IRS2008M [INFINEON]

200-V half-bridge driver with shutdown and VCC & VBS UVLO;
IRS2008M
型号: IRS2008M
厂家: Infineon    Infineon
描述:

200-V half-bridge driver with shutdown and VCC & VBS UVLO

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IRS2008(S,M)PBF  
200-V half-bridge driver with shutdown and VCC & VBS UVLO  
Features  
Product Summary  
Gate drive supplies up to 20 V per channel  
VOFFSET  
VOUT  
≤ 200V  
10 V 20 V  
Undervoltage lockout for VCC, VBS  
3.3 V, 5 V , 15 V input logic compatible  
Tolerant to negative transient voltage  
Designed for use with bootstrap power supplies  
Cross-conduction prevention logic  
Matched propagation delay for both channels  
Internal set deadtime  
High-side output in phase with input  
Shutdown input turns off both channels  
-40°C to 125°C operating range  
RoHS compliant  
Io+ & I o- (typ.)  
tON & tOFF (typ.)  
Deadtime (typ.)  
290 mA & 600 mA  
680 ns & 150 ns  
520 ns  
Description  
Package Options  
The IRS2008 is a high voltage, high speed power  
MOSFET and IGBT driver with dependent high and low  
side referenced output channels. Proprietary HVIC and  
latch immune CMOS technologies enable ruggedized  
monolithic construction. The logic input is compatible  
with standard CMOS or LSTTL output, down to 3.3 V  
logic. The output drivers feature a high pulse current  
buffer stage designed for minimum driver cross-  
conduction. The floating channel can be used to drive  
an N-channel power MOSFET or IGBT in the high side  
configuration which operates up to 200 V. Propagation  
delays are matched to simplify the HVIC’s use in high  
frequency applications.  
16-Lead MLPQ 4x4  
(without 2 leads)  
8-Lead SOIC  
Typical Applications  
Appliance motor drives, Stepper motor, Servo drives  
Micro inverter drives  
General purpose three phase inverters  
Light electric vehicles (e-bikes, e-scooters, e-toys)  
Wireless Charging  
General battery driven applications  
Standard Pack  
Base Part Number  
Package Type  
Orderable Part Number  
Form  
Quantity  
Tape and Reel  
2500  
IRS2008STRPBF  
IRS2008S  
IRS2008M  
8-Lead SOIC  
Tube/Bulk  
95  
IRS2008SPBF  
14-Lead MLPQ 4x4  
Tape and Reel  
3000  
IRS2008MTRPBF  
1
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April, 23, 2020  
IRS2008(S,M)PBF  
Typical Connection Diagram  
(Refer to Lead Assignments for correct pin configuration). This diagram shows electrical connections only. Please refer tour  
Application Notes & DesignTips for proper circuit board layout.  
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IRS2008(S,M)PBF  
Absolute Maximum Ratings  
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are  
absolute voltages referenced to COM unless otherwise stated in the table. The thermal resistance and power dissipation ratings  
are measured under board mounted and still air conditions.  
Symbol  
Definition  
Low side supply voltage  
Min.  
-0.3  
Max.  
25†  
Units  
VCC  
VIN  
VB  
COM - 0.3  
VCC + 0.3  
225  
Logic input voltage (IN & SD)  
High-side floating well supply voltage  
High-side floating well supply return voltage  
Floating gate drive output voltage  
Low-side output voltage  
-0.3  
VB- 25  
VS - 0.3  
COM - 0.3  
VCC - 25  
VS  
VB + 0.3  
VB + 0.3  
VCC + 0.3  
VCC + 0.3  
50  
V
VHO  
VLO  
COM  
dVS/dt  
Power ground  
Allowable VS offset supply transient relative to COM  
V/ns  
W
8-Lead SOIC  
0.625  
2.08  
Package power  
dissipation @ TA +25ºC  
PD  
14-Lead MLPQ 4x4  
8-Lead SOIC  
200  
Thermal resistance,  
junction to ambient  
RthJA  
ºC/W  
ºC  
14-Lead MLPQ 4x4  
36  
TJ  
TS  
TL  
Junction temperature  
Storage temperature  
150  
-55  
150  
Lead temperature (soldering, 10 seconds)  
300  
All supplies are tested at 25V.  
Recommended Operating Conditions  
For proper operation, the device should be used within the recommended conditions. All voltage parameters are absolute voltages  
referenced to COM unless otherwise stated in the table. The offset rating is tested with supplies of (VCC - COM) = (VB - VS) = 15V.  
Symbol  
VCC  
Definition  
Low-side supply voltage  
Min  
10  
0
Max  
20  
Units  
V
VIN  
VCC  
Logic input voltage(IN & SD)  
High-side floating well supply voltage  
High-side floating well supply offset voltage†  
Floating gate drive output voltage  
Low-side output voltage  
VB  
VS  
VS + 10  
COM - 8†  
Vs  
VS + 20  
200  
VHO  
VLO  
TA  
VB  
COM  
-40  
VCC  
Ambient temperature  
125  
ºC  
Logic operation for VS of 8 V to 200 V. Logic state held for VS of 8 V to VBS. Please refer to Design Tip DT97-  
3 for more details.  
3
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April 23, 2020  
IRS2008(S,M)PBF  
Static Electrical Characteristics  
(VCC - COM) = (VB - VS) = 15V. TA = 25°C unless otherwise specified. The VIN and IIN parameters are referenced to COM. The VO  
and IO parameters are referenced to respective VS and COM and are applicable to the respective output leads HO or LO. The  
VCCUV parameters are referenced to COM. The VBSUV parameters are referenced to VS.  
Symbol  
VBSUV  
Definition  
Min.  
8.0  
Typ.  
8.9  
Max. Units Test Conditions  
9.8  
VBS supply undervoltage positive going threshold  
+
VBSUV  
VBS supply undervoltage negative going threshold  
VBS supply undervoltage hysteresis  
-
7.4  
8.2  
0.7  
8.9  
9
VBSUVHY  
VCCUV  
V
VCC supply undervoltage positive going threshold  
+
8.0  
9.8  
VCC supply undervoltage negative going  
threshold  
VCCUV  
-
7.4  
8.2  
9
VCCUVHY  
ILK  
VCC supply undervoltage hysteresis  
0.7  
High-side floating well offset supply leakage  
Quiescent VBS supply current  
50  
75  
VB = VS = 200V  
IQBS  
45  
µA  
V
All inputs are in the  
off state  
IQCC  
VOH  
Quiescent VCC supply current  
300  
0.05  
0.02  
520  
0.2  
0.1  
High level output voltage drop, VBIAS-VO  
Low level output voltage drop, VO  
IO = 2 mA  
VOL  
VO = 0V  
PW ≤ 10µs  
VO = 15V  
Io+  
Io-  
Output high short circuit pulsed current  
Output low short circuit pulsed current  
200  
420  
290  
600  
mA  
PW ≤ 10µs  
VIH  
VIL  
Logic “1” (HO) & Logic “0” (LO) input voltage  
2.5  
Logic “0” (HO) & Logic “1” (LO) input voltage  
0.8  
V
Vcc=10V to 20V  
VSD,TH+  
SD input positive going threshold  
SD input negative going threshold  
2.5  
3
0.8  
10  
5
VSD,TH-  
IIN+  
Input bias current  
Logic “1”  
VIN = 5V  
VIN = 0V  
µA  
Input bias current  
IIN-  
Logic “0”  
Dynamic Electrical Characteristics  
VCC = VB = 15V, VS = COM, TA = 25oC, and CL = 1000pF unless otherwise specified.  
Symbol  
Definition  
Min.  
Typ.  
Max. Units Test Conditions  
tON  
Turn-on propagation delay  
680  
870  
tOFF  
tSD  
tR  
Turn-off propagation delay  
Shutdown propagation delay  
Turn-on rise time  
150  
160  
70  
220  
220  
170  
90  
VS = 0V or 200V  
VS = 0V  
ns  
tF  
Turn-off fall time  
30  
Deadtime, LS turn-off to HS turn-on & HS turn-on  
to LS turn-off  
DT  
MT  
400  
520  
650  
60  
Delay matching time (tON, tOFF  
)
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IRS2008(S,M)PBF  
Functional Block Diagram  
8
VB  
UV  
DETECT  
R
R
Q
7
6
Pulse  
Filter  
HO  
VS  
S
2
IN  
Pulse  
Generator  
Dead time  
and Short  
Through  
1
Vcc  
Prevention  
UV  
DETECT  
Delay  
Match  
LO  
5
4
SD  
3
COM  
5
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IRS2008(S,M)PBF  
Lead Definitions  
Symbol  
Description  
Vcc  
VB  
VS  
IN  
Low-side and logic supply voltage  
High-side gate drive floating supply  
High voltage floating supply return  
Logic inputs for high and low side gate driver output (HO and LO), in phase with HO  
SD  
Logic inputs for shutdown  
High-side driver output  
Low-side driver output  
Low-side gate drive return  
HO  
LO  
COM  
Lead Assignments  
16  
14  
13  
NC  
HIN  
1
2
3
4
12 HO  
8
VB  
HO  
VS  
VCC  
HIN  
1
2
3
4
11  
VS  
7
6
5
SD  
SD  
9
COM  
NC  
COM  
LO  
6
7
8
5
16-Lead MLPQ 4x4  
(without 2 leads)  
8-Lead SOIC  
IRS2008S  
IRS2008M  
6
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April 23, 2020  
IRS2008(S,M)PBF  
Application Information and Additional Details  
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IRS2008(S,M)PBF  
Figure 6A. Turn-On Time vs. Temperature  
Figure 6C. Turn-On Time vs. Input Voltage  
Figure 7B. Turn-Off Time vs. Supply Voltage  
Figure 6B. Turn-On Time vs. Supply Voltage  
Figure 7A. Turn-Off Time vs. Temperature  
Figure 7C. Turn-Off Time vs. Input Voltage  
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IRS2008(S,M)PBF  
Figure 8B. Shutdown Time vs. Voltage  
Figure 9B. Turn-On Rise Time vs. Voltage  
Figure 8A. Shutdown Time vs. Temperature  
Figure 9A. Turn-On Rise Time vs. Temperature  
Figure 10A. Turn-Off Fall Time vs. Temperature  
Figure 10B. Turn-Off Fall Time vs. Voltage  
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IRS2008(S,M)PBF  
Figure 11A. Deadtime vs. Temperature  
Figure 11B. Deadtime vs. Voltage  
Figure 12A. Logic “1” Input Voltage  
Figure 12B. Logic “1” Input Voltage  
vs. Temperature  
vs. Voltage  
Figure 13A. Logic “0”(HO) & Logic “1”(LO)  
Figure 13B. Logic “0”(HO) & Logic “1”(LO)  
& Active SD Input Voltages vs. Temperature  
& Active SD Input Voltages vs Supply Voltage  
10  
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IRS2008(S,M)PBF  
Figure 14A. High Level Output Voltage vs.  
Temperature  
Figure 14B. High Level Output Voltage  
vs. Supply Voltage  
Figure 15A. Low Level Output Voltage  
vs. Temperature  
Figure 15B. Low Level Output Voltage  
vs. Supply Voltage  
Figure 16A. Offset Supply Current vs. Temperature  
Figure 16B. Offset Supply Current vs. Voltage  
11  
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IRS2008(S,M)PBF  
Figure 17A. VBS Supply Current vs. Temperature  
Figure 17B. VBS Supply Current vs. Voltage  
Figure 18A. VCC Supply Current vs. Temperature  
Figure 18B. VCC Supply Current vs. Voltage  
Figure 19A. Logic “1” Input Current vs. Temperature  
Figure 19B. Logic “1” Input Current vs. Voltage  
12  
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IRS2008(S,M)PBF  
Figure 20A. Logic “0” Input Bias Current  
Figure 20B. Logic “0” Input Bias Current  
Figure 21A. VCC\VBS Undervoltage Threshold(+) vs.  
Temperature  
Figure 21B. VCC\VBS Undervoltage Threshold(-) vs.  
Temperature  
Figure 22A. Output Source Current vs. Temperature  
Figure 22B. Output Source Current vs. Supply  
Current  
13  
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IRS2008(S,M)PBF  
Figure 23A. Output Sink Current vs. Temperature  
Figure 23B. Output Sink Current vs. Supply Voltage  
Figure 24B. SD input Positive Going Threshold(+)  
vs. Supply Voltage  
Figure 24A. SD input Positive Going Threshold(+)  
vs. Temperature  
Figure 25A. SD input Negative Going Threshold(-)  
vs. Temperature  
Figure 25A. SD input Negative Going Threshold(-)  
vs. Voltage  
14  
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April 23, 2020  
IRS2008(S,M)PBF  
Package Details: 8-Lead SOIC  
15  
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IRS2008(S,M)PBF  
Tape and Reel Details: 8-Lead SOIC  
LOADED TAPE FEED DIRECTION  
A
B
H
D
F
C
NOTE : CONTROLLING  
DIMENSION IN MM  
E
G
CARRIER TAPE DIMENSION FOR 8SOICN  
Metric Imperial  
Code  
A
B
C
D
E
F
G
H
Min  
7.90  
3.90  
11.70  
5.45  
6.30  
5.10  
1.50  
1.50  
Max  
8.10  
4.10  
12.30  
5.55  
6.50  
5.30  
n/a  
Min  
Max  
0.318  
0.161  
0.484  
0.218  
0.255  
0.208  
n/a  
0.311  
0.153  
0.46  
0.214  
0.248  
0.200  
0.059  
0.059  
1.60  
0.062  
F
D
B
C
A
E
G
H
REEL DIMENSIONS FOR 8SOICN  
Metric  
Imperial  
Code  
A
B
C
D
E
F
G
H
Min  
329.60  
20.95  
12.80  
1.95  
98.00  
n/a  
14.50  
12.40  
Max  
330.25  
21.45  
13.20  
2.45  
102.00  
18.40  
17.10  
14.40  
Min  
12.976  
0.824  
0.503  
0.767  
3.858  
n/a  
Max  
13.001  
0.844  
0.519  
0.096  
4.015  
0.724  
0.673  
0.566  
0.570  
0.488  
16  
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April 23, 2020  
IRS2008(S,M)PBF  
Package Details: 14-Lead MLPQ 4x4  
17  
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April 23, 2020  
IRS2008(S,M)PBF  
Tape and Reel Details: 14-Lead MLPQ 4x4  
LOADED TAPE FEED DIRECTION  
A
B
H
D
F
C
NOTE : CONTROLLING  
DIMENSION IN MM  
E
G
CARRIER TAPE DIMENSION FOR MLPQ4x4  
Metric Imperial  
Code  
Min  
7.90  
3.90  
11.70  
5.45  
4.25  
4.25  
1.50  
1.50  
Max  
8.10  
4.10  
12.30  
5.55  
4.45  
4.45  
n/a  
Min  
Max  
0.358  
0.161  
0.484  
0.219  
0.176  
0.176  
n/a  
A
B
C
D
E
F
0.311  
0.153  
0.461  
0.215  
0.168  
0.168  
0.069  
0.069  
G
H
1.60  
0.063  
F
D
B
C
A
E
G
H
REEL DIMENSIONS FOR MLPQ4x4  
Metric  
Imperial  
Code  
A
B
C
D
E
F
G
H
Min  
329.60  
20.95  
12.80  
1.95  
98.00  
n/a  
14.50  
12.40  
Max  
330.25  
21.45  
13.20  
2.45  
102.00  
18.40  
17.10  
14.40  
Min  
12.976  
0.824  
0.503  
0.767  
3.858  
n/a  
Max  
13.001  
0.844  
0.519  
0.096  
4.015  
0.724  
0.673  
0.566  
0.570  
0.488  
18  
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April 23, 2020  
IRS2008(S,M)PBF  
Part Marking Information  
Part number  
Date code  
S2008S  
YWW ?  
IR logo  
Pin 1  
Identifier  
? XXXX  
Lot Code  
(Prod mode –  
4 digit SPN code)  
?
MARKING CODE  
P
Lead Free Released  
Non-Lead Free Released  
Assembly site code  
Per SCOP 200-002  
8-Lead SOIC8  
IRS2008SPBF  
Pin 1 Identifier  
Part number  
IR logo  
S2008M  
?YWW ?  
XXXXX  
Assembly site  
Code  
?
MARKING CODE  
P
Lead Free Released  
Non-Lead Free Released  
-
Date code  
Lot Code  
(Prod mode 4  
digit SPN code)  
14-Lead MLPQ 4x4  
IRS2008MPBF  
19  
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April 23, 2020  
IRS2008(S,M)PBF  
Qualification Information  
Industrial†  
Comments: This family of ICs is qualified according to relevant  
tests of JEDEC47/22/20. IR’s Consumer qualification level is  
granted by extension of the higher Industrial level.  
Qualification Level  
8 Lead SOIC  
MSL2††, 260C  
(per IPC/JEDEC J-STD-020)  
Moisture Sensitivity Level  
14-Lead MLPQ 4x4  
Class 2  
Human Body Model  
Machine Model  
(per JEDEC standard JESD22-A114)  
ESD  
Class A  
(per EIA/JEDEC standard EIA/JESD22-A115)  
Class I  
(per JESD78)  
Yes  
IC Latch-Up Test  
RoHS Compliant  
According to IR Qualification Requirements for IC products.  
††  
Higher MSL ratings may be available for the specific package types listed here. Please contact your Infineon sales  
representative for further information.  
20  
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IRS2008(S,M)PBF  
Published by  
Infineon Technologies AG  
81726 München, Germany  
© Infineon Technologies AG 2020  
All Rights Reserved.  
IMPORTANT NOTICE  
The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics  
(“Beschaffenheitsgarantie”). With respect to any examples, hints or any typical values stated herein and/or any  
information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties  
and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of  
any third party.  
In addition, any information given in this document is subject to customer’s compliance with its obligations stated in  
this document and any applicable legal requirements, norms and standards concerning customer’s products and  
any use of the product of Infineon Technologies in customer’s applications.  
The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of  
customer’s technical departments to evaluate the suitability of the product for the intended application and the  
completeness of the product information given in this document with respect to such application.  
For further information on the product, technology, delivery terms and conditions and prices please contact your  
nearest Infineon Technologies office (www.infineon.com).  
WARNINGS  
Due to technical requirements products may contain dangerous substances. For information on the types in  
question please contact your nearest Infineon Technologies office.  
Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized  
representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications  
where a failure of the product or any consequences of the use thereof can reasonably be expected to result in  
personal injury.  
21  
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