MA001108592 [INFINEON]
Material Content Data Sheet;
| 型号： | MA001108592 |
| 厂家： | 
Infineon |
| 描述： | Material Content Data Sheet |
| 文件： | 总1页 (文件大小：28K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Material Content Data Sheet
Sales Product Name BSP300 H6327
Issued
29. August 2013
114.06 mg
MA#
MA001092588
Package
PG-SOT223-4-21
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
non noble metal
organic material
plastics
silicon
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-50-8
1333-86-4
-
2.019
0.010
0.051
0.152
50.489
0.016
0.586
8.796
49.255
1.464
0.513
0.123
0.581
1.77
0.01
0.04
0.13
44.28
0.01
0.51
7.71
43.19
1.28
0.45
0.11
0.51
1.77
17706
89
17706
leadframe
silicon
titanium
chromium
copper
445
1334
442673
140
44.46
0.01
444541
140
wire
copper
encapsulation
carbon black
epoxy resin
silicondioxide
tin
5141
77116
431851
12836
4498
1080
5091
inorganic material
non noble metal
noble metal
60676-86-0
7440-31-5
7440-22-4
-
51.41
1.28
0.45
514108
12836
4498
leadfinish
plating
glue
silver
plastics
epoxy resin
silver
noble metal
7440-22-4
0.62
6171
*deviation
< 10%
Sum in total: 100,00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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