Q68000-A6887 [INFINEON]

GaAs MMIC (Two-stage monolithic microwave IC MMIC amplifier All-gold metallization Chip fully passivated); 砷化镓MMIC (两级单片微波集成电路MMIC放大器全镀金芯片完全钝化)
Q68000-A6887
型号: Q68000-A6887
厂家: Infineon    Infineon
描述:

GaAs MMIC (Two-stage monolithic microwave IC MMIC amplifier All-gold metallization Chip fully passivated)
砷化镓MMIC (两级单片微波集成电路MMIC放大器全镀金芯片完全钝化)

放大器 微波
文件: 总9页 (文件大小:141K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
GaAs MMIC  
CGY 31  
Two-stage monolithic microwave IC (MMIC amplifier)  
All-gold metallization  
Chip fully passivated  
Operating voltage range: 3 to 6 V  
50 input/output; RLIN RLOUT > 10 dB  
Gain: 18 dB at 1.6 GHz  
Low noise figure: 4 dB at 1.6 GHz  
3 dB bandwidth: 2 GHz  
Hermetically sealed package  
ESD: Electrostatic discharge sensitive device, observe handling precautions!  
Package1)  
Type  
Ordering Code Circuit Diagram (Pin Configuration)  
CGY 31 Q68000-A6887  
TO-12  
1 RF output, V  
S
2 Interstage, V  
S
3 RF input  
4 RF and DC  
ground, case  
1)  
For detailed information see chapter Package Outlines.  
Semiconductor Group  
1
CGY 31  
Maximum Ratings  
Parameter  
Symbol  
Values  
Unit  
V
Supply voltage, TC 80 ˚C  
Total power dissipation, TC 50 ˚C  
Channel temperature  
V
S
6
Ptot  
2
W
T
ch  
150  
˚C  
Storage temperature range  
Tstg  
– 55 … + 150  
Thermal Resistance  
Channel - case  
R
thchC  
50  
K/W  
Note: Exceeding any of the maximum ratings may cause permanent damage to the device.  
Appropriate handling procedures are required to protect the electrostatic sensitive IC  
against degradation due to excess voltage or excess current spikes. Excellent ground  
connection of lead 4 and the package (e. g. soldered on microstripline laminate) is  
required to achieve guaranteed RF performance and stable operation conditions and  
provides adequate heat sink. Low parasitic capacitance of the bias network to port 2  
gives optimum gain and flatness. Input and output connections must be DC isolated by  
coupling capacitors.  
Semiconductor Group  
2
CGY 31  
Electrical Characteristics  
at T = 25 ˚C, V = 4.5 V, R  
A
S
S
= R = 50 , unless otherwise specified,  
L
(for application circuit see next page).  
Parameter  
Symbol  
Values  
typ.  
160  
Unit  
min.  
max.  
200  
Operating current  
Iop  
mA  
dB  
Power gain  
G
15  
18  
f= 800 MHz to 1800 MHz  
Gain flatness  
f= 800 MHz to 1800 MHz  
G  
F
2.0  
4.0  
13  
2.5  
5.0  
9.5  
9.5  
Noise figure  
f= 800 MHz to 1800 MHz  
Input return loss  
f= 800 MHz to 1800 MHz  
RLIN  
RLOUT  
Output return loss  
f= 800 MHz to 1800 MHz  
12  
Third order intercept point  
IP3  
31  
32.5  
dBm  
two-tone intermodulation test  
f1  
= 806 MHz, f2= 810 MHz,  
Po  
= 10 dBm (both carriers)  
1 dB gain compression  
P1dB  
19  
f= 800 MHz to 1800 MHz  
Semiconductor Group  
3
CGY 31  
Application Circuit  
f= 800 MHz to 1800 MHz  
Legend of components  
C1, C2, C  
3
: 100 pF  
: 1 nF  
Chip capacitors  
R1  
39 Ω  
Resistor, e.g. l = 4 mm; 1.8 mm with axial leads  
L1  
70 nH  
Inductance, e.g. 8 turns, 0.25 mm enamelled copper wire  
wound on R. The geometrical combination of L and R  
1
influences the frequency response.  
L
2
40 nH  
6 V 2  
Inductance, e.g. 5 turns, 0.25 enamelled copper wire  
wound on M3-nylon rod.  
D
Zener diode, 1.3 W (type BZW 22 C 6 V 2).  
Note: For lower frequencies (f = 100 … 900 MHz) the performance of CGY 31 is comparable  
to that of CGY 21, if an interstage circuit with L = 1 µH is connected.  
1
Semiconductor Group  
4
CGY 31  
Total power dissipation Ptot = f (T  
C
)
Max. supply voltage VSmax = f (T )  
C
Operating current Iop = f (V )  
S
Semiconductor Group  
5
CGY 31  
Power gain G = f (f)  
= 4.5 V, R = R = 50 Ω  
Power gain G = f (V  
S
)
V
S
S
L
RS  
= R = 50 Ω  
L
Power output G = f (Pout  
= 4.5 V, R = R = 50 Ω  
f= 0.8 GHz  
)
V
S
S
L
Semiconductor Group  
6
CGY 31  
Third order intercept point IP  
f= 0.8 GHz, R = R = 50 Ω  
3
= f (V )  
S
S
L
The intermodulation ratio dIM can easily be  
determined.  
P  
d
IM = 2 (IP  
3
0
)
IP  
d
3
= Intercept point  
IM = Intermodulation ratio  
= Power level of each carrier in dBm  
P
0
Noise figure F = f (f)  
= 4.5 V, R = R = 50 Ω  
Noise figure F = f (V  
S
)
V
S
S
L
RS  
= R = 50 Ω  
L
Semiconductor Group  
7
CGY 31  
S Parameters  
f
S11  
S21  
S12  
S22  
GHz  
MAG  
ANG  
MAG  
ANG  
MAG  
ANG  
MAG  
ANG  
VS  
= 4.5 V, Z  
0
= 50 Ω  
0.1  
0.3  
0.5  
0.7  
0.9  
1.1  
1.3  
1.5  
1.7  
1.9  
2.1  
2.3  
2.5  
2.7  
2.9  
3.1  
0.42  
0.28  
0.26  
0.25  
0.24  
0.24  
0.23  
0.22  
0.19  
0.16  
0.12  
0.06  
0.02  
0.06  
0.11  
0.15  
– 35  
– 42  
– 51  
– 64  
– 72  
– 76  
– 78  
– 77  
– 73  
– 71  
– 66  
– 56  
– 8  
107  
31  
21  
21  
22  
28  
27  
29  
30  
29  
32  
33  
35  
36  
36  
41  
40  
23  
0.007  
0.008  
0.008  
0.009  
0.009  
0.010  
0.010  
0.011  
0.011  
0.011  
0.012  
0.011  
0.012  
0.012  
0.012  
0.014  
0.25  
0.21  
0.21  
0.22  
0.23  
0.24  
0.25  
0.27  
0.30  
0.33  
0.35  
0.36  
0.36  
0.35  
0.34  
0.33  
7.77  
8.93  
9.04  
9.16  
9.15  
8.99  
8.62  
8.15  
7.52  
6.80  
6.06  
5.45  
4.81  
4.15  
3.43  
2.68  
– 19  
– 20  
– 23  
– 30  
– 34  
– 36  
– 35  
– 31  
– 26  
– 22  
– 17  
– 13  
– 11  
– 10  
– 13  
– 20  
– 12  
– 34  
– 52  
– 71  
– 90  
– 109  
– 127  
– 145  
– 162  
– 179  
165  
150  
135  
121  
110  
108  
111  
S11 = f (f)  
S12 = f (f)  
V
S
= 4.5 V, Z  
0
= 50 Ω  
V
S
= 4.5 V, Z  
0
= 50 Ω  
Semiconductor Group  
8
CGY 31  
S Parameters (continued)  
S21 = f (f)  
S22 = f (f)  
V
S
= 4.5 V, Z  
0
= 50 Ω  
V
S
= 4.5 V, Z = 50 Ω  
0
Semiconductor Group  
9

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