ITS4300S-SJ-D [INFINEON]

高边功率开关,集成了垂直功率 FET,提供嵌入式保护和诊断功能。;
ITS4300S-SJ-D
型号: ITS4300S-SJ-D
厂家: Infineon    Infineon
描述:

高边功率开关,集成了垂直功率 FET,提供嵌入式保护和诊断功能。

开关
文件: 总23页 (文件大小:797K)
中文:  中文翻译
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Smart high-side NMOS-power switch  
ITS4300S-SJ-D  
Features  
CMOS compatible input  
Switching all types of resistive, inductive and capacitive loads  
Fast demagnetization of inductive loads  
Very low standby current  
Optimized Electromagnetic Compatibility (EMC)  
Open drain diagnostic output for overtemperature and short circuit  
Open load detection in OFF-state with external resistor  
Overload protection  
Current limitation  
Short circuit protection  
Thermal shutdown with restart  
Overvoltage protection (including load dump)  
Reverse battery protection with external resistor  
Loss of GND and loss of Vbb protection  
Electrostatic Discharge Protection (ESD)  
Green Product (RoHS compliant)  
Applications  
All types of resistive, inductive and capacitive loads  
Power switch for 12V and 24V DC applications with CMOS compatible control interface  
Driver for electromagnetic relays  
Power management for high-side-switching with low current consumption in OFF-mode  
Product Validation  
Qualified for industrial applications according to the relevant tests of JEDEC.  
Description  
The ITS4300S-SJ-D is a protected single channel Smart High-Side NMOS-Power Switch in a PG-DSO-8 package  
with charge pump, CMOS compatible input and diagnostic feedback.  
Data Sheet  
Rev 1.1  
2019-07-25  
www.infineon.com/industrial-profets  
1
Smart high-side NMOS-power switch  
ITS4300S-SJ-D  
Table 1  
Product summary  
Parameter  
Symbol  
VSAZmin  
VS  
Values  
Overvoltage protection  
Operating voltage range  
On-state resistance  
41 V  
5V < VS < 34V  
typ. 300 m  
0.4 A  
RDSON  
IL(nom)  
Tj  
Nominal load current  
Operating temperature range  
Stand-by current  
-40°C to 125°C  
26 µA  
ISSTB  
Type  
Package  
Marking  
ITS4300S-SJ-D  
PG-DSO-8  
I300SD  
Data Sheet  
2
Rev1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4300S-SJ-D  
Table of Contents  
1
Block diagram and terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
2
2.1  
2.2  
Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Pin assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Pin definitions and functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
3
General product characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Functional range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Thermal resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
3.1  
3.2  
3.3  
4
5
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Typical performance graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
6
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Application diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Diagnosis description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Special feature description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
Typical application waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Protection behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
6.1  
6.2  
6.3  
6.4  
6.5  
7
8
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
Data Sheet  
3
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4300S-SJ-D  
Block diagram and terms  
1
Block diagram and terms  
ITS4300S-SJ-D  
VS  
5
6
7
8
Bias  
Supervision  
Overvoltage  
Protection  
Current  
Limiter  
Gate  
Control  
Circuit  
IN  
Logic  
2
4
ESD  
Protection  
ST  
Temperature  
Sensor  
OUT  
3
1
GND  
Figure 1  
Block diagram  
Voltage- and Current-Definitions:  
Switching Times and Slew Rate Definitions:  
VIN  
H
ITS4300S-SJ-D  
L
VS  
5
6
7
8
t
IS  
VOUT  
+VS  
Bias  
Supervision  
Overvoltage  
Protection  
Current  
Limiter  
VDS  
90%  
70%  
SROFF  
40%  
30%  
Gate  
Control  
Circuit  
IN  
Logic  
2
4
IIN  
ESD  
Protection  
SRON  
10%  
ST  
Temperature  
Sensor  
0
OUT  
IST  
tON  
tOFF  
t
t
3
IOUT  
IL  
IL  
1
0
GND  
OFF  
ON  
OFF  
GND  
Figure 2  
Terms - parameter definition  
Data Sheet  
4
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4300S-SJ-D  
Pin configuration  
2
Pin configuration  
2.1  
Pin assignment  
GND  
IN  
1
2
3
4
8
7
6
5
VS  
VS  
OUT  
ST  
VS  
VS  
P-DSO-8  
Figure 3  
Pin configuration top view, PG-DSO-8  
2.2  
Pin definitions and functions  
Pin  
Symbol Function  
1
GND  
IN  
Logic ground  
2
Input, controls the power switch; the powerswitch is ON when high  
Output to the load  
3
OUT  
ST  
4
Status flag; diagnosis feedback; NMOS open drain  
5, 6, 7, 8  
VS  
Supply voltage (design the wiring for the maximum short circuit current and  
also for low thermal resistance)  
Data Sheet  
5
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4300S-SJ-D  
General product characteristics  
3
General product characteristics  
3.1  
Absolute maximum ratings  
Table 2  
Absolute maximum ratings1) at Tj = 25°C unless otherwise specified. Currents flowing into  
the device unless otherwise specified in chapter “Block Diagram and Terms”  
Parameter  
Symbol  
Values  
Typ.  
Unit Note or  
Test Condition  
Number  
Min.  
Max.  
Supply voltage VS  
Voltage  
VS  
40  
28  
V
V
4.1.1  
4.1.2  
Voltage for short circuit protection VSSC  
Output stage OUT  
Output current; (short circuit  
current see electrical  
characteristics)  
IOUT  
self  
limited  
A
4.1.3  
Input IN  
Voltage  
VIN  
IIN  
-10  
-5  
16  
5
V
4.1.4  
4.1.5  
Current  
mA  
Status ST  
Current  
IST  
-5  
5
mA  
4.1.6  
Temperatures  
Junction temperature  
Storage temperature  
Power dissipation  
Ta = 25 °C2)  
Tj  
-40  
-55  
125  
125  
°C  
°C  
4.1.7  
4.1.8  
Tstg  
P tot  
1.4  
W
4.1.9  
Inductive load switch-off energy dissipation  
Tj = 125 °C; VS=13.5V; IL= 0.3A3)  
EAS  
800  
mJ  
single pulse  
4.1.10  
ESD susceptibility  
ESD susceptibility (input pin IN)  
VESD  
-1  
-6  
-3  
1
6
3
kV  
kV  
kV  
HBM4)  
HBM4)  
HBM4)  
4.1.11  
4.1.13  
4.1.12  
ESD susceptibility (output pin OUT) VESD  
ESD susceptibility (all other pins) VESD  
1) Not subject to production test, specified by design  
2) Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70mm thick) copper area for Vbb connection.  
PCB is vertical without blown air  
3) Not subject to production test, specified by design  
4) ESD susceptibility HBM according to ANSI/ESDA/JEDEC J001 (1.5k, 100pF).  
Note:  
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.  
Integrated protection functions are designed to prevent IC destruction under fault conditions  
described in the data sheet. Fault conditions are considered as “outside” the normal operating  
range. Protection functions are neither designed for continuous nor repetitive operation.  
Data Sheet  
6
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4300S-SJ-D  
General product characteristics  
3.2  
Functional range  
Table 3  
Functional range  
Parameter  
Symbol  
Values  
Unit Note or  
Test Condition  
Number  
Min. Typ. Max.  
Nominal operating voltage  
VS  
5
34  
V
VS increasing  
4.2.1  
Note:  
Within the functional range the IC operates as described in the circuit description. The electrical  
characteristics are specified within the conditions given in the related electrical characteristics  
table.  
3.3  
Thermal resistance  
Note:  
This thermal data was generated in accordance with JEDEC JESD51 standards. For more  
information, go to www.jedec.org.  
Table 4  
Thermal resistance1)  
Parameter  
Symbol  
Values  
Unit Note or  
Test Condition  
Number  
Min. Typ. Max.  
Thermal resistance - junction to Rthj-pin5  
pin5  
34.5  
K/W  
4.3.1  
4.3.2  
2)  
Thermal resistance - junction to RthJA_1s0p  
ambient - 1s0p, minimal  
footprint  
145  
K/W  
3)  
4)  
5)  
6)  
Thermal resistance - junction to RthJA_1s0p_300mm  
89  
K/W  
K/W  
K/W  
K/W  
4.3.3  
4.3.4  
4.3.5  
4.3.6  
ambient - 1s0p, 300mm2  
Thermal resistance - junction to RthJA_1s0p_600mm  
78  
ambient - 1s0p, 600mm2  
Thermal resistance - junction to RthJA_2s2p  
ambient - 2s2p  
85  
Thermal resistance - junction to RthJA_2s2p  
ambient with thermal vias - 2s2p  
60.4  
1) Not subject to production test, specified by design  
2) Specified RthJA value is according to Jedec JESD51-3 at natural convection on FR4 1s0p board, footprint; the product  
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 1x 70µm Cu.  
3) Specified RthJA value is according to Jedec JESD51-3 at natural convection on FR4 1s0p board, Cu, 300mm2; the  
Product (Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 1x 70µm Cu.  
4) Specified RthJA value is according to Jedec JESD51-3 at natural convection on FR4 1s0p board, 600mm2; the product  
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 1x 70µm Cu.  
5) Specified RthJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; the product  
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).  
6) Specified RthJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board with two thermal  
vias; the Product (Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm  
Cu, 2 x 35µm Cu. The diameter of the two vias are equal 0.3mm and have a plating of 25um with a copper heatsink  
area of 3mm x 2mm). JEDEC51-7: The two plated-through hole vias should have a solder land of no less than 1.25 mm  
diameter with a drill hole of no less than 0.85 mm diameter.  
Data Sheet  
7
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4300S-SJ-D  
Electrical Characteristics  
4
Electrical Characteristics  
Table 5  
VS=13.5V; Tj = -40°C to +125°C; all voltages with respect to ground. Currents flowing into the  
device unless otherwise specified in chapter “Block Diagram and Terms”. Typical values at  
Vs = 13.5V, Tj = 25°C  
Parameter  
Symbol  
Values  
Unit Note or  
Test Condition  
Number  
Min. Typ. Max.  
Powerstage  
NMOS ON resistance  
RDSON  
RDSON  
ILNOM  
300  
480  
400  
600  
mIOUT= 0.3A; Tj = 25°C; 5.0.1  
9V < VS < 34V;  
VIN= 5V  
NMOS ON resistance  
mIOUT= 0.3A; Tj = 125°C; 5.0.2  
9V < VS < 34V;  
VIN= 5V  
Nominal load current;  
device on PCB 1)  
0.4  
A
Tpin5 = 85°C  
5.0.3  
Timings of power stages2)  
Turn ON time (to 90% of Vout);  
L to H transition of VIN  
tON  
140  
170  
2.0  
µs  
µs  
VS=13.5V; RL = 47Ω  
VS=13.5V; RL = 47Ω  
5.0.4  
5.0.5  
5.0.6  
Turn OFF time (to 10% of Vout);  
H to L transition of VIN  
tOFF  
SRON  
ON-slew rate; VOUT / t ;  
(10 to 30% of Vout);  
L to H transition of VIN  
V /µs VS=13.5V; RL = 47Ω  
V / µs VS=13.5V; RL = 47Ω  
OFF-slew rate; VOUT / t ;  
(70 to 40% of Vout);  
SROFF  
2.0  
5.0.7  
H to L transition of VIN  
Under voltage lockout (charge pump start-stop-restart)  
Supply undervoltage;  
charge pump stop voltage  
VSUV  
5.5  
5.5  
V
V
VS decreasing  
VS increasing  
5.0.8  
5.0.9  
Supply startup voltage;  
VSSU  
Charge pump restart voltage  
Current consumption  
Operating current  
Standby current  
IGND  
1.3  
26  
mA VIN= 5V  
5.0.10  
5.0.11  
ISSTB  
µA  
VIN= 0V; VOUT= 0V  
-40°C < Tj < 85°C  
VIN= 0V; Tj = 125°C  
VIN= 0V; VOUT= 0V  
Standby current  
ISSTB  
26  
12  
µA  
µA  
5.0.12  
5.0.13  
Output leakage current  
Protection functions3)  
IOUTLK  
Initial peak short circuit current  
limit  
ILSCP  
2
A
Tj = -40°C; VS = 20V;  
VIN = 5.0V  
5.0.14  
Data Sheet  
8
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4300S-SJ-D  
Electrical Characteristics  
Table 5  
VS=13.5V; Tj = -40°C to +125°C; all voltages with respect to ground. Currents flowing into the  
device unless otherwise specified in chapter “Block Diagram and Terms”. Typical values at  
Vs = 13.5V, Tj = 25°C  
Parameter  
Symbol  
Values  
Unit Note or  
Test Condition  
Number  
Min. Typ. Max.  
Initial peak short circuit current  
limit  
ILSCP  
ILSCP  
ILSCR  
1.2  
A
A
A
Tj = 25°C; VS = 20V;  
IN = 5.0V  
Tj =125°C; VS = 20V;  
IN = 5.0V  
5.0.15  
5.0.16  
5.0.17  
V
Initial peak short circuit current  
limit  
0.4  
V
Repetitive short circuit current  
limit  
1
VIN = 5.0V  
Tj = TjTrip ; see timing diagrams  
Output clamp at VOUT = VS - VDSCL  
(inductive load switch off)  
VDSCL  
VSAZ  
TjTrip  
THYS  
VSREV  
VFDS  
41  
41  
150  
47  
V
IS = 4mA  
IS = 4mA  
5.0.18  
5.0.19  
5.0.20  
5.0.21  
Overvoltage protection  
VOUT = VS - VONCL  
V
Thermal overload  
trip temperature  
°C  
K
Thermal hysteresis  
Reverse Battery4)  
10  
Continuous reverse battery  
voltage  
- 32  
V
5.0.22  
5.0.23  
Forward voltage of the drain-  
source reverse diode  
600  
mV IFDS = 200mA;  
VIN= 0V; Tj = 125°C  
Input interface; pin IN  
Input turn-ON voltage  
(logic input high-level)  
VINON  
2.2  
V
V
5.0.24  
5.0.25  
Input turn-OFF voltage  
(logic input low-level)  
VINOFF  
0.8  
Input threshold hysteresis  
Off state input current  
On state input current  
Input resistance  
VINHYS  
IINOFF  
IINON  
RIN  
0.3  
V
5.0.26  
5.0.27  
5.0.28  
5.0.29  
1
30  
30  
5.0  
µA  
µA  
kΩ  
VIN = 0.7V  
VIN = 5.0V  
1
1.5  
3.5  
Status output (NMOS open drain); pin ST  
Status output zener voltage  
Status output low voltage  
VSTZ  
5.4  
6.1  
6.8  
0.4  
V
V
IST = 1.6mA  
5.0.30  
5.0.31  
VSTLO  
IST = 1.6mA  
Tj < 25°C  
Status output low voltage  
Status leakage current  
VSTLO  
ISTLK  
0.6  
2
V
IST = 1.6mA  
Tj < 125°C  
5.0.32  
5.0.33  
5.0.34  
µA  
µs  
VST = 5V  
Tj < 105°C  
Status invalid time after positive tdP  
300  
600  
VS = 20V  
input slope5)  
Data Sheet  
9
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4300S-SJ-D  
Electrical Characteristics  
Table 5  
VS=13.5V; Tj = -40°C to +125°C; all voltages with respect to ground. Currents flowing into the  
device unless otherwise specified in chapter “Block Diagram and Terms”. Typical values at  
Vs = 13.5V, Tj = 25°C  
Parameter  
Symbol  
Values  
Unit Note or  
Test Condition  
Number  
Min. Typ. Max.  
Diagnostic characteristics  
Short circuit detection voltage  
Open load detection voltage6)  
Open load detection current7)  
(included in standby current)  
VOUTSC  
VOUTOL  
IOUTOL  
2.8  
3
V
5.0.35  
5.0.36  
5.0.37  
V
5
µA  
VOUT = 4V  
1) Device on 50mm x 50mm x 1,5mm epoxy FR4 PCB with 6cm2 (one layer copper 70um thick) copper area for supply  
voltage connection. PCB in vertical position without blown air.  
2) Timing values only with high slewrate input signal; otherwise slower.  
3) Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data  
sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not designed  
for continuous repetitive operation.  
4) Requires a 150W resistor in GND connection. The reverse load current trough the intrinsic drain-source diode of the  
power-MOS has to be limited by the connected load. Power dissipation is higher compared to normal operation due  
to the voltage drop across the drain-source diode. The temperature protection is not functional during reverse  
current operation! Input current has to be limited (see max ratings).  
5) No delay time after overtemparature switch off and short circuit in on-state.  
6) External pull up resistor required for open load detection in off state.  
7) External pull up resistor required for open load detection in off state.  
Data Sheet  
10  
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4300S-SJ-D  
Typical performance graphs  
5
Typical performance graphs  
Typical performance characteristics  
Transient thermal impedance ZthJA versus  
Transient thermal impedance ZthJA versus  
pulse time tp @ 6cm2 heatsink area  
pulse time tp @ minimum footprint  
D = tp / T  
D = tp / T  
On-resistance RDSONversus  
junction temperature Tj  
On-resistance RDSONversus  
supply voltage VS  
400  
350  
300  
250  
200  
150  
100  
50  
550  
500  
450  
400  
350  
300  
250  
200  
150  
100  
Tj=−40°C;IL=1A  
Tj=25°C;IL=1A  
50  
Vs=13.5V  
0
Tj=125°C;IL=1A  
0
−40 −25  
0
25  
50  
Tj [°C]  
75  
100  
125  
5
10  
15  
20  
Vs[V]  
25  
30  
35  
40  
Data Sheet  
11  
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4300S-SJ-D  
Typical performance graphs  
Typical performance characteristics  
Switch ON time tON versus  
junction temperature Tj  
Switch OFF time tOFFversus  
junction temperature Tj  
80  
70  
60  
50  
40  
30  
20  
120  
100  
80  
60  
40  
20  
0
10  
Vs=9V;RL=47Ω  
Vs=13.5..32V;RL=47Ω  
Vs=9..32V;RL=47Ω  
75 100 125  
0
−40 −25  
0
25  
50  
T[°C]  
75  
100  
125  
−40 −25  
0
25  
50  
T[°C]  
j
j
ON slewrate SRON versus  
junction temperature Tj  
OFF slewrate SROFF versus  
junction temperature Tj  
1.6  
1.4  
1.2  
1
2
1.8  
1.6  
1.4  
1.2  
1
Vs=9V;RL=47Ω  
Vs=13.5V;RL=47Ω  
Vs=32V;RL=47Ω  
0.8  
0.6  
0.4  
0.2  
0
0.8  
0.6  
0.4  
Vs=9V;RL=47Ω  
Vs=13.5V;RL=47Ω  
Vs=32V;RL=47Ω  
0.2  
0
−40 −25  
0
25  
50  
Tj[°C]  
75  
100  
125  
−40 −25  
0
25  
50  
Tj[°C]  
75  
100  
125  
Data Sheet  
12  
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4300S-SJ-D  
Typical performance graphs  
Typical performance characteristics  
Standby current ISSTB versus  
junction temperature Tj  
Output leakage current IOUTLK versus  
junction temperature Tj  
6
5
4
3
2
1
12  
10  
8
6
4
2
VIN=0V;Vs=32V  
75 100  
VIN=0V;Vs=32V  
0
0
−40 −25  
0
25  
50  
Tj [°C]  
125  
−40 −25  
0
25  
50  
Tj [°C]  
75  
100  
125  
Initial peak short circuit current limit ILSCP versus Initial short circuit shutdown time tSCOFF versus  
junction temperature Tj  
junction temperature Tj  
2
1.8  
1.6  
1.4  
1.2  
1
120  
Vs=20V  
100  
80  
60  
40  
20  
0
0.8  
0.6  
0.4  
0.2  
0
Vs=20V  
100  
−40 −25  
0
25  
50  
Tj [°C]  
75  
125  
−40 −25  
0
25  
50  
T[°C]  
75  
100  
125  
j
Data Sheet  
13  
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4300S-SJ-D  
Typical performance graphs  
Typical performance characteristics  
Input current consumption IIN versus  
junction temperature Tj  
Input current consumption IIN versus  
input voltage VIN  
12  
10  
8
200  
Tj=−40..25°C;Vs=13.5V  
180  
Tj=125°C;Vs=13.5V  
160  
140  
120  
100  
80  
6
4
60  
40  
2
V
IN0.7V;Vs=13.5V  
VIN=5V;Vs=13.5V  
75 100  
20  
0
0
−40 −25  
0
25  
50  
Tj [°C]  
125  
0
2
4
6
8
VIN[V]  
Input threshold voltage VINH,L versus  
junction temperature Tj  
Input threshold voltage VINH,L versus  
supply voltage VS  
2
1.8  
1.6  
1.4  
1.2  
1
2
1.8  
1.6  
1.4  
1.2  
1
0.8  
0.6  
0.4  
0.8  
0.6  
0.4  
OFF;Tj=25°C  
ON;Tj=25°C  
25 30  
OFF;Vs=13.5V  
ON;Vs=13.5V  
75 100  
0.2  
0
0.2  
0
−40 −25  
0
25  
50  
Tj [°C]  
125  
5
10  
15  
20  
Vs[V]  
Data Sheet  
14  
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4300S-SJ-D  
Typical performance graphs  
Typical performance characteristics  
Max. allowable load inductance L versus  
load current IL  
Max. allowable inductive single pulse switch-off  
Energy EAS versus load current IL  
4000  
3500  
3000  
2500  
2000  
1500  
1000  
500  
800  
Tjstart=125°C;Vs=13.5V  
700  
600  
500  
400  
300  
200  
100  
0
Tjstart=125°C;Vs=13.5V;RL=0Ω  
0
0.3  
0.35  
0.4  
0.45  
0.5  
0.3  
0.35  
0.4  
0.45  
0.5  
IL [A]  
IL [A]  
Status delay time tdP versus  
supply voltage VS  
500  
450  
400  
350  
300  
250  
200  
150  
100  
50  
Tj=25°C  
0
5
10  
15  
20  
Vs [V]  
25  
30  
Data Sheet  
15  
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4300S-SJ-D  
Application information  
6
Application information  
6.1  
Application diagram  
The following information is given as a hint for the implementation of the device only and shall not be  
regarded as a description or warranty for a certain functionality, condition or quality of the device.  
Wire  
Harness  
ITS4300S-SJ-D  
VS  
5
6
Bias  
Supervision  
Overvoltage  
Protection  
Current  
Limiter  
7
8
CS  
GND3  
220nF  
Gate  
Control  
Circuit  
IN  
Logic  
2
4
ESD  
Protection  
Wire  
Harness  
ST  
Temperature  
Sensor  
OUT  
3
COUT  
1nF  
Complex  
LOAD  
1
GND  
GND1  
GND2  
Electronic Control Unit  
Figure 4  
Application diagram  
The ITS4300S-SJ-D can be connected directly to a supply network. It is recommended to place a ceramic  
capacitor (e.g. CS = 220nF) between supply and GND to avoid line disturbances. Wire harness  
inductors/resistors are sketched in the application circuit above.  
The complex load (resistive, capacitive or inductive) must be connected to the output pin OUT.  
A built-in current limit protects the device against destruction.  
The ITS4300S-SJ-D can be switched on and off with standard logic ground related logic signal at pin IN.  
In standby mode (IN=L) the ITS4300S-SJ-D is deactivated with very low current consumption.  
The output voltage slope is controlled during on and off transition to minimize emissions. Only a small  
ceramic capacitor COUT=1nF is recommended to attenuate RF noise.  
In the following chapters the main features, some typical waverforms and the protection behavior  
of the ITS4300S-SJ-D is shown. For further details please refer to application notes on the Infineon homepage.  
Data Sheet  
16  
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4300S-SJ-D  
Application information  
6.2  
Diagnosis description  
For diagnostic purpose the device provides a digital output pin ST in order to indicate fault conditions.  
The status output (ST) of the ITS4300S-SJ-D is a high voltage open drain output.  
In “normal” operation mode the NMOS open drain transistor is switched OFF.  
The following truth table defines the status output.  
Table 6  
Truth table of diagnosis feature  
Device operation  
Normal operation  
Short circuit to GND  
Short circuit to GND  
IN  
H
L
OUT  
ST  
H
Comment  
H
L
H
No diagnosis  
H
L
L
OUT=L: VOUT < VOUTSC ;  
Short circuit detection voltage; typ 2.8V  
Short circuit to VS (in OFF state)  
Short circuit to VS (in ON state)  
Overload  
L
H
H
L
L
H
L
H
H
H
No diagnosis  
No diagnosis  
Overload  
H
H
OUT=H: VOUT > VOUTSC ;  
Short circuit detection voltage; typ 2.8V  
Overtemperature  
L
L
H
L
No diagnosis  
Overtemperature  
H
L
L
Open load in OFF state  
Open load in OFF state  
H
H
L
H
H
No diagnosis  
Data Sheet  
17  
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4300S-SJ-D  
Application information  
6.3  
Special feature description  
Supply over voltage:  
Supply reverse voltage:  
ITS4300S-SJ-D  
ITS4300S-SJ-D  
VS  
VS  
5-8  
5-8  
RIN  
RIN  
IN  
IN  
IRev  
2
4
2
+VCC  
ZDIN  
IIN  
ZDIN  
IIN  
RST1  
ST  
ZDSAZ  
ZDSAZ  
ST  
4
RST2  
ZDST  
ZDST  
OUT  
OUT  
ROUTPD  
ROUTPD  
3
3
IRev1  
1
1
VControl  
GND  
GND  
ZL  
ZL  
RGND  
RGND  
IRev2  
If over-voltage is applied to the VS-Pin:  
Voltage is limited to VZDSAZ; current can be calculated:  
ZDSAZ = (VS – VZDSAZ) / RGND  
A typical value for RGND is 150Ω.  
In case of ESD pulse on the input pin there is in both  
polarities a peak current IINpeak ~ VESD / RIN  
If reverse voltage is applied to the device:  
1.) Current via load resistance RL:  
I
I
Rev1 = (VRev – VFDS) / RL  
2.) Current via Input pin IN and dignostic pin ST :  
Rev2 = IST+IIN ~ (VRev–VCC)/RIN +(VRev–VCC)/RST1,2  
I
Current IST must be limited with the extrernal series  
resistor RSTS. Both currents will sum up to:  
I
Rev = IRev1+ IRev2  
Drain-Source power stage clamper VDSCL  
:
Energy calculation:  
ITS4300S-SJ-D  
ITS4300S-SJ-D  
VS  
VS  
5-8  
5-8  
RIN  
RIN  
IN  
IN  
EBatt  
2
4
2
4
ZDIN  
IIN  
ZDIN  
IIN  
ZDSAZ  
ZDSAZ  
ST  
ST  
ELoad  
ZDST  
ZDST  
OUT  
OUT  
ROUTPD  
ROUTPD  
3
3
1
1
IL  
EL  
ER  
LL  
RL  
GND  
GND  
LL  
RGND  
When an inductive load is switched off a current path must be  
established until the current is sloped down to zero (all energy  
removed from the inductive load). For that purpose the series  
combination ZDSCL is connected between Gate and Drain of the  
power DMOS acting as an active clamp.  
When the device is switched off, the voltage at OUT turns  
negative until VDSCL is reached.  
Energy stored in the load inductance is given by :  
EL= IL²*L/2  
While demagnetizing the load inductance the energy  
dissipated by the Power-DMOS is:  
EAS = ES + EL – ER  
With an approximate solution for RL =0Ω:  
The voltage on the inductive load is the difference between  
VDSCL and VS.  
EAS = ½ * L * IL² * {(1- VS / (VS - VDSCL)  
Figure 5  
Special feature description  
Data Sheet  
18  
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4300S-SJ-D  
Application information  
6.4  
Typical application waveforms  
General Input Output waveforms:  
Waveforms switching a resistive load:  
VIN  
VIN  
H
H
L
L
t
t
t
t
VS  
VOUT  
+VS  
VDS  
90%  
70%  
SROFF = dV/dt  
VOUT  
40%  
30%  
SRON = dV/dt  
10%  
0
0
tON  
tOFF  
t
IL  
IL  
0
0
t
t
t
t
VST  
VST  
H
H
L
L
OFF  
ON  
OFF  
ON  
OFF  
ON  
OFF  
Waveforms switching a capacitive load:  
Waveforms switching an inducitive load:  
VIN  
VIN  
H
H
L
L
t
t
VOUT  
VOUT  
~ VS  
~ VS  
0
0
t
t
IL  
ILSC  
IL  
0
0
t
t
VST  
VST  
H
H
L
L
t
t
OFF  
ON  
OFF  
ON  
OFF  
ON  
OFF  
ON  
Figure 6  
Typical application waveforms of the ITS4300S-SJ-D  
Data Sheet  
19  
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4300S-SJ-D  
Application information  
6.5  
Protection behavior  
Overtemperature concept:  
Overtemperature behavior:  
VIN  
H
L
TjRestart  
TjTrip  
t
VOUT  
ON  
heating  
up  
0
t
TJ  
TjTrip  
OFF  
cooling  
down  
TJ  
THYS  
Device  
Status  
THYS  
Normal  
Toggling  
Overtemperature  
t
t
VST  
H
L
OFF  
ON  
OFF  
ON  
OFF  
Waveforms turn on into a short circuit :  
Waveforms short circuit during on state :  
VIN  
H
VIN  
H
L
L
t
t
VOUT  
VOUT  
0
0
t
t
Ipeak  
Ipeak  
IL  
IL  
ILSCP  
Controlled  
Controlled  
by the  
current limit  
by the  
current limit  
ILSCR  
ILSCR  
circuit  
circuit  
tm  
tSCOFF  
0
0
t
t
t
VST  
VST  
H
H
tdP  
L
L
t
Normal  
operation  
OFF  
OFF  
OFF  
OUT shorted to GND  
Overloaded  
Shut down by overtemperature and  
restart by cooling (toggling)  
Shut down by overtemperature and  
restart by cooling (toggling)  
Figure 7  
Protective behavior of the ITS4300S-SJ-D  
Data Sheet  
20  
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4300S-SJ-D  
Package information  
7
Package information  
0.35 x 45°  
1)  
4-0.2  
C
1.27  
B
0.1  
±0.25  
0.64  
SEATING PLANE  
+0.1 2)  
-0.06  
0.41  
±0.2  
6
M
M
0.2  
A B 8x  
0.2  
C 8x  
8
5
1
4
A
1)  
5-0.2  
Index Marking  
1) Does not include plastic or metal protrusion of 0.15 max. per side  
2) Lead width can be 0.61 max. in dambar area  
Figure 8  
PG-DSO-81)  
Green Product (RoHS compliant)  
To meet the world-wide customer requirements for environmentally friendly products and to be compliant  
with government regulations the device is available as a green product. Green products are RoHS-Compliant  
(i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).  
Further information on packages  
https://www.infineon.com/packages  
1) Dimensions in mm  
Data Sheet  
21  
Rev 1.1  
2019-07-25  
Smart high-side NMOS-power switch  
ITS4300S-SJ-D  
Revision history  
8
Revision history  
Revision Date  
Changes  
2019-07-25 Datasheet updated:  
- ESD ratings for HBM updated according to ANSI/ESDA/JEDEC JS-001  
1.1  
1.0  
- Editorial changes  
12-09-01  
Datasheet release  
Data Sheet  
22  
Rev 1.1  
2019-07-25  
Trademarks  
All referenced product or service names and trademarks are the property of their respective owners.  
IMPORTANT NOTICE  
The information given in this document shall in no For further information on technology, delivery terms  
Edition 2019-07-25  
Published by  
event be regarded as a guarantee of conditions or and conditions and prices, please contact the nearest  
characteristics ("Beschaffenheitsgarantie").  
Infineon Technologies Office (www.infineon.com).  
With respect to any examples, hints or any typical  
values stated herein and/or any information regarding  
the application of the product, Infineon Technologies  
hereby disclaims any and all warranties and liabilities  
of any kind, including without limitation warranties of  
non-infringement of intellectual property rights of any  
third party.  
In addition, any information given in this document is  
subject to customer's compliance with its obligations  
stated in this document and any applicable legal  
requirements, norms and standards concerning  
customer's products and any use of the product of  
Infineon Technologies in customer's applications.  
The data contained in this document is exclusively  
intended for technically trained staff. It is the  
responsibility of customer's technical departments to  
evaluate the suitability of the product for the intended  
application and the completeness of the product  
information given in this document with respect to  
such application.  
Infineon Technologies AG  
81726 Munich, Germany  
Please note that this product is not qualified  
according to the AEC Q100 or AEC Q101 documents of  
the Automotive Electronics Council.  
© 2019 Infineon Technologies AG.  
All Rights Reserved.  
WARNINGS  
Due to technical requirements products may contain  
dangerous substances. For information on the types  
in question please contact your nearest Infineon  
Technologies office.  
Do you have a question about any  
aspect of this document?  
Email: erratum@infineon.com  
Z8F51106901  
Except as otherwise explicitly approved by Infineon  
Technologies in a written document signed by  
authorized representatives of Infineon Technologies,  
Infineon Technologies’ products may not be used in  
any applications where a failure of the product or any  
consequences of the use thereof can reasonably be  
expected to result in personal injury.  

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