TLS203B0EJ V50 [INFINEON]
TLS203B0EJV50 是一款微功耗、低噪声、低压差的调节器。该器件能够实现 300 mA 的输出电流,290 mV 的压差。专为电池供电系统设计,30 μA 的低静态电流使其成为理想的选择。TLS203B0EJV50 的一个关键特性是其输出噪声较低。通过添加一个外部 10 nF 的旁路电容,可以在 10 Hz 至 100 kHz 的带宽内将输出噪音值下降至 42 μVRMS。TLS203B0EJV50 电压调节器在输入电容小至 3.3 μF 时也能保持其稳定性。可以使用小型陶瓷电容,不需要其他许多调节器所需的串联电阻。内部保护电路包括反向电池保护、电流限制和反向电流保护。TLS203B0EJV50 是5.0 V 固定输出电压的型号,采用 PG-DSO-8 散热焊盘封装。;型号: | TLS203B0EJ V50 |
厂家: | Infineon |
描述: | TLS203B0EJV50 是一款微功耗、低噪声、低压差的调节器。该器件能够实现 300 mA 的输出电流,290 mV 的压差。专为电池供电系统设计,30 μA 的低静态电流使其成为理想的选择。TLS203B0EJV50 的一个关键特性是其输出噪声较低。通过添加一个外部 10 nF 的旁路电容,可以在 10 Hz 至 100 kHz 的带宽内将输出噪音值下降至 42 μVRMS。TLS203B0EJV50 电压调节器在输入电容小至 3.3 μF 时也能保持其稳定性。可以使用小型陶瓷电容,不需要其他许多调节器所需的串联电阻。内部保护电路包括反向电池保护、电流限制和反向电流保护。TLS203B0EJV50 是5.0 V 固定输出电压的型号,采用 PG-DSO-8 散热焊盘封装。 电池 调节器 |
文件: | 总25页 (文件大小:2346K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TLS203B0 V50
Linear Voltage Post Regulator
Low Dropout, Low Noise, 5V, 300mA
TLS203B0EJV50
TLS203B0LDV50
Data Sheet
Rev. 1.1, 2015-01-15
Automotive Power
Linear Voltage Post Regulator
Low Dropout, Low Noise, 5V, 300mA
TLS203B0EJV50
TLS203B0LDV50
1
Overview
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Low Noise down to 42 µVRMS (BW = 10 Hz to 100 kHz)
300 mA Current Capability
Low Quiescent Current: 30 µA
Wide Input Voltage Range up to 20 V
Internal circuitry working down to 2.3 V
2.5% Output Voltage Accuracy (over full temperature and load range)
Low Dropout Voltage: 290 mV
Very low Shutdown Current: < 1 µA
No Protection Diodes needed
Fixed Output Voltage: 5.0 V
PG-DSO-8 Exposed Pad
Stable with ≥ 3.3 µF Output Capacitor
Stable with Aluminium, Tantalum or Ceramic Output Capacitors
Reverse Polarity Protection
No Reverse Current
Overcurrent and Overtemperature Protected
PG-DSO-8 Exposed Pad and PG-TSON-10 Exposed Pad Package
Suitable for use in Automotive Electronics as Post Regulator
Green Product (RoHS compliant)
PG-TSON-10
AEC Qualified
The TLS203B0 V50 is a micropower, low noise, low dropout voltage 5 V regulator. The device is capable of
supplying an output current of 300 mA with a dropout voltage of 290 mV. Designed for use in battery-powered
systems, the low quiescent current of 30 µA makes it an ideal choice.
A key feature of the TLS203B0 V50 is its low output noise. By adding an external 10 nF bypass capacitor output
noise values down to 42 µVRMS over a 10 Hz to 100 kHz bandwidth can be reached. The TLS203B0 V50 voltage
regulator is stable with output capacitors as small as 3.3 µF. Small ceramic capacitors can be used without the
series resistance required by many other linear voltage regulators.
Internal protection circuitry includes reverse battery protection, current limiting and reverse current protection. The
TLS203B0 V50 comes as 5.0 V fixed output voltage variant and is available in a PG-DSO-8 Exposed Pad as well
as in a PG-TSON-10 Exposed Pad package.
Type
Package
Marking
203B0V50
203B0V5
TLS203B0EJV50
TLS203B0LDV50
PG-DSO-8 Exposed Pad
PG-TSON-10
Data Sheet
2
Rev. 1.1, 2015-01-15
TLS203B0EJV50
TLS203B0LDV50
Block Diagram
2
Block Diagram
Note: Pin numbers in block diagrams refer to the PG-DSO-8 Exposed Pad package type.
Saturation
Control
TLS203B0
I
8
5
1
Q
Over Current
Protection
Temperature
Protection
EN
Bias
Voltage
reference
4
BYP
Error
Amplifier
2
SENSE
6
GND
Figure 1
Block Diagram TLS203B0 V50
Data Sheet
3
Rev. 1.1, 2015-01-15
TLS203B0EJV50
TLS203B0LDV50
Pin Configuration
3
Pin Configuration
3.1
Pin Assignment
1
2
8
7
Q
I
SENSE
NC
NC
3
4
6
5
GND
EN
9
BYP
TLS203B0EJV50
Figure 2
Pin Configuration of TLS203B0EJV50 in PG-DSO-8 Exposed Pad
Q
Q
1
2
3
4
5
10
9
I
I
NC
8
NC
EN
GND
SENSE
BYP
7
11
6
TLS203B0LDV50
Figure 3
Pin Configuration of TLS203B0LDV50 in PG-TSON-10
Data Sheet
4
Rev. 1.1, 2015-01-15
TLS203B0EJV50
TLS203B0LDV50
Pin Configuration
3.2
Pin Definitions and Functions
Pin
Symbol
Function
1 (DSO-8 EP)
1,2 (TSON-10)
Q
Output. Supplies power to the load. For this pin a minimum output capacitor of
3.3 µF is required to prevent oscillations. Larger output capacitors may be
required for applications with large transient loads in order to limit peak voltage
transients or when the regulator is applied in conjunction with a bypass capacitor.
For more details please refer to “Application Information” on Page 19.
2 (DSO-8 EP)
4 (TSON-10)
SENSE
Output Sense. The SENSE pin is the input to the error amplifier. This allows to
achieve an optimized regulation performance in case of small voltage drops Rp
that occur between regulator and load. In applications where such drops are
relevant they can be eliminated by connecting the SENSE pin directly at the load.
In standard configuration the SENSE pin can be directly connected to Q. For
further details please refer to the section “Kelvin Sense Connection” on
Page 19.
3, 7 (DSO-8 EP) NC
3, 8 (TSON-10)
No Connect. The NC Pins have no connection to any internal circuitry. Connect
either to GND or leave open.
4 (DSO-8 EP)
5 (TSON-10)
BYP
Bypass. The BYP pin is used to bypass the reference of the TLS203B0 V50 to
achieve low noise performance. The BYP-pin is clamped internally to ±0.6 V (i.e.
one VBE). A small capacitor from the output Q to the BYP pin will bypass the
reference to lower the output voltage noise 1). If not used this pin must be left
unconnected.
5 (DSO-8 EP)
7 (TSON-10)
EN
Enable. With the EN pin the TLS203B0 V50 can be put into a low power shutdown
state. The output will be off when the EN is pulled low. The EN pin can be driven
either by 3.3 V or 5 V logic or as well by open-collector logic with pull-up resistor.
The pull-up resistor is required to supply the pull-up current of the open-collector
gate 2) and the EN pin current 3). Please note that if the EN pin is not used it must
be connected to VI. It must not be left floating.
6 (DSO-8 EP)
6 (TSON-10)
GND
I
Ground.
8 (DSO-8 EP)
Input. The device is supplied by the input pin I. A capacitor at the input pin is
required if the device is more than 6 inches away from the main input filter
capacitor or if a non-negligible inductance is present at the input I 4). The
TLS203B0 V50 is designed to withstand reverse voltages on the input pin I with
respect to GND and output Q. In the case of reverse input (e.g. due to a wrongly
attached battery) the device will act as if there is a diode in series with its input. In
this way there will be no reverse current flowing into the regulator and no reverse
voltage will appear at the load. Hence, the device will protect both - the device
itself and the load.
9, 10 (TSON-10)
9 (DSO-8 EP)
11 (TSON-10)
Tab
Exposed Pad. To ensure proper thermal performance, solder Pin 11 of TSON-10
to the PCB ground and tie directly to Pin 6. In the case of DSO-8 EP as well solder
Pin 9 (exposed pad) to the PCB ground and tie directly to Pin 6 (GND).
1) A maximum value of 10 nF can be used for reducing output voltage noise over the bandwidth from 10 Hz to 100 kHz.
2) Normally several microamperes.
3) Typical value is 1 µA.
4) In general the output impedance of a battery rises with frequency, so it is advisable to include a bypass capacitor in battery-
powered circuits. Depending on actual conditions an input capacitor in the range of 1 to 10 µF is sufficient.
Data Sheet
5
Rev. 1.1, 2015-01-15
TLS203B0EJV50
TLS203B0LDV50
General Product Characteristics
4
General Product Characteristics
4.1
Absolute Maximum Ratings
Table 1
Absolute Maximum Ratings 1)
Tj = -40 °C to +150 °C; all voltages with respect to ground, positive current flowing into pin (unless otherwise
specified)
Parameter
Symbol
Values
Typ.
Unit Note /
Test Condition
Number
Min.
Max.
Input Voltage
Voltage
VI
-20
–
20
V
–
P_4.1.1
Output Voltage
Voltage
VQ
-20
-20
–
–
20
20
V
V
–
–
P_4.1.2
P_4.1.3
Input to Output Differential Voltage VI - VQ
Sense Pin
Voltage
VSENSE
VBYP
VEN
-20
-0.6
-20
–
–
–
20
0.6
20
V
V
V
–
P_4.1.4
P_4.1.5
P_4.1.6
BYP Pin
Voltage
Enable Pin
Voltage
–
Temperatures
Junction Temperature
Storage Temperature
ESD Susceptibility
All Pins
Tj
-40
-55
–
–
150
150
°C
°C
–
–
P_4.1.7
P_4.1.8
Tstg
VESD
VESD
-2
-1
–
–
2
1
kV
kV
HBM 2)
CDM 3)
P_4.1.9
All Pins
P_4.1.10
1) Not subject to production testing, specified by design.
2) ESD susceptibility, HBM according to ANSI/ESDA/JEDEC JS001 (1.5 kΩ, 100 pF)
3) ESD susceptibility, Charged Device Model “CDM” according JEDEC JESD22-C101
Notes
1. Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2. Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not
designed for continuous repetitive operation.
Data Sheet
6
Rev. 1.1, 2015-01-15
TLS203B0EJV50
TLS203B0LDV50
General Product Characteristics
4.2
Functional Range
Table 2
Functional Range
Parameter
Symbol
Values
Unit Note / Test Condition Number
Min.
5.5
Typ.
Max.
20
Input Voltage Range
VI
–
–
V
–
P_4.2.1
P_4.2.2
OutputCapacitor’sRequirements CQ
3.3
–
µF
C
BYP = 0 nF 1)
for Stability
OutputCapacitor’sRequirements CQ
6.8
–
–
µF
0 nF < CBYP ≤ 10 nF 1) P_4.2.3
for Stability
2)
1)
ESR
ESR
–
–
–
3
Ω
–
–
P_4.2.4
P_4.2.5
Operating Junction Temperature Tj
1) for further details see corresponding graph.
-40
125
°C
2) CBYP = 0 nF, CQ ≥ 3.3 µF; please note that for cases where a bypass capacitor at BYP is used – depending on the actual
applied capacitance of CQ and CBYP a minimum requirement for ESR of CQ may apply.
Note:Within the functional or operating range, the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the Electrical Characteristics table.
4.3
Thermal Resistance
Note:This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go
to www.jedec.org.
Table 3
Thermal Resistance 1)
Symbol
Parameter
Values
Typ.
Unit
Note /
Test Condition
Number
Min.
Max.
TLS203B0EJV50 (PG-DSO-8 Exposed Pad)
Junction to Case
RthJC
RthJA
RthJA
RthJA
–
–
–
–
7.0
39
–
–
–
–
K/W
K/W
K/W
K/W
–
P_4.3.1
P_4.3.2
P_4.3.3
2)
Junction to Ambient
Junction to Ambient
Junction to Ambient
–
155
66
Footprint only 3)
300 mm2 heatsink P_4.3.4
area on PCB 3)
Junction to Ambient
RthJA
–
52
–
K/W
600 mm2 heatsink P_4.3.5
area on PCB 3)
TLS203B0LDV50 (PG-TSON-10)
Junction to Case
RthJC
RthJA
RthJA
RthJA
–
–
–
–
6.4
53
–
–
–
–
K/W
K/W
K/W
K/W
–
–
P_4.3.6
P_4.3.7
P_4.3.8
2)
Junction to Ambient
Junction to Ambient
183
69
Footprint only 3)
300 mm2 heatsink P_4.3.9
area on PCB 3)
Junction to Ambient
Junction to Ambient
RthJA
–
57
7
–
K/W
600 mm2 heatsink P_4.3.10
area on PCB 3)
1) Not subject to production test, specified by design.
Data Sheet
Rev. 1.1, 2015-01-15
TLS203B0EJV50
TLS203B0LDV50
General Product Characteristics
2) Specified RthJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70 µm Cu, 2 x 35 µm Cu).
Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.
3) Specified RthJA value is according to JEDEC JESD 51-3 at natural convection on FR4 1s0p board; The Product
(Chip+Package) was simulated on a 76.2 × 114.3 × 1.5 mm3 board with 1 copper layer (1 x 70 µm Cu).
Data Sheet
8
Rev. 1.1, 2015-01-15
TLS203B0EJV50
TLS203B0LDV50
Electrical Characteristics
5
Electrical Characteristics
Table 4
Electrical Characteristics
-40 °C < Tj < 125 °C; all voltages with respect to ground; positive current defined flowing out of pin; unless
otherwise specified.
Parameter
Symbol
Values
Typ.
Unit
Note / Test Condition
Number
Min.
Max.
2.3
Minimum Operating Voltage 1)
Minimum Operating Voltage
Output Voltage 2)
VI,min
VQ
–
1.8
V
V
IQ = 300 mA
P_5.0.1
P_5.0.2
Output Voltage
4.875 5.00
5.125
1mA < IQ < 300 mA ;
6 V < VI < 20 V
Line Regulation
Line Regulation
∆VQ
–
1
25
mV
ꢀVI = 5.5 V to 20 V ;
IQ = 1 mA
P_5.0.3
Load Regulation
Load Regulation
∆VQ
∆VQ
–
–
8
–
22
43
mV
mV
TJ = 25 °C ; VI = 6.0 V ;
∆IQ = 1 to 300 mA
P_5.0.4
P_5.0.5
Load Regulation
VI = 6.0 V ;
∆IQ = 1 to 300 mA
Dropout Voltage 3)
Dropout Voltage
VDR
–
130
190
mV
IQ = 10 mA ; VI = VQ,nom
TJ = 25 °C
;
;
P_5.0.6
Dropout Voltage
Dropout Voltage
VDR
VDR
–
–
–
250
220
mV
mV
IQ = 10 mA ; VI = VQ,nom
P_5.0.7
P_5.0.8
170
IQ = 50 mA ; VI = VQ,nom
TJ = 25 °C
Dropout Voltage
Dropout Voltage
VDR
VDR
–
–
–
320
240
mV
mV
IQ = 50 mA ; VI = VQ,nom
P_5.0.9
200
IQ = 100 mA ;
P_5.0.10
VI = VQ,nom ; TJ = 25 °C
Dropout Voltage
Dropout Voltage
VDR
VDR
–
–
–
340
320
mV
mV
IQ = 100 mA ; VI = VQ,nom P_5.0.11
290
IQ = 300 mA ;
P_5.0.12
VI = VQ,nom ; TJ = 25 °C
Dropout Voltage
VDR
–
–
410
mV
IQ = 300 mA ; VI = VQ,nom P_5.0.13
Quiescent Current
Quiescent Current
(Active-Mode, EN-pin high)
Iq
Iq
–
–
30
60
1
µA
µA
VI = VQ,nom
IQ = 0 mA
;
P_5.0.14
P_5.0.15
Quiescent Current
(Off-Mode, EN-pin low)
0.1
VI = 6 V ; VEN = 0 V ;
TJ = 25 °C
GND Pin Current 4)
GND Pin Current
IGND
IGND
–
–
50
100
850
µA
µA
VI = VQ,nom
IQ = 1 mA
;
P_5.0.16
P_5.0.17
GND Pin Current
Data Sheet
300
VI = VQ,nom ;
IQ = 50 mA
9
Rev. 1.1, 2015-01-15
TLS203B0EJV50
TLS203B0LDV50
Electrical Characteristics
Table 4
Electrical Characteristics (cont’d)
-40 °C < Tj < 125 °C; all voltages with respect to ground; positive current defined flowing out of pin; unless
otherwise specified.
Parameter
Symbol
Values
Typ.
0.7
Unit
Note / Test Condition
Number
Min.
Max.
GND Pin Current
GND Pin Current
IGND
IGND
–
2.2
mA
mA
VI = VQ,nom
IQ = 100 mA
VI = VQ,nom
;
P_5.0.18
P_5.0.19
–
4
12
;
IQ = 300 mA
Enable
Enable Threshold High
Enable Threshold Low
EN Pin Current 5)
Vth,EN
Vtl,EN
IEN
–
0.8
0.65
0.01
1
2.0
–
V
VQ = Off to On
VQ = On to Off
P_5.0.20
P_5.0.21
P_5.0.22
P_5.0.23
0.25
–
V
–
µA
µA
V
V
EN = 0 V ; TJ = 25 °C
EN = 20V ; TJ = 25 °C
EN Pin Current 5)
IEN
–
–
Output Voltage Noise 6)
Output Voltage Noise
eno
–
–
55
–
–
µVRMS CQ = 10 µF ;
BYP = 10 nF ;
P_5.0.24
C
IQ = 300 mA ;
BW = 10 Hz to 100 kHz
Output Voltage Noise
eno
44
µVRMS CQ = 10 µF
+250mΩ resistorinseries;
BYP = 10 nF ;
P_5.0.25
C
IQ = 300 mA ;
BW = 10 Hz to 100 kHz
Output Voltage Noise
Output Voltage Noise
eno
–
–
42
42
–
–
µVRMS CQ = 22 µF
BYP = 10 nF ;
P_5.0.26
P_5.0.27
C
IQ = 300 mA ;
BW = 10 Hz to 100 kHz
eno
µVRMS CQ = 22 µF
+250mΩ resistorinseries;
BYP = 10 nF ;
C
IQ = 300 mA ;
BW = 10 Hz to 100 kHz
Power Supply Ripple Rejection 6)
Power Supply Ripple Rejection PSRR
–
65
–
dB
VI - VQ = 1.5 V (avg) ;
P_5.0.28
V
RIPPLE = 0.5 Vpp ;
fr = 120 Hz ; IQ = 300 mA
Output Current Limitation
Output Current Limit
Output Current Limit
IQ,limit
IQ,limit
320
320
–
–
–
–
mA
mA
VI = 7 V ; VQ = 0 V
P_5.0.29
P_5.0.30
VI = VQ,nom + 1 V
∆VQ = -0.1 V
Input Reverse Leakage Current
Input Reverse Leakage
Reverse Output Current 7)
Reverse Output Current
Ileak,rev
–
–
–
1
mA
µA
VI = -20 V ; VQ = 0 V
P_5.0.31
IReverse
10
20
VQ = VQ,nom ; VI < VQ,nom ; P_5.0.32
TJ = 25 °C
Data Sheet
10
Rev. 1.1, 2015-01-15
TLS203B0EJV50
TLS203B0LDV50
Electrical Characteristics
1) This parameter defines the minimum input voltage for which the device is powered up and provides the maximum nominal
output current of 300 mA. Under this minimum input voltage condition the TLS203B0 V50 starts to be in tracking mode and
the output voltage will typically be in the range of around 1 V while providing the 300 mA.
2) The operation conditions are limited by the maximum junction temperature. The regulated output voltage specification will
only apply for conditions where the limit of the maximum junction temperature is fulfilled. It will therefore not apply for all
possible combinations of input voltage and output current. When operating at maximum input voltage, the output current
must be limited for thermal reasons. The same holds true when operating at maximum output current where the input
voltage range must be limited for thermal reasons.
3) The dropout voltage is the minimum input to output voltage differential needed to maintain regulation at a specified output
current. In dropout, the output voltage will be equal to VI - VDR
4) GND-pin current is tested with VI = VQ,nom and a current source load. This means that this parameter is tested while being
in the dropout region. The GND pin current will in most cases decrease slightly at higher input voltages - please also refer
to the corresponding typical performance graphs.
5) The EN pin current flows into EN pin.
6) Not subject to production test, specified by design.
7) Reverse output current is tested with the I pin grounded and the Q pin forced to the rated output voltage. This current flows
into the Q pin and out of the GND pin.
Note:The listed characteristics are ensured over the operating range of the integrated circuit. Typical
characteristics specified mean values expected over the production spread. If not otherwise specified,
typical characteristics apply at TA = 25 °C and the given supply voltage.
Data Sheet
11
Rev. 1.1, 2015-01-15
TLS203B0EJV50
TLS203B0LDV50
Electrical Characteristics
5.1
Typical Performance Characteristics
Dropout Voltage VDR versus
Output Current IQ
Guaranteed Dropout Voltage VDR versus
Output Current IQ
500
450
400
350
300
250
200
150
100
50
500
Δ = Guaranteed Limits
450
400
350
300
250
200
150
100
50
Tj = −40 °C
Tj = 25 °C
Tj = 125 °C
Tj ≤ 25 °C
Tj ≤ 125 °C
0
0
0
50
100
150
200
250
300
0
50
100
150
200
250
300
IQ [A]
IQ [A]
Dropout Voltage VDR versus
Junction Temperature Tj
Quiescent Current versus
Junction Temperature Tj
500
50
45
40
35
30
25
20
15
10
5
IQ = 10 mA
450
IQ = 50 mA
IQ = 100 mA
400
IQ = 300 mA
350
300
250
200
150
100
50
VI = 6 V
IQ = 0 mA .
VEN = V
I
0
0
−50
0
50
Tj [°C]
100
−50
0
50
Tj [°C]
100
Data Sheet
12
Rev. 1.1, 2015-01-15
TLS203B0EJV50
TLS203B0LDV50
Electrical Characteristics
Output Voltage VQ versus
Junction Temperature TJ
Quiescent Current Iq versus
Input Voltage VI
800
700
600
500
400
300
200
100
0
5.08
5.06
5.04
5.02
5
4.98
4.96
4.94
VQ,nom = 5.0 V
IQ,nom = 0 mA
VEN = V
I
Tj = 25 °C
4.92
IQ = 1 mA
4.9
−50
0
50
Tj [°C]
100
0
2
4
6
8
10
VI [V]
GND Pin Current IGND versus
Input Voltage VI
GND Pin Current IGND versus
Input Voltage VI
1600
8
RLoad = 5.0 kΩ / IQ = 1 mA*
RLoad = 100 Ω / IQ = 50 mA*
RLoad = 50.0 Ω / IQ = 100 mA*
RLoad = 16.7 Ω / IQ = 300 mA*
1400
1200
1000
800
600
400
200
0
7
6
5
4
3
2
1
0
[* for VQ = 5.0 V]
Tj = 25°C
[* for VQ = 5.0 V]
Tj = 25°C
0
2
4
6
8
10
0
2
4
6
8
10
VI [V]
VI [V]
Data Sheet
13
Rev. 1.1, 2015-01-15
TLS203B0EJV50
TLS203B0LDV50
Electrical Characteristics
GND Pin Current IGND versus
Output Current IQ
EN Pin Threshold (On-to-Off) versus
Junction Temperature TJ
1.2
1
5
1 mA
300 mA
VI = 6 V
Tj = 25 ° C
4.5
4
3.5
3
0.8
0.6
0.4
0.2
0
2.5
2
1.5
1
0.5
0
−50
0
50
Tj [°C]
100
0
50
100
150
200
250
300
IQ [mA]
EN Pin Threshold (Off-to-On) versus
EN Pin Input Current versus
Junction Temperature TJ
EN Pin Voltage VEN
1.2
1
1.4
1.2
1
Tj = 25 °C
VI = 20 V
1 mA
300 mA
0.8
0.6
0.4
0.2
0
0.8
0.6
0.4
0.2
0
−50
0
50
Tj [°C]
100
0
5
10
VEN [V]
15
20
Data Sheet
14
Rev. 1.1, 2015-01-15
TLS203B0EJV50
TLS203B0LDV50
Electrical Characteristics
EN Pin Current versus
Current Limit versus
Junction Temperature TJ
Input Voltage VI
1.6
1.4
1.2
1
1
VQ = 0 V
VEN = 20 V
T = 25 ° C
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
j
0.8
0.6
0.4
0.2
0
−50
0
50
Tj [°C]
100
0
1
2
3
4
5
6
7
VI [V]
Current Limit versus
Reverse Output Current versus
Junction Temperature TJ
Output Voltage VQ
1.2
1
90
VQ.nom = 5.0 V (V50)
VI = 7 V
VQ = 0 V
80
70
VI = 0 V
Tj = 25 °C
0.8
0.6
0.4
0.2
0
60
50
40
30
20
10
0
−50
0
50
Tj [°C]
100
0
2
4
6
8
10
VQ [V]
Data Sheet
15
Rev. 1.1, 2015-01-15
TLS203B0EJV50
TLS203B0LDV50
Electrical Characteristics
Reverse Output Current versus
Minimum Input Voltage 1) versus
Junction Temperature TJ
Junction Temperature TJ
22
2.5
VQ.nom = 5.0 V (V50)
20
18
2
1.5
1
VI = 0 V
16
14
12
10
8
6
0.5
0
4
IQ = 1 mA
2
IQ = 300 mA
0
−50
0
50
Tj [°C]
100
−50
0
50
Tj [°C]
100
Load Regulation versus
Junction Temperature TJ
5
V50: V = 6.0 V; VQ.nom = 5.0 V
I
0
−5
−10
−15
−20
−25
ΔILoad = 1 mA to 300 mA
−50
0
50
Tj [°C]
100
1) VI,min is referred here as the minimum input voltage for which the requested current is provided and VQ reaches 1 V.
Data Sheet
16
Rev. 1.1, 2015-01-15
TLS203B0EJV50
TLS203B0LDV50
Electrical Characteristics
ESR Stability versus
ESR(CQ) with CBYP = 10 nF versus
Output Current IQ (for CQ = 3.3 µF)
Output Capacitance CQ
3
2.5
2
101
CByp = 10 nF
measurement limit
ESRmax CByp = 0 nF
100
stable region above blue line
ESRmin CByp = 0 nF
ESRmax CByp = 10 nF
ESRmin CByp = 10 nF
1.5
1
CQ = 3.3 µF
(0.06 Ω is measurement limit)
0.5
0
10−1
0
50
100
150
200
250
300
2
3
4
5
6
7
IQ [mA]
CQ [µF]
Input Ripple Rejection PSRR versus
Input Ripple Rejection PSRR versus
Frequency f
Junction Temperature TJ
100
72
70
68
66
64
62
VI = VQnom + 1.5 V
Vripple = 0.5 Vpp
CQ = 10 µF
90
80
70
60
50
40
30
20
10
0
60
VI = VQnom + 1.5 V
Vripple = 0.5 Vpp
fripple = 120 Hz
CQ = 10 µF
58
56
54
52
IQ =300mA CBYP =0 nF
IQ =300mA CBYP =10nF
IQ =50mA CBYP =0 nF
IQ =50mA CBYP =10nF
IQ = 300mA; CBYP = 0 nF
IQ = 300mA; CBYP = 10nF
50
Tj [°C]
10
100
1k
10k
100k
−50
0
100
f [Hz]
Data Sheet
17
Rev. 1.1, 2015-01-15
TLS203B0EJV50
TLS203B0LDV50
Electrical Characteristics
Output Noise Spectral Density versus
Output Noise Spectral Density versus
Frequency f (CQ = 10 µF, IQ = 50 mA)
Frequency f (CQ = 22 µF, IQ = 50 mA)
101
101
CQ = 10 µF
IQ = 50 mA
CQ = 22 µF
IQ = 50 mA
100
100
10−1
10−1
CByp = 0 nF; ESR(CQ)=0
CByp = 10 nF; ESR(CQ)=0
CByp = 0 nF; ESR(CQ)=0
CByp = 10 nF; ESR(CQ)=0
CByp = 10 nF; ESR(CQ)=250mΩ
CByp = 10 nF; ESR(CQ)=250mΩ
10−2
101
10−2
101
102
103
f [Hz]
104
105
102
103
f [Hz]
104
105
Transient Response CBYP= 0 nF
Transient Response CBYP= 10 nF
0,3
0,15
CQ = 10 µF
CQ = 10 µF
CBYP
VI
=
=
0 nF
6V
CBYP = 10 nF
0,2
0,1
0
0,1
VI
=
6V
0,05
0
-0,1
-0,2
-0,3
-0,05
-0,1
-0,15
0
100
200
300
400
500
Time (μs)
600
700
800
900
1000
0
20
40
60
80
100
Time / [μs]
120
140
160
180
200
400
350
300
250
200
150
100
50
400
350
300
250
200
150
100
50
IQ : 100 to 300mA
IQ : 100 to 300mA
0
0
0
100
200
300
400
500
Time (μs)
600
700
800
900
1000
0
20
40
60
80
100
Time / [μs]
120
140
160
180
200
Data Sheet
18
Rev. 1.1, 2015-01-15
TLS203B0EJV50
TLS203B0LDV50
Application Information
6
Application Information
Note:The following information is given as a hint for the implementation of the device only and shall not be
regarded as a description or warranty of a certain functionality, condition or quality of the device.
TLS203B0
VI
VQ
I
Q
CI
SENSE
RLoad
CQ
CBYP
1µF
10nF
10µF
EN
BYP
GND
GND
Typical Application Circuit TLS203B0 V50
Figure 4
Note:This is a very simplified example of an application circuit. The function must be verified in the real
application. 1) 2)
The TLS203B0 V50 is a 300 mA low dropout regulator with very low quiescent current and Enable-functionality.
The device is capable of supplying 300 mA at a dropout voltage of 290 mV. Output voltage noise numbers down
to 42 µVRMS can be achieved over a 10 Hz to 100 kHz bandwidth with the addition of a 10 nF reference bypass
capacitor. The usage of a reference bypass capacitor will additionally improve transient response of the regulator,
lowering the settling time for transient load conditions. The device has a low operating quiescent current of typical
30 µA that drops to less than 1 µA in shutdown (EN-pin pulled to low level). The device also incorporates several
protection features which makes it ideal for battery-powered systems. It is protected against both reverse input
and reverse output voltages.
6.1
Kelvin Sense Connection
The SENSE pin of the TLS203B0 V50 is the input to the error amplifier. An optimum regulation will be obtained at
the point where the SENSE pin is connected to the output pin Q of the regulator. In critical applications however
small voltage drops may be caused by the resistance Rp of the PC-traces and thus may lower the resulting voltage
at the load. This effect may be eliminated by connecting the SENSE pin to the output as close as possible at the
load (see Figure 5). Please note that the voltage drop across the external PC trace will add up to the dropout
voltage of the regulator.
1) Please note that in case a non-negligible inductance at the input pin I is present, e.g. due to long cables, traces, parasitics,
etc, a bigger input capacitor CI may be required to filter its influence. As a rule of thumb if the I pin is more than six inches
away from the main input filter capacitor an input capacitor value of CI = 10 µF is recommended.
2) For specific needs a small optional resistor may be placed in series to very low ESR output capacitors CQ for enhanced
noise performance (for details please see “Bypass Capacitance and Low Noise Performance” on Page 20).
Data Sheet
19
Rev. 1.1, 2015-01-15
TLS203B0EJV50
TLS203B0LDV50
Application Information
TLS203B0
RP
I
Q
VI
CI
SENSE
RLoad
CQ
EN
BYP
GND
RP
Figure 5
Kelvin Sense Connection
6.2
Bypass Capacitance and Low Noise Performance
The TLS203B0 V50 regulator may be used in combination with a bypass capacitor connecting the output pin Q to
the BYP pin in order to minimize output voltage noise1). This capacitor will bypass the reference of the regulator,
providing a low frequency noise pole. The noise pole provided by such a bypass capacitor will lower the output
voltage noise in the considered bandwidth. Actual numbers of the output voltage noise of the TLS203B0 V50 will
- next to the bypass capacitor itself - be dependent on the capacitance of the applied output capacitor CQ and its
ESR: In case of applying a bypass capacitor of 10 nF in combination with a (low ESR) ceramic CQ of 10 µF output
voltage noise numbers will be in the range of typical 55 µVRMS. This output noise level can be reduced to typical
44 µVRMS under the same conditions by adding a small resistor of ~250 mΩ in series to the 10 µF ceramic output
capacitor acting as additional ESR. A reduction of the output voltage noise can also be achieved by increasing
capacitance of the output capacitor. For CQ = 22 µF (ceramic low ESR) the output voltage noise will be typically
around 42 µVRMS. For output capacitor values of 22 µF or bigger adding resistance in series to CQ does not further
lower output noise numbers significantly anymore. For further details please also see “Output Voltage Noise”
on Page 10,, of the Electrical Characteristics. Please note that next to reducing the output voltage noise level the
usage of a bypass capacitor has the additional benefit of improving transient response which will be also explained
in the next chapter. However one needs to take into consideration that on the other hand the regulator start-up
time is proportional to the size of the bypass capacitor and slows down to values around 15 ms when using a 10 nF
bypass capacitor in combination with a 10 µF CQ output capacitor.
6.3
Output Capacitance and Transient Response
The TLS203B0 V50 is designed to be stable with a wide range of output capacitors. The ESR of the output
capacitor is an essential parameter with regard to stability, most notably with small capacitors. A minimum output
capacitor of 3.3 µF with an ESR of 3 Ω or less is recommended to prevent oscillations. Like in general for LDO’s
the output transient response of the TLS203B0 V50 will be a function of the output capacitance. Larger values of
output capacitance decrease peak deviations and thus improve transient response for larger load current
changes. Bypass capacitors, used to decouple individual components powered by the TLS203B0 V50 will
increase the effective output capacitor value. Please note that with the usage of bypass capacitors for low noise
operation either larger values of output capacitors may be needed or a minimum ESR requirement of CQ may have
to be considered (see also typical performance graph “ESR(CQ) with CBYP = 10 nF versus Output Capacitance
1) a good quality low leakage capacitor is recommended.
Data Sheet
20
Rev. 1.1, 2015-01-15
TLS203B0EJV50
TLS203B0LDV50
Application Information
CQ” on Page 17 as example). In conjunction with the usage of a 10 nF bypass capacitor an output capacitor CQ ≥
6.8 µF is recommended. The benefit of a bypass capacitor to the transient response performance is impressive
and illustrated as one example in Figure 6 where the transient response of the TLS203B0 V50 to one and the
same load step from 100 mA to 300 mA is shown with and without a 10 nF bypass capacitor: for the given
configuration of CQ = 10 µF with no bypass capacitor the load step will settle in the range of less than 200 µs while
for CQ = 10 µF in conjunction with a 10 nF bypass capacitor the same load step will settle in the range of 20 µs.
Due to the shorter reaction time of the regulator by adding the bypass capacitor not only the settling time improves
but also output voltage deviations due to load steps are sharply reduced.
0,3
C_BYP = 0nF
C_BYP = 10nF
CQ = 10 µF
BYP = 0 vs 10nF
VI = 6 V
C
0,2
0,1
0
-0,1
-0,2
-0,3
0
100
200
300
400
500
Time (μs)
600
700
800
900
1000
Figure 6
Influence of CBYP: example of transient response to one and the same load step with and
without CBYP of 10 nF (IQ: 100 mA to 300 mA)
6.4
Protection Features
The TLS203B0 V50 regulators incorporate several protection features which make them ideal for use in battery-
powered circuits. In addition to normal protection features associated with monolithic regulators like current limiting
and thermal limiting the device is protected against reverse input voltage, reverse output voltage and reverse
voltages from output to input.
Current limit protection and thermal overload protection are intended to protect the device against current overload
conditions at the output of the device. For normal operation the junction temperature must not exceed 125 °C.
The input of the device will withstand reverse voltages of 20 V. Current flowing into the device will be limited to
less than 1 mA (typically less than 100 µA) and no negative voltage will appear at the output. The device will
protect both itself and the load. This provides protection against batteries being plugged backwards.
The output of the TLS203B0 V50 can be pulled below ground without damaging the device. If the input is left open-
circuit or grounded, the output can be pulled below ground by 20 V. Under such conditions the output of the device
by itself behaves like an open circuit with practically no current flowing out of the pin 1). In more application relevant
cases however where the output is connected to the SENSE pin there will be a small current of typically less than
100 µA present from this origin. If the input is powered by a voltage source the output will source the short circuit
current of the device and will protect itself by thermal limiting. In this case grounding the EN pin will turn off the
device and stop the output from sourcing the short-circuit current.
In circuits where a backup battery is required, several different input/output conditions can occur. The output
voltage may be held up while the input is either pulled to ground, pulled to some intermediate voltage or is left
open-circuit. Current flow back into the output will follow the curve as shown in Figure 7 below.
1) typically < 1 µA for the mentioned conditions, VQ being pulled below ground with other pins either grounded or open.
Data Sheet
21
Rev. 1.1, 2015-01-15
TLS203B0EJV50
TLS203B0LDV50
Application Information
90
80
70
60
50
40
30
20
10
0
VQ.nom = 5.0 V (V50)
VI = 0 V
Tj = 25 °C
0
2
4
6
8
10
VQ [V]
Figure 7
Reverse Output Current
Data Sheet
22
Rev. 1.1, 2015-01-15
TLS203B0EJV50
TLS203B0LDV50
Package Outlines
7
Package Outlines
0.35 x 45˚
1)
±0.1
3.9
0.1 C D 2x
+0.06
9
0.1
0.08
Seating Plane
C
C
0.64±0.25
±0.2
0.2
1.27
2)
M
±0.09
0.41
D 8x
6
M
0.2
C A-B D 8x
D
Bottom View
±0.2
3
A
1
4
8
5
1
4
8
5
B
0.1 C A-B 2x
1)
±0.1
4.9
Index Marking
1) Does not include plastic or metal protrusion of 0.15 max. per side
2) Dambar protrusion shall be maximum 0.1 mm total in excess of lead width
3) JEDEC reference MS-012 variation BA
PG-DSO-8-27-PO V01
Figure 8
PG-DSO-8 Exposed Pad package outlines
±0.1
2.58
±0.1
0.1
±0.1
±0.1
±0.1
3.3
0.36
0.53
0.05
Z
Pin 1 Marking
±0.1
0.5
Pin 1 Marking
±0.1
0.25
PG-TSON-10-2-PO V02
Z (4:1)
0.07 MIN.
Figure 9
PG-TSON-10 Package Outlines
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e
Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
For further information on alternative packages, please visit our website:
http://www.infineon.com/packages.
Dimensions in mm
Data Sheet
23
Rev. 1.1, 2015-01-15
TLS203B0EJV50
TLS203B0LDV50
Revision History
8
Revision History
Revision
Date
Changes
Data Sheet - Revision 1.1:
1.1
2015-01-15
•
PG-TSON-10 package variant added: Product Overview, Pin Configuration,
Thermal Resistance, etc - wording and description added / updated
accordingly.
•
Editorial changes.
1.0
2014-06-30
Data Sheet - Initial Release
Data Sheet
24
Rev. 1.1, 2015-01-15
Edition 2015-01-15
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2015 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
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