ACTS244K [INTERSIL]
Radiation Hardened Octal Non-Inverting Three-State Buffer; 抗辐射八路非反相三态缓冲器
| 型号： | ACTS244K |
| 厂家： | 
Intersil |
| 描述： | Radiation Hardened Octal Non-Inverting Three-State Buffer |
| 文件： | 总3页 (文件大小：51K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ACTS244MS
Radiation Hardened Octal
Non-Inverting Three-State Buffer
January 1996
Features
Pinouts
20 PIN CERAMIC DUAL-IN-LINE
MIL-STD-1835 DESIGNATOR CDIP2-T20,
• Devices QML Qualified in Accordance with MIL-PRF-38535
• Detailed Electrical and Screening Requirements are Contained in
SMD# 5962-96718 and Intersil’s QM Plan
LEAD FINISH C
TOP VIEW
• 1.25 Micron Radiation Hardened SOS CMOS
1
20
19
18
17
16
15
14
13
12
11
VCC
BE
AE
AI1
• Total Dose . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >300K RAD (Si)
2
3
• Single Event Upset (SEU) Immunity: <1 x 10-10 Errors/Bit/Day
(Typ)
BO4
AI2
AO1
BI4
4
5
BO3
AI3
AO2
BI3
• SEU LET Threshold . . . . . . . . . . . . . . . . . . . . . . . >100 MEV-cm2/mg
• Dose Rate Upset . . . . . . . . . . . . . . . . >1011 RAD (Si)/s, 20ns Pulse
• Dose Rate Survivability. . . . . . . . . . . >1012 RAD (Si)/s, 20ns Pulse
• Latch-Up Free Under Any Conditions
6
7
AO3
BI2
BO2
AI4
8
9
BO1
GND
AO4
BI1
10
• Military Temperature Range . . . . . . . . . . . . . . . . . . -55oC to +125oC
• Significant Power Reduction Compared to ALSTTL Logic
• DC Operating Voltage Range . . . . . . . . . . . . . . . . . . . . 4.5V to 5.5V
20 PIN CERAMIC FLATPACK
MIL-STD-1835 DESIGNATOR CDFP4-F20,
LEAD FINISH C
• Input Logic Levels
- VIL = 0.8V Max
TOP VIEW
- VIH = VCC/2 Min
• Input Current ≤ 1µA at VOL, VOH
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
AE
AI1
VCC
BE
• Fast Propagation Delay . . . . . . . . . . . . . . . 14.5ns (Max), 10ns (Typ)
BO4
AI2
AO1
BI4
Description
BO3
AI3
AO2
BI3
The Intersil ACTS244MS is a Radiation Hardened Octal Non-Inverting
Three-State Buffer having two active low enable inputs.
BO2
AI4
AO3
BI2
The ACTS244MS utilizes advanced CMOS/SOS technology to achieve
high-speed operation. This device is a member of radiation hardened,
high-speed, CMOS/SOS Logic Family.
BO1
GND
AO4
BI1
The ACTS244MS is supplied in a 20 lead Ceramic Flatpack (K suffix) or
a Dual-In-Line Ceramic Package (D suffix).
Ordering Information
PART NUMBER
5962F9671801VRC
5962F9671801VXC
ACTS244D/Sample
ACTS244K/Sample
ACTS244HMSR
TEMPERATURE RANGE
SCREENING LEVEL
MIL-PRF-38535 Class V
MIL-PRF-38535 Class V
Sample
PACKAGE
o
o
-55 C to +125 C
20 Lead SBDIP
o
o
-55 C to +125 C
20 Lead Ceramic Flatpack
20 Lead SBDIP
o
25 C
o
25 C
Sample
20 Lead Ceramic Flatpack
Die
o
25 C
Die
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
Spec Number 518784
File Number 3187.1
http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999
1
ACTS244MS
Functional Diagram
NOTE: (1 CIRCUIT OF 2)
AO1
AE
1(19)
P
N
18(9)
AI1
2(11)
P
N
AO2
16(7)
AI2
4(13)
P
N
AO3
14(5)
AI3
6(15)
P
N
AO4
12(3)
AI4
8(17)
TRUTH TABLE
INPUTS
OUTPUT
AE, BE
AIn, BIn
AOn, BOn
L
L
L
H
X
L
H
Z
H
NOTE: H = High Voltage Level, L = Low Voltage Level,
X = Immaterial, Z = High Impedance
Spec Number 518784
2
ACTS244MS
Die Characteristics
DIE DIMENSIONS:
100 x 100 (mils)
2.54 x 2.54 (mm)
METALLIZATION:
Type: AlSi
Metal 1 Thickness: 7.125kÅ ±1.125kÅ
Metal 2 Thickness: 9kÅ ±1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 8kÅ ±1kÅ
WORST CASE CURRENT DENSITY:
< 2.0 x 105A/cm2
BOND PAD SIZE:
110 x 110 (µm)
4.4 x 4.4 (mils)
Metallization Mask Layout
ACTS244MS
AI1
(2)
AE
(1)
VCC VCC
(20) (20)
BE
(19)
(18) AO1
(17) BI4
(16) AO2
(15) BI3
(14) AO3
(13) BI2
BO4 (3)
AI2 (4)
BO3 (5)
AI3 (6)
BO2 (7)
AI4 (8)
BO1 (9)
AO4 (12)
(10) (10)
GND GND
(11)
BI1
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Spec Number 518784
3
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