AV8063801149402 [INTEL]
Microprocessor, 2800MHz, CMOS, PBGA1023, FCBGA-1023;
| 型号： | AV8063801149402 |
| 厂家： | 
INTEL |
| 描述： | Microprocessor, 2800MHz, CMOS, PBGA1023, FCBGA-1023 |
| 文件： | 总4页 (文件大小：187K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
30/09/2015
ARK | Intel® Core™ i73517UE Processor (4M Cache, up to 2.80 GHz)
Intel® Core™ i7-3517UE Processor
(4M Cache, up to 2.80 GHz)
Specifications
‐ Essentials
Status
Launched
Q2'12
i7-3517UE
4 MB
Launch Date
Processor Number
Intel® Smart Cache
DMI
5 GT/s
64-bit
AVX
Instruction Set
Instruction Set Extensions
Embedded Options Available
Lithography
Yes
22 nm
TRAY: $320.00
Yes
Recommended Customer Price
Conflict Free
Datasheet
Link
Product Brief
yes
‐ Performance
# of Cores
2
# of Threads
4
Processor Base Frequency
Max Turbo Frequency
TDP
1.7 GHz
2.8 GHz
17 W
‐ Memory Specifications
Max Memory Size (dependent on memory type)
Memory Types
16 GB
DDR3/DDR3L 1333/1600
Max # of Memory Channels
Max Memory Bandwidth
2
25.6 GB/s
Yes
ECC Memory Supported ‡
‐ Graphics Specifications
Processor Graphics ‡
Intel® HD Graphics 4000
Graphics Base Frequency
Graphics Max Dynamic Frequency
Graphics Output
350 MHz
1 GHz
eDP/DP/HDMI/SDVO/CRT
Intel® Quick Sync Video
Intel® InTru™ 3D Technology
Intel® Insider™
Yes
Yes
No
Intel® Wireless Display
No
Intel® Flexible Display Interface (Intel® FDI)
Yes
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30/09/2015
ARK | Intel® Core™ i73517UE Processor (4M Cache, up to 2.80 GHz)
Intel® Clear Video HD Technology
Intel® Clear Video Technology
# of Displays Supported ‡
Yes
No
3
‐ Expansion Options
PCI Express Revision
3.0
PCI Express Configurations ‡
Max # of PCI Express Lanes
1x16 2x8 1x8 2x4
16
‐ Package Specifications
T
105°C
JUNCTION
Package Size
31mm x 24mm
22nm
Graphics and IMC Lithography
Sockets Supported
FCBGA1023
See MDDS
Low Halogen Options Available
‐ Advanced Technologies
Intel® Turbo Boost Technology ‡
Intel® vPro Technology ‡
2.0
Yes
Yes
Yes
Intel® Hyper-Threading Technology ‡
Intel® Virtualization Technology (VT-x) ‡
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Intel® VT-x with Extended Page Tables (EPT) ‡
Intel® 64 ‡
Yes
Yes
Yes
Yes
No
Intel® My WiFi Technology
4G WiMAX Wireless Technology
Idle States
Yes
Yes
No
Enhanced Intel SpeedStep® Technology
Intel® Demand Based Switching
Thermal Monitoring Technologies
Intel® Fast Memory Access
Yes
Yes
Yes
Yes
Intel® Flex Memory Access
Intel® Identity Protection Technology ‡
‐ Intel® Data Protection Technology
Intel® AES New Instructions
Yes
‐ Intel® Platform Protection Technology
Trusted Execution Technology ‡
Execute Disable Bit ‡
Yes
Yes
No
Anti-Theft Technology
Compatible Products
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30/09/2015
ARK | Intel® Core™ i73517UE Processor (4M Cache, up to 2.80 GHz)
‐ Chipsets
Compare
Compare All
Product Name
Status
Embedded Options Available
TDP
Recommended Customer Price
+
Mobile Intel® QM77 Express Chipset
(Intel® BD82QM77 PCH)
Launched
Launched
Launched
Yes
Yes
Yes
4.1 W T&R : $48.00
3.9 W T&R : $48.00
3.9 W T&R : $40.00
Mobile Intel® QM67 Express Chipset
(Intel® BD82QM67 PCH)
Mobile Intel® HM65 Express Chipset
(Intel® BD82HM65 PCH)
Product Images
Ordering and Spec Information
Trade Compliance Information
ECCN
CCATS
US HTS
5A992C
G077159
8542310000-HYBRD
Ordering and Spec Information
Spec Code
Ordering Code
Step
RCP
Intel® Core™ i7-3517UE Processor (4M Cache, up to 2.80 GHz) FC-BGA12F, Tray
SR0T6 AV8063801149402
L1
$320.00
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The
information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability,
functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
"Intel classifications" consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and
shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company may be the exporter of record, and as such, your company is responsible for determining the
correct classification of any item at the time of export.
Refer to Datasheet for formal definitions of product properties and features.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M.
Please contact OEM for the BIOS that includes the latest Processor configuration update.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications
(motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility.
Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Conflict free” and “conflict-free” means “DRC conflict free”, which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin,
tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term "conflict-free"
in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured
before January 1, 2013 are not confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers
to the processor only, not to any additional included accessories, such as heatsinks/coolers.
See http://www.intel.com/content/www/us/en/architecture-and-technology/hyper-threading/hyper-threading-technology.html?wapkw=hyper+threading for more information including details on
which processors support Intel® HT Technology.
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30/09/2015
ARK | Intel® Core™ i73517UE Processor (4M Cache, up to 2.80 GHz)
Max Turbo Frequency refers to the maximum single-core processor frequency that can be achieved with Intel® Turbo Boost Technology. See www.intel.com/technology/turboboost/ for more
information.
The Recommended Customer Price (“RCP”) is pricing guidance for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change
without notice. Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. Listing of these RCP does not
constitute a formal pricing offer from Intel. Please work with your appropriate Intel representative to obtain a formal price quotation.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly
meet JS-709 requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment.
For benchmarking data see http://www.intel.com/performance.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See
http://www.intel.com/content/www/us/en/processors/processor-numbers.html for details.
Processors that support 64-bit computing on Intel® architecture require an Intel 64 architecture-enabled BIOS.
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