V23833-F0005-B101 [INFINEON]
XFP850 nm Small Form Factor Module 10 Gigabit Pluggable Transceiver Compatible with XFP MSA Rev. 3.1; XFP850纳米小尺寸模块万兆可插拔收发器兼容XFP MSA 3.1版本
| 型号： | V23833-F0005-B101 |
| 厂家： | 
Infineon |
| 描述： | XFP850 nm Small Form Factor Module 10 Gigabit Pluggable Transceiver Compatible with XFP MSA Rev. 3.1 |
| 文件： | 总26页 (文件大小：710K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Fiber Optics
XFP
V23833-F0005-B101
V23833-F0005-B102
850 nm Small Form Factor Module
10 Gigabit Pluggable Transceiver
Compatible with XFP MSA Rev. 3.1
Preliminary Data Sheet
Features
Standards
• Compatible with IEEE 802.3ae™-2002
• Compatible with Fibre Channel 10GFC Draft 3.5
• Compatible with XFP MSA Rev. 3.1
Optical
File: 2115
• IEEE Ethernet: Serial 850 nm 10GBASE-SR
• T11 Fibre Channel: Serial 850 nm
1200-M5-SN-I; 1200-M5E-SN-I; 1200-M6-SN-I
• Transmission distance
– up to 82 m1) (50 µm MMF)
– up to 300 m1) (on special MMF)
• Vertical Cavity Surface Emitting Laser at 850 nm (VCSEL)
• LC connector, multimode fiber
• Full duplex transmission mode
1)
Maximum reach as defined by IEEE. Longer reach possible depending upon link implementation.
Ordering Information
Part Number
Chassis/Signal Grounding Concept
Standard
V23833-F0005-B101
V23833-F0005-B102
Separated
Common
Multi-Protocol
Multi-Protocol
Preliminary Product Information
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V23833-F0005-B102
Applications
Monitoring and Control
• Laser safety shut off
• Supply voltage 5 V / 3.3 V
• Transmit power
• Received power RSSI
• Laser bias current
• Tx_DIS
• Mod_NR
• Mod_DeSel
• Interrupt
• Mod_ABS
• P_Down/RST
• Rx_Los
Mechanical
• Color coded beige for 850 nm
• Belly-to-belly applications
• Latching mechanism with low insertion force
Electrical
• Hot pluggable
• Power supply 5 V / 3.3 V only
• Total power consumption < 1.5 W max.
• XFI electrical interface
• Reference clock not required
• Management and control via 2-wire interface
• 30 pin connector, 0.8 mm pitch
Applications
• 10GBE, 10GFC and G.709 transmission systems for short range
• Integration on PCI card, with eventually mid-board mounting
• Belly-to-belly for high density applications
• Enterprise and campus network applications
• Storage applications
• Backplane and switch applications
• Aggregation point for lower date rate
• XFP evaluation kit V23833-F9909-Z001 available upon request
Preliminary Product Information
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V23833-F0005-B102
Pin Configuration
Pin Configuration
1
2
3
4
5
6
7
8
9
GND
30 GND
V
29 TD+
EE5
MOD_DESEL
INTERRUPT
TX_DIS
28 TD−
27 GND
26 GND
V
25 REFCLK−
24 REFCLK+
23 GND
CC5
GND
V
CC3
V
22
21 P_DOWN/RST
20
V
CC3
CC2
10 SCL
11 SDA
V
CC2
12 MOD_ABS
13 MOD_NR
14 RX_LOS
15 GND
19 GND
18 RD+
17 RD−
16 GND
Bottom of Board
(As viewed through top of board)
Top of Board
File: 2304
Figure 1
XFP Transceiver Electrical Pad Layout
Preliminary Product Information
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Pin Configuration
Connector Pin Assignments
Pin No. Signal Name
Pin No. Signal Name
1
GND
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
GND
TD+
TD–
2
VEE5
3
MOD_DESEL
INTERRUPT
TX_DIS
VCC5
4
GND
GND
5
6
REFCLK–
REFCLK+
GND
7
GND
8
VCC3
9
VCC3
VCC2
10
11
12
13
14
15
SCL
P_DOWN
VCC2
SDA
MOD_ABS
MOD_NR
RX_LOS
GND
GND
RD+
RD–
GND
Preliminary Product Information
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Pin Configuration
Pin Description
Signal Name
Level
I/O
Pin No.
Description
Management and Monitoring Ports
MOD_DESEL LVTTL
I
3
Module De-select: when “L” allows
the module to respond to 2-wire
serial interface command. “H”active
INTERRUPT
TX_DIS
LVTTL
O
4
Interrupt: indicates presence of an
important condition which can be
read on the 2-wire serial interface.
“H” active
LVTTL
I
5
Transmitter Disable: transmitter
laser source is turned off. “H” active
SCL
LVTTL
LVTTL
LVTTL
I
10
11
12
2-wire Interface Clock
2-wire Interface Data
SDA
I
MOD_ABS
O
Module Absent: indicating the
modules not present. “H” active
MOD_NR
LVTTL
O
13
Module not ready: module
operational fault
RX_LOS
LVTTL
LVTTL
O
I
14
21
Receiver Loss Of Signal Indicator
P_DOWN
Power Saving Mode: places the
module in the stand-by condition.
Active “H”. During the falling edge
set the module reset
Transmit Functions
TD–
TD+
CML
CML
I
I
28
29
Transmitter Inverted Data Input
Transmitter Not-inverted Data Input
Receive Functions
RD–
CML
O
O
I
17
18
24
Receiver Data Output Inverted
RD+
CML
Receiver Data Output Not-inverted
REFCLK+
PECL
Reference Clock Not-inverted
Input1)
REFCLK–
PECL
I
25
Reference Clock Inverted Input1)
Preliminary Product Information
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Pin Configuration
Pin Description (cont’d)
Signal Name
DC Power
GND
Level
I/O
Pin No.
Description
0 V
–
1,7,15,16,19, Ground connection for both signal
23,26,27,30
and chassis on the module
VCC5
VCC3
+5 V
I
I
I
6
Positive power supply, nominal
Positive power supply, nominal
Positive power supply, nominal
+3.3 V
+1.8 V
8,9
20,22
VCC2
1)
Reference clock not required. Input internally terminated 50 Ω to ground.
Preliminary Product Information
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Description
Description
System Block Diagram
XFP Module
Connector
RX
CDR
D
A
C´
B´
C
B
ASIC/SerDes
TX
CDR
Host Board
File: 2306
Figure 2
Optical Interface Standard Specifications
• IEEE 802.3ae™-2002 clause 52, 10GBASE-SR
• Fibre Channel 10GFC Draft 3.5, 1200-M5-SN-I
• Fibre Channel 10GFC Draft 3.5, 1200-M5E-SN-I
• Fibre Channel 10GFC Draft 3.5, 1200-M6-SN-I
• XFP MSA Rev. 3.1
Standard
Fiber Type
Minimum Modal Bandwidth Operating Range1)
at 850 nm (MHz*km)
62.5 µm MMF 160
50 µm MMF 400
Fibre Channel 62.5 µm MMF 200
(meters)
IEEE
2 to 26
2 to 66
0.5 to 33
0.5 to 82
0.5 to 300
50 µm MMF
50 µm MMF
500
2000
1)
Longer reaches possible depending upon link implementation.
Preliminary Product Information
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Description
Electrical Interface Standard Specifications
• IEEE 802.3ae™-2002 clause 45 & 47
• XFP MSA Rev. 3.1
Environment: Thermal Management Recommendations
Operating air inlet temperature:
Operating Airflow:
0°C - 50°C
200 LFM (1.5 m/s)
Operating Humidity:
80% RH non-condensing
Maximum operating case temperature is 70°C as defined by UL 1950.
Module can withstand and operate within specification with case temperature of 75°C for
up to 96 hrs/yr. Transceiver requires airflow parallel to cooling fins. Maximum airflow
required per XFP MSA is 3 m/s.
Fibers and Connectors
The transceiver LC features a duplex receptacle and is designed for multimode LC
cables, 0° polished end face (PC).
30-pin Connector
The module interface connector is a 30-pin, printed circuit board edge connection with a
0.8 mm pitch. The appropriate mating connector for the customer PCB is a 30-pin SMT,
dual row, right angled, edge connector, 0.8 mm pitch (TycoAmp part number 788862C
or equivalent).
Cage/Heatsink Requirement
The cage/heatsink assembly required to mount the XFP module is defined by the MSA.
Preliminary Product Information
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Description
Regulatory Compliance
Feature
Standard
Comments
ESD:
EIA/JESD22-A114-B
Class 1a (> 500 V)
Electrostatic Discharge (MIL-STD 883D
to the Electrical Pins
(HBM)
Method 3015.7)
Immunity:
EN 61000-4-2
IEC 61000-4-2
Discharges ranging from ±2 kV to
±25 kV to the front end / faceplate /
receptacle cause no damage to
module (under recommended
conditions).
Against Electrostatic
Discharge (ESD) to the
Module Receptacle
Immunity:
Against Radio
Frequency
EN 61000-4-3
IEC 61000-4-3
With a field strength of 30 V/m,
noise frequency ranges from
10 MHz to 2 GHz. No effect on
module performance between the
specification limits.
Electromagnetic Field
Emission:
Electromagnetic
Interference (EMI)
FCC 47 CFR
Noise frequency range:
30 MHz to 40 GHz
Radiated emission does not exceed
specified limits.
Part 15, Class B
EN 55022 Class B
CISPR 22
Preliminary Product Information
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Technical Data
Technical Data
Absolute Maximum Ratings
Parameter
Symbol
Limit Values
Unit
min.
max.
85
50
80
6
Storage Ambient Temperature1)
Operating Ambient Temperature1) 2)
Operating Case Temperature1)
Supply Voltage +5.0 V
TS
–20
°C
°C
°C
V
TA
0
TC
0
V5
0
Supply Voltage +3.3 V
V3
0
4
V
Static Discharge Voltage, All Pins
Average Receive Optical Power
STd
RxP max
–500
500
1.5
V
dBm
1)
Non condensing.
2)
With specified airflow (see “Environment: Thermal Management Recommendations”).
Exceeding any one of these values may permanently destroy the device.
Recommended Operating Conditions
Parameter
Symbol
Values
typ.
Unit
min.
max.
Operating Case Temperature1) TC
0
70
°C
W
Transceiver Total Power
Consumption
1.25
P
Supply Voltage +5.0 V
Supply Current +5.0 V
Supply Voltage +3.3 V
VCC5
ICC5
VCC3
ICC3
4.75
3.14
5.0
50
5.25
3.47
V
mA
V
3.3
300
Supply Current +3.3 V
mA
1)
Worst case thermal location (see Figure 15).
Preliminary Product Information
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Technical Data
Optical Characteristics
(VCC5 = 4.75 V to 5.25 V, VCC3 = 3.14 V to 3.47 V, TC = 0°C to 70°C)
Parameter
Symbol
Values
Unit
min.
typ.
max.
Transmitter
Launch Power in OMA1)
Average Launch Power
Center Wavelength Range1)
RMS Spectral Width1)
Extinction Ratio
PO-OMA
PO-Avg
λC-Tx
σI
–2.8
–3
dBm
dBm
nm
–2
–1
840
850
0.4
5.5
860
0.45
nm
ER
3
dB
Relative Intensity Noise12OMA RIN
Eye Mask Definition
–128
dB/Hz
According to IEEE and Fibre Channel
3.9
Transmitter and Dispersion
Penalty
TDP
dB
Encircled Flux
EF
at 19 µm ≥ 86%, at 4.5 µm ≤ 30%
Optical Return Loss Tolerance ORLT
12
dB
Average Launch Power of OFF PO-OFF
–30
dBm
Transmitter
Receiver
Stressed Receiver Sensitivity in PIN-S
–7.5
dBm
OMA
Sensitivity in OMA2)
PIN
–11.1
dBm
dBm
dBm
dBm
dB
Average Receive Power
Signal Detect Deassert Level
Signal Detect Assert Level
Signal Detect Hysteresis
Receiver Reflectance
PIN-max
PSDL
PSD
–1
–30
–20
2
–13
4
PSD
1
REFRx
λC-Rx
–12
860
dB
Center Wavelength Range
840
nm
1)
Conforms to IEEE triple trade off between center wavelength, RMS spectral width and minimum OMA.
Receiver sensitivity, which is defined for an ideal input signal is informative only.
2)
Preliminary Product Information
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Technical Data
Electrical DC Characteristics
(VCC5 = 4.75 V to 5.25 V, VCC3 = 3.14 V to 3.47 V, TC = 0°C to 70°C)
Parameter
Symbol
Values
Unit
min.
typ.
max.
3.3 V CMOS I/O DC Characteristics
(Management, Logic and Monitoring Ports)
External Pull-up Resistor for
Open Drain
Rpullup
10
22
kΩ
Output High Voltage1)
Output Low Voltage1)
Input High Voltage
Input Low Voltage
Voh
Vol
Vih
Vil
2.4
3.5
0.4
2
V
V
V
0
0.8
10
V
Input Pull-up Current2)
Ipd
–10
0
µA
LVPECL I/O Characteristics
(REFCLK+/–)
Differential Input Voltage
(pk-pk)3)
Vin_diff
400
2000
mV
p-p
XFI I/O DC Characteristics
(TD+/–; RD+/–)
Differential Input Amplitude
(pk-pk)4)
TD+/–
RD+/–
240
680
1640
1700
mV
p-p diff
Differential Output Amplitude
mV
p-p diff
(pk-pk)5)
1)
R
pull-up = 10 kΩ to 3.3 V.
2)
3)
4)
5)
Vin = 3.3 V.
AC coupled in transceiver.
AC coupled input at host board.
AC coupled output at host board.
Preliminary Product Information
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Technical Data
Electrical AC Characteristics
(VCC5 = 4.75 V to 5.25 V, VCC3 = 3.14 V to 3.47 V, TC = 0°C to 70°C)
Parameter
Symbol
Values
typ.
Unit
min.
max.
XFI Input AC Characteristics
(TD+/–)
Baud Rate
TD+/–
TDtol
ZIN
9.95
–500
80
10.3125 10.75
500
Gbit/s
ppm
Ω
Baud Rate Tolerance
Differential Input Impedance
Differential Return Loss1)
Input Differential Skew2)
Total Jitter3)
100
120
|S11|
8
dB
TSKEWIN
TJTD
TJTD
t.b.d.
ps
0.61
0.2
UI pp
UI pp
Deterministic Jitter3)
XFI Output AC Characteristics
(RD+/–)
Baud Rate
RD+/–
RDtol
9.95
–100
24
10.3125 10.75
100
Gbit/s
ppm
ps
Baud Rate Tolerance
Rise and Fall Times4)
Output Differential Skew
tr, tf
TSKEWOUT
t.b.d.
ps
Output Differential Impedance ZOUT
Differential Output Return Loss1) |S22|
80
8
100
120
Ω
dB
UI
Total Jitter5)
TJRD
DJRD
0.34
0.18
Deterministic Jitter5)
UI
Preliminary Product Information
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Technical Data
Electrical AC Characteristics (cont’d)
(VCC5 = 4.75 V to 5.25 V, VCC3 = 3.14 V to 3.47 V, TC = 0°C to 70°C)
Parameter
Symbol
Values
typ.
Unit
min.
max.
3.3 V CMOS I/O AC Characteristics for I2C Signals
(SDA; SCL)
SCL Clock Frequency
SCL Period Low
fSCL
tLOW
tHIGH
tBUF
0
400
kHz
µs
µs
µs
µs
µs
µs
µs
ns
ns
1.3
0.6
1.3
SCL Period High
Bus Free Time6)
Start Condition Setup Time
Stop Condition Setup Time
Start Condition Hold Time
Data Hold Time
tSU_START 0.6
tSU_STOP 0.6
tH_START
tH_DATA
tSU_DATA
tr, tf
0.6
0
Data Setup Time
100
SDA and SCL Rise and Fall
300
Time
1)
100 MHz - 5.5 GHz above 5.5 GHz see XFP MSA 3.1.
Not defined at crossing point.
Per XFP MSA 3.1 table 17, 1 UI = 96.97 ps.
20%, 80%.
Per XFP MSA 3.1 table 19, 1 UI = 96.97 ps.
Between stop and start condition.
2)
3)
4)
5)
6)
Preliminary Product Information
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Technical Data
Timing Parameters for XFP Management
Parameter
Symbol
Values
max.
Unit
min.
TX_DIS Assert Time1)
TX_DIS Negate Time2)
Time to Initialize3)
INTERRUPT Assert Delay4)
INTERRUPT Negate Delay5)
P_DOWN/RST Assert Delay6)
MOD_NR Assert Delay7)
MOD_NR Negate Delay8)
P_DOWN Reset Time9)
RX_LOS Assert Delay10)
t_off
10
2
µs
t_on
ms
ms
ms
µs
t_init
300
200
500
100
1
Interrupt_on
Interrupt_off
P_Down/RST_on
Mod_nr_on
Mod_nr_off
µs
ms
ms
µs
1
10
t_loss_on
t_loss_off
100
100
µs
RX_LOS Negate Delay11)
µs
1)
Rising edge of TX_DIS to fall of output signal below 10% of nominal.
2)
Falling edge of TX_DIS to rise of output signal above 90% of nominal.
From power on or hot plug after supply or from falling edge of P_DOWN/RST.
From occurrence of the condition triggering INTERRUPT.
From clear on read INTERRUPT flags.
3)
4)
5)
6)
From power down initiation.
7)
From occurrence of fault to assertion of MOD_NR.
From clearance of signal to negation of MOD_NR.
Min. length of P_DOWN assert to initiate reset.
From occurrence of loss of signal to assertion of RX_LOS.
From occurrence of presence of signal to negation of RX_LOS.
8)
9)
10)
11)
Preliminary Product Information
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Eye Safety
Eye Safety
This laser based multimode transceiver is a Class 1M product. It complies with IEC
60825-1/A2: 2001 and FDA performance standards for laser products (21 CFR 1040.10
and 1040.11) except for deviations pursuant to Laser Notice 50, dated July 26, 2001.
INVISIBLE LASER RADIATION
CLASS 1M LASER PRODUCT
DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS
To meet laser safety requirements the transceiver shall be operated within the Absolute
Maximum Ratings.
Note: All adjustments have been made at the factory prior to shipment of the devices.
No maintenance or alteration to the device is required.
Tampering with or modifying the performance of the device will result in voided
product warranty.
Failure to adhere to the above restrictions could result in a modification that is
considered an act of “manufacturing”, and will require, under law, recertification of
the modified product with the U.S. Food and Drug Administration (ref. 21 CFR
1040.10 (i)).
Laser Emission Data
Wavelength
850 nm
Maximum total output power
743 µW / –1.3 dBm
(as defined by IEC: 7 mm aperture at 100 mm distance)
Beam divergence (full angle) / NA (half angle)
20° / 0.18 rad
FDA
IEC
Complies with 21 CFR
1040.10 and 1040.11
Class 1M Laser Product
File: 2412
Figure 3
Required Labels
Laser
Emission
Tx
Top view
Rx
File: 1333
Figure 4
Laser Emission
Preliminary Product Information
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Application Notes
Application Notes
Host Board Layouts
File: 2508
Dimensions in mm
Figure 5
XFP Host Board Mechanical Layout
Detail Z see Figure 6.
Preliminary Product Information
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Application Notes
Dimensions in mm
File: 2509
Figure 6
XFP Host Board Mechanical Layout, Detail Z
Preliminary Product Information
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Application Notes
File: 2510
Dimensions in mm
Figure 7
Recommended Single Sided Bezel Design
File: 2511
Dimensions in mm
Figure 8
Recommended Double Sided Mounting Bezel Design
Preliminary Product Information
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Application Notes
Mechanical
File: 2512
Figure 9
PCI Card Application
Preliminary Product Information
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Application Notes
File: 2513
Dimensions in mm
Figure 10
XFP Transceiver Connector Illustration
Preliminary Product Information
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Application Notes
Top View
GND
15
14
13
12
11
10
9
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
GND
RD−
RD+
GND
RX_LOS
MOD_NR
MOD_ABS
SDA
V
CC2
SCL
P_DOWN/RST
V
V
CC3
CC3
V
CC2
8
Toward
ASIC
Toward
Bezel
GND
GND
7
REFCLK+
REFCLK−
GND
V
6
CC5
TX_DIS
5
INTERRUPT
MOD_DESEL
4
GND
TD−
TD+
GND
3
V
2
EE5
GND
1
File: 2514
Figure 11
Host PCB XFP Pinout
Preliminary Product Information
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Application Notes
Host Board
Host +5 V
0.1 µF
4.7 µH
22 µF
V
CC5
CC3
CC2
1)
xx µF
0.1 µF
Host +3.3 V
0.1 µF
4.7 µH
22 µF
4.7 µH
22 µF
V
1)
xx µF
XFP Module
0.1 µF
V
Host +1.8 V
0.1 µF
1)
xx µF
0.1 µF
1) Design criterion of the capacitor used is the resonant frequency and its value must
be in the order of the nominal data rate. Use of single layer capacitors recommended.
Short trace lengths are mandatory.
File: 2305
Figure 12
Recommended Host Board Supply Filtering Network
Preliminary Product Information
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Package Outlines
Package Outlines
Dimensions in mm
File: 2206
Figure 13
Mechanical Dimensions
Revision code
Laser class
Description
Part number
Country of origin
WW: week of production
nnnnnnnn: serial number
Optional marking
(MS/ES)
Dimensions in mm
File: 2402
Figure 14
Label Description
Preliminary Product Information
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Package Outlines
Dimensions in mm
File: 2207
Figure 15
XFP Temperature Reference Point
Preliminary Product Information
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Revision History:
2004-06-16
DS0
Previous Version:
none
Page
Subjects (major changes since last revision)
Edition 2004-06-16
Published by Infineon Technologies AG,
St.-Martin-Strasse 53,
81669 München, Germany
© Infineon Technologies AG 2004.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as a guarantee of
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
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