IRLL024NQPBF [INFINEON]

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IRLL024NQPBF
型号: IRLL024NQPBF
厂家: Infineon    Infineon
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PD - 91895  
IRLL024N  
HEXFET® Power MOSFET  
l Surface Mount  
D
l Advanced Process Technology  
l Ultra Low On-Resistance  
l Dynamic dv/dt Rating  
l Fast Switching  
VDSS = 55V  
RDS(on) = 0.065Ω  
G
l Fully Avalanche Rated  
ID = 3.1A  
S
Description  
Fifth Generation HEXFETs from International Rectifier  
utilize advanced processing techniques to achieve  
extremelylow on-resistancepersiliconarea. Thisbenefit,  
combined with the fast switching speed and ruggedized  
device design that HEXFET Power MOSFETs are well  
knownfor,providesthedesignerwithanextremelyefficient  
andreliabledeviceforuseinawidevarietyofapplications.  
The SOT-223 package is designed for surface-mount  
usingvaporphase,infrared,orwavesolderingtechniques.  
Its unique package design allows for easy automatic pick-  
and-place as with other SOT or SOIC packages but has  
the added advantage of improved thermal performance  
due to an enlarged tab for heatsinking. Power dissipation  
of 1.0W is possible in a typical surface mount application.  
S O T -223  
Absolute Maximum Ratings  
Parameter  
Max.  
4.4  
Units  
ID @ TA = 25°C  
ID @ TA = 25°C  
Continuous Drain Current, VGS @ 10V**  
Continuous Drain Current, VGS @ 10V*  
Continuous Drain Current, VGS @ 10V*  
Pulsed Drain Current   
3.1  
A
ID @ TA = 70°C  
2.5  
IDM  
12  
PD @TA = 25°C  
PD @TA = 25°C  
Power Dissipation (PCB Mount)**  
Power Dissipation (PCB Mount)*  
Linear Derating Factor (PCB Mount)*  
Gate-to-Source Voltage  
2.1  
W
W
1.0  
8.3  
mW/°C  
V
VGS  
± 16  
120  
EAS  
Single Pulse Avalanche Energy‚  
Avalanche Current  
mJ  
A
IAR  
3.1  
EAR  
Repetitive Avalanche Energy*  
Peak Diode Recovery dv/dt ƒ  
0.1  
mJ  
V/ns  
°C  
dv/dt  
TJ, TSTG  
5.0  
Junction and Storage Temperature Range  
-55 to + 150  
Thermal Resistance  
Parameter  
Junction-to-Amb. (PCB Mount, steady state)*  
Junction-to-Amb. (PCB Mount, steady state)**  
Typ.  
90  
Max.  
120  
60  
Units  
RθJA  
RθJA  
°C/W  
50  
* When mounted on FR-4 board using minimum recommended footprint.  
** When mounted on 1 inch square copper board, for comparison with other SMD devices.  
www.irf.com  
1
6/15/99  
IRLL024N  
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Min. Typ. Max. Units  
55 ––– –––  
––– 0.048 ––– V/°C Reference to 25°C, ID = 1mA  
Conditions  
V(BR)DSS  
Drain-to-Source Breakdown Voltage  
V
VGS = 0V, ID = 250µA  
V(BR)DSS/TJ Breakdown Voltage Temp. Coefficient  
––– ––– 0.065  
––– ––– 0.080  
––– ––– 0.100  
VGS = 10V, ID = 3.1A „  
VGS = 5.0V, ID = 2.5A „  
VGS = 4.0V, ID = 1.6A „  
VDS = VGS, ID = 250µA  
VDS = 25V, ID = 1.9 A  
VDS = 55V, VGS = 0V  
VDS = 44V, VGS = 0V, TJ = 125°C  
VGS = 16V  
RDS(on)  
Static Drain-to-Source On-Resistance  
VGS(th)  
gfs  
Gate Threshold Voltage  
1.0  
3.3  
––– 2.0  
––– –––  
V
S
Forward Transconductance  
––– ––– 25  
––– ––– 250  
––– ––– 100  
––– ––– -100  
––– 10.4 15.6  
IDSS  
IGSS  
Drain-to-Source Leakage Current  
µA  
nA  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
Total Gate Charge  
VGS = -16V  
Qg  
ID = 1.9A  
Qgs  
Qgd  
td(on)  
tr  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Turn-On Delay Time  
Rise Time  
–––  
–––  
–––  
–––  
–––  
–––  
1.5 2.3  
5.5 8.3  
7.4 –––  
21 –––  
18 –––  
25 –––  
nC VDS = 44V  
VGS = 5.0V, See Fig. 6 and 9 „  
VDD = 28V  
ID = 1.9A  
ns  
td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
RG = 24 Ω  
RD = 15 Ω, See Fig. 10 „  
VGS = 0V  
Ciss  
Coss  
Crss  
Input Capacitance  
––– 510 –––  
––– 140 –––  
Output Capacitance  
pF  
VDS = 25V  
Reverse Transfer Capacitance  
–––  
58 –––  
ƒ = 1.0MHz, See Fig. 5  
Source-Drain Ratings and Characteristics  
Parameter  
Continuous Source Current  
(Body Diode)  
Min. Typ. Max. Units  
Conditions  
MOSFET symbol  
IS  
––– ––– 3.1  
A
showing the  
ISM  
Pulsed Source Current  
(Body Diode)   
integral reverse  
––– ––– 12  
p-n junction diode.  
TJ = 25°C, IS = 1.9A, VGS = 0V „  
TJ = 25°C, IF = 1.9A  
VSD  
trr  
Diode Forward Voltage  
Reverse Recovery Time  
Reverse RecoveryCharge  
Forward Turn-On Time  
––– ––– 1.0  
V
––– 39  
––– 63  
58  
94  
ns  
Qrr  
ton  
nC di/dt = 100A/µs „  
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)  
Notes:  
 Repetitive rating; pulse width limited by  
ƒ ISD 1.9A, di/dt 270A/µs, VDD V(BR)DSS  
TJ 150°C  
,
max. junction temperature. ( See fig. 11 )  
‚ Starting TJ = 25°C, L = 25 mH  
„ Pulse width 300µs; duty cycle 2%.  
RG = 25, IAS = 3.1A. (See Figure 12)  
2
www.irf.com  
IRLL024N  
100  
10  
1
100  
10  
1
VGS  
15V  
VGS  
15V  
10V  
7.0V  
5.5V  
4.5V  
4.0V  
3.5V  
TOP  
TOP  
10V  
7.0V  
5.5V  
4.5V  
4.0V  
3.5V  
BOTTOM 2.7V  
BOTTOM 2.7V  
2.7V  
2.7V  
20µs PULSE WIDTH  
T = 150 C  
J
20µs PULSE WIDTH  
°
°
T = 25 C  
J
0.1  
1
10  
100  
0.1  
1
10  
100  
V
, Drain-to-Source Voltage (V)  
V
, Drain-to-Source Voltage (V)  
DS  
DS  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
2.0  
100  
3.1A  
=
I
D
°
T = 25 C  
J
1.5  
1.0  
0.5  
0.0  
°
T = 150 C  
J
10  
V
= 25V  
DS  
20µs PULSE WIDTH  
V
= 10V  
GS  
1
2
4
6
8
10  
12  
-60 -40 -20  
0
20 40 60 80 100 120 140 160  
°
V
, Gate-to-Source Voltage (V)  
T , Junction Temperature ( C)  
J
GS  
Fig 3. Typical Transfer Characteristics  
Fig 4. Normalized On-Resistance  
Vs. Temperature  
www.irf.com  
3
IRLL024N  
15  
12  
9
1000  
I
D
= 1.9A  
V
= 0V,  
f = 1MHz  
C
GS  
C
= C + C  
SHORTED  
ds  
iss  
gs  
gd ,  
gd  
C
= C  
gd  
rss  
C
= C + C  
800  
600  
400  
200  
0
oss ds  
V
V
V
= 44V  
= 27V  
= 11V  
DS  
DS  
DS  
C
iss  
6
C
oss  
3
C
rss  
FOR TEST CIRCUIT  
SEE FIGURE 13  
0
1
10  
100  
0
4
8
12  
16  
20  
V
, Drain-to-Source Voltage (V)  
Q
, Total Gate Charge (nC)  
DS  
G
Fig 6. Typical Gate Charge Vs.  
Fig 5. Typical Capacitance Vs.  
Gate-to-Source Voltage  
Drain-to-Source Voltage  
100  
100  
10  
1
OPERATION IN THIS AREA LIMITED  
BY R  
DS(on)  
10  
100us  
1ms  
°
T = 150 C  
J
1
10ms  
°
T = 25 C  
J
°
T = 25 C  
C
°
T = 150 C  
Single Pulse  
J
V
= 0 V  
GS  
1.2  
0.1  
0.4  
0.1  
0.6  
0.8  
1.0  
1.4  
0.1  
1
10  
100  
1000  
V
,Source-to-Drain Voltage (V)  
V
, Drain-to-Source Voltage (V)  
SD  
DS  
Fig 8. Maximum Safe Operating Area  
Fig 7. Typical Source-Drain Diode  
Forward Voltage  
4
www.irf.com  
IRLL024N  
4.0  
3.0  
2.0  
1.0  
0.0  
RD  
VDS  
VGS  
D.U.T.  
RG  
+VDD  
-
5.0V  
Pulse Width ≤ 1 µs  
Duty Factor ≤ 0.1 %  
Fig 10a. Switching Time Test Circuit  
V
DS  
90%  
25  
50  
T
75  
100  
125  
150  
°
, Case Temperature ( C)  
C
10%  
V
GS  
Fig 9. Maximum Drain Current Vs.  
t
t
r
t
t
f
d(on)  
d(off)  
Case Temperature  
Fig 10b. Switching Time Waveforms  
1000  
100  
10  
1
D = 0.50  
0.20  
0.10  
0.05  
P
DM  
0.02  
0.01  
t
1
t
2
Notes:  
1. Duty factor D =  
t / t  
1 2  
SINGLE PULSE  
(THERMAL RESPONSE)  
2. Peak T = P  
J
x Z  
+ T  
10  
DM  
thJA  
A
0.1  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
100  
t , Rectangular Pulse Duration (sec)  
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient  
www.irf.com  
5
IRLL024N  
300  
250  
200  
150  
100  
50  
I
D
TOP  
1.4A  
2.5A  
BOTTOM 3.1A  
15V  
DRIVER  
L
V
D S  
D.U .T  
R
G
+
V
DD  
-
I
A
AS  
10V  
t
0.01Ω  
p
Fig 12a. Unclamped Inductive Test Circuit  
0
25  
50  
75  
100  
125  
150  
°
Starting T , Junction Temperature ( C)  
J
V
(BR)DSS  
t
p
Fig 12c. Maximum Avalanche Energy  
Vs. Drain Current  
I
AS  
Current Regulator  
Fig 12b. Unclamped Inductive Waveforms  
Same Type as D.U.T.  
50KΩ  
.2µF  
12V  
Q
G
.3µF  
+
5.0 V  
V
DS  
D.U.T.  
-
Q
Q
GD  
GS  
V
GS  
V
G
3mA  
I
I
D
G
Charge  
Current Sampling Resistors  
Fig 13b. Gate Charge Test Circuit  
Fig 13a. Basic Gate Charge Waveform  
6
www.irf.com  
IRLL024N  
Package Outline  
SOT-223 (TO-261AA) Outline  
Part Marking Information  
EXAMPLE : THIS IS AN IRFL014  
SOT-223  
W AFER  
LO T CO DE  
PART NUM BER  
FL014  
314  
XXXXXX  
BO TTOM  
INTERNATIO NAL  
RECTIFIER  
LOG O  
DATE CO DE (YW W )  
Y
=
LAST DIG IT OF THE YEAR  
W EEK  
TOP  
W W  
=
www.irf.com  
7
IRLL024N  
Tape & Reel Information  
SOT-223 Outline  
4.10 (.161)  
3.90 (.154)  
0.35 (.013)  
0.25 (.010)  
1.85 (.072)  
1.65 (.065)  
2.05 (.080)  
1.95 (.077)  
T R  
7.55 (.297)  
7.45 (.294)  
16.30 (.641)  
15.70 (.619)  
7.60 (.299)  
7.40 (.292)  
1.60 (.062)  
1.50 (.059)  
TYP .  
FE E D D IR E C T IO N  
2.30 (.09 0)  
2.10 (.08 3)  
7.10 (.279)  
6.90 (.272)  
12.10 (.475)  
11.90 (.469)  
N O T E S  
1. C O N TR O LLIN G D IM E N S IO N : M ILLIM E T E R .  
2. O U T LIN E C O N F O R M S T O E IA -48 1 E IA -541.  
:
&
3. E A C H O 330.00 (13.00) R E EL C O N T A IN S 2,500 D E V IC E S .  
13.20 (.519)  
12.80 (.504)  
15.40 (.607)  
11.90 (.469)  
4
330.00  
(13.000)  
MAX.  
50.00 (1.969)  
M IN .  
18.40 (.724)  
M AX .  
N O T ES  
:
1. O U T LIN E C O M FO R M S T O E IA-418-1.  
2. C O N T R O LLIN G DIM EN SIO N : M ILLIM ET E R ..  
3. D IM E N S IO N M E A S UR E D  
14.40 (.566)  
12.40 (.488)  
4
@ H U B.  
4. IN CL U D E S F LA N G E D IS TO R TIO N  
@
O U T E R ED G E .  
3
WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331  
IR GREAT BRITAIN: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel: ++ 44 1883 732020  
IR CANADA: 15 Lincoln Court, Brampton, Ontario L6T3Z2, Tel: (905) 453 2200  
IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 6172 96590  
IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 11 451 0111  
IR FAR EAST: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo Japan 171 Tel: 81 3 3983 0086  
IR SOUTHEAST ASIA: 1 Kim Seng Promenade, Great World City West Tower, 13-11, Singapore 237994 Tel: ++ 65 838 4630  
IR TAIWAN:16 Fl. Suite D. 207, Sec. 2, Tun Haw South Road, Taipei, 10673, Taiwan Tel: 886-2-2377-9936  
http://www.irf.com/  
Data and specifications subject to change without notice. 6/99  
8
www.irf.com  

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