ISL22313UFU10Z [INTERSIL]
Single Digitally Controlled Potentiometer XDCP; 单数字控制电位器XDCP型号: | ISL22313UFU10Z |
厂家: | Intersil |
描述: | Single Digitally Controlled Potentiometer XDCP |
文件: | 总15页 (文件大小:618K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ISL22313
®
Single Digitally Controlled Potentiometer (XDCP™)
Data Sheet
July 17, 2007
FN6421.0
2 ®
Low Noise, Low Power, I C Bus, 256 Taps
Features
The ISL22313 integrates a single digitally controlled
potentiometer (DCP), control logic and non-volatile memory
on a monolithic CMOS integrated circuit.
• 256 resistor taps
2
• I C serial interface
- Two address pins, up to four devices per bus
• Non-volatile EEPROM storage of wiper position
• 14 General Purpose non-volatile registers
The digitally controlled potentiometer is implemented with a
combination of resistor elements and CMOS switches. The
position of the wipers are controlled by the user through the
2
I C bus interface. The potentiometer has an associated
• High reliability
volatile Wiper Register (WR) and a non-volatile Initial Value
Register (IVR) that can be directly written to and read by the
user. The contents of the WR control the position of the
wiper. At power up the device recalls the contents of the
DCP’s IVR to the WR.
- Endurance: 1,000,000 data changes per bit per register
- Register data retention: 50 years @ T≤+55°C
• Wiper resistance: 70Ω typical @ 1mA
• Standby current <2.5µA max
The ISL22313 also has 14 general purpose non-volatile
registers that can be used as storage of lookup table for
multiple wiper position or any other valuable information.
• Shutdown current <2.5µA max
• Dual power supply
- VCC = 2.25V to 5.5V
- V- = -2.25V to -5.5V
The ISL22313 features a dual supply, that is beneficial for
applications requiring a bipolar range for DCP terminals
between V- and VCC.
• DCP terminal voltage from V- to VCC
• 10kΩ, 50kΩ or 100kΩ total resistance
• Extended industrial temperature range: -40 to +125°C
• 10 Lead MSOP
The DCP can be used as a three-terminal potentiometer or
as a two-terminal variable resistor in a wide variety of
applications including control, parameter adjustments, and
signal processing.
• Pb-free plus anneal product (RoHS compliant)
Pinout
ISL22313
(10 LD MSOP)
TOP VIEW
O
10
9
SCL
SDA
A1
VCC
1
2
3
4
5
RH
RW
8
7
A0
RL
V-
GND
6
Ordering Information
PART
RESISTANCE
TEMP.
NUMBER
PART
MARKING
OPTION
(kΩ)
RANGE
(°C)
PACKAGE
(Pb-Free)
(Notes 1, 2)
ISL22313TFU10Z
ISL22313UFU10Z
ISL22313WFU10Z
NOTES:
PKG. DWG. #
M10.118
313TZ
100
50
-40 to +125
-40 to +125
-40 to +125
10 Ld MSOP
313UZ
313WZ
10 Ld MSOP
10 Ld MSOP
M10.118
M10.118
10
1. Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are
MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
2. Add “-TK” suffix for 1,000 Tape and Reel option
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) and XDCP are registered trademarks of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2007. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL22313
Block Diagram
V-
V
CC
RH
SCL
SDA
A1
POWER UP
INTERFACE,
CONTROL
AND
STATUS
LOGIC
2
I C
WR
INTERFACE
VOLATILE
REGISTER
AND
A0
WIPER
CONTROL
CIRCUITRY
NON-VOLATILE
REGISTERS
RL
RW
GND
Pin Descriptions
MSOP PIN
SYMBOL
DESCRIPTION
2
1
2
SCL
SDA
A1
Open drain I C interface clock input
2
Open drain Serial data I/O for the I C interface
2
3
Device address input for the I C interface
2
4
A0
Device address input for the I C interface
5
V-
Negative supply pin
Device ground pin
6
GND
RL
7
“Low” terminal of DCP
“Wiper” terminal of DCP
“High” terminal of DCP
Power supply pin
8
RW
RH
9
10
VCC
FN6421.0
July 17, 2007
2
ISL22313
Absolute Maximum Ratings
Thermal Information
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Voltage at any Digital Interface Pin
Thermal Resistance (Typical, Note 3)
θ
(°C/W)
120
JA
10 Lead MSOP. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
with Respect to GND . . . . . . . . . . . . . . . . . . . . . -0.3V to V +0.3
CC
Maximum Junction Temperature (Plastic Package). . . . . . . . +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3V to +6V
CC
V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -6V to 0.3V
Voltage at any DCP Pin with
respect to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V- to V
CC
Recommended Operating Conditions
I
(10s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±6mA
W
Temperature Range (Full Industrial) . . . . . . . . . . . .-40°C to +125°C
Power Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15mW
Latchup . . . . . . . . . . . . . . . . . . . . . . . . . Class II, Level A at +125°C
ESD
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3kV
Machine Model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .400V
V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.25V to 5.5V
CC
V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-2.25V to -5.5V
Max Wiper Current Iw . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±3.0mA
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTE:
3. θ is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
JA
Analog Specifications Over recommended operating conditions unless otherwise stated. Limits are established by characterization.
MIN
TYP
MAX
SYMBOL
PARAMETER
RH to RL resistance
TEST CONDITIONS
(Note 18) (Note 4) (Note 18)
UNIT
kΩ
R
W option
U option
T option
10
50
TOTAL
kΩ
100
kΩ
RH to RL resistance tolerance
-20
V-
+20
%
End-to-End Temperature Coefficient
W option
±150
±50
ppm/°C
ppm/°C
V
U, T option
V
, V
RH RL
DCP terminal voltage
Wiper resistance
V
and V to GND
RL
V
CC
RH
R
RH - floating, V = V-, force I current to
RL
the wiper, I = (V
70
10/10/25
0.1
250
Ω
W
W
- V )/R
W
CC
RL TOTAL
C /C /C
W
Potentiometer capacitance
Leakage on DCP pins
See Macro Model below.
pF
µA
H
L
(Note 16)
I
Voltage at pin from GND to V
@ RH; measured at RW, unloaded)
W option
1
LkgDCP
CC
VOLTAGE DIVIDER MODE (V- @ RL; V
CC
INL
Integral non-linearity
-1.5
±0.5
1.5
LSB
(Note 9)
(Note 5)
U, T option
W option
-1.0
-1.0
±0.2
±0.4
1.0
1.0
DNL
Differential non-linearity
LSB
(Note 8)
(Note 5)
U, T option
W option
-0.5
0
±0.15
1
0.5
5
ZSerror
(Note 6)
Zero-scale error
Full-scale error
LSB
(Note 5)
U, T option
W option
0
0.5
-1
2
FSerror
(Note 7)
-5
-2
0
LSB
(Note 5)
U, T option
-1
0
TC
Ratiometric temperature coefficient
DCP register set to 80 hex
±4
ppm/°C
V
(Notes 10, 16)
FN6421.0
July 17, 2007
3
ISL22313
Analog Specifications Over recommended operating conditions unless otherwise stated. Limits are established by characterization.
(Continued)
MIN
TYP
MAX
SYMBOL
PARAMETER
-3dB cut off frequency
TEST CONDITIONS
(Note 18) (Note 4) (Note 18)
UNIT
kHz
kHz
kHz
f
Wiper at midpoint (80hex) W option (10k)
Wiper at midpoint (80hex) U option (50k)
Wiper at midpoint (80hex) T option (100k)
1000
250
cutoff
(Note 16)
120
RESISTOR MODE (Measurements between RW and RL with RH not connected, or between RW and RH with RL not connected)
RINL
(Note 14)
Integral non-linearity
Differential non-linearity
Offset
W option
-3
±1.5
±0.3
±0.4
±0.15
1
3
MI
(Note 11)
U, T option
-1
1
MI
(Note 11)
RDNL
(Note 13)
W option
-1.5
-0.5
0
1.5
0.5
5
MI
(Note 11)
U, T option
MI
(Note 11)
Roffset
W option
MI
(Note 12)
(Note 11)
U, T option
0
0.5
2
MI
(Note 11)
TC
Resistance temperature coefficient
DCP register set between 32 hex and FF hex
±50
ppm/°C
R
(Notes 15, 16)
Operating Specifications Over the recommended operating conditions unless otherwise specified. Limits are established by
characterization.
MIN
TYP
MAX
SYMBOL
PARAMETER
TEST CONDITIONS
= +5.5V, V- = -5.5V, f = 400kHz;
SDA = Open; (for I C, active, read and write
states)
(Note 18) (Note 4) (Note 18)
UNIT
I
V
Supply Current (volatile
V
0.07
0.02
-0.18
-0.06
1
0.15
0.05
mA
CC1
CC
CC
SCL
2
write/read)
V
= +2.25V, V- = -2.25V, f
SCL
SDA = Open; (for I C, active, read and write
= 400kHz;
mA
mA
mA
mA
mA
mA
mA
CC
2
states)
I
V- Supply Current (volatile write/read) V- = -5.5V, V
= +5.5V, f
CC SCL
SDA = Open; (for I C, active, read and write
states)
= 400kHz;
-1
V-1
2
V- = -2.25V, V
CC
SDA = Open; (for I C, active, read and write
= +2.25V, f
SCL
= 400kHz;
-0.4
2
states)
I
V
Supply Current (non-volatile
V = +5.5V, V- = -5.5V, f
CC SCL
SDA = Open; (for I C, active, read and write
= 400kHz;
2
CC2
CC
2
write/read)
states)
V
= +2.25V, V- = -2.25V, f
SCL
SDA = Open; (for I C, active, read and write
= 400kHz;
0.3
0.7
CC
2
states)
I
V- Supply Current (non-volatile
write/read)
V- = -5.5V, V
CC
SDA = Open; (for I C, active, read and write
= +5.5V, f
SCL
= 400kHz;
-2
-1.2
-0.4
V-2
2
states)
V- Supply Current (non-volatile
write/read)
V- = -2.25V, V
CC
SDA = Open; (for I C, active, read and write
= +2.25V, f
SCL
= 400kHz;
-0.7
2
states)
FN6421.0
July 17, 2007
4
ISL22313
Operating Specifications Over the recommended operating conditions unless otherwise specified. Limits are established by
characterization. (Continued)
MIN
TYP
MAX
SYMBOL
PARAMETER
TEST CONDITIONS
= +5.5V, V- = -5.5V @ +85°C, I C
(Note 18) (Note 4) (Note 18)
UNIT
2
I
V
Current (standby)
V
0.2
1
1.5
2.5
1
µA
SB
CC
CC
interface in standby state
2
V
= +5.5V, V- = -5.5V @ +125°C, I C
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µs
CC
interface in standby state
2
V
= +2.25V, V- = -2.25V @ +85°C, I C
0.1
0.5
-0.7
-3
CC
interface in standby state
2
V
= +2.25V, V- = -2.25V @ +125°C, I C
2
CC
interface in standby state
2
I
V- Current (standby)
V- = -5.5V, V
= +5.5V @ +85°C, I C
-2.5
-4
V-SB
CC
interface in standby state
2
V- = -5.5V, V
= +5.5V @ +125°C, I C
CC
interface in standby state
2
V- = -2.25V, V
= +2.25V @ +85°C, I C
-1.5
-3
-0.3
-1
CC
interface in standby state
2
V- = -2.25V, V
= +2.25V @ +125°C, I C
CC
interface in standby state
2
I
V
Current (shutdown)
V
= +5.5V, V- = -5.5V @ +85°C, I C
0.2
1
1.5
2.5
1
SD
CC
CC
interface in standby state
2
V
= +5.5V, V- = -5.5V @ +125°C, I C
CC
interface in standby state
2
V
= +2.25V, V- = -2.25V @ +85°C, I C
0.1
0.5
-0.7
-3
CC
interface in standby state
2
V
= +2.25V, V- = -2.25V @ +125°C, I C
2
CC
interface in standby state
2
I
V- Current (standby)
V- = -5.5V, V
= +5.5V @ +85°C, I C
-2.5
-4
V-SB
CC
interface in standby state
2
V- = -5.5V, V
= +5.5V @ +125°C, I C
CC
interface in standby state
2
V- = -2.25V, V
= +2.25V @ +85°C, I C
-1.5
-3
-0.3
-1
CC
interface in standby state
2
V- = -2.25V, V
= +2.25V @ +125°C, I C
CC
interface in standby state
I
Leakage current, at pins A0, A1, SDA, Voltage at pin from GND to V
and SCL
-1
1
LkgDig
CC
t
DCP wiper response time
SCL falling edge of last bit of DCP data byte
to wiper new position
1.5
1.5
DCP
(Note 16)
t
DCP recall time from shutdown mode SCL falling edge of last bit of ACR data byte
to wiper stored position and RH connection
µs
ShdnRec
(Note 16)
Vpor
Power-on recall voltage
ramp rate
Minimum V
at which memory recall occurs
1.9
0.2
2.1
5
V
CC
VCC Ramp
V
V/ms
ms
CC
t
Power-up delay
V
above Vpor, to DCP Initial Value
CC
D
2
Register recall completed, and I C Interface
in standby state
EEPROM SPECIFICATION
EEPROM Endurance
1,000,000
50
Cycles
Years
ms
EEPROM Retention
Temperature T ≤ +55°C
t
Non-volatile Write cycle time
12
20
WC
(Note 17)
FN6421.0
July 17, 2007
5
ISL22313
Operating Specifications Over the recommended operating conditions unless otherwise specified. Limits are established by
characterization. (Continued)
MIN
TYP
MAX
SYMBOL
PARAMETER
TEST CONDITIONS
(Note 18) (Note 4) (Note 18)
UNIT
SERIAL INTERFACE SPECS
V
A1, A0, SDA, and SCL input buffer
LOW voltage
-0.3
0.3*V
V
V
IL
CC
V
A1, A0, SDA, and SCL input buffer
HIGH voltage
0.7*V
V
+ 0.
CC
IH
CC
3
Hysteresis SDA and SCL input buffer hysteresis
(Note 16)
0.05*V
0
V
CC
V
SDA output buffer LOW voltage,
0.4
10
V
OL
(Note 16) sinking 4mA
Cpin
A1, A0, SDA, and SCL pin
pF
(Note 16) capacitance
f
SCL frequency
Pulse width suppression time at SDA Any pulse narrower than the max spec is
400
50
kHz
ns
SCL
t
sp
and SCL inputs suppressed
t
SCL falling edge to SDA output data SCL falling edge crossing 30% of V , until
CC
900
ns
ns
AA
(Note 16) valid
SDA exits the 30% to 70% of V
window
CC
t
Time the bus must be free before the SDA crossing 70% of V
during a STOP
1300
BUF
(Note 16) start of a new transmission
CC
condition, to SDA crossing 70% of V
CC
during the following START condition
t
Clock LOW time
Measured at the 30% of V
Measured at the 70% of V
crossing
crossing
1300
600
ns
ns
ns
LOW
CC
t
Clock HIGH time
HIGH
CC
t
START condition setup time
SCL rising edge to SDA falling edge; both
crossing 70% of V
600
SU:STA
HD:STA
SU:DAT
CC
From SDA falling edge crossing 30% of V
t
t
START condition hold time
Input data setup time
600
100
ns
ns
CC
to SCL falling edge crossing 70% of V
CC
From SDA exiting the 30% to 70% of V
CC
window, to SCL rising edge crossing 30% of
V
CC
t
Input data hold time
From SCL rising edge crossing 70% of V
0
ns
HD:DAT
CC
to SDA entering the 30% to 70% of V
window
CC
t
STOP condition setup time
From SCL rising edge crossing 70% of V
to SDA rising edge crossing 30% of V
,
600
1300
0
ns
ns
ns
SU:STO
CC
CC
t
STOP condition hold time for read, or From SDA rising edge to SCL falling edge;
volatile only write
HD:STO
both crossing 70% of V
CC
t
Output data hold time
From SCL falling edge crossing 30% of V
,
DH
(Note 16)
CC
CC
until SDA enters the 30% to 70% of V
window
t
SDA and SCL rise time
From 30% to 70% of V
20 +
0.1 * Cb
250
250
400
ns
ns
R
CC
(Note 16)
t
SDA and SCL fall time
From 70% to 30% of V
20 +
0.1 * Cb
F
CC
(Note 16)
Cb
(Note 16)
Capacitive loading of SDA or SCL
Total on-chip and off-chip
10
pF
kΩ
Rpu
SDA and SCL bus pull-up resistor
Maximum is determined by t and t
R F
1
(Note 16) off-chip
For Cb = 400pF, max is about 2kΩ~2.5kΩ
For Cb = 40pF, max is about 15kΩ~20kΩ
FN6421.0
July 17, 2007
6
ISL22313
Operating Specifications Over the recommended operating conditions unless otherwise specified. Limits are established by
characterization. (Continued)
MIN
TYP
MAX
SYMBOL
PARAMETER
A1 and A0 setup time
A1 and A0 hold time
TEST CONDITIONS
Before START condition
After STOP condition
(Note 18) (Note 4) (Note 18)
UNIT
ns
t
600
600
SU:A
t
ns
HD:A
NOTES:
4. Typical values are for T = +25°C and 3.3V supply voltage.
A
5. LSB: [V(R
)
– V(R ) ]/255. V(R
)
and V(R ) are V(R ) for the DCP register set to FF hex and 00 hex respectively. LSB is the
W 0
W 255
W 0 W 255
W
incremental voltage when changing from one tap to an adjacent tap.
6. ZS error = V(RW) /LSB.
0
7. FS error = [V(RW)
– V ]/LSB.
CC
255
8. DNL = [V(RW) – V(RW) ]/LSB-1, for i = 1 to 255. i is the DCP register setting.
i-1
i
9. INL = [V(RW) – i • LSB – V(RW) ]/LSB for i = 1 to 255
i
0
Max(V(RW) ) – Min(V(RW) )
6
10
i
i
10.
for i = 16 to 255 decimal, T = -40°C to +125°C. Max( ) is the maximum value of the wiper
[Max(V(RW) ) + Min(V(RW) )] ⁄ 2 165°C voltage and Min ( ) is the minimum value of the wiper voltage over the temperature range.
--------------------------------------------------------------------------------------------- ----------------
TC
=
×
V
+
i
i
11. MI = |RW
– RW |/255. MI is a minimum increment. RW
and RW are the measured resistances for the DCP register set to FF hex and
255 0
255
0
00 hex respectively.
12. Roffset = RW /MI, when measuring between RW and RL.
0
Roffset = RW
/MI, when measuring between RW and RH.
255
13. RDNL = (RW – RW )/MI -1, for i = 16 to 255.
i-1
i
14. RINL = [RW – (MI • i) – RW ]/MI, for i = 16 to 255.
i
0
6
15.
for i = 16 to 255, T = -40°C to +125°C. Max( ) is the maximum value of the resistance and Min ( ) is
the minimum value of the resistance over the temperature range.
[Max(Ri) – Min(Ri)]
10
--------------------------------------------------------------- ----------------
165°C
[Max(Ri) + Min(Ri)] ⁄ 2 +
TC
=
×
R
16. Limits should be considered typical and are not production tested.
2
17. t is the time from a valid STOP condition at the end of a Write sequence of I C serial interface, to the end of the self-timed internal non-volatile
WC
write cycle.
18. Parts are 100% tested at +25°C. Over temperature limits established by characterization and are not production tested.
DCP Macro Model
R
TOTAL
RH
RL
C
L
C
H
C
W
10pF
10pF
25pF
RW
SDA vs SCL Timing
t
sp
t
t
t
t
R
F
HIGH
LOW
SCL
t
SU:DAT
t
t
t
SU:STO
SU:STA
HD:DAT
t
HD:STA
SDA
(INPUT TIMING)
t
t
t
BUF
AA
DH
SDA
(OUTPUT TIMING)
FN6421.0
July 17, 2007
7
ISL22313
A0 and A1 Pin Timing
STOP
START
SCL
CLK 1
SDA
t
t
HD:A
SU:A
A0, A1
Typical Performance Curves
80
2.0
1.5
1.0
0.5
0
T = +125ºC
70
60
50
40
30
20
10
0
T = +25ºC
I
CC
-0.5
-1.0
-1.5
-2.0
I
V-
T = -40ºC
0
50
100
150
200
250
-40
0
40
TEMPERATURE (°C)
80
120
TAP POSITION (DECIMAL)
FIGURE 2. STANDBY I
AND I vs TEMPERATURE
V-
FIGURE 1. WIPER RESISTANCE vs TAP POSITION
[ I(RW) = V /R ] FOR 10kΩ (W)
CC
CC TOTAL
0.50
0.50
0.25
0
V
= 5.5V
CC
T = +25ºC
T = +25ºC
V
= 2.25V
CC
0.25
0
-0.25
-0.50
-0.25
-0.50
V
= 5.5V
V
= 2.25V
100
CC
100
TAP POSITION (DECIMAL)
CC
0
50
150
200
250
0
50
150
200
250
TAP POSITION (DECIMAL)
FIGURE 4. INL vs TAP POSITION IN VOLTAGE DIVIDER
FIGURE 3. DNL vs TAP POSITION IN VOLTAGE DIVIDER
MODE FOR 10kΩ (W)
MODE FOR 10kΩ (W)
FN6421.0
July 17, 2007
8
ISL22313
Typical Performance Curves (Continued)
2.0
0
10k
1.6
1.2
-1
-2
V
= 2.25V
CC
50k
V
= 5.5V
CC
0.8
50k
-3
-4
10k
V
= 2.25V
V
= 5.5V
CC
CC
0.4
0
-5
-40
0
40
80
120
-40
0
40
TEMPERATURE (ºC)
80
120
TEMPERATURE (ºC)
FIGURE 5. ZS ERROR vs TEMPERATURE
FIGURE 6. FS ERROR vs TEMPERATURE
2.0
0.5
0.25
0
T = +25ºC
T = +25ºC
V
= 5.5V
1.5
1.0
CC
V
= 2.25V
CC
0.5
0
-0.25
-0.50
V
= 2.25V
100
CC
V
= 5.5V
CC
50
-0.5
0
100
150
200
250
0
50
150
200
250
TAP POSITION (DECIMAL)
TAP POSITION (DECIMAL)
FIGURE 7. DNL vs TAP POSITION IN RHEOSTAT MODE FOR
FIGURE 8. INL vs TAP POSITION IN RHEOSTAT MODE FOR
10kΩ (W)
10kΩ (W)
200
1.60
10k
160
1.20
10k
120
80
0.80
5.5V
0.40
0.00
50k
40
50k
2.25V
0
-0.40
16
66
116
166
216
266
-40
0
40
80
120
TAP POSITION (DECIMAL)
TEMPERATURE (ºC)
FIGURE 10. TC FOR VOLTAGE DIVIDER MODE IN ppm
FIGURE 9. END TO END R
TOTAL
% CHANGE vs
TEMPERATURE
FN6421.0
July 17, 2007
9
ISL22313
Typical Performance Curves (Continued)
500
INPUT
OUTPUT
10k
400
300
200
50k
100
WIPER AT MID POINT (POSITION 80h)
= 10kΩ
R
TOTAL
0
16
66
116
166
216
TAP POSITION (DECIMAL)
FIGURE 12. FREQUENCY RESPONSE (1MHz)
FIGURE 11. TC FOR RHEOSTAT MODE IN ppm
CS
SCL
WIPER UNLOADED,
WIPER
MOVEMENT FROM 0h to FFh
FIGURE 13. MIDSCALE GLITCH, CODE 7Fh TO 80h
FIGURE 14. LARGE SIGNAL SETTLING TIME
Bus Interface Pins
Pin Description
Serial Data Input/Output (SDA)
Potentiometers Pins
2
The SDA is a bidirectional serial data input/output pin for I C
interface. It receives device address, operation code, wiper
RH and RL
The high (RH) and low (RL) terminals of the ISL22313 are
equivalent to the fixed terminals of a mechanical
potentiometer. RH and RL are referenced to the relative
position of the wiper and not the voltage potential on the
terminals. With WR set to 255 decimal, the wiper will be
closest to RH, and with the WR set to 0, the wiper is closest
to RL.
2
address and data from an I C external master device at the
rising edge of the serial clock SCL, and it shifts out data after
each falling edge of the serial clock.
SDA requires an external pull-up resistor, since it is an open
drain input/output.
Serial Clock (SCL)
2
RW
This input is the serial clock of the I C serial interface. SCL
requires an external pull-up resistor, since it is an open drain
input.
RW is the wiper terminal, and it is equivalent to the movable
terminal of a mechanical potentiometer. The position of the
wiper within the array is determined by the WR register.
FN6421.0
July 17, 2007
10
ISL22313
Device Address (A1, A0)
Memory Description
The address inputs are used to set the least significant 2 bits
of the 7-bit I C interface slave address. A match in the slave
The ISL22313 contains one non-volatile 8-bit Initial Value
Register (IVR), fourteen General Purpose non-volatile 8-bit
registers and two volatile 8-bit registers: Wiper Register (WR)
and Access Control Register (ACR). Memory map of ISL22313
is in Table 1. The non-volatile register (IVR) at address 0,
contains initial wiper position and volatile register (WR) contains
current wiper position.
2
address serial data stream must match with the Address
input pins in order to initiate communication with the
ISL22313. A maximum of four ISL22313 devices may
2
occupy the I C serial bus (see Table 3).
Principles of Operation
TABLE 1. MEMORY MAP
The ISL22313 is an integrated circuit incorporating one DCP
with its associated registers, non-volatile memory and an I C
ADDRESS
2
(hex)
10
F
NON-VOLATILE
VOLATILE
serial interface providing direct communication between a
host and the potentiometer and memory. The resistor array
is comprised of individual resistors connected in series. At
either end of the array and between each resistor is an
electronic switch that transfers the potential at that point to
the wiper.
N/A
ACR
Reserved
E
D
C
B
A
9
General Purpose
General Purpose
General Purpose
General Purpose
General Purpose
General Purpose
General Purpose
General Purpose
General Purpose
General Purpose
General Purpose
General Purpose
General Purpose
General Purpose
IVR
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
WR
The electronic switches on the device operate in a “make
before break” mode when the wiper changes tap positions.
When the device is powered down, the last value stored in
IVR will be maintained in the non-volatile memory. When
power is restored, the contents of the IVR are recalled and
loaded into the WR to set the wiper to the initial value.
8
7
DCP Description
6
The DCP is implemented with a combination of resistor
elements and CMOS switches. The physical ends of each
DCP are equivalent to the fixed terminals of a mechanical
potentiometer (RH and RL pins). The RW pin of the DCP is
connected to intermediate nodes, and is equivalent to the
wiper terminal of a mechanical potentiometer. The position
of the wiper terminal within the DCP is controlled by an 8-bit
volatile Wiper Register (WR). When the WR of a DCP
contains all zeroes (WR[7:0]= 00h), its wiper terminal (RW)
is closest to its “Low” terminal (RL). When the WR register of
a DCP contains all ones (WR[7:0]= FFh), its wiper terminal
(RW) is closest to its “High” terminal (RH). As the value of
the WR increases from all zeroes (0) to all ones (255
decimal), the wiper moves monotonically from the position
closest to RL to the position closest to RH. At the same time,
the resistance between RW and RL increases monotonically,
while the resistance between RH and RW decreases
monotonically.
5
4
3
2
1
0
The non-volatile IVR and volatile WR registers are
accessible with the same address.
The Access Control Register (ACR) contains information
and control bits described below in Table 2.
The VOL bit (ACR[7]) determines whether the access to
wiper registers WR or initial value registers IVR.
TABLE 2. ACCESS CONTROL REGISTER (ACR)
BIT #
7
6
5
4
0
3
0
2
0
1
0
0
0
While the ISL22313 is being powered up, the WR is reset to
80h (128 decimal), which locates RW roughly at the center
between RL and RH. After the power supply voltage
becomes large enough for reliable non-volatile memory
reading, the WR will be reloaded with the value stored in a
non-volatile Initial Value Register (IVR).
NAME
VOL
SHDN WIP
If VOL bit is 0, the non-volatile IVR register is accessible. If
VOL bit is 1, only the volatile WR is accessible. Note: Value
is written to IVR register also is written to the WR. The
default value of this bit is 0.
The WR and IVR can be read or written to directly using the
I C serial interface as described in the following sections.
The SHDN bit (ACR[6]) disables or enables Shutdown mode.
When this bit is 0, i.e. DCP is forced to end-to-end open
circuit and RW is shorted to RL as shown on Figure 15.
Default value of the SHDN bit is 1.
2
FN6421.0
July 17, 2007
11
ISL22313
2
All I C interface operations must begin with a START
condition, which is a HIGH to LOW transition of SDA while
SCL is HIGH. The ISL22313 continuously monitors the SDA
and SCL lines for the START condition and does not
respond to any command until this condition is met (see
Figure 16). A START condition is ignored during the power-
up of the device.
RH
RW
RL
2
All I C interface operations must be terminated by a STOP
FIGURE 15. DCP CONNECTION IN SHUTDOWN MODE
condition, which is a LOW to HIGH transition of SDA while
SCL is HIGH (see Figure 16). A STOP condition at the end
of a read operation, or at the end of a write operation places
the device in its standby mode.
The WIP bit (ACR[5]) is a read-only bit. It indicates that non-
volatile write operation is in progress. It is impossible to write
to the WR or ACR while WIP bit is 1.
2
An ACK (Acknowledge) is a software convention used to
indicate a successful data transfer. The transmitting device,
either master or slave, releases the SDA bus after
transmitting eight bits. During the ninth clock cycle, the
receiver pulls the SDA line LOW to acknowledge the
reception of the eight bits of data (see Figure 17).
I C Serial Interface
2
The ISL22313 supports an I C bidirectional bus oriented
protocol. The protocol defines any device that sends data
onto the bus as a transmitter and the receiving device as the
receiver. The device controlling the transfer is a master and
the device being controlled is the slave. The master always
initiates data transfers and provides the clock for both
transmit and receive operations. Therefore, the ISL22313
operates as a slave device in all applications.
The ISL22313 responds with an ACK after recognition of a
START condition followed by a valid Identification Byte, and
once again after successful receipt of an Address Byte. The
ISL22313 also responds with an ACK after receiving a Data
Byte of a write operation. The master must respond with an
ACK after receiving a Data Byte of a read operation
2
All communication over the I C interface is conducted by
sending the MSB of each byte of data first.
Protocol Conventions
A valid Identification Byte contains 10100 as the five MSBs,
and the following two bits matching the logic values present
at pins A1 and A0. The LSB is the Read/Write bit. Its value is
“1” for a Read operation and “0” for a Write operation (see
Table 3).
Data states on the SDA line must change only during SCL
LOW periods. SDA state changes during SCL HIGH are
reserved for indicating START and STOP conditions (see
Figure 16). On power-up of the ISL22313, the SDA pin is in
the input mode.
TABLE 3. IDENTIFICATION BYTE FORMAT
LOGIC VALUES AT PINS A1 AND A0, RESPECTIVELY
1
0
1
0
0
A1
A0
R/W
(MSB)
(LSB)
SCL
SDA
START
DATA
DATA
DATA
STOP
STABLE
CHANGE STABLE
FIGURE 16. VALID DATA CHANGES, START AND STOP CONDITIONS
FN6421.0
July 17, 2007
12
ISL22313
SCL FROM
MASTER
1
8
9
SDA OUTPUT FROM
TRANSMITTER
HIGH IMPEDANCE
HIGH IMPEDANCE
SDA OUTPUT FROM
RECEIVER
START
ACK
FIGURE 17. ACKNOWLEDGE RESPONSE FROM RECEIVER
WRITE
S
SIGNALS FROM
THE MASTER
T
A
R
T
S
T
O
P
IDENTIFICATION
BYTE
ADDRESS
BYTE
DATA
BYTE
SIGNAL AT SDA
1 0 1 0 0 A1A0 0
0 0 0 0
SIGNALS FROM
THE SLAVE
A
C
K
A
C
K
A
C
K
FIGURE 18. BYTE WRITE SEQUENCE
S
T
A
R
T
S
T
A
R
T
SIGNALS
FROM THE
MASTER
S
T
O
P
A
C
K
A
C
K
IDENTIFICATION
BYTE WITH
R/W = 0
IDENTIFICATION
BYTE WITH
R/W = 1
A
C
K
ADDRESS
BYTE
SIGNAL AT SDA
1 0 1 0 0A1A0 0
0 0 0 0
1 0
1
0 A1A0 1
0
A
C
K
A
C
K
A
C
K
SIGNALS FROM
THE SLAVE
FIRST READ
DATA BYTE
LAST READ
DATA BYTE
FIGURE 19. READ SEQUENCE
Write Operation
Read Operation
A Read operation consist of a three byte instruction followed
by one or more Data Bytes (see Figure 19). The master
initiates the operation issuing the following sequence: a
START, the Identification byte with the R/W bit set to “0”, an
Address Byte, a second START, and a second Identification
byte with the R/W bit set to “1”. After each of the three bytes,
the ISL22313 responds with an ACK. Then the ISL22313
transmits Data Bytes as long as the master responds with an
ACK during the SCL cycle following the eighth bit of each
byte. The Data Bytes are from the registers indicated by an
internal pointer. This pointer initial value is determined by the
Address Byte in the Read operation instruction, and
A Write operation requires a START condition, followed by a
valid Identification Byte, a valid Address Byte, a Data Byte,
and a STOP condition. After each of the three bytes, the
ISL22313 responds with an ACK. At this time, the device
enters its standby state (see Figure 18).
The non-volatile write cycle starts after STOP condition is
determined and it requires up to 20ms delay for the next
non-volatile write. Thus, non-volatile registers must be
written individually.
FN6421.0
July 17, 2007
13
ISL22313
increments by one during transmission of each Data Byte.
After reaching the memory location 0Fh, the pointer “rolls
over” to 00h, and the device continues to output data for
each ACK received.The master terminates the read
operation issuing a NACK (ACK ) and a STOP condition
following the last bit of the last Data Byte (see Figure 19).
Applications Information
When stepping up through each tap in voltage divider mode,
some tap transition points can result in noticeable voltage
transients (or overshoot/undershoot) resulting from the
sudden transition from a very low impedance “make” to a
much higher impedance “break within an extremely short
period of time (<50ns). Two such code transitions are EFh to
F0h, and 0Fh to 10h. Note that all switching transients will
settle well within the settling time as stated in the datasheet.
A small capacitor can be added externally to reduce the
amplitude of these voltage transients, but that will also
reduce the useful bandwidth of the circuit, thus this may not
be a good solution for some applications. It may be a good
idea, in that case, to use fast amplifiers in a signal chain for
fast recovery.
FN6421.0
July 17, 2007
14
ISL22313
Mini Small Outline Plastic Packages (MSOP)
N
M10.118 (JEDEC MO-187BA)
10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
E1
E
INCHES
MILLIMETERS
SYMBOL
MIN
MAX
MIN
0.94
0.05
0.75
0.18
0.09
2.95
2.95
MAX
1.10
0.15
0.95
0.27
0.20
3.05
3.05
NOTES
-B-
0.20 (0.008)
INDEX
AREA
A
A1
A2
b
0.037
0.002
0.030
0.007
0.004
0.116
0.116
0.043
0.006
0.037
0.011
0.008
0.120
0.120
-
1 2
A
B
C
-
TOP VIEW
-
4X θ
0.25
(0.010)
R1
9
R
GAUGE
PLANE
c
-
D
3
SEATING
PLANE
E1
e
4
L
-C-
4X θ
0.020 BSC
0.50 BSC
-
L1
A
A2
E
0.187
0.016
0.199
0.028
4.75
0.40
5.05
0.70
-
SEATING
PLANE
L
6
0.10 (0.004)
-A-
C
C
L1
N
0.037 REF
10
0.95 REF
10
-
b
-H-
A1
7
e
D
R
0.003
0.003
-
-
0.07
0.07
-
-
-
0.20 (0.008)
C
R1
θ
-
a
SIDE VIEW
o
o
o
o
C
L
5
15
5
15
-
o
o
o
o
E
1
0
6
0
6
-
α
-B-
0.20 (0.008)
C
D
END VIEW
Rev. 0 12/02
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions
- H -
and are measured at Datum Plane.
Interlead flash and
protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. Formed leads shall be planar with respect to one another within
0.10mm (.004) at seating Plane.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
- B -
-A -
10. Datums
and
to be determined at Datum plane
.
- H -
11. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are for reference only
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6421.0
July 17, 2007
15
相关型号:
ISL22313UFU10Z-TK
Single Digitally Controlled Potentiometer (XDCP™), Low Noise, Low Power, I2C® Bus, 256 Taps; MSOP10; Temp Range: -40° to 125°C
RENESAS
ISL22313WFU10Z
Single Digitally Controlled Potentiometer (XDCP™), Low Noise, Low Power, I2C® Bus, 256 Taps; MSOP10; Temp Range: -40° to 125°C
RENESAS
ISL22313WFU10Z-TK
Single Digitally Controlled Potentiometer (XDCP™), Low Noise, Low Power, I2C® Bus, 256 Taps; MSOP10; Temp Range: -40° to 125°C
RENESAS
ISL22316UFRT10Z
Low Noise, Low Power I2C® Bus, 128 Taps; DFN10, MSOP10; Temp Range: -40° to 125°C
RENESAS
ISL22316UFRT10Z-TK
Low Noise, Low Power I2C® Bus, 128 Taps; DFN10, MSOP10; Temp Range: -40° to 125°C
RENESAS
ISL22316UFU10Z-TK
Low Noise, Low Power I2C® Bus, 128 Taps; DFN10, MSOP10; Temp Range: -40° to 125°C
RENESAS
©2020 ICPDF网 联系我们和版权申明