IS31AP2010B-UTLS2-TR [ISSI]

Audio Amplifier, 3W, 1 Channel(s), 1 Func, PBGA9, UTQFN-9;
IS31AP2010B-UTLS2-TR
型号: IS31AP2010B-UTLS2-TR
厂家: INTEGRATED SILICON SOLUTION, INC    INTEGRATED SILICON SOLUTION, INC
描述:

Audio Amplifier, 3W, 1 Channel(s), 1 Func, PBGA9, UTQFN-9

放大器 商用集成电路
文件: 总13页 (文件大小:367K)
中文:  中文翻译
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IS31AP2010B  
3W@5.0V MONO FILTER-LESS CLASS-D AUDIO POWER AMPLIFIER  
April 2013  
GENERAL DESCRIPTION  
FEATURES  
The IS31AP2010B is a high efficiency, 3W@5.0V  
mono filter-less Class-D audio power amplifier. A low  
noise, filter-less PWM architecture eliminates the  
output filter, reduces external component count,  
system cost, and simplifying design.  
5.0V supply at THD+N = 10%  
3W into 4(Typ.)  
1.68W into 8(Typ.)  
Efficiency at 5.0V  
85% at 400mW with a 4speaker  
88% at 400mW with an 8speaker  
Less than 1μA shutdown current  
Optimized PWM output stage eliminates LC output  
filter  
Fully differential design reduces RF rectification  
and eliminates bypass capacitor  
Improved CMRR eliminates two input coupling  
capacitors  
Operating in a single 5.0V supply, IS31AP2010B is  
capable of driving 4speaker load at a continuous  
average output of 3W@10% THD+N. The  
IS31AP2010B has high efficiency with speaker load  
compared to a typical class- AB amplifier.  
In cellular handsets, the earpiece, speaker phone, and  
melody ringer speaker can each be driven by the  
IS31AP2010B. The gain of IS31AP2010B is externally  
configurable which allows independent gain control  
from multiple sources by summing signals from each  
function.  
Integrated click-and-pop suppression circuitry  
UTQFN-9 package  
RoHS compliant and 100% lead(Pb)-free  
IS31AP2010B is available in UTQFN-9 packages. It  
operates from 2.7V to 5.5V over the temperature range  
of -40°C to +85°C.  
APPLICATIONS  
Wireless or cellular handsets and PDAs  
Portable DVD player  
Notebook PC  
Portable radio  
Educational toys  
Portable gaming  
TYPICAL APPLICATION CIRCUIT  
VBattery  
B1,B2  
VCC  
CS  
0.1 F  
1 F  
C3  
OUT+  
A3  
C
IN-  
R
IN-  
OUT-  
0.1 F 150k  
C1  
A1  
IN-  
Differential  
Input  
IS31AP2010B  
IN+  
C
IN+  
R
IN+  
0.1 F 150k  
C2  
A2,B3  
Shutdown  
Control  
SDB  
GND  
100k  
Figure 1 Typical Application Circuit  
1
Integrated Silicon Solution, Inc. – www.issi.com  
Rev.B, 04/10/2013  
IS31AP2010B  
PIN CONFIGURATION  
Package  
Pin Configuration (Top View)  
UTQFN-9  
PIN DESCRIPTION  
No.  
Pin  
Description  
A1  
IN+  
Positive audio input.  
Connect to ground.  
Negative audio output.  
Power supply.  
A2, B3  
A3  
GND  
OUT-  
VCC  
IN-  
B1, B2  
C1  
Negative audio input.  
C2  
SDB  
OUT+  
Enter in shutdown mode when active low.  
Positive audio output.  
C3  
Copyright © 2013 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any  
time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are  
advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.  
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the  
product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not  
authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:  
a.) the risk of injury or damage has been minimized;  
b.) the user assume all such risks; and  
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances  
2
Integrated Silicon Solution, Inc. – www.issi.com  
Rev.B, 04/10/2013  
IS31AP2010B  
ORDERING INFORMATION  
Industrial Range: -40°C to +85°C  
Order Part No.  
Package  
QTY/Reel  
IS31AP2010B-UTLS2-TR  
UTQFN-9, Lead-free  
3000  
3
Integrated Silicon Solution, Inc. – www.issi.com  
Rev.B, 04/10/2013  
IS31AP2010B  
ABSOLUTE MAXIMUM RATINGS  
Supply voltage, VCC  
Voltage at any input pin  
Junction temperature, TJMAX  
Storage temperature range, TSTG  
Operating temperature range, TA  
-0.3V ~ +6.0V  
-0.3V ~ VCC+0.3V  
150°C  
-65°C ~ +150°C  
40°C ~ +85°C  
Note:  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only  
and functional operation of the device at these or any other condition beyond those indicated in the operational sections of the specifications is  
not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.  
ELECTRICAL CHARACTERISTICS  
V
CC = 2.7V ~ 5.5V, TA = 25°C, unless otherwise noted. (Note 1)  
Symbol  
Parameter  
Supply voltage  
Condition  
Min.  
Typ.  
Max.  
Unit  
VCC  
2.7  
5.5  
V
Output offset voltage  
(measured differentially)  
|VOS  
|
V
V
SDB = 0V, AV = 2V/V  
CC = 5.5V, no load  
10  
mV  
mA  
2.6  
1.2  
ICC  
Quiescent current  
VCC = 2.7V, no load  
VSDB = 0.4V  
ISDB  
fSW  
RIN  
Shutdown current  
Switching frequency  
Input resistor  
1
μA  
kHz  
kΩ  
V/V  
V
250  
2
Gain 20V/V  
RIN = 150kΩ  
15  
Gain  
VIH  
High-level input voltage  
Low-level input voltage  
1.4  
VIL  
0.4  
V
4
Integrated Silicon Solution, Inc. – www.issi.com  
Rev.B, 04/10/2013  
IS31AP2010B  
ELECTRICAL CHARACTERISTICS  
TA = 25°C, Gain = 2V/V, CIN = 2μF, unless otherwise noted. (Note 2)  
Symbol  
Parameter  
Condition  
Min.  
Typ.  
Max.  
Unit  
V
CC = 5.0V  
1.68  
1.2  
THD+N = 10%  
f = 1kHz, RL = 8Ω  
VCC = 4.2V  
VCC = 3.6V  
VCC = 5.0V  
VCC = 4.2V  
VCC = 3.6V  
W
0.88  
3.0  
THD+N = 10%  
f = 1kHz, RL = 4Ω  
2.0  
W
W
W
1.5  
PO  
Output power  
V
CC = 5.0V  
1.4  
THD+N = 1%  
f = 1kHz, RL = 8Ω  
VCC = 4.2V  
VCC = 3.6V  
1.0  
0.7  
V
CC = 5.0V  
2.4  
THD+N = 1%  
f = 1kHz, RL = 4Ω  
VCC = 4.2V  
VCC = 3.6V  
1.68  
1.2  
V
CC = 4.2V, PO = 0.6W, RL = 8, f = 1kHz  
0.18  
0.22  
Total harmonic  
distortion plus noise  
THD+N  
%
VCC = 4.2V, PO = 1.1W, RL = 4, f = 1kHz  
VCC = 4.2V, f = 20Hz ~ 20kHz  
Inputs AC-grounded  
VNO Output voltage noise  
80  
32  
μVrms  
Wake-up time from  
shutdown  
TWU  
VCC = 3.6V  
ms  
dB  
SNR Signal-to-noise ratio PO = 1.0W, RL = 8, VCC = 4.2V  
CC = 5.0V  
91  
V
-75  
-70  
-66  
Power supply rejection f = 217HzRL = 8Ω  
PSRR  
VCC = 4.2V  
VCC = 3.6V  
dB  
ratio  
Input grounded  
Note 1: All parts are production tested at TA = 25°C. Other temperature limits are guaranteed by design.  
Note 2: Guaranteed by design.  
5
Integrated Silicon Solution, Inc. – www.issi.com  
Rev.B, 04/10/2013  
IS31AP2010B  
TYPICAL PERFORMANCE CHARACTERISTIC  
20  
20  
10  
5
R = 8  
f = 1kHz  
L
R
L
= 4  
10  
5
f = 1kHz  
V
CC = 5.0V  
V
CC = 5.0V  
2
1
2
V
CC = 4.2V  
V
CC = 4.2V  
1
V
CC = 3.6V  
0.5  
0.5  
V
CC = 3.6V  
0.2  
0.1  
0.2  
0.1  
10m 20m  
50m  
100m  
1
10m 20m  
100m  
1
2
3
4
500m  
2
3
50m  
500m  
Output Power(W)  
Output Power(W)  
Figure 2 THD+N vs. Output Power  
Figure 3 THD+N vs. Output Power  
10  
10  
RL = 8  
RL = 4Ω  
5
2
1
5
2
1
V
CC = 4.2V  
0.5  
0.5  
Po = 1.1W  
0.2  
0.1  
0.2  
0.1  
V
CC = 3.6V  
V
CC = 5.0V  
V
CC = 5.0V  
Po = 0.45W  
V
CC = 3.6V  
Po = 1.5W  
Po = 0.9W  
Po = 0.8W  
0.05  
0.05  
V
CC = 4.2V  
Po = 0.6W  
0.02  
0.01  
0.02  
0.01  
2k  
5k  
20k  
200  
2k  
5k  
20k  
20  
50  
100 200  
500  
1k  
20  
50  
100  
500  
1k  
Frequency(Hz)  
Frequency(Hz)  
Figure 4 THD+N vs. Frequency  
Figure 5 THD+N vs. Frequency  
+0  
+0  
R
L
= 8  
R
L
= 4Ω  
Input Grouded  
Input Grouded  
-20  
-20  
V
V
CC = 5.0V  
-40  
-60  
V
CC = 3.6V  
-40  
-60  
V
CC = 5.0V  
V
CC = 3.6V  
-80  
CC = 4.2V  
-80  
V
CC = 4.2V  
-100  
-100  
-120  
2k  
5k  
20k  
20k  
20  
50  
100 200  
500  
1k  
200  
2k  
5k  
20  
50  
100  
500  
1k  
Frequency(Hz)  
Frequency(Hz)  
Figure 6 PSRR vs. Frequency  
Figure 7 PSRR vs. Frequency  
6
Integrated Silicon Solution, Inc. – www.issi.com  
Rev.B, 04/10/2013  
IS31AP2010B  
200  
100  
80  
VCC = 3.6V~5.0V  
RL  
= 4, 8Ω  
100  
70  
RL=8  
RL=4Ω  
60  
50  
40  
20  
0
30  
20  
V
CC = 5.0V  
10  
20  
2k  
5k  
20k  
50  
100 200  
500  
1k  
0
0.3  
0.6  
0.9  
1.2  
1.5  
Output Power(W)  
Frequency(Hz)  
Figure 9 Efficiency  
Figure 8 Noise  
7
Integrated Silicon Solution, Inc. – www.issi.com  
Rev.B, 04/10/2013  
IS31AP2010B  
FUNCTIONAL BLOCK DIAGRAM  
8
Integrated Silicon Solution, Inc. – www.issi.com  
Rev.B, 04/10/2013  
IS31AP2010B  
APPLICATION INFORMATION  
FULLY DIFFERENTIAL AMPLIFIER  
The IS31AP2010B is a fully differential amplifier with  
differential inputs and outputs. The fully differential  
amplifier consists of a differential amplifier and a  
common mode amplifier. The differential amplifier  
ensures that the amplifier outputs a differential voltage  
on the output that is equal to the differential input times  
the gain. The common-mode feedback ensures that  
the common-mode voltage at the output is biased  
around VCC/2 regardless of the common-mode  
voltage at the input. The fully differential IS31AP2010B  
can still be used with a single-ended input; however,  
the IS31AP2010B should be used with differential  
inputs when in a noisy environment, like a wireless  
handset, to ensure maximum noise rejection.  
Figure 11 Single-Ended Input  
INPUT RESISTORS (RIN)  
The input resistors (RIN) set the gain of the amplifier  
according to Equation (1).  
ADVANTAGES OF FULLY DIFFERENTIAL  
AMPLIFIERS  
2 RF  
V
V
The fully differential amplifier does not require a  
bypass capacitor. This is because any shift in the  
mid-supply affects both positive and negative channels  
equally and cancels at the differential output.  
Gain   
(1)  
RIN  
Resistor matching is very important in fully differential  
amplifiers. The balance of the output on the reference  
voltage depends on matched ratios of the resistors.  
CMRR, PSRR, and cancellation of the second  
harmonic distortion diminish if resistor mismatch  
occurs. Therefore, it is recommended to use 1%  
tolerance resistors or better to keep the performance  
optimized. Matching is more important than overall  
tolerance. Resistor arrays with 1% matching can be  
used with a tolerance greater than 1%.  
GSM handsets save power by turning on and shutting  
off the RF transmitter at a rate of 217Hz. The  
transmitted signal is picked-up on input and output  
traces. The fully differential amplifier cancels the signal  
much better than the typical audio amplifier.  
COMPONENT SELECTION  
Figure 10 shows the IS31AP2010B with differential  
inputs and input capacitors, and Figure 11 shows the  
IS31AP2010B with single-ended inputs. Differential  
inputs should be used whenever possible because the  
single-ended inputs are much more susceptible to  
noise.  
Place the input resistors very close to the  
IS31AP2010B to limit noise injection on the  
high-impedance nodes.  
For optimal performance the gain should be set to  
2V/V or lower. Lower gain allows the IS31AP2010B to  
operate at its best, and keeps a high voltage at the  
input making the inputs less susceptible to noise.  
VBattery  
B1,B2  
VCC  
CS  
0.1  
F
C3  
A3  
1
F
OUT+  
OUT-  
DECOUPLING CAPACITOR (CS)  
C
IN-  
RIN-  
150k  
0.1  
F
C1  
The IS31AP2010B is a high performance Class-D  
audio amplifier that requires adequate power supply  
decoupling to ensure the efficiency is high and total  
harmonic distortion (THD) is low. For higher frequency  
transients, spikes, or digital hash on the line, a good  
low equivalent-series-resistance (ESR) ceramic  
capacitor, typically 1μF, placed as close as possible to  
the device VCC lead works best. Placing this  
decoupling capacitor close to the IS31AP2010B is very  
important for the efficiency of the Class-D amplifier,  
because any resistance or inductance in the trace  
between the device and the capacitor can cause a loss  
in efficiency. For filtering lower frequency noise signals,  
a 10μF or greater capacitor placed near the audio  
power amplifier would also help, but it is not required in  
most applications because of the high PSRR of this  
device.  
IN-  
Differential  
Input  
A1  
IS31AP2010B  
IN+  
C
IN+  
RIN+  
0.1  
F
150k  
C2  
A2,B3  
Shutdown  
Control  
SDB  
GND  
100k  
Figure 10 Differential Input  
9
Integrated Silicon Solution, Inc. – www.issi.com  
Rev.B, 04/10/2013  
IS31AP2010B  
INPUT CAPACITORS (CIN)  
If summing left and right inputs with a gain of 1V/V, use  
RIN1 = RIN2 = 300k.  
The input capacitors and input resistors form a high  
pass filter with the corner frequency, fC, determined in  
Equation (2).  
If summing a ring tone and a phone signal, set the  
ring-tone gain to Gain1 = 2V/V, and the phone gain to  
Gain2 = 0.1V/V. The resistor values would be  
1
(2)  
f
RIN1 = 150k, RIN2 = 3M.  
c
2RIN CIN  
The value of the input capacitor is important to  
consider as it directly affects the bass (low frequency)  
performance of the circuit. Speakers in wireless  
phones cannot usually respond well to low frequencies,  
so the corner frequency can be set to block low  
frequencies in this application.  
Equation (3) is reconfigured to solve for the input  
coupling capacitance.  
1
CIN  
(3)  
Figure 12 Summing Two Differential Inputs  
2RIN fC  
If the corner frequency is within the audio band, the  
capacitors should have a tolerance of ±10% or better,  
because any mismatch in capacitance causes an  
impedance mismatch at the corner frequency and  
below.  
SUMMING A DIFFERENTIAL INPUT SIGNAL AND A  
SINGLE-ENDED INPUT SIGNAL  
Figure 13 shows how to sum a differential input signal  
and a single-ended input signal. Ground noise may  
couple in through IN- with this method. It is better to  
use differential inputs. The gain for each input source  
can be set independently by Equations (4) and (5). The  
corner frequency of the single-ended input is set by  
For a flat low frequency response, use large input  
coupling capacitors (1μF). However, in a GSM phone  
the ground signal is fluctuating at 217Hz, but the signal  
from the codec does not have the same 217Hz  
fluctuation. The difference between the two signals is  
amplified, sent to the speaker, and heard as a 217Hz  
hum.  
CIN2, shown in Equation (6).  
1
CIN 2  
(6)  
2RIN 2 fC  
SUMMING INPUT SIGNALS  
To assure that each input is balanced, the  
Most wireless phones or PDAs need to sum signals at  
the audio power amplifier or just have two signal  
sources that need separate gain. The IS31AP2010B  
makes it easy to sum signals or use separate signal  
sources with different gains. Many phones now use the  
same speaker for the earpiece and ringer, where the  
wireless phone would require a much lower gain for  
the phone earpiece than for the ringer. PDAs and  
phones that have stereo headphones require summing  
of the right and left channels to output the stereo signal  
to the mono speaker.  
single-ended input must be driven by a low-impedance  
source even if the input is not in use. If summing a ring  
tone and a phone signal, the phone signal should use  
a differential input signal while the ring tone might be  
limited to a single-ended signal. Ring-tone gain is set  
to Gain1 = 2V/V, and phone gain is set to Gain2 =  
0.1V/V, the resistor values would be RIN1 = 150k, RIN2  
= 3M.  
The high pass corner frequency of the single-ended  
input is set by CIN2. If the desired corner frequency is  
less than 20Hz.  
SUMMING TWO DIFFERENTIAL INPUT SIGNALS  
Two extra resistors are needed for summing  
differential signals (a total of 5 components). The gain  
for each input source can be set independently (see  
Equations (4) and (5) and Figure 12).  
1
So, CIN 2  
and  
2150k  20Hz  
CIN 2 53 pF  
VO  
2 150k  
V
V
Gain1   
Gain2   
(4)  
(5)  
RIN1  
VI1  
VO  
2 150k  
V
V
RIN 2  
VI 2  
10  
Integrated Silicon Solution, Inc. – www.issi.com  
Rev.B, 04/10/2013  
IS31AP2010B  
Figure 14 Summing Two Single-Ended Inputs  
EMI EVALUATION RESULT  
Figure 13 Summing Differential Input and Single-Ended Input  
dBuV/m  
80  
70  
60  
50  
40  
30  
20  
10  
0
Signals  
SUMMING TWO SINGLE-ENDED INPUT SIGNALS  
The gain and corner frequencies (fC1 and fC2) for each  
input source can be set independently by Equations (4)  
and (5). Resistor, RP, and capacitor, CP, are needed on  
the IN+ terminal to match the impedance on the IN-  
terminal. The single-ended inputs must be driven by  
low impedance sources even if one of the inputs is not  
outputting an ac signal.  
RE_B  
1
(7)  
(8)  
CIN1  
2RIN1 fC  
1
CIN 2  
MHz  
1000  
30  
100  
2RIN 2 fC  
Figure 15 EMI Evaluation Result  
Cp CIN1 CIN 2  
(9)  
(10)  
RIN1 RIN 2  
RP   
RIN1 RIN 2  
11  
Integrated Silicon Solution, Inc. – www.issi.com  
Rev.B, 04/10/2013  
IS31AP2010B  
CLASSIFICATION REFLOW PROFILES  
Profile Feature  
Pb-Free Assembly  
Preheat & Soak  
150°C  
200°C  
60-120 seconds  
Temperature min (Tsmin)  
Temperature max (Tsmax)  
Time (Tsmin to Tsmax) (ts)  
Average ramp-up rate (Tsmax to Tp)  
3°C/second max.  
Liquidous temperature (TL)  
Time at liquidous (tL)  
217°C  
60-150 seconds  
Peak package body temperature (Tp)*  
Max 260°C  
Time (tp)** within 5°C of the specified  
classification temperature (Tc)  
Max 30 seconds  
Average ramp-down rate (Tp to Tsmax)  
Time 25°C to peak temperature  
6°C/second max.  
8 minutes max.  
Figure 16 Classification Profile  
12  
Integrated Silicon Solution, Inc. – www.issi.com  
Rev.B, 04/10/2013  
IS31AP2010B  
PACKAGING INFORMATION  
UTQFN-9  
Note: All dimensions in millimeters unless otherwise stated.  
13  
Integrated Silicon Solution, Inc. – www.issi.com  
Rev.B, 04/10/2013  

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