Q67000-A9407 [INFINEON]

5-V Low-Drop Voltage Regulator; 5 -V低压差稳压器
Q67000-A9407
型号: Q67000-A9407
厂家: Infineon    Infineon
描述:

5-V Low-Drop Voltage Regulator
5 -V低压差稳压器

稳压器
文件: 总18页 (文件大小:203K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
5-V Low-Drop Voltage Regulator  
TLE 4290  
Features  
• Output voltage 5 V 2%  
• Very low current consumption  
• 450 mA current capability  
• Power Good Feature  
• Very low-drop voltage  
P-TO252-5-1  
• Short-circuit-proof  
• Reverse polarity proof  
• Suitable for use in automotive electronics  
Type  
Ordering Code Package  
TLE 4290 D Q67006-A9408 P-TO252-5-1 (SMD)  
TLE 4290 G Q67006-A9405 P-TO263-5-1 (SMD)  
TLE 4290  
Q67000-A9407 P-TO220-5-11  
New type  
P-TO263-5-1  
Functional Description  
The TLE 4290 is a monolithic integrated low-drop  
voltage regulator which can supply loads up to 450 mA  
with power good feature. An input voltage up to 42 V is  
regulated to VQ,nom = 5.0 V. The device is designed to  
supply µ-controllers in the severe environment of  
automotive applications. Therefore it is protected  
against overload, short circuit and over temperature  
conditions. Of course the TLE 4290 can been used also  
in all other applications, where a stabilized 5 V voltage is  
required.  
P-TO220-5-11  
Data Sheet Rev. 1.4  
1
2001-10-18  
TLE 4290  
Power Good  
The Power Good PG pin informs e.g. the microcontroller in case the output voltage has  
fallen below the lower threshold VQ,pgt-d of typ. 3.65 V. Connecting the regulator to a  
battery voltage at first the power good signal remains LOW. When the output voltage has  
reached the higher threshold VQ,pgt-i the power good output remains still LOW for the  
power good delay time trd. Afterwards the power good output turns HIGH. The delay time  
can be set by the user with an external capacitor at pin D according to the requirements  
of the application.  
The Power Good circuitry supervises the output voltage. In case VQ falls below the lower  
Power Good switching threshold VQ,pgt-d the PG output is set LOW after the Power Good  
reaction time. The Power Good LOW signal is generated down to an output voltage VQ  
to 1 V. A LOW signal at the Power Good pin informs that the battery was lost and  
memory is no longer valid.  
The feature should be used in combination with a microcontroller with internal reset.  
TLE 4290  
1
5
I
Q
Band-  
Gap-  
Reference  
Current  
and  
Saturation  
Control  
2
PG  
Power  
Good  
Control  
4
AEB02823  
GND  
D
Figure 1  
Block Diagram  
Data Sheet Rev. 1.4  
2
2001-10-18  
TLE 4290  
P-TO252-5-1 (D-PAK)  
P-TO263-5-1 (SMD)  
P-TO220-5-11  
GND  
I
PG  
D Q  
AEP02825  
I
PG GND  
D
Q
AEP02827  
I
GND  
Q
PG  
D
AEP02826  
Figure 2  
Pin Configuration (top view)  
Pin Definitions and Functions  
Pin No. Symbol Function  
1
2
I
Input; block to ground directly at the IC with a ceramic capacitor.  
PG  
Power Good; open collector output. Add a pull up resistor of > 5 kΩ  
to pin Q.  
3
4
GND  
D
Ground; Pin 3 internally connected to heatsink.  
Delay; connect a capacitor to GND for setting power good delay  
time.  
5
Q
Output; block to ground with a capacitor, C 22 µF  
ESR < 5 at 10 kHz.  
Data Sheet Rev. 1.4  
3
2001-10-18  
TLE 4290  
Absolute Maximum Ratings  
Parameter  
Symbol  
Limit Values  
Unit Test Condition  
min.  
max.  
Input I  
Voltage  
Current  
VI  
II  
42  
45  
V
Internally limited  
Output Q  
Voltage  
Current  
VQ  
IQ  
1.0  
16  
V
Internally limited  
Power Good Output PG  
Voltage  
Current  
VPG  
IPG  
0.3  
5  
25  
5
V
mA  
Delay D  
Voltage  
Current  
VD  
ID  
0.3  
2  
7
2
V
mA  
Temperature  
Junction temperature  
Storage temperature  
Tj  
40  
50  
150  
150  
°C  
°C  
Tstg  
Note: Stresses above those listed here may cause permanent damage to the device.  
Exposure to absolute maximum rating conditions for extended periods may affect  
device reliability.  
Data Sheet Rev. 1.4  
4
2001-10-18  
TLE 4290  
Operating Range  
Parameter  
Symbol  
Limit Values  
Unit Remarks  
min.  
max.  
42  
Input voltage  
VI  
Tj  
5.5  
V
Junction temperature  
40  
150  
°C  
Thermal Resistance  
Junction case  
Rthj-c  
Rthj-a  
Rthj-a  
Rthj-a  
4
K/W –  
Junction ambient  
Junction ambient  
53  
78  
65  
K/W TO2631)  
K/W TO2521)  
K/W TO220  
Junction ambient  
1)  
Worst case, regarding peak temperature; zero airflow; mounted on a PCB FR4, 80 × 80 × 1.5 mm3, heat sink  
area 300 mm2  
Note: In the operating range, the functions given in the circuit description are fulfilled.  
Data Sheet Rev. 1.4  
5
2001-10-18  
TLE 4290  
Characteristics  
VI = 13.5 V; 40 °C < Tj < 150 °C (unless otherwise specified)  
Parameter  
Symbol  
Limit Values  
Unit Measuring  
Condition  
min. typ. max.  
Output  
Output voltage  
VQ  
VQ  
4.9  
4.9  
5.0  
5.0  
5.1  
5.1  
5 mA < IQ < 400 mA;  
6 V < VI < 28 V  
V
Output voltage  
5 mA < IQ < 200 mA;  
6 V < VI < 40 V  
V
1)  
Output current limitation  
IQ  
Iq  
450 700  
mA  
Current consumption;  
Iq = II IQ  
200 230 µA  
IQ = 1 mA;  
Tj = 25 °C  
Current consumption;  
Iq = II IQ  
Iq  
200 255 µA  
IQ = 1 mA;  
Tj 85 °C  
Current consumption;  
Iq = II IQ  
Iq  
5
12  
25  
mA  
mA  
IQ = 250 mA  
IQ = 400 mA  
IQ = 300 mA  
Current consumption;  
Iq = II IQ  
Iq  
12  
Drop voltage  
Vdr  
250 500 mV  
1)  
Vdr = VI VQ  
Load regulation  
Line regulation  
30 15  
15 5  
30  
15  
mV  
mV  
dB  
VI = 6 V;  
IQ = 5 mA to 400 mA  
VQ, lo  
VQ, li  
PSRR  
Vl = 8 V to 32 V;  
IQ = 5 mA  
Power supply ripple  
rejection  
60  
0.5  
fr = 100 Hz;  
Vr = 0.5 Vpp  
dVQ  
----------  
dT  
Temperature output  
voltage drift  
mV/K –  
Output Capacitor  
CQ  
22  
µF  
ESR < 5 in the  
operation range  
Power Good Output PG and Delay Timing D  
Power Good switching  
threshold  
VQ,pgt-i  
4.45 4.65 4.80 V  
VQ increasing  
Data Sheet Rev. 1.4  
6
2001-10-18  
TLE 4290  
Characteristics (contd)  
VI = 13.5 V; 40 °C < Tj < 150 °C (unless otherwise specified)  
Parameter  
Symbol  
Limit Values  
Unit Measuring  
Condition  
min. typ. max.  
Power Good switching  
threshold  
VQ,pgt-d 3.50 3.65 3.80 V  
VQ decreasing  
Power Good output low  
voltage  
VPGL  
IPGH  
ID,c  
0.2  
0
0.4  
2
V
RPG 5 k;  
VQ > 1 V  
Power Good output  
leakage current  
µA  
µA  
V
VPG > 4.5 V  
Power Good charging  
current  
3
6
9
VD = 1 V  
Upper timing threshold  
Lower timing threshold  
Power Good delay time  
VDU  
VDL  
trd  
1.5  
1.8  
2.2  
0.60 0.85 1.10 V  
10  
16  
22  
ms  
CD = 47 nF  
CD = 47 nF  
Power Good reaction time trr  
0.2  
0.5  
2.0  
µs  
1)  
Measured when the output voltage VQ has dropped 100 mV from the nominal value obtained at VI = 13.5 V.  
Note: The listed characteristics are ensured over the operating range of the integrated  
circuit. Typical characteristics specify mean values expected over the production  
spread. If not otherwise specified, typical characteristics apply at Ta = 25 °C and  
the given supply voltage.  
II  
IQ  
I
Q
VI  
1
4
5
2
CI1  
CI2  
100 nF  
CQ  
22 µF  
1000 µF  
RPG  
5 k  
TLE 4290  
VQ  
ID  
D
PG  
ID,C  
VPG  
CD  
47 nF  
GND  
IGND  
AES02824  
Figure 3  
Test Circuit  
Data Sheet Rev. 1.4  
7
2001-10-18  
TLE 4290  
Application Information  
CQ2  
CQ1  
TLE 4290  
µ-Controller  
22 100  
VBAT  
µF  
nF  
1
5 Q  
I
VCC  
CI1  
CI2  
Band-  
Gap-  
Current  
and  
Reference  
Saturation  
Control  
Internal  
Reset  
RPG  
5 k  
2
NMI /  
PORT  
Power  
Good  
PG  
Control  
4
GND  
D
CD  
47 nF  
AES02822  
Figure 4  
Application Diagram  
Input, Output  
An input capacitor is necessary for damping line influences. A resistor of approx. 1 in  
series with CI, can damp the LC of the input inductivity and the input capacitor.  
The TLE 4290 requires an output capacitor of at least 22 µF with an ESR below 5 for  
stability.  
Power Good  
The Power Good pin informs e.g. the micro-controller in case the output voltage has  
fallen below a threshold of typ. 3.65 V. When the battery voltage is supplied the Power  
Good signal indicates a loss of memory due to missing power. After the Memory Good  
switching threshold is reached the Power Good output remains low for the Power Good  
delay time. This time can be set by the user with an external capacitor at pin D according  
to the requirements of the application, e.g. the time until the microcontroller is initialized  
and ready to receive any information.  
Data Sheet Rev. 1.4  
8
2001-10-18  
TLE 4290  
The power good circuit supervises the output voltage. In case VQ falls below the Power  
Good switching threshold the Power Good output PG is set LOW after the power good  
reaction time. The power good LOW signal is generated down to an output voltage VQ  
to 1 V. A LOW signal at the power good pin informs that the battery was lost and memory  
is no longer valid.  
The feature should only be used in combination to a microcontroller with internal reset.  
For the power good delay time after the output voltage of the regulator is above the reset  
threshold, the reset signal is set High again. The reset delay time is defined by the reset  
delay capacitor CD at pin D.  
The Power Good delay time is defined by the charging time of an external delay  
capacitor CD.  
CD= (trd × ID,c) / V  
With  
CD  
trd  
V  
Power Good delay capacitor  
Power Good delay time  
= VDU, typical 1.8 V  
ID,c Charge current typical 6 µA  
VΙ  
< trr  
VQ  
VQ,pgt_i  
VQ,pgt_d  
dV  
ΙD, c  
CD  
=
dt  
VD  
VDU  
VDL  
trd  
trr  
VPG  
Power-on  
Power Good  
Signal  
Thermal  
Shutdown  
Voltage Dip  
at Input  
Undervoltage  
Secondary  
Spike  
Overload  
at Output  
AED03074  
Figure 5  
Power Good Timing  
Data Sheet Rev. 1.4  
9
2001-10-18  
TLE 4290  
The power good reaction time trr is the time it takes the voltage regulator to set power  
good output PG LOW after the output voltage has dropped below the power good  
switching threshold. It is typically 0.5 µs for delay capacitor of 47 nF. For other values for  
CD the reaction time can be estimated using the following equation:  
trr = 10 ns/nF × CD  
The Power Good output is an open collector output. It requires externally a pull up  
resistor of at least 5 kto Q.  
Typical Performance Characteristics  
Output Voltage VQ versus  
Temperature Tj  
Output Voltage VQ versus  
Input Voltage VI  
AED01929  
AED03033  
12  
V
5.2  
V
VQ  
V
Q
10  
5.1  
VI = 13.5 V  
8
5.0  
4.9  
4.8  
4.7  
4.6  
6
R
= 25  
L
4
2
0
-40  
0
40  
80  
120 ˚C 160  
0
2
4
6
8
10  
V
Tj  
V
Ι
Data Sheet Rev. 1.4  
10  
2001-10-18  
TLE 4290  
Output Current IQ versus  
Temperature Tj  
Output Current IQ versus  
Input Voltage VI  
AED03046  
AED03034  
1.2  
1200  
mA  
IQ  
A
IQ  
1.0  
1000  
800  
600  
400  
200  
0
0.8  
0.6  
0.4  
0.2  
0
T
j = 125 ˚C  
25 ˚C  
-40  
0
40  
80  
120 ˚C 160  
0
10  
20  
30  
40 V 50  
Tj  
VI  
Current Consumption Iq  
versus Output Current IQ; Tj = 25 °C  
Current Consumption Iq  
versus Output Current IQ  
AED03112  
AED03035  
2.4  
80  
mA  
mA  
Ι q  
Ι q  
70  
60  
50  
40  
2.0  
1.6  
1.2  
VΙ = 13.5 V  
30  
0.8  
VΙ = 13.5 V  
20  
10  
0
0.4  
0
0
20  
40  
60  
80  
120  
mA  
0
100  
200  
300  
400  
600  
mA  
Ι Q  
Ι Q  
Data Sheet Rev. 1.4  
11  
2001-10-18  
TLE 4290  
Drop Voltage Vdr versus  
Output Current IQ  
Charge Current ID,c  
versus Temperature Tj  
AED01935  
AED03036  
800  
8
mV  
µA  
Vdr  
ID, c  
700  
600  
500  
7
6
5
T
j = 125 ˚C  
25 ˚C  
VI = 13.5 V  
D = 1 V  
400  
300  
200  
100  
0
4
3
2
1
0
V
mA  
0
200  
400  
600  
1000  
-40  
0
40  
80  
120 ˚C 160  
IQ  
Tj  
Upper Timing Threshold VDU  
versus Temperature Tj  
AED03037  
4.0  
mA  
VDU  
3.5  
3.0  
2.5  
VΙ = 13.5 V  
2.0  
1.5  
1.0  
0.5  
0
-40  
0
40  
80  
120  
160  
˚C  
Tj  
Data Sheet Rev. 1.4  
12  
2001-10-18  
TLE 4290  
Package Outlines  
P-TO252-5-1 (D-PAK)  
(Plastic Transistor Single Outline)  
+0.05  
-0.10  
+0.15  
2.3  
6.5  
-0.10  
+0.08  
-0.04  
B
0.1  
5.4  
0.9  
A
0.1  
1
0...0.15  
0.15 max  
per side  
+0.08  
-0.04  
0.5  
0.1  
5x0.6  
1.14  
0.1  
4.56  
M
0.25  
A B  
GPT09161  
All metal surfaces tin plated, except area of cut.  
Sorts of Packing  
Package outlines for tubes, trays etc. are contained in our  
Data Book Package Information”  
Dimensions in mm  
2001-10-18  
SMD = Surface Mounted Device  
Data Sheet Rev. 1.4  
13  
TLE 4290  
P-TO263-5-1-1 (SMD)  
(Plastic Transistor Single Outline)  
0.2  
10  
4.4  
0.15  
9.8  
0.1  
1.27  
B
A
8.5 1)  
0.1  
0.05  
2.4  
0...0.15  
5x0.8 0.1  
0.5  
0.1  
4x1.7  
8
˚
max.  
M
0.25  
A B  
0.1  
1)  
Typical  
All metal surfaces tin plated, except area of cut.  
Sorts of Packing  
Package outlines for tubes, trays etc. are contained in our  
Data Book Package Information”  
Dimensions in mm  
2001-10-18  
SMD = Surface Mounted Device  
Data Sheet Rev. 1.4  
14  
TLE 4290  
P-TO220-5-11  
(Plastic Transistor Single Outline)  
0.2  
10  
A
0.15  
9.8  
8.51)  
4.4  
3.7-0.15  
1.27 0.1  
0.05  
C
0.5 0.1  
3.9 0.4  
0...0.15  
2.4  
0.8 0.1  
1.7  
M
0.25  
A C  
8.4 0.4  
1)  
Typical  
All metal surfaces tin plated, except area of cut.  
gpt09064_ma  
Sorts of Packing  
Package outlines for tubes, trays etc. are contained in our  
Data Book Package Information”  
Dimensions in mm  
2001-10-18  
Data Sheet Rev. 1.4  
15  
TLE 4290  
Data Sheet Rev. 1.4  
16  
2001-10-18  
TLE 4290  
Data Sheet Rev. 1.4  
17  
2001-10-18  
TLE 4290  
Edition 2001-10-18  
Published by Infineon Technologies AG,  
St.-Martin-Strasse 53,  
D-81541 München, Germany  
© Infineon Technologies AG 2001.  
All Rights Reserved.  
Attention please!  
The information herein is given to describe  
certain components and shall not be consid-  
ered as warranted characteristics.  
Terms of delivery and rights to technical  
change reserved.  
We hereby disclaim any and all warranties,  
including but not limited to warranties of  
non-infringement, regarding circuits, descrip-  
tions and charts stated herein.  
Infineon Technologies is an approved CECC  
manufacturer.  
Information  
For further information on technology, deliv-  
ery terms and conditions and prices please  
contact your nearest Infineon Technologies  
Office in Germany or our Infineon Technolo-  
gies Representatives worldwide (see ad-  
dress list).  
Warnings  
Due to technical requirements components  
may contain dangerous substances. For in-  
formation on the types in question please  
contact your nearest Infineon Technologies  
Office.  
Infineon Technologies Components may only  
be used in life-support devices or systems  
with the express written approval of Infineon  
Technologies, if a failure of such components  
can reasonably be expected to cause the fail-  
ure of that life-support device or system, or to  
affect the safety or effectiveness of that de-  
vice or system. Life support devices or sys-  
tems are intended to be implanted in the hu-  
man body, or to support and/or maintain and  
sustain and/or protect human life. If they fail, it  
is reasonable to assume that the health of the  
user or other persons may be endangered.  
Data Sheet Rev. 1.4  
18  
2001-10-18  

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