SLE66C168PC [INFINEON]
Microcontroller;
| 型号： | SLE66C168PC |
| 厂家： | 
Infineon |
| 描述： | Microcontroller 微控制器 |
| 文件： | 总8页 (文件大小：43K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Security & Chip Card ICs
SLE 66C168P/PE
8/16-Bit Security Controller
with enhanced instruction set for large memories
in 0.22 µm CMOS Technology
64-Kbytes ROM, 2304 Bytes RAM, 16-Kbytes EEPROM
Dual Key Triple DES
Preliminary
Short Product Information 11.02
SLE 66C168P/PE Short Product Information
Ref.: SPI_SLE 66C168P/PE_1102.doc
This document contains preliminary information on a new product under development.
Details are subject to change without notice.
Revision History: Current Version 11.02
Previous Releases:
Page
Important: Further information is confidential and on request. Please contact:
Infineon Technologies AG in Munich, Germany,
Security & Chip Card ICs,
Tel +49 - (0)89 234-80000
Fax +49 - (0)89 234-81000
E-Mail: security.chipcard.ics@infineon.com
Edition 2002
Published by Infineon Technologies AG, CC Applications Group
St.-Martin-Strasse 53, D-81541 München
© Infineon Technologies AG 2002
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon
Technologies Office in Germany or our Infineon Technologies Representatives world-wide (see address list).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of
that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices
or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect
human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
SLE 66C168P/PE
16-Bit Security Controller with enhanced instruction set for large
memories in 0.22µm CMOS Technology, 64-Kbyte ROM, 2304 Bytes
RAM, 16-Kbyte EEPROM, Dual Key Triple DES Accelerator
Features
· Internal Clock with up to 33 MHz:
New
Programmable internal frequency (PLL x1, x2, x3, x4
· 8/16-bit microcomputer in 0.22 µm CMOS technology
and free running mode(s)).
· Instruction set opcode compatible with standard
· Adjustable frequency according to available power
SAB 8051 processor
New
or required performance
· Downward compatibility to existing SLE66CxxxP
· Increased internal clock frequency for maximum
products for existing masks without using the
performance
new features
New
New
· Internal frequency is automatically adjusted to
guarantee a given limited power
consumption
· Addressable memory up to 16 Mbyte
· Additional enhanced instructions for direct
physical memory access of >64kByte
· Two 16-bit Autoreload Timer
· Power saving sleep mode
· Typically saves up to 90 % code space and
increases execution speed up to 80 %.
· Ext. Clock freq. 1 up to 7.5 MHz for int. Clock up to
· Dedicated, non-standard architecture with execution
time 6 times faster than standard SAB 8051
processor at same external clock. (Up to 18 times
faster using internal frequency PLL x 3 compared to
external clock).
33 MHz
· UART for handling serial interface in accordance
with ISO/IEC 7816 part 3 supporting transmission
protocols T=1 and T=0
· 64 Kbytes User ROM for application programs
· 16 Kbytes MicroSlim-EEPROM
· 2 Kbytes XRAM, 256 bytes internal RAM
· Enhanced Memory Management and Protection
Unit (MMU) with application and user defined
segments
New
New
· Supply voltage range:1.8 V, 3.0 V, 5.0 V
·
Current consumption
< 10 mA @ 5.5 V
< 6 mA @ 3.3 V
< 4 mA @ 1.98 V
New
· Operating Temperature range: -25 to +85°C
· Storing temperature range: –40° to +125°C
· ESD protection larger than 6 kV (HBM)
· Dual Key Triple DES (DDES)
·
CC EAL5+ certification according to BSI-PP-0001-
2001 planned
MicroSlim-EEPROM
· True Random Number Generator with Firmware test
· Erase + Write time < 2.5 ms
function
· Enhanced ECC module controlled by OS
· Reading and programming byte by byte
· Flash-like erasing of E²-segments up to 2 kB
· CRC Module
· 16-bit Interrupt Module
New
New
·
Code executions during E²-programming for faster
personalization
· Flexible page mode for 1 to 64 bytes write/erase
operation
· EEPROM programming voltage generated on chip
· 32 bytes security area (OTP)
· Fast personalization mode < 0.70 ms
· Minimum of * 500.000 write/erase cycles @ 25°C per
hot spot on average, where f is typically 3.3 for
smartcard applications
New
· Data retention for a minimum of 10 years
Preliminary - Short Product Information
3 / 8
11.02
SLE 66C168P/PE
Memory Management and Protection Unit
Anti Snooping
New
·
·
Addressable memory of up to 16 Mbyte
·
·
Automatic randomization smoothing of power profile
Separates OS (system mode) and application (user
mode)
Effective HW-countermeasures against SEMA/DEMA,
SPA/DPA, DFA and Timing-Attacks
·
·
System routines called by interrupts
·
·
Non standard dedicated Smart Card CPU – Core
OS can restrict access to peripherals in application
mode
Active Shield with automatic and user controlled attack
detection
·
Variable application orientated segments defined
and controlled by OS
·
Hardware countermeasures controlled by True
Random Number Generator
·
·
Code execution from XRAM possible
Targeted Certification
Enhanced multi-application support by 16
descriptors for system / application mode
New
·
·
·
·
CC
VISA
Mastercard
Proton
Security Features
·
Enhanced sensor concept:
· Low and high voltage sensors
· Frequency sensors and filters
· Light Sensor
Support
· HW-& SW-Tools (Emulator, ROM Monitor, Card
Emulator, Simulator, Softmasking)
· Application notes
· Glitch Sensors
Supported Standards
· Temperature Sensor
· Life Test Function for Sensors (UMSLC)
Bus confusion
·
·
·
·
ISO/IEC 7816
EMV 2000
·
·
·
GSM 11.11, 11.12, 11.18
ETSI TS 102 221
Security reset detection
Current control oscillator (ICO)
Document References
Memory Security
·
·
·
Confidential Data Book SLE 66CxxxPE
Qualification report
·
Sparkling SFR encryption for DDES and ACE, CRC
module and RNG
New
Chip delivery specification for wafer with chip-layout
(die size, orientation,...)
·
·
32 bytes security PROM, hardware protected
Unique chip identification number for
each chip
·
·
Module specification containing description of
package, etc.
·
MED – memory encryption/decryption device for
XRAM, ROM and EEPROM
Qualification report module
·
·
·
Security optimized layout and layout scrambling
Fast IRAM erase
Development Tools Overview
·
Short Product Information Software Development Kit
SDK CC
Enhanced Error correction unit (ECU)
·
·
·
Short Product Information Card Emulator CE66P
Short Product Information ROM Monitor RM66P
Testmode
· Irreversible Lock - Out of test-mode
Short Product Information Emulator ET66P Hitex or
ET66P KSC
·
Short Product Information Smart Mask Package
Preliminary - Short Product Information
4 / 8
11.02
SLE 66C168P/PE
Performance DES- Accelerator
Operation
Data Block Encryption Time for an
Length
8-Byte Block incl. Data
Transfer
New
5 MHz 15 MHz 33 MHz*
56-bit Single DES Encryption
112-bit Triple DES Encryption
64 bit
64 bit
23 µs
8 µs
3.5 µs
5.3 µs
35 µs 12 µs
* preliminary values
Ordering Information
Type
Remark
Package1
Voltage
Range
Temperature
Range
Frequency
Range
(int. clock
frequency
Frequency
Range
(ext. clock
frequency)
SLE 66C168PE C
Die (sawn,
unsawn)
1.8 V; 3.0 V; 5.0 V
or
– 25°C to + 70°C
or
1 MHz - 5 MHz
or
Enhanced
Up to 33 MHz
Up to 15 MHz
feature set
3.0 V; 5.0 V
– 25°C to + 85°C
1 MHz - 7.5 MHz
SLE 66C168PE M5
M5.1
SLE 66C168P C
Die (sawn,
unsawn)
Mask
compatibility to
existing SLE
1.8 V; 3.0 V; 5.0 V
or
– 25°C to + 70°C
or
1 MHz - 5 MHz
or
SLE 66C168P M5
66P products M5.1
3.0 V; 5.0 V
– 25°C to + 85°C
1 MHz - 7.5 MHz
For ordering information please refer to the databook and contact your sales representative.
Production sites for SLE 66C168P/PE:
· Dresden (Germany), UMC (Taiwan), Altis (France).
Packaging Information:
· New, innovative Pad design:
New
· Suitable for wire bonding and future Flip-Chip technology
· Interoperability between all new derivatives of the 66PE family
Inline Pads
Pad size: 90 x 90 µm
1 available as wire-bonded module (M5) for embedding in plastic cards or as die (C) for customer packaging
Preliminary - Short Product Information
5 / 8
11.02
SLE 66C168P/PE
Pin Configuration
VCC GND
CLK
RST
I/O
SLE
66C168P/PE
Figure 1: Pin Configuration
Pin Definitions and Functions
Symbol
VCC
RST
Function
Operating voltage
Reset input
CLK
Processor clock input
Ground
GND
I/O
Bi-directional data port
Preliminary - Short Product Information
6 / 8
11.02
SLE 66C168P/PE
General Description
The SLE66C168P/PE is one member of the improved 66PE-series of Infineon Technologies. This high performance
security controller is manufactured in advanced 0.22 µm CMOS technology. It is downward compatible to existing 66P
controller derivatives. The well known ECO2000 8/16 bit CPU provides the high efficiency of the SAB 8051 instruction
set extended by additional powerful instructions together with enhanced performance, memory sizes and security
features compared to existing 66P derivatives.
Performance: The internal clock frequency can be adjusted to a level up to 33 MHz either as a multiple of 1,2,3,4 to the
external frequency or independent of the clock rate of the terminal with the help of the internal clock. It is adjustable
according to either available power requirements or required performance:
·
Increased internal clock frequency for maximum performance, e.g. for high performance with max. frequency in
payment applications.
·
Automatically adjusted frequency for a max. given power consumption, e.g. by GSM or UMTS requirements.
New
Memory: The SLE66C168P/PE offers 64 Kbytes of User-ROM, 256 byte internal RAM, 2048 byte XRAM and 16 Kbytes
MicroSlim-EEPROM, to fulfill the requirements of mainly standard GSM an SDA payment applications. The large ROM
size allows to place applications in the ROM-mask and to keep the E²PROM free for customer data. In addition it saves
mask development costs, as one mask may be used for different customer projects.
The enhanced Memory Management and Protection Unit allows a secure separation of the operating system and
different applications. It allows to separate the memories in application orientated segments, which can be controlled by
the OS. Furthermore, the MMU makes a secure downloading of applications possible even after personalization of a
card. These new features suit the requirements of the next generation of multi application operating systems.
ROM
64 Kbyte
Voltage
Clock
Reset
XRAM
2 Kbyte
EEPROM
16 Kbyte
DES
Accelerator
16-Bit CPU with
MMU
&
Address-/Data Bus
Random
ECO 2000
Instruction Set
Sleep Mode Logic
Sensors/Filters
two
Clock
generated
Interrupt
16-bit
Timer
CRC
Number
Generator
UART
Voltage Regulator
Figure 2: Block Diagram SLE 66C168P/PE
The new platform is designed to address up to 16Mbyte. However this feature is only available upon request and will
clearly require a change in the existing tool environment.
In addition, new instructions have been implemented in the design for an efficient direct access of physical memory
>64KByte up to16 MByte.
Preliminary - Short Product Information
7 / 8
11.02
SLE 66C168P/PE
Security features:
Since the very beginning, security is an integrated part of Infineons product development, as proved by various
certificates (ITSEC, CC, Proton, VISA, ZKA, Mondex). The so called “integral security concept” for the 66P series
ensures:
·
·
·
A secret storage of any confidential code, data and keys
Protection against side channel attacks such as: Simple Power Analysis (SPA) , Differential Power Analysis (DPA),
Protection against Differential Fault Analysis (DFA), Electromagnetic Emanation Attack (EMA) and other possible
HW or SW attacks
Peripherals: The CRC module allows the easy generation of checksums according to ISO/IEC 3309 (16-Bit-CRC). To
minimize the overall power consumption, the chip card controller IC offers a sleep mode. The UART supports the half-
duplex transmission protocols T=0 and T=1 according to ISO/IEC 7816-3. All relevant transmission parameters can be
adjusted by software, as e.g. the clock division factor, direct/inverse convention and the number of stop bits. Additionally,
the I/O port can be driven by communication routines realized in software.
The HW-DES module supports symmetric crypto algorithms according to the Data Encryption Standard in the Electronic
Code Book Mode.
The random number generator (RNG) is able to supply the CPU with true random numbers on all conditions.
The advanced sensor concept includes various sensors for any kind of attack scenarios and even more important a “Life
Test ” for sensors.
As an important feature, the chip provides an on-chip security, which fulfills the strong security requirements of a
Common Criteria evaluation at an EAL5+ level.
In conclusion, the SLE 66C168P/PE fulfills all the requirements of today's chip card applications, such as payment, GSM,
security access, and identification.
The SLE66C168P/PE integrates outstanding memory sizes, additional peripherals in combination with enhanced
performance and optimized power consumption on a minimized die size.
Preliminary - Short Product Information
8 / 8
11.02
相关型号：
©2020 ICPDF网 联系我们和版权申明