IRLL014NTR 概述
Advanced Process Technology 先进的工艺技术 MOS管 功率场效应晶体管
IRLL014NTR 规格参数
是否Rohs认证: | 不符合 | 生命周期: | Active |
包装说明: | SMALL OUTLINE, R-PDSO-G4 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | 风险等级: | 5.69 |
Is Samacsys: | N | 其他特性: | HIGH RELIABILITY |
雪崩能效等级(Eas): | 32 mJ | 外壳连接: | DRAIN |
配置: | SINGLE WITH BUILT-IN DIODE | 最小漏源击穿电压: | 55 V |
最大漏极电流 (ID): | 2 A | 最大漏源导通电阻: | 0.14 Ω |
FET 技术: | METAL-OXIDE SEMICONDUCTOR | JEDEC-95代码: | TO-261AA |
JESD-30 代码: | R-PDSO-G4 | JESD-609代码: | e3 |
湿度敏感等级: | 1 | 元件数量: | 1 |
端子数量: | 4 | 工作模式: | ENHANCEMENT MODE |
封装主体材料: | PLASTIC/EPOXY | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE | 峰值回流温度(摄氏度): | NOT SPECIFIED |
极性/信道类型: | N-CHANNEL | 最大脉冲漏极电流 (IDM): | 16 A |
认证状态: | Not Qualified | 表面贴装: | YES |
端子面层: | Matte Tin (Sn) | 端子形式: | GULL WING |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
晶体管应用: | SWITCHING | 晶体管元件材料: | SILICON |
Base Number Matches: | 1 |
IRLL014NTR 数据手册
通过下载IRLL014NTR数据手册来全面了解它。这个PDF文档包含了所有必要的细节,如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载PD- 91499B
IRLL014N
HEXFET® Power MOSFET
l Surface Mount
D
l Advanced Process Technology
l Ultra Low On-Resistance
l Dynamic dv/dt Rating
l Fast Switching
VDSS = 55V
RDS(on) = 0.14Ω
G
l Fully Avalanche Rated
ID = 2.0A
S
Description
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremelylow on-resistancepersiliconarea. Thisbenefit,
combined with the fast switching speed and ruggedized
device design that HEXFET Power MOSFETs are well
knownfor,providesthedesignerwithanextremelyefficient
andreliabledeviceforuseinawidevarietyofapplications.
The SOT-223 package is designed for surface-mount
usingvaporphase,infrared,orwavesolderingtechniques.
Its unique package design allows for easy automatic pick-
and-place as with other SOT or SOIC packages but has
the added advantage of improved thermal performance
due to an enlarged tab for heatsinking. Power dissipation
of 1.0W is possible in a typical surface mount application.
S O T -223
Absolute Maximum Ratings
Parameter
Max.
Units
ID @ TA = 25°C
ID @ TA = 25°C
ID @ TA = 70°C
IDM
Continuous Drain Current, VGS @ 10V**
Continuous Drain Current, VGS @ 10V*
Continuous Drain Current, VGS @ 10V*
Pulsed Drain Current
2.8
2.0
A
1.6
16
PD @TA = 25°C
PD @TA = 25°C
Power Dissipation (PCB Mount)**
Power Dissipation (PCB Mount)*
Linear Derating Factor (PCB Mount)*
Gate-to-Source Voltage
2.1
W
W
1.0
8.3
mW/°C
V
VGS
± 16
EAS
Single Pulse Avalanche Energy
Avalanche Current
32
2.0
mJ
A
IAR
EAR
Repetitive Avalanche Energy*
Peak Diode Recovery dv/dt
Junction and Storage Temperature Range
0.1
mJ
V/ns
°C
dv/dt
TJ, TSTG
7.2
-55 to + 150
Thermal Resistance
Parameter
Junction-to-Amb. (PCB Mount, steady state)*
Typ.
90
Max.
120
Units
RθJA
RθJA
°C/W
Junction-to-Amb. (PCB Mount, steady state)**
50
60
* When mounted on FR-4 board using minimum recommended footprint.
** When mounted on 1 inch square copper board, for comparison with other SMD devices.
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1
1/25/99
IRLL014N
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
55 ––– –––
Conditions
VGS = 0V, ID = 250µA
V(BR)DSS
Drain-to-Source Breakdown Voltage
V
∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient ––– 0.015 ––– V/°C Reference to 25°C, ID = 1mA
––– ––– 0.14
––– ––– 0.20
––– ––– 0.28
VGS = 10V, ID = 2.0A
VGS = 5.0V, ID = 1.2A
VGS = 4.0V, ID = 1.0A
VDS = VGS, ID = 250µA
VDS = 25V, ID = 1.0A
VDS = 55V, VGS = 0V
VDS = 44V, VGS = 0V, TJ = 150°C
VGS = 16V
RDS(on)
Static Drain-to-Source On-Resistance
Ω
VGS(th)
gfs
Gate Threshold Voltage
1.0
2.3
––– 2.0
––– –––
V
S
Forward Transconductance
––– ––– 25
––– ––– 250
––– ––– 100
––– ––– -100
IDSS
IGSS
Drain-to-Source Leakage Current
µA
nA
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
VGS = -16V
Qg
–––
–––
–––
–––
–––
–––
–––
9.5
14
ID = 2.0A
Qgs
Qgd
td(on)
tr
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
1.1 1.7
3.0 4.4
5.1 –––
4.9 –––
14 –––
2.9 –––
nC VDS = 44V
VGS = 10V, See Fig. 6 and 9
VDD = 28V
ID = 2.0A
ns
pF
td(off)
tf
Turn-Off Delay Time
Fall Time
RG = 6.0Ω
RD = 14Ω, See Fig. 10
VGS = 0V
Ciss
Coss
Crss
Input Capacitance
––– 230 –––
Output Capacitance
–––
–––
66 –––
30 –––
VDS = 25V
Reverse Transfer Capacitance
ƒ = 1.0MHz, See Fig. 5
Source-Drain Ratings and Characteristics
Parameter
Continuous Source Current
(Body Diode)
Min. Typ. Max. Units
Conditions
MOSFET symbol
IS
––– ––– 1.3
A
showing the
ISM
Pulsed Source Current
(Body Diode)
integral reverse
–––
––– ––– 1.0
––– 41 61
––– 73 110
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
16
–––
p-n junction diode.
TJ = 25°C, IS = 2.0A, VGS = 0V
TJ = 25°C, IF = 2.0A
VSD
trr
Diode Forward Voltage
Reverse Recovery Time
Reverse RecoveryCharge
Forward Turn-On Time
V
ns
Qrr
ton
nC di/dt = 100A/µs
Notes:
Repetitive rating; pulse width limited by
ISD ≤ 2.0A, di/dt ≤ 170A/µs, VDD ≤ V(BR)DSS
,
max. junction temperature. ( See fig. 11 )
TJ ≤ 150°C
VDD = 25V, starting TJ = 25°C, L = 4.0mH
RG = 25Ω, IAS = 4.0A. (See Figure 12)
Pulse width ≤ 300µs; duty cycle ≤ 2%.
2
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IRLL014N
100
10
1
100
10
1
VGS
15V
VGS
15V
TOP
TOP
10V
10V
7.0V
5.5V
4.5V
4.0V
3.5V
7.0V
5.5V
4.5V
4.0V
3.5V
BOT TOM 3.0V
BOTTOM 3.0V
3.0V
20µs PULS E W IDTH
TJ = 25°C
20µs P ULSE W IDTH
T
3.0V
= 150°C
J
A
A
100
0.1
1
10
100
0.1
1
10
V
, Drain-to-Source Voltage (V)
V
, Drain-to-Source Voltage (V)
DS
D S
Fig 2. Typical Output Characteristics,
Fig 1. Typical Output Characteristics,
2.0
1.5
1.0
0.5
0.0
100
I
= 2.0A
D
10
TJ = 25°C
TJ = 150°C
VDS = 25V
20µs PULSE W IDTH
V
= 10V
G S
1
A
7.0A
-60
-40
-20
J
0
20
40
60
80
100 120 140 160
3.0
4.0
5.0
6.0
T
, Junction Tem perature (°C)
VG S , Gate-to-Source Voltage (V)
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance
Vs. Temperature
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3
IRLL014N
20
16
12
8
400
V
C
C
C
= 0V ,
f = 1M Hz
I
= 2.0A
D
G S
iss
= C
= C
= C
+ C
+ C
,
C
SHORTED
gs
gd
ds
gd
ds
V
V
= 44V
= 28V
DS
DS
rss
oss
gd
300
200
100
0
C
iss
C
C
oss
rss
4
FOR TE ST CIRCUIT
S EE FIGURE 9
0
A
A
1
10
100
0
3
6
9
12
15
V
, Drain-to-Source Voltage (V)
Q
, Total Gate Charge (nC)
DS
G
Fig 5. Typical Capacitance Vs.
Fig 6. Typical Gate Charge Vs.
Drain-to-Source Voltage
Gate-to-Source Voltage
100
100
10
1
OPE RATION IN THIS AREA LIM ITE D
BY R
DS(on)
10µs
10
1 00µs
T
= 150°C
J
T
= 25°C
J
1m s
1
10m s
T
T
= 25°C
= 150°C
A
J
S ingle Pulse
V
= 0V
G S
A
0.1
0.1
A
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1
10
100
V
, Drain-to-Source Voltage (V)
V
, Source-to-Drain Voltage (V)
DS
SD
Fig 8. Maximum Safe Operating Area
Fig 7. Typical Source-Drain Diode
Forward Voltage
4
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IRLL014N
RD
VDS
Q
G
10V
VGS
D.U.T.
Q
Q
GD
GS
RG
+ VDD
-
V
G
10V
Pulse Width ≤ 1 µs
Duty Factor ≤ 0.1 %
Charge
Fig 9a. Basic Gate Charge Waveform
Fig 10a. Switching Time Test Circuit
Current Regulator
Same Type as D.U.T.
V
DS
50KΩ
90%
.2µF
12V
.3µF
+
V
DS
D.U.T.
-
10%
V
GS
V
GS
t
t
r
t
t
f
3mA
d(on)
d(off)
I
I
D
G
Current Sampling Resistors
Fig 9b. Gate Charge Test Circuit
Fig 10b. Switching Time Waveforms
1000
100
10
1
D
=
0.5 0
0.20
0.10
0.05
P
D M
0.02
0.01
t
1
t
2
N otes:
1 . D uty factor D
=
t
/ t
2
S IN G LE P U LS E
(T H E R M A L R E S P O N S E )
1
Z
2. P eak T
=
P
x
+ T
thJA A
D M
J
A
0.1
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
t
, R ectangular Pulse Du ration (sec)
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
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5
IRLL014N
80
60
40
20
0
I
D
TO P
1.8A
3.2A
4.0A
15V
B OTTOM
DRIVER
L
V
D S
D.U .T
AS
R
+
G
V
DD
-
I
A
10V
0.01
Ω
t
p
Fig 12a. Unclamped Inductive Test Circuit
V
= 25V
50
DD
A
150
V
(BR)DSS
25
75
100
125
Starting T , Junction Tem perature (°C)
t
J
p
Fig 12c. Maximum Avalanche Energy
Vs. Drain Current
I
AS
Fig 12b. Unclamped Inductive Waveforms
6
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IRLL014N
Peak Diode Recovery dv/dt Test Circuit
+
Circuit Layout Considerations
• Low Stray Inductance
• Ground Plane
• Low Leakage Inductance
Current Transformer
D.U.T
-
+
-
-
+
RG
• dv/dt controlled by RG
+
-
• Driver same type as D.U.T.
• ISD controlled by Duty Factor "D"
• D.U.T. - Device Under Test
VDD
Driver Gate Drive
P.W.
P.W.
Period
Period
D =
V
=10V
*
GS
D.U.T. I Waveform
SD
Reverse
Recovery
Current
Body Diode Forward
Current
di/dt
D.U.T. V Waveform
DS
Diode Recovery
dv/dt
V
DD
Re-Applied
Voltage
Body Diode
Forward Drop
Inductor Curent
I
SD
Ripple ≤ 5%
* VGS = 5V for Logic Level Devices
Fig 13. For N-Channel HEXFETS
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7
IRLL014N
Package Outline
SOT-223 (TO-261AA) Outline
Part Marking Information
EXAMPLE : THIS IS AN IRFL014
SOT-223
W AFER
PART NUM BER
LO T CO DE
FL014
314
XXXXXX
INTERNATIO NAL
RECTIFIER
LOG O
DATE CO DE (YW W )
Y
=
LAST DIG IT OF THE YEAR
W EEK
BO TTOM
TOP
W W
=
8
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IRLL014N
Tape & Reel Information
SOT-223 Outline
4.10 (.161)
3.90 (.154)
0.35 (.013)
0.25 (.010)
1.85 (.072)
1.65 (.065)
2.05 (.080)
1.95 (.077)
T R
7.55 (.297)
7.45 (.294)
16.30 (.641)
15.70 (.619)
7.60 (.299)
7.40 (.292)
1.60 (.062)
1.50 (.059)
TYP .
FE E D D IR E C T IO N
2.30 (.0 90)
2.10 (.0 83)
7.10 (.279)
6.90 (.272)
12.10 (.475)
11.90 (.469)
N O T E S
1. C O N TR O LLIN G D IM E N S IO N : M ILLIM E TE R .
2. O U T LIN E C O N F O R M S TO E IA -481 E IA -541.
:
&
3. E A C H O 330.00 (13.0 0) R E E L C O N TA IN S 2,500 D E VIC E S.
13.20 (.51 9)
12.80 (.50 4)
15.40 (.607)
11.90 (.469)
4
330.00
(13.000)
MAX.
50.00 (1.969)
M IN .
18.40 (.724)
M AX .
N O TE S
:
1. O U T LIN E C O M FO R M S TO E IA -418-1.
2. C O N TR O LLIN G D IM EN SIO N : M ILLIM ET ER ..
3. D IM E N S IO N M E AS U R E D
14.40 (.566)
12.40 (.488)
4
@ HU B.
4. IN CLU D E S F LA N G E D IS TO R T IO N
@
O U T ER ED G E .
3
WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331
IR GREAT BRITAIN: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel: ++ 44 1883 732020
IR CANADA: 15 Lincoln Court, Brampton, Ontario L6T3Z2, Tel: (905) 453 2200
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IR TAIWAN:16 Fl. Suite D. 207, Sec. 2, Tun Haw South Road, Taipei, 10673, Taiwan Tel: 886-2-2377-9936
http://www.irf.com/
Data and specifications subject to change without notice. 1/99
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9
IRLL014NTR 替代型号
型号 | 制造商 | 描述 | 替代类型 | 文档 |
IRLL014NPBF | INFINEON | HEXFET Power MOSFET | 类似代替 | |
IRLL014NTRPBF | INFINEON | Power Field-Effect Transistor, 2A I(D), 55V, 0.14ohm, 1-Element, N-Channel, Silicon, Metal | 类似代替 | |
STN2NF06L | STMICROELECTRONICS | N-CHANNEL 60V - 0.1 ohm - 2A SOT-223 STripFET | 功能相似 |
IRLL014NTR 相关器件
型号 | 制造商 | 描述 | 价格 | 文档 |
IRLL014NTRPBF | INFINEON | Power Field-Effect Transistor, 2A I(D), 55V, 0.14ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-261AA, ROHS COMPLIANT, PLASTIC PACKAGE-4 | 获取价格 | |
IRLL014PBF | INFINEON | HEXFET Power MOSFET | 获取价格 | |
IRLL014PBF | VISHAY | Power MOSFET | 获取价格 | |
IRLL014TR | VISHAY | Power MOSFET | 获取价格 | |
IRLL014TRA | VISHAY | Power MOSFET | 获取价格 | |
IRLL014TRPBF | VISHAY | Power MOSFET | 获取价格 | |
IRLL014TRPBF | INFINEON | Power Field-Effect Transistor, 2.7A I(D), 60V, 0.2ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-261AA, LEAD FREE PACKAGE-4 | 获取价格 | |
IRLL014TRPBFA | VISHAY | Power MOSFET | 获取价格 | |
IRLL014_10 | VISHAY | Power MOSFET | 获取价格 | |
IRLL024N | INFINEON | HEXFET Power MOSFET | 获取价格 |
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