JANTX2N7221UPBF [INFINEON]

Power Field-Effect Transistor, 10A I(D), 400V, 0.7ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, SMD-1, 3 PIN;
JANTX2N7221UPBF
型号: JANTX2N7221UPBF
厂家: Infineon    Infineon
描述:

Power Field-Effect Transistor, 10A I(D), 400V, 0.7ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, SMD-1, 3 PIN

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PD-91550D  
IRFN340  
JANTX2N7221U  
JANTXV2N7221U  
POWER MOSFET  
SURFACE MOUNT(SMD-1)  
REF:MIL-PRF-19500/596  
400V, N-CHANNEL  
HEXFET® MOSFET TECHNOLOGY  
Product Summary  
Part Number  
RDS(on)  
ID  
IRFN340  
0.55 Ω  
10A  
HEXFET® MOSFET technology is the key to International  
Rectifier’s advanced line of power MOSFET transistors. The  
efficient geometry design achieves very low on-state re-  
sistance combined with high transconductance. HEXFET  
transistors also feature all of the well-established advan-  
tages of MOSFETs, such as voltage control, very fast switch-  
ing, ease of paralleling and electrical parameter temperature  
stability. They are well-suited for applications such as switch-  
ing power supplies, motor controls, inverters, choppers,  
audio amplifiers, high energy pulse circuits, and virtually  
any application where high reliability is required. The  
HEXFET transistor’s totally isolated package eliminates the  
need for additional isolating material between the device  
and the heatsink. This improves thermal efficiency and  
reduces drain capacitance.  
SMD-1  
Features:  
n
n
n
n
n
n
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Electrically Isolated  
Surface Mount  
Dynamic dv/dt Rating  
n Light-weight  
Absolute Maximum Ratings  
Parameter  
Units  
I
@ V  
@ V  
= 10V, T = 25°C  
Continuous Drain Current  
10  
D
D
GS  
GS  
C
A
I
= 10V, T = 100°C Continuous Drain Current  
6.0  
40  
C
I
Pulsed Drain Current À  
Max. Power Dissipation  
Linear Derating Factor  
DM  
@ T = 25°C  
P
125  
W
W/°C  
V
D
C
1.0  
V
Gate-to-Source Voltage  
Single Pulse Avalanche Energy Á  
Avalanche Current À  
±20  
GS  
E
650  
mJ  
A
AS  
I
10  
AR  
E
Repetitive Avalanche Energy À  
Peak Diode Recovery dv/dt   
Operating Junction  
12.5  
4.0  
mJ  
V/ns  
AR  
dv/dt  
T
-55 to 150  
J
T
Storage Temperature Range  
Package Mounting Surface Temperature  
Weight  
°C  
g
STG  
300(for 5 seconds)  
2.6 (Typical)  
For footnotes refer to the last page  
www.irf.com  
1
03/10/11  
IRFN340  
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)  
Parameter  
Min Typ Max Units  
Test Conditions  
BV  
Drain-to-Source Breakdown Voltage  
400  
V
V
= 0V, I = 1.0mA  
D
DSS  
GS  
V/°C Reference to 25°C, I = 1.0mA  
BV  
/T Temperature Coefficient of Breakdown  
0.46  
DSS  
J
D
Voltage  
R
V
Static Drain-to-Source On-State  
Resistance  
Gate Threshold Voltage  
Forward Transconductance  
Zero Gate Voltage Drain Current  
2.0  
4.9  
0.55  
0.70  
4.0  
25  
250  
V
V
= 10V, I = 6.0A  
GS D  
Ã
DS(on)  
= 10V, I = 10A  
GS  
D
V
S
V
DS  
= V , I = 250µA  
GS(th)  
fs  
GS  
D
g
V
=15V, I  
= 6.0A Ã  
DS  
V
DS  
I
= 320V ,V =0V  
DSS  
DS GS  
µA  
V
= 320V,  
DS  
= 0V, T = 125°C  
V
GS  
J
I
I
Gate-to-Source Leakage Forward  
Gate-to-Source Leakage Reverse  
Total Gate Charge  
Gate-to-Source Charge  
Gate-to-Drain (‘Miller’) Charge  
Turn-On Delay Time  
Rise Time  
Turn-Off Delay Time  
Fall Time  
Total Inductance  
4.0  
100  
-100  
65  
14  
40.5  
25  
92  
79  
58  
V
= 20V  
= -20V  
GSS  
GSS  
GS  
nA  
nC  
V
GS  
Q
Q
Q
V
=10V, I = 10A  
g
gs  
gd  
d(on)  
r
GS D  
V
DS  
= 200V  
t
t
t
t
V
= 200V, I = 10A,  
=10V, R = 2.35Ω  
DD  
GS  
D
G
V
ns  
d(off)  
f
Measured from the center of drain  
pad to center of source pad.  
L
+ L  
S
D
nH  
C
C
C
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
1400  
3500  
2300  
V
= 0V, V  
= 25V  
f = 1.0MHz  
iss  
oss  
rss  
GS DS  
pF  
Source-Drain Diode Ratings and Characteristics  
Parameter  
Min Typ Max Units  
Test Conditions  
I
I
V
t
Q
Continuous Source Current (Body Diode)  
Pulse Source Current (Body Diode) À  
Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
10  
40  
1.5  
600  
5.6  
S
SM  
SD  
rr  
A
V
ns  
µC  
T = 25°C, I = 10A, V  
= 0V Ã  
j
S
GS  
T = 25°C, I = 10A, di/dt 100A/µs  
j
F
V
30V Ã  
RR  
DD  
t
on  
Forward Turn-On Time  
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by L + L .  
S D  
Thermal Resistance  
Parameter  
Min Typ Max Units  
Test Conditions  
R
R
Junction-to-Case  
Junction-to-PC board  
4.0  
1.0  
thJC  
thJ-PCB  
°C/W  
Soldered to a copper-clad PC board  
Note: Corresponding Spice and Saber models are available on International Rectifier Web site.  
For footnotes refer to the last page  
2
www.irf.com  
IRFN340  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
Fig 3. Typical Transfer Characteristics  
Fig 4. Normalized On-Resistance  
Vs.Temperature  
www.irf.com  
3
IRFN340  
13a & b  
Fig 6. Typical Gate Charge Vs.  
Fig 5. Typical Capacitance Vs.  
Gate-to-SourceVoltage  
Drain-to-SourceVoltage  
100  
10  
OPERATION IN THIS AREA LIMITED BY R (on)  
DS  
µ
100 s  
1ms  
1
10ms  
DC  
0.1  
0.01  
Tc = 25°C  
Tj = 150°C  
Single Pulse  
1
10  
100  
1000  
V
, Drain-to-Source Voltage (V)  
DS  
Fig 8. Maximum Safe Operating Area  
Fig 7. Typical Source-Drain Diode  
ForwardVoltage  
4
www.irf.com  
IRFN340  
RD  
VDS  
VGS  
D.U.T.  
RG  
+VDD  
-
10V  
Pulse Width ≤ 1 µs  
Duty Factor ≤ 0.1 %  
Fig 10a. Switching Time Test Circuit  
V
DS  
90%  
10%  
V
GS  
Fig 9. Maximum Drain Current Vs.  
t
t
r
t
t
f
d(on)  
d(off)  
CaseTemperature  
Fig 10b. Switching Time Waveforms  
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case  
www.irf.com  
5
IRFN340  
15V  
DRIVER  
+
L
V
DS  
.
D.U.T  
R
G
V
DD  
-
I
A
AS  
10  
2V  
0.01Ω  
t
p
Fig 12a. Unclamped Inductive Test Circuit  
V
(BR)DSS  
Fig 12c. Maximum Avalanche Energy  
t
p
Vs. DrainCurrent  
I
AS  
Current Regulator  
Same Type as D.U.T.  
Fig 12b. Unclamped Inductive Waveforms  
50KΩ  
.2µF  
1
10V  
Q
G
.3µF  
10 V  
+
V
DS  
D.U.T.  
-
Q
Q
GD  
GS  
V
GS  
V
G
3mA  
I
I
D
G
Charge  
Current Sampling Resistors  
Fig 13b. Gate Charge Test Circuit  
Fig 13a. Basic Gate Charge Waveform  
6
www.irf.com  
IRFN340  
Footnotes:  
Â
Ã
I
V
10A, di/dt 120A/µs,  
À
Repetitive Rating; Pulse width limited by  
maximum junction temperature.  
SD  
DD  
400V, T 150°C  
J
Pulse width 300 µs; Duty Cycle 2%  
Á
V
= 50V, starting T = 25°C, L= 13mH  
J
DD  
Peak I = 10A, V  
= 10V  
L
GS  
Case Outline and Dimensions — SMD-1  
PADASSIGNMENTS  
1- DRAIN  
2- GATE  
3- SOURCE  
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105  
IR LEOMINSTER : 205 Crawford St., Leominster, Massachusetts 01453, USA Tel: (978) 534-5776  
TAC Fax: (310) 252-7903  
Visit us at www.irf.com for sales contact information.  
Data and specifications subject to change without notice. 03/2011  
www.irf.com  
7

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