TLE6710Q_技术文档

TLE 6710

Airbag

Combined Power-Supply

and Firing Circuit

Datasheet

Copying of this document, and giving it to others and the use or communication of the contents thereof, are forbidden without express authority.

Offenders are liable to the payment of damages. All rights are reserved in the event of the grant of a patent or the registration of a utility model.

Version B

May 04, 2001

Datasheet

TLE 6710

Table of Content:

A. Features......................................................................................................................................... 2

B. Circuit Description.......................................................................................................................... 3

Supply and Reference:.................................................................................................................. 3

Low Battery Detection on pin UBATT:........................................................................................... 3

Oscillator for Boost (30V)-, Buck (5V)-Converter and Watchdog: ................................................ 3

Boost Converter (30V): ................................................................................................................. 4

Buck Converter (5 V):.................................................................................................................... 5

Power On Reset of VCC5: ............................................................................................................ 7

Watchdog Operation and Generation of the Squib Driver Enable Signal ZKEN:.......................... 7

ISO 9141 - Serial Interface:........................................................................................................... 9

Serial Peripheral Interface (SPI) and Decoder Logic: ................................................................... 9

Alarm Warning Lamp Driver (AWL1):........................................................................................... 11

Alarm Warning Lamp and Multifunction Driver 2 (AWL2):............................................................ 12

Voltage-/ Current Sources:............................................................................................................ 13

Squib Drivers:................................................................................................................................ 14

Squib Resistance Measurement: .................................................................................................. 16

Squib Leakage Measurement: ...................................................................................................... 17

Supply Voltage Measurements: .................................................................................................... 19

Detection of Safing Sensor Closure:............................................................................................. 19

Average Chip Temperature Measurement:................................................................................... 22

Grounding Requirements for External Components on PCB:....................................................... 22

C. Package Outline ............................................................................................................................ 23

D. Pin Configuration ........................................................................................................................... 24

E. Pin Definitions and Functions ........................................................................................................ 25

F. Block Diagram and Application Circuit........................................................................................... 27

G. Absolute Maximum Ratings........................................................................................................... 28

H. Functional Range........................................................................................................................... 31

I. AC/DC Characteristics .................................................................................................................... 32

Supply currents: ............................................................................................................................ 32

Logic Inputs and Outputs: ............................................................................................................. 33

Low Battery Detection on pin UBATT (EVZ):................................................................................ 34

Oscillator for Boost (30V)-, Buck (5V)-Converter and Watchdog ................................................. 34

Boost Converter (30V): ................................................................................................................. 35

Buck Converter (5V):..................................................................................................................... 37

Power On Reset of VCC5 & EVZ and Watchdog: ...................................................................... 39

ISO 9141 - Serial Interface:........................................................................................................... 40

Alarm Warning Lamp Driver (AWL1):........................................................................................... 41

Alarm Warning Lamp and Multifunction Driver 2 (AWL2):............................................................ 42

Voltage-/ Current-Sources (V/I):.................................................................................................... 43

A)

Squib Driver: Highside: .............................................................................................................. 44

A)

Squib Driver: Lowside: ............................................................................................................... 44

Squib Driver: Highside and Lowside: ............................................................................................ 45

Squib Resistance Measurement: .................................................................................................. 46

Squib Leakage Measurement: ...................................................................................................... 49

Internal Dummy Squib Resistance:............................................................................................... 50

Supply Voltage Measurements: .................................................................................................... 50

Detection of Safing Sensor Closure:............................................................................................. 51

Average Chip Temperature Measurement:................................................................................... 52

J. Serial Peripheral Interface (SPI)..................................................................................................... 53

J.1: SPI Timing Characteristics:.................................................................................................... 53

J.2: SPI Commands:..................................................................................................................... 54

J.2.1: General Information on SPI Command Structure: ......................................................... 54

J.2.2: Summary of SPI Commands: ........................................................................................ 54

J.2.3: Firing Commands: (8XXX)H ......................................................................................... 55

J.2.4: Squib Resistance Measurement-, Squib Voltage Measurement-

and IMESS-pin Voltage Measurement Commands:...................................................... 56

J.2.5: Firing Voltage Measurement Commands: ..................................................................... 57

J.2.6: Squib Leakage Measurement Commands with one of eight squib switches in ON-st.:. 58

J.2.7: Voltage-/ Current-Sources (V/I) Commands:................................................................. 59

J.2.8: Supply Voltage-, Lamp-Measurement and Squib Leakage Measurement

......... with squib switches in OFF-state Commands: (1XXX)H

60

J.2.9: Control Commands for Lamps, Watchdog and Safing Sensor Detection:..................... 61

J.2.10: Oscillator Frequency Test Mode Command: (5555)H ................................................. 62

J.2.11: 2.8V Reference Test Mode Command: (AAAA)H........................................................ 62

J.2.12: Reset by SPI Command: (FFFF)H............................................................................... 62

J.2.13: Average Chip Temperature Test Mode Command: (9XXX)H...................................... 63

Version B

May 05, 2001

page 1

Datasheet

TLE 6710

Combined Power-Supply and Firing Circuit for Airbag Applications

A. Features

•

Step up converter 30V (Boost Converter) with a maximum duty cycle of 90%

and a 700mA minimum current limitation of the power transistor

Step down converter 5V (Buck Converter)

Improvement of the efficiency of the buck converter by external supply (EVZ2)

Four independent firing squib drivers

•

Highside and lowside switch for each firing circuit

Firing current limitation to maximum 3.25A for each firing circuit

Digital output for firing current detection of minimum 1.75A for two squib drivers

Squib resistance measurement with analogue outputs

Switchable gain factor (10 or 30) for an improved accuracy of the squib

resistance measurement

•

Programmable squib leakage measurement to ground or to battery supply

with digital outputs

•

Several supply voltage measurements on external pins

Digital output for detection of safing sensor closure

Watch dog circuit

Precise 100kHz oscillator

Power on/off reset generator

Serial interface line driver (ISO 9141 and TTL-level)

Four voltage/current sources for diagnostic purposes

Diagnostic lamp driver

Diagnostic driver for inductive loads or lamps

Serial peripheral interface (SPI) for direct driving from a micro controller

Logic and analogue output signals for direct sensing and diagnostics by a µC

Package P-MQFP-64-1

Type

Ordering Code

Package

TLE 6710

on request

P-MQFP-64-1

Version B

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Datasheet

TLE 6710

B. Circuit Description

A description of each section of the IC is given below with the representative block diagram and the application circuit.

Supply and Reference:

Internal supply and biasing of the sections is provided by a supply module which is driven by voltage EVZ of the boost

converter (30V) . During start up, EVZ is charged by the battery voltage UBATT via external inductance and diode.

The voltage reference is based on a temperature-compensated bandgap circuit and has an accuracy of ± 1% at room

temperature.

Low Battery Detection on pin UBATT:

A comparator has been incorporated to guarantee that the modules i.e. reference voltage, internal supply and 100kHz-

oscillator, are fully functional before the boost converter (30V) and the logic output AUSP are enabled. It prevents the

possibility of start up glitches. The internal reference voltage is monitored by a comparator which disables the output

stage AUSP when the voltage on input pin UBATT drops below 5V. To prevent erratic output switching as the threshold

is crossed, 200mV of hysteresis is provided.

Oscillator for Boost (30V)-, Buck (5V)-Converter and Watchdog:

The oscillator frequency is externally programmed to 100kHz by the capacitor COS = 1nF on pin COS and a current

source determined by the fixed resistor ROS = 5 kΩ on the pin ROS. The nominal voltage value on pin ROS is 1.2V.

1.2 V

Current calculation:

I

ROS

240 A

5 k

The charge to discharge ratio is controlled to yield a 90 % maximum duty cycle at the switch output of the boost

converter (30V). During the discharge of COS, the oscillator generates an internal blanking pulse (FOSC) to disable

the switch output of the boost converter (30V) and to enable the switch output of the buck converter (5V) as well as to

provide a clock signal to the watchdog function. The nominal peak and valley saw tooth thresholds of the oscillator are

VSTV = 0.6V and PSTV = 1.8V respectively.

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Datasheet

TLE 6710

Calculation formulas:

7

V

ROS

Capacitor charge current:

I

COSc

=

× IROS

=

×

= 140 µA

= 840µA

12

R

7

2

V

ROS

Capacitor discharge current:

Peak to peak voltage on pin COS:

Saw tooth rise time:

COSd = − × I^ROS= −

×

2

R

ROS

V

COSpp = VROS = 1.2 V

V

^COSpp× C^COS

12

t

r

=

× R^ROS× CCOS

I

COSc

7

V

^COSpp× C^COS

2

Saw tooth fall time:

t

f

× R^ROS× CCOS

I

COSd

7

1

Oscillator frequency calculation:

f

OS

f

offset 5%

foffset 5%

t

r

t

f

2 C^COS

RROS

f

offset ...Frequency offset of the PCB depending on the layout of each application.

Boost Converter (30V):

A boost converter generates a supply voltage for the airbag firing system, adjustable via external resistors between

15V and 33V. An inductance L is PWM-switched by an integrated current limited DMOS-power-transistor with a

frequency of 100kHz. The reference section provides a 2.8V voltage for the regulation loop. An error amplifier

compares the reference voltage with the feedback signal TVZ, which comes from an external divider network used to

determine the output voltage EVZ.

Application note for programming the output voltage on pin EVZ:

R

VZ1

R

VZ2

VEVZ

2.8V

R

VZ2

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Datasheet

TLE 6710

With a PWM comparator, the output of the error amplifier is then compared with a periodic linear ramp provided by the

saw tooth signal of the oscillator. A logic signal with variable pulse width is generated, which passes through logic and

driver circuits to the power switching FET. A duty cycle of typ. 86 % is determined by the duration of the falling ramp of

the saw tooth oscillator.

The output transistor conduction is suppressed immediately if the current through the power FET exceeds typ. 800mA,

low battery voltage or overvoltage on pin EVZ is detected. In case of short spikes, the logic circuit inhibits multiple

pulses during one oscillating period.

Warning: A short from EVZ to ground can damage the external diode or the inductance, due to non existing

overcurrent limitation in that path. The output transistor is designed to switch a maximum of 40V, with a drain current

limitation of typically 800mA.

During start up, EVZ is charged by the battery voltage UBATT via external inductance and diode, so the voltage on pin

EVZ is too low and the PWM-comparator requires a duty cycle of more than 85 %. Due to an increasing inductance

current after several periods, the overcurrent sensor becomes active and reduces the maximum duty cycle to improve

magnetic energy transfer.

NOTE: The pin GNDC chip internally is separated from the analog ground GNDB. On PCB these pins need to be

connected for standard applications. If a boost converter application with higher power capability is needed, the pin

GNDC can drive the gate of an external logic level power FET. The maximum output voltage on pin GNDC will be 7.5V

(0mA) and minimum 5.5V driving 10mA. An external overcurrent detection circuit should switch off the external power

FET and lead to a current spike on pin GNDC (900mA) to shut down the boost converter output driver stage of the TLE

6710.

Buck Converter (5 V):

A stabilised 5V-supply for general purpose in the airbag system is realised by a buck converter. An external inductance

L is PWM switched with a frequency of 100kHz via a high side DMOS-power transistor. The regulator module is

supplied by the boost converter output (15-33V), and uses the stored energy of the boost converter capacitor if battery

power-down occurs.

The basis for the regulation loop is a temperature compensated 2.8V bandgap reference voltage, generated in the

reference section and linked to the non inverting input of the ‘Error Amplifier’ with a high voltage gain (> 60dB). The

reference voltage is compared with the internally divided output voltage VCC5.

External loop compensation is required for converter stability, and is formed by connecting a series resistor-capacitor

(R , C ) between pins KOM1 and KOM2. The simplest way to optimise the compensation network is to observe the

F

response of the output voltage VCC5 to a step load change, while adjusting R and C for critical damping. The final

F

circuit should be verified for stability under four boundary conditions. These conditions are minimum input voltages,

with minimum and maximum loads.

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Datasheet

TLE 6710

The error amplifier output is applied to the inverting input of the ‘Pulse Width Modulator’ (PWM) and is compared with

the oscillator ramp voltage COS. Output switch conduction is initiated when the error amplifier output voltage exceeds

the sawtooth peak voltage, due to less VCC5 voltage.

The duration of the output transistor conduction depends on VCC5 level and conduction is suppressed immediately if

the current through the power FET exceeds typically 400mA or the voltage on pin VCC5 reaches typically 6V. The logic

circuit inhibits in the case of short spikes, multiple pulse operation in one oscillating period.

During start up procedure the buck converter will be enabled, if the voltage on pin TVZ is greater than 1.85V.

So the EVZ voltage of the boost converter has to reach 60 % of its final value to enable the buck converter (5V). The

buck converter will be disabled, only when a power down of EVZ occurs to less than about 7 % of the nominal voltage

value on pin EVZ.

The output power FET works as a source follower and is designed to switch a maximum of 40V with a drain current

limitation of typ. 400mA. To make the power dissipation of the output FET smaller, the voltage drop across the device

can be reduced by increasing the gate voltage. This improvement can be executed by adding an external supply

voltage to the pin EVZ2, which should be approximately 8V greater than the voltage on pin EVZ and realized by a

bootstrap circuit.

Version B

May 05, 2001

page 6

Datasheet

TLE 6710

Power On Reset of VCC5:

In order to avoid any system malfunction, a sequence of several conditions has to be passed. In case of VCC5 (5V)-

power down a logic LOW output signal on pin RESQ is generated to disable an external microcontroller. When a

voltage of VCC5 ≥ 4.75V is reached, the RESQ signal remains LOW for another 64ms before switching to HIGH. If

VCC5 decreases below 4.55V, reset is activated after more than 10µs to 150µs only.

Watchdog Operation and Generation of the Squib Driver Enable Signal ZKEN:

The watchdog is driven by the oscillator frequency divided by 100 (= 1kHz). After power on, the LOW-signal on output

RESQ for µC-reset is extended by 64 cycles. 32 clock cycles after the rising edge of RESQ, a chip internal trigger

window (WDWI) begins. It ends after 32 cycles at the latest. If a trigger pulse (TRI) - coming via the serial peripheral

interface (SPI) - occurs within the trigger window (or if a power-down occurs) the watchdog window signal is reset. The

TRI pulse must be active for at least two rising clock edges and must return to zero for two clock edges. If no TRI pulse

occurs in the trigger window, or if TRI pulse is outside of the trigger window, a reset (LOW) is generated on pin RESQ

after 64 cycles and lasts for a further 64 cycles.

Correct triggering also will be executed, if after the falling edge of the TRI pulse signal only the sampling of the second

‘low’ occurs inside of the watchdog window. The beginning of the TRI pulse starts outside of the trigger window.

The TRI trigger pulse is set and latched by the SPI command WDTRH and reset by WDTRL. So the microcontroller is

allowed to do measurements with the TLE 6710 during the TRI pulse is active.

In addition to the µC-reset signal RESQ, there exists an enable signal ZKEN for the internal squib drivers and for

external firing circuits. If RESQ is high, the signal ZKEN goes to active high with the first valid trigger pulse TRI. It

returns to low immediately if pretriggering, missing triggering or an incorrect trigger duration, as well as power down

reset occurs. ZKEN is designed as an open drain output. If ZKEN is used as an input and held to 'low' by an external

device, firing of the squibs can not be activated.

Accelerated testing via pin RTP and AW1CT:

VVCC5

VRTP

AW1C

T

RESQ

0

ZKEN

0

fWD [kHz] TWD [ms]

Remarks

-

< 4.55 V

>4.75V -0.3V ≤ VRTP ≤ 0.8V

x

0

1

-

1

normal operating Normal operating

mode

>4.75V

fWD

2.4V ≤ VRTP ≤

VVCC5+ + 0.3V

2.4V ≤ VRTP ≤

VVCC5+ + 0.3V

VVCC5 + 1.7V

≤ VRTP ≤ 7.1V

1

0

1

test mode A

test mode B

test mode C

normal operating normal operating

25

0.04

mode

1

mode

1

Frequency of the internal used 'Watchdog' - clock (fWD = fos / 100; fos = 100kHz typ.)

For test mode B and C: fWD = fos / 4

TWD

Period of the internal used 'Watchdog' - clock ( = 1 / fWD)

Version B

May 05, 2001

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Datasheet

TLE 6710

Watchdog

A. Perfect triggering after power on

VCC5

5 V

4.55 V

<4.55 V

0 V

t

RESQ

tpu

64 cy

chip internal

watchdog

window

ttwd

<32 cy

WDWI

t

t0

TRI

32 cy

tts

32 cy max.

32 cy

coming

from SPI

t0

t1

t2

t3

ZKEN

t

B. Incorrect

64 cy

RESQ

t

WDWI

t0

t1

t2

64

32

64

32

TR

I

ZKEN

t

incorrect trigger duration TR

inside of watchdog window

WDWI: H<=2cy, l<=2cy

pretrigger

missing trigger

Version B

May 05, 2001

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Datasheet

TLE 6710

Note: After ‘key ON’ and sending the first correct SPI trigger command the output signal ZKEN is expected to transit to

‘high’ immediately. However it may stay ‘low’ longer depending on the voltage on pin ISS (Input Safing Sensor). This

one time event happens only after a RESQ ‘low’ to ‘high’ transition in case of VISS = 0V to VVCC5/2 (Spec. 20.4A), pin

ISS = open or VISS ≥ VVCC5 + 1.2V (Spec.20.1). The time prolongation to achieve the rising edge on ZKEN will be

9800/fos (98ms typ.) starting from the rising edge of RESQ, if a SPI trigger command was successful at that time.

ISO 9141 - Serial Interface:

Serial data communication from external to the µC of the airbag board is provided by a 12V/5V-level-interface. The

transmission signal TXD is transferred via an open drain output buffer to pin K. The external line signal K is linked to

the receiving pin RXD. If the input pin L is not connected, the typ. threshold voltage on pin K is 0.5 x V

.

If the

UBATT

input pin L is connected, the typical threshold voltage on pin L is 0.16 x V

. If it is necessary to handle a logic

UBATT

level input signal on pin L, the input pin LVCC has to be connected to VCC5. In this case the threshold voltage on pin L

is 0.5 x VVCC5.

+V

K

TXD

0.5 x UBATT

0.16 x UBATT

RXD

L

LVCC

to VCC5

0.5 x VCC5

for logic level purpose

Serial Peripheral Interface (SPI) and Decoder Logic:

The slave select pin SSQ allows the individual selection of different slave SPI devices. Slave devices that are not

selected do not interfere with SPI bus activities. The SPI logic is selected by the slave select signal SSQ for the

transmission of instructions like control and diagnostic commands.

(See chapter: 'J. Serial Peripheral Interface SPI')

The master-out slave-in pin MOSI is the input signal for the serial data from the µC, synchronously clocked by clock

input CL, which operates at a maximum transmission rate of 4 Mbits/sec.

All commands, no matter which function, consist of 16 bits, so the TLE 6710 SPI includes a 16 bit input shift register, a

16 bit latch and a decoder logic block for the generation of the SPI command signals.

With the rising edge of CL the data via MOSI is shifted into the first bit of the shift register.

To suppress data transfer errors in the event that the clock signal includes spikes or glitches, a counter for 16 clock

cycles is provided. Only after occurring of 16 clock cycles, the rising edge of SSQ causes an internal signal ‘lat_enm’

(latch enable) to transfer the data from the shift register to the 16 bit latch. A CMOS logic block decodes the 16 bit word

of the latch to address the desired functional block.

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May 05, 2001

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Datasheet

TLE 6710

Mode definition: The TLE 6710 can be configured in two modes. The difference between the two modes are the

definitions of the hardware pins HSEN_EN12, LSEN_EN34 and MODE for the functions of firing and squib

measurements (see chapter J.2). A Mode1 operation requires an initializing SPI ‘Mode command’ (FExx)H and a ‘high’

on pin MODE before starting with SPI instructions. Otherwise the control and diagnostic commands will not be

decoded. A MODE0 operation requires no SPI ‘Mode command’ however a ‘low’ or ‘open’ on pin MODE (due to a pull

down resistor). With a hardware reset RESQ=0 the ASIC will return to its default state of the MODE0.

The following table shows the principle:

Mode

pin: MODE

0 or open

1

SPI: Mode command

MODE0

MODE1

(FExx)H

TLE6710

MODE:

MODE0:‘low‘

MODE1:‘high‘

Serial Peripheral Interface (SPI) and Decoder Logic:

Timing of the Serial Peripheral Interface (SPI):

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May 05, 2001

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Datasheet

TLE 6710

Alarm Warning Lamp Driver (AWL1):

The driver AWL1 is designed as a low side switch. Its logical behavior can be programmed via the control pin AW1CT. If AW1CT

is not connected, the lamp driver AWL1 is ON as default. If AW1CT is connected to ground (0V), the lamp driver AWL1 is off as

default. In case of missing EVZ or VCC5 the warning lamp is supplied via pin AWL1 with a typical saturation voltage of 2V,

independent of the IC-supply voltage.

The following table defines all possible conditions:

AW1CT

open

gnd

open

gnd

open

gnd

EVZ

ok

VCC5

ok

RESQ

AWLEN

SPI-bit

Driver AWL1

ON

0

X

1

X

0

1

X

OFF

ON

OFF

ON

OFF

ON

SAWL1B

SAWL1D

SAWL1B

SAWL1D

gnd

open

gnd

open

gnd

open

gnd

ok

missing

ok

X

ON

OFF

ON

OFF

ON

OFF

missing

missing missing

ok

If AWL1 is on and the voltage on pin AWL1 is greater than typically 2V, the lamp current is limited. To protect the integrated power

switch against overtemperature, a thermal limitation circuit is provided. This feature prevents catastrophic failures from accidental

device overheating. The temperature limitation circuit starts to work, if the voltage drop across the power transistor is greater than

typically 2V. The lamp status is reported as an information of the voltage or of the current on pin AWL1 to the general analogue

measurement output pin UZP.

1. Voltage measurement on pin AWL1:

Via SPI command UAWL1 the voltage on pin AWL1 is measured and linked to the measurement pin UZP with a voltage ratio of 5

to 1.

Following detections are possible:

• Short to battery if lamp is switched on

• Over temperature if lamp is switched on

• Short to ground if lamp is switched off

• Open load if lamp is switched off

2. Current measurement on pin AWL1:

Via SPI command IAWL1 a current level on pin AWL1 is detected and reported to the measurement pin UZP as a digital

information for 'open load if lamp is switched on'.

Lamp switched to

Lamp current

VUZP

on

0 to 0.4 V

1.5 V to VVCC5

≤10 mA

≥30 mA

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Datasheet

TLE 6710

Alarm Warning Lamp and Multifunction Driver 2 (AWL2):

A second warning lamp block (AWL2) is provided to drive high side or low side loads.

The default state of the driver is "off". The driver can be switched on via SPI control bits. To obtain minimum on resistance of the

driver, if used as high side switch, VEVZ has to be greater than VAWL2D+6V

In case of missing the voltage EVZ or VCC5 the driver is switched off. The pin AW1CT has no influence to the status of the AWL2-

driver.

EVZ

ok

missing

ok

VCC5

ok

RESQ

SPI

X

on

off

X

driver awl2

OFF

0

1

X

ON

OFF

missing

X

missing

OFF

The load current is limited to 250 to 600 mA.

The load status is reported as an information for the voltage on pins AWL2S and AWL2D to the general analogue measurement

output pin UZP. This information can be selected by the corresponding SPI commands.

1. Voltage measurement on pin AWL2D:

Via SPI command UAWLD the voltage on pin AWL2D is measured and linked to the measurement pin UZP with a voltage ratio of

5 to 1.

Following detections are possible:

• Short to battery if driver is switched on

• Overtemperature if driver is switched on

• Short to ground if driver is switched off

• Open load if driver is switched off

2. Voltage measurement on pin AWL2S:

Via SPI command UAWLS the voltage on pin AWL2S is measured and linked to the measurement pin UZP with a voltage ratio of

5 to 1.

Following detections are possible:

• Short to ground if driver is switched on

• Overtemperature if driver is switched on

• Short to battery if driver is switched off

• Open load if driver is switched off

Current can be measured by connecting a resistor from drain pin to battery supply or source pin to ground corresponding to the

application. The voltage drop across the resistor indicates the current through the load.

To protect the integrated power switch against overtemperature, a thermal shut down circuit is included. This feature prevents

catastrophic failures from accidental device overheating. The attached schematic shows the principal function in case of

overtemperature. If the lamp driver is on and an overtemperature signal of the AWL2 driver occurs, latch 2 is set and latch 1 is

reset to switch off the driver. Activating an 'Average Chip Temperature'-measurement reports to pin UZP a reduced voltage of less

than approx. 1.4V, which can be interpreted as a digital information of over temperature of lamp driver 2. Returning to the specified

'Average Chip Temperature' measurement only can be done by a SPI command SAWL2D (to switch off the lamp).

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May 05, 2001

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Datasheet

TLE 6710

Voltage-/ Current Sources:

The functional block 'V/I-Sources' is provided to measure the value of four different external resistors and can be

addressed by a special SPI command SELx (x=1,2,3,4) (2XXX)H. After being addressed a constant voltage source of

2.8V on pin IASGx is activated and a current flows through one addressed external resistor. The resistance dependent

sensor current is reflected by a 10 to 1 current mirror to an analysis path ISENS. The voltage drop of R

on pin

SENS

ISENS is proportional to the actual external resistive sensor value and is reported 1:1 to pin UZP. This signal is

connected with an analogue port of the µC and stored as first measurement value. Due to the possibility of an external

ground shift a second measurement occurs to use a difference measurement principle to eliminate a constant ground

voltage shift. Therefor the SPI command SELx (x=1,2,3,4) AND SELV (BXXX)H has to be addressed to activate the

constant voltage source to the second value of 5.0V on pin IASGx. This voltage determines a second voltage value on

pin UZP.

Calculation of the external resistance value on pin IASGx (done by the µC):

^SENSx

R

5.0V −2.8V

RIASGx

=

10

V

ISENS2−

V

ISENS1

The current through pin IASGx is limited to |25|...|80| mA, if pin IASGx is shorted to ground and the voltage on pin

ISENS does not reach VVCC5 due to a low resistor on pin ISENS. However the value of the IASGx current limitation

can be reduced by increasing the value of the resistor on pin ISENS. Then the maximum current through pin IASGx

can be calculated as:

V

VCC5

I

IASGxlim 10 x

RSENS

For high accuracy the IASGx current needs to be between 1 and 20mA and the maximum ISENS voltage is less than

VVCC5-0.3V. Under clamping condition the voltage on pin ISENS is clamped to VVCC5 + 0.3V.

Calculation of the value of the resistor on pin ISENS:

V

^VCC5− 0.3V

RSENS = 10 x

I

IASG^max

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Datasheet

TLE 6710

Squib Drivers:

The TLE 6710 includes four independent driver circuits to fire one squib each. The deployment of a squib is only

initiated, if two independent switches of the firing squib loop are closed. These two serial switches are realised by one

1)

highside DMOS -switch from squib supply pin VZx (x=1,2,3,4) to the first terminator of the squib ZPx1 (x=1,2,3,4) and

one lowside DMOS-switch from the second terminator of the squib ZPx2 (x=1,2,3,4) to ground Mx (x=1,2,3,4).

The squib will fire only if all following signals are present: RESQ = 1,

Mode

MODE ZKEN ZKEN_int HSEN_EN12 LSEN_EN34 Function

MODE0

MODE1

0

1

0

1

0

1

(8xxx)H: firing of HSx and / or LSx

(8xxx)H: firing of squib 1 and 2

(8xxx)H: firing of squib 3 and 4

(8xxx)H: firing of squibs 1 to 4

For MODE1 operation an initializing SPI ‘Mode command’ needs to be sent once after start up. If RESQ = 0 is

generated, then the measurement will be interrupted and the ASIC will return to its default state of the MODE0. A soft

reset (FFFF)H does not change the mode. ZKEN must be generated internally (ZKEN_int) to high. Used as an input

the ZKEN signal is not allowed to hold it to GND by an external device.

In case of activating the lowside switching transistor the firing current will be sensed (squib driver 1 and squib driver 2

only). If the current exceeds 1.75A, a digital firing current signal can be detected on pins LL and LH as described in the

following table:

Firing current of squib 1 Firing current of squib 2

VLL

high

low

high

low

VLH

high

low

0A

>1.75A

0A

>1.75A

0A

>1.75A

low

The maximum firing current of the squib loop is limited to 3.0 A by reducing the gate to source voltage of the low side

DMOS transistors.

For a drain to source voltage drop less than approximately 2V of each switching transistor, no reduction of gate to

source voltage of the squib transistor is demanded. So the sum of voltage drops across the high side and low side

transistors does not exceed 3.0 V at 1.75 A of squib current. The gate driver of the high side transistor is supplied via

pin EVZ2. A current source from EVZ to an external capacitor on pin EVZ2, de-coupled by a diode provides a sufficient

gate to source voltage for the DMOS.

To protect each individual squib driver transistor in the event that the peak junction temperature of the transistor

o

exceeds 280 C a thermal toggling circuit is provided to avoid a further increasing of the DMOS temperature. This

feature prevents catastrophic failures from accidental device overheating. Due to too long switch on times and high

power consumption the thermal toggling leads to a general increasing of the average chip temperature. If the average

chip temperature exceeds 100°C, a driver will be deactivated under thermal toggling and stays in off-state by a latch.

Repeating on-commands do not activate the affected transistor, however to resume firing it will be necessary to send a

NO OP-, 0000-, driver-off- or any measurement-command to reset the latch, before sending a new firing command,

once the average temperature falls below its critical level.

1)..........

DMOS: Double Diffused Metal Oxide Transistor

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Datasheet

TLE 6710

ϑ

Ω

squib

Truth table for the squib drivers:

Mode

MODE ZKEN ZKEN_int HSEN_EN12 LSEN_EN34 SPI command / Function

MODE0

MODE1

0

1

x

1

x

1

x

0

1

x

(8xxx)H: firing of HSx and / or LSx

(7xxx)H: reference + HSx main current

(Cxxx)H: measurement with HSx on

(Cxxx)H: measurement with LSx on

(8xxx)H: firing of squib 1 and 2

0

1

0

1

0

1

0

(8xxx)H: firing of squib 3 and 4

(8xxx)H: firing of squibs 1 to 4

(7xxx)H: reference + HSx main current

(Cxxx)H: measurement with HSx on

(Cxxx)H: measurement with LSx on

LSx

HSx

low side switch of the squib driver (x = 1,2,3,4)

high side switch of the squib driver (x = 1,2,3,4)

For MODE1 operation an initializing SPI ‘Mode command’ needs to be sent once after start up. If RESQ = 0 is

generated, then the measurement will be interrupted and the ASIC will return to its default state of the MODE0. A soft

reset (FFFF)H does not change the mode. ZKEN must be generated internally (ZKEN_int) to high. Used as an input

the ZKEN signal is not allowed to hold it to GND by an external device.

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TLE 6710

Squib Resistance Measurement:

The squib resistance measurement module consists of several circuit parts and can be addressed by a SPI command

(4XXX)H. After being addressed a current source of approximately 5.5mA is activated and this current flows as a

reference measurement current through ZPx2. The appropriate voltage drop across the squib is amplified by a precise

amplifier with a fixed gain of either 10 or 30 and monitored on the external analogue output pin UZP. The measurement

current is also reported by the voltage drop across the external resistor on pin IMESS. The value of this basic current

through pin IMESS is determined by the external resistor on pin ROS and can be calculated by the following formula:

IIMESS = IROS x 55 x 5/12

IROS = 1.2V / RROS

(IROS=240µA @ 5kΩ)

One of the recommended values for RROS in the application circuits is 4.99kΩ.

After the first reference measurement has been performed with the current of typ. 5.5mA, a second measurement with

a programmable current source of typically 40mA is started by an additional SPI command (6XXX)H. This current is

determined by an external resistor from pin EVZ to pin WDR. The voltage on pin WDR is regulated to approximately 9

V.

A=1/5

main

current

basic

current

RB

SB

5,3

V

Squib resistance measurement: Functional schematic

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TLE 6710

Application note for calculation of the external resistor R

:

WDR

V_EVZ(7.5to 8.5V)

R_WDR

(10to50 )

I_WDR< 60mA,

I_WDR

Rsquib = 2Ω approx.

Also for the second measurement the voltage drop across the squib (x10 or x30) via pin UZP and the measurement

current via the pin IMESS are reported to the microcontroller. This feature enables the µC to calculate the external

squib resistance with a high accuracy by eliminating DC-offsets.

Calculation of the squib resistance R

:

squib

V_UZP1V_UZP2

R_squib

R_IMESS/ gain factor (10 or 30)

V_UZP10.9 V^VCC5typ.

_IMESS=50Ω approx.

, if a mechanical safing sensor (SS) with a resistor (RS) is used in parallel.

(V

V

)

IMESS2

IMESS1

R

There is another way to measure R

squib

Instead of activating the higher measurement current the highside switch of a squib driver can be switched on via SPI:

(7XXX)H . Now a current determined by the resistor RS flows through the squib and is reported to UZP and IMESS.

For buckle switch measurement purposes an amplifier with gain 2 was provided. In applications a buckle switch (SB)

with a 2kΩ to 5kΩ resistor (RB) in parallel is connected in series to the squib. For the distinction between a broken and

an open seat belt switch the result of the gain 10/30 amplifier gives us no information, so the voltage drop across pin

IMESS multiplied by two can be reported to pin UZP to increase the sensitivity of the current measurement through the

pin IMESS. If this principle does not give information enough a squib voltage measurement with activated ‘main

current’ can be performed to multiplex VZPx1 / 5 to pin UZP. So the SPI commands for the squib resistance

measurement select between a measurement of the voltage drop across the squib (gain 10/30 amplifier), a

measurement of the voltage drop across pin IMESS (gain 2 amplifier) or a measurement of the voltage on pin Zpx1

(divided by 5) reported to pin UZP each.

The measurement for each squib is activated separately, but the analogue output signals on pins UZP and IMESS are

common.

Note 1: The high measurement current through the squib requires a force and sense measurement principle to

guarantee the high resistance measurement accuracy. So the precise gain-10-amplifier sense inputs and the gain-30-

amplifier sense inputs are bonded separately to the pins ZPx1 and ZPx2. (x=1,2,3,4).

Note 2: The analogue output pin UZP can be connected in parallel with other ASICs on one PCB.

Note 3: The current output pin IMESS can be connected in parallel with other ASICs on one PCB. So the external

resistor on pin IMESS is only used once and is common for all IC's.

Squib Leakage Measurement:

The leakage resistance measurement module can be addressed only for one squib at one time by a SPI command

(1XXX)H. The current for the leakage measurement I

is determined by the reference resistor RRLM from pin RLM

RLM

to ground, which is supplied by a voltage of VUBRL / 3 .

V_UBRL

I_RLM

=

= I_LL= I_LH

3×R_RLM

Due to a leakage the programmed leakage current I

can flow either from the squib system via the leakage resistor

RLM

R

LL

to ground (I ) or from a positive voltage +V via the leakage resistor R into the squib system (I ). See

LL LH LH

schematic.

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TLE 6710

Across the leakage resistors R and R the following leakage voltage drops can be monitored:

LL LH

V

UBRL

V_{ZPx1to GND}= I_LL×R_LL=

×R_LL

3×R_RLM

V_UBRL

V_{UBRL to ZPx1}= I_LH×R_LH=

×R_LH

x = 1,2,3,4

3×R_RLM

15 to 33 V

VBAT

EVZ

RS

VZx

SS

LH

1:1

UBRL

3

ILL

HSx

SPI:SHSx

A

x VUBRL

REG

+

-

4

VUBRL

3

VRLM =

ZPx1

ILH

1

x VUBRL

4

RLM

+

squib1

ILL

ILH

+ V

RLL

RRLM

IRLM

1:1

RLH

ZPx2

LL

A

SPI:LKx

from squib

driver 1

I1 > 1.75 A

I2 > 1.75 A

LSx

SPI:SLSx

from squib

driver 2

Mx

43

Leakage resistance measurement: Functional schematic

For the TLE 6710 the leakage resistance threshold is defined by:

RLeak = RLL = RLH = RRLM x 3/4

and so the leakage voltage drops become:

VZPx1 to GNDB = VUBRL / 4

and

V+V to ZPx1 = VUBRL / 4

Two comparators, which are referenced to 1/4 x V

UBRL

and 3/4 x V

UBRL

, determine a leakage to V or a higher

UBRL

voltage by setting pin LH to 'low' and a leakage to ground by setting pin LL to 'low'. If no leakage is detected the pins LL

and LH report 'high'.

To prevent jitters on the output pins a hysteresis of 1/48 x V

UBRL

is provided in both comparators.

Leakage resistance malfunction can be simulated in a testmode by switching on only the squib driver highside

transistor for a leakage to battery, as well as by switching on only the lowside transistor for a leakage to ground by SPI:

(CXXX)H. (see chapter 'SPI Commands').

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TLE 6710

Supply Voltage Measurements:

By SPI commands (1XXX)H (see chapter J.2.8) different voltage measurements are activated and reported to the

analogue output pin UZP with a defined voltage ratio. The pin names of the voltage sources which can be selected are:

UBATT, UBRL, ZPx1

voltage ratio to pin UZP: 5,

voltage ratio to pin UZP: 8.

EVZ, EVZ2, VZ1, VZ2, VZ3, VZ4

For test purposes the internal used reference voltage can be measured by addressing the SPI command UREF: (AA

AA)H.

UREF

voltage ratio to pin UZP: 1 (+/-7%).

Detection of Safing Sensor Closure:

Depending on the voltage on pin ISS either the high side - or the low side detection circuit is activated.

High Side Detection:

For V_ISS≥ V_VCC5+1.8V the ‘Safing Sensor’ high side - detection is turned on.

This comparator circuit detects a closure of an external 'Safing Sensor' of the system between the pins VZ1 and ISS. A

closure Safing sensor switch reports a 'high' to pin MSS. If under firing condition the differential voltage between VZ1

and ISS exceeds typ.2.3 V output MSS changes to 'low'.

For testing purposes a current source (typ. 3 mA) from pin VZ1 to ground can be addressed by the SPI command:

SMSSH. In this case a testing current flows through a resistor in parallel with the Safing Sensor. The voltage drop

across VZ1 and ISS is high enough to exceed the MSS comparator threshold voltage of typ. 0.4 V to get 'low' on pin

MSS.

TLE6710

Version B

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Datasheet

TLE 6710

Functional description (VISS≥VVCC5+1.8 V)

VISS - VVZ1 VMSS

Safing sensor closed

Safing sensor open and squib driver inactive (off)

Safing sensor open and squib driver active (on)

Safing sensor open and squib driver inactive (off) and 3mA current source activated by SPI

Safing sensor closed and one to four squib drivers active (on)

0V

10 to 30V

≥0.3V

≥2.1V

'high'

'low'

Low Side Detection:

A voltage on pin ISS of V_ISS≤ V_VCC5+0.6V activates the ‘Safing Sensor’ low side - detection.

This comparator circuit detects a closure of an external 'Safing Sensor' from pin ISS to ground, which is reported to pin

MSS and indicated by a ‘high’ state at this output ( ‘Closure’ means that V_ISS≤ V_VCC5/2 typ.). To describe the behavior

of the pin MSS depending on ISS and ZKEN, following cases need to be considered together with the time diagrams

on the following page:

Case 1:

If the closure time of the safing sensor t_closureis less than 0.5 ms, then the output MSS will follow the

inverted input signal ISS.

Case 2:

In case of a duration of the safing sensor closure t_closure≥ 1ms a time extension of t_add= 96.5ms is

triggered. The input signal ISS will be sampled by a clock with the period of TS=50/fos. The MSS time prolongation will

be started only, if the internal clock (1/TS) samples a transition of H==>L==>L (see x in the timing diagrams). The

output MSS remains ‘high’ for the total period of time t_sum= t_detect+ t_add= (0.5÷1)ms + 96.5ms. To describe the behavior

of the MSS - output after this period of time, following cases must be considered.

The state on pin MSS will return to ‘low’, if the voltage on pin ISS has returned to ‘high’ and has been ‘high’

continuously within this period of time plus 0.5ms.

4

Case 3:

remain in ‘high’ state for another t_addperiod .

Case 4: After an interruption of the safing sensor closure of at least 0.5ms within the extension period t_add

If the closure still exists after this period t_addplus 1ms, the output MSS will be triggered again and will

a

retrigger will occur, if the following closure time is longer than 1ms. An interrupt less than 1ms does not have any effect

on the origin time extension.

Case 5:

For testing purposes of the external safing sensor the squib drivers can be disabled externally via the

pin ZKEN. Whenever this happens, and the time extension is activated (t_closure≥1ms), the voltage on pin ZKEN is kept

‘low‘ internally by the ASIC within this period (t_add) of time (see switch S in the following schematic).

TLE6710

Function description (VISS≤VVCC5+0.6 V)

Safing sensor open

VISS [V]

VMSS

tsum [100/fOS]

----

V

_VCC5≥V_ISS≥(V_VCC5/2)+0.1 'low'

Safing sensor closed (tclosure≤0.5 100/fOS)

Safing sensor closed (tclosure≥1 100/fOS)

Safing sensor retrigger (tinterrupt≥0.5 100/fOS)

V_ISS≤(V_VCC5/2)-0.1

'high'

tclosure

(0.5+96.5) ≤ tsum ≤ (1+96.5)

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Datasheet

TLE 6710

0,50

50

t_closure

Detection with Time Extension

Case 2: Triggering Mode

t_closure

t_detect

193

Case 3: Retriggering Mode

193

Case 4: Retriggering Mode with Interruptions

not valid

valid

193

Case 5: Testmode

t_closure

t_detect

193

Version B

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Datasheet

TLE 6710

Average Chip Temperature Measurement:

A SPI command (9XXX)H (MTEMP) allows to measure the temperature dependent voltage of 4 diodes connected in

series via the pin UZP. The diodes are supplied by a temperature constant current source which is generated in the

oscillator circuit. The current depends on the resistor on pin ROS.

IDIODES = IROS / 6 = 0.2V / RROS

With ROS = 5kΩ the current will be 40µA. The temperature dependence of the voltage across the four diodes is

approximately - 7 mV/K. The nominal value at room temperature (25°C) will be 2.9 V.

The value will be divided by two after an overtemperature shut down of the lamp driver AWL2 (see chapter AWL2).

Grounding Requirements for External Components on PCB:

The external components from the following pins to ground are necessary to be grounded to pin GNDB. The

connections have to be low resistive and without any voltage shift to the ground pin GNDB.

Critical pins:

ROS, TVZ, UZP, IMESS, RLM, ISENS

Version B

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Datasheet

TLE 6710

C. Package Outline

P-MQFP-64-1

Version B

May 05, 2001

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Datasheet

TLE 6710

D. Pin Configuration

(top view)

Version B

May 05, 2001

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Datasheet

TLE 6710

E. Pin Definitions and Functions

No.

1

2

3

Symbol

Function

ISENS

Current measurement output of V/I-source for connection of an external resistor

Frequency compensation capacitor terminal 2 for 5 V-buck converter

Frequency compensation capacitor terminal 1 for 5 V-buck converter

Analogue measurement and diagnostic output 0...5V

External capacitor (COS=1nF) for oscillator

KOM2

KOM1

UZP

4

5

COS

6

ROS

External resistor (ROS=5kΩ) for oscillator

7

8

9

10

11

GNDB

SVCC5

EVZ2

EVZ

Ground terminal for analogue functions and digital logic

The output of the buck converter (5V) is connected to an external inductance

Connection for external stabilization capacitor

Boost Converter Output

The input of the boost converter is connected to an external inductance

(100 µH)

SVZ

12

13

14

GNDC

RLM

TVZ

Ground terminal for step-up and step-down-converter

Connection of external reference resistor for leakage current detection

Feedback terminal of the boost converter regulation loop via an external resistive

divider between EVZ and GNDC

15

16

VCC5

5V-supply terminal for feedback of the buck converter regulation loop and

supply-input for all 5V-modules

Connection of external reference resistor for firing circuit resistance

measurement

IMESS

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

VZ2

ZP21

ZP22

M2

RESQ

AUSP

MSS

LH

Buffered supply input voltage firing circuit 2

Connection high-side-switch firing circuit 2

Connection low-side-switch firing circuit 2

Ground terminal for firing circuit2

Open drain output for reset or power fail signal

CMOS/TTL-level output of low supply voltage detection, low active

CMOS/TTL-output for detection of short of safing sensor

CMOS-level output for squib leakage to battery or firing current 2 >1.75A

CMOS-level output for squib leakage to ground or firing current 1 >1.75A

CMOS-level input for the Serial ISO 9141 Interface

CMOS-level output signal of the Serial ISO 9141 Interface

CMOS-level input for testing purposes (Watchdog functions)

Ground terminal for firing circuit 1

LL

TXD

RXD

RTP

M1

ZP12

ZP11

VZ1

Connection low-side-switch firing circuit 1

Connection high-side-switch firing circuit 1

Buffered supply input voltage firing circuit 1

Version B

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Datasheet

TLE 6710

Pin Definitions and Functions (continued)

No.

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

Symbol

Function

ISS

Detection input for short of safing sensor

WDR

UBATT

UBRL

AWL1

GNDA1

IASG1

IASG2

IASG3

IASG4

AWL2S

AWL2D

K

Connection of external reference resistor to EVZ for resistance measurement

Unregulated high voltage supply input

UBATT supply voltage connection

Output of the warning lamp

Ground terminal for AWL1

Output of V/I-source 1

Output of V/I-source 2

Output of V/I-source 3

Output of V/I-source 4

Source terminal for AWL2

Drain of AWL2 driver for general purpose

High-voltage open drain output of the serial interface

High-voltage input for the serial interface

Input to program the L input to TTL-level, if connected to VCC5

Input, control pin for warning lamp 1, must be left open for self conductance

Buffered supply input voltage firing circuit 3

Connection high-side-switch firing circuit 3

Connection low-side-switch firing circuit 3

Ground terminal for firing circuit 3

L

LVCC

AW1CT

VZ3

ZP31

ZP32

M3

HSEN_EN12 Logic-level input to enable the high-side switches (MODE0) or squibs 1 & 2

(MODE1)

54

LSEN_EN34

Logic-level input to enable the low-side switches (MODE0) or squibs 3 & 4

(MODE1)

55

56

57

58

59

60

61

62

63

64

AWLEN

SSQ

CL

MOSI

MODE

ZKEN

M4

ZP42

ZP41

VZ4

Logic-level input to switch on the warning lamp

Logic-level input to select SPI slave

Logic-level clock input of SPI

Logic-level master-out slave in input

Logic-level input for the mode definition (MODE0 or MODE1)

Logic-input/output open drain signal, enable firing HS- and LS-switch

Ground terminal for firing circuit 4

Connection low-side-switch firing circuit 4

Connection high-side-switch firing circuit 4

Buffered supply input voltage firing circuit 4

Version B

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TLE 6710

F. Block Diagram and Application Circuit

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Datasheet

TLE 6710

G. Absolute Maximum Ratings

Maximum ratings are absolute ratings; exceeding just one of these values

may cause irreversible damage to the integrated circuit.

Maximum Ratings for junction temperature T from -40 to 150°C

j

Limit Values

No.

Parameter

Symbol

min.

typ.

max.

Unit

Supply Pins

Voltage

1.1

VUBATT, VUBRL,

VSVZ, VEVZ,

VVZ1,VVZ2,VVZ3, VVZ4,

VAWL1, VAWL2D, VAWL2S,

VISS, VTVZ

VSVCC5

VEVZ2

-0.3

-1.2

-0.3

40.0

44.0

V

VVCC5

IUBRL

-0.3

-30

6.8

3.0

V

1.2

1.3

Current

mA

Squib Driver Pins

Voltage

VZP11,VZP12,

VZP21, VZP22,

VZP31,VZP32,

VZP41,VZP42

-0.3

40.0

|4.0|

V

1.4

1.5

Current

(see diagram A for timing

characteristics)

IZP11, IZP12,

IZP21, IZP22,

IZP31, IZP32,

IZP41, IZP42

A

Input-/ Output-Signal Pins

Digital input voltages

VRTP

-0.3

7.1

V

VHSEN_EN12,

VLSEN_EN34,

VTXD, VAWLEN,

VMOSI, VCL,

VAW1CT, VSSQ, VMODE

VVCC5

+0.3

V

1.6

Digital input currents

IHSEN_EN12, ILSEN_EN34,

ITXD, IAWLEN,IMOSI, ICL,

IRTP, IAW1CT, ISSQ,

IMODE

|10.0|

mA

1.7

1.8

Digital output voltages

Digital output currents

VRXD, VAUSP,VRESQ,

VMSS, VLL, VLH, VZKEN

-0.3

VVCC5

+0.3

V

IRXD, IAUSP, IRESQ, IMSS,

ILL, ILH, IZKEN

|10.0|

mA

Version B

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Datasheet

TLE 6710

Absolute Maximum Ratings (continued)

Limit Values

No.

Parameter

Symbol

min.

typ.

max.

Unit

Resistance Measurement Pins

1.9

Current output for squib resistance

VIMESS

-0.3

6.8

V

1.10 measurement

IIMESS

-100.0

-220.0

100.0

mA

1.10A For On-time ton< 5ms

1.11 Voltage output for squib resistance

1.12 measurement

VUZP

IUZP

-0.3

6.8

V

-10.0

10.0

mA

1.13 Reference input for squib resistance

1.14 measurement

VWDR

IWDR

-0.3

40.0

V

-100.0

100.0

mA

Leakage Measurement Pins

1.15 Input differential voltage

VZPx1-VZPx2

-40.0

40.0

V

1.16 Reference output for leakage resistance VRLM

-0.3

25.0

10.0

V

1.17 measurement

IRLM

-10.0

mA

ISO 9141 Interface Pins

1.18 L input

VL

IL

-1.0

-2

15

2

V

1.19

mA

V

1.20 K output / input

1.21

VK

IK

-1

40

100

-100

mA

1.21.A LVCC input voltage

VLVCC

-0.3

6.8

V

V/I-Source Pins

1.22 IASGx voltage (x=1 to 4)

1.23 ISENS output voltage

1.24 ISENS output current

VIASG1 to 4

VISENS

-0.6

-0,3

-6.0

40

6.8

6.0

V

IISENS

mA

Oscillator Pins

1.25 ROS voltage

1.26 ROS current

1.27 COS voltage

1.28 COS current

VROS

IROS

VCOS

ICOS

-0,3

-300

-0.3

-2

6.8

300

6.8

2

V

µA

V

mA

Compensation Pins

1.29 KOM1, KOM2 voltage

VKOM1, VKOM2

-0,3

6.8

V

Version B

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Datasheet

TLE 6710

Absolute Maximum Ratings (continued)

Limit Values

No.

Parameter

Squib Deployments

Symbol

min.

typ.

max.

Unit

1.31 Number of firings per squib driver and

lifetime of the IC.

Nmax

100

Squib firing on / off timing

characteristics see the following

enclosed 'diagram A + B'

cooling delay time between two cycles

1min.; load=2Ω

Temperatures

1.32 Ambient temperature

1.33 Storage temperature

1.34 Junction temperature

-40

-55

-40

90

150

°C

ϑa

ϑs

ϑj

Thermal Resistance

1.35 Junction to ambient

1.36 Junction to case

1)

Rthja

Rthjc

50

K/W

15

ESD Classification

1.37

1.38

2000

200

V

Human Body Model (100pF/1.5kΩ)

Machine Model (200pF/0Ω)

±VHBM

±VMM

1)

Condition:

Printed circuit board (epoxi), t = 1.5mm

Top side: copper connections to the pins ( W = 0.35mm, L > 10mm)

CU

Bottom side: Copper lattice (W = 5mm, W = 1mm)

L

CU

squib 1

squib 2

squib 3

squib 4

4ms

10ms

4ms

1min

4ms

Diagram B

Diagram A

Squib firing on/off-timing characteristics

Version B

May 05, 2001

page 30

Datasheet

TLE 6710

H. Functional Range

In the functional range the functions given in the circuit are fulfilled.

Deviations from the characteristics are possible.

T = -40 to + 125°C

j

Limit Values

No.

Parameter

Symbol

min. typ. max.

Unit

Condition

2.1

Voltage on pins UBATT, AWL1, VUBATT

-0.3

20

18

V

AWL2D, AWL2S

VAWL1

VAWL2S

VAWL2D

2.2

2.3

2.4

Voltage on pins UBATT, AWL1, VUBATT

25

40

30

V

t ≤ 15 min

AWL2D, AWL2S during jump

start

VAWL1

lamps off

VAWL2S

VAWL2D

Voltage on pins UBATT, AWL1, VUBATT

V

t ≤ 400ms

lamps off

AWL2D, AWL2S during load

dump

VAWL1

VAWL2S

VAWL2D

dVUBATT/dt

dVUBRL/dt,

dVEVZ/dt,

dVEVZ2/dt,

dVVZx/dt,

dVZPxx/dt,

dVIASGx/dt

VEVZ

Rate of supply voltage rise

V/µs

2.5

Supply voltage EVZ

4,5

33.0

40.0

44.0

V

2.5.A Supply voltage EVZ

2.6

2.7

VEVZ

VEVZ2

t ≤ 48 hours

Supply voltage EVZ2

10.0

Supply voltage of squib drivers

VVZ1, VVZ2,

VVZ3, VVZ4 6.0

40.0

4.8 5.0 6.2

V

2.8

Supply voltage on pin VCC5

VVCC5

2.8 A Voltage on digital I/O pins

Vdigital I/O

VUBRL

-0.3

VVCC5 V

2.9

Reference input on pin UBRL

for leakage measurement

40.0

V

t ≤ 400ms;

≤25V: t ≤ 15 min;

≤18V: continuous

ISVCC5 ≤ 600mA

2.10 Voltage on pin SVCC5

2.10A Voltage on pin SVZ

2.11 Voltage on pin L

2.12 Voltage on pin K

2.13 Voltage on pin ZPx1 (x=1,2,3,4) VZPx1

2.14 Voltage on pin IASGx

2.15 Voltage on pin IASGx

2.16 Voltage on pin IASGx

2.17 Lifetime

VSVCC5

VSVZ

VL

-0.6

-0.3

-1.0

-0.6

40

6.8

18

40

18

25

40

15

V

VK

VUBATT = VEVZ = 8V

VIASGx

tlt

t ≤ 15 min

t ≤ 400ms

years

2.18 Operating time on battey

Conditions:

Tj = 90 °C

Tj = 110 °C

Tj = 125 °C

Tj = 150 °C

top

10000 h

7000

4500

3000

General Conditions for operating range:

1

Increasing or decreasing the supply voltages VVZ1, VVZ2, VVZ3, VVZ4, VEVZ, VEVZ2,VUBATT,

VUBRL, VWDR, VVCC5 causes no incorrect firing of the squibs.

2

Loosing the connection to pin WDR or one of the squib driver supply voltages

VVZ1, VVZ2, VVZ3, or VVZ4, has no influence to the other squib driver function.

During jump start and load dump conditions the IC must be able to fire the squibs

Squib failures like shorts to ground or battery must not have an influence to other chip functions

Maximum difference voltage of the squib connections: +/- (VZPx1 - VZPx2) = 40V

3

4

5

Version B

May 05, 2001

page 31

Datasheet

TLE 6710

I. AC/DC Characteristics

AC/DC characteristics involve the spread of values guaranteed within the

specified supply voltage range and ambient temperature range.

Typical characteristics specify mean values expected over the production spread.

Currents into pins have positive values and vice-versa.

ATE tests will be performed with VEVZ=33V, VVZx=33V, unless otherwise specified under Test Condition.

Supply currents:

T = -40 to + 125°C, V

=0 to 18V, V

=0 to 18V

j

UBATT

UBRL

V

=6 to 33V, V =15 to 33V, V

=V

V

=4.8 to 5.2V

VZ1,2,3,4

EVZ

EVZ2 VZ1,2,3,4; VCC5

Limit Values

No.

Parameter

Symbol min. typ.

max. Unit

Test Condition

3.1 Supply current on pin UBATT

3.2 Quiescent current on pin VCC5 IVCC5

3.3 Current on pin VCC5

3.3A Current on pin VCC5

3.4 Operating current on pin EVZ

IUBATT

1.5

1

mA EVZ, VCC5 open

mA Regulators inactive

mA Regulators active,

no diagnostic

IVCC5

IEVZ

2

6

mA Regulators active,

diagnostic ON ¹⁾

mA drivers off

30V regulator off,

5V regulator off,

no diagnostic,

VEVZ2=open

3.4A Operating current on pin EVZ

IEVZ

6.5

15

mA drivers on, oscill. on

30V regulator on,

5V regulator on,

no diagnostic,

VEVZ2= VEVZ=30V ¹⁾

mA VEVZ2=30V, VEVZ=30V

VUBATT=18V,

3.5 Current on pin EVZ during

squib leakage measurement

VVCC5=4.8V,

VTVZ=2.2V; oscill. on

IRLM=1.5mA

3.6 Current on pin EVZ2

3.7 Current on pin EVZ2

3.8 Current on pin EVZ2

3.8A Current on pin EVZ2

IEVZ2

-3

-0.8

850

500

350

mA VEVZ2=0V, VEVZ=30V

drivers off

µA

VEVZ2=30V, VEVZ≥8V

VVCC5=4.8V,drivers off

VEVZ2=30V,VEVZ≥20V

all drivers on

VEVZ2=30V,VEVZ≥20V

squib drivers OFF ¹⁾

drivers off,

3.9 Quiescent currents on squib

driver supply pins VZ2 to 4

3.10 Quiescent current on squib

driver supply pin VZ1

IVZ2, IVZ3,

IVZ4

IVZ1

0

20

60

µA

V

measurement off

driver off,

measurement off

pin voltage

measurem. ON / OFF

drivers off, squibs off,

VEVZ=30V,

3.10 Additional current on pins

IVZ1

A

EVZ2, VZx, UBATT, UBRL

0

150

0.9

3.11 Voltage difference between pins VEVZ -

EVZ and EVZ2

VEVZ2

0.3

IEVZ2=-500µA

1)

Guaranteed by design

Version B

May 05, 2001

page 32

Datasheet

TLE 6710

AC/DC Characteristics (continued)

Logic Inputs and Outputs:

Inputs:

HSEN_EN12, LSEN_EN34, TXD, AWLEN, MOSI, CL, SSQ, ZKEN, RTP, MODE

RXD, AUSP, RESQ, MSS, ZKEN, LL, LH

Outputs:

T = -40 to + 125°C, V

=4.8 to 5.2V, V =15 to 33V

EVZ

j

VCC5

Limit Values

No.

Parameter

Symbol min. typ.

max. Unit

Test Condition

4.1 Input voltage - high level

4.2 Input voltage - low level

4.3 Input hysteresis

VIH

VIL

∆VI

2.4

V

mV

kΩ

0.8

200

48

20

16

4.4 Input pull-up resistance internal RIU

VVCC5 = 5 V,

VI = 0 V

to VCC5 on pins:

SSQ, TXD

VMODE = 0 V (MODE0)

LSEN_EN34

4.4A Input pull-up resistance internal RIU_MOSI

40

16

100 260

48

kΩ

VVCC5 = 5 V,

VI = 0 V

to VCC5 on pin: MOSI

4.5 Input pull-down resistor internal RID

VI = 5 V

to ground on pins:

HSEN_EN12, AWLEN, RTP,

MODE

VMODE = 5 V (MODE1)

LSEN_EN34

4.6 Output voltage - low level

VOL

IOH

0

0.4

-50

VVCC5 = 5 V,

VEVZ = 8 V,

IOUT = 1 mA

VVCC5 = 5 V,

VEVZ = 8 V,

VOUT= 0 V

VVCC5 = 5 V,

VEVZ = 8 V,

VOUT= 0 V

4.7 Output current - high level;

only pin ZKEN

-220

-440

2.8

µA

V

4.7A Output current - high level;

only pin RESQ

IOH

-100

4.8 Output voltage - high level;

except pins RESQ, ZKEN, LL,

LH

4.8A Output voltage - high level;

only pins LL and LH

4.11 Input voltage - high level for pin VIH

AW1CT

4.12 Input voltage - low level for pin

AW1CT

VOH

VVCC5

VVCC5 = 5 V,

IOUT = -200 µA

2.8

4.2

V

VVCC5 = 5 V,

IOUT = -100 µA

VIL

0.8

Version B

May 05, 2001

page 33

Datasheet

TLE 6710

AC/DC Characteristics (continued)

Low Battery Detection on pin UBATT (EVZ):

T = -40 to + 125°C, V

= 4,5 to 33 V

j

EVZ

Limit Values

No.

Parameter

Symbol min. typ. max. Unit

Test Condition

5.1 Threshold voltage on pin

UBATT reported to pin AUSP

5.2 Hysteresis

5.3 Threshold voltage on pin EVZ

to start the boost converter

V

4.10

4.60

V

VCC5

decreases

UBATT

1)

2)

V

> 4.7 V

∆V

130

250

4.5

mV

V

UBATT

V

increases

≥ 4.6 V

EVZ

UBATT

EVZ

1) Output AUSP is low active and follows the input UBATT.

The internal signal of AUSP enables the boost converter, so the regulator will not work,

if VUBATT is less than the value of Spec 5.1.

2) Not tested. Guaranteed by design. If VEVZ is less than the threshold value of Spec 5.3,

the converters will stop to operate

Oscillator for Boost (30V)-, Buck (5V)-Converter and Watchdog

T = -40 to + 125°C, V

= 8 to 33 V

j

EVZ

Limit Values

No.

Parameter

Symbol min. typ. max. Unit

Test Condition

6.1 Frequency

f

89

1)

103

kHz VUBATT = 12 V; CCOS =

OS

1 nF; RROS = 4.99 kΩ

6.2 Voltage on pin ROS

6.2A Current on pin ROS

6.3 Current on pin COS

V

I

1.176 1.2 1.224

V

µA

R

V

= 5 kΩ

≤ 0.5 V

= 5 kΩ

≤ 0.5 V

= 5 kΩ

≥ 1.9 V

= 5 kΩ

≥ 1.9 V

= 1 nF,

= 5 kΩ

ROS

-240

-140

2)

ROS

COS

I

COS

6.3A Current ratio of pin COS to pin

ROS

/ I

-7/12

+840

7/2

R

COS ROS

COS

ROS

V

COS

6.4 Current on pin COS

µA

V

R

V

ROS

COS

6.4A Current ratio of pin COS to pin

ROS

/ I

R

COS ROS

ROS

V

COS

6.5 Difference of sawtooth

thresholds (PSTV - VSTV)

∆V

1.2

C

R

COS

ROS

Application information: Oscillator starts running at VEVZ ≥ 4.5 V

1) Application Note: Formula for fos: fos = [1/(2 x CCOS x RROS) +/-5% ] + foffset

foffset depends on the layout of the application board. Correlation between reference Board and the real application

boards need to be performed with ‘golden devices TLE 6710’.

Recommendation for RROS: 4.87kΩ to 5.23kΩ nominal value+/- tolerance and +/- temperature depend.

Formula for fos Reference Board measurement: fos = fRESQ x 12800

2) IROS = VROS / RROS

Version B

May 05, 2001

page 34

Datasheet

TLE 6710

AC/DC Characteristics (continued)

Boost Converter (30V):

T = -40 to + 125°C, V

= 4.75 to 20 V, V

= 5 to 33 V

j

UBATT

EVZ

Limit Values

Symbol min. typ. max. Unit

No.

Parameter

Test Condition

VUBATT = 6 V;

7.1 Switching current limiting

7.2 Switching saturation voltage

I

650

950

mA

SVZ

VTVZ = 0 V;

VSVCC5 open;

VVCC5 open;

V

1

V

I

= 450 mA;

SVZ

V

= 6 V;

UBATT

= 0 V; V

≥ 18 V

TVZ

EVZ

VSVCC5 open;

V

I

open

VCC5

7.2A Switching on resistance

7.3 Max. switch duty cycle

Ron

2.2

90

Ω

= 450 mA;

SVZ-GNDC

SVZ

V

= 6 V;

UBATT

= 0 V; V

TVZ

EVZ

VSVCC5 open;

open

V

VCC5

D

85

%

I

≥ 10 mA;

SVZ

30max

V

EVZ

≥ 18 V;

7.4 Min. switch duty cycle

D

t

0

%

30min

7.5 Switch on time via pin COS

0.2

0.8

µs

I

= 300 mA;

SVZ

on30

V

= 6 V;

UBATT

= 0 V; V

≥ 18 V

TVZ

EVZ

= 2.0 to 0.5V;

COS

sample: 0.1xV

SVZmax

7.6 Switch on slope via pin COS

7.7 Switch off time via pin COS

s

-250

0.3

-50 V/µs see: 7.5

sample: 0.1xV

and 0.9xV

1)

on30

SVZmax

t

1.5

µs

I

= 300 mA;

SVZ

off30

V

= 6 V;

UBATT

= 0 V; V

≥ 18 V

TVZ

EVZ

= 0.5 to 2.0V;

COS

sample: 0.9xV

SVZmax

7.8 Switch off slope via pin COS

1) Not tested. Guaranteed by design.

s

100

280 V/µs see: 7.7

sample: 0.1xV

and 0.9xV

1)

off30

SVZmax

Version B

May 05, 2001

page 35

Datasheet

TLE 6710

AC/DC Characteristics (continued)

Boost Converter (30V): (continued)

T = -40 to + 125°C, V

UBATT

= 5.25 to 18 V, V

EVZ

= 5 to 33 V

j

Limit Values

No.

Parameter

Symbol min. typ. max. Unit

Test Condition

= 6 V;

7.9 Overcurrent switch off time

t

0.08

0.5

µs

V

UBATT

= 0 V; V

offCL30

≥ 18 V

EVZ

TVZ

R

= 1 Ω; V

= 12V;

load

sample: 0.9xV

SVZmax

7.10 Overvoltage on pin EVZ for

switch off the regulator

Error Amplifier

V

33.5

39.5

V

EVZ

1)

7.11 Input offset voltage

-40

34

40

70

2

mV

dB

∆V

EAVZ

7.12 DC open loop gain

7.12A Unity-Gain bandwidth

7.12B Gain at f = 100 kHz

A

OLVZ

f

1.3

18

MHz

dB

U

A

100

Reference

1), 2)

1), 2), 3)

=33.5 to 40V

7.13 Reference voltage

V

2.75 2.8 2.85

2.52 2.8 3.08

V

VR

7.14 Reference voltage

V

EVZ

7.15 Leakage current on pin TVZ

I

-2

1.5

=2.52 to 3.08V

µA

TVZ

SVZ Output

7.16

7.17

V

2.65 2.8

V

Switch on threshold via TVZ

Switch off threshold via TVZ

TVZ

6)

V

2.8 2.95

Application characteristics (see: Application Circuit)

7.A Output voltage range

V

16

30

V

= 2.8 V

EVZ

TVZ

(adjusted by an external

divider)

7.B Output voltage accuracy for

5)

a

0.95x

1.05x

regulator on at:

VTVZ = 2.65 V;

regulator off at:

VTVZ = 2.95 V

EVZ

one determined V

EVZ

TVZ-divider resistors.

via

V

EVZ

V

EVZ

7.C Output power

P

0.6

W

V

= 5.5 V;

EVZ

VCC5

SVCC5 open

1)

Error Amplifier characteristics of the packaged device cannot be measured, but are guaranteed by design. The reference voltage is measured

only on wafer.

2)

3)

5)

6)

Reference is supplied only via pin EVZ.

No uncontrolled reset on pin RESQ is allowed, due to higher supply voltage V

Accuracy of the external resistive TVZ-divider from EVZ to GNDB: 0%

.

EVZ

If the voltage on pin TVZ reaches 33V for a max. duration of 10 sec and returns to 2.8V (typ. value), the regulator must operate as specified.

Version B

May 05, 2001

page 36

Datasheet

TLE 6710

AC/DC Characteristics (continued)

Buck Converter (5V):

T = -40 to + 125°C, V

= 8 to 33 V, V

UBATT

= 5.25 to 18 V

j

EVZ

Limit Values

No.

Parameter

Symbol min. typ. max. Unit

I -600 -250 mA

SVCC5

Test Condition

8.1 Output current limit

8.2 Switch saturation voltage

V

-

3.9

3.5

1.5

V

I

= 18 V ≤ V

;

EVZ

EVZ2

EVZ

V

= 3 V;

TVZ

SVCC5

=-300mA; 47Ω to Gnd

SVCC5

SVZ open, VCC5<4.6 V

8.3 Switch saturation voltage

8.3A Switch saturation voltage

V

-

V

I

= 8.5 V ≤ V

;

EVZ

EVZ2

EVZ

= 3 V;

TVZ

SVCC5

= -30 mA;

SVCC5

SVZ open; VCC5<4.6 V

V

-

V

I

= 18 V;

= 26 V;

EVZ

EVZ2

SVCC5

= 3 V;

TVZ

=-300mA;

SVCC5

SVZ open, VCC5<4.6 V

= -300 mA;

8.4 Switch on time via pin COS t

0.2

0.8

µs

I

SVCC5

on5

V

TVZ

= 3 V;

V

≥ 18 V;

EVZ

= 0.5 to 2.0V;

COS

sample: 0.5xV

SWITCHmax

8.5 Switch on slope via pin

COS

s

40

100 V/µs see: 8.4

1)

on5

sample: 0.75xV

SWITCHmax

and 0.5xV

8.6 Switch off time via pin

KOM1

t

0.8

2.5

µs

I

= -300 mA;

SVCC5

off5

V

= 3 V;

TVZ

V

≥ 18 V; V = 4.7V

VCC5

EVZ

= 0 to 3V;

KOM1

sample: 0.5xV

SWITCHmax

8.7 Switch off slope via pin

KOM1

s

-700

-100 V/µs see: 8.6

sample: 0.75xV

1)

off5

SWITCHmax

and 0.5xV

SWITCHmax

1) Not tested. Guaranteed by design.

Version B

May 05, 2001

page 37

Datasheet

TLE 6710

AC/DC Characteristics (continued)

Buck Converter (5V): (continued)

T = -40 to + 125°C, V

EVZ

= 8 to 33 V

j

Limit Values

No.

Parameter

Symbol min. typ. max. Unit

Test Condition

8.8 Overcurrent switch off time t

0.05

0.8

µs

V

= 0V;

= 3V;

≥ 18 V;

= 47Ω;

VCC5

offCL5

TVZ

EVZ

R

load

sample: 0.5xV

SWITCHmax

8.9 Switch on time via pin TVZ

t

10

0.2

150

1

µs

I

= -300 mA;

SVCC5

onVZ5

V

≥ 18 V;

EVZ

TVZ

= 0 to 5 V;

sample: 0.5xV

SWITCHmax

8.10 Switch off time via pin TVZ t

I

V

= -300 mA;

SVCC5

EVZ

TVZ

offVZ5

≥ 18 V;

= 5 to 0 V;

sample: 0.5xV

SWITCHmax

= -300 mA;

≥ 18 V;

8.10A Switch off time due to an

overvoltage on pin VCC5

t

1.5

I

V

SVCC5

EVZ

TVZ

offVCC5

= 3V; V

= 4.8V to 6.1V;

= 0V;

KOM1

V

VCC5

sample: 0.5xV

V

SWITCHmax

≥ 2 V;

1)

8.10B Overvoltage switch off

threshold on pin VCC5

8.11 Switch on threshold

voltage via pin TVZ

V

5.3

6.1

V

KOM2

offVCC5

2)

1.51 1.70 1.85

0.1 0.2 0.3

(54..66%)

(4..11%)

TVZ

8.12 Switch off threshold

TVZ

voltage via pin TVZ

Error Amplifier

8.13 Input offset voltage

8.14 DC open loop gain

8.15 Unity-Gain bandwidth

8.16 Gain at f = 100 kHz

8.17 Output voltage LOW on

pin KOM2

1)

∆V

-10

60

2

+10

0.4

mV

dB

MHz

dB

EAVCC

1)

A

OLVCC

f

U

A

26

100

V

I

= 20 µA;

KOM2

V

I

= 3V

KOM1

8.18 Output voltage HIGH on

pin KOM2

V

2.5

V

= -500 µA;

= 0V

KOM2

V

KOM1

Reference see No. 7.13: Reference of the 30 V Step-up Regulator

SVCC5 Output

8.19 Switch on threshold via pin V

4.85 5.0

5.0 5.15

V

I

= 30mA

VCC5

SVCC5

VCC5

8.20 Switch off threshold via pin V

VCC5

SVCC5

VCC5

1)

2)

Not tested. Guaranteed by design.

The switching of the output transistor will ´be delayed by 10 to 150 us after reaching the threshold voltage.

Version B

May 05, 2001

page 38

Datasheet

TLE 6710

AC/DC Characteristics (continued)

Buck Converter (5V): (continued)

T = -40 to + 125°C, V

= 8 to 33 V

Application characteristics (see: Application Circuit)

j

EVZ

8.A Output voltage

V

4.85

5.15

V

I

= 30mA

VCC5 L

VCC5

T = 25°C

V

I

V

I

a

EVZ

= 30 V

8.B Output voltage

8.C Output voltage

8.D Output power

V

P

4.8

5.2

0.3

V

= 10 to 60 mA

≥ 18 V

= 10 to 33 mA

≥ 8.5 V

VCC5

VCC5L

EVZ

VCC5L

EVZ

V

W

I

....... is the symbol for the output current of the buck converter output.

VCC5L

P is the symbol for the output power of the buck converter output.

VCC5L

.......

Power On Reset of VCC5 & EVZ and Watchdog:

T = -40 to + 125°C, V

EVZ

= 8 to 33 V

j

Limit Values

Symbol min. typ. max. Unit

No.

Parameter

Test Condition

V = 8 to 40 V

EVZ

9.1 Power-on reset, RESQ = H

9.2 Power-down reset, RESQ = L

V

4.75

2.0

7

V

VCC5

EVZ

4.50

8.5

9.2A Power-down reset threshold level V

for RESQ high to low transition

VEVZ decreasing;

VVCC5 > 4.75V

9.3 Power down reset delay time

t

10

150

128

µs

V

decreases to

VCC5

4 V

rdel

9.4 Watchdog period (determined

by oscillator frequency divider)

9.5 Start of reset (after watchdog

time-out)

9.6 Reset duration (after watchdog

time-out)

T

t

128

100 V

f_OS

≥ 4.7 V

VCC5

WD

64

100 V

f_OS

≥ 4.7 V

sr

t

100 V

f_OS

rd

9.7 Trigger window duration

1

32

65

100 V

f_OS

100 V

f_OS

100 V

f_OS

100 V

f_OS

≥ 4.7 V

VCC5

twd

9.7A Trigger window duration without t

32

64

twdmax

ts

SPI triggering

9.8 Start of trigger window

t

9.9 Power-up reset extension

pu

Note: Reset threshold voltage is derivated from the reference for VCC5, so there is a linear function of the

absolute value of VCC5. Power down reset: A hysteresis is included by design, but will not be tested.

Logic functions and diagrams as defined in circuit description of chapter 'Watchdog'.

If the pin RTP is 'High' and pin AW1CT is grounded (test mode B), the units for tests No. 9.4 to 9.9

are 4/fos instead of 100/fos.

Version B

May 05, 2001

page 39

Datasheet

TLE 6710

AC/DC Characteristics (continued)

ISO 9141 - Serial Interface:

T = -40 to + 125°C, V

UBATT

= 8 to 18 V, V

EVZ

= 8 to 33 V, V ≥ 4.55V

VCC5

j

Limit Values

No.

Parameter

Symbol

min.

typ. max. Unit

Test Condition

10.1 Output voltage on pin K

10.2 Output voltage on pin K

10.3 L pin input threshold low

V

1.4

1

V

I = 30 mA

K

L

K

I = 30 mA at 25°C

K

0.13x

V =0V, V

K

LVCC=open

V

UBATT

10.4 L pin input threshold high

10.5 L pin hysteresis

10.6 L pin input threshold (logic

level) 'low level'

V

0.19x

UBATT

V

V =0V, V

K

L

V

1)

∆V

V

L

30

150

2

mV V =0V, V

K

V

L

V =0V, V

=V

K

LVCC VCC5

10.7 L pin input threshold (logic

level) 'high level'

V

L

3

V

V =0V, V

K

V

LVCC= VCC5

10.8 K pin input treshold low

(to pin RXD)

10.9 K pin input treshold high

(to pin RXD)

V

0.35x

UBATT

V

L = open

K

V

I

0.70x

UBATT

V

K

V

10.10 K pin input current

-12

12

µA

V

=0V;

UBATT

K

V =18V;

K

V

=0V; V

=0V

≤2V

EVZ

V =18V;

VCC5

10.10.A K pin input current

10.10.B K pin input current

10.11 K pin input current

10.12 K pin input current

10.12.A K pin input current

I

-12

12

µA

K

V

=0V; V

EVZ

V =18V;

K

V

=0V; V

=18V; V =0V;

TXD

UBATT

K

VTXD=VVCC5 or open

V = V

UBATT

- 1V;

K

VTXD=VVCC5 or open

= 0V or open;

V

VCC5

V =18V

K

1)

2)

10.12.B K pin input peak current

I

1

mA dV / dt ≤ 10 V/µs;

K

VTXD=VVCC5 or open

10.13 L pin input current

10.14 Short-circuit current

I

t

0

35

1

0.5

0.2

0.1

0.2

0.1

60

100

4

3

2

1

2

µA

V = 6 V; V =0V or open

L

K

Kr

Kf

RXDr

RXDf

K_RXDr

K_RXDf

L

K

mA max. 5 ms

10.15 Rise time delay TXD to K

10.16 Fall time delay TXD to K

10.17 Rise time delay L to RXD

10.18 Fall time delay L to RXD

10.19 Rise time delay K to RXD

10..20 Fall time delay K to RXD

µs

Sample point: 0.5 x V

Kmax

2)

Kmax

RXD

3)

RXD

1) Not tested. Guaranteed by design.

)

2

With 500 R external pull-up to battery and 10 nF to GND for test purposes only.

3) Not tested. Guaranteed by design. Pin L is not connected.

If the pin K operates within the maximum ratings (-1V to +40V), all other circuit blocks must work as defined

by the specification. This function is not tested, but it is guaranteed by design.

The allowed current into pin L is -0.3 to 2.0 mA. At IL = 1mA the voltage VL ≥ 7.0V

Version B

May 05, 2001

page 40

Datasheet

TLE 6710

AC/DC Characteristics (continued)

Alarm Warning Lamp Driver (AWL1):

T = -40 to + 125°C, V

EVZ

= 8 to 33 V

j

Limit Values

Symbol min. typ. max Unit

No.

Parameter

Test Condition

11.1 Output voltage

V

2

3.2

V

IAWL1 = 300mA 1)

EVZ

AWL1

V

= 0 V

11.2 Output voltage

11.3 AWL1 leakage current

V

I

0.6

150

V

µA

IAWL1 = 300mA 1), 4)

= 17.5 V, off;

AWL1 measurement on

V = 17.5 V, off;

AWL1

0

V

AWL1

11.4 AWL1 leakage current

I

50

µA

AWL1 measurement off

11.4 AWL1 reverse voltage

A

11.5 Output current limit static

11.6 Temperature limitation

(current will be reduced)

11.7 Temperature limitation

11.8 AWL1 Voltage to UZP output

voltage ratio

V

-0.2

650

V

IAWL1 = -100 µA

AWL1

VGNDA1 = 0 V

I

T

400

mA

°C

V

= 4 V

AWL1

150 170

AWL1 switch is on;

V

> 2 V

2)

AWL1

T

130

-5%

°C

AWL1

V

5

+5% V/V selection via SPI: UAWL1

AWL1

UZP

/

VAWL1≤VEVZ-6V

11.9 Current threshold for open load

detection

I

10

0

35

mA selection via SPI:

AWL1

IAWL1

detection on pin UZP

11.10 Voltage on pin UZP for open

load

V

0.4

V

selection via SPI for

lamp on and current

measurement

UZP

I

< 10 mA

AAWL1

11.11 Voltage on pin UZP for

standard load

V

1.5

-20

VVCC5

selection via SPI for

lamp on and current

measurement

UZP

I

> 30 mA

AWL1

11.12 Current on pin AW1CT

IAW1CT

0

µA

VAW1CT=0V and 5V,

VAWL1=12V 3)

1) If V

≥ 25 V, the warning lamp driver can not be switched on. This feature prevents a reduction of warning lamp lifetime.

AAWL

2) Limit values are guaranteed by design. The logic function is tested only on wafer.

In case of a short circuit from an external voltage source (=12V) to pin AWL1 and voltage on pin UBATT is 0V, the chip will be

warmed up to a temperature limitation value of approximately 150 °C. Proposal: Continuous operation with temperature limitation is not

recommended.

If a start up of the voltage on pin UBATT (4.5 to 18V) occurs immediately, following functions have to operate:

a. Bandgap-Reference, Oscillator, Boost- and Buck-Converter;

b. Generation of signal RESQ to 'high';

c. SPI command transfer for

1. trigger;

2. measurement of chip temperature

4. switch OFF lamp 1

3. measurement of AWL1 voltage;

3) Pin AW1CT could be connected to VCC5 or be open for default ON operation. For default OFF operation pin AW1CT has to be shorted;

the maximum value of the external short circuit resistor to ground is 10kΩ.

•

No active clamping circuitry is included in the device.

During start up the AWL1 lamp driver is ON if AW1CT is left open. It can be switched off if all three conditions are applied:

1. RESQ = 'HIGH'; 2. AWLEN = 'HIGH'; 3. SPI: SAWL1D

•

During start up the AWL1 lamp driver is OFF if AW1CT is connected to ground. It can be switched on if all following conditions

occur: 1. RESQ = 'HIGH'; 2. AWLEN = 'HIGH'; 3. SPI: SAWL1D

AWL1 lamp driver can be switched on/off by the SPI-command SAWL1B/SAWL1D (lamp 'bright' /'dark' ) according to the

state of AW1CT.

4) At the maximum voltage of 0.6V and a current of 300mA the maximum ON-resistance is Rds(on)max = 2Ω.

Version B

May 05, 2001

page 41

Datasheet

TLE 6710

AC/DC Characteristics (continued)

Alarm Warning Lamp and Multifunction Driver 2 (AWL2):

T = -40 to + 125°C, V

EVZ

= 8 to 33 V

j

Limit Values

No.

12.1 Output Voltage

(used as low side switch)

12.2 Drain Source

Saturation Voltage

Parameter

Symbol min. typ. max Unit

Test Condition

VAWL2S = 0 V 2)

IAWL2 = 200mA

V

0.6

1.0

V

AWL2D

V

VEVZ > VAWL2D + 6 V

IAWL2 = 200mA

DS

(used as high side switch)

VDS = VAWL2D - VAWL2S

12.3 AWL2 leakage current

I

0

20

VAWL2 = 17.5 V

lamp off,

µA

AWL2

AWL2 measurement off

12.4 AWL2 leakage current

I

150

VAWL2D = 17.5 V

VAWL2S = 0 V

lamp off,

AWL2 measurement on

12.4 AWL2 reverse voltage

A

V

I

-0.2

V

IAWL2D = -100 µA

AWL2

VAWL2S = 0 V

12.5 Output current limit static

250 400 600

mA

°C

VDS ≥ 3V

AWL2

12.6 Over-Temperature shut down

T

150

190

AWL2 power-switch

AWL2

turns off;

SPI: MTEMP (9XXX)H

T = 25°C 1)

1)

12.7 Voltage on pin UZP after over-

temperature shut down

V

1.45

5

V

UZP

12.8

V

-5%

+5% V/V selection via SPI:

UAWL2D

AWL2D Voltage to UZP output

voltage ratio

AWL2D

/

UZP

VAWL2D≤VEVZ-6V

12.9

V

5

+5% V/V selection via SPI:

UAWL2S

AWL2S Voltage to UZP output

voltage ratio

AWL2S

UZP

VAWL2S≤VEVZ-6V

1) Limit values are guaranteed by design. Logic function is tested only on wafer.

Activating 'Average Chip Temperature' measurement, the typical temperature coefficient of the

voltage on pin UZP after over temperature shut down is -4mV/K

No active clamping circuitry is included in the device.

If the AWL2 lamp driver is used as a high side switch to drive an inductive load, an external

free-wheeling diode in parallel with the load must be used.

AWL2 lamp driver only can be switched on by the SPI-command SAWL2B (lamp 'bright' or on)

AWL2 lamp driver only can be switched off by the SPI-command SAWL2D (lamp 'dark' or off)

2) At the maximum voltage of 0.6V and a current of 200mA the maximum ON-resistance is:

Rds(on)max = 3Ω.

Version B

May 05, 2001

page 42

Datasheet

TLE 6710

AC/DC Characteristics (continued)

Voltage-/ Current-Sources (V/I):

T = -40 to + 125°C, V

= 4.8 to 5.2 V, V = 18 to 33 V; x=1,2,3,4

j

VCC5

EVZ

Limit Values

No.

Parameter

Symbol min.

typ.

max. Unit

Test Condition

13.1 Operating current on pin IASGx I

-20

-80

-1

-25

mA

t

V

t

V

R

I

≤5 ms

IASGx

on

13.2 Current limitation on pin IASGx

13.2A Current limitation on pin IASGx

I

≤5 ms, VISENS = 0V,

IASGx

= 0V

IASGx

-32

-24

mA

V

≤5 ms, RISENS=2kΩ

IASGx

on

= 0V

IASGx

13.3 Output voltage 1 on pin IASGx

V

-7%

-5%

2.8

2.2

10

+3%

≤ 100kΩ

IASGx

= -1 to -20 mA

= -0.5 mA

IASGx

I

IASGx

2)

SPI: (2XXX)H

R

I

13.4 Difference of output voltage 2

(5V) and output voltage 1

(2.8V) on pin IASGx

∆V

+5%

V

≤ 100kΩ

IASGx

= -1 to -20 mA

= -0.5 mA

IASGx

2)

SPI: (BXXX)H

13.6 Current ratio accuracy

IISENS / IIASG

I

-5%

0%

7%

15%

I

= -1 mA to -20mA

= -0.5 mA to -1mA

1), 2)

IASG

IASGx/

ISENS

I

IASG

13.7 Voltage on pin ISENS

for IASG-current limit

13.8 Voltage on pin ISENS

V

I

Vvcc5

+0.6

Vvcc5

+0.8

2

V

R

V

≤20 kΩ,

= 0V

ISENS

IASGx

R

V

ISENS

ISENS open,

=0V

IASGx

2)

13.9 ISENS offset current

13.9A ISENS offset current

13.9B ISENS offset current

-2

µA VISENS=0V,

ISENS

measurement inactive

2)

I

2

µA VISENS=VVCC5 - 0.3V,

measurement inactive

µA pin IASGx open,

VISENS=0V,

2)

measurement active

SPI: SELx

VISENS=0.4V to Vvcc5- 0.3V

13.10 Voltage ratio VUZP / VISENS

VUZP /

VISENS

-5%

1.0

+5%

50

13.11 Settling time on pin UZP for

one measurement

tUZP

µs Starting with SPI

command, ending at

90% of the final value

on pin UZP

13.12 IASGx leakage current

I

-2

2

µA

V

IASGx

IASGx=0V and 5V; 2)

measurement inactive

I

1) Current ratio accuracy calculation:

Current ratio calculation:

a

ISENS = (10× ^ISENS−1)×100%

I

IASGx

I

IASGx

1000

=

I

ISENS

100+ a^ISENS

2) After characterization guaranteed by design.

If the pin IASGx is open or shorted to ground, no latch-up or oscillation may occur (RISENS ≤ 20kΩ).

Version B

May 05, 2001

page 43

Datasheet

TLE 6710

AC/DC Characteristics (continued)

Squib Driver: Highside:^A)

T = -40 to + 150°C, V

=6 to 33V, V

=8.5 to 33V, VEVZ2 ≥ VVZx + 6V V

=4.8 to 5.2V

j

VZ1,2,3,4

EVZ

,

VCC5

Limit Values

No.

Parameter

Symbol

min. typ. max.

Unit

Test Condition

14.1 Saturation voltage of switch

x=1,2,3,4

VVZx-ZPx1

1.75 2.0

V

VEVZ = VEVZ2 = 21V, 1)

VVZx=12V, -IZPx1=1.75A

14.2 Output current limitation of

switch x=1,2,3,4

IZPx1

-3.5

24

-2.25

27

A

V

VEVZ = VEVZ2 = 21V,

VVZx - ZPx1 ≥4V

IZPx1= value of Spec.

15.3 and 15.4

14.2 Clamping voltage on pin Zpx1

VZPx1

A

during firing (x=1,2,3,4)

2)

14.3 Switch off time delay of switch

x=1,2,3,4

14.4 Switch on time delay of switch

x=1,2,3,4

toff

ton

0.1

1

5

µsec Rload= 2.2Ω

20

µsec VEVZ = VEVZ2 = 33V,

RZPx1 to +18V = 2.2Ω,

VVZx = 33V (I=0.23A)

Trigger VZPx1=18.5V

µsec VEVZ = VEVZ2 = 33V,

RZPx1 to +18V = 2.2Ω,

VVZx = 33V (I=2A)

14.5 Switch on time delay of switch

x=1,2,3,4

ton

T

1

35

Trigger VZPx1=22.4V

14.6 Over temperature limitation

A)

180

300

°C

not tested

2)

The limits are valid for a switch on duration of 4ms and a firing on- / off- timing characteristics

as descript in chapter 'Absolute Maximum Ratings'.

From one squib output ZPx1 a short to ground or a connection to the automotive

supply voltage VBAT has no influence to other squib drivers, and vice versa.

The maximum saturation voltage VVZx - VZPx1 = 2.6 V is guaranteed by design.

The test conditions are VEVZ = VEVZ2 = 15 V, VVZx = 12V, -IZPx1 = 1.75 A

1)

2)

Guaranteed by design

Squib Driver: Lowside:^A)

T = -40 to + 150°C, V

=6 to 33V, V

=8.5 to 33V, VEVZ2 ≥ VVZx + 6V V

=4.8 to 5.2V

j

VZ1,2,3,4

EVZ

,

VCC5

Limit Values

No.

Parameter

Symbol

min. typ. max.

Unit

Test Condition

15.1 Saturation voltage of switch

x=1,2,3,4

VZPx2

1.65 1.85

V

VEVZ = VEVZ2 = 21V,

IZPx2 = 1.75A

2)

15.2 Driver current detection of

switch x (x=1 to LL, x=2 to LH)

15.3 Output current limitation of

switch x=1,2

15.4 Output current limitation of

switch x= 3,4

IZPx2det

IZPx2lim

1.75 2.0 2.25

A

VZPx2 ≥4V

3)

IZPx2det

+0.25

IZPx2de

+0.75

VZPx2 ≥4V

IZPx2det

+0.25

IZPx2de

+0.75

VZPx2 ≥4V

A)

The limits are valid for a switch on duration of 4ms and a firing on- / off- timing characteristics as descript in

chapter 'Absolute Maximum Ratings'. From one squib output ZPx1 a short to ground or a connection to the

automotive supply voltage VBAT has no influence to other squib drivers, and vice versa.

The hysteresis of the driver current detection is typically 50 mA.

2)

3)

The value of the current limitation is always greater than the value of the current detection.

Version B

May 05, 2001

page 44

Datasheet

TLE 6710

AC/DC Characteristics (continued)

Squib Driver: Lowside (continued):

T = -40 to + 150°C, V

=6 to 33V, V =8.5 to 33V V =4.8 to 5.2V

, VCC5

j

VZ1,2,3,4

EVZ

Limit Values

min. typ. max.

No.

15.4 Switch off time delay of switch

x=1,2,3,4

Parameter

Symbol

Unit

Test Condition

toff

0.1

5

µsec Rload= 2.2Ω

A

15.5 Switch on time delay of switch

x=1,2,3,4

ton

3

20

µsec Rload = 2.2Ω,

Vload = 12V (I=0.23A)

Trigger VZPx2=11.5V

µsec Rload= 2.2Ω,

15.6 Switch on time delay of switch

x=1,2,3,4

ton

T

5

35

Vload= 12V (I=2A)

Trigger VZPx2=7.6V

15.7 Over temperature limitation

180

300

°C

not tested, guaranteed by

design

Outputs LL and LH for Firing

Current Detection:

15.8 Voltage on pin LL

15.9 Voltage on pin LH

15.10 Response time to LL or LH if

the squib current will be

interrupted

VLL

VLH

tLL, tLH

0.8

3

V

IZP12>1.75A

IZP22>1.75A

1

1/fOS IZP12>1.75A to pin LL

IZP22>1.75A to pin LH

fOS = frequency of the

oscillator

15.11 Delay time to LL or LH if the

firing current exceeds the value

of Spec.No. 15.2

tLLon, tLHoff

10

40

µs

Rsquib = 2.2Ω

Vload = 8V

to = signal SSQ from

low to high

Note: The timing measurements of No. 14.3, 14.4, 14.5, 15.4A, 15.5 and 15.6 will be started either with the rising edge

of SSQ or a transition of HSEN_EN12 / LSEN_EN34 and stopped by the voltage transition (50%) on ZPx1 or ZPx2.

Squib Driver: Highside and Lowside:

T = -40 to + 150°C, V

=6 to 33V, V

=8.5 to 33V V =4.8 to 5.2V

, VCC5

j

VZ1,2,3,4

EVZ

Limit Values

min. typ. max.

3.0

No.

Parameter

Symbol

Unit

Test Condition

15.13 Total sum of saturation

voltages of high and lowside

switches x=1,2,3,4

VVZx -VZPx1 +

VZPx2

V

see test conditions

for specification 14.1

and 15.1

IZPx = 1.75A ²⁾

of No.: 14.1 and 15.1

15.14 Total absorbed energy of one

high side switch

WHS

WLS

120

140

mJ

starting

temperature: ≤ 85°C

Squib firing on / off

timing see: Max. Rat.

and No. 1.31 ¹⁾

starting

temperature: ≤ 85°C

15.15 Total absorbed energy of one

low side switch

Squib firing on / off

timing see: Max. Rat.

and No. 1.31 ¹⁾

1)

2)

WHS = IZPx1 x (VVZx - VZPx1) x ton

On-Resistance of high and low side switches together:

WLS = IZPx2 x VZPx2 x ton

Ron [T=Tabs] = 1.71Ω x {1 - 3.65 E-3 x (150°C - Tabs)}

Tabs ... temperature in °C

ATE-testing for 14.1, 15.1 and 15.13 will be performed at maximum 125°C, however with guard bands.

Version B

May 05, 2001

page 45

Datasheet

TLE 6710

AC/DC Characteristics (continued)

Squib Resistance Measurement:

T = -40 to + 125°C, V

=15 to 33V, V =4.8 to 5.2V

j

EVZ

VCC5

Limit Values

min. typ. max. Unit

No.

Parameter

Symbol

Test Condition

Basic reference current:

16.1 Basic current on pin IMESS

5)

IMESS

-6.2

-4.8

mA SPI: (4XXX)H

RROS=5.0kΩ ± 0.1%

Measurement current

reference input WDR:

16.2 Operating voltage range on pin VZPx1

0

VEVZ-

6

V

IWDR = 55mA

SPI: (6XXX)H

Zpx1, if the switch between pin

WDR and pin Zpx1 is closed

3)

16.3 On resistance between pin

RWDR-ZPx1

8

30

40

Ω

IWDR = 40mA

SPI: (6XXX)H

IWDR = 5mA

VEVZ = 30V,

VZPx1 = 25V,

SPI: (6XXX)H

WDR and pin ZPx1

3)

16.3A On resistance between pin

WDR and pin ZPx1

RWDR-ZPx1

10

16.4 Current on pin WDR

IWDR

60.0

200

mA squib resistance <3Ω

16.4A Short circuit current on pin

60

mA VWDR = VEVZ = 30V,

WDR

VZPx1 = 0V

Measurement current

output IMESS:

16.5 Linear voltage range for

VIMESS

0

VVCC5

V

IWDR ≤ 55mA,

measurement on pin IMESS

SPI: (6XXX)H

16.5A Clamping voltage on pin

IMESS

VVCC5

+ 0.6

RIMESS ≥

VVCC5 / 60mA

4)

16.6 Leakage current on pin IMESS IIMESS

(measurement inactive)

-10.0

-0.2

0

µA

VZPx2 =33V

(x=1,2,3,4)

16.7 Current difference of the basic ∆I1

0.2

%

SPI: (4XXX)H,

VIMESS = 4.8V,

IZPx2 = 0 and 55mA

4)

1)

reference current on pin

IMESS between IZPx2 (x=1,2,3,4)

and -IIMESS

16.8 Current difference of the basic ∆IIMESS

0

60

µA 1. SPI: (4XXX)H,

2. SPI: (6XXX)H with

pin WDR = open and

squibs connected

reference current on pin

IMESS between IWDR and -

IIMESS (measurement of

channel 1 to 4 active)

VIMESS = 4.8V

4)

16.9 Current difference of the basic ∆I2

-0.2

0.2

%

SPI: (6XXX)H

4)

2)

reference current on pin

VIMESS = 4.8V,

IMESS between IWDR and -

IIMESS (measurement of

channel 1 to 4 active)

IWDR = 0 and 55mA,

squibs connected

(I^IMESS2- I^IMESS1) - 55mA

1)

I

1

=

x 100

(IIMESS2: at IZPx2=55mA, IIMESS1: at IZPx2=0mA)

55mA

After characterization the values will be guaranteed by design.

(I^IMESS2- I^IMESS1) - 55mA

55mA

2)

3)

2

(IIMESS2: at IWDR=55mA, IIMESS1: at IWDR=0mA)

After characterization the values will be guaranteed by design.

Typical temperature dependence of the ON-resistance: Ron 125 °C = 2.5 x Ron -40 °C

4) Garanteed by design.

5)

IIMESS = (VROS / RROS) x 275 / 12 (± 8 %)

VROS specified under No. 6.2

Version B

May 05, 2001

page 46

Datasheet

TLE 6710

AC/DC Characteristics (continued)

Squib Resistance Measurement: (continued)

T = -40 to + 125°C, V

=15 to 33V, V

=4.8 to 5.2V, x=1,2,3,4

Limit Values

min. typ. max.

j

EVZ

VCC5

No.

Parameter

Symbol

Unit

Test Condition

UZP Voltage Output for

Resistance Measurement:

16.10 Voltage on pin UZP

(measurement active)

VUZP

IUZP

0.0

VVCC5

+ 0.6

0.93 x

VVCC5

0.95 x

VVCC5

30

-1.0

80

V

16.10 Voltage on pin UZP

0.85 x

VVCC5

0.85x

VVCC5

0.0

-3.0

30

VZPx1 = VZPx2

A

(gain = 10 amplifier active)

16.10 Voltage on pin UZP

(gain = 30 amplifier active)

V

B

16.11 Voltage on pin UZP

(measurement inactive)

16.12 Current on pin UZP

(measurement active)

16.13 internal pull down resistor on

pin UZP

mV

mA

kΩ

VZPx1-VZPx2 = 0V

VUZP = 0V

VUZP = 3V

RUZP

(measurement inactive)

), ), )

1 2

0

Measurement amplifier

(gain = 10)

16.14 Voltage gain

a₁₀

9.90

45

10.30

VZPX1-VZPX2=400mV

VCM = VZPX2 ± 0.4V,

the value of VZPX2 is

the actual

measurement result

of No. 16.21

16.18 Common mode rejection ratio

CMRR₁₀

dB

VCM = VZPX2 ± 0.4V,

the value of VZPX2 is

the actual

measurement result

3)

of No. 16.21

), ), )

1 2

0

Measurement amplifier

(gain = 30)

16.19 Voltage gain

a₃₀

29.0

50

32.0

VZPX1-VZPX2=140mV

VCM = VZPX2 ± 0.4V,

the value of VZPX2 is

the actual

measurement result

of No. 16.21

16.20 Common mode rejection ratio

CMRR₃₀

dB

VCM = VZPX2 ± 0.4V,

the value of VZPX2 is

the actual

measurement result

3)

of No. 16.21

)

0

The 'Gain-10-Amplifier' measurements will be done between pin UZP (as an output)

and pins ZPx1 , ZPx2 (as differential inputs).

1)

2)

3)

From one squib output ZP11 / ZP12 (or ZP21 / ZP22, ZP31 / ZP32, ZP41 / ZP42) a short to

ground or a connection to the automotive supply voltage VBAT has no influence to the other

squib resistance measurement function and vice-versa.

A squib difference voltage > 0.4 V has no influence to the other squib resistance measurement function

and vice-versa. In this case the output voltage on pin UZP will be set to values as specified under

No. 16.10.

CMRR = 20 x log(ax x ∆VZPx2 / ∆VUZP)

Version B

May 05, 2001

page 47

Datasheet

TLE 6710

AC/DC Characteristics (continued)

Squib Resistance Measurement: (continued)

T = -40 to + 125°C, V

=15 to 33V, V

=4.8 to 5.2V, x=1,2,3,4

Limit Values

min. typ. max.

j

EVZ

VCC5

No.

Parameter

Pins ZP12, ZP22,ZP32, ZP42

voltage regulator

Symbol

Unit

Test Condition

16.21 Regulated voltage on pins

ZPx2

VZPx2

7.5

8.5

V

VIMESS = 4.8V

IIMESS = -5.0mA to -60mA

16.22 Voltage difference of the

regulated voltage on pins ZPx2

1. SPI: (4XXX)H;

2. SPI: (6XXX)H

with IWDR = 55mA,

squibs connected,

VIMESS = 4.8V

∆VZPx2

100

-65

mV

mA

16.23 Current limit on pin IMESS

IIMESS

-220

VZPx2 =40V,

RIMESS = 0Ω

activated by SPI

ton < 5ms

Settling Time

16.24 Total settling time on pin UZP

tUZP

5

200

µs

IIMESS = -5.0 to -60mA

for 90% of the final

value on pin UZP

no capacitance on

pins ZPx

initial VZPx to 0...33V

Pin IMESS Voltage

1)

Measurement Amplifier

(gain = 2)

16.25 Voltage gain

a₂

1.90

1.95

2.25

2.05

20

VIMESS = 340mV to

1V

16.25 Voltage gain

A

a₂

VIMESS = 1V to 2.5V

2)

16.26 Input offset voltage

Vos

mV

1)

2)

The 'Gain-2-Amplifier’ measurements will be done between pin UZP (as an output)

and pin IMESS (as input).

Will be guaranteed by design after characterization. ( Vos = VUZP/2 - VIMESS )

Version B

May 05, 2001

page 48

Datasheet

TLE 6710

AC/DC Characteristics (continued)

Squib Leakage Measurement:

T = -40 to + 125°C, V

=15 to 33V, V

=4.8 to 5.2V; V

=5.25V to 20 V, (¾ x V

)+2.5V ≤ V

EVZ

j

EVZ

VCC5

UBRL

Limit Values

No.

Parameter

Symbol

min. typ. max.

Unit

Test Condition

Outputs LL and LH for

Leakage Measurement:

17.1 Voltage on pin LL

VLL

VLH

0.8

V

leakage to ground

VZPx1 < 1 / 4 x VUBRL

VZPx1 is decreasing

17.2 Voltage on pin LH

leakage to battey

VZPx1 > 3 / 4 x VUBRL

VZPx1 is increasing

Reference output RLM:

17.3 Output voltage on pin RLM

VRLM

0.31x

VUBRL

0.35 x

VUBRL

V

RRLM = 2k to 20kΩ,

IRLM=-0.2 to -3.5mA

17.4 Output current on pin RLM

during measurement

IRLM

-3.5

0

mA stable state

17.5 Dynamic output voltage

on pin RLM

VRLM

0.2 x

VUBRL

0.46x

VUBRL

V

RRLM = 220Ω

VUBRL = 6V

17.6 Dynamic output current

capability on pin RLM

IRLM

-6.0

mA

RRLM = 220Ω

VUBRL = 6V

17.7 Current ratio of pin RLM to pin

ZPx1

17.8 Current ratio of pin RLM to pins

ZPx1

17.9 Resistance ratio of resistor on

pin RLM to leakage resistance

IRLM/IZPx1

RRLM/Rleak

0.9

1.1

stable state,

IRLM = -3.5mA

0.75

1.25

dynamic state,

IRLM = -6mA

4/3

Leakage detection voltages:

17.10 Leakage low threshold voltage

VZPx1

∆VZPx1

-5%

1/4

x

5%

V

leakage to ground

VZPx1 is decreasing

target: VLL = 'low'

leakage to battery

VZPx1 is increasing

target: VLH = 'low'

VUBRL

17.11 Leakage high threshold voltage

17.12 Leakage detection hysteresis

3/4

x

VUBRL

-20% 1/48 20%

leakage to ground or

leakage to battery

x

VUBRL

Reference input UBRL:

17.13 Internal resistor at pin UBRL

Settling time

17.14 Total settling time on pins

LL or LH

RUBRL

35

150

50

kΩ

VUBRL < 24V

tLL

tLH

µs

IRLM = -0.5 mA

no capacitance on

pins ZPx1 and ZPx2

initialise:

VZPx2 = 0 to 33V

17.15 LL output response after Squib Low tdLL

30

µs

no external leakage

Side Switch activation via LSEN

17.16 LH output response after Squib High tdLH

no external leakage

Side Switch activation via HSEN

Note: The pin RLM is protected against a short circuit to ground during leakage measurement

(ton ≤ 400ms). In this case the minimum expected current IRLM ≥ -100mA and IZPx1 ≤ 100mA.

Version B

May 05, 2001

page 49

Datasheet

TLE 6710

AC/DC Characteristics (continued)

Internal Dummy Squib Resistance:

T = -40 to + 125°C; V

=15 to 33V

j

EVZ

Limit Values

No.

Parameter

Squib outputs:

Symbol

min. typ. max.

Unit

Test Condition

18.1 Leakage current of switch

x=1,2,3,4

IZPx

-20.0

10

20.0

50

µA

switch off;

ZPx1=ZPx2

VVZx=33V

VZPx=16,5V

switch off;

ZPx1=ZPx2

VVZx=33V

VZPx=0V

no firing or measure

VZPx1-VZPx2 = 20V,

VZPx1-VZPx2 ≤ VEVZ

18.1 Leakage current of switch

IZPx

µA

A

x=1,2,3,4

18.2 Internal dummy resistor from

ZPx1 to ZPx2 (x=1,2,3,4)

RZPx1-ZPx2

kΩ

Supply Voltage Measurements:

T = -40 to + 125°C, V

=4.8 to 5.2V; V

=6 to 33V, V

=V

=15 to 33V, V

=V

=6 to 18 V

j

VCC5

VZ1,2,3,4

EVZ EVZ2

UBATT UBRL

Limit Values

No.

Parameter

Symbol

min.

typ.

max. Unit

Test Condition

UZP Voltage Output for Supply

Voltage Measurements:

19.1 Voltage on pin UZP

(measurement inactive)

19.2 Voltage on pin UZP

(measurement active)

VUZP

0.0

0

30

mV

VVCC5

+0.6

V

19.3 UBATT Voltage to UZP output VUBATT/VUZP -5%

voltage ratio

5

8

5%

selection via SPI:

MUB1

VUBATT ≤ VEVZ-6V

19.4 UBRL Voltage to UZP output

voltage ratio

VUBRL/VUZP

VEVZ / VUZP

VEVZ2 / VUZP

VVZx / VUZP

-5%

selection via SPI:

MUB2

VUBRL ≤ VEVZ-6V

selection via SPI:

MEVZ1

VEVZ ≥ +6V

selection via SPI:

MEVZ2

VEVZ2 ≥ +6V

selection via SPI:

MVZx

19.5 EVZ Voltage to UZP output

voltage ratio

19.6 EVZ2 Voltage to UZP output

voltage ratio

19.7 VZx Voltage to UZP output

voltage ratio (x=1,2,3,4)

VVZx ≥ +6V

19.8 Total settling time on pin UZP

tUZPM

200

+7%

5%

µs

V

for 90% of the final

value on pin UZP

selection via SPI:

REF; (AAAA)H

selection via SPI:

MZPx

VZPx1 ≤ VEVZ-6V

19.9 Reference Voltage on UZP pin VUZP

-7%

-5%

2.8

5

19.10 ZPx1 Voltage to UZP output

voltage ratio

VZPx1/VUZP

Version B

May 05, 2001

page 50

Datasheet

TLE 6710

AC/DC Characteristics (continued)

Detection of Safing Sensor Closure:

T = -40 to + 125°C, V

=4.8 to 5.2V;

j

VCC5

=V

V

=6 to 40V, V

=15 to 40V, V

=V

=6 to 18 V

VZ1

EVZ EVZ2

UBATT UBRL

Limit Values

typ. max. Unit Test Condition

No.

Parameter

Symbol

min.

20.1 Threshold voltage on pin ISS for VISS

the choice between LS - and HS -

detection

V

+ 0.6

V

+ 1.2

V

VCC5

+ 1.8

V

VMSS='low',

VISS decreases,

VVZ1≥VISS-0.3V

VEVZ≥5V

VCC5

High Side Detection:

20.2 Threshold voltage of difference

between pins ISS and VZ1

VISS-VVZ1

0.3

2.0

10

0.4

2.3

0.6

2.5

V

VMSS='low',

VISS-VVZ1

increases

20.3 Threshold voltage of difference

between pins ISS and VZ1 in

case of firing

VISS-VVZ1

20.4 Hysteresis of difference between ∆(VISS -

150

mV

V

pins ISS and VZ1

Low Side Detection:

VVZ1)

0)

20.4A Threshold voltage on pin ISS

VISS

V

/2

V

/2

V

/2

VMSS='high',

VISS decreases

VCC5

- 0.1

VCC5

+ 0.1

20.4B Time limit for VISS < threshold for tISSMIN

time prolonguation on pin MSS

0.5

1

100

f_OS

100

f_OS

100

f_OS

2)

20.4C VMSS time prolonguation (starting tSUM

from VISS exceeding threshold)

97

97.5

20.4D Time limit for a valid retrigger for tRTRIG

VISS > threshold

0.5

Current source from pin VZ1 to

ground:

20.5 Current on pin VZ1

IVZ1

1.2

1)

6

mA RROS=5kΩ

selection via

SPI: SMSSH

20.6 Current on pin ISS

20.7 Current on pin ISS

IISS

50

200

µA NO firing

µA Firing active

0)

Guaranteed by design.

V

ROS

1)

2)

I_VZ1min,max15

1 0.6

R_ROS

Accelerated testing can be performed by the test mode C, described in the chapter

‘Watchdog Operation and Generation of the Squib Driver Enable Signal ZKEN’.

If the pin RTP is set to VVCC5 + 2 x Vdiode, the units for 20.4B, 20.4C, 20.4 D are 4/fos instead of 100/fos.

Version B

May 05, 2001

page 51

Datasheet

TLE 6710

AC/DC Characteristics (continued)

Average Chip Temperature Measurement:

T = -40 to + 150°C, V

=15 to 33V, V =4.8 to 5.2V

VCC5

j

EVZ

Limit Values

No.

Parameter

Symbol

min. typ. max.

Unit

Test Condition

T = 25 °C;

21.1

VUZP

2.7

1)

3.1

V

Voltage on pin UZP

RROS=5kΩ,

SPI: MTMP

(9XXX)H

21.2

1)

dVUZP/dT

-7.5

-6.0 mV/K SPI: MTMP

(9XXX)H

Temperature coefficient of the

voltage on pin UZP

Calculation of the voltage on pin UZP at T = 25 °C depending on the value of the resistor on pin ROS:

5 k

VUZP 2.9V + 4

26mV ln

( 7%)

RROS

Version B

May 05, 2001

page 52

Datasheet

TLE 6710

J. Serial Peripheral Interface (SPI)

J.1: SPI Timing Characteristics:

T = -40 to + 125°C, V

=4.8 to 5.2V;

VCC5

j

Limit Values

No.

Parameter

Symbol

tlead

min. typ. max.

Unit

ns

22.1

40

100

25

SSQ Lead Time

SSQ Lag Time

22.2

22.3

ns

tlag

tf

ns

Fall Time for SSQ, CL, MOSI

Rise Time for SSQ, CL, MOSI

MOSI Data Setup Time

MOSI Data Hold Time

MOSI Data Valid Time

Clock frequency

22.4

25

ns

tr

22.5

40

ns

tSU

th

22.6

40

ns

22.10

22.12

120

ns

tv

2)

0

4

MHz

fCL

Note :

2)

All timing is shown with respect to 20% and 70% of VVCC5.

Parameter No.: 22.10 is necessary, if 68HC11 is used.

TLE 6710 function is independent of this parameter.

SPI Timing

Version B

May 05, 2001

page 53

Datasheet

TLE 6710

J.2: SPI Commands:

J.2.1: General Information on SPI Command Structure:

The TLE 6710 hardware can be configured as MODE0- or MODE1. With a ‘low’ or ‘open’ on pin MODE, after start up

the system works in the MODE0-default mode and decodes SPI instruction commands. A MODE1 operation requires

an initializing SPI ‘Mode command’ (FExx)H and a ‘high’ on pin MODE before starting with SPI instructions like

diagnostic, control or firing commands. If the software and hardware settings for the mode definition do not fit together,

then the transmission of all SPI-commands will be prevented.

All functions e.g. 'Firing' or 'Measurement' are controlled by a 16 bit instruction command. The 16 bit word consists of

two bytes (8 bit) and will be decoded by the decoder logic circuit of the TLE 6710 and latched for some functions.

After a Watchdog activated 'reset' all internal control registers and decoded signals are reset to its inactive default

value.

Byte A: FUNCTION - BYTE

Byte B: SELECTION - BYTE

a7

a6

a5

a4

a3

a2

a1

a0

b7

b6

b5

b4

b3

b2

b1

b0

MSB

LSB MSB

LSB

Function Byte:

a0:

indicates valid control command

a1..a3 control bits

a4..a7 SPI command bits

Selection Byte

b0..b1 channel select

b2..b3 function select, firing and test commands

b4..b6 switch or measurement select

b7

not used except firing and test commands

in case of firing command: b0..b7 selects the squib driver transistors, all

combinations are allowed.

If RESQ=0 is generated, then the SPI-control register is reset to its inactive default value. All commands will be

interrupted.

Default states:

1. MODE0 (pin MODE = 0 or open)

2. all squib drivers off,

3. all measurements off

4. Lamp Driver 1(AWL1) depends on AW1CT.

See table in the description ‘Alarm Warning Lamp Driver (AWL1)

5. Lamp Driver 2 (AWL2) is off

6. Watchdog Trigger signal is low,

7. Safing Sensor Closure Detection: Current source to ground = 0mA

J.2.2: Summary of SPI Commands:

Version B

May 05, 2001

page 54

Datasheet

TLE 6710

Code

(hex)

0000

Name

Short Description

NOMEAS

CTRL

Deactivate all measurements, no change of latched status via

control command (J.2.9)

0xxx

1xxx

2xxx

Control Commands for Lamps, Watchdog and Safing Sensor

Detection (only if used as a stand alone command!!)

Supply Voltage and Lamp Measurement Command,

Squib Leakage Measurement with squib switches in OFF state

V/I-Sources Command; Set IASGx (x=1,2,3,4) voltage source to

low voltage: 2.8 V

MSUPL

VIM28

3xxx

4xxx

5555

6xxx

MFSUP

RES5

OSC

Firing Voltage Measurement Command

Resistance measurement 'reference current' active (5mA)

100kHz Test Mode Command

Resistance measurement 'main current' active (defined on WDR

Pin) and 'reference current' active (5mA)

RES40

7xxx

RES5H

Resistance measurement with 'activated high side-switch and

'reference current' active (5mA)

8xxx

9xxx

AAAA

Bxxx

FIRE

MTEMP

REF

Firing Command

Temperature measurement

2.8V Reference Test Mode Command

V/I-Sources Command; Set IASGx (x=1,2,3,4) voltage source to

high voltage: 5.0 V

VIM5

Cxxx

MSQL

Squib Leakage Measurement Command

with one of eight squib switches in ON state

This command could be reserved for future purposes

not used

Dxxx

Exxx

FExx

MODE3

RESET

Latch Command for the MODE1. First command after start up. Pin

MODE must be ‘high’ during transmission

Reset by SPI Command. Deactivate all measurements. Reset all

latched control commands (J.2.9) to it’s default state. Does not

change the MODE1 to MODE0!

FFFF

J.2.3: Firing Commands: (8XXX)H

Byte A: FUNCTION - BYTE

Byte B: SELECTION - BYTE

a7

a6

a5

a4

a3

a2

a1

a0

b7

b6

b5

b4

b3

b2

b1

b0

MSB

LSB MSB

LSB

x

1/0 1/0 1/0 1/0 1/0 1/0 1/0 1/0

1

0

b7 = 1: High-Side-Switch of squib 4 active

b6 = 1: High-Side-Switch of squib 3 active

b5 = 1: High-Side-Switch of squib 2 active

b4 = 1: High-Side-Switch of squib 1 active

b3 = 1: Low-Side-Switch of squib 4 active

b2 = 1: Low-Side-Switch of squib 3 active

b1 = 1: Low-Side-Switch of squib 2 active

b0 = 1: Low-Side-Switch of squib 1 active

Also more than one switch can be activated, all combinations may be allowed.

Hardware requirements depending on MODE0- or MODE1

Mode

MODE ZKEN ZKEN_int HSEN_EN12 LSEN_EN34 Function

MODE0

MODE1

0

1

0

1

0

1

(8xxx)H: firing of HSx and / or LSx

(8xxx)H: firing of squib 1 and 2

(8xxx)H: firing of squib 3 and 4

(8xxx)H: firing of squibs 1 to 4

For MODE1 operation an initializing SPI ‘Mode command’ needs to be sent once after start up. If RESQ = 0 is

generated, then the measurement will be interrupted and the ASIC will return to it’s default state of the MODE0. A soft

reset (FFFF)H does not change the mode.

Version B

May 05, 2001

page 55

Datasheet

TLE 6710

J.2.4: Squib Resistance Measurement-, Squib Voltage Measurement-

and IMESS-pin Voltage Measurement Commands:

Resistance measurement

(4XXX) ^H

'reference current' active (5.5 mA)

Byte A: FUNCTION - BYTE

Byte B: SELECTION - BYTE

a7

a6

a5

a4

a3

a2

a1

a0

b7

b6

b5

b4

b3

b2

b1

b0

MSB

LSB MSB

LSB

x

X

x

0/1 0/1

0

1

0

0/1 0/1

Resistance measurement

(6XXX) ^H

'main current' active (defined on pin WDR) and

'reference current' active (5.5 mA)

Byte A: FUNCTION - BYTE

Byte B: SELECTION - BYTE

a7

a6

a5

a4

a3

a2

a1

a0

b7

b6

b5

b4

b3

b2

b1

b0

MSB

LSB MSB

LSB

x

0/1 0/1

0

1

0

0/1 0/1

Resistance measurement

(7XXX)^H

'activated high side-switch’ (current defined on pin VZx) and

'reference current' active (5.5 mA)

Byte A: FUNCTION - BYTE

Byte B: SELECTION - BYTE

a7

a6

a5

a4

a3

a2

a1

a0

b7

b6

b5

b4

b3

b2

b1

b0

MSB

LSB MSB

LSB

x

0/1 0/1

0

1

0/1 0/1

b0..b1 : Channel select

b1

0

b0 channel select

0

1

0

1

Channel 1

Channel 2

Channel 3

Channel 4

0

1

b2..b3 : Selection of the functions on pin UZP

b3

b2 additional functions select

0

1

0

1

0

1

Gain 10 Amplifier to UZP

Gain 30 Amplifier to UZP

Gain 2 Amplifier to UZP

Squib Voltage to UZP

[-∆VUZP / ∆(VZPx1 - VZPx2) = 10]

[-∆VUZP / ∆(VZPx1 - VZPx2) = 30]

[∆VUZP / ∆VIMESS = 2]

(x=1,2,3,4)

[VZPx1 = 5 x VUZP]

(x=1,2,3,4)

Version B

May 05, 2001

page 56

Datasheet

TLE 6710

Hardware requirements depending on MODE0 - or MODE1

Mode

MODE ZKEN ZKEN_int HSEN_EN12 LSEN_EN34 Function

MODE0

MODE1

0

1

x

1

x

1

0

x

1

0

(4xxx)H: reference current

(6xxx)H: reference + WDR main current

(7xxx)H: reference + HSx main current

(4xxx)H: reference current

(6xxx)H: reference + WDR main current

(7xxx)H: reference + HSx main current

For MODE1 operation an initializing SPI ‘Mode command’ needs to be sent once after start up. If RESQ = 0 is

generated, then the measurement will be interrupted and the ASIC will return to it’s default state of the MODE0. A soft

reset (FFFF)H does not change the mode.

J.2.5: Firing Voltage Measurement Commands:

(3XXX)^H

Byte A: FUNCTION - BYTE

Byte B: SELECTION - BYTE

a7

a6

a5

a4

a3

a2

a1

a0

b7

b6

b5

b4

b3

b2

b1

b0

MSB

LSB MSB

LSB

x

1/0 1/0

0

1

b0..b1 : channel select

b1

0

b0 channel select

0

1

0

1

Firing voltage VZ1 measurement channel 1 active

Firing voltage VZ2 measurement channel 2 active

Firing voltage VZ3 measurement channel 3 active

Firing voltage VZ4 measurement channel 4 active

0

1

Version B

May 05, 2001

page 57

Datasheet

TLE 6710

J.2.6: Squib Leakage Measurement Commands with one of eight squib switches in ON-state:

(CXXX)^H

Byte A: FUNCTION - BYTE

Byte B: SELECTION - BYTE

a7

a6

a5

a4

a3

a2

a1

a0

b7

b6

b5

b4

b3

b2

b1

b0

MSB

LSB MSB

LSB

x

1/0 1/0 1/0

x

1/0 1/0

1

0

b0..b1 : channel select

b1

0

b0 channel select

0

1

0

1

Leakage measurement channel 1 active

Leakage measurement channel 2 active

Leakage measurement channel 3 active

Leakage measurement channel 4 active

0

1

b4..b6 : HS-/ LS-switch selection

b6

0

b5

0

b4 HS-/ LS-switch selection

0

1

0

1

0

1

0

1

Low-Side-Switch of squib 1 ON

Low-Side-Switch of squib 2 ON

Low-Side-Switch of squib 3 ON

Low-Side-Switch of squib 4 ON

High-Side-Switch of squib 1 ON

High-Side-Switch of squib 2 ON

High-Side-Switch of squib 3 ON

High-Side-Switch of squib 4 ON

0

1

0

1

0

1

0

1

Hardware requirements depending on MODE0 - or MODE1

Mode

MODE ZKEN ZKEN_int HSEN_EN12 LSEN_EN34 Function

MODE0

MODE1

0

1

x

1

x

0

x

0

(Cxxx)H: measurement with HSx on

(Cxxx)H: measurement with LSx on

(Cxxx)H: measurement with HSx on

(Cxxx)H: measurement with LSx on

For MODE1 operation an initializing SPI ‘Mode command’ needs to be sent once after start up. If RESQ = 0 is

generated, then the measurement will be interrupted and the ASIC will return to it’s default state of the MODE0. A soft

reset (FFFF)H does not change the mode.

Version B

May 05, 2001

page 58

Datasheet

TLE 6710

J.2.7: Voltage-/ Current-Sources (V/I) Commands:

V/I-Sources Command; Set IASGx (x=1,2,3,4) voltage source to low voltage: 2.8 V (2XXX)H

Byte A: FUNCTION - BYTE

Byte B: SELECTION - BYTE

a7

a6

a5

a4

a3

a2

a1

a0

b7

b6

b5

b4

b3

b2

b1

b0

MSB

LSB MSB

LSB

x

1/0 1/0

0

1

0

V/I-Sources Command; Set IASGx (x=1,2,3,4) voltage source to high voltage: 5.0 V (BXXX)H

Byte A: FUNCTION - BYTE

Byte B: SELECTION - BYTE

a7

a6

a5

a4

a3

a2

a1

a0

b7

b6

b5

b4

b3

b2

b1

b0

MSB

LSB MSB

LSB

x

1/0 1/0

1

0

1

b0..b1 : source select

b1

0

b0 source select

0

1

0

1

IASG1 voltage source active

IASG2 voltage source active

IASG3 voltage source active

IASG4 voltage source active

0

1

Version B

May 05, 2001

page 59

Datasheet

TLE 6710

J.2.8: Supply Voltage-, Lamp-Measurement and Squib Leakage Measurement with squib switches in OFF-state

Commands: (1XXX)^H

Byte A: FUNCTION - BYTE

Byte B: SELECTION - BYTE

a7

a6

a5

a4

a3

a2

a1

a0

b7

b6

b5

b4

b3

b2

b1

b0

MSB

LSB MSB

LSB

x

1/0 1/0 1/0

x

1/0 1/0 1/0

0

1

b0..b1 : channel select

b2 : Leakage Measurement active or inactive

b2

1

b1

0

b0 channel select

0

1

0

1

x

Leakage measurement channel 1 active

1

0

Leakage measurement channel 2 active

Leakage measurement channel 3 active

Leakage measurement channel 4 active

Leakage measurement INACTIVE

1

0

x

b4..b6 : select measurement channel

Name

UEVZ

b6

0

b5

0

b4 select voltage measurement

0

1

0

1

0

1

0

1

EVZ voltage measurement active

EVZ2 voltage measurement active

UBATT voltage measurement active

UBRL voltage measurement active

AWL1 voltage measurement active

AWL1 current measurement active

AWL2D voltage measurement active

AWL2S voltage measurement active

UEVZ2

UUBATT

UUBRL

UAWL1

IAWL1

0

1

0

1

0

1

0

UAWL2D

UAWL2S

1

Version B

May 05, 2001

page 60

Datasheet

TLE 6710

J.2.9: Control Commands for Lamps, Watchdog and Safing Sensor Detection:

(0XXX)H : If used as a stand alone command

Byte A: FUNCTION - BYTE

Byte B: SELECTION - BYTE

a7

MSB

a6

a5

a4

a3

a2

a1

a0

LSB MSB

1/0

b7

b6

b5

b4

b3

b2

b1

b0

LSB

x

1/0 1/0 1/0

x

0

(XXXX)H, except (5XXX)H and (FXXX)H: If used during transmission of other commands

Byte A: FUNCTION - BYTE

Byte B: SELECTION - BYTE

a7

MSB

x

a6

a5

a4

a3

a2

a1

a0

LSB MSB

1/0

b7

b6

b5

b4

b3

b2

b1

b0

LSB

x

1/0 1/0 1/0

x

a0:

if its value is 0: no valid control command is transmitted

if its value is 1: a valid control command is transmitted,

bit a1..a3 will act as stated in the following table;

a1,a2 selects actions; a3 defines on/off state

Name

a3

0

a2

0

a1

0

Function

SAWL1B

SAWL2D

WDTRL

SMSSL

Lamp Driver 1 (AWL1) = ON (AW1CT is open)

Lamp Driver 2 (AWL2) = OFF

(default)

0

1

0

1

0

Watchdog Trigger = 0 (LOW)

0

1

Safing Sensor Closure Detection: Current = 0mA

Lamp Driver 1 (AWL1) = OFF (AW1CT is open)

Lamp Driver 2 (AWL2) = ON

SAWL1D

SAWL2B

WDTRH

SMSSH

1

0

1

0

1

0

Watchdog Trigger = 1 (HIGH)

1

Safing Sensor Closure Detection: Current ≥ 1.2 mA

If RESQ=0 is generated, then the SPI-control register is reset to its inactive default value:

Lamp Driver 1(AWL1) is activated if AW1CT is open,

Lamp Driver 2 (AWL2) is deactivated,

Watchdog Trigger signal is low,

Safing Sensor Closure Detection: Current source to ground = 0mA

The Control Commands can be transmitted alone as a 16bit word [command (0XXX)^H] or in combination with other

commands [command (XXXX)H ]. The Control Command is latched and active till reprogramming via SPI.

Version B

May 05, 2001

page 61

Datasheet

TLE 6710

J.2.10: Oscillator Frequency Test Mode Command: (5555)H

If RESQ=0 is generated, then the test mode is interrupted and the SPI-decoder is reset.

After activating the 'Oscillator Frequency Test Mode' the internal generated oscillator frequency is reported to the pin

LL and LH. The signal shape is the inverted curve of the FOSC signal in the description of ‘Oscillator for...’.

Byte A: FUNCTION - BYTE

Byte B: SELECTION - BYTE

a7

a6

a5

a4

a3

a2

a1

a0

b7

b6

b5

b4

b3

b2

b1

b0

MSB

LSB MSB

LSB

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

J.2.11: 2.8V Reference Test Mode Command: (AAAA)H

If RESQ=0 is generated, then the test mode is interrupted and the SPI-decoder is reset.

After activating the '2.8 V Reference Test Mode' the internal generated voltage reference is reported to the pin UZP.

Byte A: FUNCTION - BYTE

Byte B: SELECTION - BYTE

a7

a6

a5

a4

a3

a2

a1

a0

b7

b6

b5

b4

b3

b2

b1

b0

MSB

LSB MSB

LSB

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

J.2.12: Reset by SPI Command: (FFFF)H

By applying this command, the SPI-decoder is reset to its default state. Measurements will be interrupted. Latched

control commands (J.2.9) return to it’s default value. If the system works in the MODE1, then this command will not

change the state of MODE1 operation. This command has no effect on the RESQ pin.

Byte A: FUNCTION - BYTE

Byte B: SELECTION - BYTE

a7

a6

a5

a4

a3

a2

a1

a0

b7

b6

b5

b4

b3

b2

b1

b0

MSB

LSB MSB

LSB

1

Version B

May 05, 2001

page 62

Datasheet

TLE 6710

J.2.13: Average Chip Temperature Test Mode Command: (9XXX)H

If RESQ=0 is generated, then the test mode is interrupted and the SPI-decoder is reset to its default state. After

activating the 'Average Chip Temperature Test Mode' an internal generated temperature stable reference current

(approx. 40 µA) supplies four serial connected bipolar diodes, which are distributed on the chip surface. The

temperature dependent voltage drop (approx. -7mV/K) is reported to the pin UZP.

The voltage on pin UZP will be divided by two and it’s temperature dependence will be reduced to approximately

-3.5mV/K, if the Alarm Warning Lamp Driver AWL2 goes into the over temperature shut down. Then the signal on pin

UZP can be interpreted as a digital information of an AWL2 over temperature shut down. A SAWL2D command to

switch off the lamp AWL2 after temperature decreasing returns the ASIC to the ‘Average Chip Temperature Test

Mode’.

Byte A: FUNCTION - BYTE

Byte B: SELECTION - BYTE

a7

MSB

a6

a5

a4

a3

a2

a1

a0

b7

b6

b5

b4

b3

b2

b1

b0

LSB

x

LSB MSB

x

1

0

1

Version B

May 05, 2001

page 63

Datasheet

TLE 6710

Application Notes

1. It is recommended that a RC snubber is connected directly to pin SVZ to reduce ringing due to

Boost converter switching.

2. If pins ZPx1 and ZPx2 are connected to inductive loads/wiring then it may be necessary to add

protection devices to reduce negative transients caused by external shorts to ground during

deployment.

3. IASGx pins connected to loads with chassis ground reference may require protection against

negative voltage offsets.

4. An open/disconnected M1 pin cannot be detected with a Leakage Measurement which turns

on the LS driver of channel 1, i.e. C000 Hex. Instead a cross coupled Leakage Measurement

must be performed. That is, look for leakage on channel 2 while activating the LS driver of

channel 1, i.e. C001 Hex.

5. Due to the low VZx leakage currents a longer delay time or external discharge resistor is

necessary t detect an open VZx pin with a voltage measurement via UZP.

6. When AWL2 is configured as a low side driver it is necessary to add an external discharge

resistor to detect an open load with the driver off.

7. It is recommended that a low ESR capacitor is used for the VCC5 output of the Buck converter

to reduce ripple.

8. A series diode connection is required for the VZx pins to prevent reverse current flow through

the high side driver transistor body diode charging up the deployment caps due to external

short to battery.

9. It is recommended that a MOV is connected to the battery line of the airbag module to prevent

violations of the maximum ratings. The MOV is not required in case of an existing central load

dump protection.

10.If the UBRL pin voltage is protected against negative voltages by an external blocking diode,

the series resistor to UBRL is not required.

Version B

May 05, 2001

page 64

Datasheet

TLE 6710

Edition 05.2001

Published by Infineon Technologies AG i. Gr.,

Bereichs Kommunikation, St.-Martin-Strasse 53

D-81541 München

Attention please!

The information herein is given to describe certain

components and shall not be considered as

warranted characteristics.

Terms of delivery and rights to technical change

reserved.

We hereby disclaim any and all warranties,

including but not limited to warranties of non-

infringement, regarding circuits, descriptions and

charts stated herein.

Infineon Technologiesis an approved CECC

manufacturer.

Information

For further information on technology, delivery

terms and conditions and prices please contact

your nearest Infineon Technologies Office in

Germany

or

our

Infineon

Technologies

Representatives worldwide (see address list).

Warnings

Due to technical requirements components may

contain dangerous substances. For information on

the types in question please contact your nearest

Infineon Technologies Office.

Infineon Technologies Components may only be

used in life-support devices or systems with the

express written approval of Infineon Technologies,

if a failure of such components can reasonably be

expected to cause the failure of that life-support

device or system, or to affect the safety or

effectiveness of that device or system. Life support

devices or systems are intended to be implanted in

the human body, or to support and/or maintain and

sustain and/or protect human life. If they fail, it is

reasonable to assume that the health of the user or

other persons may be endangered.

Version B

May 05, 2001

page 65


型号：	TLE6710Q
厂家：	Infineon
描述：	Power Management Circuit,
文件：	总66页 (文件大小：1367K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TLE6710Q [INFINEON]

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