EP4SE530F43C3ES [INTEL]
Field Programmable Gate Array, 21248 CLBs, 717MHz, PBGA1760, 42.50 X 42.50 MM, FBGA-1760;
| 型号： | EP4SE530F43C3ES |
| 厂家： | 
INTEL |
| 描述： | Field Programmable Gate Array, 21248 CLBs, 717MHz, PBGA1760, 42.50 X 42.50 MM, FBGA-1760 栅 |
| 文件： | 总434页 (文件大小：11550K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Stratix IV Device Handbook Volume 1
Stratix IV Device Handbook
Volume 1
101 Innovation Drive
San Jose, CA 95134
www.altera.com
SIV5V1-4.4
© 2011 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX are Reg. U.S. Pat.
& Tm. Off. and/or trademarks of Altera Corporation in the U.S. and other countries. All other trademarks and service marks are the property of their respective
holders as described at www.altera.com/common/legal.html. Altera warrants performance of its semiconductor products to current specifications in accordance
with Altera’s standard warranty, but reserves the right to make changes to any products and services at any time without notice. Altera assumes no responsibility or
liability arising out of the application or use of any information, product, or service described herein except as expressly agreed to in writing by Altera. Altera
customers are advised to obtain the latest version of device specifications before relying on any published information and before placing orders for products or
services.
Stratix IV Device Handbook Volume 1
June 2011 Altera Corporation
Contents
Chapter Revision Dates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi
Section I. Device Core
Chapter 1. Overview for the Stratix IV Device Family
Feature Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2
Stratix IV GX Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3
Stratix IV E Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–4
Stratix IV GT Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–5
Architecture Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–6
High-Speed Transceiver Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–6
Highest Aggregate Data Bandwidth . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–6
Wide Range of Protocol Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–6
Diagnostic Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–7
Signal Integrity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–7
FPGA Fabric and I/O Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–8
Device Core Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–8
Embedded Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–8
Digital Signal Processing (DSP) Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–8
Clock Networks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–8
PLLs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–9
I/O Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–9
High-Speed Differential I/O with DPA and Soft-CDR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–9
External Memory Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–9
System Integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–10
Integrated Software Platform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–19
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–19
Chapter 2. Logic Array Blocks and Adaptive Logic Modules in Stratix IV Devices
Logic Array Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–1
LAB Interconnects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–4
LAB Control Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–4
Adaptive Logic Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–5
ALM Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–8
Normal Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–9
Extended LUT Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–11
Arithmetic Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–12
Shared Arithmetic Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–14
LUT-Register Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–15
Register Chain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–17
ALM Interconnects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–18
Clear and Preset Logic Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–18
LAB Power Management Techniques . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–19
Chapter 3. TriMatrix Embedded Memory Blocks in Stratix IV Devices
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–1
TriMatrix Memory Block Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–3
Parity Bit Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–3
June 2011 Altera Corporation
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iv
Contents
Byte Enable Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–3
Packed Mode Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–4
Address Clock Enable Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–5
Mixed Width Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–6
Asynchronous Clear . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–6
Error Correction Code (ECC) Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–7
Memory Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–8
Single-Port RAM Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–9
Simple Dual-Port Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–10
True Dual-Port Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–13
Shift-Register Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–15
ROM Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–16
FIFO Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–16
Clocking Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–16
Independent Clock Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–17
Input/Output Clock Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–17
Read/Write Clock Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–17
Single Clock Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–17
Design Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–17
Selecting TriMatrix Memory Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–17
Conflict Resolution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–18
Read-During-Write Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–18
Same-Port Read-During-Write Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–18
Mixed-Port Read-During-Write Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–20
Power-Up Conditions and Memory Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–22
Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–23
Chapter 4. DSP Blocks in Stratix IV Devices
Stratix IV DSP Block Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–2
Stratix IV Simplified DSP Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–4
Stratix IV Operational Modes Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–8
Stratix IV DSP Block Resource Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–9
Input Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–10
Multiplier and First-Stage Adder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–12
Pipeline Register Stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–13
Second-Stage Adder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–13
Rounding and Saturation Stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–14
Second Adder and Output Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–14
Stratix IV Operational Mode Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–15
Independent Multiplier Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–15
9-, 12-, and 18-Bit Multiplier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–15
36-Bit Multiplier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–19
Double Multiplier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–20
Two-Multiplier Adder Sum Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–22
18 x 18 Complex Multiply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–24
Four-Multiplier Adder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–26
High-Precision Multiplier Adder Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–27
Multiply Accumulate Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–29
Shift Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–30
Rounding and Saturation Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–32
DSP Block Control Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–34
Software Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–35
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Chapter 5. Clock Networks and PLLs in Stratix IV Devices
Clock Networks in Stratix IV Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1
Global Clock Networks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–3
Regional Clock Networks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–4
Periphery Clock Networks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–6
Clock Sources Per Quadrant . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–9
Clock Regions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–9
Clock Network Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–10
Dedicated Clock Input Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–10
LABs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–10
PLL Clock Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–11
Clock Input Connections to the PLLs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–12
Clock Output Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–13
Clock Control Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–14
Clock Enable Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–18
Clock Source Control for PLLs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–19
Cascading PLLs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–20
PLLs in Stratix IV Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–20
Stratix IV PLL Hardware Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–23
PLL Clock I/O Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–24
PLL Control Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–27
pfdena . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–27
areset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–27
locked . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–27
Clock Feedback Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–28
Source Synchronous Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–29
Source-Synchronous Mode for LVDS Compensation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–30
No-Compensation Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–30
Normal Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–31
Zero-Delay Buffer (ZDB) Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–31
External Feedback Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–32
Clock Multiplication and Division . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–33
Post-Scale Counter Cascading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–34
Programmable Duty Cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–35
Programmable Phase Shift . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–35
Programmable Bandwidth . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–37
Background . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–37
Implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–38
Spread-Spectrum Tracking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–39
Clock Switchover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–39
Automatic Clock Switchover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–40
Manual Clock Switchover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–43
Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–43
PLL Reconfiguration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–44
PLL Reconfiguration Hardware Implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–45
Post-Scale Counters (C0 to C9) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–47
Scan Chain Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–48
Charge Pump and Loop Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–50
Bypassing a PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–51
Dynamic Phase-Shifting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–51
PLL Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–54
Section II. I/O Interfaces
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Contents
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1
Chapter 6. I/O Features in Stratix IV Devices
I/O Standards Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–2
I/O Standards and Voltage Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–3
I/O Banks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–5
Modular I/O Banks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–8
I/O Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–17
3.3-V I/O Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–19
External Memory Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–19
High-Speed Differential I/O with DPA Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–20
Programmable Current Strength . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–20
Programmable Slew Rate Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–21
Programmable I/O Delay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–22
Programmable IOE Delay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–22
Programmable Output Buffer Delay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–22
Open-Drain Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–22
Bus Hold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–22
Programmable Pull-Up Resistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–23
Programmable Pre-Emphasis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–23
Programmable Differential Output Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–23
MultiVolt I/O Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–23
On-Chip Termination Support and I/O Termination Schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–24
On-Chip Series (R ) Termination Without Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–25
S
On-Chip Series Termination with Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–26
Left-Shift Series Termination Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–27
On-Chip Parallel Termination with Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–28
Expanded On-Chip Series Termination with Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–29
Dynamic On-Chip Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–29
LVDS Input OCT (R ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–31
D
Summary of OCT Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–31
OCT Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–32
OCT Calibration Block Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–32
Sharing an OCT Calibration Block on Multiple I/O Banks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–34
OCT Calibration Block Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–35
Power-Up Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–35
User Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–36
OCT Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–37
Serial Data Transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–37
Example of Using Multiple OCT Calibration Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–38
R Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–38
S
Termination Schemes for I/O Standards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–38
Single-Ended I/O Standards Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–38
Differential I/O Standards Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–41
LVDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–43
Differential LVPECL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–44
RSDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–45
Mini-LVDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–46
Design Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–46
I/O Bank Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–46
Non-Voltage-Referenced Standards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–47
Voltage-Referenced Standards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–47
Mixing Voltage-Referenced and Non-Voltage-Referenced Standards . . . . . . . . . . . . . . . . . . . . . 6–47
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Chapter 7. External Memory Interfaces in Stratix IV Devices
Memory Interfaces Pin Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–3
Using the R and R
Pins in a DQS/DQ Group Used for Memory Interfaces . . . . . . . . . . . . . . 7–26
UP
DN
Combining ×16/×18 DQS/DQ Groups for a ×36 QDR II+/QDR II SRAM Interface . . . . . . . . . . . 7–26
Rules to Combine Groups . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–27
Stratix IV External Memory Interface Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–29
DQS Phase-Shift Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–29
DLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–31
Phase Offset Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–42
DQS Logic Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–44
DQS Delay Chain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–45
Update Enable Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–45
DQS Postamble Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–46
Leveling Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–47
Dynamic On-Chip Termination Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–49
I/O Element Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–50
Delay Chain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–53
I/O Configuration Block and DQS Configuration Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–55
Chapter 8. High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–1
Locations of the I/O Banks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–3
LVDS Channels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–4
LVDS SERDES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–8
ALTLVDS Port List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–9
Differential Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–11
Programmable V
and Programmable Pre-Emphasis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–14
OD
Programmable VOD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–15
Programmable Pre-Emphasis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–16
Differential Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–17
Differential I/O Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–18
Receiver Hardware Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–19
DPA Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–19
Synchronizer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–20
Data Realignment Block (Bit Slip) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–20
Deserializer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–22
Receiver Data Path Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–22
Non-DPA Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–22
DPA Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–24
Soft-CDR Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–25
LVDS Interface with the Use External PLL Option Enabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–26
Left and Right PLLs (PLL_Lx and PLL_Rx) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–29
Stratix IV Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–30
Source-Synchronous Timing Budget . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–31
Differential Data Orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–31
Differential I/O Bit Position . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–31
Transmitter Channel-to-Channel Skew . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–33
Receiver Skew Margin for Non-DPA Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–33
Differential Pin Placement Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–38
Guidelines for DPA-Enabled Differential Channels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–38
DPA-Enabled Channels and Single-Ended I/Os . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–38
DPA-Enabled Channel Driving Distance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–38
Using Corner and Center Left and Right PLLs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–38
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Using Both Center Left and Right PLLs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–40
Guidelines for DPA-Disabled Differential Channels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–42
DPA-Disabled Channels and Single-Ended I/Os . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–42
DPA-Disabled Channel Driving Distance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–42
Using Corner and Center Left and Right PLLs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–42
Using Both Center Left and Right PLLs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–45
Section III. System Integration
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–1
Chapter 9. Hot Socketing and Power-On Reset in Stratix IV Devices
Stratix IV Hot-Socketing Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9–1
Stratix IV Devices can be Driven Before Power Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9–2
I/O Pins Remain Tri-Stated During Power Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9–2
Insertion or Removal of a Stratix IV Device from a Powered-Up System . . . . . . . . . . . . . . . . . . . . . . 9–2
Hot-Socketing Feature Implementation in Stratix IV Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9–3
Power-On Reset Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9–4
Power-On Reset Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9–5
Chapter 10. Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–1
Configuration Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–2
Configuration Schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–2
Configuration Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–4
Power-On Reset Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–5
VCCPGM Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–5
VCCPD Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–5
Fast Passive Parallel Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–6
FPP Configuration Using a MAX II Device as an External Host . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–6
FPP Configuration Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–12
FPP Configuration Using a Microprocessor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–16
Fast Active Serial Configuration (Serial Configuration Devices) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–16
Estimating Active Serial Configuration Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–22
Programming Serial Configuration Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–23
Guidelines for Connecting Serial Configuration Devices on an AS Interface . . . . . . . . . . . . . . . . . 10–25
Passive Serial Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–25
PS Configuration Using a MAX II Device as an External Host . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–26
PS Configuration Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–31
PS Configuration Using a Microprocessor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–32
PS Configuration Using a Download Cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–32
JTAG Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–35
Jam STAPL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–40
Device Configuration Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–40
Configuration Data Decompression . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–48
Remote System Upgrades . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–50
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–51
Enabling Remote Update . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–53
Configuration Image Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–54
Remote System Upgrade Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–54
Remote Update Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–54
Dedicated Remote System Upgrade Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–57
Remote System Upgrade Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–58
Remote System Upgrade Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–58
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Remote System Upgrade Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–59
Remote System Upgrade State Machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–60
User Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–62
Quartus II Software Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–63
ALTREMOTE_UPDATE Megafunction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–63
Design Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–64
Stratix IV Security Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–65
Security Against Copying . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–65
Security Against Reverse Engineering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–65
Security Against Tampering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–65
AES Decryption Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–65
Flexible Security Key Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–65
Stratix IV Design Security Solution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–66
Security Modes Available . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–67
Volatile Key . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–67
Non-Volatile Key . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–67
Non-Volatile Key with Tamper Protection Bit Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–67
No Key Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–68
Supported Configuration Schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10–68
Chapter 11. SEU Mitigation in Stratix IV Devices
Error Detection Fundamentals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11–2
Configuration Error Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11–2
User Mode Error Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11–2
Automated Single-Event Upset Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11–5
Error Detection Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11–5
CRC_ERROR Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11–5
Error Detection Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11–6
Error Detection Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11–7
Error Detection Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11–8
Software Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11–10
Recovering From CRC Errors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11–11
Chapter 12. JTAG Boundary-Scan Testing in Stratix IV Devices
BST Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12–1
BST Operation Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12–2
I/O Voltage Support in a JTAG Chain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12–4
BST Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12–4
BSDL Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12–4
Chapter 13. Power Management in Stratix IV Devices
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13–1
Stratix IV Power Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13–2
Programmable Power Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13–2
Stratix IV External Power Supply Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13–3
Temperature Sensing Diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13–4
External Pin Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13–4
Additional Information
About this Handbook . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Info–1
How to Contact Altera . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Info–1
Typographic Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Info–1
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Chapter Revision Dates
The chapters in this document, Stratix IV Device Handbook Volume 1, were revised
on the following dates. Where chapters or groups of chapters are available separately,
part numbers are listed.
Chapter 1. Overview for the Stratix IV Device Family
Revised:
June 2011
Part Number: SIV51001-3.3
Chapter 2. Logic Array Blocks and Adaptive Logic Modules in Stratix IV Devices
Revised:
February 2011
Part Number: SIV51002-3.1
Chapter 3. TriMatrix Embedded Memory Blocks in Stratix IV Devices
Revised:
February 2011
Part Number: SIV51003-3.2
Chapter 4. DSP Blocks in Stratix IV Devices
Revised:
February 2011
Part Number: SIV51004-3.1
Chapter 5. Clock Networks and PLLs in Stratix IV Devices
Revised:
February 2011
Part Number: SIV51005-3.2
Chapter 6. I/O Features in Stratix IV Devices
Revised:
February 2011
Part Number: SIV51006-3.2
Chapter 7. External Memory Interfaces in Stratix IV Devices
Revised:
February 2011
Part Number: SIV51007-3.2
Chapter 8. High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
Revised:
February 2011
Part Number: SIV51008-3.2
Chapter 9. Hot Socketing and Power-On Reset in Stratix IV Devices
Revised:
February 2011
Part Number: SIV51009-3.2
Chapter 10. Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
Revised:
April 2011
Part Number: SIV51010-3.3
Chapter 11. SEU Mitigation in Stratix IV Devices
Revised:
February 2011
Part Number: SIV51011-3.2
Chapter 12. JTAG Boundary-Scan Testing in Stratix IV Devices
June 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
xii
Chapter Revision Dates
Revised:
February 2011
Part Number: SIV51012-3.2
Chapter 13. Power Management in Stratix IV Devices
Revised:
February 2011
Part Number: SIV51013-3.2
Stratix IV Device Handbook Volume 1
June 2011 Altera Corporation
Section I. Device Core
This section provides a complete overview of all features relating to the Stratix® IV
device family, which is the most architecturally advanced, high-performance,
low-power FPGA in the market place. This section includes the following chapters:
■
■
■
■
■
Chapter 1, Overview for the Stratix IV Device Family
Chapter 2, Logic Array Blocks and Adaptive Logic Modules in Stratix IV Devices
Chapter 3, TriMatrix Embedded Memory Blocks in Stratix IV Devices
Chapter 4, DSP Blocks in Stratix IV Devices
Chapter 5, Clock Networks and PLLs in Stratix IV Devices
Revision History
Refer to each chapter for its own specific revision history. For information on when
each chapter was updated, refer to the Chapter Revision Dates section, which appears
in the full handbook.
June 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
I–2
Section I: Device Core
Stratix IV Device Handbook Volume 1
June 2011 Altera Corporation
1. Overview for the Stratix IV Device
Family
June 2011
SIV51001-3.3
SIV51001-3.3
Altera® Stratix® IV FPGAs deliver a breakthrough level of system bandwidth and
power efficiency for high-end applications, allowing you to innovate without
compromise. Stratix IV FPGAs are based on the Taiwan Semiconductor
Manufacturing Company (TSMC) 40-nm process technology and surpass all other
high-end FPGAs, with the highest logic density, most transceivers, and lowest power
requirements.
The Stratix IV device family contains three optimized variants to meet different
application requirements:
■
Stratix IV E (Enhanced) FPGAs—up to 813,050 logic elements (LEs), 33,294 kilobits
(Kb) RAM, and 1,288 18 x 18 bit multipliers
■
Stratix IV GX transceiver FPGAs—up to 531,200 LEs, 27,376 Kb RAM, 1,288
18 x 18-bit multipliers, and 48 full-duplex clock data recovery (CDR)-based
transceivers at up to 8.5 Gbps
■
Stratix IV GT—up to 531,200 LEs, 27,376 Kb RAM, 1,288 18 x 18-bit multipliers,
and 48 full-duplex CDR-based transceivers at up to 11.3 Gbps
The complete Altera high-end solution includes the lowest risk, lowest total cost path
to volume using HardCopy® IV ASICs for all the family variants, a comprehensive
portfolio of application solutions customized for end-markets, and the industry
leading Quartus® II software to increase productivity and performance.
f
f
For information about upcoming Stratix IV device features, refer to the Upcoming
Stratix IV Device Features document.
For information about changes to the currently published Stratix IV Device Handbook,
refer to the Addendum to the Stratix IV Device Handbook chapter.
This chapter contains the following sections:
■
■
■
■
“Feature Summary” on page 1–2
“Architecture Features” on page 1–6
“Integrated Software Platform” on page 1–19
“Ordering Information” on page 1–19
© 2011 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX are Reg. U.S. Pat. & Tm. Off.
and/or trademarks of Altera Corporation in the U.S. and other countries. All other trademarks and service marks are the property of their respective holders as described at
www.altera.com/common/legal.html. Altera warrants performance of its semiconductor products to current specifications in accordance with Altera’s standard warranty, but
reserves the right to make changes to any products and services at any time without notice. Altera assumes no responsibility or liability arising out of the application or use of any
information, product, or service described herein except as expressly agreed to in writing by Altera. Altera customers are advised to obtain the latest version of device
specifications before relying on any published information and before placing orders for products or services.
Stratix IV Device Handbook Volume 1
June 2011
Subscribe
1–2
Chapter 1: Overview for the Stratix IV Device Family
Feature Summary
Feature Summary
The following list summarizes the Stratix IV device family features:
■
Up to 48 full-duplex CDR-based transceivers in Stratix IV GX and GT devices
supporting data rates up to 8.5 Gbps and 11.3 Gbps, respectively
■
Dedicated circuitry to support physical layer functionality for popular serial
protocols, such as PCI Express (PCIe) (PIPE) Gen1 and Gen2, Gbps Ethernet (GbE),
Serial RapidIO, SONET/SDH, XAUI/HiGig, (OIF) CEI-6G, SD/HD/3G-SDI,
Fibre Channel, SFI-5, and Interlaken
■
Complete PCIe protocol solution with embedded PCIe hard IP blocks that
implement PHY-MAC layer, Data Link layer, and Transaction layer functionality
f For more information, refer to the IP Compiler for PCI Express User Guide.
■
■
Programmable transmitter pre-emphasis and receiver equalization circuitry to
compensate for frequency-dependent losses in the physical medium
Typical physical medium attachment (PMA) power consumption of 100 mW at
3.125 Gbps and 135 mW at 6.375 Gbps per channel
■
■
72,600 to 813,050 equivalent LEs per device
7,370 to 33,294 Kb of enhanced TriMatrix memory consisting of three RAM block
sizes to implement true dual-port memory and FIFO buffers
■
■
■
■
■
High-speed digital signal processing (DSP) blocks configurable as 9 x 9-bit,
12 x 12-bit, 18 x 18-bit, and 36 x 36-bit full-precision multipliers at up to 600 MHz
Up to 16 global clocks (GCLK), 88 regional clocks (RCLK), and 132 periphery
clocks (PCLK) per device
Programmable power technology that minimizes power while maximizing device
performance
Up to 1,120 user I/O pins arranged in 24 modular I/O banks that support a wide
range of single-ended and differential I/O standards
Support for high-speed external memory interfaces including DDR, DDR2,
DDR3 SDRAM, RLDRAM II, QDR II, and QDR II+ SRAM on up to 24 modular
I/O banks
■
■
■
High-speed LVDS I/O support with serializer/deserializer (SERDES), dynamic
phase alignment (DPA), and soft-CDR circuitry at data rates up to 1.6 Gbps
Support for source-synchronous bus standards, including SGMII, GbE, SPI-4
Phase 2 (POS-PHY Level 4), SFI-4.1, XSBI, UTOPIA IV, NPSI, and CSIX-L1
Pinouts for Stratix IV E devices designed to allow migration of designs from
Stratix III to Stratix IV E with minimal PCB impact
Stratix IV Device Handbook Volume 1
June 2011 Altera Corporation
Chapter 1: Overview for the Stratix IV Device Family
1–3
Feature Summary
Stratix IV GX Devices
Stratix IV GX devices provide up to 48 full-duplex CDR-based transceiver channels
per device:
■
Thirty-two out of the 48 transceiver channels have dedicated physical coding
sublayer (PCS) and physical medium attachment (PMA) circuitry and support
data rates between 600 Mbps and 8.5 Gbps
■
The remaining 16 transceiver channels have dedicated PMA-only circuitry and
support data rates between 600 Mbps and 6.5 Gbps
1
1
The actual number of transceiver channels per device varies with device selection. For
more information about the exact transceiver count in each device, refer to Table 1–1
on page 1–11.
For more information about transceiver architecture, refer to the Transceiver
Architecture in Stratix IV Devices chapter.
Figure 1–1 shows a high-level Stratix IV GX chip view.
Figure 1–1. Stratix IV GX Chip View (Note 1)
General Purpose
I/O and Memory
Interface
General Purpose
I/O and Memory
Interface
PLL PLL
PLL
PLL
FPGA Fabric
PLL
PLL
PLL
PLL
(Logic Elements, DSP,
Embedded Memory,
Clock Networks)
PLL
PLL
General Purpose
I/O and Memory
Interface
General Purpose
I/O and Memory
Interface
PLL PLL
Transceiver Block
600 Mbps-8.5 Gbps CDR-based Transceiver
General Purpose I/O and
High-Speed LVDS I/O
with DPA and Soft CDR
General Purpose I/O and 150 Mbps-1.6 Gbps
LVDS interface with DPA and Soft-CDR
Note to Figure 1–1:
(1) Resource counts vary with device selection, package selection, or both.
June 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
1–4
Chapter 1: Overview for the Stratix IV Device Family
Feature Summary
Stratix IV E Device
Stratix IV E devices provide an excellent solution for applications that do not require
high-speed CDR-based transceivers, but are logic, user I/O, or memory intensive.
Figure 1–2 shows a high-level Stratix IV E chip view.
Figure 1–2. Stratix IV E Chip View (Note 1)
General Purpose
I/O and Memory
Interface
General Purpose
I/O and Memory
Interface
PLL PLL
PLL
PLL
General
Purpose
General
Purpose
I/O and
I/O and
High-Speed
LVDS I/O
with DPA
High-Speed
LVDS I/O
with DPA
and Soft-CDR
and Soft-CDR
FPGA Fabric
PLL
PLL
PLL
PLL
(Logic Elements, DSP,
Embedded Memory,
Clock Networks)
General
Purpose
General
Purpose
I/O and
I/O and
High-Speed
LVDS I/O
with DPA
High-Speed
LVDS I/O
with DPA
and Soft-CDR
and Soft-CDR
PLL
PLL
General Purpose
I/O and Memory
Interface
General Purpose
I/O and Memory
Interface
PLL PLL
General Purpose I/O and
High-Speed LVDS I/O with DPA
and Soft-CDR
General Purpose I/O and
150 Mbps-1.6 Gbps
LVDS interface with DPA and Soft-CDR
Note to Figure 1–2:
(1) Resource counts vary with device selection, package selection, or both.
Stratix IV Device Handbook Volume 1
June 2011 Altera Corporation
Chapter 1: Overview for the Stratix IV Device Family
1–5
Feature Summary
Stratix IV GT Devices
Stratix IV GT devices provide up to 48 CDR-based transceiver channels per device:
■
Thirty-two out of the 48 transceiver channels have dedicated PCS and PMA
circuitry and support data rates between 600 Mbps and 11.3 Gbps
■
The remaining 16 transceiver channels have dedicated PMA-only circuitry and
support data rates between 600 Mbps and 6.5 Gbps
1
1
The actual number of transceiver channels per device varies with device selection. For
more information about the exact transceiver count in each device, refer to Table 1–7
on page 1–16.
For more information about Stratix IV GT devices and transceiver architecture, refer
to the Transceiver Architecture in Stratix IV Devices chapter.
Figure 1–3 shows a high-level Stratix IV GT chip view.
Figure 1–3. Stratix IV GT Chip View (Note 1)
General Purpose
I/O and Memory
Interface
General Purpose
I/O and Memory
Interface
PLL PLL
PLL
PLL
FPGA Fabric
PLL
PLL
PLL
PLL
(Logic Elements, DSP,
Embedded Memory,
Clock Networks)
PLL
PLL
General Purpose
I/O and Memory
Interface
General Purpose
I/O and Memory
Interface
PLL PLL
Transceiver Block
600 Mbps-11.3 Gbps CDR-based Transceiver
General Purpose I/O and
High-Speed LVDS I/O
with DPA and Soft CDR
General Purpose I/O and up to 1.6 Gbps
LVDS interface with DPA and Soft-CDR
Note to Figure 1–3:
(1) Resource counts vary with device selection, package selection, or both.
June 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
1–6
Chapter 1: Overview for the Stratix IV Device Family
Architecture Features
Architecture Features
The Stratix IV device family features are divided into high-speed transceiver features
and FPGA fabric and I/O features.
1
The high-speed transceiver features apply only to Stratix IV GX and Stratix IV GT
devices.
High-Speed Transceiver Features
The following sections describe high-speed transceiver features for Stratix IV GX and
GT devices.
Highest Aggregate Data Bandwidth
Up to 48 full-duplex transceiver channels supporting data rates up to 8.5 Gbps in
Stratix IV GX devices and up to 11.3 Gbps in Stratix IV GT devices.
Wide Range of Protocol Support
Physical layer support for the following serial protocols:
■
Stratix IV GX—PCIe Gen1 and Gen2, GbE, Serial RapidIO, SONET/SDH,
XAUI/HiGig, (OIF) CEI-6G, SD/HD/3G-SDI, Fibre Channel, SFI-5, GPON,
SAS/SATA, HyperTransport 1.0 and 3.0, and Interlaken
■
■
■
Stratix IV GT—40G/100G Ethernet, SFI-S, Interlaken, SFI-5.1, Serial RapidIO,
SONET/SDH, XAUI/HiGig, (OIF) CEI-6G, 3G-SDI, and Fibre Channel
Extremely flexible and easy-to-configure transceiver data path to implement
proprietary protocols
PCIe Support
■
Complete PCIe Gen1 and Gen2 protocol stack solution compliant to PCI
Express base specification 2.0 that includes PHY-MAC, Data Link, and
transaction layer circuitry embedded in PCI Express hard IP blocks
f For more information, refer to the PCI Express Compiler User Guide.
■
■
■
■
■
Root complex and end-point applications
x1, x4, and x8 lane configurations
PIPE 2.0-compliant interface
Embedded circuitry to switch between Gen1 and Gen2 data rates
Built-in circuitry for electrical idle generation and detection, receiver detect,
power state transitions, lane reversal, and polarity inversion
■
■
8B/10B encoder and decoder, receiver synchronization state machine, and
300 parts per million (ppm) clock compensation circuitry
Transaction layer support for up to two virtual channels (VCs)
Stratix IV Device Handbook Volume 1
June 2011 Altera Corporation
Chapter 1: Overview for the Stratix IV Device Family
1–7
Architecture Features
■
XAUI/HiGig Support
■
Compliant to IEEE802.3ae specification
■
Embedded state machine circuitry to convert XGMII idle code groups (||I||)
to and from idle ordered sets (||A||, ||K||, ||R||) at the transmitter and
receiver, respectively
■
8B/10B encoder and decoder, receiver synchronization state machine, lane
deskew, and 100 ppm clock compensation circuitry
■
GbE Support
■
Compliant to IEEE802.3-2005 specification
■
Automatic idle ordered set (/I1/, /I2/) generation at the transmitter,
depending on the current running disparity
■
8B/10B encoder and decoder, receiver synchronization state machine, and
100 ppm clock compensation circuitry
■
Support for other protocol features such as MSB-to-LSB transmission in
SONET/SDH configuration and spread-spectrum clocking in PCIe configurations
Diagnostic Features
■
■
■
Serial loopback from the transmitter serializer to the receiver CDR for transceiver
PCS and PMA diagnostics
Reverse serial loopback pre- and post-CDR to transmitter buffer for physical link
diagnostics
Loopback master and slave capability in PCI Express hard IP blocks
f
For more information, refer to the PCI Express Compiler User Guide.
Signal Integrity
Stratix IV devices simplify the challenge of signal integrity through a number of chip,
package, and board-level enhancements to enable efficient high-speed data transfer
into and out of the device. These enhancements include:
■
Programmable 3-tap transmitter pre-emphasis with up to 8,192 pre-emphasis
levels to compensate for pre-cursor and post-cursor inter-symbol interference (ISI)
■
■
Up to 900% boost capability on the first pre-emphasis post-tap
User-controlled and adaptive 4-stage receiver equalization with up to 16 dB of
high-frequency gain
■
■
■
On-die power supply regulators for transmitter and receiver phase-locked loop
(PLL) charge pump and voltage controlled oscillator (VCO) for superior noise
immunity
On-package and on-chip power supply decoupling to satisfy transient current
requirements at higher frequencies, thereby reducing the need for on-board
decoupling capacitors
Calibration circuitry for transmitter and receiver on-chip termination (OCT)
resistors
June 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
1–8
Chapter 1: Overview for the Stratix IV Device Family
Architecture Features
FPGA Fabric and I/O Features
The following sections describe the Stratix IV FPGA fabric and I/O features.
Device Core Features
■
Up to 531,200 LEs in Stratix IV GX and GT devices and up to 813,050 LEs in
Stratix IV E devices, efficiently packed in unique and innovative adaptive logic
modules (ALMs)
■
■
■
Ten ALMs per logic array block (LAB) deliver faster performance, improved logic
utilization, and optimized routing
Programmable power technology, including a variety of process, circuit, and
architecture optimizations and innovations
Programmable power technology available to select power-driven compilation
options for reduced static power consumption
Embedded Memory
■
TriMatrix embedded memory architecture provides three different memory block
sizes to efficiently address the needs of diversified FPGA designs:
■
■
■
640-bit MLAB
9-Kb M9K
144-Kb M144K
■
■
Up to 33,294 Kb of embedded memory operating at up to 600 MHz
Each memory block is independently configurable to be a single- or dual-port
RAM, FIFO, ROM, or shift register
Digital Signal Processing (DSP) Blocks
■
Flexible DSP blocks configurable as 9 x 9-bit, 12 x 12-bit, 18 x 18-bit, and 36 x 36-bit
full-precision multipliers at up to 600 MHz with rounding and saturation
capabilities
■
■
Faster operation due to fully pipelined architecture and built-in addition,
subtraction, and accumulation units to combine multiplication results
Optimally designed to support advanced features such as adaptive filtering, barrel
shifters, and finite and infinite impulse response (FIR and IIR) filters
Clock Networks
■
■
■
■
Up to 16 global clocks and 88 regional clocks optimally routed to meet the
maximum performance of 800 MHz
Up to 112 and 132 periphery clocks in Stratix IV GX and Stratix IV E devices,
respectively
Up to 66 (16 GCLK + 22 RCLK + 28 PCLK) clock networks per device quadrant in
Stratix IV GX and Stratix IV GT devices
Up to 71 (16 GCLK + 22 RCLK + 33 PCLK) clock networks per device quadrant in
Stratix IV E devices
Stratix IV Device Handbook Volume 1
June 2011 Altera Corporation
Chapter 1: Overview for the Stratix IV Device Family
1–9
Architecture Features
PLLs
■
Three to 12 PLLs per device supporting spread-spectrum input tracking,
programmable bandwidth, clock switchover, dynamic reconfiguration, and delay
compensation
■
On-chip PLL power supply regulators to minimize noise coupling
I/O Features
■
Sixteen to 24 modular I/O banks per device with 24 to 48 I/Os per bank designed
and packaged for optimal simultaneous switching noise (SSN) performance and
migration capability
■
Support for a wide range of industry I/O standards, including single-ended
(LVTTL/CMOS/PCI/PCIX), differential (LVDS/mini-LVDS/RSDS),
voltage-referenced single-ended and differential (SSTL/HSTL Class I/II) I/O
standards
■
■
■
■
On-chip series (RS) and on-chip parallel (RT) termination with auto-calibration for
single-ended I/Os and on-chip differential (RD) termination for differential I/Os
Programmable output drive strength, slew rate control, bus hold, and weak
pull-up capability for single-ended I/Os
User I/O:GND:VCC ratio of 8:1:1 to reduce loop inductance in the package—PCB
interface
Programmable transmitter differential output voltage (VOD) and pre-emphasis for
high-speed LVDS I/O
High-Speed Differential I/O with DPA and Soft-CDR
■
Dedicated circuitry on the left and right sides of the device to support differential
links at data rates from 150 Mbps to 1.6 Gbps
■
Up to 98 differential SERDES in Stratix IV GX devices, up to 132 differential
SERDES in Stratix IV E devices, and up to 47 differential SERDES in Stratix IV GT
devices
■
■
DPA circuitry at the receiver automatically compensates for channel-to-channel
and channel-to-clock skew in source synchronous interfaces
Soft-CDR circuitry at the receiver allows implementation of asynchronous serial
interfaces with embedded clocks at up to 1.6 Gbps data rate (SGMII and GbE)
External Memory Interfaces
■
Support for existing and emerging memory interface standards such as DDR
SDRAM, DDR2 SDRAM, DDR3 SDRAM, QDRII SRAM, QDRII+ SRAM, and
RLDRAM II
■
■
■
DDR3 up to 1,067 Mbps/533 MHz
Programmable DQ group widths of 4 to 36 bits (includes parity bits)
Dynamic OCT, trace mismatch compensation, read-write leveling, and half-rate
register capabilities provide a robust external memory interface solution
June 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
1–10
Chapter 1: Overview for the Stratix IV Device Family
Architecture Features
System Integration
■
All Stratix IV devices support hot socketing
■
Four configuration modes:
■
■
■
■
Passive Serial (PS)
Fast Passive Parallel (FPP)
Fast Active Serial (FAS)
JTAG configuration
■
■
Ability to perform remote system upgrades
256-bit advanced encryption standard (AES) encryption of configuration bits
protects your design against copying, reverse engineering, and tampering
■
Built-in soft error detection for configuration RAM cells
f
For more information about how to connect the PLL, external memory interfaces, I/O,
high-speed differential I/O, power, and the JTAG pins to PCB, refer to the
Stratix IV GX and Stratix IV E Device Family Pin Connection Guidelines and the
Stratix IV GT Device Family Pin Connection Guidelines.
Stratix IV Device Handbook Volume 1
June 2011 Altera Corporation
Table 1–1 lists the Stratix IV GX device features.
Table 1–1. Stratix IV GX Device Features (Part 1 of 2)
Feature
EP4SGX70
EP4SGX110
EP4SGX180
EP4SGX230
EP4SGX290
EP4SGX360
EP4SGX530
Package
Option
ALMs
29,040
72,600
42,240
70,300
91,200
116,480
291,200
141,440
353,600
212,480
531,200
LEs
105,600
175,750
228,000
0.6 Gbps-
8.5 Gbps
Transceivers
(PMA + PCS)
(1)
—
8
16
—
—
—
16
—
16
—
8
—
16
—
16 24
—
8
—
16
—
16 24
—
16
—
—
16
—
16 24 24 32
—
16
—
—
16
—
16 24 24
32
—
16
—
24
—
12
24
—
32
—
16
0.6 Gbps-
6.5 Gbps
Transceivers
(PMA + PCS)
(1)
8
—
8
—
—
12
—
—
12
—
—
—
—
—
—
—
PMA-only
CMU
Channels
(0.6 Gbps-
6.5 Gbps)
—
1
8
2
—
1
—
1
8
2
—
1
8
2
8
2
12 12 16
8
2
12 12
16
4
8
2
12
4
PCI Express
hard IP
2
4
Blocks
High-Speed
LVDS
28
56
28
28 56 28
44
2
88 28
44
2
88
4
—
—
44
2
88 88 98
—
—
44
2
88 88
98
44
2
88
88
4
98
SERDES (up
to 1.6 Gbps)
(4)
SPI-4.2 Links
1
1
1
4
1
4
4
Table 1–1. Stratix IV GX Device Features (Part 2 of 2)
Feature
EP4SGX70
EP4SGX110
EP4SGX180
EP4SGX230
EP4SGX290
EP4SGX360
EP4SGX530
Package
Option
M9K Blocks
462
16
660
16
950
20
1,235
22
936
36
1,248
48
1,280
64
(256 x
36 bits)
M144K
Blocks
(2048 x
72 bits)
TotalMemory
(MLAB+M9K
+M144K) Kb
7,370
384
9,564
512
13,627
17,133
17,248
832
22,564
1,040
27,376
1,024
Embedded
Multipliers
18 x 18 (2)
1,02
4
920
6
1,288
6
PLLs
3
4
3
4
3
8
3
8
4
6
8
12 12
4
6
8
12
12
6
8
12
12
48
8
56 56 74
56 74
56 74 88 92
56 74 88
User I/Os (3) 372 488 372 372
372
372 564
289 564
289 564
920 564 744 880 920
4
4
4
4
4
4
4
0
0
4
4
0
–2
,
–3 –3,
–2 –2
–2 –2
,
–3, –3,
–4 –4
–2 –2
–2 –2
–2 –2
Speed Grade –2, –2,
–2,
–3,
–4
–2,
–2, –2,
–3, –3,
–4 –4
–2, –2, –2, –2,
–3, –3, –3, –3,
–4 –4 –4 –4
–2, –2, –2, –2, –2, –2, –2, –2,
–3, –3, –3, –3, –3, –3, –3, –3,
,
,
,
,
,
,
,
,
,
(fastest to
–3,
–4
–3,
–4
–3, –3,
–4 –4
–3, –3,
–4 –4
–3, –3,
–4 –4
–3, –3,
–4 –4
slowest) (5)
,
–4
–4 –4 –4
–4
–4
–4
–4
–4
–4
Notes to Table 1–1:
(1) The total number of transceivers is divided equally between the left and right side of each device, except for the devices in the F780 package. These devices have eight transceiver channels located only
on the right side of the device.
(2) Four multiplier adder mode.
(3) The user I/Os count from pin-out files includes all general purpose I/O, dedicated clock pins, and dual purpose configuration pins. Transceiver pins and dedicated configuration pins are not included in
the pin count.
(4) Total pairs of high-speed LVDS SERDES take the lowest channel count of RX/TX.
(5) The difference between the Stratix IV GX devices in the –2 and –2x speed grades is the number of available transceiver channels. The –2 device allows you to use the transceiver CMU blocks as transceiver
channels. The –2x device does NOT allow you to use the CMU blocks as transceiver channels. In addition to the reduction of available transceiver channels in the Stratix IV GX –2x device, the data rates
in the –2x device are limited to 6.5 Gbps.
Table 1–2 lists the Stratix IV GX device package options.
Table 1–2. Stratix IV GX Device Package Options (Note 1)
F1152
(35 mm x 35 mm)
(5)
F1517
(40 mm x 40 mm)
(4), (6)
F1760
(42.5 mm x 42.5 mm)
(6)
F1932
(45 mm x 45 mm)
(6)
F780
F1152
Device
(29 mm x 29 mm) (5)
(35 mm x 35 mm) (4), (6)
EP4SGX70
DF29
DF29
DF29
DF29
—
—
—
—
HF35
HF35
—
—
—
—
—
—
—
—
—
EP4SGX110
EP4SGX180
EP4SGX230
EP4SGX290
EP4SGX360
EP4SGX530
Notes to Table 1–2:
FF35
FF35
FF35
FF35
FF35
—
—
HF35
HF35
HF35
HF35
HH35 (3)
KF40
KF40
KF40
KF40
KH40 (3)
—
—
—
—
—
—
FH29 (2)
FH29 (2)
—
—
KF43
KF43
KF43
NF45
NF45
NF45
—
—
—
—
(1) Device packages in the same column and marked under the same arrow sign have vertical migration capability.
(2) The 780-pin EP4SGX290 and EP4SGX360 devices are available only in 33 mm x 33 mm Hybrid flip chip package.
(3) The 1152-pin and 1517-pin EP4SGX530 devices are available only in 42.5 mm x 42.5 mm Hybrid flip chip packages.
(4) When migrating between hybrid and flip chip packages, there is an additional keep-out area. For more information, refer to the Package Information Datasheet for Altera Devices.
(5) Devices listed in this column are available in –2x, –3, and –4 speed grades. These devices do not have on-package decoupling capacitors.
(6) Devices listed in this column are available in –2, –3, and –4 speed grades. These devices have on-package decoupling capacitors. For more information about on-package decoupling capacitor value
in each device, refer to Table 1–3.
1
On-package decoupling reduces the need for on-board or PCB decoupling capacitors by satisfying the transient current
requirements at higher frequencies. The Power Delivery Network design tool for Stratix IV devices accounts for the on-package
decoupling and reflects the reduced requirements for PCB decoupling capacitors.
Table 1–3 lists the Stratix IV GX device on-package decoupling information.
Table 1–3. Stratix IV GX Device On-Package Decoupling Information (Note 1)
Ordering Information
VCC
VCCIO
VCCL_GXB
VCCA_L/R
100nF
100nF
VCCT and VCCR (Shared)
1470nF + 147nF per side
1470nF + 147nF per side
EP4SGX70
HF35
HF35
HF35
KF40
HF35
KF40
HF35
KF40
KF43
NF45
HF35
KF40
KF43
NF45
HH35
KH40
KF43
NF45
21uF + 2470nF
21uF + 2470nF
10nF per bank (2)
10nF per bank (2)
100nF per transceiver block
100nF per transceiver block
EP4SGX110
EP4SGX180
EP4SGX230
21uF + 2470nF
21 uF + 2470 nF
10nF per bank (2)
10 nF per bank (2)
100nF per transceiver block
100 nF per transceiver block
100nF
100 nF
1470nF + 147nF per side
1470 nF + 147 nF
per side
1470 nF + 147 nF
EP4SGX290
EP4SGX360
41 uF + 4470 nF
41 uF + 4470 nF
41 uF + 4470 nF
10 nF per bank (2)
10 nF per bank (2)
10 nF per bank (2)
100 nF per transceiver block
100 nF per transceiver block
100 nF per transceiver block
100nF
100 nF
100 nF
per side
1470 nF + 147 nF
per side
1470 nF + 147 nF
EP4SGX530
per side
Notes to Table 1–3:
(1) Table 1–3 refers to production devices on-package decoupling. For more information about decoupling design of engineering sample (ES) devices, contact Altera Technical Support.
(2) For I/O banks 3(*), 4(*), 7(*), and 8(*) only. There is no OPD for I/O bank 1(*), 2(*), 5(*), and 6(*).
Chapter 1: Overview for the Stratix IV Device Family
1–15
Architecture Features
Table 1–4 lists the Stratix IV E device features.
Table 1–4. Stratix IV E Device Features
Feature
Package Pin Count
ALMs
EP4SE230
780
EP4SE360
780 1152
EP4SE530
1517
EP4SE820
1517
1152
1760
112
1152
1760
91,200
228,000
141,440
353,600
212,480
531,200
325,220
813,050
LEs
High-Speed LVDS
SERDES (up to
1.6 Gbps) (1)
56
56
3
88
4
88
4
112
88
4
112
132
6
SPI-4.2 Links
3
6
6
M9K Blocks
(256 x 36 bits)
1,235
1,248
48
1,280
64
1610
M144K Blocks
(2048 x 72 bits)
22
60
Total Memory
(MLAB+M9K+
M144K) Kb
17,133
22,564
1,040
27,376
33,294
Embedded Multipliers
(18 x 18) (2)
1,288
1,024
960
12
PLLs
4
4
8
8
12
12
8
12
User I/Os (3)
488
488
744
744
976
976
744 (4) 976 (4) 1120 (4)
Speed Grade
(fastest to slowest)
–2, –3, –4 –2, –3, –4 –2, –3, –4 –2, –3, –4 –2, –3, –4 –2, –3, –4
–3, –4 –3, –4 –3, –4
Notes to Table 1–4:
(1) The user I/O count from the pin-out files include all general purpose I/Os, dedicated clock pins, and dual purpose configuration pins. Transceiver pins
and dedicated configuration pins are not included in the pin count.
(2) Four multiplier adder mode.
(3) Total pairs of high-speed LVDS SERDES take the lowest channel count of RX/TX.
(4) This data is preliminary.
June 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
1–16
Chapter 1: Overview for the Stratix IV Device Family
Architecture Features
Table 1–5 summarizes the Stratix IV E device package options.
Table 1–5. Stratix IV E Device Package Options (Note 1)
F780
F1152
F1517
(40 mm x 40 mm) (6)
F1760
Device
(29 mm x 29 mm) (4), (5) (35 mm x 35 mm) (4), (6)
(42.5 mm x 42.5 mm) (6)
EP4SE230
F29
H29 (2)
—
—
—
—
—
EP4SE360
F35
—
EP4SE530
H35 (3)
H35 (3)
H40 (3)
H40 (3)
F43
F43
EP4SE820
—
Notes to Table 1–5:
(1) Device packages in the same column and marked under the same arrow sign have vertical migration capability.
(2) The 780-pin EP4SE360 device is available only in the 33 mm x 33 mm Hybrid flip chip package.
(3) The 1152-pin and 1517-pin for EP4SE530 and EP4SE820 devices are available only in the 42.5 mm x 42.5 mm Hybrid flip chip package.
(4) When migrating between hybrid and flip chip packages, there is an additional keep-out area. For more information, refer to the Package
Information Datasheet for Altera Devices.
(5) Devices listed in this column do not have on-package decoupling capacitors.
(6) Devices listed in this column have on-package decoupling capacitors. For more information about on-package decoupling capacitor value for
each device, refer to Table 1–6.
Table 1–6 lists the Stratix IV E on-package decoupling information.
Table 1–6. Stratix IV E Device On-Package Decoupling Information (Note 1)
Ordering Information
VCC
VCCIO
EP4SE360
F35
H35
H40
F43
H35
H40
F43
41 uF + 4470 nF
10 nF per bank
EP4SE530
41 uF + 4470 nF
41 uF + 4470 nF
10 nF per bank
10 nF per bank
EP4SE820
Note to Table 1–6:
(1) Table 1–6 refers to production devices on-package decoupling. For more information about decoupling design of engineering sample (ES)
devices, contact Altera Technical Support.
Table 1–7 lists the Stratix IV GT device features.
Table 1–7. Stratix IV GT Device Features (Part 1 of 2)
Feature
EP4S40G2
1517
EP4S40G5 EP4S100G2 EP4S100G3 EP4S100G4
EP4S100G5
1517 1932
Package Pin Count
ALMs
1517
1517
91,200
228,000
1932
1932
91,200
212,480
531,200
116,480
291,200
141,440
353,600
212,480
531,200
LEs
228,000
Total Transceiver
Channels
36
12
36
36
48
48
36
24
48
32
10G Transceiver
Channels
(600 Mbps - 11.3 Gbps
with PMA + PCS)
12
24
24
24
Stratix IV Device Handbook Volume 1
June 2011 Altera Corporation
Chapter 1: Overview for the Stratix IV Device Family
1–17
Architecture Features
Table 1–7. Stratix IV GT Device Features (Part 2 of 2)
Feature
EP4S40G2
EP4S40G5 EP4S100G2 EP4S100G3 EP4S100G4
EP4S100G5
8G Transceiver
Channels
(600 Mbps - 8.5 Gbps
with PMA + PCS) (1)
12
12
0
8
8
0
0
PMA-only CMU
Channels
(600 Mbps- 6.5 Gbps)
12
2
12
2
12
2
16
4
16
4
12
2
16
4
PCIe hard IP Blocks
High-Speed LVDS
SERDES
(up to 1.6 Gbps) (2)
46
46
46
47
47
46
2
47
2
SP1-4.2 Links
2
2
2
2
2
M9K Blocks
(256 x 36 bits)
1,235
1,280
1,235
936
1,248
1,280
64
M144K Blocks
(2048 x 72 bits)
22
64
22
36
17,248
832
48
Total Memory (MLAB +
M9K + M144K) Kb
17,133
1,288
27,376
1,024
17,133
1,288
22,564
1,024
27,376
1,024
Embedded Multipliers
18 x 18 (3)
PLLs
8
8
8
12
12
8
12
User I/Os (4), (5)
654
654
654
781
781
654
781
Speed Grade
(fastest to slowest)
–1, –2, –3
–1, –2, –3
–1, –2, –3
–1, –2, –3
–1, –2, –3 –1, –2, –3 –1, –2, –3
Notes to Table 1–7:
(1) You can configure all 10G transceiver channels as 8G transceiver channels. For example, the EP4S40G2F40 device has twenty-four 8G
transceiver channels and the EP4S100G5F45 device has thirty-two 8G transceiver channels.
(2) Total pairs of high-speed LVDS SERDES take the lowest channel count of RX/TX.
(3) Four multiplier adder mode.
(4) The user I/O count from the pin-out files include all general purpose I/Os, dedicated clock pins, and dual purpose configuration pins. Transceiver
pins and dedicated configuration pins are not included in the pin count.
(5) This data is preliminary.
June 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
1–18
Chapter 1: Overview for the Stratix IV Device Family
Architecture Features
Table 1–8 lists the resource counts for the Stratix IV GT devices.
Table 1–8. Stratix IV GT Device Package Options (Note 1), (2)
1517 Pin
Device
1932 Pin
(45 mm x 45 mm)
(40 mm x 40 mm) (3)
Stratix IV GT 40 G Devices
EP4S40G2
F40
—
—
EP4S40G5
H40 (4), (5)
Stratix IV GT 100 G Devices
EP4S100G2
F40
—
EP4S100G3
—
—
F45
F45
F45
EP4S100G4
EP4S100G5
H40 (4), (5)
Notes to Table 1–8:
(1) This table represents pin compatability; however, it does not include hard IP block placement compatability.
(2) Devices under the same arrow sign have vertical migration capability.
(3) When migrating between hybrid and flip chip packages, there is an additional keep-out area. For more information,
refer to the Altera Device Package Information Data Sheet.
(4) EP4S40G5 and EP4S100G5 devices with 1517 pin-count are only available in 42.5-mm x 42.5-mm Hybrid flip chip
packages.
(5) If you are using the hard IP block, migration is not possible.
Table 1–9 lists the Stratix IV GT on-package decoupling information.
Table 1–9. Stratix IV GT Device On-Package Decoupling Information (Note 1)
Ordering
VCC
VCCIO
VCCL_GXB
VCCA_L/R
VCCT_L/R
VCCR_L/R
Information
EP4S40G2F40
EP4S100G2F40
EP4S100G3F45
EP4S100G4F45
EP4S40G5H40
EP4S100G5H40
EP4S100G5F45
Notes to Table 1–9:
100 nF per
transceiver block
21 uF + 2470 nF 10 nF per bank (2)
41 uF + 4470 nF 10 nF per bank (2)
100 nF
100 nF
100 nF
100 nF per
transceiver block
100 nF
100 nF
100 nF
(1) Table 1–9 refers to production devices on-package decoupling. For more information about decoupling design of engineering sample (ES)
devices, contact Altera Technical Support.
(2) For I/O banks 3(*), 4(*), 7(*), and 8(*) only. There is no OPD for I/O bank 1(*), 2(*), 5(*), and 6(*).
Stratix IV Device Handbook Volume 1
June 2011 Altera Corporation
Chapter 1: Overview for the Stratix IV Device Family
1–19
Integrated Software Platform
Integrated Software Platform
The Quartus II software provides an integrated environment for HDL and schematic
design entry, compilation and logic synthesis, full simulation and advanced timing
analysis, SignalTap II Logic Analyzer, and device configuration of Stratix IV designs.
The Quartus II software provides the MegaWizard Plug-In Manager user interface to
generate different functional blocks, such as memory, PLL, and digital signal
processing logic. For transceivers, the Quartus II software provides the ALTGX
MegaWizard Plug-In Manager interface that guides you through configuration of the
transceiver based on your application requirements.
The Stratix IV GX and GT transceivers allow you to implement low-power and
reliable high-speed serial interface applications with its fully reconfigurable
hardware, optimal signal integrity, and integrated Quartus II software platform.
f
For more information about the Quartus II software features, refer to the Quartus II
Handbook.
Ordering Information
This section describes the Stratix IV E, GT, and GX devices ordering information.
Figure 1–4 shows the ordering codes for Stratix IV GX and E devices.
Figure 1–4. Stratix IV GX and E Device Packaging Ordering Information
EP4SGX
230
K
F
40
C
2
ES
Family Signature
Optional Suffix
Indicatesspecific deviceoptions
ES:Engineering sample
EP4SGX: Stratix IV Transceiver
EP4SE: Stratix IV Logic/Memory
N:Lead-freedevices
Device Density
Speed Grade
70
2, 2x, 3, or 4, with 2 being the fastest
110
180
230
290
360
530
820
Transceiver Count
D: 8
F: 16
H: 24
K: 36
N: 48
Operating Temperature
C: Commercial Temperature (t =0° C to 85° C)
J
I: Industrial Temperature (t =–40° C to 100° C)
J
M: Military Temperature (t =–55° C to 125° C)
J
Package Type
Ball Array Dimension
F: FineLine BGA (FBGA)
H: Hybrid FineLine BGA
Corresponds to pin count
29 = 780 pins
35 = 1152 pins
40 = 1517 pins
43 = 1760 pins
45 = 1932 pins
June 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
1–20
Chapter 1: Overview for the Stratix IV Device Family
Ordering Information
Figure 1–5 shows the ordering codes for Stratix IV GT devices.
Figure 1–5. Stratix IV GT Device Packaging Ordering Information
EP4S 40G
2
F
40
C
2
ES
Family Signature
Optional Suffix
Indicatesspecific device options
ES: Engineering sample
N: Lead-free devices
Aggregate Bandwidth
40G
100G
Device Density
Speed Grade
2 = 230k LEs
3 = 290k LEs
4 = 360k LEs
5 = 530k LEs
1, 2, 3 with 1 being the fastest
Operating Temperature
Package Type
C: Commercial temperature(t = 0 C to 85 C)
J
I:
Industrial temperature (t
= 0°C to 100°C)
J
F: FineLine BGA (FBGA)
H: Hybrid FineLine BGA
Ball Array Dimension
Corresponds to pin count
40 = 1517 pins
45 = 1932 pins
o
Document Revision History
Table 1–10 lists the revision history for this chapter.
Table 1–10. Document Revision History (Part 1 of 2)
Date
Version
Changes
■ Added military temperature to Figure 1–4.
June 2011
3.3
■ Updated Table 1–7 and Table 1–8.
■ Applied new template.
February 2011
March 2010
3.2
3.1
■ Minor text edits.
■ Updated Table 1–1, Table 1–2, and Table 1–7.
■ Updated Figure 1–3.
■ Updated the “Stratix IV GT Devices” section.
■ Added two new references to the Introduction section.
■ Minor text edits.
■ Updated the “Stratix IV Device Family Overview”, “Feature Summary”, “Stratix IV GT
Devices”, “High-Speed Transceiver Features”, “FPGA Fabric and I/O Features”, “Highest
Aggregate Data Bandwidth”, “System Integration”, and “Integrated Software Platform”
sections.
November 2009
3.0
■ Added Table 1–3, Table 1–6, and Table 1–9.
■ Updated Table 1–1, Table 1–2, Table 1–4, Table 1–5, Table 1–7, and Table 1–8.
■ Updated Figure 1–3, Figure 1–4, and Figure 1–5.
■ Minor text edits.
Stratix IV Device Handbook Volume 1
June 2011 Altera Corporation
Chapter 1: Overview for the Stratix IV Device Family
1–21
Ordering Information
Table 1–10. Document Revision History (Part 2 of 2)
Date
Version
Changes
■ Updated Table 1–1.
■ Minor text edits.
June 2009
2.4
■ Added Table 1–5, Table 1–6, and Figure 1–3.
■ Updated Figure 1–5.
April 2009
2.3
2.2
■ Updated Table 1–1, Table 1–2, Table 1–3, and Table 1–4.
■ Updated “Introduction”, “Feature Summary”, “Stratix IV GX Devices”, “Stratix IV GT
Devices”, “Architecture Features”, and “FPGA Fabric and I/O Features”
■ Updated “Feature Summary”, “Stratix IV GX Devices”, “Stratix IV E Device”, “Stratix IV
GT Devices”, “Signal Integrity”
March 2009
■ Removed Tables 1-5 and 1-6
■ Updated Figure 1–4
■ Updated “Introduction”, “Feature Summary”, “Stratix IV Device Diagnostic Features”,
“Signal Integrity”, “Clock Networks”,“High-Speed Differential I/O with DPA and Soft-
CDR”, “System Integration”, and “Ordering Information” sections.
■ Added “Stratix IV GT 100G Devices” and “Stratix IV GT 100G Transceiver Bandwidth”
sections.
March 2009
2.1
■ Updated Table 1–1, Table 1–2, Table 1–3, and Table 1–4.
■ Added Table 1–5 and Table 1–6.
■ Updated Figure 1–3 and Figure 1–4.
■ Added Figure 1–5.
■ Removed “Referenced Documents” section.
■ Updated “Feature Summary” on page 1–1.
■ Updated “Stratix IV Device Diagnostic Features” on page 1–7.
■ Updated “FPGA Fabric and I/O Features” on page 1–8.
■ Updated Table 1–1.
November 2008
2.0
■ Updated Table 1–2.
■ Updated “Table 1–5 shows the total number of transceivers available in the Stratix IV GT
Device.” on page 1–15.
July 2008
May 2008
1.1
1.0
Revised “Introduction”.
Initial release.
June 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
1–22
Chapter 1: Overview for the Stratix IV Device Family
Ordering Information
Stratix IV Device Handbook Volume 1
June 2011 Altera Corporation
2. Logic Array Blocks and Adaptive Logic
Modules in Stratix IV Devices
February 2011
SIV51002-3.1
SIV51002-3.1
This chapter describes the features of the logic array blocks (LABs) in the Stratix® IV
core fabric. LABs are made up of adaptive logic modules (ALMs) that you can
configure to implement logic functions, arithmetic functions, and register functions.
LABs and ALMs are the basic building blocks of the Stratix IV device. Use these to
configure logic, arithmetic, and register functions. The ALM provides advanced
features with efficient logic usage and is completely backward-compatible.
This chapter contains the following sections:
■
“Logic Array Blocks”
■
“Adaptive Logic Modules” on page 2–5
Logic Array Blocks
Each LAB consists of ten ALMs, various carry chains, shared arithmetic chains, LAB
control signals, local interconnect, and register chain connection lines. The local
interconnect transfers signals between ALMs in the same LAB. The direct link
interconnect allows the LAB to drive into the local interconnect of its left and right
neighbors. Register chain connections transfer the output of the ALM register to the
adjacent ALM register in the LAB. The Quartus® II Compiler places associated logic in
the LAB or adjacent LABs, allowing the use of local, shared arithmetic chain, and
register chain connections for performance and area efficiency.
© 2011 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX are Reg. U.S. Pat. & Tm. Off.
and/or trademarks of Altera Corporation in the U.S. and other countries. All other trademarks and service marks are the property of their respective holders as described at
www.altera.com/common/legal.html. Altera warrants performance of its semiconductor products to current specifications in accordance with Altera’s standard warranty, but
reserves the right to make changes to any products and services at any time without notice. Altera assumes no responsibility or liability arising out of the application or use of any
information, product, or service described herein except as expressly agreed to in writing by Altera. Altera customers are advised to obtain the latest version of device
specifications before relying on any published information and before placing orders for products or services.
Stratix IV Device Handbook Volume 1
February 2011
Subscribe
2–2
Chapter 2: Logic Array Blocks and Adaptive Logic Modules in Stratix IV Devices
Logic Array Blocks
Figure 2–1 shows the Stratix IV LAB structure and interconnects.
Figure 2–1. Stratix IV LAB Structure and Interconnects
C4
C12
Row Interconnects of
Variable Speed & Length
R20
R4
ALMs
Direct link
interconnect from
adjacent block
Direct link
interconnect from
adjacent block
Direct link
interconnect to
adjacent block
Direct link
interconnect to
adjacent block
Local Interconnect
MLAB
LAB
Column Interconnects of
Variable Speed & Length
Local Interconnect is Driven
from Either Side by Columns & LABs,
& from Above by Rows
The LAB of the Stratix IV device has a derivative called memory LAB (MLAB), which
adds look-up table (LUT)-based SRAM capability to the LAB, as shown in Figure 2–2.
The MLAB supports a maximum of 640 bits of simple dual-port static random access
memory (SRAM). You can configure each ALM in an MLAB as either a 64 × 1 or a
32 × 2 block, resulting in a configuration of either a 64 × 10 or a 32 × 20 simple
dual-port SRAM block. MLAB and LAB blocks always coexist as pairs in all Stratix IV
families. MLAB is a superset of the LAB and includes all LAB features.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 2: Logic Array Blocks and Adaptive Logic Modules in Stratix IV Devices
2–3
Logic Array Blocks
f
For more information about the MLAB, refer to the TriMatrix Embedded Memory Blocks
in Stratix IV Devices chapter.
Figure 2–2. Stratix IV LAB and MLAB Structure
(1)
LUT-based-64 x 1
Simple dual-port SRAM
ALM
(1)
(1)
(1)
(1)
LUT-based-64 x 1
Simple dual-port SRAM
ALM
LUT-based-64 x 1
Simple dual-port SRAM
ALM
LUT-based-64 x 1
Simple dual-port SRAM
ALM
ALM
LUT-based-64 x 1
Simple dual-port SRAM
LAB Control Block
LAB Control Block
(1)
LUT-based-64 x 1
ALM
Simple dual-port SRAM
(1)
(1)
(1)
(1)
LUT-based-64 x 1
Simple dual-port SRAM
ALM
ALM
ALM
LUT-based-64 x 1
Simple dual-port SRAM
LUT-based-64 x 1
Simple dual-port SRAM
LUT-based-64 x 1
Simple dual-port SRAM
ALM
MLAB
LAB
Note to Figure 2–2:
(1) You can use the MLAB ALM as a regular LAB ALM or configure it as a dual-port SRAM, as shown.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
2–4
Chapter 2: Logic Array Blocks and Adaptive Logic Modules in Stratix IV Devices
Logic Array Blocks
LAB Interconnects
The LAB local interconnect can drive ALMs in the same LAB. It is driven by column
and row interconnects and ALM outputs in the same LAB. Neighboring
LABs/MLABs, M9K RAM blocks, M144K blocks, or digital signal processing (DSP)
blocks from the left or right can also drive the LAB’s local interconnect through the
direct link connection. The direct link connection feature minimizes the use of row
and column interconnects, providing higher performance and flexibility. Each LAB
can drive 30 ALMs through fast-local and direct-link interconnects.
Figure 2–3 shows the direct-link connection.
Figure 2–3. Direct-Link Connection
Direct-link interconnect from the
left LAB, TriMatrix memory
block, DSP block, or IOE output
Direct-link interconnect from the
right LAB, TriMatrix memory
block, DSP block, or IOE output
ALMs
ALMs
Direct-link
interconnect
to right
Direct-link
interconnect
to left
Local
Interconnect
MLAB
LAB
LAB Control Signals
Each LAB contains dedicated logic for driving control signals to its ALMs. Control
signals include three clocks, three clock enables, two asynchronous clears, a
synchronous clear, and synchronous load control signals. This gives a maximum of 10
control signals at a time. Although you generally use synchronous-load and clear
signals when implementing counters, you can also use them with other functions.
Each LAB has two unique clock sources and three clock enable signals, as shown in
Figure 2–4. The LAB control block can generate up to three clocks using two clock
sources and three clock enable signals. Each LAB’s clock and clock enable signals are
linked. For example, any ALM in a particular LAB using the labclk1signal also uses
the labclkena1signal. If the LAB uses both the rising and falling edges of a clock, it
also uses two LAB-wide clock signals. De-asserting the clock enable signal turns off
the corresponding LAB-wide clock.
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Adaptive Logic Modules
The LAB row clocks [5..0] and LAB local interconnects generate the LAB-wide control
signals. The MultiTrack interconnect’s inherent low skew allows clock and control
signal distribution in addition to data.
Figure 2–4. LAB-Wide Control Signals
There are two unique
clock signals per LAB.
6
Dedicated Row LAB Clocks
6
6
Local Interconnect
Local Interconnect
Local Interconnect
Local Interconnect
Local Interconnect
Local Interconnect
labclr1
labclk0
syncload
labclk1
labclk2
labclkena2
labclkena0
labclkena1
labclr0
synclr
Adaptive Logic Modules
The ALM is the basic building block of logic in the Stratix IV architecture. It provides
advanced features with efficient logic usage. Each ALM contains a variety of
LUT-based resources that can be divided between two combinational adaptive LUTs
(ALUTs) and two registers. With up to eight inputs for the two combinational ALUTs,
one ALM can implement various combinations of two functions. This adaptability
allows an ALM to be completely backward-compatible with four-input LUT
architectures. One ALM can also implement any function with up to six inputs and
certain seven-input functions.
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Chapter 2: Logic Array Blocks and Adaptive Logic Modules in Stratix IV Devices
Adaptive Logic Modules
In addition to the adaptive LUT-based resources, each ALM contains two
programmable registers, two dedicated full adders, a carry chain, a shared arithmetic
chain, and a register chain. Through these dedicated resources, an ALM can
efficiently implement various arithmetic functions and shift registers. Each ALM
drives all types of interconnects: local, row, column, carry chain, shared arithmetic
chain, register chain, and direct link. Figure 2–5 shows a high-level block diagram of
the Stratix IV ALM.
Figure 2–5. High-Level Block Diagram of the Stratix IV ALM
shared_arith_in
carry_in
reg_chain_in
labclk
Combinational/Memory ALUT0
To general or
local routing
dataf0
datae0
dataa
6-Input LUT
To general or
local routing
adder0
D
Q
reg0
datab
datac
datad
To general or
local routing
adder1
D
Q
6-Input LUT
datae1
dataf1
reg1
To general or
local routing
Combinational/Memory ALUT1
reg_chain_out
carry_out
shared_arith_out
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Adaptive Logic Modules
Figure 2–6 shows a detailed view of all the connections in an ALM.
Figure 2–6. Stratix IV ALM Connection Details
syncload
aclr[1:0]
carry_in
shared_arith_in
clk[2:0]
reg_chain_in
sclr
dataf0
datae0
dataa
datab
GND
4-INPUT
LUT
datac0
CLR
+
local
interconnect
D
Q
3-INPUT
LUT
row, column
direct link routing
row, column
direct link routing
3-INPUT
LUT
4-INPUT
LUT
datac1
CLR
+
local
interconnect
D
Q
3-INPUT
LUT
row, column
direct link routing
row, column
direct link routing
3-INPUT
LUT
V
CC
datae1
dataf1
carry_out
shared_arith_out
reg_chain_out
One ALM contains two programmable registers. Each register has data, clock, clock
enable, synchronous and asynchronous clear, and synchronous load and clear inputs.
Global signals, general-purpose I/O pins, or any internal logic can drive the register’s
clock and clear-control signals. Either general-purpose I/O pins or internal logic can
drive the clock enable. For combinational functions, the register is bypassed and the
output of the LUT drives directly to the outputs of an ALM.
Each ALM has two sets of outputs that drive the local, row, and column routing
resources. The LUT, adder, or register outputs can drive these output drivers (refer to
Figure 2–6). For each set of output drivers, two ALM outputs can drive column, row,
or direct-link routing connections. One of these ALM outputs can also drive local
interconnect resources. This allows the LUT or adder to drive one output while the
register drives another output.
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Adaptive Logic Modules
This feature, called register packing, improves device utilization because the device
can use the register and the combinational logic for unrelated functions. Another
special packing mode allows the register output to feed back into the LUT of the same
ALM so that the register is packed with its own fan-out LUT. This provides another
mechanism for improved fitting. The ALM can also drive out registered and
unregistered versions of the LUT or adder output.
ALM Operating Modes
The Stratix IV ALM operates in one of the following modes:
■
■
■
■
■
Normal
Extended LUT
Arithmetic
Shared Arithmetic
LUT-Register
Each mode uses ALM resources differently. In each mode, eleven available inputs to
an ALM—the eight data inputs from the LAB local interconnect, carry-in from the
previous ALM or LAB, the shared arithmetic chain connection from the previous
ALM or LAB, and the register chain connection—are directed to different destinations
to implement the desired logic function. LAB-wide signals provide clock,
asynchronous clear, synchronous clear, synchronous load, and clock enable control
for the register. These LAB-wide signals are available in all ALM modes.
For more information about the LAB-wide control signals, refer to “LAB Control
Signals” on page 2–4.
The Quartus II software and supported third-party synthesis tools, in conjunction
with parameterized functions such as the library of parameterized modules (LPM)
functions, automatically choose the appropriate mode for common functions such as
counters, adders, subtractors, and arithmetic functions.
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Adaptive Logic Modules
Normal Mode
Normal mode is suitable for general logic applications and combinational functions.
In this mode, up to eight data inputs from the LAB local interconnect are inputs to the
combinational logic. Normal mode allows two functions to be implemented in one
Stratix IV ALM, or a single function of up to six inputs. The ALM can support certain
combinations of completely independent functions and various combinations of
functions that have common inputs.
Figure 2–7 shows the supported LUT combinations in normal mode.
Figure 2–7. ALM in Normal Mode (Note 1)
dataf0
datae0
datac
dataa
datab
dataf0
datae0
datac
4-Input
5-Input
LUT
combout0
combout1
combout0
combout1
LUT
dataa
datab
datad
datae1
dataf1
4-Input
5-Input
LUT
LUT
datad
datae1
dataf1
dataf0
datae0
datac
dataa
datab
5-Input
LUT
dataf0
datae0
dataa
datab
datac
datad
combout0
combout1
6-Input
LUT
combout0
datad
datae1
dataf1
3-Input
LUT
dataf0
datae0
dataa
datab
datac
datad
6-Input
LUT
combout0
combout1
dataf0
datae0
datac
dataa
datab
5-Input
LUT
combout0
combout1
6-Input
LUT
datad
datae1
4-Input
datae1
dataf1
LUT
dataf1
Note to Figure 2–7:
(1) Combinations of functions with fewer inputs than those shown are also supported. For example, combinations of functions with the following
number of inputs are supported: 4 and 3, 3 and 3, 3 and 2, and 5 and 2.
Normal mode provides complete backward-compatibility with four-input LUT
architectures.
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Adaptive Logic Modules
For the packing of 2 five-input functions into one ALM, the functions must have at
least two common inputs. The common inputs are dataaand datab. The combination
of a four-input function with a five-input function requires one common input (either
dataaor datab).
In the case of implementing 2 six-input functions in one ALM, four inputs must be
shared and the combinational function must be the same. In a sparsely used device,
functions that could be placed in one ALM may be implemented in separate ALMs by
the Quartus II software to achieve the best possible performance. As a device begins
to fill up, the Quartus II software automatically uses the full potential of the Stratix IV
ALM. The Quartus II Compiler automatically searches for functions using common
inputs or completely independent functions to be placed in one ALM to make
efficient use of device resources. In addition, you can manually control resource usage
by setting location assignments.
You can implement any six-input function using inputs dataa, datab, datac, datad,
and either datae0and dataf0or datae1and dataf1. If you use datae0and dataf0, the
output is driven to register0, and/or register0is bypassed and the data drives out
to the interconnect using the top set of output drivers (refer to Figure 2–8). If you use
datae1and dataf1, the output either drives to register1or bypasses register1and
drives to the interconnect using the bottom set of output drivers. The Quartus II
Compiler automatically selects the inputs to the LUT. ALMs in normal mode support
register packing.
Figure 2–8. Input Function in Normal Mode (Note 1)
To general or
local routing
dataf0
datae0
dataa
datab
datac
datad
6-Input
LUT
To general or
local routing
D
D
Q
reg0
datae1
dataf1
(2)
To general or
local routing
Q
reg1
labclk
These inputs are available for register packing.
Notes to Figure 2–8:
(1) If you use datae1and dataf1as inputs to a six-input function, datae0and dataf0are available for register packing.
(2) The dataf1input is available for register packing only if the six-input function is unregistered.
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2–11
Adaptive Logic Modules
Extended LUT Mode
Use extended LUT mode to implement a specific set of seven-input functions. The set
must be a 2-to-1 multiplexer fed by two arbitrary five-input functions sharing four
inputs. Figure 2–9 shows the template of supported seven-input functions using
extended LUT mode. In this mode, if the seven-input function is unregistered, the
unused eighth input is available for register packing.
Functions that fit into the template shown in Figure 2–9 occur naturally in designs.
These functions often appear in designs as “if-else” statements in Verilog HDL or
VHDL code.
Figure 2–9. Template for Supported Seven-Input Functions in Extended LUT Mode
datae0
datac
dataa
datab
datad
5-Input
LUT
To general or
local routing
dataf0
combout0
To general or
local routing
D
Q
5-Input
LUT
reg0
datae1
dataf1
(1)
This input is available
for register packing.
Note to Figure 2–9:
(1) If the seven-input function is unregistered, the unused eighth input is available for register packing. The second register, reg1, is
not available.
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Adaptive Logic Modules
Arithmetic Mode
Arithmetic mode is ideal for implementing adders, counters, accumulators, wide
parity functions, and comparators. The ALM in arithmetic mode uses two sets of
2 four-input LUTs along with two dedicated full adders. The dedicated adders allow
the LUTs to be available to perform pre-adder logic; therefore, each adder can add the
output of 2 four-input functions.
The four LUTs share dataaand databinputs. As shown in Figure 2–10, the carry-in
signal feeds to adder0and the carry-out from adder0feeds to the carry-in of adder1
The carry-out from adder1drives to adder0of the next ALM in the LAB. ALMs in
.
arithmetic mode can drive out registered and/or unregistered versions of the adder
outputs.
Figure 2–10. ALM in Arithmetic Mode
carry_in
datae0
adder0
4-Input
To general or
local routing
LUT
To general or
local routing
D
Q
dataf0
datac
datab
dataa
reg0
4-Input
LUT
adder1
4-Input
To general or
local routing
LUT
datad
datae1
To general or
local routing
D
Q
4-Input
reg1
LUT
dataf1
carry_out
While operating in arithmetic mode, the ALM can support simultaneous use of the
adder’s carry output along with combinational logic outputs. In this operation, adder
output is ignored. Using the adder with combinational logic output provides resource
savings of up to 50% for functions that can use this ability.
Arithmetic mode also offers clock enable, counter enable, synchronous up/down
control, add/subtract control, synchronous clear, and synchronous load. The LAB
local interconnect data inputs generate the clock enable, counter enable, synchronous
up/down, and add/subtract control signals. These control signals are good
candidates for the inputs that are shared between the four LUTs in the ALM. The
synchronous clear and synchronous load options are LAB-wide signals that affect all
registers in the LAB. These signals can also be individually disabled or enabled per
register. The Quartus II software automatically places any registers that are not used
by the counter into other LABs.
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Adaptive Logic Modules
Carry Chain
The carry chain provides a fast carry function between the dedicated adders in
arithmetic or shared-arithmetic mode. The two-bit carry select feature in Stratix IV
devices halves the propagation delay of carry chains within the ALM. Carry chains
can begin in either the first ALM or the fifth ALM in the LAB. The final carry-out
signal is routed to the ALM, where it is fed to local, row, or column interconnects.
The Quartus II Compiler automatically creates carry-chain logic during design
processing, or you can create it manually during design entry. Parameterized
functions such as LPM functions automatically take advantage of carry chains for the
appropriate functions.
The Quartus II Compiler creates carry chains longer than 20 (10 ALMs in arithmetic or
shared arithmetic mode) by linking LABs together automatically. For enhanced
fitting, a long carry chain runs vertically, allowing fast horizontal connections to
TriMatrix memory and DSP blocks. A carry chain can continue as far as a full column.
To avoid routing congestion in one small area of the device when a high fan-in
arithmetic function is implemented, the LAB can support carry chains that only use
either the top half or bottom half of the LAB before connecting to the next LAB. This
leaves the other half of the ALMs in the LAB available for implementing narrower
fan-in functions in normal mode. Carry chains that use the top five ALMs in the first
LAB carry into the top half of the ALMs in the next LAB within the column. Carry
chains that use the bottom five ALMs in the first LAB carry into the bottom half of the
ALMs in the next LAB within the column. In every alternate LAB column, the top half
can be bypassed; in the other MLAB columns, the bottom half can be bypassed.
For more information about carry-chain interconnects, refer to “ALM Interconnects”
on page 2–18.
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Adaptive Logic Modules
Shared Arithmetic Mode
In shared arithmetic mode, the ALM can implement a three-input add within the
ALM. In this mode, the ALM is configured with 4 four-input LUTs. Each LUT either
computes the sum of three inputs or the carry of three inputs. The output of the carry
computation is fed to the next adder (either to adder1in the same ALM or to adder0of
the next ALM in the LAB) using a dedicated connection called the shared arithmetic
chain. This shared arithmetic chain can significantly improve the performance of an
adder tree by reducing the number of summation stages required to implement an
adder tree. Figure 2–11 shows the ALM using this feature.
Figure 2–11. ALM in Shared Arithmetic Mode
shared_arith_in
carry_in
labclk
4-Input
To general or
local routing
LUT
To general or
local routing
D
Q
datae0
datac
datab
dataa
reg0
4-Input
LUT
4-Input
To general or
local routing
LUT
datad
datae1
To general or
local routing
D
Q
4-Input
reg1
LUT
carry_out
shared_arith_out
You can find adder trees in many different applications. For example, the summation
of the partial products in a logic-based multiplier can be implemented in a tree
structure. Another example is a correlator function that can use a large adder tree to
sum filtered data samples in a given time frame to recover or de-spread data that was
transmitted using spread-spectrum technology.
Shared Arithmetic Chain
The shared arithmetic chain available in enhanced arithmetic mode allows the ALM
to implement a three-input add. This significantly reduces the resources necessary to
implement large adder trees or correlator functions.
Shared arithmetic chains can begin in either the first or sixth ALM in the LAB. The
Quartus II Compiler creates shared arithmetic chains longer than 20 (10 ALMs in
arithmetic or shared arithmetic mode) by linking LABs together automatically. For
enhanced fitting, a long shared arithmetic chain runs vertically, allowing fast
horizontal connections to the TriMatrix memory and DSP blocks. A shared arithmetic
chain can continue as far as a full column.
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Adaptive Logic Modules
Similar to the carry chains, the top and bottom halves of shared arithmetic chains in
alternate LAB columns can be bypassed. This capability allows the shared arithmetic
chain to cascade through half of the ALMs in an LAB while leaving the other half
available for narrower fan-in functionality. Every other LAB column is top-half
by-passable, while the other LAB columns are bottom-half by-passable.
For more information about the shared arithmetic chain interconnect, refer to “ALM
Interconnects” on page 2–18.
LUT-Register Mode
LUT-register mode allows third-register capability within an ALM. Two internal
feedback loops allow combinational ALUT1to implement the master latch and
combinational ALUT0to implement the slave latch needed for the third register. The
LUT register shares its clock, clock enable, and asynchronous clear sources with the
top dedicated register. Figure 2–12 shows the register constructed using two
combinational blocks within the ALM.
Figure 2–12. LUT Register from Two Combinational Blocks
sumout
clk
LUT regout
4-input
LUT
combout
aclr
sumout
5-input
LUT
combout
datain(datac)
sclr
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Adaptive Logic Modules
Figure 2–13 shows the ALM in LUT-register mode.
Figure 2–13. ALM in LUT-Register Mode with Three-Register Capability
clk [2:0]
aclr [1:0]
reg_chain_in
DC1
datain
lelocal 0
aclr
sclr
aclr
datain
sdata
regout
latchout
leout 0 a
leout 0 b
regout
E0
F1
lelocal 1
aclr
datain
sdata
E1
F0
leout 1 a
leout 1 b
regout
reg_chain_out
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Adaptive Logic Modules
Register Chain
In addition to general routing outputs, ALMs in the LAB have register-chain outputs.
Register-chain routing allows registers in the same LAB to be cascaded together. The
register-chain interconnect allows the LAB to use LUTs for a single combinational
function and the registers to be used for an unrelated shift-register implementation.
These resources speed up connections between ALMs while saving local interconnect
resources (refer to Figure 2–14). The Quartus II Compiler automatically takes
advantage of these resources to improve utilization and performance.
Figure 2–14. Register Chain within the LAB (Note 1)
From previous ALM
within the LAB
reg_chain_in
labclk
To general or
local routing
To general or
local routing
adder0
adder1
D
Q
reg0
Combinational
Logic
To general or
local routing
D
Q
reg1
To general or
local routing
To general or
local routing
To general or
local routing
adder0
adder1
D
Q
reg0
Combinational
Logic
To general or
local routing
D
Q
reg1
To general or
local routing
reg_chain_out
To next ALM
within the LAB
Note to Figure 2–14:
(1) You can use the combinational or adder logic to implement an unrelated, un-registered function.
For more information about the register chain interconnect, refer to “ALM
Interconnects” on page 2–18.
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Adaptive Logic Modules
ALM Interconnects
There are three dedicated paths between the ALMs—register cascade, carry chain,
and shared arithmetic chain. Stratix IV devices include an enhanced interconnect
structure in LABs for routing shared arithmetic chains and carry chains for efficient
arithmetic functions. The register chain connection allows the register output of one
ALM to connect directly to the register input of the next ALM in the LAB for fast shift
registers. These ALM-to-ALM connections bypass the local interconnect. The
Quartus II Compiler automatically takes advantage of these resources to improve
utilization and performance. Figure 2–15 shows the shared arithmetic chain, carry
chain, and register chain interconnects.
Figure 2–15. Shared Arithmetic Chain, Carry Chain, and Register Chain Interconnects
Local interconnect
routing among ALMs
in the LAB
ALM 1
Carry chain & shared
arithmetic chain
routing to adjacent ALM
Register chain
routing to adjacent
ALM's register input
ALM 2
ALM 3
Local
interconnect
ALM 4
ALM 5
ALM 6
ALM 7
ALM 8
ALM 9
ALM 10
Clear and Preset Logic Control
LAB-wide signals control the logic for the register’s clear signal. The ALM directly
supports an asynchronous clear function. You can achieve the register preset through
the Quartus II software’s NOT-gate push-back logic option. Each LAB supports up to
two clears.
Stratix IV devices provide a device-wide reset pin (DEV_CLRn) that resets all the
registers in the device. An option set before compilation in the Quartus II software
controls this pin. This device-wide reset overrides all other control signals.
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Chapter 2: Logic Array Blocks and Adaptive Logic Modules in Stratix IV Devices
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Adaptive Logic Modules
LAB Power Management Techniques
The following techniques are used to manage static and dynamic power consumption
within the LAB:
■
■
To save AC power, the Quartus II software forces all adder inputs low when ALM
adders are not in use.
Stratix IV LABs operate in high-performance mode or low-power mode. The
Quartus II software automatically chooses the appropriate mode for the LAB,
based on the design, to optimize speed versus leakage trade-offs.
■
Clocks represent a significant portion of dynamic power consumption due to their
high switching activity and long paths. The LAB clock that distributes a clock
signal to registers within an LAB is a significant contributor to overall clock power
consumption. Each LAB’s clock and clock enable signal are linked. For example, a
combinational ALUT or register in a particular LAB using the labclk1signal also
uses the labclkena1signal. To disable LAB-wide clock power consumption
without disabling the entire clock tree, use LAB-wide clock enable to gate the
LAB-wide clock. The Quartus II software automatically promotes register-level
clock enable signals to the LAB-level. All registers within the LAB that share a
common clock and clock enable are controlled by a shared, gated clock. To take
advantage of these clock enables, use a clock-enable construct in your HDL code
for the registered logic.
f
For more information about implementing static and dynamic power consumption
within the LAB, refer to the Power Optimization chapter in volume 2 of the Quartus II
Handbook.
Document Revision History
Table 2–1 lists the revision history for this chapter.
Table 2–1. Document Revision History
Date
Version
Changes
■ Updated Figure 2–6.
■ Applied new template.
■ Minor text edits.
February 2011
3.1
■ Updated graphics.
November 2009
June 2009
3.0
2.2
■ Minor text edits.
■ Removed the Conclusion section.
■ Added introductory sentences to improve search ability.
■ Minor text edits.
March 2009
November 2008
May 2008
2.1
2.0
1.0
Removed “Referenced Documents” section.
■ Updated Figure 2–6.
■ Made minor editorial changes.
Initial release.
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Chapter 2: Logic Array Blocks and Adaptive Logic Modules in Stratix IV Devices
Adaptive Logic Modules
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
3. TriMatrix Embedded Memory Blocks in
Stratix IV Devices
February 2011
SIV51003-3.2
SIV51003-3.2
This chapter describes the TriMatrix embedded memory blocks in Stratix® IV devices.
TriMatrix embedded memory blocks provide three different sizes of embedded
SRAM to efficiently address the needs of Stratix IV FPGA designs. TriMatrix memory
includes 640-bit memory logic array blocks (MLABs), 9-Kbit M9K blocks, and
144-Kbit M144K blocks. MLABs have been optimized to implement filter delay lines,
small FIFO buffers, and shift registers. You can use the M9K blocks for general
purpose memory applications and the M144K blocks for processor code storage,
packet buffering, and video frame buffering.
You can independently configure each embedded memory block to be a single- or
dual-port RAM, FIFO buffer, ROM, or shift register using the Quartus® II
MegaWizard™ Plug-In Manager. You can stitch together multiple blocks of the same
type to produce larger memories with minimal timing penalty. TriMatrix memory
provides up to 31,491 Kbits of embedded SRAM at up to 600 MHz operation.
This chapter contains the following sections:
■
■
■
■
“Overview”
“Memory Modes” on page 3–8
“Clocking Modes” on page 3–16
“Design Considerations” on page 3–17
Overview
Table 3–1 lists the features supported by the three sizes of TriMatrix memory.
Table 3–1. Summary of TriMatrix Memory Features (Part 1 of 2)
Feature
MLABs
M9K Blocks
M144K Blocks
Maximum performance
600 MHz
600 MHz
540 MHz
Total RAM bits
(including parity bits)
640
9216
147,456
8K × 1
4K × 2
16K × 8
16K × 9
8K × 16
8K × 18
4K × 32
4K × 36
2K × 64
2K × 72
64 × 8
64 × 9
2K × 4
1K × 8
64 × 10
32 × 16
32 × 18
32 × 20
Configurations
(depth × width)
1K × 9
512 × 16
512 × 18
256 × 32
256 × 36
v
Parity bits
v
v
© 2011 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX are Reg. U.S. Pat. & Tm. Off.
and/or trademarks of Altera Corporation in the U.S. and other countries. All other trademarks and service marks are the property of their respective holders as described at
www.altera.com/common/legal.html. Altera warrants performance of its semiconductor products to current specifications in accordance with Altera’s standard warranty, but
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Stratix IV Device Handbook Volume 1
February 2011
Subscribe
3–2
Chapter 3: TriMatrix Embedded Memory Blocks in Stratix IV Devices
Overview
Table 3–1. Summary of TriMatrix Memory Features (Part 2 of 2)
Feature
Byte enable
MLABs
v
M9K Blocks
M144K Blocks
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
Packed mode
—
Address clock enable
Single-port memory
Simple dual-port memory
True dual-port memory
Embedded shift register
ROM
v
v
v
—
v
v
FIFO buffer
v
Simple dual-port mixed
width support
—
—
v
v
v
True dual-port mixed width
support
v
v
Memory Initialization File
(.mif)
v
v
v
v
Mixed clock mode
Power-up condition
Register clears
v
Outputs cleared if
registered, otherwise reads Outputs cleared
memory contents
Outputs cleared
Output registers
Output registers
Output registers
Write: Falling clock edges
Read: Rising clock edges
Write/Read operation
triggering
Write and Read: Rising clock Write and Read: Rising clock
edges
edges
Outputs set to old data or
new data
Outputs set to old data or
new data
Same-port read-during-write Outputs set to don’t care
Outputs set to old data or
Mixed-port read-during-write
Outputs set to old data or
don’t care
Outputs set to old data or
don’t care
don’t care
Built-in support in ×64-wide
SDP mode or soft IP support
using the Quartus II software
Soft IP support using the
Quartus II software
Soft IP support using the
Quartus II software
ECC Support
Table 3–2 lists the capacity and distribution of the TriMatrix memory blocks in each
Stratix IV family member.
Table 3–2. TriMatrix Memory Capacity and Distribution in Stratix IV Devices (Part 1 of 2)
Total Dedicated RAM Bits
Total RAM Bits
M144K
Blocks
Device
EP4SE230
MLABs
M9K Blocks
(Dedicated Memory Blocks Only) (Including MLABs)
(Kb)
(Kb)
4,560
7,072
10,624
16,261
1,452
2,112
1,235
1,248
1,280
1,610
462
22
48
64
60
16
16
14,283
18,144
20,736
23,130
6,462
17,133
22,564
27,376
33,294
7,370
EP4SE360
EP4SE530
EP4SE820
EP4SGX70
EP4SGX110
660
8,244
9,564
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 3: TriMatrix Embedded Memory Blocks in Stratix IV Devices
3–3
Overview
Table 3–2. TriMatrix Memory Capacity and Distribution in Stratix IV Devices (Part 2 of 2)
Total Dedicated RAM Bits
M144K
Total RAM Bits
Device
MLABs
M9K Blocks
(Dedicated Memory Blocks Only) (Including MLABs)
Blocks
(Kb)
(Kb)
EP4SGX180
EP4SGX230
EP4SGX290
EP4SGX360
EP4SGX530
EP4S40G2
3,515
4,560
5,824
7,072
10,624
4,560
10,624
4,560
5,824
7,072
10,624
950
1,235
936
20
22
36
48
64
22
64
22
36
48
64
11,430
14,283
13,608
18,144
20,736
14,283
20,736
14,283
13,608
18,144
20,736
13,627
17,133
17,248
22,564
27,376
17,133
27,376
17,133
17,248
22,564
27,376
1,248
1,280
1,235
1280
1,235
936
EP4S40G5
EP4S100G2
EP4S100G3
EP4S100G4
EP4S100G5
1,248
1,280
TriMatrix Memory Block Types
While the M9K and M144K memory blocks are dedicated resources, the MLABs are
dual-purpose blocks. They can be configured as regular logic array blocks (LABs) or
as MLABs. Ten adaptive logic modules (ALMs) make up one MLAB. You can
configure each ALM in an MLAB as either a 64 × 1 or a 32 × 2 block, resulting in a
64 × 10 or 32 × 20 simple dual-port SRAM block in a single MLAB.
Parity Bit Support
All TriMatrix memory blocks have built-in parity-bit support. The ninth bit associated
with each byte can store a parity bit or serve as an additional data bit. No parity
function is actually performed on the ninth bit.
Byte Enable Support
All TriMatrix memory blocks support byte enables that mask the input data so that
only specific bytes of data are written. The unwritten bytes retain the previously
written values. The write enable (wren) signals, along with the byte enable (byteena
signals, control the RAM blocks’ write operations.
)
The default value for the byte enable signals is high (enabled), in which case writing is
controlled only by the write enable signals. The byte enable registers have no clear
port. When using parity bits on the M9K and M144K blocks, the byte enable controls
all nine bits (eight bits of data plus one parity bit). When using parity bits on the
MLAB, the byte-enable controls all 10 bits in the widest mode.
The MSB for the byteenasignal corresponds to the MSB of the data bus and the LSB of
the byteenasignal corresponds to the LSB of the data bus. For example, if you use a
RAM block in ×18 mode, with byteena = 01, data[8..0]is enabled, and data[17..9]
id disabled. Similarly, if byteena = 11, both data[8..0]and data[17..9]are
enabled. Byte enables are active high.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
3–4
Chapter 3: TriMatrix Embedded Memory Blocks in Stratix IV Devices
Overview
1
You cannot use the byte enable feature when using the error correction coding (ECC)
feature on M144K blocks.
Figure 3–1 shows how the write enable (wren) and byte enable (byteena) signals
control the operations of the RAM blocks.
When a byte-enable bit is de-asserted during a write cycle, the corresponding data
byte output can appear as either a “don’t care” value or the current data at that
location. The output value for the masked byte is controllable using the Quartus II
software. When a byte-enable bit is asserted during a write cycle, the corresponding
data byte output also depends on the setting chosen in the Quartus II software.
Figure 3–1. Byte Enable Functional Waveform
inclock
wren
a0
10
a1
a2
a0
a1
a2
address
data
an
ABCD
XXXX
XXXX
byteena
contents at a0
contents at a1
01
XX
11
XX
FFFF
ABFF
FFFF
FFCD
FFFF
ABCD
contents at a2
XXCD
FFCD
ABXX
ABCD
ABFF
FFCD
FFCD
ABCD
ABCD
don't care: q (asynch)
doutn
ABFF
ABCD
ABFF
doutn
current data: q (asynch)
Packed Mode Support
Stratix IV M9K and M144K blocks support packed mode. The packed mode feature
packs two independent single-port RAMs into one memory block. The Quartus II
software automatically implements packed mode where appropriate by placing the
physical RAM block into true dual-port mode and using the MSB of the address to
distinguish between the two logical RAMs. The size of each independent single-port
RAM must not exceed half of the target block size.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 3: TriMatrix Embedded Memory Blocks in Stratix IV Devices
3–5
Overview
Address Clock Enable Support
All Stratix IV memory blocks support address clock enable, which holds the previous
address value for as long as the signal is enabled (addressstall ). When the
=
1
memory blocks are configured in dual-port mode, each port has its own independent
address clock enable. The default value for the address clock enable signals is low
(disabled).
Figure 3–2 shows an address clock enable block diagram. The address clock enable is
referred to by the port name addressstall
.
Figure 3–2. Address Clock Enable
1
0
address[0]
register
address[0]
address[0]
address[N]
register
1
0
address[N]
address[N]
addressstall
clock
Figure 3–3 shows the address clock enable waveform during the read cycle.
Figure 3–3. Address Clock Enable During Read Cycle Waveform
inclock
rdaddress
rden
a0
a1
a2
a3
a4
a5
a6
addressstall
latched address
(inside memory)
a5
a1
a4
an
a0
q (synch)
dout0
dout4
doutn-1
doutn
doutn
dout1
dout0
dout4
dout1
q (asynch)
dout5
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
3–6
Chapter 3: TriMatrix Embedded Memory Blocks in Stratix IV Devices
Overview
Figure 3–4 shows the address clock enable waveform during the write cycle.
Figure 3–4. Address Clock Enable During the Write Cycle Waveform
inclock
a0
00
a1
01
a2
02
a3
03
a4
04
a5
05
a6
06
wraddress
data
wren
addressstall
latched address
(inside memory)
a1
a4
03
a5
an
XX
a0
00
contents at a0
contents at a1
contents at a2
contents at a3
contents at a4
contents at a5
XX
01
02
XX
XX
04
XX
XX
05
Mixed Width Support
M9K and M144K memory blocks support mixed data widths inherently. MLABs can
support mixed data widths through emulation using the Quartus II software. When
using simple dual-port, true dual-port, or FIFO modes, mixed width support allows
you to read and write different data widths to a memory block. For more information
about the different widths supported per memory mode, refer to “Memory Modes”
on page 3–8.
1
MLABs do not support mixed-width FIFO mode.
Asynchronous Clear
Stratix IV TriMatrix memory blocks support asynchronous clears on output latches
and output registers. Therefore, if your RAM is not using output registers, you can
still clear the RAM outputs using the output latch asynchronous clear. Figure 3–5
shows a waveform of the output latch asynchronous clear function.
Figure 3–5. Output Latch Asynchronous Clear Waveform
outclk
aclr
aclr at latch
q
You can selectively enable asynchronous clears per logical memory using the
Quartus II RAM MegaWizard Plug-In Manager.
f
For more information, refer to the Internal Memory (RAM and ROM) User Guide.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 3: TriMatrix Embedded Memory Blocks in Stratix IV Devices
3–7
Overview
Error Correction Code (ECC) Support
Stratix IV M144K blocks have built-in support for error correction code (ECC) when
in ×64-wide simple dual-port mode. ECC allows you to detect and correct data errors
in the memory array. The M144K blocks have a single-error-correction
double-error-detection (SECDED) implementation. SECDED can detect and fix a
single bit error in a 64-bit word, or detect two bit errors in a 64-bit word. It cannot
detect three or more errors.
The M144K ECC status is communicated using a three-bit status flag
eccstatus[2..0]. The status flag can be either registered or unregistered. When
registered, it uses the same clock and asynchronous clear signals as the output
registers. When unregistered, it cannot be asynchronously cleared.
Table 3–3 lists the truth table for the ECC status flags.
Table 3–3. Truth Table for ECC Status Flags
Status
eccstatus[2]
eccstatus[1]
eccstatus[0]
No error
0
0
1
0
0
1
1
0
1
0
0
1
0
1
0
1
1
1
0
0
X
Single error and fixed
Double error and no fix
Illegal
Illegal
Illegal
Illegal
1
1
You cannot use the byte enable feature when ECC is engaged.
Read-during-write “old data mode” is not supported when ECC is engaged.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
3–8
Chapter 3: TriMatrix Embedded Memory Blocks in Stratix IV Devices
Memory Modes
Figure 3–6 shows a diagram of the ECC block of the M144K block.
Figure 3–6. ECC Block Diagram of the M144K Block
8
64
64
8
72
72
64
RAM
Array
SECDED
Encoder
SECDED
Encoder
Comparator
8
Data Input
8
64
8
64
Flag
Generator
Error
Locator
64
3
Status Flags
Error
Correction
Block
64
Data Output
Memory Modes
Stratix IV TriMatrix memory blocks allow you to implement fully synchronous SRAM
memory in multiple modes of operation. M9K and M144K blocks do not support
asynchronous memory (unregistered inputs). MLABs support asynchronous
(flow-through) read operations.
Depending on which TriMatrix memory block you target, you can use the following:
■
■
■
■
■
■
“Single-Port RAM Mode” on page 3–9
“Simple Dual-Port Mode” on page 3–10
“True Dual-Port Mode” on page 3–13
“Shift-Register Mode” on page 3–15
“ROM Mode” on page 3–16
“FIFO Mode” on page 3–16
c
When using the memory blocks in ROM, single-port, simple dual-port, or true
dual-port mode, you can corrupt the memory contents if you violate the setup or
hold-time on any of the memory block input registers. This applies to both read and
write operations.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 3: TriMatrix Embedded Memory Blocks in Stratix IV Devices
3–9
Memory Modes
Single-Port RAM Mode
All TriMatrix memory blocks support single-port mode. Single-port mode allows you
to do either one-read or one-write operation at a time. Simultaneous reads and writes
are not supported in single-port mode. Figure 3–7 shows the single-port RAM
configuration.
Figure 3–7. Single-Port RAM (Note 1)
data[]
address[]
wren
byteena[]
addressstall
inclock
clockena
rden
q[]
outclock
aclr
Note to Figure 3–7:
(1) You can implement two single-port memory blocks in a single M9K or M144K block. For more information, refer to
“Packed Mode Support” on page 3–4.
During a write operation, RAM output behavior is configurable. If you use the
read-enable signal and perform a write operation with read enable de-activated, the
RAM outputs retain the values they held during the most recent active read enable. If
you activate read enable during a write operation, or if you are not using the
read-enable signal at all, the RAM outputs either show the “new data” being written,
the “old data” at that address, or a “don’t care” value. To choose the desired behavior,
set the read-during-write behavior to either new data, old data, or don’t care in the
RAM MegaWizard Plug-In Manager in the Quartus II software. For more information,
refer to “Read-During-Write Behavior” on page 3–18.
Table 3–4 lists the possible port width configurations for TriMatrix memory blocks in
single-port mode.
Table 3–4. Port Width Configurations for MLABs, M9K, and M144K Blocks (Single-Port Mode)
MLABs
M9K Blocks
8K × 1
M144K Blocks
16K × 8
16K × 9
8K × 16
8K × 18
4K × 32
4K × 36
2K × 64
2K × 72
4K × 2
64 × 8
64 × 9
2K × 4
1K × 8
64 × 10
32 × 16
32 × 18
32 × 20
Port Width
Configurations
1K × 9
512 × 16
512 × 18
256 × 32
256 × 36
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
3–10
Chapter 3: TriMatrix Embedded Memory Blocks in Stratix IV Devices
Memory Modes
Figure 3–8 shows timing waveforms for read and write operations in single-port
mode with unregistered outputs. Registering the RAM’s outputs simply delays the
q
output by one clock cycle.
Figure 3–8. Timing Waveform for Read-Write Operations (Single-Port Mode)
clk_a
A0
A1
address
rdena
wrena
bytenna
data_a
01
10
B456
00
11
A123
C789
DDDD
EEEE
FFFF
q_a (asyn)
D
D
23
A0 (old data)
B423
A1(old data)
DDDD
EEEE
old old
Simple Dual-Port Mode
All TriMatrix memory blocks support simple dual-port mode. Simple dual-port mode
allows you to perform one read and one write operation to different locations at the
same time. Write operation happens on port A; read operation happens on port B.
Figure 3–9 shows a simple dual-port configuration.
Figure 3–9. Stratix IV Simple Dual-Port Memory (Note 1)
data[]
rdaddress[]
rden
wraddress[]
wren
q[]
byteena[]
wr_addressstall
wrclock
rd_addressstall
rdclock
rdclocken
ecc_status
wrclocken
aclr
Note to Figure 3–9:
(1) Simple dual-port RAM supports input/output clock mode in addition to read/write clock mode.
Simple dual-port mode supports different read and write data widths (mixed-width
support). Table 3–5 lists the mixed width configurations for M9K blocks in simple
dual-port mode. MLABs do not have native support for mixed-width operation. The
Quartus II software implements mixed-width memories in MLABs by using more
than one MLAB.
Table 3–5. M9K Block Mixed-Width Configurations (Simple Dual-Port Mode) (Part 1 of 2)
Write Port
Read Port
8K × 1
v
4K × 2 2K × 4 1K × 8
512 × 16
v
256 × 32
v
1K × 9
—
512 × 18
256 × 36
8K × 1
4K × 2
2K × 4
v
v
v
v
v
v
v
v
v
—
—
—
—
—
—
v
v
v
—
v
v
v
—
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 3: TriMatrix Embedded Memory Blocks in Stratix IV Devices
3–11
Memory Modes
Table 3–5. M9K Block Mixed-Width Configurations (Simple Dual-Port Mode) (Part 2 of 2)
Write Port
Read Port
8K × 1
v
4K × 2 2K × 4 1K × 8
512 × 16
v
256 × 32
v
1K × 9
—
512 × 18
—
256 × 36
1K × 8
v
v
v
—
—
—
v
v
v
—
—
—
v
v
v
—
—
—
—
—
—
v
v
v
512 × 16
256 × 32
1K × 9
v
v
v
—
—
v
v
v
—
—
—
—
—
v
v
512 × 18
256 × 36
—
—
—
v
v
—
—
—
v
v
Table 3–6 lists the mixed-width configurations for M144K blocks in simple dual-port
mode.
Table 3–6. M144K Block Mixed-Width Configurations (Simple Dual-Port Mode)
Write Port
Read Port
16K × 8
v
8K × 16
v
4K × 32
v
2K × 64
v
16K × 9
—
8K × 18
—
4K × 36
—
2K × 72
—
16K × 8
8K × 16
4K × 32
2K × 64
16K × 9
8K × 18
4K × 36
2K × 72
v
v
v
v
—
—
—
—
v
v
v
v
—
—
—
—
v
v
v
v
—
—
—
—
—
—
—
—
v
v
v
v
—
—
—
—
v
v
v
v
—
—
—
—
v
v
v
v
—
—
—
—
v
v
v
v
In simple dual-port mode, M9K and M144K blocks support separate write-enable and
read-enable signals. You can save power by keeping the read-enable signal low
(inactive) when not reading. Read-during-write operations to the same address can
either output a “don’t care” value or “old data” value. To choose the desired
behavior, set the read-during-write behavior to either don’t care or old data in the
RAM MegaWizard Plug-In Manager in the Quartus II software. For more
information, refer to “Read-During-Write Behavior” on page 3–18.
MLABs only support a write-enable signal. For MLABs, you can set the same-port
read-during-write behavior to don’t care and the mixed-port read-during-write
behavior to either don’t care or old data. The available choices depend on the
configuration of the MLAB. There is no “new data” option for MLABs.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
3–12
Chapter 3: TriMatrix Embedded Memory Blocks in Stratix IV Devices
Memory Modes
Figure 3–10 shows timing waveforms for read and write operations in simple
dual-port mode with unregistered outputs. Registering the RAM outputs simply
delays the
qoutput by one clock cycle.
Figure 3–10. Simple Dual-Port Timing Waveforms
wrclock
wren
a0
a1
a2
a3
a4
a5
an
din
wraddress
data
an-1
a6
din-1
din4
din5
din6
rdclock
rden
rdaddress
bn
doutn-1
b1
b2
b3
b0
doutn
q (asynch)
dout0
Figure 3–11 shows timing waveforms for read and write operations in mixed-port
mode with unregistered outputs.
Figure 3–11. Mixed-Port Read-During-Write Timing Waveforms
wrclock
wren
a0
a1
a2
a3
a4
a5
an
din
wraddress
data
an-1
a6
din-1
din4
din5
din6
rdclock
rden
rdaddress
bn
doutn-1
b1
b2
b3
b0
doutn
q (asynch)
dout0
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 3: TriMatrix Embedded Memory Blocks in Stratix IV Devices
3–13
Memory Modes
True Dual-Port Mode
Stratix IV M9K and M144K blocks support true dual-port mode. Sometimes called
bi-directional dual-port, this mode allows you to perform any combination of two
port operations: two reads, two writes, or one read and one write at two different
clock frequencies.
Figure 3–12 shows the true dual-port RAM configuration.
Figure 3–12. Stratix IV True Dual-Port Memory (Note 1)
data_a[]
address_a[]
wren_a
data_b[]
address_b[]
wren_b
byteena_a[]
addressstall_a
clock_a
byteena_b[]
addressstall_b
clock_b
rden_a
rden_b
aclr_a
aclr_b
q_a[]
q_b[]
Note to Figure 3–12:
(1) True dual-port memory supports input/output clock mode in addition to independent clock mode.
The widest bit configuration of the M9K and M144K blocks in true dual-port mode is
as follows:
■
M9K: 512 × 16-bit (or 512 ×18-bit with parity)
M144K: 4K × 32-bit (or 4K ×36-bit with parity)
■
Wider configurations are unavailable because the number of output drivers is
equivalent to the maximum bit width of the respective memory block. Because true
dual-port RAM has outputs on two ports, its maximum width equals half of the total
number of output drivers. Table 3–7 lists the possible M9K block mixed-port width
configurations in true dual-port mode.
Table 3–7. M9K Block Mixed-Width Configuration (True Dual-Port Mode)
Write Port
Read Port
8K × 1
v
4K × 2
v
2K × 4
v
1K × 8
v
512 × 16 1K × 9 512 × 18
8K × 1
v
v
v
v
v
—
—
—
—
—
—
—
v
v
—
—
—
—
—
v
v
4K × 2
v
v
v
v
2K × 4
v
v
v
v
1K × 8
v
v
v
v
512 × 16
1K × 9
v
v
v
v
—
—
—
—
512 × 18
—
—
—
—
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
3–14
Chapter 3: TriMatrix Embedded Memory Blocks in Stratix IV Devices
Memory Modes
Table 3–8 lists the possible M144K block mixed-port width configurations in true
dual-port mode.
Table 3–8. M144K Block Mixed-Width Configurations (True Dual-Port Mode)
Write Port
Read Port
16K × 8
v
8K × 16
v
4K × 32
v
16K × 9
—
8K × 18
—
4K × 36
—
16K × 8
8K × 16
4K × 32
16K × 9
8K × 18
4K × 36
v
v
v
—
—
—
v
v
v
—
—
—
—
—
—
v
v
v
—
—
—
v
v
v
—
—
—
v
v
v
In true dual-port mode, M9K and M144K blocks support separate write-enable and
read-enable signals. You can save power by keeping the read-enable signal low
(inactive) when not reading. Read-during-write operations to the same address can
either output “new data” at that location or “old data”. To choose the desired
behavior, set the read-during-write behavior to either new data or old data in the
RAM MegaWizard Plug-In Manager in the Quartus II software. For more
information, refer to “Read-During-Write Behavior” on page 3–18.
In true dual-port mode, you can access any memory location at any time from either
port. When accessing the same memory location from both ports, you must avoid
possible write conflicts. A write conflict happens when you attempt to write to the
same address location from both ports at the same time. This results in unknown data
being stored to that address location. No conflict resolution circuitry is built into the
Stratix IV TriMatrix memory blocks. You must handle address conflicts external to the
RAM block.
Figure 3–13 shows true dual-port timing waveforms for the write operation at port A
and the read operation at port B, with the read-during-write behavior set to new data.
Registering the RAM’s outputs simply delays the
qoutputs by one clock cycle.
Figure 3–13. True Dual-Port Timing Waveform
clk_a
wren_a
an
a0
a1
a2
a3
a4
a5
address_a
data_a
an-1
a6
din-1
din
din4
din5
din6
q_a (asynch)
clk_b
dout0
dout1
dout2
din5
dout3
din4
din
din-1
wren_b
address_b
bn
doutn-1
b1
b2
b3
b0
doutn
q_b (asynch)
dout0
dout2
dout1
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 3: TriMatrix Embedded Memory Blocks in Stratix IV Devices
3–15
Memory Modes
Shift-Register Mode
All Stratix IV memory blocks support shift register mode. Embedded memory block
configurations can implement shift registers for digital signal processing (DSP)
applications, such as finite impulse response (FIR) filters, pseudo-random number
generators, multi-channel filtering, and auto- and cross-correlation functions. These
and other DSP applications require local data storage, traditionally implemented with
standard flipflops that quickly exhaust many logic cells for large shift registers. A
more efficient alternative is to use embedded memory as a shift-register block, which
saves logic cell and routing resources.
The size of a shift register (
length of the taps ( ), and the number of taps (
implement larger shift registers.
w
×
m
×
n
) is determined by the input data width (
w), the
m
n
). You can cascade memory blocks to
Figure 3–14 shows the TriMatrix memory block in shift-register mode.
Figure 3–14. Shift-Register Memory Configuration
w x m x n Shift Register
m-Bit Shift Register
W
W
m-Bit Shift Register
W
W
n Number of Taps
m-Bit Shift Register
W
W
m-Bit Shift Register
W
W
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
3–16
Chapter 3: TriMatrix Embedded Memory Blocks in Stratix IV Devices
Clocking Modes
ROM Mode
All Stratix IV TriMatrix memory blocks support ROM mode. A .mif file initializes the
ROM contents of these blocks. The address lines of the ROM are registered on M9K
and M144K blocks, but can be unregistered on MLABs. The outputs can be registered
or unregistered. Output registers can be asynchronously cleared. The ROM read
operation is identical to the read operation in the single-port RAM configuration.
FIFO Mode
All TriMatrix memory blocks support FIFO mode. MLABs are ideal for designs with
many small, shallow FIFO buffers. To implement FIFO buffers in your design, use the
Quartus II software FIFO MegaWizard Plug-In Manager. Both single- and dual-clock
(asynchronous) FIFO buffers are supported.
f
1
For more information about implementing FIFO buffers, refer to the SCFIFO and
DCFIFO Megafunctions User Guide.
MLABs do not support mixed-width FIFO mode.
Clocking Modes
Stratix IV TriMatrix memory blocks support the following clocking modes:
■
■
■
■
“Independent Clock Mode” on page 3–17
“Input/Output Clock Mode” on page 3–17
“Read/Write Clock Mode” on page 3–17
“Single Clock Mode” on page 3–17
c
Violating the setup or hold time on the memory block address registers could corrupt
memory contents. This applies to both read and write operations.
Table 3–9 lists which clocking mode/memory mode combinations are supported.
Table 3–9. TriMatrix Memory Clock Modes
True
Clocking Mode
Simple
Dual-Port Mode
Single-Port Mode
ROM Mode
FIFO Mode
Dual-Port Mode
Independent
Input/output
Read/write
v
v
—
v
—
v
v
v
—
v
—
v
v
v
—
v
—
—
v
v
Single clock
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 3: TriMatrix Embedded Memory Blocks in Stratix IV Devices
3–17
Design Considerations
Independent Clock Mode
Stratix IV TriMatrix memory blocks can implement independent clock mode for true
dual-port memories. In this mode, a separate clock is available for each port (clock A
and clock B). Clock A controls all registers on the port A side; clock B controls all
registers on the port B side. Each port also supports independent clock enables for
both port A and port B registers, respectively. Asynchronous clears are supported
only for output latches and output registers on both ports.
Input/Output Clock Mode
Stratix IV TriMatrix memory blocks can implement input/output clock mode for true
dual-port and simple dual-port memories. In this mode, an input clock controls all
registers related to the data input to the memory block including data, address, byte
enables, read enables, and write enables. An output clock controls the data output
registers. Asynchronous clears are available on output latches and output registers
only.
Read/Write Clock Mode
Stratix IV TriMatrix memory blocks can implement read/write clock mode for simple
dual-port memories. In this mode, a write clock controls the data-input,
write-address, and write-enable registers. Similarly, a read clock controls the
data-output, read-address, and read-enable registers. The memory blocks support
independent clock enables for both read and write clocks. Asynchronous clears are
available on data output latches and registers only.
When using read/write clock mode, if you perform a simultaneous read/write to the
same address location, the output read data is unknown. If you require the output
data to be a known value, use either single-clock mode or input/output clock mode
and choose the appropriate read-during-write behavior in the MegaWizard Plug-In
Manager.
Single Clock Mode
Stratix IV TriMatrix memory blocks can implement single-clock mode for true
dual-port, simple dual-port, and single-port memories. In this mode, a single clock,
together with a clock enable, is used to control all registers of the memory block.
Asynchronous clears are available on output latches and output registers only.
Design Considerations
This section describes guidelines for designing with TriMatrix memory blocks.
Selecting TriMatrix Memory Blocks
The Quartus II software automatically partitions user-defined memory into
embedded memory blocks by taking into account both speed and size constraints
placed on your design. For example, the Quartus II software may spread memory out
across multiple memory blocks when resources are available to increase the
performance of the design. You can manually assign memory to a specific block size
using the RAM MegaWizard Plug-In Manager.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
3–18
Chapter 3: TriMatrix Embedded Memory Blocks in Stratix IV Devices
Design Considerations
MLABs can implement single-port SRAM through emulation using the Quartus II
software. Emulation results in minimal additional logic resources being used. Because
of the dual-purpose architecture of the MLAB, it only has data input registers and
output registers in the block. MLABs gain input address registers and additional data
output registers from ALMs.
f
For more information about register packing, refer to the Logic Array Blocks and
Adaptive Logic Modules in Stratix IV Devices chapter.
Conflict Resolution
When using memory blocks in true dual-port mode, it is possible to attempt two write
operations to the same memory location (address). Because no conflict resolution
circuitry is built into the memory blocks, this results in unknown data being written
to that location. Therefore, you must implement conflict resolution logic external to
the memory block to avoid address conflicts.
Read-During-Write Behavior
You can customize the read-during-write behavior of the Stratix IV TriMatrix
memory blocks to suit your design needs. Two types of read-during-write operations
are available: same port and mixed port. Figure 3–15 shows the difference between
the two types.
Figure 3–15. Stratix IV Read-During-Write Data Flow
Port A
data in
Port B
data in
Mixed-port
data flow
Same-port
data flow
Port A
Port B
data out
data out
Same-Port Read-During-Write Mode
This mode applies to either a single-port RAM or the same port of a true dual-port
RAM. For MLABs, the output of the MLABs can only be set to don’t care in same-port
read-during-write mode. In this mode, the output of the MLABs is unknown during a
write cycle. There is a window near the falling edge of the clock during which the
output is unknown. Prior to that window, “old data” is read out; after that window,
“new data” is seen at the output.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 3: TriMatrix Embedded Memory Blocks in Stratix IV Devices
3–19
Design Considerations
Figure 3–16 shows sample functional waveforms of same-port read-during-write
behavior in don’t care mode for MLABs.
Figure 3–16. MLABs Same-Port Read-During Write: Don’t Care Mode
clk_a
A1
XX
XX
address
A2
A0
data_in
wrena
FFFF
AAAA
XXXX
A1(old data)
A2(old data)
AAAA
A0(old data)
q(unregistered) XX
q(registered)
FFFF
XX
FFFF
AAAA
For M9K and M144K memory blocks, three output choices are available in same-port
read-during-write mode: “new data” (or flow-through) or “old data”. In new data
mode, the “new data” is available on the rising edge of the same clock cycle on which
it was written. In old data mode, the RAM outputs reflect the “old data” at that
address before the write operation proceeds. In don’t care mode, the RAM outputs
“unknown values” for a read-during-write operation.
Figure 3–17 shows sample functional waveforms of same-port read-during-write
behavior in new data mode for M9K and M144K blocks.
Figure 3–17. M9K and M144K Blocks Same-Port Read-During-Write: New Data Mode
clk_a
0A
0B
address
rdena
wrena
01
10
B456
00
11
bytenna
data_a
A123
C789
DDDD
DDDD
EEEE
FFFF
XX23
B423
B423
EEEE FFFF
q_a (asyn)
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
3–20
Chapter 3: TriMatrix Embedded Memory Blocks in Stratix IV Devices
Design Considerations
Figure 3–18 shows sample functional waveforms of same-port read-during-write
behavior in old data mode for M9K and M144K blocks.
Figure 3–18. M9K and M144K Blocks Same-Port Read-During-Write: Old Data Mode
clk_a
A0
A1
address
rdena
wrena
bytenna
data_a
01
10
B456
00
11
A123
C789
DDDD
EEEE
FFFF
q_a (asyn)
D
D
23
A0 (old data)
B423
A1(old data)
DDDD
EEEE
old old
Mixed-Port Read-During-Write Mode
This mode applies to a RAM in simple or true dual-port mode that has one port
reading from and the other port writing to the same address location with the same
clock.
In this mode, you also have two output choices: “old data” or “don’t care”. In old data
mode, a read-during-write operation to different ports causes the RAM outputs to
reflect the “old data” at that address location. In don’t care mode, the same operation
results in a “don’t care” or “unknown” value on the RAM outputs.
f
Read-during-write behavior is controlled with the RAM MegaWizard Plug-In
Manager. For more information, refer to the Internal Memory (RAM and ROM) User
Guide.
Figure 3–19 shows a sample functional waveform of mixed-port read-during-write
behavior for old data mode in MLABs.
Figure 3–19. MLABs Mixed-Port Read-During-Write: Old Data Mode
clk_a
A1
A1
wraddress
rdaddress
A0
A0
AAAA
11
BBBB
CCCC
DDDD
EEEE
FFFF
data_in
wrena
byteena_a
10
01
10
11
01
AAAA
AABB
A1(old data)
DDDD
DDEE
q_b(registered)
A0 (old data)
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 3: TriMatrix Embedded Memory Blocks in Stratix IV Devices
3–21
Design Considerations
Figure 3–20 shows a sample functional waveform of mixed-port read-during-write
behavior for don’t care mode in MLABs.
Figure 3–20. MLABs Mixed-Port Read-During-Write: Don’t Care Mode
clk_a
A1
A1
wraddress
rdaddress
A0
A0
AAAA
11
BBBB
CCCC
DDDD
EEEE
FFFF
data_in
wrena
byteena_a
10
01
10
11
01
AABB
CCBB
DDDD
DDEE
FFEE
q_b(registered)
AAAA
Figure 3–21 shows a sample functional waveform of mixed-port read-during-write
behavior for old data mode in M9K and M144K blocks.
Figure 3–21. M9K and M144K Blocks Mixed-Port Read-During Write: Old Data Mode
clk_a&b
wrena
address_a
A1
A0
BBBB
data_a
bytenna
rdenb
FFFF
AAAA
11
CCCC
10
DDDD
EEEE
01
11
A1
address_b
q_b_(asyn)
A0
AAAA
A0 (old data)
AABB
A1(old data)
DDDD
EEEE
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
3–22
Chapter 3: TriMatrix Embedded Memory Blocks in Stratix IV Devices
Design Considerations
Figure 3–22 shows a sample functional waveform of mixed-port read-during-write
behavior for don’t care mode in M9K and M144K blocks.
Figure 3–22. M9K and M144K Blocks Mixed-Port Read-During Write: Don’t Care Mode
clk_a&b
wrena
A0
BBBB
01
A1
address_a
data_a
AAAA
11
CCCC
10
DDDD
EEEE
11
FFFF
bytenna
rdenb
address_b
q_b_(asyn)
A0
A1
XXXX (unknown data)
Mixed-port read-during-write is not supported when two different clocks are used in
a dual-port RAM. The output value is unknown during a dual-clock mixed-port
read-during-write operation.
Power-Up Conditions and Memory Initialization
M9K memory cells are initialized to all zeros through a default .mif file in the
Quartus II software. However, you may specify your own initialization of the
memory cells through a defined .mif file. M144K memory cells are not initialized and;
therefore, come up in an undefined state. This is to prevent the programming file
from being too large. Again, you may specify your own initialization of the memory
cells through a defined .mif file.
MLABs power up to zero if output registers are used and power up reading the
memory contents if output registers are not used. You must take this into
consideration when designing logic that might evaluate the initial power-up values of
the MLAB memory block. For Stratix IV devices, the Quartus II software initializes
the RAM cells to zero unless there is a .mif file specified.
As mentioned, all memory blocks support initialization using a .mif file. You can
create .mif files in the Quartus II software and specify their use with the RAM
MegaWizard Plug-In Manager when instantiating a memory in your design. Even if a
memory is pre-initialized (for example, using a .mif file), it still powers up with its
outputs cleared.
f
For more information about .mif files, refer to the Internal Memory (RAM and ROM)
User Guide and the Quartus II Handbook.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 3: TriMatrix Embedded Memory Blocks in Stratix IV Devices
3–23
Design Considerations
Power Management
Stratix IV memory block clock-enables allow you to control clocking of each memory
block to reduce AC power consumption. Use the read-enable signal to ensure that
read operations only occur when you need them to. If your design does not need
read-during-write, you can reduce your power consumption by de-asserting the
read-enable signal during write operations, or any period when no memory
operations occur.
The Quartus II software automatically places any unused memory blocks in
low-power mode to reduce static power.
Document Revision History
Table 3–10 lists the revision history for this chapter.
Table 3–10. Document Revision History
Date
Version
Changes
■ Updated the “Byte Enable Support” and “Power-Up Conditions and Memory Initialization”
sections.
February 2011
3.2
■ Applied new template.
■ Minor text edits.
■ Updated the “Simple Dual-Port Mode”, “Same-Port Read-During-Write Mode”, and
“Mixed-Port Read-During-Write Mode” sections.
March 2010
3.1
3.0
■ Updated Figure 3–14.
■ Minor text edits.
■ Updated Table 3–2.
■ Updated the “Simple Dual-Port Mode” section.
■ Minor text edits.
November 2009
■ Updated graphics.
■ Updated Table 3–1 and Figure 3–2.
■ Updated the “Introduction”, “Byte Enable Support”, “Mixed Width Support”,
“Asynchronous Clear”, “Single-Port RAM”, “Simple Dual-Port Mode”, “True Dual-Port
Mode”, “FIFO Mode”, and “Read/Write Clock Mode” sections.
June 2009
2.3
■ Added introductory sentences to improve search ability.
■ Removed the Conclusion section.
■ Minor text edits.
April 2009
2.2
2.1
■ Updated Table 3–2.
■ Updated Table 3–2.
March 2009
■ Removed “Referenced Documents” section.
Updated “Power-Up Conditions and Memory Initialization” on page 3–20
Initial release.
November 2008
May 2008
2.0
1.0
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
3–24
Chapter 3: TriMatrix Embedded Memory Blocks in Stratix IV Devices
Design Considerations
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
4. DSP Blocks in Stratix IV Devices
February 2011
SIV51004-3.1
SIV51004-3.1
This chapter describes how the Stratix® IV device digital signal processing (DSP)
blocks are optimized to support DSP applications requiring high data throughput,
such as finite impulse response (FIR) filters, infinite impulse response (IIR) filters, fast
Fourier transform (FFT) functions, and encoders. You can configure the DSP blocks to
implement one of several operational modes to suit your application. The built-in
shift register chain, multipliers, and adders/subtractors minimize the amount of
external logic to implement these functions, resulting in efficient resource usage and
improved performance and data throughput for DSP applications.
Many complex systems, such as WiMAX, 3GPP WCDMA, high-performance
computing (HPC), voice over Internet protocol (VoIP), H.264 video compression,
medical imaging, and HDTV use sophisticated digital signal processing techniques,
which typically require a large number of mathematical computations. Stratix IV
devices are ideally suited for these tasks because the DSP blocks consist of a
combination of dedicated elements that perform multiplication, addition, subtraction,
accumulation, summation, and dynamic shift operations.
Along with the high-performance Stratix IV soft logic fabric and TriMatrix memory
structures, you can configure DSP blocks to build sophisticated fixed-point and
floating-point arithmetic functions. These can be manipulated easily to implement
common, larger computationally intensive subsystems such as FIR filters, complex
FIR filters, IIR filters, FFT functions, and discrete cosine transform (DCT) functions.
This chapter contains the following sections:
■
■
■
■
■
■
“Stratix IV DSP Block Overview” on page 4–2
“Stratix IV Simplified DSP Operation” on page 4–4
“Stratix IV Operational Modes Overview” on page 4–8
“Stratix IV DSP Block Resource Descriptions” on page 4–9
“Stratix IV Operational Mode Descriptions” on page 4–15
“Software Support” on page 4–35
© 2011 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX are Reg. U.S. Pat. & Tm. Off.
and/or trademarks of Altera Corporation in the U.S. and other countries. All other trademarks and service marks are the property of their respective holders as described at
www.altera.com/common/legal.html. Altera warrants performance of its semiconductor products to current specifications in accordance with Altera’s standard warranty, but
reserves the right to make changes to any products and services at any time without notice. Altera assumes no responsibility or liability arising out of the application or use of any
information, product, or service described herein except as expressly agreed to in writing by Altera. Altera customers are advised to obtain the latest version of device
specifications before relying on any published information and before placing orders for products or services.
Stratix IV Device Handbook Volume 1
February 2011
Subscribe
4–2
Chapter 4: DSP Blocks in Stratix IV Devices
Stratix IV DSP Block Overview
Stratix IV DSP Block Overview
Each Stratix IV device has two to seven columns of DSP blocks that implement
multiplication, multiply-add, multiply-accumulate (MAC), and dynamic shift
functions efficiently. Architectural highlights of the Stratix IV DSP block include:
■
High-performance, power optimized, fully registered, and pipelined
multiplication operations
■
■
■
Natively supported 9-, 12-, 18-, and 36-bit wordlengths
Natively supported 18-bit complex multiplications
Efficiently supported floating-point arithmetic formats (24-bit for single precision
and 53-bit for double precision)
■
■
Signed and unsigned input support
Built-in addition, subtraction, and accumulation units to combine multiplication
results efficiently
■
■
Cascading 18-bit input bus to form the tap-delay line for filtering applications
Cascading 44-bit output bus to propagate output results from one block to the next
block without external logic support
■
■
■
Rich and flexible arithmetic rounding and saturation units
Efficient barrel shifter support
Loopback capability to support adaptive filtering
Table 4–1 lists the number of DSP blocks for the Stratix IV device family.
Table 4–1. Number of DSP Blocks in Stratix IV Devices (Part 1 of 2)
Four
Multiplier
Adder
High-Precision
Independent Input and Output Multiplication Operators
Multiplier
Adder Mode
Mode
Family
Device
9 × 9
12 × 12
18 × 18
18 × 18
Complex
36 × 36
Multipliers
18 × 36
Multipliers
18 × 18
Multipliers
Multipliers Multipliers Multipliers
EP4SE230
161
130
128
120
48
1,288
1,040
1,024
960
966
780
768
720
288
384
690
966
624
780
768
768
644
520
512
480
192
256
460
644
416
520
512
512
322
260
256
240
96
322
260
256
240
96
644
520
512
480
192
256
460
644
416
520
512
512
1288
1040
1024
960
EP4SE360
Stratix IV E
EP4SE530
EP4SE820
EP4SGX70
384
384
EP4SGX110
EP4SGX180
EP4SGX230
EP4SGX290
EP4SGX360 (1)
EP4SGX360 (2)
EP4SGX530
64
512
128
230
322
208
260
256
256
128
230
322
208
260
256
256
512
115
161
104
130
128
128
920
920
1,288
832
1288
832
Stratix IV GX
1,040
1,024
1,024
1,040
1,024
1,024
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 4: DSP Blocks in Stratix IV Devices
4–3
Stratix IV DSP Block Overview
Table 4–1. Number of DSP Blocks in Stratix IV Devices (Part 2 of 2)
Four
High-Precision
Multiplier
Adder Mode
Multiplier
Adder
Independent Input and Output Multiplication Operators
Mode
Family
Device
9 × 9
12 × 12
18 × 18
18 × 18
Complex
36 × 36
Multipliers
18 × 36
Multipliers
18 × 18
Multipliers
Multipliers Multipliers Multipliers
EP4S40G2
EP4S40G5
EP4S100G2
EP4S100G3
EP4S100G4
EP4S100G5
161
128
161
104
128
128
1,288
1,024
1,288
832
966
768
966
624
768
768
644
512
644
416
512
512
322
256
322
208
256
256
322
256
322
208
256
256
644
512
644
416
512
512
1,288
1,024
1,288
832
Stratix IV GT
1,024
1,024
1,024
1,024
Notes to Table 4–1:
(1) This is applicable for all packages in EP4SGX360 except F1932.
(2) This is applicable for EP4SGX360F1932 only.
Table 4–1 shows that the largest Stratix IV DSP-centric device provides up to 1288
18 × 18 multiplier functionality in the 36 × 36, complex 18 × 18, and summation
modes.
Each DSP block occupies four LABs in height and can be divided further into two half
blocks that share some common clock signals, but are for all common purposes
identical in functionality. Figure 4–1 shows the layout of each DSP block.
Figure 4–1. Overview of DSP Block Signals
34
Control
144
72
72
Output
Data
Half-DSP Block
Half-DSP Block
288
Input
Data
144
Output
Data
Full DSP Block
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
4–4
Chapter 4: DSP Blocks in Stratix IV Devices
Stratix IV Simplified DSP Operation
Stratix IV Simplified DSP Operation
In Stratix IV devices, the fundamental building block is a pair of 18 × 18-bit
multipliers followed by a first-stage 37-bit addition/subtraction unit, as shown in
Equation 4–1 and Figure 4–2.
1
All signed numbers, input, and output data are represented in 2’s-complement format
only.
Equation 4–1. Multiplier Equation
P[36..0] = A0[17..0] × B0[17..0] A1[17..0] × B1[17..0]
Figure 4–2. Basic Two-Multiplier Adder Building Block
A0[17..0]
B0[17..0]
+/-
P[36..0]
A1[17..0]
B1[17..0]
The structure shown in Figure 4–2 is useful for building more complex structures,
such as complex multipliers and 36 × 36 multipliers, as described in later sections.
Each Stratix IV DSP block contains four two-multiplier adder units (2 two-multiplier
adder units per half block). Therefore, there are eight 18 × 18 multiplier functionalities
per DSP block.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 4: DSP Blocks in Stratix IV Devices
4–5
Stratix IV Simplified DSP Operation
Following the two-multiplier adder units are the pipeline registers, the second-stage
adders, and an output register stage. You can configure the second-stage adders to
provide the alternative functions per half block, as shown in Equation 4–2 and
Equation 4–3.
Equation 4–2. Four-Multiplier Adder Equation
Z[37..0] = P0[36..0] + P1[36..0]
Equation 4–3. Four-Multiplier Adder Equation (44-Bit Accumulation)
Wn[43..0] = Wn-1[43..0] Zn[37..0]
In these equations, n denotes sample time and P[36..0] denotes the result from the
two-multiplier adder units.
Equation 4–2 provides a sum of four 18 × 18-bit multiplication operations
(four-multiplier adder). Equation 4–3 provides a four 18 × 18-bit multiplication
operation but with a maximum 44-bit accumulation capability by feeding the output
of the unit back to itself, as shown in Figure 4–3.
Depending on the mode you select, you can bypass all register stages except
accumulation and loopback mode. In these two modes, one set of registers must be
enabled. If the register set is not enabled, an infinite loop occurs.
Figure 4–3. Four-Multiplier Adder and Accumulation Capability
144
44
Input
Result[]
Data
Half-DSP Block
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Chapter 4: DSP Blocks in Stratix IV Devices
Stratix IV Simplified DSP Operation
To support commonly found FIR-like structures efficiently, a major addition to the
DSP block in Stratix IV devices is the ability to propagate the result of one half block
to the next half block completely within the DSP block without additional soft logic
overhead. This is achieved by the inclusion of a dedicated addition unit and routing
that adds the 44-bit result of a previous half block with the 44-bit result of the current
block. The 44-bit result is either fed to the next half block or out of the DSP block using
the output register stage, as shown in Figure 4–4. Detailed examples are described in
later sections.
The combination of a fast, low-latency four-multiplier adder unit and the “chained
cascade” capability of the output chaining adder provides the optimal FIR and vector
multiplication capability.
To support single-channel type FIR filters efficiently, you can configure one of the
multiplier input’s registers to form a tap delay line input, saving resources and
providing higher system performance.
Figure 4–4. Output Cascading Feature for FIR Structures
From Previous Half DSP Block
44
144
44
Input
Data
Result[]
Half DSP Block
44
To Next
Half DSP Block
Also shown in Figure 4–4 is the optional rounding and saturation unit (RSU). This
unit provides a rich set of commonly found arithmetic rounding and saturation
functions used in signal processing.
In addition to the independent multipliers and sum modes, you can use DSP blocks to
perform shift operations. DSP blocks can dynamically switch between logical shift
left/right, arithmetic shift left/right, and rotation operation in one clock cycle.
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Stratix IV Simplified DSP Operation
Figure 4–5 shows a top-level view of the Stratix IV DSP block.
Figure 4–6 on page 4–9 shows a more detailed top-level view of the DSP block.
Figure 4–5. Stratix IV Full DSP Block
From Previous
Half DSP Block
44
144
Input
Result[]
Data
Top Half DSP Block
44
144
Input
Result[]
Data
Bottom Half DSP Block
To Next Half DSP Block
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Stratix IV Operational Modes Overview
Stratix IV Operational Modes Overview
You can use each Stratix IV DSP block in one of five basic operational modes.
Table 4–2 lists the five basic operational modes and the number of multipliers that you
can implement within a single DSP block, depending on the mode.
Table 4–2. Stratix IV DSP Block Operation Modes
2nd
Multiplier
in Width
# of
# per
Signed or
Unsigned
RND,
SAT
In Shift
Register
Chainout 1st Stage
Mode
Stage
Mults Block
Adder
Add/Sub
Add/Acc
9 bits
12 bits
18 bits
36 bits
Double
1
1
1
1
1
8
6
4
2
2
Both
Both
Both
Both
Both
No
No
Yes
No
No
No
No
Yes
No
No
No
No
No
No
No
—
—
—
—
—
—
—
—
—
—
Independent
Multiplier
Two-Multiplier
Adder (1)
18 bits
18 bits
2
4
4
2
Signed (4)
Yes
Yes
No
No
Both
Both
—
Four-Multiplier
Adder
Both
Yes
Yes
Add Only
Multiply
Accumulate
18 bits
36 bits (3)
1836
4
1
2
2
2
2
Both
Both
Both
Yes
No
No
Yes
No
No
Yes
—
Both
—
Both
—
Shift (2)
High Precision
Multiplier Adder
No
—
Add Only
Notes to Table 4–2:
(1) This mode also supports loopback mode. In loopback mode, the number of loopback multipliers per DSP block is two. You can use the
remaining multipliers in regular two-multiplier adder mode.
(2) Dynamic shift mode supports arithmetic shift left, arithmetic shift right, logical shift left, logical shift right, and rotation operation.
(3) Dynamic shift mode operates on a 32-bit input vector but the multiplier width is configured as 36 bits.
(4) Unsigned value is also supported but you must ensure that the result can be contained within 36 bits.
The DSP block consists of two identical halves (the top half and bottom half). Each
half has four 18 × 18 multipliers.
The Quartus® II software includes megafunctions used to control the mode of
operation of the multipliers. After making the appropriate parameter settings using
the megafunction’s MegaWizard Plug-In Manager, the Quartus II software
automatically configures the DSP block.
Stratix IV DSP blocks can operate in different modes simultaneously. Each half block
is fully independent except for the sharing of the three clock, ena, and aclrsignals.
For example, you can break down a single DSP block to operate a 9 × 9 multiplier in
one half block and an 18 × 18 two-multiplier adder in the other half block. This
increases DSP block resource efficiency and allows you to implement more
multipliers within a Stratix IV device. The Quartus II software automatically places
multipliers that can share the same DSP block resources within the same block.
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Stratix IV DSP Block Resource Descriptions
Stratix IV DSP Block Resource Descriptions
The DSP block consists of the following elements:
■
■
■
■
■
■
Input register bank
Four two-multiplier adders
Pipeline register bank
Two second-stage adders
Four rounding and saturation logic units
Second adder register and output register bank
Figure 4–6 shows a detailed overall architecture of the top half of the DSP block.
Table 4–9 on page 4–34 shows a list of DSP block dynamic signals.
Figure 4–6. Half DSP Block Architecture
signa
signb
zero_loopback
accum_sload
output_round
output_saturate
rotate
clock[3..0]
ena[3..0]
alcr[3..0]
zero_chainout
overflow (1)
chainout_round
chainout_saturate
chainin[ ] (3)
shift_right
chainout_sat_overflow (2)
scanina[ ]
dataa_0[ ]
loopback
datab_0[ ]
dataa_1[ ]
datab_1[ ]
result[ ]
dataa_2[ ]
datab_2[ ]
dataa_3[ ]
datab_3[ ]
Half-DSP Block
scanouta
chainout
Notes to Figure 4–6:
(1) Block output for accumulator overflow and saturate overflow.
(2) Block output for saturation overflow of chainout
(3) The chaininport must only be connected to chainoutof the previous DSP blocks and must not be connected to general routings.
.
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Stratix IV DSP Block Resource Descriptions
Input Registers
All of the DSP block registers are triggered by the positive edge of the clock signal and
are cleared after power up. Each multiplier operand can feed an input register or go
directly to the multiplier, bypassing the input registers. The following DSP block
signals control the input registers within the DSP block:
■
■
■
clock[3..0]
ena[3..0]
aclr[3..0]
Every DSP block has nine 18-bit data input register banks per half DSP block. Every
half DSP block has the option to use the eight data register banks as inputs to the four
multipliers. The special ninth register bank is a delay register required by modes that
use both the cascade and chainout features of the DSP block. Use the ninth register
bank to balance the latency requirements when using the chained cascade feature.
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Stratix IV DSP Block Resource Descriptions
A feature of the input register bank is to support a tap delay line. Therefore, the top
leg of the multiplier input (A) can be driven from general routing or from the cascade
chain, as shown in Figure 4–7. Table 4–9 on page 4–34 lists the DSP block dynamic
signals.
Figure 4–7. Input Register of a Half DSP Block
clock[3..0]
ena[3..0]
aclr[3..0]
signa
signb
scanina[17..0]
dataa_0[17..0]
loopback
datab_0[17..0]
+/-
dataa_1[17..0]
datab_1[17..0]
dataa_2[17..0]
datab_2[17..0]
+/-
dataa_3[17..0]
datab_3[17..0]
Delay
Register
scanouta
At compile time, you must select whether the A-input comes from general routing or
from the cascade chain. In cascade mode, the dedicated shift outputs from one
multiplier block and directly feeds the input registers of the adjacent multiplier below
it (within the same half DSP block) or the first multiplier in the next half DSP block, to
form an 8-tap shift register chain per DSP Block. The DSP block can increase the
length of the shift register chain by cascading to the lower DSP blocks. The dedicated
shift register chain spans a single column, but you can implement longer shift register
chains requiring multiple columns using the regular FPGA routing resources.
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Stratix IV DSP Block Resource Descriptions
Shift registers are useful in DSP functions such as FIR filters. When implementing
18 × 18 or smaller width multipliers, you do not need external logic to create the shift
register chain because the input shift registers are internal to the DSP block. This
implementation significantly reduces the logical element (LE) resources required,
avoids routing congestion, and results in predictable timing.
The first multiplier in every half DSP block (top- and bottom-half) in Stratix IV
devices has a multiplexer for the first multiplier B-input (lower-leg input) register to
select between general routing and loopback, as shown in Figure 4–6 on page 4–9. In
loopback mode, the most significant 18-bit registered outputs are connected as
feedback to the multiplier input of the first top multiplier in each half DSP block.
Loopback modes are used by recursive filters where the previous output is needed to
compute the current output.
Loopback mode is described in “Two-Multiplier Adder Sum Mode” on page 4–22.
Table 4–3 lists input register modes for the DSP block.
Table 4–3. Input Register Modes
Register Input Mode (1)
Parallel input
9 × 9
v
12 × 12
v
18 × 18
v
36 × 36
v
Double
v
Shift register input (2)
Loopback input (3)
Notes to Table 4–3:
—
—
v
—
—
—
—
v
—
—
(1) Multiplier operand input wordlengths are statically configured at compile time.
(2) Available only on the A-operand.
(3) Only one loopback input is allowed per half block. For more information, refer to Figure 4–15 on page 4–24.
Multiplier and First-Stage Adder
The multiplier stage natively supports 9 × 9, 12 × 12, 18 × 18, or 36 × 36 multipliers.
Other wordlengths are padded up to the nearest appropriate native wordlength; for
example, 16 × 16 would be padded up to use 18 × 18. For more information, refer to
“Independent Multiplier Modes” on page 4–15. Depending on the data width of the
multiplier, a single DSP block can perform many multiplications in parallel.
Each multiplier operand can be a unique signed or unsigned number. Two dynamic
signals, signaand signb, control the representation of each operand, respectively. A
logic 1value on the signa/signbsignal indicates that data A/data Bis a signed
number; a logic 0value indicates an unsigned number. Table 4–4 lists the sign of the
multiplication result for the various operand sign representations. The result of the
multiplication is signed if any one of the operands is a signed value.
Table 4–4. Multiplier Sign Representation
Data A (signa Value)
Unsigned (logic 0)
Unsigned (logic 0)
Signed (logic 1)
Data B (signb Value)
Unsigned (logic 0)
Signed (logic 1)
Result
Unsigned
Signed
Unsigned (logic 0)
Signed (logic 1)
Signed
Signed (logic 1)
Signed
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Stratix IV DSP Block Resource Descriptions
Each half block has its own signaand signbsignal. Therefore, all of the data Ainputs
feeding the same half DSP block must have the same sign representation. Similarly,
all of the data B inputs feeding the same half DSP block must have the same sign
representation. The multiplier offers full precision regardless of the sign
representation in all operational modes except for full precision 18 × 18 loopback and
two-multiplier adder modes. For more information, refer to “Two-Multiplier Adder
Sum Mode” on page 4–22.
1
By default, when the signaand signbsignals are unused, the Quartus II software sets
the multiplier to perform unsigned multiplication.
Figure 4–6 on page 4–9 shows that the outputs of the multipliers are the only outputs
that can feed into the first-stage adder. There are four first-stage adders in a DSP block
(two adders per half DSP block). The first-stage adder block has the ability to perform
addition and subtraction. The control signal for addition or subtraction is static and
has to be configured after compile time. The first-stage adders are used by the sum
modes to compute the sum of two multipliers, 18 × 18-complex multipliers, and to
perform the first stage of a 36 × 36 multiply and shift operations.
Depending on your specifications, the output of the first-stage adder has the option to
feed into the pipeline registers, second-stage adder, rounding and saturation unit, or
output registers.
Pipeline Register Stage
Figure 4–6 on page 4–9 shows that the output from the first-stage adder can either
feed or bypass the pipeline registers. Pipeline registers increase the DSP block’s
maximum performance (at the expense of extra cycles of latency), especially when
using the subsequent DSP block stages. Pipeline registers split up the long signal path
between the input registers/multiplier/first-stage adder and the second-stage adder/
round-and-saturation/output registers, creating two shorter paths.
Second-Stage Adder
There are four individual 44-bit second-stage adders per DSP block (two adders
per half DSP block). You can configure the second-stage adders as follows:
■
■
■
■
The final stage of a 36-bit multiplier
A sum of four (18 × 18)
An accumulator (44-bits maximum)
A chained output summation (44-bits maximum)
1
1
You can use the chained-output adder at the same time as a second-level adder in
chained output summation mode.
The output of the second-stage adder has the option to go into the rounding and
saturation logic unit or the output register.
You cannot use the second-stage adder independently from the multiplier and
first-stage adder.
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Stratix IV DSP Block Resource Descriptions
Rounding and Saturation Stage
The rounding and saturation logic units are located at the output of the 44-bit
second-stage adder (the rounding logic unit followed by the saturation logic unit).
There are two rounding and saturation logic units per half DSP block. The input to the
rounding and saturation logic unit can come from one of the following stages:
■
■
■
■
Output of the multiplier (independent multiply mode in 18 × 18)
Output of the first-stage adder (two-multiplier adder)
Output of the pipeline registers
Output of the second-stage adder (four-multiplier adder and multiply-accumulate
mode in 18 × 18)
These stages are described in “Stratix IV Operational Mode Descriptions” on
page 4–15.
The rounding and saturation logic unit is controlled by the dynamic rounding and
saturate signals, respectively. A logic 1value on the rounding and/or saturate
signals enables the rounding and/or saturate logic unit, respectively.
1
You can use the rounding and saturation logic units together or independently.
Second Adder and Output Registers
The second adder register and output register banks are two banks of 44-bit registers
that you can combine to form larger 72-bit banks to support 36 × 36 output results.
The outputs of the different stages in the Stratix IV devices are routed to the output
registers through an output selection unit. Depending on the operational mode of the
DSP block, the output selection unit selects whether the outputs of the DSP blocks
comes from the outputs of the multiplier block, first-stage adder, pipeline registers,
second-stage adder, or the rounding and saturation logic unit. The output selection
unit is set automatically by the software, based on the DSP block operational mode
you specified, and has the option to either drive or bypass the output registers. The
exception is when you use the block in shift mode, in which case you dynamically
control the output-select multiplexer directly.
When the DSP block is configured in chained cascaded output mode, both of the
second-stage adders are used. Use the first one for performing a four-multiplier
adder; use the second for the chainout adder.
The outputs of the four-multiplier adder are routed to the second-stage adder
registers before they enter the chainout adder. The output of the chainout adder goes
to the regular output register bank. Depending on the configuration, you can route
the chainout results to the input of the next half block’s chainout adder input or to the
general fabric (functioning as regular output registers). For more information, refer to
“Stratix IV Operational Mode Descriptions” on page 4–15.
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Stratix IV Operational Mode Descriptions
The second-stage and output registers are triggered by the positive edge of the clock
signal and are cleared after power up. The following DSP block signals control the
output registers within the DSP block:
■
■
■
clock[3..0]
ena[3..0]
aclr[3..0]
Stratix IV Operational Mode Descriptions
This section contains an explanation of different operational modes in Stratix IV
devices.
Independent Multiplier Modes
In independent input and output multiplier mode, the DSP block performs individual
multiplication operations for general-purpose multipliers.
9-, 12-, and 18-Bit Multiplier
You can configure each DSP block multiplier for 9-, 12-, or 18-bit multiplication. A
single DSP block can support up to eight individual 9 × 9 multipliers, six individual
12 × 12 multipliers, or four individual 18 × 18 multipliers. For operand widths up to
9 bits, a 9 × 9 multiplier is implemented. For operand widths from 10 to 12 bits, a
12 × 12 multiplier is implemented, and for operand widths from 13 to 18 bits, an
18 × 18 multiplier is implemented. This is done by the Quartus II software by
zero-padding the LSBs. Figure 4–8, Figure 4–9, and Figure 4–10 show the DSP block in
the independent multiplier operation. Table 4–9 on page 4–34 lists the dynamic
signals for the DSP block.
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Stratix IV Operational Mode Descriptions
Figure 4–8. 18-Bit Independent Multiplier Mode Shown for a Half DSP Block
signa
signb
clock[3..0]
ena[3..0]
aclr[3..0]
output_round
output_saturate
overflow (1)
18
dataa_0[17..0]
36
result_0[ ]
18
18
datab_0[17..0]
dataa_1[17..0]
36
result_1[ ]
18
datab_1[17..0]
Half-DSP Block
Note to Figure 4–8:
(1) Block output for accumulator overflow and saturate overflow.
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Stratix IV Operational Mode Descriptions
Figure 4–9. 12-Bit Independent Multiplier Mode Shown for a Half DSP Block
clock[3..0]
ena[3..0]
aclr[3..0]
signa
signb
12
dataa_0[11..0]
24
result_0[ ]
12
12
datab_0[11..0]
dataa_1[11..0]
24
result_1[ ]
12
12
datab_1[11..0]
dataa_2[11..0]
24
result_2[ ]
12
datab_2[11..0]
Half-DSP Block
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Stratix IV Operational Mode Descriptions
Figure 4–10. 9-Bit Independent Multiplier Mode Shown for a Half Block
clock[3..0]
ena[3..0]
aclr[3..0]
signa
signb
9
dataa_0[8..0]
18
result_0[ ]
9
9
datab_0[8..0]
dataa_1[8..0]
18
result_1[ ]
9
9
datab_1[8..0]
dataa_2[8..0]
18
result_2[ ]
9
9
datab_2[8..0]
dataa_3[8..0]
18
result_3[ ]
9
datab_3[8..0]
Half-DSP Block
The multiplier operands can accept signed integers, unsigned integers, or a
combination of both. You can change the signaand signbsignals dynamically and
can register the signals in the DSP block. Additionally, the multiplier inputs and
results can be registered independently. You can use the pipeline registers within the
DSP block to pipeline the multiplier result, increasing the performance of the DSP
block.
1
The rounding and saturation logic unit is supported for 18-bit independent multiplier
mode only.
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Stratix IV Operational Mode Descriptions
36-Bit Multiplier
You can efficiently construct a 36 × 36 multiplier using four 18 × 18 multipliers. This
simplification fits conveniently into one half DSP block and is implemented in the
DSP block automatically by selecting 36 × 36 mode. Stratix IV devices can have up to
two 36-bit multipliers per DSP block (one 36-bit multiplier per half DSP block). The
36-bit multiplier is also under the independent multiplier mode but uses the entire
half DSP block, including the dedicated hardware logic after the pipeline registers to
implement the 36 × 36 bit multiplication operation, as shown in Figure 4–11.
The 36-bit multiplier is useful for applications requiring more than 18-bit precision;
for example, for the mantissa multiplication portion of single precision and extended
single precision floating-point arithmetic applications.
Figure 4–11. 36-Bit Independent Multiplier Mode Shown for a Half DSP Block
clock[3..0]
ena[3..0]
aclr[3..0]
signa
signb
dataa_0[35..18]
datab_0[35..18]
dataa_0[17..0]
+
datab_0[35..18]
dataa_0[35..18]
72
result[ ]
+
datab_0[17..0]
dataa_0[17..0]
+
datab_0[17..0]
Half-DSP Block
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Stratix IV Operational Mode Descriptions
Double Multiplier
You can configure the Stratix IV DSP block to efficiently support a signed or unsigned
54 × 54-bit multiplier that is required to compute the mantissa portion of an IEEE
double-precision floating point multiplication. You can build a 54 × 54-bit multiplier
using basic 18 × 18 multipliers, shifters, and adders. In order to efficiently use the
Stratix IV DSP block’s built-in shifters and adders, a special double mode (partial
54 × 54 multiplier) is available that is a slight modification to the basic 36 × 36
multiplier mode, as shown in Figure 4–12 and Figure 4–13.
Figure 4–12. Double Mode Shown for a Half DSP Block
clock[3..0]
ena[3..0]
aclr[3..0]
signa
signb
dataa_0[35..18]
datab_0[35..18]
dataa_0[17..0]
+
datab_0[35..18]
dataa_0[35..18]
72
result[ ]
+
datab_0[17..0]
dataa_0[17..0]
+
datab_0[17..0]
Half-DSP Block
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Stratix IV Operational Mode Descriptions
Figure 4–13. Unsigned 54 × 54 Multiplier for a Half-DSP Block
clock[3..0]
ena[3..0]
aclr[3..0]
signa
signb
Two Multiplier
Adder Mode
"0"
"0"
36
+
dataa[53..36]
datab[53..36]
dataa[35..18]
Double Mode
datab[53..36]
dataa[17..0]
55
108
datab[53..36]
dataa[53..36]
result[ ]
datab[35..18]
dataa[53..36]
datab[17..0]
36 x 36 Mode
dataa[35..18]
datab[35..18]
dataa[17..0]
72
datab[35..18]
dataa[35..18]
datab[17..0]
dataa[17..0]
datab[17..0]
Unsigned 54 X 54 Multiplier
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Stratix IV Operational Mode Descriptions
Two-Multiplier Adder Sum Mode
In a two-multiplier adder configuration, the DSP block can implement four 18-bit
two-multiplier adders (2 two-multiplier adders per half DSP block). You can
configure the adders to take the sum or difference of two multiplier outputs. You
must select summation or subtraction at compile time. The two-multiplier adder
function is useful for applications such as FFTs, complex FIR, and IIR filters.
Figure 4–14 on page 4–23 shows the DSP block configured in two-multiplier adder
mode.
Loopback mode is the other sub-feature of the two-multiplier adder mode.
Figure 4–15 on page 4–24 shows the DSP block configured in the loopback mode. This
mode takes the 36-bit summation result of the two multipliers and feeds back the
most significant 18-bits to the input. The lower 18-bits are discarded. You have the
option to disable or zero-out the loopback data by using the dynamic zero_loopback
signal. A logic 1value on the zero_loopbacksignal selects the zeroeddata or
disables the looped back data, while a logic 0selects the looped back data.
1
You must select the option to use loopback mode or the general two-multiplier adder
mode at compile time.
For two-multiplier adder mode, if all the inputs are full 18-bit and unsigned, the result
requires 37 bits. As the output data width in two-multiplier adder mode is limited to
36 bits, this 37-bit output requirement is not allowed. Any other combination that
does not violate the 36-bit maximum result is permitted; for example, two 16 × 16
signed two-multiplier adders is valid.
Two-multiplier adder mode supports the rounding and saturation logic unit. You can
use the pipeline registers and output registers within the DSP block to pipeline the
multiplier-adder result, increasing the performance of the DSP block.
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Stratix IV Operational Mode Descriptions
Figure 4–14. Two-Multiplier Adder Mode Shown for a Half DSP Block
signa
signb
clock[3..0]
ena[3..0]
aclr[3..0]
output_round
output_saturate
overflow (1)
dataa_0[17..0]
datab_0[17..0]
result[ ]
+
dataa_1[17..0]
datab_1[17..0]
Half-DSP Block
Note to Figure 4–14:
(1) Block output for accumulator overflow and saturate overflow.
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Chapter 4: DSP Blocks in Stratix IV Devices
Stratix IV Operational Mode Descriptions
Figure 4–15. Loopback Mode for a Half DSP Block
signa
signb
output_round
output_saturate
clock[3..0]
ena[3..0]
aclr[3..0]
zero_loopback
overflow (1)
dataa_0[17..0]
loopback
datab_0[17..0]
result[ ]
+
dataa_1[17..0]
datab_1[17..0]
Half-DSP Block
Note to Figure 4–15:
(1) Block output for accumulator overflow and saturate overflow.
18 x 18 Complex Multiply
You can configure the DSP block to implement complex multipliers using
two-multiplier adder mode. A single half DSP block can implement one 18-bit
complex multiplier.
Equation 4–4 shows a complex multiplication.
Equation 4–4. Complex Multiplication Equation
(a + jb) × (c + jd) = ((a × c) – (b × d)) + j((a × d) + (b × c))
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February 2011 Altera Corporation
Chapter 4: DSP Blocks in Stratix IV Devices
4–25
Stratix IV Operational Mode Descriptions
To implement this complex multiplication within the DSP block, the real part
((a × c) – (b × d)) is implemented using two multipliers feeding one subtractor block
while the imaginary part ((a × d) + (b × c)) is implemented using another two
multipliers feeding an adder block. Figure 4–16 shows an 18-bit complex
multiplication. This mode automatically assumes all inputs are using signed
numbers.
Figure 4–16. Complex Multiplier Using Two-Multiplier Adder Mode
clock[3..0]
signa
signb
ena[3..0]
aclr[3..0]
A
C
B
36
A x C B x D
Real Part
D
36
A x D
B x C
Imaginary Part
Half-DSP Block
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
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Chapter 4: DSP Blocks in Stratix IV Devices
Stratix IV Operational Mode Descriptions
Four-Multiplier Adder
In the four-multiplier adder configuration shown in Figure 4–17, the DSP block can
implement two four-multiplier adders (one four-multiplier adder per half DSP block).
These modes are useful for implementing one-dimensional and two-dimensional
filtering applications. The four-multiplier adder is performed in two addition stages.
The outputs of two of the four multipliers are initially summed in the two first-stage
adder blocks. The results of these two adder blocks are then summed in the
second-stage adder block to produce the final four-multiplier adder result, as shown
by Equation 4–2 on page 4–5 and Equation 4–3 on page 4–5.
Figure 4–17. Four-Multiplier Adder Mode Shown for a Half DSP Block
signa
clock[3..0]
signb
ena[3..0]
aclr[3..0]
output_round
output_saturate
overflow (1)
dataa_0[ ]
datab_0[ ]
+
dataa_1[ ]
datab_1[ ]
result[ ]
+
dataa_2[ ]
datab_2[ ]
+
dataa_3[ ]
datab_3[ ]
Half-DSP Block
Note to Figure 4–17:
(1) Block output for accumulator overflow and saturate overflow.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 4: DSP Blocks in Stratix IV Devices
4–27
Stratix IV Operational Mode Descriptions
Four-multiplier adder mode supports the rounding and saturation logic unit. You can
use the pipeline registers and output registers within the DSP block to pipeline the
multiplier-adder result, increasing the performance of the DSP block.
High-Precision Multiplier Adder Mode
In a high-precision multiplier adder configuration, shown in Figure 4–18 on
page 4–28, the DSP block can implement 2 two-multiplier adders, with multiplier
precision of 18 x 36 (one two-multiplier adder per half DSP block). This mode is
useful in filtering or FFT applications where a data path greater than 18 bits is
required, yet 18 bits is sufficient for the coefficient precision. This can occur where the
data has a high dynamic range. If the coefficients are fixed, as in FFT and most filter
applications, the precision of 18 bits provide a dynamic range over 100 dB, if the
largest coefficient is normalized to the maximum 18-bit representation.
In these situations, the data path can be up to 36 bits, allowing sufficient capacity for
bit growth or gain changes in the signal source without loss of precision. This mode is
also extremely useful in single precision block floating point applications.
The high-precision multiplier adder is performed in two stages. The 18 × 36 multiply
is divided into two 18 × 18 multipliers. The multiplier with the LSB of the data source
is performed unsigned, while the multiplier with the MSB of the data source can be
signed or unsigned. The latter multiplier has its result left shifted by 18 bits prior to
the first adder stage, creating an effective 18 x 36 multiplier. The results of these two
adder blocks are then summed in the second stage adder block to produce the final
result:
Z[54..0] = P0[53..0] + P1[53..0]
where:
P0 = A[17..0] × B[35..0]
P1 = C[17..0] × D[35..0]
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
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Chapter 4: DSP Blocks in Stratix IV Devices
Stratix IV Operational Mode Descriptions
Figure 4–18. High-Precision Multiplier Adder Configuration
signa
clock[3..0]
ena[3..0]
aclr[3..0]
signb
overflow (1)
dataA[0:17]
dataB[0:17]
+
P
0
dataA[0:17]
<<18
dataB[18:35]
result[ ]
+
dataC[0:17]
dataD[0:17]
dataC[0:17]
+
P
1
<<18
dataD[18:35]
Half-DSP Block
Note to Figure 4–18:
(1) Block output for accumulator overflow and saturate overflow.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 4: DSP Blocks in Stratix IV Devices
4–29
Stratix IV Operational Mode Descriptions
Multiply Accumulate Mode
In multiply accumulate mode, the second-stage adder is configured as a 44-bit
accumulator or subtractor. The output of the DSP block is looped back to the
second-stage adder and added or subtracted with the two outputs of the first-stage
adder block according to Equation 4–3 on page 4–5. Figure 4–19 shows the DSP block
configured to operate in multiply accumulate mode.
Figure 4–19. Multiply Accumulate Mode Shown for a Half DSP Block
signa
signb
output_round
output_saturate
clock[3..0]
ena[3..0]
aclr[3..0]
chainout_sat_overflow (1)
accum_sload
dataa_0[ ]
datab_0[ ]
+
dataa_1[ ]
datab_1[ ]
44
result[ ]
+
dataa_2[ ]
datab_2[ ]
+
dataa_3[ ]
datab_3[ ]
Half-DSP Block
Note to Figure 4–19:
(1) Block output for saturation overflow of chainout.
A single DSP block can implement up to two independent 44-bit accumulators.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
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Chapter 4: DSP Blocks in Stratix IV Devices
Stratix IV Operational Mode Descriptions
Use the dynamic accum_sloadcontrol signal to clear the accumulation. A logic 1
value on the accum_sloadsignal synchronously loads the accumulator with the
multiplier result only, while a logic 0enables accumulation by adding or subtracting
the output of the DSP block (accumulator feedback) to the output of the multiplier
and first-stage adder.
1
You must configure the control signal for the accumulator and subtractor if static at
compile time.
This mode supports the rounding and saturation logic unit because it is configured as
an 18-bit multiplier accumulator. You can use the pipeline registers and output
registers within the DSP block to increase the performance of the DSP block.
Shift Modes
Stratix IV devices support the following shift modes for 32-bit input only:
■
■
■
■
■
Arithmetic shift left, ASL[N]
Arithmetic shift right, ASR[32-N]
Logical shift left, LSL[N]
Logical shift right, LSR[32-N]
32-bit rotator or barrel shifter, ROT[N]
1
You can switch between these modes using the dynamic rotate and shift control
signals.
You can use shift mode in a Stratix IV device by using a soft embedded processor
such as Nios® II to perform the dynamic shift and rotate operation. Figure 4–20 on
page 4–31 shows the shift mode configuration.
Shift mode makes use of the available multipliers to logically or arithmetically shift
left, right, or rotate the desired 32-bit data. You can configure the DSP block similar to
the independent 36-bit multiplier mode to perform shift mode operations.
Arithmetic shift right requires a signed input vector. During an arithmetic shift right,
the sign is extended to fill the MSB of the 32-bit vector. The logical shift right uses an
unsigned input vector. During a logical shift right, zeros are padded in the MSBs,
shifting the 32-bit vector to the right. The barrel shifter uses unsigned input vector
and implements a rotation function on a 32-bit word length.
Two control signals, rotateand shift_right, together with the signaand signb
signals, determine the shifting operation. Table 4–5 on page 4–31 lists examples of
shift operations.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 4: DSP Blocks in Stratix IV Devices
4–31
Stratix IV Operational Mode Descriptions
Figure 4–20. Shift Operation Mode Shown for a Half DSP Block
signa
signb
rotate
clock[3..0]
ena[3..0]
aclr[3..0]
shift_right
dataa_0[35..18]
datab_0[35..18]
+
dataa_0[17..0]
datab_0[35..18]
dataa_0[35..18]
32
result[ ]
+
datab_0[17..0]
+
dataa_0[17..0]
datab_0[17..0]
Half-DSP Block
Table 4–5. Examples of Shift Operations
Example
Signa
Signb
Shift
Rotate
A-input
B-input
Result
Logical Shift Left
LSL[N]
Unsigned
Unsigned
0
0
0xAABBCCDD
0xAABBCCDD
0xAABBCCDD
0x0000100
0x0000100
0x0000100
0xBBCCDD00
0x000000AA
0xBBCCDD00
Logical Shift Right
LSR[32-N]
Unsigned
Signed
Unsigned
Unsigned
1
0
0
0
Arithmetic Shift Left
ASL[N]
Arithmetic Shift Right
ASR[32-N]
Signed
Unsigned
Unsigned
1
0
0
1
0xAABBCCDD
0xAABBCCDD
0x0000100
0x0000100
0xFFFFFFAA
Rotation ROT[N]
Unsigned
0xBBCCDDAA
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
4–32
Chapter 4: DSP Blocks in Stratix IV Devices
Stratix IV Operational Mode Descriptions
Rounding and Saturation Mode
Rounding and saturation functions are often required in DSP arithmetic. Use
rounding to limit bit growth and its side effects; use saturation to reduce overflow
and underflow side effects.
Two rounding modes are supported in Stratix IV devices:
■
Round-to-nearest-integer mode
Round-to-nearest-even mode
■
1
You must select one of these two options at compile time.
Round-to-nearest-integer provides the biased rounding support and is the simplest
form of rounding commonly used in DSP arithmetic. The round-to-nearest-even
method provides unbiased rounding support and is used where DC offsets are a
concern. Table 4–6 lists how round-to-nearest-even works.
Table 4–6. Example of Round-To-Nearest-Even Mode
6- to 4-bits
Rounding
Odd/Even
(Integer)
Fractional
Add to Integer
Result
010111
001101
001010
001110
110111
101101
110110
110010
x
> 0.5 (11)
< 0.5 (01)
= 0.5 (10)
= 0.5 (10)
> 0.5 (11)
< 0.5 (01)
= 0.5 (10)
= 0.5 (10)
1
0
0
1
1
0
1
0
0110
0011
0010
0100
1110
1011
1110
1100
x
Even (0010)
Odd (0011)
x
x
Odd (1101)
Even (1100)
Table 4–7 lists examples of the difference between the two modes. In this example, a
6-bit input is rounded to 4 bits. The main difference between the two rounding
options is when the residue bits are exactly halfway between its nearest two integers
and the LSB is zero (even).
Table 4–7. Comparison of Round-to-Nearest-Integer and Round-to-Nearest-Even
Round-To-Nearest-Integer
010111 ➱ 0110
001101 ➱ 0011
001010 ➱ 0011
001110 ➱ 0100
110111 ➱ 1110
101101 ➱ 1011
110110 ➱ 1110
110010 ➱ 1101
Round-To-Nearest-Even
010111 ➱ 0110
001101 ➱ 0011
001010 ➱ 0010
001110 ➱ 0100
110111 ➱ 1110
101101 ➱ 1011
110110 ➱ 1110
110010 ➱ 1100
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 4: DSP Blocks in Stratix IV Devices
4–33
Stratix IV Operational Mode Descriptions
Two saturation modes are supported in Stratix IV:
■
Asymmetric saturation mode
Symmetric saturation mode
■
1
You must select one of the two options at compile time.
In 2’s-complement format, the maximum negative number that can be represented is
–2(n–1), while the maximum positive number is 2(n–1) – 1. Symmetrical saturation limits
the maximum negative number to –2(n–1) + 1. For example, for 32 bits:
■
Asymmetric 32-bit saturation: Max = 0x7FFFFFFF, Min = 0x80000000
Symmetric 32-bit saturation: Max = 0x7FFFFFFF, Min = 0x80000001
■
Table 4–8 lists how saturation works. In this example, a 44-bit input is saturated to
36-bits.
Table 4–8. Examples of Saturation
44- to 36-Bits Saturation
5926AC01342h
Symmetric SAT Result
7FFFFFFFFh
Asymmetric SAT Result
7FFFFFFFFh
ADA38D2210h
800000001h
800000000h
Stratix IV devices have up to 16 configurable bit positions out of the 44-bit bus
[43:0]) for the rounding and saturate logic unit, providing higher flexibility. These
(
16-bit positions are located at bits [21:6]for rounding and [43:28]for saturation, as
shown in Figure 4–21.
1
You must select the 16 configurable bit positions at compile time.
Figure 4–21. Rounding and Saturation Locations
16 User defined SAT Positions (bit 43-28)
43 42
29 28
1
0
0
16 User defined RND Positions (bit 21-6)
43 42
21 20
7
6
1
For symmetric saturation, the RND bit position is also used to determine where the
LSP for the saturated data is located.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
4–34
Chapter 4: DSP Blocks in Stratix IV Devices
Stratix IV Operational Mode Descriptions
Use the rounding and saturation function just described in regular supported
multiplication operations, as specified in Table 4–2 on page 4–8. However, for
accumulation-type operations, use the following convention:
The functionality of the round logic unit is in the format of:
Result = RND[S(A × B)], when used for an accumulation type of operation.
Likewise, the functionality of the saturation logic unit is in the format of:
Result = SAT[S(A × B)], when used for an accumulation type of operation.
If you use both the rounding and saturation logic units for an accumulation type of
operation, the format is:
Result = SAT[RND[S(A × B)]]
DSP Block Control Signals
The Stratix IV DSP block is configured using a set of static and dynamic signals. You
can configure the DSP block dynamic signals. You can set the signals to toggle or not
toggle at run time. Table 4–9 lists the dynamic signals for the DSP block.
Table 4–9. DSP Block Dynamic Signals (Part 1 of 2)
Signal Name
Function
Count
■
signa
signb
Signed/unsigned control for all multipliers and adders.
■
■
signafor “multiplicand” input bus to dataa[17:0]to each
multiplier
■
■
■
■
■
signbfor “multiplier” input bus datab[17:0]to each multiplier
signa= 1, signb= 1 for signed-signed multiplication
signa= 1, signb= 0 for signed-unsigned multiplication
signa= 0, signb= 1 for unsigned-signed multiplication
signa= 0, signb= 0 for unsigned-unsigned multiplication
2
Round control for the first stage round and saturation block.
output_round
■
output_round= 1 for rounding on multiply output
output_round= 0 for normal multiply output
1
1
■
Round control for the second stage round and saturation block.
chainout_round
■
chainout_round= 1 for rounding multiply output
chainout_round= 0 for normal multiply output
■
Saturation control for the first stage round and saturation block for
Q-format multiply. If you enable both rounding and saturation,
saturation is done on the rounded result.
output_saturate
1
1
■
output_saturate= 1 for saturation support
output_saturate= 0 for no saturation support
■
Saturation control for the second stage round and saturation block for
Q-format multiply. If you enable both rounding and saturation,
saturation is done on the rounded result.
chainout_saturate
■
chainout_saturate= 1 for saturation support
chainout_saturate= 0 for no saturation support
■
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 4: DSP Blocks in Stratix IV Devices
4–35
Software Support
Table 4–9. DSP Block Dynamic Signals (Part 2 of 2)
Signal Name
Function
Count
Dynamically specifies whether the accumulator value is zero.
accum_sload
■
accum_sload= 0, accumulation input is from the output registers
accum_sload= 1, accumulation input is set to zero
1
■
zero_chainout
Dynamically specifies whether the chainout value is zero.
Dynamically specifies whether the loopback value is zero.
rotate= 1, the rotation feature is enabled
1
1
zero_loopback
rotate
1
shift_right
shift_right= 1, the shift right feature is enabled
1
Total Signals per Half Block
11
clock0
clock1
DSP-block-wide clock signals.
4
4
clock2
clock3
ena0
ena1
Input and Pipeline Register enable signals.
DSP block-wide asynchronous clear signals (active low).
ena2
ena3
aclr0
aclr1
4
aclr2
aclr3
Total Count per Full Block
34
Software Support
Altera provides two distinct methods for implementing various modes of the DSP
block in a design—instantiation and inference. Both methods use the following
Quartus II megafunctions:
■
■
■
■
lpm_mult
altmult_add
altmult_accum
altfp_mult
To use the DSP block, instantiate the megafunctions in the Quartus II software.
Alternatively, with inference, create an HDL design and synthesize it using a
third-party synthesis tool (such as LeonardoSpectrum, Synplify, or Quartus II
Native Synthesis) that infers the appropriate megafunction by recognizing
multipliers, multiplier adders, multiplier accumulators, and shift functions. Using
either method, the Quartus II software maps the functionality to the DSP blocks
during compilation.
f
For instructions about using these megafunctions and the MegaWizard Plug-In
Manager, refer to Quartus II software Help.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
4–36
Chapter 4: DSP Blocks in Stratix IV Devices
Software Support
f
For more information, refer to the “Synthesis” section in volume 1 of the Quartus II
Handbook.
Document Revision History
Table 4–10 lists the revision history for this chapter.
Table 4–10. Document Revision History
Date
Version
Changes
■ Applied new template.
■ Minor text edits.
February 2011
3.1
■ Updated Table 4–1.
■ Updated “Stratix IV Simplified DSP Operation” section.
■ Updated graphics.
November 2009
3.0
■ Minor text edits.
■ Added an introductory paragraph to increase search ability.
■ Removed the Conclusion section.
■ Updated Table 4–1.
June 2009
April 2009
March 2009
2.3
2.2
2.1
■ Updated Table 4–1.
■ Removed “Referenced Documents” section.
■ Updated Table 4–2.
November 2008
May 2008
2.0
1.0
■ Updated Figure 4–16.
■ Updated Figure 4–18.
Initial release.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
5. Clock Networks and PLLs in Stratix IV
Devices
February 2011
SIV51005-3.2
SIV51005-3.2
This chapter describes the hierarchical clock networks and phase-locked loops (PLLs)
which have advanced features in Stratix® IV devices. It includes details about the
ability to reconfigure the PLL counter clock frequency and phase shift in real time,
allowing you to sweep PLL output frequencies and dynamically adjust the output
clock phase shift.
The Quartus® II software enables the PLLs and their features without external
devices. The following sections describe the Stratix IV clock networks and PLLs in
detail:
■
“Clock Networks in Stratix IV Devices” on page 5–1
“PLLs in Stratix IV Devices” on page 5–20
■
Clock Networks in Stratix IV Devices
The global clock networks (GCLKs), regional clock networks (RCLKs), and periphery
clock networks (PCLKs) available in Stratix IV devices are organized into hierarchical
clock structures that provide up to 236 unique clock domains (16 GCLKs + 88 RCLKs
+ 132 PCLKs) within the Stratix IV device and allow up to 71 unique GCLK, RCLK,
and PCLK clock sources (16 GCLKs + 22 RCLKs + 33 PCLKs) per device quadrant.
Table 5–1 lists the clock resources available in Stratix IV devices.
Table 5–1. Clock Resources in Stratix IV Devices (Part 1 of 2)
Clock Resource
Number of Resources Available
Source of Clock Resource
32 Single-ended
(16 Differential)
Clock input pins
CLK[0..15]pand CLK[0..15]npins
CLK[0..15]pand CLK[0..15]npins, PLL clock outputs, and
GCLK networks
RCLK networks
PCLK networks
16
logic array
CLK[0..15]pand CLK[0..15]npins, PLL clock outputs, and
64/88 (1)
logic array
56/88/112/132 (33 per device
DPA clock outputs, PLD-transceiver interface clocks, horizontal
I/O pins, and logic array
quadrant) (2)
16 GCLKs + 16 RCLKs
16 GCLKs + 22 RCLKs
GCLKs/RCLKs per
quadrant
32/38 (3)
© 2011 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX are Reg. U.S. Pat. & Tm. Off.
and/or trademarks of Altera Corporation in the U.S. and other countries. All other trademarks and service marks are the property of their respective holders as described at
www.altera.com/common/legal.html. Altera warrants performance of its semiconductor products to current specifications in accordance with Altera’s standard warranty, but
reserves the right to make changes to any products and services at any time without notice. Altera assumes no responsibility or liability arising out of the application or use of any
information, product, or service described herein except as expressly agreed to in writing by Altera. Altera customers are advised to obtain the latest version of device
specifications before relying on any published information and before placing orders for products or services.
Stratix IV Device Handbook Volume 1
February 2011
Subscribe
5–2
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
Clock Networks in Stratix IV Devices
Table 5–1. Clock Resources in Stratix IV Devices (Part 2 of 2)
Clock Resource
Number of Resources Available
Source of Clock Resource
16 GCLKs + 64 RCLKs
16 GCLKs + 88 RCLKs
GCLKs/RCLKs per
device
80/104 (4)
Notes to Table 5–1:
(1) There are 64 RCLKs in the EP4S40G2, EP4S100G2, EP4SE230, EP4SGX70, EP4SGX110, EP4SGX180, and EP4SGX230 devices. There are 88
RCLKs in the EP4S40G5, EP4S100G3, EP4S100G4, EP4S100G5, EP4SE360, EP4SE530, EP4SE820, EP4SGX290, EP4SGX360, and
EP4SGX530 devices.
(2) There are 56 PCLKs in the EP4SGX70, and EP4SGX110 devices. There are 88 PCLKs in the EP4S40G2, EP4S100G2, EP4SE230, EP4SE360,
EP4SGX180, EP4SGX230, EP4SGX290, and EP4SGX360 devices. There are 112 PCLKs in the EP4S40G5, EP4S100G3, EP4S100G4,
EP4S100G5, EP4SE530 and EP4SGX530 devices. There are 132 PCLKs in the EP4SE820 device.
(3) There are 32 GCLKs/RCLKs per quadrant in the EP4S40G2, EP4S100G2, EP4SE230, EP4SGX70, EP4SGX110, EP4SGX180, and EP4SGX230
devices. There are 38 GCLKs/RCLKs per quadrant in the EP4S40G5, EP4S100G3, EP4S100G4, EP4S100G5, EP4SE360, EP4SE530, EP4SE820,
EP4SGX290, EP4SGX360, and EP4SGX530 devices.
(4) There are 80 GCLKs/RCLKs per entire device in the EP4S40G2, EP4S100G2, EP4SE230, EP4SGX70, EP4SGX110, EP4SGX180, and EP4SGX230
devices. There are 104 GCLKs/RCLKS per entire device in the EP4S40G5, EP4S100G3, EP4S100G4, EP4S100G5, EP4SE360, EP4SE530,
EP4SE820, EP4SGX290, EP4SGX360, and EP4SGX530 devices.
Stratix IV devices have up to 32 dedicated single-ended clock pins or 16 dedicated
differential clock pins (CLK[0..15]pand CLK[0..15]n) that can drive either the GCLK
or RCLK networks. These clock pins are arranged on the four sides of the Stratix IV
device, as shown in Figure 5–1 through Figure 5–4 on page 5–5.
f
For more information about how to connect the clock input pins, refer to the
Stratix IV GX and Stratix IV E Device Family Pin Connection Guidelines.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
5–3
Clock Networks in Stratix IV Devices
Global Clock Networks
Stratix IV devices provide up to 16 GCLKs that can drive throughout the device,
serving as low-skew clock sources for functional blocks such as adaptive logic
modules (ALMs), digital signal processing (DSP) blocks, TriMatrix memory blocks,
and PLLs. Stratix IV device I/O elements (IOEs) and internal logic can also drive
GCLKs to create internally generated global clocks and other high fan-out control
signals; for example, synchronous or asynchronous clears and clock enables.
Figure 5–1 shows the CLK pins and PLLs that can drive the GCLK networks in
Stratix IV devices.
Figure 5–1. GCLK Networks
CLK[12..15]
T1 T2
L1
R1
GCLK[12..15]
GCLK[0..3]
GCLK[8..11]
L2
L3
R2
R3
CLK[8..11]
CLK[0..3]
GCLK[4..7]
L4
R4
B2
B1
CLK[4..7]
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
5–4
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
Clock Networks in Stratix IV Devices
Regional Clock Networks
RCLK networks only pertain to the quadrant they drive into. RCLK networks provide
the lowest clock delay and skew for logic contained within a single device quadrant.
The Stratix IV device IOEs and internal logic within a given quadrant can also drive
RCLKs to create internally generated regional clocks and other high fan-out control
signals; for example, synchronous or asynchronous clears and clock enables.
Figure 5–2 through Figure 5–4 on page 5–5 show the CLK pins and PLLs that can
drive the RCLK networks in Stratix IV devices.
Figure 5–2. RCLK Networks (EP4SE230, EP4SGX70, and EP4SGX110 Devices) (Note 1)
CLK[12..15]
T1
RCLK[54..63]
RCLK[44..53]
RCLK[38..43]
RCLK[32..37]
RCLK[0..5]
Q1 Q2
Q4 Q3
L2
R2
CLK[8..11]
CLK[0..3]
RCLK[6..11]
RCLK[12..21]
RCLK[22..31]
B1
CLK[4..7]
Note to Figure 5–2:
(1) A maximum of four signals from the core can drive into each group of RCLKs. For example, only four core signals can drive into RCLK[0..5]and
another four core signals can drive into RCLK[54..63]at any one time.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
5–5
Clock Networks in Stratix IV Devices
Figure 5–3. RCLK Networks (EP4S40G2, EP4S100G2, EP4SGX180, and EP4SGX230 Devices) (Note 1)
CLK[12..15]
T1 T2
RCLK[54..63]
RCLK[44..53]
RCLK[0..5]
RCLK[38..43]
RCLK[32..37]
Q1 Q2
Q4 Q3
L2
L3
R2
R3
CLK[0..3]
CLK[8..11]
RCLK[6..11]
RCLK[12..21] RCLK[22..31]
B1 B2
CLK[4..7]
Note to Figure 5–3:
(1) A maximum of four signals from the core can drive into each group of RCLKs. For example, only four core signals can drive into RCLK[0..5]and
another four core signals can drive into RCLK[54..63]at any one time.
Figure 5–4. RCLK Networks (EP4S40G5, EP4S100G3, EP4S100G4, EP4S100G5, EP4SE360, EP4SE530, EP4SE820,
EP4SGX290, EP4SGX360, and EP4SGX530 Devices) (Note 1), (2), (3)
CLK[12..15]
T1 T2
L1
R1
RCLK[82..87] RCLK[54..63]
RCLK[44..53]
RCLK[76..81]
RCLK[38..43]
RCLK[32..37]
RCLK[0..5]
CLK[8..11]
L2
L3
R2
R3
CLK[0..3]
Q1 Q2
Q4 Q3
RCLK[6..11]
RCLK[70..75]
RCLK[64..69]
RCLK[12..21] RCLK[22..31]
L4
R4
B1 B2
CLK[4..7]
Notes to Figure 5–4:
(1) The corner RCLK[64..87]can only be fed by their respective corner PLL outputs. For more information about connectivity, refer to Table 5–6 on
page 5–14.
(2) The EP4S40G5 and EP4SE360 devices have up to eight PLLs. For more information about PLL availability, refer to Table 5–7 on page 5–20.
(3) A maximum of four signals from the core can drive into each group of RCLKs. For example, only four core signals can drive into RCLK[0..5]and
another four core signals can drive into RCLK[54..63]at any one time.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
5–6
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
Clock Networks in Stratix IV Devices
Periphery Clock Networks
PCLK networks shown in Figure 5–5 through Figure 5–8 on page 5–8 are collections of
individual clock networks driven from the periphery of the Stratix IV device. Clock
outputs from the dynamic phase aligner (DPA) block, programmable logic device
(PLD)-transceiver interface clocks, horizontal I/O pins, and internal logic can drive
the PCLK networks.
PCLKs have higher skew when compared with GCLK and RCLK networks. You can
use PCLKs for general purpose routing to drive signals into and out of the Stratix IV
device.
Legal clock sources for PCLK networks are clock outputs from the DPA block,
PLD-transceiver interface clocks, horizontal I/O pins, and internal logic.
Figure 5–5. PCLK Networks (EP4SGX70 and EP4SGX110 Devices)
CLK[12..15]
T1
PCLK[0..13]
PCLK[42..56]
Q1 Q2
L2
R2
CLK[8..11]
CLK[0..3]
Q4 Q3
PCLK[14..27]
PCLK[28..41]
B1
CLK[4..7]
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
5–7
Clock Networks in Stratix IV Devices
Figure 5–6. PCLK Networks (EP4S40G2, EP4S100G2, EP4SE230, EP4SE360, EP4SGX180, EP4SGX230, EP4SGX290, and
EP4SGX360 Devices) (Note 1)
CLK[12..15]
T1 T2
PCLK[0..10]
PCLK[77..87]
PCLK[11..21]
PCLK[66..76]
Q1 Q2
Q4 Q3
L2
L3
R2
R3
CLK[0..3]
CLK[8..11]
PCLK[22..32]
PCLK[33..43]
PCLK[55..65]
PCLK[44..54]
B1 B2
CLK[4..7]
Note to Figure 5–6:
(1) The EP4SE230 device has four PLLs. The EP4SGX290 and EP4SGX360 devices have up to 12 PLLs. For more information about PLL availability,
refer to Table 5–7 on page 5–20.
Figure 5–7. PCLK Networks (EP4S40G5, EP4S100G3, EP4S100G4, EP4S100G5, EP4SE530, and EP4SGX530
Devices) (Note 1)
CLK[12..15]
T1 T2
L1
R1
PCLK[98..111]
PCLK[84..97]
PCLK[0..13]
PCLK[14..27]
L2
L3
R2
R3
Q1 Q2
Q4 Q3
CLK[0..3]
CLK[8..11]
PCLK[28..41]
PCLK[42..55]
PCLK[70..83]
PCLK[56..69]
L4
R4
B1 B2
CLK[4..7]
Note to Figure 5–7:
(1) The EP4S40G5 device has eight PLLs. For more information about PLL availability, refer to Table 5–7 on page 5–20.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
5–8
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
Clock Networks in Stratix IV Devices
Figure 5–8. PCLK Networks (EP4SE820 Device)
CLK[12..15]
T1 T2
L1
R1
PCLK[0..15]
PCLK[116..131]
PCLK[16..32]
PCLK[99..115]
L2
L3
R2
R3
Q1 Q2
Q4 Q3
CLK[0..3]
CLK[8..11]
PCLK[33..49]
PCLK[50..65]
PCLK[82..98]
PCLK[66..81]
L4
R4
B1 B2
CLK[4..7]
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
5–9
Clock Networks in Stratix IV Devices
Clock Sources Per Quadrant
There are 26 section clock (SCLK) networks available in each spine clock that can
drive six row clocks in each logic array block (LAB) row, nine column I/O clocks, and
three core reference clocks. The SCLKs are the clock resources to the core functional
blocks, PLLs, and I/O interfaces of the device. Figure 5–9 shows that the SCLKs can
be driven by the GCLK, RCLK, PCLK, or the PLL feedback clock networks in each
spine clock.
1
A spine clock is another layer of routing below the GCLKs, RCLKs, and PCLKs before
each clock is connected to clock routing for each LAB row. The settings for spine
clocks are transparent to all users. The Quartus II software automatically routes the
spine clock based on the GCLK, RCLK, and PCLKs.
Figure 5–9. Hierarchical Clock Networks per Spine Clock (Note 1)
9
Column I/O clock (5)
16
GCLK
3
PLL feedback clock (4)
26
3
6
SCLK
16 (2)
22 (3)
Core reference clock (6)
Row clock (7)
PCLK
RCLK
Notes to Figure 5–9:
(1) The GCLK, RCLK, PCLK, and PLL feedback clocks share the same routing to the SCLKs. The total number of clock
resources must not exceed the SCLK limits in each region to ensure successful design fitting in the Quartus II
software.
(2) There are up to 16 PCLKs that can drive the SCLKs in each spine clock in the largest device.
(3) There are up to 22 RCLKs that can drive the SCLKs in each spine clock in the largest device.
(4) The PLL feedback clock is the clock from the PLL that drives into the SCLKs.
(5) The column I/O clock is the clock that drives the column I/O core registers and I/O interfaces.
(6) The core reference clock is the clock that feeds into the PLL as the PLL reference clock.
(7) The row clock is the clock source to the LAB, memory blocks, and row I/O interfaces in the core row.
Clock Regions
Stratix IV devices provide up to 104 distinct clock domains (16 GCLKs + 88 RCLKs) in
the entire device. You can use these clock resources to form the following types of
clock regions:
■
■
■
Entire device
Regional
Dual-regional
To form the entire device clock region, a source (not necessarily a clock signal) drives
a GCLK network that can be routed through the entire device. This clock region has
the maximum delay when compared with other clock regions, but allows the signal to
reach every destination within the device. This is a good option for routing global
reset and clear signals or routing clocks throughout the device.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
5–10
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
Clock Networks in Stratix IV Devices
To form a RCLK region, a source drives a single quadrant of the device. This clock
region provides the lowest skew within a quadrant and is a good option if all the
destinations are within a single device quadrant.
To form a dual-regional clock region, a single source (a clock pin or PLL output)
generates a dual-regional clock by driving two RCLK networks (one from each
quadrant). This technique allows destinations across two device quadrants to use the
same low-skew clock. The routing of this signal on an entire side has approximately
the same delay as a RCLK region. Internal logic can also drive a dual-regional clock
network. Corner PLL outputs only span one quadrant, they cannot generate a
dual-regional clock network. Figure 5–10 shows the dual-regional clock region.
Figure 5–10. Stratix IV Dual-Regional Clock Region
Clock pins or PLL outputs
can drive half of the device to
create side-wide clocking
regions for improved
interface timing.
Clock Network Sources
In Stratix IV devices, clock input pins, PLL outputs, and internal logic can drive the
GCLK and RCLK networks. For connectivity between dedicated pins CLK[0..15]and
the GCLK and RCLK networks, refer to Table 5–2 and Table 5–3 on page 5–11.
Dedicated Clock Input Pins
Clock pins can be either differential clocks or single-ended clocks. Stratix IV devices
support 16 differential clock inputs or 32 single-ended clock inputs. You can also use
dedicated clock input pins CLK[15..0]for high fan-out control signals such as
asynchronous clears, presets, and clock enables for protocol signals such as TRDYand
IRDYfor PCIe through the GCLK or RCLK networks.
LABs
You can drive each GCLK and RCLK network using LAB-routing to enable internal
logic to drive a high fan-out, low-skew signal.
1
Stratix IV PLLs cannot be driven by internally generated GCLKs or RCLKs. The input
clock to the PLL has to come from dedicated clock input pins or pin/PLL-fed GCLKs
or RCLKs.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
5–11
Clock Networks in Stratix IV Devices
PLL Clock Outputs
Stratix IV PLLs can drive both GCLK and RCLK networks, as described in Table 5–5
on page 5–13 and Table 5–6 on page 5–14.
Table 5–2 lists the connection between the dedicated clock input pins and GCLKs.
Table 5–2. Clock Input Pin Connectivity to the GCLK Networks
CLK (p/n Pins)
Clock Resources
0
1
2
3
4
5
6
7
8
9
10
—
—
—
—
—
—
—
—
v
v
v
v
—
—
—
—
11
—
—
—
—
—
—
—
—
v
v
v
v
—
—
—
—
12
—
—
—
—
—
—
—
—
—
—
—
—
v
v
v
v
13
—
—
—
—
—
—
—
—
—
—
—
—
v
v
v
v
14
—
—
—
—
—
—
—
—
—
—
—
—
v
v
v
v
15
—
—
—
—
—
—
—
—
—
—
—
—
v
v
v
v
GCLK0
GCLK1
GCLK2
GCLK3
GCLK4
GCLK5
GCLK6
GCLK7
GCLK8
GCLK9
GCLK10
GCLK11
GCLK12
GCLK13
GCLK14
GCLK15
v
v
v
v
—
—
—
—
—
—
—
—
—
—
—
—
v
v
v
v
—
—
—
—
—
—
—
—
—
—
—
—
v
v
v
v
—
—
—
—
—
—
—
—
—
—
—
—
v
v
v
v
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
v
v
v
v
—
—
—
—
—
—
—
—
—
—
—
—
v
v
v
v
—
—
—
—
—
—
—
—
—
—
—
—
v
v
v
v
—
—
—
—
—
—
—
—
—
—
—
—
v
v
v
v
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
v
v
v
v
—
—
—
—
—
—
—
—
—
—
—
—
v
v
v
v
—
—
—
—
Table 5–3 lists the connectivity between the dedicated clock input pins and RCLKs in
Stratix IV devices. A given clock input pin can drive two adjacent RCLK networks to
create a dual-regional clock network.
Table 5–3. Clock Input Pin Connectivity to the RCLK Networks (Part 1 of 2)
CLK (p/n Pins)
Clock Resource
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
RCLK [0, 4, 6, 10]
RCLK [1, 5, 7, 11]
v
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
v
—
—
—
—
—
v
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
v
RCLK [2, 8]
RCLK [3, 9]
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
v
—
—
—
—
v
RCLK [13, 17, 21, 23,
27, 31]
—
—
—
RCLK [12, 16, 20, 22,
26, 30]
—
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
5–12
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
Clock Networks in Stratix IV Devices
Table 5–3. Clock Input Pin Connectivity to the RCLK Networks (Part 2 of 2)
CLK (p/n Pins)
Clock Resource
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
RCLK [15, 19, 25, 29]
RCLK [14, 18, 24, 28]
RCLK [35, 41]
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
v
—
—
—
—
—
—
—
v
—
—
—
—
—
—
—
v
—
—
—
—
—
—
—
v
—
—
—
—
—
—
—
v
—
—
—
—
—
—
—
v
—
—
—
—
—
—
—
v
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
RCLK [34, 40]
RCLK [33, 37, 39, 43]
RCLK [32, 36, 38, 42]
RCLK [47, 51, 57, 61]
RCLK [46, 50, 56, 60]
—
—
—
—
—
—
—
—
—
—
—
—
—
v
—
—
RCLK [45, 49, 53, 55,
59, 63]
—
—
—
—
—
—
—
—
—
—
—
—
—
—
v
—
RCLK [44, 48, 52, 54,
58, 62]
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
v
Clock Input Connections to the PLLs
Table 5–4 lists the dedicated clock input pin connectivity to Stratix IV PLLs.
Table 5–4. Device PLLs and PLL Clock Pin Drivers (Note 1), (2) (Part 1 of 2)
Dedicated Clock
Input Pin
CLK (p/n Pins)
PLL Number
L1 (3)
L2
L3
L4 (3)
B1
B2
R1 (3)
R2
R3
R4 (3)
T1
T2
CLK0
v
v
v
v
—
—
—
—
—
—
—
—
—
—
—
v
v
v
v
—
—
—
—
—
—
—
—
—
—
—
v
v
v
v
—
—
—
—
—
—
—
—
—
—
—
v
v
v
v
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
v
v
v
v
—
—
—
—
—
—
—
—
—
—
—
v
v
v
v
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
v
v
v
v
—
—
—
—
—
—
—
—
—
—
—
v
v
v
v
—
—
—
—
—
—
—
—
—
—
—
v
v
v
v
—
—
—
—
—
—
—
—
—
—
—
v
v
v
v
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
v
v
v
—
—
—
—
—
—
—
—
—
—
—
—
v
v
v
CLK1
CLK2
CLK3
CLK4
CLK5
CLK6
CLK7
CLK8
CLK9
CLK10
CLK11
CLK12
CLK13
CLK14
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
5–13
Clock Networks in Stratix IV Devices
Table 5–4. Device PLLs and PLL Clock Pin Drivers (Note 1), (2) (Part 2 of 2)
Dedicated Clock
Input Pin
CLK (p/n Pins)
PLL Number
L1 (3)
L2
L3
L4 (3)
B1
B2
R1 (3)
R2
R3
R4 (3)
T1
T2
CLK15
—
—
—
—
—
—
—
—
—
—
v
v
Notes to Table 5–4:
(1) For single-ended clock inputs, only the CLK<#>ppin has a dedicated connection to the PLL. If you use the CLK<#>npin, a global clock is used.
(2) For the availability of the clock input pins in each device density, refer to the “Stratix IV Device Pin-Out Files” section of the Pin-Out Files for
Altera Devices site.
(3) These are non-compensated clock input paths. For the compensated input for these PLLs, use the corresponding PLL_[L, R][1,4]_CLKinput
pin.
1
Dedicated clock pins can drive PLLs over dedicated routing; they do not require the
global or regional network. Compensated inputs, which are a subset of dedicated
clock pins, drive PLLs that can only compensate the input delay when a dedicated
clock pin is in the same I/O bank as the PLL used.
Clock Output Connections
PLLs in Stratix IV devices can drive up to 20 RCLK networks and four GCLK
networks. For Stratix IV PLL connectivity to GCLK networks, refer to Table 5–5. The
Quartus II software automatically assigns PLL clock outputs to RCLK and GCLK
networks.
Table 5–5 lists how the PLL clock outputs connect to the GCLK networks.
Table 5–5. Stratix IV PLL Connectivity to the GCLK Networks (Note 1)
PLL Number
Clock Network
L1
v
v
v
v
—
—
—
—
—
—
—
—
—
—
—
—
L2
v
v
v
v
—
—
—
—
—
—
—
—
—
—
—
—
L3
v
v
v
v
—
—
—
—
—
—
—
—
—
—
—
—
L4
v
v
v
v
—
—
—
—
—
—
—
—
—
—
—
—
B1
—
—
—
—
v
v
v
v
—
—
—
—
—
—
—
—
B2
—
—
—
—
v
v
v
v
—
—
—
—
—
—
—
—
R1
—
—
—
—
—
—
—
—
v
v
v
v
—
—
—
—
R2
—
—
—
—
—
—
—
—
v
v
v
v
—
—
—
—
R3
—
—
—
—
—
—
—
—
v
v
v
v
—
—
—
—
R4
—
—
—
—
—
—
—
—
v
v
v
v
—
—
—
—
T1
—
—
—
—
—
—
—
—
—
—
—
—
v
v
v
v
T2
—
—
—
—
—
—
—
—
—
—
—
—
v
v
v
v
GCLK0
GCLK1
GCLK2
GCLK3
GCLK4
GCLK5
GCLK6
GCLK7
GCLK8
GCLK9
GCLK10
GCLK11
GCLK12
GCLK13
GCLK14
GCLK15
Note to Table 5–5:
(1) Only PLL counter outputs C0 - C3 can drive the GCLK networks.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
5–14
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
Clock Networks in Stratix IV Devices
Table 5–6 lists how the PLL clock outputs connect to the RCLK networks.
Table 5–6. Stratix IV RCLK Outputs From the PLL Clock Outputs (Note 1)
PLL Number
Clock Resource
L1
—
—
—
—
—
—
—
v
L2
v
—
—
—
—
—
—
—
L3
v
—
—
—
—
—
—
—
L4
—
—
—
—
v
—
—
—
B1
—
v
—
—
—
—
—
—
B2
—
v
—
—
—
—
—
—
R1
—
—
—
—
—
—
v
—
R2
—
—
v
—
—
—
—
—
R3 R4
T1
—
—
—
v
—
—
—
—
T2
—
—
—
v
—
—
—
—
RCLK[0..11]
RCLK[12..31]
RCLK[32..43]
RCLK[44..63]
RCLK[64..69]
RCLK[70..75]
RCLK[76..81]
RCLK[82..87]
Note to Table 5–6:
—
—
v
—
—
—
—
—
—
—
—
—
—
v
—
—
(1) All PLL counter outputs can drive the RCLK networks.
Clock Control Block
Every GCLK and RCLK network has its own clock control block. The control block
provides the following features:
■
■
■
Clock source selection (dynamic selection for GCLKs)
Global clock multiplexing
Clock power down (static or dynamic clock enable or disable)
Figure 5–11 and Figure 5–12 show the GCLK and RCLK select blocks, respectively.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
5–15
Clock Networks in Stratix IV Devices
You can select the clock source for the GCLK select block either statically or
dynamically. You can statically select the clock source using a setting in the Quartus II
software or you can dynamically select the clock source using internal logic to drive
the multiplexer-select inputs. When selecting the clock source dynamically, you can
select either PLL outputs (such as C0or C1) or a combination of clock pins or PLL
outputs.
Figure 5–11. Stratix IV GCLK Control Block
CLKp
Pins
2
PLL Counter
Outputs
2
CLKn
Pin
Internal
Logic
2
CLKSELECT[1..0]
(1)
Static Clock
Select (2)
This multiplexer
supports user-controllable
dynamic switching
Enable/
Disable
Internal
Logic
GCLK
Notes to Figure 5–11:
(1) When the device is operating in user mode, you can dynamically control the clock select signals through internal
logic.
(2) When the device is operation in user mode, you can only set the clock select signals through a configuration file
(SRAM object file [.sof] or programmer object file [.pof]) and cannot be dynamically controlled.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
5–16
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
Clock Networks in Stratix IV Devices
The mapping between the input clock pins, PLL counter outputs, and clock control
block inputs is as follows:
■
■
■
inclk[0]and inclk[1]—can be fed by any of the four dedicated clock pins on the
same side of the Stratix IV device
inclk[2]—can be fed by PLL counters C0 and C2 from the two center PLLs on the
same side of the Stratix IV device
inclk[3]—can be fed by PLL counters C1 and C3 from the two center PLLs on the
same side of the Stratix IV device
The corner PLLs (L1, L4, R1, and R4) and the corresponding clock input pins
PLL_L1_CLKand so forth) do not support dynamic selection for the GCLK network.
(
The clock source selection for the GCLK and RCLK networks from the corner PLLs
(L1, L4, R1, and R4) and the corresponding clock input pins (PLL_L1_CLKand so forth)
are controlled statically using configuration bit settings in the configuration file (.sof
or .pof) generated by the Quartus II software.
Figure 5–12. RCLK Control Block
CLKp
Pin
CLKn
(2)
Pin
PLL Counter
Outputs
2
Internal
Logic
Static Clock Select
(1)
Enable/
Disable
Internal
Logic
RCLK
Notes to Figure 5–12:
(1) When the device is operation in user mode, you can only set the clock select signals through a configuration file (.sof
or .pof) and cannot be dynamically controlled.
(2) The CLKnpin is not a dedicated clock input when used as a single-ended PLL clock input.
You can only control the clock source selection for the RCLK select block statically
using configuration bit settings in the configuration file (.sof or .pof) generated by the
Quartus II software.
You can power down the Stratix IV clock networks using both static and dynamic
approaches. When a clock network is powered down, all the logic fed by the clock
network is in off-state, thereby reducing the overall power consumption of the device.
The unused GCLK and RCLK networks are automatically powered down through
configuration bit settings in the configuration file (.sof or .pof) generated by the
Quartus II software. The dynamic clock enable or disable feature allows the internal
logic to control power-up or power-down synchronously on the GCLK and RCLK
networks, including dual-regional clock regions. This function is independent of the
PLL and is applied directly on the clock network, as shown in Figure 5–11 and
Figure 5–12.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
5–17
Clock Networks in Stratix IV Devices
You can set the input clock sources and the clkenasignals for the GCLK and RCLK
network multiplexers through the Quartus II software using the ALTCLKCTRL
megafunction. You can also enable or disable the dedicated external clock output pins
using the ALTCLKCTRL megafunction. Figure 5–13 shows the external PLL output
clock control block.
1
When using the ALTCLKCTRL megafunction to implement dynamic clock source
selection, the inputs from the clock pins feed the inclk[0..1]ports of the
multiplexer, while the PLL outputs feed the inclk[2..3]ports. You can choose from
among these inputs using the CLKSELECT[1..0]signal.
f
For more information, refer to the Clock Control Block (ALTCLKCTRL) Megafunction
User Guide.
Figure 5–13. Stratix IV External PLL Output Clock Control Block
PLL Counter
Outputs
7 or 10
Static Clock Select
(1)
Enable/
Disable
Internal
Logic
IOE (2)
Internal
Logic
Static Clock
Select
(1)
PLL_<#>_CLKOUT pin
Notes to Figure 5–13:
(1) When the device is operation in user mode, you can only set the clock select signals through a configuration file (.sof
or .pof) and cannot be dynamically controlled.
(2) The clock control block feeds to a multiplexer within the PLL_<#>_CLKOUTpin’s IOE. The PLL_<#>_CLKOUT
pin is a dual-purpose pin. Therefore, this multiplexer selects either an internal signal or the output of the clock control
block.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
5–18
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
Clock Networks in Stratix IV Devices
Clock Enable Signals
Figure 5–14 shows how the clock enable and disable circuit of the clock control block
is implemented in Stratix IV devices.
Figure 5–14. clkena Implementation
(1)
(1)
(2)
clkena
D
Q
D
Q
GCLK/
RCLK/
PLL_<#>_CLKOUT (1)
output of clock
select mux
R1
R2
Notes to Figure 5–14:
(1) The R1 and R2 bypass paths are not available for the PLL external clock outputs.
(2) The select line is statically controlled by a bit setting in the configuration file (.sof or .pof).
In Stratix IV devices, the clkenasignals are supported at the clock network level
instead of at the PLL output counter level. This allows you to gate off the clock even
when you are not using a PLL. You can also use the clkenasignals to control the
dedicated external clocks from the PLLs. Figure 5–15 shows a waveform example for
a clock output enable. clkenais synchronous to the falling edge of the clock output.
Stratix IV devices also have an additional metastability register that aids in
asynchronous enable and disable of the GCLK and RCLK networks. You can
optionally bypass this register in the Quartus II software.
Figure 5–15. clkena Signals (Note 1)
output of clock
select mux
clkena
output of AND gate
with R2 bypassed
output of AND gate
with R2 not bypassed
Note to Figure 5–15:
(1) You can use the clkenasignals to enable or disable the GCLK and RCLK networks or the PLL_<#>_CLKOUTpins.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
5–19
Clock Networks in Stratix IV Devices
The PLL can remain locked independent of the clkenasignals because the
loop-related counters are not affected. This feature is useful for applications that
require a low-power or sleep mode. The clkenasignal can also disable clock outputs
if the system is not tolerant of frequency over-shoot during resynchronization.
Clock Source Control for PLLs
The clock input to Stratix IV PLLs comes from clock input multiplexers. The clock
multiplexer inputs come from dedicated clock input pins, PLLs through the GCLK
and RCLK networks, or from dedicated connections between adjacent top/bottom
and left/right PLLs. The clock input sources to top/bottom and left/right PLLs (L2,
L3, T1, T2, B1, B2, R2, and R3) are shown in Figure 5–16; the corresponding clock
input sources to left and right PLLs (L1, L4, R1, and R4) are shown in Figure 5–17.
The multiplexer select lines are only set in the configuration file (.sof or .pof). After
programmed, this block cannot be changed without loading a new configuration file
(.sof or .pof). The Quartus II software automatically sets the multiplexer select signals
depending on the clock sources selected in the design.
Figure 5–16. Clock Input Multiplexer Logic for L2, L3, T1, T2, B1, B2, R2, and R3 PLLs
(1)
4
clk[n+3..n] (2)
GCLK / RCLK input (3)
inclk0
inclk1
To the clock
switchover block
Adjacent PLL output
(1)
4
Notes to Figure 5–16:
(1) When the device is operating in user mode, input clock multiplexing is controlled through a configuration file (.sof
or .pof) only and cannot be dynamically controlled.
(2) n=0 for L2 and L3 PLLs; n=4 for B1 and B2 PLLs; n=8 for R2 and R3 PLLs, and n=12 for T1 and T2 PLLs.
(3) You can drive the GCLK or RCLK input using an output from another PLL, a pin-driven GCLK or RCLK, or through a
clock control block provided the clock control block is fed by an output from another PLL or a pin-driven dedicated
GCLK or RCLK. An internally generated global signal or general purpose I/O pin cannot drive the PLL.
Figure 5–17. Clock Input Multiplexer Logic for L1, L4, R1, and R4 PLLs
(1)
PLL_<L1/L4/R1/R4>_CLK
inclk0
GCLK/RCLK (2)
4
CLK[0..3] or CLK[8..11] (3)
inclk1
4
Notes to Figure 5–17:
(1) Dedicated clock input pins to the PLLs are L1, L4, R1, and R4, respectively. For example, PLL_L1_CLKis the
dedicated clock input for PLL_L1.
(2) You can drive the GCLK or RCLK input using an output from another PLL, a pin-driven GCLK or RCLK, or through a
clock control block provided the clock control block is fed by an output from another PLL or a pin-driven dedicated
GCLK or RCLK. An internally generated global signal or general purpose I/O pin cannot drive the PLL.
(3) The center clock pins can feed the corner PLLs on the same side directly through a dedicated path. However, these
paths may not be fully compensated.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
5–20
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
PLLs in Stratix IV Devices
Cascading PLLs
You can cascade the left/right and top/bottom PLLs through the GCLK and RCLK
networks. In addition, where two left/right or top/bottom PLLs exist next to each
other, there is a direct connection between them that does not require the GCLK or
RCLK network. Using this path reduces clock jitter when cascading PLLs.
1
Stratix IV GX devices allow cascading the left and right PLLs to transceiver PLLs
(CMU PLLs and receiver CDRs).
f
For more information, refer to the “FPGA Fabric PLLs -Transceiver PLLs Cascading”
section in the Transceiver Clocking in Stratix IV Devices chapter.
When cascading PLLs in Stratix IV devices, the source (upstream) PLL must have a
low-bandwidth setting while the destination (downstream) PLL must have a
high-bandwidth setting. Ensure that there is no overlap of the bandwidth ranges of
the two PLLs.
f
For more information about PLL cascading in external memory interfaces designs,
refer to the External Memory PHY Interface (ALTMEMPHY) (nonAFI) Megafunction User
Guide.
PLLs in Stratix IV Devices
Stratix IV devices offer up to 12 PLLs that provide robust clock management and
synthesis for device clock management, external system clock management, and
high-speed I/O interfaces. The nomenclature for the PLLs follows their geographical
location in the device floor plan. The PLLs that reside on the top and bottom sides of
the device are named PLL_T1
left and right sides of the device are named PLL_L1
PLL_R3, and PLL_R4
, PLL_T2, PLL_B1and PLL_B2; the PLLs that reside on the
,
PLL_L2
,
PLL_L3
,
PLL_L4
,
PLL_R1
,
PLL_R2
,
.
Table 5–7 lists the number of PLLs available in the Stratix IV device family.
Table 5–7. PLL Availability for Stratix IV Devices (Part 1 of 2)
Device
Package
F1517
H1517
F1517
F1932
F1932
H1517
F1932
F780
L1
—
—
—
v
v
—
v
—
—
—
—
v
v
L2
v
v
v
v
v
v
v
v
v
v
v
v
v
L3
v
v
v
v
v
v
v
—
—
v
v
v
v
L4
—
—
—
v
v
—
v
—
—
—
—
v
v
T1
v
v
v
v
v
v
v
v
v
v
v
v
v
T2
v
v
v
v
v
v
v
—
—
v
v
v
v
B1
v
v
v
v
v
v
v
v
v
v
v
v
v
B2
v
v
v
v
v
v
v
—
—
v
v
v
v
R1
—
—
—
v
v
—
v
—
—
—
—
v
v
R2
v
v
v
v
v
v
v
v
v
v
v
v
v
R3
v
v
v
v
v
v
v
—
—
v
v
v
v
R4
—
—
—
v
v
—
v
—
—
—
—
v
v
EP4S40G2
EP4S40G5
EP4S100G2
EP4S100G3
EP4S100G4
EP4S100G5
EP4SE230
EP4SE360
H780
F1152
H1152
H1517
F1760
EP4SE530
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
5–21
PLLs in Stratix IV Devices
Table 5–7. PLL Availability for Stratix IV Devices (Part 2 of 2)
Device
Package
H1152
H1517
F1760
F780
L1
—
v
v
—
—
—
—
—
—
—
—
—
—
—
—
—
v
v
—
—
—
v
v
—
—
v
v
L2
v
v
v
v
v
v
v
v
v
v
v
v
v
—
v
v
v
v
—
v
v
v
v
v
v
v
v
L3
v
v
v
—
—
—
—
—
—
v
—
—
v
—
—
v
v
v
—
—
v
v
v
—
v
v
v
L4
—
v
v
—
—
—
—
—
—
—
—
—
—
—
—
—
v
v
—
—
—
v
v
—
—
v
v
T1
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
T2
v
v
v
—
—
—
—
—
v
v
—
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
B1
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
B2
v
v
v
—
—
—
—
—
v
v
—
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
R1
—
v
v
—
—
—
—
—
—
—
—
—
—
—
—
—
v
v
—
—
—
v
v
—
—
v
v
R2
v
v
v
—
v
—
v
—
v
v
—
v
v
—
v
v
v
v
—
v
v
v
v
v
v
v
v
R3
v
v
v
—
—
—
—
—
—
v
—
—
v
—
—
v
v
v
—
—
v
v
v
—
v
v
v
R4
—
v
v
—
—
—
—
—
—
—
—
—
—
—
—
—
v
v
—
—
—
v
v
—
—
v
v
EP4SE820
EP4SGX70
F1152
F780
EP4SGX110
F1152
F780
EP4SGX180
EP4SGX230
F1152
F1517
F780
F1152
F1517
H780
F1152
F1517
F1760
F1932
H780
EP4SGX290
F1152
F1517
F1760
F1932
H1152
H1517
F1760
F1932
EP4SGX360
EP4SGX530
All Stratix IV PLLs have the same core analog structure with only minor differences in
the features that are supported. Table 5–8 lists the features of top/bottom and
left/right PLLs in Stratix IV devices.
Table 5–8. PLL Features in Stratix IV Devices (Part 1 of 2) (Note 1)
Feature
(output) counters
counter sizes
Stratix IV Top/Bottom PLLs
Stratix IV Left/Right PLLs
C
M
10
7
,
N
,
C
1 to 512
1 to 512
6 single-ended or 4 single-ended and 1
differential pair
Dedicated clock outputs
2 single-ended or 1 differential pair
4 single-ended or 4 differential pin
pairs
Clock input pins (2)
4 single-ended or 4 differential pin pairs
External feedback input pin
Single-ended or differential
Single-ended only
Spread-spectrum input clock tracking
Yes (3)
Yes (3)
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
5–22
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
PLLs in Stratix IV Devices
Table 5–8. PLL Features in Stratix IV Devices (Part 2 of 2) (Note 1)
Feature
Stratix IV Top/Bottom PLLs
Stratix IV Left/Right PLLs
Through GCLK and RCLK and
dedicated path between adjacent PLLs
(4)
Through GCLK and RCLK and a dedicated
path between adjacent PLLs
PLL cascading
All except LVDS clock network
compensation
All except external feedback mode
when using differential I/Os
Compensation modes
PLL drives LVDSCLKand LOADEN
VCO output drives the DPA clock
Phase shift resolution
No
Yes
No
Yes
Down to 96.125 ps (5)
Down to 96.125 ps (5)
Programmable duty cycle
Output counter cascading
Input clock switchover
Yes
Yes
Yes
Yes
Yes
Yes
Notes to Table 5–8:
(1) While there is pin compatibility, there is no hard IP block placement compatibility.
(2) General purpose I/O pins cannot drive the PLL clock input pins.
(3) Provided input clock jitter is within input jitter tolerance specifications.
(4) The dedicated path between adjacent PLLs is not available on L1, L4, R1, and R4 PLLs.
(5) The smallest phase shift is determined by the voltage-controlled oscillator (VCO) period divided by eight. For degree increments, the Stratix IV
device can shift all output frequencies in increments of at least 45°. Smaller degree increments are possible depending on the frequency and
divide parameters.
Figure 5–18 shows the location of PLLs in Stratix IV devices.
Figure 5–18. PLL Locations in Stratix IV Devices
Top/Bottom PLLs
Top/Bottom PLLs
CLK[12..15]
T1 T2
L1
R1
PLL_L1_CLK
PLL_R1_CLK
Left/Right PLLs
Left/Right PLLs
Left/Right PLLs
Left/Right PLLs
Q1 Q2
Q4 Q3
L2
L3
R2
R3
CLK[0..3]
CLK[8..11]
L4
R4 PLL-R4_CLK
PLL_L4_CLK
B1 B2
CLK[4..7]
Top/Bottom PLLs
Top/Bottom PLLs
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
5–23
PLLs in Stratix IV Devices
Stratix IV PLL Hardware Overview
Stratix IV devices contain up to 12 PLLs with advanced clock management features.
The goal of a PLL is to synchronize the phase and frequency of an internal or external
clock to an input reference clock. There are a number of components that comprise a
PLL to achieve this phase alignment.
Stratix IV PLLs align the rising edge of the input reference clock to a feedback clock
using the phase-frequency detector (PFD). The falling edges are determined by the
duty-cycle specifications. The PFD produces an up or down signal that determines
whether the VCO must operate at a higher or lower frequency. The output of the PFD
feeds the charge pump and loop filter, which produces a control voltage for setting
the VCO frequency. If the PFD produces an up signal, the VCO frequency increases. A
down signal decreases the VCO frequency. The PFD outputs these up and down
signals to a charge pump. If the charge pump receives an up signal, current is driven
into the loop filter. Conversely, if the charge pump receives a down signal, current is
drawn from the loop filter.
The loop filter converts these up and down signals to a voltage that is used to bias the
VCO. The loop filter also removes glitches from the charge pump and prevents
voltage over-shoot, which filters the jitter on the VCO. The voltage from the loop filter
determines how fast the VCO operates. A divide counter (
feedback loop to increase the VCO frequency above the input reference frequency.
VCO frequency (fVCO) is equal to ( ) times the input reference clock (fREF). The input
reference clock (fREF) to the PFD is equal to the input clock (fIN) divided by the
pre-scale counter ( ). Therefore, the feedback clock (fFB) applied to one input of the
m) is inserted in the
m
N
PFD is locked to the fREF that is applied to the other input of the PFD.
The VCO output from the left and right PLLs can feed seven post-scale counters
(C[0..6]), while the corresponding VCO output from the top and bottom PLLs can
feed ten post-scale counters (C[0..9]). These post-scale counters allow a number of
harmonically related frequencies to be produced by the PLL.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
5–24
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
PLLs in Stratix IV Devices
Figure 5–19 shows a simplified block diagram of the major components of the
Stratix IV PLL.
Figure 5–19. Stratix IV PLL Block Diagram
To DPA block on
Left/Right PLLs
Casade output
to adjacent PLL
Lock
Circuit
locked
LF
pfdena
/2, /4
÷C0
GCLKs
RCLKs
4
8
÷C1
÷C2
÷C3
Dedicated
clock inputs
8
÷2
(2)
÷n
clkswitch
clkbad0
clkbad1
activeclock
inclk0
inclk1
8
CP
VCO
PFD
External clock
outputs
Clock
Switchover
Block
DIFFIOCLK from
Left/Right PLLs
GCLK/RCLK
LOAD_EN from
Left/Right PLLs
Cascade input
from adjacent PLL
(1)
÷Cn
÷m
FBOUT (3)
External
memory
interface DLL
no compensation mode
ZDB, External feedback modes
LVDS Compensation mode
Source Synchronous, normal modes
FBIN
DIFFIOCLK network
GCLK/RCLK network
Notes to Figure 5–19:
(1) The number of post-scale counters is seven for left and right PLLs and ten for top and bottom PLLs.
(2) This is the VCO post-scale counter
(3) The FBOUTport is fed by the counter in Stratix IV PLLs.
K
.
M
1
You can drive the GCLK or RCLK inputs using an output from another PLL, a
pin-driven GCLK or RCLK, or through a clock control block provided the clock
control block is fed by an output from another PLL or a pin-driven dedicated GCLK
or RCLK. An internally generated global signal or general purpose I/O pin cannot
drive the PLL.
PLL Clock I/O Pins
Each top and bottom PLL supports six clock I/O pins, organized as three pairs of
pins:
■
1st pair—two single-ended I/O or one differential I/O
■
2nd pair—two single-ended I/O or one differential external feedback input
(FBp/FBn)
■
3rd pair—two single-ended I/O or one differential input
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
5–25
PLLs in Stratix IV Devices
Figure 5–20 shows the clock I/O pins associated with the top and bottom PLLs.
Figure 5–20. External Clock Outputs for Top and Bottom PLLs
Internal Logic
C0
C1
C2
C3
Top/Bottom
PLLs
C4
C5
C6
C7
C8
C9
m(fbout)
clkena4 (3)
clkena5 (3)
clkena0 (3)
clkena1 (3)
clkena2 (3)
clkena3 (3)
PLL_<#>_CLKOUT3
(1), (2)
PLL_<#>_FBp/CLKOUT1 (1), (2)
PLL_<#>_CLKOUT0p (1), (2)
PLL_<#>_CLKOUT4
PLL_<#>_CLKOUT0n (1), (2)
PLL_<#>_FBn/CLKOUT2 (1), (2)
(1), (2)
Notes to Figure 5–20:
(1) You can feed these clock output pins using any one of the C[9..0], m counters.
(2) The CLKOUT0pand CLKOUT0npins can be either single-ended or differential clock outputs. The CLKOUT1and CLKOUT2pins are
dual-purpose I/O pins that you can use as two single-ended outputs or one differential external feedback input pin. The CLKOUT3and CLKOUT4
pins are two single-ended output pins.
(3) These external clock enable signals are available only when using the ALTCLKCTRL megafunction.
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Chapter 5: Clock Networks and PLLs in Stratix IV Devices
PLLs in Stratix IV Devices
Any of the output counters (C[9..0]on the top and bottom PLLs and C[6..0]on the
left and right PLLs) or the
Mcounter can feed the dedicated external clock outputs, as
shown in Figure 5–20 and Figure 5–21. Therefore, one counter or frequency can drive
all output pins available from a given PLL.
Each left and right PLL supports two clock I/O pins, configured as either two
single-ended I/Os or one differential I/O pair. When using both pins as single-ended
I/Os, one of them can be the clock output while the other pin is the external feedback
input (FB) pin. Therefore, for single-ended I/O standards, the left and right PLLs only
support external feedback mode.
Figure 5–21. External Clock Outputs for Left and Right PLLs
Internal Logic
C0
C1
C2
LEFT/RIGHT
PLLs
C3
C4
C5
C6
m(fbout)
clkena0 (3)
clkena1 (3)
PLL_<L2, L3, R2, R3>_CLKOUT0n/FB_CLKOUT0p (1), (2)
PLL_<L2, L3, R2, R3>_FB_CLKOUT0p/CLKOUT0n (1), (2)
Notes to Figure 5–21:
(1) You can feed these clock output pins using any one of the C[6..0],m counters.
(2) The CLKOUT0pand CLKOUT0npins are dual-purpose I/O pins that you can use as two single-ended outputs or one single-ended output and
one external feedback input pin.
(3) These external clock enable signals are available only when using the ALTCLKCTRL megafunction.
Each pin of a single-ended output pair can either be in-phase or 180° out-of-phase.
The Quartus II software places the NOT gate in the design into the IOE to implement
the 180° phase with respect to the other pin in the pair. The clock output pin pairs
support the same I/O standards as standard output pins (in the top and bottom
banks) as well as LVDS, LVPECL, differential High-Speed Transceiver Logic (HSTL),
and differential SSTL.
f
To determine which I/O standards are supported by the PLL clock input and output
pins, refer to the I/O Features in Stratix IV Devices chapter.
Stratix IV PLLs can also drive out to any regular I/O pin through the GCLK or RCLK
network. You can also use the external clock output pins as user I/O pins if you do
not need external PLL clocking.
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5–27
PLLs in Stratix IV Devices
PLL Control Signals
You can use the pfdena, areset, and lockedsignals to observe and control PLL
operation and resynchronization.
pfdena
Use the pfdenasignal to maintain the most recent locked frequency so your system
has time to store its current settings before shutting down. The pfdenasignal controls
the PFD output with a programmable gate. If you disable PFD, the VCO operates at
its most recent set value of control voltage and frequency, with some long-term drift
to a lower frequency. The PLL continues running even if it goes out-of-lock or the
input clock is disabled. You can use either your own control signal or the control
signals available from the clock switchover circuit (activeclock, clkbad[0], or
clkbad[1]) to control pfdena
.
areset
The aresetsignal is the reset or resynchronization input for each PLL. The device
input pins or internal logic can drive these input signals. When aresetis driven high,
the PLL counters reset, clearing the PLL output and placing the PLL out-of-lock. The
VCO is then set back to its nominal setting. When aresetis driven low again, the PLL
resynchronizes to its input as it re-locks.
You must assert the aresetsignal every time the PLL loses lock to guarantee the
correct phase relationship between the PLL input and output clocks. You can set up
the PLL to automatically reset (self reset) after a loss-of-lock condition using the
Quartus II MegaWizard Plug-In Manager. You must include the aresetsignal in
designs if either of the following conditions is true:
■
PLL reconfiguration or clock switchover is enabled in the design
■
Phase relationships between the PLL input and output clocks must be maintained
after a loss-of-lock condition
1
1
If the input clock to the PLL is not toggling or is unstable after power up, assert the
aresetsignal after the input clock is stable and within specifications.
locked
The lockedsignal output of the PLL indicates that the PLL has locked onto the
reference clock and the PLL clock outputs are operating at the desired phase and
frequency set in the Quartus II MegaWizard Plug-In Manager. The lock detection
circuit provides a signal to the core logic that gives an indication when the feedback
clock has locked onto the reference clock both in phase and frequency.
Altera recommends using the aresetand lockedsignals in your designs to control
and observe the status of your PLL.
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Chapter 5: Clock Networks and PLLs in Stratix IV Devices
PLLs in Stratix IV Devices
Clock Feedback Modes
Stratix IV PLLs support up to six different clock feedback modes. Each mode allows
clock multiplication and division, phase shifting, and programmable duty cycle.
Table 5–9 lists the clock feedback modes supported by the Stratix IV device PLLs.
Table 5–9. Clock Feedback Mode Availability
Availability
Clock Feedback Mode
Top and Bottom PLLs
Left and Right PLLs
Source-synchronous
No-compensation
Normal
Yes
Yes
Yes
Yes
Yes
No
Yes
Yes
Yes
Zero-delay buffer (ZDB)
External feedback (1)
LVDS compensation
Notes to Table 5–9:
Yes
Yes (2)
Yes
(1) The high-bandwidth PLL setting is not supported in external feedback mode.
(2) External feedback mode is supported for single-ended inputs and outputs only on the left and right PLLs.
1
The input and output delays are fully compensated by a PLL only when using the
dedicated clock input pins associated with a given PLL as the clock source. For
example, when using PLL_T1in normal mode, the clock delays from the input pin to
the PLL clock output-to-destination register are fully compensated, provided the
clock input pin is one of the following two pins: CLK14and CLK15. Compensated pins
are only in the same I/O bank as the PLL. When an RCLK or GCLK network drives
the PLL, the input and output delays may not be fully compensated in the Quartus II
software. Another example is when you configure PLL_T2in zero-delay buffer mode
and the PLL input is driven by a dedicated clock input pin, a fully compensated clock
path results in zero-delay between the clock input and one of the output clocks from
the PLL. If the PLL input is instead fed by a non-dedicated input (using the GCLK
network), the output clock may not be perfectly aligned with the input clock.
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5–29
PLLs in Stratix IV Devices
Source Synchronous Mode
If data and clock arrive at the same time on the input pins, the same phase
relationship is maintained at the clock and data ports of any IOE input register.
Figure 5–22 shows an example waveform of the clock and data in this mode. Altera
recommends source synchronous mode for source-synchronous data transfers. Data
and clock signals at the IOE experience similar buffer delays as long as you use the
same I/O standard.
Figure 5–22. Phase Relationship Between Clock and Data in Source-Synchronous Mode
Data pin
PLL
reference clock
at input pin
Data at register
Clock at register
Source-synchronous mode compensates for the delay of the clock network used plus
any difference in the delay between these two paths:
■
Data pin to the IOE register input
■
Clock input pin to the PLL PFD input
The Stratix IV PLL can compensate multiple pad-to-input-register paths, such as a
data bus when it is set to use source-synchronous compensation mode. You can use
the “PLL Compensation” assignment in the Quartus II software Assignment Editor to
select which input pins are used as the PLL compensation targets. You can include
your entire data bus, provided the input registers are clocked by the same output of a
source-synchronous-compensated PLL. In order for the clock delay to be properly
compensated, all of the input pins must be on the same side of the device. The PLL
compensates for the input pin with the longest pad-to-register delay among all input
pins in the compensated bus.
If you do not make the “PLL Compensation” assignment, the Quartus II software
automatically selects all of the pins driven by the compensated output of the PLL as
the compensation target.
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Chapter 5: Clock Networks and PLLs in Stratix IV Devices
PLLs in Stratix IV Devices
Source-Synchronous Mode for LVDS Compensation
The goal of source-synchronous mode is to maintain the same data and clock timing
relationship seen at the pins of the internal serializer/deserializer (SERDES) capture
register, except that the clock is inverted (180° phase shift). Thus, source-synchronous
mode ideally compensates for the delay of the LVDS clock network plus any
difference in delay between these two paths:
■
Data pin-to-SERDES capture register
■
Clock input pin-to-SERDES capture register. In addition, the output counter must
provide the 180° phase shift
Figure 5–23 shows an example waveform of the clock and data in LVDS mode.
Figure 5–23. Phase Relationship Between the Clock and Data in LVDS Mode
Data pin
PLL
reference clock
at input pin
Data at register
Clock at register
No-Compensation Mode
In no-compensation mode, the PLL does not compensate for any clock networks. This
mode provides better jitter performance because the clock feedback into the PFD
passes through less circuitry. Both the PLL internal- and external-clock outputs are
phase-shifted with respect to the PLL clock input. Figure 5–24 shows an example
waveform of the PLL clocks’ phase relationship in no-compensation mode.
Figure 5–24. Phase Relationship Between the PLL Clocks in No Compensation Mode
Phase Aligned
PLL Reference
Clock at the
Input Pin
PLL Clock at the
Register Clock Port (1)
External PLL Clock Outputs (1)
Note to Figure 5–24:
(1) The PLL clock outputs lag the PLL input clocks depending on routine delays.
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5–31
PLLs in Stratix IV Devices
Normal Mode
An internal clock in normal mode is phase-aligned to the input clock pin. The external
clock-output pin has a phase delay relative to the clock input pin if connected in this
mode. The Quartus II software timing analyzer reports any phase difference between
the two. In normal mode, the delay introduced by the GCLK or RCLK network is fully
compensated. Figure 5–25 shows an example waveform of the PLL clocks’ phase
relationship in normal mode.
Figure 5–25. Phase Relationship Between the PLL Clocks in Normal Mode
Phase Aligned
PLL Reference
Clock at the
Input Pin
PLL Clock at the
Register Clock Port
Dedicated PLL Clock Outputs (1)
Note to Figure 5–25:
(1) The external clock output can lead or lag the PLL internal clock signals.
Zero-Delay Buffer (ZDB) Mode
In ZDB mode, the external clock output pin is phase-aligned with the clock input pin
for zero-delay through the device. When using this mode, you must use the same I/O
standard on the input clocks and output clocks to guarantee clock alignment at the
input and output pins. ZDB mode is supported on all Stratix IV PLLs.
When using Stratix IV PLLs in ZDB mode, along with single-ended I/O standards, to
ensure phase alignment between the CLK pin and the external clock output (CLKOUT
pin, you must instantiate a bi-directional I/O pin in the design to serve as the
feedback path connecting the FBOUTand FBINports of the PLL. The PLL uses this
)
bi-directional I/O pin to mimic, and compensate for, the output delay from the clock
output port of the PLL to the external clock output pin. Figure 5–26 shows ZDB mode
in Stratix IV PLLs. When using ZDB mode, you cannot use differential I/O standards
on the PLL clock input or output pins.
1
The bi-directional I/O pin that you instantiate in your design must always be
assigned a single-ended I/O standard.
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Chapter 5: Clock Networks and PLLs in Stratix IV Devices
PLLs in Stratix IV Devices
1
When using ZDB mode, to avoid signal reflection, do not place board traces on the
bi-directional I/O pin.
Figure 5–26. ZDB Mode in Stratix IV PLLs
inclk
÷n
PLL_<#>_CLKOUT#
PLL_<#>_CLKOUT#
÷C0
÷C1
PFD
CP/LF
VCO
fbout
fbin
÷m
bidirectional
I/O pin (1)
Note to Figure 5–26:
(1) The bidirectional I/O pin must be assigned to the PLL_<#>_FB_CLKOUT0ppin for left and right PLLs and to the PLL_<#>_FBp_/CLKOUT1pin for
top and bottom PLLs.
Figure 5–27 shows an example waveform of the PLL clocks’ phase relationship in
ZDB mode.
Figure 5–27. Phase Relationship Between the PLL Clocks in ZDB Mode
Phase Aligned
PLL Reference
Clock at the
Input Pin
PLL Clock at the
Register Clock Port (1)
Dedicated PLL
Clock Outputs
Note to Figure 5–27:
(1) The internal PLL clock output can lead or lag the external PLL clock outputs.
External Feedback Mode
In external feedback mode, the external feedback input pin (fbin) is phase-aligned
with the clock input pin, as shown in Figure 5–28. Aligning these clocks allows you to
remove clock delay and skew between devices. This mode is supported on all
Stratix IV PLLs.
In external feedback mode, the output of the
Mcounter (FBOUT) feeds back to the PLL
fbininput (using a trace on the board) becoming part of the feedback loop. Also, use
one of the dual-purpose external clock outputs as the fbininput pin in this mode.
When using external feedback mode, you must use the same I/O standard on the
input clock, feedback input, and output clocks. Left and right PLLs support this mode
when using single-ended I/O standards only.
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Chapter 5: Clock Networks and PLLs in Stratix IV Devices
5–33
PLLs in Stratix IV Devices
Figure 5–28 shows an example waveform of the phase relationship between the PLL
clocks in external feedback mode.
Figure 5–28. Phase Relationship Between the PLL Clocks in External Feedback Mode
Phase Aligned
PLL Reference
Clock at the
Input Pin
PLL Clock at
the Register
Clock Port (1)
Dedicated PLL
Clock Outputs (1)
fbin Clock Input Pin
Note to Figure 5–28:
(1) The PLL clock outputs can lead or lag the fbinclock input.
Figure 5–29 shows external feedback mode implementation in Stratix IV devices.
Figure 5–29. External Feedback Mode in Stratix IV Devices
inclk
÷n
PLL_<#>_CLKOUT#
PLL_<#>_CLKOUT#
÷C0
÷C1
PFD
CP/LF
VCO
fbout
fbin
÷m
external
board
trace
Clock Multiplication and Division
Each Stratix IV PLL provides clock synthesis for PLL output ports using
M/(N* post-scale counter) scaling factors. The input clock is divided by a pre-scale
factor, n, and is then multiplied by the m feedback factor. The control loop drives the
VCO to match fin (M/N). Each output port has a unique post-scale counter that
divides down the high-frequency VCO. For multiple PLL outputs with different
frequencies, the VCO is set to the least common multiple of the output frequencies
that meets its frequency specifications. For example, if the output frequencies
required from one PLL are 33 and 66 MHz, the Quartus II software sets the VCO to
660 MHz (the least common multiple of 33 and 66 MHz within the VCO range). Then
the post-scale counters scale down the VCO frequency for each output port.
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Chapter 5: Clock Networks and PLLs in Stratix IV Devices
PLLs in Stratix IV Devices
Each PLL has one pre-scale counter,
n, and one multiply counter, m, with a range of
1 to 512 for both and . The counter does not use duty-cycle control because the
m
n
n
only purpose of this counter is to calculate frequency division. There are seven
generic post-scale counters per left or right PLL and ten post-scale counters per top or
bottom PLL that can feed the GCLKs, RCLKs, or external clock outputs. These
post-scale counters range from 1 to 512 with a 50% duty cycle setting. The high- and
low-count values for each counter range from 1 to 256. The sum of the high- and
low-count values chosen for a design selects the divide value for a given counter.
The Quartus II software automatically chooses the appropriate scaling factors
according to the input frequency, multiplication, and division values entered into the
ALTPLL megafunction.
Post-Scale Counter Cascading
Stratix IV PLLs support post-scale counter cascading to create counters larger than
512. This is automatically implemented in the Quartus II software by feeding the
output of one
C
counter into the input of the next
C
counter, as shown in Figure 5–30.
Figure 5–30. Counter Cascading
VCO Output
C0
C1
C2
C3
VCO Output
VCO Output
VCO Output
C4
VCO Output
from preceding
post-scale counter
Cn
VCO Output
(1)
Note to Figure 5–30:
(1) N = 6 or N = 9
When cascading post-scale counters to implement a larger division of the
high-frequency VCO clock, the cascaded counters behave as one counter with the
product of the individual counter settings. For example, if C0 = 40 and C1 = 20, the
cascaded value is C0 × C1 = 800.
1
Post-scale counter cascading is set in the configuration file. You cannot set this using
PLL reconfiguration.
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5–35
PLLs in Stratix IV Devices
Programmable Duty Cycle
The programmable duty cycle allows PLLs to generate clock outputs with a variable
duty cycle. This feature is supported on the PLL post-scale counters. The duty-cycle
setting is achieved by a low and high time-count setting for the post-scale counters. To
determine duty cycle choices, the Quartus II software uses the frequency input and
the required multiply or divide rate. The post-scale counter value determines the
precision of the duty cycle. Precision is defined as 50% divided by the post-scale
counter value. For example, if the C0counter is 10, steps of 5% are possible for
duty-cycle choices from 5% to 90%.
If the PLL is in external feedback mode, set the duty cycle for the counter driving the
fbinpin to 50%. Combining the programmable duty cycle with programmable phase
shift allows the generation of precise non-overlapping clocks.
Programmable Phase Shift
Use phase shift to implement a robust solution for clock delays in Stratix IV devices.
Implement phase shift by using a combination of the VCO phase output and the
counter starting time. A combination of VCO phase output and counter starting time
is the most accurate method of inserting delays because it is only based on counter
settings, which are independent of process, voltage, and temperature (PVT).
You can phase-shift the output clocks from the Stratix IV PLLs in either of these two
resolutions:
■
Fine resolution using VCO phase taps
■
Coarse resolution using counter starting time
Implement fine-resolution phase shifts by allowing any of the output counters
C[n..0])or the counter to use any of the eight phases of the VCO as the reference
(
m
clock. This allows you to adjust the delay time with a fine resolution. Equation 5–1
shows the minimum delay time that you can insert using this method.
Equation 5–1. Fine-Resolution Phase Shift
1
8
1
N
Φfine
=
TVCO
=
=
8fVCO 8MfREF
where fREF is the input reference clock frequency.
For example, if fREF is 100 MHz, N is 1, and M is 8, then fVCO is 800 MHz and fine
equals 156.25 ps. This phase shift is defined by the PLL operating frequency, which is
governed by the reference clock frequency and the counter settings.
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PLLs in Stratix IV Devices
Equation 5–2 shows the coarse-resolution phase shifts are implemented by delaying
the start of the counters for a predetermined number of counter clocks.
Equation 5–2. Coarse-Resolution Phase Shift
(C − 1)N
MfREF
C − 1
fVco
Φcoarse
=
=
where C is the count value set for the counter delay time (this is the initial setting in
the “PLL usage” section of the compilation report in the Quartus II software). If the
initial value is 1, C – 1 = 0° phase shift.
Figure 5–31 shows an example of phase-shift insertion with fine resolution using the
VCO phase-taps method. The eight phases from the VCO are shown and labeled for
reference. For this example, CLK0is based on the 0phasefrom the VCO and has the C
value for the counter set to one. The CLK1signal is divided by four, two VCO clocks
for high time and two VCO clocks for low time. CLK1is based on the 135° phase tap
from the VCO and also has the C value for the counter set to one. In this case, the two
clocks are offset by 3 FINE. CLK2is based on the 0phasefrom the VCO but has the
C value for the counter set to three. This arrangement creates a delay of 2 COARSE
(two complete VCO periods).
Figure 5–31. Delay Insertion Using VCO Phase Output and Counter Delay Time
1/8 t
t
VCO
VCO
0
45
90
135
180
225
270
315
CLK0
t
d0-1
CLK1
CLK2
t
d0-2
You can use coarse- and fine-phase shifts to implement clock delays in Stratix IV
devices.
Stratix IV devices support dynamic phase-shifting of VCO phase taps only. You can
reconfigure the phase shift any number of times. Each phase shift takes about one
SCANCLKcycle, allowing you to implement large phase shifts quickly.
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PLLs in Stratix IV Devices
Programmable Bandwidth
Stratix IV PLLs provide advanced control of the PLL bandwidth using the PLL loop’s
programmable characteristics, including loop filter and charge pump.
Background
PLL bandwidth is the measure of the PLL’s ability to track the input clock and its
associated jitter. The closed-loop gain 3 dB frequency in the PLL determines PLL
bandwidth. Bandwidth is approximately the unity gain point for open loop PLL
response. As Figure 5–32 shows, these points correspond to approximately the same
frequency. Stratix IV PLLs provide three bandwidth settings—low, medium (default),
and high.
Figure 5–32. Open- and Closed-Loop Response Bode Plots
Open-Loop Reponse Bode Plot
Increasing the PLL's
bandwidth in effect pushes
the open loop response out.
0 dB
Gain
Frequency
Closed-Loop Reponse Bode Plot
Gain
Frequency
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Chapter 5: Clock Networks and PLLs in Stratix IV Devices
PLLs in Stratix IV Devices
A high-bandwidth PLL provides a fast lock time and tracks jitter on the reference
clock source, passing it through to the PLL output. A low-bandwidth PLL filters out
reference clock jitter but increases lock time. Stratix IV PLLs allow you to control the
bandwidth over a finite range to customize the PLL characteristics for a particular
application. The programmable bandwidth feature in Stratix IV PLLs benefits
applications requiring clock switchover.
A high-bandwidth PLL can benefit a system that must accept a spread-spectrum clock
signal. Stratix IV PLLs can track a spread-spectrum clock by using a high-bandwidth
setting. Using a low-bandwidth setting in this case could cause the PLL to filter out
the jitter on the input clock.
A low-bandwidth PLL can benefit a system using clock switchover. When clock
switchover occurs, the PLL input temporarily stops. A low-bandwidth PLL reacts
more slowly to changes on its input clock and takes longer to drift to a lower
frequency (caused by input stopping) than a high-bandwidth PLL.
Implementation
Traditionally, external components such as the VCO or loop filter control a PLL’s
bandwidth. Most loop filters consist of passive components such as resistors and
capacitors that take up unnecessary board space and increase cost. With Stratix IV
PLLs, all the components are contained within the device to increase performance and
decrease cost.
When you specify the bandwidth setting (low, medium, or high) in the ALTPLL
MegaWizardPlug-in Manager, the Quartus II software automatically sets the
corresponding charge pump and loop filter (Icp, R, C) values to achieve the desired
bandwidth range.
Figure 5–33 shows the loop filter and components that you can set using the
Quartus II software. The components are the loop filter resistor, R, the high frequency
capacitor, Ch, and the charge pump current, IUP or IDN
.
Figure 5–33. Loop Filter Programmable Components
IUP
PFD
R
C
Ch
IDN
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PLLs in Stratix IV Devices
Spread-Spectrum Tracking
Stratix IV devices can accept a spread-spectrum input with typical modulation
frequencies. However, the device cannot automatically detect that the input is a
spread-spectrum signal. Instead, the input signal looks like deterministic jitter at the
input of the PLL. Stratix IV PLLs can track a spread-spectrum input clock as long as it
is within input-jitter tolerance specifications. Stratix IV devices cannot internally
generate spread-spectrum clocks.
Clock Switchover
The clock switchover feature allows the PLL to switch between two reference input
clocks. Use this feature for clock redundancy or for a dual-clock domain application
such as in a system that turns on the redundant clock if the previous clock stops
running. The design can perform clock switchover automatically when the clock is no
longer toggling or based on a user control signal, clkswitch
.
The following clock switchover modes are supported in Stratix IV PLLs:
■
■
Automatic switchover—The clock sense circuit monitors the current reference
clock and if it stops toggling, automatically switches to the other inclk0or inclk1
clock.
Manual clock switchover—Clock switchover is controlled using the clkswitch
signal. When the clkswitchsignal goes from logic low to logic high, and stays
high for at least three clock cycles, the reference clock to the PLL is switched from
inclk0to inclk1, or vice-versa.
■
Automatic switchover with manual override—This mode combines automatic
switchover and manual clock switchover. When the clkswitchsignal goes high, it
overrides the automatic clock switchover function. As long as the clkswitchsignal
is high, further switchover action is blocked.
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Chapter 5: Clock Networks and PLLs in Stratix IV Devices
PLLs in Stratix IV Devices
Stratix IV PLLs support a fully configurable clock switchover capability. Figure 5–34
shows a block diagram of the automatic switchover circuit built into the PLL. When
the current reference clock is not present, the clock sense block automatically switches
to the backup clock for PLL reference. The clock switchover circuit also sends out
three status signals—clkbad[0], clkbad[1], and activeclock—from the PLL to
implement a custom switchover circuit in the logic array. You can select a clock source
as the backup clock by connecting it to the inclk1port of the PLL in your design.
Figure 5–34. Automatic Clock Switchover Circuit Block Diagram
clkbad[0]
clkbad[1]
activeclock
Switchover
State
Machine
Clock
Sense
clksw
Clock Switch
Control Logic
clkswitch
inclk0
n Counter
PFD
inclk1
refclk
muxout
fbclk
Automatic Clock Switchover
Use the switchover circuitry to automatically switch between inclk0and inclk1
when the current reference clock to the PLL stops toggling. For example, in
applications that require a redundant clock with the same frequency as the reference
clock, the switchover state machine generates a signal (clksw) that controls the
multiplexer select input, as shown in Figure 5–34. In this case, inclk1becomes the
reference clock for the PLL. When using automatic switchover mode, you can switch
back and forth between inclk0and inclk1any number of times when one of the two
clocks fails and the other clock is available.
When using automatic clock switchover mode, the following requirements must be
satisfied:
■
Both clock inputs must be running
■
The period of the two clock inputs can differ by no more than 100% (2×)
If the current clock input stops toggling while the other clock is also not toggling,
switchover is not initiated and the clkbad[0..1]signals are not valid. Also, if both
clock inputs are not the same frequency, but their period difference is within 100%,
the clock sense block detects when a clock stops toggling, but the PLL may lose lock
after the switchover is completed and needs time to re-lock.
1
Altera recommends resetting the PLL using the aresetsignal to maintain the phase
relationships between the PLL input and output clocks when using clock switchover.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
5–41
PLLs in Stratix IV Devices
In automatic switchover mode, the clkbad[0]and clkbad[1]signals indicate the
status of the two clock inputs. When they are asserted, the clock sense block has
detected that the corresponding clock input has stopped toggling. These two signals
are not valid if the frequency difference between inclk0and inclk1is greater than
20%.
The activeclocksignal indicates which of the two clock inputs (inclk0or inclk1) is
being selected as the reference clock to the PLL. When the frequency difference
between the two clock inputs is more than 20%, the activeclocksignal is the only
valid status signal.
Figure 5–35 shows an example waveform of the switchover feature when using
automatic switchover mode. In this example, the inclk0signal is stuck low. After the
inclk0signal is stuck at low for approximately two clock cycles, the clock sense
circuitry drives the clkbad[0]signal high. Also, because the reference clock signal is
not toggling, the switchover state machine controls the multiplexer through the
clkswitchsignal to switch to the backup clock, inclk1
.
Figure 5–35. Automatic Switchover After Loss of Clock Detection
inclk0
inclk1
(1)
muxout
clkbad0
clkbad1
activeclock
Note to Figure 5–35:
(1) Switchover is enabled on the falling edge of inclk0or inclk1, depending on which clock is available. In this figure,
switchover is enabled on the falling edge of inclk1
.
Manual Override
In automatic switchover with manual override mode, you can use the clkswitch
input for user- or system-controlled switch conditions. You can use this mode for
same-frequency switchover, or to switch between inputs of different frequencies. For
example, if inclk0is 66 MHz and inclk1is 200 MHz, you must control switchover
using clkswitchbecause the automatic clock-sense circuitry cannot monitor clock
input (inclk0and inclk1) frequencies with a frequency difference of more than 100%
(2×). This feature is useful when the clock sources originate from multiple cards on
the backplane, requiring a system-controlled switchover between the frequencies of
operation. You must choose the backup clock frequency and set the
m, n, c, and k
counters accordingly so the VCO operates within the recommended operating
frequency range of 600 to 1,600 MHz. The ALTPLL MegaWizard Plug-in Manager
notifies you if a given combination of inclk0and inclk1frequencies cannot meet this
requirement.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
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Chapter 5: Clock Networks and PLLs in Stratix IV Devices
PLLs in Stratix IV Devices
Figure 5–36 shows a clock switchover waveform controlled by clkswitch. In this case,
both clock sources are functional and inclk0is selected as the reference clock;
clkswitchgoes high, which starts the switchover sequence. On the falling edge of
inclk0, the counter’s reference clock, muxout, is gated off to prevent clock glitching.
On the falling edge of inclk1, the reference clock multiplexer switches from inclk0to
inclk1as the PLL reference and the activeclocksignal changes to indicate which
clock is currently feeding the PLL.
Figure 5–36. Clock Switchover Using the clkswitch (Manual) Control (Note 1)
inclk0
inclk1
muxout
clkswitch
activeclock
clkbad0
clkbad1
Note to Figure 5–36:
(1) To initiate a manual clock switchover event, both inclk0and inclk1must be running when the clkswitchsignal
goes high.
In automatic override with manual switchover mode, the activeclocksignal mirrors
the clkswitchsignal. As both clocks are still functional during the manual switch,
neither clkbadsignal goes high. Because the switchover circuit is positive-edge
sensitive, the falling edge of the clkswitchsignal does not cause the circuit to switch
back from inclk1to inclk0. When the clkswitchsignal goes high again, the process
repeats. clkswitchand automatic switch only work if the clock being switched to is
available. If the clock is not available, the state machine waits until the clock is
available.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
5–43
PLLs in Stratix IV Devices
Manual Clock Switchover
In manual clock switchover mode, the clkswitchsignal controls whether inclk0or
inclk1is selected as the input clock to the PLL. By default, inclk0is selected. A
low-to-high transition on clkswitchand clkswitchbeing held high for at least three
inclkcycles initiates a clock switchover event. You must bring clkswitchback low
again in order to perform another switchover event in the future. If you do not require
another switchover event in the future, you can leave clkswitchin a logic high state
after the initial switch. Pulsing clkswitchhigh for at least three inclkcycles performs
another switchover event. If inclk0and inclk1are different frequencies and are
always running, the clkswitchminimum high time must be greater than or equal to
three of the slower frequency inclk0or inclk1cycles. Figure 5–37 shows a block
diagram of the manual switchover circuit.
Figure 5–37. Manual Clock Switchover Circuitry in Stratix IV PLLs
clkswitch
Clock Switch
Control Logic
inclk0
n Counter
PFD
inclk1
muxout
refclk
fbclk
f
For more information about PLL software support in the Quartus II software, refer to
the Phase-Locked Loop (ALTPLL) Megafunction User Guide.
Guidelines
When implementing clock switchover in Stratix IV PLLs, use the following
guidelines:
■
Automatic clock switchover requires that the inclk0and inclk1frequencies be
within 100% (2×) of each other. Failing to meet this requirement causes the
clkbad[0]and clkbad[1]signals to not function properly.
■
When using manual clock switchover, the difference between inclk0and inclk1
can be more than 100% (2×). However, differences in frequency, phase, or both, of
the two clock sources will likely cause the PLL to lose lock. Resetting the PLL
ensures that the correct phase relationships are maintained between the input and
output clocks.
1
Both inclk0and inclk1must be running when the clkswitchsignal goes
high to initiate the manual clock switchover event. Failing to meet this
requirement causes the clock switchover to not function properly.
■
Applications that require a clock switchover feature and a small frequency drift
must use a low-bandwidth PLL. The low-bandwidth PLL reacts more slowly than
a high-bandwidth PLL to reference input clock changes. When switchover
happens, a low-bandwidth PLL propagates the stopping of the clock to the output
more slowly than a high-bandwidth PLL. However, be aware that the
low-bandwidth PLL also increases lock time.
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Chapter 5: Clock Networks and PLLs in Stratix IV Devices
PLLs in Stratix IV Devices
■
■
After a switchover occurs, there may be a finite resynchronization period for the
PLL to lock onto a new clock. The exact amount of time it takes for the PLL to
re-lock depends on the PLL configuration.
The phase relationship between the input clock to the PLL and the output clock
from the PLL is important in your design. Assert aresetfor at least 10 ns after
performing a clock switchover. Wait for the locked signal to go high and be stable
before re-enabling the output clocks from the PLL.
■
Figure 5–38 shows how the VCO frequency gradually decreases when the current
clock is lost and then increases as the VCO locks on to the backup clock.
Figure 5–38. VCO Switchover Operating Frequency
Primary Clock Stops Running
Switchover Occurs
VCO Tracks Secondary Clock
ΔF
vco
■
Disable the system during clock switchover if it is not tolerant of frequency
variations during the PLL resynchronization period. You can use the clkbad[0]
and clkbad[1]status signals to turn off the PFD (PFDENA
= 0) so the VCO
maintains its most recent frequency. You can also use the state machine to switch
over to the secondary clock. When the PFD is re-enabled, output clock-enable
signals (clkena) can disable clock outputs during the switchover and
resynchronization period. When the lock indication is stable, the system can
re-enable the output clocks.
PLL Reconfiguration
PLLs use several divide counters and different VCO phase taps to perform frequency
synthesis and phase shifts. In Stratix IV PLLs, you can reconfigure both the counter
settings and phase-shift the PLL output clock in real time. You can also change the
charge pump and loop-filter components, which dynamically affects PLL bandwidth.
You can use these PLL components to update the output-clock frequency and PLL
bandwidth and to phase-shift in real time, without reconfiguring the entire Stratix IV
device.
The ability to reconfigure the PLL in real time is useful in applications that operate at
multiple frequencies. It is also useful in prototyping environments, allowing you to
sweep PLL output frequencies and adjust the output-clock phase dynamically. For
instance, a system generating test patterns is required to generate and transmit
patterns at 75 or 150 MHz, depending on the requirements of the device under test.
Reconfiguring the PLL components in real time allows you to switch between two
such output frequencies within a few microseconds. You can also use this feature to
adjust clock-to-out (tCO) delays in real time by changing the PLL output clock phase
shift. This approach eliminates the need to regenerate a configuration file with the
new PLL settings.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
5–45
PLLs in Stratix IV Devices
PLL Reconfiguration Hardware Implementation
The following PLL components are reconfigurable in real time:
■
■
■
■
■
Pre-scale counter (
Feedback counter (
Post-scale output counters (C0
Post VCO Divider (
Dynamically adjust the charge-pump current (Icp) and loop-filter components
) to facilitate reconfiguration of the PLL bandwidth
Figure 5–39 shows how you can dynamically adjust the PLL counter settings by
shifting their new settings into a serial shift-register chain or scan chain. Serial data is
n)
m
)
-
C9)
K
)
(R, C
input to the scan chain using the scandataport. Shift registers are clocked by scanclk
The maximum scanclkfrequency is 100 MHz. Serial data is shifted through the scan
chain as long as the scanclkenasignal stays asserted. After the last bit of data is
.
clocked, asserting the configupdatesignal for at least one scanclkclock cycle causes
the PLL configuration bits to be synchronously updated with the data in the scan
registers.
Figure 5–39. PLL Reconfiguration Scan Chain (Note 1)
from m counter
from n counter
PFD
LF/K/CP (3)
VCO
scandata
scanclkena
configupdate
inclk
/Ci (2)
/Ci-1
/m
/C2
/C1
/C0
/n
scandataout
scandone
scanclk
Notes to Figure 5–39:
(1) Stratix IV left and right PLLs support C0-C6counters.
(2) i = 6 or i = 9.
(3) This figure shows the corresponding scan register for the
counter is physically located after the VCO.
Kcounter in between the scan registers for the charge pump and loop filter. The K
1
The counter settings are updated synchronously to the clock frequency of the
individual counters. Therefore, all counters are not updated simultaneously.
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Chapter 5: Clock Networks and PLLs in Stratix IV Devices
PLLs in Stratix IV Devices
Table 5–10 lists how these signals can be driven by the PLD logic array or I/O pins.
Table 5–10. Real-Time PLL Reconfiguration Ports
PLL Port Name
Description
Source
Destination
Serial input data stream to scan
chain.
scandata
Logic array or I/O pin
PLL reconfiguration circuit
Serial clock input signal. This clock
can be free running.
scanclk
GCLK, RCLK or I/O pins
Logic array or I/O pin
Logic array or I/O pin
PLL reconfiguration circuit
PLL reconfiguration circuit
PLL reconfiguration circuit
Enables scanclkand allows the
scandatato be loaded in the scan
chain. Active high.
scanclkena
configupdate
Writes the data in the scan chain to
the PLL. Active high.
Indicates when the PLL has finished
reprogramming. A rising edge
indicates the PLL has begun
reprogramming. A falling edge
indicates the PLL has finished
reprogramming.
scandone
PLL reconfiguration circuit
PLL reconfiguration circuit
Logic array or I/O pins
Logic array or I/O pins
Used to output the contents of the
scan chain.
scandataout
To reconfigure the PLL counters, follow these steps:
1. The scanclkenasignal is asserted at least one scanclkcycle prior to shifting in the
first bit of scandata D0).
2. Serial data (scandata) is shifted into the scan chain on the second rising edge of
(
scanclk
.
3. After all 234 bits (top and bottom PLLs) or 180 bits (left and right PLLs) have been
scanned into the scan chain, the scanclkenasignal is de-asserted to prevent
inadvertent shifting of bits in the scan chain.
4. The configupdatesignal is asserted for one scanclkcycle to update the PLL
counters with the contents of the scan chain.
5. The scandonesignal goes high, indicating the PLL is being reconfigured. A falling
edge indicates the PLL counters have been updated with new settings.
6. Reset the PLL using the aresetsignal if you make any changes to the
post-scale output C counters or to the Icp , or settings.
M, N, or
,
R
C
7. You can repeat steps 1-5 to reconfigure the PLL any number of times.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
5–47
PLLs in Stratix IV Devices
Figure 5–40 shows a functional simulation of the PLL reconfiguration feature.
Figure 5–40. PLL Reconfiguration Waveform
(LSB)
D0
(MSB)
Dn
SCANDATA
SCANCLK
SCANCLKENA
D0_old
Dn_old
Dn
SCANDATAOUT
CONFIGUPDATE
SCANDONE
ARESET
1
When you reconfigure the counter clock frequency, you cannot reconfigure the
corresponding counter phase shift settings using the same interface. Instead,
reconfigure the phase shifts in real time using the dynamic phase shift reconfiguration
interface. If you reconfigure the counter frequency, but wish to keep the same
non-zero phase shift setting (for example, 90°) on the clock output, you must
reconfigure the phase shift immediately after reconfiguring the counter clock
frequency.
Post-Scale Counters (C0 to C9)
You can reconfigure the multiply or divide values and duty cycle of post-scale
counters in real time. Each counter has an 8-bit high-time setting and an 8-bit
low-time setting. The duty cycle is the ratio of output high- or low-time to the total
cycle time, which is the sum of the two. Additionally, these counters have two control
bits, rbypass, for bypassing the counter, and rselodd, to select the output clock duty
cycle.
When the rbypassbit is set to 1, it bypasses the counter, resulting in a divide by 1.
When the rbypassbit is set to 0, the high- and low-time counters are added to
compute the effective division of the VCO output frequency. For example, if the
post-scale divide factor is 10, the high- and low-count values can be set to 5 and 5,
respectively, to achieve a 50% - 50% duty cycle. The PLL implements this duty cycle
by transitioning the output clock from high to low on the rising edge of the VCO
output clock. However, a 4 and 6 setting for the high- and low-count values,
respectively, produces an output clock with a 40% - 60% duty cycle.
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Chapter 5: Clock Networks and PLLs in Stratix IV Devices
PLLs in Stratix IV Devices
The rseloddbit indicates an odd divide factor for the VCO output frequency along
with a 50% duty cycle. For example, if the post-scale divide factor is 3, the high- and
low-time count values could be set to 2 and 1, respectively, to achieve this division.
This implies a 67% - 33% duty cycle. If you need a 50% - 50% duty cycle, you can set
the rseloddcontrol bit to 1 to achieve this duty cycle despite an odd division factor.
The PLL implements this duty cycle by transitioning the output clock from high to
low on a falling edge of the VCO output clock. When you set rselodd= 1, you
subtract 0.5 cycles from the high time and you add 0.5 cycles to the low time. For
example:
■
■
■
High-time count = 2 cycles
Low-time count = 1 cycle
rselodd= 1 effectively equals:
■
■
■
High-time count = 1.5 cycles
Low-time count = 1.5 cycles
Duty cycle = (1.5/3) % high-time count and (1.5/3) % low-time count
Scan Chain Description
The length of the scan chain varies for different Stratix IV PLLs. The top and bottom
PLLs have ten post-scale counters and a 234-bit scan chain, while the left and right
PLLs have seven post-scale counters and a 180-bit scan chain. Table 5–11 lists the
number of bits for each component of a Stratix IV PLL.
Table 5–11. Top and Bottom PLL Reprogramming Bits (Part 1 of 2)
Number of Bits
Block Name
Total
Counter
16
16
16
16
16
16
16
16
16
16
16
16
0
Other (1)
C9 (2)
2
2
2
2
2
2
2
2
2
2
2
2
3
0
18
18
18
18
18
18
18
18
18
18
18
18
3
C8
C7
C6 (3)
C5
C4
C3
C2
C1
C0
M
N
Charge Pump Current
VCO Post-Scale divider (
K)
1
1
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February 2011 Altera Corporation
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
5–49
PLLs in Stratix IV Devices
Table 5–11. Top and Bottom PLL Reprogramming Bits (Part 2 of 2)
Number of Bits
Block Name
Total
Counter
Other (1)
Loop Filter Capacitor (4)
Loop Filter Resistor
Unused CP/LF
0
0
2
5
2
5
0
7
7
Total number of bits
Notes to Table 5–11:
—
—
234
(1) Includes two control bits, rbypass, for bypassing the counter, and rselodd, to select the output clock duty
cycle.
(2) The LSB for the C9 low-count value is the first bit shifted into the scan chain for the top and bottom PLLs.
(3) The LSB for the C6 low-count value is the first bit shifted into the scan chain for the left and right PLLs.
(4) The MSB for the loop filter is the last bit shifted into the scan chain.
Table 5–11 lists the scan chain order of PLL components for the top and bottom PLLs,
which have 10 post-scale counters. The order of bits is the same for the left and right
PLLs, but the reconfiguration bits start with the C6 post-scale counter.
Figure 5–41 shows the scan-chain order of PLL components for the top and bottom
PLLs.
Figure 5–41. Scan-Chain Order of PLL Components for Top and Bottom PLLs (Note 1)
DATAIN
K
LF
CP
M
N
C3
C0
C1
LSB
MSB
C6
C7
C4
C5
C2
DATAOUT
C8
C9
Note to Figure 5–41:
(1) Left and right PLLs have the same scan-chain order. The post-scale counters end at C6.
Figure 5–42 shows the scan-chain bit-order sequence for post-scale counters in all
Stratix IV PLLs.
Figure 5–42. Scan-Chain Bit-Order Sequence for Post-Scale Counters in Stratix IV PLLs
HB
6
HB
5
HB
1
HB
3
HB
7
HB
0
HB
2
HB
4
DATAIN
rbypass
rselodd
LB
5
LB
0
LB
1
LB
2
LB
3
LB
4
LB
6
LB
7
DATAOUT
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Chapter 5: Clock Networks and PLLs in Stratix IV Devices
PLLs in Stratix IV Devices
Charge Pump and Loop Filter
You can reconfigure the charge-pump and loop-filter settings to update the PLL
bandwidth in real time.
Table 5–12 lists the possible settings for charge pump current (Icp) values for
Stratix IV PLLs.
Table 5–12. Charge Pump Current Bit Settings
CP[2]
CP[1]
CP[0]
Decimal Value for Setting
0
0
0
1
0
0
1
1
0
1
1
1
0
1
3
7
Table 5–13 lists the possible settings for loop-filter resistor (
PLLs.
R
) values for Stratix IV
Table 5–13. Loop-Filter Resistor Bit Settings
LFR[4]
LFR[3]
LFR[2]
LFR[1]
LFR[0]
Decimal Value for Setting
0
0
0
0
1
1
1
1
1
1
1
0
0
0
1
0
0
0
1
1
1
1
0
0
1
0
0
0
1
0
0
1
1
0
1
0
0
0
1
0
0
1
0
1
0
1
0
0
0
1
0
0
1
0
0
0
3
4
8
16
19
20
24
27
28
30
Table 5–14 lists the possible settings for loop-filter capacitor (
PLLs.
C) values for Stratix IV
Table 5–14. Loop-Filter Capacitor Bit Settings
LFC[1]
LFC[0]
Decimal Value for Setting
0
0
1
0
1
1
0
1
3
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February 2011 Altera Corporation
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
5–51
PLLs in Stratix IV Devices
Bypassing a PLL
Bypassing a PLL counter results in a multiply (
counters) factor of one.
mcounter) or a divide (nand C0to C9
Table 5–15 lists the settings for bypassing the counters in Stratix IV PLLs.
Table 5–15. PLL Counter Settings
PLL Scan Chain Bits [0..8] Settings
LSB
MSB
1 (1) PLL counter bypassed
PLL counter not bypassed because
Description
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0 (1)
bit 8 (MSB) is set to 0
Note to Table 5–15:
(1) Counter-bypass bit.
1
To bypass any of the PLL counters, set the bypass bit to 1. The values on the other bits
are ignored. To bypass the VCO post-scale counter (K), set the corresponding bit to 0.
Dynamic Phase-Shifting
The dynamic phase-shifting feature allows the output phases of individual PLL
outputs to be dynamically adjusted relative to each other and to the reference clock,
without having to send serial data through the scan chain of the corresponding PLL.
This feature simplifies the interface and allows you to quickly adjust the clock-to-out
(
t
CO) delays by changing the output clock phase-shift in real time. This adjustment is
achieved by incrementing or decrementing the VCO phase-tap selection to a given
counter or to the counter. The phase is shifted by 1/8 of the VCO frequency at a
C
M
time. The output clocks are active during this phase-reconfiguration process.
Table 5–16 lists the control signals that are used for dynamic phase-shifting.
Table 5–16. Dynamic Phase-Shifting Control Signals (Part 1 of 2)
Signal Name
Description
Source
Destination
Counter select. Four bits decoded to
select either the
Mor one of the C
PHASECOUNTERSELECT counters for phase adjustment. One
Logic array or I/O pins PLL reconfiguration circuit
[3..0]
address maps to select all
This signal is registered in the PLL on
the rising edge of SCANCLK
Ccounters.
.
Selects dynamic phase shift direction;
1 = UP; 0 = DOWN. Signal is registered
in the PLL on the rising edge of
PHASEUPDOWN
PHASESTEP
Logic array or I/O pin PLL reconfiguration circuit
Logic array or I/O pin PLL reconfiguration circuit
SCANCLK
.
Logic high enables dynamic phase
shifting.
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PLLs in Stratix IV Devices
Table 5–16. Dynamic Phase-Shifting Control Signals (Part 2 of 2)
Signal Name
Description
Source
Destination
Free running clock from the core used
in combination with PHASESTEPto
enable and disable dynamic phase
shifting. Shared with SCANCLKfor
dynamic reconfiguration.
SCANCLK
GCLK, RCLK or I/O pin PLL reconfiguration circuit
When asserted, this indicates to
core-logic that the phase adjustment is
complete and the PLL is ready to act
on a possible second adjustment
pulse. Asserts based on internal PLL
timing. De-asserts on the rising edge
PLL reconfiguration
Logic array or I/O pins
circuit
PHASEDONE
of SCANCLK
.
Table 5–17 lists the PLL counter selection based on the corresponding
PHASECOUNTERSELECTsetting.
Table 5–17. Phase Counter Select Mapping
PHASECOUNTERSELECT[3]
[2]
0
0
0
0
1
1
1
1
0
0
0
0
[1]
0
0
1
1
0
0
1
1
0
0
1
1
[0]
0
1
0
1
0
1
0
1
0
1
0
1
Selects
0
0
0
0
0
0
0
0
1
1
1
1
All Output Counters
M
Counter
C0Counter
C1Counter
C2Counter
C3Counter
C4Counter
C5Counter
C6Counter
C7Counter
C8Counter
C9Counter
To perform one dynamic phase-shift, follow these steps:
1. Set PHASEUPDOWNand PHASECOUNTERSELECTas required.
2. Assert PHASESTEP. Each PHASESTEPpulse enables one phase shift. The PHASESTEP
pulses must be at least one scanclkcycle apart.
3. Wait for PHASEDONEto go low.
4. De-assert PHASESTEP.
5. Wait for PHASEDONEto go high.
6. Repeat steps 1-5 as many times as required to perform multiple phase-shifts.
All signals are synchronous to SCANCLKand are latched on the SCANCLKedges and
must meet tsu/th requirements with respect to SCANCLKedges.
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PLLs in Stratix IV Devices
1
You can repeat dynamic phase-shifting indefinitely. For example, in a design where
the VCO frequency is set to 1000 MHz and the output clock frequency is 100 MHz,
performing 40 dynamic phase shifts (each one yields 125 ps phase shift) results in
shifting the output clock by 180°, which is a phase shift of 5 ns.
The PHASESTEPsignal is latched on the negative edge of SCANCLK. In Figure 5–43, this is
shown by the second SCANCLKfalling edge. PHASESTEPmust stay high for at least two
SCANCLKcycles. On the second SCANCLKrising edge after PHASESTEPis latched (the
fourth SCANCLKrising edge in Figure 5–43), the values of PHASEUPDOWNand
PHASECOUNTERSELECTare latched and the PLL starts dynamic phase-shifting for the
specified counter(s) and in the indicated direction. On the fourth SCANCLKrising edge,
PHASEDONEgoes from high to low and remains low until the PLL finishes dynamic
phase-shifting. You can perform another dynamic phase shift after the PHASEDONE
signal goes from low to high.
Figure 5–43. Dynamic Phase Shifting Waveform
SCANCLK
PHASESTEP
PHASEUPDOWN
PHASECOUNTERSELECT
PHASEDONE
a
b
c
d
PHASEDONE goes low synchronous with SCANCLK
t
CONFIGPHASE
Depending on the VCO and SCANCLKfrequencies, PHASEDONElow time may be greater
than or less than one SCANCLKcycle.
After PHASEDONEgoes from low to high, you can perform another dynamic phase shift.
PHASESTEPpulses must be at least one SCANCLKcycle apart.
f
For information about the ALTPLL_RECONFIG MegaWizard Plug-In Manager, refer
to the Phase-Locked Loops Reconfiguration (ALTPLL_RECONFIG) Megafunction User
Guide.
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5–54
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
PLLs in Stratix IV Devices
PLL Specifications
f
For information about PLL timing specifications, refer to the DC and Switching
Characteristics for Stratix IV Devices chapter.
Document Revision History
Table 5–18 lists the revision history for this chapter.
Table 5–18. Document Revision History (Part 1 of 2)
Date
Version
Changes
■ Updated the “Clock Input Connections to the PLLs”,“PLL Clock I/O Pins”, “Clock
Feedback Modes”, and “Clock Switchover” sections.
■ Updated Table 5–4 and Table 5–8.
■ Updated Figure 5–26, Figure 5–40, and Figure 5–43.
■ Applied new template.
February 2011
3.2
■ Minor text edits.
■ Updated Table 5–3.
■ Updated notes to Figure 5–2, Figure 5–3, Figure 5–4, and Figure 5–9.
■ Added a note to Table 5–5 and Table 5–6.
■ Added two notes to Table 5–4.
■ Updated Figure 5–43.
March 2010
3.1
■ Updated the “Dynamic Phase-Shifting” section.
■ Minor text edits.
■ Updated Table 5–1 and Table 5–7.
■ Updated “Clock Networks in Stratix IV Devices”, “Periphery Clock Networks”, and
“Cascading PLLs” sections.
■ Added Figure 5–5, Figure 5–6, Figure 5–7, Figure 5–8, and Figure 5–9.
■ Added “Clock Sources Per Region” section.
November 2009
3.0
■ Updated Figure 5–40.
■ Removed EP4SE110, EP4SE290, and EP4SE680 devices.
■ Added EP4S40G2, EP4S100G2, EP4S40G5, EP4S100G3, EP4S100G4, EP4S100G5, and
EP4SE820 devices.
■ Updated Table 5–7.
■ Updated the “PLL Reconfiguration Hardware Implementation” and “Zero-Delay Buffer
Mode” sections.
June 2009
April 2009
2.3
2.2
■ Added introductory sentences to improve search ability.
■ Removed the Conclusion section.
■ Minor text edits.
■ Updated Table 5–1 and Table 5–7.
■ Updated Figure 5–3 and Figure 5–4.
■ Updated the “Periphery Clock Networks” section.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
5–55
PLLs in Stratix IV Devices
Table 5–18. Document Revision History (Part 2 of 2)
Date
Version
Changes
■ Updated Table 5–7.
■ Updated Figure 5–34.
■ Updated “Guidelines” section.
March 2009
2.1
■ Removed “Referenced Documents” section.
■ Updated Table 5–7.
■ Updated Note 1 of Figure 5–10.
■ Updated Figure 5–15.
November 2008
May 2008
2.0
1.0
■ Updated Figure 5–20.
■ Added Figure 5–21.
■ Made minor editorial changes.
Initial release.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
5–56
Chapter 5: Clock Networks and PLLs in Stratix IV Devices
PLLs in Stratix IV Devices
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Section II. I/O Interfaces
This section provides information on Stratix® IV device I/O features, external
memory interfaces, and high-speed differential interfaces with DPA. This section
includes the following chapters:
■
■
■
Chapter 6, I/O Features in Stratix IV Devices
Chapter 7, External Memory Interfaces in Stratix IV Devices
Chapter 8, High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
Revision History
Refer to each chapter for its own specific revision history. For information on when
each chapter was updated, refer to the Chapter Revision Dates section, which appears
in the full handbook.
June 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
II–2
Section II: I/O Interfaces
Revision History
Stratix IV Device Handbook Volume 1
June 2011 Altera Corporation
6. I/O Features in Stratix IV Devices
February 2011
SIV51006-3.2
SIV51006-3.2
This chapter describes how Stratix IV devices provide I/O capabilities that allow
you to work in compliance with current and emerging I/O standards and
requirements. With these device features, you can reduce board design interface costs
and increase development flexibility.
Altera Stratix IV FPGAs deliver a breakthrough level of system bandwidth and
power efficiency for high-end applications, allowing you to innovate without
compromise. Stratix IV I/Os are specifically designed for ease-of-use and rapid
system integration while simultaneously providing the high bandwidth required to
maximize internal logic capabilities and produce system-level performance.
Stratix IV device I/O capability far exceeds the I/O bandwidth available from
previous generation FPGAs. Independent modular I/O banks with a common bank
structure for vertical migration lend efficiency and flexibility to the high-speed I/O.
Package and die enhancements with dynamic termination and output control provide
best-in-class signal integrity. Numerous I/O features assist high-speed data transfer
into and out of the device, including:
■
Up to 32 full-duplex clock data recovery (CDR)-based transceivers supporting
data rates between 600 Mbps and 8.5 Gbps
■
Dedicated circuitry to support physical layer functionality for popular serial
protocols, such as PCI Express® (PIPE) (PCIe) Gen1 and Gen2, Gigabit Ethernet
(GbE), Serial RapidIO®, SONET/SDH, XAUI/HiGig, (OIF) CEI-6G,
SD/HD/3G-SDI, Fibre Channel, SFI-5, and Interlaken
■
Complete PCIe protocol solution with embedded PCIe hard IP blocks that
implement PHY-MAC layer, data link layer, and transaction layer functionality
■
■
Single-ended, non-voltage-referenced, and voltage-referenced I/O standards
Low-voltage differential signaling (LVDS), reduced swing differential signaling
(RSDS), mini-LVDS, high-speed transceiver logic (HSTL), and SSTL
■
■
■
Single data rate (SDR) and half data rate (HDR—half frequency and twice data
width of SDR) input and output options
Up to 132 full duplex 1.6 Gbps true LVDS channels (132 Tx + 132 Rx) on the row
I/O banks
Hard dynamic phase alignment (DPA) block with serializer/deserializer
(SERDES)
■
■
■
■
■
Deskew, read and write leveling, and clock-domain crossing functionality
Programmable output current strength
Programmable slew rate
Programmable delay
Programmable bus-hold circuit
© 2011 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX are Reg. U.S. Pat. & Tm. Off.
and/or trademarks of Altera Corporation in the U.S. and other countries. All other trademarks and service marks are the property of their respective holders as described at
www.altera.com/common/legal.html. Altera warrants performance of its semiconductor products to current specifications in accordance with Altera’s standard warranty, but
reserves the right to make changes to any products and services at any time without notice. Altera assumes no responsibility or liability arising out of the application or use of any
information, product, or service described herein except as expressly agreed to in writing by Altera. Altera customers are advised to obtain the latest version of device
specifications before relying on any published information and before placing orders for products or services.
Stratix IV Device Handbook Volume 1
February 2011
Subscribe
6–2
Chapter 6: I/O Features in Stratix IV Devices
I/O Standards Support
■
■
■
■
■
■
■
Programmable pull-up resistor
Open-drain output
Serial, parallel, and dynamic on-chip termination (OCT)
Differential OCT
Programmable pre-emphasis
Programmable equalization
Programmable differential output voltage (VOD
)
This chapter contains the following sections:
■
■
■
■
■
■
■
“I/O Standards Support”
“I/O Banks” on page 6–5
“I/O Structure” on page 6–17
“On-Chip Termination Support and I/O Termination Schemes” on page 6–24
“OCT Calibration” on page 6–32
“Termination Schemes for I/O Standards” on page 6–38
“Design Considerations” on page 6–46
I/O Standards Support
Stratix IV devices support a wide range of industry I/O standards. Table 6–1 lists the
I/O standards Stratix IV devices support, as well as the typical applications. These
devices support VCCIO voltage levels of 3.0, 2.5, 1.8, 1.5, and 1.2 V.
Table 6–1. I/O Standards and Applications for Stratix IV Devices (Part 1 of 2)
I/O Standard
3.3-V LVTTL/LVCMOS (1), (2)
2.5-V LVCMOS
Application
General purpose
General purpose
General purpose
General purpose
General purpose
1.8-V LVCMOS
1.5-V LVCMOS
1.2-V LVCMOS
3.0-V PCI/PCI-X
PC and embedded system
DDR SDRAM
SSTL-2 Class I and II
SSTL-18 Class I and II
SSTL-15 Class I and II
HSTL-18 Class I and II
HSTL-15 Class I and II
HSTL-12 Class I and II
Differential SSTL-2 Class I and II
Differential SSTL-18 Class I and II
Differential SSTL-15 Class I and II
Differential HSTL-18 Class I and II
DDR2 SDRAM
DDR3 SDRAM
QDRII/RLDRAM II
QDRII/QDRII+/RLDRAM II
General purpose
DDR SDRAM
DDR2 SDRAM
DDR3 SDRAM
Clock interfaces
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 6: I/O Features in Stratix IV Devices
6–3
I/O Standards Support
Table 6–1. I/O Standards and Applications for Stratix IV Devices (Part 2 of 2)
I/O Standard Application
Differential HSTL-15 Class I and II
Clock interfaces
Clock interfaces
Differential HSTL-12 Class I and II
LVDS
High-speed communications
Flat panel display
RSDS
mini-LVDS
LVPECL
Flat panel display
Video graphics and clock distribution
Notes to Table 6–1:
(1) The 3.3-V LVTTL/LVCMOS standard is supported using VCCIO at 3.0 V.
(2) For more information about the 3.3-V LVTTL/LVCMOS standard supported in Stratix IV devices, refer to “3.3-V I/O
Interface” on page 6–19.
f
For more information about transceiver supported I/O standards, refer to the
Transceiver Architecture in Stratix IV Devices chapter.
I/O Standards and Voltage Levels
Stratix IV devices support a wide range of industry I/O standards, including
single-ended, voltage-referenced single-ended, and differential I/O standards.
Table 6–2 lists the supported I/O standards and typical values for input and output
V
CCIO, VCCPD, VREF, and board VTT.
Table 6–2. I/O Standards and Voltage Levels for Stratix IV Devices (Note 1) (Part 1 of 3)
CCIO (V)
Output Operation
Column Row
V
V
TT (V)
V
CCPD (V)
VREF (V)
Standard
Support
Input Operation
Column Row
(Board
Termination
Voltage)
I/O Standard
(Pre-Driver (InputRef
Voltage)
Voltage)
I/O Banks I/OBanks I/O Banks I/O Banks
3.3-V LVTTL
JESD8-B
JESD8-B
JESD8-5
JESD8-7
JESD8-11
JESD8-12
3.0/2.5
3.0/2.5
3.0/2.5
1.8/1.5
1.8/1.5
1.2
3.0/2.5
3.0/2.5
3.0/2.5
1.8/1.5
1.8/1.5
1.2
3.0
3.0
2.5
1.8
1.5
1.2
3.0
3.0
2.5
1.8
1.5
1.2
3.0
3.0
2.5
2.5
2.5
2.5
—
—
—
—
—
—
—
—
—
—
—
—
3.3-V LVCMOS (3)
2.5-V LVCMOS
1.8-V LVCMOS
1.5-V LVCMOS
1.2-V LVCMOS
PCI
Rev 2.1
3.0-V PCI
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
—
—
—
—
PCI-X
Rev 1.0
3.0-V PCI-X
SSTL-2 Class I
SSTL-2 Class II
SSTL-18 Class I
SSTL-18 Class II
SSTL-15 Class I
SSTL-15 Class II
JESD8-9B
JESD8-9B
JESD8-15
JESD8-15
—
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
2.5
2.5
1.8
1.8
1.5
1.5
2.5
2.5
1.8
1.8
1.5
—
2.5
2.5
2.5
2.5
2.5
2.5
1.25
1.25
0.90
0.90
0.75
0.75
1.25
1.25
0.90
0.90
0.75
0.75
—
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
6–4
Chapter 6: I/O Features in Stratix IV Devices
I/O Standards Support
Table 6–2. I/O Standards and Voltage Levels for Stratix IV Devices (Note 1) (Part 2 of 3)
CCIO (V)
Output Operation
Column Row
V
V
TT (V)
VCCPD (V)
VREF (V)
Standard
Support
Input Operation
Column Row
(Board
Termination
Voltage)
I/O Standard
(Pre-Driver (InputRef
Voltage)
Voltage)
I/O Banks I/OBanks I/O Banks I/O Banks
HSTL-18 Class I
HSTL-18 Class II
HSTL-15 Class I
HSTL-15 Class II
HSTL-12 Class I
HSTL-12 Class II
JESD8-6
JESD8-6
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
1.8
1.8
1.5
1.5
1.2
1.2
1.8
1.8
1.5
—
2.5
2.5
2.5
2.5
2.5
2.5
0.90
0.90
0.75
0.75
0.6
0.90
0.90
0.75
0.75
0.6
JESD8-6
JESD8-6
JESD8-16A
JESD8-16A
1.2
—
0.6
0.6
Differential SSTL-2
Class I
JESD8-9B
JESD8-9B
JESD8-15
JESD8-15
—
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
2.5
2.5
1.8
1.8
1.5
1.5
1.8
1.8
1.5
1.5
1.2
1.2
2.5
2.5
2.5
2.5
2.5
1.8
1.8
1.5
—
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
1.25
1.25
0.90
0.90
0.75
0.75
0.90
0.90
0.75
0.75
0.60
0.60
—
Differential SSTL-2
Class II
Differential
SSTL-18 Class I
Differential
SSTL-18 Class II
Differential
SSTL-15 Class I
Differential
SSTL-15 Class II
—
Differential
HSTL-18 Class I
JESD8-6
JESD8-6
JESD8-6
JESD8-6
JESD8-16A
JESD8-16A
1.8
1.8
1.5
—
Differential
HSTL-18 Class II
Differential
HSTL-15 Class I
Differential
HSTL-15 Class II
Differential
HSTL-12 Class I
1.2
—
Differential
HSTL-12 Class II
ANSI/TIA/
EIA-644
LVDS (4), (5), (8)
2.5
2.5
2.5
RSDS (6), (7),
(8)
—
—
—
mini-LVDS (6),
(7), (8)
—
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 6: I/O Features in Stratix IV Devices
6–5
I/O Banks
Table 6–2. I/O Standards and Voltage Levels for Stratix IV Devices (Note 1) (Part 3 of 3)
VCCIO (V)
V
TT (V)
VCCPD (V)
VREF (V)
Standard
Support
Input Operation
Column Row
Output Operation
(Board
Termination
Voltage)
I/O Standard
(Pre-Driver (InputRef
Voltage)
Voltage)
Column Row
I/O Banks I/OBanks I/O Banks I/O Banks
LVPECL
—
(4) 2.5
—
—
2.5
—
—
Notes to Table 6–2:
(1) VCCPD is either 2.5 or 3.0 V. For VCCIO = 3.0 V, VCCPD = 3.0 V. For VCCIO = 2.5 V or less, VCCPD = 2.5 V.
(2) Single-ended HSTL/SSTL, differential SSTL/HSTL, and LVDS input buffers are powered by VCCPD. Row I/O banks support both true differential
input buffers and true differential output buffers. Column I/O banks support true differential input buffers, but not true differential output buffers.
I/O pins are organized in pairs to support differential standards. Column I/O differential HSTL and SSTL inputs use LVDS differential input buffers
without on-chip RD support.
(3) For more information about the 3.3-V LVTTL/LVCMOS standard supported in Stratix IV devices, refer to “3.3-V I/O Interface” on page 6–19.
(4) Column I/O banks support LVPECL I/O standards for input clock operation. Clock inputs on column I/Os are powered by VCCCLKIN when configured
as differential clock inputs. They are powered by VCCIO when configured as single-ended clock inputs. Differential clock inputs in row I/Os are
powered by VCCPD
.
(5) Column and row I/O banks support LVDS outputs using two single-ended output buffers, an external one-resistor (LVDS_E_1R), and a
three-resistor (LVDS_E_3R) network.
(6) Row I/O banks support RSDS and mini-LVDS I/O standards using a true LVDS output buffer without a resistor network.
(7) Column and row I/O banks support RSDS and mini-LVDS I/O standards using two single-ended output buffers with one-resistor (RSDS_E_1R
and mini-LVDS_E_1R) and three-resistor (RSDS_E_3R and mini-LVDS_E_3R) networks.
(8) The emulated differential output standard that supports the tri-state feature includes: LVDS_E_1R, LVDS_E_3R, RSDS_E_1R, RSDS_E_3R,
Mini_LVDS_E_1R, and Mini_LVDS_E_3R. For more information, refer to the I/O Buffer (ALTIOBUF) Megafunction User Guide.
f
For more information about the electrical characteristics of each I/O standard, refer to
the DC and Switching Characteristics for Stratix IV Devices chapter.
I/O Banks
Stratix IV devices contain up to 24 I/O banks, as shown in Figure 6–1 and Figure 6–2.
The row I/O banks contain true differential input and output buffers and dedicated
circuitry to support differential standards at speeds up to 1.6 Gbps.
Each I/O bank in Stratix IV devices can support high-performance external memory
interfaces with dedicated circuitry. The I/O pins are organized in pairs to support
differential standards. Each I/O pin pair can support both differential input and
output buffers. The only exceptions are the clk[1,3,8,10], PLL_L[1,4]_clk, and
PLL_R[1,4]_clk pins, which support differential input operations only.
f
For information about the number of channels available for the LVDS I/O standard,
refer to the High-Speed Differential I/O Interface and DPA in Stratix IV Devices chapter.
For more information about transceiver-bank-related features, refer to the Transceiver
Architecture in Stratix IV Devices chapter.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
6–6
Chapter 6: I/O Features in Stratix IV Devices
I/O Banks
Figure 6–1. Stratix IV E Devices I/0 Banks (Note 1), (2), (3), (4), (5), (6), (7), (8)
Bank 8A
Bank 7B
Bank 8B
Bank 8C
Bank 7C
Bank 7A
I/O banks 8A, 8B, and 8C support all
single-ended and differential input
and output operations except LVPECL,
which is supported on clk input pins only.
I/O banks 7A, 7B, and 7C support all
single-ended and differential input
and output operations except LVPECL,
which is supported on clk input pins only.
Row I/O banks support LVTTL, LVCMOS, 2.5-V, 1.8-V,
1.5-V, 1.2-V, SSTL-2 Class I & II, SSTL-18 Class I & II,
SSTL-15 Class I, HSTL-18 Class I & II, HSTL-15 Class I,
HSTL-12 Class I, LVDS, RSDS, mini-LVDS, differential
SSTL-2 Class I & II, differential SSTL-18 Class I & II,
differential SSTL-15 Class I, differential HSTL-18 Class I &
II, differential HSTL-15 Class I, and differential HSTL-12
Class I standards for input and output operations.
LVPECL I/O standard for input operation on dedicated
clock input pins.
SSTL-15 Class II, HSTL-15 Class II, HSTL-12 Class II,
differential SSTL-15 Class II, differential HSTL-15
Class II, differential HSTL-12 Class II standards are
only supported for input operations.
I/O banks 4A, 4B, and 4C support all
single-ended and differential input
I/O banks 3A, 3B, and 3C support all
single-ended and differential input
and output operations except LVPECL,
which is supported on clk input pins only.
and output operations except LVPECL,
which is supported on clk input pins only.
Bank 4C
Bank 4B
Bank 4A
Bank 3C
Bank 3A
Notes to Figure 6–1:
Bank 3B
(1) Differential HSTL and SSTL outputs are not true differential outputs. They use two single-ended outputs with the second output programmed as
inverted.
(2) Column I/O differential HSTL and SSTL inputs use LVDS differential input buffers without differential OCT support.
(3) Column I/O supports LVDS outputs using single-ended buffers and external resistor networks.
(4) Column I/O supports PCI/PCI-X with on-chip clamp diode. Row I/O supports PCI/PCI-X with external clamp diode.
(5) Clock inputs on column I/Os are powered by VCCCLKIN when configured as differential clock inputs. They are powered by VCCIO when configured as
single-ended clock inputs. All outputs use the corresponding bank VCCIO
.
(6) Row I/O supports the true LVDS output buffer.
(7) Column and row I/O banks support LVPECL standards for input clock operation.
(8) Figure 6–1 is a top view of the silicon die that corresponds to a reverse view for flip chip packages. It is a graphical representation only.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 6: I/O Features in Stratix IV Devices
6–7
I/O Banks
Figure 6–2. Stratix IV GX Devices I/O Banks (Note 1), (2), (3), (4), (5), (6), (7), (8)
Bank 7B
Bank 7A
Bank 8C
Bank 7C
Bank 8B
Bank 8A
I/O banks 8A, 8B & 8C support all
single-ended and differential input
and output operation.
I/O banks 7A, 7B & 7C support all
single-ended and differential input
and output operation.
Row I/O banks support LVTTL, LVCMOS, 2.5-V, 1.8-
V, 1.5-V, 1.2-V, SSTL-2 Class I & II, SSTL-18 Class I
& II, SSTL-15 Class I, HSTL-18 Class I & II, HSTL-15
Class I, HSTL-12 Class I, LVDS, RSDS, mini-LVDS,
differential SSTL-2 Class I & II, differential SSTL-18
Class I & II, differential SSTL-15 Class I, differential
HSTL-18 Class I & II, differential HSTL-15 Class I and
differential HSTL-12 Class I standards for input and
output operation.
SSTL-15 class II, HSTL-15 Class II, HSTL-12 Class II,
differential SSTL-15 Class II, differential HSTL-15
Class II, differential HSTL-12 Class II standards are
only supported for input operations
I/O banks 4A, 4B & 4C support all
I/O banks 3A, 3B & 3C support all
single-ended and differential input
and output operation.
single-ended and differential input
and output operation.
Bank 3C
Bank 4B
Bank 4A
Bank 3A
Bank 3B
Bank 4C
Notes to Figure 6–2:
(1) Differential HSTL and SSTL outputs are not true differential outputs. They use two single-ended outputs with the second output programmed as
inverted.
(2) Column I/O differential HSTL and SSTL inputs use LVDS differential input buffers without differential OCT support.
(3) Column I/O supports LVDS outputs using single-ended buffers and external resistor networks.
(4) Column I/O supports PCI/PCI-X with an on-chip clamp diode. Row I/O supports PCI/PCI-X with an external clamp diode.
(5) Clock inputs on column I/Os are powered by VCCCLKIN when configured as differential clock inputs. They are powered by VCCIO when configured as
single-ended clock inputs. All outputs use the corresponding bank VCCIO
.
(6) Row I/O supports the true LVDS output buffer.
(7) Column and row I/O banks support LVPECL standards for input clock operation.
(8) Figure 6–2 is a top view of the silicon die that corresponds to a reverse view for flip chip packages. It is a graphical representation only.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
6–8
Chapter 6: I/O Features in Stratix IV Devices
I/O Banks
Modular I/O Banks
The I/O pins in Stratix IV devices are arranged in groups called modular I/O banks.
Depending on device densities, the number of Stratix IV device I/O banks range from
16 to 24. The number of I/O pins on each bank is 24, 32, 36, 40, or 48. Figure 6–4
through Figure 6–16 show the number of I/O pins available in each I/O bank.
In Stratix IV devices, the maximum number of I/O banks per side is either four or six,
depending on the device density. When migrating between devices with a different
number of I/O banks per side, it is the middle or “B” bank that is removed or
inserted. For example, when moving from a 24-bank device to a 16-bank device, the
banks that are dropped are “B” banks, namely: 1B, 2B, 3B, 4B, 5B, 6B, 7B, and 8B.
Similarly, when moving from a 16-bank device to a 24-bank device, the banks that are
added are the same “B” banks.
After migration from a smaller device to a larger device, the bank size increases or
remains the same, but never decreases. For example, the number of I/O pins to a bank
may increase from 24 to 26, 32, 36, 40, 42, or 48, but will never decrease. This is shown
in Figure 6–3.
Figure 6–3. Bank Migration Path with Increasing Device Size
40
42
36
32
24
26
48
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 6: I/O Features in Stratix IV Devices
6–9
I/O Banks
Figure 6–4 through Figure 6–16 show the number of I/O pins and packaging
information for different sets of available devices. They show the top view of the
silicon die that corresponds to a reverse view for flip chip packages. They are
graphical representations only.
1
For Figure 6–4 through Figure 6–16, the pin count includes all general purpose I/Os,
dedicated clock pins, and dual purpose configuration pins. Transceiver pins and
dedicated configuration pins are not included in the pin count.
Figure 6–4. Number of I/Os in Each Bank in EP4SE230 and EP4SE360 Devices in the 780-Pin FineLine BGA Package
Number
of I/Os
Bank
Name
32 Bank 1A
26 Bank 1C
26 Bank 2C
32 Bank 2A
Bank 6A 32
Bank 6C 26
Bank 5C 26
Bank 5A 32
EP4SE230
EP4SE360
Bank
Name
Number
of I/Os
Figure 6–5. Number of I/Os in Each Bank in EP4SE360, EP4SE530, and EP4SE820 Devices in the 1152-Pin FineLine BGA
Package
Number
of I/Os
Bank
Name
48 Bank 1A
42 Bank 1C
42 Bank 2C
48 Bank 2A
Bank 6A 48
Bank 6C 42
Bank 5C 42
Bank 5A 48
EP4SE360
EP4SE530
EP4SE820
Bank
Name
Number
of I/Os
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
6–10
Chapter 6: I/O Features in Stratix IV Devices
I/O Banks
Figure 6–6. Number of I/Os in Each Bank in EP4SE530 and EP4SE820 Devices in the 1517-Pin FineLine BGA Package
Number
of I/Os
Bank
Name
50 Bank 1A
24 Bank 1B
42 Bank 1C
42 Bank 2C
24 Bank 2B
50 Bank 2A
Bank 6A 50
Bank 6B 24
Bank 6C 42
Bank 5C 42
Bank 5B 24
Bank 5A 50
EP4SE530
EP4SE820
Bank
Name
Number
of I/Os
Figure 6–7. Number of I/Os in Each Bank in EP4SE530 and EP4SE820 Devices in the 1760-Pin Fineline BGA Package
Number
of I/Os
Bank
Name
50 Bank 1A
36 Bank 1B
50 Bank 1C
50 Bank 2C
36 Bank 2B
50 Bank 2A
Bank 6A 50
Bank 6B 36
Bank 6C 50
Bank 5C 50
Bank 5B 36
Bank 5A 50
EP4SE530
EP4SE820
Bank
Name
Number
of I/Os
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 6: I/O Features in Stratix IV Devices
6–11
I/O Banks
Figure 6–8. Number of I/Os in Each Bank in EP4SGX70, EP4SGX110, EP4SGX180, and EP4SGX230 Devices in the 780-Pin
FineLine BGA Package
Number of
Number
Transceiver
of I/Os
Channels
Bank
Name
32 Bank 1A
4
EP4SGX70
26 Bank 1C
26 Bank 2C
32 Bank 2A
EP4SGX110
EP4SGX180
EP4SGX230
4
Bank
Name
Number
of I/Os
Figure 6–9. Number of I/Os in Each Bank in EP4SGX290 and EP4SGX360 Devices in the 780-Pin FineLine BGA Package
Number
of I/Os
Number of
Transceiver
Channels
Bank
Name
Bank
1C
1
Bank
GXBR1
4
4
EP4SGX290
EP4SGX360
Bank
GXBL1
4
4
Bank
GXBR0
Bank
GXBL0
Bank
Name
Number of
Transceiver
Channels
Number
of I/Os
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
6–12
Chapter 6: I/O Features in Stratix IV Devices
I/O Banks
Figure 6–10. Number of I/Os in Each Bank in EP4SGX70 and EP4SGX110 Devices in the 1152-Pin FineLine BGA Package
Number
of I/Os
Bank
Name
Bank 1A
Bank 1C
32
26
4*
Bank 6A
Bank 6C
32
26
4*
EP4SGX70
EP4SGX110
Bank
GXBL1
Bank
GXBR1
Bank
GXBL0
Bank
GXBR0
4*
4*
*Number of
Transceiver
Channels
Bank
Name
Number
of I/Os
Figure 6–11. Number of I/Os in Each Bank in EP4SGX180, EP4SGX230, EP4SGX290, EP4SGX360, and EP4SGX530 Devices
in the 1152-Pin FineLine BGA Package (Note 1), (2)
Number
of I/Os
Bank
Name
48
42
48
42
Bank 1A
Bank 1C
Bank 6A
Bank 6C
EP4SGX180
EP4SGX230
EP4SGX290
EP4SGX360
EP4SGX530
Bank
GXBL1
Bank
GXBR1
4 (2)
4 (2)
4 (2)
4 (2)
Bank
GXBL0
Bank
GXBR0
Bank
Name
Number
of I/Os
Notes to Figure 6–11:
(1) Except for the EP4SGX530 device, all listed devices have two variants in the F1152 package option—one with no PMA-only transceiver channels
and the other with two PMA-only transceiver channels for each transceiver bank. The EP4SGX530 device is only offered with two PMA-only
transceiver channels for each transceiver bank in the F1152 package option.
(2) There are two additional PMA-only transceiver channels in each transceiver bank for devices with the PMA-only transceiver package option.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 6: I/O Features in Stratix IV Devices
6–13
I/O Banks
Figure 6–12. Number of I/Os in Each Bank in EP4SGX180, EP4SGX230, EP4SGX290, EP4SGX360, and EP4SGX530 Devices
in the 1517-Pin FineLine BGA Package (Note 1)
Number
of I/Os
Bank
Name
48 Bank 1A
42 Bank 1C
42 Bank 2C
Bank 6A 48
Bank 6C 42
Bank 5C 42
EP4SGX180
EP4SGX230
EP4SGX290
EP4SGX360
EP4SGX530
48 Bank 2A
Bank
Bank 5A 48
Bank
4 (1)
4 (1)
GXBL2
GXBR2
Bank
GXBL1
Bank
GXBR1
4 (1)
4 (1)
4 (1)
4 (1)
Bank
GXBR0
Bank
GXBL0
Bank
Name
Number
of I/Os
Note to Figure 6–12:
(1) There are two additional PMA-only transceiver channels in each transceiver bank.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
6–14
Chapter 6: I/O Features in Stratix IV Devices
I/O Banks
Figure 6–13. Number of I/Os in Each Bank in EP4SGX290, EP4SGX360, and EP4SGX530 Devices in the 1932-Pin FineLine
BGA Package (Note 1)
Number
of I/Os
Bank
Name
Bank 1A
Bank 1C
50
42
Bank 6A
Bank 6C
50
42
Bank 2C
Bank 2B
Bank 2A
Bank 5C
Bank 5B
Bank 5A
42
20
50
42
20
50
EP4SGX530
EP4SGX290
EP4SGX360
Bank
GXBL3
Bank
GXBR3
4 (1)
4 (1)
4 (1)
4 (1)
4 (1)
4 (1)
4 (1)
4 (1)
Bank
GXBL2
Bank
GXBR2
Bank
GXBL1
Bank
GXBR1
Bank
Bank
GXBL0
GXBR0
Bank
Name
Number
of I/Os
Note to Figure 6–13:
(1) There are two additional PMA-only transceiver channels in each transceiver bank.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 6: I/O Features in Stratix IV Devices
6–15
I/O Banks
Figure 6–14. Number of I/Os in Each Bank in EP4SGX290, EP4SGX360, and EP4SGX530 Devices in the 1760-Pin FineLine
BGA Package (Note 1)
Number
of I/Os
Bank
Name
50 Bank 1A
42 Bank 1C
42 Bank 2C
Bank 6A 50
Bank 6C 42
Bank 5C 42
EP4SGX290
EP4SGX360
EP4SGX530
50 Bank 2A
Bank
Bank 5A 50
Bank
4 (1)
4 (1)
GXBL2
GXBR2
Bank
GXBL1
Bank
GXBR1
4 (1)
4 (1)
4 (1)
4 (1)
Bank
GXBR0
Bank
GXBL0
Bank
Name
Number
of I/Os
Note to Figure 6–14:
(1) There are two additional PMA-only transceiver channels in each transceiver bank.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
6–16
Chapter 6: I/O Features in Stratix IV Devices
I/O Banks
1
The information in Figure 6–15 and Figure 6–16 applies to Stratix IV GX and GT
devices.
Figure 6–15. Number of I/Os in Each Bank in EP4S100G3, EP4S100G4, and EP4S100G5 Devices in the 1932-Pin FineLine
BGA Package (Note 1)
Number
of I/Os
Bank
Name
40 Bank 1A
21 Bank 1C
21 Bank 2C
Bank 6A 38
Bank 6C 22
Bank 5C 19
EP4S100G3
EP4S100G4
EP4S100G5
12
Bank 5B
Bank 2B
13
Bank 5A 42
Bank
41 Bank 2A
Bank
4 (1)
4 (1)
GXBL2
GXBR2
Bank
GXBR1
Bank
GXBL1
4 (1)
4 (1)
4 (1)
4 (1)
Bank
GXBR0
Bank
GXBL0
Bank
Name
Number
of I/Os
Note to Figure 6–15:
(1) There are two additional PMA-only transceiver channels in each transceiver bank.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 6: I/O Features in Stratix IV Devices
6–17
I/O Structure
Figure 6–16. Number of I/Os in Each Bank in EP4S40G2, EP4S40G5, EP4S100G2, and EP4S100G5 Devices in the 1517-Pin
FineLine BGA Package (Note 1)
Number
of I/Os
Bank
Name
43 Bank 1A
22 Bank 1C
23 Bank 2C
Bank 6A 44
Bank 6C 23
Bank 5C 23
EP4S40G2
EP4S40G5
EP4S100G2
EP4S100G5
46 Bank 2A
Bank
Bank 5A 46
Bank
4 (1)
4 (1)
GXBL2
GXBR2
Bank
GXBL1
Bank
GXBR1
4 (1)
4 (1)
4 (1)
4 (1)
Bank
GXBR0
Bank
GXBL0
Bank
Name
Number
of I/Os
Note to Figure 6–16:
(1) There are two additional PMA-only transceiver channels in each transceiver bank.
I/O Structure
The I/O element (IOE) in Stratix IV devices contain a bidirectional I/O buffer and I/O
registers to support a complete embedded bidirectional single data rate or DDR
transfer. The IOEs are located in I/O blocks around the periphery of the Stratix IV
device. There are up to four IOEs per row I/O block and four IOEs per column I/O
block. The row IOEs drive row, column, or direct link interconnects. The column IOEs
drive column interconnects.
The Stratix IV bidirectional IOE also supports the following features:
■
■
■
■
■
■
■
■
Programmable input delay
Programmable output-current strength
Programmable slew rate
Programmable output delay
Programmable bus-hold
Programmable pull-up resistor
Open-drain output
On-chip series termination with calibration
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
6–18
Chapter 6: I/O Features in Stratix IV Devices
I/O Structure
■
■
■
■
On-chip series termination without calibration
On-chip parallel termination with calibration
On-chip differential termination
PCI clamping diode
I/O registers are composed of the input path for handling data from the pin to the
core, the output path for handling data from the core to the pin, and the output-enable
(OE) path for handling the OE signal to the output buffer. These registers allow faster
source-synchronous register-to-register transfers and resynchronization. The input
path consists of the DDR input registers, alignment and synchronization registers,
and HDR. You can bypass each block of the input path.
The output and OE paths are divided into output or OE registers, alignment registers,
and HDR blocks. You can bypass each block of the output and OE paths.
Figure 6–17 shows the Stratix IV IOE structure.
Figure 6–17. IOE Structure in Stratix IV Devices (Note 1), (2), (3)
Firm Core
DQS Logic Block
D5_OCT
D6_OCT
OE Register
PRN
Dynamic OCT Control (2)
D
Q
OE
from
Core
2
Half Data
Rate Block
Alignment
Registers
OE Register
PRN
V
CCIO
D5, D6
Delay
D
Q
V
CCIO
PCI Clamp
Programmable
Pull-Up Resistor
Programmable
Current
Strength and
Slew Rate
Control
From OCT
Calibration
Block
Output Register
PRN
Write
Data
from
Core
Half Data
Rate Block
4
Alignment
Registers
D
Q
Output Buffer
D5, D6
Delay
On-Chip
Termination
Output Register
PRN
Open Drain
D
Q
D2 Delay
Input Buffer
D3_0
Delay
clkout
To
Core
Bus-Hold
Circuit
D1
Delay
Input Register
PRN
To
Core
D3_1
Delay
D
Q
Read
Data
to
Alignment and
Synchronization
Registers
4
Half Data
Rate Block
Core
Input Register
PRN
Input Register
PRN
D
Q
D
Q
DQS
CQn
D4 Delay
clkin
Notes to Figure 6–17:
(1) The D3_0and D3_1delays have the same available settings in the Quartus® II software
(2) One dynamic OCT control is available per DQ/DQS group.
(3) Column I/O supports PCI/PCI-X with an on-chip clamp diode. Row I/O supports PCI/PCI-X with an external clamp diode.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 6: I/O Features in Stratix IV Devices
6–19
I/O Structure
f
For more information about I/O registers and how they are used for memory
applications, refer to the External Memory Interfaces in Stratix IV Devices chapter.
3.3-V I/O Interface
Stratix IV I/O buffers support 3.3-V I/O standards. You can use them as transmitters
or receivers in your system. The output high voltage (VOH), output low voltage (VOL),
input high voltage (VIH), and input low voltage (VIL) levels meet the 3.3-V I/O
standards specifications defined by EIA/JEDEC Standard JESD8-B with margin when
the Stratix IV VCCIO voltage is powered by 3.0 V.
To ensure device reliability and proper operation, when interfacing with a 3.3-V I/O
system using Stratix IV devices, ensure that you do not violate the absolute maximum
ratings of the devices. Altera recommends performing IBIS simulation to determine
that the overshoot and undershoot voltages are within the guidelines.
When using the Stratix IV device as a transmitter, you can use slow slew rate and
series termination to limit overshoot and undershoot at the I/O pins, but they are not
required. Transmission line effects that cause large voltage deviations at the receiver
are associated with an impedance mismatch between the driver and the transmission
lines. By matching the impedance of the driver to the characteristic impedance of the
transmission line, you can significantly reduce overshoot voltage. You can use a series
termination resistor placed physically close to the driver to match the total driver
impedance to the transmission line impedance. Stratix IV devices support series OCT
for all LVTTL and LVCMOS I/O standards in all I/O banks.
When using the Stratix IV device as a receiver, you can use a clamping diode (on-chip
or off-chip) to limit overshoot, though this is not required. Stratix IV devices provide
an optional on-chip PCI-clamping diode for column I/O pins. You can use this diode
to protect the I/O pins against overshoot voltage.
The 3.3-V I/O standard is supported using bank supply voltage (VCCIO) at 3.0 V. In
this method, the clamping diode (on-chip or off-chip), when enabled, can sufficiently
clamp overshoot voltage to within the DC and AC input voltage specifications. The
clamped voltage can be expressed as the sum of the supply voltage (VCCIO) and the
diode forward voltage.
f
For more information about the absolute maximum rating and maximum allowed
overshoot during transitions, refer to the DC and Switching Characteristics for Stratix IV
Devices chapter.
External Memory Interfaces
In addition to the I/O registers in each IOE, Stratix IV devices also have dedicated
registers and phase-shift circuitry on all I/O banks for interfacing with external
memory interfaces.
f
For more information about external memory interfaces, refer to the External Memory
Interfaces in Stratix IV Devices chapter.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
6–20
Chapter 6: I/O Features in Stratix IV Devices
I/O Structure
High-Speed Differential I/O with DPA Support
Stratix IV devices have the following dedicated circuitry for high-speed differential
I/O support:
■
■
■
■
■
■
■
Differential I/O buffer
Transmitter serializer
Receiver deserializer
Data realignment
Dynamic phase aligner (DPA)
Synchronizer (FIFO buffer)
Phase-locked loops (PLLs)
f
For more information about DPA support, refer to the High-Speed Differential I/O
Interfaces and DPA in Stratix IV Devices chapter.
Programmable Current Strength
The output buffer for each Stratix IV device I/O pin has a programmable current
strength control for certain I/O standards. Use programmable current strength to
mitigate the effects of high signal attenuation due to a long transmission line or a
legacy backplane. The LVTTL, LVCMOS, SSTL, and HSTL standards have several
levels of current strength that you can control. Table 6–3 lists the programmable
current strength for Stratix IV devices.
Table 6–3. Programmable Current Strength (Part 1 of 2) (Note 1), (2)
IOH / IOL Current Strength
Setting (mA) for
IOH / IOL Current Strength
Setting (mA) for
I/O Standard
Column I/O Pins
Row I/O Pins
3.3-V LVTTL
16, 12, 8, 4
16, 12, 8, 4
16, 12, 8, 4
12, 10, 8, 6, 4, 2
12, 10, 8, 6, 4, 2
8, 6, 4, 2
12, 8, 4
8, 4
3.3-V LVCMOS
2.5-V LVCMOS
1.8-V LVCMOS
1.5-V LVCMOS
1.2-V LVCMOS
SSTL-2 Class I
SSTL-2 Class II
SSTL-18 Class I
SSTL-18 Class II
SSTL-15 Class I
SSTL-15 Class II
HSTL-18 Class I
HSTL-18 Class II
HSTL-15 Class I
HSTL-15 Class II
12, 8, 4
8, 6, 4, 2
8, 6, 4, 2
4, 2
12, 10, 8
12, 8
16
16
12, 10, 8, 6, 4
16, 8
12, 10, 8, 6, 4
16, 8
12, 10, 8, 6, 4
16, 8
8, 6, 4
—
12, 10, 8, 6, 4
16
12, 10, 8, 6, 4
16
12, 10, 8, 6, 4
16
8, 6, 4
—
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 6: I/O Features in Stratix IV Devices
6–21
I/O Structure
Table 6–3. Programmable Current Strength (Part 2 of 2) (Note 1), (2)
IOH / IOL Current Strength
Setting (mA) for
IOH / IOL Current Strength
I/O Standard
HSTL-12 Class I
Setting (mA) for
Row I/O Pins
Column I/O Pins
12, 10, 8, 6, 4
16
8, 6, 4
—
HSTL-12 Class II
Notes to Table 6–3:
(1) The default setting in the Quartus II software is 50-OCT RS without calibration for all non-voltage reference and
HSTL and SSTL Class I I/O standards. The default setting is 25-OCT RS without calibration for HSTL and SSTL
Class II I/O standards.
(2) The 3.3-V LVTTL and 3.3-V LVCMOS are supported using VCCIO and VCCPD at 3.0 V.
1
Altera recommends performing IBIS or SPICE simulations to determine the best
current strength setting for your specific application.
Programmable Slew Rate Control
The output buffer for each Stratix IV device regular- and dual-function I/O pin has a
programmable output slew-rate control that you can configure for low-noise or
high-speed performance. A faster slew rate provides high-speed transitions for
high-performance systems. A slower slew rate can help reduce system noise, but adds
a nominal delay to the rising and falling edges. Each I/O pin has an individual
slew-rate control, allowing you to specify the slew rate on a pin-by-pin basis.
1
You cannot use the programmable slew rate feature when using OCT RS.
The Quartus II software allows four settings for programmable slew rate control—0,
1, 2, and 3—where 0 is slow slew rate and 3 is fast slew rate. Figure 6–4 lists the
default slew rate settings from the Quartus II software.
Table 6–4. Default Slew Rate Settings
I/O Standard
Slew Rate Option
0, 1, 2, 3
Default Slew Rate
1.2-V, 1.5-V, 1.8-V, 2.5-V LVCMOS, and 3.3-V LVTTL/LVCMOS
SSTL-2, SSTL-18, SSTL-15, HSTL-18, HSTL-15, and HSTL-12
3.0-V PCI/PCI-X
3
3
3
3
3
0, 1, 2, 3
0, 1, 2, 3
LVDS_E_1R, mini-LVDS_E_1R, and RSDS_E_1R
LVDS_E_3R, mini-LVDS_E_3R, and RSDS_E_3R
0, 1, 2, 3
0, 1, 2, 3
You can use faster slew rates to improve the available timing margin in
memory-interface applications or when the output pin has high-capacitive loading.
1
Altera recommends performing IBIS or SPICE simulations to determine the best slew
rate setting for your specific application.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
6–22
Chapter 6: I/O Features in Stratix IV Devices
I/O Structure
Programmable I/O Delay
The following sections describe programmable IOE delay and programmable output
buffer delay.
Programmable IOE Delay
The Stratix IV device IOE includes programmable delays, shown in Figure 6–17 on
page 6–18, that you can activate to ensure zero hold times, minimize setup times, or
increase clock-to-output times. Each pin can have a different input delay from
pin-to-input register or a delay from output register-to-output pin values to ensure
that the bus has the same delay going into or out of the device. This feature helps read
and time margins because it minimizes the uncertainties between signals in the bus.
f
For more information about programmable IOE delay specifications, refer to the
High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices chapter.
Programmable Output Buffer Delay
Stratix IV devices support delay chains built inside the single-ended output buffer, as
shown in Figure 6–17 on page 6–18. The delay chains can independently control the
rising and falling edge delays of the output buffer, providing the ability to adjust the
output-buffer duty cycle, compensate channel-to-channel skew, reduce simultaneous
switching output (SSO) noise by deliberately introducing channel-to-channel skew,
and improve high-speed memory-interface timing margins. Stratix IV devices
support four levels of output buffer delay settings. The default setting is No Delay.
f
For more information about programmable output buffer delay specifications, refer to
the High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices chapter.
Open-Drain Output
Stratix IV devices provide an optional open-drain output (equivalent to an open
collector output) for each I/O pin. When configured as open drain, the logic value of
the output is either high-Z or 0. Typically, an external pull-up resistor is required to
provide logic high.
Bus Hold
Each Stratix IV device I/O pin provides an optional bus-hold feature. Bus-hold
circuitry can weakly hold the signal on an I/O pin at its last-driven state. Because the
bus-hold feature holds the last-driven state of the pin until the next input signal is
present, you do not need an external pull-up or pull-down resistor to hold a signal
level when the bus is tri-stated.
Bus-hold circuitry also pulls non-driven pins away from the input threshold voltage
where noise can cause unintended high-frequency switching. You can select this
feature individually for each I/O pin. The bus-hold output drives no higher than
V
CCIO to prevent over-driving signals. If you enable the bus-hold feature, you cannot
use the programmable pull-up option. Disable the bus-hold feature if the I/O pin is
configured for differential signals.
Bus-hold circuitry uses a resistor with a nominal resistance (RBH) of approximately
7 k to weakly pull the signal level to the last-driven state.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 6: I/O Features in Stratix IV Devices
6–23
I/O Structure
f
For more information about the specific sustaining current driven through this
resistor and the overdrive current used to identify the next-driven input level, refer to
the High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices chapter.
Bus-hold circuitry is active only after configuration. When going into user mode, the
bus-hold circuit captures the value on the pin present at the end of configuration.
Programmable Pull-Up Resistor
Each Stratix IV device I/O pin provides an optional programmable pull-up resistor
during user mode. If you enable this feature for an I/O pin, the pull-up resistor
(typically 25 K?) weakly holds the I/O to the VCCIO level.
Programmable pull-up resistors are only supported on user I/O pins and are not
supported on dedicated configuration pins, JTAG pins, or dedicated clock pins. If you
enable the programmable pull-up option, you cannot use the bus-hold feature.
1
When the optional DEV_OEsignal drives low, all the I/O pins remain tri-stated even
with the programmable pull-up option enabled.
Programmable Pre-Emphasis
Stratix IV LVDS transmitters support programmable pre-emphasis to compensate for
the frequency dependent attenuation of the transmission line. The Quartus II software
allows four settings for programmable pre-emphasis.
f
For more information about programmable pre-emphasis, refer to the High-Speed
Differential I/O Interfaces and DPA in Stratix IV Devices chapter.
Programmable Differential Output Voltage
Stratix IV LVDS transmitters support programmable VOD. The programmable VOD
settings allow you to adjust output eye height to optimize trace length and power
consumption. A higher VOD swing improves voltage margins at the receiver end; a
smaller VOD swing reduces power consumption. The Quartus II software allows four
settings for programmable VOD
.
f
For more information about programmable VOD, refer to the High-Speed Differential I/O
Interfaces and DPA in Stratix IV Devices chapter.
MultiVolt I/O Interface
The Stratix IV architecture supports the MultiVolt I/O interface feature that allows the
Stratix IV devices in all packages to interface with systems of different supply
voltages.
You can connect the VCCIOpins to a 1.2-, 1.5-, 1.8-, 2.5-, or 3.0-V power supply,
depending on the output requirements. The output levels are compatible with
systems of the same voltage as the power supply. (For example, when VCCIOpins are
connected to a 1.5-V power supply, the output levels are compatible with 1.5-V
systems.)
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
6–24
Chapter 6: I/O Features in Stratix IV Devices
On-Chip Termination Support and I/O Termination Schemes
f
For more information about pin connection guidelines, refer to the Stratix IV GX and
Stratix IV E Device Family Pin Connection Guidelines.
The Stratix IV VCCPDpower pins must be connected to a 2.5- or 3.0-V power supply.
Using these power pins to supply the pre-driver power to the output buffers increases
the performance of the output pins. Table 6–5 lists Stratix IV MultiVolt I/O support.
Table 6–5. Stratix IV MultiVolt I/O Support (Note 1)
Input Signal (V)
Output Signal (V)
V
CCIO (V) (3)
1.2
v
—
—
—
—
1.5
—
v
v
—
—
1.8
—
v
v
—
—
2.5
—
—
—
v
v
3.0
—
—
—
3.3
—
—
—
1.2
v
—
—
—
—
1.5
—
v
—
—
—
1.8
—
—
v
—
—
2.5
—
—
—
v
—
3.0
—
—
—
—
v
3.3
—
—
—
—
—
1.2
1.5
1.8
2.5
3.0
v(2) v(2)
v
v
Notes to Table 6–5:
(1) The pin current may be slightly higher than the default value. You must verify that the driving device’s VOL maximum and VOH minimum voltages
do not violate the applicable Stratix IV VIL maximum and VIH minimum voltage specifications.
(2) Altera recommends that you use an external clamping diode on the I/O pins when the input signal is 3.0 V or 3.3 V. You have the option to use
an internal clamping diode for column I/O pins.
(3) Each I/O bank of a Stratix IV device has its own VCCIOpins and supports only one VCCIO, either 1.2, 1.5, 1.8, or 3.0 V. The LVDS I/O standard
is not supported when VCCIO is 3.0 V. The LVDS input operations are supported when VCCIO is 1.2 V, 1.5 V, 1.8 V, or 2.5 V. The LVDS output
operations are only supported when VCCIO is 2.5 V.
On-Chip Termination Support and I/O Termination Schemes
Stratix IV devices feature dynamic series and parallel OCT to provide I/O impedance
matching and termination capabilities. OCT maintains signal quality, saves board
space, and reduces external component costs.
Stratix IV devices support:
■
■
■
■
■
■
On-chip series termination (RS) with calibration
On-chip series termination (RS) without calibration
On-chip Parallel termination (RT) with calibration
Dynamic series termination for single-ended I/O standards
Dynamic Parallel termination for single-ended I/O standards
On-chip differential termination (RD) for differential LVDS I/O standards
Stratix IV devices support OCT in all I/O banks by selecting one of the OCT I/O
standards.
These devices also support OCT RS and RT in the same I/O bank for different I/O
standards if they use the same VCCIO supply voltage. You can independently configure
each I/O in an I/O bank to support OCT RS, programmable current strength, or OCT
RT.
1
You cannot configure both OCT RS and programmable current strength for the same
I/O buffer.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 6: I/O Features in Stratix IV Devices
6–25
On-Chip Termination Support and I/O Termination Schemes
A pair of RUPand RDNpins are available in a given I/O bank and are shared for
series- and parallel-calibrated termination. The RUPand RDNpins share the same VCCIO
and GND, respectively, with the I/O bank where they are located. The RUPand RDN
pins are dual-purpose I/Os and function as regular I/Os if you do not use the
calibration circuit.
For calibration, the connections are as follows:
■
■
The RUPpin is connected to VCCIO through an external 25- 1% or 50- 1%
resistor for an on-chip series termination value of 25-or 50-, respectively.
The RDNpin is connected to GND through an external 25- 1% or 50- 1%
resistor for an on-chip series termination value of 25-or 50-, respectively.
For on-chip parallel termination, the connections are as follows:
■
The RUPpin is connected to VCCIO through an external 50- 1% resistor.
The RDNpin is connected to GND through an external 50- 1% resistor.
■
On-Chip Series (RS) Termination Without Calibration
Stratix IV devices support driver-impedance matching to provide the I/O driver with
controlled output impedance that closely matches the impedance of the transmission
line. As a result, you can significantly reduce reflections. Stratix IV devices support
on-chip series termination for single-ended I/O standards (Figure 6–18).
The RS shown in Figure 6–18 is the intrinsic impedance of the output transistors.
Typical RS values are 25 and 50 . When you select matching impedance, current
strength is no longer selectable.
Figure 6–18. On-Chip Series Termination Without Calibration
Stratix IV Driver
Series Termination
Receiving
Device
V
CCIO
R
S
S
Z
= 50 Ω
O
R
GND
To use on-chip termination for the SSTL Class I standard, you must select the 50-
on-chip series termination setting, thus eliminating the external 25- RS (to match
the 50- transmission line). For the SSTL Class II standard, you must select the 25-
on-chip series termination setting (to match the 50- transmission line and the
near-end external 50- pull-up to VTT).
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
6–26
Chapter 6: I/O Features in Stratix IV Devices
On-Chip Termination Support and I/O Termination Schemes
On-Chip Series Termination with Calibration
Stratix IV devices support on-chip series termination with calibration in all banks. The
on-chip series termination calibration circuit compares the total impedance of the I/O
buffer to the external 25- 1% or 50- 1% resistors connected to the RUPand RDN
pins and dynamically enables or disables the transistors until they match.
The RS shown in Figure 6–19 is the intrinsic impedance of the transistors. Calibration
occurs at the end of device configuration. When the calibration circuit finds the
correct impedance, it powers down and stops changing the characteristics of the
drivers.
Figure 6–19. On-Chip Series Termination with Calibration
Stratix IV Driver
Series Termination
Receiving
Device
V
CCIO
R
S
S
Z
= 50 Ω
O
R
GND
Table 6–6 lists the I/O standards that support on-chip series termination with and
without calibration.
Table 6–6. Selectable I/O Standards for On-Chip Series Termination with and Without Calibration
(Part 1 of 2)
On-Chip Series Termination Setting
I/O Standard
Row I/O ()
Column I/O ()
50
25
50
25
50
25
50
25
50
25
50
25
50
25
50
25
50
25
50
25
3.3-V LVTTL/LVCMOS
2.5-V LVCMOS
1.8-V LVCMOS
1.5-V LVCMOS
1.2-V LVCMOS
50
50
SSTL-2 Class I
SSTL-2 Class II
SSTL-18 Class I
SSTL-18 Class II
50
25
50
25
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 6: I/O Features in Stratix IV Devices
6–27
On-Chip Termination Support and I/O Termination Schemes
Table 6–6. Selectable I/O Standards for On-Chip Series Termination with and Without Calibration
(Part 2 of 2)
On-Chip Series Termination Setting
I/O Standard
Row I/O ()
Column I/O ()
SSTL-15 Class I
SSTL-15 Class II
HSTL-18 Class I
HSTL-18 Class II
HSTL-15 Class I
HSTL-15 Class II
HSTL-12 Class I
HSTL-12 Class II
50
—
50
25
50
—
50
—
50
25
50
25
50
25
50
25
Left-Shift Series Termination Control
Stratix IV devices support left-shift series termination control. You can use left-shift
series termination control to get the calibrated OCT RS with half of the impedance
value of the external reference resistors connected to the RUPand RDNpins. This feature
is useful in applications that require both 25- and 50- calibrated OCT RS at the
same VCCIO. For example, if your application requires 25- and 50- calibrated OCT
RS for SSTL-2 Class I and Class II I/O standards, you only need one OCT calibration
block with 50- external reference resistors.
You can enable the left-shift series termination control feature in the ALTIOBUF
megafunction in the Quartus II software. The Quartus II software only allows
left-shift series termination control for 25- calibrated OCT RS with 50- external
reference resistors connected to the RUPand RDNpins. You can only use left-shift series
termination control for the I/O standards that support 25- calibrated OCT RS .
1
This feature is automatically enabled if you are using a bidirectional I/O with 25-
calibrated OCT RS and 50- parallel OCT.
f
For more information about how to enable the left-shift series termination feature in
the ALTIOBUF megafunction, refer to the I/O Buffer (ALTIOBUF) Megafunction User
Guide.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
6–28
Chapter 6: I/O Features in Stratix IV Devices
On-Chip Termination Support and I/O Termination Schemes
On-Chip Parallel Termination with Calibration
Stratix IV devices support on-chip parallel termination with calibration in all banks.
On-chip parallel termination with calibration is only supported for input
configuration of input and bidirectional pins. Output pin configurations do not
support on-chip parallel termination with calibration. Figure 6–20 shows on-chip
parallel termination with calibration. When you use parallel OCT, the VCCIO of the
bank must match the I/O standard of the pin where the parallel OCT is enabled.
Figure 6–20. On-Chip Parallel Termination with Calibration
Stratix IV OCT
V
CCIO
100 Ω
Z
= 50 Ω
O
V
REF
100 Ω
GND
Transmitter
Receiver
The on-chip parallel termination calibration circuit compares the total impedance of
the I/O buffer to the external 50- 1% resistors connected to the RUPand RDNpins
and dynamically enables or disables the transistors until they match. Calibration
occurs at the end of device configuration. When the calibration circuit finds the
correct impedance, it powers down and stops changing the characteristics of the
drivers. Table 6–7 lists the I/O standards that support on-chip parallel termination
with calibration.
Table 6–7. Selectable I/O Standards with On-Chip Parallel Termination with Calibration
On-Chip Parallel
Termination Setting
(Column I/O) ()
On-Chip Parallel
Termination Setting
(Row I/O) ()
I/O Standard
SSTL-2 Class I, II
50
50
50
50
50
50
50
50
50
50
50
50
50
50
50
50
50
50
50
50
50
50
50
50
SSTL-18 Class I, II
SSTL-15 Class I, II
HSTL-18 Class I, II
HSTL-15 Class I, II
HSTL-12 Class I, II
Differential SSTL-2 Class I, II
Differential SSTL-18 Class I, II
Differential SSTL-15 Class I, II
Differential HSTL-18 Class I, II
Differential HSTL-15 Class I, II
Differential HSTL-12 Class I, II
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 6: I/O Features in Stratix IV Devices
6–29
On-Chip Termination Support and I/O Termination Schemes
Expanded On-Chip Series Termination with Calibration
OCT calibration circuits always adjust OCT RS to match the external resistors
connected to the RUPand RDNpin; however, it is possible to achieve OCT RS values
other than the 25- and 50- resistors. Theoretically, if you need a different OCT RS
value, you can change the resistance connected to the RUPand RDNpins accordingly.
Practically, the OCT RS range that Stratix IV devices support is limited because of
output buffer size and granularity limitations.
The Quartus II software only allows discrete OCT RS calibration settings of 25, 40, 50,
and 60 . You can select the closest discrete value of OCT RS with calibration settings
in the Quartus II software to your system to achieve the closest timing. For example, if
you are using 20- OCT RS with calibration in your system, you can select the 25-
OCT RS with calibration setting in the Quartus II software to achieve the closest
timing.
Table 6–8 lists expanded OCT RS with calibration supported in Stratix IV devices. Use
expanded on-chip series termination with calibration of SSTL and HSTL for
impedance matching to improve signal integrity but do not use it to meet the JEDEC
standard.
Table 6–8. Selectable I/O Standards with Expanded On-Chip Series Termination with Calibration
Range
Expanded OCT RS Range
I/O Standard
Row I/O ()
20–60
20–60
20–60
40–60
40–60
20–60
20–60
40–60
20–60
40–60
40–60
Column I/O ()
3.3-V LVTTL/LVCMOS
2.5-V LVTTL/LVCMOS
1.8-V LVTTL/LVCMOS
1.5-V LVTTL/LVCMOS
1.2-V LVTTL/LVCMOS
SSTL-2
20–60
20–60
20–60
20–60
20–60
20–60
SSTL-18
20–60
SSTL-15
20–60
HSTL-18
20–60
HSTL-15
20–60
HSTL-12
20–60
Dynamic On-Chip Termination
Stratix IV devices support on and off dynamic termination, both series and parallel,
for a bidirectional I/O in all I/O banks. Figure 6–21 shows the termination schemes
supported in Stratix IV devices. Dynamic parallel termination is enabled only when
the bidirectional I/O acts as a receiver and is disabled when it acts as a driver.
Similarly, dynamic series termination is enabled only when the bidirectional I/O acts
as a driver and is disabled when it acts as a receiver. This feature is useful for
terminating any high-performance bidirectional path because signal integrity is
optimized depending on the direction of the data.
Using dynamic OCT helps save power because device termination is internal instead
of external. Termination only switches on during input operation, thus drawing less
static power.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
6–30
Chapter 6: I/O Features in Stratix IV Devices
On-Chip Termination Support and I/O Termination Schemes
1
When using calibrated input parallel and calibrated output series termination on
bidirectional pins, they must use the same termination value because each I/O pin
can only reference one OCT calibration block. The only exception is when using 50
parallel OCT and 25 series OCT using the left shift series termination control. For
example, you cannot use calibrated 50 parallel OCT on the input buffer of a
bidirectional pin and calibrated 40 series OCT on the output buffer because these
would require two separate calibration blocks with different RUPand RDNresistor
values.
Figure 6–21. Dynamic Parallel OCT in Stratix IV Devices
VCCIO
VCCIO
Transmitter
Receiver
100 Ω
110000 Ω
50 Ω
Z
= 50 Ω
O
100 Ω
110000 Ω
50 Ω
GND
GND
Stratix IV OCT
Stratix IV OCT
VCCIO
VCCIO
100 Ω
110000 Ω
100 Ω
50 Ω
Z
= 50 Ω
O
100 Ω
50 Ω
GND
GND
Transmitter
Receiver
Stratix IV OCT
Stratix IV OCT
f
For more information about tolerance specifications for OCT with calibration, refer to
the DC and Switching Characteristics for Stratix IV Devices chapter.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 6: I/O Features in Stratix IV Devices
6–31
On-Chip Termination Support and I/O Termination Schemes
LVDS Input OCT (RD)
Stratix IV devices support OCT for differential LVDS input buffers with a nominal
resistance value of 100 , as shown in Figure 6–22. Differential OCT RD can be
enabled in row I/O banks when both the VCCIO and VCCPD is set to 2.5 V. Column I/O
banks do not support OCT RD. Dedicated clock input pairs CLK[1,3,8,10][p,n]
,
PLL_L[1,4]_CLK[p,n], and PLL_R[1,4]_CLK[p,n]on the row I/O banks of Stratix IV
devices do not support RD termination.
Figure 6–22. Differential Input OCT
Transmitter
Receiver
Z
Z
= 50 Ω
= 50 Ω
O
100 Ω
O
f
For more information about differential on-chip termination, refer to the High-Speed
Differential I/O Interfaces and DPA in Stratix IV Devices chapter.
Summary of OCT Assignments
Table 6–9 lists the OCT assignments for the Quartus II software version 9.1 and later.
Table 6–9. Summary of OCT Assignments in the Quartus II Software
Assignment Name
Value
Applies To
Input buffers for single-ended and
differential HSTL/SSTL standards
Parallel 50 with calibration
Input Termination
Input buffers for LVDS receivers on
row I/O banks (1)
Differential
Series 25 without
calibration
Series 50 without
calibration
Output buffers for single-ended
LVTTL/LVCMOS and HSTL/SSTL
standards as well as differential
HSTL/SSTL standards
Output Termination
Series 25 with calibration
Series 40 with calibration
Series 50 with calibration
Series 60 with calibration
Note to Table 6–9:
(1) You can enable differential OCT RD in row I/O banks when both VCCIO and VCCPD are set to 2.5 V.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
6–32
Chapter 6: I/O Features in Stratix IV Devices
OCT Calibration
OCT Calibration
Stratix IV devices support calibrated on-chip series termination (RS) and calibrated
on-chip parallel termination (RT) on all I/O pins. You can calibrate the device’s I/O
bank with any of the OCT calibration blocks available in the device provided the
V
CCIO of the I/O bank with the pins using calibrated OCT matches the VCCIO of the
I/O bank with the calibration block and its associated RUPand RDNpins.
OCT Calibration Block Location
Table 6–10 and Table 6–11 list the location of OCT calibration blocks in Stratix IV
devices. For both tables, the following legend applies:
■
■
■
“v” indicates I/O banks with OCT calibration block
”X” indicates I/O banks without OCT calibration block
“—” indicates I/O banks that are not available in the device
1
Table 6–10 and Table 6–11 do not show transceiver banks and transceiver calibration
blocks.
Table 6–10 lists the OCT calibration blocks in Banks 1A through 4C.
Table 6–10. OCT Calibration Block Counts and Placement in Stratix IV Devices (1A through 4C) (Part 1 of 2)
Bank
Number of
Device
EP4SE230
Pin
OCT Blocks
1A
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
1B
—
—
—
—
X
1C
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
2A
v
v
v
v
v
v
v
v
v
v
v
—
v
—
v
v
—
v
2B
—
—
—
—
X
2C
X
3A
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
3B
—
—
X
3C
X
4A
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
4B
—
—
X
4C
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
780
780
8
8
X
X
EP4SE360
1152
1152
1517
1760
1152
1517
1760
780
8
X
X
8
X
X
X
X
EP4SE530
10
10
8
X
X
v
v
X
X
X
X
X
X
X
—
X
—
X
X
X
X
EP4SE820
10
10
8
X
X
v
v
X
X
X
X
X
X
X
EP4SGX70
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
X
—
—
—
—
X
—
—
—
—
X
780
8
X
X
EP4SGX110
1152
780
8
—
X
X
8
X
EP4SGX180
EP4SGX230
1152
1517
780
8
—
X
X
8
X
X
X
8
X
—
X
X
—
X
1152
1517
8
—
X
X
8
X
X
X
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 6: I/O Features in Stratix IV Devices
6–33
OCT Calibration
Table 6–10. OCT Calibration Block Counts and Placement in Stratix IV Devices (1A through 4C) (Part 2 of 2)
Bank
Number of
Device
Pin
OCT Blocks
1A
—
v
v
v
v
—
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
1B
—
—
—
—
X
1C
—
X
2A
—
—
v
v
v
—
—
v
v
v
—
v
v
v
v
v
v
v
v
v
v
2B
—
—
—
—
—
—
—
—
—
—
—
—
—
X
2C
—
—
X
3A
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
3B
—
X
3C
X
4A
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
4B
—
X
4C
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
780
8
8
1152
1517
1760
1932
780
X
EP4SGX290
8
X
X
X
X
8
X
X
X
X
X
10
8
X
X
X
v
X
X
—
—
—
—
X
—
X
—
—
X
—
X
—
X
1152
1517
1760
1932
1152
1517
1760
1932
1517
1517
1517
1932
1932
1517
1932
8
X
EP4SGX360
EP4SGX530
8
X
X
X
X
8
X
X
X
X
X
10
8
X
X
X
v
v
v
v
v
X
X
—
—
—
—
—
—
—
—
—
—
—
X
—
X
X
X
10
10
10
8
X
X
X
X
X
X
X
X
X
X
X
EP4S40G2
EP4S40G5
EP4S100G2
EP4S100G3
EP4S100G4
X
—
—
—
X
X
X
X
10
8
X
X
X
v
X
X
X
X
X
X
10
10
10
10
X
X
X
v
v
v
v
X
X
X
X
X
X
X
—
X
X
X
X
EP4S100G5
X
X
X
X
Table 6–11 lists the OCT calibration blocks in Banks 5A through 8C.
Table 6–11. OCT Calibration Block Counts and Placement in Stratix IV Devices (5A through 8C) (Part 1 of 2)
Bank
Number of
Device
EP4SE230
Pin
OCT Blocks
5A
v
v
v
v
v
v
v
v
v
—
5B
—
—
—
—
X
5C
X
6A
v
v
v
v
v
v
v
v
v
—
6B
—
—
—
—
X
6C
X
7A
v
v
v
v
v
v
v
v
v
v
7B
—
—
X
7C
X
X
X
X
X
X
X
X
X
X
8A
v
v
v
v
v
v
v
v
v
v
8B
—
—
X
8C
X
780
780
8
8
X
X
X
EP4SE360
1152
1152
1517
1760
1152
1517
1760
780
8
X
X
X
8
X
X
X
X
X
EP4SE530
10
10
8
X
X
X
X
v
v
X
X
X
X
X
X
X
—
X
X
—
X
X
X
X
EP4SE820
EP4SGX70
10
10
8
X
X
X
X
v
v
X
X
X
X
X
X
X
—
—
—
—
—
—
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
6–34
Chapter 6: I/O Features in Stratix IV Devices
OCT Calibration
Table 6–11. OCT Calibration Block Counts and Placement in Stratix IV Devices (5A through 8C) (Part 2 of 2)
Bank
Number of
Device
Pin
OCT Blocks
5A
—
—
—
—
v
—
—
v
—
—
v
v
v
—
—
v
v
v
—
v
v
v
v
v
v
v
v
v
v
5B
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
X
5C
—
—
—
—
X
6A
—
v
—
v
v
—
v
v
—
v
v
v
v
—
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
6B
—
—
—
—
—
—
—
—
—
—
—
—
X
6C
—
X
7A
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
7B
—
—
—
X
7C
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
8A
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
8B
—
—
—
v
X
8C
X
780
1152
780
8
8
EP4SGX110
X
8
—
X
X
EP4SGX180
EP4SGX230
1152
1517
780
8
X
8
X
X
X
8
—
—
X
—
X
—
X
—
v
X
X
1152
1517
780
8
X
8
X
X
X
8
—
—
X
—
X
—
X
—
X
X
1152
1517
1760
1932
780
8
X
EP4SGX290
8
X
X
X
X
8
X
X
X
X
X
10
8
X
X
X
X
v
X
—
—
X
—
—
—
—
X
—
X
—
X
—
X
1152
1517
1760
1932
1152
1517
1760
1932
1517
1517
1517
1932
1932
1517
1932
8
X
EP4SGX360
EP4SGX530
8
X
X
X
X
8
X
X
X
X
X
10
8
X
X
X
X
v
v
v
v
v
X
—
X
—
—
—
—
—
—
—
—
—
—
—
X
X
X
10
10
10
8
X
X
X
X
X
X
X
X
X
X
X
EP4S40G2
EP4S40G5
EP4S100G2
EP4S100G3
EP4S100G4
—
—
—
X
X
X
X
X
10
8
X
X
X
X
v
X
X
X
X
X
10
10
10
10
X
X
X
X
v
v
v
v
X
X
X
X
X
—
X
X
X
X
X
EP4S100G5
X
X
X
X
Sharing an OCT Calibration Block on Multiple I/O Banks
An OCT calibration block has the same VCCIO as the I/O bank that contains the block.
OCT RS calibration is supported on all I/O banks with different VCCIO voltage
standards, up to the number of available OCT calibration blocks. You can configure
the I/O banks to receive calibration codes from any OCT calibration block with the
same VCCIO. All I/O banks with the same VCCIO can share one OCT calibration block,
even if that particular I/O bank has an OCT calibration block.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 6: I/O Features in Stratix IV Devices
6–35
OCT Calibration
For example, Figure 6–23 shows a group of I/O banks that has the same VCCIO
voltage. If a group of I/O banks has the same VCCIO voltage, you can use one OCT
calibration block to calibrate the group of I/O banks placed around the periphery.
Because 3B, 4C, 6C, and 7B have the same VCCIO as bank 7A, you can calibrate all four
I/O banks (3B, 4C, 6C, and 7B) with the OCT calibration block (CB7) located in bank
7A. You can enable this by serially shifting out OCT RS calibration codes from the
OCT calibration block located in bank 7A to the I/O banks located around the
periphery.
1
I/O banks that do not contain calibration blocks share calibration blocks with I/O
banks that do contain calibration blocks.
Figure 6–23 is a top view of the silicon die that corresponds to a reverse view for flip
chip packages. It is a graphical representation only. This figure does not show
transceiver banks and transceiver calibration blocks.
Figure 6–23. Example of Calibrating Multiple I/O Banks with One Shared OCT Calibration Block
Bank 1A
Bank 1B
Bank 1C
Bank 2C
Bank 2B
Bank 2A
Bank 6A
Bank 6B
Bank 6C
Bank 5C
Bank 5B
Bank 5A
I/O bank with the same VCCIO
I/O bank with different VCCIO
Stratix IV
OCT Calibration Block Modes of Operation
Stratix IV devices support OCT RS and OCT RT on all I/O banks. The calibration can
occur in either power-up or user mode.
Power-Up Mode
In power-up mode, OCT calibration is automatically performed at power up.
Calibration codes are shifted to selected I/O buffers before transitioning to user
mode.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
6–36
Chapter 6: I/O Features in Stratix IV Devices
OCT Calibration
User Mode
In user mode, the OCTUSRCLK
,
ENAOCT
,
nCLRUSR, and ENASER[9..0]signals are used to
calibrate and serially transfer calibration codes from each OCT calibration block to
any I/O. Table 6–12 lists the user-controlled calibration block signal names and their
descriptions.
Table 6–12. OCT Calibration Block Ports for User Control
Signal Name
Description
OCTUSRCLK
Clock for OCT block.
ENAOCT
Enable OCT Termination (Generated by user IP).
When ENOCT= 0, each signal enables the OCT serializer for the
corresponding OCT calibration block.
ENASER[9..0]
When ENAOCT= 1, each signal enables OCT calibration for the
corresponding OCT calibration block.
S2PENA_<bank#>
Serial-to-parallel load enable per I/O bank.
Clear user.
nCLRUSR
Figure 6–24 shows the flow of the user signal. When ENAOCTis 1, all OCT calibration
blocks are in calibration mode; when ENAOCTis 0, all OCT calibration blocks are in
serial data transfer mode. The OCTUSRCLKclock frequency must be 20 MHz or less.
1
You must generate all user signals on the rising edge of OCTUSRCLK.
Figure 6–24 does not show transceiver banks and transceiver calibration blocks.
Figure 6–24. Signals Used for User Mode Calibration
CB9
CB0
CB7
CB6
CB8
Bank 1A
Bank 1B
Bank 1C
Bank 2C
Bank 2B
Bank 2A
Bank 6A
Bank 6B
Bank 6C
Bank 5C
Bank 5B
Bank 5A
ENAOCT, nCLRUSR,
S2PENA_1C
S2PENA_6C
Stratix IV
Core
S2PENA_4C
OCTUSRCLK,
ENASER[N]
CB1
CB2
CB5
CB4
CB3
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 6: I/O Features in Stratix IV Devices
6–37
OCT Calibration
OCT Calibration
Figure 6–25 shows user mode signal-timing waveforms. To calibrate OCT block[N]
(where N is a calibration block number), you must assert ENAOCTone cycle before
asserting ENASER[N]. Also, nCLRUSRmust be set to low for one OCTUSRCLKcycle before
the ENASER[N]signal is asserted. Assert the ENASER[N]signals for 1000 OCTUSRCLK
cycles to perform OCTRS and OCTRT calibration. You can de-assert ENAOCTone clock
cycle after the last ENASERis de-asserted.
Serial Data Transfer
After you complete calibration, you must serially shift out the 28-bit OCT calibration
codes (14-bit OCT RS and 14-bit OCT RT) from each OCT calibration block to the
corresponding I/O buffers. Only one OCT calibration block can send out the codes at
any time by asserting only one ENASER[N]signal at a time. After you de-assert ENAOCT
,
wait at least one OCTUSRCLKcycle to enable any ENASER[N]signal to begin serial
transfer. To shift the 28-bit code from the OCT calibration block[N], you must assert
ENASER[N]for exactly 28 OCTUSRCLKcycles. Between two consecutive asserted ENASER
signals, there must be at least one OCTUSRCLKcycle gap. (Figure 6–25).
Figure 6–25. OCT User Mode Signal—Timing Waveform for One OCT Block
OCTUSRCLK
ENAOCT
Calibration Phase
nCLRUSR
28
ENASER0
1000 OCTUSRCLK Cycles
OCTUSRCLK
Cycles
t
(1)
s2p
S2PENA_1A
Note to Figure 6–25:
(1) ts2p 25 ns.
After calibrated codes are shifted in serially to each I/O bank, the calibrated codes
must be converted from serial to parallel format before being used in the I/O buffers.
Figure 6–25 shows the S2PENAsignals that can be asserted at any time to update the
calibration codes in each I/O bank. All I/O banks that received the codes from the
same OCT calibration block can have S2PENAasserted at the same time, or at a
different time, even while another OCT calibration block is calibrating and serially
shifting codes. The S2PENAsignal is asserted one OCTUSRCLKcycle after ENASERis
de-asserted for at least 25 ns. You cannot use I/Os for transmitting or receiving data
when their S2PENAis asserted for parallel codes transfer.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
6–38
Chapter 6: I/O Features in Stratix IV Devices
Termination Schemes for I/O Standards
Example of Using Multiple OCT Calibration Blocks
Figure 6–26 shows a signal timing waveform for two OCT calibration blocks doing RS
and RT calibration. Calibration blocks can start calibrating at different times by
asserting the ENASERsignals at different times. ENAOCTmust remain asserted while any
calibration is ongoing. You must set nCLRUSRlow for one OCTUSRCLKcycle before each
ENASER[N]signal is asserted. In Figure 6–26, when you set nCLRUSRto 0 for the second
time to initialize OCT calibration block 0, this does not affect OCT calibration block 1,
whose calibration is already in progress.
Figure 6–26. OCT User-Mode Signal Timing Waveform for Two OCT Blocks
OCTUSRCLK
Calibration Phase
ENAOCT
nCLRUSR
OCTUSRCLK
28
OCTUSRCLK
1000
CYCLES
ENASER0
ENASER1
CYCLES
OCTUSRCLK
CYCLES
OCTUSRCLK
28
1000
CYCLES
ts2p (1)
S2PENA_1A (2)
ts2p (1)
S2PENA_2A (3)
Notes to Figure 6–26:
(1) ts2p 25 ns.
(2) S2PENA_1A is asserted in Bank 1A for calibration block 0.
(3) S2PENA_2Ais asserted in Bank 2A for calibration block 1.
RS Calibration
If only RS calibration is used for an OCT calibration block, its corresponding ENASER
signal only requires to be asserted for 240 OCTUSRCLKcycles.
1
You must assert the ENASERsignal for 28 OCTUSRCLKcycles for serial transfer.
Termination Schemes for I/O Standards
The following sections describe the different termination schemes for the I/O
standards used in Stratix IV devices.
Single-Ended I/O Standards Termination
Voltage-referenced I/O standards require both an input reference voltage, VREF, and a
termination voltage, VTT. The reference voltage of the receiving device tracks the
termination voltage of the transmitting device.
Figure 6–27 and Figure 6–28 show the details of SSTL and HSTL I/O termination on
Stratix IV devices.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 6: I/O Features in Stratix IV Devices
6–39
Termination Schemes for I/O Standards
1
In Stratix IV devices, you cannot use series and parallel OCT simultaneously. For
more information, refer to “Dynamic On-Chip Termination” on page 6–29.
Figure 6–27. SSTL I/O Standard Termination
Termination
SSTL Class I
SSTL Class II
V
TT
V
TT
V
TT
50 Ω
25 Ω
50 Ω
50 Ω
50 Ω
External
On-Board
Termination
25 Ω
50 Ω
V
REF
V
REF
Receiver
Transmitter
Receiver
Transmitter
V
TT
V
TT
V
Stratix IV
Series OCT
TT
Stratix IV
Series OCT50 Ω
25 Ω
50 Ω 50 Ω
50 Ω
50 8Ω
OCT
Transmit
50 Ω
V
V
REF
REF
Transmitter
Receiver
Receiver
Transmitter
V
Stratix IV
Parallel OCT
CCIO
100 Ω
V
Stratix IV
Parallel OCT
100 Ω
TT
V
CCIO
50 Ω
50 8
25 Ω
25 Ω
50 Ω
OCT
Receive
V
V
REF
REF
100 Ω
Receiver
100 Ω
Transmitter
V
Series OCT
50 Ω
Receiver
Transmitter
V
CCIO
CCIO
V
V
CCIO
CCIO
Series OCT
25 Ω
OCT
in Bi-
Directional
Pins
100 Ω
100 Ω
100 Ω
100 Ω
100 Ω
100 Ω
50 Ω
50 Ω
100 Ω
100 Ω
Series
Series
OCT 50 Ω
OCT 25 Ω
Stratix IV
Stratix IV
Stratix IV
Stratix IV
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
6–40
Chapter 6: I/O Features in Stratix IV Devices
Termination Schemes for I/O Standards
Figure 6–28. HSTL I/O Standard Termination
HSTL Class II
Termination
HSTL Class I
V
V
V
TT
TT
TT
External
On-Board
Termination
50 Ω
50 Ω
50 Ω
50 Ω
50 Ω
V
V
REF
REF
Transmitter
Transmitter
Receiver
Receiver
V
V
TT
TT
V
TT
Stratix IV
Series OCT 25 Ω
Stratix IV
Series OCT50 Ω
50 Ω50 Ω
50 Ω
50 Ω
50 Ω
OCT
Transmit
V
V
REF
REF
Transmitter
Receiver
Transmitter
Receiver
V
TT
Stratix IV
Parallel OCT
V
CCIO
100 Ω
V
Stratix IV
Parallel OCT
CCIO
50 Ω
100 Ω
50 Ω
REF
50 Ω
OCT
Receive
V
V
REF
100 Ω
Receiver
100 Ω
Receiver
Transmitter
Transmitter
V
CCIO
V
V
CCIO
CCIO
V
Series OCT
50 Ω
CCIO
100 Ω
Series OCT
25 Ω
OCT
in Bi-
100 Ω
100 Ω
100 Ω
Directional
Pins
50 Ω
50 8
100 Ω
100 Ω
100 Ω
100 Ω
Series
Series
OCT 25 Ω
OCT 50 Ω
Stratix IV
Stratix IV
Stratix IV
Stratix IV
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 6: I/O Features in Stratix IV Devices
6–41
Termination Schemes for I/O Standards
Differential I/O Standards Termination
Stratix IV devices support differential SSTL-18 and SSTL-2, differential HSTL-18,
HSTL-15, HSTL-12, LVDS, LVPECL, RSDS, and mini-LVDS. Figure 6–29 through
Figure 6–35 show the details of various differential I/O terminations on these devices.
1
Differential HSTL and SSTL outputs are not true differential outputs. They use two
single-ended outputs with the second output programmed as inverted.
Figure 6–29. Differential SSTL I/O Standard Termination
Termination
Differential SSTL Class II
Differential SSTL Class I
V
V
V
TT
TT
V
TT
50 Ω
TT
50 Ω
V
V
TT
50 Ω
TT
50 Ω
50 Ω
50 Ω
25 Ω
50 Ω
External
On-Board
Termination
25 Ω
25 Ω
50 Ω
25 Ω
50 Ω
50 Ω
Transmitter
Receiver
Receiver
Transmitter
Differential SSTL Class I
Differential SSTL Class II
Series OCT 50 Ω
Series OCT 25 Ω
V
V
TT
50 Ω
Z0= 50 Ω
V
V
CCIO
100 Ω
CCIO
100 Ω
Z0= 50 Ω
Z0= 50 Ω
OCT
100 Ω
100 Ω
TT
50 Ω
Z0= 50 Ω
V
V
CCIO
CCIO
GND
100 Ω
GND
100 Ω
100 Ω
100 Ω
GND
Receiver
GND
Receiver
Transmitter
Transmitter
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
6–42
Chapter 6: I/O Features in Stratix IV Devices
Termination Schemes for I/O Standards
Figure 6–30. Differential HSTL I/O Standard Termination
Differential HSTL Class II
Termination
Differential HSTL Class I
V
V
TT V
TT
V
TT
V
TT
50 Ω
50 Ω
V
TT
TT
50 Ω
50 Ω
50 Ω
50 Ω
50 Ω
External
On-Board
Termination
50 Ω
50 Ω
50 Ω
Transmitter
Receiver
Receiver
Transmitter
Differential HSTL Class II
Differential HSTL Class I
Series OCT 25 Ω
Series OCT 50 Ω
V
TT
50 Ω
Z0= 50 Ω
V
V
CCIO
CCIO
100 Ω
100 Ω
Z0= 50 Ω
100 Ω
100 Ω
V
TT
50 Ω
Z0= 50 Ω
V
V
CCIO
CCIO
GND
GND
100 Ω
OCT
100 Ω
Z0= 50 Ω
100 Ω
100 Ω
GND
Receiver
GND
Receiver
Transmitter
Transmitter
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 6: I/O Features in Stratix IV Devices
6–43
Termination Schemes for I/O Standards
LVDS
The LVDS I/O standard is a differential high-speed, low-voltage swing, low-power,
general-purpose I/O interface standard. In Stratix IV devices, the LVDS I/O standard
requires a 2.5-V VCCIO level. The LVDS input buffer requires 2.5-V VCCPD. Use this
standard in applications requiring high-bandwidth data transfer, such as backplane
drivers and clock distribution. LVDS requires a 100- termination resistor between
the two signals at the input buffer. Stratix IV devices provide an optional 100-
differential termination resistor in the device using on-chip differential termination.
Figure 6–31 shows LVDS termination. The on-chip differential resistor is only
available in the row I/O banks.
Figure 6–31. LVDS I/O Standard Termination (Note 1)
Termination
LVDS
Differential Outputs
Differential Inputs
External On-Board
Termination
50 Ω
50 Ω
100 Ω
Differential Inputs
Differential Outputs
OCT Receive
(True LVDS
Output)
50 Ω
50 Ω
100 Ω
(2)
Stratix IV OCT
Differential Inputs
Single-Ended Outputs
OCT Receive
(Single-Ended
LVDS Output
with One-Resistor
Network,
LVDS_E_1R)
(3)
≤ 1 inch
50 Ω
50 Ω
Rp
100 Ω
External Resistor
Stratix IV OCT
Single-Ended Outputs
Differential Inputs
OCT Receive
(Single-Ended
LVDS Output
with Three-Resistor
Network,
LVDS_E_3R)
(3)
≤ 1 inch
50 Ω
50 Ω
Rs
Rp
Rs
100 Ω
External Resistor
Stratix IV OCT
Notes to Figure 6–31:
(1) For LVDS output with a three-resistor network, the RS and RP values are 120 and 170 , respectively. For LVDS output with a one-resistor network, the
RP value is 120 .
(2) Side I/O banks support true LVDS output buffers.
(3) Column and side I/O banks support LVDS_E_1R and LVDS_E_3R I/O standards using two single-ended output buffers.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
6–44
Chapter 6: I/O Features in Stratix IV Devices
Termination Schemes for I/O Standards
Differential LVPECL
In Stratix IV devices, the LVPECL I/O standard is supported on input clock pins on
column and row I/O banks. LVPECL output operation is not supported in Stratix IV
devices. LVDS input buffers are used to support LVPECL input operation. AC
coupling is required when the LVPECL common-mode voltage of the output buffer is
higher than the LVPECL input common-mode voltage. Figure 6–32 shows the
AC-coupled termination scheme. The 50- resistors used at the receiver end are
external to the device.
Figure 6–32. LVPECL AC-Coupled Termination (Note 1)
Altera FPGA
Stratix IV LVPECL
LVPECL Output Buffer
Input Buffer
0.1 μF
Z
Z
= 50 Ω
= 50 Ω
O
O
VICM
50 Ω
50 Ω
0.1 μF
Note to Figure 6–32:
(1) The LVPECL AC-coupled termination is applicable only when you use an Altera FPGA LVPECL transmitter.
DC-coupled LVPECL is supported if the LVPECL output common mode voltage is
within the Stratix IV LVPECL input buffer specification (Figure 6–33).
Figure 6–33. LVPECL DC-Coupled Termination (Note 1)
Altera FPGA
LVPECL Output Buffer
Stratix IV LVPECL
Input Buffer
Z
Z
= 50 Ω
= 50 Ω
O
100 Ω
O
Note to Figure 6–33:
(1) The LVPECL DC-coupled termination is applicable only when you use an Altera FPGA LVPECL transmitter.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 6: I/O Features in Stratix IV Devices
6–45
Termination Schemes for I/O Standards
RSDS
Stratix IV devices support the RSDS output standard with data rates up to 230 Mbps
using LVDS output buffer types. For transmitters, use two single-ended output
buffers with the external one- or three-resistor networks in the column I/O bank, as
shown in Figure 6–34. The one-resistor topology is for data rates up to 200 Mbps. The
three-resistor topology is for data rates above 200 Mbps. The row I/O banks support
RSDS output using true LVDS output buffers without an external resistor network.
Figure 6–34. RSDS I/O Standard Termination (Note 1)
One-Resistor Network (RSDS_E_1R)
Termination
Three-Resistor Network (RSDS_E_3R)
≤1 inch
≤1 inch
R
S
Ω
Ω
50
50
50
50
External
On-Board
Termination
R
100
Ω
P
R
100
Ω
P
Ω
R
S
Receiver
Transmitter
Transmitter
Receiver
Stratix IV OCT
Stratix IV OCT
≤
1 inch
≤1 inch
R
S
50
50
50
50
Ω
Ω
R
100
Ω
R
P
P
Ω
100
Ω
OCT
R
S
Transmitter
Transmitter
Receiver
Receiver
Note to Figure 6–34:
(1) The RS and RP values are pending characterization.
A resistor network is required to attenuate the LVDS output-voltage swing to meet
RSDS specifications. You can modify the three-resistor network values to reduce
power or improve noise margin. The resistor values chosen must satisfy Equation 6–1.
Equation 6–1.
R
p
R
------
s
2
-------------------- = 50
R
p
s + ------
2
R
1
Altera recommends performing additional simulations using IBIS models to validate
that custom resistor values meet the RSDS requirements.
f
For more information about the RSDS I/O standard, refer to the RSDS Specification
from the National Semiconductor website at www.national.com.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
6–46
Chapter 6: I/O Features in Stratix IV Devices
Design Considerations
Mini-LVDS
Stratix IV devices support the mini-LVDS output standard with data rates up to
340 Mbps using LVDS output buffer types. For transmitters, use two single-ended
output buffers with external one- or three-resistor networks, as shown in Figure 6–35.
The one-resistor topology is for data rates up to 200 Mbps. The three-resistor topology
is for data rates above 200 Mbps. The row I/O banks support mini-LVDS output using
true LVDS output buffers without an external resistor network.
Figure 6–35. Mini-LVDS I/O Standard Termination (Note 1)
One-Resistor Network (mini-LVDS_E_1R)
Three-Resistor Network (mini-LVDS_E_3R)
Termination
≤1 inch
≤1 inch
R
External
On-Board
Termination
S
50
50
Ω
Ω
50
50
Ω
Ω
R
R
Ω
100
Ω
100
P
P
R
S
Receiver
Transmitter
Transmitter
Receiver
Stratix IV OCT
Stratix IV OCT
1 inch
≤
≤1 inch
R
S
50
50
Ω
50
Ω
R
100
Ω
R
P
Ω
100
P
Ω
Ω
50
R
S
OCT
Transmitter
Transmitter
Receiver
Receiver
Note to Figure 6–35:
(1) The RS and RP values are pending characterization.
A resistor network is required to attenuate the LVDS output voltage swing to meet the
mini-LVDS specifications. You can modify the three-resistor network values to reduce
power or improve noise margin. The resistor values chosen must satisfy Equation 6–1
on page 6–45.
1
Altera recommends that you perform additional simulations using IBIS models to
validate that custom resistor values meet the RSDS requirements.
f
For more information about the mini-LVDS I/O standard, see the mini-LVDS
Specification from the Texas Instruments website at www.ti.com.
Design Considerations
Although Stratix IV devices feature various I/O capabilities for high-performance
and high-speed system designs, there are several other design considerations that
require your attention to ensure the success of your designs.
I/O Bank Restrictions
Each I/O bank can simultaneously support multiple I/O standards. The following
sections provide guidelines for mixing non-voltage-referenced and voltage-referenced
I/O standards in Stratix IV devices.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 6: I/O Features in Stratix IV Devices
6–47
Design Considerations
Non-Voltage-Referenced Standards
Each I/O bank of a Stratix IV device has its own VCCIOpins and supports only one
CCIO, either 1.2, 1.5, 1.8, 2.5, or 3.0 V. An I/O bank can simultaneously support any
V
number of input signals with different I/O standard assignments if it meets the VCCIO
and VCCPD requirement, as shown in Table 6–2 on page 6–3.
For output signals, a single I/O bank supports non-voltage-referenced output signals
that are driving at the same voltage as VCCIO. Because an I/O bank can only have one
V
CCIO value, it can only drive out that one value for non-voltage-referenced signals.
For example, an I/O bank with a 2.5-V VCCIO setting can support 2.5-V standard
inputs and outputs as well as 3.0-V LVCMOS inputs (but not output or bidirectional
pins).
Voltage-Referenced Standards
To accommodate voltage-referenced I/O standards, each Stratix IV device’s I/O bank
supports multiple VREFpins feeding a common VREF bus. The number of available
VREFpins increases as device density increases. If these pins are not used as VREFpins,
they cannot be used as generic I/O pins and must be tied to VCCIO or GND. Each bank
can only have a single VCCIO voltage level and a single VREF voltage level at a given
time.
An I/O bank featuring single-ended or differential standards can support
voltage-referenced standards if all voltage-referenced standards use the same VREF
setting.
For performance reasons, voltage-referenced input standards use their own VCCPD
level as the power source. This feature allows you to place voltage-referenced input
signals in an I/O bank with a VCCIO of 2.5 V or below. For example, you can place
HSTL-15 input pins in an I/O bank with 2.5-V VCCIO. However, the voltage-referenced
input with parallel OCT enabled requires the VCCIO of the I/O bank to match the
voltage of the input standard.
Voltage-referenced bidirectional and output signals must be the same as the I/O
bank’s VCCIO voltage. For example, you can only place SSTL-2 output pins in an I/O
bank with a 2.5-V VCCIO
.
Mixing Voltage-Referenced and Non-Voltage-Referenced Standards
An I/O bank can support both voltage-referenced and non-voltage-referenced pins by
applying each of the rule sets individually. For example, an I/O bank can support
SSTL-18 inputs and 1.8-V inputs and outputs with a 1.8-V VCCIO and a 0.9-V VREF
Similarly, an I/O bank can support 1.5-V standards, 1.8-V inputs (but not outputs),
and HSTL and HSTL-15 I/O standards with a 1.5-V VCCIO and 0.75-V VREF
.
.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
6–48
Chapter 6: I/O Features in Stratix IV Devices
Design Considerations
Document Revision History
Table 6–13 lists the revision history for this chapter.
Table 6–13. Document Revision History
Date
Version
Changes
■ Updated the “Modular I/O Banks”, “On-Chip Termination Support and I/O Termination
Schemes”, “Dynamic On-Chip Termination”, and “Programmable Pull-Up Resistor”
sections.
February 2011
3.2
■ Updated Figure 6–17, Figure 6–32 and Figure 6–33.
■ Applied new template.
■ Minor text edits.
■ Updated Table 6–2 and Table 6–5.
■ Updated Figure 6–18, Figure 6–19, Figure 6–27, Figure 6–28, and Figure 6–31.
■ Added the “Summary of OCT Assignments” section.
■ Added a note to the “Sharing an OCT Calibration Block on Multiple I/O Banks” section.
■ Updated the “OCT Calibration” section.
March 2010
3.1
■ Minor text edits.
■ Updated Table 6–2, Table 6–4, Table 6–6, Table 6–9, and Table 6–10.
■ Updated Figure 6–1, Figure 6–2, Figure 6–4, Figure 6–5, Figure 6–6, Figure 6–8,
Figure 6–9, Figure 6–10, Figure 6–11, Figure 6–12, Figure 6–13, and Figure 6–31.
■ Added Table 6–8.
■ Added Figure 6–7, Figure 6–14, Figure 6–15, and Figure 6–16.
■ Added “Left-Shift Series Termination Control” and “Expanded On-Chip Series Termination
November 2009
3.0
with Calibration” sections.
■ Updated “MultiVolt I/O Interface”, “RSDS”, “Mini-LVDS”, and “Non-Voltage-Referenced
Standards” sections.
■ Deleted Figure 6-5: Number of I/Os in Each Bank in EP4SE290 and EP4SE360 in the
1517-Pin FineLine BGA Package.
■ Minor text edits.
■ Added introductory sentences to improve search ability.
■ Removed the Conclusion section.
June 2009
April 2009
2.3
2.2
■ Updated Figure 6–2.
■ Updated Table 6–8 and Table 6–9.
■ Deleted Figure 6-14.
■ Updated Table 6–1, Table 6–2,Table 6–3, Table 6–4, Table 6–6, Table 6–8, and Table 6–9.
■ Updated Figure 6–2, Figure 6–7, Figure 6–8, Figure 6–9, Figure 6–10, Figure 6–11, and
Figure 6–12.
March 2009
2.1
■ Added Figure 6–14.
■ Removed Equation 6–2 and “Referenced Documents” section.
■ Updated “Modular I/O Banks” on page 6–7.
■ Updated Figure 6–3 and Figure 6–21.
■ Made minor editorial changes.
November 2008
May 2008
2.0
1.0
Initial release.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
7. External Memory Interfaces in
Stratix IV Devices
February 2011
SIV51007-3.2
SIV51007-3.2
This chapter describes external memory interfaces available with the Stratix IV
device family and that family’s silicon capability to support external memory
interfaces. To support the level of system bandwidth achievable with Altera
Stratix IV FPGAs, the devices provide an efficient architecture to quickly and easily fit
wide external memory interfaces within their small modular I/O bank structure. The
I/Os are designed to provide high-performance support for existing and emerging
external double data rate (DDR) memory standards, such as DDR3, DDR2, DDR
SDRAM, QDR II+, QDR II SRAM, and RLDRAM II.
Stratix IV I/O elements provide easy-to-use built-in functionality required for a rapid
and robust implementation with features such as dynamic calibrated on-chip
termination (OCT), trace mismatch compensation, read- and write-leveling circuit for
DDR3 SDRAM interfaces, half data rate (HDR) blocks, and 4- to 36-bit programmable
DQ group widths.
The high-performance memory interface solution is backed-up by a self-calibrating
megafunction (ALTMEMPHY), optimized to take advantage of the Stratix IV I/O
structure and the TimeQuest Timing Analyzer, which completes the picture by
providing the total solution for the highest reliable frequency of operation across
process, voltage, and temperature (PVT) variations.
This chapter contains the following sections:
■
“Memory Interfaces Pin Support” on page 7–3
■
“Stratix IV External Memory Interface Features” on page 7–29
f
For more information about external memory system performance specifications,
board design guidelines, timing analysis, simulation, and debugging information,
refer to the External Memory Interface Handbook.
© 2011 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX are Reg. U.S. Pat. & Tm. Off.
and/or trademarks of Altera Corporation in the U.S. and other countries. All other trademarks and service marks are the property of their respective holders as described at
www.altera.com/common/legal.html. Altera warrants performance of its semiconductor products to current specifications in accordance with Altera’s standard warranty, but
reserves the right to make changes to any products and services at any time without notice. Altera assumes no responsibility or liability arising out of the application or use of any
information, product, or service described herein except as expressly agreed to in writing by Altera. Altera customers are advised to obtain the latest version of device
specifications before relying on any published information and before placing orders for products or services.
Stratix IV Device Handbook Volume 1
February 2011
Subscribe
7–2
Chapter 7: External Memory Interfaces in Stratix IV Devices
Figure 7–1 shows an overview of the memory interface data path that uses all the
Stratix IV I/O element (IOE) features.
Figure 7–1. External Memory Interface Data Path Overview (Note 1), (2)
Memory
Stratix IV FPGA
DQS Logic
Block
DLL
DQS (Read) (3)
Postamble Enable
Postamble
DQS Enable
Circuit
Control
Postamble Clock
Circuit
4n
2n
2n
Alignment &
Synchronization
Registers
DPRAM
(2)
Half Data Rate
Input Registers
DDR Input
Registers
n
DQ (Read) (3)
DQ (Write) (3)
Resynchronization Clock
2n
n
4n
2n
DDR Output
and Output
Enable
Half Data Rate
Output Registers
Alignment
Registers
Registers
Half-Rate
Resynchronization
Clock
DQS (Write) (3)
4
2
2
DDR Output
and Output
Enable
Half Data Rate
Output Registers
Alignment
Registers
DQ Write Clock
Half-Rate Clock
Alignment Clock
DQS Write Clock
Clock Management & Reset
Registers
Notes to Figure 7–1:
(1) You can bypass each register block.
(2) The blocks used for each memory interface may differ slightly. The shaded blocks are part of the Stratix IV IOE.
(3) These signals may be bidirectional or unidirectional, depending on the memory standard. When bidirectional, the signal is active during both read
and write operations.
Memory interfaces use Stratix IV device features such as delay-locked loops (DLLs),
dynamic OCT control, read- and write-leveling circuitry, and I/O features such as
OCT, programmable input delay chains, programmable output delay, slew rate
adjustment, and programmable drive strength.
f
f
For more information about I/O features, refer to the I/O Features in Stratix IV Devices
chapter.
The ALTMEMPHY megafunction instantiates a phase-locked loop (PLL) and PLL
reconfiguration logic to adjust the phase shift based on VT variation. vs
For more information about the Stratix IV PLL, refer to the Clock Networks and PLLs in
Stratix IV Devices chapter. For more information about the ALTMEMPHY
megafunction, refer to the External Memory PHY Interface (ALTMEMPHY) (nonAFI)
Megafunction User Guide.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 7: External Memory Interfaces in Stratix IV Devices
7–3
Memory Interfaces Pin Support
Memory Interfaces Pin Support
A typical memory interface requires data (D, Q, or DQ), data strobe (DQS/CQ and
DQSn/CQn), address, command, and clock pins. Some memory interfaces use data
mask (DM, BWSn, or NWSn) pins to enable write masking and QVLD pins to indicate
that the read data is ready to be captured. This section describes how Stratix IV
devices support all these different pins.
1
If you have more than one clock pair, you must place them in the same DQ group. For
example, if you have two clock pairs, you must place both of them in the same ×4
DQS group.
f
f
For more information about pin connections, refer to the Stratix IV GX and Stratix IV E
Device Family Pin Connection Guidelines.
For more information about pin planning and pin connections between a Stratix IV
device and an external memory device, refer to the External Memory Interface
Handbook.
DDR3, DDR2, DDR SDRAM, and RLDRAM II devices use the CK and CK# signals to
capture the address and command signals. Generate these signals to mimic the
write-data strobe using Stratix IV DDR I/O registers (DDIOs) to ensure that the
timing relationships between the CK/CK# and DQS signals (tDQSS, tDSS, and tDSH in
DDR3, DDR2, and DDR SDRAM devices or tCKDK in RLDRAM II devices) are met.
QDR II+ and QDR II SRAM devices use the same clock (K/K#) to capture write data,
address, and command signals.
Memory clock pins in Stratix IV devices are generated using a DDIO register going to
differential output pins (refer to Figure 7–2), marked in the pin table with DIFFOUT
,
DIFFIO_TX, or DIFFIO_RXprefixes.
f
For more information about which pins to use for memory clock pins, refer to the
External Memory Interface Handbook.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
7–4
Chapter 7: External Memory Interfaces in Stratix IV Devices
Memory Interfaces Pin Support
Figure 7–2. Memory Clock Generation
FPGA LEs
I/O Elements
V
CC
D
D
Q
Q
mem_clk (2)
1
0
mem_clk_n (2)
System Clock (3)
Notes to Figure 7–2:
(1) For pin location requirements,refer to the External Memory Interface Handbook.
(2) The mem_clk[0]and mem_clk_n[0]pins for DDR3, DDR2, and DDR SDRAM interfaces use the I/O input buffer for feedback required by
the ALTMEMPHY megafunction for tracking; therefore, use bidirectional I/O buffers for these pins. For memory interfaces using a differential DQS
input, the input feedback buffer is configured as differential input. For memory interfaces using a single-ended DQS input, the input buffer is
configured as a single-ended input. Using a single-ended input feedback buffer requires that I/O standard’s VREF voltage is provided to that I/O
bank’s VREF pins.
(3) To minimize jitter, regional clock networks are required for memory output clock generation.
Stratix IV devices offer differential input buffers for differential read-data strobe and
clock operations. In addition, Stratix IV devices also provide an independent DQS
logic block for each CQn pin for complementary read-data strobe and clock
operations. In the Stratix IV pin tables, the differential DQS pin pairs are denoted as
DQS and DQSn pins, while the complementary CQ signals are denoted as CQ and
CQn pins. DQSn and CQn pins are marked separately in the pin table. Each CQn pin
connects to a DQS logic block and the shifted CQn signals go to the negative-edge
input registers in the DQ IOE registers.
1
1
Use differential DQS signaling for DDR2 SDRAM interfaces running at or above
333 MHz.
DQ pins can be bidirectional signals, as in DDR3, DDR2, and DDR SDRAM, and
RLDRAM II common I/O (CIO) interfaces, or unidirectional signals, as in QDR II+,
QDR II SRAM, and RLDRAM II separate I/O (SIO) devices. Connect the
unidirectional read-data signals to Stratix IV DQ pins and the unidirectional
write-data signals to a different DQS/DQ group than the read DQS/DQ group.
Furthermore, the write clocks must be assigned to the DQS/DQSn pins associated to
this write DQS/DQ group. Do not use the CQ/CQn pin-pair for write clocks.
Using a DQS/DQ group for the write-data signals minimizes output skew, allows
access to the write-leveling circuitry (for DDR3 SDRAM interfaces), and allows
vertical migration. These pins also have access to deskewing circuitry (using
programmable delay chains) that can compensate for delay mismatch between signals
on the bus.
The DQS and DQ pin locations are fixed in the pin table. Memory interface circuitry is
available in every Stratix IV I/O bank that does not support transceivers. All the
memory interface pins support the I/O standards required to support DDR3, DDR2,
DDR SDRAM, QDR II+, QDR II SRAM, and RLDRAM II devices.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 7: External Memory Interfaces in Stratix IV Devices
7–5
Memory Interfaces Pin Support
The Stratix IV device family supports DQS and DQ signals with DQ bus modes of ×4,
×8/×9, ×16/×18, or ×32/×36, although not all devices support DQS bus mode
×32/×36. When any of these pins are not used for memory interfacing, you can use
them as user I/Os. In addition, you can use any DQSn or CQn pins not used for
clocking as DQ (data) pins. Table 7–1 lists pin support per DQS/DQ bus mode,
including the DQS/CQ and DQSn/CQn pin pair.
Table 7–1. Stratix IV DQS/DQ Bus Mode Pins
Typical
Number of
Data Pins
per Group
Maximum
Number of
Data Pins
Parity or DM
(Optional)
QVLD
(Optional) (1)
Mode
DQSn Support
CQn Support
per Group (2)
×4
Yes
Yes
Yes
Yes
Yes
No
Yes
Yes
Yes
Yes
No (6)
Yes
No
Yes
Yes
Yes
Yes
4
5
×8/×9 (3)
8 or 9
11
23
47
39
×16/×18 (4)
×32/×36 (5)
×32/×36 (7)
Notes to Table 7–1:
Yes
16 or 18
32 or 36
32 or 36
Yes
No (8)
(1) The QVLD pin is not used in the ALTMEMPHY megafunction.
(2) This represents the maximum number of DQ pins (including parity, data mask, and QVLD pins) connected to the DQS bus network with
single-ended DQS signaling. When you use differential or complementary DQS signaling, the maximum number of data per group decreases
by one. This number may vary per DQS/DQ group in a particular device. Check the pin table for the exact number per group. For DDR3, DDR2,
and DDR interfaces, the number of pins is further reduced for an interface larger than ×8 due to the need of one DQS pin for each ×8/×9 group
that is used to form the x16/×18 and ×32/×36 groups.
(3) Two ×4 DQS/DQ groups are stitched to make a ×8/×9 group so there are a total of 12 pins in this group.
(4) Four ×4 DQS/DQ groups are stitched to make a ×16/×18 group.
(5) Eight ×4 DQS/DQ groups are stitched to make a ×32/×36 group.
(6) The DM pin can be supported if differential DQS is not used and the group does not have additional signals.
(7) These ×32/×36 DQS/DQ groups are available in EP4SGX290, EP4SGX360, and EP4SGX530 devices in 1152- and 1517-pin FineLine BGA
packages. There are 40 pins in each of these DQS/DQ groups.
(8) There are 40 pins in each of these DQS/DQ groups. The BWSn pins cannot be placed within the same DQS/DQ group as the write data pins
because of insufficient pins available.
Table 7–2 lists the number of DQS/DQ groups available per side in each Stratix IV
device. For a more detailed listing of the number of DQS/DQ groups available per
bank in each Stratix IV device, see Figure 7–3 through Figure 7–19. These figures
represent the die-top view of the Stratix IV device.
Table 7–2. Number of DQS/DQ Groups in Stratix IV Devices per Side (Part 1 of 3) (Note 1)
Device
EP4SGX70
EP4SGX110
EP4SGX180
EP4SGX230
Package
Side
Left
×4 (2)
14
×8/×9
×16/×18
×32/×36 (3)
Refer to:
6
8
2
2
0
0
780-pin
FineLine BGA
Top/Bottom
17
Figure 7–3
Right
0
0
0
0
Left/Right
Top/Bottom
Left/Right
0
0
8
6
8
0
2
2
2
0
0
0
0
EP4SGX290
EP4SGX360
780-pin
FineLine BGA
Figure 7–5
Figure 7–4
18
14
17
EP4SE230
EP4SE360
780-pin
FineLine BGA
Top/Bottom
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
7–6
Chapter 7: External Memory Interfaces in Stratix IV Devices
Memory Interfaces Pin Support
Table 7–2. Number of DQS/DQ Groups in Stratix IV Devices per Side (Part 2 of 3) (Note 1)
Device
Package
1152-pin
Side
×4 (2)
×8/×9
×16/×18
×32/×36 (3)
Refer to:
Right/Left
7
3
1
0
FineLine BGA
(with 16
transceivers)
EP4SGX110
Figure 7–6
Top/Bottom
Right/Left
17
14
17
8
6
8
2
2
2
0
0
0
1152-pin
FineLine BGA
(with 24
EP4SGX70
EP4SGX110
Figure 7–7
Top/Bottom
transceivers)
Right/Left
Top/Bottom
Right/Left
13
26
13
6
12
6
2
4
2
0
0
0
EP4SGX180
EP4SGX230
1152-pin
FineLine BGA
Figure 7–8
Figure 7–9
EP4SGX290
EP4SGX360
EP4SGX530
1152-pin
FineLine BGA
Top/Bottom
26
12
4
2 (4)
EP4SE360
EP4SE530
EP4SE820
1152-pin
FineLine BGA
All sides
26
12
4
0
Figure 7–10
Figure 7–11
Figure 7–12
EP4SGX180
EP4SGX230
1517-pin
FineLine BGA
All sides
26
12
4
0
EP4SGX290
EP4SGX360
EP4SGX530
Right/Left
26
26
12
12
4
4
0
1517-pin
FineLine BGA
Top/Bottom
2 (4)
Right/Left
Top/Bottom
Left
34
38
12
26
16
18
3
6
8
1
4
0
4
0
0
EP4SE530
EP4SE820
1517-pin
FineLine BGA
Figure 7–13
Figure 7–14
EP4S40G2
EP4S40G5
EP4S100G2
EP4S100G5
1517-pin
FineLine BGA
Top/Bottom
12
Right
11
26
4
1
4
0
0
EP4SGX290
EP4SGX360
EP4SGX530
Right/Left
12
1760-pin
FineLine BGA
Figure 7–15
Top/Bottom
38
18
8
4
Right/Left
Top/Bottom
Right/Left
Top/Bottom
Right/Left
34
38
40
44
29
16
18
18
22
13
6
8
0
4
0
4
0
1760-pin
FineLine BGA
EP4SE530
EP4SE820
Figure 7–16
Figure 7–17
6
1760-pin
FineLine BGA
10
4
EP4SGX290
EP4SGX360
EP4SGX530
1932-pin
FineLine BGA
Figure 7–18
Top/Bottom
38
18
8
4
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 7: External Memory Interfaces in Stratix IV Devices
7–7
Memory Interfaces Pin Support
Table 7–2. Number of DQS/DQ Groups in Stratix IV Devices per Side (Part 3 of 3) (Note 1)
Device
Package
Side
Left
×4 (2)
×8/×9
×16/×18
×32/×36 (3)
Refer to:
8
38
7
2
18
1
0
8
0
0
4
0
EP4S100G3
EP4S100G4
EP4S100G5
1932-pin
FineLine BGA
Top/Bottom
Right
Figure 7–19
Notes to Table 7–2:
(1) These numbers are preliminary until the devices are available.
(2) Some of the ×4 groups may use RUP and RDN pins. You cannot use these groups if you use the Stratix IV calibrated OCT feature.
(3) To interface with a ×36 QDR II+/QDR II SRAM device in a Stratix IV FPGA that does not support the ×32/×36 DQS/DQ group, refer to “Combining
×16/×18 DQS/DQ Groups for a ×36 QDR II+/QDR II SRAM Interface” on page 7–26.
(4) These ×32/×36 DQS/DQ groups have 40 pins instead of 48 pins per group. BWSn pins cannot be placed within the same DQS/DQ group as the
write data pins because of insufficient pins available.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
7–8
Chapter 7: External Memory Interfaces in Stratix IV Devices
Memory Interfaces Pin Support
Figure 7–3. Number of DQS/DQ Groups per Bank in EP4SGX70, EP4SGX110, EP4SGX180, and EP4SGX230 Devices in the
780-Pin FineLine BGA Package (Note 1), (2), (3), (4). (5)
I/O Bank 8A
I/O Bank 7C
I/O Bank 8C
I/O Bank 7A
24 User I/Os
x4=3
x8/x9=1
24 User I/Os
x4=2
x8/x9=1
40 User I/Os
x4=6
x8/x9=3
40 User I/Os
x4=6
x8/x9=3
DLL3
DLL0
x16/x18=0
x16/x18=0
x16/x18=1
x16/x18=1
I/O Bank 1A
32 User I/Os
x4=4
x8/x9=2
x16/x18=1
I/O Bank 1C
26 User I/Os
x4=3
x8/x9=1
x16/x18=0
EP4SGX70, EP4SGX110, EP4SGX180, and
EP4SGX230 Devices in the
780-Pin FineLine BGA
I/O Bank 2C
26 User I/Os
x4=3
x8/x9=1
x16/x18=0
I/O Bank 2A
32 User I/Os
x4=4
x8/x9=2
x16/x18=1
I/O Bank 3C
I/O Bank 4C
I/O Bank 4A
I/O Bank 3A
24 User I/Os
x4=3
x8/x9=1
24 User I/Os
x4=2
x8/x9=1
40 User I/Os
x4=6
x8/x9=3
40 User I/Os
x4=6
x8/x9=3
DLL1
DLL2
x16/x18=0
x16/x18=0
x16/x18=1
x16/x18=1
Notes to Figure 7–3:
(1) These numbers are preliminary until the devices are available.
(2) EP4SGX70, EP4SGX110, EP4SGX180, and EP4SGX230 devices do not support ×32/×36 mode. To interface with a ×36 QDR II+/QDR II SRAM
device, refer to “Combining ×16/×18 DQS/DQ Groups for a ×36 QDR II+/QDR II SRAM Interface” on page 7–26.
(3) You can also use DQS/DQSn pins in some of the ×4 groups as RUP and RDN pins, but you cannot use a ×4 group for memory interfaces if two pins
of the ×4 group are used as RUP and RDN pins for OCT calibration. If two pins of a ×4 group are used as RUP and RDN pins for OCT calibration, you
can use the ×16/×18 or ×32/×36 groups that include that ×4 group; however, there are restrictions on using ×8/×9 groups that include that ×4
group.
(4) You can also use some of the DQS/DQ pins in I/O Bank 1C as configuration pins. You cannot use a ×4 DQS/DQ group with any of its pin members
used for configuration purposes. Ensure that the DQS/DQ groups that you have chosen are not also used for configuration because you may lose
up to four ×4 DQS/DQ groups, depending on your configuration scheme.
(5) All I/O pin counts include dedicated clock inputs that you can use for data inputs.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 7: External Memory Interfaces in Stratix IV Devices
7–9
Memory Interfaces Pin Support
Figure 7–4. Number of DQS/DQ Groups per Bank in EP4SE230 and EP4SE360 Devices in the 780-Pin FineLine BGA
Package (Note 1), (2), (3), (4), (5)
I/O Bank 7C
I/O Bank 7A
I/O Bank 8A
I/O Bank 8C
24 User I/Os
x4=3
x8/x9=1
40 User I/Os
x4=6
x8/x9=3
24 User I/Os
x4=2
x8/x9=1
40 User I/Os
x4=6
x8/x9=3
DLL3
DLL0
x16/x18=0
x16/x18=1
x16/x18=0
x16/x18=1
I/O Bank 1A
I/O Bank 6A
32 User I/Os
x4=4
32 User I/Os
x4=4
x8/x9=2
x8/x9=2
x16/x18=1
x16/x18=1
I/O Bank 1C
I/O Bank 6C
26 User I/Os
x4=3
26 User I/Os
x4=3
x8/x9=1
x8/x9=1
x16/x18=0
x16/x18=0
EP4SE230 and EP4SE360 Devices in the
780-Pin FineLine BGA
I/O Bank 2C
I/O Bank 5C
26 User I/Os
x4=3
26 User I/Os
x4=3
x8/x9=1
x8/x9=1
x16/x18=0
x16/x18=0
I/O Bank 2A
I/O Bank 5A
32 User I/Os
x4=4
x8/x9=2
32 User I/Os
x4=4
x8/x9=2
x16/x18=1
x16/x18=1
I/O Bank 3C
I/O Bank 4A
I/O Bank 3A
I/O Bank 4C
24 User I/Os
x4=2
x8/x9=1
40 User I/Os
x4=6
x8/x9=3
40 User I/Os
x4=6
x8/x9=3
24 User I/Os
x4=3
x8/x9=1
DLL1
DLL2
x16/x18=0
x16/x18=0
x16/x18=1
x16/x18=1
Notes to Figure 7–4:
(1) These numbers are preliminary until the devices are available.
(2) EP4SE230 and EP4SE360 devices do not support ×32/×36 mode. To interface with a ×36 QDR II+/QDR II SRAM device, refer to “Combining
×16/×18 DQS/DQ Groups for a ×36 QDR II+/QDR II SRAM Interface” on page 7–26.
(3) You can also use DQS/DQSn pins in some of the ×4 groups as RUP and RDN pins, but you cannot use a ×4 group for memory interfaces if two pins
of the ×4 group are used as RUP and RDN pins for OCT calibration. If two pins of a ×4 group are used as RUP and RDN pins for OCT calibration, you
can use the ×16/×18 or ×32/×36 groups that include that ×4 group; however, there are restrictions on using ×8/×9 groups that include that ×4
group.
(4) You can also use some of the DQS/DQ pins in I/O Bank 1C as configuration pins. You cannot use a ×4 DQS/DQ group with any of its pin members
used for configuration purposes. Ensure that the DQS/DQ groups that you have chosen are not also used for configuration because you may lose
up to four ×4 DQS/DQ groups, depending on your configuration scheme.
(5) All I/O pin counts include dedicated clock inputs that you can use for data inputs.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
7–10
Chapter 7: External Memory Interfaces in Stratix IV Devices
Memory Interfaces Pin Support
Figure 7–5. Number of DQS/DQ Groups per Bank in EP4SGX290 and EP4SGX360 Devices in the 780-Pin FineLine BGA
Package (Note 1), (2)
I/O Bank 7C
I/O Bank 8A
I/O Bank 8C
I/O Bank 7A
32 User I/Os
x4=3
x8/x9=1
40 User I/Os
x4=6
x8/x9=3
32 User I/Os
x4=3
x8/x9=1
40 User I/Os
x4=6
x8/x9=3
DLL3
DLL0
x16/x18=0
x16/x18=1
x16//x18=0
x16/x18=1
EP4SGX290 and EP4SGX360 Devices
in the 780-Pin FineLine BGA
I/O Bank 3A
I/O Bank 3C
I/O Bank 4C
I/O Bank 4A
40 User I/Os
x4=6
x8/x9=3
32 User I/Os
x4=3
x8/x9=1
32 User I/Os
x4=3
x8/x9=1
40 User I/Os
x4=6
x8/x9=3
DLL2
DLL1
x16/x18=1
x16/x18=0
x16/x18=0
x16/x18=1
Notes to Figure 7–5:
(1) These numbers are preliminary until the devices are available.
(2) EP4SGX290 and EP4SGX360 devices do not support ×32/×36 mode. To interface with a ×36 QDR II+/QDR II SRAM device, refer to “Combining
×16/×18 DQS/DQ Groups for a ×36 QDR II+/QDR II SRAM Interface” on page 7–26.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 7: External Memory Interfaces in Stratix IV Devices
7–11
Memory Interfaces Pin Support
Figure 7–6. Number of DQS/DQ Groups per Bank in EP4SGX110 Devices with 16 Transceivers in the 1152-Pin FineLine
BGA Package (Note 1), (2), (3), (4), (5)
I/O Bank 7A
I/O Bank 8A
I/O Bank 7C
I/O Bank 8C
24 User I/Os
x4=3
x8/x9=1
24 User I/Os
x4=2
x8/x9=1
40 User I/Os
x4=6
x8/x9=3
40 User I/Os
x4=6
x8/x9=3
DLL0
DLL3
x16/x18=0
x16/x18=0
x16/x18=1
x16/x18=1
I/O Bank 1A
I/O Bank 6A
32 User I/Os
x4=4
x8/x9=2
32 User I/Os
x4=4
x8/x9=2
x16/x18=1
x16/x18=1
EP4SGX110 Devices
in the 1152-Pin FineLine BGA
(with 16 Transceivers)
I/O Bank 1C
I/O Bank 6C
26 User I/Os
x4=3
x8/x9=1
26 User I/Os
x4=3
x8/x9=1
x16/x18=0
x16/x18=0
I/O Bank 3C
I/O Bank 4C
I/O Bank 4A
I/O Bank 3A
24 User I/Os
x4=3
x8/x9=1
24 User I/Os
x4=2
x8/x9=1
40 User I/Os
x4=6
x8/x9=3
40 User I/Os
x4=6
x8/x9=3
DLL1
DLL2
x16/x18=0
x16/x18=0
x16/x18=1
x16/x18=1
Notes to Figure 7–6:
(1) These numbers are preliminary until the devices are available.
(2) EP4SGX110 devices do not support ×32/×36 mode. To interface with a ×36 QDR II+/QDR II SRAM device, refer to “Combining ×16/×18 DQS/DQ
Groups for a ×36 QDR II+/QDR II SRAM Interface” on page 7–26.
(3) You can also use DQS/DQSn pins in some of the ×4 groups as RUP and RDN pins, but you cannot use a ×4 group for memory interfaces if two pins
of the ×4 group are used as RUP and RDN pins for OCT calibration. If two pins of a ×4 group are used as RUP and RDN pins for OCT calibration, you
can use the ×16/×18 or ×32/×36 groups that include that ×4 group; however, there are restrictions on using ×8/×9 groups that include that ×4
group.
(4) You can also use some of the DQS/DQ pins in I/O Bank 1C as configuration pins. You cannot use a ×4 DQS/DQ group with any of its pin members
used for configuration purposes. Ensure that the DQS/DQ groups that you have chosen are not also used for configuration because you may lose
up to four ×4 DQS/DQ groups, depending on your configuration scheme.
(5) All I/O pin counts include dedicated clock inputs that you can use for data inputs.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
7–12
Chapter 7: External Memory Interfaces in Stratix IV Devices
Memory Interfaces Pin Support
Figure 7–7. Number of DQS/DQ Groups per Bank in EP4SGX70 and EP4SGX110 Devices with 24 Transceivers in the
1152-Pin FineLine BGA Package (Note 1), (2), (3), (4), (5)
I/O Bank 7A (3)
I/O Bank 8A (3)
I/O Bank 7C
I/O Bank 8C
24 User I/Os
x4=3
x8/x9=1
24 User I/Os
x4=2
x8/x9=1
40 User I/Os
x4=6
x8/x9=3
40 User I/Os
x4=6
x8/x9=3
DLL3
DLL0
x16/x18=0
x16/x18=0
x16/x18=1
x16/x18=1
I/O Bank 1A (3)
I/O Bank 6A (3)
32 User I/Os
x4=4
x8/x9=2
32 User I/Os
x4=4
x8/x9=2
x16/x18=1
x16/x18=1
I/O Bank 1C (4)
I/O Bank 6C
26 User I/Os (5)
x4=3
x8/x9=1
26 User I/Os (5)
x4=3
x8/x9=1
x16/x18=0
x16/x18=0
EP4SGX70 and EP4SGX110 Devices
in the 1152-Pin FineLine BGA
(with 24 Transceivers)
I/O Bank 6A (3)
32 User I/Os
x4=4
x8/x9=2
32 User I/Os
x4=4
x8/x9=2
x16/x18=1
x16/x18=1
I/O Bank 1C (4)
I/O Bank 6C
26 User I/Os (5)
x4=3
x8/x9=1
26 User I/Os (5)
x4=3
x8/x9=1
x16/x18=0
x16/x18=0
I/O Bank 3C
I/O Bank 4C
I/O Bank 4A (3)
I/O Bank 3A (3)
24 User I/Os
x4=3
x8/x9=1
24 User I/Os
x4=2
x8/x9=1
40 User I/Os
x4=6
x8/x9=3
40 User I/Os
x4=6
x8/x9=3
DLL1
DLL2
x16/x18=0
x16/x18=0
x16/x18=1
x16/x18=1
Notes to Figure 7–7:
(1) These numbers are preliminary until the devices are available.
(2) EP4SGX70 and EP4SGX110 devices do not support ×32/×36 mode. To interface with a ×36 QDR II+/QDR II SRAM device, refer to “Combining
×16/×18 DQS/DQ Groups for a ×36 QDR II+/QDR II SRAM Interface” on page 7–26.
(3) You can also use DQS/DQSn pins in some of the ×4 groups as RUP and RDN pins, but you cannot use a ×4 group for memory interfaces if two pins
of the ×4 group are used as RUP and RDN pins for OCT calibration. If two pins of a ×4 group are used as RUP and RDN pins for OCT calibration, you
can use the ×16/×18 or ×32/×36 groups that include that ×4 group; however, there are restrictions on using ×8/×9 groups that include that ×4
group.
(4) All I/O pin counts include dedicated clock inputs that you can use for data inputs.
(5) You can also use some of the DQS/DQ pins in I/O Bank 1C as configuration pins. You cannot use a ×4 DQS/DQ group with any of its pin members
used for configuration purposes. Ensure that the DQS/DQ groups that you have chosen are not also used for configuration because you may lose
up to four ×4 DQS/DQ groups, depending on your configuration scheme.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 7: External Memory Interfaces in Stratix IV Devices
7–13
Memory Interfaces Pin Support
Figure 7–8. Number of DQS/DQ Groups per Bank in EP4SGX180 and EP4SGX230 Devices in the 1152-Pin FineLine BGA
Package (Note 1), (2), (3), (4), (5)
I/O Bank 7B
I/O Bank 8A
I/O Bank 8B
I/O Bank 8C
I/O Bank 7C
I/O Bank 7A
24 User I/Os
x4=4
32 User I/Os
x4=3
40 User I/Os
x4=6
32 User I/Os
x4=3
24 User I/Os
x4=4
40 User I/Os
x4=6
DLL0
DLL3
x8/x9=2
x8/x9=1
x8/x9=3
x8/x9=1
x8/x9=2
x8/x9=3
x16/x18=1
x16/x18=0
x16/x18=1
x16//x18=0
x16/x18=1
x16/x18=1
I/O Bank 1A
I/O Bank 6A
48 User I/Os
x4=7
48 User I/Os
x4=7
x8/x9=3
x16/x18=1
x8/x9=3
x6/x18=1
EP4SGX180 and EP4SGX230 Devices
in the 1152-Pin FineLine BGA
I/O Bank 1C
I/O Bank 6C
42 User I/Os
x4=6
x8/x9=3
42 User I/Os
x4=6
x8/x9=3
x16/x18=1
x16/x18=1
I/O Bank 3A
I/O Bank 3B
I/O Bank 3C
I/O Bank 4C
I/O Bank 4A
I/O Bank 4B
40 User I/Os
x4=6
24 User I/Os
x4=4
32 User I/Os
x4=3
32 User I/Os
x4=3
24 User I/Os
x4=4
40 User I/Os
x4=6
DLL2
DLL1
x8/x9=2
x8/x9=3
x8/x9=2
x8/x9=1
x8/x9=1
x8/x9=3
x16/x18=1
x16/x18=1
x16/x18=0
x16/x18=0
x16/x18=1
x16/x18=1
Notes to Figure 7–8:
(1) These numbers are preliminary until the devices are available.
(2) EP4SGX180 and EP4SGX230 devices do not support ×32/×36 mode. To interface with a ×36 QDR II+/QDR II SRAM device, refer to “Combining
×16/×18 DQS/DQ Groups for a ×36 QDR II+/QDR II SRAM Interface” on page 7–26.
(3) You can also use DQS/DQSn pins in some of the ×4 groups as RUP and RDN pins, but you cannot use a ×4 group for memory interfaces if two pins
of the ×4 group are used as RUP and RDN pins for OCT calibration. If two pins of a ×4 group are used as RUP and RDN pins for OCT calibration, you
can use the ×16/×18 or ×32/×36 groups that include that ×4 group; however, there are restrictions on using ×8/×9 groups that include that ×4
group.
(4) All I/O pin counts include dedicated clock inputs that you can use for data inputs.
(5) You can also use some of the DQS/DQ pins in I/O Bank 1C as configuration pins. You cannot use a ×4 DQS/DQ group with any of its pin members
used for configuration purposes. Ensure that the DQS/DQ groups that you have chosen are not also used for configuration because you may lose
up to four ×4 DQS/DQ groups, depending on your configuration scheme.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
7–14
Chapter 7: External Memory Interfaces in Stratix IV Devices
Memory Interfaces Pin Support
Figure 7–9. Number of DQS/DQ Groups per Bank in EP4SGX290, EP4SGX360, and EP4SGX530 Devices in the 1152-Pin
FineLine BGA Package (Note 1), (3), (4), (5)
I/O Bank 7B
I/O Bank 8A
40 User I/Os
x4=6
I/O Bank 8B
I/O Bank 8C
I/O Bank 7C
I/O Bank 7A
40 User I/Os
x4=6
24 User I/Os
x4=4
32 User I/Os
x4=3
32 User I/Os
x4=3
24 User I/Os
x4=4
DLL0
DLL3
x8/x9=3
x8/x9=3
x8/x9=2
x16/x18=1
x8/x9=1
x16/x18=0
x16/x18=1
x32/x36=1 (2)
x8/x9=1
x16//x18=0
x8/x9=2
x16/x18=1
x16/x18=1
x32/x36=1 (2)
I/O Bank 1A
I/O Bank 6A
48 User I/Os
x4=7
48 User I/Os
x4=7
x8/x9=3
x16/x18=1
x8/x9=3
x6/x18=1
EP4SGX290, EP4SGX360, and EP4SGX530 Devices
in the 1152-Pin FineLine BGA
I/O Bank 1C
I/O Bank 6C
42 User I/Os
x4=6
x8/x9=3
42 User I/Os
x4=6
x8/x9=3
x16/x18=1
x16/x18=1
I/O Bank 3A
40 User I/Os
x4=6
I/O Bank 3B
I/O Bank 3C
I/O Bank 4C
I/O Bank 4A
40 User I/Os
x4=6
I/O Bank 4B
24 User I/Os
x4=4
24 User I/Os
x4=4
32 User I/Os
x4=3
32 User I/Os
x4=3
DLL2
DLL1
x8/x9=3
x8/x9=3
x8/x9=2
x16/x18=1
x16/x18=1
x32/x36=1 (2)
x8/x9=2
x16/x18=1
x8/x9=1
x16/x18=0
x8/x9=1
x16/x18=0
x16/x18=1
x32/x36=1 (2)
Notes to Figure 7–9:
(1) These numbers are preliminary until the devices are available.
(2) These ×32/×36 DQS/DQ groups have 40 pins instead of 48 pins per group.
(3) You can also use DQS/DQSn pins in some of the ×4 groups as RUP and RDN pins, but you cannot use a ×4 group for memory interfaces if two pins
of the ×4 group are used as RUP and RDN pins for OCT calibration. If two pins of a ×4 group are used as RUP and RDN pins for OCT calibration, you
can use the ×16/×18 or ×32/×36 groups that include that ×4 group; however, there are restrictions on using ×8/×9 groups that include that ×4
group.
(4) All I/O pin counts include dedicated clock inputs that you can use for data inputs.
(5) You can also use some of the DQS/DQ pins in I/O Bank 1C as configuration pins. You cannot use a ×4 DQS/DQ group with any of its pin members
used for configuration purposes. Ensure that the DQS/DQ groups that you have chosen are not also used for configuration because you may lose
up to four ×4 DQS/DQ groups, depending on your configuration scheme.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 7: External Memory Interfaces in Stratix IV Devices
7–15
Memory Interfaces Pin Support
Figure 7–10. Number of DQS/DQ Groups per Bank in EP4SE360, EP4SE530, and EP4SE820 Devices in the 1152-Pin
FineLine BGA Package (Note 1), (2), (3), (4), (5)
I/O Bank 7B
I/O Bank 8A
I/O Bank 8B
I/O Bank 8C
I/O Bank 7C
I/O Bank 7A
24 User I/Os
x4=4
x8/x9=2
32 User I/Os
x4=3
x8/x9=1
40 User I/Os
x4=6
x8/x9=3
32 User I/Os
x4=3
x8/x9=1
24 User I/Os
x4=4
x8/x9=2
40 User I/Os
x4=6
x8/x9=3
DLL0
DLL3
x16/x18=1
x16/x18=0
x16/x18=1
x16//x18=0
x16/x18=1
x16/x18=1
I/O Bank 1A
I/O Bank 6A
48 User I/Os
x4=7
48 User I/Os
x4=7
x8/x9=3
x16/x18=1
x8/x9=3
x6/x18=1
I/O Bank 1C
I/O Bank 6C
42 User I/Os
x4=6
x8/x9=3
42 User I/Os
x4=6
x8/x9=3
x16/x18=1
EP4SE360, EP4SE530
and EP4SE820 Devices
in the 1152-Pin FineLine BGA
x16/x18=1
I/O Bank 2C
I/O Bank 5C
42 User I/Os
x4=6
x8/x9=3
42 User I/Os
x4=6
x8/x9=3
x16/x18=1
x16/x18=1
I/O Bank 5A
I/O Bank 2A
48 User I/Os
x4=7
x8/x9=3
x6/x18=1
48 User I/Os
x4=7
x8/x9=3
x16/x18=1
I/O Bank 3A
I/O Bank 3B
I/O Bank 3C
I/O Bank 4C
I/O Bank 4A
I/O Bank 4B
24 User I/Os
x4=4
x8/x9=2
24 User I/Os
x4=4
x8/x9=2
40 User I/Os
x4=6
x8/x9=3
40 User I/Os
x4=6
x8/x9=3
32 User I/Os
x4=3
x8/x9=1
32 User I/Os
x4=3
x8/x9=1
DLL2
DLL1
x16/x18=1
x16/x18=1
x16/x18=1
x16/x18=1
x16/x18=0
x16/x18=0
Notes to Figure 7–10:
(1) These numbers are preliminary until the devices are available.
(2) EP4SE360, EP4SE530, and EP4SE820 devices do not support ×32/×36 mode. To interface with a ×36 QDR II+/QDR II SRAM device, refer to
“Combining ×16/×18 DQS/DQ Groups for a ×36 QDR II+/QDR II SRAM Interface” on page 7–26.
(3) You can also use DQS/DQSn pins in some of the ×4 groups as RUP and RDN pins, but you cannot use a ×4 group for memory interfaces if two pins
of the ×4 group are used as RUP and RDN pins for OCT calibration. If two pins of a ×4 group are used as RUP and RDN pins for OCT calibration, you
can use the ×16/×18 or ×32/×36 groups that include that ×4 group, however there are restrictions on using ×8/×9 groups that include that ×4
group.
(4) You can also use some of the DQS/DQ pins in I/O Bank 1C as configuration pins. You cannot use a ×4 DQS/DQ group with any of its pin members
used for configuration purposes. Ensure that the DQS/DQ groups that you have chosen are not also used for configuration because you may lose
up to four ×4 DQS/DQ groups, depending on your configuration scheme.
(5) All I/O pin counts include dedicated clock inputs that you can use for data inputs.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
7–16
Chapter 7: External Memory Interfaces in Stratix IV Devices
Memory Interfaces Pin Support
Figure 7–11. Number of DQS/DQ Groups per Bank in EP4SGX180 and EP4SGX230 Devices in the 1517-Pin FineLine BGA
Package (Note 1), (2), (3), (4), (5)
I/O Bank 7B
I/O Bank 8A
I/O Bank 8B
I/O Bank 8C
I/O Bank 7C
I/O Bank 7A
24 User I/Os
x4=4
32 User I/Os
x4=3
40 User I/Os
x4=6
32 User I/Os
x4=3
24 User I/Os
x4=4
40 User I/Os
x4=6
DLL0
DLL3
x8/x9=2
x8/x9=1
x8/x9=3
x8/x9=1
x8/x9=2
x8/x9=3
x16/x18=1
x16/x18=0
x16/x18=1
x16//x18=0
x16/x18=1
x16/x18=1
I/O Bank 1A
I/O Bank 6A
48 User I/Os
x4=7
48 User I/Os
x4=7
x8/x9=3
x16/x18=1
x8/x9=3
x6/x18=1
I/O Bank 1C
I/O Bank 6C
42 User I/Os
x4=6
x8/x9=3
42 User I/Os
x4=6
x8/x9=3
x16/x18=1
EP4SGX180 and EP4SGX230 Devices
in the 1517-Pin FineLine BGA
x16/x18=1
I/O Bank 2C
I/O Bank 5C
42 User I/Os
x4=6
x8/x9=3
42 User I/Os
x4=6
x8/x9=3
x16/x18=1
x16/x18=1
I/O Bank 5A
I/O Bank 2A
48 User I/Os
x4=7
x8/x9=3
x6/x18=1
48 User I/Os
x4=7
x8/x9=3
x16/x18=1
I/O Bank 3A
I/O Bank 3B
I/O Bank 3C
I/O Bank 4C
I/O Bank 4A
I/O Bank 4B
40 User I/Os
x4=6
24 User I/Os
x4=4
32 User I/Os
x4=3
32 User I/Os
x4=3
24 User I/Os
x4=4
40 User I/Os
x4=6
DLL2
DLL1
x8/x9=2
x8/x9=3
x8/x9=2
x8/x9=1
x8/x9=1
x8/x9=3
x16/x18=1
x16/x18=1
x16/x18=0
x16/x18=0
x16/x18=1
x16/x18=1
Notes to Figure 7–11:
(1) These numbers are preliminary until the devices are available.
(2) EP4SGX180 and EP4SGX230 devices do not support ×32/×36 mode. To interface with a ×36 QDR II+/QDR II SRAM device, refer to “Combining
×16/×18 DQS/DQ Groups for a ×36 QDR II+/QDR II SRAM Interface” on page 7–26.
(3) You can also use DQS/DQSn pins in some of the ×4 groups as RUP and RDN pins, but you cannot use a ×4 group for memory interfaces if two pins
of the ×4 group are used as RUP and RDN pins for OCT calibration. If two pins of a ×4 group are used as RUP and RDN pins for OCT calibration, you
can use the ×16/×18 or ×32/×36 groups that include that ×4 group, however there are restrictions on using ×8/×9 groups that include that ×4
group.
(4) All I/O pin counts include dedicated clock inputs that you can use for data inputs.
(5) You can also use some of the DQS/DQ pins in I/O Bank 1C as configuration pins. You cannot use a ×4 DQS/DQ group with any of its pin members
used for configuration purposes. Ensure that the DQS/DQ groups that you have chosen are not also used for configuration because you may lose
up to four ×4 DQS/DQ groups, depending on your configuration scheme.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 7: External Memory Interfaces in Stratix IV Devices
7–17
Memory Interfaces Pin Support
Figure 7–12. Number of DQS/DQ Groups per Bank in EP4SGX290, EP4SGX360, and EP4SGX530 Devices in the 1517-Pin
FineLine BGA Package (Note 1), (3), (4), (5)
I/O Bank 7B
I/O Bank 8A
40 User I/Os
x4=6
I/O Bank 8B
I/O Bank 8C
I/O Bank 7C
I/O Bank 7A
40 User I/Os
x4=6
24 User I/Os
x4=4
32 User I/Os
x4=3
32 User I/Os
x4=3
24 User I/Os
x4=4
DLL0
DLL3
x8/x9=3
x8/x9=3
x8/x9=2
x16/x18=1
x8/x9=1
x16/x18=0
x16/x18=1
x32/x36=1 (2)
x8/x9=1
x16//x18=0
x8/x9=2
x16/x18=1
x16/x18=1
x32/x36=1 (2)
I/O Bank 1A
I/O Bank 6A
48 User I/Os
x4=7
48 User I/Os
x4=7
x8/x9=3
x16/x18=1
x8/x9=3
x6/x18=1
I/O Bank 1C
I/O Bank 6C
42 User I/Os
x4=6
x8/x9=3
42 User I/Os
x4=6
x8/x9=3
x16/x18=1
EP4SGX290, EP4SGX360, and EP4SGX530 Devices
in the 1517-Pin FineLine BGA
x16/x18=1
I/O Bank 2C
I/O Bank 5C
42 User I/Os
x4=6
x8/x9=3
42 User I/Os
x4=6
x8/x9=3
x16/x18=1
x16/x18=1
I/O Bank 5A
I/O Bank 2A
48 User I/Os
x4=7
x8/x9=3
x6/x18=1
48 User I/Os
x4=7
x8/x9=3
x16/x18=1
I/O Bank 3A
40 User I/Os
x4=6
I/O Bank 3B
I/O Bank 3C
I/O Bank 4C
I/O Bank 4A
40 User I/Os
x4=6
I/O Bank 4B
24 User I/Os
x4=4
24 User I/Os
x4=4
32 User I/Os
x4=3
32 User I/Os
x4=3
DLL2
DLL1
x8/x9=3
x8/x9=3
x8/x9=2
x16/x18=1
x16/x18=1
x32/x36=1 (2)
x8/x9=2
x16/x18=1
x8/x9=1
x16/x18=0
x8/x9=1
x16/x18=0
x16/x18=1
x32/x36=1 (2)
Notes to Figure 7–12:
(1) These numbers are preliminary until the devices are available.
(2) These ×32/×36 DQS/DQ groups have 40 pins instead of 48 pins per group.
(3) You can also use DQS/DQSn pins in some of the ×4 groups as RUP and RDN pins, but you cannot use a ×4 group for memory interfaces if two pins
of the ×4 group are used as RUP and RDN pins for OCT calibration. If two pins of a ×4 group are used as RUP and RDN pins for OCT calibration, you
can use the ×16/×18 or ×32/×36 groups that include that ×4 group, however there are restrictions on using ×8/×9 groups that include that ×4
group.
(4) All I/O pin counts include dedicated clock inputs that you can use for data inputs.
(5) You can also use some of the DQS/DQ pins in I/O Bank 1C as configuration pins. You cannot use a ×4 DQS/DQ group with any of its pin members
used for configuration purposes. Ensure that the DQS/DQ groups that you have chosen are not also used for configuration because you may lose
up to four ×4 DQS/DQ groups, depending on your configuration scheme.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
7–18
Chapter 7: External Memory Interfaces in Stratix IV Devices
Memory Interfaces Pin Support
Figure 7–13. Number of DQS/DQ Groups per Bank in EP4SE530 and EP4SE820 Devices in the 1517-pin FineLine BGA
Package (Note 1), (2), (3), (4)
I/O Bank 8A
I/O Bank 8B
I/O Bank 8C
I/O Bank 7C
I/O Bank 7B
I/O Bank 7A
48 User I/Os
x4=8
x8/x9=4
48 User I/Os
x4=8
x8/x9=4
32 User I/Os
x4=3
x8/x9=1
32 User I/Os
x4=3
x8/x9=1
48 User I/Os
x4=8
x8/x9=4
48 User I/Os
x4=8
x8/x9=4
DLL3
DLL0
x16/x18=2
x32/x36=1
x16/x18=2
x32/x36=1
x16/x18=0
x32/x36=0
x16/x18=2
x32/x36=1
x16/x18=0
x32/x36=0
x16/x18=2
x32/x36=1
I/O Bank 1A
I/O Bank 6A
50 User I/Os
x4=7
50 User I/Os
x4=7
x8/x9=3
x8/x9=3
x16/x18=1
x32/x36=0
x16/x18=1
x32/x36=0
I/O Bank 1B
24 User I/Os
x4=4
I/O Bank 6B
24 User I/Os
x4=4
x8/x9=2
x8/x9=2
x16/x18=1
x32/x36=0
x16/x18=1
x32/x36=0
I/O Bank 1C
I/O Bank 6C
42 User I/Os
x4=6
42 User I/Os
x4=6
x8/x9=3
x8/x9=3
x16/x18=1
x32/x36=0
x16/x18=1
x32/x36=0
EP4SE530 and EP4SE820 Devices
in the 1517-Pin FineLine BGA
I/O Bank 5C
I/O Bank 2C
42 User I/Os
x4=6
42 User I/Os
x4=6
x8/x9=3
x8/x9=3
x16/x18=1
x32/x36=0
x16/x18=1
x32/x36=0
I/O Bank 2B
I/O Bank 5B
24 User I/Os
x4=4
x8/x9=2
24 User I/Os
x4=4
x8/x9=2
x16/x18=1
x32/x36=0
x16/x18=1
x32/x36=0
I/O Bank 2A
I/O Bank 5A
50 User I/Os
x4=7
50 User I/Os
x4=7
x8/x9=3
x8/x9=3
x16/x18=1
x32/x36=0
x16/x18=1
x32/x36=0
I/O Bank 3A
I/O Bank 3B
I/O Bank 3C
I/O Bank 4C
I/O Bank 4B
I/O Bank 4A
48 User I/Os
x4=8
x8/x9=4
48 User I/Os
x4=8
x8/x9=4
32 User I/Os
x4=3
x8/x9=1
32 User I/Os
x4=3
x8/x9=1
48 User I/Os
x4=8
x8/x9=4
48 User I/Os
x4=8
x8/x9=4
DLL1
DLL2
x16/x18=2
x32/x36=1
x16/x18=0
x32/x36=0
x16/x18=2
x32/x36=1
x16/x18=2
x32/x36=1
x16/x18=0
x32/x36=0
x16/x18=2
x32/x36=1
Notes to Figure 7–13:
(1) These numbers are preliminary until the devices are available.
(2) You can also use DQS/DQSn pins in some of the ×4 groups as RUP and RDN pins, but you cannot use a ×4 group for memory interfaces if two pins
of the ×4 group are used as RUP and RDN pins for OCT calibration. If two pins of a ×4 group are used as RUP and RDN pins for OCT calibration, you
can use the ×16/×18 or ×32/×36 groups that include that ×4 group, however there are restrictions on using ×8/×9 groups that include that ×4
group.
(3) All I/O pin counts include dedicated clock inputs and dedicated corner PLL clock inputs that you can use for data inputs.
(4) You can also use some of the DQS/DQ pins in I/O Bank 1C as configuration pins. You cannot use a ×4 DQS/DQ group with any of its pin members
used for configuration purposes. Ensure that the DQS/DQ groups that you have chosen are not also used for configuration because you may lose
up to four ×4 DQS/DQ groups, depending on your configuration scheme.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 7: External Memory Interfaces in Stratix IV Devices
7–19
Memory Interfaces Pin Support
Figure 7–14. Number of DQS/DQ Groups per Bank in EP4S40G2, EP4S40G5, EP4S100G2, and EP4S100G5 Devices in the
1517-Pin FineLine BGA Package (Note 1), (2), (3), (4), (5)
I/O Bank 8A
I/O Bank 8B
I/O Bank 8C
I/O Bank 7C
I/O Bank 7B
I/O Bank 7A
40 User I/Os
x4=6
x8/x9=3
24 User I/Os
x4=4
x8/x9=2
32 User I/Os
x4=3
x8/x9=1
32 User I/Os
x4=3
x8/x9=1
24 User I/Os
x4=4
x8/x9=2
40 User I/Os
x4=6
x8/x9=3
DLL0
DLL3
x16/x18=1
x16/x18=1
x16/x18=0
x16/x18=0
x16/x18=1
x16/x18=1
I/O Bank 1A
I/O Bank 6A
43 User I/Os
x4=5
44 User I/Os
x4=5
x8/x9=1
x8/x9=1
x16/x18=0
x16/x18=0
I/O Bank 1C
20 User I/Os
x4=0
I/O Bank 6C
21 User I/Os
x4=0
x8/x9=0
x8/x9=0
x16/x18=0
x16/x18=0
EP4S40G2, EP4S40G5, EP4S100G2, and EP4S100G5 Devices
in the 1517-Pin FineLine BGA
I/O Bank 2C
I/O Bank 5C
21 User I/Os
x4=1
21 User I/Os
x4=0
x8/x9=0
x8/x9=0
x16/x18=0
x16/x18=0
I/O Bank 5A
I/O Bank 2A
46 User I/Os
x4=6
46 User I/Os
x4=6
x8/x9=2
x8/x9=3
x16/x18=1
x16/x18=1
I/O Bank 3A
I/O Bank 3B
I/O Bank 3C
I/O Bank 4C
I/O Bank 4B
I/O Bank 4A
40 User I/Os
x4=6
x8/x9=3
24 User I/Os
x4=4
x8/x9=2
32 User I/Os
x4=3
x8/x9=1
32 User I/Os
x4=3
x8/x9=1
24 User I/Os
x4=4
x8/x9=2
40 User I/Os
x4=6
x8/x9=3
DLL1
DLL2
x16/x18=1
x16/x18=1
x16/x18=0
x16/x18=0
x16/x18=1
x16/x18=1
Notes to Figure 7–14:
(1) These numbers are preliminary until the devices are available.
(2) EP4S40G2, EP4S40G5, EP4S100G2, and EP4S100G5 devices do not support 32/36 mode. To interface with a 36 QDR II+/QDR II SRAM
device, refer to “Combining ×16/×18 DQS/DQ Groups for a ×36 QDR II+/QDR II SRAM Interface” on page 7–26.
(3) You can also use DQS/DQSn pins in some of the ×4 groups as RUP and RDN pins, but you cannot use a ×4 group for memory interfaces if two pins
of the ×4 group are used as RUP and RDN pins for OCT calibration. If two pins of a ×4 group are used as RUP and RDN pins for OCT calibration, you
can use the ×16/×18 or ×32/×36 groups that include that ×4 group, however there are restrictions on using ×8/×9 groups that include that ×4
group.
(4) All I/O pin counts include dedicated clock inputs that you can use for data inputs.
(5) You can also use some of the DQS/DQ pins in I/O Bank 1C as configuration pins. You cannot use a 4 DQS/DQ group with any of its pin members
used for configuration purposes. Make sure that the DQS/DQ groups that you have chosen are not used for configuration as you may lose up to
four 4 DQS/DQ groups, depending on your configuration scheme.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
7–20
Chapter 7: External Memory Interfaces in Stratix IV Devices
Memory Interfaces Pin Support
Figure 7–15. Number of DQS/DQ Groups per Bank in EP4SGX290, EP4SGX360, and EP4SGX530 Devices in the 1760-Pin
FineLine BGA Package (Note 1), (2), (3), (4)
I/O Bank 8B
48 User I/Os
x4=8
I/O Bank 7C
32 User I/Os
x4=3
I/O Bank 7B
48 User I/Os
x4=8
I/O Bank 7A
48 User I/Os
x4=8
I/O Bank 8A
48 User I/Os
x4=8
I/O Bank 8C
32 User I/Os
x4=3
DLL0
DLL3
x8/x9=4
x8/x9=1
x8/x9=4
x8/x9=1
x8/x9=4
x8/x9=4
x16/x18=2
x32/x36=1
x16/x18=0
x32/x36=0
x16/x18=2
x32/x36=1
x16//x18=0
x32/x36=0
x16/x18=2
x32/x36=1
x16/x18=2
x32/x36=1
I/O Bank 1A
I/O Bank 6A
50 User I/Os
x4=7
50 User I/Os
x4=7
x8/x9=3
x8/x9=3
x16/x18=1
x32/x36=0
x6/x18=1
x32/x36=0
I/O Bank 1C
42 User I/Os
x4=6
I/O Bank 6C
42 User I/Os
x4=6
x8/x9=3
x8/x9=3
x16/x18=1
x32/x36=0
x16/x18=1
x32/x36=0
EP4SGX290, EP4SGX360, and EP4SGX530 Devices
in the 1760-Pin FineLine BGA
I/O Bank 2C
I/O Bank 5C
42 User I/Os
x4=6
x8/x9=3
42 User I/Os
x4=6
x8/x9=3
x16/x18=1
x32/x36=0
x16/x18=1
x32/x36=0
I/O Bank 5A
50 User I/Os
x4=7
x8/x9=3
x16/x18=1
x32/x36=0
I/O Bank 2A
50 User I/Os
x4=7
x8/x9=3
x16/x18=1
x32/x36=0
I/O Bank 3A
48 User I/Os
x4=8
I/O Bank 3B
48 User I/Os
x4=8
I/O Bank 3C
32 User I/Os
x4=3
I/O Bank 4C
32 User I/Os
x4=3
I/O Bank 4A
48 User I/Os
x4=8
I/O Bank 4B
48 User I/Os
x4=8
DLL2
DLL1
x8/x9=4
x8/x9=4
x8/x9=4
x8/x9=4
x8/x9=1
x8/x9=1
x16/x18=2
x32/x36=1
x16/x18=2
x32/x36=1
x16/x18=2
x32/x36=1
x16/x18=0
x32/x36=0
x16/x18=0
x32/x36=0
x16/x18=2
x32/x36=1
Notes to Figure 7–15:
(1) These numbers are preliminary until the devices are available.
(2) You can also use DQS/DQSn pins in some of the ×4 groups as RUP and RDN pins, but you cannot use a ×4 group for memory interfaces if two pins
of the ×4 group are used as RUP and RDN pins for OCT calibration. If two pins of a ×4 group are used as RUP and RDN pins for OCT calibration, you
can use the ×16/×18 or ×32/×36 groups that include that ×4 group, however there are restrictions on using ×8/×9 groups that include that ×4
group.
(3) All I/O pin counts include dedicated clock inputs and dedicated corner PLL clock inputs that you can use for data inputs.
(4) You can also use some of the DQS/DQ pins in I/O Bank 1C as configuration pins. You cannot use a ×4 DQS/DQ group with any of its pin members
used for configuration purposes. Ensure that the DQS/DQ groups that you have chosen are not also used for configuration because you may lose
up to four ×4 DQS/DQ groups, depending on your configuration scheme.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 7: External Memory Interfaces in Stratix IV Devices
7–21
Memory Interfaces Pin Support
Figure 7–16. Number of DQS/DQ Groups per Bank in EP4SE530 Devices in the 1760-Pin FineLine BGA Package (Note 1),
(2), (3), (4)
I/O Bank 8A
I/O Bank 8B
I/O Bank 8C
I/O Bank 7C
I/O Bank 7B
I/O Bank 7A
48 User I/Os
x4=8
x8/x9=4
48 User I/Os
x4=8
x8/x9=4
32 User I/Os
x4=3
x8/x9=1
32 User I/Os
x4=3
x8/x9=1
48 User I/Os
x4=8
x8/x9=4
48 User I/Os
x4=8
x8/x9=4
DLL3
DLL0
x16/x18=2
x32/x36=1
x16/x18=2
x32/x36=1
x16/x18=2
x32/x36=1
x16/x18=0
x32/x36=0
x16/x18=0
x32/x36=0
x16/x18=2
x32/x36=1
I/O Bank 1A
I/O Bank 6A
50 User I/Os
x4=7
50 User I/Os
x4=7
x8/x9=3
x8/x9=3
x16/x18=1
x32/x36=0
x16/x18=1
x32/x36=0
I/O Bank 1B
24 User I/Os
x4=4
I/O Bank 6B
24 User I/Os
x4=4
x8/x9=2
x8/x9=2
x16/x18=1
x32/x36=0
x16/x18=1
x32/x36=0
I/O Bank 1C
I/O Bank 6C
42 User I/Os
x4=6
42 User I/Os
x4=6
x8/x9=3
x8/x9=3
x16/x18=1
x32/x36=0
x16/x18=1
x32/x36=0
EP4SE530 Devices
in the 1760-Pin FineLine BGA
I/O Bank 5C
I/O Bank 2C
42 User I/Os
x4=6
42 User I/Os
x4=6
x8/x9=3
x8/x9=3
x16/x18=1
x32/x36=0
x16/x18=1
x32/x36=0
I/O Bank 2B
I/O Bank 5B
24 User I/Os
x4=4
24 User I/Os
x4=4
x8/x9=2
x8/x9=2
x16/x18=1
x32/x36=0
x16/x18=1
x32/x36=0
I/O Bank 2A
I/O Bank 5A
50 User I/Os
x4=7
50 User I/Os
x4=7
x8/x9=3
x8/x9=3
x16/x18=1
x32/x36=0
x16/x18=1
x32/x36=0
I/O Bank 3A
I/O Bank 3B
I/O Bank 3C
I/O Bank 4C
I/O Bank 4B
I/O Bank 4A
48 User I/Os
x4=8
x8/x9=4
48 User I/Os
x4=8
x8/x9=4
32 User I/Os
x4=3
x8/x9=1
32 User I/Os
x4=3
x8/x9=1
48 User I/Os
x4=8
x8/x9=4
48 User I/Os
x4=8
x8/x9=4
DLL1
DLL2
x16/x18=2
x32/x36=1
x16/x18=2
x32/x36=1
x16/x18=2
x32/x36=1
x16/x18=0
x32/x36=0
x16/x18=0
x32/x36=0
x16/x18=2
x32/x36=1
Notes to Figure 7–16:
(1) These numbers are preliminary until the devices are available.
(2) You can also use DQS/DQSn pins in some of the ×4 groups as RUP and RDN pins, but you cannot use a ×4 group for memory interfaces if two pins
of the ×4 group are used as RUP and RDN pins for OCT calibration. If two pins of a ×4 group are used as RUP and RDN pins for OCT calibration, you
can use the ×16/×18 or ×32/×36 groups that include that ×4 group, however there are restrictions on using ×8/×9 groups that include that ×4
group.
(3) All I/O pin counts include dedicated clock inputs and dedicated corner PLL clock inputs that you can use for data inputs.
(4) You can also use some of the DQS/DQ pins in I/O Bank 1C as configuration pins. You cannot use a ×4 DQS/DQ group with any of its pin members
used for configuration purposes. Ensure that the DQS/DQ groups that you have chosen are not also used for configuration because you may lose
up to four ×4 DQS/DQ groups, depending on your configuration scheme.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
7–22
Chapter 7: External Memory Interfaces in Stratix IV Devices
Memory Interfaces Pin Support
Figure 7–17. Number of DQS/DQ Groups per Bank in EP4SE820 Devices in the 1760-pin FineLine BGA Package (Note 1),
(2), (3), (4)
I/O Bank 8A
I/O Bank 8B
I/O Bank 8C
I/O Bank 7C
I/O Bank 7B
I/O Bank 7A
48 User I/Os
x4=8
x8/x9=4
48 User I/Os
x4=8
x8/x9=4
48 User I/Os
x4=6
x8/x9=3
48 User I/Os
x4=6
x8/x9=3
48 User I/Os
x4=8
x8/x9=4
48 User I/Os
x4=8
x8/x9=4
DLL3
DLL0
x16/x18=2
x32/x36=1
x16/x18=1
x32/x36=0
x16/x18=2
x32/x36=1
x16/x18=2
x32/x36=1
x16/x18=1
x32/x36=0
x16/x18=2
x32/x36=1
I/O Bank 1A
I/O Bank 6A
50 User I/Os
x4=7
50 User I/Os
x4=7
x8/x9=3
x8/x9=3
x16/x18=1
x32/x36=0
x16/x18=1
x32/x36=0
I/O Bank 1B
I/O Bank 6B
36 User I/Os
x4=6
x8/x9=3
36 User I/Os
x4=6
x8/x9=3
x16/x18=1
x32/x36=0
x16/x18=1
x32/x36=0
I/O Bank 1C
I/O Bank 6C
50 User I/Os
x4=7
50 User I/Os
x4=7
x8/x9=3
x8/x9=3
x16/x18=1
x32/x36=0
x16/x18=1
x32/x36=0
EP4SE820 Devices
in the 1760-Pin FineLine BGA
I/O Bank 5C
I/O Bank 2C
50 User I/Os
x4=7
50 User I/Os
x4=7
x8/x9=3
x8/x9=3
x16/x18=1
x32/x36=0
x16/x18=1
x32/x36=0
I/O Bank 2B
I/O Bank 5B
36 User I/Os
x4=6
x8/x9=3
36 User I/Os
x4=6
x8/x9=3
x16/x18=1
x32/x36=0
x16/x18=1
x32/x36=0
I/O Bank 2A
I/O Bank 5A
50 User I/Os
x4=7
50 User I/Os
x4=7
x8/x9=3
x8/x9=3
x16/x18=1
x32/x36=0
x16/x18=1
x32/x36=0
I/O Bank 3A
I/O Bank 3B
I/O Bank 3C
I/O Bank 4C
I/O Bank 4B
I/O Bank 4A
48 User I/Os
x4=8
x8/x9=4
48 User I/Os
x4=8
x8/x9=4
48 User I/Os
x4=6
x8/x9=3
48 User I/Os
x4=6
x8/x9=3
48 User I/Os
x4=8
x8/x9=4
48 User I/Os
x4=8
x8/x9=4
DLL1
DLL2
x16/x18=2
x32/x36=1
x16/x18=1
x32/x36=0
x16/x18=2
x32/x36=1
x16/x18=2
x32/x36=1
x16/x18=1
x32/x36=0
x16/x18=2
x32/x36=1
Notes to Figure 7–17:
(1) These numbers are preliminary until the devices are available.
(2) You can also use DQS/DQSn pins in some of the ×4 groups as RUP and RDN pins, but you cannot use a ×4 group for memory interfaces if two pins
of the ×4 group are used as RUP and RDN pins for OCT calibration. If two pins of a ×4 group are used as RUP and RDN pins for OCT calibration, you
can use the ×16/×18 or ×32/×36 groups that include that ×4 group, however there are restrictions on using ×8/×9 groups that include that ×4
group.
(3) All I/O pin counts include dedicated clock inputs and dedicated corner PLL clock inputs that you can use for data inputs.
(4) You can also use some of the DQS/DQ pins in I/O Bank 1C as configuration pins. You cannot use a ×4 DQS/DQ group with any of its pin members
used for configuration purposes. Ensure that the DQS/DQ groups that you have chosen are not also used for configuration because you may lose
up to four ×4 DQS/DQ groups, depending on your configuration scheme.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 7: External Memory Interfaces in Stratix IV Devices
7–23
Memory Interfaces Pin Support
Figure 7–18. Number of DQS/DQ Groups per Bank in EP4SGX290, EP4SGX360, and EP4SGX530 Devices in the 1932-Pin
FineLine BGA Package (Note 1), (2), (3), (4)
I/O Bank 8A
I/O Bank 8B
I/O Bank 8C
I/O Bank 7C
I/O Bank 7B
I/O Bank 7A
48 User I/Os
x4=8
x8/x9=4
48 User I/Os
x4=8
x8/x9=4
32 User I/Os
x4=3
x8/x9=1
32 User I/Os
x4=3
x8/x9=1
48 User I/Os
x4=8
x8/x9=4
48 User I/Os
x4=8
x8/x9=4
DLL0
DLL3
x16/x18=2
x32/x36=1
x16/x18=0
x32/x36=0
x16/x18=2
x32/x36=1
x16/x18=2
x32/x36=1
x16/x18=0
x32/x36=0
x16/x18=2
x32/x36=1
I/O Bank 1A
I/O Bank 6A
50 User I/Os
x4=7
50 User I/Os
x4=7
x8/x9=3
x8/x9=3
x16/x18=1
x32/x36=0
x16/x18=1
x32/x36=0
I/O Bank 1C
I/O Bank 6C
42 User I/Os
x4=6
42 User I/Os
x4=6
x8/x9=3
x8/x9=3
x16/x18=1
x32/x36=0
x16/x18=1
x32/x36=0
I/O Bank 5C
I/O Bank 2C
42 User I/Os
x4=6
x8/x9=3
42 User I/Os
x4=6
x8/x9=3
EP4SGX290, EP4SGX360, and EP4SGX530 Devices
in the 1932-Pin FineLine BGA
x16/x18=1
x32/x36=0
x16/x18=1
x32/x36=0
I/O Bank 2B
I/O Bank 5B
20 User I/Os
x4=3
20 User I/Os
x4=3
x8/x9=1
x8/x9=1
x16/x18=0
x32/x36=0
x16/x18=0
x32/x36=0
I/O Bank 2A
I/O Bank 5A
50 User I/Os
x4=7
50 User I/Os
x4=7
x8/x9=3
x8/x9=3
x16/x18=1
x32/x36=0
x16/x18=1
x32/x36=0
I/O Bank 3A
I/O Bank 3B
I/O Bank 3C
I/O Bank 4C
I/O Bank 4B
I/O Bank 4A
48 User I/Os
x4=8
x8/x9=4
48 User I/Os
x4=8
x8/x9=4
32 User I/Os
x4=3
x8/x9=1
32 User I/Os
x4=3
x8/x9=1
48 User I/Os
x4=8
x8/x9=4
48 User I/Os
x4=8
x8/x9=4
DLL1
DLL2
x16/x18=2
x32/x36=1
x16/x18=0
x32/x36=0
x16/x18=2
x32/x36=1
x16/x18=2
x32/x36=1
x16/x18=0
x32/x36=0
x16/x18=2
x32/x36=1
Notes to Figure 7–18:
(1) These numbers are preliminary until the devices are available.
(2) You can also use DQS/DQSn pins in some of the ×4 groups as RUP and RDN pins, but you cannot use a ×4 group for memory interfaces if two pins
of the ×4 group are used as RUP and RDN pins for OCT calibration. If two pins of a ×4 group are used as RUP and RDN pins for OCT calibration, you
can use the ×16/×18 or ×32/×36 groups that include that ×4 group, however there are restrictions on using ×8/×9 groups that include that ×4
group.
(3) All I/O pin counts include dedicated clock inputs and dedicated corner PLL clock inputs that you can use for data inputs.
(4) You can also use some of the DQS/DQ pins in I/O Bank 1C as configuration pins. You cannot use a ×4 DQS/DQ group with any of its pin members
used for configuration purposes. Ensure that the DQS/DQ groups that you have chosen are not also used for configuration because you may lose
up to four ×4 DQS/DQ groups, depending on your configuration scheme.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
7–24
Chapter 7: External Memory Interfaces in Stratix IV Devices
Memory Interfaces Pin Support
Figure 7–19. Number of DQS/DQ Groups per Bank in EP4S100G3, EP4S100G4, and EP4S100G5 Devices in the 1932-Pin
FineLine BGA Package (Note 1), (2), (3), (4)
I/O Bank 8A
I/O Bank 8B
I/O Bank 8C
I/O Bank 7C
I/O Bank 7B
I/O Bank 7A
48 User I/Os
x4=8
x8/x9=4
48 User I/Os
x4=8
x8/x9=4
32 User I/Os
x4=3
x8/x9=1
32 User I/Os
x4=3
x8/x9=1
48 User I/Os
x4=8
x8/x9=4
48 User I/Os
x4=8
x8/x9=4
DLL0
DLL3
x16/x18=2
x32/x36=1
x16/x18=0
x32/x36=0
x16/x18=2
x32/x36=1
x16/x18=2
x32/x36=1
x16/x18=0
x32/x36=0
x16/x18=2
x32/x36=1
I/O Bank 1A
I/O Bank 6A
40 User I/Os
x4=3
38 User I/Os
x4=3
x8/x9=1
x8/x9=0
x16/x18=0
x32/x36=0
x16/x18=0
x32/x36=0
I/O Bank 1C
I/O Bank 6C
19 User I/Os
x4=0
20 User I/Os
x4=0
x8/x9=0
x8/x9=0
x16/x18=0
x32/x36=0
x16/x18=0
x32/x36=0
I/O Bank 5C
I/O Bank 2C
19 User I/Os
x4=0
x8/x9=0
17 User I/Os
x4=0
x8/x9=0
EP4S100G3, EP4S100G4, and EP4S100G5 Devices
in the 1932-Pin FineLine BGA
x16/x18=0
x32/x36=0
x16/x18=0
x32/x36=0
I/O Bank 2B
I/O Bank 5B
13 User I/Os
x4=1
12 User I/Os
x4=0
x8/x9=0
x8/x9=0
x16/x18=0
x32/x36=0
x16/x18=0
x32/x36=0
I/O Bank 2A
I/O Bank 5A
39 User I/Os
x4=4
40 User I/Os
x4=4
x8/x9=1
x8/x9=1
x16/x18=0
x32/x36=0
x16/x18=0
x32/x36=0
I/O Bank 3A
I/O Bank 3B
I/O Bank 3C
I/O Bank 4C
I/O Bank 4B
I/O Bank 4A
48 User I/Os
x4=8
x8/x9=4
48 User I/Os
x4=8
x8/x9=4
32 User I/Os
x4=3
x8/x9=1
32 User I/Os
x4=3
x8/x9=1
48 User I/Os
x4=8
x8/x9=4
48 User I/Os
x4=8
x8/x9=4
DLL1
DLL2
x16/x18=2
x32/x36=1
x16/x18=0
x32/x36=0
x16/x18=2
x32/x36=1
x16/x18=2
x32/x36=1
x16/x18=0
x32/x36=0
x16/x18=2
x32/x36=1
Notes to Figure 7–19:
(1) These numbers are preliminary until the devices are available.
(2) You can also use DQS/DQSn pins in some of the ×4 groups as RUP and RDN pins, but you cannot use a ×4 group for memory interfaces if two pins
of the ×4 group are used as RUP and RDN pins for OCT calibration. If two pins of a ×4 group are used as RUP and RDN pins for OCT calibration, you
can use the ×16/×18 or ×32/×36 groups that include that ×4 group, however there are restrictions on using ×8/×9 groups that include that ×4
group.
(3) All I/O pin counts include dedicated clock inputs and dedicated corner PLL clock inputs that you can use for data inputs.
(4) You can also use some of the DQS/DQ pins in I/O Bank 1C as configuration pins. You cannot use a ×4 DQS/DQ group with any of its pin members
used for configuration purposes. Ensure that the DQS/DQ groups that you have chosen are not also used for configuration because you may lose
up to four ×4 DQS/DQ groups, depending on your configuration scheme.
The DQS and DQSn pins are listed in the Stratix IV pin tables as DQSXYand DQSnXY
,
respectively, where indicates the DQS/DQ grouping number and indicates
X
Y
whether the group is located on the top (T), bottom (B), left (L), or right (R) side of the
device. The DQS/DQ pin numbering is based on ×4 mode.
The corresponding DQ pins are marked as DQXY, where
Xindicates which DQS group
the pins belong to and indicates whether the group is located on the top (T), bottom
Y
(B), left (L), or right (R) side of the device. For example, DQS1Lindicates a DQS pin
located on the left side of the device. The DQ pins belonging to that group are shown
as DQ1Lin the pin table. For more information, refer to Figure 7–20.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 7: External Memory Interfaces in Stratix IV Devices
7–25
Memory Interfaces Pin Support
1
The parity, DM, BWSn, NWSn, ECC, and QVLD pins are shown as DQ pins in the pin
table.
The numbering scheme starts from the top-left corner of the device going
counter-clockwise in a die-top view. Figure 7–20 shows how the DQS/DQ groups are
numbered in a die-top view of the device. The top and bottom sides of the device can
contain up to 38 ×4 DQS/DQ groups. The left and right sides of the device can contain
up to 34 ×4 DQS/DQ groups.
Figure 7–20. DQS Pins in Stratix IV I/O Banks
DQS20T
DQS19T
DQS1T
DQS38T
DLL0
DLL3
PLL_T2
PLL_T1
PLL_R1
PLL_L1
8C
7B
7A
8A
8B
7C
DQS1L
DQS34R
1A
1B
6A
6B
6C
1C
DQS17L
DQS18R
PLL_R2
PLL_L2
Stratix IV Device
PLL_R3
PLL_L3
DQS18L
DQS17R
2C
2B
2A
5C
5B
5A
DQS34L
PLL_L4
DQS1R
PLL_R4
3A
3B
3C
4A
4C
4B
PLL_B2
PLL_B1
DLL2
DLL1
DQS38B
DQS1B
DQS19B
DQS20B
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
7–26
Chapter 7: External Memory Interfaces in Stratix IV Devices
Memory Interfaces Pin Support
Using the RUP and RDN Pins in a DQS/DQ Group Used for Memory Interfaces
You can use the DQS/DQSn pins in some of the ×4 groups as RUP and RDN pins (listed
in the pin table). You cannot use a ×4 DQS/DQ group for memory interfaces if any of
its pin members are used as RUP and RDN pins for OCT calibration. You may be able to
use the ×8/×9 group that includes this ×4 DQS/DQ group, if either of the following
applies:
■
You are not using DM pins with your differential DQS pins
You are not using complementary or differential DQS pins
■
You can use the ×8/×9 group because a DQS/DQ ×8/×9 group actually comprises 12
pins, as the groups are formed by stitching two DQS/DQ groups in ×4 mode with six
pins each (refer to Table 7–1 on page 7–5). A typical ×8 memory interface consists of
one DQS, one DM, and eight DQ pins that add up to 10 pins. If you choose your pin
assignment carefully, you can use the two extra pins for RUP and RDN. In a DDR3
SDRAM interface, you must use differential DQS, which means that you only have
one extra pin. In this case, pick different pin locations for the RUP and RDN pins (for
example, in the bank that contains the address and command pins).
You cannot use the RUP and RDN pins shared with DQS/DQ group pins when using
×9 QDR II+/QDR II SRAM devices, as the RUP and RDN pins are dual purpose with
the CQn pins. In this case, pick different pin locations for RUP and RDN pins to avoid
conflict with memory interface pin placement. In this case, you have the choice of
placing the RUP and RDN pins in the data-write group or in the same bank as the
address and command pins.
There is no restriction on using ×16/×18 or ×32/×36 DQS/DQ groups that include the
×4 groups whose pins are being used as RUP and RDN pins, because there are enough
extra pins that can be used as DQS pins.
1
For ×8, ×16/×18, or ×32/×36 DQS/DQ groups whose members are used for RUP and
R
DN, you must assign DQS and DQ pins manually. The Quartus® II software might
not be able to place DQS and DQ pins without manual pin assignments, resulting in a
“no-fit”.
Combining ×16/×18 DQS/DQ Groups for a ×36 QDR II+/QDR II SRAM Interface
This implementation combines ×16/×18 DQS/DQ groups to interface with a ×36
QDR II+/QDR II SRAM device. The ×36 read data bus uses two ×16/×18 groups
while the ×36 write data uses another two ×16/×18 or four ×8/×9 groups. The
CQ/CQn signal traces are split on the board trace to connect to two pairs of CQ/CQn
pins in the FPGA. This is the only connection on the board that you need to change for
this implementation. Other QDR II+/QDR II SRAM interface rules for Stratix IV
devices also apply for this implementation.
1
The ALTMEMPHY megafunction and UniPHY-based external memory interface IPs
do not use the QVLD signal, so you can leave the QVLD signal unconnected as in any
QDR II+/QDR II SRAM interface.
f
For more information about the ALTMEMPHY megafunction or UniPHY-based IPs,
refer to the External Memory Interface Handbook.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 7: External Memory Interfaces in Stratix IV Devices
7–27
Memory Interfaces Pin Support
Rules to Combine Groups
In 780-, 1152-, and some 1517-pin package devices, there is at most one ×16/×18
group per I/O sub-bank. You can combine two ×16/×18 groups from a single side of
the device for a ×36 interface.
For devices that do not have four ×16/×18 groups in a single side of the device to
form two ×36 groups for read and write data, you can form one ×36 group on one side
of the device and another ×36 group on the other side of the device.
For vertical migration with the ×36 emulation implementation, check if migration is
possible by enabling device migration in the Quartus II project. The Quartus II
software supports the use of four ×8/×9 DQ groups for write data pins and migration
of these groups across device density. Table 7–3 lists the possible combinations to use
two ×16/×18 DQS/DQ groups to form a ×32/×36 group on Stratix IV devices lacking
a native ×32/×36 DQS/DQ group.
Table 7–3. Possible Group Combinations in Stratix IV Devices (Part 1 of 2)
Package
Device Density
■ EP4SGX70
I/O Sub-Bank Combinations
■ EP4SGX110
■ EP4SGX180
■ EP4SGX230
■ EP4SGX290
■ EP4SGX360
■ EP4SE230
3A and 4A, 7A and 8A (bottom and top I/O banks) (1)
780-Pin
FineLine BGA
1A and 2A, 5A and 6A (left and right I/O banks)
3A and 4A, 7A and 8A (bottom and top I/O banks) (1)
■ EP4SE360
■ EP4SGX70
3A and 4A, 7A and 8A (bottom and top I/O banks) (1)
■ EP4SGX110
■ EP4SGX180
■ EP4SGX230
■ EP4SGX290 (2)
■ EP4SGX360 (2)
■ EP4SGX530 (2)
■ EP4SE360
1A and 1C, 6A and 6C (left and right I/O banks)
3A and 3B, 4A and 4B (bottom I/O banks)
7A and 7B, 8A and 8B (top I/O banks)
1152-Pin
FineLine BGA
1A and 1C, 2A and 2C (left I/O banks)
3A and 3B, 4A and 4B (bottom I/O banks)
5A and 5C, 6A and 6C (right I/O banks)
7A and 7B, 8A and 8B (top I/O banks)
■ EP4SE530
■ EP4SE820
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
7–28
Chapter 7: External Memory Interfaces in Stratix IV Devices
Memory Interfaces Pin Support
Table 7–3. Possible Group Combinations in Stratix IV Devices (Part 2 of 2)
Package
Device Density
■ EP4SGX180
I/O Sub-Bank Combinations
1A and 1C, 2A and 2C (left I/O banks)
3A and 3B, 4A and 4B (bottom I/O banks)
5A and 5C, 6A and 6C (right I/O banks)
7A and 7B, 8A and 8B (top I/O banks)
■ EP4SGX230
■ EP4SGX290 (2)
■ EP4SGX360 (2)
■ EP4SGX530 (2)
■ EP4SE530 (2)
■ EP4SE820 (2)
1A and 1B, 2A and 2B or 1B and 1C, 2B and 2C (left I/O
banks) (3)
5A and 5B, 6A and 6B or 5B and 5C, 6B and 6C (right I/O
1517-Pin
FineLine BGA
banks) (3)
■ EP4S40G2
■ EP4S40G5
■ EP4S100G2
■ EP4S100G5
■ EP4SGX290
■ EP4SGX360
■ EP4SGX530
3A and 3B, 4A and 4B (bottom I/O banks)
7A and 7B, 8A and 8B (top I/O banks)
1A and 1C, 2A and 2C (left I/O banks)
3A and 3B, 4A and 4B (bottom I/O banks)
5A and 5C, 6A and 6C (right I/O banks)
7A and 7B, 8A and 8B (top I/O banks)
1760-Pin
FineLine BGA
■ EP4SE530 (2)
■ EP4SE820 (2)
1A and 1B, 2A and 2B or 1B and 1C, 2B and 2C (left I/O
banks) (3)
5A and 5B, 6A and 6B or 5B and 5C, 6B and 6C (right I/O
banks) (3)
■ EP4SGX290 (2)
■ EP4SGX360 (2)
■ EP4SGX530 (2)
1932-Pin
FineLine BGA
1A and 1C, 2A and 2C (left I/O banks)
5A and 5C, 6A and 6C (right I/O banks)
Notes to Table 7–3:
(1) Each side of the device in these packages has four remaining ×8/×9 groups. You can combine them for the write
side (only) if you want to keep the ×36 QDR II+/QDR II SRAM interface on one side of the device. You must change
the Memory Interface Data Group default assignment from the default 18 to 9 in this case.
(2) This device supports ×36 DQS/DQ groups on the top and bottom I/O banks natively.
(3) Although it is possible to combine the ×16/×18 DQS/DQ groups from I/O banks 1A and 1C, 2A and 2C, 5A and 5C,
and 6A and 6C, Altera does not recommend this due to the size of the package. Similarly, crossing a bank number
(for example, combining groups from I/O banks 6C and 5C) is not supported in this package.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 7: External Memory Interfaces in Stratix IV Devices
7–29
Stratix IV External Memory Interface Features
Stratix IV External Memory Interface Features
Stratix IV devices are rich with features that allow robust high-performance external
memory interfacing. The ALTMEMPHY megafunction allows you to use these
external memory interface features and helps set up the physical interface (PHY) best
suited for your system. This section describes each Stratix IV device feature that is
used in external memory interfaces from the DQS phase-shift circuitry, DQS logic
block, leveling multiplexers, and dynamic OCT control block.
1
The ALTMEMPHY megafunction and the Altera memory controller MegaCore®
functions can run at half the frequency of the I/O interface of the memory devices to
allow better timing management in high-speed memory interfaces. Stratix IV devices
have built-in registers in the IOE to convert data from full-rate (the I/O frequency) to
half-rate (the controller frequency) and vice versa. You can bypass these registers if
your memory controller is not running at half the rate of the I/O frequency. When
using the Altera memory controller MegaCore functions, the ALTMEMPHY
megafunction is instantiated for you.
f
For more information about the ALTMEMPHY megafunction, refer to the External
Memory PHY Interface (ALTMEMPHY) (nonAFI) Megafunction User Guide.
DQS Phase-Shift Circuitry
Stratix IV phase-shift circuitry provides phase shift to the DQS/CQ and CQn pins on
read transactions when the DQS/CQ and CQn pins are acting as input clocks or
strobes to the FPGA. The DQS phase-shift circuitry consists of DLLs that are shared
between multiple DQS pins and the phase-offset module to further fine-tune the DQS
phase shift for different sides of the device.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
7–30
Chapter 7: External Memory Interfaces in Stratix IV Devices
Stratix IV External Memory Interface Features
Figure 7–21 shows how the DQS phase-shift circuitry is connected to the DQS/CQ
and CQn pins in the device where memory interfaces are supported on all sides of the
Stratix IV device.
Figure 7–21. DQS/CQ and CQn Pins and DQS Phase-Shift Circuitry (Note 1), (2)
DQS/CQ
Pin
CQn
Pin
DQS/CQ
Pin
CQn
Pin
DLL
DLL
Reference
Clock
Reference
Clock
DQS Logic
Blocks
Δt
Δt
Δt
Δt
DQS
DQS
Phase-Shift
Circuitry
Phase-Shift
Circuitry
to IOE
to IOE
to IOE
to IOE
DQS Logic
Blocks
to
IOE
CQn
Pin
Δt
to
IOE
DQS/CQ
Pin
Δt
Δt
to
IOE
DQS/CQ
Pin
Δt
to
IOE
CQn
Pin
to
IOE
CQn
Pin
Δt
Δt
DQS/CQ
Pin
to
IOE
Δt
Δt
to
IOE
DQS/CQ
Pin
to
IOE
CQn
Pin
to IOE
to IOE
to IOE
to IOE
DQS
DQS
Phase-Shift
Circuitry
Phase-Shift
Circuitry
Δt
Δt
Δt
Δt
DLL
DLL
Reference
Clock
Reference
Clock
DQS/CQ
Pin
DQS/CQ
Pin
CQn
Pin
CQn
Pin
Notes to Figure 7–21:
(1) For possible reference input clock pins for each DLL, refer to “DLL” on page 7–31.
(2) You can configure each DQS/CQ and CQn pin with a phase shift based on one of two possible DLL output settings.
DQS phase-shift circuitry is connected to the DQS logic blocks that control each
DQS/CQ or CQn pin. The DQS logic blocks allow the DQS delay settings to be
updated concurrently at every DQS/CQ or CQn pin.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 7: External Memory Interfaces in Stratix IV Devices
7–31
Stratix IV External Memory Interface Features
DLL
DQS phase-shift circuitry uses a DLL to dynamically control the clock delay needed
by the DQS/CQ and CQn pin. The DLL, in turn, uses a frequency reference to
dynamically generate control signals for the delay chains in each of the DQS/CQ and
CQn pins, allowing it to compensate for PVT variations. The DQS delay settings are
Gray-coded to reduce jitter when the DLL updates the settings. The phase-shift
circuitry needs 1,280 clock cycles to lock and calculate the correct input clock period
when the DLL is in low jitter mode. Otherwise, only 256 clock cycles are needed. Do
not send data during these clock cycles because there is no guarantee that it will be
captured properly. As the settings from the DLL may not be stable until this lock
period has elapsed, be aware that anything using these settings (including the
leveling delay system) may be unstable during this period.
1
You can still use the DQS phase-shift circuitry for any memory interfaces that are less
than 100 MHz. However, the DQS signal may not shift over 2.5 ns. Even if the DQS
signal is not shifted exactly to the middle of the DQ valid window, the I/O element
should still be able to capture the data in low-frequency applications in which a large
amount of timing margin is available.
There are a maximum of four DLLs in a Stratix IV device, located in each corner of the
device. These four DLLs support a maximum of four unique frequencies, with each
DLL running at one frequency. Each DLL can have two outputs with different phase
offsets, which allows one Stratix IV device to have eight different DLL phase shift
settings.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
7–32
Chapter 7: External Memory Interfaces in Stratix IV Devices
Stratix IV External Memory Interface Features
Figure 7–22 shows the DLL and I/O bank locations in Stratix IV devices from a
die-top view if all sides of the device support external memory interfaces.
Figure 7–22. Stratix IV DLL and I/O Bank Locations (Die-Top View)
PLL_R1
PLL_L1
7C
8A
8B
8C
PLL_T2
7B
7A
PLL_T1
6
6
DLL0
6
DLL3
6
1A
1B
6A
6B
6C
1C
PLL_R2
PLL_R3
PLL_L2
PLL_L3
Stratix IV FPGA
2C
2B
2A
5C
5B
5A
6
6
DLL2
DLL1
6
6
PLL_L4
PLL_B1
PLL_B2
4C
3A
3C
4A
3B
4B
PLL_R4
The DLL can access the two adjacent sides from its location within the device. For
example, DLL0 on the top left of the device can access the top side (I/O banks 7A, 7B,
7C, 8A, 8B, and 8C) and the left side of the device (I/O banks 1A, 1B, 1C, 2A, 2B, and
2C). This means that each I/O bank is accessible by two DLLs, giving more flexibility
to create multiple frequencies and multiple-type interfaces. You can have two
different interfaces with the same frequency on the two sides adjacent to a DLL,
where the DLL controls the DQS delay settings for both interfaces.
Each bank can use settings from either or both DLLs the bank is adjacent to. For
example, DQS1Lcan get its phase-shift settings from DLL0, while DQS2Lcan get its
phase-shift settings from DLL1. Table 7–4 lists the DLL location and supported I/O
banks for Stratix IV devices.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 7: External Memory Interfaces in Stratix IV Devices
7–33
Stratix IV External Memory Interface Features
1
You can only have one memory interface in each I/O sub-bank (such as I/O
sub-banks 1A, 1B, and 1C) when you use leveling delay chains. This is because there
is only one leveling delay chain per I/O sub-bank.
Table 7–4. DLL Location and Supported I/O Banks
DLL
DLL0
Location
Accessible I/O Banks (1)
Top-left corner
1A, 1B, 1C, 2A, 2B, 2C, 7A, 7B, 7C, 8A, 8B, 8C
1A, 1B, 1C, 2A, 2B, 2C, 3A, 3B, 3C, 4A, 4B, 4C
3A, 3B, 3C, 4A, 4B, 4C, 5A, 5B, 5C, 6A, 6B, 6C
5A, 5B, 5C, 6A, 6B, 6C, 7A, 7B, 7C, 8A, 8B, 8C
DLL1
DLL2
DLL3
Bottom-left corner
Bottom-right corner
Top-right corner
Note to Table 7–4:
(1) The DLL can access these I/O banks if they are available for memory interfacing.
The reference clock for each DLL may come from PLL output clocks or any of the two
dedicated clock input pins located in either side of the DLL. Table 7–5 through
Table 7–17 lists the available DLL reference clock input resources for the Stratix IV
device family.
1
When you have a dedicated PLL that only generates the DLL input reference clock,
set the PLL mode to No Compensation to achieve better performance or the
Quartus II software changes it automatically. Because the PLL does not use any other
outputs, it does not need to compensate for any clock paths.
Table 7–5. DLL Reference Clock Input for EP4SGX70, EP4SGX110, EP4SGX180, and EP4SGX230 Devices in the 780-Pin
FineLine BGA Package
CLKIN
(Top/Bottom)
CLKIN
(Left/Right)
PLL
(Top/Bottom)
PLL
(Left/Right)
PLL
(Corner)
DLL
CLK12P
CLK13P
CLK14P
CLK15P
CLK4P
CLK5P
CLK6P
CLK7P
CLK4P
CLK5P
CLK6P
CLK7P
CLK12P
CLK13P
CLK14P
CLK15P
CLK0P
CLK1P
CLK2P
CLK3P
CLK0P
CLK1P
CLK2P
CLK3P
DLL0
PLL_T1
PLL_B1
PLL_B1
PLL_T1
PLL_L2
—
—
—
—
—
DLL1
DLL2
DLL3
—
—
—
—
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
7–34
Chapter 7: External Memory Interfaces in Stratix IV Devices
Stratix IV External Memory Interface Features
Table 7–6. DLL Reference Clock Input for EP4SE230 and EP4SE360 Devices in the 780-Pin FineLine BGA Package
CLKIN
(Top/Bottom)
CLKIN
(Left/Right)
PLL
(Top/Bottom)
PLL
(Left/Right)
PLL
(Corner)
DLL
CLK12P
CLK13P
CLK14P
CLK15P
CLK4P
CLK5P
CLK6P
CLK7P
CLK4P
CLK5P
CLK6P
CLK7P
CLK12P
CLK13P
CLK14P
CLK15P
CLK0P
CLK1P
CLK2P
CLK3P
CLK0P
CLK1P
CLK2P
CLK3P
CLK8P
CLK9P
CLK10P
CLK11P
CLK8P
CLK9P
CLK10P
CLK11P
DLL0
DLL1
DLL2
DLL3
PLL_T1
PLL_B1
PLL_B1
PLL_T1
PLL_L2
PLL_L2
PLL_R2
PLL_R2
—
—
—
—
Table 7–7. DLL Reference Clock Input for EP4SGX290 and EP4SGX360 Devices in the 780-Pin FineLine BGA Package
CLKIN
(Left/Right)
PLL
(Left/Right)
PLL
(Corner)
DLL
CLKIN (Top/Bottom)
PLL (Top/Bottom)
CLK12P
CLK13P
CLK14P
CLK15P
CLK4P
CLK5P
CLK6P
CLK7P
CLK4P
CLK5P
CLK6P
CLK7P
CLK12P
CLK13P
CLK14P
CLK15P
DLL0
—
—
—
—
PLL_T1
—
—
—
—
—
—
—
—
DLL1
DLL2
DLL3
PLL_B1
PLL_B2
PLL_T2
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 7: External Memory Interfaces in Stratix IV Devices
7–35
Stratix IV External Memory Interface Features
Table 7–8. DLL Reference Clock Input for EP4SGX70 and EP4SGX110 Devices in the 1152-Pin FineLine BGA Package
(with 24 Transceivers)
CLKIN
(Top/Bottom)
CLKIN
(Left/Right)
PLL
(Top/Bottom)
PLL
(Left/Right)
PLL
(Corner)
DLL
CLK12P
CLK13P
CLK14P
CLK15P
CLK0P
CLK1P
CLK2P
CLK3P
DLL0
PLL_T1
PLL_B1
PLL_B1
PLL_T1
PLL_L2
PLL_L2
PLL_R2
PLL_R2
—
—
—
—
CLK4P
CLK5P
CLK6P
CLK7P
CLK0P
CLK1P
CLK2P
CLK3P
DLL1
DLL2
DLL3
CLK4P
CLK5P
CLK6P
CLK7P
CLK8P
CLK9P
CLK10P
CLK11P
CLK12P
CLK13P
CLK14P
CLK15P
CLK8P
CLK9P
CLK10P
CLK11P
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
7–36
Chapter 7: External Memory Interfaces in Stratix IV Devices
Stratix IV External Memory Interface Features
Table 7–9. DLL Reference Clock Input for EP4SGX110 Devices in the 1152-Pin FineLine BGA Package (with 16
Transceivers)
CLKIN
(Top/Bottom)
CLKIN
(Left/Right)
PLL
(Top/Bottom)
PLL
(Left/Right)
PLL
(Corner)
DLL
CLK12P
CLK13P
CLK14P
CLK15P
CLK4P
CLK5P
CLK6P
CLK7P
CLK4P
CLK5P
CLK6P
CLK7P
CLK12P
CLK13P
CLK14P
CLK15P
CLK0P
CLK1P
DLL0
PLL_T1
PLL_B1
PLL_B1
PLL_T1
PLL_L2
—
—
—
—
—
CLK0P
CLK1P
DLL1
DLL2
DLL3
CLK10P
CLK11P
—
CLK10P
CLK11P
PLL_R2
Table 7–10. DLL Reference Clock Input for EP4SGX180, EP4SGX230, EP4SGX290, EP4SGX360, and EP4SGX530 Devices
in the 1152-Pin FineLine BGA Package
CLKIN
(Top/Bottom)
CLKIN
(Left/Right)
PLL
(Top/Bottom)
PLL
(Left/Right)
PLL
(Corner)
DLL
CLK12P
CLK13P
CLK14P
CLK15P
CLK4P
CLK5P
CLK6P
CLK7P
CLK4P
CLK5P
CLK6P
CLK7P
CLK12P
CLK13P
CLK14P
CLK15P
CLK0P
CLK1P
DLL0
PLL_T1
PLL_B1
PLL_B2
PLL_T2
PLL_L2
—
—
—
—
—
CLK0P
CLK1P
DLL1
DLL2
DLL3
CLK10P
CLK11P
—
CLK10P
CLK11P
PLL_R2
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 7: External Memory Interfaces in Stratix IV Devices
7–37
Stratix IV External Memory Interface Features
Table 7–11. DLL Reference Clock Input for EP4SE360, EP4SE530, and EP4SE820 Devices in the 1152-Pin FineLine BGA
Packages
CLKIN
(Top/Bottom)
CLKIN
(Left/Right)
PLL
(Top/Bottom)
PLL
(Left/Right)
PLL
(Corner)
DLL
CLK12P
CLK13P
CLK14P
CLK15P
CLK4P
CLK5P
CLK6P
CLK7P
CLK4P
CLK5P
CLK6P
CLK7P
CLK12P
CLK13P
CLK14P
CLK15P
CLK0P
CLK1P
CLK2P
CLK3P
CLK0P
CLK1P
CLK2P
CLK3P
CLK8P
CLK9P
CLK10P
CLK11P
CLK8P
CLK9P
CLK10P
CLK11P
DLL0
PLL_T1
PLL_B1
PLL_B2
PLL_T2
PLL_L2
PLL_L3
PLL_R3
PLL_R2
—
—
—
—
DLL1
DLL2
DLL3
Table 7–12. DLL Reference Clock Input for EP4SE530 and EP4SE820 Devices in the 1517- and 1760-Pin FineLine BGA
Packages
CLKIN
(Top/Bottom)
CLKIN
(Left/Right)
PLL
(Top/Bottom)
PLL
(Left/Right)
PLL
(Corner)
DLL
CLK12P
CLK13P
CLK14P
CLK15P
CLK4P
CLK5P
CLK6P
CLK7P
CLK4P
CLK5P
CLK6P
CLK7P
CLK12P
CLK13P
CLK14P
CLK15P
CLK0P
CLK1P
CLK2P
CLK3P
CLK0P
CLK1P
CLK2P
CLK3P
CLK8P
CLK9P
CLK10P
CLK11P
CLK8P
CLK9P
CLK10P
CLK11P
DLL0
PLL_T1
PLL_B1
PLL_B2
PLL_T2
PLL_L2
PLL_L3
PLL_R3
PLL_R2
PLL_L1
PLL_L4
PLL_R4
PLL_R1
DLL1
DLL2
DLL3
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
7–38
Chapter 7: External Memory Interfaces in Stratix IV Devices
Stratix IV External Memory Interface Features
Table 7–13. DLL Reference Clock Input for EP4SGX180, EP4SGX230, EP4SGX290, EP4SGX360, and EP4SGX530 Devices
in the 1517-Pin FineLine BGA Package
CLKIN
(Top/Bottom)
CLKIN
(Left/Right)
PLL
(Top/Bottom)
PLL
(Left/Right)
PLL
(Corner)
DLL
CLK12P
CLK13P
CLK14P
CLK15P
CLK4P
CLK5P
CLK6P
CLK7P
CLK4P
CLK5P
CLK6P
CLK7P
CLK12P
CLK13P
CLK14P
CLK15P
CLK0P
CLK1P
CLK2P
CLK3P
CLK0P
CLK1P
CLK2P
CLK3P
CLK8P
CLK9P
CLK10P
CLK11P
CLK8P
CLK9P
CLK10P
CLK11P
DLL0
PLL_T1
PLL_B1
PLL_B2
PLL_T2
PLL_L2
PLL_L3
PLL_R3
PLL_R2
—
—
—
—
DLL1
DLL2
DLL3
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 7: External Memory Interfaces in Stratix IV Devices
7–39
Stratix IV External Memory Interface Features
Table 7–14. DLL Reference Clock Input for EP4S40G2, EP4S40G5, EP4S100G2, and EP4S100G5 Devices in the 1517-Pin
FineLine BGA Package
CLKIN
(Top/Bottom)
CLKIN
(Left/Right)
PLL
(Top/Bottom)
PLL
(Left/Right)
PLL
(Corner)
DLL
CLK12P
CLK13P
CLK14P
CLK15P
CLK1P
CLK3P
DLL0
PLL_T1
PLL_B1
PLL_B2
PLL_T2
PLL_L2
PLL_L3
PLL_R3
PLL_R2
—
—
—
—
CLK4P
CLK5P
CLK6P
CLK7P
CLK1P
CLK3P
DLL1
DLL2
DLL3
CLK4P
CLK5P
CLK6P
CLK7P
CLK8P
CLK10P
CLK12P
CLK13P
CLK14P
CLK15P
CLK8P
CLK10P
Table 7–15. DLL Reference Clock Input for EP4SGX290, EP4SGX360, and EP4SGX530 Devices in the 1760-Pin FineLine
BGA Package
CLKIN
(Top/Bottom)
CLKIN
(Left/Right)
PLL
(Top/Bottom)
PLL
(Left/Right)
PLL
(Corner)
DLL
CLK12P
CLK13P
CLK14P
CLK15P
CLK0P
CLK1P
CLK2P
CLK3P
DLL0
PLL_T1
PLL_B1
PLL_B2
PLL_T2
PLL_L2
PLL_L3
PLL_R3
PLL_R2
—
—
—
—
CLK4P
CLK5P
CLK6P
CLK7P
CLK0P
CLK1P
CLK2P
CLK3P
DLL1
DLL2
DLL3
CLK4P
CLK5P
CLK6P
CLK7P
CLK8P
CLK9P
CLK10P
CLK11P
CLK12P
CLK13P
CLK14P
CLK15P
CLK8P
CLK9P
CLK10P
CLK11P
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
7–40
Chapter 7: External Memory Interfaces in Stratix IV Devices
Stratix IV External Memory Interface Features
Table 7–16. DLL Reference Clock Input for EP4SGX290, EP4SGX360, and EP4SGX530 Devices in the 1932-Pin FineLine
BGA Package
CLKIN
(Top/Bottom)
CLKIN
(Left/Right)
PLL
(Top/Bottom)
PLL
(Left/Right)
PLL
(Corner)
DLL
CLK12P
CLK13P
CLK14P
CLK15P
CLK4P
CLK5P
CLK6P
CLK7P
CLK4P
CLK5P
CLK6P
CLK7P
CLK12P
CLK13P
CLK14P
CLK15P
CLK0P
CLK1P
CLK2P
CLK3P
CLK0P
CLK1P
CLK2P
CLK3P
CLK8P
CLK9P
CLK10P
CLK11P
CLK8P
CLK9P
CLK10P
CLK11P
DLL0
PLL_T1
PLL_B1
PLL_B2
PLL_T2
PLL_L2
PLL_L3
PLL_R3
PLL_R2
PLL_L1
PLL_L4
PLL_R4
PLL_R1
DLL1
DLL2
DLL3
Table 7–17. DLL Reference Clock Input for EP4S100G3, EP4S100G4, and EP4S100G5 Devices in the 1932-Pin FineLine
BGA Package
CLKIN
(Top/Bottom)
CLKIN
(Left/Right)
PLL
(Top/Bottom)
PLL
(Left/Right)
PLL
(Corner)
DLL
CLK12P
CLK13P
CLK14P
CLK15P
DLL0
—
—
PLL_T1
PLL_B1
PLL_B2
PLL_T2
PLL_L2
PLL_L3
PLL_R3
PLL_R2
PLL_L1
PLL_L4
PLL_R4
PLL_R1
CLK4P
CLK5P
CLK6P
CLK7P
DLL1
DLL2
DLL3
CLK4P
CLK5P
CLK6P
CLK7P
CLK9P
CLK11P
CLK12P
CLK13P
CLK14P
CLK15P
CLK9P
CLK11P
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 7: External Memory Interfaces in Stratix IV Devices
7–41
Stratix IV External Memory Interface Features
Figure 7–23 shows a simple block diagram of the DLL. The input reference clock goes
into the DLL to a chain of up to 16 delay elements. The phase comparator compares
the signal coming out of the end of the delay chain block to the input reference clock.
The phase comparator then issues the upndnsignal to the Gray-code counter. This
signal increments or decrements a six-bit delay setting (DQS delay settings) that
increases or decreases the delay through the delay element chain to bring the input
reference clock and the signals coming out of the delay element chain in phase.
Figure 7–23. Simplified Diagram of the DQS Phase-Shift Circuitry (Note 1)
addnsub
Phase offset settings
from the logic array
( offset [5:0] )
Phase offset
settings to DQS pins
on top or bottom edge
6
Phase
Offset
Control
A
(3)
6
( offsetctrlout [5:0] )
offsetdelayctrlin [5:0]
DLL
aload
offsetdelayctrlout [5:0]
offsetdelayctrlout [5:0]
(dll_offset_ctrl_a)
Input Reference
addnsub
Phase offset settings
Clock (2)
upndnin
clk
from the logic array ( offset [5:0] )
Phase
Comparator
Up/Down
Counter
6
upndninclkena
Phase
Offset
Control
Phase offset
settings to DQS pin
on left or right edge(3)
( offsetctrlout [5:0] )
B
6
offsetdelayctrlin [5:0]
DQS Delay
6
(dll_offset_ctrl_b)
Delay Chains
delayctrlout [5:0]
dqsupdate
6
Settings (4)
6
Notes to Figure 7–23:
(1) All features of the DQS phase-shift circuitry are accessible from the ALTMEMPHY megafunction in the Quartus II software.
(2) The input reference clock for the DQS phase-shift circuitry can come from a PLL output clock or an input clock pin. For more information, refer
to Table 7–5 on page 7–33 through Table 7–17 on page 7–40.
(3) Phase offset settings can only go to the DQS logic blocks.
(4) DQS delay settings can go to the logic array, DQS logic block, and leveling circuitry.
1
In the Quartus II assignment, phase offset control block ‘A’ is designated as
DLLOFFSETCTRL_<coordinate x>_<coordinate y>_N1and phase offset control block
‘B’ is designated as DLLOFFSETCTRL_<coordinate x>_<coordinate y>_N2
.
You can reset the DLL from either the logic array or a user I/O pin. Each time the DLL
is reset, you must wait for 1,280 clock cycles for the DLL to lock before you can
capture the data properly.
Depending on the DLL frequency mode, the DLL can shift the incoming DQS signals
by 0°, 22.5°, 30°, 36°, 45°, 60°, 67.5°, 72°, 90°, 108°, 120°, 135°, 144°, 180°, or 240°. The
shifted DQS signal is then used as the clock for the DQ IOE input registers.
All DQS/CQ and CQn pins, referenced to the same DLL, can have their input signal
phase shifted by a different degree amount but all must be referenced at one
particular frequency. For example, you can have a 90° phase shift on DQS1Tand a 60°
phase shift on DQS2T, referenced from a 200-MHz clock. Not all phase-shift
combinations are supported. The phase shifts on the DQS pins referenced by the same
DLL must all be a multiple of 22.5° (up to 90°), 30° (up to 120°), 36° (up to 144°), 45°
(up to 180°), or 60° (up to 240°).
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
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Chapter 7: External Memory Interfaces in Stratix IV Devices
Stratix IV External Memory Interface Features
There are eight different frequency modes for the Stratix IV DLL, as listed in
Table 7–18. Each frequency mode provides different phase shift selections. In
frequency mode 0, 1, 2, and 3, the 6-bit DQS delay settings vary with PVT to
implement the phase-shift delay. In frequency modes 4, 5, 6, and 7, only 5 bits of the
DQS delay settings vary with PVT to implement the phase-shift delay; the most
significant bit of the DQS delay setting is set to 0.
Table 7–18. Stratix IV DLL Frequency Modes
Frequency Mode
Available Phase Shift
22.5, 45, 67.5, 90
30, 60, 90, 120
Number of Delay Chains
0
1
2
3
4
5
6
7
16
12
10
8
36, 72, 108, 144
45, 90, 135, 180
30, 60, 90, 120
12
10
8
36, 72, 108, 144
45, 90, 135, 180
60, 120, 180, 240
6
f
For the frequency range of each mode, refer to the DC and Switching Characteristics for
Stratix IV Devices chapter.
For 0° shift, the DQS/CQ signal bypasses both the DLL and DQS logic blocks. The
Quartus II software automatically sets the DQ input delay chains so that the skew
between the DQ and DQS/CQ pin at the DQ IOE registers is negligible when 0° shift
is implemented. You can feed the DQS delay settings to the DQS logic block and logic
array.
The shifted DQS/CQ signal goes to the DQS bus to clock the IOE input registers of the
DQ pins. The signal can also go into the logic array for resynchronization if you are
not using IOE resynchronization registers. The shifted CQn signal can only go to the
negative-edge input register in the DQ IOE and is only used for QDR II+ and QDR II
SRAM interfaces.
Phase Offset Control
Each DLL has two phase-offset modules and can provide two separate DQS delay
settings with independent offsets, one for the top and bottom I/O bank and one for
the left and right I/O bank, so you can fine-tune the DQS phase-shift settings between
two different sides of the device. Even though you have independent phase offset
control, the frequency of the interface using the same DLL must be the same. Use the
phase offset control module for making small shifts to the input signal and use the
DQS phase-shift circuitry for larger signal shifts. For example, if the DLL only offers a
multiple of 30° phase shift, but your interface needs a 67.5° phase shift on the DQS
signal, you can use two delay chains in the DQS logic blocks to give you 60° phase
shift and use the phase offset control feature to implement the extra 7.5° phase shift.
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Stratix IV External Memory Interface Features
You can use either a static phase offset or a dynamic phase offset to implement the
additional phase shift. The available additional phase shift is implemented in 2’s:
complement in Gray-code between settings –64 to +63 for frequency mode 0, 1, 2, and
3, and between settings –32 to +31 for frequency modes 4, 5, 6, and 7. An additional bit
indicates whether the setting has a positive or negative value. The settings are linear,
each phase offset setting adds a delay amount specified in the DC and Switching
Characteristics for Stratix IV Devices chapter. The DQS phase shift is the sum of the DLL
delay settings and the user-selected phase offset settings whose top setting is 64 for
frequency modes 0, 1, 2, and 3; and 32 for frequency modes 4, 5, 6, and 7, so the actual
physical offset setting range is 64 or 32 subtracted by the DQS delay settings from the
DLL.
1
When using this feature, you need to monitor the DQS delay settings to know how
many offsets you can add and subtract in the system. Note that the DQS delay settings
output by the DLL are also Gray coded.
For example, if the DLL determines that DQS delay settings of 28 is needed to achieve
a 30° phase shift in DLL frequency mode 1, you can subtract up to 28 phase offset
settings and you can add up to 35 phase offset settings to achieve the optimal delay
that you need. However, if the same DQS delay settings of 28 is needed to achieve 30°
phase shift in DLL frequency mode 4, you can still subtract up to 28 phase offset
settings, but you can only add up to 3 phase offset settings before the DQS delay
settings reach their maximum settings because DLL frequency mode 4 only uses 5-bit
DLL delay settings.
f
For more information about the value for each step, refer to the DC and Switching
Characteristics for Stratix IV Devices chapter.
When using static phase offset, you can specify the phase offset amount in the
ALTMEMPHY megafunction as a positive number for addition or a negative number
for subtraction. You can also have a dynamic phase offset that is always added to,
subtracted from, or both added to and subtracted from the DLL phase shift. When
you always add or subtract, you can dynamically input the phase offset amount into
the dll_offset[5..0]port. When you want to both add and subtract dynamically,
you control the addnsubsignal in addition to the dll_offset[5..0]signals.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
DQS Logic Block
Each DQS/CQ and CQn pin is connected to a separate DQS logic block, which consists of the DQS delay chains, update enable
circuitry, and DQS postamble circuitry, as shown in Figure 7–24.
Figure 7–24. Stratix IV DQS Logic Block
DQS Delay Chain
DQS Enable
dqsenable (2)
1xx
000
001
010
011
PRE
dqsbusout
Q
D
Bypass
dqsin
dqsbusout
DQS bus
phasectrlin[2:0]
DQS/CQ or
CQn Pin
dqsin
6
6
DQS Enable Control
delayctrlin
phasectrlin
0
1
0
1
6
6
4
<dqs_ctrl_latches_enable>
6
6
offsetctrlin [5:0]
Resynchronization
phaseinvertctrl
6
Phase offset
settings from the
DQS phase-shift
circuitry
Clock
1
0
clk
0111
D
D
Q
Q
Update
Enable
Circuitry
dqsupdateen
0110
0101
0100
0011
0010
0001
0000
0
1
<dqs_offsetctrl_enable>
<level_dqs_enable>
6
DQS delay
postamble control clock
settings from the
DQS phase-shift
circuitry
delayctrlin [5:0]
0
Postamble
Enable
0
1
dqsenableout
Input Reference
Clock (1)
0
1
1
dqsenablein
enaphasetransferreg
<delay_dqs_enable_by_half_cycle>
Notes to Figure 7–24:
(1) The input reference clock for the DQS phase-shift circuitry can come from a PLL output clock or an input clock pin. For more information, refer to Table 7–5 on page 7–33 through Table 7–17 on page 7–40.
(2) The dqsenablesignal can also come from the Stratix IV FPGA fabric.
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Stratix IV External Memory Interface Features
DQS Delay Chain
DQS delay chains consist of a set of variable delay elements to allow the input
DQS/CQ and CQn signals to be shifted by the amount specified by the DQS
phase-shift circuitry or the logic array. There are four delay elements in the DQS delay
chain; the first delay chain closest to the DQS/CQ pin can be shifted either by the
DQS delay settings or by the sum of the DQS delay setting and the phase-offset
setting. The number of delay chains required is transparent because the
ALTMEMPHY megafunction automatically sets it when you choose the operating
frequency. The DQS delay settings can come from the DQS phase-shift circuitry on
either end of the I/O banks or from the logic array.
The delay elements in the DQS logic block have the same characteristics as the delay
elements in the DLL. When the DLL is not used to control the DQS delay chains, you
can input your own Gray-coded 6-bit or 5-bit settings using the
dqs_delayctrlin[5..0]signals available in the ALTMEMPHY megafunction. These
settings control 1, 2, 3, or all 4 delay elements in the DQS delay chains. The
ALTMEMPHY megafunction can also dynamically choose the number of DQS delay
chains needed for the system. The amount of delay is equal to the sum of the delay
element’s intrinsic delay and the product of the number of delay steps and the value
of the delay steps.
You can also bypass the DQS delay chain to achieve a 0° phase shift.
Update Enable Circuitry
Both the DQS delay settings and the phase-offset settings pass through a register
before going into the DQS delay chains. The registers are controlled by the update
enable circuitry to allow enough time for any changes in the DQS delay setting bits to
arrive at all the delay elements. This allows them to be adjusted at the same time. The
update enable circuitry enables the registers to allow enough time for the DQS delay
settings to travel from the DQS phase-shift circuitry or core logic to all the DQS logic
blocks before the next change. It uses the input reference clock or a user clock from the
core to generate the update enable output. The ALTMEMPHY megafunction uses this
circuit by default. Figure 7–25 shows an example waveform of the update enable
circuitry output.
Figure 7–25. DQS Update Enable Waveform
DLL Counter Update
(Every 8 cycles)
DLL Counter Update
(Every 8 cycles)
System Clock
DQS Delay Settings
6 bit
(Updated every 8 cycles)
Update Enable
Circuitry Output
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Chapter 7: External Memory Interfaces in Stratix IV Devices
Stratix IV External Memory Interface Features
DQS Postamble Circuitry
For external memory interfaces that use a bidirectional read strobe such as in DDR3,
DDR2, and DDR SDRAM, the DQS signal is low before going to or coming from a
high-impedance state. The state in which DQS is low, just after a high-impedance
state, is called the preamble; the state in which DQS is low, just before it returns to a
high-impedance state, is called the postamble. There are preamble and postamble
specifications for both read and write operations in DDR3, DDR2, and DDR SDRAM.
The DQS postamble circuitry ensures that data is not lost if there is noise on the DQS
line during the end of a read operation that occurs while DQS is in a postamble state.
Stratix IV devices have dedicated postamble registers that you can control to ground
the shifted DQS signal used to clock the DQ input registers at the end of a read
operation. This ensures that any glitches on the DQS input signals during the end of a
read operation that occurs while DQS is in a postamble state do not affect the DQ IOE
registers.
In addition to the dedicated postamble register, Stratix IV devices also have an HDR
block inside the postamble enable circuitry. Use these registers if the controller is
running at half the frequency of the I/Os.
Using the HDR block as the first stage capture register in the postamble enable
circuitry block is optional. The HDR block is clocked by the half-rate
resynchronization clock, which is the output of the I/O clock divider circuit (shown in
Figure 7–31 on page 7–50). There is an AND gate after the postamble register outputs
that is used to avoid postamble glitches from a previous read burst on a
non-consecutive read burst. This scheme allows a half-a-clock cycle latency for
dqsenableassertion and zero latency for dqsenablede-assertion, as shown in
Figure 7–26.
Figure 7–26. Avoiding Glitch on a Non-Consecutive Read Burst Waveform
Postamble glitch
Preamble
Postamble
DQS
Postamble Enable
dqsenable
Delayed by
1/2T logic
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Stratix IV External Memory Interface Features
Leveling Circuitry
DDR3 SDRAM unbuffered modules use a fly-by clock distribution topology for better
signal integrity. This means that the CK/CK# signals arrive at each DDR3 SDRAM
device in the module at different times. The difference in arrival time between the first
DDR3 SDRAM device and the last device on the module can be as long as 1.6 ns.
Figure 7–27 shows the clock topology in DDR3 SDRAM unbuffered modules.
Figure 7–27. DDR3 SDRAM Unbuffered Module Clock Topology
DQS/DQ
DQS/DQ
DQS/DQ
DQS/DQ
DQS/DQ
DQS/DQ
DQS/DQ CK/CK# DQS/DQ
Stratix IV Device
Because the data and read strobe signals are still point-to-point, take special care to
ensure that the timing relationship between the CK/CK# and DQS signals (tDQSS
,
tDSS, and tDSH) during a write is met at every device on the modules. Furthermore,
read data coming back into the FPGA from the memory is also staggered in a similar
way.
Stratix IV FPGAs have leveling circuitry to address these two situations. There is one
leveling circuitry per I/O sub-bank (for example, I/O sub-bank 1A, 1B, and 1C each
has one leveling circuitry). These delay chains are PVT-compensated by the same DQS
delay settings as the DLL and DQS delay chains.
For frequencies equal to and above 400 MHz, the DLL uses eight delay chains, such
that each delay chain generates a 45° delay. The generated clock phases are
distributed to every DQS logic block that is available in the I/O sub-bank. The delay
chain taps then feeds a multiplexer controlled by the ALTMEMPHY megafunction to
select which clock phases are to be used for that ×4 or × 8 DQS group. Each group can
use a different tap output from the read-leveling and write-leveling delay chains to
compensate for the different CK/CK# delay going into each device on the module.
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Chapter 7: External Memory Interfaces in Stratix IV Devices
Stratix IV External Memory Interface Features
Figure 7–28 and Figure 7–29 show the Stratix IV write- and read-leveling circuitry.
Figure 7–28. Stratix IV Write-Leveling Delay Chains and Multiplexers (Note 1)
Write clk
Write-Leveled DQS Clock
(-900)
Write-Leveled DQ Clock
Note to Figure 7–28:
(1) There is one leveling delay chain per I/O sub-bank (for example, I/O sub-banks 1A, 1B, and 1C). You can only have
one memory interface in each I/O sub-bank when you use the leveling delay chain.
Figure 7–29. Stratix IV Read-Leveling Delay Chains and Multiplexers (Note 1)
I/O Clock Divider (2)
use_masterin
Half-Rate
Resynchronization Clock
slaveout
1
masterin
1
0
DFF
DQS
Half-Rate Source
clkout
0
Synchronous Clock
delayctrlin
6
phaseselect
phasectrlin
4
phaseinvertctrl
Resynchronization Clock
(resync_clk_2x)
0
1
0111
0110
0101
0100
0011
0010
0001
0000
Read-Leveled Resynchronization Clock
Notes to Figure 7–29:
(1) There is one leveling delay chain per I/O sub-bank (for example, I/O sub-banks 1A, 1B, and 1C). You can only have one memory interface in each
I/O sub-bank when you use the leveling delay chain.
(2) Each divider feeds up to six pins (from a 4 DQS group) in the device. To feed wider DQS groups, you must chain multiple clock dividers together
by feeding the slaveoutoutput of one divider to the masterininput of the neighboring pins’ divider.
The –90° write clock of the ALTMEMPHY megafunction feeds the write-leveling
circuitry to produce the clock to generate the DQS and DQ signals. During
initialization, the ALTMEMPHY megafunction picks the correct write-leveled clock
for the DQS and DQ clocks for each DQS/DQ group after sweeping all the available
clocks in the write calibration process. The DQ clock output is –90° phase-shifted
compared to the DQS clock output.
Similarly, the resynchronization clock feeds the read-leveling circuitry to produce the
optimal resynchronization and postamble clock for each DQS/DQ group in the
calibration process. The resynchronization and postamble clocks can use different
clock outputs from the leveling circuitry. The output from the read-leveling circuitry
can also generate the half-rate resynchronization clock that goes to the FPGA fabric.
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Stratix IV External Memory Interface Features
1
The ALTMEMPHY megafunction dynamically calibrates the alignment for read- and
write-leveling during the initialization process.
f
For more information about the ALTMEMPHY megafunction, refer to the External
Memory PHY Interface (ALTMEMPHY) (nonAFI) Megafunction User Guide.
Dynamic On-Chip Termination Control
Figure 7–30 shows the dynamic OCT control block. The block includes all the registers
needed to dynamically turn on OCT RT during a read and turn OCT RT off during a
write.
f
For more information about dynamic on-chip termination control, refer to the I/O
Features in Stratix IV Devices chapter.
Figure 7–30. Stratix IV Dynamic OCT Control Block
OCT Control
OCT Enable
2
DFF
DFF
OCT Half-
Rate Clock
Resynchronization
Registers
HDR
Block
Write
Clock (1)
OCT Control Path
Note to Figure 7–30:
(1) The write clock comes from either the PLL or the write-leveling delay chain.
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Chapter 7: External Memory Interfaces in Stratix IV Devices
Stratix IV External Memory Interface Features
I/O Element Registers
The IOE registers are expanded to allow source-synchronous systems to have faster
register-to-register transfers and resynchronization. Both top and bottom and left and
right IOEs have the same capability. Left and right IOEs have extra features to
support LVDS data transfer.
Figure 7–31 shows the registers available in the Stratix IV input path. The input path
consists of the DDR input registers, resynchronization registers, and HDR block. You
can bypass each block of the input path.
Figure 7–31. Stratix IV IOE Input Registers (Note 1)
Double Data Rate Input Registers
DQ
D
Q
DFF
Input Reg A
I
neg_reg_out
Q
D
Q
D
Differential
Input
Buffer
Half Data Rate Registers
DFF
directin
0
DFF
Input Reg C
Alignment & Synchronization Registers
Input Reg B
DQS/CQ (3), (9)
I
I
To Core
dataout[2]
(7)
1
D
D
D
D
Q
Q
Q
Q
0
1
Q
D
0
1
D
Q
DQSn (9)
CQn (4)
0
dataout
datain [0]
1
DFF
D
Q
To Core
dataout [0]
D
Q
DFF
DFF
DFF
dataoutbypass
(8)
(7)
DFF
D
Q
enaphasetransferreg
DFF
enainputcycledelay
DFF
DFF
<bypass_output_register>(10)
0
1
datain [1]
To Core
dataout [3]
(7)
0
D
Q
D
Q
1
0
dataout
1
To Core
dataout [1]
D
Q
DFF
DFF
D
Q
DFF
(7)
(2)
D
Q
DFF
Resynchronization Clock
(resync_clk_2x) (5)
DFF
DFF
I/O Clock
Divider (6)
to core (7)
Half-Rate Resynchronization Clock (resync_clk_1x)
Notes to Figure 7–31:
(1) You can bypass each register block in this path.
(2) This is the 0-phase resynchronization clock (from the read-leveling delay chain).
(3) The input clock can be from the DQS logic block (whether the postamble circuitry is bypassed or not) or from a global clock line.
(4) This input clock comes from the CQn logic block.
(5) This resynchronization clock comes from a PLL through the clock network (resync_ck_2x).
(6) The I/O clock divider resides adjacent to the DQS logic block. In addition to the PLL and read-leveled resync clock, the I/O clock divider can also
be fed by the DQS bus or CQn bus.
(7) The half-rate data and clock signals feed into a dual-port RAM in the FPGA core.
(8) You can dynamically change the dataoutbypasssignal after configuration to select either the directininput or the output from the half data
rate register to feed dataout
.
(9) The DQS and DQSn signals must be inverted for DDR, DDR2, and DDR3 interfaces. When using Altera’s memory interface IPs, the DQS and DQSn
signals are automatically inverted.
(10) The bypass_output_register option allows you to select either the output from the second mux or the output of the fourth alignment/
synchronization register to feed dataout
.
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Stratix IV External Memory Interface Features
There are three registers in the DDR input registers block. Two registers capture data
on the positive and negative edges of the clock, while the third register aligns the
captured data. You can choose to use the same clock for the positive edge and
negative edge registers, or two complementary clocks (DQS/CQ for the positive-edge
register and DQSn/CQn for the negative-edge register). The third register that aligns
the captured data uses the same clock as the positive edge registers.
The resynchronization registers consist of up to three levels of registers to
resynchronize the data to the system clock domain. These registers are clocked by the
resynchronization clock that is either generated by the PLL or the read-leveling delay
chain. The outputs of the resynchronization registers can go straight to the core or to
the HDR blocks, which are clocked by the divided-down resynchronization clock.
For more information about the read-leveling delay chain, refer to “Leveling
Circuitry” on page 7–47.
Figure 7–32 shows the registers available in the Stratix IV output and output-enable
paths. The path is divided into the HDR block, resynchronization registers, and
output and output-enable registers. The device can bypass each block of the output
and output-enable path.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
Figure 7–32. Stratix IV IOE Output and Output-Enable Path Registers (Note 1)
Half Data Rate to Single Data Rate Output-Enable Registers
Alignment Registers (4)
From Core (2)
D
Q
Double Data Rate Output-Enable Registers
DFF
DFF
0
1
D
Q
D
Q
D
Q
D
Q
DFF
DFF
From Core (2)
D
Q
D
Q
OE Reg AOE
OR2
DFF
1
0
DFF
DFF
DFF
D
Q
Half Data Rate to Single Data Rate Output Registers
Alignment Registers (4)
OE Reg BOE
From Core
(wdata2) (2)
D
D
D
D
Q
Double Data Rate Output Registers
Q
DFF
D
DFF
0
D
Q
D
Q
1
From Core
(wdata0) (2)
TRI
D
Q
DQ or DQS
DFF
DFF
1
0
D
Q
Q
Q
Q
Output Reg Ao
DFF
DFF
DFF
DFF
DFF
D
Q
D
Q
From Core
(wdata3) (2)
DFF
Output Reg Bo
0
1
D
Q
D
Q
From Core
(wdata1) (2)
DFF
D
Q
DFF
DFF
DFF
Half-Rate Clock (3)
Write
Clock (5)
Alignment
Clock (3)
Notes to Figure 7–32:
(1) You can bypass each register block of the output and output-enable paths.
(2) Data coming from the FPGA core are at half the frequency of the memory interface clock frequency in half-rate mode.
(3) The half-rate clock comes from the PLL, while the alignment clock comes from the write-leveling delay chains.
(4) These registers are only used in DDR3 SDRAM interfaces for write-leveling purposes.
(5) The write clock can come from either the PLL or from the write-leveling delay chain. The DQ write clock and DQS write clock have a 90° offset between them.
Chapter 7: External Memory Interfaces in Stratix IV Devices
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Stratix IV External Memory Interface Features
The output path is designed to route combinatorial or registered SDR outputs and
full-rate or half-rate DDR outputs from the FPGA core. Half-rate data is converted to
full-rate using the HDR block, clocked by the half-rate clock from the PLL. The
resynchronization registers are also clocked by the same 0° system clock, except in the
DDR3 SDRAM interface. In DDR3 SDRAM interfaces, the leveling registers are
clocked by the write-leveling clock.
For more information about the write-leveling delay chain, refer to “Leveling
Circuitry” on page 7–47.
The output-enable path has a structure similar to the output path. You can have a
combinatorial or registered output in SDR applications and you can use half-rate or
full-rate operation in DDR applications. Also, the ouput-enable path’s
resynchronization registers have a structure similar to the output path registers,
ensuring that the output-enable path goes through the same delay and latency as the
output path.
Delay Chain
Stratix IV devices have run-time adjustable delay chains in the I/O blocks and the
DQS logic blocks. You can control the delay chain setting through the I/O or the DQS
configuration block output. Figure 7–33 shows the delay chain ports.
Figure 7–33. Delay Chain
delayctrlin [3..0]
<use finedelayctrlin>
finedelayctrlin
datain
Δt
0
1
dataout
Δt
Every I/O block contains the following:
■
■
■
■
Two delay chains in a series between the output registers and the output buffer
One delay chain between the input buffer and the input register
Two delay chains between the output enable and the output buffer
Two delay chains between the OCT RT enable control register and the output
buffer
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Chapter 7: External Memory Interfaces in Stratix IV Devices
Stratix IV External Memory Interface Features
Figure 7–34 shows the delay chains in an I/O block.
Figure 7–34. Delay Chains in an I/O Block
rtena
oe
D5 OCT
Delay
Chain
D5 Output-
Enable Delay
Chain
(outputdelaysetting1 +
outputfinedelaysetting1)
octdelaysetting1 (only)
octdelaysetting2 (only)
D6 OCT
Delay
Chain
D6 Output-
Enable Delay
Chain
(outputdelaysetting2 +
outputfinedelaysetting2)
D5 Delay
Delay
Chain
D6 Delay
Delay
Chain
0
1
(outputdelaysetting2 + outputfinedelaysetting2) or
(outputonlydelaysetting2 + outputonlyfinedelaysetting2)
D1 Delay
Delay Chain
(padtoinputregisterdelaysetting +
padtoinputregisterfinedelaysetting)
Each DQS logic block contains a delay chain after the dqsbusoutoutput and another
delay chain before the dqsenableinput. Figure 7–35 shows the delay chains in the
DQS input path.
Figure 7–35. Delay Chains in the DQS Input Path
(dqsbusoutdelaysetting +
dqsbusoutfinedelaysetting)
DQS
Enable
DQS
DQS
Delay
Chain
D4 Delay
Chain
dqsbusout
dqsin
dqsenable
T11 Delay
Chain
(dqsenabledelaysetting +
dqsenablefinedelaysetting)
DQS
Enable
Control
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Stratix IV External Memory Interface Features
I/O Configuration Block and DQS Configuration Block
The I/O configuration block and the DQS configuration block are shift registers that
you can use to dynamically change the settings of various device configuration bits.
The shift registers power-up low. Every I/O pin contains one I/O configuration
register, while every DQS pin contains one DQS configuration block in addition to the
I/O configuration register. Figure 7–36 shows the I/O configuration block and the
DQS configuration block circuitry.
Figure 7–36. I/O Configuration Block and DQS Configuration Block
MSB
bit 0 bit 1 bit 2
datain
update
ena
clk
Table 7–19 lists the I/O configuration block bit sequence.
Table 7–19. I/O Configuration Block Bit Sequence
Bit
0..3
4..6
7..10
Bit Name
outputdelaysetting1[0..3]
outputdelaysetting2[0..2]
padtoinputregisterdelaysetting[0..3]
Table 7–20 lists the DQS configuration block bit sequence.
Table 7–20. DQS Configuration Block Bit Sequence (Part 1 of 2)
Bit
0..3
Bit Name
dqsbusoutdelaysetting[0..3]
dqsinputphasesetting[0..2]
dqsenablectrlphasesetting[0..3]
dqsoutputphasesetting[0..3]
dqoutputphasesetting[0..3]
resyncinputphasesetting[0..3]
dividerphasesetting
4..6
7..10
11..14
15..18
19..22
23
24
enaoctcycledelaysetting
enainputcycledelaysetting
enaoutputcycledelaysetting
dqsenabledelaysetting[0..2]
octdelaysetting1[0..3]
25
26
27..29
30..33
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Stratix IV External Memory Interface Features
Table 7–20. DQS Configuration Block Bit Sequence (Part 2 of 2)
Bit
34..36
37
Bit Name
octdelaysetting2[0..2]
enadataoutbypass
38
enadqsenablephasetransferreg
enaoctphasetransferreg
enaoutputphasetransferreg
enainputphasetransferreg
resyncinputphaseinvert
dqsenablectrlphaseinvert
dqoutputphaseinvert
39
40
41
42
43
44
45
dqsoutputphaseinvert
Document Revision History
Table 7–21 lists the revision history for this chapter.
Table 7–21. Document Revision History (Part 1 of 2)
Date
Version
Changes
■ Updated Table 7–5, Table 7–6, Table 7–11, Table 7–19, and Table 7–20.
■ Added Table 7–12.
■ Updated Figure 7–36.
February 2011
3.2
■ Removed Table 7-1 and Table 7-6.
■ Applied new template.
■ Minor text edits.
■ Updated Figure 7–8, Figure 7–11, Figure 7–23, Figure 7–24, Figure 7–29, Figure 7–31,
and Figure 7–36.
■ Added Figure 7–9 and Figure 7–12.
■ Added Table 7–7.
■ Updated Table 7–1, Table 7–2, Table 7–3, Table 7–4, Table 7–6, Table 7–8 and Table 7–19.
■ Added note to the “Memory Interfaces Pin Support” section.
■ Changed “DLL1 through DLL4” to “DLL0 through DLL3” throughout.
■ Added frequency mode 7 throughout.
March 2010
3.1
■ Minor text edits.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 7: External Memory Interfaces in Stratix IV Devices
7–57
Stratix IV External Memory Interface Features
Table 7–21. Document Revision History (Part 2 of 2)
Date
Version
Changes
■ Updated the “Memory Interfaces Pin Support” and “Combining ×16/×18 DQS/DQ Groups
for a ×36 QDR II+/QDR II SRAM Interface” sections.
■ Updated Table 7–1, Table 7–2, Table 7–7, and Table 7–12.
■ Updated Figure 7–3, Figure 7–4, Figure 7–5, Figure 7–6, Figure 7–7, Figure 7–8,
Figure 7–9, Figure 7–10, Figure 7–11, Figure 7–13, Figure 7–14, Figure 7–15, and
Figure 7–16.
■ Added Figure 7–12 and Figure 7–17.
November 2009
3.0
■ Added Table 7–14, Table 7–17, Table 7–19, and Table 7–20.
■ Added “Delay Chain” and “I/O Configuration Block and DQS Configuration Block”
sections.
■ Removed Figure 7-8 and Figure 7-12.
■ Removed Table 7-1, Table 7-2, and Table 7-24.
■ Minor text edits.
■ Updated “Overview” and “Leveling Circuitry”.
■ Updated Figure 7–26 and Figure 7–27.
■ Updated Table 7–3.
June 2009
April 2009
2.3
2.2
■ Added introductory sentences to improve search ability.
■ Removed the Conclusion section.
■ Updated Table 7–5, Table 7–6, Table 7–15, and Table 7–17
■ Removed Figure 7-12, Figure 7-13, and Figure 7-20
■ Updated Table 7–1, Table 7–5, Table 7–8, Table 7–12, Table 7–13, Table 7–14,
Table 7–15, and Table 7–17.
■ Replaced Table 7–6.
■ Added Table 7–11 and Table 7–16.
■ Updated Figure 7–3, Figure 7–6, Figure 7–8, Figure 7–9, and Figure 7–11.
■ Added Figure 7–7, Figure 7–11, Figure 7–12, Figure 7–13, and Figure 7–20.
■ Updated “Combining ×16/×18 DQS/DQ Groups for ×36 QDR II+/QDR II SRAM Interface”.
■ Updated “Rules to Combine Groups”.
March 2009
2.1
■ Removed “Referenced Documents” section.
■ Updated Table 7–1, Table 7–2, Table 7–3, Table 7–4, Table 7–5, and Table 7–6.
■ Added Table 7–7.
■ Updated Figure 7–1 and Figure 7–19.
■ Updated “Combining ×16/×18 DQS/DQ groups for ×36 QDR II+/QDR II SRAM Interface”
on page 7–26.
November 2008
2.0
1.0
■ Updated “Rules to Combine Groups” on page 7–27.
■ Updated “DQS Phase-Shift Circuitry” on page 7–29.
■ Updated Table 7–9, Table 7–10, Table 7–11, Table 7–13, Table 7–13, Table 7–14,
Table 7–15, Table 7–15, Table 7–16, and Table 7–18.
■ Updated Figure 7–30 and Figure 7–31.
■ Made minor editorial changes.
Initial release.
May 2008
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
7–58
Chapter 7: External Memory Interfaces in Stratix IV Devices
Stratix IV External Memory Interface Features
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
8. High-Speed Differential I/O Interfaces
and DPA in Stratix IV Devices
February 2011
SIV51008-3.2
SIV51008-3.2
This chapter describes the significant advantages of the high-speed differential I/O
interfaces and the dynamic phase aligner (DPA) over single-ended I/Os and their
contribution to the overall system bandwidth achievable with Stratix® IV FPGAs. All
references to Stratix IV devices in this chapter apply to Stratix IV E, GT, and GX
devices.
The Stratix IV device family consists of the Stratix IV E (Enhanced) devices without
high-speed clock data recovery (CDR) based transceivers, Stratix IV GT devices with
up to 48 CDR-based transceivers running up to 11.3 Gbps, and Stratix IV GX devices
with up to 48 CDR-based transceivers running up to 8.5 Gbps.
The following sections describe the Stratix IV high-speed differential I/O interfaces
and DPA:
■
■
■
■
■
■
■
■
■
■
■
“Locations of the I/O Banks” on page 8–3
“LVDS Channels” on page 8–4
“LVDS SERDES” on page 8–8
“ALTLVDS Port List” on page 8–9
“Differential Transmitter” on page 8–11
“Differential Receiver” on page 8–17
“LVDS Interface with the Use External PLL Option Enabled” on page 8–26
“Left and Right PLLs (PLL_Lx and PLL_Rx)” on page 8–29
“Stratix IV Clocking” on page 8–30
“Source-Synchronous Timing Budget” on page 8–31
“Differential Pin Placement Guidelines” on page 8–38
Overview
All Stratix IV E, GX, and GT devices have built-in serializer/deserializer (SERDES)
circuitry that supports high-speed LVDS interfaces at data rates of up to 1.6 Gbps.
SERDES circuitry is configurable to support source-synchronous communication
protocols such as Utopia, Rapid I/O, XSBI, small form factor interface (SFI), serial
peripheral interface (SPI), and asynchronous protocols such as SGMII and Gigabit
Ethernet.
The Stratix IV device family has the following dedicated circuitry for high-speed
differential I/O support:
■
■
■
Differential I/O buffer
Transmitter serializer
Receiver deserializer
© 2011 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX are Reg. U.S. Pat. & Tm. Off.
and/or trademarks of Altera Corporation in the U.S. and other countries. All other trademarks and service marks are the property of their respective holders as described at
www.altera.com/common/legal.html. Altera warrants performance of its semiconductor products to current specifications in accordance with Altera’s standard warranty, but
reserves the right to make changes to any products and services at any time without notice. Altera assumes no responsibility or liability arising out of the application or use of any
information, product, or service described herein except as expressly agreed to in writing by Altera. Altera customers are advised to obtain the latest version of device
specifications before relying on any published information and before placing orders for products or services.
Stratix IV Device Handbook Volume 1
February 2011
Subscribe
8–2
Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
Overview
■
■
■
■
Data realignment
DPA
Synchronizer (FIFO buffer)
Phase-locked loops (PLLs) (located on left and right sides of the device)
For high-speed differential interfaces, the Stratix IV device family supports the
following differential I/O standards:
■
■
■
LVDS
Mini-LVDS
Reduced swing differential signaling (RSDS)
In the Stratix IV device family, I/Os are divided into row and column I/Os. Figure 8–1
shows I/O bank support for the Stratix IV device family. The row I/Os provide
dedicated SERDES circuitry.
Figure 8–1. I/O Bank Support in the Stratix IV Device Family (Note 1), (2), (3), (4)
LVDS I/Os
Row I/Os with
Dedicated
SERDES Circuitry (3), (4)
Column I/Os (1), (2)
LVDS Interface
with 'Use External PLL'
Option Disabled
LVDS Interface
with 'Use External PLL'
Option Enabled
Notes to Figure 8–1:
(1) Column input buffers are true LVDS buffers, but do not support 100-differential on-chip termination.
(2) Column output buffers are single ended and need external termination schemes to support LVDS, mini-LVDS, and RSDS standards. For more
information, refer to the I/O Features in Stratix IV Devices chapter.
(3) Row input buffers are true LVDS buffers and support 100-differential on-chip termination.
(4) Row output buffers are true LVDS buffers.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
8–3
Locations of the I/O Banks
The ALTLVDS transmitter and receiver requires various clock and load enable signals
from a left or right PLL. The Quartus® II software provides the following two choices
when configuring the LVDS SERDES circuitry when using the PLL:
■
LVDS interface with the Use External PLL option enabled—You control the PLL
settings, such as dynamically reconfiguring the PLL to support different data
rates, dynamic phase shift, and so on. You must enable the Use External PLL
option in the ALTLVDS megafunction, using the ALTLVDS MegaWizard Plug-
in Manager software. You also must instantiate an ALTPLL megafunction to
generate the various clocks and load enable signals. For more information, refer to
“LVDS Interface with the Use External PLL Option Enabled” on page 8–26.
■
LVDS interface with the Use External PLL option disabled—The Quartus II
software configures the PLL settings automatically. The software is also
responsible for generating the various clock and load enable signals based on the
input reference clock and data rate selected.
1
Both choices target the same physical PLL; the only difference is the additional
flexibility provided when an LVDS interface has the Use External PLL option
enabled.
Locations of the I/O Banks
Stratix IV I/Os are divided into 16 to 24 I/O banks. The dedicated circuitry that
supports high-speed differential I/Os is located in banks in the right and left side of
the device. Figure 8–2 shows a high-level chip overview of the Stratix IV E device.
Figure 8–2. High-Speed Differential I/Os with DPA Locations in Stratix IV E Devices
General Purpose
I/O and Memory
Interface
General Purpose
I/O and Memory
Interface
PLL PLL
PLL
PLL
FPGA Fabric
(Logic Elements, DSP,
Embedded Memory,
Clock Networks)
PLL
PLL
PLL
PLL
PLL
PLL
General Purpose
I/O and Memory
Interface
General Purpose
I/O and Memory
Interface
PLL PLL
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
8–4
Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
LVDS Channels
Figure 8–3 shows a high-level chip overview of the Stratix IV GT and GX devices.
Figure 8–3. High-Speed Differential I/Os with DPA Locations in Stratix IV GT and GX Devices
General Purpose
I/O and Memory
Interface
General Purpose
I/O and Memory
Interface
PLL PLL
PLL
PLL
FPGA Fabric
(Logic Elements, DSP,
Embedded Memory,
Clock Networks)
PLL
PLL
PLL
PLL
PLL
PLL
General Purpose
I/O and Memory
Interface
General Purpose
I/O and Memory
Interface
PLL PLL
LVDS Channels
The Stratix IV device family supports LVDS on both row and column I/O banks. Row
I/Os support true LVDS input with 100- differential input termination (OCT RD),
and true LVDS output buffers. Column I/Os supports true LVDS input buffers
without OCT RD. Alternately, you can configure the row and column LVDS pins as
emulated LVDS output buffers that use two single-ended output buffers with an
external resistor network to support LVDS, mini-LVDS, and RSDS standards.
Stratix IV devices offer single-ended I/O refclk support for the LVDS.
Dedicated SERDES and DPA circuitries are implemented on the row I/O banks to
further enhance LVDS interface performance in the device. For column I/O banks,
SERDES is implemented in the core logic because there is no dedicated SERDES
circuitry on column I/O banks.
1
Emulated differential output buffers support tri-state capability starting with the
Quartus II software version 9.1.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
8–5
LVDS Channels
Table 8–1 and Table 8–2 list the maximum number of row and column LVDS I/Os
supported in Stratix IV E devices. You can design the LVDS I/Os as true LVDS buffers
or emulated LVDS buffers, as long as the combination of the two do not exceed the
maximum count.
For example, there are a total of 112 LVDS pairs on row I/Os in the 780-pin EP4SE230
device (refer to Table 8–1). You can design up to a maximum of 56 true LVDS input
buffers and 56 true LVDS output buffers, or up to a maximum of 112 emulated LVDS
output buffers. For the 780-pin EP4SE230 device (refer to Table 8–2), there are a total
of 128 LVDS pairs on column I/Os. You can design up to a maximum of 64 true LVDS
input buffers and 64 emulated LVDS output buffers, or up to a maximum of 128
emulated LVDS output buffers.
Table 8–1. LVDS Channels Supported in Stratix IV E Device Row I/O Banks (Note 1), (2), (3)
Device
780-Pin FineLine BGA 1152-Pin FineLine BGA 1517-Pin FineLine BGA 1760- Pin FineLine BGA
56 Rx or eTx + 56 Tx
EP4SE230
—
—
—
—
—
or eTx
56 Rx or eTx + 56 Tx
88 Rx or eTx + 88 Tx
or eTx
EP4SE360
EP4SE530
or eTx (4)
88 Rx or eTx + 88 Tx
112 Rx or eTx + 112 Tx 112 Rx or eTx + 112 Tx
or eTx (6) or eTx
—
—
or eTx (5)
88 Rx or eTx + 88 Tx
or eTx
112 Rx or eTx + 112 Tx 132 Rx or eTx + 132 Tx
or eTx or eTx
EP4SE820
Notes to Table 8–1:
(1) Receiver (Rx) = true LVDS input buffers with OCT RD, Transmitter (Tx) = true LVDS output buffers, eTx = emulated LVDS output buffers (either
LVDS_E_1R or LVDS_E_3R).
(2) The LVDS Rx and Tx channels are equally divided between the left and right sides of the device.
(3) The LVDS channel count does not include dedicated clock input pins.
(4) EP4SE360 devices are offered in the H780 package instead of the F780 package.
(5) EP4SE530 devices are offered in the H1152 package instead of the F1152 package.
(6) EP4SE530 devices are offered in the H1517 package instead of the F1517 package.
Table 8–2. LVDS Channels Supported in Stratix IV E Device Column I/O Banks (Note 1), (2), (3)
Device
780-Pin FineLine BGA 1152-Pin FineLine BGA 1517-Pin FineLine BGA 1760-Pin FineLine BGA
EP4SE230
64 Rx or eTx + 64 eTx
—
—
—
64 Rx or eTx + 64 eTx
EP4SE360
EP4SE530
96 Rx or eTx + 96 eTx
—
—
(4)
96 Rx or eTx + 96 eTx 128 Rx or eTx + 128 eTx
(5) (6)
—
—
128 Rx or eTx + 128 eTx
EP4SE820
96 Rx or eTx + 96 eTx 128 Rx or eTx + 128 eTx 144 Rx or eTx + 144 eTx
Notes to Table 8–2:
(1) Rx = true LVDS input buffers without OCT RD, eTx = emulated LVDS output buffers (either LVDS_E_1Ror LVDS_E_3R).
(2) The LVDS Rx and Tx channels are equally divided between the top and bottom sides of the device.
(3) The LVDS channel count does not include dedicated clock input pins.
(4) EP4SE360 devices are offered in the H780 package instead of the F780 package.
(5) EP4SE530 devices are offered in the H1152 package instead of the F1152 package.
(6) EP4SE530 devices are offered in the H1517 package instead of the F1517 package.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
8–6
Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
LVDS Channels
Table 8–3 and Table 8–4 list the maximum number of row and column LVDS I/Os
supported in Stratix IV GT devices.
Table 8–3. LVDS Channels Supported in Stratix IV GT Device Row I/O Banks (Note 1), (2)
Device
EP4S40G2
1517-pin FineLine BGA
46 Rx or eTx + 73 Tx or eTx
46 Rx or eTx + 73 Tx or eTx
46 Rx or eTx + 73 Tx or eTx
—
1932-pin FineLine BGA
—
EP4S40G5
—
EP4S100G2
EP4S100G3
EP4S100G4
EP4S100G5
Notes to Table 8–3:
—
47 Rx or eTx + 56 Tx or eTx
47 Rx or eTx + 56 Tx or eTx
47 Rx or eTx + 56 Tx or eTx
—
46 Rx or eTx + 73 Tx or eTx
(1) Rx = true LVDS input buffers with OCT RD, eTx = emulated LVDS output buffers (either LVDS_E_1R or
LVDS_E_3R).
(2) The LVDS Rx and Tx channel count does not include dedicated clock input pins.
Table 8–4. LVDS Channels Supported in Stratix IV GT Device Column I/O Banks (Note 1), (2)
Device
EP4S40G2
1517-pin FineLine BGA
96 Rx or eTx + 96 eTx
96 Rx or eTx + 96 eTx
96 Rx or eTx + 96 eTx
—
1932-pin FineLine BGA
—
EP4S40G5
—
EP4S100G2
EP4S100G3
EP4S100G4
EP4S100G5
Notes to Table 8–4:
—
128 Rx or eTx + 128 eTx
128 Rx or eTx + 128 eTx
128 Rx or eTx + 128 eTx
—
96 Rx or eTx + 96 eTx
(1) Rx = true LVDS input buffers without OCT RD, eTx = emulated LVDS output buffers (either LVDS_E_1R or
LVDS_E_3R).
(2) The LVDS Rx and Tx channel count does not include dedicated clock input pins.
Table 8–5 and Table 8–6 list the maximum number of row and column LVDS I/Os
supported in Stratix IV GX devices.
Table 8–5. LVDS Channels Supported in Stratix IV GX Device Row I/O Banks (Note 1), (2), (3) (Part 1 of 2)
1152-Pin
780-Pin
FineLine BGA
1152-Pin
FineLine BGA
1517-Pin
FineLine BGA
1760-Pin
FineLine BGA
1932-Pin
FineLine BGA
Device
FineLine BGA
(4)
28 Rx or eTx +
28 Tx or eTx
56 Rx or eTx +
56 Tx or eTx
EP4SGX70
EP4SGX110
EP4SGX180
EP4SGX230
EP4SGX290
—
—
—
—
—
—
—
—
—
—
—
28 Rx or eTx +
28 Tx or eTx
28 Rx or eTx + 56 Rx or eTx +
28 Tx or eTx 56 Tx or eTx
28 Rx or eTx +
28 Tx or eTx
44 Rx or eTx + 44 Rx or eTx + 88 Rx or eTx +
44 Tx or eTx 44 Tx or eTx 88 Tx or eTx
28 Rx or eTx +
28 Tx or eTx
44 Rx or eTx + 44 Rx or eTx + 88 Rx or eTx +
44 Tx or eTx 44 Tx or eTx 88 Tx or eTx
44 Rx or eTx + 44 Rx or eTx + 88 Rx or eTx + 88 Rx or eTx + 98 Rx or eTx +
44 Tx or eTx 44 Tx or eTx 88 Tx or eTx 88 Tx or eTx 98 Tx or eTx
— (5)
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
8–7
LVDS Channels
Table 8–5. LVDS Channels Supported in Stratix IV GX Device Row I/O Banks (Note 1), (2), (3) (Part 2 of 2)
1152-Pin
780-Pin
FineLine BGA
1152-Pin
FineLine BGA
1517-Pin
FineLine BGA
1760-Pin
FineLine BGA
1932-Pin
FineLine BGA
Device
FineLine BGA
(4)
44 Rx or eTx + 44 Rx or eTx + 88 Rx or eTx + 88 Rx or eTx + 98 Rx or eTx +
EP4SGX360
EP4SGX530
— (5)
44 Tx or eTx
44 Tx or eTx
88 Tx or eTx
88 Tx or eTx
98 Tx or eTx
44 Rx or eTx + 88 Rx or eTx +
88 Rx or eTx + 98 Rx or eTx +
88 Tx or eTx 98 Tx or eTx
—
—
44 Tx or eTx
88 Tx or eTx
(6)
(7)
Notes to Table 8–5:
(1) Rx = true LVDS input buffers with OCT RD, Tx = true LVDS output buffers, eTx = emulated LVDS output buffers (either LVDS_E_1R or
LVDS_E_3R).
(2) The LVDS Rx and Tx channels are equally divided between the left and right sides of the device, except for the devices in the 780-pin Fineline
BGA. These devices have the LVDS Rx and Tx located on the left side of the device.
(3) The LVDS channel count does not include dedicated clock input pins.
(4) This package supports PMA-only transceiver channels.
(5) EP4SGX290 and EP4SGX360 devices are offered in the H780 package instead of the F780 package.
(6) EP4SGX530 devices are offered in the H1152 package instead of the F1152 package.
(7) EP4SGX530 devices are offered in the H1517 package instead of the F1517 package.
Table 8–6. LVDS Channels Supported in Stratix IV GX Device Column I/O Banks (Note 1), (2), (3)
1152-Pin
780-Pin
FineLine BGA
1152-Pin
FineLine BGA
1517-Pin
FineLine BGA
1760-Pin
FineLine BGA
1932-Pin
FineLine BGA
Device
FineLine BGA
(4)
64 Rx or eTx +
64 eTx
64 Rx or eTx +
64 eTx
EP4SGX70
EP4SGX110
EP4SGX180
EP4SGX230
EP4SGX290
EP4SGX360
EP4SGX530
—
—
—
—
—
—
—
—
—
—
—
64 Rx or eTx +
64 eTx
64 Rx or eTx + 64 Rx or eTx +
64 eTx 64 eTx
64 Rx or eTx +
64 eTx
96 Rx or eTx + 96 Rx or eTx + 96 Rx or eTx +
96 eTx 96 eTx 96 eTx
64 Rx or eTx +
64 eTx
96 Rx or eTx + 96 Rx or eTx + 96 Rx or eTx +
96 eTx 96 eTx 96 eTx
72 Rx or eTx +
72 eTx (5)
96 Rx or eTx + 96 Rx or eTx + 96 Rx or eTx + 128 Rx or eTx + 128 Rx or eTx +
96 eTx 96 eTx 96 eTx 128 eTx 128 eTx (8)
72 Rx or eTx +
72 eTx (5)
96 Rx or eTx + 96 Rx or eTx + 96 Rx or eTx + 128 Rx or eTx + 128 Rx or eTx +
96 eTx
96 eTx
96 Rx or eTx + 96 Rx or eTx + 128 Rx or eTx + 128 Rx or eTx +
96 eTx (6) 96 eTx (7) 128 eTx 128 eTx
96 eTx
128 eTx
128 eTx (8)
—
—
Notes to Table 8–6:
(1) Rx = true LVDS input buffers without OCT RD, eTx = emulated LVDS output buffers (either LVDS_E_1R or LVDS_E_3R).
(2) The LVDS Rx and Tx channels are equally divided between the left and right sides of the device.
(3) The LVDS channel count does not include dedicated clock input pins.
(4) This package supports PMA-only transceiver channels.
(5) EP4SGX290 and EP4SGX360 devices are offered in the H780 package instead of the F780 package.
(6) EP4SGX530 devices are offered in the H1152 package instead of the F1152 package.
(7) EP4SGX530 devices are offered in the H1517 package instead of the F1517 package.
(8) The Quartus II software version 9.0 does not support EP4SGX290 and EP4SGX360 devices in the 1932-Pin FineLine BGA package. These
devices will be supported in a future release of the Quartus II software.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
8–8
Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
LVDS SERDES
LVDS SERDES
Figure 8–4 shows a transmitter and receiver block diagram for the LVDS SERDES
circuitry in the left and right banks. This diagram shows the interface signals of the
transmitter and receiver data path. For more information, refer to “Differential
Transmitter” on page 8–11 and “Differential Receiver” on page 8–17.
Figure 8–4. LVDS SERDES (Note 1), (2), (3)
Serializer
2
IOE Supports SDR, DDR, or
Non-Registered Datapath
IOE
tx_out
10
+
-
tx_in
DIN DOUT
LVDS Transmitter
tx_coreclock
(LVDS_LOAD_EN, diffioclk,
tx_coreclock)
3
IOE Supports SDR, DDR, or
Non-Registered Datapath
LVDS Receiver
Synchronizer
rx_in
2
+
-
IOE
10
rx_out
Bit Slip
Deserializer
DPA Circuitry
Retimed
DOUT
DIN
DOUT DIN
FPGA
Fabric
Data
DIN
DOUT DIN
DPA Clock
diffioclk
3
2
(DPA_LOAD_EN,
DPA_diffioclk,
rx_divfwdclk)
(LOAD_EN, diffioclk)
Clock MUX
rx_divfwdclk
rx_outclock
3
(LVDS_LOAD_EN,
LVDS_diffioclk,
rx_outclock
LVDS Clock Domain
DPA Clock Domain
8 Serial LVDS
Clock Phases
Left/Right PLL
rx_inclock/tx_inclock
Notes to Figure 8–4:
(1) This diagram shows a shared PLL between the transmitter and receiver. If the transmitter and receiver are not sharing the same PLL, the two left
and right PLLs are required.
(2) In SDR and DDR modes, the data width is 1 and 2 bits, respectively.
(3) The tx_inand rx_outports have a maximum data width of 10 bits.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
8–9
ALTLVDS Port List
ALTLVDS Port List
Table 8–7 lists the interface signals for an LVDS transmitter and receiver.
Table 8–7. Port List of the LVDS Interface (ALTLVDS) (Note 1), (2) (Part 1 of 3)
Input /
Output
Port Name
PLL Signals
Description
Asynchronous reset to the LVDS transmitter and receiver PLL. The
minimum pulse width requirement for this signal is 10 ns.
pll_areset
Input
LVDS Transmitter Interface Signals
The data bus width per channel is the same as the serialization factor (SF).
Input data must be synchronous to the tx_coreclocksignal.
tx_in[ ]
Input
Input
Reference clock input for the transmitter PLL.
The ALTLVDS MegaWizard Plug-In Manager software automatically selects
the appropriate PLL multiplication factor based on the data rate and
reference clock frequency selection.
tx_inclock
For more information about the allowed frequency range for this reference
clock, refer to the “High-Speed I/O Specification” section in the DC and
Switching Characteristics for Stratix IV Devices chapter.
This port is instantiated only when you select the Use External PLL option
in the MegaWizard Plug-In Manager software. This input port must be
driven by the PLL instantiated though the ALTPLL MegaWizard Plug-In
Manager software.
tx_enable (3)
Input
LVDS transmitter serial data output port. tx_outis clocked by a serial clock
generated by the left and right PLL.
tx_out
Output
Output
The frequency of this clock is programmable to be the same as the data
rate, half the data rate, or one-fourth the data rate. The phase offset of this
clock, with respect to the serial data, is programmable in increments of 45°.
tx_outclock
FPGA fabric-transmitter interface clock. The parallel transmitter data
generated in the FPGA fabric must be clocked with this clock.
This port is not available when you select the Use External PLL option in the
MegaWizard Plug-In Manager software. The FPGA fabric-transmitter
interface clock must be driven by the PLL instantiated through the ALTPLL
MegaWizard Plug-In Manager software.
tx_coreclock (3)
Output
Output
When high, this signal indicates that the transmitter PLL is locked to the
input reference clock.
tx_locked
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Stratix IV Device Handbook Volume 1
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Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
ALTLVDS Port List
Table 8–7. Port List of the LVDS Interface (ALTLVDS) (Note 1), (2) (Part 2 of 3)
Input /
Output
Port Name
Description
LVDS Receiver Interface Signals
rx_in
Input
LVDS receiver serial data input port.
rx_inclock
Reference clock input for the receiver PLL.
The ALTLVDS MegaWizard Plug-In Manager software automatically selects
the appropriate PLL multiplication factor based on the data rate and
reference clock frequency selection.
Input
For more information about the allowed frequency range for this reference
clock, refer to the “High-Speed I/O Specification” section in the DC and
Switching Characteristics for Stratix IV Devices chapter.
rx_channel_data_align
rx_dpll_hold
Edge-sensitive bit-slip control signal. Each rising edge on this signal causes
the data re-alignment circuitry to shift the word boundary by one bit. The
minimum pulse width requirement is one parallel clock cycle. There is no
maximum pulse width requirement.
Input
Input
Input
Output
When low, the DPA tracks any dynamic phase variations between the clock
and data. When high, the DPA holds the last locked phase and does not
track any dynamic phase variations between the clock and data. This port is
not available in non-DPA mode.
This port is instantiated only when you select the Use External PLL option
in the MegaWizard Plug-In Manager software. This input port must be
driven by the PLL instantiated though the ALTPLL MegaWizard Plug-In
Manager software.
rx_enable(3)
Receiver parallel data output. The data bus width per channel is the same as
the deserialization factor (DF). The output data is synchronous to the
rx_outclocksignal in non-DPA and DPA modes. It is synchronous to the
rx_divfwdclksignal in soft-CDR mode.
rx_out[ ]
Parallel output clock from the receiver PLL. The parallel data output from
the receiver is synchronous to this clock in non-DPA and DPA modes. This
port is not available when you select the Use External PLL option in the
MegaWizard Plug-In Manager software. The FPGA fabric-receiver interface
clock must be driven by the PLL instantiated through the ALTPLL
MegaWizard Plug-In Manager software.
rx_outclock
Output
When high, this signal indicates that the receiver PLL is locked to
rx_locked
Output
Output
rx_inclock
.
This signal only indicates an initial DPA lock condition to the optimum
phase after power up or reset. This signal is not de-asserted if the DPA
selects a new phase out of the eight clock phases to sample the received
data. You must not use the rx_dpa_lockedsignal to determine a DPA
loss-of-lock condition.
rx dpa locked
Data re-alignment (bit slip) roll-over signal. When high for one parallel clock
cycle, this signal indicates that the user-programmed number of bits for the
word boundary to roll-over have been slipped.
rx_cda_max
Output
Parallel DPA clock to the FPGA fabric logic array. The parallel receiver
output data to the FPGA fabric logic array is synchronous to this clock in
soft-CDR mode. This signal is not available in non-DPA and DPA modes.
rx_divfwdclk
dpa_pll_recal
Output
Input
Enable PLL calibration dynamically without resetting the DPA circuitry or
the PLL.
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February 2011 Altera Corporation
Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
8–11
Differential Transmitter
Table 8–7. Port List of the LVDS Interface (ALTLVDS) (Note 1), (2) (Part 3 of 3)
Input /
Output
Port Name
Description
dpa_pll_cal_busy
Output
Busysignal that is asserted high when the PLL calibration occurs.
Reset Signals
Asynchronous reset to the DPA circuitry and FIFO. The minimum pulse
width requirement for this reset is one parallel clock cycle. This signal
resets DPA and FIFO blocks.
rx_reset
Input
Input
Input
Asynchronous reset to the FIFO between the DPA and the data realignment
circuits. The synchronizer block must be reset after a DPA loses lock
condition and the data checker shows corrupted received data. The
minimum pulse width requirement for this reset is one parallel clock cycle.
This signal resets the FIFO block.
rx_fifo_reset
Asynchronous reset to the data realignment circuitry. The minimum pulse
width requirement for this reset is one parallel clock cycle. This signal
resets the data realignment block.
rx_cda_reset
Notes to Table 8–7:
(1) Unless stated, signals are valid in all three modes (non-DPA, DPA, and soft-CDR) for a single channel.
(2) All reset and control signals are active high.
(3) For more information, refer to “LVDS Interface with the Use External PLL Option Enabled” on page 8–26.
f
For more information about the LVDS transmitter and receiver settings using
ALTLVDS, refer to the ALTLVDS Megafunction User Guide.
Differential Transmitter
The Stratix IV transmitter has a dedicated circuitry to provide support for LVDS
signaling. The dedicated circuitry consists of a differential buffer, a serializer, and left
and right PLLs that can be shared between the transmitter and receiver. The
differential buffer can drive out LVDS, mini-LVDS, and RSDS signaling levels. The
serializer takes up to 10 bits wide parallel data from the FPGA fabric, clocks it into the
load registers, and serializes it using shift registers clocked by the left and right PLL
before sending the data to the differential buffer. The MSB of the parallel data is
transmitted first.
1
When using emulated LVDS I/O standards at the differential transmitter, the
SERDES circuitry must be implemented in logic cells but not hard SERDES.
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Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
Differential Transmitter
The load enable (LVDS_LOAD_EN) signal and the diffioclksignal (the clock running at
serial data rate) generated from PLL_Lx(left PLL) or PLL_Rx(right PLL) clocks the load
and shift registers. You can statically set the serialization factor to ×3, ×4, ×6, ×7, ×8, or
×10 using the Quartus II software. The load enable signal is derived from the
serialization factor setting. Figure 8–5 shows a block diagram of the Stratix IV
transmitter.
Figure 8–5. Stratix IV Transmitter (Note 1), (2)
IOE supports SDR, DDR, or
Non-Registered Datapath
2
Serializer
IOE
tx_out
+
-
tx_in
10
DOUT
DIN
FPGA
Fabric
LVDS Transmitter
tx_coreclock
3
(LVDS_LOAD_EN, diffioclk, tx_coreclock)
Left/Right PLL
LVDS Clock Domain
tx_inclock
Notes to Figure 8–5:
(1) In SDR and DDR modes, the data width is 1 and 2 bits, respectively.
(2) The tx_inport has a maximum data width of 10 bits.
You can configure any Stratix IV transmitter data channel to generate a
source-synchronous transmitter clock output. This flexibility allows the placement of
the output clock near the data outputs to simplify board layout and reduce
clock-to-data skew. Different applications often require specific clock-to-data
alignments or specific data-rate-to-clock-rate factors. The transmitter can output a
clock signal at the same rate as the data with a maximum frequency of 800 MHz. The
output clock can also be divided by a factor of 1, 2, 4, 6, 8, or 10, depending on the
serialization factor. You can set the phase of the clock in relation to the data at 0° or
180° (edge or center aligned). The left and right PLLs (PLL_Lxand PLL_Rx) provide
additional support for other phase shifts in 45° increments. These settings are made
statically in the Quartus II MegaWizard Plug-In Manager software.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
8–13
Differential Transmitter
Figure 8–6 shows the Stratix IV transmitter in clock output mode. In clock output
mode, you can use an LVDS channel as a clock output channel.
Figure 8–6. Stratix IV Transmitter in Clock Output Mode
Transmitter Circuit
Parallel
Series
Txclkout+
Txclkout–
FPGA
Fabric
Left/Right
PLL
diffioclk
LVDS_LOAD_EN
You can bypass the Stratix IV serializer to support DDR (×2) and SDR (×1) operations
to achieve a serialization factor of 2 and 1, respectively. The I/O element (IOE)
contains two data output registers that can each operate in either DDR or SDR mode.
Figure 8–7 shows the serializer bypass path.
Figure 8–7. Serializer Bypass in Stratix IV Devices (Note 1), (2), (3)
IOE supports SDR, DDR, or
Non-Registered Datapath
2
SSeerriiaalliizeerr
IOE
tx_out
+
-
tx_in
2
DOUT
DIN
FPGA
Fabric
LVDS Transmitter
tx_coreclockk
3
(LVVDDSS__LLOOAADD__EENN,, ddiiffffiiooccllkk,, ttxx__ccoorreecclloocckk))
Left/Right PLL
Notes to Figure 8–7:
(1) All disabled blocks and signals are grayed out.
(2) In DDR mode, tx_inclockclocks the IOE register. In SDR mode, data is directly passed through the IOE.
(3) In SDR and DDR modes, the data width to the IOE is 1 and 2 bits, respectively.
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Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
Differential Transmitter
Programmable VOD and Programmable Pre-Emphasis
Stratix IV LVDS transmitters support programmable pre-emphasis and
programmable VOD. Pre-emphasis increases the amplitude of the high-frequency
component of the output signal, and thus helps to compensate for the
frequency-dependent attenuation along the transmission line. Figure 8–8 shows the
differential LVDS output.
Figure 8–8. Differential VOD
Single-Ended Waveform
Positive Channel (p)
VOD
Negative Channel (n)
VCM
Ground
(single-ended)
VOD
VOD
(diff peak - peak) = 2 x
Differential Waveform
VOD
p - n = 0V
VOD
Figure 8–9 shows the LVDS output with pre-emphasis.
Figure 8–9. Programmable Pre-Emphasis (Note 1)
V
P
OUT
V
OD
OUT
V
P
Note to Figure 8–9:
(1) VP— voltage boost from pre-emphasis. VOD— Differential output voltage (peak-peak).
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
8–15
Differential Transmitter
Pre-emphasis is an important feature for high-speed transmission. Without
pre-emphasis, the output current is limited by the VOD setting and the output
impedance of the driver. At high frequency, the slew rate may not be fast enough to
reach full VOD before the next edge, producing pattern-dependent jitter.
With pre-emphasis, the output current is boosted momentarily during switching to
increase the output slew rate. The overshoot introduced by the extra current happens
only during switching and does not ring, unlike the overshoot caused by signal
reflection. The amount of pre-emphasis needed depends on the attenuation of the
high-frequency component along the transmission line. The Quartus II software
allows four settings for programmable pre-emphasis—zero (0), low (1), medium (2),
and high (3). The default setting is low.
The VOD is also programmable with four settings: low (0), medium low (1), medium
high (2), and high (3). The default setting is medium low.
Programmable VOD
You can statically assign the VOD settings from the Assignment Editor. Table 8–8 lists
the assignment name for programmable VOD and its possible values in the Quartus II
software Assignment Editor.
Table 8–8. Quartus II Software Assignment Editor
To
tx_out
Assignment name
Allowed values
Programmable Differential Output Voltage (VOD)
0, 1, 2, 3
Figure 8–10 shows the assignment of programmable VOD for a transmit data output
from the Quartus II software Assignment Editor.
Figure 8–10. Quartus II Software Assignment Editor—Programmable VOD
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Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
Differential Transmitter
Programmable Pre-Emphasis
Four different settings are allowed for pre-emphasis from the Assignment Editor for
each LVDS output channel. Table 8–9 lists the assignment name and its possible
values for programmable pre-emphasis in the Quartus II software Assignment Editor.
Table 8–9. Quartus II Software Assignment Editor
To
tx_out
Assignment name
Allowed values
Programmable Pre-emphasis
0, 1, 2, 3
Figure 8–11 shows the assignment of programmable pre-emphasis for a transmit data
output port from the Quartus II software Assignment Editor.
Figure 8–11. Quartus II Software Assignment Editor – Programmable Pre-Emphasis
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
8–17
Differential Receiver
Differential Receiver
The Stratix IV device family has a dedicated circuitry to receive high-speed
differential signals in row I/Os. Figure 8–12 shows the hardware blocks of the
Stratix IV receiver. The receiver has a differential buffer and left and right PLLs that
can be shared between the transmitter and receiver, a DPA block, a synchronizer, a
data realignment block, and a deserializer. The differential buffer can receive LVDS,
mini-LVDS, and RSDS signal levels, which are statically set in the Quartus II software
Assignment Editor.
The left and right PLL receives the external clock input and generates different phases
of the same clock. The DPA block chooses one of the clocks from the left and right PLL
and aligns the incoming data on each channel. The synchronizer circuit is a 1 bit wide
by 6 bit deep FIFO buffer that compensates for any phase difference between the DPA
clock and the data realignment block. If necessary, the user-controlled data
realignment circuitry inserts a single bit of latency in the serial bit stream to align to
the word boundary. The deserializer includes shift registers and parallel load
registers, and sends a maximum of 10 bits to the internal logic.
The Stratix IV device family supports three different receiver modes:
■
■
■
“Non-DPA Mode” on page 8–22
“DPA Mode” on page 8–24
“Soft-CDR Mode” on page 8–25
The physical medium connecting the transmitter and receiver LVDS channels may
introduce skew between the serial data and the source-synchronous clock. The
instantaneous skew between each LVDS channel and the clock also varies with the
jitter on the data and clock signals as seen by the receiver. The three different modes—
non-DPA, DPA, and soft-CDR—provide different options to overcome skew between
the source synchronous clock (non-DPA, DPA) /reference clock (soft-CDR) and the
serial data.
1
Only non-DPA mode requires manual skew adjustment.
Non-DPA mode allows you to statically select the optimal phase between the source
synchronous clock and the received serial data to compensate skew. In DPA mode,
the DPA circuitry automatically chooses the best phase to compensate for the skew
between the source synchronous clock and the received serial data. Soft-CDR mode
provides opportunities for synchronous and asynchronous applications for
chip-to-chip and short reach board-to-board applications for SGMII protocols.
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Differential Receiver
Figure 8–12. Receiver Block Diagram (Note 1), (2)
IOE Supports SDR, DDR, or Non-Registered Datapath
LVDS Receiver
2
+
rx_in
IOE
10
rx_out
Synchronizer
Deserializer
DOUT DIN
Bit Slip
DPA Circuitry
Retimed
DOUT DIN
DIN
DOUT
DIN
Data
FPGA
Fabric
DPA Clock
2
diffioclk
(LOAD_EN, diffioclk)
Clock Mux
3
(DPA_LOAD_EN,
DPA_diffioclk,
rx_divfwdclk)
rx_divfwdclk
rx_outclock
3
(LVDS_LOAD_EN,
LVDS_diffioclk,
rx_outclk)
LVDS Clock Domain
DPA Clock Domain
8 Serial LVDS
Clock Phases
Left/Right PLL
rx_inclock
Notes to Figure 8–12:
(1) In SDR and DDR modes, the data width from the IOE is 1 and 2 bits, respectively.
(2) The rx_outport has a maximum data width of 10 bits.
Differential I/O Termination
The Stratix IV device family provides a 100- on-chip differential termination option
on each differential receiver channel for LVDS standards. On-chip termination saves
board space by eliminating the need to add external resistors on the board. You can
enable on-chip termination in the Quartus II software Assignment Editor.
On-chip differential termination is supported on all row I/O pins and dedicated clock
input pins (CLK[0,2,9,11]). It is not supported for column I/O pins, dedicated clock
input pins (CLK[1,3,8,10]), or the corner PLL clock inputs.
Figure 8–13 shows device on-chip termination.
Figure 8–13. On-Chip Differential I/O Termination
Stratix IV Differential
LVDS
Receiver with On-Chip
Transmitter
100 Ω Termination
Z = 50 Ω
0
R
D
Z = 50 Ω
0
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Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
8–19
Differential Receiver
Receiver Hardware Blocks
The differential receiver has the following hardware blocks:
“DPA Block” on page 8–19
“Synchronizer” on page 8–20
■
■
■
“Data Realignment Block (Bit Slip)” on page 8–20
“Deserializer” on page 8–22
■
DPA Block
The DPA block takes in high-speed serial data from the differential input buffer and
selects one of the eight phases generated by the left and right PLL to sample the data.
The DPA chooses a phase closest to the phase of the serial data. The maximum phase
offset between the received data and the selected phase is 1/8 UI, which is the
maximum quantization error of the DPA. The eight phases of the clock are equally
divided, offering a 45° resolution.
Figure 8–14 shows the possible phase relationships between the DPA clocks and the
incoming serial data.
Figure 8–14. DPA Clock Phase to Serial Data Timing Relationship (Note 1)
D0
D1
D2
D3
D4
Dn
rx_in
0˚
45˚
90˚
135˚
180˚
225˚
270˚
315˚
T
vco
0.125T
vco
Note to Figure 8–14:
(1) TVCO is defined as the PLL serial clock period.
The DPA block continuously monitors the phase of the incoming serial data and
selects a new clock phase if needed. You can prevent the DPA from selecting a new
clock phase by asserting the optional RX_DPLL_HOLDport, which is available for each
channel.
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Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
Differential Receiver
DPA circuitry does not require a fixed training pattern to lock to the optimum phase
out of the eight phases. After reset or power up, DPA circuitry requires transitions on
the received data to lock to the optimum phase. An optional output port,
RX_DPA_LOCKED, is available to indicate an initial DPA lock condition to the optimum
phase after power up or reset. This signal is not de-asserted if the DPA selects a new
phase out of the eight clock phases to sample the received data. Do not use the
rx_dpa_lockedsignal to determine a DPA loss-of-lock condition. Use data checkers
such as a cyclic redundancy check (CRC) or diagonal interleaved parity (DIP-4) to
validate the data.
An independent reset port, RX_RESET, is available to reset the DPA circuitry. DPA
circuitry must be retrained after reset.
1
The DPA block is bypassed in non-DPA mode.
Synchronizer
The synchronizer is a 1 bit wide and 6 bit deep FIFO buffer that compensates for the
phase difference between DPA_diffioclk, which is the optimal clock selected by the
DPA block, and LVDS_diffioclk, which is produced by the left and right PLL. The
synchronizer can only compensate for phase differences, not frequency differences
between the data and the receiver’s input reference clock.
An optional port, RX_FIFO_RESET, is available to the internal logic to reset the
synchronizer. The synchronizer is automatically reset when the DPA first locks to the
incoming data. Altera recommends using RX_FIFO_RESETto reset the synchronizer
when the DPA signals a loss-of-lock condition and the data checker indicates
corrupted received data.
1
The synchronizer circuit is bypassed in non-DPA and soft-CDR mode.
Data Realignment Block (Bit Slip)
Skew in the transmitted data along with skew added by the link causes
channel-to-channel skew on the received serial data streams. If the DPA is enabled,
the received data is captured with different clock phases on each channel. This may
cause the received data to be misaligned from channel to channel. To compensate for
this channel-to-channel skew and establish the correct received word boundary at
each channel, each receiver channel has a dedicated data realignment circuit that
realigns the data by inserting bit latencies into the serial stream.
An optional RX_CHANNEL_DATA_ALIGNport controls the bit insertion of each receiver
independently controlled from the internal logic. The data slips one bit on the rising
edge of RX_CHANNEL_DATA_ALIGN. The requirements for the RX_CHANNEL_DATA_ALIGN
signal include:
■
■
■
■
The minimum pulse width is one period of the parallel clock in the logic array.
The minimum low time between pulses is one period of the parallel clock.
This is an edge-triggered signal.
Valid data is available two parallel clock cycles after the rising edge of
RX_CHANNEL_DATA_ALIGN
.
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8–21
Differential Receiver
Figure 8–15 shows receiver output (RX_OUT) after one bit slip pulse with the
deserialization factor set to 4.
Figure 8–15. Data Realignment Timing
rx_inclock
3
2
1
0
3
2
1
0
3
2
1
0
rx_in
rx_outclock
rx_channel_data_align
rx_out
xx21
321x
0321
3210
The data realignment circuit can have up to 11 bit-times of insertion before a rollover
occurs. The programmable bit rollover point can be from 1 to 11 bit-times,
independent of the deserialization factor. The programmable bit rollover point must
be set equal to or greater than the deserialization factor, allowing enough depth in the
word alignment circuit to slip through a full word. You can set the value of the bit
rollover point using the MegaWizard Plug-In Manager software. An optional status
port, RX_CDA_MAX, is available to the FPGA fabric from each channel to indicate when
the preset rollover point is reached.
Figure 8–16 shows a preset value of four bit-times before rollover occurs. The
rx_cda_maxsignal pulses for one rx_outclockcycle to indicate that rollover has
occurred.
Figure 8–16. Receiver Data Re-alignment Rollover
rx_inclock
rx_channel_data_align
rx_outclock
rx_cda_max
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Differential Receiver
Deserializer
You can statically set the deserialization factor to 3, 4, 6, 7, 8, or 10 by using the
Quartus II software. You can bypass the Stratix IV deserializer in the Quartus II
MegaWizard Plug-In Manager software to support DDR (×2) or SDR (×1) operations,
as shown Figure 8–17. The DPA and data realignment circuit cannot be used when the
deserializer is bypassed. The IOE contains two data input registers that can operate in
DDR or SDR mode.
Figure 8–17. Deserializer Bypass in Stratix IV Devices (Note 1), (2), (3)
IOE Supports SDR, DDR, or Non-Registered Datapath
LVDS Receiver
2
+
rx_in
IOE
2
rx_out
Synchronizer
Deserializer
Bit Slip
DPA Circuitry
DOUT DIN
DOUT DIN
DIN
Retimed
Data
DOUT
DIN
FPGA
Fabric
DPA Clock
2
diffioclk
(LOAD_EN, diffioclk)
Clock Mux
3
(DPA_LOAD_EN,
DPA_diffioclk,
rx_divfwdclk)
rx_divfwdclk
rx_outclock
(LVDS_LOAD_EN,
LVDS_diffioclk,
rx_outclk)
3
8 Serial LVDS
Clock Phases
Leefftt//RRiigghhtt PPLLLL
Notes to Figure 8–17:
(1) All disabled blocks and signals are grayed out.
(2) In DDR mode, rx_inclockclocks the IOE register. In SDR mode, data is directly passed through the IOE.
(3) In SDR and DDR modes, the data width from the IOE is 1 and 2 bits, respectively.
Receiver Data Path Modes
The Stratix IV device family supports three receiver datapath modes—non-DPA
mode, DPA mode, and soft-CDR mode.
Non-DPA Mode
Figure 8–18 shows the non-DPA datapath block diagram. In non-DPA mode, the DPA
and synchronizer blocks are disabled. Input serial data is registered at the rising or
falling edge of the serial LVDS_diffioclkclock produced by the left and right PLL.
You can select the rising/falling edge option using the ALTLDVS MegaWizard
Plug-In Manager software. Both data realignment and deserializer blocks are clocked
by the LVDS_diffioclkclock, which is generated by the left and right PLL.
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Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
8–23
Differential Receiver
1
When using non-DPA receivers, you must drive the PLL from a dedicated and
compensated clock input pin. Compensated clock inputs are dedicated clock pins in
the same I/O bank as the PLL.
f
For more information about dedicated and compensated clock inputs, refer to the
Clock Networks and PLLs in Stratix IV Devices chapter.
Figure 8–18. Receiver Data Path in Non-DPA Mode (Note 1), (2)
IOE Supports SDR, DDR, or Non-Registered Datapath
LVDS Receiver
2
+
rx_in
IOE
10
rx_out
Synchronizer
Deserializer
DOUT DIN
Bit Slip
DPA Circuitry
DOUT DIN
Retimed
DIN
Data
DOUT DIN
FPGA
Fabric
DPA Clock
2
diffioclk
(LOAD_EN, diffioclk)
Clock Mux
3
(DPA_LOAD_EN,
DPA_diffioclk,
rx_divfwdclk)
rx_divfwdclk
rx_outclock
3
(LVDS_LOAD_EN,
LVDS_diffioclk,
rx_outclk)
8 Serial LVDS
Clock Phases
Left/Right PLL
rx_inclock
LVDS Clock Domain
Notes to Figure 8–18:
(1) In SDR and DDR modes, the data width from the IOE is 1 and 2 bits, respectively.
(2) The rx_outport has a maximum data width of 10 bits.
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Differential Receiver
DPA Mode
Figure 8–19 shows the DPA mode datapath, where all the hardware blocks mentioned
in “Receiver Hardware Blocks” on page 8–19 are active. The DPA block chooses the
best possible clock (DPA_diffioclk) from the eight fast clocks sent by the left and right
PLL. This serial DPA_diffioclkclock is used for writing the serial data into the
synchronizer. A serial LVDS_diffioclkclock is used for reading the serial data from
the synchronizer. The same LVDS_diffioclkclock is used in data realignment and
deserializer blocks.
Figure 8–19. Receiver Datapath in DPA Mode (Note 1), (2), (3)
IOE Supports SDR, DDR, or Non-Registered Datapath
LVDS Receiver
rx_in
+
IOE
10
rx_out
Synchronizer
Deserializer
DOUT DIN
Bit Slip
DPA Circuitry
Retimed
DOUT DIN
DIN
DIN
DOUT
Data
FPGA
Fabric
DPA Clock
2
diffioclk
(LOAD_EN, diffioclk)
Clock Mux
3
(DPA_LOAD_EN,
rx_divfwdclk
rx_outclock
DPA_diffioclk,
rx_divfwdclk)
3
(LVDS_LOAD_EN,
LVDS_diffioclk,
rx_outclk)
LVDS Clock Domain
DPA Clock Domain
8 Serial LVDS
Clock Phases
Left/Right PLL
rx_inclock
Notes to Figure 8–19:
(1) All disabled blocks and signals are grayed out.
(2) In SDR and DDR modes, the data width from the IOE is 1 and 2 bits, respectively.
(3) The rx_outport has a maximum data width of 10 bits.
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February 2011 Altera Corporation
Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
8–25
Differential Receiver
Soft-CDR Mode
The Stratix IV LVDS channel offers soft-CDR mode to support the Gigabit Ethernet
and SGMII protocols. A receiver PLL uses the local clock source for reference.
Figure 8–20 shows the soft-CDR mode datapath.
Figure 8–20. Receiver Datapath in Soft-CDR Mode (Note 1), (2), (3)
IOE Supports SDR, DDR, or Non-Registered Datapath
LVDS Receiver
rx_in
+
IOE
10
rx_out
Synchronizer
Deserializer
DOUT DIN
Bit Slip
DPA Circuitry
Retimed
DOUT DIN
DIN
DIN
DOUT
Data
FPGA
Fabric
DPA Clock
2
diffioclk
(LOAD_EN, diffioclk)
Clock Mux
3
(DPA_LOAD_EN,
rx_divfwdclk
rx_outclock
DPA_diffioclk,
rx_divfwdclk)
3
(LVDS_LOAD_EN,
LVDS_diffioclk,
rx_outclk)
LVDS Clock Domain
DPA Clock Domain
8 Serial LVDS
Clock Phases
Left/Right PLL
rx_inclock
Notes to Figure 8–20:
(1) All disabled blocks and signals are grayed out.
(2) In SDR and DDR modes, the data width from the IOE is 1 and 2 bits, respectively.
(3) The rx_outport has a maximum data width of 10 bits.
In soft-CDR mode, the synchronizer block is inactive. The DPA circuitry selects an
optimal DPA clock phase to sample the data. Use the selected DPA clock for bit-slip
operation and deserialization. The DPA block also forwards the selected DPA clock,
divided by the deserialization factor called rx_divfwdclk, to the FPGA fabric, along
with the deserialized data. This clock signal is put on the periphery clock (PCLK)
network. When using soft-CDR mode, the rx_resetport must not be asserted after
the rx_dpa_lockis asserted because the DPA will continuously choose new phase
taps from the PLL to track parts per million (PPM) differences between the reference
clock and incoming data.
f
For more information about periphery clock networks, refer to the Clock Networks and
PLLs in Stratix IV Devices chapter.
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Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
LVDS Interface with the Use External PLL Option Enabled
You can use every LVDS channel in soft-CDR mode and can drive the FPGA fabric
using the periphery clock network in the Stratix IV device family. The rx_dpa_locked
signal is not valid in soft-CDR mode because the DPA continuously changes its phase
to track PPM differences between the upstream transmitter and the local receiver
input reference clocks. The parallel clock rx_outclock, generated by the left and right
PLL, is also forwarded to the FPGA fabric.
LVDS Interface with the Use External PLL Option Enabled
The ALTLVDS MegaWizard Plug-In Manager software provides an option for
implementing the LVDS interface with the Use External PLL option. With this option
enabled you can control the PLL settings, such as dynamically reconfiguring the PLL
to support different data rates, dynamic phase shift, and other settings. You also must
instantiate an ALTPLL megafunction to generate the various clock and load enable
signals.
When you enable the Use External PLL option with the ALTLVDS transmitter and
receiver, the following signals are required from the ALTPLL megafunction:
■
■
■
Serial clock input to the SERDES of the ALTLVDS transmitter and receiver
Load enable to the SERDES of the ALTLVDS transmitter and receiver
Parallel clock used to clock the transmitter FPGA fabric logic and parallel clock
used for the receiver rx_syncclockport and receiver FPGA fabric logic
■
Asynchronous PLL reset port of the ALTLVDS receiver
1
As an example, Table 8–10 describes the serial clock output, load enable output, and
parallel clock output generated on ports c0, c1, and c2, respectively, along with the
locked signal of the ALTPLL instance. You can choose any of the PLL output clock
ports to generate the interface clocks.
f
1
With soft SERDES, a different clocking requirement is needed. For more information,
refer to the LVDS SERDES Transmitter/Receiver (ALTLVDS_RX/TX) Megafunction User
Guide.
The high-speed clock generated from the PLL is intended to clock the LVDS SERDES
circuitry only. Do not use the high-speed clock to drive other logic because the
allowed frequency to drive the core logic is restricted by the PLL FOUT specification.
For more information about the FOUT specification, refer to the DC and Switching
Characteristics for Stratix IV Devices chapter.
Table 8–10 lists the signal interface between the output ports of the ALTPLL
megafunction and the input ports of the ALTLVDS transmitter and receiver.
Table 8–10. Signal Interface Between ALTPLL and ALTLVDS Megafunctions (Part 1 of 2)
From the ALTPLL
To the ALTLVDS Transmitter
Megafunction
To the ALTLVDS Receiver
tx_inclock(serial clock input to the
transmitter)
Serial clock output (c0) (1)
rx_inclock(serial clock input)
rx_enable(load enable for the
deserializer)
Load enable output (c1)
tx_enable(load enable to the transmitter)
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February 2011 Altera Corporation
Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
8–27
LVDS Interface with the Use External PLL Option Enabled
Table 8–10. Signal Interface Between ALTPLL and ALTLVDS Megafunctions (Part 2 of 2)
From the ALTPLL
To the ALTLVDS Transmitter
Megafunction
To the ALTLVDS Receiver
rx_syncclock(parallel clock input) and
parallel clock used inside the receiver
core logic in the FPGA fabric
Parallel clock used inside the transmitter core
logic in the FPGA fabric
Parallel clock output (c2)
pll_areset(asynchronous PLL reset
port) (2)
~(locked)
—
Notes to Table 8–10:
(1) The serial clock output (c0) can only drive tx_inclockon the ALTLVDS transmitter and rx_inclockon the ALTLVDS receiver. This clock
cannot drive the core logic.
(2) The pll_aresetsignal is automatically enabled for the LVDS receiver in external PLL mode. This signal does not exist for LVDS transmitter
instantiation when the external PLL option is enabled.
1
The rx_syncclockport is automatically enabled in an LVDS receiver in external PLL
mode. The Quartus II compiler errors out if this port is not connected, as shown in
Figure 8–21.
When generating the ALTPLL megafunction, the Left/Right PLL option is configured
to set up the PLL in LVDS mode. Figure 8–21 shows the connection between the
ALTPLL and ALTLVDS megafunctions.
Figure 8–21. LVDS Interface with the ALTPLL Megafunction (Note 1)
FPGA Fabric
LVDS Transmitter
(ALTLVDS)
tx_inclock
Transmitter Core Logic
tx_coreclk
tx_in
tx_enable
ALTPLL
c0
c1
c2
inclk0
pll_areset
LVDS Receiver
(ALTLVDS)
rx_coreclk
locked
rx_inclock
Receiver Core Logic
rx_out
rx_enable
rx_syncclock
pll_areset
Note to Figure 8–21:
(1) Instantiation of pll_aresetis optional for the ALTPLL instantiation.
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Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
LVDS Interface with the Use External PLL Option Enabled
Example 8–1 shows how to generate three output clocks using an ALTPLL
megafunction.
Example 8–1. Generating Three Output Clocks Using an ALTPLL Megafunction
LVDS data rate = 1 Gbps; serialization factor = 10; input reference clock = 100 MHz
The following settings are used when generating the three output clocks using an ALTPLL megafunction.
The serial clock must be 1000 MHz and the parallel clock must be 100 MHz (serial clock divided by the
serialization factor):
■
■
■
c0
■
Frequency = 1000 MHz (multiplication factor = 10 and division factor = 1)
Phase shift = –180° with respect to the voltage-controlled oscillator (VCO) clock
Duty cycle = 50%
■
■
c1
■
Frequency = (1000/10) = 100 MHz (multiplication factor = 1 and division factor = 1)
Phase shift = (10 - 2) × 360/10 = 288° [(deserialization factor - 2)/deserialization factor] × 360°
Duty cycle = (100/10) = 10% (100 divided by the serialization factor)
■
■
c2
■
Frequency = (1000/10) = 100 MHz (multiplication factor = 1 and division factor = 1)
Phase shift = (–180/10) = –18° (c0 phase shift divided by the serialization factor)
Duty cycle = 50%
■
■
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February 2011 Altera Corporation
Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
8–29
Left and Right PLLs (PLL_Lx and PLL_Rx)
The Equation 8–1 calculations for phase shift assume that the input clock and serial
data are edge aligned. Introducing a phase shift of –180° to sampling clock (c0)
ensures that the input data is center-aligned with respect to the c0, as shown in
Figure 8–22.
Figure 8–22. Phase Relationship for External PLL Interface Signals
inclk0
VCO clk
(internal PLL clk)
c0 (-180
phase shift)
c1 (288
phase shift)
c2 (-18
phase shift)
Serial data
D9
D10
D1
D2
D3
D4
D5
D6
D7
D8
Left and Right PLLs (PLL_Lx and PLL_Rx)
The Stratix IV device family contains up to eight left and right PLLs with up to four
PLLs located on the left side and four on the right side of the device. The left PLLs can
support high-speed differential I/O banks on the left side; the right PLLs can support
high-speed differential I/O banks on the right side of the device. The high-speed
differential I/O receiver and transmitter channels use these left and right PLLs to
generate the parallel clocks (rx_outclockand tx_outclock) and high-speed clocks
(diffioclk).
Figure 8–2 on page 8–3 and Figure 8–3 on page 8–4 show the locations of the left and
right PLLs for Stratix IV E, GT, and GX devices. The PLL VCO operates at the clock
frequency of the data rate. Clock switchover and dynamic reconfiguration are
allowed using the left and right PLL in high-speed differential I/O support mode.
f
For more information, refer to the Clock Networks and PLLs in Stratix IV Devices
chapter.
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Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
Stratix IV Clocking
Stratix IV Clocking
The left and right PLLs feed into the differential transmitter and receive channels
through the LVDS and DPA clock network. The center left and right PLLs can clock
the transmitter and receive channels above and below them. The corner left and right
PLLs can drive I/Os in the banks adjacent to them.
Figure 8–23 shows center PLL clocking in the Stratix IV device family. For more
information about PLL clocking restrictions, refer to “Differential Pin Placement
Guidelines” on page 8–38.
Figure 8–23. LVDS/DPA Clocks in the Stratix IV Device Family with Center PLLs
LVDS
Clock
DPA
Clock
DPA
Clock
LVDS
Clock
4
4
Quadrant
Quadrant
4
4
Center
PLL_R2
Center
PLL_L2
2
2
2
2
Center
PLL_L3
Center
PLL_R3
4
4
Quadrant
Quadrant
LVDS
Clock
DPA
Clock
DPA
Clock
LVDS
Clock
4
4
Figure 8–24 shows center and corner PLL clocking in the Stratix IV device family. For
more information about PLL clocking restrictions, refer to “Differential Pin Placement
Guidelines” on page 8–38.
Figure 8–24. LVDS/DPA Clocks in the Stratix IV Device Family with Center and Corner PLLs
Corner
PLL_R1
Corner
PLL_L1
2
4
2
LVDS
Clock
DPA
Clock
DPA
Clock
LVDS
Clock
4
4
Quadrant
Quadrant
4
Center
PLL_L2
Center
PLL_R2
2
2
2
2
Center
Center
PLL_L3
PLL_R3
4
2
4
2
Quadrant
Quadrant
LVDS
Clock
DPA
Clock
DPA
Clock
LVDS
Clock
4
4
Corner
PLL_L4
Corner
PLL_R4
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February 2011 Altera Corporation
Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
8–31
Source-Synchronous Timing Budget
Source-Synchronous Timing Budget
This section describes the timing budget, waveforms, and specifications for
source-synchronous signaling in the Stratix IV device family. LVDS I/O standards
enable high-speed data transmission. This high data transmission rate results in better
overall system performance. To take advantage of fast system performance, it is
important to understand how to analyze timing for these high-speed signals. Timing
analysis for the differential block is different from traditional synchronous timing
analysis techniques.
Instead of focusing on clock-to-output and setup times, source synchronous timing
analysis is based on the skew between the data and the clock signals. High-speed
differential data transmission requires the use of timing parameters provided by IC
vendors and is strongly influenced by board skew, cable skew, and clock jitter. This
section defines the source-synchronous differential data orientation timing
parameters, the timing budget definitions for the Stratix IV device family, and how to
use these timing parameters to determine a design’s maximum performance.
Differential Data Orientation
There is a set relationship between an external clock and the incoming data. For
operations at 1 Gbps and a serialization factor of 10, the external clock is multiplied by
10. You can set phase-alignment in the PLL to coincide with the sampling window of
each data bit. The data is sampled on the falling edge of the multiplied clock.
Figure 8–25 shows the data bit orientation of the ×10 mode.
Figure 8–25. Bit Orientation in the Quartus II Software
inclock/outclock
10 LVDS Bits
MSB
9
LSB
0
data in
8
7
6
5
4
3
2
1
Differential I/O Bit Position
Data synchronization is necessary for successful data transmission at high
frequencies. Figure 8–26 shows the data bit orientation for a channel operation. This
figure is based on the following:
■
■
■
Serialization factor equals the clock multiplication factor
Edge alignment is selected for phase alignment
Implemented in hard SERDES
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Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
Source-Synchronous Timing Budget
For other serialization factors, use the Quartus II software tools to find the bit position
within the word. Table 8–11 lists the bit positions after deserialization.
Figure 8–26. Bit-Order and Word Boundary for One Differential Channel (Note 1)
Transmitter Channel
Operation (x8 Mode)
tx_outclock
Current Cycle
Next Cycle
Previous Cycle
7
X X X X X X
6
5
4
3
2
1
0
tx_out
X
X
X
X
X X X X
X
X
6
MSB
LSB
Receiver Channel
Operation (x8 Mode)
rx_inclock
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
7
5
4
3
2
1
0
rx_in
rx_outclock
rx_out [7..0]
X X X X X X X X
X X X X X X X X
X X X X 7 6 5 4
3 2 1 0 X X X X
Note to Figure 8–26:
(1) These are only functional waveforms and are not intended to convey timing information.
Table 8–11 lists the conventions for differential bit naming for 18 differential channels.
The MSB and LSB positions increase with the number of channels used in a system.
Table 8–11. Differential Bit Naming
Internal 8-Bit Parallel Data
Receiver Channel Data Number
MSB Position
LSB Position
1
2
7
0
15
8
3
23
16
4
31
24
5
39
32
6
47
40
7
55
48
8
63
56
9
71
64
10
11
12
13
14
15
16
17
18
79
72
87
80
95
88
103
111
119
127
135
143
96
104
112
120
128
136
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Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
8–33
Source-Synchronous Timing Budget
Transmitter Channel-to-Channel Skew
Transmitter channel-to-channel skew (TCCS) is an important parameter based on the
Stratix IV transmitter in a source synchronous differential interface. This parameter is
used in receiver skew margin calculation. For more information, refer to “Receiver
Skew Margin for Non-DPA Mode” on page 8–33.
TCCS is the difference between the fastest and slowest data output transitions,
including the TCO variation and clock skew. For LVDS transmitters, the TimeQuest
Timing Analyzer provides a TCCS report, which shows TCCS values for serial output
ports.
f
You can get the TCCS value from the TCCS report (report_TCCS) in the Quartus II
compilation report under the TimeQuest Timing Analyzer, or from the DC and
Switching Characteristics for Stratix IV Devices chapter.
Receiver Skew Margin for Non-DPA Mode
Changes in system environment, such as temperature, media (cable, connector, or
PCB), and loading effect the receiver’s setup and hold times; internal skew affects the
sampling ability of the receiver.
Different modes of LVDS receivers use different specifications that can help in
deciding the ability to sample the received serial data correctly. In DPA mode, you
must use DPA jitter tolerance instead of receiver input skew margin (RSKM).
In non-DPA mode, use TCCS, RSKM, and sampling window (SW) specifications for
high-speed source-synchronous differential signals in the receiver data path. The
relationship between RSKM, TCCS, and SW is expressed by the RSKM equation
shown in Equation 8–1.
Equation 8–1. RSKM
TUI – SW – TCCS
RSKM = ----------------------------------------------
2
Conventions used for the equation:
■
Time unit interval (TUI)—Time period of the serial data.
■
RSKM—The timing margin between the receiver’s clock input and the data input
sampling window.
■
■
SW—The period of time that the input data must be stable to ensure that data is
successfully sampled by the LVDS receiver. The SW is a device property and
varies with device speed grade.
TCCS—The timing difference between the fastest and the slowest output edges,
including tCO variation and clock skew, across channels driven by the same PLL.
The clock is included in the TCCS measurement.
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Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
Source-Synchronous Timing Budget
Figure 8–27 shows the relationship between the RSKM, TCCS, and the receiver’s SW.
You must calculate the RSKM value to decide whether or not data can be sampled
properly by the LVDS receiver with the given data rate and device. A positive RSKM
value indicates that the LVDS receiver can sample the data properly, whereas a
negative RSKM indicates that it cannot.
Figure 8–27. Differential High-Speed Timing Diagram and Timing Budget for Non-DPA Mode
Timing Diagram
External
Input Clock
Time Unit Interval (TUI)
Internal
Clock
TCCS
RSKM
TCCS
RSKM
Receiver
Input Data
SW
Internal
Clock
Falling Edge
Timing Budget
TUI
External
Clock
Clock Placement
Internal
Clock
Synchronization
Transmitter
Output Data
RSKM
RSKM
TCCS
2
TCCS
Receiver
Input Data
SW
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Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
8–35
Source-Synchronous Timing Budget
For LVDS receivers, the Quartus II software provides an RSKM report showing the
SW, TUI, and RSKM values for non-DPA mode. You can generate the RSKM report by
executing the report_RSKMcommand in the TimeQuest Timing Analyzer. You can
find the RSKM report in the Quartus II compilation report under the TimeQuest
Timing Analyzer section.
1
In order to obtain the RSKM value, you must assign an appropriate input delay to the
LVDS receiver through the TimeQuest Timing Analyzer constraints menu.
For assigning input delay, follow these steps:
1. The Quartus II TimeQuest Timing Analyzer GUI has many options for setting the
constraints and analyzing the design. Figure 8–28 shows various commands on
the Constraints menu. For setting input delay, you must select the Set Input Delay
option.
Figure 8–28. Selection of Constraint Menu in TimeQuest Timing Analyzer
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Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
Source-Synchronous Timing Budget
2. Figure 8–29 shows the setting parameters for the Set Input Delay option. The
clock name must reference the source synchronous clock that feeds the LVDS
receiver. Select the desired clock using the pull-down menu.
Figure 8–29. Input Time Delay Assignment Through TimeQuest Timing Analyzer
3. Figure 8–30 shows the Targets option. You can view a list of all available ports
using the List option in the Name Finder window.
Figure 8–30. Name Finder Window in Set Input Delay Option
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8–37
Source-Synchronous Timing Budget
4. Select the LVDS receiver serial input ports (from the list) according to the input
delay you set. Click OK.
5. In the Set Input Delay window, set the appropriate values in the Input Delay
Options section and Delay value.
6. Click Run to incorporate these values in the TimeQuest Timing Analyzer.
7. Assign the appropriate delay for all the LVDS receiver input ports following these
steps. If you have already assigned Input Delay and you need to add more delay
to that input port, use the Add Delay option in the Set Input Delay window.
1
If no input delay is set in the TimeQuest Timing Analyzer, the receiver
channel-to-channel skew (RCCS) defaults to zero. You can also directly set the input
delay in a Synopsys Design Constraint file (.sdc) using the set_input_delay
command.
f
For more information about .sdc commands and the TimeQuest Timing Analyzer,
refer to the Quartus II TimeQuest Timing Analyzer chapter in volume 3 of the Quartus II
Development Software Handbook.
Example 8–2 shows the RSKM calculation.
Example 8–2. RSKM
Data Rate: 1 Gbps, Board channel-to-channel skew = 200 ps
For Stratix IV devices:
TCCS = 100 ps (pending characterization)
SW = 300 ps (pending characterization)
TUI = 1000 ps
Total RCCS = TCCS + Board channel-to-channel skew= 100 ps + 200 ps
= 300 ps
RSKM= TUI - SW - RCCS
= 1000 ps - 300 ps - 300 ps
= 400 ps > 0
Because the RSKM > 0 ps, receiver non-DPA mode must work correctly.
1
You can also calculate RSKM using the steps described in “Guidelines for DPA-
Enabled Differential Channels” on page 8–38.
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Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
Differential Pin Placement Guidelines
Differential Pin Placement Guidelines
To ensure proper high-speed operation, differential pin placement guidelines have
been established. The Quartus II compiler automatically checks that these guidelines
are followed and issues an error message if they are not met.
This section is divided into pin placement guidelines with and without DPA usage
because DPA usage adds some constraints on the placement of high-speed differential
channels.
1
DPA-enabled differential channels refer to DPA mode or soft-CDR mode; DPA
disabled channels refer to non-DPA mode.
Guidelines for DPA-Enabled Differential Channels
The Stratix IV device family has differential receivers and transmitters in I/O banks
on the left and right sides of the device. Each receiver has a dedicated DPA circuit to
align the phase of the clock to the data phase of its associated channel. When you use
DPA-enabled channels in differential banks, you must adhere to the guidelines listed
in the following sections.
DPA-Enabled Channels and Single-Ended I/Os
When you enable a DPA channel in a bank, both single-ended I/Os and differential
I/O standards are allowed in the bank.
■
■
■
Single-ended I/Os are allowed in the same I/O bank, as long as the single-ended
I/O standard uses the same VCCIO as the DPA-enabled differential I/O bank.
Single-ended inputs can be in the same logic array block (LAB) row as a
differential channel using the SERDES circuitry.
DDIO can be placed within the same LAB row as a SERDES differential channel
but half rate DDIO (single data rate) output pins cannot be placed within the same
LAB row as a receiver SERDES differential channel. The input register must be
implemented within the FPGA fabric logic.
DPA-Enabled Channel Driving Distance
If the number of DPA channels driven by each left and right PLL exceeds 25 LAB
rows, Altera recommends implementing data realignment (bit slip) circuitry for all
the DPA channels.
Using Corner and Center Left and Right PLLs
If a differential bank is being driven by two left and right PLLs, where the corner left
and right PLL is driving one group and the center left and right PLL is driving
another group, there must be at least one row of separation between the two groups
of DPA-enabled channels (refer to Figure 8–31). The two groups can operate at
independent frequencies.
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Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
8–39
Differential Pin Placement Guidelines
You do not need a separation if a single left and right PLL is driving the DPA-enabled
channels as well as DPA-disabled channels.
Figure 8–31. Corner and Center Left and Right PLLs Driving DPA-Enabled Differential I/Os in the
Same Bank
Corner
Left/Right PLL
Reference
CLK
DPA-enabled
Diff I/O
Channels
driven by
Corner
Left/Right
PLL
DPA -enabled
Diff I/O
DPA -enabled
Diff I/O
DPA -enabled
Diff I/O
DPA -enabled
Diff I/O
One Unused
Channel for Buffer
Diff I/O
DPA-enabled
Diff I/O
DPA-enabled
Diff I/O
Channels
driven by
Center
DPA-enabled
Diff I/O
Left/Right
PLL
DPA-enabled
Diff I/O
Reference
CLK
Center
Left/Right PLL
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Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
Differential Pin Placement Guidelines
Using Both Center Left and Right PLLs
You can use both center left and right PLLs to drive DPA-enabled channels
simultaneously, as long as they drive these channels in their adjacent banks only, as
shown in Figure 8–32.
If one of the center left and right PLLs drives the top and bottom banks, you cannot
use the other center left and right PLL to drive differential channels, as shown in
Figure 8–32.
If the top PLL_L2 and PLL_R2 drives DPA-enabled channels in the lower differential
bank, the PLL_L3 and PLL_R3 cannot drive DPA-enabled channels in the upper
differential banks and vice versa. In other words, the center left and right PLLs cannot
drive cross-banks simultaneously, as shown in Figure 8–33.
Figure 8–32. Center Left and Right PLLs Driving DPA-Enabled Differential I/Os
DPA-enabled
Diff I/O
DPA-enabled
Diff I/O
DPA-enabled
Diff I/O
DPA-enabled
Diff I/O
DPA-enabled
Diff I/O
DPA-enabled
Diff I/O
DPA-enabled
Diff I/O
DPA-enabled
Diff I/O
Reference
CLK
Reference
CLK
Center
Center
Left/Right PLL
(PLL_L2/PLL_R2)
Left/Right PLL
(PLL_L2/PLL_R2)
Center
Left/Right PLL
(PLL_L3/PLL_R3)
Center
Left/Right PLL
(PLL_L3/PLL_R3)
Unused
PLL
Reference
CLK
Reference
CLK
DPA-enabled
Diff I/O
DPA-enabled
Diff I/O
DPA-enabled
Diff I/O
DPA-enabled
Diff I/O
DPA-enabled
Diff I/O
DPA-enabled
Diff I/O
DPA-enabled
Diff I/O
DPA-enabled
Diff I/O
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
8–41
Differential Pin Placement Guidelines
Figure 8–33. Invalid Placement of DPA-Enabled Differential I/Os Driven by Both Center Left and
Right PLLs
DPA-enabled
Diff I/O
DPA-enabled
Diff I/O
DPA-enabled
Diff I/O
DPA-enabled
Diff I/O
Reference
CLK
Center Left/Right
PLL
Center Left/Right
PLL
Reference
CLK
DPA-enabled
Diff I/O
DPA-enabled
Diff I/O
DPA-enabled
Diff I/O
DPA-enabled
Diff I/O
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
8–42
Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
Differential Pin Placement Guidelines
Guidelines for DPA-Disabled Differential Channels
When you use DPA-disabled channels in the left and right banks of a Stratix IV
device, you must adhere to the guidelines in the following sections.
1
When using non-DPA receivers, you must drive the PLL from a dedicated and
compensated clock input pin. Compensated clock inputs are dedicated clock pins in
the same I/O bank as the PLL.
f
For more information about dedicated and compensated clock inputs, refer to the
Clock Networks and PLLs in Stratix IV Devices chapter.
DPA-Disabled Channels and Single-Ended I/Os
The placement rules for DPA-disabled channels and single-ended I/Os are the same
as those for DPA-enabled channels and single-ended I/Os. For more information,
refer to “DPA-Enabled Channels and Single-Ended I/Os” on page 8–38.
DPA-Disabled Channel Driving Distance
Each left and right PLL can drive all the DPA-disabled channels in the entire bank.
Using Corner and Center Left and Right PLLs
You can use a corner left and right PLL to drive all transmitter channels and a center
left and right PLL to drive all DPA-disabled receiver channels within the same
differential bank. In other words, a transmitter channel and a receiver channel in the
same LAB row can be driven by two different PLLs, as shown in Figure 8–34.
A corner left and right PLL and a center left and right PLL can drive duplex channels
in the same differential bank, as long as the channels driven by each PLL are not
interleaved. Separation is not necessary between the group of channels driven by the
corner and center left and right PLLs, as shown in Figure 8–34 and Figure 8–35.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
8–43
Differential Pin Placement Guidelines
Figure 8–34. Corner and Center Left and Right PLLs Driving DPA-Disabled Differential I/Os in the
Same Bank
Corner Left/Right
PLL
Corner Left/Right
PLL
Reference
CLK
Reference
CLK
Diff RX
Diff TX
DPA-disabled
Diff I/O
Channels
driven by
Corner
Left/Right
PLL
Diff RX
Diff RX
Diff RX
Diff RX
Diff RX
Diff RX
Diff RX
Diff RX
Diff TX
Diff TX
Diff TX
Diff TX
Diff TX
Diff TX
Diff TX
Diff TX
DPA-disabled
Diff I/O
DPA-disabled
Diff I/O
DPA-disabled
Diff I/O
No
separation
buffer
DPA-disabled
Diff I/O
DPA-disabled
Diff I/O
needed
DPA-disabled
Diff I/O
DPA-disabled
Diff I/O
Channels
driven by
Center
DPA-disabled
Diff I/O
Left/Right
PLL
DPA -disabled
Diff I /O
Diff RX
Diff TX
Reference
CLK
Reference
CLK
Center Left/Right
PLL
Center Left/Right
PLL
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
8–44
Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
Differential Pin Placement Guidelines
Figure 8–35. Invalid Placement of DPA-Disabled Differential I/Os Due to Interleaving of Channels
Driven by the Corner and Center Left and Right PLLs
Corner Left/Right
PLL
Reference CLK
DPA-disabled
Diff I/O
DPA-disabled
Diff I/O
DPA-disabled
Diff I/O
DPA-disabled
Diff I/O
DPA-disabled
Diff I/O
DPA-disabled
Diff I/O
DPA-disabled
Diff I/O
DPA-disabled
Diff I/O
DPA-disabled
Diff I/O
DPA-disabled
Diff I/O
Reference CLK
Center Left/Right
PLL
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
8–45
Differential Pin Placement Guidelines
Using Both Center Left and Right PLLs
You can use both center left and right PLLs simultaneously to drive DPA-disabled
channels on upper and lower differential banks. Unlike DPA-enabled channels, the
center left and right PLLs can drive cross-banks. For example, the upper-center left
and right PLL can drive the lower differential bank at the same time the lower center
left and right PLL is driving the upper differential bank, and vice versa, as shown in
Figure 8–36.
Figure 8–36. Both Center Left and Right PLLs Driving Cross-Bank DPA-Disabled Channels
Simultaneously
DPA-disabled
Diff I/O
DPA-disabled
Diff I/O
DPA-disabled
Diff I/O
DPA-disabled
Diff I/O
Reference
CLK
Center
Left/Right PLL
Center
Left/Right PLL
Reference
CLK
DPA-disabled
Diff I/O
DPA-disabled
Diff I/O
DPA-disabled
Diff I/O
DPA-disabled
Diff I/O
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
8–46
Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
Differential Pin Placement Guidelines
Document Revision History
Table 8–12 lists the revision history for this chapter.
Table 8–12. Document Revision History (Part 1 of 2)
Date
Version
Changes
■ Updated Table 8–10.
■ Updated the “Differential Transmitter”, “Non-DPA Mode”, “LVDS Interface with the Use
External PLL Option Enabled”, “Deserializer”, and “Guidelines for DPA-Disabled
Differential Channels” sections.
February 2011
3.2
■ Applied new template.
■ Minor text edits.
■ Removed note 7 from Table 8–1 and Table 8–2.
■ Updated Figure 8–5.
■ Updated the “LVDS Channels” section.
■ Updated Table 8–7.
March 2010
3.1
■ Added a note to the “LVDS Interface with the Use External PLL Option Enabled” and
“ALTLVDS Port List” sections.
■ Minor text edits.
■ Changed “dedicated LVDS” to “true LVDS”.
■ Removed EP4SE110, EP4SE290, and EP4SE680 devices.
■ Added EP4SE820 and Stratix IV GT devices.
■ Updated “LVDS Channels”, “Differential Transmitter”, “Soft-CDR Mode”, and “DPA-
Enabled Channels and Single-Ended I/Os” sections.
November 2009
3.0
■ Updated Table 8–1, Table 8–2, Table 8–5, and Table 8–6.
■ Added Table 8–3 and Table 8–4.
■ Updated Example 8–1.
■ Updated Figure 8–22.
■ Minor text edits.
■ Added an introductory paragraph to increase search ability.
■ Minor text edits.
June 2009
April 2009
2.3
2.2
■ Updated “Introduction”.
■ Updated Figure 8–3.
■ Removed Table 8-5 and Table 8-6.
■ Updated “Introduction”, “Stratix IV LVDS Channels”, “Stratix IV Differential Transmitter”,
“Differential I/O Termination”, and “Dynamic Phase Alignment (DPA) Block” sections.
■ Updated Table 8–1, Table 8–2, Table 8–3, Table 8–4, and Table 8–7.
■ Added Table 8–5 and Table 8–6.
March 2009
2.1
■ Updated Figure 8–2.
■ Removed “Referenced Documents” section.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
8–47
Differential Pin Placement Guidelines
Table 8–12. Document Revision History (Part 2 of 2)
Date
November 2008
May 2008
Version
Changes
■ Updated Figure 8–2, Figure 8–3, Figure 8–21, Figure 8–34.
■ Removed Figure 8–31.
2.0
■ Updated Table 8–1, Table 8–10.
■ Updated “Differential Pin Placement Guidelines” section.
Initial release.
1.0
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
8–48
Chapter 8: High-Speed Differential I/O Interfaces and DPA in Stratix IV Devices
Differential Pin Placement Guidelines
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Section III. System Integration
This section includes the following chapters:
■
Chapter 9, Hot Socketing and Power-On Reset in Stratix IV Devices
■
Chapter 10, Configuration, Design Security, and Remote System Upgrades in
Stratix IV Devices
■
■
■
Chapter 11, SEU Mitigation in Stratix IV Devices
Chapter 12, JTAG Boundary-Scan Testing in Stratix IV Devices
Chapter 13, Power Management in Stratix IV Devices
Revision History
Refer to each chapter for its own specific revision history. For information on when
each chapter was updated, refer to the Chapter Revision Dates section, which appears
in the full handbook.
June 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
III–2
Section III: System Integration
Revision History
Stratix IV Device Handbook Volume 1
June 2011 Altera Corporation
9. Hot Socketing and Power-On Reset in
Stratix IV Devices
February 2011
SIV51009-3.2
SIV51009-3.2
This chapter describes hot-socketing specifications, power-on reset (POR)
requirements, and their implementation in Stratix® IV devices.
Stratix IV devices offer hot socketing, also known as hot plug-in or hot swap, and
power sequencing support without the use of external devices. You can insert or
remove a Stratix IV device or a board in a system during system operation without
causing undesirable effects to the running system bus or board that is inserted into the
system.
The hot-socketing feature also removes some of the difficulty when you use Stratix IV
devices on PCBs that contain a mixture of 3.0-, 2.5-, 1.8-, 1.5-, and 1.2-V devices.
The Stratix IV hot-socketing feature provides:
■
■
■
Board or device insertion and removal without external components or board
manipulation
Support for any power-up sequence with the exception that VCC must power up
fully before VCCAUX for all Stratix IV production devices
I/O buffers non-intrusive to system buses during hot insertion
This section also describes POR circuitry in Stratix IV devices. POR circuitry keeps the
devices in the reset state until the power supply outputs are within operating range
(provided VCC powers up fully before VCCAUX).
This chapter contains the following sections:
■
■
■
■
“Stratix IV Hot-Socketing Specifications”
“Hot-Socketing Feature Implementation in Stratix IV Devices” on page 9–2
“Power-On Reset Circuitry” on page 9–3
“Power-On Reset Specifications” on page 9–4
Stratix IV Hot-Socketing Specifications
Stratix IV devices are hot-socketing compliant without the need for external
components or special design requirements. Hot-socketing support in Stratix IV
devices has the following advantages:
■
■
■
“Stratix IV Devices can be Driven Before Power Up” on page 9–2
“I/O Pins Remain Tri-Stated During Power Up” on page 9–2
“Insertion or Removal of a Stratix IV Device from a Powered-Up System” on
page 9–2
© 2011 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX are Reg. U.S. Pat. & Tm. Off.
and/or trademarks of Altera Corporation in the U.S. and other countries. All other trademarks and service marks are the property of their respective holders as described at
www.altera.com/common/legal.html. Altera warrants performance of its semiconductor products to current specifications in accordance with Altera’s standard warranty, but
reserves the right to make changes to any products and services at any time without notice. Altera assumes no responsibility or liability arising out of the application or use of any
information, product, or service described herein except as expressly agreed to in writing by Altera. Altera customers are advised to obtain the latest version of device
specifications before relying on any published information and before placing orders for products or services.
Stratix IV Device Handbook Volume 1
February 2011
Subscribe
9–2
Chapter 9: Hot Socketing and Power-On Reset in Stratix IV Devices
Stratix IV Hot-Socketing Specifications
Stratix IV Devices can be Driven Before Power Up
You can drive signals into I/O pins, dedicated input pins, and dedicated clock pins of
Stratix IV devices before or during power up or power down without damaging the
device.
I/O Pins Remain Tri-Stated During Power Up
A device that does not support hot socketing can interrupt system operation or cause
contention by driving out before or during power up. In a hot-socketing situation, the
Stratix IV device’s output buffers are turned off during system power up or power
down. Also, the Stratix IV device does not drive out until the device is configured and
working within the recommended operating conditions.
Insertion or Removal of a Stratix IV Device from a Powered-Up System
Devices that do not support hot socketing can short power supplies when powered
up through the device signal pins. This irregular power up can damage both the
driving and driven devices and can disrupt card power up.
You can insert a Stratix IV device into or remove it from a powered-up system board
without damaging the system board or interfering with its operation.
You can power up or power down the VCCIO, VCC, VCCPGM, and VCCPD supplies in any
sequence (with any time between them) which are monitored by the hot socket
circuit. In addition, all other power supplies for the device can be powered up or
down in any sequence. Individual power supply ramp-up and ramp-down rates
range from 50 µs to 100 ms. During hot socketing, the I/O pin capacitance is less than
15 pF and the clock pin capacitance is less than 20 pF.
1
To successfully power-up and exit POR on production devices, fully power VCC
before VCCAUX begins to ramp.
A possible concern regarding hot socketing is the potential for “latch-up.” Stratix IV
devices are immune to latch-up when hot socketing. Latch-up can occur when
electrical subsystems are hot socketed into an active system. During hot socketing, the
signal pins can be connected and driven by the active system before the power supply
can provide current to the device’s power and ground planes. This condition can lead
to latch-up and cause a low-impedance path from power to ground within the device.
As a result, the device draws a large amount of current, possibly causing electrical
damage.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 9: Hot Socketing and Power-On Reset in Stratix IV Devices
9–3
Hot-Socketing Feature Implementation in Stratix IV Devices
Hot-Socketing Feature Implementation in Stratix IV Devices
The hot-socketing feature turns off the output buffer during power up and power
down of the VCC, VCCAUX, VCCIO, VCCPGM, or VCCPD power supplies. The hot-socketing
circuitry generates an internal HOTSCKTsignal when the VCC, VCCAUX, VCCIO, VCCPGM
,
or VCCPD power supplies are below the threshold voltage. Hot-socketing circuitry is
designed to prevent excess I/O leakage during power up. When the voltage ramps up
very slowly, it is still relatively low, even after the POR signal is released and the
configuration is completed. The CONF_DONE, nCEO, and nSTATUSpins fail to respond, as
the output buffer cannot flip from the state set by the hot-socketing circuit at this low
voltage. Therefore, the hot-socketing circuitry has been removed from these
configuration pins to make sure that they are able to operate during configuration.
Thus, it is expected behavior for these pins to drive out during power-up and
power-down sequences.
Figure 9–1 shows the Stratix IV device’s I/O pin circuitry.
Figure 9–1. Hot-Socketing Circuitry for Stratix IV Devices
Power On
Reset
Monitor
V
CCIO
Weak
Pull-Up
Resistor
R
Output Enable
Hot Socket
Voltage
Tolerance
Control
PAD
Output
Pre-Driver
Input Buffer
to Logic Array
The POR circuit monitors the voltage level of the power supplies (VCC, VCCAUX, VCCPT
,
V
CCPGM, and VCCPD) and keeps the I/O pins tri-stated until the device is in user mode.
The weak pull-up resistor (R) in the Stratix IV input/output element (IOE) keeps the
I/O pins from floating. The 3.0-V tolerance control circuit permits the I/O pins to be
driven by 3.0 V before the VCC, VCCAUX, VCCPT, VCCPGM, or VCCPD supplies are
powered. It also prevents the I/O pins from driving out when the device is not in user
mode. To successfully power-up and exit POR on production devices, fully power
V
CC before VCCAUX begins to ramp.
1
Altera uses GND as a reference for hot-socketing operations and I/O buffer designs.
To ensure proper operation, you must connect the GND between boards before
connecting the power supplies. This prevents the GND on your board from being
pulled up inadvertently by a path to power through other components on your board.
A pulled up GND could otherwise cause an out-of-specification I/O voltage or
current condition with the Altera device.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
9–4
Chapter 9: Hot Socketing and Power-On Reset in Stratix IV Devices
Power-On Reset Circuitry
Power-On Reset Circuitry
When power is applied to a Stratix IV device, a POR event occurs if the power supply
reaches the recommended operating range within the maximum power supply ramp
time (tRAMP). If tRAMP is not met, the device I/O pins and programming registers
remain tri-stated, during which device configuration could fail. The maximum tRAMP
for Stratix IV devices is 100 ms; the minimum tRAMP is 50 µs. When the PORSELpin is
high, the maximum TRAMP for Stratix IV devices is 4 ms.
Stratix IV devices provide a dedicated input pin (PORSEL) to select a POR delay time
during power up. When the PORSELpin is connected to GND, the POR delay time is
100 to 300 ms. When the PORSELpin is set to high, the POR delay time is 4 to 12 ms.
The POR block consists of a regulator POR, satellite POR, and main POR to check the
power supply levels for proper device configuration.
The satellite POR monitors the following:
■
■
■
VCCPD and VCCPGM power supplies that are used in the I/O buffers and for device
programming
VCCAUX power supply which is the auxiliary supply for the programmable power
technology
VCC and VCCPT power supplies that are used in the device core
1
1
Altera requires powering up VCC before VCCAUX.
The main POR waits for satellite POR and the regulator POR to release the POR
signal. Until the release of the POR signal, the device configuration cannot start.
The internal configuration memory supply that is used during device configuration is
checked by the regulator POR block and is gated in the main POR block for the final
POR trip. Figure 9–2 shows a simplified diagram of the POR block.
All configuration-related dedicated and dual function I/O pins must be powered by
VCCPGM
.
Figure 9–2. Simplified POR Diagram for Stratix IV Devices
Regulator POR
Main POR
V
CCPGM
V
CCPD
POR
POR Pulse
Setting
V
CC
Satellite POR
V
CCPT
V
CCAUX
PORSEL
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 9: Hot Socketing and Power-On Reset in Stratix IV Devices
9–5
Power-On Reset Specifications
Power-On Reset Specifications
Table 9–1 lists the power supplies that the POR circuit monitors.
1
Altera requires powering up VCC before VCCAUX
.
Table 9–1. Power Supplies Monitored by the POR Circuitry
Power Supply Description
VCC Core and periphery power supply
Setting (V)
0.9
VCCPT
Programmable power technology power supply
I/O pre-driver power supply
1.5
VCCPD
2.5, 3.0
VCCPGM
VCCAUX
Configuration pins power supply
1.8, 2.5, 3.0
2.5
Auxiliary supply for the programmable power technology
Table 9–2 lists the power supplies that the POR circuit does not monitor.
Table 9–2. Power Supplies Not Monitored by the POR Circuitry (Note 1)
Power Supply
VCCIO
Description
Setting (V)
1.2, 1.5, 1.8,
2.5, 3.0
I/O power supply
VCCA_PLL
VCCD_PLL
PLL analog global power supply
PLL digital power supply
2.5
0.9
PLL differential clock input power supply (top and bottom I/O
banks only)
VCC_CLKIN
2.5
Battery back-up power supply for design security volatile key
storage
VCCBAT
1.2-3.3
Note to Table 9–2:
(1) The transceiver supplies are not monitored by POR.
1
VCCIO, VCCA_PLL, VCCD_PLL, VCC_CLKIN, and VCCBAT are not monitored by POR and have
no affect on the device configuration.
The POR specification is designed to ensure that all the circuits in the Stratix IV device
are at certain known states during power up.
The POR signal pulse width is programmable using the PORSELinput pin. When the
PORSELpin is connected to GND, the POR delay time is 100 to 300 ms. When the
PORSELpin is set to high, the POR delay time is 4 to 12 ms.
f
For more information about the POR specification, refer to the DC and Switching
Characteristics for Stratix IV Devices chapter.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
9–6
Chapter 9: Hot Socketing and Power-On Reset in Stratix IV Devices
Power-On Reset Specifications
Document Revision History
Table 9–3 lists the revision history for this chapter.
Table 9–3. Document Revision History
Date
Version
Changes
■ Updated Table 9–2.
■ Updated the “Power-On Reset Circuitry”, “Power-On Reset Specifications”, and “Insertion
or Removal of a Stratix IV Device from a Powered-Up System” sections.
February 2011
3.2
■ Applied new template.
■ Minor text edits.
■ Updated the introduction and the “Stratix IV Hot-Socketing Specifications”, “Insertion or
Removal of a Stratix IV Device from a Powered-Up System”, “Hot-Socketing Feature
Implementation in Stratix IV Devices”, “Power-On Reset Circuitry”, and “Power-On Reset
Specifications” sections.
March 2010
3.1
■ Updated Table 9–1 and Table 9–2.
■ Updated Figure 9–2.
■ Minor text edits.
■ Updated graphics.
November 2009
June 2009
3.0
2.2
■ Minor text edits.
■ Updated Table 9–2.
■ Added introductory sentences to improve search ability.
■ Removed the Conclusion section.
■ Minor text edits.
■ Changed all “Stratix IV E” to “Stratix IV”.
■ Updated “Stratix IV Hot-Socketing Specifications” and “Hot-Socketing Feature
Implementation in Stratix IV Devices” sections.
March 2009
2.1
2.0
■ Updated Figure 9–2.
■ Removed “Referenced Documents” section.
■ Updated “Hot-Socketing Feature Implementation in Stratix IV Devices” on page 9–2.
■ Updated “Power-On Reset Circuitry” on page 9–4.
■ Updated Table 9–1.
November 2008
■ Made minor editorial changes.
July 2008
May 2008
1.1
1.0
Revised “Introduction”.
Initial release.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
10. Configuration, Design Security, and
Remote System Upgrades in Stratix IV
Devices
April 2011
SIV51010-3.3
SIV51010-3.3
This chapter describes the configuration, design security, and remote system
upgrades in Stratix® IV devices. To save configuration memory space and time,
Stratix IV devices provide configuration data decompression. They also provide a
built-in design security feature that protects your designs against IP theft and
tampering of your configuration files.
Stratix IV devices also offer remote system upgrade capability so that you can
upgrade your system in real-time through any network. This helps to deliver feature
enhancements and bug fixes and provides error detection, recovery, and status
information to ensure reliable reconfiguration.
Overview
This chapter describes supported configuration schemes for Stratix IV devices,
instructions about how to execute the required configuration schemes, and the
necessary pin settings.
Stratix IV devices use SRAM cells to store configuration data. As SRAM is volatile,
you must download configuration data to the Stratix IV device each time the device
powers up. You can configure Stratix IV devices using one of four configuration
schemes:
■
■
■
■
Fast passive parallel (FPP)
Fast active serial (AS)
Passive serial (PS)
Joint Test Action Group (JTAG)
All configuration schemes use either an external controller (for example, a MAX® II
device or microprocessor), a configuration device, or a download cable. For more
information, refer to “Configuration Features” on page 10–4.
This chapter includes the following sections:
■
■
■
■
■
■
■
■
■
“Configuration Schemes” on page 10–2
“Configuration Features” on page 10–4
“Fast Passive Parallel Configuration” on page 10–6
“Fast Active Serial Configuration (Serial Configuration Devices)” on page 10–16
“Passive Serial Configuration” on page 10–24
“JTAG Configuration” on page 10–34
“Device Configuration Pins” on page 10–39
“Configuration Data Decompression” on page 10–47
“Remote System Upgrades” on page 10–49
© 2011 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX are Reg. U.S. Pat. & Tm. Off.
and/or trademarks of Altera Corporation in the U.S. and other countries. All other trademarks and service marks are the property of their respective holders as described at
www.altera.com/common/legal.html. Altera warrants performance of its semiconductor products to current specifications in accordance with Altera’s standard warranty, but
reserves the right to make changes to any products and services at any time without notice. Altera assumes no responsibility or liability arising out of the application or use of any
information, product, or service described herein except as expressly agreed to in writing by Altera. Altera customers are advised to obtain the latest version of device
specifications before relying on any published information and before placing orders for products or services.
Stratix IV Device Handbook Volume 1
April 2011
Subscribe
10–2
Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
Configuration Schemes
■
■
■
■
“Remote System Upgrade Mode” on page 10–53
“Dedicated Remote System Upgrade Circuitry” on page 10–56
“Quartus II Software Support” on page 10–62
“Design Security” on page 10–63
Configuration Devices
Altera® serial configuration devices support a single-device and multi-device
configuration solution for Stratix IV devices and are used in the fast AS configuration
scheme. Serial configuration devices offer a low-cost, low pin-count configuration
solution.
f
1
For information about serial configuration devices, refer to the Serial Configuration
Devices (EPCS1, EPCS4, EPCS16, EPCS64, and EPCS128) Data Sheet in volume 2 of the
Configuration Handbook.
All minimum timing information in this chapter covers the entire Stratix IV family.
Some devices may work at less than the minimum timing stated in this handbook due
to process variation.
Configuration Schemes
Select the configuration scheme by driving the Stratix IV device MSELpins either high
or low, as shown in Table 10–1. The MSELinput buffers are powered by the VCC power
supply. Altera recommends hard wiring the MSEL[]pins to VCCPGM and GND. The
MSEL[2..0]pins have 5-k internal pull-down resistors that are always active.
During power-on reset (POR) and during reconfiguration, the MSELpins must be at
V
IL and VIH levels of VCCPGM voltage to be considered logic low and logic high.
1
To avoid problems with detecting an incorrect configuration scheme, hardwire the
MSEL[]pins to VCCPGM and GND without pull-up or pull-down resistors. Do not drive
the MSEL[]pins by a microprocessor or another device.
Table 10–1. Configuration Schemes for Stratix IV Devices (Part 1 of 2)
Configuration Scheme
Fast passive parallel
MSEL2
MSEL1
MSEL0
0
0
0
0
0
0
1
1
1
0
0
0
1
1
1
Passive serial
Fast AS (40 MHz) (1)
Remote system upgrade fast AS (40 MHz) (1)
FPP with design security feature and/or decompression enabled (2)
Stratix IV Device Handbook Volume 1
April 2011 Altera Corporation
Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
10–3
Configuration Schemes
Table 10–1. Configuration Schemes for Stratix IV Devices (Part 2 of 2)
Configuration Scheme
JTAG-based configuration (4)
MSEL2
MSEL1
MSEL0
(3)
(3)
(3)
Notes to Table 10–1:
(1) Stratix IV devices only support fast AS configuration. You must use either EPCS64 or EPCS128 devices to configure a Stratix IV device in fast
AS mode.
(2) These modes are only supported when using a MAX II device or a microprocessor with flash memory for configuration. In these modes, the
host system must output a DCLKthat is ×4 the data rate.
(3) Do not leave the MSELpins floating, connect them to VCCPGM or GND. These pins support the non-JTAG configuration scheme used in
production. If you only use the JTAG configuration, connect the MSELpins to GND.
(4) The JTAG-based configuration takes precedence over other configuration schemes, which means the MSELpin settings are ignored. The
JTAG-based configuration does not support the design security or decompression features.
Table 10–2 lists the uncompressed raw binary file (.rbf) configuration file sizes for
Stratix IV devices.
Table 10–2. Uncompressed Raw Binary File (.rbf) Sizes for Stratix IV Devices
Device
EP4SE230
Data Size (Bits)
94,557,465
EP4SE360
EP4SE530
EP4SE820
EP4SGX70
EP4SGX110
EP4SGX180
EP4SGX230
128,395,577
171,722,057
241,684,465
47,833,345
47,833,345
94,557,465
94,557,465
128,395,577
171,722,057 (1)
128,395,577
171,722,057 (1)
171,722,057
94,557,465
EP4SGX290
EP4SGX360
EP4SGX530
EP4S40G2
EP4S40G5
EP4S100G2
EP4S100G3
EP4S100G4
EP4S100G5
171,722,057
94,557,465
171,722,057
171,722,057
171,722,057
Note to Table 10–2:
(1) This only applies to the F45 package.
Use the data in Table 10–2 to estimate the file size before design compilation. Different
configuration file formats; for example, a hexidecimal (.hex) or tabular text file (.ttf)
format, have different file sizes. Refer to the Quartus® II software for the different
types of configuration file and file sizes. However, for any specific version of the
Quartus II software, any design targeted for the same device has the same
uncompressed configuration file size. If you are using compression, the file size can
vary after each compilation because the compression ratio depends on the design.
April 2011 Altera Corporation
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Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
Configuration Features
f
For more information about setting device configuration options or creating
configuration files, refer to the Device Configuration Options and Configuration File
Formats chapters in volume 2 of the Configuration Handbook.
Configuration Features
Stratix IV devices offer design security, decompression, and remote system upgrade
features. Design security using configuration bitstream encryption is available in
Stratix IV devices, which protects your designs. Stratix IV devices can receive a
compressed configuration bitstream and decompress this data in real-time, reducing
storage requirements and configuration time. You can make real-time system
upgrades from remote locations of your Stratix IV designs with the remote system
upgrade feature.
Table 10–3 lists which configuration features you can use in each configuration
scheme.
Table 10–3. Configuration Features for Stratix IV Devices
Remote
System
Upgrade
Configuration
Scheme
Design
Security
Configuration Method
Decompression
FPP
MAX II device or a microprocessor with flash memory
Serial configuration device
v (1)
v
v (1)
v
—
v
—
—
—
—
Fast AS
MAX II device or a microprocessor with flash memory
Download cable
v
v
PS
v
v
MAX II device or a microprocessor with flash memory
Download cable
—
—
JTAG
—
—
Note to Table 10–3:
(1) In these modes, the host system must send a DCLKthat is ×4 the data rate.
You can also refer to the following:
■
■
■
For more information about the configuration data decompression feature, refer to
“Configuration Data Decompression” on page 10–47.
For more information about the remote system upgrade feature, refer to “Remote
System Upgrades” on page 10–49.
For more information about the design security feature, refer to “Design Security”
on page 10–63.
If your system already contains a common flash interface (CFI) flash memory, you can
use it for Stratix IV device configuration storage as well. The MAX II parallel flash
loader (PFL) feature in MAX II devices provides an efficient method to program CFI
flash memory devices through the JTAG interface and provides the logic to control
configuration from the flash memory device to the Stratix IV device. Both PS and FPP
configuration modes are supported using this PFL feature.
f
For more information about PFL, refer to Parallel Flash Loader Megafunction User Guide.
For more information about programming Altera serial configuration devices, refer to
“Programming Serial Configuration Devices” on page 10–22.
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Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
10–5
Configuration Features
Power-On Reset Circuit
The POR circuit keeps the entire system in reset until the power supply voltage levels
have stabilized on power-up. After power-up, the device does not release nSTATUS
until VCC, VCCAUX, VCCPT, VCCPGM, and VCCPD are above the device’s POR trip point.
On power down, brown-out occurs if the VCC, VCCAUX, VCCPT, VCCPGM, or VCCPD drops
below the threshold voltage.
In Stratix IV devices, a pin-selectable option (PORSEL)is provided that allows you to
select between the standard POR time or fast POR time. When PORSELis driven low,
the standard POR time is 100 ms < TPOR < 300 ms, which has a lower power-ramp rate.
When PORSELis driven high, the fast POR time is 4 ms < TPOR < 12 ms.
VCCPGM Pins
Stratix IV devices have a power supply, VCCPGM, for all the dedicated configuration
pins and dual function pins. The supported configuration voltage is 1.8, 2.5, and 3.0 V.
Stratix IV devices do not support 1.5 V configuration.
Use the VCCPGM pin to power all dedicated configuration inputs, dedicated
configuration outputs, dedicated configuration bidirectional pins, and some of the
dual functional pins that you use for configuration. With VCCPGM, the configuration
input buffers do not have to share power lines with the regular I/O buffer in
Stratix IV devices.
The operating voltage for the configuration input pin is independent of the I/O banks
power supply VCCIO during configuration. Therefore, Stratix IV devices do not need
configuration voltage constraints on VCCIO
.
VCCPD Pins
Stratix IV devices have a dedicated programming power supply, VCCPD, which must
be connected to 3.0 V/2.5 V to power the I/O pre-drivers and JTAG I/O pins (TCK
TDO, and TRST).
,
TMS, TDI,
1
1
VCCPGM and VCCPD must ramp up from 0 V to the desired voltage level within 100 ms
when PORSELis low or 4 ms when PORSELis high. If these supplies are not ramped up
within this specified time, your Stratix IV device will not configure successfully. If
your system cannot ramp up the power supplies within 100 ms or 4 ms, you must
hold nCONFIGlow until all the power supplies are stable.
V
CCPD must be greater than or equal to VCCIO of the same bank. If VCCIO of the bank is
set to 3.0 V, VCCPD must be powered up to 3.0 V. If the VCCIO of the bank is powered to
2.5 V or lower, VCCPD must be powered up to 2.5 V.
For more information about configuration pins power supply, refer to “Device
Configuration Pins” on page 10–39.
April 2011 Altera Corporation
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Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
Fast Passive Parallel Configuration
Fast Passive Parallel Configuration
Fast passive parallel configuration in Stratix IV devices is designed to meet the
continuously increasing demand for faster configuration times. Stratix IV devices are
designed with the capability of receiving byte-wide configuration data per clock
cycle.
You can perform FPP configuration of Stratix IV devices using an intelligent host,
such as a MAX II device or a microprocessor.
FPP Configuration Using a MAX II Device as an External Host
FPP configuration using compression and an external host provides the fastest
method to configure Stratix IV devices. In this configuration scheme, you can use a
MAX II device as an intelligent host that controls the transfer of configuration data
from a storage device, such as flash memory, to the target Stratix IV device. You can
store configuration data in .rbf, .hex, or .ttf format. When using the MAX II device as
an intelligent host, a design that controls the configuration process, such as fetching
the data from flash memory and sending it to the device, must be stored in the MAX II
device.
1
If you are using the Stratix IV decompression and/or design security features, the
external host must be able to send a DCLKfrequency that is ×4 the data rate.
The ×4 DCLKsignal does not require an additional pin and is sent on the DCLKpin. The
maximum DCLKfrequency is 125 MHz, which results in a maximum data rate of
250 Mbps. If you are not using the Stratix IV decompression or design security
features, the data rate is ×8 the DCLKfrequency.
Figure 10–1 shows the configuration interface connections between the Stratix IV
device and a MAX II device for single device configuration.
Figure 10–1. Single Device FPP Configuration Using an External Host
Memory
V
(1)
V
(1)
CCPGM
CCPGM
ADDR DATA[7..0]
Stratix IV Device
MSEL[2..0]
10 kΩ
10 kΩ
CONF_DONE
nSTATUS
GND
N.C.
nCE
nCEO
External Host
(MAX II Device or
Microprocessor)
GND
DATA[7..0]
nCONFIG
DCLK
Note to Figure 10–1:
(1) Connect the resistor to a supply that provides an acceptable input signal for the Stratix IV device. VCCPGM must be
high enough to meet the VIH specification of the I/O on the device and the external host. Altera recommends powering
up all configuration system I/Os with VCCPGM.
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10–7
Fast Passive Parallel Configuration
After power-up, the Stratix IV device goes through a POR. The POR delay depends on
the PORSELpin setting. When PORSELis driven low, the standard POR time is
100 ms < TPOR < 300 ms. When PORSELis driven high, the fast POR time is
4 ms < TPOR < 12 ms. During POR, the device resets, holds nSTATUSlow, and tri-states
all user I/O pins. After the device successfully exits POR, all user I/O pins continue to
be tri-stated. If nIO_pullupis driven low during power up and configuration, the user
I/O pins and dual-purpose I/O pins have weak pull-up resistors, which are on (after
POR) before and during configuration. If nIO_pullupis driven high, the weak pull-up
resistors are disabled.
The configuration cycle consists of three stages: reset, configuration, and initialization.
While nCONFIGor nSTATUSare low, the device is in the reset stage. To initiate
configuration, the MAX II device must drive the nCONFIGpin from low to high.
1
1
To begin the configuration process, you must fully power VCCPT, VCC, VCCPD, and
V
CCPGM of the banks where the configuration pins reside to the appropriate voltage
levels.
When nCONFIGgoes high, the device comes out of reset and releases the open-drain
nSTATUSpin, which is then pulled high by an external 10-k pull-up resistor. After
nSTATUSis released, the device is ready to receive configuration data and the
configuration stage begins. When nSTATUSis pulled high, the MAX II device places
the configuration data one byte at a time on the DATA[7..0]pins.
Stratix IV devices receive configuration data on the DATA[7..0]pins and the clock is
received on the DCLKpin. Data is latched into the device on the rising edge of DCLK. If
you are using the Stratix IV decompression and/or design security features,
configuration data is latched on the rising edge of every fourth DCLKcycle. After the
configuration data is latched in, it is processed during the following three DCLKcycles.
Therefore, you can only stop DCLKafter three clock cycles after the last data is latched
into the Stratix IV devices.
Data is continuously clocked into the target device until CONF_DONEgoes high. The
CONF_DONEpin goes high one byte early in FPP modes. The last byte is required for
FPP mode. After the device has received the next-to-last byte of the configuration data
successfully, it releases the open-drain CONF_DONEpin, which is pulled high by an
external 10-kpull-up resistor. A low-to-high transition on CONF_DONEindicates
configuration is complete and initialization of the device can begin. The CONF_DONE
pin must have an external 10-k pull-up resistor for the device to initialize.
In Stratix IV devices, the initialization clock source is either the internal oscillator or
the optional CLKUSRpin. By default, the internal oscillator is the clock source for
initialization. If you use the internal oscillator, the Stratix IV device provides itself
with enough clock cycles for proper initialization. Therefore, if the internal oscillator
is the initialization clock source, sending the entire configuration file to the device is
sufficient to configure and initialize the device. Driving DCLKto the device after
configuration is complete does not affect device operation.
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Fast Passive Parallel Configuration
You can also synchronize initialization of multiple devices or delay initialization with
the CLKUSRoption. You can turn on the Enable user-supplied start-up clock
(CLKUSR) option in the Quartus II software from the General tab of the Device and
Pin Options dialog box. Supplying a clock on CLKUSRdoes not affect the configuration
process. The CONF_DONEpin goes high one byte early in FPP modes. The last byte is
required for FPP mode. After the CONF_DONEpin transitions high, CLKUSRis enabled
after the time specified at tCD2CU. After this time period elapses, Stratix IV devices
require 8,532 clock cycles to initialize properly and enter user mode. Stratix IV devices
support a CLKUSRfMAX of 125 MHz.
An optional INIT_DONEpin is available, which signals the end of initialization and the
start of user-mode with a low-to-high transition. This Enable INIT_DONE Output
option is available in the Quartus II software from the General tab of the Device and
Pin Options dialog box. If you use the INIT_DONEpin, it is high because of an external
10-k pull-up resistor when nCONFIGis low and during the beginning of
configuration. After the option bit to enable INIT_DONEis programmed into the device
(during the first frame of configuration data), the INIT_DONEpin goes low. When
initialization is complete, the INIT_DONEpin is released and pulled high. The MAX II
device must be able to detect this low-to-high transition, which signals the device has
entered user mode. When initialization is complete, the device enters user mode. In
user-mode, the user I/O pins no longer have weak pull-up resistors and function as
assigned in your design.
1
Two DCLKfalling edges are required after CONF_DONEgoes high to begin the
initialization of the device for both uncompressed and compressed bitstream in FPP.
To ensure DCLKand DATA[7..0]are not left floating at the end of configuration, the
MAX II device must drive them either high or low, whichever is convenient on your
board. The DATA[7..0]pins are available as user I/O pins after configuration. When
you select the FPP scheme as a default in the Quartus II software, these I/O pins are
tri-stated in user mode. To change this default option in the Quartus II software, select
the Dual-Purpose Pins tab of the Device and Pin Options dialog box.
The configuration clock (DCLK) speed must be below the specified frequency to ensure
correct configuration. No maximum DCLKperiod exists, which means you can pause
configuration by halting DCLKfor an indefinite amount of time.
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Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
10–9
Fast Passive Parallel Configuration
1
If you need to stop DCLK, it can only be stopped:
■
three clock cycles after the last data byte was latched into the Stratix IV device
when you use the decompression and/or design security features.
■
two clock cycles after the last data byte was latched into the Stratix IV device when
you do not use the Stratix IV decompression and/or design security features.
By stopping DCLK, the configuration circuit allows enough clock cycles to process the
last byte of latched configuration data. When the clock restarts, the MAX II device
must provide data on the DATA[7..0]pins prior to sending the first DCLKrising edge.
If an error occurs during configuration, the device drives its nSTATUSpin low, resetting
itself internally. The low signal on the nSTATUSpin also alerts the MAX II device that
there is an error. If the Auto-restart configuration after error option (available in the
Quartus II software from the General tab of the Device and Pin Options dialog box)
is turned on, the device releases nSTATUSafter a reset time-out period (a maximum of
500 s). After nSTATUSis released and pulled high by a pull-up resistor, the MAX II
device can try to reconfigure the target device without needing to pulse nCONFIGlow.
If this option is turned off, the MAX II device must generate a low-to-high transition
(with a low pulse of at least 2 s) on nCONFIGto restart the configuration process.
1
1
If you have enabled the Auto-restart configuration after error option, the nSTATUSpin
transitions from high to low and back again to high when a configuration error is
detected. This appears as a low pulse at the nSTATUSpin with a minimum pulse width
of 10 s to a maximum pulse width of 500 s, as defined in the tSTATUS specification.
The MAX II device can also monitor the CONF_DONEand INIT_DONEpins to ensure
successful configuration. The MAX II device must monitor the CONF_DONEpin to detect
errors and determine when programming completes. If all the configuration data is
sent, but the CONF_DONEor INIT_DONEsignals have not gone high, the MAX II device
reconfigures the target device.
If you use the optional CLKUSRpin and nCONFIGis pulled low to restart the
configuration during device initialization, ensure that CLKUSRcontinues toggling
during the time nSTATUSis low (a maximum of 500 s).
When the device is in user mode, initiating reconfiguration is done by transitioning
the nCONFIGpin low-to-high. The nCONFIGpin must be low for at least 2 s. When
nCONFIGis pulled low, the device also pulls nSTATUSand CONF_DONElow and all I/O
pins are tri-stated. After nCONFIGreturns to a logic high level and nSTATUSis released
by the device, reconfiguration begins.
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Fast Passive Parallel Configuration
Figure 10–2 shows how to configure multiple Stratix IV devices using a MAX II
device. This circuit is similar to the FPP configuration circuit for a single device,
except the devices are cascaded for multi-device configuration.
Figure 10–2. Multi-Device FPP Configuration Using an External Host
Memory
V
(1) V
(1)
CCPGM
CCPGM
ADDR DATA[7..0]
Stratix IV Device 2
MSEL[2..0]
Stratix IV Device 1
MSEL[2..0]
10 kΩ
10 kΩ
CONF_DONE
nSTATUS
CONF_DONE
nSTATUS
GND
GND
N.C.
nCE
nCEO
nCE
nCEO
External Host
(MAX II Device or
Microprocessor)
GND
DATA[7..0]
DATA[7..0]
nCONFIG
DCLK
nCONFIG
DCLK
Note to Figure 10–2:
(1) Connect the pull-up resistor to a supply that provides an acceptable input signal for all Stratix IV devices in the chain. VCCPGM must be high enough
to meet the VIH specification of the I/O standard on the device and the external host. Altera recommends powering up all configuration system
I/Os with VCCPGM.
In a multi-device FPP configuration, the first device’s nCEpin is connected to GND
while its nCEOpin is connected to nCEof the next device in the chain. The last device’s
nCEinput comes from the previous device, while its nCEOpin is left floating. After the
first device completes configuration in a multi-device configuration chain, its nCEOpin
drives low to activate the second device’s nCEpin, which prompts the second device
to begin configuration. The second device in the chain begins configuration within
one clock cycle; therefore, the transfer of data destinations is transparent to the
MAX II device. All other configuration pins (nCONFIG, nSTATUS, DCLK, DATA[7..0], and
CONF_DONE) are connected to every device in the chain. The configuration signals may
require buffering to ensure signal integrity and prevent clock skew problems. Ensure
that the DCLKand DATAlines are buffered for every fourth device. Because all device
CONF_DONEpins are tied together, all devices initialize and enter user mode at the same
time.
All nSTATUSand CONF_DONEpins are tied together; if any device detects an error,
configuration stops for the entire chain and you must reconfigure the entire chain. For
example, if the first device flags an error on nSTATUS, it resets the chain by pulling its
nSTATUSpin low. This behavior is similar to a single device detecting an error.
If the Auto-restart configuration after error option is turned on, the devices release
their nSTATUSpins after a reset time-out period (a maximum of 500 s). After all
nSTATUSpins are released and pulled high, the MAX II device tries to reconfigure the
chain without pulsing nCONFIGlow. If this option is turned off, the MAX II device
must generate a low-to-high transition (with a low pulse of at least 2 s) on nCONFIGto
restart the configuration process.
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10–11
Fast Passive Parallel Configuration
1
If you have enabled the Auto-restart configuration after error option, the nSTATUSpin
transitions from high to low and back again to high when a configuration error is
detected. This appears as a low pulse at the nSTATUSpin with a minimum pulse width
of 10 s to a maximum pulse width of 500 s, as defined in the tSTATUS specification.
In a multi-device FPP configuration chain, all Stratix IV devices in the chain must
either enable or disable the decompression and/or design security features. You
cannot selectively enable the decompression and/or design security features for each
device in the chain because of the DATAand DCLKrelationship. If the chain contains
devices that do not support design security, use a serial configuration scheme.
If a system has multiple devices that contain the same configuration data, tie all
device nCEinputs to GND and leave the nCEOpins floating. All other configuration
pins (nCONFIG, nSTATUS, DCLK, DATA[7..0], and CONF_DONE) are connected to every
device in the chain. Configuration signals may require buffering to ensure signal
integrity and prevent clock skew problems. Ensure that the DCLKand DATAlines are
buffered for every fourth device. Devices must be the same density and package. All
devices start and complete configuration at the same time.
Figure 10–3 shows a multi-device FPP configuration when both Stratix IV devices are
receiving the same configuration data.
Figure 10–3. Multiple-Device FPP Configuration Using an External Host When Both Devices Receive the Same Data
Memory
V
(1) V
(1)
CCPGM
CCPGM
ADDR DATA[7..0]
Stratix IV Device
MSEL[2..0]
Stratix IV Device
10 kΩ
10 kΩ
MSEL[2..0]
GND
GND
CONF_DONE
CONF_DONE
nSTATUS
nCE
nSTATUS
nCEO
nCE
N.C. (2)
nCEO
N.C. (2)
External Host
(MAX II Device or
Microprocessor)
GND
GND
DATA[7..0]
DATA[7..0]
nCONFIG
DCLK
nCONFIG
DCLK
Notes to Figure 10–3:
(1) Connect the resistor to a supply that provides an acceptable input signal for all Stratix IV devices in the chain. VCCPGM must be high enough to
meet the VIH specification of the I/O on the device and the external host. Altera recommends powering up all configuration system I/Os with VCCPGM.
(2) The nCEOpins of both Stratix IV devices are left unconnected when configuring the same configuration data into multiple devices.
You can use a single configuration chain to configure Stratix IV devices with other
Altera devices that support FPP configuration, such as other types of Stratix devices.
To ensure that all devices in the chain complete configuration at the same time, or that
an error flagged by one device initiates reconfiguration in all devices, tie all of the
device CONF_DONEand nSTATUSpins together.
f
For more information about configuring multiple Altera devices in the same
configuration chain, refer to the Configuring Mixed Altera FPGA Chains in volume 2 of
the Configuration Handbook.
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Fast Passive Parallel Configuration
FPP Configuration Timing
Figure 10–4 shows the timing waveform for an FPP configuration when using a
MAX II device as an external host. This waveform shows the timing when you have
not enabled the decompression and design security features.
Figure 10–4. FPP Configuration Timing Waveform (Note 1), (2)
tCF2ST1
tCFG
tCF2CK
nCONFIG
nSTATUS (3)
tSTATUS
tCF2ST0
tCLK
CONF_DONE (4)
t
CH tCL
tCF2CD
tST2CK
(5)
DCLK
tDH
(6)
Byte 0 Byte 1
Byte n-2 Byte n-1 Byte n
DATA[7..0]
Byte 2 Byte 3
User Mode
User Mode
tDSU
High-Z
User I/O
INIT_DONE
tCD2UM
Notes to Figure 10–4:
(1) Use this timing waveform when you have not enabled the decompression and design security features.
(2) The beginning of this waveform shows the device in user mode. In user mode, nCONFIG, nSTATUS, and CONF_DONEare at logic high levels.
When nCONFIGis pulled low, a reconfiguration cycle begins.
(3) After power-up, the Stratix IV device holds nSTATUSlow for the time of the POR delay.
(4) After power-up, before and during configuration, CONF_DONEis low.
(5) Do not leave DCLKfloating after configuration. You can drive it high or low, whichever is more convenient.
(6) DATA[7..0]are available as user I/O pins after configuration except for some exceptions on Stratix IV GT devices. The state of these pins
depends on the dual-purpose pin settings.
Table 10–4 lists the timing parameters for Stratix IV devices for an FPP configuration
when you have not enabled the decompression and design security features.
Table 10–4. FPP Timing Parameters for Stratix IV Devices (Part 1 of 2) (Note 1), (2)
Minimum
Maximum
Symbol
Parameter
Units
Stratix IV Stratix IV Stratix IV Stratix IV Stratix IV Stratix IV
(7)
(8)
(9)
(7)
(8)
(9)
nCONFIGlow to CONF_DONE
low
tCF2CD
—
800
ns
ns
nCONFIGlow to nSTATUS
low
tCF2ST0
—
800
tCFG
nCONFIGlow pulse width
nSTATUSlow pulse width
2
—
s
s
tSTATUS
10
500 (3)
nCONFIGhigh to nSTATUS
high
tCF2ST1
tCF2CK
—
500 (4)
s
s
nCONFIGhigh to first rising
edge on DCLK
500
—
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Fast Passive Parallel Configuration
10–13
Units
Table 10–4. FPP Timing Parameters for Stratix IV Devices (Part 2 of 2) (Note 1), (2)
Minimum
Maximum
Symbol
Parameter
Stratix IV Stratix IV Stratix IV Stratix IV Stratix IV Stratix IV
(7)
(8)
(9)
(7)
(8)
(9)
nSTATUShigh to first rising
edge of DCLK
tST2CK
tDSU
tDH
2
—
s
ns
ns
Data setup time before
rising edge on DCLK
4
1
—
—
Data hold time after rising
edge on DCLK
TR
t
Input rise time
Input fall time
—
—
40
40
ns
ns
CONF_DONEhigh to user
mode (5)
tCD2UM
tCD2CU
55
150
—
s
4 × maximum
CONF_DONEhigh to CLKUSR
enabled
—
DCLKperiod
CONF_DONEhigh to user
tCD2UMC mode with CLKUSRoption
tCD2CU + (8532 × CLKUSR
—
—
period)
on
tCH
DCLKhigh time (6)
DCLKlow time (6)
DCLK period (6)
DCLKfrequency
3.6
3.6
8
4.5
4.5
10
5.6
5.6
—
—
ns
ns
tCL
tCLK
fMAX
12.5
—
ns
—
125
100
80
MHz
Notes to Table 10–4:
(1) This information is preliminary.
(2) Use these timing parameters when you have not enabled the decompression and design security features.
(3) You can obtain this value if you do not delay the configuration by extending the nCONFIGor nSTATUSlow pulse width.
(4) This value is applicable if you do not delay the configuration by externally holding nSTATUSlow.
(5) The minimum and maximum numbers apply only if you chose the internal oscillator as the clock source for starting the device.
(6) Adding up tCH and tCL equals to tCLK. When EP4SE230 tCH is 3.6 ns (min), tCL must be 4.4 ns and vice versa.
(7) Applicable to EP4SE230, EP4SE360, EP4SGX70, EP4SGX110, EP4SGX180, EP4SGX230, EP4SGX290 (except F45 package), EP4SGX360 (except
F45 package), EP4S40G2, EP4S100G2 devices.
(8) Applicable to EP4SE530, EP4SGX290 (only for F45 package), EP4SGX360 (only for F45 package), EP4SGX530, EP4S40G5, EP4S100G3,
EP4S100G4, EP4S100G5 devices.
(9) Applicable to EP4SE820 only.
April 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
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Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
Fast Passive Parallel Configuration
Figure 10–5 shows the timing waveform for an FPP configuration when using a
MAX II device as an external host. This waveform shows the timing when you have
enabled the decompression and/or design security features.
Figure 10–5. FPP Configuration Timing Waveform with Decompression or Design Security Feature Enabled (Note 1), (2)
tCF2ST1
tCFG
tCF2CK
nCONFIG
nSTATUS (3)
tSTATUS
tCF2ST0
CONF_DONE (4)
t
CL
tCF2CD
tST2CK
t
CH
DCLK
(7)
(5)
(6)
1
1
2
3
4
1
2
3
4
3
4
t
CLK
Byte 0
Byte 1
User Mode
User Mode
Byte (n-1) Byte n
DATA[7..0]
Byte 2
t
t
tDSU
DH
DH
High-Z
User I/O
INIT_DONE
tCD2UM
Notes to Figure 10–5:
(1) Use this timing waveform when you have enabled the decompression and/or design security features.
(2) The beginning of this waveform shows the device in user-mode. In user-mode, nCONFIG, nSTATUS, and CONF_DONEare at logic high levels.
When nCONFIGis pulled low, a reconfiguration cycle begins.
(3) After power-up, the Stratix IV device holds nSTATUSlow for the time of the POR delay.
(4) After power-up, before and during configuration, CONF_DONEis low.
(5) Do not leave DCLKfloating after configuration. You can drive it high or low, whichever is more convenient.
(6) DATA[7..0]are available as user I/O pins after configuration except for some exceptions on Stratix IV GT devices. The state of these pins
depends on the dual-purpose pin settings.
(7) If needed, you can pause DCLKby holding it low. When DCLKrestarts, the external host must provide data on the DATA[7..0]pins prior to
sending the first DCLKrising edge.
Table 10–5 lists the timing parameters for Stratix IV devices for an FPP configuration
when you enable the decompression and/or the design security features.
Table 10–5. FPP Timing Parameters for Stratix IV Devices with the Decompression and/or Design Security Features
Enabled (Note 1), (2) (Part 1 of 2)
Minimum
Maximum
Symbol
Parameter
Units
Stratix IV Stratix IV Stratix IV StratixIV StratixIV StratixIV
(7)
(8)
(9)
(7)
(8)
(9)
nCONFIGlow to CONF_DONE
low
tCF2CD
—
800
ns
tCF2ST0
tCFG
nCONFIGlow to nSTATUSlow
nCONFIGlow pulse width
nSTATUSlow pulse width
—
2
800
—
ns
s
s
tSTATUS
10
500 (3)
nCONFIGhigh to nSTATUS
high
tCF2ST1
tCF2CK
—
500 (4)
s
s
nCONFIGhigh to first rising
edge on DCLK
500
—
Stratix IV Device Handbook Volume 1
April 2011 Altera Corporation
Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
10–15
Fast Passive Parallel Configuration
Table 10–5. FPP Timing Parameters for Stratix IV Devices with the Decompression and/or Design Security Features
Enabled (Note 1), (2) (Part 2 of 2)
Minimum
Maximum
Symbol
Parameter
Units
Stratix IV Stratix IV Stratix IV StratixIV StratixIV StratixIV
(7)
(8)
(9)
(7)
(8)
(9)
nSTATUShigh to first rising
edge of DCLK
tST2CK
tDSU
tDH
2
—
s
ns
s
Data setup time before rising
edge on DCLK
4
—
—
Data hold time after rising
edge on DCLK
3/(DCLKfrequency) + 1
tDATA
Data rate
—
—
—
250
40
Mbps
ns
tR
t
Input rise time
Input fall time
40
ns
CONF_DONEhigh to user mode
(5)
tCD2UM
tCD2CU
55
150
—
s
—
—
4 × maximum
CONF_DONEhigh to CLKUSR
enabled
DCLKperiod
CONF_DONEhigh to user mode
with CLKUSRoption on (5)
tCD2UMC
t
CD2CU + (8532 × CLKUSRperiod)
—
tCH
DCLKhigh time (6)
DCLKlow time (6)
DCLKperiod (6)
DCLKfrequency
3.6
3.6
8
4.5
4.5
10
5.6
5.6
—
—
ns
ns
tCL
tCLK
fMAX
12.5
—
ns
—
125
100
80
MHz
Notes to Table 10–5:
(1) This information is preliminary.
(2) Use these timing parameters when you use the decompression and/or design security features.
(3) You can obtain this value if you do not delay the configuration by extending the nCONFIGor nSTATUSlow pulse width.
(4) This value is applicable if you do not delay the configuration by externally holding nSTATUSlow.
(5) The minimum and maximum numbers apply only if you chose the internal oscillator as the clock source for starting the device.
(6) Adding up tCH and tCL equals to tCLK. When EP4SE230 tCH is 3.6 ns (min), tCL must be 4.4 ns and vice versa.
(7) Applicable for EP4SE230, EP4SE360, EP4SGX70, EP4SGX110, EP4SGX180, EP4SGX230, EP4SGX290 (except F45 package), EP4SGX360 (except
F45 package), EP4S40G2, EP4S100G2 devices.
(8) Applicable for EP4SE530, EP4SGX290 (only for F45 package), EP4SGX360 (only for F45 package), EP4SGX530, EP4S40G5, EP4S100G3,
EP4S100G4, EP4S100G5 devices.
(9) Applicable to EP4SE820 only.
f
For more information about device configuration options and how to create
configuration files, refer to the Device Configuration Options and Configuration File
Formats chapters in volume 2 of the Configuration Handbook.
April 2011 Altera Corporation
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Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
Fast Active Serial Configuration (Serial Configuration Devices)
FPP Configuration Using a Microprocessor
In this configuration scheme, a microprocessor can control the transfer of
configuration data from a storage device, such as flash memory, to the target
Stratix IV device.
All information in “FPP Configuration Using a MAX II Device as an External Host”
on page 10–6 is also applicable when using a microprocessor as an external host. Refer
to this section for all configuration and timing information.
Fast Active Serial Configuration (Serial Configuration Devices)
In the fast AS configuration scheme, Stratix IV devices are configured using a serial
configuration device. These configuration devices are low-cost devices with
non-volatile memory that feature a simple four-pin interface and a small form factor.
The largest serial configuration device currently supports 128 MBits of configuration
bitstream. Use the Stratix IV decompression features or select an FPP or PS
configuration scheme for EP4SE360, EP4SGX290, EP4S40G5, EP4S100G3 and larger
devices.
f
1
For more information about serial configuration devices, refer to the Serial
Configuration Devices (EPCS1, EPCS4, EPCS16, EPCS64, and EPCS128) Data Sheet
chapter in volume 2 of the Configuration Handbook.
Serial configuration devices provide a serial interface to access configuration data.
During device configuration, Stratix IV devices read configuration data using the
serial interface, decompress data if necessary, and configure their SRAM cells. This
scheme is referred to as the AS configuration scheme because the Stratix IV device
controls the configuration interface. This scheme contrasts with the PS configuration
scheme where the configuration device controls the interface.
The Stratix IV decompression and design security features are fully available when
configuring your Stratix IV device using fast AS mode.
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10–17
Fast Active Serial Configuration (Serial Configuration Devices)
Serial configuration devices have a four-pin interface—serial clock input (DCLK), serial
data output (DATA), AS data input (ASDI), and an active-low chip select (nCS). This
four-pin interface connects to Stratix IV device pins, as shown in Figure 10–6.
Figure 10–6. Single Device Fast AS Configuration
V
V
V
CCPGM (1)
CCPGM (1)
CCPGM (1)
10 kΩ
10 kΩ
10 kΩ
Serial Configuration
Device
Stratix IV Device
nSTATUS
CONF_DONE
nCONFIG
nCE
nCEO
N.C.
GND
V
CCPGM
DATA
DATA0
DCLK
nCSO
ASDO
DCLK
nCS
MSEL2
MSEL1
MSEL0
ASDI
(2)
GND
Notes to Figure 10–6:
(1) Connect the pull-up resistors to VCCPGM at a 3.0-V supply.
(2) Stratix IV devices use the ASDO-to-ASDIpath to control the configuration device.
You can power the EPCS serial configuration device with 3.0 V when you configure
the Stratix IV FPGA using Active Serial (AS) configuration mode. This is feasible
because the power supply to the EPCS device ranges between 2.7 V and 3.6 V. You do
not need a dedicated 3.3 V power supply to power the EPCS device. The EPCS device
and the VCCPGMpins on the Stratix IV device may share the same 3.0 V power supply.
After power-up, the Stratix IV devices go through a POR. The POR delay depends on
the PORSELpin setting. When PORSELis driven low, the standard POR time is
100 ms < TPOR < 300 ms. When PORSELis driven high, the fast POR time is
4 ms < TPOR < 12 ms. During POR, the device resets, holds nSTATUSand CONF_DONE
low, and tri-states all user I/O pins. After the device successfully exits POR, all the
user I/O pins continue to be tri-stated. If nIO_pullupis driven low during power-up
and configuration, the user I/O pins and dual-purpose I/O pins will have weak
pull-up resistors, which are on (after POR) before and during configuration. If
nIO_pullupis driven high, the weak pull-up resistors are disabled.
The configuration cycle consists of three stages—reset, configuration, and
initialization. While nCONFIGor nSTATUSare low, the device is in reset. After POR, the
Stratix IV device releases nSTATUS, which is pulled high by an external 10-k pull-up
resistor and enters configuration mode.
1
To begin configuration, power the VCC, VCCIO, VCCPGM, and VCCPD voltages (for the
banks where the configuration pins reside) to the appropriate voltage levels.
The serial clock (DCLK) generated by the Stratix IV device controls the entire
configuration cycle and provides timing for the serial interface. Stratix IV devices use
an internal oscillator to generate DCLK. Using the MSEL[]pins, you can select to use a
40 MHz oscillator.
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Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
Fast Active Serial Configuration (Serial Configuration Devices)
In fast AS configuration schemes, Stratix IV devices drive out control signals on the
falling edge of DCLK. The serial configuration device responds to the instructions by
driving out configuration data on the falling edge of DCLK. Then the data is latched
into the Stratix IV device on the following falling edge of DCLK
.
In configuration mode, Stratix IV devices enable the serial configuration device by
driving the nCSOoutput pin low, which connects to the chip select (nCS) pin of the
configuration device. The Stratix IV device uses the serial clock (DCLK) and serial data
output (ASDO) pins to send operation commands and/or read address signals to the
serial configuration device. The configuration device provides data on its serial data
output (DATA) pin, which connects to the DATA0input of the Stratix IV devices.
After all the configuration bits are received by the Stratix IV device, it releases the
open-drain CONF_DONEpin, which is pulled high by an external 10-k resistor.
Initialization begins only after the CONF_DONEsignal reaches a logic high level. All AS
configuration pins (DATA0, DCLK, nCSO, and ASDO) have weak internal pull-up resistors
that are always active. After configuration, these pins are set as input tri-stated and
are driven high by the weak internal pull-up resistors. The CONF_DONEpin must have
an external 10-k pull-up resistor in order for the device to initialize.
In Stratix IV devices, the initialization clock source is either the internal oscillator or
the optional CLKUSRpin. By default, the internal oscillator is the clock source for
initialization. If you use the internal oscillator, the Stratix IV device provides itself
with enough clock cycles for proper initialization. You also have the flexibility to
synchronize initialization of multiple devices or to delay initialization with the CLKUSR
option. You can turn on the Enable user-supplied start-up clock (CLKUSR) option in
the Quartus II software from the General tab of the Device and Pin Options dialog
box. When you select the Enable user supplied start-up clock option, the CLKUSRpin
is the initialization clock source. Supplying a clock on CLKUSRdoes not affect the
configuration process. After all configuration data is accepted and CONF_DONEgoes
high, CLKUSRis enabled after four clock cycles of DCLK. After this time period elapses,
Stratix IV devices require 8,532 clock cycles to initialize properly and enter user mode.
Stratix IV devices support a CLKUSRfMAX of 125 MHz.
An optional INIT_DONEpin is available, which signals the end of initialization and the
start of user-mode with a low-to-high transition. The Enable INIT_DONE Output
option is available in the Quartus II software from the General tab of the Device and
Pin Options dialog box. If you use the INIT_DONEpin, it is high due to an external
10-k pull-up resistor when nCONFIGis low and during the beginning of
configuration. After the option bit to enable INIT_DONEis programmed into the device
(during the first frame of configuration data), the INIT_DONEpin goes low. When
initialization is complete, the INIT_DONEpin is released and pulled high. This
low-to-high transition signals that the device has entered user mode. When
initialization is complete, the device enters user mode. In user mode, the user I/O
pins no longer have weak pull-up resistors and function as assigned in your design.
If an error occurs during configuration, Stratix IV devices assert the nSTATUSsignal
low, indicating a data frame error, and the CONF_DONEsignal stays low. If the
Auto-restart configuration after error option (available in the Quartus II software
from the General tab of the Device and Pin Options dialog box) is turned on, the
Stratix IV device resets the configuration device by pulsing nCSO, releases nSTATUS
after a reset time-out period (a maximum of 500 µs), and retries configuration. If this
option is turned off, the system must monitor nSTATUSfor errors and then pulse
nCONFIGlow for at least 2 s to restart configuration.
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10–19
Fast Active Serial Configuration (Serial Configuration Devices)
1
If you have enabled the Auto-restart configuration after error option, the nSTATUSpin
transitions from high to low and back again to high when a configuration error is
detected. This appears as a low pulse at the nSTATUSpin with a minimum pulse width
of 10 s to a maximum pulse width of 500 s, as defined in the tSTATUS specification.
When the Stratix IV device is in user mode, you can initiate reconfiguration by pulling
the nCONFIGpin low. The nCONFIGpin must be low for at least 2 s. When nCONFIGis
pulled low, the device also pulls nSTATUSand CONF_DONElow and all I/O pins are
tri-stated. After nCONFIGreturns to a logic high level and nSTATUSis released by the
Stratix IV device, reconfiguration begins.
1
If you wish to gain control of the EPCS pins, hold the nCONFIGpin low and pull the
nCEpin high. This causes the device to reset and tri-state the AS configuration pins.
The timing parameters for AS mode are not listed here because the tCF2CD, tCF2ST0, tCFG
STATUS, tCF2ST1, and tCD2UM timing parameters are identical to the timing parameters
,
t
for PS mode listed in Table 10–7 on page 10–30.
You can configure multiple Stratix IV devices using a single serial configuration
device. You can cascade multiple Stratix IV devices using the chip-enable (nCE) and
chip-enable-out (nCEO) pins. The first device in the chain must have its nCEpin
connected to GND. You must connect its nCEOpin to the nCEpin of the next device in
the chain. When the first device captures all of its configuration data from the
bitstream, it drives the nCEOpin low, enabling the next device in the chain. You must
leave the nCEOpin of the last device unconnected. The nCONFIG, nSTATUS, CONF_DONE,
DCLK, and DATA0pins of each device in the chain are connected (refer to Figure 10–7).
The first Stratix IV device in the chain is the configuration master and controls
configuration of the entire chain. You must connect its MSELpins to select the AS
configuration scheme. The remaining Stratix IV devices are configuration slaves. You
must connect their MSELpins to select the PS configuration scheme. Any other Altera
device that supports PS configuration can also be part of the chain as a configuration
slave.
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Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
Fast Active Serial Configuration (Serial Configuration Devices)
Figure 10–7 shows the pin connections for the multi-device fast AS configuration.
Figure 10–7. Multi-Device Fast AS Configuration
V
V
V
CCPGM (1)
CCPGM (1) CCPGM (1)
10 kΩ
10 kΩ
10 kΩ
Serial Configuration
Device
Stratix IV Device Master
Stratix IV Device Slave
nSTATUS
nSTATUS
CONF_DONE
CONF_DONE
nCEO
N.C.
nCONFIG
nCONFIG
nCE
nCEO
nCE
GND
V
CCPGM
V
CCPGM
DATA
DATA0
DCLK
nCSO
ASDO
DATA0
DCLK
MSEL2
MSEL1
MSEL0
MSEL2
MSEL1
MSEL0
DCLK
nCS
ASDI
GND
GND
Buffers (2)
Notes to Figure 10–7:
(1) Connect the pull-up resistors to VCCPGM at a 3.0-V supply.
(2) Connect the repeater buffers between the Stratix IV master and slave device(s) for DATA[0]and DCLK. This is to prevent potential signal
integrity and clock skew problems.
As shown in Figure 10–7, the nSTATUSand CONF_DONEpins on all target devices are
connected together with external pull-up resistors. These pins are open-drain
bidirectional pins on the devices. When the first device asserts nCEO(after receiving all
of its configuration data), it releases its CONF_DONEpin. But the subsequent devices in
the chain keep this shared CONF_DONEline low until they have received their
configuration data. When all target devices in the chain have received their
configuration data and have released CONF_DONE, the pull-up resistor drives a high
level on this line and all devices simultaneously enter initialization mode.
If an error occurs at any point during configuration, the nSTATUSline is driven low by
the failing device. If you enable the Auto-restart configuration after error option,
reconfiguration of the entire chain begins after a reset time-out period (a maximum of
500 s). If you did not enable the Auto-restart configuration after error option, the
external system must monitor nSTATUSfor errors and then pulse nCONFIGlow to
restart configuration. The external system can pulse nCONFIGif it is under system
control rather than tied to VCCGPM
.
1
If you have enabled the Auto-restart configuration after error option, the nSTATUSpin
transitions from high to low and back again to high when a configuration error is
detected. This appears as a low pulse at the nSTATUSpin with a minimum pulse width
of 10 s to a maximum pulse width of 500 s, as defined in the tSTATUS specification.
Stratix IV Device Handbook Volume 1
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Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
10–21
Fast Active Serial Configuration (Serial Configuration Devices)
1
While you can cascade Stratix IV devices, you cannot cascade or chain together serial
configuration devices.
If the configuration bitstream size exceeds the capacity of a serial configuration
device, you must select a larger configuration device and/or enable the compression
feature. When configuring multiple devices, the size of the bitstream is the sum of the
individual device configuration bitstreams.
A system may have multiple devices that contain the same configuration data. In
active serial chains, you can implement this by storing one copy of the .sof in the
serial configuration device. The same copy of the .sof configures the master Stratix IV
device and all remaining slave devices concurrently. All Stratix IV devices must be the
same density and package.
To configure four identical Stratix IV devices with the same .sof, set up the chain as
shown in Figure 10–8. The first device is the master device and its MSELpins must be
set to select AS configuration. The other three slave devices are set up for concurrent
configuration and their MSELpins must be set to select PS configuration. The nCEinput
pins from the master and slave are connected to GND, and the DATAand DCLKpins
connect in parallel to all four devices. During the configuration cycle, the master
device reads its configuration data from the serial configuration device and transmits
the configuration data to all three slave devices, configuring all of them
simultaneously.
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Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
Fast Active Serial Configuration (Serial Configuration Devices)
Figure 10–8 shows the multi-device fast AS configuration when the devices receive
the same data using a single .sof.
Figure 10–8. Multi-Device Fast AS Configuration When the Devices Receive the Same Data Using a Single .sof
Stratix IV
Device Slave
nSTATUS
CONF_DONE
nCEO
N.C.
nCONFIG
nCE
V
V
V
CCPGM (1) CCPGM (1) CCPGM (1)
V
DATA0
DCLK
CCPGM
MSEL2
MSEL1
MSEL0
10 kΩ
10 kΩ
10 kΩ
GND
Serial Configuration
Device
Stratix IV
Device Master
Stratix IV
Device Slave
nSTATUS
nSTATUS
CONF_DONE
CONF_DONE
nCEO
N.C.
nCONFIG
nCONFIG
nCE
nCEO
nCE
N.C.
GND
CCPGM
GND
V
DATA
DCLK
nCS
DATA0
V
DATA0
DCLK
CCPGM
MSEL2
MSEL1
MSEL0
MSEL2
MSEL1
MSEL0
DCLK
nCSO
ASDO
ASDI
GND
GND
Stratix IV
Device Slave
nSTATUS
CONF_DONE
Buffers (2)
nCEO
N.C.
nCONFIG
nCE
V
DATA0
DCLK
CCPGM
MSEL2
MSEL1
MSEL0
GND
Notes to Figure 10–8:
(1) Connect the pull-up resistors to VCCPGM at a 3.0-V supply.
(2) Connect the repeater buffers between the Stratix IV master and slave device(s) for DATA[0]and DCLK. This is to prevent potential signal
integrity and clock skew problems.
Estimating Active Serial Configuration Time
Active serial configuration time is dominated by the time it takes to transfer data from
the serial configuration device to the Stratix IV device. This serial interface is clocked
by the Stratix IV DCLKoutput (generated from an internal oscillator) and must be set to
40 MHz (25 ns).Therefore, the minimum configuration time estimate for an EP4SE230
device (94, 600, 000 bits of uncompressed data) is:
RBF Size × (minimum DCLKperiod / 1 bit per DCLKcycle) = estimated minimum
configuration time
94, 600, 000 bits × (25 ns / 1 bit) = 2365 ms
1
The calculation above is based on a preliminary uncompressed .rbf size. The final .rbf
size will be available after the Quartus II software is able to generate the .rbf.
Enabling compression reduces the amount of configuration data that is transmitted to
the Stratix IV device, which also reduces configuration time. On average, compression
reduces configuration time, depending on the design.
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Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
10–23
Fast Active Serial Configuration (Serial Configuration Devices)
Programming Serial Configuration Devices
Serial configuration devices are non-volatile, flash-memory-based devices. You can
program these devices in-system using the USB-Blaster™, EthernetBlaster™, or
ByteBlaster™ II download cable. Alternatively, you can program them using the
Altera programming unit (APU), supported third-party programmers, or a
microprocessor with the SRunner software driver.
You can perform in-system programming of serial configuration devices using the
conventional AS programming interface or the JTAG interface solution.
Because serial configuration devices do not support the JTAG interface, the
conventional method to program them is using the AS programming interface. The
configuration data used to program serial configuration devices is downloaded using
programming hardware.
During in-system programming, the download cable disables device access to the AS
interface by driving the nCEpin high. Stratix IV devices are also held in reset by a low
level on nCONFIG. After programming is complete, the download cable releases nCE
and nCONFIG, allowing the pull-down and pull-up resistors to drive GND and VCCPGM
respectively. Figure 10–9 shows the download cable connections for the serial
configuration device.
,
Altera has developed Serial FlashLoader (SFL), an in-system programming solution
for serial configuration devices using the JTAG interface. This solution requires the
Stratix IV device to be a bridge between the JTAG interface and the serial
configuration device.
f
For more information about SFL, refer to AN 370: Using the Serial FlashLoader with
Quartus II Software.
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Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
Fast Active Serial Configuration (Serial Configuration Devices)
f
For more information about the USB-Blaster download cable, refer to the USB-Blaster
Download Cable User Guide. For more information about the ByteBlaster II cable, refer
to the ByteBlaster II Download Cable User Guide. For more information about the
EthernetBlaster download cable, refer to the EthernetBlaster Communications Cable User
Guide.
Figure 10–9. In-System Programming of Serial Configuration Devices
V
V
V
CCPGM (1) CCPGM (1) CCPGM (1)
10 kΩ
10 kΩ
10 kΩ
Stratix IV Device
CONF_DONE
nCEO
N.C.
nSTATUS
Serial
Configuration
Device
nCONFIG
nCE
10 kΩ
V
DATA
DCLK
nCS
DATA0
DCLK
nCSO
ASDO
CCPGM
MSEL2
MSEL1
MSEL0
ASDI
GND
V
Pin 1
(2)
CCPGM
USB Blaster or ByteBlaser II
(AS Mode)
10-Pin Male Header
Notes to Figure 10–9:
(1) Connect these pull-up resistors to VCCPGM at a 3.0-V supply.
(2) Power up the USB-ByteBlaster, ByteBlaster II, or EthernetBlaster cable’s VCC(TRGT) with VCCPGM
.
You can program serial configuration devices with the Quartus II software using the
Altera programming hardware and the appropriate configuration device
programming adapter.
In production environments, you can program serial configuration devices using
multiple methods. You can use Altera programming hardware or other third-party
programming hardware to program blank serial configuration devices before they are
mounted on PCBs. Alternatively, you can use an on-board microprocessor to program
the serial configuration device in-system using C-based software drivers provided by
Altera.
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April 2011 Altera Corporation
Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
10–25
Passive Serial Configuration
You can program a serial configuration device in-system by an external
microprocessor using SRunner. SRunner is a software driver developed for embedded
serial configuration device programming, which can be easily customized to fit in
different embedded systems. SRunner is able to read raw programming data (.rpd)
and write to serial configuration devices. The serial configuration device
programming time using SRunner is comparable to the programming time with the
Quartus II software.
f
f
For more information about SRunner, refer to AN 418: SRunner: An Embedded Solution
for Serial Configuration Device Programming and the source code on the Altera website
at www.altera.com.
For more information about programming serial configuration devices, refer to the
Serial Configuration Devices (EPCS1, EPCS4, EPCS16, EPCS64, and EPCS128) Data Sheet
chapter in volume 2 of the Configuration Handbook.
Guidelines for Connecting Serial Configuration Devices on an AS Interface
For single- and multi-device AS configurations, the board trace length and loading
between the supported serial configuration device and the Stratix IV device family
must follow the recommendations listed in Table 10–6.
Table 10–6. Maximum Trace Length and Loading for the AS Configuration
Maximum Board Trace Length
from the Stratix IV Device to
Stratix IV Device AS Pins
Maximum Board Load (pF)
the Serial Configuration
Device (Inches)
DCLK
10
10
10
10
15
30
30
30
DATA[0]
nCSO
ASDO
Passive Serial Configuration
You can program a PS configuration for Stratix IV devices using an intelligent host,
such as a MAX II device or microprocessor with flash memory, or a download cable.
In the PS scheme, an external host (a MAX II device, embedded processor, or host PC)
controls configuration. Configuration data is clocked into the target Stratix IV device
using the DATA0pin at each rising edge of DCLK
.
1
The Stratix IV decompression and design security features are fully available when
configuring your Stratix IV device using PS mode.
April 2011 Altera Corporation
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Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
Passive Serial Configuration
PS Configuration Using a MAX II Device as an External Host
In this configuration scheme, you can use a MAX II device as an intelligent host that
controls the transfer of configuration data from a storage device, such as flash
memory, to the target Stratix IV device. You can store configuration data in .rbf, .hex,
or .ttf format.
Figure 10–10 shows the configuration interface connections between a Stratix IV
device and a MAX II device for single device configuration.
Figure 10–10. Single Device PS Configuration Using an External Host
Memory
V
V
CCPGM (1)
CCPGM (1)
ADDR
DATA0
Stratix IV Device
10 kΩ
10 kΩ
CONF_DONE
nSTATUS
nCE
nCEO
N.C.
External Host
(MAX II Device or
Microprocessor)
GND
V
CCPGM
MSEL2
MSEL1
MSEL0
DATA0
nCONFIG
DCLK
GND
Note to Figure 10–10:
(1) Connect the resistor to a supply that provides an acceptable input signal for the Stratix IV device. VCCPGM must be
high enough to meet the VIH specification of the I/O on the device and the external host. Altera recommends powering
up all configuration system I/Os with VCCPGM
.
After power-up, Stratix IV devices go through a POR. The POR delay depends on the
PORSELpin setting. When PORSELis driven low, the standard POR time is
100 ms < TPOR < 300 ms. When PORSELis driven high, the fast POR time is
4 ms < TPOR < 12 ms. During POR, the device resets, holds nSTATUSlow, and tri-states
all user I/O pins. After the device successfully exits POR, all user I/O pins continue to
be tri-stated. If nIO_pullupis driven low during power-up and configuration, the user
I/O pins and dual-purpose I/O pins will have weak pull-up resistors that are on
(after POR) before and during configuration. If nIO_pullupis driven high, the weak
pull-up resistors are disabled.
The configuration cycle consists of three stages—reset, configuration, and
initialization. While nCONFIGor nSTATUSare low, the device is in reset. To initiate
configuration, the MAX II device must generate a low-to-high transition on the
nCONFIGpin.
1
V
CC, VCCIO, VCCPGM, and VCCPD of the banks where the configuration pins reside must
be fully powered to the appropriate voltage levels to begin the configuration process.
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Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
10–27
Passive Serial Configuration
When nCONFIGgoes high, the device comes out of reset and releases the open-drain
nSTATUSpin, which is then pulled high by an external 10-k pull-up resistor. After
nSTATUSis released, the device is ready to receive configuration data and the
configuration stage begins. When nSTATUSis pulled high, the MAX II device places
the configuration data one bit at a time on the DATA0pin. If you are using
configuration data in .rbf, .hex, or .ttf format, you must send the LSB of each data byte
first. For example, if the .rbf contains the byte sequence 02 1B EE 01 FA, the serial
bitstream you must transmit to the device is
0100-0000 1101-1000 0111-0111 1000-0000 0101-1111
.
The Stratix IV device receives configuration data on the DATA0pin and the clock is
received on the DCLKpin. Data is latched into the device on the rising edge of DCLK
.
Data is continuously clocked into the target device until CONF_DONEgoes high. After
the device has received all configuration data successfully, it releases the open-drain
CONF_DONEpin, which is pulled high by an external 10-kpull-up resistor. A
low-to-high transition on CONF_DONEindicates configuration is complete and
initialization of the device can begin. The CONF_DONEpin must have an external 10-k
pull-up resistor for the device to initialize.
In Stratix IV devices, the initialization clock source is either the internal oscillator or
the optional CLKUSRpin. By default, the internal oscillator is the clock source for
initialization. If you use the internal oscillator, the Stratix IV device provides itself
with enough clock cycles for proper initialization. Therefore, if the internal oscillator
is the initialization clock source, sending the entire configuration file to the device is
sufficient to configure and initialize the device. Driving DCLKto the device after
configuration is complete does not affect device operation.
You also have the flexibility to synchronize initialization of multiple devices or to
delay initialization with the CLKUSRoption. You can turn on the Enable user-supplied
start-up clock (CLKUSR) option in the Quartus II software from the General tab of
the Device and Pin Options dialog box. If you supply a clock on CLKUSR, it will not
affect the configuration process. After all configuration data has been accepted and
CONF_DONEgoes high, CLKUSRis enabled after the time specified at tCD2CU. After this
time period elapses, Stratix IV devices require 8,532 clock cycles to initialize properly
and enter user mode. Stratix IV devices support a CLKUSRfMAX of 125 MHz.
An optional INIT_DONEpin is available that signals the end of initialization and the
start of user-mode with a low-to-high transition. The Enable INIT_DONE Output
option is available in the Quartus II software from the General tab of the Device and
Pin Options dialog box. If you use the INIT_DONEpin, it is high due to an external
10-k pull-up resistor when nCONFIGis low and during the beginning of
configuration. After the option bit to enable INIT_DONEis programmed into the device
(during the first frame of configuration data), the INIT_DONEpin goes low. When
initialization is complete, the INIT_DONEpin is released and pulled high. The MAX II
device must be able to detect this low-to-high transition that signals the device has
entered user mode. When initialization is complete, the device enters user mode. In
user-mode, the user I/O pins no longer have weak pull-up resistors and function as
assigned in your design.
1
Two DCLKfalling edges are required after CONF_DONEgoes high to begin the
initialization of the device for both uncompressed and compressed bitstream in PS.
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Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
Passive Serial Configuration
To ensure DCLKand DATA0are not left floating at the end of configuration, the MAX II
device must drive them either high or low, whichever is convenient on your board.
The DATA[0]pin is available as a user I/O pin after configuration. When you chose the
PS scheme as a default in the Quartus II software, this I/O pin is tri-stated in user
mode and must be driven by the MAX II device. To change this default option in the
Quartus II software, select the Dual-Purpose Pins tab of the Device and Pin Options
dialog box.
The configuration clock (DCLK) speed must be below the specified frequency to ensure
correct configuration. No maximum DCLKperiod exists, which means you can pause
the configuration by halting DCLKfor an indefinite amount of time.
If an error occurs during configuration, the device drives its nSTATUSpin low, resetting
itself internally. The low signal on the nSTATUSpin also alerts the MAX II device that
there is an error. If the Auto-restart configuration after error option (available in the
Quartus II software from the General tab of the Device and Pin Options dialog box)
is turned on, the Stratix IV device releases nSTATUSafter a reset time-out period (a
maximum of 500 s). After nSTATUSis released and pulled high by a pull-up resistor,
the MAX II device can try to reconfigure the target device without needing to pulse
nCONFIGlow. If this option is turned off, the MAX II device must generate a
low-to-high transition (with a low pulse of at least 2 s) on nCONFIGto restart the
configuration process.
1
1
If you have enabled the Auto-restart configuration after error option, the nSTATUSpin
transitions from high to low and back again to high when a configuration error is
detected. This appears as a low pulse at the nSTATUSpin with a minimum pulse width
of 10 s to a maximum pulse width of 500 s, as defined in the tSTATUS specification.
The MAX II device can also monitor the CONF_DONEand INIT_DONEpins to ensure
successful configuration. The CONF_DONEpin must be monitored by the MAX II device
to detect errors and determine when programming completes. If all configuration
data is sent, but CONF_DONEor INIT_DONEhave not gone high, the MAX II device must
reconfigure the target device.
If you use the optional CLKUSRpin and nCONFIGis pulled low to restart configuration
during device initialization, you must ensure that CLKUSRcontinues toggling during
the time nSTATUSis low (a maximum of 500 s).
When the device is in user-mode, you can initiate a reconfiguration by transitioning
the nCONFIGpin low-to-high. The nCONFIGpin must be low for at least 2 s. When
nCONFIGis pulled low, the device also pulls nSTATUSand CONF_DONElow and all I/O
pins are tri-stated. After nCONFIGreturns to a logic high level and nSTATUSis released
by the device, reconfiguration begins.
Stratix IV Device Handbook Volume 1
April 2011 Altera Corporation
Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
10–29
Passive Serial Configuration
Figure 10–11 shows how to configure multiple devices using a MAX II device. This
circuit is similar to the PS configuration circuit for a single device, except the Stratix IV
devices are cascaded for multi-device configuration.
Figure 10–11. Multi-Device PS Configuration Using an External Host
Memory
V
V
CCPGM (1) CCPGM (1)
ADDR
DATA0
Stratix IV Device 1
Stratix IV Device 2
CONF_DONE
10 kΩ
10 kΩ
CONF_DONE
nSTATUS
nCEO
N.C.
nSTATUS
nCE
nCEO
nCE
External Host
(MAX II Device or
Microprocessor)
V
GND
V
CCPGM
CCPGM
MSEL2
MSEL1
MSEL0
MSEL2
DATA0
DATA0
MSEL1
nCONFIG
nCONFIG
DCLK
DCLK
MSEL0
GND
GND
Note to Figure 10–11:
(1) Connect the resistor to a supply that provides an acceptable input signal for all Stratix IV devices in the chain. VCCPGM must be high enough to
meet the VIH specification of the I/O on the device and the external host. Altera recommends powering up all configuration system I/Os with VCCPGM
.
In multi-device PS configuration, the first device’s nCEpin is connected to GND, while
its nCEOpin is connected to nCEof the next device in the chain. The last device’s nCE
input comes from the previous device, while its nCEOpin is left floating. After the first
device completes configuration in a multi-device configuration chain, its nCEOpin
drives low to activate the second device’s nCEpin, which prompts the second device
to begin configuration. The second device in the chain begins configuration within
one clock cycle. Therefore, the transfer of data destinations is transparent to the
MAX II device. All other configuration pins (nCONFIG, nSTATUS, DCLK, DATA0, and
CONF_DONE) are connected to every device in the chain. Configuration signals can
require buffering to ensure signal integrity and prevent clock skew problems. Ensure
that the DCLKand DATAlines are buffered for every fourth device. Because all device
CONF_DONEpins are tied together, all devices initialize and enter user mode at the same
time.
Because all nSTATUSand CONF_DONEpins are tied together, if any device detects an
error, configuration stops for the entire chain and you must reconfigure the entire
chain. For example, if the first device flags an error on nSTATUS, it resets the chain by
pulling its nSTATUSpin low. This behavior is similar to a single device detecting an
error.
If the Auto-restart configuration after error option is turned on, the devices release
their nSTATUSpins after a reset time-out period (a maximum of 500 s). After all
nSTATUSpins are released and pulled high, the MAX II device can try to reconfigure
the chain without needing to pulse nCONFIGlow. If this option is turned off, the
MAX II device must generate a low-to-high transition (with a low pulse of at least
2 s) on nCONFIGto restart the configuration process.
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Passive Serial Configuration
1
If you have enabled the Auto-restart configuration after error option, the nSTATUSpin
transitions from high to low and back again to high when a configuration error is
detected. This appears as a low pulse at the nSTATUSpin with a minimum pulse width
of 10 s to a maximum pulse width of 500 s, as defined in the tSTATUS specification.
In your system, you can have multiple devices that contain the same configuration
data. To support this configuration scheme, all device nCEinputs are tied to GND,
while the nCEOpins are left floating. All other configuration pins (nCONFIG
DATA0, and CONF_DONE) are connected to every device in the chain.
, nSTATUS,
DCLK
,
Configuration signals can require buffering to ensure signal integrity and prevent
clock skew problems. Ensure that the DCLKand DATAlines are buffered for every fourth
device. Devices must be the same density and package. All devices start and complete
configuration at the same time.
Figure 10–12 shows multi-device PS configuration when both Stratix IV devices are
receiving the same configuration data.
Figure 10–12. Multiple-Device PS Configuration When Both Devices Receive the Same Data
Memory
V
V
CCPGM (1)
CCPGM (1)
ADDR
DATA0
Stratix IV Device
Stratix IV Device
CONF_DONE
10 kΩ
10 kΩ
CONF_DONE
nSTATUS
(2)
N.C.
nCEO
nSTATUS
nCE
(2)
nCEO
N.C.
nCE
External Host
(MAX II Device or
Microprocessor)
V
GND
GND
V
CCPGM
CCPGM
MSEL2
MSEL1
MSEL0
MSEL2
MSEL1
MSEL0
DATA0
DATA0
nCONFIG
DCLK
nCONFIG
DCLK
GND
GND
Notes to Figure 10–12:
(1) Connect the resistor to a supply that provides an acceptable input signal for all Stratix IV devices in the chain. VCCPGM must be high enough to
meet the VIH specification of the I/O on the device and the external host. Altera recommends powering up all configuration system I/Os with VCCPGM
.
(2) The nCEOpins of both devices are left unconnected when configuring the same configuration data into multiple devices.
You can use a single configuration chain to configure Stratix IV devices with other
Altera devices. To ensure that all devices in the chain complete configuration at the
same time, or that an error flagged by one device initiates reconfiguration in all
devices, all of the device CONF_DONEand nSTATUSpins must be tied together.
f
For more information about configuring multiple Altera devices in the same
configuration chain, refer to the Configuring Mixed Altera FPGA Chains chapter in
volume 2 of the Configuration Handbook.
Stratix IV Device Handbook Volume 1
April 2011 Altera Corporation
Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
10–31
Passive Serial Configuration
PS Configuration Timing
Figure 10–13 shows the timing waveform for PS configuration when using a MAX II
device as an external host.
Figure 10–13. PS Configuration Timing Waveform (Note 1)
tCF2ST1
tCFG
tCF2CK
nCONFIG
nSTATUS (2)
tSTATUS
tCF2ST0
tCLK
CONF_DONE (3)
t
CH tCL
tCF2CD
tST2CK
(4)
(5)
DCLK
DATA
tDH
Bit 2 Bit 3
Bit n
Bit 0 Bit 1
tDSU
High-Z
User I/O
User Mode
INIT_DONE
tCD2UM
Notes to Figure 10–13:
(1) The beginning of this waveform shows the device in user mode. In user mode, nCONFIG, nSTATUS, and CONF_DONEare at logic high levels.
When nCONFIGis pulled low, a reconfiguration cycle begins.
(2) After power-up, the Stratix IV device holds nSTATUSlow for the time of the POR delay.
(3) After power-up, before and during configuration, CONF_DONEis low.
(4) Do not leave DCLKfloating after configuration. You can drive it high or low, whichever is more convenient.
(5) DATA[0]is available as a user I/O pin after configuration. The state of this pin depends on the dual-purpose pin settings.
Table 10–7 lists the timing parameters for Stratix IV devices for PS configuration.
Table 10–7. PS Timing Parameters for Stratix IV Devices (Part 1 of 2) (Note 1)
Symbol
tCF2CD
tCF2ST0
tCFG
Parameter
nCONFIGlow to CONF_DONElow
nCONFIGlow to nSTATUSlow
nCONFIGlow pulse width
Minimum
Maximum
800
800
—
Units
ns
—
—
2
ns
s
s
s
s
s
ns
tSTATUS
tCF2ST1
tCF2CK
tST2CK
tDSU
nSTATUSlow pulse width
10
—
500
2
500 (2)
500 (3)
—
nCONFIGhigh to nSTATUShigh
nCONFIGhigh to first rising edge on DCLK
nSTATUShigh to first rising edge of DCLK
Data setup time before rising edge on DCLK
Data hold time after rising edge on DCLK
DCLKhigh time (5)
—
4
—
tDH
0
—
ns
tCH
3.2
3.2
8
—
ns
tCL
DCLKlow time (5)
—
ns
tCLK
DCLKperiod (5)
—
ns
fMAX
DCLKfrequency
—
—
125
40
MHz
ns
tR
Input rise time
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Passive Serial Configuration
Table 10–7. PS Timing Parameters for Stratix IV Devices (Part 2 of 2) (Note 1)
Symbol
tF
tCD2UM
Parameter
Minimum
Maximum
40
Units
ns
Input fall time
—
55
CONF_DONEhigh to user mode (4)
150
?s
4 × maximum
DCLKperiod
tCD2CU
CONF_DONEhigh to CLKUSRenabled
—
—
t
CD2CU + (8532
tCD2UMC
CONF_DONEhigh to user mode with CLKUSRoption on
?
CLKUSR
period)
—
—
Notes to Table 10–7:
(1) This information is preliminary.
(2) This value is applicable if you do not delay the configuration by extending the nCONFIGor nSTATUSlow pulse width.
(3) This value is applicable if you do not delay the configuration by externally holding nSTATUSlow.
(4) The minimum and maximum numbers apply only if you choose the internal oscillator as the clock source for starting the device.
(5) Adding up tCH and tCL equals to tCLK. When tCH is 3.2 ns (min), tCL must be 4.8 ns and vice versa.
f
Device configuration options and how to create configuration files are described in
the Device Configuration Options and Configuration File Formats chapters in volume 2 of
the Configuration Handbook.
PS Configuration Using a Microprocessor
In this PS configuration scheme, a microprocessor controls the transfer of
configuration data from a storage device, such as flash memory, to the target
Stratix IV device.
For more information about configuration and timing information, refer to “PS
Configuration Using a MAX II Device as an External Host” on page 10–25. This
section is also applicable when using a microprocessor as an external host.
PS Configuration Using a Download Cable
1
In this section, the generic term “download cable” includes the Altera USB-Blaster
universal serial bus (USB) port download cable, MasterBlaster serial/USB
communications cable, ByteBlaster II parallel port download cable, ByteBlasterMV
parallel port download cable, and EthernetBlaster download cable.
In a PS configuration with a download cable, an intelligent host (such as a PC)
transfers data from a storage device to the device using the USB Blaster, MasterBlaster,
ByteBlaster II, EthernetBlaster, or ByteBlasterMV cable.
After power-up, Stratix IV devices go through a POR. The POR delay depends on the
PORSELpin setting. When PORSELis driven low, the standard POR time is
100 ms < TPOR < 300 ms. When PORSELis driven high, the fast POR time is
4 ms < TPOR < 12 ms. During POR, the device resets, holds nSTATUSlow, and tri-states
all user I/O pins. After the device successfully exits POR, all user I/O pins continue to
be tri-stated. If nIO_pullupis driven low during power-up and configuration, the user
I/O pins and dual-purpose I/O pins will have weak pull-up resistors, which are on
(after POR) before and during configuration. If nIO_pullupis driven high, the weak
pull-up resistors are disabled.
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10–33
Passive Serial Configuration
The configuration cycle consists of three stages—reset, configuration, and
initialization. While nCONFIGor nSTATUSare low, the device is in reset. To initiate
configuration in this scheme, the download cable generates a low-to-high transition
on the nCONFIGpin.
1
To begin configuration, power the VCC, VCCIO, VCCPGM, and VCCPD voltages (for the
banks where the configuration pins reside) to the appropriate voltage levels.
When nCONFIGgoes high, the device comes out of reset and releases the open-drain
nSTATUSpin, which is then pulled high by an external 10-k pull-up resistor. After
nSTATUSis released, the device is ready to receive configuration data and the
configuration stage begins. The programming hardware or download cable then
places the configuration data one bit at a time on the device’s DATA0pin. The
configuration data is clocked into the target device until CONF_DONEgoes high. The
CONF_DONEpin must have an external 10-k pull-up resistor for the device to initialize.
When using a download cable, setting the Auto-restart configuration after error
option does not affect the configuration cycle because you must manually restart
configuration in the Quartus II software when an error occurs. Additionally, the
Enable user-supplied start-up clock (CLKUSR) option has no affect on the device
initialization because this option is disabled in the .sof when programming the device
using the Quartus II programmer and download cable. Therefore, if you turn on the
CLKUSRoption, you do not need to provide a clock on CLKUSRwhen you are
configuring the device with the Quartus II programmer and a download cable.
Figure 10–14 shows PS configuration for Stratix IV devices using a USB Blaster,
EthernetBlaster, MasterBlaster, ByteBlaster II, or ByteBlasterMV cable.
Figure 10–14. PS Configuration Using a USB Blaster, EthernetBlaster, MasterBlaster, ByteBlaster II, or ByteBlasterMV
Cable
V
(1)
V
(1)
V
(1)
V
(1)
CCPGM
CCPGM
CCPGM
CCPGM
10 kΩ
10 kΩ
10 kΩ
10 kΩ
Stratix IV Device
(2)
CONF_DONE
V
V
(1)
CCPGM
CCPGM
nSTATUS
MSEL2
10 kΩ
(2)
MSEL1
MSEL0
GND
Download Cable
10-Pin Male Header
(PS Mode)
nCE
nCEO
N.C.
Pin 1
GND
V
(1)
CCPGM
DCLK
DATA0
nCONFIG
GND
(3)
V
IO
Shield
GND
Notes to Figure 10–14:
(1) Connect the pull-up resistor to the same supply voltage (VCCPGM) as the USB Blaster, MasterBlaster (VIOpin), ByteBlaster II, ByteBlasterMV, or
EthernetBlaster cable.
(2) You only need the pull-up resistors on DATA0and DCLKif the download cable is the only configuration scheme used on your board. This ensures
that DATA0and DCLKare not left floating after configuration. For example, if you are also using a configuration device, you do not need the
pull-up resistors on DATA0and DCLK.
(3) Pin 6 of the header is a VIO reference voltage for the MasterBlaster output driver. VIO must match the device’s VCCPGM. For more information about
this value, refer to the MasterBlaster Serial/USB Communications Cable User Guide. In the USB-Blaster, ByteBlaster II, and ByteBlasterMV cable,
this pin is a no connect.
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Passive Serial Configuration
You can use a download cable to configure multiple Stratix IV devices by connecting
each device’s nCEOpin to the subsequent device’s nCEpin. The first device’s nCEpin is
connected to GND, while its nCEOpin is connected to the nCEof the next device in the
chain. The last device’s nCEinput comes from the previous device, while its nCEOpin is
left floating. All other configuration pins (nCONFIG, nSTATUS, DCLK, DATA0, and
CONF_DONE) are connected to every device in the chain. Because all CONF_DONEpins are
tied together, all devices in the chain initialize and enter user mode at the same time.
In addition, because the nSTATUSpins are tied together, the entire chain halts
configuration if any device detects an error. The Auto-restart configuration after
error option does not affect the configuration cycle because you must manually restart
the configuration in the Quartus II software when an error occurs.
Figure 10–15 shows how to configure multiple Stratix IV devices with a download
cable.
Figure 10–15. Multi-Device PS Configuration Using a USB Blaster, EthernetBlaster, MasterBlaster, ByteBlaster II, or
ByteBlasterMV Cable
V
(1)
CCPGM
Download Cable
10-Pin Male Header
(PS Mode)
V
(1)
CCPGM
10 kΩ
V
(1)
CCPGM
10 kΩ
Stratix IV Device 1
V
(1)
Pin 1
V
(1)
(2)
CCPGM
CCPGM
(2)
V
(1)
CCPGM
CONF_DONE
nSTATUS
10 kΩ
MSEL2
MSEL1
DCLK
10 kΩ
MSEL0
GND
IO
V
(1)
V
(3)
CCPGM
GND
nCEO
nCE
10 kΩ
GND
DATA0
nCONFIG
GND
Stratix IV Device 2
V
(1)
CCPGM
CONF_DONE
MSEL2
MSEL1
nSTATUS
DCLK
MSEL0
GND
nCEO
N.C.
nCE
DATA0
nCONFIG
Notes to Figure 10–15:
(1) Connect the pull-up resistor to the same supply voltage (VCCPGM) as the USB Blaster, MasterBlaster (VIOpin), ByteBlaster II, ByteBlasterMV, or
EthernetBlaster cable.
(2) You only need the pull-up resistors on DATA0and DCLKif the download cable is the only configuration scheme used on your board. This is to
ensure that DATA0and DCLKare not left floating after configuration. For example, if you are also using a configuration device, you do not need
the pull-up resistors on DATA0and DCLK.
(3) Pin 6 of the header is a VIO reference voltage for the MasterBlaster output driver. VIO must match the device’s VCCPGM. For more information about
this value, refer to the MasterBlaster Serial/USB Communications Cable User Guide. In the USB-Blaster, ByteBlaster II, and ByteBlasterMV cables,
this pin is a no connect.
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April 2011 Altera Corporation
Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
10–35
JTAG Configuration
f
For more information about how to use the USB Blaster, MasterBlaster, ByteBlaster II,
or ByteBlasterMV cables, refer to the following user guides:
■
■
■
■
■
USB-Blaster Download Cable User Guide
MasterBlaster Serial/USB Communications Cable User Guide
ByteBlaster II Download Cable User Guide
ByteBlasterMV Download Cable User Guide
EthernetBlaster Communications Cable User Guide
JTAG Configuration
JTAG has developed a specification for boundary-scan testing. This boundary-scan
test (BST) architecture offers the capability to efficiently test components on PCBs
with tight lead spacing. The BST architecture can test pin connections without using
physical test probes and capture functional data while a device is operating normally.
You can also use JTAG circuitry to shift configuration data into the device. The
Quartus II software automatically generates .sofs that you can use for JTAG
configuration with a download cable in the Quartus II software programmer.
f
For more information about JTAG boundary-scan testing and commands available
using Stratix IV devices, refer to the following documents:
■
■
JTAG Boundary Scan Testing in Stratix IV Devices chapter
Programming Support for Jam STAPL Language
Stratix IV devices are designed such that JTAG instructions have precedence over any
device configuration modes. Therefore, JTAG configuration can take place without
waiting for other configuration modes to complete. For example, if you attempt JTAG
configuration of Stratix IV devices during PS configuration, PS configuration is
terminated and JTAG configuration begins.
1
1
You cannot use the Stratix IV decompression or design security features if you are
configuring your Stratix IV device when using JTAG-based configuration.
A device operating in JTAG mode uses four required pins, TDI
one optional pin, TRST. The TCKpin has an internal weak pull-down resistor, while the
TMS, and TRSTpins have weak internal pull-up resistors (typically 25 k). The
, TDO, TMS, and TCK, and
TDI
,
JTAG output pin TDOand all JTAG input pins are powered by 2.5-V/3.0-V VCCPD. All
the JTAG pins only support the LVTTL I/O standard.
All user I/O pins are tri-stated during JTAG configuration.
f
All the JTAG pins are powered by the VCCPD power supply of I/O bank 1A. For more
information about how to connect a JTAG chain with multiple voltages across the
devices in the chain, refer to the JTAG Boundary Scan Testing in Stratix IV Devices
chapter.
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Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
JTAG Configuration
During JTAG configuration, you can download data to the device on the PCB through
the USB Blaster, MasterBlaster, ByteBlaster II, EthernetBlaster, or ByteBlasterMV
download cable. Configuring devices through a cable is similar to programming
devices in-system, except you must connect the TRSTpin to VCCPD. This ensures that
the TAP controller is not reset.
Figure 10–16 shows JTAG configuration of a single Stratix IV device when using a
download cable.
Figure 10–16. JTAG Configuration of a Single Device Using a Download Cable
V
(1)
CCPD
(5)
V
CCPGM
V
(1)
CCPD
10 kΩ
V
CCPGM
Stratix IV Device
(5)
10 kΩ
nCE (4)
TCK
TDO
N.C.
nCE0
GND
TMS
TDI
Download Cable
10-Pin Male Header
(JTAG Mode)
nSTATUS
CONF_DONE
nCONFIG
MSEL[2..0]
DCLK
V
(1)
CCPD
(2)
(2)
(2)
(Top View)
TRST
Pin 1
V
(1)
CCPD
GND
(3)
V
IO
1 kΩ
GND
GND
Notes to Figure 10–16:
(1) Connect the pull-up resistor to the same supply voltage as the USB Blaster, MasterBlaster (VIOpin), ByteBlaster II, ByteBlasterMV, or
EthernetBlaster cable. The voltage supply can be connected to the VCCPD of the device.
(2) Connect the nCONFIGand MSEL[2..0]pins to support a non-JTAG configuration scheme. If you only use the JTAG configuration, connect
nCONFIGto VCCPGM and MSEL[2..0]to GND. Pull DCLKeither high or low, whichever is convenient on your board.
(3) Pin 6 of the header is a VIO reference voltage for the MasterBlaster output driver. VIO must match the device’s VCCPD. For more information about
this value, refer to the MasterBlaster Serial/USB Communications Cable User Guide. In the USB-Blaster, ByteBlaster II, and ByteBlasterMV cable,
this pin is a no connect.
(4) You must connect nCEto GND or driven low for successful JTAG configuration.
(5) The pull-up resistor value can vary from 1 k to 10 k .
Stratix IV Device Handbook Volume 1
April 2011 Altera Corporation
Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
10–37
JTAG Configuration
To configure a single device in a JTAG chain, the programming software places all
other devices in bypass mode. In bypass mode, devices pass programming data from
the TDIpin to the TDOpin through a single bypass register without being affected
internally. This scheme enables the programming software to program or verify the
target device. Configuration data driven into the device appears on the TDOpin one
clock cycle later.
The Quartus II software verifies successful JTAG configuration upon completion. At
the end of configuration, the software checks the state of CONF_DONEthrough the JTAG
port. When the Quartus II software generates a JAM file (.jam) for a multi-device
chain, it contains instructions so that all the devices in the chain are initialized at the
same time. If CONF_DONEis not high, the Quartus II software indicates that
configuration has failed. If CONF_DONEis high, the software indicates that
configuration was successful. After the configuration bitstream is transmitted serially
using the JTAG TDIport, the TCKport is clocked an additional 1,094 cycles to perform
device initialization.
Stratix IV devices have dedicated JTAG pins that always function as JTAG pins. Not
only can you perform JTAG testing on Stratix IV devices before and after, but also
during configuration. While other device families do not support JTAG testing during
configuration, Stratix IV devices support the bypass, ID code, and sample instructions
during configuration without interrupting configuration. All other JTAG instructions
may only be issued by first interrupting configuration and reprogramming the I/O
pins using the CONFIG_IOinstruction.
The CONFIG_IOinstruction allows I/O buffers to be configured using the JTAG port
and when issued, interrupts configuration. This instruction allows you to perform
board-level testing prior to configuring the Stratix IV device or waiting for a
configuration device to complete configuration. After configuration has been
interrupted and JTAG testing is complete, you must reconfigure the part using JTAG
(PULSE_CONFIGinstruction) or by pulsing nCONFIGlow.
The chip-wide reset (DEV_CLRn) and chip-wide output enable (DEV_OE) pins on
Stratix IV devices do not affect JTAG boundary-scan or programming operations.
Toggling these pins does not affect JTAG operations (other than the usual
boundary-scan operation).
When designing a board for JTAG configuration for Stratix IV devices, consider the
dedicated configuration pins. Table 10–8 lists how these pins are connected during
JTAG configuration.
Table 10–8. Dedicated Configuration Pin Connections During JTAG Configuration (Part 1 of 2)
Signal
Description
On all Stratix IV devices in the chain, nCEmust be driven low by connecting it to
GND, pulling it low using a resistor, or driving it by some control circuitry. For
devices that are also in multi-device FPP, AS, or PS configuration chains, the nCE
pins must be connected to GND during JTAG configuration or JTAG must be
configured in the same order as the configuration chain.
nCE
On all Stratix IV devices in the chain, you can leave nCEOfloating or connected to
the nCEof the next device.
nCEO
MSEL
Do not leave these pins floating. These pins support whichever non-JTAG
configuration is used in production. If you only use JTAG configuration, tie these
pins to GND.
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Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
JTAG Configuration
Table 10–8. Dedicated Configuration Pin Connections During JTAG Configuration (Part 2 of 2)
Signal
Description
Driven high by connecting to VCCPGM, pulling up using a resistor, or driven high by
some control circuitry.
nCONFIG
Pull to VCCPGM using a 10-k resistor. When configuring multiple devices in the
same JTAG chain, each nSTATUSpin must be pulled up to VCCPGM individually.
nSTATUS
CONF_DONE
DCLK
Pull to VCCPGM using a 10-k resistor. When configuring multiple devices in the
same JTAG chain, each CONF_DONEpin must be pulled up to VCCPGM individually.
CONF_DONEgoing high at the end of JTAG configuration indicates successful
configuration.
Do not leave DCLKfloating. Drive low or high, whichever is more convenient on
your board.
When programming a JTAG device chain, one JTAG-compatible header is connected
to several devices. The number of devices in the JTAG chain is limited only by the
drive capability of the download cable. When four or more devices are connected in a
JTAG chain, Altera recommends buffering the TCK, TDI, and TMSpins with an on-board
buffer.
JTAG-chain device programming is ideal when the system contains multiple devices,
or when testing your system using JTAG BST circuitry.
Figure 10–17 shows a multi-device JTAG configuration when using a download cable.
Figure 10–17. JTAG Configuration of Multiple Devices Using a Download Cable
Stratix IV Device
Stratix IV Device
Stratix IV Device
10 kΩ
V
Download Cable
10-Pin Male Header
(JTAG Mode)
V
V
CCPGM
V
V
V
CCPGM
CCPGM
CCPGM
CCPGM
CCPGM
10 kΩ
10 kΩ
nSTATUS
10 kΩ
10 kΩ
10 kΩ
V
(1)
CCPD
nSTATUS
nCONFIG
nSTATUS
nCONFIG
(2)
(2)
(2)
nCONFIG
(5)
Pin 1
CONF_DONE
V
(1)
CONF_DONE
CONF_DONE
CCPD
V
(1)
CCPD
(2)
(2)
DCLK
(2)
(2)
DCLK
(2)
(2)
DCLK
MSEL[2..0]
MSEL[2..0]
MSEL[2..0]
(5)
nCE (4)
nCE (4)
V
(1)
nCE (4)
V
(1)
V
(1)
CCPD
CCPD
CCPD
TRST
TDI
TMS
TRST
TDI
TMS
TRST
TDI
TMS
V
IO
TDO
TDO
TDO
(3)
TCK
TCK
TCK
1 kΩ
Notes to Figure 10–17:
(1) Connect the pull-up resistor to the same supply voltage as the USB Blaster, MasterBlaster (VIO pin), ByteBlaster II, ByteBlasterMV, or
EthernetBlaster cable. Connect the voltage supply to VCCPD of the device.
(2) Connect the nCONFIGand MSEL[2..0]pins to support a non-JTAG configuration scheme. If you only use a JTAG configuration, connect
nCONFIGto VCCPGM and MSEL[2..0]to GND. Pull DCLKeither high or low, whichever is convenient on your board.
(3) Pin 6 of the header is a VIO reference voltage for the MasterBlaster output driver. VIO must match the device’s VCCPD. For more information about
this value, refer to the MasterBlaster Serial/USB Communications Cable User Guide. In the USB-Blaster, ByteBlaster II, and ByteBlasterMV cables,
this pin is a no connect.
(4) You must connect nCEto GND or drive it low for successful JTAG configuration.
(5) The pull-up resistor value can vary from 1 k to 10 k .
Stratix IV Device Handbook Volume 1
April 2011 Altera Corporation
Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
10–39
JTAG Configuration
You must connect the nCEpin to GND or drive it low during JTAG configuration. In
multi-device FPP, AS, and PS configuration chains, the first device’s nCEpin is
connected to GND, while its nCEOpin is connected to nCEof the next device in the
chain. The last device’s nCEinput comes from the previous device, while its nCEOpin is
left floating. In addition, the CONF_DONEand nSTATUSsignals are all shared in
multi-device FPP, AS, or PS configuration chains so the devices can enter user mode at
the same time after configuration is complete. When the CONF_DONEand nSTATUS
signals are shared among all the devices, you must configure every device when JTAG
configuration is performed.
If you only use JTAG configuration, Altera recommends connecting the circuitry as
shown in Figure 10–17, where each of the CONF_DONEand nSTATUSsignals are isolated,
so that each device can enter user mode individually.
After the first device completes configuration in a multi-device configuration chain,
its nCEOpin drives low to activate the second device’s nCEpin, which prompts the
second device to begin configuration. Therefore, if these devices are also in a JTAG
chain, ensure the nCEpins are connected to GND during JTAG configuration or that
the devices are JTAG configured in the same order as the configuration chain. As long
as the devices are JTAG configured in the same order as the multi-device
configuration chain, the nCEOof the previous device drives the nCEof the next device
low when it has successfully been JTAG configured.
You can place other Altera devices that have JTAG support in the same JTAG chain for
device programming and configuration.
1
JTAG configuration support is enhanced and allows more than 17 Stratix IV devices to
be cascaded in a JTAG chain.
f
For more information about configuring multiple Altera devices in the same
configuration chain, refer to the Configuring Mixed Altera FPGA Chains chapter in
volume 2 of the Configuration Handbook.
You can configure Stratix IV devices using multiple configuration schemes on the
same board. Combining JTAG configuration with AS configuration on your board is
useful in the prototyping environment because it allows multiple methods to
configure your FPGA.
f
For more information about combining JTAG configuration with other configuration
schemes, refer to the Combining Different Configuration Schemes chapter in volume 2 of
the Configuration Handbook.
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Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
Device Configuration Pins
Figure 10–18 shows JTAG configuration of a Stratix IV device using a microprocessor.
Figure 10–18. JTAG Configuration of a Single Device Using a Microprocessor
V
CCPGM (1)
V
CCPGM (1)
10 kΩ
Memory
Stratix IV Device
10 kΩ
DATA
ADDR
nSTATUS
V
CCPD
CONF_DONE
TRST
TDI (4)
TCK (4)
TMS (4)
TDO (4)
DCLK
nCONFIG
(2)
(2)
(2)
MSEL[2..0]
nCEO
N.C.
Microprocessor
(3) nCE
GND
Notes to Figure 10–18:
(1) Connect the pull-up resistor to a supply that provides an acceptable input signal for all Stratix IV devices in the chain.
CCPGM must be high enough to meet the VIH specification of the I/O on the device.
V
(2) Connect the nCONFIGand MSEL[2..0]pins to support a non-JTAG configuration scheme. If you use only a JTAG
configuration, connect nCONFIGto VCCGPM and MSEL[2..0]to GND. Pull DCLKeither high or low, whichever is
convenient on your board.
(3) Connect nCEto GND or drive it low for successful JTAG configuration.
(4) The microprocessor must use the same I/O standard as VCCPD to drive the JTAG pins.
Jam STAPL
Jam STAPL, JEDEC standard JESD-71, is a standard file format for in-system
programmability (ISP) purposes. Jam STAPL supports programming or configuration
of programmable devices and testing of electronic systems, using the IEEE 1149.1
JTAG interface. Jam STAPL is a freely licensed open standard.
The Jam Player provides an interface for manipulating the IEEE Std. 1149.1 JTAG TAP
state machine.
f
For more information about JTAG and Jam STAPL in embedded environments, refer
to Using Jam STAPL for ISP via an Embedded Processor. To download the Jam Player,
visit the Altera website at www.altera.com.
Device Configuration Pins
The following tables list the connections and functionality of all the
configuration-related pins on Stratix IV devices. Table 10–9 lists the Stratix IV
configuration pins and their power supply.
Table 10–9. Stratix IV Configuration Pin Summary (Part 1 of 2) (Note 1)
Description
Input/Output
Input
Dedicated
Yes
Powered By
VCCPD
Configuration Mode
TDI
TMS
TCK
TRST
TDO
JTAG
JTAG
Input
Yes
VCCPD
Input
Yes
VCCPD
JTAG
Input
Yes
VCCPD
JTAG
Output
Output
Yes
VCCPD
JTAG
CRC_ERROR
—
Pull-up
Optional, all modes
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10–41
Device Configuration Pins
Table 10–9. Stratix IV Configuration Pin Summary (Part 2 of 2) (Note 1)
Description
Input/Output
Input
Dedicated
—
Powered By
VCCPGM/VCCIO (3)
VCCPGM/VCCIO (3)
Pull-up
Configuration Mode
DATA0
All modes except JTAG
FPP
DATA[7..1]
INIT_DONE
CLKUSR
Input
—
Output
Input
—
Optional, all modes
Optional
—
VCCPGM/VCCIO (3)
VCCPGM/Pull-up
VCCPGM
nSTATUS
nCE
Bidirectional
Input
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
All modes
All modes
All modes
All modes
All modes
AS
CONF_DONE
nCONFIG
PORSEL
Bidirectional
Input
VCCPGM/Pull-up
VCCPGM
Input
VCC (2)
ASDO (4)
nCSO (4)
Output
Output
Input
VCCPGM
VCCPGM
AS
VCCPGM
PS, FPP
DCLK (4)
Output
Input
VCCPGM
AS
nIO_PULLUP
nCEO
VCC (2)
All modes
All modes
All modes
Output
Input
VCCPGM
MSEL[2..0]
VCC (2)
Notes to Table 10–9:
(1) The total number of pins is 29. The total number of dedicated pins is 18.
(2) Although MSEL[2..0],PORSEL,and nIO_PULLUPare powered up by VCC, Altera recommends connecting these pins to VCCPGM or GND directly
without using a pull-up or pull-down resistor.
(3) These pins are powered up by VCCPGM during configuration. These pins are powered up by VCCIO if they are used as regular I/O in user mode.
(4) To tri-state this pin, in the Quartus II software, on the Assignments menu, select Device. On the Device page, select Device and Pin Options...
On the Device and Pin Options page, select Configuration and select the Enable input tri-state on active configuration pins in user mode
option.
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Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
Device Configuration Pins
Table 10–10 lists the dedicated configuration pins. You must connect these pins
properly on your board for successful configuration. Some of these pins may not be
required for your configuration schemes.
Table 10–10. Dedicated Configuration Pins on the Stratix IV Device (Part 1 of 4)
Configuration
Pin Name
User Mode
Pin Type
Description
Scheme
Dedicated power pin. Use this pin to power all dedicated
configuration inputs, dedicated configuration outputs,
dedicated configuration bidirectional pins, and some of the
dual functional pins that are used for configuration.
You must connect this pin to 1.8, 2.5, or 3.0 V. VCCPGM must
ramp-up from 0 V to VCCPGM within 100 ms when PORSELis
low or 4 ms when PORSELis high. If VCCPGM is not ramped
up within this specified time, your Stratix IV device will not
configure successfully. If your system does not allow a
VCCPGM ramp-up within 100 ms or 4 ms, you must hold
nCONFIGlow until all power supplies are stable.
VCCPGM
N/A
All
Power
Dedicated power pin. Use this pin to power the I/O
pre-drivers, JTAG input and output pins, and design
security circuitry.
You must connect this pin to 2.5 V or 3.0 V, depending on
the I/O standards selected. For the 3.0-V I/O standard,
VCCPD = 3.0 V. For the 2.5 V or below I/O standards,
VCCPD = 2.5 V.
VCCPD
N/A
All
Power
V
CCPD must ramp-up from 0 V to 2.5 V / 3.0 V within
100 ms when PORSELis low or 4 ms when PORSELis high.
If VCCPD is not ramped up within this specified time, your
Stratix IV device will not configure successfully. If your
system does not allow a VCCPD to ramp-up time within
100 ms or 4 ms, you must hold nCONFIGlow until all
power supplies are stable.
Dedicated input that selects between a standard POR time
or a fast POR time. A logic low selects a standard POR time
setting of 100 ms < TPOR < 300 ms and a logic high selects
a fast POR time setting of 4 ms < TPOR < 12 ms.
PORSEL
N/A
All
Input
The PORSELinput buffer is powered by VCC and has an
internal 5-kpull-down resistor that is always active. Tie
the PORSELpin directly to VCCPGM or GND.
Dedicated input that chooses whether the internal pull-up
resistors on the user I/O pins and dual-purpose I/O pins
(
nCSO, nASDO, DATA[7..0], CLKUSR, and INIT_DONE) are
on or off before and during configuration. A logic high turns
off the weak internal pull-up resistors; a logic low turns
them on.
nIO_PULLUP
N/A
All
Input
The nIO-PULLUPinput buffer is powered by VCC and has an
internal 5-k pull-down resistor that is always active. The
nIO-PULLUPcan be tied directly to VCCPGM, using a 1-k
pull-up resistor or tied directly to GND, depending on your
device requirements.
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Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
10–43
Device Configuration Pins
Table 10–10. Dedicated Configuration Pins on the Stratix IV Device (Part 2 of 4)
Configuration
Pin Name
User Mode
Pin Type
Description
Scheme
Three-bit configuration input that sets the Stratix IV device
configuration scheme. For the appropriate connections,
refer to Table 10–1 on page 10–2.
MSEL[2..0]
N/A
All
Input
You must hardwire these pins to VCCPGM or GND.
The MSEL[2..0]pins have internal 5-k pull-down
resistors that are always active.
Configuration control input. Pulling this pin low during
user-mode causes the device to lose its configuration data,
enter a reset state, and tri-state all I/O pins. Returning this
pin to a logic high level initiates a reconfiguration.
nCONFIG
N/A
All
Input
Configuration is possible only if this pin is high, except in
JTAG programming mode, when nCONFIGis ignored.
The device drives nSTATUSlow immediately after power-up
and releases it after the POR time.
During user mode and regular configuration, this pin is
pulled high by an external 10-k resistor.
This pin, when driven low by the Stratix IV device, indicates
that the device has encountered an error during
configuration.
■ Status output—If an error occurs during configuration,
nSTATUSis pulled low by the target device.
■ Status input—If an external source drives the nSTATUS
pin low during configuration or initialization, the target
device enters an error state.
Bidirectional
open-drain
nSTATUS
N/A
All
Driving nSTATUSlow after configuration and initialization
does not affect the configured device. If you use a
configuration device, driving nSTATUSlow causes the
configuration device to attempt to configure the device, but
because the device ignores transitions on nSTATUSin user
mode, the device does not reconfigure. To initiate a
reconfiguration, nCONFIGmust be pulled low.
If you have enabled the Auto-restart configuration after
error option, the nSTATUSpin transitions from high to low
and back again to high when a configuration error is
detected. This appears as a low pulse at the pin with a
minimum pulse width of 10 s to a maximum pulse width
of 500 s, as defined in the tSTATUS specification.
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Device Configuration Pins
Table 10–10. Dedicated Configuration Pins on the Stratix IV Device (Part 3 of 4)
Configuration
Pin Name
User Mode
Pin Type
Description
Scheme
If VCCPGM is not fully powered up, the following could occur:
■ VCCPGM is powered high enough for the nSTATUSbuffer
to function properly and nSTATUSis driven low. When
VCCPGM is ramped up, POR trips and nSTATUSis released
after POR expires.
■ VCCPGM is not powered high enough for the nSTATUS
buffer to function properly. In this situation, nSTATUS
might appear logic high, triggering a configuration
attempt that would fail because POR did not yet trip.
When VCCPD is powered up, nSTATUSis pulled low
because POR did not yet trip. When POR trips after
VCCPGM is powered up, nSTATUSis released and pulled
high. At that point, reconfiguration is triggered and the
device is configured.
nSTATUS
—
—
—
(continued)
Status output. The target device drives the CONF_DONEpin
low before and during configuration. After all the
configuration data is received without error and the
initialization cycle starts, the target device releases
CONF_DONE
.
Bidirectional
open-drain
CONF_DONE
N/A
All
Status input. After all the data is received and CONF_DONE
goes high, the target device initializes and enters user
mode. The CONF_DONEpin must have an external 10-k
pull-up resistor for the device to initialize.
Driving CONF_DONElow after configuration and initialization
does not affect the configured device.
Active-low chip enable. The nCEpin activates the device
with a low signal to allow configuration. The nCEpin must
be held low during configuration, initialization, and user
mode. In single device configuration, it must be tied low. In
multi-device configuration, nCEof the first device is tied
low, while its nCEOpin is connected to nCEof the next
device in the chain.
nCE
N/A
All
Input
The nCEpin must also be held low for successful JTAG
programming of the device.
Output that drives low when device configuration is
complete. In single device configuration, this pin is left
floating. In multi-device configuration, this pin feeds the
next device’s nCEpin. The nCEOof the last device in the
chain is left floating.
nCEO
ASDO
N/A
N/A
All
Output
Output
The nCEOpin is powered by VCCPGM
.
Control signal from the Stratix IV device to the serial
configuration device in AS mode used to read out
configuration data.
AS
In AS mode, ASDOhas an internal pull-up resistor that is
always active.
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10–45
Device Configuration Pins
Table 10–10. Dedicated Configuration Pins on the Stratix IV Device (Part 4 of 4)
Configuration
Pin Name
User Mode
Pin Type
Description
Scheme
Output control signal from the Stratix IV device to the serial
configuration device in AS mode that enables the
configuration device.
nCSO
N/A
AS
Output
In AS mode, nCSOhas an internal pull-up resistor that is
always active.
In PS and FPP configurations, DCLKis the clock input used
to clock data from an external source into the target device.
Data is latched into the device on the rising edge of DCLK
.
In AS mode, DCLKis an output from the Stratix IV device
that provides timing for the configuration interface. In AS
mode, DCLKhas an internal pull-up resistor (typically
25 k) that is always active.
Synchronous
configuration
schemes
Input
(PS, FPP)
Output (AS)
In AS configuration schemes, this pin is driven into an
inactive state after configuration completes. You can use
this pin as a user I/O during user mode.
DCLK
N/A
(PS, FPP, AS)
In PS or FPP schemes that use a control host, you must
drive DCLKeither high or low, whichever is more
convenient. In passive schemes, you cannot use DCLKas a
user I/O during user mode.
Toggling this pin after configuration does not affect the
configured device.
Data input. In serial configuration modes, bit-wide
configuration data is presented to the target device on the
DATA0pin.
N/A in AS
mode. I/O
in PS or
In AS mode, DATA0has an internal pull-up resistor that is
always active.
DATA0
PS, FPP, AS
Input
FPP mode.
After PS or FPP configuration, DATA0is available as a user
I/O pin. The state of this pin depends on the Dual-Purpose
Pin settings.
Data inputs. Byte-wide configuration data is presented to
the target device on DATA[7..0]
.
Parallel
configuration
schemes
(FPP)
In serial configuration schemes, they function as user I/O
pins during configuration, which means they are tri-stated.
DATA[7..1]
I/O
Inputs
After FPP configuration, DATA[7..1]are available as user
I/O pins. The state of these pins depends on the
Dual-Purpose Pin settings.
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Device Configuration Pins
Table 10–11 lists the optional configuration pins. If these optional configuration pins
are not enabled in the Quartus II software, they are available as general-purpose user
I/O pins. Therefore, during configuration, these pins function as user I/O pins and
are tri-stated with weak pull-up resistors.
Table 10–11. Optional Configuration Pins
Pin Name
User Mode
Pin Type
Description
Optional user-supplied clock input synchronizes the initialization of
one or more devices. Enable this pin by turning on the Enable
user-supplied start-up clock (CLKUSR) option in the Quartus II
software.
N/A if option is on.
I/O if option is off.
CLKUSR
Input
Use as a status pin to indicate when the device has initialized and is
in user mode. When nCONFIGis low and during the beginning of
configuration, the INIT_DONEpin is tri-stated and pulled high due to
an external 10-k pull-up resistor. After the option bit to enable
INIT_DONEis programmed into the device (during the first frame of
N/A if option is on.
I/O if option is off.
Output
INIT_DONE
open-drain configuration data), the INIT_DONEpin goes low. When initialization
is complete, the INIT_DONEpin is released and pulled high and the
device enters user mode. Thus, the monitoring circuitry must be able
to detect a low-to-high transition. Enable this pin by turning on the
Enable INIT_DONE output option in the Quartus II software.
Optional pin that allows you to override all tri-states on the device.
When this pin is driven low, all I/O pins are tri-stated. When this pin
is driven high, all I/O pins behave as programmed. Enable this pin by
turning on the Enable device-wide output enable (DEV_OE) option
in the Quartus II software.
N/A if option is on.
I/O if option is off.
DEV_OE
Input
Input
Optional pin that allows you to override all clears on all device
registers. When this pin is driven low, all registers are cleared. When
this pin is driven high, all registers behave as programmed. Enable
this pin by turning on the Enable device-wide reset (DEV_CLRn)
option in the Quartus II software.
N/A if option is on.
I/O if option is off.
DEV_CLRn
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Device Configuration Pins
Table 10–12 lists the dedicated JTAG pins. JTAG pins must be kept stable before and
during configuration to prevent accidental loading of JTAG instructions. The TDI
,
TMS,and TRSTpins have weak internal pull-up resistors, while TCKhas a weak
internal pull-down resistor (typically 25 k). If you plan to use the SignalTap®
embedded logic array analyzer, you must connect the JTAG pins of the Stratix IV
device to a JTAG header on your board.
Table 10–12. Dedicated JTAG Pins
Pin
Name
User
Mode
Pin Type
Description
Serial input pin for instructions as well as test and programming data. Data is shifted on
the rising edge of TCK. The TDIpin is powered by the 2.5-V/3.0-V VCCPD supply.
Test data
input
TDI
N/A
N/A
If the JTAG interface is not required on your board, you can disable the JTAG circuitry by
connecting this pin to logic high using a 1-k resistor.
Serial data output pin for instructions as well as test and programming data. Data is
shifted out on the falling edge of TCK. The pin is tri-stated if data is not being shifted out of
the device. The TDOpin is powered by VCCPD. For recommendations about connecting a
JTAG chain with multiple voltages across the devices in the chain, refer to the JTAG
Boundary Scan Testing in Stratix IV Devices chapter.
Test data
output
TDO
TMS
If the JTAG interface is not required on your board, you can disable the JTAG circuitry by
leaving this pin unconnected.
Input pin that provides the control signal to determine the transitions of the TAP controller
state machine. TMSis evaluated on the rising edge of TCK. Therefore, you must set up TMS
before the rising edge of TCK. Transitions within the state machine occur on the falling
edge of TCKafter the signal is applied to TMS. The TMSpin is powered by 2.5-V/3.0-V
Testmode
select
N/A
VCCPD
.
If the JTAG interface is not required on your board, you can disable the JTAG circuitry by
connecting this pin to logic high using a 1-k resistor.
Clock input to the BST circuitry. Some operations occur at the rising edge, while others
occur at the falling edge. The TCKpin is powered by the 2.5-V/3.0-V VCCPD supply.
Test clock
input
TCK
N/A
N/A
It is expected that the clock input waveform have a nominal 50% duty cycle.
If the JTAG interface is not required on your board, you can disable the JTAG circuitry by
connecting TCKto GND.
Active-low input to asynchronously reset the boundary-scan circuit. The TRSTpin is
optional according to IEEE Std. 1149.1. The TRSTpin is powered by the 2.5-V/3.0-V VCCPD
supply.
Test reset
input
(optional)
TRST
Hold TMSat 1 or keep TCKstatic while TRSTis changed from 0 to 1.
If the JTAG interface is not required on your board, you can disable the JTAG circuitry by
connecting the TRSTpin to GND.
f
For more information about the pin connection recommendations, refer to the
Stratix IV GX and Stratix IV E Device Family Pin Connection Guidelines.
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Configuration Data Decompression
Configuration Data Decompression
Stratix IV devices support configuration data decompression, which saves
configuration memory space and time. This feature allows you to store compressed
configuration data in configuration devices or other memory and transmit this
compressed bitstream to Stratix IV devices. During configuration, the Stratix IV
device decompresses the bitstream in real time and programs its SRAM cells.
1
Preliminary data indicates that compression typically reduces the configuration
bitstream size by 30% to 55% based on the designs used.
Stratix IV devices support decompression in the FPP (when using a MAX II device or
microprocessor + flash), fast AS, and PS configuration schemes. The Stratix IV
decompression feature is not available in the JTAG configuration scheme.
In PS mode, use the Stratix IV decompression feature because sending compressed
configuration data reduces configuration time.
When you enable compression, the Quartus II software generates configuration files
with compressed configuration data. This compressed file reduces the storage
requirements in the configuration device or flash memory, and decreases the time
needed to transmit the bitstream to the Stratix IV device. The time required by a
Stratix IV device to decompress a configuration file is less than the time needed to
transmit the configuration data to the device.
There are two ways to enable compression for Stratix IV bitstreams—before design
compilation (in the Compiler Settings menu) and after design compilation (in the
Convert Programming Files window).
To enable compression in the project’s Compiler Settings menu, follow these steps:
1. On the Assignments menu, click Device to bring up the Settings dialog box.
2. After selecting your Stratix IV device, open the Device and Pin Options window.
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Configuration Data Decompression
3. In the Configuration settings tab, turn on Generate compressed bitstreams (as
shown in Figure 10–19).
Figure 10–19. Enabling Compression for Stratix IV Bitstreams in Compiler Settings
You can also enable compression when creating programming files from the Convert
Programming Files window. To do this, follow these steps:
1. On the File menu, click Convert Programming Files.
2. Select the programming file type (.pof, .sram, .hex, .rbf, or .ttf).
3. For .pof output files, select a configuration device.
4. In the Input files to convert box, select SOF Data.
5. Select Add File and add a Stratix IV device .sof file.
6. Select the name of the file you added to the SOF Data area and click Properties.
7. Check the Compression check box.
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Remote System Upgrades
When multiple Stratix IV devices are cascaded, you can selectively enable the
compression feature for each device in the chain if you are using a serial configuration
scheme. Figure 10–20 shows a chain of two Stratix IV devices. The first Stratix IV
device has compression enabled; therefore, receives a compressed bitstream from the
configuration device. The second Stratix IV device has the compression feature
disabled and receives uncompressed data.
In a multi-device FPP configuration chain (with a MAX II device or microprocessor +
flash), all Stratix IV devices in the chain must either enable or disable the
decompression feature. You cannot selectively enable the compression feature for
each device in the chain because of the DATAand DCLKrelationship.
Figure 10–20. Compressed and Uncompressed Configuration Data in the Same Configuration File
Serial Configuration Data
Serial Configuration
Device
Uncompressed
Configuration
Data
Compressed
Configuration
Data
Decompression
Controller
Stratix IV
Device
Stratix IV
Device
nCE
nCEO
nCE
nCEO
N.C.
GND
You can generate programming files for this setup by clicking Convert Programming
Files on the File menu in the Quartus II software.
Remote System Upgrades
This section describes the functionality and implementation of the dedicated remote
system upgrade circuitry. It also defines several concepts related to remote system
upgrade, including factory configuration, application configuration, remote update
mode, and user watchdog timer. Additionally, this section provides design guidelines
for implementing remote system upgrades with the supported configuration
schemes.
System designers sometimes face challenges such as shortened design cycles,
evolving standards, and system deployments in remote locations. Stratix IV devices
help overcome these challenges with their inherent reprogrammability and dedicated
circuitry to perform remote system upgrades. Remote system upgrades help deliver
feature enhancements and bug fixes without costly recalls, reduce time-to-market,
extend product life, and avoid system downtime.
Stratix IV devices feature dedicated remote system upgrade circuitry. Soft logic (either
the Nios® II embedded processor or user logic) implemented in a Stratix IV device can
download a new configuration image from a remote location, store it in configuration
memory, and direct the dedicated remote system upgrade circuitry to initiate a
reconfiguration cycle. The dedicated circuitry performs error detection during and
after the configuration process, recovers from any error condition by reverting back to
a safe configuration image, and provides error status information.
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Remote System Upgrades
Remote system upgrade is supported in fast AS Stratix IV configuration schemes. You
can also implement remote system upgrade in conjunction with advanced Stratix IV
features such as real-time decompression of configuration data and design security
using the advanced encryption standard (AES) for secure and efficient field upgrades.
The largest serial configuration device currently supports 128 Mbits of configuration
bitstream.
1
1
Stratix IV devices only support remote system upgrade in the single device fast AS
configuration scheme. Because the largest serial configuration device currently
supports 128 Mbits of configuration bitstream, the remote system upgrade feature is
not supported in EP4SGX290, EP4SE360, and larger devices.
The remote system upgrade feature is not supported in a multi-device chain.
Functional Description
The dedicated remote system upgrade circuitry in Stratix IV devices manages remote
configuration and provides error detection, recovery, and status information. User
logic or a Nios II processor implemented in the Stratix IV device logic array provides
access to the remote configuration data source and an interface to the system’s
configuration memory.
Stratix IV devices have remote system upgrade processes that involve the following
steps:
1. A Nios II processor (or user logic) implemented in the Stratix IV device logic array
receives new configuration data from a remote location. The connection to the
remote source uses a communication protocol such as the transmission control
protocol/Internet protocol (TCP/IP), peripheral component interconnect (PCI),
user datagram protocol (UDP), universal asynchronous receiver/transmitter
(UART), or a proprietary interface.
2. The Nios II processor (or user logic) stores this new configuration data in
non-volatile configuration memory.
3. The Nios II processor (or user logic) initiates a reconfiguration cycle with the new
or updated configuration data.
4. The dedicated remote system upgrade circuitry detects and recovers from any
error(s) that might occur during or after the reconfiguration cycle and provides
error status information to the user design.
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Remote System Upgrades
Figure 10–21 shows the steps required for performing remote configuration updates.
(The numbers in Figure 10–21 coincide with the steps just mentioned.)
Figure 10–21. Functional Diagram of Stratix IV Remote System Upgrade
1
2
Data
Data
Stratix IV
Device
Control Module
Configuration
Memory
Development
Location
Data
Stratix IV Configuration
3
Figure 10–22 shows a block diagram for implementing a remote system upgrade with
the Stratix IV fast AS configuration scheme.
Figure 10–22. Remote System Upgrade Block Diagram for Stratix IV Fast AS Configuration
Scheme
Stratix IV
Device
Nios II Processor
or User Logic
Serial
Configuration
Device
You must set the mode select pins (MSEL[2..0]) to fast AS mode to use remote system
upgrade in your system. Table 10–13 lists the MSELpin settings for Stratix IV devices in
standard configuration mode and remote system upgrade mode. The following
sections describe remote update of the remote system upgrade mode.
For more information about standard configuration schemes supported in Stratix IV
devices, refer to “Configuration Schemes” on page 10–2.
Table 10–13. Remote System Upgrade Modes in Stratix IV Devices
Configuration Scheme
Fast AS (40 MHz)
MSEL[2..0]
011
Remote System Upgrade Mode
Standard
011
Remote update (1)
Note to Table 10–13:
(1) All EPCS densities are able to support DCLKup to 40 MHz, but batches of EPCS1 and EPCS4 manufactured on
0.18-m process geometry can only support DCLKup to 20 MHz. For more information, refer to the Serial
Configuration Devices (EPCS1, EPCS4, EPCS16, EPCS64, and EPCS128) Data Sheet chapter in volume 2 of the
Configuration Handbook.
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Remote System Upgrades
1
When using fast AS mode, you must select remote update mode in the Quartus II
software and insert the ALTREMOTE_UPDATE megafunction to access the circuitry.
For more information, refer to “ALTREMOTE_UPDATE Megafunction” on
page 10–62.
Enabling Remote Update
You can enable remote update for Stratix IV devices in the Quartus II software before
design compilation (in the Compiler Settings menu). In remote update mode, the
auto-restart configuration after error option is always enabled. To enable remote
update in the project’s compiler settings, in the Quartus II software, follow these
steps:
1. On the Assignment menu, click Device. The Settings dialog box appears.
2. Click Device and Pin Options. The Device and Pin Options dialog box appears.
3. Click the Configuration tab.
4. From the Configuration scheme list, select Active Serial (you can also use
Configuration Device) (Figure 10–23).
5. From the Configuration Mode list, select Remote (Figure 10–23).
6. Click OK.
7. In the Settings dialog box, click OK.
Figure 10–23. Enabling Remote Update for Stratix IV Devices in the Compiler Settings Menu
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Remote System Upgrade Mode
Configuration Image Types
When performing a remote system upgrade, Stratix IV device configuration
bitstreams are classified as factory configuration images or application configuration
images. An image, also referred to as a configuration, is a design loaded into the
Stratix IV device that performs certain user-defined functions.
Each Stratix IV device in your system requires one factory image or the addition of
one or more application images. The factory image is a user-defined fall-back, or safe
configuration, and is responsible for administering remote updates in conjunction
with the dedicated circuitry. Application images implement user-defined
functionality in the target Stratix IV device. You may include the default application
image functionality in the factory image.
A remote system upgrade involves storing a new application configuration image or
updating an existing one using the remote communication interface. After an
application configuration image is stored or updated remotely, the user design in the
Stratix IV device initiates a reconfiguration cycle with the new image. Any errors
during or after this cycle are detected by the dedicated remote system upgrade
circuitry and cause the device to automatically revert to the factory image. The factory
image then performs error processing and recovery. The factory configuration is
written to the serial configuration device only once by the system manufacturer and
must not be remotely updated. On the other hand, application configurations may be
remotely updated in the system. Both images can initiate system reconfiguration.
Remote System Upgrade Mode
Remote system upgrade has one mode of operation—remote update mode. Remote
update mode allows you to determine the functionality of your system after
power-up and offers several features.
Remote Update Mode
In remote update mode, Stratix IV devices load the factory configuration image after
power up. The user-defined factory configuration determines which application
configuration is to be loaded and triggers a reconfiguration cycle. The factory
configuration may also contain application logic.
When used with serial configuration devices, remote update mode allows an
application configuration to start at any flash sector boundary. For example, this
translates to a maximum of 128 sectors in the EPCS64 device and 32 sectors in the
EPCS16 device, where the minimum size of each page is 512 KBits. Altera
recommends not using the same page in the serial configuration devices for two
images. Additionally, remote update mode features a user watchdog timer that
determines the validity of an application configuration.
When a Stratix IV device is first powered up in remote update mode, it loads the
factory configuration located at page zero (page registers PGM[23:0]=24'b0). Always
store the factory configuration image for your system at page address zero. This
corresponds to the start address location 0×000000 in the serial configuration device.
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Remote System Upgrade Mode
The factory image is user-designed and contains soft logic to:
■
■
■
Process any errors based on status information from the dedicated remote system
upgrade circuitry
Communicate with the remote host and receive new application configurations
and store this new configuration data in the local non-volatile memory device
Determine which application configuration is to be loaded into the Stratix IV
device
■
■
Enable or disable the user watchdog timer and load its time-out value (optional)
Instruct the dedicated remote system upgrade circuitry to initiate a
reconfiguration cycle
Figure 10–24 shows the transitions between the factory and application
configurations in remote update mode.
Figure 10–24. Transitions Between Configurations in Remote Update Mode
Configuration Error
Application 1
Configuration
Set Control Register
and Reconfigure
Power Up
Reload a
Different Application
Factory
Configuration
Configuration
Error
(page 0)
Reload a
Different Application
Application n
Configuration
Set Control Register
and Reconfigure
Configuration Error
After power up or a configuration error, the factory configuration logic is loaded
automatically. The factory configuration also must specify whether to enable the user
watchdog timer for the application configuration and if enabled, to include the timer
setting information.
The user watchdog timer ensures that the application configuration is valid and
functional. The timer must be continually reset within a specific amount of time
during user mode operation of an application configuration. Only valid application
configurations contain the logic to reset the timer in user mode. This timer reset logic
must be part of a user-designed hardware and/or software health monitoring signal
that indicates error-free system operation. If the timer is not reset in a specific amount
of time; for example, the user application configuration detects a functional problem
or if the system hangs, the dedicated circuitry updates the remote system upgrade
status register, triggering the loading of the factory configuration.
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Remote System Upgrade Mode
1
The user watchdog timer is automatically disabled for factory configurations. For
more information about the user watchdog timer, refer to “User Watchdog Timer” on
page 10–61.
If there is an error while loading the application configuration, the cause of the
reconfiguration is written by the dedicated circuitry to the remote system upgrade
status register. Actions that cause the remote system upgrade status register to be
written are:
■
■
■
■
nSTATUSdriven low externally
Internal CRCerror
User watchdog timer time-out
A configuration reset (logic array nCONFIGsignal or external nCONFIGpin assertion
to low)
Stratix IV devices automatically load the factory configuration located at page address
zero. This user-designed factory configuration can read the remote system upgrade
status register to determine the reason for the reconfiguration. The factory
configuration then takes appropriate error recovery steps and writes to the remote
system upgrade control register to determine the next application configuration to be
loaded.
When Stratix IV devices successfully load the application configuration, they enter
into user mode. In user mode, the soft logic (Nios II processor or state machine and
the remote communication interface) assists the Stratix IV device in determining
when a remote system update is arriving. When a remote system update arrives, the
soft logic receives the incoming data, writes it to the configuration memory device,
and triggers the device to load the factory configuration. The factory configuration
reads the remote system upgrade status register and control register, determines the
valid application configuration to load, writes the remote system upgrade control
register accordingly, and initiates system reconfiguration.
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Dedicated Remote System Upgrade Circuitry
Dedicated Remote System Upgrade Circuitry
This section describes the implementation of the Stratix IV remote system upgrade
dedicated circuitry. The remote system upgrade circuitry is implemented in hard
logic. This dedicated circuitry interfaces to the user-defined factory and application
configurations implemented in the Stratix IV device logic array to provide the
complete remote configuration solution. The remote system upgrade circuitry
contains the remote system upgrade registers, a watchdog timer, and a state machine
that controls those components.
Figure 10–25 shows the data path for the remote system upgrade block.
Figure 10–25. Remote System Upgrade Circuit Data Path (Note 1)
Internal Oscillator
Status Register (SR)
Control Register
[37..0]
[4..0]
Logic Array
Update Register
[37..0]
update
Shift Register
din dout
RSU
State
Machine
User
Watchdog
Timer
time-out
dout
din
Bit [4..0]
Bit [37..0]
capture
capture
clkout capture update
Logic Array
clkin
RU_DOUT
RU_SHIFTnLD
RU_CAPTnUPDT
RU_CLK RU_DIN RU_nCONFIG
RU_nRSTIMER
Note to Figure 10–25:
(1) The RU_DOUT,RU_SHIFTnLD,RU_CAPTnUPDT,RU_CLK,RU_DIN,RU_nCONFIG, and RU_nRSTIMERsignals are internally
controlled by the ALTREMOTE_UPDATE megafunction.
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Dedicated Remote System Upgrade Circuitry
Remote System Upgrade Registers
The remote system upgrade block contains a series of registers that store the page
addresses, watchdog timer settings, and status information. Table 10–14 lists these
registers.
Table 10–14. Remote System Upgrade Registers
Register
Description
This register is accessible by the logic array and allows the update, status, and control registers to be
written and sampled by user logic.
Shift register
This register contains the current page address, user watchdog timer settings, and one bit specifying
whether the current configuration is a factory configuration or an application configuration. During a read
operation in an application configuration, this register is read into the shift register. When a
reconfiguration cycle is initiated, the contents of the update register are written into the control register.
Control register
This register contains data similar to that in the control register. However, it can only be updated by the
factory configuration by shifting data into the shift register and issuing an update operation. When a
Update register reconfiguration cycle is triggered by the factory configuration, the control register is updated with the
contents of the update register. During a capture in a factory configuration, this register is read into the
shift register.
This register is written to by the remote system upgrade circuitry on every reconfiguration to record the
cause of the reconfiguration. This information is used by the factory configuration to determine the
appropriate action following a reconfiguration. During a capture cycle, this register is read into the shift
Status register
register.
The remote system upgrade control and status registers are clocked by the 10-MHz
internal oscillator (the same oscillator that controls the user watchdog timer).
However, the remote system upgrade shift and update registers are clocked by the
user clock input (RU_CLK).
Remote System Upgrade Control Register
The remote system upgrade control register stores the application configuration page
address and user watchdog timer settings. The control register functionality depends
on the remote system upgrade mode selection. In remote update mode, the control
register page address bits are set to all zeros (24'b0=0×000000) at power up to load
the factory configuration. A factory configuration in remote update mode has write
access to this register.
Figure 10–26 and Table 10–15 specify the control register bit positions. In the figure,
the numbers show the bit position of a setting within a register. For example, bit
number 25 is the enable bit for the watchdog timer.
Figure 10–26. Remote System Upgrade Control Register
37 36 35 34 33 32 31 30 29 28 27 26
Wd_timer[11..0]
25
24 23 22 ..
3
2
1
0
Wd_en
AnF
PGM[23..0]
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Dedicated Remote System Upgrade Circuitry
The application-not-factory (AnF) bit indicates whether the current configuration
loaded in the Stratix IV device is the factory configuration or an application
configuration. This bit is set low by the remote system upgrade circuitry when an
error condition causes a fall-back to the factory configuration. When the AnFbit is
high, the control register access is limited to read operations. When the AnFbit is low,
the register allows write operations and disables the watchdog timer.
In remote update mode, the factory configuration design sets this bit high (1'b1) when
updating the contents of the update register with the application page address and
watchdog timer settings.
Table 10–15 lists the remote system upgrade control register contents.
Table 10–15. Remote System Upgrade Control Register Contents
Remote System
Upgrade Mode
Control Register Bit
AnF (1)
Value (2)
1'b0
Definition
Remote update
Remote update
Remote update
Application not factory
AS configuration start address
StAdd[23..0])
PGM[23..0]
Wd_en
24'b0×000000
1'b0
(
User watchdog timer enable bit
User watchdog time-out value
(most significant 12 bits of 29-bit
count value: {Wd_timer[11..0],
Wd_timer[11..0]
Remote update
12'b000000000000
17'b0}
)
Notes to Table 10–15:
(1) In remote update mode, the remote configuration block does not update the AnFbit automatically (you can update it manually).
(2) This is the default value of the control register bit.
Remote System Upgrade Status Register
The remote system upgrade status register specifies the reconfiguration trigger
condition. The various trigger and error conditions include:
■
■
■
Cyclic redundancy check (CRC) error during application configuration
nSTATUSassertion by an external device due to an error
Stratix IV device logic array triggered a reconfiguration cycle, possibly after
downloading a new application configuration image
■
■
External configuration reset (nCONFIG) assertion
User watchdog timer time-out
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Dedicated Remote System Upgrade Circuitry
Figure 10–27 and Table 10–16 specify the contents of the status register. The numbers
in the figure show the bit positions within a 5-bit register.
Figure 10–27. Remote System Upgrade Status Register
4
3
2
1
0
Wd nCONFIG Core_nCONFIG nSTATUS CRC
Table 10–16. Remote System Upgrade Status Register Contents
Status Register Bit
CRC(from the configuration)
nSTATUS
Definition
POR Reset Value
1 bit '0'
CRCerror caused reconfiguration
nSTATUScaused reconfiguration
Device logic array caused reconfiguration
nCONFIGcaused reconfiguration
Watchdog timer caused reconfiguration
1 bit '0'
CORE_nCONFIG (1)
nCONFIG
1 bit '0'
1 bit '0'
Wd
1 bit '0'
Note to Table 10–16:
(1) Logic array reconfiguration forces the system to load the application configuration data into the Stratix IV device. This occurs after the factory
configuration specifies the appropriate application configuration page address by updating the update register.
Remote System Upgrade State Machine
The remote system upgrade control and update registers have identical bit
definitions, but serve different roles (refer to Table 10–14 on page 10–57). While both
registers can only be updated when the device is loaded with a factory configuration
image, the update register writes are controlled by the user logic; the control register
writes are controlled by the remote system upgrade state machine.
In factory configurations, the user logic sends the AnFbit (set high), the page address,
and the watchdog timer settings for the next application configuration bit to the
update register. When the logic array configuration reset (RU_nCONFIG) goes low, the
remote system upgrade state machine updates the control register with the contents
of the update register and initiates system reconfiguration from the new application
page.
1
To ensure successful reconfiguration between the pages, assert the RU_nCONFIGsignal
for a minimum of 250 ns. This is equivalent to strobing the reconfiguration input of
the ALTREMOTE_UPDATE megafunction high for a minimum of 250 ns.
In the event of an error or reconfiguration trigger condition, the remote system
upgrade state machine directs the system to load a factory or application
configuration (page zero or page one, based on the mode and error condition) by
setting the control register accordingly. Table 10–17 lists the contents of the control
register after such an event occurs for all possible error or trigger conditions.
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Dedicated Remote System Upgrade Circuitry
The remote system upgrade status register is updated by the dedicated error
monitoring circuitry after an error condition but before the factory configuration is
loaded.
Table 10–17. Control Register Contents after an Error or Reconfiguration Trigger Condition
Control Register Setting
Reconfiguration Error/Trigger
Remote Update
nCONFIGreset
nSTATUSerror
All bits are 0
All bits are 0
Update register
All bits are 0
All bits are 0
COREtriggered reconfiguration
CRCerror
Wdtime out
Capture operations during factory configuration access the contents of the update
register. This feature is used by the user logic to verify that the page address and
watchdog timer settings were written correctly. Read operations in application
configurations access the contents of the control register. This information is used by
the user logic in the application configuration.
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Dedicated Remote System Upgrade Circuitry
User Watchdog Timer
The user watchdog timer prevents a faulty application configuration from stalling the
device indefinitely. The system uses the timer to detect functional errors after an
application configuration is successfully loaded into the Stratix IV device.
The user watchdog timer is a counter that counts down from the initial value loaded
into the remote system upgrade control register by the factory configuration. The
counter is 29 bits wide and has a maximum count value of 229. When specifying the
user watchdog timer value, specify only the most significant 12 bits. The granularity
of the timer setting is 217 cycles. The cycle time is based on the frequency of the
10-MHz internal oscillator. Table 10–18 lists the operating range of the 10-MHz
internal oscillator.
Table 10–18. 10-MHz Internal Oscillator Specifications (Note 1)
Minimum
Typical
Maximum
Units
4.3
5.3
10
MHz
Note to Table 10–18:
(1) These values are preliminary.
The user watchdog timer begins counting after the application configuration enters
device user mode. This timer must be periodically reloaded or reset by the application
configuration before the timer expires by asserting RU_nRSTIMER. If the application
configuration does not reload the user watchdog timer before the count expires, a
time-out signal is generated by the remote system upgrade dedicated circuitry. The
time-out signal tells the remote system upgrade circuitry to set the user watchdog
timer status bit (Wd) in the remote system upgrade status register and reconfigures the
device by loading the factory configuration.
1
1
To allow remote system upgrade dedicated circuitry to reset the watchdog timer, you
must assert the RU_nRSTIMERsignal active for a minimum of 250 ns. This is equivalent
to strobing the reset_timerinput of the ALTREMOTE_UPDATE megafunction high
for a minimum of 250 ns.
The user watchdog timer is not enabled during the configuration cycle of the device.
Errors during configuration are detected by the CRC engine. Also, the timer is
disabled for factory configurations. Functional errors should not exist in the factory
configuration because it is stored and validated during production and is never
updated remotely.
The user watchdog timer is disabled in factory configurations and during the
configuration cycle of the application configuration. It is enabled after the application
configuration enters user mode.
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Quartus II Software Support
Quartus II Software Support
The Quartus II software provides the flexibility to include the remote system upgrade
interface between the Stratix IV device logic array and the dedicated circuitry,
generate configuration files for production, and allows remote programming of the
system configuration memory.
The ALTREMOTE_UPDATE megafunction is the implementation option in the
Quartus II software that you use for the interface between the remote system upgrade
circuitry and the device logic array interface. Using the megafunction block instead of
creating your own logic saves design time and offers more efficient logic synthesis
and device implementation.
ALTREMOTE_UPDATE Megafunction
The ALTREMOTE_UPDATE megafunction provides a memory-like interface to the
remote system upgrade circuitry and handles the shift register read and write
protocol in the Stratix IV device logic. This implementation is suitable for designs that
implement the factory configuration functions using a Nios II processor or user logic
in the device.
Figure 10–28 shows the interface signals between the ALTREMOTE_UPDATE
megafunction and Nios II processor or user logic.
Figure 10–28. Interface Signals between the ALTREMOTE_UPDATE Megafunction and the Nios II Processor
ALTREMOTE_UPDATE
read_param
write_param
param[2..0]
data_in[23..0]
Nios II Processor or
User Logic
reconfig
reset_timer
clock
reset
busy
data_out[23..0]
f
For more information about the ALTREMOTE_UPDATE megafunction and the
description of ports shown in Figure 10–28, refer to the Remote Update Circuitry
(ALTREMOTE_UPDATE) Megafunction User Guide.
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Chapter 10: Configuration, Design Security, and Remote System Upgrades in Stratix IV Devices
Design Security
Design Security
This section provides an overview of the design security feature and its
implementation on Stratix IV devices using the advanced encryption standard (AES).
It also covers the new security modes available in Stratix IV devices.
As Stratix IV devices continue play a role in larger and more critical designs in
competitive commercial and military environments, it is increasingly important to
protect the designs from copying, reverse engineering, and tampering.
Stratix IV devices address these concerns with both volatile and non-volatile security
feature support. Stratix IV devices have the ability to decrypt configuration bitstreams
using the AES algorithm, an industry-standard encryption algorithm that is FIPS-197
certified. Stratix IV devices have a design security feature that utilizes a 256-bit
security key.
Stratix IV devices store configuration data in SRAM configuration cells during device
operation. Because SRAM is volatile, the SRAM cells must be loaded with
configuration data each time the device powers up. It is possible to intercept
configuration data when it is being transmitted from the memory source (flash
memory or a configuration device) to the device. The intercepted configuration data
could then be used to configure another device.
When using the Stratix IV design security feature, the security key is stored in the
Stratix IV device. Depending on the security mode, you can configure the Stratix IV
device using a configuration file that is encrypted with the same key, or for board
testing, configured with a normal configuration file.
The design security feature is available when configuring Stratix IV devices using FPP
configuration mode with an external host (such as a MAX II device or
microprocessor), or when using fast AS or PS configuration schemes. The design
security feature is also available in remote update with fast AS configuration mode.
The design security feature is not available when you are configuring your Stratix IV
device using JTAG-based configuration. For more information, refer to “Supported
Configuration Schemes” on page 10–67.
1
When using a serial configuration scheme such as PS or fast AS, configuration time is
the same whether or not you enable the design security feature. If the FPP scheme is
used with the design security or decompression feature, a ×4 DCLKis required. This
results in a slower configuration time when compared with the configuration time of
a Stratix IV device that has neither the design security nor the decompression feature
enabled.
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Design Security
Stratix IV Security Protection
Stratix IV device designs are protected from copying, reverse engineering, and
tampering using configuration bitstream encryption.
Security Against Copying
The security key is securely stored in the Stratix IV device and cannot be read out
through any interfaces. In addition, as configuration file read-back is not supported in
Stratix IV devices, the design information cannot be copied.
Security Against Reverse Engineering
Reverse engineering from an encrypted configuration file is very difficult and time
consuming because the Stratix IV configuration file formats are proprietary and the
file contains millions of bits which require specific decryption. Reverse engineering
the Stratix IV device is just as difficult because the device is manufactured on the most
advanced 40-nm process technology.
Security Against Tampering
The non-volatile keys are one-time programmable. After the Tamper Protection bit is
set in the key programming file generated by the Quartus II software, the Stratix IV
device can only be configured with configuration files encrypted with the same key.
AES Decryption Block
The main purpose of the AES decryption block is to decrypt the configuration
bitstream prior to entering data decompression or configuration.
Prior to receiving encrypted data, you must enter and store the 256-bit security key in
the device. You can choose between a non-volatile security key and a volatile security
key with battery backup.
The security key is scrambled prior to storing it in the key storage to make it more
difficult for anyone to retrieve the stored key using de-capsulation of the device.
Flexible Security Key Storage
Stratix IV devices support two types of security key programming—volatile and
non-volatile keys. Table 10–19 lists the differences between volatile keys and
non-volatile keys.
Table 10–19. Security Key Options (Part 1 of 2)
Options
Key programmability
External battery
Volatile Key
Non-Volatile Key
Reprogrammable and erasable One-time programmable
Required
Not required
Key programming method (1) On-board
On and off board
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Design Security
Table 10–19. Security Key Options (Part 2 of 2)
Options
Volatile Key
Non-Volatile Key
Secure against copying and
reverse engineering. Tamper
resistant if tamper protection
bit is set.
Secure against copying and
reverse engineering
Design protection
Note to Table 10–19:
(1) Key programming is carried out using the JTAG interface.
You can program the non-volatile key to the Stratix IV device without an external
battery. Also, there are no additional requirements to any of the Stratix IV power
supply inputs.
V
CCBAT is a dedicated power supply for volatile key storage and not shared with other
on-chip power supplies, such as VCCIO or VCC. VCCBAT continuously supplies power to
the volatile register regardless of the on-chip supply condition.
1
1
After power-up, you must wait 300 ms (PORSEL= 0) or 12 ms (PORSEL= 1) before
beginning key programming to ensure that VCCBAT is at full rail.
For more information about how to calculate the key retention time of the battery
used for volatile key storage, refer to the Stratix III, Stratix IV, Stratix V, HardCopy III
and HardCopy IV PowerPlay Early Power Estimator.
f
f
For more information about battery specifications, refer to the DC and Switching
Characteristics for Stratix IV Devices chapter.
For more information about the VCCBAT pin connection recommendations, refer to the
Stratix IV GX and Stratix IV E Device Family Pin Connection Guidelines.
Stratix IV Design Security Solution
Stratix IV devices are SRAM-based devices. To provide design security, Stratix IV
devices require a 256-bit security key for configuration bitstream encryption.
You can carry out secure configuration in the following steps, as shown in
Figure 10–29:
1. Program the security key into the Stratix IV device.
2. Program the user-defined 256-bit AES keys to the Stratix IV device through the
JTAG interface.
3. Encrypt the configuration file and store it in the external memory.
4. Encrypt the configuration file with the same 256-bit keys used to program the
Stratix IV device. Encryption of the configuration file is done using the Quartus II
software. The encrypted configuration file is then loaded into the external
memory, such as a configuration or flash device.
5. Configure the Stratix IV device.
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Design Security
At system power-up, the external memory device sends the encrypted configuration
file to the Stratix IV device.
Figure 10–29. Design Security (Note 1)
Stratix IV Device
Key Storage
User-Defined
AES Key
Step 1
AES
Decryption
Step 3
Memory or
Configuration
Device
Encrypted
Configuration
File
Step 2
Note to Figure 10–29:
(1) Step 1, Step 2, and Step 3 correspond to the procedure described in “Design Security” on page 10–63.
Security Modes Available
The following security modes are available on the Stratix IV device.
Volatile Key
Secure operation with volatile key programmed and required external battery: this
mode accepts both encrypted and unencrypted configuration bitstreams. Use the
unencrypted configuration bitstream support for board-level testing only.
Non-Volatile Key
Secure operation with one time programmable (OTP) security key programmed: this
mode accepts both encrypted and unencrypted configuration bitstreams. Use the
unencrypted configuration bitstream support for board level testing only.
Non-Volatile Key with Tamper Protection Bit Set
Secure operation in tamper resistant mode with OTP security key programmed: only
encrypted configuration bitstreams are allowed to configure the device. Tamper
protection disables JTAG configuration with unencrypted configuration bitstream.
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Design Security
1
Enabling the tamper protection bit disables test mode in Stratix IV devices. This
process is irreversible and prevents Altera from conducting carry-out failure analysis
if test mode is disabled. Contact Altera Technical Support to enable the tamper
protection bit.
No Key Operation
Only unencrypted configuration bitstreams are allowed to configure the device.
Table 10–20 lists the different security modes and configuration bitstream supported
for each mode.
Table 10–20. Security Modes Supported
Mode (1)
Function
Configuration File
Encrypted
Secure
Volatile key
Board-level testing
Secure
Unencrypted
Encrypted
Non-volatile key
Board-level testing
Unencrypted
Non-volatile key with tamper
protection bit set
Secure (tamper resistant) (2)
Encrypted
Notes to Table 10–20:
(1) In No key operation, only the unencrypted configuration file is supported.
(2) The tamper protection bit setting does not prevent the device from being reconfigured.
Supported Configuration Schemes
The Stratix IV device supports only selected configuration schemes, depending on the
security mode you select when you encrypt the Stratix IV device.
Figure 10–30 shows the restrictions of each security mode when encrypting Stratix IV
devices.
Figure 10–30. Security Modes in Stratix IV Devices—Sequence and Restrictions
No Key
Unencrypted
Configuration File
Volatile Key
Non-Volatile Key
Unencrypted or
Encrypted
Unencrypted or
Encrypted
Configuration File
Configuration File
Non-Volatile Key
with
Tamper-Protection
Bit Set
Encrypted
Configuration File
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Design Security
Table 10–21 lists the configuration modes allowed in each of the security modes.
Table 10–21. Allowed Configuration Modes for Various Security Modes (Note 1)
Configuration
Security Mode
Allowed Configuration Modes
File
No key
Unencrypted All configuration modes that do not engage the design security feature.
■ Passive serial with AES (and/or with decompression)
■ Fast passive parallel with AES (and/or with decompression)
Encrypted
Secure with volatile key
■ Remote update fast AS with AES (and/or with decompression)
■ Fast AS (and/or with decompression)
Board-level testing with
volatile key
Unencrypted All configuration modes that do not engage the design security feature.
■ Passive serial with AES (and/or with decompression)
■ Fast passive parallel with AES (and/or with decompression)
Encrypted
Secure with non-volatile key
■ Remote update fast AS with AES (and/or with decompression)
■ Fast AS (and/or with decompression)
Board-level testing with
non-volatile key
Unencrypted All configuration modes that do not engage the design security feature.
■ Passive serial with AES (and/or with decompression)
Secure in tamper resistant
mode using non-volatile key
with tamper protection set
■ Fast passive parallel with AES (and/or with decompression)
Encrypted
■ Remote update fast AS with AES (and/or with decompression)
■ Fast AS (and/or with decompression)
Note to Table 10–21:
(1) There is no impact to the configuration time required when compared with unencrypted configuration modes except FPP with AES (and/or
decompression), which requires a DCLKthat is ×4 the data rate.
You can use the design security feature with other configuration features, such as
compression and remote system upgrade features. When you use compression with
the design security feature, the configuration file is first compressed and then
encrypted using the Quartus II software. During configuration, the Stratix IV device
first decrypts and then decompresses the configuration file.
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Design Security
Document Revision History
Table 10–22 lists the revision history for this chapter.
Table 10–22. Document Revision History (Part 1 of 2)
Date
Version
Changes
■ Updated the “FPP Configuration Using a MAX II Device as an External Host”, “Fast Active
Serial Configuration (Serial Configuration Devices)”, and “PS Configuration Using a
MAX II Device as an External Host”.
April 2011
3.3
■ Updated Table 10–10.
■ Updated the “Fast Active Serial Configuration (Serial Configuration Devices)”, “FPP
Configuration Using a MAX II Device as an External Host” “Configuration Data
Decompression”, and “User Watchdog Timer” sections.
February 2011
3.2
3.1
■ Updated Table 10–2, Table 10–4, Table 10–5, Table 10–7, and Table 10–9.
■ Applied new template.
■ Minor text edits.
■ Added the “Guidelines for Connecting Serial Configuration Devices on an AS Interface”
section.
■ Updated the “Power-On Reset Circuit” and “Fast Active Serial Configuration (Serial
Configuration Devices)” sections.
March 2010
■ Updated Table 10–2, Table 10–4, Table 10–5, Table 10–10, and Table 10–13.
■ Updated Figure 10–16 and Figure 10–17 with Note 5.
■ Updated Figure 10–4, Figure 10–5, and Figure 10–13.
■ Updated the reference in the “Configuration Schemes” section.
■ Updated Table 10–1 and Table 10–2.
■ Updated the “FPP Configuration Using a MAX II Device as an External Host”,“Fast Active
Serial Configuration (Serial Configuration Devices)”, “Device Configuration Pins”,
“Remote System Upgrades”, “Remote System Upgrade Mode”, “Estimating Active Serial
Configuration Time”, “Remote System Upgrade State Machine”, and “User Watchdog
Timer” sections.
November 2009
3.0
■ Removed Table 10-4, Table 10-7, Table 10-8, and Table 10-25.
■ Minor text edits.
■ Updated the “VCCPD Pins”, “FPP Configuration Using a MAX II Device as an External
Host”, “Estimating Active Serial Configuration Time”, “Fast Active Serial Configuration
(Serial Configuration Devices)”, “Remote System Upgrades”, “PS Configuration Using a
MAX II Device as an External Host”, and “PS Configuration Using a Download Cable”
sections.
June 2009
2.3
■ Updated Table 10–3, Table 10–13 and Table 10–2.
■ Added introductory sentences to improve search ability.
■ Removed the Conclusion section.
■ Minor text edits.
April 2009
2.2
2.1
■ Updated Table 10–2.
■ Updated Table 10–1, Table 10–2, and Table 10–9.
■ Removed “Referenced Documents” section.
March 2009
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Design Security
Table 10–22. Document Revision History (Part 2 of 2)
Date
November 2008
May 2008
Version
Changes
■ Updated “Fast Active Serial Configuration (Serial Configuration Devices)” and “JTAG
Configuration” sections.
2.0
■ Updated Figure 10–4, Figure 10–5, Figure 10–6, and Figure 10–13.
■ Updated Table 10–2 and Table 10–13.
Initial release.
1.0
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Design Security
Stratix IV Device Handbook Volume 1
April 2011 Altera Corporation
11. SEU Mitigation in Stratix IV Devices
February 2011
SIV51011-3.2
SIV51011-3.2
This chapter describes how to use the error detection cyclical redundancy check
(CRC) feature when a Stratix® IV device is in user mode and recovers from CRC
errors. The purpose of the error detection CRC feature in the Stratix IV device is to
detect a flip in any of the configuration random access memory (CRAM) bits in
Stratix IV devices due to a soft error. With the error detection circuitry, you can
continuously verify the integrity of the configuration CRAM bits.
In critical applications such as avionics, telecommunications, system control, and
military applications, it is important to be able to do the following:
■
Confirm that the configuration data stored in a Stratix IV device is correct
Alert the system to the occurrence of a configuration error
■
1
The error detection feature is enhanced in the Stratix IV device family. Similar to
Stratix III devices, the error detection and recovery time for single-event upset (SEU)
in Stratix IV devices is reduced when compared with Stratix II devices.
f
For more information about test methodology for enhanced error detection in
Stratix IV devices, refer to AN 539: Test Methodology of Error Detection and Recovery
using CRC in Altera FPGA Devices.
Dedicated circuitry is built into Stratix IV devices and consists of a CRC error
detection feature that optionally checks for SEUs continuously and automatically.
1
For Stratix IV devices, the error detection CRC feature is provided in the Quartus® II
software version 8.0 and onwards.
Using error detection CRC for the Stratix IV device family has no impact on fitting or
performance of your device.
This chapter contains the following sections:
■
■
■
■
■
■
■
“Error Detection Fundamentals” on page 11–2
“Configuration Error Detection” on page 11–2
“User Mode Error Detection” on page 11–2
“Error Detection Pin Description” on page 11–5
“Error Detection Block” on page 11–6
“Error Detection Timing” on page 11–8
“Recovering From CRC Errors” on page 11–11
© 2011 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX are Reg. U.S. Pat. & Tm. Off.
and/or trademarks of Altera Corporation in the U.S. and other countries. All other trademarks and service marks are the property of their respective holders as described at
www.altera.com/common/legal.html. Altera warrants performance of its semiconductor products to current specifications in accordance with Altera’s standard warranty, but
reserves the right to make changes to any products and services at any time without notice. Altera assumes no responsibility or liability arising out of the application or use of any
information, product, or service described herein except as expressly agreed to in writing by Altera. Altera customers are advised to obtain the latest version of device
specifications before relying on any published information and before placing orders for products or services.
Stratix IV Device Handbook Volume 1
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11–2
Chapter 11: SEU Mitigation in Stratix IV Devices
Error Detection Fundamentals
Error Detection Fundamentals
Error detection determines whether the data received is corrupted during
transmission. To accomplish this, the transmitter uses a function to calculate a
checksum value for the data and appends the checksum to the original data frame.
The receiver uses the same calculation methodology to generate a checksum for the
received data frame and compares the received checksum to the transmitted
checksum. If the two checksum values are equal, the received data frame is correct
and no data corruption occurred during transmission or storage.
The error detection CRC feature uses the same concept. When Stratix IV devices are
configured successfully and are in user mode, the error detection CRC feature ensures
the integrity of the configuration data.
1
There are two CRC error checks. One CRC error check always runs during
configuration and a second optional CRC error check runs in the background in user
mode. Both CRC error checks use the same CRC polynomial but different error
detection implementations. For more information, refer to the “Configuration Error
Detection” and “User Mode Error Detection” sections.
Configuration Error Detection
In configuration mode, a frame-based CRC is stored within the configuration data
and contains the CRC value for each data frame.
During configuration, the Stratix IV device calculates the CRC value based on the
frame of data that is received and compares it against the frame CRC value in the data
stream. Configuration continues until either the device detects an error or
configuration is completed.
In Stratix IV devices, the CRC value is calculated during the configuration stage. A
parallel CRC engine generates 16 CRC check bits per frame and then stores them in
CRAM. The CRAM chain used for storing the CRC check bits is 16 bits wide and its
length is equal to the number of frames in the device.
User Mode Error Detection
Stratix IV devices have built-in error detection circuitry to detect data corruption by
soft errors in the CRAM cells. This feature allows all CRAM contents to be read and
verified to match a configuration-computed CRC value. Soft errors are changes in a
CRAM bit state due to an ionizing particle.
The error detection capability continuously computes the CRC of the configured
CRAM bits and compares it with the pre-calculated CRC. If the CRCs match, there is
no error in the current configuration CRAM bits. The process of error detection
continues until the device is reset (by setting nCONFIGlow).
If you enable the CRC error detection option in the Quartus II software, after the
device transitions into user mode, the error detection process is enabled. The internal
100 MHz configuration oscillator is divided down by a factor of two to 256 (at powers
of two) to be used as the clock source during the error detection process. You must set
the clock divide factor in the Quartus II software.
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11–3
User Mode Error Detection
A single 16-bit CRC calculation is done on a per-frame basis. After it has finished the
CRC calculation for a frame, the resulting 16-bit signature is hex 0000if there are no
CRAM bit errors detected in a frame by the error detection circuitry and the output
signal CRC_ERRORis 0. If a CRAM bit error is detected by the circuitry within a frame in
the device, the resulting signature is non-zero. This causes the CRC engine to start
searching for the error bit location.
Error detection in Stratix IV devices calculates CRC check bits for each frame and
pulls the CRC_ERROR pin high when it detects bit errors in the chip. Within a frame, it
can detect all single-bit, double-bit, and three-bit errors. The probability of more than
three CRAM bits being flipped by an SEU event is very low. In general, for all error
patterns the probability of detection is 99.998%.
The CRC engine reports the bit location and determines the type of error for all
single-bit errors and over 99.641% of double-adjacent errors. The probability of other
error patterns is very low and report of the location of bit flips is not guaranteed by
the CRC engine.
You can also read-out the error bit location through the JTAG and the core interface.
Shift these bits out through either the SHIFT_EDERROR_REGJTAG instruction or the core
interface before the CRC detects the next error in another frame. If the next frame also
has an error, you must shift these bits out within the amount of time of one frame CRC
verification. You can choose to extend this time interval by slowing down the error
detection clock frequency, but this slows down the error recovery time for the SEU
event. For the minimum update interval for Stratix IV devices, refer to Table 11–6 on
page 11–9. If these bits are not shifted out before the next error location is found, the
previous error location and error message is overwritten by the new information. The
CRC circuit continues to run, and if an error is detected, you must decide whether to
complete a reconfiguration or to ignore the CRC error.
The error detection logic continues to calculate the CRC_ERRORand 16-bit signatures for
the next frame of data regardless if any error has occurred in the current frame or not.
You need to monitor these signals and take the appropriate actions if a soft error
occurs.
The error detection circuitry in Stratix IV devices uses a 16-bit CRC-ANSI standard
(16-bit polynomial) as the CRC generator.
The computed 16-bit CRC signature for each frame is stored in the registers within the
core. The total storage register size is 16 (the number of bits per frame) × the number
of frames.
The Stratix IV device error detection feature does not check memory blocks and I/O
buffers. Thus, the CRC_ERRORsignal might stay solid high or low depending on the
error status of the previously checked CRAM frame. The I/O buffers are not verified
during error detection because these bits use flipflops as storage elements that are
more resistant to soft errors when compared with CRAM cells. The support parity bits
of MLAB, M9K, and M144K are used to check the contents of the memory blocks for
any errors. The M144K TriMatrix memory block has a built-in error correction code
block that checks and corrects the errors in the block.
f
For more information, refer to the TriMatrix Embedded Memory Blocks in Stratix IV
Devices chapter.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
11–4
Chapter 11: SEU Mitigation in Stratix IV Devices
User Mode Error Detection
A JTAG instruction, EDERROR_INJECT, is provided to test the capability of the error
detection block. This instruction is able to change the content of the 21-bit JTAG fault
injection register that is used for error injection in Stratix IV devices, enabling the
testing of the error detection block.
1
You can only execute the EDERROR_INJECTJTAG instruction when the device is in user
mode.
Table 11–1 lists the description of the EDERROR_INJECTJTAG instruction.
Table 11–1. EDERROR_INJECT JTAG Instruction
JTAG Instruction
Instruction Code
Description
This instruction controls the 21-bit JTAG fault
injection register, which is used for error
injection.
EDERROR_INJECT
00 0001 0101
You can create a Jam™ file (.jam) to automate the testing and verification process.
This allows you to verify the CRC functionality in-system, on-the-fly, without having
to reconfigure the device. You can then switch to the CRC circuit to check for real
errors induced by an SEU.
You can introduce a single-error or double-errors adjacent to each other to the
configuration memory. This provides an extra way to facilitate design verification and
system fault tolerance characterization. Use the JTAG fault injection register with the
EDERROR_INJECTinstruction to flip the readback bits. The Stratix IV device is then
forced into error test mode.
The content of the JTAG fault injection register is not loaded into the fault injection
register during the processing of the last and first frame. It is only loaded at the end of
this period.
1
You can only introduce error injection in the first data frame, but you can monitor the
error information at any time. For more information about the JTAG fault injection
register and fault injection register, refer to “Error Detection Registers” on page 11–7.
Table 11–2 lists how the fault injection register is implemented and describes error
injection.
Table 11–2. Fault Injection Register
Bit
Bit[20..19]
Error Type
Bit[18..8]
Bit[7..0]
Byte Location of
the Injected Error
Description
Error Byte Value
Error Type (1)
Error injection type
Depicts the location
of the bit error and
corresponds to the
error injection type
selection.
Depicts the location
of the injected error
in the first data
frame.
Bit[20]
Bit[19]
Content
0
1
0
1
0
0
Single-byte error injection
Double-adjacent byte error injection
No error injection
Note to Table 11–2:
(1) Bit[20]and Bit[19]cannot both be set to 1 as this is not a valid selection. The error detection circuitry decodes this as no error injection.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 11: SEU Mitigation in Stratix IV Devices
11–5
Error Detection Pin Description
1
After the test completes, Altera recommends reconfiguring the device.
Automated Single-Event Upset Detection
Stratix IV devices offer on-chip circuitry for automated checking of SEU detection.
Some applications that require the device to operate error-free in high-neutron flux
environments require periodic checks to ensure continued data integrity. The error
detection CRC feature ensures data reliability and is one of the best options for
mitigating SEU.
You can implement the error detection CRC feature with existing circuitry in
Stratix IV devices, eliminating the need for external logic. The CRC_ERRORpin reports a
soft error when the configuration CRAM data is corrupted. You must decide whether
to reconfigure the device or to ignore the error.
Error Detection Pin Description
Depending on the type of error detection feature you choose, you must use different
error detection pins to monitor the data during user mode.
CRC_ERROR Pin
Table 11–3 describes the CRC_ERRORpin.
Table 11–3. CRC_ERROR Pin Description
Pin Name
Pin Type
Description
Active-high signal indicates that the error detection circuit has detected errors in the
configuration CRAM bits. This pin is optional and is used when the error detection CRC
circuit is enabled. When the error detection CRC circuit is disabled, it is a user I/O pin.
I/O and
open-drain
CRC_ERROR
To use the CRC_ERRORpin, you can either tie this pin to VCCPGM through a 10k resistor or,
depending on the input voltage specification of the system receiving the signal, you can tie
this pin to a different pull-up voltage.
1
The WYSIWYG function performs optimization on the Verilog Quartus Mapping
(VQM) netlist within the Quartus II software.
f
For more information about the stratixiv_crcblockWYSIWYG function, refer to the
AN 539: Test Methodology of Error Detection and Recovery using CRC in Altera FPGA
Devices.
f
For more information about the CRC_ERRORpin for Stratix IV devices, refer to Device
Pin-Outs on the Altera website.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
11–6
Chapter 11: SEU Mitigation in Stratix IV Devices
Error Detection Block
Error Detection Block
You can enable the Stratix IV device error detection block in the Quartus II software
(refer to “Software Support” on page 11–10). This block contains the logic necessary to
calculate the 16-bit CRC signature for the configuration CRAM bits in the device.
The CRC circuit continues running even if an error occurs. When a soft error occurs,
the device sets the CRC_ERRORpin high. Two types of CRC detection checks the
configuration bits:
■
CRAM error checking ability (16-bit CRC), which occurs during user mode to be
used by the CRC_ERRORpin.
■
For each frame of data, the pre-calculated 16-bit CRC enters the CRC circuit at
the end of the frame data and determines whether there is an error or not.
■
■
If an error occurs, the search engine starts to find the location of the error.
The error messages are shifted out through the JTAG instruction or core
interface logics while the error detection block continues running.
■
■
The JTAG interface reads out the 16-bit CRC result for the first frame and also
shifts the 16-bit CRC bits to the 16-bit CRC storage registers for test purposes.
Single error, double errors, or double-errors adjacent to each other are
deliberately introduced to configuration memory for testing and design
verification.
■
16-bit CRC that is embedded in every configuration data frame.
■
During configuration, after a frame of data is loaded into the Stratix IV device,
the pre-computed CRC is shifted into the CRC circuitry.
■
At the same time, the CRC value for the data frame shifted-in is calculated. If
the pre-computed CRC and calculated CRC values do not match, nSTATUSis set
low. Every data frame has a 16-bit CRC; therefore, there are many 16-bit CRC
values for the whole configuration bitstream. Every device has different
lengths of configuration data frame.
1
The “Error Detection Block” section describes the 16-bit CRC only when the device is
in user mode.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 11: SEU Mitigation in Stratix IV Devices
11–7
Error Detection Block
Error Detection Registers
There is one set of 16-bit registers in the error detection circuitry that stores the
computed CRC signature. A non-zero value on the syndrome register causes the
CRC_ERRORpin to be set high.
Figure 11–1 shows the error detection circuitry, syndrome registers, and error injection
block.
Figure 11–1. Error Detection Block Diagram
16-Bit CRC
Readback bit
stream with
expected CRC
included
Syndrome
Register
Calculation and Error
Search Engine
8
Error Detection
State Machine
Control Signals
30
16
Error Message
Register
CRC_ERROR
46
Error Injection Block
Fault Injection
Register
JTAG Update
User Update
Register
Register
JTAG Fault
Injection Register
JTAG Shift
Register
User Shift
Register
General Routing
JTAG TDO
Table 11–4 lists the registers shown in Figure 11–1.
Table 11–4. Error Detection Registers (Part 1 of 2)
Register
Description
This register contains the CRC signature of the current frame through the error detection
verification cycle. The CRC_ERRORsignal is derived from the contents of this register.
Syndrome Register
This 46-bit register contains information on the error type, location of the error, and the actual
syndrome. The types of errors and location reported are single- and double-adjacent bit errors.
The location bits for other types of errors are not identified by the error message register. The
content of the register can be shifted out through the SHIFT_EDERROR_REGJTAG instruction or to
the core through the core interface.
Error Message
Register
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
11–8
Chapter 11: SEU Mitigation in Stratix IV Devices
Error Detection Timing
Table 11–4. Error Detection Registers (Part 2 of 2)
Register
Description
This register is automatically updated with the contents of the error message register one cycle
after the 46-bit register content is validated. It includes a clock enable that must be asserted prior
JTAG Update Register to being sampled into the JTAG shift register. This requirement ensures that the JTAG update
register is not being written into by the contents of the error message register at the same time
that the JTAG shift register is reading its contents.
This register is automatically updated with the contents of the Error Message Register, one cycle
after the 46-bit register content is validated. It includes a clock enable that must be asserted prior
to being sampled into the User Shift Register. This requirement ensures that the User Update
Register is not being written into by the contents of the Error Message Register at exactly the
same time that the User Shift Register is reading its contents.
User Update Register
This register is accessible by the JTAG interface and allows the contents of the JTAG Update
JTAG Shift Register
User Shift Register
Register to be sampled and read by the JTAG instruction SHIFT_EDERROR_REG
.
This register is accessible by the core logic and allows the contents of the User Update Register to
be sampled and read by user logic.
JTAG Fault Injection
Register
This 21-bit register is fully controlled by the JTAG instruction EDERROR_INJECT. This register
holds the information of the error injection that you want in the bitstream.
The content of the JTAG Fault Injection Register is loaded into this 21-bit register when it is being
updated.
Fault Injection Register
Error Detection Timing
When you enable the CRC feature through the Quartus II software, the device
automatically activates the CRC process after entering user mode, after configuration,
and after initialization is complete.
If an error is detected within a frame, CRC_ERRORis driven high at the end of the error
location search, after the error message register is updated. At the end of this cycle,
the CRC_ERRORpin is pulled low for a minimum of 32 clock cycles. If the next frame
contains an error, CRC_ERRORis driven high again after the error message register is
overwritten by the new value. You can start to unload the error message on each
rising edge of the CRC_ERRORpin. Error detection runs until the device is reset.
The error detection circuitry runs off an internal configuration oscillator with a divisor
that sets the maximum frequency. Table 11–5 lists the minimum and maximum error
detection frequencies based on the best performance of the internal configuration
oscillator.
Table 11–5. Minimum and Maximum Error Detection Frequencies
Error Detection
Frequency
Maximum Error
Detection Frequency
Minimum Error Detection
Frequency
Device Type
Valid Divisors (n)
Stratix IV
100 MHz / 2n
50 MHz
390 kHz
1, 2, 3, 4, 5, 6, 7, 8
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 11: SEU Mitigation in Stratix IV Devices
11–9
Error Detection Timing
You can set a lower clock frequency by specifying a division factor in the Quartus II
software (refer to “Software Support” on page 11–10). The divisor is a power of two,
in which n is between 1 and 8. The divisor ranges from 2 through 256. Refer to
Equation 11–1.
Equation 11–1.
100 MHz
error detection frequency = -----------------------
2n
1
The error detection frequency reflects the frequency of the error detection process for
a frame because the CRC calculation in the Stratix IV device is done on a per-frame
basis.
You must monitor the error message to avoid missing information in the error
message register. The error message register is updated whenever an error occurs. The
minimum interval time between each update for the error message register depends
on the device and the error detection clock frequency.
Table 11–6 lists the estimated minimum interval time between each update for the
error message register for Stratix IV devices.
Table 11–6. Minimum Update Interval for Error Message Register (Note 1)
Device
Timing Interval (s)
EP4SGX70
EP4SGX110
EP4SGX180
EP4SGX230
EP4SGX290
EP4SGX360
EP4SGX530
EP4SE230
EP4SE360
EP4SE530
EP4SE820
EP4S40G2
EP4S40G5
EP4S100G2
EP4S100G3
EP4S100G4
EP4S100G5
13.8
13.8
19.8
19.8
21.8
21.8
26.8
19.8
21.8
26.8
33.8
19.8
26.8
19.8
26.8
26.8
26.8
Note to Table 11–6:
(1) These timing numbers are preliminary.
CRC calculation time for the error detection circuitry to check from the first until the
last frame depends on the device and the error detection clock frequency.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
11–10
Chapter 11: SEU Mitigation in Stratix IV Devices
Error Detection Timing
Table 11–7 lists the estimated time for each CRC calculation with minimum and
maximum clock frequencies for Stratix IV devices. The minimum CRC calculation
time is calculated by using the maximum error detection frequency with a divisor
factor of one, and the maximum CRC calculation time is calculated by using the
minimum error detection frequency with a divisor factor of eight.
Table 11–7. CRC Calculation Time (Note 1)
Device
Minimum Time (ms)
Maximum Time (s)
30.90
EP4SGX70
EP4SGX110
EP4SGX180
EP4SGX230
EP4SGX290
EP4SGX360
EP4SGX530
EP4SE230
EP4SE360
EP4SE530
EP4SE820
EP4S40G2
EP4S40G5
EP4S100G2
EP4S100G3
EP4S100G4
EP4S100G5
111
111
225
225
296
296
398
225
296
398
577
225
398
225
398
398
398
30.90
62.44
62.44
82.05
82.05
110.38
62.44
82.05
110.38
160.00
62.44
110.38
62.44
110.38
110.38
110.38
Note to Table 11–7:
(1) These timing numbers are preliminary.
Software Support
The Quartus II software version 8.0 and onwards supports the error detection CRC
feature for Stratix IV devices. Enabling this feature generates the CRC_ERRORoutput to
the optional dual purpose CRC_ERRORpin.
The error detection CRC feature is controlled by the Device and Pin Options dialog
box in the Quartus II software.
To enable the error detection feature using CRC, follow these steps:
1. Open the Quartus II software and load a project using a Stratix IV device.
2. On the Assignments menu, click Settings. The Settings dialog box is shown.
3. In the Category list, select Device. The Device page is shown.
4. Click Device and Pin Options. The Device and Pin Options dialog box is shown
(refer to Figure 11–2).
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 11: SEU Mitigation in Stratix IV Devices
11–11
Recovering From CRC Errors
5. In the Device and Pin Options dialog box, click the Error Detection CRC tab.
6. Turn on Enable error detection CRC (Figure 11–2).
Figure 11–2. Enabling the Error Detection CRC Feature in the Quartus II Software
7. In the Divide error check frequency by pull-down list, enter a valid divisor as
listed in Table 11–5 on page 11–8.
1
The divide value divides the frequency of the configuration oscillator output clock
that clocks the CRC circuitry.
8. Click OK.
Recovering From CRC Errors
The system that the Stratix IV device resides in must control device reconfiguration.
After detecting an error on the CRC_ERRORpin, strobing the nCONFIGsignal low directs
the system to perform the reconfiguration at a time when it is safe for the system to
reconfigure the device.
When the data bit is rewritten with the correct value by reconfiguring the device, the
device functions correctly.
While soft errors are uncommon in Altera devices, certain high-reliability applications
require a design to account for these errors.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
11–12
Chapter 11: SEU Mitigation in Stratix IV Devices
Recovering From CRC Errors
Document Revision History
Table 11–8 lists the revision history for this chapter.
Table 11–8. Document Revision History
Date
Version
Changes
■ Applied new template.
■ Minor Text edits.
February 2011
3.2
■ Updated Table 11–3 and Table 11–6.
■ Minor text edits.
March 2010
3.1
3.0
■ Updated Table 11–3, Table 11–5, Table 11–6, and Table 11–7.
■ Updated the “CRC_ERROR Pin” section.
■ Minor text edits.
November 2009
■ Added an introductory paragraph to increase search ability.
■ Removed the Conclusion section.
■ Minor text edits.
June 2009
April 2009
2.3
2.2
■ Updated Table 11–6 and Table 11–7.
■ Updated “Error Detection Timing” section.
■ Updated Table 11–6.
March 2009
2.1
■ Added Table 11–7.
■ Removed “Critical Error Detection”, “Critical Error Pin”, and “Referenced Documents”
sections.
November 2008
May 2008
2.0
1.0
Minor text edits.
Initial release.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
12. JTAG Boundary-Scan Testing in
Stratix IV Devices
February 2011
SIV51012-3.2
SIV51012-3.2
The IEEE Std. 1149.1 boundary-scan test (BST) circuitry available in Stratix® IV
devices provides a cost-effective and efficient way to test systems that contain devices
with tight lead spacing. Circuit boards with Altera and other IEEE Std.
1149.1-compliant devices can use EXTEST, SAMPLE/PRELOAD, and BYPASSmodes to
create serial patterns that internally test the pin connections between devices and
check device operation.
This chapter describes how to use the IEEE Std. 1149.1 BST circuitry in Stratix IV
devices. The features are similar to Stratix III devices, unless stated otherwise in this
chapter.
This chapter contains the following sections:
■
■
■
■
■
“BST Architecture”
“BST Operation Control” on page 12–2
“I/O Voltage Support in a JTAG Chain” on page 12–4
“BST Circuitry” on page 12–4
“BSDL Support” on page 12–4
BST Architecture
A device operating in IEEE Std. 1149.1 BST mode uses four required pins, TDI
TMS,TCK, and one optional pin, TRST. The TCKpin has an internal weak pull-down
resistor, while the TDI TMS, and TRSTpins have internal weak pull-up resistors. The
, TDO,
,
TDOoutput pin and all the JTAG input pins are powered by the 2.5-V/3.0-V VCCPD
supply of I/O bank 1A. All user I/O pins are tri-stated during JTAG configuration.
f
For more information about the description and functionality of all JTAG pins,
registers used by the IEEE Std. 1149.1 BST circuitry, and the test access port (TAP)
controller, refer to the IEEE 1149.1 (JTAG) Boundary-Scan Testing in Stratix III Devices
chapter in volume 1 of the Stratix III Device Handbook.
© 2011 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX are Reg. U.S. Pat. & Tm. Off.
and/or trademarks of Altera Corporation in the U.S. and other countries. All other trademarks and service marks are the property of their respective holders as described at
www.altera.com/common/legal.html. Altera warrants performance of its semiconductor products to current specifications in accordance with Altera’s standard warranty, but
reserves the right to make changes to any products and services at any time without notice. Altera assumes no responsibility or liability arising out of the application or use of any
information, product, or service described herein except as expressly agreed to in writing by Altera. Altera customers are advised to obtain the latest version of device
specifications before relying on any published information and before placing orders for products or services.
Stratix IV Device Handbook Volume 1
February 2011
Subscribe
12–2
Chapter 12: JTAG Boundary-Scan Testing in Stratix IV Devices
BST Operation Control
BST Operation Control
Table 12–1 lists the boundary-scan register length for Stratix IV devices.
Table 12–1. Boundary-Scan Register Length in Stratix IV Devices
Device
EP4SGX70
Boundary-Scan Register Length
1506
1506
2274
2274
2682
2682
2970
2274
2682
2970
3402
2274
2970
2274
2970
2970
2970
EP4SGX110
EP4SGX180
EP4SGX230
EP4SGX290 (1)
EP4SGX360 (1)
EP4SGX530
EP4SE230
EP4SE360
EP4SE530
EP4SE820
EP4S40G2
EP4S40G5
EP4S100G2
EP4S100G3
EP4S100G4
EP4S100G5
Note to Table 12–1:
(1) For the F1932 package of EP4SGX290 and EP4SGX360 devices, the boundary-scan register length is 2970.
Table 12–2 lists the IDCODEinformation for Stratix IV devices.
Table 12–2. IDCODE Information for Stratix IV Devices (Part 1 of 2)
IDCODE (32 Bits) (1)
Device
Manufacturer Identity
(11 Bits)
LSB
(1 Bit) (2)
Version (4 Bits)
Part Number (16 Bits)
EP4SGX70
EP4SGX110
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0010 0100 0010 0000
0010 0100 0000 0000
0010 0100 0010 0001
0010 0100 0000 1001
0010 0100 0010 0010
0010 0100 0100 0011
0010 0100 0000 0010
0010 0100 1000 0011
0010 0100 0000 0011
0010 0100 0001 0001
0010 0100 0001 0010
000 0110 1110
000 0110 1110
000 0110 1110
000 0110 1110
000 0110 1110
000 0110 1110
000 0110 1110
000 0110 1110
000 0110 1110
000 0110 1110
000 0110 1110
1
1
1
1
1
1
1
1
1
1
1
EP4SGX180
EP4SGX230
EP4SGX290 (3)
EP4SGX290 (4)
EP4SGX360 (3)
EP4SGX360 (4)
EP4SGX530
EP4SE230
EP4SE360
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 12: JTAG Boundary-Scan Testing in Stratix IV Devices
12–3
BST Operation Control
Table 12–2. IDCODE Information for Stratix IV Devices (Part 2 of 2)
IDCODE (32 Bits) (1)
Device
Manufacturer Identity
(11 Bits)
LSB
(1 Bit) (2)
Version (4 Bits)
Part Number (16 Bits)
EP4SE530
EP4SE820
0000
0000
0000
0000
0000
0000
0000
0000
0010 0100 0001 0011
0010 0100 0000 0100
0010 0100 0100 0001
0010 0100 0010 0011
0010 0100 0100 0001
0010 0100 1010 0011
0010 0100 0110 0011
0010 0100 0010 0011
000 0110 1110
000 0110 1110
000 0110 1110
000 0110 1110
000 0110 1110
000 0110 1110
000 0110 1110
000 0110 1110
1
1
1
1
1
1
1
1
EP4S40G2 (5)
EP4S40G5 (6)
EP4S100G2 (5)
EP4S100G3
EP4S100G4
EP4S100G5 (6)
Notes to Table 12–2:
(1) The MSB is on the left.
(2) The LSB of the IDCODEis always 1.
(3) The IDCODEis applicable for all packages except F1932.
(4) The IDCODEis applicable for package F1932 only.
(5) For the ES1 device, the IDCODEis the same as the IDCODE of EP4SGX230.
(6) For the ES1 device, the IDCODEis the same as the IDCODE of EP4SGX530.
1
If the device is in reset state, when the nCONFIGor nSTATUSsignal is low, the device
IDCODE might not be read correctly. To read the device IDCODE correctly, you must
issue the IDCODE JTAG instruction only when the nSTATUSsignal is high.
f
For more information about the following topics, refer to the IEEE 1149.1 (JTAG)
Boundary-Scan Testing in Stratix III Devices chapter in volume 1 of the Stratix III Device
Handbook:
■
■
■
■
■
■
JTAG instruction codes with descriptions
TAP controller state-machine
Timing requirements for IEEE Std. 1149.1 signals
Instruction mode
Mandatory JTAG instructions (SAMPLE/PRELOAD
, EXTEST,and BYPASS)
Optional JTAG instructions (IDCODE USERCODE CLAMP,and HIGHZ)
,
,
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
12–4
Chapter 12: JTAG Boundary-Scan Testing in Stratix IV Devices
I/O Voltage Support in a JTAG Chain
I/O Voltage Support in a JTAG Chain
The JTAG chain supports several devices. However, you must use caution if the chain
contains devices that have different VCCIO levels.
f
For more information, refer to the IEEE 1149.1 (JTAG) Boundary-Scan Testing in
Stratix III Devices chapter in volume 1 of the Stratix III Device Handbook.
BST Circuitry
The IEEE Std. 1149.1 BST circuitry is enabled after device power-up. You can perform
BST on Stratix IV devices before, during, and after configuration. Stratix IV devices
support BYPASS, IDCODE, and SAMPLEJTAG instructions during configuration without
interrupting configuration. To send all other JTAG instructions, you must interrupt
configuration using the CONFIG_IOJTAG instruction.
f
f
For more information, refer to AN 39: IEEE Std. 1149.1 (JTAG) Boundary-Scan Testing in
Altera Devices.
For more information about using the CONFIG_IOJTAG instruction for dynamic I/O
buffer configuration, considerations when performing BST for configured devices,
and JTAG pin connections to mask-out the BST circuitry, refer to the IEEE 1149.1
(JTAG) Boundary-Scan Testing in Stratix III Devices chapter in volume 1 of the Stratix III
Device Handbook.
f
f
For more information about using the IEEE Std.1149.1 circuitry for device
configuration, refer to the Configuration, Design Security, Remote System Upgrades in
Stratix IV Devices chapter.
If you must perform BST for configured devices, you must use the Quartus II software
version 8.1 and onwards to generate the design-specific boundary-scan description
language (BSDL) files. For the procedure to generate post-configured BSDL files using
the Quartus II software, refer to the BSDL Files Generation in Quartus II on the Altera
website.
BSDL Support
BSDL, a subset of VHDL, provides a syntax that allows you to describe the features of
an IEEE Std. 1149.1 BST-capable device that can be tested.
f
f
For more information about BSDL files for IEEE Std. 1149.1-compliant Stratix IV
devices, refer to the Stratix IV BSDL Files on the Altera website.
BSDL files for IEEE std. 1149.1-compliant Stratix IV devices can also be generated
using the Quartus II software version 8.1 and onwards. For more information about
the procedure to generate BSDL files using the Quartus II software, refer to the BSDL
Files Generation in Quartus II on the Altera website.
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
Chapter 12: JTAG Boundary-Scan Testing in Stratix IV Devices
12–5
BSDL Support
Document Revision History
Table 12–3 lists the revision history for this chapter.
Table 12–3. Document Revision History
Date
Version
Changes
■ Applied new template.
■ Minor text edits.
February 2011
3.2
■ Updated the hand note in the “BST Operation Control” section.
■ Changed “IDCODE JTAG Instruction” to read “IDCODE” as needed.
■ Minor text edits
March 2010
November 2009
June 2009
3.1
3.0
2.3
■ Updated Table 12–1 and Table 12–2.
■ Minor text edits.
■ Added an introductory paragraph to increase search ability.
■ Removed the Conclusion section.
■ Minor text edits.
April 2009
2.2
2.1
■ Updated Table 12–1.
■ Updated Table 12–1 and Table 12–2.
■ Removed “Referenced Documents” section.
Minor text edits.
March 2009
November 2008
April 2010
2.0
1.0
Initial release.
February 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
12–6
Chapter 12: JTAG Boundary-Scan Testing in Stratix IV Devices
BSDL Support
Stratix IV Device Handbook Volume 1
February 2011 Altera Corporation
13. Power Management in Stratix IV
Devices
February 2011
SIV51013-3.2
SIV51013-3.2
This chapter describes power management in Stratix® IV devices. Stratix IV devices
offer programmable power technology options for low-power operation. You can use
these options, along with speed grade choices, in different permutations to give the
best power and performance combination. For thermal management, use the
Stratix IV internal temperature sensing device (TSD) with built-in analog-to-digital
converter (ADC) circuitry or external TSD with an external temperature sensor to
easily incorporate this feature in your designs. Being able to monitor the junction
temperature of the device at any time also offers the ability to control air flow to the
device and save power for the whole system.
Overview
Stratix IV FPGAs deliver a breakthrough level of system bandwidth and power
efficiency for high-end applications, allowing you to innovate without compromise.
Stratix IV devices use advanced power management techniques to enable both
density and performance increases while simultaneously reducing power dissipation.
The total power of an FPGA includes static and dynamic power.
■
■
Static power is the power consumed by the FPGA when it is configured but no
clocks are operating.
Dynamic power is the switching power when the device is configured and
running. You configure dynamic power with the equation shown in
Equation 13–1.
Equation 13–1. Dynamic Power Equation (Note 1)
1
2
2
--
P = CV frequency
Note to Equation 13–1:
(1) P = power; C = load capacitance; and V = supply voltage level.
Equation 13–1 shows that frequency is design dependant. However, you can vary the
voltage to lower dynamic power consumption by the square value of the voltage
difference. Stratix IV devices minimize static and dynamic power with advanced
process optimizations and programmable power technology. These technologies
enable Stratix IV designs to optimally meet design-specific performance requirements
with the lowest possible power.
The Quartus® II software optimizes all designs with Stratix IV power technology to
ensure performance is met at the lowest power consumption. This automatic process
allows you to concentrate on the functionality of the design instead of the power
consumption of the design.
© 2011 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX are Reg. U.S. Pat. & Tm. Off.
and/or trademarks of Altera Corporation in the U.S. and other countries. All other trademarks and service marks are the property of their respective holders as described at
www.altera.com/common/legal.html. Altera warrants performance of its semiconductor products to current specifications in accordance with Altera’s standard warranty, but
reserves the right to make changes to any products and services at any time without notice. Altera assumes no responsibility or liability arising out of the application or use of any
information, product, or service described herein except as expressly agreed to in writing by Altera. Altera customers are advised to obtain the latest version of device
specifications before relying on any published information and before placing orders for products or services.
Stratix IV Device Handbook Volume 1
June 2011
Subscribe
13–2
Chapter 13: Power Management in Stratix IV Devices
Stratix IV Power Technology
Power consumption also affects thermal management. Stratix IV devices offer a TSD
feature that self-monitors the device junction temperature and can be used with
external circuitry for other activities, such as controlling air flow to the Stratix IV
FPGA.
This chapter contains the following sections:
■
■
■
“Stratix IV Power Technology”
“Stratix IV External Power Supply Requirements”
“Temperature Sensing Diode”
Stratix IV Power Technology
The following sections describe Stratix IV programmable power technology.
Programmable Power Technology
Stratix IV devices offer the ability to configure portions of the core, called tiles, for
high-speed or low-power mode of operation performed by the Quartus II software
without user intervention. Setting a tile to high-speed or low-power mode is
accomplished with on-chip circuitry and does not require extra power supplies
brought into the Stratix IV device. In a design compilation, the Quartus II software
determines whether a tile must be in high-speed or low-power mode based on the
timing constraints of the design.
f
For more information about how the Quartus II software uses programmable power
technology when compiling a design, refer to AN 514: Power Optimization in Stratix IV
FPGAs.
A Stratix IV tile can consist of the following:
■
Memory logic array block (MLAB)/logic array block (LAB) pairs with routing to
the pair
■
MLAB/LAB pairs with routing to the pair and to adjacent digital signal
processing (DSP)/memory block routing
■
■
TriMatrix memory blocks
DSP blocks
All blocks and routing associated with the tile share the same setting of either
high-speed or low-power mode. By default, tiles that include DSP blocks or memory
blocks are set to high-speed mode for optimum performance. Unused DSP blocks and
memory blocks are set to low-power mode to minimize static power. Clock networks
do not support programmable power technology.
With programmable power technology, faster speed grade FPGAs may require less
power because there are fewer high-speed MLAB and LAB pairs, when compared
with slower speed grade FPGAs. The slower speed grade device may have to use
more high-speed MLAB and LAB pairs to meet performance requirements, while the
faster speed grade device can meet performance requirements with MLAB and LAB
pairs in low-power mode.
Stratix IV Device Handbook Volume 1
June 2011 Altera Corporation
Chapter 13: Power Management in Stratix IV Devices
13–3
Stratix IV External Power Supply Requirements
The Quartus II software sets unused device resources in the design to low-power
mode to reduce static and dynamic power. It also sets the following resources to
low-power mode when they are not used in the design:
■
■
■
LABs and MLABs
TriMatrix memory blocks
DSP blocks
If a phase-locked loop (PLL) is instantiated in the design, asserting the aresetpin
high keeps the PLL in low-power mode.
Table 13–1 lists the available Stratix IV programmable power capabilities. Speed grade
considerations can add to the permutations to give you flexibility in designing your
system.
Table 13–1. Programmable Power Capabilities in Stratix IV Devices
Feature
LAB
Programmable Power Technology
Yes
Yes
Routing
Memory Blocks
DSP Blocks
Fixed setting (1)
Fixed setting (1)
No
Global Clock Networks
Note to Table 13–1:
(1) Tiles with DSP blocks and memory blocks that are used in the design are always set to high-speed mode. By
default, unused DSP blocks and memory blocks are set to low-power mode.
Stratix IV External Power Supply Requirements
This section describes the different external power supplies required to power
Stratix IV devices. You can supply some of the power supply pins with the same
external power supply, provided they have the same voltage level.
f
f
For power supply pin connection guidelines and power regulator sharing, refer to the
Stratix IV GX and Stratix IV E Device Family Pin Connection Guidelines.
For each Altera recommended power supply’s operating conditions, refer to the DC
and Switching Characteristics for Stratix IV Devices chapter.
June 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
13–4
Chapter 13: Power Management in Stratix IV Devices
Temperature Sensing Diode
Temperature Sensing Diode
The Stratix IV TSD uses the characteristics of a PN junction diode to determine die
temperature. Knowing the junction temperature is crucial for thermal management.
Historically, junction temperature is calculated using ambient or case temperature,
junction-to-ambient (ja) or junction to-case (jc) thermal resistance, and device power
consumption. Stratix IV devices can either monitor its die temperature with the
internal TSD with built-in ADC circuitry or the external TSD with an external
temperature sensor. This allows you to control the air flow to the device.
You can use the Stratix IV internal TSD in two different modes of operation—
power-up mode and user mode. For power-up mode, the internal TSD reads the die’s
temperature during configuration if the ALTTEMP_SENSE megafunction is enabled
in your design. The ALTTEMP_SENSE megafunction allows temperature sensing
during device user mode by asserting the clkensignal to the internal TSD circuitry.
To reduce device static power, disable the internal TSD with built-in ADC circuitry
when not in use.
f
For more information about using the ALTTEMP_SENSE megafunction, refer to the
Thermal Sensor (ALTTEMP_SENSE) Megafunction User Guide.
The external temperature sensor steers bias current through the Stratix IV external
TSD, which measures forward voltage and converts this reading to temperature in the
form of an 8-bit signed number (7 bits plus sign). The 8-bit output represents the
junction temperature of the Stratix IV device and can be used for intelligent power
management.
External Pin Connections
The Stratix IV external TSD requires two pins for voltage reference. Figure 13–1 shows
how to connect the external TSD with an external temperature sensor device. As an
example, external temperature sensing devices, such as MAX1619, MAX1617A,
MAX6627, and ADT 7411, can be connected to the two external TSD pins for
temperature reading.
Figure 13–1. TSD External Pin Connections in Stratix IV Devices
TEMPDIODEP
External TSD
External
Temperature
Sensor
Stratix IV Device
TEMPDIODEN
f
For more information about the external TSD specification, refer to the DC and
Switching Characteristics for Stratix IV Devices chapter.
Stratix IV Device Handbook Volume 1
June 2011 Altera Corporation
Chapter 13: Power Management in Stratix IV Devices
13–5
Temperature Sensing Diode
The TSD is a very sensitive circuit that can be influenced by noise coupled from other
traces on the board and possibly within the device package itself, depending on your
device usage. The interfacing device registers’ temperature is based on millivolts
(mV) of difference, as seen at the external TSD pins. Switching the I/O near the TSD
pins can affect the temperature reading. Altera recommends taking temperature
readings during periods of inactivity in the device or use the internal TSD with
built-in ADC circuitry.
The following are board connection guidelines for the TSD external pin connections:
■
■
The maximum trace lengths for the TEMPDIODEP/TEMPDIODEN traces must be
less than eight inches.
Route both traces in parallel and place them close to each other with grounded
guard tracks on each side.
■
■
Altera recommends 10-mils width and space for both traces.
Route traces through a minimum number of vias and crossunders to minimize the
thermocouple effects.
■
■
■
Ensure that the number of vias are the same on both traces.
Ensure both traces are approximately the same length.
Avoid coupling with toggling signals (for example, clocks and I/O) by having the
GND plane between the diode traces and the high frequency signals.
■
For high-frequency noise filtering, place an external capacitor (close to the external
chip) between the TEMPDIODEP/TEMPDIODEN trace.
■
■
■
For Maxim devices, use an external capacitor between 2200 pF to 3300 pF.
Place a 0.1 uF bypass capacitor close to the external device.
You can use internal TSD with built-in ADC circuitry and external TSD at the
same time.
■
If you only use internal ADC circuitry, the external TSD pins
(TEMPDIODEP/TEMPDIODEN) can connect these pins to GND because the
external TSD pins are not used.
f For more information about the TEMPDIODEP/TEMPDIODEN pin
connection when you are not using an external TSD, refer to the
Stratix IV GX and Stratix IV E Pin Connection Guidelines.
f
For device specification and connection guidelines, refer to the external temperature
sensor device data sheet from the device manufacturer.
June 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
13–6
Chapter 13: Power Management in Stratix IV Devices
Temperature Sensing Diode
Document Revision History
Table 13–2 lists the revision history for this chapter.
Table 13–2. Document Revision History
Date
Version
Changes
■ Applied new template.
■ Minor text edits.
February 2011
3.2
■ Updated the “External Pin Connections” section.
■ Minor text edits.
March 2010
3.1
3.0
■ Updated the “Temperature Sensing Diode” and “External Pin Connections” sections.
■ Updated Equation 13–1.
November 2009
■ Removed Table 13-2: Stratix IV External Power Supply Pins.
■ Minor text edits.
■ Updated the “External Pin Connections” section.
■ Added an introductory paragraph to increase search ability.
■ Removed the Conclusion section.
June 2009
2.2
2.1
■ Updated “Temperature Sensing Diode” and “External Pin Connections” sections.
■ Updated Figure 13–1.
March 2009
■ Removed “Referenced Documents” section.
Minor text edits.
November 2008
May 2008
2.0
1.0
Initial release.
Stratix IV Device Handbook Volume 1
June 2011 Altera Corporation
Additional Information
About this Handbook
This chapter provides additional information about the document and Altera.
How to Contact Altera
To locate the most up-to-date information about Altera products, refer to the
following table.
Contact (1)
Technical support
Contact Method
Website
Website
Email
Address
www.altera.com/support
www.altera.com/training
custrain@altera.com
Technical training
Product literature
Website
Email
www.altera.com/literature
nacomp@altera.com
Non-technical support (General)
(Software Licensing)
Note to Table:
Email
authorization@altera.com
(1) You can also contact your local Altera sales office or sales representative.
Typographic Conventions
The following table shows the typographic conventions this document uses.
Visual Cue
Meaning
Indicate command names, dialog box titles, dialog box options, and other GUI
labels. For example, Save As dialog box. For GUI elements, capitalization matches
the GUI.
Bold Type with Initial Capital
Letters
Indicates directory names, project names, disk drive names, file names, file name
extensions, software utility names, and GUI labels. For example, \qdesigns
directory, D: drive, and chiptrip.gdf file.
bold type
Italic Type with Initial Capital Letters Indicate document titles. For example, Stratix IV Design Guidelines.
Indicates variables. For example, n + 1.
italic type
Variable names are enclosed in angle brackets (< >). For example, <file name> and
<project name>.pof file.
Indicate keyboard keys and menu names. For example, the Delete key and the
Options menu.
Initial Capital Letters
“Subheading Title”
Quotation marks indicate references to sections within a document and titles of
Quartus II Help topics. For example, “Typographic Conventions.”
June 2011 Altera Corporation
Stratix IV Device Handbook Volume 1
Info–2
Additional Information
Typographic Conventions
Visual Cue
Meaning
Indicates signal, port, register, bit, block, and primitive names. For example, data1
tdi, and input. The suffix denotes an active-low signal. For example, resetn
Indicates command line commands and anything that must be typed exactly as it
appears. For example, c:\qdesigns\tutorial\chiptrip.gdf
,
n
.
Courier type
.
Also indicates sections of an actual file, such as a Report File, references to parts of
files (for example, the AHDL keyword SUBDESIGN), and logic function names (for
example, TRI).
r
An angled arrow instructs you to press the Enter key.
1., 2., 3., and
Numbered steps indicate a list of items when the sequence of the items is important,
such as the steps listed in a procedure.
a., b., c., and so on
■
■
■
Bullets indicate a list of items when the sequence of the items is not important.
The hand points to information that requires special attention.
1
h
A question mark directs you to a software help system with related information.
The feet direct you to another document or website with related information.
f
A caution calls attention to a condition or possible situation that can damage or
destroy the product or your work.
c
A warning calls attention to a condition or possible situation that can cause you
injury.
w
The envelope links to the Email Subscription Management Center page of the Altera
website, where you can sign up to receive update notifications for Altera documents.
Stratix IV Device Handbook Volume 1
June 2011 Altera Corporation
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