ISL6326B_技术文档

ISL6326B

®

Data Sheet

April 21, 2006

FN9286.0

4-Phase PWM Controller with 8-Bit DAC

Code Capable of Precision DCR

Differential Current Sensing

Features

• Proprietary Active Pulse Positioning and Adaptive Phase

Alignment Modulation Scheme

The ISL6326B controls microprocessor core voltage

regulation by driving up to 4 synchronous-rectified buck

channels in parallel. Multiphase buck converter architecture

uses interleaved timing to multiply channel ripple frequency

and reduce input and output ripple currents. Lower ripple

results in fewer components, lower component cost, reduced

power dissipation, and smaller implementation area.

• Precision Multiphase Core Voltage Regulation

- Differential Remote Voltage Sensing

- ±0.5% System Accuracy Over Life, Load, Line and

Temperature

- Adjustable Precision Reference-Voltage Offset

• Precision resistor or DCR Current Sensing

- Accurate Load-Line Programming

- Accurate Channel-Current Balancing

- Differential Current Sense

Microprocessor loads can generate load transients with

extremely fast edge rates. The ISL6326B utilizes Intersil’s

proprietary Active Pulse Positioning (APP) and Adaptive

Phase Alignment (APA) modulation scheme to achieve the

extremely fast transient response with fewer output

capacitors.

• Microprocessor Voltage Identification Input

- Dynamic VID™ Technology

- 8-Bit VID Input with Selectable VR11 Code and

Extended VR10 Code at 6.25mV Per Bit

Today’s microprocessors require a tightly regulated output

voltage position versus load current (droop). The ISL6326B

senses the output current continuously by utilizing patented

techniques to measure the voltage across the dedicated

current sense resistor or the DCR of the output inductor. The

sensed current flows out of FB pin to develop the precision

voltage drop across the feedback resistor for droop control.

Current sensing also provides the needed signals for

channel-current balancing, and overcurrent protection. A

programmable integrated temperature compensation

function is implemented to effectively compensate for the

temperature coefficient of the current sense element. The

current limit function provides the overcurrent protection for

the individual phase.

• Thermal Monitoring

• Integrated Programmable Temperature Compensation

• Overcurrent Protection and Channel Current Limit

• Load Current Indicator and External Overcurrent

Protection Threshold Setup

• Overvoltage Protection

• 2, 3 or 4 Phase Operation

• Adjustable Switching Frequency up to 1MHz Per Phase

• Package Option

- QFN Compliant to JEDEC PUB95 MO-220 QFN - Quad

Flat No Leads - Product Outline

A unity gain, differential amplifier is provided for remote

voltage sensing. Any potential difference between remote

and local grounds can be completely eliminated using the

remote-sense amplifier. Eliminating ground differences

improves regulation and protection accuracy. The threshold-

sensitive enable input is available to accurately coordinate

the start up of the ISL6326B with any other voltage rail.

Dynamic-VID™ technology allows seamless on-the-fly VID

changes. The offset pin allows accurate voltage offset

settings that are independent of VID setting.

- QFN Near Chip Scale Package Footprint; Improves

PCB Efficiency, Thinner in Profile

• Pb-Free Plus Anneal Available (RoHS Compliant)

Ordering Information

PART

NUMBER

(Note)

PART

MARKING

TEMP.

(°C)

PACKAGE

(Pb-Free)

PKG.

DWG. #

ISL6326BCRZ ISL6326BCRZ 0 to70 40 Ld 6x6 QFN L40.6x6

ISL6326BIRZ ISL6326BIRZ -40 to 85 40 Ld 6x6 QFN L40.6x6

Add “-T” suffix for tape and reel.

NOTE: Intersil Pb-free plus anneal products employ special Pb-free

material sets; molding compounds/die attach materials and 100%

matte tin plate termination finish, which are RoHS compliant and

compatible with both SnPb and Pb-free soldering operations. Intersil

Pb-free products are MSL classified at Pb-free peak reflow

temperatures that meet or exceed the Pb-free requirements of

IPC/JEDEC J STD-020.

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

1

1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.

All other trademarks mentioned are the property of their respective owners.

ISL6326B

Pinout

ISL6326B (40 LD QFN)

TOP VIEW

40 39 38 37 36 35 34 33 32 31

VID6

VID5

VID4

VID3

VID2

VID1

VID0

VRSEL

OFS

ISEN3+

ISEN3-

ISEN2-

ISEN2+

PWM2

PWM4

ISEN4+

ISEN4-

ISEN1-

ISEN1+

1

2

30

29

28

27

26

25

24

23

22

21

3

4

5

GND

6

7

8

9

DAC

10

11 12 13 14 15 16 17 18 19 20

FN9286.0

April 21, 2006

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ISL6326B

ISL6326BCR Block Diagram

VDIFF VR_RDY

FS

0.875

-

CLOCK AND

RAMP GENERATOR

POWER-ON

RESET (POR)

RGND

VSEN

-

+

X1

EN_VTT

+

N

-

+

EN_PWR

SOFTSTART

AND

+

OVP

-

FAULT LOGIC

+175mV

APP and APA

MODULATOR

PWM1

PWM2

SS

VRSEL

APP and APA

MODULATOR

VID7

VID6

VID5

VID4

VID3

VID2

VID1

VID0

Dynamic

VID

D/A

APP and APA

MODULATOR

PWM3

PWM4

DAC

OFS

APP and APA

MODULATOR

OFFSET

+

REF

FB

CHANNEL

CURRENT

BALANCE

CHANNEL

DETECT

E/A

-

AND PEAK

CURRENT LIMIT

COMP

N

ISEN1+

ISEN1-

ISEN2+

ISEN2-

ISEN3+

ISEN3-

ISEN4+

ISEN4-

I_TRIP

2.0V

-

+

-

+

OCP

CHANNEL

CURRENT

SENSE

TEMPERATURE

COMPENSATION

1

N

IOUT

Σ

VR_HOT

VR_FAN

TEMPERATURE

COMPENSATION

GAIN ADJUST

THERMAL

MONITOR

TM

TCOMP

GND

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April 21, 2006

3

ISL6326B

Typical Application - 4-Phase Buck Converter with Integrated Thermal Compensation

VIN

+12V

PVCC

BOOT

+5V

VCC

UGATE

PHASE

ISL6612

DRIVER

LGATE

GND

PWM

COMP VCC DAC

REF

FB

VDIFF

VSEN

PWM1

ISEN1-

ISEN1+

+12V

RGND

EN_VTT

BOOT

PVCC

VTT

VR_RDY

VID7

VCC

UGATE

PHASE

ISL6326B

VID6

ISL6612

DRIVER

VID5

LGATE

GND

VID4

PWM

PWM2

VID3

VID2

ISEN2-

ISEN2+

VID1

VID0

+12V

VRSEL

VR_FAN

VR_HOT

BOOT

PVCC

PWM3

ISEN3-

uP

LOAD

VCC

UGATE

PHASE

ISEN3+

VIN

ISL6612

DRIVER

EN_PWR

LGATE

GND

PWM

GND

IOUT

PWM4

ISEN4-

ISEN4+

TCOMP

TM

+12V

BOOT

OFS

FS

SS

PVCC

+5V

VCC

UGATE

PHASE

ISL6612

DRIVER

NTC

LGATE

GND

PWM

FN9286.0

April 21, 2006

4

ISL6326B

Typical Application - 4-Phase Buck Converter with External Thermal Compensation

NTC

+12V

+5V

^oC

VIN

BOOT1

VCC

UGATE1

PHASE1

COMP VCC DAC

REF

FB

GND

LGATE1

VDIFF

VSEN

5V

To

12V

PVCC

ISL6614

DRIVER

VIN

RGND

EN_VTT

BOOT2

ISEN1+

ISEN1-

VTT

VR_RDY

VID7

PWM1

PWM2

UGATE2

PHASE2

PWM1

VID6

VID5

ISL6326B

LGATE2

PGND

VID4

VID3

PWM3

VID2

ISEN3-

ISEN3+

VID1

VID0

VRSEL

VR_FAN

VR_HOT

ISEN2+

ISEN2-

uP

LOAD

+12V

VIN

PWM2

BOOT1

VCC

VIN

UGATE1

PHASE1

EN_PWR

GND

PWM4

GND

ISEN4-

ISEN4+

LGATE1

IOUT

5V

To

12V

PVCC

ISL6614

DRIVER

TCOMP

TM

VIN

BOOT2

OFS

FS

SS

+5V

PWM1

PWM2

UGATE2

PHASE2

NTC

LGATE2

PGND

FN9286.0

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5

ISL6326B

Absolute Maximum Ratings

Thermal Information

Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+6V

All Pins. . . . . . . . . . . . . . . . . . . . . . . . . . . GND -0.3V to V + 0.3V

Thermal Resistance (Notes 1, 2)

θ

(°C/W)

θ

(°C/W)

JA

JC

CC

QFN Package. . . . . . . . . . . . . . . . . . . .

32

3.5

ESD (Human Body Model). . . . . . . . . . . . . . . . . . . . . . . . . . . . .>2kV

ESD (Machine Model) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>200V

ESD (Charged Device Model) . . . . . . . . . . . . . . . . . . . . . . . . >1.5kV

Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150°C

Maximum Storage Temperature Range. . . . . . . . . . .-65°C to 150°C

Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300°C

Operating Conditions

Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5V ±5%

Ambient Temperature (ISL6326BCRZ) . . . . . . . . . . . . . 0°C to 70°C

Ambient Temperature (ISL6326BIRZ) . . . . . . . . . . . . .-40°C to 85°C

CAUTION: Stress above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the

device at these or any other conditions above those indicated in the operational section of this specification is not implied.

NOTES:

1. θ is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See

JA

Tech Brief TB379

2. For θ , the “case temp” location is the center of the exposed metal pad on the package underside.

JC

Electrical Specifications Operating Conditions: VCC = 5V, Unless Otherwise Specified

PARAMETER

VCC SUPPLY CURRENT

Nominal Supply

TEST CONDITIONS

MIN

TYP MAX UNITS

VCC = 5VDC; EN_PWR = 5VDC; R = 100kΩ,

-

18

14

26

21

mA

T

ISEN1 = ISEN2 = ISEN3 = ISEN4 = -70μA

Shutdown Supply

VCC = 5VDC; EN_PWR = 0VDC; R = 100kΩ

T

POWER-ON RESET AND ENABLE

POR Threshold

VCC Rising

VCC Falling

Rising

4.3

3.7

4.5

3.9

4.7

4.2

V

EN_PWR Threshold

EN_VTT Threshold

0.850 0.875 0.910

130

V

Hysteresis

Falling

-

mV

V

0.720 0.745 0.775

0.850 0.875 0.910

Rising

V

Hysteresis

Falling

-

130

-

mV

V

0.720 0.745 0.775

REFERENCE VOLTAGE AND DAC

System Accuracy of ISL6326BCRZ

(VID = 1V-1.6V, T = 0°C to 70°C)

J

(Note 3)

-0.5

-0.9

-0.6

-1

-

0.5

0.9

0.6

1

%VID

System Accuracy of ISL6326BCRZ

(VID = 0.5V-1V, T = 0°C to 70°C)

J

System Accuracy of ISL6326BIRZ

(VID = 1V-1.6V, T = -40°C to 85°C)

J

System Accuracy of ISL6326BIRZ

(VID = 0.5V-1V, T = -40°C to 85°C)

J

VID Pull Up

-60

-

-40

-20

0.4

-

µA

V

VID Input Low Level

VID Input High Level

VRSEL Input Low Level

VRSEL Input High Level

DAC Source Current

-

0.8

-

V

-

0.4

-

V

0.8

-

V

4

7

mA

FN9286.0

April 21, 2006

6

ISL6326B

Electrical Specifications Operating Conditions: VCC = 5V, Unless Otherwise Specified (Continued)

PARAMETER

DAC Sink Current

TEST CONDITIONS

MIN

-

TYP MAX UNITS

-

300

55

µA

REF Source Current

REF Sink Current

45

50

55

PIN-ADJUSTABLE OFFSET

Voltage at OFS Pin

Offset resistor connected to ground

Voltage below VCC, offset resistor connected to VCC

380

400

420

mV

V

1.55

1.60

1.65

OSCILLATORS

Accuracy of Switching Frequency Setting

R

= 100kΩ

225

0.08

-

250

275

1.0

-

kHz

MHz

T

Adjustment Range of Switching Frequency (Note 4)

Soft-start Ramp Rate = 100kΩ (Notes 5, 6)

-

1.563

-

R

mV/µs

S

Adjustment Range of Soft-Start Ramp Rate (Note 4)

PWM GENERATOR

0.625

6.25 mV/µs

Sawtooth Amplitude

-

1.25

-

V

ERROR AMPLIFIER

Open-Loop Gain

R

= 10kΩ to ground (Note 4)

-

96

80

25

4.3

-

dB

MHz

V/µs

V

L

Open-Loop Bandwidth

Slew Rate

(Note 4)

-

Maximum Output Voltage

Output High Voltage @ 2mA

Output Low Voltage @ 2mA

REMOTE-SENSE AMPLIFIER

Bandwidth

3.8

3.6

-

4.9

-

V

-

1.8

V

(Note 4)

-

20

-

MHz

µA

Output High Current

VSEN - RGND = 2.5V

VSEN - RGND = 0.6

-500

500

Output High Current

-

µA

PWM OUTPUT

PWM Output Voltage LOW Threshold

PWM Output Voltage HIGH Threshold

Iload = ±500μA

-

0.5

-

V

4.3

CURRENT SENSE AND OVERCURRENT PROTECTION

Sensed Current Tolerance (IOUT)

ISEN1 = ISEN2 = ISEN3 = ISEN4 = 60μA

57

72

60

85

63

98

µA

V

Overcurrent Trip Level for Average Current

Peak Current Limit for Individual Channel

IOUT Trip Level for Overcurrent protection

THERMAL MONITORING AND FAN CONTROL

TM Input Voltage for VR_FAN Trip

100

1.85

120

2.0

140

2.15

1.55

1.85

1.30

1.55

-

1.65

1.95

1.40

1.65

-

1.75

2.05

1.50

1.75

30

V

TM Input Voltage for VR_FAN Reset

TM Input Voltage for VR_HOT Trip

V

TM Input Voltage for VR_HOT Reset

V

Leakage Current of VR_FAN

VR_FAN Low Voltage

With externally pull-up resistor connected to VCC

With 1.25k resistor pull-up to VCC, I = 4mA

µA

V

-

0.4

VR_FAN

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7

ISL6326B

Electrical Specifications Operating Conditions: VCC = 5V, Unless Otherwise Specified (Continued)

PARAMETER

Leakage Current of VR_HOT

VR_HOT Low Voltage

TEST CONDITIONS

MIN

TYP MAX UNITS

With externally pull-up resistor connected to VCC

-

30

µA

V

With 1.25k resistor pull-up to VCC, I

= 4mA

0.4

VR_HOT

VR READY AND PROTECTION MONITORS

Leakage Current of VR_RDY

With externally pull-up resistor connected to VCC

= 4mA

-

30

0.4

52

62

μA

V

VR_RDY Low Voltage

I

-

VR_RDY

Undervoltage Threshold

VR_RDY Reset Voltage

Overvoltage Protection Threshold

VDIFF Falling

48

58

50

60

%VID

V

VDIFF Rising

Before valid VID

1.250 1.275 1.300

After valid VID, the voltage above VID

150

-

175

100

200

-

mV

Overvoltage Protection Reset Hysteresis

NOTES:

3. These parts are designed and adjusted for accuracy with all errors in the voltage loop included.

4. Spec guaranteed by design.

5. During soft-start, VDAC rises from 0 to 1.1V first and then ramp to VID voltage after receiving valid VID.

6. Soft-start ramp rate is determined by the adjustable soft-start oscillator frequency at the speed of 6.25mV per cycle.

FN9286.0

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8

ISL6326B

the amplifier’s output and the input to the regulation and

protection circuitry. Connect VSEN and RGND to the sense

pins of the remote load.

Functional Pin Description

VCC - Supplies the power necessary to operate the chip.

The controller starts to operate when the voltage on this pin

exceeds the rising POR threshold and shuts down when the

voltage on this pin drops below the falling POR threshold.

Connect this pin directly to a +5V supply.

FB and COMP - Inverting input and output of the error

amplifier respectively. FB can be connected to VDIFF

through a resistor. A properly chosen resistor between

VDIFF and FB can set the load line (droop), because the

sensed current will flow out of FB pin. The droop scale factor

is set by the ratio of the ISEN resistors and the inductor DCR

or the dedicated current sense resistor. COMP is tied back to

FB through an external R-C network to compensate the

regulator.

GND - Bias and reference ground for the IC. The bottom

metal base of ISL6326B is the GND.

EN_PWR - This pin is a threshold-sensitive enable input for

the controller. Connecting the 12V supply to EN_PWR

through an appropriate resistor divider provides a means to

synchronize power-up of the controller and the MOSFET

driver ICs. When EN_PWR is driven above 0.875V, the

ISL6326B is active depending on status of EN_VTT, the

internal POR, and pending fault states. Driving EN_PWR

below 0.745V will clear all fault states and prime the

ISL6326B to soft-start when re-enabled.

DAC and REF - The DAC pin is the output of the precision

internal DAC reference. The REF pin is the positive input of

the Error Amp. In typical applications, a 1kΩ, 1% resistor is

used between DAC and REF to generate a precision offset

voltage. This voltage is proportional to the offset current

determined by the offset resistor from OFS to ground or

VCC. A capacitor is used between REF and ground to

smooth the voltage transition during Dynamic VID™

operations.

EN_VTT - This pin is another threshold-sensitive enable

input for the controller. It’s typically connected to VTT output

of VTT voltage regulator in the computer mother board.

When EN_VTT is driven above 0.875V, the ISL6326B is

active depending on status of EN_PWR, the internal POR,

and pending fault states. Driving EN_VTT below 0.745V will

clear all fault states and prime the ISL6326B to soft-start

when re-enabled.

PWM1, PWM2, PWM3, PWM4 - Pulse width modulation

outputs. Connect these pins to the PWM input pins of the

Intersil driver IC. The number of active channels is

determined by the state of PWM3 and PWM4. Tie PWM3 to

VCC to configure for 2-phase operation. Tie PWM4 to VCC

to configure for 3-phase operation.

FS - Use this pin to set up the desired switching frequency. A

resistor, placed from FS to ground will set the switching

frequency. The relationship between the value of the resistor

and the switching frequency will be described by an

approximate equation.

ISEN1+, ISEN1-; ISEN2+, ISEN2-; ISEN3+, ISEN3-;

ISEN4+, ISEN4- - The ISEN+ and ISEN- pins are current

sense inputs to individual differential amplifiers. The sensed

current is used for channel current balancing, overcurrent

protection, and droop regulation. Inactive channels should

have their respective current sense inputs left open (for

example, open ISEN4+ and ISEN4- for 3-phase operation).

SS - Use this pin to set up the desired start-up oscillator

frequency. A resistor, placed from SS to ground will set up

the soft-start ramp rate. The relationship between the value

of the resistor and the soft-start ramp up time will be

described by an approximate equation.

For DCR sensing, connect each ISEN- pin to the node

between the RC sense elements. Tie the ISEN+ pin to the

VID7, VID6, VID5, VID4, VID3, VID2, VID1 and VID0 -

These are the inputs to the internal DAC that generates the

reference voltage for output regulation. Connect these pins

either to open-drain outputs with or without external pull-up

resistors or to active-pull-up outputs. All VID pins have 40µA

internal pull-up current sources that diminish to zero as the

voltage rises above the logic-high level. These inputs can be

pulled up externally as high as VCC plus 0.3V.

other end of the sense capacitor through a resistor, R .

ISEN

The voltage across the sense capacitor is proportional to the

inductor current. Therefore, the sense current is proportional

to the inductor current, and scaled by the DCR of the

inductor and R

.

ISEN

To match the time delay of the internal circuit, a capacitor is

needed between each ISEN+ pin and GND, as described in

the Current Sensing section.

VRSEL - use this pin to select internal VID code. When it is

connected to GND, the extended VR10 code is selected.

When it’s floated or pulled to high, VR11 code is selected.

This input can be pulled up as high as VCC plus 0.3V.

VR_RDY - VR_RDY indicates that soft-start has completed

and the output voltage is within the regulated range around

VID setting. It is an open-drain logic output. When OCP or

OVP occurs, VR_RDY will be pulled to low. It will also be

pulled low if the output voltage is below the under-voltage

threshold.

VDIFF, VSEN, and RGND - VSEN and RGND form the

precision differential remote-sense amplifier. This amplifier

converts the differential voltage of the remote output to a

single-ended voltage referenced to local ground. VDIFF is

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ISL6326B

OFS - The OFS pin can be used to program a DC offset

Operation

current which will generate a DC offset voltage between the

REF and DAC pins. The offset current is generated via an

external resistor and precision internal voltage references.

The polarity of the offset is selected by connecting the

resistor to GND or VCC. For no offset, the OFS pin should

be left unterminated.

Multiphase Power Conversion

Microprocessor load current profiles have changed to the

point that the advantages of multiphase power conversion

are impossible to ignore. The technical challenges

associated with producing a single-phase converter which is

both cost-effective and thermally viable have forced a

change to the cost-saving approach of multiphase. The

ISL6326B controller helps reduce the complexity of

implementation by integrating vital functions and requiring

minimal output components. The block diagrams on pages

3, 4, and 5 provide top level views of multiphase power

conversion using the ISL6326B controller.

TCOMP - Temperature compensation scaling input. The

voltage sensed on the TM pin is utilized as the temperature

input to adjust ldroop and the overcurrent protection limit to

effectively compensate for the temperature coefficient of the

current sense element. To implement the integrated

temperature compensation, a resistor divider circuit is

needed with one resistor being connected from TCOMP to

VCC of the controller and another resistor being connected

from TCOMP to GND. Changing the ratio of the resistor

values will set the gain of the integrated thermal

Interleaving

The switching of each channel in a multiphase converter is

timed to be symmetrically out of phase with each of the other

channels. In a 3-phase converter, each channel switches 1/3

cycle after the previous channel and 1/3 cycle before the

following channel. As a result, the three-phase converter has

a combined ripple frequency three times greater than the

ripple frequency of any one phase. In addition, the peak-to-

peak amplitude of the combined inductor currents is reduced

in proportion to the number of phases (Equations 1 and 2).

Increased ripple frequency and lower ripple amplitude mean

that the designer can use less per-channel inductance and

lower total output capacitance for any performance

specification.

compensation. When integrated temperature compensation

function is not used, connect TCOMP to GND.

IOUT - IOUT is the output pin of sensed average channel

current. In actual application, a resistor needs to be placed

between IOUT and GND to ensure the proper operation. The

voltage at IOUT pin will be proportional to the load current

and the resistor value. ISL6326B monitors the voltage at

IOUT for overcurrent protection. If the voltage at IOUT pin is

higher than 2V, it will trigger the overcurrent shutdown. By

choosing the proper value for the resistor at IOUT pin, the

overcurrent trip level can be set to be lower than the fixed

internal overcurrent threshold. Tie it to GND if not used.

Figure 1 illustrates the multiplicative effect on output ripple

frequency. The three channel currents (IL1, IL2, and IL3)

combine to form the AC ripple current and the DC load

current. The ripple component has three times the ripple

frequency of each individual channel current. Each PWM

pulse is terminated 1/3 of a cycle after the PWM pulse of the

previous phase. The DC components of the inductor currents

combine to feed the load.

TM - TM is an input pin for the VR temperature

measurement. Connect this pin through an NTC thermistor

to GND and a resistor to VCC of the controller. The voltage

at this pin is reverse proportional to the VR temperature.

ISL6326B monitors the VR temperature based on the

voltage at the TM pin and outputs VR_HOT and VR_FAN

signals.

VR_HOT - VR_HOT is used as an indication of high VR

temperature. It is an open-drain logic output. It will be pulled

low if the measured VR temperature is less than a certain

level, and open when the measured VR temperature

reaches a certain level. A external pull-up resistor is needed.

IL1 + IL2 + IL3, 7A/DIV

IL1, 7A/DIV

VR_FAN - VR_FAN is an output pin with open-drain logic

output. It will be pulled low if the measured VR temperature

is less than a certain level, and open when the measured VR

temperature reaches a certain level. A external pull-up

resistor is needed.

PWM1, 5V/DIV

IL2, 7A/DIV

PWM2, 5V/DIV

IL3, 7A/DIV

PWM3, 5V/DIV

1µs/DIV

FIGURE 1. PWM AND INDUCTOR-CURRENT WAVEFORMS

FOR 3-PHASE CONVERTER

FN9286.0

April 21, 2006

10

ISL6326B

To understand the reduction of ripple current amplitude in the

multiphase circuit, examine the equation representing an

individual channel’s peak-to-peak inductor current.

RMS input capacitor current. The single-phase converter

must use an input capacitor bank with twice the RMS current

capacity as the equivalent three-phase converter.

(V – V

) V

OUT

Figures 17, 18 and 19 in the section entitled Input Capacitor

Selection can be used to determine the input-capacitor RMS

current based on load current, duty cycle, and the number of

channels. They are provided as aids in determining the

optimal input capacitor solution. Figure 20 shows the single

phase input-capacitor RMS current for comparison.

IN

OUT

(EQ. 1)

I

= -----------------------------------------------------

PP

Lf

V

S

IN

In Equation 1, V and V

IN

are the input and output

OUT

voltages respectively, L is the single-channel inductor value,

and f is the switching frequency.

S

PWM Modulation Scheme

INPUT-CAPACITOR CURRENT, 10A/DIV

The ISL6326B adopts Intersil's proprietary Active Pulse

Positioning (APP) modulation scheme to improve transient

performance. APP control is a unique dual-edge PWM

modulation scheme with both PWM leading and trailing

edges being independently moved to give the best response

to transient loads. The PWM frequency, however, is constant

and set by the external resistor between the FS pin and

GND. To further improve the transient response, the

ISL6326B also implements Intersil's proprietary Adaptive

Phase Alignment (APA) technique. APA, with sufficiently

large load step currents, can turn on all phases together.

With both APP and APA control, ISL6326B can achieve

excellent transient performance and reduce the demand on

the output capacitors.

CHANNEL 1

INPUT CURRENT

10A/DIV

CHANNEL 2

INPUT CURRENT

10A/DIV

CHANNEL 3

INPUT CURRENT

10A/DIV

1µs/DIV

FIGURE 2. CHANNEL INPUT CURRENTS AND INPUT-

CAPACITOR RMS CURRENT FOR 3-PHASE

CONVERTER

Under steady state conditions the operation of the ISL6326B

PWM modulator appears to be that of a conventional trailing

edge modulator. Conventional analysis and design methods

can therefore be used for steady state and small signal

operation.

The output capacitors conduct the ripple component of the

inductor current. In the case of multiphase converters, the

capacitor current is the sum of the ripple currents from each

of the individual channels. Compare Equation 1 to the

expression for the peak-to-peak current after the summation

of N symmetrically phase-shifted inductor currents in

Equation 2. Peak-to-peak ripple current decreases by an

amount proportional to the number of channels. Output-

voltage ripple is a function of capacitance, capacitor

equivalent series resistance (ESR), and inductor ripple

current. Reducing the inductor ripple current allows the

designer to use fewer or less costly output capacitors.

PWM Operation

The timing of each channel is set by the number of active

channels. The default channel setting for the ISL6326B is

four. The switching cycle is defined as the time between

PWM pulse termination signals of each channel. The cycle

time of the pulse signal is the inverse of the switching

frequency set by the resistor between the FS pin and

ground. The PWM signals command the MOSFET driver to

turn on/off the channel MOSFETs.

(V – N V

) V

OUT

For 4-channel operation, the channel firing order is 4-3-2-1:

PWM3 pulse happens 1/4 of a cycle after PWM4, PWM2

output follows another 1/4 of a cycle after PWM3, and

PWM1 delays another 1/4 of a cycle after PWM2. For

3-channel operation, the channel firing order is 3-2-1.

IN

OUT

I

= -----------------------------------------------------------

(EQ. 2)

C, PP

Lf

V

S

IN

Another benefit of interleaving is to reduce input ripple

current. Input capacitance is determined in part by the

maximum input ripple current. Multiphase topologies can

improve overall system cost and size by lowering input ripple

current and allowing the designer to reduce the cost of input

capacitance. The example in Figure 2 illustrates input

currents from a three-phase converter combining to reduce

the total input ripple current.

Connecting PWM4 to VCC selects three channel operation

and the pulse times are spaced in 1/3 cycle increments. If

PWM3 is connected to VCC, two channel operation is

selected and the PWM2 pulse happens 1/2 of a cycle after

PWM pulse.

Switching Frequency

The converter depicted in Figure 2 delivers 36A to a 1.5V load

from a 12V input. The RMS input capacitor current is 5.9A.

Compare this to a single-phase converter also stepping down

12V to 1.5V at 36A. The single-phase converter has 11.9A

Switching frequency is determined by the selection of the

frequency-setting resistor, R , which is connected from FS

pin to GND (see the figures labelled Typical Applications on

T

FN9286.0

April 21, 2006

11

ISL6326B

pages 4 and 5). Equation 3 is provided to assist in selecting

the correct resistor value.

V

IN

I

(s)

L

10

L

2.5X10

DCR

V

OUT

R

= -------------------------

(EQ. 3)

T

F

ISL6605

SW

INDUCTOR

-

C

OUT

V

L

where F

is the switching frequency of each phase.

SW

-

(s)

V

C

Current Sensing

R

C

ISL6326B senses the current continuously for fast response.

ISL6326B supports inductor DCR sensing, or resistive

sensing techniques. The associated channel current sense

amplifier uses the ISEN inputs to reproduce a signal

PWM(n)

ISL6326B INTERNAL CIRCUIT

R

ISEN(n)

(PTC)

proportional to the inductor current, I . The sense current,

L

I

n

I

, is proportional to the inductor current. The sensed

SEN

current is used for current balance, load-line regulation, and

overcurrent protection.

CURRENT

SENSE

ISEN-(n)

+

-

The internal circuitry, shown in Figures 3, and 4, represents

one channel of an N-channel converter. This circuitry is

repeated for each channel in the converter, but may not be

active depending on the status of the PWM3 and PWM4

pins, as described in the PWM Operation section.

ISEN+(n)

C

T

DCR

I

-----------------

= I

SEN

L

R

ISEN

INDUCTOR DCR SENSING

An inductor’s winding is characteristic of a distributed

resistance as measured by the DCR (Direct Current

Resistance) parameter. Consider the inductor DCR as a

separate lumped quantity, as shown in Figure 3. The

FIGURE 3. DCR SENSING CONFIGURATION

With the internal low-offset current amplifier, the capacitor

voltage V is replicated across the sense resistor R

.

C

ISEN

, is proportional

channel current I , flowing through the inductor, will also

L

Therefore, the current out of ISEN+ pin, I

to the inductor current.

SEN

pass through the DCR. Equation 4 shows the s-domain

equivalent voltage across the inductor V .

L

Because of the internal filter at ISEN- pin, one capacitor, C ,

T

is needed to match the time delay between the ISEN- and

V

= I ⋅ (s ⋅ L + DCR)

L

(EQ. 4)

L

ISEN+ signals. Select the proper C to keep the time

T

constant of R

and C (R x C ) close to 27ns.

ISEN T

A simple R-C network across the inductor extracts the DCR

voltage, as shown in Figure 3.

ISEN

T

Equation 6 shows that the ratio of the channel current to the

sensed current, I , is driven by the value of the sense

resistor and the DCR of the inductor.

The voltage on the capacitor V , can be shown to be

C

SEN

proportional to the channel current I , see Equation 5.

L

DCR

⎛

⎝

⎞

-------------

s ⋅

+ 1 ⋅ (DCR ⋅ I )

-----------------

I

= I

⋅

(EQ. 6)

L

⎠

(EQ. 5)

SEN

L

DCR

R

ISEN

V

= --------------------------------------------------------------------

C

(s ⋅ RC + 1)

RESISTIVE SENSING

For accurate current sense, a dedicated current-sense

resistor R in series with each output inductor can

If the R-C network components are selected such that the

RC time constant (= R*C) matches the inductor time

constant (= L/DCR), the voltage across the capacitor V is

SENSE

C

serve as the current sense element (see Figure 4). This

technique is more accurate, but reduces overall converter

efficiency due to the additional power loss on the current

equal to the voltage drop across the DCR, i.e., proportional

to the channel current.

sense element R

.

SENSE

The same capacitor C is needed to match the time delay

T

between ISEN- and ISEN+ signals. Select the proper C to

T

keep the time constant of R

to 27ns.

and C (R

ISEN

x C ) close

T

ISEN

T

FN9286.0

April 21, 2006

12

ISL6326B

Equation 7 shows the ratio of the channel current to the

The sensed average current I

is tied to FB internally.

AVG

sensed current I

.

This current will develop voltage drop across the resistor

between FB and VDIFF pins for droop control. ISL6326B

can not be used for non-droop applications.

SEN

R

SENSE

-----------------------

I

= I

⋅

(EQ. 7)

SEN

L

R

ISEN

The output of the error amplifier, V

, is compared to

COMP

I

sawtooth waveforms to generate the PWM signals. The

PWM signals control the timing of the Intersil MOSFET

drivers and regulate the converter output to the specified

reference voltage. The internal and external circuitry which

control voltage regulation is illustrated in Figure 5.

L

R

V

OUT

SENSE

C

OUT

ISL6326B INTERNAL CIRCUIT

R

ISEN(n)

EXTERNAL CIRCUIT

ISL6326B INTERNAL CIRCUIT

I

n

R

C

COMP

DAC

CURRENT

SENSE

ISEN-(n)

ISEN+(n)

+

-

R

REF

C

REF

T

+

R

SENSE

-

V

I

FB

COMP

= I --------------------------

SEN

L

R

ISEN

ERROR AMPLIFIER

+

V

-

R

FB

FIGURE 4. SENSE RESISTOR IN SERIES WITH INDUCTORS

DROOP

I

AVG

VDIFF

VSEN

RGND

The inductor DCR value will increase as the temperature

increases. Therefore the sensed current will increase as the

temperature of the current sense element increases. In order

to compensate the temperature effect on the sensed current

signal, a Positive Temperature Coefficient (PTC) resistor can

V

+

OUT

+

-

OUT

be selected for the sense resistor R

, or the integrated

ISEN

DIFFERENTIAL

REMOTE-SENSE

AMPLIFIER

temperature compensation function of ISL6326B should be

utilized. The integrated temperature compensation function

is described in the Temperature Compensation section.

FIGURE 5. OUTPUT VOLTAGE AND LOAD-LINE

REGULATION WITH OFFSET ADJUSTMENT

Channel-Current Balance

The sensed current I from each active channel are summed

n

together and divided by the number of active channels. The

The ISL6326B incorporates an internal differential remote-

sense amplifier in the feedback path. The amplifier removes

the voltage error encountered when measuring the output

voltage relative to the local controller ground reference point

resulting in a more accurate means of sensing output

voltage. Connect the microprocessor sense pins to the non-

inverting input, VSEN, and inverting input, RGND, of the

resulting average current I

provides a measure of the

AVG

total load current. Channel current balance is achieved by

comparing the sensed current of each channel to the

average current to make an appropriate adjustment to the

PWM duty cycle of each channel with Intersil’s patented

current-balance method.

remote-sense amplifier. The remote-sense output, V

, is

DIFF

Channel current balance is essential in achieving the

thermal advantage of multiphase operation. With good

current balance, the power loss is equally dissipated over

multiple devices and a greater area.

connected to the inverting input of the error amplifier through

an external resistor.

A digital-to-analog converter (DAC) generates a reference

voltage based on the state of logic signals at pins VID7

through VID0. The DAC decodes the eight 6-bit logic signal

(VID) into one of the discrete voltages shown in Table 1.

Each VID input offers a 45µA pull-up to an internal 2.5V

source for use with open-drain outputs. The pull-up current

diminishes to zero above the logic threshold to protect

voltage-sensitive output devices. External pull-up resistors

can augment the pull-up current sources if case leakage into

the driving device is greater than 45µA.

Voltage Regulation

The compensation network shown in Figure 5 assures that

the steady-state error in the output voltage is limited only to

the error in the reference voltage (output of the DAC) and

offset errors in the OFS current source, remote-sense and

error amplifiers. Intersil specifies the guaranteed tolerance of

the ISL6326B to include the combined tolerances of each of

these elements.

FN9286.0

April 21, 2006

13

ISL6326B

TABLE 1. VR10 VID TABLE (WITH 6.25mV EXTENSION)

(Continued)

VID4 VID3 VID2 VID1 VID0 VID5

VID6 VOLTAGE

VID4 VID3 VID2 VID1 VID0 VID5

VID6 VOLTAGE

400mV 200mV 100mV 50mV 25mV 12.5mV 6.25mV

(V)

400mV 200mV 100mV 50mV 25mV 12.5mV 6.25mV

(V)

1.35625

1.35

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

1.6

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1.59375

1.5875

1.58125

1.575

1.34375

1.3375

1.33125

1.325

1.56875

1.5625

1.55625

1.55

1.31875

1.3125

1.30625

1.3

1.54375

1.5375

1.53125

1.525

1.29375

1.2875

1.28125

1.275

1.51875

1.5125

1.50625

1.5

1.26875

1.2625

1.25625

1.25

1.49375

1.4875

1.48125

1.475

1.24375

1.2375

1.23125

1.225

1.46875

1.4625

1.45625

1.45

1.21875

1.2125

1.20625

1.2

1.44375

1.4375

1.43125

1.425

1.19375

1.1875

1.18125

1.175

1.41875

1.4125

1.40625

1.4

1.16875

1.1625

1.15625

1.15

1.39375

1.3875

1.38125

1.375

1.14375

1.1375

1.13125

1.125

1.36875

1.3625

1.11875

FN9286.0

April 21, 2006

14

ISL6326B

TABLE 1. VR10 VID TABLE (WITH 6.25mV EXTENSION)

(Continued)

TABLE 1. VR10 VID TABLE (WITH 6.25mV EXTENSION)

(Continued)

VID4 VID3 VID2 VID1 VID0 VID5

VID6 VOLTAGE

VID4 VID3 VID2 VID1 VID0 VID5

VID6 VOLTAGE

400mV 200mV 100mV 50mV 25mV 12.5mV 6.25mV

(V)

1.1125

1.10625

1.1

400mV 200mV 100mV 50mV 25mV 12.5mV 6.25mV

(V)

0.89375

0.8875

0.88125

0.875

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1.09375

OFF

0.86875

0.8625

0.85625

0.85

OFF

1.0875

1.08125

1.075

0.84375

0.8375

0.83125

1.06875

1.0625

1.05625

1.05

TABLE 2. VR11 VID 8 BIT

VID7 VID6 VID5 VID4 VID3 VID2 VID1 VID0 VOLTAGE

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

OFF

1.04375

1.0375

1.03125

1.025

1.60000

1.59375

1.58750

1.58125

1.57500

1.56875

1.56250

1.55625

1.55000

1.54375

1.53750

1.53125

1.52500

1.51875

1.51250

1.50625

1.50000

1.49375

1.48750

1.48125

1.47500

1.46875

1.46250

1.01875

1.0125

1.00625

1

0.99375

0.9875

0.98125

0.975

0.96875

0.9625

0.95625

0.95

0.94375

0.9375

0.93125

0.925

0.91875

0.9125

0.90625

0.9

FN9286.0

April 21, 2006

15

ISL6326B

TABLE 2. VR11 VID 8 BIT (Continued)

VID7 VID6 VID5 VID4 VID3 VID2 VID1 VID0 VOLTAGE

TABLE 2. VR11 VID 8 BIT (Continued)

VID7 VID6 VID5 VID4 VID3 VID2 VID1 VID0 VOLTAGE

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1.45625

1.45000

1.44375

1.43750

1.43125

1.42500

1.41875

1.41250

1.40625

1.40000

1.39375

1.38750

1.38125

1.37500

1.36875

1.36250

1.35625

1.35000

1.34375

1.33750

1.33125

1.32500

1.31875

1.31250

1.30625

1.30000

1.29375

1.28750

1.28125

1.27500

1.26875

1.26250

1.25625

1.25000

1.24375

1.23750

1.23125

1.22500

1.21875

1.21250

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1.20625

1.20000

1.19375

1.18750

1.18125

1.17500

1.16875

1.16250

1.15625

1.15000

1.14375

1.13750

1.13125

1.12500

1.11875

1.11250

1.10625

1.10000

1.09375

1.08750

1.08125

1.07500

1.06875

1.06250

1.05625

1.05000

1.04375

1.03750

1.03125

1.02500

1.01875

1.01250

1.00625

1.00000

0.99375

0.98750

0.98125

0.97500

0.96875

0.96250

FN9286.0

April 21, 2006

16

ISL6326B

TABLE 2. VR11 VID 8 BIT (Continued)

VID7 VID6 VID5 VID4 VID3 VID2 VID1 VID0 VOLTAGE

TABLE 2. VR11 VID 8 BIT (Continued)

VID7 VID6 VID5 VID4 VID3 VID2 VID1 VID0 VOLTAGE

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

0.95625

0.95000

0.94375

0.93750

0.93125

0.92500

0.91875

0.91250

0.90625

0.90000

0.89375

0.88750

0.88125

0.87500

0.86875

0.86250

0.85625

0.85000

0.84375

0.83750

0.83125

0.82500

0.81875

0.81250

0.80625

0.80000

0.79375

0.78750

0.78125

0.77500

0.76875

0.76250

0.75625

0.75000

0.74375

0.73750

0.73125

0.72500

0.71875

0.71250

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0.70625

0.70000

0.69375

0.68750

0.68125

0.67500

0.66875

0.66250

0.65625

0.65000

0.64375

0.63750

0.63125

0.62500

0.61875

0.61250

0.60625

0.60000

0.59375

0.58750

0.58125

0.57500

0.56875

0.56250

0.55625

0.55000

0.54375

0.53750

0.53125

0.52500

0.51875

0.51250

0.50625

0.50000

OFF

FN9286.0

April 21, 2006

17

ISL6326B

Load-Line Regulation

Output-Voltage Offset Programming

The ISL6326B allows the designer to accurately adjust the

offset voltage. When a resistor, R , is connected between

Some microprocessor manufacturers require a precisely-

controlled output resistance. This dependence of output

voltage on load current is often termed “droop” or “load line”

regulation. By adding a well controlled output impedance,

the output voltage can effectively be level shifted in a

direction which works to achieve the load-line regulation

required by these manufacturers.

OFS

OFS to VCC, the voltage across it is regulated to 1.6V. This

causes a proportional current (I ) to flow into OFS. If

OFS

is connected to ground, the voltage across it is

R

OFS

regulated to 0.4V, and I

flows out of OFS. A resistor

OFS

between DAC and REF, R

, is selected so that the

REF

product (I

x R

) is equal to the desired offset voltage.

OFS

In other cases, the designer may determine that a more

cost-effective solution can be achieved by adding droop.

Droop can help to reduce the output-voltage spike that

results from fast load-current demand changes.

These functions are shown in Figure 6.

Once the desired output offset voltage has been determined,

use the following formulas to set R

:

OFS

The magnitude of the spike is dictated by the ESR and ESL

of the output capacitors selected. By positioning the no-load

voltage level near the upper specification limit, a larger

negative spike can be sustained without crossing the lower

limit. By adding a well controlled output impedance, the

output voltage under load can effectively be level shifted

down so that a larger positive spike can be sustained without

crossing the upper specification limit.

For Positive Offset (connect R

to VCC):

OFS

1.6 × R

REF

(EQ. 11)

(EQ. 12)

-----------------------------

R

=

OFS

V

OFFSET

For Negative Offset (connect R

to GND):

OFS

0.4 × R

REF

-----------------------------

R

=

OFS

V

OFFSET

As shown in Figure 5, a current proportional to the average

current of all active channels, I

, flows from FB through a

AVG

FB

load-line regulation resistor R . The resulting voltage drop

FB

across R is proportional to the output current, effectively

FB

creating an output voltage droop with a steady-state value

defined as

DAC

DYNAMIC

VID D/A

V

= I

R

(EQ. 8)

DROOP

AVG FB

R

REF

E/A

REF

The regulated output voltage is reduced by the droop voltage

. The output voltage as a function of load current is

C

REF

V

DROOP

derived by combining Equation 8 with the appropriate

sample current expression defined by the current sense

method employed.

VCC

OR

GND

I

R

X

R

ISEN

⎛

⎞

⎟

⎠

LOAD

N

V

= V

– V

– ---------------- ----------------- R

⎜

OFS FB

(EQ. 9)

OUT

REF

⎝

-

1.6V

+

Where V

is the reference voltage, V

is the

REF

programmed offset voltage, I

OFS

R

OFS

is the total output current

+

-

LOAD

is the sense resistor connected to

0.4V

of the converter, R

the ISEN+ pin, and R is the feedback resistor, N is the

ISEN

OFS

ISL6326B

FB

active channel number, and R is the DCR, or R

GND

X

SENSE

VCC

depending on the sensing method.

FIGURE 6. OUTPUT VOLTAGE OFFSET PROGRAMMING

Therefore the equivalent loadline impedance, i.e. Droop

impedance, is equal to:

R

X

R

ISEN

FB

R

= ------------ -----------------

(EQ. 10)

LL

N

FN9286.0

April 21, 2006

18

ISL6326B

ISL66xx family of Intersil MOSFET drivers, which require

12V bias.

Dynamic VID

Modern microprocessors need to make changes to their

core voltage as part of normal operation. They direct the

core-voltage regulator to do this by making changes to the

VID inputs during regulator operation. The power

management solution is required to monitor the DAC inputs

and respond to on-the-fly VID changes in a controlled

manner. Supervising the safe output voltage transition within

the DAC range of the processor without discontinuity or

disruption is a necessary function of the core-voltage

regulator.

3. The voltage on EN_VTT must be higher than 0.875V to

enable the controller. This pin is typically connected to the

output of VTT VR.

ISL6326B INTERNAL CIRCUIT

EXTERNAL CIRCUIT

+12V

VCC

10kΩ

POR

ENABLE

COMPARATOR

CIRCUIT

EN_PWR

+

-

In order to ensure the smooth transition of output voltage

during VID change, a VID step change smoothing network,

910Ω

composed of R

and C

as shown in Figure 6, can be

is based on the desired offset

REF

used. The selection of R

REF

voltage as detailed above in Output-Voltage Offset

Programming. The selection of C is based on the time

0.875V

REF

EN_VTT

+

-

duration for 1 bit VID change and the allowable delay time.

Assuming the microprocessor controls the VID change at 1

bit every T , the relationship between the time constant of

VID

R

and C

network and T

is given by the following

0.875V

REF

equation.

REF

VID

SOFT-START

AND

(EQ. 13)

C

R

= T

REF REF

VID

FAULT LOGIC

Operation Initialization

FIGURE 7. POWER SEQUENCING USING THRESHOLD-

SENSITIVE ENABLE (EN) FUNCTION

Prior to converter initialization, proper conditions must exist

on the enable inputs and VCC. When the conditions are met,

the controller begins soft-start. Once the output voltage is

within the proper window of operation, VR_RDY asserts

logic high.

When all conditions above are satisfied, ISL6326B begins

the soft-start and ramps the output voltage to 1.1V first. After

remaining at 1.1V for some time, ISL6326B reads the VID

code at VID input pins. If the VID code is valid, ISL6326B will

regulate the output to the final VID setting. If the VID code is

OFF code, ISL6326B will shut down, and cycling VCC,

EN_PWR or EN_VTT is needed to restart.

Enable and Disable

While in shutdown mode, the PWM outputs are held in a

high-impedance state to assure the drivers remain off. The

following input conditions must be met before the ISL6326B

is released from shutdown mode.

Soft-Start

ISL6326B based VR has 4 periods during soft-start as

shown in Figure 8. After VCC, EN_VTT and EN_PWR reach

their POR/enable thresholds, The controller will have fixed

delay period TD1. After this delay period, the VR will begin

first soft-start ramp until the output voltage reaches 1.1V

Vboot voltage. Then, the controller will regulate the VR

voltage at 1.1V for another fixed period TD3. At the end of

TD3 period, ISL6326B reads the VID signals. If the VID code

is valid, ISL6326B will initiate the second soft-start ramp until

the voltage reaches the VID voltage minus offset voltage.

1. The bias voltage applied at VCC must reach the internal

power-on reset (POR) rising threshold. Once this

threshold is reached, proper operation of all aspects of

the ISL6326B is guaranteed. Hysteresis between the

rising and falling thresholds assure that once enabled,

the ISL6326B will not inadvertently turn off unless the

bias voltage drops substantially (see Electrical

Specifications).

2. The ISL6326B features an enable input (EN_PWR) for

power sequencing between the controller bias voltage

and another voltage rail. The enable comparator holds

the ISL6326B in shutdown until the voltage at EN_PWR

rises above 0.875V. The enable comparator has about

130mV of hysteresis to prevent bounce. It is important

that the driver ICs reach their POR level before the

ISL6326B becomes enabled. The schematic in Figure 7

demonstrates sequencing the ISL6326B with the

The soft-start time is the sum of the 4 periods as shown in

the following equation.

T

= TD1 + TD2 + TD3 + TD4

(EQ. 14)

SS

TD1 is a fixed delay with the typical value as 1.36ms. TD3 is

determined by the fixed 85µs plus the time to obtain valid

FN9286.0

April 21, 2006

19

ISL6326B

VID voltage. If the VID is valid before the output reaches the

either the DCR of the inductor or R depending on the

SENSE

1.1V, the minimum time to validate the VID input is 500ns.

Therefore the minimum TD3 is about 86µs.

sensing method.

The resistor from the IOUT pin to GND should be chosen to

ensure that the voltage at the IOUT pin is less than 2V under

the maximum load current. If the IOUT pin voltage is higher

than 2V, overcurrent shutdown will be triggered, as

described in the Overcurrent Protection section.

During TD2 and TD4, ISL6326B digitally controls the DAC

voltage change at 6.25mV per step. The time for each step is

determined by the frequency of the soft-start oscillator which

is defined by the resistor R from SS pin to GND. The

SS

A small capacitor can be placed between the IOUT pin and

GND to reduce the noise impact. If this pin is not used, tie it

to GND.

second soft-start ramp time TD2 and TD4 can be calculated

based on the following equations:

1.1xR

SS

-----------------------

TD2 =

(μs)

(EQ. 15)

6.25x25

Fault Monitoring and Protection

(V – 1.1)xR

The ISL6326B actively monitors output voltage and current

to detect fault conditions. Fault monitors trigger protective

measures to prevent damage to a microprocessor load. One

common power good indicator is provided for linking to

external system monitors. The schematic in Figure 9 outlines

the interaction between the fault monitors and the VR_RDY

signal.

VID

SS

(EQ. 16)

------------------------------------------------

TD4 =

(μs)

6.25x25

For example, when VID is set to 1.5V and the R is set at

SS

100kΩ, the first soft-start ramp time TD2 will be 704µs and

the second soft-start ramp time TD4 will be 256µs.

After the DAC voltage reaches the final VID setting,

VR_RDY will be set to high with the fixed delay TD5. The

typical value for TD5 is 85µs.

VR_RDY Signal

The VR_RDY pin is an open-drain logic output to indicate

that the soft-start period has completed and the output

voltage is within the regulated range. VR_RDY is pulled low

during shutdown and releases high after a successful soft-

start and a fixed delay TD5. VR_RDY will be pulled low when

an undervoltage or overvoltage condition is detected, or the

controller is disabled by a reset from EN_PWR, EN_VTT,

POR, or VID OFF-code.

VOUT, 500mV/DIV

TD1

TD5

TD3 TD4

TD2

Undervoltage Detection

The undervoltage threshold is set at 50% of the VID code.

When the output voltage at VSEN is below the undervoltage

threshold, VR_RDY is pulled low.

EN_VTT

Overvoltage Protection

VR_RDY

500µs/DIV

Regardless of the VR being enabled or not, the ISL6326B

overvoltage protection (OVP) circuit will be active after its

POR. The OVP thresholds are different under different

operation conditions. When VR is not enabled and during

the soft-start intervals TD1, TD2 and TD3, the OVP

threshold is 1.275V. Once the controller detects valid VID

input, the OVP trip point will be changed to DAC plus

175mV.

FIGURE 8. SOFT-START WAVEFORMS

Current Sense Output

The current flowing out of the IOUT pin is equal to the

sensed average current inside ISL6326B. In typical

application, a resistor is placed from the IOUT pin to GND to

generate a voltage, which is proportional to the load current

and the resistor value:

Two actions are taken by the ISL6326B to protect the

microprocessor load when an overvoltage condition occurs.

R

X

R

ISEN

At the inception of an overvoltage event, all PWM outputs

are commanded low instantly (less than 20ns). This causes

the Intersil drivers to turn on the lower MOSFETs and pull

the output voltage below a level to avoid damaging the load.

When the VDIFF voltage falls below the DAC plus 75mV,

PWM signals enter a high-impedance state. The Intersil

drivers respond to the high-impedance input by turning off

both upper and lower MOSFETs. If the overvoltage condition

reoccurs, the ISL6326B will again command the lower

IOUT

N

(EQ. 17)

V

= ------------------ -----------------I

IOUT

LOAD

where V

is the voltage at the IOUT pin, R

is the

is the total

IOUT

resistor between the IOUT pin and GND, I

output current of the converter, R

connected to the ISEN+ pin, N is the active channel number,

and R is the DC resistance of the current sense element,

X

LOAD

is the sense resistor

ISEN

FN9286.0

April 21, 2006

20

ISL6326B

MOSFETs to turn on. The ISL6326B will continue to protect

the load in this fashion as long as the overvoltage condition

occurs.

At the beginning of overcurrent shutdown, the controller

places all PWM signals in a high-impedance state within

20ns, commanding the Intersil MOSFET driver ICs to turn off

both upper and lower MOSFETs. The system remains in this

state a period of 4096 switching cycles. If the controller is still

enabled at the end of this wait period, it will attempt a soft-

start. If the fault remains, the trip-retry cycles will continue

indefinitely (as shown in Figure 10) until either controller is

disabled or the fault is cleared. Note that the energy

delivered during trip-retry cycling is much less than during

full-load operation, so there is no thermal hazard during this

kind of operation.

Once an overvoltage condition is detected, normal PWM

operation ceases until the ISL6326B is reset. Cycling the

voltage on EN_PWR, EN_VTT or VCC below the POR-

falling threshold will reset the controller. Cycling the VID

codes will not reset the controller.

VR_RDY

UV

OUTPUT CURRENT

50%

85µA

-

DAC

SOFT-START, FAULT

AND CONTROL LOGIC

OC

+

0A

I

AVG

2.0V

-

VDIFF

+

OUTPUT VOLTAGE

OC

OV

IOUT

+

-

VID + 0.175V

0V

2ms/DIV

FIGURE 9. VR_RDY AND PROTECTION CIRCUITRY

FIGURE 10. OVERCURRENT BEHAVIOR IN HICCUP MODE.

F

= 500kHz

SW

Overcurrent Protection

ISL6326B has two levels of overcurrent protection. Each

phase is protected from a sustained overcurrent condition by

limiting its peak current, while the combined phase currents

are protected on an instantaneous basis.

For the individual channel overcurrent protection, the

ISL6326B continuously compares the sensed current signal

of each channel with the 120µA reference current. If one

channel current exceeds the reference current, ISL6326B

will pull PWM signal of this channel to low for the rest of the

switching cycle. This PWM signal can be turned on next

cycle if the sensed channel current is less than the 120µA

reference current. The peak current limit of individual

channel will not trigger the converter to shutdown.

In instantaneous protection mode, ISL6326B utilizes the

sensed average current I

to detect an overcurrent

AVG

condition. See the Channel-Current Balance section for

more detail on how the average current is measured. The

average current is continually compared with a constant

85µA reference current, as shown in Figure 9. Once the

average current exceeds the reference current, a

comparator triggers the converter to shutdown.

Thermal Monitoring (VR_HOT/VR_FAN)

There are two thermal signals to indicate the temperature

status of the voltage regulator: VR_HOT and VR_FAN. Both

VR_FAN and VR_HOT pins are open-drain outputs, and

external pull-up resistors are required. Those signals are

valid only after the controller is enabled.

The current out of IOUT pin is equal to the sensed average

current I

. With a resistor from IOUT to GND, the voltage

AVG

at IOUT will be proportional to the sensed average current

and the resistor value. ISL6326B continuously monitors the

voltage at IOUT pin. If the voltage at IOUT pin is higher than

2V, a comparator triggers the overcurrent shutdown. By

increasing the resistor between IOUT and GND, the

The VR_FAN signal indicates that the temperature of the

voltage regulator is high and more cooling airflow is needed.

The VR_HOT signal can be used to inform the system that

the temperature of the voltage regulator is too high and the

CPU should reduce its power consumption. The VR_HOT

signal may be tied to the CPU’s PROC_HOT signal.

overcurrent protection threshold can be adjusted to be less

than 100µA. For example, the overcurrent threshold for the

sensed average current I

can be set to 80µA by using a

AVG

25kΩ resistor from IOUT to GND.

FN9286.0

April 21, 2006

21

ISL6326B

The diagram of thermal monitoring function block is shown in

V_TM/ V_CCvs. Temperature

Figure 11. One NTC resistor should be placed close to the

power stage of the voltage regulator to sense the operational

temperature, and one pull-up resistor is needed to form the

voltage divider for the TM pin. As the temperature of the

power stage increases, the resistance of the NTC will

reduce, resulting in the reduced voltage at the TM pin.

Figure 12 shows the TM voltage over the temperature for a

typical design with a recommended 6.8kΩ NTC (P/N:

NTHS0805N02N6801 from Vishay) and 1kΩ resistor RTM1.

We recommend using those resistors for the accurate

temperature compensation.

100%

90%

80%

70%

60%

50%

40%

30%

20%

There are two comparators with hysteresis to compare the

TM pin voltage to the fixed thresholds for VR_FAN and

VR_HOT signals respectively. The VR_FAN signal is set to

high when the TM voltage is lower than 33% of VCC voltage,

and is pulled to GND when the TM voltage increases to

above 39% of VCC voltage. The VR_FAN signal is set to

high when the TM voltage goes below 28% of VCC voltage,

and is pulled to GND when the TM voltage goes back to

above 33% of VCC voltage. Figure 13 shows the operation

of those signals.

0

20

40

60

80

100

120

140

Temperature (^oC)

FIGURE 12. THE RATIO OF TM VOLTAGE TO NTC

TEMPERATURE WITH RECOMMENDED PARTS

TM

0.39*Vcc

0.33*Vcc

0.28*Vcc

VR_FAN

VR_HOT

VCC

VR_FAN

Temperature

T1

T2

T3

0.33V_CC

R_TM1

FIGURE 13. VR_HOT AND VR_FAN SIGNAL vs TM VOLTAGE

VR_HOT

TM

Based on the NTC temperature characteristics and the

desired threshold of the VR_HOT signal, the pull-up resistor

RTM1 of TM pin is given by:

^oc

R_NTC

0.28V_CC

R

= 2.75xR

NTC(T3)

(EQ. 18)

TM1

FIGURE 11. BLOCK DIAGRAM OF THERMAL MONITORING

FUNCTION

R

is the NTC resistance at the VR_HOT threshold

NTC(T3)

temperature T3.

The NTC resistance at the set point T2 and release point T1

of VR_FAN signal can be calculated as:

R

= 1.267xR

(EQ. 19)

NTC(T2)

NTC(T3)

R

= 1.644xR

(EQ. 20)

NTC(T1)

NTC(T3)

With the NTC resistance value obtained from Equations 19

and 20, the temperature value T2 and T1 can be found from

the NTC datasheet.

FN9286.0

April 21, 2006

22

ISL6326B

component. The TCOMP pin voltage can be utilized to

Temperature Compensation

correct the temperature difference between NTC and the

current sense component. When a different NTC type or

different voltage divider is used for the TM function, the

TCOMP voltage can also be used to compensate for the

difference between the recommended TM voltage curve in

Figure 13 and that of the actual design. According to the

VCC voltage, ISL6326B converts the TCOMP pin voltage to

a 4-bit TCOMP digital signal as TCOMP factor N.

ISL6326B supports inductor DCR sensing, or resistive

sensing techniques. The inductor DCR has a positive

temperature coefficient, which is about +0.38%/°C. Since the

voltage across inductor is sensed for the output current

information, the sensed current has the same positive

temperature coefficient as the inductor DCR.

In order to obtain the correct current information, there

should be a way to correct the temperature impact on the

current sense component. ISL6326B provides two methods:

integrated temperature compensation and external

temperature compensation.

The TCOMP factor N is an integer between 0 and 15. The

integrated temperature compensation function is disabled for

N = 0. For N = 4, the NTC temperature is equal to the

temperature of the current sense component. For N < 4, the

NTC is hotter than the current sense component. The NTC is

cooler than the current sense component for N > 4. When

N > 4, the larger TCOMP factor N, the larger the difference

between the NTC temperature and the temperature of the

current sense component.

Integrated Temperature Compensation

When the TCOMP voltage is equal or greater than VCC/15,

ISL6326B will utilize the voltage at TM and TCOMP pins to

compensate the temperature impact on the sensed current.

The block diagram of this function is shown in Figure 14.

ISL6326B multiplexes the TCOMP factor N with the TM

digital signal to obtain the adjustment gain to compensate

the temperature impact on the sensed channel current. The

compensated channel current signal is used for droop and

overcurrent protection functions.

V_CC

I_sen4

I_sen3

I_sen2

I_sen1

Channel current

sense

R_TM1

Design Procedure

Non-linear

A/D

TM

1. Properly choose the voltage divider for the TM pin to

match the TM voltage vs temperature curve with the

recommended curve in Figure 12.

I₄

I₃

I₂

I₁

^oc

R_NTC

2. Run the actual board under the full load and the desired

cooling condition.

k_i

D/A

V_CC

3. After the board reaches the thermal steady state, record

the temperature (T

(inductor or MOSFET) and the voltage at TM and VCC

pins.

) of the current sense component

CSC

R_TC1

TCOMP

4-bit

A/D

Droop &

Over current protection

4. Use the following equation to calculate the resistance of

the TM NTC, and find out the corresponding NTC

R_TC2

temperature T

from the NTC datasheet.

NTC

V

xR

TM

TM1

(EQ. 21)

R

= -------------------------------

)

NTC

FIGURE 14. BLOCK DIAGRAM OF INTEGRATED

TEMPERATURE COMPENSATION

NTC(T

V

– V

CC

TM

5. Use the following equation to calculate the TCOMP

factor N:

When the TM NTC is placed close to the current sense

component (inductor), the temperature of the NTC will track

the temperature of the current sense component. Therefore

the TM voltage can be utilized to obtain the temperature of

the current sense component.

209x(T

– T

)

NTC

CSC

(EQ. 22)

-------------------------------------------------------

N =

+ 4

3xT

+ 400

NTC

6. Choose an integral number close to the above result for

the TCOMP factor. If this factor is higher than 15, use

N = 15. If it is less than 1, use N = 1.

Based on VCC voltage, ISL6326B converts the TM pin

voltage to a 6-bit TM digital signal for temperature

7. Choose the pull-up resistor R

TC1

(typical 10kΩ);

compensation. With the non-linear A/D converter of

ISL6326B, the TM digital signal is linearly proportional to the

NTC temperature. For accurate temperature compensation,

the ratio of the TM voltage to the NTC temperature of the

practical design should be similar to that in Figure 12.

8. If N = 15, do not need the pull-down resistor R

,

TC2

otherwise obtain R

by the following equation:

TC2

NxR

TC1

15 – N

----------------------

=

(EQ. 23)

R

TC2

9. Run the actual board under full load again with the proper

resistors connected to the TCOMP pin.

Depending on the location of the NTC and the airflow, the

NTC may be cooler or hotter than the current sense

FN9286.0

April 21, 2006

23

ISL6326B

10. Record the output voltage as V1 immediately after the

output voltage is stable with the full load. Record the

output voltage as V2 after the VR reaches the thermal

steady state.

Power Stages

The first step in designing a multiphase converter is to

determine the number of phases. This determination

depends heavily on the cost analysis which in turn depends

on system constraints that differ from one design to the next.

Principally, the designer will be concerned with whether

components can be mounted on both sides of the circuit

board; whether through-hole components are permitted; and

the total board space available for power-supply circuitry.

Generally speaking, the most economical solutions are

those in which each phase handles between 15 and 20A. All

surface-mount designs will tend toward the lower end of this

current range. If through-hole MOSFETs and inductors can

be used, higher per-phase currents are possible. In cases

where board space is the limiting constraint, current can be

pushed as high as 40A per phase, but these designs require

heat sinks and forced air to cool the MOSFETs, inductors

and heat-dissipating surfaces.

11. If the output voltage increases over 2mV as the

temperature increases, i.e. V2-V1 > 2mV, reduce N and

redesign R

; if the output voltage decreases over 2mV

TC2

as the temperature increases, i.e. V1-V2 > 2mV, increase

N and redesign R

.

TC2

External Temperature Compensation

By pulling the TCOMP pin to GND, the integrated

temperature compensation function is disabled. And one

external temperature compensation network, shown in

Figure 15, can be used to cancel the temperature impact on

the droop (i.e., load line).

ISL6326B

Internal

circuit

COMP

MOSFETs

The choice of MOSFETs depends on the current each

MOSFET will be required to conduct; the switching

frequency; the capability of the MOSFETs to dissipate heat;

and the availability and nature of heat sinking and air flow.

FB

^oC

ISEN

LOWER MOSFET POWER CALCULATION

The calculation for heat dissipated in the lower MOSFET is

simple, since virtually all of the heat loss in the lower

MOSFET is due to current conducted through the channel

VDIFF

FIGURE 15. EXTERNAL TEMPERATURE COMPENSATION

resistance (R

). In Equation 24, I is the maximum

DS(ON)

M

continuous output current; I is the peak-to-peak inductor

PP

The sensed current will flow out of the FB pin and develop a

current (see Equation 1); d is the duty cycle (V

/V ); and

droop voltage across the resistor equivalent (R ) between

OUT IN

FB

L is the per-channel inductance.

the FB and VDIFF pins. If R resistance reduces as the

FB

temperature increases, the temperature impact on the droop

can be compensated. An NTC resistor can be placed close

to the power stage and used to form R . Due to the

FB

2

I

(1 – d)

⎛

⎜

⎝

⎞

⎟

⎠

I

L, PP

(EQ. 24)

M

P

= r

(1 – d) + --------------------------------

-----

LOW, 1

DS(ON)

12

N

non-linear temperature characteristics of the NTC, a resistor

network is needed to make the equivalent resistance

between the FB and VDIFF pins reverse proportional to the

temperature.

An additional term can be added to the lower-MOSFET loss

equation to account for additional loss accrued during the

dead time when inductor current is flowing through the

lower-MOSFET body diode. This term is dependent on the

The external temperature compensation network can only

compensate the temperature impact on the droop, while it

has no impact to the sensed current inside ISL6326B.

Therefore, this network cannot compensate for the

temperature impact on the overcurrent protection function.

diode forward voltage at I , V ; the switching

M

D(ON)

frequency, f ; and the length of dead times, t and t , at

S

d1 d2

the beginning and the end of the lower-MOSFET conduction

interval respectively.

⎛

⎜

⎝

⎞

⎟

⎠

I

M

N

I

(EQ. 25)

⎛

⎝

⎞

⎠

M

PP

2

PP

2

P

= V

f

D(ON) S

t

d2

+

--------

----- –

----- + --------

LOW, 2

d1

N

General Design Guide

This design guide is intended to provide a high-level

explanation of the steps necessary to create a multiphase

power converter. It is assumed that the reader is familiar with

many of the basic skills and techniques referenced below. In

addition to this guide, Intersil provides complete reference

designs that include schematics, bills of materials, and

example board layouts for all common microprocessor

applications.

Thus the total maximum power dissipated in each lower

MOSFET is approximated by the summation of P

and

LOW,1

P

.

LOW,2

Upper MOSFET Power Calculation

In addition to R losses, a large portion of the upper-

DS(ON)

MOSFET losses are due to currents conducted across the

input voltage (V ) during switching. Since a substantially

IN

FN9286.0

April 21, 2006

24

ISL6326B

higher portion of the upper-MOSFET losses are dependent

where R is the sense resistor connected to the ISEN+

ISEN

on switching frequency, the power calculation is more

complex. Upper MOSFET losses can be divided into

separate components involving the upper-MOSFET

switching times; the lower-MOSFET body-diode reverse-

pin, N is the active channel number, R is the resistance of

the current sense element, either the DCR of the inductor or

X

R

depending on the sensing method, and I

is the

SENSE

desired overcurrent trip point. Typically, I

OCP

can be chosen

OCP

recovery charge, Q ; and the upper MOSFET R

to be 1.3 times the maximum load current of the specific

rr

DS(ON)

conduction loss.

application.

When the upper MOSFET turns off, the lower MOSFET does

not conduct any portion of the inductor current until the

voltage at the phase node falls below ground. Once the

lower MOSFET begins conducting, the current in the upper

MOSFET falls to zero as the current in the lower MOSFET

ramps up to assume the full inductor current. In Equation 26,

With integrated temperature compensation, the sensed

current signal is independent on the operational temperature

of the power stage, i.e. the temperature effect on the current

sense element R is cancelled by the integrated

X

temperature compensation function. R in Equation 30

X

should be the resistance of the current sense element at the

room temperature.

the required time for this commutation is t and the

1

approximated associated power loss is P

.

UP,1

When the integrated temperature compensation function is

disabled by pulling the TCOMP pin to GND, the sensed

current will be dependent on the operational temperature of

the power stage, since the DC resistance of the current

sense element may be changed according to the operational

t

I

⎛

⎜

⎝

⎞

⎟

⎠

1

M

PP

2

⎛

⎝

⎞

(EQ. 26)

P

≈ V

f

S

----

----- + --------

UP,1

IN

⎠

2

N

At turn on, the upper MOSFET begins to conduct and this

transition occurs over a time t . In Equation 27, the

temperature. R in Equation 30 should be the maximum DC

2

X

approximate power loss is P

.

resistance of the current sense element at the all operational

temperature.

UP,2

I

t

2

⎛I

⎞ ⎛

⎞

⎟

⎠

PP

2

M

(EQ. 27)

P

≈ V

f

S

-------- ----

⎟ ⎜

⎜

⎝

----- –

UP,2

IN

In certain circumstances, it may be necessary to adjust the

value of one or more ISEN resistors. When the components

of one or more channels are inhibited from effectively

dissipating their heat so that the affected channels run hotter

than desired, choose new, smaller values of RISEN for the

affected phases (see the section entitled Channel-Current

N

⎠ ⎝

A third component involves the lower MOSFET’s reverse-

recovery charge, Q . Since the inductor current has fully

rr

commutated to the upper MOSFET before the lower-

MOSFET’s body diode can draw all of Q , it is conducted

through the upper MOSFET across VIN. The power

rr

Balance). Choose R

in proportion to the desired

ISEN,2

decrease in temperature rise in order to cause proportionally

less current to flow in the hotter phase:

dissipated as a result is P

and is approximately

UP,3

P

= V

Q f

(EQ. 28)

UP,3

IN rr S

ΔT

2

(EQ. 31)

R

= R

----------

ISEN,2

ISEN

ΔT

1

Finally, the resistive part of the upper MOSFET’s is given in

Equation 29 as P

.

UP,4

In Equation 31, make sure that ΔT is the desired temperature

2

rise above the ambient temperature, and ΔT is the measured

temperature rise above the ambient temperature. While a

single adjustment according to Equation 31 is usually

sufficient, it may occasionally be necessary to adjust R

ISEN

two or more times to achieve optimal thermal balance

between all channels.

The total power dissipated by the upper MOSFET at full load

can now be approximated as the summation of the results

from Equations 26, 27, and 28. Since the power equations

depend on MOSFET parameters, choosing the correct

MOSFETs can be an iterative process involving repetitive

solutions to the loss equations for different MOSFETs and

different switching frequencies.

1

Load-Line Regulation Resistor

2

I

⎛

⎜

⎝

⎞

⎟

⎠

I

The load-line regulation resistor is labelled R in Figure 5.

FB

Its value depends on the desired loadline requirement of the

PP

M

(EQ. 29)

P

≈ r

d +

d

---------

12

-----

UP,4

DS(ON)

N

application.

Current Sensing Resistor

The desired loadline can be calculated by the following

equation:

The resistors connected to the Isen+ pins determine the

gains in the load-line regulation loop and the channel-current

balance loop as well as setting the overcurrent trip point.

Select values for these resistors by the following equation:

V

DROOP

R

= ------------------------

(EQ. 32)

LL

I

FL

R

I

OCP

N

X

where I is the full load current of the specific application,

FL

(EQ. 30)

R

= ----------------------- -------------

–

ISEN

6

85 ×10

and VR

is the desired voltage droop under the full

DROOP

load condition.

FN9286.0

April 21, 2006

25

ISL6326B

Based on the desired loadline R , the loadline regulation

LL

C

(OPTIONAL)

2

resistor can be calculated by the following equation:

N

R

C

LL

ISEN

R

X

R

= ---------------------------------

C

(EQ. 33)

FB

COMP

FB

where N is the active channel number, R

is the sense

resistor connected to the ISEN+ pin, and R is the

ISEN

X

+

resistance of the current sense element, either the DCR of

R

FB

V

the inductor or R depending on the sensing method.

DROOP

SENSE

-

If one or more of the current sense resistors are adjusted for

thermal balance, as in Equation 31, the load-line regulation

resistor should be selected based on the average value of

the current sensing resistors, as given in the following

equation:

VDIFF

FIGURE 16. COMPENSATION CONFIGURATION FOR

LOAD-LINE REGULATED ISL6326B CIRCUIT

R

LL

R

= ----------

R

ISEN(n)

(EQ. 34)

∑

FB

R

X

n

The feedback resistor, R , has already been chosen as

FB

outlined in Load-Line Regulation Resistor. Select a target

where R

the n ISEN+ pin.

is the current sensing resistor connected to

ISEN(n)

bandwidth for the compensated system, f . The target

0

th

bandwidth must be large enough to assure adequate

transient performance, but smaller than 1/3 of the

per-channel switching frequency. The values of the

compensation components depend on the relationships of f

to the L-C pole frequency and the ESR zero frequency. For

each of the three cases which follow, there is a separate set

of equations for the compensation components.

Compensation

The two opposing goals of compensating the voltage

regulator are stability and speed. Depending on whether the

regulator employs the optional load-line regulation as

described in Load-Line Regulation, there are two distinct

methods for achieving these goals.

0

1

COMPENSATING LOAD-LINE REGULATED

CONVERTER

------------------- > f

Case 1:

Case 2:

Case 3:

0

2π LC

2πf V

LC

pp

0.75V

IN

0

The load-line regulated converter behaves in a similar

manner to a peak-current mode controller because the two

poles at the output-filter L-C resonant frequency split with

the introduction of current information into the control loop.

The final location of these poles is determined by the system

function, the gain of the current signal, and the value of the

compensation components, R and C .

R

C

= R -----------------------------------

C

FB

0.75V

IN

2πV

= ------------------------------------

R

f

PP FB 0

1

-------------------

≤ f < -----------------------------

0

2πC(ESR)

2π LC

C

2

Since the system poles and zero are affected by the values

of the components that are meant to compensate them, the

solution to the system equation becomes fairly complicated.

Fortunately there is a simple approximation that comes very

close to an optimal solution. Treating the system as though it

were a voltage-mode regulator by compensating the L-C

poles and the ESR zero of the voltage-mode approximation

yields a solution that is always stable with very close to ideal

transient performance.

V

(2π)

f

LC

0

PP

R

C

= R --------------------------------------------

FB

(EQ. 35)

C

0.75 V

0.75V

IN

= ------------------------------------------------------------

2

(2π)

f

V

R

LC

0

PP FB

1

f > -----------------------------

0

2πC(ESR)

2π f V

L

pp

0

R

C

= R

-----------------------------------------

FB

C

0.75 V (ESR)

IN

0.75V (ESR)

C

IN

= -------------------------------------------------

2πV

R

f

L

PP FB 0

In Equation 35, L is the per-channel filter inductance divided

by the number of active channels; C is the sum total of all

output capacitors; ESR is the equivalent-series resistance of

FN9286.0

April 21, 2006

26

ISL6326B

the bulk output-filter capacitance; and V is the sawtooth

PP

with bulk capacitors having high capacitance but limited

amplitude described in Electrical Specifications.

high-frequency performance. Minimizing the ESL of the

high-frequency capacitors allows them to support the output

voltage as the current increases. Minimizing the ESR of the

bulk capacitors allows them to supply the increased current

with less output voltage deviation.

The optional capacitor C , is sometimes needed to bypass

2

noise away from the PWM comparator. Keep a position

available for C , and be prepared to install a high-frequency

2

capacitor of between 22pF and 150pF in case any leading-

edge jitter problem is noted.

The ESR of the bulk capacitors also creates the majority of

the output-voltage ripple. As the bulk capacitors sink and

source the inductor AC ripple current (see Interleaving and

Equation 2), a voltage develops across the bulk-capacitor

Once selected, the compensation values in Equation 35

assure a stable converter with reasonable transient

performance. In most cases, transient performance can be

ESR equal to I

(ESR). Thus, once the output capacitors

C,PP

are selected, the maximum allowable ripple voltage,

improved by making adjustments to R . Slowly increase the

C

value of R while observing the transient performance on an

C

V , determines the lower limit on the inductance.

PP(MAX)

oscilloscope until no further improvement is noted. Normally,

C

will not need adjustment. Keep the value of C from

⎛

⎝

⎞

V

C

V

– N V

IN

OUT

⎠

(EQ. 37)

Equation 35 unless some performance issue is noted.

L

(ESR)

≥

-----------------------------------------------------------

f V

V

IN PP(MAX)

S

Output Filter Design

Since the capacitors are supplying a decreasing portion of

the load current while the regulator recovers from the

transient, the capacitor voltage becomes slightly depleted.

The output inductors must be capable of assuming the entire

load current before the output voltage decreases more than

The output inductors and the output capacitor bank together

to form a low-pass filter responsible for smoothing the

pulsating voltage at the phase nodes. The output filter also

must provide the transient energy until the regulator can

respond. Because it has a low bandwidth compared to the

switching frequency, the output filter necessarily limits the

system transient response. The output capacitor must

supply or sink load current while the current in the output

inductors increases or decreases to meet the demand.

ΔV

. This places an upper limit on inductance.

MAX

Equation 38 gives the upper limit on L for the cases when

the trailing edge of the current transient causes a greater

output-voltage deviation than the leading edge. Equation 39

addresses the leading edge. Normally, the trailing edge

dictates the selection of L because duty cycles are usually

less than 50%. Nevertheless, both inequalities should be

evaluated, and L should be selected based on the lower of

the two results. In each equation, L is the per-channel

inductance, C is the total output capacitance, and N is the

number of active channels.

In high-speed converters, the output capacitor bank is

usually the most costly (and often the largest) part of the

circuit. Output filter design begins with minimizing the cost of

this part of the circuit. The critical load parameters in

choosing the output capacitors are the maximum size of the

load step, ΔI; the load-current slew rate, di/dt; and the

maximum allowable output-voltage deviation under transient

loading, ΔV

. Capacitors are characterized according to

2NCV

O

MAX

(EQ. 38)

L ≤ --------------------- ΔV

– ΔI(ESR)

MAX

2

their capacitance, ESR, and ESL (equivalent series

inductance).

(

)

ΔI

(EQ. 39)

(

)

1.25 NC

⎛

⎝

⎞

– V

O

L ≤ ------------------------- ΔV

– ΔI(ESR)

V

At the beginning of the load transient, the output capacitors

supply all of the transient current. The output voltage will

initially deviate by an amount approximated by the voltage

drop across the ESL. As the load current increases, the

voltage drop across the ESR increases linearly until the load

current reaches its final value. The capacitors selected must

have sufficiently low ESL and ESR so that the total output-

voltage deviation is less than the allowable maximum.

Neglecting the contribution of inductor current and regulator

response, the output voltage initially deviates by an amount:

MAX

IN

2

⎠

(

ΔI

Input Supply Voltage Selection

The VCC input of the ISL6326B can be connected either

directly to a +5V supply or through a current limiting resistor

to a +12V supply. An integrated 5.8V shunt regulator

maintains the voltage on the VCC pin when a +12V supply is

used. A 300Ω resistor is suggested for limiting the current

into the VCC pin to a worst-case maximum of approximately

25mA.

di

(EQ. 36)

ΔV ≈ (ESL) ---- + (ESR) ΔI

Switching Frequency Selection

dt

There are a number of variables to consider when choosing

the switching frequency, as there are considerable effects on

the upper-MOSFET loss calculation. These effects are

outlined in MOSFETs, and they establish the upper limit for

the switching frequency. The lower limit is established by the

requirement for fast transient response and small output-

The filter capacitor must have sufficiently low ESL and ESR

so that ΔV < ΔV

.

MAX

Most capacitor solutions rely on a mixture of high-frequency

capacitors with relatively low capacitance in combination

FN9286.0

April 21, 2006

27

ISL6326B

voltage ripple as outlined in Output Filter Design. Choose the

lowest switching frequency that allows the regulator to meet

the transient-response requirements.

support the RMS current calculated. The voltage rating of

the capacitors should also be at least 1.25 times greater

than the maximum input voltage.

Figures 18 and 19 provide the same input RMS current

information for three and four phase designs respectively.

Use the same approach to selecting the bulk capacitor type

and number as described above.

Input Capacitor Selection

The input capacitors are responsible for sourcing the AC

component of the input current flowing into the upper

MOSFETs. Their RMS current capacity must be sufficient to

handle the AC component of the current drawn by the upper

MOSFETs which is related to duty cycle and the number of

active phases.

Low capacitance, high-frequency ceramic capacitors are

needed in addition to the bulk capacitors to suppress leading

and falling edge voltage spikes. The result from the high

current slew rates produced by the upper MOSFETs turn on

and off. Select low ESL ceramic capacitors and place one as

close as possible to each upper MOSFET drain to minimize

board parasitic impedances and maximize suppression.

0.3

0.2

0.1

0.3

I

= 0

= 0.25 I

I

= 0.5 I

O

L,PP

= 0.75 I

O

0.2

0.1

0

I

= 0

L,PP

= 0.5 I

O

= 0.75 I

O

0

0.2

0.4

0.6

0.8

1.0

DUTY CYCLE (V /V

)

IN

O

FIGURE 17. NORMALIZED INPUT-CAPACITOR RMS CURRENT

vs DUTY CYCLE FOR 2-PHASE CONVERTER

0

0.2

0.4

0.6

0.8

1.0

DUTY CYCLE (V

V

)

O/ IN

0.3

I

= 0

I

= 0.5 I

O

L,PP

FIGURE 19. NORMALIZED INPUT-CAPACITOR RMS CURRENT

vs DUTY CYCLE FOR 4-PHASE CONVERTER

= 0.25 I

= 0.75 I

O

L,PP

O

L,PP

MULTIPHASE RMS IMPROVEMENT

0.2

0.1

0

Figure 20 is provided as a reference to demonstrate the

dramatic reductions in input-capacitor RMS current upon the

implementation of the multiphase topology. For example,

compare the input RMS current requirements of a two-phase

converter versus that of a single phase. Assume both

converters have a duty cycle of 0.25, maximum sustained

output current of 40A, and a ratio of I

to I of 0.5. The

L,PP

O

single phase converter would require 17.3Arms current

capacity while the two-phase converter would only require

10.9Arms. The advantages become even more pronounced

when output current is increased and additional phases are

added to keep the component cost down relative to the

single phase approach.

0

0.2

0.4

0.6

0.8

1.0

DUTY CYCLE (V

V

)

O/ IN

FIGURE 18. NORMALIZED INPUT-CAPACITOR RMS CURRENT

vs DUTY CYCLE FOR 3-PHASE CONVERTER

For a two phase design, use Figure 17 to determine the

input-capacitor RMS current requirement given the duty

cycle, maximum sustained output current (I ), and the ratio

O

of the per-phase peak-to-peak inductor current (I

) to I .

L,PP

O

Select a bulk capacitor with a ripple current rating which will

minimize the total number of input capacitors required to

FN9286.0

April 21, 2006

28

ISL6326B

0.6

0.4

0.2

0

I

= 0

= 0.5 I

= 0.75 I

L,PP

O

0

0.2

0.4

0.6

0.8

1.0

DUTY CYCLE (V

V

)

O/ IN

FIGURE 20. NORMALIZED INPUT-CAPACITOR RMS

CURRENT vs DUTY CYCLE FOR SINGLE-PHASE

CONVERTER

Layout Considerations

The following layout strategies are intended to minimize the

impact of board parasitic impedances on converter

performance and to optimize the heat-dissipating capabilities

of the printed-circuit board. These sections highlight some

important practices which should not be overlooked during the

layout process.

Component Placement

Within the allotted implementation area, orient the switching

components first. The switching components are the most

critical because they carry large amounts of energy and tend

to generate high levels of noise. Switching component

placement should take into account power dissipation. Align

the output inductors and MOSFETs such that space between

the components is minimized while creating the PHASE

plane. Place the Intersil MOSFET driver IC as close as

possible to the MOSFETs they control to reduce the parasitic

impedances due to trace length between critical driver input

and output signals. If possible, duplicate the same

placement of these components for each phase.

Next, place the input and output capacitors. Position one

high-frequency ceramic input capacitor next to each upper

MOSFET drain. Place the bulk input capacitors as close to

the upper MOSFET drains as dictated by the component

size and dimensions. Long distances between input

capacitors and MOSFET drains result in too much trace

inductance and a reduction in capacitor performance. Locate

the output capacitors between the inductors and the load,

while keeping them in close proximity to the microprocessor

socket.

FN9286.0

April 21, 2006

29

ISL6326B

Quad Flat No-Lead Plastic Package (QFN)

Micro Lead Frame Plastic Package (MLFP)

L40.6x6

40 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE

(COMPLIANT TO JEDEC MO-220VJJD-2 ISSUE C)

2X

0.15

C A

D

MILLIMETERS

A

9

SYMBOL

MIN

NOMINAL

MAX

1.00

0.05

1.00

NOTES

D/2

A

A1

A2

A3

b

0.80

0.90

-

D1

-

D1/2

2X

-

9

N

0.15 C

B

6

0.20 REF

9

INDEX

AREA

1

2

3

E1/2

E/2

9

0.18

3.95

0.23

0.30

4.25

5, 8

E1

D

6.00 BSC

-

E

B

D1

D2

E

5.75 BSC

9

2X

4.10

7, 8

0.15 C

B

6.00 BSC

-

2X

TOP VIEW

0.15 C

A

E1

E2

e

5.75 BSC

9

4.10

7, 8

0

A2

4X

C

A

/ /

0.10 C

0.08 C

0.50 BSC

-

k

0.25

0.30

-

0.40

-

L

0.50

0.15

8

SEATING PLANE

A1

A3

SIDE VIEW

9

L1

N

10

5

NX b

40

10

-

2

0.10 M C A B

4X P

Nd

Ne

P

3

D2

8

7

3

NX k

(DATUM B)

-

0.60

12

9

2

N

θ

-

9

4X P

1

Rev. 1 10/02

(DATUM A)

2

3

(Ne-1)Xe

REF.

NOTES:

E2

6

1. Dimensioning and tolerancing conform to ASME Y14.5-1994.

2. N is the number of terminals.

INDEX

AREA

7

8

E2/2

NX L

8

3. Nd and Ne refer to the number of terminals on each D and E.

4. All dimensions are in millimeters. Angles are in degrees.

N

e

9

(Nd-1)Xe

REF.

CORNER

OPTION 4X

5. Dimension b applies to the metallized terminal and is measured

between 0.15mm and 0.30mm from the terminal tip.

BOTTOM VIEW

6. The configuration of the pin #1 identifier is optional, but must be

located within the zone indicated. The pin #1 identifier may be

either a mold or mark feature.

A1

NX b

5

7. Dimensions D2 and E2 are for the exposed pads which provide

improved electrical and thermal performance.

SECTION "C-C"

C

L

8. Nominal dimensionsare provided toassistwith PCBLandPattern

Design efforts, see Intersil Technical Brief TB389.

C

L

9. Features and dimensions A2, A3, D1, E1, P & θ are present when

Anvil singulation method is used and not present for saw

singulation.

L

10

L1

10. Depending on the method of lead termination at the edge of the

package, a maximum 0.15mm pull back (L1) maybe present. L

minus L1 to be equal to or greater than 0.3mm.

e

C

TERMINAL TIP

FOR ODD TERMINAL/SIDE

FOR EVEN TERMINAL/SIDE

All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.

Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without

notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and

reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result

from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see www.intersil.com

FN9286.0

April 21, 2006

30


型号：	ISL6326B
厂家：	Intersil
描述：	4-Phase PWM Controller with 8-Bit DAC Code Capable of Precision DCR Differential Current Sensing 4相PWM控制器，带有8位DAC代码，能够高精度差分DCR电流检测的控制器
文件：	总30页 (文件大小：549K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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