SP001231818 [INFINEON]
Giant Magneto Resistance (GMR)-based principle;型号: | SP001231818 |
厂家: | Infineon |
描述: | Giant Magneto Resistance (GMR)-based principle |
文件: | 总45页 (文件大小:1355K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TLE5014
Features
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Giant Magneto Resistance (GMR)-based principle
Integrated magnetic field sensing for angle measurement
360° angle measurement
High voltage and reverse polarity capability
EEPROM for storage of configuration (e.g. zero angle) and customer
specific ID
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•
•
•
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•
•
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12 bit representation of absolute angle value on the output
Max. 1° angle error over lifetime and temperature range
Developed according to ISO26262 with process complying to ASIL-D
Internal safety mechanisms with a SPFM > 97%
Interfaces: PWM, SPC, SENT (based on SAE J2716-2010)
32 point look-up table to correct for systematic angle errors (e.g. magnetic circuit)
112 bit customer ID (programmable)
Automotive qualified Q100, Grade 1: -40°C to 125°C (ambient temperature)
ESD: 4kV (HBM) on VDD and output pin
RoHS compliant and halogen free package
Functional Safety
Safety Manual and Safety Analysis Summary Report available on request
•
Applications
The TLE5014 GMR-based angle sensor is designed for angular position sensing in automotive applications
with focus on steering angle sensor.
Description
Table 0-1 Derivative Ordering codes (see Chapter 6 for description of derivatives)
Product Type
TLE5014P16
TLE5014S16
TLE5014C16
Marking
014P
Ordering Code
SP001231814
SP001231818
SP001231806
Package
Comment
PG-TDSO-16
PG-TDSO-16
PG-TDSO-16
PWM Interface
SENT Interface
SPC Interface
014S
014C
Final Datasheet
www.infineon.com
1
Rev. 1.0
2018-04-04
TLE5014
Table of Contents
1
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.1
1.2
1.3
1.4
1.5
Block Diagram 6
Functional Block Description 6
Sensing Principle 7
Pin Configuration 9
Pin Description 9
2
Application Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3
3.1
3.2
Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Absolute Maximum Ratings 12
Operating Range 13
3.3
Electrical Characteristics 15
3.3.1
3.3.2
3.3.3
3.4
Input/Output Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
ESD Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Angle Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
EEPROM Memory 21
3.5
Reset Concept and Fault Monitoring 21
3.6
External & Internal Faults 21
3.7
Power Dissipation 22
3.8
Device Programming (SICI Interface) 22
4
4.1
Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Sensor Output Driver 24
4.2
Pulse Width Modulation (PWM) Interface 24
4.3
Short PWM Code (SPC) 26
4.3.1
4.3.2
4.3.2.1
4.3.3
4.4
Master Trigger Pulse Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
SPC Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Temperature Calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Checksum Nibble Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
SENT 32
4.4.1
4.4.2
4.4.2.1
4.5
Checksum Nibble Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
SENT Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Temperature Calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
SICI Interface 35
5
End of Line Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
5.1
5.2
5.3
Angle Base and Rotation Direction 36
Customer ID 36
Look-up Table 36
6
Pre-Configured Derivatives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
6.1
6.2
6.3
TLE5014C16 37
TLE5014S16 37
TLE5014P16 38
7
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
7.1
7.2
7.3
Package Parameters 39
Package Outline 41
Footprint 42
Final Datasheet
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TLE5014
7.4
7.5
Packing 42
Marking 43
8
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Final Datasheet
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Rev. 1.0
2018-04-04
TLE5014
List of Tables
Table 0-1 Derivative Ordering codes (see Chapter 6 for description of derivatives) . . . . . . . . . . . . . . . . . . . . . 1
Table 1-1 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 3-1 Maximum Ratings for Voltages and Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 3-2 Maximum Temperature and Magnetic Field . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 3-3 Mission Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 3-4 Lifetime & Ignition Cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 3-5 Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 3-6 Magnetic Field Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 3-7 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 3-8 Output driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 3-9 Signal Delay and Delay Time Jitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 3-10 ESD Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 3-11 Angle Error for -40°C < TA < 85°C and magnetic field range 33mT < B < 50mT . . . . . . . . . . . . . . . . 20
Table 3-12 Angle Error for -40°C < TA < 125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 3-13 EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 3-14 Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 4-1 PWM Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 4-2 PWM Frequency tolerance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Table 4-3 SPC unit times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 4-4 Structure of SPC status nibble . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 4-5 Bus programming Address Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 4-6 SPC trigger for bus mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 4-7 SPC master pulse timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 4-8 SPC blanking time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 4-9 SENT unit times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 4-10 Structure of SENT status nibble . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 6-1 SPC Derivative Configuration TLE5014C16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 6-2 SPC Derivative Configuration TLE5014C16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 6-3 SENT Derivative Configuration TLE5014S16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 6-4 SENT Derivative Configuration TLE5014S16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 6-5 PWM Derivative Configuration TLE5014P16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 6-6 PWM Derivative Configuration TLE5014P16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 7-1 Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 7-2 Position of the die in the package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Final Datasheet
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TLE5014
List of Figures
Figure 1-1 TLE5014 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 1-2 Sensitive bridges of the GMR sensor (not to scale) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 1-3 Pin configuration (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 2-1 Application circuit for SPC interface, with a SPC address ID = 0 defined by pin IF1 and IF2 . . . . 10
Figure 2-2 Application circuit for PWM interface, protocol starting with a rising edge. For interface
configuration starting with a falling edge, a pull-up resistor is required instead. 10
Figure 2-3 Application circuit for SENT interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 3-1 Allowed magnetic field range within ambient temperature range. . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 3-2 Operating area and sensor reaction for over- and undervoltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 3-3 Output level high / low . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 3-4 Delay time. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 3-5 Variation of delay time (jitter) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 4-1 PWM interface with duty cycle range starting with a rising edge. . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 4-2 SPC frame for bus mode with constant trigger length . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 4-3 SPC Master pulse timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Figure 4-4 SPC blanking time in case of same ID triggered. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 4-5 SPC blanking time in case of different IDs are triggered . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 4-6 SPC nibble low time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 4-7 Example of a SPC protocol frame configuration with short serial message enabled . . . . . . . . . . 31
Figure 4-8 SENT frame example, implementation: single secure sensor without pause pulse . . . . . . . . . . . 32
Figure 4-9 SENT nibble low time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Figure 4-10 SENT protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 7-1 Tolerance of the die in the package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Figure 7-2 PG-TDSO-16 package dimension. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Figure 7-3 Position of sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Figure 7-4 Footprint of PG TDSO-16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Figure 7-5 Tape and Reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Figure 7-6 Marking of PG-TDSO-16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Final Datasheet
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TLE5014
Functional Description
1
Functional Description
1.1
Block Diagram
VDD
EEPROM
Filter
PMU
Clock
ADC_X
XMR_X
Interface
SPC
SENT
PWM
ISM_ALG
Angle
Compare
Out
XMR_Y
Temp.
ADC_Y
ADC_T
Filter
CORDIC
(Hardware)
(SICI)
ISM_SAF
Safety
GND
CORDIC
(Software)
Figure 1-1 TLE5014 block diagram
1.2
Functional Block Description
Internal Power Supply (PMU)
The internal blocks of the TLE5014 are supplied from several voltage regulators:
•
•
•
GMR Voltage Regulator, VRS
Analog Voltage Regulator, VRA
Digital Voltage Regulator, VRD
These regulators are directly connected to the supply voltage VDD.
Oscillator and PLL (Clock)
The digital clock of the TLE5014 is given by the Phase-Locked Loop (PLL), which is fed by an internal oscillator.
SD-ADC
The Sigma-Delta Analog-Digital-Converters (SD-ADC) transform the analog GMR voltages and temperature
voltage into the digital domain.
Digital Signal Processing Unit ISM_ALG
The Digital Signal Processing Unit ISM_ALG contains the:
•
Intelligent State Machine (ISM), which does error compensation of offset, offset temperature drift,
amplitude synchronicity and orthogonality of the raw signals from the GMR bridges.
COordinate Rotation DIgital Computer (CORDIC), which contains the trigonometric function for angle
calculation
•
Final Datasheet
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TLE5014
Functional Description
Digital Signal Processing Unit ISM_SAF
The Digital Signal Processing Unit ISM_SAF performs the internal safety mechanism and plausibility checks.
Furthermore, a second CORDIC algorithm is implemented in a diverse way as in the ISM_ALG. This is for cross
checking the angle calculation
Interface
The Interface block is used to generate the PWM, SENT and SPC signals
Angle Compare
This digital block compares the angle value calculated by ISM_ALG and ISM_SAF. In case they are not identical,
an error is indicated in the transmitted protocol.
EEPROM
The EEPROM contains the configuration and calibration parameters. A part of the EEPROM can be accessed by
the customer for application specific configuration of the device. Programming of the EEPROM is achieved
with the SICI interface. Programming mode can be accessed directly after power-up of the IC.
1.3
Sensing Principle
The Giant Magneto Resistance (GMR) sensor is implemented using vertical integration. This means that the
GMR-sensitive areas are integrated above the logic part of the TLE5014 device. These GMR elements change
their resistance depending on the direction of the magnetic field.
Four individual GMR elements are connected to one Wheatstone sensor bridge. These GMR elements sense
one of two components of the applied magnetic field:
•
•
X component, Vx (cosine) or the
Y component, Vy (sine)
With this full-bridge structure the maximum GMR signal is available and temperature effects cancel out each
other.
Final Datasheet
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TLE5014
Functional Description
16
15
14
13
12
11
10
9
ReferenceDirection:
Resistance low when
external magnetic field is
in this direction
Y
X
0°
1
2
3
4
5
6
7
8
Figure 1-2 Sensitive bridges of the GMR sensor (not to scale)
Attention: Due to the rotational placement inaccuracy of the sensor IC in the package, the sensors 0° position
may deviate by up to 3° from the package edge direction indicated in Figure 1-2.
In Figure 1-2 the arrows in the resistors represent the magnetic direction which is fixed in the reference layer.
If the external magnetic field is parallel to the direction of the Reference Layer, the resistance is minimal. If
they are anti-parallel, resistance is maximal.
The output signal of each bridge is only unambiguous over 180° between two maxima. Therefore two bridges
are oriented orthogonally to each other to measure 360°.
With the trigonometric function ARCTAN2, the true 360° angle value is calculated out of the raw X and Y signals
from the sensor bridges.
Final Datasheet
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Rev. 1.0
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TLE5014
Functional Description
1.4
Pin Configuration
16
15
14
13
12
11
10
9
Center of
Sensitive area
1
2
3
4
5
6
7
8
Figure 1-3 Pin configuration (top view)
1.5
Pin Description
The following Table 1-1 describes the pin-out of the chip.
Table 1-1 Pin Description
Pin No.
1
Symbol
IF1
In/Out
I
Function
address coding for programming in bus mode,
(see Table 4-5)
connect to GND for SENT / PWM interface
2
IF2
I
address coding for programming in bus mode,
(see Table 4-5)
connect to GND for SENT / PWM interface
3
4
5
6
7
8
IF3
I
connect to IFC
VDD
GND
IFA
-
supply voltage, positive
supply voltage, ground
connect to GND.
-
-
IFB
IFC
I/O
O
SENT / SPC / PWM / SICI interface
address coding for programming in bus mode,
(see Table 4-5)
connect to IF3
9-16
-
-
n.c.
Final Datasheet
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TLE5014
Application Circuits
2
Application Circuits
The application circuits in this chapter show the various communication possibilities of the TLE5014. To
improve robustness against electro-magnetic disturbances, a capacitor of 100nF on the supply and a
capacitor with minimum value of Cw = 1nF on the output pin is recommended. These capacitors shall be
placed as close as possible to the corresponding sensor pins.
VDD
VµC
TLE5014
IF1
IF2
IF3
IFA
IFB
IFC
Rp
VDD
µController
Master
100nF
SPC
GND
Cw
GND
Figure 2-1 Application circuit for SPC interface, with a SPC address ID = 0 defined by pin IF1 and IF2
VDD
VµC
TLE5014
IF1
IF2
IF3
IFA
IFB
IFC
VDD
µController
Master
100nF
PWM
GND
Rp
Cw
GND
Figure 2-2 Application circuit for PWM interface, protocol starting with a rising edge. For interface
configuration starting with a falling edge, a pull-up resistor is required instead.
Final Datasheet
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TLE5014
Application Circuits
VDD
VµC
TLE5014
IF1
IF2
IF3
IFA
IFB
IFC
10k
VDD
µController
Master
100nF
560
2.2n
10k
GND
68p
100p
GND
Figure 2-3 Application circuit for SENT interface
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TLE5014
Specification
3
Specification
3.1
Absolute Maximum Ratings
Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute
ratings; exceeding only one of these values may cause irreversible damage to the device.
Table 3-1 Maximum Ratings for Voltages and Output Current
Parameter
Symbol
Values
Typ.
Unit Note / Test Condition
Min.
-18
Max.
26
Absolute maximum supply VDD
voltage
V
for 40h, no damage of device;
-18V means VDD < GND
Voltage Peaks
VDD
30
V
V
for 50µs, no current limitation
Absolute maximum voltage VIO
for pin IFB
-18
19.5
for 40h; no damage of device,
-18V means VDD < GND
Absolute maximum voltage VIF
for pin IF1, IF2, IF3, IFA, IFC
-0.3
6
V
no damage of device
Voltage Peaks (for pin IFB) VIO
30
40
V
for 50µs, no current limitation
Maximum current through Ishort
output in case of short
circuit
mA
for 40h, no damage of the
device, current limited by
device
Table 3-2 Maximum Temperature and Magnetic Field
Parameter
Symbol
Values
Typ.
Unit Note / Test Condition
Min.
-40
Max.
125
Maximum ambient
temperature
TA
°C
Q100, Grade 1
Maximum allowed magnetic B
field
200
150
40
mT
mT
°C
max 5 min @ TA = 25°C
max 5 h @ TA = 25°C
Maximum allowed magnetic B
field
Storage & Shipment1) 2)
Tstorage
5
for dry packed devices,
Relative humidity < 90%,
storage time < 3a
1) Air-conditioning of ware houses, distribution centres etc. is not necessary, if the combination of the specified limits
of 75% R.H. and 40 °C will not be exceeded during storage for more than 10 events per year, irrespective of the
duration per event, and one of the specified limits (75 % R.H. or 40 °C) will not be exceeded for longer than 30 days
per year
2) See Infineon Application Note: “Storage of Products Supplied by Infineon Technologies”
Final Datasheet
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TLE5014
Specification
Table 3-3 Mission Profile
Parameter
Symbol
TA,max
Values
Typ.
Unit Note / Test Condition
°C for 2000h
Min.
Min.
Max.
125
Mission Profile
Table 3-4 Lifetime & Ignition Cycles
Parameter
Symbol
Values
Unit Note / Test Condition
Typ. Max.
15.000
Operating life time
Total life time
top_life
ttot_life
Nignition
h
a
see Table 3-3 for mission profile
additional 2a storage time1)
19
Ignition cycles
200.000
during operating lifetime top_life
1) The lifetime shall be considered as an anticipation with regard to the product that shall not extend the warranty
period
The device qualification is done according to AEC Q100 Grade 1 for ambient temperature range -40°C < TA <
125°C
3.2
Operating Range
The following operating conditions must not be exceeded in order to ensure correct operation of the angle
sensor. All parameters specified in the following sections refer to these operating conditions, unless otherwise
noted. Table 3-5 is valid for -40°C < TA < 125°C unless otherwise noted.
Table 3-5 Operating Range
Parameter
Symbol
Values
Typ.
Unit Note / Test Condition
Min.
4.2
Max.
5.5
108
Operating supply voltage
Supply Voltage Slew Rate
VDD
V
-
-
-
VDD_slew
TA
0.1
V/s
°C
Operating ambient
temperature
-40
125
Angle speed
n
10000 °/s
-
Min/max value for pull-up
resistor for SENT
Rp
10
55
kOhm for SENT protocol
Min/max value for pull-up
resistor for SPC
Rp
1.45
2.2
kOhm for SPC protocol
Value for pull-down resistor Rp
for PWM
50
50
kOhm for PWM protocol starting with
rising edge
Value for pull-up resistor for Rp
PWM
kOhm for PWM protocol starting with
falling edge
Capacitive output load on
interface (SPC, SENT, PWM)
Cw
35001) pF
incl. external circuit and cable
1) Larger load capacitance up to 7nF is possible but may influence rise / fall time of the signal
Magnetic Field Range
Final Datasheet
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TLE5014
Specification
The operating range of the magnetic field describes the field values where the performance of the sensor,
especially the accuracy, is as specified in Table 3-11 and Table 3-12. This value is valid for a NdFeB magnet with
a Tc of -1300ppm/K. In case a different magnet is used, the individual Tc of this magnet has to be considered
and ensured that the limits are not exceeded. The allowed magnetic field range for the ambient temperature
range is given in Figure 3-1.
Table 3-6 Magnetic Field Range
Parameter
Symbol
Values
Typ.
Unit Note / Test Condition
Min.
25
Max.
80
Angle measurement field
range @ 25°C
B
mT
TA = 25°C, valid for NdFeB
magnet
The below figure Figure 3-1 shows the magnetic field range which shall not be exceeded during operation at
the respective ambient temperature. The temperature dependency of the magnetic field is based on a NdBFe
magnet with Tc = -1300ppm/K.
100
90
80
70
60
50
40
30
20
-50
-30
-10
10
30
50
70
90
110
130
150
Temperature (°C)
Figure 3-1 Allowed magnetic field range within ambient temperature range.
It is also possible to widen the magnetic field range for higher temperatures. In that case, additional angle
errors have to be considered.
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TLE5014
Specification
3.3
Electrical Characteristics
3.3.1
Input/Output Characteristics
The indicated parameters apply to the full operating range, unless otherwise specified. The typical values
correspond to a supply voltage VDD = 5.0V and an ambient temperature TA = 25°C, unless individually specified.
All other values correspond to -40°C < TA < 125°C.
Table 3-7 Electrical Characteristics
Parameter
Symbol
Values
Min. Typ.
Unit Note / Test Condition
Max.
15
Operating Supply Current
IDD
12
mA
ms
-
Time between supply voltage tPon
reaches reset value and valid
angle value is available on the
output (without interface
delay
7
Overvoltage detection on VDD VOV
6.5
7.0
V
V
in an overvoltage condition
the output switches to tri-
state
Undervoltage detection on VDD VUV
Overvoltage detection on IFB VOB
3.8
4.1
in an undervoltage condition
the sensor performs a reset
1.5V+VDD
in an overvoltage condition
the output switches to tri-
state
Ripple Current due to PWM
slopes
Iripple
Iripple
Δfclock
9
9
5
mA
mA
%
peak-peak; VDD = 5V,
30kHz lowpass filter
Ripple Current due to SENT
slopes
peak-peak; VDD = 5V,
30kHz lowpass filter
Internal clock tolerance
-5
including temperature and
lifetime
The following Figure 3-2 shows the operating area of the device, the condition for overvoltage and
undervoltage and the corresponding sensor reaction. The values for the over- and undervoltage comparators
are the typical values from Table 3-7.
In the extended range, the sensor fulfills the full specification. However, voltages above the operating range
can only be applied for a limited time (see Table 3-1).
Final Datasheet
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TLE5014
Specification
V_out
No output
8.0
Sensor
reset
No output
7.0
5.7
No output
Operating
range
VDD
6.5
4.1 4.2
5.5
Figure 3-2 Operating area and sensor reaction for over- and undervoltage.
Table 3-8 Output driver
Parameter
Symbol
Values
Typ.
Unit Note / Test Condition
VDD = 5V, Isink = 0.1mA (SENT spec)
Min.
Max.
Output low level1)
Output low level1)
Output low level1)
Output high level1)
Output high level1)
Output high level1)
VOL
VOL
VOL
VOH
VOH
VOH
0.1*VDD
0.2*VDD
0.3*VDD
VDD = 5V, Isink = 2mA
VDD = 5V, Isink = 3mA
0.9*VDD
0.8*VDD
0.7*VDD
VDD = 5V, Isink = 0.1mA (SENT spec)
VDD = 5V, Isink = 2mA
VDD = 5V, Isink = 3mA
1) In case several sensors are connected in a bus mode, the output levels may be influenced and out of specification in
case a malfunction of one of the sensors on the bus occurs (e.g. one sensors has loss of VDD).
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TLE5014
Specification
VOUT
VDD
VOH
VOL
t
Figure 3-3 Output level high / low
Output Delay Time and Jitter
Due to the internal signal sampling and signal conditioning, there will be a delay of the provided angle value
at the output. The definition of this delay is described in below Figure 3-4
Table 3-9 Signal Delay and Delay Time Jitter
Parameter
Symbol
Values
Typ.
Unit
µs
Note /
Test Condition
Min.
10.0
Max.
42.5
Delay time between real angle
and angle output (from
SPC/SENT falling edge of sync
pulse, without interface delay)
incl. jitter and oscillator
tolerances
tadel
25.6
min/max values
include already the
jitter tdeljit
Delay time between real angle
and angle output (from PWM
rising edge, without interface
delay) incl. jitter and oscillator
tolerances
tadel
36.7
51.2
67.4
µs
µs
min/max values
include already the
jitter tdeljit
Variation of delay time tadel
tdeljit
+/-14
see Figure 3-5.
already included in
tadel specification
The delay time describes the time difference of the real angle at the point in time were the SPC/SENT protocol
issues a falling edge (synchronization nibble) and the angle value which is transmitted with this data frame. It
is the “age” of the transmitted angle value in reference to the falling edge of the synchronization pulse.
For PWM interface the reference point in time is the starting edge of the PWM (rising or falling, depending on
protocol setting).
The delay time values given in Table 3-9 include also the internal oscillator variation and jitter.
The delay time variation (or jitter of delay time) describes the statistical variation of this parameter in case
several measurements are done. The delay time tadel can be considered as the mean value with the jitter tdeljit
as variation (see Figure 3-5).
Final Datasheet
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Rev. 1.0
2018-04-04
TLE5014
Specification
α
α
tadel
t
t
PWM_out
TPWM
α
SPC_out
SPC trigger
nibble
α
t
SENT_out
α
t
Figure 3-4 Delay time
Probability
tdeljit
tdeljit
t
tadel (typ.)
Figure 3-5 Variation of delay time (jitter)
Final Datasheet
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TLE5014
Specification
3.3.2
ESD Protection
Table 3-10 ESD Voltage
Parameter
Symbol
VHBM
Values
Typ.
Unit Note / Test Condition
Min.
Max.
±4
Electro-Static-Discharge
voltage (HBM), according to
ANSI/ESDA/JEDEC JS-001
kV
kV
kV
HBM contact discharge
for pins VDD, GND, IFB
Electro-Static-Discharge
voltage (HBM), according to
ANSI/ESDA/JEDEC JS-001
VHBM
±2
HBM contact discharge
for pins IF1, IF2, IF3, IFA, IFC
Electro-Static-Discharge
voltage (CDM), according to
JESD22-C101
VCDM
±0.5
for all pins except corner pins
for corner pins only
±0.75 kV
Final Datasheet
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Rev. 1.0
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TLE5014
Specification
3.3.3
Angle Performance
After internal angle calculation, the sensor has a remaining error, as shown in Table 3-11 for an ambient
temperature range up to 85°C and a reduced magnetic field range and in Table 3-12 for the ambient
temperature range up to 125°C and full magnetic operating range. The error value refers to BZ= 0mT.
The overall angle error represents the relative angle error. This error describes the deviation from the
reference line after zero-angle definition. It is valid for a static magnetic field.
If the magnetic field is rotating during the measurement, an additional propagation error is caused by the
angle delay time (see Table 3-9).
Table 3-11 Angle Error for -40°C < TA < 85°C and magnetic field range 33mT < B < 50mT
Parameter
Symbol
Values
Typ.
Unit Note / Test Condition
Min.
Max.
0.8
Accuracy1) over temperature AErr,T
w/o look-up table
Accuracy1) over temperature AErr,s
and lifetime,
°
°
0h2), over temperature
0.9
lifetime stress:
TA=85°C/1000h/50mT
w/o look-up table
Accuracy1)3) over
temperature and lifetime,
with look-up table
AErr,sLUT
0.65
0.16
°
°
lifetime stress:
TA=85°C/1000h/50mT
with look-up table correction
Hysteresis4)
AHyst
0.1
value includes quantization
error of 12bit angle output
1) Hysteresis and noise are included in the angle accuracy specification
2) “0h” is the condition when the part leaves the production at Infineon
3) Verified by characterization
4) Hysteresis is the maximum difference of the angle value for forward and backward rotation
Table 3-12 Angle Error for -40°C < TA < 125°C
Parameter
Symbol
Values
Typ.
Unit Note / Test Condition
Min.
Max.
0.8
Accuracy1) over temperature AErr,T
w/o look-up table
Accuracy1) over temperature AErr,s
and lifetime,
°
°
0h2), over temperature
B = 33mT to 80mT3)
33mT…80mT3)
1.0
lifetime stress: TA=125°C/2000h
w/o look-up table
Accuracy1)4) over
temperature and lifetime,
with look-up table
Hysteresis5)
AErr,sLUT
0.85
0.16
°
°
B = 33mT to 80mT3),
lifetime stress: TA=125°C/2000h
with look-up table correction
B = 33mT to 80mT6), value
includes quantization error of
12bit angle output
AHyst
0.1
1) Hysteresis and noise are included in the angle accuracy specification
2) “0h” is the condition when the part leaves the production at Infineon
3) For the magnetic field range of 25mT < B < 33mT, 0.2° have to be added to the max. angle accuracy
4) Verified by characterization
Final Datasheet
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TLE5014
Specification
5) Hysteresis is the maximum difference of the angle value for forward and backward rotation
6) For the magnetic field range of 25mT < B < 33mT, 0.1° have to be added to the max. hysteresis AHyst
3.4
EEPROM Memory
The sensor includes a non-volatile memory (NVM) where calibration data and sensor configuration data are
stored. The customer has access to a part of this memory for storage of application specific data (e.g. look-up
table & customer ID)
The time for programming the customer relevant part of the NVM as well as maximum cycles of programming
and data retention is given in Table 3-13
Table 3-13 EEPROM
Parameter
Symbol
Values
Typ.
Unit Note /
Test Condition
Number
Min.
Max.
100
Number of possible NVM
programming cycles
nProg
-
NVM data retention
tretention
-
21
a
s
includes 19a
lifetime and 2a
storage
Time for programming of
whole NVM (customer
relevant part)
tProg
0.5
incl. look-up
table,
configuration,
customer ID;
with 100kbit/s
3.5
Reset Concept and Fault Monitoring
Some internal and external faults of the device can trigger a reset. During this reset, all output pins are high-
ohmic to avoid any disturbance of other sensors which may be connected together in a bus mode. A reset is
indicated as soon as the sensor is back at operational mode either by a status bit (SPC and SENT protocol) or
with a duty cycle in the diagnostic range (PWM interface). In the case of a periodic reset (sensor toggles
between on and off state) it is avoided that the output toggles with a frequency close to a valid PWM
frequency. In this way it is ensured, that a reset can clearly be distinguished from a valid output signal.
3.6
External & Internal Faults
In case of an occurrence of external or internal faults, as for example overvoltage or undervoltage, the sensor
reacts in a way that these faults are indicated to the customer. This can be either by a status bit (SPC and SENT
protocol) or with a duty cycle in the diagnostic range (PWM interface).
The error signaling (safe state) is defined as:
•
•
•
indication of an error (e.g. status bit)
detectable wrong output (e.g. CRC failure)
no output
All errors are indicated as long as they persist, but at least once. After disappearance of the error, the error
indication is also cleared. The error is signaled and communicated to the ECU latest after 5ms from occurrence
of the fault. To achieve this, it has to be ensured that the protocol transmission time is not exceeding 1ms.
Otherwise, the fault tolerant time interval is increased above 5ms.
Final Datasheet
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Rev. 1.0
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TLE5014
Specification
Overvoltage, undervoltage
It is ensured, that the sensor provides a valid output value as long as the voltage is within the operating range
or no under- or overvoltage is indicated. At occurrence of an undervoltage, the sensor performs a reset. The
implemented undervoltage comparator at VDD detects an undervoltage at ~4.1V (typ. value). At occurrence of
an overvoltage, the sensor output goes to tristate and no protocol is transmitted. The implemented
overvoltage comparator at VDD detects an overvoltage at ~6.5V (typ. value). An overvoltage on the output pin
IFB is detected as soon as the voltage at IFB is more than ~1.5V above VDD.
Open and Shorts
All pins of the device withstand a short to ground (GND) and a short to VDD (as long as VDD is within the operating
range). In case of an open VDD connection or an open GND the sensor provides a detectable wrong signal (e.g.
no valid output protocol or duty cycle) which is considered as a safe state.
It is also ensured that a short between two neighboring pins leads to a detectable wrong output signal.
Communication Failures
An external fault can happen where an ongoing communication is interrupted before it is finished correctly. In
such an event, no sensor malfunction or dead-lock will occur.
3.7
Power Dissipation
Following table describes the calculated power dissipation for the different application cases within the
operating range defined in Table 3-5. It is a worst case assumption with the maximum values within the
operating range.
Table 3-14 Power Dissipation
Scenario
Configuration
PWM
V
DD (V)
IDD (mA)
15
VOUT (V)
IOUT (mA)
P (mW)
82.5
1
2
3
4
5.5
5.5
5.5
5.5
SPC open drain
SENT
15
1.1
0.2
1.1
3
85.8
15
0.55
3
82.6
SPC bus mode
15
85.8
3.8
Device Programming (SICI Interface)
To minimize the wiring in the application and to allow an end of line calibration and configuration of the
device at the customer, the programming interface does not require additional pins or wiring. It is possible to
do the programming on the available output line of the sensor output (SPC, SENT or PWM interface). This
single wire interface is called SICI interface. It is only for programming purpose and not for communication or
read out of angle values during operation. The programming mode can be accessed directly after start-up of
the IC by sending the appropriate command on the output line.
Following parameters can be programmed end of line:
•
•
•
•
Zero angle (angle base)
Rotation direction (clock wise or counter clock wise)
Look-up table (32 points)
Customer ID (112bit individual data)
Final Datasheet
22
Rev. 1.0
2018-04-04
TLE5014
Specification
To align the angle output of the sensor with the application specific required zero angle direction this value
can be programmed. All further output angles are in reference to this zero angle.
In case several sensors are connected in a bus mode configuration (SPC interface) each sensor needs to have
an individual address to enable a programming of the devices in the bus configuration. Please refer to
Table 4-5 for details how to assign individual addresses to the sensors.
Look-Up Table
To increase the accuracy of the provided angle value, a look-up table is implemented which allows to
compensate for external angle errors which may be introduced for example by the magnetic circuit. Alignment
tolerances (eccentricity or tilt) may lead to a non-linearity of the output signal which can be compensated
using the implemented look-up table. This look-up table has 32 equidistant points over 360° angle range with
a linear interpolation between the 32 defined values
Further details for programming and configuration of the device can be found in the corresponding user
manual of the TLE5014.
Final Datasheet
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TLE5014
Interfaces
4
Interfaces
This chapter describes the interfaces of the sensor. Several interfaces are implemented, the active interface is
predefined by Infineon and can not be changed. The available preconfigured devices are described in
Chapter 6. The indicated parameters apply to the full operating range, unless otherwise specified. The typical
values correspond to a supply voltage VDD = 5.0V and an ambient temperature of TA = 25°C, unless individually
specified. All other values correspond to -40°C < TA < 125°C
4.1
Sensor Output Driver
The TLE5014 has an output driver on the pin IFB which can be switched from a push-pull configuration to a
quasi-open drain with active controlled slope.
•
The push-pull configuration is preferred with SENT and PWM interface. It has controlled rising and falling
slopes to reduce EMC emission and provides a controlled and defined pulse length independent of
external circuitry. The push-pull output driver switches between 0V and VDD. An additional pull-down or
pull-up resistor is recommended to ensure a defined output level at sensor start-up.
•
For the SPC interface the open drain setting with controlled slopes is required. In this configuration, the
TLE5014 has controlled rising and falling slopes but after reaching the HIGH-level, the output is switched
to an open-drain behavior. The HIGH level is then maintained by the external pull-up resistor. It is
necessary, that the sensor releases the output line once reaching the HIGH level so that the master (µ-
Controller) can issue the SPC trigger pulse by pulling the line low.
4.2
Pulse Width Modulation (PWM) Interface
PWM Interface: An uni-directional interface with the angle information coded in the length of a pulse. The
angle value is proportional to the duty cycle of the output frequency.
The duty cycle is calculated as the ratio of the “high” time to the period length. An increasing angle results in
an increased duty cycle, with an angle of 0° having the smallest duty cycle.
Table 4-1 PWM Interface
Parameter
Symbol
fPWM1
Values
Typ.
Unit Note / Test Condition
Min.
200
Max.
2200
PWM output frequencies
Resolution
Hz
bit
%
configurable
12
Data duty cycle range
DCdata
5
95
configurable, the 12bit angle
value is mapped to this duty
cycle range
Diagnostic duty cycle, low1) DCdiag,low
Diagnostic duty cycle, high1) DCdiag,high
0
25
%
%
configurable, fault indication
75
100
configurable, BIST error
indication or reset indication
1) Care has to be taken to ensure that there is no overlap of diagnostic duty cycle and data duty cycle range
The starting edge of the PWM protocol can be programmed as rising or falling edge. In case the protocol shall
start with a rising edge (start with a LOW level), a pull-down resistor is required (see Figure 2-2). For the start-
up condition with a falling edge (start with a HIGH level), a pull-up resistor instead has to be implemented.
The tolerance of the programmed PWM frequency over temperature and lifetime is given in Table 4-2
Final Datasheet
24
Rev. 1.0
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TLE5014
Interfaces
Table 4-2 PWM Frequency tolerance
Parameter
Symbol
Values
Typ.
Unit Note / Test Condition
%
Min.
PWMfreq_tol -5
Max.
5
PWM Frequency tolerance
PWM Interface Error Indication
For diagnostic purpose and to indicate internal sensor failures, the output duty cycle of the PWM is limited.
Within this reserved lower and upper duty cycle range, no valid angle information is provided. Instead, this
duty cycle range is used for error indication with defined duty cycles which are clearly separated from the
usable data duty cycle range. The following events are indicated:
•
•
•
Error occurred during performing the built-in self test (BIST) after power-up
Occurrence of internal or external fault
Sensor reset occurred
PWM Interface Configuration
The PWM interface parameter can be configured in a wide range. Beside the frequency, it is also possible to
define data duty cycle range and low and high value of the diagnostic duty cycle. It has to be ensured by proper
device configuration that there is no overlap of data duty cycle range and low or high value of diagnostic duty
cycle.
A possible and valid configuration is:
•
•
•
Data duty cycle: 12.5% ...87.5%, the 12bit angle value is mapped to this duty cycle
Diagnostic duty cycle, low: 5%; an internal sensor fault is indicated with this duty cycle
Diagnostic duty cycle, high: 95%; an start-up BIST error or sensor reset is indicated with this duty cycle
The PWM interface with data duty cycle range and reserved duty cycle for diagnostics is shown in Figure 4-1
PWM out
TPWM = 1/fPWM
Duty cycle range for angle
value transmission
t
Reserved duty cycle range for
diagnostics
Figure 4-1 PWM interface with duty cycle range starting with a rising edge
As the PWM interface is an analog protocol, the rise and fall times, as well as the trigger level for the detection
of the high and low state of the signal have influence on the measured duty cycle. Therefore, an additional
angle error is introduced which varies with the measurement conditions (e.g. Rp, CW, trigger level). This error
contribution is not included in Table 3-11 and Table 3-12.
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Interfaces
4.3
Short PWM Code (SPC)
The Short PWM Code (SPC) is a synchronized data transmission based on the SENT protocol (Single Edge
Nibble Transmission) defined by SAE J2716. As opposed to SENT, which implies a continuous transmission of
data, the SPC protocol transmits data only after receiving a specific trigger pulse from the microcontroller. The
required length of the trigger pulse depends on the sensor number, which is configurable. Thereby, SPC allows
the operation of up to four sensors on one bus line.
As in SENT, the time between two consecutive falling edges defines the value of a 4-bit nibble, thus
representing numbers between 0 and 15. The transmission time therefore depends on the transmitted data
values. All values are multiples of a unit time frame concept (Table 4-3). A SPC frame consists of the following
nibbles (see Figure 4-2):
•
•
•
•
•
•
•
A trigger pulse from the master (microcontroller), which initiates the data transmission
A synchronization period of 56 UT
A status nibble of 12-27 UT
3 data nibbles of 12-27 UT, transmitting a 12bit angle value
A 4bit rolling counter of 12-27 UT (optional)
A CRC nibble of 12-27 UT
An end pulse to terminate the SPC transmission (12 UT)
Table 4-3 SPC unit times
Parameter
Symbol
UT
Values
Typ.
Unit Note / Test Condition
µs configurable in steps of 0.5µs,
Min.
1.5
Max.
3.0
SPC unit time
tolerance given by clock
tolerance
The CRC checksum includes the status nibble and the data nibbles and can be used to check the validity of the
decoded data.
The status nibble, which is sent with each SPC data frame, provides an error indication. In case the sensor
detects an error, the corresponding error bit in the status nibble is set. An error is indicated by the
corresponding error bit in the status nibble as long as it persists, but at least once.
Table 4-4 Structure of SPC status nibble
Bits
Description
[0] LSB
[1]
Short Serial Message bit (data) or bus mode ID LSB
Short Serial Message bit (start indication) or bus mode ID MSB
Warning indication (internal or external faults)
Error indication (BIST error or sensor reset)
[2]
[3] MSB
SPC bus mode
When the sensor is used in a bus mode with other sensors on a common SPC line, individual addresses have
to be assigned to each sensor for identification. These address is configured in the EEPROM of the device. A
corresponding trigger nibble from the microcontroller can therefore address each individual sensor. The
trigger nibble low time is shown in Table 4-6. Each low time corresponds to an individual sensor address. The
total length of the trigger nibble can be selected to be constant at 90UT (constant trigger length) or variable
according to Table 4-7 (variable trigger length).
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Interfaces
Synchronisation
Frame
End
pulse
Trigger Nibble
Status Nibble Data Nibble 1 Data Nibble 2 Data Nibble 3
CRC
Rolling counter
90 UT
56 UT
12 … 27 UT
12 … 27 UT
12 … 27 UT
12 … 27 UT
12 … 27 UT
12 … 27 UT
12 UT
µC Activity
Sensor Activity
Figure 4-2 SPC frame for bus mode with constant trigger length
Selection of the addresses for SPC interface and bus programming
The SPC protocol allows a bus configuration of up to 4 participants on one output line. To identify the
individual devices and allow a programming in the bus mode, an individual address has to be assigned to each
sensor. The programming interface SICI is using hard-wired addresses (see Table 4-5), whereas the SPC
protocol uses the addresses configured in the corresponding EEPROM of the sensor. For the operation of the
sensor in a SPC bus mode, it is strongly recommended that the hard-wired address is also written into the
EEPROM of the sensor, as all sensors are preconfigured with the default value “ID = 0” (see user manual for
further details).
Table 4-5 Bus programming Address Configuration
Address
IF1
IF2
0
1
2
3
GND
IFC
GND
GND
IFC
GND
IFC
IFC
4.3.1
Master Trigger Pulse Requirements
A SPC transmission is initiated by a master trigger pulse on the output pin. To detect a low-level, the voltage
must be below a threshold Vth. The sensor detects that the output line has been released as soon as Vth is
crossed. Figure 4-3 shows the timing definitions for the master pulse. The master low time tmlow is given in
Table 4-6. The total trigger time tmtr is given in Table 4-7.
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Interfaces
tmtr
SPC
Vth, rising
Vth, falling
tmlow
Figure 4-3 SPC Master pulse timing
Table 4-6 SPC trigger for bus mode
Parameter
Symbol
Values
Unit Note / Test Condition
Min.
9
Typ.
Max.
12
Master nibble low time
Master nibble low time
Master nibble low time
Master nibble low time
tmlow
tmlow
tmlow
tmlow
UT
UT
UT
UT
addr. 0
addr. 1
addr. 2
addr. 3
19
23
35.5
61.5
40.5
67.5
Table 4-7 SPC master pulse timing
Parameter
Symbol
Values
Typ.
35
Unit Note / Test Condition
Min.
Max.
1)
Threshold, falling edge
Threshold, rising edge
Vth,falling
Vth,rising
% of
VDD
1)
50
90
% of
VDD
Total trigger time
Total trigger time
tmtr
tmtr
UT
UT
2) for constant trigger length
2) for variable trigger length
tmlow
12
+
1) Not subject to production test - verified by design/characterization
2) Trigger time in the sensor is fixed to the number of units specified in the “typ.” column, but the effective trigger time
varies due to the sensor’s clock variation
After a SPC frame is transmitted, it is necessary to wait for a specified delay time tframe,blanking , before the next
SPC trigger can be issued. This time is defined from the falling edge of the end pulse to the falling edge of the
trigger nibble (see Figure 4-4).
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Interfaces
tframe,blanking
Synchronisation
Frame
End
pulse
Status Nibble
CRC
Trigger Nibble
Data Nibble 1
90 UT
12 … 27 UT
12 UT
56 UT
12 … 27 UT
12 … 27 UT
µC Activity
Sensor Activity
Figure 4-4 SPC blanking time in case of same ID triggered
tframe,blanking
End
Synchronisation
Frame
pulse
Status Nibble
CRC
Trigger Nibble
Data Nibble 1
90 UT
12 … 27 UT
56 UT
12 … 27 UT
12 … 27 UT
µC Activity
Sensor Activity
Figure 4-5 SPC blanking time in case of different IDs are triggered
Table 4-8 SPC blanking time
Parameter
Symbol
Values
Typ.
Unit Note / Test Condition
1) same ID is triggered,
Min.
Max.
SPC blanking time
tframe,blanking
12UT
measured from falling edge of
end pulse
SPC blanking time
tframe,blanking
50µs
1) different ID’s are triggered,
measured from rising edge
(50%) of end pulse
1) Not subject to production test - verified by design/characterization
The nibble low time tlow can be configured to be 3UT or 5UT. This can reduce the overall frame length. The low
time includes the fall time of the edge, therefore it has to be ensured that the fall time of the edge is fast
enough to reach the low level within the configured low time (Figure 4-6).
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Interfaces
Synchronisation
Frame
Status Nibble
Data Nibble 1 Data Nibble 2 Data Nibble 3
tlow
Figure 4-6 SPC nibble low time
4.3.2
SPC Features
Rolling counter
This 4bit counter counts the number of transmitted frames with rollover back to 0 and increment with each
message. This counter is for verification in the ECU that no frame is missed or that no frame is sent repeatedly
from the sensor. The rolling counter nibble is sent after the 3rd data nibble and before the CRC nibble.
The rolling counter nibble can be disabled, but to meet the safety requirements and target ASIL level of the
application, this is not recommended.
Optional, the rolling counter can be included in the CRC nibble, thus reducing the total number of nibbles and
therefore the total frame length. In this case, the rolling counter is reduced to a 2bit value. Further details can
be found in Chapter 4.3.3
Short Serial Message
The short serial message is an additional option which can be enabled and disabled. The short serial message
provides additional information in a slow channel transmitting a 8bit temperature value, a 16bit word
containing angle base & rotation direction information and a 32bit sensor ID.
In each SPC frame, one bit of information is transmitted. The start of the short serial message is indicated by
a “1” in bit [1] of the status nibble. For the next 15 SPC frames, this bit will contain a “0”. Information is
transmitted in blocks of 16bit with 1 bit per SPC frame in bit [0] of the status nibble.
4 bit message ID
8 bit data
4bit CRC (calculated from message ID and data bits)
The message ID is used for identification of the type of data received. All data are transmitted in the bit [0] of
the status nibble in the order MSB to LSB.
The transmitted information is as follows:
Message -ID 0: 8bit temperature value starting with MSB
Message -ID 1: 8bit of angle base (starting with MSB) address 0x00A0, bit [15:8]
Message -ID 2: 8bit of angle base (starting with MSB-8) address 0x00A0, bit [7:0]
Message -ID 3: 8bit temperature value starting with MSB
Message -ID 4: 8bit of sensor ID1 (starting with MSB) address 0x00F2, bit [15:8]
Message -ID 5: 8bit of sensor ID1 (starting with MSB-8) address 0x00F2, bit [7:0]
Message -ID 6: 8bit of sensor ID2 (starting with MSB) address 0x00F4, bit [15:8]
Message -ID 7: 8bit of sensor ID2 (starting with MSB-8) address 0x00F4, bit [7:0]
Message -ID 8 to Message -ID 15: Message -ID 0 to Message -ID 7 will be repeated
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Interfaces
In case the short serial message is enabled, the bits [0] and [1] of the status nibble for address (sensor ID)
indication are not available. In this case, the sensor ID is coded in the CRC. Further details in Chapter 4.3.3.
Short serial message (SSM), with rolling counter
CRC &
ID
Status &
SSM
Rolling
counter
Data 3
End
Trigger
Sync
Data 1
Data 2
Figure 4-7 Example of a SPC protocol frame configuration with short serial message enabled
4.3.2.1
Temperature Calculation
The temperature information which is transmitted with the short serial message is an 8-bit value. It has to be
considered as a two-complement ranging from T[LSB] = -128LSB ... +127 LSB
To obtain the temperature value in °C the following calculation has to be performed:
(4.1)
2 ⋅ T[LSB] + 34.54
T[°C] = -----------------------------------------------
1.3815
4.3.3
Checksum Nibble Details
The checksum nibble is a 4-bit CRC of the data nibbles including the status nibble. The CRC is calculated using
a polynomial x4+x3+x2+1 with a seed value of 0101B. The remainder after the last data nibble is transmitted as
CRC.
Depending on SPC frame configuration, different options for the CRC calculation have to be considered:
Short serial message disabled and rolling counter information as nibble:
the input data for CRC calculation are: STATUS & DATA1 & DATA2 & DATA3 & ROLLING_COUNTER
Rolling counter information is coded in the CRC (no explicit rolling counter nibble):
The two LSBs of the rolling counter information is prepended to "00" and added to the input data of the CRC
calculation (R1 R0 0 0). In this case, the rolling counter has only 2 bits.
Short serial message enabled and rolling counter information transmitted as nibble:
the sensor ID is coded in the CRC: the two bit value of the ID on LSB position is appended to “00” and added to
the input data of the CRC calculation (0 0 ID1 ID0)
Short serial message enabled and the rolling counter information coded in the CRC:
the two bit value of the ID on LSB position is appended to the 2LSB value of the rolling counter on MSB position
and added to the input data of the CRC calculation (R1 R0 ID1 ID0). In this case, the rolling counter has only 2
bits.
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Interfaces
4.4
SENT
SENT Interface: A standardized, uni-directional digital protocol. The information is coded in nibbles with
different length. One nibble contains 4 bit of information. Beside the angle information also a status
information and a CRC is transmitted.
The SENT protocol is implemented according to the standard SAE J2716 JAN2010. The unit time UT is
configurable according to Table 4-9.
Table 4-9 SENT unit times
Parameter
Symbol
UT
Values
Typ.
Unit Note / Test Condition
µs configurable in steps of 0.5µs.
Min.
1.5
Max.
3.0
SENT unit time
tolerance given by clock
tolerance
Two different sensor configurations are possible:
Single Secure Sensor:
The protocol consists of following nibbles
•
•
•
•
•
•
•
•
A synchronization period (56UT)
A status nibble of 12-27 UT
3 data nibbles of 12-27 UT, transmitting a 12bit angle value
2 nibbles with a 8bit rolling counter information
1 nibble as the inverted 1st data nibble
A CRC nibble of 12-27 UT
A pause pulse, this is optional and can be deactivated
A short serial message, this is optional and can be deactivated
Standard Sensor:
The protocol consists of following nibbles
•
•
•
•
•
•
A synchronization period (56UT)
A status nibble of 12-27 UT
3 data nibbles of 12-27 UT, transmitting a 12bit angle value
A CRC nibble of 12-27 UT
A pause pulse, this is optional and can be deactivated
A short serial message, this is optional and can be deactivated
Inverted
Data Nibble 1
Synchronisation
CRC
Status Nibble
Rolling Counter
Data Nibble 1 Data Nibble 2 Data Nibble 3
Rolling Counter
Frame
56 UT
12 … 27 UT
12 … 27 UT
12 … 27 UT
12 … 27 UT
12 … 27 UT
12 … 27 UT
12 … 27 UT
12 … 27 UT
Figure 4-8 SENT frame example, implementation: single secure sensor without pause pulse
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The nibble low time tlow can be configured to be 3UT or 5UT. This can reduce the overall frame length. The low
time includes the fall time of the edge, therefore it has to be ensured that the fall time of the edge is fast
enough to reach the low level within the configured low time (Figure 4-9).
Note: A nibble low time of 3UT is not compliant with the SENT standard SAE J2716 JAN2010.
Synchronisation
Status Nibble
Data Nibble 1 Data Nibble 2 Data Nibble 3
Frame
tlow
Figure 4-9 SENT nibble low time
Rolling counter
This 8bit counter counts the number of transmitted frames with rollover back to 0 and increment with each
message. This counter is for verification in the ECU that no frame is missed or that no frame is sent repeatedly
from the sensor. The rolling counter nibbles are sent after the 3rd data nibble.
SENT data range and error indication
There are two options for the data range and error indication.
•
0°... 360° are mapped to 12bit, i.e. 0... 4095. This information is coded in the three data nibbles. In case of
an internal chip error or a start-up error (BIST error), the status bit [0] of the status nibble is set. An angle
value is transmitted but might not be valid due to the occurred error.
•
0° ... 360° are mapped to 1 ... 4088. In case of an internal sensor error or start-up error (BIST error), the
message “4091” is transmitted and the status bit [0] of the status nibble is set. In case the sensor performs
a reset, the first transmitted status nibble has the status bit [0] set but a valid angle value (within the range
0... 4088) is transmitted with the 3 data nibbles.
Table 4-10 Structure of SENT status nibble
Bits
Description
[0] LSB
[1]
error indication or start-up (BIST) error or sensor reset
reserved
[2]
short serial message bit (data bit)
short serial message bit (start indication)
[3] MSB
4.4.1
Checksum Nibble Details
The checksum nibble is a 4-bit CRC of the data nibbles and is not including the status nibble. The CRC is
calculated using a polynomial x4+x3+x2+1 with a seed value of 0101B. The remainder after the last data nibble
is transmitted as CRC.
4.4.2
SENT Features
Pause Pulse
There is an optional pause pulse which can be activated or deactivated via corresponding bits in the EEPROM.
The pause pulse is implemented in a way that the total frame length is adjusted to 282UT (for option with 6
data nibbles, single secure sensor) or 203UT (3 data nibbles, standard sensor).
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Interfaces
Short Serial Message
The short serial message is an additional option which can be enabled and disabled. The short serial message
provides additional information in a slow channel transmitting a 8bit temperature value, a 16bit word
containing angle base & rotation direction information and a 32bit sensor ID.
In each SENT frame, one bit of information is transmitted. The start of the short serial message is indicated by
a “1” in bit [3] of the status nibble. For the next 15 SPC frames, this bit will contain a “0”. Information is
transmitted in blocks of 16bit with 1 bit per SENT frame in bit [2] of the status nibble.
4 bit message ID
8 bit data
4bit CRC (calculated from message ID and data bits)
The message ID is used for identification of the type of data received. All data are transmitted in the bit [2] of
the status nibble in the order MSB to LSB.
The transmitted information is as follows:
Message -ID 0: 8bit temperature value starting with MSB
Message -ID 1: 8bit of angle base (starting with MSB) address 0x00A0, bit [15:8]
Message -ID 2: 8bit of angle base (starting with MSB-8) address 0x00A0, bit [7:0]
Message -ID 3: 8bit temperature value starting with MSB
Message -ID 4: 8bit of sensor ID1 (starting with MSB) address 0x00F2, bit [15:8]
Message -ID 5: 8bit of sensor ID1 (starting with MSB-8) address 0x00F2, bit [7:0]
Message -ID 6: 8bit of sensor ID2 (starting with MSB) address 0x00F4, bit [15:8]
Message -ID 7: 8bit of sensor ID2 (starting with MSB-8) address 0x00F4, bit [7:0]
Message -ID 8 to Message -ID 15: Message -ID 0 to Message -ID 7 will be repeated
4.4.2.1
Temperature Calculation
The temperature information which is transmitted with the short serial message is an 8-bit value. It has to be
considered as a two-complement ranging from T[LSB] = -128LSB ... +127 LSB
To obtain the temperature value in °C the following calculation has to be performed:
(4.2)
2 ⋅ T[LSB] + 34.54
T[°C] = -----------------------------------------------
1.3815
Single secure sensor, with short serial messager (SSM), with pause pulse
Status &
SSM
Rolling
counter
Rolling
counter
Inverted
Data 1
Data 3
CRC
CRC
Sync
Data 1
Data 2
Pause
Single secure sensor, with short serial messager (SSM), without pause pulse
Status &
SSM
Rolling
counter
Rolling
counter
Inverted
Data 1
Data 3
Sync
Data 1
Data 2
Figure 4-10 SENT protocol
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Interfaces
4.5
SICI Interface
A single wire interface (SICI) which is on the same output pin as the SENT/SPC and PWM output, is
implemented. This interface is used to perform the EEPROM programming with application and customer
specific data (angle base, look-up table, customer-ID). In addition, some chip configuration can be done.
Further details can be found in the corresponding user manual.
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End of Line Configuration
5
End of Line Configuration
Several parameters can be programmed via the single wire interface SICI end of line. No additional
programming pin is required, programming is performed via the output pin. Further details can be found in
the corresponding user manual.
5.1
Angle Base and Rotation Direction
An angle base value can be stored in the EEPROM. The output angle value is then referenced to this angle base.
It is also possible to define the rotation direction, i.e. for a given magnet rotation direction the output angle
value can either be selected to increase or decrease.
5.2
Customer ID
A total storage of 112bits in the EEPROM is reserved for customer specific data (e.g. customer module ID,
etc...). This data can be written via SICI interface. The read-out of the first 32bits of this data can be done with
the short serial message feature during operation as a slow message (only SENT and SPC interface). The
remaining 80bits can only be addressed via SICI and are not asccessible during operation.
5.3
Look-up Table
To increase the sensor performance and angle accuracy, a look-up table with 32 points can optionally be used.
Non-linearity errors coming for example from a misaligned magnetic circuit can thus be compensated. It is
necessary to have an external angle reference for this calibration. The sensor output values at predefined,
precise positions (0°, 11.25°, 22.5°, ...), given by the external reference, have to be determined. These 32 values
are stored in the corresponding EEPROM registers. The sensor performs a linear interpolation between these
reference points for the output value.
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Pre-Configured Derivatives
6
Pre-Configured Derivatives
Derivatives of the TLE5014 are available with different pre-configured register settings for specific application
(“settings”). For each derivative with such settings, the interface type is locked and cannot be changed. Only
the derivatives with such settings have been released for production by Infineon.
Other settings/parameters for other applications could be adjusted but such adjusted settings would not have
been released for production by Infineon.
Furthermore, the available safety analysis and safety manual does only include these preconfigured
derivatives.
6.1
TLE5014C16
The sensor has SPC as predefined interface which is locked and cannot be changed.
The predefined SPC configuration of TLE5014C16 is shown below:
Table 6-1 SPC Derivative Configuration TLE5014C16
Interface
SPC
SPC unit time
2.5µs
SPC low time
5UT
SPC Trigger
Short Serial Message
enabled
constant 90UT
Table 6-2 SPC Derivative Configuration TLE5014C16
Rolling Counter
enabled
Rolling Counter in CRC Look-up Table
disabled
SPC ID
Output driver
enabled, preconfigured 00B
open drain w/
controlled slope
Following parameters and values are allowed to modify:
•
•
•
•
SPC unit time: 1.5µs / 2.5µs
Short serial message: enable / disable
Rolling counter in CRC: enable /disable
SPC ID: 0 / 1 / 2 / 3
6.2
TLE5014S16
The sensor has SENT as predefined interface which is locked and cannot be changed.
The predefined SENT configuration of TLE5014S16 is shown below:
Table 6-3 SENT Derivative Configuration TLE5014S16
Interface
SENT
SENT unit time
3.0µs
SENT low time
5UT
SENT Protocol Type Short Serial Message
single secure sensor enabled
Table 6-4 SENT Derivative Configuration TLE5014S16
SENT Error Indication
SENT Data Range Pause Pulse Look-up Table
Output driver
error code 4091 enabled 1 ... 4088
enabled
enabled, preconfigured push/pull
Following parameters and values are allowed to modify:
•
•
Short serial message: enable / disable
Pause pulse: enable /disable
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Pre-Configured Derivatives
•
•
SENT Protocol Type: Standard / Single Secure Sensor
SENT Error Indication: enable (data range: 1 ... 4088 , error code: 4091) / disable (data range: 0 ... 4095, no
error code)
6.3
TLE5014P16
The sensor has PWM as predefined interface which is locked and cannot be changed.
Table 6-5 PWM Derivative Configuration TLE5014P16
Interface
PWM
PWM Frequency
200Hz
PWM Data Range
12.5% ... 87.5%
PWM Fault
indication
PWM BIST Error or
Reset Indication
5%
95%
Table 6-6 PWM Derivative Configuration TLE5014P16
PWM Starting Level
high (rising edge)
Look-up Table
Output driver
push/pull
enabled, preconfigured
•
To be compliant with the existing safety analysis no change of above parameters is allowed unless
authorized by Infineon
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Package Information
7
Package Information
The device is qualified with a MSL level of 3. It is halogen free, lead free and RoHS compliant.
7.1
Package Parameters
Table 7-1 Package Parameters
Parameter
Symbol Limit Values
Min. Typ. Max.
150 K/W
Unit
Notes
Thermal resistance
RthJA
RthJC
RthJL
Junction to air1)
Junction to case
Junction to lead
260°C2)
45
70
K/W
K/W
Moisture Sensitively Level MSL 3
Lead Frame
Plating
Cu
Sn 100%
> 7 μm
1) according to Jedec JESD51-7
2) suitable for reflow soldering with soldering profiles according to JEDEC J-STD-020E (December 2014)
Table 7-2 Position of the die in the package
Parameter
Tilt
Symbol Limit Values
Min. Typ. Max.
Unit
°
Notes
3
in respect to the z-axis and
reference plane (see
Figure 7-1),
Rotational displacement
3
°
in respect to the reference
axis (see Figure 7-1)
Placement tolerance in
package
100 µm
in x and y direction
z
y
Tilt angle
Reference plane
Chip
Package
Chip
Die pad
Rotational
displacement
x
x
Figure 7-1 Tolerance of the die in the package
The active area of the GMR sensing element is 360µm x 470µm.
It has to be ensured that a magnet is used which has sufficient size to provide a homogeneous magnetic field
over the total sensing element area. For a practical application design this means that the magnet has to be
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Package Information
large enough to ensure that the non-homogeneity of the magnetic field in this area (plus relevant positioning
tolerances) is negligible.
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Package Information
7.2
Package Outline
Figure 7-2 PG-TDSO-16 package dimension
Figure 7-3 Position of sensing element
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Package Information
7.3
Footprint
Figure 7-4 Footprint of PG TDSO-16
7.4
Packing
Figure 7-5 Tape and Reel
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Package Information
7.5
Marking
Position
1st Line
Marking
Gxxxx
Description
G: green, 4-digit date code: YYWW
e.g. “1801”: 1st week in 2018
2nd Line
3rd Line
xxxxxxxx
xxx
Interface type and version
Lot code
Figure 7-6 Marking of PG-TDSO-16
Final Datasheet
43
Rev. 1.0
2018-04-04
TLE5014
Revision History
8
Revision History
Revision Date
Changes
1.0
2018-03-27 initial version
Final Datasheet
44
Rev. 1.0
2018-04-04
Please read the Important Notice and Warnings at the end of this document
Trademarks of Infineon Technologies AG
µHVIC™, µIPM™, µPFC™, AU-ConvertIR™, AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, CoolDP™, CoolGaN™, COOLiR™, CoolMOS™, CoolSET™, CoolSiC™,
DAVE™, DI-POL™, DirectFET™, DrBlade™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, GaNpowIR™,
HEXFET™, HITFET™, HybridPACK™, iMOTION™, IRAM™, ISOFACE™, IsoPACK™, LEDrivIR™, LITIX™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OPTIGA™,
OptiMOS™, ORIGA™, PowIRaudio™, PowIRStage™, PrimePACK™, PrimeSTACK™, PROFET™, PRO-SIL™, RASIC™, REAL3™, SmartLEWIS™, SOLID FLASH™,
SPOC™, StrongIRFET™, SupIRBuck™, TEMPFET™, TRENCHSTOP™, TriCore™, UHVIC™, XHP™, XMC™.
Trademarks updated November 2015
Other Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
IMPORTANT NOTICE
The information given in this document shall in no For further information on technology, delivery terms
Edition 2018-04-04
Published by
Infineon Technologies AG
81726 Munich, Germany
event be regarded as a guarantee of conditions or and conditions and prices, please contact the nearest
characteristics ("Beschaffenheitsgarantie").
Infineon Technologies Office (www.infineon.com).
WARNINGS
With respect to any examples, hints or any typical
values stated herein and/or any information regarding
the application of the product, Infineon Technologies
hereby disclaims any and all warranties and liabilities
of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any
third party.
In addition, any information given in this document is
subject to customer's compliance with its obligations
stated in this document and any applicable legal
requirements, norms and standards concerning
customer's products and any use of the product of
Infineon Technologies in customer's applications.
The data contained in this document is exclusively
intended for technically trained staff. It is the
responsibility of customer's technical departments to
evaluate the suitability of the product for the intended
application and the completeness of the product
information given in this document with respect to
such application.
Due to technical requirements products may contain
dangerous substances. For information on the types
in question please contact your nearest Infineon
Technologies office.
© 2018 Infineon Technologies AG.
All Rights Reserved.
Do you have a question about any
aspect of this document?
Email: erratum@infineon.com
Except as otherwise explicitly approved by Infineon
Technologies in a written document signed by
authorized representatives of Infineon Technologies,
Infineon Technologies’ products may not be used in
any applications where a failure of the product or any
consequences of the use thereof can reasonably be
expected to result in personal injury.
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