SC200R015S5B [INFINEON]
DIODE 15 V, SILICON, RECTIFIER DIODE, WAFER, Rectifier Diode;
| 型号： | SC200R015S5B |
| 厂家： | 
Infineon |
| 描述： | DIODE 15 V, SILICON, RECTIFIER DIODE, WAFER, Rectifier Diode 二极管 |
| 文件： | 总5页 (文件大小：239K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Bulletin I0505J rev. C 05/01
SC200.....5. Series
SCHOTTKY DIE 200 x 200 mils
a
c
0.35 ± 0.01
(14 ± 0.4)
NOTES:
1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS).
2. CONTROLLING DIMENSION: (MILS).
C
3. DIMENSIONS AND TOLERANCES:
a = 5.08 + 0, - 0.01
(200 + 0, - 0.4)
D
A
b = 5.08 + 0, - 0.01
(200 + 0, - 0.4)
c = 4.57 + 0, - 0.01
(180 + 0, - 0.4)
d = 4.57 + 0, - 0.01
(180 + 0, - 0.4)
Ø
Ø = 1 ± 0.15
(40 ± 6)
40 (157)
4. LETTER DESIGNATION:
A = Anode (Top Metal)
C = Cathode (Back Metal)
Wafer flat alligned with
side b of the die
D = Reject Ink Dot (only on non-conforming dies)
5. SAWING:
Recommended Blade
SEMITEC S1025 QS00 Blade
Sawing Street
0.05 + 0, - 0.005
(2 + 0, - 0.2)
Ø 125 (492)
NOT TO SCALE
NOTE: 10 mils die thickness is available on specific request only.
Contact factory for information.
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1
SC200.....5.
Bulletin I0505J rev. C 05/01
Electrical Characteristics
Device
#
T
Max.
V
(V)
Typ. I @ 25°C Typ. I @ 125°C
Max. V @ I
F F
Package
Style
J
(°C)
R
R
R
(µA)
(mA)
(V)
SC200R015x5x
SC200S020x5x
SC200S030x5x
SC200S045x5x
SC200S060x5x
SC200H045x5x
SC200H100x5x
SC200H150x5x
125
150
150
150
150
175
175
175
15
7500
1200
600
900
450
270
210
0.45 @ 80A
0.51 @ 80A
0.55 @ 80A
0.66 @ 80A
D-61
D-61
D-61
D-61
20
30
45
400
60
n.a. contact factory
45
70
30
15
26
18
10
0.74 @ 80A
0.89 @ 60A
1.14 @ 80A
D-61
D-61
D-61
100
150
Mechanical Data
Device
MetalThickness
MetalThickness
#
FrontMetal
BackMetal
SC200xxxxA5x
SC200xxxxS5x
WireBondable
Solderable
--
Al 30 kÅ
Ni 1 kÅ
--
Ag 35 kÅ
Cr 1 kÅ
Cr 1 kÅ
Ni 2 kÅ
Ni 2 kÅ
Ag 3 kÅ
Ag 3 kÅ
Ti 2 kÅ
Recommended Storage Environment: Store in original container, in dessicated nitrogen, with no contamination.
Shelf life for parts stored in above condition is 2 years.
If the storage is done in normal atmosphere shelf life is reduced to six months.
Packaging
Device
#
Description
Minimum Order Quantity
Die in Sale Package
SC200xxxxx5B
SC200xxxxx5R
SC200xxxxx5P
SC200xxxxx5F
Inked Probed Unsawn Wafer (Wafer in Box)
Probed Die in Tape & Reel
350
8,000
350
Probed Die in Waffle Pack
Inked Probed Sawn Wafer on Film
350
2
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SC200.....5.
Bulletin I0505J rev. C 05/01
Ordering Information Table
Device Code
SC 200
S
100
A
5
B
3
4
1
2
5
6
7
1
2
3
4
5
6
7
-
-
-
-
-
-
-
Schottky Die
Chip Dimension in Mils
H = 830 Process
R = OR'ing Process
S = Standard Process
Process (see Electrical Characteristics Table)
Voltage code: Code = VRRM
Chip surface metallization (see Mechanical Data Table)
Wafer Diameter in inches
Packaging(seePackagingTable)
Wafer on Film
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3
SC200.....5.
Bulletin I0505J rev. C 05/01
Wafer in Box
ROUNDCONTAINER
TYVEK DISK
FOAM DISK
Die in Waffle Pack
CHIPTRAYPOCKET
4
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SC200.....5.
Bulletin I0505J rev. C 05/01
Tape and Reel
REEL FRAME
BARE DIE CARRIER TAPE
WORLDHEADQUARTERS: 233 Kansas St., El Segundo, California 90245 U.S.A. Tel: (310) 322 3331. Fax: (310) 322 3332.
EUROPEANHEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, U.K. Tel: ++ 44 1883 732020. Fax: ++ 44 1883 733408.
IR CANADA: 15 Lincoln Court, Brampton, Markham, Ontario L6T3Z2. Tel: (905) 453 2200. Fax: (905) 475 8801.
IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg. Tel: ++ 49 6172 96590. Fax: ++ 49 6172 965933.
IR ITALY: Via Liguria 49, 10071 Borgaro, Torino. Tel: ++ 39 11 4510111. Fax: ++ 39 11 4510220.
IR FAR EAST: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo, Japan 171. Tel: 81 3 3983 0086.
IR SOUTHEAST ASIA: 1 Kim Seng Promenade, Great World City West Tower,13-11, Singapore 237994. Tel: ++ 65 838 4630.
IR TAIWAN: 16 Fl. Suite D.207, Sec. 2, Tun Haw South Road, Taipei, 10673, Taiwan. Tel: 886 2 2377 9936.
http://www.irf.com
Fax-On-Demand: +44 1883 733420
Data and specifications subject to change without notice.
www.irf.com
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