MA000843314 [INFINEON]
Material Content Data Sheet;
| 型号： | MA000843314 |
| 厂家： | 
Infineon |
| 描述： | Material Content Data Sheet |
| 文件： | 总1页 (文件大小：28K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Material Content Data Sheet
Sales Product Name BFP 520 H6327
Issued
29. August 2013
6.93 mg
MA#
MA000808534
Package
PG-SOT343-4-2
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
noble metal
gold
7440-57-5
7440-31-5
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-57-5
1333-86-4
-
0.003
0.001
0.017
0.001
0.003
0.010
3.433
0.010
0.030
0.652
2.351
0.199
0.216
0.04
0.01
0.24
0.01
0.05
0.15
49.56
0.14
0.44
9.42
33.94
2.88
3.12
421
109
non noble metal
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
tin
silicon
0.29
2449
100
2979
leadframe
silicon
titanium
chromium
copper
gold
498
1493
49.77
0.14
495593
1436
497684
1436
wire
encapsulation
organic material
plastics
carbon black
epoxy resin
silicondioxide
tin
4379
94153
339390
28760
31219
inorganic material
non noble metal
noble metal
60676-86-0
7440-31-5
7440-22-4
43.80
2.88
3.12
437922
28760
leadfinish
plating
silver
31219
*deviation
< 10%
Sum in total: 100,00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
相关型号：
©2020 ICPDF网 联系我们和版权申明