TLE9561QX [INFINEON]
The device is designed for various motor control automotive applications. To support these applications, the device provides the main functions, such as a 5 V lowdropout voltage regulator one HS-CAN transceiver supporting CAN FD, four half-bridges for DC motor control, and one 32 bit serial peripheral interface (SPI). The device includes diagnostic and supervision features, such as drain-source monitoring and open-load detection, short circuit protection, configurable time-out and window watchdog, fail-safe output, as well as overtemperature protection.;
| 型号： | TLE9561QX |
| 厂家： | 
Infineon |
| 描述： | The device is designed for various motor control automotive applications. To support these applications, the device provides the main functions, such as a 5 V lowdropout voltage regulator one HS-CAN transceiver supporting CAN FD, four half-bridges for DC motor control, and one 32 bit serial peripheral interface (SPI). The device includes diagnostic and supervision features, such as drain-source monitoring and open-load detection, short circuit protection, configurable time-out and window watchdog, fail-safe output, as well as overtemperature protection. |
| 文件： | 总237页 (文件大小：6902K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TLE9561QX
DC Motor System IC
1
Overview
Features
•
•
•
Low-drop voltage regulator 5 V, 250 mA for main supply
Four half-bridge gate drivers for external N-channel MOSFETs
Adaptive MOSFET gate control:
–
–
–
Regulation of the MOSFET switching time
Reduced switching losses in PWM mode
High efficient constant gate charge
•
•
Control of reverse battery protection MOSFET
High-speed CAN transceiver supporting CAN FD communication up to 5 Mbit/s according to ISO11898-
2:2016
•
•
•
•
Fail Outputs for fail-safe signalization
Configurable wake-up sources
Four high-side outputs 7 Ω typ.
Four PWM inputs
–
–
–
High-side and low-side PWM capable
Active free-wheeling
Up to 25 kHz PWM frequency
•
•
•
•
•
•
•
•
•
32 bit serial peripheral interface (SPI) with cyclic redundancy check (CRC)
Very low quiescent current consumption in Stop Mode and Sleep Mode
Periodic cyclic sense and cyclic wake in Normal Mode, Stop Mode and Sleep Mode
Reset and interrupt output
Drain-source monitoring and open-load detection
Configurable time-out and window watchdog
Overtemperature and short circuit protection features
Leadless power package with support of optical lead tip inspection
Green Product (RoHS compliant)
Datasheet
www.infineon.com
Rev. 1.0
2021-01-21
1
TLE9561QX
DC Motor System IC
Overview
Potential applications
•
•
•
•
•
•
•
Door module
Power lift gate
Power sliding doors
Seat control module
Seatbelt pretension
Steering column lock
Sunroof module
Product validation
Qualified for automotive applications. Product validation according to AEC-Q100.
Description
The TLE9561QX is a multifunctional system IC with integrated power supply, communication interfaces,
multiple half-bridges and support features in an exposed pad PG-VQFN-48 power package. The device is
designed for various motor control automotive applications.
To support these applications, the DC Motor System IC provides the main functions, such as a 5 V low-dropout
voltage regulator one HS-CAN transceiver supporting CAN FD, four half-bridges for DC motor control, and one
32 bit serial peripheral interface (SPI).
The device includes diagnostic and supervision features, such as drain-source monitoring and open-load
detection, short circuit protection, configurable time-out and window watchdog, fail-safe output, as well as
overtemperature protection.
Type
Package
Marking
TLE9561QX
PG-VQFN-48
TLE9561QX
Datasheet
2
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
Table of Contents
1
2
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Hints for not functional pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1
3.2
3.3
4
General Product Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Functional Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.1
4.2
4.3
4.4
5
5.1
5.2
5.3
System Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Short State Machine Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Device Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Block Description of State Machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
State Machine Modes Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Init Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Normal Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Sleep Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Restart Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Fail-Safe Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Software Development Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Transition Between States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Transition into Init Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Init Mode -> Normal Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Normal Mode -> Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Normal Mode -> Sleep Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Stop Mode -> Normal Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Sleep Mode -> Restart Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Restart Mode -> Normal Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Fail-Safe Mode -> Restart Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Reaction on Detected Faults . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Stay in Current State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Transition into Restart Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Transition into Fail-Safe Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Wake Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Cyclic Sense . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Configuration and Operation of Cyclic Sense . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Cyclic Sense in Low-power Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Cyclic Wake . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Internal Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
VS Supply Multiplexing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
5.4
5.4.1
5.4.2
5.4.3
5.4.4
5.4.5
5.4.6
5.4.7
5.5
5.5.1
5.5.2
5.5.3
5.5.4
5.5.5
5.5.6
5.5.7
5.5.8
5.6
5.6.1
5.6.2
5.6.3
5.7
5.7.1
5.7.1.1
5.7.1.2
5.7.2
5.7.3
5.8
6
Voltage Regulator 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
6.1
Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Datasheet
3
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
6.2
6.3
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
7
7.1
7.2
7.2.1
7.2.2
7.2.3
7.2.4
7.2.5
7.3
High-Side Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Under Voltage Switch Off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Over Voltage Switch Off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Over Current Detection and Switch Off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Open Load Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
PWM, Timer and SYNC Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
8
8.1
8.2
High Speed CAN Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
CAN OFF Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
CAN Normal Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
CAN Receive Only Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
CAN Wake Capable Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
CAN Bus termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
TXD Time-out Feature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Bus Dominant Clamping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Undervoltage Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
8.2.1
8.2.2
8.2.3
8.2.4
8.2.5
8.2.6
8.2.7
8.2.8
8.3
9
9.1
9.2
9.2.1
9.2.2
9.2.3
9.2.4
9.2.5
9.3
High-Voltage Wake Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
High-Voltage Wake Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Wake Input Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Wake configuration for Cyclic Sense . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Wake configuration for Synchronization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Fail Safe Output Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
10
10.1
10.2
Interrupt Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Block and Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
11
11.1
11.2
Gate Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
MOSFET control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Static activation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Static activation of a high-side MOSFET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Static activation of a low-side MOSFET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Turn-off of the high-side and low-side MOSFETs of a half-bridge . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
PWM operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Determination of the active and freewheeling MOSFET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Configurations in PWM mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
PWM mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
PWM operation with adaptive gate control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
11.2.1
11.2.2
11.2.3
11.3
11.3.1
11.3.2
11.3.3
11.3.4
Datasheet
4
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
11.3.4.1
11.3.4.2
11.3.4.3
11.3.4.4
11.3.4.5
11.3.4.6
11.3.5
11.3.5.1
11.3.5.2
11.3.6
11.3.7
11.3.8
11.4
High-side PWM with adaptive gate control, motor operating as load . . . . . . . . . . . . . . . . . . . . . . 85
Low-side PWM with adaptive gate control, motor operating as load . . . . . . . . . . . . . . . . . . . . . . 95
High-side PWM with adaptive gate control, motor operating as generator . . . . . . . . . . . . . . . . . 95
Low-side PWM with adaptive gate control, motor operating as generator . . . . . . . . . . . . . . . . . 97
Status bits for regulation of turn-on and turn-off delay times . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
Time modulation of pre-charge and pre-discharge times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
PWM operation without adaptive gate control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
AGC[1:0]=00B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
AGC[1:0]=01B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Gate driver current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
PWM operation at high and low duty cycles with active freewheeling . . . . . . . . . . . . . . . . . . . . . . 108
Measurements of the switching times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
Passive discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
Slam mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
Parking braking mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
Charge pump . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
Frequency modulation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
Electrical characteristics gate driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
11.5
11.6
11.7
11.8
11.9
12
12.1
Supervision Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
Reset Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
Reset Output Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
Soft Reset Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
Watchdog Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
Time-Out Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
Window Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
Watchdog Setting Check Sum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
Watchdog during Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
Watchdog Start in Stop Mode due to Bus Wake . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
VSINT Power On Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
VSINT Under- and Overvoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
VSINT Undervoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
VSINT Overvoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
VS Under- and Overvoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
VS Undervoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
VS Overvoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
VSHS Under- Overvoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
VSHS Undervoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
VSHS Overvoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
VCC1 Over-/ Undervoltage and Undervoltage Prewarning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
VCC1 Undervoltage and Undervoltage Prewarning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
VCC1 Overvoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134
VCC1 Short Circuit Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134
VCAN Undervoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134
Thermal Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
Individual Thermal Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
Temperature Prewarning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
Thermal Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
12.1.1
12.1.2
12.2
12.2.1
12.2.2
12.2.3
12.2.4
12.2.5
12.3
12.4
12.4.1
12.4.2
12.5
12.5.1
12.5.2
12.6
12.6.1
12.6.2
12.7
12.7.1
12.7.2
12.8
12.9
12.10
12.10.1
12.10.2
12.10.3
Datasheet
5
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
12.11
Bridge driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137
12.11.1
12.11.1.1
12.11.1.2
12.11.1.3
12.11.1.4
12.11.1.5
12.11.2
12.11.3
12.12
Bridge driver supervision with activated charge pump . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137
Drain-source voltage monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137
Cross-current protection and drain-source overvoltage blank time . . . . . . . . . . . . . . . . . . . . . . 138
OFF-state diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139
Charge pump undervoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
Switching parameters of MOSFETs in PWM mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
Low-side drain-source voltage monitoring during braking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
VS or VSINT Overvoltage braking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
13
13.1
13.2
13.3
Serial Peripheral Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148
SPI Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148
Failure Signalization in the SPI Data Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149
SPI Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
CRC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152
SPI Bit Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154
Register Banking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155
SPI control registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157
Device Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159
Control registers bridge driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179
SPI status information registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199
Device Status Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201
Status registers bridge driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213
Family and product information register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 228
13.3.1
13.4
13.4.1
13.5
13.5.1
13.5.2
13.6
13.6.1
13.6.2
13.6.3
13.7
14
Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 230
Application Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 230
ESD Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233
ESD according to IEC61000-4-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233
ESD according to SAE J2962 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233
Thermal Behavior of Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 234
Further Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 234
14.1
14.2
14.2.1
14.2.2
14.3
14.4
15
16
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 235
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 236
Datasheet
6
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
Block Diagram
2
Block Diagram
VSINT
VCC1
VCC1
VSHS
VS
CP
VS
MUX(VSINT,VS)
VCC1
SDI
CP
CPC1N
CPC1P
CPC2N
CPC2P
Charge pump
Control Logic
SDO
SPI
CLK
CSN
VCC1
state machine
watchdog
Reset
RSTN
CP
VS
Interrupt
INTN/TEST
GH1
SH1
GH2
SH2
VSHS
Interrupt
Generation
HSS output
HSS output
HS1
HS2
GH3
SH3
GH4
SH4
Gate
Drivers
HSS output
HSS output
HS3
HS4
Reset
Generation
GL1
GL2
GL3
GL4
Wake Logic
Fail Safe
MUX(VSINT,VS)
SL
MUX(VSINT,VS)
Wake-up input
WK1
Wake-up input /
Fail Out
WK2/FO
WK3
PWM1/CRC
PWM2
Wake-up input
Wake-up input
PWM
inputs
PWM3
WK4/SYNC
WK5
PWM4
Wake-up inputs
VCAN
TXDCAN
RXDCAN
CANL
CANH
CAN
GND
(Transceiver GND, Pin 16)
(Analog/dig. GND, Pin 6)
GND
MUX(VSINT,VS): multiplexed VSINT & VS
Figure 1
Block Diagram
Datasheet
7
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
Pin Configuration
3
Pin Configuration
3.1
Pin Assignment
SH4 37
24 SH2
GH4 38
WK1 39
23 GH2
22 WK2/FO
21 GL1
GL3 40
GL4 41
20 GL2
19 SL
TLE9561
WK4/SYNC 42
HS1 43
18 WK3
17 WK5
16 GND
15 CANL
14 CANH
13 VCAN
PG-VQFN-48
HS2 44
HS3 45
HS4 46
VSHS 47
VSINT 48
Figure 2
Pin Configuration
3.2
Pin Definitions and Functions
Pin
1
Symbol
Function
VCC1
Voltage Regulator. Output voltage 1
2
RSTN
Reset Output. Active LOW, internally passive pull-up with open-drain output
3
INTN/TEST
Interrupt Output. Active LOW output, push-pull structure
TEST. Connect to GND (via pull-down) to activate Software Development Mode
4
5
6
7
SDO
SDI
SPI Data Output to Microcontroller (=MISO). Push-pull structure
SPI Data Input from Microcontroller (=MOSI). Internal pull-down
Ground. Analog/digital ground
GND
CLK
SPI Clock Input. Internal passive pull-down
Datasheet
8
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
Pin Configuration
Pin
8
Symbol
CSN
Function
SPI Chip Select Not input. Internal passive pull-up
PWM input 4. Internal passive pull-down
PWM input 2. Internal passive pull-down
Transmit CAN. Internal passive pull-up
Receive CAN. Push-pull structure
HS-CAN Supply Input. For internal HS-CAN cell needed for CAN Normal Mode
CAN High Bus.
9
PWM4
PWM2
TXDCAN
RXDCAN
VCAN
CANH
CANL
GND
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
CAN Low Bus.
Ground. Transceiver ground (CAN)
Wake-up input 5.
WK5
WK3
Wake-up input 3.
SL
Source Low Side.
GL2
Gate Low Side 2.
GL1
Gate Low Side 1.
WK2/FO
GH2
Wake-up input 2 or Fail Safe Output.
Gate High Side 2.
SH2
Source High Side 2.
SH1
Source High Side 1.
GH1
Gate High Side 1.
PWM1/CRC
PWM input 1. Internal passive pull-down
CRC. Connect to GND (via pull-down) to activate CRC functionality
28
29
30
31
32
CPC2N
CPC2P
CPC1P
CPC1N
VS
Negative connection to Charge Pump Capacitor 2.
Positive connection to Charge Pump Capacitor 2.
Positive connection to Charge Pump Capacitor 1.
Negative connection to Charge Pump Capacitor 1.
Supply voltage for Bridge Drivers and Charge pump. Connected to the
battery voltage after reverse protection.
33
34
35
36
37
38
39
40
41
42
43
44
CP
Charge Pump output voltage.
PWM input 3. Internal passive pull-down
Gate High Side 3.
PWM3
GH3
SH3
Source High Side 3.
Source High Side 4.
Gate High Side 4.
SH4
GH4
WK1
GL3
Wake-up input 1.
Gate Low Side 3.
GL4
Gate Low Side 4.
WK4/SYNC
HS1
Wake-up input 4/Sync.
High Side output 1.
High Side output 2.
HS2
Datasheet
9
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
Pin Configuration
Pin
45
Symbol
HS3
Function
High Side output 3.
High Side output 4.
46
HS4
47
VSHS
Supply voltage for HSx. Connected to the battery voltage after reverse
protection
48
VSINT
Voltage regulator and main supply voltage. Connected to the battery voltage
after reverse protection
Cooling GND
Tab
Cooling Tab - Exposed Die Pad; For cooling purposes only, do not use as an
electrical ground1)
1) The exposed die pad at the bottom of the package allows better power dissipation of heat from the device via the
PCB. The exposed die pad is not connected to any active part of the IC. However, it should be connected to GND for
the best EMC performance.
Note:
The GND pin as well as the Cooling Tab must be connected to one common GND potential.
3.3
Hints for not functional pins
It must be ensured that the correct configurations are also selected, i.e. in case functions are not used that
they are disabled via SPI. Unused pins should be handled as follows:
•
•
N.U.: not used; internally bonded for testing purpose; leave open.
RSVD: must be connected to GND.
Datasheet
10
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
General Product Characteristics
4
General Product Characteristics
4.1
Absolute Maximum Ratings
Table 1
Absolute Maximum Ratings1)
Tj = -40°C to +150°C; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter
Symbol
Values
Unit Note or
Test Condition
Number
Min.
Typ. Max.
Voltages
Supply Voltage VS
Supply Voltage VS
Supply Voltage VSINT
Supply Voltage VSINT
Supply Voltage VSHS
Supply Voltage VSHS
Voltage Regulator 1
VS, max
-0.3
–
–
–
–
–
–
–
–
28
V
V
V
V
V
V
V
V
–
P_4.1.1
P_4.1.2
P_4.1.3
P_4.1.4
P_4.1.5
P_4.1.6
P_4.1.7
VS, max
-0.3
40
Load Dump
VSINT, max
VSINT, max
VSHS, max
VSHS, max
VCC1, max
VCP, max
-0.3
28
–
-0.3
40
Load Dump
–
-0.3
28
-0.3
40
Load Dump
-0.3
VS - 0.8
5.5
VS + 17
Charge Pump Output Pin
(CP)
ICP > - 200 µA if CP P_4.1.8
is disabled
CPC1P, CPC2P
CPC1N, CPC2N
VCPCxP, max
- 0.3
–
–
–
VS + 17
VS + 0.3
40
V
V
V
P_4.1.38
P_4.1.39
VCPCxN, max - 0.3
Bridge Driver Gate High Side VGHx, max
(GHx)
-8.0
-8.0
-0.3
–
–
–
P_4.1.11
P_4.1.12
P_4.1.13
Bridge Driver Gate Low Side VGLx, max
(GLx)
–
–
24
16
V
V
Voltage difference between VGS
GHx-SHx and between GLx-
SLx
Bridge Driver Source High
(SHx)
VSHx, max
-8.0
-8.0
–
–
40
6.0
40
V
V
–
–
P_4.1.14
P_4.1.15
Bridge Driver Source Low
Side SL
VSL, max
Wake Input WKx
High Side HSx
VWKx, max
VHSx, max
-0.3
-0.3
–
–
V
V
–
–
P_4.1.19
P_4.1.20
VSHS, max
+ 0.3
CANH, CANL
VBUS, max
-27
–
–
40
40
V
V
–
–
P_4.1.22
P_4.1.23
PWM1/CRC, PWM3 Input
Pins
VPWM1-3, max -0.3
PWM2,PWM4 Input Pins
VPWM2-4, max -0.3
–
VCC1
V
–
P_4.1.24
+ 0.3
Datasheet
11
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
General Product Characteristics
Table 1
Absolute Maximum Ratings1) (cont’d)
Tj = -40°C to +150°C; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter
Symbol
Values
Unit Note or
Test Condition
Number
Min.
Typ. Max.
Logic Input Pins (CSN, CLK, VI, max
SDI, TXDCAN)
-0.3
–
–
–
VCC1
+ 0.3
V
V
V
–
P_4.1.27
P_4.1.30
P_4.1.31
Logic Output Pins (SDO,
RSTN, INTN, RXDCAN)
VO, max
-0.3
-0.3
VCC1
+ 0.3
–
VCAN Input Voltage
Temperatures
VVCAN, max
5.5
Junction Temperature
Storage Temperature
ESD Susceptibility
ESD Resistivity
Tj
-40
-55
–
–
150
150
°C
°C
–
–
P_4.1.32
P_4.1.33
Tstg
VESD,11
VESD,12
-2
-8
–
–
2
8
kV
kV
HBM2)
HBM2)3)
P_4.1.34
P_4.1.35
ESD Resistivity to GND,
CANH, CANL
ESD Resistivity to GND
VESD,21
VESD,22
-500
-750
–
–
500
750
V
V
CDM4)
CDM4)
P_4.1.36
P_4.1.37
ESD Resistivity Pin 1,
12,13,24,25,36,37,48 (corner
pins) to GND
1) Not subject to production test, specified by design.
2) ESD susceptibility, HBM according to ANSI/ESDA/JEDEC JS-001 (1.5 kΩ, 100 pF).
3) For ESD “GUN” Resistivity (according to IEC61000-4-2 “gun test” (150 pF, 330 Ω)), is shown in Application Information
and test report will be provided from IBEE.
4) ESD susceptibility, Charged Device Model “CDM” EIA/JESD22-C101 or ESDA STM5.3.1.
Notes
1. Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2. Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are
not designed for continuous repetitive operation.
4.2
Functional Range
Table 2
Functional Range1)
Parameter
Symbol
Values
Unit Note or
Test Condition
Number
Min.
VPOR,f
6.0
Typ.
Max.
28
2)
Supply Voltage
VSINT,func
VS,func
–
–
–
–
–
V
P_4.2.1
P_4.2.2
P_4.2.7
P_4.2.4
P_4.2.6
Bridge Supply Voltage
High Side Supply Voltage
CAN Supply Voltage
Junction Temperature
28
V
–
2)
VSHS_HS,func 6.0
VCAN,func 4.75
Tj -40
28
V
5.25
150
V
–
–
°C
Datasheet
12
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
General Product Characteristics
1) Not subject to production test, specified by design.
2) Including Power-On Reset, Over- and Undervoltage Protection.
Note:
Within the functional range the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the related electrical characteristics
table.
Device Behavior Outside of Specified Functional Range
•
28 V < VSINT,func < 40 V: Device will still be functional including the state machine; the specified electrical
characteristics might not be ensured anymore. The VCC1 is working properly, however, a thermal shutdown
might occur due to high power dissipation. HSx switches might be turned OFF depending on HSx_OV
configurations. The specified SPI communication speed is ensured; the absolute maximum ratings are not
violated, however the device is not intended for continuous operation of VSINT > 28 V and a thermal
shutdown might occur due to high power dissipation. The device operation at high junction temperatures
for long periods might reduce the operating life time.
Note: VCAN < 4.75 V: The undervoltage bit will be set in the SPI register and the transmitter will be disabled
as long as the UV condition is present.
Note: 5.25 V < VCAN < 5.5 V: CAN transceiver still functional. However, the communication might fail due to
out-of-spec operation.
•
V
POR,f < VSINT < 5.5 V (given the fact that the device was powered up correctly before with VSINT > 5.5 V):
Device will still be functional; the specified electrical characteristics might not be ensured anymore:
–
–
–
The voltage regulator will enter the low-drop operation mode.
A reset could be triggered depending on the Vrthx settings.
HSx switch behavior will depend on the respective configuration:
HS_UV_SD_DIS = ‘0’ (default): HSx will be turned OFF for VSHS < VSHS,UVD and will stay OFF.
HS_UV_SD_DIS = ‘1’: HSx stays on as long as possible. An unwanted overcurrent shut down may occur.
OC shut down bit set and the respective HSx switch will stay OFF.
–
–
If WK2/FO is configured as Fail Safe Output, FO outputs will remain ON if they were enabled before
VSINT > 5.5 V.
The specified SPI communication speed is ensured.
Note:
VS,UV < VS < 6.0 V: the charge pump might be deactivated due to a charge pump undervoltage
detection, resulting in a turn-off of the external MOSFETs.
4.3
Thermal Resistance
Table 3
Thermal Resistance1)
Parameter
Symbol
Values
Typ.
7.2
Unit Note or
Test Condition
Number
Min.
Max.
Junction to Soldering Point Rth(JSP)
Junction to Ambient Rth(JA)
–
–
–
–
K/W Exposed Pad
P_4.3.1
P_4.3.2
2)
27
K/W
1) Not subject to production test, specified by design.
2) Specified Rth(JA) value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board for a power
dissipation of 1.5 W; the product (chip+package) was simulated on a 76.2 x 114.3 x 1.5 mm3 with 2 inner copper layers
(2 x 70 µm Cu, 2 x 35 µm C); where applicable a thermal via array under the exposed pad contacted the first inner
copper layer and 300 mm2 cooling areas on the top layer and bottom layers (70 µm).
Datasheet
13
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
General Product Characteristics
4.4
Current Consumption
Table 4
Current Consumption
Current consumption values are specified at Tj = 25°C, VSINT= VSHS = 13.5 V, all outputs open
(unless otherwise specified)
Parameter
Symbol
Values
Typ.
Unit Note or
Test Condition
Number
Min.
Max.
Normal Mode
1)
Normal Mode current
consumption
INormal
–
4.5
5.5
mA
V
= 5.5 V to 28 V; P_4.4.1
SINT
Tj = -40°C to +150°C;
CAN=CP=off
Stop Mode
Stop Mode current
consumption
(low active peak threshold)
IStop_1,25
–
–
50
65
80
µA
1)2) CAN=off;
WKx=HSx=CP=off:
Cyclic Wak./Sen.=off
Watchdog = off;
no load on VCC1
I_PEAK_TH = 0B
P_4.4.2
P_4.4.3
;
Stop Mode current
consumption
IStop_1,85
55
µA
1)2)3) Tj = 85°C;
CAN=off;
(low active peak threshold)
WKx=HSx=CP=off:
Cyclic Wak./Sen.=off
Watchdog = off;
no load on VCC1
;
I_PEAK_TH = 0B
Stop Mode current
consumption
(high active peak threshold)
IStop_2,25
–
–
70
75
95
µA
µA
1)2) CAN=off;
WKx=HSx=CP=off:
Cyclic Wak./Sen.=off
Watchdog = off;
no load on VCC1
I_PEAK_TH = 1B
P_4.4.4
P_4.4.5
;
Stop Mode current
consumption
IStop_2,85
105
1)2)3) Tj = 85°C;
CAN=off;
(high active peak threshold)
Cyclic Wak./Sen.=off;
Watchdog = off;
no load on VCC1
;
I_PEAK_TH = 1B
Sleep Mode
Sleep Mode current
consumption
ISleep,25
–
–
18
28
30
40
µA
µA
1) CAN=off;
WKx=HSx=CP=off:
Cyclic Wak./Sen.= off
1)3) Tj = 85°C;
CAN=off;
P_4.4.6
P_4.4.7
Sleep Mode current
consumption
ISleep,85
WKx=HSx=CP=off:
Cyclic Wak./Sen.=off
Datasheet
14
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
General Product Characteristics
Table 4
Current Consumption (cont’d)
Current consumption values are specified at Tj = 25°C, VSINT= VSHS = 13.5 V, all outputs open
(unless otherwise specified)
Parameter
Symbol
Values
Typ.
Unit Note or
Test Condition
Number
Min.
Feature Incremental Current Consumption
Max.
Current consumption for
CAN module, recessive state
ICAN,rec
–
–
–
–
2
3.5
mA 1)3) Normal/Stop
Mode;
P_4.4.13
CAN Normal Mode;
Tj = -40°C to +150°C;
VCC1 connectedtoVCAN
;
;
;
;
V
TXDCAN = VCC1;
no RL on CAN
mA 1)3) Normal/Stop
Mode;
Current consumption for
CAN module, dominant
state
ICAN,dom
3
5.0
0.7
1.5
P_4.4.14
P_4.4.15
P_4.4.16
CAN Normal Mode;
Tj = -40°C to +150°C;
V
CC1 connectedtoVCAN
VTXDCAN = GND;
no RL on CAN
Current consumption for
CAN module, Receive Only
Mode, Normal Mode
ICAN,Rec_onlyN
0.5
1.4
mA 1)3) Normal Mode;
CAN Receive Only
Mode;
Tj = -40°C to +150°C;
V
V
CC1 connectedtoVCAN
TXDCAN = VCC1
;
no RL on CAN
Current consumption for
CAN module, Receive Only
Mode, Stop Mode
ICAN,Rec_only
mA 1)3) Stop Mode;
CAN Receive Only
Mode;
Tj = -40°C to +150°C;
VCC1 connectedtoVCAN
V
TXDCAN = VCC1;
no RL on CAN
Current consumption for
CAN wake capability
ICAN,wake,25
ICAN,wake,85
–
–
4.5
8
7
µA
µA
4) Sleep Mode;
CAN wake capable;
3)4) Sleep Mode; Tj =
85°C;
P_4.4.17
P_4.4.18
Current consumption for
CAN wake capability
10
CAN wake capable;
WK = off;
Current consumption for
each WK input
IWK,wake,25
–
–
0.2
0.5
2
3
µA
µA
1)4)5)6) Sleep Mode; WK P_4.4.22
wake capable;
no activity on WK pin;
1)3)4)5)6) Sleep Mode; Tj P_4.4.23
= 85°C;
Current consumption for
each WK input
IWK,wake,85
WK wake capable;
no activity on WK pin;
Datasheet
15
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
General Product Characteristics
Table 4
Current Consumption (cont’d)
Current consumption values are specified at Tj = 25°C, VSINT= VSHS = 13.5 V, all outputs open
(unless otherwise specified)
Parameter
Symbol
Values
Typ.
250
Unit Note or
Test Condition
Number
Min.
Max.
3)4)7)9)8)
Current consumption for
IStop,HS,25
–
375
µA
Stop Mode;
P_4.4.24
first High-Side in Stop Mode
HS with 100% duty
cycle (no load);
Current consumption for
first High-Side in Stop Mode
IStop,HS,85
–
250
375
µA
3)4)7)9)8) Stop Mode; Tj = P_4.4.25
85°C;
HS with 100% duty
cycle (no load);
Current consumption for
cyclic sense function
IStop,CS25
IStop,CS85
–
–
20
24
26
32
µA
µA
4)7)9)10) Stop Mode; WD P_4.4.26
= off;
3)4)7)9)10) Stop Mode; Tj P_4.4.27
Current consumption for
cyclic sense function
= 85°C;
WD = off;
Current consumption for
watchdog active in Stop
Mode
IStop,WD25
IStop,WD85
IStop,FO
–
–
–
–
–
–
18
19
350
10
7
23
25
600
14
10
40
µA
µA
µA
µA
µA
3)11) Stop Mode;
Watchdog running;
P_4.4.28
P_4.4.29
P_4.4.30
P_4.4.32
P_4.4.34
P_4.4.35
Current consumption for
watchdog active in Stop
Mode
3)11) Stop Mode;
Tj = 85°C;
Watchdog running;
3)11) all modes;
Tj < 85°C;
FO = on (no load);
3)11) Stop Mode or
Sleep Mode; Tj < 85°C;
PARK_BRK_EN = 1B
3)11) Stop Mode or
Sleep Mode; Tj < 85°C;
OV_BRK_EN = 1B
Current consumption for
active Fail Output FO
Current consumption in
parking braking mode
(LSx ON)
Iparking
Current consumption Over IOV,LS_OFF
voltage braking mode
(LSx OFF)
Current consumption in VS ICP,BD
for Charge Pump and Bridge
Driver
30
mA Normal Mode;
Tj = -40°C to +150°C;
CPEN = 1; All HB OFF
1) Measured at VSINT
.
2) If the load current on VCC1 will exceed the configured VCC1 active peak threshold, the current consumption will increase
by typ. 2.9 mA to ensure optimum dynamic load behavior. See also Chapter 6.
3) Not subject to production test, specified by design.
4) Current consumption adders of features defined for Stop Mode also apply for Sleep Mode and vice versa. Wake input
signals are stable (i.e. not toggling), cyclic wake/sense & watchdog are OFF (unless otherwise specified).
5) No pull-up or pull-down configuration selected.
6) The specified WKx current consumption adder for wake capability applies regardless how many WK inputs are
activated.
7) Additional current will be drawn from VSHS and VSINT
.
8) Typical adder of additional high-side switch activation 200 µA.
Datasheet
16
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
General Product Characteristics
9) HSx used for cyclic sense, Timerx with 20ms period, 0.1 ms on-time, no load.
In general the current consumption adder for cyclic sense in Stop Mode can be calculated with below equation:
I
Stop,CS_typ = 18 µA + (IStop,HS,25 x ton/TPer)
where the 18 uA is the base current consumption of the digital cyclic sense/wake functionality.
10) Also applies to cyclic wake but without adder from HS biasing contribution.
11) Additional current will be drawn from VSINT
.
Notes
1. There is no additional current consumption contribution in Normal Mode due to PWM generators or Timers.
2. The quiescent current consumption in Stop Mode and Sleep Mode will increase for VSINT < 9 V.
Datasheet
17
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
System Features
5
System Features
This chapter describes the system features and behavior of the TLE9561QX:
•
•
•
•
State machine
Device configuration
State machine modes and mode transitions
Wake-up features such as cyclic sense and cyclic wake
5.1
Short State Machine Description
The DC Motor System IC offers six operating modes:
•
•
•
•
•
Init Mode: Power-up of the device and after a soft reset.
Normal Mode: The main operating mode of the device.
Stop Mode: The first-level power saving mode with the main voltage regulator VCC1 enabled.
Sleep Mode: The second-level power saving mode with VCC1 disabled.
Restart Mode: An intermediate mode after a wake event from Sleep Mode or Fail-Safe Mode or after a
failure (e.g. WD failure, VCC1 under voltage reset) to bring the microcontroller into a defined state via a
reset.
•
Fail-Safe Mode: A safe-state mode after critical failures (e.g. Temperature shutdown) to bring the system
into a safe state and to ensure a proper restart of the system.
A special mode, called Software Development Mode, is available during software development or debugging
of the system. All above mentioned operating modes can be accessed in this mode. However, the watchdog is
still running, but no reset to the microcontroller is applied. Watchdog failures are indicated over INTN pin
instead.
However, the watchdog reset signaling can be reactivated again in Software Development Mode. The
Watchdog will start always with the Long Open Windows (t_low).
The DC Motor System IC is controlled via a 32-bit SPI interface (refer to Chapter 13 for detailed information).
The configuration as well as the diagnosis is handled via the SPI.
The device offers various supervision features to support functional safety requirements. Refer to Chapter 12
for more information.
Datasheet
18
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
System Features
5.2
Device Configuration
Two features on the DC Motor System IC can be configured by hardware:
•
•
The selection of the normal device operation or the Software Development Mode.
Enabling/disabling the CRC on the SPI interface.
The configurations are done monitoring the follow pins:
•
•
INTN/TEST
PWM1/CRC
The hardware configuration can be done typically at device power-up, where the device is in Init Mode or (only
in case of CRC setting) in Restart Mode.
Software development Mode configuration detail
After the RSTN is released, the INTN/TEST pin is internally pulled HIGH with a weak pull-up resistor. Therefore
the default configuration is the device in normal operation.
In order to configure the Software Development Mode, the following conditions have to be fulfilled:
•
•
•
•
Init Mode from power-up
VCC1>Vrtx
POR=1
RSTN = HIGH
The Software Development Mode is configured using the following scheme:
•
Only one external pull-down on INTN/TEST pin followed by an arbitrary SPI command, the device latches
the Software Development Mode.
•
•
External pull-up or no pull-down on INTN/TEST pin enable the device in normal operation.
To enter Software Development Mode, a pull-down resistor to GND might be used.
Soft. Dev.
Mode OFF for tSDM_F to avoid supply glitches
The INTN/TEST is externally pulled-down
INTN/TEST
Soft. Dev.
Mode ON
tSDM_F
Intn_filt
RSTN
LATCHED (first SPI frame)
Entry in Software Development Mode
(not latched )
Mode
Successful latched Software Development Mode
Normal Mode
Init Mode
Time/us
Intn_filt: internal filtered INTN/TEST signal
Figure 3
Software Development Mode Selection Timing
Intn_filt is a filtered signal from INTN/TEST, with the filter time tSMD_F (P_11.2.7). Intn_filt starts (at the rising
edge if RSNT) wit the value 1.
Datasheet
19
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
System Features
Note:
If during monitoring the INTN/TEST pin for Software Development Mode entry, the device changes
the mode without SPI command, the device will not enter/stay in Software Development Mode.
CRC configuration detail
The CRC is configured using the following scheme:
•
•
Pull-down on PWM1/CRC enable the CRC.
No external components on PWM1/CRC disables the CRC.
In order to configure the CRC, the follow conditions have to be full filled:
•
•
•
•
Init Mode (from power-up) or Restart Mode
VCC1>Vrtx
POR=1
RSTN = LOW
The configuration selection is done during the reset delay time tRD1 with a continuous filter time of tCFG_F and
the configuration (depending on the voltage level at PWM1/CRC) is latched at the rising edge of RSTN.
VS_INT
VPOR,r
t
VCC1
VRT1,r
t
RSTN
tCFG_F
Continuous Filtering with
t
tRD1
Configuration selection monitoring period
Figure 4
CRC configuration Selection Timing Diagram at the device power-up.
In case of mismatch between CRC setting between the device and µC (CRC_STAT), the device can accept two
recovery SPI commands (static patterns).
The pattern 67AA AA0EH (addr + rw_bit = 67 ; data = AAAA ; CRC = 0E ) enables the CRC.
The pattern E7AA AAC3H (addr + rw_bit = E7 ; data = AAAA ; CRC = C3) disables the CRC.
The patterns shall be send only in Normal Mode.
For additional details about the CRC setting and configuration, refer also to Chapter 13.3.1.
Datasheet
20
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
System Features
5.3
Block Description of State Machine
The state machine describes the different states of operation, the device may get into. The following figure
shows the state machine flow diagram.
First battery connection
Soft Reset
* The Software Development Mode is a super set of
state machine where the WD reset is not signaled,
CAN behavior differs in Init Mode. Otherwise, there are
no differences in behavior.
Config.: settings can be changed in
this device mode;
Init Mode *
(Long open window)
(1) After Fail-Safe Mode entry, the device will stay for at
least typ. 1s in this mode (with RSTN low) after a TSD2
event and min. typ. 100ms after other Fail-Safe Events.
Only then the device can leave the mode via a wake-up
event. Wake events are stored during this time.
Fixed: settings stay as defined in
Normal Mode
Cyc.
BD(3) OFF
CP(3) OFF
VCC1
ON
CAN(2)
OFF
HSx
OFF
Wake
OFF
Cyc.
Sense
OFF
WD
fixed
(2) For Software Development Mode CAN is ON in
Init Mode and stays ON when going from there to
Normal Mode.
Any SPI
command
(3) HB Passive off due to gate-source resistors.
Normal Mode
Cyc.
VCC1
HSx
BD/CP
Wake
WD trigger
ON
config. config.
config.
Cyc.
CAN
config.
WD
config.
Sense
config.
ꢀꢁReset is released
ꢀꢁWD starts with long open window
Automatic
SPI cmd
SPI cmd
SPI cmd
Sleep Mode
BD/CP(3)
Stop Mode
BD/CP(3)
OFF
Cyc.
Cyc.
Wake
fixed
Cyc.
Sense
fixed
VCC1
OFF
CAN
Wake cap./
OFF
HSx
fixed
VCC1
HSx
fixed
Wake
fixed
OFF
ON
Cyc.
Sense
fixed
VCC1 over voltage
(depend from VCC1_OV_MOD setting)
WD
OFF
WD
fixed
CAN
fixed
Wake up event
LS short circuit during
VS_OV event
Restart Mode
(RO pin is asserted)
Sleep Mode entry without any
wake source enabled
Cyc.
VCC1
ON/
HSx
OFF
BD/CP(3)
Wake
OFF
After 4x consecutive VCC1
After 4x consecutive
Watchdog failure
OFF
under voltage events
Watchdog Failure
ramping
(if VS_INT > VS_INT_UV)
Cyc.
Sense
OFF
VCC1 Under voltage
WD
OFF
CAN
woken/OFF
Fail-Safe Mode (1)
VCC1 over voltage
(depend from VCC1_OV_MOD setting)
BD/CP(3)
OFF
Cyc.
Wake
OFF
VCC1
OFF
HSx
OFF
TSD2 event
CAN WK, wake-up event
OR
Release of overtemperature TSD2
after a time depending on TSD2_DEL
Cyc.
Sense
OFF
WD
OFF
VCC1 Short to GND
CAN
Wake cap.
Figure 5
State Diagram showing the operating modes
Description:
•
•
•
•
•
•
ON /OFF:= Indicate if the module is enabled or disabled either via SPI or from the device itself
config:= Settings can be changed in this mode
fixed:= Settings stay as defined in Normal Mode or Init Mode
active/inactive:= Indicate if the device activates/deactivates one specific feature
Wake capable:= Transceiver that is capable to detect one wake-up events
woken:= Transceiver that has detected one wake-up event
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DC Motor System IC
System Features
5.4
State Machine Modes Description
5.4.1
Init Mode
The device starts up in Init Mode after crossing the power-on reset VPOR,r threshold (see also Chapter 12.3) and
the watchdog will start with a long open window (tLW) after RSTN is released (High level).
In Init Mode, the device waits for the microcontroller to finish its startup and initialization sequence.
Init Mode
(Long open window)
Cyc.
VCC1
ON
HSx
OFF
BD OFF
CP OFF
Wake
OFF
Cyc.
Sense
OFF
CAN
OFF
WD
fixed
Figure 6
Table 5
Init Mode
Init Mode Settings
Part/Function
VCC1
Value
ON
Description
•
•
•
•
•
•
•
•
The VCC1 is ON
Watchdog is fixed and set with a long open window (tLW
All HSx are OFF
)
WD
fixed
OFF
OFF
OFF
OFF
OFF
OFF
HSx
Bridge Drivers is OFF
BD
Charge Pump is OFF
CAN transceiver is OFF1)
CP
CAN
Cycle Sense is OFF
Cyc Sense
Cycle Wake is OFF
Cyc Wake
1) Exception: The CAN transceiver is ON during Software Development Mode
5.4.2
Normal Mode
The Normal Mode is the standard operating mode for the device. The VCC1 is active and all features are
configurable. Supervision and monitoring features are enabled.
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DC Motor System IC
System Features
Normal Mode
Cyc.
Wake
config.
VCC1
ON
HSx
config.
BD/CP
config.
Cyc.
CAN
config.
WD
config.
Sense
config.
Figure 7
Normal Mode
Table 6
Part/Function
VCC1
Normal Mode Settings
Value
ON
Description
•
•
•
VCC1 is active
Watchdog may be configured by SPI
WD
config
config
The High Side Switches may be configured and switched ON or OFF by
SPI
HSx
•
The Bridge Drivers and Charge Pump may be configured and switched
ON or OFF by SPI
BD/CP
config
•
•
CAN may be configurable and switched ON or OFF by SPI
CAN
config
config
Cyclic sense may be configured with the HSx, WKx inputs and Timer1 or
Timer2 or SYNC (WK4)
Cyc. Sense
•
Cyclic wake can be configured with the Timer1 or Timer 2
Cyc. Wake
config
5.4.3
Stop Mode
The Stop Mode is the first level technique to reduce the overall current consumption by setting the voltage
regulator VCC1 into a low-power mode.
Note:
All settings have to be done before entering Stop Mode.
In Stop Mode any kind of SPI WRITE commands are ignored and the SPI_FAIL bit is set, except for changing to
Normal Mode, triggering a device Soft Reset, refreshing the watchdog as well as for reading and clearing the
SPI status registers.
Note:
A wake-up event on CAN, WKx, Low-Side short circuit detection in parking braking mode or
overvoltage brake detection, could generate an interrupt on pin INTN (based on INTN masking
configuration; refer to Chapter 10) however, no change of the device mode will occur.
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DC Motor System IC
System Features
Stop Mode
Cyc.
Wake
fixed
VCC1
ON
HSx
fixed
BD/CP
OFF
Cyc.
Sense
fixed
WD
fixed
CAN
fixed
Figure 8
Table 7
Stop Mode
Stop Mode Settings
Part/Function
VCC1
Value
ON
Description
•
•
•
•
•
•
•
VCC1 is ON
Watchdog is fixed as configured in Normal Mode
HSx are fixed as configured in Normal Mode
The Bridge Drivers and Charge Pump are OFF
CAN fixed as configured in Normal Mode
WD
fixed
fixed
OFF
HSx
BD/CP
CAN
fixed
fixed
fixed
Cyclic sense fixed as configured in Normal Mode
Cyclic wake is fixed as configured in Normal Mode
Cyc. Sense
Cyc. Wake
Note:
In Stop Mode, it is possible to activate the Low-Side of Bridge Drivers (e.g. in case of parking braking
mode or overvoltage brake detection). Refer to Chapter 12.11 for additional details.
5.4.4
Sleep Mode
The Sleep Mode is the second level technique to reduce the overall current consumption to a minimum
needed to react on wake-up events or for the device to perform autonomous actions (e.g. cyclic sense).
Note:
All settings have to be done before entering Sleep Mode.
Sleep Mode
Cyc.
Wake
fixed
VCC1
OFF
HSx
fixed
BD/CP
OFF
Cyc.
Sense
fixed
CAN
Wake cap./
OFF
WD
OFF
Figure 9
Sleep Mode
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DC Motor System IC
System Features
Table 8
Part/Function
VCC1
Sleep Mode Settings
Value
OFF
Description
•
•
•
•
•
VCC1 is OFF
Watchdog is OFF
WD
OFF
HSx are fixed as configured in Normal Mode
The Bridge Drivers and Charge Pump are OFF
CAN fixed as configured (Wake Capable or OFF)
HSx
fixed
OFF
BD/CP
CAN
Wake Cap/
OFF
•
•
Cyclic sense fixed as configured in Normal Mode
Cyclic wake is fixed
Cyc. Sense
Cyc. Wake
fixed
fixed
Note:
In Sleep Mode, it is possible to activate the Low-Side’s of Bridge Drivers (e.g. in case of parking
braking mode or overvoltage braking). Refer to Chapter 12.11 for additional details.
5.4.5
Restart Mode
The Restart Mode is a transition state where the RSNT pin is asserted.
Restart Mode
(RO pin is asserted)
Cyc.
VCC1
ON/
HSx
OFF
BD/CP
OFF
Wake
OFF
ramping
Cyc.
Sense
OFF
CAN
woken/
OFF
WD
OFF
Figure 10 Restart Mode
Table 9
Restart Mode Settings
Part/Function
VCC1
Value
Description
•
VCC1 is ON or ramping up
ON/
ramping
•
•
•
•
WD will be disabled if it was activated before
HSx will be disabled if it was activated before
The Bridge Drivers and Charge Pump are OFF
WD
OFF
OFF
OFF
HSx
BD/CP
CAN
CAN may woken (in case of wake-up event on the Bus) or wake capable
or OFF
Woken/
wake
capable/
OFF
•
•
Cyclic sense will be disabled if it was activated before
Cyclic wake will be disabled if it was activated before
Cyc. Sense
Cyc. Wake
OFF
OFF
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DC Motor System IC
System Features
5.4.6
Fail-Safe Mode
The purpose of this mode is to bring the system in a safe status after a failure condition by turning OFF the
VCC1 supply and powering off the microcontroller. After a wake event the system is then able to restart again.
Fail-Safe Mode
Cyc.
VCC1
OFF
HSx
OFF
BD/CP
OFF
Wake
OFF
Cyc.
Sense
OFF
WD
OFF
CAN
Wake cap.
Figure 11 Fail-Safe Mode
Table 10 Fail-Safe Mode Settings
Part/Function
VCC1
Value
OFF
Description
•
•
•
•
•
•
•
VCC1 is switched OFF
WD is switched OFF
HSx are switched OFF
WD
OFF
HSx
OFF
The Bridge Drivers and Charge Pump are OFF
CAN is forced to be Wake capable
Cyclic sense is switched OFF
BD/CP
OFF
CAN
Wake Cap
OFF
Cyc. Sense
Cyc. Wake
Cyclic wake is switched OFF
OFF
Note
•
In Fail-Safe Mode, the default wake sources CAN and WKx (if configured as wake inputs) are activated
automatically and all wake event bits will be cleared.
•
•
In case that WK2 is set as Fail Safe Output (FO), the WK2/FO is automatically activated.
The Fail-Safe Mode will be maintained until a wake event on the default wake sources occurs. To avoid any
fast toggling behavior a filter time of typ. 100ms (tFS,min) is implemented. Wake events during this time will
be stored and will automatically lead to entering Restart Mode after the filter time.
In case of an VCC1 overtemperature shutdown (TSD2) the Restart Mode will be reached automatically after
a filter time of typ. 1s (tTSD2) without the need of a wake event once the device temperature has fallen below
the TSD2 threshold.
•
The parking braking mode is automatically disabled in Fail-Safe Mode.
5.4.7
Software Development Mode
The Software Development Mode is a dedicated device configuration especially useful for software
development.
Compared to the default device user mode operation, this mode is a super set of the state machine. The device
will start also in Init Mode and it is possible to use all the modes and functions with following differences:
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DC Motor System IC
System Features
•
•
Restart Mode or Fail-Safe Mode (depending on the configuration) is not reached due to watchdog failure
but the other reasons to enter these modes are still valid.
CAN default value in Init Mode and entering Normal Mode from Init Mode is ON instead of OFF.
Table 11 Normal Mode Settings (Software Development Mode active)
Part/Function
Default
State
Description
•
•
VCC1 is active
VCC1
WD
ON
ON
WD is on, but will not trigger transition to Fail-Safe Mode or Restart
Mode
•
•
The High Side Switches may be configured and switched ON or OFF by
SPI
The Bridge Drivers and Charge Pump may be configured and switched
ON or OFF by SPI
HSx
OFF
OFF
BD/CP
•
•
•
CAN may be configurable and switched ON or OFF by SPI
Can be configured
CAN
ON
Cyc. Sense
Cyc. Wake
OFF
OFF
Can be configured
Software Development Mode entry
For timing and configuration details, refer to Chapter 5.2.
Note
•
•
After Init Mode, the pull-up is released as the INTN/TEST pin acts as output then to drive the INTN signal.
If the device enters Fail-Safe Mode due to VCC1 short circuit to GND during the Init Mode, the Software
Development Mode will not be entered and can only be reached at the next power-up of the device after
the VCC1 short circuit is removed.
•
The absolute maximum ratings of the pin INTN must be observed. To increase the robustness of this pin
during debugging or programming a series resistor between INTN and the connector can be added.
Watchdog in Software Development Mode
The Watchdog is enabled in Software Development Mode as default state. One INTN event is generated due
to wrong watchdog trigger.
It is possible to deactivate the integrated Watchdog module using the WD_SDM_DISABLE bit. After disabling
the Watchdog, no INTN events are generated and the WD_FAIL bit will also not be set anymore in case of a
trigger failure. It is also possible only to mask / unmask the INTN event of the WD in Software Development
Mode by using the bit WD_SDM. In case of unmasking, a WD trigger fail will only lead to WD_FAIL bit set.
5.5
Transition Between States
This chapter describes the transition between the modes triggered by power-up, SPI commands or wake-up
events.
5.5.1
Transition into Init Mode
The device goes into Init Mode in case of a power-up or after sending a soft-reset in Normal or Stop Mode.
Prerequisites:
•
Power OFF
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DC Motor System IC
System Features
•
Device in Normal Mode or Stop Mode with follow conditions:
–
–
VSINT > VPOR,r
RSTN High
Triggering Events:
A Soft Reset command (MODE = ‘11’). All SPI registers will be changed to their respective Soft Reset values.
•
Note
•
In case of Soft Reset command, a hardware RSTN event can be generated depending on the configuration.
An external Reset will be generated in case of SOFT_RESET_RO = 0B . In case of SOFT_RESET_RO = 1B, no
RSTN hardware event is generated in case of Soft Reset.
•
At power-up, the SPI bit VCC1_UV will not be set as long as VCC1 is below the VRT,x threshold and if VSINT
is below the VSINT,UV threshold. The RSTN pin will be kept LOW as long as VCC1 is below the selected
VRT1,r threshold. The reset delay counter will start after VRT1,r threshold is reached. After the first
threshold crossing of VCC1 > VRT1,R and RSTN transition from low to high, all subsequent undervoltage
events will lead to Restart Mode.
•
•
Wake events are ignored during Init Mode and will be lost.
The bit VSINT_UV will only be updated in Init Mode once RSTN resumes a high level.
5.5.2
Init Mode -> Normal Mode
This transition moves the device in the mode where all configurations are accessable via SPI command.
Prerequisites:
•
•
•
VSINT > VPOR,r
Init Mode
RSTN High
Triggering Events:
•
Any valid SPI command (from SPI protocol point of view) will bring the device to Normal Mode (i.e. any
register can be written, cleared and read) during the long open window where the watchdog has to be
triggered (refer also Chapter 13.2). The CRC is not taken into account for this transition.
•
For example:
–
A SPI Sleep Mode command will still bring the device into Normal Mode. However, as this is an invalid
state transition, the SPI bit SPI_FAIL is set.
–
Any invalid SPI command (from content point of view) will still bring the device into Normal Mode. The
SPI bit SPI_FAIL is set.
Note
It is recommended to use the first SPI command to trigger and to configure the watchdog.
•
5.5.3
Normal Mode -> Stop Mode
This transition is intended as first measure to reduce the current consumption. All the device features needed
in Stop Mode shall be configured in Normal Mode.
Prerequisites:
•
•
VCC1>Vrtx
Device in Normal Mode
Triggering Events:
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DC Motor System IC
System Features
•
State transition is only initiated by specific SPI command.
Note
•
•
•
An interrupt is triggered on the pin INTN when Stop Mode is entered and not all wake source signalization
flags were cleared.
If high-side switches are kept enabled during Stop Mode, then the device current consumption will
increase.
It is not possible to switch directly from Stop Mode to Sleep Mode. Doing so will also set the SPI_FAIL flag
and will bring the device into Restart Mode.
5.5.4
Normal Mode -> Sleep Mode
This transition is intended to reduce as much as possible the current consumption keeping active only wake-
up sources. All wake-up sources configurations shall be done in Normal Mode.
Prerequisites:
•
•
•
•
VCC1>Vrtx
Device in Normal Mode
All wake source signalization flags were cleared (including the LSxDSOV_BRK bit)
At least one wake-up source activated
Triggering Events:
State transition is only initiated by specific SPI command.
•
Note
•
•
•
•
If the HSx outputs are kept enabled during Sleep Mode, then the device current consumption will increase
(see Chapter 4.4).
The Cyclic Sense function will not work properly anymore in case of a failure event (e.g. overcurrent, over
temperature, reset) because the configured HSx and Timers will be disabled.
If VCC1_UV or VCC1_OV (with Config to go to Restart Mode) occurs at the border of the Sleep Mode entry:
The device will go immeditaley into Restart Mode.
If TSD2 or VCC1_OV (with Config to go to Fail-Safe Mode) occurs at the border of the Sleep Mode entry: The
device will enter immediately Fail-Safe Mode.
•
•
As soon as the Sleep Mode command is sent, the Reset will go low.
It is not possible to switch all wake sources off in Sleep Mode. Doing so will set the SPI_FAIL flag and will
bring the device into Restart Mode.
5.5.5
Stop Mode -> Normal Mode
This transition is intented to set the device in Normal Mode where all the device integrated features are
availbale and configurable.
Prerequisites:
•
•
VCC1>Vrtx
Device in Stop Mode
Triggering Events:
State transition is only initiated by SPI command.
•
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DC Motor System IC
System Features
Note
•
None
5.5.6
Sleep Mode -> Restart Mode
This transition is the consequence of a detection of wake-up event by the device. This transition is used to
ramp up VCC1 after a wake in a defined way.
Prerequisites:
•
•
Device in Sleep Mode
At least one wake-up source active
Triggering Events:
•
•
A wake-up event on CAN, WKx, Cyclic Sense, Cyclic Wake.
Bridge driver low-side short circuit detected during overvoltage braking or in parking braking mode.
Note
•
It is not possible to switch off all wake sources in Sleep Mode. Doing so will set the SPI_FAIL flag and will
bring the device into Restart Mode.
•
•
•
RSTN is pulled low during Restart Mode.
The Restart Mode entry is signalled in the SPI register DEV_STAT.
The wake-up events are flaged in WK_STAT register or DSOV register.
5.5.7
Restart Mode -> Normal Mode
From Restart Mode, the device goes automatically to Normal Mode.
Prerequisites:
•
Device in Sleep Mode or Fail-Safe Mode
Triggering Events:
•
•
Automatic
Reset is released
Note
The watchdog timer will start with a long open window starting from the moment of the rising edge of
•
RSTN and the watchdog period setting in the register WD_CTRL will be changed to the respective default
value.
5.5.8
Fail-Safe Mode -> Restart Mode
This transition is similar to device from Sleep Mode to Restart Mode and consequence of a detection of wake-
up event by the device. This transition is used to ramp up VCC1 after a wake in a defined way.
Prerequisites:
•
Device in Fail-Safe Mode
Triggering Events:
•
•
A wake-up event on CAN, WKx, TSD2 (released over temperature TDS2 after tTSD2).
Bridge Driver Low Side short circuit detected during VS/VSINT overvoltage braking mode or in parking
braking mode.
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DC Motor System IC
System Features
Note:
After leaving Fail-Safe Mode, the FAILURE bit in DEV_STAT register is set and needs to be cleared in
order to release the FO pin.
5.6
Reaction on Detected Faults
The device can react at some critical events either signalling the specific failure or changing the device mode.
The chapter describes actions taken from the device in case of critical events in particular related the device
mode change.
5.6.1
Stay in Current State
The following failures will not trigger any device mode changes, but will indicate the failures by an INTN event
(depending from the Interrupt Masking) and in dedicated status registers:
•
•
•
Failures on CAN
Failures in Bridge Driver and/or Charge Pump
Failures on HSx
5.6.2
Transition into Restart Mode
The Restart Mode can be entered in case of failure as shown in following figure.
VCC1 over voltage
(depend from VCC1_OV_MOD setting)
Restart Mode
(RO pin is asserted)
Sleep Mode entry without any
wake source enabled
Cyc.
Wake
OFF
VCC1
ON/
ramping
HSx
OFF
BD/CP
OFF
Watchdog Failure
Cyc.
Sense
OFF
VCC1 Under voltage
LIN
WD
OFF
CAN
woken/OFF
woken/OFF
Figure 12 Move into Restart Mode
Prerequisites
•
•
•
In case of wake-up event from Sleep Mode or Fail Safe Mode
In case of Normal Mode
In case of Stop Mode
Trigger Events
•
•
•
•
VCC1 Undervoltage in case of Normal Mode or Stop Mode.
Watchdog trigger failure in case of Normal Mode or Stop Mode.
VCC1 Overvoltage (based on VCC1_OV_MOD) in case of Normal Mode or Stop Mode.
Sleep Mode entry without any wake-up sources enabled in Normal Mode or Stop Mode.
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DC Motor System IC
System Features
Note
•
None
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DC Motor System IC
System Features
5.6.3
Transition into Fail-Safe Mode
The Fail-Safe Mode can be entered in case of critical event as shown in the following figure.
After 4x consecutive VCC1
After 4x consecutive
under voltage events
Watchdog failure
(if VS_INT > VS_INT_UV)
Fail-Safe Mode
VCC1 over voltage
(depend from VCC1_OV_MOD setting)
Cyc.
VCC1
OFF
HSx
OFF
BD/CP
OFF
Wake
OFF
TSD2 event
Cyc.
Sense
OFF
LIN
WD
OFF
VCC1 Short to GND
CAN
Wake cap.
Wake cap.
Figure 13 Move into Fail-Safe Mode
Prerequisites:
•
•
Critical events on VCC1
Watchdog trigger failures
Trigger Events:
•
•
•
•
•
Device thermal shutdown (TSD2) (see also Chapter 12.10.3).
VCC1 is shorted to GND (see also Chapter 12.8).
VCC1 over voltage (based on VCC1_OV_MOD).
4 consecutive Watchdog trigger failure.
4 consecutive VCC1 under voltage events.
Note
•
The FO/WK2 will be automatically activated if it was before configured as Fail Safe Output (FO).
5.7
Wake Features
Following wake sources are implemented in the device:
•
•
Static Sense: WKx inputs are permanently active as wake sources.
Cyclic Sense: WKx inputs only active during on-time of cyclic sense period. Internal timers are activating
HSx during on-time for sensing the WKx inputs.
•
•
Cyclic Wake: wake controlled by internal timers, wake inputs are not used for cyclic wake.
CAN wake: Wake-up via Bus pattern (refer to Chapter 8.2.4).
Note:
Differences of 'cyclic sense' and 'cyclic wake':
In both cases a timer is active. With 'cyclic sense' one of the high-side drivers is switched on
periodically and supplies some external circuits connected to the WK inputs. For the design, this
means that the WK input states are only sampled at the end of the selected HS on-phase which is set
by the corresponding SPI settings for GPIO HS and the timer. 'Cyclic wake' means that the timer is a
wake source and thus generates periodic interrupts as long as it is enabled.
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DC Motor System IC
System Features
5.7.1
Cyclic Sense
The cyclic sense feature is intended to reduce the quiescent current of the device and the application.
In the cyclic sense configuration, one high-side driver is switched on periodically controlled by TIMER_CTRL
or WK4/SYNC pin. One high-side driver supplies external circuitries e.g. switches and/or resistor arrays, which
are connected to one wake input WKx (see Figure 14). Any edge change of the WKx input signal during the on-
time of the cyclic sense period causes a wake event. Depending on the device mode, either the INTN is pulled
low (Normal Mode and Stop Mode) or the device is woken enabling the VCC1 (after Sleep Mode).
HSx
HSx
HS_CTRL
10k
10k
WKx
WKx
Signal
TIMER_CTRL
Period / On-Time
Switching
Circuitry
INTN
STATE MACHINE
to uC
Figure 14 Cyclic Sense Working Principle
5.7.1.1 Configuration and Operation of Cyclic Sense
The correct sequence to configure the cyclic sense is shown in Figure 15. All the configurations have to be
performed before the on-time is set in the TIMER_CTRL registers. The settings “OFF / LOW” and “OFF / HIGH”
define the voltage level of the respective HS driver before the start of the cyclic sense. The intention of this
selection is to avoid an unintentional wake due to a voltage level change at the start of the cyclic sense.
Cyclic Sense will start as soon as the respective on-time has been selected independently from the assignment
of the HS and filter configuration. The correct configuration sequence is as follows:
•
•
•
•
Configure the initial level.
Mapping of a Timer to the respective HSx outputs.
Configuring the respective filter timing and WK pins.
Configuring the timer period and on-time.
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DC Motor System IC
System Features
Cyclic Sense Configuration
Assign TIMERx_ON to OFF/Low or
Timer1, Timer2
Timer1, Timer2
OFF/High in TIMER_CTRL
Assign Timer to selected HSx switch
in HS_CTRL
WKx
Enable WKx as wake source with
configured Timer in WK_CTRL
Select WKx pull-up / pull-down
configuration in WK_CTRL
with above selected timer
No pull-up/-down, pull-down or pull-
up selected, automatic switching
Select Timer Period and desired
Period: 10, 20, 50, 100, 200ms, 1s, 2s
On-Time: 0.1, 0.3, 1.0, 10, 20ms
On-Time in TIMER_CTRL
A new timer configuration will become
active immediately, i.e. as soon as CSN
goes high
Cyclic Sense starts / ends by
setting / clearing On-time
Figure 15 Cyclic Sense: Configuration and Sequence
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DC Motor System IC
System Features
Cyclic Sense Configuration
Assign WK4 as SYNC input on
WK_CTRL
Assign SYNC to selected HSx switch
in HS_CTRL
Enable WKx as wake source with
configured SYNC in WK_CTRL
Select WKx pull-up / pull-down
configuration in WK_CTRL
WKx except WK4
with SYNC
No pull-up/-down, pull-down or pull-
up selected, automatic switching
Cyclic Sense starts / ends by
sensing SYNC rise/fall edge
Figure 16 Cyclic Sense: Configuration and Sequence in case of SYNC usage
Note
•
All configurations of period and on-time can be selected. However, recommended on-times for cyclic
sense are 0.1ms, 0.3ms and 1ms for quiescent current saving reasons. The SPI_FAIL will be set if the on-
time is longer than the period.
•
If the sequence is not ensured before entering Sleep Mode, then the cyclic sense function might not work
properly, e.g. an interrupt could be missed or an unintentional interrupt could be triggered. However, if
cyclic sense is the only wake source and it is not configured properly, then Restart Mode will be entered
immediately because no valid wake source was set.
•
During the HSx on phase in cyclic-sensing, the WKx level is sampled only once (one sample point). In case,
a level change will appear during HSx on phase, but before the sampling, as the sampling will happen at
the end of the on time, the level change will not be detected and has to wait for the next sensing-cycle.
A wake event caused by cyclic-sensing will also set the corresponding bit WKx_WU.
During Cyclic Sense, WK_LVL_STAT is updated only with the sampled voltage levels of the WKx pin in Normal
Mode or Stop Mode.
The functionality of the sampling and different scenarios are depicted in Figure 17 to Figure 19. The behavior
in Stop Mode and Sleep Mode is identical except that in Normal Mode and Stop Mode INTN will be triggered to
signal a change of WKx input level and in Sleep Mode, VCC1 will power-up instead. A wake event will be
triggered regardless if the bit WKx_WU is already set.
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TLE9561QX
DC Motor System IC
System Features
HSx static ON
Cyclic Sense
Period
HSx
Filter time
tFWK1
Filter time
tFWK1
On Time
t
1st sample taken
as reference
Wake detection possible
on 2nd sample
Figure 17 Cyclic Sense Timing
HSx
Filter time
High
Low
Spike
Switch
open
closed
WKx
High
Low
n-1
n
n+1
n+2
WKn = WKn+1 = Low
(but ignored because
change during filter time)
WKn = WKn+1
WKn+2= High
WKn+2 ≠WKn+1
ꢂwake event
Learning
WKn= Low
WKn = WKn-1
ꢂno wake event
Cycle
WKn-1= Low
INTN
ꢂꢁno wake event
High
Low
INTN &
WK Bit Set
Start of
Cyclic Sense
Figure 18 Cyclic Sense Example Timing for Stop Mode, HSx starts LOW, GND based WKx input
Datasheet
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Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
System Features
HSx
Filter time
High
Low
Spike
Switch
open
closed
WKx
High
Low
n-1
n
n+1
n+2
WKn = WKn+1 = Low (but
ignored because change during
filter time), WKn = WKn+1
ꢂꢁno wake event
WKn+2= High
WKn+2 ≠WKn+1
ꢂwake event
Learning
Cycle
WKn-1= Low
WKn= Low
WKn = WKn-1
ꢂno wake event
VCC1
High
Transition to Normal
via Restart Mode
Sleep Mode
Low
WK Bit Set
Start of
Cyclic Sense
Figure 19 Cyclic Sense Example Timing for Sleep Mode, HSx starts with ON, GND based WKx input
The cyclic sense function will be disabled in case of following conditions:
•
in case Fail-Safe Mode is entered, the HSx switch will be disabled and the WKx pin will be changed to static
sensing. An unintended wake-up event could be triggered when the WKx input is changed to static sensing.
•
In Normal Mode, Stop Mode, or Sleep Mode in case of an overcurrent, or overtemperature, or under- or
overvoltage event, the respective HS switch will be disabled.
5.7.1.2 Cyclic Sense in Low-power Mode
If cyclic sense is intended for Stop Mode or Sleep Mode, it is necessary to activate cyclic sense in Normal Mode
before going to the low-power mode. A wake event due to cyclic sense will set the bit WKx_WU. In Stop Mode
a wake event will trigger an interrupt, in Sleep Mode the wake event will send the device via Restart Mode to
Normal Mode.
Before returning to Sleep Mode, the wake status registers WK_STAT and DSOV must be cleared. Trying to go
to Sleep Mode with uncleared wake flags will lead to a direct wake-up from Sleep Mode by going via Restart
Mode to Normal Mode and triggering of RSTN.
5.7.2
Cyclic Wake
For the cyclic wake feature one timer is configured as internal wake-up source and will periodically trigger an
interrupt on INTN in Normal Mode and Stop Mode. During Sleep Mode, the timer triggers and wakes up the
device again. The device enters via Restart Mode the Normal Mode.
The correct sequence to configure the cyclic wake is shown in Figure 20. The sequence is as follows:
Datasheet
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Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
System Features
Cyclic Wake Configuration
Disable Timer1 and Timer2 as a wake
To avoid unintentional interrupts
source in TIMER_CTRL
No interrupt will be generated,
if the timer is not enabled as a wake source
Select Timer1 or Timer2 as a wake
source in TIMER_CTRL
Periods: 10, 20, 50, 100, 200ms, 1s, 2s
On-times: any
(OFF/LOW & OFF/HIGH are not allowed)
Select Timer Period and any
On-Time in TIMER_CTRL
Cyclic Wake starts / ends by
setting / clearing On-time
INTN is pulled low at every rising
edge of On-time except first one
Figure 20 Cyclic Wake: Configuration and Sequence
Note:
The on-time is only used to enable the cyclic wake function regardless of the value of the on time, i.e.
the on time value has no meaning to the cyclic wake function as long as it is not ‘000’ or ‘110’ or ‘111’.
As in cyclic sense, the cyclic wake function will start as soon as the on-time is configured. An interrupt is
generated for every start of the on-time except for the very first time when the timer is started.
5.7.3
Internal Timers
Two integrated timers can be used to control the below features:
•
•
Cyclic Wake, i.e. to wake up the microcontroller periodically in Normal Mode, Stop Mode and Sleep Mode.
Cyclic Sense, i.e. to perform cyclic sensing using the wake input WKx and the HSx by mapping the timer
accordingly via the HS_CTRL register.
Datasheet
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Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
System Features
5.8
VS Supply Multiplexing
VMAX SWITCH
+
-
1
0
VSINT
VS
INTERNAL SUPPLY
MUX
Figure 21 VS Supply Multiplexing
The internal supply voltage is multiplexed from VSINT and VS, choosing continuously the larger of both. In
case of transient low VBAT, the buffered supply voltage takes over the internal supply, avoiding loss of power.
Note:
Only the internal digital logic of the device is supplied by the VMAX SWITCH. In case of a power loss
of either VS or VSINT, the internal register values will not be lost.
Datasheet
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Rev.1.0
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TLE9561QX
DC Motor System IC
Voltage Regulator 1
6
Voltage Regulator 1
6.1
Block Description
VCC1
VSINT
Vref
1
Overtemperature
Shutdown
State
Machine
Bandgap
Reference
INH
GND
Figure 22 Module Block Diagram
Functional Features
•
•
5 V low-drop voltage regulator.
Undervoltage monitoring with adjustable reset level and VCC1 undervoltage prewarning (refer to
Chapter 12.7 and Chapter 12.8 for more information).
•
•
Short circuit detection and switch off with undervoltage fail threshold, device enters Fail-Safe Mode.
Effective capacitance must be ≥ 1 µF at nominal voltage output for stability. A 2.2 µF ceramic capacitor
(MLCC) is recommended for best transient response.
•
Output current capability up to IVCC1,lim.
Datasheet
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Rev.1.0
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TLE9561QX
DC Motor System IC
Voltage Regulator 1
6.2
Functional Description
The Voltage Regulator 1 (=VCC1) is “ON” in Normal Mode and Stop Mode and is disabled in Sleep Mode and in
Fail-Safe Mode. The regulator can provide an output current up to IVCC1,lim
.
For low-quiescent current reasons, the output voltage tolerance is decreased in Stop Mode because only the
less accurate low-power mode regulator will be active for small loads. If the load current on VCC1 exceeds the
selected threshold (IVCC1,Ipeak1,r or IVCC1,Ipeak2,r) then the high-power mode regulator will be also activated to
support an optimum dynamic load behavior. The current consumption will then increase (approx. 2.8 mA
additional quiescent current). The device mode stays unchanged.
If the load current on VCC1 falls below the selected threshold (IVCC1,Ipeak1,f or IVCC1,Ipeak2,f), then the low-quiescent
current mode is resumed again by disabling the high-power mode regulator.
Both regulators (low-power mode and high-power mode) are active in Normal Mode.
Two different active peak thresholds can be selected via SPI:
•
I_PEAK_TH = ‘0’(default): the lower VCC1 active peak threshold 1 is selected with lowest quiescent current
consumption in Stop Mode.
•
I_PEAK_TH = ‘1’: the higher VCC1 active peak threshold 2 is selected with an increased quiescent current
consumption in Stop Mode.
Datasheet
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Rev.1.0
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TLE9561QX
DC Motor System IC
Voltage Regulator 1
6.3
Electrical Characteristics
Table 12 Electrical Characteristics
VSINT = 5.5 V to 28 V; Tj = -40°C to +150°C; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified).
Parameter
Symbol
Values
Unit Note or
Test Condition
Number
Min. Typ. Max.
Output Voltage including Line VCC1,out1
and Load Regulation
4.9
5.0
5.0
–
5.1
V
V
V
1)Normal Mode; 10 µA < P_6.3.1
IVCC1 < 150 mA;
Output Voltage including Line VCC1,out2
and Load Regulation
(Full Load Current Range)
4.9
5.1
1)Normal Mode;
P_6.3.2
6 V < VSINT < 28 V;
10 µA < IVCC1 < 250 mA
2)Normal Mode; 20 mA P_6.3.3
< IVCC1 < 80 mA;
Output Voltage including Line VCC1,out3
and Load Regulation
4.95
5.05
(Higher Accuracy Rage)
8 V < VSINT < 18 V;
25°C < Tj < 150°C
Output Voltage including Line VCC1,out4
and Load Regulation
4.9
5.05 5.2
V
Stop Mode;
10 µA < IVCC1 < IVCC1,Ipeak
P_6.3.4
(low-power mode)
Output Drop Voltage
Output Drop Voltage
VCC1,d1
VCC1,d2
–
–
–
200
300
400
500
mV
mV
mA
IVCC1 = 50 mA,
VSINT = 5 V
P_6.3.9
IVCC1 = 150 mA,
VSINT = 5 V
2)
P_6.3.10
P_6.3.17
VCC1 Active Peak Threshold 1 IVCC1,Ipeak1,r
(Transition threshold
3.25 5.0
I
rising;
CC1
VSINT = 13.5 V;
between low-power and high-
power mode regulator)
I_PEAK_TH = ‘0’
2)
VCC1 Active Peak Threshold 1 IVCC1,Ipeak1,f 1.2
(Transition threshold
between high-power and low-
power mode regulator)
1.7
–
–
mA
mA
mA
mA
I
falling;
P_6.3.18
P_6.3.19
P_6.3.20
CC1
V
SINT = 13.5V;
I_PEAK_TH = ‘0’
2)
VCC1 Active Peak Threshold 2 IVCC1,Ipeak2,r
(Transition threshold
between low-power and high-
power mode regulator)
6
5
20
15
500
I
rising;
CC1
V
SINT = 13.5 V;
I_PEAK_TH = ‘1’
2)
VCC1 Active Peak Threshold 2 IVCC1,Ipeak2,f
(Transition threshold
between high-power and low-
power mode regulator)
–
I
falling;
CC1
V
SINT = 13.5V;
I_PEAK_TH = ‘1’
Overcurrent Limitation
IVCC1,lim
260 360
current following out of P_6.3.21
pin, VCC1= 0V 2)
Datasheet
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Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
Voltage Regulator 1
Table 12 Electrical Characteristics (cont’d)
VSINT = 5.5 V to 28 V; Tj = -40°C to +150°C; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified).
Parameter
Symbol
Values
Unit Note or
Test Condition
Number
Min. Typ. Max.
2)
MinimumOutputCapacitance CVCC1,min
for stability
13)
–
–
µF
P_6.3.22
P_6.3.23
2)
Maximum Output
Capacitance
CVCC1,max
–
–
47
µF
1) In Stop Mode, the specified output voltage tolerance applies when IVCC1 has exceeded the selected active peak
threshold (IVCC1,Ipeak1,r or IVCC1,Ipeak2,r) but with increased current consumption.
2) Not subject to production test, specified by design.
3) Value is meant to be an effective value at rated output voltage level.
Datasheet
44
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
High-Side Switch
7
High-Side Switch
7.1
Block Description
VSHS
HSx
HS Gate Control
Overcurrent Detection
Open Load (On)
Figure 23 High-Side Module Block Diagram
Features
•
•
•
•
•
•
•
•
All HSx supplied by VSHS
Under voltage switch off configurable via SPI.
Dedicated over voltage switch off per each HSx in Normal Mode- configurable via SPI.
Overvoltage switch off in Stop Mode and Sleep Mode- configurable via SPI.
Overcurrent detection and switch off.
Open load detection in ON-state.
PWM capability with internal or external timers configurable via SPI.
Switch recovery after removal of OV or UV condition configurable via SPI.
7.2
Functional Description
The High-Side switches can be used for control of LEDs, as supply for the wake inputs and for other loads
(except inductive load). The High-Side outputs can be controlled either directly via SPI by the integrated
timers or by the integrated PWM generators or by external sync signal (using WK4/SYNC pin).
The high-side outputs are supplied by VSHS pin. The topology supports improved cranking condition
behavior.
The configuration of the High-Sides (Permanent On, PWM, cyclic sense, etc.) drivers must be done in Normal
Mode. The configuration is taken over in Stop Mode or Sleep Mode and cannot be modified. When entering
Restart Mode or Fail-Safe Mode the HSx outputs are disabled.
Datasheet
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Rev. 1.0
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TLE9561QX
DC Motor System IC
High-Side Switch
7.2.1
Under Voltage Switch Off
All HS drivers in on-state are switched off in case of under voltage on VSHS. The feature can be disabled by
setting the SPI bit HS_UV_SD_DIS .
After release of under voltage condition, the HSx switch goes back to programmed state in which it was
configured via SPI. This behavior is only valid if the bit HS_UV_REC is set. Otherwise the switches will stay off
and the respective SPI control bits are cleared.
The under voltage is signaled in the bit HS_UV, no other error bits are set.
7.2.2
Over Voltage Switch Off
The HS drivers in on-state are switched off in case of over voltage on VSHS.. In Normal Mode the HSx can be
kept in on-state above the VSHS overvoltage threshold if the HSx_OV_SDN_DIS bit is set.
In Stop Mode or Sleep Modes all HS drivers can be kept in on-state if HS_OV_SDS_DIS bit is set.
When the HSx are configured to switch off in case of over voltage condition, after release of over voltage
condition, the HS switch goes back to programmed state in which it was configured via SPI. This behavior is
only valid if the respective bit HSx_OV_REC is set. Otherwise the switch will stay off and the respective SPI
control bits are cleared. This configuration is available for each HSx.
The over voltage is signaled in the bit HS_OV, no other error bits are set.
7.2.3
Over Current Detection and Switch Off
If the load current exceeds the over current shutdown threshold for a time longer then the over current
shutdown filter time the output is switched off.
The over current condition and the switch off is signaled with the respective HSx_OC_OT bit in the register
HS_OL_OC_OT_STAT. The HSx configuration is then reset to 000 by the device. To activate the High-Side
again the HSx configuration has to be set to ON (001) or be programmed to a timer function. It is
recommended to clear the over current bit before activation the High-Side switch, as the bits are not cleared
automatically by the device.
7.2.4
Open Load Detection
Open load detection on the High-Side outputs is done during on state of the output. If the current in the
activated output falls below the open load detection current threshold, the open load is detected and signaled
via the respective bit HS1_OL, HS2_OL, HS3_OL, or HS4_OL in the register HS_OL_OC_OT_STAT. The High-
Side output stays activated.. If the open load condition disappears the Open Load bit in the SPI can be cleared.
The bits are not cleared automatically by the device.
7.2.5
PWM, Timer and SYNC Function
Each integrated HSx can be configured in different ways, in particular:
•
•
•
•
•
•
•
•
Static OFF
Static ON
Timer 1
Timer 2
Internal generator PWM1
Internal generator PWM2
Internal generator PWM3
Internal generator PWM4
Datasheet
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TLE9561QX
DC Motor System IC
High-Side Switch
•
SYNC (via WK4)
Note:
PWMx mentioned in this chapter refer to the internal PWM generators, which are configured by the
registers HS_CTRL and PWM_CTRL. They can be used to control the internal high-side switches HSx.
Note:
PWMx mentioned in this chapter do not refer to the PWMx pins. The PWMx pins are used for the PWM
operation of the bridge drivers, to control the external MOSFETs.
Static configuration (ON/OFF)
This configuration set the HSx permanently ON or OFF. This configuration is available in Normal Mode, Stop
Mode and Sleep Mode.
The configuration shall be done via SPI.
Timer configuration (TIMER1 or TIMER2)
Two Timers are dedicated to control the ON phase of dedicated HS outputs.
The Timers are mapped to the dedicated HS outputs. Period and the duty cycle can be independently
configured with via SPI.
PWM configuration (PWM1..PWM4)
Several internal PWM generators are dedicated to generate a PWM signal on the HSx output, e.g. for brightness
adjustment or compensation of supply voltage fluctuation. The PWM generators are mapped to the dedicated
HS outputs, and the duty cycle can be independently configured with a 10-bit resolution via SPI (PWM_CTRL).
Two different frequencies can be selected independently for every PWM generator in the register PWM_CTRL.
In order to assign and configure the PWMx to specific HSX, the follow steps have to be followed:
•
•
•
Configure duty cycle and frequency for respective PWM generator in PWM_CTRL.
Assign PWM generator to respective HS switch(es) in HSx_CTRL.
The PWM generation will start right after the HSx is assigned to the PWM generator (HS_CTRL) .
Note:
The min. on-time during PWM is limited by the actual on- and off-time of the respective HS switch,
e.g. the PWM setting ‘00 0000 0001’ could not be realized.
SYNC configuration (using WK4)
Another possible configuration is to use the WK4 (set as SYNC pin) and mapped to one dedicated HSx output.
The configuration of the WK4/SYNC bit is done using the WK_EN bits. If the WK_EN=10B (SYNC selected), all
bits in WK4 bank are ignored and wake-up capability on WK4 is not available.
Only after the WK4/SYNC configuration, the HSx can be configured for SYNC usage (HSx = 1000B).
Datasheet
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Rev. 1.0
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TLE9561QX
DC Motor System IC
High-Side Switch
7.3
Electrical Characteristics
Table 13
Electrical Characteristics
VSINT = 5.5 V to 28 V; Tj = -40°C to +150°C; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter
Symbol
Values
Typ.
Unit Note or
Test Condition
Number
Min.
Max.
Output HS1, HS2, HS3, HS4
Static Drain-Source ON
Resistance HSx
RON,HS25
RON,HS150
Ileak,HS
–
–
–
7
–
Ω
Ids = 60 mA,
Tj < 25°C
P_7.3.1
P_7.3.2
P_7.3.3
Static Drain-Source ON
Resistance HSx
11.5
–
16
2
Ω
Ids = 60 mA,
Tj < 150°C
1)0 V < VHSx
Leakage Current HSx / per
channel
µA
< VS_HS
;
Tj < 85°C
Output Slew Rate (rising)
Output Slew Rate (falling)
Switch-on time HSx
SRraise,HS
SRfall,HS
tON,HS
0.8
-2.5
3
–
–
–
2.5
-0.8
30
V/µs 1)20 to 80%
VSHS = 6 to 18 V
RL = 220 Ω
P_7.3.4
P_7.3.5
P_7.3.6
V/µs 1)80 to 20%
VSHS = 6 to 18 V
RL = 220 Ω
µs
µs
CSN = HIGH to
0.8 × VSHS;
RL = 220 Ω;
VSHS = 6 to 18 V
Switch-off time HSx
tOFF,HS
3
–
30
CSN = HIGH to
0.2 × VSHS;
P_7.3.7
RL = 220 Ω;
VSHS = 6 to 18 V
Short Circuit Shutdown
Current
ISD,HS
150
12
245
16
300
22
2
mA
µs
VSHS = 6 to 20 V
P_7.3.8
P_7.3.9
P_7.3.10
P_7.3.11
P_7.3.12
2)
Short Circuit Shutdown
Filter Time
tSD,HS
Open Load Detection
Current
IOL,HS
0.4
–
–
mA
mA
µs
hysteresis
included
1)
Open Load Detection
hysteresis
IOL,HS,hys
0.45
220
–
2)
Open Load Detection Filter tOL,HS
160
270
Time
1) Not subject to production test, specified by design.
2) Not subject to production test, tolerance defined by internal oscillator tolerance.
Datasheet
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Rev. 1.0
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TLE9561QX
DC Motor System IC
High Speed CAN Transceiver
8
High Speed CAN Transceiver
8.1
Block Description
VCAN
VCC1
SPI Mode
Control
RTD
Driver
CANH
CANL
Output
Stage
TXDCAN
Temp.-
Protection
+
timeout
To SPI diagnostic
VCAN
VCC1
RXDCAN
MUX
Receiver
Vs
Wake
Receiver
Figure 24 Functional Block Diagram
8.2
Functional Description
The Controller Area Network (CAN) transceiver part of the device provides High-Speed (HS) differential mode
data transmission (up to 2 Mbaud/s) and reception in automotive and industrial applications. It works as an
interface between the CAN protocol controller and the physical bus lines compatible to ISO11898-2:2016 and
SAE J2284.
The CAN FD transceiver offers low-power modes to reduce current consumption. This supports networks with
partially powered down nodes. To support software diagnostic functions, a CAN Receive Only Mode is
implemented.
It is designed to provide excellent passive behavior when the transceiver is switched off (mixed networks,
clamp 15/30 applications).
A wake-up from the CAN Wake Capable Mode is possible via a message on the bus. Thus, the microcontroller
can be powered down or idled and is woken up by the CAN bus activities.
The CAN transceiver is designed to withstand the severe conditions of automotive applications and to support
12 V applications.
Datasheet
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Rev.1.0
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DC Motor System IC
High Speed CAN Transceiver
The transceiver can also be configured to Wake Capable in order to save current and to ensure a safe transition
from Normal Mode to Sleep Mode (to avoid loosing messages).
Figure 25 shows the possible transceiver mode transition when changing the device mode.
Device Mode
CAN Transceiver Mode
Stop Mode
Receive Only Wake Capable Normal Mode
OFF
OFF
Normal Mode
Sleep Mode
Receive Only Wake Capable Normal Mode
Wake Capable
OFF
OFF
Woken1
Restart Mode
Fail-Safe Mode
Wake Capable
1after a wake event on CAN Bus
Behavior after Restart Mode - not coming from Sleep Mode due to a wake up of the respective transceiver:
If the transceivers had been configured to Normal Mode, or Receive Only Mode, then the mode will be changed to Wake
Capable. If it was Wake Capable, then it will remain Wake Capable. If it had been OFF before Restart Mode, then it will
remain OFF.
Behavior in Software Development Mode:
CAN default value in INIT MODE and entering Normal Mode from Init Mode is ON instead of OFF.
Figure 25 CAN Mode Control Diagram
CAN FD Support
CAN FD stands for ‘CAN with Flexible Data Rate’. It is based on the well established CAN protocol as specified
in ISO11898-2:2016. CAN FD still uses the CAN bus arbitration method. The benefit is that the bit rate can be
increased by switching to a shorter bit time at the end of the arbitration process and then to return to the
longer bit time at the CRC delimiter, before the receivers transmit their acknowledge bits. See also Figure 26.
In addition, the effective data rate is increased by allowing longer data fields. CAN FD allows the transmission
of up to 64 data bytes compared to the 8 data bytes from the standard CAN.
Standard CAN
message
Data phase
(Byte 0 – Byte 7)
CAN Header
CAN Footer
Example:
- 11bit identifier + 8Byte data
CAN FD with
reduced bit time
Data phase
(Byte 0 – Byte 7)
CAN Header
CAN Footer
- Arbitration Phase
- Data Phase
500kbps
2Mbps
à average bit rate
1.14Mbps
Figure 26 Bit Rate Increase with CAN FD vs. Standard CAN
Datasheet
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Rev.1.0
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TLE9561QX
DC Motor System IC
High Speed CAN Transceiver
Not only the physical layer must support CAN FD but also the CAN controller. In case the CAN controller is not
able to support CAN FD then the respective CAN node must at least tolerate CAN FD communication. This CAN
FD tolerant mode is realized in the physical layer.
8.2.1
CAN OFF Mode
The CAN OFF Mode is the default mode after power-up of the device. It is available in all device modes and is
intended to completely stop CAN activities or when CAN communication is not needed. In CAN OFF Mode, a
wake-up event on the bus will be ignored.
8.2.2
CAN Normal Mode
The CAN Transceiver is enabled via SPI in Normal Mode. CAN Normal Mode is designed for normal data
transmission/reception within the HS-CAN network. The mode is available in Normal Mode and in Stop Mode.
The bus biasing is set to VCAN/2.
Transmission
The signal from the microcontroller is applied to the TXDCAN input of the device. The bus driver switches the
CANH/L output stages to transfer this input signal to the CAN bus lines.
Enabling sequence
The CAN transceiver requires an enabling time tCAN,EN before a message can be sent on the bus. This means
that the TXDCAN signal can only be pulled low after the enabling time. If this is not ensured, then the TXDCAN
needs to be set back to high (=recessive) until the enabling time is completed. Only the next dominant bit will
be transmitted on the bus. Figure 27 shows different scenarios and explanations for CAN enabling.
V
TXDCAN
t
CAN
Mode
t CAN,EN
tCAN,EN
t CAN,EN
CAN
NORMAL
CAN
OFF
t
t
V
CANDIFF
Dominant
Recessive
recessive
TXDCAN
level required
recessive TXDCAN
level required bevor
start of transmission
Correct sequence ,
Bus is enabled after tCAN,
tCAN, EN not ensured , no
transmission on bus
tCAN, EN not ensured ,
no transmission on bus
EN
Figure 27 CAN Transceiver Enabling Sequence
Reduced Electromagnetic Emission
To reduce electromagnetic emissions (EME), the bus driver controls CANH/L slopes symmetrically.
Reception
Analog CAN bus signals are converted into digital signals at RXDCAN via the differential input receiver.
8.2.3
CAN Receive Only Mode
In CAN Receive Only Mode (RX only), the driver stage is de-activated but reception is still operational. This
mode is accessible by an SPI command in Normal Mode and in Stop Mode.
Datasheet
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Rev.1.0
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TLE9561QX
DC Motor System IC
High Speed CAN Transceiver
Note:
The transceiver is still properly working in CAN Receive Only Mode even if VCAN is not available
because of an independent receiver supply.
8.2.4
CAN Wake Capable Mode
This mode can be used in Stop Mode, Sleep Mode, Restart Mode and Normal Mode by programming via SPI
and it is used to monitor bus activities. It is automatically accessed in Fail-Safe Mode. A wake-up signal on the
bus results in a change of behavior of the device, as described in Table 14. As a signalization to the
microcontroller, the RXDCAN pin is set low and will stay low until the CAN transceiver is changed to any other
mode. After a wake-up event, the transceiver can be switched to CAN Normal Mode via SPI for bus
communication.
As shown in Figure 28, a wake-up pattern (WUP) is signaled on the bus by two consecutive dominant bus
levels for at least tWake1 (wake-up time) and less than tWake2, each separated by a recessive bus level of greater
than tWake1 and shorter than tWake2
.
Entering CAN wake
capable
Bus recessive > tWAKE1
Ini
Wait
Bias off
Bias off
Bus dominant > tWAKE1
optional:
tWAKE2 expired
1
Bias off
Bus recessive > tWAKE1
optional:
tWAKE2 expired
2
Bias off
Bus dominant > tWAKE1
Entering CAN Normal
or CAN Recive Only
3
Bias on
Figure 28 CAN Wake-up Pattern Detection according to the Definition in ISO11898-2:2016
Rearming the Transceiver for Wake Capability
After a BUS wake-up event, the transceiver is woken. However, the CAN transceiver mode bits will still show
wake capable (=‘01’) so that the RXDCAN signal will be pulled low. There are two possibilities how the CAN
transceiver’s wake capable mode is enabled again after a wake-up event:
•
The CAN transceiver mode must be toggled, i.e. switched from CAN Wake Capable Mode to CAN Normal
Mode, CAN Receive Only Mode or CAN OFF Mode, before switching to CAN Wake Capable Mode again.
•
Rearming is done automatically when the device is changed to Stop Mode, Sleep Mode or Fail-Safe Mode
to ensure wake-up capability.
Datasheet
52
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
High Speed CAN Transceiver
Wake-Up in Stop Mode and Normal Mode
In Stop Mode, if a wake-up is detected, it is always signaled by the INTN output and in the WK_STAT SPI
register. It is also signaled by RXDCAN pulled to low. The same applies for the Normal Mode. The
microcontroller should set the device from Stop Mode to Normal Mode, there is no automatic transition to
Normal Mode.
For functional safety reasons, the watchdog will be automatically enabled in Stop Mode after a bus wake-up
event in case it was disabled before (if bit WD_EN_ WK_BUS was configured to high before).
Wake-Up in Sleep Mode
Wake-up is possible via a CAN message. The wake-up automatically transfers the device into the Restart Mode
and from there to Normal Mode the corresponding RXDCAN pin is set to low. The microcontroller is able to
detect the low signal on RXDCAN and to read the wake source out of the WK_STAT register via SPI. No interrupt
is generated when coming out of Sleep Mode. The microcontroller can now for example switch the CAN
transceiver into CAN Normal Mode via SPI to start communication.
Table 14 Action due to CAN Bus Wake-Up
Mode
Mode after Wake
Normal Mode
Stop Mode
VCC1
INTN
Low
Low
RXDCAN
Low
Normal Mode
Stop Mode
Sleep Mode
Restart Mode
Fail-Safe Mode
On
On
Low
Restart Mode
Restart Mode
Restart Mode
Ramping Up
On
High
High
High
Low
Low
Ramping Up
Low
8.2.5
CAN Bus termination
In accordance with the CAN configuration, four types of bus terminations are allow:
•
•
CAN Normal Mode: VCAN/2 termination.
CAN Receive Only Mode: VCAN/2 termination in case that VCAN is nominal supply.
when VCAN UV is detected, the termination is 2.5 V.
•
•
CAN Wake Capable Mode: GND termination: after wake-up, the termination is 2.5 V.
CAN OFF Mode: no termination necessary (bus floating).
When entering CAN Wake Capable Mode the termination is only connected to GND after the t_silence time has
expired.
8.2.6
TXD Time-out Feature
If the TXDCAN signal is dominant for a time t > tTXDCAN_TO, in CAN Normal Mode, the TXDCAN time-out function
deactivates the transmission of the signal at the bus setting the TXDCAN pin to recessive. This is implemented
to prevent the bus from being blocked permanently due to an error. The transmitter is disabled and thus
switched to recessive state. The CAN SPI control bits (CAN on BUS_CTRL) remain unchanged and the failure
is stored in the SPI flag CAN_FAIL. The CAN transmitter stage is activated again after the dominant time-out
condition is removed and the transceiver is automatically switched back to CAN Normal Mode.
8.2.7
Bus Dominant Clamping
If the CAN bus is dominant for a time t > tBUS_CAN_TO, when CAN is configured as CAN Normal Mode or CAN
Receive Only Mode, a bus dominant clamping is detected and the SPI bit CAN_FAIL is set. The transceiver
configuration stays unchanged. In order to avoid that a bus dominant clamping is detected due to a TXD time-
out the bus dominant clamping filter time tBUS_CAN_TO > tTXDCAN_TO
.
Datasheet
53
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
High Speed CAN Transceiver
8.2.8
Undervoltage Detection
The voltage at the CAN supply pin is monitored in CAN Normal Mode and CAN Receive Only Mode. In case of
VCAN undervoltage a signalization via SPI bit VCAN_UV is triggered and the TLE9561QX disables the
transmitter stage. If the CAN supply reaches a higher level than the undervoltage detection threshold (VCAN >
VCAN_UV), the transceiver is automatically switched back to CAN Normal Mode.
The undervoltage detection is enabled if the mode bit CAN_1 = ‘1’, i.e. in CAN Normal or CAN Receive Only
Mode. .
8.3
Electrical Characteristics
Table 15 Electrical Characteristics
Tj = -40°C to +150°C; VSINT = 5.5 V to 28 V; VCAN = 4.75 V to 5.25 V; RL = 60 Ω; CAN Normal Mode; all voltages with
respect to ground, positive current flowing into pin (unless otherwise specified)
Parameter
Symbol
Values
Typ.
Unit Note or
Test Condition
Number
Min.
Max.
CAN Bus Receiver
Differential Receiver
Threshold Voltage,
recessive to dominant edge
Vdiff,rd_N
–
0.80
0.60
–
0.90
V
V
V
Vdiff = VCANH - VCANL;
-12 V ≤ VCM(CAN)
≤ 12 V;
P_8.3.1
CAN Normal Mode
Differential Receiver
Threshold Voltage,
dominant to recessive edge
Vdiff,dr_N
0.50
–
Vdiff = VCANH -VCANL
-12 V ≤ VCM(CAN)
≤ 12 V;
;
P_8.3.2
CAN Normal Mode
Dominant state differential Vdiff_D_range 0.9
8.0
Vdiff = VCANH - VCANL
;
P_8.3.60
input voltage range
-12 V ≤ VCM(CAN) ≤
+12 V;
CAN Normal Mode
4)
Common Mode Range
CMR
-12
–
–
12
V
V
P_8.3.3
Recessive state differential Vdiff_R_range -3.0
0.5
Vdiff = VCANH - VCANL
;
P_8.3.61
input voltage range
-12 V ≤ VCM(CAN) ≤
+12 V;
CAN Normal Mode
4)
Maximum Differential Bus
Voltage
Vdiff,max
Ri
-5
–
10
50
V
P_8.3.4
CANH, CANL Input
Resistance
20
40
kΩ
CAN Normal / Wake P_8.3.5
Capable Mode;
Recessive state
-2V ≤ VCANH/L ≤ +7V
Differential Input Resistance Rdiff
40
-3
80
100
3
kΩ
CAN Normal / Wake P_8.3.6
Capable Mode;
Recessive state
-2V ≤ VCANH/L ≤ +7V
Input Resistance Deviation DRi
between CANH and CANL
–
%
4)Recessive state
CANH = VCANL = 5V
P_8.3.7
V
Datasheet
54
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
High Speed CAN Transceiver
Table 15 Electrical Characteristics (cont’d)
Tj = -40°C to +150°C; VSINT = 5.5 V to 28 V; VCAN = 4.75 V to 5.25 V; RL = 60 Ω; CAN Normal Mode; all voltages with
respect to ground, positive current flowing into pin (unless otherwise specified)
Parameter
Symbol
Values
Typ.
20
Unit Note or
Test Condition
Number
Min.
Max.
1)
Input Capacitance CANH,
CANL versus GND
Cin
–
40
pF
pF
V
V
= 5 V
P_8.3.8
P_8.3.9
P_8.3.10
TXDCAN
1)
Differential Input
Capacitance
Cdiff
–
–
10
20
V
= 5 V
TXDCAN
Wake-up Receiver
Threshold Voltage,
Vdiff, rd_W
0.8
1.15
-12 V ≤ VCM(CAN)
≤ 12 V;
recessive to dominant edge
CAN Wake Capable
Mode
Wake-up Receiver Dominant Vdiff,D_range_ 1.15
–
8.0
0.4
V
V
V
-12 V ≤ VCM(CAN) ≤
+12 V;
CAN Wake Capable
Mode
P_8.3.62
P_8.3.11
P_8.3.63
state differential input
W
voltage range
Wake-up Receiver
Vdiff, dr_W
0.4
0.7
–
-12 V ≤ VCM(CAN)
≤ 12 V;
CAN Wake Capable
Mode
Threshold Voltage,
dominant to recessive edge
Wake-up Receiver Recessive Vdiff,R_range_W -3.0
state differential input
-12 V ≤ VCM(CAN) ≤
+12 V;
voltage range
CAN Wake Capable
Mode
CAN Bus Transmitter
CANH/CANL Recessive
Output Voltage
(CAN Normal Mode)
VCANL/H_NM 2.0
–
–
3.0
0.1
V
V
CAN Normal Mode
P_8.3.12
P_8.3.13
VTXDCAN = Vcc1
;
no load
CANH/CANL Recessive
Output Voltage
VCANL/H_LP
-0.1
CAN Wake Capable
Mode;
(CAN Wake Capable Mode)
V
TXDCAN = Vcc1
no load
CAN Normal Mode;
;
CANH, CANL Recessive
Output Voltage Difference
Vdiff = VCANH - VCANL
Vdiff_r_N
-500
-200
–
–
50
mV
mV
P_8.3.14
P_8.3.15
VTXDCAN = Vcc1
no load
;
(CAN Normal Mode)
CANH, CANL Recessive
Output Voltage Difference
Vdiff = VCANH - VCANL
Vdiff_r_W
200
CAN Wake Capable
Mode;
VTXDCAN = Vcc1
;
(CAN Wake Capable Mode)
no load
CANL Dominant Output
Voltage
VCANL
0.5
–
2.25
V
4)CAN Normal Mode; P_8.3.16
TXDCAN = 0 V;
V
VCAN = 5 V;
50 Ω ≤ RL ≤ 65 Ω
Datasheet
55
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
High Speed CAN Transceiver
Table 15 Electrical Characteristics (cont’d)
Tj = -40°C to +150°C; VSINT = 5.5 V to 28 V; VCAN = 4.75 V to 5.25 V; RL = 60 Ω; CAN Normal Mode; all voltages with
respect to ground, positive current flowing into pin (unless otherwise specified)
Parameter
Symbol
Values
Typ.
–
Unit Note or
Test Condition
Number
Min.
Max.
CANH Dominant Output
Voltage
VCANH
2.75
4.5
V
V
V
4)CAN Normal Mode; P_8.3.17
VTXDCAN = 0 V;
VCAN = 5 V;
50 Ω ≤ RL ≤ 65 Ω
4)CAN Normal Mode; P_8.3.18
VTXDCAN = 0 V;
CANH, CANL Dominant
Output Voltage Difference
Vdiff = VCANH - VCANL
Vdiff_d_N
1.5
1.5
2.0
–
2.5
5.0
VCAN = 5 V;
50 Ω ≤ RL ≤ 65 Ω
4)CAN Normal Mode; P_8.3.19
CANH, CANL Dominant
Output Voltage Difference
(resistance during
arbitration)
Vdiff_d_N
VTXDCAN = 0 V;
VCAN = 5 V; RL = 2240 Ω
Vdiff = VCANH - VCANL
CANH, CANL output voltage Vdiff_slope_rd
difference slope, recessive
to dominant
–
–
–
–
70
70
5.5
V/us 4)30% to 70% of
measured
P_8.3.54
P_8.3.55
differential bus
voltage,
CL = 100 pF, RL = 60 Ω
CANH, CANL output voltage Vdiff_slope_dr
difference slope, dominant
to recessive
–
V/us 4)70% to 30% of
measured
differential bus
voltage,
CL = 100 pF, RL = 60 Ω
Driver Symmetry
SYM = VCANH + VCANL
VSYM
4.5
V
2)CAN Normal Mode; P_8.3.21
TXDCAN = 0 V / 5 V;
VCAN = 5 V;
SPLIT = 4.7 nF;
V
V
C
50 Ω ≤ RL ≤ 60 Ω;
CANH Short Circuit Current ICANHsc
CANL Short Circuit Current ICANLsc
-115
50
–
-80
80
5
-50
115
7.5
mA
mA
µA
CAN Normal Mode;
P_8.3.22
P_8.3.23
P_8.3.24
V
CANHshort = -3 V
CAN Normal Mode;
CANLshort = 18 V;
V
Leakage Current
ICANH,lk
ICANL,lk
VS = VCAN = 0 V;
0 V ≤ VCANH,L ≤ 5 V;
3)
R
= 0 / 47kΩ
test
Receiver Output RXDCAN
High level Output Voltage
VRXDCAN,H
VRXDCAN,L
0.8 ×
VCC1
–
–
–
V
V
CAN Normal Mode;
RXDCAN = -2 mA
CAN Normal Mode;
IRXDCAN = 2 mA
P_8.3.26
P_8.3.27
I
Low Level Output Voltage
–
0.2 ×
Vcc1
Datasheet
56
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
High Speed CAN Transceiver
Table 15 Electrical Characteristics (cont’d)
Tj = -40°C to +150°C; VSINT = 5.5 V to 28 V; VCAN = 4.75 V to 5.25 V; RL = 60 Ω; CAN Normal Mode; all voltages with
respect to ground, positive current flowing into pin (unless otherwise specified)
Parameter
Symbol
Values
Typ.
Unit Note or
Test Condition
Number
Min.
Max.
Transmission Input TXDCAN
High Level Input Voltage
Threshold
VTXDCAN,H
VTXDCAN,L
VTXDCAN,hys
–
–
–
0.7 ×
Vcc1
V
V
V
CAN Normal Mode;
recessive state
P_8.3.28
P_8.3.29
P_8.3.30
Low Level Input Voltage
Threshold
0.3 ×
Vcc1
–
CAN Normal Mode;
dominant state
4)
TXDCAN Input Hysteresis
–
0.12 ×
–
Vcc1
TXDCAN Pull-up Resistance RTXDCAN
TXDCAN input capacitance CTXDCAN
20
–
50
6
80
10
18
kΩ
pF
µs
-
P_8.3.31
P_8.3.64
4)
CAN Transceiver Enabling
Time
tCAN,EN
8
12
6) CSN = high to first P_8.3.32
valid transmitted
TXDCAN dominant
Dynamic CAN-Transceiver Characteristics
Min. Dominant Time for Bus tWake1
Wake-up
0.5
–
1.8
µs
-12 V ≤ VCM(CAN)
≤ 12 V;
P_8.3.33
CAN Wake Capable
Mode
Wake-up Time-out,
Recessive Bus
tWake2
tLOOP,f
0.8
–
–
10
ms
ns
6)CAN Wake Capable P_8.3.34
Mode
2)CAN Normal Mode; P_8.3.35
CL = 100 pF;
Loop delay
(recessive to dominant)
150
255
RL = 60 Ω;
VCAN = 5 V;
CRXDCAN = 15 pF
Loop delay
(dominant to recessive)
tLOOP,r
–
150
255
ns
2)CAN Normal Mode; P_8.3.36
CL = 100 pF;
RL = 60 Ω;
VCAN = 5 V;
CRXDCAN = 15 pF
Propagation Delay
TXDCAN low to bus
dominant
td(L),T
–
–
50
50
140
140
ns
ns
CAN Normal Mode;
CL = 100 pF;
RL = 60 Ω;
P_8.3.37
P_8.3.38
VCAN = 5 V
Propagation Delay
TXDCAN high to bus
recessive
td(H),T
CAN Normal Mode;
CL = 100 pF;
RL = 60 Ω;
VCAN = 5 V
Datasheet
57
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
High Speed CAN Transceiver
Table 15 Electrical Characteristics (cont’d)
Tj = -40°C to +150°C; VSINT = 5.5 V to 28 V; VCAN = 4.75 V to 5.25 V; RL = 60 Ω; CAN Normal Mode; all voltages with
respect to ground, positive current flowing into pin (unless otherwise specified)
Parameter
Symbol
Values
Typ.
100
Unit Note or
Test Condition
Number
Min.
Max.
Propagation Delay
bus dominant to RXDCAN
low
td(L),R
–
–
ns
ns
ns
CAN Normal Mode;
CL = 100 pF;
RL = 60 Ω;
P_8.3.39
VCAN = 5 V;
CRXDCAN = 15 pF
Propagation Delay
bus recessive to RXDCAN
high
td(H),R
–
100
–
–
CAN Normal Mode;
CL = 100 pF;
RL = 60 Ω;
P_8.3.40
P_8.3.42
VCAN = 5 V;
CRXDCAN = 15 pF
ReceivedRecessivebitwidth tbit(RXD)
400
550
CAN Normal Mode;
CL = 100 pF;
RL = 60 Ω ;
VCAN = 5 V;
CRXDCAN = 15 pF;
tbit(TXD) = 500 ns;
Parameter definition
in according to
Figure 30.
Transmitted Recessive bit
width
tbit(BUS)
435
–
530
ns
CAN Normal Mode;
CL = 100 pF;
P_8.3.43
RL = 60 Ω;
VCAN = 5 V;
CRXDCAN = 15 pF;
tbit(TXD) = 500 ns;
Parameter definition
in according to
Figure 30.
Receiver timing symmetry5) ∆tRec
-65
–
40
ns
CAN Normal Mode;
CL = 100 pF;
RL = 60 Ω;
P_8.3.44
VCAN = 5 V;
CRXDCAN = 15 pF;
tbit(TXD) = 500 ns;
Parameter definition
in according to
Figure 30.
Datasheet
58
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
High Speed CAN Transceiver
Table 15 Electrical Characteristics (cont’d)
Tj = -40°C to +150°C; VSINT = 5.5 V to 28 V; VCAN = 4.75 V to 5.25 V; RL = 60 Ω; CAN Normal Mode; all voltages with
respect to ground, positive current flowing into pin (unless otherwise specified)
Parameter
Symbol
Values
Typ.
–
Unit Note or
Test Condition
Number
Min.
Max.
ReceivedRecessive bit width tbit(RXD)
120
220
ns
ns
ns
CAN Normal Mode;
CL = 100 pF;
RL = 60 Ω ;
P_8.3.45
VCAN = 5 V;
CRXDCAN = 15 pF;
tbit(TXD) = 200 ns;
Parameter definition
in according to
Figure 30.
Transmitted Recessive bit
width
tbit(BUS)
155
-45
1.6
–
210
CAN Normal Mode;
CL = 100 pF;
RL = 60 Ω;
P_8.3.46
VCAN = 5 V;
CRXDCAN = 15 pF;
tbit(TXD) = 200 ns;
Parameter definition
in according to
Figure 30.
Receivertimingsymmetry∆t ∆tRec
Rec = t_bit(RXD) - t_bit(Bus)
–
15
CAN Normal Mode;
CL = 100 pF;
P_8.3.47
RL = 60 Ω;
V
CAN = 5 V;
CRXDCAN = 15 pF;
bit(TXD) = 200 ns;
t
Parameter definition
in according to
Figure 30.
TXDCAN Permanent
Dominant Time-out
tTXDCAN_TO
2.0
2.5
2.4
3.0
ms
ms
6)CAN Normal Mode P_8.3.48
BUS Permanent Dominant tBUS_CAN_TO 2.0
6)CAN Normal Mode P_8.3.49
Time-out
6)
Timeout for bus inactivity
Bus Bias reaction time
tSILENCE
tBias
0.6
–
–
–
1.2
s
P_8.3.50
6)
250
µs
P_8.3.51
1) Not subject to production test, specified by design, S2P - Method; f = 10 MHz
2) VSYM shall be observed during dominant and recessive state and also during the transition dominant to recessive and
vice versa while TXD is simulated by a square signal (50% duty cycle) with a frequency of up to 1 MHz (2MBit/s).
3) Rtests between (Vs /VCAN) and 0V (GND).
4) Not subject to production test, specified by design.
5) ∆tRec = tbit(RXD) - tbit(BUS)
.
6) Not subject to production test, tolerance defined by internal oscillator tolerance.
Datasheet
59
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
High Speed CAN Transceiver
V
TXDCAN
Vcc1
GND
t
t
VDIFF
td(L),T
td(H),T
V diff, rd_N
Vdiff, dr_N
t d(L),R
t d(H),R
tLOOP,f
tLOOP,r
VRXDCAN
V
cc1
0.8 x Vcc1
0.2 x Vcc1
GND
Figure 29 Timing Diagrams for Dynamic Characteristics
70%
TXDCAN
30%
tLoop_f
5x tBit(TXD)
tBit(TXD)
Vdiff=CANH-CANL
900mV
tBit(Bus)
500mV
70%
RXDCAN
30%
tLoop_r
tBit(RXD)
Figure 30 From ISO11898-2:2016: tloop, tbit(TXD), tbit(Bus), tbit(RXD) definitions
Datasheet
60
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
High-Voltage Wake Input
9
High-Voltage Wake Input
9.1
Block Description
Internal Supply
IPU_WK
WKx
+
-
tWK
IPD_WK
VRef
Logic
Figure 31 Wake Input Block Diagram
Features
•
•
•
•
•
•
High-Voltage inputs with a 3 V (typ.) threshold voltage except WK5 (0.5 × VSHS).
Wake-up capability for power saving modes.
Edge sensitive wake feature low to high and high to low.
Pull-up and Pull-down current sources except for WK5 (pull-up fixed), configurable via SPI.
Selectable configuration for static sense or cyclic sense.
In Normal Mode and Stop Mode the level of the WKx pin can be read via SPI unless WK4 is configured as
SYNC or WK2 is configured as FO.
•
•
Synchronization with HSx via WK4 (for cyclic sense).
Fail Safe Output configurability (only WK2).
Datasheet
61
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
High-Voltage Wake Input
9.2
High-Voltage Wake Function
9.2.1
Functional Description
The wake inputs pin are edge-sensitive inputs with a switching threshold of typically 3 V except WK5. Both
transitions, high to low and low to high, result in a signalization by the device. The signalization occurs either
in triggering the interrupt in Normal Mode and Stop Mode or by a wake up of the device in Sleep Mode and Fail-
Safe Mode.
Two different wake detection modes can be selected via SPI:
•
•
Static sense: WK inputs are always active.
Cyclic sense: WK inputs are only active for a certain time period (see Chapter 5.7.1).
A filter time tFWKx is implemented to avoid an unintentional wake-up due to transients or EMC disturbances
in static sense configuration.
The filter time (tFWKx) is triggered by a level change crossing the switching threshold and a wake signal is
recognized if the input level will not cross again the threshold during the selected filter time.
Figure 32 shows a typical wake-up timing and filtering of transient pulses.
VWKx
VWKTh,f
VWKth,f
t
t
VINTN
tFWK
tFWK
tINTN
No Wake Event
Wake Event
Figure 32 Wake-up Filter Timing for Static Sense
The wake-up capability for the WKx pin can be enabled or disabled via SPI command.
A wake event via the WKx pin can always be read in the register WK_STAT at the bit WK5_WU.
The actual voltage level of the WKx pin (low or high) can always be read in Normal Mode, Stop Mode and Init
Mode in the register WK_LVL_STAT. During Cyclic Sense, the register shows the sampled levels of the
respective WKx pin.
9.2.2
Wake Input Configuration
To ensure a defined and stable voltage levels at the internal comparator input it is possible to configure
integrated current sources via the SPI register WK_CTRL.
Datasheet
62
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
High-Voltage Wake Input
Table 16 Pull-Up / Pull-Down Resistor (not valid for WK5)
WKx_PUPD_ WKx_PUPD_ Current Sources Note
1
0
0
0
no current
source
WK input is floating if left open (default setting)
0
1
1
1
0
1
pull-down
pull-up
WK input internally pulled to GND
WK input internally pulled to internal 5V supply
Automatic
switching
If a high level is detected at the WK input the pull-up source is
activated, if low level is detected the pull down is activated.
Note:
If a WK input is not used, the respective WK input must be tied to GND on board to avoid unintended
floating state of the pin.
One additional configuration is related the filter time of each Wake-up module. The bits WK_FILT permit to set
the filter time in static sensing or in cyclic sensing.
Note:
When the device mode is changed to normal (from INIT), in case of static sense, if the WK pin is set,
the WK_STAT register is set in this time (also the interrupt pin).
9.2.3
Wake configuration for Cyclic Sense
The wake-up inputs can also be used for cyclical sensing signals during low-power modes. For this function
the WKx input performs a cyclic sensing of the voltage level during the on-time of specific HSx.
A transition of the voltage level will trigger a wake-up event.
See also Chapter 5.7.1 for more details.
9.2.4
Wake configuration for Synchronization
The WK4 pin can be configured as SYNC input for driving the HSx.
Prerequisite to configure the WK4 as SYNC input is that the WK4 has to be OFF.
The configuration of the WK4/SYNC bit is done using the WK_EN bits. if the WK_EN=10B (SYNC selected), all
bits in WK4 bank are ignored and wake-up capability on WK4 is not available.
Note:
If WKx is the only wake source available and is configured with cyclic sense with
SYNC (WKx_FILT = 100), trying to go to Sleep Mode is not possible (restart mode is entered) -
because SYNC is driven by the microcontroller which is not supplied in Sleep Mode.
9.2.5
Fail Safe Output Configuration
The WK2 is by default configured as Fail Safe Output. It is possible to configure the WK2/FO pin as wake-up
source using the WK2_FO bit.
As soon as the bit WK2_FO is written (first SPI write access of bank 2 on WK_CTRL), the configuration can be
changed only after a software reset or a new power-up sequence.
In case that the WK2_FO is locked, any attempt to configured again it will set the SPI_FAIL.
The Fail Output consists of a failure logic block and one LOW-side switch. In case of a failure, the FO output is
activated and the SPI bit FAILURE, in the register DEV_STAT, is set.
The Failure Output is activated due to the following failure conditions:
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DC Motor System IC
High-Voltage Wake Input
•
•
•
•
•
After four consecutive Watchdog Trigger failures.
Thermal Shutdown TSD2.
VCC1 short to GND.
VCC1 overvoltage in case VCC1_OV_MOD=11B.
after four consecutive VCC1 undervoltage detection.
In order to deactivate the Fail Output, the failure conditions (e.g. TSD2) must not be present anymore and the
bit FAILURE needs to be cleared via SPI command.
In case of Watchdog fail, the deactivation of the Fail Output is only allowed after a successful WD trigger, i.e.
the FAILURE bit must be cleared.
Note:
The internally stored default value used for the wake-enabled configuration is ‘low’. A level change
will be signalized in the corresponding bits in WK_STAT in case the externally connected signal
proceeds a rising or falling edge transition if the WK-enable is configured to high.
Datasheet
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TLE9561QX
DC Motor System IC
High-Voltage Wake Input
9.3
Electrical Characteristics
Table 17 Electrical Characteristics
V
SINT = 5.5 V to 28 V; Tj = -40°C to +150°C; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter Symbol
Values
Typ.
Unit Note or
Test Condition
Number
Min.
Max.
WK1, WK2 ,WK3, WK4 Input Pin Characteristics
Wake-up/monitoring VWKx_th,f 2.5
threshold voltage
falling
3
3.5
V
V
V
without external
serial resistor RS
P_10.3.1
P_10.3.2
P_10.3.3
Wake-up/monitoring VWKx_th,r
threshold voltage
rising
3
3.5
0.6
4
without external
serial resistor RS
Threshold hysteresis
VWKx_th,hys 0.4
0.85
without external
serial resistor RS
WK pin Pull-up Current IPU_WKx
-20
3
-10
10
-3
µA
µA
VWKx = 4 V
P_10.3.4
P_10.3.5
WK pin Pull-down
Current
IPD_WKx
20
VWKx = 2.5 V
Input leakage current ILK,lx
-2
2
-
µA
0 V < VWKx < 40 V;
Pull-up / Pull-down
disabled
P_10.3.6
WK5 Input Pin Characteristics
Wake-up/monitoring VWK5_th,f 0.4 x
threshold voltage
falling
0.45 x
VSHS
V
V
P_10.3.7
P_10.3.8
VSHS
Wake-up/monitoring VWK5_th,r
threshold voltage
rising
-
0.55 x 0.6 x
VSHS
VSHS
Threshold hysteresis
VWK5_th,hy 0.07 × 0.1 ×
0.175 ×
V
P_10.3.9
VSHS
VSHS
VSHS
s
Pull-up resistance on RWK5,pull- 20
30
47
kΩ
P_10.3.10
WK5
up
WK4 as SYNC input pin
LOW input voltage
threshold
WK4SYNC_ 0.3 ×
-
-
V
P_10.3.11
P_10.3.12
P_10.3.13
VCC1
th,L
HIGH input voltage
threshold
WK4SYNC_
-
-
0.7 ×
VCC1
V
th,H
Pull-down resistance RSYNC
20
40
80
kΩ
VSYNC = 1 V
on WK/SYNC
WK2/FO as Fail Safe Output
FO low-side output
voltage (active)
VFO,L1
–
0.6
1
V
WK2 configured as
Fail-Safe Output;
P_10.3.14
IFO = 4.0 mA
Datasheet
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Rev.1.0
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TLE9561QX
DC Motor System IC
High-Voltage Wake Input
Table 17 Electrical Characteristics (cont’d)
VSINT = 5.5 V to 28 V; Tj = -40°C to +150°C; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter
Symbol
Values
Typ.
–
Unit Note or
Test Condition
Number
Min.
Max.
FO input leakage
IFO,LK
–
2
µA
V_FO = 28 V
P_10.3.15
current (all inactive)
Timing
1)
1)
Wake-up filter time 1 tFWK1
12
50
16
64
22
80
µs
µs
P_10.3.16
P_10.3.17
Wake-up filter time 2 tFWK2
1) Not subject to production test, tolerance defined by internal oscillator tolerance.
Datasheet
66
Rev.1.0
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TLE9561QX
DC Motor System IC
Interrupt Function
10
Interrupt Function
10.1
Block and Functional Description
Vcc1
Time
out
INTN
Interrupt logic
INTERRUPT BLOCK.VSD
Figure 33 Interrupt Block Diagram
The interrupt is used to signalize special events in real time to the microcontroller. The interrupt block is
designed as a push/pull output stage as shown in Figure 33. An interrupt is triggered and the INTN pin is pulled
low (active low) for tINTN in Normal Mode and Stop Mode and it is released again once tINTN is expired. The
minimum high-time of INTN between two consecutive interrupts is tINTND. An interrupt does not cause a device
mode change.
Two different interrupt generation methods are implemented:
•
Interrupt Mask: One dedicated register (INT_MASK) is intended to enable or disable set of interrupt
sources. The interrupt sources follow the SPI Status Information Field.
In details:
–
–
–
–
–
–
SUPPLY_STAT: “OR” of all bits on SUP_STAT register except POR, VCC1_UV, VCC1_SC, VCC1_OV
TEMP_STAT: “OR” of all bits on THERM_STAT register except TSD2
BUS_STAT: “OR” of all bits on BUS_STAT register
HS_STAT: “OR” of all bits on HS_OL_OC_OT_STAT register
BD_STAT: “OR” of all bits on DSOV register
SPI_CRC_FAIL: or between SPI_FAIL and CRC_FAIL bits on DEV_STAT register.
•
Wake-up events: all wake-up events stored in the wake status SPI register WK_STAT only in case the
corresponding input was configured as wake-up source.
The wake-up sources are:
–
–
–
–
via CAN (wake-up pattern or wake-up frame)
via WK pins
via TIMERx (cyclic wake)
via LSx_DSOV_BRK if any of the brake-feature is enabled
The methods are both available at the same time.
Note:
The errors which will cause Restart or Fail-Safe Mode (VCC1_UV, VCC1_SC, VCC1_OV, TSD2) are the
exceptions of an INTN generation. Also the bit POR will not generate interrupts. If the above
mentioned bits are not cleared after the device is back in Normal Mode or Stop Mode, the INTN is
periodically generated (Register based cyclic interrupt generation).
Datasheet
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TLE9561QX
DC Motor System IC
Interrupt Function
Note:
Note:
Periodical interrupts are only generated by CRC fail and SPI fail from DEV_STAT register.
During Restart Mode the SPI is blocked and the microcontroller is in reset. Therefore the INTN will not
be in Restart Mode, which is the same behavior in Fail-Safe Mode or Sleep Mode.
In addition to this behavior, INTN will be triggered when Stop Mode is entered and not all wake source bits
were cleared in the WK_STAT register and also the LSx_DSOV_BRK bits in the DSOV register..
The SPI status registers are updated at every falling edge of the INTN pulse. All interrupt events are stored in
the respective register until the register is cleared via SPI command. A second SPI read after reading out the
respective status register is optional but recommended to verify that the interrupt event is not present
anymore. The interrupt behavior is shown in Figure 34.
The INTN pin is also used during Init Mode to select the Software Development Mode entry. See Chapter 5.2
for further information.
In case of pending INTN event (SPI Status registers are not cleared after INTN event), additional periodical
INTN events are generated as shown in Figure 35.
The periodical INTN events generation can be disabled via SPI command using INTN_CYC_EN bit.
WKx
CAN
INTN
tINTD
tINTN
Update of
WK_STAT register
Update of
WK_STAT register
optional
no WK
SPI
Read & Clear
WK_STAT
contents
WKx
no WK
CAN
SPI
Read & Clear
No SPI Read & Clear
Command sent
WK + CAN
no WK
Figure 34 Interrupt Signalization Behavior
Note:
For two or more interrupt events at the same time, when INTN pin is low the same time, it will not
start multiple toggling.
Datasheet
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Rev.1.0
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TLE9561QX
DC Motor System IC
Interrupt Function
WKx
INTN
tINTN
tINTN
tINTN_PULSE
tINTN_PULSE
Update of
WK_STAT register
SPI
Read & Clear
No SPI Read & Clear
Command sent
No SPI Read & Clear
Command sent
WK_STAT
contents
WKx
WKx
Figure 35 Interrupt Signalization Behavior in case of pending INTN events
Datasheet
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Rev.1.0
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TLE9561QX
DC Motor System IC
Interrupt Function
10.2
Electrical Characteristics
Table 18 Electrical Characteristics
VSINT = 5.5 V to 28 V; Tj = -40°C to +150°C; Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin; unless otherwise specified.
Parameter
Symbol
Values
Typ.
Unit Note or
Test Condition
Number
Min.
Max.
Interrupt Output; Pin INTN
1)
INTN High Output Voltage VINTN,H 0.8 ×
–
–
–
V
V
I
= -2 mA;
P_11.2.1
P_11.2.2
INTN
VCC1
INTN = off
1)
INTN Low Output Voltage VINTN,L
–
0.2 ×
I
= 2mA;
INTN
VCC1
INTN = on
2)
INTN Pulse Width
tINTN
80
80
100
100
120
120
µs
µs
P_11.2.3
P_11.2.4
INTN Pulse Minimum
Delay Time
tINTND
2) between
consecutive pulses
Pulse in case of pending tINTN_PUL
4
5
6
ms
2) between
P_11.2.5
INTN
consecutive pulses
SE
SDM Select; Pin INTN
Config Pull-up Resistance RSDM
30
50
60
64
100
80
kΩ
VINTN = 5 V
2)
P_11.2.6
P_11.2.7
Config Select Filter Time tSDM_F
µs
1) Output Voltage Value also determines device configuration during Init Mode.
2) Not subject to production test, tolerance defined by internal oscillator tolerance.
Datasheet
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Rev.1.0
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TLE9561QX
DC Motor System IC
Gate Drivers
11
Gate Drivers
The TLE9561QX integrates eight floating gate drivers capable of controlling a wide range of N-channel
MOSFETs. They are configured as four high-sides an d four low-sides, building four half-bridges.
VCP
VS
GHx
Highside
Gate-Driver
VDSMONTH
Current-Steering
DACs
SHx
High-Speed
Comparators
VCP
GLx
Lowside
Gate-Driver
VDSMONTH
Current-Steering
DACs
SL
Figure 36 Half-bridge gate driver - Block diagram
This section describes the MOSFET control in static activation and during PWM operation.
Note:
PWMx mentioned in this chapter refer to the PWMx pins and signal used by the bridge driver to
control the external MOSFETs.
Note:
In this chapter PWMx do not refer to the internal PWM generators used to control the internal high-
side switches HSx.
11.1
MOSFET control
Depending on the configuration bits HBxMODE[1:0] (refer to HBMODE), CPEN, each high-side and low-side
MOSFETs can be:
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DC Motor System IC
Gate Drivers
•
•
•
•
Kept off with the passive discharge.
Kept off actively.
Activated (statically, no PWM, HBx_PWM_EN = 0).
Activated in PWM mode (HBx_PWM_EN = 1).
Refer to Table 19 for details.
Table 19
CPEN
Half-bridge mode selection
HBxMODE[1:0]1) Configuration of HSx/LSx1)
CPEN = 0
CPEN = 1
CPEN = 1
CPEN = 1
Don’t care
00B
All MOSFETs are kept off by the passive discharge
HBx MOSFETs are kept off by the passive discharge
LSx MOSFET is ON, HSx MOSFET is actively kept OFF
HSx MOSFET is ON, LSx MOSFET is actively kept OFF
LSx and HSx MOSFETs are actively kept OFF with IHOLD
01B
10B
CPEN = 1
11B
1) x = 1 … 4
11.2
Static activation
In this section, we consider the static activation of the high-side and low-side MOSFET of the half-bridge x:
HBx_PWM_EN= 0 (in ST_ICHG) and CPEN = 1.
The low-side or high-side MOSFET of HBx is statically activated (no PWM) by setting HBxMODE[1:0] to
respectively (0,1) or (1,0).
The configured active cross-current protection and the Drain-Source overvoltage blank times for the Half-
Bridge x are noted tHBxCCP ACTIVE and tHBxBLANK ACTIVE
.
The charge and discharge currents applied to the static controlled Half-Bridge x are noted ICHGSTx
(ST_ICHG).
IHARDOFF is the maximum current that the gate drivers can sink (100 mA typ.). This current is used to keep a
MOSFET off, when the opposite MOSFET of the same half-bridge is being turned on. This feature reduces the
risk of parasitic cross-current conduction.
ICHGSTx is the current sourced, respectively sunk, by the gate driver to turn-on the high-side x or low-side x.
ICHGSTx is configured in the control register ST_ICHG.
Table 20
Static charge and discharge currents
ICHGSTx[3:0]
Nom. charge current
[mA]
Nom. discharge current
[mA]
Max. deviation to typ. values
0000B
0001B
0010B
0011B
0100B
0101B
0.5 (ICHG0
1.4 (ICHG4
3.1 (ICHG8
)
)
)
0.5 (IDCHG0
1.4 (IDCHG4
3.1 (IDCHG8
)
)
)
+/- 60 %
+/- 60 %
+/- 55%
+/- 40 %
+/- 40 %
+/- 40 %
5.7 (ICHG12
9.2 (ICHG16
)
)
5.7 (IDCHG12
9.2 (IDCHG16
)
)
13.7 (ICHG20
)
13.5 (IDCHG20)
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Rev. 1.0
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TLE9561QX
DC Motor System IC
Gate Drivers
Table 20
Static charge and discharge currents (cont’d)
ICHGSTx[3:0]
Nom. charge current
[mA]
Nom. discharge current
[mA]
Max. deviation to typ. values
0110B
0111B
1000B
1001B
1010B
1011B
1100B
1101B
1110B
1111B
19.2(ICHG24
)
18.8(IDCHG24
)
+/- 40 %
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
25.8 (ICHG28
32.8 (ICHG32
40.1 (ICHG36
47.8 (ICHG40
55.9 (ICHG44
64.3 (ICHG48
73.2 (ICHG52
82.7 (ICHG56
92.7 (ICHG60
)
)
)
)
)
)
)
)
)
25.2 (IDCHG28
32.2 (IDCHG32
39.4 (IDCHG36
47.0 (IDCHG40
55.0 (IDCHG44
63.2 (IDCHG48
72.4 (IDCHG52
)
)
)
)
)
)
82.1 (ICHG56
92.2 (ICHG60
)
)
IHOLD is the hold current used to keep the gate of the external MOSFETs in the desired state. This parameter
is configurable with the IHOLD control bit in GENCTRL.
If the control bit IHOLD = 0:
•
•
A MOSFET is kept ON with the current ICHG19
.
A MOSFET is kept OFF with the current IDCHG19
.
If the control bit IHOLD = 1:
•
•
A MOSFET is kept ON with the current ICHG25
.
A MOSFET is kept OFF with the current ICHG25
.
11.2.1
Static activation of a high-side MOSFET
Turn-on with cross-current protection
If LSx is ON (HBxMODE[1:0] = 01B), before the activation of HSx (HBxMODE[1:0] = 10B) then the high-side
MOSFET is turned on after a cross-current protection time (refer to Figure 37):
•
•
•
After the CSN rising edge and for the duration tHBxCCP ACTIVE :
–
–
The high-side MOSFET is kept OFF with the current -ICHGSTx.
The gate of the low-side MOSFET is discharged with the current -ICHGSTx.
At the end of tHBxCCP ACTIVE and for the duration tHBxBLANK ACTIVE + tFVDS
:
–
–
The gate of the high-side MOSFET is charged with the current ICHGSTx.
Low-side MOSFET is kept OFF with the current -IHARDOFF (hard off phase).
At the end of tFVDS
:
–
–
The drive current of the high-side MOSFET is reduced to IHOLD.
The drive current of the low-side MOSFET is set to -IHOLD.
Datasheet
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TLE9561QX
DC Motor System IC
Gate Drivers
SPI Frame accepted
Turn on HSx
CSN
Previous State
HSx OFF
LSx ON
à
à
à
New State
HSx ON
LSx OFF
t
VS
tHBxCCP
Active
tHBxBLANK
Active
IGHx
tFVDS
ICHGSTx
HSx
GHx
0
t
IGHx
HSx internal
drive signal
SHx
ICHGSTx
LSx
GLx
SL
IHOLD
-IHOLD
IGLx
t
-ICHGSTx
IGLx
t
-ICHGSTx
LSx internal
drive signal
IHOLD
-IHOLD
t
-ICHGSTx
Hard off
-IHARDOFF
Figure 37 Turn-on of a high-side MOSFET with cross-current protection
Note:
The CSN rising edge must be synchronized with the device logic. Therefore SPI commands are
executed with a delay of up to 3 µs after the CSN rising edge.
Datasheet
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Rev. 1.0
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TLE9561QX
DC Motor System IC
Gate Drivers
Turn-on without cross-current protection
If LSx is OFF (HBxMODE[1:0] = 11B), before the activation of HSx (HBxMODE[1:0] = 10B), then the high-side
MOSFET is turned on without cross-current protection (refer to Figure 38):
•
right after the CSN rising edge and for a duration tHBxBLANK ACTIVE + tFVDS:
–
–
The gate of the high-side MOSFET is charged with the current ICHGSTx.
The low-side MOSFET is kept OFF with the current -IHARDOFF.
•
At the end of tFVDS
:
–
–
The drive current of the high-side MOSFET is reduced to IHOLD.
The drive current of the low-side MOSFET is set to -IHOLD.
SPI Frame accepted
Turn on HSx
CSN
Previous State
HSx OFF
LSx OFF
à
à
à
New State
HSx ON
LSx OFF
t
tHBxBLANK
Active
IGHx
tFVDS
ICHGSTx
0
t
HSx internal
drive signal
ICHGSTx
VS
IHOLD
-IHOLD
t
HSx
GHx
IGHx
IGLx
0
SHx
t
LSx
GLx
SL
IGLx
LSx internal
drive signal
IHOLD
-IHOLD
t
Hard off
-IHARDOFF
Figure 38 Turn-on of a high-side MOSFET without cross-current protection
Note:
The CSN rising edge must be synchronized with the device logic. Therefore SPI commands are
executed with a delay of up to 3 µs after the CSN rising edge.
Datasheet
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TLE9561QX
DC Motor System IC
Gate Drivers
11.2.2
Static activation of a low-side MOSFET
The description of the static activation of a low-side x differs from the description of Chapter 11.2.1 only by
exchanging high-side x and low-side x.
11.2.3
Turn-off of the high-side and low-side MOSFETs of a half-bridge
When the TLE9561QX receives a SPI command to turn-off both the high-side and low-side MOSFETs of the half-
bridge x (HBxMODE[1:0] = (0,0) or (1,1)):
•
•
The gate of HSx and LSx are discharged with the current -ICHGSTx for the duration tHBxCCP ACTIVE (Figure 39).
At the end of tHBxCCP ACTIVE, the drive current of HSx and LSx are reduced to -IHOLD.
SPI Frame accepted
Turn off HSx and LSx
VS
CSN
HSx
t
GHx
IGHx
IGHx
SHx
0
LSx
t
GLx
-ICHGSTx
IGLx
SL
HSx internal
drive signal
tHBxCCP
Active
IHOLD
-IHOLD
t
t
-ICHGSTx
IGLx
LSx internal
drive signal
t
-IHOLD
-ICHGSTx
Figure 39 Turn-off of the high-side and low-side MOSFETs of a half-bridge
Note:
The CSN rising edge must be synchronized with the device logic. Therefore SPI commands are
executed with a delay of up to 3 µs after the CSN rising edge.
Datasheet
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TLE9561QX
DC Motor System IC
Gate Drivers
11.3
PWM operation
The pins PWMx provide the PWM signal for each PWM channel.
Each half-bridge is activated in PWM mode by setting the corresponding HBx_PWM_EN bit (HBMODE).
11.3.1
Determination of the active and freewheeling MOSFET
If EN_GEN_CHECK = 1, right before each MOSFET activation, the device detects which MOSFET of the half-
bridge is the active MOSFET and which MOSFET is the free-wheeling (FW) MOSFET (Figure 40):
•
•
If VSHx > VSHH : The high-side MOSFET is the FW MOSFET and the low-side MOSFET is the active MOSFET.
If VSHx < VSHL: Then the low-side MOSFET is the FW MOSFET and the high-side MOSFET is the active
MOSFET.
•
•
If VSHL< VSHx < VSHH: No clear distinction between the active FW MOSFET and the active MOSFET. The next
MOSFET to be turned on is turned on as if it was the active MOSFET.
No distinction between active MOSFET and FW MOSFET is possible (and the PWM MOSFET is considered as
the active MOSFET), if:
–
–
the ON-time of the external PWM signal is shorter than tHBxCCP FW
the OFF-time of the external PWM signal is shorter than tHBxCCP Active
Note:
The PWM signal is applied to the MOSFET selected by HBxMODE[1:0], independently from the free-
wheeling and the active MOSFET.
HS and LS off
Freewheeling through
high-side MOSFET body diode
VSHx > VSHH
HS and LS are off
Freewheeling through
low-side MOSFET body diode
VSHx < VSHL
HS = FW MOSFET
LS = FW MOSFET
LS = Active MOSFET
HS = Active MOSFET
VCP
VCP
VS
VS
GHx
GHx
Highside
Highside
Gate-Driver
Gate-Driver
SHx
SHx
VSHH
VSHH
High-Speed
Comparators
High-Speed
Comparators
VSHL
VSHL
VCP
VCP
GLx
GLx
Lowside
Lowside
Gate-Driver
Gate-Driver
SL
SL
Figure 40 Detection of the active and FW MOSFET (EN_GEN_CHECK = 1)- Principle
Datasheet
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Rev. 1.0
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TLE9561QX
DC Motor System IC
Gate Drivers
Figure 41 and Figure 42 show examples of free-wheeling and active MOSFET when the motor operates as
load.
VS
PWM
HS1
Active
MOSFET
Time
HS2 OFF
VOUT1
VOUT2
PWM
Time
Time
AFW
AFW
AFW
OUT1
OUT2
M
LS1: FW
MOSFET
LS2 ON
AFW: Active Free-wheeling
LS1 ON
Current Flow PWM = High
Current Flow PWM = Low
Figure 41 Active freewheeling on HB1: AFW1 = 1, HB1_PWM_EN = 1. PWM applied to HS1
(HB1MODE[1:0] = 10B). The motor operates as load: HS1 is the active MOSFET, LS1 is the FW
MOSFET.
VS
PWM
Time
HS2
FW MOSFET
VOUT2
AFW
AFW AFW
HS1 ON
LS1 OFF
Time
Time
VOUT1
M
OUT1
OUT2
LS2
Active MOSFET
PWM
AFW: Active Free-wheeling
HS2 ON
Current Flow PWM = High
Current Flow PWM = Low
Figure 42 Active freewheeling on HB2: AFW2 = 1, HB1_PWM_EN = 1. PWM applied to LS2
(HB2MODE[1:0] = 01B). The motor operates as load: LS2 is the active MOSFET, HS2 is the FW
MOSFET.
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Gate Drivers
Figure 43 and Figure 44 show examples of free-wheeling and active MOSFETs when the motor operates as
generator.
VS
PWM
HS1: FW
MOSFET
Time
HS2 OFF
VOUT1
VOUT2
PWM
AFW
AFW
AFW
Time
Time
OUT1
OUT2
M
LS1: Active
MOSFET
LS2 ON
AFW: Active Free-wheeling
HS1 ON
Current Flow PWM = High
Current Flow PWM = Low
Figure 43 Active freewheeling on HB1: AFW1 = 1, HB1_PWM_EN = 1. PWM applied to HS1
(HB1MODE[1:0] = 10B), EN_GEN_CHECK = 1.The motor operates as generator: LS1 is the
active MOSFET, HS1 is the FW MOSFET.
VS
PWM
Time
HS2
Active MOSFET
VOUT2
HS1 ON
LS1 OFF
AFW
AFW AFW
Time
Time
VOUT1
M
OUT1
OUT2
LS2
FW MOSFET
PWM
Current Flow PWM = High
Current Flow PWM = Low
AFW: Active Free-wheeling
LS2 ON
Figure 44 Active freewheeling on HB2: AFW2 = 1, HB1_PWM_EN = 1. PWM applied to LS2
(HB2MODE[1:0] = 01B), EN_GEN_CHECK = 1. The motor operates as generator: HS2 is the
active MOSFET, LS2 is the FW MOSFET.
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Gate Drivers
11.3.2
Configurations in PWM mode
The following sections describe the different control schemes in PWM mode.
Active gate control (AGC)
The control scheme during the pre-charge and pre-discharge phases are configured by the control bits
AGC[1:0]:
•
Adaptive gate control (AGC[1:0] = (1,0) or (1,1), GENCTRL): in this mode a pre-charge current and a pre-
discharge current are applied to the gate of the active MOSFET. These currents are used to regulate the
turn-on and turn-off delays to the respective target values. Refer to Chapter 11.3.4.
•
•
No adaptive gate control (AGC[1;0] = (0,0)): in this mode, the pre-charge and pre-discharge phases (of the
active MOSFET) are deactivated. Refer to Chapter 11.3.5.
No adaptive gate control (AGC[1;0] = (0,1)). In this mode:
–
During the pre-charge phase, the gate of the active MOSFET is charged with the configured current
IPCHGINIT (HB_PCHG_INIT).
–
During the pre-discharge phase, the gate of the active MOSFET is discharged with the configured
current IPDCHGINIT (HB_PCHG_INIT).
Note:
It is recommended to configure tPCHGx < tHBxBLANK Active and tPDCHGx < tHBxCCP Active (Refer
to TPRECHG and CCP_BLK) independently from the AGC settings.
Active free-wheeling (AFW)
The active free-wheeling is activated for HBx if the AFWx and HBx_PWM_EN (HBMODE) are set to 1 to reduce
the power dissipation of the free-wheeling MOSFET. If an active MOSFET is OFF, the opposite MOSFET of the
same half-bridge is actively turned on. See examples of high-side and low-side PWM operation in Figure 41
and Figure 42.
If AFWx = 1, a cross-current protection time is applied to HBx (set by CCP_BLK) during the PWM operation.
If AFWx = 0, no cross current protection is applied to HBx during the PWM operation.
AFWx can be changed either when HBx is in high impedance or when one of the HBx MOSFETs is on:
•
•
In motor mode :
–
If AFWx is changed from 1 to 0: then the new value of AFWx is read and latched at the end to tCCP FW
which follows the PWM rising edge.
–
If AFWx is changed from 0 to 1: then the new value of AFWx is read and latched at the PWM rising edge.
In generator mode (EN_GEN_CHECK = 1): If AFWx is changed from 0 to 1 or from 1 to 0, then the new value
of AFWx is read and latched at the end to tCCP active which follows a PWM rising edge.
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Gate Drivers
Post-charge
A post-charge is initiated if POCHGDIS is set to 0 (GENCTRL) to reach the minimum MOSFET Rdson.
•
POCHGDIS = 0: The post-charge phase is initiated at the end of the turn-on of the active MOSFET. The
charge current is increased by one current step at every bridge driver clock cycle (BDFREQ) to ICHGMAXx.
•
POCHGDIS = 1: The post-charge phase is disabled. The charge current is kept to ICHGx.
Synchronized
PWMz
t
IGS
PWM MOSFET
Precharge
Post-charge
tPCHGx
Predischarge
ICHGMAXx
IPRECHGx
tPDCHGx
ICHGx
0
t
tHBxCPP
- IDCHGx
tBLANK for PWM MOSFET
Cross-current
protection
Symmetrization
- IPREDCHGx
tHBxCPP
delay
tHBxCPP for symmetry
PWM_Control_Scheme_Overview_AFW.emf
Figure 45 PWM overview - AGC = 10B or 11B, POCHGDIS=0, AFWx = 1
Synchronized
PWMz
t
IGS
PWM MOSFET
Precharge
Post-charge
tPCHGx
Predischarge
ICHGMAXx
IPRECHGx
tPDCHGx
ICHGx
0
t
- IDCHGx
tBLANK for PWM MOSFET
- IPREDCHGx
tHBxCPP
PWM_Control_Scheme_Overview_AFW.emf
Figure 46 PWM overview - AGC = 10B or 11B, POCHGDIS=0, AFWx = 0
Synchronized
PWMz
t
IGS
PWM MOSFET
Precharge
tPCHGx
Predischarge
tPDCHGx
IPRECHGx
ICHGx
0
t
- IDCHGx
tBLANK for PWM MOSFET
- IPREDCHGx
tHBxCPP
Figure 47 PWM overview - AGC = 10B or 11B, POCHGDIS=1, AFWx = 0
11.3.3
PWM mapping
The PWM inputs can be mapped by different half-bridges by setting the configuration bits PWM12MAP and
PWM34MAP in GENCTRL.
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SLAM = 0
PWM12MAP = 0
PWM Mapping
PWM12MAP = 1
PWM Mapping
PWM1/CRC
PWM2
HB1
HB2
HB1
HB2
PWM1/CRC
PWM2
PWM34MAP = 0
PWM Mapping
PWM34MAP = 1
PWM Mapping
PWM3
PWM4
HB3
HB4
PWM3
PWM4
HB3
HB4
Figure 48 PWM input mapping TLE9561QXC
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DC Motor System IC
Gate Drivers
11.3.4
PWM operation with adaptive gate control
This section describes the MOSFETs control during high-side or low-side PWM operation when the adaptive
gate control is enabled (AGC[1:0] = (1,0) or (1,1), GENCTRL).
Assumption: A high-side or low-side MOSFET is mapped to the PWM input PWMz.
The TLE9561QX adapts the pre-charge current, respectively the pre-discharge current, in order to match the
effective turn-on delay (tDON) and turn-off delay (tDOFF) to the configured values.
The configured turn-on and turn-off delays of the respective PWM MOSFETs are set by the registers
TDON_HB_CTRL and TDOFF_HB_CTRL.
The effective turn-on and turn-off delays of the respective PWM MOSFETs are read out from the status registers
EFF_TDON_OFFx.
Table 21
Abbreviation
Suffix x
Abbreviations for adaptive turn-on and turn-off phases in PWM configuration
Definition
Related to the half-bridge x.
Suffix z
Related to the PWM input z.
VGS_HSx
IGS_HSx
Gate-Source voltage of high-side MOSFET x.
Gate current of high-side MOSFET x.
IGS_HSx is positive when the current flows out of GHx.
VGS_LSx
IGS_LSx
Gate-Source voltage of low-side MOSFET x.
Gate current of low-side MOSFET x.
IGS_LSx is positive when the current flows out of GLx.
tPWM_SYNCH
Synchronization delay between external and internal PWM signal.
tHBxCCP ACTIVE Active cross-current protection time of HBx. See control register CCP_BLK.
tHBxBLANK ACTIVE Active Drain-source overvoltage blank time of HBx. See control register and CCP_BLK.
tHBxCCP FW
Freewheeling cross-current protection time of HBx. See control register CCP_BLK.
tHBxBLANK FW
Freewheeling drain-source overvoltage blank time of HBx. See control register and
CCP_BLK.
PWMz
External PWM signal applied to the input pin PWMz.
ICHGMAXx
Maximum drive current of the half-bridge x during the pre-charge and pre-discharge
phases. See control register HB_ICHG_MAX.
IPRECHGx and IPREDCHGx are limited to ICHGMAXx.
IPRECHGx
Pre-charge current sourced by the gate driver to the active MOSFET of the half-bridge
x during tPCHGx (TPRECHG).
Internal and self-adaptive parameter (if AGC[1:0] = (1,0) or (1,1), GENCTRL).
IPRECHGx is clamped between ICHG0 (0.5 mA typ.) and ICHGMAXx.
IPCHGINITx
IPREDCHGx
Initial value of IPRECHGx. Refer to HB_PCHG_INIT.
Pre-discharge-current sunk by the gate driver mapped to the half-bridge x during
tPDCHGx.
Internal and self-adaptive parameter (if AGC[1:0] = (1,0) or (1,1), GENCTRL).
IPREDCHGx is clamped between IDCHG0 (0.5 mA typ.) and ICHGMAXx.
IPDCHGINITx
Initial value of IPREDCHGx. Refer to HB_PCHG_INIT.
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DC Motor System IC
Gate Drivers
Table 21
Abbreviation
ICHGx
Abbreviations for adaptive turn-on and turn-off phases in PWM configuration (cont’d)
Definition
Current sourced by the gate driver to the active MOSFET of the half-bridge x during the
charge phase. See control register HB_ICHG.
IDCHGx
Current sunk by the gate driver to turn-off the active MOSFET of the half-bridge x
during the discharge phase. See control register HB_ICHG.
ICHGFWx
tPCHGx
tPDCHGx
Current sourced or sunk by the gate driver to turn on / turn off the freewheeling
MOSFET of the half-bridge x. See control register HB_ICHG.
Duration of the pre-charge phase of half-bridge x.
tPCHGx is configurable by SPI. See control register TPRECHG.
Duration of the pre-discharge phase of half-bridge x.
tPDCHGx is configurable by SPI. See control register TPRECHG.
tDONx
tDOFFx
IHOLD
Turn-on delay of the active MOSFET of HBx.
Turn-off delay of the active MOSFET of HBx.
Hold current sourced or sunk by the gate driver to keep the MOSFET in the desired
state. See IHOLD control bit in GENCTRL.
IHARDOFF
TFVDS
IHARDOFF is the maximum current that the gate drivers can sink. It corresponds to the
discharge current when IDCHGx[5:0] = 63D (100 mA typ.).
Drain-Source overvoltage filter time. See LS_VDS.
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Gate Drivers
11.3.4.1 High-side PWM with adaptive gate control, motor operating as load
The following section describes the MOSFET control when the PWM signal is applied to the high-side MOSFET
of one half-bridge while the motor operates as a load.
Assumption: the PWM input z is mapped to the high-side MOSFET of the half-bridge x.
Current Flow PWMz = High
VS
Current Flow PWMz = Low
HSx: Active
MOSFET
IDS_HSx
HSx
IGS_HSx
HSy OFF
PWMz
VGS_HSx
SHx
SHy
M
LSx: FW
MOSFET
LSx
IGS_LSx
LSy ON
VGS_LSx
Figure 49 PWM input z is mapped to high-side x, the motor operating as load
11.3.4.1.1
High-side PWM with adaptive gate control and active free-wheeling
This section describes the MOSFETs control scheme applied to HBx with active free-wheeling (AFWx = 1).
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Gate Drivers
External
PWMz
Synchronized
intern. PWMz
t
t
tPWM_SYNCH
Charge
phase
Postcharge Phase
IGS_HSx
tPCHGx
ICHGMAXx
IPRECHGx
ICHGx
0
t
tHBxBLANK Active
tHBxCCP FW
HSx internal
drive signal
tFVDS
ICHGMAXx
IPRECHGx
IHOLD
IHOLD
ICHGx
ICHGx
t
0
-
IHOLD
VGS_HSx
t
t
tRISEx
VSHx
VS
VSHH
VSHH
tDONx
VSHL
VSHL
IDS_HSDx
IMOTOR
t
t
IGS_LSx
-
ICHGFWx
LSx internal
drive signal
IHOLD
tFVDS
t
-
IHOLD
-
IHOLD
-
ICHGFWx
Hard off
-
IHARDOFF
Figure 50 Adaptive turn-on with high-side PWM, AGC[1:0] = (1,0) or (1,1), AFWx=1, POCHGDIS=0,
motor operating as load
Adaptive turn-on during high-side PWM
The turn-on of the high-side MOSFET is done in four phases (Refer to Figure 50):
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1. Cross-current protection phase: The cross-current protection tHBxCCP FW starts at the rising edge of
PWMz. During tHBxCCP FW, the low-side MOSFET x is turned off with the discharge current
- ICHGFWx, while the high-side MOSFET x is kept off.
2. Pre-charge: 1)Once tHBxCCP FW has elapsed, the gate of the high-side MOSFET x is pre-charged with the
current IPRECHGx for a duration tPCHGx. IPRECHGx2) is an internal parameter, which is self-adaptive (see
next phase).
3. Charge: After tPCHGx, the charge current is decreased from IPRECHGx down to ICHGx. The effective
tDONx3) is measured and compared to the configured tDONx for the automatic adaptation of IPRECHGx
(see Adaptive control of pre-charge current). The charge phase ends up when VSHx reaches VSHH (typically
VS - 2.25 V)
4. Post-charge: After the charge phase, the control signal for the charge current of HSx is increased by one
current step at every bridge driver clock cycle (BDFREQ) to ICHGMAXx until the end of tFVDS.
Adaptive control of pre-charge current
Refer to Chapter 11.3.6 for information on the pre-discharge currents.
The pre-charge current IPRECHGx is a self-adaptive parameter if AGC[1:0] = (1,0) or (1,1) (see GENCTRL). It is
applied during tPCHGx (see TPRECHG). The TLE9561QX adapts the IPRECHGx to match the effective tDONx to
the configured value.
IPRECHGx is clamped between ICHG0 (0.5 mA typ.) and ICHGMAXx (HB_ICHG_MAX).
IPRECHGx is initialized to Min(IPCHGINITx,ICHGMAXx) when the TLE9561QX receives an SPI command setting
HBx_PWM_EN to 1 (see HBMODE). IPCHGINITx is set by the register HB_PCHG_INIT.
The following adaptive schemes can be selected.
AGCFILT = 0: No filter is applied:
•
•
•
If the effective tDONx is longer than the configured tDONx, then IPRECHGx is increased during the next pre-
charge phase.
If the effective tDONx is shorter than the configured tDONx, then IPRECHGx is decreased during the next
pre-charge phase.
The pre-charge current is increased or decreased by one, respectively by two current steps
(Chapter 11.3.6) if the control bit IPCHGADT in the control register GENCTRL is set to 0 respectively 1.
AGCFILT = 1: A filter is applied:
•
•
•
•
If the effective tDONx of the last two PWM cycles are longer than the configured tDONx, then IPRECHGx is
increased during the next pre-charge phase.
If the effective tDONx of the last two PWM cycles are shorter than the configured tDONx, then IPRECHGx
is decreased during the next pre-charge phase.
The pre-charge current is increased or decreased by one, respectively by two current steps
(Chapter 11.3.6) if the control bit IPCHGADT in the control register GENCTRL is set to 0 respectively 1.
If none of the two cases are applicable, then IPRECHGx is unchanged during the next pre-charge phase.
1) For a correct operation, it is recommended to configure tPCHGx < tHBxBLANK Active.
2) IPRECHGx is clamped between ICHGMAXx and ICHG0
3) The effective tDON can be read out. Refer to EFF_TDON_OFF1, EFF_TDON_OFF2, EFF_TDON_OFF3, EFF_TDON_OFF4.
.
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DC Motor System IC
Gate Drivers
External
PWMz
t
t
tPWM_SYNCH
Synchronized
intern. PWMz
IGS_HSx
Discharge phase
tPDCHGx
t
0
- IDCHGx
- IPREDCHGx
tHBxCCP FW for
symmetrisation
tHBxCCP Active for cross current
protection
HSx internal
drive signal
IHOLD
0
t
-
IHOLD
- IDCHGx
- IHOLD
- IDCHGx
- IPREDCHGx
Hard off
-
IHARDOFF
VGS_HSx
tFVDS
t
t
tFALLx
VSHx
tDOFFx
VS
VSHH
VSHH
VSHL
VSHL
IDS_HSDx
IMOTOR
t
t
IGS_LSx
ICHGFWx
tHBxBLANK FW
LSx internal
drive signal
tFVDS
ICHGFWx
IHOLD
IHOLD
t
-
IHOLD
Figure 51 Adaptive turn-off with high-side PWM, AGC[1:0] = (1,0) or (1,1), AFWx=1, motor operating as
load
Adaptive turn-off during high-side PWM
The turn-off of the high-side MOSFET is done in four phases (Refer to Figure 51):
1. Turn-off delay time for symmetrization of the PWM signal: The turn-off of HSx is delayed by tHBxCCP FW
after the falling edge of PWMz, in order to compensate the distortion caused by the cross-current
protection time at turn-on.
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Gate Drivers
2. Pre-discharge: 1)once tHBxCCP FW for symmetrization has elapsed, the gate of the high-side MOSFET x is
pre-discharged with the current - IPREDCHGx for a duration tDPCHGx. IPREDCHGx is a device internal
parameter, which is self-adaptive (See next phase).
3. Discharge: After tPREDCHGx, the pre-discharge current is decreased in absolute value from IPREDCHGx2)
down to IDCHGx. The effective tDOFF3) is measured and compared to the configured tDOFFx for the
automatic adaptation of IPREDCHGx (see Adaptive control of pre-discharge current). The discharge
phase ends up at expiration of tHBxCCP active for cross-current protection.
4. Cross-current protection phase: The cross-current protection is concurrent to the pre-discharge and
discharge of the high-side MOSFET. The cross-current protection phase starts when the turn-off delay for
symmetrization ends up. It has the duration tHBxCCP active . During tHBxCCP active, the low-side
MOSFETx is kept OFF. When tHBxCCP active has elapsed, the gate of the low-side MOSFET x is charged with
the current ICHGFWx until the end of tFVDS, provided that VSHx < VSHL
.
Adaptive control of pre-discharge current
Refer to Chapter 11.3.6 for information on the pre-discharge currents.
The pre-discharge current IPREDCHGx is a self-adaptive parameter if AGC[1:0] = (1,0) or (1,1) (see GENCTRL).
The TLE9561QX adapts the IPREDCHGx to match the measured tDOFFx to the configured value.
IPREDCHGx is clamped between IDCHG0 (0.5 mA typ.) and ICHGMAXx (see HB_ICHG_MAX).
IPREDCHGx is initialized to Min(IPDCHGINITx, ICHGMAXx) when the TLE9561QX receives a SPI command
setting HBx_PWM_EN to 1 (see HBMODE). IPDCHGINITx is set by the register HB_PCHG_INIT.
The pre-discharge current is increased or decreased by one, respectively by two current steps
(Chapter 11.3.6) if the control bit IPCHGADT in the control register GENCTRL is set to 0 respectively 1.
The following adaptive schemes can be selected:
AGCFILT = 0: No filter is applied.
•
•
•
If the effective tDOFFx is longer than the configured tDOFFx, then IPREDCHGx is increased during the next
pre-discharge phase.
If the effective tDOFFx is shorter than the configured tDOFFx, then IPREDCHGx is decreased during the next
pre-discharge phase.
The pre-charge current is increased or decreased by one, respectively by two current steps
(Chapter 11.3.6) if the control bit IPCHGADT in the control register GENCTRLis set to 0 respectively 1.
AGCFILT = 1:
•
•
•
If the effective tDOFFx of the last two PWM cycles are longer than the configured tDOFFx, then IPREDCHGx
is increased during the next pre-discharge phase.
If the effective tDOFFx of the last two PWM cycles are shorter than the configured tDOFFx, then
IPREDCHGx is decreased during the next pre-discharge phase.
If none of the two cases are applicable, then IPRECHGx is unchanged during the next pre-discharge phase.
1) For a correct operation, it is required to configure tPDCHGx < tHBxCCPActive.
2) IPREDCHGx is clamped between ICHGMAXx and IDCHG0
.
3) The effective tDOFF can be read out.
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DC Motor System IC
Gate Drivers
•
The pre-discharge current is increased or decreased by one, respectively by two current steps if the control
bit IPCHGADT is set to 0 respectively 1.
11.3.4.1.2
High-side PWM with adaptive gate control and passive free-wheeling
This section describes the MOSFETs control scheme with passive free-wheeling (AFWx = 0, HBMODE).
In contrast to the active free-wheeling, if AFWx =0, only the PWM MOSFET can be turned on, while the
complementary MOSFET is always kept off.
Turn-on of the PWM MOSFET, AFWx = 0
If AFWx = 0, the cross-current protection time at the rising edge of the synchronized PWM signal is omitted in
contrast to the active free-wheeling. The pre-charge, the charge and the post-charge phases are identical to
the control scheme with active free-wheeling. Refer to Figure 52.
Turn-off of the PWM MOSFET, AFWx = 0
If AFWx = 0, the cross-current protection time at the falling edge of the synchronized PWM signal is omitted in
contrast to the active free-wheeling. The pre-discharge, the discharge and the post-charge phases are
identical to the control scheme with active free-wheeling. Refer to Figure 53.
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DC Motor System IC
Gate Drivers
External
PWMz
Synchronized
intern. PWMz
t
t
tPWM_SYNCH
Charge
phase
Postcharge Phase
IGS_HSx
tPCHGx
ICHGMAXx
IPRECHGx
ICHGx
0
t
tHBxBLANK
HSx internal
drive signal
tFVDS
ICHGMAXx
IPRECHGx
IHOLD
IHOLD
ICHGx
ICHGx
t
0
-
IHOLD
VGS_HSx
t
t
tRISEx
VSHx
VS
VSHH
VSHH
VSHL
tDONx
VSHL
IDS_HSDx
IMOTOR
t
t
IGS_LSx
-
ICHGMAX
LSx internal
drive signal
tFVDS
t
-
IHOLD
-
IHOLD
Hard off
-
IHARDOFF
Figure 52 Adaptive turn-on with high-side PWM, AGC[1:0] = (1,0) or (1,1), AFWx=0, POCHGDIS=0,
motor operating as load
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DC Motor System IC
Gate Drivers
External
PWMz
t
t
tPWM_SYNCH
Synchronized
intern. PWMz
IGS_HSx
Discharge phase
tPDCHGx
t
0
- IDCHGx
- IPREDCHGx
tHBxCCP Active
HSx internal
drive signal
IHOLD
0
t
-
IHOLD
- IDCHGx
- IHOLD
- IDCHGx
- IPREDCHGx
VGS_HSx
t
t
tFALLx
VSHx
tDOFFx
VS
VSHH
VSHH
VSHL
VSHL
IDS_HSDx
IMOTOR
t
t
IGS_LSx
0
LSx internal
drive signal
t
-
IHOLD
Figure 53 Adaptive turn-off with high-side PWM, AGC[1:0] = (1,0) or (1,1), AFWx=0, motor operating as
load
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Gate Drivers
External
PWMz
t
t
tPWM_SYNCH
Synchronized
intern. PWMz
IGS_LSx
Discharge phase
tPDCHGx
t
0
- IDCHGx
- IPREDCHGx
tHBxCCP Active for cross current
protection
LSx internal
drive signal
IHOLD
0
t
-
IHOLD
- IDCHGx
- IHOLD
- IDCHGx
- IPREDCHGx
VGS_LSx
t
t
VSHx
tDOFFx tFALLx
VS
VSHH
VSHH
VSHL
VSHL
Detection of the active MOSFET
IDS_LSDx
IMOTOR
(EN_GEN_CHECK= 1). VSH > VSHH: LS
MOSFET is the active MOSFET
t
IGS_HSx
t
HSx internal
drive signal
t
-
IHOLD
Figure 54 PWM rising edge in generator mode with high-side PWM, adaptive gate control on, AGC[1:0]
= (1,0) or (1,1), AFWx=0, POCHGDIS=0. EN_GEN_CHECK = 1. The PWM MOSFET is the FW
MOSFET
Datasheet
93
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Gate Drivers
Detection of the active MOSFET
(EN_GEN_CHECK= 1). VSH > VSHH: LS
MOSFET is the active MOSFET
External
PWMz
Synchronized
intern. PWMz
t
t
tPWM_SYNCH
Charge
phase
Postcharge Phase
IGS_LSx
tPCHGx
ICHGMAXx
IPRECHGx
ICHGx
0
t
tHBxBLANK Active
LSx internal
drive signal
tFVDS
ICHGMAXx
IPRECHGx
IHOLD
IHOLD
ICHGx
ICHGx
t
0
-
IHOLD
VGS_LSx
t
t
tRISEx
VSHH
VSHx
VS
VSHH
tDONx
VSHL
VSHL
IDS_LSDx
IMOTOR
t
t
IGS_HSx
HSx internal
drive signal
tFVDS
t
-
IHOLD
-
IHOLD
Hard off
-
IHARDOFF
Figure 55 PWM falling edge in generator mode with high-side PWM, adaptive gate control on,
AGC[1:0] = (1,0) or (1,1), AFWx=0, POCHGDIS=0. EN_GEN_CHECK = 1. The PWM MOSFET is the
FW MOSFET
Datasheet
94
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Gate Drivers
11.3.4.2 Low-side PWM with adaptive gate control, motor operating as load
The following section describes the MOSFET control when the PWM signal is applied to the low-side MOSFET
of one half-bridge.
Assumption: the PWM channel z is applied to the low-side MOSFET of the half-bridge x (Figure 56).
Current Flow PWM = High
VS
Current Flow PWM = Low
HSx: FW MOSFET
IGS_HSx
HSy ON
VGS_HSx
SHy
SHx
M
LSx: Active MOSFET
IDS_LSx
LSx
IGS_LSx
LSy OFF
PWMz
VGS_LSx
Figure 56 PWM Channel z is mapped to low-side x, motor operating as load
The description of the control of the PWM half-bridge differs from the description of Chapter 11.3.4.1 only by
exchanging high-side x and low-side x and thresholds VSHH and VSHL
.
11.3.4.3 High-side PWM with adaptive gate control, motor operating as generator
Current Flow PWMz = High
Current Flow PWMz = Low
VS
HSx: FW
MOSFET
IDS_HSx
HSx
PWMz
IGS_HSx
HSy OFF
VGS_HSx
SHx
SHy
M
LSx: Active
MOSFET
LSx
IGS_LSx
LSy ON
VGS_LSx
Figure 57 PWM input z is mapped to high-side x, the motor operating as generator
Datasheet
95
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Gate Drivers
External
PWMz
t
t
tPWM_SYNCH
Synchronized
intern. PWMz
IGS_LSx
Discharge phase
tPDCHGx
t
0
- IDCHGx
- IPREDCHGx
tHBxCCP FW for
symmetrisation
tHBxCCP Active for cross current
protection
LSx internal
drive signal
IHOLD
0
t
-
IHOLD
- IDCHGx
- IHOLD
- IDCHGx
- IPREDCHGx
Hard off
-
IHARDOFF
tFVDS
VGS_LSx
t
VSHx
tDOFFx tFALLx
VS
VSHH
VSHH
VSHL
VSHL
t
t
IDS_LSDx
- IMOTOR
IGS_HSx
ICHGFWx
t
tHBxBLANK FW
HSx internal
drive signal
tFVDS
ICHGFWx
IHOLD
IHOLD
t
-
IHOLD
Figure 58 Adaptive turn-on with high-side PWM, AGC[1:0] = (1,0) or (1,1), AFWx=1, motor operating as
generator
Datasheet
96
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Gate Drivers
11.3.4.4 Low-side PWM with adaptive gate control, motor operating as generator
Current Flow PWM = High
VS
Current Flow PWM = Low
HSx: Active MOSFET
IGS_HSx
HSy ON
VGS_HSx
SHy
SHx
M
LSx: FW MOSFET
IDS_LSx
LSx
IGS_LSx
LSy OFF
PWMz
VGS_LSx
Figure 59 PWM input z is mapped to low-side x, the motor operating as generator
Datasheet
97
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Gate Drivers
External
PWMz
Synchronized
intern. PWMz
t
t
tPWM_SYNCH
Charge
phase
Postcharge Phase
IGS_LSx
tPCHGx
ICHGMAXx
IPRECHGx
ICHGx
0
t
tHBxBLANK Active
tHBxCCP FW
LSx internal
drive signal
tFVDS
ICHGMAXx
IPRECHGx
IHOLD
IHOLD
ICHGx
ICHGx
t
0
-
IHOLD
VGS_LSx
VSHx
t
t
tRISEx
VSHH
VS
VSHH
tDONx
VSHL
VSHL
IDS_LSDx
t
t
- IMOTOR
IGS_HSx
-
ICHGFWx
HSx internal
drive signal
tFVDS
IHOLD
t
-
IHOLD
-
IHOLD
-
ICHGFWx
Hard off
-
IHARDOFF
Figure 60 Adaptive turn-off with high-side PWM, AGC[1:0] = (1,0) or (1,1), AFWx=1, motor operating as
generator and EN_GEN_CHECK = 1
Datasheet
98
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Gate Drivers
11.3.4.5 Status bits for regulation of turn-on and turn-off delay times
The control bits TDREGx (TDREG) indicate if tDONx and tDOFFx of the half-bridge x, using the adaptive control
scheme (AGC = 10B or 11B), are in regulation.
The half-bridge x is considered in regulation if one of the following conditions is met:
•
Condition 1: The effective turn-on and turn-off delays are equal to the configured delays for at least eight
cumulative PWM cycle (HBx tDON counter ≥ 8 and HBx tDOFF counter ≥ 8). For each PWM cycle
–
–
–
–
if tDONxEFF1) = TDONx2): HBx tDON counter is incremented
if tDONxEFF1) ≠ TDONx2): HBx tDON counter is decremented
if tDOFFxEFF1) = TDOFFx3): HBx tDOFF counter is incremented
if tDOFFxEFF 1) ≠ TDOFFx3): HBx tDOFF counter is decremented
•
Condition 2: The error between the effective delays ((tDONxEFF-TDONx) and(tDOFFxEFF-TDOFFx ))
changes its sign three times consecutively
11.3.4.6 Time modulation of pre-charge and pre-discharge times
If DEEP_ADAP =0:
•
•
one single precharge current is applied during tPCHGx to regulate TDON
one single precharge current is applied during tPDCHGx to regulate TDOFF
If DEEP_ADAP = 1 (“deep adaptation” or “time modulation”) it is possible to:
•
•
to divide the precharge phase in two parts, during which two different precharge currents can be applied
to divide the predischarge phase in two parts, during which two different precharge currents can be
applied
Figure 61 describes the principle of the time modulation applied to the precharge phase. The same principle
is also applied for the regulation of the pre-discharge phase.
1) Refer to EFF_TDON_OFF1, EFF_TDON_OFF2, EFF_TDON_OFF3, EFF_TDON_OFF4
2) Refer to TDON_HB_CTRL
3) Refer to TDOFF_HB_CTRL
Datasheet
99
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Gate Drivers
TDON adaptation
with two current
steps (IPCHGADT =
1)
Current i+2
No
3 consecutive sign changes of (TDON
EFF- TDON TARGET) or No error for 3
consecutive PWM cycles
Current i
Yes
tPCHG
tPCHG
TDON adaptation
with one current step
i+1
i
3 consecutive sign changes
of (TDON EFF- TDON
TARGET)
No
tPCHG
tPCHG
Yes
i+1
i
Precharge phase splitted in 2
sub-phases
50% 50%
tPCHG
Yes
TDON EFF = TDON
TARGET
No
Precharge splitted:
75%-25% if TDON EFF > TDON TARGET
25%-75% if TDON EFF < TDON TARGET
i+1
i
i+1
i
or
25%
75%
75%
tPCHG
25%
tPCHG
Yes
TDON EFF = TDON
TARGET
No
Precharge splitted:
E.g 87.5%-12.5%
1) Precharge further split either:
- until TDON EFF = TDON TARGET
Etc... 1)
- Or until no further split of tPCHG is possible. Refer to 2).
No 2)
TDON EFF = TDON TARGET
2) Exit time modulation:
- tPCHG cannot be further divided due to the limitation of the resolution
- and the regulation of TDON is still not possible
à One single current is applied during tPCHG
Figure 61
Principle of the time modulation of the precharge phase, DEEP_ADAP = 1, AGC = 10B or 11B
Datasheet
100
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Gate Drivers
11.3.5
PWM operation without adaptive gate control
The adaptive gate control is disabled if AGC[1:0] is set to (0,0) or (0,1). The effective turn-on and turn -off delays
of the PWM MOSFETs are not regulated. Two modes can be selected.
The target turn-on and turn-off delay times of PWM MOSFETs (configured in TRISE_FALL1, TRISE_FALL2,
TRISE_FALL3, TRISE_FALL4) are no longer regulated. Nevertheless the status registers EFF_TDON_OFF1,
EFF_TDON_OFF2, EFF_TDON_OFF3, EFF_TDON_OFF4 still report the effective turn-on and turn-off times of
the PWM MOSFET.
11.3.5.1 AGC[1:0]=00B
When AGC[1:0] = (0,0) (see GENCTRL), the control of the gate drivers in PWM mode differs from the description
of Chapter 11.3.4, PWM operation with adaptive gate control, only by the suppression of the pre-charge
and pre-discharge phases.
11.3.5.2 AGC[1:0]=01B
When AGC = (0,1) (see GENCTRL), then:
•
During the pre-charge phase (tDCHGx) the gate of the PWM MOSFET mapped to the PWM input z is charged
with the current IPCHGINITx (HB_PCHG_INIT).
•
During the pre-discharge phase (tPDCHGx), the gate of the PWM MOSFET mapped to the PWM input z is
discharged with the current -IPDCHGINITx (HB_PCHG_INIT).
Datasheet
101
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Gate Drivers
11.3.6
Gate driver current
Each gate driver is able to source and sink currents from 0.5 mA to 100 mA, with 64 steps according to
Figure 62 and Figure 63.
100
95
90
85
80
75
70
65
60
55
50
45
40
35
30
25
20
15
10
5
0
0
5
10 15 20 25 30 35 40 45 50 55 60
ICHGx[5:0]dec
Figure 62 Configurable charge currents in PWM operation
Datasheet
102
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Gate Drivers
Table 22
Charge currents in PWM operation, initial precharge current and freewheeling MOSFETs
charge current
ICHGx[5:0], PCHGINIT[5:0]
Parameter Nom. charge current
Max. deviation to nominal
values [%]
name
[mA]
000000B
000001B
000010B
000011B
000100B
000101B
000110B
000111B
001000B
001001B
001010B
001011B
001100B
001101B
001110B
001111B
010000B
010001B
010010B
010011B
010100B
010101B
010110B
010111B
011000B
011001B
011010B
011011B
011100B
011101B
011110B
011111B
100000B
100001B
100010B
100011B
ICHG0
0.5
+/- 60%
+/- 60%
+/- 60%
+/- 60%
+/- 60%
+/- 60%
+/- 60%
+/- 60%
+/- 55%
+/- 55%
+/- 55%
+/- 55%
+/- 55%
+/- 55%
+/- 40%
+/- 40%
+/- 40 %
+/- 40 %
+/- 40%
+/- 40%
+/- 40%
+/- 40%
+/- 40%
+/- 40%
+/- 40%
+/- 40%
+/- 40%
+/- 40%
+/- 40%
+/- 40%
+/- 30%
+/- 30%
+/- 30%
+/- 30%
+/- 30%
+/- 30%
ICHG1
0.65
0.85
1.1
ICHG2
ICHG3
ICHG4
1.35
1.7
ICHG5
ICHG6
2.1
ICHG7
2.5
ICHG8
3.1
ICHG9
3.7
ICHG10
ICHG11
ICHG12
ICHG13
ICHG14
ICHG15
ICHG16
ICHG17
ICHG18
ICHG19
ICHG20
ICHG21
ICHG22
ICHG23
ICHG24
ICHG25
ICHG26
ICHG27
ICHG28
ICHG29
ICHG30
ICHG31
ICHG32
ICHG33
ICHG34
ICHG35
4.3
5.0
5.7
6.5
7.3
8.2
9.2
10.2
11.3
12.5
13.7
15
16.3
17.7
19.2
20.8
22.4
24.1
25.8
27.5
29.2
31
32.8
34.6
36.4
38.2
Datasheet
103
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Gate Drivers
Table 22
Charge currents in PWM operation, initial precharge current and freewheeling MOSFETs
charge current (cont’d)
ICHGx[5:0], PCHGINIT[5:0]
Parameter Nom. charge current
Max. deviation to nominal
values [%]
name
ICHG36
ICHG37
ICHG38
ICHG39
ICHG40
ICHG41
ICHG42
ICHG43
ICHG44
ICHG45
ICHG46
ICHG47
ICHG48
ICHG49
ICHG50
ICHG51
ICHG52
ICHG53
ICHG54
ICHG55
ICHG56
ICHG57
ICHG58
ICHG59
ICHG60
ICHG61
ICHG62
ICHG63
[mA]
40.1
42
100100B
100101B
100110B
100111B
101000B
101001B
101010B
101011B
101100B
101101B
101110B
101111B
110000B
110001B
110010B
110011B
110100B
110101B
110110B
110111B
111000B
111001B
111010B
111011B
111100B
111101B
111110B
111111B
+/- 30%
+/- 30%
+/- 30%
+/- 30%
+/- 30%
+/- 30%
+/- 30%
+/- 30%
+/- 30%
+/- 30%
+/- 30%
+/- 30%
+/- 30%
+/- 30%
+/- 30%
+/- 30%
+/- 30%
+/- 30%
+/- 30%
+/- 30%
+/- 30%
+/- 30%
+/- 30%
+/- 30%
+/- 30%
+/- 30%
+/- 30%
+/- 30%
43.9
45.8
47.8
49.8
51.8
53.8
55.9
58
60.1
62.2
64.3
66.4
68.6
70.9
73.2
75.5
77.9
80.3
82.7
85.1
87.5
89.9
92.4
94.9
97.4
100
Datasheet
104
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Gate Drivers
100
95
90
85
80
75
70
65
60
55
50
45
40
35
30
25
20
15
10
5
0
0
5
10 15 20 25 30 35 40 45 50 55 60
IDCHGx[5:0]dec
Figure 63 Configurable discharge currents in PWM operation
Datasheet
105
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Gate Drivers
Table 23
Discharge currents in PWM operation, initial predischarge current and freewheeling
MOSFETs discharge current
IDCHGx[5:0],
PDCHGINIT[5:0]
Parameter Nom. discharge current
Max. deviation to nominal
values [%]
name
[mA]
000000B
000001B
000010B
000011B
000100B
000101B
000110B
000111B
001000B
001001B
001010B
001011B
001100B
001101B
001110B
001111B
010000B
010001B
010010B
010011B
010100B
010101B
010110B
010111B
011000B
011001B
011010B
011011B
011100B
011101B
011110B
011111B
100000B
100001B
100010B
100011B
IDCHG0
0.5
+/- 60%
+/- 60%
+/- 60%
+/- 60%
+/- 60%
+/- 60%
+/- 60%
+/- 60%
+/- 55%
+/- 55%
+/- 55%
+/- 55%
+/- 55%
+/- 55%
+/- 40%
+/- 40%
+/- 40%
+/- 40%
+/- 40%
+/- 40%
+/- 40%
+/- 40%
+/- 40%
+/- 40%
+/- 40%
+/- 40%
+/- 40%
+/- 40%
+/- 40%
+/- 40%
+/- 30%
+/- 30%
+/- 30%
+/- 30%
+/- 30%
+/- 30%
IDCHG1
0.65
0.85
1.1
IDCHG2
IDCHG3
IDCHG4
1.35
1.7
IDCHG5
IDCHG6
2.1
IDCHG7
2.5
IDCHG8
3.1
IDCHG9
3.7
IDCHG10
IDCHG11
IDCHG12
IDCHG13
IDCHG14
IDCHG15
IDCHG16
IDCHG17
IDCHG18
IDCHG19
IDCHG20
IDCHG21
IDCHG22
IDCHG23
IDCHG24
IDCHG25
IDCHG26
IDCHG27
IDCHG28
IDCHG29
IDCHG30
IDCHG31
IDCHG32
IDCHG33
IDCHG34
IDCHG35
4.3
5.0
5.7
6.5
7.3
8.2
9.2
10.2
11.2
12.3
13.5
14.8
16.1
17.4
18.8
20.3
21.9
23.5
25.2
26.9
28.6
30.4
32.2
34
35.8
37.6
Datasheet
106
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Gate Drivers
Table 23
Discharge currents in PWM operation, initial predischarge current and freewheeling
MOSFETs discharge current (cont’d)
IDCHGx[5:0],
PDCHGINIT[5:0]
Parameter Nom. discharge current
Max. deviation to nominal
values [%]
name
IDCHG36
IDCHG37
IDCHG38
IDCHG39
IDCHG40
IDCHG41
IDCHG42
IDCHG43
IDCHG44
IDCHG45
IDCHG46
IDCHG47
IDCHG48
IDCHG49
IDCHG50
IDCHG51
IDCHG52
IDCHG53
IDCHG54
IDCHG55
IDCHG56
IDCHG57
IDCHG58
IDCHG59
IDCHG60
IDCHG61
IDCHG62
IDCHG63
[mA]
39.4
41.3
43.2
45.1
47
100100B
100101B
100110B
100111B
101000B
101001B
101010B
101011B
101100B
101101B
101110B
101111B
110000B
110001B
110010B
110011B
110100B
110101B
110110B
110111B
111000B
111001B
111010B
111011B
111100B
111101B
111110B
111111B
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
+/- 30 %
49
51
53
55
57
59
61.1
63.2
65.4
67.7
70
72.4
74.8
77.2
79.6
82.1
84.6
87.1
89.6
92.2
94.8
97.4
100
Datasheet
107
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Gate Drivers
11.3.7
PWM operation at high and low duty cycles with active freewheeling
This section describes the internal PWM signal of the active and FW MOSFET when the motor operates as load
or generator with active freewheeling (AFWx = 1). In particular, at low and high duty cycles, the active free-
wheeling is disabled.
Notes
1. It is recommended to clear EN_GEN_CHECK (EN_GEN_CHECK to 0)at very high and very low duty cycles:
t
ON < tHBxCCP FW or tOFF < tHBxCCP active. Under these conditions, a generator mode cannot be correctly detected.
The control scheme of the active MOSFET and of the freewheeling MOSFET can therefore be inverted.
2. The device cannot measure the switching times tDON, tDOFF, tRISE and tFALL at very high and very low duty cycles:
tON < tHBxCCP FW or tOFF < tHBxCCP active.
General case, motor operating as load, tON > tHBxCCP FW and tOFF > tHBxCCP FW + tHBxCCP active
Figure 64 shows the internal control signals of the PWM MOSFETs and the freewheeling MOSFET while the
motor operates as load:
•
•
tON is longer than the FW cross-current protection time (tHBxCCP FW).
tOFF is longer than the active cross-current protection time (tHBxCCP FW + tHBxCCP Active).
tHBxCCP3
active
tHBxCCP2
FW (sym)
tHBxCCP1
FW
External PWMx signal
tON
time
time
Control signal for
Active MOSFET
Control signal for
free-wheeling MOSFET
time
Figure 64 Internal signals for PWM operation - General case tON > tHBxCCP FW, tOFF > tHBxCCP FW +
tHBxCCP active, motor operating as load
General case, motor operating as generator, tOFF > tHBxCCP FW and tON > tHBxCCP FW + tHBxCCP
active
Figure 65 shows the internal control signals of the PWM MOSFETs and the freewheeling MOSFET while the
motor operates as generator:
•
•
tOFF is longer than the FW cross-current protection time (tHBxCCP FW).
tON is longer than the active cross-current protection time (tHBxCCP FW + tHBxCCP Active).
Datasheet
108
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Gate Drivers
External PWMx
tOFF
signal
time
tHBxCCP3
active
tHBxCCP2
FW (sym)
tHBxCCP1
FW
Inverted ext.
PWMx signal
time
time
Control signal for
Active MOSFET
Control signal for
free-wheeling MOSFET
time
Figure 65 Internal signals for PWM operation - General case: tOFF > tHBxCCP FW, tON > tHBxCCP FW
+ tHBxCCP FW, Motor operating as generator
Datasheet
109
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Gate Drivers
High duty cycle: tOFF < tHBxCCP active
No distinction between active MOSFET and FW MOSFET is possible, when the OFF-time of the external PWM
signal is shorter than the configured active cross-current protection time. Therefore the PWM MOSFET
(selected by HBxMODE[1:0]) is controlled as the active MOSFET. In other words, it is assumed that the motor
operates as load. The control signal of the PWM MOSFET is shifted by one FW cross-current protection time
compared to the external PWM signal. The MOSFET opposite to the PWM MOSFET stays OFF (passive FW).
Refer to Figure 66.
Note:
No active FW is applied if tOFF < tHBxCCP FW + tHBxCCP active
tHBxCCP2
FW (sym)
tHBxCCP1
FW
External PWMx signal
time
time
tOFF
Control signal for
PWM MOSFET
Control signal for
MOSFET opposite
to PWM MOSFET
time
Figure 66 Internal signals for PWM operation at high duty cycle, tOFF < tHBxCCP Active + tHBxCCP FW
Low duty cycle: tON < tHBxCCP FW
No distinction between active MOSFET and FW MOSFET is possible, when the ON-time of the external PWM
signal is shorter than the configured FW cross-current protection time. Therefore the PWM MOSFET (selected
by HBxMODE[1:0]) is controlled as the active MOSFET. In other words, it is assumed that the motor operates
as load. The control signal of the PWM MOSFET is shifted by one cross-current protection time compared to
the external PWM signal.
Refer to Figure 67.
Datasheet
110
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Gate Drivers
tHBxCCP
FW2 (sym)
tHBxCCP
Active 3
tHBxCCP
FW 1
External PWMx signal
time
time
tON
Control signal for
PWM MOSFET
Control signal for
MOSFET opposite
to PWM MOSFET
time
Figure 67 Internal signals for PWM operation at low duty cycle, tON < tHBxCCP FW
11.3.8
Measurements of the switching times
The effective switching times in PWM operation:
•
•
of the PWM MOSFET if EN_GEN_CHECK = 0
of the active MOSFET if EN_GEN_CHECK = 1
are reported in the registers:
EFF_TDON_OFF1,EFF_TDON_OFF2,EFF_TDON_OFF3, EFF_TDON_OFF4.
If the end of the rise time for a given MOSFET is not detected before tHBxBLANK Active elapses, then the
corresponding status register reports an effective rise time equal to zero.
If the end of the fall time for a given MOSFET is not detected before tHBxCCP Active active elapses, then the
corresponding status register reports an effective fall time equal to zero.
The device cannot measure the switching times tDON, tDOFF, tRISE and tFALL at very high and very low duty cycles:
tON < tHBxCCP FW and tOFF < tHBxCCP active. In this case, the corresponding registers report effective tDON, tDOFF, tRISE
and tFALL equal to zero.
11.4
Passive discharge
Resistors (RGGND) between the gate of GHx and GND, and between GLx and GND, ensure that the external
MOSFETs are turned off in the following conditions:
•
•
•
•
•
•
•
VCC1 undervoltage
HBxMODE = 00B in Normal Mode
CPEN = 0 in Normal Mode
VS overvoltage or VSINT overvoltage
Charge pump undervoltage and charge pump blank time (tCPUVBLANK
Charge pump overtemperature (CP_OT)
VDS overvoltage after active discharge in Normal Mode
)
Datasheet
111
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Gate Drivers
•
In Init Mode, Stop Mode, Fail Safe Mode, Restart Mode and Sleep Mode (exceptions for low-sides in parking
braking and VS / VSINT overvoltage braking , refer to Chapter 11.6 and Chapter 12.11.3)
11.5
Slam mode
The slam mode is applicable in Normal Mode.
If the SLAM bit is set in BRAKE register:
1. If HBxMODE = 01b or 10b , then the corresponding MOSFETs are actively turned off with their static
discharge current during their respective tHBxCCP Active.
2. Then charge pump is deactivated independently from CPEN
3. Then PWM1/CRC input pin is mapped to LS1, LS2, LS3 and LS4, independently from PMW12MAP,
PWM34MAP, HBxMODE and HBx_PWM_EN
a) If PWM1/CRC is High, then the low-side MOSFETs are turned on within tON_BRAKE
.
b) If PWM1/CRC is Low, then the low-side MOSFETs are turned off within tOFF_BRAKE
.
There is also the possibility to disable selectively the LSx in SLAM mode.
11.6
Parking braking mode
If PARK_BRK_EN bit is set, while the device goes in Sleep Mode or in Stop Mode:
1. If HBxMODE = 01b or 10b , then the corresponding MOSFETs are actively turned off with their static
discharge current during their respective tHBxCCP Active.
2. Then charge pump is deactivated independently from CPEN bit.
3. Then the passive discharge (RGGND) of the low-sides is deactivated, the passive discharge of the high-sides
are activated
4. If PWM1/CRC is High, then the low-side MOSFETs are turned on within tON_BRAKE
.
Refer to Chapter 12.11.2 for the protection of the of low-side MOSFETs against short circuits when the parking
braking mode is activated.
Datasheet
112
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Gate Drivers
11.7
Charge pump
A dual-stage charge pump supplies the gate drivers for the high-side and low-side MOSFETs. It requires three
external capacitors connected between CPC1N and CPC1P, CPC2N and CPC2P, VS and CP.
The buffer capacitor between VS and CP must have a capacitance equal or higher than 470 nF.
CCP ≥ 470 nF
CCP1
CCP2
VS
CP
Single/dual stage
charge pump
Precharge
Logic
Figure 68 Charge pump - Block diagram
Logic or normal level MOSFETs
The regulation of the charge pump outputs voltage can be configured depending on the type of MOSFET.
FET_LVL = 0: Logic level MOSFETs are selected:
•
•
•
VCP - VS = VCP3 (11 V typ. at VS > 8 V).
The high-side gate-source voltage GHx - SHx is VGH4 (VS > 8 V).
The low-side gate-source voltage GLx - SL is VGH3 (VS > 8 V).
FET_LVL = 1: Normal level MOSFETs are selected:
•
•
VCP - VS = VCP1(15 V typ. at VS > 8 V).
The high-side and low-side gate-source voltage GHx - SHx or GLx - SL is VGH1 (VS > 8 V).
CPSTGA = 0 (default, see GENCTRL), the device operates with the dual-stage charge pump.
If CPSTGA = 1, the device switches to single-stage or dual-stage charge pump automatically:
•
•
If VS > VCPSO DS: the TLE9561QX switches from a dual-stage to a single-stage charge pump.
If VS < VCPSO SD: the TLE9561QX switches from single-stage to dual-stage charge pump.
The operation with the single-stage charge pump reduces the current consumption from the VS pin.
Datasheet
113
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Gate Drivers
11.8
Frequency modulation
A modulation of the charge pump frequency can be activated to reduce the peak emission.
The modulation frequency is set by the control bit FMODE in GENCTRL:
•
•
FMODE = 0: No modulation.
FMODE = 1: Modulation frequency = 15.6 kHz (default).
Datasheet
114
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Gate Drivers
11.9
Electrical characteristics gate driver
The electrical characteristics related to the gate driver are valid for VCP > VS + 8.5 V
Table 24
Electrical characteristics: gate drivers
VSINT = 5.5 V to 28 V, Tj = -40°C to +150°C,
VCP > VS + 8.5 V, VS = 6 to 19V, all voltages with respect to ground, positive current flowing into pin except for IGLx
and IGHx (unless otherwise specified).
Parameter
Symbol
Values
Typ.
Unit Note or
Test Condition
Number
Min.
Max.
Comparators
SHx High Threshold
SHx Low Threshold
SHx comparator delay
MOSFET Driver Output
VSHH
VSHL
tSHx
VS - 2.6
1.9
–
VS - 1.9
2.6
V
P_12.11.1
P_12.11.2
P_12.11.3
–
V
Referred to GND
1)
–
12
30
ns
High Level Output Voltage VGH1
GHx vs. SHx and GLx vs. SL
10
7
11.5
–
12.5
12.5
V
V
2) VS ≥ 8 V ,
CLoad = 10 nF,
ICP = -12 mA,
FET_LVL = 1
P_12.11.4
High Level Output Voltage VGH2
VS = 6 V,
P_12.11.5
GHx vs. SHx and GLx vs. SL
C
Load = 10 nF,
ICP = -6 mA,
FET_LVL = 1
High Level Output Voltage VGH3
GLx vs. SL
10
–
12.5
12.5
V
V
3) VS ≥ 6 V ,
CLoad = 10 nF,
FET_LVL = 0
P_12.11.6
P_12.11.7
High Level Output Voltage VGH4
8.5
10
2) VS ≥ 8 V ,
GHx vs. SHx
C
Load = 10 nF,
ICP = -12 mA,
FET_LVL = 0
High Level Output Voltage VGH5
7
–
12.5
V
VS = 6 V,
P_12.11.8
GHx vs. SHx
CLOAD= 10 nF,
ICP = -6 mA,
FET_LVL =0
1)
Charge current
Charge current
Charge current
Charge current
ICHG0
ICHG8
ICHG16
ICHG32
-60% 0.5
-55% 3.1
-40% 9.2
-30% 32.8
+60% mA
+55% mA
+40% mA
+30% mA
ICHG = 0D
P_12.11.10
P_12.11.11
P_12.11.12
P_12.11.13
CLoad = 2.2 nF
4)
4)
4)
4)
VS ≥8V, VGS≤VGS(ON)
1)
ICHG = 8D
CLoad = 2.2 nF
VS ≥8V, VGS≤VGS(ON)
1)
ICHG = 16D
CLoad = 2.2 nF
VS ≥8V, VGS≤VGS(ON)
1)
ICHG = 32D
CLoad = 10 nF
VS ≥8V, VGS≤VGS(ON)
Datasheet
115
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Gate Drivers
Table 24
Electrical characteristics: gate drivers (cont’d)
VSINT = 5.5 V to 28 V, Tj = -40°C to +150°C,
VCP > VS + 8.5 V, VS = 6 to 19V, all voltages with respect to ground, positive current flowing into pin except for IGLx
and IGHx (unless otherwise specified).
Parameter
Symbol
Values
Typ.
Unit Note or
Test Condition
Number
Min.
Max.
1)
Charge current
ICHG48
-30% 64.3
-30% 100
-60 % -0.5
-55 % -3.1
-40% -9.2
-30% -32.2
-30% -63.2
-30% -100
+30% mA
ICHG = 48D
P_12.11.14
CLoad = 10 nF
VS ≥8V, VGS≤VGS(ON)
4)
4)
1)
Charge current
ICHG63
+30% mA
+60% mA
+55% mA
+40% mA
+30% mA
+30% mA
+30% mA
ICHG = 63 D
P_12.11.15
P_12.11.16
P_12.11.17
P_12.11.18
P_12.11.19
P_12.11.20
P_12.11.21
CLoad = 10 nF
VS ≥8V, VGS≤VGS(ON)
1)
Discharge current
Discharge current
Discharge current
Discharge current
Discharge current
Discharge current
IDCH0
IDCHG = 0D
CLoad = 2.2 nF
VS ≥8V,VGS≥VGS(OFF1)
1)
IDCH8
IDCHG =8D
CLoad = 2.2 nF
VS ≥8V,VGS≥VGS(OFF1)
1)
IDCHG16
IDCHG32
IDCHG48
IDCHG63
IDCHG =16 D
CLoad = 2.2 nF
VS ≥8V,VGS≥VGS(OFF1)
1)
IDCHG =32 D
CLoad = 10 nF
VS ≥8V,VGS≥VGS(OFF2)
1)
IDCHG = 48D
CLoad = 10 nF
VS ≥8V,VGS≥VGS(OFF2)
1)
IDCHG = 63D
CLoad = 10 nF
VS ≥8V,VGS≥VGS(OFF2)
1)5)
Charge current
temperature drift
ICHG0,TDrift
ICHG8,TDrift
-37% -12% 15%
ICHG = 0D
P_12.11.107
P_12.11.108
P_12.11.109
P_12.11.110
P_12.11.111
P_12.11.112
P_12.11.113
1)5)
Charge current
temperature drift
-17% 1%
20%
18%
9%
ICHG = 8D
1)5)
Charge current
temperature drift
ICHG16,TDrift -12% 3%
ICHG32,TDrift -11% -1%
ICHG48,TDrift -7.5% 0.5%
ICHG63,TDrift -5.5% 1.5%
ICHG = 16D
1)5)
Charge current
temperature drift
ICHG = 32D
1)5)
Charge current
temperature drift
8%
ICHG = 48D
1)5)
Charge current
temperature drift
8.5%
ICHG = 63D
1)6)
Discharge current
temperature drift
IDCHG0,TDrift -29% -4.5% 20%
IDCHG = 0D
Datasheet
116
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Gate Drivers
Table 24
Electrical characteristics: gate drivers (cont’d)
VSINT = 5.5 V to 28 V, Tj = -40°C to +150°C,
VCP > VS + 8.5 V, VS = 6 to 19V, all voltages with respect to ground, positive current flowing into pin except for IGLx
and IGHx (unless otherwise specified).
Parameter
Symbol
Values
Typ.
Unit Note or
Test Condition
Number
Min.
Max.
1)6)
Discharge current
temperature drift
IDCHG8,TDrift -8%
IDCHG16,TDrift -4%
IDCHG32,TDrift -4%
IDCHG48,TDrift -4%
8.5%
26%
IDCHG = 8D
P_12.11.114
P_12.11.115
P_12.11.116
P_12.11.117
P_12.11.118
1)6)
1)6)
1)6)
1)6)
Discharge current
temperature drift
9.5%
4.5%
3.5%
23%
13%
10%
9.5%
IDCHG = 16D
IDCHG = 32D
IDCHG = 48D
IDCHG = 63D
Discharge current
temperature drift
Discharge current
temperature drift
Discharge current
temperature drift
IDCHG63,TDrift -3.5% 3.5%
1)7)
Charge current VS drift
Charge current VS drift
Charge current VS drift
Charge current VS drift
Charge current VS drift
Charge current VS drift
ICHG0,VsDrift
ICHG8,VsDrift
3%
4.5%
6%
6%
ICHG = 0D
P_12.11.143
P_12.11.144
P_12.11.145
P_12.11.146
P_12.11.147
P_12.11.148
P_12.11.149
P_12.11.150
P_12.11.151
P_12.11.152
P_12.11.153
P_12.11.154
P_12.11.22
1)7)
4.5%
7.5%
7.5%
5.8%
4.5%
2.8%
ICHG = 8D
1)7)
ICHG16,VsDrift 4%
ICHG32,VsDrift 2%
5.8%
3.8
ICHG = 16D
ICHG = 32D
ICHG = 48D
ICHG = 63D
IDCHG = 0D
IDCHG = 8D
1)7)
1)7)
1)7)
1)8)
1)8)
ICHG48,VsDrift -0.5% 2%
ICHG63,VsDrift -2.3% 0.3
Discharge current VS drift IDCHG0,VsDrift -3%
Discharge current VS drift IDCHG8,VsDrift -3%
-1.5% 0%
-0.5% 2%
1)8)
1)8)
1)8)
1)8)
Discharge current VS drift IDCHG16,VsDrift -3.3% -0.3% 2.3%
IDCHG = 16D
IDCHG = 32D
IDCHG = 48D
Discharge current VS drift IDCHG32,VsDrift -2%
0%
2%
Discharge current VS drift IDCHG48,VsDrift -1.5% 0%
Discharge current VS drift IDCHG63,VsDrift -1.5% 0.2%
1.5%
1.5%
30
IDCHG = 63D
1)
Passive discharge
resistance between
GHx/GLx and GND
RGGND
10
20
kΩ
1)9)
Resistor between SHx and RSHGND
GND
10
–
20
22
30
35
kΩ
P_12.11.23
P_12.11.24
Low RDSON mode
RONCCP
Ω
1) VS = 13.5 V
V
CP = VS + 14 V
ICHG = IDCHG = 63D
Gate Drivers Dynamic Parameters
Gate Driver turn-on delay tDGDRV_ON1
–
–
400
ns
10) From PWM11)
P_12.11.25
Time
rising edge to 20%
of ICHGx
x = 0 to 63,
Load = 10 nF,
BDFREQ = 0
,
C
Datasheet
117
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Gate Drivers
Table 24
Electrical characteristics: gate drivers (cont’d)
VSINT = 5.5 V to 28 V, Tj = -40°C to +150°C,
VCP > VS + 8.5 V, VS = 6 to 19V, all voltages with respect to ground, positive current flowing into pin except for IGLx
and IGHx (unless otherwise specified).
Parameter
Symbol
Values
Typ.
–
Unit Note or
Test Condition
Number
Min.
Max.
Gate Driver turn-on delay tDGDRV_ON2
–
300
ns
10) From PWM11)
P_12.11.93
Time
rising edge to 20%
of ICHGx
x = 0 to 63,
Load = 10 nF,
,
C
BDFREQ = 1
Gate Driver current turn-on tGDRV_RISE(ON)
rise time
–
–
30
–
50
ns
ns
10) From 20% of
ICHGx to ICHGx ,
x = 0 to 63,
P_12.11.26
P_12.11.27
C
Load = 10 nF
Gate Driver turn-off delay tDGDRV_OFF1
400
10) From PWM11)
Time
rising edge to 20%
of IDCHGx
x = 0 to 63,
Load = 10 nF,
,
C
BDFREQ = 0
Gate Driver turn-off delay tDGDRV_OFF2
Time
–
–
–
300
50
ns
ns
10) From PWM11)
rising edge to 20%
P_12.11.94
P_12.11.28
of IDCHGx
x = 0 to 63,
Load = 10 nF,
,
C
BDFREQ = 1
10) From 20% of
Gate Driver current turn-off tGDRV_RISE(OFF
30
rise time
I
DCHGx to IDCHGx
x = 0 to 63,
Load = 10 nF
,
)
C
External MOSFET gate-to- VGS(ON)1
source voltage - ON
7
–
–
–
–
–
–
–
V
1) VS ≥ 8 V,
FET_LVL=1
1) VS ≥ 8 V,
FET_LVL=0
1) IDCHGx ≤ 36D (≤ P_12.11.30
40 mA typ.)
1)IDCHGx > 36D (> P_12.11.101
40 mA typ.)
1) BDFREQ = 0
P_12.11.29
External MOSFET gate-to- VGS(ON)2
source voltage - ON
5.5
–
–
V
P_12.11.100
External MOSFET gate-to- VGS(OFF)1
source voltage - OFF
1.5
3.8
200
100
V
External MOSFET gate-to- VGS(OFF)2
source voltage - OFF
–
V
PWM synchronization
delay
tPWM_SYNCH0 80
tPWM_SYNCH1 40
ns
ns
P_12.11.33
PWM synchronization
delay
1) BDFREQ= 1
P_12.11.82
Bridge driver frequency
Bridge driver frequency
tBDFREQ0
tBDFREQ1
16.8
33.7
18.75 20.7
37.5 42.3
MHz 1) BDFREQ= 0
MHz 1) BDFREQ= 1
P_12.11.83
P_12.11.84
Datasheet
118
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Gate Drivers
Table 24
Electrical characteristics: gate drivers (cont’d)
VSINT = 5.5 V to 28 V, Tj = -40°C to +150°C,
VCP > VS + 8.5 V, VS = 6 to 19V, all voltages with respect to ground, positive current flowing into pin except for IGLx
and IGHx (unless otherwise specified).
Parameter
Symbol
Values
Typ.
107
Unit Note or
Test Condition
Number
Min.
Max.
Pre-charge time
Pre-charge time
Pre-charge time
Pre-charge time
Pre-charge time
Pre-charge time
Pre-charge time
Pre-charge time
Pre-discharge time
Pre-discharge time
Pre-discharge time
Pre-discharge time
Pre-discharge time
Pre-discharge time
Pre-discharge time
Pre-discharge time
tPCHG000
tPCHG001
tPCHG010
tPCHG011
tPCHG100
tPCHG101
tPCHG110
tPCHG111
tPDCHG000
tPDCHG001
tPDCHG010
tPDCHG011
tPDCHG100
tPDCHG101
tPDCHG110
tPDCHG111
80
140
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
1) TPCHG = 000,
P_12.11.34
P_12.11.35
P_12.11.36
P_12.11.37
P_12.11.85
P_12.11.86
P_12.11.87
P_12.11.88
P_12.11.38
P_12.11.39
P_12.11.40
P_12.11.41
P_12.11.89
P_12.11.90
P_12.11.91
P_12.11.92
BDFREQ= 0 or 1
1) TPCHG = 001,
BDFREQ= 0 or 1
1) TPCHG = 010,
BDFREQ= 0 or 1
1) TPCHG = 011,
BDFREQ= 0 or 1
1) TPCHG = 100,
BDFREQ= 0 or 1
1) TPCHG = 101,
BDFREQ= 0 or 1
1) TPCHG = 110,
BDFREQ= 0 or 1
1) TPCHG = 111,
BDFREQ= 0 or 1
1) TPDCHG = 000,
BDFREQ= 0 or 1
1) TPDCHG = 001,
BDFREQ= 0 or 1
1) TPDCHG = 010,
BDFREQ= 0 or 1
1) TPDCHG = 011,
BDFREQ= 0 or 1
1) TPDCHG = 100,
BDFREQ= 0 or 1
1) TPDCHG = 101,
BDFREQ= 0 or 1
1) TPDCHG = 110,
BDFREQ= 0 or 1
1) TPDCHG = 111,
130
170
210
250
420
600
840
80
160
214
267
320
533
747
1067
107
160
214
267
320
533
747
1067
190
260
330
390
630
900
1260
140
190
260
330
390
630
900
1260
130
170
210
250
420
600
840
BDFREQ= 0 or 1
Low-side gate driver, CP off - Slam mode, parking braking and VS overvoltage braking
LS turn-on time, CP off
tON_BRAKE
–
4.5
9
µs
CLOAD = 10 nF
P_12.11.42
VGLx-VSL = 5 V,
VS > 8 V or VSINT > 8 V
Datasheet
119
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Gate Drivers
Table 24
Electrical characteristics: gate drivers (cont’d)
VSINT = 5.5 V to 28 V, Tj = -40°C to +150°C,
VCP > VS + 8.5 V, VS = 6 to 19V, all voltages with respect to ground, positive current flowing into pin except for IGLx
and IGHx (unless otherwise specified).
Parameter
Symbol
Values
Typ.
0.7
Unit Note or
Test Condition
Number
Min.
Max.
LS turn-off time, CP off
tOFF_BRAKE
–
2
µs
CLOAD = 10 nF
P_12.11.43
VGLx-VSL = 1.5 V,
VS > 8 V or VSINT > 8 V
High output voltage
GLx - SL
VGLx_BRAKE
5
–
10
V
VS > 8 V or VSINT > 8 V P_12.11.48
Charge pump
1)
Charge Pump Frequency
fCP
–
250
–
–
–
kHz
V
P_12.11.49
Output Voltage VCP vs. VS VCPmin1
8.5
VS = 6 V, ICP = - 6 mA, P_12.11.50
FET_LVL =1
Output Voltage VCP vs. VS VCPmin2
7.5
12
–
–
V
V
VS = 6 V, ICP = - 6 mA, P_12.11.51
FET_LVL =0
Regulated CP output
voltage, VCP vs. VS
VCP1
15
17
8 V < VS < 23 V
I
CPSTGA = 0,
FET_LVL =1
P_12.11.52
P_12.11.53
P_12.11.54
P_12.11.55
CP = - 12 mA13)
,
Regulated CP output
voltage, VCP vs. VS
VCP2
12
7.5
7.5
5
15
11
11
–
17
13
13
60
60
120
V
18 V < VS < 23 V
ICP = - 12 mA13)
CPSTGA = 1,
FET_LVL =1
,
Regulated CP output
voltage, VCP vs. VS
VCP3
V
8 V < VS < 23 V
I
CP = - 12 mA13)
,
CPSTGA = 0,
FET_LVL =0
Regulated CP output
voltage, VCP vs. VS
VCP4
V
13 V < VS < 23 V
I
CP = - 12 mA13)
,
CPSTGA = 0,
FET_LVL =0
1)12)13)18 V<VS< 23 V P_12.11.56
(25%), ICP = 0 ,
CPSTGA = 1,
FET_LVL =1
Turn-on time
Rise time
tON_VCP1
tRISE_VCP1
tON_VCP2
µs
µs
µs
5
30
60
1)12)13)18 V < VS < 23 P_12.11.57
V (25%-75%)
ICP = 0 , CPSTGA = 1,
FET_LVL =1
1)12)13) 13 V < VS <23 P_12.11.58
V (25%), ICP = 0,
Turn-on time
20
CPSTGA = 1,
FET_LVL =0
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DC Motor System IC
Gate Drivers
Table 24
Electrical characteristics: gate drivers (cont’d)
VSINT = 5.5 V to 28 V, Tj = -40°C to +150°C,
VCP > VS + 8.5 V, VS = 6 to 19V, all voltages with respect to ground, positive current flowing into pin except for IGLx
and IGHx (unless otherwise specified).
Parameter
Symbol
Values
Typ.
30
Unit Note or
Test Condition
Number
Min.
Max.
Rise time
tRISE_VCP2
5
60
µs
1)12)13)13 V < VS < 23 P_12.11.59
V (25%-75%)
ICP = 0 , CPSTGA = 1,
FET_LVL =0
Automatic switch over dual VCPSO DS
to single stage charge
pump
16
17
18
V
V
V
V
CPSTGA = 1,
FET_LVL =1,
VS rising
P_12.11.60
P_12.11.61
P_12.11.62
P_12.11.64
Automatic switch over dual VCPSO DS
to single stage charge
pump
11.5
15.5
11
12.25 13
CPSTGA = 1,
FET_LVL = 0,
VS rising
Automatic switch over
single to dual stage charge
pump
VCPSO SD
16.5
17.5
CPSTGA = 1,
FET_LVL =1,
VS falling
Automatic switch over
single to dual stage charge
pump
VCPSO SD
11.75 12.5
CPSTGA = 1,
FET_LVL = 0,
VS falling
Charge pump switch over VCPSO HY
hysteresis
–
–
0.5
–
V
1) CPSTGA = 1
VCPSO DS - VCPSO SD
13) 8 V < VS < 28 V
CPSTGA = 0
P_12.11.65
P_12.11.68
Charge pump minimum
output current
ICPOC1
–
-12
mA
FET_LVL =1
Charge pump minimum
output current
ICPOC2
–
–
–
-12
mA
13) 8 V < VS < 28 V
CPSTGA = 0
FET_LVL =0
P_12.11.69
Digital PWMx Inputs
High Level Input Voltage
Threshold
VPWMH
–
–
0.7 ×
Vcc1
V
–
P_12.11.95
P_12.11.96
P_12.11.97
P_12.11.98
Low Level Input Voltage
Threshold
VPWML
0.3 ×
Vcc1
–
V
–
1)
PWMx Input Hysteresis
VPWM,hys
RPD_PWM
–
0.12 ×
Vcc1
–
V
PWMx Pull-down
Resistance
20
40
80
kΩ
–
CRC Select; Pin PWM1/CRC
14)
1)
Config Pull-up Resistance RCFG
100
10
kΩ
P_12.11.99
Config Select Filter Time tCFG_F
5
14
µs
P_12.11.105
1) Not subject to production test, specified by design.
2) Independent from CPSTGA.
3) ICP = -12 mA for VS ≥ 8 V, ICP = 6 mA for VS = 6 V.
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Gate Drivers
4) VGS(ON) = VGS(ON)1 if FET_LVL = 1, VGS(ON) = VGS(ON)2 if FET_LVL = 0.
5) (ICHGx@Tj=150°C - ICHGx@Tj=-40°C) / ICHGx@Tj=25°C
6) (IDCHGx@Tj=150°C - IDCHGx@Tj=-40°C) / IDCHGx@Tj=25°C
7) (ICHGx@VS=19V - ICHGx@VS=8V) / ICHGx@VS=13.5V
8) (IDCHGx@VS=19V - ICHGx@VS=8V) / IDCHGx@VS=13.5V
9) This resistance is the resistance between GHx and GND connected through a diode to SHx. As a consequence, the
voltage at SHx can rise up to 0.6 V typ. before it is discharged through the resistor.
10) Not subject to production test, specified by design.
11) External PWM signal.
12) Parameter dependent on the capacitance CCP
.
13) CCPC1 = CCPC2 = 220 nF, CCP = 470 nF. Other CCP values higher than 470 nF can be used. Note that this capacitor
influences the charge pump rise and turn-on times, and the charge , VCP ripple voltage when charging the gate of a
MOSFET.
14) Config Pull-up will be only active during startup-phase for checking external pull-down. After checking, the typ. 40 kΩ
Pull-down resistance will be present.
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DC Motor System IC
Supervision Functions
12
Supervision Functions
12.1
Reset Function
VCC1
RSTN
Resetlogic
Incl. filter & delay
Figure 69 Reset Block Diagram
12.1.1
Reset Output Description
The reset output pin RSTN provides a reset information to the microcontroller, for example, in the event that
the output voltage has fallen below the undervoltage threshold VRTx. In case of a reset event, the reset output
RSTN is pulled to low after the filter time tRF and stays low as long as the reset event is present plus a reset
delay time tRD1 or tRD2 depending on the value in RSTN_DEL. When connecting the device to battery voltage,
the reset signal remains low initially. When the output voltage VCC1 has reached the reset default threshold
VRT1,r, the reset output RSTN is released to high after the reset delay time tRD1. A reset can also occur due to a
watchdog trigger failure. The reset threshold can be adjusted via SPI, the default reset threshold is VRT1,f. The
RSTN pin has an integrated pull-up resistor. In case reset is triggered, it will be pulled low for VCC1 ≥ 1V and
for VSINT ≥ VPOR,f (see also Chapter 12.3).
The timings for the RSTN triggering regarding VCC1 undervoltage and watchdog trigger is shown in Figure 70.
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DC Motor System IC
Supervision Functions
VCC1
VRT1
t < tRF
The reset threshold can be
configured via SPI in
Normal Mode, default is VRT1
undervoltage
t
tCW
tOW
tRD1
tRDx (config)
tCW
tLW
tLW
tCW
tOW
SPI
SPI
Init
WD
Trigger
WD
Trigger
SPI
Init
t
t
tRF
RSTN
t
t
t
LW= long open window
CW= closed window
OW= open window
Init
Normal
Restart
Normal
Reset_timing.vsd
Figure 70 Reset Timing Diagram
12.1.2
Soft Reset Description
In Normal Mode and Stop Mode, it is also possible to trigger a device internal reset via a SPI command in order
to bring the device into a defined state in case of failures. In this case the microcontroller must send a SPI
command and set the MODE bits to ‘11’ in the M_S_CTRL register. As soon as this command becomes valid,
the device is set back to Init Mode and all SPI registers are set to their default values (see SPI Chapter 13.5.1
and Chapter 13.6.1).
Two different soft reset configurations are possible via the SPI bit SOFT_RESET_RO:
•
•
SOFT_RESET_RO = ‘0’: The reset output (RSTN) is triggered when the soft reset is executed (default
setting) The configured reset delay time tRD1 or tRD2 is applied depending on the value in RSTN_DEL).
SOFT_RESET_RO = ‘1’: The reset output (RSTN) is not triggered when the soft reset is executed.
Note:
The device must be in Normal Mode or Stop Mode when sending this command.
Otherwise, the command will be ignored.
Note:
Allow CRC configuration after software-reset - or better check once again via SPI after software
reset.
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Supervision Functions
12.2
Watchdog Function
The watchdog is used to monitor the software execution of the microcontroller and to trigger a reset or move
the device to Fail Safe Mode, if the microcontroller stops serving the watchdog due to a lock up in the software.
Two different types of watchdog functions are implemented and can be selected via the bit WD_CFG:
•
•
Time-Out Watchdog (default value)
Window Watchdog
The respective watchdog functions can be selected and programmed in Normal Mode. The configuration stays
unchanged in Stop Mode.
Please refer to Table 25 to match the device modes with the respective watchdog modes.
Table 25 Watchdog Functionality by modes
Mode
Watchdog Mode
Remarks
Init Mode
Starts with Long Open
Window
Watchdog starts with Long Open Window after RSTN
is released.
Normal Mode
WD Programmable
Window Watchdog, Time-Out watchdog or switched
off for Stop Mode.
Stop Mode
Sleep Mode
Watchdog is fixed or off
Off
Device will start with Long Open Window when
entering Normal Mode.
Restart Mode
Off
Device will start with Long Open Window when
entering Normal Mode.
The watchdog timing is programmed via SPI command in the register WD_CTRL. As soon as the watchdog is
programmed, the timer starts with the new setting and the watchdog must be served. The watchdog is
triggered by sending a valid SPI-write command to the watchdog configuration register. The watchdog trigger
command is executed when the SPI command is interpreted.
When coming from Init Mode, Restart Mode or in certain cases from Stop Mode, the watchdog timer is always
started with a long open window. The long open window (tLW) allows the microcontroller to run its
initialization sequences and then to trigger the watchdog via SPI.
The watchdog timer period can be selected via SPI (WD_TIMER).The timer setting is valid for both watchdog
types.
The following watchdog timer periods are available:
•
•
•
•
•
•
•
•
WD Setting 1: 10 ms
WD Setting 2: 20 ms
WD Setting 3: 50 ms
WD Setting 4: 100 ms
WD Setting 5: 200 ms
WD Setting 6: 500 ms
WD Setting 7: 1 s
WD Setting 8: 10 s
In case of a reset, Restart Mode or Fail-Safe Mode is entered according to the configuration and the SPI bits
WD_FAIL are set. Once the RSTN goes high again the watchdog immediately starts with a long open window
the device enters automatically Normal Mode.
The Watchdog behaviour in Software Development Mode is described in Chapter 5.4.7.
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Supervision Functions
In case a watchdog-trigger was missed in Software Development Mode, the watchdog will start with the long-
open-window once again.
The WD_FAIL bits will be set after a watchdog trigger failure.
The WD_FAIL bits are cleared automatically when following conditions apply:
•
•
After a successful watchdog trigger.
When the watchdog is off: in Stop Mode after successfully disabling it, in Sleep Mode, or in Fail-Safe Mode
(except for a watchdog failure).
12.2.1
Time-Out Watchdog
The time-out watchdog is an easier and less secure watchdog than a window watchdog as the watchdog
trigger can be done at any time within the configured watchdog timer period.
A correct watchdog service immediately results in starting a new watchdog timer period. Taking the
tolerances of the internal oscillator into account leads to the safe trigger area as defined in Figure 71.
If the time-out watchdog period elapses, a watchdog reset is created by setting the reset output RSTN low and
the device switches to Restart Mode or Fail-Safe Mode.
Typical timout watchdog trigger period
tWD x 1.50
open window
uncertainty
Watchdog Timer Period (WD_TIMER)
tWD x 1.20
tWD x 1.80
t / [tWD_TIMER
]
safe trigger area
Figure 71 Time-out Watchdog Definitions
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Supervision Functions
12.2.2
Window Watchdog
Compared to the time-out watchdog the characteristic of the window watchdog is that the watchdog timer
period is divided between a closed and an open window. The watchdog must be triggered within the open
window.
A correct watchdog trigger results in starting the window watchdog period by a closed window followed by an
open window.
The watchdog timer period is at the same time the typical trigger time and defines the middle of the open
window. Taking the oscillator tolerances into account leads to a safe trigger area of:
tWD × 0.72 < safe trigger area < tWD × 1.20.
The typical closed window is defined to a width of 60% of the selected window watchdog timer period. Taking
the tolerances of the internal oscillator into account leads to the timings as defined in Figure 72.
A correct watchdog service immediately results in starting the next closed window.
If the trigger signal meet the closed window or if the watchdog timer period elapses, then a watchdog reset is
triggered (RSTN low) and the device switches to Restart Mode or Fail-Safe Mode.
tWD x 0.6
tWD x 0.9
Typ. closed window
Typ. open window
tWD x 0.48
tWD x 0.72
tWD x 1.0
tWD x 1.20
tWD x 1.80
closed window
uncertainty
open window
uncertainty
Watchdog Timer Period (WD_TIMER)
t / [tWD_TIMER
]
safe trigger area
Figure 72 Window Watchdog Definitions
12.2.3
Watchdog Setting Check Sum
A check sum bit is part of the SPI command to trigger the watchdog and to set the watchdog setting.
The sum of the 16 data bits in the register WD_CTRL needs to have even parity (see Equation (12.1)). This is
realized by either setting the bit CHECKSUM to 0 or 1. If the check sum is wrong, then the SPI command is
ignored, i.e. the watchdog is not triggered or the settings are not changed and the bit SPI_FAIL is set.
The written value of the reserved bits of the WD_CTRL register is considered (even if read as ‘0’ in the SPI
output) for checksum calculation, i.e. if a 1 is written on the reserved bit position, then a 1 will be used in the
checksum calculation.
(12.1)
Bit(CHECKSUM) = Bit22 ⊕ … ⊕ Bit8
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DC Motor System IC
Supervision Functions
12.2.4
Watchdog during Stop Mode
The watchdog can be disabled for Stop Mode in Normal Mode. For safety reasons, there is a special sequence
to be followed in order to disable the watchdog as described in Figure 73. Two different SPI bits
(WD_STM_EN_0, WD_STM_EN_1) in the registers HW_CTRL and WD_CTRL need to be set.
Correct WD disabling
Sequence Errors
sequence
ꢀMissing to set bit
WD_STM_EN_0 with the
next watchdog trigger after
having set WD_STM_EN_1
Set bit
WD_STM_EN_1 = 1
with next WD Trigger
ꢀStaying in Normal Mode
instead of going to Stop
Mode with the next trigger
Set bit
WD_STM_EN_0 = 1
Before subsequent WD Trigger
Will enable the WD:
Change to
Stop Mode
ꢀSwitching back to
Normal Mode
ꢀTriggering the watchdog
WD is switched off
Figure 73 Watchdog disabling sequence in Stop Mode
If a sequence error occurs, then the bit WD_STM_EN_1 will be cleared and the sequence has to be started
again.
The watchdog can be enabled by triggering the watchdog in Stop Mode or by switching back to Normal Mode
via SPI command. In both cases the watchdog will start with a long open window and the bits WD_STM_EN_1
and WD_STM_EN_0 are cleared. After the long open window the watchdog has to be served as configured in
the WD_CTRL register.
Note:
The bit WD_STM_EN_0 will be cleared automatically when the sequence is started and it was 1
before. WD_STM_EN_0 can also not be set if WD_STM_EN_1 isn't yet set.
12.2.5
Watchdog Start in Stop Mode due to Bus Wake
In Stop Mode the Watchdog can be disabled. In addition a feature is available which will start the watchdog
with any BUS wake (CAN, ) during Stop Mode. The feature is enabled by setting the bit WD_EN_ WK_BUS = 1
(default value after POR). The bit can only be changed in Normal Mode and needs to be programmed before
starting the watchdog disable sequence.
A wake on the Bus will generate an interrupt and the RXDCAN, is pulled to low. By these signals the
microcontroller is informed that the watchdog is started with a long open window. After the long open
window the watchdog has to be served as configured in the WD_CTRL register.
To disable the watchdog again, the device needs to be switched to Normal Mode and the sequence needs to
be sent again.
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Supervision Functions
12.3
VSINT Power On Reset
At power up of the device, the Power on Reset is detected when VSINT > VPOR,r and the SPI bit POR is set to
indicate that all SPI registers are set to POR default settings. VCC1 is starting up and the reset output will be
kept low and will only be released once VCC1 has crossed VRT1,r and after tRD1 has elapsed.
In case VSINT < VPOR,f, an device internal reset will be generated and the device is switched off and will restart
in Init Mode at the next VSINT rising. This is shown in Figure 74.
VSINT
VPOR,r
VPOR,f
t
t
VCC1
VRT1,r
The reset threshold can be
configured via SPI in
Normal Mode, default is VRT1
VRTx,f
RSTN
Restart Mode is entered
whenever the Reset is
triggered
t
tRD1
Mode
Re-
start
OFF
INIT MODE
Any MODE
OFF
t
SPI
Command
Figure 74 Ramp up / down example of Supply Voltage
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DC Motor System IC
Supervision Functions
12.4
VSINT Under- and Overvoltage
12.4.1
VSINT Undervoltage
The VSINT under-voltage monitoring is always active in Init Mode, Restart Mode, Normal Mode. If the supply
voltage VSINT drops below VSINT,UV for more than tVSUV_FILT, then the device does the following measures:
•
The VCC1 short circuit diagnosis becomes inactive (see Chapter 12.8). However, the thermal protection of
the device remains active. If the undervoltage threshold is exceeded (VSINT rising) then the function will
be automatically enabled again.
•
The status bit VSINT_UV is set and latched until a clear command of SUP_STAT is received.
Note:
VSINT under-voltage monitoring is not available in Stop Mode due to current consumption saving
requirements except if the VCC1 load current is above the active peak threshold (I_PEAK_TH) or if
VCC1 is below the VCC1 prewarning threshold.
12.4.2
VSINT Overvoltage
The VSINT over-voltage monitoring is always active in Init Mode, Restart Mode and Normal Mode. If VSINT rises
above VS,OVD1, VS,OVD2 for more than tVSOV_FILT then the device does the following measures:
1. If HBxMODE = 01b or 10b , then the corresponding MOSFETs are actively turned off with their static
discharge current during their respective tHBxCCP Active.
2. Then the charge pump is turned off and the passive discharge is activated.
3. The status bits VSINT_OV is set and latched until a clear command of SUP_STAT is received.
If VS or VSINT fall below VS,OVD1 or VS,OVD2
:
•
•
If CPEN = 0 : the charge pumps stays and the bridge driver stay off.
If CPEN = 1 :
–
If BDOV_REC = 0 : Then the charge pump is reactivated but the bridge driver stays off until VS_OV and
VSINT_OV are cleared.
–
If BDOV_REC = 1 : Then the charge pump is reactivated and the bridge driver is enabled if VCP > VCPUVx
even if VS_OV or VSINT_OV is set. The state of the external MOSFETs is according to the control
registers.
,
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DC Motor System IC
Supervision Functions
12.5
VS Under- and Overvoltage
12.5.1
VS Undervoltage
The VS under-voltage monitoring is always active in Init-, Restart Mode and Normal Mode. If VS drops below
VS,UV for more than tVSUV_FILT, then the device does the following measures:
1. If HBxMODE = 01b or 10b , then the corresponding MOSFETs are actively turned off with their static
discharge current during their respective tHBxCCP Active.
2. Then the charge pump is turned off and the passive discharge is activated .
3. The status bits VS_UV is set and latched until a clear command of SUP_STAT is received.
If VS rises above VS,UV, then the charge pump is reactivated (provided that CPEN is set) but the bridge driver
stays off until VS_UV is cleared. The bridge driver will be reactivated once the VS_UV bit is cleared.
12.5.2
VS Overvoltage
The VS over-voltage monitoring is always active in Init-, Restart Mode and Normal Mode or when the charge
pump is enabled. If VS rises above VS,OVD1 or VS,OVD2 for more than tVSOV_FILT, then the device does the following
measures:
1. If HBxMODE = 01b or 10b , then the corresponding MOSFETs are actively turned off with their static
discharge current during their respective tHBxCCP Active.
2. Then the charge pump is turned off and the passive discharge is activated.
3. The status bits VS_OV is set and latched until a clear command of SUP_STAT is received.
If VS and VSINT fall below VS,OVD1 or VS,OVD2
:
•
•
If CPEN = 0 : the charge pumps and the bridge driver stay off.
If CPEN = 1 :
–
If BDOV_REC = 0 : Then the charge pump is reactivated (provided that CPEN = 1 and CP_UV = 0) but the
bridge driver stays off until VS_OV and VSINT_OV are cleared.
–
If BDOV_REC = 1 : Then the charge pump is reactivated and the bridge driver is enabled if VCP > VCPUVx
even if VS_OV or VSINT_OV is set. The state of the external MOSFETs is according to the control
registers.
,
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Supervision Functions
12.6
VSHS Under- Overvoltage
12.6.1
VSHS Undervoltage
If the supply voltage VSHS passes below the undervoltage threshold (VSHS,UVD) the device does the following
measures:
•
•
HS1...4 are acting accordingly to the SPI setting (refer also to Chapter 7.2.1).
SPI bit HS_UV is set. No other error bits are set. The bit can be cleared once the condition is not present
anymore.
12.6.2
VSHS Overvoltage
If the supply voltage VSHS reaches the overvoltage threshold (VSHS,OVD) the device triggers the following
measures:
•
•
HS1...4 are acting accordingly to the SPI setting (refer also to Chapter 7.2.2).
The status bit HS_OV is set. No other error bits are set. The bit can be cleared once the condition is not
present anymore.
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Supervision Functions
12.7
VCC1 Over-/ Undervoltage and Undervoltage Prewarning
12.7.1
VCC1 Undervoltage and Undervoltage Prewarning
This function is always active when the VCC1 voltage regulator is enabled.
A first-level voltage detection threshold is implemented as a prewarning for the microcontroller. The
prewarning event is signaled with the bit VCC1_WARN. No other actions are taken.
As described in Chapter 12.1 and Figure 75, a reset will be triggered (RSTN pulled low) when the VCC1 output
voltage falls below the selected undervoltage threshold (VRTx). The device will enter Restart Mode and the bit
VCC1_UV is set when RSTN is released again.
The hysteresis of the VCC1 undervoltage threshold can be increased by setting the bit RSTN_HYS. In this case
always the highest rising threshold (VRT1,R) is used for the release of the undervoltage reset. The falling reset
threshold remains as configured.
An additional safety mechanism is implemented to avoid repetitive VCC1 undervoltage resets due to high
dynamic loads on VCC1:
•
A counter is increased for every consecutive VCC1 undervoltage event (regardless on the selected reset
threshold).
•
•
The counter is active in Init Mode, Normal Mode and Stop Mode.
For VS < VSINT,UV the counter will be stopped in Normal Mode (i.e. the VS UV comparator is always enabled
in Normal Mode).
•
•
A 4th consecutive VCC1 undervoltage event will lead to Fail-Safe Mode entry and to setting the bit
VCC1_UV_FS.
This counter is cleared:
–
–
–
When Fail-Safe Mode is entered.
When the bit VCC1_UV is cleared.
When a Soft-Reset is triggered.
Note:
Note:
After 4 consecutive VCC1_UV events, the device will enter Fail-Safe Mode and the VCC1_UV_FS bit is
set.
The VCC1_WARN or VCC1_UV bits are not set in Sleep Mode as VCC1 = 0 V in this case.
VCC1
VRTx
t
tRF
tRDx (config)
RSTN
t
Normal Mode
Restart Mode
Normal Mode
Figure 75 VCC1 Undervoltage Timing Diagram
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Supervision Functions
Note:
It is recommended to clear the VCC1_WARN and VCC1_UV bit once it is detected by the
microcontroller software to verify if the undervoltage still exists or not.
12.7.2
VCC1 Overvoltage
For fail-safe reasons a configurable VCC1 over voltage detection feature is implemented. It is active when the
VCC1 voltage regulator is enabled.
In case the VCC1,OV,r threshold is crossed, the device triggers following measures depending on the
configuration:
•
•
•
The bit VCC1_OV is always set.
Based on the configuration of VCC1_OV_MOD, different kind of event are generated from device.
If the VCC1_OV_MOD=11B, in case of the device enters in Fail Safe Mode, the Fail Safe Output is activated
(according WK2_FO setting).
VCC1
VCC1,OV
t
tOV_filt
RSTN
tRDx (config)
t
Normal Mode
Restart Mode
Normal Mode
Figure 76 VCC1 Over Voltage Timing Diagram
12.8
VCC1 Short Circuit Diagnostics
The short circuit protection feature for VCC1 is implemented as follows:
•
•
The short circuit detection is only enabled if VS > VSINT,UV.
If VCC1 is not above the VRTx within tVCC1,SC after device power up or after waking from Sleep Mode or Fail-
Safe Mode (i.e. after VCC1 is enabled) then the SPI bit VCC1_SC bit is set, VCC1 is turned off, the FO pin is
enabled, FAILURE is set and Fail-Safe Mode is entered. The device can be activated again via a wake-up
sources.
•
The same behavior applies, if VCC1 falls below VRTx for longer than tVCC1,SC.
12.9
VCAN Undervoltage
An undervoltage warning is implemented for VCAN as follows:
•
V
V
CAN undervoltage detection: In case the CAN module is enabled and the voltage on VCAN will drop below the
CAN_UV,f threshold, then the SPI bit VCAN_UV is set and can be only cleared via SPI.
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12.10
Thermal Protection
Three independent and different thermal protection features are implemented in the device according to the
system impact:
•
•
•
Individual thermal shutdown of specific blocks
Temperature prewarning of VCC1 voltage regulator
Device thermal shutdown due to VCC1 overtemperature
12.10.1 Individual Thermal Shutdown
As a first-level protection measure, CAN, HSx and the charge pump are independently switched off if the
respective block reaches the temperature threshold TjTSD1. Then the TSD1 bit is set. This bit can only be
cleared via SPI once the overtemperature is not present anymore. Independent of the device mode the
thermal shutdown protection is only active if the respective block is ON.
The respective modules behave as follows:
•
CAN: The transmitter is disabled and stays in CAN Normal Mode acting like CAN Receive Only Mode. The
status bits CAN_FAIL are set to ‘01’. Once the overtemperature condition is not present anymore, then the
CAN transmitter is automatically switched on.
•
HSx: If one or more HSx switches reach the TSD1 threshold, then the HSx switches are turned OFF
(depending on configuration either individually or all at once) and the control bits for HSx are cleared
based on HS_OT_SD_DIS setting. The status bits HSx_OT are set (see register HS_OL_OC_OT_STAT).
Once the over temperature condition is not present anymore, then HSx has to be configured again by SPI.
•
Charge pump: If the charge pump reaches TjTSD1, then CP_OT is set, CPEN is cleared and the activated
MOSFETs are actively discharged with their respective static currents during their respective active cross
current protection times (tHBxCCP active). When all tHBxCCP active elapsed, then the charge pump and
the MOSFETs active discharge are disabled . Once the over temperature condition is not present anymore,
then CPEN has to be configured again by SPI.
Note:
The diagnosis bits are not cleared automatically and have to be cleared via SPI once the
overtemperature condition is not present anymore.
12.10.2 Temperature Prewarning
As a next level of thermal protection a temperature prewarning is implemented if the main supply VCC1
reaches the thermal prewarning temperature threshold TjPW. Then the status bit TPW is set. This bit can only
be cleared via SPI once the overtemperature is not present anymore.
12.10.3 Thermal Shutdown
As a highest level of thermal protection a temperature shutdown of the device is implemented if the main
supply VCC1 reaches the thermal shutdown temperature threshold TjTSD2. Once a TSD2 event is detected Fail-
Safe Mode is entered. Only when device temperature falls below the TSD2 threshold then the device remains
in Fail-Safe Mode for tTSD2 to allow the device to cool down. After this time has expired, the device will
automatically change via Restart Mode to Normal Mode (see also Chapter 5.4.6).
When a TSD2 event is detected, then the status bit TSD2 is set. This bit can only be cleared via SPI in Normal
Mode once the overtemperature is not present anymore.
For increased robustness requirements it is possible to extend the TSD2 waiting time by 64x of tTSD2 after 16
consecutive TSD2 events by setting the SPI bit TSD2_DEL. The counter is incremented with each TSD2 event
even if the bit TSD2 is not cleared. Once the counter has reached the value 16, then the bit TSD2_SAFE is set
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Supervision Functions
and the extended TSD2 waiting time is active. The extended waiting time will be kept until TSD2_SAFE is
cleared. The TSD counter is cleared when TSD2 or TSD2_DEL is cleared.
Note:
In case a TSD2 overtemperature occurs while entering Sleep Mode then Fail-Safe Mode is still
entered.
Note:
In case of a TSD2 event, the FAILURE bit is set to ‘1’ and the DEV_STAT field is set to ‘01’ inside the
DEV_STAT register.
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DC Motor System IC
Supervision Functions
12.11
Bridge driver
This section describes the supervision functions related to the bridge driver.
12.11.1 Bridge driver supervision with activated charge pump
This section describes the supervision functions when the charge pump is activated.
12.11.1.1 Drain-source voltage monitoring
Voltage comparators monitor the activated MOSFETs to protect high-side MOSFETs and low-side MOSFETs
against a short circuit respectively to ground and to the battery during ON-state.
A drain-source overvoltage is detected on a low-side MOSFET if the voltage difference between VSHx and SL
exceeds the threshold voltage configured by LS_VDS (see Table 26). Consequently, the corresponding half-
bridge is latched off with the static discharge current.
A drain-source overvoltage is detected on a high-side MOSFET if the voltage difference between VS and VSHx
exceeds the threshold voltage configured by HS_VDS (see Table 27). Consequently, the corresponding half-
bridge is latched off with the static discharge current.
Table 26 Low-side drain-source overvoltage threshold
LSxVDSTH[2:0]
000B
Drain-Source overvoltage threshold for LSx (typical)
160 mV
200 mV (default)
300 mV
400 mV
500 mV
600 mV
800 mV
2 V
001B
010B
011B
100B
101B
110B
111B
Table 27 High-side drain-source overvoltage threshold
HSxVDSTH[2:0]
000B
Drain-Source overvoltage threshold for HSx (typical)
160 mV
200 mV (default)
300 mV
400 mV
500 mV
600 mV
800 mV
2 V
001B
010B
011B
100B
101B
110B
111B
Attention: 2 V threshold is dedicated for the diagnostic in off-state. It is highly recommended to select
another drain-source overvoltage threshold once the routine of the diagnostic in off-state has
been performed to avoid additional current consumption from VS and from the charge pump.
The device reports a Drain-Source overvoltage error if both conditions are met:
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•
•
After expiration of the blank time .
If the Drain-Source voltage monitoring exceeds the configured threshold for a duration longer than the
configured filter time (refer to Table 28 and LS_VDS TFVDS bits).
Table 28 Drain-Source overvoltage filter time
TFVDS[2:0]
Drain-Source overvoltage filter time (typical)
00B
01B
10B
11B
0.5 µs (default)
1 µs
2 µs
6 µs
If a short circuit is detected by the Drain-Source voltage monitoring:
•
The impacted half-bridge is latched off with the static discharge current for the configured cross-current
protection time.
•
•
The corresponding bit in the status register DSOV is set.
The DSOV bit in Global Status Register GEN_STAT is set.
If a Drain-Source overvoltage is detected for one of the MOSFETs, then the status register DSOV must be
cleared in order to re-enable the faulty half-bridge.
12.11.1.2 Cross-current protection and drain-source overvoltage blank time
All gate drivers feature a cross-current protection time and a Drain-Source overvoltage blank time.
The cross-current protection avoids the simultaneous activation of the high-side and the low-side MOSFETs
of the same half-bridge.
During the blank time, the drain-source overvoltage detection is disabled, to avoid a wrong fault detection
during the activation phase of a MOSFET.
Note:
The setting of the cross-current protection and of the blank times may be changed by the
microcontroller only if all HBx_PWM_EN bits are reset.
Note:
Changing the Drain-Source overvoltage of a half-bridge x (HBx) in on-state (HBxMODE[1:0]=(0,1) or
(1,0)) may result in a wrong VDS overvoltage detection on HBx. Therefore it is highly recommended
to change this threshold when HBxMODE[1:0]=(0,0) or (1,1)
12.11.1.2.1 Cross-current protection
The active and freewheeling cross-current protection times of each half-bridge is configured individually with
the control register CCP_BLK.
The typical cross-current protection time applied to the freewheeling MOSFET of the half-bridge x is 587 ns +
266 ns x TCCP[3:0]D, where TCCP[3:0]D is the decimal value of the control bits TCCP.
12.11.1.2.2 Drain-source overvoltage blank time
A configurable blank time for the Drain-Source monitoring is applied at the turn-on of the MOSFETs. During
the blank time, a Drain-Source overvoltage error is masked.
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For Half-Bridges in PWM mode with AFWx = 1:
•
the blank time of the PWM MOSFET starts at the expiration of the cross-current protection time of the PWM
MOSFET. Refer to Figure 77.
•
the blank time of the free-wheeling MOSFET starts after expiration of the cross-current protection time at
turn-off of the PWM MOSFET. Refer to Figure 77.
PWM
t
IGS_PWM
MOSFET
Post-charge
tPCHGz
ICHGMAXz
tPDCHGz
IPRECHGz
ICHGz
t
0
- IDCHGz
tBLANK for
PWM MOSFET
- IPREDCHGz
tHBxCPP for
symmetrisation
tHBxCPP
tHBxCPP
IGS Freewheeling
MOSFET
ICHGMAXz
t
tBLANK for
freewheeling MOSFET
-
ICHGMAXz
Figure 77 Blank time for half-bridges in PWM operation with AFW = 1
For statically activated half-bridges, the blank time starts:
•
Case1: at expiration of the cross-current protection (Figure 37), if the opposite MOSFET was previously
activated.
•
Case 2: right after the decoding of the SPI command to turn on a MOSFET, if the half-bridge was in high
impedance (Figure 38).
The blank times of the active and FW MOSFETs can be configured with the control register CCP_BLK.
The typical blank is 587 ns + 266 ns x TBLK[3:0]D).
Note:
The blank time is implemented at every new activation of a MOSFET, including a recovery from VS
undervoltage, VS overvoltage, VSINT overvoltage, CP UV, CP OT.
12.11.1.3 OFF-state diagnostic
In order to support the off-state diagnostic (HBxMODE= 11 and CPEN = 1), the gate driver of each MOSFET
provides pull-up (IPUDiag) and a pull-down currents (IPDDiag) at the SHx pins. This function requires an activated
charge pump.
The pull-up current source of a given half-bridge is on when the half-bridge is active: HBxMODE= 01, 10 or 11
and CPEN = 1.
The pull-down current of each low-side gate driver is activated by the control bits HBx (HB_ICHG_MAX
register).
During the off-state diagnostic routine performed by the microcontroller, the drain-source overvoltage
threshold of the relevant half-bridges must be set to 2V nominal. Refer to Table 26. Once the routine is
finished, it is highly recommended to decrease the drain-source overvoltage threshold to a lower value,
avoiding additional current consumption from the VS input.
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DC Motor System IC
Supervision Functions
The following failures can be detected:
•
•
•
MOSFET short circuit to GND
MOSFET short circuit the battery
Open load (disconnected motor)
The status of the output voltages VOUTx, can be read back with status bit HBxVOUT (register GEN_STAT) when
the corresponding half-bridge is in off-state (HBxMODE[1:0] = 11).
Note:
HBxVOUT = 0 if the half-bridge x is not actively off (HBxMODE[1:0] = (0,0), (0,1) or (1,0) and CPEN=1)
or when the charge pump is deactivated (CPEN=0).
12.11.1.4 Charge pump undervoltage
The voltage of the charge pump output (VCP) is monitored in order to ensure a correct control of the external
MOSFETs.
The charge pump undervoltage threshold is configurable by the control bits FET_LVL and CPUVTH.
Table 29 Charge pump undervoltage thresholds
FET_LVL = 0
FET_LVL = 1
CPUVTH = 0
CPUVTH = 1
V
CPUV1 (6 V typ. referred to VS)
CPUV2 (6.5 V typ. referred to VS)
VCPUV3 (7.5 V typ. referred to VS)
VCPUV4 (8 V typ. referred to VS)
V
If VCP falls below the configured charge pump undervoltage threshold while CPEN = 1:
•
If one of the MOSFET is on, then all MOSFETs are actively turned off with their configured static discharge
current during their respective tHBxCCP active.
•
•
Then the gate drivers are turned off .
CP_UV is set and latched.
The CP_UV is reset and the normal operation is resumed once SUP_STAT is cleared and VCP > VCPUV.
The charge pump undervoltage detection is blanked (tCPUVBLANK) during each new activation of the charge
pump1).
12.11.1.5 Switching parameters of MOSFETs in PWM mode
The effective switching parameters of the active MOSFETs (EN_GEN_CHECK=1), respectively PWM MOSFET
(EN_GEN_CHECK=0)can be read out with dedicated status registers:
•
The turn-on and turn off delays, noted tDON and tDOFF are reported by the status register
EFF_TDON_OFF1, EFF_TDON_OFF2, EFF_TDON_OFF3, EFF_TDON_OFF4.
•
The rise and fall times, noted tRISE and tFALL, are reported by the status register TRISE_FALL1,
TRISE_FALL2, TRISE_FALL3, TRISE_FALL4.
Refer to Chapter 11.3 for the definition of tDON, tDOFF, tRISE and tFALL for high-side PWM and low-side PWM
operations.
1) Including CPEN set to 1, recovery from VS under/overvoltage, VSINT overvoltage and CP_ OT
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12.11.2 Low-side drain-source voltage monitoring during braking
The low-side MOSFETs are turned-on while the charge pump is deactivated in the following conditions:
•
•
•
The slam mode is activated and PWM1/CRC is High.
The parking braking mode is activated and the device is in Sleep Mode or Stop Mode.
VS overvoltage brake is activated and (VS > VS Overvoltage braking or VSINT > VSINT Overvoltage braking)
in all device modes if OV_BRK_EN is set.
Under these conditions, the drain-source voltage of the low-sides are monitored and the applied drain-source
overvoltage thresholds are according to VDSTH_BRK.
The applied blank time, which starts at the beginning of the brake activation, is:
•
•
t
t
BLK_BRAKE1 if TBLK_BRK = 0
BLK_BRAKE2 if TBLK_BRK = 1
During the blank time, a drain-source overvoltage of the low-sides is masked.
The applied filter time is tFVDS_BRAKE
.
If a drain-source overvoltage is detected during braking , then all low-side MOSFETs are turned off (latched)
within tOFF_BRAKE. SLAM_LSx_DIS (BRAKE, SLAM, PARK_BRK_EN, OV_BRK_EN are unchanged. The
corresponding status bit LSxDSOV_BRK is set in DSOV.
The low-sides can be reactivated only if all LSxDSOV_BRK bits (DSOV) are cleared (even in slam mode with the
respective LSx disabled by the SLAM_LSx_DIS bit).
If any of the status bits LSxDSOV_BRK is set, then the charge pump stays off (CPEN=1 command is accepted
but the charge pump stays disabled until all LSxDSOV_BRK are cleared).
12.11.3 VS or VSINT Overvoltage braking
The VS and VSINT overvoltage braking is activated if the OV_BRK_EN bit in BRAKE register is set regardless of
the device mode.
If VS, respectively VSINT, exceeds VOVBR,cfgx,r (x = 0 to 7), then all low-sides MOSFETs are turned-on within
tON_BRAKE. The status bits VSOVBRAKE_ST, respectively VSINTOVBRAKE_ST, is set and latched (see DSOV
register).
If VS and VSINT decrease below VOVBR,cfgx,r - VHYS,cfgx (x = 0 to 7), then all low-sides MOSFETs are turned-off within
tOFF_BRAKE after the filter time tOV_BR_FILT.
If (VSHx - VSL) exceeds the configured threshold, then all low-sides MOSFETs are turned-off within tOFF_BRAKE
after the filter time tFVDS_BRAKE. The threshold is:
•
•
V
V
VDSMONTH0_BRAKE if VDSTH_BRK = 0
VDSMONTH1_BRAKE if VDSTH_BRK = 1
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DC Motor System IC
Supervision Functions
12.12
Electrical Characteristics
Table 30 Electrical Characteristics
VSINT = 5.5 V to 28 V; Tj = -40°C to +150°C; Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin; unless otherwise specified.
Parameter
Symbol
Values
Typ.
Unit Note or
Test Condition
Number
Min.
Max.
VCC1 Monitoring; VCC1 = 5.0V Version
Undervoltage Prewarning VPW,f
Threshold Voltage PW,f
4.53
4.60
30
4.70
4.75
50
4.84
4.90
90
V
VCC1 falling,
SPI bit is set
P_13.12.1
P_13.12.2
P_13.12.3
Undervoltage Prewarning VPW,r
Threshold Voltage PW,r
V
VCC1 rising
4)
Undervoltage Prewarning VPW,hys
Threshold Voltage
mV
hysteresis
VCC1 UV Prewarning
Detection Filter Time
tVCC1,PW_F
VRT1,f
VRT1,r
VRT2,f
VRT2,r
VRT3,f
VRT3,r
VRT4,f
5
10
14
us
V
V
V
V
V
V
V
V
2) rising and falling P_13.12.4
Reset Threshold
Voltage RT1,f
4.45
4.58
3.70
3.85
3.24
3.39
2.49
2.65
4.6
4.75
4.90
4.00
4.15
3.55
3.70
2.8
default setting;
VCC1 falling
P_13.12.5
P_13.12.6
P_13.12.7
P_13.12.8
P_13.12.9
P_13.12.10
P_13.12.11
P_13.12.12
Reset Threshold
Voltage RT1,r
4.74
3.85
4.0
default setting;
VCC1 rising
Reset Threshold
Voltage RT2,f
VCC1 falling
Reset Threshold
Voltage RT2,r
VCC1 rising
Reset Threshold
Voltage RT3,f
3.40
3.54
2.65
2.76
VS ≥ 4 V;
VCC1 falling
Reset Threshold
Voltage RT3,r
VS ≥ 4 V;
VCC1 rising
Reset Threshold
Voltage RT4,f
VS ≥ 4 V;
VCC1 falling
Reset Threshold
Voltage RT4,r
VRT4,r
2.95
VS ≥ 4 V;
VCC1 rising
4)
Reset Threshold Hysteresis VRT,hys
70
140
220
5.8
mV
V
P_13.12.13
P_13.12.26
VCC1 Over Voltage
Detection Threshold
Voltage
VCC1,OV,r
VCC1,OV,f
tVCC1,OV_F
5.5
5.65
1)4) rising VCC1
VCC1 Over Voltage
Detection Threshold
Voltage
5.4
51
5.55
64
5.7
80
V
4) falling VCC1
P_13.12.27
P_13.12.31
2)
VCC1 OV Detection Filter
Time
us
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DC Motor System IC
Supervision Functions
Table 30 Electrical Characteristics (cont’d)
VSINT = 5.5 V to 28 V; Tj = -40°C to +150°C; Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin; unless otherwise specified.
Parameter
Symbol
Values
Typ.
4
Unit Note or
Test Condition
Number
Min.
Max.
VCC1 Short to GND Filter
Time
tVCC1,SC
3.2
4.8
ms
2) blanking time
during power-up,
short circuit
P_13.12.32
detection for
VS ≥ VS,UV
Reset Generator; Pin RSTN
Reset Low Output Voltage VRSTN,L
–
0.2
–
0.4
V
V
IRSTN = 1 mA for
VCC1 ≥ 1 V &
VS ≥ VPOR,f
P_13.12.33
P_13.12.34
Reset High Output Voltage VRSTN,H
0.8 x
VCC1
+
IRSTN = -20 µA
VCC1
0.3 V
Reset Pull-up Resistor
Reset Filter Time
RRSTN
tRF
10
4
20
10
40
26
kΩ
VRSTN = 0 V
P_13.12.35
P_13.12.36
2)
µs
V
< VRT1x
CC1
to RSTN = L see
also Chapter 12.3
Reset Delay Time 1
Reset Delay Time 2
VCAN Monitoring
tRD1
tRD2
8
10
2
12
ms
ms
2) RSTN_DEL = 0
2) RSTN_DEL = 1
P_13.12.37
P_13.12.64
1.6
2.4
CAN Supply undervoltage VCAN_UV,f
detection threshold
(falling)
4.5
4.6
–
4.75
V
VCAN falling
P_13.12.38
CAN Supply undervoltage VCAN_UV,r
detection threshold (rising)
–
4.85
130
14
V
VCAN rising
P_13.12.39
P_13.12.40
4)
VCAN Undervoltage
VCAN,UV, hys 50
90
10
mV
µs
detection hysteresis
VCAN UV detection Filter
Time
tVCAN,UV_F
5
2) VCAN rising and P_13.12.41
falling
Watchdog Generator / Internal Oscillator
2)
Long Open Window
tLW
160
0.8
200
1.0
240
1.2
ms
P_13.12.42
Internal Clock Generator
Frequency
fCLKSBC,1
MHz
–
P_13.12.43
Minimum Waiting time during Fail-Safe Mode
Min. waiting time Fail-Safe tFS,min 80
2)3)
100
120
ms
P_13.12.45
Power-on Reset, Over / Undervoltage Protection
VSINT Power on reset rising VPOR,r
–
–
–
–
4.5
3
V
V
VSINT increasing P_13.12.46
VSINT decreasing P_13.12.47
VSINT Power on reset
falling
VPOR,f
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DC Motor System IC
Supervision Functions
Table 30 Electrical Characteristics (cont’d)
VSINT = 5.5 V to 28 V; Tj = -40°C to +150°C; Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin; unless otherwise specified.
Parameter
Symbol
Values
Typ.
–
Unit Note or
Test Condition
Number
Min.
Max.
VSINT Undervoltage
Detection Threshold
VSINT,UV
5.3
6.0
V
Supply UV
P_13.12.48
threshold for VCC1
SC detection;
hysteresis
included; includes
rising and falling
threshold
VSHS Overvoltage
Detection Threshold
VSHS,OVD
20
–
22
V
Supply OV
supervision for
HSx;
P_13.12.55
hysteresis
included
4)
VSHS Overvoltage
Detection hysteresis
VSHS,OVD,hys 100
VSHS,UVD 4.8
500
–
–
mV
V
P_13.12.56
P_13.12.57
VSHS Undervoltage
Detection Threshold
5.5
Supply UV
supervision for
HSx;
hysteresis
included
4)
VSHS Undervoltage
Detection hysteresis
VSHS,UVD,hys 50
200
10
350
14
mV
us
P_13.12.58
VSHS Undervoltage
Detection Filter Time
tVSHS,UV
tVSHS,OV
5
5
2) rising and falling P_13.12.300
2) rising and falling P_13.12.301
VSHS Overvoltage
10
14
us
Detection Filter Time
Charge Pump Undervoltage
Charge Pump
Undervoltage Referred to
VS
VCPUV1
5.4
5.9
6.4
V
V
V
FET_LVL = 0
CPUVTH = 0
falling threshold,
VS ≥6 V
P_13.12.59
P_13.12.60
P_13.12.61
Charge Pump
Undervoltage Referred to
VS
VCPUV2
5.85
6.85
6.35
7.35
6.85
7.85
FET_LVL = 0
CPUVTH = 1
falling threshold,
VS ≥ 6 V
Charge Pump
Undervoltage Referred to
VS
VCPUV3
FET_LVL = 1
CPUVTH = 0
falling threshold,
VS ≥ 6 V
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DC Motor System IC
Supervision Functions
Table 30 Electrical Characteristics (cont’d)
VSINT = 5.5 V to 28 V; Tj = -40°C to +150°C; Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin; unless otherwise specified.
Parameter
Symbol
Values
Typ.
8
Unit Note or
Test Condition
Number
Min.
Max.
Charge Pump
Undervoltage Referred to
VS
VCPUV4
7.5
8.5
V
FET_LVL = 1
CPUVTH = 1
falling threshold,
VS ≥ 6 V
P_13.12.62
Charge Pump
Undervoltage Filter Time
tCPUV
51
64
80
µs
µs
4)VS ≥ 6 V
P_13.12.63
Charge Pump
tCPUVBLANK
400
500
600
4)VS ≥ 6 V
P_13.12.175
Undervoltage Blank Time
VS monitoring
VS undervoltage threshold VS,UV
4.7
19
–
–
5.4
V
V
hysteresis
included
P_13.12.66
P_13.12.68
VS overvoltage threshold VS,OVD1
22.5
hysteresis
detection 1
included,
VS_OV_SEL = 0
VS overvoltage threshold VS,OVD2
27.75
–
31.25
V
hysteresis
P_13.12.65
detection 2
included,
VS_OV_SEL = 1
VS undervoltage filter time tVSUV_FILT
VS overvoltage filter time tVSOV_FILT
Off-state open load diagnosis
5
5
10
10
14
14
µs
µs
2) rising and falling P_13.12.71
2) rising and falling P_13.12.72
Pull-up diagnosis current IPUDiag
-600
-400
-270
µA
µA
VS ≥ 6 V
VS ≥ 6 V
P_13.12.73
P_13.12.74
Pull-down diagnosis
current
IPDDiag
1600
2200
2800
Diagnosis current ratio
IDiag_ratio
4.25
5.25
6.25
Ratio
P_13.12.302
IPDDiag / IPUDiag
Drain-source monitoring CP activated
Blank time
tBLANK
typ-
20%
587
+266
xTBLK
typ+20 ns
%
4) TBLK: decimal
valueofTBLK[3:0],
VS ≥ 6 V
P_13.12.75
P_13.12.76
Cross-current protection
time
tCCP
typ-
20%
587
+266
xTCCP
typ+20 ns
%
4) TCCP: decimal
value of
TCCPx[3:0],
VS ≥ 6 V
HS/LS Drain-source
overvoltage 0
VVDSMONTH0_ 0.115 0.16
0.195
0.25
0.36
V
V
V
VDSTH[2:0] = 000B, P_13.12.77
VS≥6 V, TFVDS=00B
CPON
HS/LS Drain-source
overvoltage 1
VVDSMONTH1_ 0.16
0.2
0.3
VDSTH[2:0] = 001B, P_13.12.78
VS≥6 V, TFVDS=00B
CPON
HS/LS Drain-source
overvoltage 2
VVDSMONTH2_ 0.24
VDSTH[2:0] = 010B, P_13.12.79
VS≥6 V, TFVDS=00B
CPON
Datasheet
145
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
Supervision Functions
Table 30 Electrical Characteristics (cont’d)
VSINT = 5.5 V to 28 V; Tj = -40°C to +150°C; Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin; unless otherwise specified.
Parameter
Symbol
Values
Typ.
0.4
Unit Note or
Test Condition
Number
Min.
Max.
HS/LS Drain-source
overvoltage 3
VVDSMONTH3_ 0.32
0.48
V
V
V
V
V
VDSTH[2:0] = 011B, P_13.12.80
VS≥6 V, TFVDS=00B
CPON
HS/LS Drain-source
overvoltage 4
VVDSMONTH4_ 0.4
0.5
0.6
0.8
2.0
0.6
VDSTH[2:0] = 100B, P_13.12.81
VS≥6 V, TFVDS=00B
CPON
HS/LS Drain-source
overvoltage 5
VVDSMONTH5_ 0.48
0.72
0.96
2.25
VDSTH[2:0] = 101B, P_13.12.82
VS≥6 V, TFVDS=00B
CPON
HS/LS Drain-source
overvoltage 6
VVDSMONTH6_ 0.64
VDSTH[2:0] = 110B, P_13.12.83
VS≥6 V, TFVDS=00B
CPON
HS/LS Drain-source
overvoltage 7
VVDSMONTH7_ 1.75
VDSTH[2:0] = 111B, P_13.12.84
VS≥6 V, TFVDS=00B
CPON
Drain-Source monitoring - Slam mode, parking braking and VS overvoltage braking, VS or VSINT ≥ 8V
Blank time
tBLK_BRAKE1 4.5
7
9.5
µs
TBLK_BRK = 0,
P_13.12.85
VS or VSINT ≥ 8 V
Blank time
tBLK_BRAKE2
9
11
13
µs
TBLK_BRK = 1,
P_13.12.86
VS or VSINT ≥ 8 V
VDS Filter time
tFVDS_BRAKE 0.5
VVDSMONTH0_ 0.56
1
2.5
µs
V
VS or VSINT ≥ 8 V P_13.12.87
LS Drain-source
monitoring thresholds
0.8
1.05
VS or VSINT ≥ 8 V P_13.12.89
VDSTH_BRK = 0
BRAKE
LS Drain-source
monitoring thresholds
VVDSMONTH1_ 0.15
0.22
0.29
V
VS or VSINT ≥ 8 V P_13.12.90
VDSTH_BRK = 1
BRAKE
VS Overvoltage Braking Mode
VS Overvoltage braking
config 0 rising
VOVBR,cfg0,r
25.65 27
28.35
29.40
30.45
31.50
32.55
33.60
34.65
35.70
0.85
V
V
V
V
V
V
V
V
V
OV_BRK_TH=000B P_13.12.97
OV_BRK_TH=001B P_13.12.98
OV_BRK_TH=010B P_13.12.99
OV_BRK_TH=011B P_13.12.100
OV_BRK_TH=100B P_13.12.101
OV_BRK_TH=101B P_13.12.102
OV_BRK_TH=110B P_13.12.103
OV_BRK_TH=111B P_13.12.104
OV_BRK_TH=000B P_13.12.105
VS Overvoltage braking
config 1 rising
VOVBR,cfg1,r
VOVBR,cfg2,r
VOVBR,cfg3,r
VOVBR,cfg4,r
VOVBR,cfg5,r
VOVBR,cfg6,r
VOVBR,cfg7,r
VHYS,cfg0
26.60 28
27.55 29
28.50 30
29.45 31
30.40 32
31.35 33
32.30 34
VS Overvoltage braking
config 2 rising
VS Overvoltage braking
config 3 rising
VS Overvoltage braking
config 4 rising
VS Overvoltage braking
config 5 rising
VS Overvoltage braking
config 6 rising
VS Overvoltage braking
config 7 rising
VS Overvoltage braking
config 0
0.64
0.75
Datasheet
146
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
Supervision Functions
Table 30 Electrical Characteristics (cont’d)
VSINT = 5.5 V to 28 V; Tj = -40°C to +150°C; Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin; unless otherwise specified.
Parameter
Symbol
Values
Typ.
Unit Note or
Test Condition
Number
Min.
Max.
VS Overvoltage braking
config 1
VHYS,cfg1
VHYS,cfg2
VHYS,cfg3
VHYS,cfg4
VHYS,cfg5
VHYS,cfg6
VHYS,cfg7
0.74
0.82
0.9
V
OV_BRK_TH=001B P_13.12.109
OV_BRK_TH=010B P_13.12.113
OV_BRK_TH=011B P_13.12.117
OV_BRK_TH=100B P_13.12.121
OV_BRK_TH=101B P_13.12.125
OV_BRK_TH=110B P_13.12.129
OV_BRK_TH=111B P_13.12.133
VS Overvoltage braking
config 2
0.80
0.85
0.93
0.97
1.03
1.1
0.89
0.95
1.03
1.08
1.15
1.23
15
0.98
1.05
1.13
1.19
1.27
1.36
20
V
VS Overvoltage braking
config 3
V
VS Overvoltage braking
config 4
V
VS Overvoltage braking
config 5
V
VS Overvoltage braking
config 6
V
VS Overvoltage braking
config 7
V
4)
VS and VSINT overvoltage tOV_BR_FILT
10
µs
P_13.12.200
braking filter time
Overtemperature Shutdown4)
Thermal Prewarning
Temperature
TjPW
125
145
165
°C
Tj rising
Tj rising
P_13.12.169
Thermal Shutdown TSD1 TjTSD1
Thermal Shutdown TSD2 TjTSD2
170
170
–
185
185
25
200
200
–
°C
°C
°C
P_13.12.170
P_13.12.171
P_13.12.172
Tj rising
4)
Thermal Shutdown
hysteresis
TjTSD,hys
TSD/TPW Filter Time
tTSD_TPW_F
5
10
15
us
rising and falling, P_13.12.173
applies to all
thermal sensors
(TPW, TSD1, TSD2)
2)
Deactivation time after
thermal shutdown TSD2
tTSD2
0.8
1
1.2
s
P_13.12.174
1) It is ensured that the threshold VCC1,OV,r is always higher than the highest regulated VCC1 output voltage VCC1,out4
.
.
2) Not subject to production test, tolerance defined by internal oscillator tolerance.
3) This time applies for all failure entries except a device thermal shutdown (TSD2 has a typ. 1 s waiting time tTSD2).
4) Not subject to production test, specified by design.
Datasheet
147
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
13
Serial Peripheral Interface
The Serial Peripheral Interface is the communication link between the device and the microcontroller.
The TLE9561QX is supporting multi-slave operation in full-duplex mode with 32-bit data access.
The SPI behavior for the different device modes is as follows:
•
•
The SPI is enabled in Init Mode, Normal Mode and Stop Mode.
The SPI is OFF in Sleep Mode, Restart Mode and Fail-Safe Mode.
13.1
SPI Block Description
The Control Input Word is read via the data input SDI, which is synchronized with the clock input CLK provided
by the microcontroller. The output word appears synchronously at the data output SDO (see Figure 78 with a
32-bit data access example).
The transmission cycle begins when the chip is selected by the input CSN (Chip Select Not), LOW active. After
the CSN input returns from LOW to HIGH, the word that has been read is interpreted according to the content.
The SDO output switches to tristate status (high impedance) at this point, thereby releasing the SDO bus for
other use.The state of SDI is shifted into the input register with every falling edge on CLK. The state of SDO is
shifted out of the output register after every rising edge on CLK. The SPI of the device is not daisy chain
capable.
CSN high to low: SDO is enabled. Status information transferred to output shift register
CSN
time
CSN low to high: data from shift register is transferred to output functions
CLK
time
Actual data
New data
LSB
MSB
0 1
SDI
0 1 2 3 4 5 6
27 28 29 30 31
+ +
time
SDI: will accept data on the falling edge of CLK signal
Actual status
New status
LSB
MSB
0
1
ERR
SDO
ERR
0 1 2 3 4 5 6
27 28 29 30 31
-
+
+
time
SDO: will change state on the rising edge of CLK signal
Figure 78 SPI Data Transfer Timing (note the reversed order of LSB and MSB shown in this figure
compared to the register description)
Datasheet
148
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
13.2
Failure Signalization in the SPI Data Output
When the microcontroller sends a wrong SPI command to the device, the device ignores the information.
Wrong SPI commands are either invalid device mode commands or commands which are prohibited by the
state machine to avoid undesired device or system states (see below). In this case the diagnosis bit SPI_FAIL
is set and the SPI Write command is ignored (no partial interpretation). This bit can be only reset by actively
clearing it via a SPI command.
Invalid SPI Commands leading to SPI_FAIL are listed below (in this case the SPI command is ignored):
•
Illegal state transitions:
- Going from Stop Mode to Sleep Mode. In this case the device enters Restart Mode.
- Trying to go to Stop Mode or Sleep Mode from Init Mode1). In this case Normal Mode is entered.
•
•
Uneven parity in the data bit of the WD_CTRL register. In this case the watchdog trigger is ignored and/or
the new watchdog settings are ignored respectively.
In Stop Mode: attempting to change any SPI settings, e.g. changing the watchdog configuration, PWM
settings and HSx configuration settings during Stop Mode, etc.;
the SPI command is ignored in this case;
only WD trigger, returning to Normal Mode, triggering a device soft reset, and read & clear status registers
commands are valid SPI commands in Stop Mode; Note: No failure handling is done for the attempt to go
to Stop Mode when all bits in the registers BUS_CTRL and WK_CTRL are cleared because the
microcontroller can leave this mode via SPI.
•
•
•
When entering Stop Mode and WK_STAT is not cleared; SPI_FAIL will not be set but the INTN pin will be
triggered.
Changing from Stop Mode to Normal Mode and changing the other bits of the M_S_CTRL register. The
other modifications will be ignored.
Sleep Mode: attempt to go to Sleep Mode without any wake source set, i.e. when all bits in the BUS_CTRL
and WK_CTRL registers are cleared. In this case the SPI_FAIL bit is set and the device enters Restart Mode.
Even though the Sleep Mode command is not entered in this case, the rest of the command is executed but
restart values apply during Restart Mode; Note: At least one wake source must be activated in order to
avoid a deadlock situation in Sleep Mode.
If the only wake source is a timer and the timer is OFF, then the device will wake immediately from Sleep
Mode and enter Restart Mode.
•
•
•
•
Setting a longer or equal on-time than the timer period of the respective timer.
SDI stuck at HIGH or LOW, e.g. SDI received all ‘0’ or all ‘1’.
Any attempt to configure again the WK2_FO.
Configured the HSx controlled by SYNC when the WK4/SYNC is not configured as SYNC-input.
Note:
Note:
There is no SPI fail information for unused addresses.
In case that the register or banking are accessed but they are not valid as address or banks, the
SPI_FAIL is not triggered and the cmd is ignored.
1) If the device is externally configured to use SPI with CRC (by PWM1/CRC pin), the attempt to go to Stop or Sleep from Init , will
generate SPI_FAIL even if it is a SPI command with correct CRC. Still, the first SPI command will put the device from Init to Normal
Mode even if CRC is not correct (CRC_FAIL status bit will be set).
Datasheet
149
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Signalization of the ERR Flag (high active) in the SPI Data Output (see Figure 78):
The ERR flag presents an additional diagnosis possibility for the SPI communication. The ERR flag is being set
for following conditions:
•
•
in case the number of received SPI clocks is not 0 or 32.
in case RSTN is LOW and SPI frames are being sent at the same time.
Note:
In order to read the SPI ERR flag properly, CLK must be low when CSN is triggered, i.e. the ERR bit is
not valid if the CLK is high on a falling edge of CSN.
The number of received SPI clocks is not 0 or 32:
The number of received input clocks is supervised to be 0 or 32 clock cycles and the input word is discarded in
case of a mismatch (0 clock cycle to enable ERR signalization). The error logic also recognizes if CLK was high
during CSN edges. Both errors ( 0 or 32 bit CLK mismatch or CLK high during CSN edges ) are flagged in the
following SPI output by a “HIGH” at the data output (SDO pin, bit ERR) before the first rising edge of the clock
is received. The complete SPI command is ignored in this case.
RSTN is LOW and SPI frames are being sent at the same time:
The ERR flag will be set when the RSTN pin is triggered (during device restart) and SPI frames are being sent to
the device at the same time. The behavior of the ERR flag will be signalized at the next SPI command for below
conditions:
•
•
•
If the command begins when RSTN is HIGH and it ends when RSTN is LOW.
If a SPI command will be sent while RSTN is LOW.
If a SPI command begins when RSTN is LOW and it ends when RSTN is HIGH.
And the SDO output will behave as follows:
•
•
Always when RSTN is LOW then SDO will be HIGH.
When a SPI command begins when RSTN is LOW and ends when RSTN is HIGH, then the SDO should be
ignored because wrong data will be sent.
Note:
Note:
It is possible to quickly check for the ERR flag without sending any data bits. i.e. only the CSN is pulled
low and SDO is observed - no SPI Clocks are sent in this case.
The ERR flag could also be set after the device has entered Fail-Safe Mode because the SPI
communication is stopped immediately.
Datasheet
150
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
13.3
SPI Programming
For the TLE9561QX, 7 bits are used for the address selection (BIT 6...0). Bit 7 is used to decide between Read
Only and Read & Clear for the status bits, and between Write and Read Only for configuration bits. For the
actual configuration and status information, 16 data bits (BIT 23...8) are used.
Writing, clearing and reading is done word wise. The SPI status bits are not cleared automatically and must be
cleared by the microcontroller. Some of the configuration bits will automatically be cleared by the device
(refer to the respective register descriptions for detailed information). In Restart Mode, the device ignores all
SPI communication, i.e. it does not interpret it.
There are two types of SPI registers:
•
•
Control registers: These registers are used to configure the device, e.g. mode, watchdog trigger, etc.
Status registers: These registers indicate the status of the device, e.g. wake events, warnings, failures, etc.
For the status registers, the requested information is given in the same SPI command in the data out (SDO).
For the control registers, the status of each byte is shown in the same SPI command as well. However,
configuration changes of the same register are only shown in the next SPI command (configuration changes
inside the device become valid only after CSN changes from low to high). See Figure 79.
Writing of control registers is possible in Init and Normal Mode. During Stop Mode only the change to Normal
Mode and triggering the watchdog is allowed as well as reading and clearing the status registers.
No status information can be lost, even if a bit changes right after the first 7 SPI clock cycles before the SPI
frame ends. In this case the status information field will be updated with the next SPI command. However, the
flag is already set in the relevant status register.The device status information from the SPI status registers is
transmitted in a compressed format with each SPI response on SDO in the so-called Status Information Field
register (see also Table 31). The purpose of this register is to quickly signal changes in dedicated SPI status
registers to the microcontroller.
Table 31 Status Information Field
Bit in Status
Information Field
Corresponding
Address Bit
Status Register Description
0
1
2
3
4
SUPPLY_STAT = OR of all bits on SUP_STAT register
TEMP_STAT = OR of all bits on THERM_STAT register
BUS_STAT= OR of all bits on BUS_STAT register
WAKE_UP = OR of all bits on WK_STAT register
HS_STAT = OR of all bits on HS_OL_OC_OT_STAT
register
5
DEV_STAT = OR of all bits on DEV_STAT except
CRC_STAT and SW_DEV
6
7
BD_STAT = OR of all bits on DSOV register
SPI_CRC_FAIL = (SPI_FAIL) OR (CRC_FAIL)
Datasheet
151
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
MSB
LSB
DI
0
1
2
3
4
5
6
7
8
x
9
x
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31
R/W
Address Bits
Data Bits
CRC or Static Pattern
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
Register content of
selected address
DO
0
1
2
3
4
5
6
7
8
x
9
x
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31
Status Information Field
Data Bits
CRC or Static Pattern
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
time
LSB is sent first in SPI message
Figure 79 SPI Operation Mode
13.3.1
CRC
The SPI interface includes also 8 Bits (bits 24 to 31) used for Cyclic Redundancy Check (CRC) to ensure data
integrity on sent or received SPI command.
The implemented CRC is based on Autosar specification of CRC Routines revision 4.3.0 and in particular the
function CRC8-2FH.
The specification are based on the follow table:
Table 32 CRC8x2FH definition
CRC result width:
Polynomial
8 bits
2FH
FFH
No
Initial Value
Input data reflected
Result data reflected
XOR value
No
FFH
DFH
42H
Check
Magic check
Some examples of CRC calculation are shown in the follow table:
Table 33 CRC8x2FH calculation example
Data Bytes (hexadecimal)
CRC
12
00
F2
0F
00
33
92
FF
00
01
AA
FF
22
6B
FF
00
83
00
55
55
55
FF
00
C2
C6
77
55
11
AA
BB
CC
DD
EE
FF
11
33
FF
6C
Datasheet
152
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Polynominal
The polynomial is:
x8 + x5 + x3 + x2 + x1 + x0
(13.1)
Calculation in SDI and SDO
The calculation of the CRC is done considering the first 24 bits (BIT 0..23) either of SDI or SDO.
The content of SDO Payload (BIT 8..23) is referring the previous data written at the addressed register via SDI.
SDI
r
Add.
Payload - Configuration
CRC
CRC
w
PASS/FAIL
∑
SDO
Status Info. Field
From previous SPI cmd
∑
Figure 80 CRC calculation
CRC Activation and status information
For CRC activation, refer to Chapter 5.2.
The CRC status (CRC_STAT)and failure (CRC_FAIL) are readable on DEV_STAT.
Read out of the register which contains the CRC_STAT and CRC_FAIL is done ignoring the CRC field and no
failure flag are set.
The DEV_STAT register shall be cleared considering the CRC setting (ON or OFF).
The CRC_STAT bit is read only.
The CRC_FAIL is set in the follow conditions:
•
•
If the CRC is enabled and the µC sends wrong CRC field.
If the CRC is disabled and the µC sends wrong static pattern (no A5H).
CRC field in case of CRC disabled
In case that the CRC is not activated, the bits needed for CRC field have to be filled with static pattern.
In case of SDI, the CRC field has to be filled with A5H (bits 24:31).
In case of SDO, the device will always answer with 5AH (bits 24:31).
The status of the CRC is updated accordingly in CRC_STAT bit.
Datasheet
153
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
13.4
SPI Bit Mapping
The following figures show the mapping of the registers and the SPI bits of the respective registers.
The Control Registers are Read/Write Register with the following structure:
•
•
•
Device Control Registers from 000 0001B to 000 1011B.
Bridge Driver Control Registers from 001 0000B to 001 1101B.
SWK Control Registers from 011 0000B to 011 1111B.
Depending on bit 7 the bits are only read (setting bit 7 to ‘0’) or also written (setting bit 7 to ‘1’). The new setting
of the bit after a write can be seen with a new read / write command.
The Status Registers are Read/Clear with the following structure:
•
•
•
Device Status Registers from 100 0000B to 100 0110B.
Bridge Driver Status Registers from 101 0000B to 101 1011B.
Product Family is 111 0000B.
The registers can be read or can be cleared (if clearing is possible) depending on bit 7. To clear the payload of
one of the Status Registers bit 7 must be set to 1.
The registers WK_LVL_STAT, and FAM_PROD_STAT are an exception as they show the actual voltage level at
the respective WKx pin (LOW/HIGH), or a fixed family/ product ID respectively and can thus not be cleared.
It is recommended for proper diagnosis to clear respective status bits for wake events or failure.
When changing to a different device mode, certain configurations bits will be cleared automatically or
modified:
•
•
The device mode bits are updated to the actual status, e.g. when returning to Normal Mode.
When changing to a low-power mode (Stop Mode or Sleep Mode), the diagnosis bits of the integrated
module are not cleared.
•
•
When changing to Stop Mode, the CAN, control bits will not be modified.
When changing to Sleep Mode, the CAN, control bits will be modified if they were not OFF or wake capable
before.
•
FO will stay activated if it was triggered before. Depending on the respective configuration, CAN,
transceivers will be either OFF, woken or still wake capable.
Note:
The detailed behavior of the respective SPI bits and control functions is described in Chapter 13.5,
Chapter 13.6.and in the respective module chapter. The bit type be marked as ‘rwh’ in case the
device will modify respective control bits.
Datasheet
154
Rev. 1.0
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TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Reg.
Type
7 Address Bits [bits 6...0]
16 Data Bits [bits 23...8]
for Register Selection
for Configuration & Status Information
Addresses:
0 0 0 0 0 0 1
.
.
.
0 0 0 1 0 1 1
Addresses:
0 0 1 0 0 0 0
.
.
.
0 0 1 1 1 0 1
Addresses:
1 0 0 0 0 0 0
.
.
.
1 1 1 0 0 0 0
The most important status registers are represented in the
Status Information Field
Figure 81 SPI Register Mapping Structure
The detailed register mappings for control registers and status registers are shown in Table 34 and Table 59
respectively.
13.4.1
Register Banking
In order to minimize the number of configuration registers, seven registers follow a bank structure.
The banked registers are:
•
•
•
•
•
•
•
•
WK_CTRL
PWM_CTRL
CCP_BLK
TPRECHG
HB_ICHG
HB_PCHG_INIT
TDON_HB_CTRL
TDOFF_HB_CTRL
In these register, the first 3 bits of the payload (bit 8 to 10) select the bank that has to be configured. The rest
of the payload is used to configure the selected bank (for more details refer to the specific banked register).
In case that CRC is used, the CRC calculation is done considering the first 24 bits (from bit 0 to 23).
The banked registers can be read like the other configuration registers but in the SDO one ‘0’ is automatically
added after the status information field. Figure 82 shows the structure of SDO in banked register.
Datasheet
155
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
SDI
B
K
0
B
K
1
B
K
2
R
e
s
Configuration of selected Bank
Selected Bank Content
r
w
Add.
CRC
CRC
SDO
B
K
0
B
K
1
B
K
2
Status Info. Filed
0
Figure 82 Register read Out of banked register (3 bit banking)
Datasheet
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Rev. 1.0
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TLE9561QX
DC Motor System IC
Serial Peripheral Interface
13.5
SPI control registers
READ/WRITE Operation (see also Chapter 13.3):
•
•
•
The ‘POR / Soft Reset Value’ defines the register content after POR or device reset.
The ‘Restart Value’ defines the register content after device restart, where ‘x’ means the bit is unchanged.
There are different bit types:
–
–
–
‘r’ = READ: read only bits (or reserved bits).
‘rw’ = READ/WRITE: readable and writable bits.
‘rwh’ = READ/WRITE/Hardware: readable/writable bits, which can also be modified by the device
hardware.
•
Reserved bits are marked as “Reserved” and always read as “0”. The respective bits shall also be
programmed as “0”.
•
•
Reading a register is done word wise by setting the SPI bit 7 to “0” (= Read Only).
SPI control bits are in general not cleared or changed automatically. This must be done by the
microcontroller via SPI programming. Exceptions to this behavior are stated at the respective register
description and the respective bit type is marked with a ‘h’ meaning that the device is able to change the
register content.
The registers are addressed wordwise.
Table 34 Register Overview
Register Short Name
Register Long Name
Offset Address Page
Number
SPI control registers, Device Control Registers
M_S_CTRL
HW_CTRL
Mode and Supply Control
0000001B
0000010B
0000011B
0000100B
0000101B
0000110B
0000111B
0001000B
0001001B
0001010B
0001011B
159
Hardware Control
161
163
165
166
168
170
173
175
177
178
WD_CTRL
Watchdog Control
BUS_CTRL
WK_CTRL
CAN Control
Wake-up Control
TIMER_CTRL
SW_SD_CTRL
HS_CTRL
Timer 1 and Timer 2 Control and Selection
High-Side Switch Shutdown Control
High-Side Switch Control
Interrupt Mask Control
PWM Configuration Control
System Status Control
INT_MASK
PWM_CTRL
SYS_STAT_CTRL
SPI control registers, Control registers bridge driver
GENCTRL
LS_VDS
General Bridge Control
0010000B
0010010B
0010011B
0010100B
0010101B
0010110B
0010111B
179
181
183
185
186
188
190
Drain-Source monitoring threshold
Drain-Source monitoring threshold
CCP and times selection
HS_VDS
CCP_BLK
HBMODE
TPRECHG
ST_ICHG
Half-Bridge MODE
PWM pre-charge and pre-discharge time
Static charge/discharge current
Datasheet
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Rev. 1.0
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DC Motor System IC
Serial Peripheral Interface
Table 34 Register Overview (cont’d)
Register Short Name
Register Long Name
Offset Address Page
Number
191
HB_ICHG
PWM charge/discharge current
0011000B
0011001B
HB_ICHG_MAX
PWM max. pre-charge/pre-discharge current
and diagnostic pull-down
192
HB_PCHG_INIT
TDON_HB_CTRL
TDOFF_HB_CTRL
BRAKE
PWM pre-charge/pre-discharge initialization
PWM inputs TON configuration
PWM inputs TOFF configuration
Brake control
0011010B
0011011B
0011100B
0011101B
194
195
196
197
Datasheet
158
Rev. 1.0
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TLE9561QX
DC Motor System IC
Serial Peripheral Interface
13.5.1
Device Control Registers
Mode and Supply Control
M_S_CTRL
Mode and Supply Control
(000 0001B)
Reset Value: see Table 35
15
MODE
rwh
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
VCC1_OV_MO
D
RSTN_
HYS
I_PEA
K_TH
RES
RES
RES
RES
VCC1_RT
r
rwh
r
rw
r
rw
r
rw
Field
Bits
15:14
Type
Description
Device Mode Control
MODE
rwh
00B NORMAL, Normal Mode
01B SLEEP, Sleep Mode
10B STOP, Stop Mode
11B RESET, Device reset: Soft reset is executed
(configuration of RSTN triggering in bit
SOFT_RESET_RO)
RES
13:11
10:9
r
Reserved, always reads as 0
VCC1_OV_MOD
rwh
Reaction in case of VCC1 Over Voltage
00B NO, no reaction
01B INTN, INTN event is generated
10B RSTN, RSTN event is generated
11B FAILSAFE, Fail-Safe Mode is entered
RES
8
7
r
Reserved, always reads as 0
RSTN_HYS
rw
VCC1 Undervoltage Reset Hysteresis Selection (see
also Chapter 12.7.1 for more information)
0B DEFAULT, default hysteresis applies as specified
in the electrical characteristics table
1B HIGHEST, the highest rising threshold (VRT1,R) is
always used for the release of the undervoltage
reset
RES
6
5
r
Reserved, always reads as 0
I_PEAK_TH
rw
VCC1 Active Peak Threshold Selection
0B LOW, low VCC1 active peak threshold selected
1B HIGH, high VCC1 active peak threshold selected
RES
4:2
1:0
r
Reserved, always reads as 0
VCC1_RT
rw
VCC1 Reset Threshold Control
00B VRT1, Vrt1 selected (highest threshold)
01B VRT2, Vrt2 selected
10B VRT3, Vrt3 selected
11B VRT4, Vrt4 selected
Datasheet
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Rev. 1.0
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TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Table 35 Reset of M_S_CTRL
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0000 0000 0000B
0000 0000 x0x0 00xxB
Notes
1. It is not possible to change from Stop Mode to Sleep Mode via SPI Command. See also the State Machine
Chapter.
2. After entering Restart Mode, the MODE bits will be automatically set to Normal Mode.
3. The SPI output will always show the previously written state with a Write Command (what has been
programmed before) .
Datasheet
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Rev. 1.0
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TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Hardware Control
HW_CTRL
Hardware Control
(000 0010B)
Reset Value: see Table 36
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
SOFT_
RESET
_RO
WD_S
TM_E
N_1
TSD2_ VS_OV SH_DI RSTN_
DEL _SEL SABLE DEL
FO_O
N
RES
RES
RES
RES
r
rw
rw
rw
rw
r
rw
rwh
r
rwh
r
Field
RES
Bits
Type
Description
Reserved, always reads as 0
TSD2 minimum Waiting Time Selection
15:13
12
r
TSD2_DEL
rw
0B 1s, Minimum waiting time until TSD2 is released
again is always 1 s
1B 64s, Minimum waiting time until TSD2 is released
again is 1 s, after >16 TSD2 consecutive events, it
will extended x 64
VS_OV_SEL
SH_DISABLE
RSTN_DEL
RES
11
10
9
rw
rw
rw
VS OV comparator threshold change
0B 20V, Default threshold setting (VS,OVD1
1B 30V, increased threshold setting (VS,OVD2
)
)
Sample and hold circuitry disable
0B ENABLED, Gate driver S&H circuitry enabled
1B DISABLED, Gate driver S&H circuitry disabled
Reset delay time
0B 10ms, Reset delay time 10 ms (tRD1
1B 2ms, Reset delay time to 2 ms (tRD2
Reserved, always reads as 0
Soft Reset Configuration
)
)
8:7
6
r
SOFT_RESET_RO
rw
0B RSTN, RSTN will be triggered (pulled low) during
a Soft Reset
1B NO_RSTN, no RSTN trigger during a Soft Reset
FO_ON
5
rwh
Failure Output Activation
0B DISABLED, FO not activated by software, FO will
be activated by specified failures
1B ENABLED, FO activated by software (via SPI),
only if WK2/FO pin is configured as Fail Safe
Output
RES
4:3
2
r
Reserved, always reads as 0
WD_STM_EN_1
rwh
Watchdog Deactivation during Stop Mode, bit1
0B ACTIVE, Watchdog is active in Stop Mode
1B INACTIVE, Watchdog is deactivated in Stop Mode
RES
1:0
r
Reserved, always reads as 0
Datasheet
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Rev. 1.0
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TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Table 36 Reset of HW_CTRL
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR
0000 0000 0000 0000B
Soft reset
Restart
0000 00x0 0000 0000B
000x 00x0 0x00 0000B
Notes
1. Clearing the FO_ON bit will not disable the FO outputs in case a failure occurred which triggered the FO
outputs. In this case the FO outputs have to be disabled by clearing the FAILURE bit.
If the FO_ON bit is set by the software then it will be cleared by the device after Restart Mode was entered and
the FO outputs will be disabled (if no failures occurred which triggered the fail outputs) .
2. WD_STM_EN_1 will also be cleared when changing from Stop Mode to Normal Mode .
Datasheet
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Rev. 1.0
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TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Watchdog Control
WD_CTRL
Watchdog Control
(000 0011B)
Reset Value: see Table 37
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
WD_S
TM_E
N_0
WD_E
N_WK RES
_BUS
CHEC
KSUM
WD_C
FG
RES
WD_TIMER
rw
r
rwh
rw
rwh
r
rwh
Field
Bits
Type
Description
Watchdog Setting Check Sum Bit
CHECKSUM
15
rw
0B 0, Counts as 0 for checksum calculation
1B 1, Counts as 1 for checksum calculation
RES
14:7
6
r
Reserved, always reads as 0
WD_STM_EN_0
rwh
Watchdog Deactivation during Stop Mode, bit0
0B ACTIVE, Watchdog is active in Stop Mode
1B INACTIVE, Watchdog is deactivated in Stop Mode
WD_CFG
5
4
rw
Watchdog Configuration
0B TIMEOUT, Watchdog works as a Time-Out
watchdog
1B WINDOW, Watchdog works as a Window
watchdog
WD_EN_ WK_BUS
rwh
Watchdog Enable after Bus Wake in Stop Mode
0B DISABLED, Watchdog will not start after a CAN
wake-up event
1B ENABLED, Watchdog starts with a long open
window after CAN Wake-up event
RES
3
r
Reserved, always reads as 0
WD_TIMER
2:0
rwh
Watchdog Timer Period
000B 10ms, 10ms
001B 20ms, 20ms
010B 50ms, 50ms
011B 100ms, 100ms
100B 200ms, 200ms
101B 500ms, 500ms
110B 1s, 1s
111B 10s, 10s
Table 37 Reset of WD_CTRL
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0000 0001 0100B
0000 0000 000x 0100B
Datasheet
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Rev. 1.0
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TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Notes
1. See also Chapter 12.2.4 for more information on disabling the watchdog in Stop Mode.
2. See chapter Chapter 12.2.5 for more information on the effect of the bit WD_EN_WK_BUS.
3. See chapter Chapter 12.2.3 for calculation of checksum.
Datasheet
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Rev. 1.0
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TLE9561QX
DC Motor System IC
Serial Peripheral Interface
CAN Control
BUS_CTRL
CAN Control
(000 0100B)
Reset Value: see Table 38
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RES
RES RES RES
RES
CAN
r
r
r
r
r
rwh
Field
RES
RES
RES
RES
RES
CAN
Bits
Type
Description
15:8
7
r
Reserved, always reads as 0
Reserved, always reads as 0
Reserved, always reads as 0
Reserved, always reads as 0
Reserved, always reads as 0
r
6
r
5
r
4:3
2:0
r
rwh
HS-CAN Module Modes
000B OFF, CAN OFF
001B WAKE, CAN is wake capable (no SWK)
010B RECEIVE, CAN Receive Only Mode (no SWK)
011B NORMAL, CAN Normal Mode (no SWK)
100B OFF, CAN OFF
Table 38 Reset of BUS_CTRL
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0000 0010 0000
0000 0000 0000 0xyyB
Notes
1. The reset values for CAN, transceivers are marked with ‘y’ because they will vary depending on the cause of
change.
2. See Figure 25, for detailed state changes of CAN, transceivers for different device modes.
3. The bit CAN_2 is not modified by the device but can only be changed by the user. Therefore, the bit type is ‘rw’
compared to bits CAN_0 and CAN_1.
4. In case SYSERR = 0 and the CAN transceiver is configured to ‘x11’ while going to Sleep Mode, it will be
automatically set to wake capable (‘x01’). The SPI bits will be changed to wake capable. If configured to ‘x10’
and Sleep Mode is entered, then the transceiver is set to wake capable, while it will stay in Receive Only Mode
when it had been configured to ‘x10’ when going to Stop Mode. If it had been configured to wake capable or
OFF then the mode will remain unchanged.The Receive Only Mode has to be selected by the user before
entering Stop Mode.
5. Failure Handling Mechanism: When the device enters Fail-Safe Mode due to a failure, then BUS_CTRL is
modified by the device to 0000 0000 xxx0 1001B to ensure that the device can be woken again. See also the
description in Chapter 8.1, and Chapter 9.2.1 for WK_CTRL for other wake sources when entering Fail-Safe
Mode.
6. When in Software Development Mode the POR/Soft Reset value are: CAN=001B , .
Datasheet
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Rev. 1.0
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TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Wake-up Control
WK_CTRL
Wake-up Control
(000 0101B)
Reset Value: see Table 39
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
WK2_
FO
RES
WK_FILT
WK_PUPD
RES
WK_EN
rw
RES
WK_BNK
rw
r
rw
rw
r
r
rw
Field
Bits
Type
Description
WK2 / FO configuration
WK2_FO
15
rw
0B FAIL_SAFE, WK2/FO pin configured as Fail Safe
Output
1B WAKE_UP, WK2/FO pin configured as Wake-up
Input
RES
14
r
Reserved, always reads as 0
WK_FILT
13:11
rw
Wake-up Filter Time Configuration
000B 16us, Filter with 16 µs filter time (static sensing)
001B 64us, Filter with 64 µs filter time (static sensing)
010B TIMER1, Filtering at the end of the on-time; filter
time of 16 µs (cyclic sensing) is selected, Timer1
011B TIMER2, Filtering at the end of the on-time; filter
time of 16 µs (cyclic sensing) is selected, Timer2
100B SYNC, Filter at the end of settle time (80 µs), filter
time of 16 µs (cyclic sensing) is selected, SYNC1)2)
101B , reserved
110B , reserved
111B , reserved
WK_PUPD
10:9
rw
WKx Pull-Up/Pull-Down Configuration
00B NO, No pull-up/pull-down selected
01B PULL_DOWN, Pull-down resistor selected
10B PULL_UP, Pull-up resistor selected3)
11B AUTO, Automatic switching to pull-up or pull-
down
RES
8:7
6:5
r
Reserved, always reads as 0
WK_EN
rw
WKx Enable
00B WK_OFF, WKx module OFF
01B WK_ON, WKx module ON
10B SYNC, OFF or (in case of WK4), it is configured as
SYNC input
11B OFF, OFF
RES
4:3
r
Reserved, always reads as 0
Datasheet
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Rev. 1.0
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TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Field
Bits
Type
Description
WK_BNK
2:0
rw
WKs input Banking
000B WK1, WK1 Module (Bank 1)
001B WK2, WK2 Module (Bank 2)
010B WK3, WK3 Module (Bank 3)
011B WK4, WK4 Module (Bank 4)
100B WK5, WK5 Module (Bank 5)3)
101B , reserved
110B , reserved
111B , reserved
1) This setting is available only in case of WK4 configured as WK_EN=10B.
2) The min TON time for cyclic sense with SYNC is 100 µs.
3) WK5 has a fixed pull-up resistor and is not configurable. So in Bank 5, the WK_PUPD field is reserved.
Table 39 Reset of WK_CTRL
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0000 0010 0000B
x0xx xxx0 0xx0 0000B
Notes
1. WK2_FO bit is accessable only if the Bank 2 is selected.
2. The SYNC functionality is accessable only if the Bank 4 is selected.
3. When selecting a filter time configuration, the user must make sure to also assign the respective timer/SYNC
to at least one HS switch during cyclic sense operation.
4. At Fail-Safe Mode entry WK_EN will be automatically changed (by the device) in “01”.
Exceptions: WK2 is configured as FO and WK4 if configured as SYNC previously
5. During Fail-Safe Mode the WK_FILT bits are ignored and static-sense with 16 µs filter time is used by default.
Datasheet
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Rev. 1.0
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TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Timer 1 and Timer2 Control and Selection
TIMER_CTRL
Timer 1 and Timer2 Control and Selection
(000 0110B)
Reset Value: see Table 40
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
TIMER2_ON
RES
TIMER2_PER
CYCWK
rwh
TIMER1_ON
RES
TIMER1_PER
rwh
r
rwh
rwh
r
rwh
Field
Bits
Type
Description
Timer2 On-Time Configuration
TIMER2_ON
15:13
rwh
000B OFF_LOW, OFF / Low (timer not running, HSx
output is low)
001B 100us, 0.1ms on-time
010B 300us, 0.3ms on-time
011B 1ms, 1.0ms on-time
100B 10ms, 10ms on-time
101B 20ms, 20ms on-time
110B OFF_HIGH, OFF / HIGH (timer not running, HSx
output is high)
111B , reserved, same behaviour as 110B
RES
12
r
Reserved, always reads as 0
TIMER2_PER
11:9
rwh
Timer2 Period Configuration
000B 10ms, 10ms
001B 20ms, 20ms
010B 50ms, 50ms
011B 100ms, 100ms
100B 200ms, 200ms
101B 500ms, 500ms
110B 1s, 1s
111B 2s, 2s
CYCWK
8:7
rwh
Cyclic Wake Configuration
00B DISABLED, Timer1 and Timer2 disabled as wake-
up sources
01B TIMER1, Timer1 is enabled as wake-up source
(Cyclic Wake)
10B TIMER2, Timer2 is enabled as wake-up source
(Cyclic Wake)
11B , reserved
Datasheet
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Rev. 1.0
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TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Field
Bits
Type
Description
TIMER1_ON
6:4
rwh
Timer1 On-Time Configuration
000B OFF_LOW, OFF / Low (timer not running, HSx
output is low)
001B 100us, 0.1ms on-time
010B 300us, 0.3ms on-time
011B 1ms, 1.0ms on-time
100B 10ms, 10ms on-time
101B 20ms, 20ms on-time
110B OFF_HIGH, OFF / HIGH (timer not running, HSx
output is high)
111B , reserved, same behaviour as 110B
RES
3
r
Reserved, always reads as 0
TIMER1_PER
2:0
rwh
Timer1 Period Configuration
000B 10ms, 10ms
001B 20ms, 20ms
010B 50ms, 50ms
011B 100ms, 100ms
100B 200ms, 200ms
101B 500ms, 500ms
110B 1s, 1s
111B 2s, 2s
Table 40 Reset of TIMER_CTRL
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0000 0000 0000B
0000 0000 0000 0000B
Notes
1. The timer must be first assigned and is then automatically activated as soon as the on-time is configured.
2. If cyclic sense is selected and the HSx switch is cleared during Restart Mode then also the timer settings
(period and on-time) are cleared to avoid incorrect switch detection. However, the timer settings are not
cleared in case of failure not leading to Restart Mode.
3. In case the timer is set as wake sources and cyclic sense is running, then both cyclic sense and cyclic wake will
be active at the same time.
4. Timer accuracy is linked to the oscillator accuracy (see Parameter P_13.12.43).
Datasheet
169
Rev. 1.0
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TLE9561QX
DC Motor System IC
Serial Peripheral Interface
High-Side Switch Shutdown Control
SW_SD_CTRL
High-Side Switch Shutdown Control
(000 0111B)
Reset Value: see Table 41
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
HS4_ HS3_ HS2_ HS1_
OV_S OV_S OV_S OV_S
DN_DI DN_DI DN_DI DN_DI
HS4_ HS3_ HS2_ HS1_ HS_O
OV_RE OV_RE OV_RE OV_RE T_SD_
HS_O HS_U
V_SDS V_SD_ RES
_DIS DIS
HS_U
V_REC
RES
C
C
C
C
DIS
S
S
rw
S
rw
S
rw
rw
rw
rw
rw
rw
rw
rw
rw
r
rw
r
Field
Bits
Type
Description
HS4_OV_REC
HS3_OV_REC
HS2_OV_REC
HS1_OV_REC
15
14
13
12
11
rw
rw
rw
rw
rw
Switch recovery after removal of VSHS Overvoltage
for HS4
0B DISABLED, Switch recovery is disabled
1B PREVIOUS, Previous state before VSHS
Overvoltage is enabled after Overvoltage
considtion is removed
Switch recovery after removal of VSHS Overvoltage
for HS3
0B DISABLED, Switch recovery is disabled
1B PREVIOUS, Previous state before VSHS
Overvoltage is enabled after Overvoltage
considtion is removed
Switch recovery after removal of VSHS Overvoltage
for HS2
0B DISABLED, Switch recovery is disabled
1B PREVIOUS, Previous state before VSHS
Overvoltage is enabled after Overvoltage
considtion is removed
Switch recovery after removal of VSHS Overvoltage
for HS1
0B DISABLED, Switch recovery is disabled
1B PREVIOUS, Previous state before VSHS
Overvoltage is enabled after Overvoltage
considtion is removed
HS_OT_SD_DIS
Shutdown Disabling of all HS in case of
Overtemperature event
0B ALL, shudown for all HSx in case of
Overtemperature
1B INDIVIDUAL, individual shudown in case of
Overtemperature
Datasheet
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TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Field
Bits
Type
Description
HS4_OV_SDN_DIS
10
rw
Shutdown Disabling of HS4 in case of input supply
overvoltage in Normal Mode
0B ENABLED, shudown enabled in case of VSHS
Overvoltage
1B DISABLED, shudown disabled in case of VSHS
Overvoltage
HS3_OV_SDN_DIS
HS2_OV_SDN_DIS
HS1_OV_SDN_DIS
HS_OV_SDS_DIS
HS_UV_SD_DIS
9
8
7
6
5
rw
rw
rw
rw
rw
Shutdown Disabling of HS3 in case of input supply
overvoltage in Normal Mode
0B ENABLED, shudown enabled in case of VSHS
Overvoltage
1B DISABLED, shudown disabled in case of VSHS
Overvoltage
Shutdown Disabling of HS2 in case of input supply
overvoltage in Normal Mode
0B ENABLED, shudown enabled in case of VSHS
Overvoltage
1B DIASBLED, shudown disabled in case of VSHS
Overvoltage
Shutdown Disabling of HS1 in case of input supply
overvoltage in Normal Mode
0B ENABLED, shudown enabled in case of VSHS
Overvoltage
1B DISABLED, shudown disabled in case of VSHS
Overvoltage
Shutdown Disabling of HSx in case of input supply
overvoltage in Stop Mode or Sleep Mode
0B ENABLED, shudown enabled in case of VSHS
Overvoltage
1B DISABLED, shudown disabled in case of VSHS
Overvoltage
Shutdown Disabling of HSx in case of input supply
undervoltage
0B ENABLED, shudown enabled in case of VSHS
Undervoltage
1B DISABLED, shudown disabled in case of VSHS
Undervoltage
RES
4
3
r
Reserved, always reads as 0
HS_UV_REC
rw
Switch recovery after removal of Undervoltage for
HSx
0B DISABLED, Switch recovery is disabled
1B PREVIOUS, Previous state before VSHS
Undervoltage is enabled after Undervoltage
considtion is removed
RES
2:0
r
Reserved, always reads as 0
Datasheet
171
Rev. 1.0
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TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Table 41 Reset of SW_SD_CTRL
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0000 0000 0000B
xxxx xxxx xxx0 x000B
Datasheet
172
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
High-Side Switch Control
HS_CTRL
High-Side Switch Control
(000 1000B)
Reset Value: see Table 42
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
HS4
HS3
HS2
HS1
rwh
rwh
rwh
rwh
Field
HS4
Bits
15:12
Type
rwh
Description
HS4 Configuration
0000BOFF, OFF
0001BON, ON
0010BTIMER1, Controlled by Timer1
0011BTIMER2, Controlled by Timer2
0100BPWM1, Controlled by PWM1
0101BPWM2, Controlled by PWM2
0110BPWM3, Controlled by PWM3
0111BPWM4, Controlled by PWM4
1000BWK4_SYNC, Synchronized with WK4/SYNC
1001B, reserved
1010B, reserved
1011B, reserved
1100B, reserved
1101B, reserved
1110B, reserved
1111B, reserved
HS3
11:8
rwh
HS3 Configuration
0000BOFF, OFF
0001BON, ON
0010BTIMER1, Controlled by Timer1
0011BTIMER2, Controlled by Timer2
0100BPWM1, Controlled by PWM1
0101BPWM2, Controlled by PWM2
0110BPWM3, Controlled by PWM3
0111BPWM4, Controlled by PWM4
1000BWK4_SYNC, Synchronized with WK4/SYNC
1001B, reserved
1010B, reserved
1011B, reserved
1100B, reserved
1101B, reserved
1110B, reserved
1111B, reserved
Datasheet
173
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Field
HS2
Bits
Type
Description
7:4
rwh
HS2 Configuration
0000BOFF, OFF
0001BON, ON
0010BTIMER1, Controlled by Timer1
0011BTIMER2, Controlled byTimer2
0100BPWM1, Controlled by PWM1
0101BPWM2, Controlled by PWM2
0110BPWM3, Controlled by PWM3
0111BPWM4, Controlled by PWM4
1000BWK4_SYNC, Synchronized with WK4/SYNC
1001B, reserved
1010B, reserved
1011B, reserved
1100B, reserved
1101B, reserved
1110B, reserved
1111B, reserved
HS1
3:0
rwh
HS1 Configuration
0000BOFF, OFF
0001BON, ON
0010BTIMER1, Controlled by Timer1
0011BTIMER2, Controlled by Timer2
0100BPWM1, Controlled by PWM1
0101BPWM2, Controlled by PWM2
0110BPWM3, Controlled by PWM3
0111BPWM4, Controlled by PWM4
1000BWK4_SYNC, Synchronized with WK4/SYNC
1001B, reserved
1010B, reserved
1011B, reserved
1100B, reserved
1101B, reserved
1110B, reserved
1111B, reserved
Table 42 Reset of HS_CTRL
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0000 0000 0000B
0000 0000 0000 0000B
PWMx in this register designates the internal PWM generators for the integrated high-side switches.
Datasheet
174
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Interrupt Mask Control1)
INT_MASK
Interrupt Mask Control
(000 1001B)
Reset Value: see Table 43
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
INTN_ WD_S
CYC_E DM_DI
SPI_C
RC_FA
IL
SUPP
LY_ST
AT
WD_S
DM
BD_ST HS_ST BUS_S TEMP
RES
AT
AT
TAT _STAT
N
SABLE
r
rw
rw
rw
rw
rw
rw
rw rw
rw
Field
RES
Bits
Type
Description
15:9
8
r
Reserved, always reads as 0
INTN_CYC_EN
rw
Periodical INTN generation
0B DISABLED, no periodical INTN event generated in
case of pending interrupts
1B ENABLED, periodical INTN event generated in
case of pending interrupts
WD_SDM_DISABLE
WD_SDM
7
6
5
4
3
rw
rw
rw
rw
rw
Disable Watchdog in Software Development Mode
0B ENABLED, WD is enabled in Software
Development Mode
1B DISABLED, WD is disabled in Software
Development Mode
Watchdog failure in Software Development Mode
0B DISABLED, no INTN event generated in case of
WD trigger failure in Software Development Mode
1B ENABLED, one INTN event is generated in case of
WD trigger failure in Software Development Mode
SPI_CRC_FAIL
BD_STAT
SPI and CRC interrupt generation
0B DISABLED, no INTN event generated in case of
SPI_FAIL or CRC_FAIL
1B ENABLED, one INTN event is generated n case of
SPI_FAIL or CRC_FAIL
Bridge Driver Interrupt generation
0B DISABLED, no INTN event generated in case
BD_STAT (on Status Information Field) is set
1B ENABLED, one INTN event generated in case
BD_STAT (on Status Information Field) is set
HS_STAT
High Side Interrupt generation
0B DISABLED, no INTN event generated in case
HS_STAT (on Status Information Field) is set
1B ENABLED, one INTN event generated in case
HS_STAT (on Status Information Field) is set
1) Every event will generate a signal on the INTN pin (when masked accordingly).
Even if the status-bit was already set in the corresponding status-register it can still trigger a signal on the INTN pin.
Datasheet
175
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Field
Bits
Type
Description
BUS_STAT
2
rw
BUS Interrupt generation
0B DISABLED, no INTN event generated in case
BUS_STAT (on Status Information Field) is set
1B ENABLED, one INTN event generated in case
BUS_STAT (on Status Information Field) is set
TEMP_STAT
1
0
rw
rw
Temperature Interrupt generation
0B DISABLED, no INTN event generated in case
TEMP_STAT (on Status Information Field) is set
1B ENABLED, one INTN event generated in case
TEMP_STAT (on Status Information Field) is set
SUPPLY_STAT
SUPPLY Status Interrupt generation
0B DISABLED, no INTN event generated in case
SUPPLY_STAT (on Status Information Field) is set
1B ENABLED, one INTN event generated in case
SUPPLY_STAT (on Status Information Field) is set
Table 43 Reset of INT_MASK
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0001 0100 0000B
0000 000x xxxx xxxxB
Datasheet
176
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
PWM Configuration Control
PWM_CTRL
PWM Configuration Control
(000 1010B)
Reset Value: see Table 44
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
PWM_
FREQ
RES
PWM_DC
RES
PWM_BNK
r
rw
rw
r
rw
Field
RES
Bits
Type
r
Description
Reserved, always reads as 0
15
14
PWM_FREQ
rw
PWM generator Frequency Setting
0B 100Hz, 100Hz is selected
1B 200Hz, 200Hz is selected
PWM_DC
13:4
rw
PWM Duty Cycle Setting (bit4 = LSB; bit13 = MSB)
00 0000 0000B, 100% OFF, i.e. HS = OFF
xx xxxx xxxxB, ON with duty cycle fraction of 1024
11 1111 1111B, 100% ON, i.e. HS = ON
RES
3
r
Reserved, always reads as 0
PWM_BNK
2:0
rw
Internal PWM generator selection
000B PWM1, PWM1 Module
001B PWM2, PWM2 Module
010B PWM3, PWM3 Module
011B PWM4, PWM4 Module
1xxB , Don’t care
Table 44 Reset of PWM_CTRL
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0000 0000 0000B
0xxx xxxx xxxx 0000B
PWMx in this register designates the internal PWM generators for the integrated high-side switches.
Notes
1. 0% and 100% duty cycle settings are used to have the switch turned ON or OFF respectively.
2. The desired duty cycle should be set first before the HSx is enabled as PWM.
3. The PWM signal is correct only after at least one PWM pulse.
4. PWM generator accuracy is linked to the oscillator accuracy (see parameter P_13.12.43).
Datasheet
177
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
System Status Control
SYS_STAT_CTRL
System Status Control
(000 1011B)
Reset Value: see Table 45
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
SYS_STAT
rw
Field
Bits
15:0
Type
rw
Description
System Status Control (bit0=LSB; bit15=MSB)
SYS_STAT
Dedicated bytes for system configuration, access only
by microcontroller. Cleared after power up and soft
reset.
Table 45 Reset of SYS_STAT_CTRL
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR / Soft reset
Restart
0000 0000 0000 0000B
xxxx xxxx xxxx xxxxB
Note:
This register is intended for storing system configuration of the ECU by the microcontroller and is
only accessible in Normal Mode. The register is not accessible by the TLE9561QX and is also not
cleared after Fail-Safe or Restart Mode. It allows the microcontroller to quickly store system
configuration without loosing data.
Datasheet
178
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
13.5.2
Control registers bridge driver
General Bridge Control
GENCTRL
General Bridge Control
(001 0000B)
Reset Value: see Table 46
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
EN_GE
N_CH IHOLD
ECK
BDFR PWM3 PWM1 CPUV FET_L CPST BDOV IPCHG
POCH AGCFI
FMOD
E
AGC
CPEN
EQ 4MAP 2MAP TH
VL
GA _REC ADT
rw rw rw
GDIS
LT
rw
rw
rw
rw
rw
rw
rw
rw
rw
rw
rw
rw
Field
Bits
Type
Description
BDFREQ
15
rw
Bridge driver synchronization frequency
0B 18MHz, typ. 18.75 MHz (default)
1B 37MHz, typ. 37.5 MHz
PWM34MAP
PWM12MAP
CPUVTH
14
rw
PWM34MAP
0B PWM34_TO_HB34, PWM3 mapped to HB3, PWM4
mapped to HB4 (default)
1B PWM3_TO_HB4, PWM3 mapped to HB4
13
12
rw
rw
PWM12MAP
0B PWM12_TO_HB12, PWM1/CRC mapped to HB1,
PWM2 mapped to HB2 (default)
1B PWM1_TO_HB2, PWM1/CRC mapped to HB2
Charge pump under voltage (referred to VS)
0B TH1, (default) CPUV threshold 1 for FET_LVL = 0,
CPUV threshold 1 for FET_LVL = 1
1B TH2, CPUV threshold 2 for FET_LVL = 0, CPUV
threshold 2 for FET_LVL = 1
FET_LVL
CPSTGA
11
10
rw
rw
External MOSFET normal / logic level selection
0B LOGIC, Logic level MOSFET selected
1B NORMAL, Normal level MOSFET selected(default)
Automatic switchover between dual and single
charge pump stage
0B INACTIVE, Automatic switch over deactivated
(default)
1B ACTIVE, Automatic switch over activated
BDOV_REC
IPCHGADT
9
8
rw
rw
Bridge driver recover from VS and VSINT
Overvoltage
0B INACTIVE, Recover deactivated (default)
1B ACTIVE, Recover activated
Adaptation of the pre-charge and pre-discharge
current
0B 1STEP, 1 current step (default)
1B 2STEPS, 2 current steps
Datasheet
179
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Field
AGC
Bits
Type
Description
7:6
rw
Adaptive gate control
00B INACTIVE1, (default) Adaptive gate control
disabled, pre-charge and pre-discharge disabled
01B INACTIVE2, Adaptive gate control disabled,
precharge is enabled with IPRECHG = IPCHGINIT,
predischarge is enabled with IPREDCHG =
IPDCHGINIT
10B ACTIVE, Adaptive gate control enabled, IPRECHG
and IPREDCHG are self adapted
11B , reserved. Adaptive gate control enabled,
IPRECHG and IPREDCHG are self adapted
CPEN
5
4
rw
rw
CPEN
0B DISABLED, Charge pump disabled (default)
1B ENABLED, Charge pump enabled
POCHGDIS
Postcharge disable bit
0B ENABLED, The postcharge phase is enabled
during PWM (default)
1B DISABLED, The postcharge phase is disabled
during PWM
AGCFILT
3
2
1
0
rw
rw
rw
rw
Filter for adaptive gate control
0B NO_FILT, No filter applied (default)
1B FILT_APPL, Filter applied
EN_GEN_CHECK
IHOLD
Detection of active / FW MOSFET
0B DISABLED, Detection disabled (default)
1B ENABLED, Detection enabled
Gate driver hold current IHOLD
0B TH1, (default) Charge: ICHG19 , discharge IDCHG19
1B TH2, Charge: ICHG25, discharge: ICHG25
.
FMODE
Frequency modulation of the charge pump
0B NO, No modulation
1B 15KHz, Modulation frequency 15.6 kHz (default)
Table 46 Reset of GENCTRL
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 1000 0000 0001B
xxxx xxxx xxxx xxxxB
Datasheet
180
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Drain-Source monitoring threshold LS1-4
LS_VDS
VDS monitoring threshold LS1-4
(001 0010B)
Reset Value: see Table 47
15
14
13
TFVDS
rw
12
11
10
9
8
7
6
5
4
3
2
1
0
RES
LS4VDSTH
LS3VDSTH
LS2VDSTH
LS1VDSTH
r
rw
rw
rw
rw
Field
RES
Bits
Type
Description
Reserved. Always read as 0
15:14
13:12
r
TFVDS
rw
Filter time of drain-source voltage monitoring
00B 500ns, 0.5 µs (default)
01B 1us, 1 µs
10B 2us, 2 µs
11B 6us, 6 µs
LS4VDSTH
LS3VDSTH
LS2VDSTH
11:9
rw
rw
rw
LS4 drain-source overvoltage threshold
000B 160mV, 0.16 V
001B 200mV, 0.20 V (default)
010B 300mV, 0.30 V
011B 400mV, 0.40 V
100B 500mV, 0.50 V
101B 600mV, 0.60 V
110B 800mV, 0.80 V
111B 2V, 2.0 V
8:6
LS3 drain-source overvoltage threshold
000B 160mV, 0.16 V
001B 200mV, 0.20 V (default)
010B 300mV, 0.30 V
011B 400mV, 0.40 V
100B 500mV, 0.50 V
101B 600mV, 0.60 V
110B 800mV, 0.80 V
111B 2V, 2.0 V
5:3
LS2 drain-source overvoltage threshold
000B 160mV, 0.16V
001B 200mV, 0.20 V (default)
010B 300mV, 0.30 V
011B 400mV, 0.40 V
100B 500mV, 0.50 V
101B 600mV, 0.60 V
110B 800mV, 0.80 V
111B 2V, 2.0 V
Datasheet
181
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Field
Bits
Type
Description
LS1VDSTH
2:0
rw
LS1 drain-source overvoltage threshold
000B 160mV, 0.16 V
001B 200mV, 0.20 V (default)
010B 300mV, 0.30 V
011B 400mV, 0.40 V
100B 500mV, 0.50 V
101B 600mV, 0.60 V
110B 800mV, 0.80 V
111B 2V, 2.0 V
Table 47 Reset of LS_VDS
Register Reset Type Reset Values
Reset Short Name
Reset Mode
Note
POR/Soft reset
Restart
0000 0010 0100 1001B 0000 0000 0000 0000
0000 xxxx xxxx xxxxB
Datasheet
182
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Drain-Source monitoring Threshold HS1-4
HS_VDS
VDS monitoring threshold HS1-4
(001 0011B)
Reset Value: see Table 48
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
DEEP_
ADAP
RES
RES
HS4VDSTH
HS3VDSTH
HS2VDSTH
HS1VDSTH
r
rw
rw
rw
rw
rw
rw
Field
RES
RES
Bits
15:14
13
Type
Description
Reserved. Always read as 0
r
rw
rw
Reserved. This bit must be programmed to ‘0‘
DEEP_ADAP
12
Deep adaptation enable
0B NO_DEEP_ADAP, Deep adaptation disabled
(default)
1B DEEP_ADAP, Deep adaptation enabled
HS4VDSTH
11:9
rw
rw
rw
HS4 drain-source overvoltage threshold
000B 160mV, 0.16 V
001B 200mV, 0.20 V (default)
010B 300mV, 0.30 V
011B 400mV, 0.40 V
100B 500mV, 0.50 V
101B 600mV, 0.60 V
110B 800mV, 0.80 V
111B 2V, 2.0 V
HS3VDSTH
8:6
HS3 drain-source overvoltage threshold
000B 160mV, 0.16 V
001B 200mV, 0.20 V (default)
010B 300mV, 0.30 V
011B 400mV, 0.40 V
100B 500mV, 0.50 V
101B 600mV, 0.60 V
110B 800mV, 0.80 V
111B 2V, 2.0 V
HS2VDSTH
5:3
HS2 drain-source overvoltage threshold
000B 160mV, 0.16 V
001B 200mV, 0.20 V (default)
010B 300mV, 0.30 V
011B 400mV, 0.40 V
100B 500mV, 0.50 V
101B 600mV, 0.60 V
110B 800mV, 0.80 V
111B 2V, 2.0 V
Datasheet
183
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Field
Bits
Type
Description
HS1VDSTH
2:0
rw
HS1 drain-source overvoltage threshold
000B 160mV, 0.16 V
001B 200mV, 0.20 V (default)
010B 300mV, 0.30 V
011B 400mV, 0.40 V
100B 500mV, 0.50 V
101B 600mV, 0.60 V
110B 800mV, 0.80 V
111B 2V, 2.0 V
Table 48 Reset of HS_VDS
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0010 0100 1001B
00xx xxxx xxxx xxxxB
Datasheet
184
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
CCP and times selection
CCP_BLK
CCP and times selection
(001 0100B)
Reset Value: see Table 49
15
14
TBLANK
rw
13
12
11
10
TCCP
rw
9
8
7
6
5
4
3
2
1
0
RES
CCP_BNK
r
rw
Field
Bits
Type
Description
Blank time
TBLANK
15:12
rw
nom. tHBxBLANK = 587 ns + 266 x T[3:0]D
The CCP_BNK bits select the blank time for the FW or
active MOSFET and the half-bridge HBx
Reset of active and FW tHBxBLANK: 2450 ns typ.
TCCP
11:8
rw
Cross-current protection time
nom. tHBxCCP = 587 ns + 266 x TCCP[3:0]D
The CCP_BNK bits select the cross-current protection
time for the FW or active MOSFET and the half-bridge
HBx
Reset of all active and FW tHBxCCP: 2450 ns typ.
RES
7:3
2:0
r
Reserved, always reads as 0
CCP_BNK
rw
Cross-current and time banking
000B ACT_HB1, Active blank and cross-current prot.
times for HB1 (default)
001B ACT_HB2, Active blank and cross-current prot.
times for HB2
010B ACT_HB3, Active blank and cross-current prot.
times for HB3
011B ACT_HB4, Active blank and cross-current prot.
times for HB4
100B FW_HB1, FW blank and cross-current prot. times
for HB1
101B FW_HB2, FW blank and cross-current prot. times
for HB2
110B FW_HB3, FW blank and cross-current prot. for
times for HB3
111B FW_HB4, FW blank and cross-current prot. for
times for HB4
Table 49 Reset of CCP_BLK
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0111 0111 0000 0000B
xxxx xxxx 0000 0000B
Datasheet
185
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Half-Bridge MODE
HBMODE
Half-Bridge MODE
(001 0101B)
Reset Value: see Table 50
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
HB4_
HB3_
HB2_
HB1_
HB4MODE AFW4 PWM_ HB3MODE AFW3 PWM_ HB2MODE AFW2 PWM_ HB1MODE AFW1 PWM_
EN
EN
EN
EN
rw
rw
rw
rw
rw
rw
rw
rw
rw
rw
rw
rw
Field
Bits
Type
Description
HB4MODE
15:14
rw
Half-bridge 4 MODE selection
00B PASSIVE_OFF, LS4 and HS4 are off by passive
discharge (default)
01B LS4_ON, LS4 is ON
10B HS4_ON, HS4 is ON
11B ACTIVE_OFF, LS4 and HS4 kept off by the active
discharge
AFW4
13
rw
rw
rw
Active freewheeling for half-bridge 4 during PWM
0B DISABLED, active freewheeling disabled
1B ENABLED, active freewheeling enabled (default)
HB4_PWM_EN
HB3MODE
12
PWM mode for half-bridge 4
0B INACTIVE, PWM deactivated for HB4(default)
1B ACTIVE, PWM activated for HB4
11:10
Half-bridge 3 MODE selection
00B PASSIVE_OFF, LS3 and HS3 are off by passive
discharge (default)
01B LS3_ON, LS3 is ON
10B HS3_ON, HS3 is ON
11B ACTIVE_OFF, LS3 and HS3 kept off by the active
discharge
AFW3
9
rw
rw
rw
Active freewheeling for half-bridge 3 during PWM
0B DISABLED, active freewheeling disabled
1B ENABLED, active freewheeling enabled (default)
PWM mode for half-bridge 3 if PWM34MAP=01)
0B INACTIVE, PWM deactivated for HB2(default)
1B ACTIVE, PWM activated for HB2
HB3_PWM_EN
HB2MODE
8
7:6
Half-bridge 2 MODE selection
00B PASSIVE_OFF, LS2 and HS2 are off by passive
discharge (default)
01B LS2_ON, LS2 is ON
10B HS2_ON, HS2 is ON
11B ACTIVE_OFF, LS2 and HS2 kept off by the active
discharge
Datasheet
186
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Field
Bits
Type
Description
AFW2
5
rw
Active freewheeling for half-bridge 2 during PWM
0B DISABLED, active freewheeling disabled
1B ENABLED, active freewheeling enabled (default)
HB2_PWM_EN
HB1MODE
4
rw
rw
PWM mode for half-bridge 2
0B INACTIVE, PWM deactivated for HB2(default)
1B ACTIVE, PWM activated for HB2
3:2
Half-bridge 1 MODE selection
00B PASSIVE_OFF, LS1 and HS1 are off by passive
discharge (default)
01B LS1_ON, LS1 is ON
10B HS1_ON, HS1 is ON
11B ACTIVE_OFF, LS1 and HS1 kept off by the active
discharge
AFW1
1
0
rw
rw
Active freewheeling for half-bridge 1 during PWM
0B DISABLED, active freewheeling disabled
1B ENABLED, active freewheeling enabled (default)
PWM mode for half-bridge 1 if PWM12MAP=02)
0B INACTIVE, PWM deactivated for HB1 (default)
1B ACTIVE, PWM activated for HB1
HB1_PWM_EN
1) If PWM34MAP = 1, HB3 is controlled statically according to HB3MODE independently from HB3_PWM_EN.
2) If PWM12MAP = 1, HB1 is controlled statically according to HB1MODE independently from HB1_PWM_EN.
Table 50 Reset of HBMODE
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0010 0010 0010 0010B
0010 0010 0010 0010B
Datasheet
187
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
HB pre-charge and pre-discharge time
TPRECHG
HB pre-charge and pre-discharge time
(001 0110B)
Reset Value: see Table 51
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
TPCHG4
TPCHG3
TPCHG2
TPCHG1
RES
TPCHG_BNK
rw
rw
rw
rw
r
rw
Field
Bits
Type
Description
TPCHG4
TPCHG3
TPCHG2
15:13
12:10
9:7
rw
rw
rw
If TPCHG_BNK=0: precharge time of HB 4, If
TPCHG_BNK=1: predischarge time of HB 4
000B 107ns, tPCHG000 / tPDCHG000 (default)
001B 160ns, tPCHG001 / tPDCHG001
010B 214ns, tPCHG010 / tPDCHG010
011B 267ns, tPCHG011 / tPDCHG011
100B 320ns, tPCHG100 / tPDCHG100
101B 533ns, tPCHG101 / tPDCHG101
110B 747ns, tPCHG110 / tPDCHG110
111B 1067ns, tPCHG111 / tPDCHG111
If TPCHG_BNK=0: precharge time of HB 3, If
TPCHG_BNK=1: predischarge time of HB 3
000B 107ns, tPCHG000 / tPDCHG000 (default)
001B 160ns, tPCHG001 / tPDCHG001
010B 214ns, tPCHG010 / tPDCHG010
011B 267ns, tPCHG011 / tPDCHG011
100B 320ns, tPCHG100 / tPDCHG100
101B 533ns, tPCHG101 / tPDCHG101
110B 747ns, tPCHG110 / tPDCHG110
111B 1067ns, tPCHG111 / tPDCHG111
If TPCHG_BNK=0: precharge time of HB 2, If
TPCHG_BNK=1: predischarge time of HB 2
000B 107ns, tPCHG000 / tPDCHG000 (default)
001B 160ns, tPCHG001 / tPDCHG001
010B 214ns, tPCHG010 / tPDCHG010
011B 267ns, tPCHG011 / tPDCHG011
100B 320ns, tPCHG100 / tPDCHG100
101B 533ns, tPCHG101 / tPDCHG101
110B 747ns, tPCHG110 / tPDCHG110
111B 1067ns, tPCHG111 / tPDCHG111
Datasheet
188
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Field
Bits
Type
Description
TPCHG1
6:4
rw
If TPCHG_BNK=0: precharge time of HB 1, If
TPCHG_BNK=1: predischarge time of HB 1
000B 107ns, tPCHG000 / tPDCHG000 (default)
001B 160ns, tPCHG001 / tPDCHG001
010B 214ns, tPCHG010 / tPDCHG010
011B 267ns, tPCHG011 / tPDCHG011
100B 320ns, tPCHG100 / tPDCHG100
101B 533ns, tPCHG101 / tPDCHG101
110B 747ns, tPCHG110 / tPDCHG110
111B 1067ns, tPCHG111 / tPDCHG111
RES
3
r
Reserved, always read as 0
TPCHG_BNK
2:0
rw
Precharge/predischarge time selection
000B PRECHARGE, Precharge time selected (default)
001B PREDISCHARGE, Predischarge time selected
x1xB , wrong setting of TPCHG_BNK
1xxB , wrong setting of TPCHG_BNK
Table 51 Reset of TPRECHG
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0000 0000 0000B
xxxx xxxx xxxx 0000B
Datasheet
189
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Static charge/discharge current
ST_ICHG
Static charge/discharge current
(001 0111B)
Reset Value: see Table 52
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
ICHGST4
ICHGST3
ICHGST2
ICHGST1
rw
rw
rw
rw
Field
Bits
Type
Description
ICHGST4
15:12
11:8
7:4
rw
rw
rw
rw
Static charge and discharge currents of HB4
Refer to Table 20
Default: 0100B - charge: ICHG16, 9.2 mA typ., discharge
DCHG16, 9.2 mA typ.
I
ICHGST3
ICHGST2
ICHGST1
Static charge and discharge currents of HB3
Refer to Table 20
Default: 0100B - charge: ICHG16, 9.2 mA typ., discharge:
IDCHG16, 9.2 mA typ.
Static charge and discharge currents of HB2
Refer to Table 20
Default: 0100B - charge: ICHG16, 9.2 mA typ., discharge
IDCHG16, 9.2 mA typ.
3:0
Static charge and discharge currents of HB1
Refer to Table 20
Default: 0100B - charge: ICHG16, 9.2 mA typ., discharge
IDCHG16, 9.2 mA typ.
Table 52 Reset of ST_ICHG
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0100 0100 0100 0100B
xxxx xxxx xxxx xxxxB
Datasheet
190
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
HB charge/discharge currents for PWM operation
HB_ICHG
HB charge/discharge currents for PWM operation
(001 1000B)
Reset Value: see Table 53
15
14
13
IDCHG
rw
12
11
10
9
8
7
6
5
4
3
2
1
0
ICHG
RES
ICHG_BNK
rw
r
rw
Field
Bits
15:10
Type
Description
IDCHG
rw
rw
If ICHG_BNK =0xxB: Discharge current of HBx active
MOSFET
If ICHG_BNK=1xxB: Reserved. Always read as ‘0’
Default value for all active MOSFETs discharge
currents: 001111B, IDCHG15
Refer to Table 23 for the configuration of the discharge
current
ICHG
9:4
If ICHG_BNK=0xxB: Charge current of HBx active
MOSFET
If ICHG_BNK=1xxB: Charge and discharge current of
HBx FW MOSFETs
Default value for all active MOSFETs charge currents
and all FW MOSFETs charge/discharge currents:
001101B, ICHG13
Refer to Table 22 for the configuration of the charge
current of the active and FW MOSFET
Refer to Table 23 for the configuration of the discharge
current of the FW MOSFET
RES
ICHG_BNK
3
r
Reserved, always read as 0
2:0
rw
Banking bits for charge and discharge currents of
active MOSFETs
000B ACT_HB1, Active MOSFET of HB1 is selected
(default)
001B ACT_HB2, Active MOSFET of HB2 is selected
010B ACT_HB3, Active MOSFET of HB3 is selected
011B ACT_HB4, Active MOSFET of HB4 is selected
100B FW_HB1, FW MOSFET of HB1 is selected
101B FW_HB2, FW MOSFET of HB2 is selected
110B FW_HB3, FW MOSFET of HB3 is selected
111B FW_HB4, FW MOSFET of HB4 is selected
Table 53 Reset of HB_ICHG
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
0011 1100 1101 0000B
POR value valid for
ICHG_BNK = 0
Restart
xxxx xxxx xxxx 0000B
Datasheet
191
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
HB max. pre-charge/pre-discharge in PWM operation current and diagnostic pull-down
HB_ICHG_MAX
HB max. pre-charge/pre-discharge in PWM operation current and diagnostic pull-down
(001 1001B)
Reset Value: see Table 54
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
HB4ID HB3ID HB2ID HB1ID
RES
ICHGMAX4
ICHGMAX3
ICHGMAX2
ICHGMAX1
IAG
IAG
IAG
IAG
rw
rw
rw
rw
r
rw
rw
rw
rw
Field
Bits
Type
Description
HB4IDIAG
HB3IDIAG
15
rw
Control of HB4 off-state current source and current
sink
0B INACTIVE, Pull-down deactivated (default)
1B ACTIVE, Pull-down activated
14
rw
Control of HB3 off-state current source and current
sink
0B INACTIVE, Pull-down deactivated (default)
1B ACTIVE, Pull-down activated
HB2IDIAG
HB1IDIAG
13
12
rw
rw
Control of HB2 pull-down for off-state diagnostic
0B INACTIVE, Pull-down deactivated (default)
1B ACTIVE, Pull-down activated
Control of HB1 pull-down for off-state diagnostic
0B INACTIVE, Pull-down deactivated (default)
1B ACTIVE, Pull-down activated
RES
11:8
7:6
r
Reserved, always read as 0
ICHGMAX4
rw
Maximum drive current of HB4 during the pre-
charge phase and pre-discharge phases1)
00B 19mA, charge ICHG24: typ. 19.2 mA, discharge
I
DCHG24: typ. 18.8 mA (default)
01B 32mA, charge ICHG32: typ. 32.8 mA, discharge
DCHG32: typ. 32.2 mA
I
10B 73mA, charge ICHG52: typ. 73.2 mA, discharge
IDCHG52: typ. 72.4mA
11B 100mA, charge ICHG63: typ. 100 mA, discharge
IDCHG63: typ. 100 mA
ICHGMAX3
5:4
rw
Maximum drive current of HB3 during the pre-
charge and pre-discharge phases1)
00B 19mA, charge ICHG24: typ. 19.2 mA, discharge
IDCHG24: typ. 18.8 mA (default)
01B 32mA, charge ICHG32: typ. 32.8 mA, discharge
IDCHG32: typ. 32.2 mA
10B 73mA, charge ICHG52: typ. 73.2 mA, discharge
I
DCHG52: typ. 72.4mA
11B 100mA, charge ICHG63: typ. 100 mA, discharge
DCHG63: typ. 100 mA
I
Datasheet
192
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Field
Bits
Type
Description
ICHGMAX2
3:2
rw
Maximum drive current of HB2 during the pre-
charge phase and pre-discharge phases1)
00B 19mA, charge ICHG24: typ. 19.2 mA, discharge
IDCHG24: typ. 18.8 mA (default)
01B 32mA, charge ICHG32: typ. 32.8 mA, discharge
I
DCHG32: typ. 32.2 mA
10B 73mA, charge ICHG52: typ. 73.2 mA, discharge
DCHG52: typ. 72.4mA
I
11B 100mA, charge ICHG63: typ. 100 mA, discharge
IDCHG63: typ. 100 mA
ICHGMAX1
1:0
rw
Maximum drive current of HB1 during the pre-
charge and pre-discharge phases1)
00B 19mA, charge ICHG24: typ. 19.2 mA, discharge
I
DCHG24: typ. 18.8 mA (default)
01B 32mA, charge ICHG32: typ. 32.8 mA, discharge
DCHG32: typ. 32.2 mA
I
10B 73mA, charge ICHG52: typ. 73.2 mA, discharge
IDCHG52: typ. 72.4mA
11B 100mA, charge ICHG63: typ. 100 mA, discharge
IDCHG63: typ. 100 mA
1) ICHGMAX is also the current applied during the post-charge of the PWM MOSFET.
Table 54 Reset of HB_ICHG_MAX
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0000 0000 0000B
xxxx 0000 xxxx xxxxB
Datasheet
193
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
HBx pre-charge/pre-dischage initialization configuration in PWM operation
HB_PCHG_INIT
HBx pre-charge/pre-discharge initialization configuration in PWM operation
(001 1010B)
Reset Value: see Table 55
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
PDCHGINIT
PCHGINIT
RES
INIT_BNK
rw
rw
r
rw
Field
Bits
Type
Description
PDCHGINIT
15:10
rw
Initial predischarge current of HBx, IPDCHGINITx
The INIT_BNK bits select the addressed half-bridge
Default: 001111B
Refer to Table 23
PCHGINIT
9:4
rw
Initial precharge current of HBx, IPCHGINITx
The INIT_BNK bits select the addressed half-bridge
Default: 001101B
Refer to Table 22
RES
3
r
Reserved, always reads as 0
INIT_BNK
2:0
rw
Banking bits for Precharge an Predischarge Initial
Current
000B HB1, precharge/discharge init. for HB1 selected
(default)
001B HB2, precharge/discharge init. for HB2 selected
010B HB3, precharge/discharge init. for HB3 selected
011B HB4, precharge/discharge init. for HB4 selected
1xxB , wrong setting of INIT_BANK
Table 55 Reset of HB_PCHG_INIT
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0011 1100 1101 0000B
xxxx xxxx xxxx 0000B
Datasheet
194
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
HBx inputs TDON configuration
TDON_HB_CTRL
HBx inputs TDON configuration
(001 1011B)
Reset Value: see Table 56
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RES
TDON
RES
HB_TDON_BNK
r
rw
r
rw
Field
RES
Bits
Type
Description
Reserved, always read as 0
15:14
13:8
r
TDON
rw
Turn-on delay time of active MOSFET of HBx
The HB_TDON_BNK bits selects the turn-on delay time
of the active MOSFET of the half-bridge HBx
Nominal tDON = 53.3 ns x TDON[5:0]D
Default: 00 1100B : 640 ns typ.
RES
7:3
2:0
r
Reserved, always read as 0
HB_TDON_BNK
rw
Banking bits for turn-on delay time
000B HB1, tDON of HB1 selected (default)
001B HB2, tDON of HB2 selected
010B HB3, tDON of HB3 selected
011B HB4, tDON of HB4 selected
1xxB , wrong setting of PWM_TDON_BNK
Table 56 Reset of TDON_HB_CTRL
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 1100 0000 0000B
00xx xxxx 0000 0000B
Datasheet
195
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
HBx TDOFF configuration
TDOFF_HB_CTRL
HBx TDOFF configuration
(001 1100B)
Reset Value: see Table 57
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RES
TDOFF
RES
HB_TDOFF_BNK
r
rw
r
rw
Field
RES
Bits
Type
Description
Reserved, always read as 0
15:14
13:8
r
TDOFF
rw
Turn-off delay time of active MOSFET of HBx
The HB_TDOFF_BNK bits selects the turn-off delay
time of the active MOSFET of the half-bridge HBx
Nominal tDOFF = 53.3 ns x TDOFF[5:0]D
Default: 0000 1100B : 640 ns
RES
7:3
2:0
r
Reserved, always read as 0
HB_TDOFF_BNK
rw
Banking bits for turn-off delay time
000B HB1, tDOFF of HB1 selected (default)
001B HB2, tDOFF of HB2 selected
010B HB3, tDOFF of HB3 selected
011B HB4, tDOFF of HB4 selected
1xxB , wrong setting of PWM_TDOFF_BNK
Table 57 Reset of TDOFF_HB_CTRL
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 1100 0000 0000B
00xx xxxx 0000 0000B
Datasheet
196
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Brake control
BRAKE
Brake control
(001 1101B)
Reset Value: see Table 58
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
SLAM SLAM SLAM SLAM
_LS4_ _LS3_ _LS2_ _LS1_ SLAM H_BR
VDST
PARK_ OV_B
BRK_E RK_E
TBLK_
BRK
RES
RES
OV_BRK_TH
DIS
DIS
DIS
DIS
K
N
N
r
rw
rw
rw
rw
rw
rw
rw
rw
rw
rw
rw
Field
RES
Bits
Type
Description
Reserved, always read as 0
15:14
13
r
SLAM_LS4_DIS
SLAM_LS3_DIS
SLAM_LS2_DIS
SLAM_LS1_DIS
rw
LS4 output disable during SLAM mode
0B ACTIVE, LS4 control active in Slam mode
(default)
1B DISABLED, LS4 control disabled in Slam mode
12
11
10
rw
rw
rw
LS3 output disable during SLAM mode
0B ACTIVE, LS3 control active in Slam mode
(default)
1B DISABLED, LS3 control disabled in Slam mode
LS2 output disable during SLAM mode
0B ACTIVE, LS2 control active in Slam mode
(default)
1B DISABLED, LS2 control disabled in Slam mode
LS1 output disable during SLAM mode
0B ACTIVE, LS1 control active in Slam mode
(default)
1B DISABLED, LS1 control disabled in Slam mode
SLAM
9
rw
rw
rw
rw
rw
rw
Slam mode
0B INACTIVE, Slam mode deactivated (default)
1B AVTIVE, Slam mode activated
VDSTH_BRK
TBLK_BRK
PARK_BRK_EN
OV_BRK_EN
RES
8
VDS Overvoltage for LS1-4 during braking
0B 800mV, VVDSMONTH0_BRAKE, 0.8 V, typ. (default)
1B 220mV, VVDSMONTH1_BRAKE, 0.22 V typ.
7
Blank time of VDS overvoltage during braking
0B 7uS, tBLK_BRAKE1,7 µs typ.
1B 11uS, tBLK_BRAKE2, 11 µs typ. (default)
6
Parking brake enable
0B DISABLED, Parking brake disabled (default)
1B ENABLED, Parking brake enabled
5
Overvoltage brake enable
0B DISABLED, Overvoltage brake disabled
1B ENABLED, Overvoltage brake enabled (default)
4:3
Reserved, to be set to 0
Datasheet
197
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Field
Bits
Type
Description
OV_BRK_TH
2:0
rw
Overvoltage brake threshold
000B 27V, typ. 27V (default)
001B 28V, typ. 28V
010B 29V, typ. 29V
011B 30V, typ. 30V
100B 31V, typ. 31V
101B 32V, typ. 32V
110B 33V, typ. 33V
111B 34V, typ. 34V
Table 58 Reset of BRAKE
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0000 1010 0000B
00xx xxxx xxx0 0xxxB
Note:
For min and max values of OV_BRK_TH, refer to Chapter 12.12.
Datasheet
198
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
13.6
SPI status information registers
READ/CLEAR Operation (see also Chapter 13.3):
•
One 32-bit SPI command consist of four bytes:
- The 7-bit address and one additional bit for the register access mode and
- following the two data bytes and the CRC.
The numbering of following bit definitions refers to the data byte and correspond to the bits D0...D7 and to
the SPI bits 8...23 (see also figure).
•
There are two different bit types:
- ‘r’ = READ: read only bits (or reserved bits).
- ‘rc’ = READ/CLEAR: readable and clearable bits.
•
•
Reading a register is done word wise by setting the SPI bit 7 to “0” (= Read Only).
Clearing a register is done word wise by setting the SPI bit 7 to “1”. No single bits can be cleared. Therefore
the content of a SPI message (bit 8..23) doesn’t matter.
•
SPI status registers are in general not cleared or changed automatically (an exception are the x bits). This
must be done by the microcontroller via SPI command.
The registers are addressed wordwise.
Table 59 Register Overview
Register Short Name
Register Long Name
Offset Address Page
Number
SPI status information registers, Device Status Registers
SUP_STAT
Supply Voltage Fail Status
Thermal Protection Status
Device Information Status
Bus Communication Status
Wake-up Source and Information Status
WK Input Level
1000000B
1000001B
1000010B
1000011B
1000100B
1000101B
1000110B
201
THERM_STAT
DEV_STAT
203
204
206
208
210
211
BUS_STAT
WK_STAT
WK_LVL_STAT
HS_OL_OC_OT_STAT
High-Side Switch Status
SPI status information registers, Status registers bridge driver
GEN_STAT
TDREG
GEN Status register
1010000B
1010001B
1010010B
213
215
217
219
Turn-on/off delay regulation register
Drain-source overvoltage HBVOUT
DSOV
EFF_TDON_OFF1
Effective MOSFET turn-on/off delay - PWM half- 1010011B
bridge 1
EFF_TDON_OFF2
EFF_TDON_OFF3
EFF_TDON_OFF4
Effective MOSFET turn-on/off delay - PWM half- 1010100B
bridge 2
220
221
222
Effective MOSFET turn-on/off delay - PWM half- 1010101B
bridge 3
Effective MOSFET turn-on/off delay - PWM half- 1010110B
bridge 4
TRISE_FALL1
TRISE_FALL2
TRISE_FALL3
MOSFET rise/fall time - PWM half-bridge 1
MOSFET rise/fall time - PWM half-bridge 2
MOSFET rise/fall time - PWM half-bridge 3
1010111B
1011000B
1011001B
223
224
225
Datasheet
199
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Table 59 Register Overview (cont’d)
Register Short Name
Register Long Name
Offset Address Page
Number
226
TRISE_FALL4
MOSFET rise/fall time - PWM half-bridge 4
1011010B
1110000B
SPI status information registers, Family and product information register
FAM_PROD_STAT
Family and Product Identification Register
227
Datasheet
200
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
13.6.1
Device Status Registers
Supply Voltage Fail Status
SUP_STAT
Supply Voltage Fail Status
(100 0000B)
Reset Value: see Table 60
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
CP_O VCC1_ HS_U HS_O VSINT VSINT
VCC1_ VCC1_ VCC1_ VCC1_
POR
RES
VS_UV VS_OV CP_UV
T
UV_FS
V
V
_UV _OV
rc rc
SC
UV
OV WARN
rc
r
rc
rc
rc
rc
rc
rc
rc
rc
rc
rc rc
Field
POR
Bits
15
Type
Description
rc
Power-On reset detection
0B NO_POR, No POR
1B POR, POR occurred
RES
14:13
12
r
Reserved, always reads as 0
CP_OT
rc
Charge pump overtemperature
0B NO_CP_OT, No charge pump OT detected
1B CP_OT, Charge pump OT detected
VCC1_UV_FS
11
rc
4th consecutive VCC1 UV-Detection
0B NO_FAILSAFE, No Fail-Safe Mode entry due to
4th consecutive VCC1_UV
1B FAILSAFE, Fail-Safe Mode entry due to 4th
consecutive VCC1_UV
HS_UV
10
9
rc
rc
rc
rc
rc
HS Supply UV-Detection
0B NO_UV, No Undervoltage
1B UV_EVENT, HS Supply Undervoltage detected
HS_OV
HS Supply OV-Detection
0B NO_OV, No Overvoltage
1B OV_EVENT, HS Supply Overvoltage detected
VSINT_UV
VSINT_OV
VS_UV
8
VSINT UV-Detection
0B NO_UV, No Undervoltage
1B UV_EVENT, VSINT Undervoltage detected
7
VSINT OV-Detection
0B NO_OV, No Overvoltage
1B OV_EVENT, VSINT Overvoltage detected
6
VS Undervoltage Detection (VS,UV)
0B NO_VS, No VS undervoltage detected
1B VS_EVENT, VS undervoltage detected (detection
is only active when VCC1 is enabled)
VS_OV
5
rc
VS Overvoltage Detection (VS,OV)
0B NO_OV, No VS overvoltage detected
1B OV_EVENT, VS overvoltage detected (detection is
only active when VCC1 is enabled)
Datasheet
201
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Field
Bits
Type
Description
CP_UV
4
rc
CP_UV
0B NO_UV, No CP undervoltage detected
1B UV_EVENT, CP undervoltage detected
VCC1_SC
3
2
1
0
rc
rc
rc
rc
VCC1 SC
0B NO_SC, No VCC1 short to GND detected
1B SC_EVENT, VCC1 short to GND
VCC1_UV
VCC1_OV
VCC1_WARN
VCC1 UV-Detection (due to Vrtx reset)
0B NO_UV, No VCC1_UV detection
1B UV_EVENT, VCC1 undervoltage detected
VCC1 Overvoltage Detection
0B NO_OV, No VCC1 overvoltage warning
1B OV_EVENT, VCC1 overvoltage detected
VCC1 Undervoltage Prewarning
0B NO_UV, No VCC1 undervoltage prewarning
1B UV_PREWARN, VCC1 undervoltage prewarning
detected
Table 60 Reset of SUP_STAT
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
y000 0000 0000 0000B
x00x xxxx xxxx xxxxB
Notes
1. The VCC1 undervoltage prewarning threshold VPW,f / VPW,r is a fixed threshold and independent of the VCC1
undervoltage reset thresholds.
2. VSINT undervoltage monitoring is not available in Stop Mode due to current consumption saving
requirements. Exception: VSINT undervoltage detection is also available in Stop Mode if the VCC1 load current
is above the active peak threshold (I_PEAK_TH) or if VCC1 is below the VCC1 prewarning threshold
(VCC1_WARN is set).
3. The MSB of the POR/Soft Reset value is marked as ‘y’: the default value of the POR bit is set after Power-on
reset (POR value = 1000 0000). However it will be cleared after a device Soft Reset command (Soft Reset value
= 0000 0000).
4. During Sleep Mode, the bits VCC1_SC, VCC1_OV and VCC1_UV will not be set when VCC1 is off.
5. The VCC1_UV bit is never updated in Restart Mode, in Init Mode it is only updated after RSTN was released, it
is always updated in Normal Mode and Stop Mode, and it is always updated in any device modes in a VCC1_SC
condition (after VCC1_UV = 1 for > 2 ms).
Datasheet
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Rev. 1.0
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TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Thermal Protection Status
THERM_STAT
Thermal Protection Status
(100 0001B)
Reset Value: see Table 61
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
TSD2_
SAFE
RES
TSD2 TSD1 TPW
rc rc rc
r
rc
Field
RES
Bits
Type
Description
Reserved, always reads as 0
15:4
3
r
TSD2_SAFE
rc
TSD2 Thermal Shut-Down Safe State Detection
0B NO_TSD2_SF, No TSD2 safe state detected
1B TSD2_SF, TSD2 safe state detected: >16
consecutive TSD2 events occurred, next TSD2
waiting time will be 64s
TSD2
TSD1
TPW
2
1
0
rc
rc
rc
TSD2 Thermal Shut-Down Detection
0B NO_TSD2, No TSD2 event
1B TSD2_EVENT, TSD2 OT detected - leading to Fail-
Safe Mode
TSD1 Thermal Shut-Down Detection
0B NO_TSD1, No TSD1 fail
1B TSD1_EVENT, TSD1 OT detected (affected
module is disabled)
Thermal Pre Warning
0B NO_TPW, No Thermal Pre warning
1B TPW, Thermal Pre warning detected
Table 61 Reset of THERM_STAT
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0000 0000 0000B
0000 0000 0000 xxxxB
Note:
Temperature warning and shutdown bits are not reset automatically, even if the temperature pre
warning or the TSD condition is not present anymore.
Datasheet
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TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Device Information Status
DEV_STAT
Device Information Status
(100 0010B)
Reset Value: see Table 62
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
CRC_S CRC_F
SW_D
EV
SPI_F FAILU
RES
DEV_STAT
RES
WD_FAIL
TAT
AIL
AIL
RE
r
r
rc
rc
r
rh
rh
rc
rc
Field
RES
Bits
Type
Description
15:10
9
r
r
Reserved, always read as 0
CRC_STAT
CRC_FAIL
DEV_STAT
CRC STAT Information
0B DISABLED, CRC disabled
1B ENABLED, CRC enabled
CRC Fail Information1)
0B NO_FAIL, No CRC Failure
8
rc
rc
1B FAIL, CRC Failure detected
7:6
Device Status before Restart Mode
00B CLEARED, Cleared (Register must be actively
cleared)
01B RESTART, Restart due to failure (WD fail, TSD2,
VCC1_UV, trial to access Sleep Mode without any
wake source activated); also after a wake from
Fail-Safe Mode
10B SLEEP, Sleep Mode
11B , reserved
RES
5
4
r
Reserved, always reads 0
SW_DEV
rh
Status of Operating Mode
0B NORMAL, Normal operation
1B SW_DEV, Software Development Mode is
enabled
WD_FAIL
3:2
rh
Number of WD-Failure Events
00B NO_FAIL, No WD Fail
01B 1x, 1x WD Fail,
10B 2x, 2x WD Fail
11B 3x, more than 3xWD Fail
SPI_FAIL
FAILURE
1
0
rc
rc
SPI Fail Information
0B NO_FAIL, No SPI fail
1B INVALID, Invalid SPI command detected
Failure detection
0B NO_FAIL, No Failure
1B FAIL, Failure occured
1) The CRC_FAIL bit will not be set in case the static CRC enabling / disabling sequence is sent (see Chapter 5.2).
Datasheet
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DC Motor System IC
Serial Peripheral Interface
Table 62 Reset of DEV_STAT
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0000 0000 0000B
0000 00xx xx0x xxxxB
Notes
1. The bits DEV_STAT show the status of the device before exiting Restart Mode. Either the device came from
regular Sleep Mode or a failure (Restart Mode or Fail-Safe Mode) occurred. Coming from Sleep Mode will also
be shown if there was a trial to enter Sleep Mode without having cleared all wake flags before.
2. The WD_FAIL bits are implemented as a counter and are the only status bits, which are cleared automatically
by the device.
3. The SPI_FAIL bit can only be cleared via SPI command.
4. The bit CRC_STAT and CRC_FAIL can be read regardless the CRC setting. The SPI read command on
DEV_STAT ignores the CRC field.
Datasheet
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TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Bus Communication Status
BUS_STAT
Bus Communication Status
(100 0011B)
Reset Value: see Table 63
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
CANT SYSER
VCAN_
UV
RES
RES
CAN_FAIL
O
R
r
r
rc
rc
rc
rc
Field
RES
Bits
Type
Description
15:7
6:5
4
r
Reserved, always reads as 0
Reserved, always reads as 0
CAN Time Out Detection
RES
r
CANTO
rc
0B NO_FAIL, Normal operation
1B TIME_OUT, CAN Time Out detected
SYSERR
3
rc
rc
SWK System Error
0B NO_FAIL, Selective Wake Mode is possible
1B FAIL, System Error detected, SWK enabling not
possible
CAN_FAIL
VCAN_UV
2:1
CAN failure status
00B NO_ERR, No error
01B CAN_TSD, CAN Thermal shutdown
10B CAN_TXD_DOM_TO, CAN_TXD_DOM: TXD
dominant time out detected
11B CAN_BUS_DOM_TO, CAN_BUS_DOM: BUS
dominant time out detected
0
rc
Under Voltage CAN Bus Supply
0B NORMAL, Normal operation
1B UNDERVOLTAGE, CAN Supply undervoltage
detected. Transmitter disabled
Table 63 Reset of BUS_STAT
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0000 0000 0000B
0000 0000 0xxx xxxxB
Notes
1. The VCAN_UV comparator is enabled if CAN Normal or CAN Receive Only Mode.
2. CANTO will be set only if CAN2 = 1 (=SWK Mode enabled). It will be set as soon as CANSIL was set and will stay
set even in CANSIL it is reset. An interrupt is issued in Stop Mode and Normal Mode as soon as CANTO is set and
the interrupt is not masked out, i.e. CANTO_MASK must be set to 1.
3. The SYSERR Flag is set in case of a configuration error and in case of an error counter overflow (n > 32)
It is only updated if SWK is enabled (CAN_2 = ‘1’). See also chapter x.
Datasheet
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DC Motor System IC
Serial Peripheral Interface
4. CANTO is set asynchronously to the INTN pulse. In order to prevent undesired clearing of CANTO and thus
possibly missing this interrupt, the bit will be prevented from clearing (i.e. cannot be cleared) until the next
falling edge of INTN.
Datasheet
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Rev. 1.0
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TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Wake-up Source and Information Status
WK_STAT
Wake-up Source and Information Status
(100 0100B)
Reset Value: see Table 64
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
CAN_ TIMER TIMER
WU 2_WU 1_WU
WK5_ WK4_ WK3_ WK2_ WK1_
RES
RES
RES
WU
WU
WU
WU
WU
r
r
rc
rc
rc
r
rc
rc
rc
rc
rc
Field
RES
Bits
Type
Description
15:11
10
r
Reserved, always reads as 0
Reserved, always reads as 0
RES
r
CAN_WU
9
rc
Wake up via CAN Bus
0B NO_WU, No Wake up
1B WU, Wake up detected
TIMER2_WU
TIMER1_WU
8
7
rc
rc
Wake up via Timer2
0B NO_WU, No Wake up
1B WU, Wake up detected
Wake up via Timer1
0B NO_WU, No Wake up
1B WU, Wake up detected
RES
6:5
4
r
Reserved, always reads as 0
WK5_WU
rc
Wake up via WK5
0B NO_WU, No Wake up
1B WU, Wake up detected
WK4_WU
WK3_WU
WK2_WU
WK1_WU
3
2
1
0
rc
rc
rc
rc
Wake up via WK4
0B NO_WU, No Wake up
1B WU, Wake up detected
Wake up via WK3
0B NO_WU, No Wake up
1B WU, Wake up detected
Wake up via WK2
0B NO_WU, No Wake up
1B WU, Wake up detected
Wake up via WK1
0B NO_WU, No Wake up
1B WU, Wake up detected
Table 64 Reset of WK_STAT
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0000 0000 0000B
0000 0xxx x000 00x0B
Datasheet
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Rev. 1.0
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TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Note:
At Fail-Safe Mode entry, the WK_STAT register is automatically cleared by the device.
Datasheet
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Rev. 1.0
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TLE9561QX
DC Motor System IC
Serial Peripheral Interface
WK Input Level
WK_LVL_STAT
WK Input Level
(100 0101B)
Reset Value: see Table 65
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
WK5_ WK4_ WK3_ WK2_ WK1_
RES
LVL
LVL
LVL
LVL
LVL
r
r
r
r
r
r
Field
RES
Bits
Type
Description
15:5
4
r
r
Reserved, always reads as 0
WK5_LVL
WK4_LVL
WK3_LVL
WK2_LVL
WK1_LVL
Status of WK5
0B LOW, Low Level (=0)
1B HIGH, High Level (=1)
3
2
1
0
r
r
r
r
Status of WK4
0B LOW, Low Level (=0)
1B HIGH, High Level (=1)
Status of WK3
0B LOW, Low Level (=0)
1B HIGH, High Level (=1)
Status of WK2
0B LOW, Low Level (=0)
1B HIGH, High Level (=1)
Status of WK1
0B LOW, Low Level (=0)
1B HIGH, High Level (=1)
Table 65 Reset of WK_LVL_STAT
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0000 0000 00x0B
0000 0000 0000 00x0B
Note:
WK_LVL_STAT is updated in Normal Mode and Stop Mode and also in Init and Restart Mode. In cyclic
sense or wake mode, the registers contain the sampled level, i.e. the registers are updated after
every sampling.
Datasheet
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Rev. 1.0
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TLE9561QX
DC Motor System IC
Serial Peripheral Interface
High-Side Switch Status
HS_OL_OC_OT_STAT
High-Side Switch Status
(100 0110B)
Reset Value: see Table 66
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
HS4_ HS3_ HS2_ HS1_
HS4_ HS3_ HS2_ HS1_
HS4_ HS3_ HS2_ HS1_
RES
RES
RES
OT
OT
OT
OT
OL
OL
OL
OL
OC
OC
OC
OC
r
rc
rc
rc
rc
r
rc
rc
rc
rc
r
rc
rc
rc
rc
Field
Bits
Type
Description
Reserved, always reads as 0
RES
15:14
13
r
HS4_OT
rc
Overtemperature Detection on HS4
0B NO_OT, No OT
1B OT, OT detected
HS3_OT
HS2_OT
HS1_OT
12
11
10
rc
rc
rc
Overtemperature Detection on HS3
0B NO_OT, No OT
1B OT, OT detected
Overtemperature Detection on HS2
0B NO_OT, No OT
1B OT, OT detected
Overtemperature Detection on HS1
0B NO_OT, No OT
1B OT, OT detected
RES
9
8
r
Reserved, always reads as 0
HS4_OL
rc
Open-Load Detection on HS4
0B NO_OL, No OL
1B OL, OL detected
HS3_OL
HS2_OL
HS1_OL
7
6
5
rc
rc
rc
Open-Load Detection on HS3
0B NO_OL, No OL
1B OL, OL detected
Open-Load Detection on HS2
0B NO_OL, No OL
1B OL, OL detected
Open-Load Detection on HS1
0B NO_OL, No OL
1B OL, OL detected
RES
4
3
r
Reserved, always reads as 0
HS4_OC
rc
Overcurrent Detection on HS4
0B NO_OC, No OC
1B OC, OC detected
HS3_OC
2
rc
Overcurrent Detection on HS3
0B NO_OC, No OC
1B OC, OC detected
Datasheet
211
Rev. 1.0
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TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Field
Bits
Type
Description
HS2_OC
1
rc
Overcurrent Detection on HS2
0B NO_OC, No OC
1B OC, OC detected
HS1_OC
0
rc
Overcurrent Detection on HS1
0B NO_OC, No OC
1B OC, OC detected
Table 66 Reset of HS_OL_OC_OT_STAT
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0000 0000 0000B
00xx xxxx xxxx xxxxB
Datasheet
212
Rev. 1.0
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TLE9561QX
DC Motor System IC
Serial Peripheral Interface
13.6.2
Status registers bridge driver
General Status register
GEN_STAT
General Status register
(101 0000B)
Reset Value: see Table 67
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
HB4V HB3V HB2V HB1V
OUT OUT OUT OUT
PWM4 PWM3 PWM2 PWM1
STAT STAT STAT STAT
RES
RES RES
r
r
r
r
r
r
r
r
r
r
r
Field
RES
Bits
Type
Description
Reserved, always reads as 0
15:10
9
r
r
HB4VOUT
HB3VOUT
HB2VOUT
HB1VOUT
Voltage level at VSH4 when HB4MODE[1:0] = 11 and
CPEN=11)
0B LOW, VSH4 = Low : VS - VSH4 > VHS4VDSTHx
1B HIGH, VSH4 = High: VS - VSH4 ≤ VHS4VDSTHx
8
7
6
r
r
r
Voltage level at VSH3 when HB3MODE[1:0] = 11 and
CPEN=11)
0B LOW, VSH3 = Low : VS - VSH3 > VHS3VDSTHx
1B HIGH, VSH3 = High: VS - VSH3 ≤ VHS3VDSTHx
Voltage level at VSH2 when HB2MODE[1:0] = 11 and
CPEN=11)
0B LOW, VSH2 = Low : VS - VSH2 > VHS2VDSTHx
1B HIGH, VSH2 = High: VS - VSH2 ≤ VHS2VDSTHx
Voltage level at VSH1 when HB1MODE[1:0] = 11 and
CPEN=11)
0B LOW, VSH1 = Low : VS - VSH1 > VHS1VDSTHx
1B HIGH, VSH1 = High: VS - VSH1 ≤ VHS1VDSTHx
RES
5
4
3
r
r
r
Reserved, always reads as 0
Reserved, always reads as 0
RES
PWM4STAT
PWM4 Status
0B LOW, PWM4 is Low
1B HIGH, PWM4 is High
PWM3STAT
PWM2STAT
PWM1STAT
2
1
0
r
r
r
PWM3 status
0B LOW, PWM3 is Low
1B HIGH, PWM3 is High
PWM2 Status
0B LOW, PWM2 is Low
1B HIGH, PWM2 is High
PWM1/CRC status
0B LOW, PWM1/CRC is Low
1B HIGH, PWM1/CRC is High
1) HBxVOUT = 0 if (CPEN=1 and HBxMODE ≠ 11) or CPEN=0.
Datasheet
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Rev. 1.0
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TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Table 67 Reset of GEN_STAT
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0000 0000 0000B
0000 0000 xx00 000xB
Datasheet
214
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Turn-on/off delay regulation register
TDREG
Turn-on/off delay regulation register
(101 0001B)
Reset Value: see Table 68
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
IPDCH IPDCH IPDCH IPDCH IPCHG IPCHG IPCHG IPCHG TDRE TDRE TDRE TDRE
RES
G4_ST G3_ST G2_ST G1_ST 4_ST 3_ST 2_ST 1_ST G4
G3
G2
G1
r
r
r
r
r
r
r
r
r
r
r
r
r
Field
RES
Bits
15:12
11
Type
Description
r
r
Reserved, always reads as 0
IPDCHG4_ST
IPDCHG3_ST
IPDCHG2_ST
IPDCHG1_ST
IPCHG4_ST
HB4 predischarge status
0B CLAMP, the predischarge current is equal to
0.5 mA typ. or ICHGMAX4 if AGC[1:0] = 10B or 11B,
and HB4_PWM_EN = 11)
1B NO_CLAMP, 0.5 mA < predischarge current <
ICHGMAX41)
10
9
r
r
r
r
HB3 predischarge status
0B CLAMP, the predischarge current is equal to
0.5 mA typ. or ICHGMAX3 if AGC[1:0] = 10B or 11B,
and HB3_PWM_EN = 11)
1B NO_CLAMP, 0.5 mA < predischarge current <
ICHGMAX31)
HB2 predischarge status
0B CLAMP, the predischarge current is equal to
0.5 mA typ. or ICHGMAX2 if AGC[1:0] = 10B or 11B,
and HB2_PWM_EN = 11)
1B NO_CLAMP, 0.5 mA < predischarge current <
ICHGMAX21)
8
HB1 predischarge status
0B CLAMP, the predischarge current is equal to the
0.5 mA typ. or ICHGMAX1 if AGC[1:0] = 10B or 11B,
and HBx_PWM_EN = 11)
1B NO_CLAMP, 0.5 mA < predischarge current <
ICHGMAX11)
7
HB4 discharge status
0B CLAMP, the discharge current is equal to 0.5 mA
typ. or ICHGMAX4 if AGC[1:0] = 10B or 11B, and
HB4_PWM_EN = 11)
1B NO_CLAMP, 0.5 mA < discharge current <
ICHGMAX41)
Datasheet
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Rev. 1.0
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TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Field
Bits
Type
Description
IPCHG3_ST
6
r
HB3 precharge status
0B CLAMP, the precharge current is equal to 0.5 mA
typ. or ICHGMAX3 if AGC[1:0] = 10B or 11B, and
HB3_PWM_EN = 11)
1B NO_CLAMP, 0.5 mA < precharge current <
ICHGMAX31)
IPCHG2_ST
IPCHG1_ST
5
4
r
r
HB2 precharge status
0B CLAMP, the precharge current is equal to 0.5 mA
typ. or ICHGMAX2 if AGC[1:0] = 10B or 11B, and
HB2_PWM_EN = 11)
1B NO_CLAMP, 0.5 mA < precharge current <
ICHGMAX21)
HB1 precharge status
0B CLAMP, the precharge current is equal to the
0.5 mA typ. or ICHGMAX1 if AGC[1:0] = 10B or 11B,
and HB1_PWM_EN = 11)
1B NO_CLAMP, 0.5 mA < precharge current <
ICHGMAX11)
TDREG4
TDREG3
TDREG2
TDREG1
3
2
1
0
r
r
r
r
HB4 Regulation of turn-on/off delay
0B NO_REG, tDON4 and tDOFF4 are not in regulation
1B REG, tDON4 and/or tDOFF4 are in regulation
HB3 Regulation of turn-on/off delay
0B NO_REG, tDON3 and tDOFF3 are not in regulation
1B REG, tDON3 and/or tDOFF3 are in regulation
HB2 Regulation of turn-on/off delay
0B NO_REG, tDON2 and tDOFF2 are not in regulation
1B REG, tDON2 and/or tDOFF2 are in regulation
HB1 Regulation of turn-on/off delay
0B NO_REG, tDON and tDOFF are not in regulation
1B REG, tDON and/or tDOFF are in regulation
1) IPCHGx_ST = 1 otherwise (PWM disabled, HB in high impedance or AGC[1:0] = 00B or 01B ).
Table 68 Reset of TDREG
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0000 0000 0000B
0000 0000 xx00 000xB
Datasheet
216
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Drain-source overvoltage status
DSOV
Drain-source overvoltage
(101 0010B)
Reset Value: see Table 69
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
VSINT
OVBR
AKE_S
T
VSOV LS4DS LS3DS LS2DS LS1DS
BRAK OV_B OV_B OV_B OV_B
LS4DS HS4D LS3DS HS3D LS2DS HS2D LS1DS HS1D
RES RES
OV
SOV
OV
SOV
OV
SOV
OV
SOV
E_ST RK
RK
RK
RK
r
r
rc
rc rc
rc
rc
rc
rc
rc
rc
rc
rc
rc
rc
rc
Field
RES
RES
Bits
Type
Description
15
14
13
r
Reserved, always reads as 0
Reserved, always reads as 0
VSINT Brake status
r
VSINTOVBRAKE_ST
rc
0B NOT_DETECT, VSINT overvoltage brake
condition is not detected
1B DETECT, VSINT overvoltage brake conditions is
detected
VSOVBRAKE_ST
12
rc
VS Brake status
0B NOT_DETECT, VS overvoltage brake conditions is
not detected
1B DETECT, VS overvoltage brake conditions is
detected
LS4DSOV_BRK
LS3DSOV_BRK
LS2DSOV_BRK
LS1DSOV_BRK
11
10
9
rc
rc
rc
rc
Drain-source overvoltage on low-side 4 during
braking
0B NO_OV, No drain-source overvoltage on LS4
1B OV, Drain-source overvoltage on LS4
Drain-source overvoltage on low-side 3 during
braking
0B NO_OV, No drain-source overvoltage on LS3
1B OV, Drain-source overvoltage on LS3
Drain-source overvoltage on low-side 2 during
braking
0B NO_OV, No drain-source overvoltage on LS2
1B OV, Drain-source overvoltage on LS2
8
Drain-source overvoltage on low-side 1 during
braking
0B NO_OV, No drain-source overvoltage on LS1
1B OV, Drain-source overvoltage on LS1
LS4DSOV
HS4DSOV
7
6
rc
rc
Drain-source overvoltage on low-side 4
0B NO_OV, No drain-source overvoltage on LS4
1B OV, Drain-source overvoltage on LS4
Drain-source overvoltage on high-side 4
0B NO_OV, No drain-source overvoltage on HS4
1B OV, Drain-source overvoltage on HS4
Datasheet
217
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Field
Bits
Type
Description
LS3DSOV
5
rc
Drain-source overvoltage on low-side 3
0B NO_OV, No drain-source overvoltage on LS3
1B OV, Drain-source overvoltage on LS3
HS3DSOV
LS2DSOV
HS2DSOV
LS1DSOV
HS1DSOV
4
3
2
1
0
rc
rc
rc
rc
rc
Drain-source overvoltage on high-side 3
0B NO_OV, No drain-source overvoltage on HS3
1B OV, Drain-source overvoltage on HS3
Drain-source overvoltage on low-side 2
0B NO_OV, No drain-source overvoltage on LS2
1B OV, Drain-source overvoltage on LS2
Drain-source overvoltage on high-side 2
0B NO_OV, No drain-source overvoltage on HS2
1B OV, Drain-source overvoltage on HS2
Drain-source overvoltage on low-side 1
0B NO_OV, No drain-source overvoltage on LS1
1B OV, Drain-source overvoltage on LS1
Drain-source overvoltage on high-side 1
0B NO_OV, No drain-source overvoltage on HS1
1B OV, Drain-source overvoltage on HS1
Table 69 Reset of DSOV
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0000 0000 0000B
00xx xxxx xxxx xxxxB
Datasheet
218
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Effective MOSFET turn.on/off delay - PWM half-bridge 1
EFF_TDON_OFF1
Effective MOSFET turn.on/off delay - HB1
(101 0011B)
Reset Value: see Table 70
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RES
TDOFF1EFF
RES
TDON1EFF
r
r
r
r
Field
RES
Bits
Type
Description
Reserved, always reads as 0
Effective active MOSFET turn-off delay HB1
15:14
13:8
r
r
TDOFF1EFF
Nominal effective tDOFF1 = 53.3 ns x TDOFF1EFF[13:8]D
RES
7:6
5:0
r
r
Reserved, always reads as 0
TDON1EFF
Effective active MOSFET turn-on delay HB1
Nominal effective tDON1 = 53.3 ns x TDON1EFF[5:0]D
Table 70 Reset of EFF_TDON_OFF1
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0000 0000 0000B
00xx xxxx 00xx xxxxB
Datasheet
219
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Effective MOSFET turn.on/off delay - PWM half-bridge 2
EFF_TDON_OFF2
Effective MOSFET turn.on/off delay - HB 2
(101 0100B)
Reset Value: see Table 71
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RES
TDOFF2EFF
RES
TDON2EFF
r
r
r
r
Field
RES
Bits
Type
Description
Reserved, always reads as 0
Effective active MOSFET turn-off delay HB2
15:14
13:8
r
r
TDOFF2EFF
Nominal effective tDOFF2 = 53.3 ns x TDOFF2EFF[13:8]D
RES
7:6
5:0
r
r
Reserved, always reads as 0
TDON2EFF
Effective active MOSFET turn-on delay HB2
Nominal effective tDON2 = 53.3 ns x TDON2EFF[5:0]D
Table 71 Reset of EFF_TDON_OFF2
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0000 0000 0000B
00xx xxxx 00xx xxxxB
Datasheet
220
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Effective MOSFET turn.on/off delay - PWM half-bridge 3
EFF_TDON_OFF3
Effective MOSFET turn.on/off delay - HB3
(101 0101B)
Reset Value: see Table 72
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RES
TDOFF3EFF
RES
TDON3EFF
r
r
r
r
Field
RES
Bits
Type
Description
Reserved, always reads as 0
Effective active MOSFET turn-off delay HB3
15:14
13:8
r
r
TDOFF3EFF
Nominal effective tDOFF3 = 53.3 ns x TDO3EFF[13:8]D
RES
7:6
5:0
r
r
Reserved, always reads as 0
TDON3EFF
Effective active MOSFET turn-on delay HB3
Nominal effective tDON3 = 53.3 ns x TDON3EFF[5:0]D
Table 72 Reset of EFF_TDON_OFF3
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0000 0000 0000B
00xx xxxx 00xx xxxxB
Datasheet
221
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Effective MOSFET turn.on/off delay - PWM half-bridge 4
EFF_TDON_OFF4
Effective MOSFET turn.on/off delay - HB4
(101 0110B)
Reset Value: see Table 73
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RES
TDOFF4EFF
RES
TDON4EFF
r
r
r
r
Field
RES
Bits
Type
Description
Reserved, always reads as 0
Effective active MOSFET turn-off delay HB4
15:14
13:8
r
r
TDOFF4EFF
Nominal effective tDOFF4 = 53.3 ns x TDOFF4EFF[13:8]D
RES
7:6
5:0
r
r
Reserved, always reads as 0
TDON4EFF
Effective active MOSFET turn-on delay HB4
Nominal effective tDON4 = 53.3 ns x TDON4EFF[5:0]D
Table 73 Reset of EFF_TDON_OFF4
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0000 0000 0000B
00xx xxxx 00xx xxxxB
Datasheet
222
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
MOSFET rise/fall time - PWM half-bridge 1
TRISE_FALL1
MOSFET rise/fall time - HB1
(101 0111B)
Reset Value: see Table 74
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RES
TFALL1
RES
TRISE1
r
r
r
r
Field
RES
Bits
Type
Description
15:14
13:8
r
r
Reserved, always reads as 0
TFALL1
Active MOSFET fall time HB1
Nominal tFALL1 = 53.3 ns x TFALL1[5:0]D
RES
7:6
5:0
r
r
Reserved, always reads as 0
TRISE1
Active MOSFET rise time HB1
Nominal tRISE1 = 53.3 ns x TRISE1[5:0]D
Table 74 Reset of TRISE_FALL1
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0000 0000 0000B
00xx xxxx 00xx xxxxB
Datasheet
223
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
MOSFET rise/fall time - PWM half-bridge 2
TRISE_FALL2
MOSFET rise/fall time - HB2
(101 1000B)
Reset Value: see Table 75
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RES
TFALL2
RES
TRISE2
r
r
r
r
Field
RES
Bits
Type
Description
15:14
13:8
r
r
Reserved, always reads as 0
TFALL2
Active MOSFET fall time HB2
Nominal tFALL2 = 53.3 ns x TFALL2[5:0]D
RES
7:6
5:0
r
r
Reserved, always reads as 0
TRISE2
Active MOSFET rise time HB2
Nominal tRISE2 = 53.3 ns x TRISE2[5:0]D
Table 75 Reset of TRISE_FALL2
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0000 0000 0000B
00xx xxxx 00xx xxxxB
Datasheet
224
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
MOSFET rise/fall time - PWM half-bridge 3
TRISE_FALL3
MOSFET rise/fall time - HB3
(101 1001B)
Reset Value: see Table 76
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RES
TFALL3
RES
TRISE3
r
r
r
r
Field
RES
Bits
Type
Description
15:14
13:8
r
r
Reserved, always reads as 0
TFALL3
Active MOSFET fall time HB3
Nominal tFALL3 = 53.3 ns x TFALL3[5:0]D
RES
7:6
5:0
r
r
Reserved, always reads as 0
TRISE3
Active MOSFET rise time HB3
Nominal tRISE3 = 53.3 ns x TRISE3[5:0]D
Table 76 Reset of TRISE_FALL3
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0000 0000 0000B
00xx xxxx 00xx xxxxB
Datasheet
225
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
MOSFET rise/fall time - PWM half-bridge 4
TRISE_FALL4
MOSFET rise/fall time - HB4
(101 1010B)
Reset Value: see Table 77
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RES
TFALL4
RES
TRISE4
r
r
r
r
Field
RES
Bits
Type
Description
15:14
13:8
r
r
Reserved, always reads as 0
TFALL4
Active MOSFET fall time HB4
Nominal tFALL4 = 53.3 ns x TFALL4[5:0]D
RES
7:6
5:0
r
r
Reserved, always reads as 0
TRISE4
Active MOSFET rise time HB4
Nominal tRISE4 = 53.3 ns x TRISE4[5:0]D
Table 77 Reset of TRISE_FALL4
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0000 0000 0000B
00xx xxxx 00xx xxxxB
Datasheet
226
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
13.6.3
Family and product information register
Family and Product Identification Register
FAM_PROD_STAT
Family and Product Identification Register (111 0000B)
Reset Value: see Table 78
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RES
FAM
PROD
r
r
r
Field
RES
Bits
Type
Description
15:11
10:7
r
r
Reserved, always reads as 0
FAM
Device Family Identifier
1000B, DC Motor System IC
PROD
6:0
r
Device Product Identifier
000 0000BTLE9562-3QX/QX, TLE9562-3QX/-3QXJ/QX
000 0001BTLE9561-3QX/QX, TLE9561-3QX/-3QXJ/QX
000 0010BTLE9563-3QX, TLE9563-3QX
000 0011BTLE9564QX, TLE9564QX,TLE9185QX
001 0000BTLE9562-3QX V33, TLE9562-3QX V33
001 0010BTLE9563-3QX V33, TLE9563-3QX V33
001 0011BTLE9564QX V33,
TLE9564QX V33,TLE9185QX V33
001 1000BTLE9560QX, TLE9560-3QX/-3QXJ
Table 78 Reset of FAM_PROD_STAT
Register Reset Type Reset Values
Reset Short Name Reset Mode
Note
POR/Soft reset
Restart
0000 0100 0000 0001B
0000 0100 0000 0001B
Datasheet
227
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
13.7
Electrical Characteristics
Table 79 Electrical Characteristics: Power Stage
VSINT = 5.5 V to 28 V, Tj = -40°C to +150°C, all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter
Symbol
Values
Typ.
Unit Note or
Test Condition
Number
Min.
Max.
SPI frequency
1)
Maximum SPI frequency
fSPI,max
–
–
6.0
MHz
V
> 3 V
P_14.7.1
CC1
SPI Interface; Logic Inputs SDI, CLK and CSN
H-input Voltage Threshold VIH
L-input Voltage Threshold VIL
Hysteresis of input Voltage VIHY
–
–
–
0.7 ×
VCC1
V
–
P_14.7.2
P_14.7.3
P_14.7.4
P_14.7.5
0.3 ×
VCC1
–
V
–
1)
–
0.12 ×
VCC1
–
V
Pull-up Resistance at pin
CSN
RICSN
20
20
–
40
40
10
80
80
–
kΩ
kΩ
pF
–
Pull-down Resistance at pin RICLK/SDI
SDI and CLK
VSDI/CLK = 0.2 × VCC1 P_14.7.6
1)
Input Capacitance at pin
CSN, SDI or CLK
CI
V
, VSDI, VCLK
=
P_14.7.7
CSN
VCC1
Logic Output SDO
H-output Voltage Level
VSDOH
VSDOL
0.8 ×
VCC1
–
–
V
IDOH = -2 mA
P_14.7.8
P_14.7.9
P_14.7.11
P_14.7.38
L-output Voltage Level
–
–
0.2 ×
VCC1
V
IDOL = 2 mA
1)
‘Tri-state Input Capacitance CSDO
–
10
–
15
pF
µA
V
, VSDI, VCLK =
CSN
VCC1
1)
Tri-state Leakage Current
ISDOLK
–10
10
V
= VCC1,
CSN
0V < VSDO< VCC1
Data Input Timing1)
Clock Period
tpCLK
tCLKH
tCLKL
160
70
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
ns
ns
ns
ns
ns
ns
ns
ns
ns
–
–
–
–
–
–
–
–
–
P_14.7.12
P_14.7.13
P_14.7.14
P_14.7.15
P_14.7.16
P_14.7.17
P_14.7.18
P_14.7.19
P_14.7.20
Clock HIGH Time
Clock LOW Time
70
Clock LOW before CSN LOW tbef
70
CSN Setup Time
CLK Setup Time
tlead
tlag
160
160
70
Clock LOW after CSN HIGH tbeh
SDI Setup Time
SDI Hold Time
tDISU
tDIHO
60
40
Datasheet
228
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Serial Peripheral Interface
Table 79 Electrical Characteristics: Power Stage (cont’d)
VSINT = 5.5 V to 28 V, Tj = -40°C to +150°C, all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter
Symbol
Values
Typ.
–
Unit Note or
Test Condition
Number
Min.
Max.
Input Signal Rise Time at pin trIN
SDI, CLK and CSN
–
20
ns
ns
µs
µs
–
P_14.7.21
P_14.7.22
P_14.7.23
P_14.7.24
Input Signal Fall Time at pin tfIN
SDI, CLK and CSN
–
–
3
–
–
–
20
5
–
3)
Delay Time for Mode
Changes2)
tDel,Mode
CSN HIGH Time
tCSN(high)
–
–
Data Output Timing1)
SDO Rise Time
trSDO
tfSDO
–
–
30
30
40
40
ns
ns
CL = 50 pF, 0.2 × VCC1 P_14.7.25
to 0.8 × VCC1
SDO Fall Time
CL = 50 pF, 0.8 × VCC1 P_14.7.26
to 0.2 × VCC1
SDO Enable Time
SDO Disable Time
SDO Valid Time
tENSDO
tDISSDO
tVASDO
–
–
–
–
–
–
40
40
40
ns
ns
ns
LOW impedance
HIGH impedance
CL = 50 pF
P_14.7.27
P_14.7.28
P_14.7.29
1) Not subject to production test; specified by design.
2) Applies to all mode changes triggered via SPI commands.
3) Guaranteed by design.
24
CSN
15
16
17
18
13
14
CLK
SDI
19
20
LSB
MSB
MSB
not defined
27
28
29
SDO
Flag
LSB
Figure 83 SPI Timing Diagram
Note:
Numbers in drawing correlate with the last 2 digits of the Number field in the Electrical
Characteristics table.
Datasheet
229
Rev. 1.0
2021-01-21
TLE9561QX
DC Motor System IC
Application Information
14
Application Information
Note:
The following information is given as a hint for the implementation of the device only and shall not
be regarded as a description or warranty of a certain functionality, condition or quality of the device.
14.1
Application Diagrams
VSHS
Drev1
VSINT
VCC1
CVCC1
L1
Trev1
VS
VBAT
Cin1
CCP
Cin5
SDI
CP
CPC1N
CPC1P
CPC2N
CPC2P
SDO
CLK
CSN
Rrev2
CCP1
Trev2
Drev3
CCP2
RSTN
INTN
RLED
CHS2
CHS1
HS1
HS2
HS3
HS4
GHx
SHx
RLED
Q1
CHS2
CHS1
RLED
CHB1x
CHB2x
CHS2
CHS1
GLx
Q2
TLE9561
Microcontroller
WK1
RWK2
to other bridges
SL
CWK1
WK2/FO
WK3
VS
Fail out
WK4/SYNC
WK5
RWK3
VBAT
CWK2
PWM1
PWM2
PWM3
PWM4
VCAN
VCC1
CVCAN
CANH
CANL
TxD_CAN
RxD_CAN
RCAN
RCAN
GND
CCAN
Figure 84 TLE9561QX Application Diagram
Note:
This is a very simplified example of an application circuit. The function must be always verified in the
real application.
Datasheet
230
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
Application Information
Table 80 Bill of Material
Ref.
Typical Value
Purpose / Comment
Capacitances
Cin1
100 nF ±20%
ceramic
Input filter battery capacitor for optimum EMC behavior
Cin2
100 µF ±20%, 50 V
Electrolytic
Buffering capacitor to cut off battery spikes, depending on the
application
Cin2b
Cin3
470 µF ±20%, 50 V
Electrolytic
Buffering capacitor for bridges. Cut off battery spikes,
depending on the application
100 nF ±20%, 50 V
Ceramic
Input capacitor
Cin4
100 nF ±20%, 50 V
Ceramic
Input capacitor
Cin5
470 µF ±20%, 50 V
Electrolytic
Buffering capacitor for bridges. Cut off battery spikes,
depending on the application
CCP
470 nF ±20%, 50 V
Ceramic
Charge-Pump buffering capacitor
CCP1/ CCP2
220 nF ±20%, 50 V
Ceramic
Charge-Pump flying capacitor to be placed as closed as possible
to the device pins, in order to minimize the length of the PCB
tracks
CCAN
4.7 nF / OEM dependent
2.2 uF ±20%, 16 V
Split termination stability
CVCC1
Blocking capacitor. Low ESR. Minimum 1 uF effective
capacitance
CVCAN
CHB1x
CHB2x
1 uF ... 4.7 uF
Input filter CAN supply. The capacitor must be placed close to
the VCAN pin. For optimum EMC and CAN FD performances, the
capacitor has to be ≥ 2.2 µF
10 nF ±20%, 50 V
Ceramic
Half-Bridge EME (electromagnetic emission) and ESD
suppression filter to be placed close to the connector. Other
capacitance values might be needed depending on application
560 pF ±20%, 50 V
Ceramic
Optional filter for EMI immunity to be placed close to the SHx pin
(PCB footprints highly recommended). Other capacitance values
might be needed depending on application
CHS1
47 pF / OEM dependent
33 nF / OEM dependent
47 nF / OEM dependent
Only required om case of off-board connection to optimize
EMC behavior, place close to pin
CHS2
As required by application, mandatory protection for off-board
connection
CWK1 / CWK2
Spike filtering, as required by application, mandatory protection
for off-board connections
Inductances
L1
4 uH ... 6 uH
Input filter for power stage - consider high current rating
(application dependent)
Datasheet
231
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
Application Information
Table 80 Bill of Material (cont’d)
Ref.
Typical Value
Purpose / Comment
Resistances
RREV1
100 kΩ ±5%
10 kΩ ±5%
10 kΩ ±5%
60 Ω / OEM dependent
1 k
Other values needed depending on application
Device protection against reverse battery
RREV2
RREV3
RCAN
CAN bus termination
Limit LED-current
RLED
RWK1 / RWK2
RWK3 / RWK4
/
10 kΩ ±5%
Active Components
DREV1
DREV2
DREV3
TREV1
TREV2
Q1 / Q2
RR268MM600
Reverse polarity protection
Gate protection. Limit VGS
BZX84C16
BAS21
IPZ40N04S5L-2R8
BC846
Reverse battery protection, N-MOS
Main power switches
IPZ40N04S5-5R4
Datasheet
232
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
Application Information
14.2
ESD Tests
14.2.1
ESD according to IEC61000-4-2
Tests for ESD robustness according to IEC61000-4-2 “GUN test” (150 pF, 330 Ω) have been performed.
The results and test condition are available in a test report. The values for the test are listed below.
Table 81 ESD “GUN test”1)2)
Performed Test
Result
Unit
Remarks
ESD at pin CANH, CANL, HSx,
VS,VSINT,VSHS, WKx
versus GND
> 6
kV
positive pulse
ESD at pin CANH, CANL, HSx,
VS,VSINT,VSHS, WKx
versus GND
< -6
kV
negative pulse
1) ESD susceptibility “ESD GUN” according to EMC 1.3 Test specification, Section 4.3 (IEC 61000-4-2). Tested by external
test house (IBEE Zwickau, EMC Test report Nr. 20.12.20).
2) ESD Test “Gun Test” is specified with external components for pins VS, VSINT, VSHS, WKx, HSx. See the application
diagram in Chapter 14.1 for more information.
14.2.2
ESD according to SAE J2962
Tests for ESD robustness according to SAE J2962 have been performed.
Table 82 ESD according to SAE J2962
Performed Test
Result
Unit
kV
Remarks
ESD at pin CANH, CANL, versus GND ± 4
ESD at pin CANH, CANL versus GND ± 8
ESD at pin CANH, CANL versus GND ± 15
Unpowered, contact discharge
Powered, contact discharge
Powered, air discharge
kV
kV
Datasheet
233
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
Application Information
14.3
Thermal Behavior of Package
Bottom view
cooling area
Detail solder
pads and vias
Top view
Figure 85 Board Setup
Board setup is defined according JESD 51-2, -5, -7.
Board: 76.2 × 114.3 × 1.5 mm3 with 2 inner copper layers (35 µm thick), with thermal via array under the
exposed pad contacting the first inner copper layer and 300 mm2 cooling area on the bottom layer (70 µm).
14.4
Further Application Information
•
The VS pin supplies the bridge driver and the charge pump, and is the sense pin for the high-side MOSFETs
drain voltage. It is therefore highly recommended to connect a 100 nF / 50V ceramic by-pass capacitor as
close as possible to the VS pin with a short PCB trace to GND.
•
•
Please contact us for information regarding the FMEA pin
For further information you may contact http://www.infineon.com/
Datasheet
234
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
Package Outlines
15
Package Outlines
0ꢀ9 MAXꢀ
(0ꢀ65)
11 x 0ꢀ5 = 5ꢀ5
0ꢀ5
0ꢀ1
7
A
0ꢀ03
6ꢀ8
0ꢀ1
+0ꢀ031)
2)
37
B
36
25
24
13
48x
0ꢀ08
48
1
12
Index Marking
48x
0ꢀ1
0ꢀ4 x 45°
0ꢀ05
Index Marking
0ꢀ23
M
A B C
(0ꢀ2)
0ꢀ05 MAXꢀ
(5ꢀ2)
(6)
C
1) Vertical burr 0ꢀ03 maxꢀ, all sides
2) These four metal areas have exposed diepad potential
PG-VQFN-48-29, -31-PO V05
Figure 86 PG-VQFN-481)
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant
with government regulations the device is available as a green product. Green products are RoHS-Compliant
(i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
Further information on packages
https://www.infineon.com/packages
1) Dimensions in mm
Datasheet
235
Rev.1.0
2021-01-21
TLE9561QX
DC Motor System IC
Revision History
16
Revision History
Revision Date
Changes
1.0
2021-01-21
First release
Datasheet
236
Rev.1.0
2021-01-21
Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
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Edition 2021-01-21
Published by
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81726 Munich, Germany
event be regarded as a guarantee of conditions or and conditions and prices, please contact the nearest
characteristics ("Beschaffenheitsgarantie").
Infineon Technologies Office (www.infineon.com).
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values stated herein and/or any information regarding
the application of the product, Infineon Technologies
hereby disclaims any and all warranties and liabilities
of any kind, including without limitation warranties of
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In addition, any information given in this document is
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application and the completeness of the product
information given in this document with respect to
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dangerous substances. For information on the types
in question please contact your nearest Infineon
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