HCA10009 [INTERSIL]
100MHz, Single and Dual Low Noise, Precision Operational Amplifier; 为100MHz ，单路和双路低噪声，精密运算放大器
| 型号： | HCA10009 |
| 厂家： | 
Intersil |
| 描述： | 100MHz, Single and Dual Low Noise, Precision Operational Amplifier |
| 文件： | 总10页 (文件大小：532K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HCA10009
Data Sheet
August 1999
File Number 4771
100MHz, Single and Dual Low Noise,
Precision Operational Amplifier
Features
• Gain Bandwidth Product. . . . . . . . . . . . . . . . . . . . 100MHz
• Unity Gain Bandwidth. . . . . . . . . . . . . . . . . . . . . . . 25MHz
• Slew Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25V/µs
• Low Offset Voltage . . . . . . . . . . . . . . . . . . . . . . . . . 0.3mV
• High Open Loop Gain. . . . . . . . . . . . . . . . . . . . . . . 128dB
• Channel Separation at 10kHz . . . . . . . . . . . . . . . . 110dB
• Low Noise Voltage at 1kHz. . . . . . . . . . . . . . . . 3.4nV/√Hz
• High Output Current . . . . . . . . . . . . . . . . . . . . . . . . . 56mA
• Low Supply Current per Amplifier. . . . . . . . . . . . . . . . 8mA
The HCA10009 is a high performance dielectrically isolated,
op amp, featuring precision DC characteristics while providing
excellent AC characteristics. Designed for audio, video, and
other demanding applications, noise (3.4nV/√Hz at 1kHz),
total harmonic distortion (<0.005%), and DC errors are kept to
a minimum.
The precision performance is shown by low offset voltage
(0.3mV), low bias currents (40nA), low offset currents
(15nA), and high open loop gain (128dB). The combination
of these excellent DC characteristics with the fast settling
time (0.4µs) make the HCA10009 ideally suited for precision
signal conditioning.
Applications
The unique design of the HCA10009 gives it outstanding AC
characteristics not normally associated with precision op
amps, high unity gain bandwidth (35MHz) and high slew rate
(25V/µs). Other key specifications include high CMRR (95dB)
and high PSRR (100dB). The combination of these
specifications will allow the HCA10009 to be used in RF signal
conditioning as well as video amplifiers.
• Precision Test Systems
• Active Filtering
• Small Signal Video
• Accurate Signal Processing
• RF Signal Conditioning
Pinout
Ordering Information
HCA10009
(SOIC)
TOP VIEW
PART NUMBER
(BRAND)
TEMP.
RANGE ( C)
PKG.
NO.
o
PACKAGE
8 Ld SOIC
HCA10009
0 to 75
M8.15
-BAL
-IN
1
2
3
4
8
7
6
5
+BAL
V+
+
+IN
V-
OUT
NC
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999
4-1
HCA10009
Absolute Maximum Ratings
Thermal Information
o
Supply Voltage Between V+ and V- Terminals. . . . . . . . . . . . . . 35V
Differential Input Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . 5V
Output Current Short Circuit Duration . . . . . . . . . . . . . . . . Indefinite
Thermal Resistance (Typical, Note 2)
θ
( C/W)
JA
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . .
157
o
Maximum Junction Temperature (Plastic Package) . . . . . . . 150 C
Maximum Storage Temperature Range. . . . . . . . . . -65 C to 150 C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300 C
o
o
o
Operating Conditions
(SOIC - Lead Tips Only)
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
o
o
HCA10009 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 C to 75 C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. Input is protected by back-to-back zener diodes. See applications section.
2. θ is measured with the component mounted on an evaluation PC board in free air.
JA
Electrical Specifications
V
= ±15V, Unless Otherwise Specified
SUPPLY
HCA10009
TYP
o
PARAMETER
INPUT CHARACTERISTICS
Input Offset Voltage
TEST CONDITIONS
TEMP. ( C)
MIN
MAX
UNITS
25
Full
Full
25
-
0.30
0.35
0.5
40
0.75
1.5
-
mV
mV
-
o
Average Offset Voltage Drift
Input Bias Current
-
µV/ C
-
100
200
100
150
750
1500
-
nA
nA
nA
nA
µV
µV
V
Full
25
-
70
Input Offset Current
-
15
Full
25
-
30
Input Offset Voltage Match
-
400
-
Full
25
-
Common Mode Range
Differential Input Resistance
Input Noise Voltage
±12
-
25
-
-
-
-
-
-
-
-
-
70
-
kΩ
f = 0.1Hz to 10Hz
25
0.25
6.2
3.6
3.4
4.7
1.8
0.97
<0.005
-
µV
P-P
Input Noise Voltage
f = 10Hz
f = 100Hz
f = 1000Hz
f = 10Hz
f = 100Hz
f = 1000Hz
Note 4
25
10
6
nV/√Hz
nV/√Hz
nV/√Hz
pA/√Hz
pA/√Hz
pA/√Hz
%
Density (Notes 3, 12)
25
25
4.0
8.0
2.8
1.8
-
Input Noise Current
Density (Notes 3, 12)
25
25
25
THD+N
25
TRANSFER CHARACTERISTICS
Large Signal Voltage Gain
Note 5
25
Full
Full
25
106
100
86
-
128
120
95
-
-
-
-
-
-
dB
dB
CMRR
V
= ±10V
dB
CM
-3dB
1kHz to 400kHz
Unity Gain Bandwidth
Gain Bandwidth Product
Minimum Stable Gain
35
MHz
MHz
V/V
25
-
100
-
Full
1
4-2
HCA10009
Electrical Specifications
V
= ±15V, Unless Otherwise Specified (Continued)
SUPPLY
HCA10009
TYP
o
PARAMETER
OUTPUT CHARACTERISTICS
Output Voltage Swing
TEST CONDITIONS
TEMP. ( C)
MIN
MAX
UNITS
R = 333Ω
Full
25
±10
±12
±11.5
±30
-
-
-
-
-
-
-
-
V
V
L
L
L
R
R
= 1kΩ
= 1kΩ
±12.5
±12.1
±56
10
Full
Full
25
V
Output Current
V
= ±10V
mA
Ω
OUT
Output Resistance
Full Power Bandwidth
Note 6
25
239
398
kHz
TRANSIENT RESPONSE (Note 10)
Slew Rate
Notes 7, 11
Notes 8, 11
Notes 8, 11
0.1%
Full
Full
Full
25
15
-
25
13
-
20
50
-
V/µs
ns
Rise Time
Overshoot
-
28
%
Settling Time (Note 9)
-
0.4
1.5
µs
0.01%
25
-
-
µs
POWER SUPPLY
PSRR
V
= ±10V to ±20V
Full
Full
86
-
100
8
-
dB
S
Supply Current
NOTES:
11
mA/Op Amp
3. Refer to typical performance curve in data sheet.
4. A
5. V
= 10, f = 1kHz, V = 5V
, R = 600Ω, 10Hz to 100kHz, Minimum resolution of test equipment is 0.005%.
RMS
VCL
O
O
L
= 0 to ±10V, R = 1kΩ, C = 50pF.
OUT
L
L
Slew Rate
--------------------------
6. Full Power Bandwidth is calculated by: FPBW =
, V
= 10V .
PEAK
2πV
PEAK
7. V
8. V
= ±2.5V, R = 1kΩ, C = 50pF.
L L
OUT
= ±100mV, R = 1kΩ, C = 50pF.
OUT
L
L
9. Settling time is specified for a 10V step and A = -1.
V
10. See Test Circuits.
11. Guaranteed by characterization.
4-3
HCA10009
Test Circuits and Waveforms
V
+
IN
V
OUT
-
1kΩ
50pF
FIGURE 1. TRANSIENT RESPONSE TEST CIRCUIT
100mV
0V
2.5V
0V
V
IN
-100mV
-2.5V
2.5V
100mV
V
0V
-100mV
OUT
0V
-2.5V
V = ±100mV
OUT
Vertical Scale = 100mV/Div.,
Horizontal Scale = 200ns/Div.
V
= 2.5V
OUT
Vertical Scale = 2V/Div.,
Horizontal Scale = 200ns/Div.
FIGURE 2. LARGE SIGNAL RESPONSE
FIGURE 3. SMALL SIGNAL RESPONSE
V
SETTLE
5K
5K
2K
+
2K
V
IN
V
OUT
NOTES:
12. A = -1.
V
13. Feedback and summing resistors must be matched (0.1%).
14. HP5082-2810 clipping diodes recommended.
15. Tektronix P6201 FET probe used at settling point.
FIGURE 4. SETTLING TIME TEST CIRCUIT
4-4
HCA10009
Application Information
Operation at Various Supply Voltages
Saturation Recovery
The HCA10009 operates over a wide range of supply
voltages with little variation in performance. The supplies
may be varied from ±5V to ±15V. See Typical Performance
Curves for variations in supply current, slew rate and output
voltage swing.
When an op amp is over driven, output devices can saturate
and sometimes take a long time to recover. By clamping the
input, output saturation can be avoided. If output saturation
can not be avoided, the maximum recovery time when
overdriven into the positive rail is 10.6µs. When driven into
the negative rail the maximum recovery time is 3.8µs.
Offset Adjustment
Input Protection
The following diagram shows the offset voltage adjustment
configuration for the HCA10009. By moving the
potentiometer wiper towards pin 8 (+BAL), the op amps
output voltage will increase; towards pin 1 (-BAL) decreases
the output voltage. A 20kΩ trim pot will allow an offset
voltage adjustment of about 10mV.
The HCA10009 has built in back-to-back protection diodes
which limit the maximum allowable differential input voltage
to approximately 5V. If the HCA10009 will be used in circuits
where the maximum differential voltage may be exceeded,
then current limiting resistors must be used. The input
current should be limited to a maximum of 10mA.
R
LIMIT
+15V
2
6
∆V
IN
V
+
OUT
R
LIMIT
3
7
R
1
P
2
3
8
6
PC Board Layout Guidelines
+
4
When designing with the HCA10009, good high frequency
(RF) techniques should be used when building a PC board.
Use of ground plane is recommended. Power supply
decoupling is very important. A 0.01µF to 0.1µF high quality
ceramic capacitor at each power supply pin with a 2.2µF to
10µF tantalum close by will provide excellent decoupling.
Chip capacitors produce the best results due to ease of
placement next to the op amp and basically no lead
-15V
Capacitive Loading Considerations
When driving capacitive loads >80pF, a small resistor, 50Ω
to 100Ω, should be connected in series with the output and
inside the feedback loop.
inductance. If leaded capacitors are used, the leads should
be kept as short as possible to minimize lead inductance.
o
Typical Performance Curves V = ±15V, T = 25 C
S
A
12
R
= 1K, C = 50pF
L
L
9
A
= +1, R = 1K, C = 50pF
V
L
L
120
100
80
60
40
20
0
6
3
0
GAIN
GAIN
-3
-6
180
135
90
45
0
180
135
PHASE
PHASE
10K
90
45
0
10K
100K
1M
FREQUENCY (Hz)
10M
100M
1K
100K
1M
10M
100M
FREQUENCY (Hz)
FIGURE 5. OPEN LOOP GAIN AND PHASE vs FREQUENCY
FIGURE 6. CLOSED LOOP GAIN vs FREQUENCY
4-5
HCA10009
o
Typical Performance Curves V = ±15V, T = 25 C (Continued)
S
A
9
6
3
0
80
60
40
20
0
A
= -1, R = 1K, C = 50pF
A = -1000
V
V
L
L
R
= 1K, C = 50pF
L
L
A
= -100
= -10
V
A
GAIN
V
A
= -10
V
180
135
90
180
135
90
45
0
PHASE
A
= -100
V
A
= -1000
V
45
0
10K
100K
1M
FREQUENCY (Hz)
10M
100M
10K
100K
1M
FREQUENCY (Hz)
10M
100M
FIGURE 7. CLOSED LOOP GAIN vs FREQUENCY
FIGURE 8. VARIOUS CLOSED LOOP GAINS vs FREQUENCY
A
= +1, R = 1K
L
A
= +1, R = 1K
V
V
L
120
100
80
60
40
20
0
100
80
-PSRR
60
40
20
0
+PSRR
10K
100K
1M
10M
100M
10K
100K
1M
10M
100M
FREQUENCY (Hz)
FREQUENCY (Hz)
FIGURE 9. CMRR vs FREQUENCY
FIGURE 10. PSRR vs FREQUENCY
20
18
16
14
12
10
8
300
250
200
150
100
50
R
= 1K
L
6
0
4
-50
2
0
-100
-60
-40
-20
0
20
40
60
o
80
100
120
-60
-40
-20
0
20
40
60
o
80
100 120
TEMPERATURE ( C)
TEMPERATURE ( C)
FIGURE 11. OPEN LOOP GAIN vs TEMPERATURE
FIGURE 12. OFFSET VOLTAGE vs TEMPERATURE
(4 REPRESENTATIVE UNITS)
4-6
HCA10009
o
Typical Performance Curves V = ±15V, T = 25 C (Continued)
S
A
14
13.5
13
R
= 600Ω
L
160
140
120
100
80
12.5
12
11.5
60
40
11
20
10.5
0
-20
-40
10
-60
-40 -20
0
20
40
60
o
80
100 120
-60
-40
-20
0
20
40
60
o
80
100 120
TEMPERATURE ( C)
TEMPERATURE ( C)
FIGURE 13. BIAS CURRENT vs TEMPERATURE
(4 REPRESENTATIVE UNITS)
FIGURE 14. OUTPUT VOLTAGE SWING vs TEMPERATURE
1.1
70
60
A
= +1, R = 1K, C = 50pF
V
L
L
1.05
1
50
40
0.95
0.9
30
20
0.85
10
0
0.8
-60
-40 -20
0
20
40
60
o
80
100 120
0
1
2
3
4
5
TEMPERATURE ( C)
TIME AFTER POWER UP (MINUTES)
FIGURE 15. SLEW RATE vs TEMPERATURE
FIGURE 16. OFFSET VOLTAGE WARM-UP DRIFT
36
34
32
30
28
26
24
22
20
18
16
14
A
= +1, R = 2K, C = 50pF
L L
8.5
8.25
8
V
+SLEW RATE
-SLEW RATE
7.75
7.5
12
10
5
7
9
11
13
15
17
5
7
9
11
13
15
17
SUPPLY VOLTAGE (±V)
SUPPLY VOLTAGE (±V)
FIGURE 17. SUPPLY CURRENT vs SUPPLY VOLTAGE
FIGURE 18. SLEW RATE vs SUPPLY VOLTAGE
4-7
HCA10009
o
Typical Performance Curves V = ±15V, T = 25 C (Continued)
S
A
20
15
10
R
= 600Ω
L
16
14
12
10
8
24
21
18
15
12
9
6
5
0
4
6
VOLTAGE NOISE
CURRENT NOISE
2
3
0
0
10K
1
10
100
1K
5
7
9
11
13
15
17
SUPPLY VOLTAGE (±V)
FREQUENCY (Hz)
FIGURE 19. OUTPUT VOLTAGE SWING vs SUPPLY VOLTAGE
FIGURE 20. NOISE CHARACTERISTICS
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
100
90
80
70
60
50
40
+PSRR
-PSRR
30
20
10
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
CMRR
98
97
96
95
-60
-40
-20
0
20
40
60
o
80
100
120
-60
-40
-20
0
20
40
60
o
80
100
120
TEMPERATURE ( C)
TEMPERATURE ( C)
FIGURE 21. OFFSET CURRENT vs TEMPERATURE
(4 REPRESENTATIVE UNITS)
FIGURE 22. CMRR AND PSRR vs TEMPERATURE
45
120
130
PHASE MARGIN
A
= +1, R = 1K
L
V
40
35
30
100
80
110
90
BANDWIDTH
60
40
20
0
25
20
15
70
50
1
10
100
1000
0
1
2
3
4
5
LOAD CAPACITANCE (pF)
TIME AFTER SHORT CIRCUIT (MINUTES)
FIGURE 23. BANDWIDTH AND PHASE MARGIN vs LOAD
CAPACITANCE
FIGURE 24. SHORT CIRCUIT OUTPUT CURRENT vs TIME
4-8
HCA10009
o
Typical Performance Curves V = ±15V, T = 25 C (Continued)
S
A
Vertical Scale = 1mV/Div.; Horizontal Scale = 1s/Div.
= +25,000; E = 0.168µV RTI
Vertical Scale = 10mV/Div.; Horizontal Scale = 1s/Div.
= +25,000; E = 1.5µV RTI
A
A
V
N
P-P
V
N
P-P
FIGURE 25. 0.1Hz TO 10Hz NOISE
FIGURE 26. 0.1Hz TO 1MHz
18
16
14
12
10
8
18
16
A
= +1, R = 1K, C = 15pF, THD ≤ 0.01%
L L
A
= +1, THD ≤ 0.01%, f = 1kHz
V
V
V
V
= ±18
= ±15
S
S
V
V
= ±18
= ±15
S
14
12
S
10
8
V
= ±10
= ±5
S
V
V
= ±10
= ±5
S
6
4
2
6
4
2
0
V
S
S
0
10K
100K
1M
10M
10
100
1K
10K
LOAD RESISTANCE (Ω)
FREQUENCY (Hz)
FIGURE 27. OUTPUT VOLTAGE SWING vs FREQUENCY
FIGURE 28. OUTPUT VOLTAGE SWING vs LOAD RESISTANCE
10
9.5
9
8.5
8
7.5
7
6.5
6
-60
-40
-20
0
20
40
60
o
80
100 120
TEMPERATURE ( C)
FIGURE 29. SUPPLY CURRENT/AMPLIFIER vs TEMPERATURE
4-9
HCA10009
Small Outline Plastic Packages (SOIC)
M8.15 (JEDEC MS-012-AA ISSUE C)
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
N
INDEX
AREA
0.25(0.010)
M
B M
H
E
INCHES
MILLIMETERS
-B-
SYMBOL
MIN
MAX
MIN
1.35
0.10
0.33
0.19
4.80
3.80
MAX
1.75
0.25
0.51
0.25
5.00
4.00
NOTES
A
A1
B
C
D
E
e
0.0532
0.0040
0.013
0.0688
0.0098
0.020
-
1
2
3
L
-
9
SEATING PLANE
A
0.0075
0.1890
0.1497
0.0098
0.1968
0.1574
-
-A-
o
h x 45
D
3
4
-C-
α
0.050 BSC
1.27 BSC
-
e
A1
H
h
0.2284
0.0099
0.016
0.2440
0.0196
0.050
5.80
0.25
0.40
6.20
0.50
1.27
-
C
B
0.10(0.004)
5
0.25(0.010) M
C
A M B S
L
6
N
α
8
8
7
NOTES:
o
o
o
o
0
8
0
8
-
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
Rev. 0 12/93
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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4-10
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