ISL8563IB [INTERSIL]
+3V to +5.5V, 1Microamp, 250kbps, EIA/TIA-562, EIA/TIA-232 Transmitters/Receivers; + 3V至+ 5.5V ， 1Microamp ， 250kbps的， EIA / TIA- 562 ， EIA / TIA- 232发射器/接收器
| 型号： | ISL8563IB |
| 厂家： | 
Intersil |
| 描述： | +3V to +5.5V, 1Microamp, 250kbps, EIA/TIA-562, EIA/TIA-232 Transmitters/Receivers |
| 文件： | 总10页 (文件大小：240K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ISL8563
TM
Data Sheet
March 2001
File Number 6005
+3V to +5.5V, 1Microamp, 250kbps,
EIA/TIA-562, EIA/TIA-232
Transmitters/Receivers
Features
• Drop in Replacement for MAX563, with Improved Output
Voltage (±5V) for Enhanced Noise Immunity
The Intersil ISL8563 contains 3.0V to 5.5V powered
transmitters/receivers which meet ElA/TIA-562 and
• Available as ±15kV ESD Protected Version (ISL8563E)
• Meets EIA/TIA-562, and EIA/TIA-232 Specifications at 3V
• Latch-Up Free
ElA/TIA-232 specifications, even at V
= 3.0V. Targeted
tle
85
CC
applications are PDAs, Palmtops, and notebook and laptop
computers where the low operational, and even lower
standby, power consumption is critical. Efficient on-chip
charge pumps, coupled with a manual powerdown function,
reduce the standby supply current to a 1µA trickle. Small
footprint packaging, and the use of small, low value
capacitors ensure board space savings as well. Data rates
greater than 250kbps are guaranteed at worst case load
conditions. The ISL8563 is fully compatible with 3.3V only
systems, mixed 3.3V and 5.0V systems, and 5.0V only
systems.
• On-Chip Voltage Converters Require Only Four External
0.1µF Capacitors
• Receivers Active in Powerdown
jec
V
• Receiver Hysteresis For Improved Noise Immunity
• Guaranteed Minimum Data Rate . . . . . . . . . . . . . 250kbps
• Guaranteed Minimum Slew Rate . . . . . . . . . . . . . . . 4V/µs
• Wide Power Supply Range. . . . . . . . Single +3V to +5.5V
• Low Supply Current in Powerdown State. . . . . . . . . . .1µA
V,
cro
,
kb
Applications
This product features an improved charge pump which
delivers ±5V transmitter supplies, allowing the use of the
ISL8563 in RS-562 and RS-232 applications. RS-562
applications will benefit from the improved noise immunity
afforded by the ±5V output swing capability.
• Any System Requiring RS-562/RS-232 Communication
Ports
/TI
62,
/TI
32
s
ers
ei
)
- Battery Powered, Hand-Held, and Portable Equipment
- Laptop Computers, Notebooks, Palmtops
- Digital Cameras
- Bar Code Readers
Table 1 summarizes the features of the device represented
by this data sheet, while Application Note AN9863
summarizes the features of each device comprising the 3V
RS-232 family.
Related Literature
• Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”
tho
For a drop-in compatible part with ±15kV ESD protection,
please see the ISL8563E data sheet.
• Application Note AN9863, “3V to +5.5V, 250K-1Mbps,
RS-232 Transmitters/Receivers”
w
Ordering Information
Pinout
TEMP.
o
rsi
PART NO.
ISL8563CB
ISL8563CB-T
ISL8563CP
ISL8563IB
RANGE ( C)
0 to 70
PACKAGE
18 Ld SOIC
PKG. NO.
M18.3
ISL8563 (PDIP, SOIC)
TOP VIEW
por
n,
ico
cto
-
EN
C1+
V+
1
2
3
4
5
6
7
8
9
18 SHDN
17
0 to 70
Tape and Reel
18 Ld PDIP
M18.3
E18.3
M18.3
M18.3
V
CC
0 to 70
16 GND
15 T1
-40 to 85
-40 to 85
18 Ld SOIC
C1-
C2+
C2-
V-
OUT
ISL8563IB-T
Tape and Reel
14 R1
13 R1
12 T1
IN
V
OUT
IN
IN
ect
T2
11 T2
10
OUT
R2
IN
R2
OUT
an
y
el,
,
TABLE 1. SUMMARY OF FEATURES
DATA
NO. OF
MONITOR Rx.
(R
MANUAL
POWER-
DOWN?
AUTOMATIC
POWERDOWN
FUNCTION?
PART
NUMBER
NO. OF NO. OF
RATE
(kbps)
Rx. ENABLE
FUNCTION?
READY
OUTPUT?
Tx.
Rx.
)
OUTB
ISL8563
2
2
0
250
YES
NO
YES
NO
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2001, All Rights Reserved
1
ISL8563
Pin Descriptions
PIN
FUNCTION
V
System Power Supply Input (3.0V to 5.5V).
CC
V+
V-
Internally Generated Positive Transmitter Supply (+5.5V).
Internally Generated Negative Transmitter Supply (-5.5V).
Ground Connection.
GND
C1+
C1-
C2+
C2-
External Capacitor (Voltage Doubler) is connected to this lead.
External Capacitor (Voltage Doubler) is connected to this lead.
External Capacitor (Voltage Inverter) is connected to this lead.
External Capacitor (Voltage Inverter) is connected to this lead.
TTL/CMOS Compatible Transmitter Inputs with pull-up resistors.
RS-562/RS-232 level (nominally ±5.5V) transmitter outputs.
RS-562/RS-232 compatible receiver inputs.
T
IN
T
OUT
R
IN
R
TTL/CMOS Level Receiver Outputs.
OUT
EN
Active Low Receiver Enable Control.
SHDN
Active Low Input which shuts down transmitters and on-board power supply, to place device in low power mode.
Typical Operating Circuit
ISL8563
+3.3V
C
+
0.1µF
17
C
0.1µF
3
2
C1+
1
V
CC
+
+
+
+
V+
V-
0.1µF
4
5
3
7
C1-
C
0.1µF
2
C2+
C
4
0.1µF
6
C2-
V
CC
400kΩ
T
T
1
2
12
15
T1
T2
T1
IN
OUT
OUT
V
CC
400kΩ
8
11
13
T2
IN
TTL/CMOS
LOGIC LEVELS
RS-562/232
LEVELS
14
R1
R1
OUT
IN
IN
5kΩ
R
1
9
10
1
R2
R2
OUT
5kΩ
R
2
EN
18
V
CC
SHDN
GND
16
2
ISL8563
Absolute Maximum Ratings
Thermal Information
o
V
to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V
Thermal Resistance (Typical, Note 1)
θ
( C/W)
CC
JA
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3V to -7V
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14V
Input Voltages
18 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .
18 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
Moisture Sensitivity (see Technical Brief TB363)
All Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 1
Maximum Junction Temperature (Plastic Package) . . . . . . . 150 C
Maximum Storage Temperature Range. . . . . . . . . . -65 C to 150 C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300 C
(SOIC - Lead Tips Only)
80
75
o
o
T
, EN, SHDN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V
IN
o
R
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25V
IN
Output Voltages
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±13.2V
o
T
OUT
R
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to V
+0.3V
OUT
Short Circuit Duration
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
CC
Operating Conditions
T
OUT
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Temperature Range
ISL8563CX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 C to 70 C
ISL8563IX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40 C to 85 C
o
o
o
o
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θ is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
JA
Electrical Specifications Test Conditions: V = 3V to 5.5V, C - C = 0.1µF; Unless Otherwise Specified.
CC
1
4
o
Typicals are at T = 25 C
A
TEMP
o
PARAMETER
RS-562/RS-232 TRANSMITTERS
Output Voltage Swing
TEST CONDITIONS
( C)
MIN
TYP
MAX
UNITS
All Transmitter Outputs Loaded with 3kΩ to Ground
= 3kΩ, C = 1000pF, One Transmitter Switching and
Full
Full
±5.0
±5.4
-
-
V
Maximum Data Rate
R
250
500
kbps
L
L
Maintaining ±5V Output Swing
Input Logic Threshold Low
Input Logic Threshold High
Transmitter Pull-Up Input Current
T
T
T
Full
Full
Full
Full
Full
Full
Full
-
-
-
0.8
-
V
V
IN
IN
IN
V
= 3.0V to 5.0V
2.4
CC
SHDN = V
-
2
20
µA
µA
µA
Ω
CC
SHDN = GND
-
±0.01
-
±1.0
±10
-
Output Leakage Current
Output Resistance
V
V
V
= ±12V, V
= 0V or 3.6V to 5.5V, SHDN = GND
CC
-
300
-
OUT
= V+ = V- = 0V, Transmitter Output = ±2V
10M
±35
CC
Output Short-Circuit Current
RS-562/RS-232 RECEIVERS
Input Voltage Range
= 0V
±60
mA
OUT
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
-25
-
-
25
0.6
0.8
-
V
V
Input Threshold Low
V
V
V
V
V
= 3.3V
1.2
1.5
1.5
1.8
0.5
5
CC
CC
CC
CC
CC
= 5.0V
-
V
Input Threshold High
= 3.3V
2.4
2.4
0.1
3
V
= 5.0V
-
V
Input Hysteresis
= 3.0V to 3.6V
1.0
7
V
Input Resistance
kΩ
V
Output Voltage Low
Output Voltage High
Output Leakage Current
EN Input Logic Threshold Low
EN Input Logic Threshold High
POWER SUPPLY
I
I
= 3.2mA
= -1.0mA
-
-
0.4
-
OUT
OUT
V
-0.6
V
-0.1
V
CC
CC
EN = V
CC
-
-
±0.05
±10
0.8
-
µA
V
-
-
V
= 3.0V to 5.0V
2.4
V
CC
Operating Supply Voltage
Supply Current
Full
Full
25
3.0
-
0.5
14
5.5
6.0
-
V
SHDN = V
CC
All Outputs Unloaded
All Outputs loaded, R = 3kΩ
-
-
-
-
-
mA
mA
µA
µA
µA
L
Supply Current, Powerdown
SHDN Input Leakage Current
SHDN = GND
25
1
10
Full
Full
1
25
±0.01
±1.0
3
ISL8563
Electrical Specifications Test Conditions: V = 3V to 5.5V, C - C = 0.1µF; Unless Otherwise Specified.
CC
1
4
o
Typicals are at T = 25 C (Continued)
A
TEMP
o
PARAMETER
TEST CONDITIONS
( C)
MIN
-
TYP
MAX
0.8
-
UNITS
SHDN Input Logic Threshold Low
SHDN Input Logic Threshold High
AC CHARACTERISTICS
Full
Full
-
-
V
V
V
V
= 3.0V to 5.0V
2.4
CC
CC
Transition Region Slew Rate
= 3.3V, R = 3kΩ to 7kΩ, Measured From 3V to -3V or
25
4
-
30
V/µs
L
-3V to 3V, C = 50pF to 2500pF
L
Transmitter Propagation Delay
Receiver Propagation Delay
Transmitter Input to
Transmitter Output,
t
t
(Note 2)
(Note 2)
Full
Full
-
-
1
1
3.5
3.5
µs
µs
PHL
PLH
C
= 1000pF, R = 3kΩ
L
L
Receiver Input to Receiver
t
t
t
t
t
t
(Note 3)
(Note 3)
Full
Full
Full
Full
25
-
-
-
-
-
-
-
-
0.3
0.3
1.0
µs
µs
ns
ns
µs
ns
ns
ns
PHL
PLH
ER
Output, C = 150pF
L
1.0
Receiver Output Enable Time
Receiver Output Disable Time
Transmitter Output Enable Time
Figure 1
Figure 1
Figure 2
125
160
17
500
500
DR
ET
-
-
-
-
Transmitter Output Disable Time Figure 2
25
600
100
100
DT
Transmitter Skew
Receiver Skew
t
t
- t
PHL PLH
(Note 2)
(Note 3)
25
- t
PHL PLH
25
ESD PERFORMANCE
RS-562 Pins (T
, R
)
Human Body Model
25
25
25
25
-
-
-
-
±15
±8
-
-
-
-
kV
kV
kV
kV
OUT IN
IEC1000-4-2 Contact Discharge
IEC1000-4-2 Air Gap Discharge
Human Body Model
±8
All Other Pins
NOTES:
±3
2. Transmitter is measured at the transmitter zero crossing points.
3. Receiver is measured at the receiver 50 percent crossing points.
Test Waveforms
V
CC
t
V
CC
EN INPUT
0V
0V
SHDN INPUT
t
ER
ET
+3.7V
-3.7V
V
- 0.6V
0.5V
CC
CC
0V
RECEIVER
OUTPUT
TRANSMITTER
OUTPUT
C
= 50pF
C
R
= 150pF to GND
L
+0.4V
L
L
R
= 3kΩ
= 1kΩ to 0.5V
L
CC
V
V
CC
CC
SHDN INPUT
0V
0V
EN INPUT
t
DR
t
DT
V
V+
OH
+3.7V
-3.7V
V
- 0.1V
+ 0.1V
OH
TRANSMITTER
OUTPUT
0.5V
CC
RECEIVER
OUTPUT
0V
C
= 50pF
L
V
V
C
= 150pF to GND
OL
OL
L
V-
R
= 3kΩ
L
R
= 1kΩ to 0.5V
CC
L
FIGURE 2. TRANSMITTER OUTPUT ENABLE AND DISABLE
TIMING
FIGURE 1. RECEIVER OUTPUT ENABLE AND DISABLE TIMING
4
ISL8563
(V
= 0V). The receivers’ Schmitt trigger input stage uses
Detailed Description
CC
hysteresis (even in powerdown) to increase noise immunity
and decrease errors due to slow input signal transitions.
The ISL8563 operates from a single +3V to +5.5V supply,
guarantees a 250kbps minimum data rate, requires only four
small external 0.1µF capacitors, features low power
consumption, and meets all ElA/TIA-562 and EIA/TIA-232
specifications. The circuit is divided into three sections: The
charge pump, the transmitters, and the receivers.
The ISL8563 inverting receivers disable only when EN is
driven high. Standard receivers driving powered down
peripherals must be disabled to prevent current flow through
the peripheral’s protection diodes (see Figures 4 and 5).
Charge-Pump
V
CC
Intersil’s new ISL8563 utilizes regulated on-chip dual charge
pumps as voltage doublers, and voltage inverters to
R
R
XIN
XOUT
generate ±5.5V transmitter supplies from a V
supply as
GND ≤ V
≤ V
-25V ≤ V
≤ +25V
5kΩ
CC
ROUT
CC
RIN
low as 3.0V. This allows these devices to maintain RS-232
compliant output levels over the ±10% tolerance range of
3.3V powered systems. The efficient on-chip power supplies
require only four small, external 0.1µF capacitors for the
GND
FIGURE 3. INVERTING RECEIVER CONNECTIONS
Powerdown Functionality
voltage doubler and inverter functions over the full V
CC
This 3V device requires a nominal supply current of 0.3mA
during normal operation (not in powerdown mode). This is
considerably less than the 5mA to 11mA current required by
5V devices. The already low current requirement drops
significantly when the device enters powerdown mode. In
powerdown, supply current drops to 1µA, because the on-
range. The charge pumps operate discontinuously (i.e., they
turn off as soon as the V+ and V- supplies are pumped up to
the nominal values), resulting in significant power savings.
Transmitters
The transmitters are proprietary, low dropout, inverting
drivers that translate TTL/CMOS inputs to EIA/TIA-562/232
output levels. Coupled with the on-chip ±5.5V supplies,
these transmitters deliver true RS-562/232 levels over a
wide range of single supply system voltages.
chip charge pump turns off (V+ collapses to V , V-
CC
collapses to GND), the transmitter outputs three-state, and
the transmitter input pull-ups disable. This micro-power
mode makes the ISL8563 ideal for battery powered and
portable applications.
All transmitter outputs disable and assume a high
impedance state when the device enters the powerdown
mode (see Table 2). These outputs may be driven to ±12V
when disabled.
Software Controlled (Manual) Powerdown
The ISL8563, is forced into its low power, stand by state via
a simple shutdown (SHDN) pin. Driving this pin high enables
normal operation, while driving it low forces the IC into its
All devices guarantee a 250kbps data rate (V
= ±5V) for
≥ 3.0V, with one
OUT
powerdown state. Connect SHDN to V
if the powerdown
full load conditions (3kΩ and 1000pF), V
CC
CC
transmitter operating at full speed. Under more typical
conditions of V ≥ 3.3V, R = 3kΩ, and C = 250pF, one
function isn’t needed. Note that all the receiver outputs
remain enabled during shutdown (see Table 2). For the
lowest power consumption during powerdown, the receivers
should also be disabled by driving the EN input high (see
next section, and Figures 4 and 5). The time required to exit
powerdown, and resume transmission is less than 30µs.
CC
L
L
transmitter easily operates at 900kbps.
Unused transmitter inputs may be left unconnected because
they will be pulled to V by the on-chip pull-up resistors.
CC
Forcing the ISL8563 into power down disables the pull-up
resistors to further minimize power.
Receiver ENABLE Control
The device also features an EN input to control the receiver
outputs. Driving EN high disables all the receiver outputs
placing them in a high impedance state. This is useful to
eliminate supply current, due to a receiver output forward
biasing the protection diode, when driving the input of a
Receivers
The ISL8563 contains standard inverting receivers that
three-state via the EN control line. All the receivers convert
RS-562/232 signals to CMOS output levels and accept
inputs up to ±25V while presenting the required 3kΩ to 7kΩ
input impedance (see Figure 3) even if the power is off
powered down (V
= GND) peripheral (see Figure 4). The
CC
enable input has no effect on transmitters.
TABLE 2. POWERDOWN AND ENABLE LOGIC TRUTH TABLE
SHDN INPUT
EN INPUT
TRANSMITTER OUTPUTS
RECEIVER OUTPUTS
MODE OF OPERATION
Manual Powerdown
L
L
L
H
L
High-Z
High-Z
Active
Active
Active
High-Z
Active
High-Z
Manual Powerdown w/Rcvr. Disabled
Normal Operation
H
H
H
Normal Operation w/Rcvr. Disabled
5
ISL8563
Transmitter Outputs When Exiting
V
CC
Powerdown
V
CC
V
Figure 6 shows the response of two transmitter outputs
when exiting powerdown mode. As they activate, the two
transmitter outputs properly go to opposite RS-562/232
levels, with no glitching, ringing, nor undesirable transients.
Each transmitter is loaded with 3kΩ in parallel with 2500pF.
Note that the transmitters enable only when the magnitude
of the supplies exceed approximately 3V.
CURRENT
FLOW
CC
V
= V
CC
OUT
Rx
POWERED
DOWN
UART
Tx
OLD
RS-562/232 CHIP
SHDN = GND
GND
5V/DIV.
SHDN
FIGURE 4. POWER DRAIN THROUGH POWERED DOWN
PERIPHERAL
T1
V
CC
2V/DIV.
TRANSITION
DETECTOR
TO
WAKE-UP
LOGIC
ISL8563
T2
V
= +3.3V
CC
V
CC
C1 - C4 = 0.1µF
TIME (20µs/DIV.)
R
T
V
= HI-Z
X
OUT
FIGURE 6. TRANSMITTER OUTPUTS WHEN EXITING
POWERDOWN
R2
OUT
POWERED
DOWN
UART
R2
T1
IN
T1
IN
X
High Data Rates
The ISL8563 maintains the RS-232 ±5V minimum
transmitter output voltages even at high data rates. Figure 7
details a transmitter loopback test circuit, and Figure 8
illustrates the loopback test result at 120kbps. For this test,
all transmitters were simultaneously driving RS-232 loads in
parallel with 1000pF, at 120kbps. Figure 9 shows the
loopback results for a single transmitter driving 1000pF and
an RS-232 load at 250kbps. The static transmitters were
also loaded with an RS-232 receiver.
OUT
SHDN = GND, EN = V
CC
FIGURE 5. DISABLED RECEIVERS PREVENT POWER DRAIN
Capacitor Selection
The charge pumps operate with 0.1µF (or greater) capacitors
for 3.0V ≤ V
≤ 5.5V. Increasing the capacitor values (by a
CC
factor of 2) reduces ripple on the transmitter outputs and
slightly reduces power consumption. C , C , and C can be
increased without increasing C ’s value, however, do not
increase C without also increasing C , C , and C to
2
3
4
V
CC
1
+
0.1µF
V
CC
V+
V-
+
+
1
2
3
4
C1+
+
C
C
maintain the proper ratios (C to the other capacitors).
1
1
2
C
3
4
C1-
When using minimum required capacitor values, make sure
that capacitor values do not degrade excessively with
temperature. If in doubt, use capacitors with a larger nominal
value. The capacitor’s equivalent series resistance (ESR)
usually rises at low temperatures and it influences the
amount of ripple on V+ and V-.
ISL8563
CC
C2+
C
+
V
C2-
400kΩ
T
T
IN
OUT
1000pF
R
IN
R
OUT
Power Supply Decoupling
In most circumstances a 0.1µF bypass capacitor is
adequate. In applications that are particularly sensitive to
EN
SHDN
5K
V
CC
power supply noise, decouple V
to ground with a
CC
capacitor of the same value as the charge-pump capacitor C .
Connect the bypass capacitor as close as possible to the IC.
1
FIGURE 7. TRANSMITTER LOOPBACK TEST CIRCUIT
6
ISL8563
Interconnection with 3V and 5V Logic
5V/DIV.
The ISL8563 directly interface with most 5V logic families,
including ACT and HCT CMOS. See Table 3 for more
information on possible combinations of interconnections.
T1
IN
TABLE 3. LOGIC FAMILY COMPATIBILITY WITH VARIOUS
SUPPLY VOLTAGES
T1
OUT
SYSTEM
V
CC
POWER-SUPPLY SUPPLY
VOLTAGE
(V)
VOLTAGE
(V)
COMPATIBILITY
R1
OUT
3.3
3.3
Compatible with all CMOS
families.
V
= +3.3V
CC
C1 - C4 = 0.1µF
5
5
Compatible with all TTL and
CMOS logic families.
5µs/DIV.
FIGURE 8. LOOPBACK TEST AT 120kbps
5
3.3
Compatible with ACT and HCT
CMOS, and with TTL.
Incompatible with AC, HC, or
CD4000 CMOS.
5V/DIV.
T1
IN
T1
OUT
R1
OUT
V
= +3.3V
CC
C1 - C4 = 0.1µF
2µs/DIV.
FIGURE 9. LOOPBACK TEST AT 250kbps
o
Typical Performance Curves V = 3.3V, T = 25 C
CC
A
6
4
25
20
V
+
OUT
2
1 TRANSMITTER AT 250kbps
1 TRANSMITTER AT 30kbps
0
15
10
-SLEW
-2
-4
-6
+SLEW
V
-
OUT
5
0
0
1000
2000
3000
4000
5000
1000
2000
3000
4000
5000
LOAD CAPACITANCE (pF)
LOAD CAPACITANCE (pF)
FIGURE 10. TRANSMITTER OUTPUT VOLTAGE vs LOAD
CAPACITANCE
FIGURE 11. SLEW RATE vs LOAD CAPACITANCE
7
ISL8563
o
Typical Performance Curves V = 3.3V, T = 25 C (Continued)
CC
A
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
45
40
35
30
25
20
NO LOAD
ALL OUTPUTS STATIC
250kbps
120kbps
20kbps
15
10
5
0
0
1000
2000
3000
4000
5000
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
LOAD CAPACITANCE (pF)
SUPPLY VOLTAGE (V)
FIGURE 12. SUPPLY CURRENT vs LOAD CAPACITANCE
WHEN TRANSMITTING DATA
FIGURE 13. SUPPLY CURRENT vs SUPPLY VOLTAGE
Die Characteristics
DIE DIMENSIONS:
PASSIVATION:
100 mils x 100 mils (2540µm x 2540µm)
Type: Silox
Thickness: 13kÅ
METALLIZATION:
TRANSISTOR COUNT:
Type: Metal 1: AISi(1%)
Thickness: Metal 1: 8kÅ
Type: Metal 2: AISi (1%)
Thickness: Metal 2: 10kÅ
338
PROCESS:
Si Gate CMOS
SUBSTRATE POTENTIAL (POWERED UP):
Floating
8
ISL8563
Dual-In-Line Plastic Packages (PDIP)
E18.3 (JEDEC MS-001-BC ISSUE D)
18 LEAD DUAL-IN-LINE PLASTIC PACKAGE
N
E1
INDEX
AREA
INCHES
MILLIMETERS
1
2
3
N/2
SYMBOL
MIN
MAX
0.210
-
MIN
-
MAX
5.33
-
NOTES
-B-
A
A1
A2
B
-
4
-A-
0.015
0.115
0.014
0.045
0.008
0.845
0.005
0.300
0.240
0.39
2.93
0.356
1.15
0.204
21.47
0.13
7.62
6.10
4
D
E
BASE
PLANE
0.195
0.022
0.070
0.014
0.880
-
4.95
0.558
1.77
0.355
22.35
-
-
A2
A
-C-
-
SEATING
PLANE
L
C
L
B1
C
8, 10
D1
B1
-
eA
A1
A
D1
e
D
5
eC
B S
C
B
eB
D1
E
5
0.010 (0.25) M
C
0.325
0.280
8.25
7.11
6
NOTES:
E1
e
5
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
0.100 BSC
0.300 BSC
2.54 BSC
7.62 BSC
-
e
A
6
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
e
-
0.430
0.150
-
10.92
3.81
7
B
L
0.115
2.93
4
9
4. Dimensions A, A1 and L are measured with the package seated in
N
18
18
JEDEC seating plane gauge GS-3.
Rev. 0 12/93
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
e
6. E and
are measured with the leads constrained to be perpendic-
A
-C-
ular to datum
.
7. e and e are measured at the lead tips with the leads unconstrained.
B
C
e
must be zero or greater.
C
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
9
ISL8563
Small Outline Plastic Packages (SOIC)
M18.3 (JEDEC MS-013-AB ISSUE C)
N
18 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010)
M
B M
H
INCHES
MILLIMETERS
E
SYMBOL
MIN
MAX
MIN
2.35
0.10
0.33
0.23
11.35
7.40
MAX
2.65
0.30
0.51
0.32
11.75
7.60
NOTES
-B-
A
A1
B
C
D
E
e
0.0926
0.0040
0.013
0.1043
0.0118
0.0200
0.0125
0.4625
0.2992
-
-
1
2
3
L
9
SEATING PLANE
A
0.0091
0.4469
0.2914
-
-A-
o
3
h x 45
D
4
-C-
0.050 BSC
1.27 BSC
-
α
µ
H
h
0.394
0.010
0.016
0.419
0.029
0.050
10.00
0.25
0.40
10.65
0.75
1.27
-
e
A1
C
5
B
0.10(0.004)
L
6
0.25(0.010) M
C A M B S
N
α
18
18
7
o
o
o
o
0
8
0
8
-
NOTES:
Rev. 0 12/93
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
All Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at website www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.
Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. How-
ever, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use.
No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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10
相关型号：
ISL8563IB-T
+3V to +5.5V, 1Microamp, 250kbps, EIA/TIA-562, EIA/TIA-232 Transmitters/Receivers
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4A SWITCHING CONTROLLER, 2000kHz SWITCHING FREQ-MAX, PQCC40, 6 X 6 MM, ROHS COMPLIANT, PLASTIC, QFN-40
RENESAS
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