ST1000C24K3LPBF [INFINEON]

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ST1000C24K3LPBF
型号: ST1000C24K3LPBF
厂家: Infineon    Infineon
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Bulletin I25202 rev. A 01/00  
ST1000C..K SERIES  
Hockey Puk Version  
PHASE CONTROL THYRISTORS  
Features  
1473A  
Center amplifying gate  
Metal case with ceramic insulator  
International standard case A-24 (K-PUK)  
High profile hockey-puk  
Typical Applications  
DC motor controls  
Controlled DC power supplies  
AC controllers  
case style A-24 (K-PUK)  
Major Ratings and Characteristics  
Parameters  
IT(AV)  
ST1000C..K  
1473  
Units  
A
@ T  
55  
°C  
hs  
hs  
IT(RMS)  
2913  
A
@ T  
25  
°C  
ITSM  
@50Hz  
@60Hz  
@50Hz  
@60Hz  
20.0  
KA  
KA  
21.2  
2
2
I t  
2000  
KA s  
2
1865  
KA s  
2
2
I t  
20000  
1200 to 2600  
300  
KA s  
VDRM/VRRM range  
V
t
typical  
range  
µs  
°C  
q
TJ  
-40to125  
1
www.irf.com  
ST1000C..K Series  
Bulletin I25202 rev. A 01/00  
ELECTRICALSPECIFICATIONS  
Voltage Ratings  
Voltage  
Code  
VRRM , maximum repetitive  
VRSM , maximum non-  
IRRM max.  
Type number  
peak reverse voltage  
V
repetitive peak rev. voltage  
V
@ TJ = 125°C  
mA  
12  
16  
20  
22  
24  
26  
1200  
1600  
2000  
2200  
2400  
2600  
1300  
1700  
2100  
2300  
2500  
2700  
ST1000C..K  
100  
On-state Conduction  
Parameter  
ST1000C..K Units Conditions  
IT(AV)  
Maximum average on-state current  
@ Heatsink temperature  
IT(RMS) Maximum RMS on-state current  
1473 (630)  
55 (85)  
6540  
A
°C  
A
180° conduction, half sine wave  
Double side (single side) cooled  
DC @ 25°C heatsink temp. double side cooled  
ITSM  
Maximum peak, one-cycle,  
non-repetitive surge current  
20.0  
KA t = 10ms No voltage  
t = 8.3ms reapplied  
21.2  
17.0  
t = 10ms 100% VRRM  
t = 8.3ms reapplied  
18.1  
Sinusoidal half wave,  
I2t  
Maximum I2t for fusing  
2000  
1865  
1445  
1360  
20000  
KA2s t = 10ms No voltage Initial TJ = TJ max.  
t = 8.3ms reapplied  
t = 10ms 100% VRRM  
t = 8.3ms reapplied  
I2t  
Maximum I2t for fusing  
KA2s t = 0.1 to 10ms, no voltage reapplied  
VT(TO)1 Low level value of threshold voltage  
VT(TO)2 High level value of threshold voltage  
0.950  
1.024  
0.283  
0.265  
1.80  
V
(16.7% x π x IT(AV) < I < π x IT(AV)), TJ = TJ max.  
(I > π x IT(AV)), TJ = TJ max.  
r
r
Low level value of on-state slope resistance  
High level value of on-state slope resistance  
Maximum on-state voltage drop  
Maximum holding current  
m(16.7% x π x IT(AV) < I < π x IT(AV)), TJ = TJ max.  
(I > π x IT(AV)), TJ = TJ max.  
t1  
t2  
VTM  
IH  
V
Ipk = 3000A, TJ = 125°C, tp = 10ms sine pulse  
600  
mA TJ = 25°C, anode supply 12V resistive load  
IL  
Typical latching current  
1000  
2
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ST1000C..K Series  
Bulletin I25202 rev. A 01/00  
Switching  
Parameter  
ST1000C..K Units Conditions  
di/dt  
Maximum non repetitive rate of rise  
of turned-on current  
1000  
A/µs Gate drive 20V, 20, t < 1µs  
r
TJ = TJ max., anode voltage < 80% VDRM  
t
Typical delay time  
1.9  
µs  
Gate current 1A, di /dt = 1A/µs  
g
d
V
= 0.67% VDRM , TJ = 25°C  
d
t
Typical turn-off time  
300  
A/µs ITM = 550A, TJ = TJ max, di/dt = 40A/µs, VR = 50V  
q
dv/dt = 20V/µs, Gate 0V 100, t < 500µs  
p
Blocking  
Parameter  
ST1000C..K Units Conditions  
dv/dt  
Maximum critical rate of rise of off-state  
voltage  
500  
V/µs TJ = TJ max., linear to 80% rated VDRM  
IRRM  
IDRM  
Maximum peak reverse and off-state  
leakage current  
100  
µs  
TJ = TJ max., rated VDRM/VRRM applied  
Triggering  
Parameter  
Maximum peak gate power  
PG(AV) Maximum peak average gate power  
IGM Maximum peak positive gate current  
ST1000C..K Units Conditions  
PGM  
16  
3
W
W
A
T = T max., t < 5ms  
p
J J  
TJ = TJ max., f = 50Hz, d% = 50  
3.0  
20  
T = T max., t < 5ms  
p
J
J
+ VGM Maximum peak positive gate voltage  
- VGM Maximum peak negative gate voltage  
V
5.0  
V
IGT  
DC gate current required to trigger  
TYP.  
200  
100  
50  
MAX.  
-
TJ  
=
=
-40°C  
25°C  
200  
mA TJ  
Max. required gate trigger / current /  
-
-
TJ = 125°C  
voltage are the lowest value which  
will trigger all units 12V anode-to-  
cathode applied  
VGT  
DC gate voltage required to trigger  
1.4  
TJ  
TJ  
=
=
-40°C  
25°C  
1.1  
3.0  
-
V
0.9  
TJ = 125°C  
Max. gate current / voltage not to  
trigger is the max. value which will  
not trigger any units with rated VDRM  
anode-to-cathode applied  
IGD  
DC gate current not to trigger  
DC gate voltage not to trigger  
10  
0.25  
mA TJ = TJ max.  
V
VGD  
3
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ST1000C..K Series  
Bulletin I25202 rev. A 01/00  
Thermal and Mechanical Specifications  
Parameter  
ST1000C..K Units Conditions  
TJ  
T
Max. junctionoperatingtemperaturerange  
Max. storage temperature range  
- 40 to 125  
-40to150  
°C  
stg  
RthJ-hs Max. thermal resistance, junction to  
0.042  
0.021  
0.006  
0.003  
K/W DC operation single side cooled  
DC operation double side cooled  
heatsink  
RthC-hs Max. thermal resistance, case to  
heatsink  
K/W DC operation single side cooled  
DC operation double side cooled  
F
Mounting force, 10%  
24500  
(2500)  
N
(Kg)  
wt  
Approximate weight  
Case style  
425  
g
A-24(K-PUK)  
See outline table  
RthJC Conduction  
(The following table shows the increment of thermal resistance RthJC when devices operate at different conduction angles than DC)  
Sinusoidal conduction  
Rectangular conduction  
Conduction angle  
Units Conditions  
Single Side Double Side Single Side Double Side  
180°  
120°  
90°  
0.003  
0.004  
0.005  
0.003  
0.004  
0.005  
0.002  
0.004  
0.005  
0.002  
0.004  
0.005  
K/W  
TJ = TJ max.  
60°  
30°  
0.007  
0.012  
0.007  
0.012  
0.007  
0.012  
0.007  
0.012  
Ordering Information Table  
DeviceCode  
ST 100  
0
C
26  
K
1
1
2
3
4
5
8
6
7
1
2
3
4
5
6
7
-
-
-
-
-
-
-
Thyristor  
Essential part number  
0 = Converter grade  
C = Ceramic Puk  
Voltage code: Code x 100 = VRRM (See Voltage Ratings Table)  
K = Puk Case A-24 (K-PUK)  
0 = Eyelet terminals (Gate and Auxiliary Cathode Unsoldered Leads)  
1 = Fast-on terminals (Gate and Auxiliary Cathode Unsoldered Leads)  
2 = Eyelet terminals (Gate and Auxiliary Cathode Soldered Leads)  
3 = Fast-on terminals (Gate and Auxiliary Cathode Soldered Leads)  
Critical dv/dt: None = 500V/µsec (Standard selection)  
8
-
L
= 1000V/µsec (Special selection)  
4
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ST1000C..K Series  
Bulletin I25202 rev. A 01/00  
Outline Table  
1 (0.04) MIN.  
TWO PLACES  
47.5 (1.87) DIA. MAX.  
TWO PLACES  
PIN RECEPTACLE  
AMP. 60598-1  
67 (2.6) DIA. MAX.  
20° 5°  
4.75 (0.2) NOM.  
44 (1.73)  
Case Style A-24 (K-PUK)  
All dimensions in millimeters (inches)  
2 HOLES DIA. 3.5 (0.14) x  
2.1 (0.1) DEEP  
Quote between upper and lower  
pole pieces has to be considered  
after application of Mounting Force  
(see Thermal and Mechanical  
Specification)  
CREPAGE DESTANCE 28.88 (1.137) MIN.  
STRIKE DISTANCE 17.99 (0.708) MIN.  
130  
120  
110  
100  
90  
130  
120  
110  
100  
90  
ST1000C..K Series  
(Single Side Cooled)  
ST1000C..K Series  
(Single Side Cooled)  
R
(DC) = 0.042 K/W  
R
(DC) = 0.042 K/W  
thJ-hs  
thJ-hs  
Conduction Period  
Conduction Angle  
30°  
30°  
60°  
60°  
90°  
90°  
120°  
120°  
80  
80  
180°  
180°  
D C  
1000  
70  
70  
0
100 200 300 400 500 600 700  
0
200  
400  
600 800  
AverageOn-stateCurrent(A)  
Fig. 2 - Current Ratings Characteristics  
AverageOn-stateCurrent(A)  
Fig. 1 - Current Ratings Characteristics  
5
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ST1000C..KSeries  
Bulletin I25202 rev. A 01/00  
130  
130  
120  
110  
100  
90  
ST1000C..K Series  
(Double Side Cooled)  
ST1000C..K Series  
(Double Side Cooled)  
120  
110  
100  
90  
R
(DC) = 0.021 K/W  
R
(DC) = 0.021 K/W  
thJ-hs  
thJ-hs  
Conduction Period  
Conduction Angle  
80  
30˚  
80  
30˚  
60˚  
60˚  
90˚  
70  
70  
90˚  
120˚  
120˚  
180˚  
60  
60  
180˚  
50  
DC  
50  
40  
40  
0
400 800 1200 1600 2000 2400  
0
400  
800  
1200  
1600  
AverageOn-stateCurrent(A)  
Average On-state Current (A)  
Fig. 3 - Current Ratings Characteristics  
Fig. 4 - Current Ratings Characteristics  
3000  
2500  
2000  
1500  
1000  
500  
4000  
3500  
3000  
2500  
2000  
1500  
1000  
500  
DC  
180˚  
120˚  
90˚  
60˚  
30˚  
180˚  
120˚  
90˚  
60˚  
RMS Limit  
30˚  
RMS Limit  
Conduction Period  
Conduction Angle  
ST1000C..K Series  
ST1000C..K Series  
T = 125˚C  
J
T = 125˚C  
J
0
0
0
500 1000 1500 2000 2500  
0
400  
800  
1200  
1600  
Average On-state Current (A)  
Average On-state Current (A)  
Fig. 6- On-state Power Loss Characteristics  
Fig. 5- On-state Power Loss Characteristics  
18000  
16000  
14000  
12000  
10000  
8000  
22000  
20000  
18000  
16000  
14000  
12000  
10000  
8000  
Maximum Non Repetitive Surge Current  
Versus Pulse Train Duration. Control  
Of Conduction May Not Be Maintained.  
At Any Rated Load Condition And With  
Rated V  
Applied Following Surge.  
RRM  
Initial T = 125˚C  
J
Initial T = 125˚C  
J
@ 60 Hz 0.0083 s  
@ 50 Hz 0.0100 s  
No Voltage Reapplied  
Rated V  
Reapplied  
RRM  
ST1000C..K Series  
ST1000C..K Series  
6000  
6000  
0.01  
0.1  
Pulse Train Duration (s)  
1
1
10  
100  
Number Of Equal Amplitude Half Cycle Current Pulses (N)  
Fig. 7 - Maximum Non-Repetitive Surge Current  
Single and Double Side Cooled  
Fig. 8 - Maximum Non-Repetitive Surge Current  
Single and Double Side Cooled  
6
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ST1000C..K Series  
Bulletin I25202 rev. A 01/00  
10000  
1000  
100  
T = 25˚C  
J
T = 125˚C  
J
ST1000C..K Series  
0.5  
1
1.5  
2
2.5  
3
3.5  
4
Instantaneous On-state Voltage (V)  
Fig. 9 - On-state Voltage Drop Characteristics  
0.1  
0.01  
Steady State Value  
= 0.42 K/W  
R
thJ-hs  
(Single Side Cooled)  
= 0.21 K/W  
R
thJ-hs  
(Double Side Cooled)  
(DC Operation)  
ST1000C..K Series  
0.001  
0.001  
0.01  
0.1  
Square Wave Pulse Duration (s)  
Fig. 10 - Thermal Impedance ZthJ-hs Characteristics  
1
10  
100  
100  
10  
1
Rectangular gate pulse  
(1) PGM = 16W, tp = 4ms  
a) Recommended load line for  
rated di/dt : 20V, 10ohms; tr<=1 µs  
b) Recommended load line for  
<=30% rated di/dt : 10V, 10ohms  
tr<=1 µs  
(2) PGM = 30W, tp = 2ms  
(3) PGM = 60W, tp = 1ms  
(a)  
(b)  
(2) (3)  
(1)  
VGD  
IGD  
Frequency Limited by PG(AV)  
Device: ST100C..K Series  
0.1  
0.001  
0.01  
0.1  
1
10  
100  
Instantaneous Gate Current (A)  
Fig. 11 - Gate Characteristics  
7
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