XC2264 [INFINEON]
16/32-Bit Single-Chip Microcontroller with 32-Bit Performance; 16位/ 32位单芯片微控制器与32位性能
| 型号： | XC2264 |
| 厂家： | 
Infineon |
| 描述： | 16/32-Bit Single-Chip Microcontroller with 32-Bit Performance |
| 文件： | 总116页 (文件大小：1519K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Data Sheet, V2.1, Aug. 2008
XC226x
16/32-Bit Single-Chip Microcontroller with
32-Bit Performance
Microcontrollers
Edition 2008-08
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2008.
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values
stated herein and/or any information regarding the application of the device, Infineon Technologies hereby
disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-
infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
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and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
Data Sheet, V2.1, Aug. 2008
XC226x
16/32-Bit Single-Chip Microcontroller with
32-Bit Performance
Microcontrollers
XC2267 / XC2264
XC2000 Family Derivatives
XC226x
Revision History: V2.1, 2008-08
Previous Version(s):
V2.0, 2008-03, Preliminary
V0.1, 2007-02, Preliminary
Page
several
7
Subjects (major changes since last revision)
Maximum frequency changed to 80 MHz
Specification of 8 ADC0 channels corrected
Missing ADC0 channels added
13f
28
Voltage domain for XTAL1/XTAL2 corrected to M
Coupling factors corrected
69
74, 76
75, 77
83
Improved leakage parameters
Pin leakage formula corrected
Improved ADC error values
96f
Improved definition of external clock parameters
JTAG clock speed corrected
109
We Listen to Your Comments
Any information within this document that you feel is wrong, unclear or missing at all?
Your feedback will help us to continuously improve the quality of this document.
Please send your proposal (including a reference to this document) to:
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Data Sheet
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
1
Summary of Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2
General Device Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1
Pin Configuration and Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3
3.1
3.2
3.3
3.4
3.5
3.6
3.7
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Memory Subsystem and Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
External Bus Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Central Processing Unit (CPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Interrupt System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
On-Chip Debug Support (OCDS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Capture/Compare Unit (CAPCOM2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Capture/Compare Units CCU6x . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
General Purpose Timer (GPT12E) Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Real Time Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
A/D Converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Universal Serial Interface Channel Modules (USIC) . . . . . . . . . . . . . . . . . 57
MultiCAN Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Clock Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Parallel Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Instruction Set Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
3.8
3.9
3.10
3.11
3.12
3.13
3.14
3.15
3.16
3.17
4
4.1
4.2
4.2.1
4.2.2
4.2.3
4.3
4.4
4.5
Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
DC Parameters for Upper Voltage Area . . . . . . . . . . . . . . . . . . . . . . . . 74
DC Parameters for Lower Voltage Area . . . . . . . . . . . . . . . . . . . . . . . . 76
Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Analog/Digital Converter Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
System Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Flash Memory Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Testing Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Definition of Internal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
External Clock Input Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
External Bus Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Synchronous Serial Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 106
JTAG Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
4.6
4.6.1
4.6.2
4.6.3
4.6.4
4.6.5
4.6.6
5
5.1
5.2
Package and Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
Thermal Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
Data Sheet
3
V2.1, 2008-08
16/32-Bit Single-Chip Microcontroller with 32-Bit
Performance
XC226x
XC2000 Family
1
Summary of Features
For a quick overview and easy reference, the features of the XC226x are summarized
here.
•
High-performance CPU with five-stage pipeline
– 12.5 ns instruction cycle at 80 MHz CPU clock (single-cycle execution)
– One-cycle 32-bit addition and subtraction with 40-bit result
– One-cycle multiplication (16 × 16 bit)
– Background division (32 / 16 bit) in 21 cycles
– One-cycle multiply-and-accumulate (MAC) instructions
– Enhanced Boolean bit manipulation facilities
– Zero-cycle jump execution
– Additional instructions to support HLL and operating systems
– Register-based design with multiple variable register banks
– Fast context switching support with two additional local register banks
– 16 Mbytes total linear address space for code and data
– 1024 Bytes on-chip special function register area (C166 Family compatible)
Interrupt system with 16 priority levels for up to 87 sources
– Selectable external inputs for interrupt generation and wake-up
– Fastest sample-rate 12.5 ns
•
•
•
•
Eight-channel interrupt-driven single-cycle data transfer with
Peripheral Event Controller (PEC), 24-bit pointers cover total address space
Clock generation from internal or external clock sources,
using on-chip PLL or prescaler
On-chip memory modules
– 1 Kbyte on-chip stand-by RAM (SBRAM)
– 2 Kbytes on-chip dual-port RAM (DPRAM)
– 16 Kbytes on-chip data SRAM (DSRAM)
– Up to 64 Kbytes on-chip program/data SRAM (PSRAM)
– Up to 768 Kbytes on-chip program memory (Flash memory)
On-Chip Peripheral Modules
•
– Two Synchronizable A/D Converters with up to 16 channels, 10-bit resolution,
conversion time below 1 µs, optional data preprocessing (data reduction, range
check)
– 16-channel general purpose capture/compare unit (CAPCOM2)
– Up to four capture/compare units for flexible PWM signal generation (CCU6x)
– Multi-functional general purpose timer unit with 5 timers
Data Sheet
4
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Summary of Features
– Up to 6 serial interface channels to be used as UART, LIN, high-speed
synchronous channel (SPI/QSPI), IIC bus interface (10-bit addressing, 400 kbit/s),
IIS interface
– On-chip MultiCAN interface (Rev. 2.0B active) with up to 128 message objects
(Full CAN/Basic CAN) on up to 5 CAN nodes and gateway functionality
– On-chip real time clock
•
Up to 12 Mbytes external address space for code and data
– Programmable external bus characteristics for different address ranges
– Multiplexed or demultiplexed external address/data buses
– Selectable address bus width
– 16-bit or 8-bit data bus width
– Four programmable chip-select signals
•
•
•
•
•
•
Single power supply from 3.0 V to 5.5 V
Power reduction modes with flexible power management
Programmable watchdog timer and oscillator watchdog
Up to 75 general purpose I/O lines
On-chip bootstrap loaders
Supported by a full range of development tools including C compilers, macro-
assembler packages, emulators, evaluation boards, HLL debuggers, simulators,
logic analyzer disassemblers, programming boards
On-chip debug support via JTAG interface
•
•
100-pin Green LQFP package, 0.5 mm (19.7 mil) pitch
Ordering Information
The ordering code for an Infineon microcontroller provides an exact reference to a
specific product. This ordering code identifies:
•
•
the derivative itself, i.e. its function set, the temperature range, and the supply voltage
the package and the type of delivery.
For ordering codes for the XC226x please contact your sales representative or local
distributor.
This document describes several derivatives of the XC226x group. Table 1 lists these
derivatives and summarizes the differences. As this document refers to all of these
derivatives, some descriptions may not apply to a specific product.
For simplicity the term XC226x is used for all derivatives throughout this document.
Data Sheet
5
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Summary of Features
Table 1
XC226x Derivative Synopsis
Derivative1)
Temp.
Range
Program
Memory2)
PSRAM3) CCU6 ADC4) Interfaces4)
Mod. Chan.
SAK-XC2267-
96FxxL
-40 °C to 768Kbytes 64 Kbytes 0, 1,
125 °C Flash 2, 3
-40 °C to 768Kbytes 64 Kbytes 0, 1,
85 °C Flash 2, 3
-40 °C to 576Kbytes 32 Kbytes 0, 1,
125 °C Flash 2, 3
-40 °C to 576Kbytes 32 Kbytes 0, 1,
85 °C Flash 2, 3
-40 °C to 448Kbytes 16 Kbytes 0, 1,
125 °C Flash 2, 3
-40 °C to 448Kbytes 16 Kbytes 0, 1,
85 °C Flash 2, 3
-40 °C to 768Kbytes 64 Kbytes 0, 1
125 °C Flash
-40 °C to 768Kbytes 64 Kbytes 0, 1
85 °C Flash
-40 °C to 576Kbytes 32 Kbytes 0, 1
125 °C Flash
-40 °C to 576Kbytes 32 Kbytes 0, 1
85 °C Flash
-40 °C to 448Kbytes 16 Kbytes 0, 1
125 °C Flash
-40 °C to 448Kbytes 16 Kbytes 0, 1
85 °C Flash
11 + 5 5 CAN Nodes,
6 Serial Chan.
SAF-XC2267-
96FxxL
11 + 5 5 CAN Nodes,
6 Serial Chan.
SAK-XC2267-
72FxxL
11 + 5 5 CAN Nodes,
6 Serial Chan.
SAF-XC2267-
72FxxL
11 + 5 5 CAN Nodes,
6 Serial Chan.
SAK-XC2267-
56FxxL
11 + 5 5 CAN Nodes,
6 Serial Chan.
SAF-XC2267-
56FxxL
11 + 5 5 CAN Nodes,
6 Serial Chan.
SAK-XC2264-
96FxxL
8
8
8
8
8
8
2 CAN Nodes,
4 Serial Chan.
SAF-XC2264-
96FxxL
2 CAN Nodes,
4 Serial Chan.
SAK-XC2264-
72FxxL
2 CAN Nodes,
4 Serial Chan.
SAF-XC2264-
72FxxL
2 CAN Nodes,
4 Serial Chan.
SAK-XC2264-
56FxxL
2 CAN Nodes,
4 Serial Chan.
SAF-XC2264-
56FxxL
2 CAN Nodes,
4 Serial Chan.
1) This Data Sheet is valid for devices starting with and including design step AC.
2) Specific inormation about the on-chip Flash memory in Table 2.
3) All derivatives additionally provide 1 Kbyte SBRAM, 2 Kbytes DPRAM, and 16 Kbytes DSRAM.
4) Specific information about the available channels in Table 3.
Analog input channels are listed for each Analog/Digital Converter module separately (ADC0 + ADC1).
Data Sheet
6
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Summary of Features
The XC226x types are offered with several Flash memory sizes. Table 2 describes the
location of the available memory areas for each Flash memory size.
Table 2
Flash Memory Allocation
Total Flash Size
Flash Area A1) Flash Area B
Flash Area C
768 Kbytes
C0’0000H …
C1’0000H …
n.a.
C0’EFFFH
CB’FFFFH
576 Kbytes
448 Kbytes
C0’0000H …
C0’EFFFH
C1’0000H …
C8’FFFFH
n.a.
C0’0000H …
C1’0000H …
C8’0000H …
C0’EFFFH
C5’FFFFH
C8’FFFFH
1) The uppermost 4-Kbyte sector of the first Flash segment is reserved for internal use (C0’F000H to C0’FFFFH).
The XC226x types are offered with different interface options. Table 3 lists the available
channels for each option.
Table 3
Interface Channel Association
Available Channels
Total Number
11 ADC0 channels
8 ADC0 channels
5 ADC1 channels
5 CAN nodes
CH0, CH2 … CH5, CH8 … CH11, CH13, CH15
CH0, CH2, CH3, CH4, CH5, CH8, CH9, CH10
CH0, CH2, CH4, CH5, CH6
CAN0, CAN1, CAN2, CAN3, CAN4
CAN0, CAN1
2 CAN nodes
6 serial channels
4 serial channels
U0C0, U0C1, U1C0, U1C1, U2C0, U2C1
U0C0, U0C1, U1C0, U1C1
Data Sheet
7
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
General Device Information
2
General Device Information
The XC226x derivatives are high-performance members of the Infineon XC2000 Family
of full-feature single-chip CMOS microcontrollers. These devices extend the functionality
and performance of the C166 Family in terms of instructions (MAC unit), peripherals, and
speed. They combine high CPU performance (up to 80 million instructions per second)
with extended peripheral functionality and enhanced IO capabilities. Optimized
peripherals can be adapted flexibly to meet the application requirements. These
derivatives utilize clock generation via PLL and internal or external clock sources. On-
chip memory modules include program Flash, program RAM, and data RAM.
TRef
VAREFVAGND
VDDI VDDP VSS
(1) (1)
(4) (9) (4)
Port 0
8 bit
XTAL1
XTAL2
ESR0
ESR1
Port 1
8 bit
Port 2
13 bit
Port 10
16bit
Port 4
4 bit
Port 6
3 bit
Port 15
5 bit
Port 7
5 bit
Port 5
11bit
PORST TRST JTAG Debug
4 bit 2 bit
via Port Pins
TESTM
MC_XX_LOGSYMB100
Figure 1
Logic Symbol
Data Sheet
8
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
General Device Information
2.1
Pin Configuration and Definition
The pins of the XC226x are described in detail in Table 4, which includes all alternate
functions. For further explanations please refer to the footnotes at the end of the table.
Figure 2 summarizes all pins, showing their locations on the four sides of the package.
VSS
1
2
3
4
5
6
7
8
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
VDDPB
P0.7
P10.7
P10.6
P0.6
P10.5
P10.4
P0.5
P10.3
P2.10
TRef
VDDI1
P0.4
P10.2
P0.3
P10.1
P10.0
P0.2
P2.9
P2.8
P0.1
P2.7
P0.0
VDDPB
VSS
VDDPB
TESTM
P7.2
TRST
P7.0
P7.3
P7.1
P7.4
9
VDDIM
P6.0
P6.1
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
P6.2
LQFP-100
VDDPA
P15.0
P15.2
P15.4
P15.5
P15.6
VAREF
VAGND
P5.0
P5.2
P5.3
VDDPB
MC_XX_PIN100
Figure 2
Pin Configuration (top view)
Data Sheet
9
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
General Device Information
Notes to Pin Definitions
1. Ctrl.: The output signal for a port pin is selected by bitfield PC in the associated
register Px_IOCRy. Output O0 is selected by setting the respective bitfield PC to
1x00B, output O1 is selected by 1x01B, etc.
Output signal OH is controlled by hardware.
2. Type: Indicates the pad type used (St=standard pad, Sp=special pad, DP=double
pad, In=input pad, PS=power supply) and its power supply domain (A, B, M, 1).
Table 4
Pin Definitions and Functions
Ctrl. Type Function
Pin Symbol
3
TESTM
I
In/B Testmode Enable
Enables factory test modes, must be held HIGH for
normal operation (connect to VDDPB).
An internal pullup device will hold this pin high
when nothing is driving it.
4
P7.2
O0 / I St/B Bit 2 of Port 7, General Purpose Input/Output
EMUX0
TxDC4
O1
O2
I
St/B External Analog MUX Control Output 0 (ADC1)
St/B CAN Node 4 Transmit Data Output
St/B CCU62 Position Input 0
CCU62_
CCPOS0A
TDI_C
TRST
I
I
St/B JTAG Test Data Input
5
In/B Test-System Reset Input
For normal system operation, pin TRST should be
held low. A high level at this pin at the rising edge
of PORST activates the XC226x’s debug system.
In this case, pin TRST must be driven low once to
reset the debug system.
An internal pulldown device will hold this pin low
when nothing is driving it.
6
P7.0
O0 / I St/B Bit 0 of Port 7, General Purpose Input/Output
T3OUT
T6OUT
TDO_A
ESR2_1
RxDC4B
O1
O2
OH
I
St/B GPT1 Timer T3 Toggle Latch Output
St/B GPT2 Timer T6 Toggle Latch Output
St/B JTAG Test Data Output
St/B ESR2 Trigger Input 1
I
St/B CAN Node 4 Receive Data Input
Data Sheet
10
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
General Device Information
Table 4
Pin Definitions and Functions (cont’d)
Pin Symbol
Ctrl. Type Function
7
P7.3
O0 / I St/B Bit 3 of Port 7, General Purpose Input/Output
EMUX1
O1
St/B External Analog MUX Control Output 1 (ADC1)
St/B USIC0 Channel 1 Shift Data Output
St/B USIC0 Channel 0 Shift Data Output
St/B CCU62 Position Input 1
U0C1_DOUT O2
U0C0_DOUT O3
CCU62_
I
CCPOS1A
TMS_C
U0C1_DX0F
P7.1
I
I
St/B JTAG Test Mode Selection Input
St/B USIC0 Channel 1 Shift Data Input
8
9
O0 / I St/B Bit 1 of Port 7, General Purpose Input/Output
EXTCLK
TxDC4
O1
O2
I
St/B Programmable Clock Signal Output
St/B CAN Node 4 Transmit Data Output
St/B CCU62 Emergency Trap Input
CCU62_
CTRAPA
BRKIN_C
P7.4
I
St/B OCDS Break Signal Input
O0 / I St/B Bit 4 of Port 7, General Purpose Input/Output
EMUX2
O1
St/B External Analog MUX Control Output 2 (ADC1)
St/B USIC0 Channel 1 Shift Data Output
U0C1_DOUT O2
U0C1_
O3
St/B USIC0 Channel 1 Shift Clock Output
SCLKOUT
CCU62_
I
St/B CCU62 Position Input 2
CCPOS2A
TCK_C
I
St/B JTAG Clock Input
U0C0_DX0D I
St/B USIC0 Channel 0 Shift Data Input
St/B USIC0 Channel 1 Shift Clock Input
U0C1_DX1E
P6.0
I
11
O0 / I St/A Bit 0 of Port 6, General Purpose Input/Output
EMUX0
O1
O3
I
St/A External Analog MUX Control Output 0 (ADC0)
St/A OCDS Break Signal Output
BRKOUT
ADCx_
St/A External Request Gate Input for ADC0/1
REQGTyC
U1C1_DX0E
I
St/A USIC1 Channel 1 Shift Data Input
Data Sheet
11
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
General Device Information
Table 4
Pin Definitions and Functions (cont’d)
Pin Symbol
Ctrl. Type Function
12
P6.1
O0 / I St/A Bit 1 of Port 6, General Purpose Input/Output
EMUX1
T3OUT
O1
O2
St/A External Analog MUX Control Output 1 (ADC0)
St/A GPT1 Timer T3 Toggle Latch Output
St/A USIC1 Channel 1 Shift Data Output
U1C1_DOUT O3
ADCx_
I
St/A External Request Trigger Input for ADC0/1
REQTRyC
13
P6.2
O0 / I St/A Bit 2 of Port 6, General Purpose Input/Output
EMUX2
T6OUT
O1
O2
O3
St/A External Analog MUX Control Output 2 (ADC0)
St/A GPT2 Timer T6 Toggle Latch Output
St/A USIC1 Channel 1 Shift Clock Output
U1C1_
SCLKOUT
U1C1_DX1C I
St/A USIC1 Channel 1 Shift Clock Input
In/A Bit 0 of Port 15, General Purpose Input
In/A Analog Input Channel 0 for ADC1
In/A Bit 2 of Port 15, General Purpose Input
In/A Analog Input Channel 2 for ADC1
In/A GPT2 Timer T5 Count/Gate Input
15
16
P15.0
I
I
I
I
I
I
I
I
I
I
I
I
I
-
-
I
I
ADC1_CH0
P15.2
ADC1_CH2
T5IN
17
18
19
P15.4
In/A Bit 4 of Port 15, General Purpose Input
In/A Analog Input Channel 4 for ADC1
In/A GPT2 Timer T6 Count/Gate Input
ADC1_CH4
T6IN
P15.5
In/A Bit 5 of Port 15, General Purpose Input
In/A Analog Input Channel 5 for ADC1
In/A GPT2 Timer T6 External Up/Down Control Input
In/A Bit 6 of Port 15, General Purpose Input
In/A Analog Input Channel 6 for ADC1
PS/A Reference Voltage for A/D Converters ADC0/1
PS/A Reference Ground for A/D Converters ADC0/1
In/A Bit 0 of Port 5, General Purpose Input
In/A Analog Input Channel 0 for ADC0
ADC1_CH5
T6EUD
P15.6
ADC1_CH6
VAREF
20
21
22
VAGND
P5.0
ADC0_CH0
Data Sheet
12
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
General Device Information
Table 4
Pin Definitions and Functions (cont’d)
Pin Symbol
Ctrl. Type Function
23
24
28
P5.2
I
I
I
I
I
I
I
I
I
In/A Bit 2 of Port 5, General Purpose Input
In/A Analog Input Channel 2 for ADC0
ADC0_CH2
TDI_A
In/A JTAG Test Data Input
P5.3
In/A Bit 3 of Port 5, General Purpose Input
In/A Analog Input Channel 3 for ADC0
In/A GPT1 Timer T3 Count/Gate Input
In/A Bit 4 of Port 5, General Purpose Input
In/A Analog Input Channel 4 for ADC0
In/A External Run Control Input for T12 of CCU63
ADC0_CH3
T3IN
P5.4
ADC0_CH4
CCU63_
T12HRB
T3EUD
TMS_A
P5.5
I
I
I
I
I
In/A GPT1 Timer T3 External Up/Down Control Input
In/A JTAG Test Mode Selection Input
29
30
In/A Bit 5 of Port 5, General Purpose Input
In/A Analog Input Channel 5 for ADC0
ADC0_CH5
CCU60_
T12HRB
In/A External Run Control Input for T12 of CCU60
P5.8
I
I
I
In/A Bit 8 of Port 5, General Purpose Input
In/A Analog Input Channel 8 for ADC0
ADC0_CH8
CCU6x_
T12HRC
In/A External Run Control Input for T12 of CCU6x
CCU6x_
T13HRC
I
In/A External Run Control Input for T13 of CCU6x
31
32
33
P5.9
I
I
I
I
In/A Bit 9 of Port 5, General Purpose Input
In/A Analog Input Channel 9 for ADC0
In/A CAPCOM2 Timer T7 Count Input
In/A Bit 10 of Port 5, General Purpose Input
In/A Analog Input Channel 10 for ADC0
In/A OCDS Break Signal Input
ADC0_CH9
CC2_T7IN
P5.10
ADC0_CH10 I
BRKIN_A
P5.11
I
I
In/A Bit 11 of Port 5, General Purpose Input
In/A Analog Input Channel 11 for ADC0
ADC0_CH11 I
Data Sheet
13
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
General Device Information
Table 4
Pin Definitions and Functions (cont’d)
Pin Symbol
Ctrl. Type Function
34
P5.13
I
In/A Bit 13 of Port 5, General Purpose Input
In/A Analog Input Channel 13 for ADC0
ADC0_CH13 I
EX0BINB
P5.15
I
I
In/A External Interrupt Trigger Input
In/A Bit 15 of Port 5, General Purpose Input
In/A Analog Input Channel 15 for ADC0
35
36
ADC0_CH15 I
P2.12
O0 / I St/B Bit 12 of Port 2, General Purpose Input/Output
U0C0_
SELO4
O1
St/B USIC0 Channel 0 Select/Control 4 Output
St/B USIC0 Channel 1 Select/Control 3 Output
St/B External Bus Interface READY Input
U0C1_
SELO3
O2
I
READY
P2.11
37
O0 / I St/B Bit 11 of Port 2, General Purpose Input/Output
U0C0_
SELO2
O1
O2
OH
St/B USIC0 Channel 0 Select/Control 2 Output
U0C1_
SELO2
St/B USIC0 Channel 1 Select/Control 2 Output
BHE/WRH
St/B External Bus Interf. High-Byte Control Output
Can operate either as Byte High Enable (BHE) or
as Write strobe for High Byte (WRH).
39
40
P2.0
O0 / I St/B Bit 0 of Port 2, General Purpose Input/Output
O2 / I St/B CCU63 Channel 0 Input/Output
CCU63_
CC60
AD13
OH / I St/B External Bus Interface Address/Data Line 13
RxDC0C
P2.1
I
St/B CAN Node 0 Receive Data Input
O0 / I St/B Bit 1 of Port 2, General Purpose Input/Output
O1 St/B CAN Node 0 Transmit Data Output
TxDC0
CCU63_
CC61
O2 / I St/B CCU63 Channel 1 Input/Output
AD14
OH / I St/B External Bus Interface Address/Data Line 14
ESR1_5
EX0AINA
I
I
St/B ESR1 Trigger Input 5
St/B External Interrupt Trigger Input
Data Sheet
14
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
General Device Information
Table 4
Pin Definitions and Functions (cont’d)
Pin Symbol
Ctrl. Type Function
41
P2.2
O0 / I St/B Bit 2 of Port 2, General Purpose Input/Output
O1 St/B CAN Node 1 Transmit Data Output
TxDC1
CCU63_
CC62
O2 / I St/B CCU63 Channel 2 Input/Output
AD15
OH / I St/B External Bus Interface Address/Data Line 15
ESR2_5
EX1AINA
P4.0
I
I
St/B ESR2 Trigger Input 5
St/B External Interrupt Trigger Input
42
43
O0 / I St/B Bit 0 of Port 4, General Purpose Input/Output
O3 / I St/B CAPCOM2 CC24IO Capture Inp./ Compare Out.
CC2_24
CS0
OH
St/B External Bus Interface Chip Select 0 Output
P2.3
O0 / I St/B Bit 3 of Port 2, General Purpose Input/Output
U0C0_DOUT O1
St/B USIC0 Channel 0 Shift Data Output
St/B CCU63 Channel 3 Output
CCU63_
COUT63
O2
CC2_16
A16
O3 / I St/B CAPCOM2 CC16IO Capture Inp./ Compare Out.
OH
St/B External Bus Interface Address Line 16
St/B ESR2 Trigger Input 0
ESR2_0
U0C0_DX0E
I
I
St/B USIC0 Channel 0 Shift Data Input
St/B USIC0 Channel 1 Shift Data Input
St/B CAN Node 0 Receive Data Input
U0C1_DX0D I
RxDC0A
P4.1
I
44
O0 / I St/B Bit 1 of Port 4, General Purpose Input/Output
O2 St/B CAN Node 2 Transmit Data Output
O3 / I St/B CAPCOM2 CC25IO Capture Inp./ Compare Out.
OH St/B External Bus Interface Chip Select 1 Output
TxDC2
CC2_25
CS1
Data Sheet
15
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
General Device Information
Table 4
Pin Definitions and Functions (cont’d)
Pin Symbol
Ctrl. Type Function
45
P2.4
O0 / I St/B Bit 4 of Port 2, General Purpose Input/Output
U0C1_DOUT O1
St/B USIC0 Channel 1 Shift Data Output
St/B CAN Node 0 Transmit Data Output
TxDC0
CC2_17
A17
O2
O3 / I St/B CAPCOM2 CC17IO Capture Inp./ Compare Out.
OH
St/B External Bus Interface Address Line 17
St/B ESR1 Trigger Input 0
ESR1_0
U0C0_DX0F
RxDC1A
P2.5
I
I
I
St/B USIC0 Channel 0 Shift Data Input
St/B CAN Node 1 Receive Data Input
46
O0 / I St/B Bit 5 of Port 2, General Purpose Input/Output
U0C0_
O1
St/B USIC0 Channel 0 Shift Clock Output
SCLKOUT
TxDC0
CC2_18
A18
O2
St/B CAN Node 0 Transmit Data Output
O3 / I St/B CAPCOM2 CC18IO Capture Inp./ Compare Out.
OH
I
St/B External Bus Interface Address Line 18
St/B USIC0 Channel 0 Shift Clock Input
U0C0_DX1D
P4.2
47
48
O0 / I St/B Bit 2 of Port 4, General Purpose Input/Output
O2 St/B CAN Node 2 Transmit Data Output
O3 / I St/B CAPCOM2 CC26IO Capture Inp./ Compare Out.
TxDC2
CC2_26
CS2
OH
I
St/B External Bus Interface Chip Select 2 Output
St/B GPT1 Timer T2 Count/Gate Input
T2IN
P2.6
O0 / I St/B Bit 6 of Port 2, General Purpose Input/Output
U0C0_
SELO0
O1
St/B USIC0 Channel 0 Select/Control 0 Output
U0C1_
SELO1
O2
St/B USIC0 Channel 1 Select/Control 1 Output
CC2_19
A19
O3 / I St/B CAPCOM2 CC19IO Capture Inp./ Compare Out.
OH
St/B External Bus Interface Address Line 19
St/B USIC0 Channel 0 Shift Control Input
St/B CAN Node 0 Receive Data Input
U0C0_DX2D I
RxDC0D
I
Data Sheet
16
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
General Device Information
Table 4
Pin Definitions and Functions (cont’d)
Pin Symbol
Ctrl. Type Function
49
P4.3
O0 / I St/B Bit 3 of Port 4, General Purpose Input/Output
O3 / I St/B CAPCOM2 CC27IO Capture Inp./ Compare Out.
CC2_27
CS3
OH
St/B External Bus Interface Chip Select 3 Output
St/B CAN Node 2 Receive Data Input
RxDC2A
T2EUD
P0.0
I
I
St/B GPT1 Timer T2 External Up/Down Control Input
53
O0 / I St/B Bit 0 of Port 0, General Purpose Input/Output
St/B USIC1 Channel 0 Shift Data Output
O3 / I St/B CCU61 Channel 0 Input/Output
U1C0_DOUT O1
CCU61_
CC60
A0
OH
I
St/B External Bus Interface Address Line 0
St/B USIC1 Channel 0 Shift Data Input
U1C0_DX0A
P2.7
54
O0 / I St/B Bit 7 of Port 2, General Purpose Input/Output
U0C1_
SELO0
O1
St/B USIC0 Channel 1 Select/Control 0 Output
U0C0_
SELO1
O2
St/B USIC0 Channel 0 Select/Control 1 Output
CC2_20
A20
O3 / I St/B CAPCOM2 CC20IO Capture Inp./ Compare Out.
OH
St/B External Bus Interface Address Line 20
St/B USIC0 Channel 1 Shift Control Input
St/B CAN Node 1 Receive Data Input
U0C1_DX2C I
RxDC1C
P0.1
I
55
O0 / I St/B Bit 1 of Port 0, General Purpose Input/Output
U1C0_DOUT O1
St/B USIC1 Channel 0 Shift Data Output
St/B CAN Node 0 Transmit Data Output
TxDC0
O2
CCU61_
CC61
O3 / I St/B CCU61 Channel 1 Input/Output
A1
OH
St/B External Bus Interface Address Line 1
St/B USIC1 Channel 0 Shift Data Input
St/B USIC1 Channel 0 Shift Clock Input
U1C0_DX0B
U1C0_DX1A
I
I
Data Sheet
17
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
General Device Information
Table 4
Pin Definitions and Functions (cont’d)
Pin Symbol
Ctrl. Type Function
56
P2.8
O0 / I DP/B Bit 8 of Port 2, General Purpose Input/Output
U0C1_
O1
DP/B USIC0 Channel 1 Shift Clock Output
SCLKOUT
EXTCLK
O2
DP/B Programmable Clock Signal Output
1)
CC2_21
A21
O3 / I DP/B CAPCOM2 CC21IO Capture Inp./ Compare Out.
OH
DP/B External Bus Interface Address Line 21
DP/B USIC0 Channel 1 Shift Clock Input
U0C1_DX1D I
P2.9
57
O0 / I St/B Bit 9 of Port 2, General Purpose Input/Output
U0C1_DOUT O1
St/B USIC0 Channel 1 Shift Data Output
St/B CAN Node 1 Transmit Data Output
TxDC1
CC2_22
A22
O2
O3 / I St/B CAPCOM2 CC22IO Capture Inp./ Compare Out.
OH
St/B External Bus Interface Address Line 22
St/B Clock Signal Input
CLKIN1
TCK_A
P0.2
I
I
St/B JTAG Clock Input
58
O0 / I St/B Bit 2 of Port 0, General Purpose Input/Output
U1C0_
O1
St/B USIC1 Channel 0 Shift Clock Output
SCLKOUT
TxDC0
O2
St/B CAN Node 0 Transmit Data Output
CCU61_
CC62
O3 / I St/B CCU61 Channel 2 Input/Output
A2
OH
I
St/B External Bus Interface Address Line 2
St/B USIC1 Channel 0 Shift Clock Input
U1C0_DX1B
P10.0
59
O0 / I St/B Bit 0 of Port 10, General Purpose Input/Output
St/B USIC0 Channel 1 Shift Data Output
U0C1_DOUT O1
CCU60_
CC60
O2 / I St/B CCU60 Channel 0 Input/Output
AD0
OH / I St/B External Bus Interface Address/Data Line 0
ESR1_2
I
I
I
St/B ESR1 Trigger Input 2
U0C0_DX0A
U0C1_DX0A
St/B USIC0 Channel 0 Shift Data Input
St/B USIC0 Channel 1 Shift Data Input
Data Sheet
18
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
General Device Information
Table 4
Pin Definitions and Functions (cont’d)
Pin Symbol
Ctrl. Type Function
60
P10.1
O0 / I St/B Bit 1 of Port 10, General Purpose Input/Output
St/B USIC0 Channel 0 Shift Data Output
U0C0_DOUT O1
CCU60_
CC61
O2 / I St/B CCU60 Channel 1 Input/Output
AD1
OH / I St/B External Bus Interface Address/Data Line 1
U0C0_DX0B
U0C0_DX1A
P0.3
I
I
St/B USIC0 Channel 0 Shift Data Input
St/B USIC0 Channel 0 Shift Clock Input
61
O0 / I St/B Bit 3 of Port 0, General Purpose Input/Output
U1C0_
SELO0
O1
O2
O3
St/B USIC1 Channel 0 Select/Control 0 Output
St/B USIC1 Channel 1 Select/Control 1 Output
St/B CCU61 Channel 0 Output
U1C1_
SELO1
CCU61_
COUT60
A3
OH
St/B External Bus Interface Address Line 3
St/B USIC1 Channel 0 Shift Control Input
St/B CAN Node 0 Receive Data Input
U1C0_DX2A
RxDC0B
P10.2
I
I
62
O0 / I St/B Bit 2 of Port 10, General Purpose Input/Output
O1 St/B USIC0 Channel 0 Shift Clock Output
U0C0_
SCLKOUT
CCU60_
CC62
O2 / I St/B CCU60 Channel 2 Input/Output
AD2
OH / I St/B External Bus Interface Address/Data Line 2
U0C0_DX1B
I
St/B USIC0 Channel 0 Shift Clock Input
Data Sheet
19
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
General Device Information
Table 4
Pin Definitions and Functions (cont’d)
Pin Symbol
Ctrl. Type Function
63
P0.4
O0 / I St/B Bit 4 of Port 0, General Purpose Input/Output
U1C1_
SELO0
O1
O2
O3
St/B USIC1 Channel 1 Select/Control 0 Output
St/B USIC1 Channel 0 Select/Control 1 Output
St/B CCU61 Channel 1 Output
U1C0_
SELO1
CCU61_
COUT61
A4
OH
St/B External Bus Interface Address Line 4
St/B USIC1 Channel 1 Shift Control Input
St/B CAN Node 1 Receive Data Input
U1C1_DX2A
RxDC1B
TRef
I
I
65
66
IO
Sp/1 Control Pin for Core Voltage Generation
2)
P2.10
O0 / I St/B Bit 10 of Port 2, General Purpose Input/Output
U0C1_DOUT O1
St/B USIC0 Channel 1 Shift Data Output
U0C0_
SELO3
O2
St/B USIC0 Channel 0 Select/Control 3 Output
CC2_23
A23
O3 / I St/B CAPCOM2 CC23IO Capture Inp./ Compare Out.
OH
St/B External Bus Interface Address Line 23
St/B USIC0 Channel 1 Shift Data Input
St/B GPT2 Register CAPREL Capture Input
U0C1_DX0E
CAPIN
I
I
67
P10.3
O0 / I St/B Bit 3 of Port 10, General Purpose Input/Output
O2 St/B CCU60 Channel 0 Output
CCU60_
COUT60
AD3
OH / I St/B External Bus Interface Address/Data Line 3
U0C0_DX2A
U0C1_DX2A
I
I
St/B USIC0 Channel 0 Shift Control Input
St/B USIC0 Channel 1 Shift Control Input
Data Sheet
20
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
General Device Information
Table 4
Pin Definitions and Functions (cont’d)
Pin Symbol
Ctrl. Type Function
68
P0.5
O0 / I St/B Bit 5 of Port 0, General Purpose Input/Output
U1C1_
SCLKOUT
O1
O2
O3
St/B USIC1 Channel 1 Shift Clock Output
St/B USIC1 Channel 0 Select/Control 2 Output
St/B CCU61 Channel 2 Output
U1C0_
SELO2
CCU61_
COUT62
A5
OH
I
St/B External Bus Interface Address Line 5
St/B USIC1 Channel 1 Shift Clock Input
U1C1_DX1A
U1C0_DX1C I
P10.4
St/B USIC1 Channel 0 Shift Clock Input
69
O0 / I St/B Bit 4 of Port 10, General Purpose Input/Output
U0C0_
SELO3
O1
St/B USIC0 Channel 0 Select/Control 3 Output
CCU60_
COUT61
O2
St/B CCU60 Channel 1 Output
AD4
OH / I St/B External Bus Interface Address/Data Line 4
U0C0_DX2B
U0C1_DX2B
P10.5
I
I
St/B USIC0 Channel 0 Shift Control Input
St/B USIC0 Channel 1 Shift Control Input
70
O0 / I St/B Bit 5 of Port 10, General Purpose Input/Output
U0C1_
O1
St/B USIC0 Channel 1 Shift Clock Output
SCLKOUT
CCU60_
COUT62
O2
St/B CCU60 Channel 2 Output
AD5
OH / I St/B External Bus Interface Address/Data Line 5
U0C1_DX1B
I
St/B USIC0 Channel 1 Shift Clock Input
Data Sheet
21
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
General Device Information
Table 4
Pin Definitions and Functions (cont’d)
Pin Symbol
Ctrl. Type Function
71
72
73
P0.6
O0 / I St/B Bit 6 of Port 0, General Purpose Input/Output
U1C1_DOUT O1
St/B USIC1 Channel 1 Shift Data Output
St/B CAN Node 1 Transmit Data Output
St/B CCU61 Channel 3 Output
TxDC1
O2
O3
CCU61_
COUT63
A6
OH
St/B External Bus Interface Address Line 6
St/B USIC1 Channel 1 Shift Data Input
St/B CCU61 Emergency Trap Input
U1C1_DX0A
I
I
CCU61_
CTRAPA
U1C1_DX1B
P10.6
I
St/B USIC1 Channel 1 Shift Clock Input
O0 / I St/B Bit 6 of Port 10, General Purpose Input/Output
U0C0_DOUT O1
St/B USIC0 Channel 0 Shift Data Output
St/B CAN Node 4 Transmit Data Output
St/B USIC1 Channel 0 Select/Control 0 Output
TxDC4
O2
O3
U1C0_
SELO0
AD6
OH / I St/B External Bus Interface Address/Data Line 6
St/B USIC0 Channel 0 Shift Data Input
U0C0_DX0C I
U1C0_DX2D I
St/B USIC1 Channel 0 Shift Control Input
CCU60_
CTRAPA
I
St/B CCU60 Emergency Trap Input
P10.7
O0 / I St/B Bit 7 of Port 10, General Purpose Input/Output
U0C1_DOUT O1
St/B USIC0 Channel 1 Shift Data Output
St/B CCU60 Channel 3 Output
CCU60_
COUT63
O2
AD7
OH / I St/B External Bus Interface Address/Data Line 7
U0C1_DX0B
I
I
St/B USIC0 Channel 1 Shift Data Input
St/B CCU60 Position Input 0
CCU60_
CCPOS0A
RxDC4C
I
St/B CAN Node 4 Receive Data Input
Data Sheet
22
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
General Device Information
Table 4
Pin Definitions and Functions (cont’d)
Pin Symbol
Ctrl. Type Function
74
P0.7
O0 / I St/B Bit 7 of Port 0, General Purpose Input/Output
U1C1_DOUT O1
St/B USIC1 Channel 1 Shift Data Output
U1C0_
SELO3
O2
St/B USIC1 Channel 0 Select/Control 3 Output
A7
OH
St/B External Bus Interface Address Line 7
St/B USIC1 Channel 1 Shift Data Input
St/B CCU61 Emergency Trap Input
U1C1_DX0B
I
I
CCU61_
CTRAPB
78
P1.0
O0 / I St/B Bit 0 of Port 1, General Purpose Input/Output
U1C0_
O1
St/B USIC1 Channel 0 Master Clock Output
MCLKOUT
U1C0_
SELO4
O2
St/B USIC1 Channel 0 Select/Control 4 Output
A8
OH
St/B External Bus Interface Address Line 8
St/B ESR1 Trigger Input 3
ESR1_3
EX0BINA
I
I
I
St/B External Interrupt Trigger Input
St/B CCU62 Emergency Trap Input
CCU62_
CTRAPB
79
P10.8
O0 / I St/B Bit 8 of Port 10, General Purpose Input/Output
U0C0_
O1
St/B USIC0 Channel 0 Master Clock Output
MCLKOUT
U0C1_
SELO0
O2
St/B USIC0 Channel 1 Select/Control 0 Output
AD8
OH / I St/B External Bus Interface Address/Data Line 8
CCU60_
I
St/B CCU60 Position Input 1
CCPOS1A
U0C0_DX1C I
BRKIN_B
St/B USIC0 Channel 0 Shift Clock Input
St/B OCDS Break Signal Input
I
Data Sheet
23
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
General Device Information
Table 4
Pin Definitions and Functions (cont’d)
Pin Symbol
Ctrl. Type Function
80
P10.9
O0 / I St/B Bit 9 of Port 10, General Purpose Input/Output
U0C0_
SELO4
O1
St/B USIC0 Channel 0 Select/Control 4 Output
U0C1_
O2
St/B USIC0 Channel 1 Master Clock Output
MCLKOUT
AD9
OH / I St/B External Bus Interface Address/Data Line 9
CCU60_
I
St/B CCU60 Position Input 2
CCPOS2A
TCK_B
P1.1
I
St/B JTAG Clock Input
81
O0 / I St/B Bit 1 of Port 1, General Purpose Input/Output
CCU62_
COUT62
O1
St/B CCU62 Channel 2 Output
U1C0_
SELO5
O2
St/B USIC1 Channel 0 Select/Control 5 Output
U2C1_DOUT O3
St/B USIC2 Channel 1 Shift Data Output
St/B External Bus Interface Address Line 9
St/B ESR2 Trigger Input 3
A9
OH
ESR2_3
EX1BINA
I
I
St/B External Interrupt Trigger Input
U2C1_DX0C I
St/B USIC2 Channel 1 Shift Data Input
O0 / I St/B Bit 10 of Port 10, General Purpose Input/Output
82
P10.10
U0C0_
SELO0
O1
St/B USIC0 Channel 0 Select/Control 0 Output
CCU60_
COUT63
O2
St/B CCU60 Channel 3 Output
AD10
OH / I St/B External Bus Interface Address/Data Line 10
St/B USIC0 Channel 0 Shift Control Input
U0C0_DX2C I
TDI_B
I
St/B JTAG Test Data Input
U0C1_DX1A
I
St/B USIC0 Channel 1 Shift Clock Input
Data Sheet
24
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
General Device Information
Table 4
Pin Definitions and Functions (cont’d)
Pin Symbol
Ctrl. Type Function
83
P10.11
O0 / I St/B Bit 11 of Port 10, General Purpose Input/Output
U1C0_
O1
St/B USIC1 Channel 0 Shift Clock Output
SCLKOUT
BRKOUT
O2
St/B OCDS Break Signal Output
AD11
OH / I St/B External Bus Interface Address/Data Line 11
St/B USIC1 Channel 0 Shift Clock Input
U1C0_DX1D I
RxDC2B
TMS_B
P1.2
I
St/B CAN Node 2 Receive Data Input
St/B JTAG Test Mode Selection Input
I
84
O0 / I St/B Bit 2 of Port 1, General Purpose Input/Output
O1 / I St/B CCU62 Channel 2 Input/Output
CCU62_
CC62
U1C0_
SELO6
O2
O3
St/B USIC1 Channel 0 Select/Control 6 Output
St/B USIC2 Channel 1 Shift Clock Output
U2C1_
SCLKOUT
A10
OH
St/B External Bus Interface Address Line 10
St/B ESR1 Trigger Input 4
ESR1_4
I
I
CCU61_
T12HRB
St/B External Run Control Input for T12 of CCU61
EX2AINA
I
St/B External Interrupt Trigger Input
St/B USIC2 Channel 1 Shift Data Input
U2C1_DX0D I
U2C1_DX1C I
P10.12
St/B USIC2 Channel 1 Shift Clock Input
85
O0 / I St/B Bit 12 of Port 10, General Purpose Input/Output
U1C0_DOUT O1
St/B USIC1 Channel 0 Shift Data Output
St/B CAN Node 2 Transmit Data Output
St/B JTAG Test Data Output
TxDC2
O2
O3
TDO_B
AD12
OH / I St/B External Bus Interface Address/Data Line 12
St/B USIC1 Channel 0 Shift Data Input
U1C0_DX0C I
U1C0_DX1E
I
St/B USIC1 Channel 0 Shift Clock Input
Data Sheet
25
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
General Device Information
Table 4
Pin Definitions and Functions (cont’d)
Pin Symbol
Ctrl. Type Function
86
P10.13
O0 / I St/B Bit 13 of Port 10, General Purpose Input/Output
U1C0_DOUT O1
St/B USIC1 Channel 0 Shift Data Output
St/B CAN Node 3 Transmit Data Output
St/B USIC1 Channel 0 Select/Control 3 Output
TxDC3
O2
O3
U1C0_
SELO3
WR/WRL
OH
St/B External Bus Interface Write Strobe Output
Active for each external write access, when WR,
active for ext. writes to the low byte, when WRL.
U1C0_DX0D I
P1.3
St/B USIC1 Channel 0 Shift Data Input
87
O0 / I St/B Bit 3 of Port 1, General Purpose Input/Output
CCU62_
COUT63
O1
St/B CCU62 Channel 3 Output
U1C0_
SELO7
O2
O3
St/B USIC1 Channel 0 Select/Control 7 Output
St/B USIC2 Channel 0 Select/Control 4 Output
U2C0_
SELO4
A11
OH
St/B External Bus Interface Address Line 11
St/B ESR2 Trigger Input 4
ESR2_4
I
I
CCU62_
T12HRB
St/B External Run Control Input for T12 of CCU62
EX3AINA
P10.14
I
St/B External Interrupt Trigger Input
89
O0 / I St/B Bit 14 of Port 10, General Purpose Input/Output
U1C0_
SELO1
O1
St/B USIC1 Channel 0 Select/Control 1 Output
U0C1_DOUT O2
St/B USIC0 Channel 1 Shift Data Output
St/B External Bus Interface Read Strobe Output
St/B ESR2 Trigger Input 2
RD
OH
I
ESR2_2
U0C1_DX0C I
RxDC3C
St/B USIC0 Channel 1 Shift Data Input
St/B CAN Node 3 Receive Data Input
I
Data Sheet
26
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
General Device Information
Table 4
Pin Definitions and Functions (cont’d)
Pin Symbol
Ctrl. Type Function
90
P1.4
O0 / I St/B Bit 4 of Port 1, General Purpose Input/Output
CCU62_
COUT61
O1
O2
O3
St/B CCU62 Channel 1 Output
U1C1_
SELO4
St/B USIC1 Channel 1 Select/Control 4 Output
St/B USIC2 Channel 0 Select/Control 5 Output
U2C0_
SELO5
A12
OH
I
St/B External Bus Interface Address Line 12
St/B USIC2 Channel 0 Shift Control Input
U2C0_DX2B
P10.15
91
O0 / I St/B Bit 15 of Port 10, General Purpose Input/Output
U1C0_
SELO2
O1
St/B USIC1 Channel 0 Select/Control 2 Output
U0C1_DOUT O2
U1C0_DOUT O3
St/B USIC0 Channel 1 Shift Data Output
St/B USIC1 Channel 0 Shift Data Output
ALE
OH
St/B External Bus Interf. Addr. Latch Enable Output
St/B USIC0 Channel 1 Shift Clock Input
U0C1_DX1C I
P1.5
92
O0 / I St/B Bit 5 of Port 1, General Purpose Input/Output
CCU62_
COUT60
O1
St/B CCU62 Channel 0 Output
U1C1_
SELO3
O2
St/B USIC1 Channel 1 Select/Control 3 Output
BRKOUT
A13
O3
St/B OCDS Break Signal Output
OH
St/B External Bus Interface Address Line 13
St/B USIC2 Channel 0 Shift Data Input
U2C0_DX0C I
P1.6
93
O0 / I St/B Bit 6 of Port 1, General Purpose Input/Output
O1 / I St/B CCU62 Channel 1 Input/Output
CCU62_
CC61
U1C1_
SELO2
O2
St/B USIC1 Channel 1 Select/Control 2 Output
U2C0_DOUT O3
St/B USIC2 Channel 0 Shift Data Output
St/B External Bus Interface Address Line 14
St/B USIC2 Channel 0 Shift Data Input
A14
OH
U2C0_DX0D I
Data Sheet
27
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
General Device Information
Table 4
Pin Definitions and Functions (cont’d)
Pin Symbol
Ctrl. Type Function
94
P1.7
O0 / I St/B Bit 7 of Port 1, General Purpose Input/Output
O1 / I St/B CCU62 Channel 0 Input/Output
CCU62_
CC60
U1C1_
MCLKOUT
O2
O3
OH
St/B USIC1 Channel 1 Master Clock Output
St/B USIC2 Channel 0 Shift Clock Output
U2C0_
SCLKOUT
A15
St/B External Bus Interface Address Line 15
St/B USIC2 Channel 0 Shift Clock Input
Sp/M Crystal Oscillator Amplifier Output
U2C0_DX1C I
95
96
XTAL2
XTAL1
O
I
Sp/M Crystal Oscillator Amplifier Input
To clock the device from an external source, drive
XTAL1, while leaving XTAL2 unconnected.
Voltages on XTAL1 must comply to the core
supply voltage VDDIM
.
97
PORST
I
In/B Power On Reset Input
A low level at this pin resets the XC226x
completely. A spike filter suppresses input pulses
<10 ns. Input pulses >100 ns safely pass the filter.
The minimum duration for a safe recognition
should be 120 ns.
An internal pullup device will hold this pin high
when nothing is driving it.
98
ESR1
O0 / I St/B External Service Request 1
U1C0_DX0F
I
St/B USIC1 Channel 0 Shift Data Input
St/B USIC1 Channel 0 Shift Control Input
St/B USIC1 Channel 1 Shift Data Input
St/B USIC1 Channel 1 Shift Control Input
St/B USIC2 Channel 1 Shift Control Input
St/B External Interrupt Trigger Input
U1C0_DX2C I
U1C1_DX0C I
U1C1_DX2B
U2C1_DX2C I
EX0AINB
I
I
Data Sheet
28
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
General Device Information
Table 4
Pin Definitions and Functions (cont’d)
Pin Symbol
Ctrl. Type Function
99
ESR0
O0 / I St/B External Service Request 0
Note: After power-up, ESR0 operates as open-
drain bidirectional reset with a weak pull-up.
St/B USIC1 Channel 0 Shift Data Input
U1C0_DX0E
U1C0_DX2B
VDDIM
I
I
-
St/B USIC1 Channel 0 Shift Control Input
10
PS/M Digital Core Supply Voltage for Domain M
Decouple with a ceramic capacitor, see Table 12
for details.
38, VDDI1
64,
88
-
-
PS/1 Digital Core Supply Voltage for Domain 1
Decouple with a ceramic capacitor, see Table 12
for details.
All VDDI1 pins must be connected to each other.
14
VDDPA
PS/A Digital Pad Supply Voltage for Domain A
Connect decoupling capacitors to adjacent
V
DDP/VSS pin pairs as close as possible to the pins.
Note: The A/D_Converters and ports P5, P6, and
P15 are fed from supply voltage VDDPA
.
2,
VDDPB
-
PS/B Digital Pad Supply Voltage for Domain B
25,
27,
50,
52,
75,
77,
100
Connect decoupling capacitors to adjacent
V
DDP/VSS pin pairs as close as possible to the pins.
Note: The on-chip voltage regulators and all ports
except P5, P6, and P15 are fed from supply
voltage VDDPB
.
1,
VSS
-
PS/-- Digital Ground
26,
51,
76
All VSS pins must be connected to the ground-line
or ground-plane.
Note: Also the exposed pad is connected to VSS.
The respective board area must be
connected to ground (if soldered) or left free.
1) To generate the reference clock output for bus timing measurement, fSYS must be selected as source for
EXTCLK and P2.8 must be selected as output pin. Also the high-speed clock pad must be enabled. This
configuration is referred to as reference clock output signal CLKOUT.
Data Sheet
29
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
General Device Information
2) Pin TRef was used to control the core voltage generation in step AA. For that step, pin TRef must be connected
to VDDPB
.
This connection is no more required from step AB on. For the current step, pin TRef is logically not connected.
Future derivatives will feature an additional general purpose IO pin at this position.
Data Sheet
30
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
3
Functional Description
The architecture of the XC226x combines advantages of RISC, CISC, and DSP
processors with an advanced peripheral subsystem in a well-balanced design. On-chip
memory blocks allow the design of compact systems-on-silicon with maximum
performance suited for computing, control, and communication.
The on-chip memory blocks (program code memory and SRAM, dual-port RAM, data
SRAM) and the generic peripherals are connected to the CPU by separate high-speed
buses. Another bus, the LXBus, connects additional on-chip resources and external
resources (see Figure 3). This bus structure enhances overall system performance by
enabling the concurrent operation of several subsystems of the XC226x.
The block diagram gives an overview of the on-chip components and the advanced
internal bus structure of the XC226x.
PSRAM
16/32/64 Kbytes
DPRAM
2 Kbytes
DSRAM
16 Kbytes
OCDS
Debug Support
Program Flash 0
256 Kbytes
EBC
LXBus Control
External Bus
Control
CPU
Program Flash 1
192/256 Kbytes
C166SV2 - Core
Program Flash 2
0/64/256 Kbytes
WDT
RTC
System Functions
Clock, Reset, Power Control,
Stand-By RAM
Interrupt & PEC
Interrupt Bus
CCU63 ...
ADC1 ADC0 GPT
CC2
CCU60
USIC2 USIC1 USIC0 Multi
2 Ch., 2 Ch., 2 Ch., CAN
64 x 64 x 64 x
8-Bit/
10-Bit 10-Bit
8 Ch. 16 Ch.
8-Bit/
T2
T7
T8
T12
T13
T12
T13
T3
T4
Buffer Buffer Buffer
RS232, RS232, RS232,
LIN,
SPI,
LIN,
SPI,
LIN,
SPI,
T5
5 ch.
T6
IIC, IIS IIC, IIS IIC, IIS
P15
Port 5
11
P10
16
P7 P6 P4
P2
P1
8
P0
5
5
3
4
13
8
MC_XC226X_BLOCKDIAGRAM
Figure 3
Block Diagram
Data Sheet
31
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
3.1
Memory Subsystem and Organization
The memory space of the XC226x is configured in the von Neumann architecture. In this
architecture all internal and external resources, including code memory, data memory,
registers and I/O ports, are organized in the same linear address space.
Table 5
XC226x Memory Map
Address Area
Start Loc. End Loc. Area Size1)
Notes
IMB register space
FF’FF00H FF’FFFFH 256 Bytes
–
Reserved (Access trap) F0’0000H
Reserved for EPSRAM E9’0000H
FF’FEFFH <1 Mbyte
EF’FFFFH 448 Kbytes
E8’FFFFH 64 Kbytes
E7’FFFFH 448 Kbytes
E0’FFFFH 64 Kbytes
Minus IMB registers
Mirrors EPSRAM
Flash timing
Mirrors PSRAM
Maximum speed
Emulated PSRAM
Reserved for PSRAM
Program SRAM
E8’0000H
E1’0000H
E0’0000H
Reserved for pr. mem. CC’0000H DF’FFFFH <1.25 Mbytes –
Program Flash 2
Program Flash 1
Program Flash 0
C8’0000H CB’FFFFH 256 Kbytes
C4’0000H C7’FFFFH 256 Kbytes
C0’0000H C3’FFFFH 256 Kbytes
–
–
2)
External memory area 40’0000H
Available Ext. IO area3) 20’5800H
BF’FFFFH 8 Mbytes
3F’FFFFH < 2 Mbytes
–
Minus USIC/CAN
USIC registers
20’4000H
20’0000H
20’57FFH
6 Kbytes
Accessed via EBC
MultiCAN registers
20’3FFFH 16 Kbytes
1F’FFFFH < 2 Mbytes
Accessed via EBC
External memory area 01’0000H
Minus segment 0
SFR area
00’FE00H 00’FFFFH 0.5 Kbyte
–
–
–
–
–
–
–
–
Dual-Port RAM
Reserved for DPRAM
ESFR area
00’F600H
00’F200H
00’F000H
00’E000H
00’A000H
00’8000H
00’FDFFH 2 Kbytes
00’F5FFH 1 Kbyte
00’F1FFH 0.5 Kbyte
00’EFFFH 4 Kbytes
00’DFFFH 16 Kbytes
00’9FFFH 8 Kbytes
00’7FFFH 32 Kbytes
XSFR area
Data SRAM
Reserved for DSRAM
External memory area 00’0000H
1) The areas marked with “<” are slightly smaller than indicated. See column “Notes”.
2) The uppermost 4-Kbyte sector of the first Flash segment is reserved for internal use (C0’F000H to C0’FFFFH).
3) Several pipeline optimizations are not active within the external IO area. This is necessary to control external
peripherals properly.
Data Sheet
32
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
This common memory space consists of 16 Mbytes organized as 256 segments of
64 Kbytes; each segment contains four data pages of 16 Kbytes. The entire memory
space can be accessed bytewise or wordwise. Portions of the on-chip DPRAM and the
register spaces (ESFR/SFR) additionally are directly bit addressable.
The internal data memory areas and the Special Function Register areas (SFR and
ESFR) are mapped into segment 0, the system segment.
The Program Management Unit (PMU) handles all code fetches and, therefore, controls
access to the program memories such as Flash memory and PSRAM.
The Data Management Unit (DMU) handles all data transfers and, therefore, controls
access to the DSRAM and the on-chip peripherals.
Both units (PMU and DMU) are connected to the high-speed system bus so that they can
exchange data. This is required if operands are read from program memory, code or
data is written to the PSRAM, code is fetched from external memory, or data is read from
or written to external resources. These include peripherals on the LXBus such as USIC
or MultiCAN. The system bus allows concurrent two-way communication for maximum
transfer performance.
Up to 64 Kbytes of on-chip Program SRAM (PSRAM) are provided to store user code
or data. The PSRAM is accessed via the PMU and is optimized for code fetches. A
section of the PSRAM with programmable size can be write-protected.
Note: The actual size of the PSRAM depends on the chosen derivative (see Table 1).
16 Kbytes of on-chip Data SRAM (DSRAM) are used for storage of general user data.
The DSRAM is accessed via a separate interface and is optimized for data access.
2 Kbytes of on-chip Dual-Port RAM (DPRAM) provide storage for user-defined
variables, for the system stack, and for general purpose register banks. A register bank
can consist of up to 16 word-wide (R0 to R15) and/or byte-wide (RL0, RH0, …, RL7,
RH7) General Purpose Registers (GPRs).
The upper 256 bytes of the DPRAM are directly bit addressable. When used by a GPR,
any location in the DPRAM is bit addressable.
1 Kbyte of on-chip Stand-By SRAM (SBRAM) provides storage for system-relevant
user data that must be preserved while the major part of the device is powered down.
The SBRAM is accessed via a specific interface and is powered in domain M.
Data Sheet
33
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
1024 bytes (2 × 512 bytes) of the address space are reserved for the Special Function
Register areas (SFR space and ESFR space). SFRs are word-wide registers which are
used to control and monitor functions of the different on-chip units. Unused SFR
addresses are reserved for future members of the XC2000 Family. In order to to ensure
upward compatibility they should either not be accessed or written with zeros.
In order to meet the requirements of designs where more memory is required than is
available on chip, up to 12 Mbytes (approximately, see Table 5) of external RAM and/or
ROM can be connected to the microcontroller. The External Bus Interface also provides
access to external peripherals.
Up to 768 Kbytes of on-chip Flash memory store code, constant data, and control
data. The on-chip Flash memory consists of up to three modules with a maximum
capacity of 256 Kbytes each. Each module is organized in 4-Kbyte sectors.
The uppermost 4-Kbyte sector of segment 0 (located in Flash module 0) is used
internally to store operation control parameters and protection information.
Note: The actual size of the Flash memory depends on the chosen derivative (see
Table 1).
Each sector can be separately write protected1), erased and programmed (in blocks of
128 Bytes). The complete Flash area can be read-protected. A user-defined password
sequence temporarily unlocks protected areas. The Flash modules combine 128-bit
read access with protected and efficient writing algorithms for programming and erasing.
Dynamic error correction provides extremely high read data security for all read access
operations. Access to different Flash modules can be executed in parallel.
For Flash parameters, please see Section 4.5.
1) To save control bits, sectors are clustered for protection purposes, they remain separate for
programming/erasing.
Data Sheet
34
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
3.2
External Bus Controller
All external memory access operations are performed by a special on-chip External Bus
Controller (EBC). The EBC also controls access to resources connected to the on-chip
LXBus (MultiCAN and the USIC modules). The LXBus is an internal representation of
the external bus that allows access to integrated peripherals and modules in the same
way as to external components.
The EBC can be programmed either to Single Chip Mode, when no external memory is
required, or to an external bus mode with the following selections1):
•
•
•
Address Bus Width with a range of 0 … 24-bit
Data Bus Width 8-bit or 16-bit
Bus Operation Multiplexed or Demultiplexed
The bus interface uses Port 10 and Port 2 for addresses and data. In the demultiplexed
bus modes, the lower addresses are output separately on Port 0 and Port 1. The number
of active segment address lines is selectable, restricting the external address space to
8 Mbytes … 64 Kbytes. This is required when interface lines shall be assigned to Port 2.
Up to four external CS signals (three windows plus default) can be generated and output
on Port 4 in order to save external glue logic. External modules can be directly
connected to the common address/data bus and their individual select lines.
Important timing characteristics of the external bus interface are programmable (with
registers TCONCSx/FCONCSx) to allow the user to adapt it to a wide range of different
types of memories and external peripherals.
Access to very slow memories or modules with varying access times is supported by a
special ‘Ready’ function. The active level of the control input signal is selectable.
In addition, up to four independent address windows may be defined (using registers
ADDRSELx) to control access to resources with different bus characteristics. These
address windows are arranged hierarchically where window 4 overrides window 3, and
window 2 overrides window 1. All accesses to locations not covered by these four
address windows are controlled by TCONCS0/FCONCS0. The currently active window
can generate a chip select signal.
The external bus timing is based on the rising edge of the reference clock output
CLKOUT. The external bus protocol is compatible with that of the standard C166 Family.
1) Bus modes are switched dynamically if several address windows with different mode settings are used.
Data Sheet
35
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
3.3
Central Processing Unit (CPU)
The core of the CPU consists of a 5-stage execution pipeline with a 2-stage instruction-
fetch pipeline, a 16-bit arithmetic and logic unit (ALU), a 32-bit/40-bit multiply and
accumulate unit (MAC), a register-file providing three register banks, and dedicated
SFRs. The ALU features a multiply-and-divide unit, a bit-mask generator, and a barrel
shifter.
PSRAM
Flash/ROM
PMU
CPU
Prefetch
CSP
IP
VECSEG
TFR
2-Stage
Prefetch
Pipeline
Unit
CPUCON1
CPUCON2
Branch
Unit
5-Stage
Pipeline
Injection/
Exception
Handler
DPRAM
Return
Stack
FIFO
IFU
DPP0
IPIP
IDX0
IDX1
QX0
QX1
QR0
QR1
SPSEG
SP
CP
R15
DPP1
DPP2
DPP3
STKOV
STKUN
R15
R14
R14
GPRs
GPRs
+/-
+/-
ADU
s
R1
R0
R1
Division Unit
Multiply Unit
Bit-Mask-Gen.
Barrel-Shifter
R0
Multiply
Unit
MRW
R0
R0
MCW
MSW
MDC
PSW
RF
+/-
+/-
MDH
MDL
ONES
ALU
DSRAM
EBC
Peripherals
Buffer
WB
MAH
MAL
ZEROS
MAC
DMU
mca04917_x.vsd
Figure 4
CPU Block Diagram
Data Sheet
36
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
With this hardware most XC226x instructions can be executed in a single machine cycle
of 12.5 ns with an 80-MHz CPU clock. For example, shift and rotate instructions are
always processed during one machine cycle, no matter how many bits are shifted. Also,
multiplication and most MAC instructions execute in one cycle. All multiple-cycle
instructions have been optimized so that they can be executed very fast; for example, a
32-/16-bit division is started within 4 cycles while the remaining cycles are executed in
the background. Another pipeline optimization, the branch target prediction, eliminates
the execution time of branch instructions if the prediction was correct.
The CPU has a register context consisting of up to three register banks with 16 word-
wide GPRs each at its disposal. One of these register banks is physically allocated within
the on-chip DPRAM area. A Context Pointer (CP) register determines the base address
of the active register bank accessed by the CPU at any time. The number of these
register bank copies is only restricted by the available internal RAM space. For easy
parameter passing, a register bank may overlap others.
A system stack of up to 32 Kwords is provided for storage of temporary data. The system
stack can be allocated to any location within the address space (preferably in the on-chip
RAM area); it is accessed by the CPU with the stack pointer (SP) register. Two separate
SFRs, STKOV and STKUN, are implicitly compared with the stack pointer value during
each stack access to detect stack overflow or underflow.
The high performance of the CPU hardware implementation can be best utilized by the
programmer with the highly efficient XC226x instruction set. This includes the following
instruction classes:
•
•
•
•
•
•
•
•
•
•
•
•
•
Standard Arithmetic Instructions
DSP-Oriented Arithmetic Instructions
Logical Instructions
Boolean Bit Manipulation Instructions
Compare and Loop Control Instructions
Shift and Rotate Instructions
Prioritize Instruction
Data Movement Instructions
System Stack Instructions
Jump and Call Instructions
Return Instructions
System Control Instructions
Miscellaneous Instructions
The basic instruction length is either 2 or 4 bytes. Possible operand types are bits, bytes
and words. A variety of direct, indirect or immediate addressing modes are provided to
specify the required operands.
Data Sheet
37
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
3.4
Interrupt System
With a minimum interrupt response time of 7/111) CPU clocks (in the case of internal
program execution), the XC226x can react quickly to the occurrence of non-deterministic
events.
The architecture of the XC226x supports several mechanisms for fast and flexible
response to service requests; these can be generated from various sources internal or
external to the microcontroller. Any of these interrupt requests can be programmed to be
serviced by the Interrupt Controller or by the Peripheral Event Controller (PEC).
Where in a standard interrupt service the current program execution is suspended and
a branch to the interrupt vector table is performed, just one cycle is ‘stolen’ from the
current CPU activity to perform a PEC service. A PEC service implies a single byte or
word data transfer between any two memory locations with an additional increment of
either the PEC source pointer, the destination pointer, or both. An individual PEC
transfer counter is implicitly decremented for each PEC service except when performing
in the continuous transfer mode. When this counter reaches zero, a standard interrupt is
performed to the corresponding source-related vector location. PEC services are
particularly well suited to supporting the transmission or reception of blocks of data. The
XC226x has eight PEC channels, each whith fast interrupt-driven data transfer
capabilities.
Each of the possible interrupt nodes has a separate control register containing an
interrupt request flag, an interrupt enable flag and an interrupt priority bitfield. Each node
can be programmed by its related register to one of sixteen interrupt priority levels. Once
accepted by the CPU, an interrupt service can only be interrupted by a higher-priority
service request. For standard interrupt processing, each possible interrupt node has a
dedicated vector location.
Fast external interrupt inputs can service external interrupts with high-precision
requirements. These fast interrupt inputs feature programmable edge detection (rising
edge, falling edge, or both edges).
Software interrupts are supported by the ‘TRAP’ instruction in combination with an
individual trap (interrupt) number.
Table 6 shows all of the possible XC226x interrupt sources and the corresponding
hardware-related interrupt flags, vectors, vector locations and trap (interrupt) numbers.
Note: Interrupt nodes which are not assigned to peripherals (unassigned nodes) may be
used to generate software-controlled interrupt requests by setting the respective
interrupt request bit (xIR).
1) Depending if the jump cache is used or not.
Data Sheet
38
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
Table 6
XC226x Interrupt Nodes
Source of Interrupt or PEC
Service Request
Control
Register
Vector
Trap
Number
Location1)
CAPCOM Register 16, or
ERU Request 0
CC2_CC16IC
CC2_CC17IC
CC2_CC18IC
CC2_CC19IC
CC2_CC20IC
CC2_CC21IC
CC2_CC22IC
CC2_CC23IC
CC2_CC24IC
CC2_CC25IC
CC2_CC26IC
CC2_CC27IC
CC2_CC28IC
CC2_CC29IC
xx’0040H
xx’0044H
xx’0048H
xx’004CH
xx’0050H
xx’0054H
xx’0058H
xx’005CH
xx’0060H
xx’0064H
xx’0068H
xx’006CH
xx’0070H
xx’0074H
10H / 16D
11H / 17D
12H / 18D
13H / 19D
14H / 20D
15H / 21D
16H / 22D
17H / 23D
18H / 24D
19H / 25D
1AH / 26D
1BH / 27D
1CH / 28D
1DH / 29D
CAPCOM Register 17, or
ERU Request 1
CAPCOM Register 18, or
ERU Request 2
CAPCOM Register 19, or
ERU Request 3
CAPCOM Register 20, or
USIC0 Request 6
CAPCOM Register 21, or
USIC0 Request 7
CAPCOM Register 22, or
USIC1 Request 6
CAPCOM Register 23, or
USIC1 Request 7
CAPCOM Register 24, or
ERU Request 0
CAPCOM Register 25, or
ERU Request 1
CAPCOM Register 26, or
ERU Request 2
CAPCOM Register 27, or
ERU Request 3
CAPCOM Register 28, or
USIC2 Request 6
CAPCOM Register 29, or
USIC2 Request 7
CAPCOM Register 30
CAPCOM Register 31
GPT1 Timer 2
CC2_CC30IC
CC2_CC31IC
xx’0078H
xx’007CH
1EH / 30D
1FH / 31D
20H / 32D
21H / 33D
22H / 34D
GPT12E_T2IC xx’0080H
GPT12E_T3IC xx’0084H
GPT12E_T4IC xx’0088H
GPT1 Timer 3
GPT1 Timer 4
Data Sheet
39
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
Table 6
XC226x Interrupt Nodes (cont’d)
Source of Interrupt or PEC
Service Request
Control
Register
Vector
Trap
Number
Location1)
GPT2 Timer 5
GPT12E_T5IC xx’008CH
GPT12E_T6IC xx’0090H
GPT12E_CRIC xx’0094H
23H / 35D
24H / 36D
25H / 37D
26H / 38D
27H / 39D
28H / 40D
29H / 41D
2AH / 42D
2BH / 43D
2CH / 44D
2DH / 45D
2EH / 46D
2FH / 47D
30H / 48D
31H / 49D
32H / 50D
33H / 51D
34H / 52D
35H / 53D
36H / 54D
37H / 55D
38H / 56D
39H / 57D
3AH / 58D
3BH / 59D
3CH / 60D
3DH / 61D
3EH / 62D
3FH / 63D
40H / 64D
GPT2 Timer 6
GPT2 CAPREL Register
CAPCOM Timer 7
CC2_T7IC
CC2_T8IC
ADC_0IC
xx’0098H
xx’009CH
xx’00A0H
xx’00A4H
xx’00A8H
xx’00ACH
xx’00B0H
xx’00B4H
xx’00B8H
xx’00BCH
xx’00C0H
xx’00C4H
xx’00C8H
xx’00CCH
xx’00D0H
xx’00D4H
xx’00D8H
xx’00DCH
xx’00E0H
xx’00E4H
xx’00E8H
xx’00ECH
xx’00F0H
xx’00F4H
xx’00F8H
xx’00FCH
xx’0100H
CAPCOM Timer 8
A/D Converter Request 0
A/D Converter Request 1
A/D Converter Request 2
A/D Converter Request 3
A/D Converter Request 4
A/D Converter Request 5
A/D Converter Request 6
A/D Converter Request 7
CCU60 Request 0
CCU60 Request 1
CCU60 Request 2
CCU60 Request 3
CCU61 Request 0
CCU61 Request 1
CCU61 Request 2
CCU61 Request 3
CCU62 Request 0
CCU62 Request 1
CCU62 Request 2
CCU62 Request 3
CCU63 Request 0
CCU63 Request 1
CCU63 Request 2
CCU63 Request 3
CAN Request 0
ADC_1IC
ADC_2IC
ADC_3IC
ADC_4IC
ADC_5IC
ADC_6IC
ADC_7IC
CCU60_0IC
CCU60_1IC
CCU60_2IC
CCU60_3IC
CCU61_0IC
CCU61_1IC
CCU61_2IC
CCU61_3IC
CCU62_0IC
CCU62_1IC
CCU62_2IC
CCU62_3IC
CCU63_0IC
CCU63_1IC
CCU63_2IC
CCU63_3IC
CAN_0IC
Data Sheet
40
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
Table 6
XC226x Interrupt Nodes (cont’d)
Source of Interrupt or PEC
Service Request
Control
Register
Vector
Trap
Number
Location1)
CAN Request 1
CAN_1IC
CAN_2IC
CAN_3IC
CAN_4IC
CAN_5IC
CAN_6IC
CAN_7IC
CAN_8IC
CAN_9IC
CAN_10IC
CAN_11IC
CAN_12IC
CAN_13IC
CAN_14IC
CAN_15IC
U0C0_0IC
U0C0_1IC
U0C0_2IC
U0C1_0IC
U0C1_1IC
U0C1_2IC
U1C0_0IC
U1C0_1IC
U1C0_2IC
U1C1_0IC
U1C1_1IC
U1C1_2IC
U2C0_0IC
U2C0_1IC
U2C0_2IC
xx’0104H
xx’0108H
xx’010CH
xx’0110H
xx’0114H
xx’0118H
xx’011CH
xx’0120H
xx’0124H
xx’0128H
xx’012CH
xx’0130H
xx’0134H
xx’0138H
xx’013CH
xx’0140H
xx’0144H
xx’0148H
xx’014CH
xx’0150H
xx’0154H
xx’0158H
xx’015CH
xx’0160H
xx’0164H
xx’0168H
xx’016CH
xx’0170H
xx’0174H
xx’0178H
41H / 65D
42H / 66D
43H / 67D
44H / 68D
45H / 69D
46H / 70D
47H / 71D
48H / 72D
49H / 73D
4AH / 74D
4BH / 75D
4CH / 76D
4DH / 77D
4EH / 78D
4FH / 79D
50H / 80D
51H / 81D
52H / 82D
53H / 83D
54H / 84D
55H / 85D
56H / 86D
57H / 87D
58H / 88D
59H / 89D
5AH / 90D
5BH / 91D
5CH / 92D
5DH / 93D
5EH / 94D
CAN Request 2
CAN Request 3
CAN Request 4
CAN Request 5
CAN Request 6
CAN Request 7
CAN Request 8
CAN Request 9
CAN Request 10
CAN Request 11
CAN Request 12
CAN Request 13
CAN Request 14
CAN Request 15
USIC0 Cannel 0, Request 0
USIC0 Cannel 0, Request 1
USIC0 Cannel 0, Request 2
USIC0 Cannel 1, Request 0
USIC0 Cannel 1, Request 1
USIC0 Cannel 1, Request 2
USIC1 Cannel 0, Request 0
USIC1 Cannel 0, Request 1
USIC1 Cannel 0, Request 2
USIC1 Cannel 1, Request 0
USIC1 Cannel 1, Request 1
USIC1 Cannel 1, Request 2
USIC2 Cannel 0, Request 0
USIC2 Cannel 0, Request 1
USIC2 Cannel 0, Request 2
Data Sheet
41
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
Table 6
XC226x Interrupt Nodes (cont’d)
Source of Interrupt or PEC
Service Request
Control
Register
Vector
Trap
Number
Location1)
USIC2 Cannel 1, Request 0
USIC2 Cannel 1, Request 1
USIC2 Cannel 1, Request 2
Unassigned node
Unassigned node
Unassigned node
Unassigned node
Unassigned node
Unassigned node
Unassigned node
Unassigned node
Unassigned node
SCU Request 1
U2C1_0IC
xx’017CH
xx’0180H
xx’0184H
xx’0188H
xx’018CH
xx’0190H
xx’0194H
xx’0198H
xx’019CH
xx’01A0H
xx’01A4H
xx’01A8H
xx’01ACH
xx’01B0H
xx’01B4H
xx’01B8H
xx’01BCH
5FH / 95D
60H / 96D
U2C1_1IC
U2C1_2IC
61H / 97D
–
62H / 98D
–
63H / 99D
–
64H / 100D
65H / 101D
66H / 102D
67H / 103D
68H / 104D
69H / 105D
6AH / 106D
6BH / 107D
6CH / 108D
6DH / 109D
6EH / 110D
6FH / 111D
–
–
–
–
–
–
SCU_1IC
SCU_0IC
PFM_IC
RTC_IC
EOPIC
SCU Request 0
Program Flash Modules
RTC
End of PEC Subchannel
1) Register VECSEG defines the segment where the vector table is located.
Bitfield VECSC in register CPUCON1 defines the distance between two adjacent vectors. This table
represents the default setting with a distance of 4 (two words) between two vectors.
Data Sheet
42
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
The XC226x includes an excellent mechanism to identify and process exceptions or
error conditions that arise during run-time, the so-called ‘Hardware Traps’. A hardware
trap causes an immediate non-maskable system reaction similar to a standard interrupt
service (branching to a dedicated vector table location). The occurrence of a hardware
trap is also indicated by a single bit in the trap flag register (TFR). Unless another higher-
priority trap service is in progress, a hardware trap will interrupt any ongoing program
execution. In turn, hardware trap services can normally not be interrupted by standard
or PEC interrupts.
Table 7 shows all possible exceptions or error conditions that can arise during runtime:
Table 7
Trap Summary
Exception Condition
Trap
Flag
Trap
Vector
Vector
Trap
Trap
Location1) Number Priority
Reset Functions
–
RESET
xx’0000H
00H
III
Class A Hardware Traps:
•
•
•
•
System Request 0
Stack Overflow
Stack Underflow
Software Break
SR0
STKOF
STKUF
SR0TRAP
STOTRAP
STUTRAP
xx’0008H
xx’0010H
xx’0018H
02H
04H
06H
08H
II
II
II
II
SOFTBRK SBRKTRAP xx’0020H
Class B Hardware Traps:
•
•
•
•
System Request 1
Undefined Opcode
Memory Access Error
Protected Instruction
Fault
SR1
BTRAP
xx’0028H
xx’0028H
xx’0028H
xx’0028H
0AH
0AH
0AH
0AH
I
I
I
I
UNDOPC BTRAP
ACER
PRTFLT
BTRAP
BTRAP
•
Illegal Word Operand
Access
ILLOPA
BTRAP
xx’0028H
0AH
I
Reserved
–
–
–
–
[2CH - 3CH] [0BH -
0FH]
–
Software Traps:
Any
Any
Current
CPU
Priority
•
TRAP Instruction
[xx’0000H - [00H -
xx’01FCH] 7FH]
in steps of
4H
1) Register VECSEG defines the segment where the vector table is located to.
Bitfield VECSC in register CPUCON1 defines the distance between two adjacent vectors. This table
represents the default setting, with a distance of 4 (two words) between two vectors.
Data Sheet
43
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
3.5
On-Chip Debug Support (OCDS)
The On-Chip Debug Support system built into the XC226x provides a broad range of
debug and emulation features. User software running on the XC226x can be debugged
within the target system environment.
The OCDS is controlled by an external debugging device via the debug interface. This
consists of the JTAG port conforming to IEEE-1149. The debug interface can be
completed with an optional break interface.
The debugger controls the OCDS with a set of dedicated registers accessible via the
debug interface (JTAG). In addition the OCDS system can be controlled by the CPU, e.g.
by a monitor program. An injection interface allows the execution of OCDS-generated
instructions by the CPU.
Multiple breakpoints can be triggered by on-chip hardware, by software, or by an
external trigger input. Single stepping is supported, as is the injection of arbitrary
instructions and read/write access to the complete internal address space. A breakpoint
trigger can be answered with a CPU halt, a monitor call, a data transfer, or/and the
activation of an external signal.
Tracing data can be obtained via the debug interface, or via the external bus interface
for increased performance.
The JTAG interface uses four interface signals, to communicate with external circuitry.
The debug interface can be amended with two optional break lines.
Data Sheet
44
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
3.6
Capture/Compare Unit (CAPCOM2)
The CAPCOM2 unit supports generation and control of timing sequences on up to
16 channels with a maximum resolution of one system clock cycle (eight cycles in
staggered mode). The CAPCOM2 unit is typically used to handle high-speed I/O tasks
such as pulse and waveform generation, pulse width modulation (PWM), digital to
analog (D/A) conversion, software timing, or time recording with respect to external
events.
Two 16-bit timers (T7/T8) with reload registers provide two independent time bases for
the capture/compare register array.
The input clock for the timers is programmable to a number of prescaled values of the
internal system clock. It may also be derived from an overflow/underflow of timer T6 in
module GPT2. This provides a wide range for the timer period and resolution while
allowing precise adjustments for application-specific requirements. An external count
input for CAPCOM2 timer T7 allows event scheduling for the capture/compare registers
with respect to external events.
The capture/compare register array contains 16 dual purpose capture/compare
registers. Each may be individually allocated to either CAPCOM2 timer T7 or T8 and
programmed for a capture or compare function.
12 registers of the CAPCOM2 module have one port pin associated with it. This serves
as an input pin to trigger the capture function or as an output pin to indicate the
occurrence of a compare event.
Table 8
Compare Modes (CAPCOM2)
Compare Modes
Function
Mode 0
Interrupt-only compare mode;
Several compare interrupts per timer period are possible
Mode 1
Mode 2
Mode 3
Pin toggles on each compare match;
Several compare events per timer period are possible
Interrupt-only compare mode;
Only one compare interrupt per timer period is generated
Pin set ‘1’ on match; pin reset ‘0’ on compare timer overflow;
Only one compare event per timer period is generated
Double Register
Mode
Two registers operate on one pin;
Pin toggles on each compare match;
Several compare events per timer period are possible
Single Event Mode
Generates single edges or pulses;
Can be used with any compare mode
Data Sheet
45
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
When a capture/compare register has been selected for capture mode, the current
contents of the allocated timer will be latched (‘captured’) into the capture/compare
register in response to an external event at the port pin associated with this register. In
addition, a specific interrupt request for this capture/compare register is generated.
Either a positive, a negative, or both a positive and a negative external signal transition
at the pin can be selected as the triggering event.
The contents of all registers selected for one of the five compare modes are continuously
compared with the contents of the allocated timers.
When a match occurs between the timer value and the value in a capture/compare
register, specific actions will be taken based on the compare mode selected.
Data Sheet
46
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
Reload Reg.
T7REL
fCC
T7
T7IN
T6OUF
Input
Control
Timer T7
T7IRQ
CC16IO
CC17IO
CC16IRQ
CC17IRQ
Mode
Control
(Capture
or
Sixteen
16-bit
Capture/
Compare
Registers
Compare)
CC31IO
CC31IRQ
T8IRQ
T8
Input
fCC
Timer T8
T6OUF
Control
Reload Reg.
T8REL
MC_CAPCOM2_BLOCKDIAG
Figure 5
CAPCOM2 Unit Block Diagram
Data Sheet
47
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
3.7
Capture/Compare Units CCU6x
The XC226x features up to four CCU6 units (CCU60, CCU61, CCU62, CCU63).
The CCU6 is a high-resolution capture and compare unit with application-specific
modes. It provides inputs to start the timers synchronously, an important feature in
devices with several CCU6 modules.
The module provides two independent timers (T12, T13), that can be used for PWM
generation, especially for AC motor control. Additionally, special control modes for block
commutation and multi-phase machines are supported.
Timer 12 Features
•
Three capture/compare channels, where each channel can be used either as a
capture or as a compare channel.
•
Supports generation of a three-phase PWM (six outputs, individual signals for high-
side and low-side switches)
•
•
•
•
•
•
•
•
16-bit resolution, maximum count frequency = peripheral clock
Dead-time control for each channel to avoid short circuits in the power stage
Concurrent update of the required T12/13 registers
Center-aligned and edge-aligned PWM can be generated
Single-shot mode supported
Many interrupt request sources
Hysteresis-like control mode
Automatic start on a HW event (T12HR, for synchronization purposes)
Timer 13 Features
•
•
•
•
•
•
One independent compare channel with one output
16-bit resolution, maximum count frequency = peripheral clock
Can be synchronized to T12
Interrupt generation at period match and compare match
Single-shot mode supported
Automatic start on a HW event (T13HR, for synchronization purposes)
Additional Features
•
•
•
•
•
•
•
Block commutation for brushless DC drives implemented
Position detection via Hall sensor pattern
Automatic rotational speed measurement for block commutation
Integrated error handling
Fast emergency stop without CPU load via external signal (CTRAP)
Control modes for multi-channel AC drives
Output levels can be selected and adapted to the power stage
Data Sheet
48
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
CCU6 Module Kernel
fSYS
compare
Channel 0
T12 Channel 1
Channel 2
1
Dead-
time
Control
Multi-
channel
Control
Trap
Control
TxHR
1
1
start
Interrupts
T13 Channel 3
compare
1
3
2
2
2
3
1
Input / Output Control
mc_ccu6_blockdiagram.vsd
Figure 6
CCU6 Block Diagram
Timer T12 can work in capture and/or compare mode for its three channels. The modes
can also be combined. Timer T13 can work in compare mode only. The multi-channel
control unit generates output patterns that can be modulated by timer T12 and/or timer
T13. The modulation sources can be selected and combined for signal modulation.
Data Sheet
49
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
3.8
General Purpose Timer (GPT12E) Unit
The GPT12E unit is a very flexible multifunctional timer/counter structure which can be
used for many different timing tasks such as event timing and counting, pulse width and
duty cycle measurements, pulse generation, or pulse multiplication.
The GPT12E unit incorporates five 16-bit timers organized in two separate modules,
GPT1 and GPT2. Each timer in each module may either operate independently in a
number of different modes or be concatenated with another timer of the same module.
Each of the three timers T2, T3, T4 of module GPT1 can be configured individually for
one of four basic modes of operation: Timer, Gated Timer, Counter, and Incremental
Interface Mode. In Timer Mode, the input clock for a timer is derived from the system
clock and divided by a programmable prescaler. Counter Mode allows timer clocking in
reference to external events.
Pulse width or duty cycle measurement is supported in Gated Timer Mode, where the
operation of a timer is controlled by the ‘gate’ level on an external input pin. For these
purposes each timer has one associated port pin (TxIN1)) which serves as a gate or clock
input. The maximum resolution of the timers in module GPT1 is 4 system clock cycles.
The counting direction (up/down) for each timer can be programmed by software or
altered dynamically by an external signal on a port pin (TxEUD1)), e.g. to facilitate
position tracking.
In Incremental Interface Mode the GPT1 timers1) can be directly connected to the
incremental position sensor signals A and B through their respective inputs TxIN and
TxEUD. Direction and counting signals are internally derived from these two input
signals, so that the contents of the respective timer Tx corresponds to the sensor
position. The third position sensor signal TOP0 can be connected to an interrupt input.
Timer T3 has an output toggle latch (T3OTL) which changes its state on each timer
overflow/underflow. The state of this latch may be output on pin T3OUT e.g. for time out
monitoring of external hardware components. It may also be used internally to clock
timers T2 and T4 for measuring long time periods with high resolution.
In addition to the basic operating modes, T2 may be configured as reload or capture
register for timer T3. A timer used as capture or reload register is stopped. The contents
of timer T3 is captured into T2 in response to a signal at the associated input pin (TxIN).
Timer T3 is reloaded with the contents of T2, triggered either by an external signal or a
selectable state transition of its toggle latch T3OTL.
1) Exception: Timer T4 is not connected to pins.
Data Sheet
50
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
T3CON.BPS1
2n:1
Basic Clock
fGPT
Interrupt
Request
(T2IRQ)
Aux. Timer T2
U/D
T2IN
T2
Mode
Control
Reload
Capture
T2EUD
Interrupt
Request
(T3IRQ)
T3
Core Timer T3
T3OTL
Toggle
Latch
T3IN
Mode
Control
T3OUT
U/D
T3EUD
Capture
Reload
T4IN
T4
Mode
Control
Interrupt
Request
(T4IRQ)
Aux. Timer T4
T4EUD
U/D
MC_GPT_BLOCK1
Figure 7
Block Diagram of GPT1
Data Sheet
51
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
With its maximum resolution of 2 system clock cycles, the GPT2 module provides
precise event control and time measurement. It includes two timers (T5, T6) and a
capture/reload register (CAPREL). Both timers can be clocked with an input clock which
is derived from the CPU clock via a programmable prescaler or with external signals. The
counting direction (up/down) for each timer can be programmed by software or altered
dynamically with an external signal on a port pin (TxEUD1)). Concatenation of the timers
is supported with the output toggle latch (T6OTL) of timer T6, which changes its state on
each timer overflow/underflow.
The state of this latch may be used to clock timer T5, and/or it may be output on pin
T6OUT. The overflows/underflows of timer T6 can also be used to clock the CAPCOM2
timers and to initiate a reload from the CAPREL register.
The CAPREL register can capture the contents of timer T5 based on an external signal
transition on the corresponding port pin (CAPIN); timer T5 may optionally be cleared
after the capture procedure. This allows the XC226x to measure absolute time
differences or to perform pulse multiplication without software overhead.
The capture trigger (timer T5 to CAPREL) can also be generated upon transitions of
GPT1 timer T3 inputs T3IN and/or T3EUD. This is especially advantageous when T3
operates in Incremental Interface Mode.
1) Exception: T5EUD is not connected to a pin.
Data Sheet
52
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
T6CON.BPS2
2n:1
Basic Clock
fGPT
Interrupt
Request
(T5IRQ)
GPT2 Timer T5
T5IN
T5
Mode
Control
U/D
T5EUD
Clear
Capture
CAPIN
GPT2 CAPREL
CAPREL
Mode
Control
Interrupt
Request
(CRIRQ)
Reload
Clear
T3IN/
T3EUD
Interrupt
Request
(T6IRQ)
Toggle
FF
GPT2 Timer T6
U/D
T6OTL
T6OUT
T6OUF
T6
Mode
Control
T6IN
T6EUD
MC_GPT_BLOCK2
Figure 8
Block Diagram of GPT2
Data Sheet
53
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
3.9
Real Time Clock
The Real Time Clock (RTC) module of the XC226x can be clocked with a clock signal
selected from internal sources or external sources (pins).
The RTC basically consists of a chain of divider blocks:
•
•
•
Selectable 32:1 and 8:1 dividers (on - off)
The reloadable 16-bit timer T14
The 32-bit RTC timer block (accessible via registers RTCH and RTCL) consisting of:
– a reloadable 10-bit timer
– a reloadable 6-bit timer
– a reloadable 6-bit timer
– a reloadable 10-bit timer
All timers count up. Each timer can generate an interrupt request. All requests are
combined to a common node request.
fRTC
MUX
:
32
RUN
RTCINT
MUX
Interrupt Sub Node
: 8
CNT
INT0
CNT
INT1
CNT
INT2
CNT
INT3
PRE
REFCLK
REL-Register
T14REL
10 Bits
6 Bits
6 Bits
10 Bits
fCNT
T14
10 Bits
6 Bits
6 Bits
10 Bits
T14-Register
CNT-Register
MCB05568B
Figure 9
RTC Block Diagram
Note: The registers associated with the RTC are only affected by a power reset.
Data Sheet
54
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
The RTC module can be used for different purposes:
•
•
System clock to determine the current time and date
Cyclic time-based interrupt, to provide a system time tick independent of CPU
frequency and other resources
•
•
48-bit timer for long-term measurements
Alarm interrupt at a defined time
Data Sheet
55
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
3.10
A/D Converters
For analog signal measurement, up to two 10-bit A/D converters (ADC0, ADC1) with
11 + 5 multiplexed input channels and a sample and hold circuit have been integrated
on-chip. They use the successive approximation method. The sample time (to charge
the capacitors) and the conversion time are programmable so that they can be adjusted
to the external circuit. The A/D converters can also operate in 8-bit conversion mode,
further reducing the conversion time.
Several independent conversion result registers, selectable interrupt requests, and
highly flexible conversion sequences provide a high degree of programmability to meet
the application requirements. Both modules can be synchronized to allow parallel
sampling of two input channels.
For applications that require more analog input channels, external analog multiplexers
can be controlled automatically.
For applications that require fewer analog input channels, the remaining channel inputs
can be used as digital input port pins.
The A/D converters of the XC226x support two types of request sources which can be
triggered by several internal and external events.
•
Parallel requests are activated at the same time and then executed in a predefined
sequence.
•
Queued requests are executed in a user-defined sequence.
In addition, the conversion of a specific channel can be inserted into a running sequence
without disturbing that sequence. All requests are arbitrated according to the priority
level assigned to them.
Data reduction features, such as limit checking or result accumulation, reduce the
number of required CPU access operations allowing the precise evaluation of
analoginputs (high conversion rate) even at a low CPU speed.
The Peripheral Event Controller (PEC) can be used to control the A/D converters or to
automatically store conversion results to a table in memory for later evaluation, without
requiring the overhead of entering and exiting interrupt routines for each data transfer.
Each A/D converter contains eight result registers which can be concatenated to build a
result FIFO. Wait-for-read mode can be enabled for each result register to prevent the
loss of conversion data.
In order to decouple analog inputs from digital noise and to avoid input trigger noise,
those pins used for analog input can be disconnected from the digital input stages under
software control. This can be selected for each pin separately with registers P5_DIDIS
and P15_DIDIS (Port x Digital Input Disable).
The Auto-Power-Down feature of the A/D converters minimizes the power consumption
when no conversion is in progress.
Data Sheet
56
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
3.11
Universal Serial Interface Channel Modules (USIC)
The XC226x includes three USIC modules (USIC0, USIC1, USIC2), each providing two
serial communication channels.
The Universal Serial Interface Channel (USIC) module is based on a generic data shift
and data storage structure which is identical for all supported serial communication
protocols. Each channel supports complete full-duplex operation with a basic data buffer
structure (one transmit buffer and two receive buffer stages). In addition, the data
handling software can use FIFOs.
The protocol part (generation of shift clock/data/control signals) is independent of the
general part and is handled by protocol-specific preprocessors (PPPs).
The USIC’s input/output lines are connected to pins by a pin routing unit. The inputs and
outputs of each USIC channel can be assigned to different interface pins, providing great
flexibility to the application software. All assignments can be made during runtime.
Bus
Buffer & Shift Structure Protocol Preprocessors
Pins
Control 0
PPP_A
PPP_B
PPP_C
PPP_D
DBU
0
DSU
0
Control 1
PPP_A
PPP_B
PPP_C
PPP_D
DBU
1
DSU
1
fsys
Fractional
Dividers
Baud rate
Generators
USIC_basic.vsd
Figure 10
General Structure of a USIC Module
The regular structure of the USIC module brings the following advantages:
•
•
•
Higher flexibility through configuration with same look-and-feel for data management
Reduced complexity for low-level drivers serving different protocols
Wide range of protocols with improved performances (baud rate, buffer handling)
Data Sheet
57
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
Target Protocols
Each USIC channel can receive and transmit data frames with a selectable data word
width from 1 to 16 bits in each of the following protocols:
•
•
•
UART (asynchronous serial channel)
– maximum baud rate: fSYS / 4
– data frame length programmable from 1 to 63 bits
– MSB or LSB first
LIN Support (Local Interconnect Network)
– maximum baud rate: fSYS / 16
– checksum generation under software control
– baud rate detection possible by built-in capture event of baud rate generator
SSC/SPI/QSPI (synchronous serial channel with or without data buffer)
– maximum baud rate in slave mode: fSYS
– maximum baud rate in master mode: fSYS / 2, limited by loop delay
– number of data bits programmable from 1 to 63, more with explicit stop condition
– MSB or LSB first
– optional control of slave select signals
•
•
IIC (Inter-IC Bus)
– supports baud rates of 100 kbit/s and 400 kbit/s
IIS (Inter-IC Sound Bus)
– maximum baud rate: fSYS / 2 for transmitter, fSYS for receiver
Note: Depending on the selected functions (such as digital filters, input synchronization
stages, sample point adjustment, etc.), the maximum achievable baud rate can be
limited. Please note that there may be additional delays, such as internal or
external propagation delays and driver delays (e.g. for collision detection in UART
mode, for IIC, etc.).
Data Sheet
58
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
3.12
MultiCAN Module
The MultiCAN module contains up to five independently operating CAN nodes with Full-
CAN functionality which are able to exchange Data and Remote Frames using a
gateway function. Transmission and reception of CAN frames is handled in accordance
with CAN specification V2.0 B (active). Each CAN node can receive and transmit
standard frames with 11-bit identifiers as well as extended frames with 29-bit identifiers.
All CAN nodes share a common set of up to 128 message objects. Each message object
can be individually allocated to one of the CAN nodes. Besides serving as a storage
container for incoming and outgoing frames, message objects can be combined to build
gateways between the CAN nodes or to set up a FIFO buffer.
The message objects are organized in double-chained linked lists, where each CAN
node has its own list of message objects. A CAN node stores frames only into message
objects that are allocated to its own message object list and it transmits only messages
belonging to this message object list. A powerful, command-driven list controller
performs all message object list operations.
MultiCAN Module Kernel
TXDC4
CAN
Node 4
RXDC4
Clock
Control
fCAN
.
.
.
.
.
.
.
.
.
Message
Object
Buffer
Linked
List
Control
Address
Decoder
Port
Control
TXDC1
RXDC1
CAN
Node 1
128
Objects
TXDC0
RXDC0
CAN
Node 0
Interrupt
Control
CAN Control
mc_multican_block5.vsd
Figure 11
Block Diagram of MultiCAN Module
Data Sheet
59
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
MultiCAN Features
•
CAN functionality conforming to CAN specification V2.0 B active for each CAN node
(compliant to ISO 11898)
•
•
•
•
•
•
Up to five independent CAN nodes
Up to 128 independent message objects (shared by the CAN nodes)
Dedicated control registers for each CAN node
Data transfer rate up to 1 Mbit/s, individually programmable for each node
Flexible and powerful message transfer control and error handling capabilities
Full-CAN functionality for message objects:
– Can be assigned to one of the CAN nodes
– Configurable as transmit or receive objects, or as message buffer FIFO
– Handle 11-bit or 29-bit identifiers with programmable acceptance mask for filtering
– Remote Monitoring Mode, and frame counter for monitoring
Automatic Gateway Mode support
16 individually programmable interrupt nodes
Analyzer mode for CAN bus monitoring
•
•
•
Data Sheet
60
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
3.13
Watchdog Timer
The Watchdog Timer is one of the fail-safe mechanisms which have been implemented
to prevent the controller from malfunctioning for longer periods of time.
The Watchdog Timer is always enabled after an application reset of the chip. It can be
disabled and enabled at any time by executing the instructions DISWDT and ENWDT
respectively. The software has to service the Watchdog Timer before it overflows. If this
is not the case because of a hardware or software failure, the Watchdog Timer
overflows, generating a prewarning interrupt and then a reset request.
The Watchdog Timer is a 16-bit timer clocked with the system clock divided by 16,384
or 256. The Watchdog Timer register is set to a prespecified reload value (stored in
WDTREL) in order to allow further variation of the monitored time interval. Each time it
is serviced by the application software, the Watchdog Timer is reloaded and the
prescaler is cleared.
Time intervals between 3.2 µs and 13.4 s can be monitored (@ 80 MHz).
The default Watchdog Timer interval after power-up is 6.5 ms (@ 10 MHz).
3.14
Clock Generation
The Clock Generation Unit can generate the system clock signal fSYS for the XC226x
from a number of external or internal clock sources:
•
•
•
•
External clock signals with pad or core voltage levels
External crystal using the on-chip oscillator
On-chip clock source for operation without crystal
Wake-up clock (ultra-low-power) to further reduce power consumption
The programmable on-chip PLL with multiple prescalers generates a clock signal for
maximum system performance from standard crystals or from the on-chip clock source.
See also Section 4.6.2.
The Oscillator Watchdog (OWD) generates an interrupt if the crystal oscillator frequency
falls below a certain limit or stops completely. In this case, the system can be supplied
with an emergency clock to enable operation even after an external clock failure.
All available clock signals can be output on one of two selectable pins.
Data Sheet
61
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
3.15
Parallel Ports
The XC226x provides up to 75 I/O lines which are organized into 7 input/output ports and
2 input ports. All port lines are bit-addressable, and all input/output lines can be
individually (bit-wise) configured via port control registers. This configuration selects the
direction (input/output), push/pull or open-drain operation, activation of pull devices, and
edge characteristics (shape) and driver characteristics (output current) of the port
drivers. The I/O ports are true bidirectional ports which are switched to high impedance
state when configured as inputs. During the internal reset, all port pins are configured as
inputs without pull devices active.
All port lines have alternate input or output functions associated with them. These
alternate functions can be programmed to be assigned to various port pins to support the
best utilization for a given application. For this reason, certain functions appear several
times in Table 9.
All port lines that are not used for alternate functions may be used as general purpose
I/O lines.
Table 9
Summary of the XC226x’s Parallel Ports
Port
Width
Alternate Functions
Port 0
8
Address lines,
Serial interface lines of USIC1, CAN0, and CAN1,
Input/Output lines for CCU61
Port 1
Port 2
8
Address lines,
Serial interface lines of USIC1 and USIC2,
Input/Output lines for CCU62,
OCDS control, interrupts
13
Address and/or data lines, bus control,
Serial interface lines of USIC0, CAN0, and CAN1,
Input/Output lines for CCU60, CCU63, and CAPCOM2,
Timer control signals,
JTAG, interrupts, system clock output
Port 4
Port 5
8
Chip select signals,
Serial interface lines of CAN2,
Input/Output lines for CAPCOM2,
Timer control signals
16
Analog input channels to ADC0,
Input/Output lines for CCU6x,
Timer control signals,
JTAG, OCDS control, interrupts
Data Sheet
62
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
Table 9
Summary of the XC226x’s Parallel Ports (cont’d)
Port
Width
Alternate Functions
Port 6
4
ADC control lines,
Serial interface lines of USIC1,
Timer control signals,
OCDS control
Port 7
5
ADC control lines,
Serial interface lines of USIC0 and CAN4,
Input/Output lines for CCU62,
Timer control signals,
JTAG, OCDS control,system clock output
Port 10
Port 15
16
8
Address and/or data lines, bus control,
Serial interface lines of USIC0, USIC1, CAN2, CAN3, and CAN4,
Input/Output lines for CCU60,
JTAG, OCDS control
Analog input channels to ADC1,
Timer control signals
Data Sheet
63
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
3.16
Power Management
The XC226x provides the means to control the power it consumes either at a given time
or averaged over a certain duration.
Three mechanisms can be used (and partly in parallel):
•
•
•
Supply Voltage Management permits the temporary reduction of the supply voltage
of major parts of the logic or even its complete disconnection. This drastically reduces
the power consumed because it eliminates leakage current, particularly at high
temperature.
Several power reduction modes provide the best balance of power reduction and
wake-up time.
Clock Generation Management controls the frequency of internal and external
clock signals. Clock signals for currently inactive parts of logic are disabled
automatically. The user can drastically reduce the consumed power by reducing the
XC226x system clock frequency.
External circuits can be controlled using the programmable frequency output
EXTCLK.
Peripheral Management permits temporary disabling of peripheral modules. Each
peripheral can be disabled and enabled separately. The CPU can be switched off
while the peripherals can continue to operate.
Wake-up from power reduction modes can be triggered either externally with signals
generated by the external system, or internally by the on-chip wake-up timer. This
supports intermittent operation of the XC226x by generating cyclic wake-up signals. Full
performance is available to quickly react to action requests while the intermittent sleep
phases greatly reduce the average system power consumption.
Note: When selecting the supply voltage and the clock source and generation method,
the required parameters must be carefully written to the respective bitfields, to
avoid unintended intermediate states. Recommended sequences are provided
which ensure the intended operation of power supply system and clock system.
Please refer to the Programmer’s Guide.
Data Sheet
64
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
3.17
Instruction Set Summary
Table 10 lists the instructions of the XC226x.
The addressing modes that can be used with a specific instruction, the function of the
instructions, parameters for conditional execution of instructions, and the opcodes for
each instruction can be found in the “Instruction Set Manual”.
This document also provides a detailed description of each instruction.
Table 10
Mnemonic
ADD(B)
Instruction Set Summary
Description
Bytes
2 / 4
2 / 4
2 / 4
2 / 4
2
Add word (byte) operands
ADDC(B)
SUB(B)
Add word (byte) operands with Carry
Subtract word (byte) operands
Subtract word (byte) operands with Carry
SUBC(B)
MUL(U)
(Un)Signed multiply direct GPR by direct GPR
(16- × 16-bit)
DIV(U)
(Un)Signed divide register MDL by direct GPR (16-/16-bit) 2
(Un)Signed long divide reg. MD by direct GPR (32-/16-bit) 2
DIVL(U)
CPL(B)
Complement direct word (byte) GPR
Negate direct word (byte) GPR
Bitwise AND, (word/byte operands)
Bitwise OR, (word/byte operands)
Bitwise exclusive OR, (word/byte operands)
Clear/Set direct bit
2
NEG(B)
AND(B)
OR(B)
2
2 / 4
2 / 4
2 / 4
2
XOR(B)
BCLR/BSET
BMOV(N)
Move (negated) direct bit to direct bit
4
BAND/BOR/BXOR AND/OR/XOR direct bit with direct bit
4
BCMP
Compare direct bit to direct bit
4
BFLDH/BFLDL
Bitwise modify masked high/low byte of bit-addressable
direct word memory with immediate data
4
CMP(B)
CMPD1/2
CMPI1/2
PRIOR
Compare word (byte) operands
2 / 4
Compare word data to GPR and decrement GPR by 1/2 2 / 4
Compare word data to GPR and increment GPR by 1/2
2 / 4
2
Determine number of shift cycles to normalize direct
word GPR and store result in direct word GPR
SHL/SHR
Data Sheet
Shift left/right direct word GPR
2
65
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
Table 10
Mnemonic
ROL/ROR
ASHR
Instruction Set Summary (cont’d)
Description
Bytes
Rotate left/right direct word GPR
2
Arithmetic (sign bit) shift right direct word GPR
Move word (byte) data
2
MOV(B)
MOVBS/Z
JMPA/I/R
JMPS
2 / 4
Move byte operand to word op. with sign/zero extension 2 / 4
Jump absolute/indirect/relative if condition is met
Jump absolute to a code segment
4
4
4
4
JB(C)
Jump relative if direct bit is set (and clear bit)
Jump relative if direct bit is not set (and set bit)
JNB(S)
CALLA/I/R
CALLS
Call absolute/indirect/relative subroutine if condition is met 4
Call absolute subroutine in any code segment
4
4
PCALL
Push direct word register onto system stack and call
absolute subroutine
TRAP
Call interrupt service routine via immediate trap number
Push/pop direct word register onto/from system stack
2
2
4
PUSH/POP
SCXT
Push direct word register onto system stack and update
register with word operand
RET(P)
Return from intra-segment subroutine
2
(and pop direct word register from system stack)
RETS
Return from inter-segment subroutine
Return from interrupt service subroutine
Software Break
2
RETI
2
SBRK
SRST
2
Software Reset
4
IDLE
Enter Idle Mode
4
PWRDN
SRVWDT
Unused instruction1)
4
Service Watchdog Timer
4
DISWDT/ENWDT Disable/Enable Watchdog Timer
4
EINIT
End-of-Initialization Register Lock
4
ATOMIC
EXTR
Begin ATOMIC sequence
2
Begin EXTended Register sequence
Begin EXTended Page (and Register) sequence
Begin EXTended Segment (and Register) sequence
2
EXTP(R)
EXTS(R)
2 / 4
2 / 4
Data Sheet
66
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Functional Description
Table 10
Mnemonic
NOP
Instruction Set Summary (cont’d)
Description
Bytes
Null operation
2
4
4
4
4
CoMUL/CoMAC
CoADD/CoSUB
Co(A)SHR
Multiply (and accumulate)
Add/Subtract
(Arithmetic) Shift right
Shift left
CoSHL
CoLOAD/STORE
CoCMP
Load accumulator/Store MAC register
Compare
4
4
4
4
4
4
CoMAX/MIN
CoABS/CoRND
CoMOV
Maximum/Minimum
Absolute value/Round accumulator
Data move
CoNEG/NOP
Negate accumulator/Null operation
1) The Enter Power Down Mode instruction is not used in the XC226x, due to the enhanced power control
scheme. PWRDN will be correctly decoded, but will trigger no action.
Data Sheet
67
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
4
Electrical Parameters
The operating range for the XC226x is defined by its electrical parameters. For proper
operation the specified limits must be respected during system design.
Note: Typical parameter values refer to room temperature and nominal supply voltage,
minimum/maximum
parameter
values
also
include
conditions
of
minimum/maximum temperature and minimum/maximum supply voltage.
Additional details are described where applicable.
4.1
General Parameters
These parameters are valid for all subsequent descriptions, unless otherwise noted.
Table 11
Absolute Maximum Rating Parameters
Parameter
Symbol
Values
Unit Note /
Test Condition
Min.
-65
Typ.
Max.
150
Storage temperature
Junction temperature
TST
TJ
–
–
–
°C
°C
V
–
-40
150
under bias
–
Voltage on VDDI pins with VDDIM
respect to ground (VSS)
Voltage on VDDP pins with VDDPA
,
-0.5
1.65
VDDI1
,
-0.5
-0.5
-10
–
–
–
–
–
6.0
V
–
respect to ground (VSS)
VDDPB
Voltage on any pin with
respect to ground (VSS)
VIN
VDDP
+ 0.5
V
VIN < VDDPmax
Input current on any pin
during overload condition
–
–
10
mA
mA
–
–
Absolute sum of all input
currents during overload
condition
|100|
Output current on any pin IOH, IOL
–
–
|30|
mA
–
Note: Stresses above the values listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only. Functional operation
of the device at these or any other conditions above those indicated in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for an extended time may affect device reliability.
During absolute maximum rating overload conditions (VIN > VDDP or VIN < VSS) the
voltage on VDDP pins with respect to ground (VSS) must not exceed the values
defined by the absolute maximum ratings.
Data Sheet
68
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
Operating Conditions
The following operating conditions must not be exceeded to ensure correct operation of
the XC226x. All parameters specified in the following sections refer to these operating
conditions, unless otherwise noticed.
Table 12
Operating Condition Parameters
Symbol Values
Parameter
Unit Note /
Test Condition
Min.
Typ.
Max.
1.6
Digital core supply voltage VDDI
1.4
–
–
V
Core Supply Voltage
Difference
∆VDDI -10
+10
mV
V
DDIM - VDDI1
1)
2)
Digital supply voltage for VDDPA
,
4.5
3.0
0
–
–
–
5.5
4.5
0
V
V
V
IO pads and voltage
VDDPB
regulators,
upper voltage range
2)
Digital supply voltage for VDDPA
,
IO pads and voltage
VDDPB
regulators,
lower voltage range
Digital ground voltage
VSS
IOV
Reference
voltage
mA Per IO pin3)4)
Overload current
-5
-2
–
–
5
5
mA Per analog input
pin3)4)
Overload positive current KOVA
coupling factor for analog
inputs5)
–
–
–
–
–
1.0 × 1.0 ×
10-6 10-4
–
I
I
I
I
OV > 0
OV < 0
OV > 0
OV < 0
Overload negative current KOVA
coupling factor for analog
inputs5)
2.5 × 1.5 ×
10-4 10-3
–
Overload positive current KOVD
coupling factor for digital
I/O pins5)
1.0 × 5.0 ×
10-4 10-3
–
Overload negative current KOVD
coupling factor for digital
I/O pins5)
1.0 × 3.0 ×
–
10-2
10-2
4)
Absolute sum of overload Σ|IOV|
–
50
mA
currents
Data Sheet
69
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
Table 12
Operating Condition Parameters (cont’d)
Parameter
Symbol
Values
Typ.
20
Unit Note /
Test Condition
Min.
Max.
External Pin Load
Capacitance
CL
–
–
pF
µF
µF
Pin drivers in
default mode6)
7)
Voltage Regulator Buffer CEVRM
Capacitance for DMP_M
1.0
–
–
4.7
2.2
Voltage Regulator Buffer CEVR1
Capacitance for DMP_1
0.47
One for each
supply pin7)
8)
Operating frequency
Ambient temperature
fSYS
TA
–
–
–
–
80
–
MHz
°C
See Table 1
1) If both core power domains are clocked, the difference between the power supply voltages must be less than
10 mV. This condition imposes additional constraints when using external power supplies.
Do not combine internal and external supply of different core power domains.
Do not supply the core power domains with two independent external voltage regulators. The simplest method
is to supply both power domains directly via a single external power supply.
2) Performance of pad drivers, A/D Converter, and Flash module depends on VDDP
.
If the external supply voltage VDDP becomes lower than the specified operating range, a power reset must be
generated. Otherwise, the core supply voltage VDDI may rise above its specified operating range due to
parasitic effects.
This power reset can be generated by the on-chip SWD. If the SWD is disabled the power reset must be
generated by activating the PORST input.
3) Overload conditions occur if the standard operating conditions are exceeded, i.e. the voltage on any pin
exceeds the specified range: VOV > VIHmax (IOV > 0) or VOV < VILmin (IOV < 0). The absolute sum of input
overload currents on all pins may not exceed 50 mA. The supply voltages must remain within the specified
limits. Proper operation under overload conditions depends on the application.
Overload conditions must not occur on pin XTAL1 (powered by VDDI).
4) Not subject to production test - verified by design/characterization.
5) An overload current (IOV) through a pin injects an error current (IINJ) into the adjacent pins. This error current
adds to that pin’s leakage current (IOZ). The value of the error current depends on the overload current and is
defined by the overload coupling factor KOV. The polarity of the injected error current is reversed from the
polarity of the overload current that produces it.
The total current through a pin is |ITOT| = |IOZ| + (|IOV| × KOV). The additional error current may distort the input
voltage on analog inputs.
6) The timing is valid for pin drivers operating in default current mode (selected after reset). Reducing the output
current may lead to increased delays or reduced driving capability (CL).
7) To ensure the stability of the voltage regulators the EVRs must be buffered with ceramic capacitors. Separate
buffer capacitors with the recomended values shall be connected as close as possible to each VDDI pin to keep
the resistance of the board tracks below 2 Ω. Connect all VDDI1 pins together.
The minimum capacitance value is required for proper operation under all conditions (e.g. temperature).
Higher values slightly increase the startup time.
8) The operating frequency range may be reduced for specific types of the XC226x. This is indicated in the
device designation (…FxxL). 80-MHz devices are marked …F80L.
Data Sheet
70
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
Parameter Interpretation
The parameters listed in the following include both the characteristics of the XC226x and
its demands on the system. To aid in correctly interpreting the parameters when
evaluating them for a design, they are marked accordingly in the column “Symbol”:
CC (Controller Characteristics):
The logic of the XC226x provides signals with the specified characteristics.
SR (System Requirement):
The external system must provide signals with the specified characteristics to the
XC226x.
Data Sheet
71
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
4.2
DC Parameters
These parameters are static or average values that may be exceeded during switching
transitions (e.g. output current).
The XC226x can operate within a wide supply voltage range from 3.0 V to 5.5 V.
However, during operation this supply voltage must remain within 10 percent of the
selected nominal supply voltage. It cannot vary across the full operating voltage range.
Because of the supply voltage restriction and because electrical behavior depends on
the supply voltage, the parameters are specified separately for the upper and the lower
voltage range.
During operation, the supply voltages may only change with a maximum speed of
dV/dt < 1 V/ms.
Leakage current is strongly dependent on the operating temperature and the voltage
level at the respective pin. The maximum values in the following tables apply under worst
case conditions, i.e. maximum temperature and an input level equal to the supply
voltage.
The value for the leakage current in an application can be determined by using the
respective leakage derating formula (see tables) with values from that application.
The pads of the XC226x are designed to operate in various driver modes. The DC
parameter specifications refer to the current limits in Table 13.
Table 13
Current Limits for Port Output Drivers
Port Output Driver
Mode
Maximum Output Current
Nominal Output Current
(IOLnom, -IOHnom
VDDP ≥ 4.5 V VDDP < 4.5 V VDDP ≥ 4.5 V VDDP < 4.5 V
1)
(IOLmax, -IOHmax
)
)
Strong driver
Medium driver
Weak driver
10 mA
4.0 mA
0.5 mA
10 mA
2.5 mA
0.5 mA
2.5 mA
1.0 mA
0.1 mA
2.5 mA
1.0 mA
0.1 mA
1) An output current above |IOXnom| may be drawn from up to three pins at the same time.
For any group of 16 neighboring output pins, the total output current in each direction (ΣIOL and Σ-IOH) must
remain below 50 mA.
Data Sheet
72
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
Pullup/Pulldown Device Behavior
Most pins of the XC226x feature pullup or pulldown devices. For some special pins these
are fixed; for the port pins they can be selected by the application.
The specified current values indicate how to load the respective pin depending on the
intended signal level. Figure 12 shows the current paths.
The shaded resistors shown in the figure may be required to compensate system pull
currents that do not match the given limit values.
VDDP
Pullup
Pulldown
VSS
MC_XC2X_PULL
Figure 12
Pullup/Pulldown Current Definition
Data Sheet
73
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
4.2.1
DC Parameters for Upper Voltage Area
These parameters apply to the upper IO voltage range, 4.5 V ≤ VDDP ≤ 5.5 V.
Table 14
DC Characteristics for Upper Voltage Range
(Operating Conditions apply)1)
Parameter
Symbol
Values
Typ.
–
Unit Note /
Test Condition
Min.
Max.
Input low voltage
(all except XTAL1)
VIL SR -0.3
0.3 ×
VDDP
V
V
V
–
Input high voltage
(all except XTAL1)
Input Hysteresis2)
VIH SR 0.7 ×
–
–
VDDP
+ 0.3
–
VDDP
HYS CC 0.11
–
V
DDP in [V],
× VDDP
Series
resistance = 0 Ω
3)
Output low voltage
Output low voltage
Output high voltage5)
VOL CC –
VOL CC –
–
–
–
1.0
0.4
–
V
V
V
IOL ≤ IOLmax
3)4)
IOL ≤ IOLnom
3)
V
OH CC VDDP
IOH ≥ IOHmax
- 1.0
3)4)
Output high voltage5)
V
OH CC VDDP
–
–
V
IOH ≥ IOHnom
- 0.4
Input leakage current
(Port 5, Port 15)6)
I
I
OZ1 CC –
OZ2 CC –
±10
±0.2
±200
±5
nA 0 V < VIN < VDDP
Input leakage current
(all other)6)7)
µA TJ ≤ 110°C,
0.45 V < VIN
< VDDP
Input leakage current
(all other)6)7)
I
OZ2 CC –
±0.2
±15
µA TJ ≤ 150°C,
0.45 V < VIN
< VDDP
Pull level keep current
Pull level force current
IPLK
–
–
–
–
±30
–
µA VPIN ≥ VIH (up)8)
VPIN ≤ VIL (dn)
µA VPIN ≤ VIL (up)8)
VPIN ≥ VIH (dn)
IPLF
±250
Pin capacitance9)
CIO CC
–
10
pF
(digital inputs/outputs)
1) Keeping signal levels within the limits specified in this table ensures operation without overload conditions. For
signal levels outside these specifications, also refer to the specification of the overload current IOV
.
Data Sheet
74
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
2) Not subject to production test - verified by design/characterization. Hysteresis is implemented to avoid
metastable states and switching due to internal ground bounce. It cannot suppress switching due to external
system noise under all conditions.
3) The maximum deliverable output current of a port driver depends on the selected output driver mode, see
Table 13, Current Limits for Port Output Drivers. The limit for pin groups must be respected.
4) As a rule, with decreasing output current the output levels approach the respective supply level (VOL→VSS,
VOH→VDDP). However, only the levels for nominal output currents are verified.
5) This specification is not valid for outputs which are switched to open drain mode. In this case the respective
output will float and the voltage is determined by the external circuit.
6) An additional error current (IINJ) will flow if an overload current flows through an adjacent pin. Please refer to
the definition of the overload coupling factor KOV
.
7) The given values are worst-case values. In production test, this leakage current is only tested at 125°C; other
values are ensured by correlation. For derating, please refer to the following descriptions:
Leakage derating depending on temperature (TJ = junction temperature [°C]):
IOZ = 0.05 × e(1.5 + 0.028×TJ) [µA]. For example, at a temperature of 130°C the resulting leakage current is
8.54 µA.
Leakage derating depending on voltage level (DV = VDDP - VPIN [V]):
I
OZ = IOZtempmax - (1.6 × DV) [µA]
This voltage derating formula is an approximation which applies for maximum temperature.
Because pin P2.8 is connected to two pads (standard pad and high-speed clock pad), it has twice the normal
leakage.
8) Keep current: Limit the current through this pin to the indicated value so that the enabled pull device can keep
the default pin level: VPIN ≥ VIH for a pullup; VPIN ≤ VIL for a pulldown.
Force current: Drive the indicated minimum current through this pin to change the default pin level driven by
the enabled pull device: VPIN ≤ VIL for a pullup; VPIN ≥ VIH for a pulldown.
These values apply to the fixed pull-devices in dedicated pins and to the user-selectable pull-devices in
general purpose IO pins.
9) Not subject to production test - verified by design/characterization.
Because pin P2.8 is connected to two pads (standard pad and high-speed clock pad), it has twice the normal
capacitance.
Data Sheet
75
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
4.2.2
DC Parameters for Lower Voltage Area
These parameters apply to the lower IO voltage range, 3.0 V ≤ VDDP ≤ 4.5 V.
Table 15
DC Characteristics for Lower Voltage Range
(Operating Conditions apply)1)
Parameter
Symbol
Values
Typ.
–
Unit Note /
Test Condition
Min.
Max.
Input low voltage
(all except XTAL1)
VIL SR -0.3
0.3 ×
VDDP
V
V
V
–
Input high voltage
(all except XTAL1)
Input Hysteresis2)
VIH SR 0.7 ×
–
–
VDDP
+ 0.3
–
VDDP
HYS CC 0.07
–
V
DDP in [V],
× VDDP
Series
resistance = 0 Ω
3)
Output low voltage
Output low voltage
Output high voltage5)
VOL CC –
VOL CC –
–
–
–
1.0
0.4
–
V
V
V
IOL ≤ IOLmax
3)4)
IOL ≤ IOLnom
3)
V
OH CC VDDP
IOH ≥ IOHmax
- 1.0
3)4)
Output high voltage5)
V
OH CC VDDP
–
–
V
IOH ≥ IOHnom
- 0.4
Input leakage current
(Port 5, Port 15)6)
I
I
OZ1 CC –
OZ2 CC –
±10
±0.2
±200
±2.5
nA 0 V < VIN < VDDP
Input leakage current
(all other)6)7)
µA TJ ≤ 110°C,
0.45 V < VIN
< VDDP
Input leakage current
(all other)6)7)
I
OZ2 CC –
±0.2
±8
µA TJ ≤ 150°C,
0.45 V < VIN
< VDDP
Pull level keep current
Pull level force current
IPLK
–
–
–
–
±10
–
µA VPIN ≥ VIH (up)8)
VPIN ≤ VIL (dn)
µA VPIN ≤ VIL (up)8)
VPIN ≥ VIH (dn)
IPLF
±150
Pin capacitance9)
CIO CC
–
10
pF
(digital inputs/outputs)
1) Keeping signal levels within the limits specified in this table ensures operation without overload conditions. For
signal levels outside these specifications, also refer to the specification of the overload current IOV
.
Data Sheet
76
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
2) Not subject to production test - verified by design/characterization. Hysteresis is implemented to avoid
metastable states and switching due to internal ground bounce. It cannot suppress switching due to external
system noise under all conditions.
3) The maximum deliverable output current of a port driver depends on the selected output driver mode, see
Table 13, Current Limits for Port Output Drivers. The limit for pin groups must be respected.
4) As a rule, with decreasing output current the output levels approach the respective supply level (VOL→VSS,
VOH→VDDP). However, only the levels for nominal output currents are verified.
5) This specification is not valid for outputs which are switched to open drain mode. In this case the respective
output will float and the voltage is determined by the external circuit.
6) An additional error current (IINJ) will flow if an overload current flows through an adjacent pin. Please refer to
the definition of the overload coupling factor KOV
.
The leakage current value is not tested in the lower voltage range but only in the upper voltage range. This
parameter is ensured by correlation.
7) The given values are worst-case values. In production test, this leakage current is only tested at 125°C; other
values are ensured by correlation. For derating, please refer to the following descriptions:
Leakage derating depending on temperature (TJ = junction temperature [°C]):
IOZ = 0.03 × e(1.35 + 0.028×TJ) [µA]. For example, at a temperature of 130°C the resulting leakage current is
4.41 µA.
Leakage derating depending on voltage level (DV = VDDP - VPIN [V]):
I
OZ = IOZtempmax - (1.3 × DV) [µA]
This voltage derating formula is an approximation which applies for maximum temperature.
Because pin P2.8 is connected to two pads (standard pad and high-speed clock pad), it has twice the normal
leakage.
8) Keep current: Limit the current through this pin to the indicated value so that the enabled pull device can keep
the default pin level: VPIN ≥ VIH for a pullup; VPIN ≤ VIL for a pulldown.
Force current: Drive the indicated minimum current through this pin to change the default pin level driven by
the enabled pull device: VPIN ≤ VIL for a pullup; VPIN ≥ VIH for a pulldown.
These values apply to the fixed pull-devices in dedicated pins and to the user-selectable pull-devices in
general purpose IO pins.
9) Not subject to production test - verified by design/characterization.
Because pin P2.8 is connected to two pads (standard pad and high-speed clock pad), it has twice the normal
capacitance.
Data Sheet
77
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
4.2.3
Power Consumption
The power consumed by the XC226x depends on several factors such as supply
voltage, operating frequency, active circuits, and operating temperature. The power
consumption specified here consists of two components:
•
•
The switching current IS depends on the device activity
The leakage current ILK depends on the device temperature
To determine the actual power consumption, always both components, switching current
IS (Table 16) and leakage current ILK (Table 17) must be added:
I
DDP = IS + ILK.
Note: The power consumption values are not subject to production test. They are
verified by design/characterization.
To determine the total power consumption for dimensioning the external power
supply, also the pad driver currents must be considered.
The given power consumption parameters and their values refer to specific operating
conditions:
•
Active mode:
Regular operation, i.e. peripherals are active, code execution out of Flash.
•
Stopover mode:
Crystal oscillator and PLL stopped, Flash switched off, clock in domain DMP_1
stopped.
•
Standby mode:
Voltage domain DMP_1 switched off completely, power supply control switched off.
Note: The maximum values cover the complete specified operating range of all
manufactured devices.
The typical values refer to average devices under typical conditions, such as
nominal supply voltage, room temperature, application-oriented activity.
After a power reset, the decoupling capacitors for VDDI are charged with the
maximum possible current, see parameter ICC in Table 20.
For additional information, please refer to Section 5.2, Thermal Considerations.
Data Sheet
78
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
Table 16
Switching Power Consumption XC226x
(Operating Conditions apply)
Parameter
Sym-
bol
Values
Min. Typ.
Unit Note /
Test Condition
Max.
10 +
0.6×fSYS 1.0×fSYS
Power supply current
(active) withallperipherals
active and EVVRs on
ISACT
–
10 +
mA Active mode1)2)
SYS in [MHz]
f
Power supply current
in stopover mode,
EVVRs on
ISSO
–
1.0
2.0
mA Stopover Mode2)
Power supply current
in standby mode
ISSB
ISSB
–
–
150
70
250
150
µA Standby mode,
upper voltage area
Power supply current
in standby mode
µA Standby mode,
lower voltage area
1) The pad supply voltage pins (VDDPB) provide the input current for the on-chip EVVRs and the current consumed
by the pin output drivers. A small current is consumed because the drivers’ input stages are switched.
2) The pad supply voltage has only a minor influence on this parameter.
Data Sheet
79
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
IS [mA]
100
90
80
70
60
50
40
30
20
10
ISACTmax
ISACTtyp
f
SYS [MHz]
20
40
60
80
MC_XC2XM_IS
Figure 13
Supply Current in Active Mode as a Function of Frequency
Data Sheet
80
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
Table 17
Leakage Power Consumption XC226x
(Operating Conditions apply)
Parameter
Sym-
bol
Values
Min. Typ.
Unit Note /
Test Condition1)
Max.
Leakage supply current2)
(DMP_1 powered)
ILK1
–
–
–
–
–
–
–
–
0.03
0.5
2.1
4.4
20
0.05
1.3
mA TJ = 25°C
mA TJ = 85°C
mA TJ = 125°C
mA TJ = 150°C
µA TJ = 25°C
µA TJ = 85°C
µA TJ = 125°C
Formula3): 600,000 × e-α;
α = 5000 / (273 + B×TJ);
Typ.: B = 1.0, Max.: B = 1.3
6.2
13.7
35
Leakage supply current2)
(DMP_1 off)
ILK0
115
270
420
330
880
Formula3): 500,000 × e-α;
α = 3000 / (273 + B×TJ);
Typ.: B = 1.0, Max.: B = 1.6
1,450 µA TJ = 150°C
1) All inputs (including pins configured as inputs) are set at 0 V to 0.1 V or at VDDP - 0.1 V to VDDP and all outputs
(including pins configured as outputs) are disconnected.
2) The supply current caused by leakage depends mainly on the junction temperature (see Figure 14) and the
supply voltage. The temperature difference between the junction temperature TJ and the ambient temperature
TA must be taken into account. As this fraction of the supply current does not depend on device activity, it must
be added to other power consumption values.
3) This formula is valid for temperatures above 0°C. For temperatures below 0°C a value of below 10 µA can be
assumed.
Data Sheet
81
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
ILK [m A ]
1 4
1 2
1 0
8
IL K 1m a x
6
IL K 1typ
4
2
IL K 0m a x
IL K 0typ
T J [°C ]
-5 0
0
5 0
1 0 0
1 5 0
M C _ X C 2 X _ ILK 1 5 0
Figure 14
Leakage Supply Current as a Function of Temperature
Data Sheet
82
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
4.3
Analog/Digital Converter Parameters
These parameters describe the conditions for optimum ADC performance.
Table 18
A/D Converter Characteristics
(Operating Conditions apply)
Parameter
Symbol
Limit Values
Unit Test
Condition
Min.
Max.
1)
Analog reference supply VAREF SR VAGND
VDDPA
+ 0.05
V
V
V
+ 1.0
Analog reference ground VAGND SR VSS
VAREF
- 1.0
–
- 0.05
2)
Analog input voltage
range
VAIN
fADCI
SR VAGND
VAREF
3)
Analog clock frequency
0.5
20
MHz
–
Conversion time for 10-bit tC10
CC (13 + STC) × tADCI
+ 2 × tSYS
–
result4)
Conversion time for 8-bit tC8
CC (11 + STC) × tADCI
+ 2 × tSYS
–
–
–
–
result4)
Wakeup time from analog tWAF
powerdown, fast mode
CC –
CC –
CC –
1
µs
µs
Wakeup time from analog tWAS
powerdown, slow mode
10
Total unadjusted error5)
TUE
±2
LSB VAREF = 5.0 V1)
DNL error
EADNL CC –
EAINL CC –
EAGAIN CC –
EAOFF CC –
CAINT CC –
±1
LSB
LSB
LSB
LSB
INL error
±1.2
±0.8
±0.8
10
Gain error
Offset error
6)7)
Total capacitance
of an analog input
pF
6)7)
Switched capacitance
of an analog input
CAINS CC –
4
pF
6)7)
Resistance of
the analog input path
RAIN
CC –
1.5
15
kΩ
6)7)
Total capacitance
CAREFT CC –
pF
of the reference input
Data Sheet
83
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
Table 18
A/D Converter Characteristics (cont’d)
(Operating Conditions apply)
Parameter
Symbol
Limit Values
Max.
Unit Test
Condition
Min.
CAREFS CC –
6)7)
Switched capacitance
of the reference input
7
pF
6)7)
Resistance of
RAREF CC –
2
kΩ
the reference input path
1) TUE is tested at VAREFx = VDDPA, VAGND = 0 V. It is verified by design for all other voltages within the defined
voltage range.
The specified TUE is valid only if the absolute sum of input overload currents on Port 5 or Port 15 pins (see
I
OV specification) does not exceed 10 mA, and if VAREF and VAGND remain stable during the measurement time.
2) VAIN may exceed VAGND or VAREFx up to the absolute maximum ratings. However, the conversion result in these
cases will be X000H or X3FFH, respectively.
3) The limit values for fADCI must not be exceeded when selecting the peripheral frequency and the prescaler
setting.
4) This parameter includes the sample time (also the additional sample time specified by STC), the time to
determine the digital result and the time to load the result register with the conversion result.
Values for the basic clock tADCI depend on programming and are found in Table 19.
5) The total unadjusted error TUE is the maximum deviation from the ideal ADC transfer curve, not the sum of
individual errors.
All error specifications are based on measurement methods standardized by IEEE 1241.2000.
6) Not subject to production test - verified by design/characterization.
7) These parameter values cover the complete operating range. Under relaxed operating conditions
(temperature, supply voltage) typical values can be used for calculation. At room temperature and nominal
supply voltage the following typical values can be used:
CAINTtyp = 12 pF, CAINStyp = 5 pF, RAINtyp = 1.0 kΩ, CAREFTtyp = 15 pF, CAREFStyp = 10 pF, RAREFtyp = 1.0 kΩ.
A/D Converter
RSource
RAIN, On
VAIN
-
CExt
CAINT CAINS
CAINS
MCS05570
Figure 15
Equivalent Circuitry for Analog Inputs
Data Sheet
84
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
Sample time and conversion time of the XC226x’s A/D converters are programmable.
The timing above can be calculated using Table 19.
The limit values for fADCI must not be exceeded when selecting the prescaler value.
Table 19
A/D Converter Computation Table
GLOBCTR.5-0
(DIVA)
A/D Converter
Analog Clock fADCI
INPCRx.7-0
(STC)
Sample Time
tS
000000B
000001B
000010B
:
fSYS
00H
01H
02H
:
tADCI × 2
f
f
f
f
f
SYS / 2
tADCI × 3
SYS / 3
tADCI × 4
SYS / (DIVA+1)
SYS / 63
tADCI × (STC+2)
tADCI × 256
tADCI × 257
111110B
111111B
FEH
FFH
SYS / 64
Converter Timing Example A:
Assumptions:
Analog clock
Sample time
fSYS = 80 MHz (i.e. tSYS = 12.5 ns), DIVA = 03H, STC = 00H
fADCI = fSYS / 4 = 20 MHz, i.e. tADCI = 50 ns
tS
= tADCI × 2 = 100 ns
Conversion 10-bit:
tC10 = 13 × tADCI + 2 × tSYS = 13 × 50 ns + 2 × 12.5 ns = 0.675 µs
Conversion 8-bit:
tC8
= 11 × tADCI + 2 × tSYS = 11 × 50 ns + 2 × 12.5 ns = 0.575 µs
Converter Timing Example B:
Assumptions:
Analog clock
Sample time
fSYS = 40 MHz (i.e. tSYS = 25 ns), DIVA = 02H, STC = 03H
fADCI = fSYS / 3 = 13.3 MHz, i.e. tADCI = 75 ns
= tADCI × 5 = 375 ns
tS
Conversion 10-bit:
tC10 = 16 × tADCI + 2 × tSYS = 16 × 75 ns + 2 × 25 ns = 1.25 µs
Conversion 8-bit:
tC8
= 14 × tADCI + 2 × tSYS = 14 × 75 ns + 2 × 25 ns = 1.10 µs
Data Sheet
85
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
4.4
System Parameters
The following parameters specify several aspects which are important when integrating
the XC226x into an application system.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Table 20
Various System Parameters
Parameter
Symbol
Min.
Values
Typ.
Unit Note /
Test Condition
Max.
Supply watchdog (SWD) VSWD
VLV -
0.150
VLV
VLV +
0.100
V
V
V
VLV = selected
voltage in upper
voltage area
supervision level
CC
(see Table 21)
VLV -
0.125
VLV
VLV
VLV +
0.050
VLV = selected
voltage in lower
voltage area
Core voltage (PVC)
supervision level
(see Table 22)
V
PVC CC VLV -
VLV +
0.030
VLV = selected
voltage
0.070
Current control limit
I
CC CC 13
90
–
30
mA Power domain
DMP_M
–
150
600
5.2
320
3.5
mA Power domain
DMP_1
Wakeup clock source
frequency
f
f
t
t
WU CC 400
INT CC 4.8
SSO CC 200
SSB CC 2.5
500
5.0
260
2.8
kHz FREQSEL
= 00B
Internal clock source
frequency
MHz
Startup time from
stopover mode
µs
User instruction
from PSRAM
Startup time from
standby mode
ms
User instruction
from Flash
Data Sheet
86
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
Table 21
Code
0000B
0001B
0010B
0011B
0100B
0101B
0110B
0111B
1000B
1001B
1010B
1011B
1100B
1101B
1110B
1111B
Coding of Bitfields LEVxV in Register SWDCON0
Default Voltage Level
Notes1)
2.9 V
3.0 V
3.1 V
3.2 V
3.3 V
3.4 V
3.6 V
4.0 V
4.2 V
4.5 V
4.6 V
4.7 V
4.8 V
4.9 V
5.0 V
5.5 V
LEV1V: reset request
LEV2V: no request
1) The indicated default levels are selected automatically after a power reset.
Table 22
Code
000B
Coding of Bitfields LEVxV in Registers PVCyCONz
Default Voltage Level
Notes1)
0.9 V
1.0 V
1.1 V
1.2 V
1.3 V
1.4 V
1.5 V
1.6 V
001B
010B
011B
100B
LEV1V: reset request
101B
LEV2V: interrupt request
110B
111B
1) The indicated default levels are selected automatically after a power reset.
Data Sheet
87
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
4.5
Flash Memory Parameters
The XC226x is delivered with all Flash sectors erased and with no protection installed.
The data retention time of the XC226x’s Flash memory (i.e. the time after which stored
data can still be retrieved) depends on the number of times the Flash memory has been
erased and programmed.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Table 23
Flash Characteristics
(Operating Conditions apply)
Parameter
Symbol
Limit Values
Unit
Note / Test
Condition
Min.
Typ.
Max.
Programming time per
128-byte page
tPR
–
31)
3.5
ms
ms
ms
ms
Erase time per
sector/page
tER
–
41)
–
5
–
Data retention time
tRET
20
years 1,000 erase /
program
cycles
Flash erase endurance for NER
15,000 –
–
–
–
cycles Data retention
time 5 years
user sectors2)
Flash erase endurance for NSEC
security pages
10
64
–
–
cycles Data retention
time 20 years
3)
Drain disturb limit
NDD
cycles
1) Programming and erase times depend on the internal Flash clock source. The control state machine needs a
few system clock cycles. This requirement is only relevant for extremely low system frequencies.
In the XC226x erased areas must be programmed completely (with actual code/data or dummy values) before
that area is read.
2) A maximum of 64 Flash sectors can be cycled 15,000 times. For all other sectors the limit is 1,000 cycles.
3) This parameter limits the number of subsequent programming operations within a physical sector. The drain
disturb limit is applicable if wordline erase is used repeatedly. For normal sector erase/program cycles this
limit will not be violated.
Access to the XC226x Flash modules is controlled by the IMB. Built-in prefetch
mechanisms optimize the performance for sequential access.
Flash access waitstates only affect non-sequential access. Due to prefetch
mechanisms, the performance for sequential access (depending on the software
structure) is only partially influenced by waitstates.
Data Sheet
88
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
Table 24
Flash Access Waitstates
Required Waitstates
System Frequency Range
4 WS (WSFLASH = 100B)
3 WS (WSFLASH = 011B)
2 WS (WSFLASH = 010B)
1 WS (WSFLASH = 001B)
0 WS (WSFLASH = 000B)
fSYS ≤ fSYSmax
fSYS ≤ 17 MHz
fSYS ≤ 13 MHz
fSYS ≤ 8 MHz
Forbidden! Must not be selected!
Note: The maximum achievable system frequency is limited by the properties of the
respective derivative.
Data Sheet
89
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
4.6
AC Parameters
These parameters describe the dynamic behavior of the XC226x.
4.6.1
Testing Waveforms
These values are used for characterization and production testing (except pin XTAL1).
Output delay
Hold time
Output delay
Hold time
0.8 VDDP
0.7 VDDP
Input Signal
(driven by tester)
0.3 VDDP
0.2 VDDP
Output Signal
(measured)
Output timings refer to the rising edge of CLKOUT.
Input timings are calculated from the time, when the input signal reaches
VIH or VIL, respectively.
MCD05556C
Figure 16
Input Output Waveforms
V
Load + 0.1 V
V
V
OH - 0.1 V
OL + 0.1 V
Timing
Reference
Points
V
Load - 0.1 V
For timing purposes a port pin is no longer floating when a 100 mV
change from load voltage occurs, but begins to float when a 100 mV
change from the loaded VOH /VOL level occurs (IOH / IOL = 20 mA).
MCA05565
Figure 17
Floating Waveforms
Data Sheet
90
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
4.6.2
Definition of Internal Timing
The internal operation of the XC226x is controlled by the internal system clock fSYS
.
Because the system clock signal fSYS can be generated from a number of internal and
external sources using different mechanisms, the duration of the system clock periods
(TCSs) and their variation (as well as the derived external timing) depend on the
mechanism used to generate fSYS. This must be considered when calculating the timing
for the XC226x.
Phase Locked Loop Operation (1:N)
fIN
fSYS
TCS
Direct Clock Drive (1:1)
fIN
fSYS
TCS
Prescaler Operation (N:1)
fIN
fSYS
TCS
MC_XC2X_CLOCKGEN
Figure 18
Generation Mechanisms for the System Clock
Note: The example of PLL operation shown in Figure 18 uses a PLL factor of 1:4; the
example of prescaler operation uses a divider factor of 2:1.
The specification of the external timing (AC Characteristics) depends on the period of the
system clock (TCS).
Data Sheet
91
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
Direct Drive
When direct drive operation is selected (SYSCON0.CLKSEL = 11B), the system clock is
derived directly from the input clock signal CLKIN1:
f
SYS = fIN.
The frequency of fSYS is the same as the frequency of fIN. In this case the high and low
times of fSYS are determined by the duty cycle of the input clock fIN.
Selecting Bypass Operation from the XTAL11) input and using a divider factor of 1 results
in a similar configuration.
Prescaler Operation
When prescaler operation is selected (SYSCON0.CLKSEL = 10B, PLLCON0.VCOBY =
1B), the system clock is derived either from the crystal oscillator (input clock signal
XTAL1) or from the internal clock source through the output prescaler K1 (= K1DIV+1):
f
SYS = fOSC / K1.
If a divider factor of 1 is selected, the frequency of fSYS equals the frequency of fOSC. In
this case the high and low times of fSYS are determined by the duty cycle of the input
clock fOSC (external or internal).
The lowest system clock frequency results from selecting the maximum value for the
divider factor K1:
f
SYS = fOSC / 1024.
Phase Locked Loop (PLL)
When PLL operation is selected (SYSCON0.CLKSEL = 10B, PLLCON0.VCOBY = 0B),
the on-chip phase locked loop is enabled and provides the system clock. The PLL
multiplies the input frequency by the factor F (fSYS = fIN × F).
F is calculated from the input divider P (= PDIV+1), the multiplication factor N (=
NDIV+1), and the output divider K2 (= K2DIV+1):
(F = N / (P × K2)).
The input clock can be derived either from an external source at XTAL1 or from the on-
chip clock source.
The PLL circuit synchronizes the system clock to the input clock. This synchronization is
performed smoothly so that the system clock frequency does not change abruptly.
Adjustment to the input clock continuously changes the frequency of fSYS so that it is
locked to fIN. The slight variation causes a jitter of fSYS which in turn affects the duration
of individual TCSs.
1) Voltages on XTAL1 must comply to the core supply voltage VDDI1
.
Data Sheet
92
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
The timing in the AC Characteristics refers to TCSs. Timing must be calculated using the
minimum TCS possible under the given circumstances.
The actual minimum value for TCS depends on the jitter of the PLL. Because the PLL is
constantly adjusting its output frequency to correspond to the input frequency (from
crystal or oscillator), the accumulated jitter is limited. This means that the relative
deviation for periods of more than one TCS is lower than for a single TCS (see formulas
and Figure 19).
This is especially important for bus cycles using waitstates and for the operation of
timers, serial interfaces, etc. For all slower operations and longer periods (e.g. pulse train
generation or measurement, lower baudrates, etc.) the deviation caused by the PLL jitter
is negligible.
The value of the accumulated PLL jitter depends on the number of consecutive VCO
output cycles within the respective timeframe. The VCO output clock is divided by the
output prescaler K2 to generate the system clock signal fSYS. The number of VCO cycles
is K2 × T, where T is the number of consecutive fSYS cycles (TCS).
The maximum accumulated jitter (long-term jitter) DTmax is defined by:
DTmax [ns] = ±(220 / (K2 × fSYS) + 4.3)
This maximum value is applicable, if either the number of clock cycles T > (fSYS / 1.2) or
the prescaler value K2 > 17.
In all other cases for a timeframe of T × TCS the accumulated jitter DT is determined by:
DT [ns] = DTmax × [(1 - 0.058 × K2) × (T - 1) / (0.83 × fSYS - 1) + 0.058 × K2]
f
SYS in [MHz] in all formulas.
Example, for a period of 3 TCSs @ 33 MHz and K2 = 4:
Dmax = ±(220 / (4 × 33) + 4.3) = 5.97 ns (Not applicable directly in this case!)
D3 = 5.97 × [(1 - 0.058 × 4) × (3 - 1) / (0.83 × 33 - 1) + 0.058 × 4]
= 5.97 × [0.768 × 2 / 26.39 + 0.232]
= 1.7 ns
Example, for a period of 3 TCSs @ 33 MHz and K2 = 2:
Dmax = ±(220 / (2 × 33) + 4.3) = 7.63 ns (Not applicable directly in this case!)
D3 = 7.63 × [(1 - 0.058 × 2) × (3 - 1) / (0.83 × 33 - 1) + 0.058 × 2]
= 7.63 × [0.884 × 2 / 26.39 + 0.116]
= 1.4 ns
Data Sheet
93
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
Acc. jitter DT
ns
±9
fSYS = 33 MHz fSYS = 66 MHz
fVCO = 66 MHz
fVCO = 132MHz
±8
±7
±6
±5
±4
±3
±2
±1
Cycles
100
T
0
1
20
40
60
80
MC_XC 2X_JITTER
Figure 19
Approximated Accumulated PLL Jitter
Note: The specified PLL jitter values are valid if the capacitive load per pin does not
exceed CL = 20 pF (see Table 12).
The maximum peak-to-peak noise on the pad supply voltage (measured between
VDDPB pin 100/144 and VSS pin 1) is limited to a peak-to-peak voltage of VPP
=
50 mV. This can be achieved by appropriate blocking of the supply voltage as
close as possible to the supply pins and using PCB supply and ground planes.
Different frequency bands can be selected for the VCO so that the operation of the PLL
can be adjusted to a wide range of input and output frequencies:
Table 25
PLLCON0.VCOSEL VCO Frequency Range
VCO Bands for PLL Operation1)
Base Frequency Range
10 … 40 MHz
00
01
1X
50 … 110 MHz
100 … 160 MHz
Reserved
20 … 80 MHz
1) Not subject to production test - verified by design/characterization.
Data Sheet
94
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
Wakeup Clock
When wakeup operation is selected (SYSCON0.CLKSEL = 00B), the system clock is
derived from the low-frequency wakeup clock source:
f
SYS = fWU.
In this mode, a basic functionality can be maintained without requiring an external clock
source and while minimizing the power consumption.
Selecting and Changing the Operating Frequency
When selecting a clock source and the clock generation method, the required
parameters must be carefully written to the respective bitfields, to avoid unintended
intermediate states.
Many applications change the frequency of the system clock (fSYS) during operation in
order to optimize system performance and power consumption. Changing the operating
frequency also changes the switching currents, which influences the power supply.
To ensure proper operation of the on-chip EVRs while they generate the core voltage,
the operating frequency shall only be changed in certain steps. This prevents overshoots
and undershoots of the supply voltage.
To avoid the indicated problems, recommended sequences are provided which ensure
the intended operation of the clock system interacting with the power system.
Please refer to the Programmer’s Guide.
Data Sheet
95
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
4.6.3
External Clock Input Parameters
These parameters specify the external clock generation for the XC226x. The clock can
be generated in two ways:
•
•
By connecting a crystal or ceramic resonator to pins XTAL1/XTAL2.
By supplying an external clock signal. This clock signal can be supplied either to
pin XTAL1 (core voltage domain) or to pin CLKIN1 (IO voltage domain).
If connected to CLKIN1, the input signal must reach the defined input levels VIL and VIH.
In connected to XTAL1, a minimum amplitude VAX1 (peak-to-peak voltage) is sufficient
for the operation of the on-chip oscillator.
Note: The given clock timing parameters (t1 … t4) are only valid for an external clock
input signal.
Table 26
External Clock Input Characteristics
(Operating Conditions apply)
Parameter
Symbol
Limit Values
Unit Note / Test
Condition
Min.
Input voltage range limits VIX1 SR -1.7 +
Typ.
Max.
1)
–
1.7
V
for signal on XTAL1
VDDI
Input voltage (amplitude)
on XTAL1
V
AX1 SR 0.3 ×
–
–
V
Peak-to-peak
voltage2)
VDDI
XTAL1 input current
Oscillator frequency
IIL CC
–
–
–
–
±20
40
µA
0 V < VIN < VDDI
f
OSC CC 4
MHz Clock signal
4
16
MHz Crystal or
Resonator
High time
Low time
Rise time
Fall time
t1 SR
t2 SR
t3 SR
t4 SR
6
6
–
–
–
–
8
8
–
–
8
8
ns
ns
ns
ns
1) Overload conditions must not occur on pin XTAL1.
2) The amplitude voltage VAX1 refers to the offset voltage VOFF. This offset voltage must be stable during the
operation and the resulting voltage peaks must remain within the limits defined by VIX1.
Data Sheet
96
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
t3
t1
VOFF
VAX1
t2
t4
tOSC = 1/fOSC
MC_EXTCLOCK
Figure 20
External Clock Drive XTAL1
Note: For crystal/resonator operation, it is strongly recommended to measure the
oscillation allowance (negative resistance) in the final target system (layout) to
determine the optimum parameters for oscillator operation.
Please refer to the limits specified by the crystal/resonator supplier.
Data Sheet
97
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
4.6.4
External Bus Timing
The following parameters specify the behavior of the XC226x bus interface.
Table 27
CLKOUT Reference Signal
Symbol
Parameter
Limits
Max.
Unit Note / Test
Condition
Min.
CLKOUT cycle time
CLKOUT high time
CLKOUT low time
CLKOUT rise time
CLKOUT fall time
t5
t6
t7
t8
t9
CC
40/25/12.51)
ns
ns
ns
ns
ns
CC 3
CC 3
CC –
CC –
–
–
3
3
1) The CLKOUT cycle time is influenced by the PLL jitter (given values apply to fSYS = 25/40/80 MHz).
For longer periods the relative deviation decreases (see PLL deviation formula).
t9
t8
t5
t6
t7
CLKOUT
MC_X_EBCCLKOUT
Figure 21
CLKOUT Signal Timing
Note: The term CLKOUT refers to the reference clock output signal which is generated
by selecting fSYS as the source signal for the clock output signal EXTCLK on pin
P2.8 and by enabling the high-speed clock driver on this pin.
Data Sheet
98
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
Variable Memory Cycles
External bus cycles of the XC226x are executed in five consecutive cycle phases (AB,
C, D, E, F). The duration of each cycle phase is programmable (via the TCONCSx
registers) to adapt the external bus cycles to the respective external module (memory,
peripheral, etc.).
The duration of the access phase can optionally be controlled by the external module
using the READY handshake input.
This table provides a summary of the phases and the ranges for their length.
Table 28
Programmable Bus Cycle Phases (see timing diagrams)
Parameter Valid Values Unit
Bus Cycle Phase
Address setup phase, the standard duration of this tpAB
phase (1 … 2 TCS) can be extended by 0 … 3 TCS
if the address window is changed
1 … 2 (5)
TCS
Command delay phase
tpC
tpD
tpE
tpF
0 … 3
0 … 1
1 … 32
0 … 3
TCS
TCS
TCS
TCS
Write Data setup/MUX Tristate phase
Access phase
Address/Write Data hold phase
Note: The bandwidth of a parameter (from minimum to maximum value) covers the
whole operating range (temperature, voltage) as well as process variations. Within
a given device, however, this bandwidth is smaller than the specified range. This
is also due to interdependencies between certain parameters. Some of these
interdependencies are described in additional notes (see standard timing).
Data Sheet
99
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
Table 29
External Bus Cycle Timing for Upper Voltage Range
(Operating Conditions apply)
Parameter
Symbol
Limits
Typ.
Unit Note
Min.
Max.
Output valid delay for:
RD, WR(L/H)
t10 CC
t11 CC
t12 CC
t13 CC
t14 CC
t15 CC
t16 CC
–
13
ns
ns
ns
ns
ns
ns
ns
Output valid delay for:
BHE, ALE
–
–
–
–
–
–
13
14
14
13
14
14
Output valid delay for:
A23 … A16, A15 … A0 (on P0/P1)
Output valid delay for:
A15 … A0 (on P2/P10)
Output valid delay for:
CS
Output valid delay for:
D15 … D0 (write data, MUX-mode)
Output valid delay for:
D15 … D0 (write data, DEMUX-
mode)
Output hold time for:
RD, WR(L/H)
t20 CC
t21 CC
t23 CC
t24 CC
t25 CC
t30 SR
t31 SR
0
8
8
8
8
8
–
–
ns
ns
ns
ns
ns
ns
ns
Output hold time for:
BHE, ALE
0
Output hold time for:
A23 … A16, A15 … A0 (on P2/P10)
0
Output hold time for:
CS
0
Output hold time for:
D15 … D0 (write data)
0
Input setup time for:
READY, D15 … D0 (read data)
18
-4
Input hold time for:
READY, D15 … D0 (read data)1)
1) Read data are latched with the same internal clock edge that triggers the address change and the rising edge
of RD. Address changes before the end of RD have no impact on (demultiplexed) read cycles. Read data can
change after the rising edge of RD.
Data Sheet
100
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
Table 30
External Bus Cycle Timing for Lower Voltage Range
(Operating Conditions apply)
Parameter
Symbol
Limits
Typ.
Unit Note
Min.
Max.
Output valid delay for:
RD, WR(L/H)
t10 CC
t11 CC
t12 CC
t13 CC
t14 CC
t15 CC
t16 CC
–
20
ns
ns
ns
ns
ns
ns
ns
Output valid delay for:
BHE, ALE
–
–
–
–
–
–
20
22
22
20
21
21
Output valid delay for:
A23 … A16, A15 … A0 (on P0/P1)
Output valid delay for:
A15 … A0 (on P2/P10)
Output valid delay for:
CS
Output valid delay for:
D15 … D0 (write data, MUX-mode)
Output valid delay for:
D15 … D0 (write data, DEMUX-
mode)
Output hold time for:
RD, WR(L/H)
t20 CC
t21 CC
t23 CC
t24 CC
t25 CC
t30 SR
t31 SR
0
10
10
10
10
10
–
ns
ns
ns
ns
ns
ns
ns
Output hold time for:
BHE, ALE
0
Output hold time for:
A23 … A16, A15 … A0 (on P2/P10)
0
Output hold time for:
CS
0
Output hold time for:
D15 … D0 (write data)
0
Input setup time for:
READY, D15 … D0 (read data)
29
-6
Input hold time for:
–
READY, D15 … D0 (read data)1)
1) Read data are latched with the same internal clock edge that triggers the address change and the rising edge
of RD. Address changes before the end of RD have no impact on (demultiplexed) read cycles. Read data can
change after the rising edge of RD.
Data Sheet
101
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
tpAB
tpC
tpD
tpE
tpF
CLKOUT
ALE
t21
t11
t11/t14
t24
A23-A16,
BHE, CSx
High Address
t20
t10
RD
WR(L/H)
t31
t13
t23
t30
AD15-AD0
(read)
Low Address
Low Address
Data In
t13
t15
t25
AD15-AD0
(write)
Data Out
MC_X_EBCMUX
Figure 22
Multiplexed Bus Cycle
Data Sheet
102
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
tpAB
tpC
tpD
tpE
tpF
CLKOUT
ALE
t21
t11
t11/t14
t24
A23-A0,
BHE, CSx
Address
t20
t10
RD
WR(L/H)
t31
t30
D15-D0
(read)
Data In
t16
t25
D15-D0
(write)
Data Out
MC_X_EBCDEMUX
Figure 23
Demultiplexed Bus Cycle
Data Sheet
103
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
Bus Cycle Control with the READY Input
The duration of an external bus cycle can be controlled by the external circuit using the
READY input signal. The polarity of this input signal can be selected.
Synchronous READY permits the shortest possible bus cycle but requires the input
signal to be synchronous to the reference signal CLKOUT.
An asynchronous READY signal puts no timing constraints on the input signal but incurs
a minimum of one waitstate due to the additional synchronization stage. The minimum
duration of an asynchronous READY signal for safe synchronization is one CLKOUT
period plus the input setup time.
An active READY signal can be deactivated in response to the trailing (rising) edge of
the corresponding command (RD or WR).
If the next bus cycle is controlled by READY, an active READY signal must be disabled
before the first valid sample point in the next bus cycle. This sample point depends on
the programmed phases of the next cycle.
Data Sheet
104
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
tpD
tpE
tpRDY
tpF
CLKOUT
RD, WR
t10
t20
t31
t30
D15-D0
(read)
Data In
t25
D15-D0
(write)
Data Out
t31
t30
t31
t30
READY
Synchronous
Not Rdy
READY
t31
t30
t31
t30
READY
Asynchron.
Not Rdy
READY
MC_X_EBCREADY
Figure 24
READY Timing
Note: If the READY input is sampled inactive at the indicated sampling point (“Not Rdy”)
a READY-controlled waitstate is inserted (tpRDY),
sampling the READY input active at the indicated sampling point (“Ready”)
terminates the currently running bus cycle.
Note the different sampling points for synchronous and asynchronous READY.
This example uses one mandatory waitstate (see tpE) before the READY input
value is used.
Data Sheet
105
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
4.6.5
Synchronous Serial Interface Timing
The following parameters are applicable for a USIC channel operated in SSC mode.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Table 31
SSC Master/Slave Mode Timing for Upper Voltage Range
(Operating Conditions apply), CL = 50 pF
Parameter
Symbol
Values
Typ.
Unit Note /
Test Co
Min.
Max.
ndition
Master Mode Timing
1)
3)
2)
Slave select output SELO active t1 CC
to first SCLKOUT transmit edge
0
–
–
ns
Slaveselect output SELO inactive t2 CC
0.5 ×
ns
after last SCLKOUT receive edge
tBIT
Transmit data output valid time
t3 CC
-6
–
–
13
–
ns
ns
Receive data input setup time to t4 SR
31
SCLKOUT receive edge
Data input DX0 hold time from
SCLKOUT receive edge
t5 SR
-7
–
–
ns
Slave Mode Timing
4)
Select input DX2 setup to first
clock input DX1 transmit edge
t10 SR
t11 SR
t12 SR
t13 SR
t14 CC
7
5
7
5
8
–
–
–
–
–
–
ns
4)
Select input DX2 hold after last
clock input DX1 receive edge
–
ns
4)
Data input DX0 setup time to
clock input DX1 receive edge
–
ns
4)
Data input DX0 hold time from
clock input DX1 receive edge
–
ns
4)
Data output DOUT valid time
29
ns
1) The maximum value further depends on the settings for the slave select output leading delay.
2) tSYS = 1/fSYS (= 12.5 ns @ 80 MHz)
3) The maximum value depends on the settings for the slave select output trailing delay and for the shift clock
output delay.
4) These input timings are valid for asynchronous input signal handling of slave select input, shift clock input, and
receive data input (bits DXnCR.DSEN = 0).
Data Sheet
106
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
Table 32
SSC Master/Slave Mode Timing for Lower Voltage Range
(Operating Conditions apply), CL = 50 pF
Parameter
Symbol Values
Unit Note /
Test Co
Min.
Typ.
Max.
ndition
Master Mode Timing
1)
3)
2)
Slave select output SELO active t1 CC
to first SCLKOUT transmit edge
0
–
–
ns
2)
Slaveselect output SELO inactive t2 CC
0.5 ×
ns
after last SCLKOUT receive edge
tBIT
Transmit data output valid time
t3 CC
-13
48
–
–
16
–
ns
ns
Receive data input setup time to t4 SR
SCLKOUT receive edge
Data input DX0 hold time from
SCLKOUT receive edge
t5 SR
-11
–
–
ns
Slave Mode Timing
4)
Select input DX2 setup to first
clock input DX1 transmit edge
t10 SR
t11 SR
t12 SR
t13 SR
t14 CC
12
8
–
–
–
–
–
–
ns
4)
Select input DX2 hold after last
clock input DX1 receive edge
–
ns
4)
Data input DX0 setup time to
clock input DX1 receive edge
12
8
–
ns
4)
Data input DX0 hold time from
clock input DX1 receive edge
–
ns
4)
Data output DOUT valid time
11
44
ns
1) The maximum value further depends on the settings for the slave select output leading delay.
2) tSYS = 1/fSYS (= 12.5 ns @ 80 MHz)
3) The maximum value depends on the settings for the slave select output trailing delay and for the shift clock
output delay.
4) These input timings are valid for asynchronous input signal handling of slave select input, shift clock input, and
receive data input (bits DXnCR.DSEN = 0).
Data Sheet
107
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
Master Mode Timing
t1
t2
Select Output
SELOx
Inactive
Inactive
Active
Clock Output
SCLKOUT
Receive
Edge
Last Receive
Transmit
Edge
First Transmit
Edge
Edge
t3
t3
Data Output
DOUT
t4
t4
t5
t5
Data Input
DX0
Data
valid
Data
valid
Slave Mode Timing
t10
t11
Select Input
DX2
Inactive
Active
Inactive
Clock Input
DX1
Receive
Edge
Last Receive
Edge
First Transmit
Edge
Transmit
Edge
t12
t12
t13
t13
Data Input
DX0
Data
valid
Data
valid
t14
t14
Data Output
DOUT
Transmit Edge: with this clock edge, transmit data is shifted to transmit data output.
Receive Edge: with this clock edge, receive data at receive data input is latched.
Drawn for BRGH.SCLKCFG = 00B. Also valid for for SCLKCFG = 01B with inverted SCLKOUT signal.
USIC_SSC_TMGX.VSD
Figure 25
USIC - SSC Master/Slave Mode Timing
Note: This timing diagram shows a standard configuration where the slave select signal
is low-active and the serial clock signal is not shifted and not inverted.
Data Sheet
108
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
4.6.6
JTAG Interface Timing
The following parameters are applicable for communication through the JTAG debug
interface. The JTAG module is fully compliant with IEEE1149.1-2000.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Table 33
JTAG Interface Timing Parameters
(Operating Conditions apply)
Parameter
Symbol
Values
Unit Note /
Test Condition
Min.
60
16
16
–
Typ.
50
–
Max.
TCK clock period
TCK high time
t1 SR
t2 SR
t3 SR
t4 SR
t5 SR
t6 SR
–
–
–
8
8
–
ns
ns
ns
ns
ns
ns
–
–
–
–
–
–
TCK low time
–
TCK clock rise time
TCK clock fall time
–
–
–
TDI/TMS setup
6
–
to TCK rising edge
TDI/TMS hold
t7 SR
6
–
–
ns
–
after TCK rising edge
TDO valid
t8 CC
t8 CC
–
–
–
–
30
–
ns
ns
ns
CL = 50 pF
CL = 20 pF
CL = 50 pF
after TCK falling edge1)
10
–
TDO high imped. to valid t9 CC
30
from TCK falling edge1)2)
TDO valid to high imped. t10 CC
–
–
30
ns
CL = 50 pF
from TCK falling edge1)
1) The falling edge on TCK is used to generate the TDO timing.
2) The setup time for TDO is given implicitly by the TCK cycle time.
Data Sheet
109
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Electrical Parameters
t1
0.9 VDDP
0.5 VDDP
0.1 VDDP
t5
t4
t2
t3
MC_JTAG_TCK
Figure 26
Test Clock Timing (TCK)
TCK
t6
t7
TMS
t6
t7
TDI
t9
t8
t10
TDO
MC_JTAG
Figure 27
JTAG Timing
Data Sheet
110
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Package and Reliability
5
Package and Reliability
In addition to the electrical parameters, the following specifcations ensure proper
integration of the XC226x into the target system.
5.1
Packaging
These parameters specify the packaging rather than the silicon.
Table 34
Package Parameters (PG-LQFP-100-3)
Parameter
Symbol
Limit Values
Max.
Unit Notes
Min.
Exposed Pad Dimension Ex × Ey –
6.2 × 6.2
mm –
Power Dissipation
PDISS
RΘJA
–
–
1.0
49
37
22
W
–
Thermal resistance
Junction-Ambient
K/W No thermal via1)
K/W 4-layer, no pad2)
K/W 4-layer, pad3)
1) Device mounted on a 2-layer JEDEC board (according to JESD 51-3) or a 4-layer board without thermal vias;
exposed pad not soldered.
2) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad not
soldered.
3) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad soldered
to the board.
Data Sheet
111
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Package and Reliability
Package Outlines
Figure 28
PG-LQFP-100-3 (Plastic Green Thin Quad Flat Package)
All dimensions in mm.
You can find complete information about Infineon packages, packing and marking in our
Infineon Internet Page “Packages”: http://www.infineon.com/packages
Data Sheet
112
V2.1, 2008-08
XC2267 / XC2264
XC2000 Family Derivatives
Package and Reliability
5.2
Thermal Considerations
When operating the XC226x in a system, the total heat generated in the chip must be
dissipated to the ambient environment to prevent overheating and the resulting thermal
damage.
The maximum heat that can be dissipated depends on the package and its integration
into the target board. The “Thermal resistance RΘJA” quantifies these parameters. The
power dissipation must be limited so that the average junction temperature does not
exceed 150 °C.
The difference between junction temperature and ambient temperature is determined by
∆T = (PINT + PIOSTAT + PIODYN) × RΘJA
The internal power consumption is defined as
P
INT = VDDP × IDDP (see Section 4.2.3).
The static external power consumption caused by the output drivers is defined as
IOSTAT = Σ((VDDP-VOH) × IOH) + Σ(VOL × IOL)
P
The dynamic external power consumption caused by the output drivers (PIODYN) depends
on the capacitive load connected to the respective pins and their switching frequencies.
If the total power dissipation for a given system configuration exceeds the defined limit,
countermeasures must be taken to ensure proper system operation:
•
•
•
•
Reduce VDDP, if possible in the system
Reduce the system frequency
Reduce the number of output pins
Reduce the load on active output drivers
Data Sheet
113
V2.1, 2008-08
w w w . i n f i n e o n . c o m
Published by Infineon Technologies AG
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