HS9-6254RH-Q

更新时间:2024-09-18 01:57:29
品牌:INTERSIL
描述:Radiation Hardened Ultra High Frequency NPN Transistor Array

HS9-6254RH-Q 概述

Radiation Hardened Ultra High Frequency NPN Transistor Array 抗辐射超高频NPN晶体管阵列

HS9-6254RH-Q 数据手册

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HS-6254RH  
Data Sheet  
August 1999  
File Number 4425.2  
Radiation Hardened Ultra High Frequency  
NPN Transistor Array  
Features  
• Electrically Screened to SMD # 5962-97641  
• QML Qualified per MIL-PRF-38535 Requirements  
• Radiation Environment  
The HS-6254RH is a Radiation Hardened array of five NPN  
transistors on a common substrate. One of our bonded  
wafer, dielectrically isolated fabrication processes provides  
an immunity to Single Event Latch-up and the capability of  
highly reliable performance in any radiation environment.  
5
- Gamma Dose (γ) . . . . . . . . . . . . . . . . . 3 x 10 RAD(Si)  
- SEL Immune. . . . . . . Bonded Wafer Dielectric Isolation  
• Gain Bandwidth Product (F ). . . . . . . . . . . . . .8GHz (Typ)  
T
The high F (8GHz) and low noise figure (3.5dB) of these  
T
transistors make them ideal for use in high frequency  
amplifier and mixer applications. Monolithic construction of  
the five transistors provides the closest electrical and  
thermal matching possible. Access is provided to each  
terminal of the transistors for maximum application flexibility.  
• Current Gain (h ) . . . . . . . . . . . . . . . . . . . . . . . . 70 (Typ)  
FE  
• Early Voltage (V ). . . . . . . . . . . . . . . . . . . . . . . . 50V (Typ)  
A
• Noise Figure (50) at 1GHz. . . . . . . . . . . . . . .3.5dB (Typ)  
• Collector-to-Collector Leakage. . . . . . . . . . . . . <1pA (Typ)  
Specifications for Rad Hard QML devices are controlled  
by the Defense Supply Center in Columbus (DSCC). The  
SMD numbers listed here must be used when ordering.  
Applications  
• High Frequency Amplifiers and Mixers  
- Refer to Application Note 9315  
Detailed Electrical Specifications for these devices are  
contained in SMD 5962-97641. A “hot-link” is provided  
on our homepage for downloading.  
• High Frequency Converters  
• Synchronous Detectors  
www.intersil.com/spacedefense/space.asp  
Pinouts  
Ordering Information  
HS1-6254RH (CERDIP) GDIP1-T16 OR  
HS1-6254RH (SBDIP) CDIP2-T16  
TOP VIEW  
INTERNAL  
MKT. NUMBER  
TEMP.RANGE  
o
ORDERING NUMBER  
HS0-6254RH-Q  
( C)  
HS0-6254RH-Q  
HS1-6254RH-Q  
HS1B-6254RH-Q  
HS9-6254RH-Q  
25  
Q1C  
Q2C  
Q2E  
Q2B  
NC  
1
2
3
4
5
6
7
8
16 Q1E  
15 Q1B  
14 Q5B  
13 Q5E  
12 Q5C  
11 Q4C  
10 Q4E  
5962F9764101VEA  
5962F9764101VEC  
5962F9764101VXC  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
Q1  
Q2  
Q3  
Q5  
HS1-6254RH/SAMPLE HS1-6254RH/SAMPLE  
Q3C  
Q3E  
Q3B  
Q4  
9
Q4B  
HS9-6254RH (FLATPACK) CDFP4-F16  
TOP VIEW  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
Q1C  
Q2C  
Q2E  
Q2B  
NC  
Q1E  
Q1B  
Q5B  
Q5E  
Q5C  
Q4C  
Q4E  
Q4B  
Q1  
Q2  
Q3  
Q5  
Q3C  
Q3E  
Q3B  
Q4  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999  
1
HS-6254RH  
Burn-In Circuit  
100 ±5%  
10.5V ±0.5V  
5.5V ±0.5V  
0.01µF  
0.01µF  
1
16  
15  
14  
13  
12  
11  
10  
9
Q1  
1K ±5%  
2
3
4
5
6
7
8
Q2  
Q3  
1K ±5%  
NC  
Q5  
1K ±5%  
1K ±5%  
Q4  
1K ±5%  
Irradiation Circuit  
100Ω ±5%  
10.5V ±0.5V  
0.01µF  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
Q1  
1K ±5%  
Q2  
Q3  
1K ±5%  
NC  
Q5  
1K ±5%  
1K ±5%  
Q4  
1K ±5%  
5V ±0.5V  
0.01µF  
2
HS-6254RH  
Die Characteristics  
DIE DIMENSIONS:  
ASSEMBLY RELATED INFORMATION:  
52 mils x 52.8 mils x 15 mils ±1 mil  
1320µm x 1340µm x 381µm ±25.4µm  
Substrate Potential:  
Floating  
INTERFACE MATERIALS:  
Glassivation:  
ADDITIONAL INFORMATION:  
Worst Case Current Density:  
Type: Nitride  
Thickness: 4kÅ ±0.5kÅ  
5
2
3.04 x 10 A/cm  
Transistor Count:  
Top Metallization:  
5
Type: Metal 1: AlCu (2%)/TiW  
Thickness: Metal 1: 8kÅ ±0.5kÅ  
Type: Metal 2: AlCu (2%)  
Thickness: Metal 2: 16kÅ ±0.8kÅ  
Substrate:  
UHF-1X Bonded Wafer, DI  
Backside Finish:  
Silicon  
Metallization Mask Layout  
HS-6254RH  
2
1
16  
15  
14  
3
4
13  
12  
11  
5
6
7
8
9
10  
NOTE: Pad numbers correspond to the 16 lead pinout.  
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.  
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-  
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and  
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result  
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com  
3

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