X9313ZMIZ-3 [INTERSIL]

Digitally Controlled Potentiometer; 数字控制电位器
X9313ZMIZ-3
型号: X9313ZMIZ-3
厂家: Intersil    Intersil
描述:

Digitally Controlled Potentiometer
数字控制电位器

电位器
文件: 总12页 (文件大小:277K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
X9313  
®
Digitally Controlled Potentiometer (XDCP™)  
Data Sheet  
April 18, 2007  
FN8177.5  
Linear, 32 Taps, 3 Wire Interface, Terminal  
Voltages ± V  
Features  
CC  
• Solid-state potentiometer  
• 3-wire serial interface  
• 32 wiper tap points  
The Intersil X9313 is a digitally controlled potentiometer  
(XDCP). The device consists of a resistor array, wiper  
switches, a control section, and nonvolatile memory. The  
wiper position is controlled by a 3-wire interface.  
- Wiper position stored in nonvolatile memory and  
recalled on power-up  
The potentiometer is implemented by a resistor array  
composed of 31 resistive elements and a wiper switching  
network. Between each element and at either end are tap  
points accessible to the wiper terminal. The position of the  
wiper element is controlled by the CS, U/D, and INC inputs.  
The position of the wiper can be stored in nonvolatile  
memory and then be recalled upon a subsequent power-up  
operation.  
• 31 resistive elements  
- Temperature compensated  
- End to end resistance range ±20%  
- Terminal voltages, -V  
to +V  
CC  
CC  
• Low power CMOS  
- V  
CC  
= 3V or 5V  
- Active current, 3mA max.  
- Standby current, 500µA max.  
The device can be used as a three-terminal potentiometer or  
as a two-terminal variable resistor in a wide variety of  
applications including:  
• High reliability  
- Endurance, 100,000 data changes per bit  
- Register data retention, 100 years  
• Control  
• R  
TOTAL  
values = 1kΩ, 10kΩ, 50kΩ  
• Parameter adjustments  
• Signal processing  
• Packages  
- 8 Ld SOIC, 8 Ld MSOP and 8 Ld PDIP  
• Pb-free plus anneal available (RoHS compliant)  
Block Diagram  
DECODER  
31  
5-BIT  
UP/DOWN  
COUNTER  
U/D  
INC  
CS  
R /V  
H
H
V
(SUPPLY VOLTAGE)  
CC  
30  
29  
28  
R /V  
H
H
UP/DOWN  
(U/D)  
5-BIT  
NONVOLATILE  
MEMORY  
CONTROL  
AND  
MEMORY  
ONE OF  
INCREMENT  
(INC)  
R
/V  
W
W
THIRTY-TWO  
OUTPUTS  
TRANSFER  
GATES  
RESISTOR  
ARRAY  
ACTIVE  
AT A  
TIME  
DEVICE SELECT  
(CS)  
R /V  
L
L
2
STORE AND  
RECALL  
CONTROL  
CIRCUITRY  
V
(GROUND)  
SS  
1
0
V
V
CC  
SS  
GENERAL  
R /V  
L
L
/V  
R
W
W
DETAILED  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.  
1
XDCP is a trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2005, 2006, 2007. All Rights Reserved  
All other trademarks mentioned are the property of their respective owners.  
X9313  
Ordering Information  
TEMPERATURE  
RANGE  
PART  
MARKING  
V
RANGE  
(V)  
R
PKG.  
DWG. #  
CC  
TOTAL  
(kΩ)  
PART NUMBER  
X9313UMI  
(°C)  
PACKAGE  
8 Ld MSOP  
13UI  
4.5 to 5.5  
50  
-40 to +85  
-40 to +85  
0 to +70  
M8.118  
X9313UMIZ (Note)  
X9313UP  
DDB  
8 Ld MSOP (Pb-free)  
8 Ld PDIP  
M8.118  
X9313UP  
X9313U  
X9313U Z  
X9313U I  
X9313U ZI  
DDF  
MDP0031  
MDP0027  
M8.15  
X9313US*  
0 to +70  
8 Ld SOIC  
X9313USZ* (Note)  
X9313USI  
0 to +70  
8 Ld SOIC (Pb-free)  
8 Ld SOIC  
-40 to +85  
-40 to +85  
0 to +70  
MDP0027  
M8.15  
X9313USIZ (Note)  
X9313WMZ (Note)  
X9313WMI*  
8 Ld SOIC (Pb-free)  
8 Ld MSOP (Pb-free)  
8 Ld MSOP  
10  
M8.118  
13WI  
-40 to +85  
-40 to +85  
0 to +70  
M8.118  
X9313WMIZ* (Note)  
X9313WP  
DDE  
8 Ld MSOP (Pb-free)  
8 Ld PDIP  
M8.118  
X9313WP  
X9313WP ZD  
X9313WP I  
X9313WP ZI  
X9313WS  
X9313W Z  
X9313WS I  
X9313WS ZI  
313Z  
MDP0031  
MDP0031  
MDP0031  
MDP0031  
MDP0027  
M8.15  
X9313WPZ-3  
X9313WPI  
-40 to +85  
-40 to +85  
-40 to +85  
0 to +70  
8 Ld PDIP*** (Pb-free)  
8 Ld PDIP  
X9313WPIZ  
8 Ld PDIP*** (Pb-free)  
8 Ld SOIC  
,
X9313WS* **  
,
X9313WSZ* ** (Note)  
0 to +70  
8 Ld SOIC (Pb-free)  
8 Ld SOIC  
X9313WSI*  
-40 to +85  
-40 to +85  
0 to +70  
MDP0027  
M8.15  
X9313WSIZ* (Note)  
X9313ZM  
8 Ld SOIC (Pb-free)  
8 Ld MSOP  
M8.118  
X9313ZMZ (Note)  
DDJ  
0 to +70  
8 Ld MSOP (Pb-free)  
8 Ld MSOP  
M8.118  
,
X9313ZMI* **  
13ZI  
1
-40 to +85  
-40 to +85  
0 to +70  
M8.118  
,
X9313ZMIZ* ** (Note)  
DDH  
8 Ld MSOP (Pb-free)  
8 Ld PDIP  
M8.118  
X9313ZP  
X9313ZP  
X9313ZP I  
X9313ZP ZI  
X9313ZS  
X9313 Z  
X9313ZS I  
X9313ZS ZI  
13UD  
MDP0031  
MDP0031  
MDP0031  
MDP0027  
M8.15  
X9313ZPI  
-40 to +85  
-40 to +85  
0 to +70  
8 Ld PDIP  
X9313ZPIZ (Note)  
8 Ld PDIP*** (Pb-free)  
8 Ld SOIC  
,
X9313ZS* **  
,
X9313ZSZ* ** (Note)  
0 to +70  
8 Ld SOIC (Pb-free)  
8 Ld SOIC  
X9313ZSI*  
-40 to +85  
-40 to +85  
0 to +70  
MDP0027  
M8.15  
X9313ZSIZ* (Note)  
X9313UM-3T1  
8 Ld SOIC (Pb-free)  
3 to 5.5  
50  
8 Ld MSOP Tape and Reel M8.118  
X9313UMZ-3T1 (Note)  
DDD  
0 to +70  
8 Ld MSOP Tape and Reel M8.118  
(Pb-free)  
X9313UMI-3*  
13UE  
-40 to +85  
-40 to +85  
0 to +70  
8 Ld MSOP  
M8.118  
M8.118  
MDP0027  
M8.15  
X9313UMIZ-3* (Note)  
13UEZ  
X9313U D  
X9313U ZD  
13WD  
8 Ld MSOP (Pb-free)  
8 Ld SOIC  
,
X9313US-3* **  
,
X9313USZ-3* ** (Note)  
0 to +70  
8 Ld SOIC (Pb-free)  
8 Ld MSOP  
X9313WM-3*  
10  
0 to +70  
M8.118  
M8.118  
M8.118  
X9313WMZ-3* (Note)  
X9313WMI-3*  
DDG  
0 to +70  
8 Ld MSOP (Pb-free)  
8 Ld MSOP  
13WE  
-40 to +85  
FN8177.5  
April 18, 2007  
2
X9313  
Ordering Information (Continued)  
TEMPERATURE  
RANGE  
PART  
MARKING  
V
RANGE  
(V)  
R
PKG.  
DWG. #  
CC  
TOTAL  
(kΩ)  
PART NUMBER  
X9313WMIZ-3* (Note)  
X9313WS-3*  
(°C)  
PACKAGE  
8 Ld MSOP (Pb-free)  
8 Ld SOIC  
13WEZ  
-40 to +85  
0 to +70  
0 to +70  
0 to +70  
0 to +70  
-40 to +85  
-40 to +85  
0 to +70  
0 to +70  
0 to +70  
0 to +70  
-40 to +85  
-40 to +85  
M8.118  
X9313W D  
X9313W ZD  
13ZD  
MDP0027  
M8.15  
X9313WSZ-3* (Note)  
X9313ZM-3*  
8 Ld SOIC (Pb-free)  
8 Ld MSOP  
3 to 5.5  
1
M8.118  
X9313ZMZ-3* (Note)  
X9313ZMI-3*  
DDK  
8 Ld MSOP (Pb-free)  
8 Ld MSOP  
M8.118  
13ZE  
M8.118  
X9313ZMIZ-3* (Note)  
X9313ZP-3  
13ZEZ  
8 Ld MSOP (Pb-free)  
8 Ld PDIP  
M8.118  
X9313ZP D  
X9313ZP ZD  
X9313Z D  
X9313Z ZD  
X9313Z E  
X9313Z ZE  
MDP0031  
MDP0031  
MDP0027  
M8.15  
X9313ZPZ-3 (Note)  
X9313ZS-3*  
8 Ld PDIP (Pb-free)***  
8 Ld SOIC  
X9313ZSZ-3* (Note)  
X9313ZSI-3*  
8 Ld SOIC (Pb-free)  
8 Ld SOIC  
MDP0027  
M8.15  
X9313ZSIZ-3* (Note)  
8 Ld SOIC (Pb-free)  
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate  
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL  
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.  
*Add "T1" suffix for tape and reel.  
**Add "T2" suffix for tape and reel.  
***Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.  
Chip Select (CS)  
Pin Descriptions  
The device is selected when the CS input is LOW. The current  
RH/VH and RL/VL  
counter value is stored in nonvolatile memory when CS is  
The high (RH/VH) and low (RL/VL) terminals of the X9313  
returned HIGH while the INC input is also HIGH. After the  
are equivalent to the fixed terminals of a mechanical  
potentiometer. The terminology of RL/VL and RH/VH  
references the relative position of the terminal in relation to  
store operation is complete the X9313 will be placed in the low  
power standby mode until the device is selected once again.  
wiper movement direction selected by the U/D input and not  
the voltage potential on the terminal.  
Pinouts  
X9313  
8 LD PDIP, 8 LD SOIC  
RW/VW  
TOP VIEW  
RW/VW is the wiper terminal and is equivalent to the  
movable terminal of a mechanical potentiometer. The  
position of the wiper within the array is determined by the  
control inputs. The wiper terminal series resistance is  
INC  
1
2
3
4
8
7
6
5
VCC  
U/D  
RH/VH  
VSS  
CS  
X9313  
RL/VL  
typically 40Ω at V  
= 5V.  
CC  
RW/VW  
Up/Down (U/D)  
The U/D input controls the direction of the wiper movement  
and whether the counter is incremented or decremented.  
X9313  
8 LD MSOP  
TOP VIEW  
Increment (INC)  
The INC input is negative-edge triggered. Toggling INC will  
move the wiper and either increment or decrement the  
counter in the direction indicated by the logic level on the  
U/D input.  
RH/VH  
U/D  
INC  
VCC  
1
8
7
6
5
VSS  
RW/VW  
RL/VL  
2
3
4
X9313  
CS  
FN8177.5  
April 18, 2007  
3
X9313  
TABLE 1. PIN NAMES  
DESCRIPTION  
The system may select the X9313, move the wiper and  
deselect the device without having to store the latest wiper  
position in nonvolatile memory. After the wiper movement is  
performed as described above and once the new position is  
reached, the system must keep INC LOW while taking CS  
HIGH. The new wiper position will be maintained until  
changed by the system or until a power-up/down cycle  
recalled the previously stored data.  
SYMBOL  
RH/VH  
RW/VW  
RL/VL  
VSS  
High terminal  
Wiper terminal  
Low terminal  
Ground  
VCC  
Supply voltage  
This procedure allows the system to always power-up to a  
preset value stored in nonvolatile memory; then during  
system operation minor adjustments could be made. The  
adjustments might be based on user preference, system  
parameter changes due to temperature drift, etc.  
U/D  
Up/Down control input  
Increment control input  
Chip Select control input  
INC  
CS  
The state of U/D may be changed while CS remains LOW.  
This allows the host system to enable the device and then  
move the wiper up and down until the proper trim is attained.  
Principles of Operation  
There are three sections of the X9313: the input control,  
counter and decode section; the nonvolatile memory; and  
the resistor array. The input control section operates just like  
an up/down counter. The output of this counter is decoded to  
turn on a single electronic switch connecting a point on the  
resistor array to the wiper output. Under the proper  
conditions the contents of the counter can be stored in  
nonvolatile memory and retained for future use. The resistor  
array is comprised of 31 individual resistors connected in  
series. At either end of the array and between each resistor  
is an electronic switch that transfers the potential at that  
point to the wiper.  
TABLE 2. MODE SELECTION  
CS  
INC  
U/D  
MODE  
L
H
Wiper up  
L
L
Wiper down  
H
X
Store wiper position  
H
X
L
X
X
Standby current  
No store, return to standby  
L
L
H
L
Wiper up (not recommended)  
Wiper down (not recommended)  
The wiper, when at either fixed terminal, acts like its  
mechanical equivalent and does not move beyond the last  
position. That is, the counter does not wrap around when  
clocked to either extreme.  
Symbol Table  
The electronic switches on the device operate in a “make  
before break” mode when the wiper changes tap positions. If  
the wiper is moved several positions, multiple taps are  
connected to the wiper for t (INC to V change). The  
WAVEFORM  
INPUTS  
OUTPUTS  
Must be  
steady  
Will be  
steady  
IW  
W
R
value for the device can temporarily be reduced by  
TOTAL  
a significant amount if the wiper is moved several positions.  
May change  
from Low to  
High  
Will change  
from Low to  
High  
When the device is powered-down, the last wiper position  
stored will be maintained in the nonvolatile memory. When  
power is restored, the contents of the memory are recalled  
and the wiper is set to the value last stored.  
May change  
from High to  
Low  
Will change  
from High to  
Low  
Don’t Care:  
Changes  
Allowed  
Changing:  
State Not  
Known  
Instructions and Programming  
The INC, U/D and CS inputs control the movement of the  
wiper along the resistor array. With CS set LOW the device  
is selected and enabled to respond to the U/D and INC  
inputs. HIGH to LOW transitions on INC will increment or  
decrement (depending on the state of the U/D input) a seven  
bit counter. The output of this counter is decoded to select  
one of thirty-two wiper positions along the resistive array.  
N/A  
Center Line  
is High  
Impedance  
The value of the counter is stored in nonvolatile memory  
whenever CS transitions HIGH while the INC input is also  
HIGH.  
FN8177.5  
April 18, 2007  
4
X9313  
Absolute Maximum Ratings  
Recommended Operating Conditions  
Temperature Under Bias . . . . . . . . . . . . . . . . . . . . .-65°C to +135°C  
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C  
Voltage on CS, INC, U/D, and  
Temperature:  
Commercial. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C  
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C  
Supply Voltage (VCC):  
X9313 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5V ±10%  
X9313-3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3V to 5.5V  
Max Wiper current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±4.4mA  
Power rating:  
V
with respect to V . . . . . . . . . . . . . . . . . . . . . . . . -1V to +7V  
SS  
CC  
Voltage on V , V , V  
W
H
L
with respect to V . . . . . . . . . . . . . . . . . . . . . . . . . . . . -6V to +7V  
SS  
ΔV = |V - V |:  
H
L
X9313Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4V  
X9313W, X9313U . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10V  
Lead Temperature (soldering 10s). . . . . . . . . . . . . . . . . . . . .+300°C  
R
R
10kΩ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10mW  
1kΩ. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16mW  
TOTAL  
TOTAL  
I
(10s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±8.8mA  
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below  
http://www.intersil.com/pbfree/Pb-FreeReflow.asp  
Pb-free PDIPs can be used for through hole wave solder processing  
only. They are not intended for use in Reflow solder processing  
applications  
W
ESD Rating  
Human Body Model (Per MIL-STD-883 Method 3015.7) . . . 2.0kV  
Machine Model (Per EIAJ ED-4701 Method C-111). . . . . . . .200V  
CAUTION: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only; functional  
operation of the device (at these or any other conditions above those listed in the operational sections of this specification) is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect device reliability.  
Potentiometer CharacteristicsOver recommended operating conditions unless otherwise stated.  
LIMITS  
SYMBOL  
PARAMETER  
TEST CONDITIONS/NOTES  
MIN  
TYP  
MAX  
UNIT  
%
End-to-end resistance tolerance  
±20  
V
V
V
terminal voltage  
terminal voltage  
-V  
+V  
CC  
V
VH  
H
L
CC  
V
-V  
+V  
CC  
V
VL  
CC  
R
Wiper resistance  
Wiper current  
I
= (V - V )/R  
, V  
= 5V  
40  
100  
Ω
W
W
H
L
TOTAL CC  
I
±4.4  
mA  
dBV  
%
W
Noise (Note 5)  
Ref: 1kHz  
-120  
3
Resolution  
Absolute linearity (Note 1)  
R
R
- R  
±1  
MI  
(Note 3)  
W(n)(actual)  
W(n)(expected)  
Relative linearity (Note 2)  
- (R  
+MI)  
±0.2  
MI  
W(n+1)  
W(n)  
(Note 3)  
R
temperature coefficient (Note 5)  
±300  
±20  
ppm/°C  
ppm/°C  
TOTAL  
Ratiometric temperature coefficient  
(Note 5)  
C /C /C  
W
Potentiometer capacitances  
See Circuit #3  
10/10/25  
pF  
H
L
(Note 5)  
NOTES:  
1. Absolute linearity is utilized to determine actual wiper voltage versus expected voltage = (V  
- V  
) = ±1 MI maximum.  
W(n)(actual)  
+ MI) = ±0.2 MI.  
W(n)(expected)  
2. Relative linearity is a measure of the error in step size between taps = R  
W(n+1)  
- (R  
W(n)  
3. 1 MI = minimum increment = R  
/31.  
TOT  
FN8177.5  
April 18, 2007  
5
X9313  
DC Operating Characteristics Over recommended operating conditions unless otherwise stated.  
LIMITS  
TYP  
SYMBOL  
PARAMETER  
active current  
TEST CONDITIONS/NOTES  
MIN  
(Note 4)  
MAX  
UNIT  
I
V
CS = V , U/D = V or V and  
1
3
mA  
CC  
CC  
IL IL IH  
INC = 0.42/2.4V @ max t  
CYC  
I
Standby supply current  
CS = V  
- 0.3V, U/D and INC = V or  
SS  
200  
500  
±10  
µA  
SB  
CC  
- 0.3V  
V
CC  
I
CS, INC, U/D input leakage current  
CS, INC, U/D input HIGH current  
CS, INC, U/D input LOW current  
CS, INC, U/D input capacitance  
V
= V to V  
SS CC  
µA  
V
LI  
IN  
V
2
IH  
V
+0.8  
V
IL  
C
V
= 5V, V = V , T = +25°C,  
IN SS  
10  
pF  
IN  
CC  
A
(Note 5)  
f = 1MHz  
Endurance and Data Retention  
PARAMETER  
MIN  
UNIT  
Minimum endurance  
100,000  
Data changes per bit  
per register  
Data retention  
100  
Years  
V
/R  
H
H
R
TOTAL  
V
/R  
H
H
TEST POINT  
/R  
FORCE  
CURRENT  
R
R
L
H
C
L
C
W
C
H
10pF  
V
S
V
TEST POINT  
/R  
W
W
25pF  
V
W
W
10pF  
V /R  
L
L
V /R  
R
L
L
W
FIGURE 1. TEST CIRCUIT #1  
FIGURE 2. TEST CIRCUIT #2  
FIGURE 3. CIRCUIT #3 SPICE MACRO  
MODEL  
FN8177.5  
April 18, 2007  
6
X9313  
AC Operating Characteristics Over recommended operating conditions unless otherwise stated.  
LIMITS  
TYP  
SYMBOL  
PARAMETER  
MIN  
100  
100  
2.9  
1
(Note 4)  
MAX  
UNIT  
ns  
t
t
t
CS to INC setup  
CI  
ID  
DI  
INC HIGH to U/D change  
U/D to INC setup  
INC LOW period  
ns  
µs  
t
µs  
IL  
IH  
IC  
t
t
INC HIGH period  
1
µs  
INC inactive to CS inactive  
CS deselect time (STORE)  
CS deselect time (NO STORE)  
1
µs  
t
t
20  
100  
ms  
ns  
CPH  
CPH  
t
INC to V change  
W
5
µs  
IW  
t
INC cycle time  
2
µs  
CYC  
t , t (Note 5)  
INC input rise and fall time  
Power-up to wiper stable  
500  
50  
µs  
R
F
t
(Note 5)  
10  
10  
µs  
PU  
t
V
(Note 5)  
V
power-up rate  
0.2  
V/ms  
ms  
R
CC  
CC  
t
(Note 5)  
Store cycle  
WR  
NOTES:  
4. Typical values are for T = +25°C and nominal supply voltage.  
A
5. This parameter is not 100% tested.  
1ms after V  
CC  
reaches its final value. The V  
CC  
ramp spec is  
Power-Up and Power-Down Requirements  
always in effect. In order to prevent unwanted tap position  
changes, or an inadvertent store, bring the CS and INC high  
before or concurrently with the VCC pin on power-up.  
The recommended power-up sequence is to apply V /V  
CC SS  
first, then the potentiometer voltages. During power-up, the  
data sheet parameters for the DCP do not fully apply until  
CS  
t
CYC  
t
t
t
t
t
CPH  
CI  
IL  
IH  
IC  
90%  
90%  
INC  
U/D  
10%  
t
t
t
t
R
ID  
DI  
F
t
IW  
(SEE NOTE)  
MI  
V
W
NOTE: MI IN THE AC TIMING DIAGRAM REFERS TO THE MINIMUM INCREMENTAL CHANGE IN THE V OUTPUT DUE TO A CHANGE IN THE WIPER  
W
POSITION.  
FIGURE 4. AC TIMING DIAGRAM  
FN8177.5  
April 18, 2007  
7
X9313  
computer-based digital controls, and (3) the retentivity of  
nonvolatile memory used for the storage of multiple  
potentiometer settings or data.  
Applications Information  
Electronic digitally controlled potentiometers (XDCP) provide  
three powerful application advantages; (1) the variability and  
reliability of a solid-state potentiometer, (2) the flexibility of  
Basic Configurations of Electronic Potentiometers  
V
R
V
R
V
H
L
V
/R  
W
W
V
I
THREE-TERMINAL POTENTIOMETER;  
VARIABLE VOLTAGE DIVIDER  
TWO-TERMINAL VARIABLE RESISTOR;  
VARIABLE CURRENT  
Basic Circuits  
BUFFERED REFERENCE VOLTAGE  
CASCADING TECHNIQUES  
NONINVERTING AMPLIFIER  
R
+V  
+V  
+5V  
1
LM308A  
V
+V  
+
S
+5V  
V
O
VW  
OP-07  
+
V
X
REF  
-5V  
VW/RW  
V
OUT  
R
2
+V  
-5V  
R
1
V
W
V
= V /R  
W W  
OUT  
(a)  
(b)  
V
= (1 + R R )V  
2/ S  
O
1
VOLTAGE REGULATOR  
OFFSET VOLTAGE ADJUSTMENT  
COMPARATOR WITH HYSTERESIS  
R
R
2
1
LT311A  
V
S
V
S
V
V
(REG)  
V
O
317  
IN  
O
+
100kΩ  
R
1
+
V
O
TL072  
I
adj  
R
R
2
1
10kΩ  
10kΩ  
R
2
10kΩ  
V
V
= [R (R + R )] V (max)  
1/ 1 2 O  
UL  
LL  
= [R (R + R )] V (min)  
1/  
1
2
O
V
(REG) = 1.25V (1 + R R ) + I R  
2/ ADJ 2  
O
1
+12V  
-12V  
(FOR ADDITIONAL CIRCUITS SEE AN115)  
FN8177.5  
April 18, 2007  
8
X9313  
Mini Small Outline Plastic Packages (MSOP)  
N
M8.118 (JEDEC MO-187AA)  
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE  
INCHES  
MILLIMETERS  
E1  
E
SYMBOL  
MIN  
MAX  
MIN  
0.94  
0.05  
0.75  
0.25  
0.09  
2.95  
2.95  
MAX  
1.10  
0.15  
0.95  
0.36  
0.20  
3.05  
3.05  
NOTES  
A
A1  
A2  
b
0.037  
0.002  
0.030  
0.010  
0.004  
0.116  
0.116  
0.043  
0.006  
0.037  
0.014  
0.008  
0.120  
0.120  
-
-B-  
0.20 (0.008)  
INDEX  
AREA  
1 2  
A
B
C
-
-
TOP VIEW  
4X θ  
9
0.25  
(0.010)  
R1  
c
-
R
GAUGE  
PLANE  
D
3
E1  
e
4
SEATING  
PLANE  
L
0.026 BSC  
0.65 BSC  
-
-C-  
4X θ  
L1  
A
A2  
E
0.187  
0.016  
0.199  
0.028  
4.75  
0.40  
5.05  
0.70  
-
L
6
SEATING  
PLANE  
L1  
N
0.037 REF  
0.95 REF  
-
0.10 (0.004)  
-A-  
C
C
b
8
8
7
-H-  
A1  
e
R
0.003  
0.003  
-
-
0.07  
0.07  
-
-
-
D
0.20 (0.008)  
C
R1  
0
-
o
o
o
o
5
15  
5
15  
-
a
SIDE VIEW  
C
L
o
o
o
o
0
6
0
6
-
α
E
1
-B-  
Rev. 2 01/03  
0.20 (0.008)  
C
D
END VIEW  
NOTES:  
1. These package dimensions are within allowable dimensions of  
JEDEC MO-187BA.  
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.  
3. Dimension “D” does not include mold flash, protrusions or gate  
burrs and are measured at Datum Plane. Mold flash, protrusion  
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.  
4. Dimension “E1” does not include interlead flash or protrusions  
- H -  
and are measured at Datum Plane.  
Interlead flash and  
protrusions shall not exceed 0.15mm (0.006 inch) per side.  
5. Formed leads shall be planar with respect to one another within  
0.10mm (0.004) at seating Plane.  
6. “L” is the length of terminal for soldering to a substrate.  
7. “N” is the number of terminal positions.  
8. Terminal numbers are shown for reference only.  
9. Dimension “b” does not include dambar protrusion. Allowable  
dambar protrusion shall be 0.08mm (0.003 inch) total in excess  
of “b” dimension at maximum material condition. Minimum space  
between protrusion and adjacent lead is 0.07mm (0.0027 inch).  
- B -  
to be determined at Datum plane  
-A -  
10. Datums  
and  
.
- H -  
11. Controlling dimension: MILLIMETER. Converted inch dimen-  
sions are for reference only.  
FN8177.5  
April 18, 2007  
9
X9313  
Small Outline Plastic Packages (SOIC)  
M8.15 (JEDEC MS-012-AA ISSUE C)  
N
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE  
INDEX  
AREA  
0.25(0.010)  
M
B M  
H
INCHES  
MILLIMETERS  
E
SYMBOL  
MIN  
MAX  
MIN  
1.35  
0.10  
0.33  
0.19  
4.80  
3.80  
MAX  
1.75  
0.25  
0.51  
0.25  
5.00  
4.00  
NOTES  
-B-  
A
A1  
B
C
D
E
e
0.0532  
0.0040  
0.013  
0.0688  
0.0098  
0.020  
-
-
1
2
3
L
9
SEATING PLANE  
A
0.0075  
0.1890  
0.1497  
0.0098  
0.1968  
0.1574  
-
-A-  
3
h x 45°  
D
4
-C-  
0.050 BSC  
1.27 BSC  
-
α
H
h
0.2284  
0.0099  
0.016  
0.2440  
0.0196  
0.050  
5.80  
0.25  
0.40  
6.20  
0.50  
1.27  
-
e
A1  
C
5
B
0.10(0.004)  
L
6
0.25(0.010) M  
C
A M B S  
N
α
8
8
7
NOTES:  
0°  
8°  
0°  
8°  
-
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of  
Publication Number 95.  
Rev. 1 6/05  
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
3. Dimension “D” does not include mold flash, protrusions or gate burrs.  
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006  
inch) per side.  
4. Dimension “E” does not include interlead flash or protrusions. Inter-  
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per  
side.  
5. The chamfer on the body is optional. If it is not present, a visual index  
feature must be located within the crosshatched area.  
6. “L” is the length of terminal for soldering to a substrate.  
7. “N” is the number of terminal positions.  
8. Terminal numbers are shown for reference only.  
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater  
above the seating plane, shall not exceed a maximum value of  
0.61mm (0.024 inch).  
10. Controlling dimension: MILLIMETER. Converted inch dimensions  
are not necessarily exact.  
FN8177.5  
April 18, 2007  
10  
X9313  
Small Outline Package Family (SO)  
A
D
h X 45°  
(N/2)+1  
N
A
PIN #1  
I.D. MARK  
E1  
E
c
SEE DETAIL “X”  
1
(N/2)  
B
L1  
0.010 M  
C A B  
e
H
C
A2  
A1  
GAUGE  
PLANE  
SEATING  
PLANE  
0.010  
L
4° ±4°  
0.004 C  
b
0.010 M  
C
A
B
DETAIL X  
MDP0027  
SMALL OUTLINE PACKAGE FAMILY (SO)  
INCHES  
SO16  
(0.150”)  
SO16 (0.300”)  
(SOL-16)  
SO20  
SO24  
(SOL-24)  
SO28  
(SOL-28)  
SYMBOL  
SO-8  
0.068  
0.006  
0.057  
0.017  
0.009  
0.193  
0.236  
0.154  
0.050  
0.025  
0.041  
0.013  
8
SO-14  
0.068  
0.006  
0.057  
0.017  
0.009  
0.341  
0.236  
0.154  
0.050  
0.025  
0.041  
0.013  
14  
(SOL-20)  
0.104  
0.007  
0.092  
0.017  
0.011  
0.504  
0.406  
0.295  
0.050  
0.030  
0.056  
0.020  
20  
TOLERANCE  
MAX  
NOTES  
A
A1  
A2  
b
0.068  
0.006  
0.057  
0.017  
0.009  
0.390  
0.236  
0.154  
0.050  
0.025  
0.041  
0.013  
16  
0.104  
0.007  
0.092  
0.017  
0.011  
0.406  
0.406  
0.295  
0.050  
0.030  
0.056  
0.020  
16  
0.104  
0.007  
0.092  
0.017  
0.011  
0.606  
0.406  
0.295  
0.050  
0.030  
0.056  
0.020  
24  
0.104  
0.007  
0.092  
0.017  
0.011  
0.704  
0.406  
0.295  
0.050  
0.030  
0.056  
0.020  
28  
-
±0.003  
±0.002  
±0.003  
±0.001  
±0.004  
±0.008  
±0.004  
Basic  
-
-
-
c
-
D
1, 3  
E
-
E1  
e
2, 3  
-
L
±0.009  
Basic  
-
L1  
h
-
Reference  
Reference  
-
N
-
Rev. M 2/07  
NOTES:  
1. Plastic or metal protrusions of 0.006” maximum per side are not included.  
2. Plastic interlead protrusions of 0.010” maximum per side are not included.  
3. Dimensions “D” and “E1” are measured at Datum Plane “H”.  
4. Dimensioning and tolerancing per ASME Y14.5M-1994  
FN8177.5  
April 18, 2007  
11  
X9313  
Plastic Dual-In-Line Packages (PDIP)  
E
N
1
D
PIN #1  
INDEX  
A2  
A
E1  
SEATING  
PLANE  
L
c
A1  
NOTE 5  
2
N/2  
eA  
eB  
e
b
b2  
MDP0031  
PLASTIC DUAL-IN-LINE PACKAGE  
INCHES  
SYMBOL  
PDIP8  
0.210  
0.015  
0.130  
0.018  
0.060  
0.010  
0.375  
0.310  
0.250  
0.100  
0.300  
0.345  
0.125  
8
PDIP14  
0.210  
0.015  
0.130  
0.018  
0.060  
0.010  
0.750  
0.310  
0.250  
0.100  
0.300  
0.345  
0.125  
14  
PDIP16  
0.210  
0.015  
0.130  
0.018  
0.060  
0.010  
0.750  
0.310  
0.250  
0.100  
0.300  
0.345  
0.125  
16  
PDIP18  
PDIP20  
0.210  
0.015  
0.130  
0.018  
0.060  
0.010  
1.020  
0.310  
0.250  
0.100  
0.300  
0.345  
0.125  
20  
TOLERANCE  
MAX  
NOTES  
A
A1  
A2  
b
0.210  
0.015  
0.130  
0.018  
0.060  
0.010  
0.890  
0.310  
0.250  
0.100  
0.300  
0.345  
0.125  
18  
MIN  
±0.005  
±0.002  
b2  
c
+0.010/-0.015  
+0.004/-0.002  
±0.010  
D
1
2
E
+0.015/-0.010  
±0.005  
E1  
e
Basic  
eA  
eB  
L
Basic  
±0.025  
±0.010  
N
Reference  
Rev. C 2/07  
NOTES:  
1. Plastic or metal protrusions of 0.010” maximum per side are not included.  
2. Plastic interlead protrusions of 0.010” maximum per side are not included.  
3. Dimensions E and eA are measured with the leads constrained perpendicular to the seating plane.  
4. Dimension eB is measured with the lead tips unconstrained.  
5. 8 and 16 lead packages have half end-leads as shown.  
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.  
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without  
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and  
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result  
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see www.intersil.com  
FN8177.5  
April 18, 2007  
12  

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