HS9-26CT32RH-T [INTERSIL]
Radiation Hardened Quad Differential Line Receiver; 抗辐射四路差动线路接收器
| 型号： | HS9-26CT32RH-T |
| 厂家： | 
Intersil |
| 描述： | Radiation Hardened Quad Differential Line Receiver |
| 文件： | 总3页 (文件大小：47K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HS-26CT32RH-T
Data Sheet
July 1999
File Number 4593.1
Radiation Hardened
Features
Quad Differential Line Receiver
• QML Class T, Per MIL-PRF-38535
Intersil’s Satellite Applications FlowTM (SAF) devices are fully
tested and guaranteed to 100kRAD total dose. These QML
Class T devices are processed to a standard flow intended
to meet the cost and shorter lead-time needs of large
volume satellite manufacturers, while maintaining a high
level of reliability.
• Radiation Performance
5
- Gamma Dose . . . . . . . . . . . . . . . . . . . . 1 x 10 RAD(Si)
2
- SEU and SEL . . . . . . . . . . Immune to 100MeV/mg/cm
• EIA RS-422 Compatible Inputs
• TTL Compatible Enable Inputs
The Intersil HS-26CT32RH-T is a Quad Differential Line
Receiver designed for digital data transmission over
balanced lines and meets the requirements of EIA Standard
RS-422. Radiation Hardened CMOS processing assures low
power consumption, high speed, and reliable operation in
the most severe radiation environments.
• Input Fail Safe Circuitry
• High Impedance Inputs when Disabled or Powered Down
• Low Power Dissipation 138mW Standby (Max)
• Single 5V Supply
o
o
• Full -55 C to 125 C Military Temperature Range
The HS-26CT32RH-T has an input sensitivity of 200mV (typ.)
over the common mode input voltage range of ±7V. The
receivers are also equipped with input fail safe circuitry, which
causes the outputs to go to a logic “1” when the inputs are
open. TTL compatible Enable and Disable functions are
common to all four receivers.
Pinouts
HS1-26CT32RH-T (SBDIP) CDIP2-T16
TOP VIEW
AIN
AIN
1
2
3
4
5
6
7
8
16 V
DD
15 BIN
Specifications
AOUT
ENABLE
COUT
CIN
14 BIN
Specifications for Rad Hard QML devices are controlled by
the Defense Supply Center in Columbus (DSCC). The SMD
numbers listed below must be used when ordering.
13 BOUT
12 ENABLE
11 DOUT
10 DIN
Detailed Electrical Specifications for the HS-26CT32RH-T
are contained in SMD 5962-95631. A “hot-link” is provided
from our website for downloading.
CIN
9
DIN
GND
www.intersil.com/spacedefense/newsafclasst.asp
Intersil’s Quality Management Plan (QM Plan), listing all
Class T screening operations, is also available on our
website.
HS9-26CT32RH-T (FLATPACK), CDFP4-F16
TOP VIEW
www.intersil.com/quality/manuals.asp
AIN
AIN
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
DD
Ordering Information
BIN
ORDERING
NUMBER
PART
NUMBER
TEMP.
AOUT
ENABLE
COUT
CIN
BIN
o
RANGE ( C)
-55 to 125
-55 to 125
-55 to 125
-55 to 125
BOUT
ENABLE
DOUT
DIN
5962R9563101TEC
HS1-26CT32RH/Proto
5962R9563101TXC
HS9-26CT32RH/Proto
HS1-26CT32RH-T
HS1-26CT32RH/Proto
HS9-26CT32RH-T
CIN
GND
DIN
HS9-26CT32RH/Proto
NOTE: Minimum order quantity for -T is 150 units through
distribution, or 450 units direct.
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999
1
Satellite Applications Flow™ (SAF) is a trademark of Intersil Corporation.
HS-26CT32RH-T
Functional Diagram
ENABLE ENABLE DIN DIN
CIN CIN
BIN BIN
AIN AIN
+
-
+
-
+
-
+
-
DOUT
COUT
BOUT
AOUT
TRUTH TABLE
INPUTS
OUTPUT
DEVICE POWER
ON/OFF
ENABLE ENABLE
INPUT
OUT
ON
ON
ON
ON
ON
ON
ON
0
1
1
X
X
0
0
X
0
X
HI-Z
1
VID ≥ VTH (Max)
VID ≤ VTH (Min)
VID ≥ VTH (Max)
VID ≤ VTH (Min)
Open
1
0
X
X
1
1
0
1
X
Open
1
2
HS-26CT32RH-T
Die Characteristics
DIE DIMENSIONS:
BACKSIDE FINISH:
2140µm x 3290µm x 533µm ±25.4µm
(85 x 130 x 21mils ±1mil)
Silicon
PASSIVATION:
METALLIZATION:
M1: Mo/Tiw
Type: SiO
Thickness: 8kÅ ±1kÅ
2
Thickness: 5800Å
M2: Al/Si/Cu
WORST CASE CURRENT DENSITY:
2
< 2.0e5 A/cm
Thickness: 10kÅ ±1kÅ
TRANSISTOR COUNT:
SUBSTRATE POTENTIAL:
315
Internally connected to V . May be left floating.
DD
PROCESS:
Radiation Hardened CMOS, AVLSI
Metallization Mask Layout
HS-26CT32RH-T
AIN
(1)
V
(16)
BIN
(15)
DD
(14) BIN
AIN (2)
(13) BOUT
(12) ENAB
AOUT (3)
ENAB (4)
(11) DOUT
COUT (5)
(10) DIN
CIN (6)
(7)
CIN
(8)
GND
(9)
DIN
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
3
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