D2-92634-LR [INTERSIL]

Intelligent Digital Amplifier and Sound Processor;
D2-92634-LR
型号: D2-92634-LR
厂家: Intersil    Intersil
描述:

Intelligent Digital Amplifier and Sound Processor

外围集成电路
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中文:  中文翻译
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Intelligent Digital Amplifier and Sound Processor  
D2-926xx  
Features  
The D2-926xx family of the DAE-3™ and DAE-3HT™ Digital  
Audio Engine™ devices are complete System-on Chip (SoC)  
multi-channel digital sound processors and Class-D amplifier  
controllers.  
• Advanced DAE-3™ Digital Audio Engine™ IC Family  
- DAE-3™ Pin Compatible and Function/Feature  
Compatible with the D2Audio™ DAE-6™ Device Family  
- DAE-3HT™ - Identical DAE-3 performance, in  
72-QFN package  
The integrated DSP provides efficient and configurable audio  
signal path processing including equalization, dynamic range  
compression, mixing, and filtering that is completely  
• Integrated DSP Digital Sound Processing  
- Customizable audio path sound processing  
configurable via the Audio Canvas™ III high level programming  
interface. The integrated PWM engine supports programmable  
and dynamic control of audio output, enabling a variety of  
multi-channel output configurations and output power  
capacity. Internal noise shaping, an embedded asynchronous  
sample rate converter, dynamic level-dependent timing, and  
high resolution operation supports power stage audio  
performances with SNR >110dB and THD+N < 0.01%.  
- Fully configurable and routable audio signal paths and  
hardware function assignment  
- Fully Supported with Audio Canvas™ III Design Tool  
• Flexible Audio Input and Output Configurations  
- 12 Independent PWM Engine Channels  
2
- 4 Independent Asynchronous I S Digital Inputs  
- Integrated high-performance stereo ADC (DAE-3 only)  
The D2-926xx devices are provided in two package and feature  
configurations which include the 128-pin DAE-3, and the72-pin  
DAE-3HT. Both the DAE-3 and DAE-3HT provide identical  
performance and enable an extremely flexible platform for  
feature rich and cost-affordable quality audio solutions, which  
benefit from the addition of Class-D amplifiers and DSP audio  
processing.  
- S/PDIF™ Digital Audio Inputs supporting  
Linear IEC-61958 PCM or Compressed IEC-61937 Audio  
- S/PDIF Digital Audio PCM Output  
• Embedded 8-Channel Sample Rate Converter  
• Real-Time Amplifier Control and Monitoring  
- Supports Bridged, Half-Bridged, and Bridge-Tied Load (BTL)  
Topologies, Using Discrete or Integrated Power Stages  
The 12 integrated digital PWM controllers can be used in a  
variety of multi-channel audio system configurations,  
supporting powered as well as line outputs. Fully protected  
amplifier control provides efficient and clean Class-D power  
output support.  
- Complete Fault Protection with Automatic Recovery  
• D2Audio™ SoundSuite™ Enhancement and Virtualization  
• Enhanced Audio Processing Decoders And Virtualization  
- Dolby® Digital/AC3  
- Dolby® Pro Logic IIx  
Applications  
• DTV and Blu-ray Soundbar  
- Dolby® Virtual Speaker  
• DVD and Blu-ray Home Theater Systems  
• Home Theater in a Box (HTiB)  
• Audio Video Receiver (AVR)  
- SRS TruSurround HD4™ , SRS WOW HD™,  
SRS TruVolume™  
• Multi-Channel Multi-Media (MM) Systems  
• Multi-Room Distributed Audio (MRDA)  
• Powered Speaker Systems  
• Automotive Trunk/Amplified Solutions  
July 12, 2012  
FN6787.2  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2010 - 2012. All Rights Reserved  
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.  
1
Dolby is a registered trademark of Dolby Laboratories. All other trademarks mentioned are the property of their respective owners.  
D2-926xx  
Ordering Information  
PART  
NUMBER  
(Note 2)  
AUDIO PROCESSING  
FEATURE SET SUPPORT  
(Note 1)  
DAE DEVICE  
FAMILY  
PART  
MARKING  
TEMP. RANGE  
(°C)  
PACKAGE  
(Pb-Free)  
PKG.  
DWG. #  
D2-92633-LR  
D2-92634-LR  
D2-92683-QR  
D2-92684-QR  
DAE-3  
DAE-3  
D2-92633-LR  
D2-92634-LR  
D2-92683-QR  
D2-92684-QR  
Refer to Table 1  
Refer to Table 1  
Refer to Table 1  
Refer to Table 1  
-10 to +85  
-10 to +85  
-10 to +85  
-10 to +85  
128 Ld LQFP  
128 Ld LQFP  
72 Ld QFN  
Q128.14x14  
Q128.14x14  
L72.10x10F  
L72.10x10F  
DAE-3HT  
DAE-3HT  
72 Ld QFN  
NOTES:  
1. The D2-926xx devices support multiple audio processing algorithms and decoders, and support is device-dependent. Refer to Table 1 for the  
supported features for each device part number.  
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte  
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil  
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.  
FN6787.2  
July 12, 2012  
2
D2-926xx  
DAE-3 Device Feature Set Offering  
The D2-926xx family has specific part numbers to specify the features and algorithms supported in the device. All devices of the DAE-3  
family include 8 audio input processing channels, up to 12 PWM output channels, an embedded 8-channel Sample Rate Converter  
(SRC), and are fully supported with the Audio Canvas III™ design tool software. Additional features within each DAE-3 family part  
number are shown in Table 1.  
TABLE 1. DAE-3 DEVICE PART NUMBERS AND FEATURES  
PART NUMBER  
D2-92633-LR  
DAE FAMILY  
DAE-3  
FEATURES  
8 Channels of I S or Left Justified Serial Digital Audio Inputs  
LICENSED ALGORITHM SUPPORT (Note 3)  
2
D2Audio™ SoundSuite™  
SRS TruSurround HD4™,  
SRS WOWHD4™,  
2
128-Pin Package 8 Channels of I S or Left Justified Serial Digital Audio Outputs  
2 S/PDIF Digital Inputs  
1 S/PDIF Digital Output  
SRS TruVolume™  
2 ADC Analog Audio Inputs  
2
®
D2-92634-LR  
D2-92683-QR  
D2-92684-QR  
DAE-3  
8 Channels of I S or Left Justified Serial Digital Audio Inputs  
Dolby Digital/AC3 Decode Processing  
2
®
128-Pin Package 8 Channels of I S or Left Justified Serial Digital Audio Outputs  
2 S/PDIF Digital Inputs  
Dolby Pro Logic IIx Surround Processing  
®
Dolby Virtual Speaker Processing  
1 S/PDIF Digital Output  
2 ADC Analog Audio Inputs  
2
2
DAE-3HT  
8 Channels of I S or Left Justified Serial Digital Audio Inputs, or  
D2Audio™ SoundSuite™  
72-Pin Package 6 Channels of I S or Left Justified Serial Digital Audio Inputs plus SRS TruSurround HD4™,  
2
2 Channels of I S or Left Justified Serial Digital Audio Outputs  
1 S/PDIF Digital Input  
SRS WOWHD4™,  
SRS TruVolume™  
1 S/PDIF Digital Output  
2
®
DAE-3HT  
8 Channels of I S or Left Justified Serial Digital Audio Inputs, or 6 Dolby Digital/AC3 Decode Processing  
2
®
72-Pin Package Channels of I S or Left Justified Serial Digital Audio Inputs plus 2 Dolby Pro Logic IIx Surround Processing  
2
®
Channels of I S or Left Justified Serial Digital Audio Outputs  
Dolby Virtual Speaker Processing  
1 S/PDIF Digital Input  
1 S/PDIF Digital Output  
NOTE:  
3. All DAE-3 family devices support D2Audio™ SoundSuite™ Audio Processing algorithms, and with license agreements executed with SRS Labs, also  
support SRS TruSurround HD4™, SRS WOW HD™, and SRS TruVolume™  
Device Designations  
This datasheet applies to all of the DAE-3 device family, which includes both the DAE-3 and DAE-3HT. Functional specifications apply to  
both designations of this family unless otherwise indicated.  
Throughout this document the device names apply to all part numbers of their respective names as follows:  
DAE DEVICE NAME  
DAE-3  
DAE DEVICE PART NUMBERS  
D2-92633-LR, D2-92634-LR  
D2-92683-QR, D2-92684-QR  
PACKAGE PINS  
128-Pin Package  
72-Pin Package  
DAE-3HT  
FN6787.2  
July 12, 2012  
3
D2-926xx  
Table of Contents  
DAE-3 Device Feature Set Offering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Device Designations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Thermal Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Recommended Operating Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Serial Audio Interface Port Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
2
Two-Wire (I C) Interface Port Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
SPI™ Interface Port Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Pin Configuration DAE-3 (128-Pin Package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Pin Configuration DAE-3HT (72-Pin Package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Pin Description, DAE-3 (128-Pin). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Pin Description DAE-3HT (72-Pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
Functional Block Diagram - DAE-3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
Functional Block Diagram - DAE-3HT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24  
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24  
DAE-3 Device Designations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24  
Audio Canvas III Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24  
DSP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24  
Sample Rate Converters (SRC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24  
Serial Digital Audio Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24  
Serial Digital Audio Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24  
Serial Digital Audio Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
S/PDIF Digital Audio Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26  
S/PDIF Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26  
S/PDIF Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26  
ADC input (DAE-3 Devices Only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26  
PWM Audio Amplifier Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26  
Amplifier Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27  
Graceful Overcurrent And Short Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
Thermal Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
Hardware I/O Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27  
General-purpose I/O And Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
Power Supply Synchronization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
Clocks And PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27  
Reset and Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27  
Power Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27  
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28  
Booting and Boot Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28  
Control Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28  
2
I C 2-Wire Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
Serial Peripheral Interface (SPI™) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
Reading and Writing Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29  
Audio Processing Algorithms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30  
Input Source Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
Volume . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
Shared Volume . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
Mixers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
Router . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
Stereo A/B Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
Tone Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
FN6787.2  
July 12, 2012  
4
D2-926xx  
Parametric Equalizers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
Biquad Filter (Frequency Domain Configuration) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
Biquad Filter (z-Domain Configuration) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
Filter - Crossover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
FIR Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
Excursion Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
Delay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31  
Compressor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31  
Compressor/Expander . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31  
Envelope Voltage Controlled Amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31  
Reverb . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31  
Chime Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31  
RMS Level Meter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31  
Fade-Pan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31  
Mono Mixer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31  
Dither Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31  
Harmonics Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31  
SoundSuite™ Processing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31  
Third Party Virtualization and Enhancements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32  
Audio Processing Block Controls . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32  
Dynamic Register Addressing Architecture. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32  
Hardware Feature Functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32  
AM Avoidance Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32  
MCLK Clock Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32  
PSSYNC Clock Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32  
Audio I/O Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32  
Fault Indication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32  
Decoder Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32  
Format Change Notification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32  
Idle Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32  
Master Volume Encoder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
PWM Output Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
PWM Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
Power Down Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
Temperature Sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
Thermal Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
DAE-3 And DAE-3HT Differences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34  
Pin Function Mapping Between Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34  
I/O Pin Function Assignment Comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35  
PWM Output Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35  
I2S Digital Inputs And Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35  
MCLK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35  
Protection Input Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35  
Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36  
Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36  
Q128.14x14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37  
L72.10x10F . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38  
FN6787.2  
July 12, 2012  
5
D2-926xx  
Absolute Maximum Ratings (Note 8)  
Thermal Information  
Supply Voltage  
Thermal Resistance (Typical)  
128 Ld LQFP Package (Notes 4, 6) . . . . . .  
72 Ld QFN Package (Notes 5, 7) . . . . . . . .  
Maximum Storage Temperature. . . . . . . . . . . . . . . . . . . . -55°C to +150°C  
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below  
http://www.intersil.com/pbfree/Pb-FreeReflow.asp  
θ
(°C/W)  
39  
22  
θ
(°C/W)  
6.5  
0.80  
JA  
JC  
RVDD, PWMVDD, ADCVDD . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 4.0V  
CVDD, PLLVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 2.4V  
Input Voltage  
Any Input but XTALI . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3V to RVDD +0.3V  
XTALI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to PLLVDD +0.3V  
Input Current, Any Pin but Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . ±10mA  
ESD Rating  
Human Body Model (Tested per JESD22-A114F) . . . . . . . . . . . . . . 2000V  
Machine Model (Tested per JESD22-A115C) . . . . . . . . . . . . . . . . . 200V  
Charged Device Model (Tested per JESD22-C101E). . . . . . . . . . . . . 750V  
Latch-up  
(Pins 2, 4, 6, 7, 8, 9, 37 (72 Ld Package only) Tested per JESD78D  
Class II, Level B) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA  
(All Other pins Tested per JESD78D Class II, Level A) . . . . . . . . . 100mA  
Recommended Operating Conditions  
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-10°C to +85°C  
Digital I/O Supply Voltage, PWMVDD . . . . . . . . . . . . . . . . . . . . . . . . . . .3.3V  
Core Supply Voltage, CVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.8V  
Analog Supply Voltage, PLLVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.8V  
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product  
reliability and result in failures not covered by warranty.  
NOTES:  
4. θ is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.  
JA  
5. θ is measured with the component mounted on a high effective thermal conductivity test board with direct attach of exposed pad to PCB.  
JA  
6. For θ , the “case temp” location is taken at the package top center.  
JC  
7. For θ , the “case temp” is measured on bottom of exposed pad.  
JC  
8. Absolute Maximum parameters are not tested in production.  
Electrical Specifications  
T = +25°C, CVDD = PLLVDD = 1.8V ±5%, RVDD = PWMVDD = 3.3V ±10%. All grounds at 0.0V. All voltages  
A
referenced to ground. PLL at 294.912MHz, OSC at 24.576MHz, core running at 147.456MHz with typical audio data traffic. Minimum supply currents are  
measured in full power down configuration.  
TEST  
MIN  
MAX  
SYMBOL  
PARAMETER  
Digital Input High Logic Level (Note 9)  
Digital Input Low Logic Level (Note 9)  
High Level Output Drive Voltage  
CONDITIONS  
(Note 12)  
TYP  
(Note 12)  
UNIT  
V
Relative to RVDD  
Relative to RVDD  
2.0  
-
-
-
-
0.8  
-
V
V
V
IH  
V
-
IL  
V
RVDD - 0.4  
OH  
I
at - Pin Drive Strength Current. See “Pin Description, DAE-3 (128-  
OUT  
Pin)” on page 13, and “Pin Description DAE-3HT (72-Pin)” on page 18  
V
Low Level Output Drive Voltage  
-
-
0.4  
V
OL  
I
at + Pin Drive Strength Current. See “Pin Description, DAE-3 (128-  
OUT  
Pin)” on page 13, and “Pin Description DAE-3HT (72-Pin)” on page 18  
High Level Input Drive Voltage XTALI Pin  
Low Level Input Drive Voltage XTALI Pin  
Input Leakage Current (Note 10)  
VIHX  
VILX  
0.7  
-
-
PLLVDD  
V
V
-
0.3  
I
-
-
±10  
µA  
pF  
V
IN  
C
Input Capacitance  
-
9
-
IN  
VOHO  
VOLO  
High Level Output Drive Voltage OSCOUT Pin  
Low Level Output Drive Voltage OSCOUT Pin  
Output Capacitance  
PLLVDD - 0.3  
-
-
-
-
0.3  
V
C
-
9
-
pF  
ns  
V
OUT  
t
nRESET Pulse Width  
-
10  
3.3  
10  
<1  
3.3  
5
-
RST  
R
Typical Digital I/O Pad Ring Supply  
(Voltage)  
(Current, Active)  
(Current, Power-down)  
(Voltage)  
3.0  
3.6  
VDD  
-
-
mA  
mA  
V
-
-
PWM  
VDD  
Typical PWM I/O Pad Ring Supply  
3.0  
3.6  
(Current, Active)  
(Current, Power-down)  
-
-
-
-
mA  
mA  
<1  
FN6787.2  
July 12, 2012  
6
D2-926xx  
Electrical Specifications  
T
= +25°C, CVDD = PLLVDD = 1.8V ±5%, RVDD = PWMVDD = 3.3V ±10%. All grounds at 0.0V. All voltages  
A
referenced to ground. PLL at 294.912MHz, OSC at 24.576MHz, core running at 147.456MHz with typical audio data traffic. Minimum supply currents are  
measured in full power down configuration. (Continued)  
TEST  
MIN  
MAX  
SYMBOL  
CVDD  
PARAMETER  
CONDITIONS  
(Note 12)  
TYP  
1.8  
300  
15  
(Note 12)  
UNIT  
V
Typical Core Supply  
(Voltage)  
(Current, Active)  
(Current, Power-down)  
(Voltage)  
1.7  
1.9  
-
-
mA  
mA  
V
-
-
PLLVDD Typical PLL Analog Supply  
1.7  
1.8  
25  
1.9  
(Current, Active)  
(Current, Power-down)  
(Voltage)  
-
-
mA  
mA  
V
-
3.0  
-
10  
-
3.6  
-
ADCVDD Typical ADC Analog Supply  
CRYSTAL OSCILLATOR  
3.3  
12  
(Current, Active, Power-Down)  
mA  
Xo  
Crystal Frequency (Fundamental Mode Crystal)  
20  
24.576  
24.822  
MHz  
(24.576 + 1%)  
Dt  
Duty Cycle  
40  
-
-
60  
20  
%
t
Start-up Time (Start-up Time is Oscillator Enabled  
(with Valid Supply) to Stable Oscillation)  
5
ms  
START  
PLL  
F
VCO Frequency  
80.00  
20  
294.912  
-
297.86  
MHz  
MHz  
VCO  
F
Input Reference Frequency  
24.822  
IN  
(24.576 + 1%)  
Feedback Dividers (Integer)  
4
-
12  
2
15  
-
PLL Lock Time from any Input Change  
ms  
1.8V POWER-ON RESET  
V
Reset Enabled Voltage Level  
0.9  
1.1  
150  
5
1.4  
500  
-
V
EN  
t
POR Pulse Width Rejection (Note 12)  
POR Minimum Output Pulse Width  
-
-
µs  
µs  
REJ  
t
DIS  
1.8V BROWNOUT DETECTION  
Detect Level  
1.4  
20  
1.5  
100  
-
1.6  
V
t
Pulse Width Rejection  
-
-
ns  
ns  
BOD1  
t
Minimum Output Pulse Width  
O1  
3.3V BROWNOUT DETECTION  
Detect Level  
2.5  
20  
2.7  
100  
-
2.9  
V
t
Pulse Width Rejection  
-
-
ns  
ns  
BOD3  
t
Minimum Output Pulse Width  
O3  
ADC PERFORMANCE SPECIFICATIONS (DAE-3 only)  
V
ADCREF DC Level  
1.3  
-
1.4  
1.5  
V
µA  
V
REF  
I
ADCREF Load Current  
Analog Input Level  
-
-
±20  
REF  
V
V
- 0.6  
V
+ 0.6  
REF  
AIN  
REF  
ADC Dynamic Range & SNR (Note 13)  
1.0 V  
1kHz  
-
94  
-
dB  
P-P  
(ADC + ADC Decimator performance only, DSP inactive, no digital sine wave input  
audio processing, PWM outputs off, no pPWM switching)  
reference level,  
using firmware  
from Audio  
Canvas III™ rev  
3.1.4 or newer.  
ADC Dynamic Range & SNR (Note 13)  
-
83  
-
dB  
(DSP active and processing audio data, PWM active and driving  
audio outputs, measurements using typical system-level amplifier  
equivalent as measurement environment)  
FN6787.2  
July 12, 2012  
7
D2-926xx  
Electrical Specifications  
T
= +25°C, CVDD = PLLVDD = 1.8V ±5%, RVDD = PWMVDD = 3.3V ±10%. All grounds at 0.0V. All voltages  
A
referenced to ground. PLL at 294.912MHz, OSC at 24.576MHz, core running at 147.456MHz with typical audio data traffic. Minimum supply currents are  
measured in full power down configuration. (Continued)  
TEST  
MIN  
MAX  
SYMBOL  
PARAMETER  
CONDITIONS  
(Note 12)  
TYP  
-80  
0.1  
-80  
-70  
(Note 12)  
UNIT  
dB  
THD+N  
-
-
-
-
-
-
-
-
Gain Mismatch  
Crosstalk  
dB  
dB  
Power Supply Rejection  
dB  
NOTES:  
9. All input pins except XTALI.  
10. Input leakage applies to all pins except XTALO.  
11. Power-down is with device in reset and clocks stopped.  
12. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design.  
13. Analog performance is system-design dependent and is affected by factors that include PCB layout, shielding and routing of analog traces, additional  
components within the analog input path, and power supply isolation.  
Serial Audio Interface Port Timing (Figure 1) T = +25°C, CVDD = PLLVDD = 1.8V ±5%, RVDD = PWMVDD = 3.3V ±10%. All  
A
grounds at 0.0V. All voltages referenced to ground.  
MIN  
MAX  
SYMBOL  
tc  
DESCRIPTION  
SCKRx Frequency - SCKR0, SCKR1  
(Note 12)  
TYP  
(Note 12)  
UNIT  
MHz  
ns  
12.5  
SCLK  
tw  
SCKRx Pulse Width (High and Low) - SCKR0, SCKR1  
LRCKRx Setup to SCLK Rising - LRCKR0, LRCKR1  
LRCKRx Hold from SCLK Rising - LRCKR0, LRCKR1  
SDINx Setup to SCLK Rising - SDIN0, SDIN1  
SDINx Hold from SCLK Rising - SDIN0, SDIN1  
SDOUTx Delay from SCLK Falling  
40  
20  
20  
20  
20  
SCLK  
LRCLK  
LRCLK  
ts  
ns  
th  
ns  
ts  
SDI  
ns  
th  
SDI  
ns  
t
20  
ns  
dSDO  
t SCLK  
t SCLK  
w
c
SCKRx  
t LRCLK  
t
SCLK  
h
w
LRCLKRx  
t LRCLK  
t SDI  
s
s
SDINx  
t SDI  
t SDO  
h
d
SDOUTx  
FIGURE 1. SERIAL AUDIO INTERFACE PORT TIMING  
FN6787.2  
July 12, 2012  
8
D2-926xx  
2
Two-Wire (I C) Interface Port Timing (Figure 2) T = +25°C, CVDD = PLLVDD = 1.8V ±5%, RVDD = PWMVDD = 3.3V ±10%. All  
A
grounds at 0.0V. All voltages referenced to ground.  
MIN  
MAX  
SYMBOL  
DESCRIPTION  
(Note 12)  
(Note 12)  
UNIT  
kHz  
µs  
f
SCL Frequency  
100  
SCL  
t
Bus Free Time Between Transmissions  
SCL Clock Low  
4.7  
4.7  
4.0  
4.7  
4.0  
0
buf  
tw  
µs  
lowSCLx  
tw  
SCL Clock High  
µs  
highSCLx  
ts  
Setup Time For a (Repeated) Start  
Start Condition Hold Time  
µs  
STA  
th  
µs  
STA  
th  
SDA Hold From SCL Falling (Note 14)  
SDA Setup Time to SCL Rising  
SDA Output Delay Time From SCL Falling  
Rise Time of Both SDA and SCL  
Fall Time of Both SDA and SCL  
Setup Time For a Stop Condition  
µs  
SDAx  
SDAx  
SDAx  
ts  
250  
ns  
td  
3.5  
1
µs  
t
µs  
r
f
t
300  
ns  
ts  
STO  
4.7  
µs  
NOTE:  
14. Data must be held sufficient time to bridge the 300ns transition time of SCL.  
t
SCLx  
whigh  
t
t
R
F
t
SCLx  
wlow  
SCLx  
t STA  
s
t SDAx  
t STO  
h
s
t
tsSDAx  
BUF  
SDAx (INPUT)  
t STAx  
h
SDAx (OUTPUT)  
t SDAx  
d
2
FIGURE 2. I C INTERFACE TIMING  
FN6787.2  
July 12, 2012  
9
D2-926xx  
SPI™ Interface Port Timing (Figure 3) T = +25°C, CVDD = PLLVDD = 1.8V ±5%, RVDD = PWMVDD = 3.3V ±10%. All grounds at 0.0V.  
A
All voltages referenced to ground.  
MIN  
MAX  
SYMBOL  
DESCRIPTION  
(Note 12)  
(Note 12)  
UNIT  
SPI MASTER MODE TIMING  
t
MOSI Valid From Clock Edge  
MISO Setup to Clock Edge  
MISO Hold From Clock Edge  
nCS Minimum Width  
8
ns  
ns  
ns  
V
S
H
t
2
2
3
t
t
3 system clocks  
+ 2ns  
WI  
SPI SLAVE MODE TIMING  
t
MISO Valid From Clock Edge  
MOSI Setup to Clock Edge  
MOSI Hold From Clock Edge  
nCS Minimum Width  
8
ns  
ns  
ns  
V
S
H
t
2
2
3
t
t
3 system clocks  
+ 2ns  
WI  
SCK (CPHA = 1, CPOL = 0  
SCK (CPHA = 0, CPOL = 0  
t
t
V
V
MOSI  
t
H
t
S
MISO (CPHA = 0  
nCS  
t
WI  
FIGURE 3. SPI TIMING  
FN6787.2  
July 12, 2012  
10  
D2-926xx  
Pin Configuration DAE-3 (128-Pin Package)  
D2-92633, D2-92634  
(128 LD LQFP)  
TOP VIEW  
SC20  
SRD2  
SC21  
SCK2  
STD2  
SC22  
MCLK  
SCK3  
STD3  
SC32  
SC30  
SC31  
SRD3  
STD0  
SCK0  
CVDD  
CVDD  
CGND  
CGND  
RGND  
RVDD  
SRD0  
SC00  
SC01  
SC02  
SCK  
1
96  
95  
94  
93  
92  
91  
90  
89  
88  
87  
86  
85  
84  
83  
82  
81  
80  
79  
78  
77  
76  
75  
74  
73  
72  
71  
70  
69  
68  
67  
66  
65  
PWMVDD  
PWM0  
2
3
PWM1  
4
PWM2  
5
PWM3  
6
PWMGND  
PWMVDD  
PWM4  
7
8
9
PWM5  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
PWM6  
PWM7  
PWMGND  
PWMVDD  
PWM8  
PWM9  
PWM10  
PWM11  
PWM12  
PWM13  
PWMGND  
PWMVDD  
PWM14  
PWM15  
PWM16  
PWM17  
PWMGND  
CVDD  
TIO1  
MISO  
MOSI  
GPIO7  
GPIO3  
GPIO2  
CGND  
RGND  
RVDD  
GPIO1  
PROTECT2  
FN6787.2  
July 12, 2012  
11  
D2-926xx  
Pin Configuration DAE-3HT (72-Pin Package)  
D2-92683, D2-92684  
(72 LD QFN)  
TOP VIEW  
72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55  
1
2
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
SCLK3 (SC20)  
SDIN3 (SRD2)  
LRCK3 (SC21)  
SCLK4 (SCK2)  
SDIO4 (STD2)  
LRCK4 (SC22)  
SCLK12 (SCK3)  
SDIN2 (STD3)  
LRCK12 (SC32)  
SDIN1 (SRD3)  
CVDD  
PWM0  
PWM1  
PWM2  
PWM3  
PWMGND  
PWM4  
PWM5  
PWM6  
PWM7  
PWM8  
PWM9  
PWM10  
PWM11  
CVDD  
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
CGND  
RGND  
RVDD  
SCK  
CGND  
TIO1/NTC  
MISO  
RGND  
RVDD  
MOSI  
PROTECT2  
19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36  
NOTE:  
15. All pins pass Jedec II 100mA @ +85°C, with exception of pins 2, 4, 6, 7, 8, 9, 37, which pass 50mA @ +85°C  
FN6787.2  
July 12, 2012  
12  
D2-926xx  
Pin Description, DAE-3 (128-Pin)  
PIN  
NAME  
VOLTAGE  
LEVEL  
(V)  
DRIVE  
STRENGTH  
(mA)  
PIN (Note 16) TYPE  
DESCRIPTION  
2
1
2
3
4
5
6
7
SC20  
SRD2  
SC21  
SCK2  
STD2  
SC22  
MCLK  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
O
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
8
4
Serial Audio Interface 2, I S0 SCLK  
2
Serial Audio Interface 2, I S0 SDIN  
2
8
Serial Audio Interface 2, I S0 LRCK  
2
8
Serial Audio Interface 2, I S1 SCLK  
2
8
Serial Audio Interface 2, I S1 SDIN  
2
4
Serial Audio Interface 2, I S1 LRCK  
2
16  
I S Serial Audio Master Clock output for external ADC/DAC components, drives low on reset and  
is enabled by firmware assignment.  
2
8
SCK3  
STD3  
SC32  
SC30  
SC31  
SRD3  
STD0  
SCK0  
CVDD  
CVDD  
CGND  
CGND  
RGND  
RVDD  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
P
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
8
8
8
8
8
4
8
8
Serial Audio Interface 3, I S3 SCLK  
2
9
Serial Audio Interface 3, I S3 SDIN  
2
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
Serial Audio Interface 3, I S3 LRCK  
2
Serial Audio Interface 3, I S2 SCLK  
2
Serial Audio Interface 3, I S2 LRCK  
2
Serial Audio Interface 3, I S2 SDIN  
2
Serial Audio Interface 0, I S SDAT0  
2
Serial Audio Interface 0, I S LRCK0  
Core power, 1.8V  
P
Core power, 1.8V  
P
Core ground  
P
Core ground  
P
Digital pad ring ground. Internally connected to PWMGND.  
P
Digital pad ring power, 3.3V. This 3.3V supply is used for all the digital I/O pad drivers and  
receivers, except for the analog pads. Internally connected to PWMVDD.  
22  
23  
24  
25  
26  
27  
SRD0  
SC00  
SC01  
SC02  
SCK  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
4
8
Serial Audio Interface 0, SDIO, Defaults to input, and may be configured as GPIO by firmware.  
Serial Audio Interface 0, SDIO, Defaults to input, and may be configured as GPIO by firmware.  
2
8
Serial Audio Interface 0, I S SDAT1  
2
8
Serial Audio Interface 0, I S LRCK1  
4
SPI clock I/O with hysteresis input.  
TIO1  
16  
Timer I/O port 1. Operation and assignment is controlled by firmware. Leave unconnected when  
not in use.  
28  
29  
30  
MISO  
MOSI  
GPIO7  
I/O  
I/O  
I/O  
3.3  
3.3  
3.3  
4
4
SPI master input, slave output data signal.  
SPI master output, slave input data signal.  
16  
General purpose I/O Bidirectional GPIO port. (One of 8 GPIO. Resets to input port. Operation and  
assignment is defined by product application's firmware.)  
31  
32  
33  
GPIO3  
GPIO2  
GPIO4  
I/O  
I/O  
I/O  
3.3  
3.3  
3.3  
16  
16  
16  
General purpose I/O Bidirectional GPIO port. (One of 8 GPIO. Resets to input port. Operation and  
assignment is defined by product application's firmware.)  
General purpose I/O Bidirectional GPIO port. (One of 8 GPIO. Resets to input port. Operation and  
assignment is defined by product application's firmware.)  
General purpose I/O Bidirectional GPIO port. (One of 8 GPIO. Resets to input port. Operation and  
assignment is defined by product application's firmware.)  
FN6787.2  
July 12, 2012  
13  
D2-926xx  
Pin Description, DAE-3 (128-Pin)(Continued)  
PIN  
NAME  
VOLTAGE  
LEVEL  
(V)  
DRIVE  
STRENGTH  
(mA)  
PIN (Note 16) TYPE  
DESCRIPTION  
34  
35  
36  
37  
GPIO5  
GPIO6  
SDA1  
SCL1  
I/O  
I/O  
I/O  
I/O  
3.3  
3.3  
3.3  
3.3  
3.3  
16  
General purpose I/O Bidirectional GPIO port. (One of 8 GPIO. Resets to input port. Operation and  
assignment is defined by product application's firmware.)  
16  
General purpose I/O Bidirectional GPIO port. (One of 8 GPIO. Resets to input port. Operation and  
assignment is defined by product application's firmware.)  
8 - OD  
8 - OD  
4
Two-Wire Serial data port 1. Bidirectional signal used by both the master and slave controllers for  
data transport.  
Two-Wire Serial clock port 1. Bidirectional signal is used by both the master and slave controllers  
for clock signaling.  
38 PROTECT9 I/O  
PWM protection input with hysteresis. (One of 9 protection inputs. Specific function and channel  
assignment is defined by firmware.)  
39 SPDIFRX1  
40 SPDIFRX0  
I
I
3.3  
3.3  
3.3  
S/PDIF Digital audio data input 1  
S/PDIF Digital audio data input 0  
41  
SPDIFTX  
O
4
S/PDIF Digital audio output. (Audio content and audio processing signal flow is dependent upon  
firmware, driving stereo output up to 192kHz.)  
42  
43  
TEST  
IRQA  
I
I
3.3  
3.3  
Factory test use only. Must be tied low.  
Interrupt request port A, Boot Mode Select. One of 4 IRQ pins. Connects to logic high (3.3V) or to  
ground and High/Low logic status establishes boot mode selection upon de-assertion of reset  
(nRESET) cycle.  
44  
45  
46  
47  
IRQB  
IRQC  
IRQD  
TIO2  
I
3.3  
3.3  
3.3  
3.3  
Interrupt request port B, Boot Mode Select. One of 4 IRQ pins. Connects to logic high (3.3V) or to  
ground and High/Low logic status establishes boot mode selection upon de-assertion of reset  
(nRESET) cycle.  
I
I
Interrupt request port C, Boot Mode Select. One of 4 IRQ pins. Connects to logic high (3.3V) or to  
ground and High/Low logic status establishes boot mode selection upon de-assertion of reset  
(nRESET) cycle.  
Interrupt request port D, Boot Mode Select. One of 4 IRQ pins. Connects to logic high (3.3V) or to  
ground and High/Low logic status establishes boot mode selection upon de-assertion of reset  
(nRESET) cycle.  
I/O  
16  
Timer I/O port 2. Operation and assignment is controlled by firmware. Leave unconnected when  
not in use.  
48  
49  
50  
51  
52  
53  
CVDD  
CVDD  
CGND  
CGND  
RGND  
RVDD  
P
P
P
P
P
P
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
Core power, 1.8V  
Core power, 1.8V  
Core ground  
Core ground  
Digital pad ring ground. Internally connected to PWMGND.  
Digital pad ring power, 3.3V. This 3.3V supply is used for all the digital I/O pad drivers and  
receivers, except for the analog pads. Internally connected to PWMVDD.  
54  
55  
56  
PUMPHI  
PUMPLO  
PSSYNC  
I/O  
I/O  
I/O  
3.3  
3.3  
3.3  
16  
16  
16  
Assignable I/O. Function and operation defined by firmware.  
Assignable I/O. Function and operation defined by firmware.  
Synchronizing output signal to switching power supply. (Operates under specification of firmware  
and resets to high impedance inactive state when not used.)  
57  
58  
PSTEMP  
PSCURR  
I/O  
I/O  
3.3  
3.3  
3.3  
3.3  
4
4
Assignable I/O. Function and operation defined by firmware.  
Assignable I/O. Function and operation defined by firmware.  
PWM synchronization port. (Function and operation is defined by firmware.)  
59 PWMSYNC I/O  
60 PROTECT3 I/O  
16  
4
PWM protection input with hysteresis. (One of 9 protection inputs. Specific function and channel  
assignment is defined by firmware.)  
FN6787.2  
July 12, 2012  
14  
D2-926xx  
Pin Description, DAE-3 (128-Pin)(Continued)  
PIN  
NAME  
VOLTAGE  
LEVEL  
(V)  
DRIVE  
STRENGTH  
(mA)  
PIN (Note 16) TYPE  
DESCRIPTION  
61 PROTECT4 I/O  
62 PROTECT5 I/O  
63 PROTECT6 I/O  
64 PROTECT7 I/O  
65 PROTECT2 I/O  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
4
PWM protection input with hysteresis. (One of 9 protection inputs. Specific function and channel  
assignment is defined by firmware.)  
4
PWM protection input with hysteresis. (One of 9 protection inputs. Specific function and channel  
assignment is defined by firmware.)  
4
PWM protection input with hysteresis. (One of 9 protection inputs. Specific function and channel  
assignment is defined by firmware.)  
4
PWM protection input with hysteresis. (One of 9 protection inputs. Specific function and channel  
assignment is defined by firmware.)  
4
PWM protection input with hysteresis. (One of 9 protection inputs. Specific function and channel  
assignment is defined by firmware.)  
66  
67  
GPIO1  
RVDD  
I/O  
P
16  
General purpose I/O Bidirectional GPIO port. (One of 8 GPIO. Resets to input port. Operation and  
assignment is defined by product application's firmware.)  
Digital pad ring power, 3.3V. This 3.3V supply is used for all the digital I/O pad drivers and  
receivers, except for the analog pads. Internally connected to PWMVDD.  
68  
69  
70  
71  
72  
RGND  
CGND  
P
P
3.3  
3.3  
3.3  
3.3  
3.3  
Digital pad ring ground. Internally connected to PWMGND.  
Core ground  
CVDD  
P
Core power, 1.8V  
PWMGND  
PWM17  
P
PWM output pin ground. Internally connected to RGND.  
I/O  
8 or 16  
8 or 16  
8 or 16  
8 or 16  
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by  
firmware.)  
73  
74  
75  
76  
PWM16  
PWM15  
PWM14  
PWMVDD  
I/O  
I/O  
I/O  
P
3.3  
3.3  
3.3  
3.3  
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by  
firmware.)  
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by  
firmware.)  
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by  
firmware.)  
PWM output pin power. This 3.3V supply is used for the PWM pad drivers. Internally connected to  
RVDD.  
77  
78  
PWMGND  
PWM13  
P
3.3  
3.3  
PWM output pin ground. Internally connected to RGND.  
I/O  
8 or 16  
8 or 16  
8 or 16  
8 or 16  
8 or 16  
8 or 16  
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by  
firmware.)  
79  
80  
81  
82  
83  
84  
PWM12  
PWM11  
PWM10  
PWM9  
I/O  
I/O  
I/O  
I/O  
I/O  
P
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by  
firmware.)  
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by  
firmware.)  
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by  
firmware.)  
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by  
firmware.)  
PWM8  
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by  
firmware.)  
PWMVDD  
PWM output pin power. This 3.3V supply is used for the PWM pad drivers. Internally connected to  
RVDD.  
85  
86  
PWMGND  
PWM7  
P
3.3  
3.3  
PWM output pin ground. Internally connected to RGND.  
I/O  
8 or 16  
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by  
firmware.)  
FN6787.2  
July 12, 2012  
15  
D2-926xx  
Pin Description, DAE-3 (128-Pin)(Continued)  
PIN  
NAME  
VOLTAGE  
LEVEL  
(V)  
DRIVE  
STRENGTH  
(mA)  
PIN (Note 16) TYPE  
DESCRIPTION  
87  
88  
89  
90  
PWM6  
I/O  
I/O  
I/O  
P
3.3  
3.3  
3.3  
3.3  
8 or 16  
8 or 16  
8 or 16  
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by  
firmware.)  
PWM5  
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by  
firmware.)  
PWM4  
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by  
firmware.)  
PWMVDD  
PWM output pin power. This 3.3V supply is used for the PWM pad drivers. Internally connected  
to RVDD.  
91  
92  
PWMGND  
PWM3  
P
3.3  
3.3  
PWM output pin ground. Internally connected to RGND.  
I/O  
8 or 16  
8 or 16  
8 or 16  
8 or 16  
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by  
firmware.)  
93  
94  
95  
96  
97  
PWM2  
PWM1  
I/O  
I/O  
I/O  
P
3.3  
3.3  
3.3  
3.3  
1.8  
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by  
firmware.)  
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by  
firmware.)  
PWM0  
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by  
firmware.)  
PWMVDD  
OSCOUT  
PWM output pin power. This 3.3V supply is used for the PWM pad drivers. Internally connected to  
RVDD.  
P
Analog oscillator output to slave D2-926xx devices. OSCOUT drives a buffered version of the  
crystal oscillator signal from the XTALI pin.  
98  
99  
PLLAGND  
PLLTESTB  
P
O
O
P
1.8  
1.8  
1.8  
1.8  
PLL Analog ground  
Factory test use only. Must be tied low.  
Factory test use only. Must be tied low.  
100 PLLTESTA  
101  
XTALI  
Crystal oscillator analog input port. An external clock source would be driven into the this port. In  
multi-D2-926xx systems, the OSCOUT from the master D2-926xx would drive the XTALI pin.  
102  
XTALO  
P
1.8  
Crystal oscillator analog output port. When using an external clock source, this pin must be open.  
XTALO does not have a drive strength specification.  
103 PLLAVDD  
P
P
I
1.8  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
PLL Analog power, 1.8V  
104  
105  
106  
107  
ADCVDD  
AIN1  
Analog power for internal ADC, 3.3V  
Analog input 1 to internal ADC  
ADCREF  
AIN0  
O
I
Analog voltage reference output. Must be de-coupled to analog ground with 1µF capacitor.  
Analog input 0 to internal ADC  
108 ADCGND  
P
I
Analog ground for internal ADC  
109  
110  
111  
nTRST  
nCS  
Factory test only. Must be tied high at all times.  
SPI slave select I/O.  
I/O  
P
4
RVDD  
Digital pad ring power, 3.3V. This 3.3V supply is used for all the digital I/O pad drivers and  
receivers, except for the analog pads. Internally connected to PWMVDD.  
112  
113  
114  
115  
116  
RGND  
CGND  
CVDD  
SC12  
SC11  
P
P
3.3  
3.3  
3.3  
3.3  
3.3  
Digital pad ring ground. Internally connected to PWMGND.  
Core ground  
P
Core power, 1.8V  
I/O  
I/O  
8
8
Serial Audio Interface 1, LRCK  
Serial Audio Interface 1, SDAT3  
FN6787.2  
July 12, 2012  
16  
D2-926xx  
Pin Description, DAE-3 (128-Pin)(Continued)  
PIN  
NAME  
VOLTAGE  
LEVEL  
(V)  
DRIVE  
STRENGTH  
(mA)  
PIN (Note 16) TYPE  
DESCRIPTION  
Serial Audio Interface 1, data (Assignment by firmware control.)  
Serial Audio Interface 1, SDAT2  
117  
118  
119  
120  
SC10  
STD1  
SCK1  
SRD1  
I/O  
I/O  
I/O  
I/O  
O
3.3  
3.3  
3.3  
3.3  
3.3  
8
8
8
4
Serial Audio Interface 1, SCK  
Serial Audio Interface 1, data (Assignment by firmware control.)  
121 nRSTOUT  
16 - OD  
Active low open drain reset output. Pin drives low from POR generator, 3.3V brownout detector  
going active, or from 1.8V brownout detector going active. This output should be used to initiate a  
system reset to the nRESET pin upon brownout event detection.  
122  
123  
nRESET  
TIO0  
I
3.3  
Active low reset input with hysteresis. Activates system level reset when pulled low, initializing all  
internal logic and program operations. System latches boot mode selection of the IRQ input pins  
on the rising edge.  
I/O  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
16  
4
Timer I/O port 0. Operation and assignment is controlled by firmware. Leave unconnected when  
not in use.  
124 PROTECT1 I/O  
125 PROTECT0 I/O  
PWM protection input with hysteresis. (One of 9 protection inputs. Specific function and channel  
assignment is defined by firmware.)  
4
PWM protection input with hysteresis. (One of 9 protection inputs. Specific function and channel  
assignment is defined by firmware.)  
126  
127  
GPIO0  
SDA0  
SCL0  
I/O  
I/O  
I/O  
16  
General purpose I/O Bidirectional GPIO port. (One of 8 GPIO. Resets to input port. Operation and  
assignment is defined by product application's firmware.)  
8 - OD  
8 - OD  
Two-Wire Serial data port 0. Bidirectional signal used by both the master and slave controllers for  
data transport.  
128  
Two-Wire Serial clock port 0. Bidirectional signal is used by both the master and slave controllers  
for clock signaling.  
NOTES:  
16. Unless otherwise specified, all pin names are active high. Those that are active low have an “n” prefix.  
17. All power and ground pins of same names are to be tied together to all other pins of their same name. (i.e., CVDD pins to be tied together, CGND pins  
to be tied together, RVDD pins to be tied together, and RGND pins to be tied together.) CGND and RGND are to be tied together on board. RGND and  
PWMGND pins are also internally connected and are to be tied together.  
FN6787.2  
July 12, 2012  
17  
D2-926xx  
Pin Description DAE-3HT (72-Pin)  
PIN  
NAME  
VOLTAGE  
LEVEL  
(V)  
DRIVE  
STRENGTH  
(mA)  
PIN (Note 16) TYPE  
DESCRIPTION  
2
2
1
2
3
4
SCLK3  
(SC20)  
In  
In  
In  
In  
3.3  
3.3  
3.3  
3.3  
8
4
8
8
Bit clock, I S port 3, audio input channels 5-6. (I S port 3 is 1 of 3 input-only ports, providing  
channels 5-6 input audio content.)  
2
2
SDIN3  
(SRD2)  
Audio data, I S port 3, audio input channels 5-6 (I S port 3 is 1 of 3 input-only ports, providing  
channels 5-6 input audio content.)  
2
2
LRCK3  
(SC21)  
L/R clock, I S port 3, audio input channels 5-6 (I S port 3 is 1 of 3 input-only ports, providing  
channels 5-6 input audio content.)  
2
2
SCLK4  
(SCK2)  
Bit clock, I S port 4, audio input channels 7-8, or audio output channels 1-2. (I S port 4 is either  
an I S input port, or and I S output port. Selection of input or output is defined by firmware. When  
used as input, port 4 provides channel 7-8 input audio content. When used as an output, port 4  
2
2
2
provides the 2 channels of I S output audio.)  
2
2
2
5
6
SDIO4  
(STD2)  
I/O  
In  
3.3  
3.3  
8
4
Audio data, I S port 4, input channels 7-8, or output channels 1-2. (I S port 4 is either an I S input  
2
port, or and I S output port. Selection of input or output is defined by firmware. When used as  
input, port 4 provides channel 7-8 input audio content. When used as an output, port 4 provides  
the 2 channels of I S output audio.)  
2
2
2
LRCK4  
(SC22)  
L/R clock, I S port 4, audio input channels 7-8, or audio output channels 1-2. (I S port 4 is either  
2
2
an I S input port, or and I S output port. Selection of input or output is defined by firmware. When  
used as input, port 4 provides channel 7-8 input audio content. When used as an output, port 4  
provides the 2 channels of I S output audio.)  
2
2
2
7
8
SCLK12  
(SCK3)  
In  
In  
In  
In  
3.3  
3.3  
3.3  
3.3  
8
8
8
8
Bit clock, I S ports 1 & 2, audio input channels 1-4 (I S ports 1 & 2 are 2 of the 3 input-only ports,  
providing channels 1-4 input audio content.)  
2
2
SDIN2  
(STD3)  
Audio data, I S port 2, audio input channels 3-4 (I S ports 1 & 2 are 2 of the 3 input-only ports,  
providing channels 1-4 input audio content.)  
2
2
9
LRCK12  
(SC32)  
L/R clock, I S ports 1 & 2, audio input channels 1-4 (I S ports 1 & 2 are 2 of the 3 input-only ports,  
providing channels 1-4 input audio content.)  
2
2
10  
SDIN1  
(SRD3)  
Audio data, I S port 1, audio input channels 1-2 (I S ports 1 & 2 are 2 of the 3 input-only ports,  
providing channels 1-4 input audio content.)  
11  
12  
13  
14  
CVDD  
CGND  
RGND  
RVDD  
P
G
G
P
3.3  
3.3  
3.3  
3.3  
Core power, 1.8V  
Core ground  
Digital pad ring ground. Internally connected to PWMGND.  
Digital pad ring power, 3.3V. This 3.3V supply is used for all the digital I/O pad drivers and  
receivers, except for the analog pads. Internally connected to PWMVDD.  
15  
16  
SCK  
I/O  
I/O  
3.3  
3.3  
4
SPI clock I/O with hysteresis input.  
TIO1/NTC  
16  
Timer I/O port 1, or assignable NTC temperature sensing common I/O. Operation and assignment  
is controlled by firmware. Leave unconnected when not in use.  
17  
18  
19  
MISO  
MOSI  
SDA1  
I/O  
I/O  
I/O  
3.3  
3.3  
3.3  
4
4
SPI master input, slave output data signal.  
SPI master output, slave input data signal.  
2
8 - OD  
Two-Wire Serial (I C) data port 1. Primary control interface data signal used for device boot and  
control. Bidirectional port for both master and slave controllers operation.  
2
20  
SCL1  
I/O  
3.3  
8 - OD  
Two-Wire Serial (I C) clock port 1. Primary control interface clock signal used for device boot and  
control. Bidirectional port for both master and slave controllers operation.  
21  
22  
SPDIFRX  
SPDIFTX  
In  
O
3.3  
3.3  
S/PDIF Digital audio data input  
S/PDIF Digital audio output. (Audio content and audio processing signal flow is dependent upon  
firmware, driving stereo output up to 192kHz.)  
23  
24  
TEST  
IRQA  
In  
In  
3.3  
3.3  
Factory test use only. Must be tied low.  
Interrupt request port A, Boot Mode Select. One of 4 IRQ pins. Connects to logic high (3.3V) or to  
ground and High/Low logic status establishes boot mode selection upon de-assertion of reset  
(nRESET) cycle.  
FN6787.2  
July 12, 2012  
18  
D2-926xx  
Pin Description DAE-3HT (72-Pin)(Continued)  
PIN  
NAME  
VOLTAGE  
LEVEL  
(V)  
DRIVE  
STRENGTH  
(mA)  
PIN (Note 16) TYPE  
DESCRIPTION  
25  
26  
27  
IRQB  
IRQC  
IRQD  
In  
In  
In  
3.3  
3.3  
3.3  
Interrupt request port B, Boot Mode Select. One of 4 IRQ pins. Connects to logic high (3.3V) or to  
ground and High/Low logic status establishes boot mode selection upon de-assertion of reset  
(nRESET) cycle.  
Interrupt request port C, Boot Mode Select. One of 4 IRQ pins. Connects to logic high (3.3V) or to  
ground and High/Low logic status establishes boot mode selection upon de-assertion of reset  
(nRESET) cycle.  
Interrupt request port D, Boot Mode Select. One of 4 IRQ pins. Connects to logic high (3.3V) or to  
ground and High/Low logic status establishes boot mode selection upon de-assertion of reset  
(nRESET) cycle.  
28  
29  
30  
31  
CVDD  
CGND  
RGND  
RVDD  
P
G
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
Core power, 1.8V  
Core ground  
G
Digital pad ring ground. Internally connected to PWMGND.  
P
Digital pad ring power, 3.3V. This 3.3V supply is used for all the digital I/O pad drivers and  
receivers. Internally connected to PWMVDD.  
32 PROTECT3  
33 PROTECT4  
34 PROTECT5  
In  
In  
In  
4
4
4
4
4
PWM protection input with hysteresis. (One of 8 protection inputs. Specific function, channel  
assignment, & optional GPIO is defined by firmware.)  
PWM protection input with hysteresis. (One of 8 protection inputs. Specific function, channel  
assignment, & optional GPIO is defined by firmware.)  
PWM protection input with hysteresis. (One of 8 protection inputs. Specific function, channel  
assignment, & optional GPIO is defined by firmware.)  
35 PROTECT6 I/O  
/nMUTE  
PWM protection input with hysteresis, or optional mute output. (One of 8 protection inputs.  
Specific function, channel assignment, and/or optional GPIO is defined by firmware.)  
36 PROTECT7  
/nOVRT  
In  
PWM protection input with hysteresis, or optional over-temperature monitor input. (One of 8  
protection inputs. Specific function, channel assignment, and/or optional GPIO is defined by  
firmware.)  
37 PROTECT2  
In  
P
3.3  
3.3  
4
PWM protection input with hysteresis. (One of 8 protection inputs. Specific function, channel  
assignment, & optional GPIO is defined by firmware.)  
38  
RVDD  
Digital pad ring power, 3.3V. This 3.3V supply is used for all the digital I/O pad drivers and  
receivers. Internally connected to PWMVDD.  
39  
40  
RGND  
CGND  
G
G
3.3  
3.3  
Digital pad ring ground. Internally connected to PWMGND.  
Core ground  
41  
42  
43  
44  
45  
46  
CVDD  
PWM11  
PWM10  
PWM9  
PWM8  
PWM7  
P
O
O
O
O
O
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
Core power, 1.8V  
8 or 16  
8 or 16  
8 or 16  
8 or 16  
8 or 16  
PWM output pin. (One of 12 PWM output pins. Channel and operation assignment is defined by  
firmware.)  
PWM output pin. (One of 12 PWM output pins. Channel and operation assignment is defined by  
firmware.)  
PWM output pin. (One of 12 PWM output pins. Channel and operation assignment is defined by  
firmware.)  
PWM output pin. (One of 12 PWM output pins. Channel and operation assignment is defined by  
firmware.)  
PWM output pin. (One of 12 PWM output pins. Channel and operation assignment is defined by  
firmware.)  
FN6787.2  
July 12, 2012  
19  
D2-926xx  
Pin Description DAE-3HT (72-Pin)(Continued)  
PIN  
NAME  
VOLTAGE  
LEVEL  
(V)  
DRIVE  
STRENGTH  
(mA)  
PIN (Note 16) TYPE  
DESCRIPTION  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
61  
62  
63  
64  
65  
66  
PWM6  
PWM5  
PWM4  
PWMGND  
PWM3  
PWM2  
PWM1  
PWM0  
PWMVDD  
PLLAGND  
XTALI  
O
O
O
O
O
O
O
O
P
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
1.8  
1.8  
1.8  
1.8  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
8 or 16  
8 or 16  
8 or 16  
PWM output pin. (One of 12 PWM output pins. Channel and operation assignment is defined by  
firmware.)  
PWM output pin. (One of 12 PWM output pins. Channel and operation assignment is defined by  
firmware.)  
PWM output pin. (One of 12 PWM output pins. Channel and operation assignment is defined by  
firmware.)  
PWM output pin power ground  
8 or 16  
8 or 16  
8 or 16  
8 or 16  
PWM output pin. (One of 12 PWM output pins. Channel and operation assignment is defined by  
firmware.)  
PWM output pin. (One of 12 PWM output pins. Channel and operation assignment is defined by  
firmware.)  
PWM output pin. (One of 12 PWM output pins. Channel and operation assignment is defined by  
firmware.)  
PWM output pin. (One of 12 PWM output pins. Channel and operation assignment is defined by  
firmware.)  
PWM output pin power. This 3.3V supply is used for the PWM pad drivers. Internally connected to  
RVDD.  
G
In  
O
P
PLL Analog ground  
Crystal oscillator analog input port. When using an external clock source, the external clock is  
driven into the this port.  
XTALO  
Crystal oscillator analog output port. When using an external clock source, this pin must be open.  
XTALO does not have a drive strength specification.  
PLLAVDD  
nSS  
PLL Analog power, 1.8V  
O
P
4
SPI slave select I/O.  
RVDD  
Digital pad ring power, 3.3V. This 3.3V supply is used for all the digital I/O pad drivers and  
receivers. Internally connected to PWMVDD.  
RGND  
G
G
P
Digital pad ring ground. Internally connected to PWMGND.  
CGND  
Core ground  
CVDD  
Core power, 1.8V  
SCK1  
/MCLK  
I/O  
O
8
Assignable general purpose I/O, or MCLK output. Operation and assignment is controlled by  
firmware. Assigns as default output for MCLK when enabled through firmware.  
nRSTOUT  
16 - OD  
Active low open drain reset output. Pin drives low from POR generator, 3.3V brownout detector  
going active, or from 1.8V brownout detector going active. This output should be used to initiate a  
system reset to the nRESET pin upon brownout event detection.  
67  
68  
nRESET  
In  
3.3  
3.3  
Active low reset input with hysteresis. Activates system level reset when pulled low, initializing all  
internal logic and program operations. System latches boot mode selection of the IRQ input pins  
on the rising edge.  
TIO0  
/PSSYNC  
I/O  
16  
Timer I/O port 0, or power supply sync output. Operation and assignment is controlled by  
firmware. Leave unconnected when not in use.  
FN6787.2  
July 12, 2012  
20  
D2-926xx  
Pin Description DAE-3HT (72-Pin)(Continued)  
PIN  
NAME  
VOLTAGE  
LEVEL  
(V)  
DRIVE  
STRENGTH  
(mA)  
PIN (Note 16) TYPE  
DESCRIPTION  
69 PROTECT1  
In  
3.3  
3.3  
3.3  
3.3  
4
PWM protection input with hysteresis. (One of 8 protection inputs. Specific function, channel  
assignment, & optional GPIO is defined by firmware.)  
70 PROTECT0  
In  
4
PWM protection input with hysteresis. (One of 8 protection inputs. Specific function, channel  
assignment, & optional GPIO is defined by firmware.)  
71  
72  
SDA0  
/TEMPREF  
I/O  
I/O  
8 - OD  
8 - OD  
Two-Wire Serial data port 0, or assignable I/O. Available for NTC temperature sensing reference  
as assignable I/O. Function is assigned by firmware.  
SCL0  
Two-Wire Serial clock port 0, assignable I/O. Available for NTC temperature sensing reference as  
assignable I/O. Function is assigned by firmware.  
/TEMPNTC  
NOTES:  
18. Unless otherwise specified, all pin names are active high. Those that are active low have an “n” prefix.  
19. All power and ground pins of same names are to be tied together to all other pins of their same name. (i.e., CVDD pins to be tied together, CGND pins  
to be tied together, RVDD pins to be tied together, and RGND pins to be tied together.) CGND and RGND are to be tied together on board. RGND and  
PWMGND pins are also internally connected and are to be tied together.  
FN6787.2  
July 12, 2012  
21  
D2-926xx  
Functional Block Diagram - DAE-3  
FIGURE 4. DAE-3 IC FUNCTIONAL BLOCK DIAGRAM  
FN6787.2  
July 12, 2012  
22  
D2-926xx  
Functional Block Diagram - DAE-3HT  
FIGURE 5. DAE-3HT IC FUNCTIONAL BLOCK DIAGRAM  
FN6787.2  
July 12, 2012  
23  
D2-926xx  
The DAE-3 supports a Class-D amplifier system built around  
internal audio processing blocks and amplifier system hardware  
functions.  
Functional Description  
Introduction  
The DAE-3 family of ICs provide the core functionality, amplifier  
control, and complete audio signal processing for D2Audio  
Class-D amplifier solutions. The devices are highly  
programmable with all system features and functionality totally  
defined by firmware, that includes complete definition of audio  
processing, signal flow, digital audio I/O, and amplifier hardware  
interface control.  
In addition to audio processing blocks and signal flow that are  
user-selectable, system functions of hardware are configurable  
that include PWM timing control, channel configuration and  
assignment, protection and monitoring features, clock  
configurations, and other audio system features. Choices and  
settings are defined using the Audio Canvas III design tool  
software which builds the unique DAE firmware for each  
particular system design.  
The Audio Canvas III software design tool supports building of the  
firmware for the DAE-3 family devices. Using Audio Canvas III, the  
designer is able to fully define audio processing and hardware  
function features with I/O assignments, and build complete  
production-ready firmware for the DAE-3 devices.  
DSP  
The majority of the audio processing functions and hardware  
feature implementations operate through firmware running  
within the DSP core. The core is a 24-bit fixed-point Digital Signal  
Processor, with its own DMA, interrupt control, memory spaces,  
and control interfaces.  
DAE-3 DEVICE DESIGNATIONS  
The DAE-3 device family includes both the DAE-3 and DAE-3HT  
ICs. Functional specifications are identical to both designations  
of this family unless otherwise indicated.  
Sample Rate Converters (SRC)  
DAE-3 family supports internal asynchronous sample rate  
conversion to align input audio streams to a single rate  
compatible with the DSP processing rate and PWM switch rate.  
The family has 4 independent rate estimators, allowing up to 4  
asynchronous stereo inputs (8 channels) to be sample rate  
converted and processed simultaneously. The sample rate  
converter has a measured SNR that exceeds 140dB and a  
THD+N that exceeds -125dB.  
The family device names apply to these part numbers:  
DAE FAMILY  
DEVICE NAME  
DAE PART  
NUMBERS  
PACKAGE  
PINS  
DAE-3  
D2-92633-LR  
D2-92634-LR  
128-Pin Package  
DAE-3HT  
D2-92683-QR  
D2-92684-QR  
72-Pin Package  
Serial Digital Audio Interface  
SERIAL DIGITAL AUDIO INPUTS  
The DAE-3 devices are completely pin-compatible with the DAE-6  
devices, allowing full flexibility for function vs cost trade-off,  
providing cost-effective solutions for applications of varying  
end-user features and capabilities.  
The DAE-3 families include 4 Serial Audio Interface (SAI) digital  
audio input ports supporting up to 8 audio channels.  
• The DAE-3 supports four independent SAI ports. All 4 ports  
operate asynchronously to receive audio from 4 independent  
audio sources, and each of the 4 ports has its own clock and  
frame inputs. SAI port 3 (the 4th port) of the DAE-3 has  
multiplexed inputs to select that port’s audio from the SAI  
input or from the on-chip ADC.  
The DAE-3HT devices are identical to the DAE-3 but are provided  
in a smaller 72-pin package with features and I/O mapped to  
pins supported in that package.  
AUDIO CANVAS III SUPPORT  
Audio Canvas III is a powerful design tool that lets the designer  
define audio processing and build a signal flow customized to the  
user’s specifications. It fully supports the DAE-3 family including  
configuring the DAE family hardware I/O features and pin  
assignments. The designer can define the entire audio signal  
flow and architecture without signal flow limitations to any  
specific system. Capabilities include drag-and-drop of individual  
audio processing blocks that can be inserted into the signal flow,  
ability to connect and re-route signal flow, and live update  
capability to build and download the new audio architecture  
directly into the operating amplifier.  
• The DAE-3HT devices support either 4 SAI input ports, or when  
its fourth port is used as an audio output, support 3 SAI input  
ports.  
2
Each SAI port supports the digital audio industry I S standard  
which is capable of carrying up to 24-bit Linear PCM audio words  
per subframe IEC60958, or compressed digital audio (Dolby®  
Digital, AAC, MPEG, etc.) packing per the IEC61937 specification.  
The SAI port also supports Left-Justified formatted Linear PCM or  
compressed digital audio. These ports support sample rates from  
32kHz to 192kHz.  
The DAE-3 family of ICs supports a wide variety of signal flows  
and audio processing options that are fully programmable and  
are completely defined by the system firmware and system  
architecture.  
SAI data formats are shown in Figure 6. For I2S format, the left  
channel data is read when LRCK is low. For the Left-Justified  
format, the left channel data is read when LRCK is high. Either  
format requires data to be valid on the rising edge of SCLK and  
sent MSB-first on SDIN with 32 bits of data per channel. Each set  
of digital inputs runs asynchronously to the others and may  
accept different sample rates and formats.  
The firmware is built by the Audio Canvas III software, enabling  
full audio processing and amplifier hardware feature definition  
by the designer.  
FN6787.2  
July 12, 2012  
24  
D2-926xx  
Input audio may be received from the S/PDIF input for 2 audio  
SERIAL DIGITAL AUDIO OUTPUTS  
input channels, concurrent with and asynchronous from audio  
that is also being presented to SAI inputs for other audio input  
channels. Routing through the SRC synchronizes this audio from  
multiple sources for synchronous audio processing within the  
DAE audio processing paths.  
Up to 4 SAI ports (up to 8 channels) are supported in the DAE-3  
families.  
2
• The DAE-3 supports 4 independent I S output ports for a total  
of 8 channels of audio.  
2
• the DAE-3HT supports 1 I S output port (2 channels) and that  
port is configured to operate as either an input port or as an  
output port.  
Use and channel assignment to the SAI outputs is configured  
using the Audio Canvas III software. Any of the DAE device’s 12  
audio processing channels may be assigned to any of the  
available SAI output channels. Audio Canvas III also assigns use  
of the 4th SAI port as in input or output for the DAE-3HT.  
Left Channel  
LRCLKx  
SCLKx  
Right Channel  
Serial  
Data  
-1  
-2  
-1  
-2  
-3  
+3  
+2  
+1  
LSB  
+3  
+2  
+1  
LSB  
-3  
MSB  
MSB  
MSB  
I2S Format  
Right Channel  
LRCLKx  
SCLKx  
Left Channel  
Serial  
Data  
-1  
-2  
-1  
-2  
-4  
+3  
+2  
+1  
LSB  
-3  
+3  
+2  
+1  
LSB  
-3  
MSB  
MSB  
-4  
MSB  
-1  
Left-Justified  
FIGURE 6. SAI PORT SUPPORTED DATA FORMATS FOR DELIVERY OF LINEAR PCM OR COMPRESSED AUDIO DATA  
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D2-926xx  
S/PDIF Digital Audio Interface  
ADC input (DAE-3 Devices Only)  
The device families include a S/PDIF Digital receiver and  
transmitter.  
The DAE-3 devices contains a high-performance Analog-to-Digital  
Converter (ADC) that connects to input analog sources with a  
minimum of interface circuitry. The ADC is included in the DAE-3  
devices only. It is not supported in the DAE-3HT devices.  
• The DAE-3 devices (128 pin packaged devices) include an on-  
chip multiplexer supporting switching of input from 2 different  
S/PDIF input pins. Input selection determines which pin routes  
to the S/PDIF receiver.  
At a bandwidth of 20kHz at nominal voltage and temperature,  
the ADC input of the DAE-3 provides a typical THD+N  
(unweighted) value of -81dB and a typical SNR/Dynamic Range  
• The DAE-3HT devices (72 pin packaged devices) support one  
input pin only and do not use multiplex switching.  
of 83dB. These typical performances are based on a 1.0V  
1
P-P  
kHz sine wave input reference level, using a representative  
system-level amplifier environment processing digital audio data  
and producing PWM amplifier outputs.  
All of the devices in the family include a S/PDIF Digital  
transmitter.  
S/PDIF RECEIVER  
Analog performance is affected by factors that include PCB  
layout, shielding and routing of analog traces, additional  
components within the analog input path, and proper power  
supply isolation techniques.  
The S/PDIF receiver input pins are 3.3V CMOS input level  
compatible, requiring external circuitry to condition the serial  
input. The receiver contains an input transition detector, digital  
PLL clock recovery, and a decoder to separate audio, channel  
status, and user data. Only the first 24-Channel status bits are  
supported. The receiver constantly monitors the incoming data  
stream to detect the IEC61937-1 packet headers, and if found,  
captures the Pc and Pd data words into registers. The receiver  
meets the jitter tolerance specified in IEC60958-4.  
The ADC master clock is supplied from the low jitter PLL of the  
D2-926xx. The ADC operates synchronous to the DSP processing  
which minimizes noise pickup.  
PWM Audio Amplifier Outputs  
The DAE-3 family devices include an integrated 12-channel PWM  
engine. Each engine is independently programmable for timing,  
output pin assignment and audio processing path source.  
S/PDIF is typically used for receiving compressed (IEC61937-  
compliant) as well as stereo PCM (IEC60958-compliant) audio  
data. This interface also supports receipt of compressed audio  
data that is not compliant with the IEC61937 specification, but  
instead meets the IEC60958 specification.  
PWM operation is defined by firmware. The Audio Canvas III  
design tool provides the selection for audio channel assignment  
routing, protection enabling, timing, and PWM output pin  
mapping, then uses these selections to build the firmware that  
controls the PWM outputs. Some features such as dead-band  
timing are also adjustable in real-time through the control  
interface.  
S/PDIF receive data is routed through the SRC, providing a time  
synchronized audio input stream for use within any of the DAE  
audio processing channels. Audio may be presented on the  
S/PDIF input asynchronous to audio also being presented to the  
2
I S Serial Digital inputs such that after routing through the SRC,  
Programmability enable use of multiple PWM output topologies,  
which supporting system designs of a broad range of output  
stages. Output topologies include integrated power stages, or  
discrete implementations using N+N or P+N for half-bridge, full-  
bridge or bridged-tied-load power stages. The PWM outputs may  
be used for powered outputs, and may also be used for driving  
line-level or headphone outputs.  
are synchronous time aligned for internal DAE audio processing.  
S/PDIF TRANSMITTER  
The transmitter complies with the consumer applications defined  
in IEC60958-3. The transmitter supports 24-bit audio data, 24-bit  
user data, and 30-bit channel status data. S/PDIF output is linear  
PCM only and is non-compressed. Routing of compressed audio  
that is presented to the DAE inputs must be decoded by the DAE  
and its firmware before the selected channels may be routed to  
the S/PDIF outputs.  
The 12 PWM channels are mapped to the PWM output pins by  
firmware register assignment. Both DAE-3 and DAE-3HT include  
12 PWM engines, and their available pins are:  
Audio routing to the S/PDIF transmitter is defined by the signal  
flow built by the Audio Canvas III software. That software  
supports assigning any of the audio processing channels to the 2  
(L/R) channels of the S/PDIF output. Because all timing of the  
internal audio processing is synchronous to the internal DSP and  
processing channels, the S/PDIF audio output is also  
synchronous to that internal timing.  
• DAE-3 - 18 assignable and mappable pins  
• DAE-3HT- 12 assignable and mappable pins  
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D2-926xx  
Timers provides programmed I/O control of features that are  
Amplifier Protection  
event or timing dependent. Their hardware pins are assigned to  
system features, and operation is controlled through firmware.  
Timer pins are configurable based on the features supported  
within the system firmware. Choice and operation of their  
assigned features is selected through the Audio Canvas III  
software that builds the firmware for the specific system project.  
The core firmware that operates the DAE-3 family devices  
supports protection options to prevent damage from faults  
present in class-D amplifier designs. This protection is also  
effective against user-induced faults such as clipping, output  
overload, or output shorts, including both shorted outputs or  
short-to-ground faults.  
POWER SUPPLY SYNCHRONIZATION  
Protection features and their details are firmware dependent.  
The Audio Canvas III program provides selection for assignment  
and use of certain protection methods, using the selections for  
building the system firmware.  
The PSSYNC pin provides a power supply synchronization signal  
for switching power supplies. This synchronizing of power supply  
switching with the PWM switching rate eliminates audio output  
tones generated if the switching power supply is not locked to the  
amplifier switching.  
GRACEFUL OVERCURRENT AND SHORT CIRCUIT  
Per-channel PWM protection is supported through individual  
protection input pins. These PROTECT pins are primarily intended  
for protecting the PWM powered output stages and operation is  
firmware controlled. The protection input signal is typically  
generated by sensing circuits within power stages and can  
include sensing for detecting current, temperature, or voltage  
fault conditions.  
Firmware settings configure PSSYNC to the desired frequency  
needed by the system switching regulator. The Audio Canvas III  
software supports selection of use and frequency of this output.  
Clocks And PLL  
The PLL block operation is completely managed by the system  
firmware. The clock generation contains a low jitter PLL critical  
for low noise PWM output and a precise master clock source for  
the ADC, sample rate conversion, and the audio data paths.  
Overcurrent sensing requires a current sensor in the power  
device to be protected, usually a powered PWM output. The  
typical sensor asserts its fault signal that is routed to the  
PROTECT pins of the DAE device.  
The PLL block includes a low noise crystal oscillator, clock  
multipliers clock generation for all internal device timing, PWM  
engine timing, and clock reference for use with assignable clock  
outputs that include MCLK and PSSYNC outputs.  
The D2-926xx devices observe the overcurrent protection inputs  
and provides graceful protection for the assigned output stages.  
Hardware may be configured to provide immediate current  
reduction, cycle-by-cycle output clipping, output signal control,  
and output stage deactivation depending on the severity and  
duration of high current events. The combination of hardware  
features and firmware monitoring allows the system to  
differentiate between an overcurrent situation or a more serious  
short circuit condition, and supports the managed protection  
within the DAE amplifier systems.  
The system clock is provided by the crystal oscillator, using either  
a fundamental mode crystal or a clock input to the XTALI pin. If  
the clock input is used, it must be a 1.8V signal level. The input  
signal on the XTALI pin is analog buffered and driven onto the  
OSCOUT pin for use in driving the XTALI input of other D2-926xx  
controllers, for supporting synchronous timing if multiple DAE  
devices are used in a single application.  
Reset and Initialization  
THERMAL PROTECTION  
The D2-926xx must be reset after power-up to begin proper  
operation. In normal system hardware configurations, the reset  
occurs automatically via the reset hardware circuitry. The chip  
contains power rail sensors, brownout detectors, on the 3.3V and  
1.8V power supplies. These brownout sensors will assert and hold  
an internal Power-on Reset which will disable the device until the  
power supplies are at a safe level for the DSP to start. These same  
brownout sensors will detect a power supply voltage droop while  
the system is active and provide a safe amplifier shutdown.  
Temperature monitoring may be used to provide warning,  
shutdown, or managed output level reduction to attempt to  
reduce heating effects at high load power. Multiple thermal  
protection methods are supported within the DAE family  
firmware. User choice of method and operation is  
programmable, using the Audio Canvas III software to configure  
settings and options.  
Hardware I/O Features  
The DAE-3 and DAE-3HT provides programmable I/O pins used  
for various hardware functions of the system design. Pin  
functions are defined by the product firmware and configured  
with the Audio Canvas III software.  
Power Sequencing  
The CVDD and RVDD (including PWMVDD) supplies should be  
brought up together to avoid high current transients that could  
fold back a power supply regulator. The ADCVDD and PLLVDD  
may be brought up separately. Best practice would be for all  
supplies to feed from regulators with a common power source.  
Typically this can be achieved by using a single 5V power source  
and regulating the 3.3V and 1.8V supplies from that 5V source.  
GENERAL-PURPOSE I/O AND TIMERS  
General Purpose I/O (GPIO) pins are available for system use  
with the DAE-3 and are assignable by choice selection in the  
Audio Canvas III software. The DAE-3 supports pins assignable to  
various hardware features, while the DAE-3HT shares functions  
of some of its available device pins providing feature choices in a  
lower pin-count package.  
FN6787.2  
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D2-926xx  
memory. The boot ROM code is designed to handle both  
encrypted and non-encrypted boot images from any of the boot  
modes shown in Table 2.  
Reset  
D2-926xx has one reset input: the nRESET pin. The nRESET input  
pin (active low, non-reset high) is effectively a power-on system  
reset. All internal state logic is initialized by nRESET. While reset  
is active the system is held in the reset condition which is defined  
as all internal reset signals being active, the crystal oscillator is  
running, and the PLL disabled. At the de-assertion of nRESET, the  
chip will capture the boot mode selection from the IRQ[D:A] pins  
and begin the boot process.  
The specific boot mode is selected based on the state of the  
IRQD, IRQC, IRQB, and IRQA pins at the time of reset  
de-assertion. The mode is selected by a hardware pull-up or  
pull-down connection to each of the four boot mode (IRQ[D:A])  
pins. (Modes not listed are reserved.)  
Control Interfaces  
The nRSTOUT pin is an active low open drain reset output. This  
pin drives low from the internal power-on-reset generator, 3.3V  
brownout detector going active, or from 1.8V brownout detector  
going active. This output should be used to initiate a system  
reset, and to also connect to the nRESET pin to initiate a DAE  
reset upon brownout event detection.  
2
I C 2-WIRE INTERFACE  
2
The D2-926xx family ICs have two separate I C 2-Wire  
compatible ports. Port 1 is used as the external controller  
interface, and Port 0 is used for booting from an external  
2
EEPROMs or compatible chips. Both I C interfaces are  
multi-master capable.  
Booting and Boot Modes  
D2-926xx includes a fully-programmable DSP with internal boot  
ROM. The boot ROM’s primary function is to download a  
second-stage boot image from one of several possible sources.  
SERIAL PERIPHERAL INTERFACE (SPI™)  
The Serial Peripheral Interface (SPI) is provides an alternate boot  
source interface such as an SPI Flash. The SPI port is used only  
for boot operation. Register control of the system firmware is not  
implemented through the SPI interface.  
The system requires external firmware to boot the internal DSP.  
Internal ROM within the DAE-3 initiates the boot process to read  
the boot records and firmware, to load into the internal DAE-3  
TABLE 2. BOOT MODES  
XTALI RANGE INTERFACE SPEED  
MODE IRQ[D:A]  
DAE M/S  
Slave  
Master  
Master  
-
DESCRIPTION  
I C port 1 slave to external master, boot @ address 88  
2
0
1
0000  
0001  
0010  
-
N/A  
24.576MHz  
24.576MHz  
-
per Master  
400kb/s  
1.53MHz  
-
2
2
I C port 0 master to I C EEPROM slave  
SPI port master to SPI Flash slave  
Reserved  
2
3-F  
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D2-926xx  
8. Transmit data lower byte  
Reading and Writing Control Registers  
DAE control is provided through the I C port, using registers and  
2
2
9. I C STOP command  
memory spaces that are defined within the firmware. After  
booting and initialization, this control port provides continuous  
read and write access for control and monitoring of the amplifier  
system. Register addresses are dynamic based on the audio path  
signal flow and hardware options selected for the particular  
project. Address locations are generated for each system through  
a header file from the Audio Canvas III design tool that maps the  
address location to each parameter of the system.  
All reads to registers require two steps. First, the master must  
send a dummy write which consist of sending a Start, followed by  
the device address with the write bit set, and three register  
address bytes. Next, the master must send a repeated Start,  
following with the device address with the read/write bit set to  
read, and then read the next three data bytes. The master must  
Acknowledge (ACK) the first two read bytes and send a Not  
Acknowledge (NACK) on the third byte received and a Stop  
condition to complete the transaction. The device's control  
interface acknowledges each byte by pulling SDA low on the bit  
immediately following each write byte. The device read function,  
2
The I C port is used for reading and writing the control data. The  
highest-order byte of the register address (bits 23:16) determines  
the internal address space used for control read or write access,  
and the remaining 16 bits (bits 15:0) describe the actual address  
within that space.  
2
as shown in Figure 8, executes the following 11 steps as the I C  
bus master:  
2
1. I C START command  
All reads or writes to registers (shown in Figures 7 and 8) begin  
with a Start Condition, followed by the Device Address byte, three  
Register Address bytes, three Data bytes and a Stop Condition.  
2
2. Transmit device I C address with W  
3. Transmit mode byte  
2
Register writes through the I C interface are initiated by setting  
the read/write bit that is within the device address byte. The  
device write function as, shown in Figure 7, executes the  
following 9 steps as the I C bus master:  
4. Transmit upper memory address byte  
5. Transmit lower memory address byte  
6. Repeat START command  
2
2
1. I C START command  
2
7. Transmit device I C address with R  
2
2. Transmit device I C address with W  
8. Receive data upper byte  
9. Receive data middle byte  
10. Receive data lower byte  
3. Transmit mode byte  
4. Transmit upper memory address byte  
5. Transmit lower memory address byte  
6. Transmit data upper byte  
2
11. I C STOP command or NACK  
7. Transmit data middle byte  
ACK  
ACK  
ACK  
DEVICE-ADDR  
REGISTER [23:16]  
REGISTER [15:8]  
REGISTER [7:0]  
START  
R/W  
ACK  
ACK  
ACK  
ACK  
Write Sequence  
REGISTER [7:0]  
DATA [23:16]  
DATA [15:8]  
DATA [7:0]  
STOP  
2
FIGURE 7. I C WRITE SEQUENCE OPERATION  
Step 1  
ACK  
ACK  
ACK  
ACK  
DEVICE-ADDR  
REGISTER [23:16]  
REGISTER [15:8]  
REGISTER [7:0]  
REPEAT  
START  
START  
R/W  
MASTER  
ACK  
MASTER  
ACK  
ACK  
ACK  
NACK  
Read Sequence  
DEVICE-ADDR  
DATA [23:16]  
DATA [15:8]  
DATA [7:0]  
REPEAT  
START  
R/W  
STOP  
Step 2  
2
FIGURE 8. I C READ SEQUENCE OPERATION  
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STEREO A/B SWITCH  
Audio Processing  
The A/B Switch provides stereo routing selection to switching  
either of 2 pairs of stereo inputs to its output. It operates as a  
double-pole, double-throw type of switch to the audio flow.  
Audio processing is totally defined by the system firmware and  
signal flow. Audio processing blocks are implemented using the  
Audio Canvas III design tool software. This tool includes an  
extensive library of audio processing functions that are  
developed for operating in the DAE-3 and DAE-3HT device  
families.  
TONE CONTROL  
Tone Controls are shelving filters providing independent of gain  
and frequency adjustment for bass and treble tone settings.  
Frequency and gain are continuously and independently  
adjustable for both the bass and treble settings, supporting gain  
ranges of -14 to +14 dB.  
The Audio Canvas III software provides the interface to define  
and build a complete audio sound processing system. Drag-and-  
drop inserting of its included audio processing blocks enables  
building a customized signal flow, by placing audio algorithms  
into customized firmware for executing on the DAE devices.  
PARAMETRIC EQUALIZERS  
Parametric Equalizer (EQ) blocks provide an adjustable bandpass  
or band-reject frequency response. With frequency-domain  
parameter settings of frequency, gain, and bandwidth or Q,  
parameters are continuously and independently adjustable. EQs  
are provided as individual audio blocks, and as blocks with  
groups of 3-Band and 5-Band EQs.  
Audio Processing Algorithms  
Audio processing algorithms include all of these following  
functions. Multiples of each are permitted, and there is no limit  
to the order or interconnect of the algorithm blocks. Upon  
completion of defining the audio processing path, the Audio  
Canvas III software incorporates the blocks and builds the final  
system firmware for loading onto and running the DAE devices.  
BIQUAD FILTER (FREQUENCY DOMAIN  
CONFIGURATION)  
Details and equations for each parameter are provided in the  
Audio Canvas III User’s Manual.  
The Biquad block is a frequency-domain-parameter-entry biquad  
filter implemented as a second-order biquad algorithm, providing  
configurable high-pass, low-pass, and all-pass filtering functions.  
First or second filter order may be selected, and parameter  
setting entries of frequency and damping coefficient are  
continuously adjustable. Bypass and polarity phase inversion is  
also supported.  
INPUT SOURCE SELECTION  
A source selection register defines input channel assignment of  
audio presented to the DAE device’s audio input ports.  
VOLUME  
Volume control blocks provide level and trim adjustments within  
the signal flow. Continuous adjustment through programmable  
gain ranges supports attenuation to -100dB and gain to +24dB. A  
single 24-bit register value provides gain setting and also  
supports selectable audio phase inversion.  
BIQUAD FILTER (Z-DOMAIN CONFIGURATION)  
The z-Domain Biquad is a second order biquad digital algorithm  
that operates from direct entry of z-transform coefficients. The  
filter supports individual user entry coefficients enabling nearly  
any second order filter synthesis per cascadable block.  
SHARED VOLUME  
FILTER - CROSSOVER  
Shared Volume blocks implement multiple channels of level  
attenuation. The number of channels is configurable and a single  
24-bit register value equally controls all channel levels. Volume is  
continuously adjustable from unity gain to -100dB.  
The Crossover Filter blocks provide high-pass or low-pass filtering  
using frequency domain adjustment settings. Blocks are  
implemented from 2 cascaded second-order biquad elements,  
with selections that directly implement Linkwitz-Riley,  
Butterworth, or Bessel filter presets. Slope setting is adjustable  
from 6, 12, 18 or 24dB per octave, frequency and damping  
coefficients are continuously adjustable, and bypass, active or  
mute functions are supported.  
MIXERS  
Mixers provide individually-adjustable inputs that are summed  
together and passed to their output. Each input mixing level is  
controlled with its own 24-bit register that provides continuous  
adjustment from unity gain to -100dB, along with full audio path  
cut-off and optional input phase inversion supporting sum and  
difference mixers. Audio block choices include 2-input, 4-input,  
and configurable N-input mixers accommodating as many inputs  
as desired.  
FIR FILTER  
The FIR filter is a configurable n-tap finite impulse response filter  
implementation. The number of taps and their coefficient values  
are defined in the audio signal flow simply through a user-  
generated list of tap coefficients for the FIR structure.  
ROUTER  
EXCURSION CONTROL  
Routers perform independent channel routing assignment,  
connecting any input to any output. Number of channels is  
configurable with up to 64 inputs and 12 outputs.  
Excursion Control is a specialized algorithm that dynamically  
controls audio based on frequency and level. Excursion Control  
boosts the low frequency response to compensate for physically-  
limited low-frequency capabilities of small loudspeakers and  
subwoofers at low listening levels. As listening levels rise, it  
dynamically adjusts its boost enabling an optimum sub-woofer  
listening experience at all loudness levels.  
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DELAY  
MONO MIXER  
Delay Blocks introduce an adjustable delay of a channel's audio  
data. Buffer size is fully user-configurable, supporting adjustment  
over a range as small as milliseconds, to over 1 second.  
A Mono Mixer is a threshold-gating mixer that routes the sum of  
either or both of its 2 inputs into its output, based on a control  
level input. This threshold-controlled mixing supports processing  
of input audio that may be mono on both Left and Right, or  
containing content on only one of Left or Right. This summed  
audio then passes equally to stereo processing and output  
system channels.  
COMPRESSOR  
Compressors provide threshold-dependent level adjustments,  
implementing dynamic attenuation at configurable rates as the  
control signal level increases. Headroom level is configurable,  
supporting adjustable threshold ranges. Ratio, threshold, and  
attack/release times are also fully adjustable. Compressors  
incorporate a side chain input for algorithm control, supporting  
compressing or limiting operation from inputs independent of  
the processed channel audio signal flow.  
DITHER GENERATOR  
The Dither Block generates a random noise (dither) pattern at a  
shaped-spectrum low level. This noise is available to sum into the  
audio path using a mixer, pushing up low-order bits of low-level  
audio. This process enables improved uniform audio quality  
when digital bit depth truncation is required because of  
interfacing equipment. Audio signal flow data is normally  
processed and output in digital format as 24 bits from the  
channels assigned to the SAI digital outputs.  
COMPRESSOR/EXPANDER  
The Expander Compressor implements dynamic low level signal  
expansion, or an upward compression to audio levels. The  
Expander Compressor implements dynamic low level signal  
expansion for an upward compression to audio levels. Adjustable  
settings include gate threshold and ratio, expansion threshold,  
ratio, and expansion gain limit, and attack and release times.  
HARMONICS GENERATOR  
The Harmonics Generator provides a harmonic spectrum content  
from audio presented to its input. Harmonic order and amplitude  
is programmable, supporting customized audio processing  
features.  
ENVELOPE VOLTAGE CONTROLLED AMPLIFIER  
The Envelope VCA processes its control input to establish an  
amplitude envelope signal representing the audio path input  
level. The Envelope VCA uses its side chain input to establish an  
amplitude envelope of the audio level. Controls are similar to  
that of the Compressor Block.  
SoundSuite™ Processing  
The D2Audio SoundSuite™ audio processing provides a full set of  
enhancements to audio that greatly add to the quality and  
listening experience of sound in wide scopes of consumer  
devices. The SoundSuite algorithms use psycho-acoustic  
processing that create a rich-sounding environment from small  
speakers, and synthesizes the sound and quality equivalent to  
more complex systems. It is especially suited to consumer  
products that include televisions, docking stations, and mini hi-fi  
stereo products. SoundSuite Processing includes:  
REVERB  
The Reverb Block is a 2-channel stereo reverb processor. It  
provides adjustable reverb time and damping settings, and its  
built-in mixer includes adjustments for both dry and wet audio  
levels.  
• D2Audio™ WideSound™  
• D2Audio™ WideSound™ x4  
• D2Audio™ DeepBass™  
• D2Audio™ Mono2Stereo™  
CHIME GENERATOR  
The Chime Generator contains 3 oscillators, each with adjustable  
frequency and gain. When triggered, the oscillators initially  
produce full programmed output levels that then decrease at  
their programmable decay time rate.  
D2Audio™ SoundSuite™ algorithms are completely supported  
with all part numbers of the DAE-3 and DAE-3HT families.  
RMS LEVEL METER  
RMS Meters provide real-time indication of the signal levels  
through the audio processing path. Visible in the Audio Canvas III  
signal flow, they provide continuous level indication. Measured  
data in the meter's registers may also be read by system  
controllers for monitoring levels in a final production system.  
FADE-PAN  
The Fade-Pan control provides level adjustment of 4 input  
channels to 4 output channels. Implementation includes a  
Rear/Front fade adjustment, and a Left/Right balance  
adjustment. Controls are continuously adjustable, providing unity  
gain at mid-point settings, and attenuating output levels of its  
channels as the respective control is adjusted away from that  
channel's direction.  
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D2-926xx  
AM radio station, reducing possible station interference. The  
algorithm is optional and selection is controlled through a  
register setting that is created with the system firmware.  
Third Party Virtualization and Enhancements  
Enhancement processing and virtualization algorithms from  
third-party technology providers are available to add to Audio  
Canvas III. As permitted through license agreements from the  
providers, these algorithms are supplied to the designer where  
they integrate into the Audio Canvas III software, and appear as  
additional audio block choices.  
MCLK CLOCK OUTPUT  
2
The MCLK output provides the I S clock to external digital audio  
circuits or devices. The MCLK output is optional, and when  
enables is selectable between 2 frequencies.  
Depending on device part number and design-specific firmware  
definitions, the DAE-3 device supports a variety of processing,  
decoding, virtualization, and pre/post processing feature sets.  
Features and processing support is shown in Table 1 on page 3.  
PSSYNC CLOCK OUTPUT  
The PSSYNC signal is used for synchronizing switching power  
converters used in the amplifier. Providing a synchronizing  
frequency that is a multiple or sub-multiple of the PWM switching  
rate eliminates possibility of in-band audio frequency generation  
from close but asynchronous clocks. The output is optional, and  
when enabled supports 6 frequency multiple choices.  
Audio Processing Block Controls  
Each audio processing block is assigned its own registers  
providing adjustment controls for the parameters associated  
with its audio function. Some blocks use one register only, while  
other blocks with multiple control settings may use multiple  
registers for each control. The parameter equations for all of the  
audio blocks are provided in the Audio Canvas III User’s Manual.  
AUDIO I/O CONFIGURATION  
This configuration allow choice selection of which audio  
processing channels are assigned to the S/PDIF and I S digital  
2
outputs. It also supports choice of input port assignments to the  
audio input channels.  
Dynamic Register Addressing Architecture  
Audio Canvas III supports building of any signal flow with no  
restriction of the order of occurrence of any audio block, or any  
limit to repeated deleting or addition during signal flow editing.  
As audio algorithm blocks are edited, added, or removed, the  
user-space memory addresses for each register will change.  
However, each instance of each block has its own unique label  
identifier where that identifier is clearly known and visible on the  
signal flow workspace.  
FAULT INDICATION  
An optional output may be assigned to provide a control signal to  
a system controller or other hardware within the amplifier upon  
detection of protection or fault conditions. The feature may be  
enabled or disabled, and when enabled, allows choosing an  
available I/O pin for providing this output.  
DECODER SELECTION  
Because each and every algorithm is assigned its own dedicated  
register for its parameter settings, the Audio Canvas III generates  
a variable-to-address mapping for each build of each project. This  
mapping is provided as a text file in a header file format that can  
be directly included within a system controller’s software build.  
As multiple iterations of a signal flow are created during the  
design process, a new header file is created matching each  
revision. Simply including the header file within the system  
controller compile automatically passes these new register  
addresses without need for repeated system code editing.  
Third party decoding of compressed formats is supported based  
on the particular device part number. By default, when a device is  
used that supports the licensed technology, its supported  
decoding is enabled. Choices allow building of firmware to  
selectively include or exclude the available decoding algorithms.  
FORMAT CHANGE NOTIFICATION  
The Format Change Notification feature allow assigning an I/O  
pin to provide hardware indication when a change of decoded  
format types is detected. This supports dynamic audio path  
allocation by the system controller when audio content changes  
to or from PCM and an encoded format. The feature is disabled  
by default, but when enabled, allows assignment of the I/O pin to  
signal this state. An additional setting allows choosing an audio  
muting time delay between format changes.  
Hardware Feature Functions  
In addition to the core firmware that runs the DAE devices to  
operate the amplifier, several feature-specific options are  
supported for use in the amplifier system. These optional  
features are configurable and may be chosen or bypassed.  
Configuration is set using the Audio Canvas III software, where  
based on chosen settings, the firmware will include each function  
along with the hardware I/O assigned to its function.  
IDLE POWER MANAGEMENT  
The Idle Power Management feature allows controlled audio  
PWM output shutdown after a time period has elapsed with no  
audio detected above a threshold level. The feature is disabled by  
default and when enabled allows choice of threshold time and  
signal level, and assignment of an I/O pin that can be used to  
signal other operations in the amplifier.  
The DAE-3 supports pins assignable to various hardware  
features, while the DAE-3HT shares choices between functions  
with some of its available pins providing feature choices in a  
lower pin-count package.  
These hardware feature algorithms include:  
AM AVOIDANCE MODE  
AM Avoidance Mode allows selecting the PWM switching  
frequency to move its harmonics away from the frequency of an  
FN6787.2  
July 12, 2012  
32  
D2-926xx  
MASTER VOLUME ENCODER  
The Master Volume Encoder fe a tu er allows assigning of I/O  
pins to a quadrature-type encoder that can be used as a  
mechanical volume control. The fe a tu er is disabled by default,  
but when enabled allows choice of volume control algorithm  
association in the audio signal flow, and choice of the I/O pins.  
PWM OUTPUT CONFIGURATION  
The PWM Output Configuration functions support assignment of  
PWM output pins to each of the 12 PWM engines. It allows pin  
polarity selection, and choice of enabling or disabling each PWM  
engine.  
PWM OUTPUT TIMING  
The PWM Output Timing controls enable per-channel adjustment  
of each PWM output timing. Controls included dead time,  
minimum pulse width, and stagger settings between channels.  
POWER DOWN OUTPUT  
The Power Down Output feature supports setting an output pin  
that can connect to power stages, for manually shutting down  
power stages during fault detection and system startup. When  
enabled, the algorithm supports specification entry of the I/O pin  
to be used for the function.  
TEMPERATURE SENSING  
A thermal protection algorithm supports use of NTC resistors  
placed in heat-sensitive areas of the amplifier. The algorithms  
run and provide real-time temperature measurement.  
Temperature values are available in firmware registers for  
reading by a system controller, and set-points in the algorithm  
can be used to trigger a controlled-attenuation level reduction or  
fault shutdown.  
THERMAL MANAGEMENT  
An additional thermal protection algorithm supports a high  
temperature warning input to trigger controlled-attenuation level  
reduction. Rate of change and delay are programmable when the  
feature is enabled.  
FN6787.2  
July 12, 2012  
33  
D2-926xx  
Pin Function Mapping Between Devices  
Table 3 lists the pin numbers, names and functions for both the  
DAE-3 and DAE-3HT devices, and provides a mapping of the pin  
functions between those devices.  
DAE-3 And DAE-3HT Differences  
The DAE-3 device family includes both the DAE-3 and DAE-3HT.  
Functional specifications are identical to both designations of  
this family. However, the DAE-3HT, provided in its smaller 72-pin  
package supports system and assignable functions that are  
mapped to the pins supported in that package. Complete pin  
functions of all pins of both devices of the DAE-3 family are listed  
in the Pin Description Tables.  
TABLE 3. DAE-3 AND DAE-3HT PIN AND I/O COMPARISON TABLE  
PIN NUMBERS  
PIN NAMES  
DESCRIPTION AND FUNCTION  
DAE-3 DAE-3HT  
DAE-3  
DAE-3HT  
DAE-3  
DAE-3HT  
2
2
1
1
SC20  
SRD2  
SC21  
SCK2  
STD2  
SC22  
SCK3  
STD3  
SC32  
SRD3  
SDA1  
SCL1  
SCK1  
TIO0  
SCLK3  
(SC20)  
I S Input Port 1 SCLK  
I S Port 3 Input Channels 5-6 SCLK  
2
2
2
2
SDIN3  
(SRD2)  
I S Data Port 1, Input Channels 1-2  
I S Port 3 Input Channels 5-6 Audio Input Data  
2
2
3
3
LRCK3  
(SC21)  
I S Input Port 1 LRCK  
I S Port 3 Input Channels 5-6 LRCK  
2
2
4
4
SCLK4  
(SCK2)  
I S Input Port 2 SCLK  
I S Port 4 Input Channels 7-8, or Output Channels  
1-2 SCLK  
2
2
5
5
SDIO4  
(STD2)  
I S Data Port 2, Input Channels 3-4  
I S Port 4 Input Channels 7-8, or Output Channels  
1-2 Audio Data  
2
2
6
6
LRCK4  
(SC22)  
I S Input Port 2 LRCK  
I S Port 4 Input Channels 7-8, or Output Channels  
1-2 LRCK  
2
2
8
7
SCLK12 I S Input Port 3 SCLK  
(SCK3)  
I S Ports 1&2 Input Channels 1-4 SCLK  
2
2
9
8
SDIN2  
(STD3)  
I S Data Port 4, Input Channels 7-8  
I S Port 2 Input Channels 3-4 Audio Data  
2
2
10  
13  
36  
37  
119  
123  
127  
128  
27  
125  
124  
65  
9
LRCK12 I S Input Port 4 LRCK  
(SC32)  
I S Ports 1&2 Input Channels 1-4 LRCK  
2
2
10  
19  
20  
65  
68  
71  
72  
16  
70  
69  
37  
SDIN1  
(SRD3)  
I S Data Port 3, Input Channels 5-6  
I S Port 1 Input Channels 1-2 Audio Data  
SDA1  
2-Wire (I2C) Data Port (Controller Port)  
2-Wire (I2C) Clock Port (Controller Port)  
2-Wire (I2C) Data Port (Controller Port)  
2-Wire (I2C) Clock Port (Controller Port)  
Assignable GPIO or MCLK Output  
SCL1  
2
SCK1  
/MCLK  
I S Output Port SCLK  
TIO0  
/PSSYNC  
Timer I/O port 0.  
Timer I/O port 0, or Assignable Power Supply Sync  
Output  
SDA0  
SCL0  
TIO1  
SDA0  
/TEMPREF  
2-Wire (I2C) Data Port  
Assignable I/O, NTC Temp Sense Reference  
Assignable I/O, NTC Temp Sense NTC  
Assignable I/O, NTC Temp Sense Common  
PWM Channel 0 Protect Input  
SCL0  
/TEMPNTC  
2-Wire (I2C) Clock Port  
TIO1  
/NTC  
Timer I/O port 1, NTC Temp Sense Common  
PROTECT0 PROTECT0 PWM Channel 0 Protect Input  
PROTECT1 PROTECT1 PWM Channel 1 Protect Input  
PROTECT2 PROTECT2 PWM Channel 2 Protect Input  
PWM Channel 1 Protect Input  
PWM Channel 2 Protect Input  
FN6787.2  
July 12, 2012  
34  
D2-926xx  
TABLE 3. DAE-3 AND DAE-3HT PIN AND I/O COMPARISON TABLE (Continued)  
PIN NUMBERS  
PIN NAMES  
DAE-3 DAE-3HT  
DESCRIPTION AND FUNCTION  
DAE-3 DAE-3HT  
DAE-3  
DAE-3HT  
60  
61  
62  
63  
64  
95  
32  
33  
34  
35  
36  
54  
PROTECT3 PROTECT3 PWM Channel 3 Protect Input  
PROTECT4 PROTECT4 PWM Channel 4 Protect Input  
PROTECT5 PROTECT5 PWM Channel 5 Protect Input  
PWM Channel 3 Protect Input  
PWM Channel 4 Protect Input  
PWM Channel 5 Protect Input  
PROTECT6 PROTECT6 PWM Channel 6 Protect Input  
/nMUTE  
Assignable PWM Protect Input, or Mute Output  
PROTECT7 PROTECT7 PWM Channel 7 Protect Input  
/nOVRT  
Assignable PWM Protect Input, or Over-  
Temperature Monitor Input  
PWM0  
PWM0  
PWM output pin. (One of 18 PWM output pins.  
Channel and operation assignment is defined by  
firmware.)  
PWM output pin. (One of 12 PWM output pins.  
Channel and operation assignment is defined by  
firmware.)  
I/O Pin Function Assignment Comparison  
Pin I/O functions and their assignments are supported through  
user selections of the Audio Canvas III software that builds the  
DAE-3 or DAE-3HT firmware. The designer has the option of  
choosing the offered features and allocating I/O pins to those  
features based on individual system design needs.  
MCLK  
• The DAE-3 utilizes a dedicated pin for the MCLK output. That  
pin is available only for MCLK. User selection determines if  
MCLK is present on this pin or if its output is off.  
• The DAE-3HT provides a user selection to choose whether to  
enable the MCLK output. This pin (the SCK1/MCLK pin)  
becomes assigned to MCLK when MCLK is enabled. When  
MCLK is disabled, the SDK1/MCLK pin becomes available for  
assignment to other hardware I/O functions.  
The differences of pin functions are shown in the preceding table,  
but the following provides additional detail to certain of these  
pins and functions as to their available features and assignment.  
PWM OUTPUT PINS  
PROTECTION INPUT PINS  
• The DAE-3 has 18 PWM pins that are assignable to any of the  
DAE-3’s 12 PWM channels.  
• The DAE-3 provides 9 protect input pins, where the first 8 are  
allocated to the first 8 PWM engines. The last of the 9 is a  
dedicated input for monitoring an over-temperature warning  
control signal from power stages or other monitoring switches.  
• The DAE-3HT has 12 PWM pins that are assignable to any of  
the DAE-3’s 12 PWM channels.  
2
I S DIGITAL INPUTS AND OUTPUTS  
• The DAE-3HT provides 8 protect input pins. These pins are all  
assignable to be used as the protect input for their default  
PWM engine, or when not used for that protection become  
available for use with other pin-assignable hardware I/O  
functions. All selection is established through the user  
interface of the Audio Canvas III design tool program.  
2
• The DAE-3 supports 8 audio INPUT channels through 4 I S  
serial digital audio input ports. Port assignments are  
established with the firmware built with the Audio Canvas III  
software for the DAE-3 devices.  
2
• The DAE-3 supports 8 audio OUTPUT channels through 4 I S  
serial digital audio output ports. Port and channel assignments  
are established through user selection with the firmware built  
with the Audio Canvas III software for the DAE-3 devices.  
• The DAE-3HT supports a user choice of either:  
2
- 8 audio INPUT channels through 4 I S serial digital audio  
2
input ports, and no I S OUTPUTS, or  
2
2
- 6 INPUT channels through 3 I S ports with 1 I S OUTPUT  
supporting 2 audio channels.  
FN6787.2  
July 12, 2012  
35  
D2-926xx  
Revision History  
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make  
sure you have the latest Rev.  
DATE  
REVISION  
FN6787.2  
CHANGE  
July 3, 2012  
Complete datasheet rewrite to add DAE-3HT devices to the DAE-3 family.  
- Revisions and additions to accommodate additions for DAE-3HT to DAE-3/DAE-3HT family.  
- Complete rewrite of page 1 description and features, and complete rewrite of all functional description content.  
(Rewrites do not change function of DAE-3 devices, but provide more accurate explanation of device use.)  
- No changes to DAE-3 specifications other than: Addition and revision of ADC specifications and updates of  
supporting detail for ADC. All other DAE-3 specifications unless noted by DAE-3HT specific designations are  
identical to those of DAE-3.  
- Updates to DAE-3 high-level and detail block diagrams, and addition of diagrams for DAE-3HT.  
- Removal of ADC and DSD plots.  
- Removal of all HDA interface, HDMI interface, DSD, and SCI references and descriptions.  
- Removal of D2-92613-LR and D2-92625-LR part numbers which are being discontinued. (Their features are  
fully supported in the D2-92633-LR part number and the removed part numbers are not needed.)  
POD Q128.14x14 updated to latest revision - Changed title from “Thin Plastic Quad Flatpack Package (LQFP)”  
to “Low Plastic Quad Flatpack Package (LQFP)”  
POD L72.10x10F updated to latest revision - Changed bottom view to reflect correct pin 1 corner and pin  
numbering. Also cleaned up details Y & Z  
May 3, 2011  
FN6787.1  
Rewrite of datasheet. Fixes to incorrect (pin 109) connection description, removal of unnecessary descriptive  
content and structure.  
-Updated datasheet to latest corporate document format and applied standards as follows:  
Ordering information added audio processing column, added device support note, numbered notes, lead finish  
matching intrepid.  
Added Tjc to Thermal Information and corresponding note on page 5  
Added Compliance note on page 6 referencing MIN and MAX columns of Electrical Spec Tables  
-Updated Block Diagram on page 1 - complete re-draw.  
-Removed D2-92643 part number from DAE-3 Device Feature Set Offering Table 1 on page 2 (this is not an  
available ordering part number)  
-Corrected pin 109 (nTRST) description error on page 14 to indicate that it must be pulled high at all times.  
(internally-requested error correction). Changed from: "Hardware test mode control. For D2Audio use only. Must  
be tied high or low." To: "Factory test only. Must be tied high at all times."  
-Removed outdated high level system diagrams,  
-Removed all (outdated and non-applicable) reference design examples,  
-Removed unnecessary HDA connection diagrams  
-Removed trademarks section/paragraph. Explicit listing not required/sufficiently covered through other  
means.  
April 1, 2010  
FN6787.0  
Initial Release  
Products  
Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products  
address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks.  
Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a  
complete list of Intersil product families.  
To report errors or suggestions for this datasheet, please go to: www.intersil.com/askourstaff  
For additional products, see www.intersil.com/product_tree  
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted  
in the quality certifications found at www.intersil.com/design/quality  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time  
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be  
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third  
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see www.intersil.com  
FN6787.2  
July 12, 2012  
36  
D2-926xx  
Low Plastic Quad Flatpack Packages (LQFP)  
Q128.14x14  
128 LEAD LOW PLASTIC QUAD FLATPACK PACKAGE .4  
MM PITCH  
4X  
0.2 Y T-U Z  
D
MILLIMETERS  
PIN 1  
97  
128  
Z
SYMBOL  
MIN  
-
NOM  
MAX  
1.60  
0.15  
1.45  
0.23  
0.19  
0.20  
0.16  
NOTES  
A
A1  
A2  
b
-
1
96  
0.05  
1.35  
0.13  
0.13  
0.09  
0.09  
-
1.40  
-
0.16  
4
b1  
c
-
-
-
-
U
T
c1  
D
-
16 BSC  
14 BSC  
16 BSC  
14 BSC  
0.60  
-
E
E1  
-
D1  
E
3
-
E1  
L
3
0.45  
0.75  
-
65  
32  
L1  
R1  
R2  
S
1.00 REF  
-
-
0.08  
0.08  
0.20  
0°  
-
0.20  
-
-
33  
64  
-
-
-
-
D1  
0.2 H T-U Z  
0
3.5°  
7°  
-
4X  
01  
02  
03  
N
0°  
-
-
-
11°  
11°  
12°  
13°  
13°  
-
12°  
-
DETAIL  
0.080 Y  
F
128  
-
H
Y
e
0.40 BSC  
-
Rev. 1 7/11  
NOTES:  
128X b  
1. Dimensions are in millimeters. Dimensions in ( ) for Refer-  
ence Only.  
e
124X  
SEATING PLANE  
0.07  
b1  
Y T-U  
c1  
M
2. Dimensions and tolerances per AMSEY14.5M-1994.  
3. Dimensions D1 and E1 are excluding mold protrusion. Al-  
lowable protrusion is 0.25 per side. Dimensions D1 and E1  
are exclusive of mold mismatch and determined by datum  
plane H.  
c
0.05  
b
PLATING  
02  
4. Dimension bdoesnotincludedambarprotrusion. Allowable  
dambar protrusion shall not cause the lead width to exceed  
the maximum b dimension by more than 0.08mm. Dambar  
cannot be located at the lower radius or the foot. Minimum  
space between protrusion and an adjacent lead is 0.07 mm.  
01  
R1  
A2  
A
R2  
0 3  
0
A1  
S
L
0.25 GAUGE  
PLANE  
(L1)  
DETAIL  
F
FN6787.2  
July 12, 2012  
37  
D2-926xx  
Package Outline Drawing  
L72.10x10F  
72 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE  
Rev 1, 4/12  
A
10.00  
6
4X 8.50  
6
PIN 1  
INDEX AREA  
B
PIN 1  
INDEX AREA  
55  
72  
1
54  
68X 0.50  
EXP. DAP  
7.70 SQ.  
10.00  
37  
18  
(4X)  
0.15  
36  
19  
72X 0.25  
4
TOP VIEW  
0.10 M C A B  
SEE DETAIL "Z"  
BOTTOM VIEW  
SEE DETAIL "X"  
0.90 MAX  
C
0.10 C  
0.08 C  
SEATING PLANE  
68X 0.50  
(0.75)  
72X 0.25  
9.80 SQ  
5
C
0 . 2 REF  
37  
7.70 SQ  
(0.40)  
0 . 00 MIN.  
0 . 05 MAX.  
36  
(0.271)  
DETAIL “Y”  
72X 0.60  
DETAIL "Z"  
TYPICAL RECOMMENDED LAND PATTERN  
NOTES:  
1. Dimensions are in millimeters.  
Dimensions in ( ) for Reference Only.  
2. Dimensioning and tolerancing conform to ASME Y14.5m-1994.  
3.  
4.  
Unless otherwise specified, tolerance : Decimal ± 0.05  
Dimension applies to the metallized terminal and is measured  
between 0.15mm and 0.30mm from the terminal tip.  
Tiebar shown (if present) is a non-functional feature.  
5.  
6.  
The configuration of the pin #1 identifier is optional, but must be  
located within the zone indicated. The pin #1 identifier may be  
either a mold or mark feature.  
7. Package outline compliant to JESD-MO220.  
FN6787.2  
July 12, 2012  
38  

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