SPP11N65C3_07 [INFINEON]

New revolutionary high voltage technology Ultra low gate charge Periodic avalanche rated; 新的革命高电压技术,超低栅极电荷定期额定雪崩
SPP11N65C3_07
型号: SPP11N65C3_07
厂家: Infineon    Infineon
描述:

New revolutionary high voltage technology Ultra low gate charge Periodic avalanche rated
新的革命高电压技术,超低栅极电荷定期额定雪崩

栅极
文件: 总15页 (文件大小:561K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SPP11N65C3,SPA11N65C3  
SPI11N65C3  
Cool MOS™ Power Transistor  
Feature  
V
R
650  
0.38  
11  
V
A
D
S  
DS(on)  
New revolutionary high voltage technology  
Ultra low gate charge  
I
D
PG-TO262  
PG-TO220FP PG-TO220  
Periodic avalanche rated  
Extreme dv/dt rated  
High peak current capability  
Improved transconductance  
Type  
Package  
Ordering Code  
Q67040-S4557  
Marking  
SPP11N65C3  
SPA11N65C3  
PG-TO220  
11N65C3  
11N65C3  
11N65C3  
PG-TO220FP SP000216318  
PG-TO262 Q67040-S4561  
SPI11N65C3  
Maximum Ratings  
Parameter  
Symbol  
Value  
SPP_I  
Unit  
SPA  
Continuous drain current  
I
A
D
1)  
T = 25 °C  
11  
7
11  
C
1)  
T = 100 °C  
7
C
Pulsed drain current, t limited by T  
I
D puls  
33  
33  
A
p
jmax  
Avalanche energy, single pulse  
E
340  
340  
mJ  
AS  
I =2.5A, V =50V  
D
DD  
2)  
E
Avalanche energy, repetitive t limited by T  
0.6  
0.6  
AR  
AR  
jmax  
jmax  
I =4A, V =50V  
D
DD  
Avalanche current, repetitive t limited by T  
I
4
20  
4
A
V
AR  
AR  
Gate source voltage  
V
V
P
20  
30  
33  
GS  
GS  
Gate source voltage AC (f >1Hz)  
30  
Power dissipation, T = 25°C  
125  
W
C
tot  
Operating and storage temperature  
T , T  
j
-55...+150  
°C  
stg  
Rev. 2.9  
Page 1  
2007-08-30  
SPP11N65C3,SPA11N65C3  
SPI11N65C3  
Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
Drain Source voltage slope  
dv/dt  
50  
V/ns  
V
= 480 V, I = 11 A, T = 125 °C  
D j  
DS  
Thermal Characteristics  
Parameter  
Symbol  
Values  
Unit  
min.  
typ. max.  
R
-
-
-
-
-
-
-
-
1
K/W  
Thermal resistance, junction - case  
Thermal resistance, junction - case, FullPAK  
Thermal resistance, junction - ambient, leaded  
Thermal resistance, junction - ambient, FullPAK  
SMD version, device on PCB:  
thJC  
3.8  
62  
80  
R
thJC_FP  
R
thJA  
R
R
thJA_FP  
thJA  
@ min. footprint  
-
-
-
-
35  
-
62  
-
2
3)  
@ 6 cm cooling area  
260 °C  
Soldering temperature, wavesoldering  
1.6 mm (0.063 in.) from case for 10s  
T
sold  
Electrical Characteristics, at T =25°C unless otherwise specified  
j
Parameter  
Symbol  
Conditions  
Values  
Unit  
min.  
650  
-
typ. max.  
V
V
=0V, I =0.25mA  
-
-
-
V
Drain-source breakdown voltage  
Drain-Source avalanche  
breakdown voltage  
(BR)DSS GS  
D
V
=0V, I =4A  
730  
V
GS  
D
(BR)DS  
I =500µA, V =V  
2.1  
3
3.9  
Gate threshold voltage  
V
I
D
GS DS  
GS(th)  
V
=600V, V =0V,  
DS GS  
µA  
Zero gate voltage drain current  
DSS  
T =25°C  
-
-
-
0.1  
1
j
T =150°C  
-
-
100  
j
V
V
=20V, V =0V  
GS DS  
100 nA  
Gate-source leakage current  
I
GSS  
=10V, I =7A  
GS  
Drain-source on-state resistance  
R
D
DS(on)  
T =25°C  
-
-
-
0.34  
0.92  
0.86  
0.38  
j
T =150°C  
-
-
j
R
f=1MHz, open drain  
Gate input resistance  
G
Rev. 2.9  
Page 2  
2007-08-30  
SPP11N65C3,SPA11N65C3  
SPI11N65C3  
Electrical Characteristics  
Parameter  
Symbol  
Conditions  
Values  
typ. max.  
Unit  
S
min.  
Transconductance  
g
V
2*I *R  
,
-
8.3  
-
fs  
DS DS(on)max  
D
I =7A  
D
Input capacitance  
C
C
C
C
V
=0V, V =25V,  
GS DS  
-
-
-
-
1200  
390  
30  
-
-
-
-
pF  
iss  
f=1MHz  
Output capacitance  
oss  
rss  
Reverse transfer capacitance  
4)  
V
V
=0V,  
GS  
45  
Effective output capacitance,  
energy related  
o(er)  
=0V to 480V  
DS  
5)  
-
85  
-
Effective output capacitance,  
time related  
C
o(tr)  
Turn-on delay time  
Rise time  
t
V
=380V, V =0/10V,  
GS  
-
-
-
-
10  
5
-
-
ns  
d(on)  
DD  
I =11A,  
t
D
r
R =6.8Ω  
Turn-off delay time  
Fall time  
t
44  
5
70  
9
G
d(off)  
t
f
Gate Charge Characteristics  
Gate to source charge  
Q
V
=480V, I =11A  
-
-
-
5.5  
22  
45  
-
-
nC  
V
gs  
DD  
D
Gate to drain charge  
Q
gd  
V
=480V, I =11A,  
60  
Gate charge total  
Q
g
DD  
D
V
=0 to 10V  
GS  
V
=480V, I =11A  
-
5.5  
-
Gate plateau voltage  
V(plateau)  
DD  
D
1
Limited only by maximum temperature  
2
Repetitve avalanche causes additional power losses that can be calculated as PAV=EAR*f.  
3
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain  
connection. PCB is vertical without blown air.  
4
Co(er) is a fixed capacitance that gives the same stored energy as Coss while VDS is rising from 0 to 80% VDSS.  
5
Co(tr) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS.  
Rev. 2.9  
Page 3  
2007-08-30  
SPP11N65C3,SPA11N65C3  
SPI11N65C3  
Electrical Characteristics  
Parameter  
Symbol  
Conditions  
Values  
typ. max.  
Unit  
min.  
T =25°C  
-
-
11  
33  
1.2  
A
Inverse diode continuous  
forward current  
I
C
S
Inverse diode direct current,  
pulsed  
I
-
-
SM  
V
=0V, I =I  
F S  
-
-
-
-
-
1
400  
6
V
Inverse diode forward voltage  
Reverse recovery time  
V
SD  
GS  
t
V =480V, I =I ,  
600 ns  
rr  
R
F
S
di /dt=100A/µs  
F
Reverse recovery charge  
Peak reverse recovery current  
Q
-
-
-
µC  
A
rr  
I
41  
rrm  
T =25°C  
1200  
A/µs  
Peak rate of fall of reverse  
recovery current  
di /dt  
rr  
j
Typical Transient Thermal Characteristics  
Symbol  
Value  
Unit  
Symbol  
Value  
Unit  
SPP_I  
0.015  
0.03  
SPA  
0.15  
SPP_I  
SPA  
R
R
R
R
K/W  
C
C
C
C
C
C
0.0001878 0.0001878 Ws/K  
0.0007106 0.0007106  
th1  
th2  
th3  
th1  
th2  
th3  
0.03  
0.056  
0.197  
0.216  
0.083  
0.056  
0.194  
0.413  
2.522  
0.000988  
0.002791  
0.007285  
0.063  
0.000988  
0.002791  
0.007401  
0.412  
th4  
th4  
th5  
Rth5  
R
th6  
th6  
External Heatsink  
Tj  
Rth1  
Rth,n  
Tcase  
Ptot (t)  
Cth1  
Cth2  
Cth,n  
Tamb  
Rev. 2.9  
Page 4  
2007-08-30  
SPP11N65C3,SPA11N65C3  
SPI11N65C3  
1 Power dissipation  
= f (T )  
2 Power dissipation FullPAK  
P = f (T )  
tot  
P
tot  
C
C
SPP11N65C3  
35  
140  
W
W
120  
110  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
25  
20  
15  
10  
5
0
°C  
0
20  
40  
60  
80 100 120  
160  
0
20  
40  
60  
80 100 120 °C 160  
T
T
C
C
3 Safe operating area  
I = f ( V  
4 Safe operating area FullPAK  
I = f (V )  
)
D
DS  
D
DS  
parameter : D = 0 , T =25°C  
parameter: D = 0, T = 25°C  
C
C
2
2
10  
10  
A
A
1
1
10  
10  
0
0
10  
10  
tp = 0.0008 ms  
tp = 0.01 ms  
tp = 0.1 ms  
tp = 1 ms  
tp = 10 ms  
DC  
tp = 0.0008 ms  
tp = 0.01 ms  
tp = 0.1 ms  
tp = 1 ms  
DC  
-1  
-1  
10  
10  
10  
-2  
10 0  
-2  
10 0  
10  
10 1  
10 2  
V
V
10 3  
DS  
10 1  
10 2  
V
V
10 3  
DS  
Rev. 2.9  
Page 5  
2007-08-30  
SPP11N65C3,SPA11N65C3  
SPI11N65C3  
5 Transient thermal impedance FullPAK  
= f (t )  
6 Typ. output characteristic  
I = f (V ); T =25°C  
Z
thJC  
D
p
DS  
j
parameter: D = t /t  
parameter: t = 10 µs, V  
p
p
GS  
1
10  
40  
K/W  
20V  
10V  
A
8V  
0
10  
32  
7V  
28  
24  
20  
16  
12  
8
6,5V  
-1  
10  
D = 0.5  
D = 0.2  
D = 0.1  
D = 0.05  
D = 0.02  
D = 0.01  
single pulse  
6V  
-2  
10  
5,5V  
-3  
10  
5V  
4
4,5V  
-4  
10  
0
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1  
s
10 1  
0
3
6
9
12  
15 18 21  
V
27  
t
V
DS  
p
7 Typ. output characteristic  
8 Typ. drain-source on resistance  
R =f(I )  
DS(on)  
I = f (V ); T =150°C  
D
D
DS  
j
parameter: t = 10 µs, V  
parameter: T =150°C, V  
p
GS  
j
GS  
2
22  
20V  
8V  
7V  
A
4.5V  
6V  
4V  
18  
5V  
5.5V  
7.5V  
6V  
1.6  
1.4  
1.2  
1
16  
14  
12  
10  
8
5.5V  
5V  
6
0.8  
0.6  
0.4  
4.5V  
4V  
4
6.5V  
8V  
20V  
2
0
0
5
10  
15  
V
25  
DS  
0
2
4
6
8
10 12 14 16  
A
20  
I
V
D
Rev. 2.9  
Page 6  
2007-08-30  
SPP11N65C3,SPA11N65C3  
SPI11N65C3  
9 Drain-source on-state resistance  
= f (T )  
10 Typ. transfer characteristics  
R
I = f ( V ); V 2 x I x R  
D GS DS D DS(on)max  
DS(on)  
j
parameter : I = 7 A, V = 10 V  
parameter: t = 10 µs  
D
p
GS  
SPP11N65C3  
40  
2.1  
A
25°C  
1.8  
1.6  
1.4  
1.2  
1
32  
28  
24  
20  
16  
12  
8
150°C  
0.8  
0.6  
0.4  
0.2  
0
98%  
typ  
4
0
°C  
-60  
-20  
20  
60  
100  
180  
0
2
4
6
8
10  
12  
V
15  
V
T
j
GS  
11 Typ. gate charge  
= f (Q  
12 Forward characteristics of body diode  
I = f (V )  
V
)
Gate  
F
SD  
GS  
parameter: I = 11 A pulsed  
parameter: T , tp = 10 µs  
D
j
SPP11N65C3  
2 SPP11N65C3  
10  
16  
V
A
12  
1
10  
0,2 VDS max  
10  
0,8 VDS max  
8
6
4
2
0
0
10  
Tj = 25 °C typ  
Tj = 150 °C typ  
Tj = 25 °C (98%)  
Tj = 150 °C (98%)  
-1  
10  
V
0
10  
20  
30  
40  
50  
70  
Gate  
0
0.4  
0.8  
1.2  
1.6  
2
2.4  
3
nC  
Q
V
SD  
Rev. 2.9  
Page 7  
2007-08-30  
SPP11N65C3,SPA11N65C3  
SPI11N65C3  
13 Typ. switching time  
t = f (I ), inductive load, T =125°C  
14 Typ. switching time  
t = f (R ), inductive load, T =125°C  
D
j
G
j
par.: V =380V, V =0/+13V, R =6.8Ω  
par.: V =380V, V =0/+13V, I =11 A  
D
DS  
GS  
G
DS  
GS  
350  
70  
ns  
ns  
60  
55  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
td(off)  
250  
200  
150  
100  
50  
td(off)  
td(on)  
tr  
tf  
tf  
td(on)  
tr  
2
0
0
0
4
6
8
A
12  
0
10  
20  
30  
40  
50  
70  
I
R
D
G
15 Typ. drain current slope  
di/dt = f(R ), inductive load, T = 125°C  
16 Typ. drain source voltage slope  
dv/dt = f(R ), inductive load, T = 125°C  
G
j
G
j
par.: V =380V, V =0/+13V, I =11A  
par.: V =380V, V =0/+13V, I =11A  
D
D
DS  
GS  
DS  
GS  
140  
3000  
V/ns  
dv/dt(off)  
A/µs  
120  
110  
100  
90  
2000  
1500  
1000  
500  
0
80  
70  
60  
50  
di/dt(off)  
40  
dv/dt(on)  
30  
di/dt(on)  
20  
10  
0
20  
40  
60  
80  
120  
0
10  
20  
30  
40  
50  
70  
R
R
G
G
Rev. 2.9  
Page 8  
2007-08-30  
SPP11N65C3,SPA11N65C3  
SPI11N65C3  
17 Typ. switching losses  
E = f (I ), inductive load, T =125°C  
18 Typ. switching losses  
E = f(R ), inductive load, T =125°C  
D
j
G
j
par.: V =380V, V =0/+13V, R =6.8Ω  
par.: V =380V, V =0/+13V,I =11A  
D
DS GS  
DS  
GS  
G
0.04  
0.24  
*) Eon includes SPD06S60 diode  
commutation losses  
*) Eon includes SPD06S60 diode  
commutation losses  
mWs  
mWs  
0.03  
0.025  
0.02  
0.015  
0.01  
0.005  
0
0.16  
0.12  
0.08  
0.04  
0
Eoff  
Eon*  
Eon*  
Eoff  
0
2
4
6
8
A
12  
0
10  
20  
30  
40  
50  
70  
I
R
D
G
19 Avalanche SOA  
= f (t )  
20 Avalanche energy  
E = f (T )  
AS  
I
AR  
AR  
j
par.: T 150 °C  
par.: I = 2.5 A, V = 50 V  
D
j
DD  
350  
4
A
mJ  
3
2.5  
2
T
=25°C  
j(Start)  
250  
200  
150  
100  
50  
T
=125°C  
j(Start)  
1.5  
1
0.5  
0
0
20  
10 -3 10 -2 10 -1 10 0 10 1 10 2  
µs 10 4  
40  
60  
80  
100  
120  
°C  
160  
t
T
AR  
j
Rev. 2.9  
Page 9  
2007-08-30  
SPP11N65C3,SPA11N65C3  
SPI11N65C3  
21 Drain-source breakdown voltage  
22 Avalanche power losses  
P = f (f )  
AR  
V
= f (T )  
(BR)DSS  
j
parameter: E =0.6mJ  
AR  
785  
V
300  
W
745  
725  
705  
685  
665  
645  
625  
605  
200  
150  
100  
50  
0
585  
-60  
10 4  
10 5  
Hz  
10 6  
-20  
20  
60  
100  
180  
°C  
T
f
j
23 Typ. capacitances  
24 Typ. C  
stored energy  
oss  
C = f (V )  
E
=f(V )  
oss  
DS  
DS  
parameter: V =0V, f=1 MHz  
GS  
4
10  
7.5  
µJ  
pF  
C
iss  
6
5.5  
5
3
10  
4.5  
4
2
10  
C
oss  
3.5  
3
2.5  
2
1
10  
10  
C
rss  
1.5  
1
0.5  
0
0
0
100  
200  
300  
400  
V
600  
0
100  
200  
300  
400  
V
600  
V
V
DS  
DS  
Rev. 2.9  
Page 10  
2007-08-30  
SPP11N65C3,SPA11N65C3  
SPI11N65C3  
Definition of diodes switching characteristics  
Rev. 2.9  
Page 11  
2007-08-30  
SPP11N65C3, SPA11N65C3  
SPI11N65C3  
PG-TO220-3-1, PG-TO220-3-21  
Rev. 2.9  
Page 12  
2007-08-30  
SPP11N65C3, SPA11N65C3  
SPI11N65C3  
PG-TO220-3-31/3-111 Fully isolated package ( 2500 VAC; 1 minute )  
Rev. 2.9  
Page 13  
2007-08-30  
SPP11N65C3, SPA11N65C3  
SPI11N65C3  
PG-TO262-3-1, PG-TO262-3-21 (I²-PAK)  
Rev. 2.9  
Page 14  
2007-08-30  
SPP11N65C3,SPA11N65C3  
SPI11N65C3  
Published by  
Infineon Technologies AG,  
Bereichs Kommunikation  
St.-Martin-Strasse 53,  
D-81541 München  
© Infineon Technologies AG 1999  
All Rights Reserved.  
Attention please!  
The information herein is given to describe certain components and shall not be considered as warranted  
characteristics.  
Terms of delivery and rights to technical change reserved.  
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,  
regarding circuits, descriptions and charts stated herein.  
Infineon Technologies is an approved CECC manufacturer.  
Information  
For further information on technology, delivery terms and conditions and prices please contact your nearest  
Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).  
Warnings  
Due to technical requirements components may contain dangerous substances.  
For information on the types in question please contact your nearest Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or systems with the express  
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to  
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device  
or system Life support devices or systems are intended to be implanted in the human body, or to support  
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health  
of the user or other persons may be endangered.  
Rev. 2.9  
Page 15  
2007-08-30  

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IC-SM-VIDEO AMP

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ZETEX

ZXFV201N14TA

QUAD VIDEO AMPLIFIER

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ZETEX

ZXFV201N14TC

QUAD VIDEO AMPLIFIER

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ZETEX

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ETC

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ZXFV302N16

IC-SM-4:1 MUX SWITCH

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ETC

ZXFV4089

VIDEO AMPLIFIER WITH DC RESTORATION

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ZETEX

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