IN74HC174AD
更新时间:2024-09-18 02:21:08
品牌:INTEGRAL
描述:Hex D Flip-Flop with Common Clock and Reset High-Performance Silicon-Gate CMOS
IN74HC174AD 概述
Hex D Flip-Flop with Common Clock and Reset High-Performance Silicon-Gate CMOS 六路D触发器与普通时钟和复位高性能硅栅CMOS 触发器/锁存器
IN74HC174AD 规格参数
生命周期: | Contact Manufacturer | 包装说明: | , |
Reach Compliance Code: | unknown | 风险等级: | 5.75 |
Base Number Matches: | 1 |
IN74HC174AD 数据手册
通过下载IN74HC174AD数据手册来全面了解它。这个PDF文档包含了所有必要的细节,如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载TECHNICAL DATA
IN74HC174A
Hex D Flip-Flop with
Common Clock and Reset
High-Performance Silicon-Gate CMOS
The IN74HC174A is identical in pinout to the LS/ALS174. The
device inputs are compatible with standard CMOS outputs; with pullup
resistors, they are compatible with LS/ALSTTL outputs.
This device consists of six D flip-flops with common Clock and
Reset inputs. Each flip-flop is loaded with a low-to-high transition of
the Clock input. Reset is asynchronous and active-low.
·
·
·
·
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2.0 to 6.0 V
Low Input Current: 1.0 mA
ORDERING INFORMATION
IN74HC174AN Plastic
IN74HC174AD SOIC
IZ74HC174A Chip
High Noise Immunity Characteristic of CMOS Devices
TA = -55° to 125° C for all packages
PIN ASSIGNMENT
LOGIC DIAGRAM
FUNCTION TABLE
Inputs
Clock
X
Output
Reset
L
D
X
H
L
Q
L
PIN 16=VCC
PIN 8 = GND
H
H
H
L
H
L
X
X
no change
no change
H
X = Don’t care
L = LOW voltage level
H = HIGH voltage level
INTEGRAL
1
IN74HC174A
MAXIMUM RATINGS*
Symbol
Parameter
Value
-0.5 to +7.0
-1.5 to VCC +1.5
-0.5 to VCC +0.5
±20
Unit
V
VCC
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
V
IN
V
VOUT
IIN
V
mA
mA
mA
mW
IOUT
ICC
DC Output Current, per Pin
±25
DC Supply Current, VCC and GND Pins
±50
PD
Power Dissipation in Still Air, Plastic DIP+
SOIC Package+
750
500
Tstg
TL
Storage Temperature
-65 to +150
260
°C
°C
Lead Temperature, 1,5 mm from Case for 4 Seconds
(Plastic DIP or SOIC Package)
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
+Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C
SOIC Package: : - 7 mW/°C from 65° to 125°C
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Min
2.0
0
Max
6.0
Unit
V
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
Operating Temperature, All Package Types
V , VOUT
IN
VCC
V
TA
-55
+125
°C
ns
tr, tf
Input Rise and Fall Time (Figure 1)
VCC =2.0 V
VCC =4.5 V
VCC =6.0 V
0
0
0
1000
500
400
This device contains protection circuitry to guard against damage due to high static voltages or electric
fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages
to this high-impedance circuit. For proper operation, V and VOUT should be constrained to the range GND£(V or
IN
IN
VOUT)£VCC.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused
outputs must be left open.
INTEGRAL
2
IN74HC174A
DC ELECTRICAL CHARACTERISTICS(Voltages Referenced to GND)
VCC
V
Guaranteed Limit
Symbol
Parameter
Test Conditions
-55°C
to
£85
°C
£125
°C
Unit
V
25°C
V
IH
Minimum High-Level
Input Voltage
VOUT³ VCC-0.1 V
or £0.1 V
êIOUTê£ 20 mA
2.0
4.5
6.0
1.5
3.15
4.2
1.5
3.15
4.2
1.5
3.15
4.2
V
IL
Maximum Low -Level
Input Voltage
VOUT£0.1 V
or ³ VCC-0.1 V
êIOUTê £ 20 mA
2.0
4.5
6.0
0.5
1.35
1.8
0.5
1.35
1.8
0.5
1.35
1.8
V
VOH
Minimum High-Level
Output Voltage
V =V or V
IL
êIOUTê £ 20 mA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
IN
IH
V =V or V
IL
IN
IH
êIOUTê £ 4.0 mA
êIOUTê £ 5.2 mA
4.5
6.0
3.98
5.48
3.84
5.34
3.7
5.2
VOL
Maximum Low-Level
Output Voltage
V = V or V
IH
êIOUTê £ 20 mA
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
IN
IL
V = V or V
IH
IN
IL
êIOUTê £ 4.0 mA
êIOUTê £ 5.2 mA
4.5
6.0
0.26
0.26
0.33
0.33
0.4
0.4
IIN
Maximum Input
Leakage Current
V =VCC or GND
6.0
±0.1
±1.0
±1.0
mA
mA
IN
ICC
Maximum Quiescent
Supply Current
(per Package)
V =VCC or GND
6.0
4.0
40
160
IN
IOUT=0mA
INTEGRAL
3
IN74HC174A
AC ELECTRICAL CHARACTERISTICS(CL=50pF, Input tr=tf=6.0 ns, V = 0 V, V =Vcc)
IL
IH
VCC
V
Guaranteed Limit
Symbol
fmax
Parameter
-55°C
£85°C
£125°C
Unit
MHz
ns
to
25°C
Maximum Clock Frequency (50% Duty Cycle)
(Figures 1 and 4)
2.0
4.5
6.0
6.0
30
35
4.8
24
28
4.0
20
24
tPLH, tPHL Maximum Propagation Delay, Clock to Q (Figures
1 and 4)
2.0
4.5
6.0
110
22
19
140
28
24
165
33
28
tPHL
Maximum Propagation Delay , Reset to Q
(Figures 2 and 4)
2.0
4.5
6.0
110
21
19
140
28
24
160
32
27
ns
tTLH, tTHL Maximum Output Transition Time, Any Output
(Figures 1 and 4)
2.0
4.5
6.0
75
15
13
95
19
16
110
22
19
ns
CIN
Maximum Input Capacitance
-
10
10
10
pF
Power Dissipation Capacitance (Per Enabled
Output)
Typical @25°C,VCC=5.0 V
CPD
Used to determine the no-load dynamic power
consumption: PD=CPDVCC2f+ICCVCC
62
pF
TIMING REQUIREMENTS (CL=50pF,Input tr=tf=6.0 ns, V = 0 V, V =Vcc)
IL
IH
VCC
V
Guaranteed Limit
Symbol
tSU
Parameter
-55 °C to
25°C
£85°C
£125°C
Unit
Minimum Setup Time, Data to
Clock (Figure 3)
2.0
4.5
6.0
50
10
9
65
13
11
75
15
13
ns
ns
ns
ns
ns
ns
th
trec
tw
Minimum Hold Time, Clock to
Data (Figure 3)
2.0
4.5
6.0
5
5
5
5
5
5
5
5
5
Minimum Recovery Time,
Reset Inactive to Clock (Figure
2)
2.0
4.5
6.0
5
5
5
5
5
5
5
5
5
Minimum Pulse Width, Clock
(Figure 1)
2.0
4.5
6.0
75
15
13
95
19
16
110
22
19
tw
Minimum Pulse Width, Reset
(Figure 2)
2.0
4.5
6.0
75
15
13
95
19
16
110
22
19
tr, tf
Maximum Input Rise and Fall
Times (Figure 1)
2.0
4.5
6.0
1000
500
400
1000
500
400
1000
500
400
INTEGRAL
4
IN74HC174A
tw
VCC
t
t
r
f
RESET
Q
50%
VCC
90%
50%
10%
GND
CLOCK
tPHL
GND
tw
50%
1/f
max
tPLH
tPHL
trec
Q
90%
50%
10%
VCC
CLOCK
50%
GND
tTLH
tTHL
Figure 1. Switching Waveforms
Figure 2. Switching Waveforms
TEST POINT
VALID
VCC
DATA
50%
DEVICE
UNDER
TEST
OUTPUT
GND
tsu
th
*
L
C
VCC
CLOCK
50%
GND
Figure 3. Switching Waveforms
Figure 4. Test Circuit
EXPANDED LOGIC DIAGRAM
INTEGRAL
5
IN74HC174A
CHIP PAD DIAGRAM
Chip marking
13
12
14
11
15
10
09
16
08
07
01
02
03
04
05
06
1.6 + 0.03
Chip marking :15HC174
Location of marking (mm): left lower corner x = 0.110, y = 0.870; right lower corner x = 0.240, y = 0.900
Chip thickness: 0.46 ± 0.02 mm
PAD LOCATION
Pad No
Pad size, mm
Symbol
Location (left lower corner), mm
X
Y
01
02
03
04
05
06
07
08
09
10
11
12
13
14
15
16
Reset
Q0
D0
D1
Q1
D2
Q2
GND
Clock
Q3
D3
Q4
D4
D5
Q5
Vcc
0.115
0.115
0.325
0.580
0.850
1.145
1.345
1.370
1.365
1.355
1.155
0.880
0.620
0.320
0.125
0.115
0.340
0.140
0.115
0.115
0.115
0.115
0.140
0.355
0.815
1.045
1.065
1.065
1.065
1.065
1.045
0.660
0.12´ 0.12
0.12´ 0.12
0.12´ 0.12
0.12´ 0.12
0.12´ 0.12
0.12´ 0.12
0.12´ 0.12
0.12´ 0.16
0.12´ 0.12
0.12´ 0.12
0.12´ 0.12
0.12´ 0.12
0.12´ 0.12
0.12´ 0.12
0.12´ 0.12
0.12´ 0.19
Note: Location is given as per passivation layer
INTEGRAL
6
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