ISL55005IEZ-T7 [INTERSIL]

MMIC Silicon Bipolar Broadband Amplifier; 单片硅双极宽带放大器
ISL55005IEZ-T7
型号: ISL55005IEZ-T7
厂家: Intersil    Intersil
描述:

MMIC Silicon Bipolar Broadband Amplifier
单片硅双极宽带放大器

放大器
文件: 总6页 (文件大小:146K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ISL55005  
®
Data Sheet  
May 22, 2006  
FN6199.0  
MMIC Silicon Bipolar Broadband Amplifier  
Features  
The ISL55005, ISL55007, ISL55008 and ISL55009,  
ISL55010, ISL55011 constitute a family of high performance  
gain blocks featuring a Darlington configuration using high f  
transistors and excellent thermal performance. They are an  
ideal choice for DVB-S LNB cable receiver applications.  
• Input impedance of 75Ω  
• Output impedance of 50Ω  
• Noise figure of 3.6dB  
t
• OIP3 of 17dBm  
ISL55005, ISL55007, ISL55008 offer higher OIP3  
• Low input and output return losses  
performance while the ISL55009, ISL55010, ISL55011 offer  
lower operating supply currents.  
• Pb-free plus anneal available (RoHS compliant)  
ISL55005 and ISL55009 match a 75source to a 50load.  
ISL55007 and ISL55010 match a 75source to a 75load.  
ISL55008 and ISL55011 match a 50source to a 50load.  
Applications  
• LNB and LNB-T line amplifiers  
• IF gain blocks for satellite and terrestrial HDTV STBs  
• PA driver amplifier  
Ordering Information  
• Wireless data, satellite  
PART  
NUMBER  
(Note)  
• Bluetooth/WiFi  
PART  
MARKING  
TAPE &  
REEL  
PACKAGE  
(Pb-Free) DWG. #  
PKG.  
• Satellite locator and signal strength meters  
ISL55005IEZ-T7 CSA  
7” (3k pcs) 6 Ld SC-70 P6.049  
NOTE: Intersil Pb-free plus anneal products employ special Pb-free  
material sets; molding compounds/die attach materials and 100%  
matte tin plate termination finish, which are RoHS compliant and  
compatible with both SnPb and Pb-free soldering operations. Intersil  
Pb-free products are MSL classified at Pb-free peak reflow  
temperatures that meet or exceed the Pb-free requirements of  
IPC/JEDEC J STD-020.  
Typical Application Circuit  
Pinout  
6 LD SC-70  
+3.3V  
GND  
GND  
IN  
1
2
3
6
5
4
OUT  
GND  
VSP  
100pF  
100nH  
0.1µF  
0.1µF  
100pF  
4
3
6
68pF  
68pF  
1, 2, 5  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.  
Copyright © Intersil Americas Inc. 2006. All Rights Reserved.  
1
All other trademarks mentioned are the property of their respective owners.  
ISL55005  
Absolute Maximum Ratings (T = 25°C)  
A
Supply Voltage from VSP to GND . . . . . . . . . . . . . . . . . . . . . . . . 6V  
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +125°C  
Operating Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +125°C  
ESD Rating  
Human Body Model (Per MIL-STD-883 Method 3015.7). . .3000V  
Machine Model (Per EIAJ ED-4701 Method C-111). . . . . . . .300V  
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . V + +0.3V to GND -0.3V  
S
Power Dissipation . . . . . . . . . . . .See Packging Information Section  
Ambient Operating Temperature . . . . . . . . . . . . . . . .-40°C to +85°C  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typ values are for information purposes only. Unless otherwise noted, all tests are  
at the specified temperature and are pulsed tests, therefore: T = T = T  
A
J
C
Electrical Specifications VSP = +3.3V, Zrsc = Zload = 50, TA = 25°C, unless otherwise specified.  
PARAMETER DESCRIPTION CONDITIONS  
Gt Small Signal Gain  
MIN  
16.2  
16.0  
15.6  
5.5  
TYP  
17.2  
17.0  
16.6  
7.5  
MAX  
18.2  
18.0  
17.6  
9.5  
UNIT  
dB  
1.0GHz  
1.5GHz  
2.0GHz  
1.0GHz  
2.0GHz  
1.0GHz  
2.0GHz  
dB  
dB  
P1dB  
OIP3  
Output Power at 1dB Compression  
Output Third Order Intercept Point  
dBm  
dBm  
dBm  
dBm  
GHz  
dB  
4.9  
6.4  
7.9  
18.0  
17.3  
3.0  
BW  
IRL  
3dB Bandwidth  
3dB below Gain @ 500MHz  
1.0GHz Zrsc = 75Ω, Zload = 50Ω  
1.0GHz Zrsc = 75Ω, Zload = 50Ω  
2.0GHz  
Input Return Loss  
Output Return Loss  
Reverse Isolation  
Noise Figure  
14.5  
17.6  
21.8  
3.6  
ORL  
RISOL  
NF  
dB  
dB  
2.0GHz  
dB  
ID  
Device Operating Current  
17.5  
20.6  
23.5  
mA  
Device Test Setup  
Agilent _8753ES  
VNA  
50Ω  
50Ω  
CONNECTORLESS  
PLATFORM  
PICOSECOND LABS  
MODEL 5542  
PIN 3  
PIN 6  
50Ω  
50Ω  
DC BLOCK  
DUT  
BIAS TEE  
PICOSECOND LABS  
MODEL 5508-110  
3.3V  
I
I
1
2
I
DEVICE  
OUTPUT  
REFERENCE  
PLANE  
INPUT  
REFERENCE  
PLANE  
3.3V  
POWER  
SUPPLY  
FN6199.0  
May 22, 2006  
2
ISL55005  
Typical Performance Curves Z = 75, Z  
= 50Ω  
load  
src  
20  
16  
12  
8
20  
16  
12  
8
4
4
0
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
Frequency (GHz)  
Frequency (GHz)  
FIGURE 1. INPUT RETURN LOSS vs FREQUENCY  
FIGURE 2. OUTPUT RETURN LOSS vs FREQUENCY  
Typical Performance Curves 50environment  
18.0  
17.2  
16.4  
15.6  
14.8  
14.0  
-8.0  
-8.6  
-9.2  
-9.8  
-10.4  
-11.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
FREQUENCY (GHz)  
FREQUENCY (GHz)  
FIGURE 3. |S21| vs FREQUENCY  
FIGURE 4. |S11| vs FREQUENCY  
-21.0  
-9.0  
-9.8  
-21.4  
-21.8  
-22.2  
-22.6  
-23.0  
-10.6  
-11.4  
-12.2  
-13.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
FREQUENCY (GHz)  
FREQUENCY (GHz)  
FIGURE 5. |S12| vs FREQUENCY  
FIGURE 6. |S22| vs FREQUENCY  
FN6199.0  
May 22, 2006  
3
ISL55005  
Typical Performance Curves 50environment (Continued)  
21  
8.0  
7.6  
7.2  
6.8  
6.4  
6.0  
20  
19  
18  
17  
16  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
FREQUENCY (GHz)  
FREQUENCY (GHz)  
FIGURE 7. OIP3 vs FREQUENCY  
FIGURE 8. P1dB vs FREQUENCY  
5
4
3
2
1
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
FREQUENCY (GHz)  
FIGURE 9. NOISE FIGURE vs FREQUENCY  
S22  
0.5 GHz  
0.5 GHz  
1.0  
3 GHz  
2.2  
1.0  
2.2  
S11  
3 GHz  
FIGURE 10. S11 AND S22 vs FREQUENCY  
FN6199.0  
May 22, 2006  
4
ISL55005  
Packaging Information  
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL  
CONDUCTIVITY TEST BOARD  
0.3  
0.25  
0.2  
176mW  
0.15  
0.1  
0.05  
0
0
25  
50  
75 85 100  
125  
150  
AMBIENT TEMPERATURE (°C)  
FIGURE 11. PACKAGE POWER DISSIPATION vs AMBIENT  
TEMPERATURE  
FN6199.0  
May 22, 2006  
5
ISL55005  
Small Outline Transistor Plastic Packages (SC70-6)  
VIEW C  
0.20 (0.008)  
C
M
P6.049  
C
L
6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE  
e
b
6
INCHES  
MIN  
MILLIMETERS  
SYMBOL  
MAX  
0.043  
0.004  
0.039  
0.012  
0.010  
0.009  
0.009  
0.085  
0.094  
0.053  
MIN  
0.80  
0.00  
0.00  
0.15  
0.15  
0.08  
0.08  
1.85  
1.80  
1.15  
MAX  
1.10  
0.10  
1.00  
0.30  
0.25  
0.22  
0.20  
2.15  
2.40  
1.35  
NOTES  
A
A1  
A2  
b
0.031  
0.000  
0.031  
0.006  
0.006  
0.003  
0.003  
0.073  
0.071  
0.045  
-
-
-
-
5
2
4
3
C
L
E1  
C
E
L
1
b1  
c
6
6
3
-
e1  
C
c1  
D
D
C
L
E
E1  
e
3
-
SEATING  
PLANE  
A2  
A1  
A
0.0256 Ref  
0.0512 Ref  
0.010 0.018  
0.65 Ref  
1.30 Ref  
0.26 0.46  
-C-  
e1  
L
-
4
0.10 (0.004) C  
L1  
L2  
N
0.017 Ref.  
0.006 BSC  
6
0.420 Ref.  
0.15 BSC  
6
b
5
WITH  
PLATING  
b1  
R
0.004  
-
0.10  
-
R1  
α
0.004  
0.010  
0.15  
0.25  
c
c1  
o
o
o
o
0
8
0
8
-
Rev. 2 9/03  
BASE METAL  
NOTES:  
1. Dimensioning and tolerance per ASME Y14.5M-1994.  
2. Package conforms to EIAJ SC70 and JEDEC MO203AB.  
4X θ1  
3. Dimensions D and E1 are exclusive of mold flash, protrusions,  
or gate burrs.  
R1  
4. Footlength L measured at reference to gauge plane.  
5. “N” is the number of terminal positions.  
R
GAUGE PLANE  
6. These Dimensions apply to the flat section of the lead between  
0.08mm and 0.15mm from the lead tip.  
SEATING  
PLANE  
L
7. Controlling dimension: MILLIMETER. Converted inch dimen-  
sions are for reference only  
C
α
L2  
L1  
4X θ1  
VIEW C  
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.  
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without  
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and  
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result  
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see www.intersil.com  
FN6199.0  
May 22, 2006  
6

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