D2-92634-LR [INTERSIL]
Intelligent Digital Amplifier and Sound Processor;型号: | D2-92634-LR |
厂家: | Intersil |
描述: | Intelligent Digital Amplifier and Sound Processor 外围集成电路 |
文件: | 总38页 (文件大小:888K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Intelligent Digital Amplifier and Sound Processor
D2-926xx
Features
The D2-926xx family of the DAE-3™ and DAE-3HT™ Digital
Audio Engine™ devices are complete System-on Chip (SoC)
multi-channel digital sound processors and Class-D amplifier
controllers.
• Advanced DAE-3™ Digital Audio Engine™ IC Family
- DAE-3™ Pin Compatible and Function/Feature
Compatible with the D2Audio™ DAE-6™ Device Family
- DAE-3HT™ - Identical DAE-3 performance, in
72-QFN package
The integrated DSP provides efficient and configurable audio
signal path processing including equalization, dynamic range
compression, mixing, and filtering that is completely
• Integrated DSP Digital Sound Processing
- Customizable audio path sound processing
configurable via the Audio Canvas™ III high level programming
interface. The integrated PWM engine supports programmable
and dynamic control of audio output, enabling a variety of
multi-channel output configurations and output power
capacity. Internal noise shaping, an embedded asynchronous
sample rate converter, dynamic level-dependent timing, and
high resolution operation supports power stage audio
performances with SNR >110dB and THD+N < 0.01%.
- Fully configurable and routable audio signal paths and
hardware function assignment
- Fully Supported with Audio Canvas™ III Design Tool
• Flexible Audio Input and Output Configurations
- 12 Independent PWM Engine Channels
2
- 4 Independent Asynchronous I S Digital Inputs
- Integrated high-performance stereo ADC (DAE-3 only)
The D2-926xx devices are provided in two package and feature
configurations which include the 128-pin DAE-3, and the72-pin
DAE-3HT. Both the DAE-3 and DAE-3HT provide identical
performance and enable an extremely flexible platform for
feature rich and cost-affordable quality audio solutions, which
benefit from the addition of Class-D amplifiers and DSP audio
processing.
- S/PDIF™ Digital Audio Inputs supporting
Linear IEC-61958 PCM or Compressed IEC-61937 Audio
- S/PDIF Digital Audio PCM Output
• Embedded 8-Channel Sample Rate Converter
• Real-Time Amplifier Control and Monitoring
- Supports Bridged, Half-Bridged, and Bridge-Tied Load (BTL)
Topologies, Using Discrete or Integrated Power Stages
The 12 integrated digital PWM controllers can be used in a
variety of multi-channel audio system configurations,
supporting powered as well as line outputs. Fully protected
amplifier control provides efficient and clean Class-D power
output support.
- Complete Fault Protection with Automatic Recovery
• D2Audio™ SoundSuite™ Enhancement and Virtualization
• Enhanced Audio Processing Decoders And Virtualization
- Dolby® Digital/AC3
- Dolby® Pro Logic IIx
Applications
• DTV and Blu-ray Soundbar
- Dolby® Virtual Speaker
• DVD and Blu-ray Home Theater Systems
• Home Theater in a Box (HTiB)
• Audio Video Receiver (AVR)
- SRS TruSurround HD4™ , SRS WOW HD™,
SRS TruVolume™
• Multi-Channel Multi-Media (MM) Systems
• Multi-Room Distributed Audio (MRDA)
• Powered Speaker Systems
• Automotive Trunk/Amplified Solutions
July 12, 2012
FN6787.2
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2010 - 2012. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
1
Dolby is a registered trademark of Dolby Laboratories. All other trademarks mentioned are the property of their respective owners.
D2-926xx
Ordering Information
PART
NUMBER
(Note 2)
AUDIO PROCESSING
FEATURE SET SUPPORT
(Note 1)
DAE DEVICE
FAMILY
PART
MARKING
TEMP. RANGE
(°C)
PACKAGE
(Pb-Free)
PKG.
DWG. #
D2-92633-LR
D2-92634-LR
D2-92683-QR
D2-92684-QR
DAE-3
DAE-3
D2-92633-LR
D2-92634-LR
D2-92683-QR
D2-92684-QR
Refer to Table 1
Refer to Table 1
Refer to Table 1
Refer to Table 1
-10 to +85
-10 to +85
-10 to +85
-10 to +85
128 Ld LQFP
128 Ld LQFP
72 Ld QFN
Q128.14x14
Q128.14x14
L72.10x10F
L72.10x10F
DAE-3HT
DAE-3HT
72 Ld QFN
NOTES:
1. The D2-926xx devices support multiple audio processing algorithms and decoders, and support is device-dependent. Refer to Table 1 for the
supported features for each device part number.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
FN6787.2
July 12, 2012
2
D2-926xx
DAE-3 Device Feature Set Offering
The D2-926xx family has specific part numbers to specify the features and algorithms supported in the device. All devices of the DAE-3
family include 8 audio input processing channels, up to 12 PWM output channels, an embedded 8-channel Sample Rate Converter
(SRC), and are fully supported with the Audio Canvas III™ design tool software. Additional features within each DAE-3 family part
number are shown in Table 1.
TABLE 1. DAE-3 DEVICE PART NUMBERS AND FEATURES
PART NUMBER
D2-92633-LR
DAE FAMILY
DAE-3
FEATURES
8 Channels of I S or Left Justified Serial Digital Audio Inputs
LICENSED ALGORITHM SUPPORT (Note 3)
2
D2Audio™ SoundSuite™
SRS TruSurround HD4™,
SRS WOWHD4™,
2
128-Pin Package 8 Channels of I S or Left Justified Serial Digital Audio Outputs
2 S/PDIF Digital Inputs
1 S/PDIF Digital Output
SRS TruVolume™
2 ADC Analog Audio Inputs
2
®
D2-92634-LR
D2-92683-QR
D2-92684-QR
DAE-3
8 Channels of I S or Left Justified Serial Digital Audio Inputs
Dolby Digital/AC3 Decode Processing
2
®
128-Pin Package 8 Channels of I S or Left Justified Serial Digital Audio Outputs
2 S/PDIF Digital Inputs
Dolby Pro Logic IIx Surround Processing
®
Dolby Virtual Speaker Processing
1 S/PDIF Digital Output
2 ADC Analog Audio Inputs
2
2
DAE-3HT
8 Channels of I S or Left Justified Serial Digital Audio Inputs, or
D2Audio™ SoundSuite™
72-Pin Package 6 Channels of I S or Left Justified Serial Digital Audio Inputs plus SRS TruSurround HD4™,
2
2 Channels of I S or Left Justified Serial Digital Audio Outputs
1 S/PDIF Digital Input
SRS WOWHD4™,
SRS TruVolume™
1 S/PDIF Digital Output
2
®
DAE-3HT
8 Channels of I S or Left Justified Serial Digital Audio Inputs, or 6 Dolby Digital/AC3 Decode Processing
2
®
72-Pin Package Channels of I S or Left Justified Serial Digital Audio Inputs plus 2 Dolby Pro Logic IIx Surround Processing
2
®
Channels of I S or Left Justified Serial Digital Audio Outputs
Dolby Virtual Speaker Processing
1 S/PDIF Digital Input
1 S/PDIF Digital Output
NOTE:
3. All DAE-3 family devices support D2Audio™ SoundSuite™ Audio Processing algorithms, and with license agreements executed with SRS Labs, also
support SRS TruSurround HD4™, SRS WOW HD™, and SRS TruVolume™
Device Designations
This datasheet applies to all of the DAE-3 device family, which includes both the DAE-3 and DAE-3HT. Functional specifications apply to
both designations of this family unless otherwise indicated.
Throughout this document the device names apply to all part numbers of their respective names as follows:
DAE DEVICE NAME
DAE-3
DAE DEVICE PART NUMBERS
D2-92633-LR, D2-92634-LR
D2-92683-QR, D2-92684-QR
PACKAGE PINS
128-Pin Package
72-Pin Package
DAE-3HT
FN6787.2
July 12, 2012
3
D2-926xx
Table of Contents
DAE-3 Device Feature Set Offering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Device Designations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Thermal Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Recommended Operating Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Serial Audio Interface Port Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2
Two-Wire (I C) Interface Port Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
SPI™ Interface Port Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Pin Configuration DAE-3 (128-Pin Package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Pin Configuration DAE-3HT (72-Pin Package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Pin Description, DAE-3 (128-Pin). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Pin Description DAE-3HT (72-Pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Functional Block Diagram - DAE-3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Functional Block Diagram - DAE-3HT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
DAE-3 Device Designations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Audio Canvas III Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
DSP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Sample Rate Converters (SRC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Serial Digital Audio Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Serial Digital Audio Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Serial Digital Audio Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
S/PDIF Digital Audio Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
S/PDIF Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
S/PDIF Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
ADC input (DAE-3 Devices Only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
PWM Audio Amplifier Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
Amplifier Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Graceful Overcurrent And Short Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Thermal Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Hardware I/O Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
General-purpose I/O And Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Power Supply Synchronization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Clocks And PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Reset and Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Power Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Booting and Boot Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Control Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
2
I C 2-Wire Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Serial Peripheral Interface (SPI™) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Reading and Writing Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
Audio Processing Algorithms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
Input Source Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Volume . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Shared Volume . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Mixers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Router . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Stereo A/B Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Tone Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
FN6787.2
July 12, 2012
4
D2-926xx
Parametric Equalizers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Biquad Filter (Frequency Domain Configuration) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Biquad Filter (z-Domain Configuration) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Filter - Crossover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
FIR Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Excursion Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Delay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Compressor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Compressor/Expander . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Envelope Voltage Controlled Amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Reverb . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Chime Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
RMS Level Meter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Fade-Pan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Mono Mixer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Dither Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Harmonics Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
SoundSuite™ Processing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
Third Party Virtualization and Enhancements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Audio Processing Block Controls . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Dynamic Register Addressing Architecture. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Hardware Feature Functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
AM Avoidance Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
MCLK Clock Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
PSSYNC Clock Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Audio I/O Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Fault Indication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Decoder Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Format Change Notification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Idle Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Master Volume Encoder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
PWM Output Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
PWM Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Power Down Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Temperature Sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Thermal Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
DAE-3 And DAE-3HT Differences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Pin Function Mapping Between Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
I/O Pin Function Assignment Comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
PWM Output Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
I2S Digital Inputs And Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
MCLK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Protection Input Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Q128.14x14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
L72.10x10F . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
FN6787.2
July 12, 2012
5
D2-926xx
Absolute Maximum Ratings (Note 8)
Thermal Information
Supply Voltage
Thermal Resistance (Typical)
128 Ld LQFP Package (Notes 4, 6) . . . . . .
72 Ld QFN Package (Notes 5, 7) . . . . . . . .
Maximum Storage Temperature. . . . . . . . . . . . . . . . . . . . -55°C to +150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
θ
(°C/W)
39
22
θ
(°C/W)
6.5
0.80
JA
JC
RVDD, PWMVDD, ADCVDD . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 4.0V
CVDD, PLLVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 2.4V
Input Voltage
Any Input but XTALI . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3V to RVDD +0.3V
XTALI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to PLLVDD +0.3V
Input Current, Any Pin but Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . ±10mA
ESD Rating
Human Body Model (Tested per JESD22-A114F) . . . . . . . . . . . . . . 2000V
Machine Model (Tested per JESD22-A115C) . . . . . . . . . . . . . . . . . 200V
Charged Device Model (Tested per JESD22-C101E). . . . . . . . . . . . . 750V
Latch-up
(Pins 2, 4, 6, 7, 8, 9, 37 (72 Ld Package only) Tested per JESD78D
Class II, Level B) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA
(All Other pins Tested per JESD78D Class II, Level A) . . . . . . . . . 100mA
Recommended Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-10°C to +85°C
Digital I/O Supply Voltage, PWMVDD . . . . . . . . . . . . . . . . . . . . . . . . . . .3.3V
Core Supply Voltage, CVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.8V
Analog Supply Voltage, PLLVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.8V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
4. θ is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
JA
5. θ is measured with the component mounted on a high effective thermal conductivity test board with direct attach of exposed pad to PCB.
JA
6. For θ , the “case temp” location is taken at the package top center.
JC
7. For θ , the “case temp” is measured on bottom of exposed pad.
JC
8. Absolute Maximum parameters are not tested in production.
Electrical Specifications
T = +25°C, CVDD = PLLVDD = 1.8V ±5%, RVDD = PWMVDD = 3.3V ±10%. All grounds at 0.0V. All voltages
A
referenced to ground. PLL at 294.912MHz, OSC at 24.576MHz, core running at 147.456MHz with typical audio data traffic. Minimum supply currents are
measured in full power down configuration.
TEST
MIN
MAX
SYMBOL
PARAMETER
Digital Input High Logic Level (Note 9)
Digital Input Low Logic Level (Note 9)
High Level Output Drive Voltage
CONDITIONS
(Note 12)
TYP
(Note 12)
UNIT
V
Relative to RVDD
Relative to RVDD
2.0
-
-
-
-
0.8
-
V
V
V
IH
V
-
IL
V
RVDD - 0.4
OH
I
at - Pin Drive Strength Current. See “Pin Description, DAE-3 (128-
OUT
Pin)” on page 13, and “Pin Description DAE-3HT (72-Pin)” on page 18
V
Low Level Output Drive Voltage
-
-
0.4
V
OL
I
at + Pin Drive Strength Current. See “Pin Description, DAE-3 (128-
OUT
Pin)” on page 13, and “Pin Description DAE-3HT (72-Pin)” on page 18
High Level Input Drive Voltage XTALI Pin
Low Level Input Drive Voltage XTALI Pin
Input Leakage Current (Note 10)
VIHX
VILX
0.7
-
-
PLLVDD
V
V
-
0.3
I
-
-
±10
µA
pF
V
IN
C
Input Capacitance
-
9
-
IN
VOHO
VOLO
High Level Output Drive Voltage OSCOUT Pin
Low Level Output Drive Voltage OSCOUT Pin
Output Capacitance
PLLVDD - 0.3
-
-
-
-
0.3
V
C
-
9
-
pF
ns
V
OUT
t
nRESET Pulse Width
-
10
3.3
10
<1
3.3
5
-
RST
R
Typical Digital I/O Pad Ring Supply
(Voltage)
(Current, Active)
(Current, Power-down)
(Voltage)
3.0
3.6
VDD
-
-
mA
mA
V
-
-
PWM
VDD
Typical PWM I/O Pad Ring Supply
3.0
3.6
(Current, Active)
(Current, Power-down)
-
-
-
-
mA
mA
<1
FN6787.2
July 12, 2012
6
D2-926xx
Electrical Specifications
T
= +25°C, CVDD = PLLVDD = 1.8V ±5%, RVDD = PWMVDD = 3.3V ±10%. All grounds at 0.0V. All voltages
A
referenced to ground. PLL at 294.912MHz, OSC at 24.576MHz, core running at 147.456MHz with typical audio data traffic. Minimum supply currents are
measured in full power down configuration. (Continued)
TEST
MIN
MAX
SYMBOL
CVDD
PARAMETER
CONDITIONS
(Note 12)
TYP
1.8
300
15
(Note 12)
UNIT
V
Typical Core Supply
(Voltage)
(Current, Active)
(Current, Power-down)
(Voltage)
1.7
1.9
-
-
mA
mA
V
-
-
PLLVDD Typical PLL Analog Supply
1.7
1.8
25
1.9
(Current, Active)
(Current, Power-down)
(Voltage)
-
-
mA
mA
V
-
3.0
-
10
-
3.6
-
ADCVDD Typical ADC Analog Supply
CRYSTAL OSCILLATOR
3.3
12
(Current, Active, Power-Down)
mA
Xo
Crystal Frequency (Fundamental Mode Crystal)
20
24.576
24.822
MHz
(24.576 + 1%)
Dt
Duty Cycle
40
-
-
60
20
%
t
Start-up Time (Start-up Time is Oscillator Enabled
(with Valid Supply) to Stable Oscillation)
5
ms
START
PLL
F
VCO Frequency
80.00
20
294.912
-
297.86
MHz
MHz
VCO
F
Input Reference Frequency
24.822
IN
(24.576 + 1%)
Feedback Dividers (Integer)
4
-
12
2
15
-
PLL Lock Time from any Input Change
ms
1.8V POWER-ON RESET
V
Reset Enabled Voltage Level
0.9
1.1
150
5
1.4
500
-
V
EN
t
POR Pulse Width Rejection (Note 12)
POR Minimum Output Pulse Width
-
-
µs
µs
REJ
t
DIS
1.8V BROWNOUT DETECTION
Detect Level
1.4
20
1.5
100
-
1.6
V
t
Pulse Width Rejection
-
-
ns
ns
BOD1
t
Minimum Output Pulse Width
O1
3.3V BROWNOUT DETECTION
Detect Level
2.5
20
2.7
100
-
2.9
V
t
Pulse Width Rejection
-
-
ns
ns
BOD3
t
Minimum Output Pulse Width
O3
ADC PERFORMANCE SPECIFICATIONS (DAE-3 only)
V
ADCREF DC Level
1.3
-
1.4
1.5
V
µA
V
REF
I
ADCREF Load Current
Analog Input Level
-
-
±20
REF
V
V
- 0.6
V
+ 0.6
REF
AIN
REF
ADC Dynamic Range & SNR (Note 13)
1.0 V
1kHz
-
94
-
dB
P-P
(ADC + ADC Decimator performance only, DSP inactive, no digital sine wave input
audio processing, PWM outputs off, no pPWM switching)
reference level,
using firmware
from Audio
Canvas III™ rev
3.1.4 or newer.
ADC Dynamic Range & SNR (Note 13)
-
83
-
dB
(DSP active and processing audio data, PWM active and driving
audio outputs, measurements using typical system-level amplifier
equivalent as measurement environment)
FN6787.2
July 12, 2012
7
D2-926xx
Electrical Specifications
T
= +25°C, CVDD = PLLVDD = 1.8V ±5%, RVDD = PWMVDD = 3.3V ±10%. All grounds at 0.0V. All voltages
A
referenced to ground. PLL at 294.912MHz, OSC at 24.576MHz, core running at 147.456MHz with typical audio data traffic. Minimum supply currents are
measured in full power down configuration. (Continued)
TEST
MIN
MAX
SYMBOL
PARAMETER
CONDITIONS
(Note 12)
TYP
-80
0.1
-80
-70
(Note 12)
UNIT
dB
THD+N
-
-
-
-
-
-
-
-
Gain Mismatch
Crosstalk
dB
dB
Power Supply Rejection
dB
NOTES:
9. All input pins except XTALI.
10. Input leakage applies to all pins except XTALO.
11. Power-down is with device in reset and clocks stopped.
12. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design.
13. Analog performance is system-design dependent and is affected by factors that include PCB layout, shielding and routing of analog traces, additional
components within the analog input path, and power supply isolation.
Serial Audio Interface Port Timing (Figure 1) T = +25°C, CVDD = PLLVDD = 1.8V ±5%, RVDD = PWMVDD = 3.3V ±10%. All
A
grounds at 0.0V. All voltages referenced to ground.
MIN
MAX
SYMBOL
tc
DESCRIPTION
SCKRx Frequency - SCKR0, SCKR1
(Note 12)
TYP
(Note 12)
UNIT
MHz
ns
12.5
SCLK
tw
SCKRx Pulse Width (High and Low) - SCKR0, SCKR1
LRCKRx Setup to SCLK Rising - LRCKR0, LRCKR1
LRCKRx Hold from SCLK Rising - LRCKR0, LRCKR1
SDINx Setup to SCLK Rising - SDIN0, SDIN1
SDINx Hold from SCLK Rising - SDIN0, SDIN1
SDOUTx Delay from SCLK Falling
40
20
20
20
20
SCLK
LRCLK
LRCLK
ts
ns
th
ns
ts
SDI
ns
th
SDI
ns
t
20
ns
dSDO
t SCLK
t SCLK
w
c
SCKRx
t LRCLK
t
SCLK
h
w
LRCLKRx
t LRCLK
t SDI
s
s
SDINx
t SDI
t SDO
h
d
SDOUTx
FIGURE 1. SERIAL AUDIO INTERFACE PORT TIMING
FN6787.2
July 12, 2012
8
D2-926xx
2
Two-Wire (I C) Interface Port Timing (Figure 2) T = +25°C, CVDD = PLLVDD = 1.8V ±5%, RVDD = PWMVDD = 3.3V ±10%. All
A
grounds at 0.0V. All voltages referenced to ground.
MIN
MAX
SYMBOL
DESCRIPTION
(Note 12)
(Note 12)
UNIT
kHz
µs
f
SCL Frequency
100
SCL
t
Bus Free Time Between Transmissions
SCL Clock Low
4.7
4.7
4.0
4.7
4.0
0
buf
tw
µs
lowSCLx
tw
SCL Clock High
µs
highSCLx
ts
Setup Time For a (Repeated) Start
Start Condition Hold Time
µs
STA
th
µs
STA
th
SDA Hold From SCL Falling (Note 14)
SDA Setup Time to SCL Rising
SDA Output Delay Time From SCL Falling
Rise Time of Both SDA and SCL
Fall Time of Both SDA and SCL
Setup Time For a Stop Condition
µs
SDAx
SDAx
SDAx
ts
250
ns
td
3.5
1
µs
t
µs
r
f
t
300
ns
ts
STO
4.7
µs
NOTE:
14. Data must be held sufficient time to bridge the 300ns transition time of SCL.
t
SCLx
whigh
t
t
R
F
t
SCLx
wlow
SCLx
t STA
s
t SDAx
t STO
h
s
t
tsSDAx
BUF
SDAx (INPUT)
t STAx
h
SDAx (OUTPUT)
t SDAx
d
2
FIGURE 2. I C INTERFACE TIMING
FN6787.2
July 12, 2012
9
D2-926xx
SPI™ Interface Port Timing (Figure 3) T = +25°C, CVDD = PLLVDD = 1.8V ±5%, RVDD = PWMVDD = 3.3V ±10%. All grounds at 0.0V.
A
All voltages referenced to ground.
MIN
MAX
SYMBOL
DESCRIPTION
(Note 12)
(Note 12)
UNIT
SPI MASTER MODE TIMING
t
MOSI Valid From Clock Edge
MISO Setup to Clock Edge
MISO Hold From Clock Edge
nCS Minimum Width
8
ns
ns
ns
V
S
H
t
2
2
3
t
t
3 system clocks
+ 2ns
WI
SPI SLAVE MODE TIMING
t
MISO Valid From Clock Edge
MOSI Setup to Clock Edge
MOSI Hold From Clock Edge
nCS Minimum Width
8
ns
ns
ns
V
S
H
t
2
2
3
t
t
3 system clocks
+ 2ns
WI
SCK (CPHA = 1, CPOL = 0
SCK (CPHA = 0, CPOL = 0
t
t
V
V
MOSI
t
H
t
S
MISO (CPHA = 0
nCS
t
WI
FIGURE 3. SPI TIMING
FN6787.2
July 12, 2012
10
D2-926xx
Pin Configuration DAE-3 (128-Pin Package)
D2-92633, D2-92634
(128 LD LQFP)
TOP VIEW
SC20
SRD2
SC21
SCK2
STD2
SC22
MCLK
SCK3
STD3
SC32
SC30
SC31
SRD3
STD0
SCK0
CVDD
CVDD
CGND
CGND
RGND
RVDD
SRD0
SC00
SC01
SC02
SCK
1
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
PWMVDD
PWM0
2
3
PWM1
4
PWM2
5
PWM3
6
PWMGND
PWMVDD
PWM4
7
8
9
PWM5
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
PWM6
PWM7
PWMGND
PWMVDD
PWM8
PWM9
PWM10
PWM11
PWM12
PWM13
PWMGND
PWMVDD
PWM14
PWM15
PWM16
PWM17
PWMGND
CVDD
TIO1
MISO
MOSI
GPIO7
GPIO3
GPIO2
CGND
RGND
RVDD
GPIO1
PROTECT2
FN6787.2
July 12, 2012
11
D2-926xx
Pin Configuration DAE-3HT (72-Pin Package)
D2-92683, D2-92684
(72 LD QFN)
TOP VIEW
72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55
1
2
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
SCLK3 (SC20)
SDIN3 (SRD2)
LRCK3 (SC21)
SCLK4 (SCK2)
SDIO4 (STD2)
LRCK4 (SC22)
SCLK12 (SCK3)
SDIN2 (STD3)
LRCK12 (SC32)
SDIN1 (SRD3)
CVDD
PWM0
PWM1
PWM2
PWM3
PWMGND
PWM4
PWM5
PWM6
PWM7
PWM8
PWM9
PWM10
PWM11
CVDD
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
CGND
RGND
RVDD
SCK
CGND
TIO1/NTC
MISO
RGND
RVDD
MOSI
PROTECT2
19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36
NOTE:
15. All pins pass Jedec II 100mA @ +85°C, with exception of pins 2, 4, 6, 7, 8, 9, 37, which pass 50mA @ +85°C
FN6787.2
July 12, 2012
12
D2-926xx
Pin Description, DAE-3 (128-Pin)
PIN
NAME
VOLTAGE
LEVEL
(V)
DRIVE
STRENGTH
(mA)
PIN (Note 16) TYPE
DESCRIPTION
2
1
2
3
4
5
6
7
SC20
SRD2
SC21
SCK2
STD2
SC22
MCLK
I/O
I/O
I/O
I/O
I/O
I/O
O
3.3
3.3
3.3
3.3
3.3
3.3
3.3
8
4
Serial Audio Interface 2, I S0 SCLK
2
Serial Audio Interface 2, I S0 SDIN
2
8
Serial Audio Interface 2, I S0 LRCK
2
8
Serial Audio Interface 2, I S1 SCLK
2
8
Serial Audio Interface 2, I S1 SDIN
2
4
Serial Audio Interface 2, I S1 LRCK
2
16
I S Serial Audio Master Clock output for external ADC/DAC components, drives low on reset and
is enabled by firmware assignment.
2
8
SCK3
STD3
SC32
SC30
SC31
SRD3
STD0
SCK0
CVDD
CVDD
CGND
CGND
RGND
RVDD
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
P
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
8
8
8
8
8
4
8
8
Serial Audio Interface 3, I S3 SCLK
2
9
Serial Audio Interface 3, I S3 SDIN
2
10
11
12
13
14
15
16
17
18
19
20
21
Serial Audio Interface 3, I S3 LRCK
2
Serial Audio Interface 3, I S2 SCLK
2
Serial Audio Interface 3, I S2 LRCK
2
Serial Audio Interface 3, I S2 SDIN
2
Serial Audio Interface 0, I S SDAT0
2
Serial Audio Interface 0, I S LRCK0
Core power, 1.8V
P
Core power, 1.8V
P
Core ground
P
Core ground
P
Digital pad ring ground. Internally connected to PWMGND.
P
Digital pad ring power, 3.3V. This 3.3V supply is used for all the digital I/O pad drivers and
receivers, except for the analog pads. Internally connected to PWMVDD.
22
23
24
25
26
27
SRD0
SC00
SC01
SC02
SCK
I/O
I/O
I/O
I/O
I/O
I/O
3.3
3.3
3.3
3.3
3.3
3.3
4
8
Serial Audio Interface 0, SDIO, Defaults to input, and may be configured as GPIO by firmware.
Serial Audio Interface 0, SDIO, Defaults to input, and may be configured as GPIO by firmware.
2
8
Serial Audio Interface 0, I S SDAT1
2
8
Serial Audio Interface 0, I S LRCK1
4
SPI clock I/O with hysteresis input.
TIO1
16
Timer I/O port 1. Operation and assignment is controlled by firmware. Leave unconnected when
not in use.
28
29
30
MISO
MOSI
GPIO7
I/O
I/O
I/O
3.3
3.3
3.3
4
4
SPI master input, slave output data signal.
SPI master output, slave input data signal.
16
General purpose I/O Bidirectional GPIO port. (One of 8 GPIO. Resets to input port. Operation and
assignment is defined by product application's firmware.)
31
32
33
GPIO3
GPIO2
GPIO4
I/O
I/O
I/O
3.3
3.3
3.3
16
16
16
General purpose I/O Bidirectional GPIO port. (One of 8 GPIO. Resets to input port. Operation and
assignment is defined by product application's firmware.)
General purpose I/O Bidirectional GPIO port. (One of 8 GPIO. Resets to input port. Operation and
assignment is defined by product application's firmware.)
General purpose I/O Bidirectional GPIO port. (One of 8 GPIO. Resets to input port. Operation and
assignment is defined by product application's firmware.)
FN6787.2
July 12, 2012
13
D2-926xx
Pin Description, DAE-3 (128-Pin)(Continued)
PIN
NAME
VOLTAGE
LEVEL
(V)
DRIVE
STRENGTH
(mA)
PIN (Note 16) TYPE
DESCRIPTION
34
35
36
37
GPIO5
GPIO6
SDA1
SCL1
I/O
I/O
I/O
I/O
3.3
3.3
3.3
3.3
3.3
16
General purpose I/O Bidirectional GPIO port. (One of 8 GPIO. Resets to input port. Operation and
assignment is defined by product application's firmware.)
16
General purpose I/O Bidirectional GPIO port. (One of 8 GPIO. Resets to input port. Operation and
assignment is defined by product application's firmware.)
8 - OD
8 - OD
4
Two-Wire Serial data port 1. Bidirectional signal used by both the master and slave controllers for
data transport.
Two-Wire Serial clock port 1. Bidirectional signal is used by both the master and slave controllers
for clock signaling.
38 PROTECT9 I/O
PWM protection input with hysteresis. (One of 9 protection inputs. Specific function and channel
assignment is defined by firmware.)
39 SPDIFRX1
40 SPDIFRX0
I
I
3.3
3.3
3.3
S/PDIF Digital audio data input 1
S/PDIF Digital audio data input 0
41
SPDIFTX
O
4
S/PDIF Digital audio output. (Audio content and audio processing signal flow is dependent upon
firmware, driving stereo output up to 192kHz.)
42
43
TEST
IRQA
I
I
3.3
3.3
Factory test use only. Must be tied low.
Interrupt request port A, Boot Mode Select. One of 4 IRQ pins. Connects to logic high (3.3V) or to
ground and High/Low logic status establishes boot mode selection upon de-assertion of reset
(nRESET) cycle.
44
45
46
47
IRQB
IRQC
IRQD
TIO2
I
3.3
3.3
3.3
3.3
Interrupt request port B, Boot Mode Select. One of 4 IRQ pins. Connects to logic high (3.3V) or to
ground and High/Low logic status establishes boot mode selection upon de-assertion of reset
(nRESET) cycle.
I
I
Interrupt request port C, Boot Mode Select. One of 4 IRQ pins. Connects to logic high (3.3V) or to
ground and High/Low logic status establishes boot mode selection upon de-assertion of reset
(nRESET) cycle.
Interrupt request port D, Boot Mode Select. One of 4 IRQ pins. Connects to logic high (3.3V) or to
ground and High/Low logic status establishes boot mode selection upon de-assertion of reset
(nRESET) cycle.
I/O
16
Timer I/O port 2. Operation and assignment is controlled by firmware. Leave unconnected when
not in use.
48
49
50
51
52
53
CVDD
CVDD
CGND
CGND
RGND
RVDD
P
P
P
P
P
P
3.3
3.3
3.3
3.3
3.3
3.3
Core power, 1.8V
Core power, 1.8V
Core ground
Core ground
Digital pad ring ground. Internally connected to PWMGND.
Digital pad ring power, 3.3V. This 3.3V supply is used for all the digital I/O pad drivers and
receivers, except for the analog pads. Internally connected to PWMVDD.
54
55
56
PUMPHI
PUMPLO
PSSYNC
I/O
I/O
I/O
3.3
3.3
3.3
16
16
16
Assignable I/O. Function and operation defined by firmware.
Assignable I/O. Function and operation defined by firmware.
Synchronizing output signal to switching power supply. (Operates under specification of firmware
and resets to high impedance inactive state when not used.)
57
58
PSTEMP
PSCURR
I/O
I/O
3.3
3.3
3.3
3.3
4
4
Assignable I/O. Function and operation defined by firmware.
Assignable I/O. Function and operation defined by firmware.
PWM synchronization port. (Function and operation is defined by firmware.)
59 PWMSYNC I/O
60 PROTECT3 I/O
16
4
PWM protection input with hysteresis. (One of 9 protection inputs. Specific function and channel
assignment is defined by firmware.)
FN6787.2
July 12, 2012
14
D2-926xx
Pin Description, DAE-3 (128-Pin)(Continued)
PIN
NAME
VOLTAGE
LEVEL
(V)
DRIVE
STRENGTH
(mA)
PIN (Note 16) TYPE
DESCRIPTION
61 PROTECT4 I/O
62 PROTECT5 I/O
63 PROTECT6 I/O
64 PROTECT7 I/O
65 PROTECT2 I/O
3.3
3.3
3.3
3.3
3.3
3.3
3.3
4
PWM protection input with hysteresis. (One of 9 protection inputs. Specific function and channel
assignment is defined by firmware.)
4
PWM protection input with hysteresis. (One of 9 protection inputs. Specific function and channel
assignment is defined by firmware.)
4
PWM protection input with hysteresis. (One of 9 protection inputs. Specific function and channel
assignment is defined by firmware.)
4
PWM protection input with hysteresis. (One of 9 protection inputs. Specific function and channel
assignment is defined by firmware.)
4
PWM protection input with hysteresis. (One of 9 protection inputs. Specific function and channel
assignment is defined by firmware.)
66
67
GPIO1
RVDD
I/O
P
16
General purpose I/O Bidirectional GPIO port. (One of 8 GPIO. Resets to input port. Operation and
assignment is defined by product application's firmware.)
Digital pad ring power, 3.3V. This 3.3V supply is used for all the digital I/O pad drivers and
receivers, except for the analog pads. Internally connected to PWMVDD.
68
69
70
71
72
RGND
CGND
P
P
3.3
3.3
3.3
3.3
3.3
Digital pad ring ground. Internally connected to PWMGND.
Core ground
CVDD
P
Core power, 1.8V
PWMGND
PWM17
P
PWM output pin ground. Internally connected to RGND.
I/O
8 or 16
8 or 16
8 or 16
8 or 16
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by
firmware.)
73
74
75
76
PWM16
PWM15
PWM14
PWMVDD
I/O
I/O
I/O
P
3.3
3.3
3.3
3.3
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by
firmware.)
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by
firmware.)
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by
firmware.)
PWM output pin power. This 3.3V supply is used for the PWM pad drivers. Internally connected to
RVDD.
77
78
PWMGND
PWM13
P
3.3
3.3
PWM output pin ground. Internally connected to RGND.
I/O
8 or 16
8 or 16
8 or 16
8 or 16
8 or 16
8 or 16
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by
firmware.)
79
80
81
82
83
84
PWM12
PWM11
PWM10
PWM9
I/O
I/O
I/O
I/O
I/O
P
3.3
3.3
3.3
3.3
3.3
3.3
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by
firmware.)
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by
firmware.)
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by
firmware.)
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by
firmware.)
PWM8
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by
firmware.)
PWMVDD
PWM output pin power. This 3.3V supply is used for the PWM pad drivers. Internally connected to
RVDD.
85
86
PWMGND
PWM7
P
3.3
3.3
PWM output pin ground. Internally connected to RGND.
I/O
8 or 16
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by
firmware.)
FN6787.2
July 12, 2012
15
D2-926xx
Pin Description, DAE-3 (128-Pin)(Continued)
PIN
NAME
VOLTAGE
LEVEL
(V)
DRIVE
STRENGTH
(mA)
PIN (Note 16) TYPE
DESCRIPTION
87
88
89
90
PWM6
I/O
I/O
I/O
P
3.3
3.3
3.3
3.3
8 or 16
8 or 16
8 or 16
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by
firmware.)
PWM5
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by
firmware.)
PWM4
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by
firmware.)
PWMVDD
PWM output pin power. This 3.3V supply is used for the PWM pad drivers. Internally connected
to RVDD.
91
92
PWMGND
PWM3
P
3.3
3.3
PWM output pin ground. Internally connected to RGND.
I/O
8 or 16
8 or 16
8 or 16
8 or 16
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by
firmware.)
93
94
95
96
97
PWM2
PWM1
I/O
I/O
I/O
P
3.3
3.3
3.3
3.3
1.8
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by
firmware.)
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by
firmware.)
PWM0
PWM output pin. (One of 18 PWM output pins. Channel and operation assignment is defined by
firmware.)
PWMVDD
OSCOUT
PWM output pin power. This 3.3V supply is used for the PWM pad drivers. Internally connected to
RVDD.
P
Analog oscillator output to slave D2-926xx devices. OSCOUT drives a buffered version of the
crystal oscillator signal from the XTALI pin.
98
99
PLLAGND
PLLTESTB
P
O
O
P
1.8
1.8
1.8
1.8
PLL Analog ground
Factory test use only. Must be tied low.
Factory test use only. Must be tied low.
100 PLLTESTA
101
XTALI
Crystal oscillator analog input port. An external clock source would be driven into the this port. In
multi-D2-926xx systems, the OSCOUT from the master D2-926xx would drive the XTALI pin.
102
XTALO
P
1.8
Crystal oscillator analog output port. When using an external clock source, this pin must be open.
XTALO does not have a drive strength specification.
103 PLLAVDD
P
P
I
1.8
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
PLL Analog power, 1.8V
104
105
106
107
ADCVDD
AIN1
Analog power for internal ADC, 3.3V
Analog input 1 to internal ADC
ADCREF
AIN0
O
I
Analog voltage reference output. Must be de-coupled to analog ground with 1µF capacitor.
Analog input 0 to internal ADC
108 ADCGND
P
I
Analog ground for internal ADC
109
110
111
nTRST
nCS
Factory test only. Must be tied high at all times.
SPI slave select I/O.
I/O
P
4
RVDD
Digital pad ring power, 3.3V. This 3.3V supply is used for all the digital I/O pad drivers and
receivers, except for the analog pads. Internally connected to PWMVDD.
112
113
114
115
116
RGND
CGND
CVDD
SC12
SC11
P
P
3.3
3.3
3.3
3.3
3.3
Digital pad ring ground. Internally connected to PWMGND.
Core ground
P
Core power, 1.8V
I/O
I/O
8
8
Serial Audio Interface 1, LRCK
Serial Audio Interface 1, SDAT3
FN6787.2
July 12, 2012
16
D2-926xx
Pin Description, DAE-3 (128-Pin)(Continued)
PIN
NAME
VOLTAGE
LEVEL
(V)
DRIVE
STRENGTH
(mA)
PIN (Note 16) TYPE
DESCRIPTION
Serial Audio Interface 1, data (Assignment by firmware control.)
Serial Audio Interface 1, SDAT2
117
118
119
120
SC10
STD1
SCK1
SRD1
I/O
I/O
I/O
I/O
O
3.3
3.3
3.3
3.3
3.3
8
8
8
4
Serial Audio Interface 1, SCK
Serial Audio Interface 1, data (Assignment by firmware control.)
121 nRSTOUT
16 - OD
Active low open drain reset output. Pin drives low from POR generator, 3.3V brownout detector
going active, or from 1.8V brownout detector going active. This output should be used to initiate a
system reset to the nRESET pin upon brownout event detection.
122
123
nRESET
TIO0
I
3.3
Active low reset input with hysteresis. Activates system level reset when pulled low, initializing all
internal logic and program operations. System latches boot mode selection of the IRQ input pins
on the rising edge.
I/O
3.3
3.3
3.3
3.3
3.3
3.3
16
4
Timer I/O port 0. Operation and assignment is controlled by firmware. Leave unconnected when
not in use.
124 PROTECT1 I/O
125 PROTECT0 I/O
PWM protection input with hysteresis. (One of 9 protection inputs. Specific function and channel
assignment is defined by firmware.)
4
PWM protection input with hysteresis. (One of 9 protection inputs. Specific function and channel
assignment is defined by firmware.)
126
127
GPIO0
SDA0
SCL0
I/O
I/O
I/O
16
General purpose I/O Bidirectional GPIO port. (One of 8 GPIO. Resets to input port. Operation and
assignment is defined by product application's firmware.)
8 - OD
8 - OD
Two-Wire Serial data port 0. Bidirectional signal used by both the master and slave controllers for
data transport.
128
Two-Wire Serial clock port 0. Bidirectional signal is used by both the master and slave controllers
for clock signaling.
NOTES:
16. Unless otherwise specified, all pin names are active high. Those that are active low have an “n” prefix.
17. All power and ground pins of same names are to be tied together to all other pins of their same name. (i.e., CVDD pins to be tied together, CGND pins
to be tied together, RVDD pins to be tied together, and RGND pins to be tied together.) CGND and RGND are to be tied together on board. RGND and
PWMGND pins are also internally connected and are to be tied together.
FN6787.2
July 12, 2012
17
D2-926xx
Pin Description DAE-3HT (72-Pin)
PIN
NAME
VOLTAGE
LEVEL
(V)
DRIVE
STRENGTH
(mA)
PIN (Note 16) TYPE
DESCRIPTION
2
2
1
2
3
4
SCLK3
(SC20)
In
In
In
In
3.3
3.3
3.3
3.3
8
4
8
8
Bit clock, I S port 3, audio input channels 5-6. (I S port 3 is 1 of 3 input-only ports, providing
channels 5-6 input audio content.)
2
2
SDIN3
(SRD2)
Audio data, I S port 3, audio input channels 5-6 (I S port 3 is 1 of 3 input-only ports, providing
channels 5-6 input audio content.)
2
2
LRCK3
(SC21)
L/R clock, I S port 3, audio input channels 5-6 (I S port 3 is 1 of 3 input-only ports, providing
channels 5-6 input audio content.)
2
2
SCLK4
(SCK2)
Bit clock, I S port 4, audio input channels 7-8, or audio output channels 1-2. (I S port 4 is either
an I S input port, or and I S output port. Selection of input or output is defined by firmware. When
used as input, port 4 provides channel 7-8 input audio content. When used as an output, port 4
2
2
2
provides the 2 channels of I S output audio.)
2
2
2
5
6
SDIO4
(STD2)
I/O
In
3.3
3.3
8
4
Audio data, I S port 4, input channels 7-8, or output channels 1-2. (I S port 4 is either an I S input
2
port, or and I S output port. Selection of input or output is defined by firmware. When used as
input, port 4 provides channel 7-8 input audio content. When used as an output, port 4 provides
the 2 channels of I S output audio.)
2
2
2
LRCK4
(SC22)
L/R clock, I S port 4, audio input channels 7-8, or audio output channels 1-2. (I S port 4 is either
2
2
an I S input port, or and I S output port. Selection of input or output is defined by firmware. When
used as input, port 4 provides channel 7-8 input audio content. When used as an output, port 4
provides the 2 channels of I S output audio.)
2
2
2
7
8
SCLK12
(SCK3)
In
In
In
In
3.3
3.3
3.3
3.3
8
8
8
8
Bit clock, I S ports 1 & 2, audio input channels 1-4 (I S ports 1 & 2 are 2 of the 3 input-only ports,
providing channels 1-4 input audio content.)
2
2
SDIN2
(STD3)
Audio data, I S port 2, audio input channels 3-4 (I S ports 1 & 2 are 2 of the 3 input-only ports,
providing channels 1-4 input audio content.)
2
2
9
LRCK12
(SC32)
L/R clock, I S ports 1 & 2, audio input channels 1-4 (I S ports 1 & 2 are 2 of the 3 input-only ports,
providing channels 1-4 input audio content.)
2
2
10
SDIN1
(SRD3)
Audio data, I S port 1, audio input channels 1-2 (I S ports 1 & 2 are 2 of the 3 input-only ports,
providing channels 1-4 input audio content.)
11
12
13
14
CVDD
CGND
RGND
RVDD
P
G
G
P
3.3
3.3
3.3
3.3
Core power, 1.8V
Core ground
Digital pad ring ground. Internally connected to PWMGND.
Digital pad ring power, 3.3V. This 3.3V supply is used for all the digital I/O pad drivers and
receivers, except for the analog pads. Internally connected to PWMVDD.
15
16
SCK
I/O
I/O
3.3
3.3
4
SPI clock I/O with hysteresis input.
TIO1/NTC
16
Timer I/O port 1, or assignable NTC temperature sensing common I/O. Operation and assignment
is controlled by firmware. Leave unconnected when not in use.
17
18
19
MISO
MOSI
SDA1
I/O
I/O
I/O
3.3
3.3
3.3
4
4
SPI master input, slave output data signal.
SPI master output, slave input data signal.
2
8 - OD
Two-Wire Serial (I C) data port 1. Primary control interface data signal used for device boot and
control. Bidirectional port for both master and slave controllers operation.
2
20
SCL1
I/O
3.3
8 - OD
Two-Wire Serial (I C) clock port 1. Primary control interface clock signal used for device boot and
control. Bidirectional port for both master and slave controllers operation.
21
22
SPDIFRX
SPDIFTX
In
O
3.3
3.3
S/PDIF Digital audio data input
S/PDIF Digital audio output. (Audio content and audio processing signal flow is dependent upon
firmware, driving stereo output up to 192kHz.)
23
24
TEST
IRQA
In
In
3.3
3.3
Factory test use only. Must be tied low.
Interrupt request port A, Boot Mode Select. One of 4 IRQ pins. Connects to logic high (3.3V) or to
ground and High/Low logic status establishes boot mode selection upon de-assertion of reset
(nRESET) cycle.
FN6787.2
July 12, 2012
18
D2-926xx
Pin Description DAE-3HT (72-Pin)(Continued)
PIN
NAME
VOLTAGE
LEVEL
(V)
DRIVE
STRENGTH
(mA)
PIN (Note 16) TYPE
DESCRIPTION
25
26
27
IRQB
IRQC
IRQD
In
In
In
3.3
3.3
3.3
Interrupt request port B, Boot Mode Select. One of 4 IRQ pins. Connects to logic high (3.3V) or to
ground and High/Low logic status establishes boot mode selection upon de-assertion of reset
(nRESET) cycle.
Interrupt request port C, Boot Mode Select. One of 4 IRQ pins. Connects to logic high (3.3V) or to
ground and High/Low logic status establishes boot mode selection upon de-assertion of reset
(nRESET) cycle.
Interrupt request port D, Boot Mode Select. One of 4 IRQ pins. Connects to logic high (3.3V) or to
ground and High/Low logic status establishes boot mode selection upon de-assertion of reset
(nRESET) cycle.
28
29
30
31
CVDD
CGND
RGND
RVDD
P
G
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
Core power, 1.8V
Core ground
G
Digital pad ring ground. Internally connected to PWMGND.
P
Digital pad ring power, 3.3V. This 3.3V supply is used for all the digital I/O pad drivers and
receivers. Internally connected to PWMVDD.
32 PROTECT3
33 PROTECT4
34 PROTECT5
In
In
In
4
4
4
4
4
PWM protection input with hysteresis. (One of 8 protection inputs. Specific function, channel
assignment, & optional GPIO is defined by firmware.)
PWM protection input with hysteresis. (One of 8 protection inputs. Specific function, channel
assignment, & optional GPIO is defined by firmware.)
PWM protection input with hysteresis. (One of 8 protection inputs. Specific function, channel
assignment, & optional GPIO is defined by firmware.)
35 PROTECT6 I/O
/nMUTE
PWM protection input with hysteresis, or optional mute output. (One of 8 protection inputs.
Specific function, channel assignment, and/or optional GPIO is defined by firmware.)
36 PROTECT7
/nOVRT
In
PWM protection input with hysteresis, or optional over-temperature monitor input. (One of 8
protection inputs. Specific function, channel assignment, and/or optional GPIO is defined by
firmware.)
37 PROTECT2
In
P
3.3
3.3
4
PWM protection input with hysteresis. (One of 8 protection inputs. Specific function, channel
assignment, & optional GPIO is defined by firmware.)
38
RVDD
Digital pad ring power, 3.3V. This 3.3V supply is used for all the digital I/O pad drivers and
receivers. Internally connected to PWMVDD.
39
40
RGND
CGND
G
G
3.3
3.3
Digital pad ring ground. Internally connected to PWMGND.
Core ground
41
42
43
44
45
46
CVDD
PWM11
PWM10
PWM9
PWM8
PWM7
P
O
O
O
O
O
3.3
3.3
3.3
3.3
3.3
3.3
Core power, 1.8V
8 or 16
8 or 16
8 or 16
8 or 16
8 or 16
PWM output pin. (One of 12 PWM output pins. Channel and operation assignment is defined by
firmware.)
PWM output pin. (One of 12 PWM output pins. Channel and operation assignment is defined by
firmware.)
PWM output pin. (One of 12 PWM output pins. Channel and operation assignment is defined by
firmware.)
PWM output pin. (One of 12 PWM output pins. Channel and operation assignment is defined by
firmware.)
PWM output pin. (One of 12 PWM output pins. Channel and operation assignment is defined by
firmware.)
FN6787.2
July 12, 2012
19
D2-926xx
Pin Description DAE-3HT (72-Pin)(Continued)
PIN
NAME
VOLTAGE
LEVEL
(V)
DRIVE
STRENGTH
(mA)
PIN (Note 16) TYPE
DESCRIPTION
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
PWM6
PWM5
PWM4
PWMGND
PWM3
PWM2
PWM1
PWM0
PWMVDD
PLLAGND
XTALI
O
O
O
O
O
O
O
O
P
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
1.8
1.8
1.8
1.8
3.3
3.3
3.3
3.3
3.3
3.3
3.3
8 or 16
8 or 16
8 or 16
PWM output pin. (One of 12 PWM output pins. Channel and operation assignment is defined by
firmware.)
PWM output pin. (One of 12 PWM output pins. Channel and operation assignment is defined by
firmware.)
PWM output pin. (One of 12 PWM output pins. Channel and operation assignment is defined by
firmware.)
PWM output pin power ground
8 or 16
8 or 16
8 or 16
8 or 16
PWM output pin. (One of 12 PWM output pins. Channel and operation assignment is defined by
firmware.)
PWM output pin. (One of 12 PWM output pins. Channel and operation assignment is defined by
firmware.)
PWM output pin. (One of 12 PWM output pins. Channel and operation assignment is defined by
firmware.)
PWM output pin. (One of 12 PWM output pins. Channel and operation assignment is defined by
firmware.)
PWM output pin power. This 3.3V supply is used for the PWM pad drivers. Internally connected to
RVDD.
G
In
O
P
PLL Analog ground
Crystal oscillator analog input port. When using an external clock source, the external clock is
driven into the this port.
XTALO
Crystal oscillator analog output port. When using an external clock source, this pin must be open.
XTALO does not have a drive strength specification.
PLLAVDD
nSS
PLL Analog power, 1.8V
O
P
4
SPI slave select I/O.
RVDD
Digital pad ring power, 3.3V. This 3.3V supply is used for all the digital I/O pad drivers and
receivers. Internally connected to PWMVDD.
RGND
G
G
P
Digital pad ring ground. Internally connected to PWMGND.
CGND
Core ground
CVDD
Core power, 1.8V
SCK1
/MCLK
I/O
O
8
Assignable general purpose I/O, or MCLK output. Operation and assignment is controlled by
firmware. Assigns as default output for MCLK when enabled through firmware.
nRSTOUT
16 - OD
Active low open drain reset output. Pin drives low from POR generator, 3.3V brownout detector
going active, or from 1.8V brownout detector going active. This output should be used to initiate a
system reset to the nRESET pin upon brownout event detection.
67
68
nRESET
In
3.3
3.3
Active low reset input with hysteresis. Activates system level reset when pulled low, initializing all
internal logic and program operations. System latches boot mode selection of the IRQ input pins
on the rising edge.
TIO0
/PSSYNC
I/O
16
Timer I/O port 0, or power supply sync output. Operation and assignment is controlled by
firmware. Leave unconnected when not in use.
FN6787.2
July 12, 2012
20
D2-926xx
Pin Description DAE-3HT (72-Pin)(Continued)
PIN
NAME
VOLTAGE
LEVEL
(V)
DRIVE
STRENGTH
(mA)
PIN (Note 16) TYPE
DESCRIPTION
69 PROTECT1
In
3.3
3.3
3.3
3.3
4
PWM protection input with hysteresis. (One of 8 protection inputs. Specific function, channel
assignment, & optional GPIO is defined by firmware.)
70 PROTECT0
In
4
PWM protection input with hysteresis. (One of 8 protection inputs. Specific function, channel
assignment, & optional GPIO is defined by firmware.)
71
72
SDA0
/TEMPREF
I/O
I/O
8 - OD
8 - OD
Two-Wire Serial data port 0, or assignable I/O. Available for NTC temperature sensing reference
as assignable I/O. Function is assigned by firmware.
SCL0
Two-Wire Serial clock port 0, assignable I/O. Available for NTC temperature sensing reference as
assignable I/O. Function is assigned by firmware.
/TEMPNTC
NOTES:
18. Unless otherwise specified, all pin names are active high. Those that are active low have an “n” prefix.
19. All power and ground pins of same names are to be tied together to all other pins of their same name. (i.e., CVDD pins to be tied together, CGND pins
to be tied together, RVDD pins to be tied together, and RGND pins to be tied together.) CGND and RGND are to be tied together on board. RGND and
PWMGND pins are also internally connected and are to be tied together.
FN6787.2
July 12, 2012
21
D2-926xx
Functional Block Diagram - DAE-3
FIGURE 4. DAE-3 IC FUNCTIONAL BLOCK DIAGRAM
FN6787.2
July 12, 2012
22
D2-926xx
Functional Block Diagram - DAE-3HT
FIGURE 5. DAE-3HT IC FUNCTIONAL BLOCK DIAGRAM
FN6787.2
July 12, 2012
23
D2-926xx
The DAE-3 supports a Class-D amplifier system built around
internal audio processing blocks and amplifier system hardware
functions.
Functional Description
Introduction
The DAE-3 family of ICs provide the core functionality, amplifier
control, and complete audio signal processing for D2Audio
Class-D amplifier solutions. The devices are highly
programmable with all system features and functionality totally
defined by firmware, that includes complete definition of audio
processing, signal flow, digital audio I/O, and amplifier hardware
interface control.
In addition to audio processing blocks and signal flow that are
user-selectable, system functions of hardware are configurable
that include PWM timing control, channel configuration and
assignment, protection and monitoring features, clock
configurations, and other audio system features. Choices and
settings are defined using the Audio Canvas III design tool
software which builds the unique DAE firmware for each
particular system design.
The Audio Canvas III software design tool supports building of the
firmware for the DAE-3 family devices. Using Audio Canvas III, the
designer is able to fully define audio processing and hardware
function features with I/O assignments, and build complete
production-ready firmware for the DAE-3 devices.
DSP
The majority of the audio processing functions and hardware
feature implementations operate through firmware running
within the DSP core. The core is a 24-bit fixed-point Digital Signal
Processor, with its own DMA, interrupt control, memory spaces,
and control interfaces.
DAE-3 DEVICE DESIGNATIONS
The DAE-3 device family includes both the DAE-3 and DAE-3HT
ICs. Functional specifications are identical to both designations
of this family unless otherwise indicated.
Sample Rate Converters (SRC)
DAE-3 family supports internal asynchronous sample rate
conversion to align input audio streams to a single rate
compatible with the DSP processing rate and PWM switch rate.
The family has 4 independent rate estimators, allowing up to 4
asynchronous stereo inputs (8 channels) to be sample rate
converted and processed simultaneously. The sample rate
converter has a measured SNR that exceeds 140dB and a
THD+N that exceeds -125dB.
The family device names apply to these part numbers:
DAE FAMILY
DEVICE NAME
DAE PART
NUMBERS
PACKAGE
PINS
DAE-3
D2-92633-LR
D2-92634-LR
128-Pin Package
DAE-3HT
D2-92683-QR
D2-92684-QR
72-Pin Package
Serial Digital Audio Interface
SERIAL DIGITAL AUDIO INPUTS
The DAE-3 devices are completely pin-compatible with the DAE-6
devices, allowing full flexibility for function vs cost trade-off,
providing cost-effective solutions for applications of varying
end-user features and capabilities.
The DAE-3 families include 4 Serial Audio Interface (SAI) digital
audio input ports supporting up to 8 audio channels.
• The DAE-3 supports four independent SAI ports. All 4 ports
operate asynchronously to receive audio from 4 independent
audio sources, and each of the 4 ports has its own clock and
frame inputs. SAI port 3 (the 4th port) of the DAE-3 has
multiplexed inputs to select that port’s audio from the SAI
input or from the on-chip ADC.
The DAE-3HT devices are identical to the DAE-3 but are provided
in a smaller 72-pin package with features and I/O mapped to
pins supported in that package.
AUDIO CANVAS III SUPPORT
Audio Canvas III is a powerful design tool that lets the designer
define audio processing and build a signal flow customized to the
user’s specifications. It fully supports the DAE-3 family including
configuring the DAE family hardware I/O features and pin
assignments. The designer can define the entire audio signal
flow and architecture without signal flow limitations to any
specific system. Capabilities include drag-and-drop of individual
audio processing blocks that can be inserted into the signal flow,
ability to connect and re-route signal flow, and live update
capability to build and download the new audio architecture
directly into the operating amplifier.
• The DAE-3HT devices support either 4 SAI input ports, or when
its fourth port is used as an audio output, support 3 SAI input
ports.
2
Each SAI port supports the digital audio industry I S standard
which is capable of carrying up to 24-bit Linear PCM audio words
per subframe IEC60958, or compressed digital audio (Dolby®
Digital, AAC, MPEG, etc.) packing per the IEC61937 specification.
The SAI port also supports Left-Justified formatted Linear PCM or
compressed digital audio. These ports support sample rates from
32kHz to 192kHz.
The DAE-3 family of ICs supports a wide variety of signal flows
and audio processing options that are fully programmable and
are completely defined by the system firmware and system
architecture.
SAI data formats are shown in Figure 6. For I2S format, the left
channel data is read when LRCK is low. For the Left-Justified
format, the left channel data is read when LRCK is high. Either
format requires data to be valid on the rising edge of SCLK and
sent MSB-first on SDIN with 32 bits of data per channel. Each set
of digital inputs runs asynchronously to the others and may
accept different sample rates and formats.
The firmware is built by the Audio Canvas III software, enabling
full audio processing and amplifier hardware feature definition
by the designer.
FN6787.2
July 12, 2012
24
D2-926xx
Input audio may be received from the S/PDIF input for 2 audio
SERIAL DIGITAL AUDIO OUTPUTS
input channels, concurrent with and asynchronous from audio
that is also being presented to SAI inputs for other audio input
channels. Routing through the SRC synchronizes this audio from
multiple sources for synchronous audio processing within the
DAE audio processing paths.
Up to 4 SAI ports (up to 8 channels) are supported in the DAE-3
families.
2
• The DAE-3 supports 4 independent I S output ports for a total
of 8 channels of audio.
2
• the DAE-3HT supports 1 I S output port (2 channels) and that
port is configured to operate as either an input port or as an
output port.
Use and channel assignment to the SAI outputs is configured
using the Audio Canvas III software. Any of the DAE device’s 12
audio processing channels may be assigned to any of the
available SAI output channels. Audio Canvas III also assigns use
of the 4th SAI port as in input or output for the DAE-3HT.
Left Channel
LRCLKx
SCLKx
Right Channel
Serial
Data
-1
-2
-1
-2
-3
+3
+2
+1
LSB
+3
+2
+1
LSB
-3
MSB
MSB
MSB
I2S Format
Right Channel
LRCLKx
SCLKx
Left Channel
Serial
Data
-1
-2
-1
-2
-4
+3
+2
+1
LSB
-3
+3
+2
+1
LSB
-3
MSB
MSB
-4
MSB
-1
Left-Justified
FIGURE 6. SAI PORT SUPPORTED DATA FORMATS FOR DELIVERY OF LINEAR PCM OR COMPRESSED AUDIO DATA
FN6787.2
July 12, 2012
25
D2-926xx
S/PDIF Digital Audio Interface
ADC input (DAE-3 Devices Only)
The device families include a S/PDIF Digital receiver and
transmitter.
The DAE-3 devices contains a high-performance Analog-to-Digital
Converter (ADC) that connects to input analog sources with a
minimum of interface circuitry. The ADC is included in the DAE-3
devices only. It is not supported in the DAE-3HT devices.
• The DAE-3 devices (128 pin packaged devices) include an on-
chip multiplexer supporting switching of input from 2 different
S/PDIF input pins. Input selection determines which pin routes
to the S/PDIF receiver.
At a bandwidth of 20kHz at nominal voltage and temperature,
the ADC input of the DAE-3 provides a typical THD+N
(unweighted) value of -81dB and a typical SNR/Dynamic Range
• The DAE-3HT devices (72 pin packaged devices) support one
input pin only and do not use multiplex switching.
of 83dB. These typical performances are based on a 1.0V
1
P-P
kHz sine wave input reference level, using a representative
system-level amplifier environment processing digital audio data
and producing PWM amplifier outputs.
All of the devices in the family include a S/PDIF Digital
transmitter.
S/PDIF RECEIVER
Analog performance is affected by factors that include PCB
layout, shielding and routing of analog traces, additional
components within the analog input path, and proper power
supply isolation techniques.
The S/PDIF receiver input pins are 3.3V CMOS input level
compatible, requiring external circuitry to condition the serial
input. The receiver contains an input transition detector, digital
PLL clock recovery, and a decoder to separate audio, channel
status, and user data. Only the first 24-Channel status bits are
supported. The receiver constantly monitors the incoming data
stream to detect the IEC61937-1 packet headers, and if found,
captures the Pc and Pd data words into registers. The receiver
meets the jitter tolerance specified in IEC60958-4.
The ADC master clock is supplied from the low jitter PLL of the
D2-926xx. The ADC operates synchronous to the DSP processing
which minimizes noise pickup.
PWM Audio Amplifier Outputs
The DAE-3 family devices include an integrated 12-channel PWM
engine. Each engine is independently programmable for timing,
output pin assignment and audio processing path source.
S/PDIF is typically used for receiving compressed (IEC61937-
compliant) as well as stereo PCM (IEC60958-compliant) audio
data. This interface also supports receipt of compressed audio
data that is not compliant with the IEC61937 specification, but
instead meets the IEC60958 specification.
PWM operation is defined by firmware. The Audio Canvas III
design tool provides the selection for audio channel assignment
routing, protection enabling, timing, and PWM output pin
mapping, then uses these selections to build the firmware that
controls the PWM outputs. Some features such as dead-band
timing are also adjustable in real-time through the control
interface.
S/PDIF receive data is routed through the SRC, providing a time
synchronized audio input stream for use within any of the DAE
audio processing channels. Audio may be presented on the
S/PDIF input asynchronous to audio also being presented to the
2
I S Serial Digital inputs such that after routing through the SRC,
Programmability enable use of multiple PWM output topologies,
which supporting system designs of a broad range of output
stages. Output topologies include integrated power stages, or
discrete implementations using N+N or P+N for half-bridge, full-
bridge or bridged-tied-load power stages. The PWM outputs may
be used for powered outputs, and may also be used for driving
line-level or headphone outputs.
are synchronous time aligned for internal DAE audio processing.
S/PDIF TRANSMITTER
The transmitter complies with the consumer applications defined
in IEC60958-3. The transmitter supports 24-bit audio data, 24-bit
user data, and 30-bit channel status data. S/PDIF output is linear
PCM only and is non-compressed. Routing of compressed audio
that is presented to the DAE inputs must be decoded by the DAE
and its firmware before the selected channels may be routed to
the S/PDIF outputs.
The 12 PWM channels are mapped to the PWM output pins by
firmware register assignment. Both DAE-3 and DAE-3HT include
12 PWM engines, and their available pins are:
Audio routing to the S/PDIF transmitter is defined by the signal
flow built by the Audio Canvas III software. That software
supports assigning any of the audio processing channels to the 2
(L/R) channels of the S/PDIF output. Because all timing of the
internal audio processing is synchronous to the internal DSP and
processing channels, the S/PDIF audio output is also
synchronous to that internal timing.
• DAE-3 - 18 assignable and mappable pins
• DAE-3HT- 12 assignable and mappable pins
FN6787.2
July 12, 2012
26
D2-926xx
Timers provides programmed I/O control of features that are
Amplifier Protection
event or timing dependent. Their hardware pins are assigned to
system features, and operation is controlled through firmware.
Timer pins are configurable based on the features supported
within the system firmware. Choice and operation of their
assigned features is selected through the Audio Canvas III
software that builds the firmware for the specific system project.
The core firmware that operates the DAE-3 family devices
supports protection options to prevent damage from faults
present in class-D amplifier designs. This protection is also
effective against user-induced faults such as clipping, output
overload, or output shorts, including both shorted outputs or
short-to-ground faults.
POWER SUPPLY SYNCHRONIZATION
Protection features and their details are firmware dependent.
The Audio Canvas III program provides selection for assignment
and use of certain protection methods, using the selections for
building the system firmware.
The PSSYNC pin provides a power supply synchronization signal
for switching power supplies. This synchronizing of power supply
switching with the PWM switching rate eliminates audio output
tones generated if the switching power supply is not locked to the
amplifier switching.
GRACEFUL OVERCURRENT AND SHORT CIRCUIT
Per-channel PWM protection is supported through individual
protection input pins. These PROTECT pins are primarily intended
for protecting the PWM powered output stages and operation is
firmware controlled. The protection input signal is typically
generated by sensing circuits within power stages and can
include sensing for detecting current, temperature, or voltage
fault conditions.
Firmware settings configure PSSYNC to the desired frequency
needed by the system switching regulator. The Audio Canvas III
software supports selection of use and frequency of this output.
Clocks And PLL
The PLL block operation is completely managed by the system
firmware. The clock generation contains a low jitter PLL critical
for low noise PWM output and a precise master clock source for
the ADC, sample rate conversion, and the audio data paths.
Overcurrent sensing requires a current sensor in the power
device to be protected, usually a powered PWM output. The
typical sensor asserts its fault signal that is routed to the
PROTECT pins of the DAE device.
The PLL block includes a low noise crystal oscillator, clock
multipliers clock generation for all internal device timing, PWM
engine timing, and clock reference for use with assignable clock
outputs that include MCLK and PSSYNC outputs.
The D2-926xx devices observe the overcurrent protection inputs
and provides graceful protection for the assigned output stages.
Hardware may be configured to provide immediate current
reduction, cycle-by-cycle output clipping, output signal control,
and output stage deactivation depending on the severity and
duration of high current events. The combination of hardware
features and firmware monitoring allows the system to
differentiate between an overcurrent situation or a more serious
short circuit condition, and supports the managed protection
within the DAE amplifier systems.
The system clock is provided by the crystal oscillator, using either
a fundamental mode crystal or a clock input to the XTALI pin. If
the clock input is used, it must be a 1.8V signal level. The input
signal on the XTALI pin is analog buffered and driven onto the
OSCOUT pin for use in driving the XTALI input of other D2-926xx
controllers, for supporting synchronous timing if multiple DAE
devices are used in a single application.
Reset and Initialization
THERMAL PROTECTION
The D2-926xx must be reset after power-up to begin proper
operation. In normal system hardware configurations, the reset
occurs automatically via the reset hardware circuitry. The chip
contains power rail sensors, brownout detectors, on the 3.3V and
1.8V power supplies. These brownout sensors will assert and hold
an internal Power-on Reset which will disable the device until the
power supplies are at a safe level for the DSP to start. These same
brownout sensors will detect a power supply voltage droop while
the system is active and provide a safe amplifier shutdown.
Temperature monitoring may be used to provide warning,
shutdown, or managed output level reduction to attempt to
reduce heating effects at high load power. Multiple thermal
protection methods are supported within the DAE family
firmware. User choice of method and operation is
programmable, using the Audio Canvas III software to configure
settings and options.
Hardware I/O Features
The DAE-3 and DAE-3HT provides programmable I/O pins used
for various hardware functions of the system design. Pin
functions are defined by the product firmware and configured
with the Audio Canvas III software.
Power Sequencing
The CVDD and RVDD (including PWMVDD) supplies should be
brought up together to avoid high current transients that could
fold back a power supply regulator. The ADCVDD and PLLVDD
may be brought up separately. Best practice would be for all
supplies to feed from regulators with a common power source.
Typically this can be achieved by using a single 5V power source
and regulating the 3.3V and 1.8V supplies from that 5V source.
GENERAL-PURPOSE I/O AND TIMERS
General Purpose I/O (GPIO) pins are available for system use
with the DAE-3 and are assignable by choice selection in the
Audio Canvas III software. The DAE-3 supports pins assignable to
various hardware features, while the DAE-3HT shares functions
of some of its available device pins providing feature choices in a
lower pin-count package.
FN6787.2
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D2-926xx
memory. The boot ROM code is designed to handle both
encrypted and non-encrypted boot images from any of the boot
modes shown in Table 2.
Reset
D2-926xx has one reset input: the nRESET pin. The nRESET input
pin (active low, non-reset high) is effectively a power-on system
reset. All internal state logic is initialized by nRESET. While reset
is active the system is held in the reset condition which is defined
as all internal reset signals being active, the crystal oscillator is
running, and the PLL disabled. At the de-assertion of nRESET, the
chip will capture the boot mode selection from the IRQ[D:A] pins
and begin the boot process.
The specific boot mode is selected based on the state of the
IRQD, IRQC, IRQB, and IRQA pins at the time of reset
de-assertion. The mode is selected by a hardware pull-up or
pull-down connection to each of the four boot mode (IRQ[D:A])
pins. (Modes not listed are reserved.)
Control Interfaces
The nRSTOUT pin is an active low open drain reset output. This
pin drives low from the internal power-on-reset generator, 3.3V
brownout detector going active, or from 1.8V brownout detector
going active. This output should be used to initiate a system
reset, and to also connect to the nRESET pin to initiate a DAE
reset upon brownout event detection.
2
I C 2-WIRE INTERFACE
2
The D2-926xx family ICs have two separate I C 2-Wire
compatible ports. Port 1 is used as the external controller
interface, and Port 0 is used for booting from an external
2
EEPROMs or compatible chips. Both I C interfaces are
multi-master capable.
Booting and Boot Modes
D2-926xx includes a fully-programmable DSP with internal boot
ROM. The boot ROM’s primary function is to download a
second-stage boot image from one of several possible sources.
SERIAL PERIPHERAL INTERFACE (SPI™)
The Serial Peripheral Interface (SPI) is provides an alternate boot
source interface such as an SPI Flash. The SPI port is used only
for boot operation. Register control of the system firmware is not
implemented through the SPI interface.
The system requires external firmware to boot the internal DSP.
Internal ROM within the DAE-3 initiates the boot process to read
the boot records and firmware, to load into the internal DAE-3
TABLE 2. BOOT MODES
XTALI RANGE INTERFACE SPEED
MODE IRQ[D:A]
DAE M/S
Slave
Master
Master
-
DESCRIPTION
I C port 1 slave to external master, boot @ address 88
2
0
1
0000
0001
0010
-
N/A
24.576MHz
24.576MHz
-
per Master
400kb/s
1.53MHz
-
2
2
I C port 0 master to I C EEPROM slave
SPI port master to SPI Flash slave
Reserved
2
3-F
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D2-926xx
8. Transmit data lower byte
Reading and Writing Control Registers
DAE control is provided through the I C port, using registers and
2
2
9. I C STOP command
memory spaces that are defined within the firmware. After
booting and initialization, this control port provides continuous
read and write access for control and monitoring of the amplifier
system. Register addresses are dynamic based on the audio path
signal flow and hardware options selected for the particular
project. Address locations are generated for each system through
a header file from the Audio Canvas III design tool that maps the
address location to each parameter of the system.
All reads to registers require two steps. First, the master must
send a dummy write which consist of sending a Start, followed by
the device address with the write bit set, and three register
address bytes. Next, the master must send a repeated Start,
following with the device address with the read/write bit set to
read, and then read the next three data bytes. The master must
Acknowledge (ACK) the first two read bytes and send a Not
Acknowledge (NACK) on the third byte received and a Stop
condition to complete the transaction. The device's control
interface acknowledges each byte by pulling SDA low on the bit
immediately following each write byte. The device read function,
2
The I C port is used for reading and writing the control data. The
highest-order byte of the register address (bits 23:16) determines
the internal address space used for control read or write access,
and the remaining 16 bits (bits 15:0) describe the actual address
within that space.
2
as shown in Figure 8, executes the following 11 steps as the I C
bus master:
2
1. I C START command
All reads or writes to registers (shown in Figures 7 and 8) begin
with a Start Condition, followed by the Device Address byte, three
Register Address bytes, three Data bytes and a Stop Condition.
2
2. Transmit device I C address with W
3. Transmit mode byte
2
Register writes through the I C interface are initiated by setting
the read/write bit that is within the device address byte. The
device write function as, shown in Figure 7, executes the
following 9 steps as the I C bus master:
4. Transmit upper memory address byte
5. Transmit lower memory address byte
6. Repeat START command
2
2
1. I C START command
2
7. Transmit device I C address with R
2
2. Transmit device I C address with W
8. Receive data upper byte
9. Receive data middle byte
10. Receive data lower byte
3. Transmit mode byte
4. Transmit upper memory address byte
5. Transmit lower memory address byte
6. Transmit data upper byte
2
11. I C STOP command or NACK
7. Transmit data middle byte
ACK
ACK
ACK
DEVICE-ADDR
REGISTER [23:16]
REGISTER [15:8]
REGISTER [7:0]
START
R/W
ACK
ACK
ACK
ACK
Write Sequence
REGISTER [7:0]
DATA [23:16]
DATA [15:8]
DATA [7:0]
STOP
2
FIGURE 7. I C WRITE SEQUENCE OPERATION
Step 1
ACK
ACK
ACK
ACK
DEVICE-ADDR
REGISTER [23:16]
REGISTER [15:8]
REGISTER [7:0]
REPEAT
START
START
R/W
MASTER
ACK
MASTER
ACK
ACK
ACK
NACK
Read Sequence
DEVICE-ADDR
DATA [23:16]
DATA [15:8]
DATA [7:0]
REPEAT
START
R/W
STOP
Step 2
2
FIGURE 8. I C READ SEQUENCE OPERATION
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STEREO A/B SWITCH
Audio Processing
The A/B Switch provides stereo routing selection to switching
either of 2 pairs of stereo inputs to its output. It operates as a
double-pole, double-throw type of switch to the audio flow.
Audio processing is totally defined by the system firmware and
signal flow. Audio processing blocks are implemented using the
Audio Canvas III design tool software. This tool includes an
extensive library of audio processing functions that are
developed for operating in the DAE-3 and DAE-3HT device
families.
TONE CONTROL
Tone Controls are shelving filters providing independent of gain
and frequency adjustment for bass and treble tone settings.
Frequency and gain are continuously and independently
adjustable for both the bass and treble settings, supporting gain
ranges of -14 to +14 dB.
The Audio Canvas III software provides the interface to define
and build a complete audio sound processing system. Drag-and-
drop inserting of its included audio processing blocks enables
building a customized signal flow, by placing audio algorithms
into customized firmware for executing on the DAE devices.
PARAMETRIC EQUALIZERS
Parametric Equalizer (EQ) blocks provide an adjustable bandpass
or band-reject frequency response. With frequency-domain
parameter settings of frequency, gain, and bandwidth or Q,
parameters are continuously and independently adjustable. EQs
are provided as individual audio blocks, and as blocks with
groups of 3-Band and 5-Band EQs.
Audio Processing Algorithms
Audio processing algorithms include all of these following
functions. Multiples of each are permitted, and there is no limit
to the order or interconnect of the algorithm blocks. Upon
completion of defining the audio processing path, the Audio
Canvas III software incorporates the blocks and builds the final
system firmware for loading onto and running the DAE devices.
BIQUAD FILTER (FREQUENCY DOMAIN
CONFIGURATION)
Details and equations for each parameter are provided in the
Audio Canvas III User’s Manual.
The Biquad block is a frequency-domain-parameter-entry biquad
filter implemented as a second-order biquad algorithm, providing
configurable high-pass, low-pass, and all-pass filtering functions.
First or second filter order may be selected, and parameter
setting entries of frequency and damping coefficient are
continuously adjustable. Bypass and polarity phase inversion is
also supported.
INPUT SOURCE SELECTION
A source selection register defines input channel assignment of
audio presented to the DAE device’s audio input ports.
VOLUME
Volume control blocks provide level and trim adjustments within
the signal flow. Continuous adjustment through programmable
gain ranges supports attenuation to -100dB and gain to +24dB. A
single 24-bit register value provides gain setting and also
supports selectable audio phase inversion.
BIQUAD FILTER (Z-DOMAIN CONFIGURATION)
The z-Domain Biquad is a second order biquad digital algorithm
that operates from direct entry of z-transform coefficients. The
filter supports individual user entry coefficients enabling nearly
any second order filter synthesis per cascadable block.
SHARED VOLUME
FILTER - CROSSOVER
Shared Volume blocks implement multiple channels of level
attenuation. The number of channels is configurable and a single
24-bit register value equally controls all channel levels. Volume is
continuously adjustable from unity gain to -100dB.
The Crossover Filter blocks provide high-pass or low-pass filtering
using frequency domain adjustment settings. Blocks are
implemented from 2 cascaded second-order biquad elements,
with selections that directly implement Linkwitz-Riley,
Butterworth, or Bessel filter presets. Slope setting is adjustable
from 6, 12, 18 or 24dB per octave, frequency and damping
coefficients are continuously adjustable, and bypass, active or
mute functions are supported.
MIXERS
Mixers provide individually-adjustable inputs that are summed
together and passed to their output. Each input mixing level is
controlled with its own 24-bit register that provides continuous
adjustment from unity gain to -100dB, along with full audio path
cut-off and optional input phase inversion supporting sum and
difference mixers. Audio block choices include 2-input, 4-input,
and configurable N-input mixers accommodating as many inputs
as desired.
FIR FILTER
The FIR filter is a configurable n-tap finite impulse response filter
implementation. The number of taps and their coefficient values
are defined in the audio signal flow simply through a user-
generated list of tap coefficients for the FIR structure.
ROUTER
EXCURSION CONTROL
Routers perform independent channel routing assignment,
connecting any input to any output. Number of channels is
configurable with up to 64 inputs and 12 outputs.
Excursion Control is a specialized algorithm that dynamically
controls audio based on frequency and level. Excursion Control
boosts the low frequency response to compensate for physically-
limited low-frequency capabilities of small loudspeakers and
subwoofers at low listening levels. As listening levels rise, it
dynamically adjusts its boost enabling an optimum sub-woofer
listening experience at all loudness levels.
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D2-926xx
DELAY
MONO MIXER
Delay Blocks introduce an adjustable delay of a channel's audio
data. Buffer size is fully user-configurable, supporting adjustment
over a range as small as milliseconds, to over 1 second.
A Mono Mixer is a threshold-gating mixer that routes the sum of
either or both of its 2 inputs into its output, based on a control
level input. This threshold-controlled mixing supports processing
of input audio that may be mono on both Left and Right, or
containing content on only one of Left or Right. This summed
audio then passes equally to stereo processing and output
system channels.
COMPRESSOR
Compressors provide threshold-dependent level adjustments,
implementing dynamic attenuation at configurable rates as the
control signal level increases. Headroom level is configurable,
supporting adjustable threshold ranges. Ratio, threshold, and
attack/release times are also fully adjustable. Compressors
incorporate a side chain input for algorithm control, supporting
compressing or limiting operation from inputs independent of
the processed channel audio signal flow.
DITHER GENERATOR
The Dither Block generates a random noise (dither) pattern at a
shaped-spectrum low level. This noise is available to sum into the
audio path using a mixer, pushing up low-order bits of low-level
audio. This process enables improved uniform audio quality
when digital bit depth truncation is required because of
interfacing equipment. Audio signal flow data is normally
processed and output in digital format as 24 bits from the
channels assigned to the SAI digital outputs.
COMPRESSOR/EXPANDER
The Expander Compressor implements dynamic low level signal
expansion, or an upward compression to audio levels. The
Expander Compressor implements dynamic low level signal
expansion for an upward compression to audio levels. Adjustable
settings include gate threshold and ratio, expansion threshold,
ratio, and expansion gain limit, and attack and release times.
HARMONICS GENERATOR
The Harmonics Generator provides a harmonic spectrum content
from audio presented to its input. Harmonic order and amplitude
is programmable, supporting customized audio processing
features.
ENVELOPE VOLTAGE CONTROLLED AMPLIFIER
The Envelope VCA processes its control input to establish an
amplitude envelope signal representing the audio path input
level. The Envelope VCA uses its side chain input to establish an
amplitude envelope of the audio level. Controls are similar to
that of the Compressor Block.
SoundSuite™ Processing
The D2Audio SoundSuite™ audio processing provides a full set of
enhancements to audio that greatly add to the quality and
listening experience of sound in wide scopes of consumer
devices. The SoundSuite algorithms use psycho-acoustic
processing that create a rich-sounding environment from small
speakers, and synthesizes the sound and quality equivalent to
more complex systems. It is especially suited to consumer
products that include televisions, docking stations, and mini hi-fi
stereo products. SoundSuite Processing includes:
REVERB
The Reverb Block is a 2-channel stereo reverb processor. It
provides adjustable reverb time and damping settings, and its
built-in mixer includes adjustments for both dry and wet audio
levels.
• D2Audio™ WideSound™
• D2Audio™ WideSound™ x4
• D2Audio™ DeepBass™
• D2Audio™ Mono2Stereo™
CHIME GENERATOR
The Chime Generator contains 3 oscillators, each with adjustable
frequency and gain. When triggered, the oscillators initially
produce full programmed output levels that then decrease at
their programmable decay time rate.
D2Audio™ SoundSuite™ algorithms are completely supported
with all part numbers of the DAE-3 and DAE-3HT families.
RMS LEVEL METER
RMS Meters provide real-time indication of the signal levels
through the audio processing path. Visible in the Audio Canvas III
signal flow, they provide continuous level indication. Measured
data in the meter's registers may also be read by system
controllers for monitoring levels in a final production system.
FADE-PAN
The Fade-Pan control provides level adjustment of 4 input
channels to 4 output channels. Implementation includes a
Rear/Front fade adjustment, and a Left/Right balance
adjustment. Controls are continuously adjustable, providing unity
gain at mid-point settings, and attenuating output levels of its
channels as the respective control is adjusted away from that
channel's direction.
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D2-926xx
AM radio station, reducing possible station interference. The
algorithm is optional and selection is controlled through a
register setting that is created with the system firmware.
Third Party Virtualization and Enhancements
Enhancement processing and virtualization algorithms from
third-party technology providers are available to add to Audio
Canvas III. As permitted through license agreements from the
providers, these algorithms are supplied to the designer where
they integrate into the Audio Canvas III software, and appear as
additional audio block choices.
MCLK CLOCK OUTPUT
2
The MCLK output provides the I S clock to external digital audio
circuits or devices. The MCLK output is optional, and when
enables is selectable between 2 frequencies.
Depending on device part number and design-specific firmware
definitions, the DAE-3 device supports a variety of processing,
decoding, virtualization, and pre/post processing feature sets.
Features and processing support is shown in Table 1 on page 3.
PSSYNC CLOCK OUTPUT
The PSSYNC signal is used for synchronizing switching power
converters used in the amplifier. Providing a synchronizing
frequency that is a multiple or sub-multiple of the PWM switching
rate eliminates possibility of in-band audio frequency generation
from close but asynchronous clocks. The output is optional, and
when enabled supports 6 frequency multiple choices.
Audio Processing Block Controls
Each audio processing block is assigned its own registers
providing adjustment controls for the parameters associated
with its audio function. Some blocks use one register only, while
other blocks with multiple control settings may use multiple
registers for each control. The parameter equations for all of the
audio blocks are provided in the Audio Canvas III User’s Manual.
AUDIO I/O CONFIGURATION
This configuration allow choice selection of which audio
processing channels are assigned to the S/PDIF and I S digital
2
outputs. It also supports choice of input port assignments to the
audio input channels.
Dynamic Register Addressing Architecture
Audio Canvas III supports building of any signal flow with no
restriction of the order of occurrence of any audio block, or any
limit to repeated deleting or addition during signal flow editing.
As audio algorithm blocks are edited, added, or removed, the
user-space memory addresses for each register will change.
However, each instance of each block has its own unique label
identifier where that identifier is clearly known and visible on the
signal flow workspace.
FAULT INDICATION
An optional output may be assigned to provide a control signal to
a system controller or other hardware within the amplifier upon
detection of protection or fault conditions. The feature may be
enabled or disabled, and when enabled, allows choosing an
available I/O pin for providing this output.
DECODER SELECTION
Because each and every algorithm is assigned its own dedicated
register for its parameter settings, the Audio Canvas III generates
a variable-to-address mapping for each build of each project. This
mapping is provided as a text file in a header file format that can
be directly included within a system controller’s software build.
As multiple iterations of a signal flow are created during the
design process, a new header file is created matching each
revision. Simply including the header file within the system
controller compile automatically passes these new register
addresses without need for repeated system code editing.
Third party decoding of compressed formats is supported based
on the particular device part number. By default, when a device is
used that supports the licensed technology, its supported
decoding is enabled. Choices allow building of firmware to
selectively include or exclude the available decoding algorithms.
FORMAT CHANGE NOTIFICATION
The Format Change Notification feature allow assigning an I/O
pin to provide hardware indication when a change of decoded
format types is detected. This supports dynamic audio path
allocation by the system controller when audio content changes
to or from PCM and an encoded format. The feature is disabled
by default, but when enabled, allows assignment of the I/O pin to
signal this state. An additional setting allows choosing an audio
muting time delay between format changes.
Hardware Feature Functions
In addition to the core firmware that runs the DAE devices to
operate the amplifier, several feature-specific options are
supported for use in the amplifier system. These optional
features are configurable and may be chosen or bypassed.
Configuration is set using the Audio Canvas III software, where
based on chosen settings, the firmware will include each function
along with the hardware I/O assigned to its function.
IDLE POWER MANAGEMENT
The Idle Power Management feature allows controlled audio
PWM output shutdown after a time period has elapsed with no
audio detected above a threshold level. The feature is disabled by
default and when enabled allows choice of threshold time and
signal level, and assignment of an I/O pin that can be used to
signal other operations in the amplifier.
The DAE-3 supports pins assignable to various hardware
features, while the DAE-3HT shares choices between functions
with some of its available pins providing feature choices in a
lower pin-count package.
These hardware feature algorithms include:
AM AVOIDANCE MODE
AM Avoidance Mode allows selecting the PWM switching
frequency to move its harmonics away from the frequency of an
FN6787.2
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D2-926xx
MASTER VOLUME ENCODER
The Master Volume Encoder fe a tu er allows assigning of I/O
pins to a quadrature-type encoder that can be used as a
mechanical volume control. The fe a tu er is disabled by default,
but when enabled allows choice of volume control algorithm
association in the audio signal flow, and choice of the I/O pins.
PWM OUTPUT CONFIGURATION
The PWM Output Configuration functions support assignment of
PWM output pins to each of the 12 PWM engines. It allows pin
polarity selection, and choice of enabling or disabling each PWM
engine.
PWM OUTPUT TIMING
The PWM Output Timing controls enable per-channel adjustment
of each PWM output timing. Controls included dead time,
minimum pulse width, and stagger settings between channels.
POWER DOWN OUTPUT
The Power Down Output feature supports setting an output pin
that can connect to power stages, for manually shutting down
power stages during fault detection and system startup. When
enabled, the algorithm supports specification entry of the I/O pin
to be used for the function.
TEMPERATURE SENSING
A thermal protection algorithm supports use of NTC resistors
placed in heat-sensitive areas of the amplifier. The algorithms
run and provide real-time temperature measurement.
Temperature values are available in firmware registers for
reading by a system controller, and set-points in the algorithm
can be used to trigger a controlled-attenuation level reduction or
fault shutdown.
THERMAL MANAGEMENT
An additional thermal protection algorithm supports a high
temperature warning input to trigger controlled-attenuation level
reduction. Rate of change and delay are programmable when the
feature is enabled.
FN6787.2
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D2-926xx
Pin Function Mapping Between Devices
Table 3 lists the pin numbers, names and functions for both the
DAE-3 and DAE-3HT devices, and provides a mapping of the pin
functions between those devices.
DAE-3 And DAE-3HT Differences
The DAE-3 device family includes both the DAE-3 and DAE-3HT.
Functional specifications are identical to both designations of
this family. However, the DAE-3HT, provided in its smaller 72-pin
package supports system and assignable functions that are
mapped to the pins supported in that package. Complete pin
functions of all pins of both devices of the DAE-3 family are listed
in the Pin Description Tables.
TABLE 3. DAE-3 AND DAE-3HT PIN AND I/O COMPARISON TABLE
PIN NUMBERS
PIN NAMES
DESCRIPTION AND FUNCTION
DAE-3 DAE-3HT
DAE-3
DAE-3HT
DAE-3
DAE-3HT
2
2
1
1
SC20
SRD2
SC21
SCK2
STD2
SC22
SCK3
STD3
SC32
SRD3
SDA1
SCL1
SCK1
TIO0
SCLK3
(SC20)
I S Input Port 1 SCLK
I S Port 3 Input Channels 5-6 SCLK
2
2
2
2
SDIN3
(SRD2)
I S Data Port 1, Input Channels 1-2
I S Port 3 Input Channels 5-6 Audio Input Data
2
2
3
3
LRCK3
(SC21)
I S Input Port 1 LRCK
I S Port 3 Input Channels 5-6 LRCK
2
2
4
4
SCLK4
(SCK2)
I S Input Port 2 SCLK
I S Port 4 Input Channels 7-8, or Output Channels
1-2 SCLK
2
2
5
5
SDIO4
(STD2)
I S Data Port 2, Input Channels 3-4
I S Port 4 Input Channels 7-8, or Output Channels
1-2 Audio Data
2
2
6
6
LRCK4
(SC22)
I S Input Port 2 LRCK
I S Port 4 Input Channels 7-8, or Output Channels
1-2 LRCK
2
2
8
7
SCLK12 I S Input Port 3 SCLK
(SCK3)
I S Ports 1&2 Input Channels 1-4 SCLK
2
2
9
8
SDIN2
(STD3)
I S Data Port 4, Input Channels 7-8
I S Port 2 Input Channels 3-4 Audio Data
2
2
10
13
36
37
119
123
127
128
27
125
124
65
9
LRCK12 I S Input Port 4 LRCK
(SC32)
I S Ports 1&2 Input Channels 1-4 LRCK
2
2
10
19
20
65
68
71
72
16
70
69
37
SDIN1
(SRD3)
I S Data Port 3, Input Channels 5-6
I S Port 1 Input Channels 1-2 Audio Data
SDA1
2-Wire (I2C) Data Port (Controller Port)
2-Wire (I2C) Clock Port (Controller Port)
2-Wire (I2C) Data Port (Controller Port)
2-Wire (I2C) Clock Port (Controller Port)
Assignable GPIO or MCLK Output
SCL1
2
SCK1
/MCLK
I S Output Port SCLK
TIO0
/PSSYNC
Timer I/O port 0.
Timer I/O port 0, or Assignable Power Supply Sync
Output
SDA0
SCL0
TIO1
SDA0
/TEMPREF
2-Wire (I2C) Data Port
Assignable I/O, NTC Temp Sense Reference
Assignable I/O, NTC Temp Sense NTC
Assignable I/O, NTC Temp Sense Common
PWM Channel 0 Protect Input
SCL0
/TEMPNTC
2-Wire (I2C) Clock Port
TIO1
/NTC
Timer I/O port 1, NTC Temp Sense Common
PROTECT0 PROTECT0 PWM Channel 0 Protect Input
PROTECT1 PROTECT1 PWM Channel 1 Protect Input
PROTECT2 PROTECT2 PWM Channel 2 Protect Input
PWM Channel 1 Protect Input
PWM Channel 2 Protect Input
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D2-926xx
TABLE 3. DAE-3 AND DAE-3HT PIN AND I/O COMPARISON TABLE (Continued)
PIN NUMBERS
PIN NAMES
DAE-3 DAE-3HT
DESCRIPTION AND FUNCTION
DAE-3 DAE-3HT
DAE-3
DAE-3HT
60
61
62
63
64
95
32
33
34
35
36
54
PROTECT3 PROTECT3 PWM Channel 3 Protect Input
PROTECT4 PROTECT4 PWM Channel 4 Protect Input
PROTECT5 PROTECT5 PWM Channel 5 Protect Input
PWM Channel 3 Protect Input
PWM Channel 4 Protect Input
PWM Channel 5 Protect Input
PROTECT6 PROTECT6 PWM Channel 6 Protect Input
/nMUTE
Assignable PWM Protect Input, or Mute Output
PROTECT7 PROTECT7 PWM Channel 7 Protect Input
/nOVRT
Assignable PWM Protect Input, or Over-
Temperature Monitor Input
PWM0
PWM0
PWM output pin. (One of 18 PWM output pins.
Channel and operation assignment is defined by
firmware.)
PWM output pin. (One of 12 PWM output pins.
Channel and operation assignment is defined by
firmware.)
I/O Pin Function Assignment Comparison
Pin I/O functions and their assignments are supported through
user selections of the Audio Canvas III software that builds the
DAE-3 or DAE-3HT firmware. The designer has the option of
choosing the offered features and allocating I/O pins to those
features based on individual system design needs.
MCLK
• The DAE-3 utilizes a dedicated pin for the MCLK output. That
pin is available only for MCLK. User selection determines if
MCLK is present on this pin or if its output is off.
• The DAE-3HT provides a user selection to choose whether to
enable the MCLK output. This pin (the SCK1/MCLK pin)
becomes assigned to MCLK when MCLK is enabled. When
MCLK is disabled, the SDK1/MCLK pin becomes available for
assignment to other hardware I/O functions.
The differences of pin functions are shown in the preceding table,
but the following provides additional detail to certain of these
pins and functions as to their available features and assignment.
PWM OUTPUT PINS
PROTECTION INPUT PINS
• The DAE-3 has 18 PWM pins that are assignable to any of the
DAE-3’s 12 PWM channels.
• The DAE-3 provides 9 protect input pins, where the first 8 are
allocated to the first 8 PWM engines. The last of the 9 is a
dedicated input for monitoring an over-temperature warning
control signal from power stages or other monitoring switches.
• The DAE-3HT has 12 PWM pins that are assignable to any of
the DAE-3’s 12 PWM channels.
2
I S DIGITAL INPUTS AND OUTPUTS
• The DAE-3HT provides 8 protect input pins. These pins are all
assignable to be used as the protect input for their default
PWM engine, or when not used for that protection become
available for use with other pin-assignable hardware I/O
functions. All selection is established through the user
interface of the Audio Canvas III design tool program.
2
• The DAE-3 supports 8 audio INPUT channels through 4 I S
serial digital audio input ports. Port assignments are
established with the firmware built with the Audio Canvas III
software for the DAE-3 devices.
2
• The DAE-3 supports 8 audio OUTPUT channels through 4 I S
serial digital audio output ports. Port and channel assignments
are established through user selection with the firmware built
with the Audio Canvas III software for the DAE-3 devices.
• The DAE-3HT supports a user choice of either:
2
- 8 audio INPUT channels through 4 I S serial digital audio
2
input ports, and no I S OUTPUTS, or
2
2
- 6 INPUT channels through 3 I S ports with 1 I S OUTPUT
supporting 2 audio channels.
FN6787.2
July 12, 2012
35
D2-926xx
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make
sure you have the latest Rev.
DATE
REVISION
FN6787.2
CHANGE
July 3, 2012
Complete datasheet rewrite to add DAE-3HT devices to the DAE-3 family.
- Revisions and additions to accommodate additions for DAE-3HT to DAE-3/DAE-3HT family.
- Complete rewrite of page 1 description and features, and complete rewrite of all functional description content.
(Rewrites do not change function of DAE-3 devices, but provide more accurate explanation of device use.)
- No changes to DAE-3 specifications other than: Addition and revision of ADC specifications and updates of
supporting detail for ADC. All other DAE-3 specifications unless noted by DAE-3HT specific designations are
identical to those of DAE-3.
- Updates to DAE-3 high-level and detail block diagrams, and addition of diagrams for DAE-3HT.
- Removal of ADC and DSD plots.
- Removal of all HDA interface, HDMI interface, DSD, and SCI references and descriptions.
- Removal of D2-92613-LR and D2-92625-LR part numbers which are being discontinued. (Their features are
fully supported in the D2-92633-LR part number and the removed part numbers are not needed.)
POD Q128.14x14 updated to latest revision - Changed title from “Thin Plastic Quad Flatpack Package (LQFP)”
to “Low Plastic Quad Flatpack Package (LQFP)”
POD L72.10x10F updated to latest revision - Changed bottom view to reflect correct pin 1 corner and pin
numbering. Also cleaned up details Y & Z
May 3, 2011
FN6787.1
Rewrite of datasheet. Fixes to incorrect (pin 109) connection description, removal of unnecessary descriptive
content and structure.
-Updated datasheet to latest corporate document format and applied standards as follows:
Ordering information added audio processing column, added device support note, numbered notes, lead finish
matching intrepid.
Added Tjc to Thermal Information and corresponding note on page 5
Added Compliance note on page 6 referencing MIN and MAX columns of Electrical Spec Tables
-Updated Block Diagram on page 1 - complete re-draw.
-Removed D2-92643 part number from DAE-3 Device Feature Set Offering Table 1 on page 2 (this is not an
available ordering part number)
-Corrected pin 109 (nTRST) description error on page 14 to indicate that it must be pulled high at all times.
(internally-requested error correction). Changed from: "Hardware test mode control. For D2Audio use only. Must
be tied high or low." To: "Factory test only. Must be tied high at all times."
-Removed outdated high level system diagrams,
-Removed all (outdated and non-applicable) reference design examples,
-Removed unnecessary HDA connection diagrams
-Removed trademarks section/paragraph. Explicit listing not required/sufficiently covered through other
means.
April 1, 2010
FN6787.0
Initial Release
Products
Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products
address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks.
Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a
complete list of Intersil product families.
To report errors or suggestions for this datasheet, please go to: www.intersil.com/askourstaff
For additional products, see www.intersil.com/product_tree
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6787.2
July 12, 2012
36
D2-926xx
Low Plastic Quad Flatpack Packages (LQFP)
Q128.14x14
128 LEAD LOW PLASTIC QUAD FLATPACK PACKAGE .4
MM PITCH
4X
0.2 Y T-U Z
D
MILLIMETERS
PIN 1
97
128
Z
SYMBOL
MIN
-
NOM
MAX
1.60
0.15
1.45
0.23
0.19
0.20
0.16
NOTES
A
A1
A2
b
-
1
96
0.05
1.35
0.13
0.13
0.09
0.09
-
1.40
-
0.16
4
b1
c
-
-
-
-
U
T
c1
D
-
16 BSC
14 BSC
16 BSC
14 BSC
0.60
-
E
E1
-
D1
E
3
-
E1
L
3
0.45
0.75
-
65
32
L1
R1
R2
S
1.00 REF
-
-
0.08
0.08
0.20
0°
-
0.20
-
-
33
64
-
-
-
-
D1
0.2 H T-U Z
0
3.5°
7°
-
4X
01
02
03
N
0°
-
-
-
11°
11°
12°
13°
13°
-
12°
-
DETAIL
0.080 Y
F
128
-
H
Y
e
0.40 BSC
-
Rev. 1 7/11
NOTES:
128X b
1. Dimensions are in millimeters. Dimensions in ( ) for Refer-
ence Only.
e
124X
SEATING PLANE
0.07
b1
Y T-U
c1
M
2. Dimensions and tolerances per AMSEY14.5M-1994.
3. Dimensions D1 and E1 are excluding mold protrusion. Al-
lowable protrusion is 0.25 per side. Dimensions D1 and E1
are exclusive of mold mismatch and determined by datum
plane H.
c
0.05
b
PLATING
02
4. Dimension bdoesnotincludedambarprotrusion. Allowable
dambar protrusion shall not cause the lead width to exceed
the maximum b dimension by more than 0.08mm. Dambar
cannot be located at the lower radius or the foot. Minimum
space between protrusion and an adjacent lead is 0.07 mm.
01
R1
A2
A
R2
0 3
0
A1
S
L
0.25 GAUGE
PLANE
(L1)
DETAIL
F
FN6787.2
July 12, 2012
37
D2-926xx
Package Outline Drawing
L72.10x10F
72 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 1, 4/12
A
10.00
6
4X 8.50
6
PIN 1
INDEX AREA
B
PIN 1
INDEX AREA
55
72
1
54
68X 0.50
EXP. DAP
7.70 SQ.
10.00
37
18
(4X)
0.15
36
19
72X 0.25
4
TOP VIEW
0.10 M C A B
SEE DETAIL "Z"
BOTTOM VIEW
SEE DETAIL "X"
0.90 MAX
C
0.10 C
0.08 C
SEATING PLANE
68X 0.50
(0.75)
72X 0.25
9.80 SQ
5
C
0 . 2 REF
37
7.70 SQ
(0.40)
0 . 00 MIN.
0 . 05 MAX.
36
(0.271)
DETAIL “Y”
72X 0.60
DETAIL "Z"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
4.
Unless otherwise specified, tolerance : Decimal ± 0.05
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
Tiebar shown (if present) is a non-functional feature.
5.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Package outline compliant to JESD-MO220.
FN6787.2
July 12, 2012
38
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