HGTA32N60E2 [INTERSIL]

32A, 600V N-Channel IGBT; 32A , 600V N沟道IGBT
HGTA32N60E2
型号: HGTA32N60E2
厂家: Intersil    Intersil
描述:

32A, 600V N-Channel IGBT
32A , 600V N沟道IGBT

双极性晶体管
文件: 总4页 (文件大小:35K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HGTA32N60E2  
32A, 600V N-Channel IGBT  
April 1995  
Features  
Package  
JEDEC MO-093AA (5 LEAD TO-218)  
• 32A, 600V  
• Latch Free Operation  
• Typical Fall Time 620ns  
• High Input Impedance  
• Low Conduction Loss  
5 EMITTER  
4 EMITTER KELVIN  
3 COLLECTOR  
2 NO CONNECTION  
COLLECTOR  
(FLANGE)  
1 GATE  
Description  
The IGBT is a MOS gated high voltage switching device  
combining the best features of MOSFETs and bipolar  
transistors. The device has the high input impedance of a  
MOSFET and the low on-state conduction loss of a bipolar  
transistor. The much lower on-state voltage drop varies only  
moderately between +25oC and +150oC.  
Terminal Diagram  
N-CHANNEL ENHANCEMENT MODE  
C
IGBTs are ideal for many high voltage switching applications  
operating at frequencies where low conduction losses are  
essential, such as: AC and DC motor controls, power  
supplies and drivers for solenoids, relays and contactors.  
G
EMITTER  
KELVIN  
PACKAGING AVAILABILITY  
PART NUMBER  
PACKAGE  
TO-218  
BRAND  
E
HGTA32N60E2  
GA32N60E2  
NOTE: When ordering, use the entire part number.  
o
Absolute Maximum Ratings T = +25 C, Unless Otherwise Specified  
C
HGTA32N60E2  
UNITS  
Collector-Emitter Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BV  
600  
600  
50  
32  
200  
±20  
±30  
V
V
A
A
A
V
V
-
CES  
CGR  
Collector-Gate Voltage R = 1M. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
GE  
o
Collector Current Continuous at T = +25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I  
C
C25  
C90  
o
at V = 15V at T = +90 C . . . . . . . . . . . . . . . . . . . . . . . . .I  
GE  
C
Collector Current Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
CM  
GES  
GEM  
Gate-Emitter Voltage Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
Gate-Emitter Voltage Pulsed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
o
Switching Sage Operating Area T = +150 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .SSOA  
Power Dissipation Total at T = +25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P  
Power Dissipation Derating T > +25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
200A at 0.8 BV  
J
CES  
o
208  
1.67  
-55 to +150  
W
C
D
o
o
W/ C  
C
o
Operating and Storage Junction Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . T , T  
C
C
J
STG  
o
Maximum Lead Temperature for Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T  
260  
3
15  
L
SC  
SC  
Short Circuit Withstand Time (Note 2) at V = 15V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . t  
µs  
µs  
GE  
at V = 10V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . t  
GE  
NOTES:  
1. Repetitive Rating: Pulse width limited by maximum junctions temperature.  
o
2. V  
= 360V, T = +125 C, R = 25Ω.  
C GE  
CE(PEAK)  
INTERSIL IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS:  
4,364,073  
4,587,713  
4,641,162  
4,794,432  
4,860,080  
4,969,027  
4,417,385  
4,598,461  
4,644,637  
4,801,986  
4,883,767  
4,430,792  
4,605,948  
4,682,195  
4,803,533  
4,888,627  
4,443,931  
4,618,872  
4,684,413  
4,809,045  
4,890,143  
4,466,176  
4,620,211  
4,694,313  
4,809,047  
4,901,127  
4,516,143  
4,631,564  
4,717,679  
4,810,665  
4,904,609  
4,532,534  
4,639,754  
4,743,952  
4,823,176  
4,933,740  
4,567,641  
4,639,762  
4,783,690  
4,837,606  
4,963,951  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
File Number 2833.3  
http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 19939-116  
Specifications HGTA32N60E2  
o
Electrical Specifications T = +25 C, Unless Otherwise Specified  
C
LIMITS  
PARAMETERS  
SYMBOL  
BV  
TEST CONDITIONS  
MIN  
TYP  
-
MAX  
-
UNITS  
Collector-Emitter Breakdown Voltage  
Collector-Emitter Leakage Current  
I
= 250µA, V = 0V  
600  
V
µA  
mA  
V
CES  
C
GE  
o
I
V
V
= BV  
T
T
T
T
T
= +25 C  
-
-
250  
4.0  
2.9  
3.0  
6.0  
CES  
CE  
CE  
CES  
C
C
C
C
C
o
= 0.8 BV  
= +125 C  
-
-
-
CES  
o
Collector-Emitter Saturation Voltage  
Gate-Emitter Threshold Voltage  
V
I
= I ,  
C90  
= 15V  
= +25 C  
2.4  
2.4  
4.5  
CE(SAT)  
C
V
GE  
o
= +125 C  
-
V
o
V
I
= 1.0mA,  
= +25 C  
3.0  
V
GE(TH)  
C
V
= V  
GE  
CE  
GE  
Gate-Emitter Leakage Current  
Gate-Emitter Plateau Voltage  
On-State Gate Charge  
I
V
= ±20V  
-
-
-
-
-
-
-
-
-
-
-
±500  
-
nA  
V
GES  
V
I
I
= I , V = 0.5 BV  
6.5  
200  
265  
100  
150  
630  
620  
3.5  
0.5  
GEP  
C
C90  
CE  
CES  
Q
= I  
,
V
V
= 15V  
= 20V  
260  
345  
-
nC  
nC  
ns  
ns  
ns  
ns  
mJ  
G(ON)  
C
C90  
GE  
GE  
V
= 0.5 BV  
CES  
CE  
Current Turn-On Delay Time  
Current Rise Time  
t
L = 500µH, I = I , R = 25,  
C C90 G  
V
V
D(ON)I  
o
= 15V, T = +125 C,  
GE  
CE  
J
t
= 0.8 BV  
-
RI  
CES  
Current Turn-Off Delay Time  
Current Fall Time  
t
820  
800  
-
D(OFF)I  
t
FI  
Turn-Off Energy (Note 1)  
Thermal Resistance  
NOTE:  
W
R
OFF  
o
0.6  
C/W  
θJC  
1. Turn-Off Energy Loss (W  
) is defined as the integral of the instantaneous power loss starting at the trailing edge of the input pulse and  
OFF  
ending at the point where the collector current equals zero (I = 0A) The HGTA32N60E2 was tested per JEDEC standard No. 24-1 Meth-  
CE  
od for Measurement of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss.  
Typical Performance Curves  
100  
90  
100  
VGE = 15V  
VGE = 8.0V  
PULSE DURATION = 250µs  
DUTY CYCLE < 0.5%, VCE = 15V  
VGE = 10V  
80  
70  
60  
50  
40  
30  
80  
60  
PULSE DURATION = 250µs  
DUTY CYCLE < 0.5%, TC = +25oC  
VGE = 7.5V  
VGE = 7.0V  
TC = +150oC  
TC = +25oC  
TC = -40oC  
40  
VGE = 6.5V  
VGE = 6.0V  
VGE = 5.5V  
20  
0
20  
10  
0
0
2
4
6
8
10  
0
2
4
6
8
10  
VCE, COLLECTOR-TO-EMITTER VOLTAGE (V)  
V
GE, GATE-TO-EMITTER VOLTAGE (V)  
FIGURE 1. TRANSFER CHARACTERISTICS (TYPICAL)  
FIGURE 2. SATURATION CHARACTERISTICS (TYPICAL)  
3-117  
HGTA32N60E2  
Typical Performance Curves (Continued)  
60  
1.0  
VGE = 10V AND 15V  
TJ = +150oC, RG = 25Ω  
L = 50µH  
VGE = 15V  
VCE = 240V  
50  
40  
0.8  
0.6  
0.4  
0.2  
0.0  
VGE = 10V  
VCE = 480V  
30  
20  
10  
0
1
10  
ICE, COLLECTOR-EMITTER CURRENT (A)  
100  
+25  
+50  
+75  
+100  
+125  
+150  
TC, CASE TEMPERATURE (oC)  
FIGURE 3. MAXIMUM DC COLLECTOR CURRENT vs CASE  
TEMPERATURE  
FIGURE 4. FALL TIME vs COLLECTOR-EMITTER CURRENT  
R
L = 12Ω  
12000  
I
G(REF) = 2.75mA  
VGE = 10V  
f = 1MHz  
GATE-  
EMITTER  
VOLTAGE  
600  
10  
10000  
VCC = BVCES  
VCC = BVCES  
CISS  
8000  
6000  
4000  
2000  
0
450  
300  
150  
5
0.75 BVCES  
0.75 BVCES  
0.50 BVCES  
0.25 BVCES  
0.50 BVCES  
0.25 BVCES  
COSS  
CRSS  
COLLECTOR-EMITTER VOLTAGE  
0
0
0
5
10  
15  
20  
25  
IG(REF)  
IG(REF)  
20  
80  
V
CE, COLLECTOR-TO-EMITTER VOLTAGE (V)  
IG(ACT)  
IG(ACT)  
TIME (µs)  
FIGURE 5. CAPACITANCE vs COLLECTOR-EMITTER VOLTAGE  
FIGURE 6. NORMALIZED SWITCHING WAVEFORMS AT CON-  
STANT GATE CURRENT (REFER TO APPLICATION  
NOTES AN7254 AND AN7260)  
20  
6
TJ = +150oC  
TJ = +150oC  
10  
RG = 25Ω  
5
L = 50µH  
VGE = 10V  
4
VCE = 480V, VGE = 10V, 15V  
3
1.0  
VGE = 15V  
2
V
CE = 240V, VGE = 10V, 15V  
1
0
0.1  
1
10  
100  
1
10  
ICE, COLLECTOR-EMITTER CURRENT (A)  
100  
ICE, COLLECTOR-EMITTER CURRENT (A)  
FIGURE 7. SATURATION VOLTAGE vs COLLECTOR-EMITTER  
CURRENT  
FIGURE 8. TURN-OFF SWITCHING LOSS vs COLLECTOR-  
EMITTER CURRENT  
3-118  
HGTA32N60E2  
Typical Performance Curves (Continued)  
100  
1.5  
TJ = +150oC  
CE = 480V  
L = 50µH  
VCE = 240V  
V
VCE = 480V  
1.0  
fMAX1 = 0.05/tD(OFF)I  
fMAX2 = (PD - PC)/WOFF  
10  
PC = DUTY FACTOR = 50%  
R
θJC = 0.5oC/W  
V
GE = 15V, RG = 50Ω  
0.5  
0.0  
VGE = 10V, RG = 50Ω  
VGE = 15V, RG = 25Ω  
VGE = 10V, RG = 25Ω  
TJ = +150oC, VGE = 15V  
RG = 25, L = 50µH  
1
1
10  
100  
1
10  
CE, COLLECTOR-EMITTER CURRENT (A)  
100  
ICE, COLLECTOR-EMITTER CURRENT (A)  
NOTE:  
I
PD = ALLOWABLE DISSIPATION PC = CONDUCTION DISSIPATION  
FIGURE 9. TURN-OFF DELAY vs COLLECTOR-EMITTER  
CURRENT  
FIGURE 10. OPERATING FREQUENCY vs COLLECTOR-  
EMITTER CURRENT AND VOLTAGE  
Operating Frequency Information  
Operating frequency information for a typical device (Figure  
10) is presented as a guide for estimating device performance  
for a specific application. Other typical frequency vs collector  
current (ICE) plots are possible using the information shown  
for a typical unit in Figures 7, 8 and 9. The operating  
frequency plot (Figure 10) of a typical device shows fMAX1 or  
fMAX2 whichever is smaller at each point. The information is  
based on measurements of a typical device and is bounded  
by the maximum rated junction temperature.  
frequency limiting condition for an application other than  
T
JMAX. tD(OFF)I is important when controlling output ripple  
under a lightly loaded condition.  
fMAX2 is defined by fMAX2 = (PD - PC)/WOFF. The allowable  
dissipation (PD) is defined by PD = (TJMAX - TC)/RθJC. The  
sum of device switching and conduction losses must not  
exceed PD. A 50% duty factor was used (Figure 10) so that  
the conduction losses (PC) can be approximated by PC  
=
(VCE x ICE)/2. WOFF is defined as the sum of the instanta-  
neous power loss starting at the trailing edge of the input  
pulse and ending at the point where the collector current  
equals zero (ICE - 0A).  
fMAX1 is defined by fMAX1 = 0.05/tD(OFF)I. tD(OFF)I deadtime  
(the denominator) has been arbitrarily held to 10% of the on-  
state time for a 50% duty factor. Other definitions are  
possible. tD(OFF)I is defined as the time between the 90%  
point of the trailing edge of the input pulse and the point  
where the collector current falls to 90% of its maximum  
value. Device turn-off delay can establish an additional  
The switching power loss (Figure 10) is defined as fMAX1  
x
WOFF. Turn on switching losses are not included because  
they can be greatly influenced by external circuit conditions  
and components.  
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without  
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate  
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which  
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com  
Sales Office Headquarters  
NORTH AMERICA  
EUROPE  
ASIA  
Intersil Corporation  
Intersil SA  
Mercure Center  
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1130 Brussels, Belgium  
TEL: (32) 2.724.2111  
FAX: (32) 2.724.22.05  
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Taiwan Limited  
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TEL: (407) 724-7000  
FAX: (407) 724-7240  
3-119  

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