SLE5552C [INFINEON]
EEPROM, 256X8, Serial, MOS;
| 型号： | SLE5552C |
| 厂家： | 
Infineon |
| 描述： | EEPROM, 256X8, Serial, MOS 可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 |
| 文件： | 总6页 (文件大小：123K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Chip Card & Security ICs
SLE 5552
Intelligent 256-Byte EEPROM
with Write and Read-Out Protection function
and Programmable Security Code
Short Product Information
May 2006
SLE 5552 Short Product Information
Revision History: Current Version 2006-05-19
Previous Releases:
Ref.: SPI_SLE5552_0506.doc
Page
Subjects (changes since last revision)
Important: Further information is confidential and on request. Please contact:
Infineon Technologies AG in Munich, Germany,
Chip Card & Security ICs,
Tel +49 (0)89 / 234-80000
Fax +49 (0)89 / 234-81000
E-Mail: security.chipcard.ics@infineon.com
Published by Infineon Technologies AG, AIM CC Applications Group
D-81726 München
© Infineon Technologies AG 2006
All Rights Reserved.
To our valued customers
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The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
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Information
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon
Technologies Office in Germany or our Infineon Technologies Representatives world-wide (see address list).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of
that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices
or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect
human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
SLE 5552
Intelligent 256-Byte EEPROM
with Write and Read-Out Protection Function
and Programmable Security Code (PSC)
Features
M3
•
•
•
Downward compatibility to SLE 4442 & SLE 5542
256 x 8 bit EEPROM organization of Data Memory
256 x 1 bit Protection Memory
–
–
–
Byte-wise write protection of first 32 addresses (byte 0...31) of Data Memory
Manufacturer Code for unique identification of application
Byte-wise read-out protection last 224 addresses (byte 32...255) of Data Memory
•
•
•
Data Memory (addresses 0…255) alterable only after verification of 3-Byte
Programmable Security Code (PSC)
Read-protected Data Memory (addresses 32…255) readable only after verification of
3-Byte Programmable Security Code (PSC)
Two-wire link protocol
–
–
Byte-wise addressing
End of processing indicated at data output
•
•
Contact configuration and Answer-to-Reset (synchronous transmission) in accordance
to standard ISO/IEC 7816
Sophisticated electrical characteristics
–
–
–
–
–
–
–
Ambient temperature –40 … +80°C for chip, –25 … +80°C for module
Supply voltage 5 V ± 10 %
Supply current < 3 mA (typical 600 µA)
EEPROM erase / write time 5 ms
ESD protection typical 4,000 V
EEPROM Endurance minimum 100,000 erase / write cycles1)
Data retention for minimum of 10 years1)
•
Advanced 1.2 µm CMOS-technology optimised for security layout
–
–
–
–
EEPROM-cells protected by shield
Shielding of deeper layers via metal
Sensory and logical security functions
No isolation on backside necessary
1
)
Values are temperature dependent.
Short Product Information
3 / 6
2006-05-19
SLE 5552
1
Ordering and Packaging information
Ordering Information
Table 1
Type
Package1)
Remark
Ordering Code
SLE 5552 C
SLE 5552 D
SLE 5552 M3
SLE 5552 MFC3
Die (on Wafer)
Die (on Wafer)
T-M3.2-6
unsawn
sawn
on request
on request
on request
on request
S-MFC3.1-6-1
FCoS™
Pin Description
Figure 1 Pin Configuration Wire-bonded Module M3.2 (top view)
Figure 2 Pin Configuration Module Flip Chip MFC3.1 (top view)
1)
Available as a Module Flip Chip (MFC3), wire-bonded module (M3) for embedding in plastic cards or as a die on
unsawn (C) / sawn wafer (D) for customer packaging
Short Product Information
4 / 6
2006-05-19
SLE 5552
VCC
RST
CLK
GND
I/O
SLE 5552
Figure 3 Pad Configuration Die
Table 2
Pin Definitions and Functions
Card Contact
Symbol
VCC
RST
CLK
GND
N.C.
I/O
Function
Supply voltage
Control input (Reset Signal)
Clock input
Ground
C1
C2
C3
C5
C6
C7
Not connected
Bi-directional data line (open drain)
Short Product Information
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2006-05-19
SLE 5552
2
Circuit Description
Memory Organization
The memory is organized in a Data Memory of 256 byte.
Write and Read-Out Protection of Data Memory
•
Write Protection Flags: Each of the first 32 bytes of the Data Memory can be irreversibly
protected against data change by writing the corresponding bit in the Protection Memory.
Dependent on the state of the protection bit the Data Memory is read only (ROM) or may be
erased and written again (EEPROM). Change of the manufacturer code (Application ID and
Chip Coding) is only possible by the chip manufacturer.
•
Read-Out Protection Flags: Each of the last 224 bytes of the Data Memory can be irreversibly
protected against read-out by writing the corresponding bit in the Protection Memory.
Programmable Security Code
•
Change of data of the Data Memory (addresses 0…255) and write a bit of the Protection
Memory is only possible after verification of the 3-Byte Programmable Security Code (PSC).
Read-out of read-protected Data Memory (addresses 32…255) only after verification of the
3-Byte Programmable Security Code (PSC).
•
Protection
Data
Security Logic
Memory
Memory
Programmable
Security Code
(PROM)
(EEPROM)
Error Counter
Read Main Memory
Update Main Memory
I/O
Update Main Memory
Read Main Memory
Application ID
Chip Coding
Figure 4 Memory Overview SLE 5552
Short Product Information
6 / 6
2006-05-19
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