SAK-TC1767-256F133HL [INFINEON]
32-Bit Single-Chip Microcontroller; 32位单芯片微控制器
| 型号： | SAK-TC1767-256F133HL |
| 厂家： | 
Infineon |
| 描述： | 32-Bit Single-Chip Microcontroller |
| 文件： | 总126页 (文件大小：832K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
32-Bit
TC1767
32-Bit Single-Chip Microcontroller
Data Sheet
V1.3 2009-09
Microcontrollers
Edition 2009-09
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2009 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
32-Bit
TC1767
32-Bit Single-Chip Microcontroller
Data Sheet
V1.3 2009-09
Microcontrollers
TC1767
TC1767 Data Sheet
Revision History: V1.3, 2009-09
Previous Version: V1.2
Page
Subjects (major changes since last revision)
98
IDD at 80MHz for Infineon Power Loop and text for test condition are
updated.
104
118
Footnotes for application reset boot time, tB are enhanced.
The method used for the specified thermal resistance values is
included.
Trademarks
TriCore® is a trademark of Infineon Technologies AG.
We Listen to Your Comments
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Please send your proposal (including a reference to this document) to:
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Data Sheet
V1.3, 2009-09
TC1767
Table of Contents
Table of Contents
1
Summary of Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2
2.1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
About this Document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Related Documentations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Text Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Reserved, Undefined, and Unimplemented Terminology . . . . . . . . . . . . 9
Register Access Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Abbreviations and Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
System Architecture of the TC1767 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
TC1767 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
System Features of the TC1767 device . . . . . . . . . . . . . . . . . . . . . . . . 15
On Chip CPU Cores . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
High-performance 32-bit CPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
High-performance 32-bit Peripheral Control Processor . . . . . . . . . . . 17
On Chip System Units . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Flexible Interrupt System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Direct Memory Access Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
System Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
System Control Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Clock Generation Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Features of the Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Reset Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
External Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Die Temperature Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
General Purpose I/O Ports and Peripheral I/O Lines . . . . . . . . . . . . . . . 22
Program Memory Unit (PMU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Boot ROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Overlay RAM and Data Acquisition . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Emulation Memory Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Tuning Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Program and Data Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Data Access Overlay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
TC1767 Development Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
On-Chip Peripheral Units . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Asynchronous/Synchronous Serial Interfaces . . . . . . . . . . . . . . . . . . . . 29
High-Speed Synchronous Serial Interfaces . . . . . . . . . . . . . . . . . . . . . . 31
Micro Second Channel Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
MultiCAN Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Micro Link Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
General Purpose Timer Array (GPTA) . . . . . . . . . . . . . . . . . . . . . . . . . . 41
2.1.1
2.1.2
2.1.3
2.1.4
2.1.5
2.2
2.2.1
2.2.2
2.2.3
2.2.3.1
2.2.3.2
2.3
2.3.1
2.3.2
2.3.3
2.3.4
2.3.4.1
2.3.4.2
2.3.4.3
2.3.4.4
2.3.4.5
2.3.5
2.3.6
2.3.6.1
2.3.6.2
2.3.6.3
2.3.6.4
2.3.6.5
2.3.7
2.3.8
2.4
2.4.1
2.4.2
2.4.3
2.4.4
2.4.5
2.4.6
Data Sheet
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V1.3, 2009-09
TC1767
Table of Contents
2.4.6.1
2.4.7
2.4.7.1
2.4.7.2
2.5
2.5.1
2.5.2
2.5.3
2.5.4
2.5.5
2.5.6
Functionality of GPTA0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Analog-to-Digital Converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
ADC Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
FADC Short Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
On-Chip Debug Support (OCDS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
On-Chip Debug Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Real Time Trace . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Calibration Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Tool Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Self-Test Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
FAR Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
3
3.1
3.1.1
3.1.2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
TC1767 Pin Definition and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
TC1767 Pin Configuration: PG-LQFP-176-5 . . . . . . . . . . . . . . . . . . . . . 53
Reset Behavior of the Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
4
Identification Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
5
5.1
Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Parameter Interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Pad Driver and Pad Classes Summary . . . . . . . . . . . . . . . . . . . . . . . . . 79
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Input/Output Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Analog to Digital Converters (ADC0/ADC1) . . . . . . . . . . . . . . . . . . . . . 88
Fast Analog to Digital Converter (FADC) . . . . . . . . . . . . . . . . . . . . . . . . 93
Oscillator Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Temperature Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Power Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
Testing Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
Output Rise/Fall Times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Power Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Power, Pad and Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
Phase Locked Loop (PLL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
JTAG Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
DAP Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
Peripheral Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
Micro Link Interface (MLI) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 113
Micro Second Channel (MSC) Interface Timing . . . . . . . . . . . . . . . 115
SSC Master / Slave Mode Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 116
5.1.1
5.1.2
5.1.3
5.1.4
5.2
5.2.1
5.2.2
5.2.3
5.2.4
5.2.5
5.2.6
5.3
5.3.1
5.3.2
5.3.3
5.3.4
5.3.5
5.3.6
5.3.7
5.3.8
5.3.8.1
5.3.8.2
5.3.8.3
Data Sheet
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V1.3, 2009-09
TC1767
Table of Contents
5.4
Package and Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
Flash Memory Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
Quality Declarations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
5.4.1
5.4.2
5.4.3
5.4.4
Data Sheet
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V1.3, 2009-09
TC1767
Summary of Features
1
Summary of Features
• High-performance 32-bit super-scalar TriCore V1.3.1 CPU with 4-stage pipeline
– Superior real-time performance
– Strong bit handling
– Fully integrated DSP capabilities
– Single precision Floating Point Unit (FPU)
– 133 MHz operation at full temperature range
• 32-bit Peripheral Control Processor with single cycle instruction (PCP2)
– 8 Kbyte Parameter Memory (PRAM)
– 16 Kbyte Code Memory (CMEM)
– 133 MHz operation at full temperature range
• Multiple on-chip memories
– 72 Kbyte Data Memory (LDRAM)
– 24 Kbyte Code Scratchpad Memory (SPRAM)
– 2 Mbyte Program Flash Memory (PFlash)
– 64 Kbyte Data Flash Memory (DFlash, represents 16 Kbyte EEPROM)
– Instruction Cache: up to 8 Kbyte (ICACHE, configurable)
– Data Cache: up to 4 Kbyte (DCACHE, configurable)
– 8 Kbyte Overlay Memory (OVRAM)
– 16 Kbyte BootROM (BROM)
• 8-Channel DMA Controller
• Sophisticated interrupt system with 2 × 255 hardware priority arbitration levels
serviced by CPU or PCP2
• High performing on-chip bus structure
– 64-bit Local Memory Buses between CPU, Flash and Data Memory
– 32-bit System Peripheral Bus (SPB) for on-chip peripheral and functional units
– One bus bridge (LFI Bridge)
• Versatile On-chip Peripheral Units
– Two Asynchronous/Synchronous Serial Channels (ASC) with baud rate generator,
parity, framing and overrun error detection
– Two High-Speed Synchronous Serial Channels (SSC) with programmable data
length and shift direction
– One serial Micro Second Bus interface (MSC) for serial port expansion to external
power devices
– One High-Speed Micro Link interface (MLI) for serial inter-processor
communication
– One MultiCAN Module with 2 CAN nodes and 64 free assignable message objects
for high efficiency data handling via FIFO buffering and gateway data transfer
– One General Purpose Timer Array Modules (GPTA) with additional Local Timer
Cell Array (LTCA2) providing a powerful set of digital signal filtering and timer
functionality to realize autonomous and complex Input/Output management
• 32 analog input lines for ADC
Data Sheet
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V1.3, 2009-09
TC1767
Summary of Features
– 2 independent kernels (ADC0, ADC1)
– Analog supply voltage range from 3.3 V to 5 V (single supply)
– Performance for 12 bit resolution (@fADCI = 10 MHz)
• 4 different FADC input channels
• Extreme fast conversion, 21 cycles of fFADC clock (262.5 ns @ fFADC = 80 MHz)
– 10-bit A/D conversion (higher resolution can be achieved by averaging of
consecutive conversions in digital data reduction filter)
• 88 digital general purpose I/O lines (GPIO), 4 input lines
• Digital I/O ports with 3.3 V capability
• On-chip debug support for OCDS Level 1 (CPU, PCP, DMA, On Chip Bus)
• Dedicated Emulation Device chip available (TC1767ED)
– multi-core debugging, real time tracing, and calibration
– four/five wire JTAG (IEEE 1149.1) or two wire DAP (Device Access Port) interface
• Power Management System
• Clock Generation Unit with PLL
• Core supply voltage of 1.5 V
• I/O voltage of 3.3 V
• Full automotive temperature range: -40° to +125°C
• Package variant: PG-LQFP-176-5
Data Sheet
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V1.3, 2009-09
TC1767
Summary of Features
Ordering Information
The ordering code for Infineon microcontrollers provides an exact reference to the
required product. This ordering code identifies:
• The derivative itself, i.e. its function set, the temperature range, and the supply
voltage
• The package and the type of delivery.
For the available ordering codes for the TC1767 please refer to the “Product Catalog
Microcontrollers”, which summarizes all available microcontroller variants.
This document describes the derivatives of the device.The Table 1 enumerates these
derivatives and summarizes the differences.
Table 1
TC1767 Derivative Synopsis
Derivative
Ambient Temperature Range
TA = -40oC to +125oC
TA = -40oC to +125oC
CPU frequency
133 MHz
SAK-TC1767-256F133HL
SAK-TC1767-256F80HL
80 MHz
Data Sheet
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V1.3, 2009-09
TC1767
Introduction
2
Introduction
This Data Sheet describes the Infineon TC1767, a 32-bit microcontroller DSP, based on
the Infineon TriCore Architecture.
2.1
About this Document
This document is designed to be read primarily by design engineers and software
engineers who need a detailed description of the interactions of the TC1767 functional
units, registers, instructions, and exceptions.
This TC1767 Data Sheet describes the features of the TC1767 with respect to the
TriCore Architecture. Where the TC1767 directly implements TriCore architectural
functions, this manual simply refers to those functions as features of the TC1767. In all
cases where this manual describes a TC1767 feature without referring to the TriCore
Architecture, this means that the TC1767 is a direct implementation of the TriCore
Architecture.
Where the TC1767 implements a subset of TriCore architectural features, this manual
describes the TC1767 implementation, and then describes how it differs from the TriCore
Architecture. Such differences between the TC1767 and the TriCore Architecture are
documented in the section covering each such subject.
2.1.1
Related Documentations
A complete description of the TriCore architecture is found in the document entitled
“TriCore Architecture Manual”. The architecture of the TC1767 is described separately
this way because of the configurable nature of the TriCore specification: Different
versions of the architecture may contain a different mix of systems components. The
TriCore architecture, however, remains constant across all derivative designs in order to
preserve compatibility.
This Data Sheets together with the “TriCore Architecture Manual” are required to
understand the complete TC1767 micro controller functionality.
2.1.2
Text Conventions
This document uses the following text conventions for named components of the
TC1767:
• Functional units of the TC1767 are given in plain UPPER CASE. For example: “The
SSC supports full-duplex and half-duplex synchronous communication”.
• Pins using negative logic are indicated by an overline. For example: “The external
reset pin, ESR0, has a dual function.”.
• Bit fields and bits in registers are in general referenced as
“Module_Register name.Bit field” or “Module_Register name.Bit”. For example: “The
Current CPU Priority Number bit field CPU_ICR.CCPN is cleared”. Most of the
Data Sheet
7
V1.3, 2009-09
TC1767
Introduction
register names contain a module name prefix, separated by an underscore character
“_” from the actual register name (for example, “ASC0_CON”, where “ASC0” is the
module name prefix, and “CON” is the kernel register name). In chapters describing
the kernels of the peripheral modules, the registers are mainly referenced with their
kernel register names. The peripheral module implementation sections mainly refer
to the actual register names with module prefixes.
• Variables used to describe sets of processing units or registers appear in mixed
upper and lower cases. For example, register name “MSGCFGn” refers to multiple
“MSGCFG” registers with variable n. The bounds of the variables are always given
where the register expression is first used (for example, “n = 0-31”), and are repeated
as needed in the rest of the text.
• The default radix is decimal. Hexadecimal constants are suffixed with a subscript
letter “H”, as in 100H. Binary constants are suffixed with a subscript letter “B”, as in:
111B.
• When the extent of register fields, groups register bits, or groups of pins are
collectively named in the body of the document, they are represented as
“NAME[A:B]”, which defines a range for the named group from B to A. Individual bits,
signals, or pins are given as “NAME[C]” where the range of the variable C is given in
the text. For example: CFG[2:0] and SRPN[0].
• Units are abbreviated as follows:
– MHz = Megahertz
– µs = Microseconds
– kBaud, kbit = 1000 characters/bits per second
– MBaud, Mbit = 1,000,000 characters/bits per second
– Kbyte, KB = 1024 bytes of memory
– Mbyte, MB = 1048576 bytes of memory
In general, the k prefix scales a unit by 1000 whereas the K prefix scales a unit by
1024. Hence, the Kbyte unit scales the expression preceding it by 1024. The
kBaud unit scales the expression preceding it by 1000. The M prefix scales by
1,000,000 or 1048576, and µ scales by .000001. For example, 1 Kbyte is
1024 bytes, 1 Mbyte is 1024 × 1024 bytes, 1 kBaud/kbit are 1000 characters/bits
per second, 1 MBaud/Mbit are 1000000 characters/bits per second, and 1 MHz is
1,000,000 Hz.
• Data format quantities are defined as follows:
– Byte = 8-bit quantity
– Half-word = 16-bit quantity
– Word = 32-bit quantity
– Double-word = 64-bit quantity
Data Sheet
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V1.3, 2009-09
TC1767
Introduction
2.1.3
Reserved, Undefined, and Unimplemented Terminology
In tables where register bit fields are defined, the following conventions are used to
indicate undefined and unimplemented function. Furthermore, types of bits and bit fields
are defined using the abbreviations as shown in Table 2.
Table 2
Bit Function Terminology
Function of Bits
Description
Unimplemented,
Reserved
Register bit fields named 0 indicate unimplemented functions
with the following behavior.
• Reading these bit fields returns 0.
• These bit fields should be written with 0 if the bit field is
defined as r or rh.
• These bit fields have to be written with 0 if the bit field is
defined as rw.
These bit fields are reserved. The detailed description of these
bit fields can be found in the register descriptions.
rw
rwh
r
The bit or bit field can be read and written.
As rw, but bit or bit field can be also set or reset by hardware.
The bit or bit field can only be read (read-only).
w
The bit or bit field can only be written (write-only). A read to this
register will always give a default value back.
rh
s
This bit or bit field can be modified by hardware (read-hardware,
typical example: status flags). A read of this bit or bit field give
the actual status of this bit or bit field back. Writing to this bit or
bit field has no effect to the setting of this bit or bit field.
Bits with this attribute are “sticky” in one direction. If their reset
value is once overwritten by software, they can be switched
again into their reset state only by a reset operation. Software
cannot switch this type of bit into its reset state by writing the
register. This attribute can be combined to “rws” or “rwhs”.
f
Bits with this attribute are readable only when they are accessed
by an instruction fetch. Normal data read operations will return
other values.
2.1.4
Register Access Modes
Read and write access to registers and memory locations are sometimes restricted. In
memory and register access tables, the terms as defined in Table 3 are used.
Data Sheet
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V1.3, 2009-09
TC1767
Introduction
Table 3
Symbol
U
Access Terms
Description
Access Mode: Access permitted in User Mode 0 or 1.
Reset Value: Value or bit is not changed by a reset operation.
Access permitted in Supervisor Mode.
SV
R
Read-only register.
32
Only 32-bit word accesses are permitted to this register/address range.
Endinit-protected register/address.
E
PW
NC
BE
nBE
Password-protected register/address.
No change, indicated register is not changed.
Indicates that an access to this address range generates a Bus Error.
Indicates that no Bus Error is generated when accessing this address
range, even though it is either an access to an undefined address or the
access does not follow the given rules.
nE
Indicates that no Error is generated when accessing this address or
address range, even though the access is to an undefined address or
address range. True for CPU accesses (MTCR/MFCR) to undefined
addresses in the CSFR range.
2.1.5
Abbreviations and Acronyms
The following acronyms and terms are used in this document:
ADC
Analog-to-Digital Converter
Address General Purpose Register
Arithmetic and Logic Unit
Asynchronous/Synchronous Serial Controller
Bus Control Unit
AGPR
ALU
ASC
BCU
BROM
CAN
Boot ROM & Test ROM
Controller Area Network
CMEM
CISC
CPS
PCP Code Memory
Complex Instruction Set Computing
CPU Slave Interface
CPU
Central Processing Unit
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CSA
Context Save Area
CSFR
DAP
Core Special Function Register
Device Access Port
DAS
Device Access Server
DCACHE
DFLASH
DGPR
DMA
DMI
Data Cache
Data Flash Memory
Data General Purpose Register
Direct Memory Access
Data Memory Interface
External Request Unit
ERU
EMI
Electro-Magnetic Interference
Fast Analog-to-Digital Converter
Flash Array Module
FADC
FAM
FCS
Flash Command State Machine
Flash Interface and Control Module
Flexible Peripheral Interconnect (Bus)
Floating Point Unit
FIM
FPI
FPU
GPIO
GPR
GPTA
ICACHE
I/O
General Purpose Input/Output
General Purpose Register
General Purpose Timer Array
Instruction Cache
Input / Output
JTAG
LBCU
LDRAM
LFI
Joint Test Action Group = IEEE1149.1
Local Memory Bus Control Unit
Local Data RAM
Local Memory-to-FPI Bus Interface
Local Memory Bus
LMB
LTC
Local Timer Cell
MLI
Micro Link Interface
MMU
MSB
MSC
Memory Management Unit
Most Significant Bit
Micro Second Channel
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NC
Non Connect
NMI
Non-Maskable Interrupt
On-Chip Debug Support
Overlay Memory
OCDS
OVRAM
PCP
Peripheral Control Processor
Program Memory Unit
Phase Locked Loop
PMU
PLL
PFLASH
PMI
Program Flash Memory
Program Memory Interface
Program Memory Unit
PCP Parameter RAM
Random Access Memory
Reduced Instruction Set Computing
System Peripheral Bus Control Unit
System Control Unit
PMU
PRAM
RAM
RISC
SBCU
SCU
SFR
Special Function Register
System Peripheral Bus
Scratch-Pad RAM
SPB
SPRAM
SRAM
SRN
Static Data Memory
Service Request Node
Synchronous Serial Controller
System Timer
SSC
STM
WDT
Watchdog Timer
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2.2
System Architecture of the TC1767
The TC1767 combines three powerful technologies within one silicon die, achieving new
levels of power, speed, and economy for embedded applications:
• Reduced Instruction Set Computing (RISC) processor architecture
• Digital Signal Processing (DSP) operations and addressing modes
• On-chip memories and peripherals
DSP operations and addressing modes provide the computational power necessary to
efficiently analyze complex real-world signals. The RISC load/store architecture
provides high computational bandwidth with low system cost. On-chip memory and
peripherals are designed to support even the most demanding high-bandwidth real-time
embedded control-systems tasks.
Additional high-level features of the TC1767 include:
• Program Memory Unit – instruction memory and instruction cache
• Serial communication interfaces – flexible synchronous and asynchronous modes
• Peripheral Control Processor – standalone data operations and interrupt servicing
• DMA Controller – DMA operations and interrupt servicing
• General-purpose timers
• High-performance on-chip buses
• On-chip debugging and emulation facilities
• Flexible interconnections to external components
• Flexible power-management
TC1767 clock frequencies:
• Maximum CPU clock frequency: 133 MHz1)
• Maximum PCP clock frequency: 133 MHz2)
• Maximum SPB frequency: 80 MHz3)
The TC1767 is a high-performance microcontroller with TriCore CPU, program and data
memories, buses, bus arbitration, an interrupt controller, a peripheral control processor,
a DMA controller and several on-chip peripherals. The TC1767 is designed to meet the
needs of the most demanding embedded control systems applications where the
competing issues of price/performance, real-time responsiveness, computational power,
data bandwidth, and power consumption are key design elements.
The TC1767 offers several versatile on-chip peripheral units such as serial controllers,
timer units, and Analog-to-Digital converters. Within the TC1767, all these peripheral
units are connected to the TriCore CPU/system via the Flexible Peripheral Interconnect
(FPI) Bus and the Local Memory Bus (LMB). Several I/O lines on the TC1767 ports are
reserved for these peripheral units to communicate with the external world.
1) For CPU frequencies > 80 MHz, 2:1 mode has to be enabled. CPU 2:1 mode means: fSPB = 0.5 * fCPU
2) For PCP frequencies > 80 MHz, 2:1 mode has to be enabled. PCP 2:1 mode means: fSPB = 0.5 * fPCP
3) CPU 1:1 Mode means: fSPB = fCPU . PCP 1:1 mode means: fSPB = fPCP
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2.2.1
TC1767 Block Diagram
Figure 1 shows the block diagram of the TC1767.
Abbreviations:
ICACHE:
DCACHE
SPRAM :
LDRAM:
OVRAM:
BROM:
Instruction Cache
Data Cache
Scratch-Pad RAM
Local Data RAM
Overlay RAM
Boot ROM
Program Flash
Data Flash
Parameter RAM in PCP
Code RAM in PCP
FPU
PMI
DMI
68KB LDRAM
4 KB DCACHE
16 KB SPRAM
8 KB ICACHE
(Configurable)
TriCore
CPU
PFlash:
(Configurable)
DFlash:
PRAM:
CPS
CMEM:
LBCU
Local Memory Bus(LMB)
1,5V, 3.3V
Ext. supply
M
PMU
2 MB PFlash
64 KB DFlash
8 KB OVRAM
16 KB BROM
DMA
LFI Bridge
(8 Channels)
OCDS Debug
Interface/
JTAG
M/S
MLI0
8 KB PRAM
STM
SCU
Memcheck
Interrupt
System
PCP2
Core
ASC0
ASC1
5V
Ports
Ext. ADC supply
16 KB CMEM
ADC0
16 Channels
28
(5V max)
SSC0
SSC1
ADC1
fPLL
SBCU
PLL
16 Channels
GTPA0
LTCA2
4
FADC (3.3V)
4diff ch .
(3.3V max)
4
Multi
Ext.
Request
Unit
MSC0
CAN
(LVDS)
(2 Nodes,
64 Buffer)
BlockDiagram
TC 1767
LQFP -176
Figure 1
TC1767 Block Diagram
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2.2.2
System Features of the TC1767 device
The TC1767 has the following features:
Packages
• PG-LQFP-176-5 package, 0.5 mm pitch
Clock Frequencies
• Maximum CPU clock frequency: 133 MHz1)
• Maximum PCP clock frequency: 133 MHz2)
• Maximum SPB clock frequency: 80 MHz3)
1) For CPU frequencies > 80 MHz, 2:1 mode has to be enabled. CPU 2:1 mode means: fSPB = 0.5 * fCPU
2) For PCP frequencies > 80 MHz, 2:1 mode has to be enabled. PCP 2:1 mode means: fSPB = 0.5 * fPCP
3) CPU 1:1 Mode means: fSPB = fCPU . PCP 1:1 mode means: fSPB = fPCP
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2.2.3
On Chip CPU Cores
The TC1767 includes a high Performance CPU and a Peripheral Control Processor.
.
2.2.3.1
High-performance 32-bit CPU
This chapter gives an overview about the TriCore 1 architecture.
TriCore (TC1.3.1) Architectural Highlights
• Unified RISC MCU/DSP
• 32-bit architecture with 4 Gbytes unified data, program, and input/output address
space
• Fast automatic context-switching
• Multiply-accumulate unit
• Floating point unit
• Saturating integer arithmetic
• High-performance on-chip peripheral bus (FPI Bus)
• Register based design with multiple variable register banks
• Bit handling
• Packed data operations
• Zero overhead loop
• Precise exceptions
• Flexible power management
High-efficiency TriCore Instruction Set
• 16/32-bit instructions for reduced code size
• Data types include: Boolean, array of bits, character, signed and unsigned integer,
integer with saturation, signed fraction, double-word integers, and IEEE-754 single-
precision floating point
• Data formats include: Bit, 8-bit byte, 16-bit half-word, 32-bit word, and 64-bit double-
word data formats
• Powerful instruction set
• Flexible and efficient addressing mode for high code density
Integrated CPU related On-Chip Memories
• Instruction memory: 24 KB total. After reset, configured into:1)
– 24 Kbyte Scratch-Pad RAM (SPRAM)
– 0 Kbyte Instruction Cache (ICACHE)
• Data memory: 72 KB total. After reset, configured into:1)
1) Software configurable. Available options are described in the CPU chapter.
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– 72 Kbyte Local Data RAM (LDRAM)
– 0 Kbyte Data Cache (DACHE)
• On-chip SRAMs with parity error detection
2.2.3.2
High-performance 32-bit Peripheral Control Processor
The PCP is a flexible Peripheral Control Processor optimized for interrupt handling and
thus unloading the CPU.
Features
• Data move between any two memory or I/O locations
• Data move with predefined limit supported
• Read-Modify-Write capabilities
• Full computation capabilities including basic MUL/DIV
• Read/move data and accumulate it to previously read data
• Read two data values and perform arithmetic or logical operation and store result
• Bit-handling capabilities (testing, setting, clearing)
• Flow control instructions (conditional/unconditional jumps, breakpoint)
• Dedicated Interrupt System
• PCP SRAMs with parity error detection
• PCP/FPI clock mode 1:1 and 2:1 available
Integrated PCP related On-Chip Memories
• 16 Kbyte Code Memory (CMEM)
• 8 Kbyte Parameter Memory (PRAM)
2.3
On Chip System Units
The TC1767 micro controller offers several versatile on-chip system peripheral units
such as DMA controller, embedded Flash module, interrupt system and ports.
2.3.1
Flexible Interrupt System
The TC1767 includes a programmable interrupt system with the following features:
Features
• Fast interrupt response
• Hardware arbitration
• Independent interrupt systems for CPU and PCP
• Programmable service request nodes (SRNs)
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• Each SRN can be mapped to the CPU or PCP interrupt system
• Flexible interrupt-prioritizing scheme with 255 interrupt priority levels per SRN to
choose from
2.3.2
Direct Memory Access Controller
The TC1767 includes a fast and flexible DMA controller with independant DMA channels
( DMA Move engine).
Features
•
independent DMA channels
– Up to 16 selectable request inputs per DMA channel
– 2-level programmable priority of DMA channels within the DMA Sub-Block
– Software and hardware DMA request
– Hardware requests by selected on-chip peripherals and external inputs
• 3-level programmable priority of the DMA Sub-Block at the on chip bus interfaces
• Buffer capability for move actions on the buses (at least 1 move per bus is buffered)
• Individually programmable operation modes for each DMA channel
– Single Mode: stops and disables DMA channel after a predefined number of DMA
transfers
– Continuous Mode: DMA channel remains enabled after a predefined number of
DMA transfers; DMA transaction can be repeated
– Programmable address modification
– Two shadow register modes (with / w/o automatic re-set and direct write access).
• Full 32-bit addressing capability of each DMA channel
– 4 Gbyte address range
– Data block move supports > 32 Kbyte moves per DMA transaction
– Circular buffer addressing mode with flexible circular buffer sizes
• Programmable data width of DMA transfer/transaction: 8-bit, 16-bit, or 32-bit
• Register set for each DMA channel
– Source and destination address register
– Channel control and status register
– Transfer count register
• Flexible interrupt generation (the service request node logic for the MLI channel is
also implemented in the DMA module)
• DMA module is working on SPB frequency, LMB interface on LMB frequency.
• Dependant on the target/destination address, Read/write requests from the Move
Engine are directed to the SPB, LMB, MLI or to the the Cerberus.
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2.3.3
System Timer
The TC1767’s STM is designed for global system timing applications requiring both high
precision and long range.
Features
• Free-running 56-bit counter
• All 56 bits can be read synchronously
• Different 32-bit portions of the 56-bit counter can be read synchronously
• Flexible interrupt generation based on compare match with partial STM content
• Driven by maximum 80 MHz (= fSYS, default after reset = fSYS/2)
• Counting starts automatically after a reset operation
• STM registers are reset by an application reset if bit ARSTDIS.STMDIS is cleared. If
bit ARSTDIS.STMDIS is set, the STM is not reset.
• STM can be halted in debug/suspend mode
Special STM register semantics provide synchronous views of the entire 56-bit counter,
or 32-bit subsets at different levels of resolution.
The maximum clock period is 256 × fSTM. At fSTM = 80 MHz, for example, the STM counts
28.56 years before overflowing. Thus, it is capable of continuously timing the entire
expected product life time of a system without overflowing.
In case of a power-on reset, a watchdog reset, or a software reset, the STM is reset. After
one of these reset conditions, the STM is enabled and immediately starts counting up. It
is not possible to affect the content of the timer during normal operation of the TC1767.
The timer registers can only be read but not written to.
The STM can be optionally disabled for power-saving purposes, or suspended for
debugging purposes via its clock control register. In suspend mode of the TC1767
(initiated by writing an appropriate value to STM_CLC register), the STM clock is
stopped but all registers are still readable.
Due to the 56-bit width of the STM, it is not possible to read its entire content with one
instruction. It needs to be read with two load instructions. Since the timer would continue
to count between the two load operations, there is a chance that the two values read are
not consistent (due to possible overflow from the low part of the timer to the high part
between the two read operations). To enable a synchronous and consistent reading of
the STM content, a capture register (STM_CAP) is implemented. It latches the content
of the high part of the STM each time when one of the registers STM_TIM0 to STM_TIM5
is read. Thus, STM_CAP holds the upper value of the timer at exactly the same time
when the lower part is read. The second read operation would then read the content of
the STM_CAP to get the complete timer value.
The content of the 56-bit System Timer can be compared against the content of two
compare values stored in the STM_CMP0 and STM_CMP1 registers. Interrupts can be
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Introduction
generated on a compare match of the STM with the STM_CMP0 or STM_CMP1
registers.
Figure 2 provides an overview on the STM module. It shows the options for reading
parts of STM content.
STM Module
31
23
15
7
0
STM_CMP0
Compare Register 0
to DMA etc.
31
23
15
7
0
STM_CMP1
Compare Register1
STM
IRQ0
55
47
39
31
23
15
7
0
Interrupt
Control
STM
IRQ1
56-bit System Timer
Enable /
Disable
00H
00H
STM_CAP
STM_TIM6
Clock
Control
fSTM
STM_TIM5
STM_TIM4
Address
Decoder
STM_TIM3
STM_TIM2
STM_TIM1
STM_TIM0
PORST
MCB06185_mod
Figure 2
General Block Diagram of the STM Module Registers
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Introduction
2.3.4
System Control Unit
The following SCU introduction gives an overview about the TC1767 System Control
Unit (SCU).
2.3.4.1 Clock Generation Unit
The Clock Generation Unit (CGU) allows a very flexible clock generation for the TC1767.
During user program execution the frequency can be programmed for an optimal ratio
between performance and power consumption.
2.3.4.2 Features of the Watchdog Timer
The main features of the WDT are summarized here.
• 16-bit Watchdog counter
• Selectable input frequency: fFPI/256 or fFPI/16384
• 16-bit user-definable reload value for normal Watchdog operation, fixed reload value
for Time-Out and Prewarning Modes
• Incorporation of the ENDINIT bit and monitoring of its modifications
• Sophisticated Password Access mechanism with fixed and user-definable password
fields
• Access Error Detection: Invalid password (during first access) or invalid guard bits
(during second access) trigger the Watchdog reset generation
• Overflow Error Detection: An overflow of the counter triggers the Watchdog reset
generation
• Watchdog function can be disabled; access protection and ENDINIT monitor function
remain enabled
• Double Reset Detection: If a Watchdog induced reset occurs twice, a severe system
malfunction is assumed and the TC1767 is held in reset until a system / class 0 reset
occurs.
2.3.4.3 Reset Operation
The following reset request triggers are available:
• 1 External power-on hardware reset request trigger; PORST, (cold reset)
• 2 External System Request reset triggers; ESR0 and ESR1 (warm reset)
• Watchdog Timer (WDT) reset request trigger, (warm reset)
• Software reset (SW), (warm reset)
• Debug (OCDS) reset request trigger, (warm reset)
• JTAG reset (special reset)
• Resets via the JTAG interface
Note: The JTAG and OCDS resets are described in the OCDS chapter.
There are two basic types of reset request triggers:
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Introduction
• Trigger sources that do not depend on a clock, such as the PORST. This trigger force
the device into an asynchronous reset assertion independently of any clock. The
activation of an asynchronous reset is asynchronous to the system clock, whereas
its de-assertion is synchronized.
• Trigger sources that need a clock in order to be asserted, such as the input signals
ESR0, and ESR1, the WDT trigger, the parity trigger, or the SW trigger.
2.3.4.4 External Interface
The SCU provides interface pads for system purpose. Various functions are covered by
these pins. Due to the different tasks some of the pads can not be shared with other
functions but most of them can be shared with other functions. The following functions
are covered by the SCU controlled pads:
• Reset request triggers
• Reset indication
• Trap request triggers
• Interrupt request triggers
• Non SCU module triggers
The first three points are covered by the ESR pads and the last two points by the ERU
pads.
2.3.4.5 Die Temperature Measurement
The Die Temperature Sensor (DTS) generates a measurement result that indicates
directly the current temperature. The result of the measurement can be read via an DTS
register.
2.3.5
General Purpose I/O Ports and Peripheral I/O Lines
The TC1767 includes a flexible Ports structure with the following features:
Features
• Digital General-Purpose Input/Output (GPIO) port lines
• Input/output functionality individually programmable for each port line
• Programmable input characteristics (pull-up, pull-down, no pull device)
• Programmable output driver strength for EMI minimization (weak, medium, strong)
• Programmable output characteristics (push-pull, open drain)
• Programmable alternate output functions
• Output lines of each port can be updated port-wise or set/reset/toggled bit-wise
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2.3.6
Program Memory Unit (PMU)
The devices of the AudoF family contain at least one Program Memory Unit. This is
named “PMU0”. Some devices contain additional PMUs which are named “PMU1”, …
In the TC1767, the PMU0 contains the following submodules:
• The Flash command and fetch control interface for Program Flash and Data Flash.
• The Overlay RAM interface with Online Data Acquisition (OLDA) support.
• The Boot ROM interface.
• The Emulation Memory interface.
• The Local Memory Bus LMB slave interface.
Following memories are controlled by and belong to the PMU0:
• 2 Mbyte of Program Flash memory (PFlash)
• 64 Kbyte of Data Flash memory (DFlash, represents 16 Kbyte EEPROM)
• 16 Kbyte of Boot ROM (BROM)
• 8 Kbyte Overlay RAM (OVRAM)
The following figure shows the block diagram of the PMU0:
To/From
Local Memory Bus
64
LMB Interface
PMU0
Slave
Overlay RAM
PMU
Control
Interface
64
64
ROM Control
64
64
OVRAM
Flash Interface Module
64
64
BROM
DFLASH
PFLASH
Emulation
Memory
Interface
PMU0_BasicBlockDiag_generic
Emulation Memory
(ED chip only)
Figure 3
PMU0 Basic Block Diagram
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2.3.6.1 Boot ROM
The internal 16 Kbyte Boot ROM (BROM) is divided into two parts, used for:
• firmware (Boot ROM), and
• factory test routines (Test ROM).
The different sections of the firmware in Boot ROM provide startup and boot operations
after reset. The TestROM is reserved for special routines, which are used for testing,
stressing and qualification of the component.
2.3.6.2 Overlay RAM and Data Acquisition
The overlay memory OVRAM is provided in the PMU especially for redirection of data
accesses to program memory to the OVRAM by using the data overlay function. The
data overlay functionality itself is controlled in the DMI module.
For online data acquisition (OLDA) of application or calibration data a virtual 32 KB
memory range is provided which can be accessed without error reporting. Accesses to
this OLDA range can also be redirected to an overlay memory.
2.3.6.3 Emulation Memory Interface
In TC1767 Emulation Device, an Emulation Memory (EMEM) is provided, which can fully
be used for calibration via program memory or OLDA overlay. The Emulation Memory
interface shown in Figure 3 is a 64-bit wide memory interface that controls the CPU-
accesses to the Emulation Memory in the TC1767 Emulation Device. In the TC1767
production device, the EMEM interface is always disabled.
2.3.6.4 Tuning Protection
Tuning protection is required by the user to absolutely protect control data (e.g. for
engine control), serial number and user software, stored in the Flash, from being
manipulated, and to safely detect changed or disturbed data. For the internal Flash,
these protection requirements are excellently fulfilled in the TC1767 with
• Flash read and write protection with user-specific protection levels, and with
• dedicated HW and firmware, supporting the internal Flash read protection, and with
• the Alternate Boot Mode.
Special tuning protection support is provided for external Flash, which must also be
protected.
2.3.6.5 Program and Data Flash
The embedded Flash module of PMU0 includes 2 Mbyte of Flash memory for code or
constant data (called Program Flash) and additionally 64 Kbyte of Flash memory used
for emulation of EEPROM data (called Data Flash). The Program Flash is realized as
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Introduction
one independent Flash bank, whereas the Data Flash is built of two Flash banks,
allowing the following combinations of concurrent Flash operations:
• Read code or data from Program Flash, while one bank of Data Flash is busy with a
program or erase operation.
• Read data from one bank of Data Flash, while the other bank of Data Flash is busy
with a program or erase operation.
• Program one bank of Data Flash while erasing the other bank of Data Flash, read
from Program Flash.
Both, the Program Flash and the Data Flash, provide error correction of single-bit errors
within a 64-bit read double-word, resulting in an extremely low failure rate. Read
accesses to Program Flash are executed in 256-bit width, to Data Flash in 64-bit width
(both plus ECC). Single-cycle burst transfers of up to 4 double-words and sequential
prefetching with control of prefetch hit are supported for Program Flash.
The minimum programming width is the page, including 256 bytes in Program Flash and
128 bytes in Data Flash. Concurrent programming and erasing in Data Flash is
performed using an automatic erase suspend and resume function.
A basic block diagram of the Flash Module is shown in the following figure.
Redundancy
Control
FSI
Voltage Control
Control
Control
Flash Command
State Machine FCS
SFRs
FSRAM
Microcode
Address
Addr Bus
Write Bus
Page
Write
Buffers
256 byte
and
Program
Flash
64
64
WR_DATA
128 byte
8
8
PF-Read
Buffer
256+32 bit
and
ECC Code
Bank 0
Bank 1
ECC Block
Data
Flash
64
DF-Read
Buffer
64+8 bit
Read Bus
64
RD_DATA
Flash Array Module
FAM
Flash Interface&Control Module
FIM
PMU
Flash FSI & Array
Flash_BasicBlockDiagram_generic.vsd
Figure 4
Basic Block Diagram of Flash Module
All Flash operations are controlled simply by transferring command sequences to the
Flash which are based on JEDEC standard. This user interface of the embedded Flash
is very comfortable, because all operations are controlled with high level commands,
such as “Erase Sector”. State transitions, such as termination of command execution, or
errors are reported to the user by maskable interrupts. Command sequences are
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Introduction
normally written to Flash by the CPU, but may also be issued by the DMA controller (or
OCDS).
The Flash also features an advanced read/write protection architecture, including a read
protection for the whole Flash array (optionally without Data Flash) and separate write
protection for all sectors (only Program Flash). Write protected sectors can be made re-
programmable (enabled with passwords), or they can be locked for ever (ROM function).
Each sector can be assigned to up to three different users for write protection. The
different users are organized hierarchically.
Program Flash Features and Functions
• 2 Mbyte on-chip Program Flash in PMU0.
• Any use for instruction code or constant data.
• 256 bit read interface (burst transfer operation).
• Dynamic correction of single-bit errors during read access.
• Transfer rate in burst mode: One 64-bit double-word per clock cycle.
• Sector architecture:
– Eight 16 Kbyte, one 128 Kbyte and seven 256 Kbyte sectors.
– Each sector separately erasable.
– Each sector lockable for protection against erase and program (write protection).
• One additional configuration sector (not accessible to the user).
• Optional read protection for whole Flash, with sophisticated read access supervision.
Combined with whole Flash write protection — thus supporting protection against
Trojan horse programs.
• Sector specific write protection with support of re-programmability or locked forever.
• Comfortable password checking for temporary disable of write or read protection.
• User controlled configuration blocks (UCB) in configuration sector for keywords and
for sector-specific lock bits (one block for every user; up to three users).
• Pad supply voltage (VDDP) also used for program and erase (no VPP pin).
• Efficient 256 byte page program operation.
• All Flash operations controlled by CPU per command sequences (unlock sequences)
for protection against unintended operation.
• End-of-busy as well as error reporting with interrupt and bus error trap.
• Write state machine for automatic program and erase, including verification of
operation quality.
• Support of margin check.
• Delivery in erased state (read all zeros).
• Global and sector status information.
• Overlay support with SRAM for calibration applications.
• Configurable wait state selection for different CPU frequencies.
• Endurance = 1000; minimum 1000 program/erase cycles per physical sector;
reduced endurance of 100 per 16 KB sector.
• Operating lifetime (incl. Retention): 20 years with endurance=1000.
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Introduction
• For further operating conditions see data sheet section “Flash Memory Parameters”.
Data Flash Features and Functions
• 64 Kbyte on-chip Flash, configured in two independent Flash banks of equal size.
• 64 bit read interface.
• Erase/program one bank while data read access from the other bank.
• Programming one bank while erasing the other bank using an automatic
suspend/resume function.
• Dynamic correction of single-bit errors during read access.
• Sector architecture:
– Two sectors of equal size.
– Each sector separately erasable.
• 128 byte pages to be written in one step.
• Operational control per command sequences (unlock sequences, same as those of
Program Flash) for protection against unintended operation.
• End-of-busy as well as error reporting with interrupt and bus error trap.
• Write state machine for automatic program and erase.
• Margin check for detection of problematic Flash bits.
• Endurance = 30000 (can be device dependent); i.e. 30000 program/erase cycles per
sector are allowed, with a retention of min. 5 years.
• Dedicated DFlash status information.
• Other characteristics: Same as Program Flash.
2.3.7
Data Access Overlay
The data overlay functionality provides the capability to redirect data accesses by the
TriCore to program memory (segments 8H and AH) called “target memory” to a different
memory called “overlay memory”.
Depending on the device the following overlay memories can be available:
• Overlay SRAM in the PMU.
• Emulation Memory1).
• External memory2).
This functionality makes it possible, for example, to modify the application’s test and
calibration parameters (which are typically stored in the program memory) during run
time of a program.
As the address translation is implemented in the DMI, it affects only data accesses
(reads and writes) of the TriCore. Instruction fetches by the TriCore or accesses by any
other master (including the debug interface) are not redirected.
1) Only available in Emulation Device “ED”.
2) Only available in Emulation Device with EBU.
Data Sheet
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V1.3, 2009-09
TC1767
Introduction
Summary of Features and Functions
• 16 overlay ranges (“blocks”) configurable.
• Support of 8 Kbyte embedded Overlay SRAM (OVRAM) in PMU.
• Support of up to 256 Kbyte overlay/calibration memory (EMEM)1).
• Support of up to 2 MB overlay memory in external memory (EBU space)2).
• Support of Online Data Acquisition into range of up to 32 KB and of its overlay.
• Support of different overlay memory selections for every enabled overlay block.
• Sizes of overlay blocks selectable depending on the overlay memory:
– OVRAM: from 16 byte to 2 Kbyte.
– EMEM1) and external memory2): 1 Kbyte to 128 Kbyte.
• All configured overlay ranges can be enabled with only one register write access.
• Programmable flush (invalidate) control for data cache in DMI.
2.3.8
TC1767 Development Support
Overview about the TC1767 development environment:
Complete Development Support
A variety of software and hardware development tools for the 32-bit microcontroller
TC1767 are available from experienced international tool suppliers. The development
environment for the Infineon 32-bit microcontroller includes the following tools:
• Embedded Development Environment for TriCore Products
• The TC1767 On-chip Debug Support (OCDS) provides a JTAG port for
communication between external hardware and the system
• The System Timer (STM) with high-precision, long-range timing capabilities
• The TC1767 includes a power management system, a watchdog timer as well as
reset logic
Data Sheet
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V1.3, 2009-09
TC1767
Introduction
2.4
On-Chip Peripheral Units
The TC1767 micro controller offers several versatile on-chip peripheral units such as
serial controllers, timer units, and Analog-to-Digital converters. Several I/O lines on the
TC1767 ports are reserved for these peripheral units to communicate with the external
world.
On-Chip Peripheral Units
• Two Asynchronous/Synchronous Serial Channels (ASC) with baud-rate generator,
parity, framing and overrun error detection
• Two Synchronous Serial Channels (SSC) with programmable data length and shift
direction
• One Micro Second Bus Interface (MSC) for serial communication
• One CAN Module (MultiCAN) for high-efficiency data handling via FIFO buffering and
gateway data transfer
• One Micro Link Serial Bus Interfaces (MLI) for serial multiprocessor communication
• One General Purpose Timer Array (GPTA) with a powerful set of digital signal filtering
and timer functionality to accomplish autonomous and complex Input/Output
management
• Two Analog-to-Digital Converter Units (ADC0, ADC1) with 8-bit, 10-bit, or 12-bit
resolution.
• One fast Analog-to-Digital Converter Unit (FADC)
2.4.1
Asynchronous/Synchronous Serial Interfaces
The TC1767 includes two Asynchronous/Synchronous Serial Interfaces, ASC0 and
ASC1. Both ASC modules have the same functionality.
Figure 5 shows a global view of the Asynchronous/Synchronous Serial Interface (ASC).
Data Sheet
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V1.3, 2009-09
TC1767
Introduction
fASC
Clock
Control
RXD
TXD
RXD
TXD
Address
Decoder
ASC
Module
(Kernel)
Port
Control
EIR
TBIR
TIR
RIR
Interrupt
Control
To DMA
MCB05762_mod
Figure 5
General Block Diagram of the ASC Interface
The ASC provides serial communication between the TC1767 and other
microcontrollers, microprocessors, or external peripherals.
The ASC supports full-duplex asynchronous communication and half-duplex
synchronous communication. In Synchronous Mode, data is transmitted or received
synchronous to a shift clock that is generated by the ASC internally. In Asynchronous
Mode, 8-bit or 9-bit data transfer, parity generation, and the number of stop bits can be
selected. Parity, framing, and overrun error detection are provided to increase the
reliability of data transfers. Transmission and reception of data is double-buffered. For
multiprocessor communication, a mechanism is included to distinguish address bytes
from data bytes. Testing is supported by a loop-back option. A 13-bit baud rate generator
provides the ASC with a separate serial clock signal, which can be accurately adjusted
by a prescaler implemented as fractional divider.
Data Sheet
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V1.3, 2009-09
TC1767
Introduction
Features
• Full-duplex asynchronous operating modes
– 8-bit or 9-bit data frames, LSB first
– Parity-bit generation/checking
– One or two stop bits
– Baud rate from 5.0 Mbit/s to 1.19 bit/s (@ 80 MHz module clock)
– Multiprocessor mode for automatic address/data byte detection
– Loop-back capability
• Half-duplex 8-bit synchronous operating mode
– Baud rate from 10.0 Mbit/s to 813.8 bit/s (@ 80 MHz module clock)
• Double-buffered transmitter/receiver
• Interrupt generation
– On a transmit buffer empty condition
– On a transmit last bit of a frame condition
– On a receive buffer full condition
– On an error condition (frame, parity, overrun error)
• Implementation features
– Connections to DMA Controller
– Connections of receiver input to GPTA (LTC) for baud rate detection and LIN break
signal measuring
2.4.2
High-Speed Synchronous Serial Interfaces
The TC1767 includes two High-Speed Synchronous Serial Interfaces, SSC0 and SSC1.
Both SSC modules have the same functionality.
Figure 6 shows a global view of the Synchronous Serial interface (SSC).
Data Sheet
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V1.3, 2009-09
TC1767
Introduction
MRSTA
MRSTB
MTSR
fSSC
fCLC
Master
Clock
Control
MTSR
MTSRA
MTSRB
MRST
Slave
Slave
MRST
Address
Decoder
SCLKA
SCLKB
SCLK
SSC
Module
(Kernel)
Port
Control
RIR
TIR
EIR
Master
Slave
SCLK
SLSI[7:1]
Interrupt
Control
SLSI[7:1]
SLSO[7:0]
SLSOANDO[7:0]
SLSOANDI[7:0]
SLSO[7:0]
SLSOANDO[7:0]
Master
DMA Requests
Enable
M/S Select
MCB06058_mod
Figure 6
General Block Diagram of the SSC Interface
The SSC supports full-duplex and half-duplex serial synchronous communication up to
40 Mbit/s (@ 80 MHz module clock, Master Mode). The serial clock signal can be
generated by the SSC itself (Master Mode) or can be received from an external master
(Slave Mode). Data width, shift direction, clock polarity and phase are programmable.
This allows communication with SPI-compatible devices. Transmission and reception of
data are double-buffered. A shift clock generator provides the SSC with a separate serial
clock signal. One slave select input is available for slave mode operation. Eight
programmable slave select outputs (chip selects) are supported in Master Mode.
Data Sheet
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V1.3, 2009-09
TC1767
Introduction
Features
• Master and Slave Mode operation
– Full-duplex or half-duplex operation
– Automatic pad control possible
• Flexible data format
– Programmable number of data bits: 2 to 16 bits
– Programmable shift direction: LSB or MSB shift first
– Programmable clock polarity: Idle low or idle high state for the shift clock
– Programmable clock/data phase: Data shift with leading or trailing edge of the shift
clock
• Baud rate generation
– Master Mode: 40.0 Mbit/s to 610.36 bit/s (@ 80 MHz module clock)
– Slave Mode: 20 Mbit/s to 610.36 bit/s (@ 80 MHz module clock)
• Interrupt generation
– On a transmitter empty condition
– On a receiver full condition
– On an error condition (receive, phase, baud rate, transmit error)
• Flexible SSC pin configuration
• Seven slave select inputs SLSI[7:1] in Slave Mode
• Eight programmable slave select outputs SLSO in Master Mode
– Automatic SLSO generation with programmable timing
– Programmable active level and enable control
Data Sheet
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V1.3, 2009-09
TC1767
Introduction
2.4.3
Micro Second Channel Interface
The Micro Second Channel (MSC) interface provides serial communication links
typically used to connect power switches or other peripheral devices. The serial
communication link includes a fast synchronous downstream channel and a slow
asynchronous upstream channel. Figure 7 shows a global view of the interface signals
of the MSC interface.
fMSC
Clock
Control
fCLC
FCLP
FCLN
SOP
SON
EN0
Address
Decoder
MSC
Module
(Kernel)
SR[3:0]
16
Interrupt
Control
EN1
4
EN2
To DMA
EN3
ALTINL[15:0]
ALTINH[15:0]
EMGSTOPMSC
8
SDI[7:0]
16
MCB06059
Figure 7
General Block Diagram of the MSC Interface
The downstream and upstream channels of the MSC module communicate with the
external world via nine I/O lines. Eight output lines are required for the serial
communication of the downstream channel (clock, data, and enable signals). One out of
eight input lines SDI[7:0] is used as serial data input signal for the upstream channel. The
source of the serial data to be transmitted by the downstream channel can be MSC
register contents or data that is provided on the ALTINL/ALTINH input lines. These input
lines are typically connected with other on-chip peripheral units (for example with a timer
unit such as the GPTA). An emergency stop input signal makes it possible to set bits of
the serial data stream to dedicated values in an emergency case.
Clock control, address decoding, and interrupt service request control are managed
outside the MSC module kernel. Service request outputs are able to trigger an interrupt
or a DMA request.
Data Sheet
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V1.3, 2009-09
TC1767
Introduction
Features
• Fast synchronous serial interface to connect power switches in particular, or other
peripheral devices via serial buses
• High-speed synchronous serial transmission on downstream channel
– Serial output clock frequency: fFCL = fMSC/2
– Fractional clock divider for precise frequency control of serial clock fMSC
– Command, data, and passive frame types
– Start of serial frame: Software-controlled, timer-controlled, or free-running
– Programmable upstream data frame length (16 or 12 bits)
– Transmission with or without SEL bit
– Flexible chip select generation indicates status during serial frame transmission
– Emergency stop without CPU intervention
• Low-speed asynchronous serial reception on upstream channel
– Baud rate: fMSC divided by 4, 8, 16, 32, 64, 128, or 256
– Standard asynchronous serial frames
– Parity error checker
– 8-to-1 input multiplexer for SDI lines
– Built-in spike filter on SDI lines
• Selectable pin types of downstream channel interface:
four LVDS differential output drivers or four digital GPIO pins
Data Sheet
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V1.3, 2009-09
TC1767
Introduction
2.4.4
MultiCAN Controller
The MultiCAN module provides two independent CAN nodes in the PG-LQFP-176-5
package, representing two serial communication interfaces. The number of available
message objects is 64.
MultiCAN Module Kernel
fCAN
Clock
Control
fCLC
Message
Object
Buffer
Linked
List
Control
Address
Decoder
TXDC1
CAN
Node 1
64
RXDC1
TXDC0
Port
Control
Objects
CAN
Node 0
RXDC0
Interrupt
Control
CAN Control
MCA06060_N2
Figure 8
Overview of the MultiCAN Module
The MultiCAN module contains two independently operating CAN nodes with Full-CAN
functionality that are able to exchange Data and Remote Frames via a gateway function.
Transmission and reception of CAN frames is handled in accordance to CAN
specification V2.0 B (active). Each CAN node can receive and transmit standard frames
with 11-bit identifiers as well as extended frames with 29-bit identifiers.
All two CAN nodes share a common set of message objects. Each message object can
be individually allocated to one of the CAN nodes. Besides serving as a storage
container for incoming and outgoing frames, message objects can be combined to build
gateways between the CAN nodes or to set up a FIFO buffer.
The message objects are organized in double-chained linked lists, where each CAN
node has its own list of message objects. A CAN node stores frames only into message
objects that are allocated to the message object list of the CAN node, and it transmits
only messages belonging to this message object list. A powerful, command-driven list
controller performs all message object list operations.
Data Sheet
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V1.3, 2009-09
TC1767
Introduction
The bit timings for the CAN nodes are derived from the module timer clock (fCAN) and are
programmable up to a data rate of 1 Mbit/s. External bus transceivers are connected to
a CAN node via a pair of receive and transmit pins.
Features
• Compliant with ISO 11898
• CAN functionality according to CAN specification V2.0 B active
• Dedicated control registers for each CAN node
• Data transfer rates up to 1 Mbit/s
• Flexible and powerful message transfer control and error handling capabilities
• Advanced CAN bus bit timing analysis and baud rate detection for each CAN node
via a frame counter
• Full-CAN functionality: A set of 64 message objects can be individually
– Allocated (assigned) to any CAN node
– Configured as transmit or receive object
– Setup to handle frames with 11-bit or 29-bit identifier
– Identified by a timestamp via a frame counter
– Configured to remote monitoring mode
• Advanced Acceptance Filtering
– Each message object provides an individual acceptance mask to filter incoming
frames.
– A message object can be configured to accept standard or extended frames or to
accept both standard and extended frames.
– Message objects can be grouped into four priority classes for transmission and
reception.
– The selection of the message to be transmitted first can be based on frame
identifier, IDE bit and RTR bit according to CAN arbitration rules, or on its order in
the list.
• Advanced message object functionality
– Message objects can be combined to build FIFO message buffers of arbitrary size,
limited only by the total number of message objects.
– Message objects can be linked to form a gateway that automatically transfers
frames between 2 different CAN buses. A single gateway can link any two CAN
nodes. An arbitrary number of gateways can be defined.
• Advanced data management
– The message objects are organized in double-chained lists.
– List reorganizations can be performed at any time, even during full operation of the
CAN nodes.
– A powerful, command-driven list controller manages the organization of the list
structure and ensures consistency of the list.
– Message FIFOs are based on the list structure and can easily be scaled in size
during CAN operation.
Data Sheet
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V1.3, 2009-09
TC1767
Introduction
– Static allocation commands offer compatibility with MultiCAN applications that are
not list-based.
• Advanced interrupt handling
– Up to 16 interrupt output lines are available. Interrupt requests can be routed
individually to one of the 16 interrupt output lines.
– Message post-processing notifications can be combined flexibly into a dedicated
register field of 256 notification bits.
Data Sheet
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V1.3, 2009-09
TC1767
Introduction
2.4.5
Micro Link Interface
This TC1767 contains one Micro Link Interface, MLI0.
The Micro Link Interface (MLI) is a fast synchronous serial interface to exchange data
between microcontrollers or other devices, such as stand-alone peripheral components.
Figure 9 shows how two microcontrollers are typically connected together via their MLI
interfaces.
Controller 1
CPU
Controller 2
CPU
Peripheral
A
Peripheral
B
Peripheral
C
Peripheral
D
Memory
MLI
MLI
Memory
System Bus
System Bus
MCA06061
Figure 9
Features
Typical Micro Link Interface Connection
• Synchronous serial communication between an MLI transmitter and an MLI receiver
• Different system clock speeds supported in MLI transmitter and MLI receiver due to
full handshake protocol (4 lines between a transmitter and a receiver)
• Fully transparent read/write access supported (= remote programming)
• Complete address range of target device available
• Specific frame protocol to transfer commands, addresses and data
• Error detection by parity bit
• 32-bit, 16-bit, or 8-bit data transfers supported
• Programmable baud rate: fMLI/2 (max. fMLI = fSYS
)
• Address range protection scheme to block unauthorized accesses
• Multiple receiving devices supported
Data Sheet
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V1.3, 2009-09
TC1767
Introduction
Figure 10 shows a general block diagram of the MLI module.
TREADY[D:A]
4
4
TVALID[D:A]
TDATA
fSYS
Fract.
Divider
MLI
Transmitter
I/O
Control
TCLK
TR[3:0]
fMLI
Port
Control
MLI Module
BRKOUT
SR[7:0]
RCLK[D:A]
4
4
4
4
RREADY[D:A]
RVALID[D:A]
RDATA[D:A]
Move
Engine
MLI
Receiver
I/O
Control
MCB06062_mod
Figure 10
General Block Diagram of the MLI Modules
The MLI transmitter and MLI receiver communicate with other MLI receivers and MLI
transmitters via a four-line serial connection each. Several I/O lines of these connections
are available outside the MLI module kernel as a four-line output or input vector with
index numbering A, B, C and D. The MLI module internal I/O control blocks define which
signal of a vector is actually taken into account and also allow polarity inversions (to
adapt to different physical interconnection means).
Data Sheet
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V1.3, 2009-09
TC1767
Introduction
2.4.6
General Purpose Timer Array (GPTA)
The TC1767 contains the General Purpose Timer Array (GPTA0). Figure 11 shows a
global view of the GPTA module.
The GPTA provides a set of timer, compare, and capture functionalities that can be
flexibly combined to form signal measurement and signal generation units. They are
optimized for tasks typical of engine, gearbox, and electrical motor control applications,
but can also be used to generate simple and complex signal waveforms required for
other industrial applications.
GPTA0
Clock Generation Cells
FPC0
DCM0
FPC1 PDL0
DCM1
FPC2
DIGITAL
PLL
FPC3
DCM2
DCM3
FPC4 PDL1
FPC5
fGPTA Clock Distribution Cells
Clock
Conn.
Signal
Generation Cells
GT0
GT1
LTCA2
GTC00
GTC01
GTC02
GTC03
LTC00
LTC01
LTC02
LTC03
LTC00
LTC01
LTC02
LTC03
Global
Timer
Cell Array
Local
Timer
Cell Array
Local
Timer
Cell Array
GTC30
GTC31
LTC62
LTC63
LTC30
LTC31
I/O Line
Sharing Block
I/O Line Sharing Block
Interrupt Sharing Block
Interrupt
Sharing Block
MCB05910_TC1767_LTC32
Figure 11
General Block Diagram of the GPTA Modules in the TC1767
Data Sheet
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V1.3, 2009-09
TC1767
Introduction
2.4.6.1 Functionality of GPTA0
The General Purpose Timer Array (GPTA0) provides a set of hardware modules
required for high-speed digital signal processing:
• Filter and Prescaler Cells (FPC) support input noise filtering and prescaler operation.
• Phase Discrimination Logic units (PDL) decode the direction information output by a
rotation tracking system.
• Duty Cycle Measurement Cells (DCM) provide pulse-width measurement
capabilities.
• A Digital Phase Locked Loop unit (PLL) generates a programmable number of GPTA
module clock ticks during an input signal’s period.
• Global Timer units (GT) driven by various clock sources are implemented to operate
as a time base for the associated Global Timer Cells.
• Global Timer Cells (GTC) can be programmed to capture the contents of a Global
Timer on an external or internal event. A GTC may also be used to control an external
port pin depending on the result of an internal compare operation. GTCs can be
logically concatenated to provide a common external port pin with a complex signal
waveform.
• Local Timer Cells (LTC) operating in Timer, Capture, or Compare Mode may also be
logically tied together to drive a common external port pin with a complex signal
waveform. LTCs – enabled in Timer Mode or Capture Mode – can be clocked or
triggered by various external or internal events.
• On-chip Trigger and Gating Signals (OTGS) can be configured to provide trigger or
gating signals to integrated peripherals.
Input lines can be shared by an LTC and a GTC to trigger their programmed operation
simultaneously.
The following list summarizes the specific features of the GPTA units.
Clock Generation Unit
• Filter and Prescaler Cell (FPC)
– Six independent units
– Three basic operating modes:
Prescaler, Delayed Debounce Filter, Immediate Debounce Filter
– Selectable input sources:
Port lines, GPTA module clock, FPC output of preceding FPC cell
– Selectable input clocks:
GPTA module clock, prescaled GPTA module clock, DCM clock, compensated or
uncompensated PLL clock.
– fGPTA/2 maximum input signal frequency in Filter Modes
• Phase Discriminator Logic (PDL)
– Two independent units
– Two operating modes (2- and 3- sensor signals)
Data Sheet
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V1.3, 2009-09
TC1767
Introduction
– fGPTA/4 maximum input signal frequency in 2-sensor Mode, fGPTA/6 maximum input
signal frequency in 3-sensor Mode
• Duty Cycle Measurement (DCM)
– Four independent units
– 0 - 100% margin and time-out handling
– fGPTA maximum resolution
– fGPTA/2 maximum input signal frequency
• Digital Phase Locked Loop (PLL)
– One unit
– Arbitrary multiplication factor between 1 and 65535
– fGPTA maximum resolution
– fGPTA/2 maximum input signal frequency
• Clock Distribution Unit (CDU)
– One unit
– Provides nine clock output signals:
fGPTA, divided fGPTA clocks, FPC1/FPC4 outputs, DCM clock, LTC prescaler clock
Signal Generation Unit
• Global Timers (GT)
– Two independent units
– Two operating modes (Free-Running Timer and Reload Timer)
– 24-bit data width
– fGPTA maximum resolution
– fGPTA/2 maximum input signal frequency
• Global Timer Cell (GTC)
– 32 units related to the Global Timers
– Two operating modes (Capture, Compare and Capture after Compare)
– 24-bit data width
– fGPTA maximum resolution
– fGPTA/2 maximum input signal frequency
• Local Timer Cell (LTC)
– 64 independent units
– Three basic operating modes (Timer, Capture and Compare) for 63 units
– Special compare modes for one unit
– 16-bit data width
– fGPTA maximum resolution
– fGPTA/2 maximum input signal frequency
Interrupt Sharing Unit
• 143 interrupt sources, generating up to 46 service requests
Data Sheet
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V1.3, 2009-09
TC1767
Introduction
On-chip Trigger Unit
• 16 on-chip trigger signals
I/O Sharing Unit
• Interconnecting inputs and outputs from internal clocks, FPC, GTC, LTC, ports, and
MSC interface
Data Sheet
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V1.3, 2009-09
TC1767
Introduction
2.4.7
Analog-to-Digital Converters
The TC1767 includes two Analog to Digital Converter modules (ADC0, ADC1) and one
Fast Analog to Digital Converter (FADC).
2.4.7.1 ADC Block Diagram
The analog to digital converter module (ADC) allows the conversion of analog input
values into discrete digital values based on the successive approximation method.
This module contains 2 independent kernels (ADC0, ADC1) that can operate
autonomously or can be synchronized to each other. An ADC kernel is a unit used to
convert an analog input signal (done by an analog part) and provides means for
triggering conversions, data handling and storage (done by a digital part).
analog part kernel 0
digital part kernel 0
analog
inputs
AD
converter
data (result)
handling
conversion
control
request
control
bus
inter-
face
analog part kernel 1
digital part kernel 1
analog
inputs
AD
converter
data (result)
handling
conversion
control
request
control
ADC_2_kernels
Figure 12
ADC Module with two ADC Kernels
Features of the analog part of each ADC kernel:
• Input voltage range from 0V to analog supply voltage
• Analog supply voltage range from 3.3 V to 5 V (single supply)
(5V nominal supply voltage, performance degradation accepted for lower voltages)
• Input multiplexer width of 16 possible analog input channels (not all of them are
necessarily available on pins)
• VAREF and 1 alternative reference input at channel 0
• Programmable sample time (in periods of fADCI
)
• Wide range of accepted analog clock frequencies fADCI
Data Sheet
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Introduction
• Multiplexer test mode (channel 7 input can be connected to ground via a resistor for
test purposes during run time by specific control bit)
• Power saving mechanisms
Features of the digital part of each ADC kernel:
• Independent result registers (16 independent registers)
• 5 conversion request sources (e.g. for external events, auto-scan, programmable
sequence, etc.)
• Synchronization of the ADC kernels for concurrent conversion starts
• Control an external analog multiplexer, respecting the additional set up time
• Programmable sampling times for different channels
• Possibility to cancel running conversions on demand with automatic restart
• Flexible interrupt generation (possibility of DMA support)
• Limit checking to reduce interrupt load
• Programmable data reduction filter by adding conversion results
• Support of conversion data FIFO
• Support of suspend and power down modes
• Individually programmable reference selection for each channel (with exception of
dedicated channels always referring to VAREF
)
Data Sheet
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V1.3, 2009-09
TC1767
Introduction
2.4.7.2 FADC Short Description
General Features
• Extreme fast conversion, 21 cycles of fFADC clock (262.5 ns @ fFADC = 80 MHz)
• 10-bit A/D conversion (higher resolution can be achieved by averaging of
consecutive conversions in digital data reduction filter)
• Successive approximation conversion method
• Each differential input channel can also be used as single-ended input
• Offset calibration support for each channel
• Programmable gain of 1, 2, 4, or 8 for each channel
• Free-running (Channel Timers) or triggered conversion modes
• Trigger and gating control for external signals
• Built-in Channel Timers for internal triggering
• Channel timer request periods independently selectable for each channel
• Selectable, programmable digital anti-aliasing and data reduction filter block with four
independent filter units
VDDAF
VFAGND VSSAF
VFAREF
VDDMF VDDIF
VSSMF
fFADC
fCLC
Data
Reduction
Unit
Clock
Control
FAIN0P
FAIN0N
FAIN1P
FAIN1N
FAIN2P
FAIN2N
FAIN3P
FAIN3N
input
channel 0
A/D
Control
input
channel 1
A/D
Converter
Stage
SRx
SRx
Interrupt
Control
input
channel 2
input
channel 3
DMA
TS[H:A]
GS[H:A]
Channel
Trigger
Control
Channel
Timers
MCB06065_m4
Figure 13
Block Diagram of the FADC Module with 4 Input Channels
As shown in Figure 13, the main FADC functional blocks are:
• An Input Structure containing the differential inputs and impedance control.
Data Sheet
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V1.3, 2009-09
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Introduction
• An A/D Converter Stage responsible for the analog-to-digital conversion including an
input multiplexer to select between the channel amplifiers
• A Data Reduction Unit containing programmable anti-aliasing and data reduction
filters
• A Channel Trigger Control block determining the trigger and gating conditions for the
FADC channels
• A Channel Timer for each channel to independently trigger the conversions
• An A/D Control block responsible for the overall FADC functionality
FADC Power Supply and References
The FADC module is supplied by the following power supply and reference voltage lines:
• VDDMF / VSSMF: FADC Analog Channel Amplifier Power Supply (3.3 V)
• VDDIF / VSSMF: FADC Analog Input Stage Power Supply (3.3 - 5 V),
the VDDIF supply does not appear as supply pin, because it is internally connected to
the VDDM supply of the ADC that is sharing the FADC input pins.
• VDDAF / VSSAF: FADC Analog Part Power Supply (1.5 V),
to be fed in externally
• VFAREF / VFAGND: FADC Reference Voltage (3.3 V max.) and FADC Reference Ground
Input Structure
The input structure of the FADC in the TC1767 contains:
• A differential analog input stage for each input channel to select the input impedance
(differential or single-ended measurement) and to decouple the FADC input signal
from the pins.
• A channel amplifier for each input channel with a settling time (about 5µs) when
changing the characteristics of an input stage (changing between unused,
differential, single-ended N, or single-ended P mode).
Data Sheet
48
V1.3, 2009-09
TC1767
Introduction
Analog Input
Stages
Channel Amplifier
Stages
Converter Stage
V
DDMF
FAIN0P
FAIN0N
Rp
conversion
control
A/D
Control
Rn
gain
VSSMF
CHNR
Rp
Rn
V
DDMF
FAIN2P
FAIN2N
V
SSMF
A/D
Rp
Rn
V
DDMF
FAIN1P
FAIN1N
V
DDAF
V
SSAF
VSSMF
Rp
Rn
V
DDMF
FAIN3P
FAIN3N
VSSMF
MCA06432_m4n
V
DDIF
VSSMF
Figure 14
2.5
FADC Input Structure in TC1767
On-Chip Debug Support (OCDS)
The TC1767 contains resources for different kinds of “debugging”, covering needs from
software development to real-time-tuning. These resources are either embedded in
specific modules (e.g. breakpoint logic of the TriCore) or part of a central peripheral
(known as CERBERUS).
2.5.1
On-Chip Debug Support
The classic software debug approach (start/stop, single-stepping) is supported by
several features labelled “OCDS Level 1”:
• Run/stop and single-step execution independently for TriCore and PCP.
• Means to request all kinds of reset without usage of sideband pins.
• Halt-after-Reset for repeatable debug sessions.
Data Sheet
49
V1.3, 2009-09
TC1767
Introduction
• Different Boot modes to use application software not yet programmed to the Flash.
• A total of four hardware breakpoints for the TriCore based on instruction address,
data address or combination of both.
• Unlimited number of software breakpoints (DEBUG instruction) for TriCore and PCP.
• Debug event generated by access to a specific address via the system peripheral
bus.
• Tool access to all SFRs and internal memories independent of the Cores.
• Two central Break Switches to collect debug events from all modules (TriCore, PCP,
DMA, BCU, break input pins) and distribute them selectively to breakable modules
(TriCore, PCP, break output pins).
• Central Suspend Switch to suspend parts of the system (TriCore, PCP, Peripherals)
instead if breaking them as reaction to a debug event.
• Dedicated interrupt resources to handle debug events inside TriCore (breakpoint
trap, software interrupt) and Cerberus (can trigger PCP), e.g. for implementing
Monitor programs.
• Access to all OCDS Level 1 resources also for TriCore and PCP themselvesitself for
debug tools integrated into the application code.
• Triggered Transfer of data in response to a debug event; if target is programmed to
be a device interface simple variable tracing can be done.
Additionally, in depth performance analysis and profiling support is provided by the
Emulation Device through MCDS Event Counters driven by a variety of trigger signals
(e.g. cache hit, wait state, interrupt accepted).
2.5.2
Real Time Trace
For detailed tracing of the system’s behavior a pin-compatible Emulation Device is
available.1)
2.5.3
Calibration Support
Two main use cases are catered for by resources in addition the OCDS Level 1
infrastructure: Overlay of non-volatile on-chip memory and non-intrusive signaling:
• 8 KB SRAM for Overlay.
• Can be split into up to 16 blocks which can overlay independent regions of on-chip
Data Flash.
• Changing the configuration is triggered by a single SFR access to maintain
consistency.
• Overlay configuration switch does not require the TriCore to be stopped or
suspended.
1) The OCDS L2 interface of AudoNG is not available.
Data Sheet
50
V1.3, 2009-09
TC1767
Introduction
• Invalidation of the Data Cache (maintaining write-back data) can be done
concurrently with the same SFR.
• 256 KB additional Overlay RAM on Emulation Device.
• The 256 KB Trace memory of the Emulation Device can optionally be used for
Overlay also.
• A dedicated trigger SFR with 32 independent status bits is provided to centrally post
requests from application code to the host computer.
• The host is notified automatically when the trigger SFR is updated by the TriCore or
PCP. No polling via a system bus is required.
2.5.4
Tool Interfaces
Three options exist for the communication channel between Tools (e.g. Debugger,
Calibration Tool) and TC1767:
• Two wire DAP (Device Access Port) protocol for long connections or noisy
environments.
• Four (or five) wire JTAG (IEEE 1149.1) for standardized manufacturing tests.
• CAN (plus software linked into the application code) for low bandwidth deeply
embedded purposes.
• DAP and JTAG are clocked by the tool.
• Bit clock up to 40 MHz for JTAG, up to 80 MHz for DAP.
• Hot attach (i.e. physical disconnect/reconnect of the host connection without reset of
the TC1767) for all interfaces.
• Infineon standard DAS (Device Access Server) implementation for seamless,
transparent tool access over any supported interface.
• Lock mechanism to prevent unauthorized tool access to critical application code.
2.5.5
Self-Test Support
Some manufacturing tests can be invoked by the application (e.g. after power-on) if
needed:
• Hardware-accelerated checksum calculation (e.g. for Flash content).
2.5.6
FAR Support
To efficiently locate and identify faults after integration of a TC1767 into a system special
functions are available:
• Boundary Scan (IEEE 1149.1) via JTAG and DAP.
• SSCM (Single Scan Chain Mode1)) for structural scan testing of the chip itself.
1) This function requires access to some device pins (e.g. TESTMODE) in addition to those needed for OCDS.
Data Sheet
51
V1.3, 2009-09
TC1767
Pinning
3
Pinning
3.1
TC1767 Pin Definition and Functions
Figure 15 shows the Logic Symbol of the device.
PORST
TESTMODE
Alternate Functions
GPTA, SCU
General Control
16
ESR0
ESR1
Port 0
Port 1
Port 2
Port 3
Port 4
Port 5
Port 6
16
14
16
4
GPTA, SSC1,
ADC0, OCDS
GPTA, SSC0/1,
MLI0, MSC0
GPTA, ASC0/1,
SSC0/1, SCU, CAN
TRST
TCK / DAP0
TDI / BRKIN
OCDS /
JTAG Control
TDO / DAP2 /
BRKOUT
TMS / DAP1
GPTA, SCU
GPTA, MLI0
GPTA, MSC0
16
4
Analog Inputs
AN[35:0]
VDDM
TC1767
PG-LQFP-
176 -x
VSSM
VDDMF
VSSMF
VDDAF
VAREF0
VAGND0
VFAREF
Analog Power
Supply
XTAL1
XTAL2
VDDOSC Oscillator
VDDOSC3
VFAGND
VDDFL3
9
10
11
VDD
VDDP
VSS
Digital Circuitry
Power Supply
VSSOSC
TC1767_LogSym_176
Figure 15
TC1767 Logic Symbol for the package variant PG-LQFP-176-5.
Data Sheet
52
V1.3, 2009-09
TC1767
Pinning
3.1.1
TC1767 Pin Configuration: PG-LQFP-176-5
This chapter shows the pin configuration of the package variant PG-LQFP-176-51).
OUT40/OUT8/IN40/IN26/P5.0
OUT41/OUT9/IN41/IN27/P5.1
1
2
132
131
P3.4/OUT88/MTSR0
P3.7/SLSI01/OUT89//SLSO02/SLSO12
OUT42/OUT10/IN42/IN28/P5.2
OUT43/OUT11/IN43/P5.3
3
4
130
129
P3.3/OUT87/MRST0
P3.2/OUT86/SCLK0
OUT44/OUT12/IN44/IN29/P5.4
OUT45/OUT13/IN45/IN30/P5.5
5
6
128
127
P3.8/SLSO06/OUT90/TXD1
P3.6/SLSO01/SLSO11/SLSO01&SLSO11
OUT46/OUT14/IN46/IN31/P5.6
OUT47/OUT15/IN47/P5.7
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
P3.5/SLSO00/SLSO10/SLSO00&SLSO10
VSS
VDDP
VDD
TCLK0/OUT95/P5.15
VDD
VDDP
VSS
ESR0
PORST
ESR1
P1.1/IN17/OUT17/OUT73
TESTMODE
P1.15/BRKIN/BRKOUT
P1.0/IN16/OUT16/OUT72/BRKIN/BRKOUT
TCK/DAP0
TRST
TDO/DAP2/BRKIN/BRKOUT
TMS/DAP1
TDI/BRKIN/BRKOUT
P1.7/IN23/OUT23/OUT79
P1.6/IN22/OUT22/OUT78
P1.5/IN21/OUT21/OUT77
RDATA0B/OUT89/P5.8
RVALID0B/OUT90/P5.9
RREADY0B/OUT91/P5.10
RCLK0B/OUT92/P5.11
TDATA0/SLSO07/OUT93/P5.12
TVALID0B/SLSO16/P5.13
TREADY0B/OUT94/P5.14
VDDP
VDD(SB)
VSS
VDDAF
VDDM F
VSSMF
VFAREF
VFAG ND
AN35
AN34
TC1767
P1.4/IN20/EMGSTOP/OUT20/OUT76
VDDO SC3
VDDO SC
VSSO SC
105
104
AN33
AN32
AN31
AN30
AN29
AN28
30
31
32
33
34
35
103
102
101
100
99
98
XTAL2
XTAL1
VSS
VDDP
V
P1DD.3/IN19/OUT19/OUT75
AN7
AN27
AN26
36
37
38
97
96
95
P1.11/IN27/IN51/SCLK1B/OUT27/OUT51
P1.10/IN26/IN50/OUT26/OUT50/SLSO17
P1.9/IN25/IN49/MRST1B/OUT25/OUT49
AN25
AN24
39
40
94
93
P1.8/IN24/IN48/MTSR1B/OUT24/OUT48
P1.2/IN18/OUT18/OUT74
AN23
AN22
41
42
92
91
V SS
VDDP
AN21
AN20
43
44
90
89
P4.3/IN31/IN55/OUT31/OUT55/EXTCLK0
VDD
MCP06067
Figure 16
TC1767 Pinning for PG-LQFP-176-5
1) TC1767 ED: PG-LQFP-176-6
Data Sheet
53
V1.3, 2009-09
TC1767
Pinning
Table 4
Pin Symbol
Port 0
145 P0.0
IN0
Pin Definitions and Functions (PG-LQFP-176-5 Package1))
Ctrl. Type Function
I/O0 A1/
Port 0 General Purpose I/O Line 0
GPTA0 Input 0
PU
I
IN0
I
LTCA2 Input 0
HWCFG0
OUT0
I
Hardware Configuration Input 0
GPTA0 Output 0
O1
OUT56
OUT0
O2
GPTA0 Output 56
O3
LTCA2 Output 0
146 P0.1
IN1
I/O0 A1/
Port 0 General Purpose I/O Line 1
GPTA0 Input 1
PU
I
IN1
I
LTCA2 Input 1
HWCFG1
OUT1
I
Hardware Configuration Input 1
GPTA0 Output 1
O1
OUT57
OUT1
O2
GPTA0 Output 57
O3
LTCA2 Output 1
147 P0.2
IN2
I/O0 A1/
Port 0 General Purpose I/O Line 2
GPTA0 Input 2
PU
I
IN2
I
LTCA2 Input 2
HWCFG2
OUT2
I
Hardware Configuration Input 2
GPTA0 Output 2
O1
OUT58
OUT2
O2
GPTA0 Output 58
O3
LTCA2 Output 2
148 P0.3
IN3
I/O0 A1/
Port 0 General Purpose I/O Line 3
GPTA0 Input 3
PU
I
IN3
I
LTCA2 Input 3
HWCFG3
OUT3
I
Hardware Configuration Input 3
GPTA0 Output 3
O1
O2
O3
OUT59
OUT3
GPTA0 Output 59
LTCA2 Output 3
Data Sheet
54
V1.3, 2009-09
TC1767
Pinning
Table 4
Pin Symbol
166 P0.4
IN4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Ctrl. Type Function
I/O0 A1/
Port 0 General Purpose I/O Line 4
PU
I
GPTA0 Input 4
IN4
I
LTCA2 Input 4
HWCFG4
OUT4
I
Hardware Configuration Input 4
GPTA0 Output 4
O1
OUT60
OUT4
O2
GPTA0 Output 60
O3
LTCA2 Output 4
167 P0.5
IN5
I/O0 A1/
Port 0 General Purpose I/O Line 5
GPTA0 Input 5
PU
I
IN5
I
LTCA2 Input 5
HWCFG5
OUT5
I
Hardware Configuration Input 5
GPTA0 Output 5
O1
OUT61
OUT5
O2
GPTA0 Output 61
O3
LTCA2 Output 5
173 P0.6
IN6
I/O0 A1/
Port 0 General Purpose I/O Line 6
GPTA0 Input 6
PU
I
IN6
I
LTCA2 Input 6
HWCFG6
REQ2
I
Hardware Configuration Input 6
External Request Input 2
GPTA0 Output 6
I
OUT6
O1
OUT62
OUT6
O2
GPTA0 Output 62
O3
LTCA2 Output 6
174 P0.7
IN7
I/O0 A1/
Port 0 General Purpose I/O Line 7
GPTA0 Input 7
PU
I
IN7
I
LTCA2 Input 7
HWCFG7
REQ3
I
Hardware Configuration Input 7
External Request Input 3
GPTA0 Output 7
I
OUT7
O1
O2
O3
OUT63
OUT7
GPTA0 Output 63
LTCA2 Output 7
Data Sheet
55
V1.3, 2009-09
TC1767
Pinning
Table 4
Pin Symbol
149 P0.8
IN8
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Ctrl. Type Function
I/O0 A1/
Port 0 General Purpose I/O Line 8
PU
I
GPTA0 Input 8
IN8
I
LTCA2 Input 8
OUT8
O1
GPTA0 Output 8
OUT64
OUT8
O2
GPTA0 Output 64
LTCA2 Output 8
O3
150 P0.9
IN9
I/O0 A1/
Port 0 General Purpose I/O Line 9
GPTA0 Input 9
PU
I
IN9
I
LTCA2 Input 9
OUT9
O1
GPTA0 Output 9
OUT65
OUT9
O2
GPTA0 Output 65
LTCA2 Output 9
O3
151 P0.10
IN10
I/O0 A1/
Port 0 General Purpose I/O Line 10
GPTA0 Input 10
PU
I
OUT10
OUT66
OUT10
152 P0.11
IN11
O1
GPTA0 Output 10
GPTA0 Output 66
LTCA2 Output 10
O2
O3
I/O0 A1/
Port 0 General Purpose I/O Line 11
GPTA0 Input 11
PU
I
OUT11
OUT67
OUT11
168 P0.12
IN12
O1
GPTA0 Output 11
GPTA0 Output 67
LTCA2 Output 11
O2
O3
I/O0 A1/
Port 0 General Purpose I/O Line 12
GPTA0 Input 12
PU
I
OUT12
OUT68
OUT12
O1
O2
O3
GPTA0 Output 12
GPTA0 Output 68
LTCA2 Output 12
Data Sheet
56
V1.3, 2009-09
TC1767
Pinning
Table 4
Pin Symbol
169 P0.13
IN13
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Ctrl. Type Function
I/O0 A1/
Port 0 General Purpose I/O Line 13
PU
I
GPTA0 Input 13
OUT13
OUT69
OUT13
175 P0.14
IN14
O1
GPTA0 Output 13
O2
GPTA0 Output 69
O3
LTCA2 Output 13
I/O0 A1/
Port 0 General Purpose I/O Line 14
GPTA0 Input 14
PU
I
REQ4
I
External Request Input 4
GPTA0 Output 14
OUT14
OUT70
OUT14
176 P0.15
IN15
O1
O2
GPTA0 Output 70
O3
LTCA2 Output 14
I/O0 A1/
Port 0 General Purpose I/O Line 15
GPTA0 Input 15
PU
I
REQ5
I
External Request Input 5
GPTA0 Output 15
OUT15
OUT71
OUT15
Port 1
O1
O2
O3
GPTA0 Output 71
LTCA2 Output 15
116 P1.0
IN16
I/O0 A2/
Port 1 General Purpose I/O Line 0
GPTA0 Input 16
PU
I
BRKIN
I
Break Input
OUT16
OUT72
OUT16
BRKOUT
119 P1.1
IN17
O1
GPTA0 Output 16
O2
GPTA0 Output 72
O3
LTCA2 Output 16
O
Break Output (controlled by OCDS module)
Port 1 General Purpose I/O Line 1
GPTA0 Input 17
I/O0 A1/
PU
I
OUT17
OUT73
OUT17
O1
O2
O3
GPTA0 Output 17
GPTA0 Output 73
LTCA2 Output 17
Data Sheet
57
V1.3, 2009-09
TC1767
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Ctrl. Type Function
Pin Symbol
93
P1.2
I/O0 A1/
Port 1 General Purpose I/O Line 2
PU
IN18
I
GPTA0 Input 18
OUT18
OUT74
OUT18
P1.3
O1
GPTA0 Output 18
O2
GPTA0 Output 74
O3
LTCA2 Output 18
98
I/O0 A1/
Port 1 General Purpose I/O Line 3
GPTA0 Input 19
PU
IN19
I
IN19
I
LTCA2 Input 19
OUT19
OUT75
OUT19
O1
GPTA0 Output 19
O2
GPTA0 Output 75
O3
LTCA2 Output 19
107 P1.4
IN20
I/O0 A1/
Port 1 General Purpose I/O Line 4
GPTA0 Input 20
PU
I
IN20
I
LTCA2 Input 20
EMGSTOP
I
Emergency Stop Input
GPTA0 Output 20
OUT20
OUT76
OUT20
O1
O2
GPTA0 Output 76
O3
LTCA2 Output 20
108 P1.5
I/O0 A1/
Port 1 General Purpose I/O Line 35
GPTA0 Input 21
PU
IN21
I
IN21
I
LTCA2 Input 21
OUT21
OUT77
OUT21
O1
GPTA0 Output 21
O2
GPTA0 Output 77
O3
LTCA2 Output 21
109 P1.6
I/O0 A1/
Port 1 General Purpose I/O Line 6
GPTA0 Input 22
PU
IN22
I
IN22
I
LTCA2 Input 22
OUT22
OUT78
OUT22
O1
O2
O3
GPTA0 Output 22
GPTA0 Output 78
LTCA2 Output 22
Data Sheet
58
V1.3, 2009-09
TC1767
Pinning
Table 4
Pin Symbol
110 P1.7
IN23
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Ctrl. Type Function
I/O0 A1/
Port 1 General Purpose I/O Line 7
PU
I
GPTA0 Input 23
IN23
I
LTCA2 Input 23
OUT23
O1
GPTA0 Output 23
OUT79
O2
GPTA0 Output 79
OUT23
O3
LTCA2 Output 23
94
95
96
P1.8
I/O0 A2/
Port 1 General Purpose I/O Line 8
GPTA0 Input 24
PU
IN24
I
IN48
I
GPTA0 Input 48
MTSR1B
OUT24
OUT48
MTSR1B
P1.9
I
SSC1 Slave Receive Input B (Slave Mode)
GPTA0 Output 24
O1
O2
GPTA0 Output 48
O3
SSC1 Master Transmit Output B (Master Mode)
Port 1 General Purpose I/O Line 9
GPTA0 Input 25
I/O0 A2/
PU
IN25
I
IN49
I
GPTA0 Input 49
MRST1B
OUT25
OUT49
MRST1B
P1.10
I
SSC1 Master Receive Input B (Master Mode)
GPTA0 Output 25
O1
O2
GPTA0 Output 49
O3
SSC1 Slave Transmit Output B (Slave Mode)
Port 1 General Purpose I/O Line 10
GPTA0 Input 26
I/O0 A2/
PU
IN26
I
IN50
I
GPTA0 Input 50
OUT26
OUT50
SLSO17
O1
O2
O3
GPTA0 Output 26
GPTA0 Output 50
SSC1 Slave Select Output 7
Data Sheet
59
V1.3, 2009-09
TC1767
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Ctrl. Type Function
Pin Symbol
97
P1.11
I/O0 A2/
Port 1 General Purpose I/O Line 11
PU
IN27
I
GPTA0 Input 27
IN51
I
GPTA0 Input 51
SCLK1B
OUT27
OUT51
SCLK1B
P1.12
I
SSC1 Clock Input B
O1
GPTA0 Output 27
O2
GPTA0 Output 51
O3
SSC1 Clock Output B
73
72
71
I/O0 A1/
Port 1 General Purpose I/O Line 12
LTCA2 Input 16
PU
IN16
I
AD0EMUX0
AD0EMUX0
OUT16
P1.13
O1
ADC0 External Multiplexer Control Output 0
ADC0 External Multiplexer Control Output 0
LTCA2 Output 16
O2
O3
I/O0 A1/
Port 1 General Purpose I/O Line 13
LTCA2 Input 17
PU
IN17
I
AD0EMUX1
AD0EMUX1
OUT17
P1.14
O1
ADC0 External Multiplexer Control Output 1
ADC0 External Multiplexer Control Output 1
LTCA2 Output 17
O2
O3
I/O0 A1/
Port 1 General Purpose I/O Line 14
LTCA2 Input 18
PU
IN18
I
AD0EMUX2
AD0EMUX2
OUT18
O1
ADC0 External Multiplexer Control Output 2
ADC0 External Multiplexer Control Output 2
LTCA2 Output 18
O2
O3
117 P1.15
BRKIN
I/O0 A2/
Port 1 General Purpose I/O Line 15
Break Input
PU
I
Reserved
O1
O2
O3
O
-
Reserved
Reserved
BRKOUT
-
-
Break Output (controlled by OCDS module)
Port 2
Data Sheet
60
V1.3, 2009-09
TC1767
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Ctrl. Type Function
Pin Symbol
74
P2.0
I/O0 A2/
Port 2 General Purpose I/O Line 0
PU
IN32
I
GPTA0 Input 32
OUT32
TCLK0
OUT28
P2.1
O1
GPTA0 Output 32
O2
MLI0 Transmitter Clock Output 0
LTCA2 Output 28
O3
75
I/O0 A2/
Port 2 General Purpose I/O Line 1
GPTA0 Input 33
PU
IN33
I
TREADY0A
OUT33
SLSO03
SLSO13
P2.2
I
MLI0 Transmitter Ready Input A
GPTA0 Output 33
O1
O2
SSC0 Slave Select Output Line 3
SSC1 Slave Select Output Line 3
Port 2 General Purpose I/O Line 2
GPTA0 Input 34
O3
76
77
78
I/O0 A2/
PU
IN34
I
OUT34
TVALID0
OUT29
P2.3
O1
GPTA0 Output 34
O2
MLI0 Transmitter Valid Output
LTCA2 Output 29
O3
I/O0 A2/
Port 2 General Purpose I/O Line 3
GPTA0 Input 35
PU
IN35
I
OUT35
TDATA0
OUT30
P2.4
O1
GPTA0 Output 35
O2
MLI0 Transmitter Data Output
LTCA2 Output 30
O3
I/O0 A2/
Port 2 General Purpose I/O Line 4
GPTA0 Input 36
PU
IN36
I
RCLK0A
OUT36
OUT36
OUT31
I
MLI Receiver Clock Input A
GPTA0 Output 36
O1
O2
O3
GPTA0 Output 36
LTCA2 Output 31
Data Sheet
61
V1.3, 2009-09
TC1767
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Ctrl. Type Function
Pin Symbol
79
P2.5
I/O0 A2/
Port 2 General Purpose I/O Line 5
PU
IN37
I
GPTA0 Input 37
OUT37
RREADY0A
OUT110
P2.6
O1
GPTA0 Output 37
O2
MLI0 Receiver Ready Output A
LTCA2 Output 110
O3
80
I/O0 A2/
Port 2 General Purpose I/O Line 6
GPTA0 Input 38
PU
IN38
I
RVALID0A
OUT38
OUT38
OUT111
P2.7
I
MLI Receiver Valid Input A
GPTA0 Output 38
O1
O2
GPTA0 Output 38
O3
LTCA2 Output 111
81
I/O0 A2/
Port 2 General Purpose I/O Line 7
GPTA0 Input 39
PU
IN39
I
RDATA0A
OUT39
OUT39
Reserved
I
MLI Receiver Data Input A
GPTA0 Output 39
O1
O2
GPTA0 Output 39
O3
-
164 P2.8
SLSO04
I/O0 A2/
Port 2 General Purpose I/O Line 8
SSC0 Slave Select Output 4
SSC1 Slave Select Output 4
MSC0 Enable Output 0
Port 2 General Purpose I/O Line 9
SSC0 Slave Select Output 5
SSC1 Slave Select Output 5
MSC0 Enable Output 1
PU
O1
SLSO14
EN00
O2
O3
160 P2.9
I/O0 A2/
PU
SLSO05
SLSO15
EN01
O1
O2
O3
Data Sheet
62
V1.3, 2009-09
TC1767
Pinning
Table 4
Pin Symbol
161 P2.10
MRST1A
IN10
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Ctrl. Type Function
I/O0 A2/
Port 2 General Purpose I/O Line 10
PU
I
SSC1 Master Receive Input A
LTCA2 Input 10
I
MRST1A
OUT0
O1
SSC1 Slave Transmit Output
LTCA2 Output 0
O2
Reserved
162 P2.11
SCLK1A
IN11
O3
-
I/O0 A2/
Port 2 General Purpose I/O Line 11
SSC1 Clock Input A
LTCA2 Input 11
PU
I
I
SCLK1A
OUT1
O1
SSC1 Clock Output A
LTCA2 Output 1
O2
FCLP0B
163 P2.12
MTSR1A
IN12
O3
MSC0 Clock Output Positive B
Port 2 General Purpose I/O Line 12
SSC1 Slave Receive Input A
LTCA2 Input 12
I/O0 A2/
PU
I
I
MTSR1A
OUT2
O1
SSC1 Master Transmit Output A
LTCA2 Output 2
O2
SOP0B
O3
MSC0 Serial Data Output Positive B
Port 2 General Purpose I/O Line 13
SSC1 Slave Select Input 1
MSC0 Serial Data Input
LTCA2 Input 13
165 P2.13
SLSI11
I/O0 A1/
PU
I
SDI0
I
IN13
I
OUT3
O1
O2
O3
LTCA2 Output 3
Reserved
Reserved
Port 3
-
-
Data Sheet
63
V1.3, 2009-09
TC1767
Pinning
Table 4
Pin Symbol
136 P3.0
RXD0A
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Ctrl. Type Function
I/O0 A1/
Port 3 General Purpose I/O Line 0
PU
I
ASC0 Receiver Input A (Async. & Sync. Mode)
ASC0 Output (Sync. Mode)
RXD0A
O1
RXD0A
O2
ASC0 Output (Sync. Mode)
OUT84
O3
GPTA0 Output 84
135 P3.1
TXD0
I/O0 A1/
Port 3 General Purpose I/O Line 1
ASC0 Output
PU
O1
TXD0
O2
ASC0 Output
OUT85
O3
GPTA0 Output 85
129 P3.2
SCLK0
I/O0 A2/
Port 3 General Purpose I/O Line 2
SSC0 Clock Input (Slave Mode)
SSC0 Clock Output (Master Mode)
SSC0 Clock Input (Master Mode)
GPTA0 Output 86
PU
I
SCLK0
O1
SCLK0
O2
OUT86
O3
130 P3.3
MRST0
MRST0
MRST0
OUT87
I/O0 A2/
Port 3 General Purpose I/O Line 3
SSC0 Master Receive Input (Master Mode)
SSC0 Slave Transmit Output (Slave Mode)
SSC0 Slave Transmit Output (Slave Mode)
GPTA0 Output 87
PU
I
O1
O2
O3
132 P3.4
MTSR0
MTSR0
MTSR0
OUT88
I/O0 A2/
Port 3 General Purpose I/O Line 4
SSC0 Slave Receive Input (Slave Mode)
SSC0 Master Transmit Output (Master Mode)
SSC0 Master Transmit Output (Master Mode)
GPTA0 Output 88
PU
I
O1
O2
O3
126 P3.5
SLSO00
SLSO10
I/O0 A2/
Port 3 General Purpose I/O Line 5
SSC0 Slave Select Output 0
PU
O1
O2
SSC1 Slave Select Output 0
SLSOANDO0 O3
SSC0 AND SSC1 Slave Select Output 0
Data Sheet
64
V1.3, 2009-09
TC1767
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Ctrl. Type Function
Pin Symbol
127 P3.6
SLSO01
I/O0 A2/
Port 3 General Purpose I/O Line 6
PU
O1
SSC0 Slave Select Output 1
SSC1 Slave Select Output 1
SSC0 AND SSC1 Slave Select Output 1
Port 3 General Purpose I/O Line 7
SSC0 Slave Select Input 1
SSC0 Slave Select Output 2
SSC1 Slave Select Output 2
GPTA0 Output 89
SLSO11
O2
SLSOANDO1 O3
131 P3.7
SLSI01
I/O0 A2/
PU
I
SLSO02
SLSO12
OUT89
O1
O2
O3
128 P3.8
I/O0 A2/
Port 3 General Purpose I/O Line 8
SSC0 Slave Select Output 6
ASC1 Transmit Output
GPTA0 Output 90
PU
SLSO06
TXD1
O1
O2
OUT90
O3
138 P3.9
I/O0 A1/
Port 3 General Purpose I/O Line 9
ASC1 Receiver Input A
ASC1 Receiver Output A (Synchronous Mode)
ASC1 Receiver Output A (Synchronous Mode)
GPTA0 Output 91
PU
RXD1A
RXD1A
I
O1
RXD1A
O2
OUT91
O3
137 P3.10
REQ0
I/O0 A1/
Port 3 General Purpose I/O Line 10
External Request Input 0
-
PU
I
Reserved
Reserved
OUT92
O1
O2
-
O3
GPTA0 Output 92
144 P3.11
REQ1
I/O0 A1/
Port 3 General Purpose I/O Line 11
External Request Input 1
-
PU
I
Reserved
Reserved
OUT93
O1
O2
O3
-
GPTA0 Output 93
Data Sheet
65
V1.3, 2009-09
TC1767
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Ctrl. Type Function
Pin Symbol
143 P3.12
RXDCAN0
RXD0B
I/O0 A1/
Port 3 General Purpose I/O Line 12
PU
I
CAN Node 0 Receiver Input
ASC0 Receiver Input B
I
RXD0B
O1
ASC0 Receiver Output B (Synchronous Mode)
ASC0 Receiver Output B (Synchronous Mode)
GPTA0 Output 94
RXD0B
O2
OUT94
O3
142 P3.13
TXDCAN0
TXD0
I/O0 A2/
Port 3 General Purpose I/O Line 13
CAN Node 0 Transmitter Output
ASC0 Transmit Output
PU
O1
O2
OUT95
O3
GPTA0 Output 95
134 P3.14
RXDCAN1
RXD1B
I/O0 A1/
Port 3 General Purpose I/O Line 14
CAN Node 1 Receiver Input
ASC1 Receiver Input B
PU
I
I
RXD1B
O1
ASC1 Receiver Output B (Synchronous Mode)
ASC1 Receiver Output B (Synchronous Mode)
GPTA0 Output 96
RXD1B
O2
OUT96
O3
133 P3.15
TXDCAN1
TXD1
I/O0 A2/
Port 3 General Purpose I/O Line 15
CAN Node 1 Transmitter Output
ASC1 Transmit Output
PU
O1
O2
O3
OUT97
GPTA0 Output 97
Port 4
86
P4.0
I/O0 A1/
Port 4 General Purpose I/O Line 0
GPTA0 Input 28
GPTA0 Input 52
GPTA0 Output 28
GPTA0 Output 52
-
PU
IN28
I
IN52
I
OUT28
OUT52
Reserved
O1
O2
O3
Data Sheet
66
V1.3, 2009-09
TC1767
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Ctrl. Type Function
Pin Symbol
87
88
90
P4.1
I/O0 A1/
Port 4 General Purpose I/O Line 1
PU
IN29
I
GPTA0 Input 29
IN53
I
GPTA0 Input 53
OUT29
OUT53
Reserved
P4.2
O1
GPTA0 Output 29
GPTA0 Output 53
-
O2
O3
I/O0 A2/
Port 4 General Purpose I/O Line 2
GPTA0 Input 30
PU
IN30
I
IN54
I
GPTA0 Input 54
OUT30
OUT54
EXTCLK1
P4.3
O1
GPTA0 Output 30
GPTA0 Output 54
External Clock 1 Output
Port 4 General Purpose I/O Line 3
GPTA0 Input 31
O2
O3
I/O0 A2/
PU
IN31
I
IN55
I
GPTA0 Input 55
OUT31
OUT55
EXTCLK0
O1
O2
O3
GPTA0 Output 31
GPTA0 Output 55
External Clock 0 Output
Port 5
1
P5.0
I/O0 A1/
Port 5 General Purpose I/O Line 0
GPTA0 Input 40
LTCA2 Input 26
GPTA0 Output 40
LTCA2 Output 8
-
PU
IN40
I
IN26
I
OUT40
OUT8
Reserved
O1
O2
O3
Data Sheet
67
V1.3, 2009-09
TC1767
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Ctrl. Type Function
Pin Symbol
2
P5.1
I/O0 A1/
Port 5 General Purpose I/O Line 1
PU
IN41
I
GPTA0 Input 41
LTCA2 Input 27
GPTA0 Output 41
LTCA2 Output 9
-
IN27
I
OUT41
OUT9
Reserved
P5.2
O1
O2
O3
3
I/O0 A1/
Port 5 General Purpose I/O Line 2
GPTA0 Input 42
LTCA2 Input 28
GPTA0 Output 42
LTCA2 Output 10
-
PU
IN42
I
IN28
I
OUT42
OUT10
Reserved
P5.3
O1
O2
O3
4
5
I/O0 A1/
Port 5 General Purpose I/O Line 3
GPTA0 Input 43
GPTA0 Output 43
LTCA2 Output 11
-
PU
IN43
I
OUT43
OUT11
Reserved
P5.4
O1
O2
O3
I/O0 A1/
Port 5 General Purpose I/O Line 4
GPTA0 Input 44
LTCA2 Input 29
GPTA0 Output 44
LTCA2 Output 12
-
PU
IN44
I
IN29
I
OUT44
OUT12
Reserved
P5.5
O1
O2
O3
6
I/O0 A1/
Port 5 General Purpose I/O Line 5
GPTA0 Input 45
LTCA2 Input 30
GPTA0 Output 45
LTCA2 Output 13
-
PU
IN45
I
IN30
I
OUT45
OUT13
Reserved
O1
O2
O3
Data Sheet
68
V1.3, 2009-09
TC1767
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Ctrl. Type Function
Pin Symbol
7
P5.6
I/O0 A1/
Port 5 General Purpose I/O Line 6
PU
IN46
I
GPTA0 Input 46
IN31
I
LTCA2 Input 31
OUT46
OUT14
Reserved
P5.7
O1
GPTA0 Output 46
O2
LTCA2 Output 14
O3
-
8
I/O0 A1/
Port 5 General Purpose I/O Line 7
PU
IN47
I
GPTA0 Input 47
OUT47
OUT15
Reserved
P5.8
O1
GPTA0 Output 47
O2
LTCA2 Output 15
O3
-
13
14
I/O0 A2/
Port 5 General Purpose I/O Line 8
PU
RDATA0B
Reserved
Reserved
OUT89
P5.9
I
MLI0 Receiver Data Input B
O1
-
O2
-
O3
LTCA2 Output 89
I/O0 A2/
Port 5 General Purpose I/O Line 9
PU
RVALID0B
Reserved
Reserved
OUT90
P5.10
I
MLI0 Receiver Data Valid Input B
O1
-
O2
-
O3
LTCA2 Output 90
15
16
I/O0 A2/
Port 5 General Purpose I/O Line 10
PU
RREADY0B
Reserved
OUT91
P5.11
O1
MLI0 Receiver Ready Input B
O2
-
O3
LTCA2 Output 91
I/O0 A2/
Port 5 General Purpose I/O Line 11
PU
RCLK0B
Reserved
Reserved
OUT92
I
MLI0 Receiver Clock Input B
O1
O2
O3
-
-
LTCA2 Output 92
Data Sheet
69
V1.3, 2009-09
TC1767
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Ctrl. Type Function
Pin Symbol
17
18
19
P5.12
I/O0 A2/
Port 5 General Purpose I/O Line 12
PU
TDATA0
SLSO07
OUT93
O1
MLI0 Transmitter Data Output
SSC0 Slave Select Output 7
LTCA2 Output 93
O2
O3
P5.13
I/O0 A2/
Port 5 General Purpose I/O Line 13
MLI0 Transmitter Valid Input B
SSC1 Slave Select Output 6
-
PU
TVALID0B
SLSO16
Reserved
P5.14
O1
O2
O3
I/O0 A2/
Port 5 General Purpose I/O Line 14
MLI0 Transmitter Ready Input B
-
PU
TREADY0B
Reserved
Reserved
OUT94
I
O1
O2
-
O3
LTCA2 Output 94
9
P5.15
I/O0 A2/
Port 5 General Purpose I/O Line 15
MLI0 Transmitter Clock Output
-
PU
TCLK0
O1
Reserved
OUT95
O2
O3
LTCA2 Output 95
Port 6
156 P6.0
IN14
I/O0 A1/
Port 6 General Purpose I/O Line 0
LTCA2 Input 14
F/
I
PU
O1
FCLN0
MSC0 Clock Output Negative
GPTA0 Output 80
OUT80
OUT4
O2
O3
LTCA2 Output 4
157 P6.1
I/O0 A1/
Port 6 General Purpose I/O Line 1
LTCA2 Input 15
F/
IN15
I
PU
O1
FCLP0A
OUT81
OUT5
MSC0 Clock Output Positive A
GPTA0 Output 81
O2
O3
LTCA2 Output 5
Data Sheet
70
V1.3, 2009-09
TC1767
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Ctrl. Type Function
Pin Symbol
158 P6.2
IN24
I/O0 A1/
Port 6 General Purpose I/O Line 2
F/
I
LTCA2 Input 24
PU
O1
SON0
MSC0 Serial Data Output Negative
GPTA0 Output 82
OUT82
O2
OUT6
O3
LTCA2 Output 6
159 P6.3
IN25
I/O0 A1/
Port 6 General Purpose I/O Line 3
LTCA2 Input 25
F/
I
PU
O1
SOP0A
MSC0 Serial Data Output Positive A
GPTA0 Output 83
OUT83
O2
O3
OUT7
LTCA2 Output 7
Analog Input Port
67
66
65
64
63
62
61
36
60
59
58
57
56
55
50
49
48
47
46
AN0
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
Analog Input 0
Analog Input 1
Analog Input 2
Analog Input 3
Analog Input 4
Analog Input 5
Analog Input 6
Analog Input 7
Analog Input 8
Analog Input 9
Analog Input 10
Analog Input 11
Analog Input 12
Analog Input 13
Analog Input 14
Analog Input 15
Analog Input 16
Analog Input 17
Analog Input 18
AN1
AN2
AN3
AN4
AN5
AN6
AN7
AN8
AN9
AN10
AN11
AN12
AN13
AN14
AN15
AN16
AN17
AN18
Data Sheet
71
V1.3, 2009-09
TC1767
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Ctrl. Type Function
Pin Symbol
45
44
43
42
41
40
39
38
37
35
34
33
32
31
30
29
28
54
53
AN19
AN20
AN21
AN22
AN23
AN24
AN25
AN26
AN27
AN28
AN29
AN30
AN31
AN32
AN33
AN34
AN35
VDDM
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
-
-
-
-
-
-
-
-
-
-
-
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
-
Analog Input 19
Analog Input 20
Analog Input 21
Analog Input 22
Analog Input 23
Analog Input 24
Analog Input 25
Analog Input 26
Analog Input 27
Analog Input 28
Analog Input 29
Analog Input 30
Analog Input 31
Analog Input 32
Analog Input 33
Analog Input 34
Analog Input 35
ADC Analog Part Power Supply (3.3V - 5V)
ADC Analog Part Ground
ADC0 Reference Voltage
ADC1 Reference Voltage
ADC Reference Ground
FADC Analog Part Power Supply (3.3V)2)
FADC Analog Part Logic Power Supply (1.5V)
FADC Analog Part Ground
FADC Analog Part Ground
FADC Reference Voltage
FADC Reference Ground
VSSM
-
52, VAREF0
-
VAREF1
-
51
24
23
VAGND0
VDDMF
VDDAF
-
-
-
25, VSSMF
-
VSSAF
-
26
27
VFAREF
VFAGND
-
-
Data Sheet
72
V1.3, 2009-09
TC1767
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Ctrl. Type Function
- - Digital Core Power Supply (1.5V)
Pin Symbol
10, VDD
213),
68,
84,
89,
99,
123,
153,
170
11, VDDP
20,
-
-
Port Power Supply (3.3V)
69,
83,
91,
100,
124,
139,
154,
171
12, VSS
22,
-
-
Digital Ground
70,
82,
85,
92,
101,
125,
140,
155,
172
105 VDDOSC
106 VDDOSC3
104 VSSOSC
141 VDDFL3
102 XTAL1
103 XTAL2
-
-
-
-
-
Main Oscillator and PLL Power Supply (1.5V)
Main Oscillator Power Supply (3.3V)
Main Oscillator and PLL Ground
Power Supply for Flash (3.3V)
Main Oscillator Input
-
-
-
I
O
Main Oscillator Output
Data Sheet
73
V1.3, 2009-09
TC1767
Pinning
Table 4
Pin Definitions and Functions (PG-LQFP-176-5 Package1)) (cont’d)
Ctrl. Type Function
Pin Symbol
111 TDI
BRKIN
I
A2/
PU
JTAG Serial Data Input
OCDS Break Input Line
OCDS Break Output Line
JTAG State Machine Control Input
Device Access Port Line 1
JTAG Serial Data Output
Device Access Port Line 2
OCDS Break Input Line
OCDS Break Output Line
JTAG Reset Input
I
BRKOUT
112 TMS
DAP1
O
I
A2/
PD
I/O
I/O
I/O
I
113 TDO
DAP2
A2/
PU
BRKIN
BRKOUT
114 TRST
O
I
A1/
PD
115 TCK
DAP0
I
A1/
PD
JTAG Clock Input
I
Device Access Port Line 0
Test Mode Select Input
118 TESTMODE
120 ESR1
I
PU
I/O
A2/
PD
External System Request Reset Input 1
121 PORST
122 ESR0
I
PD
Power On Reset Input
(input pad with input spike-filter)
I/O
A2
External System Request Reset Input 0
Default configuration during and after reset is
open-drain driver, corresponding to A2 strong
driver, sharp edge. The driver drives low during
power-on reset.
1) TC1767 ED: PG-LQFP-176-6
2) This pin is also connected to the analog power supply for comparator of the ADC module.
3) For the TC1767 emulation device (ED), this pin is bonded to VDDSB (ED Stand By RAM supply). In the TC1767
non ED device, this pin is bonded to a VDD pad.
Legend for Table 4
Column “Ctrl.”:
I = Input (for GPIO port lines with IOCR bit field selection PCx = 0XXXB)
O = Output
O0 = Output with IOCR bit field selection PCx = 1X00B
O1 = Output with IOCR bit field selection PCx = 1X01B (ALT1)
Data Sheet
74
V1.3, 2009-09
TC1767
Pinning
O2 = Output with IOCR bit field selection PCx = 1X10B(ALT2)
O3 = Output with IOCR bit field selection PCx = 1X11(ALT3)
Column “Type”:
A1 = Pad class A1 (LVTTL)
A2 = Pad class A2 (LVTTL)
F = Pad class F (LVDS/CMOS)
D = Pad class D (ADC)
PU = with pull-up device connected during reset (PORST = 0)
PD = with pull-down device connected during reset (PORST = 0)
TR = tri-state during reset (PORST = 0)
3.1.2
Reset Behavior of the Pins
Table 5 describes the pull-up/pull-down behavior of the System I/O pins during power-
on reset.
Table 5
List of Pull-up/Pull-down PORST Reset Behavior of the Pins
Pins
PORST = 0
Pull-up
PORST = 1
All GPIOs, TDI, TESTMODE
PORST, TRST, TCK, TMS
ESR0
Pull-down
The open-drain driver is Pull-up2)
used to drive low.1)
ESR1
TDO
Pull-down3)
Pull-up
High-impedance
1) Valid additionally after deactivation of PORST until the internal reset phase has finished. See the SCU chapter
for details.
2) See the SCU_IOCR register description.
3) see the SCU_IOCR register description.
Data Sheet
75
V1.3, 2009-09
TC1767
Identification Registers
4
Identification Registers
The Identification Registers uniquely identify a module or the whole device.
Table 6
TC1767 Identification Registers
Short Name
ADC0_ID
ADC1_ID
ASC0_ID
ASC1_ID
CAN_ID
Value
Address
Stepping
0058 C000H
0058 C000H
0000 4402H
0000 4402H
002B C061H
0000 6350H
1015 9083H
0015 C007H
000A C006H
001A C004H
0008 C005H
0027 C003H
0053 C001H
0054 C003H
0029 C005H
000F C005H
000C C006H
002A C005H
001B C001H
0025 C007H
0028 C003H
0020 C006H
000B C005H
0050 C001H
0000 6A0CH
0000 9001H
0052 C001H
F010 1008H
F010 1408H
F000 0A08H
F000 0B08H
F000 4008H
F000 0408H
F000 0464H
F7E0 FF08H
F7E1 FE18H
F000 3C08H
F87F FC08H
F010 0408H
F800 2008H
F7E1 A020H
F000 1808H
F87F FE08H
F87F FF08H
F000 2808H
F010 C208H
F010 C008H
F000 0808H
F004 3F08H
F87F FD08H
F800 0508H
F000 0108H
F000 0640H
F000 0508H
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
CBS_JDPID
CBS_JTAGID
CPS_ID
CPU_ID
DMA_ID
DMI_ID
FADC_ID
FLASH0_ID
FPU_ID
GPTA0_ID
LBCU_ID
LFI_ID
LTCA2_ID
MCHK_ID
MLI0_ID
MSC0_ID
PCP_ID
PMI_ID
PMU0_ID
SBCU_ID
SCU_CHIPID
SCU_ID
Data Sheet
76
V1.3, 2009-09
TC1767
Identification Registers
Table 6
TC1767 Identification Registers (cont’d)
Short Name
SCU_MANID
SCU_RTID
SSC0_ID
SSC1_ID
STM_ID
Value
Address
Stepping
0000 1820H
0000 0007H
0000 4511H
0000 4511H
0000 C006H
F000 0644H
F000 0648H
F010 0108H
F010 0208H
F000 0208H
–
AD-step
–
–
–
Data Sheet
77
V1.3, 2009-09
TC1767
Electrical Parameters
5
Electrical Parameters
5.1
General Parameters
5.1.1
Parameter Interpretation
The parameters listed in this section partly represent the characteristics of the TC1767
and partly its requirements on the system. To aid interpreting the parameters easily
when evaluating them for a design, they are marked with an two-letter abbreviation in
column “Symbol”:
• CC
Such parameters indicate Controller Characteristics which are a distinctive feature of
the TC1767 and must be regarded for a system design.
• SR
Such parameters indicate System Requirements which must provided by the
microcontroller system in which the TC1767 designed in.
Data Sheet
78
V1.3, 2009-09
TC1767
Electrical Parameters
5.1.2
Pad Driver and Pad Classes Summary
This section gives an overview on the different pad driver classes and its basic
characteristics. More details (mainly DC parameters) are defined in the Section 5.2.1.
Table 7
Pad Driver and Pad Classes Overview
Class Power Type
Supply
Sub Class Speed Load Leakage1) Termination
Grade
A
3.3 V
LVTTL A1
6 MHz 100 pF 500 nA
No
I/O,
(e.g. GPIO)
LVTTL
outputs
A2
(e.g. serial
I/Os)
40
MHz
50 pF 6 µA
Series
termination
recommended
F
3.3 V
5 V
LVDS/
CMOS
–
50
MHz
–
–
–
–
Parallel
termination2),
100 Ω ± 10%
DE
ADC
–
–
see Table 12
1) Values are for TJmax = 150 °C.
2) In applications where the LVDSpins are not used (disabled), these pins must be either left unconnected, or
properly terminated with the differential parallel termination of 100 Ω ± 10%.
Data Sheet
79
V1.3, 2009-09
TC1767
Electrical Parameters
5.1.3
Absolute Maximum Ratings
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent
damage to the device. This is a stress rating only and functional operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
During absolute maximum rating overload conditions (VIN > related VDD or VIN < VSS) the
voltage on the related VDD pins with respect to ground (VSS) must not exceed the values
defined by the absolute maximum ratings.
Table 8
Absolute Maximum Rating Parameters
Symbol Values
Min. Typ. Max.
Parameter
Unit Note /
Test Con
dition
Ambient temperature
Storage temperature
Junction temperature
TA
TST
TJ
SR -40
–
–
–
–
125
150
150
2.25
°C
°C
°C
V
Under bias
SR -65
SR -40
–
Under bias
–
Voltage at 1.5 V power supply VDD
pins with respect to VSS
–
1)
SR
Voltage at 3.3 V power supply VDDP SR –
pins with respect to VSS
–
–
3.75
5.5
V
V
V
–
–
2)
Voltage at 5 V power supply VDDM SR –
pins with respect to VSS
Voltage on any Class A input VIN
pin and dedicated input pins
with respect to VSS
SR -0.5 –
V
DDP + 0.5
Whatever
is lower
or max. 3.7
Voltage on any Class D
analog input pin with respect VAREFx
to VAGND
VAIN
-0.5 –
V
V
DDM + 0.5
DDM + 0.5
V
V
–
–
SR
Voltage on any Class D
VAINF
-0.5 –
analog input pin with respect VFAREF
to VSSAF, if the FADC is
SR
switched through to the pin.
1) Applicable for VDD, VDDOSC, VDDPLL, and VDDAF
.
2) Applicable for VDDP, VDDFL3, and VDDMF
.
Data Sheet
80
V1.3, 2009-09
TC1767
Electrical Parameters
5.1.4
Operating Conditions
The following operating conditions must not be exceeded in order to ensure correct
operation of the TC1767. All parameters specified in the following table refer to these
operating conditions, unless otherwise noted.
Table 9
Operating Condition Parameters
Symbol Values
Typ. Max.
Parameter
Unit Note /
Test Condition
Min.
Digital supply voltage1) VDD
SR 1.42
–
1.582)
V
V
–
VDDOSC SR
VDDP
SR 3.13
–
3.473)
For Class A pins
V
DDOSC3 SR
(3.3 V ± 5%)
VDDFL3 SR 3.13
Analog supply voltages VDDMF SR 3.13
VDDAF SR 1.42
–
–
–
–
3.473)
3.473)
1.582)
5.25
V
V
V
V
–
FADC
FADC
VDDM
SR 4.75
For Class DE
pins, ADC
Digital ground voltage
VSS
TA
SR 0
SR –
–
–
V
–
–
Ambient temperature
under bias
-40 +125 °C
Analog supply voltages –
–
–
–
–
See separate
specification
Page 88,
Page 93
4)
Overload current at
class D pins
IOV
-1
–
–
–
3
mA
Sum of overload current Σ|IOV|
10
mA per single ADC
at class D pins
Overload coupling
KOVAP
KOVAN
–
–
–
–
–
5×10-5
5×10-4
0 < IOV < 3 mA
-1 mA < IOV < 0
factor for analog inputs5)
CPU & LMB Bus
Frequency
fCPU SR
fPCP SR
fSYS SR
–
–
–
133
80
MHz Derivative
dependent
MHz 6)Derivative
dependent
PCP Frequency
–
133
80
6)
FPI Bus Frequency
Short circuit current
–
–
80
+5
MHz
7)
ISC
SR -5
mA
Data Sheet
81
V1.3, 2009-09
TC1767
Electrical Parameters
Table 9
Operating Condition Parameters
Symbol Values
Typ. Max.
Parameter
Unit Note /
Test Condition
Min.
Absolute sum of short
circuit currents of a pin
group (see Table 10)
Σ|ISC_PG
|
–
–
20
mA See note
SR
Inactive device pin
current
IID
SR -1
–
–
1
mA All power supply
voltages VDDx = 0
mA See note4)
Absolute sum of short
circuit currents of the
device
Σ|ISC_D
|
–
100
SR
External load
capacitance
CL
SR –
–
–
pF
Dependingonpin
class. See DC
characteristics
1) Digital supply voltages applied to the TC1767 must be static regulated voltages which allow a typical voltage
swing of ±5%.
2) Voltage overshoot up to 1.7 V is permissible at Power-Up and PORST low, provided the pulse duration is less
than 100 µs and the cumulated summary of the pulses does not exceed 1 h.
3) Voltage overshoot up to 4 V is permissible at Power-Up and PORST low, provided the pulse duration is less
than 100 µs and the cumulated summary of the pulses does not exceed 1 h.
4) See additional document “TC1767 Pin Reliability in Overload“ for definition of overload current on digital pins.
5) The overload coupling factor (kA) defines the worst case relation of an overload condition (IOV) at one pin to
the resulting leakage current (IleakTOT) into an adjacent pin: IleakTOT = ±kA × |IOV| + IOZ1.
Thus under overload conditions an additional error leakage voltage (VAEL) will be induced onto an adjacent
analog input pin due to the resistance of the analog input source (RAIN). That means VAEL = RAIN ×
|IleakTOT|.
The definition of adjacent pins is related to their order on the silicon.
The Injected leakage current always flows in the opposite direction from the causing overload current.
Therefore, the total leakage current must be calculated as an algebraic sum of the both component leakage
currents (the own leakage current IOZ1 and the optional injected leakage current).
6) The PLL jitter characteristics add to this value according to the application settings. See the PLL jitter
parameters.
7) Applicable for digital outputs.
Table 10
Pin Groups for Overload/Short-Circuit Current Sum Parameter
Pins
Group
1
2
3
4
P5.[14:8]
P1.[14:12]; P2.[7:0]
P4.[3:0]
P1.[3:2]; P1.[11:8]
Data Sheet
82
V1.3, 2009-09
TC1767
Electrical Parameters
Table 10
Group
5
Pin Groups for Overload/Short-Circuit Current Sum Parameter
Pins
P1.[7:4]; TDI/BRKIN/BRKOUT; TRST, TCK/DAP0; P1.[1:0]; P1.15;
TESTMODE; ESR0; PORST; ESR1
6
7
8
9
P3.[10:0]; P3.[15:14]
P3.[13:11]; P0.[3:0]; P0.[11:8]
P6.[3:0]; P2.[13:8]; P0.[5:4]; P0.[13:12]
P0.[7:6]; P0.[15:14]; P5.[7:0]; P5.15
Data Sheet
83
V1.3, 2009-09
TC1767
Electrical Parameters
5.2
DC Parameters
5.2.1
Input/Output Pins
Table 11
Input/Output DC-Characteristics (Operating Conditions apply)
Parameter
Symbol
Values
Unit Note / Test Condition
Min.
Typ. Max.
General Parameters
Pull-up current1)
|IPUH
|
10
10
–
–
–
–
100
150
10
µA VIN < VIHAmin
;
CC
CC
CC
class A1/A2/F/Input pads.
Pull-down
current1)
Pin capacitance1) CIO
|IPDL
|
µA VIN >VILAmax
;
class A1/A2/F/Input pads.
pF f = 1 MHz
(Digital I/O)
TA = 25 °C
Input only Pads (VDDP = 3.13 to 3.47 V = 3.3 V ± 5%)
Input low voltage VILI
-0.3
–
0.36 ×
VDDP
V
V
–
SR
Input high voltage VIHI
0.62 × –
VDDP+
Whatever is lower
SR VDDP
0.3 or
max.
3.6
Ratio VIL/VIH
CC 0.58
–
–
–
–
Input high voltage VIHJ
TRST, TCK
0.64 × –
SR VDDP
VDDP
+
V
Whatever is lower
0.3 or
max.
3.6
4)
Input hysteresis
HYSI
0.1 ×
CC VDDP
–
–
–
V
Input leakage
current2)
IOZI
–
±3000 nA ((VDDP/2)-1) < VIN <
CC
±6000
((VDDP/2)+1)
Otherwise
Spike filter always tSF1
blocked pulse
duration
–
–
10
ns
CC
Data Sheet
84
V1.3, 2009-09
TC1767
Electrical Parameters
Table 11
Input/Output DC-Characteristics (cont’d)(Operating Conditions apply)
Parameter
Symbol
Values
Unit Note / Test Condition
Min.
Typ. Max.
Spike filter pass- tSF2
through pulse
100
–
–
ns
CC
duration
Class A Pads (VDDP = 3.13 to 3.47 V = 3.3V ± 5%)
Outputlowvoltage VOLA
–
–
0.4
V
V
V
IOL = 2 mA for medium
and strong driver mode,
IOL = 500 µA for weak
driver mode
2)3)
CC
Output high
voltage2) 3)
VOHA
2.4
–
–
I
OH = -2 mA for medium
and strong driver mode,
OH = -500 µA for weak
driver mode
OH = -1.4 mA for medium
and strong driver mode,
OH = -400 µA for weak
CC
I
V
0.4
DDP - –
–
I
I
driver mode
Input low voltage VILA
Class A1/2 pins
-0.3
–
0.36 ×
VDDP
V
V
–
SR
Input high voltage VIHA1
0.62 × –
VDDP+
Whatever is lower
Class A1 pins
SR VDDP
0.3 or
max.
3.6
Ratio VIL/VIH
SR 0.58
–
–
–
–
Input high voltage VIHA2
Class A2 pins
0.60 × –
SR VDDP
VDDP
+
V
Whatever is lower
0.3 or
max.
3.6
Ratio VIL/VIH
CC 0.60
–
–
–
–
–
–
4)
Input hysteresis
HYSA
0.1 ×
V
CC VDDP
Input leakage
current Class A2
pins
IOZA2
–
–
±3000 nA ((VDDP/2)-1) < VIN <
((VDDP/2)+1)
±6000
Otherwise2)
Data Sheet
85
V1.3, 2009-09
TC1767
Electrical Parameters
Table 11
Input/Output DC-Characteristics (cont’d)(Operating Conditions apply)
Parameter
Symbol
Values
Unit Note / Test Condition
Min.
Typ. Max.
Input leakage
current
IOZA1
–
–
±500
nA 0 V <VIN < VDDP
CC
Class A1 pins
Class F Pads, LVDS Mode (VDDP = 3.13 to 3.47 V = 3.3V ± 5%)
Output low voltage VOL CC 875
–
–
–
–
–
mV Parallel termination
100 Ω ± 1%
Output high
voltage
VOH CC
1525
400
mV Parallel termination
100 Ω ± 1%
Output differential VOD CC 150
voltage
mV Parallel termination
100 Ω ± 1%
Output offset
voltage
VOS CC 1075
1325
140
mV Parallel termination
100 Ω ± 1%
Output impedance R0 CC 40
Ω
–
Class F Pads, CMOS Mode (VDDP = 3.13 to 3.47 V = 3.3V ± 5%)
Input low voltage VILF
-0.3
–
0.36 ×
V
–
Class F pins
SR
VDDP
Input high voltage VIHF
0.6 ×
–
VDDP+
V
Whatever is lower
Class F pins
SR VDDP
0.3 or
max 3.6
Input hysteresis
Class F pins
HYSF
0.05 × –
–
V
CC VDDP
Input leakage
current Class F
pins
IOZF
–
–
±3000 nA ((VDDP/2)-1) < VIN <
((VDDP/2)+1)
±6000
CC
Otherwise2)
Output low voltage VOLF
–
–
–
0.4
V
IOL = 2 mA
5)
CC
CC
Output high
voltage2) 5)
VOHF
2.4
–
–
V
V
I
I
OH = -2 mA
V
DDP - –
OH = -1.4 mA
0.4
Class D Pads
See ADC Characteristics
–
–
–
–
–
1) Not subject to production test, verified by design / characterization.
2) Only one of these parameters is tested, the other is verified by design characterization
Data Sheet
86
V1.3, 2009-09
TC1767
Electrical Parameters
3) Maximum resistance of the driver RDSON, defined for P_MOS / N_MOS transistor separately:
25 / 20 Ω for strong driver mode, IOH / L < 2 mA,
200 / 150 Ω for medium driver mode, IOH / L < 400 uA,
600 / 400 Ω for weak driver mode, IOH / L < 100 uA,
verified by design / characterization.
4) Function verified by design, value verified by design characterization.
Hysteresis is implemented to avoid metastable states and switching due to internal ground bounce.
It cannot be guaranteed that it suppresses switching due to external system noise.
5) The following constraint applies to an LVDS pair used in CMOS mode: only one pin of a pair should be used
as output, the other should be used as input, or both pins should be used as inputs. Using both pins as outputs
is not recommended because of the higher crosstalk between them.
Data Sheet
87
V1.3, 2009-09
TC1767
Electrical Parameters
5.2.2
Analog to Digital Converters (ADC0/ADC1)
All ADC parameters are optimized for and valid in the range of VDDM = 5V ± 5%.
Table 12
ADC Characteristics (Operating Conditions apply)
Symbol Values Unit Note /
Test Condition
Parameter
Min.
Typ. Max.
Analog supply
voltage
VDDM SR 4.75
5
5.25
V
V
V
–
3.13
3.3
1.5
3.471)
1.582)
–
VDD
SR 1.42
Power supply for
ADC digital part,
internal supply
Analog ground
voltage
VSSM SR -0.1
–
0.1
V
V
–
Analogreference VAREFx SR VAGNDx+1 VDDM VDDM
voltage14)
0.05
+
–
V
1)3)4)
Analogreference VAGNDx SR VSSMx
-
0
–
–
V
1V
AREF - V
–
–
–
ground14)
0.05V
Analog input
voltage range
VAIN
SR VAGNDx
VAREFx
V
Analogreference VAREFx
-
V
DDM/2
VDDM + V
0.05
voltage range5)14) VAGNDx SR
Converter Clock fADC SR
1
–
–
80
10
MHz –
MHz –
Internal ADC
clocks
fADCI
CC 0.5
Sample time
tS
CC 2
–
–
257
TADCI –
Total unadjusted TUE6) CC –
±4
LSB 12-bit conversion,
without noise7)8)
error5)
–
–
–
–
±2
±1
LSB 10-bit conversion8)
LSB 8-bit conversion8)
DNL error9) 5)
INL error9)5)
Gain error9)5)
EADNL
EAINL
–
–
–
±1.5 ±3.0
±1.5 ±3.0
±0.5 ±3.5
LSB 12-bit conversion
without noise8)10)
CC
CC
CC
LSB 12-bit conversion
without noise8)10)
EAGAIN
LSB 12-bit conversion
without noise8)10)
Data Sheet
88
V1.3, 2009-09
TC1767
Electrical Parameters
Table 12
ADC Characteristics (cont’d) (Operating Conditions apply)
Parameter
Symbol
Values
Typ. Max.
±1.0 ±4.0
Unit Note /
Test Condition
Min.
Offset error9)5)
EAOFF
–
LSB 12-bit conversion
without noise8)10)
CC
Input leakage
current at analog
IOZ1 CC
-300
-100
-100
–
–
–
–
100
200
300
±1.5
nA
nA
nA
µA
(0% VDDM) < VIN <
(3% VDDM
(3% VDDM) < VIN <
(97% VDDM
(97% VDDM) < VIN <
)
inputs of ADC0/1
11) 12) 13)
)
(100% VDDM
)
Input leakage
current at
IOZ2
CC –
0 V < VAREF
<
V
DDM, noconversion
VAREF0/1
,
running
per module
Input current at IAREF CC –
35
20
75
40
µA
0 V < VAREF
<
14)
15)
VAREF0/1
,
rms VDDM
per module
8)
Total
CAREFTOT
–
–
pF
capacitance of
the voltage
reference
inputs16)14)
CC
8)17)
Switched
CAREFSW
15
30
pF
capacitance at
the positive
reference
CC
voltage input14)
Resistance of
the reference
voltage input
path16)
RAREF
–
–
500
25
1000
30
Ω
500 Ohm increased
for AN[1:0] used as
reference input8)
CC
CC
1)8)
Total
CAINTOT
pF
capacitance of
the analog
inputs16)
Data Sheet
89
V1.3, 2009-09
TC1767
Electrical Parameters
Table 12
ADC Characteristics (cont’d) (Operating Conditions apply)
Parameter
Symbol
Values
Typ. Max.
Unit Note /
Test Condition
Min.
8)18)
Switched
CAINSW
–
7
20
pF
capacitance at
the analog
CC
voltage inputs
8)
ON resistance of RAIN
the transmission
gates in the
CC –
700
1500
Ω
analog voltage
path
ON resistance
for the ADC test
(pull-down for
AIN7)
RAIN7T CC 180
550
90019)
Ω
Test feature
available only for
AIN7 8) 20)
Current through IAIN7T CC –
resistanceforthe
ADC test (pull-
15
rms
30
peak
mA
Test feature
available only for
AIN78)
down for AIN7)
1) Voltage overshoot up to 4 V is permissible at Power-Up and PORST low, provided the pulse duration is less
than 100 µs and the cumulated summary of the pulses does not exceed 1 h.
2) Voltage overshoot up to 1.7 V is permissible at Power-Up and PORST low, provided the pulse duration is less
than 100 µs and the cumulated summary of the pulses does not exceed 1 h.
3) A running conversion may become inexact in case of violating the normal operating conditions (voltage
overshoot).
4) If
the
reference
voltage
VAREF
increases
or
the
VDDM
decreases,
so
that
VAREF = (VDDM + 0.05 V to VDDM + 0.07 V), then the accuracy of the ADC decreases by 4 LSB12.
5) If a reduced reference voltage in a range of VDDM/2 to VDDM is used, then the ADC converter errors increase.
If the reference voltage is reduced with the factor k (k<1), then TUE, DNL, INL Gain and Offset errors increase
with the factor 1/k.
If a reduced reference voltage in a range of 1 V to VDDM/2 is used, then there are additional decrease in the
ADC speed and accuracy.
6) TUE is tested at VAREF = 5.0 V, VAGND = 0 V and VDDM = 5.0 V
7) ADC module capability.
8) Not subject to production test, verified by design / characterization.
9) The sum of DNL/INL/Gain/Offset errors does not exceed the related TUE total unadjusted error.
10) For 10-bit conversions the DNL/INL/Gain/Offset error values must be multiplied with factor 0.25.
For 8-bit conversions the DNL/INL/Gain/Offset error values must be multiplied with 0.0625.
11) The leakage current definition is a continuous function, as shown in Figure 19. The numerical values defined
determine the characteristic points of the given continuous linear approximation - they do not define step
function.
Data Sheet
90
V1.3, 2009-09
TC1767
Electrical Parameters
12) Only one of these parameters is tested, the other is verified by design characterization.
13) The leakage current decreases typically 30% for junction temperature decrease of 10oC.
14) Applies to AINx, when used as auxiliary reference inputs.
15) IAREF_MAX is valid for the minimum specified conversion time. The current flowing during an ADC conversion
with a duration of up to tC = 25µs can be calculated with the formula IAREF_MAX = QCONV/tC. Every conversion
needs a total charge of QCONV = 150pC from VAREF
.
All ADC conversions with a duration longer than tC = 25µs consume an IAREF_MAX = 6µA.
16) For the definition of the parameters see also Figure 18.
17) This represents an equivalent switched capacitance. This capacitance is not switched to the reference voltage
at once. Instead of this smaller capacitances are successively switched to the reference voltage.
18) The sampling capacity of the conversion C-Network is pre-charged to VAREF/2 before the sampling moment.
Because of the parasitic elements the voltage measured at AINx can deviate from VAREF/2, and is typically
1.35V.
19) RAIN7T = 1400 Ohm maximum and 830 Ohm typical in the VDDM = 3.3V± 5% range.
20) The DC current at the pin is limited to 3 mA for the operational lifetime.
clock
generation
ADC kernel
f
ADC
interrupts,
etc.
divider for
divider for
fADCI
f
ADCD
digital clock
analog clock
f
ADCI
f
ADCD
registers
analog part
arbiter
ADC_clocking
Figure 17
ADC0/ADC1 Clock Circuit
Data Sheet
91
V1.3, 2009-09
TC1767
Electrical Parameters
Table 13
Conversion Time (Operating Conditions apply)
Symbol Value
Parameter
Unit Note
Conversion
time with
tC CC 2 × TADC + (4 + STC + n) × TADCI µs
n = 8, 10, 12 for
n - bit conversion
post-calibration
T
T
ADC = 1 / fADC
ADCI = 1 / fADCI
Conversion
2 × TADC + (2 + STC + n) × TADCI
time without
post-calibration
Analog Input Circuitry
RAIN, On
REXT
ANx
VAIN
CEXT
CAINSW
=
C
AINTOT - CAINSW
VAGNDx
RAIN7T
Reference Voltage Input Circuitry
RAREF, On
VAREFx
VAREF
C
AREFTOT - CAREFSW
CAREFSW
VAGNDx
Analog_InpRefDiag
Figure 18
ADC0/ADC1 Input Circuits
Io z 1
3 0 0 n A
2 0 0 n A
1 0 0 n A
V IN [V D D M % ]
-1 0 0 n A
-3 0 0 n A
3 %
9 7 % 1 0 0 %
A D C L e a k a g e 1 0 .v s d
Figure 19
ADC0/ADC1Analog Inputs Leakage
Data Sheet
92
V1.3, 2009-09
TC1767
Electrical Parameters
5.2.3
Fast Analog to Digital Converter (FADC)
All parameters apply to FADC used in differential mode, which is the default and the
intended mode of operation, and which takes advantage of many error cancelation
effects inherent to differential measurements in general.
Table 14
FADC Characteristics (Operating Conditions apply)
Parameter
Symbol
Values
Unit Note /
Test Condition
Min.
Typ. Max.
9)
DNL error
EFDNL CC –
EFINL CC –
–
–
–
±1
±4
±5
LSB
LSB
%
9)
INL error
Gradient error9)
EFGRAD
–
Without calibration
gain 1, 2, 4
CC
–
–
±6
%
Without calibration
gain 8
Offset error9)1)
EFOFF
EFREF
–
–
–
–
–
–
±203)
±903)
±60
mV
mV
mV
With calibration1)
Without calibration
–
2)
CC
Reference error of
internal VFAREF/2
CC
Analog supply
voltages
VDDMF SR 3.13
VDDAF SR 1.42
–
–
–
3.474)
1.585)
0.1
V
V
V
–
–
–
Analog ground
voltage
VSSAF
-0.1
SR
SR
Analog reference
voltage
VFAREF
VFAGND
3.13
–
3.474)6)
V
Nominal 3.3 V
Analog reference
ground
V
SSAF - –
V
SSAF + V
–
–
SR 0.05 V
0.05 V
Analog input voltage VAINF
VFAGND
–
VDDMF
V
range
SR
Analog supply
currents
IDDMF SR –
IDDAF SR –
–
–
–
10
mA
mA
–
7)
10
Input current at
VFAREF
IFAREF
–
–
–
120
µA
rms
Independent of
conversion
CC
CC
CC
Input leakage current IFOZ2
–
–
±500
±8
nA
0 V < VIN < VDDMF
8)
at VFAREF
Input leakage current IFOZ3
µA
0 V < VIN < VDDMF
8)
at VFAGND
Data Sheet
93
V1.3, 2009-09
TC1767
Electrical Parameters
Table 14
FADC Characteristics (Operating Conditions apply) (cont’d)
Parameter
Symbol
Values
Unit Note /
Test Condition
Min.
C_FADC CC –
Typ. Max.
Conversion time
t
–
21
CLK For 10-bit conv.
of
fFADC
Converter clock
fFADC SR 10
–
–
80
MHz
–
9)
Input resistance of
the analog voltage
path (Rn, Rp)
RFAIN
100
200
kΩ
CC
Channel amplifier
cutoff frequency9)
fCOFF
tSET
2
–
–
–
5
MHz
–
–
CC
Settling time of a
channel amplifier
(after changing
channel amplifier
input)9)
CC –
µs
1) Calibration should be performed at each power-up. In case of continuous operation, calibration should be
performed minimum once per week, or on regular basis in order to compensate for temperature changes.
2) The offset error voltage drifts over the whole temperature range maximum ±6 LSB.
3) Applies when the gain of the channel equals one. For the other gain settings, the offset error increases; it must
be multiplied with the applied gain.
4) Voltage overshoots up to 4 V are permissible, provided the pulse duration is less than 100 µs and the
cumulated summary of the pulses does not exceed 1 h.
5) Voltage overshoots up to 1.7 V are permissible, provided the pulse duration is less than 100 µs and the
cumulated sum of the pulses does not exceed 1 h.
6) A running conversion may become inexact in case of violating the normal operating conditions (voltage
overshoots).
7) Current peaks of up to 40 mA with a duration of max. 2 ns may occur
8) This value applies in power-down mode.
9) Not subject to production test, verified by design / characterization.
The calibration procedure should run after each power-up, when all power supply
voltages and the reference voltage have stabilized.
Data Sheet
94
V1.3, 2009-09
TC1767
Electrical Parameters
FADC Analog Input Stage
RN
FAINxN
-
+
VFAREF/2
VFAGND
+
RP
FAINxP
-
FADC Reference Voltage
Input Circuitry
VFAREF
IFAREF
VFAREF
VFAGND
FADC_InpRefDiag
Figure 20
FADC Input Circuits
Data Sheet
95
V1.3, 2009-09
TC1767
Electrical Parameters
5.2.4
Oscillator Pins
Table 15
Oscillator Pins Characteristics (Operating Conditions apply)
Parameter
Symbol
Values
Unit Note /
Test Condition
Min.
fOSC CC 8
Typ. Max.
Frequency range
–
–
–
–
25
MHz External Crystal
Mode selected
Input low voltage at VILX SR -0.2
0.3 ×
VDDOSC3
V
–
XTAL11)
Input high voltage at VIHX SR 0.7 ×
VDDOSC3
+ 0.2
V
–
XTAL11)
VDDOSC3
Input current at
XTAL1
IIX1 CC –
±25
µA
0 V < VIN < VDDOSC3
1) If the XTAL1 pin is driven by a crystal, reaching a minimum amplitude (peak-to-peak) of 0.3 × VDDOSC3 is
sufficient.
Note: It is strongly recommended to measure the oscillation allowance (negative
resistance) in the final target system (layout) to determine the optimal parameters
for the oscillator operation. Refer to the limits specified by the crystal supplier.
5.2.5
Temperature Sensor
Table 16
Temperature Sensor Characteristics (Operating Conditions apply)
Parameter
Symbol
Values
Unit Note /
Test Condition
Min. Typ. Max.
Temperature sensor range TSR SR -40
150 °C
Junction
temperature
Temperature sensor
measurement time
tTSMT SR –
–
100 µs
–
Start-up time after reset
Sensor accuracy
tTSST SR –
TTSA CC –
–
–
10
µs
–
±6
°C
Calibrated
Data Sheet
96
V1.3, 2009-09
TC1767
Electrical Parameters
The following formula calculates the temperature measured by the DTS in [oC] from the
RESULT bitfield of the DTSSTAT register.
(1)
DTSSTATRESULT – 619
Tj = -----------------------------------------------------------------
2, 28
Data Sheet
97
V1.3, 2009-09
TC1767
Electrical Parameters
5.2.6
Power Supply Current
The default test conditions (differences explicitly specified) are:
DD = 1.58 V, VDDP = 3.47 V, Tj=150oC. All other operating conditions apply.
V
Table 17
Power Supply Currents, Maximum Power Consumption
Parameter
Symbol
Values
Unit Note /
Test Condition
Min. Typ. Max.
Core active mode
supply current 1) 2)
IDD
CC –
–
–
–
–
–
330
230
10
mA
mA
mA
mA
f
CPU=133 MHz
fCPU/fSYS = 2:1
Realistic core active
–
VDD = 1.53 V,
mode supply current 3)4)
TJ = 150oC
FADC 3.3 V analog
supply current
IDDMF
IDDAF
CC –
CC –
–
4)
FADC 1.5 V analog
supply current
10
–
Flash memory 3.3 V
supply current
IDDFL3R CC –
60
mA continuously
reading the Flash
memory 5)
IDDFL3E CC –
–
61
mA Flash memory
erase-verify6)
4)
Oscillator 1.5 V supply IDDOSC CC
Oscillator 3.3 V supply IDDOSC3 CC
–
–
–
–
–
–
3
mA
mA
–
–
4)
–
–
10
15
16
34
LVDS 3.3 V supply
ILVDS
IDDP
mA in total for two pairs
4) 7)
Pad currents,sum of
CC –
mA
mA
–
V
DDP 3.3 V supplies
IDDP_FP CC –
I
DDP including Data
Flash programming
current 4) 8)
ADC 5 V power supply IDDM
CC –
SR –
2
3
mA ADC0 / 1
Maximum Average
Power Dissipation1)
PD
820 990
mW worst case
TA = 125oC,
PD × RΘJA < 25oC
1) Infineon Power Loop: CPU and PCP running, all peripherals active. The power consumption of each custom
application will most probably be lower than this value, but must be evaluated separately..
2) The IDD maximum value is 275 mA at fCPU = 80 MHz, constant TJ = 150oC, for the Infineon Max Power Loop.
The dependency in this range is, at constant junction temperature, linear.
fCPU/fSYS = 1:1 mode.
Data Sheet
98
V1.3, 2009-09
TC1767
Electrical Parameters
3) The IDD maximum value is 180 mA at fCPU = 80 MHz, constant TJ = 150oC, for the Realistic Pattern.
The dependency in this range is, at constant junction temperature, linear.
CPU/fSYS = 1:1 mode.
f
4) Not tested in production separately, verified by design / characterization.
5) This value assumes worst case of reading flash line with all cells erased. In case of 50% cells written with “1”
and 50% cells written with “0”, the maximum current drops down to 53 mA.
6) Relevant for the power supply dimensioning, not for thermal considerations.
In case of erase of Data Flash, internal flash array loading effects may generate transient current spikes of up
to 15 mA for maximum 5 ms.
7) No GPIO activity, LVDS off
8) This value is relevant for the power supply dimensioning not for thermal considerations.
The currents caused by the GPIO activity depend on the particular application and should be added
separately.
Data Sheet
99
V1.3, 2009-09
TC1767
Electrical Parameters
5.3
AC Parameters
All AC parameters are defined with the temperature compensation disabled. That
means, keeping the pads constantly at maximum strength.
5.3.1
Testing Waveforms
VDDP
90%
90%
10%
10%
VSS
tR
tF
rise_fall_vddp.vsd
Figure 21
Rise/Fall Time Parameters
VDDP
VDDP / 2
Test Points
VDDP / 2
VSS
mct04881_vddp.vsd
Figure 22
Testing Waveform, Output Delay
VLoad+ 0.1 V
VLoad- 0.1 V
VOH - 0.1 V
Timing
Reference
Points
VOL - 0.1 V
MCT04880_new
Figure 23
Testing Waveform, Output High Impedance
Data Sheet
100
V1.3, 2009-09
TC1767
Electrical Parameters
5.3.2
Output Rise/Fall Times
Table 18
Output Rise/Fall Times (Operating Conditions apply)
Parameter
Symbol
Values
Unit Note / Test Condition
Min. Typ. Max.
Class A1 Pads
Rise/fall times1)
t
RA1, tFA1
–
–
–
–
50
140
18000
150
550
ns
ns
Regular (medium) driver, 50 pF
Regular (medium) driver, 150 pF
Regular (medium) driver, 20 nF
Weak driver, 20 pF
Weak driver, 150 pF
Weak driver, 20 000 pF
65000
Class A2 Pads
Rise/fall times
tRA2, tFA2
3.7
7.5
7
18
Strong driver, sharp edge, 50 pF
Strong driver, sharp edge, 100pF
Strong driver, med. edge, 50 pF
Strong driver, soft edge, 50 pF
Medium driver, 50 pF
1)
50
140
18000
150
550
65000
Medium driver, 150 pF
Medium driver, 20 000 pF
Weak driver, 20 pF
Weak driver, 150 pF
Weak driver, 20 000 pF
Class F Pads
Rise/fall times
Rise/fall times
t
RF1, tFF1
RF2, tFF2
–
–
–
–
2
ns
ns
LVDS Mode
t
60
CMOS Mode, 50 pF
1) Not all parameters are subject to production test, but verified by design/characterization and test correlation.
Data Sheet
101
V1.3, 2009-09
TC1767
Electrical Parameters
5.3.3
Power Sequencing
V
+-5%
5V
VAREF
+-5%
3.3V
1.5V
-12%
+-5%
0.5V
-12%
0.5V
0.5V
t
VDDP
PORST
power
down
power
fail
t
Power-Up 8.vsd
Figure 24
5 V / 3.3 V / 1.5 V Power-Up/Down Sequence
The following list of rules applies to the power-up/down sequence:
• All ground pins VSS must be externally connected to one single star point in the
system. Regarding the DC current component, all ground pins are internally directly
connected.
1. At any moment,
each power supply must be higher than any lower_power_supply - 0.5 V, or:
VDD5 > VDD3.3 - 0.5 V; VDD5 > VDD1.5 - 0.5 V;VDD3.3 > VDD1.5 - 0.5 V, see Figure 24.
2. During power-up and power-down, the voltage difference between the power supply
pins of the same voltage (3.3 V, 1.5 V, and 5 V) with different names (for example
VDDP, VDDFL3 ...), that are internaly connected via diodes must be lower than 100 mV.
On the other hand, all power supply pins with the same name (for example all VDDP
), are internaly directly connected. It is recommended that the power pins of the same
voltage are driven by a single power supply.
Data Sheet
102
V1.3, 2009-09
TC1767
Electrical Parameters
3. The PORST signal may be deactivated after all VDD5, VDD3.3, VDD1.5, and VAREF power-
supplies and the oscillator have reached stable operation, within the normal
operating conditions.
4. At normal power down the PORST signal should be activated within the normal
operating range, and then the power supplies may be switched off. Care must be
taken that all Flash write or delete sequences have been completed.
5. At power fail the PORST signal must be activated at latest when any 3.3 V or 1.5 V
power supply voltage falls 12% below the nominal level. The same limit of 3.3 V-12%
applies to the 5 V power supply too. If, under these conditions, the PORST is
activated during a Flash write, only the memory row that was the target of the write
at the moment of the power loss will contain unreliable content. In order to ensure
clean power-down behavior, the PORST signal should be activated as close as
possible to the normal operating voltage range.
6. In case of a power-loss at any power-supply, all power supplies must be powered-
down, conforming at the same time to the rules number 2 and 4.
7. Although not necessary, it is additionally recommended that all power supplies are
powered-up/down together in a controlled way, as tight to each other as possible.
8. Aditionally, regarding the ADC reference voltage VAREF
:
– VAREF must power-up at the same time or later than VDDM, and
– VAREF must power-down eather earlier or at latest to satisfy the condition
V
AREF < VDDM + 0.5 V. This is required in order to prevent discharge of VAREF filter
capacitance through the ESD diodes through the VDDM power supply. In case of
discharging the reference capacitance through the ESD diodes, the current must
be lower than 5 mA.
Data Sheet
103
V1.3, 2009-09
TC1767
Electrical Parameters
5.3.4
Power, Pad and Reset Timing
Table 19
Power, Pad and Reset Timing Parameters
Parameter
Symbol
Values
Typ. Max.
Unit Note /
Test Conditi
on
Min.
Min. VDDP voltage to
ensure defined pad
states1)
V
DDPPA CC 0.6
–
–
V
–
Oscillator start-up time2)
tOSCS CC –
tPOA SR 10
–
–
10
–
ms
ms
–
–
Minimum PORST active
time after power supplies
are stable at operating
levels
ESR0 pulse width
tHD
CC program –
mable3)5)
–
fSYS
–
PORST rise time
tPOR
tPOS
SR –
SR 0
–
–
50
–
ms
ns
–
–
Setup time to PORST
rising edge4)
Hold time from PORST
rising edge
tPOH
SR 100
SR 0
–
–
–
–
–
–
ns
ns
ns
ns
ns
TESTMODE
TRST
Setup time to ESR0 rising tHDS
edge
–
–
Hold time from ESR0
rising edge
tHDH
tPIP
SR 16 ×
1/fSYS
–
HWCFG
5)
Ports inactive after
CC –
150
–
–
PORST reset active6)7)
Ports inactive after ESR0 tPI
reset active (and for all
logic)
CC –
8 ×
1/fSYS
Power on Reset Boot
Time8)
tBP
CC –
–
–
2.5
ms
–
Application Reset Boot
Time 9)10)
tB
CC 150
700
960
µs
µs
f
f
CPU=133MHz
CPU=80MHz
1) This parameter is valid under assumption that PORST signal is constantly at low level during the power-
up/power-down of the VDDP
.
Data Sheet
104
V1.3, 2009-09
TC1767
Electrical Parameters
2) tOSCS is defined from the moment when VDDOSC3 = 3.13 V until the oscillations reach an amplitude at XTAL1 of
0,3 × VDDOSC3. This parameter is verified by device characterization. The external oscillator circuitry must be
optimized by the customer and checked for negative resistance as recommended and specified by crystal
suppliers.
3) Any ESR0 activation is internally prolonged to SCU_RSTCNTCON.RELSA FPI bus clock (fFPI) cycles.
4) Applicable for input pins TESTMODE and TRST.
5) fFPI = fCPU / 2
6) Not subject to production test, verified by design / characterization.
7) This parameter includes the delay of the analog spike filter in the PORST pad.
8) The duration of the boot-time is defined between the rising edge of the PORST and the moment when the first
user instruction has entered the CPU and its processing starts.
9) The duration of the boot time is defined between the rising edge of the internal application reset and the clock
cycle when the first user instruction has entered the CPU pipeline and its processing starts.
10) The given time includes the time of the internal reset extension for a configured value of
SCU_RSTCNTCON.RELSA = 0x05BE.
VDDP -12%
VDDPPA
VDDPPA
VDDP
VDD
VDD -12%
t
POA
t
POA
PORST
t
t
POH
POH
TRST
TESTMODE
t
t
hd
hd
ESR0
t
t
HDH
t
t
HDH
HDH
PI
HWCFG
t
t
PIP
PIP
t
PI
Pads
t
t
t
PI
PI
PI
t
PIP
Pad-state undefined
Tri-state or pull device active
As programmed
reset_beh2
Figure 25
Power, Pad and Reset Timing
Data Sheet
105
V1.3, 2009-09
TC1767
Electrical Parameters
5.3.5
Phase Locked Loop (PLL)
Note: All PLL characteristics defined on this and the next page are not subject to
production test, but verified by design characterization.
Table 20
PLL Parameters (Operating Conditions apply)
Parameter
Symbol
Values
Unit Note /
Test Con
Min.
Typ. Max.
dition
Accumulated jitter
|Dm|
–
–
7
ns
–
VCO frequency range
fVCO
400
8
–
800
16
MHz –
MHz –
MHz –
VCO input frequency range fREF
PLL base frequency1)
–
fPLLBASE
tL
50
–
200
–
320
200
PLL lock-in time
µs
–
1) The CPU base frequency with which the application software starts after PORST is calculated by dividing the
limit values by 16 (this is the K2 factor after reset).
Phase Locked Loop Operation
When PLL operation is enabled and configured, the PLL clock fVCO (and with it the LMB-
Bus clock fLMB) is constantly adjusted to the selected frequency. The PLL is constantly
adjusting its output frequency to correspond to the input frequency (from crystal or clock
source), resulting in an accumulated jitter that is limited. This means that the relative
deviation for periods of more than one clock cycle is lower than for a single clock cycle.
This is especially important for bus cycles using waitstates and for the operation of
timers, serial interfaces, etc. For all slower operations and longer periods (e.g. pulse train
generation or measurement, lower baudrates, etc.) the deviation caused by the PLL jitter
is negligible.
Two formulas are defined for the (absolute) approximate maximum value of jitter Dm in
[ns] dependent on the K2 - factor, the LMB clock frequency fLMB in [MHz], and the
number m of consecutive fLMB clock periods.
for
(K2 ≤ 100)
and
(m ≤ (fLMB[MHz]) ⁄ 2)
(1 – 0, 01 × K2) × (m – 1)
0, 5 × fLMB[MHz] – 1
(2)
(3)
740
Dm[ns] = -------------------------------------------- + 5 × ---------------------------------------------------------------- + 0 , 0 1 × K2
K2 × fLMB[MHz]
740
else
Dm[ns] = -------------------------------------------- + 5
K2 × fLMB[MHz]
Data Sheet
106
V1.3, 2009-09
TC1767
Electrical Parameters
With rising number m of clock cycles the maximum jitter increases linearly up to a value
of m that is defined by the K2-factor of the PLL. Beyond this value of m the maximum
accumulated jitter remains at a constant value. Further, a lower LMB-Bus clock
frequency fLMB results in a higher absolute maximum jitter value.
Figure 26 gives the jitter curves for several K2 / fLMB combinations.
±10.0
Dm
ns
fLMB = 40 MHz (K2 = 10)
fLMB = 40 MHz (K2 = 20)
±8.0
±7.0
±6.0
±4.0
fLMB = 80 MHz (K2 = 6)
fLMB = 80 MHz (K2 = 10)
±2.0
±1.0
±0.0
fLMB = 133 MHz (K2 = 6)
20 40 60
= Max. jitter
0
80
100
120
oo
m
Dm
m
= Number of consecutive fLMB periods
K2
= K2-divider of PLL
TC1767_PLL_JITT_C
Figure 26
Approximated Maximum Accumulated PLL Jitter for Typical LMB-
Bus Clock Frequencies fLMB
Note: The specified PLL jitter values are valid if the capacitive load per output pin does
not exceed CL = 20 pF with the maximum driver and sharp edge. In case of
applications with many pins with high loads, driver strengths and toggle rates the
specified jitter values could be exceeded.
Note: The maximum peak-to-peak noise on the pad supply voltage, measured between
V
V
DDOSC3 at pin 106 and VSSOSC at pin 104, is limited to a peak-to-peak voltage of
PP = 100 mV for noise frequencies below 300 KHz and VPP = 40 mV for noise
frequencies above 300 KHz.
The maximum peak-to peak noise on the pad supply votage, measured between
VDDOSC at pin 105 and VSSOSC at pin 104, is limited to a peak-to-peak voltage of
V
PP = 100 mV for noise frequencies below 300 KHz and VPP = 40 mV for noise
frequencies above 300 KHz.
Data Sheet
107
V1.3, 2009-09
TC1767
Electrical Parameters
These conditions can be achieved by appropriate blocking of the supply voltage
as near as possible to the supply pins and using PCB supply and ground planes.
Data Sheet
108
V1.3, 2009-09
TC1767
Electrical Parameters
5.3.6
JTAG Interface Timing
The following parameters are applicable for communication through the JTAG debug
interface. The JTAG module is fully compliant with IEEE1149.1-2000.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Table 21
JTAG Interface Timing Parameters
(Operating Conditions apply)
Parameter
Symbol
Values
Unit Note /
Test Condition
Min.
25
12
10
–
Typ.
Max.
TCK clock period
TCK high time
t1 SR
t2 SR
t3 SR
t4 SR
t5 SR
t6 SR
–
–
–
–
–
–
–
–
–
4
4
–
ns
ns
ns
ns
ns
ns
–
–
–
–
–
–
TCK low time
TCK clock rise time
TCK clock fall time
–
TDI/TMS setup
6
to TCK rising edge
TDI/TMS hold
t7 SR
6
–
–
ns
–
after TCK rising edge
TDO valid after TCK falling t8 CC
–
–
2
–
–
–
13
3
ns
ns
ns
CL = 50 pF
CL = 20 pF
edge1) (propagation delay)
t8 CC
TDO hold after TCK falling t18 CC
–
edge1)
TDO high imped. to valid t9 CC
–
–
–
–
14
ns
ns
CL = 50 pF
CL = 50 pF
from TCK falling edge1)2)
TDO valid to high imped. t10 CC
13.5
from TCK falling edge1)
1) The falling edge on TCK is used to generate the TDO timing.
2) The setup time for TDO is given implicitly by the TCK cycle time.
Data Sheet
109
V1.3, 2009-09
TC1767
Electrical Parameters
t1
0.9 VDDP
0.5 VDDP
0.1 VDDP
t5
t4
t2
t3
MC_JTAG_TCK
Figure 27
Test Clock Timing (TCK)
TCK
t6
t7
TMS
t6
t7
TDI
t9
t8
t10
TDO
t18
MC_JTAG
Figure 28
JTAG Timing
Data Sheet
110
V1.3, 2009-09
TC1767
Electrical Parameters
5.3.7
DAP Interface Timing
The following parameters are applicable for communication through the DAP debug
interface.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Table 22
DAP Interface Timing Parameters
(Operating Conditions apply)
Parameter
Symbol
Values
Unit Note /
Test Condition
Min.
Typ.
Max.
DAP0 clock period
DAP0 high time
t11 SR
t12 SR
t13 SR
t14 SR
t15 SR
t16 SR
12.5
–
–
–
–
–
–
–
–
–
2
2
–
ns
ns
ns
ns
ns
ns
–
4
4
–
–
6
–
–
–
–
–
DAP0 low time
DAP0 clock rise time
DAP0 clock fall time
DAP1 setup
to DAP0 rising edge
DAP1 hold
after DAP0 rising edge
t17 SR
t19 SR
t19 SR
6
–
–
–
–
–
–
ns
ns
ns
–
DAP1 valid
8
80 MHz,
CL = 20 pF
per DAP0 clock period1)
10
40 MHz,
CL = 50 pF
1) The Host has to find a suitable sampling point by analyzing the sync telegram response.
t11
0.9 VDDP
0.1 VDDP
0.5 VDDP
t15
t14
t12
t13
MC_DAP0
Figure 29
Test Clock Timing (DAP0)
Data Sheet
111
V1.3, 2009-09
TC1767
Electrical Parameters
DAP0
t16
t17
DAP1
MC_DAP1_RX
Figure 30
DAP1
DAP Timing Host to Device
t11
t19
MC_DAP1_TX
Figure 31
DAP Timing Device to Host
Data Sheet
112
V1.3, 2009-09
TC1767
Electrical Parameters
5.3.8
Peripheral Timings
Note: Peripheral timing parameters are not subject to production test. They are verified
by design / characterization.
5.3.8.1 Micro Link Interface (MLI) Timing
MLI Transmitter Timing
t13
t14
t10
t12
TCLKx
t11
t15
t15
TDATAx
TVALIDx
t16
t17
TREADYx
MLI Receiver Timing
t23
t24
t20
t22
RCLKx
t21
t25
t26
RDATAx
RVALIDx
t27
t27
RREADYx
MLI_Tmg_2.vsd
Figure 32
MLI Interface Timing
Note: The generation of RREADYx is in the input clock domain of the receiver. The
reception of TREADYx is asynchronous to TCLKx.
Data Sheet
113
V1.3, 2009-09
TC1767
Electrical Parameters
Table 23
MLI Transmitter/Receiver Timing
(Operating Conditions apply), CL = 50 pF
Parameter
Symbol
Values
Unit Note /
Test Co
Min.
Typ.
Max.
ndition
MLI Transmitter Timing
TCLK clock period
TCLK high time
1)
t10
t11
t12
t13
t14
t15
CC 2 × TMLI
–
–
ns
2)3)
2)3)
0.45 × t10 0.5 × t10 0.55 × t10 ns
CC
TCLK low time
CC 0.45 × t10 0.5 × t10 0.55 × t10 ns
4)
TCLK rise time
CC –
CC –
CC -3
–
–
–
ns
ns
ns
–
–
–
4)
TCLK fall time
TDATA/TVALID output
delay time
4.4
TREADY setup time to
TCLK rising edge
t16
t17
SR 18
SR 0
–
–
–
–
ns
ns
–
–
TREADY hold time from
TCLK rising edge
MLI Receiver Timing
RCLK clock period
RCLK high time
RCLK low time
1)
t20
t21
t22
t23
t24
t25
SR 1 × TMLI
SR –
–
–
–
–
4
4
–
ns
ns
ns
ns
ns
ns
5)6)
5)6)
7)
0.5 × t20
SR –
0.5 × t20
RCLK rise time
SR –
–
–
–
7)
RCLK fall time
SR –
RDATA/RVALID setup
time to RCLK falling edge
SR 4.2
–
–
–
RDATA/RVALID hold time t26
from RCLK rising edge
SR 2.2
–
–
ns
ns
RREADY output delay time t27
CC 0
–
16
1) TMLImin. = TSYS = 1/fSYS. When fSYS = 80 MHz, t10 = 25 ns and t20 = 12.5 ns.
2) The following formula is valid: t11 + t12 = t10
3) The min./max. TCLK low/high times t11/t12 include the PLL jitter of fSYS. Fractional divider settings must be
regarded additionally to t11/t12.
4) For high-speed MLI interface, strong driver sharp edge selection (class A2 pad) is recommended for TCLK.
5) The following formula is valid: t21 + t22 = t20
6) The min. and max. value of is parameter can be adjusted by considering the other receiver timing parameters.
Data Sheet
114
V1.3, 2009-09
TC1767
Electrical Parameters
7) The RCLK max. input rise/fall times are best case parameters for fSYS = 80 MHz. For reduction of EMI, slower
input signal rise/fall times can be used for longer RCLK clock periods.
5.3.8.2 Micro Second Channel (MSC) Interface Timing
Table 24
MSC Interface Timing (Operating Conditions apply), CL = 50 pF
Parameter
Symbol
Values
Typ.
Unit Note /
Test Con
Min.
Max.
dition
FCLP clock period1)2)
t40 CC 2 × TMSC
t45 CC -10
–
–
ns
ns
–
–
3)
SOP/ENx outputs delay
from FCLP rising edge
10
SDI bit time
SDI rise time
SDI fall time
t46 CC 8 × TMSC
t48 SR
–
ns
ns
ns
–
–
–
100
100
t49 SR
1) FCLP signal rise/fall times are the same as the A2 Pads rise/fall times.
2) FCLP signal high and low can be minimum 1 × TMSC
.
3) TMSCmin = TSYS = 1/fSYS. When fSYS = 80 MHz, t40 = 25 ns
t40
0.9 VDDP
0.1 VDDP
FCLP
t45
t45
SOP
EN
t48
t49
0.9 VDDP
0.1 VDDP
SDI
t46
t46
MSC_Tmg_1.vsd
Figure 33
MSC Interface Timing
Note: Sample the data at SOP with the falling edge of FCLP in the target device.
Data Sheet
115
V1.3, 2009-09
TC1767
Electrical Parameters
5.3.8.3 SSC Master / Slave Mode Timing
Table 25
SSC Master/Slave Mode Timing
(Operating Conditions apply), CL = 50 pF
Parameter
Symbol
Values
Typ. Max.
Unit Note /
Test Con
dition
Min.
Master Mode Timing
1)2)3)
SCLK clock period
t50
t51
CC 2 × TSSC
–
–
–
8
ns
MTSR/SLSOx delay from
SCLK rising edge
CC 0
ns
ns
ns
–
3)
MRST setup to SCLK
falling edge
t52
t53
SR 13
SR 0
–
–
–
–
3)
MRST hold from SCLK
falling edge
Slave Mode Timing
SCLK clock period
SCLK duty cycle
1)3)
t54
SR 4 × TSSC
–
–
–
–
ns
%
t55/t54 SR 45
55
–
–
3)4)
MTSR setup to SCLK
latching edge
t56
t57
t58
t59
t60
SR TSSC + 5
ns
3)4)
3)
MTSR hold from SCLK
latching edge
SR TSSC + 5
SR TSSC + 5
SR 7
–
–
–
–
–
–
ns
ns
ns
ns
ns
SLSI setup to first SCLK
latching edge
–
SLSI hold from last SCLK
latching edge
–
–
–
–
MRST delay from SCLK
shift edge
CC 0
15
10
SLSI to valid data on MRST t61
CC –
1) SCLK signal rise/fall times are the same as the A2 Pads rise/fall times.
2) SCLK signal high and low times can be minimum 1 × TSSC
3) TSSCmin = TSYS = 1/fSYS. When fSYS = 80 MHz, t50 = 25 ns.
.
4) Fractional divider switched off, SSC internal baud rate generation used.
Data Sheet
116
V1.3, 2009-09
TC1767
Electrical Parameters
t50
SCLK1)2)
MTSR1)
t51
t51
t52
t53
Data
valid
MRST1)
SLSOx2)
t51
1) This timing is based on the following setup: CON.PH = CON.PO = 0.
2) The transition at SLSOx is based on the following setup: SSOTC.TRAIL = 0
and the first SCLK high pulse is in the first one of a transmission.
SSC_TmgMM
Figure 34
SSC Master Mode Timing
t54
First latching
SCLK edge
Last latching
SCLK edge
First shift
SCLK edge
SCLK1)
t55
t55
t56
t56
t57
t57
Data
valid
Data
valid
MTSR1)
MRST1)
SLSI
t60
t60
t61
t59
t58
1) This timing is based on the following setup: CON.PH = CON.PO = 0.
SSC_TmgSM
Figure 35
SSC Slave Mode Timing
Data Sheet
117
V1.3, 2009-09
TC1767
Electrical Parameters
5.4
Package and Reliability
Package Parameters
5.4.1
Table 26
Device
Thermal Parameters (Operating Conditions apply)
1)
1)
1)
Package
RΘJCT
RΘJCB
RΘJLeads Unit
23 K/W
Note
TC1767 PG-LQFP-176-5
6.5
5.5
1) The top and bottom thermal resistances between the case and the ambient (RTCAT, RTCAB) are to be combined
with the thermal resistances between the junction and the case given above (RTJCT, RTJCB), in order to calculate
the total thermal resistance between the junction and the ambient (RTJA). The thermal resistances between the
case and the ambient (RTCAT, RTCAB) depend on the external system (PCB, case) characteristics, and are
under user responsibility.
The junction temperature can be calculated using the following equation: TJ = TA + RTJA × PD, where the RTJA
is the total thermal resistance between the junction and the ambient. This total junction ambient resistance
RTJA can be obtained from the upper four partial thermal resistances.
Thermal resistances as measured by the ‘cold plate method’ (MIL SPEC-883 Method 1012.1).
Data Sheet
118
V1.3, 2009-09
TC1767
Electrical Parameters
5.4.2
Package Outline
Figure 36
PG-LQFP-176-5, Plastic Green Low Profile Quad Flat Package
You can find all of our packages, sorts of packing and others in our Infineon Internet
Page “Products”: http://www.infineon.com/products.
Data Sheet
119
V1.3, 2009-09
TC1767
Electrical Parameters
5.4.3
Flash Memory Parameters
The data retention time of the TC1767’s Flash memory (i.e. the time after which stored
data can still be retrieved) depends on the number of times the Flash memory has been
erased and programmed.
Table 27
Flash Parameters
Symbol
Parameter
Values
Unit
Note /
Test Condition
Min.
tRET CC 20
Typ. Max.
Program Flash
–
–
–
–
–
years Max. 1000
erase/program
Retention Time,
Physical Sector1)2)
cycles
Program Flash
Retention Time
Logical Sector1)2)
tRETL CC 20
–
years Max. 100
erase/program
cycles
Data Flash
Endurance
per 32 KB Sector
NE CC 30 000 –
cycles Max. data
retention time
5 years
Data Flash Endurance, NE8 CC 120000 –
EEPROM Emulation
cycles Max. data
retention time
(4 × 16 KB)
5 years
Programming Time
per Page3)
tPR CC –
tERP CC –
–
–
–
–
5
ms
s
–
Program Flash Erase
Time per 256-KB Sector
5
f
CPU = 133 MHz
CPU = 133 MHz
Data Flash Erase Time tERD CC –
for 2 x 32-KB Sector
2.5
s
f
Wake-up time
tWU CC –
4000/fCPU µs
–
+180
1) Storage and inactive time included.
2) At average weighted junction temperature Tj = 100oC, or
the retention time at average weighted temperature of Tj = 110oC is minimum 10 years, or
the retention time at average weighted temperature of Tj = 150oC is minimum 0.7 years.
3) In case the Program Verify feature detects weak bits, these bits will be programmed once more. The
reprogramming takes additional 5 ms.
Data Sheet
120
V1.3, 2009-09
TC1767
Electrical Parameters
5.4.4
Quality Declarations
Table 28
Quality Parameters
Symbol
Parameter
Values
Unit Note / Test Condition
Min. Typ. Max.
Operation
Lifetime1)
tOP
–
–
24000 hours –2) 3)
ESD susceptibility VHBM
according to
–
–
2000
V
Conforming to
JESD22-A114-B
Human Body
Model (HBM)
ESD susceptibility VHBM1
of the LVDS pins
–
–
–
–
500
500
V
V
–
ESD susceptibility VCDM
according to
Conforming to
JESD22-C101-C
Charged Device
Model (CDM)
Moisture
Sensitivity Level
MSL
–
–
3
–
Conforming to Jedec
J-STD-020C for 240°C
1) This lifetime refers only to the time when the device is powered on.
2) For worst-case temperature profile equivalent to:
2000 hours at Tj = 150oC
16000 hours at Tj = 125oC
6000 hours at Tj = 110oC
3) This 30000 hours worst-case temperature profile is also covered:
300 hours at Tj = 150oC
1000 hours at Tj = 140oC
1700 hours at Tj = 130oC
24000 hours at Tj = 120oC
3000 hours at Tj = 110oC
Data Sheet
121
V1.3, 2009-09
w w w . i n f i n e o n . c o m
Published by Infineon Technologies AG
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