SLE4442M3 [INFINEON]
ICs for Chip Cards / Intelligent 256/64/128-Byte EEPROM; 集成电路芯片卡/智能256 /64/ 128字节EEPROM
| 型号： | SLE4442M3 |
| 厂家： | 
Infineon |
| 描述： | ICs for Chip Cards / Intelligent 256/64/128-Byte EEPROM |
| 文件： | 总14页 (文件大小：179K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ICs for Chip Cards
SLE 4432/42
Intelligent 256-Byte EEPROM
SLE 4440
Intelligent 64-Byte EEPROM
SLE 4441
Intelligent 128-Byte EEPROM
Data Sheet 09.98
Extension
SLE 4432/40/41/42 Data Sheet Extension
Revision History:
Original Version 09.98
Previous Releases:
Page
Subjects (changes since last revision)
Important: For further information please contact:
Siemens Semiconductor Group in Munich, Germany,
Security & Chip Card ICs,
Fax +49 89 636-22360
The supply of this component does not include a license for its use in smart
card applications. This license is due to INNOVATRON Patents
137 Boulevard de Sébastopol, 75002 Paris, France, Fax +33 1 4013 3909
Published by Siemens AG, Bereich Halbleiter, HL CC Applications Group
Balanstr. 73, D-81541 München
© Siemens AG 1998. All Rights Reserved.
Attention please!
As far as patents or other rights of third parties are concerned, liability is only assumed for components, not for
applications, processes and circuits implemented within components or assemblies.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved.
For questions on technology, delivery, and prices please contact the Semiconductor Group Offices in Germany or the
Siemens Companies and Representatives world-wide (see address list).
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Siemens Office, Semiconductor Group.
Siemens AG is an approved CECC manufacturer.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport.
For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you
for any costs incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components1) of the Semiconductor Group of Siemens AG, may only be used in life-support devices or
systems2) with the express written approval of the Semiconductor Group of Siemens AG.
1) A critical component is a component used in a life-support device or system whose failure can reasonably be
expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that
device or system.
2) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or
maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be
endangered.
SLE 4432
SLE 4442
SLE 4440
SLE 4441
Intelligent 256-Byte EEPROM with Write Protect Function
SLE 4432
SLE 4442
Intelligent 256-Byte EEPROM with Write Protect Function
and Programmable Security Code (PSC)
Features
•
•
•
256 x 8-bit EEPROM organization
Byte-wise addressing
Irreversible byte-wise protection of lowest 32 addresses
(Byte 0...31)
•
•
•
•
•
•
•
•
•
•
•
32 x 1-bit organization of protection memory
Two-wire link protocol
M3
End of processing indicated at data output
Ambient temperature TA -35... +80°C
Supply voltage 5 V −5 / +10 %
Supply current < 10 mA
EEPROM programming time 5 ms
ESD protection typical 4000 V
Endurance minimum 105 write/erase cycles / bit1)
Data retention for minimum of 10 years1)
Contact configuration and Answer-to-Reset (synchronous transmission) in accordance
to ISO standard 7816
Additional Feature of SLE 4442
• Data can only be changed after entry of the correct 3-byte programmable security code
Type
Ordering Code Package
SLE 4432 M3
SLE 4432 C
SLE 4442 M3
SLE 4442 C
on request
on request
on request
on request
Wire-Bonded Module M3
Chip
Wire-Bonded Module M3
Chip
1)
Values are temperature dependent, for further information please refer to your Siemens Sales Office.
Semiconductor Group
3
Data Sheet Extension 09.98
SLE 4432
SLE 4442
SLE 4440
SLE 4441
Intelligent 64-Byte EEPROM with Write Protect Function
and Programmable Security Code (PSC)
SLE 4440
SLE 4441
Intelligent 128-Byte EEPROM with Write Protect Function
and Programmable Security Code (PSC)
•
•
•
•
64 x 8-bit EEPROM organization (SLE 4440)
128 x 8-bit EEPROM organization (SLE 4441)
Byte-wise addressing
Irreversible byte-wise protection of lowest 32 addresses
(Byte 0...31)
•
•
•
•
•
•
•
•
•
32 x 1-bit organization of protection memory
Two-wire link protocol
M3
End of processing indicated at data output
Ambient temperature TA -35... +80°C
Supply voltage 5 V −5 / +10 %
Supply current < 10 mA
EEPROM programming time 5 ms
ESD protection typical 4000 V
Endurance minimum 105 write/erase cycles / bit1)
• Data retention for minimum of 10 years1)
• Contact configuration and Answer-to-Reset (synchronous transmission) in accordance
to ISO standard 7816
• Data can only be changed after entry of the correct 3-byte programmable security code
Type
Ordering Code Package
SLE 4440 M3
SLE 4440 C
SLE 4441 M3
SLE 4441 C
on request
on request
on request
on request
Wire-Bonded Module M3
Chip
Wire-Bonded Module M3
Chip
1)
Values are temperature dependent, for further information please refer to your Siemens Sales Office.
Semiconductor Group
4
Data Sheet Extension 09.98
SLE 4432
SLE 4442
SLE 4440
SLE 4441
Introduction
This document describes changes and extensions of the Data Sheet 07.95 of
SLE 4432 / SLE 4442. All information of the Data Sheet 07.95 are also valid for SLE 4440 and
SLE 4441 (e.g. operational information) except the data mentioned in this document.
In detail the following items are added or changed
• Memory size SLE 4440
• Memory size SLE 4441
• Ambient temperature TA –35°C…+80°C
• ESD protection min. 1500 V, typical 4000 V
• Endurance minimum 100000 write/erase cycles / bit
• Package: Module M3
• Coding information
Especially the transmission protocol (2-wire) and commands are fully compatible for all chip
types.
1.
Memory Overview
The memory is organized in a Main Memory of
• 64 byte for SLE 4440
• 128 byte for SLE 4441
• 256 byte for SLE 4432 and SLE 4442
Each of the first 32 bytes of the Main Memory can be irreversibly protected against data change
by writing the corresponding bit in the Protection Memory (32 bit). Dependent on the state of the
protection bit the memory is read only (ROM) or may be erased and written again (EEPROM).
Change of the manufacturer code is only possible by the chip manufacturer.
Change of data of the Main Memory and write a bit of the Protection Memory is only possible
after a correct verification of the Programmable Security Code (PSC) for SLE 4440, SLE 4441
and SLE 4442.
Semiconductor Group
5
Data Sheet Extension 09.98
SLE 4432
SLE 4442
SLE 4440
SLE 4441
224 byte
I/O
Read Main Memory
Unprotected
Data Memory
Update Main
Memory
32 byte
Protectable
Data memory
32 bit
Protection
Memory
(PROM)
Application ID
Chip Coding
Read Protection
Memory
Figure 1 Memory Overview SLE 4432
224 byte
I/O
Read Main Memory
Unprotected
Data Memory
Update Main
Memory
Security Logic
Programmable
Security Code
32 byte
Protectable
Data memory
32 bit
Error Counter
Protection
Memory
(PROM)
Application ID
Chip Coding
Read Protection
Memory
Figure 2 Memory Overview SLE 4442
Semiconductor Group
6
Data Sheet Extension 09.98
SLE 4432
SLE 4442
SLE 4440
SLE 4441
32 byte
I/O
Read Main Memory
Security Logic
Unprotected
Data Memory
Update Main
Memory
Programmable
Security Code
32 byte
Protectable
Data memory
32 bit
Error Counter
Protection
Memory
(PROM)
Application ID
Chip Coding
Read Protection
Memory
Figure 3 Memory Overview SLE 4440
96 byte
I/O
Read Main Memory
Unprotected
Data Memory
Update Main
Memory
Security Logic
Programmable
Security Code
32 byte
Protectable
Data memory
32 bit
Error Counter
Protection
Memory
(PROM)
Application ID
Chip Coding
Read Protection
Memory
Figure 4 Memory Overview SLE 4441
Semiconductor Group
7
Data Sheet Extension 09.98
SLE 4432
SLE 4442
SLE 4440
SLE 4441
2.
Coding
SLE 4432, SLE 4442, SLE 4440 and SLE 4441 are delivered with a customer related unique
code in order to allow an unambiguous identification of the application. Thus a terminal can
clearly accept or reject a card after reading the Answer-to-Reset and the identification data. The
Answer-to-Reset (ATR) for synchronous IC cards according to ISO/IEC 7816 is a standardized
procedure allowing to identify an IC card (ICC) supporting the synchronous Answer-to-Reset. The
Answer-to-Reset data allow an interface device to select the appropriate chip type and operate
the ICC according to the data sheet of the chip.
Two different coding schemes apply
• Extended coding using encoded BER-TLV data objects according to ISO/IEC 7816-4
• 16-bit manufacturer code registered at Pro Electron
Both schemes identify the application by the registered application provider identifier RID
according to ISO/IEC 7816-5
2.1.
Registered Application Provider Identifier RID
The application is generally identified by the customer specific 5-byte registered application
provider identifier RID according to ISO/IEC 7816-5 using the registration category values ‘A’ and
‘D’. The RID is a part of the AID. Thus the AID is constructed as following:
Application identifier AID
Registered application provider identifier
Proprietary application provider identifier
RID (5 byte)
extension PIX (≤11 byte)
• Registered application provider identifier RID
Customer specific RID provided by the registration authority to the applicant
RID
Meaning
Comment
International registration
National registration
Country indicator
RID is registered by Tele Denmark
RID is registered by a national authority
Country code according to ISO 3166
‘A x xx xx xx xx’
‘D c cc xx xx xx’
‘c cc’
‘xx xx xx’
Application provider sequence no. Provided by national registration authority
• Proprietary application provider identifier extension PIX
Extension for the RID holder in order to diversify own applications
Application forms for a RID are printed in the Annex A of ISO/IEC 7816-5.
• For international registration one has to apply at the acting registration authority Tele Denmark
for a RID indicated by ‘A’. The contact address is printed in ISO/IEC 7816-5
• For national registration one has to apply at the relevant national standardization body or its
acting registration authority for a RID indicated by ‘D’ followed by the country code
The RID is provided by the customer to Siemens.
Semiconductor Group
8
Data Sheet Extension 09.98
SLE 4432
SLE 4442
SLE 4440
SLE 4441
2.2.
Extended Coding Scheme
Due to the available memory space the coding principle according to ISO/IEC 7816-4 applies for
SLE 4432, SLE 4442, SLE 4440 and SLE 4441. Data are coded according to the ASN 1 data
objects basic encoding rules using the structure Tag - Length - Value (BER TLV).
ATR header
ATR data
DIR data
RID PIX
APPLICATION data
. . .
. . .
ICM
TD LD
H1 H2 H3 H4 TM LM
ICT
TA LA
AID
LM
LD
LA
AID
ATR
DIR
Application identifier
Answer-to-Reset
Directory
LA
LD
PIX
RID
TA
Length of AID
Length of application data area
Proprietary appl. identifier extension
Registered appl. provider identifier
Tag of AID = ´4F´
H1,H2 ATR protocol bytes
H3,H4 ATR historical bytes
TD
Tag of application data area
Figure 5 Structure of a Mono- Application Memory IC Card with a simple DIR-Structure
Two coding principles apply
• Extended Coding Scheme (Compressed)
H1 H2 H3 H4 TM LM ICM ICT TA LA
RID
PIX
• Extended Coding Scheme (according to German Health Insurance)
H1 H2 H3 H4 TM LM ICM ICT … TT LT TA LA
RID
PIX
The byte definition is explained in the following:
ATR header
Byte H1: Protocol type = ‘A2’ indicating two-wire link protocol
Byte H2: Protocol parameter
Byte H3: Historical byte “Category Indicator” = ‘10’ indicating that the following byte H4 will be a
DIR data reference
Byte H4: Historical byte “DIR data reference” = a pointer (byte address) to the first byte of the
directory section (i.e. TA for Extended Coding Scheme - Compressed or TT for
Extended Coding Scheme - according to German Health Insurance)
Semiconductor Group
9
Data Sheet Extension 09.98
SLE 4432
SLE 4442
SLE 4440
SLE 4441
ATR data section
Byte TM: Tag manufacturing data object (‘pre-issuing data’) = ‘46’
Byte LM: Length of manufacturing data
Byte ICM: IC manufacturer = ‘05’. For existing applications ICM = ’81’ is still available
Byte ICT: IC Type
DIR data section
The DIR data section contains according to ISO/IEC 7816-5 data objects for application
selection. The following variants are possible:
• The IC card is a mono application card and only the data object ‘application identifier’ (tag
TA = ‘4F’) is present in the DIR data section. È Extended Coding Scheme (Compressed)
• The IC card is a mono application card with the data object ‘application template’ (tag
TT = ‘61’) in the DIR data section. The application template can contain along with the
application identifier (tag TA = ‘4F’) further data objects (e.g. application label - tag ‘50’ or
discretionary data - tag ’53’). È Extended Coding Scheme (according to German Health
Insurance)
Note: Bytes H1, H2, H3, H4, ICM, ICT and the customer specific RID are programmed by
Siemens and protected against further changes.
2.3.
16-bit Coding Scheme
For applications requiring only a unique coding the following construction applies
2 byte
1 byte
5 byte
Manufacturer Code
Manufac-
turer data
Registered application provider
identifier RID
• Manufacturer Code registered at Pro Electron
16-bit code provided by Siemens, fix for SLE 4432, SLE 4442, SLE 4440 and SLE 4441
• Manufacturer data
Differentiation of chip types SLE 4432, SLE 4442, SLE 4440 and SLE 4441
• Registered application provider identifier RID
Customer specific RID provided by the registration authority to the applicant
Note: The above mentioned 8 bytes are programmed by Siemens and protected against further
changes.
Semiconductor Group
10
Data Sheet Extension 09.98
SLE 4432
SLE 4442
SLE 4440
SLE 4441
2.4.
Codes Overview
SLE 4432, SLE 4442, SLE 4440 and SLE 4441 are available with the coding schemes.
Please note that according to ISO/IEC 7816-6 Amendment 1 ICM = ‘05’ for new
implementations. For existing applications ICM = ’81’ is still available. It is recommended that
terminals accept both IC manufacturer codes.
Address
Address
0
0
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
10
A
…
…
14 15 (dec)
F (hex)
PIX
E
Meaning H1 H2 H3 H4 TM LM ICM ICT TA LA
RID
RID
RID
RID
RID
Data
Data
Data
Data
A2 13 10 88 46 02 05 05 4F
A2 13 10 88 46 02 05 15 4F
A2 03 10 88 46 02 05 17 4F
A2 0B 10 88 46 02 05 16 4F
SLE 4432
SLE 4442
SLE 4440
SLE 4441
Figure 6 Extended Coding Scheme (compressed)
Address
Address
0
0
1
1
2
2
3
3
4
4
5
5
6
6
7
7
… 17 18 19 20 21 … 25 26 (dec)
… 11 12 13 14 15 … 19 1A (hex)
Meaning H1 H2 H3 H4 TM LM ICM ICT
TT LT TA LA
RID
RID
RID
RID
RID
PIX
Data
Data
Data
Data
A2 13 10 91
A2 13 10 91
A2 03 10 91
A2 0B 10 91
05 05
05 15
05 17
05 16
SLE 4432
SLE 4442
SLE 4440
SLE 4441
Figure 7 Extended Coding Scheme (according to German Health Insurance)
Address
Meaning
0
1
2
3
…
7
Manufacturer Code
Manufac-
turer data
01
Registered application provider
identifier RID
31
31
31
31
74
74
74
74
RID
SLE 4432
Data
Data
Data
Data
02
04
08
RID
RID
RID
SLE 4442
SLE 4440
SLE 4441
Figure 8 16-bit Coding Scheme
The shaded bytes are programmed by Siemens and protected against further changes.
Semiconductor Group
11
Data Sheet Extension 09.98
SLE 4432
SLE 4442
SLE 4440
SLE 4441
3.
Operational Information
Memory Map SLE 4440
3.1.
Address Main Memory
(decimal)
Protection Memory
Security Memory
64
:
Data Byte 64 (D7...D0)
:
32
31
:
Data Byte 32 (D7...D0)
Data Byte 31 (D7...D0) Protection Bit 31 (D31)
:
:
4
3
2
1
Data Byte 4 (D7...D0)
Data Byte 3 (D7...D0)
Data Byte 2 (D7...D0)
Data Byte 1 (D7...D0)
Data Byte 0 (D7...D0)
Protection Bit 4 (D31)
Protection Bit 3 (D3)
Protection Bit 2 (D2)
Protection Bit 1 (D1)
Protection Bit 0 (D0)
Reference Data Byte 3 (D7...D0)
Reference Data Byte 2 (D7...D0)
Reference Data Byte 1 (D7...D0)
Error Counter
0
The Data bytes 0 to 31 can be protected against further changes by programming the associated
protection bit 0 to 31. The SLE 4440 allows data changing only after correct verification of the
Reference Data bytes. Reading of the Data bytes and of the associated protection bits is always
possible.
3.2.
Memory Map SLE 4441
Address Main Memory
(decimal)
Protection Memory
Security Memory
128
:
Data Byte 128 (D7...D0)
:
32
31
:
Data Byte 32 (D7...D0)
Data Byte 31 (D7...D0) Protection Bit 31 (D31)
:
:
4
3
2
1
Data Byte 4 (D7...D0)
Data Byte 3 (D7...D0)
Data Byte 2 (D7...D0)
Data Byte 1 (D7...D0)
Data Byte 0 (D7...D0)
Protection Bit 4 (D31)
Protection Bit 3 (D3)
Protection Bit 2 (D2)
Protection Bit 1 (D1)
Protection Bit 0 (D0)
Reference Data Byte 3 (D7...D0)
Reference Data Byte 2 (D7...D0)
Reference Data Byte 1 (D7...D0)
Error Counter
0
The Data bytes 0 to 31 can be protected against further changes by programming the associated
protection bit 0 to 31. The SLE 4441 allows data changing only after correct verification of the
Reference Data bytes. Reading of the Data bytes and of the associated protection bits is always
possible.
Semiconductor Group
12
Data Sheet Extension 09.98
SLE 4432
SLE 4442
SLE 4440
SLE 4441
4.
Electrical Characteristics
The listed characteristics are ensured over the operating range of the integrated circuit. Typical
characteristics specify mean values expected over the production spread. If not otherwise
specified, typical characteristics apply at TA = 25°C and the give supply voltage.
4.1.
Absolute Maximum Ratings
Stresses above those listed may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions above those indicated
in the operational sections of this data sheet is not implied. Exposure to absolute maximum rating
conditions for extended periods may effect device reliability, including EEPROM data retention
and write/erase endurance.
Parameter
Symbol
Limit Values
min. typ. max.
1500 4000
105
Unit Test Condition
ESD protection
Endurance 1)
VS
V
ISO/IEC 7816-1
—
(write/erase cycles/bit)
Data retention 1)
10
years —
1) Values are temperature dependent, for further information please refer to your Siemens Sales
Office.
4.2.
Operation Range
Parameter
Symbol
Limit Values
Unit Test Condition
min. typ. max.
Ambient temperature
TA
-35
+80
°C
—
Semiconductor Group
13
Data Sheet Extension 09.98
SLE 4432
SLE 4442
SLE 4440
SLE 4441
5.
Package
Figure 9 Package Outlines Wire-Bonded Module M3
Semiconductor Group
14
Data Sheet Extension 09.98
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