RKSAS4R5 [INTEL]

Technical Product Specification;
RKSAS4R5
型号: RKSAS4R5
厂家: INTEL    INTEL
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Technical Product Specification

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Intel® Server Board S2600GZ/GL  
Technical Product Specification  
Revision 2.4  
October 2014  
Revision History  
Intel® Server Board S2600GZ/GL TPS  
Revision History  
Date  
Revision  
Number  
1.0  
Modifications  
January 2012  
First public release.  
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Deleted section 6.9.2 Fan Profile.  
Deleted chapter 11 - Environmental Limits Specification.  
March 2012  
August 2013  
1.1  
2.0  
Added chapter 12 - BIOS Setup Utility.  
Added Figure 17. Intel® Server Board S2600GZ/GL PCI Layout.  
Added support for Intel® Xeon® processor E5-2600 v2 product family  
Updated memory support tables  
Corrected POST code table - E0h – E3h  
Updated reference documents table  
Corrected Table 39 - pin out for on-board 7-pin SATA connectors.  
Updated PCIe Gen 3 support verbiage – section 3.2.5  
Added Phase Shedding support verbiage – section 3.2.4.1.1  
Updated BIOS Setup options to include Phase Shedding option, PCIe Gen3  
support option.  
February 2014  
April 2014  
2.1  
2.2  
.
Updated BIOS Setup options to include Extended ATR option, PFloor tuning  
option, Memory Mapped I/O Size option, PCIe AER Support option, Log  
Correctable Errors option and System Early POST Timeout option.  
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.
Corrected Figure 9 and Figure 16 – PCIe Gen1x48GB/s  
Updated BIOS Setep options to include Phase Shedding and Memory SPD  
Override options.  
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.
Updated Table 37. System Status LED State Definitions – Remove the  
“Battery Failure” from Description column.  
June 2014  
2.3  
2.4  
Updated Table 51. SystemStatus LED State Definitions – Remove the  
“Battery Failure” from Description column.  
October 2014  
Add note for Figure 29.  
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Intel® Server Board S2600GZ/GL TPS  
Disclaimers  
Disclaimers  
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE,  
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS  
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR  
SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR  
IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR  
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT  
OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.  
A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in  
personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION  
CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS  
AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL  
CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF,  
DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN  
ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR  
WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS  
PARTS.  
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on  
the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for  
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to  
them. The information here is subject to change without notice. Do not finalize a design with this information.  
The products described in this document may contain design defects or errors known as errata which may cause the  
product to deviate from published specifications. Current characterized errata are available on request.  
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product  
order.  
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be  
obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm  
Intel and Xeon are trademarks or registered trademarks of Intel Corporation.  
*Other brands and names may be claimed as the property of others.  
Copyright © 2014 Intel Corporation. All rights reserved.  
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Table of Contents  
Intel® Server Board S2600GZ/GL TPS  
Table of Contents  
1. Introduction ........................................................................................................................1  
1.1  
1.2  
Chapter Outline......................................................................................................1  
Server Board Use Disclaimer .................................................................................1  
2. Product Overview...............................................................................................................2  
2.1  
2.2  
Server Board Component/Feature Identification.....................................................4  
Server Board Dimensional Mechanical Drawings...................................................6  
3. Product Architecture Overview .......................................................................................11  
3.1  
3.1.1  
Processor Support ...............................................................................................12  
Processor Socket Assembly.................................................................................12  
Processor Population Rules .................................................................................13  
Processor Initialization Error Summary.................................................................14  
Processor Thermal Design Power (TDP) Support ................................................16  
Processor Functions Overview.............................................................................16  
Processor Core Features: ....................................................................................17  
Supported Technologies: .....................................................................................17  
Intel® QuickPath Interconnect...............................................................................17  
Integrated Memory Controller (IMC) and Memory Subsystem..............................18  
3.1.2  
3.1.3  
3.1.4  
3.2  
3.2.1  
3.2.2  
3.2.3  
3.2.4  
3.2.4.1 Supported Memory............................................................................................19  
3.2.4.2 Memory Slot Identification and Population Rules...............................................21  
3.2.4.3 Publishing System Memory...............................................................................25  
3.2.4.4 Integrated Memory Controller Operating Modes................................................25  
3.2.4.5 Memory RAS Support .......................................................................................26  
3.2.5  
Processor Integrated I/O Module (IIO)..................................................................29  
3.2.5.1 PCIe Interface...................................................................................................30  
3.2.5.2 Riser Card Support ...........................................................................................32  
3.2.5.3 PCIe Add-in card support..................................................................................34  
3.2.5.4 Network Interface..............................................................................................38  
3.2.5.5 I/O Module Support...........................................................................................38  
3.2.5.6 Intel® Integrated RAID Option............................................................................39  
3.3  
3.3.1  
3.3.2  
Intel® C602 Chipset Functional Overview.............................................................40  
Low Pin Count (LPC) Interface.............................................................................41  
Universal Serial Bus (USB) Controller..................................................................41  
3.3.2.1 eUSB SSD Support...........................................................................................41  
3.3.3  
Embedded Serial ATA (SATA)/Serial Attached SCSI (SAS)/RAID Support..........41  
3.3.3.1 Intel® Embedded Server RAID Technology 2 (ESRT2)......................................43  
3.3.3.2 Intel® Rapid Storage Technology (RSTe) ..........................................................43  
3.3.4  
3.4  
3.4.1  
Manageability.......................................................................................................44  
Integrated Baseboard Management Controller Overview .....................................44  
Super I/O Controller .............................................................................................46  
3.4.1.1 Keyboard and Mouse Support...........................................................................46  
3.4.1.2 Wake-up Control ...............................................................................................46  
3.4.2  
Graphics Controller and Video Support................................................................46  
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3.4.3  
Baseboard Management Controller......................................................................47  
3.4.3.1 Remote Keyboard, Video, Mouse, and Storage (KVMS) Support......................47  
3.4.3.2 Integrated BMC Embedded LAN Channel.........................................................48  
4. System Security................................................................................................................49  
4.1  
4.2  
BIOS Password Protection...................................................................................49  
Intel® TPM module AXXTPME5 Support .............................................................50  
TPM security BIOS...............................................................................................50  
Physical Presence................................................................................................50  
TPM Security Setup Options ................................................................................51  
4.2.1  
4.2.2  
4.2.3  
4.2.3.1 Security Screen.................................................................................................51  
Intel® Trusted Execution Technology....................................................................53  
4.3  
5. Technology Support.........................................................................................................54  
5.1  
5.2  
Intel® Virtualization Technology – Intel® VT-x/VT-d/VT-c ......................................54  
Intel® Intelligent Power Node Manager.................................................................54  
Hardware Requirements ......................................................................................56  
5.2.1  
6. Platform Management Functional Overview...................................................................57  
6.1  
6.1.1  
6.1.2  
6.2  
Baseboard Management Controller (BMC) Firmware Feature Support.................57  
IPMI 2.0 Features.................................................................................................57  
Non IPMI Features...............................................................................................57  
Advanced Configuration and Power Interface (ACPI)...........................................59  
Power Control Sources ........................................................................................59  
BMC Watchdog....................................................................................................60  
Fault Resilient Booting (FRB)...............................................................................60  
Sensor Monitoring................................................................................................61  
Field Replaceable Unit (FRU) Inventory Device ...................................................61  
System Event Log (SEL)......................................................................................61  
System Fan Management ....................................................................................61  
Thermal and Acoustic Management.....................................................................62  
Thermal Sensor Input to Fan Speed Control ........................................................62  
Memory Thermal Throttling ..................................................................................63  
Messaging Interfaces ...........................................................................................64  
6.3  
6.4  
6.5  
6.6  
6.7  
6.8  
6.9  
6.9.1  
6.9.2  
6.9.3  
6.10  
6.10.1 User Model...........................................................................................................64  
6.10.2 IPMB Communication Interface............................................................................65  
6.10.3 LAN Interface.......................................................................................................65  
6.10.3.1 RMCP/ASF Messaging ...................................................................................65  
6.10.3.2 BMC LAN Channels ........................................................................................65  
6.10.3.3 IPV6 Support...................................................................................................67  
6.10.3.4 LAN Failover ...................................................................................................67  
6.10.3.5 BMC IP Address Configuration........................................................................67  
6.10.3.6 DHCP BMC Hostname....................................................................................69  
6.10.4 Address Resolution Protocol (ARP)......................................................................70  
6.10.5 Internet Control Message Protocol (ICMP)...........................................................70  
6.10.6 Virtual Local Area Network (VLAN) ......................................................................70  
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6.10.7 Secure Shell (SSH)..............................................................................................70  
6.10.8 Serial-over-LAN (SOL 2.0) ...................................................................................70  
6.10.9 Platform Event Filter (PEF)...................................................................................71  
6.10.10 LAN Alerting.........................................................................................................71  
6.10.10.1 SNMP Platform Event Traps (PETs)..............................................................72  
6.10.11 Alert Policy Table .................................................................................................72  
6.10.11.1 E-mail Alerting...............................................................................................72  
6.10.12 SM-CLP (SM-CLP Lite)........................................................................................72  
6.10.13 Embedded Web Server........................................................................................72  
6.10.14 Virtual Front Panel ...............................................................................................74  
6.10.15 Embedded Platform Debug ..................................................................................74  
6.10.15.1 Output Data Format.......................................................................................75  
6.10.15.2 Output Data Availability.................................................................................75  
6.10.15.3 Output Data Categories.................................................................................75  
6.10.16 Data Center Management Interface (DCMI).........................................................76  
6.10.17 Lightweight Directory Authentication Protocol (LDAP)..........................................76  
7. Advanced Management Feature Support (RMM4).........................................................77  
7.1  
7.1.1  
Keyboard, Video, Mouse (KVM) Redirection ........................................................78  
Remote Console ..................................................................................................78  
Performance ........................................................................................................79  
Security................................................................................................................79  
Availability............................................................................................................79  
Usage ..................................................................................................................79  
Force-enter BIOS Setup.......................................................................................79  
Availability............................................................................................................80  
Network Port Usage .............................................................................................80  
7.1.2  
7.1.3  
7.1.4  
7.1.5  
7.1.6  
7.1.7  
7.1.8  
8. On-board Connector/Header Overview...........................................................................81  
8.1  
8.1.1  
Power Connectors................................................................................................81  
Main Power..........................................................................................................81  
Riser Card Power Connectors..............................................................................82  
Hot Swap Backplane Power Connector................................................................82  
Peripheral Drive Power Connector ......................................................................83  
Front Panel Headers and Connectors ..................................................................83  
Front Panel Support .............................................................................................83  
8.1.2  
8.1.3  
8.1.4  
8.2  
8.2.1  
8.2.1.1 Power/Sleep Button and LED Support ..............................................................84  
8.2.1.2 System ID Button and LED Support ..................................................................84  
8.2.1.3 System Reset Button Support ...........................................................................84  
8.2.1.4 NMI Button Support...........................................................................................84  
8.2.1.5 NIC Activity LED Support ..................................................................................85  
8.2.1.6 Hard Drive Activity LED Support........................................................................85  
8.2.1.7 System Status LED Support..............................................................................85  
8.2.2  
Front Panel USB Connector.................................................................................87  
Front Panel Video Connector ...............................................................................87  
Intel® Local Control Panel Connector ...................................................................87  
8.2.3  
8.2.4  
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8.3  
8.3.1  
On-Board Storage Connectors.............................................................................87  
Single Port SATA Only Connectors......................................................................88  
Multiport Mini-SAS/SATA Connectors ..................................................................88  
Internal Type-A USB Connector...........................................................................89  
Internal 2mm Low Profile eUSB SSD Connector..................................................89  
Fan Connectors....................................................................................................90  
Serial Port Connectors .........................................................................................90  
Other Connectors and Headers............................................................................91  
8.3.2  
8.3.3  
8.3.4  
8.4  
8.5  
8.6  
9. Reset and Recovery Jumpers..........................................................................................92  
10. Light Guided Diagnostics ................................................................................................95  
10.1  
10.2  
10.3  
10.4  
10.5  
10.6  
10.7  
10.8  
10.9  
10.10  
System ID LED.....................................................................................................96  
System Status LED..............................................................................................96  
BMC Boot/Reset Status LED Indicators ...............................................................98  
Post Code Diagnostic LEDs .................................................................................98  
12 Volt Stand-By Present LED .............................................................................98  
Fan Fault LEDs ....................................................................................................98  
Memory Fault LEDs..............................................................................................98  
CPU Fault LEDs...................................................................................................99  
System Power Good LED.....................................................................................99  
CATERR LED ......................................................................................................99  
11. Power Supply Specification Guidelines........................................................................100  
11.1  
11.2  
Power Supply DC Output Connector..................................................................100  
Power Supply DC Output Specification ..............................................................101  
11.2.1 Output Power/Currents.......................................................................................101  
11.2.2 Standby Output ..................................................................................................101  
11.2.3 Voltage Regulation.............................................................................................101  
11.2.4 Dynamic Loading ...............................................................................................101  
11.2.5 Capacitive Loading.............................................................................................102  
11.2.6 Grounding ..........................................................................................................102  
11.2.7 Closed loop stability ...........................................................................................102  
11.2.8 Residual Voltage Immunity in Standby mode .....................................................102  
11.2.9 Common Mode Noise.........................................................................................102  
11.2.10 Soft Starting .......................................................................................................102  
11.2.11 Zero Load Stability Requirements ......................................................................102  
11.2.12 Hot Swap Requirements ....................................................................................102  
11.2.13 Forced Load Sharing..........................................................................................102  
11.2.14 Ripple/Noise.......................................................................................................103  
11.2.15 Timing Requirements .........................................................................................103  
12. BIOS Setup Utility...........................................................................................................105  
12.1  
BIOS Setup Operation........................................................................................105  
12.1.1 Entering BIOS Setup..........................................................................................105  
12.1.2 Setup Navigation Keyboard Commands.............................................................105  
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12.2  
BIOS Setup Utility Screens.................................................................................107  
12.2.1 Main Screen (Tab) .............................................................................................107  
12.2.2 Advanced Screen (Tab) .....................................................................................110  
12.2.2.1 Processor Configuration................................................................................112  
12.2.2.2 Power & Performance ...................................................................................122  
12.2.2.3 Memory Configuration...................................................................................123  
12.2.2.4 Memory RAS and Performance Configuration...............................................128  
12.2.2.5 Mass Storage Controller Configuration..........................................................130  
12.2.2.6 PCI Configuration..........................................................................................136  
12.2.2.7 NIC Configuration..........................................................................................138  
12.2.2.8 Serial Port Configuration ...............................................................................146  
12.2.2.9 USB Configuration.........................................................................................148  
12.2.2.10 System Acoustic and Performance Configuration........................................151  
12.2.3 Security Screen (Tab) ........................................................................................154  
12.2.4 Server Management Screen (Tab) .....................................................................157  
12.2.4.1 Console Redirection......................................................................................164  
12.2.4.2 System Information .......................................................................................166  
12.2.4.3 BMC LAN Configuration................................................................................169  
12.2.5 Boot Options Screen (Tab).................................................................................177  
12.2.5.1 CDROM Order ..............................................................................................183  
12.2.5.2 Hard Disk Order ............................................................................................184  
12.2.5.3 Floppy Order .................................................................................................185  
12.2.5.4 Network Device Order...................................................................................185  
12.2.5.5 BEV Device Order.........................................................................................186  
12.2.5.6 Add EFI Boot Option .....................................................................................187  
12.2.5.7 Delete EFI Boot Option .................................................................................188  
12.2.6 Boot Manager Screen (Tab)...............................................................................188  
12.2.7 Error Manager Screen (Tab) ..............................................................................190  
12.2.8 Save & Exit Screen (Tab)...................................................................................191  
Appendix A: Integration and Usage Tips ............................................................................195  
Appendix B: Integrated BMC Sensor Tables.......................................................................196  
Appendix C: Management Engine Generated SEL Event Messages.................................210  
Appendix D: POST Code Diagnostic LED Decoder ............................................................212  
Appendix E: POST Code Errors...........................................................................................217  
Appendix F: Supported Intel® Server Systems ...................................................................223  
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List of Figures  
List of Figures  
Figure 1. Server Board Component/Features Identification.........................................................4  
Figure 2. Intel® Light Guided Diagnostic LED Identification .........................................................5  
Figure 3. Jumper Block Identification ..........................................................................................6  
Figure 4. Intel® Server Board S2600GZ/S2600GL External I/O Connector Layout ......................6  
Figure 5. Intel® Server Board S2600GZ/GL – Primary Side Keepout Zone.................................7  
Figure 6. Intel® Server Board S2600GZ/GL– Hole and Component Positions .............................8  
Figure 7. Intel® Server Board S2600GZ/GL – Secondary Side Keepout Zone.............................9  
Figure 8. Intel® Server Board S2600GZ/GL– Primary Side Height Restrictions.........................10  
Figure 9. Intel® Server Boards S2600GZ, S2600GL Functional Block Diagram.........................11  
Figure 10. Processor Socket Assembly.....................................................................................13  
Figure 11. Processor Socket ILM Variations .............................................................................13  
Figure 12. Integrated Memory Controller Functional Block Diagram..........................................18  
Figure 13. Memory Slots Definition ...........................................................................................22  
Figure 14. Intel® Server Board S2600GZ Memory Slot Layout ..................................................23  
Figure 15. Intel® Server Board S2600GL Memory Slot Layout ..................................................24  
Figure 16. Functional Block Diagram of Processor IIO Sub-system ..........................................29  
Figure 17. Intel® Server Board S2600GZ/GL PCI Layout ..........................................................30  
Figure 18. PCIe Port Bifurcation Options...................................................................................31  
Figure 19. 1U PCIe riser for Intel® Server Board S2600GZ/GL..................................................32  
Figure 20. 2U three PCIe slots riser for Intel® Server Board S2600GZ/GL ................................32  
Figure 21. 2U two PCIe slots riser for Intel® Server Board S2600GZ/GL...................................33  
Figure 22. 2U three PCIx/PCIe slots riser for Intel® Server Board S2600GZ/GL........................33  
Figure 23. Intel® Server Board S2600GZ/GL External RJ45 NIC Port LED Definition................38  
Figure 24. Server Board Layout - I/O Module Connector...........................................................39  
Figure 25. Server Board Layout – Intel® Integrated RAID Module Option Placement ................39  
Figure 26. Functional Block Diagram - Chipset Supported Features and Functions..................40  
Figure 27. Low Profile eUSB SSD Support ...............................................................................41  
Figure 28. Intel® RAID C600 Upgrade Key Connector...............................................................42  
Figure 29. Integrated BMC Block Diagram................................................................................45  
Figure 30. Integrated BMC Functional Block Diagram...............................................................45  
Figure 31. Setup Utility – TPM Configuration Screen ................................................................52  
Figure 32. Fan Speed Control Process .....................................................................................63  
Figure 33. Intel® RMM4 Lite Activation Key Installation.............................................................77  
Figure 34. Intel® RMM4 Dedicated Management NIC Installation.............................................77  
Figure 35. Serial-A RJ45 connector pin-out...............................................................................91  
Figure 36. Serial A Configuration Jumper Block Location..........................................................91  
Figure 37. Reset and Recovery Jumper Block Location............................................................92  
Figure 38. On-Board Diagnostic LED Placement ......................................................................96  
Figure 39. Memory Slot Fault LED Locations............................................................................96  
Figure 40. Turn On/Off Timing (Power Supply Signals)...........................................................104  
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List of Figures  
Intel® Server Board S2600GZ/GL TPS  
Figure 41. Main Screen...........................................................................................................107  
Figure 42. Advanced Screen...................................................................................................110  
Figure 43. Processor Configuration Screen.............................................................................113  
Figure 44. Power & Performance Screen................................................................................123  
Figure 45. Memory Configuration Screen................................................................................124  
Figure 46. Memory RAS and Performance Configuration Screen ...........................................129  
Figure 47. Mass Storage Controller Configuration Screen ......................................................131  
Figure 48. PCI Configuration Screen.......................................................................................136  
Figure 49. NIC Configuration Screen ......................................................................................141  
Figure 50. Serial Port Configuration Screen............................................................................147  
Figure 51. USB Configuration Screen .....................................................................................149  
Figure 52. System Acoustic and Performance Configuration...................................................151  
Figure 53. Security Screen......................................................................................................155  
Figure 54. Server Management Screen ..................................................................................158  
Figure 55. Console Redirection Screen...................................................................................165  
Figure 56. System Information Screen....................................................................................167  
Figure 57. BMC LAN Configuration Screen.............................................................................170  
Figure 58. Boot Options Screen..............................................................................................179  
Figure 59. CDROM Order Screen...........................................................................................184  
Figure 60. Hard Disk Order Screen.........................................................................................184  
Figure 61. Floppy Order Screen..............................................................................................185  
Figure 62. Network Device Order Screen................................................................................186  
Figure 63. BEV Device Order Screen......................................................................................186  
Figure 64. Add EFI Boot Option Screen..................................................................................187  
Figure 65. Delete EFI Boot Option Screen ..............................................................................188  
Figure 66. Boot Manager Screen ............................................................................................189  
Figure 67. Error Manager Screen............................................................................................190  
Figure 68. Save & Exit Screen ................................................................................................191  
Figure 69. POST Diagnostic LED Location .............................................................................212  
Figure 70. Intel® Server System R1000GZ/GL ........................................................................223  
Figure 71. Intel® Server System R2000GZ/GL ........................................................................223  
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List of Tables  
List of Tables  
Table 1. Intel® Server Board S2600GZ/S2600GL Feature Set ....................................................2  
Table 2. Supported Intel® Xeon® processor product family feature comparison table................12  
Table 3. Mixed Processor Configurations Error Summary.........................................................15  
Table 4. UDIMM Support Guidelines – Intel® Xeon® processor E5-2600 product family............19  
Table 5. UDIMM Support Guidelines – Intel® Xeon® processor E5-2600 v2 product family .......19  
Table 6. RDIMM Support Guidelines – Intel® Xeon® processor E5-2600 product family............20  
Table 7. RDIMM Support Guidelines – Intel® Xeon® processor E5-2600 v2 product family .......20  
Table 8. LRDIMM Support Guidelines – Intel® Xeon® processor E5-2600 product family..........21  
Table 9. LRDIMM Support Guidelines – Intel® Xeon® processor E5-2600 v2 product family .....21  
Table 10. Intel® Server Board S2600GZ Memory Slot Identification..........................................22  
Table 11. Intel® Server Board S2600GL Memory Slot Nomenclature........................................23  
Table 12. Riser Slot #1 – PCIe Port Routing .............................................................................35  
Table 13. Riser Slot #2 – PCIe Port Routing .............................................................................36  
Table 14. Supported Intel® I/O Module Options.........................................................................39  
Table 15. Supported Intel® Integrated RAID Modules................................................................40  
Table 16. Intel® RAID C600 Upgrade Key Options....................................................................43  
Table 17. Video Modes .............................................................................................................46  
Table 18. BIOS Setup Options for Configuring Video................................................................47  
Table 19. TPM Setup Utility – Security Configuration Screen Fields .........................................52  
Table 20. Intel® Intelligent Power Node Manager......................................................................55  
Table 21. ACPI Power States....................................................................................................59  
Table 22. Power Control Initiators .............................................................................................59  
Table 23. Mesaaging Interfaces................................................................................................64  
Table 24. Factory Configured PEF Table Entries ......................................................................71  
Table 25. Diagnostic Data.........................................................................................................76  
Table 26. Additional Diagnostics on Error. ................................................................................76  
Table 27. Intel® Remote Management Module 4 (RMM4) Options ............................................77  
Table 28. Enabling Advanced Management Features...............................................................77  
Table 29. Main Power (Slot 1) Connector Pin-out (“MAIN PWR 1”)..........................................81  
Table 30. Main Power (Slot 2) Connector Pin-out ("MAIN PWR 2”)...........................................82  
Table 31. Riser Slot Power Pin-out ("OPT_12V_PWR_1" & " OPT_12V_PWR_2")...................82  
Table 32. Hot Swap Backplane Power Connector Pin-out (“HSBP PWR")................................83  
Table 33. Peripheral Drive Power Connector Pin-out ("ODD/SSD_PWR")................................83  
Table 34. SSI Front Panel Header Pin-out ("Front Panel") ........................................................84  
Table 35. Power/Sleep LED Functional States..........................................................................84  
Table 36. NMI Signal Generation and Event Logging................................................................85  
Table 37. System Status LED State Definitions.........................................................................85  
Table 38. Front Panel USB Connector Pin-out ("FP USB") .......................................................87  
Table 39. Front Panel Video Connector Pin-out ("FP VIDEO")..................................................87  
Table 40. Intel Local Control Panel Connector Pin-out ("LCP") .................................................87  
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Table 41. Single Port AHCI SATA Controller Connector Pin-out ("SATA 0" & "SATA 1") ..........88  
Table 42. Multiport SAS/SATA Connector Pin-out ("SCU_0 (0-3)")...........................................88  
Table 43. Multiport SAS/SATA Connector Pin-out ("SCU_1 (4-7)")...........................................89  
Table 44. Internal Type-A USB Connector Pin-out ("USB 2")....................................................89  
Table 45. Internal eUSB Connector Pin-out ("eUSB SSD") .......................................................89  
Table 46. System Fan Connector Pin-out ("SYS_FAN #").........................................................90  
Table 47. Serial-B Connector Pin-out........................................................................................90  
Table 48. Serial A Connector Pin-out........................................................................................91  
Table 49. Chassis Intrusion Header Pin-out ("CHAS_INTR") ....................................................91  
Table 50. Hard Drive Activity Header Pin-out ("HDD_LED")......................................................91  
Table 51. SystemStatus LED State Definitions..........................................................................96  
Table 52. BMC Boot/Reset Status LED Indicators ....................................................................98  
Table 53. Power Supply DC Power Output Connector Pinout .................................................100  
Table 54. Minimum Load Ratings............................................................................................101  
Table 55. Voltage Regulation Limits........................................................................................101  
Table 56. Transient Load Requirements .................................................................................101  
Table 57. Capacitive Loading Conditions................................................................................102  
Table 58. Ripples and Noise ...................................................................................................103  
Table 59. Timing Requirements ..............................................................................................103  
Table 60. BIOS Setup: Keyboard Command Bar ....................................................................106  
Table 61. BMC Core Sensors .................................................................................................198  
Table 62. Server Platform Services Firmware Health Event....................................................210  
Table 63. Node Manager Health Event ...................................................................................211  
Table 64. POST Progress Code LED Example.......................................................................212  
Table 65. POST Progress Codes............................................................................................213  
Table 66. MRC Progress Codes .............................................................................................215  
Table 67. MRC Fatal Error Codes...........................................................................................215  
Table 68. POST Error Codes and Messages ..........................................................................217  
Table 69. POST Error Beep Codes.........................................................................................221  
Table 70. Integrated BMC Beep Codes...................................................................................222  
Table 71. Intel® Server System R1000GZ/GL Product Family Feature Set..............................224  
Table 72. Intel® Server System R2000GZ/GL Product Family Feature Set..............................226  
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Introduction  
1. Introduction  
This Technical Product Specification (TPS) provides board-specific information detailing the features,  
functionality, and high-level architecture of the Intel® Server Boards S2600GZ and S2600GL.  
Design-level information related to specific server board components and subsystems can be obtained by  
ordering External Product Specifications (EPS) or External Design Specifications (EDS) related to this server  
generation. EPS and EDS documents are made available under NDA with Intel and must be ordered through  
your local Intel representative. See the Reference Documents section for a list of available documents.  
1.1 Chapter Outline  
This document is divided into the following chapters:  
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Chapter 1 – Introduction  
Chapter 2 – Product Overview  
Chapter 3 – Product Architecture Overview  
Chapter 4 – System Security  
Chapter 5 – Technology Support  
Chapter 6 – Platform Management Functional Overview  
Chapter 7 – Advanced Management Feature Support (RMM4)  
Chapter 8 – On-board Connector/Header Overview  
Chapter 9 – Reset and Recovery Jumpers  
Chapter 10 – Light-Guided Diagnostics  
Chapter 11 – Power Supply Specification Guidelines  
Chapter 12 – BIOS Setup Utility  
Appendix A – Integration and Usage Tips  
Appendix B – Integrated BMC Sensor Tables  
Appendix C – Management Engine Generated SEL Event Messages  
Appendix D – POST Code Diagnostic LED Decoder  
Appendix E – POST Code Errors  
Appendix F – Supported Intel® Server Systems  
1.2 Server Board Use Disclaimer  
Intel Corporation server boards support add-in peripherals and contain a number of high-density VLSI and  
power delivery components that need adequate airflow to cool. Intel® ensures through its own chassis  
development and testing that when Intel® server building blocks are used together, the fully integrated system  
will meet the intended thermal requirements of these components. It is the responsibility of the system  
integrator who chooses not to use Intel®-developed server building blocks to consult vendor datasheets and  
operating parameters to determine the amount of airflow required for their specific application and  
environmental conditions. Intel Corporation cannot be held responsible if components fail or the server board  
does not operate correctly when used outside any of their published operating or  
non-operating limits.  
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Product Overview  
Intel® Server Board S2600GZ/GL TPS  
2. Product Overview  
The Intel® Server Boards S2600GZ and S2600GL are monolithic printed circuit board assemblies with features  
that are intended for high density 1U and 2U rack mount servers. These server boards are designed to support  
both the Intel® Xeon® processor E5-2600 product family and Intel® Xeon® processor E5-2600 v2 product family.  
Previous generation Intel® Xeon® processors are not supported. Many of the features and functions of these  
two server boards are common. A board will be identified by name when a described feature or function is  
unique to it.  
Table 1. Intel® Server Board S2600GZ/S2600GL Feature Set  
Feature  
Description  
Two LGA2011 (Socket R) processor sockets  
Support for one or two processors:  
Intel® Xeon® processor E5-2600 product family with TDP support up to 135 W  
Intel® Xeon® processor E5-2600 v2 product family with TDP support up to 130 W  
Processor Support  
o
o
S2600GL - 16 DIMM slots – 2 DIMMs/Channel – 4 memory channels per processor  
S2600GZ - 24 DIMM slots – 3 DIMMs/Channel – 4 memory channels per processor  
Unbuffered DDR3 (UDIMM), registered DDR3 (RDIMM), Load Reduced DDR3 (LRDIMM)  
Memory  
Chipset  
1
Memory DDR3 data transfer rates of 800, 1066, 1333, 1600, 1866 MT/s  
DDR3 standard I/O voltage of 1.5V and DDR3 Low Voltage of 1.35V  
Intel® C602 chipset with support for optional Storage Option Select keys  
DB-15 Video connector  
RJ-45 Serial Port A connector  
External (Back Panel)  
I/O connections  
Four RJ-45 Network Interface Connectors supporting 10/100/1000Mb  
Three USB 2.0 connectors  
One Type-A USB 2.0 connector  
One 2x5 pin connector providing front panel support for two USB 2.0 ports  
One 2x15 pin SSI-EEB compliant front panel header  
One 2x7pin Front Panel Video connector  
One 1x7pin header for optional Intel® Local Control Panel support  
One DH-10 Serial Port B connector  
Internal I/O  
connectors/headers  
The following I/O modules utilize a proprietary on-board connector. An installed I/O module can be  
supported in addition to standard on-board features and any add-in expansion cards.  
AXX4P1GBPWLIOM – Quad port 1 GbE based on Intel® Ethernet Controller I350  
AXX10GBTWLIOM – Dual RJ-45 port 10GBase-T I/O Module based on Intel® Ethernet  
Controller x540  
I/O Module Options  
AXX10GBNIAIOM – Dual SFP+ port 10GbE module based on Intel® 82599 10 GbE  
controller  
AXX1FDRIBIOM – Single Port FDR 56GT/S speed InfiniBand module with QSFP connector  
AXX2FDRIBIOM – Dual port FDR 56GT/S speed infiniband module with QSFP connector  
Six 10-pin managed system fan headers  
System Fans  
Two riser card slots.  
Riser Card Support  
Each riser card slot has a total of 24PCIe lanes routed to them  
Each riser card slot has support for various 1U and 2U riser cards  
Integrated 2D Video Controller  
Video  
16 MB DDR3 Memory  
®
®
1
Intel Xeon processor E5-2600 v2 product family only  
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Feature  
Description  
One eUSB 2x5 pin connector to support 2mm low-profile eUSB solid state devices  
Two 7-pin single port AHCI SATA connectors capable of supporting up to 6 GB/sec  
Two SCU 4-port mini-SAS connectors capable of supporting up to 3 GB/sec SAS/SATA  
On-board storage  
controllers and  
o
o
SCU 0 Port (Enabled standard)  
SCU 1 Port (Requires Intel RAID C600 Upgrade Key)  
Intel® RAID C600 Upgrade Key support providing optional expanded SCU SATA / SAS RAID  
capabilities  
options  
Intel® Integrated RAID module support (Optional)  
Security  
Intel® TPM module - AXXTPME5 (Accessory Option)  
Integrated Baseboard Management Controller, IPMI 2.0 compliant  
Support for Intel® Server Management Software  
Intel® Remote Management Module 4 support (Accessory Option)  
Intel® Remote Management Module 4 Lite support (Accessory Option)  
Server Management  
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2.1 Server Board Component/Feature Identification  
The following illustration provides a general overview of the server board, identifying key feature and  
component locations.  
Figure 1. Server Board Component/Features Identification  
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Label  
A
Description  
System ID  
Label  
I
Description  
System Fan #3 Fan Fault  
B
System Status  
J
Memory Fault  
C
D
E
F
G
H
POST Code Diagnostics  
12V Stand-by Power Present  
CPU-2 Fault  
System Fan #6 Fan Fault  
System Fan #5 Fan Fault  
System Fan #4 Fan Fault  
K
L
M
N
O
System Fan #2 Fan Fault  
System Fan #1 Fan Fault  
CPU-1 Fault  
CATERR  
System Power Good  
Figure 2. Intel® Light Guided Diagnostic LED Identification  
See Light Guided Diagnostics for additional details.  
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Figure 3. Jumper Block Identification  
See Chapter 9 - Reset & Recovery Jumpers for additional details.  
Label  
A
Description  
NIC 1  
B
NIC 2  
C
NIC 3  
D
NIC 4  
E
Video  
F
G
Serial Port A  
USB Ports  
Figure 4. Intel® Server Board S2600GZ/S2600GL External I/O Connector Layout  
2.2 Server Board Dimensional Mechanical Drawings  
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Figure 5. Intel® Server Board S2600GZ/GL – Primary Side Keepout Zone  
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Figure 6. Intel® Server Board S2600GZ/GL– Hole and Component Positions  
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Product Overview  
Figure 7. Intel® Server Board S2600GZ/GL – Secondary Side Keepout Zone  
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Figure 8. Intel® Server Board S2600GZ/GL– Primary Side Height Restrictions  
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Product Architecture Overview  
3. Product Architecture Overview  
The architecture of Intel® Server Boards S2600GZ and S2600GL is developed around the integrated features  
and functions of the Intel® Xeon® processor E5-2600 product family, the Intel® C602 chipset, the Intel® Ethernet  
Controller I350 GbE controller chip, and the Emulex* Pilot-III Server Management Controller.  
The following diagram provides an overview of the server board architecture, showing the features and  
interconnects of each of the major sub-system components.  
Figure 9. Intel® Server Boards S2600GZ, S2600GL Functional Block Diagram  
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3.1 Processor Support  
The server board includes two Socket-R (LGA2011) processor sockets and can support one or two of the  
following processors:  
.
.
Intel® Xeon® processor E5-2600 product family, with a Thermal Design Power (TDP) of up to 135W.  
Intel® Xeon® processor E5-2600 v2 product family, with a Thermal Design Power (TDP) of up to 130W.  
Note: Previous generation Intel® Xeon® processors are not supported on the Intel server boards described in  
this document.  
Table 2. Supported Intel® Xeon® processor product family feature comparison table  
Intel® Xeon® E5-2600 processor  
product family  
Intel® Xeon® E5-2600 processor v2  
product family  
Feature  
QPI Speed (GT/s)  
8.0, 7.2, and 6.4  
46 bits physical, 48 bits virtual  
Addressability  
Cores  
Up to 8  
Up to 12  
Threads Per Socket  
Last-Level Cache (LLC)  
Intel® Turbo-Boost Technology  
Memory Population  
Max Memory Speed  
Memory RAS  
Up to 16 threads  
Up to 20 MB  
Up to 24 threads  
Up to 30 MB  
YES  
4 Channels of up to 3 RDIMMs, 3 LRDIMMs, or 2 UDIMMs  
Up to 1600 Up to 1866  
ECC, Patrol Scrubbing, Demand Scrubbing, Sparing, Mirroring, Lockstep Mode, x4/x8 SDDC  
40 / 10 (PCIe* 3.0 at 8 GT/s)  
PCIe* Lanes / Controllers /  
Speed (GT/s)  
Idle Power Targets (W)  
15 W or higher, 12 W for LV SKUs  
10.5 W or higher, 7.5 W for LV SKUs  
Visit http://www.intel.com/support.for a complete list of supported processors.  
3.1.1 Processor Socket Assembly  
Each processor socket of the server board is pre-assembled with an Independent Latching Mechanism (ILM)  
and Back Plate which allow for secure placement of the processor and processor heat to the server board.  
The illustration below identifies each sub-assembly component:  
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Product Architecture Overview  
Heat Sink  
Server Board  
Independent Latching  
Mechanism (ILM)  
Back Plate  
Figure 10. Processor Socket Assembly  
There are two variations of the ILM: square and narrow.  
80mm  
94mm  
80mm  
56mm  
Figure 11. Processor Socket ILM Variations  
.
.
The square ILM has an 80x80mm heat sink mounting hole pattern and is used on the Intel® Server  
Board S2600GL.  
The narrow ILM has a 56x94mm heat sink mounting hole pattern and is used on the Intel® Server  
Board S2600GZ.  
Note: Processor heat sink solutions for the Intel® server boards S2600GL and S2600GZ are NOT the same.  
Care must be taken when selecting heat sinks for the given server board ensuring the screw layout pattern of  
the heat sink matches the screw hole pattern of the ILM.  
3.1.2  
Processor Population Rules  
Note: Although the server board does support dual-processor configurations consisting of different processors  
that meet the defined criteria below, Intel does not perform validation testing of this configuration. For optimal  
system performance in dual-processor configurations, Intel recommends that identical processors be installed.  
When using a single processor configuration, the processor must be installed into the processor socket labeled  
“CPU_1”.  
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When two processors are installed, the following population rules apply:  
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.
.
Both processors must be of the same processor family.  
Both processors must have the same number of cores  
Both processors must have the same cache sizes for all levels of processor cache memory.  
Processors with different core frequencies can be mixed in a system, given the prior rules are met. If this  
condition is detected, all processor core frequencies are set to the lowest common denominator (highest  
common speed) and an error is reported.  
Processors which have different Intel® Quickpath (QPI) Link Frequencies may operate together if they are  
otherwise compatible and if a common link frequency can be selected. The common link frequency would be  
the highest link frequency that all installed processors can achieve.  
Processor stepping within a common processor family can be mixed as long as it is listed in the processor  
specification updates published by Intel Corporation.  
3.1.3  
Processor Initialization Error Summary  
The following table describes mixed processor conditions and recommended actions for all Intel® server  
boards and Intel server systems designed around the Intel® Xeon® processor E5-2600 product family and  
Intel® C600 chipset product family architecture. The errors fall into one of the following categories:  
Fatal: If the system can boot, it pauses at a blank screen with the text “Unrecoverable fatal error found.  
System will not boot until the error is resolved” and “Press <F2> to enter setup”, regardless of whether  
the “Post Error Pause” setup option is enabled or disabled.  
When the operator presses the <F2> key on the keyboard, the error message is displayed on the Error  
Manager screen, and an error is logged to the System Event Log (SEL) with the POST Error Code.  
The system cannot boot unless the error is resolved. The user needs to replace the faulty part and restart the  
system.  
For Fatal Errors during processor initialization, the System Status LED will be set to a steady Amber color,  
indicating an unrecoverable system failure condition.  
Major: If the “Post Error Pause” setup option is enabled, the system goes directly to the Error Manager to  
display the error, and logs the POST Error Code to SEL. Operator intervention is required to continue booting  
the system.  
Otherwise, if “POST Error Pause” is disabled, the system continues to boot and no prompt is given for the error,  
although the Post Error Code is logged to the Error Manager and in a SEL message.  
Minor: The message is displayed on the screen or on the Error Manager screen, and the POST Error Code is  
logged to the SEL. The system continues booting in a degraded state. The user may want to replace the  
erroneous unit. The POST Error Pause option setting in the BIOS setup does not have any effect on this error.  
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Table 3. Mixed Processor Configurations Error Summary  
Error  
Severity  
Fatal  
System Action  
Processor family not Identical  
The BIOS detects the error condition and responds as follows:  
Logs the POST Error Code into the System Event Log (SEL).  
Alerts the BMC to set the System Status LED to steady Amber.  
Displays “0194: Processor family mismatch detected” message  
in the Error Manager.  
Takes Fatal Error action (see above) and will not boot until the fault  
condition is remedied.  
Processor model not Identical  
Fatal  
The BIOS detects the error condition and responds as follows:  
Logs the POST Error Code into the System Event Log (SEL).  
Alerts the BMC to set the System Status LED to steady Amber.  
Displays “0196: Processor model mismatch detected” message  
in the Error Manager.  
Takes Fatal Error action (see above) and will not boot until the fault  
condition is remedied.  
Processor cores/threads not identical Fatal  
The BIOS detects the error condition and responds as follows:  
Logs the POST Error Code into the SEL.  
Alerts the BMC to set the System Status LED to steady Amber.  
Displays “0191: Processor core/thread count mismatch  
detected” message in the Error Manager.  
Takes Fatal Error action (see above) and will not boot until the fault  
condition is remedied.  
Processor cache not identical  
Fatal  
Fatal  
The BIOS detects the error condition and responds as follows:  
Logs the POST Error Code into the SEL.  
Alerts the BMC to set the System Status LED to steady Amber.  
Displays “0192: Processor cache size mismatch detected  
message in the Error Manager.  
Takes Fatal Error action (see above) and will not boot until the fault  
condition is remedied.  
Processor frequency (speed) not  
identical  
The BIOS detects the processor frequency difference, and responds  
as follows:  
Adjusts all processor frequencies to the highest common frequency.  
No error is generated – this is not an error condition.  
Continues to boot the system successfully.  
If the frequencies for all processors cannot be adjusted to be the  
same, then this is an error, and the BIOS responds as follows:  
Logs the POST Error Code into the SEL.  
Alerts the BMC to set the System Status LED to steady Amber.  
Does not disable the processor.  
Displays “0197: Processor speeds unable to synchronize”  
message in the Error Manager.  
Takes Fatal Error action (see above) and will not boot until the fault  
condition is remedied.  
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Error  
Processor Intel® QuickPath  
Interconnect link frequencies not  
identical  
Severity  
Fatal  
System Action  
The BIOS detects the QPI link frequencies and responds as follows:  
Adjusts all QPI interconnect link frequencies to highest common  
frequency.  
No error is generated – this is not an error condition.  
Continues to boot the system successfully.  
If the link frequencies for all QPI links cannot be adjusted to be the  
same, then this is an error, and the BIOS responds as follows:  
Logs the POST Error Code into the SEL.  
Alerts the BMC to set the System Status LED to steady Amber.  
Displays “0195: Processor Intel® QPI link frequencies unable to  
synchronize” message in the Error Manager.  
Does not disable the processor.  
Takes Fatal Error action (see above) and will not boot until the fault  
condition is remedied.  
Processor microcode update missing Minor  
The BIOS detects the error condition and responds as follows:  
Logs the POST Error Code into the SEL.  
Displays “818x: Processor 0x microcode update not found”  
message in the Error Manager or on the screen.  
The system continues to boot in a degraded state, regardless of the  
setting of POST Error Pause in the Setup.  
Processor microcode update failed  
Major  
The BIOS detects the error condition and responds as follows:  
Logs the POST Error Code into the SEL.  
Displays “816x: Processor 0x unable to apply microcode  
update” message in the Error Manager or on the screen.  
Takes Major Error action. The system may continue to boot in a  
degraded state, depending on the setting of POST Error Pause in  
Setup, or may halt with the POST Error Code in the Error Manager  
waiting for operator intervention.  
3.1.4  
Processor Thermal Design Power (TDP) Support  
To allow optimal operation and long-term reliability of Intel processor-based systems, the processor must  
remain within the defined minimum and maximum case temperature (TCASE) specifications. Thermal solutions  
not designed to provide sufficient thermal capability may affect the long-term reliability of the processor and  
system. The server board is designed to support the Intel® Xeon® Processor E5-2600 product family TDP  
guidelines up to and including 135W.  
Disclaimer Note: Intel Corporation server boards contain a number of high-density VLSI and power delivery  
components that need adequate airflow to cool. Intel ensures through its own chassis development and testing  
that when Intel server building blocks are used together, the fully integrated system will meet the intended  
thermal requirements of these components. It is the responsibility of the system integrator who chooses not to  
use Intel developed server building blocks to consult vendor datasheets and operating parameters to  
determine the amount of airflow required for their specific application and environmental conditions. Intel  
Corporation cannot be held responsible if components fail or the server board does not operate correctly when  
used outside any of their published operating or non-operating limits.  
3.2 Processor Functions Overview  
With the release of the Intel® Xeon® processor E5-2600 product family, several key system components,  
including the CPU, Integrated Memory Controller (IMC), and Integrated IO Module (IIO), have been combined  
into a single processor package and feature per socket; two Intel® QuickPath Interconnect point-to-point links  
capable of up to 8.0 GT/s, up to 40 lanes of Gen 3 PCI Express* links capable of 8.0 GT/s, and 4 lanes of  
DMI2/PCI Express* Gen 2 interface with a peak transfer rate of 5.0 GT/s. The processor supports up to 46 bits  
of physical address space and 48-bit of virtual address space.  
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Product Architecture Overview  
The following sections will provide an overview of the key processor features and functions that help to define  
the architecture, performance and supported functionality of the server board. For more comprehensive  
processor specific information, refer to the Intel® Xeon® processor E5-2600 product family documents listed in  
the Reference Documents list.  
3.2.1  
Processor Core Features:  
.
.
.
.
.
.
.
.
Up to 8 execution cores (Intel® Xeon® processor E5-2600 product family)  
Up to 12 execution cores (Intel® Xeon® processor E5-2600 v2 product family)  
Each core supports two threads (Intel® Hyper-Threading Technology), up to 16 threads per socket  
46-bit physical addressing and 48-bit virtual addressing  
1 GB large page support for server applications  
A 32-KB instruction and 32-KB data first-level cache (L1) for each core  
A 256-KB shared instruction/data mid-level (L2) cache for each core  
Up to 20 MB last level cache (LLC): up to 2.5 MB per core instruction/data last level cache (LLC),  
shared among all cores  
3.2.2  
Supported Technologies:  
.
.
.
.
.
.
.
.
.
.
.
.
.
.
Intel® Virtualization Technology (Intel® VT)  
Intel® Virtualization Technology for Directed I/O (Intel® VT-d)  
Intel® Virtualization Technology Processor Extensions  
Intel® Trusted Execution Technology (Intel® TXT)  
Intel® 64 Architecture  
Intel® Streaming SIMD Extensions 4.1 (Intel® SSE4.1)  
Intel® Streaming SIMD Extensions 4.2 (Intel® SSE4.2)  
Intel® Advanced Vector Extensions (Intel® AVX)  
Intel® Hyper-Threading Technology  
Execute Disable Bit  
Intel® Turbo Boost Technology  
Intel® Intelligent Power Technology  
Data Direct I/O (DDIO)  
Enhanced Intel® SpeedStep Technology  
3.2.3  
Intel® QuickPath Interconnect  
The Intel® QuickPath Interconnect (QPI) is a high speed, packetized, point-to-point interconnect used in the  
processor. The narrow high-speed links stitch together processors in distributed shared memory and integrated  
I/O platform architecture. It offers much higher bandwidth with low latency. The Intel® QuickPath Interconnect  
has an efficient architecture allowing more interconnect performance to be achieved in real systems. It has a  
snoop protocol optimized for low latency and high scalability, as well as packet and lane structures enabling  
quick completions of transactions. Reliability, availability, and serviceability features (RAS) are built into the  
architecture.  
The physical connectivity of each interconnect link is made up of twenty differential signal pairs plus a  
differential forwarded clock. Each port supports a link pair consisting of two uni-directional links to complete the  
connection between two components. This supports traffic in both directions simultaneously. To facilitate  
flexibility and longevity, the inter-connect is defined as having five layers: Physical, Link, Routing, Transport, and  
Protocol.  
The Intel® QuickPath Interconnect includes a cache coherency protocol to keep the distributed memory and  
caching structures coherent during system operation. It supports both low-latency source snooping and a  
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scalable home snoop behavior. The coherency protocol provides for direct cache-to-cache transfers for optimal  
latency.  
3.2.4  
Integrated Memory Controller (IMC) and Memory Subsystem  
CPU 2  
CPU 1  
Figure 12. Integrated Memory Controller Functional Block Diagram  
Integrated into the processor is a memory controller. Each processor provides four DDR3 channels that  
support the following:  
.
.
Unbuffered DDR3 and registered DDR3 DIMMs  
LR DIMM (Load Reduced DIMM) for buffered memory solutions demanding higher capacity  
memory subsystems  
.
.
.
.
.
.
Independent channel mode or lockstep mode  
Data burst length of eight cycles for all memory organization modes  
Memory DDR3 data transfer rates of 800, 1066, 1333, 1600, 18662 MT/s,  
64-bit wide channels plus 8-bits of ECC support for each channel  
DDR3 standard I/O Voltage of 1.5 V and DDR3 Low Voltage of 1.35 V  
1-Gb, 2-Gb, and 4-Gb DDR3 DRAM technologies supported for these devices:  
o
o
o
UDIMM DDR3 – SR x8 and x16 data widths, DR – x8 data width  
RDIMM DDR3 – SR,DR, and QR – x4 and x8 data widths  
LRDIMM DDR3 – QR – x4 and x8 data widths with direct map or with rank multiplication  
.
.
.
Up to 8 ranks supported per memory channel, 1, 2 or 4 ranks per DIMM  
Open with adaptive idle page close timer or closed page policy  
Per channel memory test and initialization engine can initialize DRAM to all logical zeros with  
valid ECC (with or without data scrambler) or a predefined test pattern  
Isochronous access support for Quality of Service (QoS)  
Minimum memory configuration: independent channel support with 1 DIMM populated  
Integrated dual SMBus* master controllers  
.
.
.
.
.
Command launch modes of 1n/2n  
RAS Support:  
o
o
o
Rank Level Sparing and Device Tagging  
Demand and Patrol Scrubbing  
DRAM Single Device Data Correction (SDDC) for any single x4 or x8 DRAM device.  
Independent channel mode supports x4 SDDC. x8 SDDC requires lockstep mode  
Lockstep mode where channels 0 & 1 and channels 2 & 3 are operated in lockstep mode  
Data scrambling with address to ease detection of write errors to an incorrect address.  
Error reporting from Machine Check Architecture  
o
o
o
o
o
Read Retry during CRC error handling checks by iMC  
Channel mirroring within a socket  
-
-
CPU1 Channel Mirror Pairs (A,B) and (C,D)  
CPU2 Channel Mirror Pairs (E,F) and (G,H)  
o
Error Containment Recovery  
®
®
2
Intel Xeon processor E5-2600 v2 product family only  
18  
Revision 2.4  
 
 
Intel® Server Board S2600GZ/GL TPS  
Product Architecture Overview  
.
.
Improved Thermal Throttling with dynamic Closed Loop Thermal Throttling (CLTT)  
Memory thermal monitoring support for DIMM temperature  
3.2.4.1  
Supported Memory  
Table 4. UDIMM Support Guidelines – Intel® Xeon® processor E5-2600 product family  
Speed (MT/s) and Voltage Validated by  
Ranks  
Per  
DIMM  
& Data  
Width  
Slot per Channel (SPC) and DIMM Per Channel (DPC)  
2 Slots per Channel  
3 Slots per Channel  
Intel® Sever Board S2600GZ  
2DPC  
Memory Capacity Per  
DIMM1  
Intel® Server Board S2600GL  
1DPC  
2DPC  
1DPC  
3DPC  
1.35V  
1066,  
1333  
1066,  
1333  
1.5V  
1066,  
1333  
1.35V  
1.5V  
1066,  
1333  
1.35V  
1.5V  
1066,  
1333  
1.35V  
1.5V  
1066,  
1333  
n/a  
n/a  
SRx8  
ECC  
1GB 2GB 4GB  
2GB 4GB 8GB  
1066  
1066  
1066  
DRx8  
ECC  
1066,  
1333  
1066,  
1333  
1066,  
1333  
1066,  
1333  
1066  
1066  
1066  
Table 5. UDIMM Support Guidelines – Intel® Xeon® processor E5-2600 v2 product family  
Speed (MT/s) and Voltage Validated by  
Ranks  
Per  
DIMM  
& Data  
Width  
Slot per Channel (SPC) and DIMM Per Channel (DPC)  
2 Slots per Channel  
3 Slots per Channel  
Intel® Sever Board S2600GZ  
2DPC  
Memory Capacity Per  
DIMM1  
Intel® Server Board S2600GL  
1DPC  
2DPC  
1DPC  
3DPC  
1.35V  
1.5V  
1.35V  
1.5V  
1.35V  
1.5V  
1.35V  
1.5V  
1066,  
1333,  
1600,  
1866  
1066,  
1333,  
1600,  
1866  
1066,  
1333,  
1600  
1066,  
1333,  
1600  
1066,  
1333  
1066,  
1333  
1066,  
1333  
1066,  
1333  
SRx8  
ECC  
Not  
supported  
1GB 2GB 4GB  
2GB 4GB 8GB  
1066,  
1333,  
1600,  
1866  
1066,  
1333,  
1600,  
1866  
1066,  
1333,  
1600  
1066,  
1333,  
1600  
1066,  
1333  
1066,  
1333  
1066,  
1333  
1066,  
1333  
DRx8  
ECC  
Not  
supported  
19  
Revision 2.4  
 
 
 
Product Architecture Overview  
Intel® Server Board S2600GZ/GL TPS  
Table 6. RDIMM Support Guidelines – Intel® Xeon® processor E5-2600 product family  
Speed (MT/s) and Voltage Validated by  
Slot per Channel (SPC) and DIMM Per Channel (DPC)  
Memory Capacity Per  
Ranks Per DIMM &  
Data Width  
2 Slots per Channel  
3 Slots per Channel  
DIMM1  
Intel® Server Board S2600GL  
Intel® Sever Board S2600GZ  
1DPC  
2DPC  
1.5V  
1DPC  
1.5V  
2DPC  
3DPC  
1.35V  
1.5V  
1066  
1333  
1600  
1.35V  
1.35V  
1.35V  
1.5V  
1.35V 1.5V  
1066  
1333  
1600  
1066  
1333  
1600  
1066  
1333  
1600  
1066  
1333  
1066  
1333  
1066  
1333  
800  
n/a  
1066  
1333  
SRx8  
DRx8  
SRx4  
1GB  
2GB  
2GB  
2GB  
4GB  
4GB  
4GB  
8GB  
8GB  
1066  
1066  
1333  
1600  
1066  
1333  
1600  
1066  
1333  
1600  
1066  
1333  
1600  
1066  
1333  
1066  
1333  
1066  
1333  
800  
n/a  
1066  
1333  
1066  
1066  
1333  
1600  
1066  
1333  
1600  
1066  
1333  
1600  
1066  
1333  
1600  
1066  
1333  
1066,  
1333  
1066  
1333  
800  
n/a  
1066  
1333  
1066  
1066  
1333  
1600  
1066  
1333  
1600  
1066  
1333  
1600  
1066  
1333  
1600  
1066  
1333  
1066  
1333  
1066  
1333  
800  
n/a  
1066  
1333  
DRx4  
QRx4  
QRx8  
4GB  
8GB  
4GB  
8GB  
16GB  
8GB  
16GB  
32GB  
16GB  
1066  
1066  
1066  
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
n/a  
n/a  
n/a  
n/a  
1066  
1066  
800  
800  
Table 7. RDIMM Support Guidelines – Intel® Xeon® processor E5-2600 v2 product family  
Speed (MT/s) and Voltage Validated by  
Slot per Channel (SPC) and DIMM Per Channel (DPC)  
Memory Capacity Per  
Ranks Per DIMM &  
Data Width  
2 Slots per Channel  
3 Slots per Channel  
DIMM1  
Intel® Server Board S2600GL  
Intel® Sever Board S2600GZ  
1DPC  
2DPC  
1.5V  
1DPC  
1.5V  
2DPC  
3DPC  
1.35V  
1.5V  
1066  
1333  
1600  
1866  
1.35V  
1.35V  
1.35V  
1.5V  
1.35V 1.5V  
1066  
1333  
1600  
1866  
1066  
1333  
1600  
1066  
1333  
1600  
1066  
1333  
1066  
1333  
1066  
1333  
800  
800  
1066  
1333  
SRx8  
DRx8  
SRx4  
DRx4  
1GB  
2GB  
2GB  
4GB  
2GB  
4GB  
4GB  
8GB  
4GB  
8GB  
1066  
1066  
1333  
1600  
1866  
1066  
1333  
1600  
1866  
1066  
1333  
1600  
1066  
1333  
1600  
1066  
1333  
1066  
1333  
1066  
1333  
800  
800  
1066  
1333  
1066  
1066  
1333  
1600  
1866  
1066  
1333  
1600  
1866  
1066  
1333  
1600  
1066  
1333  
1600  
1066  
1333  
1066  
1333  
1066  
1333  
800  
800  
1066  
1333  
8GB  
1066  
1066  
1333  
1600  
1866  
1066  
1333  
1600  
1866  
1066  
1333  
1600  
1066  
1333  
1600  
1066  
1333  
1066  
1333  
1066  
1333  
800  
800  
1066  
1333  
16GB  
1066  
800  
1066  
800  
1066  
QRx8  
QRx4  
4GB  
8GB  
8GB  
16GB  
32GB  
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
800  
n/a  
n/a  
n/a  
n/a  
800  
1066  
800  
1066  
16GB  
20  
Revision 2.4  
 
 
Intel® Server Board S2600GZ/GL TPS  
Product Architecture Overview  
Table 8. LRDIMM Support Guidelines – Intel® Xeon® processor E5-2600 product family  
Speed (MT/s) and Voltage Validated by  
Slot per Channel (SPC) and DIMM Per Channel (DPC)  
Ranks Per  
DIMM &  
Data  
Memory Capacity Per  
DIMM2  
2 Slots per Channel  
Intel® Sever Board S2600GL  
3 Slots per Channel  
Intel® Sever Board S2600GZ  
Width  
1DPC and 2DPC  
1DPC and 2DPC  
3DPC  
1.35V  
1.5V  
1.35V  
1.5V  
1.35V  
1.5V  
QRx4  
(DDP)  
QRx8  
(P)  
1066,  
1333  
16GB  
8GB  
32GB  
16GB  
1066  
1066, 1333  
1066  
1066  
1066  
1066,  
1333  
1066  
1066, 1333  
1066  
1066  
1066  
Table 9. LRDIMM Support Guidelines – Intel® Xeon® processor E5-2600 v2 product family  
Speed (MT/s) and Voltage Validated by  
Slot per Channel (SPC) and DIMM Per Channel (DPC)  
Ranks  
Per  
DIMM &  
Data  
Memory Capacity  
2 Slots per Channel  
3 Slots per Channel  
Intel® Sever Board S2600GZ  
2DPC  
Per DIMM2  
Intel® Sever Board S2600GL  
Width  
1DPC  
2DPC  
1DPC  
3DPC  
1.35V  
1.5V  
1066  
1333  
1600  
1866  
1.35V  
1.5V  
1.35V  
1.5V  
1066  
1333  
1600  
1866  
1.35V  
1.5V  
1.35V  
1.5V  
1066  
1333  
1600  
1066  
1333  
1600  
1066  
1333  
1600  
1066  
1333  
1600  
1066  
1333  
1600  
1066  
1333  
1600  
QRx4  
(DDP)  
1066  
1066  
16GB  
32GB  
64GB  
8Rx4  
(QDP)  
32GB  
1066  
1066  
1066  
1066  
1066  
1066  
1066  
1066  
1066  
1066  
3.2.4.1.1  
Phase Shedding Configuration Option in BIOS Setup  
Intel has added a user configurable option called “Phase Shedding” to BIOS Setup. By default, this option is  
configured to “Disabled”, providing maximum VR power which mitigates possible instability issues when using  
LRDIMMs greater than 16 GB or 3 DPC memory configurations. This option should only be “Enabled” for  
optimized power in 1DPC and 2DPC configurations and when using LRDIMM sizes 16GB and smaller.  
Note: The Phase Shedding BIOS setup option can be found in BIOS revision 02.02.0002 and later.  
3.2.4.2  
Memory Slot Identification and Population Rules  
Note: Although mixed DIMM configurations may be functional, Intel only performs platform validation on  
systems that are configured with identical DIMMs installed.  
.
Each installed processor provides four channels of memory. On the Intel® Server Board S2600GZ  
each memory channel supports three memory slots, for a total possible 24 DIMMs installed. On the  
Intel® Server Board S2600GL each memory channel supports 2 memory slots, for a total possible 16  
DIMMs installed.  
.
.
System memory is organized into physical slots on DDR3 memory channels that belong to processor  
sockets.  
The memory channels from processor socket 1 are identified as Channel A, B, C and D. The memory  
channels from processor socket 2 are identified as Channel E, F, G, and H.  
21  
Revision 2.4  
 
 
 
Product Architecture Overview  
Intel® Server Board S2600GZ/GL TPS  
.
Each memory slot on the server board is identified by channel and slot number within that channel. For  
example, DIMM_A1 is the first slot on Channel A on processor 1; DIMM_E1 is the first DIMM socket on  
Channel E on processor 2.  
.
.
The memory slots associated with a given processor are unavailable if the corresponding processor  
socket is not populated.  
A processor may be installed without populating the associated memory slots provided a second  
processor is installed with associated memory. In this case, the memory is shared by the processors.  
However, the platform suffers performance degradation and latency due to the remote memory.  
.
.
Processor sockets are self-contained and autonomous. However, all memory subsystem support (such  
as Memory RAS, Error Management,) in the BIOS setup are applied commonly across processor  
sockets.  
The BLUE memory slots on the server board identify the first memory slot for a given memory channel.  
DIMM population rules require that DIMMs within a channel be populated starting with the BLUE DIMM slot or  
DIMM farthest from the processor in a “fill-farthest” approach. In addition, when populating a Quad-rank DIMM  
with a Single- or Dual-rank DIMM in the same channel, the Quad-rank DIMM must be populated farthest from  
the processor. Note that Quad-rank DIMMs and UDIMMs are not allowed in three slots populated  
configurations. Intel MRC will check for correct DIMM placement.  
Figure 13. Memory Slots Definition  
On the Intel® Server Board S2600GZ, a total of 24 DIMM slots is provided (2 CPUs – 4 Channels/CPU, 3  
DIMMs/Channel). The nomenclature for memory slots is detailed in the following table:  
Table 10. Intel® Server Board S2600GZ Memory Slot Identification  
Processor Socket 1  
Processor Socket 2  
(0)  
(1)  
Channel B  
B1  
(2)  
(3)  
(0)  
(1)  
Channel F  
F1  
(2)  
(3)  
Channel A  
Channel C  
Channel D  
Channel E  
Channel G  
Channel H  
A1  
C1  
D1  
E1  
G1  
H1  
A2 A3  
B2 B3  
C2 C3  
D2 D3  
E2 E3  
F2 F3  
G2 G3  
H2 H3  
22  
Revision 2.4  
 
 
Intel® Server Board S2600GZ/GL TPS  
Product Architecture Overview  
Figure 14. Intel® Server Board S2600GZ Memory Slot Layout  
On the Intel® Server Board S2600GL a total of 16 DIMM slots is provided (2 CPUs – 4 Channels/CPU, 2  
DIMMs /Channel). The nomenclature for memory slots is detailed in the following table:  
Table 11. Intel® Server Board S2600GL Memory Slot Nomenclature  
Processor Socket 1  
Processor Socket 2  
(0)  
(1)  
Channel B  
B1 B2  
(2)  
(3)  
(0)  
(1)  
Channel F  
F1 F2  
(2)  
(3)  
Channel A  
Channel C  
Channel D  
Channel E  
Channel G  
Channel H  
A1  
A2  
C1  
C2  
D1  
D2  
E1  
E2  
G1  
G2  
H1  
H2  
23  
Revision 2.4  
 
 
Product Architecture Overview  
Intel® Server Board S2600GZ/GL TPS  
Figure 15. Intel® Server Board S2600GL Memory Slot Layout  
The following are generic DIMM population requirements that generally apply to both the Intel® Server Board  
S2600GZ and Intel® Server Board S2600GL.  
.
.
.
.
.
All DIMMs must be DDR3 DIMMs  
Intel only validates and supports ECC memory for its server products.  
Mixing of Registered and Unbuffered DIMMs is not allowed per platform.  
Mixing of LRDIMM with any other DIMM type is not allowed per platform.  
Mixing of DDR3 voltages is not validated within a socket or across sockets by Intel. If 1.35V (DDR3L)  
and 1.50V (DDR3) DIMMs are mixed, the DIMMs will run at 1.50V.  
.
Mixing of DDR3 operating frequencies is not validated within a socket or across sockets by Intel. If  
DIMMs with different frequencies are mixed, all DIMMs will run at the common lowest frequency.  
Quad rank RDIMMs are supported but not validated by Intel.  
A maximum of 8 logical ranks (ranks seen by the host) per channel is allowed.  
DIMMs with different timing parameters can be installed on different slots within the same channel, but  
only timings that support the slowest DIMM will be applied to all. As a consequence, faster DIMMs will be  
operated at timings supported by the slowest DIMM populated.  
.
.
.
.
.
When one DIMM is used, it must be populated in the BLUE DIMM slot (farthest away from the CPU) of a  
given channel.  
When single, dual and quad rank DIMMs are populated for 2DPC or 3DPC, always populate the higher  
number rank DIMM first (starting from the farthest slot), for example, first quad rank, then dual rank, and  
last single rank DIMM.  
.
Mixing of quad ranks DIMMs (RDIMM Raw Cards F and H) in one channel and three DIMMs in other  
channel (3DPC) on the same CPU socket is not validated.  
24  
Revision 2.4  
 
Intel® Server Board S2600GZ/GL TPS  
Product Architecture Overview  
3.2.4.3  
Publishing System Memory  
.
The BIOS displays the “Total Memory” of the system during POST if Quiet Boot is disabled in BIOS  
setup. This is the total size of memory discovered by the BIOS during POST, and is the sum of the  
individual sizes of installed DDR3 DIMMs in the system.  
.
The BIOS displays the “Effective Memory” of the system in the BIOS setup. The term Effective Memory  
refers to the total size of all DDR3 DIMMs that are active (not disabled) and not used as redundant  
units.  
.
.
.
The BIOS provides the total memory of the system in the main page of the BIOS setup. This total is the  
same as the amount described by the first bullet above.  
If Quiet Boot is disabled, the BIOS displays the total system memory on the diagnostic screen at the  
end of POST. This total is the same as the amount described by the first bullet above.  
Note: Some server operating systems do not display the total physical memory installed. What is displayed is  
the amount of physical memory minus the approximate memory space used by system BIOS components.  
These BIOS components include, but are not limited to:  
.
.
.
.
.
.
ACPI (may vary depending on the number of PCI devices detected in the system)  
ACPI NVS table  
Processor microcode  
Memory Mapped I/O (MMIO)  
Manageability Engine (ME)  
BIOS flash  
3.2.4.4  
Integrated Memory Controller Operating Modes  
3.2.4.4.1  
Independent Channel Mode  
In non-ECC and x4 SDDC configurations, each channel is running independently (nonlock-step), that is, each  
cache-line from memory is provided by a channel. To deliver the 64-byte cache-line of data, each channel is  
bursting eight 8-byte chunks. Back to back data transfer in the same direction and within the same rank can be  
sent back-to-back without any dead-cycle. The independent channel mode is the recommended method to  
deliver most efficient power and bandwidth as long as the x8 SDDC is not required.  
3.2.4.4.2  
Lockstep Channel Mode  
In lockstep channel mode the cache-line is split across channels. This is done to support Single Device Data  
Correction (SDDC) for DRAM devices with 8-bit wide data ports. Also, the same address is used on both  
channels, such that an address error on any channel is detectable by bad ECC. The iMC module always  
accumulates 32-bytes before forwarding data so there is no latency benefit for disabling ECC.  
Lockstep channels must be populated identically. That is, each DIMM in one channel must have a  
corresponding DIMM of identical organization (number ranks, number banks, number rows, number columns).  
DIMMs may be of different speed grades, but the iMC module will be configured to operate all DIMMs  
according to the slowest parameters present by the Memory Reference Code (MRC).  
Channel 0 and channel 1 can be in lockstep. Channel 2 and 3 can be in lockstep.  
Performance in lockstep mode cannot be as high as with independent channels. The burst length for DDR3  
DIMMs is eight which is shared between two channels that are in lockstep mode. Each channel of the pair  
provides 32 bytes to produce the 64-byte cache-line. DRAMs on independent channels are configured to  
deliver a burst length of eight. The maximum read bandwidth for a given Rank is half of peak. There is another  
draw back in using lockstep mode, that is, higher power consumption since the total activation power is about  
twice of the independent channel operation if comparing to same type of DIMMs.  
25  
Revision 2.4  
 
 
Product Architecture Overview  
Intel® Server Board S2600GZ/GL TPS  
3.2.4.4.3  
Mirror Mode  
Memory mirroring mode is the mechanism by which a component of memory is mirrored. In mirrored mode,  
when a write is performed to one copy, a write is generated to the target location as well. This guarantees that  
the target is always updated with the latest data from the main copy. The iMC module supports mirroring  
across the corresponding mirroring channel within the processor socket but not across sockets. DIMM  
organization in each slot of one channel must be identical to the DIMM in the corresponding slot of the other  
channel. This allows a single decode for both channels. When mirroring mode is enabled, memory image in  
Channel 0 is maintained the same as Channel 1 and Channel 2 is maintained the same as Channel 3.  
3.2.4.5  
Memory RAS Support  
The server board supports the following memory RAS modes:  
.
.
.
.
.
.
.
Single Device Data Correction (SDDC)  
Error Correction Code (ECC) Memory  
Demand Scrubbing for ECC Memory  
Patrol Scrubbing for ECC Memory  
Rank Sparing Mode  
Mirrored Channel Mode  
Lockstep Channel Mode  
Regardless of RAS mode, the requirements for populating within a channel given in the section 3.2.2.2 must  
be met at all times. Note that support of RAS modes that require matching DIMM population between channels  
(Mirrored and Lockstep) require that ECC DIMMs be populated. Independent Channel Mode is the only mode  
that supports non-ECC DIMMs in addition to ECC DIMMs.  
For Lockstep Channel Mode and Mirroring Mode, processor channels are paired together as a “Domain”.  
.
.
.
.
CPU1 Mirroring/Lockstep Domain 1 = Channel A + Channel B  
CPU1 Mirroring/Lockstep Domain 2 = Channel C + Channel D  
CPU2 Mirroring/Lockstep Domain 1 = Channel E + Channel F  
CPU2 Mirroring/Lockstep Domain 2 = Channel G + Channel H  
For RAS modes that require matching populations, the same slot positions across channels must hold the  
same DIMM type with regards to size and organization. DIMM timings do not have to match but timings will be  
set to support all DIMMs populated (that is, DIMMs with slower timings will force faster DIMMs to the slower  
common timing modes).  
3.2.4.5.1  
Single Device Data Correction (SDDC)  
SDDC – Single Device Data Correction is a technique by which data can be replaced by the IMC from an  
entire x4 DRAM device which is failing, using a combination of CRC plus parity. This is an automatic IMC  
driven hardware. It can be extended to x8 DRAM technology by placing the system in Channel Lockstep Mode.  
3.2.4.5.2  
Error Correction Code (ECC) Memory  
ECC uses “extra bits” – 64-bit data in a 72-bit DRAM array – to add an 8-bit calculated “Hamming Code” to  
each 64 bits of data. This additional encoding enables the memory controller to detect and report single or  
multiple bit errors when data is read, and to correct single-bit errors.  
3.2.4.5.2.1  
Correctable Memory ECC Error Handling  
A “Correctable ECC Error” is one in which a single-bit error in memory contents is detected and corrected by  
use of the ECC Hamming Code included in the memory data. For a correctable error, data integrity is  
preserved, but it may be a warning sign of a true failure to come. Note that some correctable errors are  
expected to occur.  
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The system BIOS has logic to cope with the random factor in correctable ECC errors. Rather than reporting  
every correctable error that occurs, the BIOS has a threshold and only logs a correctable error when a  
threshold value is reached. Additional correctable errors that occur after the threshold has been reached are  
disregarded. In addition, on the expectation the server system may have extremely long operational runs  
without being rebooted, there is a “Leaky Bucket” algorithm incorporated into the correctable error counting  
and comparing mechanism. The “Leaky Bucket” algorithm reduces the correctable error count as a function of  
time – as the system remains running for a certain amount of time, the correctable error count will “leak out” of  
the counting registers. This prevents correctable error counts from building up over an extended runtime.  
The correctable memory error threshold value is a configurable option in the <F2> BIOS Setup Utility, where  
you can configure it for 20/10/5/ALL/None  
Once a correctable memory error threshold is reached, the event is logged to the System Event Log (SEL) and  
the appropriate memory slot fault LED is lit to indicate on which DIMM the correctable error threshold crossing  
occurred.  
3.2.4.5.2.2  
Uncorrectable Memory ECC Error Handling  
All multi-bit “detectable but not correctable“ memory errors are classified as Uncorrectable Memory ECC Errors.  
This is generally a fatal error.  
However, before returning control to the OS drivers from Machine Check Exception (MCE) or Non-Maskable  
Interrupt (NMI), the Uncorrectable Memory ECC Error is logged to the SEL, the appropriate memory slot fault  
LED is lit, and the System Status LED state is changed to a solid Amber.  
3.2.4.5.3  
Demand Scrubbing for ECC Memory  
Demand scrubbing is the ability to write corrected data back to the memory once a correctable error is  
detected on a read transaction. This allows for correction of data in memory at detect, and decrease the  
chances of a second error on the same address accumulating to cause a multi-bit error (MBE) condition.  
Demand Scrubbing is enabled/disabled (default is enabled) in the Memory Configuration screen in Setup.  
3.2.4.5.4  
Patrol Scrubbing for ECC Memory  
Patrol scrubs are intended to ensure that data with a correctable error does not remain in DRAM long enough  
to stand a significant chance of further corruption to an uncorrectable stage.  
3.2.4.5.5  
Rank Sparing Mode  
Rank Sparing Mode enhances the system’s RAS capability by “swapping out” failing ranks of DIMMs. Rank  
Sparing is strictly channel and rank oriented. Each memory channel is a Sparing Domain.  
For Rank Sparing to be available as a RAS option, there must be 2 or more single rank or dual rank DIMMs, or  
at least one quad rank DIMM installed on each memory channel.  
Rank Sparing Mode is enabled/disabled in the Memory RAS and Performance Configuration screen in the <F2>  
Bios Setup Utility  
When Sparing Mode is operational, for each channel, the largest size memory rank is reserved as a “spare”  
and is not used during normal operations. The impact on Effective Memory Size is to subtract the sum of the  
reserved ranks from the total amount of installed memory.  
Hardware registers count the number of Correctable ECC Errors for each rank of memory on each channel  
during operations and compare the count against a Correctable Error Threshold. When the correctable error  
count for a given rank hits the threshold value, that rank is deemed to be “failing”, and it triggers a Sparing Fail  
Over (SFO) event for the channel in which that rank resides. The data in the failing rank is copied to the Spare  
Rank for that channel, and the Spare Rank replaces the failing rank in the IMC’s address translation registers.  
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An SFO Event is logged to the BMC SEL. The failing rank is then disabled, and any further Correctable Errors  
on that now non-redundant channel will be disregarded.  
The correctable error that triggered the SFO may be logged to the BMC SEL, if it was the first one to occur in  
the system. That first correctable error event will be the only one logged for the system. However, since each  
channel is a Sparing Domain, the correctable error counting continues for other channels which are still in a  
redundant state. There can be as many SFO Events as there are memory channels with DIMMs installed.  
3.2.4.5.6  
Mirrored Channel Mode  
Channel Mirroring Mode gives the best memory RAS capability by maintaining two copies of the data in main  
memory. If there is an Uncorrectable ECC Error, the channel with the error is disabled and the system  
continues with the “good” channel, but in a non-redundant configuration.  
For Mirroring mode to be to be available as a RAS option, the DIMM population must be identical between  
each pair of memory channels that participate. Not all channel pairs need to have memory installed, but for  
each pair, the configuration must match. If the configuration is not matched up properly, the memory operating  
mode falls back to Independent Channel Mode.  
Mirroring Mode is enabled/disabled in the Memory RAS and Performance Configuration screen in the <F2>  
BIOS Setup Utility.  
When Mirroring Mode is operational, each channel in a pair is “mirrored” by the other channel. The impact on  
Effective Memory size is to reduce by half the total amount of installed memory available for use.  
When Mirroring Mode is operational, the system treats Correctable Errors the same way as it would in  
Independent channel mode. There is a correctable error threshold. Correctable error counts accumulate by  
rank, and the first event is logged.  
What Mirroring primarily protects against is the possibility of an Uncorrectable ECC Error occurring with critical  
data “in process”. Without Mirroring, the system would be expected to “Blue Screen” and halt, possibly with  
serious impact to operations. But with Mirroring Mode in operation, an Uncorrectable ECC Error from one  
channel becomes a Mirroring Fail Over (MFO) event instead, in which the IMC retrieves the correct data from  
the “mirror image” channel and disables the failed channel. Since the ECC Error was corrected in the process  
of the MFO Event, the ECC Error is demoted to a Correctable ECC Error. The channel pair becomes a single  
non-redundant channel, but without impacting operations, and the Mirroring Fail Over Event is logged to SEL  
to alert the user that there is memory hardware that has failed and needs to be replaced.  
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3.2.5  
Processor Integrated I/O Module (IIO)  
The processor integrated I/O module provides features traditionally supported through chipset components.  
The integrated I/O module provides the following features:  
.
.
PCI Express Interfaces: The integrated I/O module incorporates the PCI Express interface supporting  
up to 40 PCI Express bus lanes via three PCIe ports.  
DMI2 Interface to the PCH: The platform requires an interface to the legacy Southbridge (PCH) which  
provides basic, legacy functions required for the server platform and operating systems. Since only one  
PCH is required and allowed for the system, any sockets which do not connect to PCH would use this  
port as a standard x4 PCI Express 2.0 interface.  
.
.
Integrated IOAPIC: Provides support for PCI Express devices implementing legacy interrupt messages  
without interrupt sharing  
Non Transparent Bridge: PCI Express non-transparent bridge (NTB) acts as a gateway that enables  
high performance, low overhead communication between two intelligent subsystems; the local and the  
remote subsystems. The NTB allows a local processor to independently configure and control the local  
subsystem, provides isolation of the local host memory domain from the remote host memory domain  
while enabling status and data exchange between the two domains.  
®
.
Intel QuickData Technology: Used for efficient, high bandwidth data movement between two  
locations in memory or from memory to I/O.  
Figure 16. Functional Block Diagram of Processor IIO Sub-system  
The following sub-sections describe the server board I/O features supported by the PCIe interface of the  
processor IIO module. Features and functions of the Intel® C600 Series chipset will be described in its own  
dedicated section.  
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3.2.5.1  
PCIe Interface  
The integrated I/O module of each installed processor provides the PCI Express interface to the server board.  
Each installed processor supports three PCIe ports, identified as Port 1 (x8), Port 2 (x16), and Port 3 (x16),  
providing up to 40 PCIe bus lanes that meet the PCIe Gen 1, Gen2, and Gen 3 specifications.  
Figure 17. Intel® Server Board S2600GZ/GL PCI Layout  
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Each PCIe port from the given processor IIO module can be bifurcated down to smaller segments as needed.  
The number of PCIe port segments required is dependent on the number and type of PCIe devices that need  
to be supported for the given system configuration. The root port is identified by the port number followed by  
the letter “A”. As each port is bifurcated, the smaller segments are identified by the port number followed by  
sequential letters starting with “A”. The following diagrams illustrate possible PCIe port bifurcation options and  
port identification.  
Integrated I/O Module  
PCIe  
PCIe  
PCIe  
Port 1  
Port 2  
Port 3  
Port 1A  
x8  
Port 3A  
x16  
Port 2A  
x16  
Port 1A  
x4  
Port 1B  
x4  
Port 3A  
Port 2A  
Port 2B  
x8  
Port 3B  
x8  
x8  
x8  
Port 2C  
x4  
Port 3A Port 3B  
Port 3D  
x4  
Port 2A Port 2B  
Port 2D  
x4  
Port 3C  
x4  
x4  
x4  
x4  
x4  
Integrated I/O Module  
PCIe  
PCIe  
PCIe  
Port 1  
Port 2  
Port 3  
Port 1A  
x8  
Port 3A  
x16  
Port 2A  
x16  
Port 1A  
x4  
Port 1B  
x4  
Port 2C  
Port 3C  
x8  
x8  
x8  
x8  
Port 3A Port 3B  
x4 x4  
Port 2A Port 2B  
x4 x4  
Figure 18. PCIe Port Bifurcation Options  
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3.2.5.2  
Riser Card Support  
The server board provides two riser card slots identified as Riser Slot 1 and Riser Slot 2.  
Each riser slot has support for a total of x24 PCIe bus lanes. For Riser Slot 1, x16 PCIe lanes are routed from  
CPU 1 + x8 PCIe lanes are routed from CPU 2. For Riser Slot 2, all x24 PCIe lanes are routed from CPU 2.  
Note: Riser Slot 2 can only be used in dual processor configurations. In addition, some 2U riser cards installed  
in Riser Slot 1 may also require two processors to be installed in order to support all available add-in card slots.  
Available riser cards are common between both riser slots. Supported 1U and 2U riser cards include:  
.
1U Riser Card – 1 PCIe add-in card slot – PCIe x16, x16 mechanical  
Figure 19. 1U PCIe riser for Intel® Server Board S2600GZ/GL  
.
2U Riser Card – 3 PCIe add-in card slots  
Slot #  
Slot-1 (Top)  
Description  
PCIe x8, x16 mechanical  
Slot-2 (Middle) PCIe x8, x16 mechanical  
Slot-3 (Bottom) PCIe x8, x8 mechanical  
Figure 20. 2U three PCIe slots riser for Intel® Server Board S2600GZ/GL  
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.
2U Riser Card – 2 PCIe add-in card slots  
Slot #  
Slot-1 (Top)  
Description  
PCIe x16, x16 mechanical  
Slot-2 (Bottom) PCIe x8, x8 mechanical  
Figure 21. 2U two PCIe slots riser for Intel® Server Board S2600GZ/GL  
.
2U Riser Card – 2 PCIx + 1 PCIe add-in card slots –  
Slot #  
Slot-1 (Top)  
Description  
PCIx 133MHz  
Slot-2 (Middle) PCIx 133 MHz  
Slot-3 (Bottom) PCIe x8, x8 mechanical  
Figure 22. 2U three PCIx/PCIe slots riser for Intel® Server Board S2600GZ/GL  
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3.2.5.3  
PCIe Add-in card support  
The PCIe sub-system of the server board has support for PCIe add-in cards that follow the PCIe Gen1, Gen2  
and Gen3 specifications. However, the performance of some PCIe Gen3 cards may be forced to operate at  
Gen2 speeds due to electrical signaling characteristic limitations that exist between the server board and some  
PCIe Gen 3 add-in cards.  
Intel has implemented the following PCIe Gen 3 support model for this generation of its server boards and  
server systems.  
3.2.5.3.1  
PCIe Gen3 support – Systems configured with an Intel® Xeon® processor E5-2600 product family  
For a server system configured with one or more Intel® Xeon® processor E5-2600 product family, the system  
BIOS will use an embedded PCIe Gen 3 compatibility list which identifies all PCIe Gen 3 add-in cards tested by  
Intel to operate reliably at Gen 3 speeds on the given server system. During POST, the system BIOS will  
compare installed PCIe Gen 3 add-in cards with those included in the embedded compatibility list. If BIOS  
matches an installed card to one listed on the compatibility list, the BIOS will configure the device to operate at  
PCIe Gen 3 speeds. If the BIOS cannot match an installed PCIe add-in card with any device included in the  
list, the BIOS will force the device to operate at PCIe Gen2 speeds.  
Note: The latest available BIOS should be installed on the system to ensure the most up to date embedded  
PCIe Gen 3 compatibility list is being used.  
Visit the following Intel web site for a list of Intel tested PCIe Gen 3 compatible cards included in the BIOS  
embedded compatibility list – http://intel.com/support/motherboards/server/sb/CS-034157.htm  
3.2.5.3.2  
PCIe Gen3 support – Systems configured with an Intel® Xeon® processor E5-2600 V2 product family  
For a server system configured with one or more Intel® Xeon® processor E5-2600 V2 product family, the  
system BIOS will configure all installed PCIe Gen 3 compatible add-in cards to operate at PCIe Gen 3 speeds  
by default. For a list of Intel tested PCIe Gen 3 add-in cards, review the Tested Hardware and OS list (THOL)  
using Intel’s Server Configurator Tool at the following web site:  
https://serverconfigurator.intel.com  
The following tables identify the PCIe port routing for each add-in card slot on all supported riser cards as  
installed in either Riser Slot # 1 or Riser Slot #2. Note the specific processor, PCIe port ID, and number of  
PCIe bus lanes supporting each add-in card slot.  
Depending on the riser card installed, specific PCIe ports routed from the processor IIO module provide the  
PCIe interface to each riser card slot.  
For a system configuration that includes a PCIe add-in card that is not included on Intel’s THOL and/or may be  
operating erratically, BIOS setup includes an option to force specified PCIe ports to operate at a different PCIe  
level than the card is optimally designed to support. To configure this option, access the <F2> BIOS setup  
utility.  
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From the BIOS Setup “Main Menu”, navigate to the following menus: “Advanced Menu”, “PCI Configuration”,  
“Processor PCIe Link Speed”  
The “Processor PCIe Link Speed” menu will display selectable options for each installed processor, identified  
as “Socket #”, where # identifies the CPU number.  
Using information provided in the following tables, select the processor associated with the PCIe port to be  
configured.  
Table 12. Riser Slot #1 – PCIe Port Routing  
Riser Slot #1 – Riser Card Options  
2U - PCIx Riser  
Card  
2U – 3 PCIe Slot  
Riser Card  
2U – 2 PCIe Slot  
Riser Card  
1U – 1 PCIe Slot  
Riser Card  
Top PCIe Slot  
(CPU #1 – Port 3C)  
(x8 elec, x16 mech)  
Top PCIx Slot  
(CPU #1 – Port 3C)  
Top PCIe Slot  
(CPU #1 – Port 3A)  
(x16 elec, x16mech)  
PCIe Slot  
(CPU #1 – Port 3A)  
(x16 elec, x16mech)  
Middle PCIe Slot  
(CPU #1 – Port 3A)  
(x8 elec, x16 mech)  
Middle PCIx Slot  
(CPU #2 – Port 1B)  
Bottom PCIe Slot  
(CPU # 1 – Port 3A) (CPU #2 – Port 1A)  
(x8 elec, x8 mech) (x8 elec, x8 mech)  
Bottom PCIe Slot  
Bottom PCIe Slot  
(CPU #2 – Port 1A)  
(x8 elec, x8 mech)  
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Table 13. Riser Slot #2 – PCIe Port Routing  
Riser Slot #2 – Riser Card Options  
2U - PCIx Riser  
2U – 3 PCIe Slot  
Riser Card  
2U – 2 PCIe Slot  
Riser Card  
1U – 1 PCIe Slot  
Riser Card  
Card  
Top PCIe Slot  
(CPU #2 – Port 2C)  
(x8 elec, x16 mech)  
Top PCIx Slot  
(CPU #2 – Port 2C)  
Top PCIe Slot  
(CPU #2 – Port 2A)  
PCIe Slot  
(CPU #2 – Port 2A)  
Middle PCIe Slot  
(CPU #2 – Port 2A)  
(x8 elec, x16 mech)  
(x16 elec, x16 mech) (x16 elec, x16 mech)  
Middle PCIx Slot  
(CPU #2 –Port 3A)  
Bottom PCIe Slot  
(CPU #2 – Port 2A) (CPU #2 – Port 3A)  
(x8 elec, x8 mech) (x8 elec, x8 mech)  
Bottom PCIe Slot  
Bottom PCIe Slot  
(CPU #2 – Port 3A)  
(x8 elec, x8 mech)  
The “Socket # PCIe Ports Link Speed” window displays selectable options for each configurable PCIe port  
associated with the current system configuration.  
Note: The illustrations below are for reference purposes only. Actual PCIe port data displayed in the “Socket #  
PCIe Ports Link Speed” window may be different than what is shown here.  
Using the arrow keys, move the cursor down to the PCIe port to be changed.  
Once a port is selected, a port configuration window appears and provides options to configure the specified  
PCIe port to operate at a specified PCIe Gen level.  
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Select the desired PCIe Gen level. After making all desired changes in BIOS setup, be sure to save the  
changes and reboot the system.  
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3.2.5.4  
Network Interface  
On-board network connectivity is provided by means of an Intel® Ethernet Controller I350-AM4 providing up to  
four 10/100/1000 Mb Ethernet ports. The NIC chip is supported by x4 PCIe Gen2 signals from the IIO module  
of the CPU 1 processor.  
Each Ethernet port drives two LEDs located on each network interface connector. The LED at the right of the  
connector is the link/activity LED and indicates network connection when on, and transmit/receive activity when  
blinking. The LED at the left of the connector indicates link speed as defined in the following table:  
LED  
Color  
LED State  
Off  
NIC State  
LAN link not established  
Left  
Green On  
Blinking  
Off  
LAN link is established  
LAN activity is occurring  
10 Mb/sec data rate  
100 Mb/sec data rate  
1000 Mb /sec data rate  
Right Amber On  
Green On  
Figure 23. Intel® Server Board S2600GZ/GL External RJ45 NIC Port LED Definition  
The server board has seven MAC addresses programmed at the factory. MAC addresses are assigned as  
follows:  
.
.
.
.
.
.
.
NIC 1 MAC address (for OS usage)  
NIC 2 MAC address = NIC 1 MAC address + 1 (for OS usage)  
NIC 3 MAC address = NIC 1 MAC address + 2 (for OS usage)  
NIC 4 MAC address = NIC 1 MAC address + 3 (for OS usage)  
BMC LAN channel 1 MAC address = NIC1 MAC address + 4  
BMC LAN channel 2 MAC address = NIC1 MAC address + 5  
BMC LAN channel 3 (RMM) MAC address = NIC1 MAC address + 6  
The printed MAC address on the server board and/or server system is assigned to NIC1 on the server board.  
3.2.5.5 I/O Module Support  
To broaden the standard on-board feature set, the server board provides support for one of several available  
IO Module options. The I/O module attaches to a high density 80-pin connector on the server board (J2B1)  
labeled “IO_Module” and is supported by x8 PCIe Gen3 signals from the IIO module of the CPU 1 processor.  
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Figure 24. Server Board Layout - I/O Module Connector  
Supported I/O modules include:  
Table 14. Supported Intel® I/O Module Options  
Description  
Intel Product Code  
AXX4P1GBPWLIOM  
AXX10GBTWLIOM  
AXX10GBNIAIOM  
AXX1FDRIBIOM  
AXX2FDRIBIOM  
Quad Port Intel® I350 GbE I/O Module  
Dual Port Intel® X540 10GbE I/O Module  
Dual Port Intel® 82599 10GbE I/O Module  
Single Port FDR InfiniBand* ConnectX*-3 I/O Module  
Dual Ports FDR InfiniBand* ConnectX*-3 I/O Module  
3.2.5.6  
Intel® Integrated RAID Option  
The server board provides support for Intel® Integrated RAID modules. These optional modules attach to a  
high density 80-pin connector labeled “SAS Module” on the server board and are supported by x8 PCIe Gen3  
signals from the IIO module of the CPU 1 processor.  
Figure 25. Server Board Layout – Intel® Integrated RAID Module Option Placement  
Features of this option include:  
.
.
.
.
SKU options to support full or entry level hardware RAID  
Dual-core 6Gb SAS ROC/IOC (LSI* 2208)  
4 or 8 port and SAS/SATA or SATA –only ROC options  
SKU options to support 512MB or 1GB embedded memory  
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.
Intel designed flash + optional support for Intel® RAID Maintenance Free Backup Units (AXXRMFBU2)  
or improved Lithium Polymer battery  
Table 15. Supported Intel® Integrated RAID Modules  
External Name  
Description  
Product Code  
Intel® Integrated RAID Module  
RMS25CB080  
8 Port SAS-2.1, Full HW RAID, 1GB, IOM Slot  
RAID Levels 0,1,10, 5, 50, 6, 60  
RMS25CB080  
Intel® Integrated RAID Module  
RMS25CB040  
Intel® Integrated RAID Module  
RMT3CB080  
Intel® Integrated RAID Module  
RMS25KB080  
Intel® Integrated RAID Module  
RMS25KB040  
4 Port SAS-2.1, Full HW RAID, 1GB, IOM Slot  
RAID Levels 0,1,10, 5, 50, 6, 60  
RMS25CB040  
RMT3CB080  
RMS25KB080  
RMS25KB040  
8 Port SATA-3, Full HW RAID, 512MB, IOM Slot  
RAID Levels 0,1,10, 5, 50, 6, 60  
8 Port SAS-2.1, Entry-level HW RAID, IOM Slot  
RAID Levels 0,1,1E  
4 Port SAS-2.1, Entry-level HW RAID, IOM Slot  
RAID Levels 0,1,1E  
For additional product information, please reference the following Intel document:  
Intel Integrated RAID Module RMS25PB080, RMS25PB040, RMS25CB080, and RMS25C040 Hardware Users  
Guide.  
3.3 Intel® C602 Chipset Functional Overview  
The following sub-sections provide an overview of the key features and functions of the Intel® C602 chipset  
used on the server board. For more comprehensive chipset specific information, refer to the Intel® C600 Series  
chipset documents listed in the Reference Document list.  
SCU 0  
SCU 1  
SATA/SAS 0-3  
SATA/SAS 4-8  
AHCI  
SATA 0  
9x USB 2.0  
SATA 1  
8MB  
SPI  
Flash  
3x USB  
1x USB  
2x USB  
Rear I/O Panel  
(option) TPM Header  
Internal Type A USB Port  
Front Panel (Header)  
BMC  
(Option) Int.  
eUSB SSD  
1x USB  
2x USB  
Figure 26. Functional Block Diagram - Chipset Supported Features and Functions  
On the Intel® Server Boards S2600GZ and S2600GL, the chipset provides support for the following on-board  
functions:  
.
.
.
.
Low Pin Count (LPC) interface  
Universal Serial Bus (USB) Controller  
Serial Attached SCSI (SAS)/Serial ATA (SATA) Support  
Manageability Features  
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3.3.1  
Low Pin Count (LPC) Interface  
The chipset implements an LPC Interface as described in the LPC 1.1Specification and provides support for up  
to two Master/DMI devices. On the server board, the LPC interface is utilized as an interconnect between the  
chipset and the Integrated Base Board Management Controller as well as providing support for the optional  
Trusted Platform Module (TPM).  
3.3.2  
Universal Serial Bus (USB) Controller  
The chipset has two Enhanced Host Controller Interface (EHCI) host controllers that support USB high-speed  
signaling. High-speed USB 2.0 allows data transfers up to 480 Mb/s which is 40 times faster than full-speed  
USB. The server board utilizes nine USB 2.0 ports from the chipset. All ports are high-speed, full- speed, and  
low-speed capable.  
.
Three external USB ports are provided in a stacked housing located on the rear I/O section of the  
server board.  
.
Two USB ports are routed to an internal 10-pin connector (Labeled “FP_USB” on the server board) that  
can be cabled for front panel support.  
.
.
.
One internal Type ‘A’ USB port.  
One eUSB connector intended for use with an optional eUSB SSD device.  
Two USB ports are routed to the integrated BMC.  
3.3.2.1  
eUSB SSD Support  
The server board provides support for a low profile eUSB SSD storage device. A 2mm 2x5-pin connector  
labeled “eUSB SSD” near the rear I/O section of the server board is used to plug this small flash storage  
device into.  
Figure 27. Low Profile eUSB SSD Support  
eUSB SSD features include:  
2 wire small form factor Universal Serial Bus 2.0 (Hi-Speed USB) interface to host  
Read Speed up to 35 MB/s and write Speed up to 24 MB/s.  
Capacity range from 256 MB to 32 GB.  
Support USB Mass Storage Class requirements for Boot capability.  
3.3.3  
Embedded Serial ATA (SATA)/Serial Attached SCSI (SAS)/RAID Support  
The Intel® C602 chipset provides storage support from two integrated controllers: AHCI and SCU. By default  
the server board will support up to 6 SATA ports: Two single 6Gb/sec SATA ports routed from the AHCI  
controller to the two white SATA connectors labeled “SATA-0” and “SATA-1”, and four 3Gb/sec SATA ports  
routed from the SCU to the mini-SAS connector labeled “SCU_0 (0-3)”.  
Note: The mini-SAS connector labeled “SCU_1 (4-7)” is NOT functional by default and is only enabled with the  
addition of an Intel® RAID C600 Upgrade Key option supporting 8 SAS/SATA ports.  
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Intel® Server Board S2600GZ/GL TPS  
The server board is capable of supporting additional chipset embedded SAS, SATA, and RAID options when  
configured with one of several available Intel® RAID C600 Upgrade Keys. Upgrade keys install onto a 4-pin  
connector on the server board labeled “STOR_UPG_KEY”.  
Figure 28. Intel® RAID C600 Upgrade Key Connector  
The following table identifies available upgrade key options and their supported features.  
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Table 16. Intel® RAID C600 Upgrade Key Options  
Intel® RAID C600 Upgrade Key Options  
(Intel Product Codes)  
Default – No option key installed  
Key Color  
N/A  
Description  
4 Port SATA with Intel® ESRT RAID 0,1,10 and  
Intel® RSTe RAID 0,1,5,10  
4 Port SATA with Intel® ESRT2 RAID 0,1, 5, 10 and  
Intel® RSTe RAID 0,1,5,10  
RKSATA4R5  
RKSATA8  
RKSATA8R5  
RKSAS4  
Black  
Blue  
8 Port SATA with Intel® ESRT2 RAID 0,1, 10 and  
Intel® RSTe RAID 0,1,5,10  
8 Port SATA with Intel® ESRT2 RAID 0,1, 5, 10 and  
Intel® RSTe RAID 0,1,5,10  
White  
Green  
Yellow  
Orange  
Purple  
4 Port SAS with Intel® ESRT2 RAID 0,1, 10 and Intel®  
RSTe RAID 0,1,10  
4 Port SAS with Intel® ESRT2 RAID 0,1, 5, 10 and  
Intel® RSTe RAID 0,1,10  
RKSAS4R5  
RKSAS8  
8 Port SAS with Intel® ESRT2 RAID 0,1, 10 and Intel®  
RSTe RAID 0,1,10  
8 Port SAS with Intel® ESRT2 RAID 0,1, 5, 10 and  
Intel® RSTe RAID 0,1,10  
RKSAS8R5  
Additional information for the on-board RAID features and functionality can be found in the Intel® RAID  
Software Users Guide (Intel Document Number D29305-015).  
The system includes support for two embedded software RAID options:  
.
.
Intel® Embedded Server RAID Technology 2 (ESRT2) based on LSI* MegaRAID SW RAID technology  
Intel® Rapid Storage Technology (RSTe)  
Using the <F2> BIOS Setup Utility, accessed during system POST, options are available to enable/disable SW  
RAID, and select which embedded software RAID option to use.  
3.3.3.1  
Intel® Embedded Server RAID Technology 2 (ESRT2)  
Features of the embedded software RAID option Intel® Embedded Server RAID Technology 2 (ESRT2) include  
the following:  
.
.
.
Based on LSI* MegaRAID Software Stack  
Software RAID with system providing memory and CPU utilization  
Supported RAID Levels – 0,1,5,10  
o
o
4 & 8 Port SATA RAID 5 support provided with appropriate Intel® RAID C600 Upgrade Key  
4 & 8 Port SAS RAID 5 support provided with appropriate Intel® RAID C600 Upgrade Key  
.
.
Maximum drive support = 8  
Open Source Compliance = Binary Driver (includes Partial Source files) or Open Source using  
MDRAID layer in Linux*.  
.
.
OS Support = Windows 7*, Windows 2008*, Windows 2003*, RHEL*, SLES, other Linux* variants using  
partial source builds.  
Utilities = Windows* GUI and CLI, Linux GUI and CLI, DOS CLI, and EFI CLI  
3.3.3.2  
Intel® Rapid Storage Technology (RSTe)  
Features of the embedded software RAID option Intel® Rapid Storage Technology (RSTe) include the following:  
.
.
Software RAID with system providing memory and CPU utilization  
Supported RAID Levels – 0,1,5,10  
o
o
4 Port SATA RAID 5 available standard (no option key required)  
8 Port SATA RAID 5 support provided with appropriate Intel® RAID C600 Upgrade Key  
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Intel® Server Board S2600GZ/GL TPS  
o
No SAS RAID 5 support  
.
.
.
Maximum drive support = 32 (in arrays with 8 port SAS), 16 (in arrays with 4 port SAS), 128 (JBOD)  
Open Source Compliance = Yes (uses MDRAID)  
OS Support = Windows 7*, Windows 2008*, Windows 2003*, RHEL* 6.2 1 and later, SLES* 11 w/SP21  
and later, VMWare* 5.x.  
.
.
.
Utilities = Windows* GUI and CLI, Linux CLI, DOS CLI, and EFI CLI  
Uses Matrix Storage Manager for Windows*  
MDRAID supported in Linux (Does not require a driver)  
Note: No boot drive support to targets attached through SAS expander card.  
1) See latest product errata list for support status.  
Product Errata are documented in the Intel® Server Board S2600GZ/GL, Intel® Server System R1000GZ/GL,  
Intel® Server System R2000GZ/GL Monthly Specification Update which can be downloaded from  
www.intel.com.  
3.3.4  
Manageability  
The chipset integrates several functions designed to manage the system and lower the total cost of ownership  
(TCO) of the system. These system management functions are designed to report errors, diagnose the system,  
and recover from system lockups without the aid of an external microcontroller.  
.
TCO Timer. The chipset’s integrated programmable TCO timer is used to detect system locks. The first  
expiration of the timer generates an SMI# that the system can use to recover from a software lock. The  
second expiration of the timer causes a system reset to recover from a hardware lock.  
.
.
Processor Present Indicator. The chipset looks for the processor to fetch the first instruction after  
reset. If the processor does not fetch the first instruction, the chipset will reboot the system.  
ECC Error Reporting. When detecting an ECC error, the host controller has the ability to send one of  
several messages to the chipset. The host controller can instruct the chipset to generate either SMI#,  
NMI, SERR#, or TCO interrupt.  
.
Function Disable. The chipset provides the ability to disable the following integrated functions: LAN,  
USB, LPC, SATA, PCI Express* or SMBus*. Once disabled, these functions no longer decode I/O,  
memory, or PCI configuration space. Also, no interrupts or power management events are generated  
from the disabled functions.  
3.4 Integrated Baseboard Management Controller Overview  
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The server board utilizes the I/O controller, Graphics Controller, and Baseboard Management features of the  
Emulex* Pilot-III Management Controller. The following is an overview of the features as implemented on the  
server board from each embedded controller.  
USB 2.0  
(option) TPM Header  
FP Video (Header)  
Analog Video  
DDR3  
128MB  
Rear I/O Panel  
BMC  
SMBUS (8)  
RGMII  
SPI  
16MB  
Flash  
Note: Motherboard  
does not include the  
VGA connector nuts.  
2x USB  
(Option) RMM4 Dedicated  
NIC Module Connector  
Serial Port A (RJ45)  
Serial Port B (DH-10 Internal)  
Figure 29. Integrated BMC Block Diagram  
Figure 30. Integrated BMC Functional Block Diagram  
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3.4.1  
Super I/O Controller  
The integrated super I/O controller provides support for the following features as implemented on the server  
board:  
.
.
.
.
Two Fully Functional Serial Ports, compatible with the 16C550  
Serial IRQ Support  
Up to 16 Shared direct GPIO’s  
Serial GPIO support for 80 general purpose inputs and 80 general purpose outputs available for host  
processor  
.
.
.
.
Programmable Wake-up Event Support  
Plug and Play Register Set  
Power Supply Control  
Host SPI bridge for system BIOS support  
3.4.1.1  
Keyboard and Mouse Support  
The server board does not support PS/2 interface keyboards and mice. However, the system BIOS recognizes  
USB specification-compliant keyboard and mice.  
3.4.1.2  
Wake-up Control  
The super I/O contains functionality that allows various events to power on and power off the system.  
3.4.2  
Graphics Controller and Video Support  
The integrated graphics controller provides support for the following features as implemented on the server  
board:  
.
.
.
.
Integrated Graphics Core with 2D Hardware accelerator  
DDR-3 memory interface with 16 MB of memory allocated and reported for graphics memory  
High speed Integrated 24-bit RAMDAC  
Single lane PCI-Express host interface running at Gen 1 speed  
The integrated video controller supports all standard IBM VGA modes. The following table shows the 2D  
modes supported for both CRT and LCD:  
Table 17. Video Modes  
2D Mode  
2D Video Mode Support  
8 bpp 16 bpp 24 bpp 32 bpp  
640x480  
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
800x600  
1024x768  
1152x864  
1280x1024  
1600x1200**  
** Video resolutions at 1600x1200 and higher are only supported through the external video  
connector located on the rear I/O section of the server board. Utilizing the optional front panel  
video connector may result in lower video resolutions.  
The server board provides two video interfaces. The primary video interface is accessed using a standard 15-  
pin VGA connector found on the back edge of the server board. In addition, video signals are routed to a 14-  
pin header labeled “FP_Video” on the leading edge of the server board, allowing for the option of cabling to a  
front panel video connector. Attaching a monitor to the front panel video connector will disable the primary  
external video connector on the back edge of the board.  
The BIOS supports dual-video mode when an add-in video card is installed.  
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In the single mode (dual monitor video = disabled), the on-board video controller is disabled when an add-in  
video card is detected.  
In the dual mode (on-board video = enabled, dual monitor video = enabled), the on-board video controller is  
enabled and is the primary video device. The add-in video card is allocated resources and is considered the  
secondary video device. The BIOS Setup utility provides options to configure the feature as follows:  
Table 18. BIOS Setup Options for Configuring Video  
Enabled  
Disabled  
Enabled  
Disabled  
On-board Video  
Dual Monitor Video  
Shaded if on-board video is set to "Disabled"  
3.4.3  
Baseboard Management Controller  
The server board utilizes the following features of the embedded baseboard management controller.  
.
.
.
.
.
.
.
.
.
.
IPMI 2.0 Compliant  
400MHz 32-bit ARM9 processor with memory management unit (MMU)  
Two independent10/100/1000 Ethernet Controllers with RMII/RGMII support  
DDR2/3 16-bit interface with up to 800 MHz operation  
12 10-bit ADCs  
Fourteen fan tachometers  
Eight Pulse Width Modulators (PWM)  
Chassis intrusion logic  
JTAG Master  
Eight I2C interfaces with master-slave and SMBus* timeout support. All interfaces are SMBus* 2.0  
compliant.  
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
Parallel general-purpose I/O Ports (16 direct, 32 shared)  
Serial general-purpose I/O Ports (80 in and 80 out)  
Three UARTs  
Platform Environmental Control Interface (PECI)  
Six general-purpose timers  
Interrupt controller  
Multiple SPI flash interfaces  
NAND/Memory interface  
Sixteen mailbox registers for communication between the BMC and host  
LPC ROM interface  
BMC watchdog timer capability  
SD/MMC card controller with DMA support  
LED support with programmable blink rate controls on GPIOs  
Port 80h snooping capability  
Secondary Service Processor (SSP), which provides the HW capability of off loading time critical  
processing tasks from the main ARM core.  
3.4.3.1  
Remote Keyboard, Video, Mouse, and Storage (KVMS) Support  
.
.
.
.
.
.
.
USB 2.0 interface for Keyboard, Mouse and Remote storage such as CD/DVD ROM and floppy  
USB 1.1/USB 2.0 interface for PS2 to USB bridging, remote Keyboard and Mouse  
Hardware Based Video Compression and Redirection Logic  
Supports both text and Graphics redirection  
Hardware assisted Video redirection using the Frame Processing Engine  
Direct interface to the Integrated Graphics Controller registers and Frame buffer  
Hardware-based encryption engine  
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3.4.3.2  
Integrated BMC Embedded LAN Channel  
The Integrated BMC hardware includes two dedicated 10/100 network interfaces. These interfaces are not  
shared with the host system. At any time, only one dedicated interface may be enabled for management traffic.  
The default active interface is the NIC 1 port.  
For these channels, support can be enabled for IPMI-over-LAN and DHCP. For security reasons, embedded  
LAN channels have the following default settings:  
.
.
IP Address: Static.  
All users disabled.  
For a functional overview of the baseboard management features, refer to Platform Management Functional  
Overview.  
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System Security  
4. System Security  
4.1 BIOS Password Protection  
The BIOS uses passwords to prevent unauthorized tampering with the server setup. Passwords can restrict  
entry to the BIOS Setup, restrict use of the Boot Popup menu, and suppress automatic USB device reordering.  
There is also an option to require a Power On password entry in order to boot the system. If the Power On  
Password function is enabled in Setup, the BIOS will halt early in POST to request a password before  
continuing POST.  
Both Administrator and User passwords are supported by the BIOS. An Administrator password must be  
installed in order to set the User password. The maximum length of a password is 14 characters. A password  
can have alphanumeric (a-z, A-Z, 0-9) characters and it is case sensitive. Certain special characters are also  
allowed, from the following set:  
! @ # $ % ^ & * ( ) - _ + = ?  
The Administrator and User passwords must be different from each other. An error message will be displayed  
if there is an attempt to enter the same password for one as for the other.  
The use of “Strong Passwords” is encouraged, but not required. In order to meet the criteria for a “Strong  
Password”, the password entered must be at least 8 characters in length, and must include at least one each  
of alphabetic, numeric, and special characters. If a “weak” password is entered, a popup warning message will  
be displayed, although the weak password will be accepted.  
Once set, a password can be cleared by changing it to a null string. This requires the Administrator password,  
and must be done through BIOS Setup or other explicit means of changing the passwords. Clearing the  
Administrator password will also clear the User password.  
Alternatively, the passwords can be cleared by using the Password Clear jumper if necessary. Resetting the  
BIOS configuration settings to default values (by any method) has no effect on the Administrator and User  
passwords.  
Entering the User password allows the user to modify only the System Time and System Date in the Setup  
Main screen. Other setup fields can be modified only if the Administrator password has been entered. If any  
password is set, a password is required to enter the BIOS setup.  
The Administrator has control over all fields in the BIOS setup, including the ability to clear the User password  
and the Administrator password.  
It is strongly recommended that at least an Administrator Password be set, since not having set a password  
gives everyone who boots the system the equivalent of Administrative access. Unless an Administrator  
password is installed, anyone with access to the system can go into Setup and change BIOS settings at will.  
In addition to restricting access to most Setup fields to viewing only when a User password is entered, defining  
a User password imposes restrictions on booting the system. In order to simply boot in the defined boot order,  
no password is required. However, the F6 Boot popup prompts for a password, and can only be used with the  
Administrator password. Also, when a User password is defined, it suppresses the USB Reordering that occurs,  
if enabled, when a new USB boot device is attached to the system. A User is restricted from booting in  
anything other than the Boot Order defined in the Setup by an Administrator.  
As a security measure, if a User or Administrator enters an incorrect password three times in a row during the  
boot sequence, the system is placed into a halt state. A system reset is required to exit out of the halt state.  
This feature makes it more difficult to guess or break a password.  
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In addition, on the next successful reboot, the Error Manager displays a Major Error code 0048, which also  
logs a SEL event to alert the authorized user or administrator that a password access failure has occurred  
4.2 Intel® TPM module AXXTPME5 Support  
The Trusted Platform Module (TPM) option is a hardware-based security device that addresses the growing  
concern on boot process integrity and offers better data protection. TPM protects the system start-up process  
by ensuring it is tamper-free before releasing system control to the operating system. A TPM device provides  
secured storage to store data, such as security keys and passwords. In addition, a TPM device has encryption  
and hash functions. The server board implements TPM as per TPM PC Client specifications revision 1.2 by the  
Trusted Computing Group (TCG).  
A TPM device is optionally installed onto a high density 14-pin connector labeled “TPM” on the server board,  
and is secured from external software attacks and physical theft. A pre-boot environment, such as the BIOS  
and operating system loader, uses the TPM to collect and store unique measurements from multiple factors  
within the boot process to create a system fingerprint. This unique fingerprint remains the same unless the pre-  
boot environment is tampered with. Therefore, it is used to compare to future measurements to verify the  
integrity of the boot process.  
After the system BIOS completes the measurement of its boot process, it hands off control to the operating  
system loader and in turn to the operating system. If the operating system is TPM-enabled, it compares the  
BIOS TPM measurements to those of previous boots to make sure the system was not tampered with before  
continuing the operating system boot process. Once the operating system is in operation, it optionally uses  
TPM to provide additional system and data security (for example, Microsoft Vista* supports Bitlocker drive  
encryption).  
4.2.1  
TPM security BIOS  
The BIOS TPM support conforms to the TPM PC Client Implementation Specification for Conventional BIOS  
and to the TPM Interface Specification, and the Microsoft Windows BitLocker* Requirements. The role of the  
BIOS for TPM security includes the following:  
.
Measures and stores the boot process in the TPM microcontroller to allow a TPM enabled operating  
system to verify system boot integrity.  
.
.
Produces EFI and legacy interfaces to a TPM-enabled operating system for using TPM.  
Produces ACPI TPM device and methods to allow a TPM-enabled operating system to send TPM  
administrative command requests to the BIOS.  
.
.
Verifies operator physical presence. Confirms and executes operating system TPM administrative  
command requests.  
Provides BIOS Setup options to change TPM security states and to clear TPM ownership.  
For additional details, refer to the TCG PC Client Specific Implementation Specification, the TCG PC Client  
Specific Physical Presence Interface Specification, and the Microsoft BitLocker* Requirement documents.  
4.2.2  
Physical Presence  
Administrative operations to the TPM require TPM ownership or physical presence indication by the operator to  
confirm the execution of administrative operations. The BIOS implements the operator presence indication by  
verifying the setup Administrator password.  
A TPM administrative sequence invoked from the operating system proceeds as follows:  
1. User makes a TPM administrative request through the operating system’s security software.  
2. The operating system requests the BIOS to execute the TPM administrative command through TPM ACPI  
methods and then resets the system.  
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3. The BIOS verifies the physical presence and confirms the command with the operator.  
4. The BIOS executes TPM administrative command(s), inhibits BIOS Setup entry and boots directly to the  
operating system which requested the TPM command(s).  
4.2.3  
TPM Security Setup Options  
The BIOS TPM Setup allows the operator to view the current TPM state and to carry out rudimentary TPM  
administrative operations. Performing TPM administrative options through the BIOS setup requires TPM  
physical presence verification.  
Using BIOS TPM Setup, the operator can turn ON or OFF TPM functionality and clear the TPM ownership  
contents. After the requested TPM BIOS Setup operation is carried out, the option reverts to No Operation.  
The BIOS TPM Setup also displays the current state of the TPM, whether TPM is enabled or disabled and  
activated or deactivated. Note that while using TPM, a TPM-enabled operating system or application may  
change the TPM state independent of the BIOS setup. When an operating system modifies the TPM state, the  
BIOS Setup displays the updated TPM state.  
The BIOS Setup TPM Clear option allows the operator to clear the TPM ownership key and allows the operator  
to take control of the system with TPM. You use this option to clear security settings for a newly initialized  
system or to clear a system for which the TPM ownership security key was lost.  
4.2.3.1  
Security Screen  
To enter the BIOS Setup, press the F2 function key during boot time when the OEM or Intel logo displays. The  
following message displays on the diagnostics screen and under the Quiet Boot logo screen:  
Press <F2> to enter setup  
When the Setup is entered, the Main screen displays. The BIOS Setup utility provides the Security screen to  
enable and set the user and administrative passwords and to lock out the front panel buttons so they cannot be  
used. The Intel® Server Board S2600GZ/GL provides TPM settings through the security screen.  
To access this screen from the Main screen, select the Security option.  
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Main  
Advanced  
Security  
Server Management  
Boot Options  
Boot Manager  
Administrator Password Status  
User Password Status  
<Installed/Not Installed>  
<Installed/Not Installed>  
Set Administrator Password  
Set User Password  
[1234aBcD]  
[1234aBcD]  
Front Panel Lockout  
Enabled/Disabled  
<Enabled & Activated/Enabled & Deactivated/Disabled &  
Activated/Disabled & Deactivated>  
TPM State  
TPM Administrative Control  
No Operation/Turn On/Turn Off/Clear Ownership  
Figure 31. Setup Utility – TPM Configuration Screen  
Table 19. TPM Setup Utility – Security Configuration Screen Fields  
Setup Item  
TPM State*  
Options  
Enabled and Activated  
Help Text  
Comments  
Information only.  
Enabled and Deactivated  
Disabled and Activated  
Shows the current TPM device state.  
Disabled and  
Deactivated  
A disabled TPM device will not execute  
commands that use TPM functions and  
TPM security operations will not be  
available.  
An enabled and deactivated TPM is in  
the same state as a disabled TPM  
except setting of TPM ownership is  
allowed if not present already.  
An enabled and activated TPM  
executes all commands that use TPM  
functions and TPM security operations  
will be available.  
TPM  
Administrative  
Control**  
No Operation  
Turn On  
[No Operation] - No changes to current  
state.  
[Turn On] - Enables and activates TPM.  
[Turn Off] - Disables and deactivates TPM.  
Turn Off  
Clear Ownership  
[Clear Ownership] - Removes the TPM  
ownership authentication and returns the  
TPM to a factory default state.  
Note: The BIOS setting returns to [No  
Operation] on every boot cycle by default.  
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4.3 Intel® Trusted Execution Technology  
The Intel® Xeon® Processor E5-4600/2600/2400/1600 Product Families support Intel® Trusted Execution  
Technology (Intel® TXT), which is a robust security environment. Designed to help protect against software-  
based attacks, Intel® Trusted Execution Technology integrates new security features and capabilities into the  
processor, chipset and other platform components. When used in conjunction with Intel® Virtualization  
Technology, Intel® Trusted Execution Technology provides hardware-rooted trust for your virtual applications.  
This hardware-rooted security provides a general-purpose, safer computing environment capable of running a  
wide variety of operating systems and applications to increase the confidentiality and integrity of sensitive  
information without compromising the usability of the platform.  
Intel® Trusted Execution Technology requires a computer system with Intel® Virtualization Technology enabled  
(both VT-x and VT-d), an Intel® Trusted Execution Technology-enabled processor, chipset and BIOS,  
Authenticated Code Modules, and an Intel® Trusted Execution Technology compatible measured launched  
environment (MLE). The MLE could consist of a virtual machine monitor, an OS or an application. In addition,  
Intel® Trusted Execution Technology requires the system to include a TPM v1.2, as defined by the Trusted  
Computing Group TPM PC Client Specifications, Revision 1.2.  
When available, Intel Trusted Execution Technology can be enabled or disabled in the processor from a BIOS  
Setup option.  
For general information about Intel® TXT, visit the Intel® Trusted Execution Technology website,  
http://www.intel.com/technology/security/ .  
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5. Technology Support  
5.1 Intel® Virtualization Technology – Intel® VT-x/VT-d/VT-c  
Intel® Virtualization Technology consists of three components which are integrated and interrelated, but which  
address different areas of Virtualization.  
.
Intel® Virtualization Technology (VT-x) is processor-related and provides capabilities needed to  
provide hardware assist to a Virtual Machine Monitor (VMM).  
.
Intel® Virtualization Technology for Directed I/O (VT-d) is primarily concerned with virtualizing I/O  
efficiently in a VMM environment. This would generally be a chipset I/O feature, but in the Second  
Generation Intel® Core™ Processor Family there is an Integrated I/O unit embedded in the  
processor, and the IIO is also enabled for VT-d.  
.
Intel® Virtualization Technology for Connectivity (VT-c) is primarily concerned I/O hardware assist  
features, complementary to but independent of VT-d.  
Intel ®VT-x is designed to support multiple software environments sharing same hardware resources. Each  
software environment may consist of OS and applications. The Intel® Virtualization Technology features can be  
enabled or disabled in the BIOS setup. The default behavior is disabled.  
Intel® VT-d is supported jointly by the Intel® Xeon® Processor E5 4600/2600/2400/1600 Product Families and  
the C600 chipset. Both support DMA remapping from inbound PCI Express* memory Guest Physical Address  
(GPA) to Host Physical Address (HPA). PCI devices are directly assigned to a virtual machine leading to a  
robust and efficient virtualization.  
The Intel® S4600/S2600/S2400/S1600/S1400 Server Board Family BIOS publishes the DMAR table in the  
ACPI Tables. For each DMA Remapping Engine in the platform, one exact entry of DRHD (DMA Remapping  
Hardware Unit Definition) structure is added to the DMAR. The DRHD structure in turn contains a Device  
Scope structure that describes the PCI endpoints and/or sub-hierarchies handled by the particular DMA  
Remapping Engine.  
Similarly, there are reserved memory regions typically allocated by the BIOS at boot time. The BIOS marks  
these regions as either reserved or unavailable in the system address memory map reported to the OS. Some  
of these regions can be a target of DMA requests from one or more devices in the system, while the OS or  
executive is active. The BIOS reports each such memory region using exactly one RMRR (Reserved Memory  
Region Reporting) structure in the DMAR. Each RMRR has a Device Scope listing the devices in the system  
that can cause a DMA request to the region.  
For more information on the DMAR table and the DRHD entry format, refer to the Intel® Virtualization  
Technology for Directed I/O Architecture Specification. For more general information about VT-x, VT-d, and  
VT-c, a good reference is Enabling Intel® Virtualization Technology Features and Benefits White Paper.  
5.2 Intel® Intelligent Power Node Manager  
Data centers are faced with power and cooling challenges that are driven by increasing numbers of servers  
deployed and server density in the face of several data center power and cooling constraints. In this type of  
environment, Information Technology (IT) needs the ability to monitor actual platform power consumption and  
control power allocation to servers and racks in order to solve specific data center problems including the  
following issues.  
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Table 20. Intel® Intelligent Power Node Manager  
IT Challenge  
Over-allocation of power  
Requirement  
Ability to monitor actual power consumption  
Control capability that can maintain a power budget to enable  
dynamic power allocation to each server  
.
.
Under-population of rack space  
High energy costs  
Control capability that can maintain a power budget to enable increased rack  
population.  
Control capability that can maintain a power budget to ensure that a set  
energy cost can be achieved  
Capacity planning  
.
.
.
.
Ability to monitor actual power consumption to enable power usage  
modeling over time and a given planning period  
Ability to understand cooling demand from a temperature and airflow  
perspective  
Control capability that reduces platform power consumption to  
protect a server in a hot-spot  
Detection and correction of hot spots  
Ability to monitor server inlet temperatures to enable greater rack  
utilization in areas with adequate cooling.  
The requirements listed above are those that are addressed by the C600 chipset Management Engine (ME)  
and Intel® Intelligent Power Node Manager (NM) technology. The ME/NM combination is a power and thermal  
control capability on the platform, which exposes external interfaces that allow IT (through external  
management software) to query the ME about platform power capability and consumption, thermal  
characteristics, and specify policy directives (for example, set a platform power budget).  
Node Manager (NM) is a platform resident technology that enforces power capping and thermal-triggered  
power capping policies for the platform. These policies are applied by exploiting subsystem knobs (such as  
processor P and T states) that can be used to control power consumption. NM enables data center power  
management by exposing an external interface to management software through which platform policies can  
be specified. It also implements specific data center power management usage models such as power limiting,  
and thermal monitoring.  
The NM feature is implemented by a complementary architecture utilizing the ME, BMC, BIOS, and an ACPI-  
compliant OS. The ME provides the NM policy engine and power control/limiting functions (referred to as Node  
Manager or NM) while the BMC provides the external LAN link by which external management software can  
interact with the feature. The BIOS provides system power information utilized by the NM algorithms and also  
exports ACPI Source Language (ASL) code used by OS-Directed Power Management (OSPM) for negotiating  
processor P and T state changes for power limiting. PMBus*-compliant power supplies provide the capability to  
monitoring input power consumption, which is necessary to support NM.  
Below are the some of the applications of Intel® Intelligent Power Node Manager technology.  
.
Platform Power Monitoring and Limiting: The ME/NM monitors platform power consumption and  
hold average power over duration. It can be queried to return actual power at any given instance. The  
power limiting capability is to allow external management software to address key IT issues by setting a  
power budget for each server. For example, if there is a physical limit on the power available in a room,  
then IT can decide to allocate power to different servers based on their usage – servers running critical  
systems can be allowed more power than servers that are running less critical workload.  
Inlet Air Temperature Monitoring: The ME/NM monitors server inlet air temperatures periodically. If  
there is an alert threshold in effect, then ME/NM issues an alert when the inlet (room) temperature  
exceeds the specified value. The threshold value can be set by policy.  
.
.
.
Memory Subsystem Power Limiting: The ME/NM monitors memory power consumption. Memory  
power consumption is estimated using average bandwidth utilization information  
Processor Power monitoring and limiting: The ME/NM monitors processor or socket power  
consumption and holds average power over duration. It can be queried to return actual power at any  
given instant. The monitoring process of the ME will be used to limit the processor power consumption  
through processor P-states and dynamic core allocation  
.
Core allocation at boot time: Restrict the number of cores for OS/VMM use by limiting how many  
cores are active at boot time. After the cores are turned off, the CPU will limit how many working cores  
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are visible to BIOS and OS/VMM. The cores that are turned off cannot be turned on dynamically after  
the OS has started. It can be changed only at the next system reboot.  
.
Core allocation at run-time: This particular use case provides a higher level processor power control  
mechanism to a user at run-time, after booting. An external agent can dynamically use or not use cores  
in the processor subsystem by requesting ME/NM to control them, specifying the number of cores to  
use or not use.  
5.2.1  
Hardware Requirements  
NM is supported only on platforms that have the NM FW functionality loaded and enabled on the Management  
Engine (ME) in the SSB and that have a BMC present to support the external LAN interface to the ME. NM  
power limiting features requires a means for the ME to monitor input power consumption for the platform. This  
capability is generally provided by means of PMBus*-compliant power supplies although an alternative model  
using a simpler SMBus* power monitoring device is possible (there is potential loss in accuracy and  
responsiveness using non-PMBus* devices). The NM SmaRT/CLST feature does specifically require PMBus*-  
compliant power supplies as well as additional hardware on the baseboard.  
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6. Platform Management Functional Overview  
Platform management functionality is supported by several hardware and software components integrated on  
the server board that work together to control system functions, monitor and report system health, and control  
various thermal and performance features in order to maintain (when possible) server functionality in the event  
of component failure and/or environmentally stressed conditions.  
This chapter provides a high level overview of the platform management features and functionality  
implemented on the server board.  
For more in depth and design level Platform Management information, please refer the BMC Core Firmware  
External Product Specification (EPS) and BIOS Core External Product Specification (EPS) for Intel® Server  
products based on the Intel® Xeon® processor E5-4600,2600,1600 product families.  
6.1 Baseboard Management Controller (BMC) Firmware Feature Support  
The following sections outline features that the integrated BMC firmware can support. Support and utilization  
for some features is dependent on the server platform in which the server board is integrated and any  
additional system level components and options that may be installed.  
6.1.1  
IPMI 2.0 Features  
.
.
.
.
.
.
Baseboard management controller (BMC)  
IPMI Watchdog timer  
Messaging support, including command bridging and user/session support  
Chassis device functionality, including power/reset control and BIOS boot flags support  
Event receiver device: The BMC receives and processes events from other platform subsystems.  
Field Replaceable Unit (FRU) inventory device functionality: The BMC supports access to system FRU  
devices using IPMI FRU commands.  
.
.
System Event Log (SEL) device functionality: The BMC supports and provides access to a SEL.  
Sensor Data Record (SDR) repository device functionality: The BMC supports storage and access of  
system SDRs.  
.
.
Sensor device and sensor scanning/monitoring: The BMC provides IPMI management of sensors. It  
polls sensors to monitor and report system health.  
IPMI interfaces  
o
Host interfaces include system management software (SMS) with receive message queue  
support, and server management mode (SMM)  
o
o
IPMB interface  
LAN interface that supports the IPMI-over-LAN protocol (RMCP, RMCP+)  
.
.
.
Serial-over-LAN (SOL)  
ACPI state synchronization: The BMC tracks ACPI state changes that are provided by the BIOS.  
BMC self-test: The BMC performs initialization and run-time self-tests and makes results available to  
external entities.  
See also the Intelligent Platform Management Interface Specification Second Generation v2.0.  
6.1.2  
Non IPMI Features  
The BMC supports the following non-IPMI features.  
.
.
In-circuit BMC firmware update  
BMC FW reliability enhancements:  
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o
Redundant BMC boot blocks to avoid possibility of a corrupted boot block resulting in a scenario  
that prevents a user from updating the BMC.  
o
BMC System Management Health Monitoring  
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
Fault resilient booting (FRB): FRB2 is supported by the watchdog timer functionality.  
Enable/Disable of System Reset Due CPU Errors  
Chassis intrusion detection  
Fan speed control  
Fan redundancy monitoring and support  
Hot-swap fan support  
Power Supply Fan Sensors  
System Airflow Monitoring  
Exit Air Temperature Monitoring  
Acoustic management: Support for multiple fan profiles  
Ethernet Controller Thermal Monitoring  
Global Aggregate Temperature Margin Sensor  
Platform environment control interface (PECI) thermal management support  
Memory Thermal Management  
DIMM temperature monitoring: New sensors and improved acoustic management using closed-loop fan  
control algorithm taking into account DIMM temperature readings.  
.
.
Power supply redundancy monitoring and support  
Power unit management: Support for power unit sensor. The BMC handles power-good dropout  
conditions.  
.
.
.
.
.
Intel® Intelligent Power Node Manager support  
Signal testing support: The BMC provides test commands for setting and getting platform signal states.  
The BMC generates diagnostic beep codes for fault conditions.  
System GUID storage and retrieval  
Front panel management: The BMC controls the system status LED and chassis ID LED. It supports  
secure lockout of certain front panel functionality and monitors button presses. The chassis ID LED is  
turned on using a front panel button or a command.  
.
.
.
.
.
Local Control Display Panel support  
Power state retention  
Power fault analysis  
Intel® Light-Guided Diagnostics  
Address Resolution Protocol (ARP): The BMC sends and responds to ARPs (supported on embedded  
NICs).  
.
Dynamic Host Configuration Protocol (DHCP): The BMC performs DHCP (supported on embedded  
NICs).  
.
.
E-mail alerting  
Embedded web server  
o
o
o
o
o
Support for embedded web server UI in Basic Manageability feature set.  
Human-readable SEL  
Additional system configurability  
Additional system monitoring capability  
Enhanced on-line help  
.
Integrated KVM  
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.
.
.
.
.
.
Integrated Remote Media Redirection  
Local Directory Access Protocol (LDAP) support  
Sensor and SEL logging additions/enhancements (for example, additional thermal monitoring capability)  
SEL Severity Tracking and the Extended SEL  
Embedded platform debug feature which allows capture of detailed data for later analysis.  
Provisioning and inventory enhancements:  
o
Inventory data/system information export (partial SMBIOS table)  
.
.
.
.
.
.
.
DCMI 1.1 compliance (product-specific).  
Management support for PMBus* rev1.2 compliant power supplies  
Energy Star Server Support  
Smart Ride Through (SmaRT)/Closed Loop System Throttling (CLST)  
Power Supply Cold Redundancy  
Power Supply FW Update  
Power Supply Compatibility Check  
6.2 Advanced Configuration and Power Interface (ACPI)  
The server board has support for the following ACPI states:  
Table 21. ACPI Power States  
State  
S0  
Supported  
Yes  
Description  
Working.  
.
.
.
The front panel power LED is on (not controlled by the BMC).  
The fans spin at the normal speed, as determined by sensor inputs.  
Front panel buttons work normally.  
S1  
Yes  
Sleeping. Hardware context is maintained; equates to processor and chipset clocks being  
stopped.  
.
The front panel power LED blinks at a rate of 1 Hz with a 50% duty cycle (not  
controlled by the BMC).  
.
.
.
The watchdog timer is stopped.  
The power, reset, front panel NMI, and ID buttons are unprotected.  
Fan speed control is determined by available SDRs. Fans may be set to a fixed  
state, or basic fan management can be applied.  
The BMC detects that the system has exited the ACPI S1 sleep state when the BIOS SMI  
handler notifies it.  
S2  
S3  
No  
No  
Not supported.  
Supported only on Workstation platforms. See appropriate Platform Specific Information for  
more information.  
S4  
S5  
No  
Not supported.  
Yes  
Soft off.  
.
.
.
.
The front panel buttons are not locked.  
The fans are stopped.  
The power-up process goes through the normal boot process.  
The power, reset, front panel NMI, and ID buttons are unlocked.  
6.3 Power Control Sources  
The server board supports several power control sources which can initiate a power-up or power-down activity.  
Table 22. Power Control Initiators  
External Signal Name or  
Source  
Capabilities  
Turns power on or off  
Turns power off, or power cycle  
Internal Subsystem  
Front panel power button  
Internal BMC timer  
Power button  
BMC watchdog timer  
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Command  
Power state retention  
Chipset  
Routed through command processor  
Implemented by means of BMC internal logic  
Sleep S4/S5 signal (same as POWER_ON)  
Turns power on or off, or power cycle  
Turns power on when AC power returns  
Turns power on or off  
CPU Thermal  
WOL(Wake On LAN)  
CPU Thermtrip  
LAN  
Turns power off  
Turns power on  
6.4 BMC Watchdog  
The BMC FW is increasingly called upon to perform system functions that are time-critical in that failure to  
provide these functions in a timely manner can result in system or component damage. Intel®  
S1400/S1600/S2400/S2600/S4600 Server Platforms introduce a BMC watchdog feature to provide a safe-  
guard against this scenario by providing an automatic recovery mechanism. It also can provide automatic  
recovery of functionality that has failed due to a fatal FW defect triggered by a rare sequence of events or a  
BMC hang due to some type of HW glitch (for example, power).  
This feature is comprised of a set of capabilities whose purpose is to detect misbehaving subsections of BMC  
firmware, the BMC CPU itself, or HW subsystems of the BMC component, and to take appropriate action to  
restore proper operation. The action taken is dependent on the nature of the detected failure and may result in  
a restart of the BMC CPU, one or more BMC HW subsystems, or a restart of malfunctioning FW subsystems.  
The BMC watchdog feature will only allow up to three resets of the BMC CPU (such as HW reset) or entire FW  
stack (such as a SW reset) before giving up and remaining in the uBOOT code. This count is cleared upon  
cycling of power to the BMC or upon continuous operation of the BMC without a watchdog-generated reset  
occurring for a period of > 30 minutes. The BMC FW logs a SEL event indicating that a watchdog-generated  
BMC reset (either soft or hard reset) has occurred. This event may be logged after the actual reset has  
occurred. Refer sensor section for details for the related sensor definition. The BMC will also indicate a  
degraded system status on the Front Panel Status LED after a BMC HW reset or FW stack reset. This state  
(which follows the state of the associated sensor) will be cleared upon system reset or (AC or DC) power cycle.  
Note: A reset of the BMC may result in the following system degradations that will require a system reset or  
power cycle to correct:  
1. Timeout value for the rotation period can be set using this parameterPotentially incorrect ACPI Power  
State reported by the BMC.  
2. Reversion of temporary test modes for the BMC back to normal operational modes.  
3. FP status LED and DIMM fault LEDs may not reflect BIOS detected errors.  
6.5 Fault Resilient Booting (FRB)  
Fault resilient booting (FRB) is a set of BIOS and BMC algorithms and hardware support that allow a  
multiprocessor system to boot even if the bootstrap processor (BSP) fails. Only FRB2 is supported using  
watchdog timer commands.  
FRB2 refers to the FRB algorithm that detects system failures during POST. The BIOS uses the BMC  
watchdog timer to back up its operation during POST. The BIOS configures the watchdog timer to indicate that  
the BIOS is using the timer for the FRB2 phase of the boot operation.  
After the BIOS has identified and saved the BSP information, it sets the FRB2 timer use bit and loads the  
watchdog timer with the new timeout interval.  
If the watchdog timer expires while the watchdog use bit is set to FRB2, the BMC (if so configured) logs a  
watchdog expiration event showing the FRB2 timeout in the event data bytes. The BMC then hard resets the  
system, assuming the BIOS-selected reset as the watchdog timeout action.  
The BIOS is responsible for disabling the FRB2 timeout before initiating the option ROM scan and before  
displaying a request for a boot password. If the processor fails and causes an FRB2 timeout, the BMC resets  
the system.  
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The BIOS gets the watchdog expiration status from the BMC. If the status shows an expired FRB2 timer, the  
BIOS enters the failure in the system event log (SEL). In the OEM bytes entry in the SEL, the last POST code  
generated during the previous boot attempt is written. FRB2 failure is not reflected in the processor status  
sensor value.  
The FRB2 failure does not affect the front panel LEDs.  
6.6 Sensor Monitoring  
The BMC monitors system hardware and reports system health. Some of the sensors include those for  
monitoring  
.
.
.
.
.
.
.
.
Component, board, and platform temperatures  
Board and platform voltages  
System fan presence and tach  
Chassis intrusion  
Front Panel NMI  
Front Panel Power and System Reset Buttons  
SMI timeout  
Processor errors  
The information gathered from physical sensors is translated into IPMI sensors as part of the “IPMI Sensor  
Model”. The BMC also reports various system state changes by maintaining virtual sensors that are not  
specifically tied to physical hardware.  
See Appendix B – Integrated BMC Sensor Tables for additional sensor information.  
6.7 Field Replaceable Unit (FRU) Inventory Device  
The BMC implements the interface for logical FRU inventory devices as specified in the Intelligent Platform  
Management Interface Specification, Version 2.0. This functionality provides commands used for accessing  
and managing the FRU inventory information. These commands can be delivered through all interfaces.  
The BMC provides FRU device command access to its own FRU device and to the FRU devices throughout  
the server. The FRU device ID mapping is defined in the Platform Specific Information. The BMC controls the  
mapping of the FRU device ID to the physical device  
6.8 System Event Log (SEL)  
The BMC implements the system event log as specified in the Intelligent Platform Management Interface  
Specification, Version 2.0. The SEL is accessible regardless of the system power state through the BMC's in-  
band and out-of-band interfaces.  
The BMC allocates 65,502 bytes (approx 64 KB) of non-volatile storage space to store system events. The  
SEL timestamps may not be in order. Up to 3,639 SEL records can be stored at a time. Any command that  
results in an overflow of the SEL beyond the allocated space is rejected with an “Out of Space” IPMI  
completion code (C4h).  
Events logged to the SEL can be viewed using Intel’s SELVIEW utility, Embedded Web Server, and Active  
System Console.  
6.9 System Fan Management  
The BMC controls and monitors the system fans. Each fan is associated with a fan speed sensor that detects  
fan failure and may also be associated with a fan presence sensor for hot-swap support. For redundant fan  
configurations, the fan failure and presence status determines the fan redundancy sensor state.  
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The system fans are divided into fan domains, each of which has a separate fan speed control signal and a  
separate configurable fan control policy. A fan domain can have a set of temperature and fan sensors  
associated with it. These are used to determine the current fan domain state.  
A fan domain has three states: sleep, nominal, and boost. The sleep and boost states have fixed (but  
configurable through OEM SDRs) fan speeds associated with them. The nominal state has a variable speed  
determined by the fan domain policy. An OEM SDR record is used to configure the fan domain policy.  
System fan speeds are controlled through pulse width modulation (PWM) signals, which are driven separately  
for each domain by integrated PWM hardware. Fan speed is changed by adjusting the duty cycle, which is the  
percentage of time the signal is driven high in each pulse  
6.9.1  
Thermal and Acoustic Management  
This feature refers to enhanced fan management to keep the system optimally cooled while reducing the  
amount of noise generated by the system fans. Aggressive acoustics standards might require a trade-off  
between fan speed and system performance parameters that contribute to the cooling requirements, primarily  
memory bandwidth. The BIOS, BMC, and SDRs work together to provide control over how this trade-off is  
determined.  
This capability requires the BMC to access temperature sensors on the individual memory DIMMs. Additionally,  
closed-loop thermal throttling is only supported with buffered DIMMs.  
In order to maintain comprehensive thermal protection, deliver the best system acoustics, and fan power  
efficiency, an intelligent Fan Speed Control (FSC) and thermal management technology (mechanism) is used.  
Options in <F2> BIOS Setup (BIOS > Advanced > System Acoustic and Performance Configuration) allow  
for parameter adjustments based on the actual system configuration and usage. Refer to System Acoustic and  
Performance Configuration for a description of each setting.  
.
.
.
.
.
Set Throttling Mode  
Altitude  
Set Fan Profile  
Fan PWM Offset  
Quiet Fan Idle Mode  
Note: The above features may or may not be in effective depends on the actual thermal characters of a  
specific system. Refer to Intel® Server System R1000GZ/GL product family Technical Product Specification and  
Intel® Server System R2000GZ/GL product family Technical Product Specification for system thermal and  
acoustic management.  
6.9.2  
Thermal Sensor Input to Fan Speed Control  
The BMC uses various IPMI sensors as input to the fan speed control. Some of the sensors are IPMI models  
of actual physical sensors whereas some are “virtual” sensors whose values are derived from physical sensors  
using calculations and/or tabular information.  
The following IPMI thermal sensors are used as input to the fan speed control:  
.
.
.
.
.
.
.
.
Front Panel Temperature Sensor1  
Baseboard Temperature Sensor2  
CPU Margin Sensors3,5,6  
DIMM Thermal Margin Sensors3,5  
Exit Air Temperature Sensor1, 4, 8  
PCH Temperature Sensor4,6  
On-board Ethernet Controller Temperature Sensors4, 6  
Add-In Intel SAS/IO Module Temperature Sensors4, 6  
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.
.
.
.
.
PSU Thermal Sensor4, 9  
CPU VR Temperature Sensors4, 7  
DIMM VR Temperature Sensors4, 7  
Integrated BMC Temperature Sensor4, 7  
Global Aggregate Thermal Margin Sensors 8  
Notes:  
1. For fan speed control in Intel chassis  
2. For fan speed control in 3rd party chassis  
3. Temperature margin from throttling threshold  
4. Absolute temperature  
5. PECI value or margin value  
6. On-die sensor  
7. On-board sensor  
8. Virtual sensor  
9. Available only when PSU has PMBus*  
The following illustration provides a simple model showing the fan speed control structure that implements the  
resulting fan speeds.  
Figure 32. Fan Speed Control Process  
6.9.3  
Memory Thermal Throttling  
The server board provides support for system thermal management through open loop throttling (OLTT) and  
closed loop throttling (CLTT) of system memory. Normal system operation uses closed-loop thermal throttling  
(CLTT) and DIMM temperature monitoring as major factors in overall thermal and acoustics management. In  
the event that BIOS is unable to configure the system for CLTT, it defaults to open-loop thermal throttling  
(OLTT). In the OLTT mode, it is assumed that the DIMM temperature sensors are not available for fan speed  
control.  
Throttling levels are changed dynamically to cap throttling based on memory and system thermal conditions as  
determined by the system and DIMM power and thermal parameters. The BMC’s fan speed control  
functionality is linked to the memory throttling mechanism used.  
The following terminology is used for the various memory throttling options:  
.
Static Open Loop Thermal Throttling (Static-OLTT): OLTT control registers that are configured by  
BIOS MRC remain fixed after post. The system does not change any of the throttling control registers in  
the embedded memory controller during runtime.  
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.
Static Closed Loop Thermal Throttling (Static-CLTT): CLTT control registers are configured by BIOS  
MRC during POST. The memory throttling is run as a closed-loop system with the DIMM temperature  
sensors as the control input. Otherwise, the system does not change any of the throttling control registers  
in the embedded memory controller during runtime.  
.
Dynamic Closed Loop Thermal Throttling (Dynamic-CLTT): CLTT control registers are configured by  
BIOS MRC during POST. The memory throttling is run as a closed-loop system with the DIMM  
temperature sensors as the control input. Adjustments are made to the throttling during runtime based on  
changes in system cooling (fan speed).  
Both Static and Dynamic CLTT modes implement a Hybrid Closed Loop Thermal Throttling mechanism  
whereby the Integrated Memory Controller estimates the DRAM temperature in between actual reads of the  
memory thermal sensors.  
6.10 Messaging Interfaces  
The BMC supports the following communications interfaces:  
.
.
.
.
Host SMS interface by means of low pin count (LPC)/keyboard controller style (KCS) interface  
Host SMM interface by means of low pin count (LPC)/keyboard controller style (KCS) interface  
Intelligent Platform Management Bus (IPMB) I2C interface  
LAN interface using the IPMI-over-LAN protocols  
Every messaging interface is assigned an IPMI channel ID by IPMI 2.0. The following tables shows the  
standard channel assignments.  
Table 23. Mesaaging Interfaces  
Channel ID  
Interface  
Supports  
Sessions  
No  
0
1
Primary IPMB  
LAN 1  
Yes  
2
3
LAN 2  
Yes  
Yes  
LAN3 1  
(Provided by the Intel® Dedicated Server Management NIC)  
4
5
6
Reserved  
USB  
Secondary IPMB  
Yes  
No  
No  
7
8– 0Dh  
0Eh  
SMM  
No  
Reserved  
Self 2  
0Fh  
SMS/Receive Message Queue  
No  
Notes:  
1. Optional hardware supported by the server system.  
2. Refers to the actual channel used to send the request.  
6.10.1  
User Model  
The BMC supports the IPMI 2.0 user model. 15 user IDs are supported. These 15 users can be assigned to  
any channel. The following restrictions are placed on user-related operations:  
1. User names for User IDs 1 and 2 cannot be changed. These are always “” (Null/blank) and “root”  
respectively.  
2. User 2 (“root”) always has the administrator privilege level.  
3. All user passwords (including passwords for 1 and 2) may be modified.  
User IDs 3-15 may be used freely, with the condition that user names are unique. Therefore, no other users  
can be named “” (Null), “root,” or any other existing user name.  
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6.10.2  
IPMB Communication Interface  
The IPMB communication interface uses the 100 KB/s version of an I2C bus as its physical medium. For more  
information on I2C specifications, see The I2C Bus and How to Use It. The IPMB implementation in the BMC is  
compliant with the IPMB v1.0, revision 1.0.  
The BMC IPMB slave address is 20h.  
The BMC both sends and receives IPMB messages over the IPMB interface. Non-IPMB messages received by  
means of the IPMB interface are discarded.  
Messages sent by the BMC can either be originated by the BMC, such as initialization agent operation, or by  
another source. One example is KCS-IPMB bridging.  
6.10.3  
LAN Interface  
The BMC implements both the IPMI 1.5 and IPMI 2.0 messaging models. These provide out-of-band local area  
network (LAN) communication between the BMC and the network.  
See the Intelligent Platform Management Interface Specification Second Generation v2.0 for details about the  
IPMI-over-LAN protocol.  
Run-time determination of LAN channel capabilities can be determined by both standard IPMI defined  
mechanisms.  
6.10.3.1  
RMCP/ASF Messaging  
The BMC supports RMCP ping discovery in which the BMC responds with a pong message to an RMCP/ASF  
ping request. This is implemented per the Intelligent Platform Management Interface Specification Second  
Generation v2.0.  
6.10.3.2  
BMC LAN Channels  
The BMC supports three RMII/RGMII ports that can be used for communicating with Ethernet devices. Two  
ports are used for communication with the on-board NICs and one is used for communication with an Ethernet  
PHY located on an optional RMM4 add-in module.  
6.10.3.2.1  
Baseboard NICs  
The on-board Ethernet controller provides support for a Network Controller Sideband Interface (NC-SI)  
manageability interface. This provides a sideband high-speed connection for manageability traffic to the BMC  
while still allowing for a simultaneous host access to the OS if desired.  
The NC-SI is a DMTF industry standard protocol for the side band management LAN interface. This protocol  
provides a fast multi-drop interface for management traffic.  
The baseboard NIC(s) are connected to a single BMC RMII/RGMII port that is configured for RMII operation.  
The NC-SI protocol is used for this connection and provides a 100 Mb/s full-duplex multi-drop interface which  
allows multiple NICs to be connected to the BMC. The physical layer is based upon RMII, however RMII is a  
point-to-point bus whereas NC-SI allows 1 master and up to 4 slaves. The logical layer (configuration  
commands) is incompatible with RMII.  
The server board will provide support for a dedicated management channel that can be configured to be  
hidden from the host and only used by the BMC. This mode of operation is configured from a BIOS setup  
option.  
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6.10.3.2.2  
Dedicated Management Channel  
An additional LAN channel dedicated to BMC usage and not available to host SW is supported from an  
optional RMM4 add-in card. There is only a PHY device present on the RMM4 add-in card. The BMC has a  
built-in MAC module that uses the RGMII interface to link with the card’s PHY. Therefore, for this dedicated  
management interface, the PHY and MAC are located in different devices.  
The PHY on the RMM4 connects to the BMC’s other RMII/RGMII interface (that is, the one that is not  
connected to the baseboard NICs). This BMC port is configured for RGMII usage.  
In addition to the use of an RMM4 add-in card for a dedicated management channel, on systems that support  
multiple Ethernet ports on the baseboard, the system BIOS provides a setup option to allow one of these  
baseboard ports to be dedicated to the BMC for manageability purposes. When this is enabled, that port is  
hidden from the OS.  
6.10.3.2.3  
Concurrent Server Management Use of Multiple Ethernet Controllers  
The BMC FW supports concurrent OOB LAN management sessions for the following combination:  
.
.
.
2 on-board NIC ports  
1 on-board NIC and the optional dedicated RMM4 add-in management NIC.  
2 on-board NICs and optional dedicated RMM4 add-in management NIC.  
All NIC ports must be on different subnets for the above concurrent usage models.  
MAC addresses are assigned for management NICs from a pool of up to 3 MAC addresses allocated  
specifically for manageability.  
The server board has seven MAC addresses programmed at the factory. MAC addresses are assigned as  
follows:  
.
.
.
.
.
.
.
NIC 1 MAC address (for OS usage)  
NIC 2 MAC address = NIC 1 MAC address + 1 (for OS usage)  
NIC 3 MAC address = NIC 1 MAC address + 2 (for OS usage)  
NIC 4 MAC address = NIC 1 MAC address + 3 (for OS usage)  
BMC LAN channel 1 MAC address = NIC1 MAC address + 4  
BMC LAN channel 2 MAC address = NIC1 MAC address + 5  
BMC LAN channel 3 (RMM) MAC address = NIC1 MAC address + 6  
The printed MAC address on the server board and/or server system is assigned to NIC1 on the server board.  
For security reasons, embedded LAN channels have the following default settings:  
.
.
IP Address: Static  
All users disabled  
IPMI-enabled network interfaces may not be placed on the same subnet. This includes the Intel® Dedicated  
Server Management NIC and either of the BMC’s embedded network interfaces.  
Host-BMC communication over the same physical LAN connection – also known as “loopback” – is not  
supported. This includes “ping” operations.  
On server boards with more than two onboard NIC ports, only the first two ports can be used as BMC LAN  
channels. The remaining ports have no BMC connectivity.  
Maximum bandwidth supported by BMC LAN channels are as follows:  
.
.
.
BMC LAN1 (Baseboard NIC port) ----- 100Mb (10Mb in DC off state)  
BMC LAN 2 (Baseboard NIC port) ----- 100Mb (10Mb in DC off state)  
BMC LAN 3 (Dedicated NIC) ----- 1000Mb  
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6.10.3.3  
IPV6 Support  
In addition to IPv4, the server board has support for IPv6 for manageability channels. Configuration of IPv6 is  
provided by extensions to the IPMI Set & Get LAN Configuration Parameters commands as well as through a  
Web Console IPv6 configuration web page.  
The BMC supports IPv4 and IPv6 simultaneously so they are both configured separately and completely  
independently. For example, IPv4 can be DHCP configured while IPv6 is statically configured or vice versa.  
The parameters for IPv6 are similar to the parameters for IPv4 with the following differences:  
.
.
.
.
An IPv6 address is 16 bytes vs. 4 bytes for IPv4.  
An IPv6 prefix is 0 to 128 bits whereas IPv4 has a 4 byte subnet mask.  
The IPv6 Enable parameter must be set before any IPv6 packets will be sent or received on that channel.  
There are two variants of automatic IP Address Source configuration vs. just DHCP for IPv4.  
The three possible IPv6 IP Address Sources for configuring the BMC are:  
Static (Manual): The IP, Prefix, and Gateway parameters are manually configured by the user. The BMC  
ignores any Router Advertisement messages received over the network.  
DHCPv6: The IP comes from running a DHCPv6 client on the BMC and receiving the IP from a DHCPv6  
server somewhere on the network. The Prefix and Gateway are configured by Router Advertisements from the  
local router. The IP, Prefix, and Gateway are read-only parameters to the BMC user in this mode.  
Stateless auto-config: The Prefix and Gateway are configured by the router through Router Advertisements.  
The BMC derives its IP in two parts: the upper network portion comes from the router and the lower unique  
portion comes from the BMC’s channel MAC address. The 6-byte MAC address is converted into an 8-byte  
value per the EUI-64* standard. For example, a MAC value of 00:15:17:FE:2F:62 converts into a EUI-64 value  
of 215:17ff:fefe:2f62. If the BMC receives a Router Advertisement from a router at IP 1:2:3:4::1 with a prefix of  
64, it would then generate for itself an IP of 1:2:3:4:215:17ff:fefe:2f62. The IP, Prefix, and Gateway are read-  
only parameters to the BMC user in this mode.  
IPv6 can be used with the BMC’s Web Console, JViewer (remote KVM and Media), and Systems Management  
Architecture for Server Hardware – Command Line Protocol (SMASH-CLP) interface (ssh). There is no  
standard yet on how IPMI RMCP or RMCP+ should operate over IPv6 so that is not currently supported.  
6.10.3.4  
LAN Failover  
The BMC FW provides a LAN failover capability such that the failure of the system HW associated with one  
LAN link will result in traffic being rerouted to an alternate link. This functionality is configurable from IPMI  
methods as well as from the BMC’s Embedded UI, allowing for user to specify the physical LAN links constitute  
the redundant network paths or physical LAN links constitute different network paths. BMC will support only a  
all or nothing” approach – that is, all interfaces bonded together, or none are bonded together.  
The LAN Failover feature applies only to BMC LAN traffic. It bonds all available Ethernet devices but only one  
is active at a time. When enabled, If the active connection’s leash is lost, one of the secondary connections is  
automatically configured so that it has the same IP address (the next active LAN link will be chosen randomly  
from the pool of backup LAN links with link status as “UP”). Traffic immediately resumes on the new active  
connection.  
The LAN Failover enable/disable command may be sent at any time. After it has been enabled, standard IPMI  
commands for setting channel configuration that specify a LAN channel other than the first will return an error  
code.  
6.10.3.5  
BMC IP Address Configuration  
Enabling the BMC’s network interfaces requires using the Set LAN Configuration Parameter command to  
configure LAN configuration parameter 4, IP Address Source. The BMC supports this parameter as follows:  
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.
.
1h, static address (manually configured): Supported on all management NICs. This is the BMC’s default  
value.  
2h, address obtained by BMC running DHCP: Supported only on embedded management NICs.  
IP Address Source value 4h, address obtained by BMC running other address assignment protocol, is not  
supported on any management NIC.  
Attempting to set an unsupported IP address source value has no effect, and the BMC returns error code  
0xCC, Invalid data field-in request. Note that values 0h and 3h are no longer supported, and will return a 0xCC  
error completion code.  
6.10.3.5.1  
Static IP Address (IP Address Source Values 0h, 1h, and 3h)  
The BMC supports static IP address assignment on all of its management NICs. The IP address source  
parameter must be set to “static” before the IP address; the subnet mask or gateway address can be manually  
set.  
The BMC takes no special action when the following IP address source is specified as the IP address source  
for any management NIC:  
.
1h – Static address (manually configured)  
The Set LAN Configuration Parameter command must be used to configure LAN configuration parameter 3, IP  
Address, with an appropriate value.  
The BIOS does not monitor the value of this parameter, and it does not execute DHCP for the BMC under any  
circumstances, regardless of the BMC configuration.  
6.10.3.5.2  
Static LAN Configuration Parameters  
When the IP Address Configuration parameter is set to 01h (static), the following parameters may be changed  
by the user:  
.
.
.
LAN configuration parameter 3 (IP Address)  
LAN configuration parameter 6 (Subnet Mask)  
LAN configuration parameter 12 (Default Gateway Address)  
When changing from DHCP to Static configuration, the initial values of these three parameters will be  
equivalent to the existing DHCP-set parameters. Additionally, the BMC observes the following network safety  
precautions:  
1. The user may only set a subnet mask that is valid, per IPv4 and RFC 950 (Internet Standard Subnetting  
Procedure). Invalid subnet values return a 0xCC (Invalid Data Field in Request) completion code, and  
the subnet mask is not set. If no valid mask has been previously set, default subnet mask is 0.0.0.0.  
2. The user may only set a default gateway address that can potentially exist within the subnet specified  
above. Default gateway addresses outside the BMC’s subnet are technically unreachable and the BMC  
will not set the default gateway address to an unreachable value. The BMC returns a 0xCC (Invalid  
Data Field in Request) completion code for default gateway addresses outside its subnet.  
3. If a command is issued to set the default gateway IP address before the BMC’s IP address and subnet  
mask are set, the default gateway IP address is not updated and the BMC returns 0xCC.  
If the BMC’s IP address on a LAN channel changes while a LAN session is in progress over that channel, the  
BMC does not take action to close the session except through a normal session timeout. The remote client  
must re-sync with the new IP address. The BMC’s new IP address is only available in-band through the “Get  
LAN Configuration Parameters” command.  
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6.10.3.5.3  
Enabling/Disabling Dynamic Host Configuration (DHCP) Protocol  
The BMC DHCP feature is activated by using the Set LAN Configuration Parameter command to set LAN  
configuration parameter 4, IP Address Source, to 2h: “address obtained by BMC running DHCP”. Once this  
parameter is set, the BMC initiates the DHCP process within approximately 100 ms.  
If the BMC has previously been assigned an IP address through DHCP or the Set LAN Configuration  
Parameter command, it requests that same IP address to be reassigned. If the BMC does not receive the  
same IP address, system management software must be reconfigured to use the new IP address. The new  
address is only available in-band, through the IPMI Get LAN Configuration Parameters command.  
Changing the IP Address Source parameter from 2h to any other supported value will cause the BMC to stop  
the DHCP process. The BMC uses the most recently obtained IP address until it is reconfigured.  
If the physical LAN connection is lost (that is, the cable is unplugged), the BMC will not re-initiate the DHCP  
process when the connection is re-established.  
6.10.3.5.4  
DHCP-related LAN Configuration Parameters  
Users may not change the following LAN parameters while the DHCP is enabled:  
.
.
.
LAN configuration parameter 3 (IP Address)  
LAN configuration parameter 6 (Subnet Mask)  
LAN configuration parameter 12 (Default Gateway Address)  
To prevent users from disrupting the BMC’s LAN configuration, the BMC treats these parameters as read-only  
while DHCP is enabled for the associated LAN channel. Using the Set LAN Configuration Parameter command  
to attempt to change one of these parameters under such circumstances has no effect, and the BMC returns  
error code 0xD5, “Cannot Execute Command. Command, or request parameter(s) are not supported in present  
state.”  
6.10.3.6  
DHCP BMC Hostname  
The BMC allows setting a DHCP Hostname using the Set/Get LAN Configuration Parameters command.  
.
.
.
DHCP Hostname can be set regardless of the IP Address source configured on the BMC. But this  
parameter is only used if the IP Address source is set to DHCP.  
When Byte 2 is set to “Update in progress”, all the 16 Block Data Bytes (Bytes 3 – 18) must be present in  
the request.  
When Block Size < 16, it must be the last Block request in this series. In other words Byte 2 is equal to  
“Update is complete” on that request.  
.
.
Whenever Block Size < 16, the Block data bytes must end with a NULL Character or Byte (=0).  
All Block write requests are updated into a local Memory byte array. When Byte 2 is set to “Update is  
Complete”, the Local Memory is committed to the NV Storage. Local Memory is reset to NULL after  
changes are committed.  
.
.
When Byte 1 (Block Selector = 1), firmware resets all the 64 bytes local memory. This can be used to  
undo any changes after the last “Update in Progress”.  
User should always set the hostname starting from block selector 1 after the last “Update is complete”. If  
the user skips block selector 1 while setting the hostname, the BMC will record the hostname as “NULL,”  
because the first block contains NULL data.  
.
.
.
This scheme effectively does not allow a user to make a partial Hostname change. Any Hostname  
change needs to start from Block 1.  
Byte 64 ( Block Selector 04h byte 16) is always ignored and set to NULL by BMC which effectively means  
we can set only 63 bytes.  
User is responsible for keeping track of the Set series of commands and Local Memory contents.  
While BMC firmware is in “Set Hostname in Progress” (Update not complete), the firmware continues using the  
Previous Hostname for DHCP purposes.  
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6.10.4  
Address Resolution Protocol (ARP)  
The BMC can receive and respond to ARP requests on BMC NICs. Gratuitous ARPs are supported, and  
disabled by default.  
6.10.5  
Internet Control Message Protocol (ICMP)  
The BMC supports the following ICMP message types targeting the BMC over integrated NICs:  
.
.
Echo request (ping): The BMC sends an Echo Reply.  
Destination unreachable: If message is associated with an active socket connection within the BMC, the  
BMC closes the socket.  
6.10.6  
Virtual Local Area Network (VLAN)  
The BMC supports VLAN as defined by IPMI 2.0 specifications. VLAN is supported internally by the BMC, not  
through switches. VLAN provides a way of grouping a set of systems together so that they form a logical  
network. This feature can be used to set up a management VLAN where only devices which are members of  
the VLAN will receive packets related to management and members of the VLAN will be isolated from any  
other network traffic. Please note that VLAN does not change the behavior of the host network setting, it only  
affects the BMC LAN communication.  
LAN configuration options are now supported (by means of the Set LAN Config Parameters command,  
parameters 20 and 21) that allow support for 802.1Q VLAN (Layer 2). This allows VLAN headers/packets to be  
used for IPMI LAN sessions. VLAN ID’s are entered and enabled by means of parameter 20 of the Set LAN  
Config Parameters IPMI command. When a VLAN ID is configured and enabled, the BMC only accepts  
packets with that VLAN tag/ID. Conversely, all BMC generated LAN packets on the channel include the given  
VLAN tag/ID. Valid VLAN ID’s are 1 through 4094, VLAN ID’s of 0 and 4095 are reserved, per the 802.1Q  
VLAN specification. Only one VLAN can be enabled at any point in time on a LAN channel. If an existing VLAN  
is enabled, it must first be disabled prior to configuring a new VLAN on the same LAN channel.  
Parameter 21 (VLAN Priority) of the Set LAN Config Parameters IPMI command is now implemented and a  
range from 0-7 will be allowed for VLAN Priorities. Please note that bits 3 and 4 of Parameter 21 are  
considered Reserved bits.  
Parameter 25 (VLAN Destination Address) of the Set LAN Config Parameters IPMI command is not supported  
and returns a completion code of 0x80 (parameter not supported) for any read/write of parameter 25.  
If the BMC IP address source is DHCP, then the following behavior is seen:  
.
.
If the BMC is first configured for DHCP (prior to enabling VLAN), when VLAN is enabled, the BMC  
performs a discovery on the new VLAN in order to obtain a new BMC IP address.  
If the BMC is configured for DHCP (before disabling VLAN), when VLAN is disabled, the BMC performs a  
discovery on the LAN in order to obtain a new BMC IP address.  
.
If the BMC IP address source is Static, then the following behavior is seen:  
.
If the BMC is first configured for static (prior to enabling VLAN), when VLAN is enabled, the BMC has the  
same IP address that was configured before. It is left to the management application to configure a  
different IP address if that is not suitable for VLAN.  
.
If the BMC is configure for static (prior to disabling VLAN), when VLAN is disabled, the BMC has the  
same IP address that was configured before. It is left to the management application to configure a  
different IP address if that is not suitable for LAN.  
6.10.7  
Secure Shell (SSH)  
Secure Shell (SSH) connections are supported for SMASH-CLP sessions to the BMC.  
6.10.8  
Serial-over-LAN (SOL 2.0)  
The BMC supports IPMI 2.0 SOL.  
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IPMI 2.0 introduced a standard serial-over-LAN feature. This is implemented as a standard payload type (01h)  
over RMCP+.  
Three commands are implemented for SOL 2.0 configuration.  
.
“Get SOL 2.0 Configuration Parameters” and “Set SOL 2.0 Configuration Parameters”: These commands  
are used to get and set the values of the SOL configuration parameters. The parameters are  
implemented on a per-channel basis.  
.
.
“Activating SOL”: This command is not accepted by the BMC. It is sent by the BMC when SOL is  
activated to notify a remote client of the switch to SOL.  
Activating a SOL session requires an existing IPMI-over-LAN session. If encryption is used, it should be  
negotiated when the IPMI-over LAN session is established.  
6.10.9  
Platform Event Filter (PEF)  
The BMC includes the ability to generate a selectable action, such as a system power-off or reset, when a  
match occurs to one of a configurable set of events. This capability is called Platform Event Filtering, or PEF.  
One of the available PEF actions is to trigger the BMC to send a LAN alert to one or more destinations.  
The BMC supports 20 PEF filters. The first twelve entries in the PEF filter table are pre-configured (but may be  
changed by the user). The remaining entries are left blank, and may be configured by the user.  
Table 24. Factory Configured PEF Table Entries  
Event Filter  
Offset Mask  
Events  
Number  
1
2
3
4
5
6
Non-critical, critical and non-recoverable  
Non-critical, critical and non-recoverable  
Non-critical, critical and non-recoverable  
General chassis intrusion  
Failure and predictive failure  
Uncorrectable ECC  
Temperature sensor out of range  
Voltage sensor out of range  
Fan failure  
Chassis intrusion (security violation)  
Power supply failure  
BIOS  
7
8
9
POST error  
FRB2  
Policy Correction Time  
BIOS: POST code error  
Watchdog Timer expiration for FRB2  
Node Manager  
10  
11  
12  
Power down, power cycle, and reset  
OEM system boot event  
Drive Failure, Predicted Failure  
Watchdog timer  
System restart (reboot)  
Hot Swap Controller  
Additionally, the BMC supports the following PEF actions:  
.
.
.
.
.
Power off  
Power cycle  
Reset  
OEM action  
Alerts  
The “Diagnostic interrupt” action is not supported.  
6.10.10 LAN Alerting  
The BMC supports sending embedded LAN alerts, called SNMP PET (Platform Event traps), and SMTP email  
alerts.  
The BMC supports a minimum of four LAN alert destinations.  
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6.10.10.1  
SNMP Platform Event Traps (PETs)  
This feature enables a target system to send SNMP traps to a designated IP address by means of LAN. These  
alerts are formatted per the Intelligent Platform Management Interface Specification Second Generation v2.0.  
A Modular Information Block (MIB) file associated with the traps is provided with the BMC firmware to facilitate  
interpretation of the traps by external software. The format of the MIB file is covered under RFC 2578.  
6.10.11 Alert Policy Table  
Associated with each PEF entry is an alert policy that determines which IPMI channel the alert is to be sent.  
There is a maximum of 20 alert policy entries. There are no pre-configured entries in the alert policy table  
because the destination types and alerts may vary by user. Each entry in the alert policy table contains four  
bytes for a maximum table size of 80 bytes.  
6.10.11.1  
E-mail Alerting  
The Embedded Email Alerting feature allows the user to receive e-mails alerts indicating issues with the server.  
This allows e-mail alerting in an OS-absent (for example, Pre-OS and OS-Hung) situation. This feature  
provides support for sending e-mail by means of SMTP, the Simple Mail Transport Protocol as defined in  
Internet RC 821. The e-mail alert provides a text string that describes a simple description of the event. SMTP  
alerting is configured using the embedded web server.  
6.10.12 SM-CLP (SM-CLP Lite)  
SMASH refers to Systems Management Architecture for Server Hardware. SMASH is defined by a suite of  
specifications, managed by the DMTF, that standardize the manageability interfaces for server hardware. CLP  
refers to Command Line Protocol. SM-CLP is defined by the Server Management Command Line Protocol  
Specification (SM-CLP) ver1.0, which is part of the SMASH suite of specifications. The specifications and  
further information on SMASH can be found at the DMTF website (http://www.dmtf.org/).  
The BMC provides an embedded “lite” version of SM-CLP that is syntax-compatible but not considered fully  
compliant with the DMTF standards.  
The SM-CLP utilized by a remote user by connecting a remote system from one of the system NICs. It is  
possible for third party management applications to create scripts using this CLP and execute them on server  
to retrieve information or perform management tasks such as reboot the server, configure events, and so on  
The BMC embedded SM-CLP feature includes the following capabilities:  
.
.
.
.
.
.
.
.
.
.
.
.
Power on/off/reset the server.  
Get the system power state.  
Clear the System Event Log (SEL).  
Get the interpreted SEL in a readable format.  
Initiate/terminate an Serial Over LAN session.  
Support “help” to provide helpful information  
Get/set the system ID LED.  
Get the system GUID  
Get/set configuration of user accounts.  
Get/set configuration of LAN parameters.  
Embedded CLP communication should support SSH connection.  
Provide current status of platform sensors including current values. Sensors include voltage, temperature,  
fans, power supplies, and redundancy (power unit and fan redundancy).  
The embedded web server is supported over any system NIC port that is enabled for server management  
capabilities.  
6.10.13 Embedded Web Server  
BMC Base manageability provides an embedded web server and an OEM-customizable web GUI which  
exposes the manageability features of the BMC base feature set. It is supported over all on-board NICs that  
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have management connectivity to the BMC as well as an optional RMM4 dedicated add-in management NIC.  
At least two concurrent web sessions from up to two different users is supported. The embedded web user  
interface shall support the following client web browsers:  
.
.
.
.
.
.
Microsoft Internet Explorer 7.0*  
Microsoft Internet Explorer 8.0*  
Microsoft Internet Explorer 9.0*  
Mozilla Firefox 3.0*  
Mozilla Firefox 3.5*  
Mozilla Firefox 3.6*  
The embedded web user interface supports strong security (authentication, encryption, and firewall support)  
since it enables remote server configuration and control. Embedded web server uses ports #80 and #443. The  
user interface presented by the embedded web user interface shall authenticate the user before allowing a  
web session to be initiated. Encryption using 128-bit SSL is supported. User authentication is based on user id  
and password.  
The GUI presented by the embedded web server authenticates the user before allowing a web session to be  
initiated. It presents all functions to all users but grays-out those functions that the user does not have privilege  
to execute. (for example, if a user does not have privilege to power control, then the item shall be displayed in  
grey-out font in that user’s UI display). The web GUI also provides a launch point for some of the advanced  
features, such as KVM and media redirection. These features are grayed out in the GUI unless the system has  
been updated to support these advanced features.  
Additional features supported by the web GUI includes:  
.
.
.
.
.
.
.
.
Presents all the Basic features to the users.  
Power on/off/reset the server and view current power state.  
Displays BIOS, BMC, ME and SDR version information.  
Display overall system health.  
Configuration of various IPMI over LAN parameters for both IPV4 and IPV6  
Configuration of alerting (SNMP and SMTP).  
Display system asset information for the product, board, and chassis.  
Display of BMC-owned sensors (name, status, current reading, enabled thresholds), including color-  
code status of sensors.  
.
Provides ability to filter sensors based on sensor type (Voltage, Temperature, Fan & Power supply  
related)  
.
.
.
.
.
Automatic refresh of sensor data with a configurable refresh rate.  
On-line help.  
Display/clear SEL (display is in easily understandable human readable format).  
Supports major industry-standard browsers (Microsoft Internet Explorer* and Mozilla Firefox*).  
The GUI session automatically times-out after a user-configurable inactivity period. By default, this  
inactivity period is 30 minutes.  
.
.
Embedded Platform Debug feature - Allow the user to initiate a “diagnostic dump” to a file that can be  
sent to Intel for debug purposes.  
Virtual Front Panel. The Virtual Front Panel provides the same functionality as the local front panel.  
The displayed LEDs match the current state of the local panel LEDs. The displayed buttons (for  
example, power button) can be used in the same manner as the local buttons.  
Display of ME sensor data. Only sensors that have associated SDRs loaded will be displayed.  
Ability to save the SEL to a file.  
.
.
.
Ability to force HTTPS connectivity for greater security. This is provided through a configuration option  
in the UI.  
.
.
.
.
.
Display of processor and memory information as is available over IPMI over LAN.  
Ability to get and set Node Manager (NM) power policies.  
Display of power consumed by the server.  
Ability to view and configure VLAN settings.  
Warn user the reconfiguration of IP address will cause disconnect.  
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.
Capability to block logins for a period of time after several consecutive failed login attempts. The lock-  
out period and the number of failed logins that initiates the lock-out period are configurable by the user.  
Server Power Control - Ability to force into Setup on a reset.  
6.10.14 Virtual Front Panel  
.
Virtual Front Panel is the module present as “Virtual Front Panel” on the left side in the embedded web  
server when "remote Control" tab is clicked.  
.
.
Main Purpose of the Virtual Front Panel is to provide the front panel functionality virtually.  
Virutal Front Panel (VFP) will mimic the status LED and Power LED status and Chassis ID alone. It is  
automatically in sync with BMC every 40 seconds.  
.
.
For any abnormal status LED state, Virtual Front Panel will get the reason behind the abnormal or status  
LED changes and displayed in VFP side.  
As Virtual Front Panel uses the chassis control command for power actions. It won’t log the Front button  
press event since Logging the front panel press event for Virtual Front Panel press will mislead the  
administrator.  
.
.
.
For Reset from Virtual Front Panel, the reset will be done by a “Chassis control” command.  
For Reset from Virtual Front Panel, the restart cause will be because of “Chassis control” command.  
During Power action, Power button/Reset button should not accept the next action until current Power  
action is complete and the acknowledgment from BMC is received.  
.
.
EWS will provide a valid message during Power action until it completes the current Power action.  
The VFP does not have any effect on whether the front panel is locked by “Set Front Panel Enables”  
command.  
.
The chassis ID LED provides a visual indication of a system being serviced. The state of the chassis ID  
LED is affected by the following actions:  
.
.
Toggled by turning the chassis ID button on or off.  
There is no precedence or lock-out mechanism for the control sources. When a new request arrives,  
previous requests are terminated. For example, if the chassis ID button is pressed, then the chassis ID  
LED changes to solid on. If the button is pressed again, then the chassis ID LED turns off.  
Note that the chassis ID will turn on because of the original chassis ID button press and will reflect in the  
Virtual Front Panel after VFP sync with BMC. Virtual Front Panel won’t reflect the chassis LED software  
blinking from software command as there is no mechanism to get the chassis ID Led status.  
Only Infinite chassis ID ON/OFF from software command will reflect in EWS during automatic /manual  
EWS sync up with BMC.  
.
.
.
.
Virtual Front Panel help should available for virtual panel module.  
At present, NMI button in VFP is disabled in Intel® S1400/S1600/S2400/S2600 Server Platforms. It can  
be used in future.  
6.10.15 Embedded Platform Debug  
The Embedded Platform Debug feature supports capturing low-level diagnostic data (applicable MSRs, PCI  
config-space registers, and so on). This feature allows a user to export this data into a file that is retrievable  
from the embedded web GUI, as well as through host and remote IPMI methods, for the purpose of sending to  
an Intel engineer for an enhanced debugging capability. The files are compressed, encrypted, and password  
protected. The file is not meant to be viewable by the end user but rather to provide additional debugging  
capability to an Intel support engineer.  
A list of data that may be captured using this feature includes but is not limited to:  
.
.
Platform sensor readings – This includes all “readable” sensors that can be accessed by the BMC FW  
and have associated SDRs populated in the SDR repository. This does not include any “event-only”  
sensors. (All BIOS sensors and some BMC and ME sensors are “event-only”; meaning that they are not  
readable using an IPMI Get Sensor Reading command but rather are used just for event logging  
purposes).  
SEL – The current SEL contents are saved in both hexadecimal and text format.  
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CPU/memory register data – useful for diagnosing the cause of the following system errors: CATERR,  
ERR[2], SMI timeout, PERR, and SERR. The debug data is saved and timestamped for the last 3  
occurrences of the error conditions.  
o
o
o
PCI error registers  
MSR registers  
MCH registers  
.
BMC configuration data  
o
o
BMC FW debug log (that is, SysLog) – Captures FW debug messages.  
Non-volatile storage of captured data. Some of the captured data will be stored persistently in  
the BMC’s non-volatile flash memory and preserved across AC power cycles. Due to size  
limitations of the BMC’s flash memory, it is not feasible to store all of the data persistently.  
.
.
SMBIOS table data. The entire SMBIOS table is captured from the last boot.  
PCI configuration data for on-board devices and add-in cards. The first 256 bytes of PCI configuration  
data is captured for each device for each boot.  
.
.
System memory map. The system memory map is provided by BIOS on the current boot. This includes  
the EFI memory map and the Legacy (E820) memory map depending on the current boot.  
Power supplies debug capability.  
o
Capture of power supply “black box” data and power supply asset information. Power supply  
vendors are adding the capability to store debug data within the power supply itself. The  
platform debug feature provides a means to capture this data for each installed power supply.  
The data can be analyzed by Intel for failure analysis and possibly provided to the power supply  
vendor as well. The BMC gets this data from the power supplies from PMBus* manufacturer-  
specific commands.  
o
Storage of system identification in power supply. The BMC copies board and system serial  
numbers and part numbers into the power supply whenever a new power supply is installed in  
the system or when the system is first powered on. This information is included as part of the  
power supply black box data for each installed power supply.  
.
.
.
Accessibility from IPMI interfaces. The platform debug file can be accessed from an external IPMI  
interface (KCS or LAN).  
POST code sequence for the two most recent boots. This is a best-effort data collection by the BMC as  
the BMC real-time response cannot guarantee that all POST codes are captured.  
Support for multiple debug files. The platform debug feature provides the ability to save data to 2  
separate files that are encrypted with different passwords.  
o
File #1 is strictly for viewing by Intel engineering and may contain BMC log messages (that is,  
syslog) and other debug data that Intel FW developers deem useful in addition to the data  
specified in this document.  
o
File #2 can be viewed by Intel partners who have signed an NDA with Intel and its contents are  
restricted to specific data items specified in this with the exception of the BMC syslog messages  
and power supply “black box” data.  
6.10.15.1  
Output Data Format  
The diagnostic feature shall output a password-protected compressed HTML file containing specific BMC and  
system information. This file is not intended for end-customer usage, this file is for customer support and  
engineering only.  
6.10.15.2  
Output Data Availability  
The diagnostic data shall be available on-demand from the embedded web server, KCS, or IPMI over LAN  
commands.  
6.10.15.3  
Output Data Categories  
The following tables list the data to be provided in the diagnostic output. For items in Table 25, this data is  
collected on detection of CATERR, ERR2, PERR, SERR, and SMI timeout. The data in Table 26 is  
accumulated for the three most recent overall errors.  
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Data  
Table 25. Diagnostic Data  
Category  
Internal BMC Data  
BMC uptime/load  
Process list  
Free Memory  
Detailed Memory List  
Filesystem List/Info  
BMC Network Info  
BMC Syslog  
BMC Configuration Data  
Hex SEL listing  
External BMC Data  
Human-readable SEL listing  
Human-readable sensor listing  
BIOS configuration settings  
POST codes for the two most recent boots  
SMBIOS table for the current boot  
256 bytes of PCI config data for each PCI device  
Memory Map (EFI and Legacy) for current boot  
External BIOS Data  
System Data  
Table 26. Additional Diagnostics on Error.  
Category  
Data  
First 256 bytes of PCI config data for each PCI  
device  
System Data  
PCI error registers  
MSR registers  
MCH registers  
6.10.16 Data Center Management Interface (DCMI)  
The DCMI Specification is an emerging standard that is targeted to provide a simplified management interface  
for Internet Portal Data Center (IPDC) customers. It is expected to become a requirement for server platforms  
which are targeted for IPDCs. DCMI is an IPMI-based standard that builds upon a set of required IPMI  
standard commands by adding a set of DCMI-specific IPMI OEM commands. Intel®  
S1400/S1600/S2400/S2600 Server Platforms will be implementing the mandatory DCMI features in the BMC  
firmware (DCMI 1.1 Errata 1 compliance). Please refer to DCMI 1.1 errata 1 spec for details. Only mandatory  
commands will be supported. No support for optional DCMI commands. Optional power management and SEL  
roll over feature is not supported. DCMI Asset tag will be independent of baseboard FRU asset Tag. Please  
refer table DCMI Group Extension Commands for more details on DCMI commands.  
6.10.17 Lightweight Directory Authentication Protocol (LDAP)  
The Lightweight Directory Access Protocol (LDAP) is an application protocol supported by the BMC for the  
purpose of authentication and authorization. The BMC user connects with an LDAP server for login  
authentication. This is only supported for non-IPMI logins including the embedded web UI and SM-CLP. IPMI  
users/passwords and sessions are not supported over LDAP. LDAP can be configured (IP address of LDAP  
server, port, and so on) from the BMC’s Embedded Web UI. LDAP authentication and authorization is  
supported over the any NIC configured for system management. The BMC uses a standard Open LDAP  
implementation for Linux. Only open LDAP is supported by BMC. Windows* and Novell* LDAP are not  
supported.  
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7. Advanced Management Feature Support (RMM4)  
The integrated baseboard management controller has support for advanced management features which are  
enabled when an optional Intel® Remote Management Module 4 (RMM4) is installed.  
RMM4 is comprised of two boards – RMM4 lite and the optional Dedicated Server Management NIC (DMN).  
Table 27. Intel® Remote Management Module 4 (RMM4) Options  
Intel Product  
Code  
Description  
Kit Contents  
Benefits  
Intel® Remote Management Module 4 Lite  
Intel® Remote Management Module 4  
RMM4 Lite Activation Key Enables KVM & media redirection from  
onboard NIC  
RMM4 Lite Activation Key Dedicated NIC for management traffic.  
AXXRMM4LITE  
Higher bandwidth connectivity for KVM &  
media Redirection with 1Gbe NIC.  
AXXRMM4R  
Dedicated NIC Port  
Module  
On the server board each Intel® RMM4 component is installed at the following locations.  
Figure 33. Intel® RMM4 Lite Activation Key Installation  
Figure 34. Intel® RMM4 Dedicated Management NIC Installation  
Table 28. Enabling Advanced Management Features  
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Manageability Hardware  
Benefits  
Intel® Integrated BMC  
Comprehensive IPMI based base manageability features  
Intel® Remote Management Module 4 – Lite  
Package contains one module –  
No dedicated NIC for management  
Enables KVM & media redirection from onboard NIC  
1- Key for advance Manageability features.  
Intel® Remote Management Module 4  
Package includes 2 modules –  
Dedicated NIC for management traffic. Higher bandwidth  
connectivity for KVM & media Redirection with 1Gbe NIC.  
1 - key for advance features  
2 - Dedicated NIC (1Gbe) for management  
If the optional Dedicated Server Management NIC is not used then the traffic can only go through the onboard  
Integrated BMC-shared NIC and will share network bandwidth with the host system. Advanced manageability  
features are supported over all NIC ports enabled for server manageability.  
7.1 Keyboard, Video, Mouse (KVM) Redirection  
The BMC firmware supports keyboard, video, and mouse redirection (KVM) over LAN. This feature is available  
remotely from the embedded web server as a Java applet. This feature is only enabled when the Intel® RMM4  
lite is present. The client system must have a Java Runtime Environment (JRE) version 6.0 or later to run the  
KVM or media redirection applets.  
The BMC supports an embedded KVM application (Remote Console) that can be launched from the  
embedded web server from a remote console. USB1.1 or USB 2.0 based mouse and keyboard redirection are  
supported. It is also possible to use the KVM-redirection (KVM-r) session concurrently with media-redirection  
(media-r). This feature allows a user to interactively use the keyboard, video, and mouse (KVM) functions of  
the remote server as if the user were physically at the managed server. KVM redirection console support the  
following keyboard layouts: English, Dutch, French, German, Italian,  
Russian, and Spanish.  
KVM redirection includes a “soft keyboard” function. The “soft keyboard” is used to simulate an entire  
keyboard that is connected to the remote system. The “soft keyboard” functionality supports the following  
layouts: English, Dutch, French, German, Italian, Russian, and Spanish.  
The KVM-redirection feature automatically senses video resolution for best possible screen capture and  
provides high-performance mouse tracking and synchronization. It allows remote viewing and configuration in  
pre-boot POST and BIOS setup, once BIOS has initialized video.  
Other attributes of this feature include:  
.
.
.
.
Encryption of the redirected screen, keyboard, and mouse  
Compression of the redirected screen.  
Ability to select a mouse configuration based on the OS type.  
supports user definable keyboard macros.  
KVM redirection feature supports the following resolutions and refresh rates:  
.
.
.
.
.
.
.
.
.
640x480 at 60Hz, 72Hz, 75Hz, 85Hz, 100Hz  
800x600 at 60Hz, 72Hz, 75Hz, 85Hz  
1024x768 at 60Hx, 72Hz, 75Hz, 85Hz  
1280x960 at 60Hz  
1280x1024 at 60Hz  
1600x1200 at 60Hz  
1920x1080 (1080p),  
1920x1200 (WUXGA)  
1650x1080 (WSXGA+)  
7.1.1  
Remote Console  
The Remote Console is the redirected screen, keyboard and mouse of the remote host system. To use the  
Remote Console window of your managed host system, the browser must include a Java* Runtime  
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Environment plug-in. If the browser has no Java support, such as with a small handheld device, the user can  
maintain the remote host system using the administration forms displayed by the browser.  
The Remote Console window is a Java Applet that establishes TCP connections to the BMC. The protocol that  
is run over these connections is a unique KVM protocol and not HTTP or HTTPS. This protocol uses ports  
#7578 for KVM, #5120 for CDROM media redirection, and #5123 for Floppy/USB media redirection. When  
encryption is enabled, the protocol uses ports #7582 for KVM, #5124 for CDROM media redirection, and  
#5127 for Floppy/USB media redirection. The local network environment must permit these connections to be  
made, that is, the firewall and, in case of a private internal network, the NAT (Network Address Translation)  
settings have to be configured accordingly.  
7.1.2  
Performance  
The remote display accurately represents the local display. The feature adapts to changes to the video  
resolution of the local display and continues to work smoothly when the system transitions from graphics to text  
or vice-versa. The responsiveness may be slightly delayed depending on the bandwidth and latency of the  
network.  
Enabling KVM and/or media encryption will degrade performance. Enabling video compression provides the  
fastest response while disabling compression provides better video quality.  
For the best possible KVM performance, a 2Mb/sec link or higher is recommended.  
The redirection of KVM over IP is performed in parallel with the local KVM without affecting the local KVM  
operation.  
7.1.3  
Security  
The KVM redirection feature supports multiple encryption algorithms, including RC4 and AES. The actual  
algorithm that is used is negotiated with the client based on the client’s capabilities.  
7.1.4  
Availability  
The remote KVM session is available even when the server is powered-off (in stand-by mode). No re-start of  
the remote KVM session shall be required during a server reset or power on/off. An BMC reset (for example,  
due to an BMC Watchdog initiated reset or BMC reset after BMC FW update) will require the session to be re-  
established.  
KVM sessions persist across system reset, but not across an AC power loss.  
7.1.5  
Usage  
As the server is powered up, the remote KVM session displays the complete BIOS boot process. The user is  
able interact with BIOS setup, change and save settings as well as enter and interact with option ROM  
configuration screens.  
At least two concurrent remote KVM sessions are supported. It is possible for at least two different users to  
connect to same server and start remote KVM sessions  
7.1.6  
Force-enter BIOS Setup  
KVM redirection can present an option to force-enter BIOS Setup. This enables the system to enter F2 setup  
while booting which is often missed by the time the remote console redirects the video.  
Media Redirection  
The embedded web server provides a Java applet to enable remote media redirection. This may be used in  
conjunction with the remote KVM feature, or as a standalone applet.  
The media redirection feature is intended to allow system administrators or users to mount a remote IDE or  
USB CD-ROM, floppy drive, or a USB flash disk as a remote device to the server. Once mounted, the remote  
device appears just like a local device to the server, allowing system administrators or users to install software  
(including operating systems), copy files, update BIOS, and so on, or boot the server from this device.  
The following capabilities are supported:  
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The operation of remotely mounted devices is independent of the local devices on the server. Both  
remote and local devices are useable in parallel.  
.
.
Either IDE (CD-ROM, floppy) or USB devices can be mounted as a remote device to the server.  
It is possible to boot all supported operating systems from the remotely mounted device and to boot from  
disk IMAGE (*.IMG) and CD-ROM or DVD-ROM ISO files. See the Tested/supported Operating System  
List for more information.  
.
Media redirection supports redirection for both a virtual CD device and a virtual Floppy/USB device  
concurrently. The CD device may be either a local CD drive or else an ISO image file; the Floppy/USB  
device may be either a local Floppy drive, a local USB device, or else a disk image file.  
The media redirection feature supports multiple encryption algorithms, including RC4 and AES. The  
actual algorithm that is used is negotiated with the client based on the client’s capabilities.  
A remote media session is maintained even when the server is powered-off (in standby mode). No restart  
of the remote media session is required during a server reset or power on/off. An BMC reset (for example,  
due to an BMC reset after BMC FW update) will require the session to be re-established  
The mounted device is visible to (and useable by) managed system’s OS and BIOS in both pre-boot and  
post-boot states.  
.
.
.
.
.
The mounted device shows up in the BIOS boot order and it is possible to change the BIOS boot order to  
boot from this remote device.  
It is possible to install an operating system on a bare metal server (no OS present) using the remotely  
mounted device. This may also require the use of KVM-r to configure the OS during install.  
USB storage devices will appear as floppy disks over media redirection. This allows for the installation of  
device drivers during OS installation.  
If either a virtual IDE or virtual floppy device is remotely attached during system boot, both the virtual IDE and  
virtual floppy are presented as bootable devices. It is not possible to present only a single-mounted device type  
to the system BIOS.  
7.1.7  
Availability  
The default inactivity timeout is 30 minutes and is not user-configurable. Media redirection sessions persist  
across system reset but not across an AC power loss or BMC reset.  
7.1.8  
Network Port Usage  
The KVM and media redirection features use the following ports:  
.
.
.
.
.
.
5120 – CD Redirection  
5123 – FD Redirection  
5124 – CD Redirection (Secure)  
5127 – FD Redirection (Secure)  
7578 – Video Redirection  
7582 – Video Redirection (Secure)  
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8. On-board Connector/Header Overview  
This section identifies the location and pin-out for on-board connectors and headers of the server board that  
provide an interface to system options/features, on-board platform management, or other user accessible  
options/features.  
8.1 Power Connectors  
The server board includes several power connectors that are used to provide DC power to various devices.  
8.1.1  
Main Power  
Main server board power is supplied from two slot connectors, which allow for one or two (redundant) power  
supplies to dock directly to the server board. Each connector is labeled as “MAIN PWR 1” or “MAIN PWR 2”  
on the server board. The server board provides no option to support power supplies with cable harnesses. In a  
redundant power supply configuration, a failed power supply module is hot-swappable. The following tables  
provide the pin-out for both “MAIN PWR 1” and “MAIN PWR 2” connectors.  
Table 29. Main Power (Slot 1) Connector Pin-out (“MAIN PWR 1”)  
Signal Description  
GROUND  
Pin # Pin#  
Signal Description  
GROUND  
B1  
B2  
B3  
B4  
B5  
B6  
B7  
B8  
B9  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
A8  
A9  
GROUND  
GROUND  
GROUND  
GROUND  
GROUND  
GROUND  
GROUND  
GROUND  
GROUND  
P12V  
GROUND  
GROUND  
GROUND  
GROUND  
GROUND  
GROUND  
GROUND  
P12V  
B10 A10  
B11 A11  
B12 A12  
B13 A13  
B14 A14  
B15 A15  
B16 A16  
B17 A17  
B18 A18  
B19 A19  
B20 A20  
B21 A21  
P12V  
P12V  
P12V  
P12V  
P12V  
P12V  
P12V  
P12V  
P12V  
P12V  
P12V  
P12V  
P12V  
P12V  
P12V  
P12V  
P3V3_AUX: PD_PS1_FRU_A0  
P3V3_AUX: PD_PS1_FRU_A1  
P12V_STBY  
SMB_PMBUS_DATA_R  
SMB_PMBUS_CLK_R  
FM_PS_EN_PSU_N  
FM_PS_CR1  
B22 A22 IRQ_SML1_PMBUS_ALERTR2_N  
P12V_SHARE  
TP_1_B24  
B23 A23  
B24 A24  
ISENSE_P12V_SENSE_RTN  
ISENSE_P12V_SENSE  
PWRGD_PS_PWROK  
FM_PS_COMPATIBILITY_BUS B25 A25  
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Table 30. Main Power (Slot 2) Connector Pin-out ("MAIN PWR 2”)  
Signal Description  
Pin # Pin#  
Signal Description  
GROUND  
GROUND  
GROUND  
GROUND  
GROUND  
GROUND  
GROUND  
GROUND  
GROUND  
GROUND  
P12V  
B1  
B2  
B3  
B4  
B5  
B6  
B7  
B8  
B9  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
A8  
A9  
GROUND  
GROUND  
GROUND  
GROUND  
GROUND  
GROUND  
GROUND  
GROUND  
P12V  
B10 A10  
B11 A11  
B12 A12  
B13 A13  
B14 A14  
B15 A15  
B16 A16  
B17 A17  
B18 A18  
B19 A19  
B20 A20  
B21 A21  
P12V  
P12V  
P12V  
P12V  
P12V  
P12V  
P12V  
P12V  
P12V  
P12V  
P12V  
P12V  
P12V  
P12V  
P12V  
P12V  
P3V3_AUX: PU_PS2FRU_A0  
P3V3_AUX: PD_PS2_FRU_A1  
P12V_STBY  
FM_PS_CR1  
P12V_SHARE  
TP_2_B24  
SMB_PMBUS_DATA_R  
SMB_PMBUS_CLK_R  
FM_PS_EN_PSU_N  
B22 A22 IRQ_SML1_PMBUS_ALERTR3_N  
B23 A23  
B24 A24  
ISENSE_P12V_SENSE_RTN  
ISENSE_P12V_SENSE  
PWRGD_PS_PWROK  
FM_PS_COMPATIBILITY_BUS B25 A25  
8.1.2  
Riser Card Power Connectors  
The server board includes two white 2x2-pin power connectors that provide supplemental power to high power  
PCIe x16 add-in cards (Video or GPGPU) that have power requirements that exceed the 75W maximum power  
supplied by the PCIe x16 riser slot. A cable from this connector may be routed to a power connector on the  
given add-in card. Maximum power draw for each connector is 225W, but is also limited by available power  
provided by the power supply and the total power draw of the rest of the system. A power budget for the  
complete system should be performed to determine how much supplemental power is available to support any  
high power add-in cards.  
Table 31. Riser Slot Power Pin-out ("OPT_12V_PWR_1" & " OPT_12V_PWR_2")  
Signal Description Pin# Pin# Signal Description  
P12V  
3
1
GROUND  
P12V  
4
2
GROUND  
8.1.3  
Hot Swap Backplane Power Connector  
The server board includes one 8-pin power connector that can be cabled to provide power for hot swap  
backplanes. On the server board, this connector is labeled as “HSBP PWR”. The following table provides the  
pin-out for this connector.  
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Table 32. Hot Swap Backplane Power Connector Pin-out (“HSBP PWR")  
Signal Description Pin# Pin# Signal Description  
P12V_240VA1  
P12V_240VA1  
P12V_240VA2  
P12V_240VA2  
5
6
7
8
1
2
3
4
GROUND  
GROUND  
GROUND  
GROUND  
8.1.4  
Peripheral Drive Power Connector  
The server board includes one 6-pin power connector intended to provide power for peripheral devices such as  
Optical Disk Drives (ODD) and/or Solid State Devices (SSD). On the server board this connector is labeled as  
“ODD/SSD_ PWR”. The following table provides the pin-out for this connector.  
Table 33. Peripheral Drive Power Connector Pin-out ("ODD/SSD_PWR")  
Signal Description Pin# Pin# Signal Description  
P12V  
P3V3  
GROUND  
4
5
6
1
2
3
P5V  
P5V  
GROUND  
8.2 Front Panel Headers and Connectors  
The server board includes several connectors that provide various possible front panel options. This section  
provides a functional description and pin-out for each connector.  
8.2.1  
Front Panel Support  
Included on the front edge of the server board is a 30-pin SSI compatible front panel header which provides for  
various front panel features including:  
.
.
.
.
.
.
.
.
Power/Sleep Button  
System ID Button  
System Reset Button  
NMI Button  
NIC Activity LEDs  
Hard Drive Activity LEDs  
System Status LED  
System ID LED  
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On the server board, this header is labeled “FRONT PANEL”. The following table provides the pin-out for this  
header.  
Table 34. SSI Front Panel Header Pin-out ("Front Panel")  
Signal Description  
P3V3_AUX  
Pin# Pin#  
Signal Description  
1
2
P3V3_AUX  
KEY  
FP_PWR_LED_BUF_R_N  
P3V3  
LED_HDD_ACTIVITY_R_N  
FP_PWR_BTN_N  
GROUND  
FP_RST_BTN_R_N  
GROUND  
FP_ID_BTN_R_N  
PU_FM_SIO_TEMP_SENSOR  
FP_NMI_BTN_R_N  
KEY  
4
6
8
P5V_STBY  
5
7
9
11  
13  
15  
17  
19  
21  
23  
FP_ID_LED_BUF_R_N  
FP_LED_STATUS_GREEN_R_N  
FP_LED_STATUS_AMBER_R_N  
LED _NIC_LINK0_ACT_FP_N  
LED _NIC_LINK0_LNKUP_FP_N  
SMB_SENSOR_3V3STBY_DATA_R0  
SMB_SENSOR_3V3STBY_CLK  
FP_CHASSIS_INTRUSION  
10  
12  
14  
16  
18  
20  
22  
24  
LED_NIC_LINK1_ACT_FP_N  
LED_NIC_LINK1_LNKUP_FP_N  
KEY  
LED_NIC_LINK2_ACT_FP_N  
LED_NIC_LINK2_LNKUP_FP_N  
27  
29  
28  
30  
LED_NIC_LINK3_ACT_FP_N  
LED_NIC_LINK3_LNKUP_FP_N  
8.2.1.1  
Power/Sleep Button and LED Support  
Pressing the Power button will toggle the system power on and off. This button also functions as a sleep  
button if enabled by an ACPI compliant operating system. Pressing this button will send a signal to the  
integrated BMC, which will power on or power off the system. The power LED is a single color and is capable  
of supporting different indicator states as defined in the following table.  
Table 35. Power/Sleep LED Functional States  
State  
Power Mode  
LED  
Description  
Power-off  
Power-on  
S5  
Non-ACPI  
Non-ACPI  
ACPI  
Off  
On  
Off  
System power is off, and the BIOS has not initialized the chipset.  
System power is on  
Mechanical is off, and the operating system has not saved any context  
to the hard disk.  
S4  
S3-S1  
S0  
ACPI  
ACPI  
ACPI  
Off  
Mechanical is off. The operating system has saved context to the hard  
disk.  
DC power is still on. The operating system has saved context and  
gone into a level of low-power state.  
Slow blink1  
Steady on  
System and the operating system are up and running.  
8.2.1.2  
System ID Button and LED Support  
Pressing the System ID Button will toggle both the ID LED on the front panel and the Blue ID LED on the  
server board on and off. The System ID LED is used to identify the system for maintenance when installed in a  
rack of similar server systems. The System ID LED can also be toggled on and off remotely using the IPMI  
“Chassis Identify” command which will cause the LED to blink for 15 seconds.  
8.2.1.3  
When pressed, this button will reboot and re-initialize the system  
8.2.1.4 NMI Button Support  
System Reset Button Support  
When the NMI button is pressed, it puts the server in a halt state and causes the BMC to issue a non-  
maskable interrupt (NMI). This can be useful when performing diagnostics for a given issue where a memory  
download is necessary to help determine the cause of the problem. Once an NMI has been generated by the  
BMC, the BMC does not generate another NMI until the system has been reset or powered down.  
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The following actions cause the BMC to generate an NMI pulse:  
.
Receiving a Chassis Control command to pulse the diagnostic interrupt. This command does not  
cause an event to be logged in the SEL.  
.
Watchdog timer pre-timeout expiration with NMI/diagnostic interrupt pre-timeout action enabled.  
The following table describes behavior regarding NMI signal generation and event logging by the BMC.  
Table 36. NMI Signal Generation and Event Logging  
NMI  
Signal  
Generation  
Causal Event  
Front Panel Diag Interrupt Sensor Event Logging Support  
Chassis Control command (pulse diagnostic interrupt)  
Front panel diagnostic interrupt button pressed  
X
X
X
X
X
Watchdog Timer pre-timeout expiration with  
NMI/diagnostic interrupt action  
8.2.1.5  
NIC Activity LED Support  
The Front Control Panel includes an activity LED indicator for each on-board Network Interface Controller  
(NIC). When a network link is detected, the LED will turn on solid. The LED will blink once network activity  
occurs at a rate that is consistent with the amount of network activity that is occurring.  
8.2.1.6  
Hard Drive Activity LED Support  
The drive activity LED on the front panel indicates drive activity from the on-board hard disk controllers. The  
server board also provides a header giving access to this LED for add-in controllers.  
8.2.1.7  
System Status LED Support  
The System Status LED is a bi-color (Green/Amber) indicator that shows the current health of the server  
system. The system provides two locations for this feature; one is located on the Front Control Panel, the other  
is located on the back edge of the server board, viewable from the back of the system. Both LEDs are tied  
together and will show the same state. The System Status LED states are driven by the on-board platform  
management sub-system. The following table provides a description of each supported LED state.  
Table 37. System Status LED State Definitions  
Color  
Off  
State  
System is  
not  
Criticality  
Not ready  
Description  
1. System is powered off (AC and/or DC).  
2. System is in EuP Lot6 Off Mode.  
operating  
3. System is in S5 Soft-Off State.  
4. System is in S4 Hibernate Sleep State.  
Green  
Green  
Solid on  
Ok  
Indicates that the System is running (in S0 State) and its status is ‘Healthy’.  
The system is not exhibiting any errors. AC power is present and BMC has  
booted and manageability functionality is up and running.  
~1 Hz blink  
Degraded - system System degraded:  
is operating in a  
degraded state  
although still  
functional, or  
system is  
operating in  
a redundant state  
but with an  
Redundancy loss, such as power-supply or fan. Applies only if the  
associated platform sub-system has redundancy capabilities.  
Fan warning or failure when the number of fully operational fans is more  
than minimum number needed to cool the system.  
Non-critical threshold crossed – Temperature (including HSBP temp),  
voltage, input power to power supply, output current for main power rail  
from power supply and Processor Thermal Control (Therm Ctrl) sensors.  
Power supply predictive failure occurred while redundant power supply  
configuration was present.  
impending failure  
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Color  
State  
Criticality  
warning  
Description  
Unable to use all of the installed memory (one or more DIMMs  
failed/disabled but functional memory remains available)  
Correctable Errors over a threshold and migrating to a spare DIMM  
(memory sparing). This indicates that the user no longer has spared DIMMs  
indicating a redundancy lost condition. Corresponding DIMM LED lit.  
Uncorrectable memory error has occurred in memory Mirroring Mode,  
causing Loss of Redundancy.  
Correctable memory error threshold has been reached for a failing DDR3  
DIMM when the system is operating in fully redundant RAS Mirroring Mode.  
BMC executing in uBoot. (Indicated by Chassis ID blinking at Blinking at  
3Hz). System in degraded state (no manageability). BMC uBoot is running  
but has not transferred control to BMC Linux. Server will be in this state 6-8  
seconds after BMC reset while it pulls the Linux image into flash  
BMC booting Linux. (Indicated by Chassis ID solid ON). System in  
degraded state (no manageability). Control has been passed from BMC  
uBoot to BMC Linux itself. It will be in this state for ~10-~20 seconds.  
BMC Watchdog has reset the BMC.  
Power Unit sensor offset for configuration error is asserted.  
HDD HSC is off-line or degraded.  
Amber  
~1 Hz blink  
Non-critical -  
System is  
operating in a  
degraded state  
Non-fatal alarm – system is likely to fail:  
Critical threshold crossed – Voltage, temperature (including HSBP temp),  
input power to power supply, output current for main power rail from power  
supply and PROCHOT (Therm Ctrl) sensors.  
with an impending VRD Hot asserted.  
failure warning,  
although still  
functioning  
Minimum number of fans to cool the system not present or failed  
Hard drive fault  
Power Unit Redundancy sensor – Insufficient resources offset (indicates not  
enough power supplies present)  
In non-sparing and non-mirroring mode if the threshold of correctable errors  
is crossed within the window  
Correctable memory error threshold has been reached for a failing DDR3  
DIMM when the system is operating in a non-redundant mode  
Fatal alarm – system has failed or shutdown:  
CPU CATERR signal asserted  
MSID mismatch detected (CATERR also asserts for this case).  
CPU 1 is missing  
Amber  
Solid on  
Critical, non-  
recoverable –  
System is halted  
CPU Thermal Trip  
No power good – power fault  
DIMM failure when there is only 1 DIMM present and hence no good  
memory present1.  
Runtime memory uncorrectable error in non-redundant mode.  
DIMM Thermal Trip or equivalent  
SSB Thermal Trip or equivalent  
CPU ERR2 signal asserted  
BMC\Video memory test failed. (Chassis ID shows blue/solid-on for this  
condition)  
Both uBoot BMC FW images are bad. (Chassis ID shows blue/solid-on for  
this condition)  
240VA fault  
Fatal Error in processor initialization:  
Processor family not identical  
Processor model not identical  
Processor core/thread counts not identical  
Processor cache size not identical  
Unable to synchronize processor frequency  
Unable to synchronize QPI link frequency  
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8.2.2  
Front Panel USB Connector  
The server board includes a 10-pin connector, that when cabled, can provide up to two USB ports to a front  
panel. On the server board the connector is labeled “FP USB” and is located on the front edge of the board.  
The following table provides the connector pin-out.  
Table 38. Front Panel USB Connector Pin-out ("FP USB")  
Signal Description  
P5V_USB_FP  
USB2_P11_F_DN  
USB2_P11_F_DP  
GROUND  
Pin# Pin#  
Signal Description  
P5V_USB_FP  
USB2_P13_F_DN  
USB2_P13_F_DP  
GROUND  
1
3
5
7
2
4
6
8
10  
TP_USB2_FP_10  
8.2.3  
Front Panel Video Connector  
The server board includes a 14-pin header, that when cabled, can provide an alternate video connector to the  
front panel. On the server board this connector is labeled “FP VIDEO” and is located on the front edge of the  
board. When a monitor is attached to the front panel video connector, the external video connector located on  
the back edge of the board is disabled. The following table provides the pin-out for this connector.  
Table 39. Front Panel Video Connector Pin-out ("FP VIDEO")  
Signal Description  
V_IO_FRONT_R_CONN  
V_IO_FRONT_G_CONN  
V_IO_FRONT_B_CONN  
V_BMC_GFX_FRONT_VSYN  
V_BMC_GFX_FRONT_HSYN  
V_BMC_FRONT_DDC_SDA_CONN  
V_BMC_FRONT_DDC_SCL_CONN  
Pin# Pin#  
Signal Description  
GROUND  
1
3
5
7
2
4
6
8
GROUND  
GROUND  
GROUND  
9
KEY  
11  
13  
12  
14  
V_FRONT_PRES_N  
P5V_VID_CONN_FNT  
8.2.4  
Intel® Local Control Panel Connector  
The server board includes a 7-pin connector that is used when the system is configured with the Intel® Local  
Control Panel with LCD support. On the server board this connector is labeled “LCP” and is located on the  
front edge of the board. The following table provides the pin-out for this connector.  
Table 40. Intel Local Control Panel Connector Pin-out ("LCP")  
Signal Description  
SMB_SENSOR_3V3STBY_DATA_R0  
GROUND  
Pin#  
1
2
SMB_SENSOR_3V3STBY_CLK  
P3V3_AUX  
3
4
FM_LCP_ENTER_N_R  
FM_LCP_LEFT_N_R  
FM_LCP_RIGHT_N_R  
5
6
7
8.3 On-Board Storage Connectors  
The server board provides connectors for support of several storage device options. This section provides a  
functional overview and pin-out of each connector.  
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8.3.1  
Single Port SATA Only Connectors  
The server board includes two white single port SATA only connectors capable of transfer rates of up to 6Gb/s.  
On the server board these connectors are labeled as “SATA 0” and “SATA 1”. The following table provides the  
pin-out for both connectors.  
Table 41. Single Port AHCI SATA Controller Connector Pin-out ("SATA 0" & "SATA 1")  
Signal Description Pin#  
GROUND  
SATA_TXP  
SATA_TXN  
GROUND  
SATA_RXN  
SATA_RXP  
P5V**  
1
2
3
4
5
6
7
**SATA-DOM power support  
8.3.2  
Multiport Mini-SAS/SATA Connectors  
The server board includes two 40-pin high density multiport mini-SAS/SATA connectors. On the server board,  
these connectors are labeled as “SCU_0 (0-3)” supporting the chipset embedded SCU 0 controller, and  
“SCU_1 (4-7)”, supporting the embedded SCU 1 controller. Both connectors can support up to four SATA or  
SAS ports each. By default, only the connector labeled “SCU_0 (0-3)” is enabled and has support for up to four  
SATA ports capable of transfer rates of up to 6Gb/s. The connector labeled “SCU_1 (4-7)” is only enabled  
when an optional 8-port SAS or SATA Intel® RAID C600 Upgrade Key is installed. See Table 16. Intel® RAID  
C600 Upgrade Key Options for a complete list of supported storage upgrade keys. The following tables  
provide the pin-out for each connector.  
Table 42. Multiport SAS/SATA Connector Pin-out ("SCU_0 (0-3)")  
Signal Description  
GROUND  
Pin#  
A1  
Pin#  
B1  
Signal Description  
GROUND  
SAS0_RX_C_DP  
SAS0_RX_C_DN  
GROUND  
A2  
A3  
A4  
B2  
B3  
B4  
SAS0_TX_C_DP  
SAS0_TX_C_DN  
GROUND  
SAS1_RX_C_DP  
SAS1_RX_C_DN  
GROUND  
A5  
A6  
A7  
B5  
B6  
B7  
SAS1_TX_C_DP  
SAS1_TX_C_DN  
GROUND  
TP_SAS1_BACKPLANE_TYPE  
GROUND  
SGPIO_SAS1_DATAOUT  
SGPIO_SAS1_DATAIN  
GROUND  
SAS2_RX_C_DP  
SAS2_RX_C_DN  
GROUND  
SAS3_RX_C_DP  
SAS3_RX_C_DN  
GROUND  
A8  
A9  
B8  
B9  
SGPIO_SAS1_CLOCK  
SGPIO_SAS1_LOAD  
GROUND  
A10  
A11  
A12  
A13  
A14  
A15  
A16  
A17  
A18  
B10  
B11  
B12  
B13  
B14  
B15  
B16  
B17  
B18  
PD_SAS1_CONTROLLER_TYPE  
GROUND  
SAS2_TX_C_DP  
SAS2_TX_C_DN  
GROUND  
SAS3_TX_C_DP  
SAS3_TX_C_DN  
GROUND  
GROUND  
GROUND  
GROUND  
GROUND  
MTH1 MTH5  
MTH2 MTH6  
MTH3 MTH7  
MTH4 MTH8  
GROUND  
GROUND  
GROUND  
GROUND  
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Table 43. Multiport SAS/SATA Connector Pin-out ("SCU_1 (4-7)")  
Signal Description  
GROUND  
Pin#  
A1  
Pin#  
B1  
Signal Description  
GROUND  
SAS4_RX_C_DP  
SAS4_RX_C_DN  
GROUND  
A2  
A3  
A4  
B2  
B3  
B4  
SAS4_TX_C_DP  
SAS4_TX_C_DN  
GROUND  
SAS5_RX_C_DP  
SAS5_RX_C_DN  
GROUND  
A5  
A6  
A7  
B5  
B6  
B7  
SAS5_TX_C_DP  
SAS5_TX_C_DN  
GROUND  
TP_SAS2_BACKPLANE_TYPE  
GROUND  
SGPIO_SAS2_DATAOUT  
SGPIO_SAS2_DATAIN  
GROUND  
SAS6_RX_C_DP  
SAS6_RX_C_DN  
GROUND  
SAS7_RX_C_DP  
SAS7_RX_C_DN  
GROUND  
A8  
A9  
B8  
B9  
SGPIO_SAS2_CLOCK  
SGPIO_SAS2_LOAD  
GROUND  
A10  
A11  
A12  
A13  
A14  
A15  
A16  
A17  
A18  
B10  
B11  
B12  
B13  
B14  
B15  
B16  
B17  
B18  
PD_SAS2_CONTROLLER_TYPE  
GROUND  
SAS6_TX_C_DP  
SAS6_TX_C_DN  
GROUND  
SAS7_TX_C_DP  
SAS7_TX_C_DN  
GROUND  
GROUND  
GROUND  
GROUND  
GROUND  
MTH1 MTH5  
MTH2 MTH6  
MTH3 MTH7  
MTH4 MTH8  
GROUND  
GROUND  
GROUND  
GROUND  
8.3.3  
Internal Type-A USB Connector  
The server board includes one internal Type-A USB connector labeled “USB 2” and is located near the back  
edge of the board next to the Riser 1 slot. The following table provides the pin-out for this connector.  
Table 44. Internal Type-A USB Connector Pin-out ("USB 2")  
Signal Description Pin#  
P5V_USB_INT  
USB2_P2_F_DN  
USB2_P2_F_DP  
GROUND  
1
2
3
4
8.3.4  
Internal 2mm Low Profile eUSB SSD Connector  
The server board includes one 10-pin 2mm low profile connector with an intended usage of supporting low  
profile eUSB SSD devices. On the server board this connector is labeled “eUSB SSD”. The following table  
provides the pin-out for this connector.  
Table 45. Internal eUSB Connector Pin-out ("eUSB SSD")  
Signal Description Pin# Pin#  
Signal Description  
NOT USED  
P5V  
1
3
5
7
9
2
USB2_P0_DN  
USB2_P0_DP  
GROUND  
NOT USED  
4
6
8
10  
NOT USED  
NOT USED  
NOT USED  
LED_HDD_ACT_N  
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8.4 Fan Connectors  
The server board provides support for six system fans. Each 10-pin connector is monitored and controlled by  
on-board platform management. On the server board, each system fan connector is labeled “SYS_FAN #”,  
where # = 1 thru 6. The following table provides the pin-out for all six system fan connectors.  
Table 46. System Fan Connector Pin-out ("SYS_FAN #")  
SYS_FAN 1  
SYS_FAN 2  
SYS_FAN 3  
Signal Description  
FAN_TACH1_IN  
Pin#  
1
Signal Description  
FAN_TACH3_IN  
Pin#  
1
Signal Description  
FAN_TACH5_IN  
Pin#  
1
FAN_BMC_PWM0_R_BUF  
P12V_FAN  
2
3
FAN_BMC_PWM1_R_BUF  
P12V_FAN  
2
3
FAN_BMC_PWM2_R_BUF  
P12V_FAN  
2
3
P12V_FAN  
4
P12V_FAN  
4
P12V_FAN  
4
FAN_TACH0_IN  
GROUND  
5
6
FAN_TACH2_IN  
GROUND  
5
6
FAN_TACH4_IN  
GROUND  
5
6
GROUND  
7
GROUND  
7
GROUND  
7
FAN_SYS0_PRSNT_N  
LED_FAN_FAULT0_R  
LED_FAN0  
8
9
10  
FAN_SYS1_PRSNT_N  
LED_FAN_FAULT1_R  
LED_FAN1  
8
9
10  
FAN_SYS2_PRSNT_N  
LED_FAN_FAULT2_R  
LED_FAN2  
8
9
10  
SYS_FAN 4  
SYS_FAN 5  
SYS_FAN 6  
Signal Description  
FAN_TACH7_IN  
FAN_BMC_PWM3_R_BUF  
P12V_FAN  
Pin#  
1
2
Signal Description  
FAN_TACH9_IN  
FAN_BMC_PWM4_R_BUF  
P12V_FAN  
Pin#  
1
2
Signal Description  
FAN_TACH11_IN  
FAN_BMC_PWM5_R_BUF  
P12V_FAN  
Pin#  
1
2
3
3
3
P12V_FAN  
4
P12V_FAN  
4
P12V_FAN  
4
FAN_TACH6_IN  
GROUND  
5
6
FAN_TACH8_IN  
GROUND  
5
6
FAN_TACH10_IN  
GROUND  
5
6
GROUND  
7
GROUND  
7
GROUND  
7
FAN_SYS3_PRSNT_N  
LED_FAN_FAULT3_R  
LED_FAN3  
8
9
10  
FAN_SYS4_PRSNT_N  
LED_FAN_FAULT4_R  
LED_FAN4  
8
9
10  
FAN_SYS5_PRSNT_N  
LED_FAN_FAULT5_R  
LED_FAN5  
8
9
10  
8.5 Serial Port Connectors  
The server board includes two serial port connectors.  
Serial-B is an internal 10-pin DH-10 connector labeled “Serial_B” and has the following pin-out.  
Table 47. Serial-B Connector Pin-out  
Signal Description Pin# Pin# Signal Description  
DCD  
SIN  
SOUT  
DTR  
GROUND  
1
3
5
7
9
2
4
6
8
DSR  
RTS  
CTS  
RI  
KEY  
Serial-A is an external RJ45 type connector and has the following pin-out configuration.  
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Figure 35. Serial-A RJ45 connector pin-out  
Table 48. Serial A Connector Pin-out  
Signal Description Pin#  
RTS  
1
DTR  
2
SOUT  
GROUND  
RI  
3
4
5
SIN  
6
DCD or DSR  
CTS  
7**  
8
** Pin 7 of the RJ45 Serial A connector is configurable to support either a DSR (Default) signal or a DCD signal  
by switching jumper locations on the 3-pin jumper block labeled “J3A2” on the server board which is located  
next to the stacked external USB connectors near the back edge of the board.  
Serial-A configuration jumper block setting:  
Signal  
DSR (Default)  
Pins  
1-2  
DCD  
2-3  
Figure 36. Serial A Configuration Jumper Block Location  
8.6 Other Connectors and Headers  
The server board includes a 2-pin chassis intrusion header which can be used when the chassis is configured  
with a chassis intrusion switch. On the server board, this header is labeled “CHAS INTR” and is located on the  
front edge of the server board. The header has the following pin-out.  
Table 49. Chassis Intrusion Header Pin-out ("CHAS_INTR")  
Signal Description  
FP_CHASSIS_INTRUSION  
GROUND  
Pin#  
1
2
The server board includes a 2-pin hard drive activity LED header used with some SAS/SATA controller add-in  
cards. On the server board, this header is labeled “HDD LED” and is located on the left edge of the server  
board. The header has the following pin-out.  
Table 50. Hard Drive Activity Header Pin-out ("HDD_LED")  
Signal Description  
LED_HDD_ACT_N  
TP_LED_HDD_ACT  
Pin#  
1
2
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Intel® Server Board S2600GZ/GL TPS  
9. Reset and Recovery Jumpers  
The server board includes several jumper blocks which are used to as part of a process to restore a board  
function back to a normal functional state. The following diagram and sections identify the location of each  
jumper block and provides a description of their use.  
Figure 37. Reset and Recovery Jumper Block Location  
Note:  
1. For safety purposes, the power cord should be disconnected from a system before removing any  
system components or moving any of the on-board jumper blocks.  
2. Access to jumper blocks B-E is limited, removal of Riser Card #2 may be necessary to move these  
jumpers.  
3. System Update and Recovery files are included in the System Update Packages (SUP) posted to  
Intel’s web site.  
A – Serial Port ‘A’ Configuration Jumper – See section 8.5.  
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B – BIOS Recovery Jumper  
When the BIOS Recovery jumper block is moved from its default pin position, the system will boot into a BIOS  
Recovery Mode. It is used when the system BIOS has become corrupted and is non-functional, requiring a  
new BIOS image to be loaded on to the server board.  
Note: The BIOS Recovery jumper is ONLY used to re-install a BIOS image in the event the BIOS has become  
corrupted. This jumper is NOT used when the BIOS is operating normally and you need to update the BIOS  
from one version to another.  
The following steps demonstrate the BIOS recovery process:  
1. After downloading the latest System Update Package (SUP) from the Intel Web site, copy the following  
files to the root directory of a USB media device:  
IPMI.EFI  
IFlash32.EFI  
RML.ROM  
####REC.CAP (where #### = BIOS revision number)  
STARTUP.NSH  
Note: It may be necessary to edit the STARTUP.NSH file to ensure the ####REC.CAP file is called in  
the shell script.  
2. Power OFF the system.  
3. Locate the BIOS Recovery Jumper on the server board and move the jumper block from pins 1-2  
(default) to pins 2-3 (recovery setting).  
4. Insert the recovery media into a USB port.  
5. Power ON the system.  
6. The system will automatically boot into the embedded EFI Shell.  
7. The STARTUP.NSH file automatically executes and initiates the flash update. When complete, the  
IFlash utility will display a message.  
8. Power OFF the system and return the BIOS Recovery jumper to its default position.  
9. Power ON the system.  
10. Do *NOT* interrupt the BIOS POST during the first boot.  
C – Management Engine (ME) Firmware Force Update Jumper Block  
When the ME Firmware Force Update jumper is moved from its default position, the ME is forced to operate in  
a reduced minimal operating capacity. This jumper should only be used if the ME firmware has gotten  
corrupted and requires re-installation. The following procedure should be followed.  
Note: System Update and Recovery files are included in the System Update Packages (SUP) posted to Intel’s  
web site.  
1. Turn off the system and remove power cords.  
2. Remove Riser Card Assembly #2.  
3. Move the ME FRC UPD Jumper (J6C5) from the default (pins 1 and 2) operating position to the Force  
Update position (pins 2 and 3).  
4. Re-attach system power cords.  
5. Power on the system.  
Note: System Fans will boost and the BIOS Error Manager should report an 83A0 error code (ME in  
recovery mode).  
6. Boot to the EFI shell and update the ME firmware using the “MEComplete.cap” file using the following  
command: iflash32 /u /ni MEComplete.cap  
7. When update has successfully completed, power off system  
8. Remove AC power cords  
9. Move ME FRC UPD jumper back to the default position  
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Note: If the ME FRC UPD jumper is moved with AC power applied, the ME will not operate  
properly. The system will need have the AC power cords removed, wait for at least 10 seconds and  
then reinstalled to ensure proper operation.  
10. Install PCI Riser  
11. Install AC power cords  
12. Power on system  
D – Password Clear Jumper Block  
This jumper causes both the User password and the Administrator password to be cleared if they were set.  
The operator should be aware that this creates a security gap until passwords have been installed again  
through the BIOS Setup utility. This is the only method by which the Administrator and User passwords can be  
cleared unconditionally. Other than this jumper, passwords can only be set or cleared by changing them  
explicitly in BIOS Setup or by similar means. No method of resetting BIOS configuration settings to default  
values will affect either the Administrator or User passwords.  
1. Power down the server and unplug the power cords.  
2. Open the chassis and remove the Riser #2 assembly  
3. Move jumper (J6C6) from the default (pins 1 and 2) operating position to the password clear position  
(pins 2 and 3).  
4. Close the server chassis and reattach the power cords  
5. Power up the server and wait until POST completes.  
6. Power down the server and unplug the power cords.  
7. Open the chassis, remove the Riser #2 assembly, and move the jumper back to the default position  
(covering pins 1 and 2).  
8. Reinstall the Riser #2 assembly  
9. Close the server chassis and reattach the power cords.  
10. Power up the server  
E – BIOS Default Jumper Block  
This jumper resets BIOS Setup options to their default factory settings.  
1. Power down the server and unplug the power cords  
2. Open the chassis and remove the Riser #2 assembly  
3. Move BIOS DFLT jumper (J6D1) from the default (pins 1 and 2) position to the Set BIOS Defaults  
position (pins 2 and 3)  
4. Wait 5 seconds then move the jumper back to the default position of pins 1 and 2  
5. Install riser card assembly  
6. Install Power Cords  
7. Power on system  
F – BMC Force Update Jumper Block  
The BMC Force Update jumper is used to put the BMC in Boot Recovery mode for a low-level update. It  
causes the BMC to abort its normal boot process and stay in the boot loader without executing any Linux code.  
The jumper is normally in the de-asserted position. The system must be completely powered off (A/C power  
removed) before the jumper is moved. After power is re-applied and the firmware update is complete, the  
system must be powered off again and the jumper must be returned to the de-asserted position before normal  
operation can begin.  
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10. Light Guided Diagnostics  
The server board includes several on-board LED indicators to aid troubleshooting various board level faults.  
The following diagram shows the location for each LED.  
Label  
A
B
Description  
System ID  
System Status  
Label  
I
J
Description  
System Fan #3 Fan Fault  
Memory Fault  
C
D
E
F
G
H
POST Code Diagnostics  
12V Stand-by Power Present  
CPU-2 Fault  
System Fan #6 Fan Fault  
System Fan #5 Fan Fault  
System Fan #4 Fan Fault  
K
L
M
N
O
System Fan #2 Fan Fault  
System Fan #1 Fan Fault  
CPU-1 Fault  
CATERR  
System Power Good  
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Figure 38. On-Board Diagnostic LED Placement  
Figure 39. Memory Slot Fault LED Locations  
10.1 System ID LED  
The server board includes a blue system ID LED which is used to visually identify a specific server installed  
among many other similar servers. There are two options available for illuminating the System ID LED.  
1. The front panel ID LED Button is pushed, which causes the LED to illuminate to a solid on state until  
the button is pushed again.  
2. An IPMI “Chassis Identify” command is remotely entered, which causes the LED to blink  
The System ID LED on the server board is tied directly to the System ID LED on system front panel if present.  
10.2 System Status LED  
The server board includes a bi-color System Status LED. The System Status LED on the server board is tied  
directly to the System Status LED on the front panel (if present). This LED indicates the current health of the  
server. Possible LED states include solid green, blinking green, blinking amber, and solid amber.  
When the server is powered down (transitions to the DC-off state or S5), the BMC is still on standby power and  
retains the sensor and front panel status LED state established before the power-down event.  
When AC power is first applied to the system, the status LED turns solid amber and then immediately changes  
to blinking green to indicate that the BMC is booting. If the BMC boot process completes with no errors, the  
status LED will change to solid green.  
Table 51. SystemStatus LED State Definitions  
Color  
Off  
State  
System is  
Criticality  
Not ready  
Description  
1. System is powered off (AC and/or DC).  
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Description  
Color  
State  
Criticality  
not  
2. System is in EuP Lot6 Off Mode.  
operating  
3. System is in S5 Soft-Off State.  
4. System is in S4 Hibernate Sleep State.  
Green  
Green  
Solid on  
Ok  
Indicates that the System is running (in S0 State) and its status is ‘Healthy’.  
The system is not exhibiting any errors. AC power is present and BMC has  
booted and manageability functionality is up and running.  
~1 Hz blink  
Degraded - system System degraded:  
is operating in a  
degraded state  
although still  
functional, or  
system is  
operating in  
a redundant state  
but with an  
Redundancy loss, such as power-supply or fan. Applies only if the  
associated platform sub-system has redundancy capabilities.  
Fan warning or failure when the number of fully operational fans is more  
than minimum number needed to cool the system.  
Non-critical threshold crossed – Temperature (including HSBP temp),  
voltage, input power to power supply, output current for main power rail  
from power supply and Processor Thermal Control (Therm Ctrl) sensors.  
Power supply predictive failure occurred while redundant power supply  
configuration was present.  
impending failure  
warning  
Unable to use all of the installed memory (one or more DIMMs  
failed/disabled but functional memory remains available)  
Correctable Errors over a threshold and migrating to a spare DIMM  
(memory sparing). This indicates that the user no longer has spared DIMMs  
indicating a redundancy lost condition. Corresponding DIMM LED lit.  
Uncorrectable memory error has occurred in memory Mirroring Mode,  
causing Loss of Redundancy.  
Correctable memory error threshold has been reached for a failing DDR3  
DIMM when the system is operating in fully redundant RAS Mirroring Mode.  
BMC executing in uBoot. (Indicated by Chassis ID blinking at Blinking at  
3Hz). System in degraded state (no manageability). BMC uBoot is running  
but has not transferred control to BMC Linux. Server will be in this state 6-8  
seconds after BMC reset while it pulls the Linux image into flash  
BMC booting Linux. (Indicated by Chassis ID solid ON). System in  
degraded state (no manageability). Control has been passed from BMC  
uBoot to BMC Linux itself. It will be in this state for ~10-~20 seconds.  
BMC Watchdog has reset the BMC.  
Power Unit sensor offset for configuration error is asserted.  
HDD HSC is off-line or degraded.  
Amber  
~1 Hz blink  
Non-critical -  
System is  
operating in a  
degraded state  
Non-fatal alarm – system is likely to fail:  
Critical threshold crossed – Voltage, temperature (including HSBP temp),  
input power to power supply, output current for main power rail from power  
supply and PROCHOT (Therm Ctrl) sensors.  
with an impending VRD Hot asserted.  
failure warning,  
although still  
functioning  
Minimum number of fans to cool the system not present or failed  
Hard drive fault  
Power Unit Redundancy sensor – Insufficient resources offset (indicates not  
enough power supplies present)  
In non-sparing and non-mirroring mode if the threshold of correctable errors  
is crossed within the window  
Correctable memory error threshold has been reached for a failing DDR3  
DIMM when the system is operating in a non-redundant mode  
Fatal alarm – system has failed or shutdown:  
CPU CATERR signal asserted  
MSID mismatch detected (CATERR also asserts for this case).  
CPU 1 is missing  
Amber  
Solid on  
Critical, non-  
recoverable –  
System is halted  
CPU Thermal Trip  
No power good – power fault  
DIMM failure when there is only 1 DIMM present and hence no good  
memory present.  
Runtime memory uncorrectable error in non-redundant mode.  
DIMM Thermal Trip or equivalent  
SSB Thermal Trip or equivalent  
CPU ERR2 signal asserted  
BMC\Video memory test failed. (Chassis ID shows blue/solid-on for this  
condition)  
Both uBoot BMC FW images are bad. (Chassis ID shows blue/solid-on for  
this condition)  
240VA fault  
Fatal Error in processor initialization:  
Processor family not identical  
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Description  
Criticality  
Processor model not identical  
Processor core/thread counts not identical  
Processor cache size not identical  
Unable to synchronize processor frequency  
Unable to synchronize QPI link frequency  
10.3 BMC Boot/Reset Status LED Indicators  
During the BMC boot or BMC reset process, the System Status LED and System ID LED are used to indicate  
BMC boot process transitions and states. A BMC boot will occur when AC power is first applied to the system.  
A BMC reset will occur after: a BMC FW update, upon receiving a BMC cold reset command, and upon a BMC  
watchdog initiated reset. The following table defines the LED states during the BMC Boot/Reset process.  
Table 52. BMC Boot/Reset Status LED Indicators  
Chassis ID  
Status LED  
BMC Boot/Reset State  
LED  
Solid  
Blue  
Solid  
Blue  
Comment  
Solid  
Amber  
Solid  
Nonrecoverable condition. Contact your Intel® representative for  
information on replacing this motherboard.  
BMC/Video memory test failed  
Both Universal Bootloader (u-Boot)  
images bad  
Nonrecoverable condition. Contact your Intel® representative for  
information on replacing this motherboard.  
Amber  
Blinking green indicates degraded state (no manageability), blinking  
blue indicates u-Boot is running but has not transferred control to  
BMC Linux. Server will be in this state 6-8 seconds after BMC reset  
while it pulls the Linux image into flash.  
Blink  
Green  
1Hz  
Blink  
Blue 3Hz  
BMC in u-Boot  
Solid green with solid blue after an AC cycle/BMC reset, indicates that  
the control has been passed from u-Boot to BMC Linux itself. It will be  
in this state for ~10-~20 seconds.  
Solid  
Blue  
Solid  
Green  
BMC Booting Linux  
End of BMC boot/reset process.  
Normal system operation  
Solid  
Green  
Indicates BMC Linux has booted and manageability functionality is up  
and running. Fault/Status LEDs operate as per usual.  
Off  
10.4 Post Code Diagnostic LEDs  
A bank of eight POST code diagnostic LEDs are located on the back edge of the server next to the stacked  
USB connectors. During the system boot process, the BIOS executes a number of platform configuration  
processes, each of which is assigned a specific hex POST code number. As each configuration routine is  
started, the BIOS displays the given POST code to the POST code diagnostic LEDs. The purpose of these  
LEDs is to assist in troubleshooting a system hang condition during the POST process. The diagnostic LEDs  
can be used to identify the last POST process to be executed. See Appendix D for a complete description of  
how these LEDs are read, and for a list of all supported POST codes  
10.5 12 Volt Stand-By Present LED  
This LED is illuminated when a power cord (AC or DC) is connected to the server and the power supply is  
supplying 12 Volt Stand-by power to the server board. This LED is intended as a service caution indicator to  
anyone accessing the inside of the server system.  
10.6 Fan Fault LEDs  
The server board includes a Fan Fault LED next to each of the six system fans and both CPU fans. The LED  
has two states: On and Off. The BMC lights a fan fault LED if the associated fan-tach sensor has a lower  
critical threshold event status asserted. Fan-tach sensors are manual re-arm sensors. Once the lower critical  
threshold is crossed, the LED remains lit until the sensor is rearmed. These sensors are rearmed at system DC  
power-on and system reset.  
10.7 Memory Fault LEDs  
The server board includes a Memory Fault LED for each DIMM slot. When the BIOS detects a memory fault  
condition, it sends an IPMI OEM command (Set Fault Indication) to the BMC to instruct the BMC to turn on the  
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associated Memory Slot Fault LED. These LEDs are only active when the system is in the ‘on’ state. The BMC  
will not activate or change the state of the LEDs unless instructed by the BIOS.  
10.8 CPU Fault LEDs  
The server board includes a CPU fault LED for each CPU socket. The CPU Fault LED is lit if there is an MSID  
mismatch error is detected (that is, CPU power rating is incompatible with the board).  
10.9 System Power Good LED  
The Power Good LED is illuminated when system power is turned on and DC power to the server board is  
within acceptable limits.  
10.10 CATERR LED  
For processors that support the Intel® Quick Path Interconnect interface, the CATERR# signal is used to  
indicate that a catastrophic error condition has been experienced by the processor. Should such an error  
occur, the CATERR LED on the server board will illuminate.  
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Power Supply Specification Guidelines  
Intel® Server Board S2600GZ/GL TPS  
11. Power Supply Specification Guidelines  
This section provides power supply specification guidelines recommended for providing the specified server  
platform with stable operating power requirements.  
Note: The power supply data provided in this section is for reference purposes only. It reflects Intel’s own DC  
power out requirements for a 750W power supply as used in an Intel designed 2U server platform. The intent  
of this section is to provide customers with a guide to assist in defining and/or selecting a power supply for  
custom server platform designs that utilize the server boards detailed in this document.  
11.1 Power Supply DC Output Connector  
The server board includes two main power slot connectors allowing for power supplies to attach directly to the  
server board. Power supplies must utilize a card edge output connection for power and signal that is  
compatible with a 2x25 Power Card Edge connector (equivalent to 2x25 pin configuration of the FCI power  
card connector 10035388-102LF).  
Table 53. Power Supply DC Power Output Connector Pinout  
Pin  
Name  
Pin  
Name  
A1  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
B1  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
A2  
A3  
A4  
A5  
A6  
A7  
A8  
A9  
B2  
B3  
B4  
B5  
B6  
B7  
B8  
B9  
A10 +12V  
A11 +12V  
A12 +12V  
A13 +12V  
A14 +12V  
A15 +12V  
A16 +12V  
A17 +12V  
A18 +12V  
B10 +12V  
B11 +12V  
B12 +12V  
B13 +12V  
B14 +12V  
B15 +12V  
B16 +12V  
B17 +12V  
B18 +12V  
A19 PMBus SDA  
A20 PMBus SCL  
A21 PSON  
B19 A0 (SMBus address)  
B20 A1 (SMBus address)  
B21 12V stby  
A22 SMBAlert#  
A23 Return Sense  
B22 Cold Redundancy Bus  
B23 12V load share bus  
A24 +12V remote Sense B24 No Connect  
A25 PWOK B25 Compatibility Check pin*  
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Power Supply Specification Guidelines  
11.2 Power Supply DC Output Specification  
11.2.1  
Output Power/Currents  
The following tables define the minimum power and current ratings. The power supply must meet both static  
and dynamic voltage regulation requirements for all conditions.  
Table 54. Minimum Load Ratings  
Parameter Min Max. Peak 2, 3 Unit  
12V main 0.0 62.0 70.0  
A
12Vstby 1  
0.0 2.1 2.4  
A
Notes:  
1. 12Vstby must provide 4.0A with two power supplies in parallel. The Fan may start to work when stby current >1.5A  
2. Peak combined power for all outputs shall not exceed 850W.  
3. Length of time peak power can be supported is based on thermal sensor and assertion of the SMBAlert# signal. Minimum  
peak power duration shall be 20 seconds without asserting the SMBAlert# signal at maximum operating temperature.  
11.2.2  
Standby Output  
The 12VSB output shall be present when an AC input greater than the power supply turn on voltage is applied.  
There should be load sharing in the standby rail. Two PSU modules should be able to support 4A standby  
current.  
11.2.3  
Voltage Regulation  
The power supply output voltages must stay within the following voltage limits when operating at steady state  
and dynamic loading conditions. These limits include the peak-peak ripple/noise. These shall be measured at  
the output connectors.  
Table 55. Voltage Regulation Limits  
PARAMETER TOLERANCE  
MIN  
NOM  
MAX  
UNITS  
+12V  
- 5%/+5%  
+11.40 +12.00 +12.60 Vrms  
+12V stby  
- 5%/+5%  
+11.40 +12.00 +12.60 Vrms  
11.2.4  
Dynamic Loading  
The output voltages shall remain within limits specified for the step loading and capacitive loading specified in  
the table below. The load transient repetition rate shall be tested between 50Hz and 5kHz at duty cycles  
ranging from 10%-90%. The load transient repetition rate is only a test specification. The step load may  
occur anywhere within the MIN load to the MAX load conditions.  
Table 56. Transient Load Requirements  
Output  
+12VSB 1.0A  
+12V 60% of max load 0.25 A/µsec  
Step Load Size  
Load Slew Rate Test capacitive Load  
0.25 A/µsec  
20 µF  
2000 µF  
Note: For dynamic condition +12V min loading is 1A.  
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11.2.5  
Capacitive Loading  
The power supply shall be stable and meet all requirements with the following capacitive loading ranges.  
Table 57. Capacitive Loading Conditions  
Output  
+12VSB 20  
+12V  
MIN  
MAX  
3100  
Units  
µF  
500 25000 µF  
11.2.6  
Grounding  
The output ground of the pins of the power supply provides the output power return path. The output  
connector ground pins shall be connected to the safety ground (power supply enclosure). This grounding  
should be well designed to ensure passing the max allowed Common Mode Noise levels.  
The power supply shall be provided with a reliable protective earth ground. All secondary circuits shall be  
connected to protective earth ground. Resistance of the ground returns to chassis shall not exceed 1.0 m.  
This path may be used to carry DC current.  
11.2.7  
Closed loop stability  
The power supply shall be unconditionally stable under all line/load/transient load conditions including specified  
capacitive load ranges. A minimum of: 45 degrees phase margin and -10dB-gain margin is required.  
Closed-loop stability must be ensured at the maximum and minimum loads as applicable.  
11.2.8  
Residual Voltage Immunity in Standby mode  
The power supply should be immune to any residual voltage placed on its outputs (Typically a leakage voltage  
through the system from standby output) up to 500mV. There shall be no additional heat generated, nor  
stressing of any internal components with this voltage applied to any individual or all outputs simultaneously. It  
also should not trip the protection circuits during turn on.  
The residual voltage at the power supply outputs for no load condition shall not exceed 100mV when AC  
voltage is applied and the PSON# signal is de-asserted.  
11.2.9  
Common Mode Noise  
The Common Mode noise on any output shall not exceed 350mV pk-pk over the frequency band of 10Hz to  
20MHz.  
11.2.10 Soft Starting  
The Power Supply shall contain control circuit which provides monotonic soft start for its outputs without  
overstress of the AC line or any power supply components at any specified AC line or load conditions.  
11.2.11 Zero Load Stability Requirements  
When the power subsystem operates in a no load condition, it does not need to meet the output regulation  
specification, but it must operate without any tripping of over-voltage or other fault circuitry. When the power  
subsystem is subsequently loaded, it must begin to regulate and source current without fault.  
11.2.12 Hot Swap Requirements  
Hot swapping a power supply is the process of inserting and extracting a power supply from an operating  
power system. During this process the output voltages shall remain within the limits with the capacitive load  
specified. The hot swap test must be conducted when the system is operating under static, dynamic, and zero  
loading conditions.  
11.2.13 Forced Load Sharing  
The +12V output will have active load sharing. The output will share within 10% at full load. The failure of a  
power supply should not affect the load sharing or output voltages of the other supplies still operating. The  
supplies must be able to load share in parallel and operate in a hot-swap/redundant 1+1 configurations. The  
12VSBoutput is not required to actively share current between power supplies (passive sharing). The  
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12VSBoutput of the power supplies are connected together in the system so that a failure or hot swap of a  
redundant power supply does not cause these outputs to go out of regulation in the system.  
11.2.14 Ripple/Noise  
The maximum allowed ripple/noise output of the power supply is defined in the following table. This is  
measured over a bandwidth of 10Hz to 20MHz at the power supply output connectors. A 10µF tantalum  
capacitor in parallel with a 0.1µF ceramic capacitor is placed at the point of measurement.  
Table 58. Ripples and Noise  
+12V main  
+12VSB  
120mVp-p  
120mVp-p  
11.2.15 Timing Requirements  
These are the timing requirements for the power supply operation. The output voltages must rise from 10% to  
within regulation limits (Tvout_rise) within 5 to 70ms. For 12VSB, it is allowed to rise from 1.0 to 25ms. All  
outputs must rise monotonically. The following table shows the timing requirements for the power supply  
being turned on and off from the AC input, with PSON held low and the PSON signal, with the AC input applied.  
Table 59. Timing Requirements  
Item  
Tvout_rise  
Description  
Output voltage rise time  
MIN  
MAX  
UNITS  
5.0 *  
70 *  
ms  
ms  
Delay from AC being applied to 12VSBbeing  
within regulation.  
Delay from AC being applied to all output voltages  
being within regulation.  
Time 12Vl output voltage stay within regulation  
after loss of AC.  
Delay from loss of AC to de-assertion of PWOK  
1500  
Tsb_on_delay  
T ac_on_delay  
Tvout_holdup  
Tpwok_holdup  
3000  
ms  
ms  
13  
12  
5
ms  
ms  
Delay from PSON# active to output voltages  
within regulation limits.  
400  
Tpson_on_del  
ay  
Delay from PSON# deactivate to PWOK being de-  
asserted.  
Delay from output voltages within regulation limits  
to PWOK asserted at turn on.  
5
ms  
ms  
T pson_pwok  
Tpwok_on  
100  
1
500  
T pwok_off  
Tpwok_low  
Delay from PWOK de-asserted to output voltages  
dropping out of regulation limits.  
ms  
ms  
Duration of PWOK being in the de-asserted state  
during an off/on cycle using AC or the PSON  
signal.  
100  
Tsb_vout  
Delay from 12VSBbeing in regulation to O/Ps  
being in regulation at AC turn on.  
50  
70  
1000  
ms  
ms  
T12VSB_holdu Time the 12VSBoutput voltage stays within  
regulation after loss of AC.  
p
* The 12VSBoutput voltage rise time shall be from 1.0ms to 25ms  
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AC Input  
Tvout_holdup  
Vout  
Tpwok_low  
Tsb_on_delay  
TAC_on_delay  
Tpwok_off  
Tpwok_on  
Tsb_on_delay  
PWOK  
Tpwok_off  
Tpwok_on  
Tpwok_holdup  
Tpson_pwok  
12Vsb  
PSON  
Tsb_vout  
T5Vsb  
_
holdup  
Tpson_on_delay  
AC turn on/off cycle  
PSON turn on/off cycle  
Figure 40. Turn On/Off Timing (Power Supply Signals)  
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BIOS Setup Utility  
12. BIOS Setup Utility  
The BIOS Setup utility is a text-based utility that allows the user to configure the system and view current  
settings and environment information for the platform devices. The Setup utility controls the platform's built-in  
devices, the boot manager, and error manager.  
The BIOS Setup interface consists of a number of pages or screens. Each page contains information or links to  
other pages. The advanced tab in Setup displays a list of general categories as links. These links lead to  
pages containing a specific category’s configuration.  
The following sections describe the look and behavior for the platform setup utility.  
12.1 BIOS Setup Operation  
The BIOS Setup Utility has the following features:  
.
.
Localization – The Intel® Server Board BIOS is only available in English. However, BIOS Setup uses  
the Unicode standard and is capable of displaying data and input in Setup fields in all languages  
currently included in the Unicode standard.  
Console Redirection – BIOS Setup is functional from Console Redirection over various terminal  
emulation standards. When Console Redirection is enabled, the POST display out is in purely Text  
Mode due to Redirection data transfer in a serial port data terminal emulation mode. This may limit  
some functionality for compatibility, for example, usage of colors or some keys or key sequences or  
support of pointing devices.  
.
.
Setup screens are designed to be displayable in an 80-character x 24-line format in order to work with  
Console Redirection, although that screen layout should display correctly on any format with longer  
lines or more lines on the screen.  
Password protection – BIOS Setup may be protected from unauthorized changes by setting an  
Administrative Password in the Security screen. When an Administrative Password has been set, all  
selection and data entry fields in Setup (except System Time and Date) are grayed out and cannot be  
changed unless the Administrative Password has been entered.  
o
Note: If an Administrative Password has not been set, anyone who boots the system to Setup  
has access to all selection and data entry fields in Setup and can change any of them.  
12.1.1  
Entering BIOS Setup  
To enter the BIOS Setup using a keyboard (or emulated keyboard), press the <F2> function key during boot  
time when the OEM or Intel Logo Screen or the POST Diagnostic Screen is displayed.  
The following message is displayed on the Diagnostic Screen or under the Quiet Boot Logo Screen:  
Press <F2> to enter setup, <F6> Boot Menu, <F12> Network Boot  
Note: With a USB keyboard, it is important to wait until the BIOS “discovers” the keyboard and beeps – until  
the USB Controller has been initialized and the USB keyboard activated.  
When the Setup Utility is entered, the Main screen is displayed initially. However, serious errors cause the  
system to display the Error Manager screen instead of the Main screen.  
It is also possible to cause a boot directly to Setup using an IPMI 2.0 command “Get/Set System Boot Options”.  
For details on that capability, see the explanation in the IPMI description.  
12.1.2  
Setup Navigation Keyboard Commands  
The bottom right portion of the Setup screen provides a list of commands that are used to navigate through the  
Setup utility. These commands are displayed at all times.  
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Each Setup menu page contains a number of features. Each feature is associated with a value field, except  
those used for informative purposes. Each value field contains configurable parameters. Depending on the  
security option chosen and in effect by the password, a menu feature’s value may or may not be changed. If a  
value cannot be changed, its field is made inaccessible and appears grayed out.  
Table 60. BIOS Setup: Keyboard Command Bar  
Key  
<Enter>  
Option  
Execute  
Command  
Description  
The <Enter> key is used to activate submenus when the selected feature is a  
submenu, or to display a pick list if a selected option has a value field, or to select a  
subfield for multi-valued features like time and date. If a pick list is displayed, the  
<Enter> key selects the currently highlighted item, undoes the pick list, and returns  
the focus to the parent menu.  
<Esc>  
Exit  
The <Esc> key provides a mechanism for backing out of any field. When the <Esc>  
key is pressed while editing any field or selecting features of a menu, the parent  
menu is re-entered.  
When the <Esc> key is pressed in any submenu, the parent menu is re-entered.  
When the <Esc> key is pressed in any major menu, the exit confirmation window is  
displayed and the user is asked whether changes can be discarded. If “No” is  
selected and the <Enter> key is pressed, or if the <Esc> key is pressed, the user is  
returned to where they were before <Esc> was pressed, without affecting any  
existing settings. If “Yes” is selected and the <Enter> key is pressed, the setup is  
exited and the BIOS returns to the main System Options Menu screen.  
Select Item  
Select Item  
The up arrow is used to select the previous value in a pick list, or the previous  
option in a menu item's option list. The selected item must then be activated by  
pressing the <Enter> key.  
The down arrow is used to select the next value in a menu item’s option list, or a  
value field’s pick list. The selected item must then be activated by pressing the  
<Enter> key.  
Select Menu  
Select Field  
Change Value  
The left and right arrow keys are used to move between the major menu pages.  
The keys have no effect if a sub-menu or pick list is displayed.  
<Tab>  
-
The <Tab> key is used to move between fields. For example, <Tab> can be used  
to move from hours to minutes in the time item in the main menu.  
The minus key on the keypad is used to change the value of the current item to the  
previous value. This key scrolls through the values in the associated pick list  
without displaying the full list.  
+
Change Value  
Setup Defaults  
The plus key on the keypad is used to change the value of the current menu item  
to the next value. This key scrolls through the values in the associated pick list  
without displaying the full list. On 106-key Japanese keyboards, the plus key has a  
different scan code than the plus key on the other keyboards, but will have the  
same effect.  
<F9>  
Pressing the <F9> key causes the following to display:  
Load Optimized Defaults?  
Yes No  
If “Yes” is highlighted and <Enter> is pressed, all Setup fields are set to their  
default values. If “No” is highlighted and <Enter> is pressed, or if the <Esc> key is  
pressed, the user is returned to where they were before <F9> was pressed without  
affecting any existing field values.  
<F10>  
Save and Exit  
Pressing the <F10> key causes the following message to display:  
Save configuration and reset?  
Yes  
No  
If “Yes” is highlighted and <Enter> is pressed, all changes are saved and the Setup  
is exited. If “No” is highlighted and <Enter> is pressed, or the <Esc> key is  
pressed, the user is returned to where they were before <F10> was pressed  
without affecting any existing values.  
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12.2 BIOS Setup Utility Screens  
The following sections describe the screens available in the BIOS Setup utility for the configuration of the  
server platform.  
For each of these screens, there is an image of the screen with a list of Field Descriptions which describe the  
contents of each item on the screen. Each item on the screen is hyperlinked to the relevant Field Description.  
Each Field Description is hyperlinked back to the screen image.  
There are a number of screens in the entire Setup collection. They are organized into major categories. Each  
category has a hierarchy beginning with a top-level screen from which lower-level screens may be selected.  
Each top-level screen appears as a tab, arranged across the top of the Setup screen image of all top-level  
screens.  
There are more categories than will fit across the top of the screen, so at any given time there will be some  
categories which will not appear until the user has scrolled across the tabs which are present.  
The categories and the screens included in each category are listed below, with links to each of the screens  
named.  
12.2.1  
Main Screen (Tab)  
The Main Screen is the first screen that appears when the BIOS Setup configuration utility is entered, unless  
an error has occurred. If an error has occurred, the Error Manager Screen appears instead.  
Main  
Advanced  
Security  
Server Management  
Administrator/User  
Boot Options  
Boot Manager  
Logged in as:  
Platform ID  
<Platform Identification String>  
System BIOS  
BIOS Version  
Build Date  
<Platform.86B.xx.yy.zzzz>  
<MM/DD/YYYY>  
Memory  
Total Memory  
<Amount of memory installed>  
Quiet Boot  
Enabled/Disabled  
Enabled/Disabled  
POST Error Pause  
System Date  
System Time  
[Day MM/DD/YYYY]  
[HH:MM:SS]  
Figure 41. Main Screen  
Screen Field Descriptions:  
Logged in as:  
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Option Values:  
<Administrator/User>  
<None>  
Information only. Displays password level that setup is running in: Administrator  
Help Text:  
Comments:  
or User. With no passwords set, Administrator is the default mode.  
Back to [Main Screen]  
Platform ID  
Option Values:  
< Platform ID>  
<None>  
Information only. Displays the Platform ID (Board ID) for the board on which the  
Help Text:  
Comments:  
BIOS is executing POST.  
The Platform ID is limited to 8 characters, because it is also used in the ACPI Tables which have that  
limitation. In some cases, this means that the Platform ID is abbreviated from the marketing designation  
(for example, MFS2600KI is abbreviated to S2600KI).  
Back to [Main Screen]  
BIOS Version  
Option Values:  
<Current BIOS version ID>  
<None>  
Information only. The BIOS version displayed uniquely identifies the BIOS that is  
Help Text:  
Comments:  
currently installed and operational on the board. The version information displayed is taken from the  
BIOS ID String, with the timestamp segment dropped off. The segments displayed are:  
Platform:  
86B:  
xx:  
Identifies that this is the correct platform BIOS  
Identifies this BIOS as being an EPSD Server BIOS  
Major Revision level of the BIOS  
yy:  
zzzz:  
Release Revision level for this BIOS  
Release Number for this BIOS  
Back to [Main Screen]  
Build Date  
Option Values:  
Help Text:  
<Date and time when the currently installed BIOS was created (built)>  
<None>  
Comments:  
Information only. The time and date displayed are taken from the timestamp  
segment of the BIOS ID String.  
Back to [Main Screen]  
Total Memory  
Option Values:  
Help Text:  
<Amount of memory installed in the system>  
<None>  
Information only. Displays the total physical memory installed in the system, in  
Comments:  
MB or GB. The term physical memory indicates the total memory discovered in the form of installed  
DDR3 DIMMs.  
Back to [Main Screen]  
Quiet Boot  
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Option Values:  
Enabled  
Disabled  
Help Text:  
[Enabled] – Display the logo screen during POST.  
[Disabled] – Display the diagnostic screen during POST.  
Comments:  
This field controls whether the full diagnostic information is displayed on the  
screen during POST. When Console Redirection is enabled, the Quiet Boot setting is disregarded and  
the text mode Diagnostic Screen is displayed unconditionally.  
Back to [Main Screen]  
POST Error Pause  
Option Values:  
Help Text:  
Enabled  
Disabled  
[Enabled] – Go to the Error Manager for critical POST errors.  
[Disabled] – Attempt to boot and do not go to the Error Manager for critical POST errors.  
Comments:  
If enabled, the POST Error Pause option takes the system to the error manager  
to review the errors when major errors occur. Minor and fatal error displays are not affected by this  
setting.  
Back to [Main Screen]  
System Date  
Option Values:  
<System Date initially displays the current system calendar date,  
including the day of the week>  
Help Text:  
System Date has configurable fields for the current Month, Day, and Year.  
The year must be between 2005 and 2099.  
Use [Enter] or [Tab] key to select the next field.  
Use [+] or [-] key to modify the selected field.  
Comments:  
This field will initially display the current system day of week and date. It may be  
edited to change the system date. When the System Date is reset by the “BIOS Defaults” jumper, BIOS  
Recovery Flash Update, or other method, the date will be the earliest date in the allowed range –  
Saturday 01/01/2005.  
Back to [Main Screen]  
System Time  
Option Values:  
<System Time initially displays the current system time of day, in 24-hour  
format>  
Help Text:  
System Time has configurable fields for Hours, Minutes, and Seconds.  
Hours are in 24-hour format.  
Use the [Enter] or [Tab] key to select the next field.  
Use the [+] or [-] key to modify the selected field.  
Comments:  
This field will initially display the current system time (24 hour time). It may be  
edited to change the system time. When the System Time is reset by the “BIOS Defaults” jumper, BIOS  
Recovery Flash Update, or other method, the time will be the earliest time of day in the allowed range –  
00:00:00 (although the time will updated beginning from when it is reset early in POST).  
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Back to [Main Screen]  
Advanced Screen (Tab)  
12.2.2  
The Advanced screen provides an access point to configure several groups of options. On this screen, the  
user can select the option group to be configured. Configuration actions are performed on the selected screen,  
and not directly on the Advanced screen.  
This screen is the same for all board series, selecting between the same groups of options, although the  
options for different boards are not necessarily identical.  
To access this screen from the Main screen or other top-level “Tab” screen, press the right or left arrow keys to  
traverse the tabs at the top of the Setup screen until the Advanced screen is selected.  
Main  
Advanced  
Security  
Server Management  
Boot Options  
Boot Manager  
Processor Configuration  
Power & Performance  
Memory Configuration  
Mass Storage Controller Configuration  
PCI Configuration  
Serial Port Configuration  
USB Configuration  
System Acoustic and Performance Configuration  
Figure 42. Advanced Screen  
Screen Field Descriptions:  
Processor Configuration  
Option Values:  
Help Text:  
<None>  
View/Configure processor information and settings.  
Selection only. Position to this line and press the <Enter> key to go to the  
Comments:  
Processor Configuration group of configuration settings.  
Back to [Advanced Screen]  
1. Power & Performance  
Option Values:  
<None>  
Help Text:  
View/Configure processor information and settings.  
Comments:  
Selection only. Position to this line and press the <Enter> key to go to the Power  
& Performance group of configuration settings.  
Back to [Advanced Screen]  
Memory Configuration  
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Option Values:  
Help Text:  
<None>  
View/Configure memory information and settings.  
Comments: Selection only. Position to this line and press the <Enter> key to go to the  
Memory Configuration group of configuration settings.  
Back to [Advanced Screen]  
Mass Storage Controller Configuration  
Option Values:  
Help Text:  
<None>  
View/Configure mass storage controller information and settings.  
Comments: Selection only. Position to this line and press the <Enter> key to go to the Mass  
Storage Controller Configuration group of configuration settings.  
Back to [Advanced Screen]  
PCI Configuration  
Option Values:  
Help Text:  
<None>  
View/Configure PCI information and settings.  
Comments: Selection only. Position to this line and press the <Enter> key to go to the PCI  
Configuration group of configuration settings.  
Back to [Advanced Screen]  
Serial Port Configuration  
Option Values:  
Help Text:  
View/Configure serial port information and settings.  
Comments: Selection only. Position to this line and press the <Enter> key to go to the Serial  
<None>  
Port Configuration group of configuration settings.  
Back to [Advanced Screen]  
USB Configuration  
Option Values:  
Help Text:  
View/Configure USB information and settings.  
Comments: Selection only. Position to this line and press the <Enter> key to go to the USB  
<None>  
Configuration group of configuration settings.  
Back to [Advanced Screen]  
System Acoustic and Performance Configuration  
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Option Values:  
Help Text:  
View/Configure system acoustic and performance information and settings.  
<None>  
Comments:  
Selection only. Position to this line and press the <Enter> key to go to the  
System Acoustic and Performance Configuration group of configuration settings.  
Back to [Advanced Screen]  
12.2.2.1  
Processor Configuration  
The Processor Configuration screen displays the processor identification and microcode level, core frequency,  
cache sizes, Intel® QuickPath Interconnect (QPI) information for all processors currently installed. It also allows  
the user to enable or disable a number of processor options.  
To access this screen from the Main screen, select Advanced > Processor Configuration. To move to  
another screen, press the <Esc> key to return to the Advanced screen, then select the desired screen.  
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Advanced  
Processor Configuration  
Processor Socket  
Processor ID  
CPU 1  
<CPUID>* |  
CPU 2  
<CPUID>  
Processor Frequency  
Microcode Revision  
L1 Cache RAM  
<Proc Freq> |  
<Rev data> |  
<L1 Cache Size> | <L1 Cache Size>  
<L2 Cache Size> | <L2 Cache Size>  
<L3 Cache Size> | <L3 Cache Size>  
<ID string from Processor 1>  
<Proc Freq>  
<Rev data>  
L2 Cache RAM  
L3 Cache RAM  
Processor 1 Version  
Processor 2 Version  
<ID string from Processor 2>  
Current Intel® QPI Link Speed  
Intel® QPI Link Frequency  
Intel® QPI Frequency Select  
Intel® Turbo Boost Technology  
Enhanced Intel SpeedStep(R) Tech  
Processor C3  
Slow/Fast  
N/A/6.4 GT/s/7.2 GT/s/8.0 GT/s/Unknown GT/s  
Auto Max/6.4 GT/s/7.2 GT/s/8.0 GT/s  
Enabled/Disabled  
Enabled/Disabled  
Enabled/Disabled  
Processor C6  
Enabled/Disabled  
Intel® Hyper-Threading Tech  
Active Processor Cores  
Execute Disable Bit  
Enabled/Disabled  
All/1/2/3/4/5/6/7  
Enabled/Disabled  
Intel® Virtualization Technology  
Intel® VT for Directed I/O  
Interrupt Remapping  
Coherency Support  
Enabled/Disabled  
Enabled/Disabled  
Enabled/Disabled  
Enabled/Disabled  
ATS Support  
Enabled/Disabled  
Pass-through DMA Support  
Intel® TXT  
Enabled/Disabled  
Enabled/Disabled  
Enhanced Error Containment Mode  
MLC Streamer  
Enabled/Disabled  
Enabled/Disabled  
MLC Spatial Prefetcher  
DCU Data Prefetcher  
Direct Cache Access (DCA)  
Extended ATR  
Enabled/Disabled  
Enabled/Disabled  
Enabled/Disabled  
0x03/0x01  
PFloor Tuning  
SMM Wait Timeout  
[Maximum Non-Turbo Frequency minus 3 – 12,12 is default]  
[20 – 3000ms, 20 is default]  
Figure 43. Processor Configuration Screen  
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Screen Field Descriptions:  
Processor ID  
Option Values:  
Help Text:  
<CPUID>  
<None>  
Information only. Displays the Processor Signature value (from the CPUID  
Comments:  
instruction) identifying the type of processor and the stepping.  
For multi-socket boards, the processor selected as the Bootstrap Processor (BSP) has an asterisk (“*”)  
displayed beside the Processor ID. “N/A” will be displayed for a processor if not installed.  
S1400 or S1600 series boards have a single Processor ID display  
S2400 or S2600 series boards have 2 Processor ID displays, regardless of whether the second CPU  
socket has a processor installed. If the socket does not have a processor installed, “N/A” will displayed  
for the processor data.  
S4600 series boards have 4 Processor ID displays, regardless of whether the 2nd through 4th CPU  
sockets have a processor installed. For empty CPU sockets, “N/A” will be displayed for processor data.  
Back to [Processor Configuration Screen] [Advanced Screen]  
Processor Frequency  
Option Values:  
<Current Processor Operating Frequency>  
<None>  
Information only. Displays current operating frequency of the processor.  
Help Text:  
Comments:  
Single socket boards have a single processor display, 2 socket or 4 socket. boards have a display  
column for each socket, showing “N/A” for empty sockets where processors are not installed.  
Back to [Processor Configuration Screen] [Advanced Screen]  
Microcode Revision  
Option Values:  
<Microcode Revision Number>  
<None>  
Information only. Displays Revision Level of the currently loaded processor  
Help Text:  
Comments:  
microcode.  
Single socket boards have a single processor display, 2 socket or 4 socket. boards have a display  
column for each socket, showing “N/A” for empty sockets where processors are not installed.  
Back to [Processor Configuration Screen] [Advanced Screen]  
L1 Cache RAM  
Option Values:  
<L1 cache size>  
<None>  
Information only. Displays size in KB of the processor L1 Cache. Since L1 cache  
Help Text:  
Comments:  
is not shared between cores, this is shown as the amount of L1 cache per core. There are two types of  
L1 cache, so this amount is the total of L1 Instruction Cache plus L1 Data Cache for each core.  
Single socket boards have a single processor display, 2 socket or 4 socket. boards have a display  
column for each socket, showing “N/A” for empty sockets where processors are not installed.  
Back to [Processor Configuration Screen] [Advanced Screen]  
L2 Cache RAM  
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Option Values:  
<L2 cache size>  
<None>  
Information only. Displays size in KB of the processor L2 Cache. Since L2 cache  
Help Text:  
Comments:  
is not shared between cores, this is shown as the amount of L2 cache per core.  
Single socket boards have a single processor display, 2 socket or 4 socket. boards have a display  
column for each socket, showing “N/A” for empty sockets where processors are not installed.  
Back to [Processor Configuration Screen] [Advanced Screen]  
L3 Cache RAM  
Option Values:  
<L3 cache size>  
<None>  
Information only. Displays size in MB of the processor L3 Cache. Since L3 cache  
Help Text:  
Comments:  
is shared between all cores in a processor package, this is shown as the total amount of L3 cache per  
processor package.  
Single socket boards have a single processor display, 2 socket or 4 socket boards have a display  
column for each socket, showing “N/A” for empty sockets where processors are not installed.  
Back to [Processor Configuration Screen] [Advanced Screen]  
Processor Version  
See following…  
Processor 1 Version  
See following…  
Processor 2 Version  
Option Values:  
Help Text:  
<ID string from processor>  
<None>  
Information only. Displays Brand ID string read from processor with CPUID  
Comments:  
instruction.  
Single socket boards have a single processor display, 2 socket or 4 socket. boards have a display line  
for each socket, showing “N/A” for empty sockets where processors are not installed.  
Back to [Processor Configuration Screen] [Advanced Screen]  
Current Intel® QPI Link Speed  
Option Values:  
Slow  
Fast  
Help Text:  
<None>  
Comments:  
Information only. Displays current Link Speed setting for the QPI Links. Appears  
only on multi-socket boards.  
QPI Link Speed should display as “Slow” only when running at the “Boot Speed” of 50 MT/s, or when a  
multi-socket board has only one processor installed, so QPI is not functional. It should always be “Fast”  
when the QPI Link Frequency is in the normal functional range of 6.4 GT/s or above.  
Back to [Processor Configuration Screen] [Advanced Screen]  
Intel® QPI Link Frequency  
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Option Values:  
N/A  
6.4 GT/s  
7.2 GT/s  
8.0 GT/s  
Unknown GT/s  
Help Text:  
<None>  
Comments:  
Information only. Displays current frequency at which the QPI Links are operating.  
Appears only on multi-socket boards.  
When a multi-socket board has only one processor installed, QPI Link Frequency will be shown as  
“N/A”.  
Back to [Processor Configuration Screen] [Advanced Screen]  
Intel® QPI Frequency Select  
Option Values:  
Auto Max  
6.4 GT/s  
7.2 GT/s  
8.0 GT/s  
Help Text:  
Allows for selecting the Intel® QuickPath Interconnect Frequency. Recommended to leave in  
[Auto Max] so that BIOS can select the highest common Intel® QuickPath Interconnect  
frequency.  
Comments:  
Lowering the QPI frequency may improve performance per watt for some  
processing loads and on certain benchmarks. [Auto Max] will give the maximum QPI performance  
available. Appears only on multi-socket boards.  
When a multi-socket board has only one processor installed, this will be grayed out, with the previous  
value remaining displayed.  
Changes in QPI Link Frequency will not take effect until the system reboots, so this will not immediately  
change the QPI Link Frequency display. Changing QPI Link Frequency does not affect the QPI Link  
Speed.  
Back to [Processor Configuration Screen] [Advanced Screen]  
Intel® Turbo Boost Technology  
Option Values:  
Enabled  
Disabled  
Help Text:  
Intel® Turbo Boost Technology allows the processor to automatically increase its frequency if it  
is running below power, temperature, and current specifications.  
Comments:  
This option is only visible if all processors installed in the system support Intel®  
Turbo Boost Technology. In order for this option to be available, Enhanced Intel® SpeedStep®  
Technology must be Enabled.  
Back to [Processor Configuration Screen] [Advanced Screen]  
Enhanced Intel SpeedStep(R) Tech  
Option Values:  
Help Text:  
Enabled  
Disabled  
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Enhanced Intel SpeedStep (R) Technology allows the system to dynamically adjust processor  
voltage and core frequency, which can result in decreased average power consumption and  
decreased average heat production.  
Contact your OS vendor regarding OS support of this feature.  
Comments:  
When Disabled, the processor setting reverts to running at Max TDP Core  
Frequency (rated frequency).  
This option is only visible if all processors installed in the system support Enhanced Intel® SpeedStep®  
Technology. In order for the Intel® Turbo Boost option to be available, Enhanced Intel® SpeedStep®  
Technology must be Enabled.  
Back to [Processor Configuration Screen] [Advanced Screen]  
Processor C3  
Option Values:  
Enabled  
Disabled  
Help Text:  
Enable/Disable Processor C3 (ACPI C2/C3) report to OS  
Comments: This is normally Disabled, but can be Enabled for improved performance on  
certain benchmarks and in certain situations.  
Back to [Processor Configuration Screen] [Advanced Screen]  
Processor C6  
Option Values:  
Enabled  
Disabled  
Help Text:  
Enable/Disable Processor C6 (ACPI C3) report to OS  
Comments: This is normally Enabled but can be Disabled for improved performance on  
certain benchmarks and in certain situations.  
Back to [Processor Configuration Screen] [Advanced Screen]  
Intel® Hyper-Threading Tech  
Option Values:  
Help Text:  
Enabled  
Disabled  
Intel® Hyper-Threading Technology allows multithreaded software applications to execute  
threads in parallel within each processor.  
Contact your OS vendor regarding OS support of this feature.  
Comments:  
Hyper-Threading Technology.  
This option is only visible if all processors installed in the system support Intel®  
Back to [Processor Configuration Screen] [Advanced Screen]  
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1. Active Processor Cores  
Option Values:  
All  
1
2
3
4
5
6
7
Help Text:  
Number of cores to enable in each processor package.  
Comments: The numbers of cores that appear as selections depends on the number of cores  
available in the processors installed. Boards may have as many as 8 cores in each of 1, 2, or 4  
processors. The same number of cores must be active in each processor package.  
This Setup screen should begin with the number of currently-active cores as the number displayed. See  
note below – this may be different from the number previously set by the user.  
Note: The ME can control the number of active cores independently of the BIOS Setup setting. If the  
ME disables or enables processor cores, that will override the BIOS setting, and the number selected  
by BIOS will be disregarded.  
Back to [Processor Configuration Screen] [Advanced Screen]  
Execute Disable Bit  
Option Values:  
Help Text:  
Enabled  
Disabled  
Execute Disable Bit can help prevent certain classes of malicious buffer overflow attacks.  
Contact your OS vendor regarding OS support of this feature.  
Comments:  
This option is only visible if all processors installed in the system support the  
Execute Disable Bit. The OS and applications installed must support this feature in order for it to be  
enabled.  
Back to [Processor Configuration Screen] [Advanced Screen]  
Intel® Virtualization Technology  
Option Values:  
Enabled  
Disabled  
Help Text:  
Intel® Virtualization Technology allows a platform to run multiple operating systems and  
applications in independent partitions.  
Note: A change to this option requires the system to be powered off and then back on before  
the setting takes effect.  
Comments:  
This option is only visible if all processors installed in the system support Intel®  
VT. The software configuration installed on the system must support this feature in order for it to be  
enabled.  
Back to [Processor Configuration Screen] [Advanced Screen]  
Intel® VT for Directed I/O  
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Option Values:  
Enabled  
Disabled  
Help Text:  
Enable/Disable Intel® Virtualization Technology for Directed I/O (Intel® VT-d).  
Report the I/O device assignment to VMM through DMAR ACPI Tables.  
Comments:  
This option is only visible if all processors installed in the system support Intel®  
VT-d. The software configuration installed on the system must support this feature in order for it to be  
enabled.  
Back to [Processor Configuration Screen] [Advanced Screen]  
Interrupt Remapping  
Option Values:  
Help Text:  
Enabled  
Disabled  
Enable/Disable Intel® VT-d Interrupt Remapping support. For some processors, this option may  
be "always enabled".  
Comments:  
This option only appears when Intel® Virtualization Technology for Directed I/O is  
Enabled. For some processors this will be enabled unconditionally whenever Intel® VT-d is enabled. In  
that case, this option will be shown as "Enabled", and grayed out and not changeable.  
Back to [Processor Configuration Screen] [Advanced Screen]  
Coherency Support  
Option Values:  
Enabled  
Disabled  
Help Text:  
Enable/Disable Intel® VT-d Coherency support.  
Comments:  
This option only appears when Intel® Virtualization Technology for Directed I/O is  
Enabled.  
Back to [Processor Configuration Screen] [Advanced Screen]  
ATS Support  
Option Values:  
Enabled  
Disabled  
Help Text:  
Enable/Disable Intel® VT-d Address Translation Services (ATS) support.  
Comments:  
This option only appears when Intel® Virtualization Technology for Directed I/O is  
Enabled.  
Back to [Processor Configuration Screen] [Advanced Screen]  
Pass-through DMA Support  
Option Values:  
Enabled  
Disabled  
Help Text:  
Enable/Disable Intel® VT-d Pass-through DMA support. For some processors, this option may  
be "always enabled".  
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Comments:  
This option only appears when Intel® Virtualization Technology for Directed I/O is  
Enabled. For some processors this will be enabled unconditionally whenever Intel® VT-d is enabled. In  
that case, this option will be shown as "Enabled", and grayed out and not changeable.  
Back to [Processor Configuration Screen] [Advanced Screen]  
Intel® TXT  
Option Values:  
Enabled  
Disabled  
Help Text:  
Enable/Disable Intel® Trusted Execution Technology. Takes effect after reboot.  
Comments:  
Intel® TXT only appears when both Intel® Virtualization Technology and Intel®  
VVT for Directed IO are enabled.  
This option appears only on models equipped with a TPM. The TPM must be active in order to support  
Intel® TXT.  
Note: Changing the setting for Intel® TXT will require the system to perform a Hard Reset in order for  
the new setting to become effective.  
Back to [Processor Configuration Screen] [Advanced Screen]  
2. Enhanced Error Containment Mode  
Option Values:  
Enabled  
Disabled  
Help Text:  
Enable Enhanced Error Containment Mode (Data Poisoning) - Erroneous data coming from  
memory will be poisoned. If disabled (default), will be in Legacy Mode - No data poisoning  
support available.  
Comments:  
Enhanced Error Containment (Data Poisoning) is not supported by all models of  
processors, and this option will not appear unless all installed processors support Enhanced Error  
Containment. This option globally enables or disables both Core and Uncore Data Poisoning, for  
processors which support them.  
Back to [Processor Configuration Screen] [Advanced Screen]  
MLC Streamer  
Option Values:  
Help Text:  
Enabled  
Disabled  
MLC Streamer is a speculative prefetch unit within the processor(s).  
Note: Modifying this setting may affect performance.  
Comments:  
MLC Streamer is normally Enabled, for best efficiency in L2 Cache and Memory  
Channel use, but disabling it may improve performance for some processing loads and on certain  
benchmarks.  
Back to [Processor Configuration Screen] [Advanced Screen]  
MLC Spatial Prefetcher  
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Option Values:  
Enabled  
Disabled  
Help Text:  
[Enabled] – Fetches adjacent cache line (128 bytes) when required data is not currently in  
cache.  
[Disabled] – Only fetches cache line with data required by the processor (64 bytes).  
Comments:  
MLC Spatial Prefetcher is normally Enabled, for best efficiency in L2 Cache and  
Memory Channel use, but disabling it may improve performance for some processing loads and on  
certain benchmarks.  
Back to [Processor Configuration Screen] [Advanced Screen]  
DCU Data Prefetcher  
Option Values:  
Help Text:  
Enabled  
Disabled  
The next cache line will be prefetched into L1 data cache from L2 or system memory during  
unused cycles if it sees that the processor core has accessed several bytes sequentially in a  
cache line as data.  
[Disabled] – Only fetches cache line with data required by the processor (64 bytes).  
Comments:  
DCU Data Prefetcher is normally Enabled, for best efficiency in L1 Data Cache  
and Memory Channel use, but disabling it may improve performance for some processing loads and on  
certain benchmarks.  
Back to Processor Configuration Screen] [Advanced Screen]  
DCU Instruction Prefetcher  
Option Values:  
Help Text:  
Enabled  
Disabled  
The next cache line will be prefetched into L1 instruction cache from L2 or system memory  
during unused cycles if it sees that the processor core has accessed several bytes sequentially  
in a cache line as data.  
Comments:  
DCU Data Prefetcher is normally Enabled, for best efficiency in L1 I Cache and  
Memory Channel use, but disabling it may improve performance for some processing loads and on  
certain benchmarks.  
Back to [Processor Configuration Screen] [Advanced Screen]  
Direct Cache Access (DCA)  
Option Values:  
Help Text:  
Enabled  
Disabled  
Allows processors to increase the I/O performance by placing data from I/O devices directly into  
the processor cache.  
Comments:  
System performance is usually best with Direct Cache Access Enabled. In  
certain unusual cases, disabling this may give improved results.  
Back to [Processor Configuration Screen] [Advanced Screen]  
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Extended ATR  
Option Values:  
0x01  
0x03  
Help Text:  
Extended Timeout value for PCIe tuning.  
Comments: Adjust Aging Timer Rollover (ATR) value for PCIe performance improvement.  
Back to [Processor Configuration Screen] [Advanced Screen]  
PFloor Tuning  
Option Values:  
[Entry Field maximum Non-Turbo Frequency -3 of installed Processors –  
12, 12 is default]  
Help Text:  
Adjustment of CPU idle frequency for PCIe Bus tuning.  
Comments:  
Changing processor power state configuration may improve I/O performance. If  
processor low power states (Processor C-state) appear to be involved in the I/O performance issue  
experimentally, the next step is to see if establishing a minimum operating frequency resolves the  
problem by setting the value of the BIOS Setup option "PFloor Tuning". This will set the minimum  
operating frequency to be the same as the maximum non-Turbo frequency. The BIOS provides the  
Setup option "PFloor Tuning" with allowable range between the maximum Non-Turbo operating  
frequency minus 3 and 12, and the value is the number of 100 MHz step.  
Back to [Processor Configuration Screen] [Advanced Screen]  
3. SMM Wait Timeout  
Option Values:  
Help Text:  
[Entry Field 20 – 3000ms, 20 is default]  
Millisecond timeout waiting for BSP and APs to enter SMM. Range is 20ms to 3000ms.  
Comments: Amount of time to allow for the SMI Handler to respond to an SMI. If exceeded,  
BMC generates an SMI Timeout and resets the system.  
Note: this field is temporary, and will be removed when no longer required.  
Back to [Processor Configuration Screen] [Advanced Screen]  
12.2.2.2  
Power & Performance  
The Power & Performance screen allows the user to specify a profile which is optimized in the direction of  
either reduced power consumption or increased performance.  
To access this screen from the Main screen, select Advanced > Power and Performance. To move to  
another screen, press the <Esc> key to return to the Advanced screen, then select the desired screen.  
There are four possible profiles from which to choose. When a Power and Performance Profile is chosen, that in  
turn will cause the system to implement a defined list of Setup option settings and internal (non-visible) settings.  
There is an explanation displayed on the screen, because of the fact that other settings may be adjusted without  
specifically notifying the user.  
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BIOS Setup Utility  
Advanced  
Power & Performance  
CPU Power and Performance Policy  
Performance/Balanced Performance/  
Balanced Power/Power  
[Performance] Optimization is strongly toward performance, even at the expense of energy efficiency.  
[Balanced Performance] Weights optimization toward performance, while conserving energy.  
[Balanced Power] Weights optimization toward energy conservation, with good performance.  
[Power] Optimization is strongly toward energy efficiency, even at the expense of performance.  
Figure 44. Power & Performance Screen  
Screen Field Descriptions:  
1. CPU Power and Performance Policy  
Option Values:  
Performance  
Balanced Performance  
Balanced Power  
Power  
Help Text:  
Allows the user to set an overall power and performance policy for the system, and when  
changed will modify a selected list of options to achieve the policy. These options are still  
changeable outside of the policy, but do reflect the changes that the policy makes when a new  
policy is selected.  
Comments:  
Choosing one of these four Power and Performance Profiles implements a  
number of changes in BIOS settings, both visible settings in the Setup screens and non-visible internal  
settings.  
Back to [Power & Performance Screen] [Advanced Screen]  
12.2.2.3  
Memory Configuration  
The Memory Configuration screen allows the user to view details about the DDR3 DIMMs that are installed as  
system memory, and alter BIOS Memory Configuration settings where appropriate.  
For S1400, S1600, S2400, S2600, and S4600 series boards this screen shows memory system information,  
has options to select, and allows the user to select the “Configure Memory RAS and Performance” screen for  
further system memory information and configuration.  
This screen differs somewhat between different boards which have different memory configurations. Some  
boards have one processor socket and fewer DIMMs, while other boards have two sockets or four sockets,  
more DIMMs, and the boards may have RAS and Performance options if configured for them  
To access this screen from the Main screen, select Advanced > Memory Configuration. To move to another  
screen, press the <Esc> key to return to the Advanced screen, then select the desired screen.  
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Advanced  
Memory Configuration  
Total Memory  
<Total Physical Memory Installed in System>  
Effective Memory  
<Total Effective Memory>  
<Independent/Mirror/Rank Sparing/Lockstep>  
<Operational Memory Speed in MT/s>  
Auto/800/1066/1333/1600  
Enabled/Disabled  
Current Configuration  
Current Memory Speed  
Memory Operating Speed Selection  
Phase Shedding  
Memory SPD override  
Patrol Scrub  
Enabled/Disabled  
Enabled/Disabled  
Demand Scrub  
Enabled/Disabled  
Correctable Error Threshold  
Memory Power Optimization  
20/10/5/All/None  
Power Optimized/Performance Optimized  
Memory RAS and Performance Configuration  
DIMM Information  
DIMM_A1  
<DIMM Size> <DIMM Status>  
<DIMM Size> <DIMM Status>  
<DIMM Size> <DIMM Status>  
<DIMM Size> <DIMM Status>  
DIMM_A2  
DIMM_A3  
DIMM_B1  
~~ (repeated for B2-H2, omitted) ~~  
DIMM_H3  
<DIMM Size> <DIMM Status>  
<DIMM Size> <DIMM Status>  
~~ (repeated for I1-P2, omitted) ~~  
DIMM_P3  
Figure 45. Memory Configuration Screen  
Screen Field Descriptions:  
1. Total Memory  
Option Values:  
<Total Physical Memory Installed in System>  
Help Text:  
<None>  
Information only. Displays the amount of memory available in the system in the  
Comments:  
form of installed DDR3 DIMMs, in units of GB.  
Back to [Memory Configuration Screen] [Advanced Screen]  
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2. Effective Memory  
Option Values:  
<Total Effective Memory>  
<None>  
Information only. Displays the amount of memory available to the OS in MB or  
Help Text:  
Comments:  
GB.  
The Effective Memory is the Total Physical Memory minus the sum of all memory reserved for internal  
usage, RAS redundancy and SMRAM.  
Note: Some server operating systems do not display the total physical memory installed.  
Back to [Memory Configuration Screen] [Advanced Screen]  
3. Current Configuration  
Option Values:  
Independent Channel  
Mirror  
Rank Sparing  
Lockstep  
Help Text:  
<None>  
Comments:  
Information only: Displays one of the following:  
Independent Channel – DIMMs are operating in Independent Channel Mode, the default  
configuration when there is no RAS Mode configured.  
Mirror – Mirroring RAS Mode has been configured and is operational.  
Rank Sparing – Rank Sparing RAS Mode has been configured and is operational  
Lockstep – Lockstep RAS Mode has been configured and is operational  
Back to [Memory Configuration Screen] [Advanced Screen]  
4. Current Memory Speed  
Option Values:  
Help Text:  
<Operational Memory Speed in MT/s>  
<None>  
Information only. Displays the speed in MT/s at which the memory is currently  
Comments:  
running.  
The supported memory speeds are 800 MT/s, 1066 MT/s, 1333 MT/s, and 1600 MT/s. The actual  
memory speed capability depends on the memory configuration.  
Back to [Memory Configuration Screen] [Advanced Screen]  
5. Memory Operating Speed Selection  
Option Values:  
Auto  
800  
1066  
1333  
1600  
Help Text:  
Force specific Memory Operating Speed or use Auto setting.  
Comments:  
Allows the user to select a specific speed at which memory will operate. Only  
speeds that are legitimate are available, that is, the user can only specify speeds less that or equal to  
the auto-selected Memory Operating Speed. The default Auto setting will select the highest achievable  
Memory Operating Speed consistent with the DIMMs and processors installed.  
1600 MT/s memory speed is available only on certain models.  
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Back to [Memory Configuration Screen] [Advanced Screen]  
6. Phase Shedding  
Option Values:  
Enabled  
Disabled  
Help Text:  
Enable/disable DDR3 VR Static Phase Shedding. When enabled, DDR3 VR can be  
automatically adjusted by typical load.  
Comments:  
This feature helps DDR3 VR optimize for high loading.  
Back to [Memory Configuration Screen] [Advanced Screen]  
7. Memory SPD Override  
Option Values:  
Enabled  
Disabled  
Help Text:  
When enabled, it extends the platform’s capability to support higher Memory Frequency than  
the planned settings with Intel® S2600 family processors; disabling it keeps the planned settings.  
Comments: When enabled, it extends the platform’s capability to support higher Memory Frequency.  
Back to [Memory Configuration Screen] [Advanced Screen]  
8. Patrol Scrub  
Option Values:  
Enabled  
Disabled  
Help Text:  
When enabled, performs periodic checks on memory cells and proactively walks through  
populated memory space, to seek and correct soft ECC errors.  
Comments:  
When enabled, Patrol Scrub is initialized to read through all of memory in a 24-  
hour period, correcting any Correctable ECC Errors it encounters by writing back the corrected data to  
memory.  
Back to [Memory Configuration Screen] [Advanced Screen]  
9. Demand Scrub  
Option Values:  
Enabled  
Disabled  
Help Text:  
When enabled, executes when an ECC error is encountered during a normal read/write of data  
and corrects that data.  
Comments:  
When enabled, Demand Scrub automatically corrects a Correctable ECC Error  
encountered during a fetch from memory by writing back the corrected data to memory.  
Back to [Memory Configuration Screen] [Advanced Screen]  
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10. Correctable Error Threshold  
Option Values:  
20  
10  
5
All  
None  
Help Text:  
Threshold value for logging Correctable Errors (CE) – Threshold of 10 (default) logs 10th CE,  
"All" logs every CE and “None”’ means no CE logging. All and None are not valid with Rank  
Sparing.  
Comments:  
Specifies how many Correctable Errors must occur before triggering the logging  
of a SEL Correctable Error Event. Only the first threshold crossing is logged, unless “All” is selected.  
“All” causes every CE that occurs to be logged. “None” suppresses CE logging completely.  
When Rank Sparing RAS Mode is configured, “All” and “None” are not valid, so they will not be  
presented as choices.  
This threshold is applied on a per-rank basis. The Correctable Error occurrences are counted for each  
memory rank. When any one rank accumulates a CE count equal to the CE Threshold, then a single  
CE SEL Event is logged, and all further CE logging is suppressed.  
Note that the CE counts are subject to a “leaky bucket” mechanism that reduces the count as a function  
of time, to keep from accumulating counts unnecessarily over the term of a long operational run.  
This is also the Correctable Error threshold used when Rank Sparing RAS Mode is configured. When a  
CE threshold crossing occurs in Rank Sparing Mode on a channel which is in Redundant state, it  
causes a Sparing Fail Over (SFO) event to occur. That threshold crossing will also be logged as a  
Correctable Error event if it is the first to occur on the system.  
An SFO event causes the rank with the error to be replaced by the spare rank for that channel., and the  
channel goes to a non-redundant state (with a “Redundancy Degraded” SEL Event logged). There may  
be an SFO for each channel in the system, although only the first one can be logged as a CE event.  
Back to [Memory Configuration Screen] [Advanced Screen]  
11. Memory Power Optimization  
Option Values:  
Power Optimized  
Performance Optimized  
Help Text:  
Power Optimized enables memory power limiting, Performance Optimized disables it for  
maximum performance.  
Comments:  
When enabled, the system is configured to allow memory power management by  
the Node Manager (NM) and Management Engine (ME).  
Back to [Memory Configuration Screen] [Advanced Screen]  
12. Memory RAS and Performance Configuration  
Option Values:  
<None>  
Help Text:  
Configure memory RAS (Reliability, Availability, and Serviceability) and view current memory  
performance information and settings.  
Comments:  
Selection only. Position to this line and press the <Enter> key to go to the  
Memory RAS and Performance Configuration group of configuration settings.  
Back to [Memory Configuration Screen] [Advanced Screen]  
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13. DIMM_A1  
14. DIMM_A2  
15. DIMM_A3  
16. DIMM_B1  
(DIMM_B2 through DIMM_H2 omitted)  
17. DIMM_H3  
(DIMM_I1 through DIMM_P2 omitted)  
18. DIMM_P3  
Option Values:  
<DIMM Size> <DIMM Status>  
Where DIMM Size is:  
Size of DIMM in GB  
Where DIMM Status is:  
Installed&Operational  
Not Installed  
Failed/Disabled  
Help Text:  
<None>  
Comments:  
Information only: Displays the status of each DIMM socket present on the board.  
There is one line for each DIMM socket present on the board.  
For each DIMM socket, the DIMM Status reflects one of the following three possible states:  
.
.
.
Installed&Operational – There is a DDR3 DIMM installed and operational in this slot.  
Not Installed – There is no DDR3 DIMM installed in this slot.  
Failed/Disabled – The DIMM installed in this slot has failed during  
initialization and/or was disabled during initialization.  
For each DIMM that is in the Installed&Operational state, the DIMM Size in GB of that DIMM is  
displayed. This is the physical size of the DIMM, regardless of how it is counted in the Effective Memory  
size.  
Note: In “DIMM_XY”, X denotes the Channel Identifier A - P, and Y denotes the DIMM Slot identifier 1 -  
3 within the Channel. DIMM_A2 is the DIMM socket on Channel A, Slot 2. Not all boards have the  
same number of channels and slots – this is dependent on the board features.  
.
.
.
.
.
S1400 boards can have DIMMs A1, A2 to C1, C2 (max 3 channels/2 DPC)  
S1600 boards can have DIMMs A1, A2, A3 to D1, D2, D3 (max 4 channels/3 DPC)  
S2400 boards can have DIMMs A1, A2 to F1, F2 (max 2 CPU/3 channels/2 DPC)  
S2600 boards can have DIMMs A1, A2, A3 to H1, H2, H3 (max 2 CPU/4 chan/3 DPC)  
S4600 boards can have DIMMs A1, A2, A3 to P1, P2, P3 (max 4 CPU/4 chan/3 DPC)  
Back to [Memory Configuration Screen] [Advanced Screen]  
12.2.2.4  
Memory RAS and Performance Configuration  
The Memory RAS and Performance Configuration screen allows the user to customize several memory  
configuration options, such as whether to use Memory Mirroring or Memory Sparing.  
To access this screen from the Main screen, select Advanced > Memory Configuration > Memory RAS and  
Performance Configuration. To move to another screen, press the <Esc> key to return to the Memory  
Configuration screen, if necessary press the <Esc> key again to return to the Advanced screen, then select  
the desired screen.  
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BIOS Setup Utility  
Advanced  
Memory RAS and Performance Configuration  
Capabilities  
Memory Mirroring Possible  
Memory Rank Sparing Possible  
Memory Lockstep Possible  
Select Memory RAS Configuration  
NUMA Optimized  
Yes/No  
Yes/No  
Yes/No  
Maximum Performance/Mirroring/Rank Sparing/Lockstep  
Enabled/Disabled  
Figure 46. Memory RAS and Performance Configuration Screen  
Screen Field Descriptions:  
1. Memory Mirroring Possible  
Option Values:  
Yes  
No  
Help Text:  
<None>  
Comments:  
Information only. Displays whether the current DIMM configuration is capable of  
Memory Mirroring. For Memory Mirroring to be possible, DIMM configurations on all paired channels  
must be identical between the channel pair (Mirroring Domain).  
Back to [Memory RAS and Performance Configuration Screen] [Memory Configuration Screen] —  
[Advanced Screen]  
2. Memory Rank Sparing Possible  
Option Values:  
Yes  
No  
Help Text:  
<None>  
Comments:  
Information only. Displays whether the current DIMM configuration is capable of  
Rank Sparing. For Rank Sparing to be possible, DIMM configurations on all channels must be capable  
of supporting Rank Sparing.  
Note: The Correctable Error Threshold value is also the Sparing Fail Over threshold value. Threshold  
values of “All” or “None” are not valid for Rank Sparing. If the Correctable Error Threshold is set to  
either of those values, Rank Spring will not be possible. See Memory Configuration Setup screen.  
Back to [Memory RAS and Performance Configuration Screen] [Memory Configuration Screen] —  
[Advanced Screen]  
3. Memory Lockstep Possible  
Option Values:  
Yes  
No  
Help Text:  
<None>  
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Comments:  
Information only. Displays whether the current DIMM configuration is capable of  
Memory Lockstep. For Memory Lockstep to be possible, DIMM configurations on all paired channels  
must be identical between the channel pair.  
Back to [Memory RAS and Performance Configuration Screen] [Memory Configuration Screen] —  
[Advanced Screen]  
4. Select Memory RAS Configuration  
Option Values:  
Maximum Performance  
Mirroring  
Rank Sparing  
Lockstep  
Help Text:  
Allows the user to select the memory RAS Configuration to be applied for the next boot.  
Comments:  
Available modes depend on the current memory population. Modes which are not  
listed as “possible” should not be available as choices. If the only valid choice is “Maximum  
Performance”, then this option should be grayed out and unavailable.  
Maximum Performance – (default) no RAS, but best memory utilization since full amount of  
memory is available, operating in Independent Channel Mode.  
Mirroring - most reliability by using half of memory as a mirror image, can survive an  
Uncorrectable ECC Error.  
Rank Sparing – offers reliability by reserving spare ranks to replace failing ranks which are  
generating excessive Correctable ECC Errors.  
Lockstep – allows SDDC capability with x8 DIMMs installed. No memory size impact, but does  
have a performance and power penalty.  
Note: since only RAS Modes which are listed as “possible” are available for selection, it is not possible  
to select a RAS Mode without first installing an appropriate DIMM configuration.  
Back to [Memory RAS and Performance Configuration Screen] [Memory Configuration Screen] —  
[Advanced Screen]  
5. NUMA Optimized  
Option Values:  
Enabled  
Disabled  
Help Text:  
If enabled, BIOS includes ACPI tables that are required for NUMA-aware Operating Systems.  
Comments:  
This option is only present for boards which have two or more processor sockets.  
When a multi-socket board has only a single processor installed, this option is grayed out and set as  
Disabled.  
When enabled, the SRAT and SLIT ACPI tables are provided that show the locality of systems  
resources, especially memory, which allows a “NUMA Aware” OS to optimize which processor threads  
are used by processes which can benefit by having the best access to those resources.  
Back to [Memory RAS and Performance Configuration Screen] [Memory Configuration Screen] —  
[Advanced Screen]  
12.2.2.5  
Mass Storage Controller Configuration  
The Mass Storage Configuration screen allows the user to configure the Mass Storage controllers that are  
integrated into the server board on which the BIOS is executing. This includes only onboard Mass Storage  
controllers. Mass Storage controllers on add-in cards are not included in this screen, nor are other storage  
mechanisms such as USB-attached storage devices or Network Attached Storage.  
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There are two types of onboard controller configured in this screen, the AHCI SATA controller and the Storage  
Control Unit (SCU) with SATA or SAS drive support and RAID support. There are also informational displays of  
AHCI and SCU controller configuration, and SATA Drive Information when applicable. If the presence of an  
Intel® Storage Module is detected, the type of Storage Module is displayed as information-only.  
To access this screen from the Main screen, select Advanced > Mass Storage Controller Configuration. To  
move to another screen, press the <Esc> key to return to the Advanced screen, then select the desired  
screen.  
Advanced  
Mass Storage Controller Configuration  
AHCI Controller Configuration  
<AHCI Port Configuration>  
SATA/SAS Controller Configuration  
<SCU SAS/SATA Port Configuration>  
AHCI Capable SATA Controller  
AHCI eSATA Options  
Disabled/Compatibility/Enhanced/AHCI/RAID Mode  
SATA/eSATA  
AHCI HDD Staggered Spin-Up  
AHCI Capable RAID Options  
SAS/SATA Capable Controller  
RSTe Boot Configuration  
Enabled/Disabled  
INTEL(R) ESRT2 (LSI*)/INTEL(R) RSTe  
Disabled/INTEL(R) ESRT2 (LSI*)/INTEL(R) RSTe  
Neither/AHCI Capable Ctrlr/SAS/SATA Capable Ctrlr  
Intel® Storage Module  
- None/<Name of storage module detected >  
SATA Port 0  
SATA Port 1  
SATA Port 2  
SATA Port 3  
SATA Port 4  
SATA Port 5  
Not Installed/<Drive Information>  
Not Installed/<Drive Information>  
Not Installed/<Drive Information>  
Not Installed/<Drive Information>  
Not Installed/<Drive Information>  
Not Installed/<Drive Information>  
Figure 47. Mass Storage Controller Configuration Screen  
Screen Field Descriptions:  
AHCI Controller Configuration  
Option Values:  
<AHCI Port Configuration>  
One of these strings:  
Controller is disabled  
2 ports of 6Gb/s SATA  
2 ports of 6Gb/s SATA & 4 ports of 3Gb/s SATA  
Help Text: <None>  
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Comments:  
Information only. This is a display showing which ports are available through the  
onboard AHCI capable SATA controller, if the controller is enabled.  
This information is also displayed during POST in the POST Diagnostic Screen.  
The number of SATA ports available from the integrated AHCI-capable SATA Controller is dependent  
on the specific server board installed in the system. Different server board designs expose different  
SATA port configurations. The Platform ID (Board ID) is displayed in the Main Screen.  
Back to [Mass Storage Controller Configuration Screen]  
1. SATA/SAS Controller Configuration  
Option Values:  
One of these strings:  
<SCU SAS/SATA Port Configuration>  
Controller is disabled  
4 ports in SATA mode  
4 ports in SAS mode  
8 ports in SATA mode  
8 ports in SAS mode  
Help Text:  
Comments:  
<None>  
Information only. This is a display showing the number of ports which are  
available through the SCU controller, and whether they are configured for SATA or SAS.  
Various SATA/SAS Capable Controller configurations require the installation of Intel® RAID C600  
Upgrade Keys:  
4 port SATA requires no key or AXXRKSATA4R5 key  
4 port SAS requires AXXRKSAS4 or AXXRKSAS4R5 key  
8 port SATA requires AXXRKSATA8 or AXXRKSATA8R5 key  
8 port SAS requires AXXRKSAS8 or AXXRKSAS8R5 key  
Back to [Mass Storage Controller Configuration Screen]  
2. AHCI Capable SATA Controller  
Option Values:  
Disabled  
Compatibility  
Enhanced  
AHCI  
RAID Mode  
Help Text:  
- Compatibility provides PATA emulation on the SATA device  
- Enhanced provides Native SATA support  
- AHCI enables the Advanced Host Controller Interface, which provides Enhanced SATA  
functionality  
- RAID Mode provides host based RAID support on the onboard SATA ports  
Comments:  
This option configures the onboard AHCI-capable SATA controller, which is  
distinct from the SCU. The number and type of ports it controls differs between board series.  
If the SATA Controller is Disabled, the SATA Ports will not operate. and any installed SATA devices will  
be unavailable.  
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Compatibility provides PATA emulation on the SATA device, allowing the use of legacy IDE/PATA  
drivers. Enhanced provides Native SATA support., using native SATA drivers included with the vast  
majority of current OSes. AHCI enables the Advanced Host Controller Interface, which provides  
Enhanced SATA functionality. plus possible additional functionality (Native Command Queuing, Hot  
Plug, Staggered Spin Up). It uses AHCI drivers available for the majority of current OSes.  
RAID Mode provides host based RAID support on the onboard SATA ports. RAID levels supported and  
required drivers depend on the RAID stack selected  
Back to [Mass Storage Controller Configuration Screen]  
AHCI eSATA Options  
Option Values:  
Help Text:  
SATA  
eSATA  
- SATA mode enables the switchable internal AHCI SATA (port 1)  
- eSATA mode enables the switchable external AHCI eSATA (port 1)  
- These modes are mutually exclusive, so SATA port 1 will only be active on one connector, not  
both  
Comments:  
In order to use the external eSATA connection, this option must be set to eSATA.  
When the external eSATA connector is selected, it disables the corresponding internal SATA port 1  
connector. When set to SATA, the internal connector for SATA port 1 is active, and the external eSATA  
connector is disabled.  
This option setting only appears when the SATA Controller is enabled, and only for platforms which  
support eSATA.  
Back to [Mass Storage Controller Configuration Screen]  
3. AHCI HDD Staggered Spin-Up  
Option Values:  
Enabled  
Disabled  
Help Text:  
If enabled for the AHCI Capable SATA controller, Staggered Spin-Up will be performed on  
drives attached to it. Otherwise these drives will all spin up at boot.  
Comments:  
This option enables or disables Staggered Spin-up only for disk drives attached  
to ports on the AHCI Capable SATA Controller. Disk drives attached to SATA/SAS ports on the Storage  
Control Unit are controlled by a different method for Staggered Spin-Up and this option does not affect  
them.  
This option is only visible when the SATA Controller is enabled and AHCI or RAID has been selected  
as the operational SATA Mode.  
Staggered Spin-Up is needed when there are enough HDDs attached to the system to cause a marked  
startup power demand surge when all drives start spin-up together. Since the power demand is  
greatest just as the drive spinning is started, the overall startup power demand can be leveled off by  
starting up each drive at a slightly different time, so the power demand surges for multiple drives do not  
coincide and cause too great a power draw.  
When Staggered Spin-Up is enabled, it does have a possibility of increasing boot time if there are many  
HDDs attached, because of the interval between starting drives spinning. However, that is exactly the  
scenario in which Staggered Spin-Up is most needed, because the more disk drives attached, the  
greater the startup demand surge.  
Setting the external eSATA connector Enabled (when available) does not invalidate the Staggered  
Spin-Up option, although there may be less need for Staggered Spin-Up in a system configured for  
eSATA use.  
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Back to [Mass Storage Controller Configuration Screen]  
AHCI Capable RAID Options  
Option Values:  
Intel® ESRT2 (LSI*)  
Intel® RSTe  
Help Text:  
- Intel® ESRT2 (Powered By LSI*): Supports RAID 0/1/10 and optional RAID 5 with Intel® RAID  
C600 Upgrade Keys. Uses Intel ESRT2 drivers (based on LSI* MegaSR).  
- Intel® RSTe: Provides pass-through drive support. Also provides host based RAID 0/1/10/5  
support. Uses Intel® RSTe iastor drivers.  
Comments:  
This option only appears when the SATA Controller is enabled, and RAID Mode  
has been selected as the operational SATA Mode. This setting selects the RAID stack to be used for  
SATA RAID with the onboard AHCI SATA controller.  
If a RAID Volume has not previously been created that is compatible with the RAID stack selected, it  
will be necessary to Save and Exit and reboot in order to create a RAID Volume.  
Back to [Mass Storage Controller Configuration Screen]  
4. SAS/SATA Capable Controller  
Option Values:  
Disabled  
Intel® ESRT2 (LSI*)  
Intel® RSTe  
Help Text:  
- Intel® ESRT2: Provides host based RAID 0/1/10 and optional RAID 5. Uses Intel® ESRT2  
drivers (based on LSI* MegaSR).  
- Intel® RSTe: Provides pass-through drive support. Also provides host based RAID 0/1/10  
support, and RAID 5 (in SATA mode only). Uses Intel® RSTe iastor drivers.  
Comments:  
This option selects the RAID stack to be used with the SCU. If Disabled is  
selected, any drives connected to the SCU will not be usable.  
Intel® ESRT2 provides host based RAID 0/1/10 and optional RAID 5. For a RAID 5 configuration, this  
requires one of the Intel® RAID C600 Upgrade Keys AXXRKSATA4R5, AXXRKSATA8R5,  
AXXRKSAS4R5, or AXXRKSAS8R5. Uses Intel® ESRT2 drivers (based on LSI* MegaSR), and is also  
supported by Linux MDRAID.  
Intel® RSTe provides pass-through drive support and provides host based RAID 0/1/10 support, and  
RAID 5 (in SATA mode only). Uses Intel RSTe drivers in Windows, and MDRAID stack in Linux. The  
Intel® RSTe RAID stack is required if it is necessary to provide pass-through support for non-RAID  
drives, or if support is needed for more than 8 drives.  
Back to [Mass Storage Controller Configuration Screen]  
5. RSTe Boot Configuration  
Option Values:  
Neither  
AHCI Capable Ctrlr  
SAS/SATA Capable Ctrlr  
Help Text:  
This selects the device that will support Bootable Drives, whether they are in RAID arrays or  
individual pass-through SAS/SATA drives. Once selected and set up (if necessary), individual  
bootable devices will be listed in the Bootable Devices menu display.  
Comments:  
This option appears only when Intel® RSTe has been selected as the operational  
mode on both the AHCI and SCU controllers. In that case there is a conflict and only one controller can  
be selected as having bootable drives attached.  
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Once selected and set up (if necessary), individual bootable logical or physical drives available on the  
selected controller will be listed in the Bootable Devices menu display.  
If only one device selects RSTe, it will be available as a boot device along with any other devices – this  
option is only necessary to distinguish between which RSTe device runs the Option ROM instance.  
BIOS is required to designate the OPROM for the boot device selected here. Two iterations of the  
OPROM cannot fully load simultaneously, and the version fully loaded will only show devices  
connected to the given controller, so the OPROM load order is based on BIOS selecting the correct  
device.  
Note: If RSTe is selected, then only one CONTROLLER can be bootable, so there will be situations  
where the boot drive *OR* an optical device will be bootable, but not both.  
Please also see the product System Guide for restrictions on expander boot support.  
Back to [Mass Storage Controller Configuration Screen]  
Intel® Storage Module  
Option Values:  
None  
<Name of Storage Module detected>  
Names of Storage Modules supported at this time are:  
Intel® Integrated RAID Module  
Intel® Integrated RAID Module RMS25PB040  
Intel® Integrated RAID Module RMT3PB080  
Intel® Integrated RAID Module RMS25CB080  
Intel® Integrated RAID Module RMS25CB040  
Intel® Integrated RAID Module RMT3CB080  
Intel® Integrated RAID Module RMS25JB080  
Intel® Integrated RAID Module RMS25JB040  
Intel® Integrated RAID Module RMS25KB080  
Intel® Integrated RAID Module RMS25KB040  
Help Text:  
<None>  
Comments:  
Information only. If no Intel® Storage Module is detected, then None is displayed.  
This shows the customer the product name of the module installed, which helps in identifying drivers,  
support, documentation, and so on  
Back to [Mass Storage Controller Configuration Screen]  
SATA Port  
(For Port numbers 0-6)  
Option Values:  
Not Installed  
<Drive Information>  
Help Text:  
<None>  
Comments:  
Information only. The Drive Information, when present, will typically consist of the  
drive model identification and size for the disk drive installed on a particular port.  
This Drive Information line is repeated for all 6 SATA Port for the onboard AHCI capable SATA  
Controller. However, for any given board, only the ports which are physically populated on the board  
are shown. That is, a board which only implements the two 6 GB/s ports 0 and 1 will only show those  
two ports in this Drive Information list.  
This section for Drive Information does not appear at all when the SCU is set to Disabled or the SATA  
operational mode is RAID Mode, nor for any drives attached to the SCU SATA or SAS ports. In these  
cases the BBS information is not available to display.  
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Back to [Mass Storage Controller Configuration Screen]  
12.2.2.6 PCI Configuration  
The PCI Configuration screen allows the user to configure the PCI memory space used for onboard and add-in  
adapters, configure video options, and configure onboard adapter options.  
It also includes a selection option to go to the NIC Configuration screen.  
To access this screen from the Main screen, select Advanced > PCI Configuration. To move to another  
screen, press the <Esc> key to return to the Advanced screen, then select the desired screen.  
Advanced  
PCI Configuration  
Maximize Memory below 4GB  
Memory Mapped I/O above 4 GB  
Memory Mapped I/O Size  
Legacy VGA Socket  
Enabled/Disabled  
Enabled/Disabled  
Auto/1G/2G/4G/8G/16G/32G/64G/128G/256G/512G/1024G  
CPU Socket 1/CPU Socket 2  
Enabled/Disabled  
Dual Monitor Video  
NIC Configuration  
Figure 48. PCI Configuration Screen  
Screen Field Descriptions:  
1. Maximize Memory below 4GB  
Option Values:  
Enabled  
Disabled  
Help Text:  
BIOS maximizes memory usage below 4GB for an OS without PAE support, depending on the  
system configuration. Only enable for an OS without PAE support.  
Comments:  
When this option is enabled, BIOS makes as much memory available as possible  
in the 32-bit (4GB) address space, by limiting the amount of PCI/PCIe Memory Address Space and  
PCIe Extended Configuration Space. This option should only be enabled for a 32-bit OS without PAE  
capability or without PAE enabled.  
Back to [PCI Configuration Screen] [Advanced Screen]  
2. Memory Mapped I/O above 4 GB  
Option Values:  
Enabled  
Disabled  
Help Text:  
Enable or disable memory mapped I/O of 64-bit PCI devices to 4 GB or greater address space.  
Comments:  
When enabled, PCI/PCIe Memory Mapped I/O for devices capable of 64-bit  
addressing is allocated to address space above 4GB, in order to allow larger allocations and avoid  
impacting address space below 4G.  
Back to [PCI Configuration Screen] [Advanced Screen]  
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3. Memory Mapped I/O Size  
Option Values:  
Auto  
1G/2G/4G/8G/16G/32G/64G/128G/256G/512G/1024G  
Help Text:  
Sets MMIO Size: Auto.  
Comments:  
When Memory Mapped I/O above 4GB option enabled, this option sets the  
preserved MMIO size as PCI/PCIe Memory Mapped I/O for devices capable of 64-bit addressing. This  
option is grayed out when Memory Mapped I/O above 4GB option is disabled.  
Back to [PCI Configuration Screen] [Advanced Screen]  
4. Onboard Video  
Option Values:  
Enabled  
Disabled  
Help Text:  
On-board video controller.  
Warning: System video is completely disabled if this option is disabled and an add-in video  
adapter is not installed.  
Comments:  
When disabled, the system requires an add-in video card for the video to be seen.  
When there is no add-in video card installed, Onboard Video is set to Enabled and grayed out so it  
cannot be changed.  
If there is an add-in video card installed in a PCIe slot connected to CPU Socket 1, and the Legacy  
VGA Socket option is set to CPU Socket 1, then this Onboard Video option is available to be set.  
If there is an add-in video card installed on a PCIe slot connected to CPU Socket 2, and the Legacy  
VGA Socket option is set to CPU Socket 2, this option is grayed out and unavailable, with a value set to  
Disabled. This is because the Onboard Video is connected to CPU Socket 1, and is not functional when  
CPU Socket 2 is the active path for video. When Legacy VGA Socket is set back to CPU Socket 1, this  
option becomes available again, set to its default value of Enabled.  
Note: This option does not appear on some models.  
Back to [PCI Configuration Screen] [Advanced Screen]  
5. Legacy VGA Socket  
Option Values:  
CPU Socket 1  
CPU Socket 2  
Help Text:  
Determines whether Legacy VGA video output is enabled for PCIe slots attached to Processor  
Socket 1 or 2. Socket 1 is the default.  
Comments:  
This option is necessary when using an add-in video card on a PCIe slot  
attached to CPU Socket 2, due to a limitation of the processor IIO. The Legacy video device can be  
connected through either socket, but there is a setting that must be set on only one of the two. This  
option allows the switch to using a video card in a slot connected to CPU Socket 2.  
This option does not appear unless the BIOS is running on a board which have one processor installed  
on CPU Socket 2 and can potentially a video card installed in a PCIe slot connected to CPU Socket 2.  
This option is grayed out as unavailable and set to CPU Socket 1 unless there is a processor installed  
on CPU Socket 2 and a video card installed in a PCIe slot connected to CPU Socket 2. When this  
option is active and is set to CPU Socket 2, then both Onboard Video and Dual Monitor Video are set to  
Disabled and grayed out as unavailable. This is because the Onboard Video is a PCIe device  
connected to CPU Socket 1, and is unavailable when the Legacy VGA Socket is set to Socket 2.  
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Back to [PCI Configuration Screen] [Advanced Screen]  
6. Dual Monitor Video  
Option Values:  
Enabled  
Disabled  
Help Text:  
If enabled, both the on-board video controller and an add-in video adapter are enabled for  
system video. The on-board video controller becomes the primary video device.  
Comments:  
This option must be enabled to use an add-in card as a secondary POST Legacy  
Video device while also displaying on the Onboard Video device.  
If there is no add-in video card in any PCIe slot connected to CPU Socket 1, this options is set to  
Disabled and grayed out and unavailable.  
If the Legacy VGA Socket option is set to CPU Socket 2, this option is grayed out and unavailable, with  
a value set to Disabled. When Legacy VGA Socket is set back to CPU Socket 1, this option is set to its  
default value of Disabled, and may become available depending on add-in video card configuration,  
Note: This option does not appear on some models.  
Back to [PCI Configuration Screen] [Advanced Screen]  
7. NIC Configuration  
Option Values:  
Help Text:  
<None>  
View/Configure NIC information and settings.  
Comments: Selection only. Position to this line and press the <Enter> key to go to the NIC  
Configuration group of configuration settings.  
Back to [PCI Configuration Screen] [Advanced Screen]  
12.2.2.7  
NIC Configuration  
The NIC Configuration screen allows the user to configure the NIC controller options for BIOS POST. It also  
displays the NIC MAC Addresses currently in use. This NIC Configuration screen handles network controllers  
built in on the baseboard (“onboard”) or installed as an IO Module (IOM). It does not configure or report  
anything having to do with add-in network adapter cards.  
To access this screen from the Main screen, select Advanced > PCI Configuration > NIC Configuration. To  
move to another screen, press the <Esc> key to return to the PCI Configuration screen, if necessary press  
the <Esc> key again to return to the Advanced screen, then select the desired screen.  
There is usually one Onboard NIC built into the baseboard, although in some cases there are two Onboard  
NICs. There are several possible types of NICs which are incorporated into different boards. When an  
Infiniband* controller is on the baseboard, it appears as an Onboard NIC.  
Most boards in this family also can have an IO Module that installs on the board in a specialized connector.  
There are boards which can have two IO Modules installed.  
The descriptive names of the Onboard NIC types are:  
1. Intel® 82574 Single-Port Gigabit Ethernet Controller  
2. Intel® I350 Dual-Port Gigabit Ethernet Controller  
3. Intel® I350 Quad-Port Gigabit Ethernet Controller  
4. Intel® I540 Dual-Port X540 10 Gigabit RJ-45 Controller  
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5. Mellanox* ConnectX-3* Single-Port Infiniband* FD14 Controller  
For boards with only one Onboard NIC, the “Onboard NIC2” entries are not present on the screen. The number  
of “Port” options which are displayed for each NIC will match the number of ports the Onboard NIC presents.  
The IO Modules currently available are:  
1. Intel® I350 Quad-Port Gigabit Ethernet Module  
2. Intel® I540 Dual-Port X540 10 Gigabit RJ-45 Module  
3. Intel® 82599 Dual-Port 10 Gigabit SFP+ Module  
4. Mellanox* ConnectX-3* Single-Port Infiniband* FD14 Module  
For the IO Module entries on the NIC Configuration screen, only entries for modules which are currently  
installed will appear, and only ports which exist on those IO Modules will appear.  
If an IO Module which had been installed is no longer installed when the system is booted, all NIC  
Configuration entries which are specific to that IO Module will be reset to their default values and hidden. If a  
different IO Module is installed than had been previously installed, the module-specific settings will still be  
returned to defaults, but not hidden. This will not necessarily affect the Option ROM settings, which depend on  
the aggregate capabilities of all installed Onboard and IO Module NICs.  
For each NIC port which is present on an Onboard NIC or IO Module other than Infiniband* controllers, there  
will be a port-specific PXE Boot enabling option and a MAC Address display. Onboard NICs and NIC ports also  
have enable/disable options. IO Modules and the ports on them cannot be disabled by BIOS.  
Infiniband* controllers which appear as Onboard NICs or as IO Modules have a slightly different format. They  
do not have enable/disable options, but they do have a choice of whether to enable loading and executing the  
embedded Option ROM for the controller, which will cause it to become bootable. For Infiniband*, both a GUID  
and a MAC Address are displayed. The GUID is used for Infiniband* Fabric operations, and the MAC Address  
is used when the controller is attached as an Ethernet device.  
For non-Infiniband* NICs, there are different OPROMs for different protocols, which are also differentiated by  
speed, 1 Gb or 10 Gb. For a given protocol/speed, all Ethernet controllers of the same speed use the same  
Option ROM.  
PXE – there are two separate PXE Option ROMs, one for 1 Gb NICs and another for 10 Gb NICs. The two are  
independent of each other, but each must be the only Option ROM enabled in its speed class. If 1 GbE PXE is  
enabled, then the discs OPROM cannot be enabled. If 10 GbE PXE is enabled, then neither discs nor 10 GbE  
FCoE may be enabled.  
discs – there is only one discs Option ROM for both 1 GbE and 10 GbE NICs. If discs is enabled, then neither  
PXE nor FCoE OPROMs may be enabled for the 1 GbE or 10 GbE NICs.  
FCoE – there is a 10 GbE FCoE Option ROM that supports the Intel® 82599 NIC. When it is enabled, the discs  
OPROM and the 10 GbE PXE OPROM must be disabled  
Note: These Option ROMs are only in support of onboard NICs and installed IO Modules. They do not support  
NICs on add-in network cards, even if the NIC on an add-in card is the same type of device as an onboard NIC  
or IO Module controller.  
Only the Option ROMs for which controller capabilities are present are shown in the screen for selection. For  
example, if there are no 10 GbE NICs installed, then the 10 GbE OPROMs will not appear for selection. If  
controller capabilities are present, but all controllers with those capabilities are disabled, then the relevant  
OPROM options will appear, but will be disabled and grayed out and not changeable.  
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Similarly, when the PXE OPROM of a given speed is disabled, all PXE port enable/disable options using that  
OPROM will be disabled and grayed out. Conversely, if all ports are disabled for PXE, the PXE OPROM will be  
disabled and grayed out.  
When a NIC Port is disabled, the PXE enable/disable option for it will be disabled and grayed out, and the  
MAC Address will be blank. When a NIC controller is disabled, all Ports and PXE options for that controller will  
become disabled and grayed out and all MAC Addresses for those ports will be blank. Conversely, if all ports  
for a given controller are disabled, the controller itself will appear as disabled.  
Advanced  
NIC Configuration  
Wake on LAN (PME)  
Enabled/Disabled  
PXE 1GbE Option ROM  
Enabled/Disabled  
Enabled/Disabled  
Enabled/Disabled  
Enabled/Disabled  
PXE 10GbE Option ROM  
FCoE 10GbE Option ROM  
discs 1GbE/10GbE Option ROM  
Onboard NIC1 Type  
NIC1 Controller  
<Onboard NIC Description – Non-InfiniBand>  
Enabled/Disabled  
NIC1 Port1  
Enabled/Disabled  
NIC1 Port2  
Enabled/Disabled  
NIC1 Port3  
Enabled/Disabled  
NIC1 Port4  
Enabled/Disabled  
NIC1 Port1 PXE  
NIC1 Port2 PXE  
NIC1 Port3 PXE  
NIC1 Port4 PXE  
NIC1 Port1 MAC Address  
NIC1 Port2 MAC Address  
NIC1 Port3 MAC Address  
NIC1 Port4 MAC Address  
Enabled/Disabled  
Enabled/Disabled  
Enabled/Disabled  
Enabled/Disabled  
<MAC Address display>  
<MAC Address display >  
<MAC Address display >  
<MAC Address display >  
Onboard NIC2 Type  
<Onboard NIC Description – InfiniBand Only>  
Enabled/Disabled  
NIC2 InfiniBand Option ROM  
NIC2 Port1 GUID  
<GUID Display>  
NIC2 Port1 MAC Address  
<MAC Address display >  
Onboard NIC2 Type  
NIC2 Controller  
NIC2 Port1  
<Onboard NIC Description – Non-InfiniBand>  
Enabled/Disabled  
Enabled/Disabled  
NIC2 Port2  
Enabled/Disabled  
NIC2 Port3  
Enabled/Disabled  
NIC2 Port4  
Enabled/Disabled  
NIC2 Port1 PXE  
NIC2 Port2 PXE  
NIC2 Port3 PXE  
Enabled/Disabled  
Enabled/Disabled  
Enabled/Disabled  
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NIC2 Port4 PXE  
Enabled/Disabled  
NIC2 Port1 MAC Address  
NIC2 Port2 MAC Address  
NIC2 Port3 MAC Address  
NIC2 Port4 MAC Address  
<MAC Address display >  
<MAC Address display >  
<MAC Address display >  
<MAC Address display >  
IO Module 1 Type  
<IO Module Description – Non-InfiniBand>  
Enabled/Disabled  
IOM1 Port1 PXE  
IOM1 Port2 PXE  
Enabled/Disabled  
IOM1 Port3 PXE  
Enabled/Disabled  
IOM1 Port4 PXE  
Enabled/Disabled  
IOM1 Port1 MAC Address  
IOM1 Port2 MAC Address  
IOM1 Port3 MAC Address  
IOM1 Port4 MAC Address  
<MAC Address display >  
<MAC Address display >  
<MAC Address display >  
<MAC Address display >  
IO Module 1 Type  
<IO Module Description – InfiniBand Only>  
Enabled/Disabled  
IOM1 InfiniBand Option ROM  
IOM1 Port1 GUID  
<GUID Display>  
IOM1 Port1 MAC Address  
<MAC Address display >  
IO Module 2 Type  
<IO Module Description – Non-InfiniBand>  
Enabled/Disabled  
IOM2 Port1 PXE  
IOM2 Port2 PXE  
Enabled/Disabled  
IOM2 Port3 PXE  
Enabled/Disabled  
IOM2 Port4 PXE  
Enabled/Disabled  
IOM2 Port1 MAC Address  
IOM2 Port2 MAC Address  
IOM2 Port3 MAC Address  
IOM2 Port4 MAC Address  
<MAC Address display >  
<MAC Address display >  
<MAC Address display >  
<MAC Address display >  
Figure 49. NIC Configuration Screen  
Screen Field Descriptions:  
1. Wake on LAN (PME)  
Option Values:  
Enabled  
Disabled  
Help Text:  
Enables or disables PCI PME function for Wake on LAN capability from LAN adapters.  
Comments:  
Enables/disables PCI/PCIe PME# signal to generate Power Management Events  
(PME) and ACPI Table entries required for Wake on LAN (WOL). However, note that this will enable  
WOL only with an ACPI-capable Operating System which has the WOL function enabled.  
Back to [NIC Configuration Screen] [PCI Configuration Screen] [Advanced Screen]  
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2. PXE 1GbE Option ROM  
Option Values:  
Enabled  
Disabled  
Help Text:  
Enable/Disable Onboard/IOM NIC PXE Option ROM Load.  
Comments: This selection is to enable/disable the 1GbE PXE Option ROM that is used by all  
Onboard and IO Module 1 GbE controllers.  
This option is grayed out and not accessible if the discs Option ROM is enabled. It can co-exist with the  
10 GbE PXE Option ROM, the 10 GbE FCoE Option ROM, or with an Infiniband* controller Option  
ROM.  
If the 1GbE PXE Option ROM is disabled, and no other Option ROM is enabled, the system cannot  
perform a Network Boot and cannot respond for Wake-on-LAN.  
This 1GbE PXE option does not appear unless there is a 1 GbE NIC installed in the system as an  
Onboard or IO Module NIC.  
Back to [NIC Configuration Screen] [PCI Configuration Screen] [Advanced Screen]  
3. PXE 10GbE Option ROM  
Option Values:  
Enabled  
Disabled  
Help Text:  
Enable/Disable Onboard/IOM NIC PXE Option ROM Load.  
Comments: This selection is to enable/disable the 10GbE PXE Option ROM that is used by  
all Onboard and IO Module 10 GbE controllers.  
This option is grayed out and not accessible if the discs Option ROM is enabled or the 10 GbE FCoE  
Option ROM is enabled. It can co-exist with the 1 GbE PXE Option ROM or with an Infiniband*  
controller Option ROM.  
If the 10GbE PXE Option ROM is disabled, and no other Option ROM is enabled, the system cannot  
perform a Network Boot and cannot respond for Wake-on-LAN.  
This 10GbE PXE option does not appear unless there is a 10 GbE NIC installed in the system as an  
Onboard or IO Module NIC.  
Back to [NIC Configuration Screen] [PCI Configuration Screen] [Advanced Screen]  
4. FCoE 10GbE Option ROM  
Option Values:  
Enabled  
Disabled  
Help Text:  
Enable/Disable Onboard/IOM NIC FCoE Option ROM Load.  
Comments:  
This selection is to enable/disable the 10GbE FCoE Option ROM that is used by  
all Onboard and IO Module 10 GbE controllers capable of FCoE support. At the present time, only the  
Intel® 82599 10 Gigabit SFP+ NIC supports FCoE for this family of server boards.  
This option is grayed out and not accessible if the 10GbE PXE Option ROM is enabled or if the discs  
Option ROM is enabled. It can co-exist with the 1GbE PXE Option ROM or with an Infiniband* controller  
Option ROM.  
If the FCoE Option ROM is disabled, and no other Option ROM is enabled, the system cannot perform  
a Network Boot and cannot respond for Wake-on-LAN.  
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This FCoE option does not appear unless there is a FCoE-capable 10GbE NIC installed in the system  
as an Onboard or IO Module NIC.  
Back to [NIC Configuration Screen] [PCI Configuration Screen] [Advanced Screen]  
5. discs 1GbE/10GbE Option ROM  
Option Values:  
Enabled  
Disabled  
Help Text:  
Enable/Disable Onboard/IOM NIC discs Option ROM Load.  
Comments: This selection is to enable/disable the discs Option ROM that is used by all  
Onboard and IO Module 1 GbE and 10 GbE controllers.  
This option is grayed out and not accessible if the 1 GbE or 10GbE PXE Option ROM is enabled or if  
the 10 GbE FCoE Option ROM is enabled. It can co-exist with an Infiniband* controller Option ROM.  
If the discs Option ROM is disabled, and no other Option ROM is enabled, the system cannot perform a  
Network Boot and cannot respond for Wake-on-LAN.  
This discs option does not appear unless there is an discs-capable NIC installed in the system as an  
Onboard or IO Module NIC.  
Back to [NIC Configuration Screen] [PCI Configuration Screen] [Advanced Screen]  
6. Onboard NIC1 Type  
Onboard NIC2 Type  
Option Values:  
One of these strings:  
<Onboard NIC Description>  
Intel® 82574 Single-Port Gigabit Ethernet Controller  
Intel® I350 Dual-Port Gigabit Ethernet Controller  
Intel® I350 Quad-Port Gigabit Ethernet Controller  
Intel® I540 Dual-Port X540 10 Gigabit RJ-45 Controller  
Mellanox* ConnectX-3* Single-Port Infiniband* FD14 Controller  
Help Text:  
Comments:  
<None>  
Information only. This is a display showing which NICs are available as Network  
Controllers integrated into the baseboard. Each of these Onboard NICs will be followed by a section  
including a group of options that are specific to the type of NIC, either as an Ethernet controller or an  
Infiniband* controller.  
If a board only has one onboard NIC, the second NIC Type and following options section will not  
appear. If there is an Infiniband* controller integrated onboard, it will appear as NIC2.  
Back to [NIC Configuration Screen] [PCI Configuration Screen] [Advanced Screen]  
7. IO Module 1 Type  
IO Module 2 Type  
Option Values:  
One of these strings:  
<IO Module Description>  
Intel® I350 Quad-Port Gigabit Ethernet Module  
Intel® I540 Dual-Port X540 10 Gigabit RJ-45 Module  
Intel® 82599 Dual-Port 10 Gigabit SFP+ Module  
Mellanox* ConnectX-3* Single-Port Infiniband* FD14 Module  
Help Text:  
<None>  
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Comments:  
Information only. This is a display showing which Network Controllers on IO  
Modules are installed on the baseboard. Each of these IO Module NICs will be followed by a section  
including a group of options that are specific to the type of NIC, either as an Ethernet controller or an  
Infiniband* controller.  
This descriptive screen image shows an example of an InifiniBand* controller as IOM1. In a system with  
two IO Module connectors, an Infiniband* IO Module might be installed as either IOM1 or IOM2.  
Most boards have only one IO Module connector. In any case, an IO Module Type and following  
options section will only appear when an IO Module is installed, and a second IO Module Type and  
options section will only appear if there are two IO Modules installed.  
Back to [NIC Configuration Screen] [PCI Configuration Screen] [Advanced Screen]  
8. NIC1 Controller  
NIC2 Controller  
Option Values:  
Enabled  
Disabled  
Help Text:  
Enable/Disable Onboard Network Controller.  
Comments: This will completely disable Onboard Network Controller NIC1 or NIC2, along  
with all included NIC Ports and their associated options. That controller’s NIC Ports, Port PXE options,  
and Port MAC Address displays will not appear.  
This option only appears for onboard Ethernet controllers. It does not appear for onboard Infiniband*  
controllers.  
Ethernet controllers on IO Modules do not have a disabling function that can be controlled by BIOS, so  
there is no corresponding controller enable/disable option for an IOM Ethernet controller.  
Back to [NIC Configuration Screen] [PCI Configuration Screen] [Advanced Screen]  
9. NIC2 Infiniband* Option ROM  
10. IOM1 Infiniband* Option ROM  
IOM2 Infiniband* Option ROM  
Option Values:  
Enabled  
Disabled  
Help Text:  
Enable/Disable Infiniband* Controller Option ROM and FlexBoot.  
Comments:  
This option will control whether the associated Infiniband* Controller Option ROM  
is executed by BIOS during POST. This will also control whether the Infiniband* controller FlexBoot  
program appears in the list of bootable devices.  
This option only appears for Onboard or IO Module Infiniband* controllers. It does not appear for  
Ethernet controllers.  
Back to [NIC Configuration Screen] [PCI Configuration Screen] [Advanced Screen]  
11. NIC2 Port1 GUID  
12. IOM1 Port1 GUID  
IOM2 Port1 GUID  
Option Values:  
Help Text:  
<GUID Display>  
<None>  
Information only. 16 hex digits of the Port1 GUID of the Infiniband* controller for  
Comments:  
NIC2, IOM1, or IOM2.  
Back to [NIC Configuration Screen] [PCI Configuration Screen] [Advanced Screen]  
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13. NIC1 Port1  
14. NIC1 Port2  
15. NIC1 Port3  
NIC1 Port4  
16. NIC2 Port1  
17. NIC2 Port2  
18. NIC2 Port3  
NIC2 Port4  
Option Values:  
Enabled  
Disabled  
Help Text:  
Enable/Disable Onboard NIC<n> Port<x>.  
Comments: This will enable or disable Port<x, x = 1-4> of Onboard Network Controller<n, n =  
1-2>, including associated Port PXE options. The NIC<n> Port<x> PXE option and MAC Address  
display will not appear when that port is disabled.  
The associated port enable/disable options will not appear when NIC<n> is disabled.  
Only ports which actually exist for a particular NIC will appear in this section. That is, Port1-Port4 will  
appear for a quad-port NIC, Port1-Port2 will appear for a dual-port NIC, and only Port1 will appear for a  
single-port NIC.  
Network controllers installed on an IO Module do not have a port disabling function that is controlled by  
BIOS, so there are no corresponding options for IO Module NICs.  
Back to [NIC Configuration Screen] [PCI Configuration Screen] [Advanced Screen]  
19. NIC1 Port1 PXE  
20. NIC1 Port2 PXE  
21. NIC1 Port3 PXE  
NIC1 Port4 PXE  
22. NIC2 Port1 PXE  
23. NIC2 Port2 PXE  
24. NIC2 Port3 PXE  
NIC2 Port4 PXE  
25. IOM1 Port1 PXE  
26. IOM1 Port2 PXE  
27. IOM1 Port3 PXE  
IOM1 Port4 PXE  
28. IOM2 Port1 PXE  
29. IOM2 Port2 PXE  
30. IOM2 Port3 PXE  
IOM2 Port4 PXE  
Option Values:  
Enabled  
Disabled  
Help Text:  
Enable/Disable Onboard/IOM NIC Port PXE Boot  
Comments: This will enable or disable PXE Boot capability for Port<x, x = 1-4> of Onboard  
NIC<n, n = 1-2> or IO Module<n, n = 1-2>.  
This option will not appear for ports on a NIC which is disabled, or for individual ports when the  
corresponding NIC Port is disabled.  
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Only ports which actually exist for a particular NIC or IOM will appear in this section. That is, Port1-  
Port4 will appear for a quad-port NIC, Port1-Port2 will appear for a dual-port NIC, and only Port1 will  
appear for a single-port NIC.  
The default state of each Port PXE Boot option is Enabled, if the corresponding PXE Boot OPROM of  
the same speed is Enabled. If a PXE Boot OPROM for 1 GbE or 10 GbE changes from Disabled to  
Enabled, then the Port PXE Boot option becomes Enabled for all ports of that speed  
If the PXE Boot OPROM for1 GbE NICs or 10 GbE NICs is disabled, PXE Boot will be disabled and  
grayed out as unchangeable for all ports on NICs or IO Modules of that same speed.  
Conversely, if PXE Boot is disabled for all ports of a given speed, the corresponding PXE Option ROM  
will be disabled, but not grayed out since it could be selected.  
Back to [NIC Configuration Screen] [PCI Configuration Screen] [Advanced Screen]  
31. NIC1 Port1 MAC Address  
32. NIC1 Port2 MAC Address  
33. NIC1 Port3 MAC Address  
NIC1 Port4 MAC Address  
34. NIC2 Port1 MAC Address  
35. NIC2 Port2 MAC Address  
36. NIC2 Port3 MAC Address  
NIC2 Port4 MAC Address  
37. IOM1 Port1 MAC Address  
38. IOM1 Port2 MAC Address  
39. IOM1 Port3 MAC Address  
IOM1 Port4 MAC Address  
40. IOM2 Port1 MAC Address  
41. IOM2 Port2 MAC Address  
42. IOM2 Port3 MAC Address  
IOM2 Port4 MAC Address  
Option Values:  
Help Text:  
<Mac Address Display>  
<None>  
Information only. 12 hex digits of the MAC address of Port1- Port4 of the Network  
Comments:  
Controller corresponding to NIC1, NIC2, IOM1, or IOM2.  
This display will appear only for ports which actually exist on the corresponding Network Controller. If  
the Network Controller or port is disabled, the port MAC Address will not appear.  
Back to [NIC Configuration Screen] [PCI Configuration Screen] [Advanced Screen]  
12.2.2.8  
Serial Port Configuration  
The Serial Port Configuration screen allows the user to configure the Serial A and Serial B ports. In Legacy ISA  
nomenclature, these are ports COM1 and COM2 respectively.  
To access this screen from the Main screen, select Advanced > Serial Port Configuration. To move to  
another screen, press the <Esc> key to return to the Advanced screen, then select the desired screen.  
The primary usage for these serial ports is to enable Serial Console Redirection and Serial Over LAN (SOL)  
capabilities. Either port can be used for Serial Console Redirection, but SOL is only supported on Serial A. See  
Figure 55 for Console Redirection Configuration.  
The exception to this is the W2600CR Workstation, which does not provide a Serial A port. With W2600CR,  
Serial A will not appear for configuration here, and Serial B will support SOL functionality if required.  
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Advanced  
Serial Port Configuration  
Serial A Enable  
Address  
IRQ  
Enabled/Disabled  
3F8h/2F8h/3E8h/2E8h  
3/4  
Serial B Enable  
Address  
IRQ  
Enabled/Disabled  
3F8h/2F8h/3E8h/2E8h  
3/4  
Figure 50. Serial Port Configuration Screen  
Screen Field Descriptions:  
1. Serial A Enable  
Option Values:  
Enabled  
Disabled  
Help Text:  
Enable or Disable Serial port A.  
Comments:  
Redirection.  
Serial Port A can be used for either Serial Over LAN or Serial Console  
This Setup option should not appear on W2600CR, which does not provide a Serial A port.  
Back to [Serial Port Configuration Screen]  
2. Address  
Option Values:  
3F8h  
2F8h  
3E8h  
2E8h  
Help Text:  
Select Serial port A base I/O address.  
Comments: Legacy I/O port address. This field should not appear when Serial A port  
enable/disable does not appear.  
Back to [Serial Port Configuration Screen]  
3. IRQ  
Option Values:  
3
4
Help Text:  
Select Serial port A interrupt request (IRQ) line.  
Comments: Legacy IRQ. This field should not appear when Serial A port enable/disable does  
not appear.  
Back to [Serial Port Configuration Screen]  
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4. Serial B Enable  
Option Values:  
Enabled  
Disabled  
Help Text:  
Enable or Disable Serial port B.  
Comments: Serial Port B can be used for Serial Console Redirection. SOL cannot be routed  
to Serial B except on W2600CR boards, which do not have a Serial A port.  
Back to [Serial Port Configuration Screen]  
5. Address  
Option Values:  
3F8h  
2F8h  
3E8h  
2E8h  
Help Text:  
Select Serial port B base I/O address.  
Comments:  
Legacy I/O port address.  
Back to [Serial Port Configuration Screen]  
6. IRQ  
Option Values:  
3
4
Help Text:  
Select Serial port B interrupt request (IRQ) line.  
Comments:  
Legacy IRQ  
Back to [Serial Port Configuration Screen]  
12.2.2.9  
USB Configuration  
The USB Configuration screen allows the user to configure the available USB controller options.  
To access this screen from the Main screen, select Advanced > USB Configuration. To move to another  
screen, press the <Esc> key to return to the Advanced screen, then select the desired screen.  
This screen should display all USB Mass Storage devices which have been detected in the system. These  
include USB-attached Hard Disk Drives (HDDs), Floppy Disk Drives (FDDs), CDROM and DVDROM drives,  
and USB Flash Memory devices (USB Key, Keyfob, and so on).  
Each USB Mass Storage device may be set to allow the media emulation for which it is formatted, or an  
emulation may be specified. For USB Flash Memory devices in particular, there are some restrictions:  
.
.
.
A USB Key formatted as a CDROM drive will be recognized as an HDD.  
A USB Key formatted without a Partition Table will be forced to FDD emulation.  
A USB Key formatted with one Partition Table, and less than 528 MB in size, will be forced to FDD  
emulation – otherwise if it is 528 MB or greater in size, it will be forced to HDD emulation.  
Note: USB devices can be “hotplugged” during POST, and will be detected and “beeped”. They will be  
enumerated and displayed on this screen, though they may not be enumerated as bootable devices.  
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Advanced  
USB Configuration  
Detected USB Devices  
<Number of USB devices detected in system>  
USB Controller  
Enabled/Disabled  
Enabled/Disabled/Auto  
Enabled/Disabled  
Enabled/Disabled  
Legacy USB Support  
Port 60/64 Emulation  
Make USB Devices Non-Bootable  
USB Mass Storage Device Configuration  
Device Reset Timeout  
10 seconds/20 seconds/30 seconds/40 seconds  
Auto/Floppy/Forced FDD/Hard Disk/CD-ROM  
Mass Storage Devices:  
<Mass storage devices one line per device>  
Figure 51. USB Configuration Screen  
Screen Field Descriptions:  
1. Detected USB Devices  
Option Values:  
<Number of USB devices detected in system>  
<None>  
Information only. Displays the total number of USB devices of all types which  
Help Text:  
Comments:  
have been detected in POST.  
Back to [USB Configuration Screen]  
2. USB Controller  
Option Values:  
Enabled  
Disabled  
Help Text:  
[Enabled] - All on-board USB controllers are turned on and accessible by the OS.  
[Disabled] - All on-board USB controllers are turned off and inaccessible by the OS.  
Comments:  
When the USB controllers are Disabled, there is no USB IO available for either  
POST or the OS. In that case, all following fields on this screen are grayed out and inactive.  
Back to [USB Configuration Screen]  
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3. Legacy USB Support  
Option Values:  
Enabled  
Disabled  
Auto  
Help Text:  
Enables Legacy USB support. AUTO option disables legacy support if no USB devices are  
connected. Disable option will only keep USB Keyboard devices available for EFI applications.  
Comments:  
OS drivers.  
When Legacy USB Support is Disabled, USB devices are available only through  
If the USB controller setting is Disabled, this field is grayed out and inactive.  
Back to [USB Configuration Screen]  
4. Port 60/64 Emulation  
Option Values:  
Enabled  
Disabled  
Help Text:  
Enables I/O port 60h/64h emulation support.  
This may be needed for legacy USB keyboard support when using an OS that is USB unaware.  
Comments:  
Back to [USB Configuration Screen]  
5. Make USB Devices Non-Bootable  
If the USB controller setting is Disabled, this field is grayed out and inactive.  
Option Values:  
Enabled  
Disabled  
Help Text:  
Exclude USB in Boot Table.  
[Enabled]- This will remove all USB Mass Storage devices as Boot options.  
[Disabled] - This will allow all USB Mass Storage devices as Boot options.  
Comments:  
This is a security option. When Disabled, the system cannot be booted directly to  
a USB device of any kind. USB Mass Storage devices may still be used for data storage.  
If the USB controller setting is Disabled, this field is grayed out and inactive.  
Back to [USB Configuration Screen]  
6. Device Reset Timeout  
Option Values:  
10 seconds  
20 seconds  
30 seconds  
40 seconds  
Help Text:  
USB Mass Storage device Start Unit command timeout.  
Setting to a larger value provides more time for a mass storage device to be ready, if needed.  
Comments:  
If the USB controller setting is Disabled, this field is grayed out and inactive.  
Back to [USB Configuration Screen]  
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7. Mass Storage Devices:  
Option Values:  
Auto  
Floppy  
Forced FDD  
Hard Disk  
CD-ROM  
Help Text:  
[Auto] - USB devices less than 530 MB are emulated as floppies.  
[Forced FDD] - HDD formatted drive is emulated as an FDD (for example, ZIP drive).  
Comments:  
This field is hidden if no USB Mass Storage devices are detected.  
This setup screen can show a maximum of eight USB Mass Storage devices on the screen. If more  
than eight devices are installed in the system, the ‘USB Devices Enabled’ displays the correct count,  
but only the first eight devices discovered are displayed in this list.  
If the USB controller setting is Disabled, this field is grayed out and inactive.  
Back to [USB Configuration Screen]  
12.2.2.10  
System Acoustic and Performance Configuration  
The System Acoustic and Performance Configuration screen allows the user to configure the thermal control  
behavior of the system with respect to what parameters are used in the system’s Fan Speed Control  
algorithms.  
To access this screen from the Main screen, select Advanced > System Acoustic and Performance  
Configuration. To move to another screen, press the <Esc> key to return to the Advanced screen, then  
select the desired screen.  
Advanced  
System Acoustic and Performance Configuration  
Set Throttling Mode  
Altitude  
Auto/DCLTT/SCLTT/SOLTT  
300m or less/301m-900m/901m – 1500m/Higher than 1500m  
Performance/Acoustic  
Set Fan Profile  
Fan PWM Offset  
Quiet Fan Idle Mode  
[0 – 100, 0 is default]  
Enabled/Disabled  
Figure 52. System Acoustic and Performance Configuration  
Screen Field Descriptions:  
Set Throttling Mode  
Option Values:  
Auto  
DCLTT  
SCLTT  
SOLTT  
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Help Text:  
Sets Thermal Throttling mode for memory, to control fans and DRAM power as needed to  
control DIMM temperatures.  
[Auto] – BIOS selects mode. BIOS automatically detect and identify the appropriate thermal  
throttling mechanism based on DIMM type, airflow input, DIMM sensor availability.  
[DCLTT] – Dynamic Closed Loop Thermal Throttling.  
[SCLTT] – Static Closed Loop Thermal Throttling.  
[SOLTT] – Static Open Loop Thermal Throttling.  
Comments:  
The Thermal Throttling Mode chosen reflects whether the DIMMs have  
Temperature Sensors (TSOD), and whether the chassis is an Intel chassis for which thermal data are  
available. Note that this is for thermal throttling only, independent of any controls imposed for the  
purpose of power limiting.  
The server board provides support for system thermal management through open loop throttling (OLTT)  
and closed loop throttling (CLTT) of system memory. Normal system operation uses closed-loop  
thermal throttling (CLTT) and DIMM temperature monitoring as major factors in overall thermal and  
acoustics management. In the event that BIOS is unable to configure the system for CLTT, it defaults to  
open-loop thermal throttling (OLTT). In the OLTT mode, it is assumed that the DIMM temperature  
sensors are not available for fan speed control.  
Throttling levels are changed dynamically to cap throttling based on memory and system thermal  
conditions as determined by the system and DIMM power and thermal parameters. The BMC’s fan  
speed control functionality is linked to the memory throttling mechanism used.  
DCLTT is the expected mode for a board in an Intel chassis with inlet and outlet air  
temperature sensors and TSOD. The firmware can update the offset registers for closed  
loop during runtime, as BIOS sends the dynamic CLTT offset temperature data.  
SCLTT would be used with an OEM chassis and DIMMs with TSOD. The firmware does not  
change the offset registers for closed loop during runtime, although the Management Engine  
can do so.  
Both Static and Dynamic CLTT modes implement a Hybrid Closed Loop Thermal Throttling  
mechanism whereby the Integrated Memory Controller estimates the DRAM temperature in  
between actual reads of the memory thermal sensors.  
SOLTT is intended for a system with UDIMMs which do not have TSOD. The thermal control  
registers are configured during POST, and the firmware does not change them.  
Back to [System Acoustic and Performance Configuration]  
1. Altitude  
Option Values:  
300m or less  
301m-900m  
901m-1500m  
Higher than 1500m  
Help Text:  
[300m or less](980ft or less) Optimal near sea level.  
[301m-900m](980ft-2950ft) Optimal performance setting at moderate elevation.  
[901m-1500m](2950ft-4920ft) Optimal performance setting at high elevation.  
[Above 1500m](above 4920ft) Optimal performance setting at the highest elevations.  
Comments:  
This option sets an altitude value in order to choose a Fan Profile that is  
optimized for the air density at the current altitude at which the system is installed.  
Lower altitude selection can lead to potential thermal risk. And higher altitude selection provides better  
cooling but with undesired acoustic and fan power consumption. If the altitude is known, higher altitude  
is recommended in order to provide sufficient cooling.  
Back to [System Acoustic and Performance Configuration]  
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2. Set Fan Profile  
Option Values:  
Performance  
Acoustic  
Help Text:  
[Performance] - Fan control provides primary system cooling before attempting to throttle  
memory.  
[Acoustic] - The system will favor using throttling of memory over boosting fans to cool the  
system if thermal thresholds are met.  
Comments:  
This option allows the user to choose a Fan Profile that is optimized for  
maximizing performance or for minimizing acoustic noise.  
When Performance is selected, the thermal conditions in the system are controlled by raising fan speed  
when necessary to raise cooling performance. This provides cooling without impacting system  
performance, but may impact system acoustic performance – fans running faster are typically louder.  
The Performance mode is designed to provide sufficient cooling capability covering all kinds of add-in  
cards on the market.  
When Acoustic is selected, then rather than increasing fan speed for additional cooling, the system will  
attempt first to control thermal conditions by throttling memory to reduce heat production. This regulates  
the system’s thermal condition without changing the acoustic performance, but throttling memory may  
impact system performance. The Acoustic mode offers best acoustic experience and appropriate  
cooling capability covering mainstream and majority of the add-in cards.  
The BMC only supports enabling a fan profile through the command if that profile is supported on all fan  
domains defined for the given system. It is important to configure platform Sensor Data Records  
(SDRs) so that all desired fan profiles are supported on each fan domain. If no single profile is  
supported across all domains, the BMC, by default, uses profile 0 and does not allow it to be changed.  
Back to [System Acoustic and Performance Configuration]  
3. Fan PWM Offset  
Option Values:  
Help Text:  
[Entry Field 0 – 100, 0 is default]  
Valid Offset 0 - 100. This number is added to the calculated PWM value to increase Fan Speed.  
Comments:  
This is a percentage by which the calculated fan speed will be increased. The  
user can apply positive offsets that result in increasing the minimum fan speeds. This feature is valid  
when Quiet Fan Idle Mode is at Enabled state.  
Back to [System Acoustic and Performance Configuration]  
4. Quiet Fan Idle Mode  
Option Values:  
Enabled  
Disabled  
Help Text:  
Enabling this option allows the system fans to operate in Quiet ‘Fan off’ mode while still  
maintaining sufficient system cooling. In this mode, fan sensors become unavailable and cannot  
be monitored. There will be limited fan related event generation.  
Comments:  
When enabled, this option allows fans to idle or turn off when sufficient thermal  
margin is available, decreasing the acoustic noise produced by the system and decreasing system  
power consumption. Fans will run as needed to maintain thermal control. The actual decrease in fan  
speed depends on the system thermal loading, which in turn depends on system configuration and  
workload.  
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While Quiet Fan Idle Mode is engaged, fan sensors become unavailable and are not monitored by the  
BMC.  
Quiet Fan Idle Mode does not conflict with Fan PWM Offset (above) – they work in concert, with Fan  
PWM Offset applied to fans in Quiet Fan Idle Mode just as when the fans are operating in “normal  
mode”. A Fan PWM Offset of zero is necessary for fans to actually stop turning.  
Back to [System Acoustic and Performance Configuration]  
12.2.3  
Security Screen (Tab)  
The Security screen allows the user to enable and set the Administrator and User passwords and to lock out  
the front panel buttons so they cannot be used. This screen also allows the user to enable and activate the  
Trusted Platform Module (TPM) security settings on those boards that support TPM.  
Note that it is necessary to activate the TPM in order be able to enable Intel® Trusted Execution Technology  
(TXT) on boards that support it. Changing the TPM state in Setup will require a Hard Reset for the new state to  
become effective. For enabling Intel® TXT, see the Processor Configuration screen.  
This BIOS supports (but does not require) “Strong Passwords” for security. The “Strong Password” criteria for  
both Administrator and User passwords require that passwords be between 8 and 14 characters in length, and  
a password must contain at least one case-sensitive alphabetic character, one numeric character, and one  
special character. A warning is given when a password is set which does not meet the Strong Password  
criteria, but the password is accepted.  
For further security, the BIOS optionally may require a Power on Password to be entered in early POST in  
order to boot the system. When Power On Password is enabled, POST is halted soon after power on while the  
BIOS queries for a Power On Password. Either the Administrator or the User password may entered for a  
Power on Password.  
To access this screen from the Main screen or other top-level “Tab” screen, press the right or left arrow keys to  
traverse the tabs at the top of the Setup screen until the Security screen is selected.  
Main  
Advanced  
Security  
Server Management  
Boot Options  
Boot Manager  
Administrator Password Status  
User Password Status  
<Installed/Not Installed>  
<Installed/Not Installed>  
Set Administrator Password  
Set User Password  
[123aBcDeFgH$#@]  
[123aBcDeFgH$#@]  
Enabled/Disabled  
Power On Password  
Front Panel Lockout  
Enabled/Disabled  
TPM State  
<Displays current TPM Device State>  
TPM Administrative Control  
No Operation/Turn On/Turn Off/Clear Ownership  
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Figure 53. Security Screen  
Screen Field Descriptions:  
1. Administrator Password Status  
Option Values:  
Installed  
Not Installed  
Help Text:  
<None>  
Comments:  
Information only. Indicates the status of the Administrator Password.  
Back to [Security Screen]  
2. User Password Status  
Option Values:  
Installed  
Not Installed  
Help Text:  
<None>  
Information only. Indicates the status of the User Password.  
Comments:  
Back to [Security Screen]  
3. Set Administrator Password  
Option Values:  
[Entry Field – 0-14 characters]  
Help Text:  
Administrator password is used if Power On Password is enabled and to control change access  
in BIOS Setup. Length is 1-14 characters. Case sensitive alphabetic, numeric and special  
characters !@#$%^&*()-_+=? are allowed.  
Note: Administrator password must be set in order to use the User account.  
Comments:  
This password controls “change” access to Setup. The Administrator has full  
access to change settings for any Setup options, including setting the Administrator and User  
passwords.  
When Power On Password protection is enabled, the Administrator password may be used to allow the  
BIOS to complete POST and boot the system.  
Deleting all characters in the password entry field removes a password previously set. Clearing the  
Administrator Password also clears the User Password.  
If invalid characters are present in the password entered, it will not be accepted, and there will be  
popup error message:  
Password entered is not valid. Only case sensitive alphabetic, numeric and special  
characters !@#$%^&*()-_+=? are allowed.  
The Administrator and User passwords must be different. If the password entered is the same as the  
User password, it will not be accepted, and there will be popup error message:  
Password entered is not valid. Administrator and User passwords must be different.  
Strong passwords are encouraged, although not mandatory. If a password is entered which does not  
meet the “Strong Password” criteria, there will be a popup warning message:  
Warning – a Strong Password should include at least one each case sensitive alphabetic,  
numeric, and special character. Length should be 8 to 14 characters.  
Back to [Security Screen]  
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4. Set User Password  
Option Values:  
Help Text:  
[Entry Field – 0-14 characters]  
User password is used if Power On Password is enabled and to allow restricted access to BIOS  
Setup. Length is 1-14 characters. Case sensitive alphabetic, numeric and special  
characters !@#$%^&*()-_+=? are allowed.  
Note: Removing the administrator password also removes the user password.  
Comments:  
The User password is available only if the Administrator Password has been  
installed. This option protects Setup settings as well as boot choices. The User Password only allows  
limited access to the Setup options, and no choice of boot devices.  
When Power On Password protection is enabled, the User password may be used to allow the BIOS to  
complete POST and boot the system.  
The password format and entry rules and popup error and warning message are the same for the User  
password as for the Administrator password (see above).  
Back to [Security Screen]  
Power On Password  
Option Values:  
Help Text:  
Enabled  
Disabled  
Enable Power On Password support. If enabled, password entry is required in order to boot the  
system.  
Comments:  
When Power On Password security is enabled, the system will halt soon after  
power on and the BIOS will ask for a password before continuing POST and booting. Either the  
Administrator or User password may be used.  
If an Administrator password has not been set, this option will be grayed out and unavailable. If this  
option is enabled and the Administrator password is removed, that will also disable this option.  
Back to [Security Screen]  
5. Front Panel Lockout  
Option Values:  
Enabled  
Disabled  
Help Text:  
If enabled, locks the power button OFF function and the reset and NMI Diagnostic Interrupt  
buttons on the system’s front panel. If [Enabled] is selected, power off and reset must be  
controlled from a system management interface, and the NMI Diagnostic Interrupt is not  
available.  
Comments:  
Note: This option does not appear on all boards.  
Back to [Security Screen]  
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6. TPM State  
Option Values:  
<Displays current TPM Device State>  
May be:  
Enabled & Activated  
Enabled & Deactivated  
Disabled & Activated  
Disabled & Deactivated  
Help Text:  
<None>  
Information only. Shows the current TPM device state.  
Comments:  
A Disabled TPM device does not execute commands that use the TPM functions and TPM  
security operations are not available.  
An Enabled & Deactivated TPM is in the same state as a disabled TPM, except that setting of  
the TPM ownership is allowed if it is not present already.  
An Enabled & Activated TPM executes all commands that use the TPM functions and TPM  
security operations are also available.  
Note: This option appears only on boards equipped with a TPM.  
Back to [Security Screen]  
7. TPM Administrative Control  
Option Values:  
No Operation  
Turn On  
Turn Off  
Clear Ownership  
Help Text:  
[No Operation] - No changes to current state.  
[Turn On] - Enables and activates TPM.  
[Turn Off] - Disables and deactivates TPM.  
[Clear Ownership] - Removes TPM ownership & returns TPM to factory default state.  
Note: Setting returns to [No Operation] on every boot.  
Comments:  
Any Administrative Control operation selected will require the system to perform  
a Hard Reset in order to become effective.  
Note: This option appears only on boards equipped with a TPM.  
Back to [Security Screen]  
12.2.4  
Server Management Screen (Tab)  
The Server Management screen allows the user to configure several server management features. This screen  
also provides an access point to the screens for configuring Console Redirection, displaying system  
information, and controlling the BMC LAN configuration.  
To access this screen from the Main screen or other top-level “Tab” screen, press the right or left arrow keys to  
traverse the tabs at the top of the Setup screen until the Server Management screen is selected.  
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Main  
Advanced  
Security  
Server Management  
Boot Options  
Boot Manager  
Assert NMI on SERR  
Assert NMI on PERR  
PCIe AER Support  
Enabled / Disabled  
Enabled / Disabled  
Enabled / Disabled  
Enabled / Disabled  
Log Correctable Errors  
Reset on CATERR  
Reset on ERR2  
Enabled / Disabled  
Enabled / Disabled  
Resume on AC Power Loss  
Power Restore Delay  
Stay Off / Last State / Power On  
Disabled / Auto / Fixed  
Power Restore Delay Value  
Clear System Event Log  
FRB-2 Enable  
[25 – 300s, 25 is default]  
Enabled / Disabled  
Enabled / Disabled  
OS Boot Watchdog Timer  
Enabled / Disabled  
Power off / Reset  
OS Boot Watchdog Timer Policy  
OS Boot Watchdog Timer Timeout  
5 minutes / 10 minutes / 15 minutes / 20 minutes  
Plug & Play BMC Detection  
Enabled / Disabled  
EuP LOT6 Off-Mode  
Shutdown Policy  
Enabled / Disabled  
Enabled / Disabled  
Console Redirection  
System Information  
BMC LAN Configuration  
Figure 54. Server Management Screen  
Screen Field Descriptions:  
1. Assert NMI on SERR  
Option Values:  
Enabled  
Disabled  
Help Text:  
On SERR, generate an NMI and log an error.  
Note: [Enabled] must be selected for the Assert NMI on PERR setup option to be visible.  
Comments:  
This option allows the system to generate an NMI when an SERR occurs, which  
is a method Legacy Operating System error handlers may use instead of processing a Machine Check.  
Back to [Server Management Screen]  
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2. Assert NMI on PERR  
Option Values:  
Enabled  
Disabled  
Help Text:  
On PERR, generate an NMI and log an error.  
Note: This option is only active if the Assert NMI on SERR option has [Enabled] selected.  
Comments:  
This option allows the system to generate an NMI when a PERR occurs, which is  
a method Legacy Operating System error handlers may use instead of processing a Machine Check.  
Back to [Server Management Screen]  
3. PCIe AER Support  
Option Values:  
Enabled  
Disabled  
Help Text:  
[Enabled] – PCIe AER (Advanced Error Reporting) is enabled.  
[Disabled] – PCIe AER is disabled. All PCIe AER errors will be masked once PCIe AER is  
disabled.  
Comments:  
This option allows the system to monitor and handle PCIe AER errors on PCIe  
devices with PCIe AER support. But as PCIe AER is described in PCI Express Base Specification, any  
third-party software or OS could override this BIOS policy and take ownership of PCIe AER handling  
after BIOS POST.  
Back to [Server Management Screen]  
4. Log Correctable Errors  
Option Values:  
Enabled  
Disabled  
Help Text:  
[Enabled] – Processor & PCH PCIe correctable error logging is enabled.  
[Disabled]– Processor & PCH PCIe correctable error logging is disabled.  
Comments:  
This option allows the system to monitor and handle PCIe correctable errors on  
PCIe devices behind Processor and PCH.  
Back to [Server Management Screen]  
5. Reset on CATERR  
Option Values:  
Enabled  
Disabled  
Help Text:  
When enabled system gets reset upon encountering Catastrophic Error (CATERR); when  
disabled system does not get reset on CATERR.  
Comments:  
This option controls whether the system will be reset when the “Catastrophic  
Error” CATERR# signal is held asserted, rather than just pulsed to generate an SMI. This indicates that  
the processor has encountered a fatal hardware error.  
Note: If “Reset on CATERR” is Disabled, this can result in a system hang for certain error conditions,  
possibly with the system unable to update the System Status LED or log an error to the SEL before  
hanging.  
Back to [Server Management Screen]  
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6. Reset on ERR2  
Option Values:  
Enabled  
Disabled  
Help Text:  
When enabled system gets reset upon encountering ERR2 (Fatal error); when disabled system  
does not get reset on ERR2  
Comments:  
This option controls whether the system will be reset if the BMC’s ERR2 Monitor  
times out, that is, the ERR2 signal has been continuously asserted long enough to indicate that the SMI  
Handler is not able to service the condition  
Note: If “Reset on ERR2” is Disabled, this can result in a system hang for certain error conditions,  
possibly with the system unable to update the System Status LED or log an error to the SEL before  
hanging.  
Back to [Server Management Screen]  
7. Resume on AC Power Loss  
Option Values:  
Help Text:  
Stay Off  
Last State  
Power On  
System action to take on AC power loss recovery.  
[Stay Off] - System stays off.  
[Last State] - System returns to the same state before the AC power loss.  
[Power On] - System powers on.  
Comments:  
This option controls the policy that the BMC will follow when AC power is  
restored after an unexpected power outage. The BMC will either hold DC power off or always turn it on  
to boot the system, depending on this setting – and in the case of Last State, depending on whether  
the power was on and the system was running before the AC power went off.  
When this setting is changed in Setup, the new setting will be sent to the BMC. However, the BMC  
maintains (“owns”) this Power Restore Policy setting, and it can be changed independently with an IPMI  
command to the BMC. BIOS gets this setting from the BMC early in POST, and also for the Setup  
Server Management screen.  
Back to [Server Management Screen]  
8. Power Restore Delay  
Option Values:  
Disabled  
Auto  
Fixed  
Help Text:  
Allows a delay in powering up after a power failure, to reduce peak power requirements. The  
delay can be fixed or automatic between 25-300 seconds.  
Comments:  
When the AC power resume policy (above) is either Power On or Last State,  
this option allows a delay to be taken after AC power is restored before the system actually begins to  
power up. This delay can be either a fixed time or an “automatic” time, where “automatic” means that  
the BIOS will select a randomized delay time of 25-300 seconds when it sends the Power Restore  
Delay setting to the BMC.  
This option will be grayed out and unavailable when the AC power resume policy is Stay Off.  
The Power Restore Delay setting is maintained by BIOS. This setting does not take effect until a reboot  
is done. Early in POST, the Power Restore Policy is read from the BMC, and if the policy is Power On  
or Last State, the delay settings are sent to the BMC.  
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Bear in mind that even if the Power Restore Delay is Disabled, there will still be a delay of about 20  
seconds while the BMC itself boots up after AC power is restored.  
Note: This Power Restore Delay option applies only to powering on when AC is applied. It has no effect  
on powering the system up using the Power Button on the Front Panel. A DC power on using the  
Power Button is not delayed.  
The purpose of this delay is to avoid having all systems draw “startup surge” power at the same time.  
Different systems or racks of systems can be set to different delay times to spread out the startup  
power draws. Alternatively, all systems can be set to Automatic, and then each system will wait for a  
random period before powering up.  
Back to [Server Management Screen]  
9. Power Restore Delay Value  
Option Values:  
Help Text:  
[Entry Field 25 – 300, 25 is default]  
Fixed time period 25-300 seconds for Power Restore Delay.  
Comments:  
When the power restore policy is Power On or Last State, and the Power  
Restore Delay selection is Fixed, this field allows for specifying how long in seconds that fixed delay  
will be.  
When the Power Restore Delay is Disabled or Auto, this field will be grayed out and unavailable.  
The Power Restore Delay Value setting is maintained by BIOS. This setting does not take effect until  
a reboot is done. Early in POST, the Power Restore Policy is read from the BMC, and if the policy is  
Power On or Last State, the delay settings are sent to the BMC. When the Power Restore Delay  
setting is Fixed, this delay value is used to provide the length of the delay.  
Back to [Server Management Screen]  
10. Clear System Event Log  
Option Values:  
Enabled  
Disabled  
Help Text:  
If enabled, clears the System Event Log. All current entries will be lost.  
Note: This option is reset to [Disabled] after a reboot.  
Comments:  
This option sends a message to the BMC to request it to clear the System Event  
Log. The log will be cleared, and then the “Clear” action itself will be logged as an event. This give the  
user a time/date for when the log was cleared.  
Back to [Server Management Screen]  
11. FRB-2 Enable  
Option Values:  
Enabled  
Disabled  
Help Text:  
Fault Resilient Boot (FRB).  
BIOS programs the BMC watchdog timer for approximately 6 minutes. If BIOS does not  
complete POST before the timer expires, the BMC will reset the system.  
Comments:  
This option controls whether the system will be reset if the BMC Watchdog Timer  
detects what appears to be a hang during POST. When the BMC Watchdog Timer is purposed as an  
FRB-2 timer, it is initially set to allow 6 minutes for POST to complete.  
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However, the FRB-2 Timer is suspended during times when some lengthy operations are in progress,  
like executing Option ROMS, during Setup, and when BIOS is waiting for a password. or for input to the  
F6 BBS Boot Menu. The FRB-2 Timer is also suspended while POST is paused with the <Pause> key.  
Back to [Server Management Screen]  
12. OS Boot Watchdog Timer  
Option Values:  
Enabled  
Disabled  
Help Text:  
BIOS programs the watchdog timer with the timeout value selected. If the OS does not complete  
booting before the timer expires, the BMC will reset the system and an error will be logged.  
Requires OS support or Intel Management Software Support.  
Comments:  
This option controls whether the system will set the BMC Watchdog to detect an  
appearent to be a hang during OS booting. BIOS sets the timer before starting the OS bootstrap load  
procedure. If the OS Load Watchdog Timer times out, then presumably the OS failed to boot properly.  
If the OS does boot up successfully, it must be aware of the OS Load Watchdog Timer and immediately  
turn it off before it expires. The OS may turn off the timer, or more often the timer may be repurposed  
as an OS Watchdog Timer to protect against runtime OS hangs.  
Unless the OS does have timer-aware software to support the OS Load Watchdog Timer, the system  
will be unable to boot successfully with the OS Load Watchdog Timer enabled. When the timer expires  
without having been reset or turned off, the system will either reset or power off repeatedly.  
Back to [Server Management Screen]  
13. OS Boot Watchdog Timer Policy  
Option Values:  
Power off  
Reset  
Help Text:  
If the OS watchdog timer is enabled, this is the system action taken if the watchdog timer  
expires.  
[Reset] - System performs a reset.  
[Power Off] - System powers off.  
Comments:  
disabled.  
This option is grayed out and unavailable when the O/S Boot Watchdog Timer is  
Back to [Server Management Screen]  
14. OS Boot Watchdog Timer Timeout  
Option Values:  
5 minutes  
10 minutes  
15 minutes  
20 minutes  
Help Text:  
If the OS watchdog timer is enabled, this is the timeout value BIOS will use to configure the  
watchdog timer.  
Comments:  
disabled.  
This option is grayed out and unavailable when the O/S Boot Watchdog Timer is  
Back to [Server Management Screen]  
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15. Plug & Play BMC Detection  
Option Values:  
Enabled  
Disabled  
Help Text:  
If enabled, the BMC will be detectable by OSes which support plug and play loading of an IPMI  
driver. Do not enable this option if your OS does not support this driver.  
Comments:  
This option controls whether the OS Server Management Software will be able to  
find the BMC and automatically load the correct IPMI support software for it. If your OS does not  
support Plug & Play for the BMC, you will not have the correct IPMI driver software loaded.  
Back to [Server Management Screen]  
EuP LOT6 Off-Mode  
Option Values:  
Help Text:  
Enabled  
Disabled  
Enable/disable Ecodesign EuP LOT6 “Deep Sleep” Off-Mode for near-zero energy use when  
powered off.  
Comments:  
This option controls whether the system goes into “Deep Sleep” or more  
conventional S5 “Soft-Off” when powered off. “Deep Sleep” state uses less energy than S5, but S5 can  
start up faster and can allow a Wake on LAN action (which cannot be done from a Deep Sleep state).  
This option will not appear on platforms which do not support EuP LOT6 Off-Mode.  
Back to [Server Management Screen]  
16. Shutdown Policy  
Option Values:  
Enabled  
Disabled  
Help Text:  
Enable/Disable Shutdown Policy.  
Comments:  
This option is designed for multiple-node system and to control the policy that  
BMC should shutdown one node if it detected over-current or over-temperature condition. The BIOS  
and the BMC will synchronize the policy during the BIOS POST and current value of the BMC will be  
displayed in BIOS Setup.  
This option is only displayed when the BMC support this feature on the node.  
Back to [Server Management Screen]  
17. Console Redirection  
Option Values:  
Help Text:  
<None>  
View/Configure Console Redirection information and settings.  
Selection only. Position to this line and press the <Enter> key to go to the  
Comments:  
Console Redirection group of configuration settings.  
Back to [Server Management Screen]  
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18. System Information  
Option Values:  
Help Text:  
<None>  
View System Information.  
Comments:  
Selection only. Position to this line and press the <Enter> key to go to the  
System Information group of configuration settings.  
Back to [Server Management Screen]  
19. BMC LAN Configuration  
Option Values:  
Help Text:  
<None>  
View/Configure BMC LAN and user settings.  
Selection only. Position to this line and press the <Enter> key to go to the BMC  
Comments:  
LAN Configuration group of configuration settings.  
Back to [Server Management Screen]  
12.2.4.1  
Console Redirection  
The Console Redirection screen allows the user to enable or disable Console Redirection for Remote System  
Management, and to configure the connection options for this feature.  
To access this screen from the Main screen, select Server Management > Console Redirection. To move to  
another screen, press the <Esc> key to return to the Server Management screen, then select the desired  
screen.  
When Console Redirection is active, all POST and Setup displays are in Text Mode. The Quiet Boot setting is  
disregarded, and the Text Mode POST Diagnostic Screen will be displayed regardless of the Quiet Boot setting.  
This is due to the limitations of Console Redirection, which is based on data terminal emulation using a serial  
data interface to transfer character data.  
Console Redirection can use either of the two Serial Ports provided by the SuperIO in the BMC. However, if  
Console Redirection is to be coordinated with Serial Over LAN, the user should be aware that SOL is only  
supported through Serial Port A (except for W200CR, which only has Serial B and supports SOL on Serial B).  
Server Management  
Console Redirection  
Console Redirection  
Flow Control  
Disabled/Serial Port A/Serial Port B  
None/RTS/CTS  
Baud Rate  
9.6k/19.2k/38.4k/57.6k/115.2k  
PC-ANSI/VT100/VT100+/VT-UTF8  
Enabled/Disabled  
Terminal Type  
Legacy OS Redirection  
Terminal Resolution  
80x24/100x31  
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Figure 55. Console Redirection Screen  
Screen Field Descriptions:  
1. Console Redirection  
Option Values:  
Disabled  
Serial Port A  
Serial Port B  
Help Text:  
Console redirection allows a serial port to be used for server management tasks.  
[Disabled] - No console redirection.  
[Serial Port A] - Configure serial port A for console redirection.  
Enabling this option will disable display of the Quiet Boot logo screen during POST.  
Comments:  
Serial Console Redirection can use either Serial Port A or Serial Port B. If SOL is  
also going to be configured, note that SOL is only supported through Serial Port A (with the exception  
of W2600CR, which only has Serial B so supports SOL on Serial B).  
When Console Redirection is set to Disabled, all other options on this screen will be grayed out and  
unavailable.  
Only Serial Ports which are Enabled should be available to choose for Console Redirection. If neither  
Serial A nor Serial B is set to Enabled, then Console Redirection will be forced to Disabled, and grayed  
out as inactive. In that case, all other options on this screen will also be grayed  
Back to [Console Redirection Screen] [Server Management Screen]  
2. Flow Control  
Option Values:  
None  
RTS/CTS  
Help Text:  
Flow control is the handshake protocol.  
This setting must match the remote terminal application.  
[None] - Configure for no flow control.  
[RTS/CTS] - Configure for hardware flow control.  
Comments:  
Flow control is necessary only when there is a possibility of data overrun. In that  
case the Request To Send/Clear to Send (RTS/CTS) hardware handshake is a relatively conservative  
protocol which can usually be configured at both ends.  
When Console Redirection is set to Disabled, this option will be grayed out and unavailable.  
Back to [Console Redirection Screen] [Server Management Screen]  
3. Baud Rate  
Option Values:  
9.6k  
19.2k  
38.4k  
57.6k  
115.2k  
Help Text:  
Serial port transmission speed. This setting must match the remote terminal application.  
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Comments:  
In most modern Server Management applications, serial data transfer is  
consolidated over an alternative faster medium like LAN, and 115.2k is the speed of choice.  
When Console Redirection is set to Disabled, this option will be grayed out and unavailable.  
Back to [Console Redirection Screen] [Server Management Screen]  
4. Terminal Type  
Option Values:  
PC-ANSI  
VT100  
VT100+  
VT-UTF8  
Help Text:  
Character formatting used for console redirection. This setting must match the remote terminal  
application.  
Comments:  
The VT100 and VT100+ terminal emulations are essentially the same. VT-UTF8  
is a UTF8 encoding of VT100+. PC-ANSI is the native character encoding used by PC-compatible  
applications and emulators.  
When Console Redirection is set to Disabled, this option will be grayed out and unavailable.  
Back to [Console Redirection Screen] [Server Management Screen]  
5. Legacy OS Redirection  
Option Values:  
Enabled  
Disabled  
Help Text:  
This option enables legacy OS redirection (that is, DOS) on serial port. If it is enabled, the  
associated serial port is hidden from the legacy OS.  
Comments:  
Operating Systems which are “redirection-aware” implement their own Console  
Redirection mechanisms. For a Legacy OS which is not “aware”, this option allows the BIOS to handle  
redirection.  
When Console Redirection is set to Disabled, this option will be grayed out and unavailable.  
Back to [Console Redirection Screen] [Server Management Screen]  
6. Terminal Resolution  
Option Values:  
80x24  
100x31  
Help Text:  
Remote Terminal Resolution  
Comments: This option allows the use of a larger terminal screen area, although it does not  
change Setup displays to match.  
When Console Redirection is set to Disabled, this option will be grayed out and unavailable.  
Back to [Console Redirection Screen] [Server Management Screen]  
12.2.4.2  
System Information  
The System Information screen allows the user to view part numbers, serial numbers, and firmware revisions.  
This is an Information Only screen.  
To access this screen from the Main screen, select Server Management > System Information. To move to  
another screen, press the <Esc> key to return to the Server Management screen, then select the desired  
screen.  
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Server Management  
System Information  
Board Part Number  
Board Serial Number  
System Part Number  
System Serial Number  
Chassis Part Number  
Chassis Serial Number  
Asset Tag  
<Part Number display>  
<Serial Number display>  
<Part Number display>  
<Serial Number display>  
<Part Number display>  
<Serial Number display>  
<Asset Tag-display>  
<BMC FW Rev display>  
<ME FW Rev display>  
<SDR Rev display>  
BMC Firmware Revision  
ME Firmware Revision  
SDR Revision  
UUID  
<UUID display>  
Figure 56. System Information Screen  
Screen Field Descriptions:  
1. Board Part Number  
Option Values:  
<Part Number display>  
Help Text:  
<None>  
Information only.  
Comments:  
Back to [System Information Screen] [Server Management Screen]  
2. Board Serial Number  
Option Values:  
Help Text:  
<Serial Number display>  
<None>  
Information only.  
Comments:  
Back to [System Information Screen] [Server Management Screen]  
3. System Part Number  
Option Values:  
Help Text:  
<Part Number display>  
<None>  
Information only.  
Comments:  
Back to [System Information Screen] [Server Management Screen]  
4. System Serial Number  
Option Values:  
Help Text:  
<Serial Number display>  
<None>  
Information only.  
Comments:  
Back to [System Information Screen] [Server Management Screen]  
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5. Chassis Part Number  
Option Values:  
Help Text:  
<Part Number display>  
<None>  
Information only.  
Comments:  
Back to [System Information Screen] [Server Management Screen]  
6. Chassis Serial Number  
Option Values:  
Help Text:  
<Serial Number display>  
<None>  
Information only.  
Comments:  
Back to [System Information Screen] [Server Management Screen]  
7. Asset Tag  
Option Values:  
<Asset Tag-display>  
<None>  
Information only.  
Help Text:  
Comments:  
Back to [System Information Screen] [Server Management Screen]  
8. BMC Firmware Revision  
Option Values:  
Help Text:  
<BMC FW Rev display>  
<None>  
Information only.  
Comments:  
Back to [System Information Screen] [Server Management Screen]  
9. ME Firmware Revision  
Option Values:  
Help Text:  
<ME FW Rev display>  
<None>  
Information only.  
Comments:  
Back to [System Information Screen] [Server Management Screen]  
10. SDR Revision  
Option Values:  
Help Text:  
<SDR Rev display>  
<None>  
Information only.  
Comments:  
Back to [System Information Screen] [Server Management Screen]  
11. UUID  
Option Values:  
<UUID display>  
<None>  
Information only.  
Help Text:  
Comments:  
Back to [System Information Screen] [Server Management Screen]  
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BIOS Setup Utility  
12.2.4.3  
BMC LAN Configuration  
To access this screen from the Main screen, select Server Management > System Information. To move to  
another screen, press the <Esc> key to return to the Server Management screen, then select the desired  
screen.  
The BMC configuration screen allows the user to configure the BMC Baseboard LAN channel and an Intel®  
RMM4 LAN channel, and to manage BMC User settings for up to five BMC Users.  
An Intel® RMM4 Management Module may be installed in the server system.  
If the Management Module is installed, it may also have a Dedicated Server Management NIC Module (DMN)  
installed with it. In that case, the LAN settings for the Intel®RMM4 with Dedicated Server Management NIC  
may be configured.  
When there is no Management Module installed in the system, or there is an Intel® RMM4-Lite without a DMN  
installed, the LAN settings specific to the Intel® RMM4 are grayed out and not available.  
This screen has a choice of IPv4 or IPv6 addressing. When IPv6 is disabled, only the IPv4 addressing options  
appear. When IPv6 is enabled, the IPv4 options are grayed out and unavailable, and there is an additional  
section active for IPv6-addressing. This is true for both the Baseboard LAN configuration and the Intel® RMM4  
with Dedicated Server Management NIC Module.  
IP addresses for either IPv4 or IPv6 addressing can be assigned by static IP addresses manually typed in, or  
by dynamic IP addresses supplied by a Dynamic Host Configuration Protocol (DHCP) server. IPv6 addressing  
can also be provided by “stateless autoconfiguration” which does not require a DHCP server.  
The BMC LAN Configuration screen is unusual in that the LAN Configuration parameters are maintained by the  
BMC itself, so this screen is just a User Interface to the BMC configuration. As such, the initial values of the  
LAN options shown on the screen are acquired from the BMC when this screen is initially accessed by a user,.  
Any values changed by the user are communicated back to the BMC when a “Save Changes” or “Save  
Changes and Exit” action is performed. If a “Discard Changes” or “Discard Changes and Exit” action is  
performed instead, any accumulated changes from this screen will be disregarded and lost.  
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Server Management  
BMC LAN Configuration  
Baseboard LAN configuration  
IP Source  
IP Address  
Static/Dynamic  
[0.0.0.0]  
Subnet Mask  
[0.0.0.0]  
Gateway IP  
[0.0.0.0]  
Baseboard LAN IPv6 configuration  
IPv6  
Enabled/Disabled  
IPv6 Source  
Static/Dynamic/Auto  
IPv6 Address  
Gateway IPv6  
IPv6 Prefix Length  
[0000.0000.0000.0000.0000.0000.0000.0000]  
[0000.0000.0000.0000.0000.0000.0000.0000]  
[0 – 128, 64 is default]  
Intel(R) RMM4 LAN configuration  
Intel® RMM4  
<Not Present/Intel(R) RMM4-Lite/Intel(R) RMM4 + DMN>  
IP Source  
IP Address  
Static/Dynamic  
[0.0.0.0]  
Subnet Mask  
[0.0.0.0]  
Gateway IP  
[0.0.0.0]  
Intel(R) RMM4 LAN IPv6 configuration  
IPv6 Source  
Static/Dynamic/Auto  
IPv6 Address  
Gateway IPv6  
IPv6 Prefix Length  
[0000.0000.0000.0000.0000.0000.0000.0000]  
[0000.0000.0000.0000.0000.0000.0000.0000]  
[0 – 128, 64 is default]  
BMC DHCP Host Name  
[DHCP Host Name display/edit]  
User Configuration  
User ID  
Privilege  
User Status  
User Name  
User Password  
anonymous/root/User3/User4/User5  
Callback/ User/Operator/Administrator  
Disable/Enable  
[User Name display/edit]  
Figure 57. BMC LAN Configuration Screen  
Screen Field Descriptions:  
IP Source  
Option Values:  
Static  
Dynamic  
Help Text:  
Select BMC IP Source: If [Static], IP parameters may be edited. If [Dynamic], these fields are  
display-only and IP address is acquired automatically (DHCP).  
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Comments:  
This specifies the IP Source for IPv4 addressing for the Baseboard LAN. There is  
a separate IP Source field for the Intel® RMM4 LAN configuration.  
When IPv4 addressing is used, the initial value for this field is acquired from the BMC, and its setting  
determines whether the other Baseboard LAN IPv4 addressing fields are display-only (when Dynamic)  
or can be edited (when Static).  
When IPv6 addressing is enabled, this field is grayed out and inactive.  
Back to [BMC LAN Configuration Screen] [Server Management Screen]  
1. IP Address  
Option Values:  
[Entry Field 0.0.0.0, 0.0.0.0 is default]  
Help Text:  
View/Edit IP Address. Press <Enter> to edit.  
Comments:  
This specifies the IPv4 Address for the Baseboard LAN. There is a separate IPv4  
Address field for the Intel® RMM4 LAN configuration.  
When IPv4 addressing is used, the initial value for this field is acquired from the BMC. The setting of IP  
Source determines whether this field is display-only (when Dynamic) or can be edited (when Static).  
When IPv6 addressing is enabled, this field is grayed out and inactive.  
Back to [BMC LAN Configuration Screen] [Server Management Screen]  
2. Subnet Mask  
Option Values:  
Help Text:  
[Entry Field 0.0.0.0, 0.0.0.0 is default]  
View/Edit Subnet Mask. Press <Enter> to edit.  
Comments:  
This specifies the IPv4 addressing Subnet Mask for the Baseboard LAN. There is  
a separate IPv4 Subnet Mask field for the Intel® RMM4 LAN configuration.  
When IPv4 addressing is used, the initial value for this field is acquired from the BMC. The setting of IP  
Source determines whether this field is display-only (when Dynamic) or can be edited (when Static).  
When IPv6 addressing is enabled, this field is grayed out and inactive.  
Back to [BMC LAN Configuration Screen] [Server Management Screen]  
3. Gateway IP  
Option Values:  
Help Text:  
[Entry Field 0.0.0.0, 0.0.0.0 is default]  
View/Edit Gateway IP. Press <Enter> to edit.  
Comments:  
This specifies the IPv4 addressing Gateway IP for the Baseboard LAN. There is  
a separate IPv4 Gateway IP field for the Intel® RMM4 LAN configuration.  
When IPv4 addressing is used, the initial value for this field is acquired from the BMC. The setting of IP  
Source determines whether this field is display-only (when Dynamic) or can be edited (when Static).  
When IPv6 addressing is enabled, this field is grayed out and inactive.  
Back to [BMC LAN Configuration Screen] [Server Management Screen]  
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4. IPv6  
Option Values:  
Enabled  
Disabled  
Help Text:  
Option to Enable/Disable IPv6 addressing and any IPv6 network traffic on these channels.  
Comments: The initial value for this field is acquired from the BMC. It may be changed in  
order to switch between IPv4 and IPv6 addressing technologies.  
When this option is set to Disabled, all other IPv6 fields will not be visible for the Baseboard LAN and  
Intel® RMM4 DMN (if installed). When IPv6 addressing is Enabled, all IPv6 fields for the Baseboard  
LAN and Intel® RMM4 DMN will become visible, and all IPv4 fields will be grayed out and inactive.  
Back to [BMC LAN Configuration Screen] [Server Management Screen]  
5. IPv6 Source  
Option Values:  
Static  
Dynamic  
Auto  
Help Text:  
Select BMC IPv6 source: If [Static], IPv6 parameters may be edited. If [Dynamic], these fields  
are display-only and IPv6 address is acquired automatically (DHCP). If [Auto], these fields are  
display-only and IPv6 address is acquired using ICMPv6 router/neighbor discovery.  
Comments:  
This specifies the IP Source for IPv6 addressing for the Baseboard LAN  
configuration. There is a separate IPv6 Source field for the Intel® RMM4 LAN configuration.  
This option is only visible when the IPv6 option is set to Enabled.  
When IPv6 addressing is Enabled, the initial value for this field is acquired from the BMC, and its  
setting determines whether the other Baseboard LAN IPv6 addressing fields are display-only (when  
Dynamic or Auto) or can be edited (when Static).  
Back to [BMC LAN Configuration Screen] [Server Management Screen]  
6. IPv6 Address  
Option Values:  
[Entry Field 0000.0000.0000.0000.0000.0000.0000.0000,  
0000.0000.0000.0000.0000.0000.0000.0000 is default]  
Help Text:  
View/Edit IPv6 address. Press <Enter> to edit. IPv6 addresses consist of 8 hexadecimal 4 digit  
numbers separated by colons.  
Comments:  
This specifies the IPv6 Address for the Baseboard LAN. There is a separate IPv6  
Address field for the Intel® RMM4 LAN configuration.  
This option is only visible when the IPv6 option is set to Enabled.  
When IPv6 addressing is used, the initial value for this field is acquired from the BMC. The setting of  
IPv6 Source determines whether this field is display-only (when Dynamic or Auto) or can be edited  
(when Static).  
Back to [BMC LAN Configuration Screen] [Server Management Screen]  
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7. Gateway IPv6  
Option Values:  
[Entry Field 0000.0000.0000.0000.0000.0000.0000.0000,  
0000.0000.0000.0000.0000.0000.0000.0000 is default]  
Help Text:  
View/Edit Gateway IPv6 address. Press <Enter> to edit. Gateway IPv6 addresses consist of 8  
hexadecimal 4 digit numbers separated by colons.  
Comments:  
This specifies the Gateway IPv6 Address for the Baseboard LAN. There is a  
separate Gateway IPv6 Address field for the Intel® RMM4 LAN configuration.  
This option is only visible when the IPv6 option is set to Enabled.  
When IPv6 addressing is used, the initial value for this field is acquired from the BMC. The setting of  
IPv6 Source determines whether this field is display-only (when Dynamic or Auto) or can be edited  
(when Static).  
Back to [BMC LAN Configuration Screen] [Server Management Screen]  
8. IPv6 Prefix Length  
Option Values:  
Help Text:  
[Entry Field 0 – 128, 64 is default]  
View/Edit IPv6 Prefix Length from zero to 128 (default 64). Press <Enter> to edit.  
Comments: This specifies the IPv6 Prefix Length for the Baseboard LAN. There is a separate  
IPv6 Prefix Length field for the Intel® RMM4 LAN configuration.  
This option is only visible when the IPv6 option is set to Enabled.  
When IPv6 addressing is used, the initial value for this field is acquired from the BMC. The setting of  
IPv6 Source determines whether this field is display-only (when Dynamic or Auto) or can be edited  
(when Static).  
Back to [BMC LAN Configuration Screen] [Server Management Screen]  
9. Intel® RMM4  
Option Values:  
Not Present  
Intel® RMM4-Lite  
Intel® RMM4 + DMN  
Help Text:  
<None>  
Comments:  
Information only. Displays whether an Intel® RMM4 component is currently  
installed. This information may come from querying the BMC.  
Intel® RMM4-Lite is the Management Module without the Dedicated Server Management NIC Module.  
When this is present, or if the Management Module is Not Present at all, the fields for Intel® RMM4  
LAN Configuration will not be visible.  
When an Intel® RMM4 + DMN is installed, the options for Intel® RMM4 LAN Configuration will be  
visible. When IPv6 is Disabled, the IPv4 configuration fields will be visible and the IPv6 configuration  
fields will not be visible. When IPv6 is Enabled, the IPv4 fields will be grayed out and inactive, while the  
IPv6 Configuration fields will be visible.  
In either case, the Intel® RMM4 section IP Source or IPv6 Source will determine whether the IPv4 or  
IPv6 address fields are display-only or can be edited.  
Back to [BMC LAN Configuration Screen] [Server Management Screen]  
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10. IP Source  
Option Values:  
Static  
Dynamic  
Help Text:  
Select RMM4 IP source: If [Static], IP parameters may be edited. If [Dynamic], these fields are  
display-only and IP address is acquired automatically (DHCP).  
Comments:  
This specifies the IP Source for IPv4 addressing for the Intel® RMM4 DMN LAN  
connection. There is a separate IP Source field for the Baseboard LAN configuration.  
When IPv4 addressing is used, the initial value for this field is acquired from the BMC, and its setting  
determines whether the other Intel® RMM4 DMN LAN IPv4 addressing fields are display-only (when  
Dynamic) or can be edited (when Static).  
When IPv6 addressing is enabled, this field is grayed out and inactive.  
Back to [BMC LAN Configuration Screen] [Server Management Screen]  
11. IP Address  
Option Values:  
[Entry Field 0.0.0.0, 0.0.0.0 is default]  
Help Text:  
View/Edit IP Address. Press <Enter> to edit.  
Comments:  
This specifies the IPv4 Address for the Intel® RMM4 DMN LAN. There is a  
separate IPv4 Address field for the Baseboard LAN configuration.  
When IPv4 addressing is used, the initial value for this field is acquired from the BMC. The setting of IP  
Source determines whether this field is display-only (when Dynamic) or can be edited (when Static).  
When IPv6 addressing is enabled, this field is grayed out and inactive.  
Back to [BMC LAN Configuration Screen] [Server Management Screen]  
12. Subnet Mask  
Option Values:  
Help Text:  
[Entry Field 0.0.0.0, 0.0.0.0 is default]  
View/Edit Subnet Mask. Press <Enter> to edit.  
Comments:  
This specifies the IPv4 addressing Subnet Mask for the Intel® RMM4 DMN LAN.  
There is a separate IPv4 Subnet Mask field for the Baseboard LAN configuration.  
When IPv4 addressing is used, the initial value for this field is acquired from the BMC. The setting of IP  
Source determines whether this field is display-only (when Dynamic) or can be edited (when Static).  
When IPv6 addressing is enabled, this field is grayed out and inactive.  
Back to [BMC LAN Configuration Screen] [Server Management Screen]  
13. Gateway IP  
Option Values:  
Help Text:  
[Entry Field 0.0.0.0, 0.0.0.0 is default]  
View/Edit Gateway IP. Press <Enter> to edit.  
Comments:  
This specifies the IPv4 addressing Gateway IP for the Intel® RMM4 DMN LAN.  
There is a separate IPv4 Gateway IP field for the Baseboard LAN configuration.  
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When IPv4 addressing is used, the initial value for this field is acquired from the BMC. The setting of IP  
Source determines whether this field is display-only (when Dynamic) or can be edited (when Static).  
When IPv6 addressing is enabled, this field is grayed out and inactive.  
Back to [BMC LAN Configuration Screen] [Server Management Screen]  
14. IPv6 Source  
Option Values:  
Static  
Dynamic  
Auto  
Help Text:  
Select Intel® RMM4 IPv6 source: If [Static], IPv6 parameters may be edited. If [Dynamic], these  
fields are display-only and IPv6 address is acquired automatically (DHCP). If [Auto], these fields  
are display-only and IPv6 address is acquired using ICMPv6 router/neighbor discovery.  
Comments:  
This specifies the IP Source for IPv6 addressing for the Intel® RMM4 DMN LAN  
configuration. There is a separate IPv6 Source field for the Baseboard LAN configuration.  
This option is only visible when the IPv6 option is set to Enabled.  
When IPv6 addressing is Enabled, the initial value for this field is acquired from the BMC, and its  
setting determines whether the other Intel® RMM4 DMN LAN IPv6 addressing fields are display-only  
(when Dynamic or Auto) or can be edited (when Static).  
Back to [BMC LAN Configuration Screen] [Server Management Screen]  
15. IPv6 Address  
Option Values:  
[Entry Field 0000.0000.0000.0000.0000.0000.0000.0000,  
0000.0000.0000.0000.0000.0000.0000.0000 is default]  
Help Text:  
View/Edit IPv6 address. Press <Enter> to edit. IPv6 addresses consist of 8 hexadecimal 4 digit  
numbers separated by colons.  
Comments:  
separate IPv6 Address field for the Baseboard LAN configuration.  
This specifies the IPv6 Address for the Intel® RMM4 DMN LAN. There is a  
This option is only visible when the IPv6 option is set to Enabled.  
When IPv6 addressing is used, the initial value for this field is acquired from the BMC. The setting of  
IPv6 Source determines whether this field is display-only (when Dynamic or Auto) or can be edited  
(when Static).  
Back to [BMC LAN Configuration Screen] [Server Management Screen]  
16. Gateway IPv6  
Option Values:  
[Entry Field 0000.0000.0000.0000.0000.0000.0000.0000,  
0000.0000.0000.0000.0000.0000.0000.0000 is default]  
Help Text:  
View/Edit Gateway IPv6 address. Press <Enter> to edit. Gateway IPv6 addresses consist of 8  
hexadecimal 4 digit numbers separated by colons.  
Comments:  
is a separate Gateway IPv6 Address field for the Baseboard LAN configuration.  
This specifies the Gateway IPv6 Address for the Intel® RMM4 DMN LAN. There  
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This option is only visible when the IPv6 option is set to Enabled.  
When IPv6 addressing is used, the initial value for this field is acquired from the BMC. The setting of  
IPv6 Source determines whether this field is display-only (when Dynamic or Auto) or can be edited  
(when Static).  
Back to [BMC LAN Configuration Screen] [Server Management Screen]  
17. IPv6 Prefix Length  
Option Values:  
Help Text:  
[Entry Field 0 – 128, 64 is default]  
View/Edit IPv6 Prefix Length from zero to 128 (default 64). Press <Enter> to edit.  
Comments:  
This specifies the IPv6 Prefix Length for the Intel® RMM4 DMN LAN. There is a  
separate IPv6 Prefix Length field for the Baseboard LAN configuration.  
This option is only visible when the IPv6 option is set to Enabled.  
When IPv6 addressing is used, the initial value for this field is acquired from the BMC. The setting of  
IPv6 Source determines whether this field is display-only (when Dynamic or Auto) or can be edited  
(when Static).  
Back to [BMC LAN Configuration Screen] [Server Management Screen]  
18. BMC DHCP Host Name  
Option Values:  
Help Text:  
[Entry Field, 2-63 characters]  
View/Edit BMC DHCP host name. Press <Enter> to edit. Host name should start with an  
alphabetic, remaining can be alphanumeric characters. Host name length may be from 2 to 63  
characters.  
Comments:  
This field is active and may be edited whenever at least one of the IP Source or  
IPv6 Source options is set to Dynamic. This is the name of the DHCP Host from which dynamically  
assigned IPv4 or IPv6 addressing parameters are acquired.  
The initial value for this field is supplied from the BMC, if there is a DHCP Host available. The user can  
edit the existing Ho or enter a different DHCP Host Name.  
If none of the IP/IPv6 Source fields is set to Dynamic, then this BMC DHCP Host Name field will be  
grayed out and inactive.  
Back to [BMC LAN Configuration Screen] [Server Management Screen]  
19. User ID  
Option Values:  
anonymous  
root  
User3  
User4  
User5  
Help Text:  
Select the User ID to configure: User1 (anonymous), User2 (root), and User3/4/5 are supported.  
Comments: These 5 User IDs are fixed choices and cannot be changed. The BMC supports  
15 User IDs natively, but only the first 5 are supported through this interface.  
Back to [BMC LAN Configuration Screen] [Server Management Screen]  
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20. Privilege  
Option Values:  
Callback  
User  
Operator  
Administrator  
Help Text:  
View/Select user privilege. User2 (root) privilege is "Administrator" and cannot be changed.  
Comments: The level of privilege that is assigned for a User ID affects which functions that  
user may perform.  
Back to [BMC LAN Configuration Screen] [Server Management Screen]  
21. User Status  
Option Values:  
Enabled  
Disabled  
Help Text:  
Enable/Disable LAN access for selected user. Also enables/disables SOL, KVM, and media  
redirection.  
Comments:  
Note that status setting is Disabled by default until set to Enabled.  
Back to [BMC LAN Configuration Screen] [Server Management Screen]  
22. User Name  
Option Values:  
Help Text:  
[Entry Field, 4 - 15 characters]  
Press <Enter> to edit User Name. User Name is a string of 4 to 15 alphanumeric characters,  
and must begin with an alphabetic character. User Name cannot be changed for User1  
(anonymous) and User2 (root).  
Comments:  
User Name can only be edited for users other than “anonymous” and “root”.  
Those two User Names may not be changed.  
Back to [BMC LAN Configuration Screen] [Server Management Screen]  
23. User Password  
Option Values:  
Help Text:  
[Popup Entry Field, 0 - 15 characters]  
Press <Enter> key to enter password. Maximum length is 15 characters. Any ASCII printable  
characters can be used: case-sensitive alphabetic, numeric, and special characters.  
**Note: Password entered will override any previously set password.  
Comments:  
This field will not indicate whether there is a password set already. There is no  
display - just press <Enter> for a popup with an entry field to enter a new password. Any new password  
entered will override the previous password, if there was one.  
Back to [BMC LAN Configuration Screen] [Server Management Screen]  
12.2.5  
Boot Options Screen (Tab)  
The Boot Options screen displays all bootable media encountered during POST, and allows the user to  
configure the desired order in which boot devices are to be tried.  
To access this screen from the Main screen or other top-level “Tab” screen, press the right or left arrow keys to  
traverse the tabs at the top of the Setup screen until the Boot Options screen is selected.  
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The first boot device in the specified Boot Order which is present and is bootable during POST will be used to  
boot the system, and will continue to be used to reboot the system until the boot device configuration has  
changed (that is, which boot devices are present), or until the system has been powered down and booted in a  
“cold” power-on boot.  
Note: USB devices can be “hotplugged” during POST, and will be detected and “beeped”. They will be  
enumerated and displayed on the USB Configuration Setup screen. However, they may not be enumerated as  
bootable devices, depending on when in POST they were hotplugged. If they were recognized before the  
enumeration of bootable devices, they will appear as Boot Devices if appropriate. If they were recognized after  
Boot Device enumeration, they will not appear as a bootable device for the Boot Options screen, the Boot  
Manager screen, or the F6 Boot Menu.  
There are two main types of boot order control, Legacy Boot and EFI Optimized boot. These are mutually  
exclusive – when EFI Optimized Boot is enabled, Legacy Boot (the default) is disabled. Within Legacy Boot  
operation, there are two further methods of ordering boot devices, Dynamic Boot Order and Static Boot Order.  
The default for Boot Order control is Legacy Boot, with Dynamic Boot Order. If all types of bootable devices are  
installed in the system, then the default Boot Order is as follows :  
.
.
.
.
.
CD/DVD-ROM  
Floppy Disk Drive  
Hard Disk Drive  
PXE Network Device  
BEV (Boot Entry Vector) Device  
EFI Shell and EFI Boot paths  
In this default Boot Order, a USB device may appear in any of several Device Classes, due to the flexibility of  
USB connections and USB emulation of various types of devices.  
Note: A USB Key (USB Flash Drive) can be formatted to emulate either a Floppy Drive or a Hard Drive and will  
appear in that Boot Device Class. However, although it can be formatted as a CDROM Drive, it will not be  
detected as such. It will be treated as a Hard Disk and will appear in the list of available Hard Drives.  
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Main  
Advanced  
Security  
Server Management  
Boot Options  
Boot Manager  
System Boot Timeout  
[0 – 65535, 0 is default]  
0
System Early POST Timeout  
Boot Option #1  
<Available Boot devices>  
<Available Boot devices>  
<Available Boot devices>  
Boot Option #2  
Boot Option <#n>  
CDROM Order  
Hard Disk Order  
Floppy Order  
Network Device Order  
BEV Device Order  
Add EFI Boot Option  
Delete EFI Boot Option  
EFI Optimized Boot  
Use Legacy Video for EFI OS  
Boot Option Retry  
Enabled/Disabled  
Enabled/Disabled  
Enabled/Disabled  
Enabled/Disabled  
Enabled/Disabled  
Yes/No Action  
USB Boot Priority  
Static Boot Order  
Reset Static Boot Order  
Figure 58. Boot Options Screen  
Screen Field Descriptions:  
System Boot Timeout  
Option Values:  
Help Text:  
[Entry Field 0 – 65535, 0 is default]  
The number of seconds BIOS will pause at the end of POST to allow the user to press the [F2]  
key for entering the BIOS Setup utility.  
Valid values are 0-65535. Zero is the default. A value of 65535 causes the system to go to the  
Boot Manager menu and wait for user input for every system boot.  
Comments:  
After entering the desired timeout, press the <Enter> key to register that timeout  
value to the system. These settings are in seconds. The timeout value entered will take effect on the  
next boot.  
This timeout value is independent of the FRB2 setting for BIOS boot failure protection. The FBR2  
countdown will be suspended during the time that the Boot Timeout countdown is active.  
Also, if the <Pause> key is pressed during the time that the Boot Timeout is active, the Boot Timeout  
countdown will be suspended until the Pause state has been dismissed and normal POST processing  
has resumed.  
Back to [Boot Options Screen]  
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System Early POST Timeout  
Option Values:  
[0 – 65535, 0 is default]  
Help Text:  
The boot timeout takes effect before loading any third party option ROMs.  
Comments: The number of seconds the BIOS will pause at the early stage of POST before the BIOS  
loads any third party option ROMs.  
Valid values are 0-65535. Zero is the default. After entering the desired timeout, press the <Enter> key  
to register that timeout value to the system. These settings are in seconds. The timeout value entered  
will take effect on the next boot.  
This timeout value is independent of the FRB2 setting for BIOS boot failure protection. The FBR2  
countdown will be suspended during the time that the Boot Timeout countdown is active.  
Also, neither the <Pause> key nor the <ESC> key works at this moment as Keyboard service is not  
ready.  
Back to [Boot Options Screen]  
1. Boot Option #1  
2. Boot Option #2  
Boot Option <#n>  
Option Values:  
Help Text:  
<Available Boot Device #n>  
Set system boot order by selecting the boot option for this position.  
Comments:  
When the Boot order has been chosen, it will take effect on the next boot. The  
system will go down the list and boot from the first device on the list which is available and bootable.  
This establishes the Boot Order only with respect to the normal boot path. This order has no effect on  
the Boot Manager selection list or the <F6> BIOS Boot Menu popup, both of which simply list all  
bootable devices available in the order in which they were detected. Whether or not a potential Boot  
Device is in this list has no bearing on the presence or order of Boot Devices shown for Boot Manager  
or the BIOS Boot Menu.  
Back to [Boot Options Screen]  
3. CDROM Order  
Option Values:  
Help Text:  
<None>  
Set the order of the legacy devices in this group.  
Comments: Selection only. Position to this line and press the <Enter> key to go to the  
CDROM Order Screen.  
This option appears when one or more bootable CDROM drives are available in the system. This  
includes USB CDROM devices, but not USB Keys formatted for CRDOM emulation, which are seen as  
Hard Disk drives.  
Back to [Boot Options Screen]  
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4. Hard Disk Order  
Option Values:  
Help Text:  
<None>  
Set the order of the legacy devices in this group.  
Comments:  
Selection only. Position to this line and press the <Enter> key to go to the Hard  
Disk Order Screen.  
This option appears when one or more bootable Hard Disk drives are available in the system. This  
includes USB Hard Disk devices and USB Keys formatted for Hard Disk or CRDOM emulation.  
Back to [Boot Options Screen]  
5. Floppy Order  
Option Values:  
Help Text:  
<None>  
Set the order of the legacy devices in this group.  
Comments: Selection only. Position to this line and press the <Enter> key to go to the Floppy  
Order Screen.  
This option appears when one or more bootable Floppy Disk drives are available in the system. This  
includes USB Floppy Disk devices and USB Keys formatted for Floppy Disk emulation.  
Back to [Boot Options Screen]  
6. Network Device Order  
Option Values:  
Help Text:  
<None>  
Set the order of the legacy devices in this group.  
Comments: Selection only. Position to this line and press the <Enter> key to go to the  
Network Device Order Screen.  
This option appears when one or more bootable Network Devices are available in the system.  
Back to [Boot Options Screen]  
7. BEV Device Order  
Option Values:  
Help Text:  
<None>  
Set the order of the legacy devices in this group.  
Comments: Selection only. Position to this line and press the <Enter> key to go to the BEV  
Device Order Screen.  
This option appears when one or more bootable BEV Devices are available in the system.  
Back to [Boot Options Screen]  
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8. Add EFI Boot Option  
Option Values:  
Help Text:  
<None>  
Add a new EFI boot option to the boot order.  
Comments: Selection only. Position to this line and press the <Enter> key to go to the Add  
EFI Boot Option Screen.  
This option is only displayed if an EFI bootable device is available to the system.  
Back to [Boot Options Screen]  
9. Delete EFI Boot Option  
Option Values:  
Help Text:  
<None>  
Remove an EFI boot option from the boot order.  
Comments: Selection only. Position to this line and press the <Enter> key to go to the Delete  
EFI Boot Option Screen.  
This option is only displayed if an EFI boot path is included in the Boot Order.  
Back to [Boot Options Screen]  
10. EFI Optimized Boot  
Option Values:  
Enabled  
Disabled  
Help Text:  
If enabled, the BIOS only loads modules required for booting EFI-aware Operating Systems.  
Comments: If this option is enabled, the system will not boot successfully to a non-EFI-aware  
OS.  
Back to [Boot Options Screen]  
11. Use Legacy Video for EFI OS  
Option Values:  
Enabled  
Disabled  
Help Text:  
If enabled, the BIOS uses the legacy video ROM instead of the EFI video ROM.  
Comments: This option appears only when EFI Optimized Boot is enabled.  
Back to [Boot Options Screen]  
12. Boot Option Retry  
Option Values:  
Enabled  
Disabled  
Help Text:  
If enabled, this continually retries non-EFI-based boot options without waiting for user input.  
Comments:  
This option is intended to keep retrying for cases where the boot devices could  
possibly be slow to initially respond, for example, if the device were “asleep” and did not wake quickly  
enough. However, if none of the devices in the Boot Order ever responds, the BIOS will continue to  
reboot indefinitely.  
Back to [Boot Options Screen]  
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13. USB Boot Priority  
Option Values:  
Enabled  
Disabled  
Help Text:  
If enabled, newly discovered USB devices are moved to the top of their boot device category.  
If disabled, newly discovered USB devices are moved to the bottom of their boot device  
category.  
Comments:  
This option enables or disables the “USB Reorder” functionality. USB Boot  
Priority, if enabled, is intended for the case where a user wants to be able to plug in a USB device and  
immediately boot to it, for example in case of a maintenance or System Administration operation. If a  
User Password is installed, USB Boot Priority action is suspended when a User Password is installed.  
Back to [Boot Options Screen]  
14. Static Boot Order  
Option Values:  
Enabled  
Disabled  
Help Text:  
[Disabled] - Devices removed from the system are deleted from Boot Order Tables.  
[Enabled] - Devices removed have positions in Boot Order Tables retained for later reinsertion.  
Comments:  
When the option changes to “Enabled” from “Disabled”, it will enable Static Boot  
Order (SBO) from the next boot onward, and also the current Boot Order will be stored as the SBO  
template.  
When the option changes from “Enabled” to “Disabled”, this will disable SBO and the SBO template will  
be cleared.  
Otherwise it will retain the current Enabled/Disabled state.  
Back to [Boot Options Screen]  
15. Reset Static Boot Order  
Option Values:  
Yes  
No Action  
Help Text:  
[Yes] Take snapshot of current boot order to save as Static Boot Order Template.  
Comments: This option will allow you to save the Boot Order list as the Static Boot Order  
template without disabling and re-enabling the Static Boot Order option.  
Select Yes to snapshot the current Boot Options list into the Static Boot Options list on the next boot.  
After saving Static Boot Options list, this option will change back to NoAction automatically.  
This option is available only when the Static Boot Order option is Enabled. Otherwise it will grayed out  
and unavailable.  
Back to [Boot Options Screen]  
12.2.5.1  
CDROM Order  
The CDROM Order screen allows the user to control the order in which BIOS attempts to boot from the  
CDROM drives installed in the system. This screen is only available when there is at least one CDROM device  
available in the system configuration.  
Note: A USB attached CDROM device will appear in this section. However, a USB Key formatted as a  
CRDOM device will not – it will be detected as a Hard Disk device and will be included in the Hard Disk Order  
Screen.  
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To access this screen from the Main screen, select Boot Options > CDROM Order. To move to another  
screen, press the <Esc> key to return to the Boot Options screen, then select the desired screen.  
Boot Options  
CDROM Order  
CDROM #1  
CDROM #2  
<Available CDROM devices>  
<Available CDROM devices>  
Figure 59. CDROM Order Screen  
Screen Field Descriptions:  
1. CDROM #1  
CDROM #2  
Option Values:  
Help Text:  
<Available CDROM devices>  
Set system boot order by selecting the boot option for this position.  
Comments: Choose the order of booting among CDROM devices by choosing which  
available CDROM device should be in each position in the order.  
Back to [CDROM Order Screen] [Boot Options Screen]  
12.2.5.2  
Hard Disk Order  
The Hard Disk Order screen allows the user to control the order in which BIOS attempts to boot from the hard  
disk drives installed in the system. This screen is only available when there is at least one hard disk device  
available in the system configuration. Note that a USB attached Hard Disk drive or a USB Key device  
formatted as a hard disk will appear in this section.  
To access this screen from the Main screen, select Boot Options > Hard Disk Order. To move to another  
screen, press the <Esc> key to return to the Boot Options screen, then select the desired screen.  
Boot Options  
Hard Disk Order  
Hard Disk #1  
Hard Disk #2  
<Available Hard Disk devices>  
<Available Hard Disk devices>  
Figure 60. Hard Disk Order Screen  
Screen Field Descriptions:  
1. Hard Disk #1  
Hard Disk #2  
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Option Values:  
Help Text:  
<Available Hard Disk devices>  
Set system boot order by selecting the boot option for this position.  
Comments: Choose the order of booting among Hard Disk devices by choosing which  
available Hard Disk device should be in each position in the order.  
Back to [Hard Disk Order Screen] [Boot Options Screen]  
12.2.5.3  
Floppy Order  
The Floppy Order screen allows the user to control the order in which BIOS attempts to boot from the Floppy  
Disk drives installed in the system. This screen is only available when there is at least one Floppy Disk  
(diskette) device available in the system configuration. Note that a USB attached diskette drive or a USB Key  
device formatted as a diskette drive will appear in this section.  
To access this screen from the Main screen, select Boot Options > Floppy Order. To move to another  
screen, press the <Esc> key to return to the Boot Options screen, then select the desired screen.  
Boot Options  
Floppy Order  
Floppy Disk #1  
Floppy Disk #2  
<Available Floppy Disk devices>  
<Available Floppy Disk devices>  
Figure 61. Floppy Order Screen  
Screen Field Descriptions:  
1. Floppy Disk #1  
Floppy Disk #2  
Option Values:  
Help Text:  
<Available Floppy Disk devices>  
Set system boot order by selecting the boot option for this position.  
Comments: Choose the order of booting among Floppy Disk devices by choosing which  
available Floppy Disk device should be in each position in the order.  
Back to [Floppy Order Screen] [Boot Options Screen]  
12.2.5.4  
Network Device Order  
The Network Device Order screen allows the user to control the order in which BIOS attempts to boot from the  
network bootable devices installed in the system. This screen is only available when there is at least one  
network bootable device available in the system configuration.  
To access this screen from the Main screen, select Boot Options > Network Device Order. To move to  
another screen, press the <Esc> key to return to the Boot Options screen, then select the desired screen.  
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Boot Options  
Network Device Order  
Network Device #1  
Network Device #2  
<Available bootable Network devices>  
<Available bootable Network devices>  
Figure 62. Network Device Order Screen  
Screen Field Descriptions:  
1. Network Device #1  
Network Device #2  
Option Values:  
Help Text:  
<Available Network Devices>  
Set system boot order by selecting the boot option for this position.  
Comments: Choose the order of booting among Network Devices by choosing which  
available Network Device should be in each position in the order.  
Back to [Network Device Order Screen] [Boot Options Screen]  
12.2.5.5  
BEV Device Order  
The BEV Device Order screen allows the user to control the order in which BIOS attempts to boot from the  
BEV Devices installed in the system. This screen is only available when there is at least one BEV device  
available in the system configuration.  
To access this screen from the Main screen, select Boot Options > BEV Device Order. To move to another  
screen, press the <Esc> key to return to the Boot Options screen, then select the desired screen.  
Boot Options  
BEV Device Order  
BEV Device #1  
BEV Device #2  
<Available BEV devices>  
<Available BEV devices>  
Figure 63. BEV Device Order Screen  
Screen Field Descriptions:  
1. BEV Device #1  
BEV Device #2  
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Option Values:  
Help Text:  
<Available BEV Devices>  
Set system boot order by selecting the boot option for this position.  
Comments: Choose the order of booting among BEV Devices by choosing which available  
BEV Device should be in each position in the order.  
Back to [BEV Device Order Screen] [Boot Options Screen]  
12.2.5.6  
Add EFI Boot Option  
The Add EFI Boot Option screen allows the user to add an EFI boot option to the boot order. This screen is  
only available when there is at least one EFI bootable device present in the system configuration. The “Internal  
EFI Shell” Boot Option is permanent and cannot be added or deleted.  
To access this screen from the Main screen, select Boot Options > Add EFI Boot Option. To move to  
another screen, press the <Esc> key to return to the Boot Options screen, then select the desired screen.  
Boot Options  
Add EFI Boot Option  
Add boot option label  
Select File system  
Path for boot option  
Save  
[Enter label]  
<Available Filesystems>  
[Enter boot path]  
Figure 64. Add EFI Boot Option Screen  
Screen Field Descriptions:  
1. Add boot option label  
Option Values:  
[Enter label]  
Help Text:  
Create the label for the new boot option.  
Comments:  
This label becomes an abbreviation for this Boot Path.  
Back to [Add EFI Boot Option Screen] [Boot Options Screen]  
2. Select File system  
Option Values:  
Help Text:  
<Available Filesystems>  
Select one filesystem from this list.  
Comments:  
Choose the filesystem on which this boot path resides.  
Back to [Add EFI Boot Option Screen] [Boot Options Screen]  
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3. Path for boot option  
Option Values:  
Help Text:  
[Enter Boot Path]  
Enter the path to the boot option in the format \path\filename.efi.  
Comments: This will be the Boot Path, residing on the filesystem chosen, which will entered  
into the Boot Order with the Label entered above.  
Back to [Add EFI Boot Option Screen] [Boot Options Screen]  
4. Save  
Option Values:  
<None>  
Help Text:  
Save the boot option.  
Comments:  
Selection only. This will save the new Boot Option into the Boot Order.  
Back to [Add EFI Boot Option Screen] [Boot Options Screen]  
12.2.5.7  
Delete EFI Boot Option  
The Delete EFI Boot Option screen allows the user to remove an EFI boot option from the boot order. The  
“Internal EFI Shell” Boot Option will not be listed, since it is permanent and cannot be added or deleted.  
To access this screen from the Main screen, select Boot Options > Delete EFI Boot Option. To move to  
another screen, press the <Esc> key to return to the Boot Options screen, then select the desired screen.  
Boot Options  
Delete EFI Boot Option  
<Available EFI Boot Options>  
Delete Boot Option  
Figure 65. Delete EFI Boot Option Screen  
Screen Field Descriptions:  
1. Delete Boot Option  
Option Values:  
<Available EFI Boot Options>  
Help Text:  
Select one to delete.  
Comments:  
This will not allow a user to delete the EFI Shell.  
Back to [Delete EFI Boot Option Screen] [Boot Options Screen]  
12.2.6  
Boot Manager Screen (Tab)  
The Boot Manager screen allows the user to view a list of devices available for booting, and to select a boot  
device for immediately booting the system. There is no predetermined order for listing bootable devices. They  
are simply listed in order of discovery.  
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Regardless of whether any other bootable devices are available, the “Internal EFI Shell” will always be  
available,.  
Note that this list is not in order according to the system Boot Option order. Reordering Boot Devices or even  
removing them from the Boot Order completely has no effect on the Boot Manager.  
To access this screen from the Main screen or other top-level “Tab” screen, press the right or left arrow keys to  
traverse the tabs at the top of the Setup screen until the Boot Manager screen is selected.  
Main  
Advanced  
Security  
Server Management  
Boot Options  
Boot Manager  
Launch EFI Shell  
<Boot Device #1>  
<Boot Device #2>  
<Boot Device #n>  
Figure 66. Boot Manager Screen  
Screen Field Descriptions:  
1. Launch EFI Shell  
Option Values:  
<None>  
Help Text:  
Select this option to boot now.  
Note: This list is not the system boot option order. Use the Boot Options menu to view and  
configure the system boot option order.  
Comments:  
The EFI Shell will always be present in the list of bootable devices.  
Back to [Boot Manager Screen]  
2. <Boot Device #1>  
3. <Boot Device #2>  
4. <Boot Device #n>  
Option Values:  
Help Text:  
<None>  
Select this option to boot now.  
Note: This list is not the system boot option order. Use the Boot Options menu to view and  
configure the system boot option order.  
Comments:  
These are names of bootable devices discovered in the system. The system user  
can choose any of them from which to initiate a one-time boot – that is, booting from any device in this  
list will not permanently affect the defined system Boot Order.  
These bootable devices are not displayed in any specified order, particularly not in the system Boot  
Order established by the Boot Options screen. This is just a list of bootable devices in the order in  
which they were enumerated.  
Back to [Boot Manager Screen]  
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12.2.7  
Error Manager Screen (Tab)  
The Error Manager screen displays any POST Error Codes encountered during BIOS POST, along with an  
explanation of the meaning of the Error Code in the form of a Help Text. This is an Information Only screen.  
To access this screen from the Main screen or other top-level “Tab” screen, press the right or left arrow keys to  
traverse the tabs at the top of the Setup screen until the Error Manager screen is selected.  
Error Manager  
Exit  
ERROR CODE  
<Post Code>  
5224  
SEVERITY  
<Major/Minor>  
Major  
INSTANCE  
<Instance #>  
N/A  
DESCRIPTION  
<Description>  
This is an example.  
Figure 67. Error Manager Screen  
Screen Field Descriptions:  
1. ERROR CODE  
Option Values:  
<POST Error Code>  
Help Text:  
<N/A>  
Comments:  
initialization.  
This is a POST Error Code – a BIOS-originated error that occurred during POST  
Back to [Error Manager Screen]  
2. SEVERITY  
Option Values:  
Minor  
Major  
Fatal  
Help Text:  
<N/A>  
Comments:  
Each POST Error Code has a Severity associated with it. refer to the list of POST  
Error Codes to determine the Severity – Fatal, Major, Minor.  
Back to [Error Manager Screen]  
3. INSTANCE  
Option Values:  
Help Text:  
<Depends on error code>  
<N/A>  
Where applicable, this field shows a value indicating which one of a group of  
Comments:  
components was responsible for generating the POST Error Code that is being reported.  
Back to [Error Manager Screen]  
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4. DESCRIPTION  
Option Values:  
Help Text:  
<N/A>  
<Description of POST Error Code>  
Comments:  
This is a description of the meaning of the POST Error Code that is being  
reported. This text actually appears in the screen space that is usually reserved for “Help” messages.  
Back to [Error Manager Screen]  
12.2.8  
Save & Exit Screen (Tab)  
The Save &Exit screen allows the user to choose whether to save or discard the configuration changes made  
on other Setup screens. It also allows the user to restore the BIOS settings to the factory defaults or to save or  
restore them to a set of user-defined default values. If Load Default Values is selected, the factory default  
settings (noted in bold in the Setup screen images) are applied. If Load User Default Values is selected, the  
system is restored to previously saved User Default Values.  
To access this screen from the Main screen or other top-level “Tab” screen, press the right or left arrow keys to  
traverse the tabs at the top of the Setup screen until the Exit screen is selected.  
Note that there is a Legal Disclaimer footnote at the bottom of the Save & Exit screen:  
*Certain brands and names may be claimed as the property of others.  
This is reference to any instance in the Setup screens where names belonging to other companies may appear.  
For example “LSI*” appears in Setup in the context of Mass Storage RAID options.  
Error Manager  
Save & Exit  
Save Changes and Exit  
Discard Changes and Exit  
Save Changes  
Discard Changes  
Load Default Values  
Save as User Default Values  
Load User Default Values  
*Certain brands and names may be claimed as the property of others.  
Figure 68. Save & Exit Screen  
Screen Field Descriptions:  
1. Save Changes and Exit  
Option Values:  
<None>  
Help Text:  
Exit BIOS Setup Utility after saving changes. The system will reboot if required.  
The [F10] key can also be used.  
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BIOS Setup Utility  
Intel® Server Board S2600GZ/GL TPS  
Comments:  
Selection only. Position to this line and press the <Enter> key to exit Setup with  
any changes in BIOS settings saved. If there have been no changes made in the settings, the BIOS will  
resume executing POST.  
If changes have been made in BIOS settings, a confirmation pop-up will appear. If the “Save Changes  
& Exit” action is positively confirmed,, any persistent changes will applied and saved to the BIOS  
settings in NVRAM storage, then the system will reboot if necessary (which is normally the case). If the  
“Save Changes & Exit” action is not confirmed, BIOS will resume executing Setup.  
The <F10 > function key may also be used from anyplace in Setup to initiate a “Save Changes & Exit”  
action.  
Back to [Save & Exit Screen]  
2. Discard Changes and Exit  
Option Values:  
Help Text:  
<None>  
Exit BIOS Setup Utility without saving changes.  
The [Esc] key can also be used.  
Comments:  
Selection only. Position to this line and press the <Enter> key to exit Setup  
without saving any changes in BIOS settings. If there have been no changes made in the settings, the  
BIOS will resume executing POST.  
If changes have been made in BIOS settings, a confirmation pop-up will appear. If the “Discard  
Changes & Exit” action is positively confirmed,, all pending changes will be discarded and BIOS will  
resume executing POST. If the “Discard Changes & Exit” action is not confirmed, BIOS will resume  
executing Setup without discarding any changes.  
The <Esc > key may also be used in Setup to initiate a “Discard Changes & Exit” action.  
Back to [Save & Exit Screen]  
3. Save Changes  
Option Values:  
Help Text:  
<None>  
Save Changes made so far to any of the setup options.  
Comments: Selection only. Position to this line and press the <Enter> key to save any  
pending changes in BIOS settings. If there have been no changes made in the settings,  
Also, the user should be aware that most changes require a reboot to become active. If changes have  
been made and saved, without exiting Setup, the system should be rebooted later even if no additional  
changes are made.  
Back to [Save & Exit Screen]  
4. Discard Changes  
Option Values:  
Help Text:  
<None>  
Discard Changes made so far to any of the setup options.  
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Intel® Server Board S2600GZ/GL TPS  
BIOS Setup Utility  
Comments:  
Selection only. Position to this line and press the <Enter> key to discard any  
pending unsaved changes in BIOS settings. If there have been no changes made in the settings, the  
BIOS will resume executing POST.  
If changes have been made in BIOS settings and not yet saved, a confirmation pop-up will appear. If  
the “Discard Changes” action is positively confirmed, all pending changes will be discarded and BIOS  
will resume executing POST. If the “Discard Changes” action is not confirmed, BIOS will resume  
executing Setup without discarding pending changes.  
Back to [Save & Exit Screen]  
5. Load Default Values  
Option Values:  
Help Text:  
<None>  
Load Defaults Values for all the setup options.  
Comments: Selection only. Position to this line and press the <Enter> key to load default  
values for all BIOS settings. These are the initial factory settings (“failsafe” settings) for all BIOS  
parameters.  
There will be a confirmation popup to verify that the user really meant to take this action.  
After initializing all BIOS settings to default values, the BIOS will resume executing Setup, so the user  
may made additional changes in the BIOS settings if necessary (for example, Boot Order) before doing  
a “Save Changes and Exit” with a reboot to make the default settings take effect, including any changes  
made after loading the defaults.  
The <F9> function key may also be used from anyplace in Setup to initiate a “Load Default Values”  
action.  
Back to [Save & Exit Screen]  
6. Save as User Default Values  
Option Values:  
Help Text:  
<None>  
Save the changes made so far as User Default Values.  
Comments: Selection only. Position to this line and press the <Enter> key to save the current  
state of the settings for all BIOS parameters as a customized set of “User Default Values”.  
These are a user-determined set of BIOS default settings that can be used as an alternative instead of  
the initial factory settings (“failsafe” settings) for all BIOS parameters.  
By changing the BIOS settings to values that the user prefers to have for defaults, and then using this  
operation to save them as “User Default Values”, that version of BIOS settings can be restored at any  
time by using the following “Load User Default Values” operation.  
There will be a confirmation popup to verify that the user really intended to take this action.  
Loading the “factory default” values with F9 or the “Load Default Values” – or by any other means –  
does not affect the User Default Values. They remain set to whatever values they were saved as.  
Back to [Save & Exit Screen]  
7. Load User Default Values  
Option Values:  
Help Text:  
<None>  
Load the User Default Values to all the setup options.  
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BIOS Setup Utility  
Intel® Server Board S2600GZ/GL TPS  
Comments:  
Selection only. Position to this line and press the <Enter> key to load User  
Default Values for all BIOS settings. These are user-customized BIOS default settings for all BIOS  
parameters, previously established by doing a “Save User Defaults” action (see above).  
There will be a confirmation popup to verify that the user really intended to take this action.  
Back to [Save & Exit Screen]  
194  
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Intel® Server Board S2600GZ/GL TPS  
Appendix A: Integration and Usage Tips  
Appendix A: Integration and Usage Tips  
.
.
When adding or removing components or peripherals from the server board, power  
cords must be disconnected from the server. With power applied to the server, standby  
voltages are still present even though the server board is powered off.  
This server board supports the following processor product families:  
o
o
o
Intel® Xeon® Processor E5-2600 product family with a Thermal Design Power (TDP)  
of up to and including 135 Watts.  
Intel® Xeon® Processor E5-2600 v2 product family with a Thermal Design Power  
(TDP) of up to and including 130 Watts.  
Previous generations of the Intel® Xeon® processors are not supported.  
.
.
Server systems using this server board may or may not meet the TDP design limits of  
the server board. Validate the TDP limits of the server system before selecting a  
processor.  
Processors must be installed in order. CPU 1 must be populated for the server board to  
operate.  
.
.
Riser card slot #2 is only functional with two CPUs installed.  
The SCU-1 mini-SAS connector is only enabled when an 8-port Intel® RAID C600  
Upgrade Key is installed.  
.
.
For the best performance, the number of DDR3 DIMMs installed should be balanced  
across both processor sockets and memory channels.  
On the back edge of the server board are eight diagnostic LEDs that display a sequence  
of amber POST codes during the boot process. If the server board hangs during POST,  
the LEDs display the last POST event run before the hang.  
.
The Intel® Remote Management Module 4 (Intel® RMM4) connector is not compatible  
with any previous versions of the Intel® Remote Management Module (Product Order  
Codes – AXXRMM, AXXRMM2, AXXRMM3).  
Revision 2.4  
195  
 
Appendix B: Integrated BMC Sensor Tables  
Intel® Server Board S2  
Appendix B: Integrated BMC Sensor Tables  
This appendix provides BMC core sensor information common to all Intel server boards within  
this generation of product. Specific server boards and/or server platforms may only implement a  
sub-set of sensors and/or may include additional sensors. The actual sensor name associated  
with a sensor number may vary between server boards or systems  
.
.
.
Sensor Type  
The Sensor Type values are the values enumerated in the Sensor Type Codes table in  
the IPMI specification. The Sensor Type provides the context in which to interpret the  
sensor, such as the physical entity or characteristic that is represented by this sensor.  
Event/Reading Type  
The Event/Reading Type values are from the Event/Reading Type Code Ranges and  
Generic Event/Reading Type Codes tables in the IPMI specification. Digital sensors are  
a specific type of discrete sensor, which have only two states.  
Event Offset/Triggers  
Event Thresholds are event-generating thresholds for threshold types of sensors.  
-
[u,l][nr,c,nc]: upper non-recoverable, upper critical, upper non-critical, lower non-  
recoverable, lower critical, lower non-critical  
-
uc, lc: upper critical, lower critical  
Event Triggers are supported event-generating offsets for discrete type sensors. The  
offsets can be found in the Generic Event/Reading Type Codes or Sensor Type Codes  
tables in the IPMI specification, depending on whether the sensor event/reading type is  
generic or a sensor-specific response.  
.
.
Assertion/De-assertion Enables  
Assertion and de-assertion indicators reveal the type of events the sensor generates:  
-
-
As: Assertions  
De: De-assertion  
Readable Value/Offsets  
-
Readable Value indicates the type of value returned for threshold and other non-  
discrete type sensors.  
-
Readable Offsets indicate the offsets for discrete sensors that are readable with the  
Get Sensor Reading command. Unless otherwise indicated, all event triggers are  
readable; Readable Offsets consist of the reading type offsets that do not generate  
events.  
196  
 
Intel® Server Board S2600GZ/GL TPS  
Appendix B: Integrated BMC Sensor Tables  
.
Event Data  
Event data is the data that is included in an event message generated by the sensor. For  
threshold-based sensors, the following abbreviations are used:  
-
-
R: Reading value  
T: Threshold value  
.
Rearm Sensors  
The rearm is a request for the event status for a sensor to be rechecked and updated  
upon a transition between good and bad states. Rearming the sensors can be done  
manually or automatically. This column indicates the type supported by the sensor. The  
following abbreviations are used to describe a sensor:  
-
-
A: Auto-rearm  
M: Manual rearm  
.
.
.
Default Hysteresis  
The hysteresis setting applies to all thresholds of the sensor. This column provides the  
count of hysteresis for the sensor, which can be 1 or 2 (positive or negative hysteresis).  
Criticality  
Criticality is a classification of the severity and nature of the condition. It also controls the  
behavior of the Control Panel Status LED.  
Standby  
Some sensors operate on standby power. These sensors may be accessed and/or  
generate events when the main (system) power is off, but AC power is present.  
Revision 2.4  
197  
Appendix B: Integrated BMC Sensor Tables  
Intel® Server Board S2600GZ/GL TPS  
Note: All sensors listed below may not be present on all platforms. Please check platform EPS section for platform applicability and  
platform chassis section for chassis specific sensors. Redundancy sensors will be only present on systems with appropriate  
hardware to support redundancy (for instance, fan or power supply)  
Table 61. BMC Core Sensors  
Full Sensor Name  
(Sensor name in SDR)  
Sensor  
#
Platform  
Applicability  
Sensor Type  
Event/Readi  
ng Type  
Event Offset Triggers  
Contrib. To  
System Status  
Assert/ Readable  
De-  
Event  
Data  
Rearm  
Stand-  
by  
assert Value/Of  
fsets  
00 - Power down  
OK  
Fatal  
OK  
02 - 240 VA power  
down  
Sensor  
Specific  
As  
and  
De  
Power Unit Status  
Power Unit  
09h  
04 - A/C lost  
01h  
All  
Trig Offset  
A
X
(Pwr Unit Status)  
05 - Soft power  
control failure  
6Fh  
Fatal  
06 - Power unit failure  
00 - Fully Redundant  
OK  
01 - Redundancy lost  
Degraded  
Degraded  
Degraded  
02 - Redundancy  
degraded  
03 - Non-redundant:  
sufficient resources.  
Transition from full  
redundant state.  
As  
and  
De  
Power Unit RedundancyNote1  
(Pwr Unit Redund)  
Power Unit  
09h  
Generic  
0Bh  
Chassis-  
specific  
02h  
Trig Offset  
A
X
04 – Non-redundant:  
sufficient resources.  
Transition from  
Degraded  
Fatal  
insufficient state.  
05 - Non-redundant:  
insufficient resources  
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Appendix B: Integrated BMC Sensor Tables  
Full Sensor Name  
(Sensor name in SDR)  
Sensor  
#
Platform  
Applicability  
Sensor Type  
Event/Readi  
ng Type  
Event Offset Triggers  
Contrib. To  
System Status  
Assert/ Readable  
De-  
Event  
Data  
Rearm  
Stand-  
by  
assert Value/Of  
fsets  
06 – Redundant:  
degraded from fully  
redundant state.  
Degraded  
Degraded  
07 – Redundant:  
Transition from non-  
redundant state.  
00 - Timer expired,  
status only  
Sensor  
Specific  
01 - Hard reset  
IPMI Watchdog  
Watchdog 2  
23h  
Trig Offset  
Trig Offset  
03h  
04h  
All  
OK  
OK  
As  
A
A
X
X
02 - Power down  
03 - Power cycle  
08 - Timer interrupt  
00 - Chassis intrusion  
(IPMI Watchdog)  
6Fh  
Chassis  
Intrusion is  
chassis-  
specific  
Physical  
Security  
Sensor  
Specific  
As  
and  
De  
Physical Security  
04 - LAN leash lost  
(Physical Scrty)  
05h  
6Fh  
Critical  
Interrupt  
Sensor  
Specific  
00 - Front panel  
NMI/diagnostic  
interrupt  
FP Interrupt  
Chassis -  
specific  
05h  
06h  
OK  
As  
Trig Offset  
Trig Offset  
A
A
(FP NMI Diag Int)  
13h  
6Fh  
Digital  
Discrete  
01 – State asserted  
As  
and  
De  
SMI Timeout  
SMI Timeout  
F3h  
All  
All  
Fatal  
(SMI Timeout)  
03h  
Event  
Logging  
Disabled  
Sensor  
Specific  
02 - Log area  
reset/cleared  
System Event Log  
(System Event Log)  
OK  
As  
-
Trig Offset  
Trig Offset  
A
A
X
X
07h  
08h  
6Fh  
10h  
02 - Undetermined  
system H/W failure  
As  
and  
De  
Sensor  
Specific  
System Event  
12h  
Fatal  
OK  
System Event  
(System Event)  
All  
04 – PEF action  
6Fh  
As  
Revision 2.4  
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Appendix B: Integrated BMC Sensor Tables  
Intel® Server Board S2600GZ/GL TPS  
Full Sensor Name  
(Sensor name in SDR)  
Sensor  
#
Platform  
Applicability  
Sensor Type  
Event/Readi  
ng Type  
Event Offset Triggers  
Contrib. To  
System Status  
Assert/ Readable  
De-  
Event  
Data  
Rearm  
Stand-  
by  
assert Value/Of  
fsets  
Sensor  
Specific  
00 – Power Button  
02 – Reset Button  
Button Sensor  
Button/Switch  
14h  
OK  
AS  
_
Trig Offset  
A
X
09h  
All  
(Button)  
6Fh  
Mgmt System  
Health  
Digital  
Discrete  
01 – State Asserted  
01 – State Asserted  
Degraded  
Fatal  
As  
Trig Offset  
Trig Offset  
A
-
BMC Watchdog  
0Ah  
0Bh  
All  
All  
28h  
03h  
Digital  
Discrete  
As  
and  
De  
Voltage  
02h  
Voltage Regulator Watchdog  
(VR Watchdog)  
M
X
03h  
00 - Fully redundant  
01 - Redundancy lost  
OK  
Degraded  
02 - Redundancy  
degraded  
Degraded  
Degraded  
03 - Non-redundant:  
Sufficient resources.  
Transition from  
redundant  
04 - Non-redundant:  
Sufficient resources.  
Transition from  
Fan RedundancyNote1  
As  
and  
De  
Fan  
04h  
Generic  
0Bh  
Chassis-  
specific  
0Ch  
Trig Offset  
A
Degraded  
(Fan Redundancy)  
insufficient.  
05 - Non-redundant:  
insufficient resources.  
Non-Fatal  
Degraded  
06 – Non-Redundant:  
degraded from fully  
redundant.  
07 - Redundant  
degraded from non-  
redundant  
Degraded  
Fatal  
Digital  
Discrete  
As  
and  
De  
Temperature  
01h  
SSB Thermal Trip  
(SSB Therm Trip)  
01 – State Asserted  
Trig Offset  
M
X
0Dh  
All  
03h  
200  
Revision 2.4  
Intel® Server Board S2600GZ/GL TPS  
Appendix B: Integrated BMC Sensor Tables  
Full Sensor Name  
(Sensor name in SDR)  
Sensor  
#
Platform  
Applicability  
Sensor Type  
Event/Readi  
ng Type  
Event Offset Triggers  
Contrib. To  
System Status  
Assert/ Readable  
De-  
Event  
Data  
Rearm  
Stand-  
by  
assert Value/Of  
fsets  
Module/Boar  
d
Digital  
Discrete  
As  
and  
De  
IO Module Presence  
(IO Mod Presence)  
Platform-  
specific  
0Eh  
0Fh  
01 – Inserted/Present  
01 – Inserted/Present  
OK  
Trig Offset  
Trig Offset  
M
M
X
X
15h  
08h  
Module/Boar  
d
Digital  
Discrete  
As  
and  
De  
SAS Module Presence  
(SAS Mod Presence)  
Platform-  
specific  
OK  
15h  
08h  
Sensor  
Specific  
BMC Firmware Health  
(BMC FW Health)  
Mgmt Health  
28h  
Degraded  
10h  
11h  
20h  
All  
All  
04 – Sensor Failure  
As  
-
Trig Offset  
A
X
6Fh  
Threshold  
01h  
System Airflow  
(System Airflow)  
Other Units  
0Bh  
Analog  
Analog  
nc =  
Degraded  
As  
and  
De  
Baseboard Temperature 1  
Temperature Threshold  
01h 01h  
Platform-  
specific  
[u,l] [c,nc]  
R, T  
A
X
(Platform Specific)  
c = Non-fatal  
nc =  
Degraded  
As  
and  
De  
Front Panel Temperature  
Temperature Threshold  
01h 01h  
21h  
All  
All  
[u,l] [c,nc]  
[u,l] [c,nc]  
[u,l] [c,nc]  
[u,l] [c,nc]  
[u,l] [c,nc]  
Analog  
Analog  
Analog  
Analog  
Analog  
R, T  
R, T  
R, T  
R, T  
R, T  
A
A
A
A
A
X
X
X
X
X
(Front Panel Temp)  
c = Non-fatal  
nc =  
Degraded  
As  
and  
De  
Temperature Threshold  
01h 01h  
SSB Temperature  
22h  
23h  
24h  
25h  
(SSB Temp)  
c = Non-fatal  
nc =  
Degraded  
As  
and  
De  
Baseboard Temperature 2  
Temperature Threshold  
01h 01h  
Platform-  
specific  
(Platform Specific)  
c = Non-fatal  
nc =  
Degraded  
As  
and  
De  
Baseboard Temperature 3  
Temperature Threshold  
01h 01h  
Platform-  
specific  
(Platform Specific)  
c = Non-fatal  
nc =  
Degraded  
As  
and  
De  
Baseboard Temperature 4  
Temperature Threshold  
01h 01h  
Platform-  
specific  
(Platform Specific)  
c = Non-fatal  
Revision 2.4  
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Appendix B: Integrated BMC Sensor Tables  
Intel® Server Board S2600GZ/GL TPS  
Full Sensor Name  
(Sensor name in SDR)  
Sensor  
#
Platform  
Applicability  
Sensor Type  
Event/Readi  
ng Type  
Event Offset Triggers  
Contrib. To  
System Status  
Assert/ Readable  
De-  
Event  
Data  
Rearm  
Stand-  
by  
assert Value/Of  
fsets  
nc =  
Degraded  
As  
and  
De  
IO Module Temperature  
(I/O Mod Temp)  
Temperature Threshold  
01h 01h  
Platform-  
specific  
26h  
27h  
28h  
[u,l] [c,nc]  
[u,l] [c,nc]  
[u,l] [c,nc]  
Analog  
Analog  
Analog  
R, T  
R, T  
R, T  
A
A
A
X
X
X
c = Non-fatal  
nc =  
Degraded  
As  
and  
De  
PCI Riser 1 Temperature  
(PCI Riser 1 Temp)  
Temperature Threshold  
01h 01h  
Platform-  
specific  
c = Non-fatal  
nc =  
Degraded  
As  
and  
De  
IO Riser Temperature  
(IO Riser Temp)  
Temperature Threshold  
01h 01h  
Platform-  
specific  
c = Non-fatal  
Hot-swap Backplane 1  
Temperature  
nc =  
Degraded  
As  
and  
De  
Temperature Threshold  
01h 01h  
Chassis-  
specific  
29h  
2Ah  
2Bh  
[u,l] [c,nc]  
[u,l] [c,nc]  
[u,l] [c,nc]  
Analog  
Analog  
Analog  
R, T  
R, T  
R, T  
A
A
A
X
X
X
c = Non-fatal  
(HSBP 1 Temp)  
Hot-swap Backplane 2  
Temperature  
nc =  
Degraded  
As  
and  
De  
Temperature Threshold  
01h 01h  
Chassis-  
specific  
c = Non-fatal  
(HSBP 2 Temp)  
Hot-swap Backplane 3  
Temperature  
nc =  
Degraded  
As  
and  
De  
Temperature Threshold  
01h 01h  
Chassis-  
specific  
c = Non-fatal  
(HSBP 3 Temp)  
nc =  
Degraded  
As  
and  
De  
PCI Riser 2 Temperature  
(PCI Riser 2 Temp)  
Temperature Threshold  
01h 01h  
Platform-  
specific  
2Ch  
2Dh  
2Eh  
2Fh  
[u,l] [c,nc]  
[u,l] [c,nc]  
[u,l] [c,nc]  
[u,l] [c,nc]  
Analog  
Analog  
Analog  
Analog  
R, T  
R, T  
R, T  
R, T  
A
A
A
A
X
X
X
X
c = Non-fatal  
nc =  
Degraded  
As  
and  
De  
SAS Module Temperature  
(SAS Mod Temp)  
Temperature Threshold  
01h 01h  
Platform-  
specific  
c = Non-fatal  
nc =  
Degraded  
Chassis &  
Platform  
Specific  
As  
and  
De  
Exit Air Temperature  
(Exit Air Temp)  
Temperature Threshold  
01h 01h  
c = Non-fatal  
Network Interface Controller  
Temperature  
nc =  
Degraded  
As  
and  
De  
Temperature Threshold  
01h 01h  
All  
(LAN NIC Temp)  
c = Non-fatal  
202  
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Appendix B: Integrated BMC Sensor Tables  
Full Sensor Name  
(Sensor name in SDR)  
Sensor  
#
Platform  
Applicability  
Sensor Type  
Event/Readi  
ng Type  
Event Offset Triggers  
Contrib. To  
System Status  
Assert/ Readable  
De-  
Event  
Data  
Rearm  
Stand-  
by  
assert Value/Of  
fsets  
nc =  
Degraded  
Fan Tachometer Sensors  
Chassis &  
Platform  
Specific  
As  
and  
De  
Fan  
04h  
Threshold  
01h  
30h–  
3Fh  
[l] [c,nc]  
Analog  
-
R, T  
M
-
-
(Chassis specific  
sensor names)  
c = Non-  
fatalNote2  
Chassis &  
Platform  
Specific  
As  
and  
De  
Fan Present Sensors  
Fan  
04h  
40h–  
4Fh  
Generic  
08h  
Triggered  
Offset  
01 - Device inserted  
OK  
Auto  
(Fan x Present)  
00 - Presence  
01 - Failure  
OK  
Degraded  
Power  
Supply  
Sensor  
Specific  
As  
and  
De  
Power Supply 1 Status  
Chassis-  
specific  
02 – Predictive Failure Degraded  
50h  
51h  
Trig Offset  
A
A
X
X
(PS1 Status)  
03 - A/C lost  
Degraded  
08h  
6Fh  
06 – Configuration  
error  
OK  
00 - Presence  
01 - Failure  
OK  
Degraded  
Power  
Supply  
Sensor  
Specific  
As  
and  
De  
Power Supply 2 Status  
Chassis-  
specific  
02 – Predictive Failure Degraded  
Trig Offset  
(PS2 Status)  
03 - A/C lost  
Degraded  
08h  
6Fh  
06 – Configuration  
error  
OK  
Power Supply 1  
AC Power Input  
nc =  
Degraded  
As  
and  
De  
Other Units  
0Bh  
Threshold  
01h  
Chassis-  
specific  
54h  
55h  
58h  
59h  
[u] [c,nc]  
[u] [c,nc]  
[u] [c,nc]  
[u] [c,nc]  
Analog  
Analog  
Analog  
Analog  
R, T  
R, T  
R, T  
R, T  
A
A
A
A
X
X
X
X
(PS1 Power In)  
c = Non-fatal  
Power Supply 2  
AC Power Input  
nc =  
Degraded  
As  
and  
De  
Other Units  
0Bh  
Threshold  
01h  
Chassis-  
specific  
(PS2 Power In)  
c = Non-fatal  
Power Supply 1 +12V % of  
Maximum Current Output  
nc =  
Degraded  
As  
and  
De  
Current  
03h  
Threshold  
01h  
Chassis-  
specific  
(PS1 Curr Out %)  
c = Non-fatal  
Power Supply 2 +12V % of  
Maximum Current Output  
nc =  
Degraded  
As  
and  
De  
Current  
03h  
Threshold  
01h  
Chassis-  
specific  
(PS2 Curr Out %)  
c = Non-fatal  
Revision 2.4  
203  
Appendix B: Integrated BMC Sensor Tables  
Intel® Server Board S2600GZ/GL TPS  
Full Sensor Name  
(Sensor name in SDR)  
Sensor  
#
Platform  
Applicability  
Sensor Type  
Event/Readi  
ng Type  
Event Offset Triggers  
Contrib. To  
System Status  
Assert/ Readable  
De-  
Event  
Data  
Rearm  
Stand-  
by  
assert Value/Of  
fsets  
nc =  
Degraded  
As  
and  
De  
Power Supply 1 Temperature  
Temperature Threshold  
Chassis-  
specific  
5Ch  
5Dh  
[u] [c,nc]  
[u] [c,nc]  
Analog  
R, T  
R, T  
A
A
X
X
(PS1 Temperature)  
01h  
01h  
c = Non-fatal  
nc =  
Degraded  
As  
and  
De  
Power Supply 2 Temperature  
Threshold  
01h  
Chassis-  
specific  
Temperature  
Analog  
(PS2 Temperature)  
c = Non-fatal  
00 - Drive Presence  
01- Drive Fault  
OK  
Degraded  
Degraded  
Fatal  
60h  
Hard Disk Drive 16 - 24  
Status  
Sensor  
Specific  
As  
and  
De  
Drive Slot  
0Dh  
Chassis-  
specific  
Trig Offset  
A
X
07 - Rebuild/Remap in  
progress  
(HDD 16 - 24 Status)  
6Fh  
68h  
Sensor  
Specific  
As  
and  
De  
01 - Thermal trip  
Processor 1 Status  
Processor  
07h  
70h  
71h  
All  
All  
Trig Offset  
Trig Offset  
M
M
X
X
(P1 Status)  
07 - Presence  
OK  
6Fh  
Sensor  
Specific  
01 - Thermal trip  
Fatal  
As  
and  
De  
Processor 2 Status  
Processor  
07h  
(P2 Status)  
07 - Presence  
-
OK  
6Fh  
Temperature Threshold  
01h 01h  
Temperature Threshold  
01h 01h  
Processor 1 Thermal Margin  
(P1 Therm Margin)  
74h  
75h  
All  
All  
-
-
-
Analog  
Analog  
R, T  
R, T  
A
A
Processor 2 Thermal Margin  
(P2 Therm Margin)  
-
-
Processor 1 Thermal  
Control %  
nc =  
Degraded  
As  
and  
De  
Temperature Threshold  
01h 01h  
78h  
79h  
All  
All  
[u] [c,nc]  
Analog  
Analog  
Trig Offset  
Trig Offset  
A
A
(P1 Therm Ctrl %)  
c = Non-fatal  
Processor 2 Thermal  
Control %  
nc =  
Degraded  
As  
and  
De  
Temperature Threshold  
01h 01h  
[u] [c,nc]  
(P2 Therm Ctrl %)  
c = Non-fatal  
204  
Revision 2.4  
Intel® Server Board S2600GZ/GL TPS  
Appendix B: Integrated BMC Sensor Tables  
Full Sensor Name  
(Sensor name in SDR)  
Sensor  
#
Platform  
Applicability  
Sensor Type  
Event/Readi  
ng Type  
Event Offset Triggers  
Contrib. To  
System Status  
Assert/ Readable  
De-  
Event  
Data  
Rearm  
Stand-  
by  
assert Value/Of  
fsets  
Digital  
Discrete  
As  
and  
De  
Processor 1 ERR2 Timeout  
(P1 ERR2)  
Processor  
07h  
7Ch  
7Dh  
80h  
81h  
82h  
87h  
90h  
91h  
94h  
95h  
All  
All  
All  
All  
All  
All  
All  
All  
All  
All  
01 – State Asserted  
01 – State Asserted  
01 – State Asserted  
01 – State Asserted  
01 – State Asserted  
01 – State Asserted  
01 - Limit exceeded  
01 - Limit exceeded  
01 - Limit exceeded  
01 - Limit exceeded  
fatal  
fatal  
Trig Offset  
Trig Offset  
Trig Offset  
Trig Offset  
Trig Offset  
Trig Offset  
Trig Offset  
Trig Offset  
Trig Offset  
Trig Offset  
A
A
03h  
Digital  
Discrete  
As  
and  
De  
Processor 2 ERR2 Timeout  
(P2 ERR2)  
Processor  
07h  
03h  
Digital  
Discrete  
As  
and  
De  
Catastrophic Error  
Processor  
07h  
fatal  
M
M
M
M
M
M
A
(CATERR)  
03h  
Digital  
Discrete  
As  
and  
De  
Processor0 MSID Mismatch  
Processor  
07h  
fatal  
(P0 MSID Mismatch)  
03h  
Digital  
Discrete  
As  
and  
De  
Processor Population Fault  
Processor  
07h  
Fatal  
(CPU Missing)  
03h  
Digital  
Discrete  
As  
and  
De  
Processor1 MSID Mismatch  
Processor  
07h  
fatal  
(P1 MSID Mismatch)  
03h  
Processor 1 VRD  
Temperature  
Digital  
Discrete  
As  
and  
De  
Temperature  
01h  
Non-fatal  
Non-fatal  
Non-fatal  
Non-fatal  
(P1 VRD Hot)  
05h  
Processor 2 VRD  
Temperature  
Digital  
Discrete  
As  
and  
De  
Temperature  
01h  
(P2 VRD Hot)  
05h  
Digital  
Discrete  
As  
and  
De  
Processor 1 Memory VRD  
Hot 0-1  
(P1 Mem01 VRD Hot)  
Temperature  
01h  
05h  
Digital  
Discrete  
As  
and  
De  
Processor 1 Memory VRD  
Hot 2-3  
(P1 Mem23 VRD Hot)  
Temperature  
01h  
A
05h  
Revision 2.4  
205  
Appendix B: Integrated BMC Sensor Tables  
Intel® Server Board S2600GZ/GL TPS  
Full Sensor Name  
(Sensor name in SDR)  
Sensor  
#
Platform  
Applicability  
Sensor Type  
Event/Readi  
ng Type  
Event Offset Triggers  
Contrib. To  
System Status  
Assert/ Readable  
De-  
Event  
Data  
Rearm  
Stand-  
by  
assert Value/Of  
fsets  
Digital  
Discrete  
As  
and  
De  
Processor 2 Memory VRD  
Hot 0-1  
(P2 Mem01 VRD Hot)  
Temperature  
01h  
01 - Limit exceeded  
01 - Limit exceeded  
Non-fatal  
Non-fatal  
Trig Offset  
Trig Offset  
A
A
96h  
97h  
All  
All  
05h  
Digital  
Discrete  
As  
and  
De  
Processor 2 Memory VRD  
Hot 2-3  
(P2 Mem23 VRD Hot)  
Temperature  
01h  
05h  
As  
and  
De  
Power Supply 1 Fan  
Tachometer 1  
(PS1 Fan Tach 1)  
Generic –  
digital  
discrete  
Fan  
04h  
Chassis-  
specific  
01 – State Asserted  
01 – State Asserted  
01 – State Asserted  
01 – State Asserted  
Non-fatal  
Non-fatal  
Non-fatal  
Non-fatal  
-
-
-
-
Trig Offset  
Trig Offset  
Trig Offset  
Trig Offset  
M
M
M
M
-
-
-
-
A0h  
A1h  
A4h  
A5h  
As  
and  
De  
Power Supply 1 Fan  
Tachometer 2  
(PS1 Fan Tach 2)  
Generic –  
digital  
discrete  
Fan  
04h  
Chassis-  
specific  
As  
and  
De  
Power Supply 2 Fan  
Tachometer 1  
(PS2 Fan Tach 1)  
Generic –  
digital  
discrete  
Fan  
04h  
Chassis-  
specific  
As  
and  
De  
Power Supply 2 Fan  
Tachometer 2  
(PS2 Fan Tach 2)  
Generic –  
digital  
discrete  
Fan  
04h  
Chassis-  
specific  
nc =  
Degraded  
As  
and  
De  
Processor 1 DIMM Aggregate  
Thermal Margin  
Temperature Threshold  
01h 01h  
[u,l] [c,nc]  
[u,l] [c,nc]  
Analog  
Analog  
R, T  
R, T  
A
A
B0h  
B1h  
All  
All  
(P1 DIMM Thrm Mrgn)  
c = Non-fatal  
nc =  
Degraded  
As  
and  
De  
Processor 2 DIMM Aggregate  
Thermal Margin  
Temperature Threshold  
01h  
01h  
(P2 DIMM Thrm Mrgn)  
c = Non-fatal  
Digital  
Discrete  
As  
and  
De  
Processor 1 DIMM  
Thermal Trip  
(P1 Mem Thrm Trip)  
Temperature  
01h  
01 – State Asserted  
01 – State Asserted  
Fatal  
Trig Offset  
Trig Offset  
M
M
X
X
C0h  
C1h  
All  
All  
03h  
Digital  
Discrete  
As  
and  
De  
Processor 2 DIMM  
Thermal Trip  
(P2 Mem Thrm Trip)  
Temperature  
01h  
Fatal  
03h  
206  
Revision 2.4  
Intel® Server Board S2600GZ/GL TPS  
Appendix B: Integrated BMC Sensor Tables  
Full Sensor Name  
(Sensor name in SDR)  
Sensor  
#
Platform  
Applicability  
Sensor Type  
Event/Readi  
ng Type  
Event Offset Triggers  
Contrib. To  
System Status  
Assert/ Readable  
De-  
Event  
Data  
Rearm  
Stand-  
by  
assert Value/Of  
fsets  
Global Aggregate  
Temperature Margin 1  
(Agg Therm Mrgn 1)  
Global Aggregate  
Temperature Margin 2  
(Agg Therm Mrgn 2)  
Global Aggregate  
Temperature Margin 3  
(Agg Therm Mrgn 3)  
Global Aggregate  
Temperature Margin 4  
(Agg Therm Mrgn 4)  
Global Aggregate  
Temperature Margin 5  
(Agg Therm Mrgn 5)  
Global Aggregate  
Temperature Margin 6  
(Agg Therm Mrgn 6)  
Global Aggregate  
Temperature Margin 7  
(Agg Therm Mrgn 7)  
Global Aggregate  
Temperature Margin 8  
(Agg Therm Mrgn 8)  
Temperature Threshold  
01h 01h  
Temperature Threshold  
01h 01h  
Temperature Threshold  
01h 01h  
Temperature Threshold  
01h 01h  
Temperature Threshold  
01h 01h  
Temperature Threshold  
01h 01h  
Temperature Threshold  
01h 01h  
Temperature Threshold  
Platform  
Specific  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Analog  
Analog  
Analog  
Analog  
Analog  
Analog  
Analog  
Analog  
R, T  
R, T  
R, T  
R, T  
R, T  
R, T  
R, T  
R, T  
A
A
A
A
A
A
A
A
C8h  
C9h  
CAh  
CBh  
CCh  
CDh  
CEh  
CFh  
Platform  
Specific  
Platform  
Specific  
Platform  
Specific  
Platform  
Specific  
Platform  
Specific  
Platform  
Specific  
Platform  
Specific  
01h  
01h  
nc =  
Degraded  
As  
and  
De  
Baseboard +12V  
(BB +12.0V)  
Voltage  
02h  
Threshold  
01h  
[u,l] [c,nc]  
[u,l] [c,nc]  
[u,l] [c,nc]  
[u,l] [c,nc]  
Analog  
Analog  
Analog  
Analog  
R, T  
R, T  
R, T  
R, T  
A
A
A
A
X
D0h  
D1h  
D2h  
D3h  
All  
All  
All  
All  
c = Non-fatal  
nc =  
Degraded  
As  
and  
De  
Baseboard +5V  
(BB +5.0V)  
Voltage  
02h  
Threshold  
01h  
c = Non-fatal  
nc =  
Degraded  
As  
and  
De  
Baseboard +3.3V  
Voltage  
02h  
Threshold  
01h  
(BB +3.3V)  
c = Non-fatal  
nc =  
Degraded  
As  
and  
De  
Baseboard +5V Stand-by  
Voltage  
02h  
Threshold  
01h  
(BB +5.0V STBY)  
c = Non-fatal  
Revision 2.4  
207  
Appendix B: Integrated BMC Sensor Tables  
Intel® Server Board S2600GZ/GL TPS  
Full Sensor Name  
(Sensor name in SDR)  
Sensor  
#
Platform  
Applicability  
Sensor Type  
Event/Readi  
ng Type  
Event Offset Triggers  
Contrib. To  
System Status  
Assert/ Readable  
De-  
Event  
Data  
Rearm  
Stand-  
by  
assert Value/Of  
fsets  
nc =  
Degraded  
As  
and  
De  
Baseboard +3.3V Auxiliary  
Voltage  
02h  
Threshold  
01h  
[u,l] [c,nc]  
[u,l] [c,nc]  
[u,l] [c,nc]  
[u,l] [c,nc]  
[u,l] [c,nc]  
[u,l] [c,nc]  
[u,l] [c,nc]  
[u,l] [c,nc]  
[u,l] [c,nc]  
[u,l] [c,nc]  
Analog  
Analog  
Analog  
Analog  
Analog  
Analog  
Analog  
Analog  
Analog  
Analog  
R, T  
R, T  
R, T  
R, T  
R, T  
R, T  
R, T  
R, T  
R, T  
R, T  
A
A
A
A
A
A
A
A
A
A
X
D4h  
D6h  
D7h  
D8h  
D9h  
DAh  
DBh  
DCh  
DDh  
DEh  
All  
All  
All  
All  
All  
All  
All  
All  
All  
All  
(BB +3.3V AUX)  
c = Non-fatal  
Baseboard +1.05V Processor  
1 Vccp  
nc =  
Degraded  
As  
and  
De  
Voltage  
02h  
Threshold  
01h  
(BB +1.05Vccp P1)  
c = Non-fatal  
Baseboard +1.05V Processor  
1 Vccp  
nc =  
Degraded  
As  
and  
De  
Voltage  
02h  
Threshold  
01h  
(BB +1.05Vccp P2)  
c = Non-fatal  
Baseboard +1.5V P1 Memory  
AB VDDQ  
nc =  
Degraded  
As  
and  
De  
Voltage  
02h  
Threshold  
01h  
(BB +1.5 P1MEM AB)  
c = Non-fatal  
Baseboard +1.5V P1 Memory  
CD VDDQ  
nc =  
Degraded  
As  
and  
De  
Voltage  
02h  
Threshold  
01h  
(BB +1.5 P1MEM CD)  
c = Non-fatal  
Baseboard +1.5V P2 Memory  
AB VDDQ  
nc =  
Degraded  
As  
and  
De  
Voltage  
02h  
Threshold  
01h  
(BB +1.5 P2MEM AB)  
c = Non-fatal  
Baseboard +1.5V P2 Memory  
CD VDDQ  
nc =  
Degraded  
As  
and  
De  
Voltage  
02h  
Threshold  
01h  
(BB +1.5 P2MEM CD)  
c = Non-fatal  
nc =  
Degraded  
As  
and  
De  
Baseboard +1.8V Aux  
(BB +1.8V AUX)  
Voltage  
02h  
Threshold  
01h  
c = Non-fatal  
nc =  
Degraded  
As  
and  
De  
Baseboard +1.1V Stand-by  
(BB +1.1V STBY)  
Voltage  
02h  
Threshold  
01h  
c = Non-fatal  
nc =  
Degraded  
As  
and  
De  
Baseboard CMOS Battery  
Voltage  
02h  
Threshold  
01h  
(BB +3.3V Vbat)  
c = Non-fatal  
208  
Revision 2.4  
Intel® Server Board S2600GZ/GL TPS  
Appendix B: Integrated BMC Sensor Tables  
Full Sensor Name  
(Sensor name in SDR)  
Sensor  
#
Platform  
Applicability  
Sensor Type  
Event/Readi  
ng Type  
Event Offset Triggers  
Contrib. To  
System Status  
Assert/ Readable  
De-  
Event  
Data  
Rearm  
Stand-  
by  
assert Value/Of  
fsets  
Baseboard +1.35V P1 Low  
Voltage Memory AB VDDQ  
nc =  
Degraded  
As  
and  
De  
Voltage  
02h  
Threshold  
01h  
[u,l] [c,nc]  
[u,l] [c,nc]  
[u,l] [c,nc]  
[u,l] [c,nc]  
[u,l] [c,nc]  
[u,l] [c,nc]  
Analog  
Analog  
Analog  
Analog  
Analog  
Analog  
R, T  
R, T  
R, T  
R, T  
R, T  
R, T  
A
A
A
A
A
A
E4h  
E5h  
E6h  
E7h  
EAh  
EBh  
All  
All  
All  
All  
(BB +1.35 P1LV AB)  
c = Non-fatal  
Baseboard +1.35V P1 Low  
Voltage Memory CD VDDQ  
nc =  
Degraded  
As  
and  
De  
Voltage  
02h  
Threshold  
01h  
(BB +1.35 P1LV CD)  
c = Non-fatal  
Baseboard +1.35V P2 Low  
Voltage Memory AB VDDQ  
nc =  
Degraded  
As  
and  
De  
Voltage  
02h  
Threshold  
01h  
(BB +1.35 P2LV AB)  
c = Non-fatal  
Baseboard +1.35V P2 Low  
Voltage Memory CD VDDQ  
nc =  
Degraded  
As  
and  
De  
Voltage  
02h  
Threshold  
01h  
(BB +1.35 P2LV CD)  
c = Non-fatal  
Baseboard +3.3V Riser 1  
Power Good  
nc =  
Degraded  
As  
and  
De  
Platform  
Specific  
Voltage  
02h  
Threshold  
01h  
(BB +3.3 RSR1 PGD)  
c = Non-fatal  
Baseboard +3.3V Riser 2  
Power Good  
nc =  
Degraded  
As  
and  
De  
Platform  
Specific  
Voltage  
02h  
Threshold  
01h  
(BB +3.3 RSR2 PGD)  
c = Non-fatal  
OK  
00 - Drive Presence  
01- Drive Fault  
Degraded  
F0h  
-
Sensor  
Specific  
As  
and  
De  
Hard Disk Drive 1 -15 Status  
(HDD 1 - 15 Status)  
Drive Slot  
0Dh  
Chassis-  
specific  
07 - Rebuild/Remap in  
progress  
Trig Offset  
A
X
6Fh  
FEh  
Degraded  
Revision 2.4  
209  
Appendix C: Management Engine Generated SEL Event Messages  
Intel® Server Board S2600GZ/GL TPS  
Appendix C: Management Engine Generated SEL Event  
Messages  
This appendix lists the OEM System Event Log message format of events generated by the  
Management Engine (ME). This includes the definition of event data bytes 10-16 of the  
Management Engine generated SEL records. For System Event Log format information, see the  
Intelligent Platform Management Interface Specification, Version 2.0.  
Table 62. Server Platform Services Firmware Health Event  
Server Platform Services  
Firmware Health Event  
Request  
Byte 1 - EvMRev  
=04h (IPMI2.0 format)  
Byte 2 – Sensor Type  
=DCh (OEM)  
Byte 3 – Sensor Number  
=23 – Server Platform Services Firmware Health  
Byte 4 – Event Dir | Event Type  
[7] – Event Dir  
=0 Assertion Event  
[6-0] – Event Type  
=75h (OEM)  
Byte 5 – Event Data 1  
[7,6]=10b – OEM code in byte 2  
[5,4]=10b – OEM code in byte 3  
[3..0] – Health Event Type  
=00h –Firmware Status  
Byte 6 – Event Data 2  
=0 - Forced GPIO recovery. Recovery Image loaded due to MGPIO<n>  
(default recovery pin is MGPIO1) pin asserted.  
Repair action: Deassert MGPIO1 and reset the ME  
=1 - Image execution failed. Recovery Image loaded because  
operational image is corrupted. This may be either caused by Flash  
device corruption or failed upgrade procedure.  
Repair action: Either the Flash device must be replaced (if error is  
persistent) or the upgrade procedure must be started again.  
=2 - Flash erase error. Error during Flash erases procedure probably  
due to Flash part corruption.  
Repair action: The Flash device must be replaced.  
=3 – Flash corrupted. Error while checking Flash consistency probably  
due to Flash part corruption.  
Repair action: The Flash device must be replaced (if error is  
persistent).  
=4 – Internal error. Error during firmware execution.  
Repair action: FW Watchdog Timeout  
Operational image shall be upgraded to other version or hardware  
board repair is needed (if error is persistent).  
=5..255 – Reserved  
210  
Revision 2.4  
 
 
Intel® Server Board S2600GZ/GL TPS  
Appendix C: Management Engine Generated SEL Event Messages  
Byte 7 – Event Data 3  
=<Extended error code. Should be used when reporting an error to the  
support>  
Table 63. Node Manager Health Event  
Request  
Node Manager Health  
Event  
Byte 1 - EvMRev  
=04h (IPMI2.0 format)  
Byte 2 – Sensor Type  
=DCh (OEM)  
Byte 3 – Sensor Number  
(Node Manager Health sensor)  
Byte 4 – Event Dir | Event Type  
[0:6] – Event Type  
= 73h (OEM)  
[7] – Event Dir  
=0 Assertion Event  
Byte 5 – Event Data 1  
[0:3] – Health Event Type  
=02h – Sensor Node Manager  
[4:5]=10b – OEM code in byte 3  
[6:7]=10b – OEM code in byte 2  
Byte 6 – Event Data 2  
[0:3] – Domain Id (Currently, supports only one domain,  
Domain 0)  
[4:7] – Error type  
=0-9 - Reserved  
=10 – Policy Misconfiguration  
=11 – Power Sensor Reading Failure  
=12 – Inlet Temperature Reading Failure  
=13 – Host Communication error  
=14 – Real-time clock synchronization failure  
=15 – Reserved  
Byte 7 – Event Data 3  
if error indication = 10 <PolicyId>  
if error indication = 11 <PowerSensorAddress>  
if error indication = 12 <InletSensorAddress>  
Otherwise set to 0.  
211  
Revision 2.4  
 
Appendix D: POST Code Diagnostic LED Decoder  
Intel® Server Board S2600GZ/GL TPS  
Appendix D: POST Code Diagnostic LED Decoder  
As an aid to assist in trouble shooting a system hang that occurs during a system’s Power-On Self Test (POST)  
process, the server board includes a bank of eight POST Code Diagnostic LEDs on the back edge of the  
server board.  
During the system boot process, Memory Reference Code (MRC) and System BIOS execute a number of  
memory initialization and platform configuration processes, each of which is assigned a specific hex POST  
code number. As each routine is started, the given POST code number is displayed to the POST Code  
Diagnostic LEDs on the back edge of the server board.  
During a POST system hang, the displayed post code can be used to identify the last POST routine that was  
run prior to the error occurring, helping to isolate the possible cause of the hang condition.  
Each POST code is represented by eight LEDs; four Green and four Amber. The POST codes are divided into  
two nibbles, an upper nibble and a lower nibble. The upper nibble bits are represented by Amber Diagnostic  
LEDs #4, #5, #6, #7. The lower nibble bits are represented by Green Diagnostics LEDs #0, #1, #2 and #3. If  
the bit is set in the upper and lower nibbles, the corresponding LED is lit. If the bit is clear, the corresponding  
LED is off.  
Figure 69. POST Diagnostic LED Location  
In the following example, the BIOS sends a value of ACh to the diagnostic LED decoder. The LEDs are  
decoded as follows:  
Note: Diag LEDs are best read and decoded when viewing the LEDs from the back of the system  
Table 64. POST Progress Code LED Example  
Upper Nibble AMBER LEDs  
Lower Nibble GREEN LEDs  
MSB  
LED #7  
8h  
LSB  
LEDs  
LED #6  
4h  
LED #5  
2h  
LED #4  
1h  
LED #3  
8h  
LED #2  
4h  
LED #1  
2h  
LED #0  
1h  
Status  
ON  
1
OFF  
0
ON  
1
OFF  
0
ON  
1
ON  
1
OFF  
0
OFF  
0
Results  
Ah  
Ch  
212  
Revision 2.4  
 
 
Intel® Server Board S2600GZ/GL TPS  
Appendix D: POST Code Diagnostic LED Decoder  
Upper nibble bits = 1010b = Ah; Lower nibble bits = 1100b = Ch; the two are concatenated as ACh  
The following table provides a list of all POST progress codes.  
Table 65. POST Progress Codes  
Diagnostic LED Decoder  
1 = LED On, 0 = LED Off  
Upper Nibble  
Lower Nibble  
Checkpoint  
MSB  
8h 4h 2h 1h 8h 4h 2h  
LSB  
1h  
#7 #6 #5 #4 #3 #2 #1 #0  
LED #  
Description  
SEC Phase  
01h  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0
1
1
1
1
0
0
1
1
0
1
1
0
0
1
1
0
0
1
1
1
0
1
0
1
0
1
0
1
0
1
First POST code after CPU reset  
Microcode load begin  
CRAM initialization begin  
02h  
03h  
04h  
05h  
06h  
07h  
08h  
09h  
Pei Cache When Disabled  
SEC Core At Power On Begin.  
Early CPU initialization during Sec Phase.  
Early SB initialization during Sec Phase.  
Early NB initialization during Sec Phase.  
End Of Sec Phase.  
0Eh  
0Fh  
Microcode Not Found.  
Microcode Not Loaded.  
PEI Phase  
10h  
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0
1
0
0
1
0
0
0
0
0
0
1
1
1
PEI Core  
CPU PEIM  
NB PEIM  
SB PEIM  
11h  
15h  
19h  
MRC Process Codes – MRC Progress Code Sequence is executed - See Table 63  
PEI Phase continued…  
31h  
32h  
33h  
34h  
35h  
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
0
1
1
1
1
1
1
0
0
0
0
0
0
0
1
0
0
0
1
1
1
1
0
1
1
0
0
1
1
1
0
1
0
1
0
1
Memory Installed  
CPU PEIM (Cpu Init)  
CPU PEIM (Cache Init)  
CPU PEIM (BSP Select)  
CPU PEIM (AP Init)  
CPU PEIM (CPU SMM Init)  
Dxe IPL started  
36h  
4Fh  
DXE Phase  
60h  
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
0
0
0
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
0
0
1
1
0
0
1
0
0
1
0
0
0
0
1
1
0
0
1
0
1
0
1
0
1
0
0
1
0
0
1
0
1
0
1
0
1
0
DXE Core started  
DXE NVRAM Init  
SB RUN Init  
Dxe CPU Init  
DXE PCI Host Bridge Init  
DXE NB Init  
DXE NB SMM Init  
DXE SB Init  
DXE SB SMM Init  
DXE SB devices Init  
DXE ACPI Init  
61h  
62h  
63h  
68h  
69h  
6Ah  
70h  
71h  
72h  
78h  
79h  
90h  
91h  
92h  
93h  
94h  
95h  
DXE CSM Init  
DXE BDS Started  
DXE BDS connect drivers  
DXE PCI Bus begin  
DXE PCI Bus HPC Init  
DXE PCI Bus enumeration  
DXE PCI Bus resource requested  
DXE PCI Bus assign resource  
96h  
213  
Revision 2.4  
 
Appendix D: POST Code Diagnostic LED Decoder  
Intel® Server Board S2600GZ/GL TPS  
Diagnostic LED Decoder  
1 = LED On, 0 = LED Off  
Upper Nibble  
Lower Nibble  
Checkpoint  
MSB  
8h 4h 2h 1h 8h 4h 2h  
LSB  
1h  
#7 #6 #5 #4 #3 #2 #1 #0  
LED #  
Description  
97h  
98h  
99h  
9Ah  
9Bh  
9Ch  
9Dh  
A1h  
A2h  
A3h  
A4h  
A5h  
A6h  
A7h  
A8h  
A9h  
ABh  
ACh  
ADh  
AEh  
AFh  
B0h  
B1h  
B2h  
B3h  
B4h  
B5h  
B6h  
B7h  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
1
1
1
1
1
1
0
0
0
0
0
0
0
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
1
0
0
0
0
1
1
0
0
0
1
1
1
1
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
1
0
0
1
1
0
0
0
1
1
0
0
1
1
0
0
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
1
0
1
0
1
0
1
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
DXE CON_OUT connect  
DXE CON_IN connect  
DXE SIO Init  
DXE USB start  
DXE USB reset  
DXE USB detect  
DXE USB enable  
DXE IDE begin  
DXE IDE reset  
DXE IDE detect  
DXE IDE enable  
DXE SCSI begin  
DXE SCSI reset  
DXE SCSI detect  
DXE SCSI enable  
DXE verifying SETUP password  
DXE SETUP start  
DXE SETUP input wait  
DXE Ready to Boot  
DXE Legacy Boot  
DXE Exit Boot Services  
RT Set Virtual Address Map Begin  
RT Set Virtual Address Map End  
DXE Legacy Option ROM init  
DXE Reset system  
DXE USB Hot plug  
DXE PCI BUS Hot plug  
DXE NVRAM cleanup  
DXE Configuration Reset  
INT19  
00h  
S3 Resume  
E0h  
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
1
0
1
S3 Resume PEIM (S3 started)  
E1h  
E2h  
E3h  
S3 Resume PEIM (S3 boot script)  
S3 Resume PEIM (S3 Video Repost)  
S3 Resume PEIM (S3 OS wake)  
BIOS Recovery  
F0h  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
1
0
0
1
1
0
0
1
0
1
0
PEIM which detected forced Recovery condition  
PEIM which detected User Recovery condition  
Recovery PEIM (Recovery started)  
Recovery PEIM (Capsule found)  
Recovery PEIM (Capsule loaded)  
F1h  
F2h  
F3h  
F4h  
POST Memory Initialization MRC Diagnostic Codes  
There are two types of POST Diagnostic Codes displayed by the MRC during memory initialization; Progress  
Codes and Fatal Error Codes.  
The MRC Progress Codes are displays to the Diagnostic LEDs that show the execution point in the MRC  
operational path at each step.  
214  
Revision 2.4  
Intel® Server Board S2600GZ/GL TPS  
Appendix D: POST Code Diagnostic LED Decoder  
Table 66. MRC Progress Codes  
Diagnostic LED Decoder  
1 = LED On, 0 = LED Off  
Upper Nibble Lower Nibble  
Checkpoint  
LED  
MSB  
LSB  
Description  
8h 4h 2h 1h 8h 4h 2h 1h  
#3 #2 #1 #0  
#7 #6 #5 #4  
MRC Progress Codes  
B0h  
B1h  
B2h  
B3h  
B4h  
B5h  
B6h  
B7h  
B8h  
B9h  
BAh  
BBh  
BCh  
BFh  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Detect DIMM population  
Set DDR3 frequency  
Gather remaining SPD data  
Program registers on the memory controller level  
Evaluate RAS modes and save rank information  
Program registers on the channel level  
Perform the JEDEC defined initialization sequence  
Train DDR3 ranks  
Initialize CLTT/OLTT  
Hardware memory test and init  
Execute software memory init  
Program memory map and interleaving  
Program RAS configuration  
MRC is done  
Memory Initialization at the beginning of POST includes multiple functions, including: discovery, channel  
training, validation that the DIMM population is acceptable and functional, initialization of the IMC and other  
hardware settings, and initialization of applicable RAS configurations.  
When a major memory initialization error occurs and prevents the system from booting with data integrity, a  
beep code is generated, the MRC will display a fatal error code on the diagnostic LEDs, and a system halt  
command is executed. Fatal MRC error halts do NOT change the state of the System Status LED, and they do  
NOT get logged as SEL events. The following table lists all MRC fatal errors that are displayed to the  
Diagnostic LEDs.  
Table 67. MRC Fatal Error Codes  
Diagnostic LED Decoder  
1 = LED On, 0 = LED Off  
Upper Nibble  
Lower Nibble  
Checkpoint  
Description  
MSB  
LSB  
8h 4h 2h 1h 8h 4h 2h 1h  
#7 #6 #5 #4 #3 #2 #1 #0  
LED  
MRC Fatal Error Codes  
E8h  
No usable memory error  
1
1
1
0
1
0
0
0
01h = No memory was detected from SPD read, or invalid config that  
causes no operable memory.  
215  
Revision 2.4  
 
 
Appendix D: POST Code Diagnostic LED Decoder  
Intel® Server Board S2600GZ/GL TPS  
Diagnostic LED Decoder  
1 = LED On, 0 = LED Off  
Upper Nibble  
Lower Nibble  
Checkpoint  
Description  
MSB  
LSB  
8h 4h 2h 1h 8h 4h 2h 1h  
#7 #6 #5 #4 #3 #2 #1 #0  
LED  
02h = Memory DIMMs on all channels of all sockets are disabled due to  
hardware memtest error.  
3h = No memory installed. All channels are disabled.  
Memory is locked by Intel Trusted Execution Technology and is  
inaccessible  
DDR3 channel training error  
01h = Error on read DQ/DQS (Data/Data Strobe) init  
02h = Error on Receive Enable  
E9h  
EAh  
1
1
1
1
1
1
0
0
1
1
0
0
0
1
1
0
3h = Error on Write Leveling  
04h = Error on write DQ/DQS (Data/Data Strobe  
EBh  
EDh  
Memory test failure  
01h = Software memtest failure.  
02h = Hardware memtest failed.  
03h = Hardware Memtest failure in Lockstep Channel mode requiring a  
channel to be disabled. This is a fatal error which requires a reset and  
calling MRC with a different RAS mode to retry.  
DIMM configuration population error  
1
1
1
0
1
0
1
1
01h = Different DIMM types (UDIMM, RDIMM, LRDIMM) are detected  
installed in the system.  
02h = Violation of DIMM population rules.  
03h = The 3rd DIMM slot cannot be populated when QR DIMMs are  
installed.  
04h = UDIMMs are not supported in the 3rd DIMM slot.  
05h = Unsupported DIMM Voltage.  
1
1
1
1
1
1
0
0
1
1
1
1
0
1
1
1
EFh  
Indicates a CLTT table structure error  
216  
Revision 2.4  
Intel® Server Board S2600GZ/GL TPS  
Appendix E: POST Code Errors  
Appendix E: POST Code Errors  
Most error conditions encountered during POST are reported using POST Error Codes. These  
codes represent specific failures, warnings, or are informational. POST Error Codes may be  
displayed in the Error Manager display screen, and are always logged to the System Event Log  
(SEL). Logged events are available to System Management applications, including Remote and  
Out of Band (OOB) management.  
There are exception cases in early initialization where system resources are not adequately  
initialized for handling POST Error Code reporting. These cases are primarily Fatal Error  
conditions resulting from initialization of processors and memory, and they are handed by a  
Diagnostic LED display with a system halt.  
The following table lists the supported POST Error Codes. Each error code is assigned an error  
type which determines the action the BIOS will take when the error is encountered. Error types  
include Minor, Major, and Fatal. The BIOS action for each is defined as follows:  
Minor: The error message is displayed on the screen or on the Error Manager screen, and an  
error is logged to the SEL. The system continues booting in a degraded state. The user may  
want to replace the erroneous unit. The POST Error Pause option setting in the BIOS setup  
does not have any effect on this error.  
Major: The error message is displayed on the Error Manager screen, and an error is logged to  
the SEL. The POST Error Pause option setting in the BIOS setup determines whether the  
system pauses to the Error Manager for this type of error so the user can take immediate  
corrective action or the system continues booting.  
Note that for 0048 “Password check failed”, the system halts, and then after the next  
reset/reboot will displays the error code on the Error Manager screen.  
Fatal: The system halts during post at a blank screen with the text “Unrecoverable fatal error  
found. System will not boot until the error is resolved” and “Press <F2> to enter setup”  
The POST Error Pause option setting in the BIOS setup does not have any effect with this class  
of error.  
When the operator presses the F2 key on the keyboard, the error message is displayed on the  
Error Manager screen, and an error is logged to the SEL with the error code. The system cannot  
boot unless the error is resolved. The user needs to replace the faulty part and restart the  
system.  
Note: The POST error codes in the following table are common to all current generation Intel  
server platforms. Features present on a given server board/system will determine which of the  
listed error codes are supported.  
Table 68. POST Error Codes and Messages  
Error Code  
0012  
Error Message  
System RTC date/time not set  
Response  
Major  
0048  
Password check failed  
Major  
0140  
0141  
PCI component encountered a PERR error  
PCI resource conflict  
Major  
Major  
217  
Revision 2.4  
 
 
Appendix E: POST Code Errors  
Intel® Server Board S2600GZ/GL TPS  
Error Code  
0146  
0191  
0192  
0194  
0195  
0196  
0197  
5220  
5221  
5224  
8130  
8131  
8132  
8133  
8160  
8161  
8162  
8163  
8170  
8171  
8172  
8173  
8180  
8181  
8182  
8183  
8190  
8198  
8300  
8305  
83A0  
83A1  
84F2  
84F3  
84F4  
84FF  
8500  
8501  
8520  
8521  
8522  
8523  
8524  
8525  
8526  
8527  
8528  
8529  
852A  
852B  
852C  
852D  
852E  
852F  
8530  
8531  
8532  
8533  
Error Message  
PCI out of resources error  
Response  
Major  
Fatal  
Fatal  
Fatal  
Fatal  
Fatal  
Fatal  
Processor core/thread count mismatch detected  
Processor cache size mismatch detected  
Processor family mismatch detected  
Processor Intel® QPI link frequencies unable to synchronize  
Processor model mismatch detected  
Processor frequencies unable to synchronize  
BIOS Settings reset to default settings  
Passwords cleared by jumper  
Password clear jumper is Set  
Processor 01 disabled  
Processor 02 disabled  
Processor 03 disabled  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Minor  
Minor  
Minor  
Minor  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Minor  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Processor 04 disabled  
Processor 01 unable to apply microcode update  
Processor 02 unable to apply microcode update  
Processor 03 unable to apply microcode update  
Processor 04 unable to apply microcode update  
Processor 01 failed Self Test (BIST)  
Processor 02 failed Self Test (BIST)  
Processor 03 failed Self Test (BIST)  
Processor 04 failed Self Test (BIST)  
Processor 01 microcode update not found  
Processor 02 microcode update not found  
Processor 03 microcode update not found  
Processor 04 microcode update not found  
Watchdog timer failed on last boot  
OS boot watchdog timer failure  
Baseboard management controller failed self-test  
Hot Swap Controller failure  
Management Engine (ME) failed Selftest  
Management Engine (ME) Failed to respond.  
Baseboard management controller failed to respond  
Baseboard management controller in update mode  
Sensor data record empty  
System event log full  
Memory component could not be configured in the selected RAS mode  
DIMM Population Error  
DIMM_A1 failed test/initialization  
DIMM_A2 failed test/initialization  
DIMM_A3 failed test/initialization  
DIMM_B1 failed test/initialization  
DIMM_B2 failed test/initialization  
DIMM_B3 failed test/initialization  
DIMM_C1 failed test/initialization  
DIMM_C2 failed test/initialization  
DIMM_C3 failed test/initialization  
DIMM_D1 failed test/initialization  
DIMM_D2 failed test/initialization  
DIMM_D3 failed test/initialization  
DIMM_E1 failed test/initialization  
DIMM_E2 failed test/initialization  
DIMM_E3 failed test/initialization  
DIMM_F1 failed test/initialization  
DIMM_F2 failed test/initialization  
DIMM_F3 failed test/initialization  
DIMM_G1 failed test/initialization  
DIMM_G2 failed test/initialization  
218  
Revision 2.4  
Intel® Server Board S2600GZ/GL TPS  
Appendix E: POST Code Errors  
Error Code  
8534  
8535  
8536  
8537  
8538  
8539  
853A  
853B  
853C  
853D  
853E  
853F  
(Go to  
85C0)  
8540  
8541  
8542  
8543  
8544  
8545  
8546  
8547  
8548  
8549  
854A  
854B  
854C  
854D  
854E  
854F  
8550  
8551  
8552  
8553  
8554  
8555  
8556  
8557  
8558  
8559  
855A  
855B  
855C  
855D  
855E  
855F  
(Go to  
85D0)  
8560  
8561  
8562  
8563  
8564  
8565  
8566  
8567  
8568  
8569  
Error Message  
Response  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
DIMM_G3 failed test/initialization  
DIMM_H1 failed test/initialization  
DIMM_H2 failed test/initialization  
DIMM_H3 failed test/initialization  
DIMM_I1 failed test/initialization  
DIMM_I2 failed test/initialization  
DIMM_I3 failed test/initialization  
DIMM_J1 failed test/initialization  
DIMM_J2 failed test/initialization  
DIMM_J3 failed test/initialization  
DIMM_K1 failed test/initialization  
DIMM_K2 failed test/initialization  
DIMM_A1 disabled  
DIMM_A2 disabled  
DIMM_A3 disabled  
DIMM_B1 disabled  
DIMM_B2 disabled  
DIMM_B3 disabled  
DIMM_C1 disabled  
DIMM_C2 disabled  
DIMM_C3 disabled  
DIMM_D1 disabled  
DIMM_D2 disabled  
DIMM_D3 disabled  
DIMM_E1 disabled  
DIMM_E2 disabled  
DIMM_E3 disabled  
DIMM_F1 disabled  
DIMM_F2 disabled  
DIMM_F3 disabled  
DIMM_G1 disabled  
DIMM_G2 disabled  
DIMM_G3 disabled  
DIMM_H1 disabled  
DIMM_H2 disabled  
DIMM_H3 disabled  
DIMM_I1 disabled  
DIMM_I2 disabled  
DIMM_I3 disabled  
DIMM_J1 disabled  
DIMM_J2 disabled  
DIMM_J3 disabled  
DIMM_K1 disabled  
DIMM_K2 disabled  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
DIMM_A1 encountered a Serial Presence Detection (SPD) failure  
DIMM_A2 encountered a Serial Presence Detection (SPD) failure  
DIMM_A3 encountered a Serial Presence Detection (SPD) failure  
DIMM_B1 encountered a Serial Presence Detection (SPD) failure  
DIMM_B2 encountered a Serial Presence Detection (SPD) failure  
DIMM_B3 encountered a Serial Presence Detection (SPD) failure  
DIMM_C1 encountered a Serial Presence Detection (SPD) failure  
DIMM_C2 encountered a Serial Presence Detection (SPD) failure  
DIMM_C3 encountered a Serial Presence Detection (SPD) failure  
DIMM_D1 encountered a Serial Presence Detection (SPD) failure  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
219  
Revision 2.4  
Appendix E: POST Code Errors  
Intel® Server Board S2600GZ/GL TPS  
Error Code  
856A  
856B  
856C  
856D  
856E  
856F  
8570  
8571  
8572  
8573  
8574  
8575  
8576  
8577  
8578  
8579  
857A  
857B  
857C  
857D  
857E  
857F  
(Go to  
85E0)  
85C0  
85C1  
85C2  
85C3  
85C4  
85C5  
85C6  
85C7  
85C8  
85C9  
85CA  
85CB  
85CC  
85CD  
85CE  
85CF  
85D0  
85D1  
85D2  
85D3  
85D4  
85D5  
85D6  
85D7  
85D8  
85D9  
85DA  
85DB  
85DC  
85DD  
85DE  
85DF  
85E0  
85E1  
Error Message  
Response  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
DIMM_D2 encountered a Serial Presence Detection (SPD) failure  
DIMM_D3 encountered a Serial Presence Detection (SPD) failure  
DIMM_E1 encountered a Serial Presence Detection (SPD) failure  
DIMM_E2 encountered a Serial Presence Detection (SPD) failure  
DIMM_E3 encountered a Serial Presence Detection (SPD) failure  
DIMM_F1 encountered a Serial Presence Detection (SPD) failure  
DIMM_F2 encountered a Serial Presence Detection (SPD) failure  
DIMM_F3 encountered a Serial Presence Detection (SPD) failure  
DIMM_G1 encountered a Serial Presence Detection (SPD) failure  
DIMM_G2 encountered a Serial Presence Detection (SPD) failure  
DIMM_G3 encountered a Serial Presence Detection (SPD) failure  
DIMM_H1 encountered a Serial Presence Detection (SPD) failure  
DIMM_H2 encountered a Serial Presence Detection (SPD) failure  
DIMM_H3 encountered a Serial Presence Detection (SPD) failure  
DIMM_I1 encountered a Serial Presence Detection (SPD) failure  
DIMM_I2 encountered a Serial Presence Detection (SPD) failure  
DIMM_I3 encountered a Serial Presence Detection (SPD) failure  
DIMM_J1 encountered a Serial Presence Detection (SPD) failure  
DIMM_J2 encountered a Serial Presence Detection (SPD) failure  
DIMM_J3 encountered a Serial Presence Detection (SPD) failure  
DIMM_K1 encountered a Serial Presence Detection (SPD) failure  
DIMM_K2 encountered a Serial Presence Detection (SPD) failure  
DIMM_K3 failed test/initialization  
DIMM_L1 failed test/initialization  
DIMM_L2 failed test/initialization  
DIMM_L3 failed test/initialization  
DIMM_M1 failed test/initialization  
DIMM_M2 failed test/initialization  
DIMM_M3 failed test/initialization  
DIMM_N1 failed test/initialization  
DIMM_N2 failed test/initialization  
DIMM_N3 failed test/initialization  
DIMM_O1 failed test/initialization  
DIMM_O2 failed test/initialization  
DIMM_O3 failed test/initialization  
DIMM_P1 failed test/initialization  
DIMM_P2 failed test/initialization  
DIMM_P3 failed test/initialization  
DIMM_K3 disabled  
DIMM_L1 disabled  
DIMM_L2 disabled  
DIMM_L3 disabled  
DIMM_M1 disabled  
DIMM_M2 disabled  
DIMM_M3 disabled  
DIMM_N1 disabled  
DIMM_N2 disabled  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
DIMM_N3 disabled  
DIMM_O1 disabled  
DIMM_O2 disabled  
DIMM_O3 disabled  
DIMM_P1 disabled  
DIMM_P2 disabled  
DIMM_P3 disabled  
DIMM_K3 encountered a Serial Presence Detection (SPD) failure  
DIMM_L1 encountered a Serial Presence Detection (SPD) failure  
220  
Revision 2.4  
Intel® Server Board S2600GZ/GL TPS  
Appendix E: POST Code Errors  
Error Code  
85E2  
85E3  
85E4  
85E5  
85E6  
85E7  
85E8  
85E9  
85EA  
85EB  
85EC  
85ED  
85EE  
85EF  
8604  
8605  
8606  
92A3  
92A9  
A000  
A001  
A002  
A003  
A100  
A421  
A5A0  
A5A1  
Error Message  
Response  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Major  
Minor  
Major  
Major  
Major  
Major  
Minor  
Minor  
Minor  
Minor  
Major  
Fatal  
DIMM_L2 encountered a Serial Presence Detection (SPD) failure  
DIMM_L3 encountered a Serial Presence Detection (SPD) failure  
DIMM_M1 encountered a Serial Presence Detection (SPD) failure  
DIMM_M2 encountered a Serial Presence Detection (SPD) failure  
DIMM_M3 encountered a Serial Presence Detection (SPD) failure  
DIMM_N1 encountered a Serial Presence Detection (SPD) failure  
DIMM_N2 encountered a Serial Presence Detection (SPD) failure  
DIMM_N3 encountered a Serial Presence Detection (SPD) failure  
DIMM_O1 encountered a Serial Presence Detection (SPD) failure  
DIMM_O2 encountered a Serial Presence Detection (SPD) failure  
DIMM_O3 encountered a Serial Presence Detection (SPD) failure  
DIMM_P1 encountered a Serial Presence Detection (SPD) failure  
DIMM_P2 encountered a Serial Presence Detection (SPD) failure  
DIMM_P3 encountered a Serial Presence Detection (SPD) failure  
POST Reclaim of non-critical NVRAM variables  
BIOS Settings are corrupted  
NVRAM variable space was corrupted and has been reinitialized  
Serial port component was not detected  
Serial port component encountered a resource conflict error  
TPM device not detected.  
TPM device missing or not responding.  
TPM device failure.  
TPM device failed self test.  
BIOS ACM Error  
PCI component encountered a SERR error  
PCI Express component encountered a PERR error  
PCI Express component encountered an SERR error  
Minor  
Fatal  
DXE Boot Service driver: Not enough memory available to shadow a Legacy  
Option ROM  
Minor  
A6A0  
POST Error Beep Codes  
The following table lists the POST error beep codes. Prior to system video initialization, the  
BIOS uses these beep codes to inform users on error conditions. The beep code is followed by  
a user-visible code on the POST Progress LEDs.  
Table 69. POST Error Beep Codes  
Beeps  
1
Error Message  
USB device action  
POST Progress Code  
NA  
Description  
Short beep sounded whenever a USB device is  
discovered in POST, or inserted or removed during  
runtime  
1 long  
Intel® TXT security  
violation  
0xAE, 0xAF  
System halted because Intel® Trusted Execution  
Technology detected a potential violation of system  
security.  
3
2
4
Memory error  
See Table 67and Table 68.  
System halted because a fatal error related to the  
memory was detected.  
Recovery boot has been initiated.  
BIOS Recovery  
started  
BIOS Recovery  
failure  
NA  
NA  
BIOS recovery has failed. This typically happens so  
quickly after recovery us initiated that it sounds like a  
2-4 beep code.  
The Integrated BMC may generate beep codes upon detection of failure conditions. Beep codes  
are sounded each time the problem is discovered, such as on each power-up attempt, but are  
221  
Revision 2.4  
 
Appendix E: POST Code Errors  
Intel® Server Board S2600GZ/GL TPS  
not sounded continuously. Codes that are common across all Intel server boards and systems  
that use same generation chipset are listed in the following table. Each digit in the code is  
represented by a sequence of beeps whose count is equal to the digit.  
Table 70. Integrated BMC Beep Codes  
Code  
1-5-2-1  
Reason for Beep  
No CPUs installed or first CPU socket is  
Associated Sensors  
CPU1 socket is empty, or sockets are populated  
empty.  
incorrectly  
CPU1 must be populated before CPU2.  
1-5-2-4  
1-5-4-2  
MSID Mismatch  
Power fault  
MSID mismatch occurs if a processor is installed  
into a system board that has incompatible power  
capabilities.  
DC power unexpectedly lost (power good dropout)  
– Power unit sensors report power unit failure  
offset  
1-5-4-4  
1-5-1-2  
1-5-1-4  
Power control fault (power good assertion Power good assertion timeout – Power unit  
timeout).  
sensors report soft power control failure offset  
VR controller DC power on sequence was not  
completed in time.  
VR Watchdog Timer sensor assertion  
Power Supply Status  
The system does not power on or unexpectedly  
powers off and a Power Supply Unit (PSU) is  
present that is an incompatible model with one or  
more other PSUs in the system.  
222  
Revision 2.4  
 
Intel® Server Board S2600GZ/GL TPS  
Appendix F: Supported Intel® Server Systems  
Appendix F: Supported Intel® Server Systems  
Two Intel® Server System product families integrate the Intel® Server board S2600GZ and  
Intel® Server S2600GL, they are the 1U rack mount Intel® Server System R1000GZ/GL product  
family and the 2U rack mount Intel® R2000GZ/GL product family.  
Figure 70. Intel® Server System R1000GZ/GL  
Figure 71. Intel® Server System R2000GZ/GL  
223  
Revision 2.4  
 
 
 
Appendix F: Supported Intel® Server Systems  
Intel® Server Board S2600GZ/GL TPS  
Table 71. Intel® Server System R1000GZ/GL Product Family Feature Set  
Feature  
Description  
. Support for one or two processors:  
Processor Support  
o
o
Intel® Xeon® processor E5-2600 product family with TDP support up to 135 W1,2  
Intel® Xeon® processor E5-2600 v2 product family with TDP support up to 130 W  
. S2600GL - 16 DIMM slots – 2 DIMMs/Channel – 4 memory channels per processor  
. S2600GZ - 24 DIMM slots – 3 DIMMs/Channel – 4 memory channels per processor  
. Unbuffered DDR3 (UDIMM), registered DDR3 (RDIMM), Load Reduced DDR3 (LRDIMM)  
. Memory DDR3 data transfer rates of 800, 1066, 1333 MT/s, 1600, 18663 MT/s  
. DDR3 standard I/O voltage of 1.5V and DDR3 Low Voltage of 1.35V  
Intel® C602 chipset with support for optional Storage Option Select keys  
. Video (back and front video connectors)  
Memory  
Chipset  
. RJ-45 Serial- A Port  
External I/O  
connections  
. Four RJ-45 Network Interface Connectors supporting 10/100/1000Mb  
.
USB 2.0 connectors - 3 on back panel + 2 on front panel  
. One Type-A USB 2.0 connector  
. One DH-10 Serial-B port connector  
Internal I/O  
connectors/headers  
The following I/O modules utilize a single proprietary on-board connector. An installed I/O  
module can be supported in addition to standard on-board features and any add-in expansion  
cards.  
. AXX4P1GBPWLIOM – Quad port 1 GbE based on Intel® Ethernet Controller I350  
. AXX10GBTWLIOM – Dual RJ-45 port 10GBase-T I/O Module based on Intel® Ethernet  
Controller x540  
Optional I/O Module  
support  
. AXX10GBNIAIOM – Dual SFP+ port 10GbE module based on Intel® 82599 10 GbE  
controller  
. AXX1FDRIBIOM – Single Port FDR 56GT/S speed InfiniBand module with QSFP  
connector  
. AXX2FDRIBIOM – Dual port FDR 56GT/S speed infiniband module with QSFP connector  
. AXXQAAIOMOD – Intel® Quick Assist Accelerator Card  
. Six dual rotor managed system fans  
System Fans  
Riser Cards  
Video  
. One power supply fan for each installed power supply module  
Concurrent support for two PCIe riser cards. Each riser card slot has support for the  
following riser card options:  
. Single add-in card slot – PCIe x16, x16 mechanical  
. Integrated 2D Video Controller  
. 16 MB DDR3 Memory  
. One eUSB 2x5 pin connector to support 2mm low-profile eUSB solid state devices  
. Two 7-pin single port AHCI SATA connectors capable of supporting up to 6 GB/sec  
. Two SCU 4-port mini-SAS connectors capable of supporting up to 3 GB/sec SAS/SATA  
On-board storage  
controllers and  
options  
. Intel® RAID C600 Upgrade Key support providing optional expanded SCU SATA/SAS  
RAID capabilities  
. Intel® Integrated RAID module support (Optional)  
Security  
Intel® Trusted Platform Module (TPM) - AXXTPME5 (Accessory Option)  
. Integrated Baseboard Management Controller, IPMI 2.0 compliant  
. Support for Intel® Server Management Software  
. Intel® Remote Management Module 4 Lite – Accessory Option  
. Intel® Remote Management Module 4 Management NIC – Accessory Option  
Server Management  
224  
Revision 2.4  
 
Intel® Server Board S2600GZ/GL TPS  
Feature  
Appendix F: Supported Intel® Server Systems  
Description  
. The server system can have up to two power supply modules installed, providing support  
for the following power configurations: 1+0, 1+1 Redundant Power, and 2+0 Combined  
Power  
Power Supply  
Options  
. Three power supply options:  
o
o
o
AC 460W Gold  
AC 750W Platinum  
DC 750W  
. The server system can have up to two power supply modules installed, providing support  
for the following power configurations: 1+0, 1+1 Redundant Power, and 2+0 Combined  
Power  
Power Supply  
Options  
. Three power supply options:  
o
o
AC 460W Gold  
AC 750W Platinum  
. 4x – 3.5” SATA/SAS Hot Swap Hard Drive Bays + Optical Drive support  
. 8x – 2.5” SATA/SAS Hot Swap Hard Drive Bays + Optical Drive support (capable)  
. Tool-less rack mount rail kit – Intel Product Code – AXXPRAIL  
. Value rack mount rail kit – Intel Product Code – AXXVRAIL  
Storage Bay Options  
Supported Rack  
Mount Kit Accessory  
Options  
. Cable Management Arm – Intel Product Code – AXX1U2UCMA (*supported with  
AXXPRAIL only)  
. 2-post fixed mount bracket kit – Intel Product Code – AXX2POSTBRCKT  
Notes:  
1. With a system fan failure, processor throttling may occur.  
2. Processor throttling may occur with systems configured using the following processors: E5-2690, E5-2643.  
3. Intel® Xeon® processor E5-2600 v2 product family only  
225  
Revision 2.4  
Appendix F: Supported Intel® Server Systems  
Intel® Server Board S2600GZ/GL TPS  
Table 72. Intel® Server System R2000GZ/GL Product Family Feature Set  
Description  
Feature  
. Support for one or two processors:  
o
Intel® Xeon® processor E5-2600 product family with TDP support up to 135 W1,2  
Processor Support  
o
Intel® Xeon® processor E5-2600 v2 product family with TDP support up to 130 W  
. S2600GL - 16 DIMM slots – 2 DIMMs/Channel – 4 memory channels per processor  
. S2600GZ - 24 DIMM slots – 3 DIMMs/Channel – 4 memory channels per processor  
. Unbuffered DDR3 (UDIMM), Registered DDR3 (RDIMM), and Load Reduced DDR3  
(LRDIMM)  
Memory  
Chipset  
. Memory DDR3 data transfer rates of 800, 1066, 1333 MT/s,1600 and 18663 MT/s  
. DDR3 standard I/O voltage of 1.5V and DDR3 Low Voltage of 1.35V  
Intel® C602 chipset with support for optional Storage Option Select keys  
. Video – Back Panel + Front Panel on Non-Max Hard drive SKUs  
. RJ-45 Serial- A Port  
External I/O  
connections  
. Four RJ-45 Network Interface Connectors supporting 10/100/1000Mb  
.
USB 2.0 connectors - 3 on back panel + 2 on front panel on non-max hard drive SKUs  
. One Type-A USB 2.0 connector  
. One DH-10 Serial-B port connector  
Internal I/O  
connectors/headers  
The following I/O modules utilize a single proprietary on-board connector. An installed I/O  
module can be supported in addition to standard on-board features and any add-in expansion  
cards.  
. AXX4P1GBPWLIOM – Quad port 1 GbE based on Intel® Ethernet Controller I350  
. AXX10GBTWLIOM – Dual RJ-45 port 10GBase-T I/O Module based on Intel® Ethernet  
Controller x540  
Optional I/O Module  
support  
. AXX10GBNIAIOM – Dual SFP+ port 10GbE module based on Intel® 82599 10 GbE  
controller  
. AXX1FDRIBIOM – Single Port FDR 56GT/S speed InfiniBand module with QSFP  
connector  
. AXX2FDRIBIOM – Dual port FDR 56GT/S speed infiniband module with QSFP connector  
. AXXQAAIOMOD - Intel® Quick Assist Accelerator Card  
. Five managed system fans  
System Fans  
Riser Cards  
Video  
. One power supply fan for each installed power supply module  
Support for two riser card slots. Each riser card slot has support for the following riser card  
options:  
. 3-slot PCIe Riser Card: (Slots 1 & 2) – PCIe x16 slot, x8 lanes, (Slot 3) – PCIe x8 slot, x8  
lanes  
. 2-slot PCIe Riser Card: (Slot 1) – PCIe x16 slot, x16 lanes, (Slot 2) – PCIe x8 slot, x8  
lanes  
. 3-slot PCIx/PCIe Riser Card: (Slots 1 & 2) – PCIx 64-bit, (Slot 3) – PCIe x8 slot, x8 lanes  
. Integrated 2D Video Controller  
. 16 MB DDR3 Memory  
. One eUSB 2x5 pin connector to support 2mm low-profile eUSB solid state devices  
. Two 7-pin single port AHCI SATA connectors capable of supporting up to 6 GB/sec  
. Two SCU 4-port mini-SAS connectors capable of supporting up to 3 GB/sec SAS/SATA  
. Intel® Integrated RAID module support (Optional)  
On-board storage  
controllers and  
options  
. Intel® RAID C600 Upgrade Key support providing optional expanded SATA/SAS RAID  
capabilities  
Security  
Intel® Trusted Platform Module (TPM) - AXXTPME5 (Accessory Option)  
226  
Revision 2.4  
 
Intel® Server Board S2600GZ/GL TPS  
Appendix F: Supported Intel® Server Systems  
. Integrated Baseboard Management Controller, IPMI 2.0 compliant  
. Support for Intel® Server Management Software  
. Intel® Remote Management Module 4 Lite – Accessory Option  
. Intel® Remote Management Module 4 Management NIC – Accessory Option  
Server Management  
. The server system can have up to two power supply modules installed, providing support  
for the following power configurations: 1+0, 1+1 Redundant Power, and 2+0 Combined  
Power  
Power Supply  
Options  
. Three power supply options:  
. AC 460W Gold  
. AC 750W Platinum  
. 8x – 3.5” SATA/SAS Hot Swap Hard Drive Bays + Optical Drive support  
. 12x – 3.5” SATA/SAS Hot Swap Hard Drive Bays  
. 8x – 2.5” SATA/SAS Hot Swap Hard Drive Bays + Optical Drive support  
. 16x – 2.5” SATA/SAS Hot Swap Hard Drive Bays + Optical Drive support  
Storage Bay Options  
.
24x – 2.5” SATA/SAS Hot Swap Hard Drive Bays  
. Tool-less rack mount rail kit – Intel Product Code – AXXPRAIL  
. Value rack mount rail kit – Intel Product Code – AXXVRAIL  
Supported Rack  
Mount Kit Accessory  
Options  
. Cable Management Arm – Intel Product Code – AXX1U2UCMA (*supported with  
AXXPRAIL only)  
. 2-post fixed mount bracket kit – Intel Product Code – AXX2POSTBRCKT  
Notes:  
1. With a system fan failure, processor throttling may occur.  
2. Processor throttling may occur with systems configured using the following processors: E5-2690, E5-2643.  
3. Intel® Xeon® processor E5-2600 v2 product family only  
Refer to the Technical Product Specification for each these two Intel® Server Product families  
for more information.  
227  
Revision 2.4  
Glossary  
Intel® Server Board S2600GZ/GL TPS  
Glossary  
This appendix contains important terms used in this document. For ease of use, numeric entries  
are listed first (for example, “82460GX”) followed by alpha entries (for example, “AGP 4x”).  
Acronyms are followed by non-acronyms.  
Term  
ACPI  
Definition  
Advanced Configuration and Power Interface  
Application Processor  
AP  
APIC  
ARP  
ASIC  
ASMI  
BIOS  
BIST  
BMC  
BPP  
Bridge  
BSP  
Byte  
CBC  
Advanced Programmable Interrupt Control  
Address Resolution Protocal  
Application Specific Integrated Circuit  
Advanced Server Management Interface  
Basic Input/Output System  
Built-In Self Test  
Baseboard Management Controller  
Bits per pixel  
Circuitry connecting one computer bus to another, allowing an agent on one to access the other  
Bootstrap Processor  
8-bit quantity  
Chassis Bridge Controller (A microcontroller connected to one or more other CBCs, together they  
bridge the IPMB buses of multiple chassis.  
CEK  
Common Enabling Kit  
CHAP  
CMOS  
Challenge Handshake Authentication Protocol  
Complementary Metal-oxide-semiconductor  
In terms of this specification, this describes the PC-AT compatible region of battery-backed 128 bytes  
of memory, which normally resides on the server board.  
DHCP  
DPC  
EEPROM  
EHCI  
EMP  
EPS  
Dynamic Host Configuration Protocal  
Direct Platform Control  
Electrically Erasable Programmable Read-Only Memory  
Enhanced Host Controller Interface  
Emergency Management Port  
External Product Specification  
Enterprise South Bridge 2  
Fully Buffered DIMM  
ESB2  
FBD  
F MB  
FRB  
Flexible Mother Board  
Fault Resilient Booting  
FRU  
FSB  
Field Replaceable Unit  
Front Side Bus  
GB  
1024 MB  
GPA  
GPIO  
GTL  
Guest Physical Address  
General Purpose I/O  
Gunning Transceiver Logic  
Host Physical Address  
HPA  
HSC  
Hz  
Hot-swap Controller  
Hertz (1 cycle/second)  
228  
Revision 2.4  
Intel® Server Board S2600GZ/GL TPS  
Term  
Glossary  
Definition  
I2C  
Inter-Integrated Circuit Bus  
IA  
Intel® Architecture  
IBF  
Input Buffer  
ICH  
I/O Controller Hub  
ICMB  
IERR  
IFB  
Intelligent Chassis Management Bus  
Internal Error  
I/O and Firmware Bridge  
Independent Loading Mechanism  
Integrated Memory Controller  
Interrupt  
ILM  
IMC  
INTR  
I/OAT  
IOH  
IP  
I/O Acceleration Technology  
I/O Hub  
Internet Protocol  
IPMB  
IPMI  
IR  
Intelligent Platform Management Bus  
Intelligent Platform Management Interface  
Infrared  
ITP  
In-Target Probe  
KB  
1024 bytes  
KCS  
KVM  
LAN  
LCD  
LDAP  
LED  
LPC  
LUN  
MAC  
MB  
Keyboard Controller Style  
Keyboard, Video, Mouse  
Local Area Network  
Liquid Crystal Display  
Local Directory Authentication Protocol  
Light Emitting Diode  
Low Pin Count  
Logical Unit Number  
Media Access Control  
1024 KB  
MCH  
MD2  
MD5  
ME  
Memory Controller Hub  
Message Digest 2 – Hashing Algorithm  
Message Digest 5 – Hashing Algorithm – Higher Security  
Management Engine  
MMU  
ms  
Memory Management Unit  
Milliseconds  
MTTR  
Mux  
NIC  
Memory Type Range Register  
Multiplexor  
Network Interface Controller  
Nonmaskable Interrupt  
NMI  
OBF  
OEM  
Ohm  
OVP  
PECI  
PEF  
PEP  
Output Buffer  
Original Equipment Manufacturer  
Unit of electrical resistance  
Over-voltage Protection  
Platform Environment Control Interface  
Platform Event Filtering  
Platform Event Paging  
229  
Revision 2.4  
Glossary  
Intel® Server Board S2600GZ/GL TPS  
Term  
Definition  
PIA  
Platform Information Area (This feature configures the firmware for the platform hardware)  
PLD  
Programmable Logic Device  
PMI  
Platform Management Interrupt  
Power-On Self Test  
POST  
PSMI  
PWM  
QPI  
Power Supply Management Interface  
Pulse-Width Modulation  
QuickPath Interconnect  
RAM  
RASUM  
RISC  
RMII  
Random Access Memory  
Reliability, Availability, Serviceability, Usability, and Manageability  
Reduced Instruction Set Computing  
Reduced Media-Independent Interface  
Read Only Memory  
ROM  
RTC  
Real-Time Clock (Component of ICH peripheral chip on the server board)  
Sensor Data Record  
SDR  
SECC  
SEEPROM  
SEL  
Single Edge Connector Cartridge  
Serial Electrically Erasable Programmable Read-Only Memory  
System Event Log  
SIO  
Server Input/Output  
SMBUS*  
SMI  
System Management BUS  
Server Management Interrupt (SMI is the highest priority non-maskable interrupt)  
Server Management Mode  
SMM  
SMS  
SNMP  
SPS  
Server Management Software  
Simple Network Management Protocol  
Server Platform Services  
SSE2  
SSE3  
SSE4  
TBD  
Streaming SIMD Extensions 2  
Streaming SIMD Extensions 3  
Streaming SIMD Extensions 4  
To Be Determined  
TDP  
Thermal Design Power  
TIM  
Thermal Interface Material  
UART  
UDP  
Universal Asynchronous Receiver/Transmitter  
User Datagram Protocol  
UHCI  
URS  
Universal Host Controller Interface  
Unified Retention System  
UTC  
Universal time coordinare  
VID  
Voltage Identification  
VRD  
Voltage Regulator Down  
VT  
Virtualization Technology  
Word  
WS-MAN  
ZIF  
16-bit quantity  
Web Services for Management  
Zero Insertion Force  
230  
Revision 2.4  
Intel® Server Board S2600GZ/GL  
Reference Documents  
Reference Documents  
.
.
Advanced Configuration and Power Interface Specification, Revision 3.0,  
http://www.acpi.info/.  
Intelligent Platform Management Bus Communications Protocol Specification, Version 1.0.  
1998. Intel Corporation, Hewlett-Packard Company, NEC Corporation, Dell Computer  
Corporation.  
.
.
Intelligent Platform Management Interface Specification, Version 2.0. 2004. Intel Corporation,  
Hewlett-Packard Company, NEC Corporation, Dell Computer Corporation.  
Platform Support for Serial-over-LAN (SOL), TMode, and Terminal Mode External  
Architecture Specification, Version 1.1, 02/01/02, Intel Corporation.  
.
.
Intel® Remote Management Module User’s Guide, Intel Corporation.  
Alert Standard Format (ASF) Specification, Version 2.0, 23 April 2003, ©2000-2003,  
Distributed Management Task Force, Inc., http://www.dmtf.org.  
.
.
.
.
BIOS for EPSD Platforms Based on Intel® Xeon Processor E5-4600/2600/2400/1600  
Product Families External Product Specification  
EPSD Platforms Based On Intel Xeon® Processor E5 4600/2600/2400/1600 Product  
Families BMC Core Firmware External Product Specification  
SmaRT & CLST Architecture on “Romley” Systems and Power Supplies Specification (Doc  
Reference # 461024)  
Intel Integrated RAID Module RMS25PB080, RMS25PB040, RMS25CB080, and  
RMS25CB040 Hardware Users Guide  
.
.
.
.
.
.
.
.
.
Intel® Remote Management Module 4 Technical Product Specification  
Intel® Remote Management Module 4 and Integrated BMC Web Console Users Guide  
Intel® Server System R1000GZ/GL Technical Product Specification  
Intel® Server System R2000GZ/GL Technical Product Specification  
Intel® Deployment Assistant (IDA) 5.2 Users Guide  
One Boot Flash Update Installation and Users Guide  
Intel® Active System Control Console User Guide  
Intel® Intelligent Power Node Manager White Paper  
Intel® System Management Software Installation Guide  
Pin  
1
3
5
7
Name  
3V3_AUX  
3V3_AUX  
GND  
GND  
GND  
Pin  
2
4
6
8
Name  
MDIO  
MDC  
TXD_0  
TXD_1  
TXD_2  
TXD_3  
9
11  
10  
12  
GND  
231  
Revision 2.4  
Reference Documents  
Intel® Server Board S2600GZ/GL TPS  
13  
15  
17  
19  
21  
23  
25  
27  
29  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
14  
16  
18  
20  
22  
24  
26  
28  
30  
TX_CTL  
RX_CTL  
RXD_0  
RXD_1  
RXD_2  
RXD_3  
TX_CLK  
RX_CLK  
PRESENT#  
232  
Revision 2.4  

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