X95820_06 [INTERSIL]
Dual Digital Controlled Potentiometers; 双通道数字电位器型号: | X95820_06 |
厂家: | Intersil |
描述: | Dual Digital Controlled Potentiometers |
文件: | 总12页 (文件大小:1118K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
X95820
®
Dual Digital Controlled Potentiometers (XDCP™)
Data Sheet
July 18, 2006
FN8212.2
2
Low Noise/Low Power/I C® Bus/256 Taps
Features
The X95820 integrates two digitally controlled
potentiometers (XDCP) on a monolithic CMOS integrated
circuit.
• Two potentiometers in one package
• 256 resistor taps-0.4% resolution
2
• I C serial interface
The digitally controlled potentiometers are implemented with
a combination of resistor elements and CMOS switches. The
position of the wipers are controlled by the user through the
- Three address pins, up to eight devices/bus
• Wiper resistance: 70Ω typical @ 3.3V
• Non-volatile storage of wiper position
• Standby current < 5µA max
2
I C bus interface. Each potentiometer has an associated
volatile Wiper Register (WR) and a non-volatile Initial Value
Register (IVR), that can be directly written to and read by the
user. The contents of the WR controls the position of the
wiper. At power up the device recalls the contents of the two
DCP’s IVR to the corresponding WRs.
• Power supply: 2.7V to 5.5V
• 50kΩ, 10kΩ total resistance
• High reliability
The DCPs can be used as three-terminal potentiometers or
as two-terminal variable resistors in a wide variety of
applications including control, parameter adjustments, and
signal processing.
- Endurance: 150,000 data changes per bit per register
- Register data retention: 50 years @ T ≤ 75°C
• 14 Ld TSSOP
• Pb-free plus anneal available (RoHS compliant)
Ordering Information
PART
MARKING
RESISTANCE
OPTION
Pinouts
PART NUMBER
PACKAGE
X95820
(14 LD TSSOP)
TOP VIEW
X95820WV14I-2.7* X95820WV G
10kΩ
10kΩ
14 Ld TSSOP
X95820WV14IZ-2.7* X95820WV Z G
(Note)
14 Ld TSSOP
(Pb-free)
V
CC
14
13
1
2
3
4
5
6
7
A1
WP
RH0
RL0
X95820UV14I-2.7* X95820UV G
50kΩ
50kΩ
14 Ld TSSOP
A0
RH1
12
11
X95820UV14IZ-2.7* X95820UV Z G
(Note)
14 Ld TSSOP
(Pb-free)
RL1
RW1
GND
RW0
10
9
*Add "T1" suffix for tape and reel.
A2
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations. Intersil
Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
SCL
SDA
8
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
XDCP is a trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2005-2006. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
1
X95820
Block Diagram
V
CC
2
R
R
I C
H1
POWER-UP,
INTERFACE,
CONTROL AND
STATUS LOGIC
INTERFACE
WR1
W1
SDA
SCL
R
L1
A2
A1
A0
R
R
R
H0
W0
L0
WR0
NON-VOLATILE
REGISTERS
WP
GND
PiN Descriptions
PIN
SYMBOL
DESCRIPTION
1
V
Power supply pin
CC
2
2
WP
RH0
RL0
RW0
A2
Hardware write protection pin. Active low. Prevents any “Write” operation of the I C interface.
3
“High” terminal of DCP0
“Low” terminal of DCP0
“Wiper” terminal of DCP0
4
5
2
6
Device address for the I C interface
2
7
SCL
SDA
GND
RW1
RL1
RH1
A0
I C interface clock
2
8
Serial data I/O for the I C interface
9
Ground
10
11
12
13
14
“Wiper” terminal of DCP1
“Low” terminal of DCP1
“High” terminal of DCP1
2
Device address for the I C interface
2
A1
Device address for the I C interface
FN8212.2
July 18, 2006
2
X95820
Absolute Maximum Ratings
Recommended Operating Conditions
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Temperature Range (Industrial). . . . . . . . . . . . . . . . . .-40°C to 85°C
Voltage at Any Digital Interface Pin
V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V
CC
with Respect to GND . . . . . . . . . . . . . . . . . . . . . . . -0.3V to V +0.3
Power Rating of Each DCP . . . . . . . . . . . . . . . . . . . . . . . . . . . .5mW
Wiper Current of Each DCP. . . . . . . . . . . . . . . . . . . . . . . . . .±3.0mA
CC
V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3V to +6V
CC
Voltage at Any DCP Pin with Respect to GND . . . . . . -0.3V to V
CC
Lead Temperature (soldering, 10s) . . . . . . . . . . . . . . . . . . . . .300°C
(10s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±6mA
I
W
CAUTION: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only; functional
operation of the device (at these or any other conditions above those listed in the operational sections of this specification) is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Analog Specifications Over recommended operating conditions unless otherwise stated.
TYP
SYMBOL
PARAMETER
to R Resistance
TEST CONDITIONS
W, U versions respectively
MIN
(Note 1)
MAX
UNIT
kΩ
%
R
R
R
10, 50
TOTAL
H
L
to R Resistance Tolerance
-20
+20
200
H
L
R
Wiper Resistance
V
= 3.3V @ 25°C
70
Ω
W
CC
Wiper current = V /R
CC TOTAL
C /C /C
W
Potentiometer Capacitance (Note 15)
Leakage on DCP Pins (Note 15)
10/10/25
0.1
pF
µA
H
L
I
Voltage at pin from GND to V
1
LkgDCP
CC
VOLTAGE DIVIDER MODE (0V @ RL ; V
@ RH ; measured at RW , unloaded; i = 0 or 1)
i
CC
i
i
INL (Note 6) Integral Non-linearity
-1
1
LSB
(Note 2)
DNL (Note 5) Differential Non-linearity
Monotonic over all tap positions
-0.5
0.5
LSB
(Note 2)
ZSerror
(Note 3)
Zero-scale Error
U option
W option
U option
W option
0
0
1
0.5
-1
7
2
0
0
2
LSB
(Note 2)
FSerror
(Note 4)
Full-scale Error
-7
-2
-2
LSB
(Note 2)
-1
V
DCP to DCP Matching
Any two DCPs at same tap position, same
voltage at all RH terminals, and same
voltage at all RL terminals
LSB
(Note 2)
MATCH
(Note 7)
TC (Note 8) Ratiometric Temperature Coefficient
DCP Register set to 80 hex
±4
ppm/°C
V
RESISTOR MODE (Measurements between RW and RL with RH not connected, or between RW and RH with RL not
i
i
i
i
i
i
connected. i = 0 or 1)
RINL
(Note 12)
Integral Non-linearity
DCP register set between 20 hex and
FF hex. Monotonic over all tap positions
-1
-0.5
0
1
0.5
7
MI
(Note 9)
RDNL
(Note 11)
Differential Non-linearity
Offset
MI
(Note 9)
Roffset
(Note 10)
DCP Register set to 00 hex, U option
DCP Register set to 00 hex, W option
1
MI
(Note 9)
0
0.5
2
MI
(Note 9)
R
DCP to DCP Matching
Any two DCPs at the same tap position with
the same terminal voltages.
-2
2
MI
(Note 9)
MATCH
(Note 13)
TC
(Note 14)
Resistance Temperature Coefficient
DCP register set between 20 hex and FF
hex
±45
ppm/°C
R
FN8212.2
July 18, 2006
3
X95820
Operating Specifications Over the recommended operating conditions unless otherwise specified.
TYP
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
(Note 1)
MAX
UNITS
2
I
V
Supply Current
f
= 400kHz;SDA = Open; (for I C,
1
mA
CC1
CC
SCL
(Volatile write/read)
Active, Read and Volatile Write States only)
2
I
V
Supply Current
f
= 400kHz; SDA = Open; (for I C,
SCL
3
mA
CC2
CC
(nonvolatile write)
Active, Nonvolatile Write State only)
2
I
V
Current (standby)
V
V
= +5.5V, I C Interface in Standby State
5
2
µA
µA
µA
SB
CC
CC
CC
2
= +3.6V, I C Interface in Standby State
I
Leakage Current, at Pins A0, Voltage at pin from GND to V
-10
10
LkgDig
CC
A1, A2, SDA, SCL, and WP
Pins
t
DCP Wiper Response Time SCL falling edge of last bit of DCP Data Byte to
wiper change
1
µs
DCP
(Note 15)
Vpor
Power-on Recall Voltage
Ramp Rate
Minimum V
at which memory recall occurs
1.8
0.2
2.6
V
CC
VccRamp
V
V/ms
ms
CC
t
(Note 15) Power-up Delay
V
above Vpor, to DCP Initial Value Register recall
CC
3
D
2
completed, and I C Interface in standby state
EEPROM SPECS
EEPROM Endurance
EEPROM Retention
SERIAL INTERFACE SPECS
150,000
50
Cycles
Years
Temperature ≤ 75°C
V
WP, A2, A1, A0, SDA, and
SCL input buffer LOW
voltage
-0.3
0.3*Vcc
Vcc+0.3
V
V
IL
V
WP, A2, A1, A0, SDA, and
SCL Input Buffer HIGH
Voltage
0.7*Vcc
IH
Hysterisis
(Note 15)
SDA and SCL input buffer
hysterisis
0.05*
Vcc
V
V
V
SDA Output Buffer LOW
Voltage, Sinking 4mA
0
0.4
10
OL
(Note 15)
Cpin
(Note 15)
WP, A2, A1, A0, SDA, and
SCL Pin Capacitance
pF
f
SCL Frequency
400
50
kHz
ns
SCL
t
Pulse Width Suppression
Time at SDA and SCL Inputs suppressed.
Any pulse narrower than the max spec is
IN
(Note 15)
t
SCL Falling Edge to SDA
Output Data Valid
SCL falling edge crossing 30% of V , until SDA
CC
900
ns
ns
AA
(Note 15)
exits the 30% to 70% of V
window.
CC
t
Time the Bus Must be Free SDA crossing 70% of V
Before the Start of a New
Transmission
during a STOP condition,
1300
BUF
(Note 15)
CC
to SDA crossing 70% of V
during the following
CC
START condition.
t
Clock LOW Time
Clock HIGH Time
Measured at the 30% of V
Measured at the 70% of V
crossing.
crossing.
1300
600
ns
ns
ns
LOW
CC
t
HIGH
CC
t
START Condition Setup
Time
SCL rising edge to SDA falling edge. Both crossing
70% of V
600
SU:STA
.
CC
t
START Condition Hold Time From SDA falling edge crossing 30% of V
to SCL
600
ns
HD:STA
CC
falling edge crossing 70% of V
.
CC
FN8212.2
July 18, 2006
4
X95820
Operating Specifications Over the recommended operating conditions unless otherwise specified. (Continued)
TYP
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
(Note 1)
MAX
UNITS
t
Input Data Setup Time
From SDA exiting the 30% to 70% of V
window, to SCL rising edge crossing 30% of V
100
ns
SU:DAT
HD:DAT
SU:STO
HD:STO
CC
CC
t
Input Data Hold Time
From SCL rising edge crossing 70% of V
to SDA
0
ns
ns
ns
ns
ns
ns
pF
kΩ
CC
window.
entering the 30% to 70% of V
CC
t
STOP Condition Setup Time From SCL rising edge crossing 70% of V , to SDA
CC
600
600
0
rising edge crossing 30% of V
.
CC
STOP Condition Setup Time From SDA rising edge to SCL falling edge. Both
crossing 70% of V
t
.
CC
t
(Note 15) Output Data Hold Time
From SCL falling edge crossing 30% of V , until
DH
CC
window.
SDA enters the 30% to 70% of V
CC
t
(Note 15) SDA and SCL Rise Time
(Note 15) SDA and SCL Fall Time
From 30% to 70% of V
20 +
0.1 * Cb
250
250
400
R
CC
t
From 70% to 30% of V
20 +
0.1 * Cb
F
CC
Cb (Note 15) Capacitive Loading of SDA
or SCL
Total on-chip and off-chip
10
1
Rpu (Note 15) SDA and SCL Bus Pull-up
resIstor Off-chip
Maximum is determined by t and t .
R F
For Cb = 400pF, max is about 2~2.5kΩ.
For Cb = 40pF, max is about 15~20kΩ.
t
Non-volatile Write Cycle
12
20
ms
ns
ns
WP
(Notes 15, 16) Time
t
A2, A1, A0, and WP Setup
Time
Before START condition
After STOP condition
600
600
SU:WPA
t
A2, A1, A0, and WP Hold
Time
HD:WPA
SDA vs. SCL Timing
t
t
t
t
R
F
HIGH
LOW
SCL
t
SU:DAT
t
t
t
SU:STO
SU:STA
HD:DAT
t
HD:STA
SDA
(INPUT TIMING)
t
t
t
BUF
AA
DH
SDA
(OUTPUT TIMING)
WP, A0, A1, and A2 Pin Timing
STOP
START
SCL
Clk 1
SDA IN
t
t
HD:WPA
SU:WPA
WP, A0, A1, or A2
FN8212.2
July 18, 2006
5
X95820
NOTES:
1. Typical values are for T = 25°C and 3.3V supply voltage.
A
2. LSB: [V(RW)
255
- V(RW) ] / 255. V(RW) and V(RW) are V(RW) for the DCP register set to FF hex and 00 hex respectively. LSB is the
255 0
0
incremental voltage when changing from one tap to an adjacent tap.
3. ZS error = V(RW) / LSB.
0
4. FS error = [V(RW)
255
- V ] / LSB.
CC
5. DNL = [V(RW) - V(RW) ] / LSB-1, for i = 1 to 255. i is the DCP register setting.
i-1
i
6. INL = [V(RW) – (i • LSB – V(RW) )]/LSB for i = 1 to 255.
i
0
7. V
= [V(RWx) - V(RWy) ] / LSB, for i = 0 to 255, x = 0 to 1 and y = 0 to 1.
i i
MATCH
Max(V(RW) ) – Min(V(RW) )
6
10
i
i
--------------------------------------------------------------------------------------------- ----------------
TC
=
×
8.
V
[Max(V(RW) ) + Min(V(RW) )] ⁄ 2 125°C
i
i
for i = 16 to 240 decimal, T = -40°C to 85°C. Max( ) is the maximum value of the wiper voltage and Min ( ) is the minimum value of the wiper
voltage over the temperature range.
9. MI = |R
- R | / 255. R
and R are the measured resistances for the DCP register set to FF hex and 00 hex respectively.
255 0
255
0
10. Roffset = R / MI, when measuring between RW and RL.
0
Roffset = R
/ MI, when measuring between RW and RH.
255
11. RDNL = (R - R ) / MI, for i = 32 to 255.
i
i-1
12. RINL = [R - (MI • i) - R ] / MI, for i = 32 to 255.
i
0
13. R
14.
= (R - R ) / MI, for i = 0 to 255, x = 0 to 1 and y = 0 to 1.
i,x i,y
MATCH
6
[Max(Ri) – Min(Ri)]
10
--------------------------------------------------------------- ----------------
TC
=
×
R
125°C
[Max(Ri) + Min(Ri)] ⁄ 2
for i = 32 to 255, T = -40°C to 85°C. Max( ) is the maximum value of the resistance and Min ( ) is the minimum value of the resistance over the
temperature range.
15. This parameter is not 100% tested.
16. t
is the minimum cycle time to be allowed for any non-volatile Write by the user, unless Acknowledge Polling is used. It is the time from a
WC
2
valid STOP condition at the end of a Write sequence of a I C serial interface Write operation, to the end of the self-timed internal non-volatile
write cycle.
Typical Performance Curves
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
160
140
120
100
80
V
= 2.7, T = 85°C
CC
V
= 2.7, T = -40°C
CC
V = 2.7, T = 25°C
CC
-40°C
85°C
60
40
V
= 5.5, T = 85°C
CC
= 5.5, T = 25°C
20
25°C
V
= 5.5, T = -40°C
V
CC
CC
0
2.7
3.2
3.7
4.2
(V)
4.7
5.2
0
50
100
150
200
250
V
CC
TAP POSITION (DECIMAL)
FIGURE 2. STANDBY I
vs V
CC
FIGURE 1. WIPER RESISTANCE vs TAP POSITION
[ I(RW) = V /R ] FOR 50kΩ (U)
CC
CC TOTAL
FN8212.2
July 18, 2006
6
X95820
Typical Performance Curves (Continued)
0.3
0.2
0.1
0
0.2
V
= 2.7, T = -40°C
CC
= 5.5, T = -40°C
V
= 5.5, T = -40°C
CC
V
= 2.7, T = -40°C
CC
V
V
= 5.5, T = 85°C
CC
CC
0.15
0.1
V
= 2.7, T = 25°C
CC
0.05
0
V
= 2.7, T = 25°C
CC
-0.05
-0.1
-0.15
-0.2
V
= 2.7, T = 85°C
CC
-0.1
-0.2
-0.3
V
= 5.5, T = 25°C
CC
V
= 5.5, T = 25°C
CC
V
= 5.5, T = 85°C
V
= 2.7, T = 85°C
CC
CC
0
50
100
150
200
250
0
50
100
150
200
250
TAP POSITION (DECIMAL)
TAP POSITION (DECIMAL)
FIGURE 4. INL vs TAP POSITION IN VOLTAGE DIVIDER
FIGURE 3. DNL vs TAP POSITION IN VOLTAGE DIVIDER
MODE FOR 10kΩ (W)
MODE FOR 10kΩ (W)
0
-0.1
-0.2
0.4
0.35
V
= 5.5V
= 2.7V
CC
-0.3
-0.4
-0.5
-0.6
-0.7
-0.8
0.3
V
CC
2.7V
0.25
0.2
5.5V
-0.9
-1
0.15
0
-40
-20
20
40
60
80
-40
-20
0
20
40
60
80
TEMPERATURE (°C)
TEMPERATURE (°C)
FIGURE 6. FSerror vs TEMPERATURE
FIGURE 5. ZSerror vs TEMPERATURE
0.3
0.5
0.4
0.3
0.2
0.1
0
V
= 2.7, T = 25°C
CC
V
= 2.7, T = 25°C
CC
0.2
0.1
0
V
= 5.5, T = 25°C
CC
V
= 5.5, T = -40°C
CC
V
= 5.5, T = 85°C
CC
-0.1
-0.2
-0.3
-0.4
-0.5
-0.1
-0.2
-0.3
V
= 5.5, T = 85°C
CC
V
= 2.7, T = 85°C
CC
V
= 2.7, T = -40°C
CC
V
= 2.7, T = 85°C
CC
V
= 5.5, T = -40°C
CC
V
= 5.5, T = 25°C
V
= 2.7, T = -40°C
CC
CC
32
82
132
182
232
32
82
132
182
232
TAP POSITION (DECIMAL)
TAP POSITION (DECIMAL)
FIGURE 8. INL vs TAP POSITION IN Rheostat MODE FOR
FIGURE 7. DNL vs TAP POSITION IN Rheostat MODE FOR
50kΩ (U)
50kΩ (U)
FN8212.2
July 18, 2006
7
X95820
Typical Performance Curves (Continued)
1.50
1.00
20
10
0
0.50
2.7V
5.5V
0.00
-0.50
-1.00
-1.50
-10
-20
32
82
132
182
232
-40
-20
0
20
40
60
80
TEMPERATURE (°C)
TAP POSITION (DECIMAL)
FIGURE 10. TC FOR VOLTAGE DIVIDER MODE IN ppm
FIGURE 9. END TO END R
% CHANGE vs
TOTAL
TEMPERATURE
35
25
15
5
INPUT
OUTPUT
-5
Tap Position = Mid Point
-15
-25
R
= 9.4K
TOTAL
32
57
82
107
132
157
182
207
232
TAP POSITION (DECIMAL)
FIGURE 12. FREQUENCY RESPONSE (2.2MHz)
FIGURE 11. TC FOR Rheostat MODE IN ppm
SCL
Signal at Wiper (Wiper Unloaded)
Signal at Wiper
(Wiper Unloaded Movement
From ffh to 00h)
Wiper Movement Mid Point
From 80h to 7fh
FIGURE 13. MIDSCALE GLITCH, CODE 80h TO 7Fh (WIPER 0)
FIGURE 14. LARGE SIGNAL SETTLING TIME
FN8212.2
July 18, 2006
8
X95820
When the byte at address 8 is all zeroes, which is the default
at power up:
Principles of Operation
The X95820 in as integrated circuit incorporating two DCPs
with their associated registers, non-volatile memory, and a
• A read operation to addresses 0 or 1 outputs the value of
the non-volatile IVRs.
2
I C serial interface providing direct communication between
a host and the potentiometers and memory.
• A write operation to addresses 0 or 1 writes the same
value to the WR and IVR of the corresponding DCP.
DCP Description
When the byte at address 8 is 80h (128 decimal):
Each DCP is implemented with a combination of resistor
elements and CMOS switches. The physical ends of each
DCP are equivalent to the fixed terminals of a mechanical
potentiometer (RH and RL pins). The RW pin of each DCP is
connected to intermediate nodes, and is equivalent to the
wiper terminal of a mechanical potentiometer. The position
of the wiper terminal within the DCP is controlled by an 8-bit
volatile Wiper Register (WR). Each DCP has its own WR.
When the WR of a DCP contains all zeroes (WR<7:0>: 00h),
its wiper terminal (RW) is closest to its “Low” terminal (RL).
When the WR of a DCP contains all ones (WR<7:0>: FFh),
its wiper terminal (RW) is closest to its “High” terminal (RH).
As the value of the WR increases from all zeroes (00h) to all
ones (255 decimal), the wiper moves monotonically from the
position closest to RL to the closest to RH. At the same time,
the resistance between RW and RL increases monotonically,
while the resistance between RH and RW decreases
monotonically.
• A read operation to addresses 0 or 1 outputs the value of
the volatile WR.
• A write operation to addresses 0 or 1only writes to the
corresponding volatile WR.
It is not possible to write to an IVR without writing the same
value to its corresponding WR.
00h and 80h are the only values that should be written to
address 8. All other values are reserved and must not be
written to address 8.
To access the general purpose bytes at addresses 2, 3, 4, 5,
or 6, the value at address 8 must be all zeros.
The X95820 is pre-programmed with 80h in the two IVRs.
TABLE 1. MEMORY MAP
ADDRESS
NON-VOLATILE
VOLATILE
8
7
-
Access Control
While the X95820 is being powered up, all two WRs are
reset to 80h (128 decimal), which locates RW roughly at the
center between RL and RH. Soon after the power supply
voltage becomes large enough for reliable non-volatile
memory reading, the X95820 reads the value stored on two
different non-volatile Initial Value Registers (IVRs) and loads
them into their corresponding WRs.
Reserved
6
5
4
3
2
General Purpose
Not Available
1
0
IVR1
IVR0
WR1
WR0
The WRs and IVRs can be read or written directly using the
2
I C serial interface as described in the following sections.
WR: Wiper Register, IVR: Initial value Register.
Memory Description
2
I C Serial Interface
The X95820 contains eight non-volatile bytes. they are
2
2
accessed by I C interface operations with Address Bytes 0
The X95820 supports a bidirectional I C bus oriented
through 7 decimal. The first two non-volatile bytes at
addresses 0 and 1 contain the initial value loaded at power-
up into the volatile Wiper Registers (WRs) of DCP0 and
DCP1 respectively. Bytes at addresses 2, 3, 4, 5, and 6 are
available to the user as general purpose registers. The byte
at address 7 is reserved; the user should not write to it, and
its value should be ignored if read.
protocol. The protocol defines any device that sends data
onto the bus as a transmitter and the receiving device as the
receiver. The device controlling the transfer is a master and
the device being controlled is the slave. The master always
initiates data transfers and provides the clock for both
transmit and receive operations. Therefore, the X95820
operates as a slave device in all applications.
2
The volatile WR, and the non-volatile Initial Value Register
(IVR) of a DCP are accessed with the same Address Byte.
All communication over the I C interface is conducted by
sending the MSB of each byte of data first.
A volatile byte at address 8 decimal, controls what byte is
read or written when accessing DCP registers: the WR, the
IVR, or both.
Protocol Conventions
Data states on the SDA line can change only during SCL
LOW periods. SDA state changes during SCL HIGH are
reserved for indicating START and STOP conditions (See
Figure 15). On power up of the X95820 the SDA pin is in the
input mode.
FN8212.2
July 18, 2006
9
X95820
2
All I C interface operations must begin with a START
receiver pulls the SDA line LOW to acknowledge the
condition, which is a HIGH to LOW transition of SDA while
SCL is HIGH. The X95820 continuously monitors the SDA
and SCL lines for the START condition and does not
respond to any command until this condition is met (See
Figure 15). A START condition is ignored during the power
up sequence and during internal non-volatile write cycles.
reception of the eight bits of data (See Figure 16).
The X95820 responds with an ACK after recognition of a
START condition followed by a valid Identification Byte, and
once again after successful receipt of an Address Byte. The
X95820 also responds with an ACK after receiving a Data
Byte of a write operation. The master must respond with an
ACK after receiving a Data Byte of a read operation
2
All I C interface operations must be terminated by a STOP
condition, which is a LOW to HIGH transition of SDA while
SCL is HIGH (See Figure 15). A STOP condition at the end
of a read operation, or at the end of a write operation to
volatile bytes only places the device in its standby mode. A
STOP condition during a write operation to a non-volatile
byte, initiates an internal non-volatile write cycle. The device
enters its standby state when the internal non-volatile write
cycle is completed.
A valid Identification Byte contains 1010 as the four MSBs,
and the following three bits matching the logic values
present at pins A2, A1, and A0. The LSB in the Read/Write
bit. Its value is “1” for a Read operation, and “0” for a Write
operation (See Table 2).
TABLE 2. IDENTIFICATION BYTE FORMAT
Logic values at pins A2, A1, and A0 respectively
An ACK, Acknowledge, is a software convention used to
indicate a successful data transfer. The transmitting device,
either master or slave, releases the SDA bus after
1
0
1
0
A2
A1
A0
R/W
(MSB)
(LSB)
transmitting eight bits. During the ninth clock cycle, the
SCL
SDA
START
DATA
DATA
DATA
STOP
STABLE CHANGE STABLE
FIGURE 15. VALID DATA CHANGES, START, AND STOP CONDITIONS
SCL from Master
1
8
9
SDA Output from
Transmitter
High Impedance
High Impedance
SDA Output from
Receiver
START
ACK
FIGURE 16. ACKNOWLEDGE RESPONSE FROM RECEIVER
Write
S
Signals from the
Master
t
a
r
S
t
o
p
Data
Byte
Address
Byte
Identification
Byte
t
Signal at SDA
1 0 1 0
A2A1A00
0 0 0 0
Signals from the
X95820
A
C
K
A
C
K
A
C
K
FIGURE 17. BYTE WRITE SEQUENCE
FN8212.2
July 18, 2006
10
X95820
pulse that loads the last bit (LSB) of the Data Byte. If the
Write Operation
Address Byte is between 0 and 6 (inclusive), and the Access
Control Register is all zeros (default), then the STOP
condition initiates the internal write cycle to non-volatile
memory.
A Write operation requires a START condition, followed by a
valid Identification Byte, a valid Address Byte, a Data Byte,
and a STOP condition. After each of the three bytes, the
X95820 responds with an ACK. At this time, if the Data Byte
is to be written only to volatile registers, then the device
enters its standby state. If the Data Byte is to be written also
to non-volatile memory, the X95820 begins its internal write
cycle to non-volatile memory. During the internal non-volatile
write cycle, the device ignores transitions at the SDA and
SCL pins, and the SDA output is at a high impedance state.
When the internal non-volatile write cycle is completed, the
X95820 enters its standby state (See Figure 17).
Read Operation
A Read operation consists of a three byte instruction
followed by one or more Data Bytes (See Figure 18). The
master initiates the operation issuing the following
sequence: a START, the Identification byte with the R/W bit
set to “0”, an Address Byte, a second START, and a second
Identification byte with the R/W bit set to “1”. After each of
the three bytes, the X95820 responds with an ACK. Then the
X95820 transmits Data Bytes as long as the master
responds with an ACK during the SCL cycle following the
eight bit of each byte. The master terminates the read
operation (issuing a STOP condition) following the last bit of
the last Data Byte (See Figure 18).
The byte at address 00001000 bin (8 decimal) determines if
the Data Byte is to be written to volatile and/or non-volatile
memory. See “Memory Description” on page 9.
Data Protection
The WP pin has to be at logic HIGH to perform any Write
operation to the device. When the WP is active (LOW) the
device ignores Data Bytes of a Write Operation, does not
respond to the Data Bytes with an ACK, and instead, goes to
its standby state waiting for a new START condition.
The Data Bytes are from the memory location indicated by
an internal pointer. This pointer initial value is determined by
the Address Byte in the Read operation instruction, and
increments by one during transmission of each Data Byte.
After reaching the memory location 01Fh (8 decimal) the
pointer “rolls over” to 00h, and the device continues to output
data for each ACK received.
A STOP condition also acts as a protection of non-volatile
memory. A valid Identification Byte, Address Byte, and total
number of SCL pulses act as a protection of both volatile
and non-volatile registers. During a Write sequence, the
Data Byte is loaded into an internal shift register as it is
received. If the Address Byte is 0, 1, or 8 decimal, the Data
Byte is transferred to the appropriate Wiper Register (WR) or
to the Access Control Register, at the falling edge of the SCL
The byte at address 00001000 bin (8 decimal) determines if
the Data Bytes being read are from volatile or non-volatile
memory. See “Memory Description” on page 9.
S
t
a
r
S
t
a
r
Identification
Byte
Identification
Signals
from the
Master
S
t
o
p
Byte
with
R/W=1
with
R/W=0
A
C
K
A
C
K
Address
Byte
t
t
Signal at SDA
1 0 1 0
1 0 1 0
1
0
A
C
K
A
C
K
A
C
K
Signals from the
Slave
Last Read Data
Byte
First Read Data
Byte
FIGURE 18. READ SEQUENCE
FN8212.2
July 18, 2006
11
X95820
Thin Shrink Small Outline Plastic Packages (TSSOP)
M14.173
N
14 LEAD THIN SHRINK SMALL OUTLINE PLASTIC
PACKAGE
INDEX
AREA
0.25(0.010)
M
B M
E
E1
-B-
INCHES
MIN
MILLIMETERS
GAUGE
PLANE
SYMBOL
MAX
0.047
0.006
0.041
0.0118
0.0079
0.199
0.177
MIN
-
MAX
1.20
0.15
1.05
0.30
0.20
5.05
4.50
NOTES
A
A1
A2
b
-
-
1
2
3
0.002
0.031
0.0075
0.0035
0.195
0.169
0.05
0.80
0.19
0.09
4.95
4.30
-
L
0.25
0.010
-
0.05(0.002)
SEATING PLANE
A
9
-A-
D
c
-
D
3
-C-
α
E1
e
4
A2
e
A1
0.026 BSC
0.65 BSC
-
c
b
0.10(0.004)
E
0.246
0.256
6.25
0.45
6.50
0.75
-
0.10(0.004) M
C
A M B S
L
0.0177
0.0295
6
N
14
14
7
NOTES:
o
o
o
o
0
8
0
8
-
α
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AC, Issue E.
Rev. 2 4/06
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen-
sion at maximum material condition. Minimum space between protru-
sion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact. (Angles in degrees)
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN8212.2
July 18, 2006
12
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