ML1000605D [INFINEON]

HIGH RELIABILITY RADIATION HARDENED LOW POWER DC-DC CONVERTER;
ML1000605D
型号: ML1000605D
厂家: Infineon    Infineon
描述:

HIGH RELIABILITY RADIATION HARDENED LOW POWER DC-DC CONVERTER

DC-DC转换器
文件: 总17页 (文件大小:875K)
中文:  中文翻译
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PD-97806  
ML1000605D  
100V Input, Dual Output  
HIGH RELIABILITY  
RADIATION HARDENED  
LOW POWER  
DC-DC CONVERTER  
Description  
The ML-Series of isolated DC-DC converters for space  
applications are low power radiation hardened high  
reliability devices designed for hostile radiation  
environments such as those encountered by geostationary  
Features  
earth orbit satellites, deep space probes and communication n Total Dose > 100 krad(Si)  
n SEE > 82 MeV.cm2/mg  
systems. Features include small size, high efficiency,  
low weight, and a good tolerance to total ionizing dose,  
single event effects, and environmental stresses such  
as temperature extremes, mechanical shock, and  
vibration. All components are fully derated to meet the  
requirements of EEE-INST-002 (NASA) and ECSS-Q-  
30-11A (ESA). Extensive documentation including worst  
case analysis, radiation susceptibility, thermal analysis,  
stress analysis, and reliability analysis are available.  
n Low Weight < 50 grams  
n 97V to 103V DC Input Range  
n O/P 1: +6.0V (up to 500mA)  
n O/P 2: -5.0V (up to 100mA)  
n Output Ripple: < 1mVrms (100Hz - 50MHz)  
n CS Rejection Input to Outputs: > 90dB  
(50Hz - 1.0MHz)  
n 10M@ 100VDC Isolation  
n Input Under-Voltage Protection  
n Meets Conducted Emission Requirements of  
Major Power Buses:  
The ML-Series converter has two outputs – one positive  
and one negative - each is independently regulated via  
linear post regulators. The outputs are sequenced  
during turn-on and turn-off such that negative output  
comes up first at turn-on and stays up at turn-off until the  
positive output has decreased. The ML-series converters  
incorporate a fixed frequency flyback power converter  
and internal EMI filter that meets the requirements for  
most major satellite power buses. The converter includes  
isolated On/Off telecommand with associated status  
telemetry. The converter also includes input under  
voltage shut-down functionality.  
100Hz - 100kHz: 80dBuArms  
100kHz - 10MHz: -20dB/decade  
10MHz - 50MHz: 40dBuArms  
n Short Circuit and Overload Protection  
n Meets Derating Requirements of EEE-INST  
002 and ECSS-Q-30-11A  
n Isolated On/Off Control via High Level Pulse  
Command (Latching Relay)  
n Status Telemetry (Relay Contact Type)  
n Workmanship Per IPC-A610 Class 3  
n Board is Coated with ARATHANE-5750  
Due to the linear post regulation of the outputs, the ML-  
Series is well suited for use in RF-applications where  
low noise, high output voltage accuracy, and high CS  
attenuation is required.  
Applications  
n
Low Power RF Systems (like LNA) on-board  
Satellites  
Each converter is provided as a complete board  
assembly for installation into the host equipment chassis.  
The board is conformal coated (except for mating  
surfaces) and is mounted in the host chassis using  
screws. The board outline is L x W x H: 70mm x 50mm x  
18mm. The weight is less than 50 grams.  
Non-flight versions of the ML-Series converters  
are available for system development purposes.  
Variations in electrical specifications and  
screening to meet custom requirements can be  
accommodated.  
www.irf.com  
1
04/22/13  
ML1000605D  
(100V Input, Dual Output)  
Circuit Description  
Design Methodology  
The ML-Series converters utilize two-stage regulation  
with a flyback topology with a switching frequency of  
140kHz for primary regulation and linear post  
regulation for each of the outputs.  
The ML-Series is developed using a proven  
conservative design methodology, which includes  
selecting radiation tolerant, and established  
reliability components and full derating to the  
requirements of EEE-INST-002 and ECSS-ST-11A.  
The Output power is limited under any load fault  
condition to approximately 120% of rated output.  
An overload condition on the positive output causes  
the converter output to behave like a constant current  
source with the output voltage dropping below  
nominal. An overload condition at the negative output  
causes the positive output to shut-down in order to  
protect RF-transistors in the load. The converter will  
resume normal operation when the load current is  
reduced below the current limit point.  
An under-voltage protection circuit prohibits the  
converter from operating when the line voltage is  
too low for safe operation. In case of an under  
voltage event the converter will not start when the  
input voltage returns to its nominal level before an  
Off-command followed by an On-command has been  
issued.  
The isolated On/Off telecommand is made with a  
latching relay and is intended for use with a 26V  
pulse command. A status telemetry derived from a  
spare set of contacts in the relay is used for status  
telemetry.  
For further information please refer to the ML-Series  
generic description available at www.irf.com.  
2
www.irf.com  
ML1000605D  
(100V Input, Dual Output)  
Specifications  
Absolute Maximum Ratings  
Recommended Operating Conditions  
Input voltage range  
-0.5Vdc to +120Vdc  
Input voltage range (Note 9)  
+97Vdc to +103Vdc  
0 to Max. Rated  
-40°C to +75°C *  
Output power  
Internally limited  
-55°C to +100°C  
Output power  
Operating mounting point  
temperature (Note 10)  
Storage temperature  
Operating mounting point  
temperature (Note 9)  
Cold start temperature  
-55°C to +125°C  
-55°C  
* Meets full derating  
Electrical Performance Characteristics  
Conditions  
Limits  
Nom  
-40°C Tc +75°C  
Unit  
Max  
Parameter  
Condition  
V
IN  
= 100V DC ± 0.5%, C = 0µF  
L
Min  
97  
unless otherwise specified  
Primary Input Voltage  
100  
103  
V
Output voltage ( VOUT  
(O/P 1, O/P 2)  
+6.0V  
)
Note 1  
1
1
+5.970  
-4.975  
+6.00  
-5.00  
+6.030  
-5.025  
V
V
V
0% ≤ IOUT 100% of rated load  
0% ≤ IOUT 100% of rated load  
0% ≤ IOUT 100% of rated load  
-5.0V  
+6.0V  
-5.0V  
2
2
+5.940  
-4.950  
+6.060  
-5.050  
+6.0V  
-5.0V  
3
3
+5.880  
-4.900  
6.120  
5.100  
Output power ( POUT  
(O/P 1, O/P 2)  
+6.0V  
)
1,2,3  
VIN = 97, 100, 103V  
3.0  
0.5  
W
-5.0V  
Output current ( IOUT  
(O/P 1, O/P 2)  
+6.0V  
)
1,2,3  
1,2,3  
1,2,3  
V
IN = 97, 100, 103V  
0
0
500  
100  
mA  
-5.0V  
Line regulation ( VRLINE  
Each output  
)
VIN = 97, 100, 103V  
I
OUT = 10%, 50%, 100% rated  
-1.0  
-1.0  
1.0  
1.0  
1.0  
mV  
mV  
Load regulation ( VRLOAD  
Each output  
)
IOUT = 10%, 50%, 100% rated  
VIN = 97, 100, 103V  
Cross regulation ( VRCROSS  
)
1,2,3  
1,2,3  
V
IN = 97, 100, 103V, Note 1  
mV  
mA  
Input current  
IOUT = 0, commanded On  
Commanded Off  
10  
15  
2.0  
Switching frequency ( FS  
)
1,2,3  
1,2,3  
Notes 1, 7  
126  
85  
140  
154  
kHz  
V
Input under voltage  
Trig level  
95  
0% ≤ IOUT 100% of rated load  
Output Sequencing  
Turn-on delay O/P 2 to O/P 1  
Turn-off delay O/P1 to O/P 2  
1,2,3  
2.0  
1.0  
12  
ms  
8.0  
IOUT 20% for Output 1  
For Notes to Specifications, refer to page 5  
www.irf.com  
3
ML1000605D  
(100V Input, Dual Output)  
Electrical Performance Characteristics (continued)  
Conditions  
Limits  
Nom  
-40°C Tc +75°C  
Unit  
Parameter  
Condition  
V
= 100V DC ± 0.5%, C = 0µF  
L
IN  
Min  
Max  
unless otherwise specified  
Output ripple ( VRIP  
Each output  
+6.0V  
)
VIN = 97, 100, 103V  
IOUT = 100% rated load  
1
Frequency domain 100Hz – 50MHz  
Note 1  
1.0  
1.0  
mVrms  
mVpp  
-5.0V  
+6.0V  
-5.0V  
1,2  
Time domain 100Hz – 50MHz  
Notes 1, 2  
30  
30  
Efficiency ( EFF  
)
For combined output power  
of  
0.70W  
1,2,3  
1,2,3  
IOUT = 20% rated load  
IOUT = 50% rated load  
IOUT = 100% rated load  
37  
52  
60  
38  
54  
62  
%
1.75W  
3.50W  
Telecommand I/F  
Pulse Voltage high  
Pulse Voltage low  
Pulse duration  
Note 1  
+22  
-40  
10  
+30  
0.5  
V
V
1000  
ms  
Telemetry  
Converter On  
Converter Off  
1,2,3  
1,2,3  
400  
1.0  
422  
450  
ohm  
Mohm  
Current Limit Point  
Each output  
+6.0V  
VOUT = 100mV below Nominal  
mA  
550  
110  
700  
150  
-5.0V  
Output response to  
step load changes ( V  
)
)
TLD  
-70  
-50  
70  
50  
+6.0V  
-5.0V  
1,2,3  
1,2,3  
20% to / from 100% Load, Note 3  
mV pk  
ms  
Recovery time,  
20% to / from 100% Load , Notes 3, 4  
step load changes ( T  
TLD  
+6.0  
-5.0  
2.5  
2.5  
Turn-on Response  
10% Load, Full Load  
Note 5  
Overshoot ( V  
)
OS  
1,2,3  
60  
50  
10  
mV  
ms  
+6.0V  
-5.0V  
2.0  
Turn-on Delay  
Capacitive Load ( C )  
L
1
100  
100  
I
= 100% rated load  
+6.0V  
-5.0V  
OUT  
µF  
No effect on DC performance  
Notes 1, 6  
Each output  
For Notes to Specifications, refer to page 5  
4
www.irf.com  
ML1000605D  
(100V Input, Dual Output)  
Electrical Performance Characteristics (continued)  
Conditions  
-40°C Tc +75°C  
Limits  
Parameter  
Condition  
Unit  
V
= 100V DC ± 0.5%, C = 0µF  
L
unless otherwise specified  
IN  
Min  
96  
Nom  
110  
Max  
EMC conducted  
I
= 100% rated load  
OUT  
susceptibility  
1
dB  
Primary power sine wave injection of  
2Vp-p, 100Hz to 1MHz, Note 1  
(Line rejection)  
Electromagnetic Interference  
(EMI), conducted emission  
(CE)  
IOUT = 100% rated load, Notes 1, 7  
1
1
Limits per Figures 4 and 5  
Isolation  
Input to Output, any potential to  
telecommand input and any potential to  
telemetry output, test @ 100VDC  
10  
MΩ  
Device Weight  
Failure Rate  
50  
60  
g
FITs  
MIL-HDBK-217F2, SF, 35°C, Note 8  
Notes: Specification and Electrical Performance Characteristics Tables  
1. Parameter is tested as part of design characterization or after design changes. Thereafter, parameter shall  
be guaranteed to the limits specified.  
2. Guaranteed for a D.C. to 50MHz bandwidth. Tested using a 10.7MHz bandwidth.  
3. Load current step transition time 10 µs.  
4. Recovery time is measured from the initiation of the transient to where VOUT has returned to within ±1% of  
its steady state value.  
5. Turn-on delay time from application of telecommand pulse to the point where Output 2 = 98% of nominal  
output voltage.  
6. Capacitive load may be any value from 0 to the maximum limit without compromising the output sequencing  
performance. A capacitive load in excess of the maximum limit may influence the output sequencing  
performance and start-up time, converter operation and dc performance will remain intact.  
7. The switching frequency and 1st and 2nd harmonic of the input ripple is tested on every unit.  
8. MIL-HDBK-217F2 stress-dependent method is used with 2 exceptions: For soldering a fixed failure rate at  
0.035FIT is used and for power MOSFETs the dissipated power (instead of rated power) is used for the Pr  
parameter. 1 FIT is 1 failure in 109 hours.  
9. The converter meets full derating per EEE-INST-002 and ECSS-Q-30-11A with the following exception: For  
Schottky diode JANS1N5819 a maximum derated junction temperature of +110°C. For EEE-INST-002 it is  
required that ceramic capacitors with a voltage stress below 10V shall be rated for minimum 100V - in the  
product such capacitors is rated for 50V minimum.  
10. Although operation temperatures between -55°C to +100°C and -40°C to+75°C is guaranteed, no  
parameter limits are specified.  
Electrical Performance Characteristics - Definition of Conditions  
Condition Definition  
Comment  
1
2
3
BOL @ +25°C interface temperature  
Initial setting  
BOL @ -40°C to +75°C interface temperature Initial setting and worst case temperature variation  
EOL @ -40°C to +75°C interface temperature Worst case performance including initial setting,  
temperature variation, aging and radiation degradation  
www.irf.com  
5
ML1000605D  
(100V Input, Dual Output)  
Model Definition and Test Plans  
Model Definition  
Model  
Description  
Build Standard  
EBB  
The EBB is an electrical  
representative model.  
The PCB will be hand soldered by the engineering group. No  
staking and conformal coating is foreseen  
Preferably same type of EEE parts as intended for flight, but  
lower grade will be used for convenience. For resistors and  
capacitors different types with same basic characteristics may be  
used  
The EBB is intended to be  
used by customers in their  
proto type at equipment  
level.  
EBB models are built at  
IR’s Danish Design Center.  
EQM  
FM  
The EQM is an electrical  
and mechanical  
representative model.  
Flight standard for processes.  
Same type of EEE parts as intended for flight, but lower grade  
may be used for convenience.  
The EQM is intended to be  
used by customer in their  
EQM at equipment level.  
Flight standard models.  
Full flight standard  
Test Plan - A  
The EBB must pass the following tests:  
Location* Remarks  
Test No. Type of Test  
1
Electrical performance test,  
IRD  
Acceptance Test Procedure  
room temperature incl. Limited  
EMC test (CE 50kHz-1MHz)  
2
3
Electrical performance test in  
temperature (Q-level)  
IRD  
IRD  
Acceptance Test Procedure  
Acceptance Test Procedure  
Electrical performance test,  
room temperature incl. Limited  
EMC test (CE 50kHz-1MHz)  
4
Final Inspection  
IRD  
General inspection Procedure  
6
www.irf.com  
ML1000605D  
(100V Input, Dual Output)  
Test Plan - B  
The EQM must pass the following tests:  
Location* Remarks  
Test No. Type of Test  
1
Electrical performance test, room  
IRSJ  
Acceptance Test Procedure  
temperature incl. Limited EMC test  
(CE 50kHz-1MHz)  
2
Thermal cycling with electrical  
monitoring of input and outputs  
IRSJ  
Acceptance Test Procedure  
10 cycles  
(Q-level)  
3
4
5
Electrical performance test in  
temperature (Q-level)  
IRSJ  
Acceptance Test Procedure  
Vibration Test Procedure  
Acceptance Test Procedure  
Random Vibration test in  
(Q-level)  
External  
test house  
Electrical performance test, room  
temperature incl. Limited EMC test  
(CE 50kHz-1MHz)  
IRSJ  
6
7
Mechanical Measurements  
Final Inspection  
IRSJ  
IRSJ  
Acceptance Test Procedure  
General inspection Procedure  
Test Plan - C  
The FM must pass the following tests:  
Location* Remarks  
Test No. Type of Test  
1
Electrical performance test, room IRSJ  
temperature incl. Limited EMC test  
Acceptance test procedure  
(CE 50kHz-1MHz)  
2
3
Electrical performance test in IRSJ  
temperature (A-levels)  
Acceptance test procedure  
Acceptance test procedure  
Electrical performance test, room IRSJ  
temperature incl. Limited EMC test  
(CE 50kHz-1MHz)  
4
Electrical performance test, room  
temperature  
IRSJ  
Acceptance Test Procedure  
5
6
Mechanical Measurements  
Final Inspection  
IRSJ  
IRSJ  
Acceptance test procedure  
General inspection procedure  
Note:  
Location* - IRD: IR’s Danish Design Center, Skovlunde, Denmark  
- IRSJ: IR’s Site in San Jose, California, USA  
www.irf.com  
7
ML1000605D  
(100V Input, Dual Output)  
Radiation Performance  
TID  
The TID radiation performance is guaranteed by worst case analysis with radiation degradation data for  
each radiation sensitive component used in the DC-DC converter. For TID radiation verification testing  
(RVT) for each wafer lot for all sensitive components is part of the EEE parts requirements per table below.  
TID RVT Plan Table  
Component Type  
JANS2N2222A  
RVT Plan (applicable to all flight lots)  
LDRS 0.01 to 0.1 rad up to 200 krad per IR RVT plan  
LDRS 0.01 to 0.1 rad up to 200 krad per IR RVT plan  
RVT by Manufacturer (HDR)  
JANS2N2907A  
JANSR2N7492T2  
IRHF57214SESCS  
IRHLUB770Z4SCS  
IRHLUB7970Z4SCS  
LM124AWR  
RVT by Manufacturer (HDR)  
RVT by Manufacturer (HDR)  
RVT by Manufacturer (HDR)  
RVT by Manufacturer (ELDRS)  
IS2-1009RH  
RVT by Manufacturer (HDR)  
LDRS 0.01 to 0.1 rad up to 100 krad per IR RVT plan  
UC1845A  
LDRS 0.01 to 0.1 rad/s up to 100kRad per IR RVT plan  
SEE  
The SEE radiation performance is guaranteed by a combination of derating and mitigation at circuit level.  
For mitigation at circuit level both theoretical analysis and testing with imposed SEE effects are performed.  
The applicable SEE and mitigation concept is presented in table below.  
The maximum output perturbation is 5% of the nominal output voltage during any SEE.  
Applicable SEE and Mitigation Methods Table  
Component Type  
Applicable SEE  
Mitigation Concept  
RH MOSFET  
SEGR  
Vds derating in combination with SEE SOA  
curves from manufacturer data sheet  
Op-Amp  
SET, 15us perturbation to rail  
SET, 10us perturbation to rail  
SET, 15us perturbation to rail  
Double Pulses  
Mitigation at circuit level (filtering)  
Mitigation at circuit level (filtering)  
Mitigation at circuit level (filtering)  
Voltage reference  
PWM  
Mitigation at circuit level (filtering, no  
saturation of magnetic parts)  
Missing Pulses  
Mitigation at circuit level (filtering, no  
saturation of magnetic parts)  
8
www.irf.com  
ML1000605D  
(100V Input, Dual Output)  
EEE Parts Technical Standard  
For component screening and DPA rules, refer to the generic ML-Series data sheet at www.irf.com.  
Random Vibration  
Axis  
Frequency Range (Hz)  
Level  
Duration (S)  
PSD Level (g  
)
rms  
20-100  
100-1600  
1600-2000  
+6 dB/oct  
0.5 SQR(g)/Hz  
-12 dB/oct  
X, Y, Z  
29.9  
180  
Fig 1- Block Diagram  
Primary  
Power  
Bus  
Rectifier  
&
Filter  
Int.Supply  
Rectifier &  
Filter  
Linear  
Regulator  
Input Filter  
V1: +6V 500mA  
Start-Up  
Resistor  
TC ON  
Fly-Back  
Trans-  
former  
Rectifier  
&
Filter  
Internal  
aux  
Latching  
Relay  
TC OFF  
on/off  
TM  
Output  
Sequencing  
UVP  
Monitor &  
Latch  
Fly-Back  
Power  
Switch  
Disable  
PWM  
Controller  
Rectifier  
&
Filter  
Negative  
Linear  
Regulator  
Current  
Shunt  
V2: -5V 100mA  
Grounding and Isolation Scheme  
Parameter  
Grounding & Isolation Performance  
Isolation:  
Primary to Secondary:  
> 10 MOhm // < 50nF  
Floating  
Telecommand:  
Status TM:  
Floating  
Grounding:  
Secondary return bound to chassis via multiple screw connections  
www.irf.com  
9
ML1000605D  
(100V Input, Dual Output)  
Interface Schematics  
Fig 2 - Power Input:  
J1  
R1  
L2  
PRIMARY POWER BUS  
PRIMARY POWER BUS  
3
L3  
11  
L1  
To Fly-back converter and  
Startup Circuit  
C1  
CR1  
PRIMARY POWER BUS RETURN  
PRIMARY POWER BUS RETURN  
1
9
R4  
C6  
C7  
C8  
C9  
Component  
Component Type  
Package  
Value  
Voltage (V)  
0.56µF  
C1  
C6  
C7  
C8  
C9  
CR1  
L1  
BR40 II  
CDR33BX  
CDR33BX  
CDR33BX  
CDR33BX  
1N5806US  
R6.3  
RADIAL  
SMD 1210  
SMD 1210  
SMD 1210  
SMD 1210  
A- MFLF  
TOROID  
TOROID  
TOROID  
RWR  
200  
100  
100  
100  
100  
150  
27nF  
27nF  
27nF  
27nF  
2.5A  
2 X109.8µH  
90µH  
L2  
HIGH FLUX  
HIGH FLUX  
RWR81S  
RM1206B  
30µH  
L3  
R1  
R4  
9.09ohms  
21.5ohms  
500  
100  
SMD 1206  
10  
www.irf.com  
ML1000605D  
(100V Input, Dual Output)  
Fig 3 - TM / TC Interface:  
J1  
TC On return  
13  
CR205  
CR206  
K1  
6
4
9
ON  
TC On  
5
R201  
R202  
CR201  
CR203  
CR202  
CR204  
From Input Filter  
OFF  
TC Off  
10  
7
CR207  
CR208  
R218  
R219  
14  
TC Off return  
Relay is shown ON  
R220  
8
Status TM  
R203  
CR213  
CR214  
R223  
15  
7
8
3
Status TM Return  
6
1
2
U101  
PWM  
VC  
C103  
From Primary  
AUX.  
VR101  
Component  
Component Type  
Package  
Value  
Voltage (V)  
CR201  
CR202  
CR203  
CR204  
CR205  
CR206  
CR207  
CR208  
CR213  
CR204  
C103  
1N6640US  
1N6640US  
1N6640US  
1N6640US  
1N6640US  
1N6640US  
1N6640US  
1N6640US  
1N6640US  
1N6640US  
CWR29  
D-5D  
D-5D  
0.3A  
0.3A  
0.3A  
0.3A  
0.3A  
0.3A  
0.3A  
0.3A  
0.3A  
0.3A  
33µF  
75  
75  
D-5D  
75  
D-5D  
75  
D-5D  
75  
D-5D  
75  
D-5D  
75  
D-5D  
75  
D-5D  
75  
D-5D  
75  
SMD H  
TO-5  
25  
K201  
J422-26M SHOC  
RM1206B  
26.5  
100  
100  
100  
100  
100  
100  
15  
R118  
SMD 1206  
SMD 1206  
SMD 1206  
SMD 1206  
SMD 1206  
SMD 1206  
DO-213AA  
21.5kohms  
21.5kohms  
21.5kohms  
21.5kohms  
215ohms  
R119  
RM1206B  
R120  
RM1206B  
R123  
RM1206B  
R201  
RM1206B  
R202  
RM1206B  
215ohms  
VR101  
1N4109UR-1  
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11  
ML1000605D  
(100V Input, Dual Output)  
EMI Performance  
Fig 4 - Typical Conducted Emission Performance at Power Input:  
Fig 5 - Typical Conducted Emission Performance at Output 1:  
12  
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ML1000605D  
(100V Input, Dual Output)  
Power Conversion Efficiency  
Fig 6 - Typical Power Conversion Efficiency Vs +6V Output Current Parametric  
with -5V Output Current  
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13  
ML1000605D  
(100V Input, Dual Output)  
Recommended Mounting Stud Design  
It is foreseen with a mounting stud design with circular mounting studs made out of aluminum with a  
diameter of 4.0mm and a treaded hole support mounting with M2 screws.  
5pcs M2 screws are used for mounting the board. Mounting torque shall be 30Ncm ± 5.0Ncm.  
14  
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ML1000605D  
(100V Input, Dual Output)  
Mechanical Interface  
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15  
ML1000605D  
(100V Input, Dual Output)  
Pin Designation Tables  
Input Terminals Assignment List  
Indent.: Input Terminals (Solder, Pins, Straight)  
Output Terminals Assignment List  
Indent.: Output Terminals (Solder Pads)  
Pin #  
Pin #  
Function  
Input Power Return  
Input Power Return  
Rerserved  
Rerserved  
Input Power  
Input Power  
Chasis (Ground)  
Voltage TM  
Chasis (Ground)  
TC On Return  
TC On  
TC Off Return  
TC Off  
Pin #  
Pin #  
Function  
1
1
3
5
7
2
4
6
8
V1 (Positive Output)  
Chasis (Ground)  
Chasis (Ground)  
V2 (Negative Output)  
9
2
3
4
5
6
7
8
10  
11  
12  
13  
14  
15  
TM Status Return  
TM Status  
Thermal Design Information  
The thermal design for the ML-Series is solely based on heat conduction through the mounting  
interfaces/mounting screws into the host equipment chassis.  
The maximum power loss during normal operation is 2.0W. The temperature profile for the board  
based on all screw mounting points kept at isothermal level is given below.  
16  
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ML1000605D  
(100V Input, Dual Output)  
Part Numbering  
ML 100 06 05 D /XXX  
Model  
ML-Series  
Quality Level  
EBB = Elegant Bread Board Model  
EQM = Engineering Qualification Model  
Blank = Fight Model  
Nominal Input  
Voltage  
100 = 100V  
Number of Outputs  
D = Dual Outputs  
Output 1  
06 = 6V  
Output 2  
05 = 5V  
Application Information  
Standard Documentation  
n Interface Control Drawing  
n User’s Manual  
n End Item Data Package with CoC, Applicable Configuration, MIP Photo and Test Results  
Design Justification Documentation  
The following documentation can be made available upon request:  
n Worst Case Analysis  
n Parts Stress Analysis  
n Thermal Analysis  
n Mechanical Analysis  
n FMECA  
n Reliability Assessment  
n Declared Components List  
n Declared Materials List  
n Declared Process List  
WORLDHEADQUARTERS:101N, SepulvedaBlvd., ElSegundo, California90245, USATel:(310)252-7105  
IRSANJOSE:2520JunctionAvenue, SanJose, California95134, USATel:(408)434-5000  
IR DENMARK: Literbuen10C, DK-2740 Skovlunde, Denmark, Tel: +45 4457 5010  
Visit us at www.irf.com for sales contact information.  
Data and specifications subject to change without notice. 04/2013  
www.irf.com  
17  

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