TLE4274GV10 [INFINEON]
Low-Drop Voltage Regulator; 低压差稳压器型号: | TLE4274GV10 |
厂家: | Infineon |
描述: | Low-Drop Voltage Regulator |
文件: | 总13页 (文件大小:83K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Low-Drop Voltage Regulator
TLE 4274
Features
• Output voltage tolerance ≤ ± 4 %
• Low-drop voltage
• Very low current consumption
• Short-circuit proof
• Reverse polarity proof
• Suitable for use in automotive electronics
P-TO220-3-1
P-TO252-3-1
P-TO263-3-1
Type
Ordering Code Package
TLE 4274 V10
TLE 4274 V85
TLE 4274 V50
Q67000-A9258 P-TO220-3-1
Q67000-A9257 P-TO220-3-1
Q67000-A9256 P-TO220-3-1
TLE 4274 D V50 Q67006-A9331 P-TO252-3-1
TLE 4274 G V10 Q67006-A9261 P-TO263-3-1
TLE 4274 G V50 Q67006-A9259 P-TO263-3-1
TLE 4274 G V85 Q67006-A9260 P-TO263-3-1
SMD = Surface Mounted Device
Functional Description
The TLE 4274 is a low-drop voltage regulator in a
TO220 package. The IC regulates an input voltage up
to 40 V to VQrated = 5.0 V (V50), 8.5 V (V85) and 10 V
(V10). The maximum output current is 400 mA. The IC
is short-circuit proof and incorporates temperature
protection that disables the IC at over temperature.
Dimensioning Information on External Components
The input capacitor CI is necessary for compensating line influences. Using a resistor of
approx. 1 Ω in series with CI, the oscillating of input inductivity and input capacitance can
be damped. The output capacitor CQ is necessary for the stability of the regulation circuit.
Stability is guaranteed at values CQ ≥ 22 µF and an ESR of ≤ 3 Ω within the operating
temperature range.
Semiconductor Group
1
1998-11-01
TLE 4274
Circuit Description
The control amplifier compares a reference voltage to a voltage that is proportional to the
output voltage and drives the base of the series transistor via a buffer. Saturation control
as a function of the load current prevents any oversaturation of the power element. The
IC also incorporates a number of internal circuits for protection against:
• Overload
• Overtemperature
• Reverse polarity
Pin Configuration (top view)
P-TO220-3-1
P-TO252-3-1
P-TO263-3-1
GND
Ι
Q
AEP02512
Ι
GND Q
AEP02281
Ι
GND Q
AEP01957
Figure 1
Pin Definitions and Functions
Pin No. Symbol Function
1
I
Input; block to ground directly at the IC with a ceramic
capacitor.
2
3
GND
Q
Ground
Output; block to ground with a ≥ 22 µF capacitor.
Semiconductor Group
2
1998-11-01
TLE 4274
Saturation
Control and
Protection
Circuit
Temperature
Sensor
1
3
Ι
Q
Control
Amplifier
Buffer
Bandgap
Reference
2
GND
AEB01959
Figure 2
Block Diagram
Semiconductor Group
3
1998-11-01
TLE 4274
Absolute Maximum Ratings
Tj = – 40 to 150 °C
Parameter
Symbol
Limit Values
Unit Test Condition
min.
max.
Voltage Regulator
Input
Voltage
VI
II
– 42
–
45
–
–
V
Current
Internally limited
–
Output
Voltage
Current
VQ
IQ
– 1.0
–
40
–
V
–
–
Internally limited
Ground
Current
IGND
–
100
mA
–
Temperature
Junction temperature
Storage temperature
Tj
–
150
150
°C
°C
–
–
Tstg
– 50
Note: Maximum ratings are absolute ratings; exceeding any one of these values may
cause irreversible damage to the integrated circuit.
Operating Range
Parameter
Symbol
Limit Values
Unit Remarks
min.
5.5
9.0/10.5 40/40
max.
Input voltage
VI
Tj
40
V50
V85/V10
V
Junction temperature
– 40
150
°C
–
Thermal Resistance
Junction ambient
Junction ambient
Junction case
Rthja
Rthja
Rthjc
–
–
–
65
70
4
K/W TO220
K/W TO2521), TO263
K/W –
1)
Soldered in, min. footprint
Semiconductor Group
4
1998-11-01
TLE 4274
Characteristics
VI = 13.5 V; – 40 °C < Tj < 150 °C (unless otherwise specified)
Parameter
Symbol
Limit Values
min. typ. max.
Unit Measuring Conditions
Output voltage
V50-Version
VQ
VQ
VQ
IQ
4.8
8.16
9.6
400
–
5
5.2
8.84
10.4
–
5 mA < IQ < 400 mA
6 V < VI < 40 V
V
Output voltage
V85-Version
8.5
10
5 mA < IQ < 400 mA
9.5 V < VI < 40 V
V
Output voltage
V10-Version
5 mA < IQ < 400 mA
11 V < VI < 40 V
V
Output current
limitation1)
600
100
mA
µA
–
Current
Iq
220
IQ = 1 mA
consumption;
Iq = II – IQ
Current
consumption;
Iq = II – IQ
Drop voltage1)
Load regulation
Line regulation
Iq
–
8
15
mA
IQ = 250 mA
IQ = 400 mA
Iq
–
–
20
30
mA
mV
Vdr
250
500
IQ = 250 mA
Vdr = VI – VQ
–
–
–
–
20
10
60
0.5
50
25
–
mV
mV
dB
IQ = 5 mA to
400 mA
∆VQ
∆Vl = 12 V to 32 V
IQ = 5 mA
∆VQ
Power supply
ripple rejection
fr = 100 Hz;
Vr = 0.5 VSS
PSRR
Temperature
output voltage
drift
–
mV/K –
dV
--------Q--
dT
1)
Measured when the output voltage VQ has dropped 100 mV from the nominal value obtained at VI = 13.5 V.
Semiconductor Group
5
1998-11-01
TLE 4274
Ι Ι
Ι Q
Output
1
3
Input
C
C
Q
22 µF
Ι
µ
100
F
100 nF
TLE 4274
R
V
V
Q
L
Ι
2
AES01960
Figure 3
Measuring Circuit
3
1
Input
Output
TLE 4274
C
C
Q
Ι
2
AES01961
Figure 4
Application Circuit
Semiconductor Group
6
1998-11-01
TLE 4274
Typical Performance Characteristics (V50, V85 and V10):
Drop Voltage Vdr versus
Output Current IQ
Output Current IQ versus
Input Voltage VI
AED01963
AED01962
800
600
mA
mV
V
dr
Ι
Q
600
T = 125 C
j
400
300
200
100
0
T
V
= 25 C
= 0 V
j
Q
400
200
0
T = 25 C
j
=
V
V
QNOM-0.1 V
dr
0
10
20
30
40
50
V
0
100
200
300
400
mA
V
Ι
Ι
Q
Current Consumption Iq versus
Output Current IQ (high load)
Current Consumption Iq versus
Output Current IQ (low load)
AED02268
AED02267
0.6
60
mA
mA
T j = 25 C
Ι q
T j = 25 C
Ι q
V Ι = 13.5 V
V Ι = 13.5 V
0.4
0.3
0.2
0.1
0
40
30
20
10
0
0
10
20
30
40
60
mA
0
100 200 300 400
600
mA
Ι Q
Ι Q
Semiconductor Group
7
1998-11-01
TLE 4274
Typical Performance Characteristics (V50):
Output Voltage VQ versus
Junction Temperature Tj
Current Consumption Iq versus
Input Voltage VI
AED01966
AED02269
5.20
30
V
V
Q
mA
5.10
5.00
4.90
4.80
4.70
4.60
Ι q
V = 13.5 V
Ι
20
T j = 25 C
RL = 20
Ω
10
0
-40
0
40
80
120
160
C
0
10
20
30
50
V
T
VΙ
j
Output Voltage VQ versus
Input Voltage VI
Input Current II versus
Input Voltage VI
AED01977
AED01968
3.5
6
mA
V
Ι
V
V
Ι
3.0
Q
Q
5
4
2.5
2.0
T
= 25 C
j
V =V
Ι
Q
R
= 10 kΩ
L
1.5
1.0
0.5
0
3
2
T
= 25
C
j
R
= 20 Ω
L
1
-2
0
-50
-25
0
25
50
V
0
2
4
6
8
10
V
V
V
Ι
Ι
Semiconductor Group
8
1998-11-01
TLE 4274
Typical Performance Characteristics for V85:
Output Voltage VQ versus
Junction Temperature Tj
Current Consumption Iq versus
Input Voltage VI
AED01970
AED02270
9.0
30
V
V
Q
mA
Ι q
V = 13.5 V
Ι
8.5
8.0
7.5
20
T j = 25 C
RL = 20
Ω
10
0
-40
0
40
80
120
160
C
0
10
20
30
50
V
T
VΙ
j
Output Voltage VQ versus
Input Voltage VI
Input Current II versus
Input Voltage VI
AED01973
AED01972
3.5
mA
12
V
Ι
V
Ι
3.0
2.5
2.0
1.5
1.0
0.5
0
Q
10
V
Q
8
T
= 25 C
j
V =V
Ι
Q
R
= 8.5 kΩ
L
6
4
2
0
T
= 25 C
j
R
= 34 Ω
L
-2
-50
-25
0
25
50
V
0
4
8
12
16
V
20
V
V
Ι
Ι
Semiconductor Group
9
1998-11-01
TLE 4274
Typical Performance Characteristics for V10:
Output Voltage VQ versus
Junction Temperature Tj
Current Consumption Iq versus
Input Voltage VI
AED01974
AED02270
10.5
30
V
V
Q
mA
Ι q
V = 13.5 V
Ι
10.0
9.5
20
T j = 25 C
RL = 20
Ω
10
0
9.0
-40
0
40
80
120
160
C
0
10
20
30
50
V
T
VΙ
j
Output Voltage VQ versus
Input Voltage VI
Input Current II versus
Input Voltage VI
AED01977
AED01976
3.5
mA
12
V
Ι
V
V
Ι
3.0
Q
Q
10
2.5
2.0
8
T
= 25 C
j
V =V
Ι
Q
R
= 10 kΩ
L
1.5
1.0
0.5
0
6
T
= 25 C
j
R
= 34 Ω
L
4
2
-2
0
-50
-25
0
25
50
V
0
4
8
12
16
V
20
V
V
Ι
Semiconductor Group
10
1998-11-01
TLE 4274
Package Outlines
P-TO220-3-1
(Plastic Transistor Outline)
±0.2
10
A
±0.15
9.8
B
8.51)
4.4
3.7-0.15
1.27±0.1
0.05
C
±0.1
0.5
0...0.15
3x
0.75
2.4
±0.1
1.05
2.54
M
0.25
A B C
GPT05155
1)
Typical
All metal surfaces tin plated, except area of cut.
Sorts of Packing
Package outlines for tubes, trays etc. are contained in our
Data Book “Package Information”
Dimensions in mm
Semiconductor Group
11
1998-11-01
TLE 4274
P-TO252-3-1
(Plastic Transistor Single Outline)
+0.15
6.5
-0.10
+0.05
-0.10
2.3
A
+0.08
0.9
-0.04
B
±0.1
5.4
0...0.15
0.15 max
per side
3x
0.75
+0.08
0.5
±0.1
-0.04
2.28
±0.1
1
4.57
M
0.25
A B
0.1
GPT09051
All metal surfaces tin plated, except area of cut.
Sorts of Packing
Package outlines for tubes, trays etc. are contained in our
Data Book “Package Information”
Dimensions in mm
SMD = Surface Mounted Device
Semiconductor Group
12
1998-11-01
TLE 4274
P-TO263-3-1
(Plastic Transistor Single Outline)
±0.2
10
4.4
±0.15
9.8
±0.1
1.27
B
A
8.5 1)
0.1
0.05
2.4
0...0.15
±0.1
0.75
±0.1
1.05
2.54
5.08
M
0.25
A B
0.1
1)
Typical
All metal surfaces tin plated, except area of cut.
Sorts of Packing
Package outlines for tubes, trays etc. are contained in our
Data Book “Package Information”
Dimensions in mm
SMD = Surface Mounted Device
Semiconductor Group
13
1998-11-01
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