FSPL230R3 [INTERSIL]
Radiation Hardened, SEGR Resistant N-Channel Power MOSFETs; 抗辐射，抗SEGR N沟道功率MOSFET
| 型号： | FSPL230R3 |
| 厂家： | 
Intersil |
| 描述： | Radiation Hardened, SEGR Resistant N-Channel Power MOSFETs |
| 文件： | 总8页 (文件大小：84K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
FSPL230R, FSPL230F
TM
Data Sheet
June 2000
File Number 4865
Radiation Hardened, SEGR Resistant
N-Channel Power MOSFETs
Features
• 9A, 200V, r
• UIS Rated
• Total Dose
= 0.170Ω
DS(ON)
Intersil Star*Power Rad Hard
MOSFETs have been specifically
TM
developed for high performance
applications in a commercial or
military space environment. Star*Power MOSFETs offer the
- Meets Pre-RAD Specifications to 100K RAD (Si)
- Rated to 300K RAD (Si)
system designer both extremely low r
and Gate
DS(ON)
• Single Event
Charge allowing the development of low loss Power
Subsystems. Star*Power FETs combine this electrical
capability with total dose radiation hardness up to 300K
RADs while maintaining the guaranteed performance for
Single Event Effects (SEE) which the Intersil FS families
have always featured.
- Safe Operating Area Curve for Single Event Effects
2
- SEE Immunity for LET of 36MeV/mg/cm with
V
up to 100% of Rated Breakdown and
of 10V Off-Bias
DS
V
GS
• Dose Rate
- Typically Survives 3E9 RAD (Si)/s at 80% BV
DSS
The Intersil portfolio of Star*Power FETs includes a family of
devices in various voltage, current and package styles. The
Star*Power family consists of Star*Power and Star*Power
Gold products. Star*Power FETS are optimized for total dose
- Typically Survives 2E12 if Current Limited to I
AS
• Photo Current
- 3.0nA Per-RAD (Si)/s Typically
and r
performance while exhibiting SEE capability at
DS(ON)
• Neutron
full rated voltage up to an LET of 37. Star*Power Gold FETs
have been optimized for SEE and Gate Charge providing
SEE performance to 80% of the rated voltage for an LET of
82 with extremely low gate charge characteristics.
- Maintain Pre-RAD Specifications
for 1E13 Neutrons/cm
2
2
- Usable to 1E14 Neutrons/cm
Symbol
This MOSFET is an enhancement-mode silicon-gate power
field effect transistor of the vertical DMOS (VDMOS)
structure. It is specifically designed and processed to be
radiation tolerant. The MOSFET is well suited for
applications exposed to radiation environments such as
switching regulation, switching converters, power
distribution, motor drives and relay drivers as well as other
power control and conditioning applications. As with
conventional MOSFETs these Radiation Hardened
MOSFETs offer ease of voltage control, fast switching
speeds and ability to parallel switching devices.
D
G
S
Packaging
TO-205AF
Reliability screening is available as either TXV or Space
equivalent of MIL-S-19500.
Formerly available as type TA45210W.
Ordering Information
G
D
S
RAD LEVEL SCREENING LEVEL PART NUMBER/BRAND
10K
Engineering samples FSPL230D1
100K
100K
300K
300K
TXV
FSPL230R3
FSPL230R4
FSPL230F3
FSPL230F4
Space
TXV
Space
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
4-1
1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Corporation. | Copyright © Intersil Corporation 2000
Star*Power™ is a trademark of Intersil Corporation.
FSPL230R, FSPL230F
o
Absolute Maximum Ratings T = 25 C, Unless Otherwise Specified
C
FSPL230R, FSPL230F
UNITS
Drain to Source Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
200
200
V
V
DS
Drain to Gate Voltage (R
GS
= 20kΩ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DGR
Continuous Drain Current
o
T
T
= 25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
9
5
A
A
A
V
C
D
D
o
= 100 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
C
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
29
±30
DM
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
GS
Maximum Power Dissipation
o
T
T
= 25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
25
10
W
W
C
T
o
= 100 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
C
T
o
Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Single Pulsed Avalanche Current, L = 100µH (See Test Figure). . . . . . . . . . . . . . . . . . . . . . . . . I
0.20
29
W/ C
A
A
A
AS
Continuous Source Current (Body Diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
9
S
SM
Pulsed Source Current (Body Diode). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
29
o
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T , T
-55 to 150
300
C
J
STG
o
Lead Temperature (During Soldering) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
(Distance >0.063in (1.6mm) from Case, 10s Max)
C
L
Weight (Typical)
1.0 (Typical)
g
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
o
Electrical Specifications
T
= 25 C, Unless Otherwise Specified
C
PARAMETER
SYMBOL
BV
TEST CONDITIONS
= 1mA, V = 0V
MIN
TYP
MAX
-
UNITS
V
Drain to Source Breakdown Voltage
Gate Threshold Voltage
I
200
-
DSS
D
GS
o
V
V
= V
DS
,
T
T
T
T
T
T
T
= -55 C
-
-
5.5
4.5
-
V
GS(TH)
GS
= 1mA
C
C
C
C
C
C
C
I
o
D
= 25 C
2.0
-
V
o
= 125 C
1.0
-
-
V
o
Zero Gate Voltage Drain Current
Gate to Source Leakage Current
I
V
V
= 160V,
= 0V
= 25 C
-
25
250
100
200
1.58
0.170
0.313
20
40
35
15
33
12
10
-
µA
µA
nA
nA
V
DSS
DS
GS
o
= 125 C
-
-
o
I
V
= ±30V
= 25 C
-
-
GSS
GS
o
= 125 C
-
-
Drain to Source On-State Voltage
Drain to Source On Resistance
V
V
= 12V, I = 9A
-
-
DS(ON)
GS
D
o
r
I
= 5A,
T
T
= 25 C
-
0.145
Ω
DS(ON)12
D
C
V
= 12V
o
GS
= 125 C
-
-
-
Ω
C
Turn-On Delay Time
Rise Time
t
V
R
R
= 100V, I = 9A,
-
ns
ns
ns
ns
nC
nC
nC
nC
nC
V
d(ON)
DD
D
= 11Ω, V = 12V,
L
GS
t
-
-
r
= 7.5Ω
GS
Turn-Off Delay Time
Fall Time
t
-
-
d(OFF)
t
-
-
f
Total Gate Charge
Gate Charge Source
Gate Charge Drain
Gate Charge at 20V
Threshold Gate Charge
Plateau Voltage
Q
V
= 0V to 12V
V
= 100V,
-
30
10
8
g(12)
GS
DD
= 9A
I
D
Q
-
gs
gd
Q
-
Q
V
= 0V to 20V
= 0V to 2V
-
45
3
g(20)
GS
Q
V
-
-
g(TH)
GS
V
I
= 9A, V
= 15V
-
6.5
1400
230
8
-
(PLATEAU)
D
DS
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
C
V
= 25V, V = 0V,
GS
-
-
pF
pF
pF
ISS
DS
f = 1MHz
C
C
-
-
OSS
-
-
RSS
o
Thermal Resistance Junction to Case
R
-
-
5.0
C/W
JC
θ
4-2
FSPL230R, FSPL230F
Source to Drain Diode Specifications
PARAMETER
Forward Voltage
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
1.5
210
-
UNITS
V
V
I
I
= 9A
-
-
-
-
-
SD
SD
Reverse Recovery Time
Reverse Recovery Charge
t
= 9A, dI /dt = 100A/µs
ns
rr
SD
SD
Q
1.2
µC
RR
o
Electrical Specifications up to 300K RAD
T
= 25 C, Unless Otherwise Specified
C
MIN
MAX
MIN
300K RAD
200
MAX
PARAMETER
SYMBOL
BV
TEST CONDITIONS
= 0, I = 1mA
100K RAD
UNITS
Drain to Source Breakdown Volts (Note 3)
V
200
-
V
V
DSS
GS
D
Gate to Source Threshold Volts
Gate to Body Leakage
Zero Gate Leakage
(Note 3)
V
V
= V , I = 1mA
DS
2.0
4.5
1.5
4.5
100
50
GS(TH)
GS
D
(Notes 2, 3)
(Note 3)
I
V
= ±30V, V
= 0V
-
-
-
-
100
25
nA
µA
V
GSS
GS
DS
= 160V
I
V
= 0, V
DSS
GS DS
Drain to Source On-State Volts
Drain to Source On Resistance
NOTES:
(Notes 1, 3)
(Notes 1, 3)
V
V
= 12V, I = 9A
1.58
0.170
-
-
1.71
0.185
DS(ON)
GS
D
r
V
= 12V, I = 5A
Ω
DS(ON)12
GS
D
1. Pulse test, 300µs Max.
2. Absolute value.
3. Insitu Gamma bias must be sampled for both V
= 12V, V
DS
= 0V and V
GS
= 0V, V
= 80% BV
.
GS
DS
DSS
Single Event Effects (SEB, SEGR) Note 4
ENVIRONMENT (NOTE 5)
APPLIED
BIAS
(NOTE 6)
MAXIMUM
ION
TYPICAL LET
(MeV/mg/cm)
TYPICAL
RANGE (µ)
V
GS
(V)
TEST
SYMBOL
SEESOA
SPECIES
V
BIAS (V)
DS
Single Event Effects Safe Operating Area
Br
Br
I
37
37
60
60
82
82
36
36
32
32
28
28
-10
-15
-2
200
160
200
I
-8
160
Au
Au
0
160
-5
120
NOTES:
4. Testing conducted at Brookhaven National Labs.
2
o
5. Fluence = 1E5 ions/cm (typical), T = 25 C.
6. Does not exhibit Single Event Burnout (SEB) or Single Event Gate Rupture (SEGR).
Performance Curves Unless Otherwise Specified
2
LET = 37MeV/mg/cm , RANGE = 36µ
2
240
200
160
120
80
LET = 60MeV/mg/cm , RANGE = 32µ
2
LET = 82MeV/mg/cm , RANGE = 28µ
LET = 37 BROMINE
2
240
200
160
120
80
FLUENCE = 1E5 IONS/cm (TYPICAL)
o
TEMP = 25 C
LET = 82 GOLD
40
LET = 60 IODINE
-15 -20
40
0
0
-5
-10
-25
-30
0
0
-4
-8
-12
-16
-20
V
GS
V
(V)
GS
FIGURE 1. SINGLE EVENT EFFECTS SAFE OPERATING AREA
FIGURE 2. TYPICAL SEE SIGNATURE CURVE
4-3
FSPL230R, FSPL230F
Performance Curves Unless Otherwise Specified (Continued)
1E-3
10
8
1E-4
ILM = 10A
30A
6
1E-5
1E-6
1E-7
100A
4
300A
2
0
-50
10
30
100
300
1000
0
50
100
o
150
DRAIN SUPPLY (V)
T
, CASE TEMPERATURE ( C)
C
FIGURE 3. TYPICAL DRAIN INDUCTANCE REQUIRED TO
LIMIT GAMMA DOT CURRENT TO I
FIGURE 4. MAXIMUM CONTINUOUS DRAIN CURRENT vs
TEMPERATURE
AS
100
10
1
o
T
= 25 C
C
12V
Q
G
100µs
Q
Q
GD
GS
1ms
V
G
10ms
OPERATION IN THIS
AREA MAY BE
LIMITED BY r
DS(ON)
10
, DRAIN TO SOURCE VOLTAGE (V)
0.1
1
100
1000
CHARGE
V
DS
FIGURE 5. FORWARD BIAS SAFE OPERATING AREA
FIGURE 6. BASIC GATE CHARGE WAVEFORM
50
2.5
PULSE DURATION = 250ms, V
GS
= 12V, I = 5A
D
V
= 14V
= 12V
= 10V
= 8V
GS
V
GS
40
30
20
10
0
2.0
1.5
1.0
0.5
0.0
V
GS
V
GS
V
= 6V
GS
V
= 6V
GS
0
2
4
6
8
10
-80
-40
0
40
80
120
160
V
, DRAIN TO SOURCE VOLTAGE (V)
DS
o
T , JUNCTION TEMPERATURE ( C)
J
FIGURE 7. TYPICAL NORMALIZED r
TEMPERATURE
vs JUNCTION
FIGURE 8. TYPICAL OUTPUT CHARACTERISTICS
DS(ON)
4-4
FSPL230R, FSPL230F
Performance Curves Unless Otherwise Specified (Continued)
10
1
0.5
0.2
0.1
0.1
0.05
0.02
0.01
P
DM
SINGLE PULSE
0.01
NOTES:
DUTY FACTOR: D = t /t
t
1
2
+ T
1
t
PEAK T = P
DM
x Z
2
J
JC
C
θ
0.001
-5
-4
-3
10
-2
-1
10
0
1
10
10
10
t, RECTANGULAR PULSE DURATION (s)
10
10
FIGURE 9. NORMALIZED MAXIMUM TRANSIENT THERMAL RESPONSE
100
o
STARTING T = 25 C
J
10
1
o
STARTING T = 150 C
J
IF R = 0
AV
IF R ≠ 0
t
= (L) (I ) / (1.3 RATED BV
- V
DD
)
AS DSS
t
= (L/R) ln [(I *R) / (1.3 RATED BV
- V ) + 1]
DD
AV
AS
DSS
0.1
0.01
0.1
1
10
t
, TIME IN AVALANCHE (ms)
AV
FIGURE 10. UNCLAMPED INDUCTIVE SWITCHING
Test Circuits and Waveforms
ELECTRONIC SWITCH OPENS
WHEN I IS REACHED
AS
V
DS
L
BV
+
I
-
DSS
CURRENT
TRANSFORMER
AS
t
P
V
DS
I
AS
V
VARY t TO OBTAIN
DD
P
+
50Ω
REQUIRED PEAK I
AS
V
DD
V
≤ 20V
GS
-
50V-150V
DUT
50Ω
t
P
0V
t
AV
FIGURE 11. UNCLAMPED ENERGY TEST CIRCUIT
FIGURE 12. UNCLAMPED ENERGY WAVEFORMS
4-5
FSPL230R, FSPL230F
Test Circuits and Waveforms
t
t
ON
OFF
t
d(OFF)
V
DD
t
d(ON)
t
t
f
r
R
L
V
DS
90%
90%
V
DS
V
= 12V
GS
10%
10%
DUT
0V
90%
50%
R
GS
50%
V
GS
PULSE WIDTH
10%
FIGURE 13. RESISTIVE SWITCHING TEST CIRCUIT
FIGURE 14. RESISTIVE SWITCHING WAVEFORMS
Screening Information
Screening is performed in accordance with the latest revision in effect of MIL-S-19500, (Screening Information Table).
o
Delta Tests and Limits (JANTXV Equivalent, JANS Equivalent) T = 25 C, Unless Otherwise Specified
C
PARAMETER
Gate to Source Leakage Current
Zero Gate Voltage Drain Current
Drain to Source On Resistance
Gate Threshold Voltage
NOTES:
SYMBOL
TEST CONDITIONS
= ±30V
GS
MAX
UNITS
nA
I
V
±20 (Note 7)
±25 (Note 7)
±20% (Note 8)
±20% (Note 8)
GSS
I
V
= 80% Rated Value
o
µA
DSS
DS
r
T
= 25 C at Rated I
D
Ω
DS(ON)
C
V
I
= 1.0mA
V
GS(TH)
D
7. Or 100% of Initial Reading (whichever is greater).
8. Of Initial Reading.
Screening Information
TEST
JANTXV EQUIVALENT
JANS EQUIVALENT
= 20V, L = 0.1mH; Limit = 29A
Unclamped Inductive Switching
Thermal Response
Gate Stress
V
= 20V, L = 0.1mH; Limit = 29A
V
GS(PEAK)
GS(PEAK)
t
= 10ms; V = 25V; I = 1A; LIMIT = 60mV
t
= 10ms; V = 25V; I = 1A; LIMIT = 60mV
H
H
H
H
H
H
V
= 45V, t = 250µs
V
= 45V, t = 250µs
GS
GS
Pind
Optional
Required
Pre Burn-In Tests (Note 9)
MIL-S-19500 Group A,
Subgroup 2 (All Static Tests at 25 C)
MIL-S-19500 Group A,
Subgroup 2 (All Static Tests at 25 C)
o
o
Steady State Gate
Bias (Gate Stress)
MIL-STD-750, Method 1042, Condition B
MIL-STD-750, Method 1042, Condition B
V
= 80% of Rated Value,
V
= 80% of Rated Value,
GS
GS
o
o
T = 150 C, Time = 48 hours
T = 150 C, Time = 48 hours
A
A
Interim Electrical Tests (Note 9)
All Delta Parameters Listed in the Delta Tests
and Limits Table
All Delta Parameters Listed in the Delta Tests
and Limits Table
Steady State Reverse
Bias (Drain Stress)
MIL-STD-750, Method 1042, Condition A
MIL-STD-750, Method 1042, Condition A
V
= 80% of Rated Value,
V
= 80% of Rated Value,
DS
DS
o
o
T = 150 C, Time = 160 hours
T = 150 C, Time = 240 hours
A
A
PDA
10%
5%
Final Electrical Tests (Note 9)
MIL-S-19500, Group A, Subgroup 2
MIL-S-19500, Group A,
Subgroups 2 and 3
NOTE:
9. Test limits are identical pre and post burn-in.
Additional Tests
PARAMETER
Safe Operating Area
Thermal Impedance
SYMBOL
TEST CONDITIONS
= 160V, t = 10ms
MAX
0.5
UNITS
A
SOA
V
DS
= 500ms; V =25V; I = 1A
∆V
SD
t
230
mV
H
H
H
4-6
FSPL230R, FSPL230F
Rad Hard Data Packages - Intersil Power Transistors
TXV Equivalent
Class S - Equivalents
1. RAD HARD TXV EQUIVALENT - STANDARD DATA
PACKAGE
1. RAD HARD “S” EQUIVALENT - STANDARD DATA
PACKAGE
A. Certificate of Compliance
A. Certificate of Compliance
B. Serialization Records
C. Assembly Flow Chart
D. SEM Photos and Report
B. Assembly Flow Chart
C. Preconditioning - Attributes Data Sheet
D. Group A
E. Group B
F. Group C
G. Group D
- Attributes Data Sheet
- Attributes Data Sheet
- Attributes Data Sheet
- Attributes Data Sheet
E. Preconditioning - Attributes Data Sheet
- HTRB - Hi Temp Gate Stress Post
Reverse Bias Data and Delta Data
- HTRB - Hi Temp Drain Stress Post
Reverse Bias Delta Data
2. RAD HARD TXV EQUIVALENT - OPTIONAL DATA
PACKAGE
F. Group A
G. Group B
H. Group C
I. Group D
- Attributes Data Sheet
- Attributes Data Sheet
- Attributes Data Sheet
- Attributes Data Sheet
A. Certificate of Compliance
B. Assembly Flow Chart
C. Preconditioning - Attributes Data Sheet
- Pre and Post Burn-In Read and Record
Data
2. RAD HARD MAX. “S” EQUIVALENT - OPTIONAL
DATA PACKAGE
D. Group A
E. Group B
- Attributes Data Sheet
A. Certificate of Compliance
B. Serialization Records
C. Assembly Flow Chart
D. SEM Photos and Report
- Attributes Data Sheet
- Pre and Post Read and Record Data for
Intermittent Operating Life (Subgroup B3)
- Bond Strength Data (Subgroup B3)
- Pre and Post High Temperature Operating
Life Read and Record Data (Subgroup B6)
E. Preconditioning - Attributes Data Sheet
- HTRB - Hi Temp Gate Stress Post
Reverse Bias Data and Delta Data
- HTRB - Hi Temp Drain Stress Post
Reverse Bias Delta Data
F. Group C
G. Group D
- Attributes Data Sheet
- Pre and Post Read and Record Data for
Intermittent Operating Life (Subgroup C6)
- Bond Strength Data (Subgroup C6)
- X-Ray and X-Ray Report
- Attributes Data Sheet
F. Group A
G. Group B
H. Group C
I. Group D
- Attributes Data Sheet
- Subgroups A2, A3, A4, A5 and A7 Data
- Pre and Post RAD Read and Record Data
- Attributes Data Sheet
- Subgroups B1, B3, B4, B5 and B6 Data
- Attributes Data Sheet
- Subgroups C1, C2, C3 and C6 Data
- Attributes Data Sheet
- Pre and Post Radiation Data
4-7
FSPL230R, FSPL230F
TO-205AF
3 LEAD JEDEC TO-205AF HERMETIC METAL CAN PACKAGE
ØD
INCHES
MIN
MILLIMETERS
ØD
1
SYMBOL
MAX
0.180
0.021
0.370
0.335
0.105
0.210
0.105
0.020
0.034
0.045
0.560
-
MIN
4.07
0.41
8.89
8.01
2.42
4.83
2.42
0.26
0.72
0.74
12.70
1.91
MAX
4.57
0.53
9.39
8.50
2.66
5.33
2.66
0.50
0.86
1.14
14.22
-
NOTES
P
A
0.160
0.016
0.350
0.315
0.095
0.190
0.095
0.010
0.028
0.029
0.500
0.075
-
2, 3
-
A
Øb
ØD
SEATING
PLANE
h
ØD
e
-
1
L
Øb
4
4
4
-
e
e
1
e
2
e
1
h
j
-
o
90
2
k
-
e
2
1
3
L
P
3
5
o
45
j
k
NOTES:
1. These dimensions are within allowable dimensions of Rev. E of
JEDEC TO-205AF outline dated 11-82.
2. Lead dimension (without solder).
3. Solder coating may vary along lead length, add typically 0.002
inches (0.05mm) for solder coating.
4. Position of lead to be measured 0.100 inches (2.54mm) from bottom
of seating plane.
5. This zone controlled for automatic handling. The variation in
actual diameter within this zone shall not exceed 0.010 inches
(0.254mm).
6. Lead no. 3 butt welded to stem base.
7. Controlling dimension: Inch.
8. Revision 3 dated 6-94.
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com
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