IRSM516-076DA2 [INFINEON]
Integrated Power Module for Small Appliance Motor Drive Applications;
| 型号： | IRSM516-076DA2 |
| 厂家： | 
Infineon |
| 描述： | Integrated Power Module for Small Appliance Motor Drive Applications |
| 文件： | 总17页 (文件大小：858K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IRSM506-076
IRSM516-076 Series
600V, 4A
Integrated Power Module
for Small Appliance Motor Drive Applications
Description
IRSM506-076 and IRSM516-076 are 3-phase Integrated Power Modules (IPM) designed for advanced appliance
motor drive applications such as energy efficient fans and pumps. These advanced IPMs offers a combination of
low VCE(sat) Trench IGBT technology and the industry benchmark half-bridge high voltage, rugged driver in a
familiar package. The modules are optimized for low EMI characteristics.
IRSM506-076 includes temperature feedback while IRSM516-076 does not.
Features
600V 3-phase inverter including high voltage gate drivers
Integrated bootstrap functionality
Low 1.7V VCE(sat) (max, 25°C, 1A) Trench IGBT
Under-voltage lockout for all channels
Matched propagation delay for all channels
Temperature feedback via NTC (IRSM506-076 only)
Optimized dV/dt for loss and EMI trade offs
Open-emitter for single and leg-shunt current sensing
3.3V logic compatible
Driver tolerant to negative transient voltage (-Vs)
Advanced input filter with shoot-through protection
Rugged design for PM fan and pump motors
Isolation 1900VRMS, 1min
Standard Pack
Form
Base Part Number
NTC
Package Type
Orderable Part Number
Quantity
240
SOP23
DIP23
Tube
IRSM506-076PA
IRSM506-076DA
IRSM506-076DA2
IRSM516-076PA
IRSM516-076DA
IRSM516-076DA2
IRSM506-076
Yes
Tube
240
DIP23A
SOP23
DIP23
Tube
240
Tube
240
IRSM516-076
No
Tube
240
DIP23A
Tube
240
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February 10, 2016
IRSM506-076
IRSM516-076 Series
Internal Electrical Schematic
1 COM
2 VB1
17 V+
1 COM
2 VB1
17 V+
3 VCC1
3 VCC1
4 HIN1
5 LIN1
4 HIN1
Half-Bridge
HVIC
18 U/VS1
Half-Bridge
HVIC
18 U/VS1
5 LIN1
19 VR1
20 VR2
21 V/VS2
19 VR1
20 VR2
21 V/VS2
6 NC
Integrated in HVIC
6 NC
Integrated in HVIC
7 VB2
7 VB2
8 VCC2
9 HIN2
10 LIN2
8 VCC2
9 HIN2
10 LIN2
Half-Bridge
HVIC
Half-Bridge
HVIC
11 VTH
12 VB3
11 NC
12 VB3
22 VR3
22 VR3
13 VCC3
14 HIN3
15 LIN3
13 VCC3
14 HIN3
15 LIN3
Half-Bridge
HVIC
23 W/VS3
Half-Bridge
HVIC
23 W/VS3
16 NC
16 NC
IRSM506-076
IRSM516-076
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the module may occur. These are not tested at
manufacturing. All voltage parameters are absolute voltages referenced to COM unless otherwise stated in the table.
Symbol
Description
Min
---
Max
600
Unit
VCES / VRRM
IGBT/ FW Diode Blocking Voltage
DC Output Current per IGBT
Pulsed Output Current per IGBT (Note 1)
Maximum Power Dissipation per IGBT
Isolation Voltage (1min)
V
IO @ TC=25°C
---
4.0
A
IOP @ TC =25°C
---
15
Pd @ TC=25°C
---
16
W
VRMS
°C
°C
°C
V
VISO
TJ
---
1900
150
Operating Junction Temperature
Operating Case Temperature
Storage Temperature
-40
TC
-40
150
TS
-40
150
VS1,2,3
VB1,2,3
VCC
VIN
High Side Floating Supply Offset Voltage
High Side Floating Supply Voltage
Low Side and Logic Supply voltage
Input Voltage of LIN, HIN
VB1,2,3 - 20
-0.3
VB1,2,3 +0.3
625
V
-0.3
25
V
COM -0.3
VCC+0.3
V
Note 1: Pulse Width = 100µs, Single Pulse
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February 10, 2016
IRSM506-076
IRSM516-076 Series
Recommended Operating Conditions
Symbol
Description
Min
---
Max
480
480
VS+20
16.5
5
Unit
V
V+
Positive DC Bus Input Voltage
High Side Floating Supply Offset Voltage
High Side Floating Supply Voltage
Low Side and Logic Supply Voltage
Input Voltage of LIN, HIN, ITRIP, EN, FLT
PWM Carrier Frequency
VS1,2,3
VB1,2,3
VCC
(Note 2)
VS+12
13.5
0
V
V
V
VIN
V
Fp
---
20
kHz
Note 2: Logic operational for Vs from COM-8V to COM+600V. Logic state held for Vs from COM-8V to COM-VBS
.
Static Electrical Characteristics
(VCC-COM) = (VB-VS) = 15 V. TC = 25oC unless otherwise specified. The VIN and IIN parameters are referenced to COM and
are applicable to all six channels. The
parameters are referenced to COM. The
parameters are referenced to VS.
VCCUV
VBSUV
Units
V
Symbol
Description
Min
Typ
Max
Conditions
V(BR)CES
Collector to Emitter Breakdown Voltage
600
---
---
TJ=25°C, ILK=250µA
Leakage Current of Each High Side
IGBT
ILKH
5
µA
µA
TJ=25°C, VCE=600V
Leakage Current of Low Side IGBT
Plus Gate Drive IC
ILKL
10
1.2
1.3
TJ=25°C, VCE=600V
---
---
1.7
---
TJ=25°C, VCC=15V, Ic = 1A
VCE(ON)
Collector to Emitter Saturation Voltage
V
TJ=150°C, VCC=15V, Ic = 1A
(Note 3)
VFM
Diode Forward Voltage Drop
Positive Going Input Threshold
Negative Going Input Threshold
---
2.2
---
1.05
---
---
---
V
V
V
TJ=25°C, VCC=15V, IF=1A
VIN,th+
VIN,th-
---
0.8
VCCUV+,
VBSUV+
VCC and VBS Supply Under-Voltage,
Positive Going Threshold
10.4
10.2
---
11.1
10.9
0.2
11.8
11.6
---
V
V
V
VCCUV-,
VBSUV-
VCC and VBS supply Under-Voltage,
Negative Going Threshold
VCCUVH,
VBSUVH
VCC and VBS Supply Under-Voltage
Lock-Out Hysteresis
IQBS
Quiescent VBS Supply Current VIN=0V
Quiescent VBS Supply Current VIN=4V
Quiescent VCC Supply Current VIN=0V
Quiescent VCC Supply Current VIN=4V
Input Bias Current VIN=4V
---
---
---
---
---
---
42
42
60
60
4
µA
µA
mA
mA
µA
µA
IQBS, ON
IQCC
IQCC, ON
IIN+
1.7
1.8
4.6
---
4
18
2
VIN=3.3V
VIN=0V
IIN-
Input Bias Current VIN=0V
Internal Bootstrap Equivalent Resistor
Value
RBR
---
200
---
Ω
TJ=25°C
Note 3: Characterized, not tested at manufacturing
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February 10, 2016
IRSM506-076
IRSM516-076 Series
Dynamic Electrical Characteristics
(VCC-COM) = (VB-VS) = 15 V. TC = 25oC unless otherwise specified.
Symbol
Description
Min
Typ
Max
Units
Conditions
Input to Output Propagation Turn-On
Delay Time
TON
---
0.7
1.5
µs
ID=120mA, V+=30V
See Fig.1
Input to Output Propagation Turn-Off
Delay Time
TOFF
---
0.8
1.5
µs
TFIL,IN
DT
Input Filter Time (HIN, LIN)
Deadtime Inserted
200
---
300
400
---
---
ns
ns
VIN=0 & VIN=3.3V
VIN=0 & VIN=3.3V without
external deadtime
EON
Turn-on switching energy loss
Turn-off switching energy loss
Recovery energy loss
---
---
---
---
---
---
16
10
5
---
---
---
---
---
---
µJ
µJ
µJ
µJ
µJ
µJ
V+=320V, ID=0.5A, L=40mH,
TC=25°C (Note 4)
EOFF
EREC
EON,150
EOFF,150
EREC,150
Turn-on switching energy loss
Turn-off switching energy loss
Recovery energy loss
35
21
13
V+=320V, ID=0.5A, L=40mH,
TC=150°C (Note 4)
Note 4: Characterized, not tested at manufacturing
Thermal and Mechanical Characteristics
Symbol
Description
Min
Typ
Max
Units
Conditions
Junction to Case Thermal Resistance,
one IGBT
High Side V-Phase IGBT (Note
5)
Rth(J-C)
---
---
7.2
---
°C/W
Junction to Case Thermal Resistance,
one diode
High Side V-Phase Diode
(Note 5)
Rth(J-C)
9.1
---
°C/W
Note 5: Characterized, not tested at manufacturing. Case temperature (TC) point shown in Figure 2.
Internal NTC – Thermistor Characteristics (IRSM506-076 Only)
Symbol
Description
Min
Typ
Max
Units
kΩ
kΩ
K
Conditions
R25
Resistance
---
47
---
TC=25°C, ±5% tolerance
TC=125°C
R125
B
Resistance
---
1.41
4050
---
---
B-constant (25-50°C)
---
---
±2% tolerance (Note 6)
Temperature Range
-40
125
°C
Note 6: See application notes for usage
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February 10, 2016
IRSM506-076
IRSM516-076 Series
Qualification Information†
Industrial††
Qualification Level
MSL3†††
Moisture Sensitivity Level
RoHS Compliant
UL Certified
Yes
Yes – File Number E252584
Machine Model
ESD
Class B
Class 2
Human Body Model
†
Qualification standards can be found at International Rectifier’s web site http://www.irf.com/
††
Higher qualification ratings may be available should the user have such requirements. Please contact
your International Rectifier sales representative for further information.
††† SOP23 package only. Higher MSL ratings may be available for the specific package types listed here.
Please contact your International Rectifier sales representative for further information.
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February 10, 2016
IRSM506-076
IRSM516-076 Series
Module Pin-Out Description
Pin
Name
Description
1
COM
Logic Ground
2
VB1
High Side Floating Supply Voltage 1
15V Supply 1
3
VCC1
HIN1
LIN1
NC
4
Logic Input for High Side Gate Driver - Phase 1
Logic Input for Low Side Gate Driver - Phase 1
Not Connected
5
6
7
VB2
High Side Floating Supply Voltage 2
15V Supply 2
8
VCC2
HIN2
LIN2
VTH
9
Logic Input for High Side Gate Driver - Phase 2
Logic Input for Low Side Gate Driver - Phase 2
Thermistor Output (IRSM506-076DA)
Not Connected (IRSM516-076DA)
High Side Floating Supply Voltage 3
15V Supply 3
10
11
NC
12
13
14
15
16
17
18
19
20
21
22
23
VB3
VCC3
HIN3
LIN3
NC
Logic Input for High Side Gate Driver - Phase 3
Logic Input for Low Side Gate Driver - Phase 3
Not Connected
V+
DC Bus Voltage Positive
U/VS1
VR1
Output - Phase 1, High Side Floating Supply Offset 1
Phase 1 Low Side Emitter
VR2
Phase 2 Low Side Emitter
V/VS2
VR3
Output - Phase 2, High Side Floating Supply Offset 2
Phase 3 Low Side Emitter
W/VS3
Output - Phase 3, High Side Floating Supply Offset 2
A 0123-412W
IRSM506-076PA
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February 10, 2016
IRSM506-076
IRSM516-076 Series
Referenced Figures
V
IC
CE
IC
V
CE
H /L
90%I
IN IN
C
50%
90%IC
H /L
50%
IN IN
50%
IN /L
V
H
CE
IN
H /L
IN IN
50%
V
CE
10%IC
10%IC
tr
t
f
TON
TOFF
Figure 1a: Input to Output propagation turn-on
Figure 1b: Input to Output propagation turn-off
delay time.
delay time.
IF
VCE
HIN/LIN
Irr
trr
Figure 1c: Diode Reverse Recovery.
Figure 1: Switching Parameter Definitions
14.5mm
TC
3.8mm
Top View
Figure 2: TC measurement point for Rth(j-C)
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February 10, 2016
IRSM506-076
IRSM516-076 Series
Application Notes
A basic application schematic is shown below.
VB2
VB1
VB3
IRSM506-076
VBUS
2M
VCC
HVICs
XTAL0
PWMUH
PWMVH
HIN1
HIN2
HIN3
LIN1
LIN2
LIN3
U, VS1
PWMWH
XTAL1
AIN2
V, VS2
W, VS3
PWMUL
PWMVL
PWMWL
SPD-REF
IRMCF171
+
-
GATEKILL
7.50k
AIN1
IF B+
IF B-
Power
Supply
3V
VDD
VTH
COM
VDDCAP
VSS
6.04k
IF BO
1nF
7.68k
4.87k
0.25
Figure 3: Basic sensor-less motor drive circuit connection. Motor is connected to U, V, W
A complete reference design board for running any permanent magnet motor via sensorless sinusoidal control is
available. The board – photo below – features the µIPM™-DIP module and the iMotion™ digital control IC.
Reference design kits are available on the Infineon website (irf.com > Design Resources > Reference Designs >
Intelligent Power Modules)
Figure 4: Reference design board featuring the µIPM™-DIP module and the iMotion™ IRMCF171 digital control IC
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February 10, 2016
IRSM506-076
IRSM516-076 Series
Figures 5-7 show the typical current capability for this module at specified conditions. In all tests, the application
board – the IRMCS1071-1-D reference board – was placed in a box to prevent cooling from ambient airflow.
Figure 5 is derived from using a heat sink that maintains TC at 125°C. Figures 6-7 represent current capability for
the module as used without any heat sink. ∆TJA represents the difference in temperature between the junction of
the high-side V-phase IGBT and the ambient, measured 10cm above and 6cm away from the board. Ambient
temperature kept within 28-29°C.
2500
2000
1500
3-Phase Modulation
1000
500
0
2-Phase Modulation
6
8
10
12
14
16
18
20
Carrier Frequency (kHz)
Figure 5: Maximum sinusoidal phase current vs PWM switching frequency with a heat sink.
Space Vector Modulation, V+=320V, TA=28°C, TJ=150°C, TC=125°C
1000
900
800
700
600
500
3-Phase Modulation
400
2-Phase modulation
300
200
100
0
6
8
10
12
14
16
18
20
Carrier Frequency (kHz)
Figure 6: Maximum sinusoidal phase current vs PWM switching frequency, no heat sink.
Space Vector Modulation, V+=320V, TA=28°C, TJ=128°C
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February 10, 2016
IRSM506-076
IRSM516-076 Series
800
700
600
500
400
300
200
100
0
3-Phase Modulation
2-Phase Modulation
6
8
10
12
14
16
18
20
Carrier Frequency (kHz)
Figure 7: Maximum sinusoidal phase current vs PWM switching frequency, no heat sink.
Space Vector Modulation, V+=320V, TA=28°C, TJ=98°C
The module contains an NTC – connected between COM and the VTH pin – which can be used to monitor the
temperature of the module. The NTC is effectively a resistor whose value decreases as the temperature rises.
The NTC resistance can be calculated at any temperature as follows:
1
1
ꢀ
ꢂꢃ
−
푅푇퐻 = 푅25푒[퐵(
)] , where 푅25is 47kΩ and ꢄ is 4050K
ꢀ
ꢀꢁ
An external resistor network is connected to the NTC, the simplest of which is one resistor pulled up to VCC as
shown in Figure 3. The VTH vs NTC temperature, TTH curve for this configuration is shown in Figure 8 below. The
min, typical and max curves result from the NTC having a ±5% tolerance on its resistance and ±2% tolerance on
the B-parameter.
Figure 9 shows the thermistor temperature, TTH plotted against the high-side V-phase junction temperature, TJ for
a module without a heat sink. It is thus advisable to shut down the module when TTH reaches 125°C.
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February 10, 2016
IRSM506-076
IRSM516-076 Series
14.0
12.0
10.0
8.0
min
typical
max
6.0
4.0
2.0
0.0
0
10
20
30
40
50
60
70
80
90 100 110 120 130 140
TTH (°C)
Figure 8: VTH vs TTH with VTH pin pulled up to VCC with a 7.50kΩ (1%, 100ppm) resistor.
A 15V, 1% variation in VCC is assumed.
140
120
100
80
60
40
20
0
0
10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160
TJ (°C)
Figure 9: TTH vs TJ for a module without a heat sink. VCC=15.4V, R=7.50kΩ
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February 10, 2016
IRSM506-076
IRSM516-076 Series
The µIPM™-DIP module series features an advanced filter for input pins, LIN and HIN. The filter rejects noise
spikes and short pulses with widths shorter than TFIL,IN as illustrated in Figure 10 below.
tFIL,IN
HINx
VSX
Figure 10: Advanced input filter rejects noise spikes on a logic 0-level HIN signal. The behavior is similar for noise spikes on
logic 1-level signals
The advanced input filter maintains the pulse duration for pulses slightly longer than tFIL,IN. Figure 11 illustrates
this feature.
tFIL,IN
HINx
High Side Gate
Drive Signal
Figure 11: Advanced input filter maintains the pulse duration for pulses longer than tFIL,IN
The module series also features shoot-through protection. If a logic 1-level signal is applied to LIN and HIN
simultaneously, the IGBTs of the corresponding inverter leg are kept off. For overlapping logic 1-level LIN & HIN
signals, a deadtime of duration DT is applied. The input-output logic table is shown below.
VSx
HINx
LINx
1
0
0
1
0
1
0
1
V+
0
*
$
*
* Voltage depends on direction of phase current
$ Integrated shoot-through protection prevents simultaneous turn on of high side and low side IGBTs of the same inverter leg
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February 10, 2016
IRSM506-076
IRSM516-076 Series
SOP23 Package Outline
Dimensions in mm
13
February 10, 2016
IRSM506-076
IRSM516-076 Series
DIP23A Package Outline
Dimensions in mm
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February 10, 2016
IRSM506-076
IRSM516-076 Series
DIP23 Package Outline
Dimensions in mm
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February 10, 2016
IRSM506-076
IRSM516-076 Series
Top Marking
A 0123-412P
IRSM506-076PA
Marking Code
P = Pb Free; Y = Engineering Samples
Date Code
YWW format, where Y = least significant digit of the production year , WW = two digits representing
the week of the production year
Revision History
Feb 9 Updated header & footer designs; added application notes related to advanced input filter
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February 10, 2016
IRSM506-076
IRSM516-076 Series
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2015
All Rights Reserved.
IMPORTANT NOTICE
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”). With respect to any examples, hints or any typical values stated
herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims
any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of
intellectual property rights of any third party.
In addition, any information given in this document is subject to customer’s compliance with its obligations stated
in this document and any applicable legal requirements, norms and standards concerning customer’s products
and any use of the product of Infineon Technologies in customer’s applications.
The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of
customer’s technical departments to evaluate the suitability of the product for the intended application and the
completeness of the product information given in this document with respect to such application.
For further information on the product, technology, delivery terms and conditions and prices please contact your
nearest Infineon Technologies office (www.infineon.com).
WARNINGS
Due to technical requirements products may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies office.
Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized
representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications
where a failure of the product or any consequences of the use thereof can reasonably be expected to result in
personal injury.
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February 10, 2016
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