JANTX2N7221UPBF [INFINEON]
Power Field-Effect Transistor, 10A I(D), 400V, 0.7ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, SMD-1, 3 PIN;型号: | JANTX2N7221UPBF |
厂家: | Infineon |
描述: | Power Field-Effect Transistor, 10A I(D), 400V, 0.7ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, SMD-1, 3 PIN 开关 脉冲 晶体管 |
文件: | 总7页 (文件大小:220K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
PD-91550D
IRFN340
JANTX2N7221U
JANTXV2N7221U
POWER MOSFET
SURFACE MOUNT(SMD-1)
REF:MIL-PRF-19500/596
400V, N-CHANNEL
HEXFET® MOSFET TECHNOLOGY
Product Summary
Part Number
RDS(on)
ID
IRFN340
0.55 Ω
10A
HEXFET® MOSFET technology is the key to International
Rectifier’s advanced line of power MOSFET transistors. The
efficient geometry design achieves very low on-state re-
sistance combined with high transconductance. HEXFET
transistors also feature all of the well-established advan-
tages of MOSFETs, such as voltage control, very fast switch-
ing, ease of paralleling and electrical parameter temperature
stability. They are well-suited for applications such as switch-
ing power supplies, motor controls, inverters, choppers,
audio amplifiers, high energy pulse circuits, and virtually
any application where high reliability is required. The
HEXFET transistor’s totally isolated package eliminates the
need for additional isolating material between the device
and the heatsink. This improves thermal efficiency and
reduces drain capacitance.
SMD-1
Features:
n
n
n
n
n
n
Simple Drive Requirements
Ease of Paralleling
Hermetically Sealed
Electrically Isolated
Surface Mount
Dynamic dv/dt Rating
n Light-weight
Absolute Maximum Ratings
Parameter
Units
I
@ V
@ V
= 10V, T = 25°C
Continuous Drain Current
10
D
D
GS
GS
C
A
I
= 10V, T = 100°C Continuous Drain Current
6.0
40
C
I
Pulsed Drain Current À
Max. Power Dissipation
Linear Derating Factor
DM
@ T = 25°C
P
125
W
W/°C
V
D
C
1.0
V
Gate-to-Source Voltage
Single Pulse Avalanche Energy Á
Avalanche Current À
±20
GS
E
650
mJ
A
AS
I
10
AR
E
Repetitive Avalanche Energy À
Peak Diode Recovery dv/dt Â
Operating Junction
12.5
4.0
mJ
V/ns
AR
dv/dt
T
-55 to 150
J
T
Storage Temperature Range
Package Mounting Surface Temperature
Weight
°C
g
STG
300(for 5 seconds)
2.6 (Typical)
For footnotes refer to the last page
www.irf.com
1
03/10/11
IRFN340
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
Parameter
Min Typ Max Units
Test Conditions
BV
Drain-to-Source Breakdown Voltage
400
—
—
V
V
= 0V, I = 1.0mA
D
DSS
GS
V/°C Reference to 25°C, I = 1.0mA
∆BV
/∆T Temperature Coefficient of Breakdown
—
0.46
—
DSS
J
D
Voltage
R
V
Static Drain-to-Source On-State
Resistance
Gate Threshold Voltage
Forward Transconductance
Zero Gate Voltage Drain Current
—
—
2.0
4.9
—
—
—
—
—
—
—
0.55
0.70
4.0
—
25
250
V
V
= 10V, I = 6.0A
GS D
Ã
DS(on)
Ω
= 10V, I = 10A
GS
D
V
S
V
DS
= V , I = 250µA
GS(th)
fs
GS
D
g
V
=15V, I
= 6.0A Ã
DS
V
DS
I
= 320V ,V =0V
DSS
DS GS
µA
—
V
= 320V,
DS
= 0V, T = 125°C
V
GS
J
I
I
Gate-to-Source Leakage Forward
Gate-to-Source Leakage Reverse
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain (‘Miller’) Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Inductance
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
4.0
100
-100
65
14
40.5
25
92
79
58
—
V
= 20V
= -20V
GSS
GSS
GS
nA
nC
V
GS
Q
Q
Q
V
=10V, I = 10A
g
gs
gd
d(on)
r
GS D
V
DS
= 200V
t
t
t
t
V
= 200V, I = 10A,
=10V, R = 2.35Ω
DD
GS
D
G
V
ns
d(off)
f
Measured from the center of drain
pad to center of source pad.
L
+ L
S
D
nH
C
C
C
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
—
—
—
1400
3500
2300
—
—
—
V
= 0V, V
= 25V
f = 1.0MHz
iss
oss
rss
GS DS
pF
Source-Drain Diode Ratings and Characteristics
Parameter
Min Typ Max Units
Test Conditions
I
I
V
t
Q
Continuous Source Current (Body Diode)
Pulse Source Current (Body Diode) À
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
—
—
—
—
—
—
—
—
—
—
10
40
1.5
600
5.6
S
SM
SD
rr
A
V
ns
µC
T = 25°C, I = 10A, V
= 0V Ã
j
S
GS
T = 25°C, I = 10A, di/dt ≤ 100A/µs
j
F
V
≤ 30V Ã
RR
DD
t
on
Forward Turn-On Time
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by L + L .
S D
Thermal Resistance
Parameter
Min Typ Max Units
Test Conditions
R
R
Junction-to-Case
Junction-to-PC board
—
—
—
4.0
1.0
—
thJC
thJ-PCB
°C/W
Soldered to a copper-clad PC board
Note: Corresponding Spice and Saber models are available on International Rectifier Web site.
For footnotes refer to the last page
2
www.irf.com
IRFN340
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance
Vs.Temperature
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3
IRFN340
13a & b
Fig 6. Typical Gate Charge Vs.
Fig 5. Typical Capacitance Vs.
Gate-to-SourceVoltage
Drain-to-SourceVoltage
100
10
OPERATION IN THIS AREA LIMITED BY R (on)
DS
µ
100 s
1ms
1
10ms
DC
0.1
0.01
Tc = 25°C
Tj = 150°C
Single Pulse
1
10
100
1000
V
, Drain-to-Source Voltage (V)
DS
Fig 8. Maximum Safe Operating Area
Fig 7. Typical Source-Drain Diode
ForwardVoltage
4
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IRFN340
RD
VDS
VGS
D.U.T.
RG
+VDD
-
10V
Pulse Width ≤ 1 µs
Duty Factor ≤ 0.1 %
Fig 10a. Switching Time Test Circuit
V
DS
90%
10%
V
GS
Fig 9. Maximum Drain Current Vs.
t
t
r
t
t
f
d(on)
d(off)
CaseTemperature
Fig 10b. Switching Time Waveforms
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
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5
IRFN340
15V
DRIVER
+
L
V
DS
.
D.U.T
R
G
V
DD
-
I
A
AS
10
2V
0.01Ω
t
p
Fig 12a. Unclamped Inductive Test Circuit
V
(BR)DSS
Fig 12c. Maximum Avalanche Energy
t
p
Vs. DrainCurrent
I
AS
Current Regulator
Same Type as D.U.T.
Fig 12b. Unclamped Inductive Waveforms
50KΩ
.2µF
1
10V
Q
G
.3µF
10 V
+
V
DS
D.U.T.
-
Q
Q
GD
GS
V
GS
V
G
3mA
I
I
D
G
Charge
Current Sampling Resistors
Fig 13b. Gate Charge Test Circuit
Fig 13a. Basic Gate Charge Waveform
6
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IRFN340
Footnotes:
Â
Ã
I
V
≤ 10A, di/dt ≤ 120A/µs,
À
Repetitive Rating; Pulse width limited by
maximum junction temperature.
SD
DD
≤ 400V, T ≤ 150°C
J
Pulse width ≤ 300 µs; Duty Cycle ≤ 2%
Á
V
= 50V, starting T = 25°C, L= 13mH
J
DD
Peak I = 10A, V
= 10V
L
GS
Case Outline and Dimensions — SMD-1
PADASSIGNMENTS
1- DRAIN
2- GATE
3- SOURCE
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
IR LEOMINSTER : 205 Crawford St., Leominster, Massachusetts 01453, USA Tel: (978) 534-5776
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information.
Data and specifications subject to change without notice. 03/2011
www.irf.com
7
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