HC5515CMZ [INTERSIL]

ITU CO/PABX SLIC with Low Power Standby; ITU CO / PABX SLIC与低功耗待机
HC5515CMZ
型号: HC5515CMZ
厂家: Intersil    Intersil
描述:

ITU CO/PABX SLIC with Low Power Standby
ITU CO / PABX SLIC与低功耗待机

文件: 总20页 (文件大小:462K)
中文:  中文翻译
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HC5515  
®
Data Sheet  
June 6, 2006  
FN4235.6  
ITU CO/PABX SLIC with Low Power  
Standby  
Features  
• DI Monolithic High Voltage Process  
The HC5515 is a subscriber line interface circuit which is  
interchangeable with Ericsson’s PBL3860 for distributed  
central office applications. Enhancements include immunity  
to circuit latch-up during hot plug and absence of false  
signaling in the presence of longitudinal currents.  
• Programmable Current Feed (20mA to 60mA)  
• Programmable Loop Current Detector Threshold and  
Battery Feed Characteristics  
• Ring Trip Detection  
• Compatible with Ericsson’s PBL3860  
• Thermal Shutdown  
The HC5515 is fabricated in a High Voltage Dielectrically  
Isolated (DI) Bipolar Process that eliminates leakage  
currents and device latch-up problems normally associated  
with junction isolated ICs. The elimination of the leakage  
currents results in improved circuit performance for wide  
temperature extremes. The latch free benefit of the DI  
process guarantees operation under adverse transient  
conditions. This process feature makes the HC5515 ideally  
suited for use in harsh outdoor environments.  
• On-Hook Transmission  
• Wide Battery Voltage Range (-24V to -58V)  
• Low Standby Power  
• -40°C to 85°C Ambient Temperature Range  
• Pb-Free Plus Anneal Available (RoHS Compliant)  
Applications  
Ordering Information  
• Digital Loop Carrier Systems  
• Fiber-In-The-Loop ONUs  
• Wireless Local Loop  
• Pair Gain  
• POTS  
PART  
NUMBER  
PART  
TEMP.  
PKG.  
MARKING RANGE (°C) PACKAGE DWG. #  
HC5515CM HC5515CM  
0 to 70  
0 to 70  
28 Ld PLCC N28.45  
• PABX  
• Hybrid Fiber Coax  
HC5515CMZ HC5515CMZ  
(Note)  
28 Ld PLCC N28.45  
(Pb-free)  
• Related Literature  
NOTE: Intersil Pb-free plus anneal products employ special Pb-free  
material sets; molding compounds/die attach materials and 100%  
matte tin plate termination finish, which are RoHS compliant and  
compatible with both SnPb and Pb-free soldering operations. Intersil  
Pb-free products are MSL classified at Pb-free peak reflow  
temperatures that meet or exceed the Pb-free requirements of  
IPC/JEDEC J STD-020.  
- AN9632, Operation of the HC5523/15 Evaluation Board  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.  
Copyright Intersil Americas Inc. 2000, 2006. All Rights Reserved  
1
All other trademarks mentioned are the property of their respective owners.  
HC5515  
Block Diagram  
RING RELAY  
DRIVER  
4-WIRE  
RINGRLY  
V
INTERFACE  
TX  
VF SIGNAL  
PATH  
RSN  
DT  
DR  
RING TRIP  
DETECTOR  
TIP  
RING  
2-WIRE  
INTERFACE  
HPT  
HPR  
LOOP CURRENT  
DETECTOR  
E0  
C1  
C2  
DIGITAL  
MULTIPLEXER  
V
BAT  
V
CC  
DET  
V
BIAS  
EE  
R
R
D
AGND  
BGND  
DC  
RSG  
FN4235.6  
June 6, 2006  
2
HC5515  
Absolute Maximum Ratings  
Thermal Information  
Temperature, Humidity  
Thermal Resistance (Typical, Note 1)  
θ
(°C/W)  
53  
JA  
Storage Temperature Range . . . . . . . . . . . . . . . . .-65°C to 150°C  
Operating Temperature Range. . . . . . . . . . . . . . . . -40°C to 110°C  
Operating Junction Temperature Range . . . . . . . .-40°C to 150°C  
28 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . .  
Continuous Power Dissipation at 70°C  
28 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5W  
Package Power Dissipation at 70°C, t < 100ms, t > 1s  
28 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4W  
Derate above . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C  
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18.8mW/°C  
PLCC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18.8mW/°C  
Maximum Junction Temperature Range . . . . . . . . . .-40°C to 150°C  
Maximum Storage Temperature Range. . . . . . . . . . .-65°C to 150°C  
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300°C  
(PLCC - Lead Tips Only)  
Power Supply (-40°C T 85°C)  
A
REP  
Supply Voltage V  
to GND . . . . . . . . . . . . . . . . . . . . 0.5V to 7V  
CC  
Supply Voltage V to GND. . . . . . . . . . . . . . . . . . . . . -7V to 0.5V  
EE  
Supply Voltage V  
to GND. . . . . . . . . . . . . . . . . . . -80V to 0.5V  
BAT  
Ground  
Voltage between AGND and BGND. . . . . . . . . . . . . -0.3V to 0.3V  
Relay Driver  
Ring Relay Supply Voltage . . . . . . . . . . . . . . . . . . . . . . 0V to 20V  
Ring Relay Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA  
Ring Trip Comparator  
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
Input Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -5mA to 5mA  
Digital Inputs, Outputs (C1, C2, E0, DET)  
to 0V  
BAT  
Die Characteristics  
Gate Count . . . . . . . . . . . . . . . . . . . . . . 543 Transistors, 51 Diodes  
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0V to V  
Output Voltage (DET Not Active) . . . . . . . . . . . . . . . . . .0V to V  
CC  
CC  
Output Current (DET). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5mA  
Tipx and Ringx Terminals (-40°C T 85°C)  
A
Tipx or Ringx Voltage, Continuous (Referenced to GND)V  
to +2V  
BAT  
-20V to +5V  
Tipx or Ringx, Pulse < 10ms, T  
Tipx or Ringx, Pulse < 10µs, T  
Tipx or Ringx, Pulse < 250ns, T  
> 10s . . . . V  
REP  
REP  
BAT  
> 10s. . . . V  
-40V to +10V  
-70V to +15V  
BAT  
BAT  
> 10s. . . V  
REP  
Tipx or Ringx Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70mA  
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .500V  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTE:  
1. θ is measured with the component mounted on an evaluation PC board in free air.  
JA  
Typical Operating Conditions  
These represent the conditions under which the part was developed and are suggested as guidelines.  
PARAMETER  
Case Temperature  
CONDITIONS  
MIN  
-40  
TYP  
MAX  
100  
UNITS  
-
-
-
-
°C  
V
V
V
V
with Respect to AGND  
-40°C to 85°C  
4.75  
-5.25  
-58  
5.25  
-4.75  
-24  
CC  
EE  
with Respect to AGND  
-40°C to 85°C  
-40°C to 85°C  
V
with Respect to BGND  
V
BAT  
Electrical Specifications T = 0°C to 70°C, V = +5V ±5%, V = -5V ±5%, V = -48V, AGND = BGND = 0V, R  
BAT DC1  
= R  
DC2  
= 41.2k,  
A
R
CC  
EE  
= 39k, R  
SG  
= 0, R = R = 0, C = 10nF, C  
= 1.5µF, Z = 600, Unless Otherwise Specified.  
D
F1 F2 HP DC L  
PARAMETER  
CONDITIONS  
MIN  
3.1  
-
TYP  
-
MAX  
-
UNITS  
Overload Level  
1% THD, Z = 600, (Note 2, Figure 1)  
V
L
PEAK  
Longitudinal Impedance (Tip/Ring)  
0 < f < 100Hz (Note 3, Figure 2)  
20  
35  
/Wire  
A
V
V
T
TX  
19  
TIP  
27  
TX  
19  
1V  
TIP  
27  
RMS  
0 < f < 100Hz  
V
300Ω  
T
E
L
C
R
T
R
R
L
T
600kΩ  
600Ω  
600kΩ  
V
TRO  
2.16µF  
I
300Ω  
DCMET  
23mA  
V
R
E
RX  
R
RX  
R
RX  
A
R
RING  
28  
RSN  
16  
RING  
28  
RSN  
16  
300kΩ  
300kΩ  
LZ = V /A  
LZ = V /A  
R R  
T
T
T
R
FIGURE 1. OVERLOAD LEVEL (TWO-WIRE PORT)  
FIGURE 2. LONGITUDINAL IMPEDANCE  
FN4235.6  
June 6, 2006  
3
HC5515  
Electrical Specifications T = 0°C to 70°C, V = +5V ±5%, V = -5V ±5%, V = -48V, AGND = BGND = 0V, R  
= R  
= 41.2k,  
= 1.5µF, Z = 600, Unless Otherwise Specified.  
A
R
CC  
EE  
BAT DC1  
DC2  
= 39k, R  
SG  
= 0, R = R = 0, C = 10nF, C  
D
F1 F2 HP DC  
L
(Continued)  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
LONGITUDINAL CURRENT LIMIT (TIP/RING)  
Off-Hook (Active)  
No False Detections, (Loop Current),  
LB > 45dB (Note 4, Figure 3A)  
20  
5
-
-
-
-
mA  
/
/
PEAK  
Wire  
On-Hook (Standby), R = ∞  
No False Detections (Loop Current) (Note 5,  
Figure 3B)  
mA  
L
PEAK  
Wire  
368Ω  
368Ω  
TIP  
27  
RSN  
16  
A
TIP  
27  
RSN  
16  
A
2.16µF  
C
39kΩ  
C
39kΩ  
R
R
E
DC1  
R
D
E
DC1  
R
D
L
L
41.2kΩ  
41.2kΩ  
-5V  
A
-5V  
A
2.16µF  
2.16µF  
C
C
R
C
DC  
DC2  
DC  
R
DC2  
R
RING  
28  
R
RING  
28  
DC  
14  
DC  
368Ω  
41.2kΩ  
14  
368Ω  
1.5µF  
1.5µF  
41.2kΩ  
DET  
DET  
FIGURE 3A. OFF-HOOK  
FIGURE 3B. ON-HOOK  
FIGURE 3. LONGITUDINAL CURRENT LIMIT  
OFF-HOOK LONGITUDINAL BALANCE  
Longitudinal to Metallic  
IEEE 455 - 1985, R , R = 368Ω  
0.2kHz < f < 4.0kHz (Note 6, Figure 4)  
53  
53  
50  
70  
70  
55  
-
-
-
dB  
LR LT  
Longitudinal to Metallic  
Metallic to Longitudinal  
R
, R = 300, 0.2kHz < f < 4.0kHz  
LR LT  
dB  
dB  
(Note 6, Figure 4)  
FCC Part 68, Para 68.310  
0.2kHz < f < 1.0kHz  
1.0kHz < f < 4.0kHz (Note 7)  
50  
53  
50  
55  
70  
55  
-
-
-
dB  
dB  
dB  
Longitudinal to 4-Wire  
Metallic to Longitudinal  
0.2kHz < f < 4.0kHz (Note 8, Figure 4)  
R
, R = 300, 0.2kHz < f < 4.0kHz  
LR LT  
(Note 9, Figure 5)  
4-Wire to Longitudinal  
0.2kHz < f < 4.0kHz (Note 10, Figure 5)  
50  
55  
-
dB  
R
LT  
R
LT  
V
TIP  
27  
V
TX  
19  
TIP  
27  
TX  
19  
300Ω  
E
2.16µF  
L
E
R
T
600kΩ  
C
TR  
R
T
V
V
TR  
TX  
600kΩ  
C
2.16µF  
V
L
E
RX  
R
R
R
LR  
RX  
RX  
RSN  
16  
RING  
28  
RSN  
16  
RING  
28  
R
300kΩ  
300kΩ  
300Ω  
LR  
FIGURE 4. LONGITUDINAL TO METALLIC AND  
LONGITUDINAL TO 4-WIRE BALANCE  
FIGURE 5. METALLIC TO LONGITUDINAL AND 4-WIRE TO  
LONGITUDINAL BALANCE  
2-Wire Return Loss  
= 20nF  
0.2kHz to 0.5kHz (Note 11, Figure 6)  
0.5kHz to 1.0kHz (Note 11, Figure 6)  
1.0kHz to 3.4kHz (Note 11, Figure 6)  
25  
27  
23  
-
-
-
-
-
-
dB  
dB  
dB  
C
HP  
TIP IDLE VOLTAGE  
Active, I = 0  
-
-
-1.5  
<0  
-
-
V
V
L
Standby, I = 0  
L
RING IDLE VOLTAGE  
Active, I = 0  
-
-
-46.5  
>-48  
-
-
V
V
L
Standby, I = 0  
L
FN4235.6  
June 6, 2006  
4
HC5515  
Electrical Specifications T = 0°C to 70°C, V = +5V ±5%, V = -5V ±5%, V = -48V, AGND = BGND = 0V, R  
= R  
= 41.2k,  
= 1.5µF, Z = 600, Unless Otherwise Specified.  
A
R
CC  
EE  
BAT DC1  
DC2  
= 39k, R  
= 0, R = R = 0, C = 10nF, C  
D
SG  
F1 F2 HP DC  
L
(Continued)  
PARAMETER  
TIP-RING Open Loop Metallic Voltage, V  
CONDITIONS  
= 0Ω  
MIN  
TYP  
MAX  
UNITS  
V
= -52V, R  
SG  
43  
-
47  
V
TR  
BAT  
4-WIRE TRANSMIT PORT (V  
Overload Level  
)
TX  
Z
> 20k, 1% THD (Note 12, Figure 7)  
3.1  
-60  
-
-
-
-
V
L
PEAK  
mV  
Output Offset Voltage  
E
= 0, Z = (Note 13, Figure 7)  
60  
G
L
Output Impedance (Guaranteed by Design)  
0.2kHz < f < 03.4kHz  
5
20  
W
2-Wire to 4-Wire (Metallic to V ) Voltage Gain 0.3kHz < f < 03.4kHz (Note 14, Figure 7)  
0.98  
1.0  
1.02  
V/V  
TX  
Z
2.16µF  
D
TIP  
27  
V
V
TX  
19  
TIP  
27  
TX  
19  
R
L
C
600Ω  
V
R
R
TR  
R
V
T
M
Z
R
600kΩ  
T
V
V
TXO  
TX  
V
Z
L
S
600kΩ  
I
DCMET  
23mA  
E
G
IN  
R
R
RX  
RX  
RING  
28  
RSN  
16  
RING RSN  
28 16  
R
300kΩ  
300kΩ  
LR  
FIGURE 6. TWO-WIRE RETURN LOSS  
FIGURE 7. OVERLOAD LEVEL (4-WIRE TRANSMIT PORT),  
OUTPUT OFFSET VOLTAGE, 2-WIRE TO 4-WIRE  
VOLTAGE GAIN AND HARMONIC DISTORTION  
4-WIRE RECEIVE PORT (RSN)  
DC Voltage  
I
= 0mA  
-
-
0
-
-
V
W
RSN  
R
Sum Node Impedance (Gtd by Design)  
0.2kHz < f < 3.4kHz  
20  
X
Current Gain-RSN to Metallic  
FREQUENCY RESPONSE (OFF-HOOK)  
2-Wire to 4-Wire  
0.3kHz < f < 3.4kHz (Note 15, Figure 8)  
900  
1000  
1100  
Ratio  
0dBm at 1.0kHz, E = 0V  
RX  
0.3kHz < f < 3.4kHz (Note 16, Figure 9)  
-0.2  
-0.2  
-0.2  
-
-
-
0.2  
0.2  
0.2  
dB  
dB  
dB  
4-Wire to 2-Wire  
4-Wire to 4-Wire  
0dBm at 1.0kHz, E = 0V  
G
0.3kHz < f < 3.4kHz (Note 17, Figure 9)  
0dBm at 1.0kHz, E = 0V  
G
0.3kHz < f < 3.4kHz (Note 18, Figure 9)  
INSERTION LOSS  
2-Wire to 4-Wire  
0dBm, 1kHz (Note 19, Figure 9)  
0dBm, 1kHz (Note 20, Figure 9)  
-0.2  
-0.2  
-
-
0.2  
0.2  
dB  
dB  
4-Wire to 2-Wire  
GAIN TRACKING (Ref = -10dBm, at 1.0kHz)  
2-Wire to 4-Wire  
+3dBm to +7dBm (Note 21, Figure 9)  
-40dBm to +3dBm (Note 21, Figure 9)  
-55dBm to -40dBm (Note 21, Figure 9)  
-40dBm to +7dBm (Note 22, Figure 9)  
-0.15  
-0.1  
-0.2  
-0.1  
-
-
-
-
0.15  
0.1  
dB  
dB  
dB  
dB  
2-Wire to 4-Wire  
2-Wire to 4-Wire  
0.2  
4-Wire to 2-Wire  
0.1  
FN4235.6  
June 6, 2006  
5
HC5515  
Electrical Specifications T = 0°C to 70°C, V = +5V ±5%, V = -5V ±5%, V = -48V, AGND = BGND = 0V, R  
= R  
= 41.2k,  
= 1.5µF, Z = 600, Unless Otherwise Specified.  
A
R
CC  
EE  
BAT DC1  
DC2  
= 39k, R  
SG  
= 0, R = R = 0, C = 10nF, C  
D
F1 F2 HP DC  
L
(Continued)  
PARAMETER  
CONDITIONS  
-55dBm to -40dBm (Note 22, Figure 9)  
MIN  
TYP  
MAX  
UNITS  
4-Wire to 2-Wire  
-0.2  
-
0.2  
dB  
GRX = ((V )(300k))/(-3)(600)  
- V  
TR1 TR2  
Where: V  
TR1  
is the Tip to Ring Voltage with V  
RSN  
= 0V  
and V  
is the Tip to Ring Voltage with V  
= -3V  
TR2  
RSN  
V
V
= 0V  
RSN  
C
R
RX  
= -3V  
RSN  
TIP  
27  
V
TIP  
27  
RSN  
16  
TX  
19  
R
300kΩ  
L
600Ω  
R
T
R
R
L
DC1  
600kΩ  
V
TX  
600Ω  
I
41.2kΩ  
V
V
DCMET  
TR  
TR  
E
G
E
RX  
C
R
R
DC  
RX  
DC2  
1/ωC < R  
L
RING  
28  
R
RING RSN  
28 16  
DC  
14  
1.5µF  
41.2kΩ  
300kΩ  
FIGURE 8. CURRENT GAIN-RSN TO METALLIC  
FIGURE 9. FREQUENCY RESPONSE, INSERTION LOSS,  
GAIN TRACKING AND HARMONIC DISTORTION  
NOISE  
Idle Channel Noise at 2-Wire  
C-Message Weighting (Note 23, Figure 10)  
-
-
8.5  
-
-
dBrnC  
dBrnp  
Psophometrical Weighting  
(Note 23, Figure 10)  
-81.5  
Idle Channel Noise at 4-Wire  
C-Message Weighting (Note 24, Figure 10)  
-
-
8.5  
-
-
dBrnC  
dBrnp  
Psophometrical Weighting  
(Note 23, Figure 10)  
-81.5  
HARMONIC DISTORTION  
2-Wire to 4-Wire  
0dBm, 1kHz (Note 25, Figure 7)  
-
-
-65  
-65  
-54  
-54  
dB  
dB  
4-Wire to 2-Wire  
0dBm, 0.3kHz to 3.4kHz (Note 26, Figure 9)  
BATTERY FEED CHARACTERISTICS  
Constant Loop Current Tolerance  
I = 2500/(R  
-40°C to 85°C (Note 27)  
+ R  
DC2  
),  
0.85I  
0.75I  
14  
I
I
1.15I  
1.25I  
20  
mA  
mA  
V
L
DC1  
L
L
L
L
L
L
R
= 41.2kΩ  
DCX  
Loop Current Tolerance (Standby)  
I = (V -3)/(R +1800),  
L
BAT  
L
-40°C to 85°C (Note 28)  
Open Circuit Voltage (V  
TIP  
- V  
)
-40°C to 85°C, (Active) R  
= ∞  
SG  
16.67  
RING  
LOOP CURRENT DETECTOR  
On-Hook to Off-Hook  
R
R
R
= 33kΩ, -40°C to 85°C  
11  
9.5  
-
465/R  
405/R  
17.2  
15.0  
-
mA  
mA  
mA  
D
D
D
D
D
Off-Hook to On-Hook  
= 33kΩ, -40°C to 85°C  
= 33kΩ, -40°C to 85°C  
Loop Current Hysteresis  
60/R  
D
TIP  
27  
V
TX  
19  
R
R
L
T
V
600Ω  
TR  
V
TX  
600kΩ  
R
RX  
RING RSN  
28 16  
300kΩ  
FIGURE 10. IDLE CHANNEL NOISE  
FN4235.6  
June 6, 2006  
6
HC5515  
Electrical Specifications T = 0°C to 70°C, V = +5V ±5%, V = -5V ±5%, V = -48V, AGND = BGND = 0V, R  
= R  
= 41.2k,  
= 1.5µF, Z = 600, Unless Otherwise Specified.  
A
R
CC  
EE  
BAT DC1  
DC2  
= 39k, R  
SG  
= 0, R = R = 0, C = 10nF, C  
D
F1 F2 HP DC  
L
(Continued)  
PARAMETER  
RING TRIP DETECTOR (DT, DR)  
Offset Voltage  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
Source Res = 0  
Source Res = 0  
Source Res = 0  
-20  
-
-
-
-
-
20  
mV  
nA  
V
Input Bias Current  
-360  
360  
Input Common-Mode Range  
Input Resistance  
V
+1  
0
-
BAT  
1
Source Res = 0, Unbalanced  
Source Res = 0, Balanced  
MΩ  
MΩ  
3
-
RING RELAY DRIVER  
V
at 25mA  
I
= 25mA  
OL  
-
-
0.2  
-
0.6  
10  
V
SAT  
Off-State Leakage Current  
V
= 12V  
µA  
OH  
DIGITAL INPUTS (E0, C1, C2)  
Input Low Voltage, V  
0
2
-
-
-
-
-
0.8  
V
IL  
Input High Voltage, V  
V
V
IH  
Input Low Current, I : C1, C2  
CC  
-
V
V
V
= 0.4V  
= 0.4V  
= 2.4V  
-200  
-100  
-
µA  
µA  
µA  
IL  
IL  
IL  
IH  
Input Low Current, I : E0  
IL  
-
Input High Current  
40  
DETECTOR OUTPUT (DET)  
Output Low Voltage, V  
I
I
= 2mA  
-
2.7  
8
-
-
0.45  
-
V
V
OL  
OL  
Output High Voltage, V  
= 100µA  
OH  
OH  
Internal Pull-Up Resistor  
POWER DISSIPATION (V  
Open Circuit State  
15  
25  
kΩ  
= -48V)  
BAT  
C1 = C2 = 0  
C1 = C2 = 1  
-
-
-
-
26.3  
37.5  
110  
1.1  
70  
85  
mW  
mW  
mW  
W
On-Hook, Standby  
On-Hook, Active  
C1 = 0, C2 = 1, R = High Impedance  
300  
1.4  
L
Off-Hook, Active  
C1 = 0, C2 = 1, R = 600Ω  
L
TEMPERATURE GUARD  
Thermal Shutdown  
150  
-
180  
°C  
SUPPLY CURRENTS (V  
= -28V)  
BAT  
Open Circuit State (C1, 2 = 0, 0)  
On-Hook  
I
I
I
I
I
I
I
I
I
-
-
-
-
-
-
-
-
-
1.3  
0.6  
2.8  
2.0  
1.2  
3.5  
2.0  
1.6  
9.5  
4.0  
5.2  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
CC  
EE  
0.35  
1.6  
BAT  
CC  
EE  
Standby State (C1, 2 = 1, 1)  
On-Hook  
0.62  
0.55  
3.7  
BAT  
CC  
EE  
Active State (C1, 2 = 0, 1)  
On-Hook  
1.1  
2.2  
BAT  
PSRR  
V
V
to 2 or 4-Wire Port  
to 2 or 4-Wire Port  
(Note 29, Figure 11)  
(Note 29, Figure 11)  
-
-
40  
40  
-
-
dB  
dB  
CC  
EE  
FN4235.6  
June 6, 2006  
7
HC5515  
Electrical Specifications T = 0°C to 70°C, V = +5V ±5%, V = -5V ±5%, V = -48V, AGND = BGND = 0V, R  
BAT DC1  
= R = 41.2k,  
DC2  
A
R
CC  
EE  
= 39k, R = 0, R = R = 0, C = 10nF, C = 1.5µF, Z = 600, Unless Otherwise Specified.  
D
SG  
F1  
F2  
HP  
DC  
L
(Continued)  
PARAMETER  
to 2 or 4-Wire Port  
CONDITIONS  
(Note 29, Figure 11)  
MIN  
TYP  
MAX  
UNITS  
V
-
40  
-
dB  
BAT  
-48V SUPPLY  
+5V SUPPLY  
-5V SUPPLY  
100mV  
, 50Hz TO 4kHz  
RMS  
TIP  
27  
V
TX  
19  
PSRR = 20 log (VTX/VIN  
)
R
T
R
L
V
600kΩ  
TX  
600Ω  
R
RX  
RING RSN  
28 16  
300kΩ  
FIGURE 11. POWER SUPPLY REJECTION RATIO  
Circuit Operation and Design Information  
The HC5515 is a current feed voltage sense Subscriber Line  
Interface Circuit (SLIC). This means that for short loop  
For loop resistances that result in a tip to ring voltage less than  
the saturation guard voltage the loop current is defined as:  
applications the SLIC provides a programed constant current to  
the tip and ring terminals while sensing the tip to ring voltage.  
2.5V  
-------------------------------------  
I
=
× 1000  
(EQ. 1)  
L
R
+ R  
DC2  
DC1  
The following discussion separates the SLIC’s operation into  
its DC and AC paths, then follows up with additional circuit  
and design information.  
where: I = Constant loop current, and  
L
R
and R  
= Loop current programming resistors.  
and R removes the VF  
DC1  
DC2  
Capacitor C  
between R  
DC1  
DC  
DC2  
Constant Loop Current (DC) Path  
signals from the battery feed control loop. The value of C  
is determined by Equation 2:  
DC  
SLIC in the Active Mode  
The DC path establishes a constant loop current that flows  
out of tip and into the ring terminal. The loop current is  
1
1
(EQ. 2)  
C
= T × --------------- + ---------------  
DC  
R
R
DC1  
DC2  
programmed by resistors R  
, R and the voltage on  
DC1 DC2  
the R  
pin (Figure 12). The R voltage is determined by  
DC  
DC  
where T = 30ms.  
the voltage across R in the saturation guard circuit. Under  
1
constant current feed conditions, the voltage drop across R  
NOTE: The minimum C  
DC  
value is obtained if R  
= R .  
DC2  
DC1  
1
sets the R  
voltage to -2.5V. This occurs when current  
DC  
Figure 13 illustrates the relationship between the tip to ring  
voltage and the loop resistance. For a 0loop resistance  
flows through R into the current source I . The R voltage  
establishes a current (I  
1
2
DC  
/(R  
) that is equal to V  
RSN  
RDC DC1  
both tip and ring are at V  
/2. As the loop resistance  
BAT  
+R  
). This current is then multiplied by 1000, in the loop  
DC2  
increases, so does the voltage differential between tip and  
ring. When this differential voltage becomes equal to the  
saturation guard voltage, the operation of the SLIC’s loop  
feed changes from a constant current feed to a resistive  
feed. The loop current in the resistive feed region is no  
longer constant but varies as a function of the loop  
resistance.  
current circuit, to become the tip and ring loop currents.  
For the purpose of the following discussion, the saturation  
guard voltage is defined as the maximum tip to ring voltage  
at which the SLIC can provide a constant current for a given  
battery and overhead voltage.  
FN4235.6  
June 6, 2006  
8
HC5515  
V
TX  
I
+
-
RSN  
R
R
R
RX  
RSN  
LOOP CURRENT  
CIRCUIT  
I
TIP  
TIP  
I
DC1  
DC2  
TIP  
I
RING  
RING  
I
C
DC  
RING  
R
DC  
SATURATION GUARD  
CIRCUIT  
-
-2.5V  
+
-
+
A
2
I
A
1
I
R
1
-
+
17.3kΩ  
2
R
SG  
1
-5V  
R
SG  
HC5515  
-5V  
-5V  
FIGURE 12. DC LOOP CURRENT  
The Saturation Guard circuit (Figure 12) monitors the tip to  
ring voltage via the transconductance amplifier A . A  
generates a current that is proportional to the tip to ring  
V
= -48V, I = 23mA, R  
= 4.0kΩ  
SG  
BAT  
L
0
-10  
-20  
-30  
-40  
-50  
V
1
1
TIP  
SATURATION  
GUARD VOLTAGE  
voltage difference. I is internally set to sink all of A ’s  
1
1
CONSTANT CURRENT  
FEED REGION  
RESISTIVE FEED  
REGION  
current until the tip to ring voltage exceeds 12.5V. When the  
tip to ring voltage exceeds 12.5V (with no R resistor) A  
SG  
1
supplies more current than I can sink. When this happens  
1
A amplifies its input current by a factor of 12 and the current  
2
through R becomes the difference between I and the  
1
2
output current from A . As the current from A increases, the  
2
2
voltage across R decreases and the output voltage on R  
1
DC  
decreases. This results in a corresponding decrease in the  
loop current. The R pin provides the ability to increase the  
SATURATION  
GUARD VOLTAGE  
V
RING  
SG  
saturation guard reference voltage beyond 12.5V. Equation  
3 gives the relationship between the R resistor value and  
0
1.2K  
LOOP RESISTANCE ()  
SG  
FIGURE 13. V vs R  
TR  
L
the programmable saturation guard reference voltage:  
Figure 14 shows the relationship between the saturation  
guard voltage, the loop current and the loop resistance.  
Notice from Figure 14 that for a loop resistance <1.2k(R  
= 4.0k) the SLIC is operating in the constant current feed  
region and for resistances >1.2kthe SLIC is operating in  
the resistive feed region. Operation in the resistive feed  
region allows long loop and off-hook transmission by  
keeping the tip and ring voltages off the rails. Operation in  
this region is transparent to the customer.  
5
5 10  
(EQ. 3)  
V
= 12.5 + -----------------------------------  
SGREF  
R
+ 17300  
SG  
SG  
where:  
V
= Saturation Guard reference voltage, and  
SGREF  
R
= Saturation Guard programming resistor.  
SG  
When the Saturation guard reference voltage is exceeded,  
the tip to ring voltage is calculated using Equation 4:  
5
16.66 + 5 10 ⁄ (R  
+ 17300)  
50  
SG  
(EQ. 4)  
CONSTANT CURRENT  
FEED REGION  
------------------------------------------------------------------------------------  
= R ×  
L
V
TR  
V
= -48V, R  
= 4.0kΩ  
SG  
R
+ (R  
+ R  
) ⁄ 600  
DC2  
BAT  
L
DC1  
40  
30  
20  
10  
0
SATURATION GUARD  
where:  
= Voltage differential between tip and ring, and  
VOLTAGE, V = 38V  
TR  
V
TR  
R = Loop resistance.  
V
= -24V, R = ∞  
SG  
BAT  
L
SATURATION GUARD  
For on-hook transmission R = , Equation 4 reduces to:  
L
RESISTIVE FEED  
REGION  
VOLTAGE, V = 13V  
TR  
5
5 10  
(EQ. 5)  
V
= 16.66 + -----------------------------------  
TR  
R
+ 17300  
0
10  
20  
LOOP CURRENT (mA)  
30  
SG  
The value of R  
should be calculated to allow maximum  
SG  
R
R
100kΩ  
100kΩ  
4kΩ  
2kΩ  
<1.2kΩ  
<400Ω  
R
R
= 4.0kΩ  
= Ω  
L
L
SG  
loop length operation. This requires that the saturation guard  
reference voltage be set as high as possible without clipping  
the incoming or outgoing VF signal. A voltage margin of -4V  
1.5kΩ  
700Ω  
SG  
FIGURE 14. V vs I and R  
L
TR  
L
FN4235.6  
June 6, 2006  
9
HC5515  
on tip and -4V on ring, for a total of -8V margin, is  
recommended as a general guideline. The value of R  
calculated using Equation 6:  
V
= Is the analog ground referenced receive signal,  
= Is used to set the 4-wire to 2-wire gain,  
RX  
is  
Z
E
SG  
RX  
= Is the AC open circuit voltage, and  
G
Z = Is the line impedance.  
L
5
5 10  
(R  
R
=
---------------------------------------------------------------------------------------------------------------------------------------------- – 17300  
SG  
+ R  
)
(AC) 2-Wire Impedance  
The AC 2-wire impedance (Z ) is the impedance looking  
DC1  
DC2  
( V  
V  
) × 1 + --------------------------------------------- 16.66V  
BAT  
MAR  
600R  
L
TR  
into the SLIC, including the fuse resistors, and is calculated  
as follows:  
(EQ. 6)  
where:  
Let V  
= 0. Then from Equation 10:  
RX  
V
V
= Battery voltage, and  
BAT  
= Voltage Margin. Recommended value of -8V to  
I
MAR  
(EQ. 12)  
(EQ. 13)  
M
------------  
V
= Z  
TX  
T
allow a maximum overload level of 3.1V  
.
1000  
PEAK  
For on-hook transmission R = , Equation 6 reduces to:  
Z
is defined as:  
L
TR  
5
5 10  
V  
V
R
= ----------------------------------------------------------------- 17300  
TR  
(EQ. 7)  
SG  
Z
= -----------  
V
16.66V  
TR  
BAT  
MAR  
I
M
Substituting in Equation 9 for V  
:
TR  
SLIC in the Standby Mode  
Overall system power is saved by configuring the SLIC in the  
standby state when not in use. In the standby state the tip  
and ring amplifiers are disabled and internal resistors are  
V
2R I  
F M  
TX  
(EQ. 14)  
Z
= ---------- + -----------------------  
TR  
I
I
M
M
Substituting in Equation 12 for V  
:
connected between tip to ground and ring to V  
. This  
TX  
BAT  
connection enables a loop current to flow when the phone  
goes off-hook. The loop current detector then detects this  
current and the SLIC is configured in the active mode for  
voice transmission. The loop current in standby state is  
calculated as follows:  
Z
T
1000  
(EQ. 15)  
(EQ. 16)  
Z
= ------------ + 2R  
TR  
F
Therefore:  
Z
= 1000 • (Z  
2R )  
T
TR  
F
V
3V  
BAT  
(EQ. 8)  
-------------------------------  
I
Equation 16 can now be used to match the SLIC’s  
L
R
+ 1800Ω  
L
impedance to any known line impedance (Z ).  
TR  
where:  
I = Loop current in the standby state,  
Example:  
L
Calculate Z to make Z = 600in series with 2.16µF.  
T
TR  
R = Loop resistance, and  
L
R = 20.  
F
V
= Battery voltage.  
BAT  
1
Z
= 1000 600 + ----------------------------------------- – 2 20  
T
6  
(AC) Transmission Path  
jω • 2.16 10  
SLIC in the Active Mode  
Z = 560kin series with 2.16nF.  
T
Figure 15 shows a simplified AC transmission model. Circuit  
analysis yields the following design equations:  
(AC) 2-Wire to 4-Wire Gain  
The 2-wire to 4-wire gain is equal to V / V  
TX TR  
.
(EQ. 9)  
(EQ. 10)  
(EQ. 11)  
V
= V + I 2R  
TR  
TX  
M
F
From Equations 9 and 10 with V  
RX  
= 0:  
V
Z 1000  
T
Z 1000 + 2R  
T F  
V
V
I
TX  
TX  
RX  
M
(EQ. 17)  
A
= ----------- = -----------------------------------------  
---------- + ----------- = ------------  
2 4  
V
Z
Z
1000  
= E I Z  
L
TR  
T
RX  
V
TR  
G
M
(AC) 4-Wire to 2-Wire Gain  
where:  
= Is the AC metallic voltage between tip and ring,  
The 4-wire to 2-wire gain is equal to V /V  
.
TR RX  
From Equations 9, 10 and 11 with E = 0:  
V
TR  
including the voltage drop across the fuse resistors R ,  
G
F
Z
V
Z
T
Z
RX  
L
TR  
--------------------------------------------  
A
= ----------- = ---------- •  
V
= Is the AC metallic voltage. Either at the ground  
4 2  
TX  
referenced 4-wire side or the SLIC tip and ring terminals,  
Z
V
(EQ. 18)  
T
RX  
------------ + 2R + Z  
F
L
1000  
I
= Is the AC metallic current,  
M
R = Is a fuse resistor,  
F
Z = Is used to set the SLIC’s 2-wire impedance,  
T
FN4235.6  
June 6, 2006  
10  
HC5515  
I
M
TIP  
A = 250  
R
F
Z
L
V
TX  
+
-
Z
TR  
+
TX  
-
+
1
V
V
TR  
+
TX  
-
V
+
-
Z
T
E
G
-
I
M
A = 4  
RSN  
Z
A = 250  
RX  
R
I
F
M
RING  
+
RX  
1000  
V
-
HC5515  
FIGURE 15. SIMPLIFIED AC TRANSMISSION CIRCUIT  
For applications where the 2-wire impedance (Z  
,
Example:  
Given: R = 20k, Z  
TR  
Equation 15) is chosen to equal the line impedance (Z ), the  
L
= 280k, Z = 562k(standard  
TX  
RX  
T
expression for A  
simplifies to:  
4-2  
value), R = 20and Z = 600,  
F
Z
1
2
T
(EQ. 19)  
The value of Z = 18.7kΩ  
--  
A
= –---------- •  
B
4 2  
Z
RX  
R
FB  
(AC) 4-Wire to 4-Wire Gain  
The 4-wire to 4-wire gain is equal to V /V  
I
2
R
V
TX  
TX  
.
TX RX  
From Equations 9, 10 and 11 with E = 0:  
-
+
G
+
TX  
I
1
V
Z
+ 2R  
F
V
Z
T
Z
RX  
L
TX  
-
--------------------------------------------  
A
= ----------- = ---------- •  
(EQ. 20)  
4 4  
Z
V
T
RX  
------------ + 2R + Z  
Z
Z
B
F
L
HC5515  
T
1000  
+
RX  
V
-
RSN  
Transhybrid Circuit  
Z
RX  
The purpose of the transhybrid circuit is to remove the receive  
signal (V ) from the transmit signal (V ), thereby preventing  
an echo on the transmit side. This is accomplished by using an  
external op amp (usually part of the CODEC) and by the  
inversion of the signal from the 4-wire receive port (RSN) to the  
CODEC/  
FILTER  
RX  
TX  
FIGURE 16. TRANSHYBRID CIRCUIT  
4-wire transmit port (V ). Figure 16 shows the transhybrid  
TX  
circuit. The input signal will be subtracted from the output signal  
Supervisory Functions  
The loop current and the ring trip detector outputs are  
if I equals I . Node analysis yields the following equation:  
1
2
multiplexed to a single logic output pin called DET. See  
V
V
RX  
Z
B
TX  
(EQ. 21)  
----------- + ----------- = 0  
Table 1 to determine the active detector for a given logic  
input. For further discussion of the logic circuitry see section  
titled “Digital Logic Inputs”.  
R
TX  
The value of Z is then:  
B
V
Before proceeding with an explanation of the loop current  
detector and the longitudinal impedance, it is important to  
understand the difference between a “metallic” and  
“longitudinal” loop currents. Figure 17 illustrates 3 different  
types of loop current encountered.  
RX  
(EQ. 22)  
-----------  
Z
= –R  
TX  
B
V
TX  
Where V /V equals 1/ A  
RX TX  
.
4-4  
Therefore:  
Z
T
Case 1 illustrates the metallic loop current. The definition of  
a metallic loop current is when equal currents flow out of tip  
and into ring. Loop current is a metallic current.  
------------ + 2R + Z  
Z
F
L
(EQ. 23)  
1000  
RX  
---------- --------------------------------------------  
Z
= R  
TX  
B
Z
Z + 2R  
L F  
T
FN4235.6  
June 6, 2006  
11  
HC5515  
Cases 2 and 3 illustrate the longitudinal loop current. The  
definition of a longitudinal loop current is a common mode  
current, that flows either out of or into tip and ring  
Taking into account the hysteresis voltage, the typical value  
of R for the off-hook to on-hook condition is:  
D
375  
R
= --------------------------------------------------------------------------  
(EQ. 26)  
D
I
simultaneously. Longitudinal currents in the on-hook state result  
OFF HOOK to ON HOOK  
in equal currents flowing through the sense resistors R and  
1
A filter capacitor (C ) in parallel with R will improve the  
accuracy of the trip point in a noisy environment. The value  
of this capacitor is calculated using the following Equation:  
R (Figure 17). And longitudinal currents in the off-hook state  
D
D
2
result in unequal currents flowing through the sense resistors  
R and R . Notice that for case 2, longitudinal currents flowing  
1
2
T
R
D
away from the SLIC, the current through R is the metallic loop  
current plus the longitudinal current; whereas the current  
1
C
= -------  
(EQ. 27)  
D
through R is the metallic loop current minus the longitudinal  
current. Longitudinal currents are generated when the phone  
line is influenced by magnetic fields (e.g., power lines).  
2
where: T = 0.5ms.  
Ring Trip Detector  
Ring trip detection is accomplished with the internal ring trip  
comparator and the external circuitry shown in Figure 18.  
The process of ring trip is initiated when the logic input pins  
are in the following states: E0 = 0, C1 = 1 and C2 = 0. This  
logic condition connects the ring trip comparator to the DET  
output, and causes the Ringrly pin to energize the ring relay.  
The ring relay connects the tip and ring of the phone to the  
external circuitry in Figure 18. When the phone is on-hook  
the DT pin is more positive than the DR pin and the DET  
output is high. For off-hook conditions DR is more positive  
than DT and DET goes low. When DET goes low, indicating  
that the phone has gone off-hook, the SLIC is commanded  
by the logic inputs to go into the active state. In the active  
state, tip and ring are once again connected to the phone  
and normal operation ensues.  
Loop Current Detector  
Figure 17 shows a simplified schematic of the loop current  
detector. The loop current detector works by sensing the  
metallic current flowing through resistors R and R . This  
1
2
results in a current (I ) out of the transconductance  
RD  
amplifier (gm ) that is equal to the product of gm and the  
1
1
metallic loop current. I  
then flows out the R pin and  
RD  
D
through resistor R to V . The value of I  
EE  
is equal to:  
RD  
D
I
I  
I
L
300  
TIP  
RING  
(EQ. 24)  
I
= ----------------------------------- = ---------  
RD  
600  
The I  
RD  
current results in a voltage drop across R that is  
D
compared to an internal 1.25V reference voltage. When the  
voltage drop across R exceeds 1.25V, and the logic is  
D
configured for loop current detection, the DET pin goes low.  
Figure 18 illustrates battery backed unbalanced ring injected  
ringing. For tip injected ringing just reverse the leads to the  
phone. The ringing source could also be balanced.  
The hysteresis resistor R adds an additional voltage  
H
effectively across R , causing the on-hook to off-hook  
D
threshold to be slightly higher than the off-hook to on-hook  
threshold.  
NOTE: The DET output will toggle at 20Hz because the DT input is  
not completely filtered by C . Software can examine the duty cycle  
RT  
Taking into account the hysteresis voltage, the typical value  
of R for the on-hook to off-hook condition is:  
D
and determine if the DET pin is low for more that half the time, if so  
the off-hook condition is indicated.  
465  
R
= --------------------------------------------------------------------------  
(EQ. 25)  
D
I
ON HOOK to OFF HOOK  
gm (I  
)
METALLIC  
1
R
D
R
H
+
-
I
RD  
C
D
R
CURRENT  
LOOP  
COMPARATOR  
D
+
-
+
TIP  
-
V
R
R
REF  
1.25V  
1
2
V
EE  
gm  
1
-5V  
RING  
CASE 1  
CASE 2  
CASE 3  
DIGITAL MULTIPLEXER  
DET  
-
+
I
I
I
LONGITUDINAL  
METALLIC LONGITUDINAL  
HC5515  
FIGURE 17. LOOP CURRENT DETECTOR  
FN4235.6  
June 6, 2006  
12  
HC5515  
transconductance amplifiers GT and GR. The output of GT  
and GR are the differential currents DI1 and DI2, which in  
turn feed the differential inputs of current sources IT and IR  
respectively. IT and IR have current gains of 250 single  
ended and 500 differentially, thus leading to a change in IT  
and IR that is equal to 500(DI) and 500(DI2).  
R
R
R
C
RT  
1
2
RT  
DT  
DR  
-
DET  
R
+
3
RING TRIP  
COMPARATOR  
TIP  
R
4
The circuit shown in Figure 19(B) illustrates the tip side of  
the longitudinal network. The advantages of a differential  
input current source are: improved noise since the noise due  
E
RG  
V
BAT  
to current source 2I is now correlated, power savings due  
O
to differential current gain and minimized offset error at the  
Operational Amplifier inputs via the two 5kresistors.  
RING  
RINGRLY  
HC5515  
RING  
RELAY  
Digital Logic Inputs  
FIGURE 18. RING TRIP CIRCUIT FOR BATTERY BACKED  
RINGING  
Table 1 is the logic truth table for the TTL compatible logic  
input pins. The HC5515 has an enable input pin (E0) and  
two control inputs pins (C1, C2).  
Longitudinal Impedance  
The enable pin E0 is used to enable or disable the DET  
output pin. The DET pin is enabled if E0 is at a logic level 0  
and disabled if E0 is at a logic level 1.  
The feedback loop described in Figure 19(A, B) realizes the  
desired longitudinal impedances from tip to ground and from  
ring to ground. Nominal longitudinal impedance is resistive  
and in the order of 22.  
A combination of the control pins C1 and C2 is used to select  
1 of the 4 possible operating states. A description of each  
operating state and the control logic follow:  
In the presence of longitudinal currents this circuit attenuates  
the voltages that would otherwise appear at the tip and ring  
terminals, to levels well within the common mode range of  
the SLIC. In fact, longitudinal currents may exceed the  
programmed DC loop current without disturbing the SLIC’s  
VF transmission capabilities.  
Open Circuit State (C1 = 0, C2 = 0)  
In this state the SLIC is effectively off. All detectors and  
both the tip and ring line drive amplifiers are powered  
down, presenting a high impedance to the line. Power  
dissipation is at a minimum.  
The function of this circuit is to maintain the tip and ring  
voltages symmetrically around V  
/2, in the presence of  
BAT  
Active State (C1 = 0, C2 = 1)  
longitudinal currents. The differential transconductance  
amplifiers G and G accomplish this by sourcing or sinking  
The tip output is capable of sourcing loop current and for  
open circuit conditions is about -4V from ground. The ring  
output is capable of sinking loop current and for open circuit  
T
R
the required current to maintain V at V  
/2.  
C
BAT  
When a longitudinal current is injected onto the tip and ring  
inputs, the voltage at VC moves from it’s equilibrium value  
conditions is about V  
normal. The loop current detector is active, E0 determines if  
the detector is gated to the DET output.  
+4V. VF signal transmission is  
BAT  
V
/2. When VC changes by the amount DVC, this change  
BAT  
appears between the input terminals of the differential  
I
LONG  
TIP CURRENT SOURCE  
WITH DIFFERENTIAL INPUTS  
I
I
LONG  
T
TIP  
20Ω  
+
I  
1
I  
TIP  
1
V  
T
-
5kΩ  
5kΩ  
G
T
R
-
LARGE  
+
R
V
/2  
BAT  
LARGE  
+
-
V
I  
C
I  
1
1
G
R
V
C
V
/2  
BAT  
R
LARGE  
I
LONG  
I  
I  
2
2
2I  
0
RING  
HC5515  
R
LARGE  
+
I
R
I
V  
TIP DIFFERENTIAL  
TRANSCONDUCTANCE AMPLIFIER  
LONG  
R
-
RING  
FIGURE 19A.  
FIGURE 19. LONGITUDINAL IMPEDANCE NETWORK  
FIGURE 19B.  
FN4235.6  
June 6, 2006  
13  
HC5515  
operating conditions and allows negative surges to be  
returned to system ground.  
Ringing State (C1 = 1, C2 = 0)  
The ring relay driver and the ring trip detector are activated.  
Both the tip and ring line drive amplifiers are powered down.  
Both tip and ring are disconnected from the line via the  
external ring relay.  
The fuse resistors (R ) serve a dual purpose of being  
F
nondestructive power dissipaters during surge and fuses  
when the line in exposed to a power cross.  
Standby State (C1 = 1, C2 = 1)  
Power-Up Sequence  
Both the tip and ring line drive amplifiers are powered down.  
Internal resistors are connected between tip to ground and ring  
The HC5515 has no required power-up sequence. This is a  
result of the Dielectrically Isolated (DI) process used in the  
fabrication of the part. By using the DI process, care is no  
longer required to insure that the substrate be kept at the  
most negative potential as with junction isolated ICs.  
to V  
to allow loop current detect in an off-hook condition.  
BAT  
The loop current and ground key detectors are both active, E0  
determines if the detector is gated to the DET output.  
AC Transmission Circuit Stability  
To ensure stability of the AC transmission feedback loop two  
Printed Circuit Board Layout  
Care in the printed circuit board layout is essential for proper  
operation. All connections to the RSN pin should be made as  
close to the device pin as possible, to limit the interference  
that might be injected into the RSN terminal. It is good  
practice to surround the RSN pin with a ground plane.  
compensation capacitors C and C  
Figure 20 (Application Circuit) illustrates their use.  
Recommended value is 2200pF.  
are required.  
TC RC  
AC-DC Separation Capacitor, C  
HP  
The high pass filter capacitor connected between pins HPT  
and HPR provides the separation between circuits sensing  
tip to ring DC conditions and circuits processing AC signals.  
The analog and digital grounds should be tied together at the  
device.  
A 10nf C  
will position the low end frequency response  
HP  
3dB break point at 48Hz. Where:  
1
(EQ. 28)  
f
= ----------------------------------------------------  
3dB  
(2 • π • R  
C  
)
HP  
HP  
where R  
= 330k.  
HP  
Thermal Shutdown Protection  
The HC5515’s thermal shutdown protection is invoked if a  
fault condition on the tip or ring causes the temperature of  
the die to exceed 160°C. If this happens, the SLIC goes into  
a high impedance state and will remain there until the  
temperature of the die cools down by about 20°C. The SLIC  
will return back to its normal operating mode, providing the  
fault condition has been removed.  
Surge Voltage Protection  
The HC5515 must be protected against surge voltages and  
power crosses. Refer to “Maximum Ratings” TIPX and  
RINGX terminals for maximum allowable transient tip and  
ring voltages. The protection circuit shown in Figure 20  
utilizes diodes together with a clamping device to protect tip  
and ring against high voltage transients.  
Positive transients on tip or ring are clamped to within a  
couple of volts above ground via diodes D and D . Under  
1
2
normal operating conditions D and D are reverse biased  
1
2
and out of the circuit.  
Negative transients on tip and ring are clamped to within a  
couple of volts below ground via diodes D and D with the  
3
4
help of a Surgector. The Surgector is required to block  
conduction through diodes D and D under normal  
3
4
FN4235.6  
June 6, 2006  
14  
HC5515  
SLIC Operating States  
TABLE 1. LOGIC TRUTH TABLE  
E0  
0
C1  
0
C2  
0
SLIC OPERATING STATE  
ACTIVE DETECTOR  
DET OUTPUT  
Logic Level High  
Open Circuit  
Active  
No Active Detector  
Loop Current Detector  
Ring Trip Detector  
0
0
1
Loop Current Status  
Ring Trip Status  
0
1
0
Ringing  
0
1
1
Standby  
Loop Current Detector  
Loop Current Status  
1
1
1
1
0
0
1
1
0
1
0
1
Open Circuit  
Active  
No Active Detector  
Loop Current Detector  
Ring Trip Detector  
Logic Level High  
Ringing  
Standby  
Loop Current Detector  
BFLE = 20 log (E /V ), E = source is removed.  
RX TR  
L
Notes  
where: E , V and E are defined in Figure 5.  
RX TR  
L
2. Overload Level (Two-Wire port) - The overload level is  
specified at the 2-wire port (V ) with the signal source at the  
11. Two-Wire Return Loss - The 2-wire return loss is computed  
TR0  
4-wire receive port (E ). I  
= 30mA, R  
= 4k,  
using the following equation:  
RX  
increase the amplitude of E  
DCMET  
until 1% THD is measured at  
SG  
RX  
r = -20 log (2V /V ).  
M
S
V
. Reference Figure 1.  
TRO  
where: Z = The desired impedance; e.g., the characteristic  
D
impedance of the line, nominally 600Ω. (Reference Figure 6).  
3. LongitudinalImpedance - The longitudinal impedance is  
computed using the following equations, where TIP and RING  
voltages are referenced to ground. L , L , V , V , A and  
12. Overload Level (4-Wire port) - The overload level is specified  
ZT ZR  
T
R
R
A
are defined in Figure 2.  
at the 4-wire transmit port (V  
) with the signal source (E ) at  
T
TXO  
= 23mA, Z = 20k, R  
G
the 2-wire port, I  
= 4k(Refer-  
DCMET  
L
SG  
(TIP) L = V /A ,  
ZT  
T
T
ence Figure 7). Increase the amplitude of E until 1% THD is  
G
(RING) L = V /A ,  
ZR  
measured at V  
. Note that the gain from the 2-wire port to  
R
R
TXO  
the 4-wire port is equal to 1.  
where: E = 1V  
(0Hz to 100Hz).  
L
RMS  
4. Longitudinal Current Limit (Off-Hook Active) - Off-Hook  
(Active, C = 1, C = 0) longitudinal current limit is determined  
13. Output Offset Voltage - The output offset voltage is specified  
with the following conditions: E = 0, I  
= 23mA, Z = ∞  
G
DCMET  
, V and Z are defined  
L
1
2
and is measured at V . E , I  
TX  
DCMET  
G
DCMET TX  
L
by increasing the amplitude of E (Figure 3A) until the 2-wire  
longitudinal balance drops below 45dB. DET pin remains low  
(no false detection).  
L
in Figure 7. Note: I  
is established with a series 600Ω  
resistor between tip and ring.  
14. Two-Wire to Four-Wire (Metallic to V ) Voltage Gain - The  
TX  
5. Longitudinal Current Limit (On-Hook Standby) - On-Hook  
2-wire to 4-wire (metallic to V ) voltage gain is computed  
TX  
(Active, C = 1, C = 1) longitudinal current limit is determined  
1
2
using the following equation.  
by increasing the amplitude of E (Figure 3B) until the 2-wire  
L
longitudinal balance drops below 45dB. DET pin remains high  
(no false detection).  
G
= (V /V ), E = 0dBm0, V , V , and E are defined  
TX TR TX TR  
2-4  
in Figure 7.  
G
G
6. Longitudinal to Metallic Balance - The longitudinal to metallic  
15. Current Gain RSN to Metallic - The current gain RSN to  
balance is computed using the following equation:  
Metallic is computed using the following equation:  
BLME = 20 log (E /V ), where: E and V  
TR TR  
Figure 4.  
are defined in  
K = I [(R  
DC1  
+ R  
DC2  
are defined in Figure 8.  
)/(V  
- V  
)] K, I , R  
DC1  
, R ,  
DC2  
L
L
M
RDC  
RSN  
M
V
and V  
RDC  
RSN  
7. Metallic to Longitudinal FCC Part 68, Para 68.310 - The  
16. Two-Wire to Four-Wire Frequency Response - The 2-wire to  
metallic to longitudinal balance is defined in this spec.  
4-wire frequency response is measured with respect to  
E
= 0dBm at 1.0kHz, E  
= 0V, I = 23mA. The  
G
RX  
DCMET  
8. Longitudinal to Four-Wire Balance - The longitudinal to 4-wire  
frequency response is computed using the following equation:  
balance is computed using the following equation:  
F
= 20 log (V /V ), vary frequency from 300Hz to  
2-4  
TX TR  
BLFE = 20 log (E /V ),: E and V are defined in Figure 4.  
TX TX  
L
L
3.4kHz and compare to 1kHz reading.  
9. Metallic to Longitudinal Balance - The metallic to  
V
, V , and E are defined in Figure 9.  
TX TR  
G
longitudinal balance is computed using the following equation:  
17. Four-Wire to Two-Wire Frequency Response - The 4-wire to  
BMLE = 20 log (E /V ), E  
TR RX  
= 0,  
L
2-wire frequency response is measured with respect to  
where: E , V and E are defined in Figure 5.  
E
= 0dBm at 1.0kHz, E = 0V, I  
= 23mA. The  
TR  
L
RX  
RX  
G
DCMET  
frequency response is computed using the following equation:  
10. Four-Wire to Longitudinal Balance - The 4-wire to longitudinal  
F
= 20 log (V /E ), vary frequency from 300Hz to  
balance is computed using the following equation:  
4-2  
TR RX  
FN4235.6  
June 6, 2006  
15  
HC5515  
3.4kHz and compare to 1kHz reading.  
and E are defined in Figure 9.  
E
= -10dBm, 1.0kHz signal, E = 0, I = 23mA and is  
DCMET  
RX  
G
computed using the following equation:  
V
TR  
RX  
G
= 20 log (V /E ) vary amplitude -40dBm to +3dBm, or  
TR RX  
4-2  
18. Four-Wire to Four-Wire Frequency Response - The 4-wire  
-55dBm to -40dBm and compare to -10dBm reading.  
to 4-wire frequency response is measured with respect to  
V
and E are defined in Figure 9. The level is specified at  
E
= 0dBm at 1.0kHz, E = 0V, I  
= 23mA. The  
TR  
RX  
RX  
G
DCMET  
the 4-wire receive port and referenced to a 600impedance  
frequency response is computed using the following equation:  
level.  
F
= 20 log (V /E ), vary frequency from 300Hz to  
TX RX  
4-4  
3.4kHz and compare to 1kHz reading.  
23. Two-Wire Idle Channel Noise - The 2-wire idle channel noise  
at V  
is specified with the 2-wire port terminated in 600(R )  
TR  
L
V
and E are defined in Figure 9.  
TX  
19. Two-Wire to Four-Wire Insertion Loss - The 2-wire to 4-wire  
insertion loss is measured with respect to E = 0dBm at 1.0kHz  
RX  
and with the 4-wire receive port grounded (Reference Figure 10).  
24. Four-Wire Idle Channel Noise - The 4-wire idle channel noise  
G
at V is specified with the 2-wire port terminated in 600(R ).  
TX  
L
input signal, E  
the following equation:  
= 0, I = 23mA and is computed using  
RX  
DCMET  
The noise specification is with respect to a 600impedance  
level at V . The 4-wire receive port is grounded (Reference  
TX  
L
= 20 log (V /V )  
TX TR  
Figure 10).  
2-4  
where: V , V , and E are defined in Figure 9. (Note: The  
TX TR  
25. Harmonic Distortion (2-Wire to 4-Wire) - The  
harmonic  
G
fuse resistors, R , impact the insertion loss. The specified  
distortion is measured with the following conditions.  
F
insertion loss is for R = 0).  
F
E
V
= 0dBm at 1kHz, I  
= 23mA. Measurement taken at  
G
DCMET  
. (Reference Figure 7).  
TX  
20. Four-Wire to Two-Wire Insertion Loss - The 4-wire to 2-wire  
insertion loss is measured based upon E  
= 0dBm, 1.0kHz  
26. Harmonic Distortion (4-Wire to 2-Wire) - The  
harmonic  
RX  
= 23mA and is computed using  
input signal, E = 0, I  
distortion is measured with the following conditions. E  
0dBm0. Vary frequency between 300Hz and 3.4kHz, I  
=
=
G
DCMET  
RX  
DCMET  
the following equation:  
23mA. Measurement taken at V . (Reference Figure 9).  
TR  
L
= 20 log (V /E ),  
TR RX  
4-2  
27. Constant Loop Current - The constant loop current is  
where: V and E are defined in Figure 9.  
TR  
RX  
calculated using the following equation:  
21. Two-Wire to Four-Wire Gain Tracking - The 2-wire to 4-wire  
I
= 2500 / (R  
+ R ).  
DC2  
L
DC1  
gain tracking is referenced to measurements taken for  
E
= -10dBm, 1.0kHz signal, E  
= 0, I = 23mA and is  
G
RX  
DCMET  
28. Standby State Loop Current - The standby state loop current  
computed using the following equation.  
is calculated using the following equation:  
G
= 20 log (V /V ) vary amplitude -40dBm to +3dBm, or  
TX TR  
2-4  
I
= [|V | - 3] / [R +1800], T = 25°C.  
BAT L A  
L
-55dBm to -40dBm and compare to -10dBm reading.  
29. Power Supply Rejection Ratio - Inject a 100mV  
signal  
RMS  
supplies. PSRR is  
V
and V are defined in Figure 9.  
TX  
TR  
(50Hz to 4kHz) on V  
, V  
and V  
BAT  
CC EE  
computed using the following equation:  
22. Four-Wire to Two-Wire Gain Tracking - The 4-wire to 2-wire  
gain tracking is referenced to measurements taken for  
PSRR = 20 log (V /V ). V and V are defined in Figure 11.  
TX IN TX IN  
Pin Descriptions  
PLCC  
SYMBOL  
DESCRIPTION  
Internally connected to output of RING power amplifier.  
1
2
RING  
SENSE  
BGND  
Battery Ground - To be connected to zero potential. All loop current and longitudinal current flow from this ground.  
Internally separate from AGND but it is recommended that it is connected to the same potential as AGND.  
4
5
6
7
8
9
V
+5V power supply.  
CC  
RINGRLY  
Ring relay driver output.  
V
Battery supply voltage, -24V to -56V.  
BAT  
R
Saturation guard programming resistor pin.  
This pin is used during manufacturing. This pin is to be left open for proper SLIC operation.  
SG  
NC  
E0  
TTL compatible logic input. Enables the DET output when set to logic level zero and disables DET output when set to  
a logic level one.  
11  
12  
DET  
C2  
Detector output. TTL compatible logic output. A zero logic level indicates that the selected detector was triggered (see  
Truth Table for selection of Ground Key detector, Loop Current detector or the Ring Trip detector). The DET output is  
an open collector with an internal pull-up of approximately 15kto V  
CC.  
TTL compatible logic input. The logic states of C1 and C2 determine the operating states (Open Circuit, Active, Ringing  
or Standby) of the SLIC.  
FN4235.6  
June 6, 2006  
16  
HC5515  
Pin Descriptions (Continued)  
PLCC  
SYMBOL  
DESCRIPTION  
13  
C1  
TTL compatible logic input. The logic states of C1 and C2 determine the operating states (Open Circuit, Active, Ringing  
or Standby) of the SLIC.  
14  
R
DC feed current programming resistor pin. Constant current feed is programmed by resistors R  
DC1  
and R  
DC2  
DC  
connected in series from this pin to the receive summing node (RSN). The resistor junction point is decoupled to AGND  
to isolate the AC signal components.  
15  
16  
AGND  
RSN  
Analog ground.  
Receive Summing Node. The AC and DC current flowing into this pin establishes the metallic loop current that flows  
between tip and ring. The magnitude of the metallic loop current is 1000 times greater than the current into the RSN  
pin. The constant current programming resistors and the networks for program receive gain and 2-wire impedance all  
connect to this pin.  
18  
19  
V
V
-5V power supply.  
EE  
Transmit audio output. This output is equivalent to the TIP to RING metallic voltage. The network for programming the  
2-wire input impedance connects between this pin and RSN.  
TX  
20  
21  
22  
23  
25  
HPR  
HPT  
RD  
RING side of AC/DC separation capacitor C . C  
is required to properly separate the ring AC current from the DC  
is connected to HPT.  
HP HP  
loop current. The other end of C  
HP  
TIP side of AC/DC separation capacitor C . C is required to properly separate the tip AC current from the DC loop  
HP HP  
current. The other end of C  
is connected to HPR.  
HP  
Loop current programming resistor. Resistor R sets the trigger level for the loop current detect circuit. A filter capacitor  
D
C
is also connected between this pin and V  
.
D
EE  
DT  
Input to ring trip comparator. Ring trip detection is accomplished by connecting an external network to a comparator in  
the SLIC with inputs DT and DR.  
DR  
Input to ring trip comparator. Ring trip detection is accomplished by connecting an external network to a comparator in  
the SLIC with inputs DT and DR.  
26  
27  
28  
TIP  
Internally connected to output of tip power amplifier.  
Output of tip power amplifier.  
SENSE  
TIPX  
RINGX  
N/C  
Output of ring power amplifier.  
3, 10 17,  
24  
No internal connection.  
FN4235.6  
June 6, 2006  
17  
HC5515  
Pinout  
HC5515  
(PLCC)  
TOP VIEW  
4
3
2
1
28 27 26  
RINGRLY  
5
6
25 DR  
24 N/C  
23 DT  
V
BAT  
R
7
SG  
8
NC  
22 RD  
21 HPT  
20 HPR  
9
E0  
10  
11  
N/C  
DET  
19 V  
TX  
12 13 14 15 16 17 18  
FN4235.6  
June 6, 2006  
18  
HC5515  
Application Circuit  
C
(NOTE 32)  
HP  
R
C
R
RT  
RT  
1
2
R
U
FB  
R
3
R
D
U
1
21 HPT  
HPR 20  
2
-5V  
R
R
R
TX  
4
22 RD  
23 DT  
V
V
19  
18  
-
TX  
+
-5V  
R
R
B
EE  
T
V
BAT  
R
RX  
25 DR  
RSN 16  
AGND 15  
PTC  
PTC  
R
F1  
27 TIPX  
R
DC1  
D
D
TIP  
D
1
2
3
CODEC/FILTER  
C
TC  
2 BGND  
R
14  
DC  
NOTE 31  
R
C
DC  
DC2  
C
4 V  
C1 13  
C2 12  
RC  
CC  
D
RING  
4
28 RINGX  
R
Surgector  
F2  
V
BAT  
K
A
DET 11  
6 V  
BAT  
G
5 RINGRLY  
E
9
8
O
D
5
R
SG  
E
7 R  
1
SG  
RINGING  
+ 90V  
+5V  
OR  
12V  
RELAY  
-5V  
(V  
)
RMS  
BAT  
D
6
R , R 200k, 5%, 1/4W  
U1 SLIC (Subscriber Line Interface Circuit)  
HC5515  
1
3
R
R
910k, 5%, 1/4W  
1.2M, 5%, 1/4W  
18.7k,1%, 1/4W  
39k, 5%, 1/4W  
2
U2 Combination CODEC/Filter e.g.  
CD22354A or Programmable CODEC/  
Filter, e.g. SLAC  
4
R
B
D
R
C
1.5µF, 20%, 10V  
DC  
R
, R  
41.2k, 5%, 1/4W  
20.0k, 1%, 1/4W  
280k, 1%, 1/4W  
562k, 1%, 1/4W  
20k, 1%, 1/4W  
150, 5%, 2W  
DC1 DC2  
C
10nF, 20%, 100V (Note 2)  
0.39µF, 20%, 100V  
2200pF, 20%, 100V  
HP  
R
FB  
C
RT  
R
RX  
C
, C  
TC RC  
R
T
TX  
RT  
Relay Relay, 2C Contacts, 5V or 12V Coil  
D - D IN4007 Diode  
R
1
5
R
Surgector SGT27S10  
R
V
V
= -28V, R  
= -48V, R  
= ∞  
SG BAT  
SG  
SG  
PTC Polyswitch TR600-150  
= 4.0k, 1/4W 5%  
BAT  
D
Diode, 1N4454  
6
R
, R  
Line Resistor, 20, 1% Match, 2 W  
Carbon column resistor or thick film on  
ceramic  
F1 F2  
NOTES:  
30. It is recommended that the anodes of D and D be shorted to ground through a battery referenced surgector (SGT27S10).  
3
4
31. To meet the specified 25dB 2-wire return loss at 200Hz, C  
needs to be 20nF, 20%, 100V.  
HP  
FIGURE 20. APPLICATION CIRCUIT  
FN4235.6  
June 6, 2006  
19  
HC5515  
Plastic Leaded Chip Carrier Packages (PLCC)  
0.042 (1.07)  
0.048 (1.22)  
0.042 (1.07)  
0.056 (1.42)  
0.004 (0.10)  
C
N28.45 (JEDEC MS-018AB ISSUE A)  
PIN (1) IDENTIFIER  
28 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE  
0.025 (0.64)  
0.045 (1.14)  
0.050 (1.27) TP  
R
INCHES  
MILLIMETERS  
C
L
SYMBOL  
MIN  
MAX  
MIN  
4.20  
MAX  
4.57  
NOTES  
A
A1  
D
0.165  
0.090  
0.485  
0.450  
0.191  
0.485  
0.450  
0.191  
0.180  
0.120  
0.495  
0.456  
0.219  
0.495  
0.456  
0.219  
-
D2/E2  
D2/E2  
2.29  
3.04  
-
12.32  
11.43  
4.86  
12.57  
11.58  
5.56  
-
C
L
E1 E  
D1  
D2  
E
3
4, 5  
VIEW “A”  
12.32  
11.43  
4.86  
12.57  
11.58  
5.56  
-
E1  
E2  
N
3
0.020 (0.51)  
MIN  
4, 5  
6
A1  
D1  
D
28  
28  
A
Rev. 2 11/97  
SEATING  
PLANE  
0.020 (0.51) MAX  
3 PLCS  
-C-  
0.026 (0.66)  
0.032 (0.81)  
0.013 (0.33)  
0.021 (0.53)  
0.025 (0.64)  
MIN  
0.045 (1.14)  
MIN  
VIEW “A” TYP.  
NOTES:  
1. Controlling dimension: INCH. Converted millimeter dimensions are  
not necessarily exact.  
2. Dimensions and tolerancing per ANSI Y14.5M-1982.  
3. Dimensions D1 and E1 do not include mold protrusions. Allowable  
mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1  
and E1 include mold mismatch and are measured at the extreme  
material condition at the body parting line.  
-C-  
4. To be measured at seating plane  
contact point.  
5. Centerline to be determined where center leads exit plastic body.  
6. “N” is the number of terminal positions.  
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.  
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without  
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and  
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result  
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see www.intersil.com  
FN4235.6  
June 6, 2006  
20  

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