IRS2008M [INFINEON]
200-V half-bridge driver with shutdown and VCC & VBS UVLO;型号: | IRS2008M |
厂家: | Infineon |
描述: | 200-V half-bridge driver with shutdown and VCC & VBS UVLO |
文件: | 总21页 (文件大小:2403K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
IRS2008(S,M)PBF
200-V half-bridge driver with shutdown and VCC & VBS UVLO
Features
Product Summary
Gate drive supplies up to 20 V per channel
VOFFSET
VOUT
≤ 200V
10 V – 20 V
Undervoltage lockout for VCC, VBS
3.3 V, 5 V , 15 V input logic compatible
Tolerant to negative transient voltage
Designed for use with bootstrap power supplies
Cross-conduction prevention logic
Matched propagation delay for both channels
Internal set deadtime
High-side output in phase with input
Shutdown input turns off both channels
-40°C to 125°C operating range
RoHS compliant
Io+ & I o- (typ.)
tON & tOFF (typ.)
Deadtime (typ.)
290 mA & 600 mA
680 ns & 150 ns
520 ns
Description
Package Options
The IRS2008 is a high voltage, high speed power
MOSFET and IGBT driver with dependent high and low
side referenced output channels. Proprietary HVIC and
latch immune CMOS technologies enable ruggedized
monolithic construction. The logic input is compatible
with standard CMOS or LSTTL output, down to 3.3 V
logic. The output drivers feature a high pulse current
buffer stage designed for minimum driver cross-
conduction. The floating channel can be used to drive
an N-channel power MOSFET or IGBT in the high side
configuration which operates up to 200 V. Propagation
delays are matched to simplify the HVIC’s use in high
frequency applications.
16-Lead MLPQ 4x4
(without 2 leads)
8-Lead SOIC
Typical Applications
Appliance motor drives, Stepper motor, Servo drives
Micro inverter drives
General purpose three phase inverters
Light electric vehicles (e-bikes, e-scooters, e-toys)
Wireless Charging
General battery driven applications
Standard Pack
Base Part Number
Package Type
Orderable Part Number
Form
Quantity
Tape and Reel
2500
IRS2008STRPBF
IRS2008S
IRS2008M
8-Lead SOIC
Tube/Bulk
95
IRS2008SPBF
14-Lead MLPQ 4x4
Tape and Reel
3000
IRS2008MTRPBF
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IRS2008(S,M)PBF
Typical Connection Diagram
(Refer to Lead Assignments for correct pin configuration). This diagram shows electrical connections only. Please refer tour
Application Notes & DesignTips for proper circuit board layout.
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Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are
absolute voltages referenced to COM unless otherwise stated in the table. The thermal resistance and power dissipation ratings
are measured under board mounted and still air conditions.
Symbol
Definition
Low side supply voltage
Min.
-0.3
Max.
25†
Units
VCC
VIN
VB
COM - 0.3
VCC + 0.3
225
Logic input voltage (IN & SD)
High-side floating well supply voltage
High-side floating well supply return voltage
Floating gate drive output voltage
Low-side output voltage
-0.3
VB- 25
VS - 0.3
COM - 0.3
VCC - 25
—
VS
VB + 0.3
VB + 0.3
VCC + 0.3
VCC + 0.3
50
V
VHO
VLO
COM
dVS/dt
Power ground
Allowable VS offset supply transient relative to COM
V/ns
W
8-Lead SOIC
—
0.625
2.08
Package power
dissipation @ TA +25ºC
PD
14-Lead MLPQ 4x4
8-Lead SOIC
—
—
200
Thermal resistance,
junction to ambient
RthJA
ºC/W
ºC
14-Lead MLPQ 4x4
—
36
TJ
TS
TL
Junction temperature
Storage temperature
—
150
-55
150
Lead temperature (soldering, 10 seconds)
—
300
†
All supplies are tested at 25V.
Recommended Operating Conditions
For proper operation, the device should be used within the recommended conditions. All voltage parameters are absolute voltages
referenced to COM unless otherwise stated in the table. The offset rating is tested with supplies of (VCC - COM) = (VB - VS) = 15V.
Symbol
VCC
Definition
Low-side supply voltage
Min
10
0
Max
20
Units
V
VIN
VCC
Logic input voltage(IN & SD)
High-side floating well supply voltage
High-side floating well supply offset voltage†
Floating gate drive output voltage
Low-side output voltage
VB
VS
VS + 10
COM - 8†
Vs
VS + 20
200
VHO
VLO
TA
VB
COM
-40
VCC
Ambient temperature
125
ºC
†
Logic operation for VS of –8 V to 200 V. Logic state held for VS of –8 V to –VBS. Please refer to Design Tip DT97-
3 for more details.
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Static Electrical Characteristics
(VCC - COM) = (VB - VS) = 15V. TA = 25°C unless otherwise specified. The VIN and IIN parameters are referenced to COM. The VO
and IO parameters are referenced to respective VS and COM and are applicable to the respective output leads HO or LO. The
VCCUV parameters are referenced to COM. The VBSUV parameters are referenced to VS.
Symbol
VBSUV
Definition
Min.
8.0
Typ.
8.9
Max. Units Test Conditions
9.8
VBS supply undervoltage positive going threshold
+
VBSUV
VBS supply undervoltage negative going threshold
VBS supply undervoltage hysteresis
-
7.4
—
8.2
0.7
8.9
9
VBSUVHY
VCCUV
—
V
VCC supply undervoltage positive going threshold
+
8.0
9.8
VCC supply undervoltage negative going
threshold
VCCUV
-
7.4
8.2
9
VCCUVHY
ILK
VCC supply undervoltage hysteresis
—
—
—
—
—
—
0.7
—
—
High-side floating well offset supply leakage
Quiescent VBS supply current
50
75
VB = VS = 200V
IQBS
45
µA
V
All inputs are in the
off state
IQCC
VOH
Quiescent VCC supply current
300
0.05
0.02
520
0.2
0.1
High level output voltage drop, VBIAS-VO
Low level output voltage drop, VO
IO = 2 mA
VOL
VO = 0V
PW ≤ 10µs
VO = 15V
Io+
Io-
Output high short circuit pulsed current
Output low short circuit pulsed current
200
420
290
600
—
—
mA
PW ≤ 10µs
VIH
VIL
Logic “1” (HO) & Logic “0” (LO) input voltage
2.5
—
—
—
Logic “0” (HO) & Logic “1” (LO) input voltage
—
0.8
V
Vcc=10V to 20V
VSD,TH+
SD input positive going threshold
SD input negative going threshold
2.5
—
—
—
—
—
3
—
0.8
10
5
VSD,TH-
IIN+
Input bias current
Logic “1”
VIN = 5V
VIN = 0V
µA
Input bias current
IIN-
—
Logic “0”
Dynamic Electrical Characteristics
VCC = VB = 15V, VS = COM, TA = 25oC, and CL = 1000pF unless otherwise specified.
Symbol
Definition
Min.
Typ.
Max. Units Test Conditions
—
tON
Turn-on propagation delay
680
870
—
—
—
—
tOFF
tSD
tR
Turn-off propagation delay
Shutdown propagation delay
Turn-on rise time
150
160
70
220
220
170
90
VS = 0V or 200V
VS = 0V
ns
tF
Turn-off fall time
30
Deadtime, LS turn-off to HS turn-on & HS turn-on
to LS turn-off
DT
MT
400
520
650
60
—
Delay matching time (tON, tOFF
)
—
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IRS2008(S,M)PBF
Functional Block Diagram
8
VB
UV
DETECT
R
R
Q
7
6
Pulse
Filter
HO
VS
S
2
IN
Pulse
Generator
Dead time
and Short
Through
1
Vcc
Prevention
UV
DETECT
Delay
Match
LO
5
4
SD
3
COM
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Lead Definitions
Symbol
Description
Vcc
VB
VS
IN
Low-side and logic supply voltage
High-side gate drive floating supply
High voltage floating supply return
Logic inputs for high and low side gate driver output (HO and LO), in phase with HO
SD
Logic inputs for shutdown
High-side driver output
Low-side driver output
Low-side gate drive return
HO
LO
COM
Lead Assignments
16
14
13
NC
HIN
1
2
3
4
12 HO
8
VB
HO
VS
VCC
HIN
1
2
3
4
11
VS
7
6
5
SD
SD
9
COM
NC
COM
LO
6
7
8
5
16-Lead MLPQ 4x4
(without 2 leads)
8-Lead SOIC
IRS2008S
IRS2008M
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IRS2008(S,M)PBF
Application Information and Additional Details
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Figure 6A. Turn-On Time vs. Temperature
Figure 6C. Turn-On Time vs. Input Voltage
Figure 7B. Turn-Off Time vs. Supply Voltage
Figure 6B. Turn-On Time vs. Supply Voltage
Figure 7A. Turn-Off Time vs. Temperature
Figure 7C. Turn-Off Time vs. Input Voltage
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Figure 8B. Shutdown Time vs. Voltage
Figure 9B. Turn-On Rise Time vs. Voltage
Figure 8A. Shutdown Time vs. Temperature
Figure 9A. Turn-On Rise Time vs. Temperature
Figure 10A. Turn-Off Fall Time vs. Temperature
Figure 10B. Turn-Off Fall Time vs. Voltage
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Figure 11A. Deadtime vs. Temperature
Figure 11B. Deadtime vs. Voltage
Figure 12A. Logic “1” Input Voltage
Figure 12B. Logic “1” Input Voltage
vs. Temperature
vs. Voltage
Figure 13A. Logic “0”(HO) & Logic “1”(LO)
Figure 13B. Logic “0”(HO) & Logic “1”(LO)
& Active SD Input Voltages vs. Temperature
& Active SD Input Voltages vs Supply Voltage
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Figure 14A. High Level Output Voltage vs.
Temperature
Figure 14B. High Level Output Voltage
vs. Supply Voltage
Figure 15A. Low Level Output Voltage
vs. Temperature
Figure 15B. Low Level Output Voltage
vs. Supply Voltage
Figure 16A. Offset Supply Current vs. Temperature
Figure 16B. Offset Supply Current vs. Voltage
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Figure 17A. VBS Supply Current vs. Temperature
Figure 17B. VBS Supply Current vs. Voltage
Figure 18A. VCC Supply Current vs. Temperature
Figure 18B. VCC Supply Current vs. Voltage
Figure 19A. Logic “1” Input Current vs. Temperature
Figure 19B. Logic “1” Input Current vs. Voltage
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Figure 20A. Logic “0” Input Bias Current
Figure 20B. Logic “0” Input Bias Current
Figure 21A. VCC\VBS Undervoltage Threshold(+) vs.
Temperature
Figure 21B. VCC\VBS Undervoltage Threshold(-) vs.
Temperature
Figure 22A. Output Source Current vs. Temperature
Figure 22B. Output Source Current vs. Supply
Current
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Figure 23A. Output Sink Current vs. Temperature
Figure 23B. Output Sink Current vs. Supply Voltage
Figure 24B. SD input Positive Going Threshold(+)
vs. Supply Voltage
Figure 24A. SD input Positive Going Threshold(+)
vs. Temperature
Figure 25A. SD input Negative Going Threshold(-)
vs. Temperature
Figure 25A. SD input Negative Going Threshold(-)
vs. Voltage
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IRS2008(S,M)PBF
Package Details: 8-Lead SOIC
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Tape and Reel Details: 8-Lead SOIC
LOADED TAPE FEED DIRECTION
A
B
H
D
F
C
NOTE : CONTROLLING
DIMENSION IN MM
E
G
CARRIER TAPE DIMENSION FOR 8SOICN
Metric Imperial
Code
A
B
C
D
E
F
G
H
Min
7.90
3.90
11.70
5.45
6.30
5.10
1.50
1.50
Max
8.10
4.10
12.30
5.55
6.50
5.30
n/a
Min
Max
0.318
0.161
0.484
0.218
0.255
0.208
n/a
0.311
0.153
0.46
0.214
0.248
0.200
0.059
0.059
1.60
0.062
F
D
B
C
A
E
G
H
REEL DIMENSIONS FOR 8SOICN
Metric
Imperial
Code
A
B
C
D
E
F
G
H
Min
329.60
20.95
12.80
1.95
98.00
n/a
14.50
12.40
Max
330.25
21.45
13.20
2.45
102.00
18.40
17.10
14.40
Min
12.976
0.824
0.503
0.767
3.858
n/a
Max
13.001
0.844
0.519
0.096
4.015
0.724
0.673
0.566
0.570
0.488
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IRS2008(S,M)PBF
Package Details: 14-Lead MLPQ 4x4
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IRS2008(S,M)PBF
Tape and Reel Details: 14-Lead MLPQ 4x4
LOADED TAPE FEED DIRECTION
A
B
H
D
F
C
NOTE : CONTROLLING
DIMENSION IN MM
E
G
CARRIER TAPE DIMENSION FOR MLPQ4x4
Metric Imperial
Code
Min
7.90
3.90
11.70
5.45
4.25
4.25
1.50
1.50
Max
8.10
4.10
12.30
5.55
4.45
4.45
n/a
Min
Max
0.358
0.161
0.484
0.219
0.176
0.176
n/a
A
B
C
D
E
F
0.311
0.153
0.461
0.215
0.168
0.168
0.069
0.069
G
H
1.60
0.063
F
D
B
C
A
E
G
H
REEL DIMENSIONS FOR MLPQ4x4
Metric
Imperial
Code
A
B
C
D
E
F
G
H
Min
329.60
20.95
12.80
1.95
98.00
n/a
14.50
12.40
Max
330.25
21.45
13.20
2.45
102.00
18.40
17.10
14.40
Min
12.976
0.824
0.503
0.767
3.858
n/a
Max
13.001
0.844
0.519
0.096
4.015
0.724
0.673
0.566
0.570
0.488
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IRS2008(S,M)PBF
Part Marking Information
Part number
Date code
S2008S
YWW ?
IR logo
Pin 1
Identifier
? XXXX
Lot Code
(Prod mode –
4 digit SPN code)
?
MARKING CODE
P
Lead Free Released
Non-Lead Free Released
Assembly site code
Per SCOP 200-002
8-Lead SOIC8
IRS2008SPBF
Pin 1 Identifier
Part number
IR logo
S2008M
?YWW ?
XXXXX
Assembly site
Code
?
MARKING CODE
P
Lead Free Released
Non-Lead Free Released
-
Date code
Lot Code
(Prod mode – 4
digit SPN code)
14-Lead MLPQ 4x4
IRS2008MPBF
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IRS2008(S,M)PBF
†
Qualification Information
Industrial†
Comments: This family of ICs is qualified according to relevant
tests of JEDEC47/22/20. IR’s Consumer qualification level is
granted by extension of the higher Industrial level.
Qualification Level
8 Lead SOIC
MSL2††, 260C
(per IPC/JEDEC J-STD-020)
Moisture Sensitivity Level
14-Lead MLPQ 4x4
Class 2
Human Body Model
Machine Model
(per JEDEC standard JESD22-A114)
ESD
Class A
(per EIA/JEDEC standard EIA/JESD22-A115)
Class I
(per JESD78)
Yes
IC Latch-Up Test
RoHS Compliant
†
According to IR Qualification Requirements for IC products.
††
Higher MSL ratings may be available for the specific package types listed here. Please contact your Infineon sales
representative for further information.
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IRS2008(S,M)PBF
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2020
All Rights Reserved.
IMPORTANT NOTICE
The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics
(“Beschaffenheitsgarantie”). With respect to any examples, hints or any typical values stated herein and/or any
information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of
any third party.
In addition, any information given in this document is subject to customer’s compliance with its obligations stated in
this document and any applicable legal requirements, norms and standards concerning customer’s products and
any use of the product of Infineon Technologies in customer’s applications.
The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of
customer’s technical departments to evaluate the suitability of the product for the intended application and the
completeness of the product information given in this document with respect to such application.
For further information on the product, technology, delivery terms and conditions and prices please contact your
nearest Infineon Technologies office (www.infineon.com).
WARNINGS
Due to technical requirements products may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies office.
Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized
representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications
where a failure of the product or any consequences of the use thereof can reasonably be expected to result in
personal injury.
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