ISL5239 [INTERSIL]
Pre-Distortion Linearizer; 预失真线性化型号: | ISL5239 |
厂家: | Intersil |
描述: | Pre-Distortion Linearizer |
文件: | 总31页 (文件大小:651K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ISL5239
®
Data Sheet
September 2, 2005
FN8039.2
Pre-Distortion Linearizer
Features
The ISL5239 Pre-Distortion Linearizer (PDL) is a full featured
component for Power Amplifier (PA) linearization to improve PA
power efficiency and reduce PA cost.
• Output Sample Rates Up to 125MSPS
• Full 20MHz Signal Bandwidth
• Dynamic Memory Effects Compensation
• Input and Feedback Capture Memories
• LUT-based Digital Pre-distortion
The Radio Frequency (RF) PA is one of the most expensive and
power-consuming devices in any wireless communication
system. The ideal RF PA would have an entirely linear
relationship between input and output, expressed as a simple
gain which applies at all power levels. Unfortunately, realizable
RF amplifiers are not completely linear and the use of pre-
distortion techniques allows the substitution of lower cost/power
PA’s for higher cost/power PA’s.
• Two 18-bit Output Busses with Programmable Bit-Width
• 16-Bit Parallel µProcessor Interface
• Input Interpolator x2, x4, x8
• Programmable Frequency Response Correction
• Low Power Architecture
The ISL5239 pre-distortion linearizer enables the linearization of
less expensive PA’s to provide more efficient operation closer to
saturation. This provides the benefit of improved linearity and
efficiency, while reducing PA cost and operational expense.
• Threshold Comparator for Internal Triggering
• Quadrature or Digital IF Architecture
The ISL5239 features a 125MHz pre-distortion bandwidth
capable of full 5th order intermodulation correction for signal
bandwidths up to 20MHz. This bandwidth is particularly well
suited for 3G cellular deployments of UMTS and CDMA2000.
The device also corrects for PA memory effects that limit pre-
distortion performance including self heating.
• Lowest-Cost Full-Featured Part Available
• Pb-Free Plus Anneal Available (RoHS Compliant)
Applications
• Base Station Power Amplifier Linearization
• Operates with ISL5217 in Software Radio Solutions
• Compatible with the ISL5961 or ISL5929 D/A Converters
The ISL5239 combines an input formatter and interpolator, pre-
distortion linearizer, an IF converter, correction filter,
gain/phase/offset adjustment, output formatter, and input and
feedback capture memories into a single chip controlled by a 16-
bit linearizer interface.
Ordering Information
The ISL5239 supports log of power, linear magnitude, and linear
power based pre-distortion, utilizing two Look-Up Table (LUT)
based algorithms for the pre-distortion correction. The device
provides programmable scaling and offset correction, and
provides for phase imbalance adjustment.
TEMP
PART
NUMBER
PART
MARKING
RANGE
PKG.DWG.
PACKAGE #
o
( C)
ISL5239KI
ISL5239KI
-40 to 85 196 Ld BGA V196.15x15
ISL5239KIZ
(Note)
ISL5239KIZ -40 to 85 196 Ld BGA V196.15x15
(Pb-free)
ISL5239EVAL1
25
Evaluation Kit
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations. Intersil
Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2002, 2005. All Rights Reserved
1
All other trademarks mentioned are the property of their respective owners.
ISL5239
Block Diagram
SERCLK
SERSYNC
SEROUT
SERIN
CLK
TRIGIN
IOUT<17:0>
QOUT<17:0>
IIN<17:0>
INPUT
PRE-DISTORTER
WITH
IF CONVERTER
CORRECTION
FILTER
REAL 1X
REAL 2X
OUTPUT
DATA
FORMATTER
8-18 BIT-WIDTH
GAIN /
PHASE
OFFSET
ADJUST
FORMATTER
AND
REAL 1X
REAL 2X
COMPLEX
QIN<17:0>
CLKOUT
TWO 1K x 60
INTERPOLATOR
LUTs
X1, X2, X4, X8
ISTRB
COMPLEX
TRIGOUT
A<5:0>
P<15:0>
CS
INPUT
MEMORY
(2k x 32)
uP INTERFACE
WR
FEEDBACK
MEMORY
(1k x 20)
FBCLK
RD
BUSY
FB<19:0>
RESET
2
Functional Block Diagram
ISL5239 Pre-Distortion Linearizer
IIN<17:0>
OFFSET
BINARY
BYPASS
BYPASS
BYPASS
HALF
BYPASS
BYPASS
BYPASS
QIN<17:0>
HALF
BAND
FILTER
HALF
BAND
FILTER
/
I
IOUT<17:0>
QOUT<17:0>
CORRECTION
FILTER
REAL 1X
REAL 2X
OUTPUT
DATA
FORMATTER
8-18 BIT-WIDTH
BAND
/
IF
CONV.
GAIN /
PHASE
OFFSET
ADJUST.
CLKOUT
ISTRB
FILTER
/
Q
/
/
/
DE-MUX
1
2
3
20
IFIP I,Q
CM TEST
18
20
I
COMPLEX
Q
INPUT TYPE
(PAR/SERIAL)
HM, KM, LM, GM, DC OFFSETS
OUTPUT WORD WIDTH SEL.
OUTPUT VALUE TYPE
TEST
FUNC. SEL.
LUT
BYPASS
COEF. DATA
ADDRESS
MODE
REAL PIPELINE SEL.
COEF. ADDR.
OFFSET
SCALE
PD MAG.
CALCULATION
ADDR
SERIAL INPUT EN.
COEF. B SELECT
LUT DATA I
LUT DATA Q
LUT DELTA DATA I
LUT DELTA DATA Q
ACTIVE LUT
MEMORYEFFECT
COMPENSATION
DATA
LUT
TMS
TDI
TCK
TRST
JTAG
LUT ADDR
LUT ADDR AUTO INCR.
TDO
COEF. A
COEF. B
TRIGIN
PWR INTGR PER.
PWR LOW
SERIAL TO PAR.
PD MAG.
POWER
INTEGRATOR
THRESHOLD
COMPARE
PWR HIGH
MAX
MIN
uP
SERIN
SERCLK
EXTERNAL
MEMORY
EFFECTS
TRIG SEL
TRIG
IFIP I,Q
PD I,Q
PD MAG.
SER. OUTPUT EN.
SERSYNC
SEROUT
PAR. TO SERIAL
INPUT DELAY
COUNT
FPGA
FB DELAY COUNT
uP FORMAT
INPUT
INPUT
SEL
FB
STATE
FBCLK
FB<19:0>
uP
STATE
DATA ADDR
ADDR DATA
INPUT
CAPTURE
MEMORY 2K
FEEDBACK
CAPTURE
MEMORY 1K
TRIGOUT
CM TEST I,Q
MEMORY SELECT
CLK
A<5:0>
P<15:0>
CS
uP INTERFACE
WR
RD
BUSY
RESET
ISL5239
Pinout
196 CABGA
TOP VIEW
1
2
3
4
5
6
7
8
9
10
11
12
13
14
A
NC
VCCC
NC
IIN16
IIN17
IIN12
IIN14
IIN9
IIN4
IIN7
IIN0 QOUT15 GND QOUT11 GND
VCCIO VCCC
NC
B
C
D
E
F
ISTRB
A3
VCCC
IIN3
VCCIO VCCIO QOUT9 QOUT6 QOUT4
NC
GND
A0
A1
A2
A5
IIN15
IIN13
IIN11
IIN10
IIN8
IIN6
IIN2 QOUT16 QOUT12 VCCC QOUT7 QOUT1 QOUT3 QOUT0
IIN1 QOUT17 QOUT13QOUT8 QOUT2
QOUT5 FB17
VCCIO
CS
P0
VCCC
P1
RD
P2
A4
P3
WR
P4
IIN5
GND
VCCC QOUT14 QOUT10 FB14 FB19
FB18
GND
VCCC
FB10
VCCIO
FB13
FB16 FB15
G
P7
P6
P5
GND
P8
P11
P9
SEROUT FB9
FB12 FB11 SERIN
H
J
P10
P12
SERSYNC GND VCCIO SERCLK CLKOUT
VCCIO
FB6
VCCC
FB1
CLK
P13
GND
TDO
P14
P15
TRIGOUT FB7
FB5
FB3
FB8
FB4
RESET
TCK
K
L
BUSY
QIN6
QIN0
VCCC
GND IOUT11
GND
FB0
DCTEST TDI
TMS
QIN17 QIN9
QIN2 VCCIO IOUT13 IOUT9 VCCC IOUT4
TRIGIN FB2
M
N
P
QIN16 QIN15 QIN13 QIN11
QIN7
QIN4 IOUT16
GND
IOUT7 VCCIO IOUT3 IOUT0 IOUT2 FBCLK
TRST
NC
NC
QIN14 QIN10 VCCC
QIN3 IOUT17 IIOUT12 IOUT10 IOUT8
GND
VCCIO
NC
IOUT1
NC
VCCC QIN12
QIN8
QIN5
QIN1
IOUT15 IOUT14 VCCIO GND
IOUT6 IOUT5 VCCC
POWER PIN
SIGNAL PIN
NC (Do not connect)
GROUND PIN
THERMAL BALL
Pin Descriptions
NAME
POWER SUPPLY
VCCC
TYPE
DESCRIPTION
-
-
-
Positive Device Core Power Supply Voltage, 1.8V ±0.18V.
Positive Device Input/Output Power Supply Voltage, 3.3V ±0.165V.
Common Ground, 0V
VCCIO
GND
MICROPROCESSOR INTERFACE AND CONTROL
CLK
I
I
Input Clock. Rising edge drives all of the devices synchronous operations, except feedback capture.
RESET
Reset. (Active Low). Asserting reset will clear all configuration registers to their default values, reset all internal
states, and halt all processing.
P<15:0>
I/O
16-bit bi-directional data bus that operates with A<5:0>, CS, RD, and WR to write to and read from the devices
internal control registers. When the host system asserts CS and RD simultaneously, P<15:0> is an output bus,
under all other conditions, it is an input bus. Bit 15 is the MSB.
4
ISL5239
Pin Descriptions (Continued)
NAME
TYPE
DESCRIPTION
A<5:0>
I
6-bit address bus that operates with P<15:0>, CS, RD, and WR to write to and read from the devices internal
control registers. Bit 5 is the MSB.
CS
I
I
Chip Select. (active low). Enables device to respond to µP access by enabling read or write operations.
WR
Write Strobe, (active low). The data on P<15:0> is written to the destination selected by A<5:0> on the rising
edge of WR when CS is asserted (low).
RD
I
Read Strobe (Active Low). The data at the address selected by A(5:0) is placed on P<15:0> when RD is
asserted (low) and CS is asserted (low).
BUSY
O
µP Busy. (Active Low) Indicates that the µP interface is busy. The device asserts BUSY during a read operation
to indicate that the output data on P<15:0> is not ready, and it asserts this signal during a write operation to
indicate that it is not available for another read or write operation yet.
EXTERNAL SERIAL INTERFACE
SERCLK
O
Serial Clock. Clock signal provided to external device for serial input and output, derived from rising edge of
CLK.
SERSYNC
O
Serial Sync. Active high single-cycle pulse that is time coincident with the first sample of the 32-bit serial data
frame. Derived from by rising edge of CLK.
SEROUT
SERIN
O
I
Serial Output. Output data bit for the serial interface. Derived from the rising edge of CLK.
Serial Input.Input data bit for serial interface. Derived from rising edge of CLK.
FEEDBACK INTERFACE
FB<19:0>
I
Feedback Input Data. Parallel or serial data to be stored in the feedback memory. In parallel mode, all 20-
bits are stored on the rising edge of FBCLK. In serial mode, bit 0 is serial input data and bit 1 is serial sync,
sampled at the rising edge of FBCLK.
FBCLK
I
Input clock used for sampling the FB<19:0> pins.
TRIGGER INTERFACE
TRIGIN
I
Trigger input. Hardwired trigger source to be used to trigger an input/feedback capture. Sampled internally
with rising edge of CLK.
TRIGOUT
DATA INPUT
IIN<17:0>
O
Trigger output. Indicated that the capture system has been triggered, either internally or externally.
I
I
I input data. Real component of the complex input sample when input format is parallel. Alternating real and
imaginary when input format is muxed. Selectable as 2’s complement or offset binary.
QIN<17:0>
ISTRB
Q input data. Imaginary component of the complex input sample when input format is parallel. Unused in serial
input format.
I
I data strobe. (active high). Used in the muxed input format. When asserted, the input data buses contains valid
I data.
CLKOUT
O
Input data clock. Output clock for the data source driving the IIN<17:0> and QIN<17:0> inputs. Input data
busses sampled on the rising edge of CLK that generates the rising edge of CLKOUT.
DATA OUTPUT
IOUT<17:0>
I
I
I output data. Real component of the complex output sample driven by the rising edge of CLK. Selectable as
2’s complement or offset binary.
QOUT<17:0>
Q output data. IMaginary component of the complex output sample driven by the rising edge of CLK. Selectable
as 2’s complement or offset binary.
TEST ACCESS
DCTEST
O
DC tree output. NAND tree output for DC threshold test. Do not connect for normal operation.
JTAG TEST ACCESS PORT
TMS
TDI
I
I
JTAG Test Mode Select. Internally pulled up.
JTAG Test Data In. Internally pulled up.
JTAG Test Clock.
TCK
TRST
TDO
I
I
JTAG Test Reset (Active Low). Internally pulled-up.
JTAG Test Data Out.
O
5
ISL5239
The clock divider generates the CLKOUT signal which is
Functional Description
used to clock data from the input signal source. Typical input
sources include the ISL5217 quad programmable
upconverter, which is designed to operate seamlessly with
the ISL5239.
The ISL5239 is a full-featured digital pre-distortion part
featuring a high-performance lookup-table based pre-
distortion (PD) processing unit. It includes an interpolator for
upsampling and supports all varieties of upconversion
architectures with a programmable correction filter for
equalization including both sin(x)/x correction and removal of
frequency response imbalance between quadrature paths. It
also features gain, phase, and offset compensation for direct
upconversion, digital IF output for heterodyning, and
input/output capture memories with internal/external
triggering capabilities to facilitate closedloop feedback
processing. System implementation is typically as shown in
Figure 1. Although the power detect feedback is shown with
one Analog to Digital Converter (ADC), coherently
demodulated feedback signalsLO configurations with 1 or 2
ADC’s are also supported.
The interpolation factor is selectable in control word 0x02,
bits 6:4 as x1, x2, x4, and x8. The x1 mode bypasses all
three half-band filters. The x2 mode utilized HB1 and
bypasses HB2 and HB3. The x4 mode utilized HB1 and HB2
and bypasses HB3. Finally, the x8 mode utilizes all three
HBFs. Saturation status bits are provided for each of the
three HBFs in the status register 0x03.
Input data rates up to the CLK rate are supported, based on
the requirement CLK >= Fs * IP, where Fs is the input rate of
the incoming data and IP is the interpolation factor selected
in control word 0x02.
BYPASS
BYPASS
BYPASS
The block diagram on page 1 shows the internal functional
units within the ISL5239. In the following sections each
functional unit is described. The operation of the ISL5239 is
controlled by the register map listed in Table 3. Detailed
descriptions for each control/status register are given in
Tables 4 through 48. The control/status registers are referred
to in the discussion below.
HALF
BAND
FILTER
HALF
BAND
FILTER
HALF
BAND
FILTER
IIN<17:0>
I
QIN<17:0>
Q
/
18
/
/
/
1
2
3
20
20
20
FIGURE 2. INPUT FORMATTER AND INTERPOLATOR
BLOCK DIAGRAM
Each half-band filter performs a x2 interpolation by inserting
one zero between each input data sample, causing the
sampling frequency to double. The resulting zero-stuffed
data is then low pass filtered to reject the upsampling image.
The half-band filter frequency responses are as shown in
Figure 3.
HALFBAND FILTER 1 RESPONSE
0
FIGURE 1. SYSTEM OVERVIEW
-20
-40
Input Formatter and Interpolator (IFIP)
The Input Formatter and Interpolator interfaces to the data
source to provide for parallel data input via the IIN<17:0>,
QIN<17:0> busses, or serial input via the IIN<17:0> input
bus. In parallel input mode, both 18-bit input busses are
used to allow for parallel I and Q sample loading. In serial
mode, the data is input via the IIN<17:0> bus only, as the I
sample followed by the Q sample with the ISTRB input
asserted with each I sample. In this mode, the QIN<17:0>
bus is not utilized. The input data format is selectable as
either two’s complement or offset binary.
-60
-80
-100
-120
-140
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
NORMALIZED FREQUENCY (NYQUIST=1)
FIGURE 3. x2, HB1 ENABLED FREQUENCY RESPONSE
The Interpolator function is necessary because pre-
distorting a signal results in a much wider bandwidth signal
(typically 5x to 7x wider). The Input Formatter and
Interpolator is depicted in Figure 2.
Three interpolation rates (x2, x4, and x8) are supported by
the cascade of three Half-Band (HB) Filters. The ISL5239
includes an on-chip clock divider to facilitate input clocking.
6
ISL5239
Pre-Distorter (PD)
HALFBAND FILTER 2 RESPONSE
The function of the Pre-distorter is to compute the
magnitude of the input signal, look up a complex distortion
vector based on the magnitude, and apply that distortion to
the input signal.
0
-20
-40
The signal magnitude may be computed by any of three
different methods: log of power, linear magnitude or linear
power. The result is scaled and offset by programmable
amounts and becomes the address into a Look-up Table
(LUT).
-60
-80
-100
-120
-140
Two LUTs are available, one of which is ‘live’ in the circuit
and the other is offline and can be loaded via the processor
interface. This configuration allows instantaneous switching
of pre-distortion characteristics without unpredictable
effects on the processed signal.
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
NORMALIZED FREQUENCY (NYQUIST=1)
FIGURE 3A. X4, HB1 AND HB2 ENABLED FREQUENCY
RESPONSE
The LUTs contain a complex distortion vector, as well as
complex delta values which interact with an external
Thermal/Memory calculation circuit to predict the effects of
temperature changes on the RF amplifier’s behavior and
compensate. The average power into the amplifier is
computed and transmitted serially off chip. The external
circuits compute one or two memory effect coefficients
which are combined with the complex delta values in the
LUT to derive the final distortion vector. The distortion
vector is a rectangular complex value which is multiplied
with the input signal resulting in a magnitude based non-
linearity. Access to the LUT is optimized by the use of an
auto incrementing address register which allows the tables
to be updated with only one address register write
HALFBAND FILTER 3 RESPONSE
0
-20
-40
-60
-80
-100
-120
-140
operation. Control words 0x10 through 0x1d apply to the
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
NORMALIZED FREQUENCY (NYQUIST=1)
FIGURE 3B. X8, HB1-HB3 ENABLED FREQUENCY RESPONSE
7
ISL5239
pre-distorter. The pre-distorter block diagram is shown in
Figure 4.
IF Converter (IFC)
The output of the pre-distorter is a complex baseband signal
sampled at the system CLK rate. To provide greater system
flexibility, the IF Converter function can change this in one of
three different ways, providing frequency shifts, sample rate
changes and complex to real conversions.
FROM
IFIP
I
Q
I
Q
I
CM TEST
Q
LUT
ADDRESS
CALCULATION
Real 1X
The real 1x operating mode shifts the signal up by Fs/4 and
performs a complex to real conversion without changing the
base sample rate. This mode has 1/2 the bandwidth of the
original input signal, with the I output channel active and the
Q output channel set to 0. The operation of the IF converter
in this mode is shown in Figure 5.
TEST
FUNC. SEL.
BYPASS
OFFSET
SCALE
PD MAG.
POWER
LUT DATA I
ADDR
LUT
LUT DATA Q
LUT DELTA DATA I
LUT DELTA DATA Q
ACTIVE LUT
BYPASS
HALF
BAND
FILTER
I
I
MEMORY EFFECT
COMPENSATION
LUT ADDR
LUT ADDR AUTO INCR.
COEF. B SELECT
Re{*}
DATA
Q
FROM
PD
j(pi/2)(n)
e
SERIAL INPUT EN.
FIGURE 5. IF CONVERTER IN REAL 1X MODE OPERATION
PWR INTGR PER.
PWR LOW
COEF. A
COEF. B
POWER
INTEGRATOR
SERIAL TO PAR.
PWR HIGH
Real 2X
The real 2x operating mode converts complex to real at 2x
the sample rate and shifts the signal up to Fs/2 (Fs/4 of the
output rate). This mode has the same bandwidth as the
original signal with the I channel carrying the first of twwo
samples/clock and the Q channel carrying the second
sample. The operation of the IF Converter in this mode is
shown in Figure 6.
SERCLK
SERSYNC
SEROUT
EXTERNAL
SER. OUTPUT EN.
PAR. TO SERIAL
MEMORY
EFFECTS
FPGA
FIGURE 4. PRE-DISTORTER BLOCK DIAGRAM
BYPASS
Serial Interface
The serial interface for the external memory effects
-1
HALF
BAND
FILTER
I
I
Z
2
2
Re{*}
calculation consists of outputs SERCLK, SERSYNC, and
SEROUT and input SERIN. The serial output sends the 32-
bit unsigned average power off-chip for further processing.
The data is transmitted via the SEROUT pin MSB first, with
the first bit marked by a high pulse on the SERSYNC pin.
The SERCLK rate is scaled such that 32 bits are transmitted
in one period of the power integrator as controlled by register
0x18 bits 5:4. SEROUT is enabled by register 0x18 bit 12.
Q
Q
2
2
FROM
PD
j(pi/2)(n)
e
FIGURE 6. IF CONVERTER IN REAL 2X MODE OPERATION
The SERIN receives the thermal compensation parameters
from external processing using the same SERCLK and
SERSYNC used by the SEROUT. The chip expects to
receive 32 bits of data sequentially on the SERIN pin: the
MSB of A, followed by the rest of A, then the MSB of B,
followed by the rest of B. The SERIN is enabled by register
0x18 bit 8. When SERIN is disabled, registers 0x19 and
0x1a supply the A and B parameters for the thermal
compensation calculations. See Figure 16 for a detailed
timing diagram of the serial interface.
8
ISL5239
The IF converter frequency response is as shown in
Figure 7, with the folding effect shown in Figure 7A for the
x2, Fs/4 upconverter case.
Correction Filter (CF)
To compensate for imperfections in the analog filtering which
takes place after D/A conversion, the correction filter
provides an independent 13-tap FIR filter on each channel.
These filters may be programmed to remove differential
group delay and ripple characteristics of external analog
circuits including sin(x)/x correction and frequency response
imbalance between the I and Q channels using either
amplitude or group delay. This allows for correction of the
two physically separate I and Q analog response paths from
the DAC’s through the quadrature up-converter. It also
provides correction of the bandpass response when
operating in a complex frequency shifted IF mode. There are
two possible correction filter modes.
IFC FILTER RESPONSE (x2 MODE)
0
-20
-40
-60
-80
-100
-120
-140
Real 2X
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
When the IF Converter is set to generate 2x sampled real
data, the Correction Filter must be reconfigured to process
this data correctly. In this mode it effectively provides one 13-
tap block-mode filter when the coefficients for the two filters
are programmed identically.
NORMALIZED FREQUENCY (NYQUIST=1)
FIGURE 7. x2, IFC FREQUENCY RESPONSE
IFC FILTER RESPONSE (x2 MODE, WITH FOLDING)
0
BYPASS
-20
-40
I
2
-1
I
Z
2
I/Q FIRs
Q
2
-1
Z
Q
2
FROM
IFC
-60
-80
FIGURE 9. CORRECTION FILTER IN REAL 2X MODE
-100
-120
-140
Complex or Real 1x
When configured for operation in the complex mode, one 13-
tap filter is provided for each the I and Q channels. In Real 1x
mode, the Q channel is not used.
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
NORMALIZED FREQUENCY (NYQUIST=1)
FIGURE 7A. x2, IFC FREQUENCY RESP. WITH FOLDING
BYPASS
I-CHAN
I
I
FIR
Complex
Q
Q
Q-CHAN
FIR
The complex operating mode simply shifts the complex
baseband signal up by Fs/4 without any filtering or real
conversion. The operation of the IF converter in this mode is
shown in Figure 8.
FROM
IFC
FIGURE 10. CORRECTION FILTER IN COMPLEX MODE
BYPASS
Output Data Conditioner (ODC)
I
I
The Output Data Conditioner can apply I/Q balance
corrections, DC offset corrections and output format
conversions.
Q
Q
FROM
PD
j(pi/2)(n)
e
To compensate for gain/phase imperfections in external
analog modulation circuits which can result in poor image
rejection and reduced dynamic range, the ODC provides an
I/Q balance corrector. The I/Q balance corrector provides
four coefficients to control the magnitude of the direct and
FIGURE 8. IF CONVERTER IN COMPLEX MODE OPERATION
9
ISL5239
cross-coupled term on both the I and Q channels. Typical
implementation is as shown in Figure 10.
Feedback Memory
The feedback memory allows the user to capture data from
an external system and to view the memory through the
processor interface. The feedback memory is used to
observe the signals coming out of the amplifier. The 1K deep
memory grabs 20-bit data, either in parallel or serial format.
The feedback capture memory has its own clock input,
FBCLK, which must be synchronously derived from CLK and
meet the timing requirements.
Capture operations may be triggered by an external signal
(TRIGIN), by magnitude threshold crossings detection
programmed in the magnitude threshold maximum and
minimum values, or by system software writing to the
processor trigger bit in control word 0x04, bit 6. Separate
programmable delays of up to 32k samples are provided for
both input memory and feedback capture, allowing system
delays to be calibrated out for optimum alignment prior to
analysis. A TRIGOUT output is provided to indicates when a
capture operation has begun.
FIGURE 11. IMBALANCE CORRECTION
The Output formatter also provides DC offset correction to
1/4 LSB for 18-bit outputs to reduce analog DC offsets
introduced in external D/A conversion and modulation
circuits which can degrade system performance by causing
carrier feed through in complex baseband systems, or spurs
at DC for IF systems.
The processor interface to the capture memories is designed
to minimize the time required for loading/unloading. Although
access to the memories takes place through indirect address
and data registers, auto incrementing of the address is
supported so the address only needs to be written once to
access the entire memory. The capture memory is as shown
in Figure 13.
The ODC also provides programmable output precision 8 to
18-bits, with unbiased (convergent) rounding, since practical
system designs will require D/A converters with fewer than
18-bits. Internal accuracy is in excess of 18-bits, and utilizes
20-bit data paths in critical areas. Additionally, both two’s
complement and offset binary formats are supported.
TRIGIN
MAG COMP
Capture Memory (CM)
uP
TRIG SEL
TRIG
The Capture Memory allows the capture and viewing of data
from various points in the chip. The primary function is to
capture the digital signals coming into the pre-distorter. The
CM also provides a secondary mode, as it can provide
stimulus directly to the pre-Distorter. The CM is comprised of
both the Input and the Feedback Memories. The processor
interface provides the access to view, input, and alter the
memory data. Synchronized (triggered) capture of both input
and feedback signals is a typical requirement of adaptive
digital pre-distortion systems.
IFC I,Q
PD I,Q
PD MAG
INPUT DELAY
COUNT
FB DELAY COUNT
uP FORMAT
INPUT
STATE
FBCLK
FB<19:0>
INPUT
SEL
FB
STATE
uP
DATA ADDR
ADDR DATA
INPUT
CAPTURE
MEMORY 2K
FEEDBACK
CAPTURE
MEMORY 1K
CM TEST I,Q
MEMORY SELECT
Input Memory
uP INTERFACE
The input capture memory observes the signals going into
the amplifier. The 2K deep memory grabs complex samples
of data at one of three possible locations, either at the input
to the pre-distorter, the output of the pre-distorter, or from its
magnitude calculation. In addition to capturing input data,
this memory may also be configured as a data source. The
input capture memory may be pre-loaded with user defined
data and ‘played’ into the pre-distorter to stimulate the
system with signals that will elicit a desired response.
FIGURE 12. CAPTURE MEMORY BLOCK DIAGRAM
Memory Modes and Programming Instructions
Unless noted, the following discussion applies to both the
input memory and feedback memory operations. Prior to
invoking the memory to capture or send data, the control
word 0x06, bits 14:0 input trigger delay counter, 0x08 bits
14:0 feedback trigger delay count, 0x05, bits 10:0 input
length, 0x04, bits 2:1 input memory datain source or 0x04,
bit 8 feedback input format, and 0x04, bits 5:4 trigger select
registers must be loaded.
10
ISL5239
For the input data, the 0x04, bit 3 input data round bit must
also be selected and the feedback memory length count is
always set to 1024. To invoke memory operation, the 0x07,
bit 4 feedback memory mode or bits 1:0 input memory mode
and 0x04, bit 6 processor trigger must be controlled.
Single/Capture Mode
The sequence for the single shot stimulus mode, input
memory mode = SINGLE, and input memory capture mode
= CAPTURE with input capture mode = DELAY are the
identical. The function of the memory reading or writing
provides the difference between the two modes. In the single
shot case, the capture memories read data to the output bus,
and in the capture mode, they write data to the memories.
The sequence of operation in the Single/Capture mode is
described below.
There are three modes of operation — capture, loop, and
single-shot. The feedback memory does not have a loop
mode. A synopsis of the three modes is described below.
Capture Mode
There are two types of capture mode — advanced trigger
and single/capture. The advanced trigger mode allows data
to be captured around a trigger point, and the quantity of the
data captured after the trigger point is set by 0x06, bits 14:0.
When input memory capture mode = DELAY, the delay
register acts as a delay count prior to the capture or sending
of data. The max delay in this case is 32768 counts or
system clock ticks. The advanced trigger mode is used in
capture mode only. With the feedback capture operations
being analogous to the input memory, one feedback memory
exception is its control register 0x08, bits 14:0. It has 10
LSBs of available capture space.
The input capture status should be in IDLE and the input
memory capture mode in DELAY with the input memory
delay counter set to 0x0056. Note: The 15 LSBs of the input
memory delay counter are valid for the delay count in this
mode. After the trigger, Ox56 signifies there are 86 counts of
delay before the start of the capture/send of data to/from the
memory.
The user invokes the capture mode by writing the input
memory mode to CAPTURE. The system is in the capture
mode and the input memory status is ARMED. The system
waits for a trigger and the memory is idle at this point. When
a trigger occurs, the trigger causes the delay counters to
count 86 clocks of delay. At the end of the delay, the
memories begin their writing sequence until input memory
length data points are written. During the writing of data, the
input memory status is LOADING. When the final input
memory length point is written, the input memory status
returns to IDLE and a new capture transaction can be
initiated by writing CAPTURE to the input memory mode.
Advanced Trigger Capture Mode Sequence
The control register 0x0e, bit 13:12 input capture status,
should be in IDLE. Set 0x06, bit 15, input memory capture
mode to ADVANCE to signify an advanced trigger capture.
0x06, bits 14:0 set the input trigger delay counter to = 0x56
signifies there are 86 points captured after the occurrence of
the trigger point, 0x0e, bit 10:0, input trigger position and all
other points are captured prior to trigger point. Note: only the
11 lsbs are valid for the delay capture in this mode. The input
trigger position is a read-only register and adding to it the 11
lsbs of the input trigger delay counter determines the
position of the final data point captured after the trigger. If the
input trigger position is 0x1ff, the final point captured
occurred at address: 0x1ff + 0x56 = 0x255 or 597 (decimal).
The user must set the input trigger delay counter prior to
invoking the transaction of the capture.
For the Single Capture mode, the deviations from the
sequence are the writing of the input memory mode to
SINGLE, and the input memory status to SEND when
reading of the data from memory. All other operations are
analogous.
Loop Mode
This is a continuous play mode from the memories;
therefore, the memories should contain valid data before
invoking transactions. The length of each repeatable output
stream is controlled by the input memory length. Upon
outputting the final input memory length point, the hardware
resets to play another set of input memory length points from
the memory.
The user invokes the capture mode register by writing
CAPTURE to 0x07, bit 1:0 input memory mode. The system
is in the advanced trigger capture mode and 0x0e, bits
13:12, input capture status is ARMED. The system waits for
a trigger as the memory is continuously being written into.
When a trigger occurs, the trigger causes the memory to
load the data till the memory address is equal to input trigger
position + 11 lsbs of the input trigger delay counter. The
memory address that is time coincident with the trigger
occurrence latches to the input trigger position. During this
period, the input capture status is LOADING. When the final
capture point loads, the input capture status returns to IDLE
and a new capture transaction can be initiated by writing
CAPTURE to the input memory mode.
The user invokes the loop mode by writing input memory
mode to LOOP. The system is in the loop mode and the input
memory status = SEND. The memory starts reading data
continuously and a stop can be initiated by setting input
memory mode to IDLE during the transaction. The input
memory status returns to IDLE and a new loop transaction
can be initiated by writing the input memory mode to LOOP.
This is the only mode where immediate mode changes are
acknowledged during its transaction cycle.
11
ISL5239
into the memory. The I data is read from the memory on the
General Comments About Modes
DataHigh register and the Q data, DataLow register.
Once a trigger is detected in the ARMED condition, all
following triggers are ignored during the sequence. The
system does not acknowledge new triggers until a new
transaction is invoked and re-armed. When a new mode is
invoked, all subsequent invocations of new modes during the
duration of its sequence is ignored, except in the loop mode.
In the loop mode, an input memory mode change to IDLE is
processed immediately.
In the predistort magnitude input, the data is unsigned 16
bits and the software has to reshuffle the data to extract the
original magnitude. The DataHigh contains only the pre-
distorter magnitude bit 15, and the DataLow contains the
pre-distorter magnitude 14:0.
Writing/Reading the Memories from the Processor
Interface
When in the IDLE, all controls, addresses, and data, default
to the processor interface values.
In the auto-increment mode, the data is loaded in 16-bit
increments. The low word is written or read first followed by
the high word. The high word increments the address
counter and generates the actual write to the memory. For
reading, it just increments the counter. The input memory
select 0x04, bit 12, selects the memory to be written to or
read from.
Triggers
When a capture memory is ARMED, i.e. waiting for a trigger
to happen, the activation of the trigger occurs in three ways
— external, data dependent, and user invoked. The trigger
select, 0x04, bits 5:4, provides the selection of the trigger
source. When the pre-distorter magnitude bus values fall
between the range of 0x09 minimum and 0x0a maximum,
the data dependent trigger activates. The first of these
transitions causes a trigger to be detected and the remaining
triggers during the capture sequence is ignored.
When writing or reading a specific address, the 0x0b
address register must be loaded before the 0x0c and 0x0d
memory data registers. In the write, the high word
transaction will trigger the actual write to the memory and a
low word must be written first. For additional details, see the
uP interface section.
To invoke the user invoked trigger, 0x04, 5:4, set to
processor, the programmer writes a TRIGGER to the 0x04,
bit 6 processor trigger register. After a TRIGGER is in the
field, the user initiates the trigger by just writing to that
register. The user does not have to reset the trigger back to
IDLE. By setting the processor trigger bit to IDLE when not in
use, it keeps the circuit quiet and allows the user to write to
other values at that address without causing a trigger to
occur during operation. To disable the processor trigger, the
user should change trigger select to something other than
PROCESSOR and then change values in processor trigger.
If trigger select is not set to PROCESSOR, the system
ignores the trigger generated by processor trigger.
Microprocessor Interface
The microprocessor interface allows the ISL5239 to appear
as a memory mapped peripheral to the µP. All registers can
be accessed through this interface. The interface consists of
a 16 bit bidirectional data bus, P<15:0>, six bit address bus,
A<5:0>, a write strobe (WR), a read strobe (RD) and a chip
enable (CE). The interface is configured for separate read
and write strobe inputs.
The processor interface provides a simple parallel
Data/Control/Address bus for monitoring and controlling its
operation. The processor interface is asynchronous to the
CLK, and BUSY signal is included to indicate when read and
write operations are complete.
The feedback and input memory circuit uses the same
trigger; both circuits trigger at the same point with its
operation registers causing different operations to occur. The
user should monitor input memory status and feedback
memory status simultaneously before activating triggers.
Make sure both status registers are in ARMED before
activating triggers or the results from the capture can be
erroneous and data can be overwritten. Selecting processor
trigger (register 0x04, bits 5:4 = 00) while arming the input
and feedback memory circuits is a convenient way to ensure
no unexpected triggers occur before confirming ARMED
status of both circuits.
The register configuration is master/slave, where the slave
registers are updated from the masters and all reads access
the slaves.
The master registers are clocked by the µP WR strobe, are
writable and cleared by a hard reset. The slave registers are
clocked by CLK, and are readable and cleared by either a
hard or soft reset. The transfer of configuration data from the
master register to the slave register occurs synchronously
after an event and requires a four clock synchronization
period.
Input Data to Input Memory
The µP can perform back-to-back accesses to the register,
There are three sources of input data to the input memory —
interpolator, pre-distorter’s data outputs, and the pre-
distorter’s magnitude. Data from the interpolator and the
predistort output are the upper 16 bits with or without
rounding. Only 16 of the original 20 bits of I or Q is loaded
but must maintain four f
periods between accesses to
CLK
the same address. This limits the maximum µP access rate
for the RAM to 125MHz/4 = 31.25MHz.
12
ISL5239
The address map and bit field details for the microprocessor
interface is shown in the Tables 2-48. The procedures for
reading and writing to this interface are provided below.
3. Perform a direct write to control word 0x17 by setting up
the address on A<5:0>, data on P<15:0>, and generating
a rising edge on WR. The WR updates the contents of
0x014-0x017 and performs the auto increment, if
enabled.
Microprocessor Read/Write Procedure
Read Access to the LUT
The ISL5239 offers the user microprocessor read/write
access to all of the configuration registers and the capture
memory.
1. Perform a direct write to control word 0x13 by setting up
the address on A<5:0>, data on P<15:0>, and generating
a rising edge on WR. 0x13 selects the auto increment
mode and the LUT address as specified in bit 9:0.
Configuration Read/Write Procedure
2. Perform a direct read of any/all control words 0x14, 0x15,
0x16, in any order, by dropping the RD line low to transfer
data from the slave register selected by A<5:0> onto the
data bus P<15:0>.
Write Access to the Configuration Master
Registers
Perform a direct write to the configuration master registers
by setting up the address A<5:0>, data P<15:0>, enabling the
CS input, and generating WR strobe. The rising edge of the
WR initiates the transfer to the master register. Registers may
be written in any order.
3. Perform a direct read of control word 0x17 by dropping the
RD line low to transfer data from the slave register
selected by A<5:0> onto the data bus P<15:0>. Reading
from this control word performs the auto increment, if
enabled.
1. Write the global control register 0x00.
2. Write all remaining registers sequentially.
Capture Memory Read/Write Procedure
3. Load all IFIP, PD, IFC, CM and ODC coefficients and
control words.
Indirect addressing is used to access the Capture Memory.
The control word 0x04, bit 12 selects whether the input or
feedback memory is accessed and bit 13 selects the auto
address increment or manual modes. Control word 0x0b is
the memory address, and words 0x0c and 0x0d combine to
form the 32-bit word which is written or read from the
memory. The write to 0x0d triggers the write to the memory
and the auto increment of the address, if enabled. When
reading feedback capture memory, 0x0c bits 3:0 will contain
the upper four bits, and 0x0d, bits 15:0 will be the remaining
15-bits.
RD
WR
A<5:0>
0x00
xxxx
0x01 0x02 0x03 0x04 0x05
P<15:0>
FIGURE 13. CONFIGURATION WRITE TRANSFER
Read Access to the Configuration Slave Registers
Write Access to the Capture Memory
1. Perform a direct read of a configuration register by
dropping the RD line low to transfer data from the register
selected by A<5:0> onto the data bus P<15:0>.
1. Perform a direct write to control word 0x04 by setting up
the address on A<5:0>, data on P<15:0>, and generating
a rising edge on WR. 0x04 selects the auto increment
mode and the input or feedback memories.
RD
2. Perform a direct write to control word 0x0b by setting up
the address on A<5:0>, data on P<15:0>, and generating
a rising edge on WR. 0x0b selects the starting memory
address.
WR
A<5:0>
0X00
0X01 0X02 0X03 0X04 0X05
HI-Z
P<15:0>
3. Perform a direct write to 0x0c by setting up the address on
A<5:0>, data on P<15:0>, and generating a rising edge on
WR.
DATA VALID
FIGURE 14. CONFIGURATION READ TRANSFER
4. Perform a direct write to control word 0x0d by setting up
the address on A<5:0>, data on P<15:0>, and generating
a rising edge on WR. The WR updates the contents of
0x0c and 0x0d and performs the auto increment, if
enabled.
LUT Read/Write Procedure
Write Access to the LUT Memory
1. Perform a direct write to control word 0x13 by setting up
the address on A<5:0>, data on P<15:0>, and generating
a rising edge on WR. 0x13 selects the auto increment
mode and the LUT address as specified in bit 9:0.
2. Perform a direct write to any/all control words 0x14, 0x15,
or 0x16, in any order, by setting up the address on A<5:0>,
data on P<15:0>, and generating a rising edge on WR.
13
ISL5239
Read Access to the Capture Memory
Software Hard Reset
1. Perform a direct write to control word 0x04 by setting up
the address on A<5:0>, data on P<15:0>, and generating
a rising edge on WR. 0x04 selects the auto increment
mode and the input or feedback memories.
The µP can issue a reset command through the global
control register 0x00, bit 4. This reset is identical to asserting
the RESET pin, except the control fields 0x00 and 0x01 are
not affected, and the uP interface is not reset.
2. Perform a direct read of 0x0c by dropping the RD line low
to transfer data from the slave register selected by
A<5:0> onto the data bus P<15:0>.
Software Soft Reset
The uP can issue a reset command through the global
control register 0x00, bit 0, which is identical to a Software
hard reset, but none of the control registers are reset. A soft
reset leaves the device in an idle state.
3. Perform a direct read of control word 0x0d by dropping the
RD line low to transfer data from the slave register
selected by A<5:0> onto the data bus P<15:0>. Reading
from this control word performs the auto increment, if
enabled.
JTAG Test
The IEEE 1149.1 Joint Test Action Group boundary scan
standard operational codes shown in Table 9 are supported.
A separate application note is available with implementation
details and the BSDL file is available.
Correction Filter Read/Write Procedure
Write Access to the Correction Filter Coefficients
1. Perform a direct write to control word 0x28 by setting up
the address on A<5:0>, data on P<15:0>, and generating
a rising edge on WR. 0x28 selects the auto increment
mode.
TABLE 1. JTAG OP CODES SUPPORTED
INSTRUCTION
EXTEST
OP CODE
0000
2. Perform a direct write to control word 0x29 by setting up
the address on A<5:0>, data on P<15:0>, and generating
a rising edge on WR. 0x29 selects the coefficient address
for I or Q.
IDCODE
0001
SAMPLE/PRELOAD
INTEST
0010
0011
3. Perform a direct write to control word 0x2a by setting up
the address on A<5:0>, data on P<15:0>, and generating
a rising edge on WR.
BYPASS
1111
Power-up Sequencing
4. Repeat step 3 until all 13 coefficients for I and for Q have
been loaded as the master registers are transferred to the
slaves when the last Q coefficient is written.
The ISL5239 core and I/O blocks are isolated by structures
which may become forward biased if the supply voltages are
not at specified levels. During the power-up and power-down
operations, differences in the starting point and ramp rates of
the two supplies may cause current to flow in the isolation
structures which, when prolonged and excessive, can
reduce the usable life of the device. In general, the most
preferred case would be to power-up or down the core and
I/O structures simultaneously. However, it is also safe to
power-up the core prior to the I/O block if simultaneous
application of the supplies is not possible. In this case, the
I/O voltage should be applied within 10 ms to 100 ms
nominally to preserve component reliability. Bringing the
core and I/O supplies to their respective regulation levels in
a maximum time frame of a 100 ms, moderates the stresses
placed on both, the power supply and the ISL5239. When
powering down, simultaneous removal is preferred, but It is
also safe to remove the I/O supply prior to the core supply. If
the core power is removed first, the I/O supply should also
be removed within 10-100mS.
Read Access to the Correction Filter Coefficients
1. Perform a direct write to control word 0x028 by setting up
the address on A<5:0>, data on P<15:0>, and generating
a rising edge on WR. 0x28 selects the auto increment
mode.
2. Perform a direct write to control word 0x029 by setting up
the address on A<5:0>, data on P<15:0>, and generating
a rising edge on WR.
3. Perform a direct read of 0x2a by dropping the RD line low
to transfer data from the slave register selected by
A<5:0> onto the data bus P<15:0>.
Latency
To be provided later.
Reset
There are three types of chip resets.
RESET pin
Application Notes and Evaluation Boards
A hard reset can occur by asserting the input pin RESET
which resets all chip registers to their default condition, and
resets the uP interface.
The ISL5239 operation can be demonstrated via the
ISL5239EVAL1 board. All required hardware and Windows
GUI software are supplied with both a user’s manual and
accompanying applications notes.
14
ISL5239
Absolute Maximum Ratings
Thermal Information
o
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . +2.5VCCC, 4.6V VCCIO
Input, Output or I/O Voltage . . . . . . . . . . . . . . . . . GND -0.5V to 5.5V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 2
Thermal Resistance (Typical, Notes 1, 2)
θ
( C/W)
JA
196 BGA Package . . . . . . . . . . . . . . . . . . . . . . . . . .
w/200 LFM Air Flow . . . . . . . . . . . . . . . . . . . . . . . . .
w/400 LFM Air Flow . . . . . . . . . . . . . . . . . . . . . . . . .
42
38
36
o
Operating Conditions
o
Maximum Storage Temperature Range. . . . . . . . . . -65 C to 150 C
o
Voltage Range Core, V
. . . . . . . . . . . . . . . . . . +1.71V to +1.89V
CCC
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . 125 C
Voltage Range I/O, V
Temperature Range
Industrial. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40 C to 85 C
Input Low Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to +0.8V
. . . . . . . . . +3.135V to +3.465V
CCCIO (Note 3)
For Recommended Soldering Conditions, See Tech Brief TB334.
o
o
Input High Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to V
CC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. θ is measured in free air with the component mounted on a high effective thermal conductivity test board. See Tech Brief TB379.
JA
o
2. With “direct attach” features (i.e., vias in the PCB), the thermal resistance is 36 without airflow, w/200 it is 33, w/400 it is 31 C/W. Tie 196 BGA
package pins F6-9, G6-9, H6-9, J6-9 to heat sink or ground with vias to ensure maximum device heat dissipation.
3. Single supply operation of both the core VCCC and I/O VCCIO at 1.8V is not allowed.
o
o
DC Electrical Specifications V
PARAMETER
= 1.8± 5%, V
= 3.3 ±5%, T = -40 C to 85 C
CCC
CCIO
A
SYMBOL
TEST CONDITIONS
MIN
2.0
-
Typ
MAX
-
UNITS
Logical One Input Voltage
Logical Zero Input Voltage
Clock Input High
V
V
V
V
V
= 1.89V, V
= 1.71V, V
= 1.89V, V
= 1.71V, V
= 3.465V
= 3.135V
= 3.465V
= 3.135V
V
V
IH
CCC
CCC
CCC
CCC
CCIO
CCIO
CCIO
CCIO
V
0.8
-
IL
V
2.0
-
V
IHC
Clock Input Low
V
V
0.8
-
V
ILC
OH
Output High Voltage
I
I
= -2mA, V
= 1.71V, V
= 3.135V
2.6
V
-0.2
CC
V
OH
OL
CCC CCIO
= 1.71V, V = 3.135V
CCIO
Output Low Voltage
V
= 2mA, V
0.2
0.4
10
V
OL
CCC
or GND, V
Input Leakage Current
I
V
V
= V
= 1.89V,
= 1.89V,
= 1.89V,
-10
1
µA
L
IN
CCIO
= 3.465V
CCC
CCC
CCC
CCIO
Output Leakage Current
I
V
V
= V
or GND, V
-10
1
10
-
µA
µA
µA
H
IN
CCIO
= 3.465V
CCIO
Input Pull-up Leakage Current Low
Input Pull-up Leakage Current High
Standby Power Supply Current
Operating Power Supply Current
I
V
V
= V or GND, V
CCIO
-100
-50
1
SL
IN
= 3.465V, TMS, TRST, TDI
CCIO
I
V
V
= V
or GND, V = 1.89V,
CCC
-
-
-
10
SH
IN
CCIO
= 3.465V, TMS, TRST, TDI
CCIO
I
V
= 1.89V, V = 3.465V, Outputs Not
CCIO
1
100
3
500
mA(core)
uA(I/O)
CCSB
CCC
Loaded
I
f = 125MHz, V = V
V
or GND,
300
100
mA (Core)
mA(I/O),
(Note 4)
CCOP
IN
= 3.465V, V
CCIO
= 1.89V,
CCC
CCIO
Input Capacitance
Output Capacitance
NOTES:
C
Freq = 1MHz, V
Open, All Measurements
-
-
5
5
pF (Note 5)
IN
CCIO
Are Referenced to Device Ground
C
Freq = 1MHz, V Open, All Measurements
pF (Note 5)
OUT
CCIO
are Referenced to Device Ground
4. Power Supply current is proportional to operation frequency. Typical rating for I
o
is 2.0 mA/MHz (core) and 0.5mA/MHz(I/O),
CCOP
5. Capacitance T = 25 C, controlled via design or process parameters and not directly tested. Characterized upon initial design and at major
A
process or design changes.
15
ISL5239
o
o
AC Electrical Specifications
V
= 1.8± 5%, V
= 3.3 ± 5%, T = -40 C to 85 C (Note 6)
CCIO A
CCC
PARAMETER
SYMBOL
MIN
-
MAX
UNITS
CLK Frequency
f
t
125
-
MHz
CLK
CLK
CLK Period
8.0
3
3
2
2
2
1
4
0
4
0
3
-
ns
CLK High, FBCLK High
CLK Low, FBCLK Low
t
-
ns
CH
CL
RS
RH
t
-
ns
Setup Time RESET High to CLK (Note 8)
Hold RESET High from CLK
RESET Low Pulse Width (Note 7)
Setup Time P<15:0> to WR
Hold Time P<15:0> from WR
Setup Time A<5:0> to WR
Hold Time A<5:0> from WR
Setup Time CS to WR
t
t
-
ns
-
ns
t
t
t
t
t
t
t
t
t
t
-
CLK Cycles
RPW
PSW
PHW
ASW
AHW
CSW
CHW
BDW
WSC
WHC
-
ns
ns
-
-
ns
-
ns
-
ns
Hold Time CS from WR
-
ns
Delay Time from WR to BUSY
Setup Time WR to CLK (Note 9)
Hold Time WR from CLK
8
-
ns
3
0
3
3
1
2
1
2
-2
3
-
ns
-
ns
WR Pulse Width High
t
-
ns
WPWH
WPWL
WR Pulse Width Low
t
-
ns
Setup Time from RD to CLK
Hold Time RD from CLK
t
t
t
t
t
t
-
ns
RSR
RHR
CSR
CHR
ASR
ASC
-
ns
Setup Time from CS to CLK
Hold Time CS from CLK
-
ns
-
ns
Setup Time from A<5:0> to CS and RD (Note 7)
Setup Time from A<5:0> to CLK
-
CLK Cycles
ns
-
Delay Time from CS and RD to P<15:0> Enable (Note 7)
Delay Time from CS and RD to P<15:0> Disable (Note 7)
Delay Time from CLK to P<15:0> valid
t
t
8
6
7
-
ns
RE
RD
-
ns
t
-
ns
DR1
Setup Time IIN<17:0>, QIN<17:0>, or ISTRB to CLK
Hold Time IIN<17:0>, QIN<17:0>, or ISTRB from CLK
Delay Time from CLK to CLKOUT in x1 Mode
Delay Time from CLK to CLKOUT in x2, x4, x8 Mode
Delay Time from CLK to IOUT<17:0>, QOUT<17:0> valid
Time Skew from CLK to FBCLK (Note 7)
t
2
2
ns
DS
DH
t
-
ns
t
7
8
8
ns
CC01
CC0N
PDC1
CFBD
t
ns
t
2 (Note 7)
-0.1
ns
t
t
- 2
ns
CLK
Setup Time from FB<19:0> to FBCLK
t
t
2
ns
FS
FH
Hold Time FB<19:0> from FBCLK
1
ns
Delay Time from CLK to SERSYNC
t
t
t
2 (Note 7)
2 (Note 7)
2 (Note 7)
2 (Note 7)
1
7
8
9
8
ns
SD1
SD2
SC1
SCN
DSS
Delay Time from CLK to SEROUT
ns
Delay Time from CLK to SERCLK in Period_32 Mode
ns
Delay Time from CLK to SERCLK in Period_64 or Period_128 Modes
Setup Time from SERIN to CLK (Note 7)
t
ns
t
ns
16
ISL5239
o
o
AC Electrical Specifications
V
= 1.8± 5%, V
= 3.3 ± 5%, T = -40 C to 85 C (Note 6) (Continued)
CCIO A
CCC
PARAMETER
Hold Time SERIN from CLK (Note 7)
SYMBOL
MIN
MAX
UNITS
ns
t
t
1
DHS
PDC
DS1
DH1
Delay Time from CLK to TRIGOUT
Setup Time from TRIGIN to CLK
Hold Time TRIGIN from CLK
Setup Time from TMS and TDI to TCK
Hold Time TMS and TDI from TCK
Delay Time from TCK to TDO valid
Test Clock Frequency
2 (Note 7)
7
ns
t
2
2
3
3
ns
t
ns
t
t
t
ns
TS
TH
TD
ns
8
50
3
ns
f
MHz
ns
T
Output Rise/Fall Time (Note 7)
NOTES:
t
-
RF
6. AC tests performed with C = 70pF. Input reference level for CLK is 1.5V, all other inputs 1.5V.
L
Test V = 3.0V, V
IH
= 3.0V, V = 0V, V = 1.5V, V
= 1.5V.
OH
IHC
IL OL
7. Controlled via design or process parameters and not directly tested. Characterized upon initial design and at major process or design changes.
8. Can be asynchronous to CLK, specification guarantying which CLK edge the device comes out of reset on.
9. Can be asynchronous to CLK, specification guarantying which CLK edge the device begins the read cycle on.
AC Test Load Circuit
S
1
DUT
C †
L
±
I
1.5V
I
OL
OH
SWITCH S OPEN FOR I
CCSB
AND I
CCOP
1
EQUIVALENT CIRCUIT
† TEST HEAD CAPACITANCE
Waveforms
CLK
t
t
SC1, SCN
t
CLK
t
= 1 / F
CLK
CLK
SERCLK
t
t
CL
CH
t
SD1
SERSYNC
CLK
t
SD2
t
RS
t
RH
SEROUT
SERIN
t
RPW
t
DSS
t
DHS
RESET
FIGURE 15. CLOCK AND RESET TIMING
FIGURE 16. SERIAL INTERFACE RELATIVE TIMING
17
ISL5239
Waveforms (Continued)
CLK
t
DS
t
DH
IN<17:0>,
QIN<17:0>,
ISTRB
VALID
VALID
CLK
t
, t
CCO1 CCON
t
PDC
CLKOUT
t
TRIGIN
DH1
t
DS1
t
PDC1
TRIGOUT
IOUT<19:0>,
QOUT<19:0>
VALID
VALID
VALID
FIGURE 18. TRIGGER PORT TIMING
FIGURE 17. INPUT/OUTPUT TIMING
CLK
t
CFBD
TCK
t
TS
t
TH
FBCLK
t
FS
TMS, TDI
TDO
t
FH
t
TD
FB<19:0>
VALID
FIGURE 19. FEEDBACK TIMING
FIGURE 20. JTAG TIMING
CLK
RD
CLK
t
t
RSR
RHR
RD
t
t
WHC
WSC
t
WPWL
WR
t
WPWH
WR
t
BDW
4 CLK CYCLES
BUSY
CS
BUSY
CS
t
CSW
t
t
CSR
CHR
t
CHW
t
ASW
t
ASC
t
AHW
VALID
ASR
VALID
A<5:0>
A<5:0>
t
t
DR1
t
PSW
PHW
t
t
RD
RE
t
VALID
P<15:0>
VALID
P<15:0>
FIGURE 21. MICROPROCESSOR WRITE TIMING
FIGURE 22. MICROPROCESSOR READ TIMING
18
ISL5239
Programming Information and Device Control Registers
TABLE 2. CONTROL REGISTER MAP
ADDRESS
(5:0)
00
01
02
03
04
05
06
07
08
TYPE
R/W
R
FUNCTION
DESCRIPTION
RESET DEFAULT
0x0000
Global
Chip Control
Chip ID
Control
0x0000
0x0000
0x0000
0x0000
0x0000
R/W
R
Input Formatter and Interpolator
Capture Memory
Status
R/W
R/W
R/W
R/W
R/W
Control
Length of Input Memory Loops
Input Memory Capture Mode and Trigger Delay 0x0000
Operating Modes
0x0000
0x0000
Feedback Memory Capture Mode and Trigger
Delay
09
0a
0b
0c
0d
0e
0f
R/W
R/W
R/W
R/W
R/W
R
Magnitude Threshold Minimum Value
Magnitude Threshold Maximum Value
Memory Address
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0002
0x0000
0x0000
0x0000
0x0000
0x0000
Memory Data LSW
Memory Data MSW
Input Memory Status
Feedback Memory Status
Control
R
10
11
12
13
14
15
16
17
18
19
1a
1b
1c
1d
20
21
28
29
2a
2b
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R
Pre-Distorter
Magnitude Function Control
Magnitude Function Scale Factor
Look-Up Table Control
Look-Up Table Delta Imaginary Data
Look-Up Table Delta Real Data
Look-Up Table Imaginary Data
Look-Up Table Real Data
Memory Effect Control
Memory Effect Coefficient A
Memory Effect Coefficient B
Memory Effect Power Integrator LSW
Memory Effect Power Integrator MSW
Status
R/W
R
IF Converter
Control
Status
R/W
R/W
R/W
R
Correction Filter
Control
Coefficient Index
Coefficient Value
Status
19
ISL5239
TABLE 2. CONTROL REGISTER MAP (Continued)
ADDRESS
(5:0)
TYPE
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R
FUNCTION
Output Data Conditioner
DESCRIPTION
RESET DEFAULT
0x0000
30
31
32
33
34
35
36
37
38
39
Control
I-to-I (hm) Coefficient
Q-to-I (km) Coefficient
I-to-Q(Im) Coefficient
Q-to-Q (gm) Coefficient
I-Channel DC Offset MSW
I-Channel DC Offset LSW
Q-Channel DC Offset MSW
Q-Channel DC Offset LSW
Status
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
TABLE 3. CHIP CONTROL
TYPE: GLOBAL: ADDRESS: 0x00
DESCRIPTION
BIT
15:11
10:8
FUNCTION
Reserved
ID Index
Not Used
Pointer that selects a pair of characters from the Chip Identification, where the Chip Identification is a
string of 16 ASCII characters. The ChipID field provides access to the selected character pair. For
example, if the Chip Identification is the first 16 letters of the alphabet,—“ABCD…P”—then setting
ID_Index = PAIR_0, selects the left-most pair, AB, which can be accessed by reading the ChipID field.
Setting ID_Index = PAIR_1, selects the pair, CD.
000 - Pair 0
001 - Pair 1
010 - Pair 2
011 - Pair 3
100 - Pair 4
101 - Pair 5
110 - Pair 6
111 - Pair 7
7:5
4
Reserved
Not Used
Hard Reset
Control bit that resets the entire chip except the Processor Interface (PI) block. Identical to asserting
RESET, except:
(1) it does not reset the control fields, ID Index, Hard Reset, Soft Reset, and Chip ID.
(2) it does not reset the PI Controller in the PI block.
0 - Reset not active (default).
1 - Reset is active for the entire chip except the PI block.
3:1
0
Reserved
Soft Reset
Not Used.
Control bit that is identical to Hard Reset except that it does not reset any control registers.
0 - Reset not active (default).
1 - Reset is active for the entire chip except the PI block and all control registers.
TABLE 4. CHIP ID
TYPE: GLOBAL: ADDRESS: 0x01
DESCRIPTION
BIT
FUNCTION
Chip ID
15:0
Pair of ASCII character codes for the Chip Identification, where the Chip Identification is a string of 16
ASCII characters. The ChipID field provides access to the characters selected by ID_Index. From the
example in the ID_Index description, reading ChipID with ID_Index = PAIR_0 returns the ASCII code for
“AB”. The ASCII code for “A” is 0x41, and the ASCII code for “B” is 0x42; therefore, ChipID would have
the value 0x4142.
20
ISL5239
TABLE 5. CONTROL
TYPE: INPUT FORMATTER AND INTERPOLATOR, ADDRESS: 0x02
BIT
15
FUNCTION
Reserved
DESCRIPTION
Not used.
14
Clear Status
Reserved
Set high to clear all status bits, set low (default) to allow the status bits to update.
13:8
7
Internal use only.
Not used.
Reserved
6:4
Interpolation Factor
The chip upsamples its input data by x1, x2, x4, or x8, and it performs the appropriate filtering to reject
the images created by the upsampling operation. Interpolation by 1 bypasses all the interpolation filters.
000 - x1 (default)
001 - x2
011 - x4
111 - x8
010, 100, 101, 110 Internal Use Only.
3
2
Reserved
Not used.
Input Sequence Type
The type of sample sequence of the Input Formatter and Interpolator input data IIN<17:0>, QIN<17:0>.
0 - PARALLEL. (default) The chip receives I and Q data in parallel through IIN<17:0>, QIN<17:0>The chip
ignores the input signal, ISTRB, in this mode.
1 - SERIAL. The chip receives I and Q data in a serial stream through IIN<17:0>. The serial stream
alternates between I and Q samples, and the chip uses the input signal, ISTRB, to detect which samples
are I and which samples are Q. The chip ignores the input signal QIN<17:0> in this mode.
1
0
Input Value Type
Soft Reset
Allows selection of the input type as 2’s complement or offset binary.
0 - 2’s complement (default) Input data.
1 - Offset Binary Input data.
Soft reset that, when high, resets all input formatter and interpolator circuitry except the control fields.
TABLE 6. STATUS
TYPE: INPUT FORMATTER AND INTERPOLATOR, ADDRESS: 0x03
BIT
15:14
13
FUNCTION
Reserved
DESCRIPTION
Not used.
Reserved
Internal use only.
Internal use only.
12:8
7
Reserved
HB 3 Q Saturation
When high, bit indicates HB 3 saturated at least one sample in the Q channel since the last clear status
command. Invalid when Interpolation factor < x8.
6
5
4
3
2
1
0
HB 3 I Saturation
HB 2 Q Saturation
HB 2 I Saturation
HB 1Q Saturation
HB 1I Saturation
Serial Mode Error
When high, bit indicates HB 3 saturated at least one sample in the I channel since the last clear status
command. Invalid when Interpolation factor < x8.
When high, bit indicates HB 2 saturated at least one sample in the Q channel since the last clear status
command. Invalid when Interpolation factor < x8.
When high, bit indicates HB 2 saturated at least one sample in the I channel since the last clear status
command. Invalid when Interpolation factor < x8.
When high, bit indicates HB 1 saturated at least one sample in the Q channel since the last clear status
command. Invalid when Interpolation factor < x2.
When high, bit indicates HB 1 saturated at least one sample in the I channel since the last clear status
command. Invalid when Interpolation factor < x2.
When high, indicated the input formatter and interpolator block performed an illegal operation since the
last clear status command.
Serial Mode Error Active When high, indicates the input formatter and interpolator block is performing an illegal operation. Not
impacted by the clear status command.
21
ISL5239
TABLE 7. CONTROL
TYPE: CAPTURE MEMORY, ADDRESS: 0x04
BIT
15:14
13
FUNCTION
Reserved
Address Auto Increment When set high, automatically increments the memory address after any access operation (read or write).
DESCRIPTION
Not used.
12
Memory Select
Selects the memory for access.
0 - Input memory (default).
1 - Feedback memory.
11:9
8
Reserved
Not used.
Feedback Input Format
Selects the feedback input format.
0 - Parallel (default) uses FB<19:0> as a 20-bit parallel input.
1 - Serial uses FB<0> as the input data bit and FB<1> as the serial sync, sampled at the rising edge of
FBCLK.
7
6
Reserved
Not used.
Processor Trigger
Trigger Select
When high, enables the trigger. Low (default) is trigger disabled.
5:4
Selects the trigger mode.
00 - Processor trigger used (default).
01 - Magnitude trigger when min threshold <= magnitude <= maximum threshold.
10 - External trigger.
3
Reserved
Not used.
2:1
Input Memory Data in
Source
Select the input memory dataIn Source.
00 - Interpolator output (default).
01 - Pre-distortion Output.
10 - Pre-distortion Magnitude.
0
CM Soft Reset
When high, resets all the configuration memory circuitry except the control fields. Low is default.
TABLE 8. LENGTH OF INPUT MEMORY LOOP
TYPE: CAPTURE MEMORY, ADDRESS: 0x05
DESCRIPTION
BIT
15:11
10:0
FUNCTION
Reserved
Not Used
0
11
Input Length
Length of the input memory loop. Specified from 2 (1) to 2 (2047). Default = 0. Resets the input
memory address to 0 when input length reached. Actual loop length is this value + 2.
TABLE 9. INPUT MEMORY CAPTURE MODE AND TRIGGER DELAY
TYPE: CAPTURE MEMORY, ADDRESS: 0x06
DESCRIPTION
BIT
FUNCTION
15
Input Memory Capture
Mode
Selects the active capture mode when the input capture memory is running. Identical to feedback capture
mode except applies to the input memory.
0 - Delay. (default) Defines the beginning of the 2k sample capture window as the trigger point plus the
input trigger delay counter samples.
1 - Advance. Defines the end of the 2k-sample capture window as the trigger point plus the input trigger
delay counter samples.
See control word 0x07, bit 1:0 for mode selection.
14:0
Input Trigger Delay
Counter
Offset delay that defines the input memory capture window when control word 0x07, bits 1:0 = 01
(Capture mode).
0
15
When control word 0x06, bit 15 is set to 0, delay mode, values selectable from 2 to 2 (0...32768).
0
11
When control word 0x06, bit 15 is set to 1, advance mode, value selectable from 2 to 2 (0...2047).
22
ISL5239
TABLE 10. OPERATING MODES
TYPE: CAPTURE MEMORY, ADDRESS: 0x07
BIT
15:5
4
FUNCTION
Reserved
DESCRIPTION
Not used.
Feedback Memory Mode Selects the feedback memory operating mode as
0 - Idle. (default) Memory not operating.
1 - Capture. Memory is capturing data in accordance with the mode and trigger settings specified in
control word 0x08.
3:2
1:0
Reserved
Not used.
Input Memory Mode
Selects the capture memory operating mode as
00 - Idle. (default) Memory not operating.
01 - Capture. Memory is capturing data in accordance with the mode and trigger settings specified in
control word 0x06.
10 - Loop. Input memory plays back data in a continuous loop to provide stimulus.
11 - Single. Input memory plays back data in a one pass through its contents to provide stimulus.
TABLE 11. FEEDBACK MEMORY CATPURE MODE AND TRIGGER DELAY
TYPE: CAPTURE MEMORY, ADDRESS: 0x08
DESCRIPTION
BIT
FUNCTION
15
Feedback Memory
Capture Mode
Selects the active capture mode when the feedback capture memory is running. Identical to input capture
mode except applies to the feedback memory.
0 - Delay. (default) Defines the beginning of the 1k sample capture window as the trigger point plus the
feedback trigger delay counter samples.
1 - Advance. Defines the end of the 1k-sample capture window as the trigger point plus the feedback
trigger delay counter samples.
See control word 0x07, bit 4 for mode selection
14:0
Feedback Trigger Delay Offset delay that defines the feedback memory capture window when control word 0x07, bits 4 = 1
Counter (Capture mode)
When control word 0x08, bit 15 is set to 0, delay mode, values selectable from 2 to 2 (0...32767)
0
15
10
0
When control word 0x08, bit 15 is set to 1, advance mode, value selectable from 2 to 2 (0...1023)
TABLE 12. MAGNITUDE THRESHOLD MINIMUM VALUE
TYPE: CAPTURE MEMORY, ADDRESS: 0x09
DESCRIPTION
BIT
FUNCTION
0
16
15:0
Magnitude Threshold
Minimum
Default = 0. Value selectable from 2 to 2 (0...65535). Magnitude-based trigger is generated when the
magnitude value is greater than or equal to this value and less than or equal to the value in control word
0x0a.
TABLE 13. MAGNITUDE THRESHOLD MAXIMUM VALUE
TYPE: CAPTURE MEMORY, ADDRESS: 0x0a
DESCRIPTION
BIT
FUNCTION
0
16
15:0
Magnitude Threshold
Maximum
Default = 0. Value selectable from 2 to 2 (0...65535). Magnitude-based trigger is generated when the
magnitude value is less than or equal to this value and greater than or equal to the value in control word
0x09
TABLE 14. MEMORY ADDRESS
TYPE: CAPTURE MEMORY, ADDRESS: 0x0b
DESCRIPTION
BIT
15:11
10:0
FUNCTION
Reserved
Not used.
0
11
Memory Address
Index into memory value. Default = 0. Selectable from 2 to 2 (0...2047).
23
ISL5239
TABLE 15. MEMORY DATA LSW
TYPE: CAPTURE MEMORY, ADDRESS: 0x0c
BIT
FUNCTION
DESCRIPTION
15:0
Memory Data <15:0>
Lower 16 bits of capture memory data word.
TABLE 16. MEMORY DATA MSW
TYPE: CAPTURE MEMORY, ADDRESS: 0x0d
BIT
FUNCTION
DESCRIPTION
15:0
Memory Data <31:16>
Higher 16 bits of capture memory data word. Writing to this address triggers the write to the memory and
increments the address counter when address auto increment, control word 0x04, bit 13 is set. Must write
control word 0x0c first, to load the data values into memory.
TABLE 17. INPUT MEMORY STATUS
TYPE: CAPTURE MEMORY, ADDRESS: 0x0e
DESCRIPTION
BIT
FUNCTION
Reserved
15:14
13:12
Not used.
Input Capture Status
Read only register with status defined as:
00 - Idle, Memory access OK.
01 - Armed. Capture memory waiting for trigger.
10 - Loading. Capture memory in load mode.
11 - Send. Memory sends data to downstream modules.
0
11
10:0
Input Trigger Position
Read only register which records memory location of input trigger point. 2 to 2 (0...2047).
TABLE 18. FEEDBACK MEMORY STATUS
TYPE: CAPTURE MEMORY, ADDRESS: 0x0f
DESCRIPTION
BIT
FUNCTION
15:14
13:12
Reserved
Not used.
Feedback Capture Status Read only register with status defined as:
00 - Idle, Memory access OK.
01 - Armed. Capture memory waiting for trigger.
10 - Loading. Capture memory in load mode.
10
Reserved
Not used.
0
10
9:0
Feedback Trigger
Position
Read only register which records memory location of feedback trigger point. 2 to 2 (0...1023).
TABLE 19. CONTROL
TYPE: PRE-DISTORTER, ADDRESS: 0x10
DESCRIPTION
BIT
15:3
2
FUNCTION
Reserved
Not used.
Test
Selects use of test inputs
0 - Off. IIN<17:0>, QIN<17:0> in use for input stream.
1 - On. Use capture memory output for pre-Distorter input. Note: Test inputs are 16-bits wide and are MSB
justified onto the pre-distorter 20-bit inputs by setting the four LSB’s to zero.
1
0
Bypass
Reset
Disables processing and allows input data to flow to output without any pre-distorter modification.
0 - Pre-distorter is active and processing.
1 - Pre-distorter is bypassed.
Software generated logic reset, which when high, resets the pre-distorter circuitry. Low is default.
24
ISL5239
TABLE 20. MAGNITUDE FUNCTION CONTROL
TYPE: PRE-DISTORTER, ADDRESS: 0x11
DESCRIPTION
BIT
FUNCTION
Reserved
15:14
13:12
Not used
Selects the magnitude calculation function as:
00 - Log. Log base 2 of magnitude squared computed as log2(I + Q )
Magnitude Function
Select
2
2
2
2
01 - Linear. Linear magnitude computed as sqrt (I + Q )
2
2
10 - Power. Magnitude squared computed as (I + Q )
11:0
Address Offset
Linear offset of magnitude function when calculating LUT address (e.g. power backoff) Selectable from
(-1024...1024) in increments of 2 . Note: Setting the LSB of this value permits rounding of the resulting
-1
address. Clearing the LSB causes truncation. (0xFFFFF --> 0x00000 maps to -1024 to 0, and 0x00001 -
-> 0x7FFFF maps to 0.5 to 1023.5).
TABLE 21. I - MAGNITUDE FUNCTION SCALE FACTOR
TYPE: PRE-DISTORTER, ADDRESS: 0x12
DESCRIPTION
BIT
15:13
12:0
FUNCTION
Reserved
Not Used.
Address Scale
Linear scale of magnitude function when calculating LUT address (e.g. db/LSB) Selectable from (0.(64-
-7
increment)), in increments of 2
.
TABLE 22. Q - LOOK-UP TABLE CONTROL
TYPE: PRE-DISTORTER, ADDRESS: 0x13
BIT
15:14
13
FUNCTION
Reserved
DESCRIPTION
Not Used.
Active LUT
Selects which ping pong LUT is currently in use. The opposite LUT shall be accessible through the
processor interface.
0 - Use LUT 0, access LUT 1.
1 - Use LUT 1, access LUT 0.
12
LUT Address Auto
Increment
Set high to automatically increment LUT address after any access operation (read/write). Default is low,
not auto increment.
11:10
9:0
Reserved
Not used.
LUT Address
Address for index into LUT. Default = 0, pointer to next LUT location.
TABLE 23. LOOK-UP TABLE DELTA IMAGINARY DATA
TYPE: PRE-DISTORTER, ADDRESS: 0x14
BIT
15:14
13:0
FUNCTION
Reserved
DESCRIPTION
Not used.
LUT Data Delta Q
Delta imaginary Data written to or read back from LUT. Delta Q controls memory effect. Selectable as (-
-16
0.125...(0.125-increment)) in increments of 2 . Default = 0.
TABLE 24. LOOK-UP TABLE DELTA REAL DATA
TYPE: PRE-DISTORTER, ADDRESS: 0x15
BIT
15:14
13:0
FUNCTION
Reserved
DESCRIPTION
Not used.
LUT Data Delta I
Delta real data written to or read back from LUT. Delta I controls memory effect. Selectable as (-
-16
0.125...(0.125-increment)) in increments of 2 . Default = 0.
TABLE 25. LOOK-UP TABLE IMAGINARY DATA
TYPE: PRE-DISTORTER, ADDRESS: 0x16
BIT
FUNCTION
DESCRIPTION
15:0
LUT Data Q
Imaginary distortion data written to or read back from LUT. Selectable as (-0.5...(0.5-increment)) in
increments of 2 . Default = 0.
-16
25
ISL5239
TABLE 26. LOOK-UP TABLE REAL DATA
TYPE: PRE-DISTORTER, ADDRESS 0x17
BIT
FUNCTION
LUT Data I
DESCRIPTION
15:0
Real distortion data written to or read back from LUT. Selectable as (-0.5...(0.5-increment)) in increments
-16
of 2 . Default = 0.
TABLE 27. MEMORY EFFECT CONTROL
TYPE: PRE-DISTORTER, ADDRESS: 0x18
BIT
15:13
12
FUNCTION
Reserved
DESCRIPTION
Not used.
Serial Output Enable
Reserved
Set to high to enable the external serial interface output pins. Default is low, disabled.
Not used
11:9
8
Serial Input Enable
Set to high to enable the external serial interface input pin SERIN data to override the processor settings.
Default is low, disabled, processor settings over-ride serial inputs.
7:6
5:4
Reserved
Not used.
Power Integrator Period Select the number of samples in the power integrate/dump operation. Also controls the SERCLK
frequency.
00 - 128 samples, SERCLK runs at CLK/4.
01 - 64 samples, SERCLK runs at CLK/2.
10 - 32 samples, SERCLK runs at CLK.
3:1
0
Reserved
Not used.
2
Thermal Coefficient B
Set to high to select A , low to select B (default).
TABLE 28. MEMORY EFFECT COEFFICIENT A
TYPE: PRE-DISTORTER, ADDRESS: 0x19
DESCRIPTION
BIT
FUNCTION
-15
15:0
Thermal Coef. A
Coefficient A for memory effect selectable from (-1.0...(1-increment)) in increments of 2 . If control word
0x18, bit 8 high, reading this control word returns the value from SERIN.
TABLE 29. MEMORY EFFECT COEFFICIENT B
TYPE: PRE-DISTORTER, ADDRESS: 0x1a
DESCRIPTION
BIT
FUNCTION
-15
15:0
Thermal Coef. B
Coefficient B for memory effect selectable from (-1.0...(1-increment)) in increments of 2 . If control word
0x18, bit 8 high, reading this control word returns the value from SERIN.
TABLE 30. MEMORY EFFECT POWER INTEGRATOR LSW
TYPE: PRE-DISTORTER, ADDRESS: 0x1b
DESCRIPTION
BIT
FUNCTION
15:0
Power Integrator <15:0> Power integrator LSW.
TABLE 31. MEMORY EFFECT POWER INTEGRATOR MSW
TYPE: PRE-DISTORTER, ADDRESS: 0x1c
DESCRIPTION
BIT
FUNCTION
15:0
Power Integrator <31:16> Power integrator MSW. The Power Integrator [31:0] forms an unsigned fixed point number with 9 integer
and 23 fractional bits (u9.23).
26
ISL5239
TABLE 32. STATUS
TYPE: PRE-DISTORTER, ADDRESS: 0x1d
BIT
15:1
0
FUNCTION
Reserved
Reserved
DESCRIPTION
Not used.
Internal use only.
TABLE 33. CONTROL
TYPE: IF CONVERTER, ADDRESS: 0x20
DESCRIPTION
BIT
15:14
13:12
11:9
8
FUNCTION
Reserved
Reserved
Reserved
Reserved
Reserved
IF Conv. Mode
Not used.
Internal use only.
Not used.
Internal use only.
Not used.
7:6
5:4
Selects the operational mode of the IF converter as:
00 - Disabled. Default mode which zeroes data into pipeline.
01 - Real x1. Real I outputs only, shifted by Fs/4.
10 - Real x2. Real samples output shifted by Fs/4. The sample on the I port is the first, earlier, sample of
the pair.
11 - Complex. Complex outputs shifted by Fs/4.
3
2
Reserved
Not used.
IF Conv. Status Clear
When set high, clears the IF Conv. status bits. Set low for normal operation and to allow the status bits
to update.
1
0
IF Conv. Bypass
IF Conv. Reset
When set high (default), bypasses the IF conv. stage. Set low for normal processing.
When set high, resets the IF conv. state machine. Set low (default) for normal operation.
TABLE 34. STATUS
TYPE: IF CONVERTER, ADDRESS: 0x21
DESCRIPTION
BIT
15:4
3:2
1
FUNCTION
Reserved
Not used.
Reserved
Internal use only.
I Channel Saturation
When high, indicates the IF conv. saturated at least one sample since the last control word 0x20, bit 2
command.
0
Q Channel Saturation
When high, indicates the IF conv. saturated at least one sample since the last control word 0x20, bit 2
command.
TABLE 35. CONTROL
TYPE: CORRECTION FILTER, ADDRESS: 0x28
BIT
15
FUNCTION
Reserved
DESCRIPTION
Not used.
14:12
11:10
9:8
Reserved
Internal use only.
Not used.
Reserved
Reserved
Internal use only.
Not used.
7:5
Reserved
4
Address Auto Increment Set high to automatically increment coef/address after any access operation (read/write). Low (default) is
not auto increment.
3
Real Pipeline Select
Set high to configure the filter to process muxed real data, with the values arriving on the IIN<17:0> port
in serial fashion with I following Q. Set low (default) for complex operation.
2
1
0
Clear Status
Bypass
Set high to clear all status bits, low for normal status bit updates.
Set high (default) to bypass the correction filter, low to enable processing.
Not used.
Reserved
27
ISL5239
TABLE 36. COEFFICIENT INDEX
TYPE: CORRECTION FILTER, ADDRESS: 0x29
BIT
15:8
7:0
FUNCTION
Reserved
DESCRIPTION
Not used.
Coefficient Address
Pointer to current LUT location. Default is 0. 0x00-0x7F are I coefficients, 0x80-0xff are Q coefficients.
Master register to slave register transfer occurs after the processor interface last write to the Q
coefficient. The circuit uses the slave registers. All reads are from the slave register values. There are
13 each I and Q coefficients.
TABLE 37. COEFFICIENT VALUE
TYPE: CORRECTION FILTER, ADDRESS: 0x2a
BIT
FUNCTION
DESCRIPTION
(1-15)
15:0
Coefficient Data
Coefficient data access. Default = 0, non centered coef. Default = 1 - 2
centered coef.
TABLE 38. STATUS
TYPE: CORRECTION FILTER, ADDRESS: 0x2b
DESCRIPTION
BIT
15:4
3:2
1
FUNCTION
Reserved
Not used.
Reserved
Internal use only.
I Channel Saturation
When high indicates the correction filter saturated at least one sample since the last control word 0x28,
bit 2 command.
0
Q Channel Saturation
When high indicates the correction filter saturated at least one sample since the last control word 0x28,
bit 2 command.
TABLE 39. CONTROL
TYPE: OUTPUT DATA CONDITIONER, ADDRESS: 0x30
BIT
15:8
8
FUNCTION
Reserved
DESCRIPTION
Not used.
Reserved
Internal use only.
7:4
Output Word Width
Select the width of the output data bus IOUT<17:0> and QOUT<17:0>.
0000 - 8 bits
0001 - 9 bits
0010 - 10 bits
0011 - 11 bits
0100 - 12 bits
0101 - 13 bits
0110 - 14 bits
0111 - 15 bits
1000 - 16 bits
1001 - 17 bits
1010 - 18 bits (default)
3
2
1
0
Output Format
Status clear
Bypass
Set high to select offset binary, low to select 2’s compliment.
Set high to clear all status bits, low to enable bits to be active.
Set high (default) to bypass, low to enable output processing.
Not used.
Reserved
28
ISL5239
TABLE 40. I-to-I (HM) COEFFICIENT
TYPE: OUTPUT DATA CONDITIONER, ADDRESS: 0x31
DESCRIPTION
BIT
FUNCTION
hm Coefficient
15:0
I-to-I (hm) coefficient values loaded from the master registers to the slave registers when the user writes
the last coefficient register in control word 0x38. The slave registers are used in the datapath. All reads
(1-15)
return slave register values. Default 1-2
.
TABLE 41. Q-to-I (KM) COEFFICIENT
TYPE: OUTPUT DATA CONDITIONER, ADDRESS: 0x32
DESCRIPTION
BIT
FUNCTION
km Coefficient
15:0
Q-to-I (km) master register. Default 0.
TABLE 42. I-to-Q (LM) COEFFICIENT
TYPE: OUTPUT DATA CONDITIONER, ADDRESS: 0x33
DESCRIPTION
BIT
FUNCTION
lm Coefficient
15:0
I-to-Q (lm) master register. Default 0.
TABLE 43. Q-toQ (GM) COEFFICIENT
TYPE: OUTPUT DATA CONDITIONER, ADDRESS: 0x34
DESCRIPTION
BIT
FUNCTION
Gm Coefficient
(1-15)
15:0
Q-to-Q (Gm) master register. Default 1-2
TABLE 44. I CHANNEL DC OFFSET MSW
TYPE: OUTPUT DATA CONDITIONER, ADDRESS: 0x35
DESCRIPTION
BIT
15:4
3:0
FUNCTION
Reserved
Not used.
DC I Offset <19:16>
I DC offset master register containing the upper four bits of the I DC offset.
TABLE 45. I CHANNEL DC OFFSET LSW
TYPE: OUTPUT DATA CONDITIONER, ADDRESS: 0x36
DESCRIPTION
BIT
FUNCTION
15:0
DC I Offset <15:0>
I DC offset master register containing the lower 16 bits of the I DC offset.
TABLE 46. Q CHANNEL DC OFFSET MSW
TYPE: OUTPUT DATA CONDITIONER, ADDRESS: 0x37
DESCRIPTION
BIT
15:4
3:0
FUNCTION
Reserved
Not used.
DC Q Offset <19:16>
Q DC offset master register containing the upper four bits of the Q DC offset.
TABLE 47. Q CHANNEL DC OFFSET LSW
TYPE: OUTPUT DATA CONDITIONER, ADDRESS: 0x38
DESCRIPTION
BIT
FUNCTION
15:0
DC Q Offset <15:0>
Q DC offset master register containing the lower 16 bits of the Q DC offset.
29
ISL5239
TABLE 48. STATUS
TYPE: OUTPUT DATA CONDITIONER, ADDRESS: 0x39
BIT
15:4
3:2
1
FUNCTION
Reserved
DESCRIPTION
Not used.
Reserved
Internal use only.
I Channel Status
When high indicates that the output data conditioner saturated at least one sample since the last control
word 0x30, bit 2 command.
0
Q Channel Status
When high indicates that the output data conditioner saturated at least one sample since the last control
word 0x30, bit 2 command.
30
ISL5239
Plastic Ball Grid Array Packages (BGA)
o
A
V196.15x15
196 BALL PLASTIC BALL GRID ARRAY PACKAGE
A1 CORNER
D
A1 CORNER I.D.
INCHES MILLIMETERS
SYMBOL
MIN
MAX
MIN
-
MAX
1.50
NOTES
A
A1
-
0.059
0.016
0.044
0.020
0.595
0.516
-
0.012
0.037
0.016
0.587
0.508
0.31
0.93
0.41
14.90
12.90
0.41
-
E
A2
1.11
-
b
0.51
7
D/E
D1/E1
N
15.10
13.10
-
-
B
196
196
-
TOP VIEW
e
0.039 BSC
14 x 14
0.004
1.0 BSC
14 x 14
0.10
-
0.15
0.006
0.08
0.003
M
M
C
C
A
B
MD/ME
bbb
aaa
3
A1
CORNER
-
D1
14 13 12 11 10 9 8
0.005
0.12
-
b
7
6 5 4 3 2 1
Rev. 1 12/00
A1
NOTES:
A
B
C
D
E
F
CORNER I.D.
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
S
2. DimensioningandtolerancingconformtoASMEY14.5M-1994.
G
H
J
3. “MD” and “ME” are the maximum ball matrix size for the “D”
and “E” dimensions, respectively.
E1
K
L
M
N
P
4. “N” is the maximum number of balls for the specific array size.
A
5. Primary datum C and seating plane are defined by the spher-
ical crowns of the contact balls.
6. Dimension “A” includes standoff height “A1”, package body
thickness and lid or cap height “A2”.
e
S
7. Dimension “b” is measured at the maximum ball diameter,
parallel to the primary datum C.
ALL ROWS AND COLUMNS
A
8. Pin “A1” is marked on the top and bottom sides adjacent to A1.
BOTTOM VIEW
9. “S” is measured with respect to datum’s A and B and defines
the position of the solder balls nearest to package center-
lines. When there is an even number of balls in the outer row
the value is “S” = e/2.
A1
A2
bbb C
aaa C
C
A
SEATING PLANE
SIDE VIEW
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Intersil Corporation’s quality certifications can be viewed at website www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.
Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. How-
ever, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com
31
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