SPD30P06P G [INFINEON]
Infineon’s highly innovative OptiMOS™ families include p-channel power MOSFETs. These products consistently meet the highest quality and performance demands in key specifications for power system design such as on-state resistance and figure of merit characteristics.;
| 型号： | SPD30P06P G |
| 厂家： | 
Infineon |
| 描述： | Infineon’s highly innovative OptiMOS™ families include p-channel power MOSFETs. These products consistently meet the highest quality and performance demands in key specifications for power system design such as on-state resistance and figure of merit characteristics. |
| 文件： | 总10页 (文件大小：500K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SPD30P06P G
SIPMOS Power-Transistor
Features
Product Summary
P-Channel
Drain source voltage
V
-60
0.075
-30
V
A
DS
Enhancement mode
Drain-source on-state resistance R
DS(on)
Avalanche rated
Continuous drain current
I
D
dv/dt rated
175°C operating temperature
° Pb-free lead plating; RoHS compliat
° Qualified according to AEC Q101
Pin 1 PIN 2/4 PIN 3
G
D
S
Type
Package
SPD30P06P G
PG-TO252-3
Maximum Ratings,at T = 25 °C, unless otherwise specified
j
Parameter
Symbol
Value
Unit
Continuous drain current
I
A
D
T = 25 °C
-30
C
T = 100 °C
-21.5
C
Pulsed drain current
I
-120
D puls
T = 25 °C
C
Avalanche energy, single pulse
E
E
250
mJ
AS
I = -30 A , V = -25 V, R = 25
D
DD
GS
Avalanche energy, periodic limited by T
12.5
6
jmax
AR
Reverse diode dv/dt
dv/dt
kV/µs
I = -30 A, V = -48 V, di/dt = 200 A/µs,
S
DS
T
= 175 °C
jmax
Gate source voltage
Power dissipation
V
P
±20
125
V
GS
W
tot
T = 25 °C
C
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
T , T
-55...+175
55/175/56
°C
j
stg
Rev 2.3
Page 1
2008-09-02
SPD30P06P G
Thermal Characteristics
Parameter
Symbol
Values
Unit
min.
typ.
max.
Characteristics
Thermal resistance, junction - case
Thermal resistance, junction - ambient, leaded
SMD version, device on PCB:
@ min. footprint
R
-
-
-
-
1.2
K/W
thJC
R
100
thJA
R
thJA
-
-
-
-
75
50
2
1)
@ 6 cm cooling area
Electrical Characteristics, at T = 25 °C, unless otherwise specified
j
Parameter
Symbol
Values
typ.
Unit
min.
-60
max.
Static Characteristics
Drain- source breakdown voltage
V
V
-
-
V
(BR)DSS
GS(th)
V
= 0 V, I = -250 µA
D
GS
Gate threshold voltage, V = V
-2.1
-3
-4
GS
DS
I = -1.7 mA
D
Zero gate voltage drain current
I
µA
DSS
V
V
= -60 V, V = 0 V, T = 25 °C
-
-
-0.1
-10
-1
DS
DS
GS
j
= -60 V, V = 0 V, T = 150 °C
-100
GS
j
Gate-source leakage current
= -20 V, V = 0 V
I
-
-10
-100 nA
GSS
V
GS
DS
Drain-source on-state resistance
R
-
0.069 0.075
DS(on)
V
= -10 V, I = -21.5 A
D
GS
1
2
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
Rev 2.3
Page 2
2008-09-02
SPD30P06P G
Electrical Characteristics, at T = 25 °C, unless otherwise specified
j
Parameter
Symbol
Values
Unit
min.
typ.
max.
Dynamic Characteristics
Transconductance
g
5.2
10.4
-
S
fs
V
2*I *R
, I = -21.5 A
DS(on)max D
DS
D
Input capacitance
= 0 V, V = -25 V, f = 1 MHz
C
C
C
-
-
-
-
1228 1535 pF
iss
oss
V
GS
DS
Output capacitance
= 0 V, V = -25 V, f = 1 MHz
387
142
13
383
V
GS
DS
Reverse transfer capacitance
= 0 V, V = -25 V, f = 1 MHz
177
rss
V
GS
DS
Turn-on delay time
= -30 V, V = -10 V, I = -21.5 A,
t
t
t
t
19.5 ns
d(on)
V
DD
GS
D
R = 1.6
G
Rise time
-
-
-
11
30
20
16.5
45
r
V
= -30 V, V = -10 V, I = -21.5 A,
GS D
DD
R = 1.6
G
Turn-off delay time
= -30 V, V = -10 V, I = -21.5 A,
d(off)
V
DD
GS
D
R = 1.6
G
Fall time
30
f
V
= -30 V, V = -10 V, I = -21.5 A,
GS D
DD
R = 1.6
G
Rev 2.3
Page 3
2008-09-02
SPD30P06P G
Electrical Characteristics, at T = 25 °C, unless otherwise specified
j
Parameter
Symbol
Values
Unit
min.
typ.
max.
Dynamic Characteristics
Gate to source charge
Q
Q
Q
-
-
-
-
3.7
13.8
32
5.6
20.7
48
nC
gs
V
= -48 V, I = -30 A
D
DD
Gate to drain charge
= -48 V, I = -30 A
gd
V
DD
D
Gate charge total
= -48 V, I = -30 A, V = 0 to -10 V
g
V
DD
D
GS
Gate plateau voltage
= -48 V , I = -30 A
V
-5.2
-
V
(plateau)
V
DD
D
Parameter
Symbol
Values
typ.
Unit
min.
max.
-30
Reverse Diode
Inverse diode continuous forward current
I
-
-
-
-
-
-
A
S
T = 25 °C
C
Inverse diode direct current,pulsed
I
-
-120
-1.7
97
SM
T = 25 °C
C
Inverse diode forward voltage
V
-1.3
64.6
153
V
SD
V
= 0 V, I = -30
F
GS
Reverse recovery time
V = -30 V, I =I , di /dt = 100 A/µs
t
ns
rr
R
F
S
F
Reverse recovery charge
V = -30 V, I =l , di /dt = 100 A/µs
Q
230 nC
rr
R
F S
F
Rev 2.3
Page 4
2008-09-02
SPD30P06P G
Power dissipation
Drain current
I = f (T )
P
= f (T )
C
tot
D
C
parameter: V
10 V
GS
SPD30P06P
SPD30P06P
-32
140
W
A
120
110
100
90
80
70
60
50
40
30
20
10
0
-24
-20
-16
-12
-8
P
I
-4
0
°C
°C
190
0
20 40 60 80 100 120 140 16
190
0
20 40 60 80 100 120 140 160
T
T
C
C
Safe operating area
I = f ( V
Transient thermal impedance
Z = f (t )
thJC
)
D
DS
p
parameter : D = 0 , T = 25 °C
parameter : D = t /T
C
p
SPD30P06P
SPD30P06P
-10 3
10 1
K/W
A
10 0
t
= 31.0µs
100 µs
p
-10 2
10 -1
I
Z
10 -2
D = 0.50
0.20
I
-10 1
10 -3
V
0.10
1 ms
0.05
R
0.02
single pulse
10 -4
10 ms
0.01
DC
-10 0
10 -5
-10 -1
-10 0
-10 1
-10 2
DS
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2
10 0
V
s
V
t
p
Rev 2.3
Page 5
2008-09-02
SPD30P06P G
Typ. output characteristic
I = f (V ); T =25°C
Typ. drain-source-on-resistance
= f (I )
R
D
DS
j
DS(on)
D
parameter: t = 80 µs
parameter: V
GS
p
SPD30P06P
-75 Ptot = 125.00W
A
SPD30P06P
0.26
c
d
e
f
g
h
i
V
[V]
GS
a
0.22
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
k
j
-4.0
-4.5
-5.0
-5.5
-6.0
-6.5
-7.0
-7.5
-8.0
-9.0
-10.0
-60
b
c
d
e
f
-55
-50
i
I
R
-45
h
g
h
i
-40
-35
-30
-25
-20
-15
-10
-5
g
e
j
j
f
k
k
d
b
V
[V] =
d
GS
c
a
c
e
f
g
h
i
j
k
-5.0 -5.5 -6.0 -6.5 -7.0 -7.5 -8.0 -9.0 -10.0
0
V
A
0
-2
-4
-6
-8
-10
-13
DS
0
-10
-20
-30
-40
-60
V
I
D
Typ. transfer characteristics I = f ( V
)
GS
Typ. forward transconductance
g = f(I ); T =25°C
D
V
2 x I x R
D DS(on)max
DS
fs
D
j
parameter: t = 80 µs
parameter: g
p
fs
13
S
-60
A
11
10
9
-40
8
I
g
7
6
5
4
3
2
1
0
-30
-20
-10
0
V
A
0
-1 -2 -3 -4 -5 -6 -7 -8
-10
GS
0
-1 -2 -3 -4 -5 -6 -7 -8
-10
V
I
D
Rev 2.3
Page 6
2008-09-02
SPD30P06P G
Drain-source on-state resistance
= f (T )
Gate threshold voltage
V = f (T )
GS(th)
R
DS(on)
j
j
parameter : I = -21.5 A, V = -10 V
parameter: V = V , I = -1.7 mA
GS DS D
D
GS
SPD30P06P
-5.0
0.24
V
98%
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
-4.0
-3.5
-3.0
-2.5
-2.0
-1.5
-1.0
-0.5
0.0
typ
2%
V
R
98%
typ
°C
°C
-60
-20
20
60
100
140
200
-60
-20
20
60
100
180
T
T
j
j
Typ. capacitances
C = f (V )
Forward characteristics of reverse diode
I = f (V )
DS
F
SD
parameter: V =0V, f=1 MHz
parameter: T , tp = 80 µs
GS
j
SPD30P06P
10 4
-10 3
A
pF
-10 2
C
I
C
iss
10 3
-10 1
C
C
Tj = 25 °C typ
oss
rss
Tj = 175 °C typ
Tj = 25 °C (98%)
Tj = 175 °C (98%)
10 2
-10 0
0.0
V
V
0
-5
-10
-15
-20
-25
-35
-0.4 -0.8 -1.2 -1.6 -2.0 -2.4
-3.0
V
V
DS
SD
Rev 2.3
Page 7
2008-09-02
SPD30P06P G
Avalanche energy
= f (T )
Typ. gate charge
= f (Q
E
V
)
Gate
AS
j
GS
para.: I = -30 A , V = -25 V, R = 25
parameter: I = -30 A pulsed
D
DD
GS
D
SPD30P06P
260
-16
mJ
V
220
200
180
160
140
120
100
80
-12
-10
E
V
V
V
DS max
0,2
0,8
DS max
-8
-6
-4
-2
0
60
40
20
0
25
45
65
85 105 125 145
185
0
10
20
30
40
55
°C
nC
T
j
Q
Gate
Drain-source breakdown voltage
V
= f (T )
(BR)DSS
j
SPD30P06P
-72
V
-68
-66
-64
-62
-60
-58
-56
-54
V
°C
-60
-20
20
60
100
140
200
T
j
Rev 2.3
Page 8
2008-09-02
SPD30P06P G
Package outline: PG-TO252-3
Rev 2.3
page 9
2008-09-02
SPD30P06P G
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2008 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions
or characteristics. With respect to any examples or hints given herein, any typical values stated
herein and/or any information regarding the application of the device, Infineon Technologies
hereby disclaims any and all warranties and liabilities of any kind, including without limitation,
warranties of non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact
).
the nearest Infineon Technologies Office (www.infineon.com
Warnings
Due to technical requirements, components may contain dangerous substances. For information
on the types in question, please contact the nearest Infineon Technologies Office. Infineon
Technologies components may be used in life-support devices or systems only with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be
expected to cause the failure of that life-support device or system or to affect the safety or
effectiveness of that device or system. Life support devices or systems are intended to be
implanted in the human body or to support and/or maintain and sustain and/or protect human life.
If they fail, it is reasonable to assume that the health of the user or other persons may be
endangered.
Rev 2.3
Page 10
2008-09-02
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