ISL21070CIH310Z-TK [INTERSIL]
25μA Micropower Voltage References; 25μA微功耗电压基准
| 型号： | ISL21070CIH310Z-TK |
| 厂家： | 
Intersil |
| 描述： | 25μA Micropower Voltage References |
| 文件： | 总12页 (文件大小：480K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
25µA Micropower Voltage References
ISL21070
Features
• Reference Output Voltage . . . . . . . 1.024V, 2.048V,
2.500V, 3.300V
The ISL21070 voltage references are analog voltage
references featuring low supply voltage operation at
ultra-low 25µA max operating current.
• Initial Accuracy: 1.024V . . . . . . . . . . . . . . .±0.5%
• Initial Accuracy: 2.048V . . . . . . . . . . . . . .±0.25%
• initial Accuracy: 2.5V, 3.3V . . . . . . . . . . . . .±0.2%
• Input Voltage Range
Additionally, the ISL21070 family features guaranteed
initial accuracy as low as ±0.2% and 30ppm/°C
temperature coefficient.
These references are ideal for general purpose
applications for performance at lower cost. The ISL21070
is provided in an industry standard 3 Ld SOT-23 pinout.
- ISL21070-10 (Coming Soon) . . . . . . 2.7V to 5.5V
- ISL21070-20 (Coming Soon) . . . . . . 2.7V to 5.5V
- ISL21070-25. . . . . . . . . . . . . . . . . . 2.7V to 5.5V
- ISL21070-33 (Coming Soon) . . . . . . 3.5V to 5.5V
• Output Voltage Noise . . . . 30µVP-P (0.1Hz to 10Hz)
• Supply Current. . . . . . . . . . . . . . . . . . 25µA (Max)
• Tempco . . . . . . . . . . . . . . . . . . . . . . . . 30ppm/°C
• Output Current Capability . . . . . . . . . . . . . ±10mA
• Operating Temperature Range . . . . -40°C to +85°C
• Package . . . . . . . . . . . . . . . . . . . . . . 3 Ld SOT-23
• Pb-Free (RoHS compliant)
The ISL21070 offers output voltages that can be used as
precision voltage sources for control loops, standby
voltages for low power states for DSP, FPGA, Datapath
Controllers, Microcontrollers and other core voltages:
1.024V, 2.048V, 2.5V, and 3.3V.
Applications*(see page 11)
• Battery Management/Monitoring
• Low Power Standby Voltages
• Portable Instrumentation
Related Literature*(see page 11)
• Consumer/Medical Electronics
• Wearable Electronics
• AN1533, “X-Ray Effects on Intersil FGA References”
• AN1494, “Reflow and PC Board Assembly Effects on
Intersil FGA References”
• Lower Cost Industrial and Instrumentation
• Power Regulation Circuits
• Control Loops and Compensation Networks
• LED/Diode Supply
2.5020
2.5015
TYP
2.5010
2.5005
2.5000
2.4995
LOW
HIGH
2.4990
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80
TEMPERATURE (°C)
FIGURE 1. VOUT vs TEMPERATURE NORMALIZED to +25°C
March 19, 2010
FN7599.0
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2010. All Rights Reserved
1
All other trademarks mentioned are the property of their respective owners.
ISL21070
Typical Application Circuit
2.7V TO 5.5V
0.1µF
10µF
V
IN
+
–
V
SENSE
OUT
V
OUT
ISL21070
GND
LOAD
Pin Configuration
Pin Descriptions
ISL21070
(3 LD SOT-23)
TOP VIEW
1
VIN
3
GND
VOUT
2
PIN NUMBER
PIN NAME
VIN
DESCRIPTION
1
2
3
Input Voltage Connection. Range: 2.7 to 5.5V
Voltage Reference Output.
VOUT
GND
Ground Connection
Ordering Information
PART NUMBER
(Notes 1, 2, 3)
PART
MARKING
VOUT OPTION
(V)
TEMP. RANGE
(°C)
PACKAGE
(Pb-Free)
PKG.
DWG. #
GRADE
ISL21070CIH310Z-TK
ISL21070CIH320Z-TK
ISL21070CIH325Z-TK
ISL21070CIH333Z-TK
NOTES:
BCGA
BCHA
BCJA
BCKA
1.024
2.048
2.5
±0.5%, 30ppm/°C
±0.25%, 30ppm/°C
±0.2%, 30ppm/°C
±0.2%, 30ppm/°C
-40 to +85
-40 to +85
-40 to +85
-40 to +85
3 Ld SOT-23
3 Ld SOT-23
3 Ld SOT-23
3 Ld SOT-23
P3.064
P3.064
P3.064
P3.064
3.3
1. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach
materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both
SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see device information page for ISL21070. For more information on MSL please
see techbrief TB363.
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March 19, 2010
2
ISL21070
Absolute Voltage Ratings
Thermal Information
Max Voltage
Thermal Resistance (Typical)
θJA (°C/W)
V
V
IN to GND . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +6.5V
OUT (pin) to GND (10s). . . . . . . . . . . -0.5V to VOUT + 1V
3 Ld SOT-23 (Note 5) . . . . . . . . . . . . . . . . .
371
Continuous Power Dissipation (TA = +85°C). . . . . . . . 99mW
Storage Temperature Range. . . . . . . . . . . -65°C to +150°C
Pb-Free Reflow Profile (Note 6). . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
ESD Ratings
Human Body Model (Tested per JESD22-A114) . . . . 6000V
Machine Model (Tested per JESD22-A115) . . . . . . . . 500V
Charged Device Model (Tested per JESD22-C101) . . . . 2kV
Latch Up (Tested Per JESD-78) . . . . . . . . . . . . . . . . 100mA
Recommended Operating Conditions
Temperature Range (Industrial) . . . . . . . . . -40°C to +85°C
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . .2.7V to 5.5V
Environmental Operating Conditions
X-Ray Exposure (Note 4). . . . . . . . . . . . . . . . . . . .10mRem
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact
product reliability and result in failures not covered by warranty.
NOTES:
4. Measured with no filtering, distance of 10” from source, intensity set to 55kV and 70mA current, 30s duration. Other exposure
levels should be analyzed for Output Voltage drift effects. See “Applications Information” on page 8.
5. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief
TB379 for details.
6. Post-reflow drift for the ISL21070 devices will range from 100µV to 1.0mV based on experimental results with devices on FR4
double sided boards. The design engineer must take this into account when considering the reference voltage after assembly.
Electrical Specifications (ISL21070-xx, VOUT = 1.024V to 2.048V) VIN = 3.0V, TA = -40°C to +85°C,
I
OUT = 0, unless otherwise specified. Boldface limits apply over the operating
temperature range, -40°C to +85°C.
MIN
MAX
SYMBOL
PARAMETER
CONDITIONS
(Note 10) TYP (Note 10 UNITS
VOUT
Output Voltage
1.024
2.048
V
V
%
VOA
VOUT Accuracy @ TA = +25°C
ISL21070 C-grade: 1.024
ISL21070 C-grade: 2.048
ISL21070 C-grade
-0.5
+0.5
+0.25
30
-0.25
%
TC VOUT
Output Voltage Temperature
Coefficient (Note 7)
ppm/°C
VIN
IIN
Input Voltage Range
Supply Current
2.7
5.5
25
V
µA
16
50
ΔVOUT/ΔVIN Line Regulation
ΔVOUT/ΔIOUT Load Regulation
2.7V < VIN < 5.5V
Sourcing: 0mA ≤ IOUT ≤ 10mA
Sinking: -10mA ≤ IOUT ≤ 0mA
TA = +25°C, VOUT tied to GND
VOUT = ±0.1%
250
100
100
µV/V
µV/mA
µV/mA
mA
6
10
ISC
tR
Short Circuit Current
Turn-on Settling Time
Ripple Rejection
50
150
-20
30
µs
f = 10kHz
dB
eN
VN
Output Voltage Noise
Broadband Voltage Noise
0.1Hz ≤ f ≤ 10Hz
µVP-P
µVRMS
ppm
ppm
10Hz ≤ f ≤ 10kHz
10
ΔVOUT/ΔTA Thermal Hysteresis (Note 8)
ΔTA = +125°C
100
50
ΔVOUT/Δt
Long Term Stability (Note 9)
TA = +25°C
FN7599.0
March 19, 2010
3
ISL21070
Electrical Specifications (ISL21070-25, VOUT = 2.5V) VIN = 3.0V, TA = -40°C to +85°C, IOUT = 0, unless
otherwise specified. Boldface limits apply over the operating temperature range,
-40°C to +85°C.
MIN
MAX
SYMBOL
VOUT
PARAMETER
Output Voltage
CONDITIONS
(Note 10) TYP (Note 10
UNIT
V
2.5
VOA
VOUT Accuracy @ TA = +25°C
ISL21070 C-grade
-0.2
+0.2
%
TC VOUT
Output Voltage Temperature
Coefficient (Note 7)
ISL21070 C-grade
30
ppm/°C
VIN
IIN
Input Voltage Range
Supply Current
2.7
5.5
25
V
VEN = VIN
11
15
6
µA
ΔVOUT/ΔVIN
ΔVOUT/ΔIOUT
Line Regulation
Load Regulation
2.7V < VIN < 5.5V
Sourcing: 0mA ≤ IOUT ≤ 7mA
250
100
µV/V
µV/mA
µV/mA
Sourcing: 0mA ≤ IOUT ≤ 10mA
133
(TA = +70°C)
Sinking: -10mA ≤ IOUT ≤ 0mA
TA = +25°C, VOUT tied to GND
VOUT = ±0.1%
10
30
100
µV/mA
mA
ISC
tR
Short Circuit Current
Turn-on Settling Time
Ripple Rejection
150
-20
30
µs
f = 10kHz
dB
eN
Output Voltage Noise
Broadband Voltage Noise
Thermal Hysteresis (Note 8)
Long Term Stability (Note 9)
0.1Hz ≤ f ≤ 10Hz
10Hz ≤ f ≤ 10kHz
ΔTA = +125°C
µVP-P
µVRMS
ppm
ppm
VN
10
ΔVOUT/ΔTA
ΔVOUT/Δt
20
TA = +25°C
50
FN7599.0
March 19, 2010
4
ISL21070
Electrical Specifications (ISL21070-33, VOUT = 3.3V) VIN = 5V, TA = -40°C to +85°C, IOUT = 0, unless
otherwise specified.Boldface limits apply over the operating temperature range,
-40°C to +85°C.
MIN
MAX
SYMBOL
VOUT
PARAMETER
Output Voltage
CONDITIONS
(Note 10) TYP (Note 10) UNIT
3.3
V
VOA
VOUT Accuracy @ TA = +25°C
ISL21070 C-grade
-0.2
+0.2
%
TC VOUT
Output Voltage Temperature
Coefficient (Note 7)
ISL21070 C-grade
50
ppm/°
C
VIN
IIN
Input Voltage Range
Supply Current
3.5
5.5
25
V
VEN = VIN
µA
ΔVOUT/ΔVIN
ΔVOUT/ΔIOUT
Line Regulation
Load Regulation
3.5V < VIN < 5.5V
Sourcing: 0mA ≤ IOUT ≤ 10mA
Sinking: -10mA ≤ IOUT ≤ 0mA
TA = +25°C, VOUT tied to GND
VOUT = ±0.1%
50
20
100
70
µV/mA
µV/mA
mA
20
70
ISC
tR
Short Circuit Current
30
Turn-on Settling Time
Ripple Rejection
150
-20
30
µs
f = 10kHz
dB
eN
Output Voltage Noise
Broadband Voltage Noise
Thermal Hysteresis (Note 8)
Long Term Stability (Note 9)
0.1Hz ≤ f ≤ 10Hz
µVP-P
µVRMS
ppm
ppm
VN
10Hz ≤ f ≤ 10kHz
ΔTA = +125°C
10
ΔVOUT/ΔTA
ΔVOUT/Δt
100
50
TA = +25°C
NOTES:
7. Over the specified temperature range. Temperature coefficient is measured by the box method whereby the change in VOUT
is divided by the temperature range; in this case, -40°C to +85°C = +125°C.
8. Thermal Hysteresis is the change of VOUT measured @ TA = +25°C after temperature cycling over a specified range, ΔTA. VOUT
is read initially at TA = +25°C for the device under test. The device is temperature cycled and a second VOUT measurement
is taken at +25°C. The difference between the initial VOUT reading and the second VOUT reading is then expressed in ppm.
For Δ TA = +125°C, the device under test is cycled from +25°C to +85°C to -40°C to +25°C.
9. Long term drift is logarithmic in nature and diminishes over time. Drift after the first 1000 hours will be approximately
10ppm/√1khrs
10. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established
by characterization and are not production tested.
FN7599.0
March 19, 2010
5
ISL21070
Typical Performance Characteristics Curves VOUT = 2.5V, VIN = 3V, IOUT = 0mA, TA = +25°C
unless otherwise specified.
20
18
16
14
12
10
8
14
13
12
11
10
9
HIGH
TYP
+25°C
-85°C
6
4
LOW
4.3
-40°C
3.5
2
0
8
2.7
3.1
3.9
V
4.3
(V)
4.7
5.1
5.5
2.7
3.1
3.5
3.9
V
4.7
5.1
5.5
(V)
IN
IN
FIGURE 2. IIN vs VIN, 3 UNITS
FIGURE 3. IIN vs VIN OVER-TEMPERATURE
2.50030
2.50025
2.50020
2.50015
2.50010
2.50005
2.50000
2.49995
2.49990
200
+25°C
150
100
50
TYP
-85°C
0
-40°C
-50
-100
-150
LOW
3.5
HIGH
2.7
3.1
3.9
V
4.3
(V)
4.7
5.1
5.5
2.7
3.1
3.5
3.9
V
4.3
(V)
4.7
5.1
5.5
IN
IN
FIGURE 5. LINE REGULATION OVER-TEMPERATURE
FIGURE 4. LINE REGULATION, 3 UNITS
2.5020
25
20
ΔV = +0.3V
IN
2.5015
2.5010
2.5005
2.5000
2.4995
2.4990
15
10
5
TYP
0
-5
-10
-15
-20
-25
ΔV = -0.3V
IN
LOW
HIGH
0
50 100 150 200 250 300 350 400 450 500
TIME (µs)
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80
TEMPERATURE (°C)
FIGURE 7. LINE TRANSIENT RESPONSE, WITH 1nF
CAPACITIVE LOAD
FIGURE 6. VOUT vs TEMPERATURE NORMALIZED to
+25°C
FN7599.0
March 19, 2010
6
ISL21070
Typical Performance Characteristics Curves VOUT = 2.5V, VIN = 3V, IOUT = 0mA, TA = +25°C
unless otherwise specified. (Continued)
100
80
25
20
15
10
5
+25°C
60
ΔV = +0.3V
IN
40
20
0
0
-40°C
-20
-40
-60
-80
-100
-5
-10
-15
-20
-25
ΔV = -0.3V
IN
-85°C
-10 -9 -8 -7 -6 -5 -4 -3 -2 -1
0
1
2
3
4
5
6
7
8
9
10
0
50 100 150 200 250 300 350 400 450 500
TIME (µs)
SINKING LOAD (mA)
SOURCING
FIGURE 9. LOAD REGULATION OVER-TEMPERATURE
FIGURE 8. LINE TRANSIENT RESPONSE, WITH NO
CAPACITIVE LOAD
200
160
120
500
400
300
I = +50mA
LOAD
I
= +10mA
LOAD
80
40
200
100
0
0
-40
-80
-120
-160
-200
-100
-200
-300
-400
-500
I
= -50mA
LOAD
I
= -10mA
LOAD
0
20 40 60 80 100 120 140 160 180 200
TIME (µs)
0
20 40 60 80 100 120 140 160 180 200
TIME (µs)
FIGURE 10. LOAD TRANSIENT RESPONSE
FIGURE 11. LOAD TRANSIENT RESPONSE
2.510
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
2.508
2.506
2.504
2.502
2.500
2.498
2.496
2.494
2.492
2.490
TYP
10mA LOAD
VDD
NO LOAD
LOW
HIGH
2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0
(V)
0
50
100
150
200
250
300
TIME (µs)
V
IN
FIGURE 13. TURN-ON TIME
FIGURE 12. DROPOUT
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7
ISL21070
Typical Performance Characteristics Curves VOUT = 2.5V, VIN = 3V, IOUT = 0mA, TA = +25°C
unless otherwise specified. (Continued)
120
100
80
60
40
20
0
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
NO LOAD
1nF LOAD
NO LOAD
1nF LOAD
10nF LOAD
10nF LOAD
100nF LOAD
100nF LOAD
1
10
100
1k
10k
100k
1M
1
10
100
1k
10k
100k 1M 10M
FREQUENCY (Hz)
FREQUENCY (Hz)
FIGURE 15. PSRR vs FREQUENCY
FIGURE 14. ZOUT vs f vs CL
X-rayed, care should be taken to shield the FGA
reference device.
Applications Information
FGA Technology
The ISL21070 series of voltage references use the
Board Mounting Considerations
For applications requiring the highest accuracy, board
mounting location should be reviewed. Placing the device
in areas subject to slight twisting can cause degradation
of the accuracy of the reference voltage due to die
stresses. It is normally best to place the device near the
edge of a board, or the shortest side, as the axis of
bending is most limited at that location. Obviously,
mounting the device on flexprint or extremely thin PC
material will likewise cause loss of reference accuracy.
floating gate technology to create references with very
low drift and supply current. Essentially, the charge
stored on a floating gate cell is set precisely in
manufacturing. The reference voltage output itself is a
buffered version of the floating gate voltage. The
resulting reference device has excellent characteristics
which are unique in the industry: very low temperature
drift, high initial accuracy, and almost zero supply
current. Also, the reference voltage itself is not limited by
voltage bandgaps or zener settings, so a wide range of
reference voltages can be programmed (standard
voltage settings are provided, but customer-specific
voltages are available).
Board Assembly Considerations
FGA references provide high accuracy and low
temperature drift but some PC board assembly
precautions are necessary. Normal Output voltage shifts
of 100µV to 1mV can be expected with Pb-free reflow
profiles or wave solder on multi-layer FR4 PC boards.
Precautions should be taken to avoid excessive heat or
extended exposure to high reflow or wave solder
temperatures, this may reduce device initial accuracy.
The process used for these reference devices is a floating
gate CMOS process, and the amplifier circuitry uses
CMOS transistors for amplifier and output transistor
circuitry. While providing excellent accuracy, there are
limitations in output noise level and load regulation due
to the MOS device characteristics. These limitations are
addressed with circuit techniques discussed in other
sections.
Post-assembly x-ray inspection may also lead to
permanent changes in device output voltage and should
be minimized or avoided. If x-ray inspection is required,
it is advisable to monitor the reference output voltage to
verify excessive shift has not occurred. If large amounts
of shift are observed, it is best to add an X-ray shield
consisting of thin zinc (300µm) sheeting to allow clear
imaging, yet block x-ray energy that affects the FGA
reference.
Handling and Board Mounting
FGA references provide excellent initial accuracy and low
temperature drift at the expense of very little power
drain. There are some precautions to take to insure this
accuracy is not compromised. Excessive heat during
solder reflow can cause excessive initial accuracy drift, so
the recommended +260°C max temperature profile
should not be exceeded. Expect up to 1mV drift from the
solder reflow process.
Special Applications Considerations
In addition to post-assembly examination, there are also
other X-ray sources that may affect the FGA reference
long term accuracy. Airport screening machines contain
X-rays and will have a cumulative effect on the voltage
reference output accuracy. Carry-on luggage screening
uses low level X-rays and is not a major source of output
voltage shift, however, if a product is expected to pass
FGA references are susceptible to excessive
X-radiation like that used in PC board manufacturing.
Initial accuracy can change 10mV or more under
extreme radiation. If an assembled board needs to be
FN7599.0
March 19, 2010
8
ISL21070
through that type of screening over 100 times, it may
ISL21070 Used as a Low Cost Precision
Current Source
Using an N-JET and the ISL21070, a precision, low cost,
high impedance current source can be created. The
precision of the current source is largely dependent on
the tempco and accuracy of the reference. The current
setting resistor contributes less than 20% of the error.
need to consider shielding with copper or aluminum.
Checked luggage X-rays are higher intensity and can
cause output voltage shift in much fewer passes, thus
devices expected to go through those machines should
definitely consider shielding. Note that just two layers of
1/2 ounce copper planes will reduce the received dose by
over 90%. The leadframe for the device which is on the
bottom also provides similar shielding.
V
OUT
+8V TO 28V
I
SET =
R
SET
If a device is expected to pass through luggage X-ray
machines numerous times, it is advised to mount a
2-layer (minimum) PC board on the top, and along with a
ground plane underneath will effectively shield it from 50
to 100 passes through the machine. Since these
I = I
IR
SET
L
SET +
V
IN
V
OUT
machines vary in X-ray dose delivered, it is difficult to
produce an accurate maximum pass recommendation.
R
SET
0.01µF
1kΩ
0.1%
10ppm/°C
ISL21070-2.5
Z
> 100MΩ
OUT
V
= 2.5V
Noise Performance and Reduction
OUT
The output noise voltage in a 0.1Hz to 10Hz bandwidth is
typically 30µVP-P. The noise measurement is made with
a bandpass filter made of a 1 pole high-pass filter with a
corner frequency at 0.1Hz and a 2-pole low-pass filter
with a corner frequency at 12.6Hz to create a filter with a
9.9Hz bandwidth. Wideband noise is reduced by adding
capacitor to the output, but the value should be limited
to 1nF or less to insure stability.
GND
I
~ 11µA
SY
I
SET
IL AT 0.1% ACCURACY
~2.5011mA
FIGURE 16. ISL21070 USED AS A LOW COST
PRECISION CURRENT SOURCE
Temperature Drift
The limits stated for output accuracy over-temperature
are governed by the method of measurement. For the
-40°C to 85°C temperature range, measurements are
made at +25°C and the two extremes. This
measurement method combined with the fact that FGA
references have a fairly linear temperature drift
characteristic insures that the limits stated will not be
exceeded over the temperature range.
Typical Application Circuits
V
= 3.0V
IN
R = 200Ω
2N2905
V
IN
V
2.5V/50mA
0.001µF
OUT
ISL21070
GND
FIGURE 17. PRECISION 2.5V 50mA REFERENCE
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9
ISL21070
Typical Application Circuits(Continued)
2.7V TO 5.5V
0.1µF
10µF
V
IN
V
OUT
ISL21070
GND
0.001µF
V
R
CC
V
H
OUT
X9119
SDA
SCL
+
–
2-WIRE BUS
V
OUT
(BUFFERED)
V
R
L
SS
FIGURE 18. 2.5V FULL SCALE LOW-DRIFT 10-BIT ADJUSTABLE VOLTAGE SOURCE
2.7V TO 5.5V
0.1µF
10µF
V
IN
+
V
SENSE
OUT
V
OUT
–
ISL21070
GND
LOAD
FIGURE 19. KELVIN SENSED LOAD
FN7599.0
March 19, 2010
10
ISL21070
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to
web to make sure you have the latest Rev.
DATE
REVISION
CHANGE
3/19/10
FN7599.0
Initial release.
Products
Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The
Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones,
handheld products, and notebooks. Intersil's product families address power management and analog signal
processing functions. Go to www.intersil.com/products for a complete list of Intersil product families.
*For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device
information page on intersil.com: ISL21070
To report errors or suggestions for this datasheet, please go to www.intersil.com/askourstaff
FITs are available from our website at http://rel.intersil.com/reports/search.php
For additional products, see www.intersil.com/product_tree
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications
at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by
Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any
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patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN7599.0
March 19, 2010
11
ISL21070
Package Outline Drawing
P3.064
3 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE (SOT23-3)
Rev 2, 9/09
4
2.92±0.12
DETAIL "A"
C
L
2.37±0.27
1.30±0.10
4
C
L
0.950
0.435±0.065
0.20 M C
0 - 8 deg.
TOP VIEW
10° TYP
(2 plcs)
0.25
0.91±0.03
GAUGE PLANE
1.00±0.12
SEATING PLANE
C
SEATING PLANE
0.10 C
0.31±0.10
5
0.013(MIN)
0.100(MAX)
SIDE VIEW
DETAIL "A"
(0.60)
NOTES:
(2.15)
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSEY14.5m-1994.
3. Reference JEDEC TO-236.
(1.25)
4. Dimension does not include interlead flash or protrusions.
Interlead flash or protrusions shall not exceed 0.25mm per side.
5. Footlength is measured at reference to gauge plane.
(0.95 typ.)
TYPICAL RECOMMENDED LAND PATTERN
FN7599.0
March 19, 2010
12
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