EL5263IYZ-T13 [INTERSIL]

500MHz Low Power Current Feedback Amplifiers with Enable; 500MHz的低功耗电流反馈放大器与启用
EL5263IYZ-T13
型号: EL5263IYZ-T13
厂家: Intersil    Intersil
描述:

500MHz Low Power Current Feedback Amplifiers with Enable
500MHz的低功耗电流反馈放大器与启用

放大器
文件: 总15页 (文件大小:333K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
EL5162, EL5163, EL5262, EL5263, EL5362  
®
Data Sheet  
January 4, 2008  
FN7388.10  
500MHz Low Power Current Feedback  
Amplifiers with Enable  
Features  
• 500MHz to 3dB bandwidth  
• 4000V/µs slew rate  
The EL5162, EL5163, EL5262, EL5263, and EL5362 are  
current feedback amplifiers with a bandwidth of 500MHz.  
This makes these amplifiers ideal for today’s high speed  
video and monitor applications.  
• 1.5mA supply current  
• Single and dual supply operation, from 5V to 12V supply  
span  
With a supply current of just 1.5mA and the ability to run  
from a single supply voltage from 5V to 12V, these amplifiers  
are also ideal for handheld, portable or battery-powered  
equipment.  
• Fast enable/disable (EL5162, EL5262 and EL5362 only)  
• Available in SOT-23 packages  
• Pb-free available (RoHS compliant)  
The EL5162 also incorporates an enable and disable  
function to reduce the supply current to 100µA typical per  
amplifier. Allowing the CE pin to float or applying a low logic  
level will enable the amplifier.  
• High speed, 1.4GHz product available (EL5167 and  
EL5167)  
• High speed, 4mA, 630MHz product available (EL5164 and  
EL5165)  
The EL5162 is available in 6 Ld SOT-23 and 8 Ld SOIC  
packages, the EL5163 in 5 Ld SOT-23 and SC-70 packages,  
the EL5262 in the 10 Ld MSOP package, the EL5263 in 8 Ld  
MSOP and SO packages, and the EL5362 in 16 Ld SOIC  
(0.150”) and QSOP packages. All operate over the industrial  
temperature range of -40°C to +85°C.  
Applications  
• Battery-powered equipment  
• Handheld, portable devices  
• Video amplifiers  
• Cable drivers  
• RGB amplifiers  
Test equipment  
• Instrumentation  
• Current to voltage converters  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
1
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.  
Copyright Intersil Americas Inc. 2004, 2005, 2007, 2008. All Rights Reserved.  
All other trademarks mentioned are the property of their respective owners.  
EL5162, EL5163, EL5262, EL5263, EL5362  
Ordering Information  
PART NUMBER  
PART MARKING  
5162IS  
PACKAGE  
PKG. DWG. #  
MDP0027  
EL5162IS  
8 Ld SOIC (150 mil)  
8 Ld SOIC (150 mil)  
8 Ld SOIC (150 mil)  
EL5162IS-T7*  
5162IS  
5162IS  
5162ISZ  
5162ISZ  
5162ISZ  
j
MDP0027  
MDP0027  
MDP0027  
MDP0027  
MDP0027  
MDP0038  
MDP0038  
MDP0038  
MDP0038  
MDP0038  
MDP0038  
MDP0038  
MDP0038  
P5.049  
EL5162IS-T13*  
EL5162ISZ (Note)  
EL5162ISZ-T7* (Note)  
EL5162ISZ-T13* (Note)  
EL5162IW-T7*  
8 Ld SOIC (150 mil) (Pb-free)  
8 Ld SOIC (150 mil) (Pb-free)  
8 Ld SOIC (150 mil) (Pb-free)  
6 Ld SOT-23  
EL5162IW-T7A*  
j
6 Ld SOT-23  
EL5162IWZ-T7* (Note)  
EL5162IWZ-T7A* (Note)  
EL5163IW-T7*  
BAKA  
BAKA  
d
6 Ld SOT-23 (Pb-free)  
6 Ld SOT-23 (Pb-free)  
5 Ld SOT-23  
EL5163IW-T7A*  
d
5 Ld SOT-23  
EL5163IWZ-T7* (Note)  
EL5163IWZ-T7A* (Note)  
EL5163IC-T7*  
BALA  
5 Ld SOT-23 (Pb-free)  
5 Ld SOT-23 (Pb-free)  
5 Ld SC-70 (1.25mm)  
BALA  
E
EL5163IC-T7A*  
E
5 Ld SC-70 (1.25mm)  
P5.049  
EL5163ICZ-T7* (Note)  
EL5163ICZ-T7A* (Note)  
EL5262IY  
BDA  
5 Ld SC-70 (1.25mm) (Pb-free)  
5 Ld SC-70 (1.25mm) (Pb-free)  
10 Ld MSOP (3.0mm)  
10 Ld MSOP (3.0mm)  
10 Ld MSOP (3.0mm)  
10 Ld MSOP (3.0mm) (Pb-free)  
10 Ld MSOP (3.0mm) (Pb-free)  
10 Ld MSOP (3.0mm) (Pb-free)  
8 Ld SOIC (150 mil)  
P5.049  
BDA  
P5.049  
BLAAA  
BLAAA  
BLAAA  
BBTAA  
BBTAA  
BBTAA  
5263IS  
5263IS  
5263IS  
5263ISZ  
5263ISZ  
5263ISZ  
BMAAA  
BMAAA  
BMAAA  
BBBJA  
BBBJA  
BBBJA  
EL5362IS  
EL5362IS  
EL5362IS  
MDP0043  
MDP0043  
MDP0043  
MDP0043  
MDP0043  
MDP0043  
MDP0027  
MDP0027  
MDP0027  
MDP0027  
MDP0027  
MDP0027  
MDP0043  
MDP0043  
MDP0043  
MDP0043  
MDP0043  
MDP0043  
MDP0027  
MDP0027  
MDP0027  
EL5262IY-T7*  
EL5262IY-T13*  
EL5262IYZ (Note)  
EL5262IYZ-T7* (Note)  
EL5262IYZ-T13* (Note)  
EL5263IS  
EL5263IS-T7*  
8 Ld SOIC (150 mil)  
EL5263IS-T13*  
8 Ld SOIC (150 mil)  
EL5263ISZ (Note)  
EL5263ISZ-T7* (Note)  
EL5263ISZ-T13* (Note)  
EL5263IY  
8 Ld SOIC (150 mil) (Pb-free)  
8 Ld SOIC (150 mil) (Pb-free)  
8 Ld SOIC (150 mil) (Pb-free)  
8 Ld MSOP (3.0mm)  
EL5263IY-T7*  
8 Ld MSOP (3.0mm)  
EL5263IY-T13*  
8 Ld MSOP (3.0mm)  
EL5263IYZ (Note)  
EL5263IYZ-T7* (Note)  
EL5263IYZ-T13* (Note)  
EL5362IS  
8 Ld MSOP (3.0mm) (Pb-free)  
8 Ld MSOP (3.0mm) (Pb-free)  
8 Ld MSOP (3.0mm) (Pb-free)  
16 Ld SOIC (150 mil)  
EL5362IS-T7*  
16 Ld SOIC (150 mil)  
EL5362IS-T13*  
16 Ld SOIC (150 mil)  
FN7388.10  
January 4, 2008  
2
EL5162, EL5163, EL5262, EL5263, EL5362  
Ordering Information (Continued)  
PART NUMBER  
PART MARKING  
EL5362ISZ  
EL5362ISZ  
EL5362ISZ  
5362IU  
PACKAGE  
16 Ld SOIC (150 mil) (Pb-free)  
16 Ld SOIC (150 mil) (Pb-free)  
16 Ld SOIC (150 mil) (Pb-free)  
16 Ld QSOP (150 mil)  
PKG. DWG. #  
MDP0027  
EL5362ISZ (Note)  
EL5362ISZ-T7* (Note)  
EL5362ISZ-T13* (Note)  
EL5362IU  
MDP0027  
MDP0027  
MDP0040  
MDP0040  
MDP0040  
MDP0040  
MDP0040  
MDP0040  
EL5362IU-T7*  
5362IU  
16 Ld QSOP (150 mil)  
EL5362IU-T13*  
5362IU  
16 Ld QSOP (150 mil)  
EL5362IUZ (Note)  
EL5362IUZ-T7* (Note)  
EL5362IUZ-T13* (Note)  
5362IUZ  
16 Ld QSOP (Pb-free)  
5362IUZ  
16 Ld QSOP (Pb-free)  
5362IUZ  
16 Ld QSOP (Pb-free)  
*Please refer to TB347 for details on reel specifications.  
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100%  
matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.  
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J  
STD-020.  
FN7388.10  
January 4, 2008  
3
EL5162, EL5163, EL5262, EL5263, EL5362  
Pinouts  
EL5162  
(8 LD SOIC)  
TOP VIEW  
EL5162  
(6 LD SOT-23)  
TOP VIEW  
EL5163  
(5 LD SOT-23, SC-70)  
TOP VIEW  
NC  
IN-  
1
2
3
4
8
7
6
5
CE  
OUT  
VS-  
IN+  
1
2
3
6
5
4
VS+  
CE  
OUT  
VS-  
IN+  
1
2
3
5
VS+  
VS+  
OUT  
NC  
-
+
+
-
+
-
IN+  
VS-  
IN-  
4
IN-  
EL5262  
(10 LD MSOP)  
TOP VIEW  
EL5263  
(8 LD SOIC, MSOP)  
EL5362  
(16 LD SOIC, QSOP)  
TOP VIEW  
TOP VIEW  
OUT  
IN-  
1
2
3
4
5
10 VS+  
OUT1  
IN-  
1
2
3
4
8
7
6
5
VS+  
OUT2  
IN-  
INA+  
CEA  
VS-  
1
2
3
4
5
6
7
8
16 INA-  
15 OUTA  
14 VS+  
-
+
9
8
7
6
OUT  
IN-  
-
+
-
+
IN+  
VS-  
CE  
IN+  
-
+
-
+
+
-
IN+  
CE  
VS-  
IN+  
CEB  
INB+  
NC  
13 OUTB  
12 INB-  
11 NC  
+
-
CEC  
INC+  
10 OUTC  
9
INC-  
FN7388.10  
January 4, 2008  
4
EL5162, EL5163, EL5262, EL5263, EL5362  
Absolute Maximum Ratings (T = +25°C)  
Thermal Information  
A
Supply Voltage between V + and V -. . . . . . . . . . . . . . . . . . . 13.2V  
Maximum Continuous Output Current . . . . . . . . . . . . . . . . . . . 50mA  
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C  
Ambient Operating Temperature . . . . . . . . . . . . . . . .-40°C to +85°C  
Operating Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +125°C  
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Curves  
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below  
http://www.intersil.com/pbfree/Pb-FreeReflow.asp  
S
S
Slewrate of V + to V -. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1V/µs  
S
S
Maximum Voltage between IN+ and IN-, disabled. . . . . . . . . . ±1.5V  
Current into IN+, IN-, CE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±5mA  
Pin Voltages. . . . . . . . . . . . . . . . . . . . . . . . . V - -0.5V to V + +0.5V  
S
S
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and  
result in failures not covered by warranty.  
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests  
are at the specified temperature and are pulsed tests, therefore: T = T = T  
A
J
C
Electrical Specifications V + = +5V, V - = -5V, R = 750Ω for A = 1, R = 400Ω for A = 2, R = 150Ω, T = +25°C unless otherwise  
S
S
F
V
F
V
L
A
specified.  
PARAMETER  
DESCRIPTION  
CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
AC PERFORMANCE  
BW  
-3dB Bandwidth  
A
= +1, R = 500Ω, R = 598Ω  
500  
233  
30  
MHz  
MHz  
MHz  
V/µs  
V
L
F
A
= +2, R = 150Ω, R = 422Ω  
L F  
V
BW1  
SR  
0.1dB Bandwidth  
Slew Rate  
V
= -2.5V to +2.5V, A = +2, R = 100Ω  
2000  
2800  
2500  
4000  
6000  
O
V
L
(EL5262, EL5263, EL5362)  
V
= -2.5V to +2.5V, A = +2, R = 100Ω  
4000  
V/µs  
O
V
L
(EL5162, EL5163)  
t
0.1% Settling Time  
V
= -2.5V to +2.5V, A = +1  
25  
3
ns  
nV/Hz  
pA/Hz  
pA/Hz  
%
S
OUT  
V
e
Input Voltage Noise  
IN- Input Current Noise  
IN+ Input Current Noise  
N
i -  
10  
N
i +  
N
6.5  
0.05  
0.15  
dG  
dP  
Differential Gain Error (Note 1)  
Differential Phase Error (Note 1)  
A = +2  
V
A
= +2  
°
V
DC PERFORMANCE  
V
Offset Voltage  
-5  
1.5  
6
+5  
mV  
OS  
T V  
Input Offset Voltage Temperature  
Coefficient  
Measured from T  
MIN  
to T  
MAX  
µV/°C  
C
OS  
R
Transimpedance  
500  
1000  
kΩ  
OL  
INPUT CHARACTERISTICS  
CMIR  
Common Mode Input Range  
Guaranteed by CMRR test  
= ±3V  
±3  
50  
-1  
±3.3  
62  
V
dB  
CMRR  
-ICMR  
Common Mode Rejection Ratio  
- Input Current Common Mode Rejection  
+ Input Current  
V
75  
+1  
+8  
+10  
3
IN  
0.22  
0.5  
2
µA/V  
µA  
+I  
-8  
IN  
-I  
- Input Current  
-10  
0.8  
µA  
IN  
R
Input Resistance  
1.6  
1
MΩ  
pF  
IN  
IN  
C
Input Capacitance  
OUTPUT CHARACTERISTICS  
V
Output Voltage Swing  
R = 150Ω to GND  
±3.35  
±3.75  
60  
±3.6  
±3.9  
100  
±3.75  
±4.15  
V
V
O
L
R = 1kΩ to GND  
L
I
Output Current  
R = 10Ω to GND  
mA  
OUT  
L
FN7388.10  
January 4, 2008  
5
EL5162, EL5163, EL5262, EL5263, EL5362  
Electrical Specifications V + = +5V, V - = -5V, R = 750Ω for A = 1, R = 400Ω for A = 2, R = 150Ω, T = +25°C unless otherwise  
S
S
F
V
F
V
L
A
specified. (Continued)  
PARAMETER  
DESCRIPTION  
CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
SUPPLY  
I
I
I
Supply Current - Enabled, per Amplifier No load, V = 0V  
IN  
1.3  
-25  
0
1.5  
-14  
10  
2.0  
0
mA  
µA  
SON  
Supply Current - Disabled, per Amplifier No load, V = 0V  
IN  
SOFF-  
SOFF+  
+25  
µA  
PSRR  
-IPSR  
Power Supply Rejection Ratio  
DC, V = ±4.75V to ±5.25V  
65  
76  
dB  
S
- Input Current Power Supply Rejection DC, V = ±4.75V to ±5.25V  
-0.5  
0.1  
+0.5  
µA/V  
S
ENABLE (EL5162, EL5262, EL5362 ONLY)  
t
t
I
I
Enable Time  
380  
800  
5
ns  
ns  
µA  
µA  
V
EN  
Disable Time  
DIS  
CE Pin Input High Current  
CE Pin Input Low Current  
CE Input High Voltage for Power-down  
CE Input Low Voltage for Power-down  
CE = V +  
1
25  
+1  
IHCE  
ILCE  
S
CE = (V +) -5V  
-1  
0
S
V
V
V + - 1  
S
IHCE  
ILCE  
V + - 3  
V
S
NOTE:  
1. Standard NTSC test, AC signal amplitude = 286mV , f = 3.58MHz  
P-P  
FN7388.10  
January 4, 2008  
6
EL5162, EL5163, EL5262, EL5263, EL5362  
Typical Performance Curves  
+4  
+3  
+2  
+1  
0
+4  
+3  
+2  
+1  
0
V
V
R
= +5V  
= -5V  
= 375Ω  
V
V
R
R
= +5V  
= -5V  
= 500Ω  
= 598Ω  
CC  
EE  
F
CC  
EE  
L
F
-1  
-2  
-3  
-4  
-5  
-6  
-1  
-2  
-3  
-4  
-5  
-6  
100k  
1M  
10M  
100M  
1G  
100k  
1M  
10M  
100M  
1G  
FREQENCY (Hz)  
FREQUENCY (Hz)  
FIGURE 1. FREQUENCY RESPONSE FOR A = +1  
V
FIGURE 2. FREQUENCY RESPONSE FOR A = +4.6  
V
+2  
+1  
0
+3  
+2  
+1  
0
-1  
-2  
-3  
-4  
-1  
-2  
-3  
-4  
V
V
= +5V  
= -5V  
= +10  
= 150Ω  
= 375Ω  
CC  
EE  
-5  
-6  
-7  
-8  
V
V
R
R
= +5V  
= -5V  
= 150Ω  
= 422Ω  
CC  
EE  
L
F
-5  
-6  
-7  
A
V
R
R
L
F
100k  
1M  
10M  
100M  
1G  
100k  
1M  
10M  
100M  
1G  
FREQUENCY (Hz)  
FREQUENCY (Hz)  
FIGURE 3. FREQUENCY RESPONSE FOR A = +10  
V
FIGURE 4. FREQUENCY RESPONSE FOR A = +2  
V
+3  
+2  
+1  
0
+5  
A
R
R
= +1  
= 150Ω  
= 698Ω  
V
L
F
+4  
+3  
+2  
+1  
0
±6V  
-1  
-2  
-3  
-4  
-1  
-2  
-3  
-4  
-5  
V
, V  
=
±5V  
±4V  
CC EE  
V
V
R
R
= +5V  
= -5V  
= 150Ω  
= 422Ω  
CC  
EE  
L
F
±3V  
-5  
-6  
-7  
±2.5V  
1M  
10M  
100M  
500M  
100k  
100k  
1M  
10M  
100M  
1G  
FREQUENCY (Hz)  
FREQUENCY (Hz)  
FIGURE 5. FREQUENCY RESPONSE FOR A = +4  
V
FIGURE 6. FREQUENCY RESPONSE FOR VARIOUS V , V  
CC EE  
FN7388.10  
January 4, 2008  
7
EL5162, EL5163, EL5262, EL5263, EL5362  
Typical Performance Curves (Continued)  
100  
10  
1
V
V
= +5V  
= -5V  
= +2  
V
V
= +5V  
= -5V  
= +2  
CC  
EE  
CC  
EE  
INPUT RISE TIME  
1.028ns  
A
A
V
V
R
= 150Ω  
1V/DIV  
L
OUTPUT RISE  
TIME 2.218ns  
2V/DIV  
0.1  
10k  
100k  
1M  
10M  
100M  
4ns/DIV  
FREQUENCY (Hz)  
FIGURE 7. CLOSED LOOP OUTPUT IMPEDANCE  
FIGURE 8. EL5262 OUTPUT RISE TIME  
V
V
= +5V  
= -5V  
= +2  
CC  
EE  
CH 1  
A
V
INPUT FALL  
TIME 1.036ns  
1V/DIV  
R
= 150Ω  
L
OUTPUT FALL  
TIME 2.21ns  
2V/DIV  
CH 2  
CH1 = 5V  
CH2 = 200mV  
M = 100ns  
4ns/DIV  
100ns/DIV  
FIGURE 9. EL5262 OUTPUT FALL TIME  
FIGURE 10. TURN ON TIME  
0
V
V
= +5V  
= -5V  
= +2  
= 150Ω  
CC  
EE  
-10  
-20  
-30  
-40  
-50  
-60  
-70  
-80  
-90  
-100  
CH1 = 5V  
CH2 = 200mV  
M = 100ns  
A
V
R
L
CH1  
CH2  
100  
1k  
10k  
100k  
1M  
10M  
100M  
100ns/DIV  
FREQUENCY (Hz)  
FIGURE 11. TURN OFF TIME  
FIGURE 12. PSRR (V  
)
CC  
FN7388.10  
January 4, 2008  
8
EL5162, EL5163, EL5262, EL5263, EL5362  
Typical Performance Curves (Continued)  
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL  
CONDUCTIVITY TEST BOARD  
0
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
V
V
= +5V  
= -5V  
= +2  
CC  
EE  
-10  
-20  
-30  
-40  
-50  
-60  
-70  
-80  
-90  
-100  
A
V
1.250W  
R
= 150Ω  
SO16 (0.150”)  
L
θ
= +80°C/W  
JA  
909mW  
SO8  
= +110°C/W  
θ
JA  
100  
1k  
10k  
100k  
1M  
10M  
100M  
0
25  
50  
75 85 100  
125  
150  
FREQUENCY (Hz)  
AMBIENT TEMPERATURE (°C)  
FIGURE 13. PSRR (V  
)
FIGURE 14. PACKAGE POWER DISSIPATION vs AMBIENT  
TEMPERATURE  
EE  
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL  
CONDUCTIVITY TEST BOARD  
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL  
CONDUCTIVITY TEST BOARD  
1.4  
0.50  
435mW  
0.45  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
0.40  
893mW  
0.35  
SOT23-5/6  
0.30  
0.25  
0.20  
0.15  
0.10  
0.05  
0
θ
= +230°C/W  
JA  
QSOP16  
= +112°C/W  
θ
JA  
0
25  
50  
75 85 100  
125  
150  
0
25  
50  
75 85 100  
125  
150  
AMBIENT TEMPERATURE (°C)  
AMBIENT TEMPERATURE (°C)  
FIGURE 15. PACKAGE POWER DISSIPATION vs AMBIENT  
TEMPERATURE  
FIGURE 16. PACKAGE POWER DISSIPATION vs AMBIENT  
TEMPERATURE  
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL  
JEDEC JESD51-3 LOW EFFECTIVE THERMAL  
CONDUCTIVITY TEST BOARD  
CONDUCTIVITY TEST BOARD  
1.0  
1.0  
870mW  
0.9  
0.9  
909mW  
625mW  
SO16 (0.15 0”)  
= +110°C/W  
0.8  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
θ
JA  
MSOP8/10  
0.7  
θ
= +115°C/W  
JA  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
SO8  
= +160°C/W  
θ
JA  
0
25  
50  
75 85 100  
125  
0
25  
50  
75 85 100  
125  
150  
AMBIENT TEMPERATURE (°C)  
AMBIENT TEMPERATURE (°C)  
FIGURE 17. PACKAGE POWER DISSIPATION vs AMBIENT  
TEMPERATURE  
FIGURE 18. PACKAGE POWER DISSIPATION vs AMBIENT  
TEMPERATURE  
FN7388.10  
January 4, 2008  
9
EL5162, EL5163, EL5262, EL5263, EL5362  
Typical Performance Curves (Continued)  
JEDEC JESD51-3 LOW EFFECTIVE THERMAL  
CONDUCTIVITY TEST BOARD  
JEDEC JESD51-3 LOW EFFECTIVE THERMAL  
CONDUCTIVITY TEST BOARD  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
0.45  
0.40  
0.35  
0.30  
0.25  
0.20  
0.15  
0.10  
0.05  
0
391mW  
SOT23-5/6  
633mW  
θ
= +256°C/W  
JA  
QSOP16  
θ
= +158°C/W  
JA  
0
25  
50  
75 85 100  
125  
150  
0
25  
50  
75 85 100  
125  
150  
AMBIENT TEMPERATURE (°C)  
AMBIENT TEMPERATURE (°C)  
FIGURE 19. PACKAGE POWER DISSIPATION vs AMBIENT  
TEMPERATURE  
FIGURE 20. PACKAGE POWER DISSIPATION vs AMBIENT  
TEMPERATURE  
JEDEC JESD51-3 LOW EFFECTIVE THERMAL  
CONDUCTIVITY TEST BOARD  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
486mW  
MSOP8/10  
= +206°C/W  
θ
JA  
0
25  
50  
75 85 100  
125  
AMBIENT TEMPERATURE (°C)  
FIGURE 21. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE  
FN7388.10  
January 4, 2008  
10  
EL5162, EL5163, EL5262, EL5263, EL5362  
SOT-23 Package Family  
MDP0038  
e1  
D
SOT-23 PACKAGE FAMILY  
A
MILLIMETERS  
6
4
N
SYMBOL  
SOT23-5  
1.45  
0.10  
1.14  
0.40  
0.14  
2.90  
2.80  
1.60  
0.95  
1.90  
0.45  
0.60  
5
SOT23-6  
1.45  
0.10  
1.14  
0.40  
0.14  
2.90  
2.80  
1.60  
0.95  
1.90  
0.45  
0.60  
6
TOLERANCE  
MAX  
A
A1  
A2  
b
±0.05  
E1  
E
±0.15  
2
3
±0.05  
0.15  
2X  
C
D
c
±0.06  
1
2
3
0.20  
2X  
C
D
Basic  
5
e
E
Basic  
E1  
e
Basic  
0.20  
C
A-B  
D
M
B
b
NX  
Basic  
e1  
L
Basic  
±0.10  
L1  
N
Reference  
Reference  
Rev. F 2/07  
0.15  
2X  
C
A-B  
1
3
D
NOTES:  
C
1. Plastic or metal protrusions of 0.25mm maximum per side are not  
included.  
A2  
SEATING  
PLANE  
2. Plastic interlead protrusions of 0.25mm maximum per side are not  
included.  
A1  
3. This dimension is measured at Datum Plane “H”.  
0.10  
NX  
C
4. Dimensioning and tolerancing per ASME Y14.5M-1994.  
5. Index area - Pin #1 I.D. will be located within the indicated zone  
(SOT23-6 only).  
6. SOT23-5 version has no center lead (shown as a dashed line).  
(L1)  
H
A
GAUGE  
PLANE  
0.25  
c
+3°  
-0°  
L
0°  
FN7388.10  
January 4, 2008  
11  
EL5162, EL5163, EL5262, EL5263, EL5362  
Small Outline Package Family (SO)  
A
D
h X 45°  
(N/2)+1  
N
A
PIN #1  
I.D. MARK  
E1  
E
c
SEE DETAIL “X”  
1
(N/2)  
B
L1  
0.010 M  
C A B  
e
H
C
A2  
A1  
GAUGE  
PLANE  
SEATING  
PLANE  
0.010  
L
4° ±4°  
0.004 C  
b
0.010 M  
C
A
B
DETAIL X  
MDP0027  
SMALL OUTLINE PACKAGE FAMILY (SO)  
INCHES  
SO16  
(0.150”)  
SO16 (0.300”)  
(SOL-16)  
SO20  
SO24  
(SOL-24)  
SO28  
(SOL-28)  
SYMBOL  
SO-8  
0.068  
0.006  
0.057  
0.017  
0.009  
0.193  
0.236  
0.154  
0.050  
0.025  
0.041  
0.013  
8
SO-14  
0.068  
0.006  
0.057  
0.017  
0.009  
0.341  
0.236  
0.154  
0.050  
0.025  
0.041  
0.013  
14  
(SOL-20)  
0.104  
0.007  
0.092  
0.017  
0.011  
0.504  
0.406  
0.295  
0.050  
0.030  
0.056  
0.020  
20  
TOLERANCE  
MAX  
NOTES  
A
A1  
A2  
b
0.068  
0.006  
0.057  
0.017  
0.009  
0.390  
0.236  
0.154  
0.050  
0.025  
0.041  
0.013  
16  
0.104  
0.007  
0.092  
0.017  
0.011  
0.406  
0.406  
0.295  
0.050  
0.030  
0.056  
0.020  
16  
0.104  
0.007  
0.092  
0.017  
0.011  
0.606  
0.406  
0.295  
0.050  
0.030  
0.056  
0.020  
24  
0.104  
0.007  
0.092  
0.017  
0.011  
0.704  
0.406  
0.295  
0.050  
0.030  
0.056  
0.020  
28  
-
±0.003  
±0.002  
±0.003  
±0.001  
±0.004  
±0.008  
±0.004  
Basic  
-
-
-
c
-
D
1, 3  
E
-
E1  
e
2, 3  
-
L
±0.009  
Basic  
-
L1  
h
-
Reference  
Reference  
-
N
-
Rev. M 2/07  
NOTES:  
1. Plastic or metal protrusions of 0.006” maximum per side are not included.  
2. Plastic interlead protrusions of 0.010” maximum per side are not included.  
3. Dimensions “D” and “E1” are measured at Datum Plane “H”.  
4. Dimensioning and tolerancing per ASME Y14.5M-1994  
FN7388.10  
January 4, 2008  
12  
EL5162, EL5163, EL5262, EL5263, EL5362  
Small Outline Transistor Plastic Packages (SC70-5)  
D
P5.049  
VIEW C  
5 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE  
e1  
INCHES  
MIN  
MILLIMETERS  
SYMBOL  
MAX  
0.043  
0.004  
0.039  
0.012  
0.010  
0.009  
0.009  
0.085  
0.094  
0.053  
MIN  
0.80  
0.00  
0.80  
0.15  
0.15  
0.08  
0.08  
1.85  
1.80  
1.15  
MAX  
1.10  
0.10  
1.00  
0.30  
0.25  
0.22  
0.20  
2.15  
2.40  
1.35  
NOTES  
5
1
4
A
A1  
A2  
b
0.031  
0.000  
0.031  
0.006  
0.006  
0.003  
0.003  
0.073  
0.071  
0.045  
-
-
-
-
E
C
L
C
E1  
L
2
3
b
b1  
c
e
6
6
3
-
C
L
c1  
D
0.20 (0.008) M  
C
C
C
L
E
E1  
e
3
-
SEATING  
PLANE  
0.0256 Ref  
0.0512 Ref  
0.010 0.018  
0.65 Ref  
1.30 Ref  
0.26 0.46  
A2  
A1  
A
e1  
L
-
-C-  
4
-
L1  
L2  
0.017 Ref.  
0.420 Ref.  
0.15 BSC  
0.10 (0.004)  
C
0.006 BSC  
o
o
o
o
0
8
0
8
-
α
N
b
WITH  
5
5
5
PLATING  
b1  
R
0.004  
0.004  
-
0.10  
0.15  
-
R1  
0.010  
0.25  
c
c1  
Rev. 3 7/07  
NOTES:  
BASE METAL  
1. Dimensioning and tolerances per ASME Y14.5M-1994.  
2. Package conforms to EIAJ SC70 and JEDEC MO-203AA.  
4X θ1  
3. Dimensions D and E1 are exclusive of mold flash, protrusions,  
or gate burrs.  
R1  
4. Footlength L measured at reference to gauge plane.  
5. “N” is the number of terminal positions.  
R
6. These Dimensions apply to the flat section of the lead between  
0.08mm and 0.15mm from the lead tip.  
GAUGE PLANE  
SEATING  
PLANE  
7. Controlling dimension: MILLIMETER. Converted inch dimen-  
sions are for reference only.  
L
C
α
L2  
L1  
4X θ1  
VIEW C  
0.4mm  
0.75mm  
2.1mm  
0.65mm  
TYPICAL RECOMMENDED LAND PATTERN  
FN7388.10  
January 4, 2008  
13  
EL5162, EL5163, EL5262, EL5263, EL5362  
Mini SO Package Family (MSOP)  
MDP0043  
0.25 M C A B  
A
MINI SO PACKAGE FAMILY  
D
(N/2)+1  
MILLIMETERS  
N
SYMBOL  
MSOP8  
1.10  
0.10  
0.86  
0.33  
0.18  
3.00  
4.90  
3.00  
0.65  
0.55  
0.95  
8
MSOP10  
1.10  
0.10  
0.86  
0.23  
0.18  
3.00  
4.90  
3.00  
0.50  
0.55  
0.95  
10  
TOLERANCE  
Max.  
NOTES  
A
A1  
A2  
b
-
±0.05  
-
E
E1  
PIN #1  
I.D.  
±0.09  
-
+0.07/-0.08  
±0.05  
-
c
-
D
±0.10  
1, 3  
1
B
(N/2)  
E
±0.15  
-
E1  
e
±0.10  
2, 3  
Basic  
-
e
H
C
L
±0.15  
-
SEATING  
PLANE  
L1  
N
Basic  
-
Reference  
-
M
C A B  
b
0.08  
0.10 C  
Rev. D 2/07  
N LEADS  
NOTES:  
1. Plastic or metal protrusions of 0.15mm maximum per side are not  
included.  
L1  
2. Plastic interlead protrusions of 0.25mm maximum per side are  
not included.  
A
3. Dimensions “D” and “E1” are measured at Datum Plane “H”.  
4. Dimensioning and tolerancing per ASME Y14.5M-1994.  
c
SEE DETAIL "X"  
A2  
GAUGE  
PLANE  
0.25  
L
DETAIL X  
A1  
3° ±3°  
FN7388.10  
January 4, 2008  
14  
EL5162, EL5163, EL5262, EL5263, EL5362  
Quarter Size Outline Plastic Packages Family (QSOP)  
A
MDP0040  
QUARTER SIZE OUTLINE PLASTIC PACKAGES FAMILY  
D
(N/2)+1  
N
INCHES  
SYMBOL QSOP16 QSOP24 QSOP28 TOLERANCE NOTES  
A
A1  
A2  
b
0.068  
0.006  
0.056  
0.010  
0.008  
0.193  
0.236  
0.154  
0.025  
0.025  
0.041  
16  
0.068  
0.006  
0.056  
0.010  
0.008  
0.341  
0.236  
0.154  
0.025  
0.025  
0.041  
24  
0.068  
0.006  
0.056  
0.010  
0.008  
0.390  
0.236  
0.154  
0.025  
0.025  
0.041  
28  
Max.  
±0.002  
±0.004  
±0.002  
±0.001  
±0.004  
±0.008  
±0.004  
Basic  
-
PIN #1  
I.D. MARK  
E
E1  
-
-
-
1
(N/2)  
c
-
B
D
1, 3  
0.010 C A B  
E
-
e
E1  
e
2, 3  
H
-
C
SEATING  
L
±0.009  
Basic  
-
PLANE  
L1  
N
-
0.007 C A B  
b
0.004 C  
Reference  
-
Rev. F 2/07  
L1  
NOTES:  
1. Plastic or metal protrusions of 0.006” maximum per side are not  
included.  
A
2. Plastic interlead protrusions of 0.010” maximum per side are not  
included.  
c
SEE DETAIL "X"  
3. Dimensions “D” and “E1” are measured at Datum Plane “H”.  
4. Dimensioning and tolerancing per ASME Y14.5M-1994.  
0.010  
A2  
GAUGE  
PLANE  
L
A1  
4°±4°  
DETAIL X  
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.  
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without  
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and  
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result  
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see www.intersil.com  
FN7388.10  
January 4, 2008  
15  

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