ISL6754 [INTERSIL]
ZVS Full-Bridge PWM Controller with Adjustable Synchronous Rectifier Control; ZVS全桥PWM控制器,可调节同步整流控制型号: | ISL6754 |
厂家: | Intersil |
描述: | ZVS Full-Bridge PWM Controller with Adjustable Synchronous Rectifier Control |
文件: | 总19页 (文件大小:534K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ISL6754
¬
Data Sheet
September 29, 2008
FN6754.1
ZVS Full-Bridge PWM Controller with
Features
Adjustable Synchronous Rectifier Control
• Adjustable Resonant Delay for ZVS Operation
The ISL6754 is a high-performance extension of the Intersil
family of zero-voltage switching (ZVS) full-bridge PWM
controllers. Like the ISL6752, it achieves ZVS operation by
driving the upper bridge FETs at a fixed 50% duty cycle while
the lower bridge FETs are trailing-edge modulated with
adjustable resonant switching delays.
• Synchronous Rectifier Control Outputs with Adjustable
Delay/Advance
• Voltage- or Current-Mode Control
• 3% Current Limit Threshold
• Adjustable Average Current Limit
• Adjustable Deadtime Control
• 175µA Start-up Current
Adding to the ISL6752’s feature set are average current
monitoring and soft-start. The average current signal may be
used for average current limiting, current sharing circuits and
average current mode control. Additionally, the ISL6754
supports both voltage- and current-mode control.
• Supply UVLO
• Adjustable Oscillator Frequency Up to 2MHz
• Internal Over-Temperature Protection
• Buffered Oscillator Sawtooth Output
• Fast Current Sense to Output Delay
• Adjustable Cycle-by-Cycle Peak Current Limit
• 70ns Leading Edge Blanking
• Multi-Pulse Suppression
The ISL6754 features complemented PWM outputs for
synchronous rectifier (SR) control. The complemented
outputs may be dynamically advanced or delayed relative to
the PWM outputs using an external control voltage.
This advanced BiCMOS design features precision deadtime
and resonant delay control, and an oscillator adjustable to
2MHz operating frequency. Additionally, Multi-Pulse
Suppression ensures alternating output pulses at low duty
cycles where pulse skipping may occur.
• Pb-Free (RoHS Compliant)
Ordering Information
Applications
PART
NUMBER
(Note)
TEMP.
RANGE
(°C)
PART
MARKING
PACKAGE
(Pb-free)
PKG.
DWG. #
• ZVS Full-Bridge Converters
• Telecom and Datacom Power
• Wireless Base Station Power
• File Server Power
ISL6754AAZA* 6754 AAZ
-40 to +105 20 Ld QSOP M20.15
*Add -T suffix to part number for tape and reel packaging.
NOTE: These Intersil Pb-free plastic packaged products employ
special Pb-free material sets, molding compounds/die attach
materials, and 100% matte tin plate plus anneal (e3 termination
finish, which is RoHS compliant and compatible with both SnPb and
Pb-free soldering operations). Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed
the Pb-free requirements of IPC/JEDEC J STD-020.
• Industrial Power Systems
Pinout
ISL6754
(20 LD QSOP)
TOP VIEW
VREF
1
2
20
SS
19 VADJ
VERR
CTBUF
RTD
3
18
17
16
15
14
13
VDD
4
OUTLL
OUTLR
OUTUL
OUTUR
OUTLLN
5
RESDEL
CT
6
FB
7
RAMP
CS
8
9
12 OUTLRN
11 GND
10
IOUT
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2008. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
Functional Block Diagram
VDD
OUTUL
OUTUR
50%
VDD
DELAY/
ADVANCE
TIMING
VREF
PWM
STEERING
LOGIC
UVLO
OUTLL
OUTLR
CONTROL
OVER-
PWM
TEMPERATURE
PROTECTION
OUTLLN
OUTLRN
GND
VREF
SAMPLE
AND
HOLD
VADJ
CS
RESDEL
+
-
4X
IOUT
+70 nS
LEADING
EDGE
1.00V
OVER CURRENT
COMPARATOR
BLANKING
OSCILLATOR
CT
VREF
RTD
RAMP
VREF
PWM
COMPARATOR
80mV
1 mA
CTBUF
SS
+
-
0.33
VERR
FB
+
0.6V
SOFTSTART
CONTROL
-
Typical Application - High Voltage Input Primary Side Control ZVS Full-Bridge Converter
VIN+
CR2
CR3
T3
Q2
Q5A
Q5B
R15
R16
Q8A
Q8B
Q1
C3
C2
+
T1
C1
R18
C14
400 VDC
+ Vout
L1
Q12
C4
Q10A
Q10B
Q9A
Q9B
C16
C15
+
Q13
R17
RETURN
C13
Q3
Q7A
Q7B
Q6A
Q6B
Q4
VIN-
R20
R19
R13
R7
R8
R23
1
2
VREF
20
T2
SS
CR1
R6
VADJ 19
VERR
CTBUF
RTD
3
18
17
16
15
14
13
VDD
C17
EL7212
C12
4
OUTLL
T4
EL7212
5
RESDEL OUTLR
R21
R22
CR4
6
CT
OUTUL
OUTUR
OUTLLN
U4
7
FB
R5
R4
U5
8
RAMP
9
CS
OUTLRN 12
GND 11
C18
R1
R24
10
IOUT
R11
U1
R12
C9
U3
TL431
VDD
BIAS
U2
C11
C10
R25
C5
C6
C7
C8
R14
R2
R3
R9
R10
Typical Application - High Voltage Input Secondary Side Control ZVS Full-Bridge Converter
VIN+
T3
Q1
Q2
1:1:1
Q6
Q5
CR2
T1
R17
CR3
R18
Np:Ns:Ns=9:2:2
Ns
R20
C14
Np
+ Vout
L1
Q16
C12
Ns
Q10A
Q10B
Q9A
Q9B
C15
+
+
400 VDC
C1
R19
C13
Q15
T4
1:1:1
Q4
Q3
CR5
CR4
Q8A
Q8B
R15
Q7A
Q7B
RETURN
R16
C10
C11
C9
Q11A
Q12A
Q12B
Q11B
Q13A
Q13B
VIN-
VREF
U1
R11
R10
1
2
VREF
20
T2
SS
CR1
R12
VADJ 19
R23
VERR
CTBUF
RTD
3
18
17
16
15
14
13
VDD
OUTLL
4
5
RESDEL OUTLR
6
CT
OUTUL
OUTUR
OUTLLN
7
FB
R4
C16
R1
8
RAMP
CS
Q14A
Q14B
VREF
9
OUTLRN 12
GND 11
R5
10
IOUT
R9
C17
R24
C6
R14
R8
R7
CR6
U3
SECONDARY
BIAS SUPPLY
-
R22
R21
+
C2
R25
R6
C7
C8
R13
C4
C3
C5
R2
R3
C18
ISL6754
Absolute Maximum Ratings
Thermal Information
Supply Voltage, V
OUTxxx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to V
Signal Pins. . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to V
. . . . . . . . . . . . . . . . . . . GND - 0.3V to +22.0V
Thermal Resistance Junction to Ambient (Typical)
20 Lead QSOP (Note 1). . . . . . . . . . . . . . . . . . . . . .
Maximum Junction Temperature . . . . . . . . . . . . . . .-55°C to +150°C
Maximum Storage Temperature Range. . . . . . . . . .-65°C to +150°C
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
θ
(°C/W)
88
DD
JA
DD
+ 0.3V
REF
V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to 6.0V
REF
Peak GATE Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.1A
Latchup (Note 3) . . . . . . . . . . . . . . . . . . . Class II, Level B @ +85°C
Operating Conditions
Temperature Range
ISL6754AAxx . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +105°C
Supply Voltage Range (Typical). . . . . . . . . . . . . . . .9VDC to 16VDC
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1. θ is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
JA
2. All voltages are with respect to GND.
3. Jedec Class II pulse conditions and failure criterion used. Level B exceptions are using a pulse limited to 50mA.
Electrical Specifications Recommended operating conditions unless otherwise noted. Refer to “Functional Block Diagram” on page 2
and “Typical Application schematics” beginning on page 3. 9V < V
< 20V, RTD = 10.0kΩ, CT = 470pF,
DD
= -40°C to +105°C, Typical values are at T = +25°C; Parameters with MIN and/or MAX limits are 100%
T
A
A
tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not
production tested.
PARAMETER
SUPPLY VOLTAGE
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage
-
-
20
400
15.5
9.00
7.50
-
V
µA
mA
V
Start-Up Current, I
V
= 5.0V
DD
-
-
175
11.0
8.75
7.00
1.75
DD
Operating Current, I
R
, C = 0
LOAD OUT
DD
UVLO START Threshold
UVLO STOP Threshold
Hysteresis
8.00
6.50
-
V
V
REFERENCE VOLTAGE
Overall Accuracy
I
= 0mA to 10mA
4.850
-
5.000
5.150
V
VREF
Long Term Stability
T
= +125°C, 1000 hours (Note 4)
3
-
-
mV
mA
mA
mA
A
Operational Current (source)
Operational Current (sink)
Current Limit
-10
5
-
-
-
V
= 4.85V
-15
-
-100
REF
CURRENT SENSE
Current Limit Threshold
CS to OUT Delay
VERR = V
Excl. LEB
0.97
1.00
1.03
-
V
ns
ns
ns
Ω
REF
-
35
Leading Edge Blanking (LEB) Duration
CS to OUT Delay + LEB
CS Sink Current Device Impedance
Input Bias Current
-
-
70
-
T
= +25°C
-
150
20
1.0
4.15
-
A
V
V
= 1.1V
= 0.3V
-
-
CS
CS
-1.0
3.85
3.9
-
-
µA
V/V
V
I
I
I
Sample and Hold Buffer Amplifier Gain
Sample and Hold VOH
T
= +25°C
4.00
OUT
OUT
OUT
A
V
V
= max, I
= -300μA
-
-
CS
CS
LOAD
Sample and Hold VOL
= 0.00V, I
= 10μA
0.3
V
LOAD
FN6754.1
September 29, 2008
5
ISL6754
Electrical Specifications Recommended operating conditions unless otherwise noted. Refer to “Functional Block Diagram” on page 2
and “Typical Application schematics” beginning on page 3. 9V < V
< 20V, RTD = 10.0kΩ, CT = 470pF,
DD
= -40°C to +105°C, Typical values are at T = +25°C; Parameters with MIN and/or MAX limits are 100%
T
A
A
tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not
production tested. (Continued)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
RAMP
RAMP Sink Current Device Impedance
RAMP to PWM Comparator Offset
Bias Current
V
= 1.1V
-
-
80
-
20
95
Ω
RAMP
T
= +25°C
65
mV
μA
A
V
= 0.3V
-5.0
-2.0
RAMP
PULSE WIDTH MODULATOR
Minimum Duty Cycle
VERR < 0.6V
-
-
94
97
99
-
0
-
%
%
%
%
V
Maximum Duty Cycle (per half-cycle)
VERR = 4.20V, V
= 0V (Note 5)
-
-
CS
RTD = 2.00kΩ, CT = 220pF
RTD = 2.00kΩ, CT = 470pF
-
-
-
Zero Duty Cycle VERR Voltage
VERR to PWM Comparator Input Offset
VERR to PWM Comparator Input Gain
Common Mode (CM) Input Range
ERROR AMPLIFIER
0.85
0.7
0.31
0
1.20
0.9
0.35
4.45
T
= +25°C
0.8
0.33
-
V
A
V/V
V
(Note 4)
Input Common Mode (CM) Range
GBWP
(Note 4)
(Note 4)
0
5
-
V
V
MHz
V
REF
-
-
-
VERR VOL
I
I
= 2mA
= 0mA
-
0.4
-
LOAD
LOAD
VERR VOH
4.20
0.8
-
V
VERR Pull-Up Current Source
EA Reference
VERR = 2.5V
= +25°C
1.0
0.600
0.600
1.3
mA
V
T
0.594
0.590
0.606
0.612
A
EA Reference + EA Input Offset Voltage
OSCILLATOR
V
Frequency Accuracy, Overall
(Note 4)
165
-10
-
183
-
201
10
kHz
%
Frequency Variation with V
Temperature Stability
T
= +25°C, (F
- - F
)/F
10V 10V
0.3
4.5
1.5
-200
20
1.7
%
DD
A
20V
V
= 10V, |F
- F
|/F
-
-
%
DD
-40°C
0°C 0°C
|F
- F
|/F
(Note 4)
-
-
%
0°C
= +25°C
105°C 25°C
Charge Current
T
-193
19
-207
23
µA
µA/µA
V
A
Discharge Current Gain
CT Valley Voltage
CT Peak Voltage
CT Pk-Pk Voltage
RTD Voltage
Static Threshold
Static Threshold
Static Value
0.75
2.75
1.92
1.97
0
0.80
2.80
2.00
2.00
-
0.88
2.88
2.05
2.03
2.00
2.05
0.44
0.10
0.10
V
V
V
RESDEL Voltage Range
V
CTBUF Gain (V
/V
)
V
V
= 0.8V, 2.6V
= 0.8V
1.95
0.34
-
2.0
0.40
-
V/V
V
CTBUFP-P CTP-P
CT
CT
CTBUF Offset from GND
CTBUF VOH
ΔV(I
ΔV(I
= 0mA, I
LOAD
= -2mA), V = 2.6V
CT
V
LOAD
LOAD
CTBUF VOL
= 2mA, I
LOAD
= 0mA), V = 0.8V
CT
-
-
V
FN6754.1
September 29, 2008
6
ISL6754
Electrical Specifications Recommended operating conditions unless otherwise noted. Refer to “Functional Block Diagram” on page 2
and “Typical Application schematics” beginning on page 3. 9V < V
< 20V, RTD = 10.0kΩ, CT = 470pF,
DD
= -40°C to +105°C, Typical values are at T = +25°C; Parameters with MIN and/or MAX limits are 100%
T
A
A
tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not
production tested. (Continued)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
SOFT-START
Charging Current
SS = 3V
SS = 2V
-60
4.410
10
-70
4.500
-
-80
4.590
-
μA
V
SS Clamp Voltage
SS Discharge Current
Reset Threshold Voltage
OUTPUT
mA
V
T
= +25°C
0.23
0.27
0.33
A
High Level Output Voltage (VOH)
Low Level Output Voltage (VOL)
Rise Time
I
I
= -10mA, V
- VOH
-
0.5
1.0
1.0
V
V
OUT
OUT
DD
= 10mA, VOL - GND
-
0.5
C
C
= 220pF, V
= 220pF, V
= 15V (Note 4)
= 15V (Note 4)
-
110
200
150
1.25
-
ns
ns
V
OUT
OUT
DD
DD
Fall Time
-
90
-
UVLO Output Voltage Clamp
V
= 7V, I
LOAD
= 1mA (Note 6)
-
-
DD
Output Delay/Advance Range
V
= 2.50V
2
-
ns
ns
ns
V
ADJ
OUTLLN/OUTLRN relative to OUTLL/OUTLR
V
< 2.425V
> 2.575V
-40
40
-300
300
5.000
2.425
ADJ
V
-
ADJ
Delay/Advance Control Voltage Range
OUTLxN Delayed
2.575
0
-
OUTLLN/OUTLRN relative to OUTLL/OUTLR
OUTLxN Advanced
T = +25°C (OUTLx Delayed) (Note 7)
A
-
V
V
Delay Time
ADJ
V
= 0
-
-
-
-
-
300
105
70
-
-
-
-
-
ns
ns
ns
ns
ns
ADJ
V
= 0.5V
= 1.0V
= 1.5V
= 2.0V
ADJ
V
ADJ
V
55
ADJ
V
50
ADJ
T
= +25°C (OUTLxN Delayed)
A
V
= V
= V
= V
= V
= V
-
-
-
-
-
300
100
68
-
-
-
-
-
ns
ns
ns
ns
ns
ADJ
REF
REF
REF
REF
REF
V
- 0.5V
- 1.0V
- 1.5V
- 2.0V
ADJ
V
ADJ
V
55
ADJ
V
48
ADJ
THERMAL PROTECTION
Thermal Shutdown
(Note 4)
(Note 4)
(Note 4)
-
-
-
140
125
15
-
-
-
°C
°C
°C
Thermal Shutdown Clear
Hysteresis, Internal Protection
NOTES:
4. Limits established by characterization and are not production tested.
5. This is the maximum duty cycle achievable using the specified values of RTD and CT. Larger or smaller maximum duty cycles may be obtained
using other values for these components. See Equations 1 through 3.
6. Adjust V
below the UVLO stop threshold prior to setting at 7V.
DD
7. When OUTLx is delayed relative to OUTLxN (V
< 2.425V), the delay duration as set by V
ADJ
should not exceed 90% of the CT discharge
ADJ
time (deadtime) as determined by CT and RTD.
FN6754.1
September 29, 2008
7
ISL6754
Typical Performance Curves
25
24
23
22
21
20
19
18
1.02
1.01
1
0.99
0.98
-40 -25 -10
5
20
35
50 65
80 95 110
0
200
400
600
800
1000
TEMPERATURE (¬¨Ð
RTD CURRENT (¬¨¬
FIGURE 1. REFERENCE VOLTAGE vs TEMPERATURE
FIGURE 2. CT DISCHARGE CURRENT GAIN vs RTD CURRENT
3
1-10
4
1-10
CT = 1000pF
CT = 680pF
CT = 470pF
3
1-10
RTD = 10kΩ
100
CT = 100pF
CT = 220pF
RTD = 50kΩ
RTD = 100kΩ
CT = 330pF
100
10
10
0
10 20 30 40 50 60 70 80 90 100
0.1
1
10
RTD (kΩ)
CT (nF)
FIGURE 3. DEADTIME (DT) vs CAPACITANCE
FIGURE 4. CAPACITANCE vs FREQUENCY
magnitude of the current that discharges CT. The CT
Pin Descriptions
discharge current is nominally 20x the resistor current. The
PWM deadtime is determined by the timing capacitor
discharge duration. The voltage at RTD is nominally 2.00V.
VDD - VDD is the power connection for the IC. To optimize
noise immunity, bypass VDD to GND with a ceramic
capacitor as close to the VDD and GND pins as possible.
CS - This is the input to the overcurrent comparator. The
overcurrent comparator threshold is set at 1.00 V nominal.
The CS pin is shorted to GND at the termination of either
PWM output.
VDD is monitored for supply voltage undervoltage lock-out
(UVLO). The start and stop thresholds track each other
resulting in relatively constant hysteresis.
GND - Signal and power ground connections for this device.
Due to high peak currents and high frequency operation, a
low impedance layout is necessary. Ground planes and
short traces are highly recommended.
Depending on the current sensing source impedance, a
series input resistor may be required due to the delay
between the internal clock and the external power switch.
This delay may result in CS being discharged prior to the
power switching device being turned off.
VREF - The 5.00V reference voltage output having 3%
tolerance over line, load and operating temperature. Bypass
to GND with a 0.1μF to 2.2μF low ESR capacitor.
RAMP - This is the input for the sawtooth waveform for the
PWM comparator. The RAMP pin is shorted to GND at the
termination of the PWM signal. A sawtooth voltage
waveform is required at this input. For current-mode control
this pin is connected to CS and the current loop feedback
signal is applied to both inputs. For voltage-mode control,
the oscillator sawtooth waveform may be buffered and used
to generate an appropriate signal, RAMP may be connected
to the input voltage through a RC network for voltage feed
forward control, or RAMP may be connected to VREF
CT - The oscillator timing capacitor is connected between
this pin and GND. It is charged through an internal 200μA
current source and discharged with a user adjustable current
source controlled by RTD.
RTD - This is the oscillator timing capacitor discharge
current control pin. The current flowing in a resistor
connected between this pin and GND determines the
FN6754.1
September 29, 2008
8
ISL6754
through a RC network to produce the desired sawtooth
waveform.
control range. This behavior provides the user increased
accuracy when selecting a shorter delay/advance duration.
OUTUL and OUTUR - These outputs control the upper
bridge FETs and operate at a fixed 50% duty cycle in
alternate sequence. OUTUL controls the upper left FET and
OUTUR controls the upper right FET. The left and right
designation may be switched as long as they are switched in
conjunction with the lower FET outputs, OUTLL and OUTLR.
When the PWM outputs are delayed relative to the SR
outputs (VADJ < 2.425V), the delay time should not exceed
90% of the deadtime as determined by RTD and CT.
VERR - The control voltage input to the inverting input of the
PWM comparator. The output of an external error amplifier
(EA) is applied to this input, either directly or through an
opto-coupler, for closed loop regulation. VERR has a
nominal 1mA pull-up current source.
RESDEL - Sets the resonant delay period between the
toggle of the upper FETs and the turn on of either of the
lower FETs. The voltage applied to RESDEL determines
when the upper FETs switch relative to a lower FET turning
on. Varying the control voltage from 0 to 2.00V increases the
resonant delay duration from 0 to 100% of the deadtime. The
control voltage divided by 2 represents the percent of the
deadtime equal to the resonant delay. In practice the
maximum resonant delay must be set lower than 2.00V to
ensure that the lower FETs, at maximum duty cycle, are OFF
prior to the switching of the upper FETs.
When VERR is driven by an opto-coupler or other current
source device, a pull-up resistor from VREF is required to
linearize the gain. Generally, a pull-up resistor on the order
of 5kΩ is acceptable.
FB - FB is the inverting inputs to the error amplifier (EA). The
amplifier may be used as the error amplifier for voltage
feedback or used as the average current limit amplifier (IEA).
If the amplifier is not used, FB should be grounded.
OUTLL and OUTLR - These outputs control the lower
bridge FETs, are pulse width modulated, and operate in
alternate sequence. OUTLL controls the lower left FET and
OUTLR controls the lower right FET. The left and right
designation may be switched as long as they are switched in
conjunction with the upper FET outputs, OUTUL and
OUTUR.
IOUT - Output of the 4X buffer amplifier of the sample and
hold circuitry that captures and averages the CS signal.
SS - Connect the soft-start timing capacitor between this pin
and GND to control the duration of soft-start. The value of
the capacitor and the internal current source determine the
rate of increase of the duty cycle during start-up.
SS may also be used to inhibit the outputs by grounding
through a small transistor in an open collector/drain
configuration.
OUTLLN and OUTLRN - These outputs are the
complements of the PWM (lower) bridge FETs. OUTLLN is
the complement of OUTLL and OUTLRN is the complement
of OUTLR. These outputs are suitable for control of
synchronous rectifiers. The phase relationship between
each output and its complement is controlled by the voltage
applied to VADJ.
CTBUF - CTBUF is the buffered output of the sawtooth
oscillator waveform present on CT and is capable of
sourcing 2mA. It is offset from ground by 0.40V and has a
nominal valley-to-peak gain of 2. It may be used for slope
compensation.
VADJ - A 0V to 5V control voltage applied to this input sets
the relative delay or advance between OUTLL/OUTLR and
OUTLLN/OUTLRN. The phase relationship between
OUTUL/OUTUR and OUTLL/OUTLR is maintained
regardless of the phase adjustment between OUTLL/OUTLR
and OUTLLN/OUTLRN.
Functional Description
Features
The ISL6754 PWM is an excellent choice for low cost ZVS
full-bridge applications requiring adjustable synchronous
rectifier drive. With its many protection and control features,
a highly flexible design with minimal external components is
possible. Among its many features are a very accurate
overcurrent limit threshold, thermal protection, a buffered
sawtooth oscillator output suitable for slope compensation,
synchronous rectifier outputs with variable delay/advance
timing, and adjustable frequency.
Voltages below 2.425V result in OUTLLN/OUTLRN being
advanced relative to OUTLL/OUTLR. Voltages above
2.575V result in OUTLLN/OUTLRN being delayed relative to
OUTLL/OUTLR. A voltage of 2.50V ±75mV results in zero
phase difference. A weak internal 50% divider from VREF
results in no phase delay if this input is left floating.
The range of phase delay/advance is either zero or 40 to
300ns with the phase differential increasing as the voltage
deviation from 2.5V increases. The relationship between the
control voltage and phase differential is non-linear. The gain
(Δt/ΔV) is low for control voltages near 2.5V and rapidly
increases as the voltage approaches the extremes of the
If synchronous rectification is not required, please consider
the ISL6755 controller.
Oscillator
The ISL6754 has an oscillator with a programmable
frequency range to 2MHz, which can be programmed with a
resistor and capacitor.
FN6754.1
September 29, 2008
9
ISL6754
The switching period is the sum of the timing capacitor
charge and discharge durations. The charge duration is
determined by CT and a fixed 200µA internal current source.
The discharge duration is determined by RTD and CT.
operation. The DC blocking capacitors used in voltage-mode
bridge topologies become unbalanced, as does the flux in
the transformer core. Average current limit will prevent the
instability and allow continuous operation in current limit
provided the control loop is designed with adequate
bandwidth.
3
T
≈ 11.5 ⋅ 10 ⋅ CT
S
(EQ. 1)
C
D
The propagation delay from CS exceeding the current limit
threshold to the termination of the output pulse is increased
by the leading edge blanking (LEB) interval. The effective
delay is the sum of the two delays and is nominally 105ns.
–9
(EQ. 2)
T
≈ (0.06 ⋅ RTD ⋅ CT) + 50 ⋅ 10
S
1
------------
T
= T + T =
D
S
(EQ. 3)
The current sense signal applied to the CS pin connects to
the peak current comparator and a sample and hold
SW
C
F
SW
averaging circuit. After a 70ns leading edge blanking (LEB)
delay, the current sense signal is actively sampled during the
on time, the average current for the cycle is determined, and
where T and T are the charge and discharge times,
C
D
respectively, CT is the timing capacitor in Farads, RTD is the
discharge programming resistance in ohms, T is the
SW
is the oscillator frequency. One
the result is amplified by 4x and output on the I
pin. If an
OUT
oscillator period, and F
SW
RC filter is placed on the CS input, its time constant should
not exceed ~50ns or significant error may be introduced on
output switching cycle requires two oscillator cycles. The
actual times will be slightly longer than calculated due to
internal propagation delays of approximately 10ns/transition.
This delay adds directly to the switching duration, but also
causes overshoot of the timing capacitor peak and valley
voltage thresholds, effectively increasing the peak-to-peak
voltage on the timing capacitor. Additionally, if very small
discharge currents are used, there will be increased error
due to the input impedance at the CT pin. The maximum
recommended current through RTD is 1mA, which produces
a CT discharge current of 20mA.
I
.
OUT
The maximum duty cycle, D, and percent deadtime, DT, can
be calculated from:
T
C
(EQ. 4)
------------
D =
T
SW
DT = 1 – D
(EQ. 5)
CHANNEL 1 (YELLOW): OUTLL
CHANNEL 3 (BLUE): CS
CHANNEL 2 (RED): OUTLR
CHANNEL 4 (GREEN): IOUT
Overcurrent Operation
FIGURE 5. CS INPUT vs I
OUT
Two overcurrent protection mechanisms are available to the
power supply designer. The first method is cycle-by-cycle
peak overcurrent protection which provides fast response.
The cycle-by-cycle peak current limit results in pulse-by-pulse
duty cycle reduction when the current feedback signal
Figure 5 shows the relationship between the CS signal and
under steady state conditions. I is 4x the average
of CS. Figure 6 shows the dynamic behavior of the current
averaging circuitry when CS is modulated by an external
I
OUT
OUT
sine wave. Notice I
is updated by the sample and hold
exceeds 1.0V. When the peak current exceeds the threshold,
the active output pulse is immediately terminated. This results
in a decrease in output voltage as the load current increases
beyond the current limit threshold. The ISL6754 operates
continuously in an overcurrent condition without shutdown.
OUT
circuitry at the termination of the active output pulse.
The second method is a slower, averaging method which
produces constant or “brick-wall” current limit behavior. If
voltage-mode control is used, the average overcurrent
protection also maintains flux balance in the transformer by
maintaining duty cycle symmetry between half-cycles. If
voltage-mode control is used in a bridge topology, it should
be noted that peak current limit results in inherently unstable
FN6754.1
September 29, 2008
10
ISL6754
The EA available on the ISL6754 may also be used as the
voltage EA for the voltage feedback control loop rather than
the current EA as described above. An external op-amp may
be used as either the current or voltage EA providing the
circuit is not allowed to source current into VERR. The
external EA must only sink current, which may be
accomplished by adding a diode in series with its output.
The 4x gain of the sample and hold buffer allows a range of
150 - 1000mV peak on the CS signal, depending on the
resistor divider placed on I
. The overall bandwidth of the
OUT
average current loop is determined by the integrating current
EA compensation and the divider on I
.
OUT
1
CHANNEL 1 (YELLOW): OUTLL
CHANNEL 3 (BLUE): CS
CHANNEL 2 (RED): OUTLR
CHANNEL 4 (GREEN): IOUT
2
3
VERR
ISL6754
FIGURE 6. DYNAMIC BEHAVIOR OF CS vs I
4
OUT
5
The average current signal on I
remains accurate
OUT
C10
6
provided the output inductor current remains continuous
(CCM operation). Once the inductor current becomes
-
7
FB
0.6V
+
discontinuous (DCM operation), I
represents 1/2 the
OUT
8
peak inductor current rather than the average current. This
occurs because the sample and hold circuitry is active only
during the on time of the switching cycle. It is unable to
detect when the inductor current reaches zero during the off
time.
150 - 1000 mV
S&H
4x
9
CS
10
IOUT
R6
R5
R4
If average overcurrent limit is desired, I
may be used
with the error amplifier of the ISL6754. Typically I is
OUT
OUT
divided down and filtered as required to achieve the desired
amplitude. The resulting signal is input to the current error
amplifier (IEA). The IEA is similar to the voltage EA found in
most PWM controllers, except it cannot source current.
Instead, VERR has a separate internal 1mA pull-up current
source.
FIGURE 7. AVERAGE OVERCURRENT IMPLEMENTATION
The current EA cross-over frequency, assuming R6 >>
(R4||R5), is:
1
(EQ. 6)
-----------------------------------
f
=
Hz
CO
2π ⋅ R6 ⋅ C10
Configure the IEA as an integrating (Type I) amplifier using
the internal 0.6V reference. The voltage applied at FB is
integrated against the 0.6V reference. The resulting signal,
VERR, is applied to the PWM comparator where it is
compared to the sawtooth voltage on RAMP. If FB is less
than 0.6V, the IEA will be open loop (can’t source current),
VERR will be at a level determined by the voltage loop, and
the duty cycle is unaffected. As the output load increases,
where f
CO
is the cross-over frequency. A capacitor in parallel
with R4 may be used to provide a double-pole roll-off.
The average current loop bandwidth is normally set to be
much less than the switching frequency, typically less than
5kHz and often as slow as a few hundred hertz or less. This
is especially useful if the application experiences large
surges. The average current loop can be set to the steady
state overcurrent threshold and have a time response that is
longer than the required transient. The peak current limit can
be set higher than the expected transient so that it does not
interfere with the transient, but still protects for short-term
larger faults. In essence a 2-stage overcurrent response is
possible.
I
will increase, and the voltage applied to FB will
OUT
increase until it reaches 0.6V. At this point the IEA will
reduce VERR as required to maintain the output current at
the level that corresponds to the 0.6V reference. When the
output current again drops below the average current limit
threshold, the IEA returns to an open loop condition, and the
duty cycle is again controlled by the voltage loop.
The average current control loop behaves much the same
as the voltage control loop found in typical power supplies
except it regulates current rather than voltage.
The peak overcurrent behavior is similar to most other PWM
controllers. If the peak current exceeds 1.0V, the active
output pulse is terminated immediately.
FN6754.1
September 29, 2008
11
ISL6754
If voltage-mode control is used in a bridge topology, it should
selected so that the ramp amplitude reaches 1.0V at
be noted that peak current limit results in inherently unstable
operation. DC blocking capacitors used in voltage-mode
bridge topologies become unbalanced, as does the flux in
the transformer core. The average overcurrent circuitry
prevents this behavior by maintaining symmetric duty cycles
for each half-cycle. If the average current limit circuitry is not
used, a latching overcurrent shutdown method using
external components is recommended.
minimum input voltage within the duration of one half-cycle.
1
2
20
19
18
17
16
15
14
13
12
VIN
3
4
ISL6754
R3
C7
5
6
7
The CS to output propagation delay is increased by the
leading edge blanking (LEB) interval. The effective delay is
the sum of the two delays and is 130ns maximum.
8
RAMP
9
10
GND 11
Voltage Feed Forward Operation
Voltage feed forward is a technique used to regulate the
output voltage for changes in input voltage without the
intervention of the control loop. Voltage feed forward is
implemented in voltage-mode control loops, but is redundant
and unnecessary in peak current-mode control loops.
FIGURE 9. VOLTAGE FEED FORWARD CONTROL
The charging time of the ramp capacitor is:
Voltage feed forward operates by modulating the sawtooth
ramp in direct proportion to the input voltage. Figure 8
demonstrates the concept.
V
⎛
⎞
⎟
⎠
RAMP(PEAK)
---------------------------------------
t = –R3 ⋅ C7 ⋅ ln 1 –
S
⎜
(EQ. 7)
V
⎝
IN(MIN)
For optimum performance, the maximum value of the
VIN
capacitor should be limited to 10nF. The maximum DC
current through the resistor should be limited to 2mA
maximum. For example, if the oscillator frequency is
400kHz, the minimum input voltage is 300V, and a 4.7nF
ramp capacitor is selected, the value of the resistor can be
determined by rearranging Equation 7.
ERROR VOLTAGE
RAMP
CT
–6
–t
-------------------------------------------------------------------------
–2.5 ⋅ 10
------------------------------------------------------------
=
R3 =
–9
1
⎞
---------
V
⎛
⎞
⎟
⎠
⎛
RAMP(PEAK)
4.7 ⋅ 10 ⋅ ln 1 –
---------------------------------------
C7 ⋅ ln 1 –
⎜
⎝
⎠
300
V
⎝
IN(MIN))
OUTLL, LR
= 159
kΩ
(EQ. 8)
FIGURE 8. VOLTAGE FEED FORWARD BEHAVIOR
where t is equal to the oscillator period minus the deadtime.
If the deadtime is short relative to the oscillator period, it can
be ignored for this calculation.
Input voltage feed forward may be implemented using the
RAMP input. An RC network connected between the input
voltage and ground, as shown in Figure 9, generates a
voltage ramp whose charging rate varies with the amplitude
of the source voltage. At the termination of the active output
pulse, RAMP is discharged to ground so that a repetitive
sawtooth waveform is created. The RAMP waveform is
compared to the VERR voltage to determine duty cycle. The
selection of the RC components depends upon the desired
input voltage operating range and the frequency of the
oscillator. In typical applications, the RC components are
If feed forward operation is not desired, the RC network may
be connected to V
rather than the input voltage.
REF
Alternatively, a resistor divider from CTBUF may be used as
the sawtooth signal. Regardless, a sawtooth waveform must
be generated on RAMP as it is required for proper PWM
operation.
Gate Drive
The ISL6754 outputs are capable of sourcing and sinking
10mA (at rated VOH, VOL) and are intended to be used in
conjunction with integrated FET drivers or discrete bipolar
totem pole drivers. The typical on resistance of the outputs is
50Ω.
FN6754.1
September 29, 2008
12
ISL6754
V can be solved for in terms of input voltage, current
Slope Compensation
n
transducer components, and output inductance yielding:
Peak current-mode control requires slope compensation to
improve noise immunity, particularly at lighter loads, and to
prevent current loop instability, particularly for duty cycles
greater than 50%. Slope compensation may be
T
⋅ V ⋅ R
CS
O
N
SW
1
S
⎝
π
P
⎛
⎞
----------------------------------------- ------- --
V
=
⋅
+ D – 0.5
V
(EQ. 15)
e
⎠
N
⋅ L
N
CT
O
accomplished by summing an external ramp with the current
feedback signal or by subtracting the external ramp from the
voltage feedback error signal. Adding the external ramp to
the current feedback signal is the more popular method.
where R
is the current sense burden resistor, N is the
CT
CS
current transformer turns ratio, L is the output inductance,
O
V
is the output voltage, and N and N are the secondary
O
S P
and primary turns, respectively.
From the small signal current-mode model [1] it can be
shown that the naturally-sampled modulator gain, Fm,
without slope compensation, is:
The inductor current, when reflected through the isolation
transformer and the current sense transformer to obtain the
current feedback signal at the sense resistor yields:
N
⋅ R
D ⋅ T
N
S
N
P
⎛
⎜
⎝
⎛
⎜
⎝
⎞⎞
⎟⎟
⎠⎠
1
S
CS
SW
-------------------
Fm =
------------------------
--------------------
-------
(EQ. 16)
(EQ. 9)
V
=
I
+
V
⋅
– V
O
V
CS
O
IN
SnTsw
N
⋅ N
2L
O
P
CT
where Sn is the slope of the sawtooth signal and Tsw is the
duration of the half-cycle. When an external ramp is added,
the modulator gain becomes:
where V
is the voltage across the current sense resistor
CS
and I is the output current at current limit.
O
Since the peak current limit threshold is 1.00V, the total
current feedback signal plus the external ramp voltage must
sum to this value.
1
1
(EQ. 10)
--------------------------------------
---------------------------
Fm =
=
(Sn + Se)Tsw
m SnTsw
c
V
+ V
= 1
CS
(EQ. 17)
where Se is slope of the external ramp and
Se
e
-------
= 1 +
m
(EQ. 11)
c
Sn
Substituting Equations 15 and 16 into Equation 17 and
solving for R yields:
CS
⋅ N
The criteria for determining the correct amount of external
ramp can be determined by appropriately setting the
damping factor of the double-pole located at half the
oscillator frequency. The double-pole will be critically
damped if the Q-factor is set to 1, and over-damped for
Q > 1, and under-damped for Q < 1. An under-damped
condition can result in current loop instability.
N
1
P
CT
----------------------- ------------------------------------------------------
R
=
⋅
Ω
(EQ. 18)
CS
N
V
O
1
π
D
2
S
⎛
⎝
⎞
⎠
-------
-- ---
+
I
+
T
O
SW
L
O
For simplicity, idealized components have been used for this
discussion, but the effect of magnetizing inductance must be
considered when determining the amount of external ramp
to add. Magnetizing inductance provides a degree of slope
compensation to the current feedback signal and reduces
the amount of external ramp required. The magnetizing
inductance adds primary current in excess of what is
reflected from the inductor current in the secondary.
1
(EQ. 12)
-------------------------------------------------
Q =
π(m (1 – D) – 0.5)
c
where D is the percent of on time during a half cycle. Setting
Q = 1 and solving for S yields:
e
1
π
1
⎛⎛
⎝⎝
⎞
⎞
– 1
(EQ. 13)
--
-------------
S
= S
+ 0.5
V
⋅ DT
SW
e
n
IN
⎠
⎠
1 – D
(EQ. 19)
-------------------------------
ΔI
=
A
P
L
m
Since S and S are the on time slopes of the current ramp
n
e
where V is the input voltage that corresponds to the duty
IN
and the external ramp, respectively, they can be multiplied
by T to obtain the voltage change that occurs during T
cycle D and L is the primary magnetizing inductance. The
.
m
ON ON
effect of the magnetizing current at the current sense
resistor, R , is:
CS
1
π
1
⎛⎛
⎝⎝
⎞
⎞
– 1
--
-------------
V
= V
+ 0.5
(EQ. 14)
e
n
⎠
⎠
1 – D
ΔI ⋅ R
P
CS
(EQ. 20)
-------------------------
ΔV
=
V
CS
N
where V is the change in the current feedback signal during
CT
n
the on time and V is the voltage that must be added by the
e
external ramp.
FN6754.1
September 29, 2008
13
ISL6754
If ΔV
CS
is greater than or equal to V , then no additional
Example:
e
slope compensation is needed and R
becomes:
CS
V
V
L
= 280V
= 12V
IN
N
CT
-------------------------------------------------------------------------------------------------------------------------------------
R
=
CS
O
N
DT
N
V
⋅ DT
⎛
⎛
⎞⎞
⎟⎟
⎠⎠
S
SW
S
IN SW
-------
----------------
-------
-------------------------------
⋅ I
+
⋅ V
⋅
– V
O
+
⎜
⎜
O
IN
= 2.0µH
N
P
2L
O
N
P
L
O
⎝
⎝
m
(EQ. 21)
Np/Ns = 20
Lm = 2mH
If ΔV is less than Ve, then Equation 16 is still valid for the
CS
value of R , but the amount of slope compensation added
CS
I
= 55A
O
by the external ramp must be reduced by ΔV
.
CS
Oscillator Frequency, Fsw = 400kHz
Duty Cycle, D = 85.7%
Adding slope compensation may be accomplished in the
ISL6754 using the CTBUF signal. CTBUF is an amplified
representation of the sawtooth signal that appears on the CT
pin. It is offset from ground by 0.4V and is 2x the peak-to-
peak amplitude of CT (0.4V to 4.4V). A typical application
sums this signal with the current sense feedback and applies
the result to the CS pin as shown in Figure 10.
N
= 50
CT
R6 = 499Ω
Solve for the current sense resistor, R , using Equation 18.
CS
R
= 15.1Ω.
CS
Determine the amount of voltage, V , that must be added to
e
the current feedback signal using Equation 15.
1
2
20
19
Ve = 153mV
3
18
CTBUF
Next, determine the effect of the magnetizing current from
Equation 20.
4
17
5
16
ISL6754
R9
6
15
ΔV
CS
= 91mV
7
14
Using Equation 23, solve for the summing resistor, R9, from
CTBUF to CS.
8
RAMP
CS
13
9
12
R9 = 30.1kΩ
R6
10
GND 11
RCS
C4
Determine the new value of R , R’ , using Equation 24.
CS CS
R’
CS
= 15.4Ω
The above discussion determines the minimum external
ramp that is required. Additional slope compensation may be
considered for design margin.
FIGURE 10. ADDING SLOPE COMPENSATION
If the application requires deadtime less than about 500ns,
the CTBUF signal may not perform adequately for slope
compensation. CTBUF lags the CT sawtooth waveform by
300ns to 400ns. This behavior results in a non-zero value of
CTBUF when the next half-cycle begins when the deadtime
is short.
Assuming the designer has selected values for the RC filter
placed on the CS pin, the value of R9 required to add the
appropriate external ramp can be found by superposition.
(D(V
– 0.4) + 0.4) ⋅ R6
CTBUF
------------------------------------------------------------------------------
(EQ. 22)
V
– ΔV
=
CS
V
e
R6 + R9
Rearranging to solve for R9 yields:
Under these situations, slope compensation may be added
by externally buffering the CT signal as shown in Figure 11.
(D(V
– 0.4) – V + ΔV
+ 0.4) ⋅ R6
CS
CTBUF
e
------------------------------------------------------------------------------------------------------------------
R9 =
Ω
V
– ΔV
CS
e
(EQ. 23)
The value of R
determined in Equation 18 or 21 must be
CS
rescaled so that the current sense signal presented at the
CS pin is that predicted by Equation 16. The divider created
by R6 and R9 makes this necessary.
R6 + R9
R9
----------------------
⋅ R
CS
(EQ. 24)
R′
=
CS
FN6754.1
September 29, 2008
14
ISL6754
1
2
20
19
VREF
CT
ISL6754
3
18
DEADTIME
OUTLL
4
17
PWM
PWM
5
16
CT
6
15
R9
7
14
PWM
PWM
OUTLR
OUTUR
8
RAMP
CS
13
9
12
R6
RESONANT
DELAY
10
GND 11
OUTUL
RESDEL
WINDOW
RCS
C4
CT
FIGURE 12. BRIDGE DRIVE SIGNAL TIMING
To understand how the ZVS method operates one must
include the parasitic elements of the circuit and examine a
full switching cycle.
FIGURE 11. ADDING SLOPE COMPENSATION USING CT
Using CT to provide slope compensation instead of CTBUF
requires the same calculations, except that Equations 22
and 23 require modification. Equation 22 becomes:
VIN+
UL
UR
D1
VOUT+
RTN
LL
2D ⋅ R6
R6 + R9
----------------------
V
– ΔV
=
CS
V
(EQ. 25)
e
and Equation 23 becomes:
LL
LR
D2
(2D – V + ΔV ) ⋅ R6
e
CS
------------------------------------------------------------
(EQ. 26)
R9 =
Ω
VIN-
V
– ΔV
CS
e
FIGURE 13. IDEALIZED FULL-BRIDGE
The buffer transistor used to create the external ramp from
CT should have a sufficiently high gain (>200) so as to
minimize the required base current. Whatever base current
is required reduces the charging current into CT and will
reduce the oscillator frequency.
In Figure 13, the power semiconductor switches have been
replaced by ideal switch elements with parallel diodes and
capacitance, the output rectifiers are ideal, and the
transformer leakage inductance has been included as a
discrete element. The parasitic capacitance has been
lumped together as switch capacitance, but represents all
parasitic capacitance in the circuit including winding
capacitance. Each switch is designated by its position, upper
left (UL), upper right (UR), lower left (LL), and lower right
(LR). The beginning of the cycle, shown in Figure 14, is
arbitrarily set as having switches UL and LR on and UR and
LL off. The direction of the primary and secondary currents
ZVS Full-Bridge Operation
The ISL6754 is a full-bridge zero-voltage switching (ZVS)
PWM controller that behaves much like a traditional hard-
switched topology controller. Rather than drive the diagonal
bridge switches simultaneously, the upper switches (OUTUL,
OUTUR) are driven at a fixed 50% duty cycle and the lower
switches (OUTLL, OUTLR) are pulse width modulated on
the trailing edge.
are indicated by I and I , respectively.
P
S
VIN+
UL
UR
IS
D1
VOUT+
RTN
LL
IP
LL
LR
D2
VIN-
FIGURE 14. UL - LR POWER TRANSFER CYCLE
FN6754.1
September 29, 2008
15
ISL6754
The UL - LR power transfer period terminates when switch
LR turns off as determined by the PWM. The current flowing
in the primary cannot be interrupted instantaneously, so it
must find an alternate path. The current flows into the
parasitic switch capacitance of LR and UR which charges
the node to VIN and then forward biases the body diode of
upper switch UR.
where τ is the resonant transition time, L is the leakage
L
inductance, C is the parasitic capacitance, and R is the
P
equivalent resistance in series with L and C .
L
P
The resonant delay is always less than or equal to the
deadtime and may be calculated using Equation 28.
V
resdel
2
-------------------
τ
=
⋅ DT
S
(EQ. 28)
resdel
VIN+
UL
UR
IS
D1
where τ
resdel
is the desired resonant delay, V is a
resdel
VOUT+
RTN
LL
voltage between 0V and 2V applied to the RESDEL pin, and
DT is the deadtime (see Equations 1 through 5).
IP
When the upper switches toggle, the primary current that
was flowing through UL must find an alternate path. It
charges/discharges the parasitic capacitance of switches UL
and LL until the body diode of LL is forward biased. If
RESDEL is set properly, switch LL will be turned on at this
time. The output inductor does not assist this transition. It is
LL
LR
D2
VIN-
FIGURE 15. UL - UR FREE-WHEELING PERIOD
The primary leakage inductance, L , maintains the current
L
VIN+
which now circulates around the path of switch UL, the
transformer primary, and switch UR. When switch LR opens,
the output inductor current free-wheels through both output
diodes, D1 and D2. During the switch transition, the output
inductor current assists the leakage inductance in charging
the upper and lower bridge FET capacitance.
UL
UR
IS
D1
VOUT+
RTN
LL
IP
LL
LR
D2
The current flow from the previous power transfer cycle
tends to be maintained during the free-wheeling period
because the transformer primary winding is essentially
shorted. Diode D1 may conduct very little or none of the
free-wheeling current, depending on circuit parasitics. This
behavior is quite different than occurs in a conventional
hard-switched full-bridge topology where the free-wheeling
current splits nearly evenly between the output diodes, and
flows not at all in the primary.
VIN-
FIGURE 16. UPPER SWITCH TOGGLE AND RESONANT
TRANSITION
purely a resonant transition driven by the leakage
inductance.
The second power transfer period commences when switch
LL closes. With switches UR and LL on, the primary and
secondary currents flow as indicated in Figure 17.
This condition persists through the remainder of the half-
cycle.
VIN+
During the period when CT discharges, also referred to as
the deadtime, the upper switches toggle. Switch UL turns off
and switch UR turns on. The actual timing of the upper
switch toggle is dependent on RESDEL which sets the
resonant delay. The voltage applied to RESDEL determines
how far in advance the toggle occurs prior to a lower switch
turning on. The ZVS transition occurs after the upper
switches toggle and before the diagonal lower switch turns
on. The required resonant delay is 1/4 of the period of the LC
resonant frequency of the circuit formed by the leakage
inductance and the parasitic capacitance. The resonant
transition may be estimated from Equation 27.
UL
UR
D1
VOUT+
RTN
LL
LL
LR
D2
VIN-
FIGURE 17. UR - LL POWER TRANSFER CYCLE
The UR - LL power transfer period terminates when switch
LL turns off as determined by the PWM. The current flowing
in the primary must find an alternate path. The current flows
into the parasitic switch capacitance which charges the node
π
2
1
-------------------------------------
τ =
(EQ. 27)
2
1
R
-------------- ---------
–
2
L
L C
L
P
4L
to V and then forward biases the body diode of upper
IN
switch UL. As before, the output inductor current assists in
this transition. The primary leakage inductance, L ,
L
FN6754.1
September 29, 2008
16
ISL6754
maintains the current, which now circulates around the path
of switch UR, the transformer primary, and switch UL. When
switch LL opens, the output inductor current free-wheels
predominantly through diode D1. Diode D2 may actually
conduct very little or none of the free-wheeling current,
depending on circuit parasitics. This condition persists
through the remainder of the half-cycle.
opposite PWM output, i.e. OUTLL and OUTLRN are paired
together and OUTLR and OUTLLN are paired together.
CT
OUTLL
VIN+
UL
UR
IS
D1
OUTLR
VOUT+
RTN
LL
IP
OUTLLN
(SR1)
LL
LR
OUTLRN
(SR2)
D2
VIN-
FIGURE 18. UR - UL FREE-WHEELING PERIOD
FIGURE 20. BASIC WAVEFORM TIMING
When the upper switches toggle, the primary current that
was flowing through UR must find an alternate path. It
charges/discharges the parasitic capacitance of switches UR
and LR until the body diode of LR is forward biased. If
RESDEL is set properly, switch LR will be turned on at this
time.
Referring to Figure 20, the SRs alternate between being both
on during the free-wheeling portion of the cycle (OUTLL/LR
off), and one or the other being off when OUTLL or OUTLR is
on. If OUTLL is on, its corresponding SR must also be on,
indicating that OUTLRN is the correct SR control signal.
Likewise, if OUTLR is on, its corresponding SR must also be
on, indicating that OUTLLN is the correct SR control signal.
VIN+
UL
UR
IS
D1
A useful feature of the ISL6754 is the ability to vary the
phase relationship between the PWM outputs (OUTLL, OUT
LR) and the their complements (OUTLLN, OUTLRN) by
±300ns. This feature allows the designer to compensate for
differences in the propagation times between the PWM FETs
VOUT+
RTN
LL
IP
LL
LR
D2
and the SR FETs. A voltage applied to V
phase relationship.
controls the
ADJ
VIN-
FIGURE 19. UPPER SWITCH TOGGLE AND RESONANT
TRANSITION
CT
The first power transfer period commences when switch LR
closes and the cycle repeats. The ZVS transition requires
that the leakage inductance has sufficient energy stored to
OUTLL
fully charge the parasitic capacitances. Since the energy
2
stored is proportional to the square of the current (1/2 L I ),
L P
OUTLR
the ZVS resonant transition is load dependent. If the leakage
inductance is not able to store sufficient energy for ZVS, a
discrete inductor may be added in series with the
transformer primary.
OUTLLN
(SR1)
OUTLRN
(SR2)
Synchronous Rectifier Outputs and Control
The ISL6754 provides double-ended PWM outputs, OUTLL
and OUTLR, and synchronous rectifier (SR) outputs,
OUTLLN and OUTLRN. The SR outputs are the
complements of the PWM outputs. It should be noted that
the complemented outputs are used in conjunction with the
FIGURE 21. WAVEFORM TIMING WITH PWM OUTPUTS
DELAYED, 0V < V < 2.425V
ADJ
FN6754.1
September 29, 2008
17
ISL6754
On/Off Control
The ISL6754 does not have a separate enable/disable
control pin. The PWM outputs, OUTLL/OUTLR, may be
disabled by pulling VERR to ground. Doing so reduces the
duty cycle to zero, but the upper 50% duty cycle outputs,
OUTUL/OUTUR, will continue operation. Likewise, the SR
outputs OUTLLN/OUTLRN will be active high.
CT
OUTLL
OUTLR
Pulling Soft-Start to ground will disable all outputs and set
them to a low condition
OUTLLN
(SR1)
Fault Conditions
A fault condition occurs if V
REF
or V fall below their
DD
OUTLRN
(SR2)
undervoltage lockout (UVLO) thresholds or if the thermal
protection is triggered. When a fault is detected the outputs
are disabled low. When the fault condition clears the outputs
are re-enabled.
FIGURE 22. WAVEFORM TIMING WITH SR OUTPUTS
DELAYED, 2.575V < VADJ < 5.00V
An overcurrent condition is not considered a fault and does
not result in a shutdown.
Setting VADJ to V
/2 results in no delay on any output.
REF
The no delay voltage has a ±75mV tolerance window.
Control voltages below the V /2 zero delay threshold
Thermal Protection
REF
cause the PWM outputs, OUTLL/LR, to be delayed. Control
voltages greater than the V /2 zero delay threshold cause
Internal die over temperature protection is provided. An
integrated temperature sensor protects the device should
the junction temperature exceed +140°C. There is
approximately +15°C of hysteresis.
REF
the SR outputs, OUTLLN/LRN, to be delayed. It should be
noted that when the PWM outputs, OUTLL/LR, are delayed,
the CS to output propagation delay is increased by the
amount of the added delay.
Ground Plane Requirements
Careful layout is essential for satisfactory operation of the
The delay feature is provided to compensate for mismatched
propagation delays between the PWM and SR outputs as
may be experienced when one set of signals crosses the
primary-secondary isolation boundary. If required, individual
output pulses may be stretched or compressed as required
using external resistors, capacitors, and diodes.
device. A good ground plane must be employed. V
and
DD
should be bypassed directly to GND with good high
V
REF
frequency capacitance.
References
[1] Ridley, R., “A New Continuous-Time Model for Current
Mode Control”, IEEE Transactions on Power
Electronics, Vol. 6, No. 2, April 1991.
When the PWM outputs are delayed, the 50% upper outputs
are equally delayed, so the resonant delay setting is
unaffected.
FN6754.1
September 29, 2008
18
ISL6754
Shrink Small Outline Plastic Packages (SSOP)
Quarter Size Outline Plastic Packages (QSOP)
N
M20.15
INDEX
0.25(0.010)
M
B M
H
AREA
20 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
(0.150” WIDE BODY)
E
GAUGE
PLANE
-B-
INCHES
MIN
MILLIMETERS
SYMBOL
MAX
0.069
0.010
0.061
0.012
0.010
0.344
0.157
MIN
1.35
0.10
-
MAX
1.75
0.25
1.54
0.30
0.25
8.74
3.98
NOTES
1
2
3
A
A1
A2
B
0.053
0.004
-
-
L
-
0.25
0.010
SEATING PLANE
A
-
-A-
D
h x 45¬
0.008
0.007
0.337
0.150
0.20
0.18
8.56
3.81
9
C
D
E
-
-C-
α
3
A2
e
A1
4
C
B
0.10(0.004)
e
0.025 BSC
0.635 BSC
-
0.17(0.007) M
C
A M B S
H
h
0.228
0.0099
0.016
0.244
0.0196
0.050
5.80
0.26
0.41
6.19
0.49
1.27
-
5
NOTES:
L
6
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
N
α
20
20
7
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
0°
8°
0°
8°
-
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
Rev. 1 6/04
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dam-
bar protrusion shall be 0.10mm (0.004 inch) total in excess of “B” di-
mension at maximum material condition.
10. Controlling dimension: INCHES. Converted millimeter dimensions
are not necessarily exact.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6754.1
September 29, 2008
19
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