SLE66CL80M-C [INFINEON]

Micro Peripheral IC, CMOS;
SLE66CL80M-C
型号: SLE66CL80M-C
厂家: Infineon    Infineon
描述:

Micro Peripheral IC, CMOS

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Chip Card & Security  
SLE 66CL80PE(M) Family  
8/16-Bit High Security Dual Interface Controller  
For Contact based and Contactless Applications  
ISO/IEC 7816 and 14443 Type B & A Compliant Interfaces  
Contactless interface acc. ISO/IEC 18092 passive mode  
(SONY FeliCa® communication interface)  
with Linear Addressing Instruction Set For Large Memories  
in 0.22 µm CMOS Technology  
92-Kbyte User ROM, 2304-byte RAM,  
8-Kbyte EEPROM  
112-Bit Dual Key DES Accelerator  
supporting DES, 3DES Algorithms  
Mifare™ is a registered trademark of NXP Semiconductors  
Short Product Information  
12.2009  
Preliminary SLE 66CL80PE(M) Family Short Product Information  
Ref.: SPI_SLE66CL80PE_091106.doc  
This document contains preliminary information on a new product under development.  
Details are subject to change without notice.  
Revision History: Current Version: 2009-12-16  
Previous Releases:  
Page  
Subjects (changes since last revision)  
Important: Further information is confidential and on request. Please contact:  
Infineon Technologies AG in Munich, Germany,  
Chip Card & Security  
Email: security.chipcard.ics@infineon.com  
www.infineon.com/security  
Published by Infineon Technologies AG,  
81726 Munich, Germany  
© Infineon Technologies AG 2009  
All Rights Reserved.  
Attention please!  
The information herein is given to describe certain components and shall not be considered as warranted characteristics.  
Terms of delivery and rights to technical change reserved.  
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits,  
descriptions and charts stated herein.  
Infineon Technologies is an approved CECC manufacturer.  
Information  
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon  
Technologies Office in Germany or our Infineon Technologies Representatives world-wide (see address list).  
Warnings  
Due to technical requirements components may contain dangerous substances. For information on the types in question  
please contact your nearest Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or systems with the express written  
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of  
that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or  
systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect  
human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.  
SLE66CL80PE(M)  
8/16-Bit High Security Dual Interface Controller in 0.22 µm CMOS Technology  
for Contact and Contactless Operation  
with ISO/IEC 7816 and 14443 Type B & A Compliant Interfaces  
Contactless interface acc. ISO/IEC 18092 passive mode  
(SONY FeliCa® communication interface)  
with MMU and Linear Addressing Instruction Set For Large Memories  
and optional MIFARETM compatible emulation  
92-Kbyte User ROM, 2304-byte RAM, 8-Kbyte EEPROM  
112-Bit Dual Key DES Accelerator supporting DES, 3DES algorithm  
· Certified True Random Number Generator  
General Features  
with firmware test function supporting AIS-31  
requirements  
· Enhanced low power non-standard  
architecture 8051 CPU with extended  
addressing modes for dual interface smart  
card and contactless applications  
· Dual Key Triple DES (DDES) Accelerator  
· CC EAL5+ Certification planned according to  
BSIPP-0002  
· Instruction set opcode compatible with  
standard 8051 processor with additional  
powerful instructions optimized for smart card  
application  
· CRC Module according to ISO/IEC 3309  
supporting CCIT V.41 & HDLC X25 with  
configurable initial values  
· 16 Interrupt Vectors Module with 3 priority  
· Execution time at least 6 times faster than  
standard 8051 processor at same external  
clock  
levels to ensure real time operation  
· Internal clock controlled by PLL: up to 30MHz  
asynchronous clock frequency (optional use)  
· Additional enhanced instructions for direct  
physical memory access of >64-Kbyte  
· Adjustable internal frequency according to  
available power or required performance  
· Typically saves up to 90 % code space and  
increases execution speed up to 80%  
· Increased internal frequency for maximum  
performance  
· 92-Kbyte User ROM for operating system and  
application (programs & data)  
· Internal frequency adjusted to guarantee a  
given limited power consumption  
· 256 bytes reserved ROM for Resource  
Management System (RMS) with  
Contactless optimized EEPROM  
write/erase routines  
· Two 16-bit Auto-reload Timers with interrupt  
capability for protocols, security checks &  
watch dog implementations  
· 8-Kbyte Secure EEPROM in MicroSlim  
· Power saving sleep and clock stop modes  
technology for application program and data  
· Temperature range:  
· MIFARETM compatible emulation  
· 4-Kbyte reserved in User ROM  
contact-based: -25°C to +85°C  
contact-less:  
-25°C to +70°C  
· 2-Kbyte additional EEPROM protected by  
RMS Firewall  
· 2048-byte XRAM and 256-byte internal RAM  
for fast data processing  
· Enhanced Memory Management Unit with  
application and user defined segment  
MIFA RETM is a trademark of NXP B.V.  
· EEPROM voltage generated on chip  
4 / 13  
12.2009  
SLE66CL80PE(M)  
MIFARETM compatible Interface  
Full operation either via Contact-based  
and/or Contactless interfaces controlled  
by Operating System enhances Security  
Level  
· Optionally 1-Kbyte emulation  
· Operation controlled by RMS functions: same  
functionality and command set as given by the  
MIFARETM technology  
· Support of multiple MIFARETM compliant  
Contact-based Interface  
interfaces on one controller  
· Contact configuration and serial interface  
according to ISO/IEC 7816  
· Unique Identification number  
· UART handling serial interface compliant with  
ISO/IEC 7816 supporting transmission  
· Personalisation also possible in Contact  
based mode secured by RMS functions  
protocols T=0/1 and up to Division Factor 8  
· Supply voltage range:  
5V ± 10% (Class A)  
E²PROM Technology  
· Byte wise EEPROM programming and read  
3V ± 10% (Class B)  
1.8V ± 10% (Class C) (on request)  
accesses  
· Flexible page mode for 1 to 64 bytes  
· Current consumption < 10 mA @ 5.5 V  
write/erase operation  
· External CPU clock frequency:  
· 32 bytes security area including:  
- 16 bytes chip unique identification number  
- 16 bytes PROM area (OTP like)  
1 to 7.5 MHz  
· Internal CPU clock frequency:  
up to 30 MHz  
· Fast personalisation mode =1.0 ms  
· Typical Page Programming time of 2.2ms  
· ESD protection larger than 6 kV  
· Enhanced ECC Module controlled by  
Contactless Interface  
Operating System  
· Platform prepared for flash-like erasing of up  
· Interface according to ISO/IEC 14443 for both  
to 2-Kbyte EEPROM-segments  
Type B and Type A  
· Minimum of 500.000 Write/erase cycles  
@25°C per page  
· Interface according to ISO/IEC 18092 passive  
mode Interface (SONY FeliCa®)  
· Data retention for a minimum of 25 years  
· Carrier frequency 13.56 MHz  
@25°C  
· Data rate in both directions  
· EEPROM programming voltage generated on  
up to 848 Kbit/s in type B operation  
up to 848 Kbit/s in type A operation  
up to 424Kbit/s in FeliCa® operation  
chip  
Memory Management and  
Protection Unit  
· Anticollision & Transmission Protocol  
supported by open source application notes  
for both Type B & A  
· Addressable memory up to 16 Mbytes  
· supported by RMS functions  
· Separates OS (system mode) and Application  
· Flexible Internal CPU clock frequency:  
(application mode) by usage of descriptors  
fully configurable from 1.7MHz up to 30 MHz  
· Enhanced multi-application support by 16  
· 256 bytes buffer for contactless data  
descriptors  
exchange (FiFo circular architecture)  
· System routines called by interrupts  
· Parallel operation of CPU, Peripherals like  
DES, CRC and Contactless Interface for high  
demanding applications.  
· Access Restrictions to peripherals in  
application mode controlled by OS  
· Code execution from XRAM possible  
5 / 13  
12.2009  
SLE66CL80PE(M)  
·
·
Secure start of the operating system ensured  
by certified Self Test Software (STS)  
Security Features  
Certified EEPROM programming routines  
(RMS)  
·
·
Enhanced Error Correction Unit (ECU)  
Operation state mechanism  
Certified True Random Number Generator  
including firmware test function supporting  
AIS-31 requirements.  
· Low and high voltage sensors  
· Internal voltage sensor  
· Frequency sensors and filters  
· Light sensor  
·
High Speed SPA/DPA resistant Dual Key  
DES (DDES) Accelerator  
· Glitch sensors  
· Temperature sensor  
· Life Test function for sensors  
· Internal power-on reset sensor  
Anti Snooping  
· Automatic randomization and smoothing of  
power profile  
· Non standard dedicated Smart Card  
CPU Core  
· Active Shield with automatic and user  
· HW-countermeasures against SEMA/DEMA,  
controlled attack detection  
SPA/DPA, DFA and Timing Attacks  
· Active Shield with automatic and user  
Secure chip and firmware  
design  
controlled attack detection  
·
·
Sparkling SFR encryption for DDES, ACE,  
RNG and CRC modules  
Targeted Evaluation  
· CC EAL5+  
· Visa Level 3  
· CAST  
Security scrambled, dual rail pre-charge logic  
design & optimized chip layout against  
physical chip manipulation  
·
·
Bus Confusion  
· EMVCo  
Immediate internal RAM erase upon security  
reset detection  
Supported Standards  
·
·
·
Security Reset  
· ISO/IEC 7816  
· EMV 2000  
ROM code not visible due to implantation  
Mask dependant ROM code encrypted during  
production  
· MasterCard PayPass® M/Stripe and M/Chip  
· Visa Wave® and MSD  
· GSM 11.1x  
· ETSI TS 102 221  
· ISO/IEC 14443  
·
·
·
Chip unique encryption of the XRAM and  
EEPROM  
Flexible encryption of part or whole EEPROM  
by additional user-defined key  
Memory encryption/decryption module (MED)  
for XRAM, ROM and EEPROM against  
reverse engineering and power attacks  
· ISO/IEC 18092 (passive mode)  
· ISO/IEC 3309  
· CCIT v.41  
· HDLC X25  
·
·
16 byte Unique Chip IDentification number  
for anti-clone countermeasure & secure  
tracking  
16 bytes security PROM hardware protected  
(OTP like)  
6 / 13  
12.2009  
SLE66CL80PE(M)  
Document References  
Application Support  
· HW-& SW-Tools (Emulator, ROM Monitor,  
· Confidential Data Book  
Simulator, Evaluation Kit Proximity  
SLE 66CL(X)xxxPE(M)  
(Contactless Reader package), SmartMask™  
package, Simulated Reader Software, etc.)  
· Confidential Instruction Set SLE 66CxxxPE(M)  
· Confidential Quick Reference  
· Open Source Application Notes Tutorial (e.g.:  
T=0, T=1, DES and 3DES, Crypto Library,  
Anticollision and Contactless Transmission  
Protocols for both Type B and A, Card Coil  
Design Guide, Card Coil Antenna Reference  
Design List, etc.)  
SLE 66CxxxPE(M)  
· Chip Qualification report  
· Chip delivery specification for wafer with chip-  
layout (die size, orientation, ...)  
· Module specification containing description of  
· Certified CC EAL5+ Crypto Library  
package, etc.  
· Worldwide Application Engineer Team and  
customer dedicated Field Application  
Engineers  
· Module Qualification report  
· Dedicated Team for Contactless Design-in  
Development Tools Overview  
support and Analysis  
· Straight forward migration of existing tool  
chain for 66P towards 66PE family by  
firmware update  
· Regular Customer trainings on Cryptography,  
Contactless and Dual interface controllers  
including ISO/IEC 14443 related topics  
· Software Development Kit SDK CC  
· On-site trainings available on request  
· ROM Monitor RM66P/PE-II with stand alone  
functionality for ROM mask qualification in the  
end user system  
· Emulator ET66P/PE Hitex or ET66P/PE KSC  
· Smart Mask™ Package for chip evaluation  
· Smart Mask™ Dual Interface modules M8.4  
(supplied by Infineon) supporting both  
ISO/IEC 14443 Type B & A and ISO/IEC 7816  
for implantation process testing and  
production setup  
· Evaluation Kit Proximity (Contactless reader  
package)  
· Reader Optimization Kit  
7 / 13  
12.2009  
SLE66CL80PE(M)  
Cryptographic Timing Performances  
Timing performances are independent of the contact or contactless interface.  
Operation  
Data Block  
Length  
Encryption Time for an  
8-byte Block including Data Transfer  
5 MHz  
15 MHz  
30MHz  
High Speed and Secure  
56-bit Single DES Encryption  
(incl. key loading)  
64 bit  
37 µs  
12 µs  
6 µs  
High Speed and Secure  
56-bit Single DES Encryption  
64 bit  
64 bit  
23 µs  
60 µs  
8 µs  
4 µs  
High Speed and Secure  
112-bit Triple DES Encryption  
(incl. key loading)  
20 µs  
10 µs  
High Speed and Secure  
64 bit  
35 µs  
12 µs  
6 µs  
112-bit Triple DES Encryption  
Table 1  
Performance DDES Accelerator1  
Ordering Information  
Type  
Package Voltage Temperature Frequency  
Frequency  
Range  
Range2  
Range  
Range  
(external  
clock CB)  
(internal  
clock)  
MCC83  
M8.44  
Chip  
1.62 V  
to  
– 25°C  
1 MHz  
to  
SLE 66CL80PE(M) – MCC8  
SLE 66CL80PE(M) – M8.4  
SLE 66CL80PE(M) – C  
Up to 30MHz  
to  
5.5 V  
+ 85°C  
7.5 MHz  
Table 2  
Package Product Information5  
1 Preliminary values based on internal test results  
2 External Contactless clock range according to ISO/IEC14443  
3 Pure Contactless Module (MCC8): for standard thickness inlays (330µm)  
4 Dual Interface Module (M8.4)  
5 Ordering Codes are available on request  
8 / 13  
12.2009  
SLE66CL80PE(M)  
Pin Description and Pad Configuration  
C1  
C2  
C3  
C4  
C5  
C6  
C7  
C8  
Figure 1  
M8.4 Pin Configuration Wire-bonded Module (top view)  
LA  
LB  
CLK  
RST  
I/O  
VDD  
SLE 66CL80PE(M)  
GND  
Figure 2  
Pad Configuration (die)  
Card Contact  
Symbol  
VDD  
RST  
CLK  
GND  
I/O  
Function  
C1  
C2  
C3  
C5  
C7  
Supply voltage  
Reset input  
Processor clock input  
Ground  
Bi-directional data port  
Coil connection pin LA  
Coil connection pin LB  
LA  
LB  
Table 3  
Pin Definitions and Functions  
9 / 13  
12.2009  
SLE66CL80PE(M)  
Block Diagram Description  
Active Shield  
Non Volatile Memory (NVM)  
VCC  
IFX  
used  
NVM  
USER  
EEPROM  
Timers  
(0, 1)  
16 Byte ROM  
16 Byte PROM  
UART  
RNG  
CRC  
I/O  
ECO 2000  
CPU  
MED  
MMU  
Sleep Mode  
CLK  
Logic  
Address-/Databus  
RST  
Security  
Sensors  
256 Bytes  
IRAM  
GND  
ROM  
Inter-  
rupt  
DES  
ACE  
XRAM  
6 kByte  
IF-RMS  
Ext. Voltage  
Int. Voltage  
Sensor  
HF/LF  
Sensors  
F-Curse  
Sensor  
USER  
ROM  
STS  
SH-RMS  
Light  
Sensor  
Temp  
Sensor  
Glitch  
Sensor  
UmSLC  
LA  
On-Chip Firmware  
STS, RMS  
Voltage  
Regulator  
Clock Unit  
VCO  
CODEC  
FIFO  
256 byte  
Crypto  
RFI  
ISO14443 A,B  
SONY FeliCa  
LB  
(Dual -Supply CB/CL)  
Figure 3  
Block Diagram of SLE 66CL80PE(M)  
10 / 13  
12.2009  
SLE66CL80PE(M)  
General Description  
The dual interface security controllers SLE 66CL80PE(M) belong to the family of the Infineon  
Technologies SLE 66CxxxPE high-end security controller family in 0.22 µm CMOS technology which  
are designed for contactless security systems that requires continuous ongoing improvements with  
the highest degree of protection against fraudulent attacks.  
SLE 66CL80PE(M) is targeting dual interface and pure contactless smart card applications such as ID  
cards, banking, security access and transport.  
SLE 66CL80PE(M) offers 92 Kbytes of User-ROM, 256 bytes internal RAM, 2 Kbytes XRAM and  
8 Kbytes EEPROM, which can be used as data and as program memory. The non-volatile memory  
consists of high reliability cells to guarantee data integrity. This is especially important when the  
EEPROM is used as program memory.  
It features ISO/IEC 14443 Type B contactless interfaces and Type A and ISO/IEC 7816 contact-  
based interface on a single chip. They also support symmetric algorithms, such like DES and 3DES,  
independently of the communication mode.  
The CPU provides the high efficiency of the 8051 instruction set extended by additional powerful  
instructions with enhanced performance, memory sizes and security features tailored for contact and  
contactless smart card applications. Using the embedded PLL, the internal clock is adjustable up to  
30 MHz independent from the carrier frequency of the magnetic field supplied by the contactless  
terminal.  
The Memory Management Unit allows a secure separation of the operating system and the  
applications. Using the system/application mode, it allows to securely downloading applications in the  
field after card personalisation. Using the MMU transparent mode allows keeping the memory mapping  
for code compatibility to previous 66P Infineon security controller family member. These new features  
suit the requirements of the new generation of operating systems.  
The UART supports the half-duplex transmission protocols T=0 and T=1 according to ISO/IEC 7816-3.  
All relevant transmission parameters can be adjusted by software, as e.g. the clock division factor,  
direct/inverse convention and the number of stop bits. To minimize the overall power consumption, the  
smart card controller can be set into sleep mode supporting clock stop mode.  
Timers ease the implementation of advanced communication protocols such as T=CL (according to  
ISO/IEC 14443-4) and all other time critical processes for contactless communications. Both Timers  
features auto-reload mechanisms as well as their own dedicated interrupt vectors. Additional interrupts  
capability of the RF interface module allows real time operation of the pure contactless smart card with  
the contactless terminals.  
SLE 66CL80PE(M) is able to communicate with any Proximity Card Device (PCD) defined in  
ISO/IEC 14443 such as the Infineon Evaluation Kit Proximity. The power supply and data are received  
by an antenna, which consists of a coil with a few turns directly connected to the IC. DES acceleration  
by a factor of more than 500 compared to software solutions in combination with the high data transfer  
rate up to 848 Kbit/s keep the transaction times short. For more independence and flexibility, the  
controller offers the two modulation type B and type A according ISO/IEC 14443.  
The Anticollision and Contactless Transmission Protocol are supported by open source  
application notes for both Type B and A in order to offer a maximum flexibility to the Operating  
System. Both Contactless Communication protocol may be implemented in the Operating  
System while the final selection of the Type B or A is based upon the personalisation data of the  
contactless smart card. The communication type can also be changed during runtime in the field.  
Thus, SLE 66CL80PE(M) ensures a simplified handling of the ROM mask, high reactivity by a  
tailored personalisation during production of the contactless smart card in order to answer to the  
increasing market demand and applications.  
11 / 13  
12.2009  
SLE66CL80PE(M)  
SLE 66CL80PE(M) features a new Resource Management System (RMS_E) which optimizes  
Contactless EEPROM write/erase routines. EEPROM programming is enhanced over the entire  
communication distance compared to the standard RMS. Thus, the reduction of programming times  
and power consumption is ensured independently of the use of the contact or the contactless interface.  
The CRC module allows the easy generation of checksums according to ISO/IEC 3309 (16-Bit-CRC),  
thus it supports the two different CRC calculation required for ISO/IEC 14443 Type B and Type A.  
It additionally features an configurable initial value to avoid checksum computation re-starting  
from zero in the case interrupts requiring use of the CRC module are triggered. Therefore, data as well  
as program located in the EEPROM can be extra-secured by a CRC checksum enabling the Operating  
System to detect errors while downloading new application in the field.  
To minimize the overall power consumption, the pure contactless smart card controller can be set into  
sleep mode.  
The certified random number generator (RNG) is able to supply the CPU with true random numbers on  
all conditions. It allows creating session key used for authentication in open networks and enable  
secure downloading of new applications.  
The DDES module supports symmetrical crypto algorithms according to the Data Encryption Standard  
in the Electronic Code Book Mode. It features two internal registers for storage of the two keys required  
for a Triple DES computation. Together with the fast contactless interface, it offers high security and  
high speed for dual interface smart card applications.  
As an important feature, SLE 66CL80PE(M) provides a new and enhanced level of on-chip  
security, which fulfils the strong security requirements of a Common Criteria evaluation at an  
EAL5+ High level. Each security measure is designed to act as an integral part of the complete system  
in order to strengthen the system as a whole.  
Thus, porting an existing Operating System to SLE 66CL80PE(M) requires only very limited  
changes as it is typically reduced to add the Contactless Library and the Contactless Optimized  
Resource Management System (RMS_E) to the existing Operating System.  
SLE 66CL80PE(M) integrates outstanding memory sizes, additional peripherals in combination with  
enhanced performance and optimized power consumption on a minimized die size.  
In conclusion, SLE 66CL80PE(M) fulfils the requirements of for both contact-based and contactless  
smart card applications such like ID cards, banking, security access and transport. The family concept  
offers to select the right product for a given application in terms of available memory and price.  
12 / 13  
12.2009  
SLE66CL80PE(M)  
Glossary  
AES  
Advanced Encryption Standard  
AIS-31  
Functionality classes and evaluation methodology guidelines for physical random number  
generators defined by the German Institute for the Security of the Information Technology.  
Cache memories are Random Access Memories that the CPU can access more quickly than it  
can access regular RAM.  
Caches  
CLK  
Clock  
CPU  
CMOS  
Central Processing Unit  
Complementary Metal-Oxide Semiconductor, the technology used to manufacture most of  
today's microchips.  
CRT  
DES, 3DES  
DSA  
Chinese Remainder Theorem, computing technique  
Data Encryption Standard  
Digital Signature Algorithm  
EAL 5+  
EC  
Common Criteria Certification level  
Elliptic Curves  
EEPROM  
ESD  
Electrically Erasable Programmable Read-Only Memory  
Electrostatic Discharge, release of static electricity that can damage a chip  
Component of RSA key  
Exponent  
F_4  
Fermat Number F4 , computing term.  
GF(2m)  
GF(p)  
Galois Field: finite field of 2m elements represented by polynomials with degree < m  
Galois Field, set of whole numbers less than prime number p  
Input/Output  
I/O  
Modulus  
RAM  
Component of RSA key  
Random Access Memory  
RISC  
Reduced Instruction Set Computer  
RNG, TRNG  
ROM  
Random Number Generator, True Random Number Generator  
Read-Only Memory  
RSA  
SHA-1  
STS  
Rivest, Shamir and Adleman, inventors of the RSA cryptosystem  
Secure Hash Algorithm revision 1  
Self Test Software  
T=0, T=1  
UART  
Communication Protocols defined in ISO 7816 standard  
Universal Asynchronous Receiver/Transmitter  
Sales code name  
SLE: IFX name  
S: Solitary Digital Circuits  
L: Free selectable  
CL: Contactless  
controller  
Ordinal number:  
e.g.: 0, 1  
E: Temperature range  
(-25°C up to +85°C)  
SLE 66 CL  
8 0 PE(M)  
Chip Family  
EEPROM size  
Product Family  
66: 8/16-bit  
e.g.:  
8: 8KB  
PE: Plus Enhanced  
M:MIFARETM  
compatible interface  
Optimized for high-end  
applications  
13 / 13  
12.2009  

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